ELE Times

Video Dragon 6222 combines a frame grabber and frame generator in a single device. GÖPEL electronic offers a modular setup using the Video Dragon 6222 for the verification of high-resolution industrial cameras, display systems, and imaging units. As a high-performance solution, this setup is suitable for all camera and display applications where the highest standards of image quality, reliability, and reproducibility are required. The setup combines a frame grabber and frame generator into a single system, enabling the capture, analysis, and output of video data in a seamless workflow—from development through validation to production.

With increasing resolutions, frame rates, and heterogeneous interfaces, the complexity of testing camera and imaging systems is growing. Video Dragon 6222 addresses this challenge head-on and impresses with a modular hardware design, flexible sideband communication, and intuitive application software. The use of project-specific interface units, such as pin adapters, enables flexible implementation and a precise connection to the respective applications. Developers, test engineers, and production managers thus gain a powerful solution for reliably testing stability during continuous operation, interface compatibility, and timing.

Video Dragon 6222 combines a frame grabber and frame generator in a single device. This allows incoming video streams from high-resolution cameras to be recorded, visualized, and analyzed. It also enables the output of test patterns and videos with freely configurable resolution, color formats, and frame rates. As a “man-in-the-middle,” Video Dragon can integrate into existing systems without affecting their behavior. This flexibility enables rapid debugging of prototypes, objective verification of production products, and long-term and stress testing under realistic conditions. The modular architecture reduces integration effort and ensures investment security, as new interfaces can be added as needed.

The included Dragon Suite software offers a clear, intuitive user interface that provides access to all hardware functions—without any programming effort. The cross-hardware interface G-API is available for integration into custom applications. It maps all hardware functions and enables rapid automation, e.g., in validation environments, production test benches, or HIL systems.

The Video Dragon 6222 product family includes three models that cover all use cases:

• G CAR 6222 (standalone device): Ideal for lab, mobile testing, and flexible setups
• G PCIe 6222 (PCI Express card): Directly in the test PC, high data density, and automation
• G PXIe 6222 (PXI-Express module): Optimized for modular test systems and fully automated production lines

These variants enable end-to-end deployment from the developer’s workstation through validation test benches to production testing.

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End-user spending on public cloud services in India is forecast to grow 28.1% to a total of $17.5 billion in 2026, up from $13.7 billion in 2025, according to Gartner, Inc, a business and technology insights company.

“Strong enterprise demand for AI-ready cloud infrastructure is redefining cloud investment priorities in India, driving the next phase of public cloud spending growth,” said Ashish Banerjee, Sr Principal Analyst at Gartner. This is further fueled by rising demand for application modernization, digital sovereignty, digital service delivery, and more scalable, consumption-based IT models, as organizations move toward more advanced and strategic cloud use cases.

“Cloud adoption is becoming more tightly aligned with business goals, such as improving productivity, accelerating innovation and go-to-market speed, enhancing customer experience, and strengthening business resilience,” said Banerjee.This sharper focus on business outcomes is sustaining strong momentum in cloud investments across the country.
Gartner analysts are exploring how IT infrastructure and operations (I&O) leaders can advance their cloud strategies and optimize costs at the Gartner IT Infrastructure, Operations & Cloud Strategies Conference in Mumbai this week.
Infrastructure-as-a-service (IaaS) and platform-as-a-service (PaaS) are expected to be the fastest-growing segments in India’s cloud market, with IaaS projected to grow 40% in 2026, followed by PaaS at 25.4% (see Table 1).

Table 1. India Public Cloud Services End-User Spending Forecast (Millions of U.S. Dollars)

	2025 Spending	2025 Growth (%)	2026 Spending	2026 Growth (%)
Cloud Application Infrastructure Services (PaaS)	5,114	22.1	6,414	25.4
Cloud Application Services (SaaS)	3,901	16.7	4,637	18.9
Cloud Desktop-as-a-Service (DaaS)	171	4.9	176	2.9
Cloud System Infrastructure Services (IaaS)	4,470	34.9	6,259	40.0
Total Market	13,656	24.0	17,487	28.1

Source: Gartner (June 2026)

“The rising need for AI-ready infrastructure, including GPUs, high-performance compute, high-speed networking, scalable storage and always-on inference capacity, is amplifying IaaS adoption and driving higher spending in this segment,” said Banerjee. PaaS is the largest spending category for Indian organizations in 2026, and is forecast to reach $6.4 billion, as enterprises rebuild their technology foundations to support AI-driven initiatives.

“Organizations are accelerating adoption of AI-driven technologies to unify data, connect systems, speed up development and enable real-time digital interactions, driving PaaS growth beyond cloud migration toward platform-led execution,” said Arunasree Cheparthi, Sr Principal Analyst at Gartner.

SaaS is expected to exhibit more moderate growth in 2026. “This reflects its established adoption base, as enterprises optimize licenses, rationalize usage, and shift incremental spending toward infrastructure and platform capabilities required to scale workloads and operationalize AI at scale,” said Cheparthi.

Cloud Priorities in 2026 and Beyond

Governance of increasingly complex hybrid, multicloud, and AI-enabled environments is emerging as one of the most significant cloud challenges for enterprises in 2026. Gartner predicts that by 2030, over 60% of enterprises will perform intensive AI model activity in one cloud but leverage it with their data in another, up from less than 10% today.
“Over the next 12-18 months, I&O leaders in India need to shift from cloud adoption to disciplined execution,” said Banerjee. “This includes prioritizing AI-ready data and infrastructure, stronger governance, FinOps maturity, security-by-design, and dynamic workload placement across hybrid and multicloud environments.”
“Organizations that can scale AI and digital initiatives while demonstrating business value, maintaining cost and risk discipline, and addressing critical skills gaps without slowing innovation, are expected to outperform their peers.”

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Infineon Technologies, a leading provider of power systems and IoT, joins NVIDIA’s MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon’s power management solutions support NVIDIA’s MGX architecture and 800 VDC power architecture, an open, modular reference architecture for AI factories in the agentic AI era. 800 VDC MGX-compatible power racks help existing AI infrastructure scale AI compute performance and power density, creating an upgrade path for future AI infrastructure.

“As a member of NVIDIA’s ecosystem, Infineon is working with NVIDIA to redefine power delivery systems from the grid to the processor core, which is required for this next phase of AI innovation,” says Adam White, Division President, Power & Sensor Systems at Infineon. “As AI models continue to grow in size and complexity, data centers must deliver dramatically more compute performance within the same physical, power, and cooling constraints. Combined with NVIDIA’s modular MGX architecture, Infineon’s power solutions significantly enhance energy-efficient power distribution across the entire data center power flow. We look forward to continuing our work with NVIDIA to bring more MGX-powered innovations to market.”

Infineon’s deep expertise in power conversion from grid to core leverages all relevant semiconductor materials, including silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). This comprehensive approach helps accelerate the transition toward full-scale 800 VDC architectures. Using Infineon’s GaN technology at switching frequencies close to 1 MHz enables ultra-compact bus converters at an industry-leading efficiency, while the combination of Infineon’s proprietary SiC JFET technology and dedicated control ICs is the perfect match for protection and hot-swap functionality of native 800 V server boards. Infineon’s power management solutions convert power from 800 V to 50 V, 12 V, or even down to 6 V.

