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latest product and technology information from electronics companies in India
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PSoC Automotive 4100S Max supports fifth generation CAPSENSE technology with higher performance

Fri, 03/01/2024 - 14:24

Infineon Technologies has launched the new Automotive PSoC 4100S Max family. This microcontroller device family expands Infineon’s portfolio of CAPSENSE-enabled Human Machine Interface (HMI) solutions for automotive body/HVAC and steering wheel applications by delivering higher flash densities, GPIOs, CAN-FD, and HW-Security.

The Automotive PSoC 4100S Max with fifth-generation CAPSENSE technology offering 10x higher sensitivity is available in 100-TQFP (14×14 mm²), 64-TQFP (10×10 mm²) and 48-QFN (7×7 mm²) packages. It is an optimal solution for automotive HMI applications requiring low-power consumption, multiple sensing pins (50+), configurable scan times to optimize the system’s refresh rate, high-speed communication (CAN-FD, I2C), and dedicated HW-cryptography for enhanced security while offloading the main CPU. This device offers up to 84 GPIOs and 384 KB of flash memory (the largest PSoC4 flash memory in its class).

The Automotive PSoC 4100S Max is AECQ-100 qualified up to 125 °C ambient temperature and also provides support towards ASIL-B (ISO 26262-ready), which helps the integrator to achieve system level compliance for automotive application supported by Infineon’s latest ModusToolbox development platform, the devices allow developers an easy implementation for a variety of use cases.

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Samsung Semiconductor India expands R&D footprint with a new state-of-the-art R&D facility in Namma Bengaluru

Fri, 03/01/2024 - 14:02

Samsung Semiconductor India Research (SSIR) has announced the opening of its new R&D facility in Bengaluru. The expansion marks a significant milestone in SSIR’s commitment to driving cutting-edge semiconductor research and development in India, while addressing the company’s growing needs for advanced infrastructure. This is SSIR’s second office in Bengaluru, with a capacity to accommodate close to sixteen hundred professionals. Located at Bagmane Capital Tech Park in Angkor-West, the facility spans 1,60,000 square feet across four floors.

The new campus of Samsung Semiconductor India Research (SSIR) features a modern, open-plan layout across four floors, encouraging collaboration and agility. The design includes designated hot-desking areas for workforce flexibility. There are over sixty (60) state-of-the-art meeting rooms for seamless communication, and amenities such as a fully equipped cafeteria, medical facilities, dedicated nap rooms, and recreational areas for rejuvenation for all employees. Additionally, transport shuttle services are also available which will further enhance convenience, ensuring a holistic work experience for SSIR employees.

“It is an exciting moment for us as the new facility in Bengaluru embodies our commitment to expanding our footprint in India and enabling a vibrant environment for our exceptional team members. This new hub reinforces SSIR’s standing as a crucial player in Samsung Semiconductor’s global innovation ecosystem as we open the doors to new opportunities”, said Balajee Sowrirajan, EVP & MD at Samsung Semiconductor India Research.

SSIR currently has a strength of over four thousand and five hundred (4500) employees and will add over seven hundred (700) people including fresh graduates as well as lateral hires across teams in India.

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With click rate analysis, the R&S EPL1000 EMI test receiver is the cost-effective answer to CISPR 14-1 compliance testing

Fri, 03/01/2024 - 13:21

For both device developers and conformance test houses the R&S EPL1000 EMI test receiver offers fast, accurate and reliable EMI compliance measurements up to 30 MHz at the best price in its class. The R&S EPL1000 now adds click rate measurements in line with the latest CISPR 14-1:2020 version, mandatory for household appliances and electric power tools.

The electromagnetic emissions of a wide range of household consumer devices that must comply with CISPR 14-1 require conducted tests up to 30 MHz. The R&S EPL1000 EMI test receiver meets all requirements and complies with the CISPR test procedures for frequency bands A and B at an attractive price.

The new R&S EPL1-K59 Click Rate Analyzer option provides click rate measurements in line with CISPR 14-1 and the Japanese DENAN Law requirements. These measurements are mandatory for household appliances and electric power tools with switching operations such as cookers, air conditioners and washing machines, because the switching process can cause discontinuous disturbance (“clicks”) or spikes in emissions.

The R&S EPL1000 supports both the conventional sequential frequency scan and the fast FFT-based time domain scan, enabling it to measure CISPR band A and B standard compliant in one shot. The latest edition 7 of CISPR 14-1 requires the click rate to be calculated separately for four frequencies in CISPR Band B. With the R&S EPL1-K59, the R&S EPL1000 can measure all four frequencies in parallel and evaluate the results four times faster than other EMI analyzers that measure each frequency sequentially.

The R&S EPL1000 is ideal for both PASS/FAIL compliance tests and troubleshooting during development. For development and debugging, hours of measured values can be evaluated in a few seconds. Users can save and recall settings and measurements for subsequent analysis. Data can also be exported for post-processing. Features such as zoom-in and markers help users to examine the values of individual clicks, and to easily measure time and level differences beyond standard click analysis.

The R&S EPL1000 is fully compliant with CISPR 16-1-1 (referenced by CISPR14-1) including the click rate analyzer measurement function. In addition to the standard calibration documents for the individual base units, documentation of the click rate verification using pulses defined in accordance with CISPR 16-1-1 is available, as required by EMC test houses.

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Light + Building 2024: Reorientation for the building sector en route to greater sustainability

Fri, 03/01/2024 - 12:31

From old buildings in need of modernisation to energy-intensive office buildings, there is much to do in the building sector en route to greater climate neutrality. In Germany, this sector accounts for around 30 per cent of CO2 emissions. For many years, however, the building sector has failed to reach the CO2 reduction targets set by the German government. Around 2,200 exhibitors are ready to present their innovative technologies at Light + Building in Frankfurt am Main from 3 to 8 March 2024.

Over the coming six days, the spotlight at the world’s leading trade fair for lighting and building-services technology will be on solutions for greater sustainability. Around 2,200 exhibitors are showing modern lighting design, smart building-services technology, technologies for efficient energy management, the connection of PV installations, charging stations for electrical mobility and the electrical infrastructure. These innovations have the potential to save up many millions of tonnes of CO2 by 2030.

