ELE Times

As AI infrastructure, industrial robotics, battery management systems (BMS) and advanced power electronics drive increasing power density and efficiency requirements, accurate current sensing is becoming increasingly critical. According to market analyses, the global current-sense resistor market is projected to expand at a CAGR of approximately 6% through the coming years, reflecting growing demand across battery management, motor control and power conversion applications.

At the same time, engineers are under increasing pressure to improve energy efficiency and reduce system costs while maintaining measurement accuracy in higher power designs. To address these challenges, Panasonic Industry offers its Thick Film Current Sensing Resistors as a cost-effective alternative to conventional metal shunt resistors for selected low- and medium-current sensing applications.

Current sense resistors play a vital role in measuring electrical current and enabling its monitoring and control in applications ranging from AI server power systems and industrial robotics to battery management systems, DC/DC converters, motor drives and advanced power supplies. Accurate current detection and control support improved system performance, system protection and higher energy efficiency.

Traditionally, metal shunt resistors have been widely used for current sensing, particularly in applications requiring very low resistance values and high power-handling capabilities. However, not all current-sensing applications require ultra-low resistance values or the highest power ratings. In low- and medium-current designs with suitable electrical and thermal requirements, thick film current sense resistors can provide the required sensing performance while helping to reduce component cost.

Panasonic’s Thick Film Current Sense Resistors support efficient and accurate current measurement in low- and medium current applications where low resistance, thermal stability and cost efficiency are key design considerations. By combining advanced resistor materials, optimized trimming technology and different structural designs, including double-sided resistor structures and wide-terminal designs, Panasonic offers resistance values down to 10 mΩ, with stable resistance performance over temperature and TCR values as low as ±75ppm/°C in selected series.

A key challenge in current sensing is balancing low resistance with a low temperature coefficient of resistance (TCR), as these requirements typically involve a trade-off. Panasonic addresses this challenge through optimized resistor materials and component structures that support accurate current measurement, low power loss through low resistance values, improved heat dissipation and reduced temperature-induced drift.

For engineers working within the operating range in which thick-film and metal-shunt technologies overlap, Panasonic’s Thick Film Current Sensing Resistors offer several important advantages:

• Potential component cost savings of up to 50% compared with selected comparable metal shunt solutions in suitable applications*
• Improved heat dissipation through optimized component design, such as wide-terminal structures and double-sided resistive element structures, helping to lower operating temperatures and enhance thermal performance.
• Enhanced reliability under thermal cycling, supported by soft termination technology that helps reduce solder-joint stress.
• Supports accurate current sensing with resistance values down to 10mΩ, stable resistance performance over temperature and TCR values as low as ±75ppm/°C in selected series.
• Simplified migration through footprint-compatible designs available in selected case sizes, supporting the replacement of metal shunt resistors within the overlapping operating range.

Panasonic’s Thick Film Current Sense Resistors are already proven in customer applications and are particularly suited to AI infrastructure, robotics, battery management systems, motor control, power supplies and industrial automation systems, where designers seek to optimize both cost and performance.

As designers look for ways to improve efficiency, reduce thermal stress and manage bill-of-materials costs, Panasonic’s Thick Film Current Sensing Resistors offer a practical, cost-effective option for low- and medium-current sensing applications that require accurate measurement, thermal stability and reliable performance.

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MongoDB, Inc. today announced at MongoDB .local Build Fest that MongoDB’s intelligent data platform is now available natively inside the AI tools developers use to build applications. Available today, MongoDB Atlas Managed MCP Server is a fully hosted way to connect agents to Atlas without running additional infrastructure. Builders can now easily add MongoDB Atlas to Claude Code, Codex, Grok Build and Devin. Everything announced today is available now, and teams can get started with Atlas for free at mongodb.com/atlas.

“The AI tools teams reach for keep changing, so our approach is to make sure MongoDB is present in all of them, whether a team is working in Claude or Codex, or running an agent in production. More of that building is now done by agents, and neither the agent nor the developer has to stop and set up a connection, so applications come together faster,” said Pablo Stern-Plaza, Chief Product Officer, AI and Emerging Products, MongoDB.

With the new connectors, MongoDB is available natively across the tools where software is built. Ask questions of data in plain language in ChatGPT, Claude, and Grok. Query, inspect, and update data in MongoDB as work happens, with coding agents like Claude Code, Codex, Grok Build and Devin. And builders can also see live MongoDB data while generating an app in an IDE like Cursor.

Getting connected with these tools takes only a few clicks. Find the MongoDB connector in the tool’s marketplace and authorize it, with no connection string to paste and no infrastructure to configure. Once connected, the tool can list collections and indexes, query and aggregate data, and inspect schemas—and with the right permissions—can also create collections or manage indexes.

Introducing the MongoDB Atlas Managed MCP Server

Running an agent in production means connecting it to real operational data and agent memory, and until now, teams had to build and maintain that connection themselves. MongoDB’s MCP server already sees more than 30,000 installs a week. Starting today, the MongoDB Atlas Managed MCP Server is remote and fully hosted, running as a service inside Atlas, so there is nothing for a team to install, operate, or upgrade. Teams connect using the same credentials and access controls they already use with Atlas, so administrators can govern how agents access operational data from one place.

“Developers want their AI tools to connect with the context and systems they already rely on,” said Vibhor Chhabra, Product Lead for ChatGPT Ecosystem at OpenAI. “MongoDB’s plugin in ChatGPT makes it easier to access and work with live application data, helping developers move faster while staying grounded in the context of their applications.”

“We’re in the golden age of software engineering. The scope of what one engineer can build has exploded, and the unlock is agents working with real context,” said Russell Kaplan, President at Cognition, the company behind Devin. “By connecting Devin to MongoDB Atlas, engineers can hand off well-scoped tasks knowing Devin is working from live application data, not stale assumptions, and spend their own time on the harder problems.”

