ELE Times

Milestone Systems, a leading provider of open platform video management software announced the release of XProtect 2025 R1, featuring expanded cloud integration capabilities and advanced vehicle identification video analytics. This release demonstrates Milestone’s commitment to platform accessibility and enhanced security features across its XProtect product line.

Extended Arcules Plugin Support Broadens Cloud Integration Options

The XProtect 2025 R1 release, available from March 18 marks a significant expansion in platform accessibility, with the Arcules Plugin now supporting XProtect Professional+, Expert, and Corporate editions. This enhanced integration enables seamless video and alarm flow from the Arcules Video Surveillance as a Service (VSaaS/cloud solution) to XProtect across a broader range of deployments, opening new possibilities for system integrators and end users.

Previously available only for XProtect Corporate users, the Arcules Plugin has been redesigned as a standalone device solution, eliminating the requirement for interconnect licensing. This strategic enhancement allows organizations using XProtect Professional+, Expert, and Corporate to leverage Arcules’ capabilities, significantly expanding market accessibility and integration options.

Advanced Analytics Transform Vehicle Identification and Tracking

The XProtect License Plate Recognition extension in XProtect 2025 R1 introduces comprehensive enhancements that elevate vehicle identification to new levels of sophistication. These updates enable more precise and efficient vehicle analytics, including:

• Vehicle Classification: Enables differential processing based on vehicle type, from motorcycles to buses
• Color Recognition: Facilitates rapid vehicle identification for security and law enforcement
• Make/Model Detection: Enhances vehicle identification accuracy for investigative purposes
• Vehicle Angle Detection: Determines vehicle orientation relative to camera position

These advanced capabilities within the XProtect LPR extension accelerate vehicle identification processes, allowing security personnel and law enforcement to quickly locate and identify vehicles of interest. The system’s enhanced capabilities support rapid filtering of video data based on specific vehicle characteristics, speeding up investigation processes and improving response times.

Transformative Impact on City Operations

Beyond security applications, the enhanced vehicle analytics provide valuable insights for urban planning and traffic management. The system’s ability to analyze various vehicle types and their movement patterns enables:

• Data-driven traffic flow optimization
• Strategic congestion management
• Environmental impact assessment through traffic pattern analysis
• Informed infrastructure development planning

This latest release continues Milestone’s tradition of innovation in video management technology, providing partners and customers with advanced tools to enhance security operations and leverage video data for broader operational insights.

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Automotive Grade Device Allows for the Calculation of Color Temperature, Light Source Differentiation, and Placement behind Dark Cover Glass

The Optoelectronics group of Vishay Intertechnology, Inc. introduced the industry’s first AEC-Q100 qualified RGBIR color sensor. The Vishay Semiconductors VEML6046X00 features a highly sensitive photodiode, low noise amplifier, and 16-bit ADC in a miniature, opaque 2.67 mm by 2.45 mm surface-mount package with a low 0.6 mm profile.

With separate red, green, blue, and infrared channels, the Automotive Grade device released today allows for the calculation of the color temperature to enable white point balancing for displays. The spectral sensitivity of the VEML6046X00’s green channel matches that of the human eye to ensure highly accurate measurements, while IR channel facilitates a stable output over a wide range of light sources. With an ambient light range from 0 lx to 176 klx, the sensor will not saturate in daylight, while its high sensitivity of 0.0053 lx/ct allows the device to be placed behind dark cover glass.

Offering a high operating temperature range to +110 °C, the VEML6046X00 will be used for automotive display backlight controls, infotainment systems, rear view mirror dimming, interior lighting control systems, heads-up displays, color recognition, CCT measurement, mood lighting, and laser front light monitoring. The sensor supports the easy to use I²C bus communication interface for these applications and offers an interrupt function.

The VEML6046X00 features a supply voltage range of 2.5 V to 3.6 V, I²C bus voltage range of 1.7 V to 3.6 V, and low shut down current consumption of 0.5 μA typical. RoHS-compliant, halogen-free, and Vishay Green, the device offers a Moisture Sensitivity Level of 2a and a floor life of four weeks in accordance with J-STD-020E.

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• Validates the performance of AI infrastructure by emulating real-world workloads
• Evaluates how new algorithms, components, and protocols improve the performance of
  AI training
• Adjusts and optimizes the parameters of both AI workloads and system infrastructure without investing in expensive large-scale deployments

Keysight Technologies, Inc. introduces Keysight AI Data Center Builder, an advanced software suite that emulates real-world workloads to evaluate how new algorithms, components, and protocols impact the performance of AI training.KAI Data Center Builder’s workload emulation capability integrates large language model and other artificial intelligence model training workloads into the design and validation of AI infrastructure components – networks, hosts, and accelerators. This solution enables tighter synergy between hardware design, protocols, architectures, and AI training algorithms, boosting system performance.

AI operators use various parallel processing strategies, also known as model partitioning, to accelerate AI model training. Aligning model partitioning with AI cluster topology and configuration enhances training performance. During the AI cluster design phase, critical questions are best answered through experimentation. Many of the questions focus on data movement efficiency between the graphics processing units. Key considerations include:

• Scale-up design of GPU interconnects inside an AI host or rack
• Scale-out network design, including bandwidth per GPU and topology
• Configuration of network load balancing and congestion control
• Tuning of the training framework parameters

The KAI Data Center Builder workload emulation solution reproduces network communication patterns of real-world AI training jobs to accelerate experimentation, reduce the learning curve necessary for proficiency, and provide deeper insights into the cause of performance degradation, which is challenging to achieve through real AI training jobs alone. Keysight customers can access a library of LLM workloads like GPT and Llama, with a selection of popular model partitioning schemas like Data Parallel, Fully Sharded Data Parallel, and three-dimensional parallelism.

Using the workload emulation application in the KAI Data Center Builder enables AI operators to:

• Experiment with parallelism parameters, including partition sizes and their distribution over the available AI infrastructure
• Understand the impact of communications within and among partitions on overall job completion time Identify low-performing collective operations and drill down to identify bottlenecks
• Analyze network utilization, tail latency, and congestion to understand the impact they have on JCT

The KAI Data Center Builder’s new workload emulation capabilities enable AI operators, GPU cloud providers, and infrastructure vendors to bring realistic AI workloads into their lab setups to validate the evolving designs of AI clusters and new components. They can also experiment to fine-tune model partitioning schemas, parameters, and algorithms to optimize the infrastructure and improve AI workload performance.

Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: “As AI infrastructure grows in scale and complexity, the need for full-stack validation and optimization becomes crucial. To avoid costly delays and rework, it’s essential to shift validation to earlier phases of the design and manufacturing cycle. KAI Data Center Builder’s workload emulation brings a new level of realism to AI component and system design, optimizing workloads for peak performance.”

KAI Data Center Builder is the foundation of the Keysight Artificial Intelligence architecture, a portfolio of end-to-end solutions designed to help customers scale artificial intelligence processing capacity in data centers by validating AI cluster components using real-world AI workload emulation.

Keysight will showcase KAI Data Center Builder and its workload emulation capabilities in booth 1301 at the OFC 2025 conference, April 1-3, at the Moscone Center, San Francisco, California.

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Device Offers Wide Power Supply Range from 1.65V to 3.6V and
Fast Access Time Down to 10 ns

To meet the demand for high-density fast CMOS SRAMs, Alliance Memory today introduced a new 32Mb device in the 6 mm by 8 mm 48-ball FBGA package. Configured as 2M x 16, the AS7CW2M16-10BIN offers a wide power supply range from 1.65V to 3.6V.

“As other manufacturers continue to phase out their SRAM offerings, Alliance Memory remains committed to supporting the market with a wide range of fast memory solutions,” said David Bagby, president and CEO of Alliance Memory. “Our latest device not only provides our customers with a higher density option but also offers increased flexibility by supporting both 1.8V and 3.3V operating voltages in a single part.”