Light + Building is the international platform for the electrical industry and lighting designers, and attracts companies from all over the world to Frankfurt am Main. The level of internationality among the exhibitors has reached 77 per cent. After Germany, the majority of exhibitors come from Italy, China, Türkiye, Spain, Poland, Austria, the Netherlands, the United Kingdom, France and Greece. “It is fascinating to see how many innovations for our homes and buildings are coming onto the market. Everyone can expand their knowledge in personal discussions at Light + Building. After all, if we want to achieve the reorientation towards greater sustainability in the building sector, everything has to dovetail and function efficiently”, says Wolfgang Marzin, President and Chief Executive Officer, Messe Frankfurt.

Under the motto ‘Be electrified’, Light + Building shows how intelligent energy management in buildings interconnects and optimises power-generating plant with household consumption. This has an energy-saving potential of up to 30 percent. Renewable energy generated in or on the building itself improves the carbon footprint. Increasing e-mobility is also reducing CO2 emissions. Thus, demand is growing for charging points at private households, apartment buildings, shopping centres, offices, etc. Against this background, solutions for electric charging infrastructure will be presented and discussed at Light + Building 2024.

In cooperation with its partners, the German Electro and Digital Industry Association (ZVEI) and the Federation of the German Electrical and Information Technology Installation Trades (ZVEH), Messe Frankfurt has set out the agenda for the lighting and building technology sectors with three top themes: ‘Connectivity’, ‘Sustainability’ and ‘Work + Living’. They are the content guidelines for the accompanying events during the show and include a variety of lectures, guided tours and award ceremonies to be held in the lighting area of the Design Plaza in Hall 3.1 (Stand B50). The Building Plaza in Hall 9.0 (Stand D60) focuses on building-services technology topics.

The partners of Light + Building are also taking part. At the ZVEI Technology Forum in Hall 12.1 (Stand D86), Stefan Wenzel, Parliamentary State Secretary at the Federal Ministry for Economic Affairs and Climate Action, and Wolfgang Marzin, President and Chief Executive Officer of Messe Frankfurt, will open the world’s leading trade fair for lighting and building-services technology at 13.00 hrs on 3 March 2024. Subsequently, the Technology Forum will be the meeting place for an exchange of ideas and information between exhibitors and visitors against a backdrop of lectures and panel discussions focussing on electrification and digitalisation of the building sector. The ZVEH is also represented by the E-House in Hall 11.0 (Stand C07/D07). There, the spotlight is on ‘sustainable energy supply’ and ‘smart health’.

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Quantum Leap Forward: Zurich Instruments Unveils the SHF+ Product Line for High-Fidelity Qubit Control

Fri, 03/01/2024 - 11:43

Zurich Instruments, a leader in the development and production of quantum technology products, makes another step towards more computational quantum power. The new product line, SHF+, enables increased high-fidelity qubit control, and the new feature has already been tested at leading quantum labs. This allows for even more reliable manipulation of fragile quantum states and thus enables running more powerful algorithms. This is yet another important step toward the endgame: building a useful quantum computer.

This March, Zurich Instruments launches the newest system for control and readout of superconducting qubits, including a full measurement software framework: the SHFSG+ Signal Generator, SHFQC+ Qubit Controller, and SHFQA+ Quantum Analyzer. Designed to the limits of analog performance, the SHF+ product line unites high-fidelity qubit control and quality performance and accelerates the development of longer coherence time qubits and scaling up QPUs.

The SHFSG+, SHFQC+, and SHFQA+ improve the signal-to-noise ratio (SNR) by 10 dB, placing them among the highest available on the market. Such a high SNR dramatically reduces thermal qubit excitation and, in turn, maximizes quantum computing algorithm fidelity. A substantially improved phase noise allows for suppressing phase errors in the control of long-lived qubits.

“By working closely with many leading quantum computing research groups, we’ve observed that the setup allows for reduction of the phase error limit up to ten times and reaches levels of 10-6 for qubits in the millisecond lifetime range”, says Dr. Bruno Küng, principal product marketing manager at Zurich Instruments.

In addition to a noise-optimized signal chain, the SHF+ products also offer the ability to actively mute the output for measurements on even the most sensitive of qubits.

“The new SHFSG+, SHFQC+ and SHFQA+ are the result of collaborations across the globe to provide the highest quality control electronics to the very people who are making great improvements in qubit quality – gate fidelity, lifetime, coherence – day by day. And we seal it all with the Swiss cross for quality”, says Dr. Mark Kasperczyk, senior product manager at Zurich Instruments.

“Strong connections to research have allowed us to stay on the frontiers of science, as well as to scale our operations in a sustainable way. We thank our R&D teams for developing the SHF+ line, and to institutes such as ETH Zurich and many others for performing validations. This is a step towards more computational quantum power: better and longer quantum circuits, even for a few qubits, and the use of larger chips for more powerful QPUs. The story goes on – towards 4 9s and hundreds of qubits to accelerate the second quantum revolution”, concludes Dr. Sadik Hafizovic, the CEO of Zurich Instruments.

The SHFQC+, SHFSG+ and SHFQA+ will be launched at the meeting of the American Physical Society (APS), 4th – 8th of March, in Minneapolis, USA.

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Renesas Unveils Powerful Single-Chip RZ/V2H MPU for Next-Gen Robotics with Vision AI and Real-Time Control

