ELE Times

Enables simple, fast, and secure IoT implementations for OEMs

Avnet’s second release of IoTConnect on Amazon Web Services (AWS) allows Original Equipment Manufacturers (OEMs) to build intelligent Internet of Things (IoT) devices faster. This full-featured release now incorporates key features such as support for AWS IoT Greengrass, built-in dynamic dashboards, a smart rules engine, and Artificial Intelligence (AI) model management and deployment. These features benefit OEMs by allowing them to focus on the development of features and applications that truly elevate their connected products.

Building on the first release of IoTConnect on AWS launched in February, this second release helps OEMs of IoT solutions design their products more efficiently and reduce their time to market by more than 50%.

Avnet’s IoTConnect platform is created to seamlessly connect devices and gain insights from the collected data to make better business decisions. This full-fledged platform as a Service (PaaS) allows for device communication and management, data storage, app creation, and enablement of robust security protocols.

Clear-Vu, a market leader in the design, development, and manufacturing of innovative LED lighting, is embracing Avnet’s IoTConnect. “We are excited to work with Avnet and leverage the power of AWS, as their robust hardware and cloud capabilities are poised to accelerate our continual journey towards creating innovative lighting solutions,” said Nick Russo, national director of Sales at Clear-Vu. “Their combined expertise in creating connected solutions and scalable infrastructure should enable us to enhance our product offerings and create transformative experiences for our customers.”

This IoTConnect platform addresses the challenges that come with cloud-connected solutions like scalability, reliability, maintenance, and security, making it easier for OEMs to bring their products to market quickly and successfully.

“Today’s second release of IoTConnect on AWS significantly expands the features available for OEMs to design, build, deploy, and manage cloud-connected devices, applications, and solutions at scale,” said Lou Lutostanski, vice president of IoT, Avnet. “To further reduce OEMs’ development time, Avnet has also teamed up with leading microcontroller manufacturers to pre-connect their hardware solutions to IoTConnect.”

“Collaboration with Avnet is instrumental in AWS’s mission to accelerate and empower customers with IoT solutions that mitigate the complexities that hinder their journey to market,” said Yasser Alsaied, vice president of IoT at AWS. “Together, we are driving innovation, enabling OEMs to build IoT solutions from edge to cloud with ease and at scale.”

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For hazardous locations that require use of an explosion-proof motor, Kollmorgen’s Goldline EB series of ATEX Certified and IECEx/cETLus Listed servo motors now includes the 480 Vac Goldline EBH.

Kollmorgen, a global leader in motion control systems, announced ATEX certification and IECEx/cETLus listing for the explosion-proof Goldline EBH 480 Vac servo motor. These new explosion-proof approvals for the high-voltage Goldline EBH servo motor exemplify Kollmorgen’s commitment to advancing the state of the art in motion control and meeting the most demanding application requirements. The high-voltage Goldline EBH servo motor joins a broad selection of Kollmorgen explosion-proof motors certified and listed according to UL, ATEX, IECEx, and/or CSA standards. Explosion-proof motors are required in hazardous locations where flammable gases, mists, or vapors may exist in explosive or ignitable concentrations. Such environments are often found in mines, oil & gas refineries, textile mills, and industrial paint booths.

For high-voltage applications in hazardous locations, Goldline EBH servo motors offer speeds up to 7,500 rpm with exceptionally high torque density for maximum performance in a minimal installation footprint. Rugged resolver feedback and a built-in thermostat support reliable operation under harsh environmental conditions. Goldline EBH servo motors in frame sizes 1 – 6 join other explosion-proof motors in the Goldline EB family that meet ATEX/IECEx standards, and more specifically CE 0081 Ex II 2 G Ex d IIB T3 Gb –40ºC ≤ Ta ≤ 40ºC. This classification indicates that the motors are suitable for use in any above-ground industry where easily ignited gases such as ethylene are likely to be present in the atmosphere for 10 to 1,000 hours/year during normal operation (Zones 1 and 2). Kollmorgen applies a flameproof method of protection to the motor so that any internal ignition is contained within the motor housing without the possibility of escape into the external atmosphere. The maximum surface temperature of the motor under fault conditions is 200°C.

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Overcoming complexity and the limitations of legacy tools unable to keep pace with the speed of AI, SkopeAI democratizes advanced data protection for every user

Netskope, a leader in Secure Access Service Edge (SASE), announced new solution offerings from SkopeAI, the Netskope suite of artificial intelligence and machine learning (AI/ML) innovations available across the Netskope portfolio. SkopeAI capabilities use AI/ML to deliver modern data protection and cyber threat defense, overcoming the limitations of conventional security technologies and providing protection using AI-speed techniques not found in products from other SASE vendors.

The role of AI/ML innovation in improving data protection and threat defense is urgent and pervasive. According to IDC projections, nearly 80% of an estimated 175 zettabytes of data by 2025 will be unstructured, meaning the data will be in such forms as screenshot images, generative AI application prompts, messages in collaboration apps, and numerous others that legacy protection tools can’t adequately identify or analyze, let alone protect.

At the same time, the continued enactment of privacy compliance regulations makes the safeguarding of sensitive data non-negotiable for every business, even as enterprises worldwide also confront critical questions of effectively using AI while safeguarding against its dangers. According to data from Netskope Threat Labs’ latest Cloud & Threat Report, generative AI app use in the enterprise is rapidly increasing—up 22.5% over the past few months—with organizations of 10,000 users or more accessing at least five generative AI apps daily. Among those users, source code is being posted to the most popular generative AI app, ChatGPT, at a concerning rate of 158 incidents per month.

