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– Q2 FY 2024: Revenue €3.632 billion, Segment Result €707 million, Segment Result Margin 19.5 percent
– Outlook for FY 2024: Based on an assumed exchange rate of US$1.10 to the euro, Infineon now expects to generate revenue of around €15.1 billion plus or minus €400 million (previously €16 billion plus or minus €500 million), with a Segment Result Margin of around 20 percent (previously in the low to mid-twenties percentage range) at the mid-point of the guided revenue range. Adjusted gross margin will be in the low-forties percentage range (previously in the low to mid-forties percentage range). Investments are planned at around €2.8 (previously around 2.9 billion). Adjusted Free Cash Flow of about €1.6 billion (previously €1.8 billion) and reported Free Cash Flow of about €0 million (previously about €200 million) are now expected
– Outlook for Q3 FY 2024: Based on an assumed exchange rate of US$1.10 to the euro, revenue of around €3.8 billion expected. On this basis, the Segment Result Margin is forecast to be in the high-teens percentage range

Infineon Technologies AG is reporting results for the second quarter of the 2024 fiscal year (period ended 31 March 2024).

„In the prevailing difficult market environment, Infineon delivered a solid second quarter”, says Jochen Hanebeck, CEO of Infineon. “Many end markets have remained weak due to economic conditions, while customers and distributors have continued to reduce semiconductor inventory levels. Weak demand for consumer applications persists. There has also been a noticeable deceleration in growth in the automotive sector. We are therefore taking a cautious approach to the outlook for the rest of the fiscal year and are lowering our forecast. In the medium to long term, decarbonization and digitalization will continue to be strong structural drivers of our profitable growth. In order to realize the full potential of our Company, we will further strengthen our competitiveness. To this end, we are launching the company-wide “Step Up” program. We are aiming to achieve structural improvements in our Segment Result in the high triple-digit million euro range per year.”

Group performance in the second quarter of the 2024 fiscal year

In the second quarter of the 2024 fiscal year, Infineon generated Group revenue of €3,632 million. This was 2 percent down on revenue in the prior quarter of €3,702 million. In the Automotive (ATV) segment, revenue remained stable compared with the prior quarter, while in the Green Industrial Power (GIP) and Power & Sensor Systems (PSS) segments revenue was lower. The Connected Secure Systems (CSS) segment saw a slight increase in revenue from the first quarter of the 2024 fiscal year.

The gross margin achieved in the second quarter of the current fiscal year was 38.6 percent, compared with 43.2 percent in the prior quarter. The adjusted gross margin was 41.1 percent, compared with 44.9 percent in the first quarter of the fiscal year.

The Segment Result in the second quarter of the 2024 fiscal year was €707 million, compared with €831 million in the prior quarter. The Segment Result Margin achieved was 19.5 percent, compared with 22.4 percent in the first quarter.

The Non-Segment Result for the second quarter of the 2024 fiscal year was a net loss of €211 million, compared with a net loss of €129 million in the prior quarter. The second-quarter Non-Segment Result comprised €91 million relating to cost of goods sold, €18 million relating to research and development expenses and €54 million relating to selling, general and administrative expenses. In addition, it included net operating expenses of €48 million. This figure includes impairment losses of €37 million relating to the write-down of assets in connection with the planned sale of two backend manufacturing sites in Cheonan (South Korea) and Cavite (Philippines).

Operating profit for the second quarter of the 2024 fiscal year reached €496 million, compared with €702 million in the prior quarter.

The financial result in the second quarter of the current fiscal year was a net loss of €12 million, compared with a net gain of €25 million in the prior quarter. The financial result for the first quarter included interest income of €32 million arising on the release of a tax risk provision in conjunction with the acquisition of Cypress.

The tax expense in the second quarter of the 2024 fiscal year amounted to €93 million, compared with €134 million in the prior quarter.

Profit from continuing operations in the second quarter of the current fiscal year was €394 million, compared with €598 million in the first quarter. The result from discontinued operations was €0 million, after a loss of €11 million in the preceding quarter. The profit for the period achieved in the second quarter of the current fiscal year was €394 million. In the first quarter of the 2024 fiscal year, the profit for the period was €587 million.

Earnings per share from continuing operations decreased in the second quarter of the 2024 fiscal year to €0.30, from €0.45 in the prior quarter (basic and diluted in each case). Adjusted earnings per share1 (diluted) stood at €0.42 at the end of the second quarter of the current fiscal year, compared with €0.53 one quarter earlier.

Investments – which Infineon defines as the sum of investments in property, plant and equipment, investments in other intangible assets and capitalized development costs –totaled €643 million in the second quarter of the current fiscal year, compared with €653 million in the first quarter. Depreciation and amortization in the second quarter of the 2024 fiscal year amounted to €467 million, compared with €456 million in the preceding quarter.

Free Cash Flow2 improved in the second quarter of the current fiscal year to €82 million, compared with a negative figure of €1,597 million in the prior quarter. The figure for the first quarter of the 2024 fiscal year included purchase price payments of around €800 million relating to the acquisition of companies, mainly the acquisition of GaN Systems Inc. Annual bonus payments were also made in the first quarter of the 2024 fiscal year for the record 2023 fiscal year.

The gross cash position decreased from €2,712 million at the end of the first quarter of the 2024 fiscal year to €2,583 million at the end of the second quarter. In the course of the second quarter, the dividend of €456 million was paid and €233 million was utilized to buy back own shares related with the employee stock option plan. Set against this was the issue of a €500 million bond. Financial debt at 31 March 2024 stood at €5,941 million, compared with €5,398 million at 31 December 2023. The net cash position was therefore a negative amount of €3,358 million, compared with a negative amount of €2,686 million at the end of the first quarter.

Segment earnings for the second quarter of the 2024 fiscal year

ATV segment revenue remained stable in the second quarter of the 2024 fiscal year, totaling €2,078 million, compared with €2,085 million in the first quarter. Set against increasing revenues in electromobility was a slightly lower level of revenue from ADAS. Revenue from classical car components was unchanged. The Segment Result in the second quarter of the current fiscal year was €512 million, compared with €564 million in the first quarter of the 2024 fiscal year. The Segment Result Margin achieved was 24.6 percent, compared with 27.1 percent in the prior quarter.

In the second quarter of the 2024 fiscal year, GIP segment revenue decreased by 4 percent to €469 million, compared with €487 million in the first quarter. As a result of high direct customer and distributor inventory, demand in the areas of renewable energy and energy infrastructure was weaker. The Segment Result in the second quarter of the current fiscal year amounted to €89 million, compared with €130 million in the first quarter of the 2024 fiscal year. The Segment Result Margin was 19.0 percent, compared with 26.7 percent in the prior quarter.

PSS segment revenue decreased in the second quarter of the 2024 fiscal year by 7 percent to €713 million, compared with €765 million in the prior quarter. The reason for the decline in revenue was ongoing weak demand for components for PCs, notebooks, consumer electronics, battery-powered devices and microinverters for roof-top solar systems. Revenue from silicon microphones and components for smartphones continued to recover. The Segment Result achieved in the second quarter of the current fiscal year was €64 million, compared with €99 million in the first quarter. The Segment Result Margin was 9.0 percent, compared with 12.9 percent in the prior quarter.

CSS segment revenue increased slightly in the second quarter of the 2024 fiscal year to €371 million, up from €364 million in the first quarter. The growth in revenue of 2 percent was mainly the result of a higher level of sales relating to Wi-Fi. The Segment Result rose to €42 million, from €37 million in the prior quarter. The Segment Result Margin increased to 11.3 percent, from 10.2 percent in the first quarter.

Outlook for the 2024 fiscal year

Based on an assumed exchange rate of US$1.10 to the euro, revenue in the 2024 fiscal year is now expected to be around €15.1 billion plus or minus €400 million (previously €16 billion plus or minus €500 million). The adjustment of the forecast for the fiscal year is due to prolonged weak demand in major target markets as well as ongoing destocking at direct customers and distributors.

In the Automotive segment, revenue growth in the low to mid-single-digit percentage range is now expected. The decrease in revenue in the Green Industrial Power segment in comparison with the prior fiscal year is expected to be a low-teens percentage figure. The decline in revenue in Power & Sensor Systems is forecast to be in the high-teens and in the Connected Secure Systems segment in the low-twenties percentage range. With expected revenue in the 2024 fiscal year of €15.1 billion, the adjusted gross margin should be in the low-forties percentage range and the Segment Result Margin is expected to be around 20 percent. The Segment Result Margin for the Automotive segment is expected to be at the lower end of the aforementioned range of between 25 and 28 percent.

Investments – which Infineon defines as the sum of investments in property, plant and equipment, investments in other intangible assets and capitalized development costs – are now being slightly adjusted to a figure of about €2.8 billion (previously about 2.9 billion) for the 2024 fiscal year. The focus here will be investments in the manufacturing module at the Kulim site (Malaysia), which is designed to produce compound semiconductors, as well as the manufacturing module in Dresden (Germany), designed to produce analog/mixed-signal components.

Depreciation and amortization are anticipated to be around €1.9 billion in the 2024 fiscal year, of which around €400 million is attributable to amortization of purchase price allocations arising mainly from the acquisition of Cypress. Adjusted Free Cash Flow, which is adjusted for investment in large frontend buildings and the purchase of GaN Systems, is now expected to be about €1.6 billion (previously €1.8 billion), which is about 11 percent of the forecast revenue for the year of €15.1 billion. Reported Free Cash Flow should be around €0 million (previously €200 million). Return on Capital Employed (RoCE) is now forecast to reach around 9 percent. When the figures for Q1 FY 2024 were published, RoCE for the 2024 fiscal year was expected to be around 11 percent.

Outlook for the third quarter of the 2024 fiscal year

Based on an assumed exchange rate of US$1.10 to the euro, Infineon expects to generate revenue of around €3.8 billion in the third quarter of the 2024 fiscal year. Revenue in the ATV and CSS segments should grow in-line with group average quarter-on-quarter. Quarter-on-quarter growth rate for the GIP segment is expected to be belowand for PSS beyond group average. Based on this revenue forecast for the Group, the Segment Result Margin should be in the high-teens percentage range.

Structural improvement program “Step Up” to strengthen competitiveness

The Company wants to further strengthen its competitiveness. To this end, Infineon is starting the “Step Up” program focusing on a targeted, sustainable improvement of its cost structure. The program includes various packages of measures focusing on the areas of manufacturing productivity, portfolio management, pricing quality and operating cost optimization without compromising the Company’s innovative strength.

The program is expected to have a positive effect on the Segment Result in the high triple-digit million euro range per year (based on the 2023 fiscal year). The first financial benefits are expected in the course of the 2025 fiscal year. The full effect is expected to show in the first half of the 2027 fiscal year.

