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In booth C4107 at the European Conference on Optical Communication (ECOC 2025) in Copenhagen, Denmark (29 September–1 October), TRUMPF Photonic Components GmbH of Ulm, Germany (part of the TRUMPF Group) — which makes vertical-cavity surface-emitting lasers (VCSELs) and photodiodes for datacoms — is showcasing linear performance of its new PAM4 100Gbps, 850nm multimode VCSEL in collaboration with customer Optomind Inc of Suwon, South Korea, which provides optical interconnect solutions for data centers including artificial intelligence (AI) and high-performance computing (HPC) networks. Along with the VCSEL, TRUMPF also offers a 100G wideband (842–948nm) photodiode that can be used to further optimize the link...

In a live demo in booth C4107 at the European Conference on Optical Communication (ECOC 2025) in Copenhagen, Denmark (29 September–1 October), TRUMPF Photonic Components GmbH of Ulm, Germany (part of the TRUMPF Group) is unveiling its new 100G vertical-cavity surface-emitting laser (VCSEL)...

Motorola’s 68000 blended 32-bit power with a 16-bit bus, creating a balanced, orthogonal, and elegant architecture that powered everything from Macintosh to arcade machines.

Edge AI—enabling autonomous vehicles, medical sensors, and industrial monitors to learn from real-world data as it arrives—can now adopt learning models on the fly while keeping energy consumption and hardware wear under tight control.

It’s made possible by a hybrid memory system that combines the best traits of two previously incompatible technologies—ferroelectric capacitors and memristors—into a single, CMOS-compatible memory stack. This novel architecture has been developed by scientists at CEA-Leti, in collaboration with scientists at French microelectronic research centers.

Their work has been published in a paper titled “A Ferroelectric-Memristor Memory for Both Training and Inference” in Nature Electronics. It explains how it’s possible to perform on-chip training with competitive accuracy, sidestepping the need for off-chip updates and complex external systems.

 

The on-chip memory conundrum

Edge AI requires both inference for reading data to make decisions and learning, a.k.a. training, for updating models based on new data on a chip without burning through energy budgets or challenging hardware constraints. However, for on-chip memory, while memristors are considered suitable for inference, ferroelectric capacitors (FeCAPs) are more suitable for learning tasks.

Resistive random-access memories or memristors excel at inference because they can store analog weights. Moreover, they are energy-efficient during read operations and better support in-memory computing. However, while the analog precision of memristors suffices for inference, it falls short for learning, which demands small, progressive weight adjustments.

On the other hand, ferroelectric capacitors allow rapid, low-energy updates, but their read operations are destructive, making them unsuitable for inference. Consequently, design engineers face the choice of either favoring inference and outsourcing training to the cloud or carrying out training with high costs and limited endurance.

This led French scientists to adopt a hybrid approach in which forward and backward passes use low-precision weights stored in analog form in memristors, while updates are achieved using higher-precision FeCAPs. “Memristors are periodically reprogrammed based on the most-significant bits stored in FeCAPs, ensuring efficient and accurate learning,” said Michele Martemucci, lead author of the paper on this new hybrid memory system.

How hybrid approach works

The CEA-Leti team developed this hybrid system by engineering a unified memory stack made of silicon-doped hafnium oxide with a titanium scavenging layer. This dual-mode memory device can operate as a FeCAP or a memristor, depending on its electrical formation.

In other words, the same memory unit can be used for precise digital weight storage (training) and analog weight expression (inference), depending on its state. Here, a digital-to-analog transfer method, requiring no formal DAC, converts hidden weights in FeCAPs into conductance levels in memristors.

The hardware for this hybrid system was fabricated and tested on an 18,432-device array using standard 130-nm CMOS technology, integrating both memory types and their periphery circuits on a single chip.

CEA-Leti has acknowledged funding support for this design undertaking from the European Research Council and the French Government’s France 2030 grant.

Related Content

• Speak Up to Shape Next-Gen Edge AI
• AI at the edge: It’s just getting started
• Will Memory Constraints Limit Edge AI in Logistics?
• Two new runtime tools to accelerate edge AI deployment
• For Leti and ST, the Fastest Way to Edge AI Is Through the Memory Wall

The post Hybrid system resolves edge AI’s on-chip memory conundrum appeared first on EDN.

