Microelectronics world news

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The future of the industrial market is being established by groundbreaking technologies that promise to reveal unique potential and redefine what is possible. These innovations range from collaborative robots (cobots) and artificial intelligence to the internet of things, digital twins, and cloud computing.

Cobots are not just tools but partners, empowering human workers to achieve greater creativity and productivity together. AI is ushering industries into a new era of intelligence, where data-driven insights accelerate innovation and transform challenges into opportunities.

The IoT is weaving vast, interconnected machines and systems that enable seamless communication and real-time responsiveness like never before. Digital twins bring imagination to life by creating virtual environments where ideas can be tested, refined, and perfected before they touch reality. Cloud computing serves as the backbone of this revolution, offering limitless power and connectivity to drive brave visions forward.

Together, these technologies are inspiring a new industrial renaissance, where innovation, sustainability, and human initiative converge to build a smarter, more resilient world.

The role of sensors

Sensors are the silent leaders driving the industrial market’s transformation into a realm of intelligence and possibility. Serving as the “eyes and ears” of smart factories, these devices unlock the power of real-time data, enabling industries to look beyond the surface and anticipate the future. By continuously sensing pressure, temperature, position, vibration, and more, sensors enable workers to be continuously monitored and bring machines to life, turning them into connected, responsive entities within the industrial IoT (IIoT).

This flow of information accelerates innovation, enables predictive maintenance, and enhances safety. Sensors do not just monitor; they usher in a new era where efficiency meets sustainability, where every process is optimized, and where industries embrace change with confidence. In this industrial landscape, sensors are the catalysts that transform raw data into insights for smarter, faster, and more resilient industries.

Challenges for industrial motion sensing applications

Sensors in industrial environments face several significant challenges. They must operate continuously for years on battery power without failure. Additionally, it is crucial that they capture every critical event to ensure no incidents are missed. Sensors must provide accurate and precise tracking to manage processes effectively. Simultaneously, they need to be compact yet powerful, integrating multiple functions into a small device.

Most importantly, sensors must deliver reliable tracking and data collection in any environment—whether harsh, noisy, or complex—ensuring consistent performance regardless of external conditions. Overcoming these challenges is essential to making factories smarter and more efficient through connected technologies, such as the IIoT and MEMS motion sensors.

MEMS inertial sensors are essential devices that detect motion by measuring accelerations, vibrations, and angular rates, ensuring important events are never missed in an industrial environment. Customers need these motion sensors to work efficiently while saving power and to keep performing reliably even in tough conditions, such as high temperatures.

However, there are challenges to overcome. Sometimes sensors can become overwhelmed, causing them to miss important impact or vibration details. Using multiple sensors to cover different motion ranges can be complicated, and managing power consumption in an IIoT node is also a concern.

There is a tradeoff between accuracy and range: Sensors that measure small movements are very precise but can’t handle strong impacts, while those that detect strong impacts are less accurate. In industrial settings, sensors must be tough enough to handle harsh environments while still providing reliable and accurate data. Solving these challenges is key to making MEMS sensors more effective in many applications.

How the new ST industrial IMU can help

Inertial measurement units (IMUs) typically integrate accelerometers to measure linear acceleration and gyroscopes to detect angular velocity. These devices often deliver space and cost savings while reducing design complexity.

One example is ST’s new ISM6HG256X intelligent IMU. This MEMS sensor is the industry’s first IMU for the industrial market to integrate high-g and low-g sensing into a single package with advanced features such as sensor fusion and edge processing.

The ISM6HG256X addresses key industrial market challenges by integrating a single mechanical structure for an accelerometer with a wide dynamic range capable of capturing both low-g vibrations (16 g) and high-g shocks (256 g) and a gyroscope, effectively eliminating the need for multiple sensors and simplifying system architecture. This compact device leverages embedded edge processing and adaptive self-configurability to optimize performance while significantly reducing power consumption, thereby extending battery life.

