ELE Times

At iba 2023, NORD DRIVESYSTEMS will present its large range of innovative drives from October 22 to 26, 2023 at the Fairground Munich. The presentation in Hall B3, Stand 490, will focus in particular on NORD solutions for hygienically sensitive applications in the baking and confectionery industry.

NORD-surface-treatment-nsd-tupH.jpg: The nsd tupH surface treatment offered by NORD is a powerful corrosion protection for gear units, smooth-surface motors, frequency inverters and motor starters in wash- down-optimised cast aluminium housings. 

The food industry places great demands on reliable, efficient and easy-to-clean drive solutions. NORD DRIVESYSTEMS offers a wide range of solutions for this area that help to reliably realise hygienically sensitive applications.

Alternative to stainless steel: nsd tupH surface treatment

The nsd tupH process developed by NORD DRIVESYSTEMS makes drive surfaces very corrosion-resistant, similar to stainless steel This is not a coating, but a treatment based on an electrolytic process that creates a protective layer that is permanently bonded to the substrate material. So nothing can detach or flake off.

Drives with the nsd tupH surface treatment are largely resistant to acids and alkalis and can be cleaned reliably and hygienically. The efficient surface treatment is thus perfect for use in hygienically critical areas in the food, beverage, packaging, pharmaceutical or chemical industry. It is also the optimum solution for applications in extremely humid environments, for example in maritime and coastal areas.

Fanless or smooth IE5+ synchronous motors

The new IE5+ motor generation was designed by NORD DRIVESYSTEMS with a special focus on its use in the food or beverage industry as well as the intralogistics sector. The IE5+ generation is available in both fanless and smooth versions up to a power of 4.0 kW with a continuous torque from 1.6 to 18.2 Nm and speeds from 0 to 2,100 min-1. The smooth-surface, hygienic design of the fanless variant is particularly efficient, easy to clean, corrosion-resistant and wash-down capable. It is therefore ideal for reliable use in hygienically sensitive environments. If desired, nsd tupH surface treatment and the protection class IP69K are available. The outstanding feature of the particularly compact and energy-efficient synchronous motors is their constant high efficiency – up to 95% over a wide torque range. As a result, they also offer optimum energy consumption performance in partial load and speed ranges.

NORD-SAFOMI-IEC.jpg: SAFOMI-IEC adapter for MAXXDRIVE® industrial gear units from NORD
DRIVESYSTEMS combined with a drive motor: less components, increased operational reliability SAFOMI-IEC adapter for agitators

The SAFOMI-IEC adapter (SAFOMI = Sealless Adapter For Mixers) from NORD DRIVESYSTEMS, which was specially developed for mixers and agitators has an integrated oil expansion chamber and thus provides the MAXXDRIVE® industrial gear units with decisive advantages such as increased reliability and reduced maintenance. Compact and simple in design, the adapter has an integrated oil expansion volume. Oil tanks and hoses as well as the radial shaft seal that is subject to leakage and wear between gear unit and IEC cylinder are not required. SAFOMI is available for MAXXDRIVE® parallel gear units and in sizes 7 to 11, i.e. for maximum output torques from 25 to 75 kNm. The compact combination of the MAXXDRIVE® industrial gear unit, SAFOMI-IEC adapter and a drive motor is an optimal choice for mixer and agitator applications in order to reduce wearing and attached components.

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Global resources are becoming increasingly scarce and responsible use of them is crucial to counteracting climate change. With over 57.4 million tons of electronic waste produced annually (2021) at a net worth of nearly $60 billion, e-waste constitutes one of the largest waste streams. Keeping resources circulating in the value chain for as long as possible is one way to tackle this challenge. A circular economy helps extend the lifecycle of products, saving resources and energy. Providing reliable spare parts for electronic devices plays a major role in this concept. Authentication solutions like the Infineon Technologies AG’s (FSE: IFX / OTCQX: IFNNY) OPTIGA Authenticate product family support the verification of spare parts as well as original products and contribute to a trustworthy, sustainable economic approach.

A circular approach to electronic products is defined by what is called the 6R concept: Reduce, reliability, repair, reuse, refurbish and recycle.

To Infineon, circular economy is relevant on different levels: These principles not only guide the company’s waste management for instance by reusing solvents in the manufacturing process. Infineon’s product design also aims to reduce resource consumption and hazardous waste and replace critical substances. On the other hand, Infineon delivers products to customers that help them innovate and create more sustainable solutions to the market based on the principles of circularity.

Sustainable and reliable – thanks to OPTIGA Authenticate security solutions

The Right to Repair regulation, for example, is not only under the umbrella of the European Green Deal, but also part of national sustainability programs worldwide. Infineon security solutions such as the OPTIGA Authenticate family support manufacturing companies in efficiently and purposefully addressing some of the key challenges of these new regulations and in reducing their environmental footprint.

The goal of the EU’s Right to Repair, Battery and Ecodesign initiatives is to save resources and increase energy efficiency of products. With regards to the Right to Repair this means that consumers not only have a right to the availability of spare parts. It should also be kept in mind that in many cases non-professionals have to be able to repair the product. Manufacturers therefore face the challenge of meeting their warranty claims, but also providing spare parts, while at the same time protecting the quality of their brand and their intellectual property as well as protecting the safety of end users.

“The OPTIGA Authenticate product family allows authentication of devices, the verification of spare parts and of the genuineness of original products. This enables product safety for end users and helps manufacturing companies meet quality and performance standards for electronic devices”, explains Josef Haid, Distinguished Engineer Security System Architectures Infineon Technologies. “Authenticators also create more security and transparency for consumers, since they can trust the authenticity and quality of devices and spare parts. Moreover, due to the increased demand for spare parts, it opens up a new market for the industry, covers potential warranty claims, and prevents counterfeiting at the same time.”

Authentication solutions protecting consumers and products

The OPTIGA Authenticate product family can be used in a wide range of replaceable components for example within a smartphone ecosystem. In a smartphone, elements such as batteries, displays and camera modules as well as power adapters, wireless chargers, and headphones (see graphic) can be equipped with authenticators. In addition, OPTIGA Authenticate security solutions can be used in other electronic devices such as power tools, notebooks, light electric vehicles, multicopters, VR/AR applications and many more. The mechanism is very simple: The OPTIGA Authenticate S security chip is integrated in a product, for example, the battery (client) of an e-scooter (host). This allows the host and client to communicate with one another and authenticate themselves, letting the host verify that the battery is original or that it conforms to certain standards. The authentication process itself is managed by the exchange of certificates, keys, and cryptographic tasks.

Authentication solutions such as the OPTIGA Authenticate product family are an easy and cost-efficient way for manufacturers to help meet legal requirements and protect their brand value from potential counterfeits. With the OPTIGA Authenticate product family, Infineon takes another step towards a circular economy, making it possible for its customers to build more sustainable solutions.

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Infineon Technologies AG has taken over as head and coordinator of the broad-scope European research project EECONE (European ECOsystem for greeN Electronics), intended to make electronics in Europe more sustainable. The objective is to investigate the corresponding technologies along the entire value chain, from design, manufacture and use all the way to recycling. EECONE is one of the Key Digital Technologies research projects supported by the European Union as a Joint Undertaking. 49 partners are participating in the project, which has a volume of approximately 35 million euros total costs. The project is being funded by the European Union and the national governments of the participating companies with around 20 million euros.