Telephone press conference and analyst telephone conference

The Management Board of Infineon will host a telephone press conference with the media at 8:00 am (CEST), 2:00 am (EDT). It can be followed over the Internet in both English and German. In addition a telephone conference call including a webcast for analysts and investors (in English only) will take place at 9:30 am (CEST), 3:30 am (EDT). During both calls, the Infineon Management Board will present the Company’s results for the second quarter of the 2024 fiscal year as well as the outlook for the third quarter and the 2024 fiscal year. The conferences will also be available live and for download on Infineon’s website at www.infineon.com/investor

The Q2 Investor Presentation is available (in English only) at:
https://www.infineon.com/cms/en/about-infineon/investor/reports-and-presentations/

FINANCIAL INFORMATION According to IFRS – Unaudited

The following financial data relates to the second quarter of the 2024 fiscal year ended 31 March 2024 and the corresponding prior quarter and prior year period.

Revenues, Results and Margins of the Segments

Segment Result is defined as operating profit excluding certain net impairments and reversal of impairments, the impact on earnings of restructuring and closures, share-based payment, acquisition-related depreciation/amortization and other expense, impact on earnings of sales of businesses or interests in subsidiaries, and other income (expense).

Reconciliation of Segment Result to operating profit

Reconciliation to adjusted earnings and adjusted earnings per share – diluted

Earnings per share in accordance with IFRS are influenced by amounts relating to purchase price allocations for acquisitions (in particular Cypress), as well as by other exceptional items. To enable better comparability of operating performance over time, Infineon computes adjusted earnings per share (diluted) as follows:

Adjusted profit (loss) for the period and adjusted earnings per share (diluted) should not be seen as a replacement or superior performance indicator, but rather as additional information to the profit (loss) for the period and earnings per share (diluted) determined in accordance with IFRS.

Reconciliation to adjusted cost of goods sold and gross margin

The cost of goods sold and the gross margin in accordance with IFRS are influenced by amounts relating to purchase price allocations for acquisitions (in particular Cypress) as well as by other exceptional items. To enable better comparability of operating performance over time, Infineon computes the adjusted gross margin as follows:

Adjusted cost of goods sold and the adjusted gross margin should not be seen as a replacement or superior performance indicator, but rather as additional information to cost of goods sold and the gross margin determined in accordance with IFRS.

Number of employees

Consolidated Statement of Financial Position

Consolidated Statement of Cash Flows Gross and Net Cash Position

The following table shows the gross cash position and the net cash position. Since some liquid funds are held in the form of financial investments which for IFRS purposes are not classified as cash and cash equivalents, Infineon reports on its gross and net cash positions in order to provide investors with a better understanding of its overall liquidity situation. The gross and net cash positions are determined as follows from the Consolidated Statement of Financial Position:

Free Cash Flow

Infineon reports the Free Cash Flow figure, defined as cash flows from operating activities and cash flows from investing activities, both from continuing operations, after adjusting for cash flows from the purchase and sale of financial investments. Free Cash Flow serves as an additional performance indicator, since Infineon holds part of its liquidity in the form of financial investments. This does not mean that the Free Cash Flow calculated in this way is available to cover other disbursements, as dividends, debt-servicing obligations and other fixed disbursements have not been deducted. Free Cash Flow should not be seen as a replacement or as a superior performance indicator, but rather as a useful item of information in addition to the disclosure of the cash flow reported in the Consolidated Statement of Cash Flows, and as a supplementary disclosure to other liquidity performance indicators and other performance indicators determined in accordance with IFRS. Free Cash Flow is derived as follows from the Consolidated Statement of Cash Flows:

Condensed Consolidated Statement of Cash Flows D I S C L A I M E R

This press release contains forward-looking statements about the business, financial condition and earnings performance of the Infineon Group.

These statements are based on assumptions and projections resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may therefore differ materially from what has been expected. Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements.

Due to rounding, numbers presented throughout this press release and other reports may not add up precisely to the totals provided and percentages may not precisely reflect the absolute figures.

All figures mentioned in this press release are unaudited.

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With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip. It provides a fully integrated embedded system for monitoring and managing automotive 12 V lead-acid batteries, which is critical for the 12 V power supply of vehicles’ electrical systems. The new microcontroller is ISO26262 compliant, enabling compact and safe intelligent battery sensing and battery management in modern vehicles.

The PSoC 4 HVPA-144K’s dual high-resolution sigma-delta ADCs, together with four digital filtering channels, enable accurate measurement of the battery’s state-of-charge (SoC) and state-of-health (SoH) by measuring key parameters such as voltage, current, and temperature with an accuracy of up to ±0.1 percent. The device features two programmable gain amplifiers (PGAs) with automatic gain control, allowing fully autonomous control of the analog front end without software intervention. The use of shunt-based current sensing for batteries provides a higher accuracy than conventional Hall sensors.

An integrated 12 V LDO (42 V tolerant) allows the device to be supplied directly from the 12 V lead-acid battery without the need for an external power supply. An integrated transceiver allows direct communication with the LIN bus. The product meets the functional safety requirements of ASIL-C according to ISO26262.

The Arm® Cortex®-M0+ MCU on which the PSoC 4 HVPA-144K is based operates at up to 48 MHz with up to 128 KB of code flash, 8 KB of data flash and 8 KB of SRAM, all with ECC. The PSoC 4 HVPA-144K also includes digital peripherals such as four timers/counters/PWMs and a serial communication block that can be configured as an I2C/SPI/UART.

The PSoC 4 HVPA-144K is supported by automotive-quality software. Infineon’s Automotive Peripheral Driver Library (AutoPDL) and Safety Library (SafeTlib) are developed according to the standard automotive software development process. They are both A-SPICE compliant, following the MISRA 2012 AMD1 and CERT C, and ISO26262 compliant.

With the introduction of the PSoC 4 HVPA-144K, Infineon is laying the foundation to expand its PSoC microcontroller portfolio to include Li-ion battery management systems for EVs. The portfolio will soon include several products for monitoring and managing high voltage (400 V and above) and low voltage (12 V/48 V) batteries, further facilitating future EV adoption.

Availability

The PSoC 4 HVPA-144K is now available in a compact 32-QFN (6×6 mm²) package with up to 9 GPIOs. For an easy start of development, an evaluation board is also available. Further information can be found at www.infineon.com/psochvpa144k.

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With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip. It provides a fully integrated embedded system for monitoring and managing automotive 12 V lead-acid batteries, which is critical for the 12 V power supply of vehicles’ electrical systems. The new microcontroller is ISO26262 compliant, enabling compact and safe intelligent battery sensing and battery management in modern vehicles.

The PSoC 4 HVPA-144K’s dual high-resolution sigma-delta ADCs, together with four digital filtering channels, enable accurate measurement of the battery’s state-of-charge (SoC) and state-of-health (SoH) by measuring key parameters such as voltage, current, and temperature with an accuracy of up to ±0.1 percent. The device features two programmable gain amplifiers (PGAs) with automatic gain control, allowing fully autonomous control of the analog front end without software intervention. The use of shunt-based current sensing for batteries provides a higher accuracy than conventional Hall sensors.

An integrated 12 V LDO (42 V tolerant) allows the device to be supplied directly from the 12 V lead-acid battery without the need for an external power supply. An integrated transceiver allows direct communication with the LIN bus. The product meets the functional safety requirements of ASIL-C according to ISO26262.

The Arm® Cortex®-M0+ MCU on which the PSoC 4 HVPA-144K is based operates at up to 48 MHz with up to 128 KB of code flash, 8 KB of data flash and 8 KB of SRAM, all with ECC. The PSoC 4 HVPA-144K also includes digital peripherals such as four timers/counters/PWMs and a serial communication block that can be configured as an I2C/SPI/UART.

The PSoC 4 HVPA-144K is supported by automotive-quality software. Infineon’s Automotive Peripheral Driver Library (AutoPDL) and Safety Library (SafeTlib) are developed according to the standard automotive software development process. They are both A-SPICE compliant, following the MISRA 2012 AMD1 and CERT C, and ISO26262 compliant.

With the introduction of the PSoC 4 HVPA-144K, Infineon is laying the foundation to expand its PSoC microcontroller portfolio to include Li-ion battery management systems for EVs. The portfolio will soon include several products for monitoring and managing high voltage (400 V and above) and low voltage (12 V/48 V) batteries, further facilitating future EV adoption.

Availability

The PSoC 4 HVPA-144K is now available in a compact 32-QFN (6×6 mm²) package with up to 9 GPIOs. For an easy start of development, an evaluation board is also available. Further information can be found at www.infineon.com/psochvpa144k.

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By: Nijas Kunju, Technical Manager in Application Engineering, ANSYS Inc

India’s robust investment in the aviation sector, exemplified by the substantial budgetary allocation of $72 billion for defense aviation in 2023, with $20 billion of domestic earmarking, points to an era of growth and innovation for the sector. This strategic investment has catalyzed the emergence of a vibrant private sector engagement in the development of cutting-edge drones, UAVs, and HAPS (high-altitude platform systems), complementing the government’s initiatives on 5th and 6th-generation fighter aircraft.

This transformative landscape includes initiatives such as the Indian Defense Offset and Make in India programs, fostering an environment conducive to heightened global participation in India’s Aerospace and Defense sector. Leading Aerospace and Defense OEMs, recognizing the imperative of technological advancement to maintain competitiveness, are steadfastly embracing modern innovations to elevate their product offerings.

With burgeoning market demands and a compelling investment climate, stakeholders increasingly advocate for expedited time-to-market for advanced stealth vehicles. Achieving this goal necessitates a paradigm shift towards minimizing prototype iterations and striving for “first-time-right” design success. Herein lies the pivotal role of Digital Engineering solutions, seamlessly integrating data management, Model-based System Engineering, and multidisciplinary analysis and optimization through physics-based simulations. Embracing these cutting-edge methodologies expedites product development and ensures enhanced agility and precision, propelling the Aerospace and Defense industry into unparalleled innovation and efficiency.

Prevailing challenges

Developing defense technologies involves strict requirements and limitations. In military aircraft, achieving stealth capability is crucial to evade detection by radar and other detection methods. This involves shaping the aircraft to minimize its visibility on radar and reducing its visual, acoustic, and infrared signatures. However, creating a stealthy design has drawbacks, including compromises in aerodynamic performance, longer development times, reduced fuel capacity, higher maintenance needs, and higher costs.

Among the various stealth technologies, radar avoidance is critical because radar can detect aircraft from long distances, regardless of weather or time of day. Therefore, reducing the aircraft’s radar cross-section (RCS) is a primary focus. Several methods exist, such as smoothing sharp edges, changing the aircraft’s shape (which can affect aerodynamics), using radar-absorbing materials (which can pose challenges at high speeds and specific frequencies), and employing active RCS cancellation techniques.

Advanced electromagnetic simulations, such as Finite Element Method (FEM), Finite Difference Time Domain (FDTD), Integral Equation (IE), physical optics (PO), and Signature-based Reduction (SBR), are used to virtually implement and accurately predict the RCS of aircraft structures (Figure 1-2).