Took a 10s charger and slapped a 1800w boost converter on it that has cc/cv and goes up to 125v DC. Just need to add XT30/60 and 90 contacs on it so that I have different options for different batteries. Going to change out the 10s charger for a 1500w power supply and add a volt/amp/WH display and change the pot on cc for a similiar one that i have changed the cv pot for allready and put a 800w buck converter that has CC/CV to be able to charge smaller batteries than 10s also. submitted by /u/Whyjustwhydothat [link] [comments]

There are various ways to construct a motor, and the properties of that motor will depend on the construction choice. The series motor configuration has some desirable properties, but it can become quite dangerous to use if proper safety precautions are overlooked.

“Motors,” per se, is a complex subject. Variations in motor designs abound and lie well outside the scope of this essay. Rather, the goal here is to focus on just one aspect of one particular type of motor. To pay proper homage, Figure 1 shows three basic motor designs.

Figure 1 The three basic DC motor types, this article focuses on DC series motor.

Readers may study the first two at their leisure, but we will focus on the DC series motor highlighted in green and begin with an examination of its basic structure.

The DC series motor

A magnetic field is required. That field is provided by current-carrying coils that are wound over steel structures called “poles”. The number of poles may vary from design to design. Simple-mindedly, Figure 2 shows three examples of pole design: two poles, four poles, and six poles. Note the alternation of north (N) and south (S) magnetic polarities.

The armature is shown as a setup for four (Figure 2) paralleled paths of wires that are insulated from each other but tied at their ends. In the example shown, there are twenty-four armature conductors arranged in six groups of four conductors, or in four parallel paths, each.

Figure 2 The DC series motor structure showing two, four, and six poles with alternating N and S polarities.

It is conventional to use the letter “Z” to represent the number of armature conductors (twenty-four as shown) and the letter “A” to represent the number of paralleled conductors (four as shown) in each path. Please do not be confused by the fact that this “Z” does NOT refer to an impedance and that this “A” does NOT refer to an area.

As shown in Figure 3, we now look at the circuit of this structure.

The field coils, wrapped around each pole, are connected in series to form the field coil.

The armature conductor groups are wired in series, with their returns being made through the center of the armature, where their wire movement is slowest. By contrast, the outermost sections of the armature conductor groups move quite rapidly as they cross the magnetic flux lines of the poles and since they are all connected in series, they generate a summation voltage called the “back electromotive force” or the “back EMF”.

Figure 3 The DC series motor equivalent circuit, the series connections of the outermost sections of the armature conductor generating back EMF.

The current flowing in the field coil and the current flowing in the armature is the same current. There is no other place for the current to flow. The available torque of a DC series motor is therefore proportional to the square of that current. By using really heavy and large conductors for both, that current can be made very large, and the available torque can be made very high. Such motors are used in high torque applications such as engine starters, in heavily loaded and slow-moving lifting cranes, commuter railroad cars, and other such applications.

The governing equation for generating back EMF is as follows in Figure 4.

Figure 4 The governing equation for back EMF, where the back EMF equals the total magnetic flux multiplied by the rotational speed multiplied by the number of series-connected armature groups.

The total magnetic flux equals the flux per pole times the number of poles. The back EMF equals the total magnetic flux multiplied by the rotational speed multiplied by the number of series-connected armature groups, which, for our present example, will be six for our six-pole magnetic structure.

Connect the load!

Now comes the crucial point to remember about DC series motors.

For safety’s sake, no DC series motor should ever be operated without a mechanical load. A DC shunt motor or a DC compound motor can be safely operated without a mechanical load (separate discussions), but a DC series motor CANNOT be safely operated that way. 

When the DC series motor is operating, there will be some back EMF generated in the armature as shown in Figure 4. That back EMF will act in opposition to the input voltage in determining the field and armature current, as shown in Figure 3 and as follows:

However, suppose a DC series motor is allowed to run without a mechanical load as the DC series motor undergoes rotary acceleration and starts to gain rotational velocity. In that case, a current flow exists for which some measure of torque exists for which there will be some measure of angular acceleration. With no mechanical load, the rotor will always be rotationally accelerating and gaining in rotational velocity because there is then no load to take rotational energy away from that rotating armature.