Engineered to withstand harsh industrial environments, the IMU reliably operates at temperatures up to 105°C, ensuring consistent accuracy and durability under demanding conditions. Supporting Industry 5.0 initiatives, the sensor’s advanced sensing architecture and edge processing capabilities enable smarter, more autonomous industrial systems that drive innovation.

Unlocking smarter tracking and safety, this integrated MEMS motion sensor is designed to meet the demanding needs of the industrial sector. It enables real-time asset tracking for logistics and shipping, providing up-to-the-minute information on location, status, and potential damage. It also enhances worker safety through wearable devices that detect falls and impacts, instantly triggering emergency alerts to protect personnel.

Additionally, it supports condition monitoring by accurately tracking vibration, shock, and precise motion of industrial equipment, helping to prevent downtime and costly failures. In factory automation, the solution detects unusual vibrations or impacts in robotic systems instantly, ensuring smooth and reliable operation. By combining tracking, monitoring, and protection into one component, industrial operations can achieve higher efficiency, safety, and reliability with streamlined system design.

The ISM6HG256X IMU sensor combines simultaneous low-g (±16 g) and high-g (±256 g) acceleration detection with a high-performance precision gyroscope for angular rate measurement. (Source: STMicroelectronics)

As the industrial market landscape evolves toward greater flexibility, sustainability, and human-centered innovation, industrial IMU solutions are aligned with the key drivers shaping the future of the industrial market. IMUs can enable precise motion tracking, reliable condition monitoring, and energy-efficient edge processing while supporting the decentralization of production and enhancing resilience and agility within supply chains.

Additionally, the integration of advanced sensing technologies contributes to sustainability goals by optimizing resource use and minimizing waste. As manufacturers increasingly adopt AI-driven collaboration and advanced technology integration, IMU solutions provide the critical data and reliability needed to drive innovation, customization, and continuous improvement across the industry.

The post The role of motion sensors in the industrial market appeared first on EDN.

We’ve looked at lightning issues before. Please see “Ground strikes and lightning protection of buried cables.”

This headline below was found online at the URL hyperlinked here.

Recent headline from the local paper. Source: ABC7NY

This ABC NY article describes how a teenage boy tried to take refuge from the rain in a thunderstorm by getting under the canopy of a tree. In that article, we find this quote: “The teen had no way of knowing that the tree would be hit by lightning.”

This quote, apparently the opinion of the article’s author, is absolutely incorrect. It is total and unforgivable rubbish.

Even when I was knee-high to Jiminy Cricket, I was told over and over and over by my parents NEVER to try to get away from rain by hiding under a tree. Any tree that you come across will have its leaves reaching way up into the air, and those wet leaves are a prime target for a lightning strike, as illustrated in this screenshot:

Conceptual image of lightning striking tree. Source: Stockvault

Somebody didn’t impart this basic safety lesson to this teenager. It is miraculous that this teenager survived the event. The above article cites second-degree burns, but a radio item that I heard about this incident also cites nerve damage and a great deal of lingering pain.

Recovery is expected.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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• Misplaced insulator proves fatal

The post Lightning and trees appeared first on EDN.

Rohde & Schwarz and Samsung are collaborating to bring 5G NR-NTN to market. Both companies have worked together to enable the validation of the first 5G-based New Radio non-terrestrial networks (NR-NTN) test cases in accordance with the 3GPP test specifications for RF (Radio Frequency), RRM (Radio Resource Management) and PCT (Protocol Conformance Testing) using conformance test solutions from Rohde & Schwarz. The validated test cases, as defined by PTCRB (PCS Type Certification Review Board) RFT 555 (Request for Testing), were conducted on the R&S TS8980 Conformance Test Platform, the R&S TS-RRM and the CMX500 in frequency range 1 (FR1) verifying Samsung’s latest NR-NTN chipset as device under test (DUT).

In preparation for the commercial rollout of a new mobile technology, 3GPP conformance testing is essential for ensuring that devices and networks comply with global standards. This is particularly true for 5G NR-NTN, set to bring reliable satellite-based connectivity to remote areas. However, NR-NTN testing presents challenges that extend beyond those encountered in traditional terrestrial networks, primarily due to the vastly different operating environment and the dynamic nature of satellite-based communication.

