ELE Times

As you grow up, make the transition from school to college, and eventually get a job, you understand by then that versatility is an important thing. The wonder of versatility is such that it can trump almost anything. If you are versatile, if you can adapt, you will do good. In case you are wondering why an article about the top battery manufacturers of India is talking about versatility, your concern is justified. But, the thing about batteries is that of all the electronic items, it is perhaps that one equipment that justifies versatility from the first letter to the last.

2017 was a good year for Indian battery manufacturers, and so was the year before that. In fact, India’s battery manufacturing industry has consistently been one of the biggest. Yes, China still remains to be the market leader globally, but India is not behind its northern neighbors. Batteries find an application in all walks of life. From automobiles to automation, from solar energy to wind energy, and from smartphones to air conditioners, there is hardly an area where batteries don’t have an application. Naturally, India’s battery industry has shown an annual growth rate of more than 25 percent year after year. And in 2018, it is well poised to show a similar growth rate.

To pay homage to the tremendous battery manufacturing industry in India, ELE Times decided to list the 10 biggest battery manufacturers in India. Take a look:

Exide Industries Ltd.

Just face it, even if you are someone who has nothing to do with batteries, you know this name. You have seen it on trucks, on cars, on inverters, and probably every place else that needs a battery. Exide is one of the biggest manufacturers of batteries not only in India, but in the whole world. Naturally, their batteries are not only distributed in the subcontinent, but also make for a large chunk of India’s battery exports. From manufacturing battery capacities of 2.5Ah to as high as 20,500Ah, Exide deals in a wide gamut of production, contributing to a number of big and small industries in the process.

Luminous Power Technologies Pvt. Ltd.

Luminous started operations back in 1988 and has since then gone on to establish itself as one of the biggest battery manufacturers in India. From batteries for home and commercial use, the company’s portfolio caters to a large operations. From industrial batteries to power back up batteries, the company has battery solutions for a number of different industries. Luminous is undoubtedly one of the leading battery manufacturers in India, but aside from that, the company also has a strong global presence with 28 sales offices and 3200 channel partners.

Amara Raja Batteries Ltd.

When it comes to lead acid batteries, there are a few companies bigger than Amara Raja. Its batteries find biggest use in the automobile industry under the brand name of Amaron. The company not only makes batteries for distribution in India, but exports its products Africa, Asia Pacific, and the Middle East.

HBL Power Systems Ltd.

Founded in 1997, the company has made a name for itself by producing world class power solutions. HBL Power Systems finds the biggest buyers in the aviation industry. Apart from airways, the firm distributes its batteries to other sectors like railways, defence, and other heavy industries.

Su-Kam Power Systems Ltd.

Growing up as a kid, if you used to own an inverter, chances are that you already are familiar with the name of Su-Kam Power Systems. This is a company that has been around since most of us were kids and it continues to be one of the biggest battery manufactures in the country today. To know more about the manufacturing prowess of the company, consider this: the company produces more than 70,000 batteries every month.

Okaya Power Pvt. Ltd.

With a dealer network of more than 50,000, and more than 1500 distributors, Okaya is one of the fastest growing battery manufacturers in India. Stationed in Himachal Pradesh, the company deals in providing a wide range of power solutions. As of now, Okaya boasts of more than 5 million installed batteries in the country.

Base Corporation Ltd.

Being Base Corporation means that you are a truly global company. The company began operations in 1987, and with time expanded to China and Dubai. If that is not enough to justify the magnanimity of the company’s battery manufacturing might, then you’d be pleased to know that Base makes batteries for any sector you can name. With a workforce of more than 1,500 people stationed across 30 different offices in the country, Base provides fuss free power solutions to its customers.

Southern Batteries Pvt. Ltd.

From flat plate batteries to lead acid batteries; from traction batteries to automotive, Southern batteries Pvt. Ltd. has spread its wings across all industries imaginable. It is a ISO certified company, and deals majorly in providing power solutions to the automotive, solar, and railways industry. Stationed in Bengaluru, the company started its operations way back in 1980, and has today established its name as one of the best battery manufacturers in India.

Evolute Solutions Pvt. Ltd.

Evolute Solutions has its headquarters in India’s financial capital, Mumbai. The company manufactures batteries in all shapes and sizes. Among its varied caterings, it makes batteries or mobile phones, inverters, UPS, and automobiles.

True Power International Ltd.

True Power is one of the biggest names in power electronics. Equipped with a solid R&D team and cutting edge technology, the company has slowly made its progress into the upper echelons of the battery manufacturing industry.

There is a battery for every need. Imagining our lives without batteries, would really be a tough thing to do. And thanks to these Indian battery manufacturers, we can now use batteries that are made in our very own country.

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Art Pini, Digi Key

Portable and battery-powered devices are everywhere, and increasingly they’re taking control of everyday functions. A perfect example is those little robotic vacuums with motors for mechanical motion and directional control. While these may seem like an everyday function now, the electronics inside these little robots continue to push designers to the limits of small form factor, weight, and power efficiency, while packing a full processing toolbox.

It helps when much of the requisite electronics can be packed into one IC. That’s the case with Analog Devices’ MAX32672GTL+. This is a very small, ultra-low-power, highly integrated 32-bit microcontroller designed especially for battery-powered devices and wireless sensors. It has a powerful ARM Cortex M4 processor with a floating point unit (FPU), and it fits right into the device designs I mentioned due to its complex sensor processing and battery life optimization.

Applications for the MAX32672GTL+, as you might imagine, include motion/motor control, industrial sensors, and battery-powered medical devices. Its application can also be stretched to optical communication modules and secure radio modem controllers.

The functional block diagram of the MAX32672GTL+ reveals the versatility of this little powerhouse.

Starting with the memory, the MAX32672GTL+ integrates 1 megabyte (Mbyte) of flash memory and 200 kilobytes (Kbytes) of SRAM. The internal flash memory with error correction is used for non-volatile programs and data storage. It is organized in two equally sized banks to allow execute-while-write operations for live firmware updates.

The internal 200 Kbyte SRAM supports low-power retention of application information and related data. For enhanced system reliability, the SRAM can be configured as 160 Kbytes with single-error correction and double-error detection (SEC–DED) codes to protect memory devices from data corruption. Error correction coding is important: implemented on the entire flash, RAM, and cache, it ensures extremely reliable code execution in the presence of harsh environmental conditions.

For all-important power management and control, functions include multiple modes that provide a mix of high-performance and low-power consumption options. These include supply voltage and brownout monitors to ensure proper operation during power-down and power-up events, and unexpected supply transients.

The MAX32672GTL+ includes lots of I/O bandwidth with multiple serial I/O peripherals, including I2C, I2S, SPI, and UART. The bidirectional I2C interface instances can operate at transfer rates from 100 kilobits per second (kbps) to 3400 kbps. The SPI interfaces can operate at up to 50 megabits per second (Mbps) and support full-duplex operation in a four-wire configuration. The bidirectional I2S audio bus works with audio amplifiers and codecs.

Finally, the UART interfaces provide full-duplex asynchronous serial communications using either two or four-wire bus configurations with an independent baud rate generator. A low-power UART (LPUART) operates in the lowest-power sleep modes to facilitate wake-up activity without any loss of data.

Besides the serial interfaces, the peripheral mix includes up to 42 general-purpose I/O (GPIO) pins, up to four 32-bit timers, up to two low-power, 32-bit timers, and a 12-channel, 12-bit successive approximation register (SAR) analog-to-digital converter (ADC).

From a sheer hardware support point of view, the combination of the serial data links, I/O pins, and the ADC makes the MAX32672GTL+ a powerful controller for motors and other rotating machines which require substantial data processing.

Flexible support accelerates control and robotics designs

Without good support tools, hardware is limited. In the case of the MAX32672GTL+, that’s not an issue. Application-specific tools include the ability to monitor both analog and digital sensors to generate pulse width modulated signals and to decode data from quadrature shaft encoders. I really like tools that are aimed at motor control and robotics applications: they remove much of the complexity and make it a lot easier to get a design up and running.

The quadrature decoder interface deciphers the shaft angle and rotational velocity of a rotating machine shaft based on the two-phase signal lines (QEA and QEB), and the index signal (QEI) from a shaft encoder. User-selected countdowns of X1, X2, or X4 are available to control the angular resolution of the decode operation. The rotation of the shaft is tracked on a 32-bit position counter (QDEC) along with specific events, such as reaching a preset position. The QDEC value indicates the current angular position of the shaft. Other outputs indicate motion, direction, and a change in rotational direction (Figure 2).

Figure 2: The quadrature inputs QEA and QEB—clocked by the quadrature clock—increment or decrement the QDEC counter depending on the direction of rotation. Output signals indicate movement (QDEC_INTFL), direction (QDIR), and a change in direction (QDEC_INTRL). (Image source: Analog Devices Inc.)

The MAX32672GTL+ incorporates Advanced Encryption Standard (AES) hardware to secure the device. AES keys are automatically generated by the software and stored in a dedicated flash region to protect against tampering. It includes a true random number generator (TRNG), providing random numbers for cryptographic seeds or strong encryption keys to ensure data privacy.

All of this processing power is contained in a small 40-pin TQFN-EP package that measures only 5 millimeters (mm) x 5 mm x 0.4 mm. The device has five different power modes offering great flexibility in operation while minimizing power consumption. Operating off a 1.1 volt supply, the microcontroller draws only 61.5 microamperes (mA) per megahertz (MHz) in active mode, up to its maximum clock rate of 100 MHz.

The Analog Devices MAX32672EVKIT# evaluation kit provides a platform for gauging the capabilities of the MAX32672GTL+ microcontroller (Figure 3). Anyone looking into using this microcontroller will find this evaluation board a great starting point for design.

Figure 3: The Analog Devices MAX32672EVKIT# evaluation kit has a MAX32672GTL+ with a pre-programmed demonstration and access to user-developed programs.

When initially powered up, the evaluation board executes a demonstration program. Beyond that, the evaluation board provides access via its internal I/O ports, and software development kits (SDKs) are available for writing your own programs.

Conclusion

The MAX32672GTL+ is a small, low-power, powerful, and flexible solution for motor/motion control, industrial sensors, and battery-powered medical devices: robotic vacuums are a perfect example. With its evaluation kit and rich tool support, I suspect there will be many other interesting designs based on it that will be proliferating soon. Let me know if you have one in mind.

The post Ultra-Low-Power Microcontroller is Ideal for Motion Control in Portable Devices appeared first on ELE Times.

-moxa.com

Thanks to the type of technology around these days, medical industries are now quickly moving toward digitalization. The need to reduce manual errors and increase operational efficiency spurs this digitalization drive that prioritizes the development of electrical health records (EHRs). In addition, COVID-19 has sped up the demand for EHRs so that medical staff can receive patient information effortlessly in real time, helping them to work more efficiently.