Fri, 03/01/2024 - 11:24
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications. Offering the highest levels of performance within the family, the RZ/V2H enables both vision AI and real-time control capabilities.
The device comes with a new generation of Renesas proprietary AI accelerator, DRP (Dynamically Reconfigurable Processor)-AI3, delivering 10 TOPS/W power efficiency, an impressive 10-fold improvement over previous models. Additionally, pruning technology employed in the DRP-AI3 accelerator significantly improves AI computing efficiency, boosting AI inference performance up to 80 TOPS. This performance boost allows engineers to process vision AI applications directly at edge AI devices without relying on cloud computing platforms. The details of the new DRP-AI3 acceleration technology were recently presented at the International Solid-State Circuits Conference (ISSCC 2024) in San Francisco.
The RZ/V2H incorporates four Arm Cortex-A55 CPU cores with a maximum operating frequency of 1.8 GHz for Linux application processing, two Cortex-R8 cores running at 800 MHz for high-performance real-time processing, and one Cortex-M33 as a sub-core. By integrating these cores into a single chip, the device can effectively manage both vision AI and real-time control tasks, making it ideal for demanding robotics applications of the future. Since the RZ/V2H consumes less power, it eliminates the need for cooling fans and other heat-dissipating components. This means engineers can design systems that are smaller in size, less expensive, and more reliable.
“As a market leader in motor control microprocessors, Renesas is ready to take on the next challenge to drive the advancement of the robotics market with AI technology,” said Daryl Khoo, Vice President of the Embedded Processing 1st Business Division at Renesas. “The RZ/V2H will facilitate the development of next-generation autonomous robots with vision AI capabilities, that have the ability to think independently and control movements in real time.”
Renesas has applied its proprietary DRP technology to develop the OpenCV Accelerator that speeds up the processing of OpenCV, an open-source industry standard library for computer vision processing. The resulting speed improvement is up to 16 times faster compared to CPU processing. The combination of the DRP-AI3 and the OpenCV Accelerator enhances both AI computing and image processing algorithms, enabling the power-efficient, real-time execution of Visual SLAM(Note 1) used in applications such as robot vacuum cleaners.
To accelerate development, Renesas also released AI Applications, a library of pre-trained models for various use cases, and the AI SDK (Software Development Kit) for rapid development of AI applications. By running these software on the RZ/V2H’s evaluation board, engineers can evaluate AI applications easily and earlier in the design process, even if they do not have extensive knowledge of AI.
“We are thrilled to be part of the launch of the RZ/V2H, which combines AI technology with real-time control,” says Rolf Segger, founder of SEGGER Microcontroller GmbH. “SEGGER’s J-Link debug probe, widely adopted by numerous embedded development projects globally, will provide the support needed for the RZ/V2H, helping accelerate the development of next-generation robotic innovations. We look forward to this next phase in our multi-decade-long partnership with Renesas.”

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CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

Fri, 03/01/2024 - 07:45

CG Power and Industrial Solutions Limited, a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India. The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.

The JV brings together the unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystems in India. Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise. Stars Microelectronics, a Thai-based OSAT, will provide both technologies for legacy packages and training and enablement.

The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively. The JV plans to invest INR 7,600 crores over a five-year period, which will be financed through a mix of subsidies, equity, and potential bank borrowings as required.

The JV will set up a state-of-the-art manufacturing facility in Sanand, Gujarat, with a capacity that will ramp up to 15 million units per day. The JV will manufacture a wide range of products – ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, consumer, industrial, 5G, to name a few.

Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us. Our partners, Renesas and Stars Microelectronics will make our learning curves steeper and help us focus on innovation and excellence. 

This is a very exciting phase for the entire nation, and we are very keen to build out India’s semiconductor capability and ecosystem.”

Mr. Natarajan Srinivasan, Managing Director, CG Power and Industrial Solutions Limited, added, “It is a matter of great pride for CG to implement this project of National importance.”

Commenting on the partnership, Mr. Hidetoshi Shibata, CEO of Renesas said, “India is a critical part of Renesas’ business. We value its innovative landscape and robust potential growth and are committed to accelerating our investment in India. By partnering with the Murugappa Group and Stars Microelectronics, we will bolster India’s semiconductor ecosystem and address the growing semiconductor demand for the customers worldwide.”

Mr. Prompong Chaikul, Chairman of Executive Committee of Stars Microelectronics (Thailand) Public Co., Ltd added, “We are deeply honored to join forces in this thrilling venture. Leveraging our expertise and experience in OSAT, we are committed to providing robust support to ensure the success of this project in India.”

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Infineon introduces new Solid-State Isolators to deliver faster switching with up to 70 percent lower power dissipation

Thu, 02/29/2024 - 12:38

At the Applied Power Electronics Conference (APEC), Infineon Technologies introduced a new product family of Solid-State Isolators to achieve faster and more reliable circuit switching with protection features not available in optical-based solid-state relays (SSR). The isolators use coreless transformer technology and support 20 times greater energy transfer with both current and temperature protection contributing to a higher reliability and lower cost of ownership. The new solid-state isolators allow driving the gates of Infineon’s MOS-controlled power transistors OptiMOS and CoolMOS to reduce power dissipation of up to 70 per cent of today’s solid-state relays using SCR (silicon-controlled rectifier) and Triac switches.

Infineon’s solid-state isolators enable custom solid-state relays capable of controlling loads
more than 1000 V and 100 A. Improved performance and reliability make coreless transformer technology ideal for applications in advanced battery management, energy
storage, renewable energy systems, as well as industrial and building automation system
applications. With Infineon’s solid-state isolator drivers, engineers can further improve the
efficiency of electronic and electromechanical systems.

“Implementing coreless transformers in solid-state isolators and relays is truly a game
changer for power engineers; it provides 50 times lower RDS(on) than existing optically
controlled solutions. This enables their use in higher-voltage and higher-power
applications,” said Davide Giacomini, Marketing Director for the Green Industrial Power
Division at Infineon Technologies.

When matched with Infineon’s CoolMOS S7 switch, the isolator drivers enable switching
designs with a much lower resistance compared to optically driven solid-state solutions.
This translates to longer lifespans and lower cost of ownership in system designs. As with
all-solid-state isolators, the devices also offer superior performance compared to electromagnetic relays, including 40 per cent lower turn-on power and increased reliability
due to the elimination of moving parts.

The family of devices is designed to be compatible with Infineon’s broad switching portfolio
including Infineon’s CoolMOS S7, OptiMOSTM and linear FET portfolios.

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How Human Intelligence and Video Analytics Level up Security

Thu, 02/29/2024 - 10:51

Author: Anuj Rajain, CEO at Soteria

When you think of “security,” what comes to mind? Cameras? Bodyguards? Surveillance systems? In ensuring security, the initial requirement is surveillance systems. A fundamental surveillance system records videos and audio from a specific location. To enhance the proactive and effective nature of this security system, human intelligence is essential. Human intelligence is a central factor that accelerates the process of monitoring and detecting crimes. Human intelligence and video analytics complement each other, reaching their full potential only through their coexistence.

