ELE Times

• New technology delivers more than 20% power consumption reduction per day in addition to improved security and privacy
• ST solution combines market leading Time-of-Flight (ToF) sensors and unique AI algorithms for a seamless user experience

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new Human Presence Detection (HPD) technology for laptops, PCs, monitors and accessories, delivering more than 20% power consumption reduction per day in addition to improved security and privacy. ST’s proprietary solution combines market-leading FlightSense Time-of-Flight (ToF) sensors with unique AI algorithms to deliver a hands-free fast Windows Hello authentication; and delivers a range of benefits such as longer battery lifetime, and user-privacy or wellness notifications.

“Building on the integration of ST FlightSense technology in more than 260 laptops and PC models launched in recent years, we are looking forward to see our new HPD solution contributing to make devices more energy-efficient, secure, and user-friendly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “As AI and sensor technology continue to advance, with greater integration of both hardware and software, we can expect to see even more sophisticated and intuitive ways of interacting with our devices, and ST is best positioned to continue to lead this market trend.”

“Since 2023, 3D sensing in consumer applications has gained new momentum, driven by the demand for better user experiences, safety, personal robotics, spatial computing, and enhanced photography and streaming. Time-of-Flight (ToF) technology is expanding beyond smartphones and tablets into drones, robots, AR/VR headsets, home projectors, and laptops. In 2024, ToF modules generated $2.2 billion in revenue, with projections reaching $3.8 billion by 2030 (9.5% CAGR). Compact and affordable, multizone dToF sensors are now emerging to enhance laptop experiences and enable new use cases,” said Florian Domengie, PhD Principal Analyst, Imaging at Yole Group.

The 5th generation turnkey ST solution
By integrating hardware and software components by design, the new ST solution is a readily deployable system based on FlightSense 8×8 multizones Time-of-Flight sensor (VL53L8CP) complemented by proprietary AI-based algorithms enabling functionalities such as human presence detection, multi-person detection, and head orientation tracking. This integration creates a unique ready-to-use solution for OEMs that requires no additional development for them.

This 5th generation of sensors also integrates advanced features such as gesture recognition, hand posture recognition, and wellness monitoring through human posture analysis

ST’s Human Presence Detection (HPD) solution enables enhanced features such as:

Adaptive Screen Dimming tracks head orientation to dim the screen when the user isn’t looking, reducing power consumption by more than 20%.

Walk-Away Lock & Wake-on-Attention automatically locks the device when the user leaves and wakes up upon return, improving security and convenience.

Multi-Person Detection alerts the user if someone is looking over their shoulder, enhancing privacy.

Tailored AI algorithm
STMicroelectronics has implemented a comprehensive AI-based development process that from data collection, labeling, cleaning, AI training and integration in a mass-market product. This effort relied on thousands of data-logs from diverse sources, including contributions from workers who uploaded personal seating and movement data over several months, enabling the continuous refinement of AI algorithms.

One significant achievement is the transformation of a Proof-Of-Concept (PoC) into a mature solution capable of detecting a laptop user’s head orientation using only 8×8 pixels of distance data. This success was driven through a meticulous development process that included four global data capture campaigns, 25 solution releases over the course of a year, and rigorous quality control of AI training data. The approach also involved a tailored pre-processing method for VL53L8CP ranging data, and the design of four specialized AI networks: Presence AI, HOR (Head Orientation) AI, Posture AI, and Hand Posture AI. Central to this accomplishment was the VL53L8CP ToF sensor, engineered to optimize the Signal-To-Noise ratio (SNR) per zone, which played a critical role in advancing these achievements.

Enhanced user experience & privacy protection
The ToF sensor ensures complete user privacy without capturing images or relying on the camera, unlike previous versions of webcam-based solutions.

Adaptive Screen Dimming:

• Uses AI algorithms to analyze the user’s head orientation. If the user is not looking at the screen, the system gradually dims the display to conserve power.
• Extends battery life by minimizing energy consumption.
• Optimizes for low power consumption with AI algorithms and can be seamlessly integrated into existing PC sensor hubs.

Walk-Away Lock (WAL) & Wake-on-Approach (WOA):

• The ToF sensor automatically locks the PC when the user moves away and wakes it upon their return, eliminating the need for manual interaction.
• This feature enhances security, safeguards sensitive data, and offers a seamless, hands-free user experience.
• Advanced filtering algorithms help prevent false triggers, ensuring the system remains unaffected by casual passerby.

Multi-Person Detection (MPD):

• The system detects multiple people in front of the screen and alerts the user if someone is looking over their shoulder.
• Enhances privacy by preventing unauthorized viewing of sensitive information.
• Advanced algorithms enable the system to differentiate between the primary user and other nearby individuals.

Technical highlights: VL53L8CP: ST FlightSense 8×8 multizones ToF sensor. https://www.st.com/en/imaging-and-photonics-solutions/time-of-flight-sensors.html

• AI-based: compact, low-power algorithms suitable for integration into PC sensor hubs.
• A complete ready-to-use solution includes hardware (ToF sensor) and software (AI algorithms).

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The latest DSC devices with specialized peripherals for efficient power conversion target data center power supplies and other complex real-time systems

Evolving security and functional safety demands, coupled with the growing complexity of real-time embedded applications, are driving designers to seek innovative solutions that deliver greater accuracy, improved reliability and compliance with industry standards. To address these challenges, Microchip Technology has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 Digital Signal Controller (DSC) families to its dsPIC33A DSC product line. The devices enable the implementation of computation-intensive control algorithms for improved energy efficiency in motor control, AI server power supplies, energy storage systems and complex sensor signal processing with Machine Learning (ML)-based inferencing.

“As AI servers and data centers continue to grow, the need for more efficient power conversion is essential. With specialized peripherals and the high-performance core in the dsPIC33AK512MPS family, developers can now achieve significant energy savings and shrink their power supply footprints,” said Joe Thomsen, corporate vice president of Microchip’s digital signal controller business unit. “The new dsPIC33A DSC families are packed with advanced features that enable efficient and reliable designs for modern power conversion, motor control and sensing applications.”

The dsPIC33AK512MPS family delivers precise, high-speed control through industry-leading 78 ps high-resolution Pulse Width Modulations (PWMs) and low-latency 40 Msps ADCs, enabling fast and accurate control loops essential for optimizing the performance of Silicon Carbide (SiC) and Gallium Nitride (GaN)-based DC-DC converters. Additionally, dsPIC33AK512MPS devices include advanced security features, an integrated touch controller and a high pin count of up to 128 pins. The dsPIC33AK512MC family is designed to offer low-latency, 40 Msps ADCs and 1.25 ns PWM resolution, providing a feature- and cost-optimized solution for multi-motor control and complex embedded applications.

The dsPIC33A DSC families, with up to 512 KB Flash and a rich peripheral set, integrate a double precision floating-point unit to accelerate mathematical computations and leverage a 32-bit architecture for seamless adoption of model-based design code. Their enhanced instruction set and Digital Signal Processing (DSP) capabilities, including single-cycle MAC operations and a 200 MHz core speed, make these devices highly efficient for low-latency, real-time control applications. Supported by MPLAB Machine Learning Development Suite, dsPIC33A devices streamline the ML workflow by automating data preparation, feature extraction, training, validation and firmware conversion of optimized models.

“dsPIC33A DSCs from Microchip provide high performance and reliability for complex automotive Electronic Control Units (ECUs),” said Norbert Weiss, managing director at Lauterbach GmbH. “Combined with the support of our latest TRACE32 solutions, we help dsPIC33A DSC customers accelerate their time-to-market using our leading debug and trace tools from the start of the development process.”

With a range of hardware safety features, dsPIC33AK512MPS/MC DSCs are compliant with functional safety standards and are developed in accordance with International Organization for Standardization (ISO) 26262 and International Electrotechnical Commission (IEC) 61508 processes, making them suitable for safety-critical automotive and industrial applications. To further enhance system-level security, the dsPIC33AK512MPS DSC family includes integrated crypto accelerators and a Flash security module, enabling immutable root of trust, secure boot, secure firmware upgrades and secure debug capabilities.

“The combination of dsPIC33A DSCs and our pre-certified safety-critical real-time operating system, SAFERTOS, simplifies the development of safety-critical applications,” said Andrew Longhurst, managing director of WITTENSTEIN high integrity systems (WHIS). “This system level solution empowers our clients to deliver reliable and efficient solutions that meet automotive and industrial safety standards.”

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The R&S FSWP phase noise analyzer and VCO tester from Rohde & Schwarz, the industry standard for phase noise testing, has just received a major performance update. It is the optimal test solution for radar applications and when developing and manufacturing synthesizers, OCXOs, DROs and VCOs. With the new option R&S FSWP-B56G, Rohde & Schwarz has extended the frequency range for absolute phase noise measurements from 50 GHz up to 56 GHz. Done simply by pushing a button, no external converter is needed. These frequencies are needed for satellite communication and for jitter measurements in high-speed digital applications such as ultra-fast LAN IEEE 802.3dj or CEI-224G (Common Electrical I/O).

