ELE Times

Choosing the right mouse can truly transform one’s working, gaming, or creative process. Be it accurate gaming or simple productivity, a dependable mouse increases lure editing speed, comfort, and efficiency. Here is a detailed look at the top ten mouse brands in the U.S, including their salient features, flagship models, and unique technology.

1. Logitech

Logitech, headquartered in Newark, California, can probably be considered the industry leader in both productivity and gaming mice. The company focuses on ergonomic office designs and high-performance gaming equipment. Popularly, the MX Master 3S is used by professionals, while gamers prefer the ultra-light G Pro X Superlight. Technologies present in Logitech include the HERO sensor, the Logi Bolt wireless connection, and the MagSpeed scroll wheel, all of which ensure pinpoint accuracy and speed, with an easy transition from work to play.

2. Razer

Razer is a household name among the laymen in the games. The company has set up shop in designing outright high-DPI, ultra-responsive competitive gaming mice for esports and competitive use. With features like Focus Pro 30K Optical Sensor and HyperSpeed Wireless technology, popular models like the DeathAdder V3 Pro and Basilisk V3 provide professional-level gaming with lightning-fast performance and haptic accuracy.

3. Corsair

Located in Fremont, California, Corsair is the very first company in this space to manufacture gaming mice that combine pure performance with extreme levels of customization. Its best-sellers include the Dark Core RGB Pro and M65 RGB Ultra, both incorporating Slipstream Wireless technology and optical switches. Corsair also provides its customers with the iCUE software with which they can alter DPI, lighting, and macros for a truly immersive gaming experience.

4. SteelSeries

SteelSeries has set up shop in Chicago, Illinois, to make its mark in the e-sports and competitive gaming world. The company usually designs the ultralight and fast mice such as the Aerox 3 Wireless and Rival 5 that feature TrueMove sensor technology and Quantum 2.0 Wireless, respectively. These provide near-zero latency and waterproof designs for situations in which games are being played at breakneck speeds.

5. HP

Based in Palo Alto, California, HP produces a vast stock of budget-class, workhorse-type mice. These are great for productivity and basic office work. Popular models, such as the HP 930 Creator Wireless Mouse and HP X3000, feature multi-device Bluetooth connectivity and silent click design, making them well-suited for every day use and professional environments.

6. Microsoft

Based out of Redmond in Washington, Microsoft concentrates on business-grade and ergonomic mice running seamlessly in the Windows ecosystem. The company’s best models such as the Microsoft Arc Mouse and Surface Precision Mouse work best with their BlueTrack sensor and for a hassle-free working experience with Surface devices and Windows-based PCs.

7. Glorious

Born and raised in Dallas, Texas, Glorious is the new rising star in high-performance gaming mice. Famous for their ultra-light honeycomb designs, the brand offers the best models on the market like the Model O and Model D Wireless. Powered with the BAMF sensor and Ascended Cord to reduce drag and maximize responsiveness, they are favorites among FPS gamers.

8. ASUS ROG

Located in Fremont, California, the ROG division of ASUS will offer you high-end gaming mice where style meets its cutting-edge hardware. ROG AimPoint sensor powers several recognized ROG models, like the ROG Gladius III and Chakram X, with push-fit switch sockets to enable customizable click resistance, thus appealing to gamers who demand precision and flexibility.

9. Cooler Master

Cooler Master, based up in Chino, California, makes gaming and everyday-use mice with a focus on price-to-performance ratio. Bestsellers like the MM731 and MM720 are equipped with Ultraweave cables, PTFE feet, and RGB lighting customizable to gamers who like the idea of having something lightweight and really nice-looking for a reasonable price.

10. Dell

Dell, headquartered in Round Rock, Texas, makes reasonably durable and efficient mice for office use and home use. Because these mice, including the Dell MS7421W and Dell WM126, are known for their long battery life, multi-OS support, and plug-and-play experience, these are the ideal companions of any business amateur as well as students.

Brand Comparison:

Brand	Use Case	Key Model	Sensor Type	DPI Range	Connectivity
Logitech	Productivity & Gaming	MX Master 3S / G Pro X	HERO Sensor	Up to 25,600	Wireless/Bluetooth
Razer	Esports Gaming	DeathAdder V3 Pro	Focus Pro 30K	Up to 30,000	HyperSpeed Wireless
Corsair	Custom Gaming	M65 RGB Ultra	PixArt PAW3393	Up to 26,000	Wireless
SteelSeries	Competitive FPS	Aerox 3 Wireless	TrueMove Core	Up to 18,000	Wireless/USB-C
HP	General Office	HP 930 Creator	Optical Sensor	Up to 4,000	Bluetooth/USB
Microsoft	Business Use	Surface Precision	BlueTrack	Up to 3,200	Bluetooth/USB
Glorious	Lightweight Gaming	Model O Wireless	BAMF Sensor	Up to 19,000	Wireless/USB-C
ASUS ROG	High-End Gaming	Chakram X	ROG AimPoint	Up to 36,000	Wireless/USB
Cooler Master	Budget Gaming	MM731	PixArt PAW3370	Up to 19,000	Wireless/USB
Dell	Office Use	MS7421W	Optical Sensor	Up to 3,000	Wireless

Conclusion:

The top 10 mouse brands that U.S. can provide comprises a diverse selection for every need, be it gaming, office, or hybrid. Brands like Logitech and Razer are in the forefront with innovative, feature-laden models, while the likes of HP, Microsoft, and Dell provide tried and tested solutions for productivity.

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A grand study conducted by the Centre for Development Studies (CDS) reiterates the major talking point all through the mobile ecosystem: India had soared further into the elite international group of suppliers of mobile phones and was positioned as the third-largest exporter of mobile phones in the world, with exports worth around US $20.5 billion during the calendar year 2024.

The Meteoric Rise: From Dependent on Imports to Export-Driven Power:

Six years ago, in 2017-18, India was exporting a mere amount of US $0.2 billion worth of mobile phones. By 2024, this figure has crossed the $24 billion mark marking an astonishing almost 11,950 per cent increase. Such explosive growth coincided with India moving from being a player in domestic manufacturing only to a scale export-led manufacturing partner in the bigger global arena.

Government encouragement and production-related incentives:

Key to this change is the Production-Linked Incentive (PLI) scheme floated in 2020 and implemented ever since. Since then, this bold policy has largely helped the foreign Original Equipment Manufacturers (OEMs) and contract manufacturers to invest in local facilities and infrastructure. So, we have a big-scale output and a robust integration into global value chains (GVCs).

Multi-layered domestic value addition stood out as a strong trend. Direct value for production of mobiles has seen an almost 283% rise from US $1.2 billion in FY 2016–17 to about US $4.6 billion in FY 2019–20. Even more impressive has been the growth in indirect value addition upstream supply chains by 604%, from US $470 million in FY 2016–17 to about US $3.3 billion in FY 2019–20.

With this economic growth came a greater occasion for employment: Further estimates indicate that more than 1.7 million direct and indirect jobs were linked to mobile production in 2022–23, and the number of export-related jobs rose at an astounding 33-fold. Wages too are rising, thanks to growing high-skill jobs in export-oriented units.

Global Trade Strategic Development:

India now ranks third in the mobile phone exports after China and Vietnam, having achieved exports worth nearly US $20.5 billion in 2024. World’s Top Exports data suggests that India exported 7.1% of global mobile exports in 2024, amounting to US $20.48 billion an increase of 585% compared to 2020.

This is in consonance with the CDS findings, positing India as a major exporting hub for mobiles. Contract manufacturing for brands such as Apple, Samsung has further accelerated exports, while the competitive ecosystem consisting of the likes of Foxconn, Wistron, Pegatron, and Dixon Technologies leads to high-volume outputs.

Conclusion:

The mobile export surge in India is more than just headline numbers; it means a structural global competitiveness transformation, portraying how policy-driven incentives together with industrial ecosystems can facilitate a rapid climb. With this blueprint led by mobiles now gaining momentum, other electronics floors such as laptops, networking equipment, and consumer electronics are ready to replicate the success, taking India one step further into becoming a global manufacturing powerhouse.

Governed jointly by the Centre for Development Studies and the Indian Cellular and Electronics Association (ICEA), the report intends to provide a clearer understanding of the effect of government policies on India’s electronics manufacturing sector.

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Introduction:

From basic timepieces to advanced wearables that improve daily life, smartwatches have undergone significant development. With features like heart rate monitoring, fitness tracking, smart notifications, and GPS navigation, smartwatches combine technology and fashion. Users of some models may even browse apps, send messages, and make calls right from their wrists. This article delves into 10 top smartwatch brands found in the German market.

1. Apple

Apple Inc. is an American multinational corporation that operates a technology company with its headquarters in Cupertino, California, USA. Apple offers a wide variety of devices like iPhone, iPad, MacBook, Apple Watch, and AirPods. Apple smartwatches are advanced wearable products that provide a combination of health monitoring, fitness functions, and easy connectivity. They comprise LTPO, OLED Retina displays, health monitoring, heart rate monitoring, sleep monitoring, and temperature sensing. Apple Watches feature activity rings, exercise workouts, GPS functionality, and water resistance. Newer versions are powered by Apple Silicon processors to provide improved performance.

