ELE Times

Focusing on Smart Power and Smart Industrials for a sustainable future

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, will host the Industrial Summit 2024 on October 29 at the Futian Shangri-La Hotel, in Shenzhen, China.

Recognizing the significant challenges posed by climate change, ST has consistently demonstrated its unwavering commitment to sustainability. The Company is dedicated to improving power density and efficiency through its cutting-edge solutions, leading the way towards reduced carbon emissions and a sustainable future.

The Industrial Summit is a top-notch technology showcase that highlights the breadth and depth of ST’s industrial products and solutions. Into its 6th edition, this year’s event continues the overarching theme of “Powering Your Sustainable Innovation”, with a focus on Smart Power and Smart Industrials for a sustainable future.

Visitors will hear insightful keynotes and 28 technical presentations from ST, its customers and partners, and can explore over 150 demonstrations targeting three main market segments: Automation, Power & Energy, and Motor Control. Additionally, the event will feature 6 showstoppers developed in close collaboration with ST’s customers and partners, presenting innovative technologies, solutions, and products in the areas of growing demand from the end markets, including Silicon Carbide (SiC) and Gallium Nitride (GaN), power supply for AI data center, High Power Thermal Management system, Automation Production Line, the Solar-Storage-Charging Integration demo, and various solutions from the Ecosystem Partners of ST.

Showstopper and demo highlights

ST’s 25+ Years of SiC Leadership: ST brings value to its customers through mastery of the full silicon carbide (SiC) value chain, from R&D, substrate, epitaxy, and wafer fabrication to assembly and packaging of power discretes and modules. At this year’s Industrial Summit, the SiC showstopper will demonstrate ST as a global SiC leader in market, innovation and manufacturing, with a broad portfolio of STPOWER MOSFETs and diodes adapted for key industrial and automotive applications. Visitors will get a comprehensive overview of the development and manufacturing of SiC devices, from powder to the end product.

ST’s cutting-edge SiC MOSFET and diode portfolio, complemented by STGAP galvanic isolated drivers, delivers high efficiency, reliability, and performance in different packages. It will be demonstrated at the Summit through various reference designs for energy storage and power supply for AI servers, as well as other high-power applications.

 Next-Generation Data Center Infrastructure from Megawatt to Gigawatt: The AI and data communications sectors, currently responsible for 4% of global carbon emissions, are projected to reach 14% of emissions by 2040. Adopting heat recovery, liquid cooling, HVDC (High Voltage Direct Current), high-efficiency PSUs (Power Supply Unit), and new power-semiconductor technologies can further reduce power consumption.

Rapid advancements in power technology, including through new semiconductor materials like SiC and GaN (Gallium Nitride) driven by STGAP galvanic isolation gate drivers, will help further moderate the growth in energy demand from data centers. Highlighting ST’s capabilities is a 5.5 kW power supply for AI data centers using SiC for greater efficiency and better power density. In addition, with STPOWER MDmesh M9/DM9 series super-junction power MOSFETs, ST sets a benchmark for the 600V/650V super-junction technology combining best-in-class performance with remarkable ease of use. Tailored for both hard- and soft-switching topologies, the MDmesh M9 and DM9 series are ideal for AI server data centers. Moreover, the STM32G4 microcontrollers bring intelligence and advanced control to our power solutions, allowing us to better manage power distribution and adapt to fluctuating loads in real-time.

In addition, transitioning to HVDC infrastructure can further enhance data-center efficiency by reducing transmission losses and energy consumption. ST’s SiC technology, paired with advanced packaging, enables HVDC systems to excel in high-temperature environments.

High-Power Thermal-Management Systems: The demand for high-power cooling solutions is rapidly increasing across various sectors, driven by significant growth in HVAC (Heating, Ventilation, Air Conditioning) systems, AI data centers infrastructure management, and grid-scale battery energy storage.

ST provides a comprehensive set of high-power cooling solutions to address differentiated power ranges and architectures. At this showstopper, ST will showcase its latest 10kW Commercial Compressor solution, which innovates using one single STM32G4 microcontroller (MCU) to control multiple functions, including three-phase PFC Vienna, FOC (Field Oriented Control) motor control, Nano Edge AI predictive maintenance, and KNX. This solution also delivers robust and reliable performance with ST’s 1200V IGBTs and SiC diodes, plus STGAP galvanically isolated gate drivers. Also, two other solutions will be featured at this showstopper­­: the 7kW triple FOC and interleaved PFC, and 4kW Dual FOC and Interleaved PFC. These solutions ensure efficient and reliable performance to meet different customer specifications for heat pumps and commercial air conditioning, based on ST’s SLLIMM Intelligent Power Modules, and Power Management and Analog ICs

Automated Assembly Line System: This groundbreaking automated assembly line system is the first of its kind at ST and represents the largest demonstration at the Industrial Summit 2024. An unprecedented factory-automation system underscores ST’s comprehensive ecosystem of partners and extensive system-level expertise in embedded systems. This demo features a complex automation system that integrates 3 robotic arms, which communicate precisely with an AGV (Automated Guided Vehicle) to transfer items running on an MTS (Maglev Track System) driven by 7 ST dual motor servo drive solutions. All these components are managed by an ST Programmable Logic Controller (PLC), navigating through a variety of standards such as Codesys, EtherCAT, Profinet, Sub-1G, IO-Link, and more. This demo is further enhanced in collaboration with Siemens automation solutions, enabling seamless integration like the PLC (Programmable Logic Controller) and HMI, which reflects accuracy, reliability and precision.

This impressive system demonstrates all major ST technologies for automation systems, including STM32 MCUs for HMI (Human Machine Interface), STM32MP1/2 Microprocessor Units (MPUs) for PLC processing, and a wide variety of analog products like IPS (intelligent power switches) for control. The system also covers different connectivity technologies for both wired (such as IO-link) and wireless, where the ST ultra-low power MCUs can bring added value in battery life.

Lastly, ST technologies include Industrial sensors (such as ToF proximity sensors, MEMS and IR sensors, IMUs, accelerometers, vibrometers, pressure sensors), ST25R for RFID read/write and Industrial actuators for the robotic arms, and the massive 14 PMSM linear motors are well covered by ST gate drivers and motion control ICs, wide LV and HV MOSFETS, IPS, Power management IC, and all this requires good protection devices for both input (CLTxx) and output (SMAJxx). In total, more than 500 ST devices are utilized across various HMIs, PLC controllers, drivers, RFID readers, gateways, connectivity devices, sensors, servo motors, and other components.

Solutions from Ecosystem Partners: To tackle the diverse challenges of the highly fragmented industrial market, ST is collaborating with technology leaders, key industrial customers, and ecosystem partners to accelerate growth and meet local market needs. Beyond the major highlights above, additional demos showcasing collaborations between ST and its ecosystem partners will be featured, including the Carbon Management solutions from ST’s customer Sungrow iCarbon, the Solar-Storage-Charging Integration Digital Energy Management solution from ST’s distributor WT Microelectronics, and multiple innovations from Joint Labs between ST and some leading Chinese universities.

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New best-of-both memory combines serial Flash speed and density with EEPROM byte-level flexibility

STMicroelectronics’ Page EEPROM combines the power efficiency and durability of an EEPROM with the capacity and speed of a Flash memory, creating a hybrid memory for applications that face extreme size and power constraints.

The new memories address growing demand for storage in embedded applications, needed to support increasingly sophisticated features and run data-hungry edge-AI algorithms. One example is behind-the-ear hearing aids, where Page EEPROM can reduce the bill of materials and help create products that are slimmer and more comfortable to wear.

In addition to wearables, Page EEPROM is ideal for applications such as healthcare devices, asset trackers, e-bikes, as well as other industrial and consumer products. “The intelligent edge has evolved quickly and is profoundly changing demands on embedded memory storage density, performance, and power consumption,” said Philippe Ganivet, STMicroelectronics EEPROM product line manager.  “Our new Page EEPROM is the perfect ultra-low-power memory to complement a microcontroller for remote IoT modules that operate on battery power.”

“ST’s Page EEPROM is the perfect non-volatile memory, a true best-of-both worlds solution that enabled us to achieve the ambitious targets we set when creating the latest generation of our flagship product family of GPS trackers, IoT devices, and all other designs where high performance, high reliability, small size, and low power are required,” said Patrick Kusbel, owner of BitFlip Engineering, one of the first customers to use the new memory ICs. “The M95P is up to 50 times faster yet consumes as little as one-tenth the power and delivers five times the reliability — at 500k writes compared to 100k writes — typical of other parts we used before. It’s a game changer.”

ST’s Page EEPROM family offers densities of 8Mbit, 16Mbit, and 32Mbit, greatly increasing storage over standard EEPROM devices. Embedded smart page-management allows byte-level write operations for processes like data logging, while also supporting page/sector/block erase and page-program up to 512 bytes for efficiently handling firmware over the air (OTA) updates. The devices also allow buffer loading, which can program several pages simultaneously to cut the time for loading software in production. The data-read speed of 320 Mbit/s is about 16 times faster than standard EEPROM, while write-cycle endurance of 500,000 cycles is several times higher than conventional serial Flash.

