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Rohde & Schwarz and Qualcomm Technologies, Inc. have successfully validated the high-throughput performance of a 5G NR connection at 13 GHz, a band that falls within the proposed FR3 frequency range. This milestone, which the two companies will demonstrate jointly at MWC 2025 Barcelona, paves the way for the next generation of wireless networks.

Rohde & Schwarz and Qualcomm Technologies, Inc. have demonstrated the feasibility of the proposed FR3 frequency range (7.125 GHz to 24.25 GHz) for future 6G wireless networks. Through their collaborative effort, the two companies successfully validated the performance of Qualcomm Technologies’ 5G mobile test platform (MTP) using the CMX500 5G one-box signaling tester (OBT) in a maximum throughput use case at 13 GHz, a frequency band within the proposed FR3 range. This achievement confirms the potential of FR3 to deliver high data rates utilizing high modulation and coding schemes (MCS) and enhanced capacity leveraging 4×4 MIMO (Multiple-Input Multiple-Output) technology.

The test setup is based on the CMX500 OBT, a future-proof multi-technology, multi-channel one-box signaling tester from Rohde & Schwarz. Its versatility allows for easy adaptation to different NR numerologies, making it the ideal choice for FR3 research and development. In this demonstration, the CMX500 OBT is used to:

• Create a signaling environment by transmitting an FR3 cell signal at 13 GHz, simulating real-world
• Conduct comprehensive analysis, verifying the device’s ability to achieve maximum throughput in the FR3 frequency range, ensuring reliable and efficient operation.

Christoph Pointner, Senior Vice President of Mobile Radio Testers at Rohde & Schwarz, says: “Our collaboration with Qualcomm Technologies demonstrates the power of joint innovation. Together, we’re accelerating the development of tomorrow’s 6G technologies, pushing the boundaries of what’s possible in wireless communication.

Tingfang Ji, Vice President of Engineering at Qualcomm Technologies, Inc., says: “We’re excited to have Rohde & Schwarz as a partner in shaping the future of mobile technology. Together, we create groundbreaking solutions that empower device manufacturers to speed up innovations in the next generation of wireless communications, ultimately enriching the mobile experience for users worldwide.”

Rohde & Schwarz and Qualcomm Technologies will jointly showcase a high-performance setup for early FR3 research featuring the CMX500 OBT at Mobile World Congress 2025 at Fira Gran Via in Barcelona in hall 5, booth 5A80. For more information on the CMX500 OBT, visit: http://www.rohde-schwarz.com/product/cmx500

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SECORA Pay Green by Infineon Technologies AG paves the way for more sustainable payment cards. This innovation together with Infineon’s active contribution to global CO2 reduction has been motivating Mastercard to admit Infineon to its Greener Payments Partnership (GPP) advisory council.

Mastercard and its industry partners are continuously working to reduce first use plastic usage in the payment card industry, seeking more sustainable solutions for card bodies. Significant progress has already been made, including increased reuse of materials, improved recyclability at the end of a card’s life cycle, and reduced overall volume of plastic used in Mastercard-branded cards. Infineon contributes to the partnership with their expertise in reducing CO₂ emissions in a sustainable chip and module production: With SECORA Pay Green, Infineon provides the technical basis to produce fully recyclable dual-interface contactless payment card bodies without additional card antenna.

According to ABI Research, customers are increasingly attracted to financial institutions that emphasize sustainable banking practices. Furthermore, more and more regulations and legal guidelines for environmental protection in the financial industry are emerging. The number of payment cards made from recycled PVC (rPVC) is forecast to increase to around 1.2 billion cards shipped worldwide by 2028, almost five times the 226 million cards shipped in 2022.

“With the introduction of SECORA Pay Green, we are not only setting a new standard for sustainable payment cards but also paving the way for a greener future in the payment industry,” said Tolgahan Yildiz, Head of the Trusted Mobile Connectivity and Transactions Product Line at Infineon. “By reducing CO2 emissions and facilitating recycling, we enable financial institutions and card issuers to make a

ABI Research, 2023

positive contribution to environmental protection while meeting growing customer demand for eco-friendly solutions.”

“Our current product offerings have proven that payment cards with enhanced recyclability can be made from sources that reduce first use plastic usage,” said Joe Pitcher, Vice President of the Mastercard Sustainable Card Program. “To further drive development and CO2 abatement, we support innovations such as Infineon’s SECORA Pay Green, which demonstrates innovative thinking and a willingness to redesign products to reduce their environmental impact.”

Going forward, Mastercard and its partners will focus on assessing and reducing CO₂ emissions across the entire card ecosystem, including the chip, module, and inlay. Infineon will support these efforts by paving the way for Infineon’s sustainable payment offering now as a new member of Mastercard’s Greener Payment Partnership. exceet Card Group, a leading European card manufacturer, has become the first one who has obtained its Mastercard Letter of Approval based on Infineon SECORA Pay Green to be able to ship sustainable contactless payment cards without an additional card inlay.

SECORA Pay Green for a more sustainable future

SECORA Pay Green is an important part of Infineon’s climate strategy to achieve carbon neutrality by 2030. The security solution enables the production of fully recyclable dual-interface contactless payment card bodies made from environmentally friendly and locally sourced materials.

Learn more about SECORA Pay Green here: www.infineon.com/secorapaygreen

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• New silicon photonics and next-gen BiCMOS proprietary technologies bring better performance to address the coming 800Gb/s and 1.6Tb/s optical interconnects.
• Developing a roadmap with partners across the value chain for higher energy efficiency pluggable optics and to address the next generation of AI clusters GPU interconnects.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is unveiling its next generation of proprietary technologies for higher-performing optical interconnect in datacenters and AI clusters. With the exponential growth of AI computing needs, challenges arise in performance and energy efficiency across computing, memory, power supply, and the interconnections linking them. ST is helping hyperscalers, and the leading optical module provider, overcome those challenges with new silicon photonics and next-gen BiCMOS technologies, scheduled to ramp up from the second half of 2025 for 800Gb/s and 1.6Tb/s optical modules.