As the armature accelerates, the back EMF tends to rise, which lowers the current flow, which lowers the magnetic flux, which lowers the torque, but the flux and the torque do not go to zero, and the rotational velocity will continue to rise. The rotational velocity will keep increasing, tending toward further raising the back EMF, which further reduces the current flow, which further reduces the magnetic field as the rotational velocity continues to increase, and so on and so on, but it is in a vicious cycle of rotary speed-up that constitutes a runaway condition. If there is no mechanical load on the armature, there will be no upper limit on the armature’s speed of rotation, and the DC series motor can and will destroy itself.

A story

It is stridently recommended that any mechanical load being driven by a DC series motor be coupled to that motor by a gear mechanism and never by a belt because a belt can break. If such a break occurs, the DC series motor will have no mechanical load, and as described, it will run away with itself.

This issue was taught to my class by my instructor, Dr. Sigfried Meyers, when I was in Brooklyn Technical High School in Brooklyn, NY. There was a motor lab area. Dr. Meyers told us of one day when there was no faculty supervision at hand, several students snuck into that lab and decided to hook up a lab motor in a series motor mode with no mechanical load. When they applied power, the motor did exactly as Dr. Meyers had warned that it would do, and the motor was destroyed.

As Mr. Spock would put it on Star Trek, that was “an undesirable outcome”.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

 Related Content

• Brushless DC Motors – Part I: Construction and Operating Principles
• DC Motor Drive Basics – Part 1: Thyristor Drive Overview
• Electric motor: types, operation modes
• Speed Control Unit Designed for a DC Motor

The post DC series motor caution appeared first on EDN.

Led by STMicroelectronics of Geneva, Switzerland, the STARLight consortium — consisting of 24 technology companies and universities from 11 European Union countries — has been selected by the European Commission under the EU CHIPS Joint Undertaking initiative...

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As cities move toward electric mobility and smarter infrastructure, seamless and safe power delivery is more important than ever. Shivam Rajput, Founder and CEO of ElectraWireless, is pioneering wireless electricity solutions that reduce EV downtime, extend fleet lifecycles, and power devices without cords or plugs. Combining advanced materials science, adaptive resonant coupling, and smart thermal management, his innovations aim to make wireless power scalable, safe, and efficient. In this conversation with ELE Times, he shares lessons from pilots, technological breakthroughs, and how India could benefit from cost-effective, large-scale wireless EV infrastructure.

Excerpts:

ELE Times:  What implications does wireless electricity have for EV adoption, safety, and the broader global energy transition?

Shivam Rajput: Wireless electricity isn’t just about convenience, it addresses real consumer challenges and can help the EV market thrive. EV adoption today is often slowed by downtime, manual charging, connector wear, and safety concerns. Consumers want simple, safe, and sustainable solutions, not just car features. Wireless electricity ensures EVs charge automatically at parking spots or even while moving, maintaining battery health and keeping vehicles ready at all times. Beyond EVs, homes, workplaces, and cities become safer with fewer exposed wires and connectors, reducing the risk of accidents and outages. This technology also minimizes energy waste, making it a crucial step in the global energy transition.

ELE Times: What are the key breakthroughs that have enabled high-power wireless electricity transmission through everyday surfaces like wood, quartz, or automotive-grade materials?

Shivam Rajput: Our system delivers power only when needed, without heating surfaces or wasting energy. Materials innovation allows seamless integration into wood, quartz, automotive-grade panels, and other common surfaces. Safety is ensured through foreign object detection, which automatically halts transmission if anything interferes. For autonomous systems, from robotics to EVs, devices no longer need to stop to plug in; they charge automatically wherever transmitters are installed. These breakthroughs make high-power wireless electricity scalable, safe, and efficient across multiple sectors.

ELE Times:  What lessons emerged from pilots in robotics, kitchens, and workplace environments, and how are they shaping your approach to scaling the technology?

Shivam Rajput: Pilots highlighted three critical lessons: seamless integration, safety, and efficiency. In smart kitchens, multiple appliances operated wirelessly without interference, showing the importance of modular design. Workspaces benefited from embedded, unobtrusive power, improving usability and safety. In robotics and autonomous systems, wireless charging dramatically reduced downtime, enabling continuous operation and boosting productivity. Eliminating manual plug-ins also reduces electrical faults, making devices safer for children and workplaces. These insights inform a scalable platform ready for enterprise-level and consumer applications.