Anuj Rajain, CEO at Soteria

Consider a scenario where surveillance systems operate without the incorporation of human intelligence, a system designed solely to monitor a location, lacking the human element to determine whether a situation involves detecting a criminal act or not. Video analytics currently lacks the sophistication to discern whether an act captured on video is criminal, suspicious, or benign. Consider a home surveillance system, particularly one in the garage. The video analytics in place struggles to differentiate between a person simply walking by and someone with criminal intent, such as attempting to steal a car. Relying solely on AI in such situations may result in numerous false alarms, raising concerns about the trustworthiness and reliability of surveillance systems. To address this issue, an understanding of human emotions and the ability to differentiate between various actions are crucial. This emphasizes the necessity of incorporating human insight to navigate the limitations of current video analytics and ensure the accurate interpretation of events.

If we focus solely on the reliance on human intelligence for maintaining and overseeing security, it becomes evident that this approach alone is not feasible. The absence of security cameras or a surveillance system would result in a chaotic environment, providing an opportunity for more criminal acts to be committed. Human intelligence, while essential, cannot cover all angles and monitor every inch of space continuously. Security cameras and surveillance systems play a crucial role in providing a comprehensive and continuous watchful eye over a location. They act as force multipliers, extending the reach of human intelligence and enhancing the overall effectiveness of security measures. Without these technological tools, security efforts would face significant limitations, making it challenging to prevent and respond to criminal activities in a timely and efficient manner. Therefore, the integration of both human intelligence and advanced surveillance technologies is essential for creating a robust and comprehensive security infrastructure.

The landscape of security camera technology is continuously advancing, becoming not only more efficient but also more effective and cost-effective. The integration of innovative security technologies, coupled with human intelligence, introduces multiple layers of security for enhanced protection. Businesses that invest in surveillance cameras featuring remote monitoring capabilities stand to reap significant benefits. Beyond the traditional security aspect, such systems contribute to increased productivity and an enhanced customer experience. The constant evolution of security camera technology ensures that companies can stay ahead in safeguarding their assets, premises, and personnel. This investment not only strengthens security measures but also proves to be a strategic move, optimizing operational efficiency and positively impacting the overall profitability of the business.

To sum up, it’s crucial to have both human intelligence and advanced surveillance technology working together for strong security. Surveillance systems keep a constant watch, but human understanding is necessary for tricky situations. As security cameras get better, they become more efficient and cost-effective, giving businesses complete solutions. Using both these aspects not only protects assets but also makes operations smoother and improves customer experiences. In today’s changing security landscape, businesses need to integrate human intelligence and the latest surveillance tech to stay ahead and maintain a safe and successful environment.

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Machine Learning: A Simple Guide to the Future

Thu, 02/29/2024 - 08:09

In today’s rapidly evolving technological landscape, one term seems to be on everyone’s lips: machine learning. From improving search engine results to predicting customer behaviour, machine learning is transforming industries and reshaping the way we interact with technology. Let’s delve into what machine learning is, its history, types, workings, applications, examples, advantages, disadvantages, and the promising future it holds.

What is Machine Learning?

At its core, machine learning is a subset of artificial intelligence (AI) that enables computers to learn and improve from experience without being explicitly programmed. It’s like teaching a computer to recognize patterns and make decisions based on data, rather than relying on pre-defined rules.

Machine Learning History

The concept of machine learning dates back to the 1950s when pioneers like Arthur Samuel began experimenting with algorithms that could improve their performance over time. Since then, the field has seen exponential growth, fueled by advancements in computing power and the availability of vast amounts of data.

Types of Machine Learning

Machine learning can be broadly categorized into three types: supervised learning, unsupervised learning, and reinforcement learning. Supervised learning involves training a model on labeled data, unsupervised learning deals with unlabeled data to find hidden patterns, and reinforcement learning focuses on training models to make sequential decisions through trial and error.

How Does Machine Learning Work?

Machine learning algorithms work by analyzing data, identifying patterns, and making predictions or decisions based on those patterns. These algorithms learn from historical data to improve their performance over time, making them more accurate and effective.

Machine Learning Applications

Machine learning finds applications across various industries, including healthcare (diagnosis and treatment planning), finance (fraud detection and stock market analysis), marketing (customer segmentation and personalized recommendations), and many more.

Machine Learning Examples

Some prominent examples of machine learning in action include recommendation systems like those used by Netflix and Amazon, natural language processing applications like virtual assistants Siri and Alexa, image recognition technologies used in autonomous vehicles, and predictive analytics tools used in healthcare to forecast disease outbreaks.

Machine Learning Advantages

One of the main advantages of machine learning is its ability to process large amounts of data quickly and accurately, leading to more informed decision-making. It also has the potential to automate repetitive tasks, improve efficiency, and uncover insights that humans might overlook.

Machine Learning Disadvantages

However, machine learning is not without its limitations. One major challenge is the need for high-quality, labeled data for training models, which can be time-consuming and expensive to obtain. Additionally, there are concerns surrounding privacy, bias, and ethics, as machine learning algorithms can sometimes perpetuate or even amplify existing societal biases present in the data.

Future of Machine Learning

Despite its challenges, the future of machine learning looks incredibly promising. Advancements in areas like deep learning, reinforcement learning, and quantum computing are poised to take machine learning to new heights, enabling even more sophisticated applications across diverse domains.

In conclusion, machine learning represents a groundbreaking technology that is reshaping our world in profound ways. From revolutionizing industries to enhancing everyday experiences, its impact is undeniable. As we continue to push the boundaries of what is possible with machine learning, the opportunities for innovation and growth are limitless. So, let’s embrace this exciting journey into the future of intelligent machines and the endless possibilities they bring.

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Outlook on the Mass Adoption of XR

Thu, 02/29/2024 - 07:29

Author: Pankaj Raut, CEO and Co-founder at Ajna Lens

As we soar into a new era of technological advancement, the world finds itself on the cusp of a transformation with Extended Reality (XR).

Pankaj Raut CEO and Co-founder of Ajna Lens

Statistics paints a compelling picture: The global XR market is expected to reach a staggering $1,134.79 billion by 2030, with a phenomenal growth rate. While still nascent, XR holds the potential to reshape every aspect of Aerospace & Defence (A&D) from design and training to maintenance and operations.

For instance, try to imagine pilots undergoing hyper-realistic, multi-sensory flight simulations in virtual battlefields, honing their skills in controlled environments that replicate G-forces, turbulence and even enemy encounters. Ground crew wearing AR glasses remotely collaborating with specialists across continents, troubleshooting glitches in real-time with the aid of shared, interactive XR experiences.