Also featuring a novel peak-current control, Page EEPROM minimizes power supply noise and prolongs the runtime of battery-operated equipment. The write current is below that of many conventional EEPROMs and there is also a deep power-down mode with fast wakeup that reduces the current to below 1µA.

Longevity is assured, with 100-year data retention. The devices are included in ST’s 10-years product longevity program that guarantees long-term product availability.

The X-NUCLEO-PGEEZ1 expansion board and X-CUBE-EEPRMA1 software package are available now, for users to learn how to interact with Page EEPROM and adopt the new devices in application designs. The software includes a demonstration application that shows how to test the memory’s hybrid architecture and quickly build a proof of concept.

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In today’s tech-driven era, automotive electronics have become integral to modern vehicles, comprising an array of systems such as engine management, ignition, radio, carputers, telematics, in-car entertainment systems, among others. Over time, the importance of these electronic systems has been growing. Historically, electronics constituted about 10% of the total car cost till the 1980s, later, this share reached 35% by 2010, according to Statista. Keeping pace with the trend, in 2030, electronics are projected to make up around 50% of the cost of a new car. The main drivers of this rise are attributed to electronics usage in cars and the broader trends of connectivity and automation.

Considering this upsurge, technology is destined to lead the way for the automotive electronics sector in the foreseeable future. To speed fast its systems, telematics and the Internet of Things (IoT) can create welcome opportunities. Telematics, in particular, is capable of tracking the vehicle to transmit and store real-time data about its location, operation, and function. Subsequently, this data can be used to improve driver safety, increase efficiency, and reduce costs. Similarly, automotive IoT forms an essential component of connected car technology allowing vehicles to interact with external objects and road users such as other vehicles, people, or road infrastructure, and ensure greater road safety and traffic efficiency.

Let’s look at how telematics and IoT are evolving to aid automotive electronics:

• Real-Time Supply Chain Visibility: Telematics provides automotive makers with critical insights into their supply chains, allowing them to address gaps in deliveries and production timelines. Additionally, IoT apps ease fleet management with the help of integrated weight management, location tracking and advanced sensors.
• Data Collection and Analysis: Tracking devices powered by telematics collect and transmit data, such as GPS position, speed, and fuel consumption. The data is sent to a centralised server, where it can be analysed and optimised for user interfaces. Moreover, the increase in electronics has enhanced vehicles’ capabilities to monitor both internal and external conditions. Thus, connected cars are capable of sharing these kinds of information with other devices via a robust IoT ecosystem. Interestingly, it is projected that by 2025, there will be over 400 million connected cars in operation, up from some 237 million in 2021.
• Live Monitoring and Safety Enhancement: Telematics allows for real-time monitoring of vehicles, especially in semi-autonomous cars. It is put in place with GPS and onboard diagnostics to record and map the vehicle’s location, route, speed, and ensure the safety of people. Moreover, IoT-infused semi-autonomous cars make on-spot decisions while partly controlling the vehicle operations to avoid accidents and reduce the load from the driver. Along with different proximity sensors and cameras, cars are integrated with IoT systems to reduce human error and make driving more comfortable and safe.
• Predictive Analysis and Improved Efficiency: A sought-after feature of automotive electronics is predictive analytics. Telematics data helps businesses make insightful decisions to identify potential issues. These systems can proactively alert drivers if they swerve, and detect drowsiness using vision AI models. As for IoT, it aids in taking necessary actions to prevent car parts from sudden breakdowns.

Future Prospects

Looking ahead, as the field of telematics matures, smart cars will continue tapping into IoT sensors and devices that link vehicles in cities via smart traffic technologies. Automotive manufacturers will use telematics for a variety of testing and training purposes such as gaining deeper insights into onsite or remote testing, creating predictive models for vehicle integrity, training employees virtually, as well as running simulations to improve crash-test safety.

The sector is bound to integrate AI to analyse large amounts of data from vehicle sensors for autonomous driving capabilities. Future vehicles may even influence telematics to provide tailored experiences based on driver preferences and habits, including navigation, entertainment, and comfort settings. With the rise of electric vehicles, telematics will play a major role in managing battery health, optimising charging, and planning energy-efficient routes. Ultimately, these developments will certainly shape business opportunities and process refinements in automotive electronics that were previously unattainable.

Author: Pavan Puri, Founder & Managing Director, Greencore Electronics

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                                                                                             FOR IMMEDIATE RELEASE

 

Littelfuse Unveils Industry’s First Asymmetrical TVS Diode Series for SiC MOSFET Gate Protection

Ideal for high-efficiency power solutions in data center, EV infrastructure, and industrial equipment

CHICAGO, October 22, 2024 — Littelfuse, Inc. (NASDAQ: LFUS), an industrial technology manufacturing company empowering a sustainable, connected, and safer world, today announced the SMFA Asymmetrical Series Surface-Mount TVS Diode, the first-to-market asymmetrical TVS solution specifically designed to protect Silicon Carbide (SiC) MOSFET gates from overvoltage events. As SiC MOSFETs become increasingly popular due to their faster switching speeds and superior efficiency compared to traditional Silicon MOSFETs and IGBTs, the need for robust gate protection has never been greater. The SMFA Asymmetrical Series offers an innovative, single-component solution that significantly enhances circuit reliability while simplifying design.  View the video.

The SMFA Asymmetrical Series is the only TVS diode on the market engineered specifically for the unique gate protection requirements of SiC MOSFETs. Unlike traditional solutions that require multiple Zener or TVS diodes, the SMFA Series effectively protects against ringing and overshoot phenomena in gate drive circuits using a single component, saving valuable PCB space and reducing the complexity of circuit designs.

The SMFA Asymmetrical Series Surface-Mount TVS Diode offers the following key features and benefits:

• Asymmetrical Design: The SMFA Series is tailored to the specific negative and positive gate voltage ratings of SiC MOSFETs, ensuring precise and reliable protection.
• Single-Component Solution: Replaces multiple Zener and TVS diodes, reducing the number of components and simplifying circuit layout.
• Space Efficiency: By combining multiple protection functions into one component, the SMFA Series minimizes PCB space usage, allowing for more compact and efficient designs.
• Compatibility: The SMFA Asymmetrical Series is compatible with all available Littelfuse and other leading SiC MOSFETs, making it a versatile solution for various applications.

“The SMFA Asymmetric TVS Diodes protect valuable SiC MOSFETs from gate failures using a single component solution that easily replaces multiple Zener and TVS diodes,” said Ben Huang, Director of Product Marketing at Littelfuse. “This unique solution also saves valuable PCB space while reducing the number of components required.”

The SMFA Asymmetrical Series is ideal for a variety of demanding applications where SiC MOSFETs are used, including:

• AI / Data Center Server Power Supplies: Enhances the reliability and efficiency of critical power supplies in high-performance computing environments.
• High-Efficiency Electric Vehicle Infrastructure (EVI) Power Systems: Provides robust gate protection in EV charging stations and related power systems, ensuring longevity and performance.
• High-Reliability Semiconductor/Industrial Equipment Power Supplies: Protects essential power supplies in industrial and semiconductor manufacturing environments, where reliability and uptime are paramount.

Availability

The SMFA Asymmetrical Series TVS Diode is available in tape and reel format in quantities of 3,000. Sample requests are accepted through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit Littelfuse.com.

 

For More Information
Additional information is available on the SMFA Asymmetrical Series TVS Diodes product page. For technical questions, please contact: Ben Huang, Director of Product Management, Protection Business, SBU, Bhuang@littelfuse.com

About Littelfuse
Littelfuse is a diversified, industrial technology manufacturing company empowering a sustainable, connected, and safer world. Across more than 20 countries, and with approximately 17,000 global associates, we partner with customers to design and deliver innovative, reliable solutions. Serving over 100,000 end customers, our products are found in a variety of industrial, transportation, and electronics end markets—everywhere, every day. Headquartered in Chicago, Illinois, United States, Littelfuse was founded in 1927. Learn more at Littelfuse.com.

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Author: STMicroelectronics

X-CUBE-STL now supports the STM32MP1, the STM32U5, the STM32L5, the STM32H5, and the STM32WL. In essence, the most extensive family of general-purpose microcontrollers capable of running Safety Integrity Level 2 and 3 certified systems continues to grow, and teams needing to meet IEC 61508, ISO 13849, and IEC 61800 requirements can do so on our latest devices. Additionally, the Functional Safety page will make finding the various ST resources that will assist developers striving for industrial or household electrical appliance certifications easier. It also lists the ST Authorized Partners providing real-time operating systems, development tools, engineering services, and training to ensure teams can cross the bridge from proof-of-concept to commercial products.

• Watch our Webinar on functional safety

The International Electrotechnical Commission defines safety as the “freedom from unacceptable risk of physical injury or of damage to people’s health.” When designing an embedded system, functional safety covers the various aspects of safety that depend on that system. For instance, in a manufacturing plant, functional safety ensures that in case of an internal failure, the circuit controlling a robot fails gracefully instead of harming its operators. In a medical application, standards guarantee that users are aware of malfunctions by the use of an alarm, among other things, to prevent detrimental usage. And since our STM32 microcontrollers are everywhere, we needed to see that they all had a straightforward path to IEC 61508 for industrial applications.

