ELE Times

L&T Technology Services, a global leader in Engineering Intelligence Solutions & ER&D Consulting Services, announced the launch of LTTS FARM, a startup engagement platform designed to accelerate the commercialization journey of deep-tech startups through Engineering Intelligence-led collaboration, co-innovation and market access.

Built on the philosophy of “Collaboration First, Commercialization Next”, LTTS FARM is targeted at startups with TRL 4+ technologies that have validated their technical feasibility and are ready to explore industry adoption. The program is focused on startups aligned with LTTS’ Technology Big Bets – Software Defined Mobility (SDM), Plant Buildout & Modernization, Energy & Industrial Automation, Digital Manufacturing, Next Gen Compute & Data Centers, Software Platforms & EI and MedTech – with the potential to further advance these strategic priorities through new technologies and solutions. By leveraging LTTS’ global presence, domain expertise and customer relationships, LTTS FARM seeks to create a structured launch pad for startups to progress from validated innovation to customer adoption and long-term growth.

The initiative reflects LTTS’ commitment to fostering a thriving innovation ecosystem by bringing together startups, engineering talent and industry stakeholders to address real-world business and technology challenges. The journey will span across evaluation, onboarding, co-innovation, pilot development and commercialization opportunities for eligible startups. Suitable solutions will be considered for broader industry deployments aided by pilot projects, proof-of-concepts, customer demonstrations and diverse commercial engagements.

Amit Chadha, CEO & Managing Director, L&T Technology Services and Member of NASSCOM Executive Council, said, “Many promising technologies struggle because of limited access to customers, industry expertise and commercialization opportunities. Through LTTS FARM, we are creating a platform where startups can collaborate with our experts, gain exposure to global markets and customer requirements, validate real-world applications and accelerate their journey from solution readiness to market adoption. By nurturing innovations that align with and further our technology big bets, LTTS FARM will also expand our Engineering Intelligence ecosystem and help transform breakthrough ideas into industry-ready solutions that deliver measurable business impact”.

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Rohde & Schwarz in collaboration with Qualcomm Technologies, Inc. has completed an early verification step for 3GPP Rel. 17 Search Space Set Group Switching (SSSG). This 5G NR feature, designed to reduce device power consumption, has now been formally submitted for RAN5 verification. This milestone supports the path from standardization to conformance testing and commercial use, while also feeding practical findings back into the standardization process.

Rohde & Schwarz has successfully verified for the first time a 3GPP NR conformance test case for Search Space Set Group Switching (SSSG). Introduced in 3GPP Release 17, SSSG is a power-saving mechanism for user equipment that improves how a device monitors control channel activity while maintaining reliable reception of scheduling information.

By completing verification of the 3GPP RAN5 NR conformance test case TS 38.523-1 TC 7.1.1.12.5 for SSSG at an early stage, the two companies supported early readiness of this feature across the 5G conformance ecosystem. The verification was carried out using a mobile test platform using Qualcomm X105 5G Modem-RF and the R&S TS-PCT protocol conformance test platform from Rohde & Schwarz, which is based on the CMX500 5G one-box signaling tester. SSSG optimizes the PDCCH monitoring behavior in 5G NR devices. This reduces unnecessary monitoring activity and helps improve power efficiency.

Rohde & Schwarz and Qualcomm Technologies are the first to complete all relevant test aspects for this conformance test case. During the verification work, the companies also identified areas where the underlying conformance specification could be improved and supported the submission of a change request to 3GPP RAN5, the group responsible for conformance test specifications. This links practical verification work with ongoing standardization development.

This combination of test execution and standards input shows how verification work can also improve the quality of future test specifications. For device manufacturers, the wireless chipset ecosystem and certification organizations, it marks a step toward reliable testing of advanced 5G power-saving functions.

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Vishay Intertechnology, today introduced two new low profile common mode chokes for high current automotive, energy, and industrial applications. Available in both surface-mount and through-hole packages, the Vishay Dale commercial ICMS2321 10 and Automotive Grade ICMS2321-1A combine a heat rating current to 30 A with a 1500 VDC dielectric withstand voltage between coils.

With their low profile, the devices released today offer a reduced size and volume, making them more resistant to shock and vibration, while their enhanced core design increases performance and saturation current at high temperatures up to +150 °C. Offering a self-shielded, rugged construction, the common mode chokes are ideal for DC/DC converters, high voltage inverters, EMI filters, and high current filters for noise suppression in motor control and other circuitry. The AEC-Q200 qualified ICMS2321-1A is well suited for use in automotive on-board chargers.

In addition to their surface-mount and through-hole mounting options, the ICMS2321-10 and ICMS2321-1A offer customizable inductance, impedance, DCR, and current ratings. Devices with surface-mount terminations are available in tape and reel packaging and are compatible with automated pick and place assembly for increased flexibility in board layouts. The common mode chokes are RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table:

(1) DC current (A) that will cause an approximate ΔT of 40 °C

(2) DC current (A) that will cause an approximate ΔT of 100 °C

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In electronics manufacturing, material and quality testing using X-ray inspection is considered the gold standard for reliability and the highest standards. For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels. With a completely newly developed system platform, the manufacturer now presents next-generation X-ray inspection: The Multi Line AXI combines outstanding technological innovations with highly versatile application options and multifunctionality, while offering simple operation and rapid adaptability to inspection tasks. The result is an innovative AXI system that sets new standards in X-ray inspection—offering a secure investment and high performance.

Technically, the Multi Line AXI stands out as a state-of-the-art planar 3D-CT X-ray system, offering the highest possible resolution and razor-sharp cross-sectional images. Based on the company’s proprietary aspeCT technology, the system achieves new levels of precision and image quality in X-ray inspection. Using a high-resolution, high-speed flat-panel detector, the detailed images are transformed into intelligent 3D reconstructions and volumetric 3D images and models of the highest quality. An innovative 7-axis system with synchronized control ensures high-speed, on-the-fly CT imaging in the shortest possible time: In less than 2 seconds, and with 8 µm voxel resolution, the Multi Line AXI offers flexible 2D, 2.5D, and 3D X-ray imaging as needed, using microfocus X-ray tubes and in sub-micrometer increments. This makes the system a highly secure investment and versatile in its application, manufactured entirely in Jena.