Speeding up measurements with external high-end signal sources

In addition, the updated R&S FSWP now supports external signal sources as local oscillators for absolute phase noise measurements up to 56 GHz. Using a high-end signal source enables users to get their results much faster, because only a few cross correlations are needed to measure the phase noise of the DUT, such as another high-end oscillator. Depending on the quality of the source, users can measure up to 1000 times faster compared to the internal source. The R&S FSWP provides tuning outputs to lock the signal source frequencies used as local oscillators to the DUT frequency. In this mode, users can measure with one or two external oscillators to get the full advantage using cross-correlation techniques. Alternatively, they can use this mode to measure two identical sources against each other (2 DUT method) and correct the results by 3 dB.

Additive and residual phase noise measurements up to 56 GHz

Equipped with R&S FSWP-B56G option, the instrument is also useful for additive and residual phase noise measurements up to 56 GHz with a frequency offset of 40 MHz on amplifiers or other components. The frequency range of the internal source for this application is now extended to 50 GHz, or up to 54 GHz with the R&S FSWP-B56G option. With external sources users can measure up to 56 GHz.

In addition, the R&S FSWP features a new marker function “NOISE FIGURE MARKER”. Users can measure the noise figure of an amplifier easily, just connecting it between the output of the signal source and input of the R&S FSWP. This easy new method for measuring the small signal noise figure of amplifiers is based just on the phase demodulation same as the phase noise measurement. As the R&S FSWP is equipped with a signal and spectrum analyzer, it delivers both the Y-factor measurement based on noise sources with a calibrated ENR in the spectrum analyzer as well as the new noise figure measurement based on demodulation in the phase noise tester.

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• Exceeds industry and safety standards so engineers can safeguard the integrity of designs
• Built-in graphical charting tools, intuitive interfaces, and standardized menus for quickly uncovering critical insights

Keysight Technologies, Inc. introduces its Smart Bench Essentials Plus, a next-generation portfolio of core bench instruments designed to deliver improved precision and reliability. The new portfolio includes Keysight’s power supply, waveform generator, digital multimeter, and oscilloscope, advanced instruments that are comprehensively tested to meet and exceed industry and safety standards, such as ISO/IEC17025, IEC61010, and CSA.

Electronic designs are increasingly complex, with additional input and output variables, strict interoperability requirements, and rigorous conformance standards. This complexity means basic bench instruments must deliver improved power, expanded channel capacity, and enhanced precision. Development engineers rely on tools to deliver this, in order to perform numerous daily measurements that will enable them to quickly draw meaningful insights and make decisions based on precise measurements.

The new Keysight Smart Bench Essentials Plus meets this challenge with accurate and precise digital multimeters, high signal integrity waveform generators, reliable and responsive DC power supplies, and a very low noise floor oscilloscope. The solutions are designed for lower noise performance, suitable for development engineers who need to design, test, troubleshoot, and qualify electronics designs.

Key benefits of Smart Bench Essential Plus include:

• Minimized measurement errors and precise results: Powered by Keysight Truevolt technology, the new solutions reduce errors from real world factors, delivering improved insights. In addition, the custom ASIC and 14-bit ADC deliver precision and low-noise performance measurements.
• Ensure product quality and compliance: The test instruments are designed and rigorously tested to meet ISO/IEC 17025, IEC61010, and CSA international standards to ensure engineers can develop quality products with precision and reliability.
• Improved productivity: Features visually intuitive, color-coordinated interfaces and standardized menus for ease of use. Built-in graphical charting tools simplify visualization and analysis of test results, while including software streamlines configuration, control, and automation to improve validation time.

Carol Leh, Vice President, Electronic Industrial Solutions Group Center of Excellence at Keysight, said: “R&D engineers face increasing complexity, requiring not only more accurate insights, but tools which can streamline workflows. At Keysight we have thoughtfully designed an integrated solution that can meet this demand, with automation at the core, providing ease of use and shorter time to value. This elevated set of instruments, equipped with proven pro-level measurement technologies, delivers precision and reliability, helping our customers to develop quality products faster.”

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Infineon Technologies AG provides its EZ-USB FX10 and FX5 controllers to CIS Corporation for its new USB 5 Gbit/s and 10 Gbit/s camera. These next-generation devices build on the EZ-USB FX3, a widely adopted USB peripheral controller, by adding support for high-speed USB 10 Gbit/s and LVDS interfaces. This advancement increases total data bandwidth by up to 275 percent compared to the previous generation, enabling significantly faster data transfer and improved system performance.

“We are proud to support CIS in bringing next-generation products to the market with our EZ-USB controllers,” says Ganesh Subramaniam, Senior Vice President of Wired Connectivity Solutions at Infineon. “By combining high data throughput, low power consumption, and flexible connectivity, our solutions enable customers to develop advanced USB 3.2 products with shorter time-to-market and compact form factors. The collaboration with CIS is an excellent example of how our technology is driving innovation in emerging data-intensive applications across various industries.”

The EZ-USB FX10 features dual Arm Cortex-M4 and M0+ cores, 512 KB of flash memory, 128 KB of SRAM, 128 KB of ROM, and seven serial communication blocks (SCBs). It includes a cryptography accelerator and a high-bandwidth data subsystem that enables direct memory access (DMA) transfers between LVDS/LVCMOS interfaces and USB ports at speeds of up to 10 Gbit/s. An additional 1 MB of SRAM supports USB data buffering. The controller also offers USB-C connection detection and flip-mux functionality, removing the need for external logic components. This combination of processing power, interface flexibility, and integrated features supports a wide range of high-speed USB applications.

With the introduction of its new USB 3.2 cameras, CIS aims to expand beyond the industrial image processing market into sectors such as logistics, robotics, medical technology, and life sciences – areas where connectivity, speed, image quality, and compact design are critical. Product samples are already finalized, and mass production is scheduled to begin in July. In addition, CIS is expanding its portfolio with new camera models across multiple resolutions.

“We are developing models with 3M, 5M, 4K/8M, and 20M pixel sensors based on EZ-USB FX5 and FX10,” says Yusuke Muraoka, President of CIS Corporation. “Thanks to Infineon’s support, we expect to complete development in a relatively short time – despite having no prior experience with USB 3.2 technology, which makes this achievement particularly noteworthy.”

The upcoming 4K version of the camera integrates CIS’s proprietary Clairivu image signal processor (ISP). Despite this added complexity, the low power dissipation of EZ-USB FX5 and FX10 allows the device to fit into a compact 29 mm cubic housing – reducing the volume by approximately 50 percent compared to CIS’s previous 4K model. Combined with plug-and-play USB connectivity, this compact design greatly enhances the camera’s versatility and ease of integration.

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Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is excited to announce the launch the 6th edition of its India IoT Technical Roadshow across India. The 2025 edition of this eagerly anticipated event series will begin in Pune on June 20, followed by Ahmedabad on June 27, Chennai on July 11, and Bengaluru on July 17.

The roadshow will bring together design engineers, technology leaders, practitioners, FAEs, EMS, OEMs, and ecosystem enablers to explore the latest advancements in IoT with live demos, technical sessions, and networking opportunities. Our esteemed technology partners – Analog Devices, Littelfuse, Molex, Phoenix Contact, Samtec, Silicon Labs, Taiyo Yuden, Bel Fuse and Würth Elektronik will be on hand to showcase their latest products and solutions.

Daphne Tien, Vice President of Marketing and Business Development for Mouser APAC, shared, “Mouser’s flagship India IoT Technical Roadshow is more than just an event. It is a reflection of our deep belief in India’s dynamic tech landscape that presents immense opportunities for innovation in IoT applications. We are excited to continue this journey, helping engineers innovate, collaborate and bring cutting-edge solutions to life. This year we have curated knowledge-based events in 4 technological hubs of India, with unique themes in each city, to ensure that participants get relevant and actionable insights.”

The event in Pune is being held at Four Points by Sheraton, Viman Nagar, and the theme is Pioneering Automotive Electronics Innovations. In Ahmedabad we will be at the Hyatt with the theme Connecting the Future: Advances in RF, Wireless & Wired Technologies.  The Chennai Roadshow will be held at Hyatt Regency on the theme Building the Future with Efficient Manufacturing. Resilience in Extremes with Rugged Electronics is our theme for Bangalore and the event will be held at The Taj, MG Road.

The roadshow will feature live demonstrations, technical sessions, and interactive discussions focusing on key sectors such as smart manufacturing, automotive and smart cities at every event. Attendees will also have the opportunity to engage with Mouser’s manufacturer partners to gain insights into the latest products and solutions shaping the future of IoT.

