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The PCIe 6.0 CEM x16 interposer from Teledyne LeCroy allows developers to capture data traffic crossing the PCIe card connector interface at up to 64 GT/s. Leveraging the company’s TAP6 technology, the interposer reduces signal integrity issues and enhances fidelity for protocol transmission acquisition.

The interposer supports data rates of 2.5 GT/s (Gen1), 5.0 GT/s (Gen2), 8.0 GT/s (Gen3), 16.0 GT/s (Gen4), 32.0 GT/s (Gen5), and 64.0 GT/s (Gen6) with up to x16 link widths. It provides a simple and easy way to probe PCIe traffic between a host and PCIe add-in card.

In combination with Teledyne LeCroy’s Summit family of PCI Express 5.0 protocol analyzers, the new PCIe 6.0 CEM x16 interposer currently enables engineers to test product designs based on PCIe 6.0 technology at up to 32 GT/s. Additionally, it will work in combination with a PCIe 6.0-capable Summit protocol analyzer to support full 64-GT/s speeds when that analyzer is released in the future.

Connecting the interposer to a Summit PCIe analyzer allows the decoding and display of data flowing in both directions and across all lanes. Data traffic is displayed using the industry-standard CATC Trace data display, along with traffic and error reports.

The PCIe 6.0 CEM x16 interposer (PE6116UIA-X) is available for immediate order.

PCIe 6.0 CEM x16 interposer product page

Teledyne LeCroy 

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TDK Tronics adds two digital MEMS accelerometers to its AXO300 series providing high linearity and stability, even in high vibration environments. The AXO301 is a low-noise, high-resolution ±1-g device for precision acceleration/deceleration measurements in railway applications and inclination control in industrial applications. The AXO305 is a ±5-g accelerometer for navigation, positioning, and motion control in land and marine manned and unmanned systems.

Built with a closed-loop architecture, both sensors specify vibration rectification error of 20 µg/g2, 1-year composite bias repeatability of 1 mg, and composite scale factor repeatability of 600 ppm. Each device is housed in a hermetically sealed ceramic J-lead package that ensures long operational life. A 24-bit digital SPI interface eases integration into inertial measurement units (IMU), inertial navigation systems (INS), and attitude and heading reference systems (AHRS).

The AXO301 and AXO305 MEMS accelerometers are sampling now. Also available is an AXO Arduino-based evaluation kit that provides built-in testing functions, such as output reading and recording, recalibration, and digital self-tests.

AXO301 product page

AXO305 product page

TDK Tronics

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Anritsu’s Field Master MS2070A handheld spectrum analyzer provides accurate RF measurements up to 3 GHz in field, lab, and manufacturing environments. Intended for standard swept spectrum analysis, the MS2070A achieves sweep speeds of up to 32 GHz/s in common low-noise configurations.

The compact, lightweight analyzer can be used for interference hunting, base station testing, coverage and interference mapping, and passive intermodulation. Key specifications include a dynamic range of >105 dB at 2.4 GHz, typical DANL of -167 dBm with an optional built-in preamplifier, and a third order intercept of +11 dBm. Typical level accuracy is ±0.5 dB.

A number of smart measurements are standard in the Field Master MS2070A. These include occupied bandwidth, channel power, and adjacent channel power. In zero span mode, the instruments displays TDD and pulsed signals with narrow resolution bandwidth of 10 Hz to 5 MHz for accurate measurements of power over time. Spectrograms are also supplied for accurate detection of intermittent interferers.

The MS2070A spectrum analyzer is outfitted with a 10-in. display that has a resolution of 1280×800 pixels. Built-in Ethernet and USBTMC interfaces are complemented by an optional Wi-Fi 802.11b/g/a/n interface for connecting to wireless routers.

MS2070A product page

Anritsu

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Joining Diodes’ automotive IntelliFET lineup, the ZXMS81045SPQ single-channel high-side power switch provides built-in protective and diagnostic functions. It is suitable for driving 12-V loads, such as LEDs, bulbs, actuators, and motors in automotive body control and lighting systems.

The ZXMS81045SPQ combines an N-channel vertical power MOSFET rated at 41 V with onboard circuitry that protects against short circuits, manages inrush currents, and safeguards against overvoltage conditions including load dumps. It also offers overtemperature protection with auto-restart, as well as ESD protection. Loss of ground and reverse polarity protection can be implemented with the addition of a few external components.

Diagnostic functions of the ZXMS81045SPQ include a dedicated current sense pin for analog current monitoring of the output, open-load detection, and defined fault indication of overload, overtemperature, and short-circuit conditions.

The AEC-Q100 qualified ZXMS81045SPQ high-side switch comes in an SO-8EP (Type E) exposed heatsink package and costs $0.95 each in lots of 2500 units.

