ELE Times

JSW MG Motor India is all set to roll out its electric SUV this month. This India-specific electric SUV from SAIC Motor’s Indian arm, will be launched on August 26, 2026. The SUV will be the first production model to feature new technology – MG ADAPT (Advanced Drive Architecture Platform Technology). The modular platform will be able to accommodate different electrified powertrain setups, namely BEVs (Battery Electric Vehicle), HEVs (Hybrid Electric Vehicles), PHEVs (Plug-in Hybrid Electric Vehicle), and REEVs (Range-Extended Electric Vehicles).

The development represents a wider shift in the automotive industry toward the use of flexible vehicle architectures. Rather than designing separate platforms for different propulsion technologies, a multiple-powertrain architecture enables automakers to present numerous powertrain architectures using a single vehicle architecture. This, potentially, enables car manufacturers to develop vehicles faster and simplify production processes, and manufacturers are more efficiently able to respond to shifts in consumer needs and demands.

The MG ADAPT system combines a dedicated hybrid engine, battery, 10-in-1 Intelligent Electric Drive Unit and electromagnetic dedicated hybrid transmission, with an intelligent energy management system. The intelligent management system controls all the components to allow the vehicle to switch between pure EV, Series Hybrid, Parallel Hybrid and Engine Direct Drive mode as per the situation.

The MG ADAPT platform goes way beyond just another new EV platform. It’s also an example of how automakers are dealing with the complex balancing act of electrification, cost and the need to allow buyers to select vehicles that suit their lifestyles.

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​Omega Seiki Mobility (OSM) has joined hands with ELECTRA AI to bring intelligent battery health services to the EVs in its electric vehicle ecosystem. Through this alliance, real-time tracking of battery health, prediction capabilities, and State of Health (SoH) will be added to OSM’s entire fleet. With the rise of EV adoption in India, battery health, reliability, and performance over its lifespan have become more crucial.

As part of the collaboration agreement, ELECTRA AI’s battery intelligence platform would enhance OSM’s visibility of battery performance and health, and this technology would assist in driving predictive maintenance, vehicle uptime improvements, warranty management and using data to advance product development.

For decades, battery management systems (BMS) have been monitoring parameters like temperature, voltage, and current in a manner to ensure efficient and safe function of the battery pack. With the help of Artificial Intelligence, together with advanced data analytics functionality, it’s possible to go beyond the scope of conventional monitoring by analysing the battery data over time and detect changes occurring in the battery’s condition.

For India’s commercial EV sector, where vehicle uptime directly affects operating economics, intelligent battery monitoring could therefore become an important technology layer. Instead of relying solely on periodic diagnostics, AI-enabled systems can continuously analyse operational data and provide insights into battery behaviour.​

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​Gulf Oil is investing Rs 50 crore to scale up Tirex’s Ahmedabad plant capacity from 1,800 to 3,000 DC fast chargers per year. The expansion enables the company to capture the rising demand in India’s e-bus market while growing its non-lubricant future-mobility portfolio. The company has announced a planned capital expenditure of Rs 50 crore to expand the production capabilities of its EV manufacturing arm, Tirex Transmission Private Limited. The investment will nearly double the annual capacity of Tirex’s Ahmedabad facility to around 3,000 DC fast chargers, up from the current 1,800 units.

This strategic move aims to leverage the rapid volume growth and strong momentum in India’s electric bus and commercial fleet segments. Currently, Gulf Oil holds a 65.18% controlling stake in Tirex Transmission Private Limited. This announcement is expected to raise Tirex’s annual manufacturing capacity to 3,000 DC fast chargers from the current 1,800 units, representing a targeted capacity doubling at Tirex’s Ahmedabad plant. The capacity scaling enhances Tirex’s ability to bid for larger municipal and corporate electric bus charging contracts. A larger manufacturing footprint establishes Tirex as an institutional leader in the localized EV charger manufacturing space​.

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Brandworks Technologies Pvt. Ltd., India’s fastest-growing design-driven and R&D-led electronics manufacturing company, has received approval under the Government of India’s Electronics Components Manufacturing Scheme (ECMS) for the manufacturing of speakers and microphones, marking a significant step in the company’s efforts to strengthen domestic electronics component manufacturing and contribute to India’s growing electronics manufacturing ecosystem.

Brandworks’ approval for speakers and microphones places it among the companies being supported under ECMS to build domestic capabilities across critical electronics components. The category forms an important part of the wider electronics value chain, with applications spanning consumer electronics, automotive systems, smart devices, communication equipment and other connected products. The company also holds an exclusive license for Dolby Atmos soundbars in India, further strengthening its capabilities and expertise in the audio technology segment.

Commenting on the development, Ishwar Kumhar, Co-founder and CEO, Brandworks Technologies, said, “The ECMS approval for speakers and microphones marks an important milestone in Brandworks’ journey of contributing to India’s electronics manufacturing ecosystem. Our ongoing engagement with the Ministry of Electronics and Information Technology has been an important part of this journey, and this approval further strengthens our commitment to supporting the Government of India’s vision for a deeper and more self-reliant electronics value chain. We aim to continue working closely with the government and industry stakeholders to accelerate domestic component manufacturing, build advanced capabilities in India and create a stronger, globally competitive electronics ecosystem.”

