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ICs hone sensorless BLDC motor design

EDN Network - Птн, 12/08/2023 - 23:19

Three motor driver ICs from Renesas enable full torque at zero speed from brushless DC (BLDC) motors without sensors. The parts enable the creation of sensorless BLDC motor systems with higher horsepower and speed at a given torque. According to the manufacturer, the ICs improve power consumption and reliability, while reducing board space by lowering the number of components needed.

The RAA306012 is a 65-V, 3-phase smart gate driver that pairs with a variety of MCUs from Renesas or from other sources. Two other devices, the RAJ306101 and RAJ306102, save board space by integrating the smart gate driver with a Renesas 32-bit or 16-bit MCU, respectively, in a single package.

The ability to enable full torque at zero speed without sensors is made possible by two Renesas patent-pending algorithms. Enhanced inductive sensing (EIS) offers stable position detection when the motor is completely stopped. When the motor is operating at extremely low speed, motor rotor position identification (MRI) is used. At higher speeds, the driver ICs use conventional methods.

All three devices are available now. The RAA306012 comes in a 7×7-mm, 48-pin QFN package. The RAJ306101 and RAJ306102 are housed in 8×8-mm QFNs with 56 pins and 64 pins, respectively. Evaluation kits for each device are also available.

RAA306012 product page

RAJ306101 product page

RAJ306102 product page 

Renesas Electronics

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Ethernet switch has on-chip neural network

EDN Network - Птн, 12/08/2023 - 23:19

Trident 5-X12, a software-programmable Ethernet switch from Broadcom, packs an on-chip neural-network inference engine—a first according to the company. NetGNT, which stands for networking general-purpose neural network traffic analyzer, improves network efficiency and performance.

NetGNT works in parallel to augment the standard packet-processing pipeline. The standard pipeline is one-packet/one-path. In other words, it looks at one packet as it takes a specific path through the chip’s ports and buffers. NetGNT, in contrast, is an ML inference engine and can be trained to look for different types of traffic patterns that span the entire chip. The enhanced telemetry capabilities of Trident 5 allow deeper real-time insights into bandwidth, which can then be used to train NetGNT.

The Trident 5-X12 provides 16 terabits/s of bandwidth, double that of its predecessor, the Trident 4-X9. Built using a 5-nm manufacturing process, the chip consumes 25% less power per 400G port than the Trident 4-X9. It also adds support for 800G ports, allowing direct connection to Broadcom’s Tomahawk 5, which is used as the spine/fabric in compute and AI/ML data centers.

The Trident 5-X12 BCM78800 Ethernet switch is now shipping to qualified customers.

Trident 5-X12 product page

Broadcom

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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5G OTA test system gains CTIA approval

EDN Network - Птн, 12/08/2023 - 23:19

R&S announced that its TS8991 over-the-air (OTA) test system now provides CTIA-compliant testing of 5G A-GNSS antenna performance. The company believes this establishes the TS8991 as the first 5G FR1 A-GNSS OTA test platform to be approved by CTIA Certification. In addition to 5G A-GNSS, the TS8991 meets CTIA requirements for 2G/3G A-GPS and 4G LTE A-GNSS.

The single-source turnkey platform comprises the CMX500 5G one-box signaling tester, the SMBV100B satellite simulator, and an anechoic wireless performance test chamber. All components are controlled by system software that enables fully automated OTA measurements in compliance with CTIA Certification test plans.

The CMX500 enables the TS8991 antenna test system to provide signaling to the device-under-test. Supporting the latest 3GPP specifications, the CMX500 measures receive sensitivity and transmit power. Along with the CMX500’s location-based services, the SMBV100B satellite simulator covers all 3GPP-based Assisted GNSS technologies.

Highly integrated and upgradeable, the TS8991 antenna performance test system comes in a variety of configurations and test chamber sizes.

TS8991 product page

Rohde & Schwarz 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Binary Clock with multi-colored LEDs and a bunch of features

Reddit:Electronics - Птн, 12/08/2023 - 21:57
Binary Clock with multi-colored LEDs and a bunch of features

I built this binay clock about a year ago. I't built into a picture frame, so you can put any 6x4" picture behind the clock.

I also wrote the code for this thing. It's based on a ESP8266 microcontroller and eleven WS2812B addressable RGB-LEDs. The clock shows hours and minutes, and every full hour it also shows week day and date for 15 seconds each.