In addition to its outstanding technology, the Multi Line AXI has been consistently designed for broad applicability, reliability, and low-maintenance operation. With an 810×535 mm inspection area, a maximum PCBA clearance of 105 mm, and a transport capacity of up to 25 kg in its flexible transport system, both the smallest PCBAs and large power electronics can be inspected quickly and with consistently high quality. Thanks to the use of parts from exclusively European suppliers and German-brand mechanical components, the system is extremely durable and reliable. The Multi Line AXI’s platform concept makes upgrades, expansions, and repairs quick and easy. Furthermore, the system can be integrated into any manufacturing or inspection environment—whether inline, at-line, or stand-alone. It interfaces seamlessly with the manufacturer’s MES and can be integrated into traceability systems. High repeatability, variable X-ray performance as needed, and adaptability to high mix, low-volume production are hallmarks of the Multi Line AXI.

However, a system’s performance and quality are only the foundation—in everyday use, an AXI system must be quickly adaptable to specific inspection tasks and easy to operate. The Multi Line AXI guarantees this through its seamless integration into the PILOT software platform’s user interface, which has also proven itself in GÖPEL AOI systems. Inspection programs are automatically generated using “Magic Click” based on Gerber and assembly data or other CAD formats (ODB++, Process, etc.). For reliable verification, the PASS/FAIL evaluation is supported by intelligent AI assistants. This transforms detailed X-ray images into actionable inspection results—ensuring the quality and security of the PCBA. Short programming times and comprehensive evaluation of results—including precise void calculation and THT fill rate measurement in percent—combined with GÖPEL electronic’s software and inspection intelligence make the Multi Line AXI practical and suitable for everyday use, intuitive to operate, and customizable.

In developing the new X-ray inspection system, GÖPEL electronic also addressed questions about the future: How do we want to manage our resources? As a result, the Multi Line AXI is designed as a “Lean & Green Machine” focused on resource conservation, energy efficiency, and sustainability. The manufacturer has deliberately omitted pneumatic components and compressed air, which not only simplifies installation and operation but also reduces maintenance and operating costs. With its lightweight design—weighing just 2.7 metric tons and featuring a compact footprint of 1600×1660—this X-ray system requires no special structural preparations and can be installed quickly and easily in virtually any environment. Based on GÖPEL electronic’s many years of experience, the system is designed from the outset to be durable, upgradeable, and reusable, with easy access for service and maintenance.

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Murata Manufacturing Co., Ltd., a global leader in electronic components and innovative electronic solutions, will participate in electronica India 2026, taking place from 16–18 September 2026 at the Bangalore International Exhibition Centre (BIEC), Bengaluru.

Located at Hall 3, Booth H3.E11, Murata will present its exhibition theme, ‘Scaling the Future from India with Murata,’ showcasing how its technologies are helping shape the next generation of intelligent, connected, and energy-efficient electronic systems. As India’s industries accelerates toward an AI-powered, electrified, and digitally connected future, Murata is helping enable the technologies that make it possible. Backed by global reliability, local commitment, and scalable innovation, Murata delivers advanced electronic components, sensing technologies, power solutions, RF technologies, and system innovations that support next-generation industrial systems.

At electronica India 2026, visitors will experience application-focused demonstrations, engage with Murata’s technical experts, and discover how the company’s technologies help accelerate innovation across rapidly evolving industries.

The electronics industry is entering a new era driven by artificial intelligence, semiconductor innovation, intelligent mobility, industrial automation, robotics, and digital infrastructure. As these technologies continue to converge, the need for highly reliable, energy-efficient, and integrated electronic solutions continues to grow.

At electronica India 2026, visitors will experience how Murata’s technologies address these evolving industry needs through interactive demonstrations and application-focused showcases.

Murata’s booth will feature five application zones highlighting technologies that enable future-ready electronic
systems across diverse industries:

• IC Zone – Accelerating Semiconductor Innovation from Device to System
  High performance AI computing requires increasingly integrated semiconductor systems. Explore how Murata’s components, reference design, and EMI expertise support power delivery, noise control, and reliable system design for advanced semiconductor applications.
• Data Center Zone – Powering AI Servers and Modern Data Center Infrastructure
  Data centers supporting AI and other high-performance computing workloads require efficient, reliable, and scalable power solutions. Discover Murata’s power technologies and electronic components for AI servers, networking, and modern data center infrastructure.
• Mobility Zone – Driving the Future of Connected and Electrified Mobility
  Enabling connected, electrified vehicles through advanced communication, sensing, and battery technologies. Explore Murata solutions for V2X (Vehicle to Everything), connectivity, positioning, and system reliability.
• Industrial Zone – Accelerating Smart Factory Transformation
  Manufacturers are adopting smarter, more connected operations. Explore Murata solutions for automation, machine monitoring, asset tracking, and operational efficiency.
• Humanoid Zone – Enabling Responsive Interaction and Synchronized Action
  Humanoid robots need accurate sensing, reliable connectivity, and coordinated control. Discover how Murata technologies support responsive interaction, synchronized movement, and dependable operation.

Complementing these featured showcases, visitors will also have the opportunity to explore additional product showcases and technology displays across each application zone, together with Murata’s broader product portfolio, demonstrating Murata’s expanding role in delivering comprehensive electronic solutions across diverse applications.

Murata combines decades of global technology leadership with an expanding local presence to support India’s rapidly evolving electronics ecosystem. By integrating global manufacturing standards with local engineering expertise and dedicated customer support, Murata continues to deliver the quality, reliability, and innovation trusted by customers worldwide.

As part of its long-term commitment to India, Murata continues to strengthen its local capabilities through its sales offices in Chennai, Delhi (Noida), and Bengaluru, together with its manufacturing facility in Chennai. This growing footprint enables closer customer collaboration, faster technical support, and stronger partnerships, reinforcing Murata’s commitment to supporting India’s ambition to become a global hub for electronics manufacturing and technological innovation.

Murata invites customers, partners, design engineers, and industry professionals to visit Hall 3, Booth H3.E11 at electronica India 2026 to experience application-focused demonstrations, engage with technical experts, and discover how ’Scaling the Future from India with Murata’ is enabling the next generation of electronics.

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​The Indian Navy received its first indigenous multi-purpose vessel, Samarthak, from Larsen & Toubro at its Kattupalli shipbuilding yard. An indigenous content of 75% indigenous content, marking the next step in India’s initiative to build naval warships indigenously. It was built with features to fulfil various requirements, such as surveillance, maritime patrol, and participation in Humanitarian Assistance and Disaster Relief (HADR) activities. Furthermore, the vessel can successfully carry out launching and recovering of naval targets, use automated systems, and evaluate naval weapons, sensors, etc.

This inherent flexibility should provide the capability for the Navy to employ the ship in an operational role in addition to its testing and evaluation capacity. These vessels are critical because new underwater systems and other unmanned vehicles and new radars and weapons need to be rigorously tested in the natural sea environment before they are widely deployed into operations. The ship was built under a contract for two Multi-Purpose Vessels and demonstrates enhanced cooperation between the Indian Navy and private shipbuilding. Its induction proves the increasing capabilities of Indian companies in designing and building advanced, technically complex naval platforms​.