2. Garmin

Garmin is a popular brand dealing in GPS technology and smartwatches. It has its business headquarters in Olathe, Kansas, USA. Garmin smartwatches are made for sporty types and outdoor enthusiasts, with features like AMOLED screens, heart rate monitoring, stress tracking, sleep monitoring, Pulse Ox measurement, and a wide variety of sports apps.  The vivoactive 6, for instance, boasts up to 11 days of battery life, while the Swim2 is designed for swimmers with GPS tracking and water resistance.

3. Samsung

Samsung is a South Korean multinational company with its base in Seoul, South Korea. Samsung offers a range of smartwatches dedicated to fitness tracking, health evaluation, and productivity improvements. The Samsung Galaxy Watch 7 comes in a 47 mm titanium case, a 3nm chipset and a 590mAh that is military-grade durable. The Samsung Galaxy Watch5 comes with a 1.4-inch Super AMOLED display and Exynos W920 processor. The different variants all offer unique features that address multiple tastes whether regarding style, health, or the convenience of day- to day needs.

4. Google

Google is an American multinational technology firm based at the Googleplex in Mountain View, California, U.S. It was established I 1998 by Larry Page and Sergey Brin. It has added a number of products such as Google Maps, Gmail, Chrome, Pixel devices, and Wear OS smartwatches to its portfolio over the years. Google sells smartwatches in its Pixel Watch series, which is based on Wear OS. The current models are the Pixel Watch 3, with AMOLED screens, 24 hours of battery life, Wear OS 5.0, and Fitbit-based health monitoring2. Google is also introducing Gemini AI to Wear OS smartwatches, overwriting Google Assistant with a superior AI-based assistant.

5. Fitbit

Fitbit is an American wearables technology company based in San Francisco, California, U.S. Founded in 2007 by James Park and Eric Friedman, Fitbit emerged as a fitness tracking device leader before it was acquired by Google in 2021. The company deals in smartwatches and activity trackers to track heart rate, sleep, steps, and general health parameters. Fitbit smartwatches, including the Versa 4, Sense 2, and Charge 6, come with AMOLED screens, onboard GPS, heart rate tracking, SpO2 monitoring, and stress management features.

6. Huawei

Huawei is a Chinese multinational technology firm headquartered in Shenzen, China. Huawei was established in 1987, and it deals I telecommunications, consumer electronics, and intelligent devices, such as smartphones and smartwatches. Models in the brand’s smartwatch series are the Huawei Watch Ultimate, which comes with a 1.5-inch LTPO AMOLED display, ECG monitoring, depth sensor and 10 ATM water resistance. Huawei smartwatches is recognised for their long battery life, AI driven health features, and high-end driven health features, and high-end designs, which make them favoured by fitness enthusiasts and tech-conscious consumers.

7. Polar

Polar is a Finnish company headquartered in Kempele, Finland, specializing in sports technology and fitness tracking. Founded in 1977, Polar known for its heart rate monitors, GPS sports watches, and advanced training analytics. The Polar Vantage V2 features a 1.2-inch AMOLED display, wrist-based heart rate monitoring, GPS, and advanced recovery tracking. The Polar Grit X Pro, built for outdoor adventures, offers military-grade durability, route guidance, and weather tracking. Polar smartwatches integrate AI-powered training recommendations, long battery life, and advanced sports metrics, making them ideal for fitness enthusiasts.

8. Suunto

Suunto is a Finnish-based company with headquarters in Vantaa, Finland, which deals in sports watches, dive computers, and precision instruments. It was founded in 1936 and has a reputation for producing strong outdoor smartwatches for athletes, adventures, and fitness enthusiasts. Suunto is an OS-based smartwatch with more than 70 sport modes, wrist-based heart rate, free offline outdoor maps, and Google Fit integration. Suunto smartwatches are designed for harsh conditions, with prolonged battery life, sophisticated fitness tracking, and outdoor navigation features.

9. Fossil

Fossil is an American fashion and accessory company with its headquarters in Richardson, Texas, U.S. Established in 1984, Fossil became famous for its fashionable watches, leather accessories, and smartwatches. The Fossil Gen 6 comes with a 1.28-inch AMOLED screen, Snapdragon Wear 4100+ processor, Bluetooth calling, GPS, and Spo₂ monitoring. The Fossil Gen 5 LTE includes a 45mm AMOLED screen, Android support, and LTE connectivity. Fossil smartwatches include Wear OS, watch faces, and fitness tracking, giving them a fashion-forward yet functional option.

10. Withings

Withings is a French consumer electronics firm based in Issy-les-Moulneaux, France. Established in 2008, Withings deals in health-oriented smart devices. Such as smartwatches, fitness trackers, and medical-grade wearables. Withings smartwatches put together medical-grade health monitoring, extended battery life and chic designs, presenting a perfect package for those desiring both fashion and functionality. ScanWatch horizon has a rotating stainless-steel bezel. ECG monitoring, Spo₂ tracking and 30-day battery life. ScanWatch is a clinically tested hybrid smartwatch with heart rate monitoring, sleep tracking, and a PMOLED display.

Specification:

Brand	Key Model	Display	Health Features	Battery Life	OS/Processor	Speciality
Apple	Watch Series 9	LTPO OLED Retina	Heart, sleep, temp, ECG	~18 hours	Apple Silicon	Seamless iOS integration
Garmin	vivoactive 6, Swim2	AMOLED / transf.	HR, sleep, Pulse Ox, stress	Up to 11 days	Proprietary OS	Sports,Outdoor GPS
Samsung	Galaxy Watch7/5	Super AMOLED	HR, sleep, body comp, ECG	40-80 hours	Exynos W920, 3nm chip	Military-grade build
Google	Pixel Watch 3	AMOLED	Fitbit health suite	~24 hours	Wear OS 5.0 + Gemini AI	Google ecosystem
Fitbit	Versa 4, Sense 2	AMOLED	HR, SpO₂, stress, sleep	6+ days	Fitbit OS	Affordable fitness
Huawei	Watch Ultimate	LTPO AMOLED	ECG, depth, sleep, HR	~14 days	HarmonyOS	Long battery + AI health
Polar	Vantage V2, Grit X	AMOLED	HR, GPS, recovery, weather	7+ days	Proprietary OS	Athletes, analytics
Suunto	Suunto 9 Peak Pro	AMOLED	HR, 70+ sport modes, GPS	~14 days	Proprietary OS + Google Fit	Extreme outdoors
Fossil	Gen 6, Gen 5 LTE	AMOLED	HR, SpO₂, fitness tracking	~24 hours	Snapdragon Wear 4100+	Fashion + Wear OS
Withings	ScanWatch, Horizon	PMOLED hybrid	HR, ECG, SpO₂, sleep	Up to 30 days	Proprietary hybrid	Medical-grade health

Conclusion:

Germany’s market for smartwatches is dominated by international technology giants, with Apple being the top most popular brand followed by Samsung. Although Germany is famous for having luxury mechanical watch manufacturers such as Sinn, NOMOS, A. Lange & Söhne, Glashütte has fewer indigenous smartwatch.

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Device Offers Knob Option for Easy Finger Setting, Variety of Pin Configurations in Top and Side Adjustment Styles

Vishay Intertechnology, Inc. introduced a new industrial-grade 3/8 inch square single-turn cermet trimmer. Available with an extended shaft, cross-slot rotor, or knob option for easy finger setting, the Vishay Sfernice M61 is offered in several pin configurations in both top and side adjustment styles to optimize placement on the PCB.

The device released, combines a wide 10 Ω to 2 MΩ resistance range with a temperature range from -55 °C to +125 °C and a low temperature coefficient of ± 100 ppm/°C. Fully sealed to withstand standard board wash processing, the M61 offers a 0.5 W power rating at +85 °C, making it ideal for industrial applications including welding equipment, power tools, and 3D printers, in addition to heating, cooling, and ventilation systems.

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The concept of self-driving cars has long fascinated the world, and in the last decade, this once-futuristic vision has begun taking tangible form on real-world roads. Backed by artificial intelligence, advanced sensor systems, and increasingly robust regulatory frameworks, autonomous vehicles are moving from prototypes to potential mainstream adoption. However, the question remains: Is the world truly ready for driverless cars?

As consumer sentiment evolves and the Self-driving Cars Market matures, industry leaders and policymakers must align innovation with public trust. In this blog, we’ll explore the current state of market potential, public readiness, technological advancements, and the barriers still standing in the way.

Consumer Perception: Trust Is Still Evolving

One of the biggest hurdles facing the Self-driving Cars Market isn’t technological—it’s psychological. Despite increasing awareness and media coverage, consumer trust in autonomous driving systems remains mixed.

