ELE Times

The defence minister, Rajnath Singh, has authorized the transfer of technologies, including conventional missile systems developed by DRDO, to eligible Indian defence manufacturers to set up indigenous production. In this process, mature and proven missile technologies are being moved from development to industrial-level mass production. The manufacturers will need to have applicable technical qualifications, certification levels, and regulatory requirements in place.

The scope for wider participation in the missile production chain would occur to some extent also due to technology transfer, where state-owned manufacturers, private firms, MSMEs & specialized manufacturers could develop expertise and participate in components and sub-components, electronics, propellants, guidance systems and associated mechanisms, launch systems and integration with greater depth.

There is scope for increased industrial involvement, which could bring about a higher level of domestic production and value addition, thereby lowering defence imports reliance. Increased industrial involvement could enable DRDO labs to focus more on research in newer and advanced technologies, while existing and developed systems may be produced industrially. A drastic policy shift, as it marks a change in treating private Indian companies as long-term technology and production partners in defence manufacturing. Its success hinges on technological absorption capability, quality testing procedures, test facilities, and orders.

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The Indian Navy commissioned INS NIPUN, the second ‘Nistar’ class Diving Support Vessel (DSV), at the Naval Dockyard. Mumbai on 31st August 2026. This is considered a great boon to our Navy’s underwater diving, underwater intervention, and submarine rescue capabilities. The first-ever indigenously developed and built vessel designed and built at Hindustan Shipyard Ltd. Visakhapatnam has sophisticated underwater-diving facilities for personnel, capable of submergence in adverse environments and pressures of the high seas. It can perform tasks such as inspection, maintenance, salvage, among others while it stays at sea, far away from shore for long periods.

It will provide increased capabilities in support of submarine-rescue operations- a vital skill that will protect crews and response personnel in submerged situations. Vessels like this are used to embark divers, remote systems and specialist rescue gear to operate as afloat platforms.

Induction of INS Nipun showcases the growing Indian capacity in indigenous design and manufacture of complex naval platforms, and it further bolsters the overall defence-shipbuilding industry in India through the contribution of Indian shipyards, equipment providers & supporting industries. She makes inroads into the Navy at a time when underwater surveillance, operation of submarines, and security of sea-based infrastructure are assuming prime importance.

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Garden Reach Shipbuilders & Engineers has recently signed two international contracts to boost its digital shipbuilding and marine-engineering activities. Both contracts were signed on September 2, 2026, at SMM, the maritime trade fair that was held in Hamburg, Germany. The signing was completed when the Indian defence shipbuilder and the Norway-based classification and assurance organization DNV signed their first Memorandum of Understanding. The partnership is said to seek digital shipbuilding and development in areas of green technologies, training, and leading technical marine engineering.

GRSE further signed its second accord with the Netherlands-based Damen Technical Cooperation to provide technical and commercial cooperation for the design and construction of high-end dredges in India, reinforcing an existing relationship and boosting India’s capability to manufacture specific vessel types in the future. Digital shipbuilding encompasses the use of an interconnected design platform, data-centric engineering, and 3-D models for developing, constructing, and maintaining a vessel throughout its life cycle.

This process helps identify design challenges early in development and allows predicting maintenance needs on vessel parts. These joint ventures may facilitate GRSE in upgrading its shipyard, attaining foreign technology, and thereby increasing opportunities to participate in overseas tenders, along with augmenting India’s indigenous capabilities for construction of advanced warships and commercial ships.

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The 16th edition of Aero India, the aerospace and defence manufacturing exhibition, is being organized by the Ministry of Defence from 8-12 February, 2027 at the Air Force Station Yelahanka in Bengaluru. Military officials, defence policy planners and policy formers, defence technology experts, as well as foreign investors are said to visit the show; the exhibition will aim to exhibit combat aircraft, helicopters, unmanned aerial systems, avionics, propulsion systems, electronic warfare and air defence technologies. The defence show of Aero India is managed by the Department of Defence Production. A flying display along with a technology exhibition will also be organized.

The event will also offer a platform for Indian defence manufacturing companies, start-ups, and MSMEs for forming manufacturing alliances and becoming an integral part of the global supply chains. The business meetings are anticipated to deliberate on technology transfer, co-development, co-production and defence exports. The announcement assumes significance at a time when India aims to give impetus to aerospace manufacturing indigenization and cut reliance on imports for its defence equipment needs. Aero India 2027 will hence not merely be an Air Show but a catalyst in enabling India’s Make in India, Make for the World defence manufacturing story.