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​The 4Th Tri-Services Future Warfare Course has concluded at the Manekshaw Centre, New Delhi, concluding the four weeks allotted for professional military education and strategy discussions. Sponsored by HQ IDS, the course was executed by the Centre for Joint Warfare Studies and offered a platform for interaction between the Army, Navy, and Air Force. Members of the government sector, academia, industrial sector, and strategic think tanks community were also invited.

The curriculum explored topics such as artificial intelligence, autonomous systems, quantum technology, cyberspace warfare, information operations, and cognitive warfare. The training also delved into grey zone conflict and coordinated military operations in the land, sea, air, space, and cyber fields. Participants will take part in lectures, scenario construction, cognitive warfare simulations, field trips, and lectures by military commanders, defence policymakers, researchers, engineers, and other experts.

The purpose of this training is to enable officers, who will participate in planning and making battlefield decisions, to understand how their operational planning and field decisions are being impacted by novel and developing technologies. It is another reflection of the Armed Forces’ greater commitment to joint and tech-focused operations, and it is its 5th edition this year, set to start 16 November to 11 December 2026.

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​TATA Advanced Systems Limited has signed a Memorandum of Agreement (MoA) with Javelin Joint Venture, a partnership between Raytheon and Lockheed Martin, on the potential indigenous production of the Javelin anti-tank missile. Under the envisaged agreement, TATA Advanced Systems would become the lead industrial partner for developing final assembly, integration, and component manufacturing in India.

The scope of cooperation between the companies would include the Javelin All-Up Round, which is a complete missile sealed within its launch container and ready for use. Raytheon will provide the guidance electronics and Lockheed Martin will supply sub-assembly kits that India can use to assemble and integrate the weapon locally. Depending on India’s interests in further local content and technology transfer to its manufacturers, the project has the potential to foster a local missile supply chain.

Javelin is an American man-portable, fire-a​nd-forget, anti-tank and multi-purpose guided missile manufactured by Lockheed Martin and is capable of hitting armoured vehicles, fortified positions and other tactical targets. Its seekers can lock and track the target, and once launched, the operator can seek cover from hostile fire. The deal comes amid the Indian Army’s acquisition of a Rs 292 Crore batch of Javelin Systems, and may help reduce weapon availability time while simultaneously promoting deeper domestic engagement in complex weapon production.

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INS Nipun, the Navy’s second indigenously built Nistar-class diving support vessel, has been commissioned in the Naval Dockyard at Mumbai. The specialised vessel is expected to bolster the Navy’s capabilities in deep-sea diving, submarine rescue, salvage and underwater intervention. Built by Hindustan Shipyard Limited (HSL), INS Nipun is intended to support naval divers during difficult deep-sea dives and also to act as a mother ship for a Deep Submergence Rescue Vehicle (DSRV) or remotely operated vehicles deployed for locating and rescuing a disabled submarine’s crew.

It is the sister ship of the first vessel of the class, INS Nistar, which is already functioning in the Eastern Naval Command. By inducting a ship each on either the Indian Ocean seaboard and the Bay of Bengal, it will enable the Indian Navy to respond with a faster specialised underwater-support capacity across both sectors, and it is a major landmark development for the indigenous shipbuilding sector, as only a small number of navies in the world possess the deep-sea diving and submarine rescue capability available in these platforms. By inducting a ship for the Indian Navy, the capability for assisting partners during any underwater disaster or maritime calamity becomes higher.

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The Ministry of Defence has streamlined India’s Defence Export Standard Operating Procedure (SOP) and Open General Export Licence (OGEL) to speed up the process and help the Indian manufacturing sector reach global markets. Except for a few items of non-lethal arms, no stakeholder concurrence will be needed for the shipment of these articles. Similarly, this requirement will not be necessary for exporting goods intended for international tendering or exhibitions. However, protection for high-security zones/sensitive equipment will continue to exist.

The three individual Open General Export Licence procedures are now integrated into a single one. The licence validity period has extended from two years to three years, and the range of eligible countries has widened further; countries covered by United Nations sanctions regimes, arms embargoes, and other security restraints are not eligible. Eligible exporters can use the licence to send multiple batches of specified goods instead of seeking permission for each batch individually.

The reform is to make way for Indian manufacturers entering long-term contracts with foreign original equipment manufacturers. It is felt that the MSMEs in the country will benefit particularly through this, as their consignments of defence products comprising components, protective devices, etc could be exported in a routine manner.

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NASH Energy, India’s first mass-scale LFP cell manufacturer, will showcase its latest energy storage and energy management solutions at the 50th edition of Middle East Energy 2026, being held from September 1–3 at the Dubai World Trade Centre.

At Booth Z3.E10, NASH Energy will present its capabilities spanning LFP cells, battery packs, battery management systems and energy storage solutions, addressing a range of applications across automotive, electric mobility, industrial and energy sectors.

The company will highlight solutions ranging from battery packs to large-scale energy storage systems, demonstrating its capabilities across the energy technology value chain. With in-house engineering, R&D and manufacturing capabilities, NASH Energy is developing customised energy solutions designed to address the evolving requirements of global customers.

NASH Energy has an R&D centre in Japan and operates an LFP cell and battery pack manufacturing line in Bengaluru, India. The company has invested significantly in strengthening its R&D and manufacturing capabilities, with the aim of developing and manufacturing advanced energy solutions in India for global markets.

The company’s portfolio includes LFP cells and battery packs designed for applications across electric mobility, industrial systems and energy storage. Its capabilities extend from cell technology and battery-pack development to the integration of battery management and monitoring technologies.

NASH Energy’s energy technology portfolio is complemented by firmware and battery management capabilities developed by NASH Industries, including Battmonx, Battery Management Systems (BMS) and EVolt. These technologies enable battery monitoring, management and automation, supporting the development of connected and intelligent energy applications.

Commenting on the company’s participation, Mr. Sanjay Wadhwa, Chairman & Managing Director, NASH Group, said, “The energy ecosystem is undergoing significant transformation, with growing requirements for reliable energy storage, intelligent battery management and connected technologies. At NASH Energy, we are building capabilities across the energy value chain, from LFP cells and battery packs to integrated energy-storage solutions. Our investments in R&D and manufacturing are focused on developing scalable, application-specific energy solutions from India for global markets. Middle East Energy provides an excellent platform to engage with customers and partners in the region, understand their evolving requirements and demonstrate how our technologies can support the next generation of energy applications.”