Enter SkopeAI. SkopeAI innovations in the Netskope unified SASE platform use AI/ML to leapfrog traditional security, protect enterprises from AI-generated threats and data loss from the misuse of ChatGPT and other popular generative AI tools, and bring data protection and threat defense techniques into the modern era with unprecedented speed and simplicity. Unique SkopeAI capabilities include:

• Deep contextual awareness enabling advanced DLP to identify, analyze, and protect structured and unstructured data
• Automated ML data classification and Train Your Own Classifiers (TYOC) technology, which automatically identifies and categories new data based on a “train-and-forget” approach, ensuring data protection adapts and applies well beyond what standard data identification can achieve
• AI-based threat protection, which provides unparalleled speed and exceptional results in detecting a wide range of threats, including multifarious attacks, polymorphic malware, novel phishing web domains, zero-day threats, and malicious web content
• The recent expansion of Netskope Intelligent SSE to provide safe enterprise enablement of generative AI applications such as ChatGPT using advanced data protection techniques
• AI-driven SD-WAN operations, which proactively monitor the network, provide predictive insights, simplify management, minimize support tickets, and troubleshoot devices remotely, resulting in improved network performance and user experience.

“Forward-thinking technology companies such as Netskope were using AI and ML for security innovation long before it was trendy to say so—it’s been in our products since the day Netskope was founded,” said Sanjay Beri, CEO and co-founder, Netskope. “But only Netskope has fully aligned the use of AI/ML with the needs of modern security and threat defense—democratizing access to data security techniques that move at speeds the era of AI now requires. SkopeAI unleashes the power of AI/ML to protect structured and unstructured data and defend enterprises from ever-evolving threats.”

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OMRON, a leading provider of end-to-end industrial automation solutions, has announced the launch of its new OMRON TM20 cobot with a payload of 20 kg. The new cobot is well-equipped to automate palletizing, machine tending, and material handling whilst managing heavy payloads.

The robot is the latest addition to the OMRON family of TM cobots, which are well renowned for their ease of use, reliability, and safety in industries such as food & beverage manufacturing, environment mobility, end-of-line packaging solution makers, and logistics solution providers to name just a few. Just like other robots of OMRON, this is also designed to work seamlessly with other OMRON products including sensors, controllers, and software, to provide a comprehensive automation solution for manufacturers.

Other unique traits of OMRON TM20 are its lightweight design- weighing in at just 33 kg, small footprint, and a reach of 1.3 meters that make it easier to integrate with mobile robots, providing greater flexibility and efficiency in industrial environments. The robot also comes equipped with special joint covers to protect it from cutting oil and other hazardous materials, making it suitable for use in machine tending applications, and an integrated camera (as an option) to identify & differentiate infeed production flow from mixed production lines.

Sameer Gandhi, MD, OMRON Automation expressed his enthusiasm for the launch of the OMRON TM20. “This new addition to our cobot family is to strengthen the value generation for our customers to make them automate heavy payload applications and achieve more out of their operations. It provides operators with relief from tasks that involve heavy lifting while ensuring that it operates safely alongside people. We look forward to collaborating with the right solution partners to co-create & develop advanced industrial solutions based on the human-machine collaborative technology the robot offers,” he shared.

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Customers can now design and debug software for Renesas Embedded Processors in VS Code; Complements Renesas’ Own e2 studio IDE

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that customers can now use Microsoft® Visual Studio Code (VS Code) to program the complete line of Renesas microcontrollers (MCUs) and microprocessors (MPUs). Renesas has added tool extensions for all of its embedded processors to the Microsoft VS Code website, enabling a huge base of designers comfortable with the popular Integrated Development Environment (IDE) and code editor to work in their preferred environment.

The popular VS Code IDE simplifies and accelerates code editing across a variety of platforms and operating systems. By providing support for VS Code, Renesas now enables a vast number of designers to create efficient embedded solutions with Renesas devices. VS Code support complements Renesas’ own powerful and flexible e2 studio IDE used by thousands of designers worldwide.

Renesas now enables customers to develop and debug embedded software using Visual Studio Code for its 8/16-bit RL78 and 32-bit RA, RX, and RH850 MCUs, as well as its 64-bit RZ MPUs and R-Car family SoCs. Renesas embedded processors are targeted at automotive, IoT, industrial automation, home appliance, health care, and other applications.

“As the world’s leading MCU supplier, Renesas has a huge and loyal customer base, most of whom use our powerful e2 studio IDE to develop their applications,” said Akiya Fukui, Vice President and Head of the Software Development Division at Renesas. “By providing support for VS Code, we enable an even larger group of designers to develop embedded applications with Renesas embedded processors.”

“We welcome Renesas, a leader in the embedded processor market, to the Visual Studio Code community,” said Marc Goodner, Principal Product Manager, Microsoft. “The millions of developers using VS Code now have access to the very broad and efficient line of MCUs and MPUs from Renesas.”

Users can download VS Code free of charge, including access to the source code. They can use the GitHub pull request extension to make a source repository, then review and edit source code using VS Code. They can also utilize evolving extension features with simple user interface or flexible command interfaces.

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The rapid rollout of AI and other disruptive technologies is creating unprecedented cybersecurity challenges for enterprises in all industries

Wipro Limited, a leading technology services and consulting company, released the 2023 edition of its State of Cybersecurity Report (#SOCR). The report presents an in-depth look at cybersecurity trends across three geographies and seven industry sectors. It gives security leaders valuable insights on industry trends, allowing them to benchmark their cyber journey against their peers and determine actions they need to take to achieve cyber resilience in the future.

“CISOs are facing unprecedented disruptive changes across the cybersecurity landscape,” said Tony Buffomante, Senior Vice President & Global Head – Cybersecurity & Risk Services (CRS), Wipro Limited. “Just as the cloud adoption journey is starting to mature, the new frontier of generative AI has data flowing faster in an environment without boundaries or developed controls. Wipro is uniquely positioned to help clients navigate this new frontier.”  