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The 66th Annual Convention of The Society of Indian Automobile Manufacturers (SIAM) was recently held in New Delhi. Addressing the event, Indian PM Narendra Modi shared a special message at the convention. He stated, “India’s automobile industry is well placed to further expand its global presence as the country’s mobility ecosystem undergoes a fundamental transformation. Continued innovation, pursuit of excellence and a bold pathway towards Viksit Bharat will unlock transformative opportunities for the sector and accelerate the journey towards a faster, greener and self-reliant future.”

Chief Guest Nitin Gadkari, Hon’ble Union Minister of Road Transport & Highways, Government of India, mentioned, “With quality, innovation, research and competitive pricing, India has the potential to become the largest automobile industry in the world, with the sector playing a key role in Viksit Bharat. We should also encourage the expansion of driver training centres, vehicle fitness centres and vehicle scrapping centres, which can contribute to the economy as well.”

In a video message, Guest of Honour H. D. Kumaraswamy, Union Minister of Heavy Industries and Steel, Government of India, said, “The Indian automobile industry is strengthening its domestic capabilities and advancing vehicle technologies, creating a strong foundation to transform the local market into a global hub. The sector will continue to grow as a cleaner, more inclusive and globally competitive industry, contributing meaningfully to the Viksit Bharat 2047 goal.”

Sharing his views, Shailesh Chandra, President, SIAM and Managing Director & CEO, Tata Motors Passenger Vehicle Ltd. added, “The Indian Automobile Industry continues to play a defining role in shaping India’s Amrit Kaal, contributing significantly to realising the vision of a Viksit Bharat by 2047. Alongside this progress, India has made significant strides in aligning with global and national priorities of sustainability, decarbonisation, and safety.”

Addressing the automobile fraternity, Shenu Agarwal, Vice President, SIAM and Managing Director & CEO, Ashok Leyland Ltd., highlighted, “The Indian automobile industry has demonstrated remarkable resilience, and India can simultaneously become a large mobility market, a global manufacturing hub and a technology leader. But the next phase of this journey will require looking beyond growth alone, with sustainability and resilience going hand in hand.”

The SIAM Annual Convention session concluded with a shared commitment to building resilience in sustainable mobility, harnessing technology to strengthen global competitiveness and advancing India’s journey towards Viksit Bharat.

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Vishay Intertechnology, Inc. today introduced a new series of thin film chip resistors in compact 0402 and 0603 case sizes. Built on an advanced aluminum nitride (AlN) substrate, the Vishay Sfernice CHEP series combines exceptional power handling and high frequency performance in standard surface-mount footprints, allowing designers to achieve higher power density without sacrificing RF performance or increasing board space.

The CHEP series sets a new benchmark for power handling in its class. While competing solutions are often rated below 1 W, the devices released today deliver standard power ratings of 1.2 W in the 0402 case size and 1.8 W in the 0603 case size. When mounted per datasheet guidelines, power ratings increase by 50 % to 1.8 W and 2.8 W, respectively, enabling higher power density in smaller footprints.

The resistors operate across a wide frequency range and are available with flip-chip or wraparound terminals. When mounted as flip-chip devices, resistors in the 0402 case size achieve frequencies to 50 GHz, while wraparound active face-up mounting supports operation to 20 GHz. Devices in the 0603 case size support frequencies up to 40 GHz.

Designed to minimize internal reactance, the CHEP series features LC values as low as 1 x 10⁻²⁴. The resulting low parasitics reduce phase shift, maintain consistent impedance, and minimize noise to improve RF performance, while standard 0402 and 0603 case sizes enable easy integration into widely accepted land patterns, simplifying design and layout.

The devices are ideal for telecom and connectivity applications, including LEO satellites, base station terminals, 5G and 6G networks, and RF infrastructure such as remote radio units (RRUs) and antennas. Additional applications include aerospace and defense systems such as drones, satellite payloads, guidance and telemetry systems, data links, and phased array radar systems.

The resistors offer a resistance range from 20 Ω to 120 Ω with tolerances down to ± 1 % and a temperature coefficient of ± 100 ppm/°C, with ± 50 ppm/°C available on request. RoHS-compliant, halogen-free, and Vishay Green, the devices operate over a temperature range from -55 °C to +155 °C.