NASH Energy’s solutions cater to applications across automotive and electric mobility, renewable energy, industrial equipment, energy storage and other emerging energy applications. The company’s integrated approach combines battery technology, engineering and manufacturing capabilities to support customers from product development through to scalable production.

The Middle East is emerging as an important market for energy storage and intelligent energy solutions as industries and infrastructure increasingly seek reliable, efficient and scalable energy technologies. Through its participation at Middle East Energy 2026, NASH Energy aims to engage with customers, technology partners and industry stakeholders and explore opportunities to develop application-specific solutions for the region.

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Electronic waste has the potential to be a source of valuable metals because a group of scientists have developed an experimental method for recovering gold from electronic waste. A research group at ETH Zurich has identified an experimental way to selectively recover gold from e-waste and have then gone on to converted the recovered material into a gold containing nugget.

Gold’s properties of electrical conductivity and resistance to corrosion make it ideal for use in components in semiconductor devices. Unfortunately, recovering gold from old computer circuit boards can be challenging, and old methods can use up huge amounts of electricity with and also harmful chemicals which generate hazardous waste and potentially harmful emissions that can pollute the environment and pose risks to human health.

A team of researchers at ETH Zurich manufactured a porous protein-based aerogel which is selective in terms of gold ion binding from solutions that contain metals recovered from discarded computer equipment. The team recovered metal material from 20 computer motherboards, dissolved them in an acid solution and tested how selective was the recovered material.

The solution obtained now consisted of several species of metal ions. The researchers then added the aerogel. The aerogel captured the gold ions from the solution. The captured gold was subsequently converted into flakes, and melted to produce a solid gold nugget.

The reported experiment produced approximately 450 mg of a metal nugget from 20 discarded computer motherboards, containing 91% gold and 9% copper, corresponding to approximately 21-22 carats. This research demonstrated a gold absorption capacity on the scale of 166.7 mg/g of aerogel which is considerably high.

The technology could create a method for extracting precious metals from abandoned PCs and other electronic waste items and help further a circular economy in the process. According to the ETH Zurich economic analysis, the cost of combined material sourcing and energy during recovery of precious metals were substantially lower than the value of the recovered gold under the study’s assumptions.

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The EV charging infrastructure sector in India is moving away from merely providing hardware to offering digitally connected and interoperable charging services. A prime example of this transition is the recent partnership between Hyundai Motor India (HMIL) and Jio-bp, aiming to combine the EV charging infrastructure with its digital platform, making it easier for EV users to discover and access charging stations.

As part of the new collaboration, Hyundai Motor India will now be connecting over 7,000 Jio-bp pulse charging points across more than 300 Indian cities directly into its myHyundai application. Through this, the total number of available charging points through myHyundai app grows to more than 37,000, thereby making charging options readily available for EV customers at one place.

The primary purpose of this collaboration is to offer improved accessibility and convenience for EV charging stations using a digitally integrated approach. Rather than drivers having to search across multiple charging apps, the myHyundai platform can allow drivers to be connected to more of the charging network through a single platform.

This highlights the increasing significance of interoperability within the EV ecosystem. With individual charge point operators running their own networks, apps and payment systems, incompatible digital ecosystems can fragment the public charging experience for EV drivers. Software linking networks together can reduce this fragmentation.

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Driven by the need for alternatives to traditional lithium-ion solutions, India’s push for the indigenous iron-air battery system utility-scale testing is to begin at NTPC’s Simhadri Super Thermal Power Station (STPS) in Andhra Pradesh. To be executed under the aegis of the Atal Incubation Centre – Anna University (AIC-AU) and scheduled to commence in August 2026, the pilot will test deep-tech start up Meine Electric’s long-duration energy storage (LDES) solution.

Iron-air batteries generate stores and release electrical energy through an electrochemical reaction that undergoes oxidation and reduction reactions an iron-based negative electrode and utilizing oxygen contained in ambient air. Discharging occurs by oxidizing iron to produce electricity and during the charge step the iron-containing reaction products are reduced, regenerating iron. This chemistry adds an alternative approach to long-duration energy storage with the potential for high power or long cycle life applications beyond those readily delivered today by current lithium-ion technologies.

According to Meine Electric, the Fast Charge Long Discharge is a six-hour charge and eighteen-hour discharge cycle. In addition, Meine Electric’s technology was also independently tested by CES and evaluated on performance in terms of electrochemistry as well as operational durability and capacity retention.

At present, the applications of the Simhadi pilot are more focused on stationary energy storage than on the EV traction applications, but it has future relevance to electric mobility since long-duration storage technology could enable the use of renewables, increase grid flexibility, and provide more reliable power supply.

In the future, with EV charging networks scaling up in India, large scale storage could eventually help charging infrastructure to balance the variations between renewable electricity generation and EV demand. This is especially the case in higher power charging hubs and corporate EV fleets.

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With the increasing growth rate of electrical vehicle adoption in India, a paramount concern of battery reliability, safety and lifespan arises. Conventionally, Battery Management Systems (BMS) have monitored parameters such as voltage, current and temperature constantly. But with the modern technology approach of integrating artificial intelligence (AI) and machine learning (ML), battery management could be transformed from conventional monitoring into a predictive system capable of identifying degradation patterns, detecting abnormalities, estimating battery health, and supporting predictive maintenance.

One key application is a State of Health (SoH) prediction, that represents the state of the battery compared to their original state of capacity or performance. ML models can be used with charging and discharging curves, temperature, current, voltage and past usage history to predict battery degradation, avoiding periodic physical tests.

Likewise, Data-driven algorithms are also useful for the estimation of state of charge (SOC). To accurately estimate the remaining usable energy is crucial in order to enhance driving range prediction. ML models can be a good supplement to current approaches (such as coulomb counting, model-based estimation), especially in varying conditions.

Other applications being developed include remaining useful life (RUL) prediction. Algorithms trained on historical data for degradation behaviour may use battery performance to determine how long a battery or cell could last before a certain level of performance was reached. This might enable predictive maintenance and warranty management.

As a part of the growing Indian EV manufacturing community shifting to connected cars and data-driven fleet management it is possible that an AI-based BMS might evolve as one more layer within the EV system. High-performance prediction would again depend on accuracy of the sensor inputs, quality of algorithm and computational capacity available and to be validated across various conditions.

