ELE Times

• DIRK (German Investor Relations Association) awards Infineon first place for best Investor Relations among DAX 40 companies
• IR Impact has honored Infineon with first-place rankings at the European level in the categories “Best Overall Investor Relations (Large Cap)” and “Best Investor Relations Officer (Large Cap)”
• Awards confirm the quality and credibility of Infineon’s capital markets communication

Infineon Technologies AG receives several awards for its Investor Relations (IR) activities. At the German Investor Relations Award presented by DIRK, the German Investor Relations Association, the Infineon IR team achieve first place for best Investor Relations among all DAX 40 companies for the first time, jointly with Siemens Energy AG. Infineon also ranked third in the categories “Best ESG Communication by a Company” and “Best IR Communication by a Head of IR”. The latter award was presented to Alexander Foltin, Head of Finance, Treasury & Investor Relations, who accepted the prize together with Chief Financial Officer Dr. Sven Schneider at the ceremony in Frankfurt on 30 June.

Just two weeks earlier, the team had already been recognized at the 2026 IR Impact Awards – Europe. Infineon’s entire IR team ranked first in the category “Best Overall Investor Relations (Large Cap).” Alexander Foltin and Daniel Györy, Team Lead Investor Relations, also jointly secured the top position in the category “Best Investor Relations Officer (Large Cap).”

“The strong recognition of Infineon’s Investor Relations work at national and international level confirms the high quality and credibility of our capital markets communication,” said Dr. Sven Schneider. “My sincere thanks go to the colleagues who continuously foster an open and transparent dialogue with our investors and analysts, particularly at a time marked by unprecedented growth opportunities and geopolitical challenges. We remain committed to shaping Infineon’s equity story, meeting the expectations of analysts and investors, and to maintaining a close and constructive exchange with the capital markets.”

The German Investor Relations Award is presented annually by Extel, WirtschaftsWoche and DIRK. The winners are determined based on Extel’s Developed Europe Executive Team Survey, which gathers independent feedback each year from thousands of buy- and sell-side professionals worldwide on the IR activities of listed companies.

The IR Impact Awards – Europe are presented annually by IR Impact and are among the most prestigious distinctions in the Investor Relations field in Europe. They recognize excellence in financial communications as well as in the dialogue between listed companies and the capital markets. Winners of the respective categories are determined by an independent survey of analysts and investors.

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The enterprise AI platform turns millions of engineering artifacts that run a plant into accurate, decision-ready data, delivering up to 85% extraction accuracy and full, audit-ready traceability

L&T Technology Services announces the launch of Ainfonix 4.0, a next-generation Engineering Intelligence platform for process industries. Unveiled at EI Live, LTTS’ flagship event that brings together analysts, industry leaders and engineering experts, Ainfonix 4.0 marks an important step in the company’s Enterprise AI and Engineering Intelligence strategy.

As industrial enterprises accelerate AI adoption, decades of engineering knowledge remain trapped in fragmented drawings, specifications, and technical records across disparate systems. Without trusted and accessible engineering data, organizations struggle to realize the full value of AI, automation, and digital transformation initiatives.

Ainfonix 4.0, developed in LTTS’ Sustainability segment, addresses this challenge by transforming engineering artifacts and multi-modal data into structured, asset-linked information that can be governed, searched and reused across the enterprise for faster and better decision-making. Built on decades of process industry expertise, the platform combines AI-powered extraction, engineering intelligence and human-in-the-loop validation to improve data quality, strengthen traceability and create a trusted foundation for engineering execution, operational visibility, and lifecycle performance. In early deployments, Ainfonix 4.0 has delivered up to 85% accuracy in technical data extraction, 30-50% faster artifact retrieval and review, and 100% audit-ready traceability, helping enterprises operate with greater speed, reliability, and control. LTTS was recently rated as a Leader in the ISG Provider Lens 2025 study for Enterprise Asset Management in the Oil & Gas Industry Service & Solutions (Americas).

Amit Chadha, CEO & Managing Director, L&T Technology Services, said, “Engineering Intelligence begins with trusted engineering data. While enterprises invest heavily in digitization, much of the engineering knowledge remains locked within disconnected engineering systems. Ainfonix 4.0 helps bridge that gap by transforming engineering information into structured, asset-linked intelligence that can be used across the asset lifecycle, from engineering and project execution to operations and maintenance. As organizations look to scale AI adoption, we believe trusted engineering data will become a critical competitive advantage, and Ainfonix 4.0 is designed to help clients unlock that value.”

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• Advance single-die solution with PQC (post-quantum cryptography) hardware accelerator
• Helps mobile device makers prepare for future security requirements while enabling rich consumer and ecosystem use cases.

STMicroelectronics introduces the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready security requirements while supporting a seamless user experience across connected services.

ST54M brings to the market a single-die device featuring an innovative hardware accelerator for post-quantum cryptography (PQC) with NFC, secure element and eSIM functionality, delivering a powerful future-ready solution for secure mobile connectivity and services. The solution supports a wide range of use cases, including contactless payments, transit ticketing, access control, digital identity, driving licenses, connectivity services, and digital car keys.

Future-proof protection for expanding mobile use cases

As mobile devices increasingly serve as trusted platforms for financial transactions, identity credentials, operator services, and secure access, product developers need solutions that combine multiple functions without compromising security, performance, or convenience. ST54M addresses this need by enabling OEMs and ecosystem partners to support multiple applications on one platform while preparing for the transition toward PQC.

