Збирач потоків

Пам'яті Григор'єва Артура Олександровича kpi пн, 10/06/2025 - 22:47

S1104 (860A) vs 1N4007 (1A) diode. submitted by /u/_st0le [link] [comments]

The dual launch places Snapdragon at the center of AI-focused mobile and PC experiences.

Спартакіада КПІ ім. Ігоря Сікорського 2025 стартувала! kpi пн, 10/06/2025 - 19:34

I designed the circuit in Figure 1 as a part of a data transmission system that has a carrier frequency of 400 kHz using on-off keying (OOK) modulation.

I needed to detect the presence of the carrier by distinguishing it from other signals of different frequencies. It was converted to digital with a 5-V logic. I wanted to avoid using programmable devices and timers based on RC circuits.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The resulting circuit is made up of four chips, including a crystal time base. In brief, this system measures the time between the rising edges of the received signal on a cycle-by-cycle basis. Thus, it detects if the incoming signal is valid or not in a short time (approximately one carrier cycle, that is ~2.5 µs). This is done independently of the signal duty cycle and in less time than other systems, such as a phase-locked loop (PLL), which may take several cycles to detect a frequency.

Figure 1 A digital frequency divider circuit that detects the presence of a 400-kHz carrier, distinguishing it from signals of other frequencies, after it has been converted to digital using 5-V logic.

How it works

In the schematic, IC1A and IC1B are the 6.144 MHz crystal oscillator and a buffer, respectively. For X1, I used a standard quartz crystal salvaged from an old microprocessor board.

The flip-flops IC2A and IC2B are interconnected such that a rising edge at the IC2A clock input (connected to the signal input) produces, through its output and IC2B input, a low logic level at IC2B Q output. Immediately afterwards, the low logic level resets IC2A, thereby leaving IC2B ready to receive a rising edge at its clock input, which causes its Q output to return to high again. Since the IC2B clock input is continuously receiving the 6.144 MHz clock, the low logic level at its output will have a very short duration. That very narrow pulse presets IC3, which takes its counting outputs to “0000”.

If IC4A is in a reset condition, that pulse will also set it in the way explained below, with the effect of releasing IC4B by deactivating its input (pin 4 of IC4) and enabling IC3 by pulling its input low.

From that instant, IC3 will count the 6.144 MHz pulses, and, if the next rising edge of the input signal occurs when IC3’s count is at “1110” or “1111”, IC1C’s output will be at a low level, so the IC4B output will go high, indicating that a cycle with about the correct period (2.5µs) has been received. Simultaneously, IC3 will be preset to start a new count. If the next rising edge occurred when the IC3 count was not yet at “1110”, IC3 would still be preset, but the circuit output would go low. This last scenario corresponds to an input frequency higher than 400 kHz.

On the contrary, if, after the last rising edge, a longer time than a valid period passes, the functioning of the circuit will be the following. When the IC3 count reaches the value “1111”, a 6.144 MHz clock pulse will occur at the signal input instead of a rising edge. This will make the IC4A Q output take the low level present at the IC3 output and the IC4A data input.

The low level at IC4A Q output will set IC4B, and the circuit output will go low. As IC4A Q output is also connected to its own input, that low level caused by a pulse at its clock input will prevent that flip-flop from responding to further clock pulses. From then on, the only way of taking IC4A out of that state will be by applying a low level (could be a very narrow pulse, as in this case) at its input (pin 10 of IC4). That would establish a forbidden condition for an instant, making IC4A first pull high both Q and , and immediately change to low.

As a result of the circuit logic and timing, after a complete cycle with a period of approximately 2.5 µs is received, the circuit output goes high and remains in that state until a shorter cycle is received, or until a longer time than the correct period elapses without a complete cycle.

Testing the circuit

I tested the circuit with signals from 0 to 10 MHz. The frequencies between 384 kHz and 405 kHz, or periods between 2.47 µs and 2.6 µs, produced a high level at the output. These values correspond to approximately 15 to 16 pulses of the 6.144 MHz clock, being the first of those pulses used to end the presetting of the counter IC3, so it is not counted.

Frequencies lower than 362 kHz or higher than 433 kHz produced a low logic level. For frequencies between 362 kHz and 384 kHz and between 405 kHz and 433 kHz, the circuit produced pulses at the output. That means that for an input period between 2.31 µs and 2.47 µs or between 2.60 µs and 2.76 µs, there will be some likelihood that the output will be in a high or low logic state. That state will depend on the phase difference between the input signal and the 6.144 MHz clock.