Nikita Kumawat, Co-founder and Director, Brandworks Technologies, said, “The approval under ECMS is a strong validation of the capabilities we have been building across electronics design, engineering and manufacturing. Speakers and microphones are at the centre of a wide range of connected and consumer electronics products, and developing these capabilities domestically will allow us to contribute greater value across the electronics supply chain. We see this as an opportunity to further strengthen our manufacturing capabilities in India and build solutions that can cater to both domestic and global requirements.”

The approval comes as the Government of India continues to accelerate the development of a deeper and more self-reliant electronics supply chain through ECMS. With the latest round of approvals, 106 projects covering 30 products across 15 states have now been approved under the scheme, representing a total approved investment of ₹69,548 crore and projected production of ₹5,34,101 crore. The scheme is designed to encourage investments across key electronics components, sub assemblies, supply-chain products and capital goods, with a focus on increasing domestic value addition and reducing dependence on imports.

For Brandworks, the latest approval builds on its continued engagement with the Government of India’s efforts to advance the country’s electronics and technology ecosystem. The company has previously partnered with the Ministry of Electronics and Information Technology (MeitY) through initiatives focused on strengthening India’s capabilities in emerging electronics and technology domains. The ECMS approval further reflects Brandworks’ continued commitment to contributing to the country’s transition towards deeper domestic manufacturing and greater value addition across the electronics supply chain.

The approval also represents an opportunity for Brandworks to further integrate component manufacturing into its electronics manufacturing portfolio while creating capabilities that can support the evolving requirements of India’s fast-growing electronics industry. The company intends to leverage its manufacturing and engineering capabilities to develop scalable production infrastructure for speakers and microphones and support customers across multiple electronics segments.

The development comes at a time when India’s electronics manufacturing sector is witnessing increasing demand for locally manufactured components, driven by the growth of smartphones, wearables, smart consumer devices, automotive electronics, connected devices and other technology-led products.

With the ECMS approval, Brandworks aims to play a larger role in this transition by contributing to a more resilient, locally anchored, and globally competitive electronics supply chain from India, while working closely with the government and industry ecosystem to advance the country’s electronics component manufacturing capabilities.

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India is continuously making efforts to increase its domestic battery production ecosystem amid mounting pressure for electric vehicles (EVs) and energy-storage systems. Announced battery-cell manufacturing projects currently total nearly 100-gigawatt hours (GWh) in capacity, a significant increase from the historical heavy reliance of India on importing the key lithium-ion cells. Still, a significant barrier to bringing on announced cell production and a holistic domestically sourced battery supply chain exists in the country.

The development is particularly important for India’s rapidly growing EV industry, where batteries make up a large portion of the total vehicle cost, directly impacting range, performance and cost-effectiveness. The strengthening of India’s indigenous battery cell manufacturing system could reduce its dependence on global supply chains and support India’s overall aspirations for electric mobility.

Driven by policy initiatives, including the Rs 18,100 crore Advanced Chemistry Cell (ACC) Production Linked Incentive (PLI) scheme, India has been promoting domestic ACC manufacturing. The programme plans for the manufacturing of large-scale battery cells and also focuses on domestic value addition.

As India’s EVs grow in number, India must develop its capability for large-scale manufacturing. Approaching 100 GWh of announced capacity marks significant progress, but the real hurdle will be turning those announcements into functioning factories, along with developing the domestic technologies and upstream supply chains necessary to make India’s EV battery ecosystem less dependent on the global value chains.

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Exicom Tele-Systems has started production of liquid-cooled AC and DC power modules for EV chargers at its Hyderabad facility. The development marks a huge milestone for Indian EV chargers and power-electronics manufacturing ecosystem in India. It states that it is also the only company in India to manufacture this kind of liquid-cooled power module for markets worldwide.

The development comes as demand for high-power EV charging infrastructure continues to grow. With the EV charging systems trending higher power EV charging solutions, it is getting quite crucial for power electronics systems to handle heat dissipation in power electronic devices. This has come at the launch of liquid-cooled modular power electronic solutions from Exicom to handle the heat dissipation issues in the powerful, compact design system for EV charging solutions.

The EV chargers use power-electronic components to convert and regulate electrical energy before delivering it to the vehicle. These parts produce an extreme amount of heat while charging a vehicle. Conventional methods for cooling with air turn into a major challenge as power density rises, requiring larger cooling systems and greater airflow.

Liquid cooling is generally considered to be the more practical approach for handling the heat created by these high-power electronics. Exicom has previously highlighted liquid-cooled power electronics to be the type of technology that is best fit for high temperature and rugged environments where dust can influence the reliability of the charger.

This latest development with an in-house liquid-cooled power module output at the Hyderabad facility would be Exicom’s first step into more sophisticated, domestically built charging power electronics. Moreover, it shows the increased significance thermal technologies will have as India’s charging infrastructure moves toward more rapid high-speed charging.