Goce Talaganov, Vice President of Mobile Radio Testers at Rohde & Schwarz, said: “Conformance testing – covering RF, RRM and PCT – is critical for a positive user experience and a stable mobile ecosystem. Rohde & Schwarz has consistently been leading edge in conformance testing, providing its comprehensive solutions across all three domains. We’re proud to partner with industry leaders like Samsung who rely on our solutions to ensure device conformance, to enable tomorrow’s connectivity.”

The post Rohde & Schwarz, together with Samsung, first to validate 3GPP NR-NTN conformance across RF, RRM and PCT appeared first on ELE Times.

I always wanted to create my very own weather station which is capable of measuring as much things as possible. For a start decided to create a set of sensors for temperature, pressure, humidity, and light. There are plenty of options for these, but I chose digital sensors with I2C interface. It leaves analog part to sensor vendors and allows to use them through a common interface both from hardware and software levels. Check out linked project page. It contains schematic, PCB design, simple test code for RPi Zero 2 W, and a tool to visualize measurements. The set requires 1.8-3.3V (haven’t tested 1.8V yet), I2C connection, and provides a couple interrupt lines. I have a bunch of MCUs so now planning to create more code examples - for RPi Pico, ESP, STM. submitted by /u/WeekSpender [link] [comments]

Microchip’s LAN866x 10BASE-T1S endpoint devices use the Remote Control Protocol (RCP) to extend Ethernet connectivity in in-vehicle networks. The endpoints enable centralized control of edge nodes for data streaming and device management, while the 10BASE-T1S multidrop topology supports an all-Ethernet zonal architecture.

LAN866X endpoints serve as bridges that translate Ethernet packets directly to local interfaces for lighting control, audio transmission, and sensor or actuator management over the network. This approach eliminates node-specific software programming, simplifying system architecture and reducing both hardware and engineering costs.

The RCP-enabled endpoint devices join Microchip’s Single Pair Ethernet (SPE) line of transceivers, bridges, switches, and development tools. These components enable reliable, high-speed data transmission over a single twisted pair cable supporting 10BASE-T1S, 100BASE-T1, and 1000BASE-T1.

The LAN8660 control, LAN8661 lighting, and LAN8662 audio endpoints are available in limited sampling. For more information about Microchip’s automotive Ethernet products, including these endpoints, click here.

Microchip Technology 

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SPARK’s Presence Detection Kit (PDK), powered by the SR1120 LE-UWB transceiver, delivers low-power, robust sensing for connected devices. Its low-energy ultra-wideband (LE-UWB) technology helps designers overcome the high power consumption and interference challenges of Bluetooth, Wi-Fi, and conventional UWB.

LE-UWB supports unidirectional and bidirectional communication, ultra-low-power beaconing with configurable detection zones, and line-of-sight Time-of-Flight (ToF) measurement for precise proximity and distance sensing. SPARK reports that its LE-UWB technology consumes over 10× less power (30 µW at 4 Hz) than Bluetooth/BLE beaconing and delivers more than 20× higher power efficiency than standard UWB.

SPARK provides an energy-optimized firmware stack for presence detection, including APIs for beaconing, ranging, data transmission, and OTA firmware updates. Reference hardware kits, demo applications, and GUIs allow engineers to evaluate detection performance, adjust detection zones, and accelerate prototyping. The PDK hardware is selected to optimize performance, power, and cost, and integrates across a broad range of MCUs and software architectures.

Presence detection kits are available now. For details on board and kit configurations, contact NA_sales@sparkmicro.com.

SPARK Microsystems 

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Keysight has expanded its power test portfolio with three families of ATE system power supplies spanning 1.5 kW to 12 kW. The RP5900 series of regenerative DC power supplies, EL4900 series of regenerative DC electronic loads, and DP5700 series of system DC power supplies deliver high density, bidirectional, and regenerative capabilities, paired with intelligent automation software for efficient design validation.