ELE Times:  In what ways could wireless charging reduce downtime and extend the lifecycle of EV fleets?

Shivam Rajput: Wireless charging allows EVs to charge in motion or at strategically located parking spots, reducing wear on connectors and preserving battery health. Fleets can operate longer, with fewer interruptions, while maintenance costs decrease. This contactless approach accelerates operations and reduces total cost of ownership, making EV fleet management more efficient and sustainable.

ELE Times:  Can wireless power assist in building scalable, cost-effective EV infrastructure in countries such as India?

Shivam Rajput: India is one of the most promising markets for EV adoption. Our retrofit-friendly wireless system integrates with existing grids, lowering installation complexity and costs. By embedding chargers into roads, parking spots, or city infrastructure, EVs can charge seamlessly while driving or parked, what we call “monorail charging.” This approach enables large-scale adoption, ensures reliability, and reduces safety risks associated with exposed connectors. The system supports faster EV market growth while building a sustainable, energy-efficient infrastructure.

ELE Times: What technological advances from ElectraWireless enabled them to scale the transmission of wireless power from as low as 5W all the way up to 40kW?

Shivam Rajput: Adaptive resonant coupling, dynamic field shaping, and smart thermal management allow safe and efficient power delivery across surfaces, from small electronics to EVs. Foreign object detection ensures absolute safety during transmission. Precision energy delivery reduces waste and maintains high efficiency for continuous operation. These advances unlock a fully scalable wireless electricity ecosystem, enabling applications in robotics, kitchens, workspaces, and urban EV infrastructure.

The post Wireless Electricity Paves the Way for India’s Sustainable EV Ecosystem appeared first on ELE Times.

💥 Інформаційний захід для науково-педагогічних працівників від DAAD Інформація КП пт, 09/26/2025 - 12:35

Satellites, spacecraft, and defense systems rely on increasingly complex software ecosystems that integrate open-source, third-party, and legacy components. Recent cybersecurity events have highlighted how vital it is to track, secure, and manage these software supply chains.

The Risk of Vulnerable Third-Party Components

At Black Hat 2025, some very serious vulnerabilities were discovered in some of the most commonly used platforms for satellite control: Yamcs, OpenC3 Cosmos, and NASA’s cFS Aquila. Such flaws-range from remote code execution, denial of service, weak encryption to manipulation of satellite operations-force criminals into changing orbital paths or stealing cryptographic keys, usually without even detection.

Even seeming-to-be-secure encryption libraries such as CryptoLib-which NASA uses-were found to harbor multiple critical vulnerabilities. Exploiting these, attackers could crash the onboard software, reset its security state, or compromise encrypted communications. These findings reinforce that third-party components remain among the easiest risks to exploit in aerospace and defense software.

SBOMs: Ensuring Transparency Across the Software Stack

Software Bill of Materials lists all components within a system involved. In practice, it finds vulnerabilities, manages risk, considers compliance, and goes into incident response. The SBOM can be only as good as its accuracy, completeness, or governance structure.

In other words, to improve security posture, an organization must hold centralized processes for the validation, enrichment, and continuous surveillance of SBOMs, so that both upstream ones (those from development) and downstream ones (those from deployed systems) are held accountable, validated, and acted upon.

Closing the Gaps

Modern SBOM platforms, such as Keysight’s solutions, enhance binary similarity checks and code emulation to detect components when source information is partial or missing. This allows SBOMs to be reliably created for firmware and software or for container images so that no single component-in whatever form it exists-goes untracked.

Hence, giving full visibility, rigorous validation, and operational governance serve systems in aerospace and defense better in recognizing vulnerabilities, quick incident response, and establishing trust across software supply chains. This closes critical gaps while trying to keep mission-critical systems safe from the ever-evolving cyber threats.

(This article has been adapted and modified from content on Keysight Technologies.)

The post Securing Aerospace & Defense Software: The Critical Role of SBOMs appeared first on ELE Times.

