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Infineon Technologies AG is expanding its portfolio of next-generation OptiMOS 7 MOSFETs for automotive applications: the portfolio of 40 V products now includes additional devices in robust, lead-free packages. In addition, 80 V and 100 V OptiMOS 7 MOSFETs are now also available. The MOSFETs are optimized for all standard and future automotive 48 V applications, including electric power steering, braking systems, power switches in new zone architectures, battery management, e-fuse boxes, DC/DC, and BLDC drives in various 12 V and 48 V electrical system applications. They are also suitable for other transportation applications such as light electric vehicles (LEV), e2wheelers, eScooters, eMotorcycles, and commercial and agricultural vehicles (CAV).

“As a technology leader in power semiconductors, Infineon is committed to shape the future technology standards in automotive power MOSFETs in terms of power efficiency, innovative and robust power packaging with high quality,” said Axel Hahn, Senior Vice President and General Manager Automotive LV MOSFETs of Infineon. “We are providing our customers a diverse product portfolio and are addressing all their requirements to drive the development of modern automotive applications.”

By combining 300 mm thin-wafer technology and innovative packaging, the new OptiMOS 7 technology enables significant performance advantages in all available voltage classes. As a result, the components are now available in various rugged automotive power packages, including Single SSO8 (5×6), Dual SSO8 (5×6), mTOLG (8×8) and sTOLL (7×8). The family offers high power density and energy efficiency with the industry’s lowest on-state resistance (e.g. 1.3 mΩ max in a single SSO8 (5×6) 80V package) in the smallest form factor. The devices also offer reduced switching losses, improved Safe Operating Area (SOA) robustness and high avalanche current capability. With this, they enable a highly efficient system design for tomorrow’s automotive applications.

Availability

The OptiMOS 7 products are now available in the following different robust automotive power packages in 40 V, 80 V and 100 V: Dual SSO8 (5×6), Single SSO8 (5×6), mTOLG (8×8), and sTOLL (7×8). Further information is available at www.infineon.com/OptiMOS7.

Infineon at the PCIM Europe 2024

PCIM Europe will take place in Nuremberg, Germany, from 11 to 13 June 2024. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booths #470 and #169. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Forums, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2024 show highlights is available at www.infineon.com/pcim.

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• Demonstrator integrates About:Energy’s battery data with ST’s automotive solutions and AutoDevKit platform to enable in-house development of safe, efficient, and cost-effective Battery Management Systems (BMS)
• This streamlines BMS design cycles, protects IP, accelerates prototyping, and enables comprehensive solutions like safety monitoring and fast charging
• Solution empowers companies across industries like EVs, aviation, and grid storage to innovate in electrification initiatives
• At the Plug and Play Expo2024 yesterday, the integrated solution won the Global Innovation Award.

About:Energy, a pioneering battery modelling software company, today revealed a technology demonstrator for battery management systems developed with the support of STMicroelectronics.

About:Energy has seamlessly integrated its industry-leading Voltt battery data with STMicroelectronics’ versatile automotive solutions, to empower companies to develop safe, efficient, and cost-effective Battery Management Systems (BMS) in-house.

The offering tackles the time and cost-intensive BMS development process by combining About:Energy’s validated battery data across diverse chemistries with STMicroelectronics’ AutoDevKit platform.

This streamlines design cycles, protects IP, accelerates BMS prototyping, and enables comprehensive solutions for safety monitoring, efficiency optimisation, state of charge assessment, and fast charging.

The integrated BMS solution showcased its capability at the Plug and Play EXPO2024 in Stuttgart on June 6th, where it won the Global Innovation Award.

Gavin White, co-founder and CEO of About:Energy said

“We are thrilled to collaborate with STMicroelectronics, a renowned leader shaping the future of automotive electronics. By fusing our expertise in battery modelling with their cutting-edge hardware and software, we are empowering companies of all sizes and across industries from electric vehicles, aviation, grid storage and more, to unleash new levels of safety, efficiency and performance in their electrification initiatives.”

STMicroelectronics support BMS technology by combining its automotive solutions with About:Energy’s innovative models, enabling companies to transform their electrification visions into reality while safeguarding intellectual property.

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Yokogawa Test & Measurement Corporation announces the release of the CT1000S AC/DC split core current sensor. The CT1000S combines the accuracy of Yokogawa’s conventional current sensors with the convenience of a clamp design, and features a high common mode rejection ratio (CMRR) and excellent frequency characteristics, even at measurement frequencies of 10 kHz or higher. As such, the CT1000S is an ideal solution for test applications that require wide-bandwidth, high-current measurement.

Development Background

The rising importance of energy efficiency across all industries is driving demand for increasingly accurate power measurements in high-current applications such as electric vehicles, trains, and renewable energy systems. While Yokogawa’s conventional CT series current sensors can be used in combination with tools such as the company’s power analyzers to perform multichannel measurement of large AC/DC currents and provide valuable insights needed to meet efficiency targets, their installation and removal require the disconnection of wires. With its clamp design, the CT1000S is a convenient and highly precise wide-bandwidth, high-current measurement tool that eliminates the need for the disconnection of wires.

Main Features 1. Wide-bandwidth, high-current measurement

The CT1000S is able to measure AC and DC currents of up to 1000A and has a wide DC to 300 kHz measurement frequency range. A high CMRR and excellent linearity of frequency characteristics ensure precise power measurement in high-frequency applications that have dramatic changes in current levels and thus require a wide dynamic range, while high resistance to electromagnetic noise ensures more accurate readings.

2. Pairable with power analyzers and waveform measurement instruments

For tasks such as the evaluation of inverter carrier fundamental frequency components and reactor losses that necessitate wide bandwidths and the measurement of large currents, the CT1000S can be paired with Yokogawa power analyzers and waveform measurement instruments.
Pairing examples:

• The CT1000S can be used with the DL950 ScopeCorder to perform kHz-range measurements for the analysis of fundamental frequency and carrier frequency components.
• The CT1000S can be used with the WT5000 precision power analyzer to perform highly accurate power measurements. A motor evaluation function utilizes torque and encoder outputs to simultaneously evaluate up to four units.

3. Ease of installation

Thanks to a clamp design that eliminates the need for the disconnection of wires, the CT1000S current sensor is easy to set and remove. To ensure stable measurements and enhance reproducibility, the CT1000S sensor unit and cable can be fixed in position. Cable lengths of 3m, 5m, and 10m are available.