According to various global mobility surveys, while many people express curiosity and even excitement about autonomous vehicles (AVs), a significant portion remains skeptical. Safety concerns, such as fear of accidents due to software glitches or hacking, rank among the top reasons for hesitation.

This sentiment is supported by recent studies, including those cited in Fairfield Market Research reports, which show that over 60% of consumers still prefer to be in control behind the wheel. Interestingly, younger demographics and tech-savvy consumers are more open to embracing driverless technology, signaling a gradual generational shift in acceptance.

Market Potential: A Multibillion-Dollar Industry in the Making

Despite consumer hesitations, the Self-driving Cars Market is poised for remarkable growth. According to Fairfield Market Research, the market is projected to grow exponentially over the next decade, driven by advancements in AI, LiDAR, radar, and 5G connectivity. From autonomous taxis and delivery vehicles to personal self-driving cars, this sector is brimming with transformative potential.

Forecasts indicate that the market could reach several hundred billion dollars in value by 2032, thanks to increasing investment by both automakers and tech giants. Companies like Tesla, Waymo, NVIDIA, Baidu, and General Motors are pouring billions into R&D, strategic partnerships, and road testing to get ahead of the curve.

What sets this market apart is its ability to serve a wide range of applications—from mobility as-a-service (MaaS) to long-haul trucking, ride-sharing platforms, and even emergency services. The convergence of self-driving capabilities with electrification is further fueling this trajectory, positioning autonomous EVs as the future of smart mobility.

Technology Advancements That Make Autonomous Driving Possible

The backbone of autonomous vehicles lies in a suite of intelligent technologies designed to mimic human perception and decision-making. These include:

• Advanced Driver-Assistance Systems (ADAS): Core to self-driving features like lane-keeping, adaptive cruise control, and emergency braking.
• LiDAR and Radar: Crucial for depth perception, obstacle detection, and maintaining 360-degree awareness.
• Machine Learning and AI: These enable real-time learning and predictive decision-making based on road conditions, traffic, and behavior of other drivers.
• 5G Connectivity: Enables ultra-fast communication between vehicles (V2V) and infrastructure (V2X), essential for safe navigation and traffic management.

Tech innovations continue to improve the reliability and scalability of autonomous driving systems. What was once limited to controlled environments is now being tested—and increasingly trusted—on busy city streets and highways.

Regulatory Landscape: Countries Taking the Lead

While technology marches forward, regulation remains a critical piece of the puzzle. Governments around the world are experimenting with frameworks to ensure the safe integration of AVs into public infrastructure.

The United States, through the National Highway Traffic Safety Administration (NHTSA), has issued federal guidance and pilot programs to promote innovation while safeguarding public welfare. Similarly, countries like Germany, Japan, and China are crafting regulatory sandboxes to foster autonomous mobility.

The European Union’s push for standardized vehicle safety norms and China’s rapid AV testing initiatives further demonstrate that the regulatory environment is evolving, albeit at different speeds across regions.

The harmonization of safety standards, liability protocols, and cybersecurity norms will play a major role in determining how quickly driverless vehicles move from limited trials to widespread adoption.

Urban Infrastructure and the Readiness Gap

Beyond consumer acceptance and regulatory progress, physical infrastructure plays a pivotal role in enabling the adoption of driverless vehicles. Smart traffic signals, connected roadways, digital mapping, and real-time traffic data are prerequisites for safe AV deployment.

However, most cities are still in the early stages of integrating such infrastructure. While some smart cities like Singapore, San Francisco, and Dubai are leading with AV-friendly road networks and IoT integration, the majority of the world still lags behind.

The readiness gap between developed and developing economies could pose a major challenge for the global adoption of autonomous vehicles. Investments in digital infrastructure, maintenance of road quality, and real-time data exchange capabilities will be crucial in bridging this divide.

Ethical Considerations and Data Privacy

With the rise of autonomous mobility comes a wave of ethical dilemmas. From decision-making in crash scenarios to potential bias in AI algorithms, the question of who is accountable when things go wrong is still murky.

Moreover, self-driving cars collect vast amounts of data—from location tracking and biometric identifiers to driving behavior. Ensuring data privacy and cybersecurity will be a top priority as the Self-driving Cars Market scales.

Consumer concerns about surveillance, hacking, and misuse of personal data must be addressed through transparent policies, encryption technologies, and government oversight.

Economic Impact and Job Disruption

As the market evolves, the ripple effects on employment and industry structures are inevitable. While autonomous vehicles will generate new job roles in software development, data science, and fleet management, they are also expected to disrupt traditional roles—especially in trucking, taxi services, and delivery.

Balancing automation with human employment is an area that governments, labor unions, and corporations must address proactively. Reskilling and upskilling the workforce will be essential to ensure a smooth transition to a more autonomous transportation ecosystem.

A Road Paved with Caution and Opportunity

So, is the world ready for driverless cars? The answer is complex. Technologically, we are closer than ever. From AI to vehicle connectivity, innovation has created a solid foundation. Yet public perception, regulatory clarity, infrastructure readiness, and ethical concerns still need time and effort to align.

The Self-driving Cars Market holds extraordinary promise, offering a future with safer roads, efficient traffic systems, and more accessible mobility options. But realizing this vision will require global collaboration between automakers, tech firms, regulators, and consumers.

As reported by Fairfield Market Research, the journey toward widespread adoption of autonomous vehicles is not a sprint but a marathon. The path ahead is filled with both promise and pitfalls—but with the right strategies in place, a driverless future is no longer just a dream.

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India has witnessed a remarkable 47% jump in the electronics exports during the April-June quarter of FY 26 to USD 12.41 billion as compared to the previous year. This surge testifies to the accelerated role India is assuming in global electronics supply chains and the execution of key strategic initiatives at the national level.

 Export Destinations:

United States: India accounted for 60.2% of electronics exports to the US, amounting to about USD 7.47 billion, thus rigidifying the US as the single largest electronics trade partner for India.

UAE: The UAE took the second position, with an 8.09% share (~USD 1.0 billion).

China: With 3.88% (~USD 482 million), China came third among electronics export destinations.

Others: The Netherlands, with shares of 2.68%, and Germany, at 2.09%, came below.

Factors Influential in Growth:

• Policy Push through PLI and Make in India

The government Production-Linked Incentive scheme and Make in India have been instrumental in encouraging electronics manufacturers, both domestic and international, to scale up operations and target exports. This has attracted investments into the sector through incentives, facilitating ease of doing business, and developing infrastructure.

• Export Boom in Smartphones

The big factor in the swell is India becoming a global hub for manufacturing smartphones. Local manufacturing is being ramped up by big brands, including Apple and Samsung, with iPhone itself witnessing a large share of electronics exports in Q1 FY26.

• Strategic Manufacturing Reshuffles

Global manufacturers diversify supply chains owing to geopolitical risks and China-centric disruptions. India has, on account of cheap labor, government supports, and budding technological capabilities, been emerging as a preferred destination for electronics assembly.

• Expansion of Export Markets

India’s electronics exports are now entering new markets beyond the traditional West. The increase in shipments to the UAE, China, the Netherlands, and Germany is indicative of India’s effort to diversify its export portfolio and reduce dependence on any one country.

• Private Sector Momentum

Indian businesses and foreign OEMs operating in India have seen a sharp rise in their manufacturing capabilities. Better supply chains, logistics systems, and quality improvements have made Indian electronics more competitive in international markets.

Broader Export Context:

The electronics boom forms part of a bigger export rush:

• Textiles & Apparel: Ready-made garment exports stood at USD 4.19 billion in Q1 and continued their upward movement.
• Seafood: This sector saw shipment increases of 19.45% to USD 1.95 billion during the same quarter.
• These factors underpin total merchandise and services exports standing at nearly USD 210 billion, out of which exports of goods were nearly USD 112 billion in Q1-my assert 5.9% growth on a year-against-year basis.

Strategic Implications:

• Position India as a Global Electronics Hub: A 47 percent increase in exports indicates India’s emergence as a plausible alternative to China in global electronics manufacturing, pointing towards growing international faith in India’s production ecosystem.
• Enhancement of Domestic Manufacturing and Jobs: The growth in exports indicates a rise in domestic manufacturing capacities. This in turn increases India’s GDP and helps open entry-level employment opportunities in states such as Uttar Pradesh, Tamil Nadu, and Karnataka.
• Strengthening Bilateral Trade: With the United States re-exporting over 60 percent of all electronics, the data showcases strengthened ties between strategic partners. Such alignment should pave the way for greater collaboration in technology, supply chains, and innovation.
• Another factor: The surge in exports has portrayed India as a destination in the eyes of PLI-type schemes and Make in India, thereby emboldening policymakers and investors to consider India a manufacturing hub.
• Widening their export marketplace: With export growth increasing in the UAE, China, and Europe, the rising trends attest to India’s entry into diversified markets, lessening the country’s over-dependence on any single region and offering trade-related resilience.

Future Outlook:

Looking ahead, India intends to capitalize on momentum through:

• Further extension of PLI to semiconductors and value-added electronics.
• Enhanced quality standards and export logistics.
• Greater entry into overseas markets, especially Europe and emerging economies.

