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News for the compound semiconductor and advanced silicon industryDOE announces 2017 solid-state lighting R&D funding opportunity
Updated: 19 min 34 sec ago

Micro-LED chip market growing at 84% CAGR to $579m by 2028

Tue, 06/04/2024 - 12:41
The micro-LED chip market is rising at a compound annual growth rate (CAGR) of 84% from just $27m in 2023 to $579m by 2028, forecasts TrendForce’s ‘2024 Micro LED Market Trend and Cost Analysis Report’...

Coherent appoints Jim Anderson as CEO as Mattera retires

Mon, 06/03/2024 - 20:10
The board of directors of materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has appointed Jim Anderson, an established industry executive with a proven track record of driving innovation and leading business transformations, as CEO. Anderson also joins the board. He succeeds Dr Vincent D. (Chuck) Mattera Jr, who is retiring as chair & CEO...

AlixLabs gains SEK2.5m grant from Sweden’s Vinnova

Mon, 06/03/2024 - 18:11
AlixLabs AB of Stockholm, Sweden — which was spun off from Lund University in 2019 and has developed Atomic Layer Etching (ALE) Pitch Splitting technology (APS) — has been granted SEK2.5m (equivalent to about €220,000) by Sweden’s innovation agency Vinnova, for continuous R&D of its semiconductor products, starting September 2024 through August 2026. The funding is part of a SEK4m (about €350,000) grant from the strategic innovation program Electronic Components and Systems and its Research and Innovation Projects 2024, with SEK1.5m going to Halmstad University...

Infineon adds Thin-TOLL 8x8 and TOLT packaged families to CoolSiC MOSFET discretes 650V portfolio

Mon, 06/03/2024 - 14:52
Infineon Technologies AG of Munich, Germany is expanding its portfolio of CoolSiC MOSFET discretes 650V by introducing two new product families housed in the Thin-TOLL 8x8 and TOLT packages, enabling maximum utilization of the PCB mainboard and daughter cards while also taking the system’s thermal requirements and space restrictions into account...

Latest issue of Semiconductor Today now available

Fri, 05/31/2024 - 15:52
For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, subscribe to Semiconductor Today magazine...

Cambridge GaN Devices signs MoU with ITRI covering GaN-based power supply development

Thu, 05/30/2024 - 14:40
Fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — has signed a memorandum of understanding (MoU) with Taiwan’s Industrial Technology Research Institute (ITRI) to solidify a partnership in developing high-performance GaN solutions for USB-PD adaptors. The MoU also covers the sharing of domestic and international market information, joint visits to potential customers, and promotion...

Luminus adds improved version of SST-08-UV LED

Wed, 05/29/2024 - 20:33
In the latest addition to its high-power UV-A LED series, Luminus Devices Inc of Sunnyvale, CA, USA – which designs and makes LEDs and solid-state technology (SST) light sources for illumination markets – has introduced the SST-08H-UV as the improved version of its SST-08-UV...

Axus secures $12.5m in funding from IntrinSiC

Wed, 05/29/2024 - 19:50
Axus Technology of Chandler, AZ, USA – a provider of chemical-mechanical polishing/planarization (CMP), wafer thinning and surface-processing solutions – has received $12.5m in capital funding from IntrinSiC Investment LLC of Palo Alto, CA, USA, a private equity firm that invests in suppliers of key enabling technology for silicon carbide (SiC). In addition, the firm has secured a significant revolving and term line of credit from a leading national bank...

Infineon launches CoolGaN transistor families built on 8-inch foundry processes

Wed, 05/29/2024 - 14:27
Infineon Technologies AG of Munich, Germany has announced two new generations of high-voltage (HV) and medium-voltage (MV) CoolGaN devices that now enable customers to use gallium nitride (GaN) in voltage classes from 40V to 700V in a broader array of applications that help to drive digitalization and decarbonization...

SiC and GaN power semiconductor market growing at 22.9% CAGR from $1.41bn in 2024 to $11.08bn in 2034

Tue, 05/28/2024 - 14:21
The global SiC and GaN power semiconductor market will rise at a compound annual growth rate CAGR of 22.9% from $1.41bn in 2024 to $11.08bn in 2034, forecasts a report by Fact.MR...

EVG highlights heterogeneous integration technologies at ECTC

Tue, 05/28/2024 - 11:34
EV Group of St Florian, Austria – a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications – says that new developments in heterogeneous integration enabled by its wafer-to-wafer (W2W) and die-to-wafer (D2W) bonding, lithography and infrared (IR) laser release solutions are being highlighted in papers presented at the 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) at The Gaylord Rockies Resort & Convention Center in Denver, CO, USA (28-31 May), where EVG is also exhibiting in booth 522...

CrayoNano announces volume delivery to key water disinfection customer

Tue, 05/28/2024 - 10:39
CrayoNano AS of Trondheim, Norway — which develops and manufactures semiconductor components based on patented and proprietary nanomaterials technology — has announced the high-volume delivery of its CrayoLED H-Series (CLH-N3S) UV-C LED components to a key customer, described as a global leader in the development, manufacturing and sales of UV-C LEDs systems and disinfection products for water, air and surface applications...

Infineon unveils CoolSiC MOSFET 400V family

Tue, 05/28/2024 - 10:26
With the increasing power requirements of artificial intelligence (AI) processors, server power supplies (PSUs) must deliver more and more power without exceeding the defined dimensions of the server racks. This is driven by a surge in energy demand of high-level GPUs, which could consume 2kW and more per chip by the end of the decade...

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