Major Target Markets

–    Automotive
–    Renewable energy
–    Shipbuilding, railway infrastructure

Applications

–    Evaluation and testing of inverters, motors, power conditioners, and other components
–    Development and evaluation of electric vehicles
–    Testing of large inverter motors used in ships and trains

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Rohde & Schwarz has developed the R&S RT-ZISO isolated probing system, further elevating its cutting-edge oscilloscope portfolio. The new R&S RT-ZISO enables extremely accurate measurements of fast switching signals, especially in environments with high common-mode voltages and currents. Also new is the R&S RT-ZPMMCX passive probe with MMCX connector, which complements the isolated probe system perfectly for certain measurement tasks.

At the PCIM Europe International Exhibition and Conference in Nuremberg, Germany, Rohde & Schwarz is giving a sneak peek at its next generation R&S RT-ZISO isolated probing system. The R&S RT-ZISO will set new standards in isolated probe technology, delivering unprecedented accuracy, sensitivity, dynamic range, and bandwidth for next generation wide bandgap (WBG) power designs with SiC and GaN.

The R&S RT-ZISO provides precise differential measurements of up to ±3 kV on reference voltages of ±60 kV with a rise time of < 450 ps and suppresses fast common-mode signals that can distort and interfere with accurate measurements. Its power-over-fiber architecture galvanically isolates the device under test (DUT) from the measurement setup, providing a much higher common-mode rejection ratio (CMRR) than conventional differential probes. Its key features include bandwidth options of 100 MHz to 1 GHz (upgradeable), a CMRR of > 90 dB (> 30 000:1) at 1 GHz, an input and offset range of ±3 kV, a common mode range of ±60 kV, and a sensitive input range of ±10 mV.

The R&S RT-ZISO isolated probe is the perfect addition to the Rohde & Schwarz oscilloscope portfolio. With the instruments of the next generation MXO series (MXO 4, MXO 5, MXO 5C), the probe enables measurements with the world’s fastest acquisition in the time and spectrum domain, thanks to the  oscilloscopes’ hardware-based acceleration. In combination with the R&S RTO6, design engineers can use the probe for complex analysis tasks that take advantage of the oscilloscope’s high performance and advanced measurement capabilities.

The R&S RT-ZISO is ideal for a wide range of applications, including switching analysis of power converters with WBG materials, double-pulse testing, floating measurements, shunt measurements, inverter design, and motor drive analysis. The isolated probing system comes with a range of probe tips for different measurement needs, including the micro-miniature coaxial (MMCX) connector, square pins, wide square pins and the isolated passive prober. All connectors are rated for CAT III voltages up to 1000 V. It is the first passive isolated prober on the market that allows users to quickly access the test point without designated connectors. In addition, the use of long bandable cables allows the tips to access the DUT at various angles with no additional mechanical stress.

R&S RT-ZPMMCX passive probe with MMCX connector

Along with the R&S RT-ZISO, Rohde & Schwarz is also presenting a new type of passive probe with MMCX connector. The R&S RT-ZPMMCX supports a bandwidth range of > 700 MHz with input voltages of ±60 V DC and 30 V (RMS), making it the ideal complement to the R&S RT-ZISO isolated probing system for low-side gate measurements. The MMCX probe has a very low capacitive load of < 4 pF, which helps to maintain the best signal integrity for preserving the switching waveform shape and timing.

The R&S RT-ZISO isolated probing system and the R&S RT-ZPMMCX passive probe are both available from Rohde & Schwarz. Visitors to the PCIM Europe International Exhibition and Conference, June 11 to 13, 2024, in Nuremberg, Germany, can experience them live at the company’s booth 619 in hall 7. For more information on the R&S RT-ZISO isolated probing system, visit: https://www.rohde-schwarz.com/_334271.html. For an overview of all oscilloscope probes from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/_229530.html

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• Power supply failures are a growing challenge for data center and telecom infrastructure operators   
• Power System Reliability Modeling by Infineon is a pivotal step towards reliable and stable power supply in data centers
• Improved device utilization and data-driven maintenance recommendation translate into enhanced profitability, reduced Total Cost of Ownership and carbon-footprint

Infineon Technologies AG introduces Power System Reliability Modeling, an innovative solution addressing the increasing challenges faced by data centers and telecom infrastructures due to power supply failures in the system. With 39 percent of downtimes attributed to power outages and an average cost of $687,700 per downtime, the need for seamless operations and mitigation of financial impact is urgent. By integrating Infineon’s power monitoring solution, organizations can enhance operational resilience, reduce their carbon-footprint and achieve substantial cost savings. The offering consists of an algorithm running on a digital power controller, thus integrating software and hardware. This is in line with Infineon’s strategic approach to provide customers with comprehensive system solutions that include both semiconductor devices and matching software tools. Target applications of the solution include DCDC converters, ACDC rectifiers and IBC modules utilized in data centers, AI servers, GPUs, and telecom networks.

Power System Reliability Modeling acts as a bridge between component and system reliability. It enables real-time power supply health monitoring of the system and lifetime estimation based on dynamic system operating parameters, a power supply system model, and a reliability prediction procedure in digital power controllers by Infineon. This solution ensures improved device utilization and data-driven maintenance recommendations, translating into enhanced profitability and reduced Total Cost of Ownership (TCO). Customers benefit from real-time system diagnostics for their power supply as well as powerful system reliability-based decisions and quality assurance. The solution is easy to use and integrate into existing designs.

“The Power System Reliability Modeling represents a pivotal step for Infineon and its customers towards reliable and stable power supply in data centers,” said Adam White, Division President Power & Sensor Systems at Infineon. “Following our Product to System approach, the solution focuses on delivering hardware integrated with advanced software capabilities. This approach not only expands product capabilities and scope, but also empowers our customers to create more value and scale their operations faster.”

Further information about the solution is available at www.infineon.com/reliabilitymodeling.

Industry professionals are invited to discover and experience a demo showcase of the Power System Reliability Modeling at PCIM Europe 2024. There will also be a keynote presentation at the Technology Stage on June 11th at 10:50 am.

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Predictive analytics systems leverage AI to foresee potential machine breakdowns before they happen, enabling proactive maintenance and optimized operations. Predictive analysis enables users to utilize bite-sized chunks of big data to predict the future behaviour of machines. Historical data provides insights from past events, like machine breakdowns, to inform future actions.

Goals include increased efficiency, reduced inventory management costs, and improved machine operating rates.