Developing EHRs, however, requires collecting a large amount of data from many medical machines scattered around multiple hospital buildings. Hence, many hospital operators are now developing their hospital information systems (HISs) to collect data from these widely distributed medical machines and turn valuable data into EHRs. As a lot of medical machines come with serial interfaces, they rely on serial-to-Ethernet communication to accommodate a modern HIS. These machines range from dialysis machines and monitoring systems for blood glucose, blood pressure, etc. to medical carts, diagnostic mobile workstations, ventilators, anesthesia machines, ECGs, and more. Developing a reliable communication system between HIS and medical machines is therefore crucial. Without reliable connections, a HIS cannot receive accurate data on time to conduct a qualified EHR. Such situations lead to poor diagnostics and a slower treatment process, defeating the purpose of developing EHRs. As serial device servers play a critical role in data transfer between serial-based medical machines and an Ethernet-based HIS, choosing a reliable serial device server is important to enable reliable connectivity. In this article, we will discuss three considerations that deserve your attention when choosing connectivity solutions to develop a HIS and how these solutions help.

Many medical machines require constant moving from one room to another to serve different patients. Wireless communications can solve connectivity issues for these mobile medical machines. Thus, using a serial device server that supports wireless connections can help you connect your mobile medical machines to a HIS through wireless networks. Despite its convenience, it is challenging to keep wireless connections stable. If you choose to develop wireless networks, you need to have sufficient APs in your hospital so that your medical machines can stay connected while moving them around. When medical machines move between different APs, your serial-to-wireless device servers require fast roaming between them to reduce switching time and minimize the chances of being disconnected. Once a wireless disconnection and instability occur, the port buffering function can be a bonus for your serial-to-wireless communication, because it allows you to store the serial data and resent it when the wireless connection resumes. Thus, when you choose a serial-to-wireless device server, check if it has this function, as it can be a great help for HISs in collecting complete serial data from medical machines.

Enabling communication enhances efficiency, but it also comes with increasing security concerns. Serial data in hospitals includes sensitive patient information that requires proper protection. So, when you choose your serial-to-wireless device servers, ensure they can protect your data during wireless transmissions. A feature to look out for is the support of the WPA2 protocol to build a secured wireless connection that encrypts your serial data over wireless networks. In addition, your serial-to-wireless device servers should also support secure boots that only allow authorized firmware to run on your devices, minimizing the chances of getting hacked.

Medical machines have a low tolerance for system downtime. Thus, the serial-to-wireless device servers you choose should be reliable enough to minimize system downtime. Providing a locking screw for stable power input against constant shocks to and vibrations of moving medical carts should be a key feature. In addition, features such as surge protection for your serial ports, power inputs, and LAN ports also enhance reliability and reduce system downtime.

Our NPort W2150A-W4/W2250A-W4 Series serial-to-wireless device server provides secure and reliable serial-to-wireless communications for your HIS. They provide 802.11 a/b/g/n dual band network connections that easily enable your serial-based medical machines to connect with a modern HIS. To reduce packet loss over wireless networks, our serial-to-wireless device servers support a fast roaming function, enabling seamless connectivity for the constantly moving medical carts between different wireless APs. In addition, our offline port buffering function provides up to 20 MB to store your data when the wireless connection is unstable. To protect sensitive patient information, our serial-to-wireless device servers support secure boots and WPA2 protocol to enhance both device security and wireless transmission security.

As an industrial connectivity solution provider, our serial-to-wireless device servers provide locking screws with power inputs and surge protection to enhance device reliability for reducing the chances of system downtime.

• Link serial and Ethernet devices to an IEEE 802.11a/b/g/n network
• Web-based configuration using built-in Ethernet or WLAN
• Secure boot for only Moxa authorized firmware allowed to run
• Secure data access with WEP, WPA, WPA2
• Fast roaming for quick automatic switching between access points
• Offline port buffering and serial data log
• Enhanced surge protection for serial, LAN, and power
• Dual power inputs (1 screw-type power jack, 1 terminal block)
• 5-year warranty to ensure product longevity and quality

Moxa is committed to providing serial connectivity solutions that easily take your serial devices into the future of networking. We continue to develop new technologies, support a variety of OS drivers, and enhance cybersecurity features, committing to provide serial connectivity for you to the year 2030 and beyond.

Source: https://www.moxa.com/en/articles/considerations-for-developing-reliable-hospital-information-systems

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Courtesy- Moxa

In recent years, time-sensitive networking (TSN) has leapt from the pages of academic journals to practical applications in the real world. Companies that want to reap the benefits of this exciting technology must understand the needs of industry players and start to build TSN-enabled systems. Even before the formation of the IEEE TSN task group, Moxa has been working with industry partners to promote digitalization in the manufacturing sector, also known as Industry 4.0, and all the key technologies for industrial automation. Time-sensitive networking (TSN) is a crucial enabler of industrial digitization applications where Moxa has already made valuable contributions. In fact, Moxa has partnered with numerous industry stakeholders to build TSN-enabled systems and bring the proven benefits of TSN to the factory floor through several technological advances and real-world applications.

Traditionally, different equipment, interfaces, and protocols presented serious challenges to transmitting, receiving, and processing large amounts of data in a timely manner for industrial automation applications. TSN overcomes these challenges by enabling time synchronization on the network so that all connected devices share a common time reference for all data to become available at a given point in time for specific tasks. These TSN-enabled systems are highly reliable as its built-in bounded low latency in a deterministic networking environment optimizes performance and security.

Taking the Technology Further

In addition to proving that the technology works, Moxa has also implemented TSN in several real-world applications to help companies achieve tangible business benefits.

Reduce the Total Cost of Ownership in Wafer Manufacturing

Cooperating with ELS System Technology, (a leading Taiwanese lithography solution provider), Moxa successfully integrated TSN into the wafer manufacturing process. The system includes incorporating machine vision into the wafer misalignment correction system. The TSN technology successfully integrated a high-bandwidth video application with a high-reliability on-demand motion control CC-Link IE TSN. The solution delivered a stable motion control system, fully equipped with machine vision, for the misalignment correction system.
Moxa’s TSN solution also supports different types of traffic that may have very different requirements and offers accurate motion control data about network traffic in real time using the same open and standard network. What’s more, the TSN solution also helps increase the economic feasibility of the network and reduces the total cost of ownership (TCO) as the infrastructure is easy to maintain and scale up.

Minimize the Inconvenience of Downtime With Video Component Logging

Real-time video monitoring is notoriously data- and bandwidth-hungry. TSN’s ultra-reliability and bounded low latency make building a converged application for recording and streaming live video over a network a feasible task. To help the Japanese industrial conglomerate Mitsubishi Electric improve the logging of all system components during visual inspections, Moxa built a module with the capability to record the video stream, waveform, and related information to help users speed up troubleshooting when necessary. As they are no longer required to scour through different devices or networks, engineers can now conduct their forensic investigation on a TSN-based integrated system in which critical and synchronized visual data is safely accessed, stored, and protected.

How TSN Helps

TSN is the key to smart factory automation because deterministic, real-time communication allows different equipment to work seamlessly together. As networks grow in size and complexity, TSN implements traffic management and prioritizes system resources to ensure that critical data gets delivered on time, which makes the network ultra-reliable and more secure. We will now consider two use cases that showcase the capabilities of TSN, and how Moxa works with system integrators, machine builders, and end users to achieve better returns with TSN.

Use Case 1: Machinery Manufacturer

Responding to market demands for advanced, integrated, and highly automated machinery, machinery manufacturers aim to offer machinery that features built-in scalability, accelerated sensing, and complex laser and machine control applications. As such, however, different proprietary networks belonging to different components require seamless communication and integration in order to deliver optimal performance. Furthermore, the maintenance of these networks will present challenges for operators, especially when the machines are shipped abroad and training for operators is at times not followed through.

Moxa developed a unified TSN network to enable deterministic communication between cameras, sensors, and machine controls. Moxa’s TSN-G5008 Series full Gigabit managed switch connects multiple I/Os to the servo drivers and machine vision cameras. Due to the “first-in, first-served” nature of Ethernet, it was not possible to transmit critical data on the same cable. With standard Ethernet TSN infrastructure, however, traffic management now allows critical data to share networking resources and ensures data packet delivery. The switch is designed to make manufacturing networks, such as those of machinery manufacturers, compatible with TSN to reap the benefits of Industry 4.0.

Use Case 2: Mass Customization Production System

A shorter production cycle is beneficial to businesses because efficiency leads to lower costs and more flexibility. It also allows businesses to cater to a changing market and offer mass customized—and often higher margin—products, such as commercial-off-the-shelf (COTS) products. For manufacturers, such efficiency and flexibility can only be achieved when various systems—including production, assembly lines, and logistics—are on a unified network so changes and adjustments to the production and distribution processes can be implemented on short notice more effectively.

To make mass customization possible, manufacturers can deploy Moxa’s TSN-G5004 and TSN-G5008 Series Ethernet switches to combine existing proprietary networks into a single TSN-capable network to boost efficiency. Most importantly, manufacturers can achieve information technology (IT) and operational technology (OT) convergence, so as to reduce the number of processes required to make a product. As such, adaptive production, mass customization, and production optimization are enabled because assets are managed through a TSN-enabled network, with which deterministic communication ensures effective control over the entire manufacturing process.

A simplified network topography benefits operators because maintenance becomes easier and more cost effective. As operators now maintain a unified network instead of many networks with different protocols and requirements, training can be streamlined. Cabling, too, becomes more straightforward, contributing to lower maintenance costs.

Boundless Benefits

TSN brings efficiency, easier management, and cost effectiveness to the world of industrial automation. Its deterministic communication, whether wired or wireless, contributes to the ultra-reliability needed for high-stakes and demanding industrial systems. As TSN requires a standard, unified network for different devices, IT and OT convergence offers fewer nodes, streamlined cabling, and easier maintenance. These benefits are realized by a wide range of stakeholders from machine builders to system integrators to end-users.

Machine Builders

With TSN technology, machine builders can leverage a competitive network infrastructure that allows the motion bus and information being sent across the network to be converged on the same cable. This simplified architecture can also reduce the number of nodes thereby saving overall costs and maintenance effort. In addition, from the performance standpoint, the cycle time of the control loop can be shortened, which makes it possible to control more devices. Last, since TSN technology runs on a Gigabit network, the higher bandwidth is well-suited for adding more applications in the future.

System Integrators

The unified TSN network also simplifies network and automation architecture by reducing cabling and engineering efforts. TSN’s ability to converge all proprietary networking technologies into one single cable means that network planning and scale can be controlled and predicted, thereby reducing the total cost of ownership and saving maintenance efforts.

End-Users

Furthermore, TSN is compatible with existing networks so additional network gateways that connect to different proprietary systems are no longer required. In fact, TSN’s compatibility with existing standard networks enables easy data access so that the system can more easily optimize resources and effort for end-users.

Compared to other existing networking technologies, TSN is also better equipped to prioritize critical packets over non-critical but high-bandwidth consuming applications, which reduces overall system downtime.

Last but not least, leveraging standard Ethernet technologies means that the latest cybersecurity solutions developed for Ethernet are also available to TSN networks, offering greater protection and adaptability in an ever-changing threat climate.

