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A new report by Compound Semiconductor Applications (CSA) Catapult has highlighted how the UK can be a leader in power electronics for data centers and the critical role of compound semiconductors in managing data-center energy consumption...

Infineon Technologies AG of Munich, Germany has introduced its roadmap for next-level battery backup unit (BBU) solutions for uninterrupted operations of AI data centers to avoid power outages and the risk of data losses...

Lip-Bu Tan, who has exposure to both chip design and chip manufacturing worlds due to his CEO stint at EDA powerhouse Cadence, is taking the reins of Intel after Pat Gelsinger was forced out by the Intel board a few months ago. Sally Ward-Foxton takes a closer look in her EE Times piece at what led to Tan’s appointment. She argues that his former leadership roles make him a suitable person to lead Intel, currently torn between its shrinking position in CPU design and its ambitious foray into the foundry business.

Read the full story at EDN’s sister publication, EE Times.

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The post Intel’s new CEO: What you need to know appeared first on EDN.