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NXP Semiconductors, an innovator and supplier of Ultra-Wideband (UWB) solutions, and Rohde & Schwarz collaborate to demonstrate a test setup for UWB radar target simulation at the upcoming Mobile World Congress in Barcelona. The demonstration, being the first of its kind, verifies the unique performance of the NXP Trimension NCJ29D6A chipset including the enhanced radar algorithms. It is capable of generating UWB radar targets with a variable target distance down to a few centimeters, enabling maximum control and reproducibility of the simulated scenario.

Ultra-Wideband (UWB) technology is experiencing a steep growth in automotive, mobile and IoT markets, based on its secure and precise ranging capabilities. The Digital Key as defined by the Car Connectivity Consortium (CCC) leverages UWB for secure and convenient handsfree car access without compromises. The current-generation NXP Trimension UWB chipsets enable new UWB-radar use cases, such as Child Presence Detection (CPD), kick-sensing for easy trunk access, intrusion or proximity detection, and much more.

These UWB radar applications benefit from advanced target simulation, able to solve technical challenges, like short distance target simulation and large signal bandwidth, to mention just two. The key components are the R&S SMW200A signal generator, a R&S FSW26 spectrum analyzer and an R&S developed control software. The equipment used is available in UWB engineering laboratories today, hence reducing the initial capital investment. The demonstration is especially interesting for UWB chipset suppliers, module providers, Tier1s and vehicle OEMs.

In order to support the automotive ecosystem in testing these new use cases, collaboration with key partners is especially important. Rohde & Schwarz and NXP Semiconductors have worked closely together to validate this test system. Jürgen Meyer, Vice President Automotive Market Segment at Rohde & Schwarz remarked, “We greatly appreciate the close working relationship with the NXP Semiconductors teams around the world to realize this unique demonstration to provide the automotive industry with the test capabilities it needs to enable the next wave of UWB applications.”

An integral part of this demonstration setup is NXP’s Trimension NCJ29D6A, which is the first monolithic UWB chipset that combines secure ranging and short-range radar with an integrated MCU to enable use cases such as CPD, kick-sensing, and intrusion detection. “The demonstrator from Rohde & Schwarz allows our customers to validate their UWB radar systems and algorithms to shorten development cycles and optimize time-to-market,” said Michael Leitner, General Manager Secure Car Access, NXP Semiconductors. “This collaboration with Rohde & Schwarz is another milestone contributing to the success of UWB technology in the automotive market.”

The test setup will be shown at the Mobile World Congress in Barcelona, from the March 3 to March 6, 2025, at the Fira Gran Via, in Hall 5, booth 5A80.

The post MWC25: Rohde & Schwarz demonstrates unique UWB radar target simulation with NXP Trimension NCJ29D6 automotive solution appeared first on ELE Times.

Malaysia is serious about its bid to move up the semiconductor industry ladder by establishing an IC design presence, and Arm’s setting up a design shop there is a testament to this ambition. Malaysia’s Prime Minister Anwar Ibrahim told reporters late last week that he has been on a call with Arm CEO Rene Haas and SoftBank’s head Masayoshi Son regarding this matter.

He added that talks are in the final stage and the agreement will be finalized and signed this month. Ibrahim also said that this demonstrates confidence in Malaysia’s policies and its ambition to become a regional hub for semiconductor design and manufacturing.

Malaysia is keen to penetrate the IC design market to bolster its standing as a regional tech hub. Source: CNA

This initiative is part of Malaysia’s National Semiconductor Strategy (NSS), which calls for $110 billion of direct investment in IC design, advanced packaging, and front-end semiconductor manufacturing processes, which includes wafer fabs and manufacturing equipment.

Details on what kind of design work Arm will carry out in Malaysia are yet to emerge. Ibrahim calls it a major test for the country’s ambition to embrace IC design work. “Can we provide tens of thousands of young professionals?”

“This is a challenge for the youth,” he added. “A professional workforce is essential when we attract significant investments.” That also shows a lot of sense of excitement.

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