“Electronics are fundamental to improving the sustainability of many applications.
But this is not sufficient, electronics themselves have to become greener,” says
Constanze Hufenbecher, Infineon Management Board member and Chief Digital
Transformation Officer. “Infineon is pleased to take on the lead role in the research
project EECONE in order to advance the circular economy together with our
partners along the value chain. The only way to achieve sustainability from design
and use and all the way to recycling is by working together.”

EECONE is aligned with the 6R concept (Reduce, Reliability, Repair, Reuse, Refurbish, Recycle); the amount of materials required by electronics is to be reduced, electronics are to be made more reliable, easier to fix and use again, and easier to recondition and to recycle. The project will investigate a total of ten application examples from the widest possible variety of fields in terms of developing green electronics. The applications are from the areas Automotive, Consumer Electronics, Health, Information and Communication Technologies, Aviation and Agriculture. Focus points are for example reducing the amount of material used by making circuit boards thinner or smaller, or improving sustainability by introducing materials which are easier to separate during recycling. Facilitating the replacement of not only circuit boards but also of semiconductors is to make it easier to repair devices. The technologies involved could also make it possible to reuse and recycle electronic components. The project will in addition develop technologies which for example generate and store their own power in IoT devices. New, ecologically friendly materials are to make it easier to recycle lithium-ion batteries. Artificial Intelligence will be used to prolong the service lives of electronic equipment, while tools for more sustainable electronic design, including comprehensive impact assessments for the use of electronics, are to be developed as well. EECONE also covers the use, dissemination and standardization of electronics and will train specialists in handling electronic refuse.

The EECONE research project has a planned duration of three years. It will establish decisive foundations for the sustainable development, manufacturing and use of electronics in Europe. The on-site inaugural event of the project will be held in Toulouse on 20 and 21 September 2023.

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New developer software for STM32H5 leverages ST’s Secure Manager to simplify safe connectivity to AWS IoT devices platform

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has added new software to its STM32Cube development tools that simplify connecting high-performing Internet of Things (IoT) devices to the AWS cloud.

ST has released the X-CUBE-AWS-H5 expansion package which enables a seamless and secure connection to the AWS cloud. It contains a set of libraries and application examples designed for high-performance microcontrollers of the STM32H5 series, which act as end devices.

The solution is built on the FreeRTOS open-source real-time operating system and ST’s Secure Manager embedded security software. The recently announced STM32H5 Discovery kit is available to use with this solution and lets developers easily and securely connect their STM32H5-based prototypes to AWS IoT Core.

 “The STM32H5 is ready for the next generation of IoT edge devices, bringing the performance to handle complex applications within a tight energy budget,” said Daniel Colonna, STM32 Marketing Director, STMicroelectronics. “The STM32Cube ecosystem helps developers unleash its powerful capabilities, accelerate development, and, with our latest software, connect securely to the powerful storage and data analytics services in the AWS cloud.”

STM32H5 is one of the most powerful Arm® Cortex®-M33 MCU series. Devices are programmed with their own immutable identity at the ST factory. Combined with ST’s Secure Manager, this simplifies registering smart devices to the AWS cloud and removes the need for costly infrastructure otherwise necessary to keep the identities of IoT objects secret during their production. 

Remote provisioning and administration of credentials will also be available via third-party service providers, during the production of devices and in the field.

The isolation properties provided by Secure Manager enable the intellectual property of multiple owners to be protected. This is also known as multitenant IP protection. It is part of a comprehensive set of services that protect the confidentiality and integrity of assets belonging to STM32 developers and partners, through development, manufacturing, and in the field.

This is a perfect fit for edge AI use cases, where models are running on the edge, on devices, protected by the Secure Manager, and further trained and securely updated via the cloud. The STM32Trust TEE Secure Manager makes stronger security simpler.

Overall, the STM32Cube ecosystem with STM32H5 microcontrollers provides developers with a powerful and secure platform for developing IoT applications that comply with future regulations and standards. STM32H5, introduced in March 2023, is the first to support Secure Manager and targets PSA Certified level 3 and SESIP3 certifications.

X-CUBE-AWS-H5 is ready to download now.

For more information, please go to www.st.com/x-cube-aws-h5.

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Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is stocking the latest innovations from Nexperia, a leading global high-volume manufacturer and supplier of discretes, logic and MOSFET devices. A winner of Nexperia’s “2022 E-Tailer of The Year” award, Mouser continues to expand its customers’ product development process by offering more than 13,000 parts from Nexperia.

Nexperia’s extensive portfolio, available from Mouser, includes diodes, bipolar transistors, electrostatic discharge (ESD) protection devices, MOSFETs, GaN FETs and analog and logic ICs that meet stringent automotive industry standards. These products are recognized as benchmarks in efficiency, process, size, power and performance, with industry-leading energy and space-saving packages.

Some of the newest Nexperia products available from Mouser include the Nexperia NEH2000BYJ energy harvesting power management integrated circuit (PMIC). This high-performance energy harvesting solution for low-power applications collects energy generated by ambient sources, such as light, to charge storage elements such as rechargeable batteries or hybrid supercapacitors– thereby eliminating the need for battery swaps. Nexperia’s Maximum Power Point Tracking (MPPT) uses an embedded hill-climbing algorithm to deliver maximum power to the load, independent of specific characteristics of the harvesters. The NEH2000BY does not require any inductor to function, allowing for a reduced BOM cost and a simpler system design for product designers. The companion NEVB-NEH2000BY evaluation boards allow convenient evaluation of the NEH2000BY energy harvesting PMIC. The boards offer a small form factor for easy integration into prototype applications.

The Nexperia NBM5100A/B and NBM7100A/B battery life booster ICs are designed to remove the limitations associated with coin cell batteries to enhance performance. Nexperia Battery Management ICs extend the life of a typical non-rechargeable lithium coin cell battery by up to 10x compared to competing solutions while also increasing its peak output current capability by up to 25x. The NBM5100A and NBM7100A offer support for I2C interfaces, and the NBM5100B and NBM7100B provide support for SPI interfaces, allowing for design flexibility.

The Nexperia NBM5100A/B and NBM7100A/B battery life booster ICs are designed to remove the limitations associated with coin cell batteries to enhance performance. Nexperia Battery Management ICs extend the life of a typical non-rechargeable lithium coin cell battery by up to 10x compared to competing solutions while also increasing its peak output current capability by up to 25x. The NBM5100A and NBM7100A offer support for I2C interfaces, and the NBM5100B and NBM7100B provide support for SPI interfaces, allowing for design flexibility.

Nexperia eMode GaN FETs offer voltage ranges of 100V to 650V with superior switching performance. These FETs deliver fast transition and switching capability and excellent power efficiency with low QC and QOSS values. Nexperia Low Voltage (< 200V) eMode GaN FETs provide optimum flexibility in power systems, enabling faster charging for e-mobility and wired / wireless changing systems, as well as significant space and BOM savings in LiDAR and low noise in Class D audio amplifiers.