At the heart of interconnections in a datacenter are thousands, or even hundreds of thousands, of optical transceivers. These devices convert optical into electrical signals and vice versa to allow data flow between graphics processing unit (GPU) computing resources, switches and storage. Inside these transceivers, ST’s new, proprietary silicon photonics (SiPho) technology will bring customers the ability to integrate multiple complex components into one single chip, while ST’s next-gen, proprietary BiCMOS technology brings ultra high-speed and low power optical connectivity, which are key to sustain the AI growth.

Fiber Optic cables and UTP Network cables connected hub ports.

“AI demand is accelerating the adoption of high-speed communication technology within the datacenter ecosystem. This is the right time for ST to introduce new power efficient silicon photonics technology and complementing it with a new generation of BiCMOS for our customers to design the next wave of optical interconnect products, which will enable 800Gbps/1.6Tbps solutions for the hyperscalers,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group at STMicroelectronics. “Both technologies will be manufactured on 300mm processes in Europe, bringing customers an independent high-volume supply for two key components of their optical module development strategy. Today’s announcement represents the first step for our PIC product-family and, thanks to close collaboration with key partners across the entire value chain, our ambition is to become a key supplier of silicon photonics and BiCMOS wafers for the datacenter and AI cluster market, be it pluggable optics today or optical I/O tomorrow.”

“AWS is pleased to collaborate with STMicroelectronics to develop a new silicon photonics technology (SiPho), PIC100, that will enable interconnection between any workload including Artificial Intelligence (AI). AWS is working with STMicroelectronics based on their demonstrated capability to make PIC100 a leading SiPho technology for the optical and AI market. We are enthusiastic about the potential innovations this will unlock for SiPho,” said Nafea Bshara, Vice President and Distinguished Engineer at Amazon Web Services.

“The Pluggable Optics for Data Center Market is experiencing significant growth, valued at $7 billion in 2024,” said Dr. Vladimir Kozlov, CEO and Chief Analyst at LightCounting. “This market is expected to grow at a Compound Annual Growth Rate (CAGR) of 23% during 2025—2030 to exceed $24 billion at the end of this period. Market share of transceivers based on silicon photonics modulators will increase from 30% in 2024 to 60% by 2030.”

Additional information

ST’s SiPho technology combined with the ST BiCMOS technology are a unique 300mm silicon platform to serve the optical market. Both technologies are being industrialized and will be manufactured in ST’s Crolles (France/Europe) 300mm fab.

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I’m pretty sure it’s just incandescence, but the behavior of it feels odd— it only glows above 9 volts at which point current will pass and it immediately reaches full brightness— no fade-in. If I didn’t know better I’d say it acts like an LED. My guess is that it’s just reaching some breakdown voltage and after which it passes current and glows. Current passed from base-collector. Draws about 300mA at 20 volts. And yes it was already blown— no live transistors were harmed lmao submitted by /u/possibly_random [link] [comments]

Non-volatile memory is an important component in a wide range of high-performance embedded applications. Especially, many consumer, industrial, and medical applications need increased re-writability to support both more frequent code updates as well as increased data logging.

These applications require greater memory density to store either a substantially larger code footprint and/or more extensive data logs. Moreover, developers need to be able to improve power efficiency while lowering system cost.

Today, there are numerous non-volatile memory technologies available to developers, including EEPROM, NOR flash, NAND flash, MRAM, and FRAM. Each has its own distinct advantages for specific applications. However, the combination of 1) manufacturing process technologies continuing to scale smaller, 2) the need for higher densities at lower power, and 3) re-writability becoming increasing important has led to increased interest in RRAM for these applications.

This article will explore RRAM technology and how it provides developers with a new approach to meeting the changing memory requirements of high-performance embedded systems.

Memory in high-performance embedded systems

Emerging connected systems face a number of tough design challenges. For instance, medical devices—such as hearing aids, continuous glucose monitors (CGMs), and patches—must fit into a smaller form factor despite increasing data and event logging requirements necessary to enable remote monitoring and compliance with industry standards.

Next, smart equipment in Industry 4.0 systems require significantly greater code storage to facilitate functionality like remote sensing, edge processing, and firmware over-the-air (FOTA) updates for remote maintenance. Furthermore, the addition of artificial intelligence (AI) at the edge in wearables and Internet of Things (IoT) devices is driving the need for high-performance, energy-efficient non-volatile memory in smaller form factors.

The increased code size and data logging requirements of such systems exceeds the embedded non-volatile memory capabilities of microcontrollers. External memory is needed to match increasing density and performance requirements. However, code and data often need varying capabilities depending upon performance, density, endurance, and data-write size.

Thus, multiple non-volatile memories may have to be used, such as NOR flash for data logging and high-density EEPROM for code storage. This can lead to systems that use several types of external memory, increasing system cost, complexity, and energy consumption.

Ideally, systems can use a single memory type that supports both external code and data storage without compromising performance or functionality for either. An emerging non-volatile technology to fill this gap as a standalone external memory is RRAM.

Resistive RAM

Resistive RAM (RRAM) is a non-volatile random-access memory that was made available commercially in the early 2000s. It operates by changing the resistance of a switching material sandwiched between two electrodes, show on left in Figure 1.