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The 30th International Symposium on VLSI Design and Test (VDAT 2026) was inaugurated today at Jaypee Institute of Information Technology (HIT), Noida, bringing together eminent academicians, semiconductor industry leaders, researchers, policymakers and students to deliberate on emerging technologies shaping the future of semiconductor and intelligent computing systems. The three-day symposium is being held from 20-22 August 2026 with the theme “Advancing Intelligent, Secure and Quantum-Ready Semiconductor Systems for the Next Era of Computing.”

The landmark edition is being hosted by JIIT in collaboration with Delhi Technological University (DTU), Indraprastha Institute of Information Technology Delhi (HIT-Delhi), Indira Gandhi Delhi Technical University for Women (IGDTUW), National Institute of Technology Delhi (NIT Delhi) and Netaji Subhas University of Technology (NSUT), with the support of the VLSI Society of India (VSI) and IEEE Uttar Pradesh Section. VDAT has been a flagship platform of VSI for three decades, connecting researchers, academia and industry in VLSI design, semiconductor technologies, testing, EDA, embedded systems and emerging computing technologies.

The 30th edition is particularly significant as VDAT is being organized in Uttar Pradesh for the first time in its history. Its presence in Noida reflects the growing importance of the Noida—Greater Noida region in India’s electronics, semiconductor, data-centre and advanced-manufacturing landscape, while providing a platform to connect the state’s emerging priorities in electronics manufacturing, semiconductor investment, innovation and high-technology employment with leading researchers and industry.

The inaugural ceremony was graced by Ms. Sunita Verma, Scientist-G and Group Coordinator, R&D Dix4sion, Ministry of Electronics and Information Technology (MeitY), Government of India, as the Chief Guest, and Dr. Kamaljeet Singh, Director General, Semi-Conductor Laboratory (SCL), Mohali, as the Guest of Honour. The ceremony also witnessed the presence of Prof. S. C. Saxena, Pro-Chancellor, HIT; Prof. Shweta Srix’astava, Director, HIT and General Chair, VDAT 2026; Dr. Satya Gupta, President, VLSI Society of India; Chitra Hariharan, Secretary, VLSI Society of India; Prof. Prateek Sharma, Vice Chancellor, DTU; and Prof. Ranjana Jha, Vice-Chancellor, IGDTUW, among other distinguished guests.

In her address, Ms. Sunita Verma emphasised the strategic importance of India’s semiconductor journey and the need to strengthen capabilities across chip design, fabrication, advanced packaging, testing, materials, equipment and intellectual property. She highlighted the growing significance of Al, edge computing, hardware security, heterogeneous integration, chiplets, silicon photonics and quantum technologies, and stressed collaboration among government, academia, industry, start ups and research institutions.

Dr. Kamaljeet Singh emphasised the strategic importance of strengthening India’s indigenous semiconductor capabilities and developing a robust ecosystem spanning research, design, fabrication and technology deployment. He highlighted stronger academia—industry—government collaboration an essential to accelerating semiconductor innovation and supporting India’s strategic and emerging technology requirements.

Dr. Satya Gupta, President, VLSI Society of India, highlighted that continued evolution of VDAT us a platform for leading researchers, industry experts and students to exchange innovations in VLSI design, semiconductor technologies, testing and system design, 8iid emphasised the relevance of the 2G26 theme to AI, sect hardware, heterogeneous integration and quantum computing.

The inaugural programme featured addresses by Prof. S. C. Saxena, Dr. Satya’ Gupta and Chitra Hariharan, Dr. Kamaljeet Singh, Ms. Sunita Verma and Mr. Hitesh Garg, Vice President and India Managing Director, NXP Semiconductors. It also featured the Synopsys—JIIT Tapeout Initiative, presented by Mr. Amit Khanuja, VP—RD Engineering, IP Group, Synopsys, the unveiling of the VDAT 2026 Proceedings, and inauguration of the Cadence-Certified Laboratory by Ms. Tal Zigman, Global Academic Network, Cadence Design Systems.

The symposium received 441 research papers from 78 institutions, of which 122 papers were accepted, representing an acceptance rate of 27.7%. The research programme covers seven technical tracks addressing contemporary areas of VLSI and semiconductor technology, including circuits and SoC design, embedded systems, AI hardware and design automation, emerging semiconductor devices, advanced integration, hardware security, advanced memory architectures and quantum ready technologies.

The three-day programme also includes keynote addresses, invited talks, tutorials, a PhD Forum, Startup/Chippreneur activities, poster sessions and industry—academia interactions, providing opportunities for researchers and young technology professionals to engage with experts from leading organisations including NXP Semiconductors, Cadence, Synopsys, STMicroelectronics and Renesas.

The symposium marks an important milestone for HIT Noida and the Delhi-NCR academic consortium, providing a platform to showcase the region’s academic and technological capabilities and strengthen connections with India’s growing semiconductor and electronics ecosystem. The organisers expressed their appreciation to the distinguished speakers, participating institutions, industry partners, researchers, reviewers, students and volunteers for their contribution to the successful organisation of VDAT 2026.