Mouser Electronics provides comprehensive design support through its vast technical resource library on engineering topics that will shape the future. You can access exclusive technical information through  Empowering Innovation Together series, eBooks, newsletters and new product emails, and online tools to accelerate your project.

Prior registration for the event is mandatory as seats are limited. Interested participants are encouraged to register for free and secure their spot at https://mouseriotroadshow.electronicsforu.com/

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Focus Is on Protecting Critical Markets Such as Automotive, Industrial IoT, and Secure Infrastructure

CEA-Leti and Soitec announced a strategic partnership to enhance the cybersecurity of integrated circuits (ICs) through the innovative use of fully depleted silicon-on-insulator (FD-SOI) technologies. This collaboration aims to position FD-SOI as a foundational platform for secure electronics by leveraging and extending its inherent resistance to physical attacks.

At the heart of the initiative is a joint effort to experimentally validate and augment the security benefits of FD-SOI—from the substrate level up to circuit design. The project aims to deliver concrete data, practical demonstrations, and roadmap guidance to meet the surging cybersecurity demands in critical markets such as automotive, industrial IoT, and secure infrastructure.

Combining Expertise to Secure the Future of Electronics

The partnership, which will utilize GlobalFoundries’ advanced chip manufacturing capabilities, will address a growing need for trusted components in embedded and cyber-physical systems—systems that must deliver security services and withstand both software- and hardware-level attacks. With FD-SOI’s proven advantages against laser fault injection (LFI) attacks due to its thin-film architecture and channel isolation, the technology presents a compelling foundation for next-generation secure IC design.

Key goals of the partnership include:

• Highlighting FD-SOI’s existing strengths in cybersecurity.
• Co-developing innovations across the substrate-design stack to boost physical robustness and meet security requirements in automotive and other embedded systems.
• Demonstrating empirical security data to reinforce FD-SOI’s credibility in certification contexts such as SESIP and Common Criteria.

Context: Rising Threats, Rising Demand

“In an era marked by increasing attacks on connected systems and autonomous vehicles, the need for embedded hardware capable of resisting physical tampering has never been greater,” said CEA-Leti CTO Jean-René Lequepeys. “FD-SOI’s unique combination of performance, energy efficiency, and attack resistance offers an ideal answer for industries that demand both trust and efficiency. This project will leverage research results from the FAMES Pilot Line.”

FD-SOI’s critical benefits include:

• Physical attack resistance, enabled by electrical isolation between the channel and substrate.
• Power-performance optimization, vital for battery-constrained applications like automotive ECUs and industrial sensors.
• Security design enablement, allowing tailored countermeasures such as fault detection and isolation of sensitive circuit domains.

Long-Term Vision: Toward a New Cyber-Substrate

While the initial phase focuses on leveraging existing FD-SOI capabilities, the project sets the stage for long-term innovation. The envisioned next-generation cyber-substrate would expand upon FD-SOI’s strengths by incorporating:

• Enhanced protection against backside and invasive physical attacks.
• Embedded anti-tamper features and physical unclonable functions (PUFs) for hardware fingerprinting.
• Dynamic response mechanisms to detect and counter emerging threats.

This future-oriented work will address both cyber and supply-chain vulnerabilities—making FD-SOI not only more secure, but also more indispensable.

Soitec’s Senior Executive Vice President in charge of Innovation and Chief Technology Officer Christophe Maleville said: “This partnership with CEA-Leti reflects our strategic ambition to position FD-SOI as a reference platform for secure and energy-efficient electronics. By combining our substrate innovation capabilities with CEA-Leti’s research excellence, we aim to demonstrate the full potential of FD-SOI in addressing today’s most pressing security challenges. Together, we are paving the way for a new generation of trusted technologies that are essential to the future of connected systems.”

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Delta Electronics India, a leading provider of power management and smart green solutions, has signed three Memorandums of Understanding (MOU) with KP Group, a prominent renewable energy conglomerate based in Surat. Under the agreements, Delta plans to provide its high-efficiency solar PV inverters, battery energy storage systems (BESS), green hydrogen energy systems, and EV charging infrastructure to KP Group’s projects across India and abroad, including approximately 1 GW of next-generation grid-connected solar PV inverters over the next 12 months.

Speaking on the occasion, Mr. Niranjan Nayak, MD of Delta Electronics India, said, “Delta Electronics India and KP Group already share a long-standing relationship. This new collaboration is a step further and a strong testament to the trust and shared values between Delta and KP Group, such as sustainability, innovation, and reliability. With this 1 GW PV inverter partnership and extended collaboration on BESS and green hydrogen, we are committed to delivering best-in-class technology and lifecycle support to support India’s decarbonization journey.”

Mr. Farukh Patel, Chairman and Managing Director of KP Group, said, “We are proud to partner with Delta Electronics India, a company that exemplifies innovation, reliability, and vision in clean technology. Our partnership is not just about products—it’s about co-creating solutions that empower India’s energy independence. Whether it is solar, storage, or hydrogen, we believe our combined strengths can build a cleaner, more sustainable tomorrow.”

Delta’s advanced solar PV inverters will feature high efficiency, cutting-edge grid support functionalities (e.g., voltage/frequency ride-through, reactive power support, low harmonic distortion), integrated smart monitoring, and remote diagnostics. They will also be future-ready, with hybrid compatibility for solar and storage integration. Delta will ensure strong after-sales support through preventive maintenance, rapid troubleshooting, spare parts support, and technical training tailored for KP Group’s operational teams. The two companies will also conduct regular joint technology workshops to ensure alignment with Delta’s latest innovations.

In view of India’s growing need for energy storage to support renewable integration and ensure grid stability, the BESS MOU outlines a detailed framework for developing and deploying scalable BESS projects. Delta will supply BESS systems, PV inverters, and energy management systems, along with design, integration, and commissioning support. Delta Will provide for advanced grid support features, as well as integrated smart monitoring and remote diagnostics for proactive maintenance.

KP Group will spearhead project development by leveraging its engineering, procurement, and construction (EPC) capabilities. Together, they will jointly deliver energy storage projects in India and potentially overseas markets. Delta will also offer post-installation services, including maintenance training, remote monitoring, and long-term operational support.

In a forward-looking step toward clean mobility, the third MOU focuses on integrated green hydrogen refueling and EV charging infrastructure. KP Group will lead the development of green hydrogen production plants powered by renewable energy. Delta will contribute critical technology including energy management systems, hydrogen compression and dispensing components, as well as EV charging hardware and software, such as power management, compression, and dispensing technologies), and integrated energy management systems. The two companies will jointly design and implement green hydrogen stations and EV charging hubs across India. Delta shall supply EV chargers, including AC and DC fast chargers, energy management systems, and software platforms for real time monitoring and billing. Additionally, the collaboration will focus on skills, with Delta also training KP Group’s teams for safe and efficient station operations.

Delta brings global experience in high-efficiency power electronics, hydrogen-ready infrastructure, and intelligent controls, while KP Group contributes a strong portfolio of land banks, clean energy infrastructure, and local execution expertise. Together, they aim to develop pilot hydrogen ecosystems that will serve industrial decarbonization, fuel substitution, and sustainable transportation.

All three collaborations are structured as long-term, non-exclusive agreements that allow both companies to maintain operational flexibility while jointly advancing key projects, allowing scope for innovation and customization.

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Nearly 10,000 satellites currently circle our planet in low Earth orbit (LEO), delivering internet access, earth observation, communications, weather information, and more data back to Earth. Compared to traditional geostationary Earth orbit (GEO) systems, LEO satellites are launched in larger numbers to achieve sufficient coverage and operate in a less severe radiation environment. As such LEO satellites require different electrical components compared to their traditional GEO counterparts. To support the development of these applications, Infineon Technologies AG is introducing a new portfolio of radiation-tolerant memory products tailored for the rapidly growing NewSpace market.

NewSpace refers to the commercialization of space exploration by private companies and startups, often with less governmental oversight than traditional space programs. Driven by the rising demand for global connectivity (direct-to-cell), NewSpace initiatives aim to combine LEO satellite constellations with the Internet of Things (IoT) to create a more connected and efficient world. These missions typically rely on smaller satellites, ranging from nano-sats to 250 kg Sats, and are shorter in mission duration and less expensive, enabling the deployment of large-scale LEO constellations. With lower launch costs and reduced radiation exposure in LEO, many NewSpace applications can benefit from commercial off-the-shelf (COTS) components that deliver robust performance without requiring traditional military or aerospace qualifications.