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Infineon Technologies AG radiation-hardened HiRel power devices are aboard the Nancy Grace Roman Space Telescope, which lifted off from Kennedy Space Center in Florida, marking the successful launch of NASA’s next flagship space observatory. The Roman Space Telescope will travel to the second Sun-Earth Lagrange point (L2), more than 1.5 million kilometers from Earth, the same orbital position as the James Webb Space Telescope, where stable gravitational conditions and an unobstructed view of a wide swath of the sky will support the mission’s scientific program. The Roman Space Telescope mission adds to Infineon’s space heritage that stretches back to the 1970s, during which the company supported hundreds of space missions including navigation satellites, the International Space Station, and NASA’s Artemis program, with rad-hard components that have traveled more than 20 billion kilometers from Earth.

“The launch marks the beginning of what will be one of the most scientifically productive space observatory missions ever undertaken, and Infineon’s HiRel technology is part of that from day one,” said Mike Mills, Senior Vice President and General Manager HiRel at Infineon. “Roman will operate at L2 for up to a decade with no possibility of maintenance or servicing. At that distance, in that radiation environment, power technology has to work flawlessly from day one and keep working. Space programs require technologies and partners they can rely on for decades, and the selection of Infineon’s HiRel devices for the Roman mission reflects the qualification depth and mission heritage that the space industry demands from a strategic technology partner.”

Beyond Earth’s protective magnetic field, high-energy particles strike electronic components unimpeded and can permanently damage or destroy them, causing mission failure. Infineon’s radiation-hardened technology addresses these mechanisms not through passive shielding, but through a semiconductor architecture that is radiation-resistant by design.

Infineon’s HiRel portfolio integrated into the Roman Space Telescope includes rad-hard power semiconductor components. The devices are qualified to MIL-PRF standards with Total Ionizing Dose (TID) and Single Event Effects (SEE) characterization, providing the performance margins required for sustained operation at L2. Roman’s onboard systems will downlink approximately 1.4 terabytes of raw science data per day to ground stations in New Mexico, Australia, and Japan, representing the highest data volume of any NASA astrophysics mission to date. Reliable, continuous power delivery to the telescope’s instruments and data systems is a prerequisite for meeting this operational cadence across the full duration of the mission.

Infineon’s HiRel product range spans radiation-hardened silicon power MOSFETs, gallium nitride (GaN) transistors, gate drivers, solid-state relays and diodes, backed by in-house fabrication, robust radiation testing capabilities and guaranteed long-term product availability. Infineon’s JANS-qualified rad-hard 100 V GaN transistor, the first and only internally manufactured rad-hard GaN transistor on the market qualified per MIL-PRF-19500, represents the leading edge of this portfolio. GaN enables lower switching losses, higher power density, and higher switching frequencies, reducing power losses and magnetic component requirements and delivering measurable weight and volume savings at the system level, where every gram counts in space applications.

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L&T Technology Services, a global leader in Engineering Intelligence Solutions & ER&D Consulting Services, announced the launch of LTTS FARM, a startup engagement platform designed to accelerate the commercialization journey of deep-tech startups through Engineering Intelligence-led collaboration, co-innovation and market access.

Built on the philosophy of “Collaboration First, Commercialization Next”, LTTS FARM is targeted at startups with TRL 4+ technologies that have validated their technical feasibility and are ready to explore industry adoption. The program is focused on startups aligned with LTTS’ Technology Big Bets – Software Defined Mobility (SDM), Plant Buildout & Modernization, Energy & Industrial Automation, Digital Manufacturing, Next Gen Compute & Data Centers, Software Platforms & EI and MedTech – with the potential to further advance these strategic priorities through new technologies and solutions. By leveraging LTTS’ global presence, domain expertise and customer relationships, LTTS FARM seeks to create a structured launch pad for startups to progress from validated innovation to customer adoption and long-term growth.

The initiative reflects LTTS’ commitment to fostering a thriving innovation ecosystem by bringing together startups, engineering talent and industry stakeholders to address real-world business and technology challenges. The journey will span across evaluation, onboarding, co-innovation, pilot development and commercialization opportunities for eligible startups. Suitable solutions will be considered for broader industry deployments aided by pilot projects, proof-of-concepts, customer demonstrations and diverse commercial engagements.

