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Vishay Intertechnology 1 Form A Solid-State Relays Offer Continuous Load Current to 5 A in Compact SOP-4 Package
Space-Saving, Industrial-Grade Devices Combine Load Voltages to 60 V With Isolation Voltage of 3750 VRMS and Low Leakage Current of < 1 µA
Vishay Intertechnology, Inc. introduced two new industrial-grade 1 Form A solid-state relays in the surface-mount SOP-4 package. The Vishay Semiconductors VO1401AEFTR and VOR1003M4T combine high continuous load current of 550 mA and 5 A, respectively, with load voltages of 60 V and 30 V, isolation voltage of 3750 VRMS, and low leakage current of < 1 µA typical.
With their high current capability, the devices released are ideal for replacing electromechanical relays, which are susceptible to damaging vibrations, with contactless optical relays that provide robust, vibration-proof switching for higher reliability and a longer service life. In addition, their high isolation voltage allows them to be used in harsh environments.
Offering typical turn-on and turn-off times of 1.3 ms and 0.15 ms for the VO1401AEFTR, and 0.5 ms and 0.1 ms for the VOR1003M4T, the relays will provide fast switching for industrial automation systems and controls; security systems; medical instrumentation; and broadcasting equipment. In these applications, the devices’ compact package saves board space, while their low leakage current translates into higher efficiency by helping to keep the sensitive load on the output side turned off.
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Infineon introduces new CoolSET System in Package (SiP) in a compact design for highly efficient power delivery up to 60 W for wide input voltage range
Infineon Technologies AG is launching its new CoolSET System in Package (SiP), a compact, fully integrated system power controller for highly efficient power delivery of up to 60 W at universal input voltage range of 85 – 305 VAC. Housed in a small SMD package, the high-voltage MOSFET with low RDS(ON) eliminates the need for an external heat sink, reducing system size and complexity. The CoolSET SiP supports zero-voltage switching flyback operation, which enables low switching losses and low EMI signature, while also enhancing system reliability and robustness. This makes it an ideal solution for applications such as major home appliances and AI servers. In addition, the controller makes it easier for developers to meet stringent energy standards, supporting future-proof power solutions for modern designs.
The CoolSET SiP integrates a 950 V startup-cell, an 800 V avalanche rugged CoolMOS P7 SJ MOSFET, a ZVS primary flyback controller, a secondary-side synchronous rectification controller, and reinforced isolated communication enabled by Infineon’s proprietary CT Link technology. This high level of integration supports the development of more sophisticated end products by significantly reducing the number of discrete components, lowering the bill of materials, and minimizing PCB space requirements. A comprehensive set of advanced protection features simplifies system integration and allows designers more flexibility to optimize their solutions and enhance the overall user experience.
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Rohde & Schwarz pioneers the future of automotive Ethernet using Analog Devices’ 10BASE-T1S solutions
Rohde & Schwarz is accelerating the development of the new automotive Ethernet variant 10BASE-T1S by offering compliance and trigger & decode options
10BASE-T1S (IEEE 802.3cg) is a type of Ethernet networking technology that is designed for use in automotive and industrial applications, and 10BASE-T1S E2B products from ADI enable highly optimized yet flexible hardware-based Ethernet edge node connectivity solutions. The new variant is not just introducing a new lower speed grade of 10 Mbps over distances of 25 meters and beyond but also adding novel capabilities such as multi-drop transmission, thus eliminating the need for a switch. By eliminating the need for microcontrollers at the edge nodes, ADI’s E2B solution enables the centralization of all software to help enable next-gen zonal architectures and software-defined vehicles. This technological advancement is particularly applicable for linking sensors and actuators throughout the car body, powertrain, and beyond to a domain or zonal controller.
On the R&S MXO series oscilloscopes, the decoded packets are displayed in a color-coded manner, thereby making it straightforward for ADI engineers to identify crucial protocol messages such as Beacon, Commit and MAC frames. This allows for more efficient test validation, thus helping to enable shorter time to market. The 10BASE-T1S takes advantage of the new PLCA technology, making it essential to verify the timing and performance of various nodes connected onto the network. The time alignment of all decoded frames with the captured waveform simplifies debugging and facilitates precise timing measurements. ADI engineers can switch between various data representations such as DME symbols, scrambled, or unscrambled, providing valuable insights into the captured network traffic.