Figure 1: shows the RCS of a corner reflector measured (red dotted) against HFSS IE and SBR+ solver

Navigating the complexities of identifying areas on aircraft or vehicles that contribute to high RCS poses a significant challenge for designers. Implementing effective mitigation strategies, such as employing radar-absorbing paints and structures, realizes pinpoint accuracy in identifying these problematic regions. Leveraging advanced 2D and 3D ISAR imaging techniques provides invaluable insights into these critical areas. Figure 3 vividly illustrates that the RCS spikes dramatically when electromagnetic energy aligns with an incident wave direction of approximately +/-98 degrees. The ISAR image comprehensively depicts these high-return regions, empowering designers to select and apply optimal RCS reduction methods strategically.

Figure 2: Graphs shows measured Vs HFSS Simulated RCS value (Source: the University of Texas Austin CEM Benchmarks)

 

Figure 3 Cessna aircraft (RCS), ISAR image, Project of RCS Hotspot area on aircraft

Transforming the defense landscape through stealth technology

Our airborne devices are protected by stealth technology, but the need for advanced radar systems to identify and classify targets remains just as important. Different types of radar are used to identify targets: bistatic, monostatic, etc. More recently, there has been an increase in the use of low-flying unmanned aerial vehicles (UAVs) and drones for defense applications. Distinguishing them from birds or other civilian objects requires high-resolution radar with a sophisticated signal processing system that can extract specific features of the target movement. AI/ML methods for classification are also being used, such as ISAR imaging, micro-Dopple effects, etc. However, these AI/ML methods require a large set of training data for each target type, such as drones, birds, UAVs, etc. For example, you need training data from different radar perspectives while in flight to identify a drone. One also needs different radars with different operating frequencies and bandwidths to capture the full spectrum of the target signatures. However, this diversity in radar systems makes it challenging to acquire comprehensive training data.

Advanced simulations can produce synthetic data mirroring real-world object behavior through numerical computation techniques. This facilitates the virtual recreation of electromagnetic properties at target frequencies and radar antennas, resulting in simulated radar raw IQ data. Users can use this raw data directly or apply their signal-processing algorithms to the simulated data. The processed data then serves as input for training AI/ML models [Figure 4]. The accompanying image depicts the detection of a drone using a 40GHz radar with a range resolution of 0.1 meters (achieved through a bandwidth of 1499 MHz). The Range-Doppler image illustrates the Doppler shift produced by rotating the drone’s front and back blades. Since rotating blades have components moving towards and away from the radar, they generate positive and negative Doppler velocity spreads in the spectrum.

Figure 4: Micro Doppler generation from the Drone, with and without Rotar blade rotation.

Observing a target over an extended duration (approximately 100-200ms) and analyzing its micro-Doppler signature can extract additional details such as rotor blade speed. This process assumes the target has already been identified using AI/ML techniques applied to the Range-Doppler image [Figure 5].

Figure 5: Spectrogram of Micro-doppler Signature from Quadcopter Drone.

To summarize, many challenges will continue to permeate, pushing the boundaries of innovation in this ever-evolving landscape of advanced stealth and radar technology. Yet, within these challenges lie unparalleled opportunities to redefine the capabilities of modern defense systems and the future of warfare. As we strive to overcome obstacles such as detection evasion and signal manipulation, we are compelled to harness the full potential of emerging technologies and interdisciplinary collaboration. To fulfill the market demand today, digital missions and high-fidelity behavioral models, virtual twins are the way of the future. Organizations such as Ansys are collaborating closely to expedite the development of products, aiming to bring this vision to reality. We will only unlock new frontiers in stealth and radar technology through perseverance, ingenuity, and technological innovations, paving the way for enhanced security and strategic advantage for India in an increasingly dynamic world.

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Enables longer battery runtime in wearables, trackers, and activity monitoring

The LSM6DSV32X 6-axis inertial module (IMU) from STMicroelectronics has a large accelerometer full-scale range of 32g and 4000 degrees-per-second (dps) gyroscope to measure intensive movements and impacts, including freefall height estimation. Ready to drive future generations of edge-AI applications, the new sensor device enables extra features and longer battery runtime in consumer wearables, asset trackers, and impact and fall alarms for workers.

The LSM6DSV32X extends the family of smart sensors that contain ST’s machine-learning core (MLC) with AI algorithms based on decision trees. With the MLC for context sensing and a finite state machine (FSM) for motion tracking, these sensors let product developers add new features, minimize latency, and save power. Leveraging the embedded features LSM6DSV32X slashes the power budget for functions such as gym-activity recognition to below 6µA. The LSM6DSV32X also embeds ST’s Sensor Fusion Low-Power (SFLP) algorithm to perform 3D orientation tracking at just 30µA. And by supporting adaptive self-configuration (ASC), the module autonomously reconfigures sensor settings in real-time to continuously optimize performance and power.

In addition to the accelerometer and gyroscope, the LSM6DSV32X integrates ST’s Qvar electrostatic charge-variation sensing to handle advanced user-interface functions such as touching, swiping, and tapping. The module also contains an analog hub for acquisition and processing of external analog signals.

Product developers can rely on a large selection of ready-to-use libraries and tools to accelerate the time to market for new products. These include the intuitive MEMS Studio environment, which supports evaluation and use-case development, and a dedicated GitHub repository that provides code examples such as sports activity and head-gesture recognition. Resources also include hardware adapters for connecting the IMU to ST’s evaluation and proof-of-concept boards such as the ProfiMEMS board, Nucleo sensor expansion board, and Sensortile.box PRO.

The LSM6DSV32X is scheduled to enter volume production in May 2024 in a 2.5mm x 3mm x 0.83mm 14-lead LGA package. Sample requests and pricing information are available from local ST sales offices. Pricing starts from $2.98 for orders of 1000 pieces.

Please visit https://www.st.com/lsm6dsv32x for more information.

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TETRA or P25 legacy narrowband technologies no longer meet the connectivity needs of today’s first responders. As mission-critical network requirements grow, broadband connectivity is the answer. Proper device and mobile network testing eases the migration to 3GPP-compliant broadband mission-critical services (MCX). At Critical Communications World 2024 (CCW 2024) in Dubai, Rohde & Schwarz will demonstrate its integrated solutions that enable reliable operation of mission-critical devices, networks and services. Solutions that enhance situational awareness for law enforcement and protection round out the exhibited portfolio.

When lives are at stake, reliable communications are vital to emergency services. While voice applications are still the top priority for first responders, data and video-based mission-critical applications are becoming increasingly important in crisis situations and for efficient day-to-day operations. Public safety and government agencies around the world are migrating their various communications networks from narrowband land mobile radio (LMR) like TETRA or P25 to broadband networks that meet this new need not only for voice but also for high-speed data services.

This migration to either 3GPP-compliant isolated secure networks or commercial 4G/5G-based cellular networks with embedded mission-critical capabilities must be planned and executed very carefully in order to maintain existing narrowband capabilities. Narrowband networks will still be in use in parallel for another decade, providing features such as push-to-talk (PTT) to their users. The 3GPP-defined internal architecture for MCX services includes amongst others user/group management, policy and charging enforcement, signaling control, and cross-network interworking. Applying appropriate and advanced test and measurement techniques during this ongoing migration process is essential to ensure reliable operation of critical communications for first responders and to save lives in crisis scenarios.

As an established partner of the critical communications ecosystem, Rohde & Schwarz is showcasing its comprehensive range of test solutions for MCX at Critical Communications World 2024, taking place from May 14 to 16 at the Dubai World Trade Centre in Dubai, UAE. At booth M20, visitors can learn from Rohde & Schwarz experts about the full range of test solutions, extending from R&D and conformance testing of end devices to network testing including MCX application verification. Solutions for spectrum monitoring and network protection complete the exhibited portfolio, all aimed at ensuring the reliable operation of mission-critical networks and services.

Device R&D and conformance testing

Rohde & Schwarz is bringing its extensive expertise in 3GPP conformance testing to the world of critical communications, demonstrating at CCW 2024 for the first time its industry-leading 3GPP MCX device conformance test suite on the R&S CMX500 4G/5G one-box tester. The test suite includes comprehensive 3GPP RF, functional, protocol and application tests for rugged MCX devices. In addition, the R&S CMA180 radio test set for testing PMR (public mobile radio) and LMR (land mobile radio) devices will be on display, highlighting the company’s cutting-edge solutions for device R&D and conformance validation for MCX device manufacturers.

Network testing

As an expert in mobile network testing, Rohde & Schwarz will also present its know-how in active and passive mobile network testing methods and solutions that cover the entire MCX network lifecycle, from coverage and interference measurements to specific MCX service testing like MCPTT and MCVideo quality. Visitors will be able to experience a unique MCX smartphone-based test solution implemented on the QualiPoc. This solution can be used in any MCX environment to assess the performance of MCX private and group calls, including measurement of 3GPP-specified MCX KPIs. Another test solution based on the R&S ROMES4 drive test software and the R&S TSMA6B mobile network scanner provides a universal tool for network engineering and optimization.

Spectrum monitoring and analysis

The Rohde & Schwarz portfolio also includes efficient solutions for stationary, transportable and portable spectrum monitoring systems that provide comprehensive spectrum awareness. At CCW 2024, Rohde & Schwarz will be exhibiting the R&S PR200, a tried-and-tested portable monitoring receiver for interference hunting in and around specific areas and facilities. It is an indispensable tool for regulatory authorities, mobile network operators, police forces, military units and other security organizations.

Cellular network analysis

R&S NESTOR is a turnkey mobile communications solution for situational awareness, law enforcement and protection of critical infrastructure. It is a software platform used in conjunction with R&S TSMA6B mobile network scanners and QualiPoc smartphones to analyze cellular networks via the air interface. Public authorities and security organizations, for example, use it to detect, identify, locate and analyze deployed cellular technologies and occupied bands and channels.

Rohde & Schwarz will present its comprehensive portfolio of solutions for mission-critical communications at Critical Communications World 2024 at the Dubai World Trade Centre from May 14 to 16, 2024, at booth M20. In addition, Rohde & Schwarz experts will share their insights at the Focus Forum on testing and certification of broadband devices on May 15, 2024 from 11:30 a.m. to 1:00 p.m.

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In the third blog of this four-part series, we will explore the range of personal micromobility solutions available within the consumer market, the technical challenges they face, and how technology can resolve these issues.

1. Introduction
2. Urban Infrastructure and Micromobility
3. Personal Transportation and Consumer Challenges
4. How Technology Will Shape the Future

Personal Micromobility Solutions

Personal micromobility solutions come in a wide variety of shapes and sizes, from e-bikes and e-scooters to electric skateboards and hoverboards. For some, they are a form of transportation used as an alternative to walking or driving; for others, they are a form of exercise equipment.

E-bikes are one of the more prominent micromobility solutions; analysts Precedence Research expect the e-bike market to grow at a compound annual growth rate (CAGR) of 9.89 percent from 2023 to 2032, achieving a market value of $44.08 billion.[1]

Whereas early e-bikes were essentially bicycles with heavy bolt-on batteries and hub motors, modern e-bikes are significantly lighter and are designed from the ground up to accommodate electric drive systems and batteries. Wiring is now carefully passed through the frame’s tubing to avoid damage. For midrange and above models, mid-drive motor units are located between the pedals to optimize the drivetrain’s efficiency and weight distribution (Figure 1).