MongoDB also announced at Build Fest new capabilities that bring its benchmark-leading Voyage AI retrieval models into the operational database, including Automated Embeddings in MongoDB Atlas powered by Voyage AI, the Atlas Embedding and Reranking API, and voyage-code-4: https://www.mongodb.com/company/newsroom/press-releases/mongodb-atlas-now- delivers-industry-leading-context-retrieval-with-precision-accuracy

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The growing New Space market is fueling demand for smaller, less expensive space hardware to support short-duration missions for applications such as satellite-to-cellular communications, alternative navigation and Earth imaging. Microchip Technology today announces it expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems. The device provides a compact, low-power alternative to traditional radiation-hardened timing solutions, helping developers reduce size, weight, power and cost while maintaining accuracy.

Building on the heritage of Microchip’s Space CSAC-SA45, the Space CSAC-SA65 extends radiation tolerance to at least 30 kRad and operates in extended temperature ranges from –40°C to +80°C. Consuming less than 120 mW and occupying less than 17 cc of volume, the device is optimized for size-, weight- and power-constrained satellite designs. Its built-in 1 PPS input and output capabilities support synchronization for satellite systems, while its atomic stability enables extended operation without continuous reliance on external timing references such as Global Navigation Satellite System (GNSS) signals.

“By enabling one of the lowest power atomic clocks to thrive in extreme conditions, even the smallest CubeSat can now fly with atomic accuracy,” said Randy Brudzinski, corporate vice president of Microchip’s frequency and time systems business unit. “The Space CSAC-SA65 brings atomic-clock performance to applications where size, weight, power and cost are tightly constrained, helping developers maintain synchronization and timing accuracy even when external timing references are unavailable.”

Manufactured as a Commercial Off-The-Shelf (COTS) product using radiation-tolerant commercial electronic components, the device can offer shorter lead times and lower overall costs compared to traditional space-grade oscillators. Designed for Low Earth Orbit (LEO) missions, the CSAC-SA65 is well suited for applications including satellite timing and frequency control, satellite clock reference, assured positioning, navigation and timing (PNT), and satellite cross-linking.

Microchip offers an extensive portfolio of clock and timing systems, ranging from miniature component oscillators, to small plug-in timing server cards, to multi-rack time scale systems. As a primary contributor to the world’s time, Microchip’s timing solutions are trusted, reliable and resilient. For more information, visit Microchip’s Clock and Timing Systems web page.

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STMicroelectronics has extended the STGAP3S family of gate drivers that feature enhanced galvanic isolation for greater reliability, introducing an efficient and economical 3A series for circuits that need lower drive current. The new STGAP3S3S is optimized for silicon carbide (SiC) MOSFETs, while the STGAP3S3IF is suited to IGBTs.

All STGAP3S drivers work with high-voltage rails up to 1200V in circuits such as power-factor correction (PFC), power supply units, DC/DC converters, and inverters. International safety and insulation certifications, including UL 1577 and IEC 60747-17, independently confirm robust isolation, safe operation, and reliable long-term performance at high voltage.  Typical applications include charging stations, energy-storage systems (ESS), solar inverters, industrial electric vehicles like forklifts, induction heating equipment, and general drives, pumps and fans.

ST’s state-of-the-art reinforced galvanic isolation protects the power-stage circuitry against transients up to 9.6kV and ensures Common Mode Transient Immunity (CMTI) up to 200V/ns. The family contains three series capable of sinking/sourcing up to 10A, 6A, and now 3A, each containing variants optimized for driving IGBTs and silicon-carbide MOSFETs.

The new STGAP3S3 series, with 3A drive strength, integrates the complete active Miller clamp, including clamping MOSFET, to prevent unwanted induced turn-on of the power switch thereby avoiding shoot-through currents. Integrating the MOSFET saves PCB space, simplifies the circuit design, and reduces the bill of materials, while providing suitable clamping performance with gate drive up to 3A. The 6A STGAP3S6 and 10A STGAP3SX series contain a pre-driver for an external MOSFET, giving extra flexibility to optimize the clamping speed in systems with high gate-drive current.

All STGAP3S drivers have desaturation detection with soft turn-off to ensure controlled voltage and current transitions, which protects the power switch during dangerous overload or short-circuit conditions. The 6A and 10A drivers, and the new 3A drivers for SiC MOSFETs, let designers connect an external resistor to optimize the soft turn-off speed.

All devices have diagnostic pins that indicate when desaturation protection, undervoltage-lockout UVLO, and thermal shutdown are active. The drivers allow negative gate voltage that strengthens unwanted turn-on prevention, protects the device during fault turn-off, and ensures robust switching without ringing during normal turn-off transitions.

An evaluation board is available for each STGAP3S driver, including the latest 3A models. These two boards, the EVLSTGAP3S3S and EVLSTGAP3S3IF, are half-bridge boards that come with protection already configured and provide test points and diagnostic LEDs to assist development.

The complete STGAP3S family for driving IGBTs and SiC MOSFETs, including STGAP3S3, STGAP3S6, and STGAP3SX series, is in production now. The drivers are offered in the SO16W wide-body package, from $1.93 for orders of 1000 pieces.

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New TCAN6062 CAN XL transceiver delivers the highest bandwidth and largest payload of any CAN-based network while preserving the advantages of proven CAN protocols.

What’s new?

Texas Instruments (TI) today introduced the industry’s first commercially available CAN XL transceiver, designed to help industrial engineers keep pace with the growing data demands of modern networks. TI’s TCAN6062 Controller Area Network (CAN) extended data-field length (XL) transceiver supports payloads up to 2,048 bytes per frame and data rates as high as 20Mbps, while ensuring that priority messages are delivered first and on time with the performance on which humanoid robots, industrial robots and human-machine interface (HMI) systems depend.