Wipro’s findings summarize the current state of cybersecurity within four pillars of resilience:

• Cyber-attacks, breaches, and law
• Enterprise cyber capabilities
• Collaboration
• Future of cybersecurity

“Political and economic uncertainties, coupled with the rise of sophisticated new technologies, including generative AI and machine learning, is creating a widening cyber resiliency gap within many enterprises,” said Josey George, SOCR Editor, General Manager, Strategy and M&A, Wipro CRS. “The insights and recommendations in the SOCR will help organizations identify security, risk, and compliance concerns and provide a path to achieving more resilient operations that can support strategic, business-aligned objectives.”

The report included responses from the security leadership of 345 organizations across the US, Europe, Asia Pacific Middle East, and Africa regions, who responded to 30 questions around trends, governance, security practices, collaboration, and best practices. The Wipro analysis of nation-state attacks is based on 1,110+ attack data points gathered by the Council on Foreign Relations. Insights on breach notification and global data-transfer laws are based on data aggregated from multiple laws and government websites regarding regulations in 23 countries. Finally, the Wipro research team analyzed more than 24,900 global patent filings across 21 countries.

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[July 31, 2023 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 6 – 8, 2023. Visit booth #I2800 to experience the latest in Smart Factory Semiconductor Inspection.

TRI’s AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

For the first time, TRI will be exhibiting the Wafer Inspection Platform, TR7950Q SII, equipped with a state-of-the-art mechanical structure, an optimal 2.5 µm high resolution, with an outstanding 25MP camera. The TR7950Q SII is equipped with an innovative optical module for the inspection of highly reflective surfaces, specialized for Wafer Inspection.

TRI will showcase the latest 3D SPI with a 3.5 µm high-resolution 25MP Camera, TR7007Q SII, and the AI-powered 3D AOI, TR7700Q SII, with the improved 25MP 2.5 µm configuration. The TR7007Q SII and the TR7700Q SII represent TRI’s latest inspection innovations for the Advanced Packaging and Semiconductor Industry. The lineup will also include an X-ray Inspection Demo Station and TRI’s innovative AI Solutions, which include the AI Station, AI Training Tool, and the AI Verify Host.

Visit TRI’s Booth No. I2800 at SEMICON Taiwan 2023 to learn more about TRI’s SEMI applications and the latest innovations in Test and Inspection for the Advanced Packaging Industry.

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.

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Planned center to bring together global and domestic suppliers and academic institutions to accelerate the development and commercialization of technology for semiconductor manufacturing equipment, enabling India’s readiness for a high-volume manufacturing ecosystem

Applied Materials, Inc. announced the company’s engagement with more than 40 suppliers and academic institutions as part of the company’s planned collaborative engineering center in Bengaluru. Participating at SemiconIndia 2023, the company is focusing on close collaboration among the country’s top engineers, academia, and suppliers to accelerate innovation in semiconductor manufacturing equipment technologies and build a robust domestic semiconductor ecosystem. The planned center aims to harness the collective expertise of the industry stakeholders and spearhead breakthrough ideas related to India’s domestic semiconductor supply chain and talent development.

Applied aims to reduce the time to commercialization and develop a sustainable semiconductor ecosystem in India. Through its engagement with leading global semiconductor supplier organizations, the center will be designed to provide access to advanced equipment and processes for suppliers to test and validate their solutions, while also creating opportunities to co-innovate, develop, and test equipment subsystems and components to accelerate cycles of learning and speed up the adoption of new concepts. Supporting the objective, Applied is also partnering with top-tier universities and institutions both for innovation and to help develop a capable workforce to support the domestic semiconductor ecosystem.

“This is a pivotal moment for India to position itself as a key player in the global semiconductor landscape,” said Prabu Raja, President of the Semiconductor Products Group at Applied Materials. “The establishment of Applied’s collaborative engineering center will be a significant milestone in our commitment to fostering innovation and collaboration in the semiconductor ecosystem in India. The center will promote synergy among industry stakeholders and cultivate a culture of technical research, skill development, and knowledge sharing.”

“We have embarked on a transformative journey to power India’s semiconductor mission,” said Srinivas Satya, Country President of Applied Materials India. “Our objective is to change the way we engage with chipmakers, universities, and other partners to enhance time to market, reduce R&D costs and increase the overall success rate of new technologies. Simultaneously, the center will provide guidance and technical expertise to semiconductor companies, assisting them in developing high-quality, cost-effective semiconductor products that cater to global and domestic markets while generating employment opportunities across various skill levels.”

Applied’s planned center is an integral part of the company’s global innovation approach and is designed to fundamentally change the way chips are made. The benefits of establishing the center in India will extend beyond the country’s domestic semiconductor ecosystem and contribute actively to the global semiconductor industry. With its rich pool of skilled engineers, strong academic foundation, and strategic supply chain partners, India is well-positioned to drive innovation in the global market. In its first five years of operation, the center is expected to create at least 500 new advanced engineering jobs along with potentially another 2,500 jobs in the manufacturing ecosystem.

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India Semiconductor Mission (ISM) Provides Key Endorsement of Event

SEMI announced its intent to support the India Semiconductor Mission (ISM) in creating a vibrant semiconductor manufacturing and design ecosystem in India. The collaboration would build on the successful execution of ISM’s two editions of SemiconIndia and continue SEMI’s tradition of bringing together stakeholders in the global end-to-end semiconductor ecosystem. A Memorandum of Understanding (MOU) is under development.

SEMI is in discussions with Electronic Industries Association of India (ELCINA) and Messe München India (MMI) as key partners to stage its flagship event.

The ISM has noted that SEMICON India would be highly complementary to efforts by the government of India to advance the domestic semiconductor ecosystem and connect to the global industry.

“For more than 50 years, the SEMICON platform has connected companies from across the global semiconductor industry to uncover new business opportunities, gain insights into market and technology trends, and collaborate to drive innovation and address top electronics industry challenges,” said Ajit Manocha, SEMI President and CEO. “With SEMI recognized worldwide as a key enabler of industry growth, the establishment of SEMICON India marks a significant step forward for the region.”