Development of OMNI edge

THK, Inc. developed the OMNI edge as an advanced predictive analytics system. The system employs a secure communications network to analyze real-time data of machine components and perform predictive failure detection. It leverages artificial intelligence to explore historical data, identify patterns, and predict future events, thereby answering the crucial question, “What’s going to happen next?”

The OMNI edge technology uses sophisticated algorithms and reference data to quantify the status of components, monitor their condition, and detect part failures before they occur. This results in increased machine uptime and optimal operation. The overall objectives are to enhance maintenance efficiency, lower inventory management costs, and boost machine operating rates.

Why and How Was the OMNI Edge Predictive Analytics System Developed?

With the advent of 5G and 6G technologies, automation and robotization will advance significantly within Industry 4.0 environments. The ability to achieve predictive failure detection and implement preventative measures swiftly will be crucial as machine interconnectivity grows.

A key feature of OMNI edge is its versatility; it can be installed on both new machines and existing ones that customers are currently concerned about. This flexibility, combined with the capacity to gather and analyze large volumes of data, not only enhances the service but also aids in the development of new products and upgrades.

Machine Issues Identified by OMNI edge

• Linear Motion Systems
• Rotary Equipment
• Cutting Tools

Using AI to Predict “What’s Going to Happen Next?”

Linear Motion Systems

Rotary Equipment

• Alert when an abnormality is detected
• Predicted failure mode
• Maintenance recommendation
• Diagnostic

Cutting Tools

Extensive Reference Data in OMNI edge

OMNI edge uses comprehensive reference data to quantify the status of components. This data is essential for monitoring conditions and predicting failures. The reference data is developed through rigorous data collection and analysis, ensuring high accuracy in predictive maintenance.

• Linear Motion Systems
• Rotary Equipment
• Cutting Tools

Reducing Inventory Management Costs with OMNI edge

Traditionally, MRO (Maintenance, Repair, and Operations) parts inventory faces challenges of overstocking, due to the fear of unexpected failures, or understocking, which can halt production lines. Both scenarios lead to excessive costs. OMNI edge helps users predict the failure of machine components, allowing for optimized inventory management. Users can thus manage their MRO parts inventory more effectively by determining the optimal inventory quantity and timing for procurement.

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Designers can speed time to market for their on-board charger application with key technologies from one supplier, including the control, gate drive and power stage

The market for Battery Electric Vehicles (BEVs) and Plug-in Hybrid Electric Vehicles (PHEVs) continues to grow as the push towards decarbonization requires sustainable solutions to reduce emissions. A critical application for EVs is the on-board charger, which converts AC power into DC power to recharge the vehicle’s high-voltage battery. Microchip Technology (Nasdaq: MCHP) today announces an On-Board Charger (OBC) solution that uses a selection of its automotive-qualified digital, analog, connectivity and power devices, including the dsPIC33C Digital Signal Controller (DSC), the MCP14C1 isolated SiC gate driver and mSiC MOSFETs in an industry-standard D2PAK-7L XL package.

This solution is designed to increase an OBC system’s efficiency and reliability by leveraging the dsPIC33 DSC’s advanced control functions, the MCP14C1 gate driver’s high-voltage reinforced isolation with robust noise immunity and the mSiC MOSFETs’ reduced switching losses and improved thermal management capabilities. To further simplify the supply chain for customers, Microchip provides the key technologies that support the other functions of an OBC, including communication interfaces, security, sensors, memory and timing.

To accelerate system development and testing, Microchip offers a flexible programmable solution with ready-to-use software modules for Power Factor Correction (PFC), DC-DC conversion, communication and diagnostic algorithms. The software modules in the dsPIC33 DSC are designed to optimize performance, efficiency and reliability, while offering flexibility for customization and adaptation to specific OEM requirements.

“Microchip established an E-Mobility megatrend team with dedicated resources to support this growing market, so in addition to providing the control, gate drive and power stage for an OBC, we can also provide customers with connectivity, timing, sensors, memory and security solutions,” said Joe Thomsen, corporate vice president of Microchip’s digital signal controller business unit. “As a leading supplier to OEMs and Tier-1s, Microchip offers comprehensive solutions to streamline the development process, including automotive-qualified products, reference designs, software and global technical support.”

Here is an overview of the key components in this OBC solution:

• The dsPIC33C DSC is AEC-Q100 qualified and features a high-performance DSP core, high-resolution Pulse-Width Modulation (PWM) modules and high-speed Analog-to-Digital Converters (ADCs), making it optimal for power conversion applications. It is functional safety ready and supports the AUTOSAR ecosystem.
• The MCP14C1 isolated SiC gate driver is AEC-Q100 qualified and is offered in SOIC-8 wide-body package supporting reinforced isolation and SOIC-8 narrow-body supporting basic isolation. Compatible with the dsPIC33 DSC, the MCP14C1 is optimized to drive mSiC MOSFETs via Undervoltage Lockout (UVLO) for VGS = 18V gate drive split output terminals, which simplifies implementation and eliminates the need for an external diode. Galvanic isolation is achieved by leveraging capacitive isolation technology, which results in robust noise immunity and high Common-Mode Transient Immunity (CMTI).
• The mSiC MOSFET in an AEC-Q101-qualified D2PAK-7L XL surface mount package includes five parallel source sense leads to reduce switching losses, increase current capability and decrease inductance. This device supports 400V and 800V battery voltages.

Microchip has published a white paper that provides more information about how this OBC solution can optimize a design’s performance and speed up its time to market.

For more information about Microchip’s OBC solutions for EVs, visit Microchip’s website.

Development Tools

The dsPIC33C DSC is an AUTOSAR-ready device and is supported by the MPLAB® development ecosystem including MPLAB PowerSmart Development Suite.

 Availability

The main components for an OBC solution including the dsPIC33C DSC, the MCP14C1 isolated SiC gate driver and the mSiC MOSFET in a D2PAK-7L XL package are now available. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

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Power Integrations has introduced the BridgeSwitch-2 BLDC IC family, enhancing their offerings for brushless DC motors (BLDC). This new family of high-voltage integrated half-bridge (IHB) motor-driver ICs targets applications up to 1 HP (746 W). These ICs incorporate high- and low-side drivers and advanced FREDFETs with integrated lossless current sensing, achieving up to 99 per cent inverter efficiency.