10BASE-T1S Ethernet technology offers additional advantages by supporting a high number of nodes on a single network, making it ideal for complex systems. Its short reach and low data-rate make it energy efficient and cost-effective. ADI’s innovative approach to 10BASE-T1S ensures that SDVs can deliver true value to OEMs by reducing form factors, cutting costs at the edge, lowering boot times, and offering bounded low latency, power saving, timestamping, and timed actuation, so that all nodes in the system are synchronized and operate seamlessly.
Fionn Hurley from ADI remarked: “ADI uses Rohde & Schwarz oscilloscopes, delivering reliable and precise measurements for our industry leading 10BASE-T1S solution. This reinforces our commitment to offering high-quality, robust technology solutions to our customers. ADI takes a holistic approach to system design and understands the complexity of the challenges faced by our customers and helps them overcome these challenges. We’re helping to drive the automotive industry towards a smarter, more efficient future.”
With the R&S MXO series oscilloscope, engineers can further leverage its high-performance capability to debug their 10BASE-T1S communication link. Standard debug tool like the spectrum mode, zone triggers and fast acquisitions makes it easy to detect anomalies on the bus. Furthermore, using the MXO’s ability to make standards-compliant 10BASE-T1S measurements in accordance with the IEEE 802.3cg and OPEN Alliance TC14 specifications, enables the automotive industry to ensure performance and interoperability of this growing automotive network technology.
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Keysight Awarded NATO FORACS Contract to Enhance Operational Readiness
- Provides advanced radar target generation and EW threat simulation solutions to strengthen NATO’s radar and electronic support measures capabilities across member nations
Keysight Technologies. Inc. has been awarded a contract with NATO’s Naval Forces Sensor and Weapons Accuracy Check Sites to modernize its testing capabilities for critical radar and electronic support measures systems. Under this agreement, Keysight will deliver Radar Target Generator and Electronic Warfare testing solutions to be deployed at NATO Navy bases, enabling the calibration and maintenance of NATO radar systems and the assessment of ESM effectiveness.
Modern military and naval forces depend heavily on the accuracy and reliability of their radar and ESM systems for maintaining situational awareness, effective targeting, and timely threat detection. In an era of increasingly complex and rapidly evolving electronic warfare threats, defense organizations require sophisticated, high-fidelity test environments. These environments must be capable of replicating real-world scenarios with dynamic multi-emitter signals, advanced threat modeling, and closed loop testing methodologies.
Keysight’s Radar Target Generator and EW solutions are designed to meet these demanding requirements, empowering NATO FORACS to rigorously assess and optimize the operational readiness of radar and ESM systems across all member nations. The contract encompasses the integration and delivery of next-generation Radar Target Generators and EW threat simulators. This will ensure enhanced accuracy verification and thorough system performance testing within complex electromagnetic environments. Notably, the Radar Target Generator leverages commercial-off-the-shelf Keysight components, featuring customized firmware and a graphical user interface developed entirely in Europe and tailored to meet NATO’s specific requirements.
The systems that Keysight will deliver to NATO is defined by several key factors, including:
- High-fidelity Radar Target Generation: Simulates precise radar returns, including Doppler shift, range, and cross-section variability, enabling accurate testing of radar tracking.
- Sophisticated EW threat simulation: Creates complex electromagnetic threat environments with multi-emitter interference, jamming, and deceptive techniques to evaluate ESM system effectiveness.
- Customizable, open-architecture design: The modular hardware and software framework allows for incremental system upgrades, ensuring adaptability to future mission requirements.
- Deployable and modular configuration: Designed for field and lab deployment, providing flexible testing capability across multiple NATO sites.
The NATO FORACS Office in NATO Headquarters in Brussels, reported: “The NATO FORACS Office is pleased to note the placement of this contract which will supply important equipment to restore NATO FORACS’ core radar and ESM testing capabilities in order to meet its users’ evolving demands.”
Thierry Locquette, EMEA VP and GM at Keysight, said: “NATO’s ability to verify and enhance the accuracy of its radar and ESM systems is critical to mission success in today’s contested electromagnetic spectrum environment. Keysight is proud to provide the cutting-edge solutions necessary to enable NATO FORACS to maintain the highest levels of sensor performance, ensuring operational superiority across allied forces. Our Radar Target Generator solution was developed in Europe, working closely with our local R&D and solution centers as well as with European technology partners to provide a highly realistic, flexible, and future-ready test capability for NATO’s evolving defense needs.”