The TCAN6062’s backward compatibility with CAN flexible data rate (FD) and CAN signal improvement capability (SIC) operations enables seamless migration to CAN XL, allowing teams to evolve existing designs incrementally without requiring a full redesign. Additionally, the transceiver allows engineers to consolidate communication layers and use Ethernet in mixed network architectures with Transmission Control Protocol/Internet Protocol (TCP/IP) tunneling, enabling efficient transfers of diagnostics, sensor data, control traffic and over-the-air updates on a single network.

Why does it matter?

Industrial systems are generating and demanding more data than ever before, with applications requiring fast, deterministic communication to synchronize motion control, sensor feedback and diagnostic data. These applications have introduced new networking requirements, often leading engineers to accept system-level trade-offs to compensate for bandwidth constraints. TI’s TCAN6062 CAN XL transceiver bridges that gap, offering engineers a path to higher-bandwidth networks while maintaining the proven reliability CAN is known for.

The specification for CAN XL has been standardized for years, but TI is the first to deliver and bring the hardware that makes it possible to the mass market. By introducing the TCAN6062, TI is transforming the innovative protocol into a broadly available, ready-to-use solution that engineers can implement in their next-generation designs.

“As industrial systems become more intelligent and interconnected, what we ask of our networks continues to evolve,” said Dwight Byrd, general manager, Interface Products at TI. “Engineers need more data, higher speeds and greater flexibility, all without compromising performance or reliability. TI’s TCAN6062 CAN XL transceiver puts that capability in their hands today, helping them build faster, more capable industrial systems.”

The TCAN6062 CAN XL transceiver’s SIC helps reduce ringing by as much as 80% in complex networks, simplifying validation in high-node architectures. Combined with wide input/output voltage compatibility and protection up to ±58V, the transceiver offers broad design flexibility across a range of industrial applications.

More details

As members of the CAN in Automation (CiA) technical group that developed International Organization for Standardization (ISO) 11898-2:2024, TI’s engineers helped shape the physical layer specification for CAN XL, ensuring the protocol was built to support the real-world demands of industrial applications.

“CAN has been the backbone of industrial communications for decades,” said Holger Zeltwanger, managing director at CiA. “Texas Instruments’ long-time membership and collaboration with CiA builds on that legacy, helping shape CAN XL by contributing to a standard that will guide the entire industry. Now with the introduction of the first commercially available CAN SIC XL transceiver, CAN XL is accessible to engineers worldwide, reflecting our shared commitment to solving the engineering challenges of today and tomorrow.”

“CAN XL opens the door to a new era of applications, enabling systems to deliver higher performance at a reasonable cost. CAN XL is the better and cheaper CAN FD, but can also tunnel Ethernet,” said Arthur Mutter, Ph.D., chairman of the CAN XL Special Interest Group at CiA and senior executive, Networking Technologies at Bosch. “With TI now offering a CAN SIC XL transceiver, system designers can leverage CAN XL to exchange data rapidly (up to 20 Mbit/s) and reliably in all applications, from industrial and robotics to automotive safety.”

The TCAN6062 represents the next generation of TI’s industry-leading CAN transceiver portfolio. Spanning CAN FD, CAN SIC and now CAN XL, TI offers a comprehensive range of solutions, giving engineers the flexibility to deliver more data faster, farther and more reliably.

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Applied Materials, Inc. today announced that the University of California, Berkeley will join the company’s EPIC Center in Silicon Valley as a research collaborator. Working side by side with Applied’s scientists and engineers, UC Berkeley faculty and students will pursue high-impact research programs to accelerate the material and process innovations that are foundational to AI computing.

“The EPIC Center is designed to bring together the best minds from industry and academia in a high-velocity, manufacturing relevant environment to dramatically accelerate the development and commercialization of next-generation semiconductor technologies,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “Few institutions have shaped modern chipmaking as profoundly as UC Berkeley. Expanding our research collaboration at the EPIC Center strengthens the lab-to-fab innovation pipeline and gives us a powerful platform for developing the semiconductor talent the industry will depend on for decades to come.”

Research universities generate many of the ideas that become tomorrow’s semiconductor materials and process technologies, yet those ideas advance fastest when researchers can test them on the same equipment used by global manufacturers. Applied’s EPIC Center gives university researchers access to industry-scale tools, enabling rapid iteration, earlier validation and a smoother handoff from discovery to deployment.

UC Berkeley brings a history of translating foundational research into commercial semiconductor technology. UC Berkeley engineers built the first research laboratory at a university dedicated to prototyping integrated circuits in 1962. In the decades that followed, the institution produced breakthroughs the entire industry now runs on – among them the SPICE circuit simulator and the FinFET, the three-dimensional transistor that is now the basis of leading-edge logic manufacturing worldwide. That heritage of moving inventions out of the lab and into high-volume production is precisely what the EPIC Center is built to accelerate.

“Pioneering innovations by UC Berkeley researchers have enabled advancements in semiconductor chip technology, resulting in the exponential growth of computing that has ushered in the AI era,” said Mark Asta, dean of UC Berkeley’s College of Engineering. “Applied Materials’ new EPIC Center in the heart of Silicon Valley aims to speed the translation of university inventions into commercial products by providing early access to cutting-edge, industrial-scale semiconductor process equipment and technologies. I look forward to advancing research and supporting new engineering talent through this R&D collaboration with Applied Materials.”

Applied and UC Berkeley already share strong ties through semiconductor research collaborations and shared laboratory space, including work connected to the Berkeley Emerging Technologies Research (BETR) Center and the Center for Information Technology Research in the Interest of Society (CITRIS). A large network of UC Berkeley alumni works at Applied as engineers, scientists and managers, and Applied recruits from the campus each year. Both organizations are rooted in the same Silicon Valley ecosystem, allowing ideas, people and equipment to move easily between campus and industry.