The partnership will give Indian semiconductor and electronics companies access to more than 2,500 SEMI member companies across the global semiconductor and electronics manufacturing and design supply chain. Additionally, SEMICON India will provide a platform for stakeholder participation in critical SEMI initiatives across areas including Workforce Development, Sustainability and Supply Chain Management to advance industry growth.

“India is all set as the next destination on the global map for semiconductor manufacturing,” said Bhupinder Singh, CEO of Messe München India. “We applaud initiatives by the India Semiconductor Mission to establish semiconductor design, manufacturing, packaging, capacity building as well as R&D in the region. Messe München India looks forward to work with SEMI to organize SEMICON India in collaboration with ELCINA, a partnership that is a natural extension of the longstanding work between Messe München and SEMI to stage events in Europe and China. Staying true to our purpose of enabling meaningful handshakes and unlocking business opportunities. This platform will integrate upstream and downstream value chains for wafer fabs and OSATs and help the India semiconductor and electronics industry become more self-reliant.”

“The semiconductor industry has taken centre stage in the electronic systems design and manufacturing ecosystem,” said Sanjay Agarwal, President of ELCINA and Managing Director at Globe Capacitors Ltd. “The industry is a strategic, vital enabler of economic growth in India. Coming together with SEMI as our partner is of great value as together we can strengthen the semiconductor industry in India and become a trusted partner to chip companies worldwide. We look forward to working with SEMI and leveraging our existing partnership with Messe München to make SEMICON India a grand success.”

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In today’s rapidly evolving industrial landscape, the convergence of physical machinery and digital technologies has given rise to the Industrial Internet of Things (IIoT). At the heart of this transformative wave lies the IIoT gateway, a critical component that acts as a bridge connecting the physical world of industrial devices and machinery with the digital realm of the internet.

The Industrial IoT Gateway acts as a communication hub between sensors and servers, collecting sensor data and transmitting relevant information to the cloud. By harnessing the power of connectivity, protocol translation, edge computing, and robust security measures, these gateways pave the way for enhanced operational efficiency, predictive maintenance, and accelerated industrial digital transformation.

The iWave Industrial IoT gateway is a powerful and versatile device that can be used to collect, process, and transmit data from a wide range of industrial sensors and devices. The gateway is based on a high-performance ARM Cortex A9 processor and supports a variety of wired and wireless connectivity options enabling seamless communication across the network.

iWave’s Industrial IoT Gateway Features

• Connectivity: The gateway supports a wide range of wireless connectivity options, including 4G LTE, LoRaWAN, Wi-Fi, and Bluetooth. This allows it to connect to a variety of industrial devices and sensors.
• Security: The gateway is designed to be secure and reliable. It includes a number of security features, such as TSL/SSL certifications, secure boot, 128-bit AES (LoRa) encrypt/decrypt, and authentication, to protect data from unauthorized access or tampering. It also features a watchdog timer to prevent the gateway from crashing.
• Powerful processor: The gateway is powered by a powerful ARM Cortex A9 processor, which provides the performance needed to run demanding industrial applications.
• Interfaces: The gateway supports a wide range of industrial interfaces, including Ethernet, USB, CAN, RS232, RS485, Analog Inputs, and Digital Inputs. This allows it to connect to a wide range of industrial equipment.
• Industrial Protocols: The gateway supports a wide range of industrial protocols, including MODBUS RTU/TCP, DLMS, HART, and PROFINET. This allows it to communicate with a wide range of industrial devices and systems.

• Cloud connectivity: The gateway can connect to the cloud, allowing it to send data to and receive commands from cloud-based applications. iWave IoT Gateway supports a wide range of cloud platforms such as Microsoft Azure, IBM Watson, AWS, Oracle, Cumulocity IoT, and Thingworx.
• Uninterrupted High-Accuracy Vehicle Location: High-precision GNSS (Global Navigation Satellite System) Module – GPS/GLONASS/BeiDou/Galileo
• System recovery and crash handling: Industrial IoT Gateway uses external watchdog timers to support the emergency safe shutdown and auto reboot logic to ensure that the gateway remains operational even in the event of a crash.
• Remote management: The gateway can be remotely managed, allowing administrators to configure and monitor the gateway from anywhere.
• Scalability: The gateway is built on a modular architecture that allows IoT sensors to be scaled-up or scaled down to meet the needs of any application. It can be easily expanded by adding additional modules, such as wireless connectivity, interface, and storage modules.

Industrial IoT Gateway and How to Pick the Right Fit

When choosing an IIoT Gateway, various key factors should be considered.

• Hardware modularity
• Software flexibility
• Security and connectivity options available on the module

Industrial IoT Gateways Use Cases and Deployment Options

Let’s look at a few real-world case studies to better understand the challenges of building industrial IoT gateways.

Factory Automation

Industrial IoT Gateways facilitate the communication between tens and thousands of IoT devices, machinery, sensors, and factory equipment, as well as communication between these devices and the cloud. They enable remote monitoring of factory assets and control of such assets.

Smart Manufacturing

The IIoT gateway enables real-time monitoring of PLCs, provides remote access for diagnostics and troubleshooting, offers data visualization and analytics, and allows for integration with higher-level manufacturing systems. It enhances the efficiency, visibility, and control of PLC operations, enabling proactive maintenance, optimization, and decision-making in manufacturing plants.

Smart Energy Consumption Monitoring

In industrial settings, IIoT Gateway can be used to regularly monitor and manage energy consumed by machines. Sensors, meters, and other IoT devices can be used to track how much energy each piece of equipment consumes. As a result, strategic actions can be taken to subdue the consumption of electricity and boost the overall efficiency of a facility by collecting energy utilization parameters.

Enterprise IIoT

An IIoT gateway for enterprise applications acts as a communication hub, connecting operational technology devices to the information technology infrastructure. It collects and transmits data from various devices, performs protocol translation, enables edge computing for faster insights, ensures data security, and facilitates integration with higher-level systems. The IIoT gateway streamlines data flow, enhances operational efficiency, and enables real-time monitoring and decision-making in enterprise environments.