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Wise-integration to Present a SiC 7kW Demoboard for Onboard Charger For Electric Vehicles with WiseWare Digital Control at PCIM 2025
The Cross-Compatible OBC Enables Flexible, Efficient, And Intelligent Power Systems Across Multiple Wide-Bandgap Platforms
Wise-integration, a pioneer in digital control for gallium nitride (GaN) and GaN IC-based power supplies, will break new ground at PCIM Europe 2025, May 6–8 in Nuremberg. In collaboration with Savoy International Group, the company will debut its digital controller of a silicon carbide (SiC) power demonstrator model, underscoring its expansion into complementary wide-bandgap technologies and showcasing its WiseWare digital controller’s universality and adaptability across those technologies.
This marks a new market entry for Wise-integration—in particular, targeting SiC-based high-voltage applications in automotive and industrial sectors—while reinforcing that WiseWare can serve as a common digital intelligence layer regardless of the underlying semiconductor material.
Building on Wise-integration’s Core GaN Expertise
The WiseWare 1 OBC SIC 7kW power demonstrator model builds on the company’s core expertise in GaN-based systems and digital control ICs, reinforcing its commitment to advancing the full spectrum of power semiconductor technologies. This cross-compatible, digital control solution for both GaN and SiC, enables flexible, efficient, and intelligent power systems across multiple WBG platforms.
“This demonstration of a silicon-carbide onboard charger marks an important step in Wise-integration’s journey toward the automotive market,” said CEO Thierry Bouchet. “By showing that WiseWare can reliably control high-voltage, high-power systems in an EV-relevant application, we’re validating our digital control platform as a strong candidate for next-generation onboard chargers. It’s a first step toward demonstrating that our technology is scalable, adaptable, and aligned with the needs of future EV platforms.”
The demonstrator is a prototype product for the company’s partner, Savoy International Group, a Tier 1 automotive supplier, whose e-mobility division collaborated with Wise-integration on a GaN charger embedded in e-bike batteries in 2023.
“This prototype has been developed specifically to support the electrification of Savoy’s innovative, light electric vehicles under the KILOW brand, as well as their broader ambition to promote fun, accessible, and sustainable mobility solutions,” Bouchet explained.
“Our previous collaboration with Wise-integration on the embedded GaN charger for our e-bike battery met all of our expectations for performance and helps us differentiate KILOW in a crowded field,” said Émile Allamand, CEO of Savoy Group. “The SiC onboard charger will enable us to diversify our EV offerings with a light, four-wheel vehicle under our KILOW brand.”
Major Differentiators of the WiseWare 1 OBC SIC 7kW Demonstrator:
- Technology-agnostic control:WiseWare works seamlessly with both GaN and SiC, allowing OEMs to keep control architecture constant, while optimizing the power stage for each use case (cost, power level, thermal profile, etc.).
- Digital-first approach:Unlike traditional analog control platforms, Wise-integration virtualizes control functions, enabling simplified designs, faster iterations, and more compact systems.
- Open and modular design philosophy:WiseWare is not tied to a proprietary microcontroller or switch brand. This flexibility makes it highly attractive to Tier 1s and system integrators seeking to reduce vendor lock-in.
SiC technology delivers excellent thermal performance and is highly efficient under heavy loads—making it ideal for high-power components like traction inverters and fast chargers. Its ruggedness and maturity also contribute to its reliability in the demanding automotive environment. WiseWare’s SiC demonstration shows that the company’s digital control platform is technology-agnostic, and can bring the same performance, modularity, and intelligence to SiC systems as it does to GaN systems.
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Rohde & Schwarz presents its advanced solutions for power electronics testing and characterization at PCIM Expo 2025
Rohde & Schwarz will showcase its latest solutions and advanced techniques for testing and analyzing power electronic systems and components at PCIM Expo 2025 in Nuremberg, Germany. At the company’s booth (hall 7, booth 166), the spotlight will be on solutions utilizing the company’s cutting-edge test instruments to address the challenges of debugging next generation wide bandgap semiconductors like GaN and SiC.
Rigorous testing and advanced characterization methods help design engineers enhance the performance, efficiency, and reliability of their power electronic designs based on SiC and GaN devices, used in pioneering industries like e-mobility, renewable energy or AI data centers. Rohde & Schwarz will bring a selection of its comprehensive T&M portfolio to booth 166 in hall 7 of PCIM Expo 2025, taking place from May 6 to 8 at the Nuremberg Exhibition Center. The test solutions are tailored for power electronics applications where high efficiency, fast switching speeds, improved power density and high-temperature operation matter.