Imagine dissecting a complex rocket engine, guided by interactive overlays highlighting potential issues before launch. Or picture yourself collaborating with colleagues across continents in a holographic workspace, designing the next-generation aircraft. Extended Reality (XR) is poised to revolutionise not just science fiction, but the very core of A&D.

From Blueprints to Holographic Workspaces

Gone are the days of clunky headsets and pixelated screens. Think of all the innovation waiting in the wings to completely enhance the design and prototyping. The aerospace industry thrives on innovation, but traditional physical prototyping can be expensive and time-consuming. XR offers a game-changer. Imagine engineers interacting with 3D models in real-time, manipulating them in virtual space, and identifying design flaws or optimising performance virtually before expensive physical prototypes are built. Studies by Deloitte show that XR design tools can reduce prototyping costs by up to 70%, leading to faster innovation cycles and a competitive edge.

Revolutionising Training with Immersive Simulations

Piloting a multi-million dollar aircraft or performing intricate maintenance tasks require meticulous training. Traditional methods often lack the nuance and realism needed to fully prepare personnel for real-world scenarios. XR creates immersive simulations that replicate real-world scenarios with unparalleled fidelity, incorporating factors like G-force, turbulence and even simulated enemy encounters.

A study by the Air Force Research Lab found that pilots trained with VR flight simulators showed a 40% reduction in training time and a 30% improvement in mission performance compared to traditional methods. This translates to safer missions, reduced costs and improved operational readiness.

Streamlining Maintenance with Augmented Guidance

Downtime due to equipment failure is costly and can compromise mission success. With XR, technicians can wear AR glasses, receive real-time instructions and overlay critical information onto physical equipment. This remote collaboration and augmented guidance enables faster, more accurate repairs. A study by Boeing found that using AR for maintenance tasks reduced overall repair time by 30% and improved first-time fix rates by 20%. This translates to minimising downtime, optimising resource allocation and improving operational efficiency.

Logistics Transformed with Enhanced Precision

On top of all this, the A&D industry’s complex supply chains demand precision and efficiency, where AR can transform logistics and operations, through real-time inventory tracking, visualised warehouse layouts, and efficient picking and packing processes. Imagine technicians wearing AR glasses, guided through warehouses with inventory locations highlighted and picking routes optimised. This translates to faster deliveries, reduced errors and optimised resource allocation.

Challenges on the Horizon

Despite the potential, challenges linger. Cost and accessibility of technology, privacy concerns and the need for robust cybersecurity measures are valid hurdles. Additionally, integrating XR seamlessly into existing workflows and infrastructure requires careful planning and collaboration. Addressing these challenges requires a collaborative effort from industry leaders, policymakers and technology developers.

Partnerships Fueling Innovation

The Indian government recognizes the transformative potential of XR and is actively fostering its adoption in A&D. Ergo, the government allocated ₹475 crore (US$64 million) for the iDEX program in the 2023-24 budget, highlighting its commitment to fostering innovation in defence. Initiatives like Innovations for Defence Excellence (iDEX) serve as collaborative platforms, bridging the gap between startups and defence forces.

This not only fast-tracks the infusion of innovative technologies into our nation’s defence capabilities but also empowers startups by offering financial backing, mentorship and resources. Additionally, the Make in India initiative promotes indigenous manufacturing, reducing external dependency and encouraging self-reliance. As of March 2023, the “Make in India” initiative has attracted foreign direct investment (FDI) worth ₹83,572 crore (US$111.9 billion) in the defence sector. Agile and innovative startups play a pivotal role in this journey, contributing to the development of cutting-edge defence technologies and products tailored to specific needs.

The Future is Immersive

The mass adoption of XR in A&D is not a question of “if,” but “when.” By embracing this transformative technology, we can ensure safer operations, more efficient training and accelerated innovation. The multiple collaborating initiatives with A&D professionals in the Indian government and the XR startups around the country hints towards the skies of the future – a future painted in the vivid colours of Extended Reality.

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Infineon introduces new Solid-State Isolators (iSSI) to deliver faster switching with up to 70 percent lower power dissipation

Wed, 02/28/2024 - 14:17

Today at the Applied Power Electronics Conference (APEC), Infineon Technologies AG introduced a new product family of Solid-State Isolators (iSSI) to achieve faster and
more reliable circuit switching with protection features not available in optical-based solid
state relays (SSR). iSSI use coreless transformer technology and support 20 times greater
energy transfer with both current and temperature protection contributing to a higher
reliability and lower cost of ownership. The new iSSI allow driving the gates of Infineon’s
MOS-controlled power transistors OptiMOSTM and CoolMOSTM to reduce power dissipation
of up to 70 percent of todays’ solid-state relays using SCR (silicon-controlled rectifier) and
Triac switches.

Infineon’s solid-state isolators enable custom solid-state relays capable of controlling loads
more than 1000 V and 100 A. Improved performance and reliability make coreless
transformer technology ideal for applications in advanced battery management, energy
storage, renewable energy systems, as well as industrial and building automation system
applications. With iSSI drivers, engineers can further improve the efficiency of electronic
and electromechanical systems.

“Implementing coreless transformers in solid-state isolators and relays is truly a game-
changer for power engineers; it provides 50 times lower RDS(on) than existing optically controlled solutions. This enables their use in higher-voltage and higher power applications,” said Davide Giacomini, Marketing Director for the Green Industrial Power
Division at Infineon Technologies.

When matched with Infineon’s CoolMOS S7 switch, the iSSI drivers enable switching
designs with a much lower resistance compared to optically driven solid-state solutions.
This translates to longer lifespans and lower cost of ownership in system designs. As with
all solid-state isolators, the devices also offer superior performance compared to
electromagnetic relays, including 40 percent lower turn-on power and increased reliability
due to elimination of moving parts.

The family of devices is designed to be compatible with Infineon’s broad switching portfolio
including Infineon’s CoolMOS S7, OptiMOSTM and linear FET portfolios.

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Rohde & Schwarz and Samsung pave the way for adoption of secure ranging test cases defined by the FiRa Consortium

Wed, 02/28/2024 - 13:54

Rohde & Schwarz and Samsung have collaborated to verify secure ranging test cases for the ultra-wideband (UWB) PHY layer and assess the secure receiver characteristics of devices based on FiRa specifications. There are new test cases specified in the FiRa 2.0 Technical Specifications, which covers the prevention of physical layer attacks on secure ranging applications based on UWB technology. These test cases were verified with the R&S CMP200 radio communication tester from Rohde & Schwarz on Samsung’s latest UWB chipset.