Operating from a single 1.8V, 2.5V, or 3.3V power supply, the device released today is optimized for consumer TVs and digital cameras, industrial robotics, networking routers, medical equipment, and high-speed automotive systems. For these applications, the AS7CW2M16-10BIN provides fast access times down to 10 ns minimum, data retention voltages down to 1.5V minimum, and low power consumption with operating currents down to 43mA typical and standby current of 10mA typical.

The SRAM features TTL-compatible inputs and outputs, tri-state output, easy memory expansion with chip select (CS) and output enable (OE) functionality, and data control for upper and lower bytes. The RoHS-compliant device operates over a -40°C to +85°C temperature range.

The AS7CW2M16-10BIN is the latest addition to Alliance Memory’s full range of fast SRAMs, which include devices with densities from 64Kb to 16Mb. Fabricated using high-performance, high-reliability CMOS technology, the ICs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions.

Device Specification Table:

Samples and production quantities of the new fast SRAM are available now, with lead times of eight to 10 weeks. The AS7CW2M16 32Mb fast SRAM part will also be available in a TSOP package later in Q2 2025.

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As vehicle architectures transition to hybrid and electric models, conventional battery systems are increasingly being supplemented or replaced by 48 V power sources. This shift is expected to become the new standard for future electric vehicles, as 12 V and 24 V power net systems reach their limits. 48 V systems enable advanced features, enhance passenger comfort, and improve efficiency by reducing currents and simplifying wire harness complexity. Additionally, the electrification of both primary and secondary power distribution systems requires replacing conventional relays and fuses. To support this development, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the Power PROFET + 24/48V switch family, developed for the requirements of modern vehicle power systems.

The Power PROFET + 24/48V switch family is housed in a compact, TO leadless package and includes two high-side switch variants: the BTH50030-1LUA with an RDS(ON) of 3.0 mΩ and the BTH50015-1LUA with an RDS(ON) of 1.5 mΩ, which enables minimal power losses in high-current applications. The devices are ideal for the demanding requirements of today’s automotive electrical systems and for commercial and hybrid vehicles, as well as the next generation of electric cars, where they enable a safer, greener and more comfortable driving experience.

One of the key benefits of the Power PROFET + 24/48V switch family is their efficiency and space-savings capabilities. The switches are highly integrated and offer resettable and diagnostic features. They are designed for optimal performance in demanding environments and offer a low on-resistance of just 1.5 mΩ. This makes them ideal for high-current applications and robust enough to withstand the conditions in hot cabin and engine compartments. With more than 1,000,000 switching cycles, the switches far exceed the average 200,000 cycles of conventional relays and offer excellent reliability.

Built-in protection and diagnostic functions such as short-circuit, over-current and over-temperature protection provide safety of the device. Diagnostic signals enable advanced fault detection and increase the reliability of the entire vehicle by preventing failure modes in the power supply network. The switches are housed in an 8-pin TO leadless package, reducing the footprint by 23 percent compared to, for example, D2PAK packages with similar thermal performance. The accuracy of the load current sense is ±5 percent after calibration and can be easily determined by reading an analog voltage at the IS pin. In addition, the switch family is PRO-SIL ISO switch 26262-ready and comes with a safety application note that supports the evaluation of hardware elements according to ISO 26262.

To enable seamless integration, the Power PROFET + 24/48V family is supported by the online simulation tool Infineon Automotive Power Explorer which is available in the Infineon Developer Center. The tool helps to calculate intrinsic fuse characteristics and visualize the sense current range for specific load currents, ensuring accurate and efficient implementation.

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Hitachi High-Tech Corporation (“Hitachi High-Tech”) is strengthening its analytical business through integrating and jointly operating its Hitachi High-Tech Analytical Science Ltd. (“Hitachi High-Tech Analytical Science”) and Hitachi High-Tech Science Corporation (“Hitachi High-Tech Science”) businesses. As of April 1, 2025, Hitachi High-Tech Science will become Hitachi High-Tech Analysis Corporation as part of this re-structure.

By integrating the core technologies of both companies, we will be better equipped to address the increasingly complex processes involved in developing, manufacturing, and inspecting materials that our customers encounter. Bringing together X-ray fluorescence (XRF), optical emission spectroscopy (OES), laser-induced breakdown spectroscopy (LIBS), thermal analysis (TA), liquid chromatography and spectrophotometers from Hitachi High-Tech Analytical Science and Hitachi High-Tech Science will facilitate the development of new, innovative solutions.

Initiatives to create a safe and secure society, and reducing environmental impact are becoming increasingly important across a wide range of business fields including healthcare, semiconductors and electronic components, and batteries. The analytical division and beam technology division, which includes electron microscopes, are key to supporting Hitachi High-Tech Group’s Core Technology Solutions business. The Core Technology Solutions division leverages its expertise in Observation, Measurement, and Analysis to offer specialized solutions for measurement and inspection. These solutions support R&D, manufacturing, and quality control processes, helping to address both customer and societal challenges.

Whilst manufacturing processes are becoming more complex, waste reduction, circular economy, and preservation of raw materials are key to a more sustainable, global industry.

Hitachi High-Tech Group will use the “Power of Knowledge” it possesses to know accurately and leveraging deep understandings the genuine issues of society and customers, and we will contribute to create a sustainable society by solving these issues.

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Rohde & Schwarz continues to develop its R&S ELEKTRA EMC test software by adding new measurement methods, adapting it to new standards and ensuring that users can carry out measurement tasks even more efficiently. R&S ELEKTRA now supports all current EMC standards in the commercial, automotive, wireless, military and aerospace sectors. The software provides interactive, partially and fully automated solutions for EMC measurements during development and for fully automated standard-compliant certification measurements.

R&S ELEKTRA from Rohde & Schwarz, the market leader in EMC test and measurement, is a comprehensive EMC test software family that is ideally suited to the powerful Rohde & Schwarz line of EMC test instruments and signal and spectrum analyzers. The solution supports all current standard-compliant emission, radiated and conducted EMS measurements, including EMS tests in reverberation chambers (RVC), the use of AWGN interference signals and the simultaneous use of multiple interference signals. Development departments and EMC test labs can use this software to ensure their test instruments achieve peak performance and to make their test processes more efficient through automation. This saves resources, time and therefore money.

Efficient user interface and hardware usage save time and costs
R&S ELEKTRA test software automates EMC tests and controls the entire EMC system. The user interface provides access to all the important functions for the test setup at a single level. An extensive library of preset measurements and standard-compliant test setups and test sequences can also be accessed directly using a keyword search function, making test configuration much simpler. The first measurement takes only a few minutes to set up. R&S ELEKTRA makes optimum use of the computer’s capacities and the instrument interfaces, saving an unprecedented amount of measurement time.

Monitoring for correct, reproducible EMC measurements
The software also monitors the plausibility of measurement parameters and stores all information relevant to the measurement along with the measurement results. This allows R&S ELEKTRA to ensure the reproducibility and comparability of measurements, preventing erroneous measurements.

Immediately after measurements are complete, laboratory staff can obtain comprehensive test reports with the reliably repeatable measurement results. R&S ELEKTRA has its own SQL database in which test reports and dedicated measurement data can be collected and stored. Measurement data can be forwarded through a standard interface of this database to ERP or CRM systems, for example, and analyzed there.

The R&S ELEKTRA EMC test software with new and improved functions is available now. R&S ELEKTRA is compatible with all Rohde & Schwarz EMC test equipment and provides interfaces to integrate almost all existing equipment in the lab. Rohde & Schwarz offers comprehensive training and support for the introductory and changeover phases.