Figure 1: Modern urban e-bikes feature mid-drive motors and integrated batteries. (Source: stockphoto-graf/stock.adobe.com) Beyond e-bikes

In addition to e-bikes, there is a wide array of micromobility alternatives, such as hoverboards, Segways, electric skateboards, and e-scooters. Although ownership of these is legal, their usage in the UK and most of the EU is restricted to private land due to the prohibition of their presence in public spaces, such as footpaths, roads, and cycle lanes.

In terms of electronic design, these products are similar to e-bikes, with a motor, control interface, and battery pack. The distinction between them and e-bikes lies in the control of their movement, as they rely exclusively on an electric powertrain operated through a throttle or, in the case of hoverboards and Segways, a gyroscopic sensor that the user can manipulate to regulate the speed.

Challenges of Personal Micromobility

While personal micromobility solutions have seen incredible growth in recent decades—a trend set to continue—barriers are impacting the market. While regulatory issues need to be addressed, there are still technical challenges faced by existing personal micromobility solutions that must be resolved.

Battery Fires

Perhaps the most prevalent issue is battery fire due to the failure of individual cells or the battery management system (BMS). The London Fire Brigade reported 116 fires in 2022 caused by e-bike and e-scooter batteries, with occurrences becoming more frequent. At the start of 2023, emergency calls specifically regarding e-bike and e-scooter battery fires averaged as every other day.[2] Transport for London (TfL) has banned electric scooters, hoverboards, and skateboards from its services since 2021 due to a rise in fires.

Within modern micromobility batteries are an array of lithium-ion (Li-ion) 18650 cells linked together to provide the necessary charge capacity and voltage (usually 36V, 48V, or 52V). The electrolytes used within Li-ion cells are lithium salts. While lithium salts are ideal for this application, they are also volatile and flammable; as a result, lithium cells are extremely sensitive to temperature changes and can experience thermal runaway.

When a cell is compromised, either through damage, manufacturing defects, external heat, or over-charging/discharging, its temperature increases rapidly until it catches fire or explodes, igniting the rest of the battery pack and creating a runaway event. Furthermore, because the cathodes in Li-ion batteries contain oxygen, any fire is self-fueling and extremely hard to extinguish.

Maintaining Safety

While micromobility fires are far too common, they are almost completely restricted to devices at the lower end of the market, with mid- and premium-tier manufacturers having few to no cases of fires.

Designing Safe Batteries

To save costs, lower-end batteries often use a simple BMS designed only to balance the cells charging and discharging, with a fuse on the charging line and power outlet.

In comparison, higher-end models implement much more sophisticated safety measures, like those recommended by Littelfuse, which provides a wide range of solutions designed for e-bikes and other micromobility designs (Figure 2).

Figure 2: Littelfuse e-bike battery pack block diagram. (Source: Mouser Electronics)

Negative temperature coefficient (NTC) thermistors are recommended within its battery block diagram, such as the Littelfuse KC Series, which can be used to monitor the temperature of cells independently, allowing for microcontrollers to act before thermal runaway can occur.

These are used alongside battery-level overcurrent and overvoltage protection devices, including the compact surface mount 0805L Series polymeric positive temperature coefficient device (PPTC), while Littelfuse ITV Battery Protectors allow for additional protection (Figure 3).

Figure 3: Littelfuse ITV battery protectors. (Source: Mouser Electronics)

Sitting between the combined cells output and the BMS unit, the ITV battery protectors are a fast-responding and cost-effective surface-mount solution designed to cut the circuit when an IC or field-effect transistor (FET) detects an overvoltage.

Conclusion

Micromobility fires present a considerable risk to consumers and dent confidence in the market. To guarantee the safety of Li-ion batteries, designers must include multiple safety measures throughout the battery, targeting voltage, current, and temperature at both the battery pack and cell level. In addition, rigorous third-party testing and complying with local regulations help ensure designs are less likely to fail, and if they do, they fail in a safe manner, preventing thermal runaway.

In the final blog of this series, we will explore the future of micromobility.

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Along with Microchip’s Mi-V ecosystem, new device family helps system designers to lower power, size and weight and speed time to market

Developers of spacecraft electronics utilize radiation-tolerant (RT) field programmable gate arrays (FPGAs) to ensure high performance, reliability, power-efficiency and the best-in-class security for emerging space domain threats. To take it a step further and help provide fast, cost-effective software customization, Microchip Technology (Nasdaq: MCHP) has introduced the RT PolarFire® system-on-chip (SoC) FPGA. Developed on Microchip’s RT PolarFire FPGA, it is the first real-time Linux® capable, RISC-V-based microprocessor subsystem on a flight-proven RT PolarFire FPGA fabric.

With today’s announcement, developers can now start designing using the commercially available PolarFire SoC (MPFS460) device and Libero® SoC development tools. Along with Microchip’s extensive Mi-V ecosystem, PolarFire SoC solution stacks, the PolarFire SoC Icicle Kit or the PolarFire SoC Smart Embedded Vision Kit, developing lower power solutions for the challenging thermal environments seen in space can happen today.

Safety-critical systems, control systems, space and security applications need the flexibility of the Linux Operating System (OS) and the determinism of real-time systems to control hardware. RT PolarFire SoC FPGAs feature a multi-core Linux-capable processor that is coherent with the memory subsystem. The RT PolarFire SoC enables central satellite processing capabilities similar to those in single board computers which are common in the space industry for command and data handling, in platform avionics and in payload control. The SoC allows for flexible implementation of highly integrated designs, customization and evolution of function while improving size, weight and power considerations.

Systems deployed in space are subjected to harsh radiation, prompting design methodologies that can provide protection for the most critical radiation-induced upset types. Unlike SRAM FPGAs, the RT PolarFire SoC is designed for zero configuration memory upsets in radiation, eliminating the need for an external scrubber and reducing the total system cost. Satellites are designed to deliver both peak and average power and to dissipate heat through conductive paths, namely metal. Starting with a SoC FPGA that can reduce your power consumption by up to 50 percent simplifies the entire satellite design, allowing designers to focus on the mission at hand.

“By delivering the design ecosystem for the industry’s first RISC-V-based radiation-tolerant SoC FPGA, Microchip is driving innovation and giving designers the ability to develop a whole new class of power-efficient applications for space.” said Bruce Weyer, corporate vice president for Microchip’s FPGA business unit. “This will also allow our clients to add enhanced edge compute capabilities to aerospace and defense systems.”

Microchip’s comprehensive Mi-V ecosystem helps designers slash time to market by providing support for symmetric multiprocessing (SMP) rich operating systems like Linux, VxWorks®, PIKE OS and more real time operating systems like RTEMS and Zephyr®. Mi-V is a comprehensive suite of tools and design resources, developed with numerous third parties, to support RISC-V designs. The Mi-V ecosystem aims to increase adoption of the RISC-V instruction set architecture (ISA) and support Microchip’s SoC FPGA portfolio.

The RT PolarFire FPGA has already received the Qualified Manufacturers List (QML) Class Q designation based on specific performance and quality requirements as governed by the Defense Logistics Agency. There is also a clear path for this device to achieve QML Class V qualification, the highest qualification standard for space microelectronics.

For more than 60 years, Microchip’s solutions have powered space flight missions. Building on a history of providing reliable, low-power SONOS-, Flash- and antifuse-based FPGAs in the industry, the company works to help streamline the design of high-speed communications payloads, high-resolution sensors and instruments and flight-critical systems for Low Earth Orbit (LEO), deep space or anything in between. To learn more, visit Microchip’s radiation-tolerant FPGA page.

Availability of Development Tools

Customers can start designs now with the development tools and boards provided for the commercial equivalent PolarFire SoC. For more information, visit the PolarFire SoC page.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image:

https://www.flickr.com/photos/microchiptechnology/53640600685/sizes/l/

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Real-time application awareness from next-gen DPI engine R&S®PACE 2 to power traffic aggregation and optimization algorithms in XipLink’s multi-path hybrid networking solution

ipoque, a Rohde & Schwarz company and a leading provider of next-gen deep packet inspection (DPI) software for networking and cybersecurity solution providers, today announced that it is partnering with XipLink, a leading global technology provider of optimized, secure and intelligent multi-path hybrid networking. The technology partnership sees the creation of the XipLink Application Classification Engine (XipACE) by integrating ipoque’s cutting-edge DPI technology R&S®PACE 2 into the XipLink operating system (XipOS), delivering advanced application visibility for multi-orbit networking.

Layer 7 visibility for multi-orbit networking

Leveraging standards-based SCPS protocol acceleration, link bonding, Layer 2 switching and Layer 3 routing, XipLink delivers intelligent multi-orbit networking that ensures network performance and QoS across satellite, cellular and wireless networks. Embedding the next-gen DPI software R&S®PACE 2 introduces traffic visibility up to Layer 7 and beyond, powering the traffic aggregation and optimization algorithms used by XipLink. “Instantaneous identification of protocols and applications enables intelligent and contextual routing policies that are aligned to the criticality of the underlying applications and prevailing network conditions,” said Dr. Martin Mieth, VP Engineering at ipoque. Prior to R&S®PACE 2, XipLink relied on its built-in classification engine that supported network traffic visibility only up to Layer 4.

R&S®PACE 2 combines behavioral, statistical and heuristic analysis with metadata extraction to accurately and reliably identify protocols, applications and application attributes in real time. “Our breakthrough AI-based encrypted traffic intelligence, which includes machine learning and deep learning techniques, and high-dimensional data analysis, brings traffic awareness to the next level by identifying any type of IP traffic, despite encryption, obfuscation and anonymization,” said Dr. Mieth.

“We are thrilled to announce our partnership with ipoque to integrate their cutting-edge DPI software, R&S®PACE 2, into our XipOS product. The inclusion of R&S®PACE 2 underscores our dedication to delivering top-tier solutions to our customers who require enterprise-grade quality and efficiency,” said Jack Waters, CEO, XipLink. “Application-aware networking plays a crucial role in optimizing network resources, enabling us to meet the escalating demands while ensuring compliance with SLAs,” added Waters.

Delivering high-performance networks

By tapping into R&S®PACE 2’s high throughput and light-weight, efficient software form-factor, XipACE is able to augment the performance of its core functions, which include QoS management, traffic analytics, steering decisions, load balancing and dynamic link bonding. Apart from performance and scalability, XipLink’s selection of ipoque’s R&S®PACE 2 is also driven by the engine’s extensive feature and plug-in set, such as first packet classification, customizability of app signatures or tethering detection. “ipoque provides us with a proven technology that has been tested in challenging network environments. Its weekly updated signature library ensures that we keep tabs on the latest traffic trends.” said Jaco Botha, SVP Product at XipLink.

Driving the responsiveness and resilience of multi-orbit networks

From offloading traffic from congested pathways to tapping into GEO satellites to alleviate latency issues, insights from R&S®PACE 2 enable XipOS to support network diversity and resilience. At the policy level, it enables application prioritization and SLA compliance. With a growing number of applications that are bandwidth-hungry and latency-sensitive, R&S®PACE 2’s granular traffic analytics help operators to optimize their networks continuously and improve resource efficiency. The insights also pave the way for autonomous and self-healing networks via data-driven decision making. DPI analytics also support hybrid aggregation of GEO and NGSO, enabling XipOS to improve network scalability and security. “The partnership strengthens our position as the most efficient link aggregation and optimization solution in the market, especially in addressing networks that comprise constrained wireless links such as LEO services,” added Sasmith Reddi, SVP Marketing at XipLink.