Applied’s new EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley represents the largest ever U.S. investment in advanced semiconductor equipment R&D. The center is designed from the ground up to dramatically reduce the time it takes to commercialize breakthrough technologies from early-stage research to full-scale manufacturing. The facility is on track to become operational in 2026.

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PayU, India’s leading diversified fintech platform, today announced the launch of Accessible Payments Checkout, India’s first RBI-compliant payment checkout designed for people who are blind or visually impaired. The launch marks a significant step towards making digital payments more accessible and inclusive. As the country celebrates Independence Day, the launch reinforces the importance of ensuring that everyone can participate in the digital economy with greater independence.

With this launch, PayU becomes the first payment gateway in India to comply with the Reserve Bank of India’s October 2024 accessibility mandate (BIS IS 17802). The enhanced checkout introduces a range of features designed to improve discoverability, navigation, and interaction for users with visual and cognitive accessibility needs, making the online payment journey more seamless and intuitive.

The solution reflects PayU’s continued commitment to building inclusive financial technology and enabling every user to access digital payments with confidence and ease.

The new PayU Accessibility Checkout includes four key features:

• Full-Screen-Reader Optimisation: PayU’s Accessibility Checkout is engineered to work seamlessly with screen readers, ensuring easy navigation of the entire payment journey for the visually impaired and blind without any sighted assistance. From choosing the payment method like Net banking, UPI, QR, NEFT, etc. to payment amount confirmation and transaction completion, every element on the checkout page is clearly and transparently announced via voice commands to the user, ensuring they know where exactly they are in their payment journey.
• Adaptive User Profiles: This feature allows users to customize their checkout environments–adjusting cursor size, button dimensions, and navigation aids to fit their requirements. Their preferences can be saved, switched between or reset at any point. The checkout adapts as the user wants, delivering complete control in the hands of the user.
• Visual Inclusivity Modes: To aid users with conditions such as low vision, colour blindness, or light sensitivity, a wide variety of visual modes are offered by PayU’s Accessibility Checkout. From high contrast to greyscale mode to colour inversion to saturation adjustment options, the checkout offers support to the visually impaired users who rely on colour and contrast adaptations to use digital platforms.
• Text Resizing: The Accessibility Checkout supports text scaling of up to 200% of the standard size, without overlapping or hiding any content. This feature ensures all elements on the checkout is transparently seen and read by the users with visual impairments.

“True financial inclusion is only possible when every individual can access and use digital payments independently. At PayU, accessibility is not an afterthought – it’s a core design principle. With the launch of our Accessibility Checkout, we’re helping merchants deliver payment experiences that are inclusive by design while enabling millions of users with diverse accessibility needs to participate more confidently in India’s digital economy. This is an important step towards supporting the RBI’s accessibility vision and building digital infrastructure that works for everyone,” said Manas Mishra, Chief Product Officer, PayU and Wibmo.

Prashant Ranjan Verma, General Secretary, National Association for the Blind, Delhi, said, “I appreciate PayU’s efforts to make digital payments more accessible for everyone, including people who are blind or have low vision. I was able to complete a UPI payment independently using PayU’s accessibility-first checkout with VoiceOver. I hope PayU continues to strengthen accessibility so that more people with visual impairments can transact confidently and independently.”

PayU’s Accessibility Checkout does not require merchants to change their existing integrations. Accessibility is embedded as a design feature allowing merchants using PayU to automatically offer a compliant and accessibility-first payments checkout experience to their customers with disabilities.

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The rapid expansion of artificial intelligence is creating an unprecedented demand for computing power, data centres, advanced networking, electricity and high-performance chips. However, the enormous capital required to build AI infrastructure has become a major challenge for AI companies and cloud providers. Addressing this funding gap, NVIDIA has announced partnerships with major global investment firms to establish independent financing platforms designed to mobilise more than $500 billion in third-party capital for AI infrastructure over time.

The initiative brings together NVIDIA with Apollo Global Management, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR. Rather than NVIDIA providing the entire $500 billion itself, the initiative is designed to attract capital from institutional investors through dedicated financing platforms. The capital can then support the development and deployment of AI computing infrastructure, including GPUs, servers, data centres, networking systems and related power infrastructure.

The chipmaker on 10 August announced partnerships with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to create independent financing platforms for AI compute infrastructure. The platforms are expected to mobilise more than $500 billion in third-party capital over time for the development of AI infrastructure.

Nevertheless, the NVIDIA’s collaboration marks a landmark step in the financing of AI infrastructure. By mobilizing as much as $500 billion from third-party sources, the firm and financial partners intend to accelerate the build-out of infrastructure for the next iteration of AI innovation. The effort could fundamentally reposition the notion of AI compute from a technologically motivated expenditure into a substantial asset class with unprecedented interconnectivity between semiconductor design, data centres, power and institutional capital.

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L&T Technology Services, a global leader in Engineering Intelligence Solutions & ER&D Consulting Services, today announced the launch of AgenticIQ, an end-to-end Agentic AI platform purpose-built for engineering and manufacturing organizations. Designed to help enterprises move beyond isolated AI pilots, AgenticIQ enables autonomous, multi-agent workflows across engineering, product development, manufacturing, industrial operations and customer experience, accelerating the adoption of Engineering Intelligence at scale.

As enterprises increase investments in AI, many initiatives continue to struggle to move beyond proof-of-concepts into production. Disconnected engineering systems, manual processes and highly regulated environments often prevent organizations from scaling autonomous AI while maintaining governance, security and operational reliability.

Built on LTTS’ portfolio of Engineering Intelligence solutions, AgenticIQ transforms proven engineering capabilities into specialized, reusable AI agents through a planning-first architecture that is embedded directly into engineering and production workflows and designed to operate within enterprise governance boundaries. The platform helps safeguard critical data, intellectual property and regulatory compliance while laying the foundation for LTTS’ next-generation Engineering Intelligence solutions and an Agentic-led engineering delivery model, enabling faster development and deployment of AI-powered solutions.