Amit Chadha, CEO & Managing Director, L&T Technology Services and Member of NASSCOM Executive Council, said, “Many promising technologies struggle because of limited access to customers, industry expertise and commercialization opportunities. Through LTTS FARM, we are creating a platform where startups can collaborate with our experts, gain exposure to global markets and customer requirements, validate real-world applications and accelerate their journey from solution readiness to market adoption. By nurturing innovations that align with and further our technology big bets, LTTS FARM will also expand our Engineering Intelligence ecosystem and help transform breakthrough ideas into industry-ready solutions that deliver measurable business impact”.

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Rohde & Schwarz in collaboration with Qualcomm Technologies, Inc. has completed an early verification step for 3GPP Rel. 17 Search Space Set Group Switching (SSSG). This 5G NR feature, designed to reduce device power consumption, has now been formally submitted for RAN5 verification. This milestone supports the path from standardization to conformance testing and commercial use, while also feeding practical findings back into the standardization process.

Rohde & Schwarz has successfully verified for the first time a 3GPP NR conformance test case for Search Space Set Group Switching (SSSG). Introduced in 3GPP Release 17, SSSG is a power-saving mechanism for user equipment that improves how a device monitors control channel activity while maintaining reliable reception of scheduling information.

By completing verification of the 3GPP RAN5 NR conformance test case TS 38.523-1 TC 7.1.1.12.5 for SSSG at an early stage, the two companies supported early readiness of this feature across the 5G conformance ecosystem. The verification was carried out using a mobile test platform using Qualcomm X105 5G Modem-RF and the R&S TS-PCT protocol conformance test platform from Rohde & Schwarz, which is based on the CMX500 5G one-box signaling tester. SSSG optimizes the PDCCH monitoring behavior in 5G NR devices. This reduces unnecessary monitoring activity and helps improve power efficiency.

Rohde & Schwarz and Qualcomm Technologies are the first to complete all relevant test aspects for this conformance test case. During the verification work, the companies also identified areas where the underlying conformance specification could be improved and supported the submission of a change request to 3GPP RAN5, the group responsible for conformance test specifications. This links practical verification work with ongoing standardization development.

This combination of test execution and standards input shows how verification work can also improve the quality of future test specifications. For device manufacturers, the wireless chipset ecosystem and certification organizations, it marks a step toward reliable testing of advanced 5G power-saving functions.

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Vishay Intertechnology, today introduced two new low profile common mode chokes for high current automotive, energy, and industrial applications. Available in both surface-mount and through-hole packages, the Vishay Dale commercial ICMS2321 10 and Automotive Grade ICMS2321-1A combine a heat rating current to 30 A with a 1500 VDC dielectric withstand voltage between coils.

With their low profile, the devices released today offer a reduced size and volume, making them more resistant to shock and vibration, while their enhanced core design increases performance and saturation current at high temperatures up to +150 °C. Offering a self-shielded, rugged construction, the common mode chokes are ideal for DC/DC converters, high voltage inverters, EMI filters, and high current filters for noise suppression in motor control and other circuitry. The AEC-Q200 qualified ICMS2321-1A is well suited for use in automotive on-board chargers.

In addition to their surface-mount and through-hole mounting options, the ICMS2321-10 and ICMS2321-1A offer customizable inductance, impedance, DCR, and current ratings. Devices with surface-mount terminations are available in tape and reel packaging and are compatible with automated pick and place assembly for increased flexibility in board layouts. The common mode chokes are RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table:

(1) DC current (A) that will cause an approximate ΔT of 40 °C

(2) DC current (A) that will cause an approximate ΔT of 100 °C

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In electronics manufacturing, material and quality testing using X-ray inspection is considered the gold standard for reliability and the highest standards. For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels. With a completely newly developed system platform, the manufacturer now presents next-generation X-ray inspection: The Multi Line AXI combines outstanding technological innovations with highly versatile application options and multifunctionality, while offering simple operation and rapid adaptability to inspection tasks. The result is an innovative AXI system that sets new standards in X-ray inspection—offering a secure investment and high performance.

