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Electronics and Electrical Engineering News, Projects & Technical Articles.
Updated: 4 hours 8 min ago

Renesas Curtails IoT Standby Power With New 64-bit Microprocessors

Thu, 01/18/2024 - 02:00
Powered by Arm Cortex CPUs, the new MPUs hit key IoT pain points: standby power, peripherals, and security features.

Basic Principles of the Push-Pull Class B Power Amplifier

Wed, 01/17/2024 - 20:00
Learn how a push-pull Class B amplifier functions, how to calculate its efficiency, and how its performance compares to the inductively-loaded Class A design.

Firms Forge Alliance to Bring Piezoelectric MEMS to the Middle Market

Wed, 01/17/2024 - 13:08
Launched today, this new alliance promises to make high quality thin-film piezoelectric (PZT) technology more accessible to piezoelectric MEMS developers.

Onsemi Designs DC SiC Power Modules to Fast Track EV Charging

Wed, 01/17/2024 - 02:00
One critical barrier to EV adoption is their notoriously long charge times. Onsemi aims to address one piece of the puzzle with new power-integrated modules.

Bosch Claims Smallest MEMS Accelerometers for Hearables and Wearables

Tue, 01/16/2024 - 20:00
The new MEMS devices have a 76% smaller footprint than Bosch’s current generation of acceleration sensors.

Three Energy-Harvesting Solutions Show Off IoT Power Possibilities

Tue, 01/16/2024 - 02:00
Several companies took the spotlight at CES 2024 to demo the newest wave of energy-harvesting technology.

Desktop, Mobile, and Edge: Intel Expands Its Computing Portfolio

Mon, 01/15/2024 - 20:00
From mobile gaming to desktop productivity, Intel is broadly expanding its processor offerings for a range of computing applications.

Small-Signal MOSFET Models for Analog IC Design

Sun, 01/14/2024 - 20:00
The small-signal characteristics of MOSFETs play an important role in analog IC design. In this article, we learn how to model MOS transistors' small-signal behaviors.

MCUs, Modules, and Add-On Boards Lend Bluetooth Support

Sat, 01/13/2024 - 20:00
Three Bluetooth offerings from STMicroelectronics, Mikroe, Atmosic, and GlobalScale aim to simplify the development of connected devices.

Introduction to the Class B Power Amplifier

Sat, 01/13/2024 - 02:00
How does a Class B power amplifier work? What makes it more efficient than a Class A power amplifier? Learn the answers in this article.

Three Companies Collab on Near-Zero-Degree Cryogenic CMOS Circuits

Fri, 01/12/2024 - 20:00
In order to tackle quantum problems, Siemens, SemiWise, and SureCore are making CMOS circuits much cooler.

Nokia and Rohde & Schwarz Win FCC Certification for Drone Network

Fri, 01/12/2024 - 02:00
Following successful collaboration with Rohde & Schwarz to secure FCC certification, Nokia Drone Networks has launched in North America.

Andes Introduces RISC-V Out-of-Order Superscalar Multicore Processor

Thu, 01/11/2024 - 20:00
The new CPU features the company’s first out-of-order architecture for higher instruction throughput, better performance, and faster processing speeds.

BAE Systems and Microchip Take Large Slices of CHIPS Act Funds

Thu, 01/11/2024 - 02:00
The incentives of the CHIPS Act are rolling forth, with $35M going to BAE Systems and $162M going to Microchip.

Learn About Load-Pull Systems: Passive and Active Tuners

Wed, 01/10/2024 - 20:00
In this article, we explore the types of impedance tuners most commonly used for load-pull measurement—their advantages, their disadvantages, and the methods by which they synthesize impedance.

TI Simplifies ADAS and EV Designs With One-Chip Sensing and Power Solutions

Wed, 01/10/2024 - 16:00
This week, TI unveiled several single-chip automotive solutions at CES—one of which is the first automotive radar sensor for satellite architectures.

TI Simplifies ADAS Designs With One-Chip Sensing and Power Solutions

Wed, 01/10/2024 - 16:00
This week, TI unveiled several single-chip automotive solutions at CES—one of which is the first automotive radar sensor for satellite architectures.

Eyeing Replacing SODIMMs in Laptops, Micron Debuts Its LPCAMM2 Module

Wed, 01/10/2024 - 03:00
Today at CES in Las Vegas, Micron unveiled its 16 GB to 64 GB LPCAMM2, the first new mobile PC memory module form factor since the SODIMM in 1997.

Atmosic Rolls Out New Multiprotocol, Energy-Harvesting SoC

Tue, 01/09/2024 - 22:00
With a new SoC announced today at CES, the company's BLE portfolio now offers 802.15.4 support for Thread and Matter.

NXP Serves up a 77 GHz Radar SoC for Software Defined Vehicles

Tue, 01/09/2024 - 19:00
At CES today, NXP announced its next generation 77 GHz radar system on chip designed to create a 360-degree network of “software defined” radar sensors for vehicles.

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