ELE Times

STM32MP13 MPUs tackle applications that challenge traditional embedded microcontrollers, combining extra performance, security-rich architecture, and energy efficiency in new cost-conscious, single-core devices.

STMicroelectronics is enabling the next generation of smart devices for secure, safe, and sustainable living with its latest STM32 microprocessors (MPUs).

Energy savings, lower operating costs, improved safety and enhanced user experience are the main trends observed in Smart Buildings, Factory automation and smart cities. The latest applications such as industrial automation, communication gateways, payment terminals, appliances, and control panels serving these trends are demanding processors with high software-execution capability, low power consumption, strengthened security, and advanced feature integration.

ST is meeting these expectations with new MPUs that build on the microcontroller (MCU) knowhow and extensive development ecosystem of its STM32 family and is now extending this product family with the new STM32MP13 MPUs, now in mass production. They are the most affordable STM32 MPUs yet and further expand the choices available to product developers. The new microprocessors also support the latest security features for protecting connected assets.

“Our STM32MP13 single-core MPUs deliver a perfect balance of power consumption, price, and increased capability for applications that demand performance above that of typical high-end embedded microcontrollers,” said Ricardo De Sa Earp, Executive Vice-President General-Purpose Microcontrollers Sub-Group, STMicroelectronics. “With their state-of-the-art security features, these devices accelerate end-product certification according to today’s leading standards including SESIP Level 3 and Payment Card Industry (PCI) PTS/POI 6.0 specifications.”

As a lead customer for ST’s STM32 MPUs, HID is incorporating the STM32MP13 into a new critical design for one of its key access control products. “Key advantages we recognize in this new offering include its performance, power and efficiency, its ability to enable all possible powerful cybersecurity attributes and functions such as its crypto engine and secure boot, and its ability to meet some of our demanding peripheral requirements,” explained Damon Dageenakis, PACS Director for Access Control Devices at HID.

The new MPUs have a 1GHz Arm® Cortex®-A7 application-processing core, combined with integrated peripherals and power-saving innovations proven in STM32 MCUs. The STM32MP13 ensures a high level of security for connected assets using cryptographic acceleration with SCA robustness/protection, tamper resistance, secure storage, and Arm TrustZone® technology with Trusted Firmware (TF-A and OP-TEE) secure processing environments. Peripheral features include a pair of Gigabit Ethernet ports that ease integration in industrial equipment like programmable logic controllers (PLCs).

Development tools and software are common between the STM32MP13 and STM32MP15. They include the fully mainlined OpenSTLinux Distribution with Linux board support package (BSP), drivers, secure bootchain supported by secure manufacturing, and popular application frameworks. Helping accelerate time to market and save development costs, OpenSTLinux Distribution ensures seamless software migration and scalability. It can even be extended with Linux real time capabilities, thanks to the new X-LINUX-RT expansion package, available for all STM32MP13 and STM32MP15 devices.

Further technical information
In addition to bridging the embedded MCU and application-processor worlds, the STM32MP13 MPUs are built around a comprehensive set of tools, leveraging the strong MCU ecosystem.

The STM32MP13 is well suited to use with the Qt graphics framework for fast and responsive development of sophisticated user interfaces. Users can take advantage of powerful tools, optimized libraries, and easy porting of code from STM32 MCU projects, which result from extensive cooperation between ST and Qt as an ST Authorized Partner.

“The new SMT32MP13 strengthens Qt’s support for cost-efficient MPUs, especially in industrial and security-related use cases. By using Qt’s cross-platform development and testing tools and deploying the applications on ST’s MCUs and MPUs, development teams can significantly improve their productivity”, said Marko Kaasila, Senior Vice President, Product Management at Qt Group. “The approach is exceptionally scalable, as Qt allows teams to create consistent user experiences across devices, from MCUs to MPUs, with the same codebase.”

While gaining the extra processing performance of an MPU, combined with the flexible power management, real-time OS (RTOS) support, and integrated security features and peripherals typically provided by embedded MCUs, STM32MP13 users also benefit from advantages such as a large selection of package options that help optimize cost and flexibility, and allow low-cost PCB designs down to four layers without costly laser vias. ST further eases designers’ workload by providing PCB layout examples.

Also available, STPMIC1 dedicated power-management ICs (PMIC) for STM32 MPUs help developers optimize power consumption to achieve superior energy ratings and maximize the runtime of battery-powered applications. Compared to bringing up a custom solution with discrete components, the ST PMICs also save bill-of-materials costs, engineering effort, and PCB footprint.

The STM32MP13 MPUs include the STM32MP131, STM32MP133, and STM32MP135. They are in full production, priced from $3.16 for orders of 10,000 pieces. Other pricing options are available. Samples and Boards are available through your preferred distributor.

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Renesas Electronics announced the expansion of its 32-bit RA family of microcontrollers (MCUs) with two new Groups based on the Arm Cortex-M33 core with Arm TrustZone technology. The new 100-MHz RA4E2 Group and 200-MHz RA6E2 Group are optimized to provide best-in-class power efficiency without compromising performance. With 128 Kbyte and 256 Kbyte flash options and 40 Kbytes of SRAM, the new groups integrate abundant connectivity options such as on-chip CAN FD, USB, QSPI, SSI and I3C interfaces and offer an easy upgrade path to other members of the RA Family. They are ideal for applications requiring high performance in small packages such as sensing, gaming, wearables and appliances.

The RA4E2 and the RA6E2 are the most cost-effective members of the RA family with integrated CAN FD, and are available with small package options including a space saving 4 x 4 mm 36-pin BGA and a 5 x 5 mm 32-pin QFN to satisfy the needs of cost-sensitive and space-constrained applications. In addition, the low power consumption of the new devices saves energy, enabling end products to contribute to a greener environment.