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Versatile 1.6 Terabit Ethernet platform in portable bench top or rack mount solutions, with application support for validating silicon chips to network equipment performance

Keysight Technologies Inc.announced the Interconnect Test System, an advanced software solution, and the Interconnect and Network Performance Tester 1600GE hardware traffic emulator it runs on. This cohesive solution validates AI infrastructure, network components, and data center interconnects from 200GE to 1600GE, expanding on the capabilities of the recently announced Interconnect and Network Performance Tester 800GE bench top. The ITS software runs on both the 800GE and 1600GE Interconnect and Network Performance Tester platforms.

For decades, validating network interconnect performance required a manual, time-consuming process with limited or no automation and needed advanced programming skills to write scripts. That process also lacked a centralized system to organize and store interconnect data and reports, making tracking and replicating tests and configurations difficult. With the increasing diversity and scale of AI and data center interconnects, these traditional test methods cannot accurately predict and measure the reliability of today’s complex production networks.

The new Interconnect and Network Performance Tester 1600GE, with ITS software, delivers a holistic system that can organize, store, and use data intelligently to automate interconnect validation in high-speed Ethernet networks and AI data centers. Benefits of the solution include:

• Adaptable and versatile high-speed Ethernet platform – The INPT-1600GE platform is lightweight and office quiet, supporting high power consumption optical receivers up to 40 watts. Available as a portable bench top unit or rack mount chassis, both models support 1x1600GE, 2x800GE, 4x400GE, and 8x200GE to validate a broad range of Ethernet devices and interconnects that use 212Gb/s electrical lane interfaces. The bench top model has a built-in handle for easy movement inside or outside the lab. The INPT-1600GE assesses the reliability, stability, and interoperability of silicon chips, optical transceivers, active cables, and networking equipment at speeds from 200GE to 1600GE PAM4 for layers 1 through 3 on any port.
• Redefines interconnect data storage and organization – The ITS software includes a first-of-its-kind, US patent pending Interconnect Library (IL) that introduces a new way to organize, retrieve, and use interconnect data, including Common Management Interface Specification (CMIS) data. CMIS standardizes how high-speed interconnects are programmed and how the data is retrieved and used in networking systems. This cutting-edge library organizes all data and creates a comprehensive record that can be used to create and execute new tests. Once a record is created, it is automatically added to the IL self-serve database, where users can retrieve, reuse, edit, and update records. This dramatically increases productivity and accelerates the creation of automated test suites without advanced programming.
• Optimize interconnect validation efficiency – The browser-based ITS software includes a robust and fast graphical user interface (GUI) that allows multiple users to simultaneously run or schedule tests using the application’s advanced multi-user test scheduler. Using this tool increases test case throughput, allowing more tests to run unattended by a greater number of users.
• Automated report generator – Allows users to report on all the data from the IL records, including test results and CMIS data that includes PASS/FAIL information. This helps streamline the development process for interconnects and can also be used for manufacturing test applications using automated reports.

Khushrow Machhi, Senior Director of Marketing, Physical Layer Products Division at Broadcom, said: “As the industry moves toward 1.6T networking, ensuring signal integrity and error correction at these unprecedented speeds is critical. Broadcom is excited to collaborate with Keysight in developing cutting-edge testing solutions that address the challenges of higher modulation schemes, SerDes advancements, and forward error correction. Our combined expertise will help accelerate the deployment of 1.6T technology, paving the way for the future of high-speed data centers and AI-driven infrastructure.”

Andy Moorwood, Vice President, Hardware Engineering, Network Test & Security Solutions, Keysight, said: “Keysight’s ITS software is the industry’s first comprehensive solution for validating performance in high-speed Ethernet and AI data center interconnects. It helps reduce device failures and drastically reduces the time needed to characterize various interconnects. Moving from a manual and tedious process to one that enables faster, more accurate test suite automation without complex programming significantly boosts productivity.”

Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: “Keysight is working with the majority of global standards bodies and manufacturers of silicon chips, optical and copper interconnects using 224Gb/s electrical lane interfaces to accelerate development of the ecosystem for 800GE and 1.6T AI network infrastructures. Our 1.6T and 800GE hardware platforms, combined with the ITS software, enable critical interconnect performance evaluations and tremendous gains in testbed productivity. This equips our customers with the tools they need to deploy highly stable and reliable solutions into their networks.”

emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product lifecycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world.

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RAA278830 LVDS Solution Adds ISO 26262 Compliance to Renesas’ Industry-Leading Video Diagnostic Capabilities

Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems, and electronic mirrors.

As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road.

Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.

Key Features of the RAA278830

• Dual Open-LDI Input/Output
• ISO 26262 Functional Safety ASIL B rating

CRCs, parity, BIST, and redundancy

safety mechanisms implemented throughout the entire data path

• Video Diagnostic Capabilities

Input/Output monitoring of video timing, signal integrity, and content

Flickering, flashing, occlusion, and glare detection

• Spread Spectrum for lower system level EMI profile
• Image enhancement engine for superior image quality
• Dual host interface: I2C & SPI (configurable)
• SPI-Flash based OSD as well as an embedded font based OSD

SPI boot capability (boot from SPI Flash, no MCU needed)

Supports multi-bank for fail-safe OTA updates

• Space-efficient 72SCQFN, 10mm x 10mm
• AEC-Q100 Grade 2 qualified

“Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”

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Modules range in power levels from 750W up to 2kW, with a top power density of 5kW/in3

New Vicor DCM3717 and DCM3735 DC-DC power modules support the growing trend of 48V-centric power delivery networks that provide greater power system efficiency, power density and lower weight versus 12V based PDNs. The DCM products are non-isolated, regulated DC-DC converters, operating from a 40 – 60V input to generate a regulated output adjustable from 10V to 12.5V. The DCM3717 family is available in two power ranges, 750W and 1kW, and the DCM3735 is a 2kW device. These new DCM products can be paralleled to rapidly scale system power levels.

With industry-leading power density at 5kW/in3, these new DCM products enable power system designers to deploy high-performance 48V power delivery networks for legacy 12V loads and achieve significant size, weight and efficiency benefits. The 5.2mm low-profile surface-mount package is thermally adept, easing thermal management system design.

The DCM3717S60E13G5TN1 (750W) and DCM3717S60D13K0TN1 (1000W) are available (size: 36.7 x 17.3 x 5.2mm), and the DCM3735S60D13L0TN1 (2000W / size: 36.7 x 35.4 x 5.2mm) will be available later this year.

Enabling easy conversion from high voltage to 12V via a 48V hub

Power delivery networks are making a decisive shift from 12V to 48V architectures to take advantage of higher efficiency. The benefits of using 48V have been illustrated in high-performance computing, automotive and in many other applications. However, seizing this opportunity presents many power system design challenges for legacy systems that have been optimized around 12V architectures for decades. Vicor, the leader in 48V DC-DC power conversion, is easing the transition with a 48V-centric power module approach to power systems design and, as with other 48V power modules, this new family of non-isolated DCM products can be used in conjunction with the Vicor BCM high-voltage fixed-ratio bus converter family that converts from high voltage (800V and 400V) to 48V. Once a 48V bus is established, Vicor DCM products can efficiently convert from 48V to a regulated 12V.

Industrial applications are transitioning to 48V PDNs

Growth applications, such as battery formation and test and semiconductor automated test equipment, aspire to rapidly transition to 48V PDNs to gain a competitive advantage but are hindered by existing investments in 12V power conversion. Some BFT implementations, for example, have been optimized to convert 12V to the battery cell load and cannot be readily re-engineered for 48V. The DCM3717/3735 products enable BFT systems engineers to preserve their existing investment by bridging 48V and 12V to create a high-performance 48V PDN.