It has a web interface where you can set a repeated alarm (with selectable weekdays) and a single alarm (turn itself of after it ran). Alarms can be set to showing the alarm time (mode 1) or as a cycle running around on all LEDs (mode 2), both in a free chooseable color and brightness. Both alarms and also the displaying of weekday, date, and any other numbers can be triggered externally by a simple HTTP GET request with the parameters it needs (for example: I trigger a alarm with my smart home when the washing machine fnished it's cycle). It has a day and night mode, so you can set different brightnesses. And it also have a dark mode for turning off all LEDs. Day, night and dark mode can be set on the web interface or triggered by a HTTP request.

Colors for time, weekday and date are set in the software. These's also the standby color which is for the uncounted LEDs, so it's still easy to read in the dark. On the pictures you can see the red standby color with the blue time color. I published the code on my web blog, so everyone who also want to build this thing can just do it :)

Schematics.pdf)

Software.zip)

submitted by /u/analogMensch
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Toshiba and ROHM collaborate on silicon and SiC power device and wafer manufacturing

Semiconductor today - Птн, 12/08/2023 - 18:19
A plan by Japan-based ROHM Co Ltd and Toshiba Electronic Devices & Storage Corp (TDSC) to collaborate on the manufacture and increased volume production of power devices has been recognized and will be supported by Japan’s Ministry of Economy, Trade and Industry (METI) as a measure supporting the Government’s target of secure and stable semiconductor supply. ROHM and Toshiba Electronic Devices & Storage will respectively make intensive investments in silicon carbide (SiC) and silicon (Si) power devices, effectively enhance their supply capabilities, and utilize each other’s production capacity...

Repair of seven segment digital readout display

Reddit:Electronics - Птн, 12/08/2023 - 17:30

If you ever get a display that has a segment dead or faint It can usually be fixed with a magnet! Take the strongest magnet you have and put it as close as possible to the display, move it around for a while, and voila! I don't know how or why it works, but it works! I've done this several times over many years and it has never failed. A stronger magnet like neodymium might work when lesser magnets won't, I don't know.

Just yesterday I had a multimeter with a dim segment. It was underneath the cover glass. I treated it with a neodymium & it took several tries waving it around from all sides, but it finally worked!

A ten cent solution to what can be a time consuming fix!

Another million $ tip is how to check any IC for good/bad. Every IC (chip) has an internal diode across the power inputs for spike suppression. 95% of the time this diode is either shorted or open if the IC is bad. You owe me big time if you have a stack of boards with many IC's that you thought could not be troubleshot because of the complexity!

submitted by /u/Hutch_co
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Toshiba expands range of 3300V SiC MOSFET modules

Semiconductor today - Птн, 12/08/2023 - 17:24
Japan-based Toshiba Electronic Devices & Storage Corp (TDSC) – which was spun off from Toshiba Corp in 2017 – has expanded its lineup of chopper SiC MOSFET modules by launching the MG800FXF1ZMS3 and MG800FZF1JMS3, which have ratings of 3300V and 800A using third-generation silicon carbide (SiC) MOSFET and Schottky barrier diode SBD chips for industrial equipment...

Automated IC layout tool integrated into foundry PDK

EDN Network - Птн, 12/08/2023 - 13:06

The Calibre DesignEnhancer software, which Siemens EDA unveiled at the Design Automation Conference (DAC) in July 2023, has been incorporated into a process design kit (PDK) of Samsung Foundry. The software provides multiple use models that perform automatic layout optimizations to improve power robustness and reduce design cycles during IC design implementation.

IC design engineers have traditionally relied on third-party place-and-route tools to incorporate design for manufacturing (DFM) optimizations. However, that often requires multiple time-consuming runs before converging on a “DRC-clean” solution.

Source: Siemens EDA

Calibre DesignEnhancer—which supports automated layout optimization during the IC design and implementation stages—helps IC designers deliver “DRC-clean” designs to tape out faster while improving design manufacturability and circuit reliability. Here, its via insertion use-model automatically inserts additional Calibre nmDRC-correct vias into layouts to reduce resistance that can minimize both voltage (IR) drop and electrostatic discharge (ESD) events in IC designs.

Siemens EDA claims that its layout tool enables design teams to significantly shorten turnaround time and reduce EM/IR issues while preparing a layout for physical verification. Calibre DesignEnhancer optimizes IC designs by reducing or even eliminating IR drop and electromigration (EM) issues quickly and accurately.

It does that by automatically implementing ‘Calibre correct-by-construction’ design layout modifications much earlier in the IC design and verification process. Luigi Rolandi, senior director for R&D at STMicroelectronics, acknowledged that Calibre DesignEnhancer proved instrumental in addressing and resolving out of specification resistance and IR drop issues.