Key features of the BridgeSwitch-2 ICs include:

• High Efficiency and Reliability: The IHB architecture eliminates hot spots, enhancing design flexibility and reliability. This also reduces component count and saves PCB space.
• Power Management: These ICs support quiescent BLDC inverters in sleep mode, reducing driver power consumption to under 10 mW.
• Safety and Certification: The ICs work on operational exceptions in hardware, that allow the use of IEC 60730 Class A safety software, significantly reducing certification time.
• MotorXpert Software Suite: This suite includes single-phase trapezoidal control and three-phase sensor-less Field Oriented Control (FOC) modules, expediting inverter development. The GUI-based tool, terminal emulator, and MISRA C-compliant code library facilitate real-time optimization without the need for repeated firmware updates.
• Wide Range of Applications: The power range of 30 to 746 W makes these ICs suitable for a variety of applications such as heat exchanger fans, refrigerator compressors, pumps, and kitchen appliances.
• Built-in Protection and Reporting: They feature DC overvoltage protection, current limits, and real-time phase current (IPH) reporting. The choice of error-flag or comprehensive fault bus reporting supports diverse system requirements and enables failure prediction.
• Compliance and Integration: The ICs meet IEC 60335-1 Class A requirements without an auxiliary power supply, reducing PCB area and component count further.

Cristian Ionescu-Catrina, product marketing manager at Power Integrations, emphasized the low standby consumption and efficiency improvements of BridgeSwitch-2-based motor drives, which help designers meet stringent EU ERP regulations and optimize motor architecture without frequent firmware updates.

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Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at the Moscone Center in San Francisco, California. Visitors to booth 1233 will have the opportunity to see demonstrations of Nordson’s WaferSense® semiconductor sensors, Quadra Pro Manual X-Ray System (MXI), and Gen 7 Acoustic Micro Imaging (AMI) system. Additionally, the innovative SpinSAM AMI system will be unveiled in a video presentation for the first time at the show.

The new SpinSAM AMI system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies. The SpinSAM’s innovative spin scanning method scans up to 4 (300mm) wafers simultaneously at 41 wafers per hour, with best-in-class defect capture and image quality.

With 4 matched waterfall transducers, the system was meticulously engineered to attain full wafer scans in less than 6 minutes. Ideal semiconductor mid-end applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more.

Setting a new industry benchmark for 3D/2D manual inspection in back-end semiconductor applications, the Quadra 7 Pro MXI system revolutionizes the inspection experience with its Onyx® detector technology. This advancement ensures exceptional image clarity and elevated levels of precision and efficiency. The Dual Mode Quadra NT4® tube provides unprecedented flexibility. This innovative technology offers both brightness and resolution modes, enabling operators to seamlessly transition between them according to specific application requirements. This ensures optimal results for a wide range of semiconductor inspection needs.

The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope. Ideal for lab analysis and specialized high-resolution applications.

Lastly, for front-end semiconductor tool set-up and maintenance, the WaferSense® ATS2 multi-camera sensor, paired with CyberSpectrum software captures offset data (x, y and z) to quickly teach wafer transfer positions in real-time without opening the tool.

Visit Nordson Test & Inspection at booth 1233 to experience the future of semiconductor inspection and metrology technology that improves yields, processes, throughput and productivity.

For more information, visit www.nordson.com/testinspect.

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“With TI’s new GaN IPM, engineers can design motor driver systems that deliver all these expectations and operate at peak efficiency.”

Texas Instruments (TI)  introduced the industry’s first 650V three-phase GaN IPM for 250W motor drive applications. The new GaN IPM addresses many design and performance compromises engineers typically face when designing major home appliances and heating, ventilation and air-conditioning (HVAC) systems. The DRV7308 GaN IPM enables more than 99% inverter efficiency, optimized acoustic performance, reduced solution size and lower system costs. It is on display at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM) Conference.

Texas Instruments Incorporated is a global semiconductor company that designs, manufactures, tests and sells analogue and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.

Nicole Navinsky, Motor Drives business unit manager at TI said “Designers of high-voltage home appliances and HVAC systems are striving to meet higher energy-efficiency standards to support environmental sustainability goals around the world. They are also addressing consumer demand for systems that are reliable, quiet and compact. With TI’s new GaN IPM, engineers can design motor driver systems that deliver all these expectations and operate at peak efficiency.”

Advantages of the first GaN IPM                                                                                

1. Improves system efficiency and reliability with TI GaN

Worldwide efficiency standards for appliances and HVAC systems such as SEER, MEPS, Energy Star and Top Runner are becoming increasingly stringent. The DRV7308 helps engineers meet these standards, leveraging GaN technology to deliver more than 99% efficiency and improve thermal performance, with 50% reduced power losses compared to existing solutions.

In addition, the DRV7308 achieves industry-low dead time and low propagation delay, both less than 200ns, enabling higher pulse-width modulation (PWM) switching frequencies that reduce audible noise and system vibration. These advantages plus the higher power efficiency and integrated features of the DRV7308 also reduce motor heating, which improves reliability and extends the system’s lifetime. 

2. Advanced integration and high power density

Supporting the trend of more compact home appliances, the DRV7308 helps engineers develop smaller motor drive systems. Enabled by GaN technology, the new IPM delivers high power density in a 12mm-by-12mm package, making it the industry’s smallest IPM for 150W to 250W motor-drive applications. Because of its high efficiency, the DRV7308 eliminates the need for an external heatsink, resulting in a motor drive inverter printed circuit board (PCB) size reduction of up to 55% compared to competing IPM solutions. The integration of a current sense amplifier, protection features and inverter stage further reduces solution size and cost.

 

Visitors to PCIM can see new products and solutions from TI are enabling the transition to a more sustainable future with reliable high-voltage technology. TI is also demonstrating a new 800V, 750kW SiC-based scalable traction inverter system for EV six-phase motors, in collaboration with EMPEL Systems.

 

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Achieves industry-leading power density by integrating 4th Generation SiC MOSFETs in a compact package

ROHM has developed four models as part of the TRCDRIVE pack series with 2-in-1 SiC molded modules (two of 750V-rated: BSTxxxD08P4A1x4, two of 1,200V-rated: BSTxxxD12P4A1x1) optimized for xEV (electric vehicles) traction inverters. TRCDRIVE pack supports up to 300kW and features high power density and a unique terminal configuration – helps solve the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours.

As the electrification of cars rapidly advances towards achieving a decarbonized society, the development of electric powertrain systems that are more efficient, compact, and lightweight is currently progressing. However, for SiC power devices that are attracting attention as key components, achieving low loss in a small size has been a difficult challenge. ROHM solves these issues inside powertrains with its TRCDRIVE pack.