As part of the NVIDIA MGX AI Factory ecosystem, Infineon supports the complete 800 VDC power conversion flow down to an intermediate bus voltage and core voltage in systems based on NVIDIA MGX, helping to reduce conversion stages and deliver DC power closer to the rack. This improves power efficiency, simplifies infrastructure, and supports higher-density AI deployments.

About NVIDIA 800 VDC

NVIDIA’s 800 VDC MGX-compatible power racks help existing AI infrastructure increase compute performance and power density without waiting for full-scale 800V DC AI factories. They provide an upgrade path for higher-density accelerated computing, enabling hybrid power architectures that protect current infrastructure investments while preparing AI factories for future workloads.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (end of September 2025) and generated revenue of about €14.7 billion in the 2025 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market.

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Keysight Technologies, Inc. announces a new capability within its RF Circuit Simulation Professional software, which enables engineers to capture their design process on an executable whiteboard. It replicates the engineer’s decision process, capturing simulations, optimizations, decision trees, and design parameters built on prior analyses. Each step generates editable Python code that can be saved, shared, and redeployed across Keysight Advanced Design System (ADS), Cadence Virtuoso, and Synopsys Custom Compiler environments.

RF organizations face a looming talent gap. McKinsey projects the semiconductor industry will need 88,000 engineers by 2029. In RF design, the challenge is more acute. Simulation methodologies spanning multiple physics domains can take years to master, and critical expertise is often lost when senior engineers leave.

Design teams face inefficient workflows, simulation bottlenecks, and knowledge barriers. RF Circuit Simulation Professional lets engineers construct their workflow on a visual whiteboard or in auto-generated Python scripts. Each step executes simulations, optimizations, and design decisions in sequence, with support for decision-based loops and parameter settings.

Each workflow becomes a repeatable methodology that can be shared across teams, reused, and driven by AI. Design review and tapeout steps that previously required manual setup for each iteration now run automatically.

Nilesh Kamdar, EDA General Manager, Keysight, said: “RF design expertise is leaving the industry faster than it can be replaced. The simulation knowledge that senior engineers have accrued cannot be transferred through documentation alone. Design teams now have a way to capture that experience as a visual, executable, reusable workflow. The structured data this generates, and the underlying Python APIs, are the first step toward fully automated, AI/ML-driven RF design.”

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MacDermid Alpha Electronics displays its latest attachment materials, which help power electronics manufacturers to improve reliability, process variation, and scale production more effectively. As automotive, industrial, and AI-driven data center applications demand higher power density and faster-switching devices, manufacturers are facing tighter thermal limits and increasing pressure to maintain stable, repeatable production. Bond line control, void reduction, and manufacturing consistency are becoming more critical to long-term power module performance.

MacDermid Alpha highlights its expansion of the ALPHA Argomax sintering portfolio and the ALPHA TrueHeight solder preforms, designed to help customers improve thermal and electrical performance while supporting more stable, high-volume manufacturing.

MacDermid Alpha will also contribute to the PCIM Europe technical program, sharing insights on electronics assembly solutions for emerging applications. On the AI stage, John Hynek, Global Product Manager, will examine how attach materials can support the uptime and reliability demands of AI and data center infrastructure. In addition, Andreas Socarras, Senior Application Engineer, will present a poster session titled “Investigation of Large Area Soldering Using High Stress Assembly and Challenging Surface Coatings”.

“Power electronics manufacturers need to attach solutions that can deliver tighter process control and higher reliability without adding unnecessary complexity,” said Gustavo Greca, Line of Business Director for Power Electronics at MacDermid Alpha Electronics Solutions.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions, a business unit of Element Solutions Inc, is a global leader in high-performance specialty chemicals, materials, and process technologies for every stage of the electronics manufacturing process. With expertise spanning circuitry formation, wafer-level packaging, circuit board assembly, semiconductor assembly, and film and smart surfaces, MacDermid Alpha delivers advanced, sustainable, and integrated solutions that drive innovation and reliability across the electronics supply chain. Operating worldwide and backed by more than a century of innovation, the organization supports a broad range of industries, including automotive, consumer electronics, data infrastructure, high-performance computing, and telecommunications, enabling next-generation electronics.

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Microchip’s dsPIC33CK Value Line DSCs offer a streamlined design for cost-sensitive applications and consistent pricing regardless of order size.

Designers of real-time control applications need to balance performance and peripheral integration while keeping system cost and complexity low. To address these challenges, Microchip Technology Inc. introduces the dsPIC33CK Value Line family of Digital Signal Controllers (DSCs) to provide essential real-time control at a competitive price point. By combining up to 100 MHz deterministic processing, high-resolution pulse-width modulation (PWM), and a 12-bit analog-to-digital converter (ADC), Value Line DSCs support motor Field Oriented Control (FOC), touch, and precision sensing applications without the added cost of unnecessary features.

Value Line device dsPIC33CK integrates a balance of peripherals that enable designers to consolidate multiple system functions onto a single device, helping reduce external component count, printed circuit board footprint, and overall Bill-Of-Materials (BoM) cost. With scalable program flash memory options ranging from 32 KB to 256 KB, and compatibility across the broader dsPIC33CK family, Value Line DSCs support scalability while offering migration paths for future needs.

“Not every real-time control design needs a high-end solution; many just need dependable performance at the right cost,” said Joe Thomsen, corporate vice president of Microchip’s digital signal controller business unit.

The dsPIC33CK Value Line delivers the essentials designers rely on most while eliminating complexity and helping provide a straightforward path to building capable, reliable systems without paying for features they don’t need. Offering consistent pricing at any volume makes it easier for customers to plan, scale, and control long-term costs. The dsPIC33CK Value Line family offers consistent and competitive pricing across various purchase volumes, helping simplify device selection during early-stage evaluation and production planning. Automotive-grade reliability, including AEC-Q100 Grade 1 qualification and built-in security features for implementing secure boot and secure firmware updates, helps enable use in industrial, automotive, consumer, and medical applications where dependable real-time operation is required.

Value Line DSCs provide up to 2 ns PWM resolution across eight channels, a 12-bit ADC supporting up to 2 MSPS, on-chip analog comparators with a 12-bit digital-to-analog converter (DAC), and a comprehensive set of communications peripherals including CAN FD, Local Interconnect Network (LIN), Single Edge Nibble Transmission (SENT), Universal Asynchronous Receiver-Transmitter (UART), Serial Peripheral Interface (SPI), and I²C. Together with Microchip’s established dsPIC33CK DSC ecosystem, these capabilities help designers implement precise, reliable real-time control functions within a single device, simplifying system design while supporting use in demanding applications that require long-term dependability and cost efficiency. Visit the website to learn more about Microchip’s full portfolio of digital signal controllers.