Designed for customer-centric engineering and R&D-intensive environments, AgenticIQ supports industries including automotive, industrial manufacturing, medical devices and healthcare, semiconductor, plant engineering and high-tech. Its cloud-agnostic architecture enables organizations to build once and deploy anywhere across cloud and on-premises environments, helping enterprises scale trusted AI while retaining control of proprietary engineering knowledge, workflows and intellectual property.

Amit Chadha, Chief Executive Officer & Managing Director, L&T Technology Services, said, “The next phase of Engineering Intelligence will be defined by how effectively autonomous AI agents collaborate to solve complex industry challenges across engineering, production and customer experience. Over the years, LTTS has built AI-powered engineering solutions that address domain-specific business problems across industries. With AgenticIQ, we are transforming these proven capabilities into reusable AI agents on a unified Agentic AI platform that enables enterprises to rapidly build, orchestrate and deploy next-generation agentic solutions at scale.”

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ASMPT, the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, today announced that Bassel Haddad has assumed the roles of Group Chief Executive Officer and Executive Director. The leadership transition, first announced in July, took effect today. Bassel Haddad succeeds Robin Ng, who retires after more than 20 years with ASMPT, including six years as Group CEO and Executive Director.

John Lok, Chairman of the Board of ASMPT, said: “We are pleased to welcome Bassel Haddad as Group CEO. He assumes leadership of ASMPT with a clear corporate strategy, strong technology capabilities and an experienced global team already in place. Bassel’s deep industry expertise, business leadership and track record of driving innovation and customer success make him the right leader to guide ASMPT through its next phase of growth and deliver solutions to increasingly complex customer requirements.”

“It is an honour to lead ASMPT, a company with a remarkable legacy and a strong foundation for future growth,” said Bassel Haddad, Group Chief Executive Officer of ASMPT. “We have an exceptional opportunity to accelerate and shape the industry’s evolution from traditional Moore´s Law scaling to the “more than Moore” era. I look forward to partnering with the Board of Directors and our talented global team to accelerate innovation, deepen our customer partnerships, and create lasting value for our employees, customers, and shareholders.”

As semiconductor architectures become more complex, assembly and advanced packaging have become central to delivering system-level performance and manufacturing scalability. Bassel Haddad’s broad experience leading technology development, operations and global businesses positions ASMPT to extend its technology leadership and customer focus.

Bassel Haddad assumes leadership following ASMPT’s recently reported first-half 2026 results. Group revenue from continuing operations increased 42.5% year on year to US$1.14 billion, while Advanced Packaging delivered record half-year revenue. The performance reflected demand across multiple advanced packaging solutions, including Thermo-Compression Bonding, high-precision SMT and Photonics, alongside growth in mainstream applications.

Before joining ASMPT, Bassel Haddad was Senior Vice President and General Manager of Foundry Solutions and Technology Platforms at SkyWater Technology, where he led business strategy, go-to-market activities and profit-and-loss accountability for its foundry and advanced technology services. He previously led SkyWater’s Advanced Packaging business, with responsibility spanning technology development, engineering, marketing and fab operations. Earlier, Bassel spent 14 years at Intel Corporation in senior leadership roles across product, technology and business management, including edge computing, artificial intelligence and product architecture. He holds bachelor’s and master’s degrees in electrical engineering from the Technion – Israel Institute of Technology.

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The MXO Series oscilloscopes from Rohde & Schwarz are now supported by Chroma’s Power Conversion Device Automated Test System Model 8000 (ATS 8000). This integration helps address increasingly complex testing requirements in high-power and high-channel-count applications, including power systems used in AI data center infrastructure. As a result, power electronics engineers using the ATS 8000 platform for automated testing and integration can benefit from the advanced capabilities of next-generation MXO oscilloscopes for real-time waveform capture.

The growth of AI infrastructure is driving power demand in data centers and related systems. This is pushing power supply vendors to develop higher-power and higher-density designs, including systems built for the latest HVDC (High-Voltage Direct Current) power architectures. Engineers power conversion devices and power supplies rely on automated test platforms such as Chroma’s ATS 8000 to carry out automated tasks including waveform capture, debugging and calibration during power system development.

The ATS 8000 is designed for automated testing of various power conversion devices and power supplies. Chroma has now added support for the MXO Series digital oscilloscopes from Rohde & Schwarz as one of several available hardware options that can be integrated into the system. In automated power testing applications, oscilloscopes play a critical role in capturing transient behavior and dynamic waveforms in real time.

High accuracy for high-voltage testing environments

Based on MXO-EP processing ASIC technology developed by Rohde & Schwarz, the next-generation MXO Series offers waveform capture rates of up to 4.5 million acquisitions per second. This helps reduce measurement blind spots and provides a more accurate real-time representation of the signal behavior. With advanced digital triggering, adjustable sensitivity and exceptionally low trigger jitter, the MXO can detect even very small signal anomalies with pixel-level trigger accuracy. In HD mode, the oscilloscopes support up to 18-bit resolution and input sensitivity as low as 0.5 mV/div.

High channel count for high-density power delivery

To meet the power demands of high-density power delivery in AI-driven data centers, a single power rack often needs to support multiple power modules, as well as battery backup units (BBU) and capacitor backup units (CBU) in series or parallel  setups. These requirements can create complex measurement challenges involving more than eight channels. The MXO Series includes models with up to eight channels and supports multi-instrument synchronization through the Rohde & Schwarz ScopeSync architecture, allowing several instruments to operate in a primary-secondary setup with up to 24 synchronized channels. This capability supports debugging work and helps align manual checks with automated test results.

