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NYSE American LLC says that the staff of NYSE Regulation has begun delisting the common stock of high-power industrial blue laser maker NUBURU Inc of Centennial, CO, USA (which was founded in 2015) from the NYSE American stock exchange. Trading in the firm’s common stock has been suspended...

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https://preview.redd.it/m2aqyzoa5l6d1.png?width=2160&format=png&auto=webp&s=31b0c6a3c1cae1a47e7c9ccb77d134f13fd3f422 https://preview.redd.it/9bq51kdg5l6d1.png?width=3840&format=png&auto=webp&s=57b83cbfeb1f0c80bbc5aa9fe99b738570b1045b My first electronics project was an annual clock based on something I saw on kickstarter a while ago. The clock slowly advances ~1-degree a day and you can see the year progressing in a whole different way. Just in the 3 weeks I've been working on it has advanced 20-degrees and it gave me an interesting perspective on what % of my year went by in a very intuitive way, It was a great learning experience and got help from this community too--thanks! If anyone is looking for a simple project that has a fun deliverable, take a look. I think it'd be perfect for STEM programs starting at middle school. https://www.instructables.com/Annual-Clock-Experience-Time-on-a-Wider-Scale/ I am definitely open to feedback for any part--hardware, software, instructions, etc--so please share anything that you think would help get more people to be successful with projects like this! submitted by /u/micasa_es_miproblema [link] [comments]

WIN Semiconductors Corp of Taoyuan City, Taiwan – which provides pure-play gallium arsenide (GaAs) and gallium nitride (GaN) wafer foundry services for the wireless, infrastructur and networking markets – has expanded its portfolio of RF GaN technologies with the beta release of its highly robust NP12-0B millimeter-wave (mmWave) gallium nitride on silicon carbide (GaN-on-SiC) technology...

Kymera International of Research Triangle Park, NC, USA (which develops and manufactures specialty materials and high-performance surface coatings) has signed an agreement to acquire Fiven ASA of Oslo, Norway from Los Angeles-based global private equity firm OpenGate Capital, which acquired Fiven in 2019 through a corporate carve-out from Saint-Gobain...

The next frontier in U.S. semiconductor restrictions for Chinese companies is gate-all-around (GAA) chip manufacturing technology. According to a Bloomberg report, measures are being discussed to limit Chin’s access to this advanced technology, widely considered a successor to the FinFET technology currently used in manufacturing cutting-edge semiconductor devices.

GAA, also known as gate-all-around field-effect transistor (GAAFET), replaces the vertical fins used in FinFET technology with a stack of horizontal sheets. This GAA structure further reduces leakage while increasing drive current, thus bolstering transistor density and delivering power and performance benefits.

Figure 1 GAA turns FinFET transistors sideways to make channels horizontal instead of vertical to extend semiconductor device scaling and reduce power consumption. Source: Samsung

In March this year, the U.K. imposed controls over GAA transistor technology on companies in China. Now, a source in Bloomberg report claims that the United States and other allies are expected to follow the U.K. in imposing controls on GAA technology this summer.

However, these access controls haven’t been finalized yet, mainly because the early version is considered very broad. It doesn’t make a clear distinction between whether these restrictions are aimed at stopping China from developing its own GAA technology or blocking chipmakers from the United States and its allies from selling GAA-based chips to companies in China.

Among the U.S. allies, South Korea is notable in this affair because Samsung Foundry is a pioneer in commercializing the GAA manufacturing technology in its 3-nm process node. Intel is expected to implement GAA transistor architecture in its 20A node which will be unveiled later this year. TSMC plans to employ GAA technology in its 2-nm process node to be made available in 2026.

That shows Samsung is ahead of the curve in GAA chip manufacturing architecture, so it’ll be interesting to see South Korea’s take on this matter. It’s worth noting that the Bloomberg report quotes anonymous sources and stresses that deliberations are private.

While South Korea and its tech star Samsung are likely to be at the center of this affair, the Bloomberg report also revealed some early-stage discussions about limiting exports of high-bandwidth memory (HBM) chips to China. That will put South Korea at the center of another technology export conflict as two of the three companies supplying HBM chips are from South Korea.

Figure 2 HBM is a high-end memory that stacks DRAMs using vertical channels called through-silicon vias (TSVs). Source: Samsung

Samsung and SK hynix, along with U.S. memory chip maker Micron, currently produce these high-end memory chips, which are considered crucial in AI applications while being paired with artificial intelligence (AI) processors. New restrictions on HBM chips, like GAA, could significantly impact South Korean tech-related exports.