The new partnership will boost XipLink’s multi-orbit networking portfolio, benefiting customers in various verticals including mobile, satellite, maritime, government and defense, as well as modem OEMs.

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Sushil Motwani, Founder, of Ayetexcel Pvt. Ltd. writes about the environmental impact of electronic waste and how smart projectors can help mitigate it 

Sushil Motwani, Founder, Ayetexcel Pvt. Ltd.

The post Can home entertainment become more eco-friendly? appeared first on ELE Times.

Lithium-ion batteries are a crucial enabler in the ongoing global quest to electrify the transportation sector. While lithium-ion batteries are not the only solution for mobile energy (hydrogen-based fuel cells are also highly promising for certain applications) they appear certain to play a key role in vehicle electrification for years to come. Compared to other chemical batteries such as nickel-metal hydride (NiMH), lithium-ion batteries offer 50%+ greater capacity by weight.

To Download the Whitepaper Please Fill in the Form. >>>>

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Author: STMicroelectronics 

STM32CubeMX 6.11 is a new milestone as it allows developers to use the unique features of the new STM32H7R and STM32H7S. The software also continues to simplify development on STM32 by offering popular USB middleware previously bound to an OS. Similarly, it is the first version of CMake, which will significantly optimize workflows. STM32CubeMX thus continues to stand as the reference application for STM32 developers thanks to its UI that removes complexity and increases the accessibility of the STM32 ecosystem. Furthermore, the new version inaugurates support for the NUCLEO-U031R8, NUCLEO-U083RC, NUCLEO-H7S3L8, NUCLEO-H533RE.

What’s new in STM32CubeMX 6.11 Support for the STM32H7R and STM32H7S

STM32CubeMX 6.11 is a crucial update for the new STM32H7R and the STM32H7S MCUs because the software helps take advantage of their memory capabilities. Indeed, the devices have a smaller flash, which makes them the most cost-effective STM32H7. Since the device targets applications that must use external storage, the new memory can help significantly lower the bill of materials. Additionally, to make the embedded flash even more meaningful, ST introduced the boot flash, which stores the entire boot sequence, thus replacing the ROM we see on MCUs. Consequently, the embedded storage becomes even more flexible and practical since it isn’t only used for application, but boot, and initialization as well.

To make the boot flash more accessible, we are exposing the feature on STM32CubeMX. Put simply, the GUI will help developers configure the embedded flash to take advantage of its boot capabilities. Similarly, since the STM32H7R and STM32H7S will be used in systems with external memory, STM32CubeMX can set up an external loader so applications like STM32CubeProgrammer can program those discrete flash modules directly. It will also help developers load the main application in the embedded memory and the rest of the system in the external one.

Support for USBX middleware

The new version of STM32CubeMX adds support for the USBX middleware in a bare metal environment. USBX is a software stack that enables the use of a USB host or device. Until now, developers who wanted to use it had to install ThreadX RTOS. The problem is that if teams wanted to do away with the operating system to optimize their system, they couldn’t use USBX. Thanks to STM32CubeMX, it is now easier to include the right middleware into projects.

Make project generation

STM32CubeMX 6.11 inaugurates its support for CMake, an open-source suite of tools that allow developers to build, test, and package their software. It’s especially useful in large multi-platform projects because it helps streamline large workflows. The current CMake support current focuses on applications that run on a single-core MCU and do not use Trustzone. Over time, we will continue to update our CMake support to allow STM32CubeMX to generate projects for more STM32 microcontrollers.

What is STM32CubeMX?

STM32CubeMX is a graphical tool that helps developers generate code that initializes a microcontroller and its application. Users get an interface to configure the MCU’s pinout, resolve conflicts, and set up hardware peripherals and middleware. Users can also configure the clock tree and benefit from a wizard that automates specific calculations. Similarly, it can help set up and tune the DDR on STM32 MPUs. The tool also helps select MCUs or MPUs and download their software packages. Hence, it’s very often the first point of contact with developers. The tool is available in STM32CubeIDE or as a standalone download.

STM32CubeMX also assists developers in other parts of their job. For instance, finding the proper documentation can be tricky, especially with such a vast library. ST is famous for its extensive documentation, and partners tell us that it’s one of the reasons they select our devices. Hence, we offer tutorial videos within the standalone version of STM32CubeMX to help developers search for information. We offer content on configuring the clock tree, the pins, or different software features. Programmers who are new to our tools can start their application quicker, thus further lowering the barrier to entry and reducing friction.

For readers who may be less familiar with STM32CubeMX, here is a rundown of some of the features we’ve released in the past.

A UI for quick feature access

Embedded system developers must grasp the numerous layers of abstractions within their ecosystem. A typical PC or mobile app developer can do all their work with only one or very few high-level languages and scripting frameworks. Conversely, working with a microcontroller forces teams to consider the many existing layers. For instance, a team looking for the ultimate optimizations will work as close to the metal with low-level code. However, those looking for a more practical approach that can still yield excellent performance will use our hardware abstraction layer (HAL), and those with a priority on rapid development will use our board support package (BSP), which abstracts the HAL.

However, too many embedded ecosystems fail to understand that the higher the abstraction, the more developers seek convenience. Indeed, if teams must spend hours or even days setting up an abstraction layer, it becomes pointless. Consequently, CubeMX 6.10.0 introduced a new UI that helps initialize our BSP functions under “New Projects” -> “Start My Project”. The UI currently works with only a few of our newest development platforms (NUCLEO-C031C6, as well as NUCLEO-H563ZI and NUCLEO-U5A5ZJ-Q when TrustZone is disabled), but our teams are working to support more development boards over time.

Let’s take the example of a blinking light demo on the NUCLEO-H563ZI. The first step is to ensure that at least USER LED GREEN is selected in the Human Machine Interface dropdown menu. When choosing this option in the new UI, the system automatically commits the right pins, instead of just suggesting which pin to use and sets up the HAL so developers can immediately use the BSP function to toggle the LED on or off. Hence, users simply have to push the GENERATE CODE button on the top right side and open the main.c file in Core/Src/ to see the BSP_LED function initialized and ready to use in the main function and ready for use in the while loop.

Additionally, ST included a “Generate demonstration code” option, which adds comments and examples in the generated main C file. Hence, beyond automating the initialization process, the new UI can also serve as a guide for new developers who can open their new files and see how to toggle a light on and off, for instance. Consequently, even a developer with a cursory knowledge of C can run a blinking light application with minimal coaching. In a nutshell, the new version of STM32CubeMX aims to make embedded systems more accessible, even to those with minimal experience in the field.

No admin rights required

With version 6.10.0, STM32CubeMX for Windows managed to do away with the admin privilege requirement. Previously, the operating system would ask for the admin password when installing the utility. Now, thanks to a reworking of the installation process, Windows no longer asks for admin permissions, which is a tremendous help for users with a locked-down computer. Often, corporations lock their machines to prevent hacks or misuse, and it can be very cumbersome to ask the administrator to authorize an installation. STM32CubeMX 6.10.0 solved that. The Linux and macOS versions of STM32CubeMX don’t suffer the same issues due to how each operating system manages user privileges.

New support for the STM32H5 and STM32MP13

STM32CubeMX is often the first utility developers launch when working on their STM32 MCU because it lets them initialize their device, select the correct firmware package, configure the clock tree, and more. As a result, ST aims to add support for our latest devices continuously. For instance, this new version is compatible with the ability to generate files for secure projects running on our new STM32H5, which introduces new security safeguards. Similarly, STM32CubeMX now provides a memory management tool for the STM32WB and STM32WBA MCUs. The latter is also getting options to support its Thread, Zigbee, and 802.15.4 millimeter wave RF functionalities. Finally, as promised, we are also adding RTOS support for the new STM32MP13.

Memory Management Tool (MMT)

STM32CubeMX comes with a Memory Management Tool. The graphical user interface vastly facilitates the configuration of registers on devices like the STM32H5 or STM32U5, among others. For instance, it can help set up a device to use TrustZone, a secure environment, or a memory protection unit with only a few clicks. Previously, developers had to figure out which registers governed what function. The new MMT removes much of the complexity to create a far more intuitive experience. Furthermore, as STM32CubeMX 6.10.0 shows, we continue to bring the MMT to new STM32 devices.

Boot Path Management

The Boot Path Manager facilitates the configuration of the new boot loader available on the STM32H5. The latest mainstream MCU from ST supports an immutable root of trust (iRoT) and an updatable root of trust (uRoT). Depending on their security needs, developers can choose to use both, one or none. STM32CubeMX makes this possible by helping users select their configuration from a menu, automatically generate keys, and set up the boot path to secure the microcontroller. As STM32H5 development boards are increasingly available, we ensure that STM32CubeMX can help them take advantage of the new features.

Secure Manager

Secure Manager is another critical feature announced in early 2023 that is now accessible from STM32CubeMX. Secure Manager is our first Trusted Execution Environment. As part of the STM32 Trust initiative, it includes binaries and can help with certification at the system level. As a result, customers targeting a SESIL & PSA Level 3 Certification can vastly hasten their qualification process. In a nutshell, developers use STM32CubeMX to set up all the functionalities in Secure Manager, and the system then uses a scripting mechanism relying on the latest version of STM32CubeProgrammer CLI to configure the MCU.

Pre- and post-flight scripts

ST added pre- and post-flight scripting capabilities in STM32CubeMX to automate various tasks. Put simply, users can ask the application to launch scripts before and after it performs a code generation to adapt to the needs of expert users. For instance, a programmer could automatically copy files to a new folder or send them to GitHub before they are erased by the new files generated. It would enable engineers to keep a history of their configuration in case they’d like to revert to a previous state. Similarly, a post-flight script could add the newly generated files to a project and launch an IDE.

Authentication STM32CubeMX

STM32CubeMX requires users to log in to their my.ST.com account before downloading a package, which may perplex some in our community. Previously, users had to leave the application, go to ST.com, and enter their credentials when downloading a piece of software. A few versions ago, STM32CubeMX created a more cohesive experience by ensuring users don’t have to leave the software. However, it does mean asking for their credentials. However, it’s still possible to use STM32CubeMX without an account until that point

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Easily Incorporate Embedded Security Using Microchip’s PIC32CK 32-bit Microcontrollers with Hardware Security Module

The new legislation takes effect in 2024, mandating stricter requirements on cybersecurity on everything from consumer IoT devices to critical infrastructure. Meeting these new security compliance requirements from a product and supply chain perspective can be complex, costly and time-consuming. To provide developers with an embedded security solution that allows them to design applications that comply with these requirements, Microchip Technology announces the new family of PIC32CK 32-bit microcontrollers (MCUs) with an integrated Hardware Security Module (HSM) subsystem and Arm Cortex-M33 core featuring TrustZone technology to help isolate and secure the device.