As a global authorized distributor, Mouser offers the widest selection of the newest semiconductors, electronic components and industrial automation products. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive. Learn about emerging technologies, product trends and more by signing up today at https://sub.info.mouser.com/subscriber.

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Compact, powerful, and densely populated, the BOXER-8651AI illustrates a design breakthrough for AAEON.

Industry-leading designer and manufacturer of edge AI solutions, AAEON, has released the BOXER-8651AI, a compact fanless embedded AI System powered by the NVIDIA Jetson Orin NX module. Consequently, the BOXER-8651AI takes advantage of the module’s NVIDIA Ampere architecture GPU, featuring 1024 CUDA and 32 Tensor Cores, along with support for NVIDIA JetPack 5.0 and above to provide users with accelerated graphics, data processing, and image classification.

With a fanless chassis measuring just 105mm x 90mm x 52mm, the BOXER-8651AI is an extremely small solution that houses a dense range of interfaces, including DB-9 and DB-15 ports for RS-232 (Rx/Tx/CTS/RTS)/RS-485, CANBus, and DIO functions. Additionally, the device provides HDMI 2.1 display output, GbE LAN, and a variety of USB Type-A ports, supporting both USB 3.2 Gen 2 and USB 2.0 functionality.

The BOXER-8651AI, despite containing such powerful AI performance for its size, is built to operate in rugged conditions, boasting a -5°F to 131°F (-15°C to 55°C) temperature range alongside anti-shock and vibration resistance features. Consequently, the PC is ideally suited for wall mounted deployment across a range of environments.

For storage, the system offers an M.2 3052 B-Key slot to accommodate M.2 2242 B+M Key SSDs and an M.2 2230 E-Key slot, ensuring users can take full advantage of the NVIDIA JetPack 5.0 software stack. Alternatively, these expansion options provide support for add-on modules to facilitate wireless communication, such as 5G, Wi-Fi, and Bluetooth.

The BOXER-8651AI is now available for order via both the AAEON eShop and its standard sales channels.

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Simplifying Designs and Saving Space in Consumer, Industrial, and Networking Applications, Industrial-Grade Devices Feature TLC NAND Flash Technology for Increased Reliability

Alliance Memory introduced new 32GB, 64GB, and 128GB industrial-grade embedded multi-media card (eMMC) solutions. For solid-state storage in consumer, industrial, and networking applications, the ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN integrate high-reliability TLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a single 11.5 mm by 13 mm 153-ball FBGA package.

The devices released today are compliant with the JEDEC eMMC v5.1 industry standard, supporting features such as boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features for faster and more reliable operation, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes. The ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN are also backwards-compatible with eMMC v4.5 and v5.0.

The eMMCs will be used in products such as smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, CCTV, infotainment, surveillance, automation, point-of-sale systems, and emerging embedded applications. For designers, the ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN simplify designs for fast and easy system integration in these products, speeding up product development and time to market while saving space by eliminating the need for an external controller. In addition, the device’s FTL software provides high reliability and stable performance with wear levelling and bad block management.

“With our latest eMMCs, we’ve extended our offering to include densities from 4GB all the way up to 128GB, providing designers with a wide range of options to meet their mass storage needs and solidifying our position as a leading supplier of eMMC technology,” said David Bagby, president and CEO, Alliance Memory. “Furthermore, with their TLC NAND flash technology, our new 32GB, 64GB, and 128GB solutions deliver even higher reliability, endurance, and performance, while maintaining the same ease of integration as our lower density devices.”

The ASFC32G31T3-51BIN, ASFC64G31T5-51BIN, and ASFC128G32T5-51BIN operate over an industrial temperature range of -40°C to +85°C and offer programmable bus widths of x1, x4, and x8. The device’s NAND memory with internal LDO can be powered with a single 3V supply voltage, while the controller can be powered by 1.8V or 3V dual supply voltages.

Samples of the eMMCs are available now. Production quantities are available with lead times of eight to 10 weeks.

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CloudSure provides continuous, proactive validation to harness cloud-native efficiencies and ensure reliable operations

Spirent Communications plc, the leading provider of test and assurance solutions for next-generation devices and networks, today announced availability of the industry’s first fully cloud-native solution to help communication service providers (CSPs) and cloud-native network function (CNF) vendors ensure resilient 5G services. An automated test platform, Spirent CloudSure evaluates and validates CNF resiliency within 5G networks with comprehensive testing capabilities to help ensure reliable service delivery, while reducing operational costs, and optimizing customer experience.

“Cloud-native environments represent a revolutionary new technical approach that breaks a handful of highly reliable, vertically integrated 5G functions into thousands of individual software components that run on a cloud optimized for performance and cost, but not reliability,” said Glenn Chagnot, Senior Director of Product Management for Cloud Solutions at Spirent. “Cloud-native marginalizes traditional testing and visibility approaches, demanding completely new processes and tooling to realize the potential benefits. CloudSure provides proactive, pre-deployment validation to test 5G services with real-world traffic operating on an imperfect cloud to ensure services are resilient and always available in operations.”

CloudSure has been engineered to help network operators deliver robust and resilient 5G services to end users in the complex, highly dynamic, cloud-native world. It enables:

• Reliable service delivery: Confirms 5G cloud-native network functions operate reliably under the most challenging cloud conditions for uninterrupted service delivery and long-term revenue growth.
• Reduced operational costs: Optimizes resource utilization and validates complex fault recovery mechanisms to avoid costly outages, 5G service interruptions and reduce operating expenses.
• Enhanced customer experience: Ensures resilient 5G service design, configuration, and performance to deliver high-quality user experiences to improve customer satisfaction and retention.
• Competitive advantage: Enables reliable, high-performing 5G services that meet customer expectations consistently, for a competitive edge in 5G and to attract new customers.

“Cloud-native deployment models are emerging as the foundation of 5G networks, yet CSPs are grappling with the challenge that each CNF has unique performance expectations within the cloud environment,” said Gorkem Yigit, Principal Analyst at Analysys Mason. “Spirent CloudSure steps in to help CSPs gain control over the complexity of these environments through validation, enabling them to deliver high-quality 5G services while realizing the efficiencies and operational benefits of the cloud.”

Ensuring 5G services survive cloud failures and degradations with minimal or no impact to users is essential to successful cloud-native technology adoption. A proactive approach and deeper cross-functional coordination are required to manage the complex and dynamic new environment, to get ahead of technology changes and gain visibility into the new, interdependent cloud-native worlds, with multiple vendors and constant release cycles.

CloudSure provides the new approach required by network operators to ensure 5G service resiliency, optimization and new service acceleration necessary for maximizing long-term revenue and ensuring reliable operations. CloudSure also complements Spirent’s market-leading Landslide 5G network test solution by injecting user-defined real-world cloud impairments and correlating their impact on cloud-native 5G services.

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Enables Designers to Share Data Between Embedded and AI/ML Projects, Streamlining the Creation of Edge and Endpoint AI Applications

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has created interfaces between its Reality AI Tools and its e2 studio integrated development environment, enabling designers to seamlessly share data, projects and AI code modules between the two programs. Modules for real-time data handling have been integrated in Renesas MCU Software Development Kits[1] to facilitate data collection from Renesas kits or customer hardware that use these microcontrollers (MCUs). This integration enables faster design cycles for artificial intelligence (AI) and tiny machine learning (ML) applications at the edge and endpoint of IoT networks.

