ELE Times

Reflow soldering is a widely used technique in electronics manufacturing for assembling surface-mount devices (SMDs) onto printed circuit boards (PCBs). This method involves applying solder paste to the board, placing components on top of it, and then heating the assembly in a controlled manner to melt and solidify the solder. The process ensures strong and reliable solder joints, making it a preferred method for mass production in the electronics industry.

Unlike wave soldering, which is typically used for through-hole components, reflow soldering is designed for SMDs, allowing for higher component density and miniaturization of electronic circuits. The precision and efficiency of reflow soldering make it ideal for modern electronic manufacturing, where consistency and high reliability are critical.

How Reflow Soldering Works

The reflow soldering process consists of several carefully controlled stages to ensure optimal soldering results. Each stage plays a crucial role in preventing defects such as solder bridging, tombstoning, or incomplete solder joints. The main steps include:

1. Solder Paste Application

The process begins with the application of solder paste, a mixture of powdered solder alloy and flux, onto the PCB. This is typically done using a stencil and a squeegee to ensure uniform deposition. The accuracy of solder paste application is critical as it determines the quality of the solder joints.

2. Component Placement

Once the solder paste is applied, surface-mount components are carefully placed on the PCB using automated pick-and-place machines. These machines use vision systems to precisely position components, ensuring alignment with the solder paste deposits.

3. Preheating Stage

The assembled board is then gradually heated in a reflow oven. The preheating stage raises the temperature of the PCB and components at a controlled rate to prevent thermal shock. This phase also activates the flux in the solder paste, which removes oxidation and improves wetting.

4. Thermal Soaking

After preheating, the PCB enters a thermal soaking phase where the temperature is maintained at a specific range to ensure uniform heat distribution. This helps in stabilizing the components and further activating the flux.

5. Reflow Zone (Peak Temperature Stage)

In this stage, the temperature reaches its peak, typically between 220°C and 250°C, depending on the solder alloy used. This is the critical moment where the solder paste melts, creating reliable electrical and mechanical connections between the components and the PCB.

6. Cooling Phase

Once the solder has melted and formed solid connections, the PCB is gradually cooled in a controlled manner. Controlled cooling prevents thermal stress and ensures the formation of strong, defect-free solder joints.

Reflow Soldering Uses & Applications

Reflow soldering is widely used in various industries, primarily in the manufacturing of electronic devices. Some key applications include:

• Consumer Electronics: Smartphones, laptops, tablets, and gaming consoles all rely on reflow soldering to ensure compact and efficient circuit assemblies.
• Automotive Electronics: Modern vehicles contain complex electronic systems, including engine control units (ECUs), infotainment systems, and safety sensors, all of which use SMD technology and reflow soldering.
• Medical Devices: High-precision medical equipment, such as diagnostic devices and portable health monitors, require reliable soldering for seamless functionality.
• Industrial Electronics: Industrial automation, control systems, and robotics benefit from reflow soldering due to its ability to create robust and durable electronic circuits.
• Aerospace & Defense: High-reliability electronics for satellites, avionics, and defense applications depend on precise and high-quality soldering techniques like reflow soldering.

Advantages of Reflow Soldering

Reflow soldering offers several advantages that make it the preferred method for assembling SMD components:

• High Precision: Automated solder paste application and component placement result in accurate soldering with minimal defects.
• Consistency and Reliability: Controlled heating profiles ensure strong and uniform solder joints, reducing the chances of failure.
• Mass Production Efficiency: The process is highly automated and scalable, making it suitable for high-volume manufacturing.
• Compatibility with Small Components: Reflow soldering supports miniaturized electronics, enabling the development of compact and lightweight devices.
• Improved Aesthetic and Functionality: Unlike wave soldering, reflow soldering does not leave excess solder, resulting in cleaner circuit boards with better electrical performance.

Disadvantages of Reflow Soldering

Despite its benefits, reflow soldering also has some limitations:

• Complex Equipment Requirements: Reflow ovens and pick-and-place machines are expensive, making the initial setup costly for small manufacturers.
• Component Sensitivity: Some temperature-sensitive components may get damaged if exposed to high temperatures during the reflow process.
• Risk of Defects: Issues such as tombstoning (where small components lift on one side) or solder bridging (where excess solder creates unintended connections) can occur if process parameters are not optimized.
• Limited Use for Through-Hole Components: While hybrid techniques exist, reflow soldering is primarily designed for surface-mount devices, requiring additional methods for through-hole components.

Conclusion

Reflow soldering is a highly efficient and precise method for assembling surface-mount components on PCBs. With applications ranging from consumer electronics to aerospace, it remains a crucial technique in modern electronic manufacturing. While the process requires careful temperature control and specialized equipment, its benefits in terms of reliability, efficiency, and scalability make it indispensable. As technology advances, improvements in solder paste formulations and reflow oven designs continue to enhance the effectiveness of reflow soldering, ensuring its relevance in the ever-evolving electronics industry.

The post Understanding Reflow Soldering: Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

India’s 3D printing industry has experienced significant growth, with numerous companies emerging as key players in the field. Here’s an overview of the top 10 3D printer manufacturers in India as of 2025:

1. Divide By Zero Technologies

Established in 2013 and based in Maharashtra, Divide By Zero Technologies is a prominent 3D printer manufacturer catering to small and medium enterprises. The company aims to make 3D printing affordable and reliable, providing solutions to renowned clients such as Samsung, L’Oreal, GE Healthcare, Godrej, and Mahindra. Their product lineup includes models like Accucraft i250+, Aion 500 MK2, Aeqon 400 V3, and Alpha 500. Notably, their patented Advanced Fusion Plastic Modeling (AFPM) technology ensures consistent quality through intuitive automation.

2. Make3D

Founded in 2014 in Gujarat, Make3D specializes in manufacturing 3D printers and scanners. Their Pratham series caters to both hobbyists and industrial users, featuring models like Pratham Mini and Pratham 6.0. They also offer the Eka Star DLP Printer and EinScan Pro 2X scanner. Committed to enhancing the accessibility of additive manufacturing, Make3D provides products known for quality and durability, alongside educational courses on 3D printing.

3. Mekuva Technologies (POD3D)

Based in Hyderabad and established in 2021, Mekuva Technologies offers a range of 3D printers, including the AKAR series (300 Pro, 600 Basic, 200 Desktop, and 200 Pro). Beyond manufacturing, they provide services like 3D design, printing, scanning, CNC machining, sheet metal operations, and injection molding, serving as a comprehensive solution provider for various industries. Their printers are compatible with materials such as PLA, ABS, and carbon fiber.

4. IMIK Technologies

Operating since 2007 in Tamil Nadu, IMIK Technologies supplies a wide range of 3D printers, including their own FDM printer, IMIK 3DP, and models from brands like Creality, Flashforge, and Ultimaker. They cater to sectors such as defense, textiles, robotics, agriculture, and medicine, offering products suitable for educational, industrial, and personal use. Additionally, they provide 3D prototyping services.

5. Printlay

Established in 2015 in Tamil Nadu, Printlay specializes in 3D printing and scanning services. They assist clients from prototyping to end-use parts production, ensuring precision and accuracy. Their services extend to CNC machining and injection molding, catering to diverse industries with a reputation for quick turnaround times and quality service.

6. A3DXYZ

Founded in 2018 in Maharashtra, A3DXYZ offers 3D printing services, including FDM printing, stereolithography, CAD modeling, digital light processing, and vacuum casting. They serve industries such as architecture, aerospace, healthcare, and medicine, and have introduced the A3DXYZ DS200 3D printer, known for its robust design and high-quality output.

7. Boson Machines

Based in Maharashtra and established in 2017, Boson Machines is a leading 3D printing manufacturer utilizing technologies like FDM, SLA, and SLS. They offer services such as part production, injection molding, and CNC machining, providing comprehensive solutions from design to production.

8. 3Ding

Operating since 2013 in Tamil Nadu, 3Ding supplies a variety of 3D printers, PCB printers, printing materials, and scanners. They distribute products from brands like 3D Systems, Fab X, Voltera, Formlabs, and Creality, and offer rental options. Their services include 3D design, printing, and scanning, along with workshops and training programs. They have branches in Chennai, Bangalore, Hyderabad, and Mumbai.

9. Precious 3D

Established in 2017 in Tamil Nadu, Precious 3D offers 3D design, printing, CNC machining, and injection molding services. They utilize technologies like SLS, FDM, DLP, and Polyjet, serving industries such as automotive and healthcare. Their clientele includes brands like Renault, Ford, Verizon, and Nippon Paint, and they provide consultation services for material selection.

10. Imaginarium

Based in Mumbai, Imaginarium stands as India’s largest 3D printing and rapid prototyping company. They offer design validation, prototyping, batch production, and various techniques such as SLA (Stereolithography), SLS (Selective Laser Sintering), VC (Vacuum Casting), CNC machining, injection molding, and scanning. Serving industries such as jewelry, automotive, and healthcare, Imaginarium utilizes 20 industrial 3D printers and 140 different materials, making them a key player in the field.

 

These companies exemplify the rapid advancement and diversification of India’s 3D printing industry, offering a wide range of products and services to meet the evolving needs of various sectors.

The post Top 10 3D Printer Manufacturers in India appeared first on ELE Times.

In an era where artificial intelligence (AI) is rapidly transforming edge computing, STMicroelectronics is leading the charge with its groundbreaking STM32N6 series, featuring the Neural-ART Accelerator. This next-generation microcontroller delivers 600 times more AI performance than previous STM32 MCUs, redefining real-time AI processing for embedded systems.

Sridhar Ethiraj, Technical Marketing – General Purpose MCU at STMicroelectronics India

In this exclusive interview, Rashi Bajpai from ELE Times sits down with Sridhar Ethiraj, Technical Marketing – General Purpose MCU at STMicroelectronics India, to explore the technological breakthroughs behind the STM32N6. We discuss the challenges of integrating high-performance AI with ultra-low power consumption, the real-world impact of AI-accelerated MCUs in industries like automotive, healthcare, and smart devices, and how ST’s Edge AI Suite is simplifying AI deployment for developers worldwide.

 

 

 

With industry giants like LG, Lenovo, and Alps Alpine already leveraging the STM32N6, this conversation unveils how AI-powered microcontrollers are shaping the future of intelligent embedded systems.