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The Automotive Skills Development Council (ASDC) recently hosted its 15th Annual Conclave 2026 in New Delhi. The conclave brought together more than 500 representatives from government, industry, academia and the automotive sector to deliberate on the skills required to support India’s evolving automotive industry. The theme of then event was: “Skilled Hands, Strong Nation: Building India’s Automotive Future.” The conclave was inaugurated by Shri H. D. Kumaraswamy, Union Minister of Heavy Industries, who underlined the importance of preparing India’s workforce for emerging technologies.

Addressing the gathering, the union minister said, “India’s automotive sector is a powerful engine of growth, creating opportunities across engineering, electronics, components, logistics, software, services and employment. As India expands its manufacturing capabilities and global value-chain presence, developing a skilled workforce that meets global standards of quality, productivity, safety and innovation is critical.”

He highlighted that the shift to electric mobility is creating new opportunities while increasing demand for skilled professionals in battery technology, high-voltage systems, power electronics and advanced diagnostics. Strengthening the link between education, skilling and employment must therefore remain a national priority. Through the Skill India Mission, the Government is committed to building a future-ready automotive workforce and positioning India as a global hub for skilled talent, contributing to the vision of ‘Viksit Bharat @2047.’

Speaking at the conclave, Vinkesh Gulati, Chairperson, Automotive Skills Development Council (ASDC), said, “India’s automotive industry is at an important inflection point, with electric mobility, advanced manufacturing, AI and Industry 4.0 rapidly reshaping not only vehicles and factories, but also the skills required across the automotive value chain. Our focus at ASDC is to ensure that skilling evolves at the same pace as technology. The real measure of our success is not just the number of people trained, but how effectively those skills translate into employability, productivity and meaningful career opportunities.”

Highlighting ASDC’s increasing focus on future technologies and global capability building, he spoke about the development of seven EV skill labs across India and internationally, including facilities in Chennai, Vadodara and South Africa. These initiatives are aimed at providing hands-on exposure to emerging automotive technologies and creating a workforce equipped to meet both domestic and global industry requirements. Gulati also presented ASDC’s Performance Report for 2025–26, highlighting the Council’s expanding initiatives across industry partnerships, women’s participation, academia-industry collaboration, emerging technologies and employment-linked skilling.

As India aspires to become a global automotive and mobility hub, our competitive advantage cannot come from manufacturing scale alone. It must also come from the quality of our talent, mentioned Gulati. “Future-ready vehicles will need a future-ready workforce, and India has the opportunity to become not only a global manufacturing hub, but also a global talent hub for the automotive industry.”

The conclave emphasized on strengthening partnerships between the skilling ecosystem and industry. The event saw MOU exchanges with Kia Motors India Private Limited; Kukje Business Solution Private Limited and Rossik East Europe SRL; Shell India; and Lucas India Service Limited. The conclave further marked important milestones in ASDC’s skilling and employment journey through the launch of its Annual Report 2025-26, the flag-off of candidates proceeding to Romania and a convocation ceremony.

Attendees witnessed two high-level industry panels addressing critical challenges across the automotive skills and employment ecosystem. The first panel, “The Last Mile Workforce: Building a Pipeline of Technicians and Entrepreneurs,” examined the need to create a robust pipeline of skilled technicians and entrepreneurs capable of supporting the industry’s expanding requirements. The second panel, “From Training to Employment: Strengthening the Skill-to-Industry Pipeline,” focused on strengthening the connection between training and actual employment opportunities, with discussions around industry requirements, job readiness and the need for greater alignment across the skill-to-employment value chain.

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The Centre for Development of Telematics (C-DOT), the premier telecom R&D centre of the Department of Telecommunications (DoT), Ministry of Communications, Government of India, celebrated its 43rd Foundation Day on 25 August 2026 at BHIM Hall, Dr. Ambedkar International Centre, New Delhi. The occasion marked 42 years of C-DOT’s contribution to the development of indigenous telecom technologies since its establishment in 1984.

Jyotiraditya M. Scindia, Hon’ble Union Minister of Communications and Development of North Eastern Region; Dr. Chandra Sekhar Pemmasani, Hon’ble Minister of State for Communications and Rural Development; and Shri Amit Agarwal, Secretary (Telecom) and Chairman, Digital Communications Commission, graced the occasion along with other senior officials, industry representatives and distinguished guests. The Foundation Day exhibition was inaugurated by both the ministers.

The Ministers also unveiled the Quantum Products Wall, showcasing C-DOT’s indigenous Quantum Series comprising of 14 products covering both Quantum Key Distribution (QKD) and Post-Quantum Cryptography (PQC) solutions developed to strengthen the security and resilience of India’s communication networks in the emerging quantum era. The product showcase at the exhibition, provided an opportunity to showcase C-DOT’s indigenous technologies and solutions across various domains of telecommunications. The dignitaries thereafter were briefed at the exhibition on the various indigenous telecom technologies and solutions developed by C-DOT.

During the inaugural session, the Hon’ble Ministers and senior dignitaries launched a Quantum Product booklet, which is a consolidation of C-DOT’s indigenous quantum solutions. The booklet presents C-DOT’s work in Quantum Key Distribution (QKD) and Post-Quantum Cryptography (PQC), highlighting the Centre’s efforts towards developing secure, resilient and future-ready communication technologies.

Addressing the gathering, Shri Jyotiraditya M. Scindia, Hon’ble Union Minister of Communications and Development of North Eastern Region, lauded C-DOT as an institution with the potential to transform not only India but also contribute to shaping the technological landscape globally. Highlighting C-DOT’s work in 5G, 6G, cybersecurity and disaster resilience, he emphasised the importance of taking indigenous innovations from the laboratory to the market. The Minister also highlighted the importance of strengthening indigenous research and innovation to create technologies that can serve national requirements and also position Indian technologies on the global stage.

He said that the spirit of “Atmanirbhar Bharat” and “Make in India” would attain its true potential when India not only develops technologies domestically but also “makes for the world”. Dedicating the occasion to C-DOT’s young engineers and researchers, he highlighted the true reflection of each letter of the name C-DOT in their Curiosity, spirit of Disruption, Ownership and Tenacity. He urged them to nurture their thirst for invention, challenge boundaries and harness their courage and capabilities to build technologies for the future, observing that the spirit of “Jai Vigyan, Jai Anusandhan” lies within the young minds of C-DOT.

The Foundation Day celebrations focused around a day-long conference themed “Beyond Connectivity: Secure, Trusted and Intelligent Communication”. It brought together senior government officials, policy makers, industry leaders, technology experts and academia to deliberate on emerging technologies and the evolving communication landscape.