ZXMS81045SPQ product page

Diodes

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Endura Precision Timing Solution Enables Faster GPS Signal Acquisition and Locking

SiTime Corporation, a market leader in precision timing, today announced a 32 kHz MEMS Super-TCXO that sets a new performance benchmark for timekeeping components in electronics. The SiT7910 is part of the SiTime Endura ruggedized family for aerospace and defense applications. Devices that use global positioning system (GPS) signals, such as ruggedized handheld radios, ground vehicles and sensors, can acquire and lock to GPS more quickly and securely with the 25x higher precision of this Super-TCXO.

“The GPS signal is ubiquitous and is a crucial part of national security, everyday communications, financial systems, and power grid operations,” said Piyush Sevalia, executive vice president of marketing at SiTime. “However, it is susceptible not just to environmental disruptions but also to jamming and spoofing. GPS modernization is a multibillion-dollar, multi-year effort to upgrade the system with better features, performance, and security. Instrumental to this modernization is precision timekeeping, which ensures the faster and more secure acquisition of, and locking to GPS signals, even in the harshest of environmental conditions. Our SiT7910 Super-TCXO excels at overcoming these challenges. Like other SiTime products, it is another example of using our MEMS, analog, and systems technologies to create precision timing solutions that solve the world’s big problems today.”

Sevalia continued, “We estimate that the SiTime product portfolio currently addresses a SAM (served addressable market) of approximately $2 billion. With products like Endura Super-TCXO and other recently introduced families, we are well on our way to growing our SAM to $4 billion by the end of 2024.” 

Key features of the Endura SiT7910 Super-TCXO

• 32.768 kHz frequency
• ±0.2 ppm frequency stability over -55°C to +105°C temperature range, up to 25x better than legacy quartz technology. The device maintains 1 second of accuracy for one year, vs. legacy quartz devices that can only maintain it for one to 14 days.
• Best-in-class 20 ppb/g g-sensitivity for resilience in high-vibration environments
• Ultra-low power consumption, typically 6.0 µA, for use in portable aerospace and defense electronics
• ±5 ppm frequency aging over 20 years, maintains device performance over decades
• 1.62 V to 3.63 V operating supply voltage range for design flexibility
• Small 2.5 x 2.0 mm package for space-constrained applications
• Pb-free, RoHS, and REACH compliant
• Endura enhanced screening flow for high quality and reliability

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Infineon’s latest semiconductor innovations transform the IoT for a comfier and greener future

IoT technologies have the potential to overcome many of the challenges society faces today. Even more, they improve the quality of life, convenience and increase industrial productivity. At the heart of every IoT solution are microelectronics such as sensors, actuators, microcontrollers, connectivity modules and security components.

As a leading semiconductor manufacturer for power systems and IoT solutions, Infineon is working with customers and partners to jointly drive decarbonization and digitalization.

Under the motto “Driving decarbonization and digitalization. Together.”, Infineon anticipates the opportunity to extend a personal welcome to their customers again this year. In addition, customers can register for Infineon’s digital platform – the perfect place to dive deeper into the various technologies that will be presented at MWC during and after the event.

• Enabling a healthy life with smart semiconductor solutions

Infineon’s semiconductor products are the perfect match for smart health devices as they meet the requirements of digital health devices. They support a health-conscious lifestyle by enabling smart home devices that can help improve well-being. For example, smart speakers with radar sensors can detect a heart beat, whether someone has fallen on the floor, and even coughing or snoring. In this way, Infineon’s solutions enable not only a more comfortable, but also a longer, more independent and healthier life at home in an increasingly ageing society.

• Bringing AR to enterprise and medical environments

Magic Leap 2, the latest AR device from AR pioneer Magic Leap, is specifically designed for enterprise and healthcare applications. One of the key features of the latest Magic Leap generation is the 3D depth sensor technology with indirect light time-of-flight (iToF), jointly developed by Infineon and pmd technologies. The new and improved iToF technology connects the real and digital worlds more intuitively through improved gesture control and more accurate user interaction. This opens up new use cases where precision and reliability are critical, such as remote maintenance and diagnostics of industrial machinery, or AI-assisted surgery that enables doctors to better understand patient anatomy.

• Decarbonizing data centers for a greener future

As more and more devices are connected in smart homes and other areas, it is estimated that 175 zettabytes of data will be processed globally by 2025. This will dramatically increase the energy needs of the world’s 8,000 or so data centres, particularly for cooling servers. At MWC 23, Infineon is demonstrating together with Super Micro Computer how green computing platforms can make an important contribution to the decarbonization of computing. The MicroBlade family offers top-notch server density for a wide range of processors and features integrated OptiMOS power stages with best-in-class efficiency.