Figure 2 shows a five-pulse 400 kHz burst (lower trace), which is applied to the input of the circuit. The upper trace is the output; it can be seen that after the first cycle has been measured. The output goes high, and it stays in that state as more 2.5 µs cycles keep arriving. After a time slightly higher than 2.5 µs without a complete cycle (~2.76 µs), the output goes low.

Figure 2 A five-pulse 400-kHz burst applied to the input of the digital frequency divider circuit (CH2) and the output (CH2) after the first cycle has been measured.

Ariel Benvenuto is an Electronics Engineer and a PhD in physics, and works in research with IFIS Litoral in Santa Fe, Argentina.

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The post A digital frequency detector appeared first on EDN.

Пам'яті Вячеслава Петровича Желяскова kpi пн, 10/06/2025 - 19:13

💧 Міжнародна конференція "ВОДНІ ТЕХНОЛОГІЇ: від традиційних методів до сучасних тенденцій" kpi пн, 10/06/2025 - 18:51

🚀 III відкритий інженерний конкурс для школярів «Збудуй свою МРІЮ» учнів 8-11 класів kpi пн, 10/06/2025 - 18:40

In last month’s smart ring overview coverage, I mentioned two things that are particularly relevant to today’s post:

• I’d be following it up with a series of more in-depth write-ups, one per ring introduced in the overview, the first of which you’re reading here, and
• Given the pending ITC (International Trade Commission) block of further shipments of RingConn and Ultrahuman smart rings into the United States, save for warranty-replacements for existing owners, and a ruling announced a few days prior to my submission of the overview writeup to Aalyia, I planned to prioritize the RingConn and Ultrahuman posts in the hopes of getting them published prior to the October 21 deadline, in case US readers were interested in purchasing either of them ahead of time (note, too, that the ITC ruling doesn’t affect readers in other countries, of course).

Color compatibility

Since the Ultrahuman Ring AIR was the first one that came into my possession, I’ll dive into its minutiae first. To start, I’ll note, in revisiting the photo from last time of all three manufacturers’ rings on my left index finger, that the Ultrahuman ring’s “Raw Titanium” color scheme option (it’s the one in the middle, straddling the Oura Gen3 Horizon to its left and the RingConn Gen 2 to its right) most closely matches the patina of my wedding band:

Here’s the Ultrahuman Ring AIR standalone:

Skip the app

Next up is sizing, discussed upfront in last month’s write-up. Ultrahuman is the only one of the three that offers a sizing app as a (potential) alternative to obtaining a kit, although candidly, I don’t recommend it, at least from my experiences with it. Take a look at the screenshots I took when using it again yesterday in prepping for this piece (and yes, I intentionally picked a size-calibrating credit card from my wallet whose account number wasn’t printed on the front!):

I’ll say upfront that the app was easy to figure out and use, including the ability to optionally disable “flash” supplemental illumination (which I took advantage of because with it “on”, the app labeled my speckled desktop as a “noisy background”).

That said, first off, it’s iOS-only, so folks using Android smartphones will be SOL unless they alternatively have an Apple tablet available (as I did; these were taken using my iPad mini 6). Secondly, the app’s finger-analysis selection was seemingly random (ring and middle finger on my right hand, but only middle finger on my left hand…in neither case the index finger, which was my preference). Thirdly, app sizing estimates undershot by one or multiple sizes (depending on the finger) what the kit indicated was the correct size. And lastly, the app was inconsistent use-to-use; the first time I’d tried it in late May, here’s what I got for my left hand (I didn’t also try my right hand then because it’s my dominant one and I therefore wasn’t planning on wearing the smart ring on it anyway):

Sub-par charging

Next, let’s delve a bit more into the previously mentioned seeming firmware-related battery life issue I came across with my initial ring. Judging from the June 2024 date stamps of the documentation on Ultrahuman’s website, the Ring AIR started shipping mid-last year (following up on the thicker and heavier but functionally equivalent original Ultrahuman R1).

Nearly a year later, when mine came into my possession, new firmware updates were still being released at a surprisingly (at least to me) rapid clip. As I’d mentioned last month, one of them had notably degraded my ring’s battery life from the normal week-ish to a half day, as well as extending the recharge time from less than an hour to nearly a full day. And none of the subsequent firmware updates I installed led to normal-operation recovery, nor did my attempted full battery drain followed by an extended delay before recharge in the hope of resetting the battery management system (BMS). I should also note at this point that other Redditors have reported that firmware updates not only killed rings’ batteries but also permanently neutered their wireless connectivity. 