Preparing for TSN Adoption

When it comes to implementing a TSN-capable application, a thorough understanding of the existing application requirements and network topology is a prerequisite to choosing the most suitable protocol and the right configurations for the switches and end devices.

Let us consider an example that requires both PLC communications and image capture. This application would require transmitting two types of data to the same host computer. Using a combined network topology, it is clear that the video stream is sent from port 4 to port 1, while the controller sends the synchronization message to the master server from port 2 to port 1.

Protecting the control packet from the high bandwidth video stream requires configuring the necessary protocols on the network, including time synchronization (802.1 AS) and time aware shaper (802.1 Qbv) on the related components and ports.
The control packet is sent at 1 second cycles, 300 µs for cycle date, and 200 µs for time sync data while the remaining 500 µs is running the non-cyclic data. The device can assign the corresponding VLAN ID to each slot to ensure that the cycle data will not be affected.

After clarifying the behavior of the application, the last step is to configure the necessary configurations on the Ethernet switch and end device.

Summary

For a long time, Moxa has been working to ensure that TSN technologies are achieving their true potential and helping industry leaders accelerate their digital transformation in industrial automation. Through the use cases we considered in this article, we hope you have a better understanding of how Moxa has worked with trusted partners and reputable stakeholders to offer future-proof TSN solutions to clients that are at different stages of their digital transformation. Moxa’s dedicated team is ready to work with you on applications where TSN technologies have the ability to make a huge difference.

The post Taking the Proven Benefits of Time-sensitive Networking to the Real World appeared first on ELE Times.

How Qualcomm AI Research is optimizing hardware-specific compilers and chip design with AI

Combinatorial problems are all around us. When we are faced with many choices and we need to find an optimal solution, it is often the case that we are dealing with a combinatorial problem. Some examples of this: airlines need to plan the optimal routes in their networks and companies need to manage their supply chain to properly serve their customers at an optimized cost. Finally, players of the game Go need to strategically plan their moves to cover more territory on the board. The number of potential solutions in Go is remarkable: ~10170.

Combinatorial optimization problems are all around us.

In computer science, there is a popular combinatorial problem that fascinates students and professors alike: the Traveling Salesman Problem. Given a set of N cities with travel distance between each pair, find the shortest path that visits each city exactly once. The full enumeration quickly becomes infeasible as N grows. Using a brute force search method, if a computer can check a solution in a microsecond, then it would take two microseconds to solve three cities, 3.6 seconds for 11 cities, and 3857 years for 20 cities. Thankfully, we have more scalable methods than brute force available: heuristic methods and exact solver methods. Even so, neither of these “traditional” methods fully scales to large problems. They also do not incorporate knowledge from previous problem solving. That is where artificial intelligence (AI) can help.

Develop an AI algorithm that can learn correlation between design parameters and optimization metrics from a limited set of problem instances.

AI leverages learned problem structure, scales to larger instances, offers a general framework, and provides speed/cost/resource benefits. Below, I will focus on two important use cases for Qualcomm: chip design and hardware-specific compilers.

Combinatorial optimization with AI for chip design

Optimizing chip design is important because it needs to account for all business metrics, whether in production cost reduction, power-performance optimization, design efficiency, or capital expenditure. The future of chip design faces a challenge as the advantages of Moore’s Law are slowing down. Design is a long and iterative process. We see that iterative optimization takes several days or weeks to meet Power/Performance/Area (PPA) requirements, and tools do not always converge without manual intervention. The challenges in chip placement are complex:

1. Placing standard cells and macros (memories) optimally
2. Satisfying the design constraints
3. Evaluating PPA efficiently
4. It is a huge combinatorial search problem

It turns out that AI can help with macro placement. That is why we have channelled our research efforts toward it.

If the macro placement were on one line it would constitute a simpler permutation problem, but the actual problem is two-dimensional. Specifying a macro placement requires choosing two permutations, and so pairs of permutations are the search space.  For example, there are (50!)2 possible placements of 50 macros, and we need an efficient search of this large macro placement space. Bayesian optimization proves to be a good method to achieve this. The goal of Bayesian optimization is to find the minimum of a function that is expensive to determine. In the case of chip design, Bayesian optimization learns a surrogate function of the PPA quality metric, which maps each macro placement to an estimate of this metric and uses it to efficiently search over the giant macro placement space. As a result, our model outperforms the standard solver. Overall, data-driven AI optimization can guide algorithmic optimization efficiently toward a solution.

Bayesian optimization can converge faster.

Combinatorial optimization with AI for hardware-specific compilers

The AI compiler converts an input neural net into an efficient program that runs on target hardware, while optimizing for latency, performance, and power. A compiler consists of tiling, placement, sequencing, and scheduling steps of a computation graph. While important decisions are made in each of these steps, in this work we focus on the node sequencing problem of a graph, which determines the complete order of node processing.

Why is finding an optimal sequence challenging? First, the runtime on the target device is expensive to evaluate — it can take minutes to set up the compiler with needed decisions and run one computation graph. Secondly, there is quite a large decision space, as computation graphs can have many thousands of nodes N, and there are N! possible sequences in such a graph. The goal of our research is to find the optimal node sequence that leads to the best on-target performance.

In our paper “Neural Topological Ordering for Computation Graphs” (NeurIPS 2022), we focus on sequencing computation graphs to minimize memory usage, which is also a good proxy for runtime latency. The input is a computation graph for a neural net (with up to tens of thousands of nodes). Our objective is to find a sequence of nodes that minimizes peak memory usage. The application is reducing the inference time of AI models on chips by minimizing access to external memory. It turns out that this can be achieved through end-to-end machine learning for sequencing with reinforcement learning used to train a Graph Neural Network encoder-decoder architecture.

This policy will then be able to generate good sequences for new unseen input graphs.

We used a combination of real and synthetic graphs for training, thus mitigating the data scarcity challenge. We also released the algorithm for creating the synthetic graphs in the same paper. The Neural Topological Order model performs better and is much faster than classical methods, as you can see below. The results are achieved on a real graph test set.

Our model generalizes well and beats baselines comprehensively.

I am excited by the state-of-the-art results Qualcomm AI Research has achieved in combinatorial optimization for chip design and AI compilers. Since combinatorial problems are all around us and even slightly more optimal solutions provide huge benefits, we look forward to scaling combinatorial optimization with AI even further to other technology areas and across industries.

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(PRODUCT MARKETING MANAGER)

5G already extends into millimeter-wave (mmWave) bands and with the advent of 6G, download speeds of 1 TB per second and one microsecond latency will soon be possible. As frequency increases, the propagation losses increase as well. Signal quality is more susceptible to modulation errors, phase noise, distortion, and other impairments. To maintain the same system performance, devices must meet more stringent linearity requirements.

Higher frequency and wider analysis bandwidth capabilities are extremely important to characterize the next generation of wireless and communication devices. Keysight launched the N9032 PXA X-Series Signal Analyzer for RF and microwave applications last year. This analyzer covered frequency ranges up to 8.4, 13.6, and 26.5 GHz at the time of the launch and we are now expanding the frequency coverage to mmWave ranges. We just introduced two new frequency models for 44 and 50 GHz in the N9032B PXA family, that enable 5G new radio (NR) frequency range (FR)2 applications. Same as the RF and microwave version, the new mmWave N9032B offers up to 2 GHz analysis bandwidth. Now we have three models available for 50 GHz signal analysis frequency coverage, at 2 GHz signal analysis bandwidth: the N9032B PXA, the N9040B UXA, and the N9042B UXA X-Series Signal Analyzers. Here are some highlights about the new N9032 PXA X-Series Signal Analyzer:

Unmatched RF/uW Bandwidth:

• The only 8.4, 13.6, and 50 GHz signal analyzer family on the market with up to 2 GHz of analysis bandwidth (4 times wider bandwidth compared to existing models)
• Perfect for wide bandwidth applications including 5G carrier aggregation, 5G amplifier test, 802.11 ax/be, and satellite communication standards.

Superior Performance:

• See small signals near noise and quickly find spurs without having to narrow real time bandwidth and slow sweep speed, with the best sweep displayed average noise level (DANL) (-163 dBm/Hz at 26.5 GHz, and -156 dBm/Hz at 50 GHz)
• Characterize your transmitters more accurately with the best EVM residuals and sensitivity
• Order of magnitude improvement in accuracy by compensating for path losses with U9361 RCal calibrator

Space/Cost Saving:

• All the performance you expect in a 6U-high signal analyzer, now available in a 4U-high form factor
• 33% space savings
• Easy drop-in and replacement for your legacy rack mounted signal analyzer

Today mmWave technology transforms wireless communications. The wireless systems achieve higher data throughput and super-fine rich resolution using ultra-wide bandwidth. The challenges for engineers in these areas are the fact that R&D and design validation tests (DVT) need 3 to 5 times bandwidth for digital pre-distortion (DPD) applications, as well as low error vector magnitude (EVM) to characterize the 5G or WiFi components and devices.

EVM is the most widely used modulation quality metric in digital communications systems, used to quantify the performance of a digital radio transmitter or receiver. It quantifies the performance of transmitters, receivers, and software-defined radios. EVM provides an overall indication of waveform distortion, representing characteristics of a device’s phase, amplitude, and noise.

Keysight has introduced a new technique called cross-correlated EVM (ccEVM), and has applied it on the N9032B PXA as well as many other high performance signal analyzers. ccEVM is available with the PathWave test signal analysis software such as 89601EVMC PathWave VSA, N9054EM0E/N9054EM1E/N9077EM0E/N9077EM1E/N9077EM2E/N9085EM0E PathWave X-App measurement applications to help you get an even more accurate measurement of your device’s EVM. ccEVM is a technique used to extend the dynamic range of a receiver for best EVM performance. By using two receivers you can capture and demodulate the same signal independently and perform cross-correlation on the error vectors to cancel out uncorrelated noise from the receivers, to get a much lower EVM. This technique causes the ccEVM value to primarily contain just the noise coming from the device under test (DUT) (Figure 1). The ccEVM on the N9032B provides impressive improvement for wideband noise-dominated signals. It’s very helpful when measuring DUTs with very low EVM or requiring accurate EVM at low output powers, where displayed average noise level (DANL) of analyzer normally limits the performance.

Figure 1: Cross-correlated EVM (ccEVM) Measurement Technique

Source: https://blogs.keysight.com/blogs/tech/rfmw.entry.html/2023/01/19/revealed_the_newtechniquetoachievethelowest-m2Cx.html

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Courtesy- element14

Aalto University researchers discovered a new and effective technique to perform interaction-free experiments. They used transmon devices, superconductive circuits exhibiting quantum behavior, to find microwave pulses that classical instruments produce. Rather than lasers and optics, the team’s lab focuses on microwaves and superconductors.

“We had to adapt the concept to the different experimental tools available for superconducting devices. Because of that, we also had to change the standard interaction-free protocol in a crucial way: we added another layer of ‘quantumness’ by using a higher energy level of the transmon. Then, we used the quantum coherence of the resulting three-level system as a resource,” Gheorghe Sorin Paraoanu said.