Excerpts:

STMicroelectronics has introduced the STM32N6 MCU with the Neural-ART Accelerator, delivering 600 times more machine-learning performance than previous high-end STM32 MCUs. What key challenges did ST overcome to integrate such advanced AI capabilities into a microcontroller while maintaining power efficiency?

Ans: STMicroelectronics faced several key challenges while integrating the Neural-ART Accelerator into the STM32N6 MCU. The need for high computing power for advanced AI features clashed with power efficiency goals was a major hurdle. ST tackled this by creating its own neural processing unit (NPU) to handle most AI tasks while keeping power use low. Making the system work with different AI frameworks and models also proved tough, but ST fixed this by supporting common frameworks like TensorFlow Keras, and the ONNX ecosystem. ST also had to tweak the hardware to run neural networks for computer vision and audio in real-time. This meant building a computer vision pipeline and special image processing abilities. In the end, all this work resulted in the STM32N6 MCU, which offers 600 times better machine-learning performance than earlier top-end STM32 MCUs, while still being very power-efficient.

With AI inference moving to the edge, how does the STM32N6 differentiate itself from other AI-enabled MCUs in terms of performance, memory, and AI software support?

Ans: The STM32N6 series redefines AI-enabled microcontrollers with its Neural-ART Accelerator, a custom neural processing unit (NPU) delivering up to 600 GOPS for real-time neural network inference. Built on the Arm Cortex-M55 core running at 800 MHz, it leverages Arm Helium vector processing to enhance DSP performance. With 4.2 MB of built-in RAM and high-speed external memory interfaces, it excels in AI and graphics-intensive applications. Backed by a comprehensive AI software ecosystem—including STM32Cube.AI, ST Edge AI Developer Cloud, and the STM32 model zoo—it simplifies model optimization and deployment. This seamless blend of hardware acceleration and software support makes the STM32N6 a powerful and scalable solution for edge AI workloads.

 

The STM32N6 has been tested and adopted by industry leaders like LG, Lenovo, and Alps Alpine. Can you share some real-world applications where this MCU is making a significant impact?

Ans: The STM32N6 MCU is driving innovation across multiple industries. In automotive, it powers advanced driver assistance systems (ADAS) by enabling real-time processing of camera and sensor inputs for collision avoidance and lane-keeping. In smart home technology, companies like LG and Lenovo use it in security cameras and smart doorbells, leveraging its AI capabilities for motion detection and facial recognition. In healthcare, it enhances medical devices by accurately processing patient data for diagnostics and continuous monitoring. These real-world applications highlight how the STM32N6 delivers high-performance AI processing, improving safety, efficiency, and user experience across industries.

AI at the edge is evolving rapidly, particularly in vision, audio processing, and sensor-based analytics. How does ST’s Edge AI Suite support developers in optimizing AI models for the STM32N6, and what industries stand to benefit the most from this innovation?

Ans: Through three main tools in the Edge AI Suite from ST, developers gain complete functionality to improve AI models for the STM32N6 platform: STM32Cube.AI and ST Edge AI Developer Cloud and STM32 model zoo. The tools in this platform optimize AI model deployment on the Neural-ART Accelerator of STM32N6 while supporting the entire process from data preparation to code generation. The STM32N6 has the potential to revolutionize multiple sectors including automotive production, automotive components and consumer electronics together with healthcare and industrial automation markets. The STM32N6 allows advanced driver assistance systems (ADAS) in automotive applications as it provides healthcare products with real-time data analysis capabilities. Through their suite developers can build effective edge AI solutions which operate throughout numerous applications.

Looking ahead, how does STMicroelectronics envision the future of AI-accelerated microcontrollers, and what role will the STM32N6 series play in shaping next-generation embedded systems?

Ans: STMicroelectronics envisions a future where AI-accelerated microcontrollers like the STM32N6 series play a pivotal role in edge computing, enabling smarter, more efficient, and autonomous embedded systems. The STM32N6, with its Neural-ART Accelerator, is designed to handle complex AI tasks such as computer vision and audio processing with exceptional efficiency. Its energy-optimized AI processing will drive advancements across automotive, healthcare, consumer electronics, and industrial automation, enabling real-time data analysis, improved user experiences, and enhanced operational efficiency. As AI at the edge continues to evolve, the STM32N6 series will be instrumental in shaping intelligent, responsive, and secure next-generation embedded systems.

Sources:

STMicroelectronics to boost AI at the edge with new NPU-accelerated STM32 microcontrollers – ST News

STM32N6 series – STMicroelectronics

Data brief – STM32N6-AI – Artificial intelligence (AI) ecosystem for STM32N6 high-performance microcontroller with Neural-ART Accelerator

STM32N6-AI – AI software ecosystem for STM32N6 with Neural-ART accelerator – STMicroelectronics

Microcontrollers-stm32n6-series-overview.pdf

The post STMicroelectronics enables unmatched edge AI performance on MCU with STM32N6 appeared first on ELE Times.

India’s industrial landscape is undergoing a significant transformation, with robotics playing a pivotal role in enhancing manufacturing efficiency, precision, and productivity. Several Indian companies have emerged as leaders in industrial robotics, offering innovative solutions tailored to various sectors. Here are ten notable industrial robot manufacturers in India:

1. DiFACTO Robotics

Headquartered in Bengaluru, DiFACTO Robotics is a prominent provider of robotic solutions for the manufacturing sector. Their expertise encompasses conceptualizing, manufacturing, and implementing advanced factory automation systems. Serving industries such as automotive, metal forming, transportation, energy, electronics, and consumer goods, DiFACTO has established itself as a key player in India’s industrial automation landscape.

2. Hi-Tech Robotic Systemz

Hi-Tech Robotic Systemz specializes in autonomous mobile robots and automated guided vehicles (AGVs). Their solutions cater to sectors like automotive, warehousing, and defense, focusing on enhancing operational efficiency and safety. With a strong emphasis on research and development, Hi-Tech Robotic Systemz continues to innovate in the field of industrial robotics.

3. Gridbots

Based in Ahmedabad, Gridbots is known for developing robots and artificial intelligence systems for industrial applications. Their product portfolio includes robotic arms, vision systems, and automation solutions designed to optimize manufacturing processes. Gridbots’ commitment to innovation has positioned them as a significant contributor to India’s robotics industry.

4. Systemantics

Systemantics focuses on designing and manufacturing industrial robots that are cost-effective and easy to deploy. Their flagship product, the ASYSTR 600, is a six-axis industrial robot designed for tasks such as material handling, welding, and assembly. By addressing the challenges of automation adoption, Systemantics aims to make robotics accessible to a broader range of industries.

5. Invento Robotics

Invento Robotics specializes in service robots with applications in hospitality, healthcare, and retail. Their robots, such as Mitra, have been deployed in various settings to assist with customer engagement and service delivery. While their primary focus is on service robotics, their technological advancements contribute to the broader robotics ecosystem in India.

6. Addverb Technologies

Addverb Technologies is a leading provider of automation solutions for warehouses and distribution centers. Their robotics offerings include autonomous mobile robots (AMRs), sorting robots, and pallet shuttles, designed to streamline intralogistics operations. By integrating robotics with advanced software systems, Addverb enhances efficiency and accuracy in supply chain processes.

7. CynLr

CynLr (Cybernetics Laboratory) focuses on developing vision systems and robotic solutions that enable machines to handle objects with human-like dexterity. Their technology addresses complex manufacturing challenges, particularly in tasks requiring precision and adaptability. CynLr’s innovations are paving the way for more versatile industrial automation.

8. PARI (Precision Automation and Robotics India)

Founded in 1991 and headquartered in Satara, Maharashtra, PARI is a global automation company that has provided over 3,000 automated solutions worldwide. Their services encompass conceptualizing, manufacturing, and implementing advanced factory automation systems, catering to industries such as automotive, aerospace, and heavy engineering.

9. Goat Robotics

Based in Coimbatore, Goat Robotics specializes in autonomous mobile robots (AMRs) designed for manufacturing industries. Their robots are equipped with advanced navigation systems and are used for material transport and logistics within industrial settings. Goat Robotics’ solutions aim to enhance operational efficiency and safety in manufacturing environments.

10. Peer Robotics

Peer Robotics is a startup focusing on collaborative mobile robots designed to work alongside human operators. Their robots are used in manufacturing and warehousing environments to assist with material handling and repetitive tasks. By emphasizing human-robot collaboration, Peer Robotics aims to create safer and more efficient workplaces.

 

India’s industrial robot manufacturing sector is characterized by a blend of established companies and innovative startups, each contributing uniquely to the automation landscape. As industries increasingly adopt automation to enhance productivity and competitiveness, these companies are poised to play a crucial role in shaping the future of manufacturing in India.

The post Top 10 Industrial Robot Manufacturers in India appeared first on ELE Times.

India’s drone industry has experienced remarkable growth, positioning itself as a global leader in unmanned aerial vehicle (UAV) technology. This surge is driven by the government’s “Make in India” initiative and supportive policies, fostering a robust ecosystem of drone manufacturers. Here, we explore the top 10 drone camera manufacturers in India, highlighting their contributions to this dynamic sector.

1. ideaForge Technology

Founded in 2007, ideaForge is a pioneer in India’s UAV industry, renowned for developing high-endurance drones tailored for defense, homeland security, and industrial applications. Their flagship product, the Switch UAV, boasts a flight time of over two hours, equipped with advanced imaging capabilities, making it indispensable for long-range surveillance and mapping. The company’s commitment to innovation has solidified its position as a leader in the Indian drone market.

2. Zen Technologies

Established in 1993, Zen Technologies specializes in designing and manufacturing combat training solutions, including UAVs and anti-drone systems. Their drones are integral to military training, offering realistic simulations and live training exercises. The company’s focus on defense applications has made it a trusted partner of the Indian armed forces.

3. Paras Defence and Space Technologies

Paras Defence is a prominent player in the defense sector, providing a range of products, including UAVs equipped with sophisticated imaging systems. Their drones are engineered for intelligence, surveillance, and reconnaissance missions, featuring high-resolution cameras and thermal imaging capabilities. The company’s expertise in optics and defense electronics enhances the performance of their UAVs.