The device is designed for use across personal electronics ecosystems involving mobile network operators, banks, governments, transit operators, car manufacturers, digital-wallet and service providers. It helps manufacturers create devices that maintain a stable, familiar user experience while meeting stronger long-term security expectations.

Arriving now, ST54M enables customers and partners to deliver post-quantum-ready implementations with enough time to meet demanding industry-driven market deployment requirements, which are expected to be mandated around 2030.

“With ST54M, we are extending our mobile-convergence platform to help customers address evolving security challenges while supporting the rich set of services users now expect from their devices,” said David Richetto, Connected Security Group VP, Division General Manager, STMicroelectronics. “By combining a PQC hardware accelerator with NFC, embedded secure element, and embedded SIM capabilities, ST54M gives device makers a secure path to start preparing next-generation mobile experiences.”

Engineered for security, integration, and RF performance

ST54M is an advanced single-die solution that integrates an NFC controller with a secure element supporting secure applications, eSIM, and NFC-compliant products. A key feature is its hardware accelerator for post-quantum cryptography algorithms, including ML-KEM and ML-DSA, supporting the transition from hybrid cryptographic approaches toward full post-quantum deployment. The hardware engine is designed to address emerging PQC requirements while helping protect against side-channel and fault-injection attacks and is the latest result from ST’s long-term commitment that also includes certified software libraries NesLib-PQML and X-CUBE-PQC in STM32 microcontrollers.

In addition to its security architecture, the device integrates a large memory capacity to support multiple applications and includes an enhanced RF front end. These capabilities can help improve performance with smaller antennas and single-ended configurations, support more stable reader-writer operation, and enable demanding use cases such as mobile Point-of-Sale (mPOS) and wireless charging. The platform has completed certification testing under Common Criteria 2022 EUCC and EMVCo, underscoring its suitability for security-sensitive mobile applications.

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Featuring AI-powered noise reduction, real-time audio transmission, compact lightweight design, Type-C connectivity, and seamless audio-video synchronisation for content creators

Portronics launches the VlogMate Neo, an AI-powered Type-C wireless microphone designed to help creators capture crystal-clear audio with ease. Built for vloggers, influencers, podcasters, educators, and mobile content creators, the VlogMate Neo combines intelligent audio processing with a compact, lightweight design to deliver professional-grade sound on the go.

Built for modern content creation needs, the VlogMate Neo features a dual-microphone system with AI-powered noise reduction, enabling it to effectively isolate voices while minimising unwanted background noise for consistently clear and natural audio across diverse environments. It also offers seamless plug-and-play functionality with Type-C smartphones, eliminating the need for additional apps or complex pairing processes.

Its lightweight and discreet form factor ensures comfortable wear during extended recording sessions, making it ideal for on-the-go creators. With real-time wireless audio transmission, the device delivers stable, low-latency performance for smooth and uninterrupted recording.

The VlogMate Neo supports audio-video synchronisation, ensuring perfectly aligned output for polished, professional-quality content. With a wireless range of up to 30 meters, creators can move freely while filming travel vlogs, fitness tutorials, interviews, presentations, and outdoor shoots without compromising audio quality.

Adding to its versatility, the microphone comes with a removable magnetic clip for quick attachment and flexible positioning. The included charging case protects the device and extends battery life, making it suitable for long recording sessions across multiple locations. Compatible with Type-C smartphones and devices, the VlogMate Neo offers true plug-and-play functionality, allowing users to start recording instantly without additional apps or complex setup procedures.

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Nuvoton Technology Corporation announces the launch of the NSC128L42, a new 32-bit Arm Cortex-M23 microcontroller for high-precision measurement. This highly integrated solution combines a 24-bit Sigma-Delta ADC, an LCD driver, and high-quality voice synthesis in a single package. With an operating speed of up to 49.152 MHz and support for a wide voltage range (2.0V to 5.5V), it is perfectly suited for a variety of portable and industrial applications.

Superior Computing Performance and Development Flexibility

The microcontroller features 320 KB of embedded Flash memory, along with an additional 6 KB that can be configured as a bootloader for In-System Programming (ISP). With 18 KB of SRAM, it provides ample memory for real-time data processing and embedded control tasks. The In-Circuit Programming (ICP) capabilities allow developers to update voice content efficiently, even after the device has been deployed in the field.

Powerful Analog Integration: Designed for Precision Measurement

A standout feature of NSC128L42 is its comprehensive analog capability, making it ideal for high-precision sensing applications. The device integrates a 24-bit Sigma-Delta ADC for ultra-high-resolution signal acquisition, complemented by a 12-bit SAR ADC for faster general-purpose conversions. Additional analog components, including a low-noise amplifier and an operational amplifier, enhance signal integrity and reduce the need for external circuitry. These features make NSC128L42 particularly suitable for applications such as blood pressure monitors, precision scales, and various measurement devices.

Rich Peripheral Connectivity and Smart Audio Support

In addition to its analog strengths, NSC128L42 provides a rich set of digital peripherals, including multiple UART interfaces, SPI and SPIM communication modules, and a six-channel Peripheral Direct Memory Access (PDMA) controller for efficient data handling. It also incorporates three 16-bit timers and PWM outputs to support a wide range of control applications. An integrated LCD driver supports various COM/SEG configurations, enabling direct connection to segment displays and reducing overall system cost.