Technically, the Multi Line AXI stands out as a state-of-the-art planar 3D-CT X-ray system, offering the highest possible resolution and razor-sharp cross-sectional images. Based on the company’s proprietary aspeCT technology, the system achieves new levels of precision and image quality in X-ray inspection. Using a high-resolution, high-speed flat-panel detector, the detailed images are transformed into intelligent 3D reconstructions and volumetric 3D images and models of the highest quality. An innovative 7-axis system with synchronized control ensures high-speed, on-the-fly CT imaging in the shortest possible time: In less than 2 seconds, and with 8 µm voxel resolution, the Multi Line AXI offers flexible 2D, 2.5D, and 3D X-ray imaging as needed, using microfocus X-ray tubes and in sub-micrometer increments. This makes the system a highly secure investment and versatile in its application, manufactured entirely in Jena.

In addition to its outstanding technology, the Multi Line AXI has been consistently designed for broad applicability, reliability, and low-maintenance operation. With an 810×535 mm inspection area, a maximum PCBA clearance of 105 mm, and a transport capacity of up to 25 kg in its flexible transport system, both the smallest PCBAs and large power electronics can be inspected quickly and with consistently high quality. Thanks to the use of parts from exclusively European suppliers and German-brand mechanical components, the system is extremely durable and reliable. The Multi Line AXI’s platform concept makes upgrades, expansions, and repairs quick and easy. Furthermore, the system can be integrated into any manufacturing or inspection environment—whether inline, at-line, or stand-alone. It interfaces seamlessly with the manufacturer’s MES and can be integrated into traceability systems. High repeatability, variable X-ray performance as needed, and adaptability to high mix, low-volume production are hallmarks of the Multi Line AXI.

However, a system’s performance and quality are only the foundation—in everyday use, an AXI system must be quickly adaptable to specific inspection tasks and easy to operate. The Multi Line AXI guarantees this through its seamless integration into the PILOT software platform’s user interface, which has also proven itself in GÖPEL AOI systems. Inspection programs are automatically generated using “Magic Click” based on Gerber and assembly data or other CAD formats (ODB++, Process, etc.). For reliable verification, the PASS/FAIL evaluation is supported by intelligent AI assistants. This transforms detailed X-ray images into actionable inspection results—ensuring the quality and security of the PCBA. Short programming times and comprehensive evaluation of results—including precise void calculation and THT fill rate measurement in percent—combined with GÖPEL electronic’s software and inspection intelligence make the Multi Line AXI practical and suitable for everyday use, intuitive to operate, and customizable.

In developing the new X-ray inspection system, GÖPEL electronic also addressed questions about the future: How do we want to manage our resources? As a result, the Multi Line AXI is designed as a “Lean & Green Machine” focused on resource conservation, energy efficiency, and sustainability. The manufacturer has deliberately omitted pneumatic components and compressed air, which not only simplifies installation and operation but also reduces maintenance and operating costs. With its lightweight design—weighing just 2.7 metric tons and featuring a compact footprint of 1600×1660—this X-ray system requires no special structural preparations and can be installed quickly and easily in virtually any environment. Based on GÖPEL electronic’s many years of experience, the system is designed from the outset to be durable, upgradeable, and reusable, with easy access for service and maintenance.

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Murata Manufacturing Co., Ltd., a global leader in electronic components and innovative electronic solutions, will participate in electronica India 2026, taking place from 16–18 September 2026 at the Bangalore International Exhibition Centre (BIEC), Bengaluru.

Located at Hall 3, Booth H3.E11, Murata will present its exhibition theme, ‘Scaling the Future from India with Murata,’ showcasing how its technologies are helping shape the next generation of intelligent, connected, and energy-efficient electronic systems. As India’s industries accelerates toward an AI-powered, electrified, and digitally connected future, Murata is helping enable the technologies that make it possible. Backed by global reliability, local commitment, and scalable innovation, Murata delivers advanced electronic components, sensing technologies, power solutions, RF technologies, and system innovations that support next-generation industrial systems.

At electronica India 2026, visitors will experience application-focused demonstrations, engage with Murata’s technical experts, and discover how the company’s technologies help accelerate innovation across rapidly evolving industries.

The electronics industry is entering a new era driven by artificial intelligence, semiconductor innovation, intelligent mobility, industrial automation, robotics, and digital infrastructure. As these technologies continue to converge, the need for highly reliable, energy-efficient, and integrated electronic solutions continues to grow.

At electronica India 2026, visitors will experience how Murata’s technologies address these evolving industry needs through interactive demonstrations and application-focused showcases.