4. Asteria Aerospace

Based in Bengaluru, Asteria Aerospace focuses on developing drones for security and industrial applications. Their Genesis series offers real-time aerial surveillance with advanced imaging systems, catering to sectors like oil and gas, mining, and agriculture. The company’s emphasis on data analytics and automation sets them apart in the industry.

5. Quidich Innovation Labs

Quidich specializes in aerial cinematography and has expanded into industrial inspections and mapping. Their drones are equipped with high-definition cameras, providing unique perspectives for film production and critical data for infrastructure assessments. Their versatility has made them a preferred choice in both entertainment and industrial sectors.

6. Garuda Aerospace

Garuda Aerospace offers a diverse range of drones for applications such as agriculture, delivery, and surveillance. Their Kisan Drone is designed for precision agriculture, featuring multispectral imaging to monitor crop health. The company’s focus on affordability and functionality has made drone technology accessible to various industries.

7. Dhaksha Unmanned Systems

Specializing in agriculture and surveillance drones, Dhaksha Unmanned Systems provides UAVs equipped with advanced imaging systems for crop monitoring and security applications. Their drones are known for durability and ease of use, benefiting farmers and law enforcement agencies alike.

8. RattanIndia Enterprises

RattanIndia has ventured into the drone sector, focusing on logistics and delivery solutions. Their drones are designed to transport goods efficiently, equipped with cameras for navigation and monitoring. The company’s entry into the drone market signifies the expanding applications of UAV technology in India.

9. DCM Shriram Industries

DCM Shriram has diversified into drone manufacturing, offering UAVs for industrial inspections and agricultural use. Their drones are equipped with high-resolution cameras and sensors, providing valuable data for maintenance and farming operations. The company’s industrial expertise enhances the reliability of their drone solutions.

10. Aeroarc Innovations

Aeroarc Innovations is an emerging player in India’s drone ecosystem, specializing in high-performance UAVs for industrial, defense, and environmental applications. Their drones feature advanced imaging capabilities, including multispectral and LiDAR sensors, making them ideal for precision agriculture, infrastructure monitoring, and disaster response. The company is focused on developing AI-powered drone solutions that enhance automation and real-time data analysis, positioning itself as a key innovator in the Indian drone market.

 

The advancements made by these companies reflect India’s burgeoning capabilities in drone technology. With applications spanning defense, agriculture, industrial inspections, and entertainment, the integration of advanced imaging systems into UAVs is transforming traditional practices. As regulatory frameworks evolve and technology advances, these manufacturers are poised to play a pivotal role in the global drone ecosystem, showcasing India’s commitment to innovation and self-reliance in this cutting-edge field.

The post Top 10 Drone Camera Manufacturers in India appeared first on ELE Times.

NEPCON JAPAN 2025 concluded its successful run at Tokyo Big Sight. The
event attracted a remarkable 85,430* attendees from around the globe, serving as a premier, world-class platform for innovation, networking, and business growth.
(*including concurrent shows)

This year’s edition brought together key industry players and the latest technologies across
multiple shows, including the 17th AUTOMOTIVE WORLD, the 11th Wearable Expo, Factory
Innovation Week 2024, and the 4th SMART LOGISTICS Expo.

The global reach and influence of NEPCON JAPAN was evident through the participation of
industry-leading exhibitors hailing from countries such as Austria, Estonia, Germany, the Czech Republic, Italy, the United States, Malaysia, and many more.

Industry Leaders and Global Participation
The exhibition halls were packed with cutting-edge technologies and breakthrough innovations presented by some of the biggest names in the industry. These companies, among 1,711 exhibitors, showcased state-of-the-art advancements in power devices, AI-driven automation, IoT solutions, next-gen mobility, and smart logistics technology.

Notable exhibitors included:

• NEPCON JAPAN: Yamaha Motor Co., Ltd., Omron Corporation, Siemens EDA Japan, Panasonic Corporation, Denso Corporation
• AUTOMOTIVE WORLD: Bosch Corporation, Continental AG, Denso Corporation, Aisin Seiki Co., Ltd., Toyota Auto Body
• Factory Innovation Week: LG Electronics Japan Inc., Mitsubishi Electric Corporation, Siemens AG, Fanuc Corporation, Kawasaki Heavy Industries, Ltd., Yaskawa Electric Corporation, Toshiba Digital Engineering Corporation
• SMART LOGOSTICS Expo: Honeywell International Inc., Daifuku Co., Ltd., Toyota Logistics Solutions, Murata Manufacturing Co., Ltd., Zebra Technologies Corporation
• WEARABLE EXPO:Lenovo Japan LLC, Sony Corporation, Samsung Electronics Co., Ltd., Google LLC, HTC Corporation, NXP Semiconductors N.V.

Event Highlights

One of the major attractions of NEPCON JAPAN 2025 was the expanded Power Device & Module Expo and the Power Device Summit, featuring discussions by leading power device manufacturers. Attendees also had access to a range of free-to-attend conference sessions, where industry leaders from Samsung, Intel, Qualcomm, and other major players shared insights on the future of electronics and R&D.

Build on NEPCON Japan’s Success: Register for the First-Ever NEPCON Osaka

Following the success of NEPCON Japan 2025, the inaugural edition of NEPCON Osaka is set to take place from May 14–16, 2025, further strengthening Japan’s presence in the electronics industry. Expected to welcome 45,000* visitors and 600* exhibitors, NEPCON Osaka will provide a new platform for business expansion and industry growth.

With yet another remarkable edition in the books, NEPCON JAPAN continues to set the standard for electronics innovation, R&D, and manufacturing excellence. Industry professionals, exhibitors, and tech enthusiasts alike can look forward to the next milestone event at NEPCON Osaka 2025.

The post NEPCON JAPAN 2025 Welcomes 85,430 Attendees for a Grand Showcase of Electronics R&D and Innovation appeared first on ELE Times.

SPS – Smart Production Solutions Guangzhou concluded successfully on 27 February 2025 at Area A of the China Import and Export Fair Complex, attracting strong attendance from across the manufacturing sector. Drawing on the extensive resources of the global SPS network, the event welcomed a wide range of international exhibitors, presenting regional manufacturers with advanced smart manufacturing technologies and solutions from around the world. Through this convergence of global expertise, the platform continues to advance the intelligent transformation of the region’s industries while enabling knowledge exchange and technological transfer across markets.

Mr Louis Leung, Deputy General Manager, Guangzhou Guangya Messe Frankfurt Co Ltd commented: “2025 marks a meaningful step forward for SPS – Smart Production Solutions Guangzhou, following last year’s brand upgrade. The exhibition now integrates more deeply within the global SPS network, delivering world-class intelligent manufacturing resources to the region. We are very pleased with the success of this year’s shows, as evidenced by the increased visitor flow, including buyers and visitors from around the world, and the highly positive feedback we’ve received from participants.”

The three-day exhibition featured leading manufacturing enterprises showcasing breakthrough developments in sensing technology, drive systems, motion control, and other key areas. Major industry players including Autonics, Binder, Bonfiglioli, CODESYS, Controlway, Crouzet, Datalogic, DEGSON, DINKLE, GSK, HIKVISION, HUALONG XUNDA, ifm, INVT, Jaten Robot, Li-Gong, MatriBox, SERVOTRONIX, SICK, SIEMENS, SUPU, TURCK, Wanjie, WATTSAN, and Zhongda Leader presented their advanced technologies, solutions and services.

The exhibition was supported by a diverse program of concurrent events, with over 100 presentations addressing key developments in sustainability, digital transformation, and artificial intelligence in manufacturing. The sessions encouraged substantive dialogue between industry experts and participants, facilitating technical collaboration and knowledge transfer.

Partnerships with the World Manufacturing Foundation (WMF) and the Innovative Industry Fair for E x E Solutions (IIFES) brought an enhanced international dimension to the exhibition through two specialised forums: “The Future of Manufacturing: Outlook 2030” and “Manufacturing Meets the Future in Japan”. At these forums, global manufacturing experts including Prof Dr David Romero, Scientific Vice-chairman of the World Manufacturing Foundation, and Ms Shuran Yamaguchi, General Manager of Global Marketing Communications at IDEC Corporation offered insights and perspectives on global developments in manufacturing, strengthening the event’s position as a leading international platform for the industry.

Further expanding its industry reach, the event was held concurrently with Guangzhou Industrial Technology and Asiamold Select – Guangzhou. The three exhibitions worked in synergy as a comprehensive platform for procurement and exchange, where participants explored complementary technologies, discovered business opportunities, and engaged in technical dialogue and resource sharing, supporting wider innovation and growth throughout the manufacturing sector.

Exhibitor comments

“SPS – Smart Production Solutions Guangzhou has provided us with an outstanding platform for business networking and enhancing our brand visibility. At this year’s event, we connected with customers from Southeast Asia, India, and Germany, gaining valuable insights into market trends and requirements. Our ten core sensor product lines were well-received by customers from many different industries. The 2025 edition has seen steady growth in visitor numbers and more focused customer interactions, enabling us to expand our customer base and have in-depth discussions about our existing partners’ future requirements and R&D plans.”
Ms Cristing Zhou, General Manager, Guangzhou Heyi Intelligent Technology Co Ltd

“This is our sixth year exhibiting at SPS – Smart Production Solutions Guangzhou, and it remains a key event for reaching quality customers. This year, we’ve had productive meetings with potential customers from India and Vietnam, among others. With its strong line-up of both domestic and international automation companies, and high concentration of industry professionals, the exhibition provides an excellent platform for presenting our technologies and enhancing our brand.”
Mr Xiangfu Li, Sales Manager, Shinier Intelligent Tech Co Ltd

“While this is our first year exhibiting, we were already well aware of this show’s strong reputation within the industry. We saw excellent visitor flow, with many high-quality prospects and meaningful inquiries, including buyers from Pakistan and other parts of Asia. Compared to other exhibitions, this platform stands out for its high standard of execution and full coverage of the industry chain. Overall, we’re very satisfied with the results and plan to exhibit again next year.”