Infineon’s NewSpace memory portfolio includes three product families: low-power, radiation-tolerant F-RAMs; QSPI NOR flash memories with 256 Mbit and 512 Mbit densities; and 256 Mbit/512 Mbit pseudo-static RAM (pSRAM). These devices offer an optimal combination of performance and reliability while supporting reduced size, weight, power, and cost benefits (SWaP-c). The F-RAMs operate across a wide MIL temperature range of
-55°C to +125 °C, while the NOR Flash and pSRAM devices support a range of -40°C to +125°C. Radiation tolerance demonstrates a total ionizing dose (TID) rating of 50 krad(Si) for the F-RAMs, 30 krad(Si) for the NOR Flash, and 100 krad(Si) for the pSRAM. Additional benefits include single lot date code and 100 percent electrical testing to ensure reliable mission operation. With these characteristics, Infineon’s memory products are ideal for short-duration, high-redundancy, and large-scale LEO constellations.

Infineon’s pSRAM are the first of their kind for NewSpace, offering a unique memory type, whose memory array is structured like DRAM internally but presents itself like static RAM (SRAM) externally. The pSRAMs are a low-power, high-performance, and low pin-count solution that is ideal for high-throughput data buffering applications.

Radiation-tolerant power solutions from IR HiRel complement memory offering

In addition to the NewSpace memory solutions, Infineon’s IR HiRel group offers a broad portfolio of radiation-tolerant power devices designed for the commercial space market. Combining decades of experience in both aerospace and automotive, the portfolio features highly reliable, cost-effective power MOSFETs optimized for 2-to-5-year LEO missions. Available in 60 V and 150 V N- and P-channel variants, these devices are qualified to AEC-Q101 and come in a rugged plastic package, with options for surface-mount and through-hole mounting. The devices are rated for a TID of 30 krad(Si), supporting radiation requirements of modern LEO missions.

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Electronic identification (eID) documents are seeing growing demand worldwide as governments push ahead with their digitalization efforts. To meet these rapidly evolving requirements more quickly and flexibly, Infineon Technologies AG has introduced two new solutions: SECORA ID V2 and the eID-OS. These solutions offer local security printers and card manufacturers greater flexibility in selecting the right solution for their specific project requirements, while helping to reduce development time and accelerate deployment.

“Our broad range of solutions is a clear commitment to our customers and their individual, local requirements in the field of ID projects,” says Maurizio Skerlj, Senior Vice President and Product Line Manager for Authentication and Identity Solutions at Infineon Connected Secure Systems. “With our all-in-one solutions, including innovative packaging options such as our coil-on-module technology and our antenna design support, we enable our customers to get their products to market faster, develop a flexible solution to their specific requirements, and realize new applications.”

SECORA ID V2: improved security features and faster transaction speeds

SECORA ID V2 is the successor to the SECORA ID V1 Java Card solution for electronic ID and authentication applications in the public sector. The V2 version of SECORA ID increases transaction speed by up to 80 percent compared to its predecessor. It is based on a 40 nm hardware architecture and can transfer data at speeds of up to 6.8 MBit/s. This enables faster personalization and processing of ID documents and allows for quick and smooth identity checks at borders and security checkpoints. SECORA ID V2 is based on the latest Java Card 3.1 standard and supports biometric match-on-card functions to increase user data protection. Customers benefit from Infineon’s broad applet toolset. It also supports payment tools such as Visa, Mastercard, and Calypso as well as the crypto vision ePasslet Suite. This wide range of applets enables developers to easily integrate and quickly deploy highly customized ID solutions. Furthermore, the sandbox enables the integration of native code without compromising security standards. The SECORA ID V2 platform is Common Criteria EAL6+(high) certified and EMVCo approved.

Infineon eID-OS: Ready-to-use and low operating expenses

Infineon eID-OS is the latest addition to the portfolio of native solutions, combining the latest TEGRION security controller with a native operating system. Designed for basic ID application projects, it offers a performance- and cost-optimized solution with fast time-to-market. The standards-compliant solution is targeting CC EAL 5+ eMRTD (Common Criteria Evaluation Assurance Level for electronic Machine-Readable Travel Document) certification and is housed in advanced packaging technology. It optimizes the development process, enables rapid deployment, and reduces maintenance costs. Featuring a powerful 32-bit CPU, advanced cryptography accelerators, and the robust Integrity Guard 32 security architecture, eID-OS enables fast and secured transactions with processing times of less than 0.5 seconds. Thanks to simplified implementation, personalization, and administration, as well as a secured chain of trust and automatic data size detection, customers benefit from low total cost of ownership. In addition, Infineon’s ultra-thin contactless coil-on-module package supports thinner electronic data pages, reducing document costs and the carbon footprint. The space saved can alternatively be used for an additional security layer, making this solution ideal for modern eID projects.

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Arrow Electronics has launched a dedicated online hub offering extensive resources for those seeking to understand the future of energy storage systems.

As the global shift towards renewable energy accelerates, battery energy storage systems (BESS) are becoming critical in revolutionising energy storage and management. BESS technology plays a vital role in integrating solar and wind power, enabling the electrification of vehicles, and providing reliable backup power, ultimately enhancing sustainability and resilience across various sectors.

The new energy storage systems resource page provides access to a range of valuable content, including a webinar on ‘Optimising Energy Storage: The Role of Advanced BMS,’ an informative e-book on BESS, essential design resources, insightful articles exploring key energy storage topics, such as photovoltaic integration and recordings of on-demand webinars, including ‘High-Power SiC MOSFETs Designed to Last.’

Arrow, in collaboration with eInfochips, is driving innovation in the BESS sector by offering leading-edge components, expert engineering support, and dependable supply chain solutions.

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Author: STMicroelectronics

From cloud-first to edge-ready: why AI needs to evolve

Artificial Intelligence (AI) has come a long way in the last decade. While cloud-based infrastructure enabled massive leaps in AI capabilities, it also introduced new challenges, such as latency, energy consumption, and privacy concerns. In response, companies and researchers started focusing on edge AI, where data is processed locally on embedded systems such as sensors and microcontrollers. The Edge AI Foundation (formerly known as TinyML) has been a driver in this transition since its creation in 2018 by bringing together industry leaders and innovators to make AI smarter, faster, and more pervasive at scale.

The evolution of AI development

Artificial Intelligence started to attract mainstream attention around 2012, when deep learning models achieved remarkable success in areas like image recognition, speech processing, and translation. The emergence of cloud computing drove these advancements, offering the computational resources required to train complex models on large datasets.

Over the next several years, companies invested heavily in cloud-based AI infrastructure, using high-performance GPUs to develop ever-larger models, including the early versions of generative AI. By 2017, AI was firmly embedded in cloud services offered by major tech providers.

However, as adoption grew, so did concerns about latency, bandwidth, privacy, and the high energy costs of transmitting and processing data remotely. These limitations became more pronounced as AI moved into latency-critical applications like autonomous systems, wearable tech, and industrial automation. The result was a gradual understanding that not all AI needs to live in the cloud and that many use cases could benefit from performing AI computations locally, closer to the data source. This awareness laid the foundation for the next significant shift: AI at the edge.

Why edge AI is the next big step

As AI becomes more integrated into everyday life, the need for fast, private, and energy-efficient processing is growing. Traditional cloud-based AI requires data to be sent to remote servers for analysis and decision-making, introducing latency, increasing energy use, and raising privacy concerns. Edge AI solves these challenges by enabling intelligent processing directly on local devices, such as sensors, microcontrollers, and other embedded processing solutions.  This eliminates or reduces the need to constantly connect to the cloud.

Thanks to key advancements like the STM32 microcontroller family and ST’s intelligent MEMS sensors portfolio, from inertial measurements units to biosensors, edge AI is no longer experimental; it’s a pervasive solution. Edge AI technologies empower devices to execute neural network inference locally, facilitating tasks such as anomaly detection, pose estimation, gesture recognition, environmental monitoring, and more. These functions are crucial in fields like industrial automation, healthcare, and innovative consumer products, where low latency, robust security, and minimal energy use are essential.

Among these innovations it is worth mentioning the STM32N6 series, ST’s first microcontroller family to integrate the Neural-ART Accelerator, a proprietary Neural Processing Unit (NPU). This NPU accelerates AI inference workloads directly on the MCU, drastically reducing latency, power consumption and off-loading the CPU for AI computing. Designed for demanding edge applications, the STM32N6 combines advanced performance, a unique video acquisition pipeline, and unprecedented energy efficiency with the flexibility of the STM32 programming ecosystem.

The Edge AI Foundation: a community driving change

The Edge AI Foundation is a strategic think tank committed to advancing edge AI across sectors. It hosts global conferences, such as annual events in Europe, the U.S., and Asia, connecting academia and industry. As a non-profit, the Foundation doesn’t promote specific products; instead, it fosters knowledge exchange, networking, joint research, and alignment on frameworks and tools.

Knowledge exchange at TinyML EMEA 2024

The journey of the Edge AI Foundation began in 2018 with the establishment of the TinyML Foundation, a collaborative community initiated by industry leaders such as Google, ARM, and STMicroelectronics.