Conclusion:

While scaling-up views for semiconductor fabrication, further diversification of export markets, and sustained competitiveness on the global front continue to pose challenges, the Q1 trajectory is signaling that India stands ready for taking bigger roles in global electronics trade. India’s 47% annual growth in electronics exports attests to its coming-of-age stellar performance synergized by the global manufacturing center. The sector-fueled by solid policy, growing markets, and production capacity-on a steady footing uphill. India is well on its way to become a major participant in the global electronics value chain with sustained investment and support.

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By: STMicroelectronics

Over the years, ST has multiplied the AutoDevKit development boards for motor control applications in cars, which all have a name that starts with “AEK-MOT”. There are general systems like the AEK-MOT-2DC40Y1 for driving three DC motors, the AEK-MOT-3P99081 for brushless motors, and the AEK-MOT-SM81M1 for stepper motors. There are also more targeted approaches like the AEK-MOT-TK200G1 for powered liftgates or the AEK-MOT-WINH92 for powered windows. The reason behind this broad range of solutions is that engineering needs in cars are changing, and as applications become varied, so must the solutions that address them. Let’s explore how those who make cars are looking at them differently.

How the car has changed Challenge 1: Application diversification The AEK-MOT-2DC40Y1

While many talk about the electrification of cars or the advent of AI in vehicles, there’s one trend that many overlook. In a span of a couple of decades, vehicles went from having about ten or so motor control applications to close to 50, and we are going to reach a hundred in a few years. The reason is simple: as cars become more digital, replacing a basic mechanical system with a motor control application means greater safety and the ability to add smart features. There are popular examples, such as powered windows, doors, or trunks. There are also systems that many drivers are oblivious to, like active suspensions, electric braking and power steering, EV drivetrains, new actuators, and more.

Challenge 2: Architectural transformation

Moreover, the underlying foundation of the car itself is going through a major shift as many adopt a zonal architecture. In essence, it means that engineers organize electric control units based on their zone or physical location instead of just grouping similar features together. It has the advantage of simplifying designs. In some cases, moving to a zonal architecture helped reduce the overall harness weight by 20%. It also means that engineers can use much more powerful computing systems, leading engineers to use an even more diverse range of motor control applications as they infuse artificial intelligence in more parts of the car.

The need for new motor control applications The AEK-MOT-3P99081

This trend comes with two significant challenges. The first one is that as more diverse applications use motor control systems, OEMs need different motor drivers and motor types. Some also wonder whether they need an integrated or non-integrated solution. Simply put, as the kinds of applications become more varied, teams struggle to find new solutions to meet their needs. The second challenge is that designers are looking at cars differently. The move to zonal architectures means that more diverse systems must easily interact with one another. Put simply, teams are increasingly looking at the vehicle as a whole rather than the sum of its parts, and they need solutions that can meet this new global vision.

AEK-MOT or how to keep up with the changes A comprehensive ecosystem

Another challenge is that each automated component must talk to the central unit, which means dealing with numerous interfaces. Currently, some systems prioritize SPI, while others use LIN, CAN, 100BASE-TX, 10BASE-T1S, or something else entirely. As engineers look at the car more globally, they are demanding motor control systems that can work with both new and existing interfaces. How a motor control application implements these systems also matters. Are they integrated or not? Does the SDK make one more accessible than the others, and can abstraction layers help solve these issues? This is why our AutoDevKit ecosystem includes varied development boards and a software library to take advantage of them more easily.

Furthermore, to enhance the transition towards software-defined vehicles (SDV), ST has developed an additional AutoDevKit functional block, AEK-COM-10BASET, that acts as a gateway between the legacy protocols found in most motor driver ICs and the new trendy 10BASE-T1S. The latter is a key building block for the new Remote Control Protocol (RCP) specification currently in progress (Open Alliance – TC18 Remote Control Protocol), which uses native Ethernet frames on 10BASES-T1S for deterministic performance. In essence, RCP is an intermediary between the Ethernet physical interface and SPI or I2C to access registers or talk to the microcontroller.

Non-integrated The AEK-MOT-SM81M1

The AEK-MOT-2DC40Y1 can drive up to three DC motors, two bi-directional in parallel or three with proper sequencing. It features VN7 high-side switches and the VNH704AY integrated H-bridge motor driver. The documentation shows how to set up the motors and the configurations available. Additionally, developers can use the graphical user interface in AutoDevKit to manage rotation direction, start them, increase or decrease their speed, and more. The AEK-MOT-2DC40Y1 connects to an SPC5 MCU board, meaning integrators can rapidly design a proof-of-concept. Similarly, the AEK-MOT-SM81M1 also connects to an SPC5 board but features the L99SM81V stepper motor driver, while the AEK-MOT-WINH92 for window lifts uses the L99H92.

Integrated

The AEK-MOT-3P99081 focuses on CAN-controlled brushless motors. It is an integrated solution with an SPC560P microcontroller and the L9908 gate driver. The MCU talks with the driver through an SPI interface for easy access to configuration options, protection features, and diagnostic messages. Similarly, the AEK-MOT-TK200G1 for powered liftgate runs on the SPC582B60E1 microcontroller and the L99DZ200G drivers, which supports LIN and HS-CAN interfaces for MCU programming during production. Developers talk to the board using a CAN bus to make it easier to access the motor remotely, meaning from another domain controller. Avid readers will remember it was at the center of our AEKD-TRUNKL1 demo.

The AEK-MOT-WINH92

All in all, the comprehensive aspect of the AutoDevKit ecosystem means that the learning curve gets easier as teams use different AEK-MOT development boards. They get a range of integrated and non-integrated solutions that all work together under one ecosystem. As a result, everyone, from the decision-makers to the engineers building the platform, can more easily look at the car as a whole and see how all its components can come together under one overarching system. This means that ST is uniquely positioned to become a one-stop shop as more and more motor control applications transform vehicles.

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• New license agreement enabling the proliferation of metasurface optics across high-volume consumer, automotive and industrial markets: from smartphone applications like biometrics, LIDAR and camera assist, to robotics, gesture recognition, or object detection.
• The agreement broadens ST’s capability to use Metalenz IP to produce advanced metasurface optics while leveraging ST’s unique technology and manufacturing platform combining 300mm semiconductor and optics production, test and qualification.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and Metalenz, the pioneer of metasurface optics, announced a new license agreement. The agreement broadens ST’s capability to use Metalenz IP to produce advanced metasurface optics while leveraging ST’s unique technology and manufacturing platform combining 300mm semiconductor and optics production, test and qualification.

“STMicroelectronics is the unique supplier on the market offering a groundbreaking combination of optics and semiconductor technology. Since 2022, we have shipped well over 140 million metasurface optics and FlightSense modules using Metalenz IP. The new license agreement with Metalenz bolsters our technology leadership in consumer, industrial and automotive segments, and will enable new opportunities from smartphone applications like biometrics, LIDAR and camera assist, to robotics, gesture recognition, or object detection,” underlined Alexandre Balmefrezol, Executive Vice President and General Manager of STMicroelectronics’s Imaging Sub-Group. “Our unique model, processing optical technology in our 300mm semiconductor fab, ensures high precision, cost-effectiveness, and scalability to meet the requests of our customers for high-volume, complex applications.”

“Our agreement with STMicroelectronics has the potential to further fast-track the adoption of metasurfaces from their origins at Harvard to adoption by market leading consumer electronics companies,” said Rob Devlin, co-founder and CEO of Metalenz. “By enabling the shift of optics production into semiconductor manufacturing, this agreement has the possibility to further redefine the sensing ecosystem. As use cases for 3D sensing continue to expand, ST’s technology leadership in the market together with our IP leadership solidifies ST and Metalenz as the dominant forces in the emergent metasurface market we created.”

The new license agreement aims to address the growing market opportunity for metasurface optics projected to experience significant growth to reach $2B by 2029*; largely driven by the industry’s role in emerging display and imaging applications. (*Yole Group, Optical Metasurfaces, 2024 report)

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Sulagna Adhikary (R&D at Keysight ATI)

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HENXV announced its latest range of innovative products designed to elevate system performance and reliability: AC/DC Converters, DC/DC Converters, and Bus Transceiver Modules.

New Products:

1. AC/DC Converters: It delivers stable power conversion with high efficiency, compact designs, and robust safety features, ideal for Industrial Automation, Medical, IoT, Electric Vehicles, and many more.

2. DC/DC Converters: Offering precise voltage regulation and high power density, these converters are built to support demanding applications, ensuring reliable performance in telecommunications, automotive, renewable energy, and many more.

3. Bus Transceiver Modules: Designed for seamless data communication, these transceiver modules provide high-speed, low-latency performance with compatibility across industry-standard protocols, perfect for IoT devices, industrial networks, etc.

Why Choose HENXV?