The PIC32CK SG is the first 32-bit device on the market that combines the strong security of an HSM with TrustZone technology, a hardware-based secure privilege environment. Microchip’s latest innovation for mid-range MCUs provides designers with a cost-effective embedded security solution for their products that meets the latest cybersecurity mandates. The inclusion of an HSM provides a high level of security for authentication, secure debug, secure boot and secure updates, while TrustZone technology provides an additional level of protection for key software functions. The HSM can accelerate a wide range of symmetric and asymmetric cryptography standards, true random number generation and secure key management.

The PIC32CK MCUs from Microchip are designed to support ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards. For increased flexibility and cost efficiency, the PIC32CK MCU family offers a wide range of options to tune the level of security, memory and connectivity bandwidth based on the end application’s requirements. Options include up to 2 MB dual-panel Flash and 512 KB SRAM, with various connectivity options like 10/100 Ethernet, CAN FD and USB.

“Emerging requirements make security mandatory for the majority of IoT-connected devices. The PIC32CK makes it cost-effective to provide hardware-based security to mid-range microcontroller applications,” said Rod Drake, corporate vice president of Microchip’s MCU32 and MPU32 business units. “Microchip’s ecosystem of tools and security expertise help our customers navigate the complexities of the new requirements and provide lifecycle support for their products.”

For product supply chains that require additional security and safety protection such as in industrial designs, medical devices, home appliances and consumer IoT devices, the PIC32CK will be supported with Microchip’s Trust Platform Design Suite for provisioning as a service. This platform enables the secure factory provisioning of keys, certificates and IP without the need to reveal these secrets within the supply chain.

Development Tools

The 32-bit PIC32CK MCU family is supported by Microchip’s software platforms including MPLAB Harmony v3 and Trust Platform Design Suite. The PIC32CK family is also supported by the PIC32CK SG and PIC32CK GC Curiosity Ultra Development Boards including the EV33A17A and EV44P93A.

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Furthering its commitment to foster the next generation of semiconductor talent, Cadence Design Systems (India) Pvt. Ltd., a fully owned subsidiary of Cadence Design Systems, Inc., has signed a memorandum of understanding (MoU) with the College of Science and Technology (CST) at the Royal University of Bhutan. This partnership marks a significant step towards bridging the industry-academic gap by leveraging Cadence’s latest EDA tools to enhance VLSI design capabilities within the college and showcases Cadence’s commitment to providing access to its latest technology tools, even in some of the most remote places in the world.

As a part of this three-year agreement, Cadence will provide research bundle and AWR Design Environment bundle licenses as part of the Cadence University Program to the College of Science and Technology (CST) at the Royal University of Bhutan. This will provide the students and faculty with access to Cadence’s cutting-edge EDA tools, allowing them to delve deeper into the field of VLSI design and facilitating hands-on learning experiences through real-world projects.

The MoU will open new opportunities for internships and placements, enabling students to gain practical industry exposure and refine their skills in preparation for future career endeavours. As a part of this collaboration, Cadence will also provide suggestions on various courses, making them more industry-relevant in alignment with the Cadence University Program.

Speaking on the partnership, Jaswinder Ahuja, Corporate VP – International Headquarters and India Managing Director at Cadence, said, “Through our partnership with the College of Science and Technology at the Royal University of Bhutan, Cadence continues its mission to nurture the semiconductor leaders of tomorrow. By providing access to our cutting-edge EDA technologies, we aim to empower students and faculty to push the boundaries of VLSI design. This collaboration highlights Cadence’s commitment to promoting innovation and bridging the gap between academia and industry.”

“On behalf of the Royal University of Bhutan, I would like to express our sincere gratitude to Cadence for supporting us in our pursuit of excellence in education and research. Integrating Cadence’s cutting-edge EDA tools into our curriculum amplifies our commitment to providing students with a robust, industry-aligned educational journey. We are excited to collaborate with Cadence and empower our future engineers with the expertise and capabilities essential for thriving in the ever-evolving landscape of VLSI design.” – Dasho Nidup Dorji, Vice Chancellor, Royal University of Bhutan

The Cadence University Program grants easy access to the leading electronic design automation tools used for academic research and education to develop advanced users of Cadence technology. Through this program, Cadence aims to train the next generation of innovators, influencing the electronics industry for years to come. Cadence has also partnered with MeitY to provide EDA tools to 104 universities, aiming to create a talent pool of 85,000 engineers in VLSI Design by 2027. Cadence aims to work closely with academic institutions to enhance, improve, and extend the knowledge, capabilities, and expertise of the ecosystem.

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Dual Core, Excels in Security Capabilities, Memory Capacity, and Rich Peripheral

Nuvoton is pleased to announce the NuMicro MA35D0 series, a high-performance microprocessor targeted at industrial edge device applications. The MPU features extensive connectivity and security, which is ideal for smart infrastructure, manufacturing automation, and new energy systems requiring control and networking. Meeting the computing demands of these scenarios, the device is based around dual power-efficient high-performance 64/32-bit Arm Cortex-A35 cores (Armv8-A architecture), running at up to 650 MHz, with 32 KB of L1 instruction and data cache for each core, plus a 512 KB shared L2 cache. The MA35D0 also features high-performance hardware floating-point units (FPU) that enhance its digital signal processing (DSP) capabilities.

To help achieve the cost, performance, size, and energy consumption requirements of its target applications, the MA35D0’s LQFP package, with 128 MB or 256 MB of stacked DDR SDRAM, significantly reduces PCB layer count, device size, BOM cost, and electromagnetic interference (EMI). The chip has an extensive operating temperature (Tj) range from -40°C to +125°C, ensuring reliable operation in challenging edge computing environments.

With all these features, the MA35D0 is well-suited for industrial and other edge and Industrial IoT roles, including factory automation, industrial control, smart buildings, smart homes, smart gateways, and new energy systems.

Extensive Toughened Security Keeps Critical Data Safe

The MA35D0 series can easily establish fast encrypted communications, keep sensitive user data safe, and offer a secure environment for critical applications. The MPU supports secure booting in four modes: USB, SD/eMMC, NAND, and SPI Flash (SPI NOR/SPI NAND).

This chip provides a trusted system that meets the practical security requirements of industrial applications. Arm TrustZone secure boot, and other security features help this MPU safeguard valuable data and code. In addition to TrustZone, it includes Snoop Control Unit (SCU) L2 cache protection and built-in cryptographic accelerators with AES, SHA, ECC, RSA, SM2/3/4—plus a True Random Number Generator (TRNG). The MPU’s cryptographic key store and OTP memory further protect sensitive data.

Wide Choice of Connectivity

For high-performance edge device roles, such as industrial control or gateway applications, the MA35D0 series provides high-speed connectivity and advanced control interfaces, such as 2x megabit ethernet (complying with IEEE 1588 v2), high-speed USB host and device connections, SD3.0/eMMC, 3x CAN FD, and 11x UART. The MA35D0 series also provides touchscreen support and a TFT LCD controller, with resolutions up to 1280×800.

Generous Evaluation and Development Resources

Nuvoton provides rich design resources for the MA35D0 series. The evaluation and development system, the MA35D0 EVB, is pre-loaded with remote control examples, such as browser status access and cloud connectivity, allowing users to begin evaluation and development immediately.

For more information about the MA35D0 series of industrial edge MPUs, please visit https://www.nuvoton.com/products/microprocessors/arm-cortex-a35-mpus/ma35d0-industrial-edge-device-series/

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Target applications include electric sunroof, window lift, sliding doors, and power-trunk lift gate

The L99H92 automotive gate driver from STMicroelectronics provides an SPI port for programming and diagnostics, a charge pump, protective features, and two additional current-sense amplifiers for system monitoring.

Containing two high-side and two low-side drivers, the L99H92 can control a single H-bridge powering one bidirectional DC motor or two half bridges for two unidirectional motors. Typical applications for the highly integrated and easily configurable driver include electric sunroof, window lift, powered trunk, sliding doors, and seat-belt pre-tensioners.

The charge pump powers the high-side drivers to maintain correct operation as the vehicle battery voltage fluctuates, enabling the outputs to function with a supply as low as 5.41V. The charge-pump output is also available at an external pin to control a MOSFET for reverse-battery protection.

The gate-driving current is programmed through the SPI port, allowing slew-rate control to minimize electromagnetic emissions and thermal dissipation. Programming the current saves up to four external discrete components per MOSFET, typically needed for slew-rate setting with conventional drivers. The maximum drive current of 170mA gives designers flexibility to use the driver with a wide variety of external MOSFETs, including high-power devices with large gate capacitance.

With many features for system protection and diagnostics, the L99H92 is built for reliability and safety. There is overcurrent protection with a programmable threshold, detected by monitoring the MOSFET drain current. Also, cross-conduction protection with programmable dead time ensures safety and efficiency. Additional protection includes overtemperature early warning and shutdown, overvoltage and undervoltage protection on analog and digital power supply inputs, and open-load and output short-circuit detection in off-state diagnostic mode.

A fail-safe input can turn off all MOSFETs instantaneously and a dedicated diagnostic pin provides immediate fault warning without waiting for periodic SPI transfers.

Additionally, two current-sense amplifiers are integrated for system-status monitoring, helping minimize the bill of materials. Suitable for high-side, low-side, and inline sensing, the amplifiers have independent programmable gain, low offset, and low thermal drift. They can be independently disabled to reduce current consumption when unused.

The L99H92 is in production now and packaged as a TQFP32 or QFN32 with wettable flanks to facilitate inspection. Pricing starts from $1.7062 in the QFN32 package and $1.7246 in the TQFP32 package, for orders of 1000 pieces. For further information please visit: www.st.com/l99h92

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Raptee is a full-stack two-wheeler EV startup with their flagship product highly tech-enabled and IoT-centred. The team began operations out of Chennai in 2019 with a mission to democratise electric mobility in India. They are crafting a two-wheeler EV that is more of an augmented machine which is intelligent, intuitive and safe with features like throttle mapping, blind-spot detection, and Bluetooth connectivity. So far, Raptee has over 31 technological patents in its name.

Mr. Dinesh Arjun, CEO & Cofounder, Raptee

Rashi Bajpai, Sub-Editor at ELE Times spoke with Mr Dinesh Arjun, CEO and Co-founder at Raptee on various aspects of EV with a prime focus on the Indian market.

This is an excerpt from the conversation.

 

 

 

1. Can you throw some light on the go-to features/ major USP of Raptee’s electric motorcycle?

Our bikes come with an onboard charger that plays an essential role in bidirectional charging modes thus making the riding experience hassle-free. Additionally, we stand out as the only electric two-wheeler company in India to leverage the ubiquitous CCS2 charging standard. This compatibility grants you access to the extensive public charging network, allowing you to top up your bike from 0 to 80% in a mere 45 minutes.

2. What core technologies and concepts does the team Raptee work on? Please highlight your key expertise and core competencies.

