Microelectronics world news

Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services

ELE Times - Sat, 07/20/2024 - 09:12

Surf-Tech Manufacturing Corp., a multi-faceted provider of contract manufacturing services, is pleased to announce the expansion of its advanced conformal coating services. By continuously investing in advanced technology and expanding its capabilities, Surf-Tech ensures that clients receive the best possible quality solutions for their manufacturing needs.

Surf-Tech’s advanced conformal coating services are designed to support a wide range of applications, from selective conformal coating and potting to bead and meter-mix dispensing. The company’s expertise in these areas allows for precise, efficient and reliable protection of electronic assemblies, ensuring optimal performance and durability.

With state-of-the-art conformal coating technology, Surf-Tech delivers superior protection for printed circuit boards (PCBs) across diverse industries. The company is dedicated to providing high-value, reliable manufacturing solutions, and its conformal coating process ensures the longevity and reliability of electronic components, even in the most demanding conditions.

“Our goal is to offer safeguard our client’s PCBs while maintaining the highest standards of quality and efficiency,” said Stephen Eggart, President of Surf-Tech Manufacturing. “By investing in industry-leading conformal coating technology, we can provide tailored solutions that meet the unique needs of each customer, from startups to Fortune 500 companies.”

In addition to its conformal coating services, Surf-Tech offers a suite of manufacturing solutions, including SMT, through-hole soldering, mechanical assembly and higher-level assembly (HLA). With turnkey capability, materials management expertise, and quick-turn prototype services, they provide comprehensive solutions tailored to their clients’ specific requirements.

The company boasts state-of-the-art automated equipment and full-service capabilities, catering to all phases of electronic manufacturing and assembly work. Whether it’s prototype design or end customer webstore fulfillment, Surf-Tech delivers high-quality solutions with precision and efficiency.

Surf-Tech’s commitment to quality is reflected in its ISO 9001 certification, IPC, and ITAR registrations. Personnel are certified to various applicable standards, including IPC-A-610 (Acceptability of Electronic Assemblies) and J-STD-001 (Requirements for Soldered Electrical and Electronic Assemblies).

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Test and Measurement Tools See Key Expansions and Firmware Updates

AAC - Fri, 07/19/2024 - 20:00
Rohde & Schwarz, Pico Technology, and Keysight Technologies are making important updates to their tools, from oscilloscopes to solar array simulators.

Innovate UK awards £1.1m one-year project to industrialize ULTRARAM, led by Quinas with IQE and Lancaster and Cardiff universities

Semiconductor today - Fri, 07/19/2024 - 18:34
Innovate UK (which provides funding and support for business innovation as part of UK Research and Innovation) has granted £1.1m to epiwafer and substrate maker IQE plc of Cardiff, Wales, UK, the Universities of Cardiff and Lancaster, and project coordinator Quinas Technology Ltd (which was spun off from Lancaster University in early 2023)...

Guerrilla RF releases broadband pre-driver for wireless infrastructure

Semiconductor today - Fri, 07/19/2024 - 17:20
Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which develops and manufactures radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — has announced the formal release of the GRF5112, a highly linear, broadband gallium arsenide (GaAs) pseudomorphic high-electron-mobility transistor (pHEMT) power amplifier that delivers what is claimed to be excellent compression performance over large fractional bandwidths of up to 40%. Its broad, single-tuned responses enable multi-carrier base stations to simultaneously transmit across two or more cellular bands using a single RF lineup...

First Solar announces ownership of TOPCon technology patents

Semiconductor today - Fri, 07/19/2024 - 17:15
Cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA has announced its ownership of patents related to the manufacturing of Tunnel Oxide Passivated Contact (TOPCon) crystalline-silicon (c-Si) photovoltaic solar cells...

Sparse AI MCU facilitates voice processing and cleanup at edge

EDN Network - Fri, 07/19/2024 - 15:38

While major microcontroller (MCU) suppliers like Infineon, Renesas, and STMicroelectronics have been incorporating artificial intelligence (AI) capabilities into their chips to facilitate applications at the edge, two smaller outfits have joined hands to offer a sparse AI MCU. Femtosense integrated its Sparse Processing Unit 001 (SPU-001), a neural processing unit (NPU), with ABOV Semiconductor’s MCU.