Since Renesas acquired Reality AI in 2022, it has made a concerted effort to study, improve, and simplify AI design. Reality AI Tools, a software environment built to support the full product development of AI applications, allows users to automatically explore sensor data and generate optimized models. Now Renesas is providing a seamless data pipeline between Reality AI Tools and the e2 studio environment used to program Renesas MCUs. Sensor data collected from Renesas MCU development kits and visualized and labelled in e2 studio can now be transferred to associated projects in Reality AI Tools with the push of a button. In addition, users now have the ability to download and integrate AI/ML classifiers generated in Reality AI Tools from within e2 studio.

“Successful AI implementations are built by developing and training models with real world input from sensor data,” said Mohammed Dogar, Vice President of Global Business Development and Ecosystem at Renesas. “By providing seamless data sharing between our Reality AI Tools and e2 studio products, we’re providing the market’s best solution to enable designers to quickly build accurate and powerful AI applications.”

In addition to data transfers, Renesas is providing cross-platform project awareness between embedded and AI environments. Users can now synchronize and transfer lists of projects in e2 studio from Reality AI Tools. They can also associate an e2 studio project with a Reality AI Tools project and create a new Reality AI Tools project from within e2 studio. For a quick overview of this process, customers can watch a video demonstration available here.

Renesas is also building a library of application examples and reference solutions internally and in collaboration with ecosystem partners. The examples offer a proof-of-concept or blueprint for specific use cases. The Renesas AI application library now features over 30 reference solutions for use-cases ranging across real-time analytics, vision and voice applications.

AI Live – A Collection of Keynotes, Panel Sessions and Tech Talks all About AI

On October 12, 2023, Renesas will present an online, half-day event focused entirely on AI-related topics. In addition to keynotes from executives and industry experts, a lively roundtable discussion is planned. Attendees will also be able to choose from a host of tech talks delving into details of various aspects of AI. Visit the Renesas AI Live event page to register and view the full agenda.

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Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is pleased to announce the 2023 recipients of the Mouser Best-in-Class Awards. The annual awards event occurred on September 14 near the global distributor’s corporate headquarters in the Dallas/Fort Worth Metroplex.

The winners of the Best-in-Class Awards are chosen based on five main criteria: Strategically partnering with the Mouser team, promoting product lines and working together on new product launches, finding creative solutions to grow market share mutually for both companies, maximizing Mouser’s unique value proposition within their own businesses, and championing Mouser within their organizations.

“We are incredibly excited to honor these ten talented individuals across our large base of suppliers. Each one has played a significant role in helping us to not only support our large and growing customer base, but also to help grow Mouser sales and share in the competitive electronics marketplace,” said Jeff Newell, Mouser Electronics Senior Vice President of Products. “We are grateful for these outstanding professionals and congratulate each of them for winning the Mouser Best-in-Class Award.”

2023 Mouser Best-in-Class Award Winners:

• Mary Benetti-Condon, Bel
• Sabine Colen, Analog Devices
• Tim Fredricks, Advantech
• Kris Lafko, u-blox
• Lora McIlheran, 3M
• Dennis Nesterov, Amphenol
• Younga Pearson, EATON
• Ron Peterson, Nexperia
• Mike Sewart, Molex
• Jill Wagar, Omron

As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive. Learn about emerging technologies, product trends and more by signing up today at https://sub.info.mouser.com/subscriber.

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Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, announces a global distribution agreement with MediaTek, a world leader in developing innovative systems-on-chip (SoC) for mobile devices, home entertainment, connectivity and IoT products.

“This global agreement with MediaTek continues our commitment to providing the latest in highly-integrated semiconductors,” said Andy Kerr, Vice President of Supplier Management at Mouser. “Design engineers will have easy access to MediaTek’s world-class SoCs, backed by Mouser’s unsurpassed customer service and best-in-class logistics.”

“With Mouser Electronics as a global channel partner, MediaTek can better support our customers and enhance our worldwide distribution network,” said CK Wang, MediaTek Vice President & General Manager, Internet of Things. “By capitalizing on Mouser’s excellent supply-chain services and support, we can expand our global presence and get our products into the hands of design engineers even quicker.”

Mouser now offers MediaTek’s Genio portfolio of power-efficient, high-performing IoT SoC and smart modules. MediaTek Genio is a complete platform stack for the IoT with powerful and ultra-efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy to develop innovative consumer, enterprise and industrial smart applications at the premium, mid-range and entry levels, bringing these devices to market faster.

The Genio platform includes the Genio 1200 (MT8395), a flagship-grade SoC developed for demanding AI and performance-centric IoT applications such as advanced smart home appliances, industrial IoT applications and demanding AI-embedded devices. The Genio 700 (MT8390) is designed for smart home, interactive retail, industrial and commercial applications. It provides highly responsive edge processing, advanced multimedia capabilities, a wide range of sensors and connectivity options, and support for multitasking OS. The Genio 500 (MT8385) is a highly capable and efficient IoT platform designed for mobile, home or commercial IoT applications that require responsive edge processing, advanced multimedia capabilities, connected touchscreen displays and a multitasking OS.

As a global authorized distributor, Mouser offers the widest selection of the newest semiconductors, electronic components and industrial automation products. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive. Learn about emerging technologies, product trends and more by signing up today at https://sub.info.mouser.com/subscriber.

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• Mind AI Unveils Vision for a New Era of Artificial Intelligence at FICCI Event
• FICCI’s Summit Emphasises the Growing Demand for AI-related Skills

The Federation of Indian Chambers of Commerce and Industry (FICCI) successfully concluded the second day of its 14th edition of the Global Skills Summit, centred around the theme “Building Skills. Empowering Youth. Creating Future.” The focal point of the day’s discussions revolved around the ‘Future of Work in AI,’ with notable contributions from industry leaders.

The highlight of the event was a captivating address by Dr Jung Hwan (Paul) Lee, Founder & CEO of Mind AI, a prominent Korean company specialising in artificial intelligence. Dr Lee delivered an enlightening session on the ‘Future of Work in AI’ and unveiled insights into Korea’s National Strategy for Artificial Intelligence. During his speech, he emphasised the profound impact of AI on our future, stating, “AI is not just about enhancing efficiency; it will completely reshape the foundations of businesses and organizations across various sectors.”

Dr Lee also provided valuable statistics on the growth of the AI market, forecasting a remarkable 37.3% Compound Annual Growth Rate (CAGR) from 2023 to 2030. He further highlighted exponential growth in specific AI sectors, with a 40.4% CAGR in Global Natural Language Processing, 23.6% in Global Conversational AI, and 39.3% in Global Robotic Process Automation. Furthermore, Dr Lee shed light on Mind AI, describing it as both a new class of AI and an extensive ecosystem.

In the context of AI’s increasing importance, Dr Lee emphasized that businesses must adapt within the next 4-5 years or risk being left behind. The implementation of AI necessitates a higher demand for a broader set of skills, including digital proficiency, analytical capabilities, and critical thinking. He stated, “General and elementary knowledge of AI is becoming essential, often at a basic level, such as the ability to use a computer or smartphone. Analytical skills are gaining prominence as automation of routine tasks allows workers to tackle more complex assignments, requiring specialized knowledge, comprehension, and the application of innovative ideas.”