Before X-CUBE-STL: How to start working on an IEC 61508 certification A robot arm in an industrial setting

The IEC 61508 governs functional safety for electrical and electronic systems in all sorts of industries and applications. However, many STM32 users seek this certification when working in an industrial setting where risks are higher and requirements more stringent. The first significant aspect of the standard is the safety life cycle. Before anything else, engineers must document all the steps and measures they will take to accomplish functional safety, from the first design operations to the product’s decommissioning. The process includes risk analysis, safety protocols, and validations, maintenance, etc.

Our Functional Safety page is a great starting point for engineers because it provides a “safety manual” for nearly all STM32 microcontrollers, thus ensuring that teams can begin working on defining their product’s life cycle. Most documentation focuses on IEC 61508 compliance. However, we recently published an application note (AN5698) to help engineers adapt what’s in the X-CUBE-STL package to other safety certifications, such as ISO 13849, for safety of machinery. We also provide a failure mode and effect analysis (FMEA), which lists all the MCU failure modes and how to mitigate them. Similarly, the failure mode effect and diagnostic analysis (FMEDA) extends the former and computes failure rates for the MCU at the function level.

X-CUBE-STL: Self-test libraries to more rapidly obtain SIL 2 or SIL 3 certifications Understanding Safety Integrity Levels

The second aspect of IEC 61508 is the assignment of a Safety Integrity Level (SIL). After a hazard analysis determines what can go wrong and how badly it can damage a person or the environment, there’s a risk assessment to determine how often or how likely a hazard can occur. From these analyses, functional safety standards draw safety requirements or SIL.

There are four levels, the first being the laxest and the fourth representing the strictest standard. SIL 4 is traditionally for railway or nuclear applications. SIL 1 is looser and tends to apply to monitoring/information devices like CCTV, while SIL 2 and 3 are much more common in hardware designed for industrial applications. The main difference is the requirement to perform redundant measurements in SIL 3.

Knowing how to get started

To start working toward SIL 2 or SIL 3 certifications, teams begin by selecting an STM32 with the hardware safety features that match their application’s requirement. For instance, all our MCUs have a dual watchdog, but only the STM32G0, STM32G4, STM32H5, STM32H7, STM32L4/L4+, STM32L5, STM32U5, STM32WB/A, and STM32WL have ECC Flash memory, and out of them, only the STM32H7, STM32H5, and STM32U5 have ECC SRAM, which is traditionally only a requirement for high-performance applications.

Teams can also use the self-test libraries available in the X-CUBE-STL to start implementing failure detection mechanisms. For instance, they can help spot random failures in the CPU, the SRAM, or the Flash. The diagnostic capability of X-CUBE-STL is verified by fault injection methodology to improve the customers’ confidence in our solutions. To make these libraries more accessible, we offer them as object code, meaning that they can be integrated into any application, and developers can use any compiler.

X-CUBE-STL provides object code to help developers run self-tests on STM32 MCUs. Consequently, because we deliver an object code, developers can integrate it into their software, certify one object, and reuse it multiple times since it doesn’t depend on the compiler version or other dependencies. It greatly facilitates the process when applying to certification bodies.

X-CUBE-CLASSB and why an ecosystem matters Sharing resources

Recently, ST updated its X-CUBE-CLASSB, which targets electrical household appliances, to align it with X-CUBE-STL. Put simply, while they have different user manuals and different purposes, the selt-test libraries share the same code base with X-CUBE-STL. Hence, it becomes much easier to obtain more than one certification on the same hardware platform. Additionally, since these certifications are much less stringent than IEC 61508, the ability to use the same object code as the X-CUBE-STL provides greater assurance. The software package currently supports the STM32U5, STM32G0, STM32C0, STM32L4, STM32G4, STM32WL, STM32MP1, STM32H5, STM32F7, and STM32H7. Support for the STM32H7R/S, STM32U0, and STM32F4 will arrive by the end of the year.

Optimizing functional safety

All these packages turn our STM32 general-purpose microcontrollers into great candidates for the most complex protocols. Traditionally, MCUs aimed at these standards are custom products, which means that they are much more expensive and use hardware specifications that are sometimes more prohibitive in one way or another. ST’s approach is thus unique because we make these standards more accessible and provide an essential network of partners. In many instances, using two STM32s is still more cost-effective than using one MCU sold specifically for safety.

As great as the documentation and self-test libraries are, we know that they represent only the first steps in a long process. Many teams often underestimate the difficulties associated with getting a certification. Hence, we also have ST Authorized Partners who know our devices and can ensure engineers cross the finish line by shipping a certified product.

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Keysight Propels Pegatron 5G to Transform Power Efficiency for Open RAN

• 40% reduction in power consumption will support sustainability goals and reduce network operating costs

 

October 21, 2024

INDIA – Keysight Technologies, Inc. (NYSE: KEYS) has enabled Pegatron 5G to test and validate its Open Radio Unit (O-RU) advanced energy savings features using ETSI-specified energy measurement methods. This was achieved using Keysight’s Open Radio Access Network Architect Solutions (KORA), which ensures conformance, interoperability, performance, security, and energy efficiency validation for radio access network (RAN) testing.

With the majority of energy (76%) consumed in the RAN, improving efficiency is a strategic priority for operators. Therefore, testing energy consumption and its impact on network performance is critical. While advancements from 2G to 5G have delivered improvements, the increasing density of 5G networks to meet higher data demands will drive up consumption, impacting operating costs and sustainability goals. E-plane testing helps operators and manufacturers optimize networks to enhance efficiency in 5G and future network deployments.

By utilizing Keysight’s E-Plane ETSI Test Suites to evaluate the energy efficiency of its PR1450 O-RU solution, Pegatron 5G was able to achieve a 40% reduction in power consumption while adhering to O-RAN energy saving requirements and the ETSI ES 202 706-1 and ETSI TS 103 786 energy measurement methods. This will significantly reduce network operating costs and ensure compliance with environmental targets. The capability was demonstrated at the India Mobile Congress 2024.

David Hoelscher, Vice President of Business Development and Chief Product Officer of Pegatron 5G, said: “We are proud to be the first company in Taiwan to demonstrate O-RAN energy saving and e-plane support on our PR1450 O-RU. This achievement reflects our ongoing commitment to innovation and our ability to deliver advanced 5G solutions that benefit customers and the environment.”

Peng Cao, Vice President and General Manager of Keysight’s Wireless Test Group, said: “Keysight’s KORA solutions expedite the sustainable development and deployment of the O-RAN ecosystem, with a full range of industry-proven Open RAN energy lab and field tests solutions. By collaborating with partners like Pegatron 5G, Keysight is accelerating deployments, helping network operators reduce costs, and contributing to environmental sustainability.”

About Keysight Technologies

At Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and www.keysight.com.

 

Media Contacts

Keysight

 

North America PR Team
pdl-americas-keysight@keysight.com

 

Fusako Dohi

Asia

+81 42 660-2162

fusako_dohi@keysight.com

 

Jenny Gallacher

Europe

+44 (0) 7800 737 982

jenny.gallacher@keysight.com

 

Thejas A S

India

+91 98862 57535

thejas.as@2020msl.com

 

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GÖPEL electronic introduces the new Multi Line product family, an innovative platform of inspection systems that supports the entire manufacturing process. The centerpiece of this solution is a modular base system with a uniform and powerful software interface. This reduces training requirements, enables flexible employee scheduling, and optimizes the exchange of knowledge between production staff. This can be especially important when there may be a shortage of skilled workers.

The all-rounder can be configured for all inspection tasks throughout the entire manufacturing process: for solder paste inspection (SPI), for surface mount technology (SMT) and through-hole technology (THT) automated optical inspection (AOI), and also for conformal coat inspection (CCI). For THT printed circuit board assemblies (PCBA), Multi Line provides flexible transport options, with or without carriers, and all the necessary camera modules for this application. It also allows THT solder inspection, even during return on the optional lower transport conveyor. Thanks to 3D technology, solder joints can be inspected not only for soldering quality and for shorts, but also for solder volume and pin length, without flipping the PCBA.

The system’s configuration versatility also makes it suitable for use in the SMT process, where optional double-sided inspection offers the advantage of fully testing SMT assemblies without flipping the PCBA.

Furthermore, Multi Line is available as an SPI system for the inspection of solder paste deposits in regard to shape, height, area, bridges, volume, X/Y offset, and co-planarity. A closed-loop interface to the solder paste printer is available, and a link to PILOT Verify software makes fault analysis more efficient by displaying associated AOI, AXI, and SPI result data.

Multi Line CCI can automatically inspect protective coatings by making fluorescent coatings glow using UV LEDs of different wavelengths. With telecentric optics and a color camera, the system delivers high-contrast images and enables fast programming using CAD data and coating plans. As a special feature, the PCBA can be simultaneously inspect both top and bottom without turning, and, if necessary, can also be transported back to the beginning of the line using a lower level return conveyor.

Thanks to the modular design of the Multi Line platform, camera modules can be flexibly combined and, if necessary, retrofitted later for new applications in the manufacturing process.

With this comprehensive solution, GÖPEL electronic is utilizing its many years of experience in quality assurance and setting new standards in inspection technology for the electronics manufacturing process.

GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies as well as industrial and automotive electronics systems. GÖPEL electronic is comprised of four business units:

• Automotive Test Solutions
• Embedded JTAG Solutions
• Inspection Solutions AOI-AXI-SPI-IVS
• Industrial Function Test

The company is a global supplier with its own subsidiaries as well as distribution, and generated sales of approximately 40 million Euros in 2023 with 240 employees.

Further information: www.goepel.com/en

Press Contact:

GÖPEL electronic GmbH                                                    Tel.: +49 (0)3641-6896-779

Bettina Richter                                                                     Fax: +49 (0)3641-6896-944

Göschwitzer Straße 58/60                                                 E-Mail: presse@goepel.com

07745 Jena, Germany.                                                        Web: www.goepel.com

 

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                                                                                  News Release

Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification

QML Class V designation recognizes exceptional reliability and longevity for critical space missions

 

October 18, 2024 — Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s (Nasdaq: MCHP) Radiation-Tolerant (RT) RTG4 Field- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Qualified Manufacturers List (QML) Class V status. As designated by the Defense Logistics Agency (DLA), QML Class V is the highest level of qualification for space components and a necessary step to satisfy mission assurance requirements on the most critical space missions such as human-rated, deep space and national security programs. Because QML qualifications are standardized based on specific performance and quality requirements governed by the DLA, customers can streamline their design and certification processes by using QML-qualified products.

 

In 2018, RTG4 FPGAs became the first RT FPGAs offering more than 150,000 logic elements to achieve a QML Class V qualification, and this next-generation solution with lead-free flip-chip bumps is the first of its kind to achieve QML Class V status. In advanced flip-chip package construction, such as that used in the RTG4 FPGA, flip-chip bumps are utilized to connect the silicon die and the package substrate. Lead-free bump material will help extend the longevity of the product, which is critical to space missions.

 

“This is another milestone for our RTG4 FPGAs that will provide customers with added confidence in designing these devices in space flight systems, while allowing them to take advantage of our high-reliability, zero-configuration-upset and low-power consumption FPGAs,” said Bruce Weyer, corporate vice president for Microchip’s FPGA business unit. “For more than 60 years, Microchip solutions have powered space flight missions, and we are dedicated to product longevity and providing the highest quality solutions.”

 

RTG4 FPGAs are designed to bring high levels of density and performance to space applications, saving cost and engineering efforts through low power consumption and immunity to configuration upsets. Unlike SRAM-based FPGA alternatives, the programming technology used in RTG4 FPGAs provides low static power, which assists in managing thermal issues common in spacecraft. RTG4 FPGAs consume only a fraction of the total power compared to equivalent SRAM FPGAs, while exhibiting zero configuration upsets in radiation and thus requiring no mitigation, reducing engineering expenses and total system costs.

 

To achieve QML Class V qualification, the RTG4 FPGA with lead-free bump has undergone extensive reliability testing, enduring up to 2,000 thermal cycles from −65°C to 150°C junction temperature. The lead-free flip-chip bump interface connections passed MIL-PRF-38535 inspection criteria and exhibited no signs of tin whiskers. The flip-chip bump is inside the FPGA package, so there is no impact on the user’s design, reflow profile, thermal management or board assembly flow when converting to lead-free bump RTG4 FPGAs.

 

Microchip boasts one of the industry’s most comprehensive space product portfolios of radiation-hardened and RT solutions that include QML Class Q RT PolarFire® FPGAs and sub-QML FPGAs that bridge the gap between traditional Qualified Manufacturers List (QML) components and Commercial Off-The-Shelf (COTS) components. For a comprehensive listing of Microchip FPGA and mixed-signal part numbers alongside their corresponding Defense Logistics Agency (DLA) drawing numbers, please refer to the DLA Cross Reference Guide.

 

Development Tools

The RTG4 FPGAs are supported by development kits, mechanical samples and daisy chain packages for board validation and testing. Libero® SoC Design Suite enables RTL entry through programming and includes a rich IP library, complete reference designs and development kits.

 

Availability

For additional information or to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

 

Resources

High-res images available through Flickr (feel free to publish):

• Application Image: https://www.flickr.com/photos/microchiptechnology/54037604837/sizes/l/

 

About Microchip:

Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control and processing solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve approximately 123,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.

###

Note: The Microchip name and logo, the Microchip logo, Libero and PolarFire are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks are the property of their respective companies.

 

Editorial Contact:

Samheetha Ravi Bhat

samheetha@prhub.com

9731054124

The post Press release of Microchip Technology about how RTG4™ FPGAs with lead-free flip-chip bumps achieve the highest space qualification appeared first on ELE Times.

Rohde & Schwarz has successfully achieved full coverage of Skylo’s comprehensive test plan for devices operating in Narrowband-IoT in Non-Terrestrial Networks (NB-NTN). This milestone also enables SMS services over NB-NTN, paving the way for unlimited connectivity on smartphones, wearables, and IoT devices.

Munich, October 17, 2024 — Rohde & Schwarz and Skylo Technologies have verified and validated all of the test cases defined in Skylo’s network operator acceptance criteria, including newly added test cases for SMS over NB-NTN, using the advanced CMW500 wideband radio communication tester. This marks a significant milestone in device certification and paves the way for a successful adoption of NB-NTN technology.

Skylo is a global NTN service provider, whose network takes advantage of dedicated satellite spectrum across various partner constellations, allowing smartphone and IoT cellular devices to connect directly over existing satellites. This technology facilitates seamless communication even in remote areas lacking traditional network coverage. Skylo’s certification process involves rigorous testing and evaluation to ensure that devices meet the stringent performance and reliability standards.

The successful validation of SMS over NB-NTN marks a significant step in bringing satellite connectivity to consumer devices. As a consequence, users of smartphones and wearables can rely on messaging services regardless of their location, which will enhance their safety and communication capabilities in areas without terrestrial network access.

For more information NTN test solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/_256719.html

Proposal for caption: Rohde & Schwarz achieves full coverage of Skylo’s test plan for NB-NTN devices using the advanced CMW500

Press contacts:

Europe (headquarters): Christian Mokry (phone: +49 89 4129 13052; email: press@rohde-schwarz.com)

North America: Dominique Loberg (phone: +1 503 523-7951; email: Dominique.Loberg@rsa.rohde-schwarz.com)

Asia Pacific: Sze Ming Ng (phone: +603 5569 0011; email: press.apac@rohde-schwarz.com)

Contact for readers:

www.rohde-schwarz.com/contact

 

Rohde & Schwarz

Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company’s leading-edge products and solutions empower industrial, regulatory and government customers to attain technological and digital sovereignty. The privately owned, Munich based company can act independently, long-term and sustainably. Rohde & Schwarz generated net revenue of EUR 2.78 billion in the 2022/2023 fiscal year (July to June). On June 30, 2023, Rohde & Schwarz had around 13,800 employees worldwide.

R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.

All press releases, including photos for downloading, are available on the internet at www.press.rohde-schwarz.com.

The post Press release of Rohde & Schwarz about achieving its full coverage of Skylo’s test plan for NB-NTN devices, enabling SMS services appeared first on ELE Times.

Rohde & Schwarz has successfully achieved full coverage of Skylo’s comprehensive test plan for devices operating in Narrowband-IoT in Non-Terrestrial Networks (NB-NTN). This milestone also enables SMS services over NB-NTN, paving the way for unlimited connectivity on smartphones, wearables, and IoT devices.

Munich, October 17, 2024 — Rohde & Schwarz and Skylo Technologies have verified and validated all of the test cases defined in Skylo’s network operator acceptance criteria, including newly added test cases for SMS over NB-NTN, using the advanced CMW500 wideband radio communication tester. This marks a significant milestone in device certification and paves the way for a successful adoption of NB-NTN technology.

Skylo is a global NTN service provider, whose network takes advantage of dedicated satellite spectrum across various partner constellations, allowing smartphone and IoT cellular devices to connect directly over existing satellites. This technology facilitates seamless communication even in remote areas lacking traditional network coverage. Skylo’s certification process involves rigorous testing and evaluation to ensure that devices meet the stringent performance and reliability standards.

The successful validation of SMS over NB-NTN marks a significant step in bringing satellite connectivity to consumer devices. As a consequence, users of smartphones and wearables can rely on messaging services regardless of their location, which will enhance their safety and communication capabilities in areas without terrestrial network access.

For more information NTN test solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/_256719.html

Proposal for caption: Rohde & Schwarz achieves full coverage of Skylo’s test plan for NB-NTN devices using the advanced CMW500

Press contacts:

Europe (headquarters): Christian Mokry (phone: +49 89 4129 13052; email: press@rohde-schwarz.com)

North America: Dominique Loberg (phone: +1 503 523-7951; email: Dominique.Loberg@rsa.rohde-schwarz.com)

Asia Pacific: Sze Ming Ng (phone: +603 5569 0011; email: press.apac@rohde-schwarz.com)

Contact for readers:

www.rohde-schwarz.com/contact

 

Rohde & Schwarz

Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company’s leading-edge products and solutions empower industrial, regulatory and government customers to attain technological and digital sovereignty. The privately owned, Munich based company can act independently, long-term and sustainably. Rohde & Schwarz generated net revenue of EUR 2.78 billion in the 2022/2023 fiscal year (July to June). On June 30, 2023, Rohde & Schwarz had around 13,800 employees worldwide.