The Foundation’s goal was to create a community of experts who could prove that machine learning could be executed even on ultralow-power devices (under 1mW), unlocking a new class of applications that operate independently of cloud infrastructure. This first step addressed the growing demand for real-time, energy-efficient, and privacy-preserving AI applications in areas like wearables, smart homes, and industrial IoT. And it was relatively quick to achieve.

As the field matured, the scope of applications expanded beyond simple models to encompass more complex tasks, such as generative and agentic AI, computer vision, and natural language processing, all executed at the edge. Following this evolution, in 2024 the TinyML Foundation rebranded itself as the Edge AI Foundation, reconfirming its commitment to advancing AI technologies that operate at the network’s edge.

Participants at TinyML EMEA 2024

Today, the Edge AI Foundation brings together a diverse community of researchers, developers, business leaders, and policymakers to address the challenges and opportunities in deploying AI at the edge. The foundation aims to make edge AI technology accessible and impactful for all. To achieve this mission, the Foundation has launched several initiatives:

• Edge AI Working Groups: focus groups on Generative AI, Blueprints, Dataset and Benchmarking, Neuromorphic and Marketing.
• Edge AI Labs: a platform providing access to high-quality datasets, models, and code to accelerate edge AI research and development.
• Edge AIP (Academia & Industry Partnership): a program promoting collaboration between industry partners and academic institutions to develop educational materials, certification programs, and scholarship opportunities.

STMicroelectronics as Strategic Leader Sponsor of the Edge AI Foundation Alessandro Cremonesi (ST Chief Innovation Officer & Executive Vice President General Manager System Research and Applications) at TinyML EMEA 2024

STMicroelectronics began collaborating with the Edge AI Foundation in 2018. This relationship started after ST demonstrated its STM32Cube.AI pre-production tool version at the CES event in Las Vegas. This seminal project led to an invitation by Pete Warden (past TensorFlow Lite tech lead at Google) to the first TinyML US Forum in early 2019. ST showcased live AI demonstrations of its standard STM32 microcontrollers on that occasion.

ST demo owners (Yanis Hamiti, Nicolas Gaude and He Huang) at TinyML EMEA 2024

Nowadays, as a Strategic Leader Sponsor, ST participates in and lead working groups, contributes to event programming, and engages in the Foundation’s governance.

For example, Danilo Pau (Technical Director, IEEE, AAIA and ST Fellow in System Research) chairs the Foundation’s Gen EDGE AI working group, organizing forums, producing white papers and initiating research projects leveraging existing ST AI products. Additionally, Giuseppe Desoli (ST’s Company Fellow, SRA Chief architect, Senior Director of Artificial Intelligence & Embedded Architectures) was appointed a Board member in 2025.

This participation supports the promotion of ST’s edge AI solutions, including its portfolio of AI-enabled microcontrollers, such as STM32 general-purpose MCUs and Stellar automotive MCUs, along with sensors and the comprehensive software tools ecosystem that make up the ST Edge AI Suite, while also building a network of authorized partners.

From smart devices to autonomous agents

Edge AI is expected to power the next generation of intelligent agents and systems capable of reasoning, planning, adapting and acting. We are already starting to see early use cases: AI-powered thermostats that learn user behavior, voice assistants that operate offline, intelligent voice transcriptors and humanoid robots that help with manufacturing tasks. In the future, these autonomous systems could help manage entire smart buildings, improve energy efficiency, or support industrial automation, all without needing a constant connection to the cloud.

To support this shift, edge AI platforms need to be highly efficient in both energy and performance. ST is enabling customers to implement edge AI daily thanks to innovations that facilitate edge AI on a broad range of STM32 microcontroller family, Microcontrollers integrating an NPU, and intelligent MEMS sensors with two technologies: the intelligent Sensor Processing Unit (ISPU) and machine learning core (MLC).

As an active contributor to the Edge AI Foundation, ST will continue to influence this community, enabling faster innovation and more sustainable technology at the edge.

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Rohde & Schwarz presents the new R&S UDS digital multimeter series. The compact instruments can display three measurements simultaneously and offer versatile measurement functions and various interfaces for remote control. Models are available with a digit resolution of 5 ½ as well as 6 ½, the latter providing a basic DC accuracy of 0.0075 percent. The R&S UDS series replaces the established R&S HMC8012 digital multimeter, offering more accuracy and an updated intuitive user interface for smooth and efficient testing.

The new R&S UDS digital multimeters from Rohde & Schwarz offer a versatile range of testing capabilities, making them ideal for troubleshooting, component testing, and system validation applications, as well as for teaching labs in education. Additionally, they are well-suited for production environments, where reliability and accuracy are paramount. With voltage ranges extending up to 1000 V DC and 750 V AC and a current capacity of 10 A, these multimeters provide a comprehensive solution for a wide range of measurement tasks. They come with an easy-to-use interface and a 3.5” OVGA color display for excellent readability. The large screen can simultaneously display up to three measurement values, streamlining test workflows and enhancing productivity.

Advanced Measurement Capabilities

In addition to twelve standard measurement functions, the multimeters feature built-in statistical and mathematical functions, making them suitable for a wide range of applications, including two-wire and four-wire measurements, as well as limit testing.

For remote control, the new multimeters offer a variety of interfaces, including USB, IEEE-488 (GPIB) for SCPI-based commands, and LAN (Ethernet). This enables seamless integration of the R&S UDS digital multimeter into any test setup or production line, providing unparalleled flexibility and convenience.

As the well-established R&S HMC8012 digital multimeter is being phased out, the new R&S UDS series will take its place.

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Quectel Wireless Solutions, a global IoT solutions provider, has launched the Quectel KCM0A5S, a high-performance Wi-SUN module designed for smart applications such as street lighting, precision agriculture, industrial IoT, smart meters and smart cities. Based on Silicon Labs EFR32FG25, a sub-GHz low power wireless System on Chip, and featuring an ARM Cortex-M33 processor with a frequency of up to 97.5MHz, the module includes built-in 256KB RAM and 2MB Flash memory, ensuring efficient performance.

The Quectel KCM0A5S supports the Wi-SUN Field Area Network (FAN) 1.1 protocol and operates across the 470–928 MHz frequency range. The module utilizes IPv6-based wireless mesh networking technology, intrinsic to the Wi-SUN communication standard, to deliver long-range transmission, stable network connectivity and reliable data transmission. Furthermore, the KCM0A5S offers flexible deployment capabilities, supporting both router and leaf node configurations in standalone SoC mode, as well as acting as a border router when paired with a Linux host in RCP (Radio Co-Processor) mode. This versatility makes it an ideal solution for a wide range of mesh networking applications in smart city, utility, and industrial IoT deployments. In addition, the KCM0A5S features strong anti-interference capabilities and delivers excellent signal penetration which is of specific value for use cases in hard-to-reach locations. With a minimum of ten years product lifecycle and cross-version compatibility, the solution ensures long-term interoperability within Wi-SUN FAN networks.

We’re delighted to launch the Quectel KCM0A5S Wi-SUN module,” said Delbert Sun, Vice General Manager, Product Department, Quectel Wireless Solutions. “Wi-SUN is a versatile LPWA connectivity technology that is applicable globally to a wide range of use cases. Its security, scalability and robustness provide compelling advantages to developers and device designers and the KCM0A5S adds to this with its ultra-compact form factor, high speed bandwidth and low latency. We look forward to helping customers to build a smarter world with the KCM0A5S as they bring the latest Wi-SUN enabled devices to market.

Flexibility for developers and designers is assured thanks to the KCM0A5S’s ultra-compact LCC form factor. Dimensions of 28.0mm x 22.0mm x 3.15mm enable the size and cost of end products to be optimized, allowing for maximized design options. The module is also ideal for industrial-grade use cases with an operating temperature range of -40 °C to +85 °C. The module is available in variants that support a peak transmit power of 30 dBm—currently permitted in select regions such as North America, Latin Ameria and some APAC countries —and offers both OFDM and FSK modulation schemes, subject to regional regulatory allowances.

Wi-SUN has been gaining traction for connecting IoT devices as a low power wide area (LPWA) connectivity solution because of its blend of scalability, security, interoperability and performance. It offers high speed bandwidth at up to 2.4Mbp with OFDM modulation. The technology is easily expandable and can support thousands of nodes. WI-SUN’s self-forming and self-healing mesh eliminates single point of failure networks and simplifies deployment.

The combination of wide coverage, long distance of several kilometers and the ability to serve urban scenarios, covered by multi-hop mode is seeing Wi-SUN adopted for smart metering and smart city applications. For example, a control management system for street lighting, utilities and parking has been deployed in London that utilizes 15,000 Wi-SUN devices and 12 Wi-SUN border routers to enable real-time remote management and provide a future-proof system that can scale up as the city transitions to new infrastructure.