Electrochemical impedance spectroscopy (EIS) is a powerful technique for studying electrochemical systems such as electrochemical cells, batteries, fuel cells, corrosion protection setups, and sensors. By differentiating processes such as charge transfer across the electrode interface, diffusion, double-layer behavior, etc., by applying small sinusoidal signals generated in random magnitudes over a wide frequency range, we invoke responses from such mechanisms. Equivalent circuits in the traditional sense can conveniently give impedance data representations; however, they do not suffice when overlapping or nonideal processes come into play. Modern physics-based modeling approaches enable the researcher to consider adsorption, mass transport, and electrode surface effects far beyond simple resistor–capacitor analogies.

EIS Real-Life Applications

Sensitivity renders EIS paramount for:

Batteries: Detects ion and electron transport at early stages of degradation and capacity fading.

Corrosion: Detects subtle interface changes between metal and electrolyte in pipelines, concrete, and marine structures.

Fuel Cells: Performance and durability improvements by separating contributions of catalyst layers, membranes, and reactant flows.

Sensors: Evaluates electrode interactions with target molecules, enabling applications like glucose monitoring.

The Limitations of Equivalent Circuits

For the simpler reactions, the impedance data frequently fit an elementary equivalent circuit: a resistor in series with a parallel resistor-capacitor pair. In a Nyquist plot, this will look like a neat semicircle corresponding to charge transfer resistance. However, rarely do real systems behave so nicely. Adsorption, diffusion, and electrode morphology will add time constants and overlapping processes with which the equivalent circuit cannot always keep up. Physics-based models are, therefore, chosen to solve the underlying electrochemical equations, thus providing a more accurate picture of how these processes may interrelate.

Consider the Nonidealities of EIS:

Important Factors

1. Adsorption–Desorption Dynamics

Intermediates may adsorb on electrodes during electrochemical reactions. The changing surface coverage may, over time, change the impedance response. For instance, with copper deposition, a progressive increase in coverage of additives changes the spectra from two capacitive loops into one dominated by an inductive loop at low frequency. Such effects demonstrate the crucial nature of adsorption in the design of such systems.

2. Mass Transport Limitations

In fuel cells, the diffusion and convection of gases such as hydrogen and oxygen significantly affect performance. Through impedance plots, one can observe the changes in charge-transfer and diffusion contributions as functions of the operating potential:

• Distinct high- and low-frequency loops at intermediate voltages
• At low voltages, loops combine with overlapping time constants
• On the strongly cathodic side, diffusion is dominant, and a single huge loop appears

This sequence clearly demonstrates the ability of EIS to differentiate between reaction kinetics and transport limitations.

3. Electrode Surface Effects

Surface roughness and uneven geometries alter the effective electrochemical area, thus shifting the impedance response. Accounting for electrode structures helps render better predictions in situations where morphology is important.

Handling Residual Behaviors

Sometimes, the impedance response cannot be explained by referring to adsorption, diffusion, or surface structure. A constant phase element (CPE) is then introduced to incorporate frequency-dependent effects that deviate from an ideal capacitive behavior. From a mechanistic standpoint, (CPE)behave as systems in which the mathematical expression describing a single mechanism can be modified with a continuous parameter that accounts for system complexity.

Conclusion:

Electrochemical impedance spectroscopy has remained one of the most versatile electrochemical experimental probes, and by moving beyond the simple circuit analogy to include adsorption, diffusion limitation, and surface-effects, researchers gained a more realistic view of the system behavior. Modeling platforms such as COMSOL Multiphysics support these newer approaches, albeit all electrochemical disciplines offer a general foundation.

From extending battery lifetimes to detecting early corrosion, EIS when paired with detailed physical insights continues to unlock new possibilities for innovation and reliability in electrochemical technologies.

(This article has been adapted and modified from content on COMSOL.)

The post Beyond Equivalent Circuits: Capturing Real-World Effects in Electrochemical Impedance Spectroscopy appeared first on ELE Times.

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Three new microcontrollers from Renesas, Nuvoton, and STMicroelectronics cut power without compromising performance.