Figure 1 Typical RRAM memory cell consists of one transistor and one resistor (left), and the memory state is altered by applying an external bias across the metal electrodes (right). Source: Infineon

The switching material can be metal oxide or a conductive bridging switching media. A typical RRAM memory cell consists of one transistor and one resistor pair (1T1R) where the resistance of the RRAM can be altered with an external bias applied across the metal electrodes, shown on the right side of Figure 1.

Initially, RRAM was developed as a potential replacement for flash memory. At the time, the cost and performance benefits of RRAM weren’t enough to supersede the advantages of other non-volatile memory technologies, especially as an external memory. However, in recent years, several factors have changed to make RRAM a compelling non-volatile alternative.

Specifically, as embedded systems become more integrated and implemented in smaller manufacturing process nodes with substantially larger code and data storage requirements, the following advantages of RRAM for external memory overtake traditional non-volatile options:

1. Scalability

Some non-volatile memory technologies are limited in their ability to scale, translating to limitations in overall memory density due to footprint, power, and cost. A major advantage of RRAM is that it can be manufactured in a compatible CMOS process, enabling it to scale to process nodes below 45 nm and even down as low as 10 nm.

For example, the memory industry has had difficulty cost-effectively scaling NOR flash memory as the technology seems to be physically limited to between 35 and 40 nm. Scalability has a direct impact on performance, density, footprint, and energy efficiency.

2. Direct write

Data storage for a NOR flash memory requires two operations: an erase operation to clear the target address followed by a write operation. The “direct write” functionality of RRAM eliminates the need to first erase memory. Thus, only a write operation is required to store data. Figure 2 shows the operations required for writing to both NOR flash and RRAM.

Figure 2 NOR flash requires an erase operation before every write operation, increasing write time, energy consumption, and wear on memory cells. RRAM’s ability to direct write speeds write operations, conserves energy, and extends cell endurance. Source: Infineon

This leads to much faster large-scale write operations for RRAM, such as during FOTA updates.

3. Byte re-writeable

Some non-volatile memories perform writes based on page size. For example, NOR flash page size is typically either 256 or 512 bytes. This means every write impacts the entire page. To change one byte, the page must be read and stored in a temporary buffer; the change is made to the temporary duplicate.

The flash must then erase the page and write the entire page back in from the buffer. This process is time-consuming and wears the flash (typically 100k+ writes). In addition, data cells that are not changed are worn unnecessarily. Consequently, data logging with NOR flash requires that data is cached and then written in page-sized chunks, adding complexity and potential data loss during a power event.

In contrast, RRAM write size is much smaller (few bytes) with higher endurance than NOR flash. This is more manageable and accommodates data logging requirements well since cells are worn only when written to. Thus, RRAM is robust and efficient for both code storage and data logging in the same memory device.

4. Energy efficiency

Through optimizations such as byte re-writability and eliminating erase operations during data writes, RRAM achieves better energy efficiency, up to 5x lower write energy and up to 8x lower read energy compared to traditional NOR flash.

5. Radiation tolerance and electromagnetic immunity

RRAM technology is inherently tolerant to radiation and electromagnetic interference (EMI). This makes RRAM an excellent choice for those applications where environmental robustness is essential.

Consolidate code storage and data logging

RRAM is a proven technology whose time has come. It’s an established technology that has been in embedded form in chips for over a decade as an internal non-volatile memory. With its ability to scale to smaller process nodes, provide higher endurance and re-writability at low power, and minimize write time and power consumption through direct write functionality, RRAM delivers high performance without compromising robustness or efficiency (Table 1).

Table 1 The above data shows a comparison between RRAM and other non-volatile memory technologies. Source: Infineon

RRAM is an ideal memory for consolidating both code storage and data logging in a single external memory to simplify design and reduce system complexity, making RRAM a compelling alternative to traditional non-volatile memories for many consumer, industrial, and medical applications.

Bobby John is senior product marketing manager for memory solutions at Infineon Technologies.

Related Content

• Resistive RAM Memory is Finally Here
• RRAM set to follow 3-D flash, says IMEC
• RRAM: A New Approach to Embedded Memory
• RRAM Startup Raises £7M to Support Data-Hungry Applications
• Monolithic embedded RRAM presents challenges, opportunities

The post RRAM: Non-volatile memory for high-performance embedded applications appeared first on EDN.

submitted by /u/telcodan [link] [comments]

A fragmented ecosystem

Embedded developers have an ongoing struggle to keep the pace by upgrading compilers and debugging tools, while ensuring the processing hardware going into their systems are right-sized for the application. Conventional embedded development tends to force engineers to stick with an established, often vendor-specific, ecosystem where shifting to a different IDE comes with its own costly learning curves. MCU companies and other manufacturers with a foothold in embedded processing are beginning to release solutions that embrace third-party development environments to appeal to the larger market while also maintaining their place with established customers. 

Microchip’s moves to ease hardware-software codesign

Microchip’s recent release of their AI coding assistant and unified compiler is this company’s signal that they are set to follow this theme of lowering development barriers. The AI coding assistant enables their established MPLAB platform to function within the eminently popular Visual Studio (VS) framework while the unified compiler license combines the MPLAB C compilers: XC8, XC16, XC-DSC, and XC32. 

In a conversation with Rodger Richey, the VP of development systems and academic programs, EDN was able to see how a developer would use the AI coding assistant within the VS IDE. 

AI coding assistant in VS

There are essentially three main pieces to this tool: 

• A microchip chatbot for product questions such as coding-specific questions
• An autocomplete function that predicts with inline code suggestions
• Direct access to technical data in vectorized datasheets allowing users to search for information such as block diagrams without leaving the coding environment

“We have actually been using this internally within Microchip for the last nine months and, depending upon the user, we’ve seen anywhere between a 20 to 40% productivity enhancement,” said Richey, offering a live demo of the VS tool. 