Having passed the FiRa® Consortium validation process, the R&S CMP200 radio communication tester is a certified tool for FiRa 2.0 PHY testing. With the successful verification of physical layer security test casesRohde & Schwarz and Samsung contribute to making standardized ultra-wideband (UWB) applications more resilient to malicious attacks.

UWB has unique capabilities for secure fine ranging, based on accurate Time of Flight (ToF) estimation and relative position determination. Therefore, UWB-enabled devices can accurately and securely measure the distance and direction of connected devices. These capabilities make UWB an ideal technology for a wide range of use cases, such as untracked indoor navigation, social distancing, hands-free access, asset tracking, ticket validation, mobile payment, and point-and-trigger applications. The PHY Secure Ranging test cases specified in the FiRa 2.0 Test Specifications have now been implemented by Rohde & Schwarz and verified using Samsung’s latest UWB Chipset, representing another step forward in achieving an interoperable UWB ecosystem across chipsets, devices, and services infrastructures.

Rohde & Schwarz integrated UWB test capabilities into the R&S CMP200 radio communication tester, making it the only test platform on the market capable of R&D and production RF tests for both 5G mmWave / FR2 and UWB functions. It is ideal for addressing UWB test challenges during mass production as well as R&D. The tester combines the capabilities of a signal analyzer and signal generator in a single instrument. In combination with Rohde & Schwarz shielded chambers and automatization software WMT, the R&S CMP200 offers a complete solution for transmitter, receiver, ToF and Angle of Arrival (AoA) measurements in conducted and radiated mode, compliant to IEEE 802.15.4a/z specifications.

Christoph Pointner, Senior Vice President for Mobile Radio Testers at Rohde & Schwarz, says, “We at Rohde & Schwarz are committed to creating a safer and connected world. For us, providing the means to ensure that a new wireless technology is resilient to malicious attacks is of the highest priority. That’s why we are very happy to have collaborated with Samsung for early verification of the FiRa PHY Security Parameter feature.”

Joonsuk Kim, Executive Vice President of the Connectivity Development Team at Samsung Electronics, said: “Drawing on our experience in developing IEEE 802.15.4a/z standard-based UWB solutions, we are excited to collaborate with Rohde & Schwarz in our joint commitment to creating a safer, more interconnected world. This partnership not only ensures industry compliance with FiRa Certification but also offers robust guidance on interoperability among UWB devices equipped with the latest secure ranging features. Leveraging our leadership in UWB technology, we remain dedicated to delivering valuable services and user experiences.”

Rohde & Schwarz will showcase the R&S CMP200 radio communication tester with integrated UWB test capabilities at Mobile World Congress 2024 in Barcelona in hall 5, booth 5A80. For further information about the UWB test solutions from Rohde & Schwarz, go to: https://www.rohde-schwarz.com/uwb

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Rohde & Schwarz receives GTI Award 2024 for its 5G RedCap test solution

Wed, 02/28/2024 - 11:49

Rohde & Schwarz received the Innovative Breakthrough in Mobile Technology Award at GTI Awards 2024 for its R&S CMX500 radio communication tester’s support of RedCap testing from early R&D to certification and conformance. The GTI Awards takes place during the Mobile World Congress and recognizes industry achievements and successes in 5G development across a wide range of market segments.

The GTI Award is granted by the Global TD-LTE Initiative (GTI), an organization of leading global operators that has successfully supported the commercialization of TD-LTE and 5G NR networks and services. The Innovative Breakthrough in Mobile Technology Award is given to technologies based on how they meet the needs of GTI operators, as well as their innovativeness, benefits, market potential, sustainability and impact. Rohde & Schwarz received this award for its R&S CMX500 one-box tester (OBT), a leading test solution that covers the entire 5G Reduced Capability (RedCap) lifecycle.

RedCap is a 5G technology defined in 3GPP Release 17. As a reduced-functionality version of 5G, it has a significantly lower cost compared to 5G eMBB. It is characterized by mid-range data throughput, low power consumption, low complexity and the ability to support a large number of devices. This makes it particularly attractive for IoT applications.

The R&S CMX500 OBT verifies the various RedCap aspects specified in 3GPP 5G Rel.17 for R&D, certification and conformance testing. It covers network access restrictions, bandwidth parts (BWP) and bandwidth part switching, power saving and other protocol signalling procedures. The platform has also been enhanced to verify the proper operation of RedCap terminal devices in legacy networks.

Christoph Pointner, Senior Vice President of Mobile Network Testers at Rohde & Schwarz, who accepted the award during the ceremony on February 27, 2024, at MWC Barcelona, said: “We are honoured to receive the prestigious GTI Award for our R&S CMX500 one-box signalling tester for its comprehensive support of 5G RedCap technology. This recognition is a testament to our striving commitment to push the boundaries of mobile communications testing to meet the diverse needs of network operators and device manufacturers, paving the way for new technologies.”

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Infineon reorganizes sales and marketing to boost customer centricity and lead in application support

Wed, 02/28/2024 - 11:45

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is setting the course for ambitious growth by further strengthening and streamlining its sales organization. Starting 1 March, Infineon’s sales team will be structured around three customer-centric Sales Segments: Automotive, Industrial & Infrastructure and Consumer, and Computing & Communication. The DEM sales organization will retain responsibility for distributors and Electronics Manufacturing Services (EMS). This new structure will further leverage the potential of Infineon’s comprehensive and diverse product portfolio by putting customers’ application needs at the center of the new organizational model. All of these organizations will be deployed globally with an optimized regional footprint.

“Customers’ expectations are quickly evolving and are driven by speed of innovation and faster time-to-market,” says Andreas Urschitz, Chief Marketing Officer of Infineon. “With a streamlined customer interface which brings the relevant products and application expertise to the customers’ doorstep, Infineon is ideally positioned to enable customers’ success.”

This simpler approach will give customers easier access to Infineon’s full portfolio and match their specific needs by offering complementary products from different divisions. In addition, this reorganization will reduce the number of interfaces for Infineon’s customers and help drive down time-to-market for their R&D projects enabled by Infineon semiconductors and solutions.

