Microelectronics world news

I've bought these female type C breakouts a while ago to convert some of my stuff to type C from type A or Micro USB. However they've only ever worked with a-to-c cables, native type C chargers never recognized them. There is a pair of pads for a resistor to indicate expected currents to the charger but it never made a difference. And then I've found the problem: the CC lines are connected together. In order to be compliant these lines should be pulled down (or up, if it is a power source) separately. (source) By modifying the PCB I could isolate the two CC lines, and created a ground track right in front of the CC pins. The second picture shows the action plan: cut along the red lines, scrape the circled areas to expose some copper, and short the original R1 pads. The third picture shows the resulting circuit (Red is VCC, light blue is GND, yellow are data lines, and green are CC lines) After this I could solder some 0603 5.1k resistors directly to the CC pins and the newly exposed copper lines to pull them down individually as seen on the first photo. You need some patience and stable hands, but in the end you can make these work with anything! submitted by /u/rOzzy87 [link] [comments]

Premier microwave, RF, wireless and radar players gather in the city of light for the European Microwave Week (EuMW). Industry-leading T&M specialist Rohde & Schwarz will present a radiating portfolio of products and solutions in Paris for various application fields, pushing the limits in the Gigahertz to Terahertz frequency ranges.

Rohde & Schwarz will showcase its latest RF and microwave portfolio and solutions following the motto “From Gigahertz to Terahertz” at this year’s European Microwave Week in Paris. At the exhibition, taking place from September 24 to 26, 2024 in the Paris Expo Porte de Versailles venue, visitors can learn at booth 401L about the company’s top-notch applications to solve pressing test challenges RF engineers are facing right now in component design and next generation wireless, as well as in the automotive and aerospace and defense industries. Highlights will include EVM measurements and wideband modulated load pull analysis for RF frontends. A system for 6G wireless data transmission based on photonics will address state-of-the-art research for next generation wireless technologies. And disruptive innovations in automotive radar production and testing as well as industry leading-solutions for 5G NTN satellite testing will round out the company’s display at the EuMW 2024.

Wide spectrum of RF and microwave component testing

Active components such as power amplifiers are integral for any RF frontend design. With increasing data rates, complex modulation schemes are becoming critical in wireless connectivity applications. A low error vector magnitude (EVM) at both the component and system levels is key to ensuring that these modulation schemes are robust and stable. Given the unprecedented performance levels of these power amplifiers, EVM measurements are a challenging task in RF frontend design. Rohde & Schwarz will present at the EuMW its updated R&S SMW200A vector signal generator which comes with enhanced performance and unparalleled flexibility to meet the most demanding EVM requirements ideal for power amplifier verification. Equipped with the new linearize RF path software option, the signal generator enables better EVM/ACLR at high output power with digital pre-distortion-based optimization. The high-end instrument perfectly matches the industry-leading R&S FSW signal and spectrum analyzer. At the EuMW, however, the setup features the powerful R&S FSVA3000 on the analysis side, including its unique IQ noise cancellation software-based feature to achieve outstanding EVM measurement performance thanks to a noise corrected measurement path.

Besides EVM, power amplifier efficiency is key in RF frontend design. The RF frontend drives signals into an antenna for wireless transmissions in its intended application. These antennas are designed to have a nominal impedance of 50 Ohms. However, due to their wide frequency coverage, the actual impedance can often deviate significantly from 50 Ohms. The impedance encountered by the RF frontend greatly influences its performance, while the influence on its performance and efficiency is unpredictable. Therefore, it’s crucial to verify the performance across a range of impedance variations. To ensure the power amplifier’s target specifications like minimized power consumption or optimized modulation performance, wideband modulated load pull analysis is a vital method for characterizing nonlinear devices. At the EuMW, Rohde & Schwarz will demonstrate a new setup for wideband modulated load pull, featuring the R&S SMW200A vector signal generator in combination with the R&S RTP164 oscilloscope. With this setup, RF engineers can verify the system level performance of the RF frontend with different impedances and verify KPIs such as gain, EVM and ACLR across varying impedance conditions.

For high-throughput RF component verification, Rohde & Schwarz demonstrates for the first time the PVT360A performance vector tester equipped with a new high-power option. The single-box tester combines two independent vector signal generators and vector signal analyzers in one instrument and provides outstanding measurement speed, making it ideal for characterization and production environments. The new option will provide up to 20 dBm RMS output power, making it well-equipped for any applications where high input power to the DUT is required or where high losses can be expected. It now covers a frequency range up to 8.5 GHz for additional potential frequency bands for the lower parts of 5G NR FR3 (7.125 GHz to 24.25 GHz). At the EuMW, visitors can get a first glimpse of the upgraded instrument version, which will be available soon.

Also measuring jitter for clocks in high-speed digital designs is addressed at the Rohde & Schwarz booth. With increasing data rates, the limits for overall system jitter become ever tighter, especially for the various components of the clock tree. Phase noise analyzers are the instruments of choice for verifying the jitter performance of clocks. With the R&S FSWP, Rohde & Schwarz will demonstrate at the EuMW the best phase noise analyzer on the market, featuring highest sensitivity. It is ideal for super low phase noise and jitter measurements even at frequencies above 50 GHz as needed for common electrical interface OIF CEI-224G (56 GHz) or ultra-fast LAN IEEE 802.3dj (53 GHz). At EuMW, it is shown analyzing beyond 50 GHz with cross correlation, achieving most accurate results that reflect the true DUT performance.