Development Tools

To accelerate evaluation and development, Microchip offers a low-cost dsPIC33CK Value Line Curiosity Nano evaluation kit featuring an onboard debugger, eliminating the need for an external programming or debugging tool. The evaluation platform can be used with Microchip’s Curiosity Nano base for Click Boards and the Curiosity Nano touch adapter board for touch-based applications. A Motor Control Dual Inline Module (DIM) is also available to support rapid prototyping of motor control designs. Value Line DSCs are compatible with the MPLAB development ecosystem, including the MPLAB XC-DSC Pro Compiler.

About Microchip Technology

Microchip Technology Inc. is a broadline supplier of semiconductors, and the headquarters is in Chandler, Arizona. It is known for innovative design, easier through total system solutions that address critical challenges at the intersection of emerging technologies and durable end markets. Its easy-to-use development tools and comprehensive product portfolio support customers throughout the design process, from concept to completion. TMicrochip offers outstanding technical support and delivers solutions across the industrial, automotive, consumer, aerospace and defense, communications, and computing markets. For more information, visit the Microchip website at www.microchip.com.

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Infeneon’s SECORA brings contactless payment to a smart watch and smart ring, which offers fast, convenient, and secure payment technology. With up to 4 billion devices with NFC connectivity by the year 2030, and up to 700 million wearables. The demand for contactless payment is growing rapidly. Infineon Technologies AG introduces SECORA Connect X, a ready-to-integrate solution that enables customers to transform smart wearables into fully functional payment devices. A combination of Infineon’s new SECORA Wallet with SECORA Token Requestor linked to Mastercard (MDES) and Visa (VTS), enabling the digitization of cards and the creation of a custom-brand wallet app. This new SECORA one-stop shop for wearable payment accelerates time-to-market through seamless integration and certification, while offering flexible design, card tokenization, and secured payment functionality for any active wearable.

“SECORA one-stop-shop turns wearables into payment devices certified by Visa and Mastercard with worldwide acceptance at all contactless POS terminals, without the need for a phone or digital wallet,” says Tolgahan Yildiz, Head of the Trusted Mobile Connectivity and Transactions Product Line at Infineon. “Original equipment manufacturers (OEMs) can now launch their own branded payment services across a wide range of smart wearables, leveraging our powerful and secure products.”

Comprehensive Solutions for Secure Payment in Smart Wearables

SECORA Connect X is a highly efficient and secure payment solution for active smart wearables, including smart rings, sports watches, and fitness trackers. The solution features a Secure Element that enables contactless payment with Mastercard, Visa, and many other NFC applications, with payment credentials securely stored on the chip, not in the cloud. As the smallest NFC payment card emulation device on the market, SECORA Connect X provides extremely low power consumption for longer battery life and lower costs thanks to fewer external electronic components. Its compact design fits into any wearable design, regardless of size, shape, or material. Java Card and GlobalPlatform standards support seamless integration through comprehensive development tools, while pre-certified applets and 1 MB of memory allow developers to create custom NFC- and Bluetooth-enabled applications.

In addition, SECORA Wallet and SECORA Token Requestor enable any Secure Element-based smart wearable to support EMVCo payment functionality via card digitization. As a Token Requestor, Infineon can connect directly with payment services such as Mastercard or Visa to request and manage payment tokens, removing Primary Account Numbers (PANs) from the payment chain for added security.

The payment tokenization process stores credit and debit cards directly on the Secure Element, adding an extra layer of security without relying on the cloud. The tokenize wearable is accepted globally at all contactless-enabled POS terminals, without the need for a phone or third-party wallet services. The integrated white-label software development kit (SDK) allows full branding flexibility and frictionless integration into existing OEM apps. SECORA Wallet supports both iOS and Android devices, enabling wide accessibility for end users.

Complementary Solution for IoT

SECORA Connect X and SECORA Connect E are efficient in connecting IoT devices such as AR/VR headsets, laptops/tablets, gaming consoles, and PC accessories. Infineon delivers a full-service offering, from end-to-end design to deployment, and contributes its expertise to a wide range of technical and payment industry bodies, including EMVCo, FiRa, GlobalPlatform, ISO, Java Card Forum, NFC Forum, and Calypso Network Association. As a result, OEMs adopting SECORA solutions benefit from industry-leading security, compliance, and innovation.

Availability

The market launch is planned for Money2020 in Amsterdam from June 2–4, 2026. Demonstrations will take place at the Infineon booth (booth 1C183, entrance F), and Infineon’s experts will be available to provide further information. More information is available at https://www.infineon.com/applications/security-solutions/payment-solutions/one-stop-shop-wearable-payments.

 

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Qorvo, a leading global provider of connectivity and power solutions, today announces a new family of RF switches that simplifies multi-band radio architectures. Spanning 50 MHz to 10 GHz, the family reduces component count, improves signal integrity, and enables more efficient RF system design across 5G infrastructure, industrial, drone, and test applications.

As 5G radios expand to support wider bandwidths and more frequency bands, including emerging spectrum such as FR3, designers face increasing challenges maintaining isolation and signal integrity without adding size, loss, and complexity. Many current designs rely on cascaded switch architectures or multiple narrowband devices, increasing insertion loss, degrading linearity and signal integrity, and adding board space and design effort.

“Designers no longer have to rely on cascaded switch architectures to achieve high isolation. We’re delivering that performance in a single device across a very wide bandwidth,” said Debbie Gibson, general manager of Qorvo’s infrastructure business. This approach reduces insertion loss, maintains signal linearity, and simplifies design, improving receiver performance in applications such as digital pre-distortion (DPD) feedback.

Qorvo’s new QPC6144 is a SP4T wideband switch that delivers greater than 65 dB isolation in a single device. Complementing this capability, the QPC6122 (SP2T) and QPC6188 (SP4T) provide wideband absorptive switching across 50 MHz to 10 GHz, enabling a single platform approach to RF routing. These devices reduce component count and simplify design while maintaining low insertion loss and strong linearity across wide bandwidths for calibration paths, general signal routing, and multi-band operation.

The new family of devices forms a dual switching platform that supports both high-isolation and general-purpose routing. By consolidating switching functions into fewer components, engineers can reduce BOM complexity, simplify layouts, and accelerate development across multiple applications.

Product	Key Role	Solves	Typical Use
QPC6144	High-isolation switching	Eliminates cascaded switches with >65 dB isolation in a single device	DPD feedback, calibration paths, high-isolation paths in 5G radios, and advanced drone communications
QPC6122	Compact wideband switching	Reduces component count while maintaining low insertion loss and signal linearity across wide bandwidths	Calibration paths, space-constrained RF routing in compact RF modules, and drones
QPC6188	Flexible wideband routing	Simplifies multi-path RF routing while maintaining low loss and signal linearity across multiple bands	Switching networks in infrastructure, industrial, drone, and test system applications

Samples are available through Qorvo. Visit the Qorvo IMS hub for more information.