Reliability and Quality: Rigorously tested to ensure durability and consistent performance.
Customizable Solutions: Tailored options to meet specific project requirements.
Dedicated Support: A team to provide technical assistance and ensure smooth integration.
Warranty: 3 years of warranty on all products.
Certifications: All products certified with CE, ROHS, and REACH.

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Introduced in 2015, eCall, an automated vehicle emergency call system, has been a mandatory requirement for all new cars sold within the European Union since 2018. However, as 2G/3G circuit-switched cellular networks become obsolete, emergency call systems will need to be adapted to 4G/5G packet-switched cellular networks. The European Commission has defined in its most recent regulation that NG eCall will be obligatory starting January 1, 2026. This standard establishes guidelines for testing eCall systems over IP Multimedia Subsystem (IMS) networks, including advanced 4G LTE and 5G NR technologies. Consequently, to incorporate the new NG eCall features in eCall modules, the automotive industry will require NG eCall testing solutions.

The Snapdragon Auto 5G Modem-RF is a 5G automotive-grade platform that has paved the way for next-generation connected vehicles, delivering high-speed connectivity, advanced positioning, and support for Vehicle-to-Everything (V2X) technology. Designed to meet the demands of modern telematics, it supports reliable connectivity, precise multi-band GNSS navigation, and enhanced safety.

Through this joint effort, Rohde & Schwarz and Qualcomm Technologies have successfully verified the compliance of the Snapdragon Auto 5G Modem-RF’s NG eCall functionality with the most recent eCall standards. The verification process employed the Rohde & Schwarz CMX500 mobile radio tester, a comprehensive testing solution for NG eCall including voice and data transmission. This rigorous test, which was simulating a Public Safety Answering Point (PSAP), validated the compliance of the implementation at both ends with the EN 17240:2024 standard. Moreover, the CMX500 supports both 4G and 5G technologies, aiming to provide that the solutions are future-proof.

“We are pleased to have joined forces with Qualcomm Technologies on the verification of their chipsets’ NG eCall implementation,” said Juergen Meyer, Vice President Market Segment Automotive at Rohde & Schwarz. “This collaboration sets a new benchmark for the future of emergency call services, providing the automotive industry a robust and dependable solution to meet the latest eCall standards.”

As a highly versatile tool, the CMX500 with the CMX-KA098 software option can be effectively used for NG eCall testing under realistic network conditions.

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Addressing the 14th convocation of IIT Hyderabad, Union Minister Ashwini Vaishnaw declared a landmark achievement. India’s electronics exports have surpassed USD 40 billion an incredible eight-fold increase in just 11 years. The production of electronics within India grew six-fold during the same timeframe, a factor that lends credence to the manufacturing capability of the nation.

Important Highlights from Vaishnaw’s Address:

Exports & Production Growth: Electronics production has grown 6× and the exports 8× during the last 11 years, sustaining double-digit CAGR.

Semiconductor Ambitions: The commercial production of the first Made-in-India semiconductor chip is expected to be seeded by the end of this year. India aspires to become one of the top five semiconductor countries in the near future.

Telecom Stack Success: A fully indigenous 4G telecom stack was created in just 3½ years and is now powering ~90,000 towers, more than the networks in many countries.

5G Labs & Talent Building: The government has rolled out 100 5G labs, having distributed EDA tools from Cadence, Synopsys & Siemens to over 270 colleges and institutions (including startups, the number increases to 340) for the fostering of semiconductor design talent.

Infrastructure Boost: Vaishnaw also discussed the quick development of Mumbai-Ahmedabad, India’s first bullet train, which is expected to start operations in August or September 2027.

These achievements highlight the Modi government’s efforts to create a self-sufficient electronics ecosystem that includes chip design, telecommunications, and semiconductor manufacturing under the Make-in-India project.

The electronics export stood at an estimated USD 12.41 billion in Q1 FY26 (April-June), with year-to-year growth clocking an impressive 47%. The chief markets for Indian electronics export were the United States (60.2%), the UAE (8.1%), and China (3.9%), marking India’s ascension on the global map of electronics manufacturing.

The growth in Q1 confirms India’s status as a developing center for electronics production and makes a significant contribution to the USD 40 billion annual export milestone.

The Significance of This Leap:

1. Global Market Integration: Dominance of markets like US, UAE, and China signals deeper integration of India into global supply chains.
2. Security and Self-Reliance: Indigenous telecom stack and semiconductor push furthers the national security and reduces import dependency.
3. Job Creation and Skill Building: Economic boom arising from semiconductors, EDA labs, and 5G infrastructure projects is creating demand for skilled professionals.
4. Strategic Infrastructure Synergy: By collaborating with major projects like telecom, railroads, and bullet trains, the growth of electronics supports national modernization

Conclusion:

Rising electronics exports in India with the scaling-up of manufacturing processes crystals the evolution of a manufacturing ecosystem aligned with the Make-in-India initiative. The assurance of indigenous semiconductors, solid telecom backdrop, and a talent pipeline pave India’s way as an electronics and technological hub across the world.

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The signing of the MoU by Tata Electronics and Robert Bosch GmbH stands as a landmark in the electronics and semiconductor manufacturing industries, significantly marking a major achievement in India’s journey toward attaining self-reliance.

A Strategic Duo:

Under this MoU, the parties will cooperate on semiconductor chip packaging and manufacturing, which concern the latter part of the semiconductor supply chain after wafer fabrication. The projects shall be undertaken at Tata Electronics’ assembly-and-test plant in Assam near completion and at its semiconductor foundry in Gujarat.

Assam: Tata Electronics is setting up the ₹27,000 crore, 600-acre semiconductor assembly and test facility in Jagiroad. Commercial operation of the plant will commence in mid-2025 and will entail advanced packaging technologies with a production capacity of 41 million chips per day.

Gujarat: Tata is executing the construction of its first fab in the Dholera Special Investment Region worth ₹91,000 crore, with support from Taiwan’s Powerchip, which will be used for large-scale production of 50,000 wafers per month starting around 2026.

This initiative jointly puts the strengths of each partner category to use: aggressive investments made by Tata across design, assembly, and test, fabrication, and packaging,” and Bosch’s deep expertise in packaging technologies and its position as a long‑time global supplier of automotive electronics.

Strengthening India’s Auto & Electronics Ecosystem

Beyond chip processing, the collaboration is intended to be widened into EMS space for the automotive industry, an area rapidly soaring as vehicles themselves become electrified and digitized.

For Tata, this alliance clearly steps into its layered approach: prior MoUs with Bharat Electronics Limited (BEL) on chip design, with Powerchip Semiconductor and with Himax Technologies on display-chip manufacture signaling an ambition to head in fab-to-front-end packaging.

India Semiconductor Leap: What This Alliance Brings

1. An integrated chip supply chain: The MoU is a signal for moving towards a vertically integrated semiconductor network-from chip fab to packaging and system implementation-anchored within India.
2. Job creation & Regional growth: Thousands of direct and indirect job opportunities will be created, more so for the backward regions like Assam where indu will be fast.
3. Global cooperation: The agreement reflects global confidence in India’s manufacturing potential—joining forces with an engineering giant like Bosch intensifies that signal.
4. Auto‑tech transformation: As vehicle electronics grow more sophisticated—covering sensors, advanced driver assistance, power management, and connectivity—this alliance prepares India to be a hub for innovation in mobility.

Path Ahead & Prospects:

Looking ahead, Tata Electronics plans to ramp up its Gujarat line for large‑scale wafer production by 2026 and expand its packaging & test unit in Assam. Bosch may also deploy its global packaging tech like 3D packaging helping India cross into advanced nodes and complex system‑in‑package offerings.

This collaboration stands as a cornerstone for India’s semiconductor journey where strategic investments, policy support, and global partnerships could coalesce into a self‑sustaining, world‑class semiconductor economy.

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Nuvoton will emphasize cloud computing applications at OCP APAC 2025. Nuvoton will showcase cloud computing silicon solutions for M-PESTI, eBMC nu.RoT, Multi-nodes controller, and computing/server ASIC/MCU. The OCP APAC Summit 2025 will take place from August 5-6, 2025, in Taipei, Taiwan.

MCU TF5103Y: M-PESTI target MCU based on DC-MHS

The TF5103Y is a Cortex-Arm M0 32-bit microcontroller that can run the M-PESTI target solution. The small package QFN32 4x4mm is easy to design in the limited layout space of a sideband card, especially in M-SDNO or 1U module systems for rack systems. The M-PESTI target solution on TF5103Y passed the Intel server lab and is already in mass production. And this solution can be compatible with Altera and Lattice systems.

eBMC NCT6694B: nu.RoT builds a security core for your system

ASRock, in collaboration with Nuvoton, has unveiled the world’s first lightweight server motherboard powered by the Nuvoton eBMC (NCT6694B) chip, designed to build a secure and trusted system core. The board includes many functions, such as enabling remote management, system monitoring, and BIOS updates. Tailored for cloud and edge applications, it delivers a high-efficiency and stable security framework. With the u.RoT architecture reinforces a robust trust chain from system boot to runtime, making security the default.