Quantum coherence describes how an object can occupy two states simultaneously. This complex concept may exist, but it’s delicate and could collapse. Researchers didn’t know if this protocol could work. During experimental tests, they discovered a detection efficiency increase. The team realized the discoveries stayed consistent after double-checking their results and putting their theoretical models together. “We also demonstrated that even very low-power microwave pulses can be detected efficiently using our protocol,” Shruti Dogra said.

Additionally, the experiment proved that quantum devices could achieve results that classical devices cannot reach, a quantum advantage phenomenon. Researchers think that quantum computers loaded with ample qubits could achieve a quantum advantage. However, the latest experiment demonstrates that it can occur through a simpler setup.

“Interaction-free measurements based on the earlier, less effective methodology had already noted applications in various specialized processes such as optical imaging, noise-detection, and cryptographic key distribution. This newer and better method may increase the efficiency of all those processes by a wide margin.”

“In quantum computing, our method could be applied for diagnosing microwave-photon states in certain memory elements. This can be regarded as a highly efficient way of extracting information without disturbing the functioning of the quantum processor,” Paraoanu said.

The team is also using their new technique to explore other “exotic forms of information processing.” This includes counterfactual communication (communication between two parties without transferring physical particles) and counterfactual quantum computing, which involves reaching computational results without operating the computer.

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Saskia Hogen, Electrolube

A huge area where protection of electronics is becoming more and more important is the automotive industry with ADAS (Advanced Driver Assistance Systems) and EV’s – most specifically in connection with their range. In this month’s blog, we are going to apply and understand how conformal coatings can make a difference to electric and hybrid vehicles. There are also additional automotive applications, fuelling a vast increase in the demand for coatings.

Advise on some of the typical applications for coatings within the automotive industry?

Ultimately, a conformal coating’s presence is almost limitless. Wherever there’s an electronic circuit board that requires lightweight protection, a conformal coating can be the ideal solution. An example of a coating application within the automotive sector can be sensors, used in ADAS and other supporting applications. This could be an ADAS control unit, PCB or powertrain applications such as the  battery management system PCB; charger PCB; inverter; AC/DC converter, and  transmission switches, to name but a few. There is also a requirement for coatings to protect electronics within the vehicle infotainment system, external and interior lighting, climate control systems, and other electronic controls. There exists a practically endless list of applications within a vehicle.

Working to future-proof the conformal coatings process within EV and automotive applications, MacDermid Alpha has taken some bold moves. Their bio-based coatings perform incredibly well, and contain a higher content of raw materials derived from sustainable sources. The coatings are lighter weight and meet the sustainability requirements of both manufacturers and end users.  The bio-based coatings show improved condensation resistance, thermal stability, flexibility and adhesion than many petrochemical derived polymers.

If we move away from the vehicle itself, to the charging infrastructure, we are faced with charging stations that are exposed to a vast range of climatic conditions;   heat, cold, humidity and corrosive environments, especially near coastlines. Specifically, if we look at the demand for a reliable network of charging points enabling EV drivers to charge their vehicles, we must include the electronics within the charging point in the list of applications for conformal coatings.

Conformal coatings are all around us. They have a discreet but intensely purposeful reason for being, as they offer powerful protection for electronic circuitry against harsh environments and help to extend the reliability and lifetime of devices. We can find conformal coatings in household appliances, white goods and other electronics, in and around our homes, as well as in our workspaces; in manufacturing and other industrial applications. Alongside the surge in connectivity adoption, via IoT, smart cities and smart infrastructure networks, the need to protect electronics in different devices, is becoming more and more important. There is increasing dependability on devices, and consequently, both cyber security, and physical protection of the electronics are escalating in significance. This is a prime example of the key difference that coatings can make.

In addition to being a truly innovative conformal coating solution providers, MacDermid Alpha Electronics Solutions, is fully committed to keeping customers one step ahead of competitors through first-class product, and technical support. The company and its brands, such as Electrolube, talk solutions each and every day.

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The SMT Solutions division of market leader ASMPT will once again demonstrate its position as the industry’s technology pioneer at booth 1701 at the IPC APEX Expo 2023 from January 24 to 26 in San Diego. Among the exhibits will be new DEK TQ L solder paste printer for large circuit boards measuring up to 600 by 510 millimeters and innovative software for the integrated smart factory. Also on display will be the smart shop floor management suite WORKS for optimizing SMT line processes, smart SaaS applications for factory and enterprise uses, and an MES solution that was specially designed for the needs of SMT manufacturers. Modular, manufacturer-independent and retrofittable, all hardware and software solutions being shown fit seamlessly into ASMPT’s Open Automation concept for the economically sensible automation of SMT production.

Best-in-class SMT line

At the ASMPT booth, visitors can see for themselves how high-performance printers, high-end SPI systems, high-performance placement systems, industry-leading feeding solutions and fully automated storage systems work together perfectly and with the highest precision on a fully functional SMT line. And for the first time on U.S. soil, the new DEK TQ L solder paste printer will demonstrate how effectively it handles circuit boards measuring up to 600 by 510 millimeters (23.6 by 20 inches). With this new printer, manufacturers significantly increase their flexibility and product range, thus opening the door to a completely new set of markets.

Full integration for Open Automation

Thanks to open interfaces such as IPC-HERMES-9852 and IPC-CFX, all ASMPT systems are designed for seamless M2M and M2H communication. They fit easily and comprehensively into the modular and manufacturer-independent Open Automation concept for the economically sensible automation of SMT production, which runs as a recurrent theme through the entire trade fair presentation. Today, software is just as important to ASMPT as hardware. With smart solutions and SaaS applications (Software as a Service) for the machine, shop floor, factory and company levels, ASMPT is underlining its technological leadership at APEX in this field as well.

Process optimization on the shop floor

The smart shop floor management suite WORKS covers all production workflows. WORKS Command Center, for example, optimizes employee assignments by automatically generating tasks and sending them to their smartphones, tablets, or smart watches while the WORKS Performance Monitor provides information about all of the production’s relevant performance indicators at the line in real time. And the unique WORKS Process Expert turns the high-end Process Lens SPI system into the world’s first self-learning inline expert system that can control and optimize the printing process fully autonomously if desired.

Intelligent software for the Integrated SMT factory

In the area of factory solutions, ASMPT will focus on SaaS applications such as the Factory Equipment Center, its comprehensive solution for company-wide asset and maintenance management, and on Data Analytics for extensive reporting across the whole enterprise. Virtual Assist is the brand-new AI- and NLP-supported ASMPT expert system that lets users handle all maintenance, repair and service tasks with help from their smartphones or tablets. The system answers concrete questions like an experienced coworker and reduces the time spent looking for information by up to 95 percent. As a special feature, it works even for third-party systems.

Powerful MES for electronics manufacturers

ASMPT recognized at an early stage the hugely important role that software would play today and decided in 2018 to invest in Critical Manufacturing (CMF), an MES developer specializing in the electronics industry. Today, the Portuguese company is also responsible for ASMPT’s software applications on the factory and enterprise levels. At this year’s APEX show, CMF will present its leading “Critical Manufacturing MES”, which was designed to meet the special needs of the electronics manufacturing industry.

“ROI-oriented, modular and retrofittable automation, best-in-class hardware and smart software solutions bring SMT production into top shape, relieve employees, and optimize processes. A visit to our IPC APEX Expo booth will be exciting and informative again this year thanks to ASMPT’s unique spectrum of products and services,” explains Mark Ogden, Head of Marketing AMCAS at ASMPT. “For our customers, North America’s largest event for electronics manufacturing is a very special opportunity to engage in a personal dialog with our specialists and to discuss their individual requirements based on the fully functional production line being shown.”

Source: https://smt.asmpt.com/en/news-center/press/asmpt-at-ipc-apex-expo-2023/

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The Harting Technology Group is expanding its proven Push-Pull connector series. The new Mini Push-Pull represents the waterproof and dustproof version of the ix Industrial. G-bit Ethernet Interface. The perfect choice for fast and reliable data connectivity in demanding industrial environments and applications exposed to the elements.

Its features include

Outdoor resistant

Miniaturisation for demanding applications

Convenient and safe mounting

Mini Push pull is easy to use, well protected and considerably more compact.

New Mini Push-Pull ix Industrial is Introducing new Mini Push-Pull series, HARTING is now providing the ix Industrial Ethernet interface for 10 G-bit Ethernet with Cat. 6 A performance in a waterproof and dustproof version. Standardised according to IEC/PAS 61076-3-124, the ix Industrial mating face in the Mini Push Pull stands for absolutely reliable transmission performance and optional power supply via PoE/PoE+. With a 30 % shorter housing compared to the proven HARTING Push-Pull RJ45, users benefit from a miniaturised data interface for demanding applications. Push-Pull is the preferential device connection technology when it comes to outstanding robustness in combination with simple and process-safe operation in waterproof and dustproof design to IP 65 / IP 67.

Compact, robust jacks are available for device integration on the PCB, providing maximum stability with five THR shield contacts. The jacks are available in three different versions:

1. Horizontal jack
2. Angled vertical jack
3. Vertical jack

All jacks are optionally available in the A and B coding for Ethernet and signals. The data contacts are designed as SMD contacts. This allows device manufacturers to process the PCB jacks according to the normal reflow soldering process. The Mini Push-Pull add-on housing, which fits all matching jacks, is mounted in front of a rectangular mounting cut-out during device integration and connects the PCB jacks providing IP 65 / IP 67 protection to the outside world.

With regard to the integration into the control cabinet and in terminal boxes, the portfolio includes Push-Pull panel feed through in A and B coding. These can be mounted quickly and easily in front of a rectangular mounting cut-out and also meet protection class IP 65 / IP 67 thanks to the integrated seal. Matching dust caps seal unused connectors and device interfaces securely.

Convenient handling

Securely-contacted plug connections are the prerequisite for stable network systems. In order to ensure correct connections also under challenging conditions, Push-Pull connectors are straight forward and intuitive in their operation. Secure locking is signalled by an audible click, and the connection is released by simply pulling on the ergonomically optimised housing. In order to prevent unintentional disconnection, the removal of the connector can be blocked by way of a security ring. Push-Pull connectors are the ideal device connection technology for all industrial electronics devices executed to protection classes IP 65 / IP 67, from sensors to controls and industrial computers.

HARTING Mini Push-Pull ix Industrial field-installable and over-moulded version

Device connectivity with HARTING Mini Push-Pull ix Industrial

HARTING Mini Push-Pull ix Industrial is 30 % shorter than HARTING Push-Pull RJ45

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Designers can create reliable, small and affordable cleaning systems for automotive and industrial applications using TI’s ULC technology

Texas Instruments (TI) introduced the first purpose-built semiconductors with ultrasonic lens cleaning (ULC) technology, enabling camera systems to quickly detect and remove dirt, ice and water using microscopic vibrations.

