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Dev kit uses backscatter Wi-Fi for low-power connectivity
HaiLa Technologies has introduced the EVAL2000 development board, featuring its BSC2000 passive backscatter Wi-Fi chip and ST’s STM32U0 MCU. The platform empowers developers and researchers to create ultra-low-power connected sensor applications over Wi-Fi.
The BSC2000 is a monolithic chip that combines analog front-end and digital baseband components to implement HaiLa’s backscatter protocol for 802.11 1-Mbps Direct Sequence Spread Spectrum (DSSS) over Wi-Fi. By using backscattering, it enables low-power communication by reflecting existing Wi-Fi signals instead of generating its own. This allows devices to transmit data with minimal energy consumption. Leveraging readily available, standard Wi-Fi infrastructure, the BSC2000 backscatter Wi-Fi chip collects and transmits sensor data with power efficiency that extends the life of battery-operated sensors.
The EVAL2000 development board accelerates prototyping with GPIO, I2C, and SPI sensor interfaces. Sensor integration is handled through firmware on the MCU. The kit also includes an onboard temperature/humidity sensor.
The BSC2000 EVAL2000 development kit is available for preorder, with shipping anticipated for Q1 2025. For more information on the backscatter Wi-Fi chip and development kit, click here.
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SoC supports multiple wireless protocols
The Talaria 6 family of SoCs from InnoPhase provides Wi-Fi 6, Bluetooth 6.0, Thread, and Zigbee connectivity, along with PSA Level 2 and Level 3 security. Powered by an Arm Cortex-M33 processor and a rich peripheral suite, the SoCs offer the computational performance needed for real-time, on-chip edge AI tasks, including predictive maintenance, sensor analytics, and smart power management.
Talaria 6 wireless SoCs support Wi-Fi 6 (802.11ax) and are Wi-Fi 7 (802.11be) ready, achieving ultra-low power and high-performance connectivity. Integrated digital CMOS radio technology ensures robust throughput in noisy, high-density environments, making them well-suited for smart thermostats, video cameras, and sensors.
Single and dual-band options (2.4 GHz/5 GHz) offer flexible band selection based on use case and network conditions. IEEE 802.11be extensions and multi-link operation improve throughput, lower latency, and increase reliability in congested environments.
Additionally, the SoCs support Bluetooth 6.0, Bluetooth Classic, Thread, and Zigbee mesh networks, enabling seamless integration with a wide range of IoT devices. To protect against cybersecurity threats, Talaria 6 devices feature hardware-based encryption, secure boot, and tamper resistance, safeguarding sensitive data and meeting PSA Level 2 and Level 3 security standards.
The INP6120 2.4-GHz Wi-Fi 6 SoC is expected to sample in Q2 2025, with production starting in Q4 2025. The INP6220 dual-band 2.4/5-GHz Wi-Fi 6 SoC will sample in the second half of 2025, with production beginning in the first half of 2026.
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Synaptics partners with Google to advance edge AI
Synaptics is pairing Google’s ML core with its Astra AI-native hardware and open-source software to simplify context-aware IoT device development. The MLIR-compliant core on Astra hardware accelerates AI processing for vision, image, voice, sound, and other modalities. This combination enables intuitive interaction in wearables, appliances, entertainment systems, embedded hubs, monitoring, and control across consumer, automotive, enterprise, and industrial applications.
The Astra AI-native compute platform for IoT integrates scalable, low-power edge compute silicon with open-source, user-friendly software, robust tools, a strong partner ecosystem, and wireless connectivity. Built on Synaptics’ expertise in neural networks, proven AI hardware, and compiler design for IoT, the platform also supports a wide range of modalities with refined in-house solutions. Google’s ML core, a highly efficient open-source machine learning core, is MLIR-compliant, enhancing compatibility with modern compilers.
For more information about Synaptics’ Astra embedded processors for AI-native IoT, click here.
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Mitsubishi samples high-voltage IGBT modules
Mitsubishi announced that it has begun shipping samples of two new S1-Series high-voltage IGBT modules rated at 1.7 kV. These two components are useful for large industrial equipment, such as railcars and DC power transmitters. With proprietary IGBT devices and advanced insulation structures, the S1-Series modules enhance reliability, minimize power loss, and reduce thermal resistance, supporting more reliable and efficient operation of inverters in large industrial equipment.
The S1-Series incorporates Mitsubishi’s Relaxed Field of Cathode (RFC) diode, increasing the Reverse Recovery Safe Operating Area (RRSOA) by 2.2 times over previous models, improving inverter reliability. Additionally, an IGBT element with a Carrier Stored Trench Gate Bipolar Transistor (CSTBT) structure reduces power loss and thermal resistance, enabling more efficient inverter operation. The upgraded insulation structure boosts insulation voltage resistance to 6.0 kVRMS—1.5 times higher than earlier products—allowing more flexible insulation designs for compatibility with a broader range of inverter types.
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