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Palo Alto Networks today announced the Frontier AI Critical Defense Program, a first-of-its-kind initiative to protect critical infrastructure from AI-driven exploits. Through the program, leaders across operational technology (OT), healthcare, commercial software and open-source communities coordinate with Palo Alto Networks to deploy proactive & “virtual patches,” neutralizing vulnerabilities at the network-level before attackers can exploit them.

Palo Alto Networks recently used Frontier AI models to uncover more than 14,000 previously unknown vulnerabilities in open source software, underscoring how AI could enable threat actors to automate cyberattacks and shrink attack timelines. Yet, critical infrastructure operators, constrained by strict uptime and safety testing, cannot patch at AI speed. This mismatch creates a significant exposure gap, leaving essential systems vulnerable long before software fixes can be safely deployed.

​​True defense at AI speed requires joint action. This program builds on our existing collaborations with IBM and Red Hat (as part of Lightwell), Microsoft (as part of MAPP) and OT leaders like Siemens and the Idaho National Laboratory (as part of the OT Threat Research Lab).

Today, the collaboration is expanding to include Anthropic, OpenAI, OT leaders like Mitsubishi and Axis Communications, industry consortiums for sharing risk information like Analysis and Resilience Center for Systemic Risk and Health-ISAC, OT research organizations like the independent, non-profit Energy R&D Institute (EPRI) and OSS initiatives like Akrites (an initiative from the Linux Foundation).

Palo Alto Networks Frontier Virtual Patching puts these insights into action to deliver proactive protection for joint customers. By combining Frontier AI threat discovery with trusted vulnerability intelligence, it delivers rapid network-level patches while safeguarding sensitive vulnerability details from attackers.

Lee Klarich, Chief Product Officer, Palo Alto Networks

“In the age of Frontier AI, the traditional, reactive race to build and deploy software patches before adversaries exploit a flaw is a losing battle. Protecting critical infrastructure requires a structural shift from isolated patching to collective, proactive intelligence. Through initiatives like our Frontier AI Critical Defense Program, we can neutralize threats at the network layer before they are weaponized.”

Help safeguard critical infrastructure by joining the expanding Frontier AI Critical Defense Program, today. Visit the website to learn more on how to get involved, or explore Palo Alto Networks broader Frontier AI Defense Initiative.

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ROHM will exhibit at electronica India 2026, South Asia’s leading trade fair for electronic components, systems, applications, and solutions, from September 16th to 18th at the Bangalore International Exhibition Centre (BIEC). At booth I-15 in Hall 3, ROHM will showcase application-focused demonstrations featuring its semiconductor devices and reference designs for mobility and industrial applications.

“Electronica India 2026 will be an important opportunity to demonstrate how ROHM’s power and analog semiconductor technologies contribute to real-world applications across mobility and industrial systems. This year, we will present more application-oriented demonstrations, including a three-wheeled concept vehicle that shows how ROHM semiconductor devices and reference designs can be integrated into mobility systems, as well as reference-design boards for AI server power supplies. Through these exhibits, we aim to foster more application-driven technical discussions with customers and partners in India and support them as they address challenges related to power conversion, energy efficiency, and system design,” says Makoto Terada, Managing Director, ROHM Semiconductor India.

Highlights of ROHM’s presence at electronica India 2026 include:

For Mobility

• The three-wheeled EV concept vehicle demonstrating how ROHM semiconductor devices and
  reference designs can be applied to mobility systems, including motor control, smart instrument
  cluster, and lighting solutions
• Engine control ICs and LED driver ICs for Two-wheeled vehicles
• Sonar demonstrations for automotive applications

For Industrial

• 1.3 kW and 5.5 kW reference designs for AI server power supplies
• Reference designs for power conversion in EV chargers and PV inverters
• Sub-GHz wireless communication LSIs and chiplet-based MCUs
• Use cases for Solist-AI, ROHM’s edge computing AI solution

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UiPath, Inc., a global leader in business orchestration and automation, today announced UiPath Maestro Flow, a developer-first orchestration canvas combining the speed of modern, AI-native development with enterprise-grade durability and governance. Using Maestro Flow, builders can use supported coding agents to design, run, observe, and govern an end-to-end process as a single artifact, from prototype to production.

With the popularity of coding agents, enterprise builders can build AI agents quickly, but struggle to implement and run them as real business processes across systems. Without a critical layer of orchestration, process logic becomes fragmented, difficult to govern, and costly to maintain—prototypes cannot ship, work stalls while waiting on review, automations are not tracked, and the cost of experimentation itself becomes a brake on progress.

Maestro Flow closes that gap. Builders can use the coding agents they already rely on—including Claude Code, Cursor, GitHub Copilot, and Codex—to design, run, observe, and govern complete business processes as a single artifact, all from their native development environment, such as VS Code or UiPath Studio. It is a fast, code-first build experience directly on an enterprise grade orchestration engine, so the version prototyped is the version that ships into production, without rebuilding or re platforming.