For applications requiring audio functionality, the device includes a Class-D speaker driver capable of delivering up to 0.35W output at 3.6V, allowing for voice manual, audio alerts or voice assistance to increase the user’s experience.

Low Power Design and Industrial-Grade Reliability

Power efficiency remains a key focus in the NSC128L42 design. The microcontroller supports multiple low-power modes, including a Deep Power Down mode that consumes less than 1 µA. An internal low-speed RC oscillator enables periodic wake-up, allowing the system to monitor events while maintaining ultra-low energy consumption. Reliability is further enhanced through features such as a built-in Brown-Out Detector and an operating temperature range of -40°C to 85°C. With its combination of precision analog integration, flexible connectivity, and low-power operation, NSC128L42 provides an ideal platform for developers targeting smart measurement, medical, and industrial applications.

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A breakthrough could lead to huge breakthroughs in battery performance, as per scientists. The findings, from researchers at Dundee and Warwick universities, could lead to the development of batteries for electronics and vehicles that charge faster, last longer, and are safer to use. The researchers say that for the first time they have identified the key role oxygen plays in storing and releasing a battery’s energy.

Previously thought that during the charging process, much of the activity happens in metal elements inside the battery, such as nickel, cobalt, or iron, and that oxygen in the battery was “passive”. However, the team said advanced computer modelling and laboratory experiments have shown that oxygen plays a much more active role in the charging and discharging process.

Dr Hrishit Banerjee, a theoretical physicist at Dundee’s faculty of science, engineering and business, said: “Global populations have become increasingly reliant on renewable energy technologies and advanced energy storage systems, from everything from the mobile phones in our pockets to the cars we drive. “By improving our knowledge of what is occurring at a tiny, atomic level within batteries, we can make big leaps in improving their performance in the real world.

This has made understanding the technology underpinning electronic processes inside battery materials increasingly important. This research is crucial and showcases a new understanding of how batteries function at a fundamental level. The study compared two of the main lithium-ion battery cathodes in daily use, phosphates and layered oxides.

Together, these forms of batteries are used for a host of applications, including electric vehicles and portable electronics such as mobile phones and laptops. The study found that while phosphates showed little oxygen participation, the layered oxides showed “significant” electron extraction from oxygen. Current technologies are limited by the understanding of the underlying physics of how and why batteries fail over time. This general framework will help design batteries with much longer lifetimes.

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The global tech supply chain is undergoing a massive structural realignment, and India is positioning itself to be more than just a destination for product assembly. In a significant move to bolster the nation’s hardware and clean-tech ecosystems, Uttar Pradesh Chief Minister Yogi Adityanath officially laid the foundation stone for major manufacturing facilities, led by Amber, Ascent, and SAEL Industries Limited. Their goal is to develop a manufacturing capacity of 6 gigawatts for solar cells and 5 gigawatts for solar modules from this plant. This development marks a critical transition from local product assembly to deep-tier component manufacturing, and the production of green technology is a fundamental requirement for true technological self-reliance.

Speaking at the inauguration ceremony, Chief Minister Yogi Adityanath said that the vision is to transform India into a global hub for electronic components manufacturing. ‘The goal is to transform India into a hub for electronic components, and this very vision has brought us to where we stand today, a moment that brings joy to us all.’

Expanding the Grid: Mass-Scale Solar and Component Infrastructure

While the state is aggressively pushing toward general electronics production, a massive anchor of this new manufacturing hub is dedicated to renewable energy hardware. The newly initiated plants are targeting staggering production capacities to fuel both domestic infrastructure and global markets:

• Solar Cell Production: The facility is designed to scale up to a manufacturing capacity of 6 Gigawatts (GW) for solar cells.
• Solar Module Assembly: Alongside the cells, the plant will house a 5 Gigawatt (GW) capacity line for fully fabricated solar modules.
• Upstream Electronics: By focusing on core electronic components and advanced fabrication alongside partners like Amber and Ascent, the hub addresses critical raw hardware gaps in India’s tech supply chain.

The launch also coincided with the inauguration of the “Pandit Deendayal Upadhyaya Training Mega-Campaign,” a structured initiative designed to upskill local workers and prepare engineers to operate these highly automated facilities. As these production lines spin up, the project provides a vital sandbox for localized engineering talent, ensuring that the youth of Uttar Pradesh are positioned to lead the region’s emerging green economy.

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New episodes highlight how the latest electronics are enabling sustainable design across industries

DigiKey, the global distribution leader of electronic components and automation products, announces the release of the second season of its Sustainable Futures video series, which examines how advanced electronics, from infrastructure to intelligence, are enabling cleaner energy, smarter systems, and more sustainable design across industries. DigiKey releases the second season of its Sustainable Futures video series, which explores the components and technologies behind efficient power systems. 

Sustainable Futures, sponsored by Harwin and Analog Devices, highlights the components and technologies behind efficient power systems, intelligent infrastructure, and reliable performance in demanding environments. From high-performance signal processing and energy management to rugged interconnects and advanced materials, these solutions enable engineers to design systems that are more efficient, scalable, and resilient. The series also explores how these technologies support real-time decision-making, improve system reliability, and help bring sustainable innovations from concept to deployment.

“In season two of Sustainable Futures, we examine how advanced electronics are driving cleaner energy, smarter infrastructure, and meaningful real-world impact,” said Ken Paxton, director, advanced semiconductor for DigiKey. “The team at DigiKey is encouraged by the work our partner organizations are doing to shape the technologies that will help build a sustainable future for all.” 