Another  demo will cover intermodulation (IM) measurements for 6G D band components. When characterizing components for tomorrow’s 6G communications systems, developers have to test the intermodulation of the active device in addition to the S-parameters. The R&S ZNA67 vector network analyzer in combination with the R&S ZCDS170 dual source converters allows a simplified measurement setup that directly provides a two-tone output signal for IM testing up to 170 GHz.

Next generation wireless technologies

The door to the 6G era has been opened and it will enable new application scenarios in industry, medical technology and everyday life. This will bring about new requirements for latency and data transmission rates. While sub-THz frequencies up to 300 GHz for communication within 6G networks will potentially be introduced at a later stage, this frequency band will be indispensable to realize the full potential of the metaverse and extended reality (XR) applications. On the path to 6G, it is important to create THz transmission sources that offer high signal quality and cover as wide a frequency range as possible. In the future, this might be achieved by integrating optical technologies with electronics. Such THz components could be used beyond communications and data transmission, finding applications in sensing and imaging. At the EuMW, Rohde & Schwarz will present its proof-of-concept for an ultra-stable tunable THz system for 6G wireless data transmission based on photonics. Developed within the 6G-ADLANTIK project funded by the Federal Ministry of Education and Research of Germany (BMBF), it enables the photonic generation of THz signals based on frequency comb technology. In this approach, a photodiode efficiently converts an optical beat signal derived from lasers at slightly different optical frequencies into an electrical signal via a photomixing process. The antenna structure surrounding the photomixer translates the oscillating photocurrent into a THz wave. The resulting signals can be modulated and demodulated for 6G wireless communications and can be tuned easily over a wide frequency range. The presented system also can be extended for component characterization with coherently received THz signals. A THz waveguide architecture simulation and design as well as the development of ultra-low phase noise photonic reference oscillators are also part of the scope-of-work for this project.

Another highlight at the Rohde & Schwarz booth will be a setup for wideband signal generation and analysis in the H band, featuring the new R&S SFI100A wideband IF vector signal generator combined with the new R&S FC330ST/SR frequency converters. The signal generator generates signals with up to 10 GHz RF modulation bandwidth, the frequency converters are designed to up- and down-convert the intermediate frequency (IF) signals to and from the RF frequency range of 220 to 330 GHz, known as H band. Their high-performance balanced mixer with low conversion loss ensures precise measurements. An additional integrated IF amplifier helps to achieve exceptional sensitivity and signal performance. The solution supports an IF range of up to 35 GHz, allowing for ultra-wide bandwidth signals to be transmitted and received. The R&S RTP oscilloscope is used in the demo setup to receive the down-converted IF signals. Equipped with the versatile R&S VSE signal analysis software the baseband signals can be analyzed directly on the instrument. The H band is gaining importance for various applications not just for 6G research but also in radar technology or advanced imaging for security and healthcare.

Next level automotive radar production testing

Next-generation radar, pivotal for the evolution of ADAS and autonomous driving, requires test solutions that deliver unrivalled accuracy, efficiency and reliability. To drive this development further, Rohde & Schwarz will bring two radical innovations in automotive radar production testing to the EuMW, offering the industry a hitherto unseen price-performance point. The R&S RadEsT (Radar Essential Tester) automotive radar target simulator emerges as an ultra-compact, versatile tool designed to meet a wide array of vehicle manufacturer testing needs, from lab-based functional testing to vehicle-level production checks. With its impressive array of features and exceptional value, it opens up new possibilities for precise, reliable, and dynamic radar testing. The Radar Essential Tester addresses a wide spectrum of use cases, from system checks and debugging of radar module reference designs to software verification and functional tests on the radar module. It is an ideal fit for OEM end-of-line testing, that provides advanced testing capabilities for radar alignment and calibration as well as functional check during production beyond the limited functionality of passive reflective elements that have historically been used. Furthermore, the R&S RadEsT has the capability to test advanced driver-assistance systems (ADAS) and autonomous driving (AD) functions.

In addition, Rohde & Schwarz also introduces new “mini”, “golden”, “pro” and “golden-pro” versions of its automotive world’s leading radar echo generator R&S AREG800A. The resulting new R&S AREG-P target generator helps Tier1 automotive radar manufacturers to increase throughput, reduce costs and reduce end-of-line test time. EuMW visitors can learn how the solution creates the perfect environment for the radar sensor’s seamless transition from R&D to production, optimizing OPEX, CAPEX and time to market.