Transformers

IoT gateways play a vital role in changing traditional transformers into intelligent, connected assets. They enable remote monitoring, diagnostics, predictive maintenance, fault detection, and easy integration with broad grid management systems. Sensors installed in transformers are used to collect real-time data such as temperature, oil levels, vibration, and electrical parameters to enable proactive maintenance.

Connecting IoT devices securely to the cloud and gathering data from them can be daunting, but it does not have to be. With features like remote management, network mapping, security options, and more, IoT Gateways provide an easier way to connect and manage everything from data security and connectivity protocol to edge computing.

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HSINCHU, Taiwan – August 1, 2023 – With Taiwan forecast to remain a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2023 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 6-8, 2023, at TaiNEX 1 and 2 in Taipei.

The largest SEMICON Taiwan ever, the event is expected to draw more than 50,000 attendees while featuring 3,000 booths and 850 exhibitors. Themed Inspire Innovation. Empower Sustainability, SEMICON Taiwan 2023 will offer more than 20 forums spotlighting critical semiconductor industry topics including:

• Advanced Manufacturing
• Heterogeneous Integration
• Compound Semiconductors
• Automotive Chips
• Smart Manufacturing
• Sustainable Manufacturing
• Semiconductor Cybersecurity
• Talent

Taiwan is projected to maintain a top position in purchases of chipmaking equipment in 2023 and 2024, according to the recent Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective announced by SEMI.

“The semiconductor industry is the main driving force for technology development and critical to innovations that promise to help overcome some of the world’s greatest challenges,” said Terry Tsao, Global Chief Marketing Officer at SEMI and President of SEMI Taiwan. “SEMICON Taiwan 2023 will bring together representatives from the global microelectronics industry, governments, academia and research to set a path to a more prosperous, sustainable future.”

Top semiconductor industry executives will gather at the CEO Summit to examine vital innovation trends and keys to the industry’s success over the next 20 years. Featured speakers will include:

• Tien Wu, CEO of Advanced Semiconductor Engineering (ASE)
• Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC)
• Anirudh Devgan, President and CEO of Cadence Design Systems
• Tim Archer, President and CEO of Lam Research
• Toshiki Kawai, President and CEO of Tokyo Electron (TEL)

Top industry analysts will explore market trends, present industry forecasts and provide insights into how companies across the semiconductor ecosystems can navigate the unpredictable market environment. Speakers will include analysts from Gartner, McKinsey & Company, Morgan Stanley, Mizuho Bank, the SEMI Market Intelligent Team (MIT), and TechInsights.

With Taiwan a vital and reliable partner in the global economy, many regions have sought cooperation with the region in order to better adapt to a rapidly changing industry. Toward that end, SEMICON Taiwan 2023 will feature eight country pavilions including Australia, the Czech Republic, the UK, Italy, Japan, Poland and Singapore. In addition, the Silicon Europe Pavilion will feature Dutch and German exhibitors.

SEMICON Taiwan 2023 will feature 12 theme pavilions to showcase areas key to semiconductor industry growth including Heterogeneous Integration, Compound Semiconductor, Materials, Green Manufacturing, and Workforce Development.

The event will also host Smart Manufacturing Journey, themed AI-Driven Innovation of Future Automation. The interactive exhibition of virtual and real integration technology will showcase powerful, innovative artificial intelligence (AI) technologies and the latest developments in robotics and automation.

SEMICON 2023 will also include:

• Smart Manufacturing Expo Taiwan
• Heterogeneous Integration Global Summit
• Strategic Materials Conference Taiwan
• FLEX Taiwan 2023

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Electronic Industries Association of India (ELCINA) and SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, are jointly participated in the prestigious SemiconIndia 2023 Exhibition. The six-day event, underway at Mahatma Mandir, Gandhinagar, Gujarat, India from 25th July to 30th July, features three days exclusively dedicated to the student community for their skill development and three days exclusively for the business community.

The ELCINA SEMI pavilion witnessed an illustrious gathering of industry leaders, including esteemed ELCINA members such as Semiconductor Laboratory, Sahasra Semiconductors, Applied Materials India, Imagine Marketing, Kaynes Technology, Bergen Group, Continental Device, PCB Power, HLBS Tech, Tesscorn Nanoscience, Highness Microelectronics, Rakon India, ESSCI, Matrix Comsec, and RIR Power Electronics. The event served as a remarkable platform to showcase the vast potential of India’s burgeoning semiconductor ecosystem.

ELCINA’s dedicated efforts in the semiconductor domain have led to significant collaborations with prestigious organizations, including SEMI USA, government laboratories specializing in semiconductors such as GATEC, SCL, and SSPL, as well as academic institutions like IIT, IISC, and Manav Rachna University. These partnerships aim to drive innovation, research, and skills development in the semiconductor industry.

SemiconIndia 2023 is highlighting ELCINA’s notable contribution through the Semiconductor Special Group, a strategic initiative designed to tackle the distinctive challenges and opportunities encountered by the Indian semiconductor sector. This group is composed of two essential wings – the Workforce Development SIG and the Supply Chain SIG, each dedicated to enhancing crucial aspects of the semiconductor industry in collaboration with ESSI and SEMI.

Workforce Development SIG: The Workforce Development SIG’s primary objective is to bridge the skills gap in the semiconductor industry by fostering talent development and upskilling.

Supply Chain SIG: The Supply Chain SIG focuses on strengthening the semiconductor supply chain ecosystem in India. Through the ELCINA B2B portal, this wing aims to facilitate networking and collaboration among semiconductor supply chain players.

SemiconIndia Exhibition serves as a prominent platform for industry players to showcase their latest technologies, products, and services, fostering collaboration and networking within the semiconductor community.

