ELE Times

India celebrated its first National Technology Day on May 11, 1999, after the successful nuclear test at Pokhran in 1998, to commemorate the many achievements of the Indian scientific and technology fraternity. This day serves as a testament to India’s constant and relentless pursuit of excellence and innovation.  It is an opportunity to celebrate and honor the collaborative efforts of scientists, engineers, entrepreneurs, and educators, towards building a better, more efficient, and supportive innovation ecosystem.

It goes without saying that behind every technological breakthrough are countless individuals and organizations working tirelessly to break the glass ceiling and achieve the unfathomable. Hence, National Technology Day reminds the Indian community to keep investing in research and development, further cementing a culture of science and innovation while ensuring equitable access to technology for all.

India’s Story in Building a Strategic Scientific and Technology Forum 

The journey of technology and innovation has been nothing short of exceptional for India. The nation has been a treasure trove of knowledge from the very start of civilization. With a rich scientific heritage dating back thousands of years, India, to begin with, has made significant contributions including the concept of zero, the formulation of algebra and trigonometry, and the decimal system. Aryabhatta is considered to be a major early physicist and a mathematician who explicitly developed theories on the motion of planets.

Indian scientific community has made great advancements in the fields of medicine, astronomy, engineering, space, biotechnology, renewable energy, electronics, automotive, and defence. The government has put sincere efforts into establishing refined, top-notch, and highly competitive educational facilities like the Indian Institute of Technology (IITs) and Indian Institutes of Science (IISc) among others. Also, to bolster the R&D ecosystem in the country, institutions like the Council of Scientific and Industrial Research (CSIR) and the Indian Space Research Organization (ISRO) have been established.

The Indian IT industry is booming to become a global hub with MNCs like Tata Consultancy Services, Wipro, and Infosys playing a crucial role in accelerating the nation’s economic growth. The Space program has achieved significant milestones, including the launch of satellites, lunar exploration missions (Chandrayaan-1 and Chandrayaan-2), and Mars exploration (Mangalyaan).

The story doesn’t end here; India is also among the top players in biotechnology and pharmaceuticals, with rapid development in areas like vaccine development, generic drug manufacturing, and biotech research. Also, the country is investing hugely in renewable energy stressing on adopting environment-friendly ways and technology in the long run.

How far has India Come?

India in the last decade has seen major strides in the field of science and technology on a global level. Initiatives like “Make in India” launched by the GoI in 2014 aim at transforming the nation into a global manufacturing hub by attracting foreign investments, improving the ease of doing business, and promoting skill development, to revitalize the manufacturing sector and promote economic growth and job creation in the country. “Digital India” is another initiative launched with the vision of transforming India into a digitally-enabled and empowered society. It aims at leveraging digital technologies to bridge the digital divide and promote growth and development in varied sectors like electronics, automotive, IT, transportation, and communication.

With such initiatives being actively worked upon, India has been hit by the wave of startup culture. The EV sector is ramping up with denser infra being set up across the country. Technology leaders like Tesla and TATA are making their way in the EV segment in India. The country is boosting its semiconductor business with GoI investing bulk in setting up manufacturing units. We also saw mobile phone manufacturing jump 21 times to nearly Rs. 4.1 lakh Cr in the last 10 years.

Industry Speaks:

Read with us what top thought leaders have to say as we observe National Technology Day this year.

Mr. Aalok Kumar, Corporate Officer & Sr. VP – Head of the Global Smart City Business at NEC Corporation and President & CEO at NEC Corporation India

“Over the past decade, India has matured into global leadership in technological innovation. This has altered how we experience how the day-to-day services are provided and above all, how citizens utilize civic services. This transformation is fundamentally underpinned by the recognition of technology’s potential to change lives and communities for the better. Today, India is on a steady path to realizing its vision for a ‘Viksit Bharat’ by 2047, and the role of technology comes into sharp focus with greater responsibility than ever before. At this juncture, the tech innovation ethos in India is evolving to “purposeful innovation” aimed at societal good, demanding creative and responsible application of AI, ML, and big data analytics to solve day-to-day problems of the common man. 

At NEC India, our purpose is to build technology that serves the people, and as intelligent communities emerge, driven by data analytics and AI, we are proud to be playing our part in shaping a future where technology redefines citizen-centricity in civic services empowering lives. India’s unique position as a rapidly urbanizing nation undergoing large-scale digital transformation presents an unparalleled opportunity as a testing ground for innovative solutions that can be adapted to various markets worldwide.”

Mr. Sivakumar Selva Ganapathy, Vice President at OpenBlue India Software Engineering & APAC Solutions, Johnson Controls

“This year, India celebrates the 25th anniversary of National Technology Day. As we reflect on this journey, it is evident that our progress over the past two decades has been nothing short of remarkable. From our early achievements to emerging as a global technological hub today, India’s strength and capability in the domain speaks for itself.

While technology has impacted every sector in India, one area where it is poised to make a defining impact is sustainability. From building management systems analyzing occupancy patterns to AI-powered Smart grids optimizing energy distribution, technology is actively transforming cities into efficient and sustainable hubs. As a corollary, the area of green technology and green buildings is increasingly becoming more relevant, and as it continues to evolve, skilling & curriculum development assumes added importance. It is our firm belief that this can be best achieved through industry-academia collaboration. 

At Johnson Controls India, we are observing a steady increase in the adoption of technologies for green buildings, and it won’t be long before buildings evolve from merely being smart, to autonomous – capable of governing and maintaining itself! This National Technology Day, as we look at the strides made, we also look forward to witnessing the future of green technologies unfold, and renew our commitment to innovating for a green tomorrow. “

The Way Forward for India

India holds tremendous potential for innovation and collaboration in varied sectors including healthcare, education, transportation, and communication, where technology has permeated and unlocked new opportunities for growth and development.

National Technology Day is not merely about gadgets and gizmos but holds a more profound implication on how technology has impacted our society for the better. Technology has the power to democratize access to information, improve healthcare systems, enhance education, foster economic development, and promote sustainable development.

As we commemorate this day in 2024, let us look at the future with optimism and resolve and reaffirm our commitment to leverage the power of technology responsibly and ethically, to create a more inclusive and sustainable world.

The post India Gears Up to Celebrate National Technology Day 2024 appeared first on ELE Times.

Automated and autonomous vehicles, which rely on sensors like cameras and radar, either assist or take over decision-making in traffic situations. Sensors’ proper interaction and functionality must be thoroughly tested to ensure road safety. Dürr and Rohde & Schwarz, a global technology group, have developed an innovative, cost-effective solution for over-the-air (OTA) vehicle-in-the-loop (VIL) testing. This solution validates conformity and effectiveness during end-of-line (EOL) testing or periodical technical inspection (PTI).

Road safety is a key challenge for future mobility, especially for automated and autonomous vehicles. Ensuring the continued functionality of advanced driver assistance systems (ADAS) and autonomous driving (AD) features is critical for long-term vehicle safety and performance. Therefore, manufacturers of vehicles equipped with these features require certification, either from a third party, authority or by self-certification. A vehicle-in-the-loop (VIL) test can validate the correct operation of all ADAS/AD functions in the end-of-line (EOL) and ensure conformity of production (COP) before a vehicle leaves the factory. In addition, maintaining proper functionality throughout a vehicle’s lifespan requires additional control measures during periodical technical inspection (PTI).

Simulating various driving scenarios

To address these additional requirements in the EOL and PTI process, Dürr and Rohde & Schwarz initiated a joint project incorporating Dürr’s patented x-road curve multi-function roll test stand, Rohde & Schwarz’ new RadEsT radar target simulator and the open-source simulation platform CARLA. The combination creates a virtual environment specifically for the camera and radar sensors installed in the test vehicle, allowing for the OTA simulation of different inspection scenarios without touching the vehicle. These scenarios include critical situations such as unintended lane departures and other vehicles braking suddenly or switching lanes directly in front of the test vehicle. The test vehicle must react promptly to changes in the VIL simulation and, if necessary, trigger the automated lane-keeping systems (ALKS) or advanced emergency braking systems (AEBS), for example, to pass inspection.

Patented technology for ultimate versatility

The 4WD x-road curve allows for unrestricted driving with steering movements, facilitating cornering maneuvers without altering the test vehicle. Laser measurement technology recognizes the front wheels’ position and steering angle while swiveling front double roller units automatically adjust for any angular difference to the driving direction. This ensures the vehicle remains centered on the test stand even at high speeds, regardless of the steering wheel’s position, and without the need for vehicle fixation, thus minimizing cycle times.

Resilient processes and precise results

RadEsT, the radar target simulator developed by Rohde & Schwarz, is exceptionally resilient to external factors, ensuring consistent performance in production and workshop environments. Its ability to provide precise and repeatable measurements makes it an invaluable tool for conducting accurate assessments in real-world conditions. Moreover, its compact and lightweight design enables easy and flexible integration at a cost-effective price point.

Easy to use test scenario generation

The open-source tool CARLA offers vehicle manufacturers or PTI organizations maximum flexibility with additional cost-saving opportunities and great potential for scenario selection. The recently announced upgrade of the CARLA simulator to Unreal Engine 5 is expected to enhance modeling, simulation realism, and performance, particularly for over-the-air camera simulation via monitors.

By combining Dürr’s patented x-road curve multi-function roll test stand, Rohde & Schwarz’ innovative radar target simulator, and the open-source platform CARLA, automated and autonomous vehicles’ full functionality can be cost-effectively evaluated to ensure proper operation in production and throughout the complete vehicle’s lifespan.

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The LE50-28 power converters are available in nine variants with single- and triple-outputs for optimal design configurability

The Low-Earth Orbit (LEO) market is rapidly growing as private and public entities alike explore the new space region for everything from 5G communication and cube satellites to IoT applications. There is an increased demand for standard space grade solutions that are reliable, cost effective and configurable. To meet this market need, Microchip Technology (Nasdaq: MCHP) today announces a new family of Radiation-Tolerant (RT) LE50-28 isolated DC-DC 50W power converters available in nine variants with single- and triple-outputs ranging from 3.3V to 28V.

The off-the-shelf LE50-28 family of power converters are designed to meet MIL-STD-461. The power converters have a companion EMI filter and offer customers ease of design to scale and customize by choosing one or three outputs based on the voltage range needed for the end application. This series provides flexibility to parallel up to four power converters to reach 200-Watts.

Designed to serve 28V bus systems, the LE50-28 isolated DC-DC power converters can be integrated with Microchip’s PolarFire® FPGAs, microcontrollers and LX7720-RT motor control sensor for a complete electrical system solution. Designers can use these high-reliability radiation-tolerant power solutions to significantly reduce system-level development time.

“The new family of LE50-28 devices enable our customers to succeed in new space and LEO environments where components must withstand harsh conditions,” said Leon Gross, vice president of Microchip’s discrete products group. “Our off-the-shelf products offer a reliable and cost-effective solution designed for the durability our customers have come to expect from Microchip.”

The LE50-28 power converters offer a variety of electrical connection and mounting options. The LE50 series is manufactured with conventional surface mount and thru-hole components on a printed wiring board. This distinction in the manufacturing process can reduce time to market and risks associated with supply chain disruptions.

The LE50-28 family offers space-grade radiation tolerance with 50 Krad Total Ionizing Dose (TID) and Single Event Effects (SEE) latch-up immunity of 37 MeV·cm2/mg linear energy transfer.

Microchip offers a wide range of components to support the new space evolution with sub-QML strategy to bridge the gap between traditional Qualified Manufacturers List (QML) components and Commercial-Off-The-Shelf (COTS) components. Designed for new space applications, sub-QML components are the optimal solution that combines the radiation tolerance of QML components with our space flight heritage that permits lower screening requirements for lower cost and shorter lead times.