Flexible test platform for real-world applications and production line environments

Thanks to Chroma’s PowerPro 5 control software, engineers can adapt the test systems to specific use cases and run external programs written in C# or Python as part of the test flow. This makes it possible to add custom analysis steps, such as decoding control frames from serial communication buses or applying product-specific calibration routines, meeting engineers’ flexibility requirements in both real-world applications and production-line environments.

Evan Tsai, Product Manager for ATS 8000 Software Solutions from Chroma said: “Drawing on many years of experience in automated testing, we consider efficiency and flexibility to be extremely important in the AI-driven era. The addition of support for the Rohde & Schwarz MXO Series oscilloscopes expands the ATS 8000 platform in response to new demands in advanced power testing. Looking ahead, Chroma will continue to develop automated testing technologies that provide power supply manufacturers worldwide with more comprehensive, precise and reliable measurement solutions, jointly paving the way for highly efficient AI-driven energy systems.”

Jithu Abraham, Director Product Management Oscilloscopes at Rohde & Schwarz said: “Power electronics engineers developing complex power systems used in AI data center infrastructure need measurement tools that can capture fast signal behavior and support complex multi-channel setups. By adding our MXO Series to Chroma’s well-established ATS 8000 platform, these users can now access next-generation oscilloscope technology within their existing automated test workflows.”

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Indian defence technology start-up Constelli is bolstering the nation’s home-grown defence electronics ecosystem through its dedicated hardware and software for testing, developing, and validating high-performance radar and electronic-warfare (EW) systems. Headquartered in Hyderabad, Constelli’s technologies are deployed within organisations such as the Defence Research and Development Organisation (DRDO) in India and are licensed to defence firms in overseas markets.

The company also produces high-speed radar processing chips and sub-systems to provide situational awareness and detection of airborne and sea-borne targets or threats. Modern defence platforms require the ability to quickly classify and identify counter signals. These capabilities will become more relevant if they cannot be recognised in real-time. The development also signals the growing use of RF signal processing, FPGA-based computing embedded systems, digital signal processing, and software-defined architecture for defence purposes, within India’s electronics industry.

As Radar and EW technology grows increasingly advanced, robust test and simulation infrastructure will be indispensable in cutting the development cycle and increasing the robustness of such systems. India’s rising interest in private sector tech firms such as Constelli is directly indicative of a wider trend and increasing investment from India’s indigenous private tech firms in developing India’s future defence electronics.

Constelli’s range of technologies spans radar signal processors (RSPs), ELINT systems, ESM equipment, RTA simulators, RIA simulators, and EW test solutions. ELINT systems, ESM equipment, RTA simulators. RIA simulators, and EW test solutions. Engineers can create synthetic battle signals and determine how radar and EW equipment will behave in a particular operating mode.

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The electric vehicle industry in India continues to witness large investments as manufacturers scale up their production capacity. The rapid increase in production is also driven by emerging customer demand and increasing competitiveness in the market. With support from the government, improving charging infrastructure and greater adoption of electric mobility, Indian and foreign investors continue to infuse confidence in several emerging Indian EV companies. River Mobility, an electric scooter manufacturing company based in Bengaluru, raised $120 million in its Series C round to scale manufacturing capacity, improve its research and development, and finance new products in electric mobility.

The funding round was led by Yamaha Motor Co., Ltd with participation from existing investors, marking another significant investment in the fast-emerging electric two-wheeler segment in India. The funds will enable River Mobility to boost its production output and expand its retail network across the country, strengthen its supply chain, and invest in next-generation technologies in electric vehicles.

A significant part of the investment will be used to increase the manufacturing capacity of the company in Karnataka. River plans to set up an increased production facility that could produce up to 80,000 electric scooters per month, thus increasing the production capacity by a great extent to cater to the increasing demand of electric scooters in the domestic market and then to export as well.

River Mobility’s successful $120 million funding represents another important step in contributing to the ever-growing EV industry in India. A focus on manufacturing capacity expansion, product innovation, and customer experience will further consolidate its place in the competitive electric two-wheeler market. With growing consumer interest and a maturing EV ecosystem in India, the latest funding for River is a promising development for local manufacturing, technical innovation, and a faster transition toward a sustainable India.

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The user trial run of India’s Agni-4 medium-range ballestic missile was held on August 6 and was fully successful on Thursday. Missiles are operated from the Integrated Test Range in Chandipur, Odisha. The test run was conducted by the Strategic Force Command with the cooperation of the Defence Research and Development Organisation (DRDO) for the purpose of checking operational and technical aspects of the missiles.

This successful trial demonstrates India’s continued progress in indigenous strategic systems. DRDO (Defence Research and Development Organization) is India’s premier defence R&D organization, and is accountable for several strategic systems including the Agni series of missiles. From an electronics point of view, such systems (Agni-4 in this case) require some cutting-edge electronics like the Guidance, Navigation, and Control Electronics, onboard computing and sensors, and telemetry for their performance.

The missile also has to operate under severe vibration, acceleration, and temperature environments that necessitate high reliability electronics and semiconductor components. Hence, the present test is an achievement much greater than the successful test-firing of the missile. It shows India has advanced further in developing sophisticated indigenous technologies in the domain areas of embedded systems, navigation and control electronics and aerospace engineering.

The success of DRDO further places them in the forefront to boost the country’s strategic powers, and further to accelerate India’s overarching aim to be technologically self-sufficient.

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With the advancement of technology in the electric vehicle industry, several companies are focusing on building next-generation electric vehicles by pushing for fast charging, longer driving range, and higher power efficiency. Supplying power to electric vehicles has become a key role in shaping the future of electric mobility as it converts the available stored energy into useful kinetic energy and determines the vehicle range, charging speed, and battery lifespan.

To enhance the efficiency of power distribution in electric vehicles, BYD which is a Chinese manufacturer, has launched its latest-generation 1500V automotive-grade silicon carbide (SiC) power technology built for high-voltage applications that would offer higher efficiency and higher thermal capabilities along with super-fast charging technologies.