About Qorvo

Qorvo supplies innovative semiconductor solutions that make a better world possible.  It combines product and technology leadership, systems level expertise, and global manufacturing scale to quickly solve customers’ most complex technical challenges.  Qorvo serves diverse high-growth segments of large global markets, including automotive, consumer, defense & aerospace, industrial & enterprise, and infrastructure. and mobile.  Visit www.qorvo.com to learn how a diverse and innovative team.

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Asymmetric network technologies such as ASA are becoming more important for transporting the increasing volume of sensor data in vehicles. At the same time, interoperability is harder to secure in a growing multi-vendor ecosystem. Rohde & Schwarz addresses this with a new ASA Motion Link compliance solution for the R&S RTP oscilloscope that focuses on standards-compliant testing, enables efficient device debugging, and ensures compatibility and seamless automotive communication.

The Automotive SerDes Alliance (ASA) was formed in 2019 with the ambition of providing an open standard for a multi-vendor ecosystem for high-speed asymmetric SerDes (Serializer/Deserializer) technology. It is perfectly optimal to carry data from high-resolution cameras, LiDAR, or radar sensors to the ECU or provide continuous data streams from the ECU to ultra-wide, high-definition displays, all the while ensuring that high-speed data transfers do not interfere with other sensitive vehicle electronics. With bandwidth capabilities scaling up to 16 Gbps per lane, it provides the scalable “nervous system” required for level 3 autonomous driving and beyond.

Rohde & Schwarz has been a long-standing member of the Alliance, contributing to the various technical committees to help further the open standard. The new R&S SPLUS-K105 option available on the R&S ScopeSuite+ software offers comprehensive electrical compliance testing for the latest ASA Motion Link standard. The software fully controls and automates the R&S RTP high-performance oscilloscope, allowing test engineers to seek guidance effortlessly through each test case via the step-by-step wizard and the web-based GUI. All relevant test cases for each speed grade (SG1 to SG5) are getting support from the software. In addition, users can also control the R&SZNB3000 and other supported VNAs for performing accurate return loss measurements.

The combination of oscilloscope, VNA, and compliance software provides capabilities for signal integrity analysis. The time domain impedance analysis in repeatable measurements is essential for verifying PHYs, ECUs, cables, and connectors, fostering reliable Automotive communication.

Further information can be found at https://www.rohde-schwarz.com/solutions/automotive-testing/in-vehicle-networks-and-ecu-testing/in-vehicle-networks-and-ecu-testing_231834.html.

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From a Jena-based spin-off to a globally sought-after test and inspection specialist.

In May 2026, GÖPEL electronics celebrates its 35th anniversary. Founded in 1991 as a spin-off of Carl Zeiss Jena Measurement and Testing Technology, the company continuously evolves and is now one of the world’s leading providers of innovative test and inspection systems, with approximately 240 employees as well as locations and partners in more than 25 countries.

GÖPEL electronic was founded as a family business by Holger Göpel, Thomas Wenzel, and Manfred Schneider. To this day, this family-oriented character shapes the corporate culture. With Alice Göpel, Jörg Schneider, and Ricardo Wenzel, the next generation is now also actively involving in management and leadership roles. With annual revenue exceeding 40 million euros, GÖPEL electronic is now one of Thuringia’s leading medium-size technology companies.

A central component of the corporate strategy is consistent investment in research and development. Approximately one-quarter of annual revenue is invested in new technologies, products, and innovations. In doing so, the company lays the foundation for sustainable growth and long-term competitiveness each year. In addition to innovative inspection systems for electronics manufacturing, GÖPEL electronics’s core competencies include electrical test systems based on embedded JTAG and boundary scan, as well as test solutions specifically for the automotive sector.

As early as 2002, the company’s individual test platforms became the de facto standard in the European automotive industry. Worldwide, the AOI systems of the Basic Line, Vario Line, and Multi Line series ensure the highest quality in electronics manufacturing and production lines. In the field of boundary scan, GÖPEL electronic is also internationally known as a leading provider of complex solutions and their seamless integration into existing test environments.

At the same time, GÖPEL electronics is increasingly expanding into new industries. Test solutions for the medical, avionics, security technology, and industrial manufacturing sectors complement the portfolio for the automotive and electronics industries. In the field of inspection systems, the manufacturer is setting new standards this year with its new Multi Line AXI X-ray system, which is based on the new ASPECT technology, and opens up expanded possibilities for the inspection of electronic assemblies. In the Embedded JTAG sector as well, the focus is on innovative software solutions and new models that enable an unprecedented level of test depth in boundary scan. The systems are complemented by modern AI-supported functions that further simplify operation and analysis processes.

“35 years of GÖPEL electronics stand for innovative strength, reliability, and sustainable growth,” explains Alice Göpel, Managing Director of GÖPEL electronics. “We are proud to continue writing the success story of our family business together with our employees, customers, and partners. Many of our current solutions have emerged directly from our customers’ requirements. Together, we develop technologies that solve today’s challenges and help shape the future of electronics manufacturing.”

About GÖPEL electronic

GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies, as well as industrial and automotive electronics systems. GÖPEL electronic has four business units:

•  Automotive Test Solutions
• Embedded JTAG Solutions
• Inspection Solutions AOI-AXI-SPI-IVS
• Industrial Function Test

The company is active worldwide, with its own subsidiaries as well as through distributors, and generated sales of approximately 40 million euros in 2023 with 240 employees. For further information, visit www.goepel.com/en.

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Companies to collaborate on R&D to accelerate the introduction of the latest packaging technologies for next-generation AI chips and systems. Partnership will leverage Applied’s global network of innovation centers, including the new EPIC Center in Silicon Valley.

Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today announces that Broadcom Inc. will join Applied’s EPIC platform as an innovation partner to accelerate the development of next-gen chip packaging technologies critical to next-generation AI systems.

The explosive growth of AI has driven a surge in demand for high-performance, energy-efficient compute infrastructure. To address this demand, chipmakers and system designers are increasingly adopting the latest packaging techniques and heterogeneous integration of multiple chips, aiming to boost energy-efficient performance across their systems. To unlock AI’s full potential, the industry is developing a new set of packaging building blocks to dramatically increase the interconnect density and bandwidth of tomorrow’s systems.

“The EPIC platform is designed to drive co-innovation across the ecosystem to change the way semiconductor technologies are developed and commercialized,” said Gary Dickerson, President and CEO of Applied Materials. “This new model gives leading system designers like Broadcom early access to foundational innovations in materials and process equipment, providing an opportunity for deep collaboration to accelerate the introduction of new advanced packaging technologies.”

“Close collaboration with partners throughout the supply chain is critical to delivering the next generation of high-performance AI systems,” said Charlie Kawwas, President of the Semiconductor Solutions Group at Broadcom. “By bringing together Applied’s expertise in materials engineering with Broadcom’s leading capabilities in semiconductor and system design, we can accelerate the time to market for innovations in AI.”

Through the EPIC platform partnership, Broadcom will leverage the R&D work taking place across Applied’s global innovation centers – driving progress in advanced packaging capabilities for connecting multiple chips within a computing system.