A trademark brand for ROHM SiC molded type modules developed specifically for traction inverter drive applications, TRCDRIVE pack reduces size by utilizing a unique structure that maximizes heat dissipation area. On top, ROHM’s 4th Generation SiC MOSFETs with low ON resistance are built in – resulting in an industry-leading power density 1.5 times higher than that of general SiC molded modules while greatly contributing to the miniaturization of inverters for xEVs.

The modules are also equipped with control signal terminals using press fit pins enabling easy connection by simply pushing the gate driver board from the top, reducing installation time considerably. In addition, low inductance (5.7nH) is achieved by maximizing the current path and utilizing a two-layer bus-bar structure for the main wiring, contributing to lower losses during switching.

 

Despite developing modules, ROHM has established a mass production system similar to discrete products, making it possible to increase production capacity by 30 times compared to conventional SiC case-type modules. To obtain samples, please contact a sales representative or visit the contact page on ROHM’s website.

Product Lineup

TRCDRIVE pack is scheduled to be launched by March 2025 with a lineup of 12 models in different package sizes (Small / Large) and mounting patterns (TIM: heat dissipation sheet / Ag sinter). In addition, ROHM is developing a 6-in-1 product with built-in heat sink that is expected to facilitate rapid traction inverter design and model rollout tailored to a variety of design specifications.

Application Examples

・ Automotive traction inverters

Comprehensive Support

ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered, such as simulations and thermal designs that enable quick evaluation and adoption of TRCDRIVE pack products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation in similar conditions as practical inverter circuits.

For details, please contact a sales representative or visit the contact page on ROHM’s website.

Terminology

Traction Inverter

Traction motors in electric cars are driven by 3-phase AC power with a phase shift of 120°. Traction inverters convert direct current supplied from the battery into 3-phase alternating current.

2-in-1

To convert DC into 3-phase AC, one high-side and one low-side MOSFET are required per phase for switching. A 2-in-1 configuration combines both of these MOSFETs into a single module.

 

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CarbonScape, a pioneer in sustainable battery materials, is making waves with its innovative biographite technology. This breakthrough aims to revolutionize the electric vehicle (EV) industry by providing a greener alternative to traditional graphite used in lithium-ion batteries.

Biographite: A Game-Changer in Battery Materials

Biographite is a sustainable anode material derived from wood. Biographite offers superior sustainability and a lower environmental footprint than traditional synthetic or mined graphite.

Environmental Impact

• Reduced Emissions: Manufacturing synthetic graphite emits 25-35 tons of CO2 per ton of product, and mined graphite emits 10-15 tons. In contrast, biographite production results in significantly lower CO2 emissions, reducing the carbon footprint of each EV by 5%.
• Renewable Source: Biographite uses forestry byproducts such as wood chips, ensuring a stable and renewable supply.

Performance

It is to be emphasized that biographite matches the performance of synthetic graphite. Rigorous testing with lithium-ion battery manufacturers, including ATL, confirms that biographite performs similarly to synthetic graphite. These tests, protected by intellectual property agreements, have shown impressive results, prompting further investment in CarbonScape.

Addressing Global Graphite Supply Deficit

Projections indicate a global graphite supply deficit of 777,000 tons by 2030. Biographite offers a decentralized solution, reducing dependence on centralized supply chains, particularly those dominated by China. By using forestry byproducts, biographite promotes critical mineral independence and reduces supply chain vulnerabilities.

Sustainable and Cost-Effective Production

Lower Temperature Production: CarbonScape’s patented process converts wood chips and sawdust into biographite through pyrolysis at half the temperature required for traditional synthetic graphite (2,500°C). This approach helps reduce costs and minimize environmental impact.

Carbon Neutral: The use of responsibly sourced forestry byproducts ensures the process is carbon neutral, depending on the grid supply, while remaining price competitive.

Scaling Up Production

CarbonScape is poised to scale up production and establish commercial facilities in Europe and the US. Despite challenges, the company leverages the expertise of its leadership team and strategic partners to meet the surging demand for batteries while maintaining sustainable practices.

Responsible Sourcing

CarbonScape addresses concerns about the environmental impact of wood chip sourcing by committing to responsible practices. Partnerships with companies like Stora Enso ensure sustainability and circularity in the supply chain. By utilizing less than 5% of the forestry industry byproduct generated in Europe and the US, CarbonScape can produce enough biographite to meet half the projected global battery demand by 2030.

Conclusion

CarbonScape’s biographite is a step forward in the right direction in the EV industry. As the world accelerates towards electrification, biographite has the potential to power the next generation of sustainable transportation, significantly reducing the environmental impact of EV batteries and contributing to a greener future.

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Vehicle Network Technology Advancements

A startup specializing in Ethernet-based vehicle network technology is leveraging a 7nm fabrication process to produce advanced chips aimed at meeting the high bandwidth demands of software-defined vehicles (SDVs). These vehicles require significantly more data bandwidth due to features such as advanced driver assistance systems (ADAS), autonomous driving, and over-the-air software updates.

Ethernet-Based Transceivers

The startup has developed Ethernet-based transceivers, designated ENT11100 and ENT11025, capable of supporting multiple data rates (10 Gbps, 5 Gbps, 2.5 Gbps, and 1 Gbps) within the same device. These transceivers are expected to help Original Equipment Manufacturers (OEMs) address the increasing data demands while simplifying thermal design.

• ENT11100: Supports IEEE 802.3ch multi-gigabit (10/5/2.5GBASE-T1) and IEEE 802.3bp (1000BASE-T1).
• ENT11025: Supports IEEE 802.3ch multi-gigabit (2.5GBASE-T1) and IEEE 802.3bp (1000BASE-T1), and is software and pin compatible with the ENT1x100, allowing for a seamless migration path with a single PCB design.

Advanced Fabrication Process

Ethernovia, the company behind these transceivers, utilizes a 7nm process for manufacturing, which offers several advantages:

• Power Optimization: Enhanced power efficiency due to advanced process technology.
• High Integration Levels: Supports higher levels of integration, resulting in a low power, high port density solution.

Industry Support and Future Developments

Andreas Aal from Volkswagen Group highlighted the importance of fast, secure data transmission for electrification, connectivity, and automated driving functions. Ethernovia’s new PHY devices meet these needs by offering energy-efficient, high-bandwidth, and low-latency data transmission with embedded co-optimized safety and security IP. This paves the way for a seamless transition to future software-defined vehicle architectures.

These transceivers are part of Ethernovia’s planned family of products, which will include a high-bandwidth, low-latency switch being developed in partnership with Continental, a leading OEM. The single-port ENT11100 and ENT11025 are currently open for customers, with quad-port devices expected to be introduced later this year.