Microchip’s extensive space solutions include FPGAs, power and discrete devices, memory products, communication interfaces, oscillators, microprocessors (MPUs) and MCUs, offering a broad range of options across qualification levels, and the largest qualified plastic portfolio for space applications. For more information, visit our space solutions webpage.

Support and Resources

The new family of LE50-28 devices are supported by comprehensive analysis and test reports including worst case analysis, electrical stress analysis and reliability analysis.

Pricing and Availability

The LE50-28 single-output and LE50-28 triple-output are now available. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: flickr.com/photos/microchiptechnology/53332596878/sizes/l
• Video link: https://www.youtube.com/watch?v=XjXePfpjNa4

The post Radiation-Tolerant DC-DC 50-Watt Power Converters Provide High-Reliability Solution for New Space Applications appeared first on ELE Times.

Waaree Energies Limited, India’s largest manufacturer of solar PV modules with the largest aggregate installed capacity of 12 GW, as of June 30, 2023 (Source: CRISIL Report), has established a collaboration with Ecofy, an NBFC backed by Eversource Capital, committed to providing green finance for climate-positive initiatives. Ecofy is committing Rs 100 crores into the partnership, showcasing confidence in Waaree’s capabilities and the renewable energy sector’s growth potential.

Complementing the government’s PM Surya Ghar Yojana 2024 and leveraging favourable market conditions, this partnership is expected to contribute to India’s renewable energy transition. By synergizing Waaree Energies Limited’s solar expertise with Ecofy’s digital financing solutions, through the initiative we aim to accelerate the solarisation of over 10,000 rooftops across households and MSMEs, as envisioned in the PM Surya Ghar Yojana 2024. Through this partnership, we intend to make clean energy more accessible and affordable for homeowners, aiding in achieving the nationwide objective of solarizing households and MSME’s.

Kailash Rathi, Head of Partnerships & Co-Lending at Ecofy, added, “Our collaboration with Waaree signifies a milestone towards solar adoption at a time when the industry is at an inflection point. Over the past 15 months, Ecofy has empowered over 5000 rooftop solar customers. We have invested heavily in this segment enabling penetration through product innovation and instant approvals. As the country prepares for the peak solar season, the collaboration between Ecofy and Waaree is expected to act as a catalyst, and aid in accelerating solar adoption and penetration across diverse segments of society.”

Pankaj Vassal, President of Sales at Waaree Energies Limited, expressed enthusiasm for the collaboration, stating, “Our partnership with Ecofy represents progress towards democratizing solar power accessibility. By integrating our solar solutions with Ecofy’s financing platform, we are working towards removing barriers and aiding in accelerating the adoption of solar power across households and businesses. Ultimately, this is expected to empower more people to embrace the benefits of clean energy while collectively building a greener, more environmentally-conscious India.”

Waaree Energies Limited and Ecofy expect to play a significant role in achieving India’s energy independence goals while assisting households in embracing a greener, more cost-effective way of living.

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Kore.ai, a leader in enterprise conversational and generative AI platform technology, has unveiled its annual 2024 Agent Experience (AX) and Customer Experience (CX) Benchmark Reports, featuring historic findings that indicate the increased global acceptance of automation and self-service solutions.

Kore.ai commissioned the research to shed light on the impact of intelligent virtual assistants (IVAs) and contact center AI solutions on customer interactions and agent job satisfaction. The reports show that, for the first time, customer service agents are prioritizing advanced AI technology and automated tools over competitive salaries and a fair work environment. Similarly, consumers are increasingly embracing AI, valuing its precision and reliability. A key factor in this shift is the IVAs’ ability to offer around-the-clock assistance and smoothly transition between tasks without requiring repetitive information, significantly enhancing consumer satisfaction and comfort levels.

Kore.ai and research partner Farrell Insights surveyed 1,200 customers and 600 agents across multiple regions including the Americas, UK, Germany, India, Japan, Philippines, and Australia, and in major industries like banking, retail, healthcare, travel, telecom, and others. The key findings are collated in the Kore.ai Agent Experience (AX) and Customer Experience (CX) Benchmark Reports 2024.

Key AX Findings Include:

• An Industry First: Tech Trumps Pay- Agents ranked three automated assistant functionalities– tools that help them better understand customer needs, reduce time spent on searches and minimize typing during call wrap-ups– higher than competitive salary and fair working conditions in terms of importance.

• Contact Centers are Lagging- 72% of agents express a strong desire for IVAs, but contact centers are lagging in implementation, with 62% of agents reporting a lack of AI use cases. Outdated systems also hinder productivity, with 91% of agents reporting technology-related frustrations.

• AI Education Boosts Satisfaction- Agents trained in AI report 92% job satisfaction and engagement levels compared to their non-trained counterparts (73%).

• Win-Win with IVAs- 71% of customer service agents view increased automated assistant usage for assessing and routing customer needs as mutually beneficial for both consumers and agents.

Key CX Findings Include:

• Customers Prioritize Accuracy and Efficiency Over Live Agent Access– For the first time, effectiveness and accuracy ranked more important than the ability to access a live agent. Additionally, 68% of customers believe that AI assistants’ ability to seamlessly carry and continue conversations across channels is important when it comes to great customer service interactions.
• Closing Gap between Automated and Live Agent Performance- In the US, there is only a 4% gap between the rating of IVA performance vs. expectations for live agents (72% vs 76%, respectively). In the APAC region, there is no difference in performance ratings.
• The Rise of IVAs Across Industries- Comfort with IVAs is growing across most sectors (travel, banking, retail, cable/telco/ISP) while healthcare sees direct human contact as crucial. Retail emerges as a standout sector with universal approval for AI-assisted customer service, especially in areas like product search (75% respondents reported interest) and purchasing (74%), highlighting broad trust in AI for both advisory and transactional roles.

• 24/7 Access Appeals to All- The allure of around-the-clock access to customer service is significant among consumers, with 77% noting this is a draw for automation and IVAs. Even Boomers are on board, with 68% recognizing the benefits of self-service’s constant access. Other key elements playing crucial roles in enhancing consumer acceptance include conversational voice and the assurance of secure communication for personal information, which enterprise-grade IVAs provide.

“Having monitored this sector for over a decade, this is the first time I’ve observed such a dramatic shift in agent preferences for automation over compensation,” said Michael Farrell, President and Chief Strategist at Farrell Insight. “As effectiveness, accuracy, security, ease of use, and trust increasingly become the top priorities for both agents and consumers, the method of achieving these results becomes secondary. Our research with Kore.ai indicates a watershed trend: people are leaning towards outcome-focused interactions in customer service, driven by their positive experiences with IVAs and contact center AI solutions.”

To improve customer experience, increase agent satisfaction, and optimize contact center performance, leveraging AI-powered solutions is essential for businesses to stay ahead of the curve.

“Our latest research shows increased engagement and satisfaction with AI solutions among agents and consumers,” said Raj Koneru, CEO of Kore.ai. “Adopting AI technologies in call centers not only enhances service quality for customers but also transforms agent roles by streamlining routine tasks and improving work conditions. We aim for this research to guide organizations looking to elevate their service interactions with AI-powered automation.”

To view the Kore.ai’s full AX and CX reports, please visit::  https://kore.ai/research-analysis/?utm_source=PR

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The aerospace and aviation industries are experiencing massive growth following the decimation of the pandemic. There is no denying the fact that both sectors stand at the cusp of technological advancements and evolution. The field has enormously stepped up from the early days of aviation to a more sophisticated and technology-laden service industry.

The industry is undergoing a transformative change in its overall lifecycle process- from the design to the final flight and everything in between. Technology breakthroughs are yielding some exceptional results, redefining commercial aviation and space exploration. Taking a closer look into the future, the aerospace and aviation industry is poised to grow manifold in the next decade, with AI/ML and other related technologies at the forefront of innovation. 

While many trends are being worked upon simultaneously, the one that is catching the most eyeballs is the eVTOL (Electric Vertical Take-off Landing) aircraft that uses electric power to hover, take off, and land vertically. This aircraft is from the not-so-distant future and would cater to point-to-point transportation between urban areas, finding its way as an efficient alternative to ground transport. 

Achieving Sustainability with Each Flight

Sustainability has become a norm that needs to be addressed by every industry. The aviation sector is utilizing forefront technologies and finding the right resources to help reduce its carbon footprint. Airlines are exploring eco-friendly, alternative sustainable aviation fuels like biofuels that would help in reducing carbon emissions or improving aerodynamics to enhance fuel efficiency. Engineers are also developing electric and hybrid aircraft and airports placing energy-efficient practices to reduce the industry’s reliance on fossil fuels. With such initiatives peaking, the aviation sector is moving closer to achieving green goals by formulating sustainable infrastructure and energy management systems.

Technological Impetus on the Rise

Right from operations to safety, efficiency, and customer experience, the aviation industry relies extensively on technology. At the forefront is AI/ML and automation that has the potential to transform the way airlines and airports operate. The development involves streamlining processes like cargo transport, aircraft data examination, integration of HR, maintenance, and flight systems into the apt interface, integration of AI-powered software into standard flight simulation training devices that are capable of analyzing real-time data, provide instant feedback on the pilot’s performance, and provide insights to instructors. Also, the constant evolution of technologies like cloud, robotics, augmented reality, virtual reality, Big Data, the Internet of Things, and AI/ML, is bringing faster and more crisp results in data refining that would help build advanced biometric technology and other sophisticated systems.

Moreover, this is the age of unmanned aerial vehicles (UAVs) i.e. Drones and the aviation sector is benefitting tons from their ability to access difficult-to-reach areas and capture high-quality images. These features have helped the airlines to restructure and revolutionize their maintenance and inspection approach. 

Cyber Threats Creeping into Intricate Digitised Aviation Systems 

Any industry that works on critical digital infrastructure is prone to cyber-attacks. Aviation’s digital landscape is a complex one with multiple stakeholders including airlines, airports, OEMs, and several service providers. With growing complexity, the digital ecosystem built on diverse technologies, new and old, with different levels of cybersecurity measures becomes exceedingly vulnerable and high-value targets to cyber exploitation.

Multiple points in the industry’s vast and interconnected supply chain are usual targets of cybercriminals. The attacks can disrupt operations, steal valuable data (passenger’s personal info, credit card details, flight data, etc.) called phishing, or pose indirect threats (ransomware) on third-party vendors. 

Thus, understanding the cybersecurity space becomes vital in the aviation business to brace against any possible breach.  

Apurva Gopinath, Assistant Vice President, Financial Services and Profession Group, Commercial Risk Solutions, India at Aon India Insurance Brokers Private Limited spoke about the underlying cyber threat in the aviation sector and shared insights on how businesses can adopt better and stricter cybersecurity strategies. 

“Aviation Businesses are facing the most challenging cyber threat landscape yet with global ransomware damage costs predicted to reach $20 billion this year, an increase of 57X from 5 years ago. Aon’s global Digital Forensics and Incident Response (DFIR) team report that over 50 per cent of those subject to ransomware attacks pay the ransom in some form. To strengthen cyber resilience, aviation companies must adopt a risk-based approach to review the effectiveness of controls, particularly in Access Management, Business Continuity, Third Party Risk and Vulnerability Management. Some of the actions companies can take to reinforce their cybersecurity strategies include conducting vulnerability assessments and breach simulations, proactively utilizing threat intelligence to monitor the techniques and procedures of threat actors, and reviewing governance including Business Continuity, Disaster Recovery (BCDR) plans. Aviation businesses should also quantify the financial loss of cyber events listed on their cyber risk register to ensure the appropriate return of security investment (ROSI) and check contractual obligations to ensure insurance policies adequately cover any financial loss arising out of a breach.”

The post Building Blocks of the Aviation Industry appeared first on ELE Times.