Cutting-edge solutions for aerospace and defense

To ensure that communications systems based on 5G non-terrestrial networks (NTN) and LEO constellations work reliably and efficiently, testing is crucial. To this end, Rohde & Schwarz will present dynamic fading test scenarios for LEO satellites and terminals that mimic realistic LEO and MEO satellite trajectories at the EuMW. With a new software update, the R&S SMW200A vector signal generator now allows for Doppler shifts of up to 1.9 MHz, enhancing the simulation of high-speed satellite movement. A new user-friendly software makes creating and uploading fading profiles easy. In combination with the instrument’s frequency range up to 67 GHz, it opens up new possibilities to develop extremely-high-frequency satellite communications. The same setup also demonstrates testing of Ka-band power amplifiers in development and verification. For this application, generating multi-carrier CW signals up to 2 GHz bandwidth is vital in order to obtain repeatable test results. Additionally, generating realistic test signals such as DVB-S2/S2X/RCS2 and custom OFDM allow the analysis of the power amplifier under real-world satellite scenarios. The R&S FSW signal and spectrum analyzer equipped with an amplifier measurement application is ideal for analyzing the characteristics of these devices, providing insights into various parameters such as Error Vector Magnitude (EVM), AM/AM and AM/PM distortion, group delay, and Adjacent Channel Leakage Ratio (ACLR), which are critical for assessing the performance and reliability of communication equipment.

mmWave imaging technology with ISAR processing

Rohde & Schwarz continues to evolve its millimeter wave imaging technology for different use cases. At the EuMW, the company will exhibit its imaging capabilities that leverages hundreds of receive and transmit antennas to quickly characterize materials in a new context. The solution is ideal for detecting quality issues of packaged goods such as leakage, missing or incorrect items as well as unwanted particles within the package through real-time analysis. This in-line quality inspection method works with non-ionizing radiation and provides users with another form of non-destructive testing, complementing current methods such as cameras, X-rays or scales in logistics, food or pharmaceutical environments. The new R&S IMAGER presented in Paris uses live inverse synthetic aperture radar (ISAR) processing, which reveals details and defects that cannot easily be detected with alternative testing methods.

Service and calibration in great hands

Leading-edge technology belongs in expert hands. The Rohde & Schwarz support network spans multiple time zones and reaches all corners of the world. At the EuMW, Rohde & Schwarz will also spotlight its comprehensive service portfolio. Visitors can learn about accredited calibration services, repair services directly from Rohde & Schwarz, training courses and industry insights from the R&S Technology Academy, and the 24/7 hotline service as well as on-site support.

Rohde & Schwarz will be exhibiting at booth 401L in Paris Expo Porte de Versailles from September 24 to 26, 2024. In addition, experts from the company will contribute with presentations and workshops to the program of the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), as well as the Defense, Security and Space Forum. Information on the company’s demonstrations, including the possibility to register for free exhibition tickets, is also available at: https://www.rohde-schwarz.com/eumw

The post Rohde & Schwarz presents its top-notch RF and microwave test solutions at the EuMW 2024 in Paris appeared first on ELE Times.

For its fiscal full year (to end-June), Wolfspeed Inc of Durham, NC, USA – which makes silicon carbide materials as well as silicon carbide (SiC) and gallium nitride (GaN) power-switching & RF semiconductor devices – has reported annual revenue growth of 6.4%, from $758.5m in fiscal 2023 to $807.2m for fiscal 2024. Specifically, Materials Products revenue rose by 12.1% from $349.3m to $391.6m, and Power Products revenue by 1.6% from $409.2m to $415.6m...

u-blox CloudTrack combines reliable positioning with data communication, cloud intelligence, and best-in-class energy savings into an all-in-one service.

u-blox, a global provider of leading positioning and wireless communication technologies and services, has announced CloudTrack, a unique end-to-end asset tracking service that breaks new ground for the Internet of Things (IoT) landscape. The all-in-one service provides the ultimate in ultra-low-power positioning, global connectivity and cloud integration. CloudTrack simplifies IoT asset tracking with contractless per-location-request plans accessible worldwide, offering businesses a predictable pay-as-you-go pricing model without hidden costs or worries about data usage.

The most significant advantage of CloudTrack is its exceptional 6X energy savings, compared to a standalone GNSS fix with a cold start and transmitting data securely over the internet. The service leverages the best of u-blox expertise and technology to intelligently calculate the position using a combination of available data from GNSS, cellular, and Wi-Fi sources. Businesses can locate assets in poor or non-existing GNSS signal conditions or even indoors, where it would otherwise be challenging to get a location fix and would quickly drain battery.

u-blox CloudTrack enables customers to eliminate the complexity and inconvenience of dealing with multiple location data and connectivity providers. This single-provider solution with a straightforward per-location-request pricing model streamlines the asset-tracking process for businesses. Moreover, with a single Thingstream SIM card that operates everywhere, IoT devices can span the globe using one stock-keeping unit (SKU), eliminating the need for regional SKUs. The Thingstream cloud platform makes it easy for businesses to transform and integrate their data with tracking dashboards, major cloud platforms, and enterprise backend systems.

CloudTrack works optimally with u-blox cellular ”combo” modules, including the LENA-R8 LTE Cat 1bis module with integrated M10 GNSS receiver, to deliver an all-in-one ultra-low-power global IoT asset tracking solution that is unmatched in the industry. This synergy of hardware, location and data communication services, cloud intelligence, and best-in-class energy savings exemplifies u-blox’s mission to ”reliably locate and connect every thing”.

The post u-blox leads the way in IoT with new ultra-low-power asset tracking service appeared first on ELE Times.

