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News for the compound semiconductor and advanced silicon industryDOE announces 2017 solid-state lighting R&D funding opportunity
Updated: 16 min 16 sec ago
University of Michigan awarded up to $7.5m to bring heat-resistant silicon carbide sensing and computing chips from lab to fab
University of Michigan researchers are leading a multi-million dollar collaborative effort to develop heat-resistant sensing and computing chips made of silicon carbide (SiC) that could advance aircraft, electric and gas-powered vehicles, renewable energy, defense and space exploration...
Categories: Новини світу мікро- та наноелектроніки
University of Michigan awarded up to $7.5m to bring heat-resistant silicon carbide sensing and computing chips from lab to fab
University of Michigan researchers are leading a multi-million dollar collaborative effort to develop heat-resistant sensing and computing chips made of silicon carbide (SiC) that could advance aircraft, electric and gas-powered vehicles, renewable energy, defense and space exploration...
Categories: Новини світу мікро- та наноелектроніки
SounDigital uses Infineon’s 100V normally-off E-mode CoolGaN transistors
Manufacturers of audio equipment constantly seek to enhance sound quality while also meeting the growing demand for compact, lightweight, more integrated and energy-efficient designs. At the same time, they must ensure seamless connectivity, cost-effectiveness and user-friendly functionality, making audio product development more complex than ever...
Categories: Новини світу мікро- та наноелектроніки
First Solar announces final sale amount of 2024 Section 45X Advanced Manufacturing Production tax credits
Cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA has announced the final amount for the sale (announced on 11 December) of Section 45X Advanced Manufacturing Production tax credits generated by the production and sale of solar modules in the USA in 2024 by its operational manufacturing footprint in the USA, including three factories in Ohio and a new Alabama facility...
Categories: Новини світу мікро- та наноелектроніки
ST launches SiPho and next-gen BiCMOS technologies for higher-performing cloud optical interconnect in data centers and AI clusters
With the exponential growth of AI computing needs, challenges arise in performance and energy efficiency across computing, memory, power supply and the interconnections linking them. STMicroelectronics of Geneva, Switzerland says that it is helping hyperscalers, and the leading optical module provider, to overcome these challenges by unveiling its next generation of proprietary technologies for higher-performing optical interconnect in data centers and AI clusters. Its new silicon photonics and next-gen BiCMOS technologies are scheduled to ramp up from second-half 2025 for 800Gb/s and 1.6Tb/s optical modules...
Categories: Новини світу мікро- та наноелектроніки
SemiQ launches 1200V SiC full-bridge modules to simplify development of solar inverters, energy storage and battery charging applications
SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — has announced a family of three 1200V SiC full-bridge modules, each integrating two of the company’s rugged high-speed switching SiC MOSFETs with reliable body diode...
Categories: Новини світу мікро- та наноелектроніки
BluGlass receives AUS$120,000 order for specialized GaN laser bars
BluGlass Ltd of Silverwater, Australia — which develops and manufactures gallium nitride (GaN) blue laser diodes based on its proprietary low-temperature, low-hydrogen remote-plasma chemical vapor deposition (RPCVD) technology — has received an AUS$120,000 order for semi-custom GaN laser diode bar products from a repeat customer, the College of Optics and Photonics (CREOL) at the University of Central Florida...
Categories: Новини світу мікро- та наноелектроніки
Lumileds adds LUXEON HL2X-V LED
Lumileds LLC of San Jose, CA, USA says that its new LUXEON HL2X-V is the latest result of its commitment to addressing lighting manufacturing issues. Many manufacturers with high-power LED solutions are considering re-engineering their designs with mid-power LEDs to take advantage of their lumen/$ position. Now, with LUXEON HL2X-V, manufacturers can achieve lm/$ ratios similar to mid-power products without spending valuable resources on redesigning or re-engineering, says the firm...
Categories: Новини світу мікро- та наноелектроніки
Lumileds’ LUXEON C ES enables small, high-output, complex, multi-color arrays
Multi-color LED fixtures based on a large LED cluster under a single optical system are preferred in many situations for their ability to deliver highly accurate illumination with superior beam quality. Until now, however, LED design has not allowed engineers to address the conflicting needs and challenges inherent to close-packed, high-power LEDs...