Author: STMicroelectronics

STM32CubeMonitor 1.8 is the first version to add support for the SEGGER J-Link hardware probe. As a result, developers who are familiar with the third-party probe will be able to use it while capturing data with the ST software. It will make debugging and monitoring operations a lot simpler. As the J-Link fully supports the JTAG interface and offers download speeds of up to 4 MB/s (J-Link ULTRA+ / PRO), it also opens the door to greater development opportunities and rapid flashing operations. That’s why ST updated STM32CubeMonitor. We wanted to make the tool even more practical and enable developers to enjoy a more flexible and practical STM32 ecosystem.

ST often releases new versions of STM32CubeMonitor, STM32CubeMonitor-RF, and STM32CubeMonitor-UCPD. The tools repeatedly appear on our blog posts because many STM32 developers use them to release their products to market faster. Indeed, the challenge for any embedded system engineer is to find a comprehensive platform for their microcontroller or microprocessor. A device may have many features, but it won’t be useful if designers can’t implement them efficiently. As a result, it is critical to offer a wide range of software tools that facilitate the development of applications on STM32 devices. Let us, therefore, explore some of these tools and their new functionalities.

What’s new in STM32CubeMonitor 1.8?

The big update brought by STM32CubeMonitor 1.8 is the support for SEGGER J-Link probes. Avid readers of the ST Blog already know that SEGGER is an active member of the ST Partner Program. The company ships embOS, a real-time operating system optimized for STM32 devices. In fact, embOS was also one of the first pieces of software to receive the MadeforSTM32 label. More recently, we shared how SEGGER launched their STM32-SFI Flasher Commander to enable entire assembly lines to support software firmware installs (SFI). Hence, the support of their J-Link probes should come as no surprise.

The support of the SEGGER probe within STM32CubeMonitor is relatively straightforward. Instead of using the traditional STLINK in and out nodes acq stlink in and acq stlink out, developers just use ack jlink in and ack jlink out within the Node-RED interface. Hence, instead of having to convert the on-board STLINK into a J-Link, engineers can use the hardware probe to enjoy the SEGGER suite of software and solutions. Finally, STM32CubeMonitor 1.8 adds support for a greater range of acquisition rates when choosing a frequency lower than 1 Hz. The feature will help customize how often the software captures data, thus further optimizing its operations.

What is STM32CubeMonitor? The Netflix of MCUs

STM32CubeMonitor is a runtime variable monitoring and visualization tool with a web interface for remote connections and a graphical interface to create custom dashboards. It ensures developers can efficiently monitor their application through a graphical interface that relies on Node-RED. This flow-based programming tool enables users to create complex data representations with no coding at all. It will allow them to debug their software easily and analyze behaviors without disrupting an existing codebase. Additionally, users can share their dashboards on the Node-RED and ST communities to build on one another.

To make the first experience with STM32CubeMonitor more intuitive, the ST Wiki explains in detail how developers can monitor a variable within an application in just two steps. Users select the start address of the data they track in memory and its type. To assist in this task, we have a guide showing how to get addresses from ELF files. The interface then asks the user to select an STLINK probe.

A runtime monitoring utility based on Node-RED STM32CubeMonitor

Keeping track of registers, variables in memory, interrupts, and the myriad of events that occur at any moment is daunting. Hence, manually monitoring them is so demanding that teams often do not have the resources for this endeavor. STM32CubeMonitor solves this problem and relies on Node-RED to keep things as simple as possible. Users drag and drop graphical representations of a program’s element onto a canvas to create a flow, meaning a sequence of events. For instance, conditions can trigger modules that send alerts by email or push data to a cloud platform using MQTT.

Without entering a single line of code, users can create graphs, chart plots, or generate gauges that will help them visualize values in a counter, data from a sensor, and many other aspects of an application. Additionally, the presence of a web server means that it’s possible to use these visualizations on any PC or mobile browser, whether on the local network or remotely. Moreover, thanks to the Node-RED and ST community, users can start by looking at other users’ dashboards and organically learn by studying other people’s examples.

A .CSV generator for power users

The previous version of STM32CubeMonitor (version 1.6) updated the export to CSV feature to generate files that would work better with spreadsheets. For instance, the time column moved before the value column to fit how most people set their tables. Similarly, time began at 0, and long numbers got a separator to be more readable. Finally, version 1.6 also made it easier to identify probe configurations by giving them names.

Version 1.7 of STM32CubeMonitor now builds on the previous release to bring features requested by our users to turn the CSV exporter into a powerhouse. For instance, creating and organizing multiple columns within the export interface is now possible. Previously, users would have had to run a Python script to manipulate data or do everything in their spreadsheet application, which tends to be cumbersome. Similarly, each variable gets its column and a timestamp to better track it. Hence, the new options within STM32CubeMonitor ensure users can structure their data more easily and use their spreadsheet software to view the results instead of applying time-consuming changes.

Node-RED 3.1

Since version 1.5, STM32CubeMonitor supports Node-RED 3. One of the most significant improvements is the addition of a contextual menu available when users right-click. Consequently, they can access a lot more actions and discover features that would previously require digging into menus. The other important functionality available in Node-RED 3 is junctions, a special type of node that makes it easier to route wires. It helps simplify and clarify designs by bringing greater flexibility. Version 3 also introduced debugging capabilities that expose node locations when working with sub-flows, thus helping developers see what node is generating an error message.

And since version 1.7, STM32CubeMonitor uses Node-RED 3.1, which brings notifications management at the tab level, thus offering a lot more granularity to developers tracking multiple aspects of their application. Users also get a bigger workspace (from 5000×5000 to 8000×8000) and lockable flow, which can prevent accidental changes, which is especially important when dealing with mission-critical flows. Version 3.1, released only a few months ago, also updated the context panel to include popular options absent from the previous iteration, forcing users to dig through menus. Finally, among the many other improvements, Node-RED 3.1 optimized the wiring between horizontally aligned nodes to make them significantly more readable.

Eco acquisition mode

STM32CubeMonitor features a low-power acquisition mechanism, named ECO mode, that reduces CPU consumption by lowering the ring sample rate below 10 Hz. There are many instances when developers don’t need fast data acquisition and could benefit from a lower processing load. Traditionally, the utility captures variables every 50 ms or double the low rate frequency. Thanks to the ECO mode, developers get far more granularity and can manage resources better. The feature is also quite accessible since the threshold is simply a value in the settings file. Changing it is thus straightforward.

A support tool throughout the life cycle of a product

During the prototyping phase, engineers will likely use an STLINK probe, such as one of the STLINK-V3 modules currently available. It connects the MCU board to the PC, which will help set up the STM32CubeMonitor Dashboard and act as a gateway for the web interface. As designers prepare to ship their final product, they can create a software routine that will send data to a USB port using UART. Developers can thus still monitor their application securely by using a computer with STM32CubeMonitor connected to that USB port. As a result, the tool provides a long-term analysis that will help plan upgrades or upcoming features.

New format and symbol change notification

The latest version of STM32CubeMonitor brings the ability to export data in CSV instead of simply using a proprietary format. Users can import the information into Excel, MATLAB, and others, opening the door to more data optimization and manipulation. The new software will also throw a notification if symbols change. Put simply, the utility tracks variables by defining them in a file and associating them with a symbol. However, recompiling the code may render the symbols’ files obsolete, creating discrepancies with the Node-RED dashboard. The new STM32CubeMonitor will alert users if they forget to update the symbols’ file.

What’s new in STM32CubeMonitor-RF 2.12?

To support the latest features present in STM32WB and STM32WBA devices, STM32CubeMonitor-RF must align itself with their Bluetooth Low Energy stacks. Consequently, each new release tracks the changes brought to the microcontrollers’ firmware packages. In this instance, STM32CubeMonitor-RF 2.12 is aligned with version 1.17.0 of the firmware for the STM32WB and version 1.1.0 for the STM32WBA, the 1st wireless Cortex-M33 for more powerful and more secure Bluetooth applications. Additionally, the new utility brings support for over-the-air firmware updates on the STM32WBA and the latest Open Thread stack on the STM32WB.

What are some of the key features of STM32CubeMonitor-RF? Utility to optimize Bluetooth and 802.15.4 applications The OTA Updater and its Optimize MTU Size option

STM32CubeMonitor-RF is a tool that tests the Bluetooth and 802.15.4 radio performance of STM32WB microcontrollers. The graphical user interface helps visualize signal strength and packet errors over time, while a command-line interface opens the door to macros, batch files, and other types of automation. Put simply, it draws from the same philosophy as the traditional STM32CubeMonitor but specializes in radio performance. Hence, developers can rapidly test their design and potentially spot issues. The utility can also sniff 802.15.4 communications between devices. The easiest way to try the utility is to connect an STM32WB development board to a computer and use its USB or UART interface.

Over-the-air performance

Since version 2.8.0, STM32CubeMonitor-RF more than doubled over-the-air performances thanks to larger data packets. When users select the “Optimize MTU size” option in the “OTA Updater”, the software tool increases OTA transfers from 16 kbit/s to 41 kbit/s. It is, therefore, an essential quality of life improvement for developers. Sending files or updating a device’s firmware are everyday operations during development. The faster speeds will ensure developers work faster and more efficiently.

Advanced Features

The software package includes advanced features like an OpenThread 1.3 stack and an 802.15.4 sniffer firmware that works with a USB dongle or a Nucleo board. STM32CubeMonitor-RF also inaugurates a new BLE Received Signal Strength Indication (RSSI) acquisition scheme, which helps determine the approximate distance between two Bluetooth devices. Faithful readers of the ST Blog will remember that the technology was crucial during the pandemic in assisting companies like Inocess in developing products such as the Nextent Tag to help maintain physical distancing guidelines.

Another milestone is that STM32CubeMonitor-RF 2.10 brought the latest features from the STM32WB BLE 5.3 firmware (stack version 1.15.0). Developers thus get to enjoy BLE extended advertising. Traditionally, Bluetooth 4 and 5 have three advertising channels only, each capable of sending a payload of 255 bytes. Thanks to extended advertisements, sending a much larger payload is possible using one of the 37 data channels. One of the three channels simply sends a header pointing to the extension. Consequently, developers don’t need to send the same data on all three channels to ensure its reception, and they can transmit more data faster.

ACI logs

CubeMonitor-RF 2.11 brought a quality of life improvement in the form of application command interface (ACI) logs in CSV format. Put simply, ACI is the mechanism that sends commands to the Bluetooth stack, and thus, one of the first logs developers look into when debugging or optimizing their software. Previously, ACI logs were only available in a traditional .txt format. The move to CSV opens the door to clearer presentations and easier manipulation. For instance, users can rapidly sort the list of commands by value, type, or number of times they were sent.

New testing capabilities

Version 2.11 of CubeMonitor-RF brought a new method of testing the reliability of 802.15.4 stacks thanks to the support of a continuous wave mode. As the name implies, it just sends an uninterrupted signal without modulation. Developers can thus perform basic but crucial measurements to gauge signal propagation under several conditions. It’s an important first test for engineers looking to understand how their design will perform. Currently, the feature is only available on devices running the STM32CubeWB 1.11.0 firmware or later.

What’s new in STM32CubeMonitor-UCPD 1.3?

STM32CubeMonitor-UCPD 1.3 is now compatible with the USB Extended Power Range (EPR), a new profile delivering 48 V at 5 A for a total of 240 W. At this level, it becomes a lot simpler to fast-charge laptops or power docking stations with multiple fast-charging ports. Moreover, 240 W also brings USB-C to more power tools, further democratizing the connector. As makers look to use one port to save resources, reuse cables, and reduce waste, support for the EPR mode enables teams to adopt the new standard faster. Furthermore, as 240 W compatible cables are now becoming available, it is critical. to adopt the profile as early as possible.

What is STM32CubeMonitor-UCPD?