Conclusion

Ethernovia’s advanced 7nm Ethernet-based transceivers are set to play a crucial role in the evolution of software-defined vehicles, providing the necessary bandwidth and performance to support the growing demands of modern automotive technology.

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When developing specialty interconnects such as flexible circuits, rigid-flex circuits, flexible heaters, or membrane switches, the primary goal is to ensure these components can perform reliably in challenging applications. Trends like miniaturization, connectivity, wearables, and mobility necessitate the use of specialty interconnects over traditional rigid PCBs. The design phase is crucial to achieving a high-performing specialty interconnect.

The Importance of Design Expertise

Design expertise is pivotal in creating an effective specialty interconnect. Customers often seek custom solutions tailored to their specific applications, and the design phase involves several key considerations:

• Material Selection and Properties: Understanding the materials and their properties is essential for creating a reliable interconnect.
• Mechanical and Electrical Challenges: Determining how the circuit will be used and addressing any mechanical or electrical challenges that may arise.
• Environmental Conditions: Considering the environmental conditions the circuit will face.
• Installation and Usage: Ensuring the design accommodates the installation and usage requirements of the circuit.

Benefits of Working with Experienced Application Engineers

Experienced application engineers bring significant value to the design and development process:

• Cost-Effective Solutions: They can identify cost-saving opportunities, such as reducing the number of layers or optimizing design features.
• High Yields: Expertise in pushing and relaxing design rules to achieve high yields.
• Faster Development: Their experience allows them to resolve issues quickly and efficiently, reducing the number of design revisions needed.
• Prototyping and Troubleshooting: Expert engineers can quickly identify and address problems during prototyping, saving valuable time and resources.
• Design for Manufacturability: They ensure the design can be manufactured reliably and cost-effectively.

Case Studies

Rapid Issue Identification: A top flex engineer quickly identified a problem that in-house engineers had been unable to resolve for weeks, highlighting the value of expertise.

Costly Mistake with Low-Cost Supplier: A customer initially chose a low-cost supplier without design expertise, leading to significant delays and increased costs due to multiple revisions and performance issues. Switching to a supplier with design expertise ultimately resolved their issues.

Conclusion

To build a better specialty interconnect, start with the design phase and partner with experienced application engineers. These experts will guide you to cost-effective, reliable solutions and help you avoid costly pitfalls. By choosing a supplier that combines superior expertise with competitive pricing, you can achieve the greatest overall value and develop a better specialty interconnect.

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The V-harvester board is a photovoltaic (PV) harvesting backup demonstration circuit. It is a sophisticated stand-alone board charged using TEMD5080X01 micro PV cells or with micro USB. The input power goes into an e-peas low power AEM10941 controller, where it is stepped up to the supercapacitor voltage of 4.2 V. Upon power demands at the interface or ENLV, ENHV settings, the controller converts the supply voltage to the target voltages using low dropout regulators (LDO).

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Showcasing their latest advancements in battery systems, Bosch Rexroth’s automation technologies are prominently featured at the Michigan CIC, with a centrally located Battery Module Demonstration Room. Resembling a pilot line, this room features a broad spectrum of Bosch Rexroth technologies from its automation portfolio, covering cell production, modular assembly, and end-of-line testing, among other functions.

Process Reliability

Various types of batteries necessitate distinct production methods for converting electrode films into cell elements. Whether it’s pouch cells, prismatic cells, or cylindrical cells, high dynamics and precision are essential for separating or stacking the cathodes and anodes. Bosch Rexroth boasts deep expertise in dry room and clean room production, including long-term component testing, ensuring high-quality standards and reliable production processes.

Technologies on Display for Cell Production:

1. VarioFlow plus Conveyor System:

• A tight turn radius minimizes tool footprint.
• Swift and efficient transportation of cells within process stations and between machines
• Items can be conveyed either on pallets or directly on the conveyor system
• Configurable for utmost design flexibility, handling high-volume products horizontally, vertically, and around obstacles.

2. Rexroth Flexible Transport System Pallet Boost:

• A highly dynamic transfer system propelled by magnets, ideal for high-throughput machines and assembly lines
• Synchronous and asynchronous bi-directional transfer.
• Compatible with standard TSplus modules for creating a complete loop or as a stand-alone section.
• Precise motion profile and stopping control with acceleration up to 30 m/s² and speed up to 5 m/s.
• Positioning repeatability down to ±20 μm.

Battery Pack Assembly

Process-reliable smart conveyor and positioning systems are crucial for battery module assembly. The Battery Customer Innovation Center showcases Bosch Rexroth’s advanced automation technology, including linear modules and Cartesian systems for precise positioning, as well as advanced resistance welding systems.

Linear Modules and Cartesian Systems:

• Pre-configured components designed to reduce engineering, assembly, and start-up time.
• The LinSelect system configurator swiftly integrates with the latest BOM and CAD models
• High system dynamics and stiffness, with repeatability to ±50 μm.
• Compatible with dry-room environments.

Resistance Welding Systems

The Battery CIC includes a resistance welding lab featuring Bosch Rexroth’s modular system with advanced welding controls, AC or MFDC inverters, and control software, along with interfaces for all popular fieldbuses. These systems are designed to enhance the overall system and process reliability, with Weld Spot Analytics software assisting welding engineers in making better, more assured decisions. Together with adaptive control, these features ensure high-quality welds and minimize inefficiencies in high-production environments.

End-of-Line Testing

Battery packs are complex devices that must meet stringent safety standards. Bosch Rexroth’s end-of-line (EOL) test systems at the Battery CIC feature scalable IndraDrive ML and fastPLC system ILC, offering:

• Efficient utilization of shared hardware for power supply, drive inverter, and DC/DC converter
• Efficient line regeneration and low harmonics.
• High power handling (up to 1000V DC and 500kW).
• Achieving the lowest ripple of DC voltage and current
• Compact footprint, cabinet size, and system weight.
• Future-proof open connectivity with protocols such as PROFINET, EtherCAT, Sercos, Ethernet/IP, Modbus TCP, OPC-UA, LabView, Simulink, and Java.

Bosch Rexroth’s innovative automation technologies at the Michigan CIC demonstrate their commitment to advancing battery system production, ensuring process reliability, and enhancing overall efficiency and performance.