The Vicor broad ecosystem of 48V centric power modules enables easy scalability and unprecedented flexibility when converting from high voltage to point-of-load for a wide variety of applications.

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New analog products from TI accurately measure currents and voltages with the highest resolution, enabling robots to perform detailed and complex tasks

Texas Instruments introduced the industry’s first functionally isolated modulators, helping designers achieve more precise motor control in compact robot designs. The new AMC0106M05, AMC0136 and AMC0106M25 isolated modulators enable increased precision and higher resolution of 12 to 14 effective number of bits for accurate and reliable phase current sensing and DC voltage sensing measurements. Offered in a small leadless package, the new products in TI’s isolated analog-to-digital converter portfolio help designers achieve smooth torque operation and fine motor control, while decreasing size and cost in low-voltage (<60V) robotics designs.

Why it matters

Engineers today are challenged to design smarter robots to perform more detailed tasks. The galvanically isolated modulators enable robotics engineers to achieve precise motor control and system protection in smaller, more sophisticated designs. This precision makes it possible for robots to complete a variety of complex tasks, such as threading a needle or handling small nuts and bolts. In addition, the small size of the new modulators—measuring just 3.5mm x 2.7mm—requires 50% less board space than competing reinforced isolation solutions. With this decrease in size, designers have more space to incorporate additional features that support precise control and reliable operation in compact robot applications.

“These modulators from TI enable designers to increase robotics accuracy and productivity in new use cases and smaller form factors, from the factory floor to the operating room,” said Karthik Vasanth, vice president and general manager of Data Converters and Clocks at TI. “For example, where humanoid robots could previously only complete simple tasks, our new functionally isolated modulators now allow them to carry out more dexterous and precise jobs.”

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Superjunction Device Enables High Power Ratings and Density While Lowering Conduction and Switching Losses to Increase Efficiency

Vishay Intertechnology, Inc. introduced a new Gen 4.5 650 V E Series power MOSFET that delivers high efficiency and power density for telecom, industrial, and computing applications. Compared to previous-generation devices, the Vishay Siliconix n-channel slashes on-resistance by 48.2 % while offering a 65.4 % lower resistance times gate charge, a key figure of merit (FOM) for 650 V MOSFETs used in power conversion applications.

Vishay offers a broad line of MOSFET technologies that support all stages of the power conversion process, from high voltage inputs to the low voltage outputs required to power the latest high tech equipment. With the SiHK050N65E and other devices in the Gen 4.5 650 V E Series family, the company is addressing the need for efficiency and power density improvements in two of the first stages of the power system architecture — power factor correction (PFC) and subsequent DC/DC converter blocks. Typical applications will include servers, edge computing, and super computers; UPS; high intensity discharge (HID) lamps and fluorescent ballast lighting; telecom SMPS; solar inverters; welding equipment; induction heating; motor drives; and battery chargers.Built on Vishay’s latest energy-efficient E Series superjunction technology, the SiHK050N65E’s low typical on-resistance of 0.048 Ω at 10 V results in a higher power rating for applications > 6 kW. With 50 V of additional breakdown voltage, the 650 V device addresses 200 VAC to 277 VAC input voltages and the Open Compute Project’s Open Rack V3 (ORV3) standards. In addition, the MOSFET offers ultra low gate charge down to 78 nC. The resulting FOM of 3.74 Ω*nC translates into reduced conduction and switching losses to save energy and increase efficiency. This allows the device to address the specific titanium efficiency requirements in server power supplies or reach 96 % peak efficiency.

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New hardware integrates closely with convenient, graphical development environment

Developing context-aware applications with MEMS sensors is faster, more powerful, and more flexible with ST’s latest-generation sensor evaluation board, the STEVAL-MKI109D. Now upgraded with an STM32H5 microcontroller, USB-C connector, and extra digital interfaces including I3C for flexible communication, the new board lets users quickly evaluate sensors and confidently handle demanding projects.

Engineers unveiled the STEVAL-MKI109D during a live tech lab, showing how to simply plug in a sensor module, connect a PC, and start analyzing data in ST MEMS Studio. Using this all-in-one graphical environment, developers can visualize the sensor output, quickly fine-tune settings, configure features, and exercise the AI capabilities of ST sensors with a machine-learning core (MLC) and intelligent sensor processing unit (ISPU) inside. The tool provides advanced functions including power monitoring and supply voltage management that help optimize energy consumption and debugging.

ST’s MEMS portfolio contains inertial sensors, pressure sensors, biosensors, and digital and analog microphones offering many choices of speed, accuracy, full-scale range, and package style in industrial, consumer, and automotive grades. Extremely compact and robust, they are suited to diverse applications including consumer products, smartphones, wearables, smart-home devices, industrial sensing, safety equipment, healthcare, environmental monitoring, and many more. Automotive-grade devices target applications including navigation support, advanced driver assistance, and automated driving.

An evaluation module is available for each sensor type, mounted on a convenient DIL24 card with headers, ready to connect to the STEVAL-MKI109D board. Additional plug-and-play accessories are available, including biosensor electrodes and remote-sensing extension cables to quickly evaluate sensors when building proof-of-concept models and developing prototypes.

The STM32H5 MCU at the heart of the new board has the latest high-performing and efficient Arm Cortex-M33 core with extensive peripherals that enable faster, more convenient development. Customers’ sensor projects can target any of the over 1400 microcontrollers and microprocessors in the STM32 family. The MLC, finite-state machine (FSM), and ISPU embedded in select MEMS devices help optimize application performance and power consumption for superior functionality, responsiveness, and battery runtime.

The STEVAL-MKI109D board is available from distributors and the eSTore, from $105. ST MEMS Studio is ready to download now at www.st.com/mems-studio and is supported with automatic upgrades to ensure users always have the latest software and firmware.

For further information please visit: www.st.com/mems-studio

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The robust, low-power solutions from Microchip Technology meet stringent automotive standards for reliability in harsh conditions

Microchip Technology’s PolarFire System on Chip (SoC) FPGAs have earned the Automotive Electronics Council (AEC)-Q100 qualification. The AEC-Q standards are a guideline for integrated circuits, using stress tests to measure the reliability of electronic components in vehicles. AEC-Q100 qualified devices have gone through rigorous testing to demonstrate they can withstand extreme conditions in automotive applications.

The PolarFire SoC FPGA has been qualified for automotive Grade 1 temperatures, -40°C to 125°C. PolarFire SoC FPGAs feature an embedded 64-bit, quad-core RISC-V architecture capable of running Linux and real-time operating systems (RTOS), with mid-range density programmable logic of up to 500K logic elements (LE). The SoC FPGA is designed for complex applications that demand low-power, high-performance, exceptional reliability and an extended operating temperature range. Devices with the same density and package have scalable assurance and share pin-package compatibility across temperature grades, making it appropriate for automotive use as well as aerospace and military applications.

The SoC FPGAs incorporate embedded security and safety features to protect physical, device, design and data integrity. The SoCs are designed with single event upset (SEU) immunity, which enhances reliability and helps mitigate the risk of data corruption and system failures in demanding environments.

“Achieving the AEC-Q100 qualification for our PolarFire SoC FPGAs validates that our technology can perform under the most challenging conditions and underscores our commitment to delivering robust solutions to meet the stringent demands of the automotive industry,” said Bruce Weyer, Corporate Vice President of Microchip’s FPGA business unit. “Our low-power design and RISC-V cores empower automotive engineers to create advanced, reliable and energy-efficient solutions for next-generation automotive systems.”

PolarFire FPGAs and SoCs deliver power and thermal efficiency, eliminating the need for active cooling while ensuring high integration, defense-grade security and reliability. With high levels of scalability, they maintain performance across varying temperature conditions and meet stringent demands of mission-critical environments.