This range enables engineers to validate complex, multi-kilowatt devices with greater precision and repeatability while using less space and energy. Supplies deliver up to 6 kW in 1U or 12 kW in 2U, with full regenerative capability, offering two to three times more channels in the same footprint as previous systems.

Keysight’s automated power suite lets engineers run complex tests—such as long-duration cycling, state-of-charge battery emulation, and transient replication—consistently and efficiently. It includes removable SD memory for secure workflows between classified and open labs, software that complies with NIST SP800-171 SSDF standards, and regenerative operation that returns energy to the grid, reducing waste and supporting sustainability.

For more information about each of the three high-density power series, click here.

Keysight Technologies 

The post High-density ATE supplies boost test capabilities appeared first on EDN.

Quectel is bundling its Real-Time Kinematic (RTK)-capable GNSS modules and antennas with Swift Navigation’s Skylark RTK correction service. Together, the hardware and service enable centimeter-level positioning accuracy for mass-market IoT applications and streamline RTK adoption.

Partnering with Swift allows Quectel to deliver optimized solutions for specific applications, helping equipment manufacturers navigate the complexities of RTK adoption. The Quectel RTK Correction Solution supports a wide range of use cases, including robotics, automotive, micro-mobility, precision agriculture, surveying, and mining. Swift’s Skylark provides multi-constellation, multi-frequency RTK corrections with broad geographic coverage across North America, Europe, and Asia-Pacific.

The RTK global offering ensures consistent compatibility and performance across regions, supporting quad–band GNSS RTK modules such as the LG290P, LG580P, and LG680P, as well as the dual-band LC29H series. These modules maintain exceptional RTK accuracy even in challenging environments. Quectel complements its hardware with full-stack services, including engineering support, precision antenna provisioning, and tuning.

Quectel

Swift Navigation 

The post Partners bring centimeter-level GNSS to IoT appeared first on EDN.

Semtech’s Unified Software Platform (USP) for its LoRa Plus transceivers enables multiprotocol IoT deployments on a single hardware platform. It manages LoRaWAN, Wireless M-Bus, Wi-SUN FSK, and proprietary protocols, eliminating the need for protocol-specific hardware variants.

LoRa Plus LR20xx transceivers integrate 4th-generation LoRa IP that supports both terrestrial and non-terrestrial networks across sub-GHz, 2.4-GHz ISM, and licensed S-bands. The LoRa USP provides a unified firmware ecosystem for multiprotocol operation on various MCU platforms through open-source environments such as Zephyr. It also offers backward-compatible build options for Gen 2 SX126x and Gen 3 LR11xx devices.

LoRa USP succeeds LoRa Basics Modem as Semtech’s multiprotocol firmware platform. Both platforms share the same set of APIs, ensuring a seamless transition to the USP version. USP supports both bare-metal and Zephyr OS implementations.

LoRa USP product page 

Semtech

The post Multiprotocol firmware streamlines LoRa IoT design appeared first on EDN.

Power management integrated circuits (PMICs) are an essential component in the design of any power supply. Their main function is to integrate several complex features, such as switching and linear power regulators, electrical protection circuits, battery monitoring and charging circuits, energy-harvesting systems, and communication interfaces, into a single chip.

Compared with a solution based on discrete components, PMICs greatly simplify the development of the power stage, reducing the number of components required, accelerating validation and therefore the design’s time to market. In addition, PMICs qualified for specific applications, such as automotive or industrial, are commercially available.

In industrial and industrial IoT (IIoT) applications, PMICs address key power challenges such as high efficiency, robustness, scalability, and flexibility. The use of AI techniques is being investigated to improve PMIC performance, with the aim of reducing power losses, increasing energy efficiency, and reducing heat dissipation.

Achieving high efficiency

Industrial and IIoT applications require multiple power lines with different voltage and current requirements. Logic processing components, such as microcontrollers (MCUs) and FPGAs, require very low voltages, while peripherals, such as GPIOs and communication interfaces, require voltages of 3.3 V, 5 V, or higher.