What happened to the original ring? My suspicion is that it actually had something to do with an inherently compromised (coupled with algorithm-worsened) charging scheme that led to battery overcharge and subsequent damage. Ultrahuman bundles a USB-C-to-USB-C cable with the ring, which would imply (incorrectly, as it turns out) that the ring charging dock circuitry can handle (including down-throttling the output as needed) any peak-wattage USB-C charger that you might want to feed it with, including (but not limited to) USB-PD-capable ones.

In actuality, product documentation claims that you should connect the dock to a charger with only a maximum output of 5W/2A. After doing research on Amazon and elsewhere, I wasn’t able to find any USB-C chargers that were that feeble. So, to get there at all, I had to dig out of storage an ancient Apple 5W USB-A charger, which I then mated to a third-party USB-A-to-USB-C cable.

That all said, following in the footsteps of others on the Ultrahuman subreddit who’d had similar experiences (and positive results), I reached out to the Reddit forum moderators (who are Ultrahuman employees, including the founder and CEO!) and after going through a few more debugging steps they’d suggested (which I’d already tried, but whatevah), got shipped a new ring.

It’s been stable through multiple subsequent firmware updates, with the stored charge dropping only ~10-15% per day (translating to the expected week-ish of between-charges operating life). And the pace of new firmware releases has also now notably slowed, suggestive of either increasing code stability or a refocus on development of the planned new product that aspires to avoid Oura patent infringement…I’m hoping for the more optimistic former option!

Other observations

More comments, some of which echo general points made in last month’s write-up:

• Since this smart ring, like those from Oura, leverages wireless inductive charging, docks are ring-size-specific. If you go up or down a size or a few, you’ll need to re-purchase this accessory (one comes with each ring, so this is specifically a concern if, like me, you’ve already bought extras for travel, elsewhere in the house, etc.)

• There’s no battery case available that I’ve come across, not even a third-party option.
• That 10-15% per day battery drop metric I just mentioned is with the ring in its initial (sole) “Turbo” operating mode, not with the subsequently offered (and now default) “Chill” option. I did drop it down to “Chill” for a couple of days, which decreased the per-drop battery-level drop by a few percent, but nothing dramatic. That said, my comparative testing wasn’t extensive, so my results should be viewed as anecdotal, not scientific. Quoting again from last month’s writeup:

Chill Mode is designed to intelligently manage power while preserving the accuracy of your health data. It extends your Ring AIR battery life by up to 35% by tracking only what matters, when it matters. Chill Mode uses motion and context-based intelligence to track heart rate and temperature primarily during sleep and rest.

• It (like the other smart rings I also tested) misinterpreted keyboard presses and other finger-and-hand movements as steps, leading to over-measurement results, especially on my dominant right hand.
• While Bluetooth LE connectivity extends battery life compared to a “vanilla” Bluetooth alternative, it also notably reduces the ring-to-phone connection range. Practically speaking, this isn’t a huge deal, though, since the data is viewed on the phone. The act of picking the phone up (assuming your ring is also on your body) will also prompt a speedy close-proximity preparatory sync.
• Unlike Oura (and like RingConn), Ultrahuman provides membership-free full data capture and analysis capabilities. That said, the company sells optional Powerplug software add-ons to further expand app functionality, along with extended warranties that, depending on the duration, also include one free replacement ring in case your sizing changes due to, for example, ring-encouraged and fitness-induced weight loss.
• The app will also automatically sync with other health services, such as Fitbit and Android’s built-in Health Connect. That said, I wonder (but haven’t yet tested to confirm or deny) what happens if, for example, I wear both the ring and an inherently Fitbit-cognizant Google Pixel Watch (or, for that matter, my Garmin or Withings smartwatches).

• One other curious note: Ultrahuman claims that it’s been manufacturing rings not only in its headquarters country, India, but also in the United States since last November in partnership with a contractor, SVtronics. And in fact, if you look at Amazon’s product page for the Ring AIR, you’ll be able to select between “Made in India” and “Made in USA” product ordering options. Oura, conversely, has indicated that it believes the claimed images of US-located manufacturing facilities are “Photoshop edits” with no basis in reality. I don’t know, nor do I particularly care, what the truth is here. I bring it up only to exemplify the broader contentious nature of ongoing interactions between Oura and its upstart competitors (also including pointed exchanges with RingConn).