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Rohde & Schwarz is set to revolutionize the field of signal and spectrum analysis with the launch of the FSWX signal and spectrum analyzer, an innovative instrument designed to overcome the limitations of current measurement methods.

Rohde & Schwarz introduced the brand-new FSWX signal and spectrum analyzer, the first multichannel signal and spectrum analyzer with multiple input ports, unlocking new possibilities in signal analysis. It is also the first instrument of its kind with a cutting-edge internal multi-path architecture enabling a novel cross-correlation feature. Combined with its low phase noise for high signal purity, its spurious-free dynamic range and its outstanding residual EVM, the FSWX delivers an RF performance like no other signal and spectrum analyzer in the market.

The instrument’s wide internal bandwidth of 8 GHz allows for comprehensive analysis even of complex waveforms and modulation schemes. Combined with a high measurement speed and analysis tools tailored to the user’s needs, the FSWX brings new levels of performance and precision to signal analysis for modern RF applications – from active RF components testing to state-of-the-art automotive radar testing to complex airborne radar scenarios and satellite test in A&D applications to the latest test challenges in WLAN and cellular technologies like 5G and beyond.

Michael Fischlein, Vice President Spectrum & Network Analyzers, EMC & Antenna Test at Rohde & Schwarz, is thrilled to introduce the new FSWX: “Our team has truly re-imagined signal and spectrum analysis technology with our new FSWX. They have come up with an innovative architecture and design to empower our customers to tackle complex measurement scenarios in the evolving landscape of wireless communications and radar technology that were previously unattainable. In other words, the FSWX makes measuring the impossible, possible.” The instrument’s innovative design features include multiple input ports, cross-correlation capabilities, advanced filter banks and broadband ADCs.

Multiple input ports

The multichannel FSWX offers the ability to measure multiple signal sources simultaneously, regardless of whether they operate at the same or different frequencies. With synchronous input ports, each featuring 4 GHz analysis bandwidth, users can seamlessly analyze the interactions between diverse signals. This opens up a multitude of new measurement scenarios, for instance, phase-coherent measurements of antenna arrays used in beamforming for wireless communications as well as in airborne and automotive radar sensors.

Multi-path architecture and cross-correlation

Its advanced internal multi-path architecture allows for the cross-correlation mode, a novel feature of the FSWX. A single signal input is internally split into two independent signal paths, each equipped with its own local oscillator and ADC. With this innovative design, advanced cross-correlation algorithms can be applied in the digital backend, effectively removing the inherent noise of the measurement instrument. This feature reveals spurs not easily seen without cross-correlation. It is especially helpful when, for instance, measuring Error Vector Magnitude (EVM), a critical factor in mobile communications. The added wideband noise of traditional signal and spectrum analyzers limits the accuracy and dynamic of EVM measurements. With the cross-correlation feature, however, the FSWX provides an unobstructed view of the DUT for precise EVM analysis.

The internal multi-path architecture also offers advanced triggering options. For example, users can apply an IF or RF power trigger at distinct frequencies, as the multi-path design allows for independent frequency settings for each receive path behind the splitter. This way, the FSWX can easily reveal effects between two RF signals.

Advanced filter banks and broadband ADCs

Traditionally, for preselection in the microwave range, spectrum analyzers rely on YIG filters. Since they are known for their challenging frequency response, YIG filters need to be bypassed for wideband signal analysis. The FSWX, however, employs broadband ADCs in conjunction with filter banks that span the entire operating frequency range, allowing for pre-selected signal analysis while eliminating the need for YIG filters. The filter banks provide high precision, optimizing instrument settings for specific applications and significantly reducing the risk of unwanted signal images contaminating results. For users requiring narrowband applications, a YIG filter can still be added optionally.

Innovative firmware applications

The FSWX also provides innovative firmware applications such as the CrossACT (Cross Application Control and Triggering) firmware feature. It synchronizes various measurements across different input channels, allowing for simultaneous analysis with multiple tools. This capability simplifies comparisons, such as determining whether the higher harmonics of a radar signal directly impact the EVM performance of a 5G signal.

The Linux-based operating system of the FSWX provides a high level of security and long-term support, essential features for users in security-sensitive environments. This robust operating system ensures reliability and stability, making the FSWX an ideal choice for demanding applications.

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Author: Mr. Saleem Ahmed, Officiating Head, ESSCI

In the next ten years, India will witness a tectonic shift in its technological landscape, one that will decisively shape the nation’s economic destiny and global standing. At the heart of this transformation lies the semiconductor industry, often referred to as the “new oil” in the global economy. For Indian engineers, the semiconductor revolution isn’t just a story of factories and chips—it’s a gateway to high-value, future-ready careers that promise innovation, growth, and national impact.

With multiple large-scale semiconductor fabrication and assembly projects underway, and policy support at an all-time high, semiconductor jobs are rapidly becoming the next big thing for engineering talent in India. And at the forefront of this workforce transformation stands the Electronics Sector Skills Council of India (ESSCI)—tasked with equipping the Indian workforce for this high-tech future.

A Nation on the Verge of a Chip Revolution

India’s dependence on imported chips—used in everything from mobile phones to fighter jets—has long been a strategic vulnerability. But that reality is now changing. Recently Union Cabinet’s approved  approved a new semiconductor plant in Uttar Pradesh’s Jewar to be jointly set up by HCL Group and Foxconn. The newly approved facility will come up at an investment of Rs 3,700 crore.

This is the sixth unit approved under the India Semiconductor Mission, with five semiconductor facilities in advanced stages of construction. Three of these units—by Micron Technologies, Kaynes Technologies and a combination of CG Power-Renesas Electronics and Star Microelectronics—are based in Sanand, Gujarat. The Tata Group is building one semiconductor facility in Dholera, Gujarat and another in Assam.

These developments are backed by the Government of India’s India Semiconductor Mission (ISM), a ₹76,000 crore policy initiative that provides incentives for design, manufacturing, and packaging of semiconductor chips.

This growing ecosystem will need a massive talent pool—and that’s where India’s engineers come in.

Why Semiconductors Are a Game-Changer for Engineers

Semiconductors power almost every modern device—from smartphones and laptops to electric vehicles, smart appliances, 5G infrastructure, defense systems, and even satellites. As the world shifts toward AI, IoT, and smart mobility, the demand for chips is set to explode. According to recent estimates, India’s semiconductor market will triple in size—from US$22.7 billion in 2019 to over US$80 billion by 2028.

This explosion is not just about demand—it’s about job creation.

According to ESSCI’s analysis, the semiconductor industry is set to witness a dramatic rise in employment demand. The sector, which is projected to employ 1.70 lakh individuals by 2025, is expected to rise to 1.87 lakh in 2026, and add a total of 1.03 lakh new jobs by 2030. This includes roles in chip design, fabrication, testing, quality control, equipment maintenance, and advanced manufacturing processes.

The rapid expansion of this sector has created an urgent need for a highly skilled workforce. ESSCI is committed to bridging the skill gap through targeted training programs, collaborating with industry and academia to equip young professionals with expertise in chip design, fabrication, and advanced packaging. These initiatives will empower the next generation to drive India’s semiconductor revolution.

Such roles are not only high-paying but also globally portable, offering Indian engineers access to both domestic and international job markets.

The Many Doors Semiconductor Jobs Open

The semiconductor industry is uniquely interdisciplinary, requiring expertise in electronics, mechanical, chemical, computer science, materials engineering, and more. Here’s a breakdown of the top career tracks Indian engineers can pursue:

1. Design Engineers

Design engineers work on creating the architecture and layout of chips. They use Electronic Design Automation (EDA) tools to ensure chips are efficient, reliable, and ready for fabrication.

2. Process Engineers

These engineers fine-tune the manufacturing process, often working in cleanroom environments. They handle wafer processing, lithography, etching, doping, and deposition.

3. Packaging and Testing Experts

Once chips are fabricated, they need to be tested, assembled, and packaged. Engineers in this field ensure performance and durability under various operating conditions.

4. R&D Scientists

Research roles offer cutting-edge work in developing new semiconductor materials like gallium nitride or silicon carbide, and technologies like FinFET or EUV lithography.

5. Equipment and Maintenance Technicians

Fabrication units run on precision equipment that needs constant monitoring and maintenance—critical work for mechanical and electronics engineers.

6. Quality and Safety Officers

Given the strict standards in chip manufacturing, QA engineers ensure compliance, while safety experts handle protocols in chemical and electrical hazards.

Enter ESSCI: Building the Backbone of India’s Semiconductor Workforce

With this exponential growth comes the challenge of creating a skilled and job-ready workforce. The Electronics Sector Skills Council of India (ESSCI), under the aegis of the Ministry of Skill Development and Entrepreneurship, plays a crucial role in bridging this gap.