All RA devices are supported by the Renesas Flexible Software Package (FSP) that includes highly efficient drivers and middleware to ease the implementation of communications and improve functionality of peripherals. The FSP’s GUI simplifies and accelerates the development process. It enables flexible use of legacy code as well as easy compatibility and scalability with other RA family devices. Designers using FSP also have access to the full Arm ecosystem as well as Renesas’ extensive partner network, offering a wide range of tools that help speed time-to-market.

“Our RA Family continues to exceed expectations by delivering market-leading performance, features, ease-of-design and value,” said Roger Wendelken, Senior Vice President in the IoT and Infrastructure Business Unit at Renesas. “The new RA4E2 and RA6E2 Groups are exceptional examples of why many customers have adopted the RA family as their MCU family of choice. We’re confident that these parts will hit the sweet spot for a wide range of applications, and that many designers will look to the RA family for future designs as well.”

“Over 90% of processors shipped are microcontrollers. The applications that use these MCUs are exceptionally varied1,” said Tom Hackenberg, Principal Market and Technology Analyst for Computing and Software at the Yole Group. “By continuing to expand its RA offerings, Renesas can address more customers in more markets with optimized parts for this wide range of specific applications.”

RA4E2 MCU Group

The RA4E2 Group includes five different options, spanning from 32-pin to 64-pin packages as small as 4 x 4mm, and 128kB of flash memory along with 40kB of SRAM. The RA4E2 devices offer excellent active power consumption, using 82 µA / MHz while executing from Flash at 100 MHz. They have an extended operating temperature range of -40/105°C. The RA4E2 Group is ideal for cost-sensitive applications and other systems requiring an optimal combination of performance, low power consumption and small package size.

Key Features of the RA4E2 Group

• 100 MHz Arm Cortex-M33 CPU core
• Integrated flash memory of 128kB; 40kB RAM
• Support for wide temperature range: Ta = -40/105°C
• Package options from 32- to 64-pin
• Low power operation: 82 µA / MHz in active mode while executing at 100 MHz
• Integrated communications options including USB 2.0 Full-Speed Device, SCI, SPI, I3C, HDMI CEC, SSI, and CAN FD
• System costs reduction with internal oscillator, abundant GPIO, advanced analog, low-voltage detection and internal reset function

RA6E2 MCU Group

The RA6E2 Group MCUs deliver 200 MHz performance. The group includes 10 different parts, spanning from 32-pin to 64-pin packages as small as 4mm x 4mm, and from 128kB to 256kB of flash memory along with 40kB of SRAM. The RA6E2 devices offer exceptional power consumption specifications, and extensive peripherals and connectivity options, delivering a unique combination of performance and features.

Key Features of the RA6E2 Group

• 200 MHz Arm Cortex-M33 CPU core
• Integrated flash memory options from 128kB to 256kB; and 40kB RAM
• Package options from 32- to 64-pin
• Low power operation: 80 µA / MHz in active mode while executing at 200 MHz
• Integrated communications options including USB 2.0 Full-Speed Device, SCI, SPI, I3C, HDMI CEC, SSI, QSPI, and CAN FD
• Integrated timer
• Advanced Analog

Winning Combinations

Renesas has designed a full Add-on Voice User Interface (VUI) Solution using the RA6E2 MCU and other compatible devices from the Renesas portfolio. This solution is modular and can easily be added to any application needing a Voice User Interface, such as smart thermostats or appliances. The RA6E2 MCU handles all tasks without burdening the host MCU. This is just one of Renesas’ many Winning Combinations, which are technically vetted, full system architectures, optimized to reduce design risk. Renesas offers more than 300 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and quickly bring their products to market.

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Vicor Corporation interviews OLogic, a full-service robotics design and development group, on the Vicor Powering Innovation podcast. OLogic helps design a wide variety of robotics and consumer products, as well as commercial electronic devices.  Located in the Silicon Valley area, they are the premier robotics design consultants, helping world-class brands and many of today’s most innovative robotic start-up companies accelerate time-to-market.

Podcast host, Robert Gendron, Vicor Corporate Vice President of Product Development, talks with Ted Larson, CEO of OLogic, to learn more about how the one-stop shop design and engineering company is spinning ideas into robotic products, with a particular focus on building mobile robots.

Larson shares how OLogic got started. “Hasbro became our first consulting customer,” said Larson reflecting on OLogic’s early days. “We worked on many, many projects for them over the years.  And then we branched out into other consumer electronic and toy types, which eventually led to larger and larger robots… and now a lot of mobile robots.”

“OLogic is a real innovator in their space, providing a tremendous service for companies that have  creative new ideas to bring to market,” said Gendron. “Ted explains how power density and state-of-the-art power conversion technology has simplified how he builds his power systems. OLogic’s expertise is really bringing one-time science fiction concepts into reality.”

The Vicor Powering Innovation podcast is available with new episodes released monthly. Listeners can expect to learn about today’s toughest power challenges, new ideas in electrification, creative power architectures and real-life power design challenges.

The Vicor Powering Innovation podcast is available to download from all major podcast providers, including Spotify, Apple Music and Google Podcasts.

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The global automotive electronics market size is expected to reach USD 144.19 billion by 2026, exhibiting a CAGR of 6.1% during the forecast period. The market size stood at USD 91.06 billion in 2018. The growing technological advancement in automotive for enhanced safety, entertainment and comfort features will contribute positively to the automotive electronics market growth during the forecast period.