“Innovation in advanced packaging is essential to enabling sustainable progress in the AI era,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “We look forward to working side-by-side with Broadcom engineers to explore new technologies for boosting performance-per-watt through advanced chip packaging. With our global innovation platform and the new EPIC Center in Silicon Valley, Applied is uniquely positioned to help chipmakers and system designers accelerate the journey from concept to commercialization.”

“Cross-ecosystem collaboration has never been more important to address the rising complexity of chips for AI systems,” said Dilip Vijay, Vice President and Head of Global Operations for Silicon Products at Broadcom. “System designers must navigate a complex array of solution paths and packaging architectures, while simultaneously driving a faster cadence of product introductions. Collaborating with Applied will provide earlier access to the foundational technologies needed to accelerate progress in advanced packaging.”

Applied’s new EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley is the cornerstone of the company’s global EPIC platform. Representing the largest-ever U.S. investment in semiconductor equipment R&D, the center is designed from the ground up to dramatically reduce the time it takes to commercialize breakthrough technologies from early-stage research to full-scale manufacturing. The facility is on track to become operational in 2026.

Forward-Looking Statements

This press release contains forward-looking statements, including those regarding Applied’s investment and growth strategies, the development of new materials and technologies, industry outlook and technology requirements, the plans and expectations for the EPIC platform and Center, and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those shown by such statements include, without limitation: the demand for semiconductors and customers’ technology requirements; the ability to develop new and innovative technologies; the ability to obtain and protect intellectual property rights in key technologies; the ability to achieve the objectives of the EPIC platform and Center; and other risks and uncertainties described in Applied’s filings with the Securities and Exchange Commission, including Applied’s most recent Forms 10-K, 10-Q and 8-K. All forward-looking statements are based on management’s current estimates, projections, and assumptions, and Applied assumes no obligation to update them.

About Applied Materials

Applied Materials, Inc. is the leader in materials engineering solutions that are at the foundation of virtually every new semiconductor and advanced display in the world. The technology we create is essential to advancing AI and accelerating the commercialization of next-generation chips. At Applied, we push the boundaries of science and engineering to deliver material innovation that changes the world. Learn more at www.appliedmaterials.com.

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$2.59 Trillion in AI Spending Excels by Vendors and Hyperscalers, with Enterprises Yet to Flex Spending Potential.

Worldwide spending on AI is forecast to total $2.59 trillion in 2026, a 47% increase year-over-year, according to Gartner, Inc., a business and technology insights company.

“Through the next several years, the need for capacity will make AI infrastructure, including AI-optimized IaaS, AI-optimized servers, AI network fabric, AI processing semiconductors and devices, the largest segment of the market, accounting for over 45% of spending, which will be driven by vendors,” said John-David Lovelock, Distinguished VP Analyst at Gartner. “Within this segment, spending on AI-optimized servers will triple over the next five years to become the largest subsegment, as cloud services providers expand capacity in anticipation of the workloads created by GenAI models and agentic workflows.”

Enterprises are expanding their use of both GenAI models with built-in existing software applications and the latest AI agents within multiple workflows. Model consumption increases through multistep processes and integration into broad suites of tools as enterprises recognize the potential value of agentic automation. This dynamic means that the short-term outlook for AI models would increase to 110% growth in 2026, adding $6 billion in spending this year.

Worldwide AI Spending by Market, 2025-2027 (Millions of U.S. Dollars)

Market	2025	2026	2027
AI Services	436,351	585,527	759,418
AI Cybersecurity	25,920	51,347	85,997
AI Software	282,897	453,209	638,431
AI Models	15,494	32,604	59,161
AI Platforms for Data Science and Machine Learning	21,292	29,928	42,639
AI Application Development Platforms	6,587	8,416	10,922
AI Data	826	3,126	6,480
AI Infrastructure	975,581	1,431,509	1,890,310
Total AI Spending	1,764,947	2,595,667	3,493,358

Source: Gartner (May 2026)

“Up to this point, AI spending has primarily been driven by technology companies and hyperscalers,” said Lovelock. Enterprises have yet to really flex their spending potential. That is coming, and 2026 will be the inflection year. Currently, organizations show limited appetite for using AI to drive disruptive enterprise change. Instead, they favor tactical AI initiatives with incremental improvements in efficiency and productivity.

“For this reason, CIOs face challenges in proving the value from AI investments and demonstrate tangible business outcomes,” said Lovelock. “Aligning AI initiatives with strategic business objectives is the essential step for success. This incremental approach persists despite AI hype and valuations that reflect aspirations to transform the broader economy.”

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Gartner IT Symposium/Xpo

The outlook on AIs during Gartner IT Symposium/Xpo is the world’s most important conference for CIOs and other IT executives. Gartner analysts and attendees explore how to become agents of change in their organizations and harness AI for successful digital transformation. Follow news and updates from the conferences on X and LinkedIn using #GartnerSYM, and on the Gartner Newsroom.

Upcoming dates and locations for Gartner IT Symposium/Xpo include:
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About Gartner for High Tech Leaders and Providers

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Infineon Technologies AG expands its CoolGaN BDS 40 V G3 bidirectional switch (BDS) family with two new devices, the IGK048B041S and IGK120B041S. The new additions reduce PCB footprint by 82 percent and cut component count in half. For engineers designing within the strict spatial constraints of modern smartphones, notebooks, and wearables, this is a significant and quantifiable step forward. Targeting compact consumer devices, the new devices give power system designers greater flexibility to optimize efficiency and streamline designs without sacrificing performance.

“As consumer devices continue to shrink while power demands grow, engineers face increasing pressure to deliver more from less. The new CoolGaN BDS devices directly address this challenge,” said Johannes Schoiswohl, GaN Business Line Head at Infineon. “Each device integrates the function of two back-to-back silicon MOSFETs into a single component, reducing component count by half and simplifying PCB layouts. Design teams can leverage existing driver layout, avoiding costly redesigns and accelerating time to market. The result is a leaner and more cost-effective power path.”

The BDS, like other GaN devices, is compatible with 5 V gate drive. Offered in WLCSP chip-scale packages measuring 2.1 x 2.1 mm² and 1.7 x 1.2 mm², the IGK048B041S and IGK120B041S are engineered for the tight spatial constraints of smartphones, notebooks, and wearables. The larger GaN device achieves 4.2 mΩ RDD(on) while the smaller device delivers 9 mΩ RDD(on). The CoolGaN BDS devices further distinguish themselves through superior switching and leakage performance. Gate charge is up to approximately 40 percent lower than that of comparable competing devices. Lower gate charge translates directly to faster switching transitions, reduced switching losses, and better system efficiency in fast-charging applications. Additionally, Drain-Drain Leakage current is more than 85 percent lower than competing solutions, underscoring the inherent leakage advantages of GaN technology. Together, these characteristics reduce thermal rise, supporting long-term reliability and helping manufacturers meet increasingly stringent safety requirements.