Speaking on the occasion, Dr. Rajkumar Upadhyay, CEO, C-DOT, said, “C-DOT’s journey over the past 42 years has been driven by its commitment to developing indigenous technologies for the nation. As telecommunications move beyond conventional connectivity, our focus is expanding towards secure, trusted and intelligent communication systems. Through our work in cybersecurity, quantum-secure communications, 6G and other emerging areas, C-DOT remains committed to strengthening India’s technological self-reliance and contributing to the development of globally competitive telecom technologies.”

The 43rd Foundation Day celebrations showcased C-DOT’s commitment to advancing indigenous research and innovation and contributing to the development of a secure, trusted and future-ready digital communications ecosystem. As it enters its 43rd year, C-DOT continues its research and development efforts in 6G, quantum-secure communications and other emerging technologies. This is in line with the vision of Atmanirbhar Bharat and India’s ambition of positioning the country as a global leader in next-generation, trusted connectivity.

Q-AKSHAY CD is a compact, fibre-based Quantum Key Distribution (QKD) system based on Coherent One Way (COW) and Differential Phase Shift (DPS) protocols in a compact 1U size. It enables secure quantum key generation and distribution over fibre networks.

Q-AKSHAY MD is a fibre-based QKD system based on the Measurement Device Independent (MDI) protocol, offering enhanced security against vulnerabilities associated with measurement devices. It represents C-DOT’s next-generation approach to secure quantum key distribution.

C-SPD is a Single-Photon Detector, a critical sub-module used in quantum communication systems.

C-RD is a wideband RF driver designed to drive intensity and phase modulators used in quantum communication systems. It serves as a critical sub-module for enabling high-performance quantum communication applications.

Q-SETU is a quantum-safe encryptor designed to secure Layer 3 communications with a throughput of up to 80 Mbps. It incorporates NIST Post-Quantum Cryptography (PQC) algorithms to protect data against emerging quantum-era threats.

Q-MAHASETU is a next-generation, commercial-grade quantum-safe encryptor supporting Layer 2/3 networks with throughput of up to 40 Gbps. It uses NIST PQC algorithms to provide high-speed, quantum-resistant protection for enterprise and critical communication networks.

Q-VIKRAM is a defence-grade quantum-safe encryptor providing up to 1 Gbps throughput for Layer 2/3 networks. It incorporates NIST PQC algorithms to provide enhanced protection for sensitive and strategic communications.

Q-AMOGH is a high-speed quantum-safe optical encryptor providing up to 200 Gbps throughput at Layer 1. Based on NIST PQC algorithms, it is designed to secure high-capacity optical communication links against emerging quantum threats.

Q-DARSHAN is a quantum-safe video IP phone incorporating NIST PQC algorithms to protect voice and video communications. It brings quantum-safe security directly into IP-based communication systems.

Q-VACHAN is quantum-safe In-line node for IP phone, NIST PQC algorithms, it can upgrade existing IP phones with quantum security.

Q-RAQSHAK is a quantum-safe enterprise network solution designed to protect enterprise communications and network infrastructure. It incorporates NIST PQC algorithms to provide protection against current and future cryptographic threats.

Q-VAAYU is a quantum-safe wireless point-to-point network solution designed to secure wireless communication links. It uses NIST PQC algorithms to provide quantum-resistant security for wireless connectivity.

Q-VAJRA1000 is a quantum-safe access node designed to upgrade existing communication networks with quantum security. It can support technologies such as GPON and wireless radios, enabling quantum-safe protection to be integrated into existing network infrastructure.

Q-PARAKRAM is a defence-grade quantum-safe encryptor providing up to 1 Gbps throughput for Layer 2/3 networks. It incorporates NIST PQC algorithms and is designed to provide robust quantum-resistant security for strategic and defence communications.

The post C-DOT, the Premier R&D Centre of DoT, Celebrates Its 43rd Foundation Day appeared first on ELE Times.

Abhishek Pandey | Sub-Editor | ELETimes

​“How little smart robots in swarms are revolutionizing farming; one field at a time.”

Agriculture’s history has always been based on years of experience, sheer muscle, and eventually- better machines. Farming tools like tractors grew bigger, irrigation more complex, and harvest more automated. But even with all this progress, many of today’s agriculture issues- labour scarcity, inclement weather, skyrocket costs, depleted soil and the demand for more food- seems harder than ever to solve.

What if the future farming technology wasn’t about big machines and instead would use thousands of smaller ones to collaborate like an ant colony?

But this isn’t just future science fiction anymore. We already see teams of robotics swarmer’s-teams of small, autonomous bots working together in a group to coordinate actions, communicate, and make collective decisions-at the hands of university researchers and agricultural tech firms. Using cutting- edge AI and loT, a tight wireless connection, Edge AI, these minute devices are re-shaping how we cultivate, protect, watch, and harvest our food.

Farmers of the future will perhaps abandon expensive machinery in favour of a hundred robots the size of shoebox collaborating with a hive mind, say scientists who drew inspiration for their robot swarm from living creatures. It will adapt and regroup on the fly, even if one of its number malfunctions.

It might therefore surprise you that swarm robotics didn’t start out in some engineering lab. Instead, it began with observation in nature. Bees build intricate underground nests that never had any leader to order each individual around. They would fly in coordinated swarms to protect their nest and gather food. Bees have the ability to marshal thousands of workers together and fly in formations, their flight directions will adjust by themselves depending on the directions of adjacent rather than order from the commander.

Together that enables an extraordinary smart system to function based on a number of individuals’ quite simple activities. Inspired by such an instinct, the engineers adopted the concept of the design to implement the concept of swarm robotics- a discipline that entails many-or sometimes a hundred-small robots units working together for tasks that could otherwise not be achieved by a solitary unit. Each unit senses the surrounding, communicates it to its close peers and modifies its behaviour according to the information aggregated.

This collective intelligence, known as a “Hive Mind” is swarm robots, is one of the reasons that this emerging field of robots, sometimes referred to as swarm intelligence, is such a rapidly growing area for research and robotics in general.

The amount of pressure being placed on modern day farming today is huge. Weather and the climate have become increasingly unpredictable with climate change. Water resources are dwindling in many regions. There is a global need for increased food production with fewer resources, in a manner that protects the environment.

Meanwhile, many countries are encountering shortages in labour supplies and there have always been issues finding workers to support agriculture planting and harvesting. Many traditional solutions to some of these issues create others, though. Large tractors can pack the soil, guzzle a lot of fuel and often approach entire fields in the same manner, even when the crop will not require the same treatment for every square foot of the field.

This is exactly where precise agriculture starts to kick into gear. So instead of spraying a field with one spray the technology can be used to determine exactly what the individual part needs for precision agriculture. Robot swarms take it to the extreme allowing thousands of small decisions to be made constantly throughout a field.