Development Tools

PolarFire SoCs are supported by Microchip’s Libero SoC Design Suite, SmartHLS, VectorBlox and Microchip’s Mi-V ecosystem of partner platforms for rapid RISC-V application development.  Additionally, a wide variety of Microchip and partner intellectual property (IP) cores are available to accelerate time-to-market. Libero SoC Design Suite is TÜV Rheinland-certified for functional safety, meeting ISO 26262 ASIL D standards for automotive applications. Compatible development boards are also available.

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The Indian mobile manufacturing landscape represents a remarkable narrative of technological transformation, economic strategy, and industrial innovation. What was once a predominantly import-driven market has metamorphosed into a robust domestic production powerhouse, driven by a confluence of governmental initiatives, technological investments, and strategic corporate vision.

Xiaomi’s journey in India epitomizes the potential of localized manufacturing. Their production facilities in Chennai and Noida are not merely assembly lines but sophisticated technological ecosystems that represent the cutting edge of mobile manufacturing. The company has systematically invested in creating a comprehensive manufacturing infrastructure that goes beyond simple assembly.

The technological sophistication of Xiaomi’s manufacturing approach is evident in their deployment of advanced Surface Mount Technology (SMT) lines. These highly automated production systems enable precision component placement, ensuring consistent quality and minimizing human error. Robotic assembly processes have been integrated to enhance production efficiency, allowing for rapid scaling and maintaining stringent quality standards.

Moreover, Xiaomi’s local sourcing strategy has been instrumental in creating a robust domestic supply chain. By strategically partnering with local component manufacturers and investing in local ecosystem development, they have not just reduced production costs but also contributed to developing India’s electronics manufacturing capabilities.

Samsung’s manufacturing complex in Noida represents more than just a production facility – it is a testament to advanced manufacturing capabilities. The facility stands as one of the world’s largest mobile phone factories, embodying cutting-edge technological integration and precision engineering.

The company’s approach transcends traditional manufacturing paradigms. Advanced Printed Circuit Board (PCB) manufacturing techniques, coupled with comprehensive quality assurance protocols, ensure that every device meets global standards. Their laboratories represent technological sanctuaries where each component undergoes rigorous testing, examining everything from thermal performance to electromagnetic compatibility.

Samsung’s integrated design and production workflows demonstrate a holistic approach to mobile manufacturing. By seamlessly connecting research, design, and production departments, they create an ecosystem that rapidly translates technological innovations into market-ready products.

Realme represents the new generation of mobile manufacturers – agile, technology-driven, and deeply committed to localization. Their manufacturing facilities in Greater Noida are not just production centers but innovation laboratories that embrace modern manufacturing philosophies.

Lean manufacturing principles guide their production strategy, allowing for maximum efficiency and minimal waste. Modular production designs enable rapid prototyping and quick adaptation to market demands. This approach allows Realme to maintain a competitive edge in a rapidly evolving market, responding swiftly to technological trends and consumer preferences.

The sister companies Oppo and Vivo have developed a synchronized manufacturing ecosystem that exemplifies technological sophistication. Their facilities in Greater Noida and Noida are equipped with state-of-the-art automated optical inspection systems, ensuring that every device meets exacting quality standards.

Their manufacturing approach integrates advanced thermal and durability testing, recognizing that modern smartphones must withstand diverse environmental conditions. Comprehensive supply chain integration ensures that each component is not just sourced but meticulously validated.

Though not an Indian company, Apple’s manufacturing strategy through Foxconn and Wistron represents a significant milestone in India’s mobile manufacturing journey. The facilities in Chennai and Bengaluru showcase precision engineering workflows that align with global high-end smartphone production standards.

The Indian mobile manufacturing ecosystem is poised at an exciting technological frontier. Emerging trends point towards deeper 5G component localization, advanced semiconductor integration, and AI-driven manufacturing optimization. Sustainability is becoming a critical consideration, with manufacturers exploring eco-friendly production technologies.

The Production Linked Incentive (PLI) scheme has been the catalyst that transformed potential into reality. By creating a supportive policy environment, the government has not just attracted investments but fundamentally reshaped India’s technological manufacturing landscape.

India’s mobile manufacturing journey is a narrative of technological ambition, strategic vision, and relentless innovation. From being a consumer market to emerging as a global manufacturing hub, the transformation is profound and promising.

The road ahead is illuminated by continuous technological advancement, strategic investments, and an unwavering commitment to excellence.

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Gold soldering is a sophisticated metallurgical joining technique that represents the pinnacle of precision manufacturing processes. Unlike conventional soldering methods, this specialized technique involves creating permanent, high-integrity connections between gold or gold-alloy components with exceptional precision and reliability. The process goes beyond simple mechanical joining, instead creating a deep metallurgical bond that ensures optimal electrical, thermal, and structural performance.

The scientific principles underlying gold soldering are complex and multifaceted. At its core, the process involves creating an atomic-level bond between gold surfaces using a carefully selected filler material with a strategically lower melting point. The metallurgical interaction is not merely a surface-level connection but a profound interdiffusion of metal atoms that creates a seamless, integrated joint.

The fundamental mechanism begins with the careful preparation of surfaces, where even microscopic contaminants can compromise the entire soldering process. As the filler material is heated, it transitions from a solid to a liquid state, simultaneously wetting the gold surfaces and creating a capillary action that draws the molten material between the components. During this process, atomic diffusion occurs, where the atoms of the filler material intermingle with the gold surfaces, creating a bond that is often stronger and more reliable than the original base materials.

Surface Preparation: The Critical First Step

Surface preparation is arguably the most crucial phase of gold soldering. This stage requires meticulous attention to detail and advanced cleaning techniques. Professionals employ a combination of chemical and mechanical methods to eliminate any potential contaminants. Specialized solvents are used to remove organic residues, while precise chemical etching or plasma cleaning techniques eliminate oxide layers and microscopic impurities.

The goal is to create an absolutely pristine surface that allows for maximum metallurgical interaction. Even a thin layer of oxidation or a microscopic particle can prevent proper bonding, leading to weak joints or complete soldering failure. Advanced cleaning techniques may include ultrasonic cleaning, chemical degreasing, and high-precision surface treatments that can remove contaminants at the atomic level.

Material Selection: A Delicate Science

Selecting the appropriate materials is a complex process that requires deep understanding of metallurgical properties. The gold alloy composition must be carefully matched with an appropriate filler material that can create a reliable bond while maintaining the desired mechanical and electrical properties. Factors such as melting point, thermal expansion coefficient, and chemical compatibility are meticulously evaluated.

Different applications demand different material characteristics. For instance, electronics may require a filler material that provides optimal electrical conductivity, while medical devices might prioritize biocompatibility and corrosion resistance. This selection process often involves extensive material testing and simulation to ensure optimal performance under various operational conditions.

Electronics Industry: Pushing Technological Boundaries

In the electronics industry, gold soldering is nothing short of revolutionary. Semiconductor packaging relies on this technique to create microscopic connections that form the backbone of advanced electronic devices. Hybrid microelectronics, which combine different types of electronic components, depend entirely on the precision and reliability of gold soldering techniques.

Modern smartphones, advanced medical imaging equipment, and cutting-edge aerospace technologies all benefit from gold soldering’s ability to create miniaturized, high-performance connections. The technique allows for the integration of components at nanoscale levels, enabling technological advancements that were previously impossible.

Medical and Aerospace Applications: Reliability in Extreme Conditions

In medical and aerospace domains, gold soldering’s reliability becomes paramount. Implantable medical devices require connections that can withstand the human body’s complex chemical environment, while aerospace components must endure extreme temperature variations and intense radiation.

The ability to create stable, corrosion-resistant joints makes gold soldering indispensable in these critical fields. Precision surgical instruments, satellite communication systems, and advanced sensor technologies all rely on the unique properties that gold soldering provides.