Collaboration looks to develop future-ready talent pool to support chip industry growth

Applied Materials India Private Limited has signed a Memorandum of Understanding (MOU) with the Tamil Nadu Government whereby Applied intends to establish an advanced AI-enabled technology development Center of Excellence focused on semiconductor manufacturing and equipment at Chennai. This Center will aim to work with local universities and industry partners to strengthen the semiconductor ecosystem in Tamil Nadu and help develop a future-ready talent pool to support chip industry growth. As part of this effort, Applied Materials plans to grow its workforce in the state to more than 500 technical jobs over the next few years.

The MOU was signed in San Francisco in the presence of Hon’ble Chief Minister of Tamil Nadu, Mr. M.K. Stalin and Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, Inc..

Hon’ble Chief Minister Mr. M K Stalin said, “Investment in key sectors such as advanced electronics and semiconductors will help us achieve the $1 trillion economy goal by 2030. We want to make Tamil Nadu the most advanced knowledge and innovation hub in South Asia.”

Speaking on the MOU, Minister for Industries Dr. T R B Rajaa said, “Tamil Nadu aims to grow the semiconductor ecosystem by fostering industry partnerships, cultivating a research-oriented culture, and developing a skilled workforce. I believe this collaboration with Applied Materials will help us create the right talent and play a strong role in Tamil Nadu’s journey to becoming a leading hub for semiconductor manufacturing.”

Commenting on the MOU signing, Dr. Prabu Raja, President, Semiconductor Products Group, Applied Materials, Inc. said, “Tamil Nadu is one of India’s most industrialized states with a thriving manufacturing sector and an impressive scientific talent pool. Applied Materials looks forward to growing our presence in Chennai and working with the government to bring AI capabilities and advanced analytics to the local semiconductor manufacturing and equipment ecosystem.

The planned Center will further strengthen Applied Materials’ existing collaborations with academic institutions in Tamil Nadu, which aim to advance research in AI, machine learning and data science for the semiconductor equipment sector.

The post Applied Materials Teams with Tamil Nadu Government to Establish Center of Excellence in AI and Data Science for Semiconductor Manufacturing and Equipment appeared first on ELE Times.

SPE campaign opens curtain on new dawn of Ethernet connectivity

element14 has assembled an elite group of industry leading suppliers to support a campaign to highlight the multiple advantages of Single Pair Ethernet (SPE) solutions.

The campaign, adopted by Amphenol, ADI, Harting, Microchip, Molex, Phoenix, Weidmuller and Wurth Electronik, is designed to inspire IIoT developers and industrial designers to switch to SPE products and protocols, to not only foster innovation but to also make their professional lives easier, more productive and produce more reliable results.

Ben Morgan, Product Segment Leader for SPE Connectors at element14 said, “We firmly believe that the future of industrial network connectivity lies with Single Pair Ethernet. IoT design engineers fully understand the current struggle of balancing space limitations with increasing data demands, however SPE is a compact, efficient technology that delivers full Ethernet performance with a single, twisted-pair cable.”

Among the many benefits of SPE is that it vastly reduces the need to allow for bulky and intricate bundles that waste valuable installation real estate space. Using SPE products for such installations streamlines a network and reduces costs, enabling professional developers to focus on maximising the power of connected devices to their fullest potential.

SPE does this by simplifying the IIoT and industrial automation design process by providing a single, high-speed connection that’s perfect for Edge devices, especially those that are often destined for tight, compromised spaces. SPE has proven to be sleek, elegant and reliable solutions that ensure devices are always connected, and always performing at their best.

Morgan added, “We are delighted to be joined by so many of key supplier in this initiative, which we think heralds a new dawn in what is achievable in network connectivity, which comes at a crucial moment to meet the demands of an increasingly interconnected world.”

SPE products from Amphenol, ADI, Harting, Microchip, Molex, Phoenix, Weidmuller and Wurth Electronik will be available from Farnell in EMEA, Newark in North America and element14 in APAC.

The post element14 gives wings to Edge devices with new Single Pair Ethernet offerings appeared first on ELE Times.

submitted by /u/thedefibulator
[link] [comments]

Space-constrained edge processors may soon get a boost from Intel’s new SoC.

My longstanding streak of not being infected by COVID-19 (knowingly, at least…there’s always the asymptomatic possibility) came to an end earlier this year, alas, doubly-unfortunately timed to coincide with the July 4th holiday weekend:

I’m guessing I caught one of the latest FLiRT variants, which are reportedly adept at evading vaccines (I’m fully boosted through the fall 2023 sequence). Thankfully, my discomfort was modest, at its worst lasting only a few days, and I was testing negative again within a week:

although several weeks later I still sometimes feel like I’ve got razor blades stuck in my throat.

One upside, for lack of a better word, to my health setback is that it finally prompted me to put into motion a longstanding plan to do a few pandemic-themed teardowns. Today’s victim, for example, is a pulse oximeter which I’d actually bought from an eBay seller (listed as a “FDA Finger tip Pulse Oximeter Blood Oxygen meter O2 SpO2 Heart Rate Monitor US”) a year prior to COVID-19’s surge, in late April 2019, for $11.49 as a sleep apnea monitoring aid. A year later, on the other hand…well, I’ll just quote from a writeup published by Yale Medicine in May 2020:

According to Consumer Reports, prices for pulse oximeters range from $25 to $100, if you can find one, as shortages have been reported.