Murata’s booth will feature five application zones highlighting technologies that enable future-ready electronic
systems across diverse industries:

• IC Zone – Accelerating Semiconductor Innovation from Device to System
  High performance AI computing requires increasingly integrated semiconductor systems. Explore how Murata’s components, reference design, and EMI expertise support power delivery, noise control, and reliable system design for advanced semiconductor applications.
• Data Center Zone – Powering AI Servers and Modern Data Center Infrastructure
  Data centers supporting AI and other high-performance computing workloads require efficient, reliable, and scalable power solutions. Discover Murata’s power technologies and electronic components for AI servers, networking, and modern data center infrastructure.
• Mobility Zone – Driving the Future of Connected and Electrified Mobility
  Enabling connected, electrified vehicles through advanced communication, sensing, and battery technologies. Explore Murata solutions for V2X (Vehicle to Everything), connectivity, positioning, and system reliability.
• Industrial Zone – Accelerating Smart Factory Transformation
  Manufacturers are adopting smarter, more connected operations. Explore Murata solutions for automation, machine monitoring, asset tracking, and operational efficiency.
• Humanoid Zone – Enabling Responsive Interaction and Synchronized Action
  Humanoid robots need accurate sensing, reliable connectivity, and coordinated control. Discover how Murata technologies support responsive interaction, synchronized movement, and dependable operation.

Complementing these featured showcases, visitors will also have the opportunity to explore additional product showcases and technology displays across each application zone, together with Murata’s broader product portfolio, demonstrating Murata’s expanding role in delivering comprehensive electronic solutions across diverse applications.

Murata combines decades of global technology leadership with an expanding local presence to support India’s rapidly evolving electronics ecosystem. By integrating global manufacturing standards with local engineering expertise and dedicated customer support, Murata continues to deliver the quality, reliability, and innovation trusted by customers worldwide.

As part of its long-term commitment to India, Murata continues to strengthen its local capabilities through its sales offices in Chennai, Delhi (Noida), and Bengaluru, together with its manufacturing facility in Chennai. This growing footprint enables closer customer collaboration, faster technical support, and stronger partnerships, reinforcing Murata’s commitment to supporting India’s ambition to become a global hub for electronics manufacturing and technological innovation.

Murata invites customers, partners, design engineers, and industry professionals to visit Hall 3, Booth H3.E11 at electronica India 2026 to experience application-focused demonstrations, engage with technical experts, and discover how ’Scaling the Future from India with Murata’ is enabling the next generation of electronics.

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​The Indian Navy received its first indigenous multi-purpose vessel, Samarthak, from Larsen & Toubro at its Kattupalli shipbuilding yard. An indigenous content of 75% indigenous content, marking the next step in India’s initiative to build naval warships indigenously. It was built with features to fulfil various requirements, such as surveillance, maritime patrol, and participation in Humanitarian Assistance and Disaster Relief (HADR) activities. Furthermore, the vessel can successfully carry out launching and recovering of naval targets, use automated systems, and evaluate naval weapons, sensors, etc.

This inherent flexibility should provide the capability for the Navy to employ the ship in an operational role in addition to its testing and evaluation capacity. These vessels are critical because new underwater systems and other unmanned vehicles and new radars and weapons need to be rigorously tested in the natural sea environment before they are widely deployed into operations. The ship was built under a contract for two Multi-Purpose Vessels and demonstrates enhanced cooperation between the Indian Navy and private shipbuilding. Its induction proves the increasing capabilities of Indian companies in designing and building advanced, technically complex naval platforms​.

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​The 4Th Tri-Services Future Warfare Course has concluded at the Manekshaw Centre, New Delhi, concluding the four weeks allotted for professional military education and strategy discussions. Sponsored by HQ IDS, the course was executed by the Centre for Joint Warfare Studies and offered a platform for interaction between the Army, Navy, and Air Force. Members of the government sector, academia, industrial sector, and strategic think tanks community were also invited.

The curriculum explored topics such as artificial intelligence, autonomous systems, quantum technology, cyberspace warfare, information operations, and cognitive warfare. The training also delved into grey zone conflict and coordinated military operations in the land, sea, air, space, and cyber fields. Participants will take part in lectures, scenario construction, cognitive warfare simulations, field trips, and lectures by military commanders, defence policymakers, researchers, engineers, and other experts.

The purpose of this training is to enable officers, who will participate in planning and making battlefield decisions, to understand how their operational planning and field decisions are being impacted by novel and developing technologies. It is another reflection of the Armed Forces’ greater commitment to joint and tech-focused operations, and it is its 5th edition this year, set to start 16 November to 11 December 2026.