Maestro Flow enables teams to build at prototype speed and run with production durability. Teams keep the code-first workflow they already use, while enterprises gain the execution, observability, and governance needed for production. Coordinating AI agents, robots, APIs, documents, and people within one flow, Maestro Flow runs on the same Maestro orchestration engine enterprises already trust.

“Enterprises don’t have an agent problem; they have an orchestration problem,” said Raghu Malpani, Chief Product and Technology Officer, UiPath. “With coding agents, it’s never been easier to build an agent. But running a real business process, spanning agents, robots, systems, and people—and being able to prove what happened at every step—needs an orchestration layer that ties these together in a real business environment. Maestro Flow is that missing layer, and it runs on the durable, governed orchestration foundation in the UiPath Platform that our customers already trust.”

Developers can get started today with UiPath Maestro Flow by clicking the “Try Now” button at www.uipath.com/product/maestro/flow. For those developers interested in trying out UiPath Maestro, UiPath is offering UiPath Maestro Lite, a lightweight option for processes that do not require extensive management, matching operational depth with the cost and criticality of the work.

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Panasonic Industry Europe announces the release of its new ECWFJ series of metallized polypropylene film capacitors, developed to support cost-effective designs while maintaining a high level of safety and long-term reliability. The new series is aimed at engineers working across industrial and automotive power electronics (it is qualified to AEC-Q200 standards) who require dependable performance under demanding environmental conditions.

The ECWFJ series demonstrates proven resistance to moisture, maintaining stable operation under conditions of 40°C and 95% relative humidity for up to 1.000 hours. This ensures long-term reliability even in humid environments, while still offering a cost-efficient solution. As a result, the capacitors are well suited for a broad range of industrial uses as well as automotive applications.

Typical application areas include electric mobility systems such as DC/DC converters, on-board chargers and e-compressors, along with solar inverters and EV charging infrastructure. The series is also designed for use in industrial power supplies, LED lighting, smart meters and embedded power systems, where consistent electrical performance and durability are essential.

Technically, the ECWFJ series covers voltage ratings from 600V up to 1.100V DC. Capacitance values range from 1µF up to 12µF. The capacitors operate across a temperature range from -40°C up to +110°C, with the 1.000V variant rated up to 105°C. The devices are engineered to withstand thermal shock from -55°C up to 85°C over 1.000 cycles and can tolerate maximum ambient temperatures of up to 125°C for limited durations.

Panasonic’s proprietary patterned metallization with an integrated fuse mechanism helps ensure stable capacitance over the lifetime of the component and enhances overall system reliability. The design is complemented by a flame-retardant plastic enclosure and non-conductive resin, supporting compliance with UL and other regulatory standards. In addition, the capacitors are fully compliant with RoHS requirements.

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​A team of researchers at Penn State University has now come up with a bio-hybrid device that pairs custom-synthesised human DNA with a perovskite crystalline semiconductor to present a new form of low-power data storage and computation. Their study was published in Advanced Functional Materials in the latest edition released August 17, 2026. Such a device may in time help reduce the energy used for powering AI computing centres and huge data centres, the scientists say.

The technology addresses a growing challenge in modern computing: the enormous energy required to model and process data. An increasing number of high-performance AI workloads and the overall compute and memory demand of data centres mean that there is pressure to find a more efficient way to store and process data.

The researchers used synthetic DNA – a chemically engineered molecule arranged into short molecular sequences and a crystalline perovskite semiconductor material (used in things like solar cells and electronics). The combined pair of these materials created a memristor: a type of electronic memory that retains clues about its past electrical experience.

Such technology could potentially go toward energy-efficient AI-computing hardware; as well as data centres and even the burgeoning field of neuromorphic computing by coupling the storage and processing information within the same device.

The development highlights a broader trend in semiconductor research: instead of relying solely on conventional silicon scaling, researchers are exploring biological materials, memristors and unconventional computing architectures to address the energy and memory demands of next-generation AI systems.

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Nuvoton Technology is preparing to begin mass production of its KA49703A and KA49713A battery monitoring ICs (BMICs) in September 2026. The devices are designed for Battery Backup Units (BBUs) used in AI servers, helping monitor battery-cell conditions and support reliable power management in high-performance computing systems. As AI servers become critical infrastructure supporting modern society, ensuring continuous operation requires highly reliable power systems capable of running 24/7 throughout the year. By leveraging the company’s proven automotive-grade daisy-chain communication technology in high-voltage 400V/800V BBU applications, the KA49703A and KA49713A help realize highly reliable and efficient power architecture.

Achievements:
1. Supports daisy-chain communication and connection of up to 55 devices, simplifying large-scale battery system design.
2. Incorporates a transportation and storage mode that extends storage duration and reduces operational costs.

Data centers are mission-critical infrastructure that must operate continuously without interruption. Consequently, their power systems require exceptional reliability and stability. In recent years, the rapid growth of generative AI and cloud services has significantly increased AI server power consumption, driving demand for higher efficiency and reliability in power delivery systems.