“Sustainability is a journey, and as expectations evolve, companies are increasingly expected to reflect the values of their customers and partners,” said Ryan Smart, vice president of product for Harwin. “Harwin is proud to provide leading-edge interconnect technology that supports more efficient, reliable, and sustainable solutions across a wide range of applications.”

“The modernization of the power grid is among the most demanding engineering challenges of our time, requiring breakthroughs in power conversion, real‑time sensing, and system‑level intelligence,” said David Andeen, senior director, business development & marketing for Analog Devices. “Analog Devices is proud to contribute to this transformation through our high‑performance power solutions.”

Episode 1: “Intelligence That Drives Efficiency” – This episode examines how renewable energy generation, smart grid infrastructure, and intelligence at the edge work together to create more efficient, resilient, and adaptive energy systems. Analog Devices’ technology enables innovation at every stage, providing system-level intelligence for measurement, control, and real-time optimization. 

Episode 2: “Building the Backbone of Electrification” – This episode looks at how EV charging infrastructure and material innovations contribute to sustainable transportation and energy systems. Harwin highlights how high-reliability interconnects and eco-friendly materials enable safe, durable, and efficient solutions that can be deployed at scale.

Episode 3: “Shaping What Comes Next” – The final episode looks ahead to the future of sustainable electronics, where AI, advanced materials, and sustainable manufacturing converge. It connects hardware, intelligence, and collaboration into a unified vision for how the industry can scale sustainable innovation over the next decade. 

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Arrow Electronics and STMicroelectronics (ST) unveil a new industrial Autonomous Mobile Robot (AMR) reference platform to shorten the path from concept to deployment for professional service robots.

Autonomous mobile robots are rapidly transforming factories, laboratories, warehouses, and logistics centers. These robots must safely navigate dynamic environments, localize accurately indoors, manage energy efficiently, and integrate advanced perception and artificial intelligence, while meeting demanding reliability and time-to-market requirements. Many robotics original equipment manufacturers (OEMs) and integrators struggle to assemble, validate, and industrialize these complex subsystems independently.

“This solution brings together the performance, flexibility, and pre-validated integration robotics customers need to move faster from development to deployment, while giving them a scalable foundation that can address a broad range of industrial and commercial robotics applications,” said Shelby Schnurrenberger, vice president of supplier management, global semiconductor, Arrow Electronics.

“ST’s broad industrial portfolio is a natural fit for autonomous mobile robot applications, where reliability, performance, and scalability are essential. By combining our technologies with Arrow’s engineering services, we are helping customers turn innovative robotic concepts into industrial-ready solutions. Together, we can accelerate the development of the next generation of AMRs for the market,” said Allan Lagasca, application director of robotics segment strategic program (SSP), smart industrials segment leader, STMicroelectronics.

To address this challenge, Arrow and eInfochips worked with ST to deliver a fully functional AMR kit built on a complete ST bill of materials, tightly integrated with an NVIDIA Jetson Orin Nano–based compute platform and NVIDIA ROS 2 software stack. Arrow and eInfochips contribute their proven Rover mechanical platform and system integration expertise, while ST provides a comprehensive portfolio of industrial-grade components and reference designs.

The new AMR reference kit combines the following features:

• Robust power and battery management for 24V operation, with a pre-validated path to 48V architectures
• STM32-based real-time controller board, acting as a powerful interface between the NVIDIA platform and the robot’s sensors and actuators
• Advanced motion control, including dual BLDC motor drives based on STSPIN32 and STDRIVE devices for precise, smooth navigation
• Rich sensing for perception and safety, using ST MEMS IMUs, magnetometers, and environmental sensors, complemented by lidar and vision inputs for SLAM-based mapping and navigation
• Industrial ROS 2 software integration, enabling mapping, localization, and autonomous navigation with standard tools such as Cartographer, NAV2, and RViz ROS 2

 The new platform offers a robust, pretested system-level design that significantly reduces development risk, integration effort, and time to market. Robot manufacturers and system integrators can start from a working, realistic AMR including chassis, electronics, and software—and then rely on engineering services from Arrow and eInfochips to customize mechanics, features, and cost-optimized designs, while ST provides a one-stop, complete bill-of-materials solution with long-term product support. This cooperation enables the AMR ecosystem to move faster from prototype to production, helping customers deliver safer, smarter, and more efficient mobile robots for industrial and commercial environments worldwide.

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Vishay Intertechnology, Inc. introduces a new Automotive Grade phototransistor optocoupler to deliver signal transmission with high galvanic isolation for electric vehicles (EV), including emerging 800 V battery architectures, and industrial automation systems. The Vishay Semiconductors VOLA617A combines an isolation voltage of 5000 VRMS with a VIORM of 1414 Vpeak and VIOTM of 8000 Vpeak in a 4-pin LSOP low-profile package.

The device released today is ideal for grid-connected on-board chargers (OBC), DC/DC converters, battery management systems (BMS), isolated wake-up signals, and any system control with galvanic and noise isolation. While most automotive optocouplers can not be used for battery voltages exceeding 500 V, this limits them to traditional 400 V EV platforms. VOLA617A isolates DC voltages up to 1000 V and enables its use in next-generation high-voltage EV architectures.

The VOLA617A consists of an infrared-emitting diode, optically coupled to a silicon planar phototransistor detector in a low-profile package with creepage and clearance distances of ≥ 8 mm. The device is available in four current transfer ratio (CTR) ranges and features a high 80 V collector-emitter voltage rating, allowing for more design flexibility.