Wide bandgap analysis
At the center of the presented setups will be the R&S RT-ZISO isolated probing system from Rohde & Schwarz. This next generation isolated probe has set new standards with unprecedented accuracy, sensitivity, dynamic range and bandwidth for wide bandgap power designs with SiC and GaN. Rohde & Schwarz will showcase the advantage of the R&S RT-ZISO over single-ended probes in a setup to investigate the switching behavior of a GaN-MosFET.
Double pulse testing
Double pulse testing is a method for evaluating the switching performance of SiC and GaN based power devices. Rohde & Schwarz is collaborating with industry expert PE-Systems GmbH for a stable and accurate approach to double pulse testing using the MXO 5 next generation oscilloscope from Rohde & Schwarz with eight channels in combination with the R&S RT-ZISO. At PCIM, visitors can experience accurate, reliable and fast double pulse testing on 1200 V SiC devices from Wolfspeed, typically used as traction inverters in the automotive industry.
Automated loadjump testing
Loadjump testing used to be a time-consuming manual process to verify a Buck converter’s load step response at varying input voltage levels, using only a few reference points. For this application, as well, Rohde & Schwarz collaborates with PE-Systems GmbH, who offers a test automation software. In combination with the MXO 5 oscilloscope and the R&S RT-ZISO isolated probing system, this solution not only reduces overall testing time but also maintains the same number of test points. At PCIM, the companies demonstrate automated loadjump testing of a Buck converter of Monolithic Power Systems, Inc. within a voltage range of 6V to 60V. The setup even allows for more reference points within the same timeframe and can be extended to include temperature control, facilitating the full automation of input voltage, load current, and temperature profile variations.
Component characterization
Rohde & Schwarz will also showcase its solutions for component characterization. The R&S LCX LCR meters with customized impedance measurement functions are suitable for all discrete passive components up to 10 MHz. Users can easily characterize the voltage dependence of capacitances in core components of power converters like MLCCs with the R&S LCX. Combined with a sweep software tool, users can perform comprehensive sweep measurements and display them in numerous charts. The MFIA impedance analyzer from Zurich Instruments AG is capable of impedance spectroscopy for both low impedance components such as shunt resistors and DC-link capacitors and high impedance systems. It offers measurement modes for impedance analysis over frequency and time as well as other features such as integrated oscilloscope and spectrum analyzer capabilities.
Dr. Philipp Weigell, Vice President of the Industry, Components, Research & University Market Segment at Rohde & Schwarz, explains: “PCIM Expo is an important venue for us to highlight our advancements in wide bandgap semiconductor testing. Testing plays a critical role to improve power efficiency, reduce size, and manage heat more effectively in power conversion applications used in AI data centers, for instance. Through collaboration with industry experts and with our advanced testing solutions we enable our customers to develop reliable and efficient systems that meet the rigorous demands of modern data processing applications.”
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Exporting Power: India’s Growing Influence In Global Transformer Supply Chains
Written By: Mr. Rajesh Patawari, Managing Director, National Electrical Equipments Corporation

In the intricate world of global energy infrastructure, transformers are essential components, quietly enabling the smooth transmission and distribution of electrical power. These devices are the backbone of energy systems, ensuring that power reaches homes, industries, and businesses across the globe. For decades, countries like China, Germany, and the United States have been the dominant forces in transformer manufacturing, but in recent years, India has been making significant strides in this industry. The country’s growing presence in global transformer supply chains signals a shift that is both intriguing and indicative of its rising industrial influence.
In 2023, India’s export of electrical transformers reached a new peak, totaling $3.59 billion, marking the country as the 10th largest exporter of transformers worldwide. The United States was the largest importer, purchasing $1.02 billion worth of transformers from India, with other nations like the Netherlands, China, and the UK following closely behind. These figures are not just impressive in isolation; they represent a clear upward trajectory, with exports to markets like the Netherlands increasing by 41% compared to previous years. This consistent growth highlights India’s expanding role as a global supplier of high-quality transformers.
What makes India’s emergence in the transformer market particularly noteworthy is the variety of products it now exports. While transformers themselves form the core of these exports, India has also made significant headway in exporting transformer parts and components. In 2023, exports of transformer parts and static converters amounted to $449 million. The United States remained the largest importer of these components, followed by markets in the Middle East and Europe. This expanding product range speaks volumes about India’s ability to meet the varied demands of different international markets, showcasing both its technical expertise and adaptability.