At the same time, adoption of 400V and 800V high-voltage power architectures is accelerating to improve power efficiency,
while server and power-system densities continue to increase. These trends require battery systems not only to provide safe
monitoring under high-voltage conditions but also to ensure long-term reliability and low thermal generation during continuous
operation.

Battery systems are no longer simply backup power sources for outages. They now play an increasingly important role in
absorbing instantaneous power fluctuations, protecting systems, and ensuring service continuity, making them foundational
technologies for modern data centers and communication infrastructure.

Building on its proven automotive daisy-chain communication technology, Nuvoton has developed the KA49703A and KA49713A battery monitoring ICs for high-voltage 400V/800V BBUs used in industrial and infrastructure applications. Mass production is scheduled to begin in September 2026.

The KA49703A and KA49713A can accurately monitor up to 16 battery cells while integrating communication functions for high- voltage systems and safety features such as cell anomaly detection, addressing the demanding requirements of next generation energy storage systems.

Features of New Product:

1. Daisy-Chain Communication Supporting up to 55 Devices
AI-server BBUs and Energy Storage Systems (ESS ) operating at 400V/800V levels require large numbers of lithium-ion battery cells connected in series. Conventional battery monitoring systems typically require a dedicated MCU and isolation device for each monitoring IC. As cell counts increase, component count and communication wiring also increase, creating challenges in communication reliability and system complexity.

To address these issues, the KA49703A and KA49713A incorporate daisy-chain communication technology. Multiple battery monitoring ICs can be connected in series, enabling systems with up to 55 devices while minimizing wiring requirements and ensuring robust communication even in high-voltage environments. This architecture reduces the need for additional MCUs and isolation components, simplifying system design, reducing component count, minimizing board space, and improving overall reliability. The compact QFP-48 package (7 mm × 7 mm) also helps address the stringent space constraints found in AI server BBUs. Combined with high-precision voltage measurement accuracy of ±2.9 mV, the device enhances both monitoring performance and safety in next-generation power systems.

2. Transportation and Storage Mode Reduces Maintenance Costs

AI-server BBUs and large-scale ESS installations contain numerous lithium-ion cells and are often transported over long distances by ship or truck. Minimizing power consumption during transportation and storage is therefore essential.

However, conventional ICs incorporating daisy-chain communication typically exhibit increased shutdown current, leading to
battery drain during storage and transport.

To solve this issue, the KA49713A incorporates a dedicated transportation and storage mode that reduces shutdown current to less than 0.1 μA.

This significantly minimizes battery depletion during transportation and storage, extends allowable storage periods, reduces recharge requirements, and contributes to lower operating costs.

These battery monitoring ICs enable customers to address increasing power demands in the AI era and the transition toward higher-voltage power systems. They support improved reliability and operational efficiency in energy storage systems for data centers, industrial equipment, and social infrastructure.

Through continued expansion of its BM-IC product lineup, Nuvoton will further advance battery monitoring technologies and contribute to realizing a sustainable and highly reliable energy society.

Applications:

・Battery Backup Units (BBUs) for AI servers
・Large-scale Energy Storage Systems (ESS)

Product name:

Industrial Battery Monitoring ICs
・KA49703A
・KA49713A

Specifications:

Start of mass production:

Sep. 2026

Definitions:

• BBU (Battery Backup Unit). A backup power system equipped with rechargeable batteries, such as lithium-ion batteries, that supplies power during outages or momentary voltage drops.
• Daisy-Chain Communication. A communication method in which multiple monitoring ICs are connected in series. It reduces wiring complexity while providing high immunity to electrical noise.
• ESS (Energy Storage System). An energy storage system used for renewable energy integration, peak load management, and power supply-demand balancing.

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The Defence Research and Development Organisation (DRDO) has put EW (Electronic Warfare), digital twins and mission critical systems as the focus for its NETRA-2026 national seminar held in Bengaluru. As representatives from Armed Forces, DRDO, ISRO and industry and academia met on August 11 and 12 to deliberate over future battlespace-enabling technologies, emerging technologies like EW and RF systems, AI, next-gen radar, FPGA design, digital engineering, modelling and simulation took centre stage for discussion. These technologies are finding an increasing inter-relationship in present-day combat platforms where dominion of the electromagnetic spectrum is crucial in determining operational capability of not just sensors and communication, but also weapon systems.

In fact, electronic warfare, or EW, is playing an increasingly important role in a way in military activities since warfighting is getting to lean more and more towards combatting with and around networked systems, radar, and the use of wireless signals. EW includes the capability of using EM-spectrum visibility and analysis (EVS/A) and threat awareness, together with such capabilities as electromagnetic countermeasures (ECM). Providing digital models and mission-critical design can thus demonstrate how complicated networks can be tested without their being produced.

NETRA-2026 clearly indicates the DRDO’s emphasis on establishing technological building blocks to prepare for a network centric, AI-enabled and electronically contested battle scenario where informational and electromagnetic advantages are as significant as conventional firepower.