The outcome, AI-ADAM-100, is an MCU built on sparse AI technology to enable on-device AI features such as voice-based control in home appliances and other products. It cleans up voice/audio data before it is sent to the cloud, improving reliability and accuracy and reducing the volume of data sent to the cloud. AI-ADAM-100 enables designers to implement voice language interfaces at the edge, even for devices that are not connected to the cloud.

AI-ADAM-100 allows manufacturers to implement voice language interfaces at the edge, even for devices that are not connected to the cloud.

“With sparsity integrated throughout the AI development stack, the AI-ADAM-100 is the first device on the market to fully unlock the advantages of sparse AI,” said Sam Fok, CEO for Femtosense. The sparse AI MCU is being targeted at home appliances as well as small form factor, battery-operated devices such as high-fidelity hearing aids, industrial headsets, and consumer earbuds.

But how does sparse AI work? It reduces the cost of AI inferencing by zeroing out irrelevant portions of an algorithm and then only allocating hardware memory and compute resources to the remaining nonzero, relevant portions of the algorithm. As a result, a system that stores and computes only nonzero weights can deliver up to a 10x improvement in speed, efficiency, and memory footprint.

AI-ADAM-100 enables home appliance manufacturers to implement sophisticated wake-up and control functionality. This allows other system controllers and connectivity modules to drop into sleep mode and consume substantially less power when a user is not interacting with the system. Moreover, ABOV has verified AI-ADAM-100’s voice command recognition performance under multiple noise conditions.

AI-ADAM-100 adds a new flavor to the ongoing marriage of AI and MCUs. It brings language processing and voice cleanup capabilities to an MCU and works with a manufacturer’s own AI models, whether dense or sparse.

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Daihen uses Infineon’s 2000V SiC module in highest-power-density grid storage ground power conditioner

Semiconductor today - Fri, 07/19/2024 - 15:22
Infineon Technologies AG of Munich, Germany that its CoolSiC 2000V modules have been selected by Daihen Corp of Tokyo, Japan for its unit-type power conditioners for grid storage batteries...

Infineon contributes to industry’s highest power density grid storage ground power conditioner from Daihen with 2000 V SiC Module

ELE Times - Fri, 07/19/2024 - 15:16

Infineon Technologies AG announced that its CoolSiC 2000 V modules have been selected by Daihen Corporation for their innovative unit-type power conditioners for grid storage batteries. In the journey towards reducing carbon emissions, both grid storage batteries and the power conditioners that are linked to them play a vital role in facilitating the wider adoption of renewable energy sources like solar and wind power generation. There has been an increasing demand for higher voltage storage batteries and power conditioners to enhance the effectiveness of power generation, storage, and transmission. Moreover, with the expansion of storage battery systems on a larger scale, finding suitable locations and minimizing construction costs have emerged as significant challenges.

The unit-type power conditioner for grid storage batteries launched by Daihen in March 2024 is the first product in the industry to achieve connection to storage batteries at a high DC link voltage of 1500 V. The higher voltage enables the product to be used with large-capacity storage battery facilities, which has resulted in a 40 percent reduction in the footprint of grid storage batteries compared to the conventional product.

The high power density is achieved by using Infineon’s 62 mm CoolSiC MOSFET 2000 V module (FF3MR20KM1H). In addition to the characteristics of SiC that enable high voltage, better thermal dissipation and high power density, Infineon’s SiC products feature M1H trench technology that increases the gate drive voltage range and provides high robustness and reliability against gate voltage spikes. Infineon was the pioneer in the industry to introduce the 2000 V class for a SiC module. This innovation has been instrumental in simplifying the inverter circuit configuration. Furthermore, the optimized 62 mm package has led to a substantial reduction in system size, contributing to enhanced efficiency and performance.

Mr. Akihiro Ohori, General Manager, Development Department, Energy Management System Division, Daihen, said, “In order to increase the voltage of power conditioners, the circuit configuration of conventional 1200 V devices had become complicated. However, by adopting Infineon’s 2000 V SiC modules, we were able to achieve a simplified circuit configuration and control design, thereby reducing development resources and the footprint.”

Masanori Fujimori, Marketing Director of the Industrial & Infrastructure Segment at Infineon Technologies Japan, said, “We are very pleased that our pioneering CoolSiC 2000 V module has contributed to the development of the industry’s highest power density power conditioners for grid storage batteries. We believe that Infineon’s SiC technology will address the need for higher efficiency in energy storage systems and will greatly contribute to the growth of renewable energy.”