Removing contaminants from camera lenses traditionally requires manual cleaning, causing system downtime, or the use of various mechanical parts that could malfunction. TI’s new ULC chipset, including the ULC1001 digital signal processor (DSP) and companion DRV2901 piezo transducer driver, features a proprietary technology that allows cameras to rapidly self-clear contaminants using precisely controlled vibrations to rapidly eliminate debris, which improves system accuracy and reduces maintenance requirements. The chipset offers designers a compact and affordable way to use ULC in a wide range of applications and camera sizes. For more information, see www.ti.com/ulc1001-pr and www.ti.com/drv2901-pr.

“ULC can make widespread use of self-cleaning cameras and sensors a reality. Existing cleaning approaches are expensive and impractical, requiring complicated mechanics, costly electronics and significant processing to detect contaminants and execute cleaning,” said Avi Yashar, product marketing engineer at TI. “With the recent proliferation of cameras in a variety of applications, from automotive and traffic cameras to smart cities and manufacturing, there’s a strong need for a simple, cost-effective way to enable self-cleaning cameras.”

The ULC1001 controller includes proprietary algorithms for automatic sensing, cleaning, and temperature and fault detection without any image processing, making ULC technology highly adaptable to various camera lens designs. The chipset’s small form factor makes it possible to improve machine vision and sensing in a variety of applications – any place that a camera or sensor could get dirty. To learn how it works, read the technical article, “Ultrasonic Lens Cleaning: A Solid-State Technology You Didn’t Know You Needed.”

“As advanced driver assistance systems [ADAS] become more sophisticated and drivers rely on them more extensively, it will become more important than ever that the sensor suite is fully operational at all times,” said Edward Sanchez, senior analyst, global automotive practice, Tech Insights. “Dirt or foreign material on a camera lens, which would be just a nuisance in the case of a rear-view camera, becomes a vital functional and safety issue on a vehicle that relies on accurate and precise imaging and sensor data. TI’s ULC approach addresses what will soon be a significant issue in the ADAS and autonomous vehicle market both practically and cost-effectively.”

Reduce system size and complexity with an integrated solution

TI’s ULC chipset eliminates the need for complex mechanical parts and human intervention in lens cleaning systems. The ULC1001 ultrasonic cleaning DSP with proprietary algorithms integrates a pulse-width modulator, current- and voltage-sense amplifiers and an analog-to-digital converter. Used together with the DRV2901 piezo transducer driver as a companion amplifier, TI’s chipset enables ULC in a compact footprint with a printed circuit board size less than 25 mm by 15 mm, reducing the bill of materials while providing more functionality than a discrete implementation.

Package, availability and pricing

The ULC1001 DSP is in volume production and available for purchase on TI.com and authorized distributors in a 4.5-mm-by-5-mm, 32-pin HotRod quad flat no-lead (QFN) package, with pricing at US$6.43 in 1,000-unit quantities. The DRV2901 piezo transducer driver is available for purchase for US$5.35 in 1,000-unit quantities. Full reels are available on TI.com and through other channels. The evaluation module, ULC1001-DRV290XEVM, can be requested on TI.com for US$249. Multiple payment and shipping options are available on TI.com.

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Courtesy: Avnet

While large, traditional telecom operators will shape the 5G market, private and hybrid networks – a combination of private and public – could help underserved groups achieve their connectivity goals.

The development of 5G coincides with a trend toward precision agriculture. Technology is being used to improve the farming industry. Precision agriculture uses automation to increase the efficiency of traditional agricultural activities.

The success of precision agriculture relies on connectivity. 5G networks offer a good solution, but farms typically exist in sparsely populated areas. This makes them low priority for larger network operators. But interest is growing now to address farming’s 5G connectivity challenges.

Network slicing can address the cost of private networks. Network slicing enables several virtualized networks—each optimized for a particular application—to operate over common, shared hardware.

A Statista research report predicts that the worldwide precision agriculture business will be worth $8.7 billion in 2023, rising to $14.4 billion by 2027. This growth will be dependent upon the availability of high-speed communications networks. It’s perhaps no surprise that the U.S. Department of Agriculture (USDA) has invested heavily in rural broadband, the latest tranche of grants and loans coming from their ReConnect Round 4 program (applications closed Nov. 2, 2022) and worth $1.15 billion.

Although not agriculture-specific, the Federal Communications Commission (FCC) launched a Rural Digital Opportunity Fund in January 2020. This is a $20 billion investment over 10 years to improve connectivity for homes and businesses in rural areas. In 2020, the FCC also announced a planned $9 billion fund for 5G for Rural America, of which $1 billion is for precision agriculture.

Rural deployment of 5G is unlikely to be a priority for public network operators, so private 5G is emerging as a viable alternative. Private networks are essentially scaled-down versions of the networks operated by national carriers. Wireless spectrum may be purchased or leased. In the U.S., there is a third option: to license spectrum free of charge under the Citizen’s Broadband Radio Service (CBRS). This is a 150MHz band in the 3.55GHz to 3.70GHz range.

Private networks deliver an unprecedented level of control and perhaps greater data security than using public networks. Privately owned and operated networks can also be less costly when scaling up the number of endpoints, such as sensors.

The cost of network deployment is falling. One contributory factor is open radio access networks (OpenRAN). Open RAN standards facilitate interoperability between network component vendors through the disaggregation of hardware and software. It promises greater hardware and software component interoperability because it is vendor agnostic. It also reduces costs because the hardware elements are commercial off-the-shelf (COTS) server hardware available from multiple vendors. A simplified comparison of conventional and OpenRAN architectures is shown below.

This diagram shows how conventional cellular base station architectures compare with an OpenRAN approach. The lack of proprietary technology creates a more accessible and competitive architecture.

A 2022 report by CoBANK, a U.S. national cooperative bank, modeled the cost of providing private 5G networks to a notional group of 50 representative farms of 8,000 acres each. Based on using free unlicensed spectrum for networks, the report estimated total capital expenditure at $27 million with operating costs thereafter of $300,000. That works out at $54,500 upfront for each farm and annual recurring costs of $6,000.

When you consider that the largest new combine harvesters now cost between $900,000 and $1 million (prices as of May 2022), the broadband outlay is a modest one.

Table above shows CoBANK’s estimate of the CAPEX and OPEX for agricultural 5G private networks.

The cellular radio industry has been quick to form partnerships and alliances to help develop private networks, which are then sold or leased to farms.

Inland Cellular and Trilogy Networks
Idaho-based Inland Cellular, a wireless carrier, has teamed up with Trilogy Networks (Boulder, Colorado) to offer cellular connectivity, including 5G, to Trilogy’s FarmGrid cloud-based, edge-compute platform for farmers.

FarmGrid captures and analyses sensor data and then delivers actionable insights to enable farmers to make real-time productivity decisions. It provides secure connectivity, cloud processing and an app store.

Ericsson and Iowa State University’s Testbed
In June 2022, Ericsson announced that it is supplying 5G equipment for Iowa State University’s research into precision agriculture, rural broadband, renewable energy and public safety. The test bed is a proving ground for 5G network ecosystems. It is run by the Agriculture and Rural Communities organization and supported by the National Science Foundation.

Field Solutions Holdings, Nokia and Mavenir
In Australia, Nokia and Mavenir, a cloud-native communications software vendor, have teamed up with rural carrier, Field Solutions Holdings (FSG), to deliver cellular networks across rural Australia. FSG has secured spectrum licenses and claims that the services will cover 85% of Australia’s landmass. The project will comprise 19 networks operating over 100 4G/5G sites and services will include voice, data, NB-IoT and CatM1.

Australia uses over half of its land for agriculture, so the country represents a great business opportunity for 5G technology companies and agriculture service providers.

Agriculture is one of the largest industries that could see significant benefits from services delivered over 5G networks.

The convergence of these factors promises to create substantial new revenue opportunities:

• Massive IoT data from sensors
• Artificial intelligence for turning this data into actionable insights
• High-speed, low-latency cellular networks that deliver near real-time performance over vast distances

As OpenRAN takes hold, the hardware of 5G networks will be more commoditized. That will create a growing demand for processors, FPGAs, GPUs, SoCs, RF ICs, the plethora of passive and electromechanical components, and discrete semiconductors that always accompany these devices.

In every sense, private 5G networks represent a growing business.

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Automotive, General, Power by onsemi

(Source: onsemi)

High-side SmartFETs have grown in popularity due to their ease of use and the high level of protection. Like standard MOSFETs, SmartFETs are ideal for various automotive applications. What separates them is the control circuitry built into a high-side SmartFET device. The control circuitry constantly monitors output current and device temperature while offering passive protection against voltage transients and other unexpected application conditions. This combination of active and passive protection features ensures a robust application solution, extending the lifetime of both the device itself and the application load it is protecting.

Onsemi now offers a family of high-side SmartFETs ranging from 45mΩ up to 160mΩ. The devices are protected, single-channel high-side drivers that can switch various loads, such as bulbs, solenoids, and other actuators. As shown in Table 1, the device name indicates the typical RDSOn of the SmartFET at 25°C. The complete family of products is listed below:

Table 1: The Complete Family of onsemi High-Side SmartFETs

onsemi’s family of devices is housed in an SO8 package, providing a small footprint while delivering high power. A family pinout for the 45mΩ to 140mΩ devices provides convenience to the designer, allowing one pinout for various application load uses. Simply switch out one device for another depending on the level of current required for a given application. The devices drive 12V automotive grounded loads and provide protection and diagnostic capabilities. The family of devices incorporates advanced protection features such as active inrush current management, over-temperature shutdown with automatic restart, and an active overvoltage clamp. A dedicated Current Sense pin provides precision analog current monitoring of the output and fault indication of short to battery, short circuit to ground, and ON and OFF state open load detection. All diagnostic and current sense features can be disabled or enabled by an active-high Current Sense Disable pin (NCV84160 only), or an active-high Current Sense Enable pin (all other parts in the family).

The “end requirement” from a high-side SmartFET is to switch loads, and there are different alternatives available in the market towards that end. Relays, for instance, have been used for a long time in the industry to switch various automotive loads, especially those requiring high current activation. With a continual reduction in the weight and size of automotive components and assemblies, there has been a transition from relays to semiconductor switches that take up less area and offer improved noise immunity and lower electromagnetic interference than relays.

High-side SmartFETs have become the dominant SmartFET configuration in the automotive market, replacing the generally simpler low-side SmartFET. Figure 1 shows an example of a high-side versus low-side SmartFET configuration. While a high-side SmartFET’s load always connects to the ground with a switched connection to the supply, a low-side SmartFET’S load always connects to the power supply with a switched connection to GND. The SmartFET is typically housed inside a control unit or ECU. The load line is the cable length that connects the load to the pin connector on the ECU. Depending on the load type and its location in the vehicle, this load line could belong, thereby increasing the likelihood of a short to chassis ground which could be a severely stressful condition for the load in a low-side SmartFET configuration. This makes the high-side SmartFET the preferred choice for load switching.