Gold soldering offers remarkable advantages, including exceptional conductivity, corrosion resistance, and the ability to create extremely precise connections. However, these benefits come with significant challenges. The process is inherently expensive, requiring specialized equipment and highly trained professionals.

The narrow temperature window for optimal soldering demands extraordinary skill and precision. A deviation of mere degrees can compromise the entire soldering process, making it a technique that requires continuous training and technological investment.

Gold soldering represents more than just a joining technique—it is a sophisticated technology that pushes the boundaries of what is possible in manufacturing. As technological demands become increasingly complex, the importance of this precise metallurgical process will only continue to grow.

Professionals in electronics, medical technology, aerospace, and advanced manufacturing must continually invest in understanding and mastering these intricate soldering techniques to drive technological innovation forward.

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1. Fundamental Quantum Mechanical Foundations

1.1 Quantum Spin Dynamics

Spintronics represents a revolutionary paradigm that fundamentally challenges traditional electronic technologies by exploiting the quantum mechanical spin property of electrons. Unlike conventional charge-based electronics, spin-based technologies leverage the intrinsic angular momentum of electrons, characterized by two quantum states: spin-up (|↑⟩) and spin-down (|↓⟩). This binary quantum nature provides an unprecedented foundation for information storage and processing, opening new frontiers in computational architecture.

The mathematical representation of spin dynamics is elegantly captured by the Heisenberg Hamiltonian:

H = -∑(J_ij * S_i · S_j)

This equation encapsulates the quantum mechanical interaction between spin operators, where J_ij represents the exchange coupling constant, and S_i and S_j describe spin operators at specific lattice sites. The fundamental interaction demonstrates the complex quantum mechanical spin correlation mechanisms that underpin spintronic technologies.

1.2 Spin-Orbit Coupling Phenomena

Spin-orbit coupling (SOC) emerges as a critical quantum mechanical interaction where an electron’s spin precession becomes intrinsically coupled with its orbital motion. This phenomenon introduces sophisticated spin-dependent electronic transport mechanisms that are crucial for advanced spintronic devices.

The field of spin-orbit coupling encompasses several profound physical manifestations. The Rashba effect represents a quantum mechanical spin splitting mechanism primarily observed in two-dimensional electron systems with broken inversion symmetry. This effect generates a spin-momentum locking phenomenon where electron spin becomes intrinsically linked to its momentum direction, creating unique quantum transport behaviors.

The Dresselhaus effect complements the Rashba mechanism, representing a bulk spin-orbit coupling phenomenon prevalent in non-centro-symmetric crystal structures. Originating from bulk inversion asymmetry, this effect generates spin-dependent electron scattering mechanisms that fundamentally deviate from traditional electronic transport models.

2. Magnetoelectric RAM: Advanced Architectural Insights

2.1 Magnetoelectric Coupling Mechanisms

Magnetoelectric RAM (MeRAM) represents a sophisticated memory paradigm that exploits the intricate coupling between magnetic and ferroelectric materials. The fundamental interaction can be described by a phenomenological free energy expression:

F = F_magnetic + F_electric + F_magnetoelectric

This sophisticated approach enables electric-field-induced magnetic state modulation with unprecedented precision, bridging quantum mechanical principles with advanced computational memory technologies.

The material design for effective magnetoelectric RAM demands a nuanced approach to material selection and interface engineering. Critical material characteristics include the magnetoelectric coefficient (α_ME), which quantifies the material’s ability to couple magnetic and electric polarization states. Magnetic anisotropy energy plays a crucial role in determining the stability of magnetic configurations, while ferroelectric polarization magnitude determines the efficiency of electric-field-based switching mechanisms.

2.2 Magnetic Tunnel Junction (MTJ) Architectures

Magnetic Tunnel Junctions (MTJs) represent the core computational element in MeRAM, utilizing quantum mechanical tunneling phenomena for information storage and transfer. The typical MTJ multilayer configuration consists of carefully engineered ferromagnetic electrodes separated by an ultrathin insulating barrier, enabling sophisticated quantum mechanical information processing.

3. Advanced Quantum Transport Mechanisms

3.1 Spin-Transfer Torque (STT)

Spin-transfer torque emerges as a sophisticated quantum mechanical mechanism for manipulating magnetic moments through spin-polarized current injection. The Landau-Lifshitz-Gilbert-Slonczewski (LLGS) equation provides a comprehensive mathematical framework for describing the complex magnetization dynamics inherent in this mechanism.

The quantum mechanical principles involve direct momentum transfer from spin-polarized electrons to magnetic moments within a material system. When a spin-polarized current passes through a magnetic multilayer structure, electron spins interact with local magnetic moments, exerting a torque that can rotate or manipulate the magnetic configuration with unprecedented precision.

3.2 Magnetoelectric Switching Dynamics

Electric-field-induced magnetic switching represents a pinnacle of quantum mechanical interface engineering. This sophisticated mechanism transcends traditional electronic switching by directly manipulating magnetic states through electric field application.

The underlying physics encompasses multiple interrelated quantum mechanical phenomena, including strain-mediated magnetic coupling, direct exchange interactions, and interfacial charge redistribution mechanisms. These complex interactions enable precise control of magnetic configurations through electrical means, representing a quantum leap in computational memory technologies.

4. Performance Characterization and Metrics

4.1 Advanced Performance Parameters

The evaluation of magnetoelectric RAM technologies requires a multidimensional approach that extends beyond traditional memory performance metrics. Key performance indicators include:

• Energy Consumption: Targeting switching energies below 0.1 picojoules per bit
• Write Latency: Approaching near-ballistic regime switching speeds of a single nanosecond
• Data Retention: Targeting retention times exceeding decade-long scales
• Endurance: Approaching or exceeding 10^12 write operations

4.2 Thermal Stability Considerations

Thermal stability represents a fundamental challenge in advanced memory technologies. The Arrhenius equation provides a mathematical framework for understanding magnetic state lifetime, relating it to material-specific energy barriers and operational temperatures.

5. Material Science Innovations

5.1 Emerging Magnetoelectric Materials

The frontier of MeRAM technologies hinges on material science innovations that push quantum mechanical engineering boundaries. Key approaches include:

• Multiferroic composites combining ferromagnetic and ferroelectric properties
• Engineered heterogeneous interfaces with atomically precise boundaries
• Topological magnetic materials providing inherent quantum decoherence protection
• Rare-earth metal substitutions enabling fine-tuned material properties

5.2 Nanostructuring Techniques

Advanced nanostructuring methodologies include:

• Molecular beam epitaxy (MBE) for atomic-layer-precise material deposition
• Pulsed laser deposition for creating complex material architectures
• Focused ion beam lithography for nanoscale structural modifications
• Atomic layer deposition (ALD) for ultra-thin, precisely controlled material layers

6. Industry and Research Implications

6.1 Technological Disruption Potential

MeRAM technologies offer transformative capabilities across multiple domains:

• High-performance computing with extraordinary energy efficiency
• Internet of Things (IoT) devices with ultra-low power consumption
• Neuromorphic computing architectures mimicking biological neural networks
• Bridging classical and quantum computational paradigms

6.2 Economic and Computational Impacts

• Projected market value: $500 million by 2028
• Potential 70% reduction in computational energy consumption
• Enabling more sustainable and efficient computing infrastructures

Spintronics and MeRAM represent a quantum leap in computational memory technologies, bridging fundamental quantum mechanical principles with advanced engineering methodologies. By leveraging sophisticated quantum mechanical interactions, these technologies promise to revolutionize computational architectures, offering unprecedented performance, energy efficiency, and computational capabilities.

Disclaimer: Technological developments are ongoing, and specific implementations may vary.