JoongWon Jeon, a distinguished engineer of foundry technology development team at Samsung Electronics, also recognized that Calibre DesignEnhancer has provided mutual customers a step function increase in via insertion efficiency. “That leads to faster turnaround time compared to classic approaches to the problem.” For instance, while traditional place-and-route processes often require design teams to conduct multiple runs, Calibre DesignEnhancer in Samsung PDK helps IC designers achieve substantial first-pass gains.

Calibre DesignEnhancer integrates with all major design and implementation environments using industry interface standards and comes with kits for all leading foundries, supporting designs from 130-nm to 2-nm process nodes.

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Coherent unveils first 800G ZR/ZR+ transceiver in QSFP-DD pluggable form factor

Semiconductor today - Птн, 12/08/2023 - 12:28
Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has launched its 800G ZR/ZR+ transceiver in ultra-compact QSFP-DD and OSFP form factors for optical communications networks, claimed to be the first digital coherent optics (DCO) that can plug directly into QSFP-DD and OSFP transceiver slots on IP routers...

Applus and Rohde & Schwarz seamlessly integrate eCall testing in EMC test environments

ELE Times - Птн, 12/08/2023 - 11:59

Applus Laboratories and Rohde & Schwarz have successfully showcased the seamless integration of eCall testing in an electromagnetic compatibility (EMC) test environment. The demonstration illustrated different eCall testing scenarios and capabilities in compliance with the UN ECE R10 standard, which regulates automobile-related EMC.

As part of the planned update to the UN ECE R10 standard, different eCall testing immunity scenarios had been developed to enhance the safety of drivers, passengers, and other road users. Compliance with UN ECE R10 is crucial for vehicles equipped with eCall systems and ensures the systems do not interfere with other electronic components in the vehicle and are not affected by external electromagnetic interference.

Applus Laboratories is the European market leader for EMC testing at both the component and vehicle levels, offering large, versatile EMC chambers dedicated to full-vehicle testing. The company approached Rohde & Schwarz to help with a demonstration of eCall testing in their EMC facilities. The demonstration utilized the R&S CMW500 cellular network emulator, along with the R&S CMW-KA09x eCall test software simulation and a Public Safety Answering Point (PSAP). The R&S CMW-KA09x eCall test software from Rohde & Schwarz supports 2G, 3G, 4G and 5G-based emergency call systems and can be used to test eCall with Long-Term Evolution (LTE) and 5G NR (Next Generation eCall or NG eCall). The software facilitates eCall compliance testing in line with the EU eCall, NG eCall, UN-R144 and other national standards. A real car was used to test an eCall system in an EMC hall. The main objective was to showcase different scenarios for integrating eCall testing capabilities in an EMC test environment by making accident emergency calls with a test vehicle without making false 112 calls.

During the demo, an immunity test was conducted in a radio anechoic chamber at Applus+ in Spain and radio interference was introduced. The test confirmed the feasibility and ease of establishing an emergency call between the automobile and simulated PSAP server with the R&S CMW500 eCall test solution. The minimum set of data (MSD) was successfully transmitted from the test vehicle to the R&S CMW500 without any data loss. Voice communication was established between the vehicle and the test solution with clear audio quality and the vehicle’s received GNSS position was accurately transmitted.

Applus Laboratories used the successful demonstration in their EMC hall to effectively showcase eCall scenarios with the R&S PSAP system in a workshop. Attendees included the United Nations Informal Working Group on Electromagnetic Compatibility (IWG EMC) and community representatives from various countries, as well as vehicle manufacturers from the International Organization of Motor Vehicle Manufacturers (OICA). The workshop was co-organized by Applus Idiada and Applus Laboratories. The participants were impressed the ease with which the R&S CMW500 handled the eCall test solution and being able to witness the full capabilities of eCall testing.

The collaboration between Applus Laboratories and Rohde & Schwarz not only demonstrated the seamless integration of eCall testing in EMC test environments but also highlighted the advancements in the safety and compatibility of vehicle eCall systems.

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Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing

ELE Times - Птн, 12/08/2023 - 11:26

Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and are now available with Press-Fit terminals

The E-Mobility, sustainability and data center markets require products that are conducive to high-volume manufacturing. To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB. Microchip Technology announced its expansive portfolio of SP1F and SP3F power modules are now available with Press-Fit terminals for high-volume applications.

Solder-free Press-Fit power module terminals allow for automated or robotic installation, which simplifies and speeds up the assembly process to reduce manufacturing costs. The high accuracy of the terminal locations and the novel Press-Fit pin design in the SP1F and SP3F power modules enables high-reliability contact with the printed circuit card. Overall, a Press-Fit power module solution can save valuable time and production costs.