Categories: Новини світу мікро- та наноелектроніки
Infinera’s acquisition by Nokia expected to complete on or about 28 February
Infinera Corp of San Jose, CA, USA — a vertically integrated manufacturer of open optical networking systems and optical semiconductors — says that its pending acquisition by Nokia Corp should be completed on or about 28 February, subject to receipt of remaining outstanding regulatory approvals and the satisfaction of other remaining customary closing conditions...
Categories: Новини світу мікро- та наноелектроніки
Sivers appoints Alexander McCann as strategic senior advisor
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs for SATCOMs and photonic lasers for AI data centers) has appointed Alexander McCann as a strategic senior advisor to the board and the CEO. His primary focus will be strengthening and scaling photonics operations...
Categories: Новини світу мікро- та наноелектроніки
CGD raises $32m in Series C funding round
Fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — has closed a $32m Series C funding round led by a strategic investor with participation from British Patient Capital and supported by existing investors Parkwalk, BGF, Cambridge Innovation Capital (CIC), Foresight Group, and IQ Capital...
Categories: Новини світу мікро- та наноелектроніки
Infineon launches CoolGaN G3 Transistor in new silicon-footprint packages
Since gallium nitride (GaN) suppliers have taken various approaches to package types and sizes, leading to fragmentation and a lack of multiple footprint-compatible sources for customers, Infineon Technologies AG of Munich, Germany has launched the high-performance CoolGaN G3 Transistor 100V in RQFN 5x6 package (IGD015S10S1) and 80V in RQFN 3.3x3.3 package (IGE033S08S1)...
Categories: Новини світу мікро- та наноелектроніки
Wolfspeed’s revenue falls 7% in December quarter
For fiscal second-quarter 2025 (for continuing operations, to 29 December 2024), Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has reported revenue of $180.5m, down 7% on $194.7m last quarter and 13% on $208.4m a year ago, but slightly above the midpoint of the $160–200m guidance range...
Categories: Новини світу мікро- та наноелектроніки
OIF unites 35 member companies in interoperability demos at OFC
The Optical Internetworking Forum (OIF) says that, at the Optical Fiber Communication Conference & Exposition (OFC 2025) in San Francisco, CA, USA (30 March–3 April), 35 member companies are uniting to demonstrate advancements in interoperability tailored to addressing the growing demands of future-oriented data centers, AI/ML technologies and disaggregated systems...
Categories: Новини світу мікро- та наноелектроніки
Qorvo’s quarterly revenue hit by mass-tier Android 5G demand falling faster than expected
For its fiscal third-quarter 2025 (ended 28 December 2024), Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has reported revenue of $916.3m, down 12.4% on $1046.5m last quarter and 14.7% on $1073.9m a year ago, albeit slightly above the midpoint of the $900m±$25m guidance...
Categories: Новини світу мікро- та наноелектроніки
Sivers signs MOU with optical infrastructure firm for high-volume production of laser arrays
Sivers Semiconductors AB of Kista, Sweden (which supplies RF beam-former ICs for SATCOMs and photonic lasers for AI data centers) has signed a strategic memorandum of understanding (MOU) with an optical infrastructure firm for large-scale AI workloads for the volume production of high-performance laser arrays...
Categories: Новини світу мікро- та наноелектроніки
Infineon releases first silicon carbide products to customers based on 200mm silicon carbide wafers
Infineon Technologies AG of Munich, Germany says that it has made significant progress on its 200mm silicon carbide (SiC) roadmap, and is releasing the first products based on the 200mm SiC technology to customers in first-quarter 2025. Manufactured in Villach, Austria, the products provide SiC power technology for high-voltage applications, including renewable energies, trains, and electric vehicles...
Categories: Новини світу мікро- та наноелектроніки
IQE raising £18m by issuing convertible loan notes
Epiwafer and substrate maker IQE plc of Cardiff, Wales, UK says that, further to its announcement of 18 November 2024, it has entered into subscription agreements with a consortium of existing investors and certain senior executives and directors, led by its largest shareholder Lombard Odier...
Categories: Новини світу мікро- та наноелектроніки
Infineon adds Q-DPAK and TOLL packages to industrial CoolSiC MOSFETs 650V G2 range
To support the electronics industry’s shift towards more compact and powerful systems and to further drive innovation at the system level, Infineon Technologies AG of Munich, Germany is expanding its portfolio of discrete CoolSiC MOSFETs 650V with two new product families housed in Q-DPAK and TOLL packages...
Categories: Новини світу мікро- та наноелектроніки