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Infineon and Amkor sign Memorandum of Understanding to stimulate sustainable action across the supply chain

ELE Times - Fri, 07/19/2024 - 14:53

–      Both companies commit to actively engage with common suppliers to help them drive effective decarbonization strategies.

–      The aim is to identify areas for improvement and support suppliers in setting their own science-based emissions reduction targets.

–      The partnership of Infineon and Amkor is set to bring the green supplier engagement of both companies to the next level.

Infineon Technologies AG, a leader in power systems and IoT, has signed a Memorandum of Understanding with Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, with a joint commitment to stimulate decarbonization and sustainability strategies across the supply chain.

Expanding their partnership towards sustainability is the next step in the sustainability journey of both companies. Infineon and Amkor intend to fully leverage their classical Outsourced Semiconductor Assembly and Test (OSAT) business relationship in order to effectively tackle emissions along their supply chain. In April, both companies announced to operate a dedicated packaging and test center at Amkor’s manufacturing site in Porto, Portugal.

As part of the cooperation for climate protection, Infineon and Amkor will actively engage with common suppliers to help them develop and implement effective decarbonization strategies. This will involve workshops, meetings, and the sharing of best practices and learnings related to decarbonization. The aim is to identify areas for improvement and support suppliers in setting science-based emissions reduction targets in line with the Science Based Targets initiative. Both companies are committed to providing ongoing guidance, fostering exchange, and tracking progress to drive continuous improvement across the common supply chain.

“Infineon has made excellent progress towards its aim to become CO2-neutral for scope 1 and 2 by 2030, as the company more than halved its emissions while doubling the revenue since 2019. Supply-chain-related Scope-3-emissions represent the highest share of total emissions at Infineon and are the hardest ones to minimize,” said Angelique van der Burg, Chief Procurement Officer at Infineon. “That makes it even more important to include them in our efforts. But no one can do it alone. We need to actively collaborate and drive innovation with our suppliers if we want to effectively reduce CO2 emissions. This is of ample importance not only for Infineon and Amkor, but also for society at large. Therefore, we are happy to join forces with Amkor on this.”

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onsemi Accelerates Silicon Carbide Innovation to Power the Transition to Electrification