STM32CubeMonitor-UCPD monitors and helps set up USB-C and Power Delivery systems on STM32 microcontrollers running the ST USB PD stack. Developers can use the tool to monitor interactions on the USB-C interface, use sink or source power profiles, and use vendor-defined messages (VDM). The tool even has predefined settings to facilitate and hasten developments by handling many of the complexities inherent to these new technologies. STM32CubeMonitor-UCPD was integral to the launch of ST’s USB-C Power Delivery ecosystem in 2019. Since then, we’ve continued to improve the software to help developers gauge performance and obtain certifications faster.

Since STM32CubeMonitor-UCPD 1.2.0 houses a Java machine, like the other tools in this blog post, the utility has everything the installer needs. Users no longer need to install Java themselves before running the application. Additionally, users can now display traces for the voltage and current bus, VDM, UCSI, and more. The new STM32CubeMonitor-UCPD also monitors electrical values from the battery. Hence, developers can track more processes and understand what happens when connecting two USB-C devices or using Power Delivery.

The post STM32CubeMonitor 1.8, STM32CubeMonitor-UCPD 1.3, and STM32CubeMonitor-RF 2.12, more powerful data manipulations appeared first on ELE Times.

– Q2 FY 2024: Revenue €3.632 billion, Segment Result €707 million, Segment Result Margin 19.5 percent
– Outlook for FY 2024: Based on an assumed exchange rate of US$1.10 to the euro, Infineon now expects to generate revenue of around €15.1 billion plus or minus €400 million (previously €16 billion plus or minus €500 million), with a Segment Result Margin of around 20 percent (previously in the low to mid-twenties percentage range) at the mid-point of the guided revenue range. Adjusted gross margin will be in the low-forties percentage range (previously in the low to mid-forties percentage range). Investments are planned at around €2.8 (previously around 2.9 billion). Adjusted Free Cash Flow of about €1.6 billion (previously €1.8 billion) and reported Free Cash Flow of about €0 million (previously about €200 million) are now expected
– Outlook for Q3 FY 2024: Based on an assumed exchange rate of US$1.10 to the euro, revenue of around €3.8 billion expected. On this basis, the Segment Result Margin is forecast to be in the high-teens percentage range

Infineon Technologies AG is reporting results for the second quarter of the 2024 fiscal year (period ended 31 March 2024).

„In the prevailing difficult market environment, Infineon delivered a solid second quarter”, says Jochen Hanebeck, CEO of Infineon. “Many end markets have remained weak due to economic conditions, while customers and distributors have continued to reduce semiconductor inventory levels. Weak demand for consumer applications persists. There has also been a noticeable deceleration in growth in the automotive sector. We are therefore taking a cautious approach to the outlook for the rest of the fiscal year and are lowering our forecast. In the medium to long term, decarbonization and digitalization will continue to be strong structural drivers of our profitable growth. In order to realize the full potential of our Company, we will further strengthen our competitiveness. To this end, we are launching the company-wide “Step Up” program. We are aiming to achieve structural improvements in our Segment Result in the high triple-digit million euro range per year.”

Group performance in the second quarter of the 2024 fiscal year

In the second quarter of the 2024 fiscal year, Infineon generated Group revenue of €3,632 million. This was 2 percent down on revenue in the prior quarter of €3,702 million. In the Automotive (ATV) segment, revenue remained stable compared with the prior quarter, while in the Green Industrial Power (GIP) and Power & Sensor Systems (PSS) segments revenue was lower. The Connected Secure Systems (CSS) segment saw a slight increase in revenue from the first quarter of the 2024 fiscal year.

The gross margin achieved in the second quarter of the current fiscal year was 38.6 percent, compared with 43.2 percent in the prior quarter. The adjusted gross margin was 41.1 percent, compared with 44.9 percent in the first quarter of the fiscal year.

The Segment Result in the second quarter of the 2024 fiscal year was €707 million, compared with €831 million in the prior quarter. The Segment Result Margin achieved was 19.5 percent, compared with 22.4 percent in the first quarter.

The Non-Segment Result for the second quarter of the 2024 fiscal year was a net loss of €211 million, compared with a net loss of €129 million in the prior quarter. The second-quarter Non-Segment Result comprised €91 million relating to cost of goods sold, €18 million relating to research and development expenses and €54 million relating to selling, general and administrative expenses. In addition, it included net operating expenses of €48 million. This figure includes impairment losses of €37 million relating to the write-down of assets in connection with the planned sale of two backend manufacturing sites in Cheonan (South Korea) and Cavite (Philippines).

Operating profit for the second quarter of the 2024 fiscal year reached €496 million, compared with €702 million in the prior quarter.

The financial result in the second quarter of the current fiscal year was a net loss of €12 million, compared with a net gain of €25 million in the prior quarter. The financial result for the first quarter included interest income of €32 million arising on the release of a tax risk provision in conjunction with the acquisition of Cypress.

The tax expense in the second quarter of the 2024 fiscal year amounted to €93 million, compared with €134 million in the prior quarter.

Profit from continuing operations in the second quarter of the current fiscal year was €394 million, compared with €598 million in the first quarter. The result from discontinued operations was €0 million, after a loss of €11 million in the preceding quarter. The profit for the period achieved in the second quarter of the current fiscal year was €394 million. In the first quarter of the 2024 fiscal year, the profit for the period was €587 million.

Earnings per share from continuing operations decreased in the second quarter of the 2024 fiscal year to €0.30, from €0.45 in the prior quarter (basic and diluted in each case). Adjusted earnings per share1 (diluted) stood at €0.42 at the end of the second quarter of the current fiscal year, compared with €0.53 one quarter earlier.

Investments – which Infineon defines as the sum of investments in property, plant and equipment, investments in other intangible assets and capitalized development costs –totaled €643 million in the second quarter of the current fiscal year, compared with €653 million in the first quarter. Depreciation and amortization in the second quarter of the 2024 fiscal year amounted to €467 million, compared with €456 million in the preceding quarter.

Free Cash Flow2 improved in the second quarter of the current fiscal year to €82 million, compared with a negative figure of €1,597 million in the prior quarter. The figure for the first quarter of the 2024 fiscal year included purchase price payments of around €800 million relating to the acquisition of companies, mainly the acquisition of GaN Systems Inc. Annual bonus payments were also made in the first quarter of the 2024 fiscal year for the record 2023 fiscal year.

The gross cash position decreased from €2,712 million at the end of the first quarter of the 2024 fiscal year to €2,583 million at the end of the second quarter. In the course of the second quarter, the dividend of €456 million was paid and €233 million was utilized to buy back own shares related with the employee stock option plan. Set against this was the issue of a €500 million bond. Financial debt at 31 March 2024 stood at €5,941 million, compared with €5,398 million at 31 December 2023. The net cash position was therefore a negative amount of €3,358 million, compared with a negative amount of €2,686 million at the end of the first quarter.

Segment earnings for the second quarter of the 2024 fiscal year

ATV segment revenue remained stable in the second quarter of the 2024 fiscal year, totaling €2,078 million, compared with €2,085 million in the first quarter. Set against increasing revenues in electromobility was a slightly lower level of revenue from ADAS. Revenue from classical car components was unchanged. The Segment Result in the second quarter of the current fiscal year was €512 million, compared with €564 million in the first quarter of the 2024 fiscal year. The Segment Result Margin achieved was 24.6 percent, compared with 27.1 percent in the prior quarter.

In the second quarter of the 2024 fiscal year, GIP segment revenue decreased by 4 percent to €469 million, compared with €487 million in the first quarter. As a result of high direct customer and distributor inventory, demand in the areas of renewable energy and energy infrastructure was weaker. The Segment Result in the second quarter of the current fiscal year amounted to €89 million, compared with €130 million in the first quarter of the 2024 fiscal year. The Segment Result Margin was 19.0 percent, compared with 26.7 percent in the prior quarter.

PSS segment revenue decreased in the second quarter of the 2024 fiscal year by 7 percent to €713 million, compared with €765 million in the prior quarter. The reason for the decline in revenue was ongoing weak demand for components for PCs, notebooks, consumer electronics, battery-powered devices and microinverters for roof-top solar systems. Revenue from silicon microphones and components for smartphones continued to recover. The Segment Result achieved in the second quarter of the current fiscal year was €64 million, compared with €99 million in the first quarter. The Segment Result Margin was 9.0 percent, compared with 12.9 percent in the prior quarter.

CSS segment revenue increased slightly in the second quarter of the 2024 fiscal year to €371 million, up from €364 million in the first quarter. The growth in revenue of 2 percent was mainly the result of a higher level of sales relating to Wi-Fi. The Segment Result rose to €42 million, from €37 million in the prior quarter. The Segment Result Margin increased to 11.3 percent, from 10.2 percent in the first quarter.

Outlook for the 2024 fiscal year

Based on an assumed exchange rate of US$1.10 to the euro, revenue in the 2024 fiscal year is now expected to be around €15.1 billion plus or minus €400 million (previously €16 billion plus or minus €500 million). The adjustment of the forecast for the fiscal year is due to prolonged weak demand in major target markets as well as ongoing destocking at direct customers and distributors.

In the Automotive segment, revenue growth in the low to mid-single-digit percentage range is now expected. The decrease in revenue in the Green Industrial Power segment in comparison with the prior fiscal year is expected to be a low-teens percentage figure. The decline in revenue in Power & Sensor Systems is forecast to be in the high-teens and in the Connected Secure Systems segment in the low-twenties percentage range. With expected revenue in the 2024 fiscal year of €15.1 billion, the adjusted gross margin should be in the low-forties percentage range and the Segment Result Margin is expected to be around 20 percent. The Segment Result Margin for the Automotive segment is expected to be at the lower end of the aforementioned range of between 25 and 28 percent.

Investments – which Infineon defines as the sum of investments in property, plant and equipment, investments in other intangible assets and capitalized development costs – are now being slightly adjusted to a figure of about €2.8 billion (previously about 2.9 billion) for the 2024 fiscal year. The focus here will be investments in the manufacturing module at the Kulim site (Malaysia), which is designed to produce compound semiconductors, as well as the manufacturing module in Dresden (Germany), designed to produce analog/mixed-signal components.

Depreciation and amortization are anticipated to be around €1.9 billion in the 2024 fiscal year, of which around €400 million is attributable to amortization of purchase price allocations arising mainly from the acquisition of Cypress. Adjusted Free Cash Flow, which is adjusted for investment in large frontend buildings and the purchase of GaN Systems, is now expected to be about €1.6 billion (previously €1.8 billion), which is about 11 percent of the forecast revenue for the year of €15.1 billion. Reported Free Cash Flow should be around €0 million (previously €200 million). Return on Capital Employed (RoCE) is now forecast to reach around 9 percent. When the figures for Q1 FY 2024 were published, RoCE for the 2024 fiscal year was expected to be around 11 percent.

Outlook for the third quarter of the 2024 fiscal year

Based on an assumed exchange rate of US$1.10 to the euro, Infineon expects to generate revenue of around €3.8 billion in the third quarter of the 2024 fiscal year. Revenue in the ATV and CSS segments should grow in-line with group average quarter-on-quarter. Quarter-on-quarter growth rate for the GIP segment is expected to be belowand for PSS beyond group average. Based on this revenue forecast for the Group, the Segment Result Margin should be in the high-teens percentage range.

Structural improvement program “Step Up” to strengthen competitiveness

The Company wants to further strengthen its competitiveness. To this end, Infineon is starting the “Step Up” program focusing on a targeted, sustainable improvement of its cost structure. The program includes various packages of measures focusing on the areas of manufacturing productivity, portfolio management, pricing quality and operating cost optimization without compromising the Company’s innovative strength.

The program is expected to have a positive effect on the Segment Result in the high triple-digit million euro range per year (based on the 2023 fiscal year). The first financial benefits are expected in the course of the 2025 fiscal year. The full effect is expected to show in the first half of the 2027 fiscal year.