This unit, a Volmate VOL60A, recently began acting wonky, sometimes not delivering definitive results at all and other times displaying data that I knew undershot reality. So, since prices have retracted to normalcy ($5 with free shipping, in this particular case, believe it or not), I’ve replaced it. Therein today’s dissection, which I’ll as-usual kick off with a series of box shots:

Let’s dive inside. The plastic tray houses our patient alongside a nifty protective case:

Underneath the tray is some literature:

The user manual is surprisingly (at least to me) quite info-thorough and informative, but I can’t find it online (the manufacturer seems to no longer be in business, judging from the “dead” website), so I’ve scanned and converted it to PDF. You can access it here. 

And there’s one more sliver of paper under the case (which also contains a lanyard):

Here’s the guest of honor, as usual alongside a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes (the VOL60A has dimensions of 62 x 35 x 31 mm and weighs 60 g including batteries):

Before cracking the unit open, and speaking of batteries, I thought I’d pop a couple of AAAs in it so you can see it in action. Here’s the sequence-of-two powerup display cadence, initiated by a press of the grey button at the bottom:

Unless a finger is preinserted in the pulse oximeter prior to powerup, the display (and broader device) will go back to sleep after a couple of seconds. Conversely, with a finger already in place:

As you can see, it measures both oxygen saturation (SpO2), displayed at the top, and pulse rate below. Good news: my actual oxygen saturation is not as low as the displayed 75%, which had it been true would have me in the hospital if not (shortly thereafter) the morgue. Bad news: my actual resting pulse rate is not as low as 28 bpm, which if true would mean I was very fit (not to mention at lower elevation than my usual 7,500’ residence location)…or conversely, I suppose, might also have me in the hospital if not (shortly thereafter) the morgue. Like I said, this unit is now acting wonky, sometimes (like this time) displaying data that I know undershoots reality.

Let’s next flip it over on its back:

The removable battery “door” is obvious. But what I want to focus in on are the labels, particularly the diminutive bright yellow one:

Here’s what it says:

AVOID EXPOSURE

LASER RADIATION IS EMITTED FROM THIS APERTURE

LED Wavelengths

	Wavelength	Radiant Power
Red	660 ± 2nm	1.5 mW
IR	940 ± 10nm	2.0 mW

I showcase this label because it conveniently gives me an excuse to briefly detour for a quick tutorial on how pulse oximeters work. This particular unit is an example of the most common technique, known as transmissive pulse oximetry. In this approach, quoting Wikipedia:

One side of a thin part of the patient’s body, usually a fingertip or earlobe, is illuminated, and the photodetector is on the other side…other convenient sites include an infant’s foot or an unconscious patient’s cheek or tongue.

The “illumination” mentioned in the quote is dual frequency in nature, as the label suggests:

More from Wikipedia:

Absorption of light at these wavelengths differs significantly between blood loaded with oxygen and blood lacking oxygen. Oxygenated hemoglobin absorbs more infrared light and allows more red light to pass through. Deoxygenated hemoglobin allows more infrared light to pass through and absorbs more red light. The LEDs sequence through their cycle of one on, then the other, then both off about thirty times per second which allows the photodiode to respond to the red and infrared light separately and also adjust for the ambient light baseline.

Here’s what the dual-LED emitter structure looks like in action in the VOL60A; perhaps obviously, the IR transmitter isn’t visible to the naked eye (and my smartphone’s camera also unsurprisingly apparently has an IR filter ahead of the image sensor):

Note that in this design implementation, the LEDs are on the bottom half of the pulse oximeter, with their illumination shining upward through the fingertip and exiting via the fingernail to the photodetector above it. This is different than the conceptual image shown earlier from Wikipedia, which locates the LEDs at the top and the photodetector at the bottom (and ironically matches the locations shown in the conceptual image in the VOL60A user manual!).

Note, too, that the Wikipedia diagram shows a common photodetector for both LED transmitters. I’ll shortly show you the photodetector in this design, which I believe has an identical structure. That said, other conceptual diagrams, such as the one shown here:

have two photodetectors (called “sensors” in this case), one for each LED (IR and red).

In the interest of wordcount efficiency, I won’t dive deep into the background theory and implementation arithmetic that enable the pulse oximeter to ascertain both oxygen saturation and pulse rate. If you’d like to follow in my research footsteps, Google searches on terms and phrases such as pulse oximeter, pulse oximetry and pulse oximeter operation will likely prove fruitful. In addition to the earlier mentioned Wikipedia entry, two other resources I can also specifically recommend come from the University of Iowa and How Equipment Works.

What I will say a few more words about involves the inherent variability of a pulse oximeter’s results and the root causes of this inconsistency, as well as what might have gone awry with my particular unit. These root-cause variables include amount and density of both fat, muscle, skin and bone in the finger, any callouses or scarring of the fingertip, whether the user is unduly cold at the time of device operation, and the amount and composition of any fingernail polish. While, as Wikipedia notes:

Taking advantage of the pulsate flow of arterial blood, it [the pulse oximeter] measures the change in absorbance over the course of a cardiac cycle, allowing it to determine the absorbance due to arterial blood alone, excluding unchanging absorbance [due to the above variables].