Creating project and searching datasheet

As shown in Figure 1, he began by asking the assistant about the features of the new PIC32CM JH family of MCUs where the assistant replied with details such as core, memory, and peripheral features as well as part numbers. At this point, the tool downloads the vectorized datasheet so that it is searchable within the AI coding assistant, “I’m going to put the part number in and select the compiler,  now what’s happened in the background is the coding assistant has downloaded the vector datasheet.”

Figure 1 The VS AI coding assistant tool showing the details of the PIC32CM JH family of MCUs. 

Code generation

As shown in Figure 2, Richey begins by asking the assistant to generate code to initialize the UART and ADC, sample once per second, and write to the UART an array of 32. At this point, the tool returns the code and interrupt routines that Richey arbitrarily places within the source code file. 

Figure 2 Code generation to initialize the UART and ADC within the PIC32CM JH MCU.

Checking code for errors

The source code is then copied and pasted into the chatbot to check for errors and a number of issues are found (Figure 3). “I inserted the code in the middle of an existing function and what it does is creates a corrected version of the code,” Richey then places the corrected code into the existing file.

Figure 3 Error is copied and pasted into the chatbot and a request to check for errors is placed whereby the coding assistant returns a number of errors found within the code. 

Autocomplete 

At this point, the autocomplete function is highlighted. First, code is created that adds two numbers together (Figure 4). As Richey accepts autocomplete inline suggestions, the tool begins predicting the next steps in the code: creating a function to average the numbers within the array. Figure 4 shows some of these inline code suggestions. Comments can also be added with relative ease by simply asking the assistant to comment the code where the user’s job is limited to rejecting/accepting the comment suggestions. “We want to keep the developers in the flow of writing code. Anything you do is a distraction, even if you have to leave the development environment or even write comments.”

Figure 4 Autocomplete functions create inline comment/code suggestions that the user can accept or reject.

Exploring the datasheet within the IDE

Richey brings up a block diagram of the analog comparator within the development environment by prompting the tool with “show me the block diagram of the analog comparator,” as shown in Figure 5. “If I want to look at what the registers are for, it’ll show me all of the registers and the bits within them.”

Figure 5 Block diagrams for the analog comparators can be viewed within the IDE with a hyperlink that takes the user to the datasheet. 

 At this point, Richey has the tool write code to initialize the comparator which he can then, once more, place arbitrarily within the source code, and check for errors. “Now I’ve got a project open that’s got a lot of directories, and each one of these directories has a lot of files,” Richey goes on to show the “@Codebase” prompt checking for a function to initialize the SERCOM0 module, a UART-to-serial port that is on the PIC32CM JH (Figure 6). At this point, the tool pulls out the relevant piece of code so that the user can drop it into any other file. “I can do an @file where I can go search for a particular file, @folder to bring up all the folders within the project.”

Figure 6 Checking the codebase for a function to initialize the SERCOM0 module, a UART-to-serial port that is on the PIC32CM JH.

Unified compiler

The MPLAB XC unified compiler licenses just released today are another initiative by the company to simplify the process of working with Microchip’s hardware and software. “Typically, you’ll have a free compiler and an optimizing compiler that you have to pay for. The difference with the optimizing compilers is that they have implemented core- or product-specific optimizations where you’ll typically see ~35% smaller code for a vendor supply compiler relative to, say a GCC [GNU Compiler Collection],” says Richey. The marginal gains can be the factor that pushes engineers into a higher memory, more expensive, device where the cost of a compiler would likely pale in comparison to the per unit savings on a mass-manufactured product. 

“A vendor today will typically supply core specific compilers, so there might be an ARM core, a MIPS core, or a supplier-specific core. As a client this can be difficult to manage. You have to ask yourself how many compilers you need.” And, as the needs for the project change, so do the mix of compilers used potentially creating more overhead for the client since payments for compilers are generally issued on an annual basis. For more stringent industries like industrial and automotive, the clients might stay on a fixed version of a tool for decades, where they must pay for that same version every year.  

“Microchip supports a lot of automotive, medical, industrial, and aerospace and defense clients, and they’re typically fixed on one version, because to upgrade the compiler version forces them to go back through an approval loop and it’s very costly for them, creating a purchasing nightmare.” Microchip is attempting to sidestep these issues with the unified compiler where a single, perpetual license grants access to the MPLAB XC8, XC16, XC-DSC and XC32 C compilers. There is however a voluntary 12-month maintenance fee that is 20% the cost of the compiler. 

Richey finished by highlighting Microchip’s initiatives for easing the development process for embedded engineers using Microchip hardware/software, “Whether it’s IR, Keil, SEGGER, VS, or the Eclipse IDE, we realize that not everyone that’s developing for Microchip is using Microchip tools. So we want to meet the developer and the ecosystem of their choice. We don’t want to force them into our ecosystem.”

 Aalyia Shaukat, associate editor at EDN, has worked in the design publishing industry for six years. She holds a Bachelor’s degree in electrical engineering from Rochester Institute of Technology, and has published works in major EE journals as well as trade publications.

Related Content

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• Elevating embedded systems with I3C
• 8 pillars of embedded software
• Optimizing motor control for energy efficiency

The post Easing the development burden for embedded systems  appeared first on EDN.

The board of directors of Ennostar Inc has approved a restructuring plan that involves the merger of its subsidiaries EPISTAR and Lextar into a single entity tentatively named Ennostar Corp, starting 1 October. The merger aims to accelerate Ennostar’s business expansion in high-value-added optoelectronic applications and to intensify its long-term growth prospects...