• Transforming things into payment devices

Why only pay with your credit card, smartphone, or smartwatch? Infineon’s technology is helping to digitize payments by transforming virtually everything from smartwatches and fitness trackers to rings, bracelets and more into a payment device. This is possible with a chip half the size of a ladybug. At MWC 23, Infineon will demonstrate how ultra-low power consumption and tiny form factors are paving the way for a whole new dimension of NFC-enabled wearables for fast, convenient, and secure payments that meet the increasingly demanding security and contactless requirements of the payment industry.

Infineon and adidas showcase smart and interactive jacket

At this year’s Mobile World Congress in Barcelona, Infineon invited adidas AG to showcase their prototype of an interactive, smart jacket at the Infineon booth.The ‘5G Connected Sport Jacket’ by adidas AG allows real-time feedback on fitness data, connectivity anytime and anywhere, as well as a SOS alarm system in case of emergency. Such applications embedded in clothes or any other wearable devices rely on semiconductor technology to turn a jacket into a smart device in order to avoid any other kind of mobile device while doing sports.

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These small, high-CV MLCCs enable revolutionary board space, weight, and component count reductions in high-reliability military applications.

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is proud to announce that its MIL-PRF-32535 BME NP0 MLCCs have been approved to the Defense Logistics Agency (DLA) Qualified Products Database (QPD).

The new MIL-PRF-32535 BME NP0 MLCCs have higher CV capabilities than standard surface-mount PME MLCCs qualified to military and aerospace specifications and are currently available in “M” and “T” reliability levels and 0402, 0603, and 0805 case sizes and rated for 68–1,500pF and 4–100V. These small, high-CV MLCCs enable revolutionary board space, weight, and component count reductions. They also feature KYOCERA AVX’s patented FLEXITERM® termination technology, which, compared to standard terminations, significantly enhances resistance to the thermomechanical stresses experienced during assembly and operation.

MIL-PRF-32535 BME NP0 MLCCs are approved for use in high-reliability military and aerospace applications including filtering, tuning, decoupling, timing, and blocking circuits.

“We have been honing and perfecting best-in-class BME MLCC technology since the 1990s and are proud to further extend our portfolio of tested and proven high-CV solutions qualified for use in high-reliability military and aerospace applications,” said Michael Conway, Product & Marketing Manager – High-Reliability Components, KYOCERA AVX. “The new MIL-PRF-32535 BME NP0 series is the latest development in our enduring mission to meet our high-rel customers’ needs. It satisfies a growing demand for smaller, high-CV, military-qualified capacitor technology, and we will continue to expand this product range and this portfolio to meet the ever-evolving demands of the global military and aerospace industry.”

Lead time for the series is currently 22 weeks for M-level reliability parts (Group A) and 38 weeks for T-level reliability parts (Groups A and B). However, lead times could be shorter if the parts are in stock at an authorized distributor, such as Avnet, Arrow, and TTI.

For prototype and verification designs, KYOCERA AVX recommends the use of its Engineering Module (EM) Range X7R BME MLCCs for non-flight prototypes. This series covers capacitors in the ESCC 3009041, NASA S311-P838, and MIL 32535 ranges and uses the same materials as the fully qualified part numbers, just without the final DLA and European Space Components Coordination (ESCC) testing and screening processes and QPD/QPL listings, so it’s available with shorter lead times.

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Author: STMicroelectronics

Connected cars provide opportunities for car makers and Tier-1 suppliers to introduce new functionalities and services such as infotainment, digital key systems, authentication, and vehicle-to-everything (V2X) communication. While these new possibilities promise many benefits, cybersecurity experts have voiced well-founded concerns over how this connectivity is secured. Let’s discover how we can ensure the highest level of security in connected cars, in a timely and cost-effective manner.

Hardware secure MCUs: the safest road to security

Among the different strategies available to tighten security, hardware systems offer greater protection against tampering and other malicious attacks than any software-based approach. EAL6+ Common Criteria certified, ST’s secure hardware element offers the highest level of security currently available. Named ST33K-A, the product provides authentication, confidentiality, and integrity services to protect car manufacturers and Tier-1 suppliers against cloning, counterfeiting, malware injection and unauthorized production.

ST33K-A was specifically developed for the automotive industry. Designed to protect any kind of device from unauthorized access, this tamper-proof MCU can store confidential and cryptographic data, protect credentials and run secure, unique authentication and identification services. More specifically, ST33K-A securely generates and stores encryption keys in a Root of Trust (RoT) platform to encrypt and decrypt data “on demand”. These tasks can be performed effectively in harsh environments, from –40 °C up to 105 °C. In terms of performance, the chip incorporates the most recent generation of Arm® processors.