The U.S. semiconductor technology export restrictions imposed on companies in China have mostly impacted chip vendors in the United States, with the exception of lithography expert ASML, which is based in the Netherlands. Now, South Korea could bear the brunt of these potential restrictions on GAA and HBM technologies.

As the Bloomberg report points out, no final decision has been made yet. But it’d be interesting to see how South Korean technology and trade officials respond to such export restrictions, especially, regarding the export of HBM chips, for which Samsung and SK hynix command nearly 90% of the market.

Related Content

• Samsung Seen Stumbling at Silicon’s Leading Edge
• Samsung Plans Aggressive Rollout of Next-Gen Transistors
• Samsung unveils plans for 2-nm and 1.4-nm process nodes
• All you need to know about GAA chip manufacturing process
• From FinFET to GAA: Samsung’s fab journey to 3 nm and 2 nm

The post What GAA and HBM restrictions mean for South Korea appeared first on EDN.

On 1 July, Tokyo-based Mitsubishi Electric Corp will begin sampling 8W and 14W gallium nitride (GaN) monolithic microwave integrated circuit (MMIC) power amplifiers, shipped as customer-board-friendly bare chips, suitable for use in emergency communications and Ka-band multi-carrier satellite-communication (SATCOM) earth stations...

Joining one flat piece of metal to another flat piece of metal is a common requirement, but sometimes the choice of method lies open. For a case in point, please consider these two kitchen spatulas in Figure 1 and Figure 2.

Figure 1 One side of a pair of kitchen spatulas, one with two rivets and one with two spot welds. Source: John Dunn

Figure 2 The back side of the pair of kitchen spatulas. Source: John Dunn

Handle attachments to the spatula blade are made with two rivets in the tool on the left while the attachments are made in the other tool using spot welds. The fixture used for doing spot welding can be roughly sketched as follows in Figure 3.

Figure 3 A diagram of the fixture used to spot weld where a large current is passed through the junction of two pieces of metal, creating a high enough DC resistance between the electrodes to melt some of the metal. This then cools off and solidifies, fusing the flat pieces of metal to each other in a specific “spot”. Source: John Dunn

The welding process passes a very large current, AC or DC, through the junction of two pieces of metal being joined so that the DC resistance in between the two electrodes gets hot enough to melt some of the metal which then cools off and solidifies to fuse the two pieces of metal to each other at that “spot”, hence the name “spot welding”.

This process can be scaled for very small pieces of work like the two welds on this flashlight D-cell (Figure 4):

Figure 4 Two Very small spot welds on a flashlight D-cell. Source: John Dunn

to very large pieces as in automotive spot welding like Figure 5:

Figure 5 Two spot welds on an automobile door. Source: John Dunn

The more detailed scenario in spot welding involves:

• When to apply the physical force
• When to turn on the welding current
• When to turn it off
• How long to let the work pieces cool before releasing the physical force
• Whether the two contacting electrodes need to be given extra cooling measures such as water flow within

The technology is quite sophisticated.

There are also personal cautions to bear in mind. One is that this procedure makes some very strong magnetic fields. If/when the work pieces melt, molten metal can be sprayed out.

“Danger, Will Robinson!”

The other thing is that magnetic fields can do a destructive number on some wristwatches as well as on credit card strips and the like, so if you are operating such a fixture, pay attention to what you may be wearing or carrying on your person.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The post A look at spot welding appeared first on EDN.

In the realm of industrial automation, mobile Automated Guided Vehicles (AGVs) and Autonomous Mobile Robots (AMRs) are indispensable in enhancing efficiency by transporting materials within factories and warehouses. Both AGVs and AMRs share fundamental attributes and perform similar automation tasks, but their key differences in navigation capabilities and obstacle avoidance set them apart.

AGVs: Precision and Predictability

AGVs operate by following predetermined routes, and they do not deviate from these paths. When an AGV encounters an obstacle, it stops and waits until the obstacle is removed. AGVs employ various sensing techniques to detect their routes:

1. Magnetic Tape: Sensors under the AGV detect magnetic tape on the factory floor and adjust the vehicle’s position accordingly. Additional magnetic tape can encode specific locations.
2. Inductive Wire: Embedded wires in the floor guide the AGV, with sensors detecting the wire to maintain the correct path.
3. Visual Tracking: Coloured tapes or markers like AprilTags are placed on the ground and detected by RGB cameras to map the route and determine location.
4. Laser Guidance: A 360° laser on the AGV interacts with reflectors installed in the facility, measuring distances and angles to triangulate the AGV’s position.