It’s not the one machine to do it all that is forming the basis for the agriculture robot swarms. Instead, responsibilities are shared.

The robot inspects the moisture level of the soil or checks the nutrients level of the plants. Other robots can scan fields to pinpoint weeds or monitor crop health from up in the air using drones and look at single plants up close with robots on the ground. Some even deliver a precise dose of pesticides or fertilizer just where the plant needs it.

If one robot detects something abnormal, it alerts its robot peers, which can help further assess the situation, and coordinate actions. This constant communication ensures that the farms are able to respond in a far more dynamic way that older farming systems ever could.

The brain power comes in the form of AI and Edge AI technology for these robots. Instead of transmitting all images and sensor data back to faraway cloud servers, the majority of robots process them in real-time, so they can react to shifting field conditions. If, for instance, a robot notices a weird pattern in leaf discoloration, it doesn’t need to pause for seconds or minutes while it’s being told what to do.

The robot can scan a picture, compare it to its earlier recordings, and can send nearby robots the signal nearly in real time. Combining this local knowledge with the power of coordinated communication enables the development of a quicker and more robust farming system.

The great thing about swarm robotics is that they are capable of being very precise. Some traditional spray equipment has the capacity to apply treatment across a whole field without differentiating between individual plants. But there are many plants which will never receive a benefit from pesticide or fertilizer applications. On the other hand, swarm robot design is more open.

Through the use of cameras, sensors, and artificial-intelligence image recognition, they can tell weeds apart from the plants or can identify if the plant has deficiency and needs more food. Why spray everything on the meter area, when it is not necessarily the problem. This leads to less chemical input, more healthy soil, reduced production costs and increased crop quality. That adds up to more efficient farming- while keeping it sustainable.

However, the benefit of robotic swarms isn’t only to increase output. Heavy machinery for agriculture presses on the ground with more weight, while light weights robots make less pressure on the soil thus saving the structure for a long time.

Their electric system reduces reliance on the combustion of fossil fuel, which means lower emissions of carbon dioxide. As farmers always keep an eye on their crop, they are alerted of potential pests, diseases, lack of water or deficiency in any of the necessary nutrients at a much early stage. The very fact that problems can be spotted much easier ensures that they don’t snowball into big losses.

Swarm systems collect useful information to make better planning for the future as well. A farmer will know better on how his performance has been during a season and identify the repetitive problems encountered each season so as to have a better planning on what he or she needs to harvest next.

While the technology is promising, the applications of swarm robotics are still a work in progress. The difficult and complex engineering task of producing low-cost, robust robots capable of withstanding challenging weather is a key priority for robotics researchers worldwide. Harsh environments-characterized by dust, rain, mud, rough terrain-pose significant hurdles for autonomous machines. Battery power is also another issue which limits how long robots, particularly small, heavy robots equipped with sensors, can be operational.

Hundreds of autonomous machines to stay secure, reliable and resilient, as cybersecurity is rapidly becoming a vital aspect of every automation process. There are also questions of economic nature. Despite the fact that robotic swarms help cut down expenses in the long run, a farmer on a small scale might find a steep initial investment to be a burden if they can’t obtain funding, or set up a cooperative model to share these expenses.

The researchers think that it is early days for the technology. In the future, farming might involve integrated networks of autonomous tractors, swarms of robotics weeders and harvesters, aerial drones, satellites, weather models, and AI-powered analytics, forming a smart farming ecosystem.

Rather than being a substitute for farmers, these tools will likely be excellent decision-making support tools that enable the farmers to use their experience, intuition, and judgement along with robots taking care of very specific, laborious, and highly repeatable and high precision tasks. Technologies are being rapidly developed in the 5G, Edge AI, robotics and sensor spheres that are making fully integrated smart farming closer than ever.

For centuries, technology has been driving innovation in agriculture, from handheld implements and animal-powered plows to automated machinery and GPS-guided tractors. This latest agriculture revolution may not come in larger machines, but in millions of smaller, more intelligent ones.

Bur swarm robotics, artificial intelligence-assisted farming and precision agriculture, for example, indicate that the ways in which we can grow food in the future could be entirely different, with help from miniature robots coordinated like nature’s own organized swarms and ant colonies. The key: They’re showing that smart behaviour doesn’t always reside within an individual, highly intelligent system, but can be generated from multiple, cooperating units working together towards a collective objective.

And if this picture continues to evolve, the farm of tomorrow won’t just be automatic, but cooperative, fluid, connected and profoundly effective. Tomorrow, the tiniest hands can get the biggest job done in a field.​

The post The Tiny Robot Revolution: Farming With a ‘HiveMind’ appeared first on ELE Times.

Prashant Verma | Sub-Editor | ELETimes

Modern electronic devices are becoming smart and more efficient with the passage of time. They give high-performance computing power, 5G speed network support, auto pilot mode in EVs like Tesla, Artificial Intelligence (AI), and cloud computing. These features have made human life more comfortable than before because now modern processors can integrate tens of billions of transistors on a single silicon die by using advanced manufacturing nodes. These innovations in semiconductors significantly improve computational performance. However, they also introduce a critical engineering challenge such as managing heat while maintaining a stable power supply throughout the chip.

A single operation in electronic devices can allow billions of transistors to operate simultaneously at frequencies exceeding several gigahertz and thus generate a substantial amount of heat. If the generated heat is not effectively dissipated, the chip’s temperature rises which can cause performance degradation or lagging of a system. Thus, thermal management plays a significant role in maintaining the temperature of semiconductor devices to ensure that the chip’s temperature is constant throughout the operation.

Heat in semiconductor devices is produced by the flow of electrical current during transistor operation. As electrons move through the semiconductor material, some kinetic energy is converted into heat because of the device’s internal resistance.

Modern digital electronics use CMOS transistors because of their high integration density and low power dissipation. It is used to manufacture nearly all integrated circuits (ICs). Every CMOS transistor consumes power through two primary mechanisms which contribute to heat generation.

• Dynamic Power
• Leakage Power

Dynamic Power: It is the energy consumed when a circuit actively switches between logic states (0 and 1). The primary role of dynamic power is to provide energy for switching the transistor between logic states. The higher the operating frequency and switching activity, the greater will be the consumption of dynamic power which will generate more heat.

Thermal management controls this heat through the following methods:

1. System-Level Active Cooling: It provides cooling through fans or circulating dielectric liquid.
2.  Circuit and Architecture-Level Management: It lowers the supply voltage and clock frequency when there is less workload on the system.
3. Semiconductor and Packaging-Level Dissipation: It includes dummy metals placed below hot CMOS junctions to draw heat away from the microscopic transistor level.