As part of Korea’s National Strategy for Artificial Intelligence, Dr Lee outlined various policy initiatives. These include an AI convergence curriculum across different life cycles and job types, interchangeability between AI and other fields at the university level, AI basic literacy training in the military through M-MOOC, and collaboration between Coursera and K-MOOC to provide digital skill courses. Korea’s commitment to nurturing AI talent and boosting youth employment rates was evident, with policies introduced over the past two decades, the development of National Competency Standards (NCS) for vocational high schools, and the establishment of Meister High Schools targeting employment rates exceeding 90% by 2022. Additionally, the youth employment quotas were raised from 3% to 5%.

Dr Lee concluded his session by introducing the innovative Mind AI, which transforms natural language inputs into internationally patented data structures referred to as “canonicals.” This transformation enables the Mind AI engine to make connections, perform logical operations, and generate intelligent responses.

The FICCI’s 14th Global Skills Summit continues to be a platform for insightful discussions on the ever-evolving landscape of skills and technology, driving India’s workforce towards a future defined by innovation and adaptability.

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By Magnus Hylén | Rohde & Schwarz

With 5G NR and the different operation modes (non-standalone and standalone) the air interface procedures and all protocol layers are getting more complex. To be able to understand the message content from relevant Radio Resource Control (RRC) we worked on a human-readable solution. R&S®ROMES4 contains now a built-in expert decoder that extracts RRC message information and automatically translates it into the structured RRC connection control, measurement and mobility functions, presenting them as readable RRC events and key performance indicators (KPI).

Overview

The arrival of 5G New Radio (5G NR) has made radio network layouts much more complex than they were for legacy 4G/LTE networks.
Fully new frequency band ranges (including mmWave) and new network architectures that allow dual connectivity create new opportunities but also pose challenges for radio network design as well as the analysis and optimization of these networks.

User equipment (UE) can either connect standalone over LTE or 5G NR networks and over both with non-standalone connectivity.
5G has greater flexibility, making it even more challenging to understand and analyze radio networks. With the growing number of network interfaces and radio access network (RAN) configurations, system experts and radio engineers need more expertise and develop methods and tools to optimize or troubleshoot 5G and 4G networks.

Analytical challenges

We are going to take a closer look at radio resource control (RRC) layer 3 signaling in 5G NR and 4G LTE mobile networks and analyze the connection control, measurement configuration and mobility procedures.
The RRC reconfiguration message contains vital information. The message can include measurement configurations, handover information, as well as add and release cells for carrier aggregation and dual connectivity.

A sample RRC layer 3 LTE protocol analysis:

The sequence starts with a measurement report from the UE in the uplink followed by an RRC connection reconfiguration message in the downlink. The underlying procedures can be found in the message content and you need to be a 3GPP protocol expert to decipher all the important information.

LTE and 5G NR RRC reconfiguration messages are some of the lengthiest in the protocol stack and it can take time to fully understand them. A protocol expert can decipher these messages and gain the insight seen in the screenshot below:

1. The measurement report is triggered by a previous Event A3 reporting configuration. The LTE RAN will act upon the Event A3 message and initiate a handover attempt that is signaled by the RRC reconfiguration message.
2. 2. Analyzing the extension fields in the next RRC reconfiguration message confirms that adding SCells will activate carrier aggregation.

This is just one RRC signaling sequence out of the hundreds that a device can generate over the course of an hour and analyzing them all is tiresome work, even for experts.

The solution – let the tool be the expert

Letting a tool such as R&S®ROMES4 do the work for you is a smart alternative. The built-in expert decoder extracts RRC message information and automatically translates it into the structured RRC connection control, measurement and mobility functions, presenting them as RRC events and key performance indicators (KPI) along with all other logged UE diagnostic information.
Below is our previous LTE handover in the layer 3 view with the smart RRC events seen with a green background in the source RRC message.

The signaling sequence is now easier to understand, even for non-experts.
The smart RRC events explain:

1. LTE -MR Event A3 triggered the measurement report and provides the measured cell quality results for the PCells, neighbor cell(s) and SCells (SFL).
2. 2. LTE eNB acts upon an MR Event A3 and initiates an RRC reconfiguration while R&S®ROMES4 detects the following smart RRC events:
   a) Handover attempt for LTE PCell: handover to a new primary cell on the same frequency (inter-frequency handover)
   b) RB AddMod: RLC and PDCP configuration of the data radio bearer
3. 3. The next RRC reconfiguration activates carrier aggregation, as indicated by the MCG add LTE SCell event.

Analysis samples

A vast set of parameters are available to control mobility functions, such as handovers and dual connectivity. High mobility performance levels in mobile networks require that parameters be fine-tuned to geographical conditions, frequency bands and even cell-specific conditions. So, a mobile network will need a lot of tuning throughout its lifecycle.
Measurement reporting configurations can be event driven or periodic. An Event A3 is the common intra-frequency handover trigger, indicating that a neighbor cell has offset of x dB relative to the serving cell. the next example depicted below shows an LTE-MR Event A3 triggering a measurement report for the PCI 483 neighbor cell with an RSRP of -83 dBm and a serving cell with -87 dBm, meaning the neighbor cell is 4 dB better. NodeB responds with an RRC reconfiguration message and a handover to the new cell.

In an earlier RRC reconfiguration message you can find the Event A3 configuration to cross-check the reporting conditions and make sure that the offset [dB] plus hysteresis [dB] are in fact 4 dB.

LTE was the first cellular technology with a self-organizing network (SON) function: the automatic neighbor relation (ANR) feature. Network operators around the world welcomed this feature, since significantly reduced the effort needed to manage neighbor cell relations, which were very challenging in legacy 2G and 3G networks.
ANR is embedded in the overall LTE measurement quality procedures with individual measurement reporting configurations. ANR can instruct the UE to report neighbor cells with a negative offset before they are detected as handover candidates by other Event A3 configurations.
In the example below the Event A3 parameters offset plus hysteresis are instead -12 dB.

R&S®ROMES4 makes it easy to distinguish between Event A3 measurement reports used to trigger handovers and those used for SON functions. Multiple instances of Event A3 SON are reported but the negative offset prevents a handover decision in the NodeB.

Missing neighbor problems are the most common cause of dropped calls and poor connection quality. When a UE sends measurement reports to the primary cell indicating a better neighbor cell and no response comes from the NodeB (i.e. no RRC reconfiguration), the UE will probably will drop the connection due to poor signal quality and start the RRC re-establishment process.

Relationships with neighbor cells may not be defined in the primary cell due to a suboptimal ANR function. Other reasons may include heavy traffic loads in a neighboring cell.

R&S®ROMES4 has the ‘No MR response’ KPI to make it easier to detect situations with no response from the UE measurement and quickly identify such problems.

The KPI helps find problems and decoded RRC MR events help understand them.
Event A3 defined for SON (negative offset) is not taken into consideration for the ‘No MR response’ KPI, since it does not trigger a NodeB response.