Moreover, the integration of Internet of Things (IoT), artificial intelligence, and cloud computing in automobiles will spur opportunities for the automotive electronics revenue in the forthcoming years, mentioned in a report, titled “Automotive Electronics Market Size, Share & Industry Analysis, By Application Type (Advanced Driver Assistance System [ADAS], Body Electronics, Power Electronics, and Infotainment), By Vehicle Type (Passenger Car, Light Commercial Vehicle, Heavy Commercial Vehicle, and Electric Vehicle) and Regional Forecasts, 2019-2026”.

In July 2021, Magna International Inc. and Veoneer announced that they had entered a merger agreement under which Magna will acquire Veoneer. The company will be combined with Magna’s ADAS business and its electronics operating units.

Market Drivers:

The shift from conventional cars to electric vehicles will subsequently aid the development of the market. The preference towards electric vehicles owing to its capabilities such as high battery life, energy-efficient, advanced electronic systems, zero direct carbon emission. The companies operating in the market are investing vastly in the development of high-end hybrid cars.

The growing government regulations to curb carbon emissions will positively promote the automotive electronics market share. Also, the consumer inclination towards electric vehicles equipped with parking assistance, head-up display, and powerful infotainment system will bolster the healthy growth of the market during the forecast period.

Market Restraints:

High-Price of Electronic Systems to Diminish Business Potential

The high production cost of electric vehicles will simultaneously escalate the overall cost of hybrid cars, which, in turn, will hamper the growth of the market during the forecast period. The rising popularity of electric vehicles (EV) has led to the development of advanced driver assistance systems (ADAS) and infotainment systems. The massive investment in R&D activities by companies along with the high cost of lithium-ion batteries and software used in vehicles will consequently surge the manufacturing cost, thus, leading to costly EVs. Besides, the complexities of electric vehicles and high maintenance and replacement cost will dampen the automotive electronics market trends.

Regional Insights:

Presence of Major Automotive Giants to Augment Growth in Europe

Asia Pacific generated a revenue of USD 43.49 in 2018 and is predicted to grow profoundly during the forecast period owing to the flourishing automobile industry. The presence of various automotive manufacturers in India, China and Japan will aid the expansion of the market in Asia Pacific. The rising production capabilities of manufacturing facilities will propel the growth of the market in the forthcoming years. The increasing awareness about the advantages of EVs will contribute positively to the automotive electronics market growth. Europe is predicted to expand radically in the foreseeable future owing to the existence of automobile giants such as Volkswagen, Skoda, Audi, BMW, Daimler. In addition, the rising focus of the European government to curb carbon emissions and ensure safety features in every vehicle will encourage the healthy growth of the market during the forecast period.

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Mouser Electronics provides a wealth of services and tools to help engineers and purchasing professionals find the right products for their designs, including a resource site for development kits and a page devoted to the latest engineering tools. The development kits resource site includes many articles, videos, and how-to guides, connecting engineers directly with the products and know-how necessary for developing new products. The engineering tools page offers an up-to-the-minute collection of new evaluation kits, reference designs, and more, allowing engineers to discover the latest products from leading manufacturers.

Mouser’s development kit resource site offers a diverse collection of resources to inform the development of applications ranging from Internet of Things (IoT) devices to Bluetooth mesh networks to wearable medical devices. The robust site also includes articles addressing challenges and use cases for specific components, such as home automation using the Microchip Technology SAM E51 Integrated Graphics and Touch (IGaT) Curiosity evaluation kit or device monitoring using the Arduino Portenta H7 development board. The resource site also includes convenient product information for a variety of evaluation boards and development kits, allowing engineers to find components for their new designs easily.

The engineering tools page features a constantly updating list of new tools for evaluating semiconductors and other electronic components. With tools for embedded processors, RF wireless, sensors, and more, the rolling catalog makes it possible for engineers to find the newest solution to their complex design challenges.

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Renesas Electronics announced that it will present the first live demonstrations of artificial intelligence (AI) and machine learning (ML) implementations on an MCU based on the Arm Cortex-M85 processor. The demos will show the performance uplift in AI/ML applications made possible by the new Cortex-M85 core and Arm’s Helium technology.

Renesas became the first company to demonstrate working silicon based on the Arm Cortex-M85 processor. This year, Renesas is extending its leadership by showcasing the features of the new processor in demanding AI use cases. The first demonstration showcases a people detection application developed in collaboration with Plumerai, a leader in Vision AI, that identifies and tracks persons in the camera frame in varying lighting and environmental conditions. The compact and efficient TinyML models used in this application lead to low-cost and lower power AI solutions for a wide range of IoT implementations. The second demo showcases a motor control predictive maintenance use case with an AI-based unbalanced load detection application using Tensorflow Lite for Microcontrollers with CMSIS-NN.

Delivering over 6 CoreMark/MHz, Cortex-M85 enables demanding IoT use cases that require the highest compute performance and DSP or ML capability, realized on a single, simple-to-program Cortex-M processor. The Arm Cortex-M85 processor features Helium technology, Arm’s M-Profile Vector Extension, available as part of the Armv8.1M architecture. It delivers a significant performance uplift for machine learning (ML) and digital signal processing (DSP) applications, accelerating compute-intensive applications such as endpoint AI. Both demos will showcase the performance uplift made possible by the application of this technology in AI use cases. Cortex-M hallmarks such as deterministic operation, short interrupt response time, and state-of-the-art low-power support are uncompromised on Cortex-M85.