These requirements are now met by multichannel PMICs, which integrate switching buck, boost, or buck-boost regulators, as well as one or more linear regulators, typically of the low-dropout (LDO) type, and power switches, very useful for motor control. Switching regulators offer very high efficiency but generate electromagnetic noise related to the charging and discharging process of the inductor.

LDO regulators, which achieve high efficiency only when the output voltage differs slightly from the input voltage to the converter, are instead suitable for low-noise applications such as sensors and, more generally, where analog voltages with very low amplitude need to be managed.

Besides multiple power rails, industrial and IIoT applications require solutions with high efficiency. This requirement is essential for prolonging battery life, reducing heat dissipation, and saving space on the printed-circuit board (PCB) using fewer components.

To achieve high efficiency, one of the first parameters to consider is the quiescent current (IQ), which is the current that the PMIC draws when it is not supplying any load, while keeping the regulators and other internal functions active. A low IQ value reduces power losses and is essential for battery-powered applications, enabling longer battery operation.

PMICs are now commercially available that integrate regulators with very low IQ values, in the order of microseconds or less. However, a low IQ value should not compromise transient response, another parameter to consider for efficiency. Transient response, or response time, indicates the time required by the PMIC to adapt to sudden load changes, such as when switching from no load to active load. In general, depending on the specific application, it is advisable to find the right compromise between these two parameters.

Nordic Semiconductor’s nPM2100 (Figure 1) is an example of a low-power PMIC. Integrating an ultra-efficient boost regulator, the nPM2100 provides a very low IQ, addressing the needs of various battery-powered applications, including Bluetooth asset tracking, remote controls, and smart sensors.

The boost regulator can be powered from an input range of 0.7 to 3.4 V and provides an output voltage in the range of 1.8 V to 3.3 V, with a maximum output current of 150 mA. It also integrates an LDO/load switch that provides up to 50-mA output current with an output voltage in the range of 0.8 V to 3.0 V.

The nPM2100’s regulator offers an IQ of 150 nA and achieves up to 95% power conversion efficiency at 50 mA and 90.5% efficiency at 10 µA. The device also has a low-current ship mode of 35 nA that allows it to be transported without removing the battery inserted. Multiple options are available for waking up the device from this low-power state.

An ultra-low-power wakeup timer is also available. This is suitable for timed wakeups, such as Bluetooth LE advertising performed by a sensor that remains in an idle state for most of the time. In this hibernate state, the maximum current absorbed by the device is 200 nA.

Figure 1: Nordic Semiconductor’s nPM2100 PMIC can be easily interfaced to low-power system-on-chips or MCUs, such as Nordic’s nRF52, nRF53, and nRF54 Series. (Source: Nordic Semiconductor)

Another relevant parameter that helps to increase efficiency is dynamic voltage and frequency scaling (DVFS).

When powering logic devices built with CMOS technology, such as common MCUs, processors, and FPGAs, a distinction can be made between static and dynamic power consumption. While the former is simply the product of the supply voltage by the current in idle conditions, dynamic power is expressed by the following formula:

Pdynamic = C × Vcc2 × fsw

where C is the load capacity, VCC is the voltage applied to the device, and fSW is the switching frequency. This formula shows that the power dissipated has a quadratic relationship with voltage and a linear relationship with frequency. The DVFS technique works by reducing these two electrical parameters and adapting them to the dynamic requirements of the load.

Consider now a sensor that transmits data sporadically and for short intervals, or an industrial application, such as a data center’s board running AI models. By reducing both voltage and frequency when they are not needed, DVFS can optimize power management, enabling significant improvements in energy efficiency.

NXP Semiconductors’ PCA9460 is a 13-channel PMIC specifically designed for low-power applications. It supports the i.MX 8ULP ultra-low-power family processor, providing four high-efficiency 1-A step-down regulators, four VLDOs, one SVVS LDO, and four 150-mΩ load switches, all enclosed in a 7 × 6-bump-array, 0.4-mm-pitch WSCSP42 package.