There are over 200 variants available in Microchip’s SP1F and SP3F power modules portfolio, with options to use mSiC technology or Si semiconductors and an array of topologies and ratings. The SP1F and SP3F are offered in voltage range of 600V-1700V and up to 280A.

With Press-Fit technology, the power module pins are not soldered to the PCB. Instead, the electrical connection is made by pressing the pins into properly sized PCB holes. A key advantage of a Press-Fit power module solution is it eliminates the need for wave soldering. This is especially important when the PCB is made to also include Surface-Mount Technology (SMT) components.

“Our power modules with Press-Fit terminals offer customers the flexibility to fully customize their design and are cost-effective power solutions for high-volume production,” said Leon Gross, vice president of Microchip’s discrete products group. “This type of plug-and-play power solution also provides a highly reliable mounting solution for automated or robotic assembly.”

The highly configurable SP1F and SP3F power modules are fully compliant with the Restriction of Hazardous Substances Directive (RoHS).

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Navitas powers NIO Phone with fast charging and EV interaction

Semiconductor today - Птн, 12/08/2023 - 11:03
Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA says that new-energy vehicle maker NIO Inc has released its inaugural smartphone, the NIO Phone with a 66W fast charger featuring its GaNFast power ICs equipped with GaNSense technology. This enhancement delivers flagship-level charging efficiency, providing end users with better vehicle-centric mobile interconnection...

Infineon introduces 12 A and 20 A synchronous buck regulator family with fast COT architecture for DC-DC POL applications

ELE Times - Птн, 12/08/2023 - 10:52

Modern power systems require highly efficient and compact regulators. Infineon Technologies addresses this challenge with the TDA388xx family, targeting the server, AI, datacom, telecom, and storage markets. The 12 A and 20 A synchronous buck regulators utilize a fast constant on-time (COT) control scheme to optimize performance. This approach ensures rapid transient response, minimizes passive component count, and reduces board space. They are versatile and are designed to operate over a wide input voltage range from 4.0 V to 16 V. An external bias supply further extends the application range in various DC-DC scenarios. Infineon’s introduction of these regulators represents a significant leap in power system efficiency and compactness.

The TDA388xx family of four buck regulators (TDA38812, TDA38813, TDA38825, and TDA38826) is unique in its internal compensation, which improves ease of use and reduces the need for external components. This family features a versatile design suitable for a variety of applications. It includes selectable switching frequencies and a soft-start functionality. The regulators also offer a programmable current limit for precise control. They support fixed frequency continuous conduction mode (FCCM) and discontinuous conduction mode (DCM). Additionally, voltage tracking is enabled through an external reference input. This flexibility is crucial for varying power system requirements. Together, these features contribute to the adaptability and efficiency of the regulator family.

The key to the TDA388xx series is its built-in protection features to ensure system safety during fault conditions. These include pre-bias startup and thermally compensated current limiting. Overvoltage protection (OVP) and undervoltage protection (UVP) are also built in. Additionally, a thermal shutdown is included for added safety. The series is housed in a ROHS-compliant QFN-21 package. It operates effectively over a temperature range of -40 to 125°C. This combination of features makes the TDA38825/26/12/13 ideal for demanding power system environments.

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Domestic electronics manufacturing up four-fold to Rs 8.22 lakh crore in FY23: MoS IT

ELE Times - Птн, 12/08/2023 - 09:49

“In FY 2013-14 the electronics manufacturing was Rs 1,80,454 crore ($29.8 billion) and has grown significantly to Rs 8,22,350 crore ($102 billion) in FY 2022-23, which is further expected to grow up to Rs 23,95,195 crore ($300 billion) by 2026.

Domestic electronics manufacturing increased over 4-fold to Rs. 8.22 lakh crore in the last 10 years, Parliament was informed on Wednesday. Minister of State for Electronics and IT Rajeev Chandrasekhar informed the Lok Sabha that India has now reached a stage where 99.2 % of mobile handsets being used in the country are manufactured domestically, and from being an importer in the segment, the country has now become an exporter.

“In FY 2013-2014, the electronics manufacturing was Rs. 1,80,454 crore ($29.8 billion) and has grown significantly to Rs 8,22,350 crore ($102 billion) in FY 2022-23, which is further expected to grow up to Rs 23,95,195 crore ($ 300 billion) by 2026.

He said the country exported mobile phones worth $11.1 billion in the financial year 2022-23.