Multi-nodes: Powerful management framework based on BMC-SMC Integration

Considering that the server system architecture is becoming increasingly complex, we now face some problems that require discussion for Multi-Node Scalability to resolve them. For example, the number of cores in Host CPUs is growing, which means platforms are moving from dual/quad sockets (shared memory) to multi-node solutions. Furthermore, OCP partners are looking forward to the Multi-node management on following DC-SCM3.0.

With Nuvoton’s BMC and SMC solution, the USB tunnels over MCTP are ready for UART/SOL, MMBI/ VW, Telemetry, etc.

MCU M2354: RoT on Microcontroller

NuMicro M2354 is a 32-bit Arm Cortex-M23 microcontroller featuring TrustZone technology. Supporting compact WLCSP49 package, it is ideal for resource-constrained devices that cannot accommodate a full TPM. M2354 integrates Secure Boot with DICE architecture in Mask ROM and is in mass production, delivering a lightweight, deployable Root of Trust for modular server and IoT systems.

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Automotive Grade Device Delivers Luminous Intensity to 2800 mcd, Enables Every Color Within the Gamut Triangle Inside the CIE 1931 Color Space

Vishay Intertechnology, Inc. introduced a new tricolor LED that provides luminous intensity to 2800 mcd at 20 mA for interior automotive lighting, RGB displays, and backlighting. Featuring separate anode and cathode connections for the red, green, and blue LED chips inside its compact 3.5 mm by 2.8 mm by 1.4 mm PLCC-6 surface-mount package, the Automotive Grade VLMRGB6122..enables individual control of each chip, making it possible to realize every color within the color room defined by the gamut triangle area inside the CIE 1931 color space through color mixing.

With its wide color range, the Vishay Semiconductors LED released, is ideal for ambient lighting, switch illumination, status indicators, and dashboard signal and symbol illumination in automobiles; large-format, full-color message and video display boards; backlighting in consumer devices, home appliances, medical instrumentation, and telecom equipment; and a wide range of accent and decorative lighting. For these applications, the device utilizes the latest high brightness AllnGaP and InGaN technologies to deliver 70 % higher brightness than previous-generation solutions in a package with a 22 % lower profile than competing products.

Providing high reliability, the VLMRGB6122..offers a wide temperature range from -40 °C to +110 °C, which is 25 °C higher than standard solutions, and Class B1 corrosion robustness. The LED is AEC-Q102 qualified, offers a Moisture Sensitivity Level (MSL) of 3, and withstands ESD voltages up to 2 kV for red and 8 kV for blue and green in accordance with JESD22-A114-B. RoHS-compliant, halogen-free, and Vishay Green, the device is compatible with IR reflow soldering and categorized per reel for luminous intensity, color, and forward voltage.

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In an exclusive interview with ELE Times, Mr. Brahmanand Patil, President & Managing Director of Vector Informatik India Pvt. Ltd., shed light on how Vector is driving the transformation of aerospace networks. The conversation ranged from TSN adoption to state-of-the-land cybersecurity, FACE compliance, and digital twins, with Vector sharing some insights about the technologies driving the current aerospace platforms. Excerpts.

ELE Times: What Vector is seeing in aerospace in the latest trends in the implementation of Time Sensitive Networking (TSN)?

Brahmanand Patil: We are seeing a growing adoption of Ethernet-based TSN for deterministic, synchronized, high-bandwidth avionics data. Aerospace OEMs increasingly prefer TSN over legacy buses (e.g., ARINC 429/FIBRE) to meet scaling demands for data communications among flight control, sensors, and mission systems.

At Vector, we are responding to this shift with TSN support in test tools, enabling aerospace developers to validate deterministic timing, redundant paths, and strict QoS behaviors on Ethernet.

ELE Times: How do Vector tools like CANoe.AFDX and VN interface hardware assist in testing high-reliability aerospace communication systems?

Brahmanand Patil: Reliability is non-negotiable in aerospace—and our tools are designed with that in mind. CANoe.AFDX supports simulation and conformance testing of AFDX (ARINC 664) and Ethernet-based avionics networks. It can inject faults, simulate redundant virtual links, verify timing requirements, and validate configuration against STDs like DO-160.

VN interface hardware like VN1600, VN5610 enables real-time physical-layer interaction, traffic generation, and measurements over Ethernet/AFDX/TSN. This lets engineers capture jitter, latency, packet errors, and link redundancy performance in real aircraft or Hardware-In-Loop (HIL) setups. These tools ensure avionics comms meet stringent reliability and timing metrics.

ELE Times: How does Vector support the development of software for FACE-compliant avionics platforms?

Brahmanand Patil: Vector’s toolchain integrates with model-based development (Simulink, SCADE, etc.) and supports code generation tailored to FACE Technical Standard running on POSIX or specialized FACE OS platforms. CANoe’s test framework can simulate face component interfaces, verify misuse cases, and perform regression testing across FACE segments: Safety-critical, Portable, and I/O.

Vector also enables integration testing in multi-vendor FACE environments, ensuring interoperability and that interfaces meet FACE conformance.

ELE Times: How is Vector integrating cybersecurity features (like secure communication or authentication) into its tools for aerospace applications?

Brahmanand Patil: At Vector, cybersecurity is not an afterthought—it’s embedded into the DNA of our tools for avionics. Our solutions enable rigorous testing and validation of secure communication protocols such as TLS, DTLS, IPsec, and secure extensions of AFDX. Using CANoe, aerospace developers can simulate and verify handshake mechanisms, certificate-based authentication, encryption throughput, and resilience against protocol-level anomalies.

Our network interfaces, including VN adapters, support precise packet-level timestamping and real-time capture of secure traffic—empowering developers to assess encryption overhead and identify tampering or injection attempts.

To further strengthen avionics systems, CANoe integrates powerful cyber-attack simulation capabilities like fuzzing, allowing stress testing against DoS, replay, and malformed packet attacks in Ethernet or AFDX-based networks.

On the software assurance front, VectorCAST delivers high-integrity testing across all development phases—from unit to system-level—aligned with DO-178C and DO-330 guidelines. With its data/control coupling analysis, VectorCAST ensures that inter-component communication adheres strictly to intended interfaces, helping eliminate side-channel risks and unauthorized data paths.

For static code analysis, PC-lint Plus acts as a robust SAST (Static Application Security Testing) tool. It enables early detection of vulnerabilities such as buffer overflows, memory corruption, and unsafe typecasts, aligned with industry standards like CWE, CERT C, MISRA, and AUTOSAR—minimizing attack surfaces in mission-critical avionics code.

By combining simulation, attack emulation, runtime monitoring, and static analysis under one roof, Vector provides aerospace engineers with an integrated platform to design, validate, and secure next-generation embedded systems.

ELE Times: What advancements is Vector making in cybersecure data communication in avionics networks?

Brahmanand Patil: Vector is enhancing its toolset with secure gateway emulation—including cybersecurity policies, firewall rules, and key-management scenarios—aligned with industry standards like DO-326A/ED-202A.

They’re also enabling encrypted redundant TSN path validation, where tools simulate failover in secure real-time Ethernet environments.

Support for capturing PHY-level anomalies, example ARINC 429 vulnerabilities hints at path toward intrusion detection, signal anomaly capture, and side-channel audit—it aligns with academia’s move toward voltage-based IDS

On the software side, Vector integrates Common Weakness Enumeration (CWE) into its PC-lint Plus static analysis tool. This enables early detection of critical vulnerabilities such as buffer overflows, memory mismanagement, and logic flaws—common risks in avionics data communications. Catching such issues early in development is vital for maintaining the integrity of flight-critical systems.

PC-lint Plus further acts as a Static Application Security Testing (SAST) solution aligned with DO-178C objectives. It supports high-integrity development through structural code analysis and enforces compliance before integration phases.

To ensure industry-grade secure coding, PC-lint Plus supports coding standards including:

• CERT C – Secure programming practices.
• MISRA C/C++ – Reliable and safe coding for critical systems.
• AUTOSAR C++14 – Standardized architecture for embedded automotive and avionics platforms.

Together, these capabilities enable aerospace developers to build secure, interoperable, and standards-compliant communication systems that are resilient against modern cybersecurity threats.

ELE Times: How does Vector leverage digital twin technologies in aerospace network validation?

Brahmanand Patil: The capabilities of CANoe and Interface hardware offer high-fidelity virtual replication of avionics networks; this effectively serves as a digital twin.

Through link-level simulation (AVIONICS + TSN), fault injection, deterministic latency modeling, and integration with physical hardware in HIL (hardware-in-the-loop) configurations, Vector supports the same iterative validation, anomaly detection, and real-time monitoring goals touted in digital twin use cases.

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Keysight Technologies held its flagship Keysight World Tech Day India on July 8, 2025, at The Leela Palace, Bengaluru, bringing together CXOs, engineers, researchers, and innovators from the electronics and high-tech sectors. The event showcased key technologies shaping the future across multiple industries including telecom, AI, and automotive, offering attendees expert-led sessions, live demonstrations, and in-depth technical tracks designed to accelerate innovation and market readiness in a rapidly evolving technology landscape.

