Semiconductor today

In booth C81 at the European Conference on Optical Communication (ECOC 2024) in Frankfurt, Germany (23–25 September), TRUMPF Photonic Components GmbH of Ulm, Germany (part of the TRUMPF Group) — which makes vertical-cavity surface-emitting lasers (VCSELs) and photodiodes — is presenting upcoming advances in VCSEL technology aimed at meeting evolving demands of the future datacom market...

Axus Technology of Chandler, AZ, USA – a provider of chemical-mechanical planarization (CMP), wafer thinning and surface-processing solutions – has announced that its flagship Capstone CS200 platform tools offer what is claimed to be the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide (SiC) wafers. Compared to its closest competitor, Axus’s small-footprint Capstone delivers twice the throughput at less than half the total cost per wafer...

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has announced the general availability and production release of what is claimed to be the industry’s first 100G ZR QSFP28 digital coherent optics (DCO) transceiver...