India’s success in this sector is not just about increasing export volume. The country has effectively entered new markets, some of which were previously dominated by other manufacturers. While the US and Europe remain key markets, India is increasingly making inroads into emerging markets like Mexico, Bangladesh, and Hong Kong. This wider market penetration is a reflection of India’s growing reputation for delivering reliable, cost-effective transformers that meet international standards. It’s not just about competing with established players; it’s about carving out a space in markets that are essential for global energy development.
The competitive landscape is still challenging, with countries like China and Germany leading in overall transformer exports. However, India’s increasing share of the global market demonstrates that it can compete on quality and cost, two critical factors that play a central role in today’s global supply chains. While the larger manufacturers may have the advantage in volume, India’s focus on producing high-quality, affordable products has resonated with many customers worldwide.
Domestically, the Indian transformer market remains strong, valued at over INR 12,000 crore, with power transformers and distribution transformers making up nearly equal shares. Although the country faces challenges, such as a slowdown in power generation and transmission infrastructure development, the transformer sector continues to show steady growth. This stability in the domestic market provides India with a solid foundation to build its export capabilities, as the country’s manufacturing and logistics networks continue to improve.
Looking forward, India’s role in global transformer supply chains is set to grow even more. With the world increasingly focused on renewable energy and sustainable power systems, the demand for efficient and reliable transformers will continue to rise. India’s growing manufacturing capabilities, combined with its expanding market presence, position it to meet this global demand. As the country strengthens its energy infrastructure and develops more advanced technologies, its ability to supply transformers for green energy projects, such as wind and solar power, will become even more important.
The future of India’s transformer industry appears bright, with further growth expected in both domestic and international markets. As the world shifts toward cleaner energy, the need for reliable transformers will only increase, and India is well-positioned to meet that demand. The country’s growing presence in global supply chains is a sign of its increasing industrial capabilities and its determination to be a key player in the future of global energy systems. In the years to come, India’s role in transforming the world’s power infrastructure will be one to watch.
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Semikron Danfoss’ Module with ROHM’s latest 2kV SiC MOSFETs Integrated into SMA’s Large Scale Solar System
SMA Solar Technology AG, a leading global specialist in photovoltaic and storage system technology, adopts Semikron Danfoss’ Module with ROHM’s latest 2kV SiC MOSFETs inside its new large scale solar system “Sunny Central FLEX”, a modular platform designed to streamline and enhance grid connections for large-scale photovoltaic installations, battery storage systems, and emerging technologies.
“ROHM’s new 2kV class SiC MOSFETs are designed to enable simple and highly efficient converter topologies for 1500V DC-links. It is developed with high reliability targets and cosmic radiation robustness – addressing the stringent conditions and extended converter lifetime requirements of the photovoltaic sector and beyond,” says Wolfram Harnack, President at ROHM Semiconductor GmbH. “The technology of our SiC device structure and integrated on-chip gate resistance eases device paralleling and simplifies high power module designs. The mass production has started,” adds Harnack.
Semikron Danfoss’ SEMITRANS 20 has designed for high power applications and fast-switching operations, it represents the next generation of power modules for large converters. SEMITRANS 20 with ROHM’s 2kV SiC MOSFETs is an integral part of SMA’s Sunny Central FLEX. “Semikron Danfoss and ROHM have collaborated for over a decade, focusing primarily on the implementation of silicon carbide (SiC) in power modules. More recently, we have teamed up to integrate silicon IGBTs as well”, says Peter Sontheimer, Senior Vice President of Semikron Danfoss’ Industry division.
“The new SEMITRANS 20 offers simple, efficient solutions for 1500VDC applications. These modules are ideal for solar and energy storage inverters. Upcoming high-power electric truck chargers, as well as wind converters, will also benefit,” adds Sontheimer.
“The cooperation between SMA, Semikron Danfoss and ROHM is proof of how the seamless integration of innovative technologies creates the conditions for future-oriented energy projects,” said Bernd Gessner, Product Manager Power Conversion Systems at SMA. “The demands on these solutions are higher than ever. SMA has decades of expertise and fulfills the highest requirements in terms of performance, reliability, durability and flexibility. The fact that Sunny Central FLEX meets these highest future-proof standards is also the result of the excellent cooperation with our partners who share the same commitment to excellence.”