Unlike silicon MOSFETs, which rely on a body diode that can allow unintended current flow, the CoolGaN BDS devices allow bidirectional voltage and current blocking. This true bidirectional blocking capability is essential for applications such as USB overvoltage protection in smartphones and portable devices, where preventing unwanted reverse current is critical to protecting sensitive downstream components. The devices are equally well-suited to load switching and power multiplexing functions in multi-rail power architectures, where precise control of current direction across multiple supply rails is required.

With the addition of these two devices, the Infineon CoolGaN BDS 40 V G3 family now comprises three devices: the IGK048B041S, IGK120B041S, and the IGK080B041S, addressing the full spectrum of mobile power switching requirements from compact wearables to high-performance notebooks.

Infineon has a strong portfolio with more than 40 new GaN product announcements in the last year and is a preferred partner for customers seeking high-quality GaN solutions. The company is on track with its implementation of scalable GaN manufacturing on 300-millimeter wafers, with first samples already being shipped to customers. 300 mm GaN enables higher production capacity and faster delivery of high-quality GaN products, which further strengthens Infineon’s position in the GaN market.

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MathWorks, the leading developer of mathematical computing software, today announces new Hardware Support Packages that directly connect Model-Based Design and simulation to execution on Renesas‘ RH850/U2A microcontroller for automotive applications and the RA6T2 microcontroller for industrial controls. The new MATLAB and Simulink integrations enable engineering teams to move from simulation to running code on hardware with automatic build, flashing, and on-target execution while also accelerating development cycles, eliminating many manual integration steps.

“Our customers expect a straightforward path from simulation model to microcontroller, and the new integration with MATLAB and Simulink delivers exactly that,” said Brad Rex, Senior Director of System Solution Team, UX (User Experience) Group at Renesas. “By working with MathWorks, we’ve removed the need to assemble toolchains and device drivers by hand so teams can simulate and validate designs earlier, iterate faster, and reduce integration effort across ECU and industrial-control projects.“

The new support packages provide engineering teams with a consistent Model-Based Design workflow across both automotive and industrial programs, reducing integration effort and accelerating deployment. Renesas’ RA microcontroller platform focuses on industrial and robotics applications that require flexible connectivity, real-time responsiveness, and scalable embedded control. The integration with the RA family enables rapid prototyping of servo and variable-speed drive applications, with one-click deployment that streamlines hardware bring-up and on-bench validation for motion profiles and closed-loop tuning.

The automotive electronic control units widely uses he Renesas RH850/U2A microcontroller, which provides the deterministic performance and safety-critical features for EV motor control, latest driver-assistance systems (ADAS), and body electronics. Automotive engineers developing traction motor control for electric vehicles can deploy field-oriented control and regenerative braking algorithms directly from Simulink to RH850/U2A-based ECUs. This shortens the time from concept to vehicle-level testing, supports smoother torque delivery during rapid transients, and speeds calibration across drive cycles—without writing initialization code or custom build scripts.

“Our collaboration with Renesas strengthens the level of interoperability that engineers expect when using MATLAB and Simulink,” said Anuja Apte, India Product Marketing Manager, MathWorks. “By providing a direct path from Simulink models to optimized microcontroller deployment, we help engineering teams move from design to hardware more efficiently while staying integrated with the broader toolchains they rely on. This approach reflects the MathWorks Connections program, which brings partners and customers together to accelerate innovation and reduce time to market within a widely adopted engineering and scientific platform.”

For more information on the new hardware support packages in MATLAB and Simulink, visit the Renesas RH850 hardware support page and the Renesas RA hardware support page on the MathWorks website.

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DefTech Bharat successfully concluded its 2026 edition in Bengaluru, reaffirming its position as one of India’s emerging platforms for aerospace, defence, and space technology collaboration. Held from May 20–22, 2026, at the Karnataka Trade Promotion Organisation (KTPO), Whitefield, the exhibition and conference attracted strong participation from defence manufacturers, technology developers, government stakeholders, startups, research institutions, and international delegations.

According to the organisers, the exhibition featured over 200 exhibitors from India and more than 12 countries, showcasing advanced technologies and next-generation solutions across air, land, sea, cyber, and space domains. The event also saw participation from more than 15,000 business visitors, including procurement officials, defence personnel, OEMs, system integrators, engineers, and policymakers.

The co-located DEFTECH Conference brought together industry leaders, technology experts, and government representatives for strategic discussions on indigenous defence manufacturing, AI-enabled warfare systems, aerospace innovation, cybersecurity, advanced electronics, and C4ISR technologies. More than 20 conference sessions and technical seminars were organised during the three-day event, focusing on technology collaboration, innovation pathways, and future battlefield requirements.

A major highlight of DEFTECH Bharat 2026 was the extensive display of cutting-edge technologies including autonomous and unmanned systems, UAVs and counter-drone solutions, AI-driven surveillance platforms, defence electronics, rugged embedded systems, aerospace subsystems, secure communication technologies, radar and sensor systems, additive manufacturing, semiconductor solutions, cyber defence technologies, and advanced manufacturing equipment. Live demonstrations and interactive technology showcases generated strong interest among both domestic and international visitors.

The exhibition also served as a strong networking and business development platform, enabling direct interaction between OEMs, MSMEs, startups, R&D organisations, armed forces representatives, and global technology providers. Several exhibitors reported high-quality business enquiries and strategic partnership discussions during the event.

Building on the strong response to the 2026 edition, the organisers announced that the next edition of DEFTECH Bharat will be held from May 19–21, 2027, at the Bangalore International Exhibition Centre (BIEC), Bengaluru. The move to the larger BIEC venue comes in response to increasing exhibitor demand and rising visitor participation. The exhibition area for the 2027 edition is expected to expand significantly to accommodate a broader range of aerospace, defence, homeland security, and space technology exhibitors.

With India accelerating its focus on indigenous defence production and technology-led modernisation under the Atmanirbhar Bharat initiative, DEFTECH Bharat continues to evolve as an important industry platform connecting innovation, manufacturing, research, and strategic capability development for the future defence ecosystem.

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ST announces Zephyr 4.4.0 is adding support for the STM32C5, STM32H5E/F, STM32U3C5, as well as the X-NUCLEO-IKS5A1 daughter board, the EVKITST87M01-1 evaluation kit, and the ST B-DSI-MB1314 touch-sensitive display, among many other things, such as sensors and modems (ST87M01). It’s a testament to the collaboration between ST and the Zephyr community. Over the years, ST prevail drivers, optimize performance, and supports new features. And while we do have partners who use Zephyr and benefit from these contributions, this also stems from our desire to work with open-source projects that help democratize real-time operating systems and lower the barrier to entry.

The ST software ecosystem, encompassing the STM32Cube suite and tools like MEMS Studio, provides engineers with low-level device access and accessible machine learning capabilities. Through utilities such as NanoEdge AI Studio, the company facilitates edge AI development and optimizes hardware accessibility for a broad user base. For more insights, visit the ST Blog.