“We’re proud to again lead the industry in implementing the powerful new Arm Cortex-M85 processor with Helium technology,” said Roger Wendelken, Senior Vice President in Renesas’ IoT and Infrastructure Business Unit. “By showcasing the performance of AI on the new processor, we are highlighting technical advantages of the new platform and at the same time demonstrating Renesas’ strengths in providing solutions for emerging applications with our innovative ecosystem partners.”

“We’re excited to take part in this ground-breaking demonstration,” said Roeland Nusselder, CEO of Plumerai. “Arm’s Helium technology supported on the new RA MCUs with the Cortex-M85 core significantly accelerates the Plumerai inference engine. This performance uplift will enable our customers to use larger and more accurate versions of Plumerai’s People Detection AI, add additional product features, and extend battery life. Our customers have an insatiable appetite for adding new and more accurate AI features that run on a microcontroller. Together with Renesas, we are the first to fulfill this demand.”

Renesas will implement the new Arm processor within its RA (Renesas Advanced) Family of MCUs. Renesas has quickly become a leader in the Arm MCU market, offering a feature rich family of over 250 different MCUs. Renesas has developed a robust ecosystem of partners providing customers with comprehensive solutions for IoT, AI/ML, industrial automation, medical, building automation, home appliance and multiple other applications.

The new Cortex-M85 core supports Arm TrustZone technology for protection of secure assets. Combined with TrustZone, Renesas’ integrated cryptographic engine, immutable storage, key management, and tamper protection against DPA/SPA side-channel attacks will provide a comprehensive and fully integrated secure element functionality. The Armv8-M architecture also brings Pointer Authentication/Branch Target Identification (PAC/BTI) security extension, a new architectural feature that provides enhanced mitigation from software attack threats and helps achieve PSA Certified Level 2 certification.

The new RA MCUs based on the Cortex-M85 core will be supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and graphics solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA devices.

Winning Combinations

Renesas will combine the new RA MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 300 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.

Renesas MCU Leadership

A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, and is the industry’s No. 1 supplier of both 16- and 32-bit MCUs, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 200 ecosystem partners.

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Pushed by safety regulations, the adoption of ADAS is increasing rapidly – and this is driving multiple sensor adoption. The new Computing and AI for Automotive 2023 report covers processors for ADAS cameras, radars, LiDARs, and in-cabin sensing, as well as processors for ADAS domain controllers. Processors dedicated to the cockpit, including the in-vehicle infotainment main unit, instrument cluster, and telematics, are also discussed.

According to Adrien Sanchez, Technology & Market Analyst, Computing & Software, within the Semiconductor, Memory & Computing division at Yole Intelligence, part of Yole Group: “Car architecture evolution is strongly impacting the processor market, in terms of both units and revenue. Even though automotive industry cycles are rather slow compared to other market segments such as consumer, centralization is expected to progress significantly in the next years”.

Indeed, as Yole Intelligence’s analysts affirm, this evolution has a strong impact on processor units and revenue, as well as on changing technology requirements and processor class breakdown. The software-defined vehicle is another key trend impacting automotive processors, as it is impacting hardware and software roadmaps with new requirements that are challenging traditional automotive companies.

In this context, Yole Intelligence releases its Computing report, Computing and AI for Automotive 2023. With this report, the company, part of Yole Group, gives an overview of computing for safety, ADAS & AD, in-cabin sensing, cockpit, and connectivity. It also provides a scenario for AI within the dynamics of the autonomous automotive market and presents an understanding of AI’s impact on the semiconductor industry.

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Mouser Electronics, is now stocking the Dynamic D8000 pluggable connectors from TE Connectivity. The Dynamic D8000 pluggable connectors feature high current capacity, including 1000 VDC rated voltage, 3000 VAC withstand voltage, and 100 A current per pin. These reliable, high-performance connectors support a range of applications, including battery management systems, battery test equipment, factory automation and robotics.

The TE Connectivity Dynamic D8000 Pluggable Connectors are available as both wire-to-wire (WTW) and wire-to-board (WTB) modules with two-position construction. The pluggable connectors employ an audible lock design to ensure safe and reliable locking, while crimping contacts save valuable assembly time for device designers.

Boasting 58 N per-pin mating and unmating forces, the Dynamic D8000 Pluggable Connectors feature silver plating on the mating surface with a polybutylene terephthalate (PBT) and high-temperature nylon housing. The robust connectors also offer >98 N contact retention force in the housing. TE Connectivity’s Dynamic Series is both vibration and shock proven, ensuring an extended service life.

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STMicroelectronics has introduced the ST-ONEHP integrated digital controller, the  world’s first IC certified by USB-IF according to the USB Power Delivery Extended Power Range (USB PD 3.1 EPR) specification.

As the third controller in the ST-ONE family, the ST-ONEHP has 28V output capability to simplify building chargers and power adapters rated up to 140W. Sharing the ST-ONE architecture, the converter is a non-complementary active-clamp-flyback zero-voltage-switching (ZVS) topology that ensures superior efficiency at high power output and switching frequency. Essential features including secondary regulation and the USB PD communication interface are integrated, saving bill-of-materials costs as well as PCB size and complexity. Built-in synchronous rectification helps maximize efficiency and reinforced galvanic isolation permits a solution that is both compact and safe.

Inside the ST-ONEHP, an Arm Cortex-M0+ microcontroller maintains overall control. The MCU is supplied pre-loaded with certified USB PD firmware, which eases end-product approval to qualify for the USB logo. With 64KByte of flash storage, the MCU provides room for customizing the power-conversion firmware.

The ST-ONEHP is well suited to use with ST’s MasterGaN single chip, integrating the Company’s third-generation gallium nitride (GaN) power transistors and optimized gate drivers. The SiP ease the adoption of GaN technology in energy-conscious applications to realize benefits including superior thermal performance and switching efficiency compared to conventional silicon transistors.