The optocoupler operates over a wide -40 °C to +125 °C temperature range with a junction temperature capability up to +145 °C while providing low coupling capacitance of 0.5 pF and high common mode transient immunity. Exceeding requirements for Automotive Grade performance and reliability, the VOLA617A’s robust package provides an extra safety margin by meeting dual AEC-Q102 qualification standards. The device is RoHS-compliant, halogen-free, and Vishay Green.

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 The DSA504RT delivers high-performance timing and integration at a cost-efficient price point

Spacecraft timing systems must provide highly stable, precise signals for navigation, communications, and scientific instruments, even when GNSS signals are weak or unavailable. Designers often rely on multiple oscillators and buffers to supply precise frequencies to various subsystems, adding size, mass, and complexity. Microchip Technology announces the space-grade DSA504RT, a radiation-tolerant, six-output programmable clock generator for addressing the complex timing needs of aerospace and defense applications. 

The DSA504RT streamlines timing architecture by generating multiple clean, phase-aligned frequencies from a single master source. Additionally, this solution reduces the need for multiple discrete oscillators, lowers overall component count, and improves system failure in time (FIT) rate. It also reduces power consumption and mass, as well as simplifies distribution networks to keep all subsystems synchronized even in the harshest environments and during GNSS outages or disruptions.

Analog Phase-Locked Loop (APLL) features spread spectrum capability, two fractional and two integer dividers, and six highly configurable output buffers, each of which can be configured as a differential driver (LVPECL, LVDS, or HCSL) or as a pair of single-ended CMOS outputs. The DSA504RT delivers ultra-low jitter performance as low as  200 femtoseconds (12kHz–20MHz) and is compliant with PCIe Gen 1-7 standards. This level of integration allows engineers to replace multiple crystals, oscillators, and buffers with a single device, improving design reliability, reducing Bill of Materials cost, and design complexity.

“This Microchip clock generation device is a game-changer for space applications. It can offer a comprehensive clock tree solution, producing three different clock families and up to six different frequencies, each buffered on a variety of selectable output drive types,” said Maamoun Abou Seido, appointed vice president of Microchip’s timing communications group. “Replacing numerous oscillators, buffers, and synthesizers, the DSA504RT saves board space and reduces part count to improve the system’s Failures in Time (FIT) rate in these high-reliability applications.”

The DSA504RT, offered in QFN28 and CQFP32 packages, serves as a companion device for complex aerospace and defense systems. It enables high integration of clock architectures within a single chip, distributing precise timing references to subsystems built around radiation-tolerant or radiation-hardened FPGAs and MCUs.

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VL53L9 is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2.3K zones, a wide field of view, on-chip processing, 100 frames per second, and a sensing range from 5 centimeters to 9 meters. It meets the evolving needs of customers and partners across diverse industries, including robotics, industrial automation, smart buildings, AR/VR, and healthcare.

The global semiconductor leader serving customers across the spectrum of electronic applications announces the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small microcontrollers (MCUs) and high-performance sensing across a wide range of applications across robotics, industrial automation, smart buildings, AR/VR, and healthcare.

“VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “This launch reflects our strategy to move beyond standalone sensors and deliver integrated sensing systems that support real-world edge AI.”

“3D sensing demand accelerates across robotics, industrial automation, XR, and intelligent consumer devices. Time-of-Flight technology is expanding beyond smartphones into applications requiring compact, affordable, and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multizone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption(1),” said Anas Chalak, Market & Technology Analyst at Yole Group.

 

ST FlightSense VL53L9 is designed for multiple industry use cases:

• Robotics: enhances small-object detection, SLAM (Simultaneous Localization and Mapping), and obstacle avoidance for autonomous navigation.
• Industrial automation: accurate volume measurement in tanks and bins, improving operational efficiency and inventory management.
• Smart buildings and homes: reliable human presence detection and people counting while preserving user privacy.
• AR/VR and consumer electronics: advanced gesture recognition, body tracking, and finger skeleton for immersive user experiences.
• Healthcare: fall detection and monitoring solutions for eldercare and patient safety.

Technical Information

Enhancing 3D sensing with precision and efficiency

The VL53L9 offers the 2,268 resolution zones (54×42) with a wide 54°x42° field of view, enabling detailed 3D depth mapping and precise detection of small objects, contours, and edges. Leveraging ST’s proprietary stacked BSI SPAD sensor technology and innovative metasurface optical elements (MOE), the module delivers fast and accurate ranging from less than 5 cm up to 9 meters with up to 1% accuracy and a frame rate of 100 frames per second.

All-in-one sensing data for edge AI and easy integration

The VL53L9’s dual-scan flood illumination replaces traditional dot scanning, reducing motion artifacts, eliminating dead zones, improving small-object detection, and capturing complementary 2D infrared and 3D depth images. In contrast to competition, this greatly simplifies post-processing and enables a broad range of edge AI use cases to run efficiently on small MCUs with low compute requirements. The all-in-one module further integrates on-chip dToF processing, a dedicated power management IC, and is fully calibration-free, simplifying integration and reducing system cost and complexity.

Compact form factor

Measuring just 12.8 mm x 6.1 mm x 4.6 mm, the VL53L9 is a reflowable, single-component module compatible with a wide range of cover glass materials. It supports dual-power-supply operation (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces, ensuring compatibility with diverse CPU architectures. The module is certified as Class 1 laser safe, providing reliable and secure operation for end users.