Ms Xiaoting Li, Secretary General Director, Guangdong MingYu Technology Co Ltd

“To stand out in this competitive industry, we’re working on two fronts: improving our operations while building our presence in both domestic and international markets. We saw strong interest in our products at the show, with several customers arranging factory visits on the spot. Beyond domestic buyers, we received inquiries from Saudi Arabia, the Middle East and Singapore. This is only our second time exhibiting, but we’re already seeing its value in supporting our market development objectives.”
Mr Xiangpeng Ning, Factory Manager, Guangzhou Jiawei Intelligent Control Technology Co Ltd

Visitor Comments:

“As a traditional flour and noodle manufacturer, we came to the show looking for ways to digitalise and automate our operations. After two days of discussions, we’ve made excellent progress, and have found several potential partnership opportunities. The forum sessions were also valuable – the speakers offered great insights about business growth and new technologies, particularly about how to implement AI in our business.”
Mr Ningyuan Wei, Information Specialist, Xingtai Jinshahe Flour Co Ltd

“As specialists in robotics and vending solutions for the hospitality sector, we came seeking new robotics and automation technologies, along with component vendors for solutions we’re developing in India. This has proven to be the most comprehensive exhibition of its type I’ve attended. We’ve made promising contacts, particularly in sensors, robotics, and automation, and the selection of exhibitors from Germany, Korea and China aligns well with our needs. The exhibition has proven well worth our time, and we look forward to returning in the future.”

Mr Sujith Mohandas, Deputy General Manager – Robotics Unit, Urban Harvest (India)

Speaker comments:
“During my presentation, the audience was highly engaged, especially when discussing ESG and sustainability, with many taking photographs and notes. The forum provides a valuable platform for advancing manufacturing, and these shared perspectives and experiences will help drive developments in our equipment and manufacturing sectors. Representing Rockwell Automation, a global authority in industrial automation and digital transformation, I was impressed by the organisers’ thoroughness at every stage, from speaker management to content preparation, delivering a well-organised and efficiently executed event.”

Mr Jason Dong, ESG & Sustainability Business Lead, Rockwell Automation (China) Company Limited

SPS – Smart Production Solutions Guangzhou is co-organised by Guangzhou Guangya Messe Frankfurt Co Ltd, China Foreign Trade Guangzhou Exhibition Co Ltd, Guangzhou Overseas Trade Fairs Ltd and Mesago Messe Frankfurt GmbH. Guangdong Association of Automation, Guangzhou Association of Automation and Guangzhou Instrument and Control Society serve as honourary organisers. The fair is also supported by the China Light Industry Machinery Association, the China International Chamber of Commerce Guangzhou Chamber of Commerce, and the Beijing Internet of Things Intelligent Technology Application Association.

The 2026 edition of SPS – Smart Production Solutions Guangzhou will take place from
4 – 6 March 2026. For more details about the fairs, please visit www.spsinchina.com or email sps@china.messefrankfurt.com.

Further events in the international SPS network include:

• SPS Stage Bangkok
  6 – 8 March 2025, Bangkok, Thailand
• SPS Italia
  13 – 15 May 2025, Parma, Italy

• SPS Stage Kuala Lumpur
  14 – 16 May 2025, Kuala Lumpur, Malaysia

• SPS Atlanta
  16 – 18 September 2025, Atlanta, United States
• SPS – Smart Production Solutions
  25 – 27 November 2025, Nuremberg, Germany

The post Substantial turnout for SPS – Smart Production Solutions Guangzhou 2025 appeared first on ELE Times.

Introduction to Laser Soldering

Laser soldering is an advanced soldering technique that utilizes a highly focused laser beam to heat and join soldered components. It is widely used in electronics, automotive, aerospace, and medical device manufacturing, offering precision and minimal thermal impact compared to traditional soldering techniques like wave and reflow soldering.

How Laser Soldering Works

Laser soldering operates by directing a controlled laser beam onto a solder joint, heating it to the required temperature to melt the solder and form a secure electrical or mechanical connection. The key components of a laser soldering system include:

1. Laser Source: Typically a fiber laser, diode laser, or Nd:YAG laser, chosen based on the application requirements.
2. Beam Delivery System: Optical fibers or galvanometer scanners to direct the laser beam to the precise soldering location.
3. Process Monitoring System: Infrared or vision-based sensors to ensure quality and consistency.
4. Flux Application System: To clean oxidation and improve wetting properties of the solder.

The laser’s intensity, duration, and focus are carefully controlled to avoid overheating and ensure optimal bonding.

Laser Soldering Process

The laser soldering process follows these key steps:

1. Surface Preparation: The materials to be soldered must be cleaned and flux applied to prevent oxidation.
2. Positioning & Fixturing: Components are precisely positioned to ensure accurate solder joint formation.
3. Laser Heating: The laser is directed at the soldering site with carefully controlled power and duration.
4. Solder Melting & Wetting: The solder melts and flows over the joint, creating a reliable electrical and mechanical connection.
5. Cooling & Solidification: The solder joint solidifies, forming a strong bond with minimal stress or thermal damage.
6. Inspection & Quality Control: Automated systems, such as X-ray or infrared imaging, may be used to verify joint integrity.

Applications of Laser Soldering

Laser soldering is employed in various high-precision industries, including:

1. Electronics Manufacturing: Used in PCB assembly, wire bonding, and micro-soldering for miniaturized circuits.
2. Automotive Industry: Employed in sensor connections, battery pack manufacturing, and electronic control modules.
3. Medical Devices: Used for assembling compact and delicate electronic components in medical implants and diagnostic equipment.
4. Aerospace & Defense: Essential for high-reliability solder joints in avionics and military electronics.
5. Telecommunications: Applied in optical fiber splicing and high-frequency circuit board soldering.

Advantages of Laser Soldering

Laser soldering offers several advantages over conventional soldering techniques:

• Precision & Control: Allows fine control over temperature, beam positioning, and solder flow.
• Minimal Thermal Impact: Reduces heat stress on delicate components, making it ideal for miniaturized electronics.
• Non-Contact Process: Eliminates mechanical stress and contamination risks.
• Automation Friendly: Easily integrates with robotics and inline inspection systems for high-throughput manufacturing.
• Consistent & Repeatable Results: Ensures uniform solder joints, reducing defects and rework.
• Eco-Friendly: Reduces solder waste and eliminates the need for high-temperature heating elements.

Disadvantages of Laser Soldering

Despite its many benefits, laser soldering also has some limitations:

• High Initial Cost: Requires investment in specialized equipment and skilled operators.
• Material Sensitivity: Some materials may not absorb laser energy efficiently, requiring careful parameter adjustments.
• Limited Joint Sizes: May not be suitable for large-area soldering applications.
• Laser Safety Considerations: Requires protective measures to prevent accidental exposure to high-intensity laser beams.
• Dependency on Precise Alignment: Small misalignments can affect solder quality and reliability.

Conclusion

Laser soldering is a cutting-edge technology that enhances precision, efficiency, and reliability in soldering applications. While it comes with a higher upfront cost and requires careful process control, its advantages in high-precision industries make it a preferred choice for modern manufacturing. As technology evolves, improvements in laser systems and automation will further expand the scope of laser soldering, making it an indispensable tool in next-generation electronics and industrial applications.

The post Laser Soldering Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

India’s smart lighting industry has experienced significant growth in recent years, driven by technological advancements and a growing emphasis on energy efficiency. Smart lighting integrates advanced controls and connectivity, allowing users to customize illumination levels, colors, and schedules, often through mobile apps or voice assistants.

This article highlights ten prominent smart lighting manufacturers in India, showcasing their contributions to this dynamic sector.

1. Philips Lighting India (Signify)

Philips Lighting, now operating as Signify, is a global leader in lighting solutions with a substantial presence in India. The company offers a diverse range of smart lighting products, including the popular Philips Hue series, which allows users to control lighting ambiance and intensity through mobile applications and voice commands. Philips’ commitment to innovation and quality has solidified its reputation in the Indian smart lighting market.

2. Wipro Lighting

Wipro Lighting, a division of Wipro Enterprises, has been at the forefront of providing innovative lighting solutions in India. The company offers smart LED lighting products that are compatible with voice assistants like Amazon Alexa and Google Assistant. Wipro’s smart bulbs and fixtures enable users to adjust brightness and color temperatures, enhancing both residential and commercial spaces with energy-efficient lighting solutions.

3. Havells India

Havells India is a renowned electrical equipment manufacturer that has ventured into the smart lighting segment. The company offers a range of smart LED bulbs and fixtures that can be controlled remotely via mobile applications. Havells’ smart lighting solutions are designed to provide energy efficiency and convenience, catering to the evolving needs of modern consumers.

4. Syska LED Lights

Syska LED Lights has emerged as a prominent player in India’s smart lighting industry. The company offers a variety of smart bulbs that can be controlled through mobile apps and are compatible with voice assistants. Syska’s focus on affordability and quality has made smart lighting accessible to a broader consumer base, contributing to the widespread adoption of intelligent lighting solutions.

5. Crompton Greaves Consumer Electricals

Crompton Greaves has a longstanding presence in India’s electrical industry and has embraced smart lighting technologies. The company offers smart LED bulbs and fixtures that can be controlled remotely, allowing users to customize lighting settings for different moods and occasions. Crompton’s integration of smart features into their lighting products reflects their commitment to innovation and customer-centric solutions.

6. Goldmedal Electricals

Goldmedal Electricals has diversified its product portfolio to include smart lighting solutions. The company’s smart LED bulbs and panels offer features like remote control, scheduling, and compatibility with popular voice assistants. Goldmedal’s emphasis on design aesthetics and functionality has positioned it as a notable player in the smart lighting market.

7. Orient Electric

Orient Electric, a part of the CK Birla Group, has expanded its offerings to include smart lighting products. The company’s smart LED bulbs and fixtures can be controlled via mobile apps, providing users with flexibility and convenience. Orient’s focus on energy efficiency and innovative designs has contributed to its growing presence in the smart lighting sector.

8. Bajaj Electricals

Bajaj Electricals has been a trusted name in the Indian electrical industry and has embraced smart lighting technologies. The company offers smart LED bulbs and luminaires that can be controlled remotely, enhancing user convenience and energy savings. Bajaj’s commitment to quality and innovation has enabled it to cater to the evolving demands of consumers seeking intelligent lighting solutions.