The new SiC technology is intended to work with BYD’s Super e-Platform (a 1000V high-voltage system integrating batteries, EV Motors and power electronics) which offers megawatt-level charging performance. The company claims that with a voltage rating of 1500V, this is currently the highest voltage rating for mass-produced automotive-grade SiC power chips (capable of high electrical loads).

Car manufacturers are increasingly turning to silicon carbide (SiC) instead of conventional silicon for electric vehicle power electronics. This type of semiconductor technology is characterized by significant improvements in electrical parameters compared with traditional silicon systems offering greatly reduced switching losses, ability to withstand high temperatures, and higher energy efficiency. This enables automotive companies to achieve greater compactness and weight reduction, and reducing cooling systems requirements in their inverters.

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Research on the futuristic defence application of photonic radar is underway in the defence establishment, especially at the Electronic and Radar Development Establishment (LRDE), Defence Research and Development Organisation (DRDO). The DRDO’s technology portfolio includes, among others, photonic radar signal generation, photonic down-converter, photonic analogue-to-digital converter, Optical beam forming array and photonic integrated circuits, which DRDO-LRDE is pursuing, according to an entry on the DRDO website.

These applications rely on photonics for generating and manipulating high-frequency radio signals and may lead to radar systems with enhanced bandwidth, signal processing and sensing features. Several sophisticated technological fields, such as RF engineering, photonic integrated circuits, semiconductor devices, digital signal processing and electronic warfare, merge for this development.

LRDE is collaborating with industry to develop new radar hardware technology too. For instance, MoD procurement data shows an LRDE project scheduled for delivery by July 2026, relating to the design, production, installation and integration of high resolution radar hardware, signifying an increasing industry presence in the Indian radar ecosystem. India’s defence-electronics sector sees the photonic radar as a viable future technology platform for use on future ground-based or aerial sensor suites, and its progress here signifies a parallel advancement in India’s self-reliance endeavours on complex radar technology as well as its semiconductor capabilities.

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​With the increasing demand for software-based design, manufacturing units, and product lifecycle management in the electric mobility industry, EV manufacturers are increasingly adopting advanced digital engineering tools such as Product Lifecycle Management (PLM) and Computer-Aided Design (CAD) to accelerate product development with the highest precision in design and also make the manufacturing process more effective.

These technologies enable engineers to manage complex systems like electric powertrains, batteries, electronics, and software through an interconnected digital engineering workflow. To meet these criteria and stand out in the competitive electric mobility market, Bengaluru-based EV manufacturer Simple Energy has enhanced its digital engineering setup with Siemens PLM technology to support faster product development and efficient manufacturing.

Simple Energy has made partnership with Siemens Digital Industries software and will be using Siemens’ cloud-based Product Lifecycle Management (PLM) software platform Teamcenter X, to facilitate collaboration among engineering team and establishes a connected digital workflow across the product lifecycle.

Simple Energy’s collaboration with Siemens demonstrates how India’s EV startups can adopt cloud-powered engineering and PLM tools to build structured digital workflows. Simple Energy’s current on-going projects ​include the Simple One, OneS and Ultra electric scooters which offer a combination of modern design, connected features, performance and electric powertrain technology.

The adoption of Siemens Teamcenter X by Simple Energy reflects the broader shift toward digital product development. It symbolizes the overall trend towards digital product development in the Indian EV industry. It shows how technologies such as connected engineering tools, cloud PLM, and simulation-driven design (SDD) will be critical to development and supporting the next generation development of electric mobility.

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India’s medical device industry is expected to emerge as a global powerhouse with a projected market size of $250 billion by 2047, according to FICCI-DUA Consulting White Paper on ‘Service and Maintenance of Medical Equipment in Indian Healthcare – Towards a Safe, Reliable and Sustainable Medical Device Maintenance Ecosystem’.

The White Paper released during the inaugural session of the 9th edition of ‘India Medical Device 2026’, organised by the Department of Pharmaceuticals in association with FICCI today says that India’s medical device sector, currently valued at around $14 billion, is projected to reach $30-50 billion within this decade, and likely to reach $250 billion by 2047. It says rising healthcare demand, increased adoption of advanced medical technologies, government support for indigenous manufacturing, and the country’s ambition to become a global MedTech hub likely to drive the rapid growth.

According to the White Paper, India has made significant progress through initiatives such as the Production Linked Incentive (PLI) Scheme and the Strengthening of Medical Devices Industry Scheme, which have enhanced domestic manufacturing capabilities and improved India’s global competitiveness. However, the report stresses that sustained growth of the sector will depend not only on manufacturing but also on creating a world-class ecosystem for servicing, maintenance, calibration and lifecycle management of medical equipment.

The report highlights that medical equipment today forms the backbone of modern healthcare, supporting timely diagnosis, emergency response, surgeries and advanced treatment. It argues that the value of these technologies extends well beyond procurement and depends on reliable servicing throughout their operational lifecycle. Proper maintenance, the report says, improves patient safety, enhances clinical effectiveness, reduces equipment downtime, extends equipment life and optimises healthcare investments.

To address these issues, the White Paper proposes a risk-tiered hybrid maintenance framework anchored in the Central Drugs Standard Control Organisation (CDSCO) device classification system. It recommends maintenance protocols based on device risk categories, creation of a national certification architecture for service engineers, strengthening technical training, encouraging commercial model innovation, and rationalising the fiscal framework to promote compliant maintenance practices. The report also advocates wider adoption of digital technologies, including predictive maintenance, digital monitoring and lifecycle management systems, to improve equipment reliability and minimise downtime.

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The access control industry is rapidly moving to the cloud. The global Access Control as a Service (ACaaS) market is expected to nearly double in size from 2025 to 2029 1 , driven by organizations seeking simpler deployment, centralized management, and lower maintenance costs.

At the same time, they are managing more employees, visitors, and locations than ever before, making access control administration increasingly complex.