Representing the Indian electronics industry, ELCINA is underscoring the remarkable strides made by the Indian semiconductor sector and underscore the pivotal role of local companies in the global supply chain. The exhibition provides a unique opportunity for ELCINA members to showcase their expertise and contributions to the semiconductor ecosystem.

Shri. Ajit Manocha, the President & CEO of SEMI, has emphasized the active role that SEMI plays in collaboration with ELCINA to make India a preferred destination in the semiconductor industry. This collaboration reflects the shared vision of both organizations to promote and strengthen the semiconductor ecosystem in India.

“We are thrilled to be a part of SemiconIndia 2023, as it provides an excellent platform for ELCINA and its members to demonstrate our technological capabilities,” said Shri Sanjay Agrawal, President of ELCINA. “Through this event, we aspire to promote the growth of the Indian semiconductor industry and foster collaborations that will drive its continued success.”

In addition to the exhibition, ELCINA actively engages in seminars and knowledge-sharing sessions, contributing valuable insights and perspectives on industry trends, challenges, and opportunities. The association endeavors to engage with attendees, industry stakeholders, and policymakers during the event.

ELCINA wholeheartedly welcomed the SemiconIndia 2023 event in Gandhinagar, Gujarat, and the Meity initiative aimed at promoting chip manufacturing in India. The Union government’s allocation of a $10 billion dedicated fund through the incentive scheme is a significant milestone, showcasing a strong commitment to attract investments and enhance the country’s domestic chip manufacturing capabilities.

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With the growing amount of electronic waste generated by consumers, industry and other sectors, it is critical to address this specific environmental issue. Reducing the carbon footprint and promoting sustainability are therefore key to achieving climate goals and improving environmental protection. This is why Infineon Technologies AG is taking another important step towards a greener future with the introduction of Soluboard®, a recyclable and biodegradable printed circuit board (PCB) substrate based on natural fibers and a halogen-free polymer. The product was developed by UK start-up Jiva Materials and helps to reduce the carbon footprint of the electronics industry.

Soluboard’s plant-based PCB material is made from natural fibers, which have a much lower carbon footprint than the traditional glass-based fibers. The organic structure is enclosed in a non-toxic polymer that dissolves when immersed in hot water, leaving only compostable organic material. This not only eliminates PCB waste, but also allows the electronic components soldered to the board to be recovered and recycled. By using Soluboard for its demo and evaluation boards, Infineon is making another important contribution to the testing of sustainable designs in the electronics industry.

“For the first time, a recyclable, biodegradable PCB material is being used in the design of electronics for consumer and industrial applications – a milestone towards a greener future,” said Andreas Kopp, Head of Product Management Discretes at Infineon’s Green Industrial Power Division. “We are also actively researching the reusability of discrete power devices at the end of their service life, which would be an additional significant step towards promoting a circular economy in the electronics industry.”

“Adopting a water-based recycling process could lead to higher yields in the recovery of valuable metals,” said Jonathan Swanston, CEO and co-founder of Jiva Materials. “In addition, replacing FR-4 PCB materials with Soluboard would result in a 60 percent reduction in carbon emissions – more specifically, 10.5 kg of carbon and 620 g of plastic can be saved per square meter of PCB.”

Currently, Infineon is using the biodegradable material to reduce the carbon footprint of demo and evaluation boards – but is also exploring the possibility of using thematerial for all boards to make the electronics industry more sustainable. In doing so, Infineon is following the European Commission’s “Green Deal” agenda, which aims to achieve climate neutrality by 2050 by making circularity the mainstream in our lives and accelerating the greening of the EU economy. In addition, the company is committed to the responsible collection and recycling of electronic products manufactured by Infineon in accordance with the EU Directive on Waste of Electrical and Electronic Equipment (WEEE).

Infineon has produced three different demo boards using Soluboard technology and plans to expand its offering over the next few years. More than 500 units are already in use to showcase the company’s power discretes portfolio, including one board that features components specifically for refrigerator applications. Based on the results of ongoing stress tests, the company plans to provide guidance on the reuse and recycling of power semiconductors removed from Soluboards, which could significantly extend the lifetime of the electronic components.

The research will also provide Infineon with a fundamental understanding of the design and reliability challenges customers face with the new material in their core applications. In particular, customers will benefit from the new knowledge as it will contribute to the development of sustainable designs.

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Amphenol RF expands its TNC product portfolio with new sealed rear mount bulkhead configurations designed for popular low loss cable types.

Amphenol RF is pleased to announce the expansion of the popular miniature sized TNC interface with additional configurations designed to accommodate micro coax cable types. These new configurations are IP67 rated which makes them ideal for applications that may experience temporary water or dust ingress due to exposure to external elements in harsh environments. They are ideal for outdoor use in antenna and industrial solutions.

These IP67 rear mount bulkhead jacks are manufactured mainly with nickel-plated, brass components including the body, hex nut, lock washer, inner ferrule and sleeve. The contact is constructed from gold-plated, beryllium copper. They are designed for use with 0.81 and 1.37 mm ultra-flexible micro coaxial cable with rear mounting for easy and secure mounting on the inside of a panel. These connectors offer an additional layer of protection for systems that may otherwise be compromised by weather-related issues.

The sealed TNC jacks join a growing portfolio of IP-rated products available at Amphenol RF. These products are well suited for remote outdoor enclosures, portable radios, handheld equipment and industrial and military equipment.

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Infineon Technologies AG introduces the new XENSIV 60 GHz radar sensor BGT60UTR11AIP. With a compact size of only 16 mm², it is the smallest 60 GHz radar sensor with antennas in package (AIP) on the market and is specifically designed for integration into the smallest devices. This makes the sensor ideal for vital sensing (heart and respiratory rate) and healthcare devices such as baby monitors and sleep trackers. It is also suitable for consumer electronics such as laptops, TVs and cameras, as well as smart home and building devices such as air conditioners, thermostats and smart doorbells. The radar sensor can also be used in industrial applications including robotics and tank level measurement.