Complementing the properties of the ST-ONE converter, MasterGaN helps maximize performance and allows high switching frequencies that permit smaller passive components. By combining the ST-ONEHP controller and a 9mm x 9mm MasterGaN1 half-bridge device, ST has produced the EVLONE140W reference design smaller than a standard 65W laptop charger.

Its volume of 90cm3 equates to industry-leading power density of 25W/in3, while the peak efficiency reaches beyond 94%. From an environmental perspective, the charger can use just a quarter of the plastics and is 2% more efficient than average chargers. Using these products in all chargers produced worldwide would save 3.5 million tons of CO2 emissions.

Samples of the ST-ONEHP are already available for selected customers in a SSOP36 leaded package, priced from $3.90 for orders of 1000 pieces.

For further information please go to www.st.com/st-onehp

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India and the US signed a pact on setting up a semiconductor supply chain and innovation partnership, and established a semiconductor sub-committee under the framework of the India-US Commercial Dialogue, revived after three years.

The sub-committee will be led by the US’s Department of Commerce and, on the Indian side, the Ministry of Electronics and Information Technology (MeitY) and the Ministry of Commerce and Industry. The first engagement of the sub-committee is expected to take place before the end of 2023.

“Recognising the importance of US and Indian markets to the global electronics industry, Secretary (Gina) Raimondo and Minister (Piyush) Goyal intend to utilise the Commercial Dialogue to enhance public and private efforts to promote industry cooperation in the semiconductor sector. These efforts will identify opportunities for growth and challenges to address in order to ensure that US and Indian semiconductor industries develop stronger connections, complementary ecosystems, and a more diverse supply chain for semiconductors,” according to a joint statement.

Cooperation on semiconductors comes against the backdrop of the shortage of such chips, which had serious consequences such as supply disruption in automobile and electronics in both countries, particularly after the outbreak of Covid-19.

“The US would like to see India achieve its aspirations to play a larger role in the electronic supply chain. And the MoU (memorandum of understanding) we signed is designed to help achieve that goal. We’ve already begun action on the MoU, tasking both the Indian and American semiconductor industries to prepare an assessment of where they have gaps and lack of resilience in the supply chain and that will guide our work,” US Commerce Secretary Gina Raimondo told reporters in a joint briefing.

Co-chaired by Commerce and Industry Minister Piyush Goyal and Raimondo, the Commercial Dialogue is part of ongoing efforts to strengthen the US-India Comprehensive Global Strategic Partnership.

Goyal and Raimondo confirmed their intention to convene before the end of 2023 a mid-year review of the Commercial Dialogue, which will be led by senior government officials from both sides.

The key theme of the dialogue focused on resilient and secure supply chains; facilitating climate and clean technology cooperation; inclusive digital growth; talent development, including skilling; post-pandemic economic recovery, especially for micro, small, and medium enterprises and start-ups; and focus on cooperation on quality standards.

Raimondo led a high-level business delegation of American chief executive officers (CEOs) for the India-US CEO Forum, aiming to focus on shared strategic priorities on both sides.

Goyal said both countries launched the Standards and Conformance Cooperation Program, which would be carried out by the US’s American National Standard Institute and India’s Bureau of Indian Standards.

“India has recognised that we have to be quality suppliers and consumers in goods and services. We offer a large marketplace, and can capitalise on economies of scale to meet India’s and the world’s needs. We need to align in terms of international standards,” Goyal said.

The joint statement further said that both sides intended to continue engaging on cross-border data flows and other relevant issues, including in appropriate multilateral forums.

“Both ministers also expressed interest in working together in developing next-generation standards in telecommunications, including 6G. They anticipate efforts to include cooperation between relevant government agencies, standards organisations, and industry bodies. Both sides intend to further work together in validation and deployment of trusted and secure next-generation telecom network equipment, including Open RAN, as well as in subsequent generations of telecommunications infrastructure,” it said.

The US is also the third-biggest source of foreign direct investment for India, and is one of the top five investment destinations for India.

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India has the opportunity to become a part of the entire electronics supply chain and not just semi-conductors, the US commerce secretary said.

“India’s desire to expand advanced manufacturing and its presence in the supply chains is totally aligned with the United States’ desire and goal to make our supply chain more resilient,” Gina Raimondo told.

“There’s opportunity in the entire electronics supply chain, not just semiconductors but the entire electronics supply chain. And, we had discussions about that today, that would include green technologies, all kind of hardware in the electronic supply chain.”

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Deliberations held on six thematic areas namely ‘Transforming the lives of common citizens’, ‘Alignment of ongoing initiatives for next 5 years’, ‘Addressing emerging challenges’, ‘New digital subjects to be included in college curriculum’, ‘Regulatory support for growth of Startup and manufacturing ecosystem’, and, ‘Securing computers in government offices from Cyber vulnerability’

Officers from Ministry of Electronics & Information Technology & different organizations took part in a day-long Chintan Shivir at Sushma Swaraj Bhawan in New Delhi. The conext setting of the programme was done by Shri Alkesh Kumar Sharma, Secretary, MeitY and the event was addressed by Hon’ble Minister of Electronics and IT, Communications, Ashwini Vaishnaw. Senior Officers from the Ministry and Head of organizations also participated in the Shivir.