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Bright Ideas: Understanding Filament Bulbs

Wed, 02/28/2024 - 11:41

In the realm of lighting, one of the most iconic and enduring symbols is the filament bulb. While newer technologies have emerged, the filament bulb continues to hold a special place in our hearts and homes. In this blog, we delve into the world of filament bulbs, exploring what they are, how they work, their uses, and their advantages.

What is a Filament Bulb?

A filament bulb, also known as an incandescent bulb, is a type of light bulb that produces light by heating a thin tungsten wire filament to a high temperature until it glows. The filament is housed within a glass bulb filled with inert gas to prevent the filament from oxidizing and burning out too quickly.

How Does a Filament Bulb Work?

The principle behind the operation of a filament bulb is simple yet elegant. When an electric current passes through the filament, it encounters resistance, which causes the filament to heat up. As the temperature rises, the filament emits light in the visible spectrum, illuminating its surroundings.

Filament Bulb Uses

Filament bulbs have been a staple in lighting applications for over a century. While their popularity has waned with the advent of more energy-efficient alternatives, filament bulbs still find use in various settings, including:

  1. Decorative Lighting: Filament bulbs are prized for their warm, inviting glow, making them a popular choice for decorative lighting in homes, restaurants, and cafes.
  2. Vintage Aesthetics: With their classic design and nostalgic appeal, filament bulbs are often used in vintage-inspired interiors, adding a touch of old-world charm.
  3. Display Lighting: Filament bulbs are ideal for highlighting merchandise in retail displays, creating an attractive ambience that draws customers’ attention.
  4. Special Events: From weddings to outdoor parties, filament bulbs are a popular choice for creating a festive atmosphere, casting a warm and inviting glow over gatherings.

Filament Bulb Advantages

While filament bulbs may not be as energy-efficient as their LED counterparts, they still offer several advantages that make them a preferred choice in certain scenarios:

  1. Warmth and Ambiance: Filament bulbs emit a warm, soft light that closely resembles natural sunlight, creating a cozy and inviting atmosphere wherever they are used.
  2. Instant On: Unlike some energy-saving bulbs that require time to reach full brightness, filament bulbs provide instant illumination, making them ideal for areas where immediate light is needed.
  3. Dimmable: Many filament bulbs are dimmable, allowing users to adjust the brightness to suit their preferences and set the mood for different occasions.
  4. Affordability: Filament bulbs are often more affordable than LED bulbs, making them a cost-effective lighting solution for those on a budget.
  5. Compatibility: Filament bulbs are compatible with most standard fixtures, making them an easy and convenient replacement for traditional incandescent bulbs.

In Conclusion

While filament bulbs may no longer be the go-to choice for energy-conscious consumers, their timeless appeal and unique characteristics continue to make them a popular lighting option in many settings. Whether used for decorative purposes, vintage aesthetics, or special events, filament bulbs shine bright as a symbol of illumination’s enduring legacy.

 

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Integrated Motor Drivers For Efficient Real-Time Embedded Motor Control

Wed, 02/28/2024 - 11:19

Microchip Technology Inc. launches a new family of integrated motor drivers, leveraging its dsPIC Digital Signal Controllers (DSC). This innovative solution integrates a dsPIC33 DSC, a three-phase MOSFET gate driver, and an optional LIN or CAN FD transceiver into a single package. It provides a comprehensive solution for efficient, real-time embedded motor control in space-constrained applications.

This integration reduces the components needed for motor control system designs, leading to smaller PCB sizes and simplified design complexity. Particularly beneficial for automotive, consumer, and industrial applications where high performance and compact form factors are crucial.

Key Features Include:

  • Single power supply operation up to 29V (operation) and 40V (transient).
  • Internal 3.3V low dropout (LDO) voltage regulator for the dsPIC DSC.
  • Operating frequencies between 70—100 MHz, enabling high CPU performance for advanced motor control algorithms like field-oriented control (FOC).

Microchip supports the development and deployment of these integrated motor drivers with a comprehensive ecosystem of software and hardware tools. This includes development boards, reference designs, application notes, and the motorBench Development Suite V2.45, a free GUI-based software tool for FOC. Additionally, the dsPIC33CK Motor Control Starter Kit (MCSK) and the MCLV-48V-300W development board offer rapid prototyping solutions with flexible control options for various motor control applications.

Joe Thomsen, Vice President of Microchip’s Digital Signal Controllers Business Unit, highlighted the advantages of the new integrated motor drivers, stating, “By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space, meeting the evolving demands for higher performance and reduced footprints in various designs.”

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Infineon unveils high-density power modules to enable benchmark performance and TCO for AI data centers

Wed, 02/28/2024 - 09:15

Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing the energy demands of the chips supporting this data growth. Today, Infineon Technologies AG launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total cost of ownership (TCO) for AI data centres. The TDM2254xD series products blend innovation in robust OptiMOSTM MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centres operate at a higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing TCO. 

Given that AI servers require 3 times more energy than traditional servers and data centres already consume more than 2 per cent of the global energy supply, it is essential to find innovative power solutions and architecture designs that further drive decarbonization. Paving the way for the green AI factory, Infineon’s TDM2254xD dual-phase power modules combine with XDPTM Controller technology to enable efficient voltage regulation for high-performance computing platforms with superior electrical, thermal and mechanical operation.

Infineon introduced the TDM2254xD series at the Applied Power Electronics Conference (APEC). The modules’ unique design allows for efficient heat transfer from the power stage onto the heat sink through a novel inductor design that is optimized to transfer current and heat, thereby allowing for a 2 per cent higher efficiency than industry average modules at full load. Improving power efficiency at the core of a GPU yields significant energy savings at scale. This translates into megawatts saved for data centres computing generative AI and in turn leads to reduced CO2 emissions and millions of dollars in operating cost savings over the system’s lifetime. 

“This unique Product-to-System solution combined with our cutting-edge manufacturing lets Infineon deliver solutions with differentiated performance and quality at scale, thereby significantly reducing total cost of ownership for our customers,” said Athar Zaidi, Senior Vice President of Power & Sensor Systems at Infineon Technologies. “We are excited to bring this solution to market; it will accelerate computing performance and will further drive our mission of digitalization and decarbonization.”