The monolithic microwave integrated circuit (MMIC) is based on Infineon’s B11 SiGe BiCMOS technology, which ensures excellent radio frequency (RF) performance. The chip features an ultra-wide bandwidth of 5.6 GHz and a ramp speed of 400 MHz/µs. As a result, the sensor enables high-resolution frequency modulated continuous wave (FMCW) operation with sensitive presence and motion detection at a range of up to 15 m (50 ft). In addition, the sensor enables precise distance measurement, 1D gesture and vital sign detection, all with sub-mm motion detection capabilities. The integrated antennas provide a ±60° field of view. In addition, an integrated state machine enables real-time data acquisition without processor interaction. The MMIC also includes a 12-bit analog-to-digital converter (ADC) with a sampling rate of up to 4 MSPS (Mega Samples per Second).

The MMIC’s built-in broadcast mode allows multiple chips to be synchronized. It also includes on-chip sensors for measuring Tx output power and temperature. In addition, the sensor features ultra-low power operation enabled by hardware deep sleep mode. Its high integration level makes this MMIC ideal for optimizing system costs.

The XENSIV 60 GHz radar BGT60UTR11AIP can be ordered now and will begin shipping in the fourth quarter of 2023. For an initial evaluation of the radar sensor, Infineon provides the DEMO BGT60UTR11AIP and the Radar Development Kit (RDK), both available for download from the Infineon Developer Center (IDC).

In addition, Infineon’s associated partner RFbeam Microwave has integrated the BGT60UTR11AIP radar transceiver into its new V-LD1 level measurement module. RFbeam also offers an evaluation kit for the V-LD1 module, which can be used in conjunction with a lens to focus the radar beam to an area of 8 x 8.

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Asahi Kasei Microdevices (AKM) has launched the AK7709VQ, a new multicore digital signal processor (DSP) conceived for next-generation in-vehicle sound design. This powerful DSP enables the real-time largescale computational processing required to provide an immersive sound experience for passengers.

With the advent of self-driving cars, there will be less need for passengers to focus on the traffic, allowing more time to be spent on work, entertainment, or relaxation. As passengers’ expectations for the automotive environment evolve, the ability to create a customized, quiet setting with an accompanying premium listening experience will become a key differentiator for the in-cabin user experience.

As a total solution provider for the in-vehicle sound environment, AKM has provided premium sound technology used in cars around the world for more than 20 years. Bringing its expertise in the field of active premium sound to the next level, the company’s launch of the new AK7709VQ DSP further boosts the potential for a natural and immersive in-vehicle sound experience.

With a processing capability of 7,000 MIPS (Millions of Instructions per Second) and 2.75 MB of integrated memory, the AK7709VQ performs real-time high-resolution audio processing for multichannel speaker arrays, enabling a quiet cabin with immersive, incredibly detailed music playback. Additionally, the two integrated HiFi 4 DSP cores support various third-party software. The AK7709Q’s unique feature set, which features high sample rate multi-microphone voice processing, also allows for hands-free and in-car communication.  The built-in audio hub function, which includes 20 channels of asynchronous hardware sample rate conversion (ASRC), supports flexible digital input/output to and from many digital sources and endpoints.

In addition, AKM has applied its acclaimed audio PCB (Printed Circuit Board) design expertise to develop a sound design demo board combining the new DSP with the AK4499EXEQ, AKM’s flagship digital audio converter (DAC). This system demonstrates immersive in-vehicle sound and can be experienced by customers in demo cars at the company’s Garage Labs in Tokyo, Shanghai, and Shenzhen. Additional Garage Labs will make this experience available in North America and Europe in the fourth quarter of 2023.

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India’s leading EV Charger manufacturer Servotech Power Systems Ltd. is pleased to announce the establishment of a wholly owned new subsidiary Techbec Green Energy Pvt. Ltd. with the aim to indigenously manufacture key components for Electric Vehicle (EV) chargers. The subsidiary will be equipped with a state-of-the-art manufacturing facility spanning across 40,000 sq. ft. in Sonipat, Haryana, and will focus on the manufacturing of key EV charger components like Power modules, CCS 2 guns, Type 2 guns, Connectors, Control Cards, and PLC Modules and Lithium-ion Batteries.

Servotech along with its subsidiary envisages an initial investment of ₹30 Crores, which will be utilized to procure testing equipment, manpower, machinery, and cutting-edge technology and supporting other allied activities. Further, the company along with the subsidiary plans to invest ₹300 Crores additionally by March 2025 with an aim to achieve a prominent operational scale. Further to streamline the corporate structure, Servotech is divesting its stake of 63.5% in its subsidiary Techbec Global Solutions Pvt. Ltd.

This strategic decision to offer high-quality, domestically made components for EV charging infrastructure aligns perfectly with Servotech’s commitment to supporting the Make in India initiative while contributing to India’s transition towards cleaner and greener energy solutions.

Commenting on the announcement, the Founder and MD of Servotech, Raman Bhatia, stated “We are pleased to announce the establishment of our new subsidiary Techbec Green Energy Pvt. Ltd. Servotech together with its subsidiary, is set to embark on an initial investment of ₹30 Crores. This capital will be allocated towards acquiring testing equipment, hiring skilled manpower, obtaining advanced machinery and technology, and supporting other related activities. Furthermore, the company and its subsidiary intend to further invest ₹300 Crores by March 2025, aiming to attain a significant operational scale in the entire EV charging ecosystem. This capital infusion will serve to significantly bolster the company’s and its subsidiaries capabilities, unlocking its true potential for success.

This new subsidiary will have a team of experienced engineers and technicians. By manufacturing these key EV Charger components in-house, Servotech aims to enhance supply chain efficiency, reduce dependence on imports, and ensure the availability of safe, reliable and cost-effective solutions for the rapidly expanding EV market.