9. TP-Link

TP-Link, known for its networking products, has entered the smart lighting market in India. The company’s smart bulbs can be controlled through the Kasa app and are compatible with voice assistants like Amazon Alexa and Google Assistant. TP-Link’s expertise in connectivity solutions has facilitated the seamless integration of their smart lighting products into modern smart homes.

10. HomeMate

HomeMate specializes in smart home solutions, including smart lighting products. The company’s offerings include Wi-Fi-enabled RGB LED kits and smart bulbs that can be controlled remotely via mobile applications. HomeMate’s focus on user-friendly interfaces and customization options has made it a notable player in the Indian smart lighting landscape.

 

In conclusion, India’s smart lighting industry is witnessing rapid growth, with numerous manufacturers offering innovative and energy-efficient solutions. The companies highlighted above have played significant roles in shaping the market by providing products that cater to the evolving needs of consumers and businesses alike. As technology continues to advance, these manufacturers are poised to drive further innovation, contributing to a more connected and sustainable future.

The post Top 10 Smart Lighting Manufacturers in India appeared first on ELE Times.

• Accelerate wireless product development and manufacturing using versatile solutions with outstanding switching speed and signal purity in a variety of compact form-factors

– Keysight Technologies, Inc. has expanded its radio frequency (RF) and microwave instrument portfolio with six new analog signal generators, two vector signal generators, eight RF synthesizers, and three signal source analyzers. These new solutions provide RF engineers with compact tools, in single channel and multi-channel platforms, for component and device characterization at frequencies up to 54 GHz.

Signal generators and RF synthesizers are essential tools that RF engineers rely on routinely to test components, devices, and systems in areas such as radar and defense electronics, wireless communication systems, consumer electronics, and more. Signal source analyzers (SSA) help RF engineers to accurately characterize phase noise, jitter, and frequency stability in oscillators, synthesizers, and signal sources and active components across radar systems, wireless networks, high-speed computing, and optical communications. These analyzers are essential for ensuring signal purity, minimizing interference, and optimizing performance in critical RF and digital applications.

Keysight’s new signal generators provide performance, with low phase noise, good spectral purity, and fast switching speed, combined with multi-channel phase coherent options. The new portfolio of RF synthesizers provide pure and fast signals, with scaled down features in even more compact and cost-effective form factors for integration and manufacturing applications.

The new Keysight compact portfolio offers several key advantages:

• Portability: Compact size, lower weight, and power consumption versus other instruments in their class for easy transport, efficient use in lab.
• Rapid testing: Fast switching speed (down to 3 µs) can accelerate testing, mimic fast moving signals (e.g. RADAR), and boost throughput with multi-channel options.
• Low phase noise: Oven-controlled crystal oscillator stabilized signal (e.g. AP5021A phase noise -145 dBc/Hz at 1 GHz, 10 kHz offset, typical) for pure signals.
• Scalable channel count: Single channel options and multi-channel options with phase coherency; units can be linked together for multi-instrument phase coherency.
• Modulation capabilities combined with signal purity, fast switching and multi-channel capability: Supports amplitude modulation, frequency modulation, phase modulation, pulse modulation, pulse train, frequency chirps along with 400 MHz vector modulation.
• Fully Integrated SSA’s: Cross-correlation system with multi-programmable low noise DC supplies.
• Optimized user interface: Features an LCD touch screen and/or remote desktop PC software making it easy to operate.

Joe Rickert, Vice President and General Manager, Keysight High Frequency Measurements Center of Excellence, said: “These new signal generators, frequency synthesizers, and signal source analyzers provide RF engineers a number of new test tools that provide an exciting combination of technical performance, compact form factors, and cost-effectiveness. The generators provide excellent signal purity, fast switching, multi-channel phase coherency, and more, while the synthesizers offer pure and fast signal creation with targeted feature sets and reduced size for system integrators and manufacturers. The signal source analyzers support accurate characterization of important system components such as oscillators.  We are excited about the value that these new platforms will bring to engineers working in aerospace/defense, wireless communications, quantum computing, consumer electronics, education, and other applications.”

The post Keysight Expands RF and Microwave Portfolio with New Fast and Compact Test Instruments appeared first on ELE Times.

• ST first to put quad-band, multi-constellation design, needed for precise GNSS positioning accurate to a few centimeters, on a single die
• Innovative design ensures cost-effective precise positioning for road users and for new industrial applications, to increase the areas where autonomous vehicles can operate

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the Teseo VI family of global navigation satellite system (GNSS) receivers aimed at high-volume precise positioning use cases. For the automotive industry, Teseo VI chips and modules will be core building blocks of advanced driving systems (ADAS), smart in-vehicle systems, and safety-critical applications such as autonomous driving. They have also been designed to improve positioning capabilities in multiple industrial applications including asset trackers, mobile robots for home deliveries, managing machinery and crop monitoring in smart agriculture, timing systems such as base stations, and many more.

“Our new Teseo VI receivers represent a real breakthrough among positioning engines for several reasons: they are the first to integrate multi-constellation and quad-band signal processing in a single die; they are the first to embed a dual-Arm-core architecture enabling both very high performance and ASIL-level safety for assisted and autonomous driving applications. Last but not least, they embed ST’s proprietary embedded Non-Volatile-Memory (PCM), thus delivering a very integrated, cost-effective, and reliable platform for new precise-positioning solutions,” said Luca Celant, Digital Audio and Signal Solutions General Manager, STMicroelectronics. “ST’s new satellite-navigation receivers will support exciting, advanced capabilities in automotive ADAS applications and enable many new use cases being implemented by industrial companies.”

Teseo VI is the first in the market to integrate all the necessary system elements for centimeter accuracy into one die, supporting simultaneous multi-constellation and quad-band operations. This innovation simplifies the development of end-user navigation and positioning products, enhances reliability even in challenging conditions like urban canyons, and reduces bill-of-materials costs. Additionally, the single chip accelerates time to market and allows for compact and lightweight form factors.

The new Teseo VI family of precise positioning receiver chips leverages decades of experience and integrates multiple ST proprietary technologies, including precise positioning and advanced embedded memory.

The post STMicroelectronics releases innovative satellite navigation receiver to democratize precise positioning for automotive and industrial applications appeared first on ELE Times.

Devices and systems – from automotive and industrial to consumer electronics – rely on powerful, efficient, and secured microcontrollers for reliable operation. At embedded world 2025 in Nuremberg, Infineon Technologies AG will showcase how its innovative semiconductor solutions meet these needs and drive further advancements. The company will present high-quality microcontrollers featuring the latest technologies, enhanced security, and high precision – delivering excellent performance with low-power consumption. True to the motto “Driving decarbonization and digitalization. Together.” the Infineon booth in Hall 4A (booth #138) will present highlights from the consumer and IoT, automotive, and industrial sectors that contribute to a more sustainable future. In addition, customers can register for Infineon’s digital platform – the perfect place to dive deeper into the various technologies presented at embedded world during and after the event.

Infineon’s highlight topics at embedded world 2025

• Leading microcontrollers: The world of connected devices demands the highest reliability, precise calculations, robust security, energy efficiency, and user-friendly building blocks for high-quality designs.

At embedded world, Infineon will showcase its extensive MCU portfolio, featuring innovative solutions that drive progress. These include:

• PSOC microcontroller families
• TriCore-based AURIX family
• AIROC Wi-Fi-connected MCUs
• MOTIX MCUs
• Paving the way for RISC-V in automotive: Committed to establishing RISC-V as the open standard for automotive applications, Infineon is collaborating with key ecosystem partners to accelerate the adoption and maturity of RISC-V-based solutions.
• CRA-ready IoT solutions: Security is a prerequisite for connected devices and can be accomplished through either a secured MCU or a discrete security element. Mandatory regulations like the EU Cyber Resilience Act (CRA) or global initiatives like Matter aim to protect consumers and businesses using digital products and software. To meet these requirements, Infineon provides a range of high-security, CRA-ready solutions with Edge Protect: PSOC microcontrollers deliver robust security features, while OPTIGA discrete security elements integrate seamlessly with each PSOC.
• System Solutions: To help developers fully leverage MCUs, Infineon offers a comprehensive range of software solutions tailored to various industries. DEEPCRAFT Studio, Infineon’s edge AI development platform, and the DEEPCRAFT Ready Models, deliver an easy-to-use, end-to-end machine learning development experience – from data input to model deployment. ModusToolbox, a suite of development tools, libraries, and embedded runtime resources, provides a flexible and powerful development experience.
• Enabling AI: AI is transforming our world, and to unlock its full potential, companies need a partner offering a diverse portfolio of AI hardware and software solutions – from Automotive AI and AIoT to Industrial AI. Infineon provides specialized microcontrollers and highly precise sensors that enable intelligent and adaptive edge AI systems. Infineon’s high-performance, energy-efficient power supply solutions sustainably support the growing demands of AI applications.

Infineon at embedded world

Embedded world will take place in Nuremberg, Germany from 11 to 13 March, 2025. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth #138 and virtually. For press inquiries please contact media.relations@infineon.com. Industry analysts interested in a briefing can email  MarketResearch.Relations@infineon.com. Information about the embedded world show highlights is available at www.infineon.com/embedded-world.

The post Infineon presents innovative microcontroller solutions supporting high-quality designs at embedded world 2025 appeared first on ELE Times.

NXP Semiconductors, an innovator and supplier of Ultra-Wideband (UWB) solutions, and Rohde & Schwarz collaborate to demonstrate a test setup for UWB radar target simulation at the upcoming Mobile World Congress in Barcelona. The demonstration, being the first of its kind, verifies the unique performance of the NXP Trimension NCJ29D6A chipset including the enhanced radar algorithms. It is capable of generating UWB radar targets with a variable target distance down to a few centimeters, enabling maximum control and reproducibility of the simulated scenario.

Ultra-Wideband (UWB) technology is experiencing a steep growth in automotive, mobile and IoT markets, based on its secure and precise ranging capabilities. The Digital Key as defined by the Car Connectivity Consortium (CCC) leverages UWB for secure and convenient handsfree car access without compromises. The current-generation NXP Trimension UWB chipsets enable new UWB-radar use cases, such as Child Presence Detection (CPD), kick-sensing for easy trunk access, intrusion or proximity detection, and much more.