R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.

All press releases, including photos for downloading, are available on the internet at www.press.rohde-schwarz.com.

The post Press release of Rohde & Schwarz about achieving its full coverage of Skylo’s test plan for NB-NTN devices appeared first on ELE Times.

Media Alert

 

Vicor releases highest density automotive-grade power modules, enabling 48V power systems for electric vehicles

Andover, Mass., October 16, 2024 – Vicor has released three automotive-grade power modules for 48V EV systems which deliver industry-leading power density and support automotive OEM and tier one production in 2025. The BCM6135, DCM3735 and PRM3735 use AEC-Q100 certified Vicor-designed ICs and have completed the PPAP process with automotive customers.

“Vicor has set a new standard for power density in the automotive industry with these scalable and flexible miniature power modules,” said Patrick Wadden, VP of the Vicor Automotive business unit. “Our high-performance converters enable new possibilities for automotive manufacturers to reduce the size and weight of power systems throughout the vehicle.”

The BCM6135 is a 98% efficient 2.5kW BCM® bus converter which converts 800V from the traction battery to 48V to provide a safety extra-low voltage (SELV) power supply for the vehicle. The BCM6135 internally provides the isolation between high voltage and low voltage which creates a large reduction the space required for the DC-DC conversion. The BCM6135’s power density of 158kW/L allows EV system designers to reduce size of the primary DC-DC converter and reduce vehicle weight. The bidirectional rapid current transient response rate of 8 mega amps per second allows the BCM6135 to replace a 25lb 48V battery — by serving as a virtual 48V battery in the xEV vehicle and delivering additional cost and weight savings.

The DCM3735 2.0kW DCM DC-DC converter transforms an unregulated 48V input into a regulated 12V output. The DCM3735 has a wide input range that is compatible with a variety of automotive applications because the output can be trimmed within a range of 8 – 16V. The DCM3735 has a power density of 300kW/L making it an attractive choice for architectures bridging a 48V distribution to 12V subsystems in zonal ECU applications.

The PRM3735 is a 2.5kW PRM regulator for 48V power that is 99.2% efficient. Its small footprint and 260kW/L power density frees up packaging space and reduces the overall volume and weight of the DC-DC power supply. It is best suited to support regulated 48V loads that are implemented in new vehicle architectures.

The newly released Vicor modules can be arranged in over 300 configurations, offering extreme flexibility and scalability to support innovation for a variety of vehicle subsystems. Further, as the market shifts from 12V to 48V Zonal Architecture, these products are highly efficient in converting to and from 48V. All three modules can be arrayed easily to increase power supply levels, and they have automatic power sharing for optimum performance in an array.  These modules solve complex challenges with 800V, 400V, 48V and 12V systems.

“Our power modules make it easy to convert from the primary battery (800V or 400V) to 48V and down to load,” said Wadden. “They are very versatile, and our customers are using the modules to improve efficiency while also removing size and weight from their power systems.”

Vicor power modules are improving power delivery networks throughout the vehicle in innovative ways:

• Active suspension comes of age in EVs
  Power needs of active suspension system are too high to be met with 12V power. Switching to a 48V bus and converting down with the bidirectional BCM6135 is an efficient way to deliver high performance. This application also capitalizes on the BCM6135’s high slew rate as the active suspension is a regenerative power load, which requires immediate current flow reversal to pass regenerated power back to the battery.
• Deleting or reducing the low-voltage battery

The industry-leading slew rate of the BCM6135 presents an opportunity to replace a 48V battery — with the BCM serving as a virtual 48V battery in the xEV vehicle, delivering cost and weight savings. Since the BCM6135 can switch from zero current to full current at 8.0MA/s, it can step down the traction battery’s 800 to 48V and power a load as fast as drawing the power from an auxiliary 48V battery. No other DC-DC converter can match this speed and enables customers to reduce vehicle weight by up to 25kg while reducing vehicle costs by up to $100.

• 48V zonal architecture adoption is on every roadmap
  The new power modules can be easily configured to make this transition easier. The DCM3735 is used in conjunction with BCM3735 to create a regulated 12V power supply off the BCM6135 48V output. When used as a part of the 48V zonal architecture, the DCM3735 can be mounted remotely to create a local 12V supply in a vehicle zone, for example on the right hand side. This application method allows the PDN designer to effectively support 12V loads while achieving up to 90% of the cost and weight savings that come from transitioning to a 48V bus.
• Precharging prevents current surges and saves weight

Precharging is a necessary step of the start-up process. It prevents current surges at battery engagement that will damage the loads (such as pumps and compressors). Currently this is done using high voltage contactors and resistors, which add 1kg and over $50 in cost. The alternative is to use BCM6135 and a PRM3735 as the main DC-DC converters and one of the low-voltage batteries installed in the vehicle. The BCM6135 can boost the low-voltage battery power up to high voltage and achieve the needed precharge, eliminating the legacy precharge contactor and power resistor.

The flexibility of the power modules enable a host of automotive applications to be powered.  More importantly, they deliver on the promise of 48V adoption. Whether converting the high voltage traction battery to 48V, delivering point-of-load power from a 48V bus, or enabling legacy 12V sub-systems to live in new 48V zonal architectures, Vicor’s high performance, automotive grade power modules deliver the highest power density while reducing power loss and simplifying designs.

 

Learn more about the three new automotive-grade Vicor power modules

 

About Vicor

Vicor is the leader in high-performance power modules, enabling customer innovation with easy-to-deploy modular power system solutions for power delivery networks that provide the highest density and efficiency from source to point-of-load. We continuously advance the density, efficiency and power delivery capabilities of our power modules by staying on the forefront of distribution architectures, conversion topologies and packaging technology. Vicor serves customers in high-performance computing, industrial equipment, automotive and aerospace and defense markets. With over 40 years of experience in designing, developing and manufacturing power modules for demanding markets, the Vicor patented, high-frequency DC-DC power conversion technology is ideally suited for the automotive market.

 

www.vicorpower.com

 

Vicor is a registered trademark of Vicor Corporation.

 

For more information contact:

 

Stephen Germino,

sgermino@vicr.com

978 749-8243

The post Press release of Vicor about the highest-density automotive-grade power modules appeared first on ELE Times.

The answers to the following questions shall bring forth few pertinent facts about Auto EV India Expo 2024:

1. With EV sales surging by 35% in 2023, how does Auto EV India 2024 plan to showcase the latest trends driving this rapid market growth?

Answer: Auto EV India 2024 shall bring to fore all companies dealing with latest innovations and advancements in the field of electric vehicle and automotive technology. All of them shall be brought under one roof. They shall exhibit all their latest advancements and products in the exhibition hall of our event. There shall be a free flow of information. This shall enable an un-interrupted exchange of ideas. It shall be a great opportunity to liaison with many industry stalwarts.

 

 

2. As fast-charging infrastructure becomes more widespread, what solutions and collaborations do you expect to be highlighted at the 3rdedition of the Expo?

Answer: All major companies dealing with fast-charging solutions shall exhibit their products and services at Auto EV India 2024. For instance, companies installing charging stations and using over-the-air technology for charging electric vehicles.

 

 

3. How is the Expo promoting collaboration among OEMs, Tier 1 suppliers, and tech innovators to enhance India’s global EV position?

Answer: In collaboration, the original equipment manufacturers and Tier 1 suppliers develop core software solutions. Such as operating systems, middleware, and applications. Besides, Tier 1 suppliers develop specific software solutions. For instance, connectivity, ADAS, in-vehicle experiences, and offering software-as-a-service (SaaS) solutions. Their partnership is based on a shift from hardware-centric partnerships to joint software development.

The Auto EV Expo 2024 is leveraging this domain by bringing together concerned companies on one forum for discussion during the conference and exhibition of their products and services to the concerned stakeholders during the exhibition.

 

 

4. How is the expo positioning itself in the realm of advancing hydrogen fuel cell technology as a key alternative in the automotive sector?

Answer: Traditionally, the automotive industry used to use internal combustion engine. Now, it is being replaced by hydrogen fuel cell. The benefit of using the latter is that it is based completely on renewable source of energy. Besides, it is highly efficient in generating energy. Also, it can be recharged in a very short span of time.

Auto EV Expo 2024 shall endeavour to bring forth all latest advancements in the field of utilising hydrogen fuel cells for a discussion during the conference. And later, for exhibition by all concerned companies during the exhibition. It would be an excellent opportunity to liaison with the technical, marketing, and sales team of concerned companies.

 

 

5. How is the government initiatives like the PLI Scheme and ACC Battery Storage impacting India’s EV future, and how will Auto EV India 2024 contribute in this scenario?

Answer: The Government of India’s Production Linked Incentive (PLI) scheme for Advanced Chemistry Cell (ACC) Battery Storage aims to scale up the production of electric vehicle’s batteries to the tune of 95 GWh. It was approved with an outlay of ₹ 18, 000 crore. It would convert India into a global manufacturing hub. This would lead to reduction in India’s import dependence.