More than 200 officers participated from Ministry, its organizations and field offices in the Shivir. It broadly discussed six topics threadbare. These were: (1). How MeitY can contribute in transforming lives of all strata of society, especially deprived section? (2). How ongoing programmes, schemes & projects should be aligned to needs in coming days? (3). What steps could be taken to address challenges like addiction of online games, financial losses due to crypto currency, fake news in social media, access of unethical content to children? (4). Which new subjects should be included in college curriculum? (5) Constraints/barriers in regulations that are limiting growth of Startup & manufacturing ecosystem and (6) Steps to be taken for securing computers in Govt. offices from Cyber vulnerability.

The suggestions given by participants were appreciated by the Minister and motivated the officers to think out of box and ahead for time for usage of technology to ease the living of common man of the country. He emphasized that schemes and projects should be reviewed for their higher effectiveness and relevance with the goals of the ministry.

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Chief Minister Basavaraj Bommai said Bengaluru will emerge as the financial capital of the country in the next five to ten years and added that there are no impediments to realise this potential.

Minister for IT-BT, Science and Technology, Dr C N Aswath Narayan said various electronics companies involving a big ticket investment of Rs 36,804 crore have evinced interest in putting up their production units in various parts of Karnataka state.
At the 25th edition of the Bengaluru Tech Summit 2022, he said the government has set an ambitious target of achieving a target of $300 billion in IT and BT exports by 2025 from the present $135 billion.

He said Karnataka state is emerging as a hub for semiconductor and chip design. He said the state had attracted investments worth Rs 22,900 crore in the semiconductor industry. ISMC Analog Fab has already issued an expression of interest in opening shop in the state. Besides, companies like Exide, Hitachi and Bosch among others have also submitted their investment proposals which have been approved.
Dr Aswath Narayan said the government of Karnataka has laid impetus on improving the quality of higher education and development of skills with a view to providing employment opportunities and quality manpower to the entrepreneurs.

The Minister said the government is encouraging the setting up of clusters beyond Bengaluru to achieve balance and stability in the ecosystem.
Dr Aswath Narayan said Karnataka has a conducive environment for establishing IT, BT, start-ups and ESDM zones. He said Karnataka has more than 22,000 start-ups, a majority of which are in deep tech and artificial intelligence sectors contributing a lion’s share to the digital economy of the state.

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Fully Tested Solutions Showcase Entire Renesas Portfolio; Address EV Charging, Vehicle Cluster Control and Other Applications

Renesas Electronics Corporation announced that it has introduced 10 new Winning Combinations that combine a broad range of products from Renesas entire portfolio, including both automotive and non-automotive parts. The new solutions address multiple applications for electric vehicle (EV) charging, instrument cluster control and low-voltage inverter functionality for traction motors.

Renesas’ Winning Combinations are engineering-vetted designs that allow customers to take advantage of an elevated platform for their design ideas, accelerating product development cycles and lowering overall risk in bringing designs to market. Renesas now offers more than 300 Winning Combinations for a wide range of customers and markets.

In November of 2022, Renesas announced a unified global sales and marketing organization, combining teams from the Automotive Solution Business Unit (ABU) and the IoT & Infrastructure Business Unit (IIBU) to accelerate cross-BU collaboration. The new organization also allows Renesas to capitalize on scale advantages by fostering cross-selling opportunities and broader customer coverage. The new Winning Combos are the first to combine products designed for automotive applications with non-automotive offerings.

“These Winning Combos are an excellent example of the synergies we can leverage from our new organization,” said Chris Allexandre, Senior Vice President, CSMO and Head of the Global Sales and Marketing Unit at Renesas. “By combining our technical, market and customer knowledge, we can serve large and rapidly growing opportunities in all geographies with the right solutions at optimal value.”

The 10 new Winning Combinations include the following:

Ÿ   OCPP Interface Card (OIC) for Smart EV Chargers

Open Charge Point Protocol (OCPP) is used to communicate between a networked charging station and a networked charge management system. Today charging stations can connect to OCPP, but with this new solution, standalone EV chargers can also connect to OCPP server to authorize EVs, manage charger configurations remotely, get real time alerts, and more. This gives users and manufacturers flexibility to use any charger with, any EV system with support for multiple charging techniques. This Winning Combo includes Renesas low-power Bluetooth®, Wi-Fi and MCUs.

Ÿ   3 Kilowatt Off-Board EV Charger

High power off-board chargers are the functional blocks for supporting battery pack solutions. This charger combination works on a universal input range and uses a high-end MCU to control power factor correction (PFC) and manage the zero-voltage switching (ZVS). This Winning Combo includes Renesas MCU, analog, power and PWM controller products.

Ÿ   Connected Android Cluster

This connected cockpit design provides developers with all the necessary modules and peripherals for complete cockpit application development. This custom board comes with multiple wireless connectivity options such as Wi-Fi, LTE, GPS, etc. Information coming from outside the vehicle can be fed through a dual CAN/FD communication channel. It supports three display connections and a variety of boot options. It supports Android infotainment systems as well as cluster applications through FreeRTOS. The Winning Combo includes Renesas R-Car Automotive System-on-chip (SoC), power management devices, timing products, Wi-Fi, modules and Bluetooth products.

Ÿ   Toll and Communication Unit for EV Charger Pile

Ÿ   Vehicle Control Unit

Ÿ   Low-cost TFT Instrument Cluster with Telematics

Ÿ   Low Voltage Inverter for 2/3 Wheel Traction Motor

Ÿ   Car Telematics Box Module

Ÿ   High Performance EV Charger Wallbox Solution

Ÿ   Portable EV Charger

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Mouser Electronics, the New Product Introduction (NPI) leader with the widest selection of semiconductors and electronic components, is pleased to announce the launch of Proto Alpha Platform in partnership with the DERBI Foundation.