These UWB radar applications benefit from advanced target simulation, able to solve technical challenges, like short distance target simulation and large signal bandwidth, to mention just two. The key components are the R&S SMW200A signal generator, a R&S FSW26 spectrum analyzer and an R&S developed control software. The equipment used is available in UWB engineering laboratories today, hence reducing the initial capital investment. The demonstration is especially interesting for UWB chipset suppliers, module providers, Tier1s and vehicle OEMs.

In order to support the automotive ecosystem in testing these new use cases, collaboration with key partners is especially important. Rohde & Schwarz and NXP Semiconductors have worked closely together to validate this test system. Jürgen Meyer, Vice President Automotive Market Segment at Rohde & Schwarz remarked, “We greatly appreciate the close working relationship with the NXP Semiconductors teams around the world to realize this unique demonstration to provide the automotive industry with the test capabilities it needs to enable the next wave of UWB applications.”

An integral part of this demonstration setup is NXP’s Trimension NCJ29D6A, which is the first monolithic UWB chipset that combines secure ranging and short-range radar with an integrated MCU to enable use cases such as CPD, kick-sensing, and intrusion detection. “The demonstrator from Rohde & Schwarz allows our customers to validate their UWB radar systems and algorithms to shorten development cycles and optimize time-to-market,” said Michael Leitner, General Manager Secure Car Access, NXP Semiconductors. “This collaboration with Rohde & Schwarz is another milestone contributing to the success of UWB technology in the automotive market.”

The test setup will be shown at the Mobile World Congress in Barcelona, from the March 3 to March 6, 2025, at the Fira Gran Via, in Hall 5, booth 5A80.

The post MWC25: Rohde & Schwarz demonstrates unique UWB radar target simulation with NXP Trimension NCJ29D6 automotive solution appeared first on ELE Times.

As semiconductor scaling approaches fundamental limits, the industry is increasingly adopting chiplet-based architectures and heterogeneous integration to drive performance, power efficiency, and functionality. This shift is enabling new computing paradigms, from high-performance computing (HPC) to artificial intelligence (AI) accelerators and edge devices. This article explores the latest developments in chiplets, their role in modern semiconductor design, the challenges that lie ahead, and the technical innovations driving this revolution.

The Rise of Chiplet-Based Architectures

Traditional monolithic chip designs are facing bottlenecks due to escalating fabrication costs, yield issues, and power constraints. Chiplets offer a modular approach, enabling manufacturers to:

• Improve Yield: Smaller dies reduce defect density, improving overall yield and lowering per-unit cost.
• Enhance Performance: Optimized chiplets for different functions allow greater efficiency and performance scaling.
• Reduce Costs: Advanced nodes can be selectively used for performance-critical chiplets while other functions remain on mature nodes to balance cost and efficiency.
• Enable Scalability: Chiplets allow seamless integration of different process nodes and functionalities, ensuring adaptability across multiple applications.

The flexibility of chiplet-based designs is enabling complex computing architectures, where compute, memory, interconnect, and I/O functionalities are independently designed and integrated into a heterogeneous multi-die system.

Heterogeneous Integration: The Next Evolution in Semiconductor Design

Heterogeneous integration refers to the assembly of multiple dissimilar semiconductor components into a single package. This includes logic, memory, power management, RF, photonics, and sensors, combined to optimize system performance.

Key benefits of heterogeneous integration:

1. Increased Performance Density – More transistors can be packed per unit area without the constraints of monolithic die sizes.
2. Energy Efficiency – Improved power management through advanced interconnect technologies and proximity of critical functions.
3. Customizable Architectures – Modular design allows for application-specific optimizations in AI, HPC, and embedded systems.
4. Multi-Node Manufacturing – Different components can be fabricated using different technology nodes, enabling cost and performance trade-offs.

Key Technologies Enabling Chiplets and Heterogeneous Integration

1. Advanced Packaging Technologies

The success of chiplet integration depends on sophisticated packaging methodologies that ensure low-latency, high-bandwidth interconnects while maintaining power efficiency. The latest packaging technologies include:

• 2.5D Integration: Uses an interposer (silicon or organic) to connect multiple chiplets, offering high-speed interconnects with reduced power consumption.
• 3D Stacking: Enables vertical stacking of dies using Through-Silicon Vias (TSVs), achieving high interconnect density and bandwidth.
• Fan-Out Wafer-Level Packaging (FOWLP): Enhances signal integrity by reducing interconnect length and improving thermal performance.
• Wafer-to-Wafer and Die-to-Wafer Bonding: Enables ultra-dense 3D integration for logic-memory co-packaging and AI processors.

2. High-Speed Interconnects and Chiplet Standards

Efficient interconnects are critical for seamless communication between chiplets. Recent advancements include:

• Universal Chiplet Interconnect Express (UCIe) – An industry-standard interface for connecting chiplets from different vendors with minimized latency.
• Advanced Interface Bus (AIB) – Developed by Intel, enabling high-bandwidth chiplet communication for FPGA and AI accelerators.
• Bunch of Wires (BoW) – A low-power interconnect standard optimized for edge computing and AI applications.
• Silicon Photonics Interconnects – Optical interconnects enable ultra-high-speed data transfer between chiplets in HPC environments.

3. Power Delivery and Thermal Management

As chiplet architectures increase integration density, power and thermal constraints become critical challenges:

• Advanced Power Distribution Networks (PDNs) optimize efficiency across chiplets, ensuring stable voltage regulation.
• Thermal Interface Materials (TIMs) and liquid cooling solutions mitigate heat buildup in densely packed chiplet systems.
• On-Package Voltage Regulation (OPVR) reduces power loss in multi-die systems and enhances dynamic power allocation.

Industry Adoption and Notable Implementations

AMD’s Chiplet Approach

AMD pioneered the chiplet strategy with its Zen architecture, integrating multiple CCD (Core Complex Dies) with an IOD (I/O Die). The approach enhances yield and scalability while maintaining high performance.

Intel’s Heterogeneous Integration with Foveros

Intel’s Foveros 3D packaging allows high-performance logic stacking, demonstrated in products like the Meteor Lake processors, which integrate high-performance and power-efficient cores within a single package.

TSMC’s CoWoS and SoIC

TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) and System on Integrated Chips (SoIC) technologies provide cutting-edge 2.5D and 3D integration solutions for AI accelerators and HPC applications.

NVIDIA’s Hopper Architecture

NVIDIA’s Hopper GPU integrates multiple HBM stacks and logic dies using TSMC’s CoWoS-S technology, demonstrating the potential of chiplet-based HPC solutions.

Challenges in Chiplet and Heterogeneous Integration

Despite the benefits, challenges remain:

1. Interconnect Latency and Bandwidth – Efficient, low-latency interconnect solutions are required for high-speed data exchange between chiplets.
2. Standardization Issues – Lack of universal standards complicates cross-vendor chiplet integration and interoperability.
3. Design Complexity – Optimizing power, thermal efficiency, and routing in multi-die architectures requires advanced EDA (Electronic Design Automation) tools.
4. Manufacturing Costs – While chiplets can reduce per-unit costs, the added complexity in packaging and interconnects can offset savings.
5. Security and Reliability – Multi-vendor chiplet integration introduces security risks and potential failure points that require robust testing methodologies.

The Future of Chiplets and Heterogeneous Integration

The industry is rapidly evolving towards fully modular semiconductor designs, driven by:

• AI and Machine Learning – Custom chiplets optimized for AI workloads are expected to dominate future architectures.
• 3D Heterogeneous Computing – Next-generation chips will feature tightly integrated compute and memory stacks for high-speed processing.
• Chiplet Ecosystem Growth – Collaboration among semiconductor giants is leading to open standards like UCIe for universal chiplet interoperability.
• Quantum and Neuromorphic Computing – Emerging computing paradigms are leveraging chiplets for specialized, high-performance computation.
• AI-Assisted Chiplet Design – Machine learning and AI-driven automation are revolutionizing semiconductor design, optimizing layouts for power and performance efficiency.

Conclusion

Chiplets and heterogeneous integration represent the next frontier in semiconductor design, overcoming the limitations of traditional monolithic scaling. With industry leaders like AMD, Intel, TSMC, and NVIDIA driving advancements, we are entering an era of unprecedented performance and efficiency in computing architectures. While challenges remain in standardization, interconnects, and thermal management, continued innovation promises a future where chiplets become the fundamental building blocks of next-generation processors, ushering in a new era of modular, high-performance computing.

The post Chiplets and Heterogeneous Integration: The Future of Semiconductor Design appeared first on ELE Times.

The relentless drive toward miniaturization in electronics has led to a growing demand for materials that can sustain high performance at the nanoscale. Graphene, a two-dimensional allotrope of carbon, has emerged as a game-changer due to its exceptional electrical, thermal, and mechanical properties. This article explores the latest advancements in graphene-based electronics, focusing on its role in enabling ultra-miniaturized devices, challenges in fabrication, and future prospects.

Graphene’s Unique Properties for Electronics

Graphene’s exceptional properties make it an ideal candidate for miniaturized electronics:

• High Electrical Conductivity: Graphene exhibits carrier mobilities exceeding 200,000 cm²/V·s, significantly surpassing silicon, due to its unique Dirac cone band structure allowing ballistic transport over micrometer scales.
• Atomic Thickness: At just one atom thick (0.34 nm), graphene enables extreme device miniaturization, significantly reducing the short-channel effects encountered in silicon transistors.
• High Thermal Conductivity: With values up to 5000 W/m·K, graphene efficiently dissipates heat, crucial for high-performance electronics, especially in applications requiring ultra-high power density.
• Mechanical Strength: Graphene is over 200 times stronger than steel, ensuring durability in nano-scale applications and enabling mechanically flexible devices.
• Quantum Effects: Graphene’s electronic properties are governed by relativistic Dirac fermions, enabling high-speed transistors, valleytronic devices, and novel quantum computing architectures.

Graphene in Transistors and Logic Devices Graphene Field-Effect Transistors (GFETs)

Graphene-based transistors, or GFETs, are at the forefront of miniaturization due to their ultra-high carrier mobility and near-ballistic transport.

• Recent advances include dual-gated GFETs, which enhance carrier modulation and energy efficiency by reducing contact resistance and improving subthreshold slope.
• Researchers at MIT have demonstrated graphene-based sub-5nm transistors, showcasing potential replacements for conventional MOSFETs and FinFETs.
• The integration of graphene with high-k dielectrics such as HfO₂ has shown improved gate control and reduced leakage current.