Auto EV India 2024 will bring together all major firms driving benefit under the aforesaid scheme for their display in the exhibition. This would enable them to interact with various industry stakeholders and prospective clients.

The post Few pertinent facts about Auto EV India Expo 2024 appeared first on ELE Times.

In the ever-evolving automotive industry, users demand a seamless Human-Machine-Interface (HMI) experience for their infotainment application. Customers are looking for large touchscreens with advanced features and are venturing into OLED and Micro OLED as their choice of display. OLED is seen as the future of smart mobility applications, enabling flexible design and free-form shapes. Best customer experience coupled with functional safety standards must go hand in hand to provide a seamless journey for the end user. To address these challenges, Infineon Technologies AG introduces the Automotive PSoC Multitouch GEN8XL (IAAT818X), a new generation of touch controllers. Designed for OLED and micro-LED displays up to 24 inches, the touch controller delivers performance and frame rates that meet today’s demands. It ensures a seamless user experience on various touch-based interfaces, such as touchscreens, touchpads, and sliders, while meeting the rigorous automotive standards for electromagnetic compatibility (EMC IEC 61967), including chip-level emission, conducted emission (IEC 62132), and radiated emission (ISO 11452).

The PSoC Automotive Multitouch GEN8XL is AEC-Q100 qualified as well as Auto-SPICE level 3 and ASIL-B compliant. It is offered in two different packages, 128-pin and 100-pin TQFP. The touch controller operates reliably despite water droplets, condensation or sweat and enables users to perform touch operations with gloves up to 4mm. The touch controller’s design allows for scalability to accommodate larger screen sizes, with the possibility of supporting screens up to 55 inches via the implementation of multi-chip architectures. It also supports advanced add-on features like rotary dial and built-in haptics.

Infineon offers a comprehensive support package, including application firmware, design guidance for sensor and Flexible Printed Circuit (FPC), as well as a touch tuning host emulator (TTHE) tuning, to facilitate seamless integration and production.

The post New Automotive PSoCTM Multitouch controller supports OLED and ultra-large screens with superior touch performance appeared first on ELE Times.

The VelocityDRIVE Software Platform enables switch-management communication based on standardized YANG models

Driven by the need for higher bandwidth, advanced features, enhanced security and standardization, automotive OEMs are transitioning to Ethernet solutions. Automotive Ethernet provides the necessary infrastructure to support Software-Defined Networking by centralizing control, enabling flexible configurations and real-time data transfer. To provide OEMs with comprehensive Ethernet solutions, Microchip Technology today announces its new family of LAN969x Multi-Gigabit Ethernet Switches and VelocityDRIVE Software Platform (SP), which is a turnkey Ethernet switch software solution and Configuration Tool (CT) based on standardized YANG models.

The combination of LAN969x devices and VelocityDRIVE SP, the industry’s first integration of CORECONF YANG, offers an innovative industry-standard network configuration solution. The CORECONF YANG standard aims to empower designers by separating software development from the hardware network layer. This reduces complexity and costs and accelerates the time to market.

The high-performance LAN969x Ethernet switches are powered by a 1 GHz single-core Arm Cortex-A53 CPU and feature multi-gigabit capabilities with scalable bandwidths from 46 Gbps to 102 Gbps. Advanced Time-Sensitive Networking (TSN) is designed to meet precise timing and reliability requirements of applications like Advanced Driver Assistance Systems (ADAS).

“The introduction of the VelocityDRIVE Software Platform provides our automotive customers with a turnkey software switch solution and configuration tool to easily manage in-vehicle Ethernet networking,” said Charlie Forni, vice president of Microchip’s USB and networking group. “The use of the standards-based YANG configuration protocol enables software to be developed independently and reused across multi-vendor Ethernet switches.”

The LAN969x switch family is designed to support ASIL B Functional Safety and AEC-Q100 Automotive Qualification standards, offering high reliability and safety for automotive applications. The devices are optimized for systems with a small embedded-memory footprint and feature secure and fast boot capabilities using integrated ECC SRAM for code execution, which eliminates the need for expensive external DDR memory.

As in-vehicle networking continues to increase, software solutions like VelocityDRIVE SP are necessary for customers to configure and manage their networking systems. The LAN969x switch family joins Microchip’s portfolio of automotive Ethernet solutions, which includes 10 Mbps to 1000 Mbps PHY transceivers, controllers, switches and endpoints. For more information about Microchip’s automotive Ethernet solutions, visit the web page.

Development Tools

The LAN969x devices are supported by the LAN9692 VelocityDRIVE Evaluation Board and VelocityDRIVE Configuration Tool (CT).

Pricing and Availability

The LAN9691, LAN9692 and LAN9693 are available in production quantities. The VelocityDRIVE Software Platform is available to download. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: flickr.com/photos/microchiptechnology/54036155085/sizes/l

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Nuvoton Technology Corporation, a leading microcontroller platform provider with years of extensive industry experience, is set to host its first-ever microcontroller/microprocessor roadshow in Southeast Asia. Building on its extensive experience and recent expansion into emerging markets, Nuvoton has strengthened regional support and optimized its global supply chain. The roadshow will take place in Singapore on November 6 and in Hanoi, Vietnam, on November 8, where we will showcase Nuvoton’s latest MCU/MPU platforms, solutions, and ecosystems to local experts and industry professionals.

Nuvoton will present comprehensive topics covering the NuMicro MCU platforms with 8051, Arm Cortex-M23/ M4/ A35, and Arm9 cores. Key products, including the MG51, ML51, M253, M460, M480, and MA35 series, are designed for various IoT, smart homes, industrial control, and HMI applications.

Additionally, Nuvoton will introduce audio chips, audio amplifiers, HMI solutions, battery management systems, and smart industrial IoT. To streamline development, the NuDeveloper ecosystem offers evaluation boards, debuggers, and software tools, supporting developers from prototyping to production, ensuring a smooth and efficient design process.

Attendees can expect live demonstrations of HMI solutions, lighting control, touch key solutions, and advanced audio designs.

This event aims to strengthen ties with Southeast Asia’s tech community and explore future collaboration opportunities. We welcome industry professionals to join us and participate in these insightful discussions and demonstrations.

For more details about the Nuvoton Technology 2024 Microcontroller Innovations Roadshow, please visit: Nuvoton Technology 2024 – Microcontroller Innovations Roadshow (digitimes.com.tw)

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New 871 Series Fuse provides 150A and 200A ratings in compact SMD form factor,
simplifying designs and saving PCB space

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, today announced the launch of the 871 Series Ultra-High Amperage SMD Fuse. This innovative new series supplements the 881 Series by offering 150A and 200A fuse ratings, a significant upgrade from the 881 Series’ 125A maximum rating. The 871 Fuse Series provides a single-fuse, surface-mounted solution for electronics designers, eliminating the need for parallel fusing configurations.

The 871 Series High-Current SMD Fuse is the first and only small-sized SMD fuse with ultra-high ratings of 150A and 200A, previously only available in much larger through-hole fuses. This advancement addresses the challenges of higher power requirements and limited fuse amperage ratings, offering a streamlined solution for modern electronic designs.

Product Features and Benefits:

• High Amperage Ratings: Available in 150A and 200A, meeting higher power requirements with a single fuse.
• Space-Saving Design: Provides a smaller-sized fuse solution, saving PCB space compared to larger through-hole legacy fuses.
• Simplified Design: Eliminates the need for parallel fusing, reducing the number of components and simplifying the bill of materials (BOM).
• Optimized Efficiency: Enables electronics engineers to optimize their designs for smaller, more space-efficient products.

“The 871 Series Fuse helps design teams simplify their processing and bill of materials by eliminating the need for two or more fuse components, reducing it down to just one fuse,” said Daniel Wang, Senior Director of Product Management. “Additionally, these SMD fuses save board space, allowing electronics engineers to optimize their designs further to be smaller and more space efficient.”

The 871 Series Fuse is ideally suited for high-power applications in various markets, including:

• Data Centers: Providing reliable protection for critical infrastructure.
• Network Infrastructure: Ensuring robust performance in demanding environments.

• Servers/Racks: Enhancing power management and efficiency in server and rack systems.

By offering a high amperage rating in a compact form factor, the 871 Series Fuse enables designers to meet their power requirements while reducing the number of components needed and the overall size of their end-product. This makes it an ideal solution for electronics engineers looking to simplify their designs and save valuable PCB space.

The post Littelfuse Launches Industry-First Ultra-High Amperage SMD Fuse Series appeared first on ELE Times.

Technology drives the development of new advancements in the automotive and electric vehicle industry. As the world is today witnessing and will witness the development of new technologies in the near-future, it shall lead to the improvement and further development in the product and design of the automotive and electric vehicle industry.

The following are few future technologies that shall lead the development of automotive and electric vehicle’s technologies:

First, OTA (over the air) charging of electric vehicles. The OTA (over the air) technology enables charging of an electric vehicle’s battery without any need for physical contact while recharging. However, this OTA technology is not available at a mass-scale today.

Hence, when the OTA (over the air) technology would be available on a mass-scale, it would lead to the development of many recharge stations in India. This would certainly increase the number of electric vehicles being used in our country. Besides, it would ease their mobility in India.