Зустріч студентів КПІ ім. Ігоря Сікорського із Сашею Мішо kpi чт, 09/25/2025 - 22:08

I got this UniFi AP-AC-HD from my school to try and repair. My teacher said he dropped it when renovating one of the classrooms. But sadly, it seems like the SOC got damaged. Spent a long time trying to debug it. PoE buck converter works, all voltages correct, but no CPU Activity whatsoever. Not even a clock signal on the flash chip. But hey, here we have its guts!! XD submitted by /u/FloTec09 [link] [comments]

Keysight’s new 170/250 GHz frequency extenders and calibration kit enable differential broadband testing for next-gen semiconductors and AI-era networks.

With the addition of 32-GHz, 43.5-GHz, and 54-GHz models, the R&S ZNB3000 series of vector network analyzers (VNAs) now covers a wider range of applications. The midrange family combines precision and speed in a scalable platform, extending RF component testing to satellite Ka and V bands and high-speed interconnects for AI data centers.

Beyond satellite and data center applications, the ZNB3000 also enables RF testing for 5G, 6G, and Wi-Fi. This makes it well-suited for both production environments and research labs working on next-generation technologies.

The ZNB3000 offers strong RF performance with up to 150-dB dynamic range and less than 0.0015-dB RMS trace noise. It also provides fast sweep cycle times of 11.8 ms (1601 points, 1 MHz to 26.5 GHz) and high output power of 11 dBm at 26.5 GHz. A 9-kHz start frequency enables precise time-domain analysis for signal integrity and high-speed testing.

Flexible frequency upgrades allow customers to start with a base unit and expand the maximum frequency later. ZNB3000 VNAs operating at the new frequencies will be available by the end of 2025.

ZNB3000 product page

Rohde & Schwarz 

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Rohm has introduced the DOT-247, a 2-in-1 SiC molded module that combines two TO-247 devices to deliver higher power density. The dual structure accommodates larger chips, while the optimized internal design lowers on-resistance. Package enhancements cut thermal resistance by roughly 15% and reduce inductance by about 50% compared with standard TO-247 devices. Rohm reports a 2.3× increase in power density in a half-bridge configuration, enabling the same conversion capability in nearly half the volume.

The 750-V and 1200-V devices target industrial power systems such as PV inverters, UPS units, and semiconductor relays, and are offered in half-bridge and common-source configurations. While two-level inverters remain standard, demand is growing for multi-level circuits—including three-level NPC, three-level T-NPC, and five-level ANPC—to support higher voltages. These advanced topologies often require custom designs with standard SiC packages due to the complexity of combining half-bridge and common-source configurations.

Rohm addresses this challenge with standardized 2-in-1 modules supporting both topologies, providing greater flexibility for NPC circuits and DC/DC converters. This approach reduces component count and board space, enabling more compact designs compared with discrete solutions.

Devices in the 750-V SC740xxDT series and 1200-V SCZ40xxKTx series are available now in OEM quantities. Samples of AEC-Q101 qualified products are scheduled to begin in October 2025.

Rohm Semiconductor 

The post 2-in-1 SiC module raises power density appeared first on EDN.

Parade Technologies’ PS8780 four-lane bidirectional linear redriver restores high-speed signals for active cables, laptops, and PCs. It supports USB4v2 Gen 4, Thunderbolt 5, and DisplayPort 2.1 Alt Mode, and is pin-compatible with the PS8778 Gen 3 redriver.

The redriver delivers USB4v2 at up to 2×40 Gbps symmetric or 120 Gbps asymmetric, TBT5 at 2×41.25 Gbps, and DP 2.1 UHBR20. It provides full USB4, USB 3.2, and DP 2.1a power management, including Advanced Link Power Management (ALPM). Its low-power design and Modern Standby support extend battery life in mobile devices and reduce energy use in active cables.

The PS8780 extends USB4v2 signals beyond the typical 1-m (3.3-ft) passive cable limit while maintaining full performance. When paired with a USB4v2 retimer between the SoC (USB4v2 router) and the USB-C/USB4 connector, it also lengthens system PCB traces. Operating from a 1.8 V supply, the device consumes 297 mW at 40 Gbps and just 0.5 mW in standby. Its compact 28-pin, 2.8×4.4 mm QFN package suits space-constrained designs.

The PS8780 redriver is now sampling.

PS8780 product page 

Parade Technologies 

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