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Selective soldering is an advanced soldering technique used in electronics manufacturing to solder specific components on a printed circuit board (PCB) without affecting adjacent parts. Unlike traditional wave soldering, which exposes the entire board to molten solder, selective soldering focuses only on designated areas, making it ideal for complex PCB assemblies with mixed technology components.

This method is essential in industries where high precision and reliability are required, such as aerospace, automotive, medical devices, and telecommunications. Selective soldering helps manufacturers meet stringent quality standards while reducing thermal stress on sensitive components.

Selective soldering involves applying molten solder to specific areas of the PCB using a programmable system. It typically follows these key steps:

1. Flux Application: A controlled amount of flux is selectively applied to solder joints to improve wetting and prevent oxidation.
2. Preheating: The PCB is preheated to activate the flux and reduce thermal shock, ensuring better solder flow.
3. Soldering Process: A programmable soldering nozzle or mini-wave applies molten solder to the designated areas, forming high-quality solder joints.
4. Cooling and Inspection: The board is cooled down gradually, and automated inspection methods such as X-ray or AOI (Automated Optical Inspection) are used to ensure quality.

The selective soldering process can be categorized into three main techniques:

1. Mini-Wave Soldering

This method involves using a small nozzle that creates a miniature solder wave, selectively soldering through-hole components. The PCB moves over the wave, allowing precise solder application.

2. Jet Wave Soldering

In this approach, a high-precision nozzle dispenses solder in a controlled manner. It is ideal for densely populated PCBs where precise control is required.

3. Laser Selective Soldering

This technique utilizes a laser to heat the solder and create joints without physical contact. It is beneficial for highly sensitive components that require minimal thermal exposure.

Each of these methods is chosen based on factors such as board complexity, component density, and production volume.

Selective soldering is widely used across various industries due to its precision and reliability. Some of the primary applications include:

• Automotive Electronics: Used in engine control units (ECUs), infotainment systems, and safety modules where high-reliability soldering is required.
• Aerospace and Defense: Essential for high-reliability PCBs used in avionics and military communication systems.
• Medical Devices: Applied in medical instrumentation where strict quality standards are necessary.
• Consumer Electronics: Used in complex PCB assemblies for smartphones, tablets, and wearables.
• Industrial Automation: Ensures robust connections in industrial control systems and robotics.

1. Precision and Selectivity

Selective soldering allows targeted soldering, reducing the risk of damage to nearby components. This is particularly useful for mixed-technology PCBs.

2. Reduced Thermal Stress

Unlike wave soldering, which exposes the entire board to heat, selective soldering minimizes thermal exposure, protecting heat-sensitive components.

3. Higher Reliability

With precise solder control, the process ensures consistent joint quality, reducing defects such as solder bridges or cold joints.

4. Cost-Effectiveness

Selective soldering reduces solder and flux consumption while minimizing rework and scrap rates, leading to cost savings in production.

5. Automation Compatibility

Modern selective soldering systems can be fully automated, improving repeatability and efficiency in high-volume manufacturing.

1. Slower Process Compared to Wave Soldering

Since each component is soldered individually, the process is slower than wave soldering, making it less ideal for extremely high-volume production.

2. Higher Initial Investment

Selective soldering machines are more expensive compared to traditional soldering equipment, requiring a significant upfront investment.

3. Complex Programming and Setup

Proper setup and programming are required to achieve optimal results, necessitating skilled operators and additional setup time.

Selective soldering is a vital technique in modern electronics manufacturing, providing high precision, reliability, and cost-efficiency. While it has certain limitations, its advantages make it indispensable for industries requiring robust and precise soldering solutions. As technology advances, selective soldering is expected to become even more efficient, further enhancing its role in electronic assembly processes.

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Wire soldering is a fundamental technique in electronics and electrical engineering that involves joining two or more metal wires using a filler metal, known as solder. This process ensures a strong, conductive, and durable connection between components. Soldering is widely used in circuit board assembly, electrical wiring, and microelectronics, offering a reliable means of creating robust electrical and mechanical bonds.

Wire soldering is a method of joining electrical wires and components by melting a filler metal (solder) at the joint. The solder, typically composed of a lead-tin alloy or a lead-free alternative, melts at a lower temperature than the workpieces, allowing it to flow and solidify, creating a permanent bond. The process ensures excellent electrical conductivity and mechanical strength, making it essential in various industrial and DIY applications.

Wire soldering works on the principle of wetting and capillary action. Temperature control plays a critical role, as solder melts at specific temperatures, typically 180–200°C for tin-lead solder and 217°C for lead-free solder. Proper heat application ensures strong joints and prevents damage to sensitive electronic components. The use of flux is essential in wire soldering, as it removes oxidation and improves adhesion by enhancing the flow of solder and preventing contaminants from interfering with the bond. Surface preparation is another crucial factor, as clean wire surfaces result in stronger solder joints. Any contaminants like oxidation or dirt can weaken the bond and should be removed before soldering. Additionally, the cooling rate must be managed properly. Gradual cooling prevents joint brittleness and ensures a reliable bond, whereas sudden cooling may introduce stress and weak points in the joint.

The wire soldering process consists of several key steps to ensure a high-quality joint. The first step is preparation, where essential tools such as a soldering iron, solder wire, flux, helping hands or clamps, and wire strippers are gathered. The wire surfaces must be cleaned with alcohol or a wire brush to remove oxidation and dirt, and flux should be applied to improve solder flow and reduce oxidation.

The next step is heating the joint. The soldering iron must be heated to the required temperature, typically between 300–400°C depending on the type of solder being used. The iron tip should be placed in contact with both wires to ensure even heating before applying solder. Once the joint reaches the correct temperature, solder is applied. The molten solder should flow into the joint via capillary action, forming a strong bond. The soldering process should be completed quickly to prevent excessive heat damage to components. The final step is cooling and inspection. The joint must be allowed to cool naturally without disturbance to maintain structural integrity. A visual and mechanical inspection should be performed to ensure proper bonding and electrical continuity.

Wire soldering finds applications in various industries due to its reliability and efficiency. In the electronics and PCB assembly sector, soldering is used for mounting components on printed circuit boards (PCBs) and is essential in assembling microelectronics and integrated circuits. In the automotive industry, it is widely employed in vehicle wiring, sensors, and electronic control modules, ensuring durable electrical connections resistant to vibrations and environmental stress. The aerospace and defense sectors also rely heavily on wire soldering, particularly in avionics, satellite electronics, and military-grade circuit assemblies. High-reliability soldering techniques are required to withstand extreme environments.

Beyond these industries, wire soldering is commonly used in home electrical repairs, such as fixing household wiring, power cords, and electrical appliances. It provides secure and long-lasting connections in low-voltage circuits. Additionally, industrial manufacturing relies on wire soldering for robotics, automation systems, and power distribution modules, ensuring robust and long-lasting connections for heavy-duty machinery.

Wire soldering offers multiple benefits, making it a preferred method for electrical connections. One of the primary advantages is strong electrical conductivity, as it provides minimal resistance and efficient signal transmission in electronic circuits. It also ensures reliable mechanical strength, offering durable joints that withstand mechanical stress and vibrations. Wire soldering allows for compact and lightweight connections, enabling miniaturization of electronic components, which is ideal for modern gadgets and compact devices. Another key advantage is cost-effectiveness and efficiency, as it requires minimal tools and materials, making it an economical and accessible solution. The process is also quick and versatile, with applications spanning from delicate electronics to heavy-duty electrical work.