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HighTec EDV-Systeme and Stellar SR6: the right compiler is as important as the right MCU

ELE Times - Птн, 12/08/2023 - 07:23

Author: STMicroelectronics

Do teams take as much care and effort in choosing their compiler as they do their microcontroller? It’s such a critical question that we work closely with HighTech EDV-Systeme GmbH, a member of the ST Partner Program and the largest commercial open-source compiler vendor. The company, which focuses on automotive applications, announced in 2022 supporting our latest Stellar SR6x integration microcontrollers on top of the existing compatibility with our SPC5x devices. It was the first time the HighTec compiler supported one of our automotive-grade microcontrollers with a Cortex core. Let us thus explore why it is a milestone and why choosing the right compiler is as important as selecting the right processor.

The importance of the close partnership between compiler vendor and silicon maker What were the first fruits of this partnership?

The collaboration between ST and HighTec dates back to 2011. Automotive module makers have had to deal with numerous systems and manufacturers, which means that using one compiler for many projects is essential. Concretely, the HighTec compiler allowed short build times and fast execution speed of the application in conjunction with the most stringent requirements of the ISO 26262 standard. And as we worked with HighTec, module makers adopted our SPC devices without drastically changing their workflows. Additionally, our close collaboration enabled our customers to take advantage of the features we provided on our hardware platform more rapidly. In a nutshell, beyond supporting ST devices, HighTec helps developers with optimized run-time performance and build times.

What to look for in a compiler vendor?

Looking at the historical context of our partnership with HighTec, it is easy to understand why a close relationship between the silicon and compiler vendors is essential. The right compiler is one that reflects a collaboration with chip makers by receiving frequent updates, compatibility with new devices, and significant performance optimizations. This close interaction also led the ST Authorized Partner to recommend our devices when providing consulting services. As we work with HighTec to ensure they have access to the right expertise and documentation, the company can better serve its community by providing the best recommendations to its customers.

The foundational quality of the hardware platform Why did we create the Stellar SR6? The Stellar SR6 supported by HighTecThe Stellar SR6 supported by HighTec

The partnership between ST and HighTec explains why the compiler is now compatible with Stellar SR6 devices. Thanks to their Cortex-R52+ cores, the ST Integration MCUs provide real-time and deterministic performances. As the name implies, they aim to integrate modules into one platform, which explains why they share interfaces, such as Ethernet, CAN-FD, CAN-XL, or LIN, and why to run multiple virtual machines on them. The SR6G (also called Stellar G) targets zone controllers, gateways, and body integration by creating a hub managing the I/Os, data, and power consumption. The Stellar P (SR6P) devices, on the other hand, help simplify designs by integrating drivetrains and domain-oriented applications onto one platform.

How do the Stellar SR6 drive innovation?

The Stellar SR6 devices are highly symbolic because the philosophy behind their specification reflects the new trends in software-driven vehicles. For instance, the SR6G7 was recently a highlight of the prestigious VLSI 2023 conference thanks to its embedded phase change memory that nearly doubles in capacity when in full over-the-air mode. Thanks to years of R&D, ST was able to show how car makers could more easily and cost-effectively implement over-the-air updates. Hence, ST’s line of Integration microcontrollers aims to solve some of the development challenges inherent to the new applications powering vehicles.

HighTec and the critical building blocks of its software ecosystem What does a flexible and pragmatic ecosystem look like?

When HighTec announced supporting our Stellar SR6 devices, the company made a point to emphasize compiler support and performance optimization. Indeed, our teams worked closely together to ensure that developers could more easily take advantage of our hardware features when using HighTec’s ecosystem. Whether programmers want to use our encryption capabilities, a hardware security module (HSM), the new OTA functionalities, or ST’s software components, such as MCAL, or the Safety and Security packs, HighTec not only baked-in support but acquired expertise to further its consulting services.

How have past and present decisions impacted the future?

Behind the scenes, the rapid adoption of our Cortex devices was possible because of technical choices HighTec made decades ago. Indeed, early in the 1990s, the company prioritized open-source compilers, which was unusual then, especially for a vendor in the automotive industry. The company first settled on GCC and then moved to LLVM around 2015 due to licensing reasons and because there was a clear trend within the industry. Consequently, the open-source aspect inspired developers looking to abandon proprietary solutions, while LLVM ensured the company could rapidly support ARM architectures.

Today, ST and HighTec work on new applications in EVs that have unique requirements. For instance, MCUs like the Stellar SR6 have a general timer module (GTM) that developers can program in C to generate I/O signals and thus offload the main CPU. These GTMs are essential when driving silicon carbide (SiC) transistors, which are increasingly necessary to improve efficiency and battery lifeHowever, the high frequency needed to drive these new devices means developers must create a high-performance code with performance similar to assembly and thus require extreme optimizations at the compiler level. Put simply, choosing the right compiler is crucial not only for today’s applications but tomorrow’s as well.

Read the full article at https://blog.st.com/hightec-stellar-sr6/

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