As I discussed in early December, my first purchase attempt of a lithium battery-based portable power generator, Energizer’s PowerSource Pro, didn’t pan out. But I didn’t give up. In fact, as I’d alluded to in a writeup published two weeks earlier, I bought two successors, both from the same company, EchoFlow. The smaller RIVER 2 (and no, I don’t know why its marketing-anointed name is all-caps):

is what I’ll be discussing here, with coverage of its more sizeable, flexible DELTA 2 sibling saved for another day (that said, currently scheduled to arrive in your web browser shortly):

With the stock photo out of the way, here’s a shot of my particular unit fresh out of the box and on the workbench, first in overview with its SLA battery-based Phase2 Energy PowerSource 660Wh 1800-Watt Power Station precursor in the background:

And then in closeup, specifically of its front panel display during initial AC-fed charging:

I picked up the RIVER 2 from EcoFlow’s eBay store, supposedly refurbished, for $109.68 after a 20%-off promo coupon, inclusive of sales tax and with free shipping, at the beginning of September. I say “supposedly refurbished” because, in stark contrast to the Energizer PowerSource Pro Battery Generator I’d bought earlier, which was supposedly brand new but arrived in clearly pre-used condition, this one seemingly came fresh and pristine straight from the factory manufacturing line. Why? I suspect it had something to do with the fact that shortly after I bought mine, EcoFlow introduced its gen-3 devices. The RIVER 3’s incremental benefits were modest, as it turned out and at least in my typical use case, such as:

• GaN-based circuitry, resulting in even smaller dimensions than before, along with higher-efficiency (therefore cooler and quieter) operation
• Higher USB-C PD peak output power (100 W vs 60 W), and
• Faster output switching speed from direct to inverter-generated AC, thereby enabling the RIVER 3 to more robustly act as an UPS (<20 ms vs 30 ms)

Although curiously, the RIVER 3’s peak stored charge capacity decreased to 245 Wh versus the RIVER 2’s 256 Wh. My guess is that my good fiscal fortunes were due to a preparatory stealth warehouse-purging move on EcoFlow’s part.

What was my rationale for getting the RIVER 2 in addition to the more sizeable Energizer PowerSource Pro-like DELTA 2? The price tag was certainly an effective temptation. More generally, here’s what I wrote back in December:

[It] is passable for overnight camping trips in the van, for example. Or a day’s worth of drone flying. Or for powering my CPAP machine and oxygen concentrator overnight. And I can use the aforementioned 100-W portable solar panel to also recharge it during the day (albeit not at the same time as the Phase2), in conjunction with an Anderson-to-XT60i connector adapter cable.

That “aforementioned 100-W portable solar panel” is this:

which I’d covered back in September. And in the spirit of “the proof of the pudding is in the eating” (which for today I’m rephrasing as “the proof of the concept is in the pictures”), here are some shots of it hooked up to on my back deck. First, the solar panel itself:

An illuminated light means “working”:

As does this output-voltage reading:

This particular solar panel was originally intended for use with (and still works fine with) the Phase2 Energy PowerSource, whose backside includes an Anderson Powerpole PP15-45 solar charging connector:

To adapt the panel to that generator, as mentioned in more recent coverage, “required both the female-to-female DC5521 that came with the Foursun F-SP100 solar panel and a separate male DC5521-to-Anderson adapter that I bought off Amazon:”

And what about the RIVER 2? Its solar (as well as car, via an included “cigarette lighter”-source adapter cable) charging connector of choice, as mentioned in that same more recent coverage, is an orange-color XT60i:

the higher current-capable, backwards-compatible successor to the original yellow-tint XT60 used in prior-generation EcoFlow models:

So, what did I do to bridge the connection-discrepancy gap? I added yet another cable to the chain, of course:

a third-party Anderson to XT60i adapter I’d found on Amazon:

The resultant setup does indeed passably bump up the RIVER 2 battery charge, assuming there’s adequate available sunshine, although fastest charging results are unsurprisingly achieved with the RIVER 2 tethered to AC as shown earlier. To wit, by the way, my stopwatch happily confirms EcoFlow’s website claim that you can “charge 0-100% in only 60 mins”.

To the “svelte” adjective in this writeup’s title, I’ll offer the following representative specs:

• Dimensions: 9.6 x 8.5 x 5.7 inches
• Weight: approximately 7.7 lbs.

The RIVER 2 standard maximum AC-inverter power output (pure sine wave, not simulated) is 300W, and it also offers a feature branded as X-Boost Mode, which doubles the output AC power (at a reduced voltage tradeoff that not all powered devices are guaranteed to accept, albeit obviously counterbalanced by higher current) to 600W. And speaking of powered devices, what are its AC and DC power output options? I thought you’d never ask:

• Two AC (one two-prong, one three-prong with ground): 120V, 50Hz/60Hz, 300W (along with surge 600W at sub-120V, as just described), pure sine wave, not simulated
• Two USB-A DC: 5V, 2.4A, 12W max
• Cigarette lighter” car DC: 12.6V, 8A, 100W max
• And USB-C (which does double-duty as both an output and another battery-charge input option, along with aforementioned AC and XT60i) DC: 5/9/12/15/20V 3A, 60W max

One other generational comment (adding on to my earlier gen-2 vs -3 comparisons), specifically related to the “lithium iron phosphate fuel” bit in this post’s title. First-generation EcoFlow devices were based on NMC (lithium nickel manganese cobalt) battery technology, which as I mentioned back in late November and again a few weeks later is only capable of a few hundred recharge cycles before its maximum storage capacity degrades to unusable levels in realistic usage scenarios. For gen-2 and beyond, EcoFlow switched to LiFePO4 (lithium iron phosphate), also known as LFP (lithium ferrophosphate), battery formulations. The comparative specs bear out the technology-transition improvements; the first-generation RIVER was guaranteed for only 500 recharge cycles, whereas with the RIVER 2 it’s 3,000. The RIVER 2 product page further elaborates and elucidates on the claimed benefits, which also include a 5 year warranty:

Safe, for up to 10 years of use.