ELE Times - Fri, 07/19/2024 - 12:58
NEWS HIGHLIGHTS
  • Latest generation EliteSiC M3e MOSFETs decrease turn-off losses by up to 50% for electrification applications
  • Platform uniquely achieves a reduction in both conduction and switching losses on the field-proven planar architecture
  • When combined with onsemi’s portfolio of intelligent power products, the EliteSiC M3e can deliver further optimized system solutions and reduce time-to-market
  • onsemi unveiled plans to introduce multiple future generations of silicon carbide at an accelerated pace through 2030
In the face of escalating climate crises and a dramatic rise in global energy demands, governments and industries are committing to ambitious climate goals aimed at mitigating environmental impact and securing a sustainable future.
Key to these efforts is the transition to electrification to reduce carbon emissions and embrace renewable energy resources. In a significant step towards accelerating this global transition, onsemi introduced its latest generation silicon carbide technology platform, EliteSiC M3e MOSFETs. The company also disclosed plans to release multiple additional generations through 2030.
onsemi EliteSiC
“The future of electrification is dependent on advanced power semiconductors. Today’s infrastructure cannot keep up with the world’s demands for more intelligence and electrified mobility without significant innovations in power. This is critical to the ability to achieve global electrification and stop climate change,” said Simon Keeton, group president, Power Solutions Group, onsemi. “We are setting the pace for innovation, with plans to significantly increase power density in our silicon carbide technology roadmap through 2030 to be able to meet the growing demands for energy and enable the global transition to electrification.”
The EliteSiC M3e MOSFETs will play a fundamental role in enabling the performance and reliability of next-generation electrical systems at lower cost per kW, thus influencing the adoption and effectiveness of electrification initiatives. With the ability to operate at higher switching frequencies and voltages while minimizing power conversion losses, this platform is essential for a wide range of automotive and industrial applications such as electric vehicle powertrains, DC fast chargers, solar inverters and energy storage solutions. Additionally, the EliteSiC M3e MOSFETs will enable the transition to more efficient, higher-power data centers to meet the exponentially increasing energy demands that power a sustainable artificial intelligence engine.
M3e Wafer
Trusted Platform Delivers Generational Efficiency Leap
Through onsemi’s unique design engineering and manufacturing capabilities, the EliteSiC M3e MOSFETs achieve a significant reduction in both conduction and switching losses on the trusted and field-proven planar architecture. Compared to previous generations, the platform can reduce conduction losses by 30% and turn-off losses by up to 50%1. By extending the life of SiC planar MOSFETs and delivering industry-leading performance with EliteSiC M3e technology, onsemi can ensure the robustness and stability of the platform, making it a preferred choice for critical electrification applications
The EliteSiC M3e MOSFETs also offer the industry’s lowest specific on-resistance (RSP) with short circuit capability which is critical for the traction inverter market that dominates SiC volume. Packaged in onsemi’s state-of-the-art discrete and power modules, the 1200V M3e die delivers substantially more phase current than previous EliteSiC technology, resulting in approximately 20% more output power in the same traction inverter housing. Conversely, a fixed power level can now be designed with 20% less SiC content, saving costs while enabling the design of smaller, lighter and more reliable systems.
Additionally, onsemi provides a broader portfolio of intelligent power technologies including gate drivers, DC-DC converters, e-Fuses and more to pair with the EliteSiC M3e platform. The end-end onsemi combination of optimized, co-engineered power switches, drivers and controllers enable advanced features via integration, lowering overall system cost.
M3e Reel
Accelerating the Future of Power
Global energy demands are projected to soar over the next decade, making the need for increased power density in semiconductors paramount. onsemi is leading innovation across its silicon carbide roadmap – from die architectures to novel packaging techniques – that will continue to address the general industry demand for increased power density.
With each new generation of silicon carbide, cell structures will be optimized to efficiently push more current through a smaller area, increasing power density. When coupled with the company’s advanced packaging techniques, onsemi will be able to maximize performance and reduce package size. By applying the concepts of Moore’s Law to the development of silicon carbide, onsemi can develop multiple generations in parallel and accelerate its roadmap to bring several new EliteSiC products to market at an accelerated pace through 2030.
“We are applying our decades of experience in power semiconductors to push the boundaries of speed and innovation in our engineering and manufacturing capabilities to meet the rising global energy demands,” said Dr. Mrinal Das, senior director of technical marketing, Power Solutions Group, onsemi. “There is a huge technical interdependency between the materials, device and package in silicon carbide. Having full ownership over these key aspects allows us to have control over the design and manufacturing process and bring new generations to market much faster.”

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Union Budget 2024-25: Employment, Manufacturing, Infrastructure, Healthcare, Education and Tax Reforms in Focus

ELE Times - Fri, 07/19/2024 - 06:30

In her Interim Budget 2024 speech, Finance Minister Sitharaman highlighted the Indian economy’s transformation, focusing on women, youth, the poor, and farmers. The government lifted 25 crore people out of poverty in a decade, provided free food to 80 crores through various schemes, and facilitated Direct Benefit Transfers of ₹34 lakh crore via PM Jan Dhan Yojana, saving ₹2.7 lakh crore. Key initiatives included support for artisans and street vendors, upskilling 1.4 crore youth, empowering rural women with financial schemes, and expanding healthcare coverage. Economic measures encompassed infrastructure development, housing subsidies, agricultural advancements, and renewable energy initiatives. The budget prioritized fiscal consolidation and capital expenditure at ₹11.11 lakh crore while maintaining tax rates. Plans for achieving Net Zero by 2070 included offshore wind energy and e-vehicle sector expansions. Borrowing targets for 2024-25 have been set at ₹14.13 lakh crore gross and ₹11.75 lakh crore net.

With the Union Budget 24-25 set to be presented by FM Sitharaman on July 23, 2024, expectations are that the government will continue reforms and investments to sustain economic momentum and enhance governance efficiency with better and more inclusive tax reforms and taxpayer services. We hope the budget reflects a comprehensive approach towards economic resilience and inclusive development across various sectors to propel India towards sustainable growth.

Industry Speaks: Budget 2024 Expectations Highlights Union Budget 2024-25: Focus on Employment, Infrastructure, and Innovation with Upskilling, SME Support, and Fintech Growth

Gaurav Jalan, Founder & CEO, mPokket

“Following from the Interim Budget earlier this year and the challenges of the economy in the recent past, the upcoming full budget is expected to focus on employment, infrastructure and innovation. We expect the government to double down on initiatives relating to upskilling of youth to improve employability. Alongside this, increasing jobs is expected to be the core government agenda. We expect this to be through a dual approach of easing credit access to small and medium businesses to catalyse their growth and through incentives on research and investments from the private sector. We expect the government to also focus on the disposable income of the middle class by revisiting direct taxation rates. This shall drive a sustained domestic consumption-led growth for the economy. Additionally, we believe the government shall continue to view positively the contribution of fintech as a key driver of easy access to credit and their potential to create employment. We therefore expect a favourable approach to investments in the sector and clarity on the open regulatory discussions to propel India towards becoming a global fintech hub.”