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•  Infineon takes a pioneering role in the semiconductor industry and creates transparency for its customers regarding the climate impact of individual product families
• Infineon aims to eventually cover its entire product portfolio
• Providing carbon footprint data at the product level is another major milestone in Infineon’s sustainability strategy

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will provide customers with comprehensive Product Carbon Footprint (PCF) data, taking a pioneering role in the semiconductor industry. The company is committed to eventually providing PCF data for its entire product portfolio, starting now with about half of its portfolio. The initiative will empower customers to advance their own sustainability goals and reduce their carbon footprint effectively along the entire supply chain. The Product Carbon Footprint is a metric that quantifies the greenhouse gas emissions associated with an individual product, allowing the comparison of different products’ climate impact. Infineon will share more insights with customers at the upcoming PCIM trade fair in Nuremberg, Germany, from 11 to 13 June 2024.

“By providing comprehensive Product Carbon Footprint data, we are driving the vision of a net-zero society and empowering our customers to reduce carbon emissions even more effectively,” says Elke Reichart, Member of the Management Board and Chief Digital and Sustainability Officer at Infineon. “Infineon is taking a leading role in carbon transparency by committing to include the entire product portfolio over the coming years. This underlines our ambition to be a leader not only in terms of technology, but also sustainability.”

The specific data Infineon provides on its individual products is essential for the growing number of customers who want to increase transparency on their own carbon footprint. Moreover, it supports informed decision making to leverage additional potential for reducing emissions along the value chain.

In the absence of established industry standards, Infineon has developed a robust methodology to calculate the Product Carbon Footprint, incorporating customer needs and best practices. Infineon includes emissions from raw materials and supplies, its own manufacturing processes, manufacturing partners and transportation to the customer (“from cradle to gate”). This means that the Product Carbon Footprint reported by Infineon covers scope 1 and 2 emissions as well as scope 3 emissions from suppliers and manufacturing partners, all the way to the customer’s gate. The Product Carbon Footprint is expressed in kilograms of carbon dioxide equivalent (kg CO2e).

Infineon has published the assessment of reference product families on the Infineon website.

Driving transparency goes hand in hand with Infineon’s strong commitment to decarbonization and digitalization. Infineon’s products make a major contribution to the global energy transition and thus to a net-zero society. They are used in solar and wind power plants, electric cars and increase energy efficiency in numerous applications, including AI data centers. Over their lifetime, the company’s chips overall save 34 times the amount of CO2e emitted during their production.

Breaking the carbon footprint down to the product level is another major milestone in Infineon’s sustainability journey. Infineon has already pledged to achieve carbon neutrality by 2030 for direct and indirect emissions (scope 1 and 2). Last year, the company additionally committed to setting a science-based target encompassing supply chain emissions (scope 3) as well.

 

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Generative AI is revolutionizing Windows applications and games by enabling new capabilities, such as unscripted, dynamic NPCs, novel works of art, and significant frame rate boosts in gaming. As generative AI’s applications and capabilities expand, the demand for computing power to support these workloads increases. Hence comes into play Hybrid AI, which is an amalgamation of onboard AI acceleration of NVIDIA RTX and cloud-based GPUs to meet these requisites effectively.

Hybrid AI: A Harmonious Solution

Hybrid AI synergizes local PC and workstation computing with cloud scalability, offering flexibility to optimize AI workloads based on specific use cases, cost, and performance:

1. Local AI on RTX GPUs:

• Delivers high performance and low latency.
• Always available, even offline.

2. Cloud-based AI:

• Runs larger models and scales across many GPUs.
• Serves multiple clients simultaneously.

By leveraging both local and cloud resources, Hybrid AI ensures AI tasks run optimally, whether locally or in the cloud, and accelerates these tasks using NVIDIA GPUs and AI stacks, including TensorRT and TensorRT-LLM. This results in reduced wait times and enhanced AI-powered features for users.

Tools and Technologies Supporting Hybrid AI

Several tools and technologies from NVIDIA support hybrid AI workflows for creators, gamers, and developers:

For Creators: Dream in the Cloud, Realize Locally

Generative AI empowers artists to ideate, prototype, and brainstorm new creations. For example:

Generative AI by iStock, powered by NVIDIA Edify:

• Provides a generative photography service built for and with artists.
• Offers extensive tools to explore styles, and variations, modify parts of an image, or expand the canvas.
• Allows artists to ideate multiple times and bring concepts to life quickly.

Once the creative concept is ready, artists can utilize RTX-powered PCs and workstations for AI acceleration in over 125 top creative apps, including Photoshop, DaVinci Resolve, and Blender.

For Gamers: Hybrid ACE Revolutionises NPC Interaction

Hybrid AI, through NVIDIA ACE, enables interactive PC gaming by integrating generative AI models into digital avatars on RTX AI PCs. This allows developers to create NPCs that can understand and respond to human player text and speech in real time, enhancing the gaming experience.

For Developers: A Hybrid Tool That Runs Anywhere

Hybrid AI assists developers in building and tuning new AI models. NVIDIA AI Workbench helps developers:

• Create, test, and customize pre-trained generative AI models and LLMs on RTX GPUs.
• Access repositories including Hugging Face, GitHub, and NVIDIA NGC.
• Reproduce, collaborate on, and migrate projects easily.
• Scale up projects when additional performance is needed, and bring them back to local RTX systems for inference and light customization.

The Hybrid RAG Workbench project allows developers to:

• Create customizable RAG applications.
• Embed documents locally and run inference on local RTX systems or cloud endpoints.
• Adapt projects to use various models, endpoints, and containers.
• Quantize models to run on their preferred GPU.

Conclusion

Hybrid AI powered by NVIDIA GPUs offers a seamless integration of local and cloud resources, providing creators, gamers, and developers with optimized AI workflows. This enables the realization of cutting-edge AI-powered features, driving innovation and performance across a wide range of applications. Whether developing new AI models, creating art, or enhancing gaming experiences, hybrid AI solutions provide the best of both worlds for AI enthusiasts and professionals.

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The United States Department of Commerce will provide funding to promote the deployment of open networks in the U.S. and abroad. Rohde & Schwarz and VIAVI offer joint test solutions to meet the needs of radio equipment manufacturers who plan to apply for the funding.