Those sample-to-sample unchanging variables can still affect the baseline measurement assumptions, therefore the broader finger-to-finger, user-to-user, and test-to-test results.

And in my particular case, while I don’t think anything went wonky with the arithmetic done on the sensed data, the data itself is suspect in my mind. Note, for example, that oxygenated blood assessment is disproportionately reliant on successful passage of red visible spectrum light. If the red LED has gone dim for some reason, if its transmission frequency has wandered from its original 660 nm center point, and/or if the photosensor is no longer as sensitive to red light as it once was, the pulse oximeter would then deliver lower-than-accurate oxygen saturation results.

Tutorial over, let’s get back to tearing down. Here are left- and right-side views, both with the front and back halves of the device “closed”:

and “open”, i.e., expanded as would be the case when the finger is inserted in-between them:

What I’m about to say might shock my fellow electrical engineers reading these words, but frankly one of the most intriguing aspects of this design (maybe the most) is mechanical in nature; the robust hinge-and-spring structure at the top, supporting both linear expansion and pivot rotation, that dynamically adapts to both finger insertion and removal and various finger dimensions while still firmly clinging to the finger during measurement cycles. You can see more of its capabilities in these top views; note, too, the flex cable interconnecting the two halves:

And, last but not least, here’s a bottom-end perspective of the device:

Accessing the backside battery compartment reveals two tempting screw candidates:

You know what comes next, right?

A couple of retaining tabs also still need to be “popped”:

And voila, our first disassembly step is complete:

As you’ll see, I’ve already begun to displace the slim PCB in the center from its surroundings:

Let’s next finish the job:

This closeup showcases the two transmission LEDs, one red and the other IR and with the cluster protected from the elements by a clear plastic rectangular structure, that shine through the back-half “window” shown in the previous shot and onto the user’s fingertip underside:

Chronologically jumping ahead briefly, here’s a post-teardown re-enactment of what it looks like temporarily back in place (and this time not illuminated):

And here’s another view of that flex PCB, which (perhaps obviously) routes both power and the LEDs’ output signals to (presumably) processing circuitry in the pulse oximeter’s front half:

Speaking of which, let’s try getting inside that front half next. In previous photos, you may have already noticed two holes at the top of the device, along with one toward the top on each side. They’re for, I believe, passive ventilation purposes, to remove heat generated by internal circuitry. But there are two more, this time with visible screw heads within them, potentially providing a pathway to the front-half insides:

Yep, you guessed it:

Again, the spudger comes through in helping complete the task:

The display dominates the landscape on this half of the PCB, along with the switch at bottom:

But I bet you already saw the two screws at the bottom, on either side of the switch, right?

With them removed, we can lift the PCB away from the chassis, exposing its back for inspection:

The large IC at the top (bottom of the PCB when installed) is the STMicroelectronics-supplied system “brains”. Specifically, it’s a STM32F100C8T6B Arm Cortex-M3-based microcontroller also containing 32 KBytes of integrated flash memory. And below it, in the center, is the three-lead photosensor, surrounded by translucent plastic seemingly for both protective and lens-focusing functions. In the previous photo, you’ll see the plastic “window” in the chassis that it normally mates with. And, in closing, here’s another after-the-fact re-assembly reenactment:

Note, too, the “felt” lining this upper-half time, presumably to preclude nail polish damage? Your thoughts on this or anything else in this piece are as-always welcome in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

 Related Content

• Learning and working in the era of COVID-19
• Simple pulse oximetry for wearable monitor
• Pulse oximetry basics and MCUs
• Signal processing and calibration improve blood measurements
• Pulse oximetry benefits from the latest programmable SoCs
• Teardown: Inside the art of pulse oximetry

The post Peering inside a Pulse Oximeter appeared first on EDN.

Following its recent relocation to larger premises (supporting ongoing growth and expanding operations), Sheffield University spin-off Phlux Technology —which designs and manufactures 1550nm avalanche photodiode (APD) infrared sensors — has appointed Christian Rookes as VP of marketing, Brian Williams as VP of operations, and John Fuller as director of engineering...

• Solution identifies subtle defects such as wire sag, near shorts, and stray wires for comprehensive assessment of wire bond integrity
• Advanced capacitive-based test methodology enables superior defect detection
• Test platform is high volume manufacturing ready, capable of testing 20 integrated circuits simultaneously for throughput of up to 72,000 units per hour

INDIA – Keysight Technologies, Inc. introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components.

The semiconductor industry is faced with testing challenges due to the increasing density of chips in mission-critical applications such as medical devices and automotive systems. Current testing methodologies often fall short in detecting wire bond structural defects, which lead to costly latent failures. In addition, traditional testing approaches frequently rely on sampling techniques that do not adequately identify wire bond structural defects.

The EST addresses these testing challenges by using cutting-edge nano Vectorless Test Enhanced Performance (nVTEP) technology to create a capacitive structure between the wire bond and a sensor plate. Using this method the EST can identify subtle defects such as wire sag, near shorts, and stray wires to enable comprehensive assessment of wire bond integrity.