ESSCI has already developed 25 NSQF-aligned qualifications for semiconductor design, packaging, and manufacturing. These qualifications are designed to cater to:

• Engineering graduates seeking specialization
• Diploma and ITI students entering the job market
• Working professionals seeking upskilling or domain switch

ESSCI offers focused a range of qualifications covering the complete value chain of the semiconductor industry. Short Term courses such as VLSI Design Engineer, concentrating on designing SOC-module functions using software, Embedded Full Stack Engineer, IoT Hardware Analyst are some of the top courses offered for pursuing engineering graduates to gain the knowledge of EDA Tools and system design. ESSCI also provides qualifications for Wafer Back Grinding Engineer and Wafer Dicing Engineer, specialising in wafer manufacturing tasks which can be taught to ITI / Diploma students. ESSCI also has foundation / upskilling courses in the field of Nano Science & Advance Nano Science which is also in great demand. Also, there are some basic courses on the Industrial Safety – Electrical & Hazchem which are very crucial & important for the industrial safety requirements.

Career Opportunities in Semiconductor Technology:

As the semiconductor industry evolves in response to these mega trends, it creates exciting career opportunities for professionals across the value chain – designing, fabrication and packaging. From semiconductor design and manufacturing to research and development, there is a growing demand for skilled professionals who can innovate and drive technological advancements in the industry.

The sector is expected to see more than 800,000 to 1 million job openings over the next five years, says staffing company Randstad. The government recently approved $15 billion worth of investments into the sector including from the Tata group. India’s burgeoning semiconductor sector is facing a surge in demand for talent, fuelled by new investments and the government’s ambitious plan to transform the country into a chip manufacturing hub.

1. Semiconductor Design Engineer:Semiconductor design engineers play a crucial role in developing the architecture and circuitry of semiconductor chips. They utilize tools like Electronic Design Automation (EDA) software and simulation tools to design and optimize chip layouts for performance, power efficiency, and manufacturability.
2. Process Engineer:Process engineers are responsible for developing and optimizing semiconductor manufacturing processes. They work closely with equipment vendors and manufacturing teams to ensure the smooth operation of semiconductor fabrication facilities, improve yield rates, and reduce production costs.
3. Research Scientist:Research scientists in the semiconductor industry focus on exploring new materials, devices, and technologies to push the boundaries of semiconductor innovation. They conduct experiments, analyze data, and collaborate with cross-functional teams to develop next-generation semiconductor solutions.
4. Material Engineers:Material engineers in the semiconductor industry are pivotal in researching, selecting, and optimizing the materials used in semiconductor device fabrication. Their expertise spans a wide range of materials, including silicon, gallium arsenide, and various compound semiconductors. Material engineers work closely with semiconductor design teams to ensure that the chosen materials meet the performance requirements of the intended applications while also considering factors such as cost, scalability, and reliability. Additionally, they play a crucial role in developing new materials and processes to push the boundaries of semiconductor technology, enabling advancements in areas such as miniaturization, power efficiency, and functionality.
5. Product Marketing Manager:Product marketing managers play a vital role in bringing semiconductor products to market. They conduct market research, develop marketing strategies, and collaborate with sales teams to promote semiconductor products and drive revenue growth.
6. Quality Assurance Engineer:Quality assurance engineers ensure that semiconductor products meet the highest standards of quality and reliability. They develop and implement test plans, conduct performance testing, and analyze data to identify and address any issues or defects in semiconductor products.
7. Packaging experts:Packaging experts in the semiconductor industry are instrumental in developing and implementing packaging solutions that safeguard semiconductor chips. Their role entails meticulous selection of packaging materials, designing efficient packaging structures to ensure protection against environmental factors and mechanical stresses, and optimizing designs for thermal management and electrical performance. They collaborate closely with design and manufacturing teams to ensure that packaging solutions meet stringent industry standards while balancing factors such as cost-effectiveness and manufacturability.
8. Clean room specialists:They play a pivotal role in maintaining the pristine conditions necessary for semiconductor fabrication processes. They are responsible for meticulously managing and monitoring cleanroom environments to prevent contamination that could compromise the quality and reliability of semiconductor devices. Clean room specialists enforce strict cleanliness protocols, perform regular inspections, and oversee cleaning procedures to ensure compliance with industry standards and regulations. Their expertise ensures that semiconductor manufacturing facilities operate in controlled environments conducive to high-quality production.
9. Machine maintenance technicians:They are essential for sustaining the operational efficiency and reliability of semiconductor manufacturing equipment. Their responsibilities include conducting routine maintenance tasks, performing diagnostics, troubleshooting equipment issues, and executing repairs as needed to minimize downtime and optimize production throughput. Machine maintenance technicians also play a crucial role in implementing preventive maintenance schedules, identifying opportunities for equipment upgrades or optimizations, and ensuring compliance with safety regulations and operational standards. Their expertise contributes to the overall efficiency and longevity of semiconductor manufacturing operations.
10. Safety protocol checkers:These people are integral to maintaining a safe and secure work environment within semiconductor manufacturing facilities. They are responsible for enforcing safety regulations, conducting regular inspections to identify potential hazards, and implementing corrective measures to mitigate risks and prevent accidents. Safety protocol checkers also play a vital role in developing and implementing safety training programs, conducting safety audits, and promoting a culture of safety awareness among employees. Their diligence and vigilance help to safeguard the well-being of personnel, protect semiconductor manufacturing equipment, and maintain the integrity of semiconductor processes.

Career Opportunities Across the Ecosystem

• Global Semiconductor Giants: Intel, Micron, AMD, Qualcomm, NXP
• Indian Startups & Design Houses: Saankhya Labs, Steradian Semiconductors, Signalchip
• Manufacturing Units: Tata Group, Vedanta-Foxconn, ISMC
• Government & Defense: DRDO, ISRO, SCL (Semiconductor Lab)
• Academia & R&D: IITs, IIITs, National Labs

India’s Policy Ecosystem: Creating the Right Conditions

India’s semiconductor journey isn’t just market-driven—it’s backed by clear, consistent policy action:

• Production Linked Incentive (PLI) Scheme to support manufacturers.
• Design Linked Incentive (DLI) Scheme for fabless startups and institutions.
• Modernization of the Semiconductor Laboratory (SCL) in Mohali into a full-fledged fab.
• State-level incentives, like Odisha’s offer of 25% subsidy on capex for fabs and 20% for fabless companies.

Moreover, global giants like Applied Materials, Lam Research, and Samsung Semiconductor India Research (SSIR) are expanding operations in India—indicating long-term confidence in India’s talent and policy framework.

A Strategic Moment for Indian Youth

The rise of India’s semiconductor sector presents a rare, perhaps once-in-a-generation, opportunity. Engineers who upskill today can become:

• The designers of India’s next chip
• The technicians behind India’s first fab line
• The entrepreneurs launching fabless startups
• The leaders driving India’s tech sovereignty

At a time when countries are scrambling to secure chip supply chains, India is carving a unique place for itself—not just as a consumer but as a creator. But this vision hinges on talent.

That’s why engineers—especially young graduates and final-year students—must look seriously at semiconductors. With government support, ESSCI’s training programs, and private sector momentum, the time to act is now.

Conclusion: From Potential to Powerhouse

India is no longer at the sidelines of the global chip race. With strong policy, infrastructure investment, and a strategic location, it is emerging as a serious contender. But no chip factory can run without engineers. The success of India’s semiconductor mission will ultimately depend on its people—its skilled, driven, and future-ready engineers.

The post Why Semiconductor Jobs Are the Next Big Thing for Indian Engineers appeared first on ELE Times.

Anritsu expands its signal generator product line with the introduction of the EcoSyn Lite Microwave Synthesizer Module that delivers outstanding phase noise, ultra-fast switching speed and compact size. EcoSyn Lite compliments Anritsu’s high performance RubidiumTM bench top signal generators to address a wide range of signal generator applications.

EcoSyn Lite covers 10 MHz to 20 GHz frequency range and delivers +18 dBm output power. Housed in a portable, compact 4 inch x 4 inch x 0.8 inch form factor ideal for use in space constrained applications which require instrumentation grade CW signal source.

Instrument Class Phase Noise in Module Form Factor

EcoSyn Lite features best in class phase noise performance of -126 dBc/Hz (typical) at 10 GHz and 10 kHz offset, that compares favorably with some of the bench top signal generators in the market today. With its robust output power of up to +18 dBm it is ideal as LO for up/down converters in RF/Microwave transceivers. These transceivers increasingly use complex and high order modulation signals which require LOs with low phase noise for up/down conversion. EcoSyn Lite’s superior non-harmonic spurious of -60 dBc delivers very low jitter and can be used as a clock source for Gbit ADC/DAC testing and in high-speed optical systems.

Ultra-fast Frequency Switching Speed

EcoSyn Lite has ultra-fast frequency switching time of less than 50 µs in Triggered list mode. In ATE (Automatic Test Equipment) application, fast frequency switching speed saves testing time. Shorter test times translate to higher test throughput thus achieving less test cost. Ultra-fast switching time and small form factor makes EcoSyn Lite ideal in ATE rack applications.