Telephone press conference and analyst telephone conference

The Management Board of Infineon will host a telephone press conference with the media at 8:00 am (CEST), 2:00 am (EDT). It can be followed over the Internet in both English and German. In addition a telephone conference call including a webcast for analysts and investors (in English only) will take place at 9:30 am (CEST), 3:30 am (EDT). During both calls, the Infineon Management Board will present the Company’s results for the second quarter of the 2024 fiscal year as well as the outlook for the third quarter and the 2024 fiscal year. The conferences will also be available live and for download on Infineon’s website at www.infineon.com/investor

The Q2 Investor Presentation is available (in English only) at:
https://www.infineon.com/cms/en/about-infineon/investor/reports-and-presentations/

FINANCIAL INFORMATION According to IFRS – Unaudited

The following financial data relates to the second quarter of the 2024 fiscal year ended 31 March 2024 and the corresponding prior quarter and prior year period.

Revenues, Results and Margins of the Segments

Segment Result is defined as operating profit excluding certain net impairments and reversal of impairments, the impact on earnings of restructuring and closures, share-based payment, acquisition-related depreciation/amortization and other expense, impact on earnings of sales of businesses or interests in subsidiaries, and other income (expense).

Reconciliation of Segment Result to operating profit

Reconciliation to adjusted earnings and adjusted earnings per share – diluted

Earnings per share in accordance with IFRS are influenced by amounts relating to purchase price allocations for acquisitions (in particular Cypress), as well as by other exceptional items. To enable better comparability of operating performance over time, Infineon computes adjusted earnings per share (diluted) as follows:

Adjusted profit (loss) for the period and adjusted earnings per share (diluted) should not be seen as a replacement or superior performance indicator, but rather as additional information to the profit (loss) for the period and earnings per share (diluted) determined in accordance with IFRS.

Reconciliation to adjusted cost of goods sold and gross margin

The cost of goods sold and the gross margin in accordance with IFRS are influenced by amounts relating to purchase price allocations for acquisitions (in particular Cypress) as well as by other exceptional items. To enable better comparability of operating performance over time, Infineon computes the adjusted gross margin as follows:

Adjusted cost of goods sold and the adjusted gross margin should not be seen as a replacement or superior performance indicator, but rather as additional information to cost of goods sold and the gross margin determined in accordance with IFRS.

Number of employees

Consolidated Statement of Financial Position

Consolidated Statement of Cash Flows Gross and Net Cash Position

The following table shows the gross cash position and the net cash position. Since some liquid funds are held in the form of financial investments which for IFRS purposes are not classified as cash and cash equivalents, Infineon reports on its gross and net cash positions in order to provide investors with a better understanding of its overall liquidity situation. The gross and net cash positions are determined as follows from the Consolidated Statement of Financial Position:

Free Cash Flow

Infineon reports the Free Cash Flow figure, defined as cash flows from operating activities and cash flows from investing activities, both from continuing operations, after adjusting for cash flows from the purchase and sale of financial investments. Free Cash Flow serves as an additional performance indicator, since Infineon holds part of its liquidity in the form of financial investments. This does not mean that the Free Cash Flow calculated in this way is available to cover other disbursements, as dividends, debt-servicing obligations and other fixed disbursements have not been deducted. Free Cash Flow should not be seen as a replacement or as a superior performance indicator, but rather as a useful item of information in addition to the disclosure of the cash flow reported in the Consolidated Statement of Cash Flows, and as a supplementary disclosure to other liquidity performance indicators and other performance indicators determined in accordance with IFRS. Free Cash Flow is derived as follows from the Consolidated Statement of Cash Flows:

Condensed Consolidated Statement of Cash Flows D I S C L A I M E R

This press release contains forward-looking statements about the business, financial condition and earnings performance of the Infineon Group.

These statements are based on assumptions and projections resting upon currently available information and present estimates. They are subject to a multitude of uncertainties and risks. Actual business development may therefore differ materially from what has been expected. Beyond disclosure requirements stipulated by law, Infineon does not undertake any obligation to update forward-looking statements.

Due to rounding, numbers presented throughout this press release and other reports may not add up precisely to the totals provided and percentages may not precisely reflect the absolute figures.

All figures mentioned in this press release are unaudited.

The post Solid Q2 FY 2024. Prolonged weak demand in major target markets leads to a lowering of the forecast for the fiscal year. Program to strengthen competitiveness starts. appeared first on ELE Times.

With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip. It provides a fully integrated embedded system for monitoring and managing automotive 12 V lead-acid batteries, which is critical for the 12 V power supply of vehicles’ electrical systems. The new microcontroller is ISO26262 compliant, enabling compact and safe intelligent battery sensing and battery management in modern vehicles.

The PSoC 4 HVPA-144K’s dual high-resolution sigma-delta ADCs, together with four digital filtering channels, enable accurate measurement of the battery’s state-of-charge (SoC) and state-of-health (SoH) by measuring key parameters such as voltage, current, and temperature with an accuracy of up to ±0.1 percent. The device features two programmable gain amplifiers (PGAs) with automatic gain control, allowing fully autonomous control of the analog front end without software intervention. The use of shunt-based current sensing for batteries provides a higher accuracy than conventional Hall sensors.

An integrated 12 V LDO (42 V tolerant) allows the device to be supplied directly from the 12 V lead-acid battery without the need for an external power supply. An integrated transceiver allows direct communication with the LIN bus. The product meets the functional safety requirements of ASIL-C according to ISO26262.

The Arm® Cortex®-M0+ MCU on which the PSoC 4 HVPA-144K is based operates at up to 48 MHz with up to 128 KB of code flash, 8 KB of data flash and 8 KB of SRAM, all with ECC. The PSoC 4 HVPA-144K also includes digital peripherals such as four timers/counters/PWMs and a serial communication block that can be configured as an I2C/SPI/UART.

The PSoC 4 HVPA-144K is supported by automotive-quality software. Infineon’s Automotive Peripheral Driver Library (AutoPDL) and Safety Library (SafeTlib) are developed according to the standard automotive software development process. They are both A-SPICE compliant, following the MISRA 2012 AMD1 and CERT C, and ISO26262 compliant.

With the introduction of the PSoC 4 HVPA-144K, Infineon is laying the foundation to expand its PSoC microcontroller portfolio to include Li-ion battery management systems for EVs. The portfolio will soon include several products for monitoring and managing high voltage (400 V and above) and low voltage (12 V/48 V) batteries, further facilitating future EV adoption.

Availability

The PSoC 4 HVPA-144K is now available in a compact 32-QFN (6×6 mm²) package with up to 9 GPIOs. For an easy start of development, an evaluation board is also available. Further information can be found at www.infineon.com/psochvpa144k.

The post Infineon introduces PSoC 4 HVPA-144K microcontroller for automotive battery management systems appeared first on ELE Times.

With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip. It provides a fully integrated embedded system for monitoring and managing automotive 12 V lead-acid batteries, which is critical for the 12 V power supply of vehicles’ electrical systems. The new microcontroller is ISO26262 compliant, enabling compact and safe intelligent battery sensing and battery management in modern vehicles.

The PSoC 4 HVPA-144K’s dual high-resolution sigma-delta ADCs, together with four digital filtering channels, enable accurate measurement of the battery’s state-of-charge (SoC) and state-of-health (SoH) by measuring key parameters such as voltage, current, and temperature with an accuracy of up to ±0.1 percent. The device features two programmable gain amplifiers (PGAs) with automatic gain control, allowing fully autonomous control of the analog front end without software intervention. The use of shunt-based current sensing for batteries provides a higher accuracy than conventional Hall sensors.

An integrated 12 V LDO (42 V tolerant) allows the device to be supplied directly from the 12 V lead-acid battery without the need for an external power supply. An integrated transceiver allows direct communication with the LIN bus. The product meets the functional safety requirements of ASIL-C according to ISO26262.

The Arm® Cortex®-M0+ MCU on which the PSoC 4 HVPA-144K is based operates at up to 48 MHz with up to 128 KB of code flash, 8 KB of data flash and 8 KB of SRAM, all with ECC. The PSoC 4 HVPA-144K also includes digital peripherals such as four timers/counters/PWMs and a serial communication block that can be configured as an I2C/SPI/UART.

The PSoC 4 HVPA-144K is supported by automotive-quality software. Infineon’s Automotive Peripheral Driver Library (AutoPDL) and Safety Library (SafeTlib) are developed according to the standard automotive software development process. They are both A-SPICE compliant, following the MISRA 2012 AMD1 and CERT C, and ISO26262 compliant.

With the introduction of the PSoC 4 HVPA-144K, Infineon is laying the foundation to expand its PSoC microcontroller portfolio to include Li-ion battery management systems for EVs. The portfolio will soon include several products for monitoring and managing high voltage (400 V and above) and low voltage (12 V/48 V) batteries, further facilitating future EV adoption.

Availability

The PSoC 4 HVPA-144K is now available in a compact 32-QFN (6×6 mm²) package with up to 9 GPIOs. For an easy start of development, an evaluation board is also available. Further information can be found at www.infineon.com/psochvpa144k.

The post Infineon introduces PSoC 4 HVPA-144K microcontroller for automotive battery management systems appeared first on ELE Times.

By: Nijas Kunju, Technical Manager in Application Engineering, ANSYS Inc

India’s robust investment in the aviation sector, exemplified by the substantial budgetary allocation of $72 billion for defense aviation in 2023, with $20 billion of domestic earmarking, points to an era of growth and innovation for the sector. This strategic investment has catalyzed the emergence of a vibrant private sector engagement in the development of cutting-edge drones, UAVs, and HAPS (high-altitude platform systems), complementing the government’s initiatives on 5th and 6th-generation fighter aircraft.

This transformative landscape includes initiatives such as the Indian Defense Offset and Make in India programs, fostering an environment conducive to heightened global participation in India’s Aerospace and Defense sector. Leading Aerospace and Defense OEMs, recognizing the imperative of technological advancement to maintain competitiveness, are steadfastly embracing modern innovations to elevate their product offerings.

With burgeoning market demands and a compelling investment climate, stakeholders increasingly advocate for expedited time-to-market for advanced stealth vehicles. Achieving this goal necessitates a paradigm shift towards minimizing prototype iterations and striving for “first-time-right” design success. Herein lies the pivotal role of Digital Engineering solutions, seamlessly integrating data management, Model-based System Engineering, and multidisciplinary analysis and optimization through physics-based simulations. Embracing these cutting-edge methodologies expedites product development and ensures enhanced agility and precision, propelling the Aerospace and Defense industry into unparalleled innovation and efficiency.

Prevailing challenges

Developing defense technologies involves strict requirements and limitations. In military aircraft, achieving stealth capability is crucial to evade detection by radar and other detection methods. This involves shaping the aircraft to minimize its visibility on radar and reducing its visual, acoustic, and infrared signatures. However, creating a stealthy design has drawbacks, including compromises in aerodynamic performance, longer development times, reduced fuel capacity, higher maintenance needs, and higher costs.

Among the various stealth technologies, radar avoidance is critical because radar can detect aircraft from long distances, regardless of weather or time of day. Therefore, reducing the aircraft’s radar cross-section (RCS) is a primary focus. Several methods exist, such as smoothing sharp edges, changing the aircraft’s shape (which can affect aerodynamics), using radar-absorbing materials (which can pose challenges at high speeds and specific frequencies), and employing active RCS cancellation techniques.

Advanced electromagnetic simulations, such as Finite Element Method (FEM), Finite Difference Time Domain (FDTD), Integral Equation (IE), physical optics (PO), and Signature-based Reduction (SBR), are used to virtually implement and accurately predict the RCS of aircraft structures (Figure 1-2).