Graphene Nano-Ribbons (GNRs) for Bandgap Engineering

One challenge with graphene is its lack of an intrinsic bandgap, making it difficult to use in digital logic. Narrowing graphene into nano-ribbons (GNRs) introduces a bandgap, allowing for graphene-based semiconductors.

• IBM has developed 5nm GNR transistors, which exhibit superior switching behavior compared to conventional silicon devices.
• Recent studies on doping GNRs with boron and nitrogen have further improved bandgap tunability and transistor performance.

Graphene in Memory and Storage Devices

Graphene’s potential in memory applications stems from its ability to form ultra-thin, high-capacity storage solutions with fast switching characteristics.

Graphene-Based Resistive RAM (RRAM)

Graphene oxide (GO)-based RRAM enables high-speed, low-power memory.

• Samsung and research institutions have demonstrated graphene-based non-volatile memory capable of replacing NAND flash storage with endurance exceeding 10¹² write cycles.

Graphene Supercapacitors for Fast-Charging Memory

Graphene supercapacitors provide ultra-fast charging and discharging, making them ideal for next-generation RAM and hybrid storage solutions.

• The incorporation of graphene aerogels and MXenes in supercapacitors has drastically improved capacitance and retention characteristics.

Graphene in Flexible and Wearable Electronics

The push toward wearable and bendable electronics demands materials that maintain high conductivity while being flexible. Graphene’s high mechanical flexibility and optical transparency make it ideal for:

• Flexible Displays: Graphene-based OLEDs and micro-LEDs enable ultra-thin, foldable screens.
• Wearable Sensors: Graphene-based biosensors detect physiological changes in real-time, with high sensitivity and selectivity.
• Smart Textiles: Integrated graphene circuits enable e-textiles for healthcare monitoring and human-machine interface applications.

Challenges in Graphene Electronics

Despite its potential, graphene electronics face challenges:

1. Scalability: Large-area, defect-free graphene synthesis remains difficult. Current CVD processes often introduce grain boundaries affecting electron transport.
2. Bandgap Engineering: Lack of a natural bandgap limits its application in digital logic. Research into graphene bilayers and heterostructures aims to address this.
3. Integration with CMOS: Seamless integration into existing silicon-based processes is challenging. Efforts in 2D material stacking with TMDs like MoS₂ show promise.
4. Fabrication Costs: High-quality graphene production methods such as CVD (Chemical Vapor Deposition) and mechanical exfoliation are expensive and require optimization.

Recent Breakthroughs and Solutions

• Graphene-Silicon Hybrid Chips: Researchers at the University of Manchester have demonstrated graphene-silicon hybrid devices, improving compatibility with existing chip technologies.
• Graphene-Doped 2D Materials: Heterostructures with h-BN (hexagonal boron nitride) and MoS₂ (molybdenum disulfide) provide tunable electronic properties and enhanced stability.
• AI-Assisted Material Design: Machine learning models are now accelerating the discovery of optimal graphene-based transistor architectures.
• Twistronics: The controlled twisting of graphene bilayers at specific angles (e.g., the magic angle ~1.1°) has enabled the discovery of superconducting states, opening doors for quantum computing applications.

The Future of Graphene in Electronics

The integration of graphene into commercial electronics is closer than ever. Major developments include:

• 5G and 6G Communications: Graphene antennas and RF components enable ultra-fast wireless networks with reduced energy consumption.
• Neuromorphic Computing: Graphene’s quantum properties contribute to brain-inspired computing architectures, with memristive behavior suitable for AI applications.
• Quantum Electronics: Graphene-based qubits and topological insulators are being explored for scalable quantum computing architectures.
• Spintronics: Graphene’s spin-orbit interactions are being leveraged for the next generation of low-power spintronic devices.

Conclusion

Graphene electronics is pushing the boundaries of miniaturization, promising a future of ultra-small, high-performance devices. While challenges remain in fabrication and integration, ongoing research and industry collaborations are accelerating progress. With continued advancements in materials engineering, device physics, and quantum mechanics, graphene may soon replace silicon as the foundation of next-generation nanoelectronics.

The post Graphene Electronics and Miniaturization: The Future of Nano-Scale Devices appeared first on ELE Times.

What is Blower Soldering?

Blower soldering is a technique that utilizes a hot air blower or a hot air rework station to melt solder and create electrical connections between components. Unlike traditional soldering, which uses a heated metal tip to apply solder, blower soldering employs a controlled stream of heated air to achieve uniform soldering, making it ideal for surface-mount device (SMD) components and rework applications.

This method is widely used in electronics repair, PCB assembly, and component rework due to its precision and ability to work with delicate electronic parts.

How Blower Soldering Works

Blower soldering involves the following key steps:

1. Preparation:
   • Ensure the work area is clean and free of dust.
   • Secure the printed circuit board (PCB) using a fixture or holder.
   • Select the appropriate solder paste or pre-applied solder.
2. Temperature & Airflow Settings:
   • Adjust the hot air blower or rework station to the required temperature, typically between 250-450°C, depending on the solder type and components.
   • Regulate the airflow to prevent displacement of small components.
3. Heating Process:
   • Direct the hot air over the target area in a circular or sweeping motion to evenly distribute the heat.
   • Observe the solder as it melts and forms solid electrical connections.
4. Cooling & Inspection:
   • Allow the soldered area to cool naturally or use a cooling fan.
   • Inspect the joints for uniformity and strength using a magnifying glass or microscope.
5. Cleaning:
   • Remove excess flux or residues using isopropyl alcohol and a brush.

Blower Soldering Process

1. Component Installation:

• Position the SMD components onto the PCB with solder paste applied.

2. Heating with Hot Air Blower:

• Apply heat evenly to reflow the solder paste and attach the components securely.

3. Cooling Phase:

• Allow the solder joints to solidify properly before handling the PCB.

4. Quality Check & Testing:

• Inspect for soldering defects such as bridges, cold joints, or insufficient solder.

Uses & Applications of Blower Soldering

Blower soldering is widely used in various electronics-related fields, including:

1. Surface-Mount Technology (SMT) Assembly

• Ideal for soldering micro-sized SMD components that cannot be soldered using traditional methods.

2. PCB Repair & Rework

• Used to remove and replace defective components on circuit boards.

3. BGA & QFN Package Soldering

• Enables effective reflow soldering of Ball Grid Array (BGA) and Quad Flat No-Lead (QFN) components.

4. Desoldering Applications

• Allows for easy removal of soldered components by melting the existing solder.

5. Prototyping & Low-Volume Manufacturing

• Useful for rapid prototyping of circuit designs before mass production.

Advantages of Blower Soldering

Blower soldering offers several benefits:

1. Precision Heating:
   • Ensures uniform temperature distribution, reducing thermal stress on components.
2. Non-Contact Soldering:
   • Unlike soldering irons, it prevents direct physical contact, minimizing damage to delicate parts.
3. Ideal for Complex Components:
   • Suitable for soldering fine-pitch components, including BGA and QFN packages.
4. Rework & Repair Flexibility:
   • Allows easy removal and replacement of individual components without damaging the PCB.
5. Even Heat Distribution:
   • Reduces the chances of cold joints or uneven solder application.
6. Compatible with Lead-Free Soldering:
   • Supports modern RoHS-compliant lead-free soldering processes.

Disadvantages of Blower Soldering

Despite its advantages, blower soldering has some limitations:

1. Risk of Overheating:
   • Excessive heat can damage sensitive electronic components.
2. Component Displacement:
   • High airflow settings may blow away lightweight SMD components.
3. Learning Curve:
   • Requires skill and practice to control airflow and temperature accurately.
4. Limited for Through-Hole Soldering:
   • Not ideal for soldering through-hole components, which require traditional soldering techniques.
5. Equipment Cost:
   • High-quality hot air rework stations can be expensive compared to basic soldering irons.

Conclusion

Blower soldering is a highly effective method for assembling and repairing modern electronic circuits, particularly for SMD components and rework applications. With proper technique and equipment, it ensures reliable and high-quality soldering results. However, it requires careful control of temperature and airflow to prevent damage to sensitive components.

As electronics continue to shrink in size and complexity, blower soldering remains an essential technique in PCB manufacturing, prototyping, and repair industries. Whether you are an electronics hobbyist or a professional technician, mastering blower soldering can significantly improve your ability to work with advanced circuit designs.

The post Blower Soldering Definition, Process, Working, Uses & Advantages appeared first on ELE Times.

Rohde & Schwarz, in collaboration with NVIDIA, has achieved a significant breakthrough in AI-driven wireless communication research. The latest proof-of-concept to be showcased at MWC 2025 in Barcelona leverages digital twin technology and high-fidelity ray tracing for more realistic testing of neural receivers for 5G-Advanced and 6G.

Rohde & Schwarz continues to push the boundaries of AI-driven wireless communication research with its latest milestone in neural receiver design and testing. To be showcased at MWC 2025 in Barcelona, the latest proof-of-concept, developed in collaboration with NVIDIA, integrates digital twin technology and high-fidelity ray tracing to create a robust framework for testing 5G-Advanced and 6G neural receivers under realistic propagation conditions. The objective is to bridge the gap between AI-driven wireless simulations and real-world deployment, thereby facilitating more efficient and accurate testing of next-generation receiver architectures.

This marks the fourth significant milestone in a long-term collaboration of Rohde & Schwarz with NVIDIA with demonstration showcased at past Mobile World Congress events. The joint demonstrations have pioneered advancements in AI/ML for wireless communications over the past years, from the training of neural receivers for handling analog impairments to the design of custom constellations for pilotless communications.

At the core of the demonstration is NVIDIA Sionna, a GPU-accelerated open-source library for link-level simulations, which provides ray-traced wireless channel models to generate realistic RF propagation conditions. The simulation results can then be seamlessly transferred to the R&S SMW200A vector signal generator from Rohde & Schwarz, which emulates complex real-world radio channels without requiring expensive external RF fading equipment. This advanced testbed enables testing and verification of AI/ML-based receiver algorithms and supports data-driven fine-tuning of neural components using realistic training data.