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​TATA Advanced Systems Limited has signed a Memorandum of Agreement (MoA) with Javelin Joint Venture, a partnership between Raytheon and Lockheed Martin, on the potential indigenous production of the Javelin anti-tank missile. Under the envisaged agreement, TATA Advanced Systems would become the lead industrial partner for developing final assembly, integration, and component manufacturing in India.

The scope of cooperation between the companies would include the Javelin All-Up Round, which is a complete missile sealed within its launch container and ready for use. Raytheon will provide the guidance electronics and Lockheed Martin will supply sub-assembly kits that India can use to assemble and integrate the weapon locally. Depending on India’s interests in further local content and technology transfer to its manufacturers, the project has the potential to foster a local missile supply chain.

Javelin is an American man-portable, fire-a​nd-forget, anti-tank and multi-purpose guided missile manufactured by Lockheed Martin and is capable of hitting armoured vehicles, fortified positions and other tactical targets. Its seekers can lock and track the target, and once launched, the operator can seek cover from hostile fire. The deal comes amid the Indian Army’s acquisition of a Rs 292 Crore batch of Javelin Systems, and may help reduce weapon availability time while simultaneously promoting deeper domestic engagement in complex weapon production.

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INS Nipun, the Navy’s second indigenously built Nistar-class diving support vessel, has been commissioned in the Naval Dockyard at Mumbai. The specialised vessel is expected to bolster the Navy’s capabilities in deep-sea diving, submarine rescue, salvage and underwater intervention. Built by Hindustan Shipyard Limited (HSL), INS Nipun is intended to support naval divers during difficult deep-sea dives and also to act as a mother ship for a Deep Submergence Rescue Vehicle (DSRV) or remotely operated vehicles deployed for locating and rescuing a disabled submarine’s crew.

It is the sister ship of the first vessel of the class, INS Nistar, which is already functioning in the Eastern Naval Command. By inducting a ship each on either the Indian Ocean seaboard and the Bay of Bengal, it will enable the Indian Navy to respond with a faster specialised underwater-support capacity across both sectors, and it is a major landmark development for the indigenous shipbuilding sector, as only a small number of navies in the world possess the deep-sea diving and submarine rescue capability available in these platforms. By inducting a ship for the Indian Navy, the capability for assisting partners during any underwater disaster or maritime calamity becomes higher.

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The Ministry of Defence has streamlined India’s Defence Export Standard Operating Procedure (SOP) and Open General Export Licence (OGEL) to speed up the process and help the Indian manufacturing sector reach global markets. Except for a few items of non-lethal arms, no stakeholder concurrence will be needed for the shipment of these articles. Similarly, this requirement will not be necessary for exporting goods intended for international tendering or exhibitions. However, protection for high-security zones/sensitive equipment will continue to exist.

The three individual Open General Export Licence procedures are now integrated into a single one. The licence validity period has extended from two years to three years, and the range of eligible countries has widened further; countries covered by United Nations sanctions regimes, arms embargoes, and other security restraints are not eligible. Eligible exporters can use the licence to send multiple batches of specified goods instead of seeking permission for each batch individually.

The reform is to make way for Indian manufacturers entering long-term contracts with foreign original equipment manufacturers. It is felt that the MSMEs in the country will benefit particularly through this, as their consignments of defence products comprising components, protective devices, etc could be exported in a routine manner.

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NASH Energy, India’s first mass-scale LFP cell manufacturer, will showcase its latest energy storage and energy management solutions at the 50th edition of Middle East Energy 2026, being held from September 1–3 at the Dubai World Trade Centre.

At Booth Z3.E10, NASH Energy will present its capabilities spanning LFP cells, battery packs, battery management systems and energy storage solutions, addressing a range of applications across automotive, electric mobility, industrial and energy sectors.

The company will highlight solutions ranging from battery packs to large-scale energy storage systems, demonstrating its capabilities across the energy technology value chain. With in-house engineering, R&D and manufacturing capabilities, NASH Energy is developing customised energy solutions designed to address the evolving requirements of global customers.

NASH Energy has an R&D centre in Japan and operates an LFP cell and battery pack manufacturing line in Bengaluru, India. The company has invested significantly in strengthening its R&D and manufacturing capabilities, with the aim of developing and manufacturing advanced energy solutions in India for global markets.