Figure 1: shows the RCS of a corner reflector measured (red dotted) against HFSS IE and SBR+ solver

Navigating the complexities of identifying areas on aircraft or vehicles that contribute to high RCS poses a significant challenge for designers. Implementing effective mitigation strategies, such as employing radar-absorbing paints and structures, realizes pinpoint accuracy in identifying these problematic regions. Leveraging advanced 2D and 3D ISAR imaging techniques provides invaluable insights into these critical areas. Figure 3 vividly illustrates that the RCS spikes dramatically when electromagnetic energy aligns with an incident wave direction of approximately +/-98 degrees. The ISAR image comprehensively depicts these high-return regions, empowering designers to select and apply optimal RCS reduction methods strategically.

Figure 2: Graphs shows measured Vs HFSS Simulated RCS value (Source: the University of Texas Austin CEM Benchmarks)

 

Figure 3 Cessna aircraft (RCS), ISAR image, Project of RCS Hotspot area on aircraft

Transforming the defense landscape through stealth technology

Our airborne devices are protected by stealth technology, but the need for advanced radar systems to identify and classify targets remains just as important. Different types of radar are used to identify targets: bistatic, monostatic, etc. More recently, there has been an increase in the use of low-flying unmanned aerial vehicles (UAVs) and drones for defense applications. Distinguishing them from birds or other civilian objects requires high-resolution radar with a sophisticated signal processing system that can extract specific features of the target movement. AI/ML methods for classification are also being used, such as ISAR imaging, micro-Dopple effects, etc. However, these AI/ML methods require a large set of training data for each target type, such as drones, birds, UAVs, etc. For example, you need training data from different radar perspectives while in flight to identify a drone. One also needs different radars with different operating frequencies and bandwidths to capture the full spectrum of the target signatures. However, this diversity in radar systems makes it challenging to acquire comprehensive training data.

Advanced simulations can produce synthetic data mirroring real-world object behavior through numerical computation techniques. This facilitates the virtual recreation of electromagnetic properties at target frequencies and radar antennas, resulting in simulated radar raw IQ data. Users can use this raw data directly or apply their signal-processing algorithms to the simulated data. The processed data then serves as input for training AI/ML models [Figure 4]. The accompanying image depicts the detection of a drone using a 40GHz radar with a range resolution of 0.1 meters (achieved through a bandwidth of 1499 MHz). The Range-Doppler image illustrates the Doppler shift produced by rotating the drone’s front and back blades. Since rotating blades have components moving towards and away from the radar, they generate positive and negative Doppler velocity spreads in the spectrum.

Figure 4: Micro Doppler generation from the Drone, with and without Rotar blade rotation.

Observing a target over an extended duration (approximately 100-200ms) and analyzing its micro-Doppler signature can extract additional details such as rotor blade speed. This process assumes the target has already been identified using AI/ML techniques applied to the Range-Doppler image [Figure 5].

Figure 5: Spectrogram of Micro-doppler Signature from Quadcopter Drone.

To summarize, many challenges will continue to permeate, pushing the boundaries of innovation in this ever-evolving landscape of advanced stealth and radar technology. Yet, within these challenges lie unparalleled opportunities to redefine the capabilities of modern defense systems and the future of warfare. As we strive to overcome obstacles such as detection evasion and signal manipulation, we are compelled to harness the full potential of emerging technologies and interdisciplinary collaboration. To fulfill the market demand today, digital missions and high-fidelity behavioral models, virtual twins are the way of the future. Organizations such as Ansys are collaborating closely to expedite the development of products, aiming to bring this vision to reality. We will only unlock new frontiers in stealth and radar technology through perseverance, ingenuity, and technological innovations, paving the way for enhanced security and strategic advantage for India in an increasingly dynamic world.

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Enables longer battery runtime in wearables, trackers, and activity monitoring

The LSM6DSV32X 6-axis inertial module (IMU) from STMicroelectronics has a large accelerometer full-scale range of 32g and 4000 degrees-per-second (dps) gyroscope to measure intensive movements and impacts, including freefall height estimation. Ready to drive future generations of edge-AI applications, the new sensor device enables extra features and longer battery runtime in consumer wearables, asset trackers, and impact and fall alarms for workers.

The LSM6DSV32X extends the family of smart sensors that contain ST’s machine-learning core (MLC) with AI algorithms based on decision trees. With the MLC for context sensing and a finite state machine (FSM) for motion tracking, these sensors let product developers add new features, minimize latency, and save power. Leveraging the embedded features LSM6DSV32X slashes the power budget for functions such as gym-activity recognition to below 6µA. The LSM6DSV32X also embeds ST’s Sensor Fusion Low-Power (SFLP) algorithm to perform 3D orientation tracking at just 30µA. And by supporting adaptive self-configuration (ASC), the module autonomously reconfigures sensor settings in real-time to continuously optimize performance and power.

In addition to the accelerometer and gyroscope, the LSM6DSV32X integrates ST’s Qvar electrostatic charge-variation sensing to handle advanced user-interface functions such as touching, swiping, and tapping. The module also contains an analog hub for acquisition and processing of external analog signals.

Product developers can rely on a large selection of ready-to-use libraries and tools to accelerate the time to market for new products. These include the intuitive MEMS Studio environment, which supports evaluation and use-case development, and a dedicated GitHub repository that provides code examples such as sports activity and head-gesture recognition. Resources also include hardware adapters for connecting the IMU to ST’s evaluation and proof-of-concept boards such as the ProfiMEMS board, Nucleo sensor expansion board, and Sensortile.box PRO.

The LSM6DSV32X is scheduled to enter volume production in May 2024 in a 2.5mm x 3mm x 0.83mm 14-lead LGA package. Sample requests and pricing information are available from local ST sales offices. Pricing starts from $2.98 for orders of 1000 pieces.

Please visit https://www.st.com/lsm6dsv32x for more information.

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TETRA or P25 legacy narrowband technologies no longer meet the connectivity needs of today’s first responders. As mission-critical network requirements grow, broadband connectivity is the answer. Proper device and mobile network testing eases the migration to 3GPP-compliant broadband mission-critical services (MCX). At Critical Communications World 2024 (CCW 2024) in Dubai, Rohde & Schwarz will demonstrate its integrated solutions that enable reliable operation of mission-critical devices, networks and services. Solutions that enhance situational awareness for law enforcement and protection round out the exhibited portfolio.

When lives are at stake, reliable communications are vital to emergency services. While voice applications are still the top priority for first responders, data and video-based mission-critical applications are becoming increasingly important in crisis situations and for efficient day-to-day operations. Public safety and government agencies around the world are migrating their various communications networks from narrowband land mobile radio (LMR) like TETRA or P25 to broadband networks that meet this new need not only for voice but also for high-speed data services.

This migration to either 3GPP-compliant isolated secure networks or commercial 4G/5G-based cellular networks with embedded mission-critical capabilities must be planned and executed very carefully in order to maintain existing narrowband capabilities. Narrowband networks will still be in use in parallel for another decade, providing features such as push-to-talk (PTT) to their users. The 3GPP-defined internal architecture for MCX services includes amongst others user/group management, policy and charging enforcement, signaling control, and cross-network interworking. Applying appropriate and advanced test and measurement techniques during this ongoing migration process is essential to ensure reliable operation of critical communications for first responders and to save lives in crisis scenarios.

As an established partner of the critical communications ecosystem, Rohde & Schwarz is showcasing its comprehensive range of test solutions for MCX at Critical Communications World 2024, taking place from May 14 to 16 at the Dubai World Trade Centre in Dubai, UAE. At booth M20, visitors can learn from Rohde & Schwarz experts about the full range of test solutions, extending from R&D and conformance testing of end devices to network testing including MCX application verification. Solutions for spectrum monitoring and network protection complete the exhibited portfolio, all aimed at ensuring the reliable operation of mission-critical networks and services.

Device R&D and conformance testing

Rohde & Schwarz is bringing its extensive expertise in 3GPP conformance testing to the world of critical communications, demonstrating at CCW 2024 for the first time its industry-leading 3GPP MCX device conformance test suite on the R&S CMX500 4G/5G one-box tester. The test suite includes comprehensive 3GPP RF, functional, protocol and application tests for rugged MCX devices. In addition, the R&S CMA180 radio test set for testing PMR (public mobile radio) and LMR (land mobile radio) devices will be on display, highlighting the company’s cutting-edge solutions for device R&D and conformance validation for MCX device manufacturers.

Network testing

As an expert in mobile network testing, Rohde & Schwarz will also present its know-how in active and passive mobile network testing methods and solutions that cover the entire MCX network lifecycle, from coverage and interference measurements to specific MCX service testing like MCPTT and MCVideo quality. Visitors will be able to experience a unique MCX smartphone-based test solution implemented on the QualiPoc. This solution can be used in any MCX environment to assess the performance of MCX private and group calls, including measurement of 3GPP-specified MCX KPIs. Another test solution based on the R&S ROMES4 drive test software and the R&S TSMA6B mobile network scanner provides a universal tool for network engineering and optimization.

Spectrum monitoring and analysis

The Rohde & Schwarz portfolio also includes efficient solutions for stationary, transportable and portable spectrum monitoring systems that provide comprehensive spectrum awareness. At CCW 2024, Rohde & Schwarz will be exhibiting the R&S PR200, a tried-and-tested portable monitoring receiver for interference hunting in and around specific areas and facilities. It is an indispensable tool for regulatory authorities, mobile network operators, police forces, military units and other security organizations.

Cellular network analysis

R&S NESTOR is a turnkey mobile communications solution for situational awareness, law enforcement and protection of critical infrastructure. It is a software platform used in conjunction with R&S TSMA6B mobile network scanners and QualiPoc smartphones to analyze cellular networks via the air interface. Public authorities and security organizations, for example, use it to detect, identify, locate and analyze deployed cellular technologies and occupied bands and channels.

Rohde & Schwarz will present its comprehensive portfolio of solutions for mission-critical communications at Critical Communications World 2024 at the Dubai World Trade Centre from May 14 to 16, 2024, at booth M20. In addition, Rohde & Schwarz experts will share their insights at the Focus Forum on testing and certification of broadband devices on May 15, 2024 from 11:30 a.m. to 1:00 p.m.

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In the third blog of this four-part series, we will explore the range of personal micromobility solutions available within the consumer market, the technical challenges they face, and how technology can resolve these issues.

1. Introduction
2. Urban Infrastructure and Micromobility
3. Personal Transportation and Consumer Challenges
4. How Technology Will Shape the Future

Personal Micromobility Solutions

Personal micromobility solutions come in a wide variety of shapes and sizes, from e-bikes and e-scooters to electric skateboards and hoverboards. For some, they are a form of transportation used as an alternative to walking or driving; for others, they are a form of exercise equipment.

E-bikes are one of the more prominent micromobility solutions; analysts Precedence Research expect the e-bike market to grow at a compound annual growth rate (CAGR) of 9.89 percent from 2023 to 2032, achieving a market value of $44.08 billion.[1]

Whereas early e-bikes were essentially bicycles with heavy bolt-on batteries and hub motors, modern e-bikes are significantly lighter and are designed from the ground up to accommodate electric drive systems and batteries. Wiring is now carefully passed through the frame’s tubing to avoid damage. For midrange and above models, mid-drive motor units are located between the pedals to optimize the drivetrain’s efficiency and weight distribution (Figure 1).

Figure 1: Modern urban e-bikes feature mid-drive motors and integrated batteries. (Source: stockphoto-graf/stock.adobe.com) Beyond e-bikes

In addition to e-bikes, there is a wide array of micromobility alternatives, such as hoverboards, Segways, electric skateboards, and e-scooters. Although ownership of these is legal, their usage in the UK and most of the EU is restricted to private land due to the prohibition of their presence in public spaces, such as footpaths, roads, and cycle lanes.