Union Budget 2024-25: Enhance National Cybersecurity with Funding, Incident Reporting, and Startup Collaboration Initiatives

Ritesh Kumar, Founder & CEO, Cyfirma

“I am looking forward to seeing how the upcoming budget addresses the nation’s urgent cybersecurity needs amidst rapid digital transformation. India needs significant investment in building a national cybersecurity framework for enterprises, SMEs and startups to ensure all businesses have access to essential resources and guidelines. Supporting this, there is a critical need for adequate funding for a robust incident reporting policy, as that would facilitate timely and transparent reporting of cyber incidents, allowing minimising the damage and help in building a resilient cybersecurity infrastructure. For all these, the budget should include co-innovation funding for cybersecurity startups that would facilitate the development of new security solutions. By doing so, India can accelerate the development and deployment of advanced cybersecurity technologies. It is crucial that the government take initiatives to integrate cybersecurity startups into federal and enterprise sectors. As collaborating with the government and cybersecurity firms can help these startups scale their solutions, offering larger entities innovative and agile security approaches. These collaborations can combine expertise and resources to advance cybersecurity measures and bolster defence against cyber threats. And finally, the Budget should prioritise funding framework and guidelines to address the AI’s cybersecurity challenges while fostering innovation”

Union Budget 2024-25: Strengthen Cybersecurity with Funding, Education, and Innovations for Critical Infrastructure Protection

Pankit Desai, CEO & Co-Founder, Sequretek 

 “Emphasis should be on enhancing national cybersecurity infrastructure by providing dedicated funding for both government and private sector to prevent data breaches and cyberattacks, especially in critical areas such as banking, energy, healthcare, and transportation. This involves investing in cybersecurity education at universities and technical institutions and providing training and certifications courses at subsidised rate to ensure continuous skill development and a robust pipeline of cybersecurity professionals. Investments should also go to protecting critical infrastructure with advanced threat detection and response systems to build resilience and recovery plans to quickly restore services in the event of a cyberattack. For this it is necessary to encourage cybersecurity innovations by providing financial incentives and establishing incubation centres to support growth of new cybersecurity businesses. Along with this, funds should be deployed to raise awareness about cybersecurity practices among businesses and the general public through workshops and seminars in collaboration with industry experts”.

Union Budget 2024-25: Accelerate EV Delivery with Policy Continuity, Lower GST, and Robust Charging Infrastructure

Akash Gupta, Co-Founder & CEO, Zypp Electric

“To achieve net-zero carbon emissions, the government must focus on maintaining policy continuity. Inclusion in the priority lending scheme and reducing GST for EV services from 18% to 5% will accelerate EV-led delivery adoption. Recognizing last-mile delivery as a distinct sector under logistics policies is essential, given that one-third of shipments fall within this category. Establishing industry standards, supporting gig delivery partners with tailored schemes, and implementing standard operating procedures (SOPs) will enhance efficiency and foster growth in this vital but often overlooked segment of the logistics industry. An extension of the existing EMPS scheme will result in better stakeholder sentiment and investor confidence. With increased government support in driving localization to cut down costs, infrastructural advancements in terms of establishing a robust charging infrastructure, which will further aid in boosting customer awareness, and focusing on job creation will foster strong collaborations and necessitate substantive developments for the EV sector.”

Union Budget 2024-25: Boost EV Adoption with PLI Schemes, Tax Reforms, and Expanded Charging Infrastructure

Niranjan Nayak, Managing Director, Delta Electronics India 

“As we look forward to the Union Budget 2024, our expectations focus on the critical need for transformative reforms in the auto sector, specifically aimed at fostering a green and sustainable energy segment. With a firm commitment to reducing pollution and addressing climate change, we anticipate the government will align its policies with the net-zero goal and sustainable development.