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Opening a $2 Billion Market in the Next Decade and Setting a New Bar with Unmatched Performance and Reliability

SiTime Corporation, the precision timing company, today announced the SiTime Epoch Platform, designed to solve the most complex timing issues in electronics and disrupt 100-year-old quartz-based technology. The SiTime Epoch Platform is a MEMS-based, oven-controlled oscillator (OCXO) that delivers an ultra-stable clock to data center and network infrastructure equipment, unlocking a cumulative $2 billion served addressable market (SAM) in the next decade. Over time, Epoch technology will be extended to other high-growth electronics markets, such as aerospace and defense, industrial controls, and more.

“The release of the Epoch Platform is a pivotal moment for SiTime and the electronics industry,” said Rajesh Vashist, CEO and chairman of SiTime. “For many years, customers lived with the shortcomings of existing timing technologies because there were no viable alternatives. They compromised on real-world performance, reliability, and power, to name just a few. SiTime’s Epoch Platform changes the game, delivering higher performance and reliability with lower power that was unavailable until now. These benefits are the result of a half-decade of engineering investment and a systems-based development approach that combines MEMS, analog, packaging and algorithms. Epoch, along with new products introduced since 2020, with more to come, will expand our communications and enterprise annual SAM to $1.3 billion by 2024. We believe precision timing will be a catalyst for innovation in all electronics and will drive our future success.”

Precision timing is critical to network performance and reliability. All nodes in the network must be synchronized in time. For example, all nodes in a 5G network must always be synchronized within hundreds of nanoseconds, which is 10X more stringent than 4G. This level of synchronization must be maintained despite network outages. By delivering up to 2X better performance, 9X smaller size, and 3X lower power in applications such as data center switches and routers, 5G base stations, and core infrastructure, the Epoch Platform sets a new bar in performance and reliability.

“As the world embraces next-gen technologies, like the explosion of AI, the reinvention of the cloud data center, and high speed 5G/6G cellular networks, advanced circuit and network timing solutions have become critical in ensuring performance, fault tolerance and reliability,” said Dave Altavilla, co-founder, president and principal analyst at HotTech Vision & Analysis. “AI is the most disruptive, transformative technology innovation in decades, perhaps even in the last century. The high-bandwidth, low-latency data center infrastructure needed to support AI will require robust precision timing for critical wired and wireless network connectivity. Furthermore, these technologies will also be deployed at the edge and in the field, where tough environmental conditions will require more ruggedness and higher reliability than ever before.”

SiTime Epoch Platform Delivers 2X Longer Holdover and Ensures Reliable, Continuous Network Operations

A synchronized network relies on multiple, redundant timing sources to ensure continuous operation. One of these sources is an ultra-stable, local oscillator, typically an OCXO, which will “holdover” the network and ensure continued operation when other timing sources are impacted.

However, legacy quartz OCXOs are inherently unreliable and prone to performance degradation in the presence of environmental stressors such as temperature changes and vibration. To date, electronics companies compromised on real-world performance, reliability, size, power, and warm-up time to achieve the one thing that an OCXO delivered – a stable clock reference.

With the Epoch Platform, SiTime is breaking through all these limitations of quartz OCXOs. Epoch delivers 2X longer holdover, even under environmental stressors, enabling telecom and cloud service providers to deliver service continuity in real-world conditions.

Key Features of the SiTime Epoch Platform

• Any frequency between 10 and 220 MHz, programmable up to 6 decimal places of accuracy.
• 8 hours of holdover, up to 12 hours with aging compensation – 2X better than other solutions in real-world environments.
• ±1, ±3, ±5 ppb frequency stability over temperature
• Highest operating temperature range: -40 °C to +95 °C
• 5, 2.8, and 3.3 operating supply voltage
• 3X lower power: 420 mW
• 3X better ADEV under airflow: 5e-12 at 10 seconds averaging time
• 3X lower aging: ±0.08 ppb/day
• 2X faster time to stability – 60 seconds
• 9X smaller, 3X lower: 9 mm x 7 mm x 3.73 mm
• Digital control with 5E-14 resolution: I2C and SPI interfaces

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Strategic Collaboration to Drive Further Value to India’s AI and Networking Solutions Market

Tech Data, a TD SYNNEX company, today announced the expansion of its partnership with Allied Telesis, a global leader in connectivity solutions and smart networks, to become its premium distributor in India. Under the terms of this agreement, Tech Data will play a key role in extending Allied Telesis’ footprint in India and adding significant value to the country’s growing AI and networking solutions market.

Allied Telesis offers the most cost-effective networking solutions driven by AI, ML and SD-WAN technologies designed for LAN, WLAN, WAN environments. These solutions provide granular network control, resulting in minimized downtime and streamlined operations. Allied Telesis offers seamlessly integration with more than 30 recognized cybersecurity vendors to provide True Zero Trust Network Security, ensuring a comprehensive approach to cybersecurity remediation.

In response to these developments, Sundaresan K., Vice President of Next-Generation Technologies, and Country General Manager, at Tech Data India, commented “The AI market in India is projected to grow at a CAGR of 32.26% reaching a value of USD3.9665 billion by 20291, while the networking solutions market is forecasted to grow at a CAGR of 18% through to 2027, reaching USD225.69 million2. In light of this prospects, we are excited to bring Allied Telesis intelligent networking solutions to our partners and customers, providing end-to-end support to enhance their ability to optimize and safeguard their network infrastructure.”

Anand Chakravarthy, Head of Business Development, Networking, Tech Data Asia Pacific and Japan, expressed, “As businesses continue to embrace next-generation technologies to drive digital transformation, achieve operational excellence and enhance user experience, aligning network capabilities becomes increasingly imperative. Our collaboration with Allied Telesis underscores our commitment to delivering best-in-class solutions that align with the demands of the modern IT landscape and evolving needs of businesses.”

Notably, Allied Telesis distinguishes itself by offering a 5-year default hardware warranty and its commitment to product availability, even in the face of the global chipset shortage. This attribute distinguishes it from the other available offerings in the market.

Subhasish Gupta, Regional Director, India/Saarc, Allied Telesis said “We at Allied Telesis are extremely happy to announce our association with Tech Data India as our premier distributor. Tech Data brings in loads of experience and deep connections and reach amongst channels in this large country. We envisage that, with Tech Data’s connections in the market, we can on-board certain large data network partners and enable them under our well-oiled and rewarding partner program. Furthermore, their focus on cybersecurity solutions compliments Allied Telesis’s true zero trust security solution and will help partners leverage our offerings to address a huge area of concern for customers across verticals when it comes to protecting their edges from cybersecurity attacks”.

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Whether check-in, sorting, high-speed-transport or baggage reclaim – NORD DRIVESYSTEMS offers suitable drive solutions for all baggage handling applications. The specialist will be presenting them from 10 to 13 October 2023 at inter airport in Munich.

Occasionally, baggage items of varying weights are transported over long distances and at irregular intervals: This is the great challenge for airport baggage handling. Here, NORD DRIVESYSTEMS offers various high-efficiency drive solutions.

Outstanding energy efficiency

NORD’s IE5+ synchronous motor convinces with an energy efficiency of up to 93 percent and thus even surpasses the highest standardised efficiency class IE5. The drive specialist does not only offer it as a standalone motor but also in integrated drive systems that reduce the number of interfaces and thus further increase system efficiency. In the patented DuoDrive geared motor, the IE5+ motor is integrated into a helical gear unit and does not only provide outstanding efficiency but also a compact installation space. In contrast, the LogiDrive drive system features a decentralised frequency inverter that efficiently controls the drive and is placed directly on the geared motor, enabling easy installation.