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India’s Electronics Component Manufacturing Scheme (ECMS) has green lighted the setting up of 31 new projects with a proposed investment of Rs 7,877 crore – taking it one step closer to increasing India’s footprint in electronic goods production and cutting import dependence. New sanctions reported on August 17, 2026. The new proposals are expected to drive production worth over Rs 82,243 crore and create nearly 10,000 direct jobs spread across ten Indian states.

The development is extremely beneficial to India’s defence electronics ecosystem. This includes the defence, radar, avionics, surveillance, electronic warfare, communications and unmanned systems sectors where indigenous and secure supply of components would add to the robustness of their systems.

The latest projects cover a broad range of components, including capital goods, camera and display modules, connectors, anode materials, enclosures, antennas, rare-earth permanent magnets, speakers and microphones, and metallised films for capacitors and coils. These components can support multiple high-technology industries, including defence, telecommunications, automotive, industrial electronics and aerospace.

The recently issued approvals for ECMS can hence be viewed both as a defence electronics manufacturing policy as well as a nascent strategic industry-capacity development program. With rising India defence production and exports, a deeper electronics supply chain would help India realise its ambitions of becoming a manufacturing and innovation hub by design.

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Indrajaal Autonomous Defence Systems and Sigma Advanced Systems have received government orders totalling around Rs 155 Crore for Indrajaal Ranger, a mobile drone patrolling vehicle for use at the border, in urban areas, and other places to tackle threats that need quick and agile response. This moves the counter-unmanned aerial system (C-UAS) away from static security measures at military bases. The companies stated that around 145 Crore of the current orders would be used for border security, while another order of Rs 10 Crore will be used for VVIP protection and other security scenarios.

The Indrajaal Ranger drone is a mobile counter-drone system capable of detecting and fighting unmanned aerial threats. Indrajaal Ranger is mobile and can function in multiple terrain sand condition, making its induction in this era a necessary step, as drones are becoming increasingly ubiquitous. Mobile platforms help security personnel to effectively deploy anti-drone solutions wherever needed, such as for guarding the borders, VVIP corridors, critical infrastructures and cities, unlike a stationary counter-drone facility.

The development also underscores the rising influence of Indian private sector enterprises in the country’s counter-UAS landscape, with the new order poised to accelerate the adoption of mobile counter-drone technology from exploratory defence platforms to broad operational use to improve both detection and reaction time to low-altitude threats.

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India’s Ministry of Defence signed a contract worth Rs 1,943 Crore with General Atomic Aeronautical Systems Inc. Of the US for leasing of two unmanned remote piloted aircraft systems (remotely piloted aircraft) or drones- the MQ-9B Sea Guardian High-Altitude Long-Endurance (HALE)- for Indian Navy on July 17, 2026, for 30 months. The purchase marks a boost to India’s maritime surveillance capabilities.

The long-endurance unmanned aerial vehicle MQ-9B Sea Guardian is suited to sustained ISR operations, and its endurance and sensor load would allow it to monitor large areas of the ocean and help with India’s maritime domain awareness needs. The leased platforms will give the Navy added airborne surveillance capability without the need to purchase permanent platforms immediately. They also arrive at an interesting time, with India pushing the observation of the Ocean area, where long-range UAVs would allow constant monitoring.

The lease also comes against the backdrop of India’s wider use of the MQ-9B technology and systems. Previously in 2024 itself, India has separately contracted for 31 MQ-9B Sky/Sea Guardian RPAS for its military operations. This further leasing underlines India’s increased use of HALE unmanned systems for routine sea-based surveillance, intelligence gathering, and strategic assessment.

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​With EV manufacturers aiming to boost the vehicle’s travel range, fast-charging capabilities, and powertrain efficiency, semiconductor technology is becoming an important part to the development of electric vehicles. Bosch’s third-generation silicon carbide (SiC) semiconductors, developed to enhance the efficiency and performance of EV power electronics, is an achievement in India’s electric-mobility ecosystem. Sample chips are currently shipping to global automakers for testing, with full commercial market availability targeted for 2027.

Bosch’s third-generation Silicon Carbide (SiC) chips support advanced dual-channel trench architecture, a specialised transistor design that improves current transmission efficiency and the overall system power-conversion efficiency by lowering down the resistance and loss during device switching. The chips are designed to meet the demanding power-efficiency and performance requirements of modern electric vehicles.

This technology offers around 20% more performance than the previous generation of chips. According to Bosch, its SiC technology should help to boost the driving range, battery utilisation and reduce the overall cost of ownership to owners of EV vehicles.

Silicon carbide technology can reduce power loss for the energy conversion process and thus can increase the power efficiency. The reduction of loss can also decrease the generation of heat inside the inverter, lowering the system’s cooling requirements.​

The introduction is particularly relevant as Indian automakers and component suppliers increasingly localise EV technologies and develop higher-efficiency powertrains. Advanced semiconductor devices such as SiC MOSFETs can play a key role in this transition by improving inverter performance without requiring proportionally larger battery packs.

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​Mahindra & Mahindra has introduced its latest BE 6 SPORTEQ electric SUV in India, bringing a new set of AI features and connected technology that works efficiently with its software-powered EV. Launched on August 15, the new series represents an effort to introduce advanced AI features with upgradable software rather than relying on conventional hardware improvements.