Figure 1: High-Side Versus Low-side Switch in an Application (Source: onsemi)

Figure 2 below shows the top-level block diagram and pin configuration of the NCV84xxx high-side SmartFET family from onsemi. Notice that the high-side SmartFET is, in fact, an NMOS FET, with a Regulated Charge Pump pulling the gate voltage up high enough to drive the load.

The Input (IN) pin is a logic level pin that turns the control logic/charge pump on and off to operate the FET. The Current Sense Enable (CS_EN) pin enables and disables the Current Sense feature. The Current Sense (CS) pin allows proportional load current sensing to be fed back to the microcontroller for real-time feedback. This pin is multiplexed; it reports analog fault events, which are easily distinguishable from normal operation, giving the user the capability of sensing the output current or a fault condition in real-time. The voltage (VD) pin connects directly to the battery or power supply, and the OUT pin connects to the load. Finally, the ground (GND) pin is simply the device GND.

Figure 2: Block Diagram and Pin Configuration of NCV84xxx (Source: onsemi)

The NCV84xxx SmartFET family of devices offers the following protection features:

• Over Voltage Protectionprotects the entire device clamping VD-GND for voltages > 41V.
• Undervoltage protection,in case of a low battery voltage, turns the device off and waits until the battery voltage has risen high enough to operate the Regulated Charge Pump to run the FET properly.
• Current Limit (see Figure 3below) limits the current in case of a short-circuit or in-rush event to prevent damage. The current will stay limited until the internal die temperature of the device exceeds the overtemperature point and will turn itself off for protection until it has cooled down enough. This feature is excellent for driving bulb loads that require a high initial inrush current, and it also limits the amount of stress on the die from high power and temperature swings.
• Overtemperature and Power Protection with Auto-Restartprotect the device from overheating due to high power dissipation and excessive ambient temperature rise. If overtemperature protection is activated, the device will shut itself off until it cools enough and auto-retry, assuming the input is “high.”
• OFF-State Open Load Detection alerts the microcontroller that the connection to the load has been lost in the Off-State before turning the input “high.”
• Output Clamping for Inductive Load Switching during an inductive discharge event, the output clamp will safely turn the FET on to handle the inductive discharge current.

Figure 3: How TJ Progresses During Short to GND/Overload (Source: onsemi)

For in-depth information on how the high-side SmartFETs operate, including protection functions, current sensing, etc., please refer to onsemi’s application note—High-Side SmartFET with Analog Current Sense Application Note.

Source: https://www.mouser.in/blog/highside-smartfet-drivers-automotive-load-applications

Additional Resources:

• High-Side SmartFET Demonstration Console Demo video
• NCV84045 Product Page
• NCV84090 Product Page
• NCV84120 Product Page
• NCV84140 Product Page
• NCV84160 Product Page

The High-Side SmartFET Drivers for Automotive Load Applications blog was first published on onsemi.com and was reposted here with permission.

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Zinc air batteries can be used along for low power vehicles and used in combination with lithium-ion batteries for high power vehicles. Other important advantage is the low cost of zinc-air batteries, which is at least 3 times cheaper, making it as a potential technology for EVs.

For the last ten years, the EV market has been growing constantly. Lithium-ion batteries are a market favourite in the automotive industry because of the rising demand for electric vehicles and their direct correlation with battery demand. Additionally, the use of lithium-ion cells in consumer electronics items like laptops and mobile phones has significantly increased the demand for lithium-ion batteries. However, ELE Times was interested in a recent advancement in EV battery technology. Researchers at the Indian Institute of Technology in Madras worked to create zinc-air batteries that can be mechanically recharged as an alternative to the lithium-ion batteries that are currently used in electric vehicles.

To know further about this development and to be the voice of this vision ELE Times got the opportunity to interview Dr. Aravind Kumar Chandiran, who is an Assistant Professor in the Department of Chemical Engineering, at IIT Madras. He has been working with his research team to create an affordable replacement for lithium-ion batteries.

ELE Times: What benefits will EV manufacturers witness by replacing Lithium-ion batteries with Zinc-air batteries?

Dr. Aravind Kumar: Our zinc-air battery technology is a low cost and high energy system. However lithium ion batteries are high power system. So our technology can go in two different domains, one for low powered two – and three – wheelers and other as a range extender for long haul vehicles. Essentially, it means, the lithium ion can be substituted in smaller vehicles, but for high power vehicles like trucks and buses, we need partial substitution of lithium batteries with zinc-air systems. The reason being, in the same volume available for batteries in vehicles, more energy can be stored. The combination of lithium-ion and zinc-air solves both the high power, high energy and long-range anxiety. Whenever transient high power is required like initial movement of vehicle from rest/traffic signals, and climbing up hill, lithium ion batteries will kick in. On a steady speed drive, constant power will be drawn from zinc-air. As the latter are high energy devices, the combination of two batteries would help running vehicle for longer distances simultaneously covering the high power requirements. In the case of two- or three-wheelers, since they require low power these vehicle can completely run on zinc-air.

To summarize, zinc air batteries can be used along for low power vehicles and used in combination with lithium-ion batteries for high power vehicles. In the latter case, by using the combination of batteries, we enable long haul drive. One other important advantage is the low cost of zinc-air batteries, which is at least 3 times cheaper, making it as a potential technology for EVs.

ELE Times: What is the main technology or concept used behind the working of mechanically powered zinc-air batteries?

Dr. Aravind Kumar: Conventionally in electric vehicles, batteries are electrically rechargeable. However depending the EV sector charging infrastructure may vary from normal charging to high speed charging. Normal charging takes somewhere around 3 to 4 hours for complete charging. Battery swapping is an excellent option, wherein the discharged batteries can be swapped with a charged batteries at Battery Swapping Stations. However this accounts for twice the CAPEX investment, meaning there should be two sets of batteries/modules for every vehicle. One would stay in the vehicle and other would be in the charging station. On one hand home charging takes time, and on the other hand swapping stations demand huge CAPEX. To balance these aspects we came up with an idea of only replacing a part of the batteries every time. Like we go to petrol pumps to get petrol, in our mechanically rechargeable case, we will get zinc. Essentially the zinc stations will take the discharge spent-zinc from vehicle, insert fresh zinc cassettes and vehicle would be ready to move on. Our design enables ultrafast zinc replacement, in less than 5 min. Meaning, EV users will have the same feel as IC engine based vehicles, where they have to spend around 5 minutes in petrol pumps. The spent-zinc will be converted back zinc plates using solar powered process, which we are also developing. Overall, the end-to-end we ensure 100% green energy with no net emissions.

ELE Times: How do you compare the pros and cons of Zinc-air batteries and Lithium-ion batteries?

Dr. Aravind Kumar: Zinc-air is low cost and very high energy system. Whereas lithium ion batteries are medium energy and high power systems, with high cost. It about the marriage between low cost, high energy and high power system that we proposing for long haul vehicles (eg. Trucks) to enable smoother transition from IC engines to EVs. India doesn’t have manufacturing technology for making lithium ion cells, neither do we have necessary raw materials. We will have to depend on import heavily. Even assuming we are tech. transferring from elsewhere aboard, the manufacturing of lithium ion battery requires ultra-dry environment which adds to huge CAPEX investment. In the case of zinc-air batteries, technology is developed in house and almost all the raw materials are available with in the country. By the way, India is one of the top producers of zinc. Next is safety. Zinc-air batteries are water based devices hence they are absolutely safe and never explode like lithium-ion systems. The devices are modular meaning if a cell fails in a module/pack no complete replacement is required, rather than one failed cell can be replaced. This ensures low cost usage of devices in long run. Being said about the advantages, let me highlight that zinc-air batteries are low power devices and cannot be used in silo in high power EVs.

ELE Times: What do you see as the availability of raw material for Zinc-air batteries?

Dr. Aravind Kumar: As said in the previous question, India is one of the largest producers of zinc and we absolutely have no issue with raw material availability in the country. Per capita consumption of zinc in India is very low compared to western countries average, so this battery technology can increase the per captia consumption.

ELE Times: What challenges are faced with the usage of Lithium-ion batteries and how will your project bring about a change in the EV industry?

Dr. Aravind Kumar: Rather than projecting zinc-air batteries to solve the challenges with lithium-ion batteries, I would say let’s use the best of both and bring a change in EV industry.  At the end of the day EV user have to feel absolutely comfortable using them with low cost of ownership, inherent safety, while combining the benefits of IC engine vehicles. EV industries are trying their best to bring all the aforementioned characteristics, by leveraging on the existing technologies. The zinc-air will greatly supplement on lost cost, and safety fronts! And above all, we become technology independent with in-house resources contributing phenomenally to Atmanirbhar Bharat!

ELE Times: What was the inspiration behind your project?

Dr. Aravind Kumar: It’s simple! There cannot be only one solution to such a large opportunity (eg. Energy storage in EVs). This pushed us to innovate and identify next gen. tech. for energy storage. The more the options available, the more the opportunities for EV manufactures/users to choose from depending on their needs/requirements.

ELE Times: What is the feasibility for the EV industry to adapt to zinc-air batteries for EVs?

Dr. Aravind Kumar: We are at the prototyping stage and it would need to pass alpha- and beta- trials before putting them on road! Any technology innovated in lab, takes at least 5 to 10 years to see the value. We are not exempted from it. Lithium-ion technology was invented in 1970s and commercialized for mobile gadgets in 90s and improved to meet EVs requirements at around 2015. However lithium-ion battery development is assisting us to move our technology faster as we have proper ecosystem both in terms of manufacturing and market. We have clear cut confidence based on lab trials and experiments and we believe in around 3 years we will have more clearer answer based on scale-up and field trials.

ELE Times: Will there be any challenges to marketing Zinc-air batteries? 

Dr. Aravind Kumar: Any new comer fighting with giant technology will have serious adoption issue unless it offers phenomenal advantage. For example, if billion are spent on CAPEX in producing lithium-ion batteries, it won’t be feasible to abandon the entire infrastructure and turn gears on one day to zinc-air, irrespective of performance/cost. So a gradual adoption is required. How to make this gradual adoption is a question and find answer to it is a challenge! Our technology definitely offers step-advancement, rather than minuscule improvements. So we believe we will have good opportunity in EV market.

ELE Times: How safe are zinc-air batteries with respect to Lithium-ion batteries for EVs?

Dr. Aravind Kumar: Put them in fire and I guarantee it won’t catch fire! No flammable solvents used, so it is absolutely safe!

The post Mechanically charged Zinc Air Batteries: Will it be the ultimate alternative to Lithium-ion Batteries? appeared first on ELE Times.

Electric vehicles (EVs) may provide a powerful jolt to supply sustainable power to our electric grids.

Through vehicle-to-grid (V2G) technology, battery power from EVs can be harnessed to power homes or share stored energy with electric grids as demand rises. Semiconductor technology will be essential in the V2G rollout, driving electrification forward with new charging and battery-storage solutions.