Proto Alpha, an initiative of the DERBI-Mouser Innovation Forum, is a collaboration and mentorship platform designed to expedite innovators in developing Alpha Prototypes, thus reducing their cycle time to PoC. It offers membership to startups and entrepreneurs to encourage breakthrough innovation and accelerate product development within the shortest cycle times. Proto Alpha allows members access to the NIDHI Prayashala Lab, a prototyping lab facility aided by the Department of Science & Technology, Government of India, as well as the Mouser Innovation Lab at DERBI Foundation, which now houses a component bank and test equipment to support designers in design, prototyping and testing.

A one-day annual summit and launch on February 17, 2023, of Proto Alpha brought together industry experts, entrepreneurs, venture capitalists, enthusiasts, and startups in an effort to kickstart and amplify collaborations, co-innovation and co-development of products. The event featured keynote sessions, panel discussions, and startup product showcases aimed at inspiring the developer community.

The highlight of the event was the launch of the open-source UV-VIS-NIR Spectrometer under the aegis of “Creato,” envisaged as a unique open-source product development platform to accelerate prototyping.

“Open-source hardware can provide a cost-effective, collaborative, and customizable approach to electronics design that can enable engineers to rapidly prototype and test their ideas and bring innovative products to market,” said Mark Burr-Lonnon, Senior Vice President of Global Service & EMEA and APAC Business at Mouser Electronics. “As a leading authorized distributor of electronic components empowering innovation, Mouser Electronics is excited to promote creativity through collaborative platforms such as Proto Alpha.”

As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive.

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated July 1, 2021. The Program was approved by a shareholder resolution dated May 27, 2021 and by the supervisory board.

STMicroelectronics N.V. announces the repurchase on the regulated market of Euronext Paris, in the period between Feb 20, 2023 to Feb 24, 2023, of 141,913 ordinary shares (equal to 0.02% of its issued share capital) at the weighted average purchase price per share of EUR 45.1345 and for an overall price of EUR 6,405,171.53.

The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company.

The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation.

Following the share buybacks detailed above, the Company holds in total 8,666,660 treasury shares, which represents approximately 1.0% of the Company’s issued share capital.

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Infineon Technologies and GaN Systems Inc. announced that the companies have signed a definitive agreement under which Infineon will acquire GaN Systems for US$830 million. GaN Systems is a global technology leader in the development of GaN-based solutions for power conversion. The company is headquartered in Ottawa, Canada, and has more than 200 employees.

“GaN technology is paving the way for more energy-efficient and CO2-saving solutions that support decarbonization. Adoption in applications like mobile charging, data center power supplies, residential solar inverters, and onboard chargers for electric vehicles is at the tipping point, leading to a dynamic market growth,” said Jochen Hanebeck, CEO of Infineon. “The planned acquisition of GaN Systems will significantly accelerate our GaN roadmap, based on unmatched R&D resources, application understanding and customer project pipeline. Following our strategy, the combination will further strengthen Infineon’s leadership in Power Systems through mastery of all relevant power technologies, be it on silicon, silicon carbide or gallium nitride.”

Jim Witham, CEO of GaN Systems, said: “The GaN Systems team is excited about teaming up with Infineon to create highly differentiating customer offerings, based on bringing together complementary strengths. With our joint expertise in providing superior solutions, we will optimally leverage the potential of GaN. Combining GaN Systems’ foundry corridors with Infineon’s in-house manufacturing capacity enables maximum growth capability to serve the accelerating adoption of GaN in a wide range of our target markets. I am very proud of what GaN Systems has accomplished so far and cannot wait to help write the next chapter together with Infineon. As an integrated device manufacturer with a broad technology capability, Infineon enables us to unleash our full potential.”

As a wide bandgap material, GaN offers customer value by higher power density, higher efficiency, and size reductions, especially at higher switching frequencies. These properties enable energy savings and smaller form factors, making GaN suited for a wide range of applications. By 2027, market analysts expect the GaN revenue for power applications to grow by 56% CAGR to approx. US$2 billion (source: Yole, Compound Semiconductor Market Monitor-Module I Q4 2022). As such, GaN is becoming a key material for power semiconductors, alongside silicon and silicon-carbide, and coupled with new topologies, such as Hybrid Flyback and multi-level implementations. In February 2022, Infineon announced doubling down on wide bandgap by investing more than €2 billion in a new frontend fab in Kulim, Malaysia, strengthening its market position. The first wafers will leave the fab in the second half of 2024, adding to Infineon’s existing wide bandgap manufacturing capacities in Villach, Austria.

The planned acquisition of GaN Systems in an all-cash transaction will be funded from existing liquidity. The transaction is subject to customary closing conditions, including regulatory approvals.

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Deputy Chief Minister of Uttar Pradesh commends Servotech Power for their efforts in promoting renewable energy and Green Energy Solutions at India Solar Expo

Leading EV charger manufacturer and solar solutions provider Servotech Power Systems Limited is exhibiting its state-of-the-art EV Chargers and Solar products at the India Solar Expo held in Lucknow, Uttar Pradesh, from 2 to 4 March 2023. The company’s stall was inaugurated by Brajesh Pathak, Deputy Chief Minister of Uttar Pradesh. He has appreciated the efforts made by Servotech Power in expanding their product line from Solar to EV Charging Solutions. Uttar Pradesh Transport Minister Dayashankar Singh was also present at the time of the inauguration.

The founder and MD of Servotech, Raman Bhatia, remarked on the thrilling prospect of attending a significant event like India Solar and EV Expo During the inauguration ceremony, Raman Bhatia, Founder and MD of Servotech Power, “India Solar Expo are thrilling prospects for us as they allow us to showcase our mission of providing green energy solutions across the country. As a company, we are committed to establishing Servotech as a leading player in the national and international renewable energy space. We aim to integrate renewable energy into people’s daily lives and create a cleaner, more sustainable future.”