The event also highlighted four key domains shaping the future of technology: 6G and Wireless, AI Infrastructure, Automotive, and AI Networks. Industry experts joined Keysight to explore AI-native 6G networks, THz communication, non-terrestrial networks (NTN), and digital twin-based design for ultra-fast, intelligent connectivity. Experts also discussed advancements in AI infrastructure highlighting compute fabrics, chiplets, optical interconnects, memory, and PCIe Gen7, which are critical enablers of next-gen AI. The automotive segment covered EV battery testing, V2X, autonomous driving, and cybersecurity for smarter mobility and finally AI Networks focused on network emulation, multi-cloud testing, and cybersecurity validation.

Keysight World Tech Day India 2025 brought together professionals from companies working on deep tech offering a unique platform for networking, knowledge sharing, and experiencing next-gen innovations that empower the electronics and high-tech community to stay ahead in a complex ecosystem.

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ANRITSU CORPORATION announced the successful verification and support of 3GPP RAN5 Rel-17 NR NTN test cases on its 5G NR Mobile Device Test Platform ME7834NR.

Non-terrestrial Networks (NTNs) are wireless communication systems that operate above the Earth’s surface, utilizing platforms in the air and in Earth’s orbit. These platforms include satellites in Low Earth Orbit (LEO), Medium Earth Orbit (MEO), and Geostationary Orbit (GEO).

3GPP Release 17 introduces “NR NTN” – the inclusion of Non-Terrestrial Networks into the 5G New Radio (NR) standards. This advancement enables 5G devices to connect to satellites using the same protocols as terrestrial base stations, paving the way for global 5G coverage beyond traditional infrastructure.

“Anritsu support for NR NTN test cases will enable ubiquitous connectivity for uninterrupted mobile data, voice and messaging—anywhere on Earth empowering individual users, businesses and industries that need to be connected with always-on access,” said Yokoo Daizaburo, General Manager of Mobile Solutions Division at Anritsu Corporation.

The conformance tests are defined by 3GPP in TS 38.523-1 and aligned with the core requirements in TS 38.331. These tests have been submitted by Anritsu to 3GPP’s Radio Access Network Working Group 5 (RAN WG5).

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Power electronics lie at the center of the revolution taking place in the mobility sector. With the world mobility trend moving towards electrification, power electronics have found their place as a foundation technology with efficient energy conversion and management in hybrid electric vehicles (HEVs) and electric vehicles (EVs). To enhance efficiency, reliability and sustainability, power electronics are integral to hybrid transportation systems and electric vehicles.

Advancements in Automotive Power Electronics

The automotive industry faces a transformation with the advent of high-profile power electronics, improving EVs for efficiency, safety and energy management. Perhaps WBG semiconductor adoption is unique, especially that of silicon carbide and gallium nitride. These materials present switched speeds triple that of silicon, with low losses and fairly high thermal endurances that allow physically much smaller and rugged designs. SiC finds use mainly in high-voltage traction inverters and onboard chargers to the extent that 800V+ architectures are employed for ultra-fast charging and enormous range, while GaN cashes in with DC-DC converters and onboard chargers for an efficiency higher that 96%.

IPMs can be considered another game-changing technology as they package and integrate high-voltage switches, gate drivers and protection circuits into a compact, thermally optimized package waterproofing the simplifying set of design parameters for the EV powertrain.

Bidirectional power conversion is what is required for vehicle to grid (V2G) and vehicle to home (V2H) working using DAB and CLLC resonant converters. These achieve efficient transfer of energy while safeguarding the EV platform in a forward-looking perspective. Solid-State Transformers introduce megawatt charging for electric vehicles, interfacing compatibility and with dynamic power facilitation.

Contention is with the battery technical part: Next-gen Battery Management Systems incorporate AI, auto-diagnostics and edge computing for real-time health monitoring, predictive maintenance and adaptive balancing, Furthermore, 48 V power electronics provide an edge to mild hybrids and ADAS by relieving loads from 12 V architecture while powering electric turbochargers and active chassis systems. This kind of innovation is placing energy ecosystems at the smart and connected core of EVs for greater performance, reliability and efficiency in the future of mobility.

The Future of mobility is being rewritten by the rise of electric vehicles (EVs) and power electronics are at its core. At the core of the metamorphosis, another transformation is upon the world: Infineon Technologies AG, a leading power semiconductor company. Infineon inculcates a new benchmark of performance, reliability, energy efficiency with its 800V traction systems, up to bidirectional charging and battery management. Speaking with two senior executives ELE Times sought exclusive insights into the changing function of power electronics in e-mobility:

Together they offered thorough observations on recent developments in wide-bandgap semiconductors, smart gate drivers, battery management systems and EV charging technologies influencing the future of sustainable transportation.

ELE Times: What are the latest developments in SiC (Silicon Carbide) and GaN (Gallium Nitride) power devices for EV applications?

Martin Spiteri & Dr Kok Wai Ma: GaN-based on-board chargers and DC-DC converters in electric vehicles will contribute to a higher charging efficiency, power density, and material sustainability, with a shift towards 20 kW+ systems. Infineon is now introducing a trench-based superjunction (TSJ) SiC technology concept. The combination of trench and charge-compensating superjunction technology enables higher efficiency and more compact designs – an important step for applications requiring the highest levels of performance and reliability. The first products based on the new technology will be 1200V in Infineon ID-PAK package for automotive traction inverters. This scalable package platform supports power levels of up to 800 kW. Key benefits of the technology include increased power density, achieved through an up to 40 percent improvement in RDS(on)*A. The 1200 V SiC trench-superjunction concept in ID-PAK package enables up to 25 percent higher current capability in main inverters without compromising short-circuit capability. Together with high-end SiC solutions, GaN will also enable more efficient traction inverters for both 400 V and 800 V EV systems, contributing to an increased driving range.  The use of GaN-based power semiconductor in EV traction is a topic of intense research and development.

ELE Times: What technologies in gate drivers and power management ICs are advancing high-voltage systems?

Martin Spiteri & Dr Kok Wai Ma: Infineon gate driver ICs covering the usage of MOSFET, IGBT, and SiC in automotive 12 V to 1200 V applications with built-in protection and diagnosis. We have gate drivers which are with ISO 26262-compliant for safety critical applications in addition to isolated gate driver ICs for HV EV applicationsproviding galvanic isolation for automotive applications above 5 kW such as the traction inverter, DC-DC converter and onboard charger and support IGBT and SiC technologies up to 1200 V. Recently introduced gate drivers to replace relays and standard fuses and provide additional protection and diagnostic functions. They increase the reliability of the power net thanks to fast fault isolation in less than 100 µs, additional diagnostics, and improved protection functions like integrated wire protection.

• Infineon’s OPTIREG PMIC products are power management integrated circuits consisting of integrated, multi-rail supply solutions for demanding automotive systems in segments such as body, power distribution, chassis, ADAS, infotainment, powertrain electric drivetrain featuring ISO 26262-compliance, Boost capability, Pre/post-regulator architecture and Multiple voltage rail supplies.

ELE Times: What new technologies in bidirectional power converters are boosting EV charging and regenerative braking capabilities?

Martin Spiteri & Dr Kok Wai Ma: Regenerative braking capabilities for EV traction using bidirectional power converter is a mature technology, and in many cases can be provided without significant cost premium. On the other hand, bidirectional power conversion for on-board EV charging is an application trend driven by the increasing vehicle-to-everything (V2X) functionality requirement. To achieve such requirement, the popular choice of AC-DC PFC stage will change from Vienna rectifier to Active Front End (AFE), and DC-DC converter topologies will change from LLC to CLLC or dual active bridge (DAB).

ELE Times: How are new battery management systems (BMS) maximizing power handling and lifespan for high-voltage applications?

Martin Spiteri & Dr Kok Wai Ma: Infineon’s cell monitoring and balancing (CMB) device, also known as the BMS IC or Analog Front End (AFE), measures cell voltages and temperatures for state of charge (SoC), ensuring safe operation within the safe operating area (SOA). It performs low-power diagnostics and housekeeping and communicates with the main controller for cell balancing and pack thermal management triggering disconnection and alerts when needed.

Over time, the small differences between cells in multicell battery stacks are magnified during each charge and discharge cycle. Weaker cells with lower capacity reaching maximum voltage sooner than others force the charging process of the entire pack to stop; in this case, the full capacity of the battery cannot be used. Using Infineon’s automotive BMS cell monitoring and balancing (CMB) device to compensate the weaker cells by equalizing the charge across the entire stack will enable extending an electric vehicle’s driving range and battery lifetime. Additionally, to achieve extremely low-power dedicated housekeeping functions, such as periodically scheduled cell measurements and state analysis required for functional safety, the Cell Monitoring and Balancing IC can operate independently of the BMS’s master controller. Safety features such as signalling over- or under-voltage, thermal stress, and emergency alarms are triggered autonomously.