STM32Cube Ecosystem and the other ST software that grant developers low-level access to devices, such as MEMS Studio, which makes machine learning on sensors even more approachable. For many, tools like STM32CubeProgrammer help make the hardware more accessible, while ST’s software packages for its microcontrollers, microprocessors, sensors, and more provide drivers, middleware, example code, and more. Recently, utilities like NanoEdge AI Studio help programmers and software engineers work on neural networks and optimize their AI applications at the edge, thanks to features like synthetic data generation.

The Zephyr project provides a necessary, agnostic system for organizations managing diverse hardware, offering a unified abstraction layer that enhances portability and interoperability for complex, multi-vendor projects. By utilizing this open-source platform, developers can establish a flexible foundation for building proprietary subsystems and avoid vendor-specific lock-in. You can read the full analysis at ST’s official website.

The importance of the collaboration between ST and Zephyr

ST contributes to the Zephyr project and supports its low-level APIs. Concretely, it means we work with Zephyr to support numerous peripherals and interfaces, including USB modules, LCD-TFT display controllers, networking interfaces, and much more. Since the beginning of the Zephyr project, ST engineers have contributed to the Zephyr codebase and the support community. In certain instances, we even help with critical technologies, such as low-power modes, recognizing that our contribution will benefit more than just the engineers using our products. Another aspect of ST’s work on the Zephyr project is the significant effort that involves reviewing community contributions to the STM32 codebase. It may include new board support, bug fixes, and even complete drivers pushed and maintained by external contributors. Over time, these contributions have been responsible for a significant part of the STM32’s current status.

New MCU Support

The STM32N6 Discovery Kit with a CMOS sensor running a person detection application. Zephyr 4.4.0 is a good example of dedication to the project. Similar to frequent updates to STM32CubeProgrammer bringing new STM32 MCU support, this new version of Zephyr adds support for the STM32C5, STM32H5E/F, the STM32U3C5, and the STM32WBA2X. In some instances, like the STM32C5, this version adds support for DMA, I2C, SPI, ADC, timers, and watchdog. Since we just launched the STM32C5, Zephyr 4.4.0 is an inaugural release for the new series. For other devices in an existing series, the MCU support builds on what is already in place, enabling developers to leverage new part numbers.

New Middleware Features

Beyond the device itself, ST also brings updates to its drivers or middleware. For instance, among many improvements, v4.4.0 brings performance enhancements on STM32, adds RTIO and optimizes DMA in SPI STM32 drivers, and adds a stream API for ADC STM32 drivers. We also added the ability to inject ADC channels to enable immediate execution, overriding the regular sequence. Similarly, Zephyr 4.4.0 adds a portable API to read the one-time programmable non-volatile memory on STM32 MCUs. Usually, that means an ADC sensor can now access calibration data. We are also starting to make our I3C interfaces available on our STM32MP2 MPU, and we have moved our USB default stack to a newer and more robust version.

 

 

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At PCIM Europe 2026 in Nuremberg, Infineon Technologies AG showcases its comprehensive semiconductor portfolio for future-proof power infrastructure, AI data centers, robotics, and electromobility. The company presents a broad range of power system solutions spanning silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) semiconductors, with support of software, tools, and cybersecurity expertise.

Infineon’s PCIM 2026 demo highlights:

• Making power infrastructure future-proof: As renewable energy continues to scale, robust power infrastructure is essential to support energy-intensive applications like AI data centers and advance factories. At PCIM, Infineon demonstrates its semiconductor technologies for efficient battery storage systems, uninterruptible power supplies, Solid-State Transformers (SST), and Solid-State Circuit Breakers (SSCB). Highlights include a demo stack for SSTs, along with SSCB components based on CoolSiC JFET technology, enabling fault isolation within microseconds and delivering high robustness for future DC grids.
• Powering AI from grid to core: Rapidly rising AI computing workloads are driving a sharp increase in data center energy demand and accelerating the shift toward new power architectures such as HVDC sidecars and DC microgrids. At PCIM, Infineon presents a comprehensive portfolio of Si, SiC, and GaN supporting this transformation from grid connection to processor core. Exhibits include power semiconductors, drivers, microcontrollers, and sensors for the latest power supply units, as well as solutions for battery backup units, intermediate bus converters, voltage regulation, and intelligent protection devices.
• Shaping the future of electromobility: Infineon is advancing electromobility as the global market leader in automotive semiconductors. PCIM highlights the link of this area, including solutions for traction inverters, DC-DC converters, on-board chargers, and battery management systems. Visitors can explore the company’s “One Inverter, One Infineon” system solution to improve drivetrain efficiency while optimizing space and cost. Additional demos showcase CoolSiC and CoolGaN power switches, the new EasyPACK S and CIPOS Prime module solutions, XENSIV sensors, and AURIX TC4xx microcontrollers.
• Empowering robotics: Robots are rapidly evolving toward physical AI systems that can sense, think, and act. At PCIM, Infineon will showcase semiconductor solutions supporting this evolution across industrial and domestic robots, humanoids, and drones. Demos include high‑efficiency motor control and power management solutions based on CoolGaN power semiconductors, PSOC Control C3 microcontrollers, and XENSIV sensors, enabling compact designs, precise control, and robust operation in future robotic applications.
• EU Cyber Resilience Act: Infineon highlights its commitment to security. At PCIM, experts will address upcoming regulatory requirements of the EU Cyber Resilience Act, illustrating how secured‑by‑design semiconductor solutions enable customers to meet compliance demands while strengthening product differentiation.

Infineon also contributes to the PCIM conference program and the various expo stages. An overview of all presentations by Infineon experts is available at www.infineon/pcim.

 

 

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Keysight Technologies today introduces an Electrical-Optical-Electrical (EOE) simulation solution in ADS 2026. Engineers can now simulate electrical-to-optical-to-electrical signal chains within a single design environment. This capability is increasingly important as AI infrastructure and high-performance computing drive demand for faster optical links. This type of analysis is essential for setting architecture and evaluating performance.

By 2029, 87% of hyperscale optical transceivers will operate at 800 Gbps or higher, with 1.6 Tbps and 3.2 Tbps on the horizon. With optical links connecting CPUs, GPUs, and high-speed SerDes interfaces, teams need to model interactions across electrical and optical domains. Legacy simulation workflows handle these separately, requiring results from different tools to be manually stitched together, potentially missing cross-domain effects that impact system performance.

The breakthrough EOE capability in ADS 2026 enables engineers to simulate the complete signal path, from transmitters through optical and photonic circuits to electrical receivers, in a unified workflow. The solution leverages Keysight’s High Speed Digital workflow with Keysight Photonic Designer. By simulating the mixed-domain signal chain before hardware implementation, teams can evaluate electrical and optical design tradeoffs and assess signal integrity against high-speed standards earlier in the design cycle.