Easy Lego-like modular developments

ST’s hardware secure MCU has more to offer than just security. It can host and run a wide range of in-cabin applications, such as Qi charging pads, digital car keys and ‘plug and go’ platforms. To create and secure these connected services in a timely manner, ST has developed an easy-to-use modular approach. Developers can use the ST33K-A secure element as a strong security hardware foundation. Depending on their targeted applications, they can add STSAFE-V, a secure system solution for vehicles, with either a STSAFE-VJ multi-SoC solution based on Java Card or a STSAFE-TPM dedicated solution. This agile development process is the preferred solution of thousands of OEMs. More than 1.5 billion units of ST33 have been sold and customized so far.

ST provides end-to-end confidentiality. ST33K-A units are produced using certified manufacturing processes, through a trusted supply chain with pre-provisioned secrets and certificates. Sensitive customer data is handled in a highly confidential environment. Developers receive a set of software libraries and drivers to ensure their secure and seamless integration into the final device. If necessary, ST can also develop tailored innovative solutions that meet specific customer needs.

Affordable security access points

The automotive industry is moving to deliver the right level of security. But change doesn’t happen overnight. While a secure element might be the only viable route to security, concerns about the cost of implementing such a secure element into every single device may arise. ST’s R&D team is committed to helping carmakers and Tier-1 suppliers to gradually upgrade their architecture in a cost-effective way. As a leader in integrated solutions, ST R&D experts can create access points, with one single secure element addressing various applications. More information is available on our website.

Make sure you aren’t ignoring threats. Build new competitive infotainment services that keep hackers out with ST33K-A and STSAFE-V.

https://blog.st.com/how-carmakers-can-secure-connected-cars/

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The National Institute of Standards and Technology (NIST) has selected a group of cryptographic algorithms to secure the Internet of Things (IoT) devices and the related tiny sensors and actuators. Ascon, a group of cryptographic algorithms, will also serve other miniature devices like medical gadgets, stress detectors inside roads and bridges, and keyless vehicle entry fobs.

NIST will publish the “lightweight cryptography” standard later this year. It’ll be targeted at tiny devices that have limited resources and thus demand a compact security implementation. “The Ascon algorithms for lightweight cryptography will cover devices with resource constraints,” said NIST computer scientist Kerry McKay.

Figure 1 Ascon algorithms have withstood years of examination by cryptographers. Source: Ascon

Several years ago, NIST announced a development program to determine the strongest and most efficient lightweight algorithms, first communicating with industry and other organizations to understand the needs. In 2018, it requested potential solutions from the cryptography community and received 57 submissions. Next, McKay and mathematician Meltem Sönmez Turan carried out a multi-round public review process and selected 10 finalists.

Finally, Ascon became the winner for its algorithm’s performance and flexibility in terms of speed, size, and energy use. Ascon—developed in 2014 by a team of cryptographers from Graz University of Technology, Infineon Technologies, Lamarr Security Research, and Radboud University—is currently available in seven variants.

Ascon’s lightweight cryptography variants

According to McKay, Ascon’s two variants or tasks are among the most important in lightweight cryptography: authenticated encryption with associated data (AEAD) and hashing. AEAD—besides protecting the the confidentiality of a message—allows additional information like the header of a message or a device’s IP address to be included without being encrypted. In lightweight cryptography, it can be used in vehicle-to-vehicle communications. It can also help prevent the counterfeiting of messages exchanged with the RFID tags that often help track packages in warehouses.

On the other hand, hashing creates a short digital fingerprint of a message that enables a recipient to determine whether the message has changed. It can be used to check whether a software update is appropriate or has been downloaded correctly.

Here, it’s worth mentioning that the the most efficient NIST-approved technique for AEAD is the Advanced Encryption Standard (AES), while SHA-256 is widely used for hashing. However, as McKay clarified, the goal of this project is not to replace AES or hash standards. “NIST still recommends their use on devices that don’t have the resource constraints that these new algorithms address.”

Figure 2 Lightweight cryptography serves small devices for tasks ranging from sensing to identification to machine control. Source: NIST

McKay added that the new algorithms are also not intended to be used for post-quantum encryption, another current concern of the cryptography community that NIST is addressing. “Post-quantum encryption is primarily important for long-term secrets that need to be protected for years,” she said. “In contrast, lightweight cryptography is generally important for more ephemeral secrets.”

Related Content

• Are you prepared for zero-day threats?
• Closing Knowledge Gap on Hardware Security
• Ending the Cat-and-Mouse Game of Firmware Attacks
• What’s Driving the Shift from Software to Hardware in IoT Security?
• The Unexpected Outcome of Ransomware: An Industrial Digital Revolution

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