 LiFePO4 Battery Chemistry

 With upgraded long-lasting LFP battery chemistry at its core, charge and empty RIVER 2 Series over 3000 times. That’s pretty much 10 years of everyday use and 6x longer than the industry average. With LFP cells, RIVER 2 Series is safe, durable, and highly efficient, even in warm temperatures.

One final note: the RIVER 2 integrates both Bluetooth and (believe it or not) Wi-Fi connectivity:

You can, for example, both monitor the status of the RIVER 2:

and over-the-air update its embedded firmware:

via a mobile-device intermediary using the company’s Android and iOS app versions.

And with that, I’ll wrap up for today. Let me know your thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Energizer’s PowerSource Pro Battery Generator: Not bad, but you can do better
• Experimenting with a modern solar cell
• The Energizer 200W portable solar panel: A solid offering, save for a connector too fragile
• Multi-solar panel interconnections: Mind the electrons’ directions

The post EcoFlow’s RIVER 2: Svelte portable power with lithium iron phosphate fuel appeared first on EDN.

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and develops and manufactures high-power industrial blue lasers — has announced its entry into a commitment letter aimed at expanding its existing defense business and establishing a new presence in the security sector...

Once primarily used by stage performers, modern in-ear monitors (IEMs) have expanded into the personal audio space over the past decade, transforming how we experience music, games, and digital content through unprecedented levels of sonic detail and spatial accuracy. This interest from audio enthusiasts, gamers, and a growing segment of consumers requires manufacturers to meet higher demands for premium sound.

At the heart of these immersive listening experiences lies a sophisticated engineering approach: multi-driver design. While traditional earphones rely on a single driver to reproduce all sounds, today’s premium IEMs employ arrays of specialized drivers, each precisely tuned to handle specific frequencies.

Leading manufacturers are pushing these boundaries further—from FiiO’s FA19 with its intricate 10-driver architecture to Earsonics’ EM96 featuring a refined three-way crossover system. As consumer demand for premium audio experiences grows, the multi-driver IEM market has evolved from its roots in the professional stage to become a pillar of high-fidelity personal audio.

This evolution brings both opportunities and challenges, requiring manufacturers to master complex acoustic engineering while delivering comfortable, practical designs for daily use. Success in this competitive landscape demands more than just adding drivers—it requires a deep understanding of how to harmoniously integrate these components to create superior listening experiences, requiring a deep understanding of acoustics, crossover integration, and component synergy.

To succeed in this evolving market, brands must navigate technical complexities in multi-driver design—ensuring seamless integration, optimizing crossovers, and balancing comfort with performance—without compromising on sound quality.

Why multi-driver designs?

Unlike single-driver IEMs, which are tasked with reproducing the entire frequency range within one transducer, multi-driver designs distribute the workload across specialized drivers. This approach mirrors full-sized speaker systems, where woofers, midrange drivers, and tweeters work together to create an immersive soundstage.

By assigning dedicated drivers to specific frequency ranges—such as bass, midrange, and treble—manufacturers can achieve exceptional clarity and depth. This targeted separation ensures each frequency range is handled by specialized drivers, reducing distortion and delivering a cohesive, high-fidelity listening experience.

A key component of modern multi-driver IEMs is the balanced armature (BA) driver. Originally developed for hearing aids, BAs have since become a cornerstone of in-ear audio due to their compact size and precision tuning capabilities. BAs use stationary coil and pivoting armature, which enables them to reproduce detailed frequencies with remarkable efficiency.

Figure 1 BAs are becoming critical for in-ear audio designs. Source: Knowles

Because of their small form factor and specialization, BAs are ideal for multi-way driver configurations, where multiple units work together to optimize frequency response, enhance clarity, and improve overall sound separation.

In fact, multiple BAs are the industry standard, though some manufacturers introduce alternative technologies—such as planar drivers, dynamic drivers, or even microphones—for novelty. Highly versatile and available in several variations for specialized applications, BAs can function in multiples or in tandem with other technologies, as often seen in hybrid-driver true wireless stereo (TWS) earphones.

Addressing design challenges

Integrating multiple drivers into an IEM presents both opportunities and engineering challenges. While multi-driver designs enable more refined tuning and enhanced performance, they require precise crossover implementation, seamless driver integration, and compact form factor solutions to deliver the best user experience. Manufacturers must balance sound quality, consistency, and ergonomic constraints while also delivering a competitive and signature sound experience.

1. Crossover design

Multi-driver IEMs rely on crossover circuits to distribute frequencies across different drivers. Poorly executed crossovers can cause phase issues (cancellation of energy rather than addition and vice versa), frequency dips, and distortion, particularly in the midrange, where driver overlaps are most sensitive.

By strategically distributing the audio signal across multiple drivers, each driver operates within its optimal range, reducing the likelihood of distortion. This ensures that no single driver is overburdened, leading to cleaner, more accurate sound reproduction with better clarity and separation compared to single-driver IEMs.

For additional ease of integration, choosing multi-way drivers with pre-configured crossover implementations can reduce the complexity of designing systems from scratch and ensure clean performance upfront.

Figure 2 BAs allow finer control over the interaction between drivers. Source: Knowles

BAs are helpful for crossover design, as they enable finer impedance control, ensuring seamless transitions between drivers. Due to their stationary coil design, which can be wound with different impedances, BAs enable finer control over the interaction between drivers. Specialty BAs with closed-back designs can further reduce acoustic irregularities, producing more natural sound even in complex setups.

2. Signature sounds

Modern IEM manufacturers distinguish themselves through unique sound signatures that define their brand identity. The precision and flexibility of multi-driver configurations enable manufacturers to create these distinctive audio profiles with unprecedented control. BAs play a pivotal role in signature sound development.