For more information, visit the VL53L9 product page: https://www.st.com/vl53l9cx

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SmartController from GÖPEL electronic offers a framework and versatile interfaces for controlling demanding tests, demonstrations, and laboratory applications

In the automotive sector, individual components such as vehicle seats often need to be tested or demonstrated independently of the overall configuration to ensure functions such as adjustment ranges, massage, heating, and ventilation. However, the control elements and power supply configured for the final vehicle are not available for this purpose. GÖPEL electronic has developed the SmartController for this application. This universal control solution is designed for demanding individual or endurance tests, presentations, and functional demonstrations, as well as laboratory applications. The powerful platform combines modern hardware, flexible software architecture, and intuitive operating concepts in a compact system.

The SmartController is based on the proven Serie62 G CAR 6281 hardware platform and offers a modular architecture with versatile interfaces. With this, GÖPEL electronic has created a universal hardware foundation that can be used across projects and customized as needs a clear advantage for test environments with changing requirements. Thanks to its high scalability, the SmartController supports up to eight bus interfaces, providing comprehensive support for automotive communication standards such as CAN, CAN-FD, LIN, and Automotive Ethernet, including residual bus simulation, diagnostics, and monitoring. The integrated Ethernet and Wi-Fi connectivity enables seamless networking and easy integration. This makes the SmartController suitable for both long-term endurance tests and dynamic development and presentation environments.

A key feature is the tablet control framework, which enables modern and convenient operation. Its uniform structure allows for use in various projects while maintaining a consistent user experience. Features such as the “Sticky Keys” input assistance (“Touch ’n’ Click / Make ’n’ Break”) support ergonomic and safe operation regardless of the hardware used. With the SmartController, GOEPEL electronic underscores its commitment to providing future-proof, modular, and practical solutions for vehicle development and industrial test applications.

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AEC-Q102 Qualifies Devices Feature Spectral Sensitivity Matches to Human Eye and Improves Spectral Angular Performance in Compact 0805 and Top-View QFN Packages

Vishay Intertechnology, Inc. expands its optoelectronics portfolio with the introduction of two Automotive Grade PIN photodiode ambient light sensors that deliver enhanced optical accuracy and long-term reliability in harsh environments. AEC-Q102 qualifies; the Vishay Semiconductors VEMD4210FX02 and VEMD5525FX02 feature spectral sensitivity closely matched to the human eye response with a peak wavelength of 530 nm and no infrared (IR) bump.

The devices are designed for automotive applications, including automatic light control in Center Information Displays (CID), Head-Up Displays (HUD), and Rain Light Tunnel (RLT) systems, as well as backlight dimming in industrial equipment. By eliminating the IR bump in the spectral sensitivity curve, the devices ensure precise visible light measurement without unwanted IR influence in these applications. In addition, the devices’ superior angular characteristics ensure stable spectral accuracy regardless of the angle of incoming lighting for consistent and reliable light measurement performance.

For space-constrained applications, the VEMD4210FX02 offers a typical reverse-light current of 0.014 μA and a sensitivity range from 470 nm to 610 nm in a compact 0805 package with a radiant-sensitive area of just 0.42 mm². For applications requiring enhanced sensitivity, particularly in low-light conditions, the VEMD5525FX02 offers a reverse-light current of 0.11 μA and a sensitivity range from 480 nm to 590 nm in a top-view QFN package with a large 7.5 mm² radiant-sensitive area. Both parts also feature wettable flanks for optical solder joint inspection.

RoHS-compliant, halogen-free, and Vishay Green, the sensors feature a moisture sensitivity level (MSL) of 4 in accordance with J-STD-020 for a floor life of 72 hours. The devices support lead (Pb)-free reflow soldering and operate over an ambient temperature range of -40 °C to +110 °C.

 

Device Specification Table:

Part number	VEMD4210FX02	VEMD5525FX02
Typical reverse light current at EV = 100 lx (µA)	0.014	0.11
Angle of half sensitivity (°)	± 52	± 58
Range of spectral bandwidth (nm)	470 to 610	480 to 590
Wavelength of peak sensitivity (nm)	530	530
Package	0805	Top-view QFN
Dimensions (mm)	2.0 x 1.25 x 0.7	5.0 x 4.0 x 0.9
Radiant sensitive area (mm²)	0.42	7.5

 

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DigiKey, the global distribution leader of electronic components and automation products, showcases its commitment to innovation and customer engagement at electronica Shanghai 2026.

DigiKey features an “in the wild” brand experience with in-booth and online giveaways, live demonstrations, hands-on workshops, and a live DigiKey Moment interview series featuring leading suppliers such as Analog Devices, Molex, Omron, NXP, TE Connectivity, YAGEO, and STMicroelectronics. These dynamic interviews are accessible to online audiences via DigiKey’s Bilibili channel and focus on trending topics in robotics and AI that are shaping the industry’s future.

“DigiKey is excited to participate in electronica Shanghai 2026 and meet face-to-face with our customers while offering insights and support to engineers, builders, and designers in China and beyond,” said Dave Doherty, DigiKey CEO. “In particular, our DigiKey team is thrilled to present an immersive ‘in the wild’ booth experience that celebrates the people and technology shaping our industry.”

Attendees get the opportunity to engage directly with DigiKey’s customer and application experts on-site. The DigiKey fulfillment zone also offers attendees the opportunity to sign up for a chance to win a box featuring one of five component-shaped pouch designs, with winners selected at random during the show.