Our new subsidiary marks an important milestone in our journey towards supporting the widespread adoption of electric vehicles. By making EV charger components domestically, we aim to contribute to the Make in India initiative while ensuring availability of technologically advanced charging infrastructure for electric vehicle users.

Further, we would also like to highlight successful divestment of our subsidiary, Techbec Global Solutions Pvt. Ltd. that was primarily engaged in manufacturing battery storage solutions like lithium-ion batteries and other allied activities for EVs, E-rickshaws and varied solar-powered solutions. While the subsidiary has shown promising growth and achievements, the management envisions future goals that demand a broader platform for expansion and innovation. As part of its long-term vision, Servotech aims to focus its resources and investments on ventures that offer greater potential for scalable growth and market penetration. The divestment allows Servotech to realign its portfolio, optimize its resources, and pursue new opportunities in line with its core business objectives.  

Servotech aims to strengthen its position as a key player in the clean energy ecosystem and drive the transition to sustainable transportation. We remain committed to developing innovative solutions that contribute to be above mentioned mission.”

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Infineon Technologies AG, a global leader in power semiconductors, and SolarEdge Technologies, Inc. (“SolarEdge”), a global leader in smart energy technology, today announced the signing of a multi-year Capacity Reservation Agreement (CRA).

Extending the existing partnership, Infineon will supply SolarEdge with critical components for a variety of SolarEdge products. In addition to the CRA, the companies will collaborate on the development of future technologies and cutting-edge solar products based on wide-bandgap (WBG) materials that are key for global green energy supplies.

“We are excited to expand our strategic partnership with SolarEdge to shape innovation in green energy technologies and decarbonization”, said Andreas Urschitz, Chief Marketing Officer at Infineon. “Our long-lasting collaboration is an enormous asset for both companies that paves the way for breakthrough-innovation and accelerated growth, as we combine our expertise and resources. With the latest investments in silicon carbide (SiC) and gallium nitride (GaN) manufacturing capacity, Infineon underlines its commitment to be a leading partner in climate technologies such as solar power.”

Uri Bechor, Chief Operating Officer at SolarEdge, said: “Securing the capacity levels of critical components such as power and wide-bandgap from Infineon enhances SolarEdge’s supply chain resiliency. This Capacity Reservation Agreement with Infineon is in line with our strategy to continue leading the global industry in solar energy advancement.”

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Compliant With the ONFI 1.0 Specification, 1Gb to 8Gb AS9F Series Devices Deliver Fast Block Erase Times Down to 3 ms

To meet the increasing demand for legacy SLC parallel NAND flash memory products in the automotive, industrial, communications, and consumer electronics markets, Alliance Memory today introduced the new AS9F series of 1.8V and 3.3V devices with densities from 1Gb to 8Gb and fast block erase times down to 3 ms typical.

“While new designs are migrating toward serial NAND flash for mass storage, many of our customers’ existing designs still require parallel NAND flash solutions, which are becoming increasingly difficult to find,” said David Bagby, president and CEO of Alliance Memory. “With our AS9F series, we’re perfectly positioned to provide our customers with a reliable source for these cost-effective solutions moving forward, saving them the expense of redesigns.”

Compliant with the ONFI 1.0 specification and offering an x8 I/O interface, the memory solutions released today are ideal for use in chipsets for Wi-Fi routers, DSL and cable modems, set-top boxes, digital TVs, artificial intelligence (AI) speakers, Internet of Things (IoT) devices, and more. Divided into blocks that can be erased independently, AS9F series products allow valid data to be preserved in these applications while old data is erased.

Delivering reliable, long-term performance, the parallel NAND flash devices feature 100,000 program/erase cycles — with 4-bit ECC per 528 bytes — and 10-year data retention. Offered in the 9.0 mm by 11.0 mm by 1.0 mm 63-ball FBGA package, the RoHS-compliant solutions are available in industrial (-40°C to +85°C) and automotive (-40°C to +105°C) temperature ranges.

Samples and production quantities of the 1.8V and 3.3V SLC parallel NAND flash memory products are available now, with lead times of 12 weeks.

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A small footprint of discrete power MOSFETs plays a critical role in achieving space savings, cost reduction, and easy-to-design applications. Additionally, higher power density can lead to layout routing flexibility and overall system size reduction. By expanding the current PQFN 2×2 portfolio with the new best-in-class OptiMOS power MOSFETs, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers benchmark solutions optimized for efficiency and performance in a small footprint. The new products are ideal for applications like synchronous rectification in switched mode power supplies (SMPS) for servers, telecom, and portable- and wireless chargers. Additional applications also include electric speed controllers for small brushless motors in drones.

The new OptiMOS 6 40 V and OptiMOS 5 25 V and 30 V power MOSFETs further optimize the proven OptiMOS technology for high-performance designs. They offer leading-edge silicon technology, package reliability, and superior thermal resistance (RthJC, max = 3.2 K/W) in the ultra-small PQFN 2×2 mm² package. The new devices combine industry-leading low on-resistance RDS(on) with industry-leading figures of merit (FOMs, QG and QOSS) for outstanding dynamic switching performance. As a result, MOSFETs with ultra-low switching and reduced conduction losses ensure optimal energy efficiency and power density, all while simplifying thermal management.

With the compact PQFN 2×2 mm2 package outline, the OptiMOS power switches enable an improved system form factor with smaller, more flexible geometric outlines for end-user applications. The MOSFETs facilitate reliable system design with less need for paralleling, significantly reducing space and system cost.

The new OptiMOS 6 power MOSFET 40 V (ISK057N04LM6) with 5.7 mΩ RDS(on) and OptiMOS 5 power MOSFETs 25 V (ISK024NE2LM5) and 30 V (ISK036N03LM5) with 2.4 mΩ and 3.6 mΩ RDS(on), respectively, are available in the improved PQFN 2×2 mm2 package and can be ordered now.

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