This is where cloud access control, also known as ACaaS, comes in.

What is cloud access control

Cloud access control connects devices directly to a cloud platform, allowing administrators to manage access permissions, attendance, and elevator control from a single interface.

Instead of maintaining servers and software infrastructure, organizations can manage users, doors, schedules, and permissions remotely while ensuring the right people access the right places at the right time.

Introducing Hik-Connect Team
Hik-Connect Team is Hikvision’s cloud-based platform, helping organizations have access control through a unified web and mobile experience. It brings the following core benefits.

• No servers required: Connect devices to power and internet, and they’re online and fully operational within minutes. No server, no configuration, no high maintenance costs.
• Remote management: Administrators manage devices and users from wherever they are without relying on VPNs — whether they are at headquarters, a branch office, or working remotely.
• Stable performance: Network outages don’t cause downtime. Edge processing, local storage, and cross-device communication keep doors operational even when connectivity is interrupted.
• Scale as you need: From a single door to an unlimited number of access points, the system grows without friction.
• SMB-ready free capacity*: Hik-Connect Team includes free door and user capacity to meet the needs of SMBs.
• Always up to date: New features and capabilities are released through updates. There’s no extra on-site deployment or maintenance work.
• Unified management with open integration: All three functions — access, attendance, and elevator control — are managed in one place. For organizations that already use third-party payroll or HR platforms, open API support makes integration straightforward.
• Enterprise-grade security: Data privacy and security are not concerns. Hik-Connect Team is built on top-tier cybersecurity infrastructure to protect sensitive data.

Designed for diverse business scenarios

Cloud-based access control is suitable for SMB scenarios:

• Small offices and single-site businesses seeking simple and cost-effective management
• Multi-site offices and chain stores requiring centralized operations
• Residential communities looking for more convenient and secure access experiences

The shift to cloud service

The shift from on-premise to cloud isn’t just a technology trend. It’s a fundamental change in how organizations think about access, operations, and cost. Hik-Connect Team is designed for that shift — flexible enough for a startup, robust enough for a multi-site enterprise, and secure enough for environments where data protection is non-negotiable.

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Across the world, schools are discovering that the path to sustainability runs straight through their classrooms. It’s transforming education in a very good way.

A classroom that saves thousands of sheets of paper each year, students who collaborate on virtual whiteboards, and teachers who share content digitally. Imagine a world of education where assignments flow seamlessly without wasting a single sheet of paper. No more overflowing recycling bins, and no more guilt about the impact on the environment. Welcome to the paperless classroom.

The paper trail problem: The hidden costs of traditional classrooms Traditional classrooms operate on a consumable intensive model, creating ongoing financial and environmental burdens. Research shows that classrooms consume massive quantities of paper, In the US, for example, schools use 32 billion sheets annually at a cost of $1.6 billion. In the UK, schools consume on average one million sheets per school every year. This consumption represents a major environmental challenge which contributes to deforestation and waste generation.

Beyond the cost of paper, consumable dependency extends to markers, chalk, and printing supplies, all of which require constant restocking. Teachers rely on projector systems which consume 150-800 watts each and adding to overall operating expenses. These recurring costs divert resources from core educational investments as schools struggle to balance quality education with fiscal responsibility and sustainable practices.

Going green with smart interactive solutions
Every morning in schools, teachers queue at copy machines as if they’re waiting for coffee. Students, meanwhile, manage stacks of worksheets that could rival a small forest, and recycling bins reach capacity by the end of the day.

Interactive displays, however, eliminate this entire workflow. Students collaborate directly on digital surfaces, assignments distribute instantly across devices, and lesson materials reside in cloud-based systems. The outcome: classrooms operate seamlessly with zero paper consumption. Rather than distributing physical handouts to 20-30 students, educators present interactive content that enables simultaneous manipulation by all participants. Students annotate directly on displays, engage in collaborative problem-solving, and submit assignments digitally. Identical lesson materials serve multiple classes without reprints. Processes that previously demanded hundreds of paper copies can now be executed through touch interactions.

Beyond paper reduction, these displays provide energy efficiency that makes traditional projectors look like energy-hungry dinosaurs. Intelligent algorithms dynamically adjust brightness according to content requirements, while kicks in whenever the screen is idle.  Engineered for extended lifecycles, they function for years without the frequent lamp replacements that send projector components to landfills. A single display can serve multiple classes, multiple subjects, and multiple years of sustainable e-learning.

From paper stacks to digital success: Paperless education improves sustainability
Spring Dale Senior School in Punjab, India, exemplifies successful sustainable classroom transformation through their comprehensive ‘Going Paperless’ initiative. The school faced escalating costs from continuous restocking of markers and paper supplies. To address these challenges, they implemented Hikvision’s  WonderHub  interactive displays across 80 classrooms and conference rooms.

The results speak for themselves. Teachers now assign homework through integrated quiz applications while students participate via personal devices, eliminating printed worksheets entirely. Digital content gets instantly updated and shared across eco-friendly classrooms, completely removing the dependency on physical teaching materials.

More than that, the displays incorporate advanced green technologies, including  PixMaster  intelligent energy management, which identifies content types and adjusts image parameters such as brightness and contrast. Echo Mode further improves energy efficiency by reducing power consumption during periods of low activity. Together, these features ensure strong environmental performance without compromising visual quality.

The transformation didn’t just reduce environmental impact—it enhanced educational outcomes through increased student engagement and improved curriculum responsiveness. The school now positions itself as an innovative, environmentally conscious, educational leader. One investment delivered multiple benefits: cost savings, environmental protection, and better learning experiences.

The success at Spring Dale Senior School illustrates a broader global shift toward greener education. Schools worldwide are embracing interactive displays to cut paper waste while enhancing learning outcomes. Each digital classroom is a meaningful step toward sustainable, carbon-neutral education.

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