The four buck regulators offer an ultra-low IQ of 1.5 μA at low-power mode and 5.5 μA at normal mode, while the four LDOs achieve an IQ of 300 nA. Two buck regulators support smart DVFS, enabling the PMIC to always set the right voltage on the processors it is powering. This feature, enabled through specific pins of the PMIC, minimizes the overall power consumption and increases energy efficiency.

Energy harvesting

The latest generation of PMICs has introduced the possibility of obtaining energy from various sources such as light, heat, vibrations, and radio waves, opening up new scenarios for systems used in IIoT and industrial environments. This feature is particularly important in IIoT and wireless devices, where maintaining a continuous power source for long periods of time is a significant challenge.

Nexperia’s NEH71x0 low-power PMIC (Figure 2) is a full power management solution integrating advanced energy-harvesting features. Harvesting energy from ambient power sources, such as indoor and outdoor PV cells, kinetic (movement and vibrations), piezo, or a temperature gradient, this device allows designers to extend battery life or recharge batteries and supercapacitors.

With an input power range from 15 μW to 100 mW, the PMIC achieves an efficiency up to 95%, features an advanced maximum power-point tracking block that uses a proprietary algorithm to deliver the highest output to the storage element, and integrates an LDO/load switch with a configurable output voltage from 1.2 V to 3.6 V.

Reducing the bill of materials and PCB space, the NEH71x0 eliminates the need for an external inductor, offering a compact footprint in a 4 × 4-mm QFN28 package. Typical applications include remote controls, smart tags, asset trackers, industrial sensors, environmental monitors, tire pressure monitors, and any other IIoT application.

Figure 2: Nexperia’s NEH71x0 energy-harvesting PMIC can convert energy with an efficiency of up to 95%. (Source: Nexperia) PMICs for AI and AI in PMICs

To meet the growing demand for power in the industrial sector and data centers, Microchip Technology Inc. has introduced the MCP16701, a PMIC specifically designed to power high-performance logic devices, such as Microchip’s PIC64GX microprocessors and PolarFire FPGAs. The device integrates eight 1.5-A buck converters that can be connected in parallel, four 300-mA LDOs, and a controller for driving external MOSFETs.

The MCP16701 offers a small footprint of 8 × 8 mm in a VQFN package (Figure 3), enabling a 48% reduction in PCB area and a 60% reduction in the number of components compared with a discrete solution. All converters, which can be connected in parallel to achieve a higher output current, share the same inductor.

A unique feature of this PMIC is its ability to dynamically adjust the output voltage on all converters in steps of 12.5 mV or 25 mV, with an accuracy of ±0.8% over the temperature range. This flexibility allows designers to precisely adjust the voltage supplied to loads, optimizing energy efficiency and system performance.

Figure 3: Microchip’s MCP16701 enables engineers to fine-tune power delivery, improving system efficiency and performance. (Source: Microchip Technology Inc.)

As in many areas of modern electronics, AI techniques are also being studied and introduced in the power management sector. This area of study is referred to as cognitive power management. PMICs, for example, can use machine-learning techniques to predict load evolution over time, adjusting the output voltage value in real time.

Tools such as PMIC.AI, developed by AnDAPT, use AI to optimize PMIC architecture and component selection, while Alif Semiconductor’s autonomous intelligent power management (aiPM) tool dynamically manages power based on AI workloads. These solutions enable voltage scaling, increasing system efficiency and extending battery life.

The post Designer’s guide: PMICs for industrial applications appeared first on EDN.

A frequently encountered category of analog system component is the precision current source. Many good designs are available, but concise and simple arithmetic for choosing the component values necessary to tailor them to specific applications isn’t always provided. I guess some designers feel such tedious details are just too trivially obvious to merit mentioning. But I sometimes don’t feel that. 

Wow the engineering world with your unique design: Design Ideas Submission Guide

Here are some examples I think some folks might find useful. I hope they won’t feel too terribly obvious, trivial, or tedious.

The circuit in Figure 1 is versatile and capable of high performance.