Speaking of RingConn, and nearing 1,600 words at this point, I’m going to wrap up my Ultrahuman coverage and switch gears for my other planned post for this month. Time (and ongoing litigation) will tell, I guess, as to whether I have more to say about Ultrahuman in the future, aside from the previously mentioned (and still planned) teardown of my original ring. Until then, reader thoughts are, as always, welcomed in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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The post Can a smart ring make me an Ultrahuman being? appeared first on EDN.

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has announced what it reckons is a breakthrough in short-reach optical interconnect technology with the demonstration of its next-generation 2D vertical-cavity surface-emitting laser (VCSEL) and photodiode (PD) arrays. Best suited for ‘slow and wide’ interconnections in scale-up AI networks, the arrays enable power-efficient and compact links optimized for short reach, addressing the surging data traffic demands in modern data centers...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the hyperscale data-center, telecom and artificial intelligence (AI) markets — has won for the ‘Most Innovative Chip-scale Packaging/Optical Sub Assembly Product’ at the ECOC Awards...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the hyperscale data-center, telecom and artificial intelligence (AI) markets — has announced with high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service provider Semtech Corp of Camarillo, CA, USA the immediate availability for customer sampling of high-performance 1.6T receiver optical engines for AI and cloud networks...

Mojo Vision Inc of Cupertino, CA, USA — which is developing and commercializing micro-LED display technology for consumer, enterprise and government applications — has appointed Dr Waguih Ishak to its advisory board, bringing decades of leadership experience in photonics and optoelectronics to its efforts to apply its micro-LED technology to the development of high-speed optical interconnects for AI infrastructure...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the hyperscale data-center, telecom and artificial intelligence (AI) markets — has announced a strategic collaboration with Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs for SATCOMs and photonic lasers for AI data centers) to develop high-performance and cost-effective external light source (ELS) modules tailored for co-packaged optics (CPO) and next-generation AI infrastructure...

India’s electronics manufacturing landscape is set for a major transformation under the newly launched Electronics Component Manufacturing Scheme (ECMS). The scheme, aimed at increasing domestic production of non-semiconductor components, has seen an industry-wide runaway response with proposals for investment totaling ₹1.15 lakh crore, well over twice the scheme’s initial aim of ₹59,000 crore.

Based on industry estimates, the rise in participation under ECMS can assist in doubling domestic value addition in the manufacture of finished electronic products from the present 15–20% to 35–40% in the next five years. This is a significant improvement towards diminishing dependence on imports and consolidating India as an international manufacturing powerhouse.

The program has received proposals from 249 firms, including major component segments like flexible printed circuit boards, electro-mechanical components, multi-layer PCBs, sub-assemblies, display modules, camera modules, and lithium-ion cells. These proposals are to be soon assessed by a committee for approval.

Amongst the largest investment proposals, enclosures for mobile phones, IT hardware, and other associated devices represent ₹35,813 crore. Other prominent segments comprise flexible PCBs (₹16,542 crore), electro-mechanical components (₹14,362 crore), multi-layer PCBs (₹14,150 crore), and display module sub-assemblies (₹8,642 crore). Cumulatively, more than 100 companies have offered investments of over ₹65,000 crore in merely three important segments electro-mechanical components, enclosures, and PCBs.

Industry specialists perceive the ECMS as a game changer in the electronics value chain that has the potential to generate mass employment on a large scale, facilitate technology transfer, and improve global competitiveness. The unprecedented response is also regarded as an indicator of increased confidence in India’s manufacturing ecosystem.

Union Minister for Electronics and IT Ashwini Vaishnaw revealed that against a production target of ₹4,56,500 crore, the government had received proposals for manufacturing electronics components worth over ₹10,34,000 crore. This staggering response underscores the scale of industry interest and further validates the ECMS as a transformative initiative for India’s electronics manufacturing sector.

He called this a “game changer,” emphasizing how the scheme reflects global trust in India’s electronics sector and its potential to transform the country into a manufacturing powerhouse.

The sector has called upon state governments to supplement the Centre’s effort by enhancing ease of doing business, streamlining regulatory procedures, and providing sector-specific incentives to maintain the momentum of investments. Collective action is likely to open up more opportunities, especially in component manufacturing, which would be the bedrock of self-reliant electronics production.

Through involvement by both national and international firms, the ECMS is considered a horizontal programme that will benefit all verticals of the electronics industry. By promoting the creation of sub-assemblies and core components in the country, the initiative will enhance India’s capability in electronic manufacturing and provide a basis for industrial growth in the long term.

The post India Targets 40% Local Value Addition in Electronics with New Component Scheme appeared first on ELE Times.