Key benefits of the solution include:

• Detect signal integrity issues across electrical and optical domains before prototyping: Simulate high-speed SerDes digital channels and photonics IC behavior together. It catches cross-domain issues that surface only when you model both domains simultaneously.
• Simulate bidirectional optical links as they behave in the real world: Full-duplex optical simulation captures forward and backward signal propagation within an EOE channel. It’s a capability that previous tools could not perform.
• Assess nonlinear effects across multiple wavelengths for multi-lane interconnects: Wavelength division multiplexing support within EOE simulation flows lets engineers evaluate how optical nonlinearities affect performance across wavelengths. This addresses a growing concern as 800G and 1.6T optical links use multiple wavelengths simultaneously on the same waveguide. These modulations in wavelengths and non-linearities model together as a system.
• Obtain a realistic view of system-level signal quality: Noise modeling spans the electrical and optical domains simultaneously, enabling engineers to assess performance under realistic conditions rather than modeling each domain in isolation.
• Catch nonlinear effects before they reach hardware: Modulator bias-dependent and large-signal non-linear effects are visible within end-to-end simulations.
• Make electrical-optical design trade-offs in one workflow: The electrical channel and optical envelope simulators have a patent for multi-domain co-simulation bridges, which eliminates the need to move between separate tools to evaluate trade-offs.

Beyond system-level EOE simulation, ADS 2026 covers the full design flow from system down to component optimization. Through PDK support at the circuit level and Keysight RSoft integration at the component level, engineers get a true representation of photonic IC behavior, with no disconnect between the real chip and system-level simulation.

Niels Fache, Senior Vice President, Keysight, said, “AI infrastructure depends on 800 Gbps and 1.6 Tbps optical links to move data at scale. At these speeds, electrical and optical performance can no longer be modeled separately. With ADS 2026, engineering teams can now simulate those interactions before committing to silicon.”

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Defence technology company Tonbo Imaging receives an award and a contract from the Indian Navy under the ADITI 3.0 innovation framework to integrate and commission a High Power Microwave (HPM) system for naval platforms. The programme supports iDEX and the Defence Innovation Organisation (DIO) under the Ministry of Defence, Government of India. Within the scope of the engagement, Tonbo Imaging will undertake system integration and commissioning activities, followed by the supply of multiple production units upon successful development, validation, and acceptance.

High-power microwave systems represent a strategically significant direct-energy capability and are considered a strategic asset; only a limited number of countries possess them today. Such systems provide a non-kinetic means of disabling or degrading adversary electronics, sensors, and unmanned systems, and one of the few practical approaches to countering swarms of drones, making them increasingly relevant in modern maritime and asymmetric threat environments. The Indian Navy’s continued investment in this domain reflects a forward-looking approach to electromagnetic spectrum dominance and next-generation deterrence.

ADITI (Advanced Defence Technology Incubation) is a Government of India initiative to enable the maturation, integration, and validation of advance defence technologies before induction. The selection of Tonbo Imaging under ADITI 3.0 reflects the emphasis on indigenously developing strategic capabilities aligned with the Navy’s evolving operational requirements and long-term force modernisation plans.

Commenting on the development, Arvind Lakshmikumar, Managing Director and Chief Executive Officer, Tonbo Imaging India Limited, said, “This programme represents a significant responsibility to execute complex capability integration with discipline, rigour, and clear alignment to end-user operational needs. Over the past several years, Tonbo Imaging has invested substantially in the indigenous development of core building blocks of High Power Microwave technology, including critical sub-systems and vacuum tube sources. We are among the very few private organisations to own core intellectual property in vacuum-tube technologies that are fundamental to HPM systems, and this deep technology foundation has been a key factor in our selection for this naval programme. For the class of effects required in High Power Microwave applications, vacuum tube–based sources remain the practical path forward, as they can generate the extremely high peak power and energy levels necessary for effective target coupling. Solid-state RF sources, while well suited for many RF applications, cannot today achieve the required peak power and pulse energy levels within feasible size, weight, and efficiency envelopes for operational HPM systems.”

With this engagement, Tonbo Imaging’s role extends well beyond that of an imaging and electro-optics company, reinforcing its position as a defence technology company focused on the development and integration of advance defence systems. The programme underscores the company’s growing involvement in complex system-level integration, advanced electronics, embedded software, and emerging direct-energy and mission systems, in addition to its prevailing strengths in electro-optics. This evolution reflects Tonbo Imaging’s transition toward delivering integrated defence capabilities.

About Tonbo Imaging India Limited

Tonbo Imaging India Limited is a defence technology company that focuses on the design, development, and integration of advanced sensing, perception, and mission-critical systems for military and security applications. The company’s portfolio spans electro-optics, thermal imaging, situational awareness, advanced electronics, embedded software, and emerging directed-energy technologies, enabling the delivery of integrated defence solutions that support operational requirements across land, maritime, and air domains. Tonbo Imaging continues to evolve as a defence technology and systems company, investing in the development of next-generation directed-energy systems as well as advanced defence solutions such as loitering munitions and counter-unmanned aerial systems (C-UAS), reflecting its strategic focus on addressing emerging operational threats through indigenous capability development.

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The initiative that helps defense organizations to modernize EW test and simulation with greater speed, flexibility, and minimal risk.

Today, Keysight Technologies Inc. announces a strategic collaboration with SRC UK Limited to support EW customers globally in modernizing their test and simulation environments. The initiative will help accelerate the adoption of Keysight’s EWASP, enabling customers to transition to open, scalable, and software-defined architectures with greater efficiency and minimal operational risk. The collaboration also enables customers to preserve and integrate existing threat libraries and test assets into modern, open architectures, enabling continuity while accelerating modernization.

As EW systems grow increasingly complex, defense organizations are seeking more flexible and high-fidelity test environments to validate performance, shorten development timelines, and ensure mission readiness. Through this collaboration, Keysight and SRC will align their respective strengths in EW simulation, systems integration, and local engineering support to address customer needs across global markets.

The effort centers on supporting customers across key areas, including engineering and integration services, training, and knowledge transfer. By combining Keysight’s expertise in EWASP architecture and scenario generation with SRC UK’s in-country engineering and support, customers gain faster deployment, improved access to expertise, and stronger operational readiness. This approach enables more accurate and repeatable validation of EW systems, and the collaboration helps deliver reliable, high-performance capabilities for increasingly complex electromagnetic environments.

Steve Davies, Managing Director at SRC UK, said: “Collaborating with Keysight allows us to bring advanced EW simulation capabilities closer to UK customers. By combining our proven EW, IMD, Mission Data, and engineering expertise with Keysight’s EWASP platform, we can help organizations optimize their test environments while maintaining alignment with evolving mission requirements.”

Eric Taylor, Vice President, Aerospace, Defense and Government Solutions at Keysight, said: “This effort reflects Keysight’s commitment to supporting our customers across the globe as they modernize EW capabilities. Together with SRC, we are expanding access to scalable, high-fidelity simulation and test solutions that reduce risk, improve efficiency, and accelerate mission readiness across the EW development lifecycle.”

Keysight will also discuss its further EW modernization at the upcoming AOC Europe event.

Resources

• EWASP: Advancing EW Test and Measurement
• EWASP Solution Catalog
• EWASP Solution Brief

About Keysight Technologies

At Keysight, we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world.

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