Figure 1 A simple high-accuracy current source that can source current with better than 1% accuracy.

With suitable component choices, this circuit can: source current with better than 1% accuracy and have Q1 drain currents ranging from < 1mA to > 10 A, while working with power supply voltages (Vps) from < 5V to > 100 V.

Here are some helpful hints for resistor values, resistor wattages, and safety zener D1. First note

• Vps = power supply voltage
• R1(W), Q1(W), and R2(W) = respective component power dissipation
• Id = Q1 drain current in amps

Adequate heat sinking for Q1(W). Another thing assumed is:

Vps > Q1 (Vgs ON voltage) + 1.24 + R1*100µA

The design equations are as follows:

1. R1 = (Vps – 1.24)/1mA
2. R1(W) = R1/1E6
3. Q1(W) = (Vps – Vload – 1.24)*Id
4. R2 = 1.24/Id
5. R2(W) = 1.24 Id
6. R2 precision 1% or better at the temperature produced by #5 heat dissipation
7. D1 is needed only if Vps > 15V

Figure 2 substitutes an N-channel MOSFET for Figure 1’s Q1 and an anode-referenced 431 regulator chip in place of the cathode-referenced 4041 to produce a very similar current sink. Its design equations are identical.

Figure 2 A simple, high-accuracy current sink uses identical design math.

Okay, okay, I can almost hear the (very reasonable) objection that, for these simple circuits, the design math really was pretty much tedious, trivial, and obvious. 

So I’ll finish with a very less obvious and more creative example from frequent contributor Christopher Paul’s DI “Precision, voltage-compliant current source.”

Taking parts parameters from Christopher Paul’s Figure 3, we can define:

1. Vs = chosen voltage across the R3R4 divider
2. V5 = voltage across R5
3. Id = chosen application-specific M1 drain current

Then:

1. Vs = 5V
2. V5 = 5V – 0.65V = 4.35V
3. R5 = 4.35V/150µA = 30kΩ
4. I4 = Id – 290µA
5. R3 = 1.24/I4
6. R4 = (Vs – 1.24)/I4 = 3.76/I4
7. R3(W) = 1.24 I4
8. R4(W) = 3.76 I4
9. M1(W) = Id(Vs – Vd)

For example, if Id = 50 mA and Vps = 15 V, then:

•  I4 = 49.7 mA
• R5 = 30 kΩ
• R4 = 75.7 Ω
• R3 = 25.2 Ω
• R3(W) = 1.24 I4 = 100 mW
• R4(W) = 3.76 I4 = 200 mW
• M1(W) = 500 mW

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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The South Wales-based compound semiconductor cluster CSconnected has announced a £1m third call in its Supply Chain Development Programme (which was launched in March), delivered in partnership with Cardiff Capital Region (CCR), to accelerate the expansion of the compound semiconductor supply chain in South Wales. The initiative aims to drive job creation, stimulate economic growth and enhance the UK’s strategic position in advanced semiconductor manufacturing...

As the automotive industry transitions to zonal architectures for in-vehicle networking, designers face increasing challenges in connecting a growing number of sensors and actuators. Traditional approaches often rely on microcontrollers and custom software for each network node, resulting in greater system complexity, higher costs and longer development cycles. To overcome these obstacles, Microchip Technology introduced its LAN866x family of 10BASE-T1S endpoint devices with Remote Control Protocol (RCP), extending Ethernet connectivity to the very edge of in-vehicle networks and enabling the vision of Software Defined Vehicles (SDVs).

The LAN866x endpoints are designed to simplify network integration by serving as bridges that translate Ethernet packets directly to local digital interfaces. Unlike conventional solutions, these endpoints are designed to be software-less, reducing the need for node-specific software programming, streamlining silicon usage and physical footprint. With support for standard-based RCP protocols, the endpoints enable centralized control of edge nodes for data streaming and device management. By utilizing a 10BASE-T1S multidrop topology, this solution supports an all-Ethernet, zonal architecture that helps reduce cabling, software integration and cost.