The India Solar Expo provides an excellent platform for companies like Servotech Power to showcase their products and ideas on expanding the use of renewable energy. The company will actively seek out connections with regional partners to explore potential collaborations throughout the event while showcasing its main line of product solutions and supporting technology.

Servotech Power’s state-of-the-art EV Chargers are another step towards the company’s commitment to promoting the use of renewable energy in transportation. The company is dedicated to promoting sustainable energy and contributing to a green future. The India Solar Expo is an opportunity for them to present their vision to a broader audience and establish long-term collaborations with experts in the field.

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Based on the Texas Instruments (TI) AM62x Arm-based processor family, Toradex’s Verdin AM62 is pin-compatible with other SoMs in the scalable Verdin product family

Toradex, a leading provider of embedded systems solutions, has announced the launch of its Verdin AM62 System on Module (SoM), based on the AM623 processor from Texas Instruments. This new module focuses on ease of use, connectivity, and scalability for the Industrial Internet of Things (IIoT), Human-machine-interaction (HMI), and gateway applications.

Toradex’s focus on innovation, industry-leading support, and lowest lifetime product cost has long set the company apart. Its offerings often surpass basic requirements and look toward a future-proof solution for its customers. This addition of AM62x processors to the well-established Toradex Verdin SoM family proves the company’s continued focus on adding value for customers and their projects.

Toradex started with extensive research and input from its customers in markets such as Industrial Automation, Healthcare, Smart City, Transportation, and Test & Measurement. It showed that while the Verdin form factor provides a great fit, even more applications would profit from a lower power and lower cost SoM, extending the pin-compatible Verdin family in the low end. When evaluating possible processors for a new Verdin SoM product, Toradex did not just consider features and price. The selection criteria also included long-term product reliability, Linux support strategy, company-wide manufacturing capabilities, and more; all to provide the lowest lifetime product cost to its customers.

The lifetime product cost includes not only the cost of the SoM alone but also the time and resources required to bring a product to market and the associated maintenance cost. With new upcoming regulations such as the EU Cyber Resilience Act, the continued maintenance of software moves from best practice to a requirement – making it all the more imperative.

“We are pleased with the latest addition – the Verdin AM62 System on Module – to our successful product portfolio. We have found a great fit with Texas Instruments’ processors and believe that it will fortify our objective of providing the best experience for our customers with their diverse application requirements. Toradex’s focus remains on building value for our customers while maintaining ease of use and accelerating their time to market. We look forward to continuing to enhance and broaden our full-stack embedded solutions offerings.” said Samuel Imgrueth, CEO of Toradex.

The Verdin AM62 is available with Torizon – an easy-to-use Industrial Linux Platform that modernizes the development and deployment of Linux-based products. The combination of the Verdin AM62 with Torizon offers a reliable and secure full-stack embedded computing platform, including a maintained and tested Linux Distribution, IDE Integration, OTA Remote Updates, Device Monitoring, and Remote Access to increase the overall product lifetime value.

Toradex’s Verdin family of products is designed to provide scalability via software and pin-compatible modules. Other Verdin SoMs include the Verdin iMX8M Mini and the iMX8M Plus. Verdin’s peripheral interfaces are optimized for modern industrial IoT and gateway applications, including Gigabit Ethernet, PCIe, CAN FD, Wi-Fi, and Bluetooth. Reference designs with extensive documentation simplify the creation of your customized carrier board.

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Rohde & Schwarz will launch its R&S EVSD1000 VHF/UHF nav/drone analyzer at Airspace World 2023 in Geneva from March 8 to 10, 2023. The analyzer provides highly accurate and efficient drone inspection of terrestrial navigation and communications systems along with outstanding accuracy and the measurement repeatability customers need.

Civil aviation requires accurate and reliable navigation systems for optimizing air traffic control (ATC) and ensuring the essential public safety while mitigating aircraft risks, delays and costs. Terrestrial air navigation systems, such as landing systems or en-route navigation systems require unique test and measurement capabilities.

R&S EVSD1000 has specifically been designed to provide a mounting adaptor for installation onto medium-size drone types. (Image: Rohde & Schwarz)

The R&S EVSD1000 VHF/UHF nav/drone analyzer is a signal level and modulation analyzer for mediumsized drones. It is the only instrument that combines measurements of instrument landing systems (ILS), ground-based augmentation systems (GBAS) and VHF omnirange (VOR) ground stations in a single box. The mechanical and electrical design is optimized for drone based, real-time measurements of terrestrial navigation systems with up to 100 measurement data sets per second.

The analyzer provides high-precision signal analysis in the frequency range from 70 MHz to 410 MHz, a critical requirement for drone based terrestrial navigation signal measurement systems. This also includes the needed measurement repeatibility to ensure that results from drone measurements can be compared to flight and to ground inspections in line with ICAO standards.

The analyzer is ideal for drone-based ground station testing in the perimeter of an airport. At 1.5 kg, the instrument’s weight allows usage of a medium-sized drone to perform measurements on ILS/VOR systems in line with the ICAO standards.

Customer benefits include reduced runway blocking times compared to conventional methods (manual measurements, mast measurements), significantly reducing costs while providing the necessary measurement repeatability, measurement precision and GNSS time and location stamps. While streaming measurement data during a drone flight via the data link to a PC on the ground, the analyzer can buffer this data internally to ensure that no results are lost if the data link is lost. This ensures gapless measurements and easy reporting.

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