DigiKey hosts The Powerhouse Panel, featuring an exclusive discussion with technology experts and industry leaders from Microchip, Molex, and NXP. Additionally, a central product showcase wall highlights a curated gallery of current electronics trends, including AI, robotics, sensing, connectivity, and power solutions from DigiKey’s supplier partners.

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Infineon Technologies AG and Amazon Web Services (AWS) to accelerate microcontroller (MCU) evaluation to shorten development cycles for automotive systems. As part of this collaboration, Infineon is launching a cloud-based platform for virtual evaluation of Infineon automotive MCUs, powered by AWS. The new platform removes dependency on physical hardware, helps to reduce evaluation cycles from multiple weeks to minutes, and significantly lowers evaluation cost per user, while supporting hundreds of concurrent users globally. The platform already includes Infineon’s next-generation RISC-V architecture.

“Development speed is a decisive competitive factor for the automotive industry and has become even more important with software-defined vehicles,” said Thomas Schneid, Vice President Software, Partner & Ecosystem Management at Infineon Technologies. “While hardware-dependent MCU evaluation has been a bottleneck for many engineering teams, our cloud-based platform is making it significantly easier for customers to get hands-on with our microcontrollers early in their development cycle. This is particularly helpful when evaluating entirely new MCUs such as our future RISC-V-based family.”

The new platform is based on the Virtual Engineering Workbench, an AWS open-source offering for automotive and manufacturing customers for digital toolchains, hardware virtualization, and infrastructure management. Infineon’s semiconductor expertise delivers a comprehensive, cloud-native virtual MCU evaluation experience. A browser-based interface eliminates local tool installation and provides a consistent workflow across operating systems, while isolated cloud environments help ensure users can experiment without impacting others. Users receive immediate feedback throughout their MCU evaluation journey.

The platform supports two primary workflows. Quick Mode enables rapid testing using pre-configured reference applications for immediate validation of MCU capabilities. Expert Mode provides a full in-browser virtual machine development environment, including compilation, flashing, debugging, and performance analysis, enabling experienced embedded developers to move from evaluation to deeper prototyping without locally installed tool chains.

The platform also introduces automation for Infineon product teams to package and release new MCU variants with minimal effort, making them available for customer evaluation instantly. Usage tracking provides insights into which MCUs and applications are evaluated most frequently, helping to optimize future product planning.

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India’s electronics manufacturing ecosystem reaches a critical inflection point, formalizing its position as the world’s sixth-largest electronics exporter, Union Minister Ashwini Vaishnaw highlights this milestone.

The scaling of India’s domestic manufacturing capacity is part of a broader macroeconomic strategy aim at capturing secondary placement in the global electronics export hierarchy. Expanding the Semiconductor and Components Value Chain to mitigate supply chain vulnerabilities and increase Domestic Value Addition (DVA), the government is pivoting from simple assembly to deep-tech infrastructure. A core pillar of this transition is the acceleration of the domestic semiconductor Fab and ATMP (Assembly, Testing, Marking, and Packaging) ecosystem. Two semiconductor fabrication plants are currently under active construction, with structural frameworks for two additional facilities slated to break ground by the end of the standard fourth quarter. Integration verticality is being expanded in the Pune cluster with upcoming facilities dedicated to the fabrication of high-tolerance mechanical precision parts, a critical move to localize the component supply chain for semiconductor and aerospace hardware.

To further strengthen the electronics ecosystem, the government is accelerating semiconductor development, with two semiconductor plants currently under construction and two more expected to be added by the end of the year. Moreover, the statement outlined that plans are underway to begin manufacturing mechanical precision parts in Pune, enhancing domestic capabilities across the electronics and semiconductor value chain. Maharashtra is emerging as a key beneficiary of this growth, aided by investor-friendly reforms and robust infrastructure, nearly 60% of India’s data centre capacity is located in Maharashtra, reinforcing its status as a leading technology investment destination. The statement also underscores that the Mumbai-Ahmedabad Bullet Train and the upcoming Wadhvan Port project are set to boost logistics efficiency, trade, exports, and industrial development while creating one of India’s most significant economic corridors.

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Mordor Intelligence publishes its latest analysis of the semiconductor industry, highlighting sustained expansion driven by artificial intelligence infrastructure, electric vehicle adoption, advanced packaging technologies, and increasing investments in domestic chip manufacturing ecosystems.

According to the industry analysis, the semiconductor industry size stands at USD 0.74 trillion in 2026 and is projected to reach USD 1.01 trillion by 2031, registering a CAGR of 6.42% during the forecast period. Market estimates indicate that rising demand for AI processors, high-bandwidth memory, automotive electronics, and edge-computing devices will continue to strengthen the global semiconductor market over the next five years.

According to reports, the growing integration of semiconductors across data centers, connected vehicles, industrial automation, consumer electronics, and telecommunications is creating new revenue streams. The evolving competitive landscape, supported by government-backed manufacturing initiatives and supply-chain diversification strategies, is expected to accelerate semiconductor industry growth while reshaping the global value chain. Semiconductor Industry Trends Reshaping Global Technology Markets

Vehicle Electrification Creating New Semiconductor Opportunities

The transition toward electric and software-defined vehicles is increasing the need for an advance semiconductor components across automotive systems. Modern vehicles rely on chips for power management, connectivity, safety features, and autonomous driving capabilities. As automakers continue integrating smarter technologies and over-the-air update capabilities, demand for automotive semiconductors is expected to remain a key growth driver for the industry.