Specialty BAs engineered for specific acoustic tasks—such as extended treble or enhanced midrange—allow manufacturers to tailor sound signatures precisely. Each BA configuration can be customized to achieve different target sound signatures in a multi-driver layout, making it easier for manufacturers to create distinctive audio profiles without extensive R&D time.

Figure 3 BAs can be engineered for specific acoustic tasks. Source: Knowles

Multi-way drivers can deliver pre-tuned frequency ranges, alleviating the work of internal teams and enabling faster progression in product development. Selecting multi-way BA models with dedicated drivers optimized for bass, midrange, and treble reduces the need for extensive manual tuning. Properly tuned BAs ensure each driver operates within its ideal range, avoiding common issues like frequency dips or distortion in the midrange.

The multi-driver designs also offer manufacturers greater flexibility in tuning their unique signature sound. By integrating newer technologies and adjusting the crossover points of different driver types, engineers can define specific characteristics—such as enhanced bass, detailed midrange, or sparkling highs—to make their output one-of-a-kind.

3. Form-factor flexibility

Despite advancements in miniaturization, integrating multiple drivers into a compact, ergonomic earpiece remains a challenge. Comfort and versatility are essential for an optimal user experience, and sound quality must be balanced with design and functionality.

The compact size of BAs offers greater flexibility in placement within an earpiece, freeing up valuable space for designing with multiple drivers. This enables the incorporation of specialty BAs—engineered for high impact in exceptionally small sizes—maximizing room for additional drivers and advanced crossover designs.

Unlike other driver types, which require larger enclosures for optimal functionality, BA drivers are significantly smaller. They also have adjustable port placements. This allows multiple units to be arranged within the same IEM shell.

Pre-configured multi-way BA configurations help manufacturers create ergonomic, form-fitting IEMs without needing large nozzles or vents. These factors allow for a more minimalist design, making it easier to achieve a comfortable form factor.

4            Scalability across multiple markets

As demand for high-performance in-ear monitors continues to grow across various listener segments, manufacturers must develop scalable solutions that cater to a wide range of users. Achieving this requires flexible driver configurations that maintain high sound quality standards while accommodating different price points.

One of the most effective ways to achieve this scalability is through multi-way driver configurations and hybrid technology. By combining drivers, manufacturers can fine-tune crossover points to create sound profiles suited for different applications. This versatility allows brands to produce IEMs that offer precise, high-fidelity audio at multiple tiers—whether for entry-level consumer models or high-end audiophile monitors.

Reliability and consistency in production also play a crucial role in meeting market demand. Automated manufacturing processes ensure tight tolerances, reducing batch-to-batch inconsistencies in multi-driver designs. Additionally, the availability of pre-configured multi-way BA systems simplifies product development, allowing manufacturers to expand their product lines efficiently without extensive redesigns.

By leveraging these scalable design strategies, companies can provide high-quality IEMs across various market segments, ensuring a balance between performance, affordability, and accessibility without compromising sound integrity.

IEMs shaping personal premium sound

Multi-driver designs have redefined what’s possible in IEM performance, enabling richer, more detailed soundscapes than ever before. Through advancements in BA technology and thoughtful integration of multiple drivers, manufacturers are overcoming traditional limitations to meet the rising demand for premium audio experiences.

For research and development teams in the personal audio space, mastering the complexities of multi-driver design is crucial for maintaining competitiveness in today’s rapidly evolving market. If done well, new IEM designs could shape the future of personal premium sound.

Cristina Downey is senior electroacoustic engineer for R&D at Knowles Corp.

Related Content

• Audio design and technology
• TWS reference design features hybrid dual speaker
• Hear This: ‘Ear-Worn Computing’ Around the Corner
• Exploring Trends and Opportunities for True Wireless Audio
• Understanding superior professional audio design: A block-by-block approach

The post Designing better listening experiences with multi-driver IEMs appeared first on EDN.

The showcase also includes a new 240kW DC fast EV charger designed to foster e- mobility for India’s sustainable cities

Delta, a global leader in power management and a provider of IoT-based smart green solutions, announced today its participation in ELECRAMA 2025 under the theme of Smart Manufacturing by launching its new D- Bot series Collaborative Robots (Cobots) in the Indian market. These 6-axis cobots boast payload capacities up to 30 kg, and speeds as fast as 200 degrees per second, thus, designed to empower industries with smarter, more efficient production processes, such as electronics assembly, packaging, materials handling, and even welding. At the event, Delta will also unveil its new 240kW DC Fast EV Charger and the Industrial Power-protect Transformer-based UPS – further strengthening its commitment to energy conservation and the development of sustainable cities across India.

Jimmy Yiin, Delta’s Executive Vice President of Global Business Operations, said, “India is a key market for Delta, and we are committed to driving its industrial and energy transformation with our advanced solutions. Delta’s strategic investment in the Krishnagiri facility underscores our dedication to local innovation, manufacturing excellence, and sustainability. Through this investment, we aim to strengthen India’s self-reliance in smart manufacturing and energy infrastructure while contributing to global industry standards.”

Benjamin Lin, President of Delta Electronics India, stated, “Delta is proud to showcase our innovative smart manufacturing solutions at Elecrama 2025. Our focus has always been on delivering solutions that advance industries to become more efficient, sustainable, and resilient. The new solutions we are introducing – from the D-Bot Cobots to the Ultron IPT Series UPS – are designed with these values in mind, and we are committed to driving the transition to smart and sustainable manufacturing across India and beyond.”

Across the Delta booth, visitors will engage on a journey with a live demonstration of intelligent infrastructure across Industrial Automation, EV Charging, Smart Building Automation Solutions, Data Centers, Smart Energy Infrastructure, ICT Infrastructure, and many more innovative solutions.