In terms of electronic design, these products are similar to e-bikes, with a motor, control interface, and battery pack. The distinction between them and e-bikes lies in the control of their movement, as they rely exclusively on an electric powertrain operated through a throttle or, in the case of hoverboards and Segways, a gyroscopic sensor that the user can manipulate to regulate the speed.

Challenges of Personal Micromobility

While personal micromobility solutions have seen incredible growth in recent decades—a trend set to continue—barriers are impacting the market. While regulatory issues need to be addressed, there are still technical challenges faced by existing personal micromobility solutions that must be resolved.

Battery Fires

Perhaps the most prevalent issue is battery fire due to the failure of individual cells or the battery management system (BMS). The London Fire Brigade reported 116 fires in 2022 caused by e-bike and e-scooter batteries, with occurrences becoming more frequent. At the start of 2023, emergency calls specifically regarding e-bike and e-scooter battery fires averaged as every other day.[2] Transport for London (TfL) has banned electric scooters, hoverboards, and skateboards from its services since 2021 due to a rise in fires.

Within modern micromobility batteries are an array of lithium-ion (Li-ion) 18650 cells linked together to provide the necessary charge capacity and voltage (usually 36V, 48V, or 52V). The electrolytes used within Li-ion cells are lithium salts. While lithium salts are ideal for this application, they are also volatile and flammable; as a result, lithium cells are extremely sensitive to temperature changes and can experience thermal runaway.

When a cell is compromised, either through damage, manufacturing defects, external heat, or over-charging/discharging, its temperature increases rapidly until it catches fire or explodes, igniting the rest of the battery pack and creating a runaway event. Furthermore, because the cathodes in Li-ion batteries contain oxygen, any fire is self-fueling and extremely hard to extinguish.

Maintaining Safety

While micromobility fires are far too common, they are almost completely restricted to devices at the lower end of the market, with mid- and premium-tier manufacturers having few to no cases of fires.

Designing Safe Batteries

To save costs, lower-end batteries often use a simple BMS designed only to balance the cells charging and discharging, with a fuse on the charging line and power outlet.

In comparison, higher-end models implement much more sophisticated safety measures, like those recommended by Littelfuse, which provides a wide range of solutions designed for e-bikes and other micromobility designs (Figure 2).

Figure 2: Littelfuse e-bike battery pack block diagram. (Source: Mouser Electronics)

Negative temperature coefficient (NTC) thermistors are recommended within its battery block diagram, such as the Littelfuse KC Series, which can be used to monitor the temperature of cells independently, allowing for microcontrollers to act before thermal runaway can occur.

These are used alongside battery-level overcurrent and overvoltage protection devices, including the compact surface mount 0805L Series polymeric positive temperature coefficient device (PPTC), while Littelfuse ITV Battery Protectors allow for additional protection (Figure 3).

Figure 3: Littelfuse ITV battery protectors. (Source: Mouser Electronics)

Sitting between the combined cells output and the BMS unit, the ITV battery protectors are a fast-responding and cost-effective surface-mount solution designed to cut the circuit when an IC or field-effect transistor (FET) detects an overvoltage.

Conclusion

Micromobility fires present a considerable risk to consumers and dent confidence in the market. To guarantee the safety of Li-ion batteries, designers must include multiple safety measures throughout the battery, targeting voltage, current, and temperature at both the battery pack and cell level. In addition, rigorous third-party testing and complying with local regulations help ensure designs are less likely to fail, and if they do, they fail in a safe manner, preventing thermal runaway.

In the final blog of this series, we will explore the future of micromobility.

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Along with Microchip’s Mi-V ecosystem, new device family helps system designers to lower power, size and weight and speed time to market

Developers of spacecraft electronics utilize radiation-tolerant (RT) field programmable gate arrays (FPGAs) to ensure high performance, reliability, power-efficiency and the best-in-class security for emerging space domain threats. To take it a step further and help provide fast, cost-effective software customization, Microchip Technology (Nasdaq: MCHP) has introduced the RT PolarFire® system-on-chip (SoC) FPGA. Developed on Microchip’s RT PolarFire FPGA, it is the first real-time Linux® capable, RISC-V-based microprocessor subsystem on a flight-proven RT PolarFire FPGA fabric.

With today’s announcement, developers can now start designing using the commercially available PolarFire SoC (MPFS460) device and Libero® SoC development tools. Along with Microchip’s extensive Mi-V ecosystem, PolarFire SoC solution stacks, the PolarFire SoC Icicle Kit or the PolarFire SoC Smart Embedded Vision Kit, developing lower power solutions for the challenging thermal environments seen in space can happen today.

Safety-critical systems, control systems, space and security applications need the flexibility of the Linux Operating System (OS) and the determinism of real-time systems to control hardware. RT PolarFire SoC FPGAs feature a multi-core Linux-capable processor that is coherent with the memory subsystem. The RT PolarFire SoC enables central satellite processing capabilities similar to those in single board computers which are common in the space industry for command and data handling, in platform avionics and in payload control. The SoC allows for flexible implementation of highly integrated designs, customization and evolution of function while improving size, weight and power considerations.

Systems deployed in space are subjected to harsh radiation, prompting design methodologies that can provide protection for the most critical radiation-induced upset types. Unlike SRAM FPGAs, the RT PolarFire SoC is designed for zero configuration memory upsets in radiation, eliminating the need for an external scrubber and reducing the total system cost. Satellites are designed to deliver both peak and average power and to dissipate heat through conductive paths, namely metal. Starting with a SoC FPGA that can reduce your power consumption by up to 50 percent simplifies the entire satellite design, allowing designers to focus on the mission at hand.

“By delivering the design ecosystem for the industry’s first RISC-V-based radiation-tolerant SoC FPGA, Microchip is driving innovation and giving designers the ability to develop a whole new class of power-efficient applications for space.” said Bruce Weyer, corporate vice president for Microchip’s FPGA business unit. “This will also allow our clients to add enhanced edge compute capabilities to aerospace and defense systems.”

Microchip’s comprehensive Mi-V ecosystem helps designers slash time to market by providing support for symmetric multiprocessing (SMP) rich operating systems like Linux, VxWorks®, PIKE OS and more real time operating systems like RTEMS and Zephyr®. Mi-V is a comprehensive suite of tools and design resources, developed with numerous third parties, to support RISC-V designs. The Mi-V ecosystem aims to increase adoption of the RISC-V instruction set architecture (ISA) and support Microchip’s SoC FPGA portfolio.

The RT PolarFire FPGA has already received the Qualified Manufacturers List (QML) Class Q designation based on specific performance and quality requirements as governed by the Defense Logistics Agency. There is also a clear path for this device to achieve QML Class V qualification, the highest qualification standard for space microelectronics.

For more than 60 years, Microchip’s solutions have powered space flight missions. Building on a history of providing reliable, low-power SONOS-, Flash- and antifuse-based FPGAs in the industry, the company works to help streamline the design of high-speed communications payloads, high-resolution sensors and instruments and flight-critical systems for Low Earth Orbit (LEO), deep space or anything in between. To learn more, visit Microchip’s radiation-tolerant FPGA page.

Availability of Development Tools

Customers can start designs now with the development tools and boards provided for the commercial equivalent PolarFire SoC. For more information, visit the PolarFire SoC page.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image:

https://www.flickr.com/photos/microchiptechnology/53640600685/sizes/l/

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Real-time application awareness from next-gen DPI engine R&S®PACE 2 to power traffic aggregation and optimization algorithms in XipLink’s multi-path hybrid networking solution

ipoque, a Rohde & Schwarz company and a leading provider of next-gen deep packet inspection (DPI) software for networking and cybersecurity solution providers, today announced that it is partnering with XipLink, a leading global technology provider of optimized, secure and intelligent multi-path hybrid networking. The technology partnership sees the creation of the XipLink Application Classification Engine (XipACE) by integrating ipoque’s cutting-edge DPI technology R&S®PACE 2 into the XipLink operating system (XipOS), delivering advanced application visibility for multi-orbit networking.

Layer 7 visibility for multi-orbit networking

Leveraging standards-based SCPS protocol acceleration, link bonding, Layer 2 switching and Layer 3 routing, XipLink delivers intelligent multi-orbit networking that ensures network performance and QoS across satellite, cellular and wireless networks. Embedding the next-gen DPI software R&S®PACE 2 introduces traffic visibility up to Layer 7 and beyond, powering the traffic aggregation and optimization algorithms used by XipLink. “Instantaneous identification of protocols and applications enables intelligent and contextual routing policies that are aligned to the criticality of the underlying applications and prevailing network conditions,” said Dr. Martin Mieth, VP Engineering at ipoque. Prior to R&S®PACE 2, XipLink relied on its built-in classification engine that supported network traffic visibility only up to Layer 4.

R&S®PACE 2 combines behavioral, statistical and heuristic analysis with metadata extraction to accurately and reliably identify protocols, applications and application attributes in real time. “Our breakthrough AI-based encrypted traffic intelligence, which includes machine learning and deep learning techniques, and high-dimensional data analysis, brings traffic awareness to the next level by identifying any type of IP traffic, despite encryption, obfuscation and anonymization,” said Dr. Mieth.

“We are thrilled to announce our partnership with ipoque to integrate their cutting-edge DPI software, R&S®PACE 2, into our XipOS product. The inclusion of R&S®PACE 2 underscores our dedication to delivering top-tier solutions to our customers who require enterprise-grade quality and efficiency,” said Jack Waters, CEO, XipLink. “Application-aware networking plays a crucial role in optimizing network resources, enabling us to meet the escalating demands while ensuring compliance with SLAs,” added Waters.

Delivering high-performance networks

By tapping into R&S®PACE 2’s high throughput and light-weight, efficient software form-factor, XipACE is able to augment the performance of its core functions, which include QoS management, traffic analytics, steering decisions, load balancing and dynamic link bonding. Apart from performance and scalability, XipLink’s selection of ipoque’s R&S®PACE 2 is also driven by the engine’s extensive feature and plug-in set, such as first packet classification, customizability of app signatures or tethering detection. “ipoque provides us with a proven technology that has been tested in challenging network environments. Its weekly updated signature library ensures that we keep tabs on the latest traffic trends.” said Jaco Botha, SVP Product at XipLink.

Driving the responsiveness and resilience of multi-orbit networks

From offloading traffic from congested pathways to tapping into GEO satellites to alleviate latency issues, insights from R&S®PACE 2 enable XipOS to support network diversity and resilience. At the policy level, it enables application prioritization and SLA compliance. With a growing number of applications that are bandwidth-hungry and latency-sensitive, R&S®PACE 2’s granular traffic analytics help operators to optimize their networks continuously and improve resource efficiency. The insights also pave the way for autonomous and self-healing networks via data-driven decision making. DPI analytics also support hybrid aggregation of GEO and NGSO, enabling XipOS to improve network scalability and security. “The partnership strengthens our position as the most efficient link aggregation and optimization solution in the market, especially in addressing networks that comprise constrained wireless links such as LEO services,” added Sasmith Reddi, SVP Marketing at XipLink.

The new partnership will boost XipLink’s multi-orbit networking portfolio, benefiting customers in various verticals including mobile, satellite, maritime, government and defense, as well as modem OEMs.

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Sushil Motwani, Founder, of Ayetexcel Pvt. Ltd. writes about the environmental impact of electronic waste and how smart projectors can help mitigate it 

Sushil Motwani, Founder, Ayetexcel Pvt. Ltd.

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Lithium-ion batteries are a crucial enabler in the ongoing global quest to electrify the transportation sector. While lithium-ion batteries are not the only solution for mobile energy (hydrogen-based fuel cells are also highly promising for certain applications) they appear certain to play a key role in vehicle electrification for years to come. Compared to other chemical batteries such as nickel-metal hydride (NiMH), lithium-ion batteries offer 50%+ greater capacity by weight.