To ensure that the digital twin and ray-tracing models accurately reflect real-world conditions, the simulation is calibrated with data from a dedicated channel-sounding measurement campaign set in an urban street-canyon environment. By combining these precise measurements with NVIDIA Sionna, the ray tracer’s ability to model material interactions and electromagnetic propagation is further refined. The result is a calibrated version of the digital twin of the physical RF environment. This combination of technologies enables more accurate site-specific testing and validation of next-generation machine learning-based communication algorithms, including applications such as neural receivers and ML-based CSI feedback enhancements.

Gerald Tietscher, Vice President Signal Generators, Power Supplies and Meters at Rohde & Schwarz, said: “The collaboration with NVIDIA marks a significant milestone in advancing AI/ML applications in wireless communications. Our work has already demonstrated the potential of AI in wireless system design, from custom constellations to neural receivers handling real-world impairments. Now, with the integration of digital twins and ray tracing, we are further expanding the possibilities of AI-driven signal processing.”

Soma Velayutham, Vice President of Telecommunications at NVIDIA, said: “Digital twin technology has transformative potential in wireless system design. By integrating advanced NVIDIA ray tracing and machine learning into receiver development, Rohde & Schwarz is paving the way for AI-native 6G networks poised to offer outstanding efficiency and innovation compared with conventional implementations.”

Rohde & Schwarz is a key contributor to global 6G research, collaborating with industry partners, research institutions, and standardization bodies to develop the next generation of wireless technologies, expected to be commercially deployed by 2030.

Visitors to MWC 2025 can experience this milestone demonstration live and speak with experts from Rohde & Schwarz and NVIDIA at the Rohde & Schwarz booth 5A80 in hall 5 of the Fira Gran Via in Barcelona from March 3 to 6, 2025. For further information on AI/ML for 6G networks, visit: https://www.rohde-schwarz.com/_257029.html

The post Rohde & Schwarz advances AI/ML-powered neural receiver testing in collaboration with NVIDIA appeared first on ELE Times.

Madhya Pradesh, a central Indian state, has emerged as a significant hub for solar energy, contributing substantially to India’s renewable energy goals. The state’s vast land resources and high solar irradiance make it an ideal location for large-scale solar power projects. This article provides an overview of the major solar power plants in Madhya Pradesh, highlighting their capacities, unique features, and contributions to the state’s energy landscape.

1. Rewa Ultra Mega Solar Power Project

Commissioned in 2018, the Rewa Ultra Mega Solar Power Project is a landmark in India’s renewable energy sector. Located in the Gurh tehsil of Rewa district, this 750 MW solar park spans approximately 1,590 acres. It was among the first projects in India to achieve grid parity, with a first-year tariff of INR 2.97 per unit, significantly lower than previous records. The project is operated by Rewa Ultra Mega Solar Limited (RUMSL), a joint venture between Madhya Pradesh Urja Vikas Nigam Limited and the Solar Energy Corporation of India. Notably, about 24% of the energy produced is supplied to the Delhi Metro Rail Corporation, meeting 60% of its daytime energy requirements.

2. Welspun Solar MP Project

Situated in Bhagwanpura village of Neemuch district, the Welspun Solar MP Project is a 151 MW photovoltaic power station. This project underscores the state’s commitment to harnessing solar energy and contributes significantly to the local grid, supporting both residential and industrial consumers.

3. Agar Solar Park

The Agar Solar Park, currently under development, is poised to add 550 MW to Madhya Pradesh’s solar capacity. Developed by RUMSL, this project is part of a broader initiative to establish multiple solar parks across the state, aiming for a combined capacity of 1.5 GW. The Agar Solar Park is expected to play a crucial role in meeting the region’s energy demands sustainably.

4. Shajapur Solar Park

Also under development by RUMSL, the Shajapur Solar Park will contribute an additional 450 MW to the state’s renewable energy portfolio. This project, along with the Agar and Neemuch Solar Parks, reflects Madhya Pradesh’s strategic efforts to expand its solar infrastructure and reduce reliance on fossil fuels.

5. Neemuch Solar Park

The Neemuch Solar Park is set to enhance the state’s solar capacity by 500 MW. Developed by RUMSL, this project is part of the trio of solar parks, including Agar and Shajapur, collectively aiming to add 1.5 GW of renewable energy to Madhya Pradesh’s grid. These initiatives are instrumental in positioning the state as a leader in India’s solar energy sector.

6. Omkareshwar Floating Solar Power Park

A pioneering project, the Omkareshwar Floating Solar Power Park is being constructed on the reservoir of the Omkareshwar Dam in Khandwa district. With a planned capacity of 600 MW, this floating solar installation is among the largest globally. The project is being developed in phases, with the initial phase commissioned in August 2024, adding 90 MW to the grid. This innovative approach not only utilizes existing water bodies but also minimizes land usage, showcasing a sustainable model for future projects.

7. ACME Solar Energy-Madhya Pradesh Solar PV Park

Commissioned in March 2014, the ACME Solar Energy-Madhya Pradesh Solar PV Park is a 30 MW photovoltaic power project. Located in Madhya Pradesh, this plant contributes to the state’s renewable energy supply, supporting both local communities and industries.

Upcoming Investments by NTPC

In a significant development, India’s state power company NTPC has announced plans to invest over $23 billion in renewable energy projects in Madhya Pradesh. This investment will encompass various projects, including solar, wind, and pumped hydro, aiming to add up to 20 GW of capacity. This initiative underscores the state’s potential and attractiveness for large-scale renewable energy investments.

Conclusion

Madhya Pradesh’s strategic investments and developments in solar energy have positioned it as a frontrunner in India’s renewable energy landscape. The state’s combination of large-scale solar parks, innovative floating solar projects, and substantial upcoming investments reflects a robust commitment to sustainable energy solutions. These initiatives not only contribute to meeting regional energy demands but also play a vital role in India’s overarching goal of transitioning to a greener and more sustainable energy future.

The post Major Solar Power Plants in Madhya Pradesh Driving Renewable Energy Growth appeared first on ELE Times.

Anritsu Corporation is pleased to announce that SK Telecom (SKT), the largest mobile operator in South Korea, and Pohang University of Science and Technology (POSTECH), a university that is a leader in advanced research, have selected the Anritsu Radio Communication Test Station MT8000A for the verification of the technologies used to realize mobile communication that combines antenna expansion technologies with Artificial Intelligence (AI).

Driving this development is a need to address the growing requirement for innovation in 5G-Advanced mobile communication systems, specified in 3GPP Release 18 and beyond. This development has achieved real-time AI-based optimization that helps solve the problem of interference arising from increasing the number of antennas mounted on a smartphone from the typical four to the current maximum of eight. This demonstration utilized the MT8000A as a base station simulator for mobile communications, revealing a remarkable improvement in the data transmission speed despite the smartphone under test remaining the same size as a conventional device and operating within the same frequency bandwidth.

The MT8000A complies with the 3GPP test standards and supports a wide range of tests, including RF measurements, protocol tests, and application tests for 5G mobile network technologies. The hardware is based on a modular architecture, making it easy to reconfigure according to the test requirements, such as higher-order MIMO (4×4 MIMO) and carrier aggregation (8CA).

To contribute to the advancement of cutting-edge telecommunications technology, Anritsu will continue to support R&D for next-generation networks by leveraging 6G and AI while strengthening our efforts to be an innovator in the area of these technologies.

The demo video for this verification will be showcased at the Mobile World Congress (MWC) Barcelona 2025 Anritsu booth, from March 3 to March 6, 2025, in Barcelona, Spain.

The post Anritsu’s Test Solutions Contribute to Enhanced Communication Performance by Combining SK Telecom and POSTECH’s Antenna Expansion Technologies with AI appeared first on ELE Times.

Available With C0G (NP0) and X7R Dielectrics, Devices Feature Voltages to 3000 VDC and Capacitance From 1.5 pF to 100 nF in Seven Case Sizes From 1206 to 2225

Vishay Intertechnology, Inc. today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high voltage commercial applications. Offered in seven case sizes ranging from 1206 to 2225, VJ….W1HV High Voltage MLCC Commercial Series devices extend the capacitance values of the company’s existing high voltage MLCCs with the ultra stable C0G (NP0) dielectric and are also available with the X7R dielectric for even higher capacitance.

The devices released today are manufactured in a base metal electrode (BME) system with a dry sheet technology process to reduce costs for a wide range of high voltage applications. The MLCCs will be used as input filtering, output filtering, and snubber capacitors for alternative and conventional energy generation, distribution, metering, management, and storage; industrial automation, motor drives, power tools, and welding equipment; consumer appliances; telecom mobile and fixed infrastructure; and medical instrumentation.

VJ….W1HV High Voltage MLCC Commercial Series devices with the C0G (NP0) dielectric offer high voltages to 3000 VDC, capacitance values from 1.5 pF to 82 nF, and a temperature coefficient of capacitance (TCC) of 0 ppm/°C ± 30 ppm/°C from -55 °C to +125 °C. X7R devices provide capacitance from 100 pF to 100 nF, voltages to 2000 VDC, and TCC of ± 15 % from -55 °C to +125 °C.

The MLCCs feature a nickel barrier with 100 % tin terminations and are available with polymer terminations for additional protection against board flexure damage. The devices are RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table:

Dielectric	Case code	Maximum voltage (V)	Capacitance
			Minimum	Maximum
C0G (NP0)	1206	3000	1.5 pF	10 nF
	1210	3000	10 pF	10 nF
	1808	3000	2.2 pF	3.3 nF
	1812	3000	10 pF	22 nF
	1825	3000	10 pF	39 nF
	2220	2000	10 pF	47 nF
	2225	2000	10 pF	82 nF
X7R	1206	2000	100 pF	1.2 nF
	1210	2000	100 pF	1.2 nF
	1808	2000	150 pF	1.8 nF
	1812	2000	270 pF	1.8 nF
	1825	1000	1.0 nF	100 nF
	2220	1000	1.0 nF	1.8 nF
	2225	1000	1.0 nF	1.8 nF

Samples and production quantities of the VJ….W1HV High Voltage MLCC Commercial Series devices are available now, with lead times of 18 weeks.

The post New Vishay Intertechnology High Voltage MLCCs Deliver Extended Capacitance for Commercial Applications appeared first on ELE Times.