Particularly important for the industry: The IE5+ motor design and the frequency inverter operation allow for the same motor variant to be universally used worldwide – regardless of the local mains voltage or the respective energy efficiency regulations. 

Reducing variants, minimising costs

NORD drive technology achieves a very high and relatively constant efficiency over a wide speed and torquerange, and also provides optimum energy consumption performance in partial load and speed ranges. This allows the use over a wide load range and thus the reduction of the number of drive variants in a complete system. Administrative costs are minimised and production, logistics, storage and service processes are streamlined. This results in a significant reduction of the user’s Total Cost of Ownership (TCO).

An energy-efficient drive is especially important for large conveyor systems with numerous drive units. With the NORD ECO service, NORD supports its customers in finding the most energy-efficient drive solution. NORD specialists measure the system’s load profile and determine whether the drive is optimally designed. Should this not be the case, they recommend a more efficient drive configuration.

NORD DRIVESYSTEMS will be presenting its solutions for the airport industry from 10 to 13 October 2023 at inter airport Europe in Munich. You will find the drive specialist at Stand B5-1566.

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• Significantly reduced carbon footprint
• No impact on product quality or performance
• Distribution of more sustainable version starts in October, 2023

Specialty chemicals company LANXESS has reached an important step towards more sustainability in its plasticizer portfolio: The Polymer Additives (PLA) business unit now offers a more sustainable solution for its plasticizer Mesamoll. The phthalate-free, well-gelling and exceptionally saponification-resistant plasticizer can be applied for a wide range of polymers, such as PVC, PUR and rubber.

“The switch to a more sustainable raw material base in the production of Mesamoll is a testament to LANXESS’s commitment to sustainability,” says Karsten Job, Head of the Polymer Additives business. “Helping our customers to reduce their carbon footprint while meeting the demands of our customers for phthalate-free, reliable, and performing solutions makes us a frontrunner in the market.”

In the future, more than 30 percent of the input materials for Mesamoll will come from fully sustainable sources resulting in a reduction in the product carbon footprint (PCF) of around 20 percent. As this is calculated via the mass balance approach by the supplier of the respective raw materials, there is no impact on the product quality or performance of Mesamoll.

“We want to actively shape the transformation of our industry,” says Stefan Tiebach, Head of Global Marketing at PLA. “At LANXESS, we firmly believe in leading by example and that is why we decided to stop the distribution of our conventional Mesamoll and are solely distributing the more sustainable version starting on October 1, 2023. Our customers will continue to receive the usual product quality with the additional benefit of an improved sustainability profile.”

LANXESS is committed to further reduce the PCF for its plasticizer Mesamoll in the future, even though the current, reduced PCF is significantly lower than most alternative plasticizers on the market.

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From the genesis of a simple electronic transaction to widespread adoption of smartphones, the evolution of online banking, mobile banking and mobile transactions has propelled the financial services industry to unparalleled heights. Demonetisation and the advent of covid-19, were the triggers that pushed everyone to adopt digital payment methods. As a result, the inclusion of modern technology is reshaping traditional business models and ultimately paving the way to new pathways of growth.

In recent years, India’s financial landscape has undergone a remarkable transformation with the integration of cutting-edge technologies. Artificial intelligence, machine learning, cloud computing, block chain, data analytics, have revolutionized the way financial services are being delivered and experienced. Today Fintechs represent the full range of services from digital payments, KYC, loan underwriting, data analysis, credit management, credit investment, debt collection & recovery process and so on.

The emergence of new-age technologies especially Artificial Intelligence (AI) has undoubtedly made great strides in the finance industry. As a matter of fact, digital lending has become one of the areas where AI has made strong inroads and at the same time has increased the participation by those who have until recently been under-or-un served. AI is a powerful boost to the lending and loan management sector through Fintech.

The projected total addressable market for fintech in India is estimated to reach $2.1 trillion (174 lakh crores) by 2030, demonstrating a compound annual growth rate (CAGR) of 18% starting from 2022. Indeed, the focus is on a rapidly expanding B2B lending market, which is poised to reform conventional lending models and reshape the financial landscape.

There are significant opportunities that have emerged rapidly in evolving fintech landscape in India. First is, bridging the credit gap where the lack of capital is one of the biggest threats to MSME’s existence. With several Fintech start-ups offering easier and quicker access to loans, MSMEs are no longer required to go through the tedious process of providing documentation, filling in the paperwork and making multiple visits to a bank. According to the IFC Report, the total addressable credit gap in the MSME segment is estimated to USD 397.5 billion(33 lakh crores). This is where financial technology comes into the picture and has the potential to solve the credit availability issues.

Secondly, driving financial inclusion in India by leveraging data analytics, financial institutes can assess creditworthiness and offer financial products to individuals and businesses that were previously excluded from traditional banking systems.

Third, cost efficiency, as Fintech start-ups often have lower operating costs compared to traditional financial institutions. They do not require extensive physical infrastructure, allowing them to offer more competitive rates and reduced fees to customers.

Fourth, revolutionizing the collection process have allowed banks to evolve their conventional debt collection methods which often involve letters, phone calls and uncomfortable in-person visits from debt collectors. Using SaaS-based platforms provide cutting-edge digital, data-driven, and customer-centric loan collections, optimizing efficiencies to unprecedented levels.

Fifth, identification of fraud is made possible by artificial intelligence and machine learning, enabling fintech companies to identify fraudulent activities and repeated defaulters, a lot more successfully ahead of the credit approval. Today, these functions are backed with underwriting models that prevent an increase of automatically approved defaulting customers.

Fintech companies are constantly innovating by using AI-ML to design products suiting their customer’s evolving needs. With this continued drive and the expedited growth, the digital lending market cap is expected to grow and reach $350 billion (28 lakh crores) by 2025 in India.

Artificial intelligence has already begun reshaping the banking and online lending industries, and its transformative impact is expected to persist. It can be seen in other industries as well like Medicine & Heath care, Media & Entertainment, Insurance, Education and many more. Digital technology is allowing Microfinance Institutions to efficiently reach and serve the “unbanked”, through their customer-centric approach. It also has streamlined loan processes and improved customer experiences, making the lending process safer and more accessible for lenders and providing a competitive advantage to banks. As AI technology continues to advance, its impact on the financial industry will likely to be more profound, leading to further advancements and optimizations in banking and lending services.

Mukund Kulkarni – CEO, Pepper Advantage India

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Courtesy: Qualcomm

From revolutionizing industries to reshaping our daily routines, there is no denying the profound impact of Artificial Intelligence (AI), making it one of the most disruptive technologies on the horizon. Thanks to the recent surge in media attention surrounding ChatGPT, the momentum for cutting-edge AI research is reaching unprecedented heights, propelling us towards innovations that can open new possibilities. Our mission with AI is to responsibly bring its benefits to more people around the world, elevate everyday mobile experiences, and enable new efficiencies for a wide range of consumer, enterprise and industrial applications.