Second, solid state batteries. The lithium-ion batteries have led to a revolution in the electric vehicle segment. Traversing on the same trajectory, the future is expected to be even more revolutionary. It is so because more efficient solid-state batteries would be available on a large scale.

A solid-state battery is an electrical battery that uses solid electrolyte.

The benefit of using solid-state batteries are as follows:

First, it provides a much higher energy density than lithium-ion batteries.

Second, it provides higher vehicle range and a significant decrease in the time required to recharge the battery.

Third, grid of driverless cars. The future electric cars would be driven driverless. They would ply in a grid of driverless cars. They would be controlled with real time access to data pertaining to traffic, lane, GPS, and other parameters. The data pertaining to such parameters would be available on a real-time basis. Using these parameters, the automobile industry would be further developed.

These driverless cars have radar sensors, machine learning systems, and complex algorithms to safely operate and navigate the vehicle.

Fourth, augmented reality. Augmented reality (AR) is an interactive experience that blends digital information with the real world.

The cars that possess augmented reality (AR) technology, necessarily use a computer within the dashboard. This gives the driver real time information about a vehicle’s surroundings. For instance, speed, direction of movement, and video footage of the area adjacent to the vehicle.

Examples of car manufacturers that use augmented reality- BMW, Jaguar and Mazda use augmented reality in their models.

By 2025, the global automotive augmented reality and virtual reality is estimated to reach about $673 billion.

Fifth, heads-up display windshields. The heads-up display windshield technology projects images from a vehicle’s dashboard on the vehicle’s windshield. This helps the driver focus better on driving and be aware of all data from the dashboard by their projection on the windshield.

Sixth, connected cars. A connected car is a car that can communicate with the outside system. This enables it to share internet access and data with other devices, both inside and outside of the car.

For instance, use of GPS and 5G technology by a car.

Seventh, regenerative braking. This technology enables a car to store kinetic energy captured during deceleration and braking as electric energy within the battery of the car. It is later used to power the electric motor.

Eighth, mobility-as-a-service (MaaS). Mobility-as-a-Service (MaaS) means integration of all the modes of transport over a single interface. This provides end-to-end transportation solutions to users. As cities will become more modern in the future, MaaS is the only solution to the traffic woes.

Ninth, advanced driver assistance systems (ADAS). The advanced driver assistance systems (ADAS) makes the automobile capable of autonomous emergency braking, driver monitoring systems, lane departure warning, etc. This technology makes an automobile safer and reliant.

Tenth, 3D printing. 3D printing enables automotive parts manufacturers to produce complex parts with ease and much faster pace. Besides, the produced parts are light-weight. This makes the manufacturing process more efficient and economical than the traditional manufacturing process. Due to this, the spare parts would be available at a much cheaper rate and at a mass-scale.

Eleventh, smart grid solutions. A smart grid integrates information and communication technology with the electrical technology. It supplies power to consumer appliances through a smart network.

The following are a few benefits of smart grid solutions:

First, quicker restoration of electricity after power lapse.

Second, more efficient transmission of electricity.

Third, lowering of the cost of operation. Hence, the cost of power for consumers would be low. This provides an economic edge.

Fourth, reduction in peak demand.

Five, increase in the security of the electrical power generation system.

Twelfth, composite materials. Any substance that has been engineered by combining two or more distinct materials so that the engineered material has complementary properties. This means it has enhanced and unique characteristics. Hence, it is referred to as a composite material.

Few common examples of the composite materials are as follows:

First, carbon fibre-reinforced plastics,

Second, fiberglass-reinforced composites, and

Third, Kevlar-reinforced materials.

 

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is exhibiting at Industrial Transformation Asia Pacific (ITAP 2024, Booth 3C07) on 14-16 October.

The booth will showcase more than 10 demos from ST and its ecosystem partners in key industrial markets addressing edge AI use-cases for industrial automation and IoT segments, sensors for smart buildings and machinery condition monitoring, an innovative use case of NFC-powered Electronic Circuit Board, Motor Control & Servo Drives with IO Link, STM32 & Graphics solutions, wireless-connectivity solutions with Matter, and power-management solutions with STSPIN.

NFC-powered Electronic Circuit Board (ECB): The NFC-powered ECB is an innovative solution from Deng Kai Sdn Bhd that incorporates multiple ST components, including an ST25R NFC reader and an ST25DV dynamic tag, together with a low-power STM32G0 microcontroller (MCU) and an LDO voltage regulator. It integrates energy harvesting through NFC technology, a first in the industry, using an antenna to capture the electromagnetic energy from an active NFC reader and converting it into electrical power. This technology offers convenience, sustainability, and cost-effectiveness for designs with low power consumption, eliminating the need for batteries.

Multi-pose estimation AI demo: ST provides X-Linux-AI open-source software ecosystem free of charge to support multiple different edge AI use cases in industrial automation and IoT segments. The demo is built around ST’s 2nd-generation STM32MP2 microprocessor, which embeds secured and enhanced peripherals for connected applications.

Servo Drives Orchestra: This showstopper features a comprehensive motor-control demo comprising of 8 motor-control modules, which use 4 different reference designs with loads ranging from 500 W to 22 kW. Each of the motors controls a rope that pulls a load and demonstrates precision position control, in a harmonic movement coordinated simultaneously with the others. Each motor drive executes the commands sent by I/O link from the podium where an HMI interface allows to select the mode, and each of them collects temperature and vibration data, executes condition-monitoring algorithms, and wirelessly sends data to a Baidu cloud, which then informs back the system and its HMI to reflect how the systems behave and save power, among other things.

STSPIN for Motor Control: The EVSPIN32G4-DUAL is a demonstration board based on the STSPIN32G4 and STDRIVE101 for applications using two three-phase brushless motors. The STSPIN32G4 is a system-in-package integrating, in a 9×9 mm VFQFPN package, a triple high-performance half-bridge gate driver with a rich set of programmable features and one mixed-signal STM32G431 microcontroller. The STDRIVE101 is a triple half-bridge gate driver in a compact 4×4 VFQPN package featuring 600 mA current capability and embedded protection.

Sensors: ST’s latest AI sensor devices for orientation and gesture-tracking (the LSM6DSO16IS for consumer and the ISM330IS for industrial) feature the Intelligent Sensor Processing Unit (ISPU) with an embedded DSP programable core. Users can port C code into the ISPU, enabling essential functions like Fast Fourier Transform (FFT) and AI solutions with tiny neural networks. This technology enhances the ability to monitor conditions and gestures effectively. The new generation of IMU sensors (the LSM6DSV for consumer) and the ISM330BX for industrial) delivers embedded sensor fusion, which processes motion data from accelerometers, gyroscopes, and external magnetometers. This provides quaternion output to track the orientation of an object in 3D space. The sensor-fusion library is also available in the STM32 library list, enhancing predictive tracking and gesture capabilities.

STM32 for Industrial Applications:

A wide variety of STM32 solutions will be on display including:

• Graphics solutions: From high-performance STM32H7 MCUs based on the 32-bit Arm Cortex-M7 core and running at up to 600 MHz, to ultra-low-power STM32U5 series offering advanced power-saving devices to meet the most demanding power/performance requirements for smart applications, including wearables, HMI, personal medical devices, home automation, and industrial sensors.
• Sustainable technology: The STM32U0 is the latest addition to the STM32 ultra-low power device range: an energy-conscious microcontroller that can reduce power consumption by up to 50% compared to previous product generations. This enables less frequent battery replacements, minimizes the impact of discarded batteries, and allows more designs to go battery free, running solely from an energy-harvesting system such as a small photovoltaic cell.
• Wireless Connectivity: ST portfolio covers all Matter device types, for its seamless interaction between connected smart homes and smart building devices across different IP technologies. Based on the STM32WB0 microcontroller, the Electronic Shelf Label (ESL) demo shows how to improve operational efficiency.

Fireside chat

ST is participating in this year’s Industrial Transformation Forum to share how we are integrating AI in our manufacturing operations to make factories smarter, propelling manufacturing into a new era of efficiency, flexibility, and sustainability.

ST looks forward to contributing to important conversations and advancing the development of smart factories.

Date	Time		Panelist/Modrator
14 Oct15:55pm – 16:25pm			Moderator: Easwaran Subramanian, Partner, Asia Pacific Supply Chain Leader, India Speakers: Jamie Neo, Director of Quality & Product Engineering,HP Jean-Marc Philippe, IT Manufacturing Solutions, Global Front-End IT Operations Director, STMicroelectronics Joseph Rosing, Head GTM Scaling for Manufacturing, AWS

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• Infineon hosts first-ever Supplier Sustainability Summit to intensify collaboration for sustainable action and reduction of CO2 emissions in line with the Science Based Target initiative (SBTi)
• Infineon is working with more than 100 suppliers engaging them to define their own science-based targets and implement appropriate reduction measures
• Applied Materials Inc., Sumco Corporation, and iwis are recognized foroutstanding environmental advancements with Infineon’s Green Award

Infineon Technologies AG, is intensifying its collaboration with suppliers to further reduce CO2 emissions along the whole supply chain. Infineon hosted its first ever Supplier Sustainability Summit to further stimulate collaboration and incentivize and support suppliers to accelerate their decarbonization journeys. The virtual event brought together about 100 top semiconductor industry suppliers.