The implementation of PLI schemes specifically for EV charging companies is crucial. Expanding EV infrastructure is essential for promoting widespread EV adoption in India, and financial incentives will significantly boost the growth of our charging network. We also hope for tax reforms that support our industry and encourage consumers to transition to electric vehicles. Developing a robust EV charging ecosystem, particularly in Tier II and Tier III cities, is vital. Prioritizing open data standards and APIs for charging networks will ensure interoperability and enhance user experience. At Delta Electronics India, we are dedicated to contributing to this transformative journey by providing innovative, reliable, and efficient charging solutions. With supportive budget measures, we can strengthen our charging capacity more accessible for all, paving the way for a sustainable future.”

Union Budget 2024-25: Prioritize Sustainable Growth with Green Investments     

Dr Miniya Chatterji, Founding Director, Anant School for Climate Action, and CEO, of Sustain Labs Paris

“In the Union Budget 2024, it would be important to prioritize initiatives that drive sustainable growth. Investments should focus on renewable energy projects, green infrastructure, and sustainable agriculture. Another good move could be a reduction in the GST levied on renewable energy components. Additionally, provisions should be made to promote skilling and innovation in the field of sustainability”.

Union Budget 2024-25: Boost EV Sector with Subsidies, Incentives, and Investment for Sustainable Mobility in India

Hyder Khan, Director & CEO, Godawari Electric Motors

“With the Central & State government’s strong push towards a greener future, we have high expectations from the upcoming budget for the EV sector, particularly for those who believe in the ‘Make in India’ model. As we approach the 2024 budget, the electric vehicle industry stands at a pivotal juncture. We are looking for continued support and substantial policy enhancements to accelerate the transition to sustainable transportation.

We urge the government to consider increased subsidies for electric two-wheelers and three-wheelers, as well as incentives for domestic manufacturing and R&D initiatives. Additionally, investments in charging infrastructure and battery technology will be crucial to overcome existing barriers to widespread EV adoption. Our vision is to make clean and affordable mobility accessible to every citizen, and with the right fiscal measures, we can make significant strides toward achieving this goal. We are hopeful that the upcoming budget will reflect a strong commitment to fostering innovation and growth within the EV sector, ultimately contributing to a greener and more sustainable future for India.”

Union Budget 2024-25: Strengthen Financial Inclusion with Enhanced Imperatives and Incentives for Banks and Tech Ecosystem

Ramki Gaddipati, CEO APAC and Global CTO, Zeta

“India already boasts of some of the most impressive Digital Public Infrastructure (DPI) and payment rails today including ground-breaking new protocols such as Credit Line on UPI. As a provider of next-generation banking solutions to large financial institutions, we hope that the Union Budget 24-25 will introduce further imperatives and incentives for banks and the associated technology ecosystem to create even more financial inclusion for the underserved Indians.”

Union Budget 2024-25: Strengthen Waste Management and Circular Economy with Enhanced Infrastructure and Streamlined Supply Chains

Sachin Sharma, Founder and Director, GEM Enviro Management Limited

“Building on the momentum of last year’s budget, which prioritized green growth, the upcoming Union Budget presents a significant opportunity to further strengthen India’s waste management infrastructure. However, significant challenges remain. Inadequate waste collection infrastructure and inefficient sorting and recycling systems continue to hinder progress. Valuable materials are still being discarded in landfills instead of being diverted for reuse.

To truly advance India’s circular economy goals, the government must encourage and support waste management agencies that are diligently working in this field. Additionally, streamlining the supply chain for e-waste and plastic waste is essential. This will foster a robust ecosystem where manufacturers, industry players, and recyclers can collaborate more effectively. While Extended Producer Responsibility (EPR) and the Waste Management Rules of 2016 have had a positive impact, more impactful compliance is needed to achieve truly meaningful results.”

Union Budget 2024-25: Boost the Electronics Industry with PLI Support, Export Enhancements, and Infrastructure Investments

Ashok Rajpal, Managing Director, Ambrane India

“For the Union Budget 2024-25, there is a strong sense of optimism within the electronics industry. The Government’s Production-Linked Incentive (PLI) schemes have already demonstrated their potential, driving remarkable growth, attracting investments, and enhancing our manufacturing capabilities. We anticipate continued support in the upcoming budget. To elevate our industry to global standards, it is imperative to enhance support for exporting ‘Made in India’ products. As the budget approaches, we look forward to policies that reinforce domestic manufacturing, foster innovation, and enhance our global competitiveness. Sustained backing for the ‘Make in India’ initiative remains crucial to our trajectory.