However, scaling AI to reach its full potential is no trivial undertaking. To do so efficiently, it’s imperative for AI processing to be intelligently distributed between the cloud and edge devices.

That’s why we believe the future of AI is hybrid. AI computation is split where and when appropriate, to provide enhanced experiences and ensure efficient use of resources.

To realize this vision, not only do we need to foster AI advances through cutting-edge research but also drive the continued wireless technology evolution. Wireless and AI are two synergistic ingredients that will fuel future innovations.

AI benefits the end-to-end wireless system

Today, 5G is propelling the rapid proliferation of intelligent devices and services, with more than 1.5B connections globally1. The rise of AI not only transforms our mobile experiences (e.g., improved camera quality, predictive texting), but also brings a unique opportunity to revolutionize the future of wireless communications.

AI’s immense potential can be harnessed to solve complex challenges in wireless system design. A testament to this is our Snapdragon Modem-RF platforms; now for two generations, we have adopted AI to enhance modem-RF system performance.

AI’s role in wireless will continue to expand. For instance, it can help optimize system energy saving, network load balancing and device mobility management. In fact, AI will touch every part of the end-to-end wireless system design. Here is a brief summary of AI’s role in each key part of the system.

• Optimized distributed clouds: AI can enable fully autonomous networks, make predictive and preventive operational optimizations on a continuous basis, and improve efficiency by reducing network loading.
• Intelligent disaggregated network: AI powers the radio access network (RAN) intelligent controller, which can more effectively manage interference, schedule transmission, and facilitate coordinate multipoint (CoMP) operations.
• AI-enabled air interface design: AI is fundamentally transforming the design and evolution of the air interface (i.e., waveform, coding), bringing new capabilities like dynamic channel adaptation, and more.
• Smart edge devices: AI can optimize device experiences with more efficient beam management and channel feedback computation, as well as enhanced capabilities like positioning and RF sensing.

Demo: Adaptive RAN operation for 5G

To showcase the benefits of wireless AI in real systems, earlier this year, we demonstrated wireless AI using our 5G test networks at our headquarters in San Diego. Watch the demos above.

AI for network deployment optimization

Additionally, AI can also be utilized to facilitate a more optimized network deployment strategy. To illustrate, we have developed:

• An intelligent network planning tool that leverages AI to first create a digital twin of the targeted deployment area, run it through a trained machine learning model, and
• Output an optimized network deployment plan based on design requirements (e.g., capacity, speed) and constraints (e.g., cost, type of infrastructure).

Our demonstration showcased how a 5G network can be flexibly designed to add mmWave extreme capacity that complements sub-7 gigahertz (GHz) wide-area coverage.

The wireless AI era starts with 5G Advanced

To get the most benefits from wireless AI, technology standardization is essential. It can define how AI is best utilized while ensuring seamless interoperability across multiple vendors in the end-to-end wireless system. 3GPP officially began the work on 5G Advanced in late 2021, setting out to study a standardized wireless AI framework and potential applications. The figure below illustrates the focus on initial use cases.

These wireless AI capabilities not only make new system efficiencies and user experiences possible, but also lay the foundation for future wireless AI innovations. At Qualcomm Technologies, we are not only actively researching wireless AI and contributing our work to technology standards, but also prototyping all use cases in our test networks. Three of our most recent wireless AI demonstrations are summarized below.

• Multi-vendor channel state feedback: We prototyped with the Qualcomm Cloud AI 100 platform and Snapdragon Modem-RF system in our 3.5 GHz massive MIMO testbed. It highlights the capacity gain in a multi-vendor system, enabled by sequential learning that prevents proprietary knowledge sharing.
• Advanced mmWave beam management: We enabled predictive beam management for both the base station and device in our 28 GHz mmWave testbed in San Diego. The implementation reduces signaling overhead resulting in increased usable capacity and extended device battery life.
• Intelligent industrial positioning: We demonstrated centimeter-level accuracy in our indoor industrial IoT testbed, overcoming the complex challenges of multipath reflections. Downlink RF fingerprinting with AI outperforms other positioning techniques, such as downlink time difference of arrival, in this challenging environment.

Onward to 6G: An AI-native communications system design

Looking beyond 5G Advanced, our vision is for 6G to be an AI-native innovation platform. 6G is expected to have a data-driven design that distributes AI throughout all protocols and layers, allowing it to continuously improve as more data is collected. Today, our research focus is on enabling efficient joint training, model sharing, and distributed inference across networks and devices, including federated learning that scales fully with 6G.

The journey with wireless AI is just beginning

We’re very excited by the potential impact that AI will have for the future of wireless communications. As 5G Advanced officially kicks start the era of wireless AI, we’ll be sharing periodic updates on the work we’re doing, whether it’s on advanced research, technology standardization, or bringing wireless AI to fruition with product support. So, stay tuned for more.

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Mouser Electronics Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, unveils the next installment of its award-winning Empowering Innovation Together series today, spotlighting the need for environmental sensors. Mouser examines the technology and applications behind environmental sensors and how they are used in creating indoor air quality monitoring solutions through a technical content stream of articles, blogs, videos, and the latest podcast episode of The Tech Between Us.

Environmental sensors have become more popular among employers looking to improve air quality inside the workplace, bolstered at least in part by the pandemic and the demand for clean indoor air, and the sensors to track potential hazards By monitoring pollutants, particulates, and hazardous gasses in real time, employers can more easily address potential threats to employee health and productivity. Poor indoor air quality has been linked to a variety of short-term ailments, such as headaches, fatigue and difficulty concentrating. With no federal standards regarding indoor air quality, employers are taking responsibility for monitoring their environments and providing clean air to employees. Mouser explores how environmental sensors offer an efficient way of doing so, allowing accurate readings that can be easily monitored over time to provide the data companies need.

“Environmental sensors can play an important role in keeping the air we breathe in our workplace clean. That’s why Mouser is excited to share this informative EIT installment centered around this topic,” says Raymond Yin, Technical Content Director at Mouser Electronics. “Through this initiative, we aim to empower engineers with the knowledge they need to find solutions for improving indoor air quality.”

This series includes the latest installment of The Tech Between Us podcast, hosted by Yin. He is joined by Ronan Cooney, Head of Product at Ambisense, to discuss the current landscape of indoor air quality compared to outdoor air quality. They also review the major contributors to poor air quality, regulations, and design considerations for air quality measurement devices. Additionally, the episode maps out Mouser’s environmental sensor selections and the considerations needed when designing for specific applications.

Mouser’s variety of articles, infographics and videos offer an in-depth overview of environmental sensors, the risks associated with poor indoor air quality, the exploration of sensor selection for improving indoor air quality (IAQ) and choosing the right volatile organic compound (VOC) sensors. This EIT installment is sponsored by Mouser’s valued partners Amphenol, TE Connectivity, Honeywell, Renesas, Sensirion, and Bosch.

Established in 2015, Mouser’s Empowering Innovation Together program is one of the industry’s most recognized electronic component programs. To learn more, visit https://www.mouser.com/empowering-innovation/ and follow Mouser on Facebook, LinkedIn, Twitter, and YouTube.

As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive. Learn about emerging technologies, product trends and more by signing up today at https://sub.info.mouser.com/subscriber.

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