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Saelig Company Unveils PicoScope 6428E-D – A Game-Changing High-Speed Oscilloscope

Tue, 02/27/2024 - 13:59

In a groundbreaking announcement, Saelig Company introduced the PicoScope 6428E-D, a cutting-edge four-channel high-speed oscilloscope. This innovative addition to Pico Technology’s renowned PicoScope 6000E Series boasts an impressive bandwidth of up to 3GHz and a remarkable maximum vertical resolution of 12 bits into 50ohm inputs. Featuring an unprecedented real-time sampling rate of 10GSa/s, the PicoScope 6428E-D sets a new standard for precision and performance in waveform analysis.

One of its standout features is its ability to accommodate larger than ±500mV input signals with external attenuators or probes specifically designed for 50ohm inputs. The device’s 4GSa buffer can hold up to two 200ms captures at the maximum sampling rate, facilitating the recording of multiple instances of complex signals under varying conditions. This capability is instrumental in quickly capturing high-frequency signals with unparalleled precision for detailed signal analysis. Moreover, the PicoScope 6428E-D can display single-shot pulses with an impressive 100ps time resolution, enabling users to uncover critical signal integrity issues such as timing errors, glitches, dropouts, crosstalk, and metastability issues.

Key Features:

  • 4 channels with four input ranges per channel (±50mV, ±100mV, ±200mV, ±500mV)
  • Up to 3GHz bandwidth
  • 100ps time resolution
  • 4GSa capture memory
  • Up to 10 GSa/s real-time sampling
  • 8-, 10-, or 12-bit flexible resolution (FlexRes)
  • Segmented memory/rapid block trigger
  • Built-in 50MHz 14-bit function generator/AWG
  • Fast transfer of captured data via USB 3.0 SuperSpeed connection
  • PicoScope software included, with drivers and SDK (Windows, Linux, Mac)
  • Programming examples for LabView, MATLAB, Python, and C++

Applications:

  • High-energy physics
  • Particle accelerators
  • LIDAR (light detection and ranging)
  • VISAR (velocity-interferometer system for any reflector)
  • Spectroscopy
  • Medical imaging
  • Semiconductor/Production test
  • Non-destructive testing

Designed for scientists, engineers, and researchers involved in high-speed applications, the PicoScope 6428E-D caters to the need for capturing, measuring, and analyzing sub-nanosecond waveform events. Whether used as a standalone instrument or integrated into a larger system, this oscilloscope offers unparalleled performance at a competitive cost. Unlike traditional benchtop mixed-signal oscilloscopes, which occupy significant bench space and are often financially out of reach for many engineers, the 6428E-D provides a cost-effective solution without compromising on quality. Additionally, users benefit from free software upgrades as new features become available.

Manufactured by Pico Technology, Europe’s award-winning test and measurement manufacturer, the PicoScope 6428E-D is now available through Saelig Company, Inc., their USA technical distributor.

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Microchip Launches New dsPIC DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device

Tue, 02/27/2024 - 10:45

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

To implement efficient, real-time embedded motor control systems in space-constrained applications, Microchip Technology has launched a new family of dsPIC Digital Signal Controller (DSC)-based integrated motor drivers. These devices incorporate a dsPIC33 digital signal controller (DSC), a three-phase MOSFET gate driver and an optional LIN or CAN FD transceiver into one package. A significant benefit of this integration is reduction in component count of the motor control system design, smaller printed circuit board (PCB) dimensions and reduced complexity. The devices are supported by development boards, reference designs, application notes and Microchip’s field-oriented control (FOC) software development suite, motorBench Development Suite V2.45.

“Automotive, consumer and industrial designs are evolving and require higher performance and reduced footprints. These expectations often come at a higher expense and increase in dimensional size,” said Joe Thomsen, vice president of Microchip’s digital signal controllers business unit. “By integrating multiple device functions into one chip, the dsPIC DSC-based integrated motor drivers can reduce system-level costs and board space.”

The integrated motor driver devices can be powered by a single power supply up to 29V (operation) and 40V (transient). An internal 3.3V low dropout (LDO) voltage regulator powers the dsPIC DSC, which eliminates the need for an external LDO to power the device. Operating between 70—100 MHz, the dsPIC DSC-based integrated motor drivers provide high CPU performance and can support efficient deployment of FOC and other advanced motor control algorithms.

Development Tools

An extensive ecosystem of motor control software and hardware development tools helps make the design process faster and easier, reducing the customer’s time to market.

The dsPIC33CK Motor Control Starter Kit (MCSK) and the MCLV-48V-300W are two new dsPIC33-based integrated motor driver development boards that provide rapid prototyping solutions with flexible control options. The MCSK includes a dsPIC33CK low-voltage motor control development board, a 24V three-phase BLDC motor, an AC/DC adapter, a USB cable and other accessories. This cost-effective kit supports fast prototyping of motor control applications that operate between 12 and 48 VDC with up to 10 Amps of continuous current. The MCLV-48V-300W development board enables fast prototyping of three-phase permanent magnet synchronous motors that are rated between 12 and 48 VDC and capable of delivering up to 25A RMS continuous current per phase. This inverter board introduces a new modular concept where a separate dual-in-line module (DIM) is inserted into the board to configure it for a particular dsPIC DSC or MCU.

The motorBench Development Suite is a free GUI-based software development tool for FOC that accurately measures critical motor parameters, automatically tunes feedback control gains and generates source code by utilizing the motor control application framework (MCAF). The latest version, v2.45, includes a powerful new feature called zero-speed/maximum torque (ZS/MT), which enables designers to eliminate Hall or magnetic sensors while maximizing the torque output from the motor, from start-up and at low speeds. This feature can be used in pumps, power tools, e-Mobility and many other applications.

MPLAB Discover now contains many dsPIC DSC-based MATLAB Simulink models supporting various motor control algorithms and development boards. Microchip also provides free device blocks for Simulink that can be used to generate optimized code from models for dsPIC DSCs and other Microchip MCUs.

The growing number of dsPIC DSC-based motor control reference designs now includes an automotive cooling fan, low-voltage ceiling fan and a drone propeller controller. These reference designs shorten the time to market by providing a production-ready solution for various motor control applications. Typically, the board design files include schematics and a BOM, a board user’s guide and motor control source code that are available for download.

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