Switching speed can also be critical in radar cross section (RCS) measurements necessary to establish radar signatures for known targets, such as aircraft, ships, and missiles. These signatures are created through measurements at thousands of frequencies. Because of the total numbers of measurements that must be made, EcoSyn’s ultra fast switching time can save considerable measurement time. Testing an antenna also requires large amounts of data at multiple frequencies. EcoSyn Lite’s ultra-fast switching speed can save a lot of testing time.

Efficient, compact and Easy to Automate

EcoSyn Lite synthesizer modules are housed in portable, compact 4 in x 4 in x 0.8 in form factor which enables them to be used in space constrained applications which require instrumentation grade CW signal source. It supports USB and SPI interfaces for remote control and is powered using a +12 VDC source.

EcoSyn Lite supports standard SCPI and QuickSyn native commands which make developing scripts to remotely control and automate very easy and user friendly.

The post Anritsu Introduces EcoSyn Lite MG36021A Microwave Synthesizer Module Outstanding Phase Noise, Ultra-fast Switching Speed and Compact Size appeared first on ELE Times.

The Central government has introduced major reforms to Special Economic Zone (SEZ) Rules to push India’s aspirations in semiconductor and electronics manufacturing, with the aim of drawing global investments and minimizing procedural bottlenecks for high-tech sectors. The Ministry of Commerce & Industry said that these measures are going to change India’s industrial policy scenario where SEZs shall henceforth be more accessible and investment-friendly.

Major Policy Changes to SEZ Norms

Amendment on Rule 5 of the SEZ Rules, 2006, is among the landmark reforms, which includes the minimum land size to be established for a semiconductor or electronic component-specific SEZ being curtailed from 50 hectares to just 10. This is expected to benefit the smaller yet highly potential players and thus fast-track building advanced manufacturing hubs.

Another important change is Rule 7, which gives more latitude in acquiring and using land. There will no longer be an encumbrance-free clause attached to mortgaging or leasing land to federal or state government agencies. This will ease a significant regulatory hurdle faced by developers and investors.

In Rule 53, a new method to compute Net Foreign Exchange (NFE) has been introduced so as to include goods being received or supplied free of cost, if such valuation is carried out as per the customs valuation norms. This will align India’s SEZ policy with global best practices and allow easier trade reporting by SEZ units.

On the other hand, Rule 18 has been amended to enable the sale of goods from SEZs into the Domestic Tariff Area (DTA) on payment of the applicable duties. This upgrade will offer enhanced flexibility to the SEZ manufacturers, as well as improve viability of commercial operations by extending market access across the country.

Focus on Capital-Intensive, Long-Gestation Sectors

These strategic reforms notified by the Department of Commerce on June 3, 2025, will be targeted toward industries with higher capital investment needs and long development time frames-such as semiconductor fabrication and advanced electronics.

By minimizing the compliance cover and raising operational flexibility, the government would like to induce global majors and homegrown innovators to invest in the evolving high-tech landscape in India.

The policy shift would also aid job creation, particularly in areas, that are highly skilled. Amongst the jobs created would be those requiring skills in chip design, fabrication engineering and electronics system manufacturing.

Early Gains: Two Major SEZ Projects Approved

In a speedy follow-up to the announcement, the Board of Approval for SEZs has cleared two proposals of major import intended to create the desired impact of the reform:

• Micron Semiconductor Technology India Pvt Ltd would construct a semiconductor LRD of SEZ at Sanand, Gujarat, 37.64 hectares in extent, with an investment commitment of ₹13,000 crore. This unit would become one of the biggest nodes in the Indian-chip making landscape.
• The Hubballi Durable Goods Cluster Pvt Ltd, promoted by Aequs Group, would set up an electronics components SEZ at Dharwad, Karnataka, spread over an area of 11.55 hectares, with an investment of about ₹100 crore.

Such approvals speak of the desire of the government to swiftly translate the policy into action and brand India as reliable partner in the global semiconductor value chain.

Strengthening India’s Global Competitiveness

Due to the soaring worldwide demand for semiconductors and electronics as digital transformation and geopolitical realignments take place, India positions itself, almost by way of strategy, as an option for manufacturing. The new SEZ framework enhances ease of doing business and gives credence to India’s claim to become a self-reliant, technology-driven economy.

These are the steps towards building a strong semiconductor ecosystem, one offering innovativeness, resilience and global relevance.

The post Centre Unveils SEZ Reforms to Boost Semiconductor and Electronics Manufacturing appeared first on ELE Times.

Pick and Place Friendly Lead Bending Option Allows Devices to Be Used as SMD Components to Reduce Assembly Costs

Vishay Intertechnology, Inc. announced that its AC03-CS series of axial cemented, leaded wirewound safety resistors is now available with a pick and place friendly lead bending option, the WSZ lead form, which allows the devices to be used as surface-mount components to reduce assembly time and lower costs.

Vishay Draloric AC03-CS series resistors act as inrush current limiting resistors during normal operation and serve as pre-charge, discharge, and snubber resistors. The devices are designed to ensure safe and silent fusing in automotive electronics, energy meters, and power supplies for industrial drives and consumer appliances when high DC voltage overload or accidental AC mains voltage of 120 VRMS / 240 VRMS is applied.

For challenging operating conditions, the devices operate over a wide temperature range from -40 °C to +200 °C and feature a robust, non-flammable silicone cement coating that conforms to UL 94 V-0. This coating allows the resistors to safeguard the PCB and other components by minimizing the risk of fire due to extreme electrical overloads, without the need for additional fuses in series.

The AEC-Q200 qualified AC03-CS series features a high surge voltage capability up to 4 kV (1.2/50 µs pulse per IEC 61000-4-5) and a power rating of 3 W at an ambient temperature of 40 °C. The devices offer resistance from 1 Ω to 100 Ω, resistance tolerance of ± 5 %, and temperature coefficient (TCR) of ± 200 ppm/K. RoHS-compliant, halogen-free, and Vishay Green, the resistors feature tin-plated terminations for compatibility with lead (Pb)-free and lead (Pb)-containing soldering processes.

The post Vishay Intertechnology AC03-CS Series Axial Cemented, Leaded Wirewound Safety Resistors Now Available With WSZ Lead Form appeared first on ELE Times.

New MCUs Are Ideal for Portable Devices such as Data Loggers and Charge Cases

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a 48-MHz Arm Cortex M23 processor, the new MCUs offer a rich feature set that makes them ideal for portable devices and PC peripherals such as gaming mice and keyboards.

The new USB Type-C Cable and Connector Specification Release 2.4 has reduced voltage detection thresholds (0.613V for 1.5A source, and 1.165V for 3.0A source). The RA2L2 MCUs are the industry’s first MCUs to support these new levels.

The RA2L2 MCUs employ proprietary low-power technology that delivers 87.5 µA/MHz active mode and software standby current of just 250nA. They also offer an independent operating clock for the low-power UART, which can be used to wake up the system when receiving data from Wi-Fi and/or Bluetooth LE modules. Along with the USB-C support, this combination of features makes the RA2L2 the premier solution available for portable devices such as USB data loggers, charge cases, barcode readers and other products.

In addition to USB-C with CC detection up to 15W (5V/3A) and USB FS support, the new MCUs offer LP UART, I3C, and CAN interfaces, giving designers the ability to reduce component count, saving cost, board-space and power consumption.

The RA2L2 MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, and networking as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. The FSP eases migration of existing IP to and from other RA devices.

“The RA2L2 Group MCUs are our first to realize full-speed USB along with USB-Type C connector support. They also ensure system costs remain low by reducing external components, and they offer the same low-power characteristics as our popular RA2L1 devices,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “These new devices demonstrate our commitment and ability to quickly deliver the solutions our customers require.”

Key Features of the RA2L2 MCUs

• Core: 48 MHz Arm Cortex-M23
• Memory: 128-64 KB Flash, 16 KB SRAM, 4 KB Dataflash
• Peripherals: USB-C, USB-FS, CAN, Low Power UART, SCI, SPI, I3C, I2S, 12-bit ADC (17-channel), Low Power Timer, Real-Time Clock, High-Speed On-chip Oscillator (HOCO), Temp Sensor
• Packages: 32-, 48- and 64-pin LQFP; 32- and 48-pin QFN
• Security: Unique ID, TRNG
• Wide Ambient Temperature Range: Ta = -40°C to 125°C
• Operating Voltage: 1.6V – 5.5V; USB Operating Voltage: 3.0V to 3.6V

Winning Combinations

Renesas has combined the new RA2L2 MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including USB Data Logger, Electronic Toll with GNSS, Gaming Keyboard and Gaming Mouse. These designs are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.

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