By removing the need for software development at every node, the LAN866x endpoints are designed to reduce both hardware and engineering costs, accelerate deployment timelines and simplify system architecture. The endpoints are well-suited for critical automotive applications such as lighting—covering interior, front and rear headlamps, as well as audio systems and a wide range of control functions. In these applications, the endpoints provide direct bridging of Ethernet data to local digital interfaces controlling LED drivers for lighting, transmitting audio data to and from microphones and speakers, as well as controlling sensors and actuators over the network.

“With the addition of these RCP endpoint devices, Microchip’s Single Pair Ethernet product line empowers designers to realize a true all-Ethernet architecture for Software-Defined Vehicles,” said Charlie Forni, corporate vice president of Microchip’s networking and communications business unit. “We are committed to delivering innovative solutions and supporting our customers with global technical expertise, comprehensive documentation and development tools to further reduce design complexity and help them bring vehicles to market faster.”

The post Microchip introduces edge-enabling LAN866x 10BASE-T1S ethernet for SDVs appeared first on ELE Times.

Specialty analog foundry Tower Semiconductor Ltd of Migdal Haemek, Israel has announced the expansion of its existing, mature 300mm wafer bonding technology (originally developed and in mass production for stacked BSI image sensors) to enable heterogeneous 3D-IC integration across its silicon photonics (SiPho) and silicon germanium (SiGe) BiCMOS processes, including full support by Cadence design tools for the stacked platform technology...

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications – has signed a teaming agreement with Louisiana- and Texas-based NovaSpark Energy, which designs and manufactures mobile hydrogen generation systems for fueling long-range drones and powering critical infrastructure...

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and developed and previously manufactured high-power industrial blue lasers — has updated its strategic alliance with Tekne S.p.A. (a provider of integrated electronic warfare and cyber capabilities in military vehicles). The companies, along with Tekne’s shareholders, signed a new letter of agreement on 10 November, superseding their previous understanding and establishing a renewed strategic and industrial partnership. This agreement will be implemented by NUBURU via its specialized subsidiary Nuburu Defense LLC, which is focused on delivering laser-based solutions for defense, security and critical infrastructure applications...

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Caliber Interconnects Pvt. Ltd., announced that it has achieved accelerated turnaround times and first-time-right outcomes for complex chiplet and Automated Test Equipment (ATE) hardware projects. The company has refined its proprietary design and verification workflow, which integrates powerful Cadence solutions to optimize performance, power, and reliability from the earliest stages of design.

Caliber’s advanced methodology significantly enhances the efficiency and precision of designing high-complexity IC packages and dense PCB layouts. By leveraging the Cadence Allegro X Design Platform for PCB and advanced package designs, which features sub- rawing management and auto- routing, Caliber’s teams can work in parallel across various circuit blocks, compressing overall project timelines by up to 80 percent. This streamlined framework is reinforced by a rigorous in-house verification process and custom automation utilities developed using the Allegro X Design Platform’s SKILL-based scripting, ensuring consistent quality and compliance with design rules.

To meet the demands of next-generation interconnects operating at over 100 Gbps, Caliber’s engineers utilize Cadence’s Sigrity X PowerSI and Sigrity X PowerDC solutions. These advanced simulation tools allow the team to analyze critical factors such as signal loss, crosstalk, and power delivery network (PDN) impedance. By thoroughly evaluating IR drop, current density, and Joule heating, Caliber can confidently deliver design signoff, reducing the risk of costly respins and speeding time to market for its customers.

“Our team has elevated our engineering leadership by creating a disciplined workflow that delivers exceptional quality and faster turnaround times for our customers across the semiconductor ecosystem,” said Suresh Babu, CEO of Caliber Interconnects. “Integrating Cadence’s advanced design and simulation environment into our proprietary methodology empowers us to push the boundaries of performance and reliability in complex chiplet and ATE hardware design.”

The post Caliber Interconnects Accelerates Complex Chiplet and ATE Hardware Design with Cadence Allegro X and Sigrity X Solutions appeared first on ELE Times.