Key benefits of the EST include:

• Advanced defect detection – Identifies a wide range of wire bond defects, both electrical and non-electrical, by analyzing changes in capacitive coupling patterns to ensure the functionality and reliability of electronic components.
• High volume manufacturing ready – Enables throughput of up to 72,000 units per hour through the ability to test up to 20 integrated circuits simultaneously, which boosts productivity and efficiency in high-volume production environments.
• Big data analytics integration: Captures defects and enhances yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT), and real-time part averaging test (RPAT).

Carol Leh, Vice President, Electronic Industrial Solutions Group Center of Excellence, Keysight, said: “Keysight is dedicated to pioneering innovative solutions that address the most pressing challenges in the wire bonding process. The Electrical Structural Tester empowers chip manufacturers to enhance production efficiency by rapidly identifying wire bond defects, ensuring superior quality and reliability in high-volume manufacturing.”

The post Keysight Unveils Wire Bond Inspection Solution for Semiconductor Manufacturing appeared first on ELE Times.

submitted by /u/kymakid
[link] [comments]

LED product and lighting maker Lumileds LLC of San Jose, CA, USA says that, in the past few years, it has realized significant external quantum efficiency (EQE) performance for micro-LEDs. However, for micro-LEDs, and display applications in particular, EQE on its own is not a sufficient measure of performance...

Author: STMicroelectronics

With the global spotlight on sports these days, it is almost impossible to overlook the technological innovations like the MEMS (Micro-Electro-Mechanical Systems) sensors. Embedded in wearable technology like smartwatches and fitness trackers, MEMS sensors facilitate athletic performance monitoring and enhancement. From everyday training to major sports events, these tiny yet powerful sensors help monitor progress and receive real-time feedback.

Precision in athletics and cycling

In the world of athletics, every millisecond and centimeter matters. Consider an athlete preparing for a high jump and representing their country at an international level. They are constantly seeking ways to perfect their jumping techniques. With each leap, MEMS sensors embedded in their sportswear ensure precise data capturing on jump height and distance and the real-time feedback will help athletes make immediate adjustments – optimizing form and technique.

Cyclists rely heavily on maintaining optimal cadence and power output to ensure peak performance. Thanks to MEMS sensors, they can optimize their pedaling efficiency and power distribution. The data collected by these sensors facilitates real-time adjustments, leading to not only improved performance but also providing a competitive edge.

How MEMS sensor technology works

ST is at the forefront of MEMS sensor Technology, integrating micro-electro-mechanical systems with electronic circuits and enabling the measurement of various physical parameters such as acceleration, angular velocity, orientation, pressure and more. For example, an accelerometer calculates the velocity, measures the rate of change of velocity in an object, and detects specific gestures and tracks body movements, providing athletes with precise and reliable data.

Optimizing training in swimming and racket sports

Efficient turns can make all the difference in competitive swimming. Precise depth measurements are crucial for underwater challenges and MEMS sensors have made a substantial impact in this area. For example, the ST waterproof pressure sensor can provide real-time data on turns and depth, helping swimmers optimize their performance and efficiency in the water.

Indeed, with MEMS sensors embedded in their sportswear or goggles, the swimmer can monitor their performance during training sessions. Moreover, using this data, coaches can adjust the training regimen, empowering their swimmers to perform their best, resulting in improved performance and a competitive edge in the pool or open water.

In racket sports like tennis, padel and baseball, the speed and accuracy of strokes are key. MEMS sensors embedded in rackets or bats provide detailed data on gestures and impact, helping athletes make immediate adjustments and improve their strokes. If you want to learn more about the latest advancements in performance monitoring, read the article on MEMS sensors that vastly Improve the performance-per-watt ratio.

Real-time feedback in football and adaptive training

For contact sports like football, impact monitoring is crucial for both player safety and performance, as well as tracking the ball’s speed and spin rate while in the air. High-g accelerometer MEMS sensors embedded in helmets, capture detailed impact data while meticulous smart ball tracking enhances the viewing experience for football fans.

In addition, they provide valuable insights into the force and direction of collisions that in turn help coaches and medical staff monitor the safety of the players. It also enables informed decision-making around training and gameplay. For instance, if a player experiences significant impact, the data can prompt immediate medical evaluation, thus ensuring the player’s well-being.

The versatility of MEMS sensors extends to a wide range of sports. Whether it is cyclists adjusting their cadence, swimmers refining their turns or tennis players perfecting their swing, MEMS sensors, including motion sensors such as Inertial Measurement Units (IMU) provide the real-time data needed to make immediate improvements and, over time, achieve better results and a competitive edge.

MEMS sensors embedded in wearable technology are undeniably transforming the landscape of competitive sports. They provide precise performance monitoring and optimize training routines with real-time feedback. As technology continues to advance, the role of MEMS sensors in enhancing athletic performance will only become more significant, paving the way for future generations of athletes.

The post From basic training to world-class competitions: MEMS sensors in wearable technology enhance athletic performance appeared first on ELE Times.

When we think of space exploration, the focus often gravitates toward massive rockets, sophisticated spacecrafts, and the captivating images they send back to Earth. However, the unsung heroes in these endeavors are the critical components ensuring that every part of these complex systems communicates effectively. One of the most critical components enabling this communication is connectors.