Rohde & Schwarz and Viavi Solutions Inc. (VIAVI) today announced an expansion of their partnership delivering state-of-the-art O-RU testing. These solutions are ideally suited to the needs of radio manufacturers planning to bid for the United States Department of Commerce’s National Telecommunications and Information Administration (NTIA) Public Wireless Supply Chain Innovation Fund (PWSCIF) Second Notice of Funding Opportunity (NOFO 2), which focuses on Open Radio Commercialization and Innovation. Since the launch of this partnership, Rohde & Schwarz and VIAVI have established a reputation for compact, flexible solutions drawing from the strengths of both companies while delivering a seamless user experience. The two companies offer:

O-RU Conformance Test

Fronthaul conformance tests, defined by the O-RAN ALLIANCE, ensure that O-RUs are interoperable with the O-RAN distributed unit (O-DU). The joint test solution includes:

• The R&S SMW200A vector signal generator, R&S FSVA3000 signal and spectrum analyzer and the R&S VSE signal analysis software from Rohde & Schwarz, to emulate a real-world radio environment by generating, capturing and analyzing RF signals, extended for O-RAN applications.

• The TM500 O-RU Tester from VIAVI, implementing the O-RAN Distributed Unit (O-DU) side of the M-plane and C/U-plane functionality necessary to configure the interface with the O-RU and exchange of I/Q data over the Open Fronthaul.

• The O-RU Test Manager application, providing a single point of control for the integrated system, simplifying testcase workflow while allowing deeper data inspection and analysis as needed.

The same set-up can be also used for performing conformance cases defined by 3GPP TS 38.141/36.141 for 5G/LTE base stations (BS).

Test Scalability

As O-RAN radios move to commercial deployment, development testing needs to move beyond lab validation of conformance to greater use case and functionality testing within R&D. These newer use cases prioritize simplicity, speed and cost effectiveness in testing. The R&S PVT360A is a compact, single-box vector signal analyzer (VSA) and vector signal generator (VSG) that combines with the VIAVI TM500 O-RU Tester and VIAVI O-RU Test Manager Application for a more scalable solution, providing a cost-optimized and simpler setup that is well-suited for R&D teams that require multiple test lines to accelerate time to market. The TM500 O-RU Tester can also be scaled to provide direct performance testing such as uplink and downlink data performance and capacity testing.

Network Energy Saving

O-RAN radio units (O-RU) consume the majority of power in 5G radio access networks. Network equipment manufacturers and service providers are prioritizing O-RU energy efficiency without sacrificing performance. Rohde & Schwarz and VIAVI have developed a fully automated testbed to verify O-RU energy efficiency, including the R&S RTO6 oscilloscope, R&S NGP800 power supply and the VIAVI TM500 O-RU Tester. The TM500 O-RU Tester emulates the DU, synchronizes and configures the O-RU and offers several test scripts to verify O-RU energy efficiency under different load conditions. The R&S equipment can then monitor dynamic device activities versus power consumption: The oscilloscope monitors energy dynamics under various traffic conditions by tracking power changes over time, while the power supply – besides powering the O-RU – also provides high measurement resolution and accuracy over a long period of time. The O-RU Test Manager Application ensures a seamless user experience across the testbed.

Alexander Pabst, Vice President Market Segment Wireless Communications at Rohde & Schwarz, said: “Our joint O-RU conformance test solution has been used to test a wide range of different O-RUs at global plugfests of the O-RAN ALLIANCE over the last years. It has a solid presence at Open Testing and Integration Center (OTIC) labs worldwide and was instrumental in initial O-RU certifications in Asia and most recently also in the first certification in Europe. With this long track record, we are now set to serve the efforts of the NTIA to bring forward Open Radio technology. This is putting the successful collaboration between Rohde & Schwarz and VIAVI to the next level.”

Ian Langley, Senior Vice President and General Manager, Wireless Business Unit, VIAVI, said: “Rohde & Schwarz and VIAVI are proud to support the NTIA Open RAN Innovation and Commercialization based on our best-of-breed approach with a unified customer experience. Since we first began offering O-RU conformance testing, open radios have advanced significantly, and test requirements – from scalability for use across the development cycle, to energy saving, have become critical. We are pleased to expand our partnership into these new areas.”

For more information on O-RAN testing solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/wireless/O-RAN

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Transphorm’s high-performance, high-reliability SuperGaN power semiconductors are making significant strides in the power electronics market by leveraging one of the largest power GaN IP portfolios, comprising over 1,000 patents. These advancements are encapsulated in a normally-off d-mode GaN platform that ensures top-notch robustness and reliability. Products utilizing SuperGaN FETs benefit from higher power density, improved efficiency, and reduced total power system costs compared to alternative solutions.

Fundamental Physics and Technological Advantages

The superior performance of SuperGaN devices is rooted in their fundamental physics. The platform’s inherent advantages include:

• Industry-Leading Efficiency: Achieving efficiencies greater than 99%, SuperGaN devices set a benchmark in the industry.
• Higher Power Density: Up to 50% higher power density allows for more compact and efficient power systems.
• Lower System Cost: With up to 20% reduction in system costs, SuperGaN provides a cost-effective solution.
• Proven Robustness and Reliability: Ensuring long-term performance and dependability.
• Compatibility: Drop-in and drive compatibility with all other high voltage power technologies.
• Wide Power Application Range: Supporting applications from 40W to 7.5kW, with future expansions to higher power ratings.

Innovations and Industry Firsts

Transphorm’s GaN technology has led to several ground-breaking innovations:

• 1200 V GaN-on-Sapphire Device: Expected to be commercially available by mid-2024, this device marks a significant milestone in GaN technology.
• Short-Circuit Withstand Times: Achieving withstand times of five microseconds, demonstrating superior robustness.
• GaN Four Quadrant Switch: Featuring true voltage and current bidirectionality control, enhancing flexibility and performance in power systems.

Strategic Partnerships and Market Impact

Element14’s Product Category Director for Passives & Semiconductors, Jose Lok, emphasized the importance of partnering with Transphorm. This collaboration supports the delivery of high-quality products and offers customers a broader choice of manufacturers and GaN device packages to meet diverse design needs.

Vipin Bothra, VP of Sales for North America and Europe at Transphorm, highlighted the transformative impact of the SuperGaN platform on the power electronics market. By driving major design and performance advantages, Transphorm’s GaN devices are being adopted globally across consumer, industrial, and automotive markets. Partnering with respected global distributors like element14 is crucial for meeting customer needs and revolutionizing power systems across various applications, from adapters and PCs to renewable energy systems and electric vehicles.

Conclusion

Transphorm’s SuperGaN power semiconductors represent a versatile and future-proofed solution for the power electronics industry. Their high efficiency, robustness, and compatibility with a wide range of applications make them a compelling choice for designers and manufacturers aiming to enhance performance and reduce costs in their power systems.

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