As the sole electric two-wheeler (e2W) utilizing a high-voltage drivetrain, we deliver superior performance surpassing any internal combustion engine (ICE) counterparts. The seamless integration of VCU and cloud computing not only enhances rider experience with smoother acceleration and improved handling but also offers practical benefits like efficient trip planning through real-time battery status updates, showcasing Raptee’s commitment to innovation and practical functionality on the road.

3. As India moves towards self-reliance in the area of information and technology, a wave of innovations and ideas has taken over the nation. How well is Raptee prepared to pursue development in the EV sector under the “Make in India” policy?

Raptee substantiates its alignment with the “Make in India” policy through its complete in-house design and development of all components. This comprehensive approach not only ensures technological sovereignty but also fosters a culture of innovation and expertise within the domestic industry. Additionally, Raptee’s establishment of a complete supply chain ecosystem from scratch addresses a critical gap in the market, particularly concerning high-voltage technology. This initiative not only reduces dependency on imports but also enhances the resilience and competitiveness of India’s EV sector.

4. What is your view on EV battery swapping booths and can its implementation help India come closer to sustainable electric mobility?

As battery technology evolves, the range of EVs is steadily increasing, reducing the need for frequent charging. This improvement diminishes the perceived advantage of battery swapping, which is often promoted as a quick solution for limited-range EVs. As batteries become more energy-dense and charging times decrease, charging stations become more efficient and comparable in terms of convenience.

5. India’s electric two-wheeler (E2W) sector is expected to cross the one million mark in 2024-what are the factors that will influence the market to reach the mark?

India’s E2W market is on an electric revolution, with sales expected to breach the one-million mark in 2024. This surge is driven by a customer-centric approach. Gone are the days of limited choices. Manufacturers are offering diverse options, from high-performance motorcycles to practical everyday rides, catering to every rider’s needs. Range anxiety is fading too, with advancements in battery technology and a rapidly expanding charging network. Additionally, robust customer support with readily available service and informative resources empowers riders, building trust and confidence in E2Ws. This focus on customer satisfaction, coupled with innovation and infrastructure development, is paving the way for a million E2Ws and a sustainable transportation future for India

6. How can better implementation of the charging infrastructure accelerate the sales of EVs?

A well-developed charging infrastructure plays a pivotal role in accelerating electric vehicle (EV) sales by addressing critical consumer concerns. Firstly, it alleviates the fear of “range anxiety” among potential buyers by ensuring a widespread network of charging stations along highways and in urban areas, thereby assuring drivers they can recharge conveniently during their journeys. Secondly, the availability of fast-charging stations, such as those utilizing the CCS2 standard, significantly reduces charging times, making EVs more competitive with traditional gasoline vehicles. This not only enables quicker trips but also enhances overall convenience by minimizing wait times at charging stations. Moreover, a robust charging infrastructure sends a powerful message to the public, signaling that EVs are a practical and supported transportation choice. This reassurance can sway hesitant consumers, ultimately driving increased EV adoption.

7. Tell us about Raptee’s goals and vision for the next decade.

Raptee’s vision is nothing less than a revolution in personal mobility. We are committed to accelerating the shift towards safe, smart, and sustainable transportation solutions, making them accessible to everyone. Fueled by a deep-tech core, we’re pioneering innovative technologies like HV drivetrains to achieve this ambitious goal.

Our focus isn’t limited to electric vehicles. We see ourselves as architects of the future of mobility, constantly exploring new product landscapes based on customer preferences and inventing disruptive technologies across different segments.

By the next decade, Raptee aspires to be a global leader in personal mobility, with a significant market share. This leadership will be built on the foundation of our unwavering commitment to safety, sustainability, and cutting-edge technological innovation.

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Engaging Multiple EU Partners, the Projects Will Apply Intelligent Sensing and AI-enabled Learning Technologies

As part of the European Union’s drive to support a multifaceted approach to addressing 6G challenges and promises, CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.

The two projects were among 27 chosen in a competitive proposal process by an EU partnership that divided €130 million between the projects. “These projects present a significant stride towards advancing smart networks and services, offering breakthrough innovations, experimental platforms and large-scale trials, driving world-class research and shaping the world’s digital connected future,” said the group, called the Smart Networks and Services Joint Undertaking (SNS JU).

6G-DISAC (Distributed Intelligent Sensing and Communication) and 6G-GOALS (Goal-Oriented AI-enabled Learning and Semantic Communication Networks) launched their three-year projects in January with multiple EU collaborators.

The two projects mark the first time a single RTO or company has been chosen to coordinate two competitive EU proposals in the same initiative. CEA-Leti has coordinated several EU projects, including the recently completed RISE-6G project. That SNS JU effort developed a disruptive new concept as a service for wireless environments by dynamically controlling wireless communication for brief, energy-efficient and high-capacity communications on a variety of surfaces, such as such as walls, ceilings, mirrors and appliances.

6G-DISAC

This project will develop and innovate on a widely distributed intelligent infrastructure compatible with both real-world integration constraints, new semantic and goal-oriented communication and sensing approaches, and the flexibility requirements of future 6G networks. It will apply theoretical approaches and operational and standards-compatible, distributed joint communication and sensing, by leveraging the expertise of world-leading network vendors, verticals, SMEs, research laboratories and academic institutions spanning the value chain.

Current approaches to integrated communication and sensing use centralized architectures and pass sensed information through a centralized controller.

“This project will bring the integrated sensing and communication (ISAC) vision into reality, going well beyond the usual restrictive standalone or localised scenarios, by adopting a holistic perspective, with large numbers of connected users and/or passive objects to be tracked,” said Emilio Calvanese Strinati, coordinator of the project and CEA-Leti’s smart devices & telecommunications strategy program director.

“With demonstrations that validate the vital 6G-DISAC concepts, the project will revolutionise various applications, from extended reality and robot-human interaction to vehicular-safety functions and improving communication key performance indicators (KPI) with sensing-aided communications,” he explained.

In addition to defining use cases and designing innovative network architecture, the 11 6G-DISAC partners will develop novel physical-layer waveforms, distributed sensing and communications methods, and optimised resource allocation methods and protocols.

Specific targets include:

• tracking connected user equipment (UE) and passive objects,
• performing ISAC with many distributed base stations, efficient distributed signal processing and machine learning for semantic ISAC, and
• incorporating extremely large multiple-input, multiple-output (MIMO) technologies and reconfigurable intelligent surfaces, and intelligent sensing activation.

“While addressing these fundamental and practical challenges, the team will focus on the distributed implementation of ISAC, unlocking real sensing applications and providing a multi-perspective view of networks in space and time for tangible communication gains,” Calvanese Strinati said.

6G-GOALS

This project is designed to reduce data traffic by conveying only the most relevant information and produce data-efficient, robust and resilient protocols that can adapt to network conditions and communication objectives using modern AI/ML techniques.

“As wireless mobile communication requires ever-higher data rates and 5G’s scope expands to include massive and ultra-reliable low-latency links, wireless evolution has been pressed to solve the technical problem of reliable data exchange between two end-points,” said project coordinator Calvanese Strinati.

“The 6G-GOALS project will take the wireless system design to its next stage by considering the significance, relevance and value of the transmitted data and transforming the potential of the emerging AI/ML-based architectures into a semantic and goal-oriented communication paradigm, offering a solid step toward cooperative generative AI technologies,” he said.

Semantic communication is instrumental in inducing reasoning and shared understanding among intelligent agents by exchanging pragmatically selected information in which its meaning to the receiver is designed to efficiently accomplish a goal or a task. With current approaches, data is sensed and transferred from sensors to the destinations without prior semantic extraction functions.

A recent paper written by 6G-GOALS participants noted that advances in AI technologies have expanded device intelligence, fostering federation and cooperation among distributed AI agents. These advancements impose new requirements on future 6G mobile network architectures.

“To meet these demands, it is essential to transcend classical boundaries and integrate communication, computation, control, and intelligence,” the paper, “Goal-Oriented and Semantic Communication in 6G AI-Native Networks: The 6G-GOALS Approach”, reports.

“These projects are fundamental to explore the capabilities of AI/ML solutions on the networks of the future, especially dealing with joint communication and sensing and semantic communications,” said Mauro Boldi Renato, EU project program coordinator at TIM (Telcom Italia). “Working with CEA-Leti represents a solid basis for their success and for bringing European industry towards implementation of 6G around 2030.”

“The exploitation of 6G-DISAC and 6G-GOALS project results will represent a transformative step for manufacturers and 6G industrial players, like NEC Corporation, by fostering the development of distributed intelligent networks and semantic/AI-driven communication strategies,” said Vincenzo Sciancalepore, principal researcher at NEC Laboratories Europe GMBH/ Germany and a member of the 6G-DISAC team. “Such an unprecedented approach will enable more efficient, flexible, and responsive network infrastructures that can support advanced applications, such as extended reality and automated mobility, meeting the increasing demand for high-capacity, low-latency and sustainable communication.”

6G-DISAC Partners

• Coordinator: CEA-Leti/France
• Technical Manager: Chalmers Tekniska Hogskola AB/Sweden
• Innovation Manager: Nokia Networks/ France
• Telecom Italia Spa/Italy
• Orange S.A./France
• Ethniko Kai Kapodistriako Panepistimio Athinon/Greece
• Institut Polytechnique

De Bordeaux/France

• NEC Laboratories Europe GmbH/Germany
• NEC Italia S.P.A/Italy
• Robert Bosch GmbH/Germany
• RadChat AB/Sweden

6G-GOALS Partners

• Coordinator: CEA-Leti/France
• Technical Manager: Consorzio Nazionale Interuniversitario per le Telecomunicazioni/Italy
• Innovation Manager: NEC Laboratories Europe GMBH/ Germany
• NEC Italia S.p.A/Italy
• Telecom Italia S.p.A/Italy
• Eurecom GIE/France
• Aalborg Universitet/Denmark
• Hewlett-Packard/France
• Hewlett-Packard Italiana S.R.L/Italy
• Toshiba Europe Limited UK
• Imperial College of Science Technology and Medicine UK
• Singapore University of Technology and Design

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Microchip’s ATMXT2952TD 2.0 family of touch controllers offer cryptographic authentication and data encryption

As we see an increased number of electric vehicles (EVs) on the road, the necessary charging infrastructure must expand to meet the increased demand. Adding credit card payment options to EV chargers is becoming a standard practice in many countries—and is a mandate in the European Union—and chargers need to meet Payment Card Industry (PCI) security standards. To help EV charger designers protect their payment architectures, Microchip Technology has launched the MXT2952TD 2.0 family of secure touchscreen controllers.

Typical touch-enabled human-machine interface (HMI) and radio frequency identification (RFID) combination-based payment systems are vulnerable to hacking attacks via malicious software updates or man-in-the-middle attacks when a user enters their personal identification number (PIN) on the touchscreen. Physical mesh barriers and sensors are often used around these integrated circuits (ICs) for protection from hacking. Constant reflashing of software and device resets are used to help safeguard software integrity. The MXT2952TD 2.0 family is designed to encrypt touch data and cryptographically authenticate software updates to minimize risk and meet PCI certification compliance standards. When the RFID reader IC and the touchscreen controller are on different printed circuit boards (PCBs), it is especially difficult and expensive to build physical barriers for hack protection. Embedded firmware on the MXT2952TD 2.0 provides a more easily implemented solution for EV charger manufacturers to remain compliant with security regulations and avoid the cost of adding a second, expensive touchscreen payment module to the charger.