From the Artemis program’s monumental lunar missions to the revolutionary insights of the James Webb Space Telescope, the success of these missions hinges not just on the large-scale engineering feats but also on the reliability and performance of connectors. These ubiquitous components face the extreme conditions of space and are pivotal in every step, from the rigors of launch to the harsh environment of outer space.

Space Exploration Ascending

Space exploration, both by government organizations and commercial ventures, is very much in the news. One of the most extensive programs in recent space history is the Artemis program, which will see humans return to the Moon. The Space Launch System (SLS) completed its first successful test mission in December of 2022 and forms the largest component of the program. However, the latest steps in our return to the Moon are not the only exciting initiatives in space.

While these high-profile events capture the public’s imagination, they represent just a small part of the picture. Exploration and exploitation of space are everyday activities. More than 200 space launches were made in 2023 alone, carrying science missions and satellites into orbit and beyond.

The Extreme Conditions of Space

Even though spaceflight has become more common, the conditions in which these systems must perform are unlike any other. Space represents possibly the single most demanding environment known to engineering. Any equipment used in spaceflight is exposed to a range of extremes, from high and low temperatures and harsh radiation to the severities of the launch process and the vacuum of space.

The lack of atmosphere in space is incredibly unforgiving. On Earth, our atmosphere is a protective blanket that provides pressure, thermal insulation, and safety from harmful radiation. This protection is stripped away in space, exposing equipment to potential damage.

Without the atmosphere to protect it, an object in space receives the full force of the sun’s radiation. When equipment is bombarded by direct sunlight, its temperature can quickly become dangerously high. In contrast, the parts of a spacecraft that remain in shadow are very cold. These temperature extremes, must be considered when selecting the materials to use aboard space vehicles. Other radiation sources, including galactic cosmic rays, are highly ionizing and can harm delicate instruments or sophisticated electronic circuits.

Choosing the Right Materials for Spaceflight

The lack of atmospheric pressure also causes materials to behave in unique ways. Components employed for spaceflight can face an array of challenges that affect performance. Outgassing is when a gas trapped inside another material is released. This is a common problem when plastic is exposed to a vacuum during spaceflight, but it is not limited to plastics alone. Some metals, including zinc and cadmium, are also prone to sublimation in vacuum conditions, both of which are commonly used in conventional equipment design.

In both cases, the gas that is released can cause damage. It may condense onto cold surfaces such as the optics and sensors of scientific equipment, which can degrade or even negate their effectiveness and put the entire mission at risk. NASA and the European Space Agency (ESA) have recommended volume levels of outgassing for materials used in their space applications. These recommendations play a key role in selecting components for spaceflight.

Components also need to be mechanically robust, as launching satellites, probes, and spacecrafts into orbit exposes them to acceleration and vibration that can cause damage that might be undiscovered for months or years. As such, plastic components need to be manufactured using materials that exhibit high stability, even in vacuum conditions.

To provide solutions for these demanding conditions, connectors designed for spaceflight must be amongst the most advanced in the industry. Manufactured to stringent standards and tested to prove their performance even in the vacuum of space, they are the very definition of high-reliability connectors.

Engineered for Maximum Endurance

If the spaceflight environment is not challenging enough, there is one additional aspect that contributes to the difficulties of designing for spaceflight: endurance. Whether intended for commercial or scientific purposes, space missions can last for years. If a piece of equipment fails, gaining access to fix the problem is essentially impossible. In these circumstances, designers and engineers depend on the reliability of each component that makes up the equipment, no matter how small.

Endurance also plays a crucial role in power planning. A long-range probe operates on a stringent power budget, and any component that introduces unwanted electrical resistance will risk jeopardizing the mission. The electrical terminals of connectors designed for space applications are made from high-performance materials and coated with a thick layer of gold, ensuring minimal electrical resistance to reduce power loss.

Contacts with low electrical resistance provide additional benefits beyond power planning. The instruments on space probes take highly precise measurements, and the currents generated by these sensors can be extremely small. For these tiny currents, low contact resistance is crucial to maximize the likelihood of detecting critical signals.

With endurance in mind, connectors designed for spaceflight applications use materials that provide the best possible performance by reducing interference. Manufacturers must ensure that the magnetic signature of any component is minimized to prevent interference with precision scientific experiments. The connector shell also protects against electromagnetic interference (EMI). Vehicles that must traverse the vacuum of space are unprotected against solar radiation, which can interfere with scientific observations and damage sensitive instruments. This is another reason why the shells of spaceflight connectors are gold-plated, which provides the highest possible protection against EMI in these circumstances.

Mission-Critical Connector Engineering

Connectors play an often-overlooked role in spaceflight applications. Space vehicles are typically manufactured from sub-assemblies, which are brought together before launch. Connectors provide the vital interface between each system during the extensive testing regime before launch and the demanding conditions in space. Spaceflight connectors are designed according to some of the highest standards in the interconnection industry and, as a result, represent some of the most capable products available today.

David Pike

The post Connectors in Space appeared first on ELE Times.

submitted by /u/Iceteavanill [link] [comments]

Learn how to implement finite-state machines in VHDL by creating a 4-bit binary counter. After compiling, it will run on an Altera CPLD development board connected to a custom PCB with input switches and an LED display.

submitted by /u/AutoModerator
[link] [comments]