Ashish Gautam, Senior Research Manager, Mordor Intelligence, says, “As the semiconductor industry continues to evolve alongside advances in artificial intelligence, automotive electronics, and high-performance computing, decision-makers require research that combines transparent sourcing with consistent market assessment. Mordor Intelligence applies a structured methodology designed to provide a balanced view of industry developments, competitive activity, and the factors influencing market growth.”

AI Infrastructure Driving Advanced Chip Demand

The rapid expansion of artificial intelligence applications is creating strong demand for advanced processors, memory solutions, and specialized chips used in data centers. As cloud providers and technology companies continue investing in AI infrastructure, semiconductor manufacturers are benefiting from increased demand for high-performance computing components, supporting sustained growth across the industry.

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DigiKey, the global distribution leader in electronic components and automation products, announces its sponsorship of the AIoT Design Challenge 2026, an initiative towards fostering innovation at the intersection of Artificial Intelligence and the Internet of Things (AIoT).

The DigiKey AIoT Design Challenge 2026 aims to provide participants with a rewarding innovation journey. Registered participants will receive exclusive access to essential resources, including development board details, specifications, idea submission samples, project article guidelines, and curated learning videos, ensuring they are fully equipped to bring their ideas to life.

Participants will have a chance to win cash prizes and development boards if their ideas are selected, including featured supplier boards from Analog Devices, Arduino, and M5Stack. Cash prizes will include ₹1,00,000 for first place, ₹30,000 for second place, ₹20,000 for third place, and 15 projects will be selected as “most popular” projects and awarded ₹5,000 each. In addition, participants who submit a qualified project abstract will be awarded a Certificate of Participation, recognizing their effort and initiative in the competition.

“DigiKey is excited to sponsor the AIoT Design Challenge 2026 and support the next generation of innovators exploring the possibilities of AI and IoT,” said Ben Brookes, director of regional marketing for DigiKey. “We are eager for participants to develop impactful, real-world solutions that push the boundaries of connected technology and inspire innovation across industries.”

Beyond monetary rewards, the competition offers unparalleled industry exposure. Winning projects will receive editorial coverage on ElectronicsForU.com, including a dedicated author page, and promotion across EFY’s extensive digital platforms, reaching an audience of over 5 million industry professionals.

The industry experts evaluate all submissions. Projects will be judged based on creativity and innovation, effective use of bill of materials sourced from DigiKey, quality of documentation, real-world applicability, and the strength of video demonstrations. This ensures a fair and thorough assessment while encouraging participants to develop well-rounded, impactful solutions.

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Devices Deliver Over 1 kΩ Impedance to Filter Noise Above 10 MHz, Soft Saturation for Stable Inductance, +180 °C Continuous Operation, and Enhanced Resistance to
Shock and Vibration

Vishay Intertechnology, Inc., introduces the first four devices in its new IHDV line of high voltage power inductors for next-generation automotive, energy, and industrial systems. Engineered for designs requiring 1.5 kV isolation voltages, and available in compact 0808 (20 mm x 14 mm x 14 mm) and 1008 (25 mm x 20 mm x 23 mm) case sizes. The Automotive Grade IHDV-0808AC-3A and IHDV-1008BB-3A and commercial IHDV-0808AC-30 and IHDV-1008BB-30 combine continuous high temperature operation to 180 °C with soft saturation performance.

To extend the voltage capability beyond the 350 V typical of existing inductors, the Vishay Dale devices release an incorporated PET plastic coilform insulator that supports 1.5 kV isolation voltage. Enabled by a powdered iron alloy core, their soft saturation behavior allows inductance to remain stable under load for effective ripple current regulation, while withstanding transient in-rush currents up to five times their heat rating current.

For high frequency filtering, the IHDV devices deliver significantly higher impedance than similarly sized iron composite inductors. The 0808 models provide impedance of 1 kΩ at a peak frequency of 80 MHz, while the 1008 models deliver 2.8 kΩ at 25 MHz, three times the impedance of similar inductors at four times the frequency. Typical applications for the devices include on-board chargers, battery-charging circuits, power factor correction (PFC), and high-voltage DC battery filtering.

The IHDV-0808AC-3A and IHDV-0808AC-30 offer a compact, surface-mount footprint roughly one-third the volume of the 1008 model, while the advantage of the larger IHDV-1008BB-3A and IHDV-1008BB-30 is the through-hole terminations that deliver maximum mechanical strength in rugged environments. RoHS-compliant, halogen-free, and Vishay Green, all four devices incorporate additional support pins to increase resistance to shock and vibration. In addition, the automotive IHDV-0808AC-3A and IHDV-1008BB-3A are AEC-Q200.

Device Specification Table:

Part number	IHDV-0808AC-3A	IHDV-0808AC-30	IHDV-1008BB-3A	IHDV-1008BB-30
Dimensions (mm)	20 x 14 x 14		25 x 20 x 23
Inductance (µH)	1.9		10
DCR typ. (mΩ)	1.3		2.7
DCR max. (mΩ)	1.5		2.9
Heat rating current typ. (A)(1)	30.0		30.0
Saturation current typ. (A)(2)	110		68
SRF typ. (MHz)	83		22
AEC-Q200	Yes	No	Yes	No

(1) DC current (A) that will cause an approximate ΔT of 40 °C

(2) DC current (A) that will cause L0 to drop approximately 30 %

 

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