ELE Times: What are the trends in high-power fast-charging architectures and how are they affecting grid integration?

Martin Spiteri & Dr Kok Wai Ma: Truck electrification is driving up EV charging voltage and capacity beyond 1000V and megawatts level. Standardization activities around the world is ongoing to enable high-voltage high-power DC fast chargers be developed and be interoperable, e.g. CCS, CHAdeMO, GB/T for High Power Charging (HPC), and SAE J3400, Ultra-ChaoJi, X-MCS and NACS for Megawatt Charging System (MCS).

To construct high-power fast DC charging park,

• DC microgrid is seen as a promising approach for interconnection of the AC grid with different renewable energy sources like solar photovoltaic and battery energy storage,
• Solid-state transformer (SST) is the key enabling technology for such architecture,

Matrix switch network will facilitate flexible power distribution amongst energy sources and charging loads.

Conclusion:

Driving Toward the Electrified Tomorrow

Power electronics will change across industries, primarily in electric vehicles and sustainable-energy systems. UWBG semiconductors such as diamond and gallium oxide will creep in as the second-generation materials that can promise better efficiency, power density and thermal performance. AI-based power electronics will predictively maintain and monitor system health in real-time to ensure it is performing at its optimum and has its life further extended. Now, the rising 800V+ architecture for EVs and the emerging trend of 48V will allow for better thermal management, efficiency and fast charging. SSTs will enable the integration of DC microgrid, allowing the power to be distributed flexibly and interfacing into renewable energy sources. Megawatt charging system (MCS) is expected to provide high-power EV charging, especially for heavy-duty vehicles and global standardization schemes are underway. Fast charging, better charging and safer battery technologies are being developed one semiconductor at a time. With the emergence of SiC, GaN advanced gate drivers and megawatt chargers, a new electrified era stands before mobility.

The post Power Electronics in the Mobility Sector: Insights on Trends, Technology, and Transformation appeared first on ELE Times.

STMicroelectronics (ST), a leading global semiconductor company that serves clients in a variety of electronics applications, recently announced ST Presence Gen 5, its fifth-generation Human Presence Detection (HPD) technology, at a virtual media briefing. The most recent version of ST’s turnkey solution marks a major advancement in protecting user privacy while improving security, power efficiency, and user engagement in personal computing devices, including laptops, monitors, tablets, webcams, and accessories.

Personal Electronics, Industrial & Mass Market Business-Line Director at Imaging Sub-Group, STMicroelectronics

The briefing included in-depth discussions from David Maucotel, Business-Line Director at the Imaging Sub-Group, assisted by Herve GROTARD (Subject Matter Expert on ST Presence) and Olivier LEMARCHAND (SME on AI-powered Human Presence Detection). The event provided a holistic view of the technology’s evolution, market relevance, and functional impact, concluding with live feature demonstrations and a technical walkthrough.

The outlook for the imaging market and ST’s strategic priorities

David Maucotel gave a thorough market analysis at the beginning of the session, referencing statistics from analysts at Yole Group who projected a compound annual growth rate of 4–5% for the image sensor market until 2029. Mobile, computer vision, and industrial applications are important growth areas. By 2030, 3D sensing is predicted to triple in revenue due to robots, indoor/outdoor navigation, and people monitoring.

In this trajectory, ST’s Imaging Sub-Group is essential. The company has naturally developed a diverse product range that targets laptops, PCs, industrial robotics, and car in-cabin monitoring, building on its prior capabilities in front-facing smartphone sensors and rear camera assistance. ST is currently a world leader in 3D depth sensing and camera modules thanks to its proprietary technologies, which include the well-known FlightSenseTM time-of-flight (ToF) sensors.

Engineering Excellence in ST’s Imaging Portfolio

The Imaging Sub-Group’s technical foundation is rooted in over 25 years of R&D, dating back to its acquisition of Vision Group in Scotland. From early success with Nokia to winning the CES Innovation Award in 2019, ST has continuously pushed the envelope in camera and ToF technologies. Its current portfolio includes:

• 3D Depth Sensing: Mastery of both indirect and direct time-of-flight sensors capable of generating from 2,000 to 500,000 points in a 3D environment. 
• Direct ToF Modules: Compact modules with 64 to 256 zones, enabling accurate distance measurement up to 10 meters in multi-zone configurations. 
• Optical Light Sensors (ALS): Ultra-small form-factor ambient light sensors for screen dimming and colour tone adjustments. 
• 2D Global Shutter Cameras: Over one billion units shipped, with applications ranging from smartphones to face authentication and VR.
  

ST’s competitive edge lies in its ability to vertically integrate manufacturing, design, to production across its fabs in France and Singapore, assembly sites in Shenzhen and Calamba, and R&D hubs in Grenoble and Edinburgh.

ST Presence Gen 5: Turnkey, AI-Powered, Privacy-Centric

Herve Grotard introduced ST Presence Gen 5, ST’s flagship turnkey solution that integrates its multi-zone ToF sensor with proprietary AI algorithms to deliver advanced human sensing capabilities—without using a camera.

“At the core is an 8×8 time-of-flight ranging sensor that calculates real-time distance data using invisible infrared light,” said Grotard. “On top of this hardware, we’ve added a stack of AI and analytic algorithms to build privacy-respecting, low-power, real-time features.”

Key advantages include:

• Privacy: No images are captured; the system operates entirely on depth data.
• Power Efficiency: Consumes under 2 milliwatts, reducing CPU wakeups and enabling ultra-low power operation.
• Low Computational Overhead: Software optimized for small microcontrollers and sensor hubs, not requiring GPUs or high-performance CPUs. 

Breakthrough Features in Gen 5

Olivier Lemarchand took the audience through each of the seven major features of ST Presence Gen 5, each enabled by a unique AI network or advanced analytics:

1. Walk-Away Lock
   Detects when a user leaves their PC and triggers automatic lock and sleep mode. Combines distance tracking, motion analytics, and an in-house “Presence AI” network to distinguish human presence from background objects. 
2. Adaptive Dimming
   A new feature that uses head orientation detection to reduce screen brightness when the user isn’t looking—improving power savings without compromising experience. “Achieving this with just 64 pixels of depth data is a technical marvel,” Lemarchand noted. 
3. Wake-on-Attention
   An upgrade from “Wake-on-Approach,” this feature wakes the device and triggers Windows Hello login only when the user is both near and visually engaged. It leverages two parallel AI networks: Body Posture and Head Orientation. 
4. Multi-Person Detection (MPD)
   Enhances on-screen privacy by identifying up to three individuals behind the primary user, issuing alerts when potential onlookers linger—a valuable security feature in public workspaces. 
5. Hand Gesture Recognition
   Introduces two new interaction modes: motion gestures (swipe, tap) and hand postures (like, dislike, love, flat hand), powered by a fourth, publicly available AI network accessible via ST’s Edge AI Suite. Developers can fine-tune or expand gesture sets and deploy them to STM32 microcontrollers. 
6. User Posture Monitoring
   As a proof-of-concept aimed at wellness, this feature detects poor seating postures and encourages users to adjust their position—addressing the growing health concerns of prolonged screen time. 
7. Body Posture Detection
   Supports features like Wake-on-Attention by ensuring the user is seated in a login-compatible posture. Also paves the way for ergonomic analytics in future workplace setups. 

Real-World Impact: ESG, User Experience & AI Efficiency

Highlighting the environmental benefits, Grotard emphasized that ST Presence Gen 5 could reduce energy consumption by over 20% per PC per day. If deployed across ST’s own 50,000 employees, it could save 118 tons of CO₂ daily—equivalent to 120 transatlantic flights. At a global scale, this equates to the carbon footprint of 123,000 fully charged electric vehicles per day.

This combination of high-impact ESG outcomes, enhanced user convenience, and seamless privacy makes ST Presence Gen 5 a compelling choice for OEMs looking to differentiate on sustainability and user experience.

AI at the Edge, Built for Integration

What makes ST Presence particularly scalable is its minimal footprint. Despite running four AI networks, the solution is designed for low-resolution, edge-AI environments. All algorithms run on a sensor hub, with no need to activate the main CPU. This enables integration into any STM32-based microcontroller platform, reducing BOM cost and design complexity.

ST also offers a complete ecosystem—from sensor modules and microcontrollers to reference designs and evaluation kits—streamlining OEM adoption.

Closing Remarks

“This is all about delivering a smart, secure, and power-efficient user experience without compromising privacy,” Grotard concluded. “ST Presence Gen 5 is a testament to what’s possible when innovation in sensing, optics, and AI converge on the edge.”

With ST Presence Gen 5, STMicroelectronics reaffirms its leadership in smart sensing and edge AI—creating meaningful impact across personal computing, sustainability, and user wellness.

The post STMicroelectronics Unveils Fifth Generation of Human Presence Detection Technology: Redefining Privacy, Power Efficiency, and User Experience in PCs appeared first on ELE Times.