A homing sensor is a device used in certain machines to detect a fixed reference point, allowing the machine to determine its exact starting position. When powered on, the machine moves until it triggers the sensor, so it can accurately track movement from that point onward. It’s essential for precision and repeatability in automated motion systems.

Selecting the right homing sensor can have a big impact on accuracy, dependability, and overall cost. Here is a quick rundown of the three main types:

Mechanical homing sensors: These operate through contact-direct switches or levers to determine position.

• Advantages: Straightforward, budget-friendly, and easy to install.
• Drawbacks: Prone to wear over time, slower to respond, and less accurate.

Magnetic homing sensors: Relying on magnetic fields, often via Hall effect sensors, these do not require physical contact.

• Advantages: Long-lasting, effective in harsh environments, and maintenance-free.
• Drawbacks: Can be affected by magnetic interference and usually offer slightly less resolution than optical sensors.

Optical homing sensors: These use infrared light paired with slotted discs or reflective surfaces for detection.

• Advantages: Extremely precise, quick response time, and no mechanical degradation.
• Drawbacks: Sensitive to dust and misalignment and typically come at a higher cost.

In clean, high-precision applications like 3D printers or CNC machines, optical sensors shine. For more demanding or industrial environments, magnetic sensors often strike the right balance. And if simplicity and low cost are top priorities, mechanical sensors remain a solid choice.

Figure 1 Magnetic, mechanical, and optical homing sensors are available in standard configurations. Source: Author

The following parts of this post detail the design framework of a universal homing sensor adapter module.

We will start with a clean, simplified schematic of the universal homing sensor adapter module. Designed for broad compatibility, it accepts logic-level inputs—including both CMOS and TTL-compatible signals—from nearly any homing sensor head, whether it’s mechanical, magnetic, or optical, making it a flexible choice for diverse applications.

Figure 2 A minimalistic design highlights the inherent simplicity of constructing a universal homing sensor module. Source: Author

The circuit is simple, economical, and built using easily sourced, budget-friendly components. True to form, the onboard test button (SW1) mirrors the function of a mechanical homing sensor, offering a convenient stand-in for setup and troubleshooting tasks.

The 74LVC1G07 (IC1) is a single buffer with an open-drain output. Its inputs accept signals from both 3.3 V and 5 V devices, enabling seamless voltage translation in mixed-signal environments. Schmitt-trigger action at all inputs ensures reliable operation even with slow input rise and fall times.

Optional flair: LED1 is not strictly necessary, but it offers a helpful visual cue. I tested the setup with a red LED and a 1-KΩ resistor (R3)—simple, effective, and reassuringly responsive.

As usual, I whipped up a quick-and-dirty breadboard prototype using an SMD adapter PCB (SOT-353 to DIP-6) to host the core chip (Figure 3). I have skipped the prototype photo for now—there is only a tiny chip in play, and the breadboard layout does not offer much visual clarity anyway.

Figure 3 A good SMD adapter PCB gives even the tiniest chip time to shine. Source: Author

A personal note: I procured the 74LVC1G07 chip from Robu.in.

Just before the setup reaches its close, note that machine homing involves moving an axis toward its designated homing sensor—a specific physical location where a sensor or switch is installed. When the axis reaches this point, the controller uses it as a reference to accurately determine the axis position. For reliable operation, it’s essential that the homing sensor is mounted precisely in its intended location on the machine.

While wrapping up, here are a few additional design pointers for those exploring alternative options, since we have only touched on a straightforward approach so far. Let’s take a closer look at a few randomly picked additional components and devices that may be better suited for the homing task:

• SN74LVC1G16: Inverting buffer featuring Schmitt-trigger input and open-drain output; ideal for signal conditioning and noise immunity.
• SN74HCS05: Hex inverter with Schmitt-trigger inputs and open-drain outputs; useful for multi-channel logic interfacing.
• TCST1103/1202/1300: Transmissive optical sensor with phototransistor output; ideal for applications that require position sensing or the detection of an object’s presence or absence.
• TCRT5000: Reflective optical sensor; ideal for close-proximity detection.
• MLX75305: Light-to-voltage sensor (EyeC series); converts ambient light into a proportional voltage signal, suitable for optical detection.
• OPBxxxx Series: Photologic slotted optical switches; designed for precise object detection and position sensing in automation setups.

Moreover, compact inductive proximity sensors like the Omron E2B-M18KN16-M1-B1 are often used as homing sensors to detect metal targets—typically a machine part or actuator—at a fixed reference point. Their non-contact operation ensures reliable, repeatable positioning with minimal wear, ideal for robotic arms, linear actuators, and CNC machines.