The company’s portfolio includes LFP cells and battery packs designed for applications across electric mobility, industrial systems and energy storage. Its capabilities extend from cell technology and battery-pack development to the integration of battery management and monitoring technologies.

NASH Energy’s energy technology portfolio is complemented by firmware and battery management capabilities developed by NASH Industries, including Battmonx, Battery Management Systems (BMS) and EVolt. These technologies enable battery monitoring, management and automation, supporting the development of connected and intelligent energy applications.

Commenting on the company’s participation, Mr. Sanjay Wadhwa, Chairman & Managing Director, NASH Group, said, “The energy ecosystem is undergoing significant transformation, with growing requirements for reliable energy storage, intelligent battery management and connected technologies. At NASH Energy, we are building capabilities across the energy value chain, from LFP cells and battery packs to integrated energy-storage solutions. Our investments in R&D and manufacturing are focused on developing scalable, application-specific energy solutions from India for global markets. Middle East Energy provides an excellent platform to engage with customers and partners in the region, understand their evolving requirements and demonstrate how our technologies can support the next generation of energy applications.”

NASH Energy’s solutions cater to applications across automotive and electric mobility, renewable energy, industrial equipment, energy storage and other emerging energy applications. The company’s integrated approach combines battery technology, engineering and manufacturing capabilities to support customers from product development through to scalable production.

The Middle East is emerging as an important market for energy storage and intelligent energy solutions as industries and infrastructure increasingly seek reliable, efficient and scalable energy technologies. Through its participation at Middle East Energy 2026, NASH Energy aims to engage with customers, technology partners and industry stakeholders and explore opportunities to develop application-specific solutions for the region.

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Electronic waste has the potential to be a source of valuable metals because a group of scientists have developed an experimental method for recovering gold from electronic waste. A research group at ETH Zurich has identified an experimental way to selectively recover gold from e-waste and have then gone on to converted the recovered material into a gold containing nugget.

Gold’s properties of electrical conductivity and resistance to corrosion make it ideal for use in components in semiconductor devices. Unfortunately, recovering gold from old computer circuit boards can be challenging, and old methods can use up huge amounts of electricity with and also harmful chemicals which generate hazardous waste and potentially harmful emissions that can pollute the environment and pose risks to human health.

A team of researchers at ETH Zurich manufactured a porous protein-based aerogel which is selective in terms of gold ion binding from solutions that contain metals recovered from discarded computer equipment. The team recovered metal material from 20 computer motherboards, dissolved them in an acid solution and tested how selective was the recovered material.

The solution obtained now consisted of several species of metal ions. The researchers then added the aerogel. The aerogel captured the gold ions from the solution. The captured gold was subsequently converted into flakes, and melted to produce a solid gold nugget.

The reported experiment produced approximately 450 mg of a metal nugget from 20 discarded computer motherboards, containing 91% gold and 9% copper, corresponding to approximately 21-22 carats. This research demonstrated a gold absorption capacity on the scale of 166.7 mg/g of aerogel which is considerably high.

The technology could create a method for extracting precious metals from abandoned PCs and other electronic waste items and help further a circular economy in the process. According to the ETH Zurich economic analysis, the cost of combined material sourcing and energy during recovery of precious metals were substantially lower than the value of the recovered gold under the study’s assumptions.

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The EV charging infrastructure sector in India is moving away from merely providing hardware to offering digitally connected and interoperable charging services. A prime example of this transition is the recent partnership between Hyundai Motor India (HMIL) and Jio-bp, aiming to combine the EV charging infrastructure with its digital platform, making it easier for EV users to discover and access charging stations.

As part of the new collaboration, Hyundai Motor India will now be connecting over 7,000 Jio-bp pulse charging points across more than 300 Indian cities directly into its myHyundai application. Through this, the total number of available charging points through myHyundai app grows to more than 37,000, thereby making charging options readily available for EV customers at one place.

The primary purpose of this collaboration is to offer improved accessibility and convenience for EV charging stations using a digitally integrated approach. Rather than drivers having to search across multiple charging apps, the myHyundai platform can allow drivers to be connected to more of the charging network through a single platform.

This highlights the increasing significance of interoperability within the EV ecosystem. With individual charge point operators running their own networks, apps and payment systems, incompatible digital ecosystems can fragment the public charging experience for EV drivers. Software linking networks together can reduce this fragmentation.

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