Newly-Launched Smart Green Solutions by Delta at ELECRAMA 2025 are:

• D-Bot Series Collaborative Robots (Cobots) are an integral part of Delta’s broad portfolio of Smart Manufacturing Designed for smart factory automation and equipped with advanced safety mechanisms, these cobots detect contact and instantly reverse movement to prevent accidents, ensuring safe human-robot collaboration. With payload capacities ranging from 6 kg to 30 kg, 6-axis flexibility, speeds up to 200 degrees per second D-bot provides precision, efficiency, and rapid deployment across industries in a broad range of applications that require smart manufacturing capabilities, including packaging, pick and place, electronics assembly, materials handling, welding, machine tending, and more. Moreover, these D-Bot series cobots integrate seamlessly with Delta’s VTScada SCADA system, DIATwin digital twin platform, machine vision systems, and more, to help customers upgrade the productivity, reliability, and efficiency of their factories.
• 240kW DC Fast EV Charger – A high-speed dual-vehicle charging solution developed locally by Delta India’s own R&D and engineering These advanced EV charger boasts 95% efficiency, OCPP compatibility, and wired/4G GSM connectivity, ensuring fast, seamless EV charging for commercial applications, fleet operators, and public charging networks.
• Industrial Power-protect Transformer-based UPS (IPT series)- It redefines power reliability with Zig-zag transformer, advanced PFC converter, and exceptional short-circuit protection. With IP43 optional enclosure protection, it ensures robust performance and optimizes frontend investment for harsh industrial environments.

Delta is also showcasing a wide range of cutting-edge solutions across its key business verticals:

Industrial Automation Solutions

Delta is also showcasing articulated and SCARA robots at ELECRAMA 2025, delivering high- speed pick-and-place capabilities and smart screwdriving solutions for mobile phone manufacturing. Additionally, Delta is featuring its Next-Gen CNC Controllers for precise motion control, PMa Synchronous Reluctance Motor MSI for energy savings, Active Power Filter APF3000 for clean power with THDi below 5%, and the Fan, Pump, and Compressor Solution with Fluid Industry Drive VP3000, integrating IE4/IE5 MSI motors for enhanced performance. Delta also offers VTScada SCADA software for Industry 4.0 by optimizing smart manufacturing and energy management through real-time monitoring, control, and predictive maintenance.

EV Charging Solutions

Delta continues to drive India’s EV charging ecosystem and showcasing, high efficiency charging solutions, designed for residential, commercial, and fleet applications. The AC Cordset 3.3kW offers a compact home charging solution, while the AC Miniplus 7.4kW provides smart connectivity-enabled AC charging. The 240kW DC Fast Charger allows simultaneous charging of two EVs with 95% efficiency and OCPP compatibility, making it ideal for commercial applications, parking lots, service stations, and bus depots. As a total solutions provider, Delta commonly integrates power conditioning systems (PCS), battery energy storage systems (BESS), solar PV inverters, and EV chargers, enabling renewable energy- powered EV charging infrastructure for smart cities.

Data Center, Telecom & Mission-Critical Infrastructure Solutions

Delta is transforming data center infrastructure with high-efficiency solutions such as the 33kW 1OU ORv3 Power Shelves, which achieve 97.5% efficiency to ensure stable power for AI servers. The InfraSuite Data Center Infrastructure Solutions helps data centres achieve PUEs below 1.2, reducing energy losses, especially with Delta’s with new liquid cooling solutions. Delta’s 18kW High-Power Rack-Mounted Systems support network communication and AI servers with 97.5% energy conversion efficiency, while the DC Power Converter achieves 98.3% efficiency, meeting the high-power demands of AI GPUs. Delta also has DC first solution with UPS, Busway, Cooling, and containerized data centre solutions for reliable, efficient infrastructure support.

Delta’s telecom power solutions include Power Distribution Units (PDU), HE Rectifiers, and Outdoor Cooling Cabinets, ensuring network efficiency and reliability. Additionally, Delta’s Mission-Critical Infrastructure Solutions (MCIS) portfolio features the Active Harmonic Filter (AHF), iCool Row, Li-Ion Battery Solutions, and IPT for next-gen power transmission.

EV Powertrain Solutions

Delta is also advancing EV Powertrain Solutions with compact, high-efficiency power solutions for electric two- and three-wheelers. These include On-Board Chargers (OBCM), DC/DC Converters, OBG, and EVCC products, which support bi-directional charging and V2X integration to enhance EV functionality.

Smart Building Automation Solutions

Delta revolutionizes buildings through integrated smart solutions, combining energy-efficient HVAC control, smart lighting, and AI-powered video surveillance. Our comprehensive building portfolio includes industry-leading brands such as LOYTEC, Delta Controls, VIVOTEK, March Networks and Amerlux, delivering advanced technologies that optimize both energy use and operational performance.

Commitment to Sustainability

Delta remains dedicated to sustainability through high-efficiency energy solutions. Between 2010 and 2023, Delta’s products and solutions deployed worldwide saved customers an estimated 45.5 billion kWh of electricity, equivalent to reducing carbon emissions by nearly 23.84 million tons. Additionally, from 2006 to 2024, Delta has built 35 green buildings and 2 certified green data centers worldwide, reinforcing its commitment to energy conservation and sustainability.

Visit Delta at ELECRAMA 2025

Experience live demonstrations and interact with Delta’s latest innovations at Booth #A3B4, Hall 16. Discover how Delta is driving smart manufacturing with its advanced robotics, automation, and energy solutions.

The post Delta Launches its New Collaborative Robots for the Indian Smart Manufacturing Market at ELECRAMA 2025 appeared first on ELE Times.