Figure 4 The Omron E2B-M18KN16-M1-B1 inductive proximity sensor supports homing applications by detecting metal targets at fixed reference points. That enables precise, contactless positioning in industrial setups. Source: Author

Finally, if this felt comfortably familiar, take it as a cue to go further; question the defaults, reframe the problem, and build what no datasheet dares to predict.

T. K. Hareendran is a self-taught electronics enthusiast with a strong passion for innovative circuit design and hands-on technology. He develops both experimental and practical electronic projects, documenting and sharing his work to support fellow tinkerers and learners. Beyond the workbench, he dedicates time to technical writing and hardware evaluations to contribute meaningfully to the maker community.

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• Radar sensors in home, office, school, factory and more

The post Universal homing sensor: A hands-on guide for makers, engineers appeared first on EDN.

Upgraded Smart Running Trail in Suzhou Industrial Park Achieves Perfect Fusion of Technology and Art

The Jinji Lake Luminous Trail, a project developed by the Suzhou Industrial Park, has won the 2025 MUSE Design Gold Award and the IES Illumination Award of Excellence.

MUSE Design Awards

In June, the Jinji Lake Luminous Trail was honored with the Gold Award in the Innovative Lighting Design category at the 2025 MUSE Design Awards. Recognized as a highly authoritative international award in the global creative design field and often hailed as “the Oscars of the design world,” the trail was one of only two recipients of the highest honor in this category, fully demonstrating the project’s outstanding innovation and design standards.

IES Illumination Awards

In addition to the MUSE Design Award, the Jinji Lake Luminous Trail also received the Award of Excellence in the Control Innovation category at the IES Illumination Awards in August of the same year. The IES Illumination Awards are presented annually by the Illuminating Engineering Society of North America (IES), an organization with over a century of history. Alongside the Lighting Design Awards from Lighting magazine and the IALD International Lighting Design Awards from the International Association of Lighting Designers, the IES Illumination Awards are considered one of the three most prestigious lighting design awards in the world today, representing the highest global design standards of the year. The IES award is the longest-standing of these accolades.

Nuvoton NUC1311 MCU Empowers the Interactive Lighting System and Smart Sensors of the Jinji Lake Trail

Within the trail’s overall smart system, the core control unit is powered by Nuvoton NUC1311 series microcontroller.

The NUC1311’s 5V operating voltage significantly enhances its stability and high noise immunity in harsh outdoor conditions. Furthermore, it supports Bosch-licensed CAN Bus IP, ensuring reliability and industrial-grade communication security during high-speed data transmission. These features enable the NUC1311 to provide real-time, stable smart lighting control for the Jinji Lake Trail’s interactive lighting systems and smart sensing devices, even in the humid and high-interference environment of the lakeside.

The Jinji Lake Luminous Trail was a key urban renewal project for the Suzhou Industrial Park in 2024. It involved upgrading the lighting systems of the Jinshuiwan Trestle Bridge and the lakeside walkways. By integrating technologies such as smart running poles and Bluetooth sensors, two distinctive trails were created: a 15 km smart running trail and a 3.5 km light-chasing interactive trail. The former combines smart planning and AI cameras to enable light interaction and cultural tours, while the latter utilizes DMX512 and Bluetooth dual-mode control, allowing users to select lighting effects via a mobile app for an immersive and interactive experience.

“Our years of partnership with Nuvoton have given us a deep appreciation for the high stability of their products, their comprehensive hardware and software ecosystem, and their excellent real-time service,” stated a representative from Suzhou Tianping. “These advantages are key reasons why we continue to choose Nuvoton products for our large-scale projects. We look forward to deepening our collaboration with Nuvoton in more areas in the future.”

The international design awards received by the Jinji Lake Luminous Trail not only symbolize the successful integration of technology and art but also highlight the formidable strength and international competitiveness of Nuvoton’s MCUs in the fields of smart cities, smart lighting, and interactive design. Moving forward, Nuvoton Technology will continue to provide high-quality, high-performance MCU solutions to help more partners create innovative applications and drive the development of smart cities to new heights.

The post Nuvoton NUC1311 Microcontroller Powers Jinji Lake Luminous Trail appeared first on ELE Times.

Пам'яті Касянчика Дмитра Олександровича kpi нд, 10/05/2025 - 22:59

In this article, we will examine the basic principles of FM demodulation through the simplest frequency discriminator: a differentiator.