The outdoor nature of EV charger HMI demands they withstand harsh weather conditions, function accurately in the presence of moisture and are resistant to vandalism. MXT2952TD 2.0 touch controller-based touchscreens remain effective when designed with IK10 standard 6 mm-thick glass, anti-reflective, anti-glare and anti-fingerprint coatings and IR filter/UV filter layers. Microchip’s proprietary differential touch sensing delivers exceptional noise immunity for superior touch performance even when used with thick gloves.

“The maXTouch 2952TD 2.0 family provides EV charger designers with a cost-effective, secure design architecture for implementing credit card payments with PIN entry on their touchscreens,” said Patrick Johnson, senior corporate vice president overseeing Microchip’s human machine interface division. “Combined with the rugged, outdoor HMI touchscreen technology that Microchip’s maXTouch portfolio is known for, the new addition to the 2952TD family of touchscreen controllers offers our customers secure designs and the exceptional touch performance necessary for outdoor applications.”

In addition to EV chargers, the MXT2952TD 2.0 family is well-suited for most unattended outdoor payment terminals such as parking meters, bus ticketing meters and other types of point-of-sale (POS) systems. The 2952TD 2.0 is specifically optimized for 20” screen sizes and its sister part, the MXT1664TD, is available for 15.6” screen sizes.

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• Q1 net revenues $3.47 billion; gross margin 41.7%; operating margin 15.9%; net income $513 million
• Q1 free cash flow $(134) million after Net Capex1 of $967 million
• Business outlook at mid-point: Q2 net revenues of $3.2 billion and gross margin of 40%

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the first quarter ended March 30, 2024. This press release also contains non-U.S. GAAP measures (see Appendix for additional information).

ST reported first-quarter net revenues of $3.47 billion, a gross margin of 41.7%, an operating margin of 15.9%, and a net income of $513 million or $0.54 diluted earnings per share.

Jean-Marc Chery, ST President & CEO, commented:

• “Q1 net revenues and gross margin both came in below the midpoint of our business outlook range, driven by lower revenues in Automotive and Industrial, partially offset by higher revenues in Personal Electronics.”
• “On a year-over-year basis, Q1 net revenues decreased 18.4%, operating margin decreased to 15.9% from 28.3% and net income decreased 50.9% to $513 million.”
• “During the quarter, Automotive semiconductor demand slowed down compared to our expectations, entering a deceleration phase, while the ongoing Industrial correction accelerated.”
• “Our second quarter business outlook, at the mid-point, is for net revenues of $3.2 billion, decreasing year-over-year by 26.0% and decreasing sequentially by 7.6%; gross margin is expected to be about 40%.”
• “We will now drive the Company based on a revised plan for FY24 revenues in the range of $14 billion to $15 billion. Within this plan, we expect a gross margin in the low 40’s.”
• “We plan to maintain our Net Capex1 plan for FY24 at about $2.5 billion focusing on our strategic manufacturing initiatives.”

Quarterly Financial Summary (U.S. GAAP)

(US$ m, except per share data)	Q1 2024	Q4 2023	Q1 2023	Q/Q	Y/Y
Net Revenues	$3,465	$4,282	$4,247	-19.1%	-18.4%
Gross Profit	$1,444	$1,949	$2,110	-26.0%	-31.6%
Gross Margin	41.7%	45.5%	49.7%	-380 bps	-800 bps
Operating Income	$551	$1,023	$1,201	-46.1%	-54.1%
Operating Margin	15.9%	23.9%	28.3%	-800 bps	-1,240 bps
Net Income	$513	$1,076	$1,044	-52.4%	-50.9%
Diluted Earnings Per Share	$0.54	$1.14	$1.10	-52.6%	-50.9%

 

First Quarter 2024 Summary Review

Reminder: On January 10, 2024, ST announced a new organization which implied a change in segment reporting starting Q1 2024. Comparative periods have been adjusted accordingly. See the Appendix for more details. 

Net Revenues by Reportable Segment (US$ m)	Q1 2024	Q4 2023	Q1 2023	Q/Q	Y/Y
Analog products, MEMS and Sensors (AM&S) segment	1,217	1,418	1,400	-14.2%	-13.1%
Power and discrete products (P&D) segment	820	965	909	-15.1%	-9.8%
Subtotal: Analog, Power & Discrete, MEMS and Sensors (APMS) Product Group	2,037	2,383	2,309	-14.5%	-11.8%
Microcontrollers (MCU) segment	950	1,272	1,448	-25.3%	-34.4%
Digital ICs and RF Products (D&RF) segment	475	623	486	-23.8%	-2.1%
Subtotal: Microcontrollers, Digital ICs and RF products (MDRF) Product Group	1,425	1,895	1,934	-24.8%	-26.3%
Others	3	4	4	–	–
Total Net Revenues	3,465	4,282	4,247	-19.1%	-18.4%

Net revenues totalled $3.47 billion, representing a year-over-year decrease of 18.4%. Year-over-year net sales to OEMs and Distribution decreased 11.5% and 30.8%, respectively. On a sequential basis, net revenues decreased 19.1%, 320 basis points lower than the mid-point of ST’s guidance.

Gross profit totalled $1.44 billion, representing a year-over-year decrease of 31.6%. Gross margin of 41.7%, 60 basis points below the mid-point of ST’s guidance, decreased 800 basis points year-over-year, mainly due to the combination of sales price and product mix, unused capacity charges and reduced manufacturing efficiencies.

Operating income decreased 54.1% to $551 million, compared to $1.20 billion in the year-ago quarter. ST’s operating margin decreased 1,240 basis points on a year-over-year basis to 15.9% of net revenues, compared to 28.3% in the first quarter of 2023.

By reportable segment, compared with the year-ago quarter:

In Analog, Power & Discrete, MEMS and Sensors (APMS) Product Group:

Analog products, MEMS and Sensors (AM&S) segment:

• Revenue decreased by 13.1% mainly due to a decrease in MEMS and Imaging.
• Operating profit decreased by 44.8% to $185 million. Operating margin was 15.2% compared to 23.9%.

Power and Discrete products (P&D) segment:

• Revenue decreased by 9.8% mainly due to a decrease in Discrete.
• Operating profit decreased by 41.6% to $138 million. Operating margin was 16.8% compared to 26.0%.

In Microcontrollers, Digital ICs and RF products (MDRF) Product Group:

Microcontrollers (MCU) segment:

• Revenue decreased 34.4% mainly due to a decrease in GP MCU.
• Operating profit decreased by 66.7% to $185 million. Operating margin was 19.5% compared to 38.3%.

Digital ICs and RF products (D&RF) segment:

• Revenue decreased 2.1% due to a decrease in ADAS more than offsetting an increase in RF Communications.
• Operating profit decreased by 8.2% to $150 million. Operating margin was 31.8% compared to 33.9%.

Net income and diluted Earnings Per Share decreased to $513 million and $0.54 respectively compared to $1.04 billion and $1.10 respectively in the year-ago quarter.

Cash Flow and Balance Sheet Highlights

				Trailing 12 Months
(US$ m)	Q1 2024	Q4 2023	Q1 2023	Q1 2024	Q1 2023	TTM Change
Net cash from operating activities	859	1,480	1,320	5,531	5,577	-0.8%
Free cash flow (non-U.S. GAAP)[1]	(134)	652	206	1,434	1,715	-16.4%

Net cash from operating activities was $859 million in the first quarter compared to $1.32 billion in the year-ago quarter.

Net Capex (non-U.S. GAAP)1 was $967 million in the first quarter compared to $1.09 billion in the year-ago quarter.

Free cash flow (non-U.S. GAAP)1 was negative at $134 million in the first quarter, compared to positive $206 million in the year-ago quarter.

Inventory at the end of the first quarter was $2.69 billion, compared to $2.70 billion in the previous quarter and $2.87 billion in the year-ago quarter. Days sales of inventory at quarter-end was 122 days compared to 104 days in the previous quarter and 122 days in the year-ago quarter.

In the first quarter, ST paid cash dividends to its stockholders totalling $48 million and executed an $87 million share buy-back as part of its current share repurchase program.

ST’s net financial position (non-U.S. GAAP)1 was $3.13 billion as of March 30, 2024, compared to $3.16 billion as of December 31, 2023, and reflected total liquidity of $6.24 billion and total financial debt of $3.11 billion. Adjusted net financial position (non-U.S. GAAP)1, taking into consideration the effect on total liquidity of advances from capital grants for which capital expenditures have not been incurred yet, stood at $2.78 billion as of March 30, 2024.

Business Outlook

ST’s guidance, at the mid-point, for the 2024 second quarter is:

• Net revenues are expected to be $3.2 billion, a decrease of 7.6% sequentially, plus or minus 350 basis points.
• Gross margin of 40%, plus or minus 200 basis points.
• This outlook is based on an assumed effective currency exchange rate of approximately $1.08 = €1.00 for the 2024 second quarter and includes the impact of existing hedging contracts.
• The second quarter will close on June 29, 2024.

Conference Call and Webcast Information

ST will conduct a conference call with analysts, investors and reporters to discuss its first quarter 2024 financial results and current business outlook today at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until May 10, 2024.

Use of Supplemental Non-U.S. GAAP Financial Information

This press release contains supplemental non-U.S. GAAP financial information.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information from other companies. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with ST’s consolidated financial statements prepared in accordance with U.S. GAAP.

See the Appendix of this press release for a reconciliation of ST’s non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures.

Forward-looking Information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance or events to differ materially from those anticipated by such statements due to, among other factors:

• changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and adversely impact the demand for our products;
• uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products;
• customer demand that differs from projections;
• the ability to design, manufacture and sell innovative products in a rapidly changing technological environment;
• changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macroeconomic or regional events, geopolitical and military conflicts, social unrest, labor actions, or terrorist activities;
• unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding;
• financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;
• the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers;
• availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation);
• the functionalities and performance of our IT systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology;
• theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation;
• the impact of intellectual property (“IP”) claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
• changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
• variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
• the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;
• product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts;
• natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics in locations where we, our customers or our suppliers operate;
• increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral by 2027 on scope 1 and 2 and partially scope 3;
• epidemics or pandemics, which may negatively impact the global economy in a significant manner for an extended period of time, and could also materially adversely affect our business and operating results;
• industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; and
• the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations.

Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward-looking terminology, such as “believes”, “expects”, “may”, “are expected to”, “should”, “would be”, “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.

Some of these risk factors are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2023 as filed with the Securities and Exchange Commission (“SEC”) on February 22, 2024. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.

Unfavorable changes in the above or other factors listed under “Item 3. Key Information — Risk Factors” from time to time in our Securities and Exchange Commission (“SEC”) filings, could have a material adverse effect on our business and/or financial condition.

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