Leakage Power: It is defined as the electrical energy wasted as heat due to continuous current flowing through the semiconductor device even when the device is in idle state. Several physical mechanisms generate leakage in modern transistors such as subthreshold leakage, reverse-bias PN junction, and gate oxide tunneling. It is a major challenging problem in thermal management.

1.   Power Gating: It is a circuit design technique that reduces power consumption by completely shutting off the power supply to idle regions of the chip.
2. Dynamic Voltage and Frequency Scaling: Lowering the supply voltage and clock frequency during tasks that require low computation power to reduce overall power and subsequently lower operating temperature.
3. Thermal Floor planning: It is a chip design technique to minimize leakage heat by strategically arranging different heat generating circuits across the chip.    Thermal Management plays an important role in maintaining the optimal temperature of electronic devices.

While thermal management focuses on removing heat, power integrity focuses on delivering required stable power to every transistor on the chip. This ensures that the device operates efficiently under all operating conditions.

Why Power Integrity is required in Semiconductor Devices?

The major requirement of power integrity is to prevent voltage fluctuations and noise that can cause logic errors, timing failures, and performance degradation. Following are the list of primary reasons why power integrity is essential in modern semiconductor devices:

• Preventing Voltage Drop: Voltage practically drops when millions of transistors switch simultaneously. Power integrity minimizes voltage drop by minimizing the impedance of the Power Distribution Network (PDN).
• Controlling Clock Jitter: Clock jitter is the unwanted, short-term variation in the clock signal caused by noise sources such as power supply variations and electromagnetic interference.
• Reducing Electromagnetic Interference (EMI): A well-designed Power Distribution Network (PDN) delivers suitable power across the transistors of the chip that reduces electromagnetic interference which eventually reduces power consumption and improves thermal performance.

Modern semiconductor devices deliver enhanced computational power. However, they also face critical power integrity challenges such as ensuring suitable power delivery across a chip, despite shrinking transistors size and massive current surge. Following are the key challenges in Power Integrity:

1. IR Drop: Current flowing through the resistance (metal interconnects) causes voltage loss. This voltage reduction is known as IR Drop. In semiconductors, a higher current flowing through a resistive interconnect results in a large voltage drop. If the voltage reaching a functional block falls below its required operating level, functional errors may occur. Engineers must therefore optimize​ the power grid to minimize IR drop across the chip.
2. Simultaneous Switching Noise (SSN): It is the voltage fluctuations created within the power delivery network when multiple transistors switch simultaneously creating a sudden surge in current demand. If SSN is not controlled, it can cause timing errors, signal integrity issues, and unreliable operation. Engineers minimize Simultaneous Switching Noise (SSN) by optimizing the Power Delivery Network (PDN) and controlling on-chip switching dynamics.
3. Power Supply Noise: It is defined as an unwanted variation in current and voltage on a DC power line. It includes high frequency spikes and voltage drops caused by switching regulators and high-speed switching of transistors inside the chip.

Power supplies are never perfectly stable. Without sufficient decoupling capacitance and well-designed power distribution network, Power Supply Noise occurs as voltage ripple across the chip. One of the major challenges in modern semiconductor devices occurs due to the simultaneous switching of billions of transistors, lower operating voltages, increasing clock frequencies, and high-power density. Engineers reduce power supply noise by building on-chip decoupling capacitance, using thicker metal power grids to lower resistance, and integrating voltage regulators directly onto the chip.

Thermal management and Power integrity are closely linked to each other. As power delivery losses generate heat and increasing temperature slows down electrical efficiency and increases resistance. To prevent any hindrance in the performance of a system, it is essential to perfectly balance these two disciplines during the design process.

Modern semiconductor companies treat both thermal management and power integrity as a single discipline while evaluating throughout the design process using advanced Electronic Design Automation (EDA) tools. This co-optimization approach enables engineers to achieve higher performance, lower power consumption, and improved long-term reliability in advanced semiconductor devices.

The post Thermal Management and Power Integrity in High-Performance Semiconductor Devices appeared first on ELE Times.

What’s new?

Texas Instruments (TI) today introduced the industry’s first multiaxial coreless Hall-effect current sensor designed for all hybrid electric vehicle and electric vehicle (HEV/EV) traction inverter applications. The TMCS2100-Q1 sensor offers a first-of-its-kind approach to current sensing through the combination of multiaxial measurement and a proprietary algorithm, eliminating the trade-off between precision and system size in traction inverter designs.

While existing coreless solutions are limited to single-axis measurements, the TMCS2100-Q1 sensor is the first to measure magnetic fields in both horizontal and vertical directions. This multiaxial measurement is 20 times more accurate than single-axis alternatives, achieving displacement error of less than 1% at 0.4mm movement and as low as 0.25% at 0.1mm. This level- of precision improves the EV powertrain torque control loop, maximizing efficiency and power delivery across varying load and thermal conditions.

“For the first time, engineers have a Hall-effect current sensor that breaks through the limitations of existing solutions, which is especially critical as 800V architectures raise the bar for traction inverter accuracy,” said Jason Cole, vice president and general manager, Sensing Products at TI. “Leveraging advanced research from TI’s Kilby Labs – our advanced R&D engine – the TMCS2100-Q1 was developed to give automakers a tool to build HEVs and EVs where tighter current measurement translates directly into longer range, smoother ride quality and more efficient motor control.”

Why does it matter?

Automakers are continuously looking to make traction inverters lighter and more efficient to extend driving range and enhance vehicle performance. Traditional measurement approaches present designers with a fundamental trade-off:

• Solutions with a magnetic core – or C-core implementations – deliver accuracy but add size and weight.
• Coreless alternatives are smaller but compromise precision due to displacement error and magnetic crosstalk.

TI’s current sensing technology addresses this trade-off by:

• Measuring both axes simultaneously: vibration during vehicle operation creates movement between the sensor and conductor, causing single-axis, differential coreless sensors to lose accuracy. The TMCS2100-Q1 sensor significantly reduces vibration-induced error by measuring magnetic fields in both horizontal and vertical axes at once.
• Maintaining accuracy: reducing error and maintaining accurate current measurement minimizes magnetic crosstalk influence and torque ripple, a cause of jerky acceleration, motor noise and inefficient operation that reduces range.

By eliminating the magnetic core without sacrificing precision, the TMCS2100-Q1 sensor enables smaller, more power-dense traction inverter designs, helping automakers build EVs that are more efficient, longer-range and more enjoyable to drive. This device is the latest innovation in TI’s automotive portfolio, demonstrating our continued investment in addressing customer challenges throughout the entire vehicle.

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