AMRs: Flexibility and Intelligence

AMRs, on the other hand, utilize Simultaneous Localization and Mapping (SLAM) to navigate autonomously. Equipped with depth sensors, typically Lidar scanners, AMRs create and store detailed maps of their environment. This process involves initially driving the AMR around the facility to accumulate scans and generate a complete map. The map is then stored on the AMR and in fleet management control software and can be enhanced with additional data such as keep-out zones, speed reduction areas, and docking station locations. Goals are set on the map as coordinates, which the AMR navigates between by continuously comparing real-time scans with the stored map and adjusting its route to avoid obstacles.

Advantages and Disadvantages of AGVs

The main advantage of AGVs is their ability to follow a predetermined route with high precision and consistency, making them ideal for high-volume, repetitive tasks. However, AGVs require substantial infrastructural changes, such as installing and maintaining tapes, wires, or reflectors. These components are susceptible to wear and tear, and any necessary adjustments can significantly disrupt operations. Furthermore, AGVs cannot navigate around obstacles autonomously, which can lead to operational downtime.

Advantages and Disadvantages of AMRs

While AMRs have a higher initial cost and are less predictable in terms of exact travel time compared to AGVs, their advantages are substantial. AMRs do not require any infrastructural changes, as they can localize and navigate without markers. Updates to tasks and goals can be made quickly through software, and facility expansions or automation upgrades can be accommodated by generating new maps or extending existing ones.

In dynamic environments, the ease of use, flexibility, and scalability of AMRs provide a clear advantage. Their enhanced sensing capabilities, including longer-range Lidar, 3D depth sensing, radar, and RGB vision technologies, combined with superior computing power and artificial intelligence, enable advanced features and improved human-robot interaction.

Conclusion

In the evolving landscape of industrial automation, the choice between AGVs and AMRs hinges on specific operational needs. AGVs excel in environments requiring high precision and repetitive tasks but come with significant infrastructure and maintenance demands. AMRs offer unparalleled flexibility and adaptability, making them suitable for dynamic and rapidly changing environments. Ultimately, the decision should be based on the specific requirements and future scalability of the automation tasks at hand.

The post Choosing the Right Solution for Industrial Automation: AGVs vs. AMRs appeared first on ELE Times.

Launch services and space systems provider Rocket Lab USA Inc has signed a non-binding preliminary memorandum of terms (PMT) with the Department of Commerce that would see Rocket Lab receive up to $23.9m in direct funding under the CHIPS and Science Act...

A new computer vision technique developed by MIT engineers is set to revolutionize the screening process for electronic materials, significantly speeding up the characterization phase, which has been a major bottleneck. This innovation could dramatically boost the development of high-performance materials for solar cells, transistors, LEDs, and batteries.

Key Advancements

1. Speed and Efficiency: The new method characterizes electronic properties of materials 85 times faster than conventional methods. This is achieved through the use of computer vision algorithms that analyze images of printed semiconducting samples.
2. Key Properties Analyzed: The technique estimates two critical electronic properties:

• Band Gap: The energy required to activate electrons.
• Stability: The longevity of the material under various conditions.

3. Automation and Integration: The technique is designed to be part of a fully automated materials screening system, potentially leading to an autonomous lab setup. This system would continuously make and test new materials based on AI predictions, operating 24/7 until the optimal material is discovered.
4. Applications and Benefits: The technique can be applied across various fields, including solar energy, transparent electronics, and advanced transistors. It leverages the richness of hyperspectral imaging data, processed by sophisticated algorithms, to quickly and accurately determine material properties.

Detailed Process

Hyperspectral Imaging: Unlike standard cameras, hyperspectral cameras capture detailed images with 300 colour channels. The first algorithm processes this data to compute the band gap swiftly.

Stability Assessment: The second algorithm uses standard RGB images to monitor changes in the material’s colour over time, correlating these changes to stability.

Research and Development

The technique was developed and tested by MIT researchers, including graduate students Eunice Aissi and Alexander Siemenn, with contributions from their colleagues and international collaborators.

Validation and Accuracy: When compared to manual characterization by experts, the new method showed 98.5% accuracy for band gap estimation and 96.9% accuracy for stability, demonstrating both speed and precision.

Future Outlook

The researchers envision integrating this technique into a fully automated materials discovery pipeline, enhancing the speed and efficiency of developing new electronic materials. This innovation holds promise for significant advancements in renewable energy and electronic technologies.

This breakthrough in computer vision and materials science marks a significant step towards more efficient and rapid development of advanced functional materials, essential for the next generation of electronic devices.

For more detailed information, you can refer to the original study published in Nature Communications.

The post Breakthrough in Computer Vision Speeds Up Screening of Electronic Materials appeared first on ELE Times.