Critical investments in infrastructure and technology will be pivotal for the growth of the electronics manufacturing sector. Tax incentives and streamlined regulatory processes are essential for sustaining sectoral health. Emphasizing self-reliance in advanced technologies will further bolster local manufacturing efforts. We await the budget with optimism, expecting policies that strengthen our foundation for growth, innovation, and sustainable practices in electronics manufacturing.”

Union Budget 2024-25: Address MSME Late Payments with Holistic Solutions and MSME Data Stack to Enhance Cash Flow

Winny Patro, CEO and Co-Founder, Recordent India

“In the age of data and technology solving many problems for businesses, MSMEs are still struggling with delayed payments and are caught up in a vicious cycle of cash flow problems. An SME entrepreneur spends more time dealing with late payments than growing his business. Introduction of section 43B(H) had an impact around the end of financial year 2024 closing and will again only impact late payers during FY closings. Access to working capital and MSMEs samadhan filing, addresses the cash flow at the far end of the problem. There is a need to address the problem holistically like how the banking industry got better with timely payments due to credit bureaus. MSME data stack could be one of the solutions to reduce credit risk and avoid late payments. In addition to this, benchmarking payment terms based on sectors and nature of products/services could be another solution. Hoping that the upcoming budget gives importance to solve this massive problem of ₹10 lakh+ crore late payments stuck in the MSME sector in India”.

Union Budget 2024-25: Propel Viksit Bharat Vision with Tech Adoption, R&D, and Skilling for Global Leadership

Aalok Kumar, Corporate Officer & Senior VP – Head of the Global Smart City Business Development Department and President & CEO, NEC Corporation India

“Earlier this year, the GoI presented an interim budget that reinforced its vision for ‘Viksit Bharat’ by 2047 – to accelerate India into a developed nation and foster inclusive economic participation among all citizens. As we await the full budget, we expect clear and decisive provisions to advance this vision, with technology at the heart of this transformation. We are optimistic that this Union Budget will prioritize the adoption of digital technologies across critical sectors, particularly in governance, to create a more inclusive, efficient, and participative framework. While technology continues to drive India’s socio-economic progress, the key lies in building the nation into the knowledge capital of the world through enhanced R&D and innovation efforts. This will require continued and rigorous investments into the nation’s talent-pool through concerted training, skilling, and upskilling endeavours. At NEC India, we remain committed to supporting this mission by partnering with our partner ecosystem and the public sector. Together, we aim to propel India’s journey towards global leadership, leveraging innovations in line with our focus – ‘In India, for India and From India, For Global’.”

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IR emitting diode boosts radiant intensity

EDN Network - Fri, 07/19/2024 - 04:05

The TSHF5211, an 890-nm infrared emitting diode from Vishay, delivers a typical radiant intensity of 235 mW/sr at a drive current of 100 mA. According to the manufacturer, this represents a 50% increase over previous-generation devices.

Based on a surface emitter chip, the TSHF5211 offers a temperature coefficient of VF of -1.0 mV/K. It also provides a narrow ±10° half angle of intensity and switching times of 15 ns. These features make the high-intensity emitter well-suited for smoke detectors and industrial sensors, as it enables good spectral matching with silicon photodetectors in these applications.

The TSHF5211 IR emitting diode is housed in a clear, untinted leaded plastic package. Samples and production quantities are available now, with lead times of 20 weeks for large orders.

TSHF5211 product page 

Vishay Intertechnology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Mux/demux ICs switch high-speed signals

EDN Network - Fri, 07/19/2024 - 04:05

Two multiplexer/demultiplexer switches from Toshiba handle high-speed differential signals, such as PCIe 5.0, USB4, and USB4 V.2. The TDS4A212MX and TDS4B212MX, which have different pin assignments, can be used as a 2-input, 1-output multiplexer and a 1-input, 2-output demultiplexer in PCs, server equipment, and mobile devices.

Both of these devices are manufactured on Toshiba’s silicon-on-insulator process to achieve high bandwidth. The TDS4A212MX has a -3-dB bandwidth of 26.2 GHz typical, while the TDS4B212MX achieves a higher -3-dB bandwidth of 27.5 GHz typical. Optimized pin assignments enhance the high-frequency characteristics of the TDS4B212MX. In contrast, the pin assignment for the TDS4A212MX is designed with circuit board layout considerations in mind.