To Download the Whitepaper Please Fill in the Form. >>>>

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Author: STMicroelectronics 

STM32CubeMX 6.11 is a new milestone as it allows developers to use the unique features of the new STM32H7R and STM32H7S. The software also continues to simplify development on STM32 by offering popular USB middleware previously bound to an OS. Similarly, it is the first version of CMake, which will significantly optimize workflows. STM32CubeMX thus continues to stand as the reference application for STM32 developers thanks to its UI that removes complexity and increases the accessibility of the STM32 ecosystem. Furthermore, the new version inaugurates support for the NUCLEO-U031R8, NUCLEO-U083RC, NUCLEO-H7S3L8, NUCLEO-H533RE.

What’s new in STM32CubeMX 6.11 Support for the STM32H7R and STM32H7S

STM32CubeMX 6.11 is a crucial update for the new STM32H7R and the STM32H7S MCUs because the software helps take advantage of their memory capabilities. Indeed, the devices have a smaller flash, which makes them the most cost-effective STM32H7. Since the device targets applications that must use external storage, the new memory can help significantly lower the bill of materials. Additionally, to make the embedded flash even more meaningful, ST introduced the boot flash, which stores the entire boot sequence, thus replacing the ROM we see on MCUs. Consequently, the embedded storage becomes even more flexible and practical since it isn’t only used for application, but boot, and initialization as well.

To make the boot flash more accessible, we are exposing the feature on STM32CubeMX. Put simply, the GUI will help developers configure the embedded flash to take advantage of its boot capabilities. Similarly, since the STM32H7R and STM32H7S will be used in systems with external memory, STM32CubeMX can set up an external loader so applications like STM32CubeProgrammer can program those discrete flash modules directly. It will also help developers load the main application in the embedded memory and the rest of the system in the external one.

Support for USBX middleware

The new version of STM32CubeMX adds support for the USBX middleware in a bare metal environment. USBX is a software stack that enables the use of a USB host or device. Until now, developers who wanted to use it had to install ThreadX RTOS. The problem is that if teams wanted to do away with the operating system to optimize their system, they couldn’t use USBX. Thanks to STM32CubeMX, it is now easier to include the right middleware into projects.

Make project generation

STM32CubeMX 6.11 inaugurates its support for CMake, an open-source suite of tools that allow developers to build, test, and package their software. It’s especially useful in large multi-platform projects because it helps streamline large workflows. The current CMake support current focuses on applications that run on a single-core MCU and do not use Trustzone. Over time, we will continue to update our CMake support to allow STM32CubeMX to generate projects for more STM32 microcontrollers.

What is STM32CubeMX?

STM32CubeMX is a graphical tool that helps developers generate code that initializes a microcontroller and its application. Users get an interface to configure the MCU’s pinout, resolve conflicts, and set up hardware peripherals and middleware. Users can also configure the clock tree and benefit from a wizard that automates specific calculations. Similarly, it can help set up and tune the DDR on STM32 MPUs. The tool also helps select MCUs or MPUs and download their software packages. Hence, it’s very often the first point of contact with developers. The tool is available in STM32CubeIDE or as a standalone download.

STM32CubeMX also assists developers in other parts of their job. For instance, finding the proper documentation can be tricky, especially with such a vast library. ST is famous for its extensive documentation, and partners tell us that it’s one of the reasons they select our devices. Hence, we offer tutorial videos within the standalone version of STM32CubeMX to help developers search for information. We offer content on configuring the clock tree, the pins, or different software features. Programmers who are new to our tools can start their application quicker, thus further lowering the barrier to entry and reducing friction.

For readers who may be less familiar with STM32CubeMX, here is a rundown of some of the features we’ve released in the past.

A UI for quick feature access

Embedded system developers must grasp the numerous layers of abstractions within their ecosystem. A typical PC or mobile app developer can do all their work with only one or very few high-level languages and scripting frameworks. Conversely, working with a microcontroller forces teams to consider the many existing layers. For instance, a team looking for the ultimate optimizations will work as close to the metal with low-level code. However, those looking for a more practical approach that can still yield excellent performance will use our hardware abstraction layer (HAL), and those with a priority on rapid development will use our board support package (BSP), which abstracts the HAL.

However, too many embedded ecosystems fail to understand that the higher the abstraction, the more developers seek convenience. Indeed, if teams must spend hours or even days setting up an abstraction layer, it becomes pointless. Consequently, CubeMX 6.10.0 introduced a new UI that helps initialize our BSP functions under “New Projects” -> “Start My Project”. The UI currently works with only a few of our newest development platforms (NUCLEO-C031C6, as well as NUCLEO-H563ZI and NUCLEO-U5A5ZJ-Q when TrustZone is disabled), but our teams are working to support more development boards over time.

Let’s take the example of a blinking light demo on the NUCLEO-H563ZI. The first step is to ensure that at least USER LED GREEN is selected in the Human Machine Interface dropdown menu. When choosing this option in the new UI, the system automatically commits the right pins, instead of just suggesting which pin to use and sets up the HAL so developers can immediately use the BSP function to toggle the LED on or off. Hence, users simply have to push the GENERATE CODE button on the top right side and open the main.c file in Core/Src/ to see the BSP_LED function initialized and ready to use in the main function and ready for use in the while loop.

Additionally, ST included a “Generate demonstration code” option, which adds comments and examples in the generated main C file. Hence, beyond automating the initialization process, the new UI can also serve as a guide for new developers who can open their new files and see how to toggle a light on and off, for instance. Consequently, even a developer with a cursory knowledge of C can run a blinking light application with minimal coaching. In a nutshell, the new version of STM32CubeMX aims to make embedded systems more accessible, even to those with minimal experience in the field.

No admin rights required

With version 6.10.0, STM32CubeMX for Windows managed to do away with the admin privilege requirement. Previously, the operating system would ask for the admin password when installing the utility. Now, thanks to a reworking of the installation process, Windows no longer asks for admin permissions, which is a tremendous help for users with a locked-down computer. Often, corporations lock their machines to prevent hacks or misuse, and it can be very cumbersome to ask the administrator to authorize an installation. STM32CubeMX 6.10.0 solved that. The Linux and macOS versions of STM32CubeMX don’t suffer the same issues due to how each operating system manages user privileges.

New support for the STM32H5 and STM32MP13

STM32CubeMX is often the first utility developers launch when working on their STM32 MCU because it lets them initialize their device, select the correct firmware package, configure the clock tree, and more. As a result, ST aims to add support for our latest devices continuously. For instance, this new version is compatible with the ability to generate files for secure projects running on our new STM32H5, which introduces new security safeguards. Similarly, STM32CubeMX now provides a memory management tool for the STM32WB and STM32WBA MCUs. The latter is also getting options to support its Thread, Zigbee, and 802.15.4 millimeter wave RF functionalities. Finally, as promised, we are also adding RTOS support for the new STM32MP13.

Memory Management Tool (MMT)

STM32CubeMX comes with a Memory Management Tool. The graphical user interface vastly facilitates the configuration of registers on devices like the STM32H5 or STM32U5, among others. For instance, it can help set up a device to use TrustZone, a secure environment, or a memory protection unit with only a few clicks. Previously, developers had to figure out which registers governed what function. The new MMT removes much of the complexity to create a far more intuitive experience. Furthermore, as STM32CubeMX 6.10.0 shows, we continue to bring the MMT to new STM32 devices.

Boot Path Management

The Boot Path Manager facilitates the configuration of the new boot loader available on the STM32H5. The latest mainstream MCU from ST supports an immutable root of trust (iRoT) and an updatable root of trust (uRoT). Depending on their security needs, developers can choose to use both, one or none. STM32CubeMX makes this possible by helping users select their configuration from a menu, automatically generate keys, and set up the boot path to secure the microcontroller. As STM32H5 development boards are increasingly available, we ensure that STM32CubeMX can help them take advantage of the new features.

Secure Manager

Secure Manager is another critical feature announced in early 2023 that is now accessible from STM32CubeMX. Secure Manager is our first Trusted Execution Environment. As part of the STM32 Trust initiative, it includes binaries and can help with certification at the system level. As a result, customers targeting a SESIL & PSA Level 3 Certification can vastly hasten their qualification process. In a nutshell, developers use STM32CubeMX to set up all the functionalities in Secure Manager, and the system then uses a scripting mechanism relying on the latest version of STM32CubeProgrammer CLI to configure the MCU.

Pre- and post-flight scripts

ST added pre- and post-flight scripting capabilities in STM32CubeMX to automate various tasks. Put simply, users can ask the application to launch scripts before and after it performs a code generation to adapt to the needs of expert users. For instance, a programmer could automatically copy files to a new folder or send them to GitHub before they are erased by the new files generated. It would enable engineers to keep a history of their configuration in case they’d like to revert to a previous state. Similarly, a post-flight script could add the newly generated files to a project and launch an IDE.

Authentication STM32CubeMX

STM32CubeMX requires users to log in to their my.ST.com account before downloading a package, which may perplex some in our community. Previously, users had to leave the application, go to ST.com, and enter their credentials when downloading a piece of software. A few versions ago, STM32CubeMX created a more cohesive experience by ensuring users don’t have to leave the software. However, it does mean asking for their credentials. However, it’s still possible to use STM32CubeMX without an account until that point

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Easily Incorporate Embedded Security Using Microchip’s PIC32CK 32-bit Microcontrollers with Hardware Security Module

The new legislation takes effect in 2024, mandating stricter requirements on cybersecurity on everything from consumer IoT devices to critical infrastructure. Meeting these new security compliance requirements from a product and supply chain perspective can be complex, costly and time-consuming. To provide developers with an embedded security solution that allows them to design applications that comply with these requirements, Microchip Technology announces the new family of PIC32CK 32-bit microcontrollers (MCUs) with an integrated Hardware Security Module (HSM) subsystem and Arm Cortex-M33 core featuring TrustZone technology to help isolate and secure the device.

The PIC32CK SG is the first 32-bit device on the market that combines the strong security of an HSM with TrustZone technology, a hardware-based secure privilege environment. Microchip’s latest innovation for mid-range MCUs provides designers with a cost-effective embedded security solution for their products that meets the latest cybersecurity mandates. The inclusion of an HSM provides a high level of security for authentication, secure debug, secure boot and secure updates, while TrustZone technology provides an additional level of protection for key software functions. The HSM can accelerate a wide range of symmetric and asymmetric cryptography standards, true random number generation and secure key management.

The PIC32CK MCUs from Microchip are designed to support ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards. For increased flexibility and cost efficiency, the PIC32CK MCU family offers a wide range of options to tune the level of security, memory and connectivity bandwidth based on the end application’s requirements. Options include up to 2 MB dual-panel Flash and 512 KB SRAM, with various connectivity options like 10/100 Ethernet, CAN FD and USB.

“Emerging requirements make security mandatory for the majority of IoT-connected devices. The PIC32CK makes it cost-effective to provide hardware-based security to mid-range microcontroller applications,” said Rod Drake, corporate vice president of Microchip’s MCU32 and MPU32 business units. “Microchip’s ecosystem of tools and security expertise help our customers navigate the complexities of the new requirements and provide lifecycle support for their products.”

For product supply chains that require additional security and safety protection such as in industrial designs, medical devices, home appliances and consumer IoT devices, the PIC32CK will be supported with Microchip’s Trust Platform Design Suite for provisioning as a service. This platform enables the secure factory provisioning of keys, certificates and IP without the need to reveal these secrets within the supply chain.

Development Tools

The 32-bit PIC32CK MCU family is supported by Microchip’s software platforms including MPLAB Harmony v3 and Trust Platform Design Suite. The PIC32CK family is also supported by the PIC32CK SG and PIC32CK GC Curiosity Ultra Development Boards including the EV33A17A and EV44P93A.

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