To provide an immersive experience, Mahindra has introduced a new feature named TEQ_Talk for the BE 6 SPORTEQ. It’s a conversational AI assistant developed in collaboration with Google Cloud using Gemini technology. According to Mahindra, it integrates 17 specialised AI agents and offers over 100 functions for vehicle controls, navigation, music, applications etc. Through this, drivers can talk to their car like a real person instead of being confined to a specific set of voice commands.

Another area of emphasis is the BE 6’s software-defined vehicle architecture. Mahindra claims that the vehicle will continue to improve after sale through software. From January 2027, further SPORTEQ features will be launched in phases, with access subject to the specific model and variant.

Software plays a part beyond infotainment. In the new BE 6 SPORTEQ, for example, are Drift Mode and Acceleration Boost that can modify performance and handling, and the Digital Car Key. For example, Drift Mode and Acceleration Boost that can modify performance and handling and Digital Car Key. These enable owners to unlock and access vehicles with their smartphones and similar devices.​

The BE 6 SPORTEQ represents an extension of a bigger trend in the Indian EV market – technology areas, beyond batteries and the powertrain, such as artificial intelligence, cloud connectivity, OTA and software-define architectures (SDAs), are gaining more consumer attention and opening new avenues to deliver continually enhanced features over the automobile’s usage life to customers and car manufacturers.

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ASMPT SMT Solutions, the global market and technology leader in integrated hardware and software solutions for electronics manufacturing, will present its latest solutions for the intelligent factory at Productronica India in Bengaluru from September 16 to 18, 2026. The highlight at Booth H4.E11 will be the launch of the new SIPLACE V placement platform in India. Visitors can also experience a live demonstration of large BGA placement for AI server applications on the SIPLACE SX, complemented by the highly precise DEK TQ printer. Software solutions for monitoring, managing and optimizing SMT production are another focus of the presentation.

Up to 30% more real performance

Developed from the ground up, the SIPLACE V combines significantly higher real performance with flexibility, process excellence and long-term investment protection. A new machine architecture with a highly rigid frame, efficient linear drives and high-resolution measurement systems enables higher acceleration and shorter non-productive movements. Under real production conditions, the platform achieves performance gains of up to 30 percent in key electronics manufacturing sectors. At Productronica India, ASMPT will demonstrate the SIPLACE V at a benchmark placement rate of more than 52,000 components per hour. Single- and dual-lane configurations, Smart Pin Support and compatibility with existing SIPLACE X feeders give manufacturers considerable flexibility in configuring the platform. High-resolution vision systems, individual component inspection and closed-loop sensor technology help ensure consistently high process quality even at high placement speeds. Also on display is the SIPLACE Measuring Feeder, which measures electrical component properties before placement.

Ready for AI server boards

A second live demonstration addresses one of the major challenges facing electronics manufacturers: the production of AI server boards. These combine extremely high component densities with increasingly large and heavy processor BGAs. Component dimensions of up to 150 × 150 millimeters and weights of more than 500 grams are no longer unusual. The SIPLACE SX at the booth will demonstrate the placement of large BGAs for AI server applications. The proven platform can be equipped with the TWIN VHF placement head for large and heavy processor BGAs, while its heavy-duty conveyor handles boards weighing up to ten kilograms. SIPLACE Smart Pin Support automatically positions support pins to prevent large boards from bending during placement. The DEK TQ printer complements the AI server presentation with solder paste printing for large-format boards.

Intelligent data use increases yield and performance

“We boost your intelligent factory” is ASMPT’s key message at Productronica India – and the presentation extends well beyond hardware. The WORKS Software Suite demonstrates how software can make production processes more transparent, support operators in their daily work, and help manufacturers make better use of production data. Real-time production KPIs make deviations and trends visible at an early stage. Combined with data from SPI and AOI systems, AI-based analysis helps identify the causes of printing and placement process deviations, automatically optimizes the printing process, and provides concrete recommendations for improving the placement process.

Additionally ASMPT will showcase its Factory Solutions, with SMT Analytics demonstrating how intelligent data use can help increase yield and performance. Another highlight is the latest version of Virtual Assist, ASMPT’s AI-based expert system for onboarding, service and maintenance. Its enhanced AI chat function now enables a continuous dialogue, allowing users to ask follow-up questions and refine their queries. A new image-based spare-parts recognition function also identifies likely matches from a smartphone photo of a disassembled part. ASMPT will also present its new Customer Portal at the booth.

“With the launch of the SIPLACE V in India, our live demonstration production of AI server boards and our latest software solutions, we are showing how advanced hardware, software and intelligent data use work together in future-ready electronics manufacturing,” says Mr Neeraj Bhardwaj, General Manager for India, Bangladesh & Sri Lanka at ASMPT SMT Solutions India. “Electronics manufacturers need more performance and flexibility, but they also need to make better use of their production data and automate processes where it makes sense. That is exactly what we want to demonstrate at Productronica India.”

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