Semiconductor today

MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) is showcasing its latest connectivity products at Stand C83 at the European Conference on Optical Communication (ECOC 2024) in Frankfurt, Germany (23-25 September)...

TRUMPF Photonic Components GmbH of Ulm, Germany (part of the TRUMPF Group) — which makes vertical-cavity surface-emitting lasers (VCSELs) and photodiodes — and its customer Optomind Inc of Suwon, South Korea, which provides optical interconnect solutions for data centers including artificial intelligence (AI) and high-performance computing (HPC) networks, are showcasing 100Gbps VCSEL performance at the European Conference on Optical Communication (ECOC 2024) in Frankfurt, Germany (23–25 September). TRUMPF Photonic Componentsis exhibiting in booth C81 and Optomind in booth E33...

Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers for industrial and consumer markets) is showcasing its latest photonic solutions on Stand #A24 at the European Conference on Optical Communication (ECOC 2024) in Frankfurt, Germany (23–25 September). Highlights are as follows...

As part of the ‘Spark their imagination; power their future’ project funded by Innovate UK and run by Compound Semiconductor Applications (CSA) Catapult and the UK Electronics Skills Foundation (UKESF), a total of 24 Year 13 students from across Wales have been awarded bursaries to provide support while they complete electronics-related degrees and help them start careers in technology...

In cooperation with Dr Hermann Oppermann of the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Dr Norwin von Malm (senior director New Technologies) and Stefan Groetsch (who leads the corresponding team within System Solution Engineering) at ams OSRAM GmbH in Premstätten, Austria and Munich, Germany comprise one of three teams nominated as a finalist for the Deutscher Zukunftspreis 2024 (German Future Award), the Federal President’s Award for Technology and Innovation (to be awarded by Federal President Frank-Walter Steinmeier in Berlin on 27 November)...

In booth 11B59 at the 2024 China International Optoelectronic Expo (CIOE) in the Shenzhen World Exhibition and Convention Center (11–13 September), China-based Chengdu InSiGa Semiconductor Technologies Co Ltd and POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — have developed and are showcasing in a live demonstration the combination of POET’s 200Gx4 transmit optical engine using InSiGa’s 200G/lane EML driver ISG-D9616 for 800G and 1.6T modules...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — has announced a reorganization of its engineering team to streamline design, component engineering and new product introduction (NPI) activities globally, in response to active customer demand for 800G-and-higher products directed at the AI systems and hyperscale data-center markets...

In booth 11B59 at the 2024 China International Optoelectronic Expo (CIOE) in the Shenzhen World Exhibition and Convention Center (11–13 September), POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — is showcasing live demonstrations of the following optical products designed for the rapidly accelerating AI systems and hyperscale data-center markets...

POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer, photonic integrated circuits (PICs) and light sources for the data-center, telecom and artificial intelligence (AI) markets — says that its transmit and receive optical engines have been selected by Mentech Technology of Shenzhen, China(which supplies datacom and telecom components, including 200-800G optical modules for data-center networking infrastructure) for use in the development of 800G pluggable transceivers. The sample purchase orders are for initial builds and engineering development...

Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of the Teledyne Defense Electronics Group that provides solutions, sub-systems and components to the space, transportation, defense and industrial markets) has partnered with distributor Flip Electronics of Alpharetta, Georgia, which will maintain inventories of its wafers for military applications, ensuring a consistent and reliable supply of critical components...

The JEDEC Solid State Technology Association (which develops standards for the microelectronics industry) has published ‘JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices’. Developed jointly by the JC-70.1 Gallium Nitride and JC-70.2 Silicon Carbide Subcommittees of JEDEC’s JC-70 Wide Bandgap Power Conversion Semiconductor Committee (which was formed in October 2017 with 23 member companies, rising to over 80 now), JEP200 is available for free download from the JEDEC website...

Infineon Technologies AG of Munich, Germany is one of three teams nominated by the jury for the Deutscher Zukunftspreis 2024, the German Federal President’s Award for Technology and Innovation (to be awarded by Federal President Frank-Walter Steinmeier in Berlin on 27 November)...

Infineon Technologies AG of Munich, Germany has developed what it says is the first 300mm power gallium nitride (GaN) wafer technology to be applied in an existing and scalable high-volume manufacturing environment, helping to drive the market for GaN-based power semiconductors. Compared with 200mm-diameter wafers, 300mm wafers allow the production of 2.3 times more chips per wafer...

Independent power electronics company Quantum Power Transformation (QPT) Ltd of Cambridge, UK — which was founded in 2019 and develops gallium nitride (GaN)-based motor drives — has appointed Dr Simon Hart as an advisor to its board. He is an Honorary Associate Professor and Entrepreneur-in-Residence at the University of Nottingham, and holds C-level roles at several technology companies...

At European Microwave Week (EuMW 2024) in Paris, France (24–26 September), Altum RF of Eindhoven, The Netherlands (which designs RF, microwave and millimeter-wave semiconductors for commercial and industrial applications) is showcasing its featured products and technical expertise in booth #815B at Paris Expo Porte de Versailles...

A European research and industry consortium led by engineered substrate manufacturer Soitec of Bernin, near Grenoble, France has begun work to develop a future generation of high-frequency semiconductors based on indium phosphide (InP)...

Specialty analog foundry Tower Semiconductor Ltd of Migdal Haemek, Israel has announced the production of Wi-Fi 7 RF front-end module (FEM) devices based on its 300mm radio frequency silicon-on-insulator (RFSOI) technology. Partnering with Broadcom Inc, Tower has enabled fully integrated Wi-Fi FEM devices on a single RFSOI die. The solution delivers superior performance and efficiency compared with existing non-SOI technologies...

GlobalFoundries (GF) of Malta, NY, USA has joined the semiconductor startup ecosystem of Silicon Valley-based Silicon Catalyst (the only incubator+accelerator focused exclusively on semiconductor solutions) as a Strategic Partner and an In-Kind Partner (IKP). The partnership will provide innovative start-ups with access to GF’s differentiated platforms to speed the development and commercialization of next-generation IoT, automotive and generative AI applications while anticipating future growth markets such as medical and quantum compute...

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has unveiled a silicon carbide module designed to transform the renewable energy, energy storage and high-capacity fast-charging sectors through improved efficiency, durability, reliability and scalability. The 2300V baseplate-less silicon carbide power modules for 1500V DC bus applications were developed and launched utilizing Wolfspeed’s 200mm silicon carbide wafers...

According to its 2024 Sustainability Report, cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA has established new industry benchmarks including verifiable leadership in ultra-low-carbon solar technology, high-value recycling, respect for human rights, and transparent reporting. First Solar is the largest solar manufacturer in the Western Hemisphere and the world’s largest high-value solar panel recycler...