Despite its advantages, wire soldering has some limitations. One of the main drawbacks is temperature sensitivity. Overheating can damage sensitive components, requiring careful temperature control to avoid such issues. Another potential issue is weak joints. Cold solder joints or insufficient flux application can lead to poor connectivity and reliability problems over time. Additionally, lead-based solder emits toxic fumes, posing health risks. Proper ventilation and safety precautions, such as using fume extractors and protective equipment, are necessary. Lastly, solder joints provide limited structural support. They are not mechanically strong enough for high-load applications and may require additional reinforcement to ensure durability in certain use cases.

Wire soldering remains an indispensable technique in electronics, automotive, aerospace, and industrial applications. By understanding its principles, process, advantages, and limitations, engineers and technicians can optimize soldering quality for reliable electrical connections. With advancements in lead-free soldering and automated soldering technologies, the future of wire soldering continues to evolve, ensuring improved safety, efficiency, and performance in electrical and electronic manufacturing.

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Neuromorphic computing represents a groundbreaking paradigm shift in computing, designed to replicate the structure and functionality of biological neural networks. Traditional Von Neumann architectures suffer from inefficiencies due to the separation of memory and processing units, leading to bottlenecks in handling AI and real-time workloads. Neuromorphic chips address these challenges through event-driven computation, parallel processing, and biologically inspired synaptic plasticity. Companies such as Intel, IBM, BrainChip, and SynSense are spearheading the development of these chips, promising enhanced AI acceleration, real-time data processing, and ultra-low power consumption. This article explores the fundamental principles, architectural advancements, diverse applications, industry trends, and future prospects of neuromorphic computing.

Neuromorphic computing is grounded in the principles of spiking neural networks (SNNs) and synaptic plasticity, enabling energy-efficient and event-driven information processing. Unlike traditional deep learning architectures that rely on dense matrix multiplications, SNNs leverage discrete electrical impulses (spikes) for data transmission. This asynchronous operation ensures that computations occur only when necessary, significantly reducing energy consumption. Another core principle is in-memory processing, where neuromorphic chips integrate memory and computation units to eliminate data transfer bottlenecks, a limitation of conventional architectures.

Adaptive learning mechanisms further distinguish neuromorphic chips from traditional AI accelerators. Inspired by Hebbian learning and long-term potentiation, these chips modify synaptic weights dynamically based on data patterns, mirroring human cognitive processes. Additionally, neuromorphic architectures exhibit massive parallelism, as thousands or even millions of artificial neurons and synapses operate simultaneously. This makes them ideal for real-time, low-latency AI inference applications in power-constrained environments such as edge devices and wearables.

Neuromorphic chip architectures vary widely, encompassing digital, analog, and hybrid designs. Digital neuromorphic processors, such as Intel’s Loihi 2, leverage asynchronous spike-based processing with over one million programmable neurons and hierarchical synaptic plasticity mechanisms. Loihi 2 features optimized learning rules, improved interconnectivity, and enhanced support for complex AI workloads, making it a leading candidate for next-generation AI acceleration.

BrainChip’s Akida platform, another prominent digital neuromorphic processor, is tailored for ultra-low power AI inference at the edge. It employs event-based processing, leveraging hierarchical temporal memory (HTM) principles to achieve highly efficient pattern recognition. The Akida chip is designed to optimize convolutional neural network (CNN) inference while maintaining minimal power consumption, making it suitable for applications such as smart surveillance, autonomous systems, and health monitoring.

Analog and mixed-signal neuromorphic chips offer even greater efficiency by utilizing physical transistor properties to mimic neuronal activity. IBM’s TrueNorth, a hybrid digital-analog neuromorphic system, incorporates one million neurons and 256 million synapses, enabling large-scale SNN processing with extremely low power consumption. Memristor-based neuromorphic architectures, such as those under development at MIT and HP, integrate non-volatile resistive RAM (RRAM) elements to implement synaptic weights directly in hardware, further reducing energy overheads.

Another emerging approach is 3D neuromorphic architectures, where stacked layers of artificial neurons are fabricated to enhance computational density and minimize interconnect delays. Researchers at ETH Zurich and Stanford University are exploring hybrid 3D CMOS-memristor designs to enable brain-scale neuromorphic computing, opening new frontiers in AI efficiency and scalability.

Neuromorphic computing has transformative applications across diverse sectors, revolutionizing AI-driven decision-making, robotics, medical diagnostics, and edge intelligence.

Edge AI and IoT

Neuromorphic chips excel in ultra-low power AI inference, making them ideal for always-on smart sensors, real-time environmental monitoring, and security surveillance. They enable real-time AI processing in IoT devices, allowing predictive maintenance, autonomous energy management, and adaptive user interfaces in smart homes and industrial automation.

Robotics and Autonomous Systems

Neuromorphic processors are redefining robotics by enabling real-time, low-latency decision-making. Their ability to process sensory inputs dynamically makes them well-suited for applications in humanoid robots, collaborative automation, and autonomous vehicles. For instance, neuromorphic vision sensors enhance object detection and navigation by replicating biological vision processing, enabling real-time adaptation in self-driving cars and drones.

Healthcare and Biomedicine

In healthcare, neuromorphic chips power advanced neural interfaces, brain-machine interaction (BMI) systems, and real-time biomedical signal processing. They facilitate ultra-fast EEG and ECG analysis, enabling rapid diagnosis of neurological disorders such as epilepsy and Parkinson’s disease. Additionally, neuromorphic AI enhances medical imaging, assisting in early disease detection with significantly reduced computational overhead.

Cybersecurity and AI at the Edge

The adaptive learning capabilities of neuromorphic chips make them well-suited for AI-driven cybersecurity solutions. Their ability to detect anomalous patterns in real-time enhances intrusion detection systems (IDS) and fraud prevention mechanisms. Moreover, neuromorphic architectures support biometric authentication technologies, such as facial recognition and voice-based identity verification, ensuring energy-efficient, secure access control solutions.

The neuromorphic computing landscape is evolving rapidly, with significant investments from semiconductor giants, startups, and government agencies.

Intel has established the Neuromorphic Research Community (INRC) to accelerate the adoption of Loihi-based computing platforms. IBM continues to explore hybrid analog-digital neuromorphic accelerators, while BrainChip expands the Akida ecosystem for low-power AI applications. Emerging startups like SynSense and Innatera are focusing on commercializing neuromorphic AI accelerators for edge computing, demonstrating a growing market appetite for these technologies.

Venture capital funding for neuromorphic startups has increased, with investors recognizing the potential of brain-inspired computing in AI acceleration and IoT. Government and defense organizations, including DARPA, are investing in neuromorphic architectures for autonomous surveillance systems, next-generation military drones, and AI-powered secure communications. Academia-industry collaborations, particularly in the U.S., Europe, and China, are driving advancements in neuromorphic hardware scalability and software frameworks.

Despite significant progress, neuromorphic computing faces challenges in software compatibility, standardization, and large-scale fabrication. Existing AI frameworks, such as TensorFlow and PyTorch, are not natively optimized for SNNs, necessitating new programming paradigms. Scalability remains a concern, as manufacturing neuromorphic chips with millions of interconnected artificial neurons requires advanced semiconductor fabrication techniques.

The next decade will witness the convergence of neuromorphic computing with emerging technologies such as quantum computing, biohybrid systems, and 3D-integrated AI architectures. Quantum neuromorphic computing, which combines quantum-inspired neural networks with spike-based processing, holds promise for solving complex optimization problems with unprecedented efficiency. Furthermore, brain-on-chip innovations, integrating living neuronal cultures with synthetic neural networks, could pave the way for biologically realistic AI models.

As AI workloads become increasingly complex, neuromorphic chips will play a crucial role in advancing edge intelligence, real-time robotics, and human-like cognition in machines. By mimicking the energy efficiency and adaptability of the human brain, neuromorphic architectures are poised to redefine the future of computing, unlocking unparalleled capabilities across diverse technological domains.

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