Here are five things our company’s experts think you should know about V2G:

V2G can ease the strain on aging electric grids

“The problem is not the grid’s overall capacity. The challenge is the grid’s peak capacity. Spikes in demand are getting higher and coming more often as we grow more reliant on power. V2G semiconductor technology could help smooth out these peaks, which can mean less frequent outages and lower overall cost of energy. A key part of this is providing people with smart technologies that can make it easy for them to know the optimal time to charge their EVs. So long as they are not all charging at the same time, like in the evening when they come home from work, the grid will be able to cope.” – Henrik Mannesson, general manager for grid infrastructure

Bidirectional charging is paving the way to V2G

“Bidirectional charging — the technology that enables electric current to flow in both directions — will become a ubiquitous feature of EVs as more carmakers and owners embrace the idea of using vehicle batteries as power sources. The cost of moving to bidirectional charging is low for EVs, given that they already have onboard chargers and much of the required hardware already fitted. Bidirectional charging is not just about cars returning power to the grid. It also enables EVs to provide power to the home. That will be useful during power outages, for example, allowing people to have a ready backup supply from their EV batteries.” – Jason Cole, product line manager for current sensing products

V2G will need rapid and efficient charging technology

“The ability of EVs to charge up and give power back to the grid quickly is key for V2G to work. Fast charging means transferring current efficiently from the grid to an EV battery and vice versa. This is where wide-bandgap technology like gallium nitride (GaN) comes in. GaN enables higher power density and efficiency than traditional silicon-based semiconductors for applications transferring power between EVs and the grid. The higher efficiency means less energy is lost to heat. That ensures minimal power is wasted in charging, helping to lower costs and easing the burden on the grid.” – David Snook, product line manager for GaN products

Current sensing technology will boost V2G efficiency

“Bidirectional charging between EVs and the grid may be conceptually straightforward but the process itself requires sophisticated sensing technology. Sensors must be able to accurately and reliably measure current and voltage between EVs and the charging infrastructure. The better the measurement, the more efficiently energy can be transferred from the grid into the car and vice versa. Sensors paired with semiconductor technology not only meet this need, but also handle high voltages and minimize electromagnetic radiation, enabling uncorrupted measurements and communication to maximize charging efficiency.” – Navin Kommaraju, product line manager for isolated ADC and isolated amplifier portfolios

Advanced connectivity will help grid operators manage power loads

“For V2G to work on a mass scale, it will require robust and flexible connectivity technologies to help grid operators anticipate and service power demand sustainably across a broad network of charging stations in all manner of locations and settings. This will mean collecting and sharing large volumes of data to ensure that power is available where needed and inform EV owners about the optimal time to charge up or give power back to the grid. Connectivity must be able to bridge multiple platforms, linking human-machine interfaces to EVs and charging stations to the cloud. Smart processors that can harness artificial intelligence (AI) technology are key to enabling this level of connectivity. As more data is collected over time, AI can enable more accurate at predicting optimal charging times and locations for EV owners based on grid behavior and usage patterns.”
– Artem Aginskiy, product line manager for Sitara MPU processors 

Through bidirectional power conversion, current and voltage sensing, connectivity and energy storage, the relationship between EVs and the grid is becoming more dynamic and connected than ever before. As more EVs hit the road, it will be critical to balance energy consumption and demand, and take steps to increase the grid’s capacity and efficiency through innovations in semiconductor technology.

Courtesy: Texas Instruments

The post 5 Things you Should Know About V2G appeared first on ELE Times.

• Lead customer Ajax Systems uses STM32U5 MCUs in next-gen wireless security and smart home solutions
• STM32U5 series MCUs are first general-purpose MCUs to receive NIST embedded random-number entropy source certification

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has expanded its STM32 family of advanced microcontrollers (MCUs) with extra STM32U5 devices that raise performance while squeezing power consumption for longer runtimes and energy efficiency. The STM32U5 has also received NIST embedded random-number entropy source certification ; the industry’s first to receive this endorsement.

The new MCUs extend the range of code and data storage to 128Kbyte Flash for cost-sensitive applications, while also adding high-density versions for complex applications and sophisticated smartphone-like user interfaces. Among these, the STM32U59x/5Ax with 4Mbyte Flash and 2.5Mbyte SRAM has the largest on-chip memory of any STM32 MCU to date.

With their increased capabilities, the new MCUs enhance deeply embedded applications like environmental sensors, industrial actuators, building automation, smart appliances, wearable devices, eMobility controls, and others, especially in remote, difficult to access locations. As billions of such devices are being deployed worldwide for smart living and working, ST’s new MCUs accelerate progress by boosting performance, enhancing energy efficiency, and strengthening cybersecurity.

All STM32 MCUs are based on industry-standard Arm® Cortex®-M embedded CPU cores and benefit from the powerful and easy-to-use STM32Cube and STM32Cube.AI development ecosystem. This ecosystem consolidates tools and software to support customers’ projects from start to finish, including the creation of cutting-edge AI/ML solutions through conversion of pretrained neural networks into optimized code.

The STM32U5 series leverages the latest generation, the Cortex-M33, which incorporates advancements that increase performance, energy efficiency, and resistance to online and hardware attacks. Around this core, ST has added its ultra-low-power MCU knowhow and implemented an architecture that leverages established Arm principles for superior cybersecurity. Some devices in the series provide a 2.5D graphics accelerator. The result is a groundbreaking MCU series that offers a large selection of pin-to-pin and software-compatible products ready to tackle next-generation applications.

“Because many applications demand extra functionality, richer graphics, and faster performance while running longer, using a smaller battery, or employing energy harvesting, we’ve developed the STM32U5 and are extending the series, today,” said Ricardo De Sa Earp, Executive Vice President General-Purpose Microcontroller Sub-Group, STMicroelectronics. “This MCU combines the latest Arm core, our unique ultra-low-power technologies, generous on-chip memory, and the option of our NeoChrom graphics engine to elevate the user’s visual experience.”

Among ST’s lead customers for the STM32U5 series, Ajax Systems is already designing future generations of its advanced wireless security and smart home solutions using the new MCUs. Max Melnyk, Device Department R&D Director at Ajax, commented, “Working with STMicroelectronics, a global giant in the semiconductor market, helps us evolve and strengthen Ajax products. The STM32U5 series significantly lowers power consumption while maintaining the same performance we achieved using other MCUs that contain DSP and floating-point co-processors. And we can reuse 90 percent of our existing code. An additional, major advantage for us is the large integrated SRAM, which is enough to handle a double frame buffer for fast and fluid graphics performance. There is also generous flash for loading resources. I’m sure it’ll drive the development of the next generations of Ajax products.”

Further technical information
Proprietary energy-saving features of the STM32U5 series include autonomous peripherals and ST’s low-power background autonomous mode (LPBAM). The LPBAM lets the application maintain critical functionality while the core and other unused blocks power down into any of the MCU’s flexible energy-saving modes. From this state, the MCU can quickly wake the core to process a batch of data efficiently then transition back into a low-power mode.

On the other hand, STM32U5 MCUs provide up to 4Mbytes of flash storage for code and data, as well as up to 2.5Mbytes SRAM, for handling sophisticated applications. The large on-chip memory saves additional discrete memory chips that otherwise increase power consumption, bill-of-materials (BOM) cost, and PCB size.

The STM32U5 series also breaks the constraints on graphics performance that typically apply to ultra-low-power MCUs. Variants with ST’s advanced NeoChrom graphics processing unit (GPU) on-chip can run a sophisticated graphical user interface (GUI) previously only possible with an expensive microprocessor-based system. A tiny, embedded processor can now host smartphone-like user experiences and GUI development can leverage ST’s TouchGFX framework that now features SVG support and rich graphical assets.

Also, unlike the processors typically needed to support such sophisticated capabilities, STM32U5 MCUs come in an economical LQFP100 package that permits a simplified PCB construction with minimal layer count. Developers can accelerate their projects using resources including the STM32CubeU5 software package, new NUCLEO-U545RE and NUCLEO-U5A5ZJ development boards, and the STM32U5A9J-DK Discovery kit for graphics.

The STM32U5 series also enhances cyber security, leveraging the Cortex-M33 with its memory protection unit and Arm’s TrustZone® architecture featuring hardware isolation. The MCUs also integrate cryptographic accelerators for advanced AES algorithms, support for public key architecture (PKA), and resistance to physical attacks. In addition, error correction code (ECC) support on flash and SRAM prevents corruption thereby enhancing both cyber-protection and safety.

On top of this, the STM32U5 is the first general-purpose group of MCUs to receive the NIST (US National Institute of Standards and Technology) embedded random-number entropy source certification. As the certification is reusable by customers, it simplifies and speeds certification for those applications that need SP800-90B final certification.

The new STM32U5 devices are scheduled to begin volume production in Q2 2023. MCUs will be available from ST’s eStore and distributors, priced from $2.15 for orders of 10,000 pieces. Please contact your local ST sales office for other pricing options.

For further information please go to www.st.com/stm32u5.

STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.

The post New microcontrollers from STMicroelectronics expand STM32U5 series, raising performance and energy efficiency for IoT and embedded applications appeared first on ELE Times.

End-of-line manufacturing solutions from ASMPT

Although the processing of odd-shaped components at the end of the line usually accounts for only about ten percent of the entire SMT process, it represents the majority of the challenges in placement operations. With a smart high-performance solution from technology leader ASMPT, the company’s SIPLACE TX high-speed placement systems can now also be used as end-of-line machines for the automated processing of odd-shaped components (OSCs), replacing expensive and slow robotic solutions or manual work. The SIPLACE Tray Unit enables the automatic, uninterrupted feeding of components from up to 82 JEDEC trays. And the associated seamless traceability of products, components and batches ensures total auditing security, which is particularly important in sensitive areas such as the automotive sector.

“With its proven Waffle Pack Changer and Matrix Tray Changer, ASMPT has long offered the option of automatically supplying odd-shaped components (OSCs) to the highly flexible SIPLACE SX and the high-volume SIPLACE X S. Due to design limitations, this was previously not possible for the SIPLACE TX,” explains Petra Klein-Gunnewigk, Senior Product Manager at ASMPT. “With the new SIPLACE Tray Unit we fulfill the wish of many electronics manufacturers to make this machine, which is highly valued for its impressive floorspace performance, fit for automated, highly efficient and more productive end-of-line processing. As a result, SIPLACE TX users can now balance their lines even more effectively while gaining valuable space on the shop floor and increasing their flexibility by integrating processes that previously had to be handled offline – with all the advantages that our Open Automation concept delivers.”

Ready for OSC processing

To ensure the correct processing of odd-shaped components in a single step, the SIPLACE TX can now be equipped with two stationary high-end camera systems for use with two TwinHeads or a placement head combination of a CPP and a TwinHead. With its great selection of special nozzles and grippers, the TwinHead makes it possible to place OSCs measuring up to 200 mm × 110 mm × 25 mm (L × W × H) and weighing up to 160 grams. And with the optional OSC Package, the OSC placement capabilities are expanded even further.