“In order to meet our ambitious targets, we need you, our suppliers,” said Elke Reichart, Member of the Board and Chief Digital and Sustainability Officer at Infineon, during her welcome message. “Infineon’s scope 3 emissions make up the lion’s share of our footprint, especially the materials we source from our suppliers. Therefore, we very much look forward to joining forces with you. Together, we can stimulate and implement decarbonization strategies even better.”

Collaboration with suppliers is a fundamental part of Infineon’s overall sustainability strategy. The company has already made significant progress on its way to reaching climate neutrality by 2030; since 2019 Infineon has halved its CO2 emissions (scope 1 and 2) while doubling revenue at the same time. In December 2023, Infineon added a commitment to setting a science-based target that includes the supply chain (scope 3). The procurement team is actively working with over 100 suppliers, engaging them to define their own science- based targets and implement appropriate reduction measures.

The Supplier Sustainability Summit was an excellent opportunity for Infineon to share learnings from its own climate strategy and journey and to facilitate exchange of best practices among suppliers. For instance, experts from the Infineon electricity procurement team gave insights from their hands-on experience in achieving 100 percent renewable electricity by 2025; whereas two suppliers shared their expertise in effectively setting science-based targets. The topic was deepened in a panel discussion with Infineon leaders and an expert from the CDP (formerly the Carbon Disclosure Project) that offered further practical advice to attendees.

Infineon’s Green Award recognizes and honors suppliers who demonstrated outstanding environmental commitment and advancements throughout the past year. The “Best Performance Award” went to Applied Materials Inc. for its ambitious climate strategy, including a 1.5°C science-based target and the company’s innovative “Xchange” program. As part of the program Infineon is directly collaborating with Applied Materials to increase resource efficiency and reduce emissions. The program enables take-back and refurbishment of spare parts for complex semiconductor equipment, thereby building on the circular economy to create environmental and business benefits for both parties.

The “Best Improvement Award” winner is Sumco Corporation, that has made remarkable progress in environmental sustainability throughout the past year. The Japan-based company is the first silicon wafer supplier to make a public commitment to setting a science- based target. Following discussions at the top leadership level, Sumco acted at an impressive speed, accelerating existing carbon reduction targets and expanding renewable electricity sourcing.

In the category of companies with less than one billion euros revenue, the “Best Improvement Award” went to iwis SE & Co. KG. The Munich-based, family-owned company serves as a great example to many with its ambitious “Zero Carbon 2040 program” and science-based target commitment. Infineon recognizes the proactive approach towards improving the environmental impact of operations and supply chain and the integration of climate targets in the environmental management system at the sites.

“We would like to applaud the winners of our Green Awards: Applied Materials, Sumco and iwis for stepping up and taking responsibility for environmental sustainability and performance,” said Angelique van der Burg, Chief Procurement Officer at Infineon and host of the day. “We believe that this performance will motivate our whole supplier base to raise the bar higher and follow their example. Now let’s make the best practice a standard practice.”

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“As chips are pervading all segments of human life, owing to the possibility of chip-backdoors, the threats of espionage, sabotage, and the concerns to national security are haunting all of humanity”.

The threat of chip-based backdoors is raising eyebrows across the globe. Today, since chips are an integral and inevitable component of any electronic device, presence of any chip-backdoor shall have widespread consequences. Both in its expanse across the countries and myriad sectors.

Given the pervading nature of chips in electronic systems, the gravity and the extent of the problem of chip-backdoors can only be speculated. Indeed, any such speculation is alarming!

It is so because the presence of any chip-based backdoor has the potential threat of granting clandestine access to information about the functioning of any electronic system. Whether it be data centres, servers, devices used in complex and critical installations such as a nuclear-reactors, space-faring vehicles, communication devices, military assets such as warships, fighter jets, etc. No such system is immune from this looming threat.

As chips are now being used for many applications that are essential and critical for national security, any chip-backdoor is a threat to any country’s national security. It is not only an infringement of right to privacy, but also poses a grave threat to the security of all devices used by humanity in this digital age.

No wonder the threat of chip-backdoor is sending shivers down the spine of the scientific community and senior military officials!

Meaning of chip backdoor

A backdoor provides clandestine and unauthorised access to a system. It does so by bypassing the legitimate authentication to access a system.

Similarly, a chip-backdoor provides a backdoor to an electronic system by means of a semi-conductor chip. It is a subset of hardware backdoor, which provides backdoor to any hardware.

If a chip-backdoor succeeds in providing backdoor access to a chip in an electronic system, it further enables unauthorised control over the system. It can even maim or cripple a system. If it so happens, it will endanger the performance of any electronic system. Hence, it may render any system’s performance at risk.

Major effects of chip-backdoors on a system

Since a chip-backdoor provides unauthorized access to a system, it gives rise to three major effects on a system. They are as follows:

First, the collection of data about the performance of a system. This data can be processed and analysed to draw inferences about the functioning of a system.

Second, spying and surveillance on the system.

Third, the threat of sabotage to the entire system. This may cripple or maim any essential and critical system in the hour of the utmost need. Hence, it has a high capability to compromise the credibility and safety of any system in emergency situations such as a war, natural calamity, etc.

How can a chip-backdoor be introduced in a chip?

If any chip, maliciously designed or fabricated and capable of providing a backdoor, is inserted in an electronic system, it provides a chip-backdoor.

A chip-backdoor can be introduced in a chip at any of the three stages of the production of a chip. They are as follows:

First, the design stage. In this stage, chip-backdoor can be introduced by the use of third-party IP cores and the electronic design automation (EDA) tools.

Second, the fabrication stage. In this stage, chip-backdoor can be introduced by making malicious modifications to photomasks, doping processes and metal interconnects.

Third, the ATMP (assembly, testing, marking, and packaging) stage. In this stage, chip-backdoor can be introduced by making alterations to chip packaging and printed circuit board.

Why is it difficult to detect a chip-backdoor?

Most important reasons that make detection of chip-backdoor difficult are as follows:

First, few chip-backdoors may be so well designed that it is difficult to detect them by all methods.

Second, few chip-backdoors may disguise as accidental vulnerability. Hence, they may evade detection.

Third, it is a herculean task to scan the entire system for a single or a few backdoor capable chips.

Reported cases of chip-backdoor

Due to the possibility of introducing backdoor at every stage of the production of a chip, there exists numerous possibilities of chip-backdoors. Despite this, there exists no concrete evidence about it.

Even though few cases have been reported in the past, the private companies involved in the production of such questionable chips have vehemently denied any such allegations.

Few such reported cases are as follows:

First, researchers from the University of Cambridge discovered a backdoor in the Actel/ Microsemi ProASIC3 chip. It was being used in sensitive industrial and military applications. They used a technique called Pipeline Emission Analysis (PEA) to detect this backdoor.

Second, in 2018, Bloomberg reported that very small malicious chips were found on Supermicro server motherboards. This backdoor was allegedly being used for spying.

Third, in June, 2024, in an interview to www.moneycontrol.com, HCL’s co-founder, Mr. Ajai Choudhary, alleged that many Chinese chips in a whole range of products have backdoors.

What counter-measures have been developed so far?

Only few counter-measures have been developed so far to detect chip-backdoor. They are as follows:

First, as per a report from the Business Insider published in May, 2012, Mr. Skorobogatov, a researcher from the University of Cambridge, developed a method to detect malicious chips in a system.

Second, as per a report from the TechRepublic published in 2016, researchers from the New York University developed a method to detect a chip’s operation by means of verifiable computing.

Third, as per a report published in the IEEE Spectrum in 2019, researchers from the University of Southern California and Paul Scherrer Institute developed the Ptychographic X-ray laminography. This technique enables verification of the blueprint of chips and their design without even minutely interfering with the chip or its functioning.

Concerns about the looming threat of chip backdoor

The mounting concerns about the looming threat of chip-backdoor steams from many factors. Few of them are as enumerated below:

First, as chips pervade all electronic systems, the possibility of the presence of backdoor in any critical installation becomes very high. It is only possible if the chip is capable of a backdoor, though.

Second, since the production of chip across all the stages of its production today spans across many locations and vendors, it is a herculean task to identify the exact coordinates of the origin of a chip-backdoor.

Third, any component of an electronic system that has the potential of activating a chip-backdoor has the potential to stay dormant for a considerable time. It gets triggered only when specific requisite conditions arise. These conditions make the chip-backdoor functional from that instant of time when such specific requisite conditions are met.

Fourth, the expenditure incurred in scanning for a backdoor-capable chip in a system is so high that it is not at all an economical option to opt for. As the deciding factor in today’s global market is the most competitive cost of production, the economic cost of production trumps all other factors.

The way forward

One method to evade the threat of chip-backdoor is to use only chips produced indigenously and by the most trusted source for all essential and critical applications involved in national security.

Besides, the scientific community of all countries has to come together to develop the most efficient and cost-effective method to detect a chip-backdoor in any system. It is sine qua non to ensure the safety and security of all of humanity in this digital age. It is a must do thing. And, it must be accomplished at the earliest.

 

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