Main specifications for these switches include:

Toshiba is now shipping the TDS4A212MX and TDS4B212MX multiplexer/demultiplexer devices.

TDS4A212MX product page

TDS4B212MX product page

Toshiba Electronic Devices & Storage 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Arduino beginners’ kit sparks creation

EDN Network - Fri, 07/19/2024 - 04:04

Arduino’s Plug and Make Kit lets beginners, hobbyists, and do-it-yourselfers build an IoT smart device and interact with it. At its core is the UNO R4 WiFi main board, which employs a Renesas RA4M1 Arm Cortex M4 microcontroller and Espressif ESP32 S3 for Wi-Fi and Bluetooth 5 connectivity. Seven starter projects with step-by-step instructions allow users to assemble components without soldering or breadboards and control their device via Arduino Cloud dashboards.

The kit furnishes seven Modulino sensor and actuator nodes, including a buzzer, 6-axis inertial measurement unit, temperature/humidity sensor, buttons, knob, LED strip, and proximity sensor. A Modulino base board provides the project’s physical frame, while Qwiic cables connect the Modulino nodes and the UNO R4 WIFI board. A USB-C cable with a USB-A adapter is also included.

Online resources are available to help integrate projects with the Arduino ecosystem. These include free programming tools, a smartphone app to monitor and control IoT devices, and Arduino Cloud templates to get up and running.

The Plug and Make Kit costs $87. It can be purchased from the Arduino Store, as well as from distributors DigiKey, Farnell, and Mouser Electronics, to name a few.

Plug and Make Kit

Arduino

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AI/ML platform leverages Microchip MPU

EDN Network - Fri, 07/19/2024 - 04:04

Edge Impulse announced that Microchip’s SAMA7G54 MPU is now fully integrated into its platform to enable easy training of ML models. The integration allows developers to build, train, and deploy machine learning models on edge devices powered by the SAMA7G54, particularly in camera-based applications.

Based on a single Arm Cortex-A7 core, the SAMA7G54 microprocessor features imaging and audio subsystems with 12-bit parallel or MIPI-CSI2 camera interfaces. It also offers dual Ethernet options and advanced security functions, including secure boot and hardware crypto accelerators. For edge AI applications, the SAMA7G54 supports camera-based edge machine learning tools like Edge Impulse’s Faster Objects, More Objects (FOMO) algorithm, which brings object detection to highly constrained devices, and image classification models.

Edge Impulse and Microchip expect their collaboration to streamline the creation of AI and ML models for edge hardware, accelerating the adoption of AI at the edge. For more information on integrating the Microchip SAMA7G54 with Edge Impulse, visit the Edge Impulse documentation here and Microchip’s documentation here.

Edge Impulse 

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IC duo forms smart automotive cockpit

EDN Network - Fri, 07/19/2024 - 04:04

Infineon and MediaTek have joined forces to create a digital cockpit system that they say reduces BOM costs for both hardware and software. The solution pairs an Infineon Traveo CYT4DN microcontroller with MediaTek’s entry-level Dimensity Auto SoC.

The Traveo CYT4DN MCU acts as a safety companion to the SoC, ensuring compliance with ASIL-B safety standards for automotive clusters. It monitors the SoC’s content and takes over with reduced functionality in case of an error, while also performing regular companion functions such as vehicle network communication.

This cockpit solution supports a resolution of 1920×720 pixels for both cluster and infotainment displays. The ASIL-B-compliant Traveo MCU drives the cluster, ensuring reliability. By running under the open-source Android OS, the Dimensity Auto SoC simplifies software, reduces software cost, and eliminates the need for a hypervisor or expensive commercial OS. Suppliers and manufacturers can self-maintain and update the software, further reducing expenses.

Infineon and MediaTek anticipate that their IC combination will make digital cockpits affordable for all vehicles, including entry-level models.

Traveo CYT4DN product page 

Dimensity Auto product page

Infineon Technologies

MediaTek

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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OmniVision, ST, and Onsemi Freshen Up Image Sensor Portfolios

AAC - Fri, 07/19/2024 - 02:00
Several companies have updated the size, efficiency, or development ecosystems of their image sensors for applications ranging from AR to factory automation.

Nuvoton Supports the AI-Laden Data Center With 48-V Motor Driver IC

AAC - Thu, 07/18/2024 - 20:00
The 48-V direct drive motor driver IC promotes high efficiency, airflow, and speed rotation in fan motors.

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