Powerful feeding solution

To operate as an end-of-line machine, the SIPLACE Tray Unit is now available for the SIPLACE TX. It uses carriers that can each hold two JEDEC trays. Depending on the size of the components, up to 82 JEDEC trays or 41 trays measuring up to 355 × 275 mm are possible. As a special feature, new trays can be refilled without having to interrupt the production because the magazine is split into a buffer zone for the continuous supply and the main storage area, which can be refilled with new trays.

Perfect fit for more space on the shop floor

The SIPLACE TX is the placement solution of choice for mobile devices, increasingly complex automotive solutions, and many more applications. Whenever manufacturers wanted to integrate the processing of OSCs into the line, they previously had to resort to alternative end-of-line solutions, which take up significantly more space, as shown in this simple example: Three SIPLACE TX and one SIPLACE SX with a Waffle Pack Changer occupy an area of 13.76 square meters. Four SIPLACE TX machines, on the other hand, the last being equipped with the new SIPLACE Tray Unit, take up only 9.92 square meters – a whopping 27.5 percent less. And the SIPLACE Tray Unit protrudes less than 13 centimeters from the front of the machine.

A more balanced line

Automated OSC processing makes the entire SMT line much more balanced because it drastically accelerates the slowest placement process. It increases the line’s productivity considerably and minimizes the robot-supported or manual processing of OSCs or eliminates it completely. Another contributor to an optimally balanced line is the powerful CP20 placement head, the latest generation of which can process components that are one millimeter taller. This makes it possible to process a higher range of components at the beginning of the line, which in turn relieves subsequent machines.

Automation for the integrated smart factory

Integrating the placement of OSCs into the SMT line also enables this process to benefit from the wide-ranging capabilities of ASMPT’s flexible and manufacturer-independent Open Automation concept. In contrast to downstream manual processes, all production, product and component data is automatically recorded during the placement process and transmitted to the IT systems for seamless traceability and documentation. In addition, the productivity- and efficiency-enhancing applications of the WORKS smart shop floor management suite can also be used to their full extent for the OSC process – another important step toward the integrated smart factory.

End-of-line processing in the ‘Facts on Open automation’ livestream

What the ideal end-of-line machine must look like is the subject of our ‘Facts on Open Automation’ livestream on March 29, 2023. Host Laszlo Sereny and his studio guests will explain why component diversity and standardization are not mutually exclusive and prove this with illustrative examples from practical applications.

This ASMPT show format offers viewers each month a roughly half-hour English-language livestream around ASMPT’s Open Automation concept with live feeds from international SMT hot-spots, interviews with experts, practical examples from SMT productions, and much more.

The post Automatic OSC feeding for the SIPLACE TX appeared first on ELE Times.

End-of-line manufacturing solutions from ASMPT

Although the processing of odd-shaped components at the end of the line usually accounts for only about ten percent of the entire SMT process, it represents the majority of the challenges in placement operations. With a smart high-performance solution from technology leader ASMPT, the company’s SIPLACE TX high-speed placement systems can now also be used as end-of-line machines for the automated processing of odd-shaped components (OSCs), replacing expensive and slow robotic solutions or manual work. The SIPLACE Tray Unit enables the automatic, uninterrupted feeding of components from up to 82 JEDEC trays. And the associated seamless traceability of products, components and batches ensures total auditing security, which is particularly important in sensitive areas such as the automotive sector.

“With its proven Waffle Pack Changer and Matrix Tray Changer, ASMPT has long offered the option of automatically supplying odd-shaped components (OSCs) to the highly flexible SIPLACE SX and the high-volume SIPLACE X S. Due to design limitations, this was previously not possible for the SIPLACE TX,” explains Petra Klein-Gunnewigk, Senior Product Manager at ASMPT. “With the new SIPLACE Tray Unit we fulfill the wish of many electronics manufacturers to make this machine, which is highly valued for its impressive floorspace performance, fit for automated, highly efficient and more productive end-of-line processing. As a result, SIPLACE TX users can now balance their lines even more effectively while gaining valuable space on the shop floor and increasing their flexibility by integrating processes that previously had to be handled offline – with all the advantages that our Open Automation concept delivers.”

Ready for OSC processing

To ensure the correct processing of odd-shaped components in a single step, the SIPLACE TX can now be equipped with two stationary high-end camera systems for use with two TwinHeads or a placement head combination of a CPP and a TwinHead. With its great selection of special nozzles and grippers, the TwinHead makes it possible to place OSCs measuring up to 200 mm × 110 mm × 25 mm (L × W × H) and weighing up to 160 grams. And with the optional OSC Package, the OSC placement capabilities are expanded even further.

Powerful feeding solution

To operate as an end-of-line machine, the SIPLACE Tray Unit is now available for the SIPLACE TX. It uses carriers that can each hold two JEDEC trays. Depending on the size of the components, up to 82 JEDEC trays or 41 trays measuring up to 355 × 275 mm are possible. As a special feature, new trays can be refilled without having to interrupt the production because the magazine is split into a buffer zone for the continuous supply and the main storage area, which can be refilled with new trays.

Perfect fit for more space on the shop floor

The SIPLACE TX is the placement solution of choice for mobile devices, increasingly complex automotive solutions, and many more applications. Whenever manufacturers wanted to integrate the processing of OSCs into the line, they previously had to resort to alternative end-of-line solutions, which take up significantly more space, as shown in this simple example: Three SIPLACE TX and one SIPLACE SX with a Waffle Pack Changer occupy an area of 13.76 square meters. Four SIPLACE TX machines, on the other hand, the last being equipped with the new SIPLACE Tray Unit, take up only 9.92 square meters – a whopping 27.5 percent less. And the SIPLACE Tray Unit protrudes less than 13 centimeters from the front of the machine.

A more balanced line

Automated OSC processing makes the entire SMT line much more balanced because it drastically accelerates the slowest placement process. It increases the line’s productivity considerably and minimizes the robot-supported or manual processing of OSCs or eliminates it completely. Another contributor to an optimally balanced line is the powerful CP20 placement head, the latest generation of which can process components that are one millimeter taller. This makes it possible to process a higher range of components at the beginning of the line, which in turn relieves subsequent machines.

Automation for the integrated smart factory

Integrating the placement of OSCs into the SMT line also enables this process to benefit from the wide-ranging capabilities of ASMPT’s flexible and manufacturer-independent Open Automation concept. In contrast to downstream manual processes, all production, product and component data is automatically recorded during the placement process and transmitted to the IT systems for seamless traceability and documentation. In addition, the productivity- and efficiency-enhancing applications of the WORKS smart shop floor management suite can also be used to their full extent for the OSC process – another important step toward the integrated smart factory.

End-of-line processing in the ‘Facts on Open automation’ livestream

What the ideal end-of-line machine must look like is the subject of our ‘Facts on Open Automation’ livestream on March 29, 2023. Host Laszlo Sereny and his studio guests will explain why component diversity and standardization are not mutually exclusive and prove this with illustrative examples from practical applications.

This ASMPT show format offers viewers each month a roughly half-hour English-language livestream around ASMPT’s Open Automation concept with live feeds from international SMT hot-spots, interviews with experts, practical examples from SMT productions, and much more.

The post Automatic OSC feeding for the SIPLACE TX appeared first on ELE Times.

Infineon Technologies launched the SEMPER Nano NOR Flash memory optimized for battery-powered, small-form-factor electronic devices. Emerging wearable and industrial applications, including fitness trackers, hearables, health monitors, drones, and GPS trackers, enable more with precision tracking, critical information logging, enhanced security, noise cancellation, and more. These advanced capabilities and use cases drive the need for more memory in less space. According to Omdia, the market for Bluetooth-enabled headsets and headphones is expected to grow at a 25 percent CAGR and exceed one billion units by 2024.

With growing demand for more memory, designers face additional challenges of limited board space and maximum battery life. The SEMPER Nano NOR Flash from Infineon is the first of its kind to deliver a solution that combines both high density, small footprint and industry-leading low power, along with robust engineering and design support.

“Semiconductors play a critical role in enabling innovative applications that have the potential to change the way we live. With smarter lifestyle devices, we can make better health choices, keep track of our loved ones, and ensure their safety,” said Sandeep Krishnegowda, VP of Marketing and Applications, Flash Memory Solutions, Infineon Technologies. “With SEMPER Nano, we enable our customers to add more functionality to their smart devices by offering more memory in a ultra-compact footprint while simultaneously enhancing system reliability with built-in ECC.”

Available in 256 Mbit 1.8 V configurations and both industrial and commercial grades, Infineon’s SEMPER Nano NOR Flash delivers 40 Mbyte/s SPI throughput and achieves industry-leading stand-by and active currents. Built-in error correction code (ECC) enhances reliability, and a configurable sector architecture allows optimization for code or data storage.

The family is fully supported by SEMPER Solutions Hub, a one-stop portal with all the building blocks required to integrate SEMPER Nano NOR Flash into an application. The software, tools and resources simplify the overall design process and help designers bring products to market faster. A new SEMPER Nano Pmod-compatible memory module is available to easily assemble hardware development platforms.

The post Infineon’s 256 Mbit SEMPER Nano NOR Flash memory enables smaller, power-efficient industrial and consumer electronics appeared first on ELE Times.

Infineon Technologies launched the SEMPER Nano NOR Flash memory optimized for battery-powered, small-form-factor electronic devices. Emerging wearable and industrial applications, including fitness trackers, hearables, health monitors, drones, and GPS trackers, enable more with precision tracking, critical information logging, enhanced security, noise cancellation, and more. These advanced capabilities and use cases drive the need for more memory in less space. According to Omdia, the market for Bluetooth-enabled headsets and headphones is expected to grow at a 25 percent CAGR and exceed one billion units by 2024.

With growing demand for more memory, designers face additional challenges of limited board space and maximum battery life. The SEMPER Nano NOR Flash from Infineon is the first of its kind to deliver a solution that combines both high density, small footprint and industry-leading low power, along with robust engineering and design support.

“Semiconductors play a critical role in enabling innovative applications that have the potential to change the way we live. With smarter lifestyle devices, we can make better health choices, keep track of our loved ones, and ensure their safety,” said Sandeep Krishnegowda, VP of Marketing and Applications, Flash Memory Solutions, Infineon Technologies. “With SEMPER Nano, we enable our customers to add more functionality to their smart devices by offering more memory in a ultra-compact footprint while simultaneously enhancing system reliability with built-in ECC.”

Available in 256 Mbit 1.8 V configurations and both industrial and commercial grades, Infineon’s SEMPER Nano NOR Flash delivers 40 Mbyte/s SPI throughput and achieves industry-leading stand-by and active currents. Built-in error correction code (ECC) enhances reliability, and a configurable sector architecture allows optimization for code or data storage.

The family is fully supported by SEMPER Solutions Hub, a one-stop portal with all the building blocks required to integrate SEMPER Nano NOR Flash into an application. The software, tools and resources simplify the overall design process and help designers bring products to market faster. A new SEMPER Nano Pmod-compatible memory module is available to easily assemble hardware development platforms.

The post Infineon’s 256 Mbit SEMPER Nano NOR Flash memory enables smaller, power-efficient industrial and consumer electronics appeared first on ELE Times.