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Vishay Intertechnology Thick Film Power Resistor With Optional NTC Thermistor and PC-TIM Simplifies Designs and Saves Board Space
AEC-Q200 Qualified Device in Compact SOT-227B Package Offers High Pulse Handling Capability and Power Dissipation to 200 W
Vishay Intertechnology, Inc. introduced a new AEC-Q200 qualified thick film power resistor in the compact, low profile SOT-227B package for mounting on a heatsink. Available with an optional NTC thermistor for internal temperature monitoring and pre-applied Phase Change Thermal Interface Material for more efficient mounting, the Vishay MCB ISOA200 offers high pulse handling capability and high power dissipation up to 200 W at an 80 °C bottom case temperature.
Built on an exposed alumina substrate instead of a metal tab, the device released, lowers costs and weight for automotive, industrial, and avionics, military, and space (AMS) applications, in which it will serve as a precharge, discharge, active discharge, or snubber resistor. For applications subject to high and repetitive pulse surges, the resistor can handle high energy pulses up to 140 J for 0.1 s and is multi-pulsed tested. Additional custom testing options for the device are also available.
With the option to integrate an AEC-Q200 qualified, temperature cycle tested NTC thermistor inside the resistor package, the ISOA200 simplifies designs and saves board space, while its optional PC-TIM streamlines installation in production. The device’s high power and high energy dissipation further simplify designs while lowering costs by reducing the need for power components.
The ISOA200 features a resistance range from 10 Ω to 1 MΩ, with tolerances of ± 5 % and ± 10 %, and TCR of ± 100 ppm/K and ± 150 ppm/K. The resistor offers a maximum operating voltage of 1500 V, an operating temperature range of -55 °C to +150 °C, and dielectric strength of 4000 Vrms. The RoHS-compliant device offers a non-inductive design and can include two different resistors.
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Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design
Integrated low-power analog peripherals reduce design costs and complexity
Devices designed for capturing rapidly changing analog signals must respond quickly while consuming minimal power, especially in battery-operated applications. To address these demands, Microchip Technology has released the PIC16F17576 microcontroller (MCU) product family with integrated low-power peripherals and the ability to precisely measure volatile analog signals.
PIC16F17576 MCUs feature a new low-power comparator and voltage reference combination that can operate while the MCU core is in sleep mode, allowing for continuous analog measurement while consuming less than 3.0 µA of current. The Analog Peripheral Manager controls which peripherals are active to minimize total energy consumption and enable battery-operated applications to monitor signals effectively without excessive power drain.
Engineered for applications that measure volatile analog signals, PIC16F17576 MCUs include operational amplifiers with software-controlled gain ladders. This feature enables a single op amp to switch between multiple gain options, helping mitigate noise while maintaining precision and power efficiency. Equipped with up to four op amps and a 12-bit differential ADC with automated averaging, the MCUs enable precise signal measurement over a wide range of inputs.
“Sensor systems can quickly become complex, often requiring multiple analog components that add board size, cost and power draw,” said Greg Robinson, corporate vice president of Microchip’s MCU business unit. “With the integrated analog features in our low-power PIC16F17576 MCUs, we’re cutting that complexity. You can eliminate parts and reduce power consumption, cutting costs and simplifying the overall design process.”
PIC16F17576 MCUs are well suited for measuring analog signals in a number of industries, including environmental and industrial monitoring, smart home and building automation. Key applications include vibration and strain measurement, flow metering, gas detection, cold asset tracking and motion sensing.
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Rohde & Schwarz receives VESA approval for DisplayPort testing solutions
Rohde & Schwarz test solutions have been officially approved by the Video Electronics Standards Association (VESA) for testing DisplayPort technology. This achievement reinforces the company’s commitment to delivering high-quality solutions for testing of the physical layer compliant with various industry standards.
VESA has officially approved the test solutions from Rohde & Schwarz for DisplayPort 2.1 (HBR X) transmitter testing, providing manufacturers a toolset to validate their DP2.1 (HBR X) transmitters with confidence. This test solution is based on the R&S RTP oscilloscope and R&S ScopeSuite test automation software.
Additionally, Rohde & Schwarz vector network analyzers have been approved for DisplayPort cable/connector testing, supporting various data rates including DP80 (UHBR20), DP54 (UHBR13.5 and UHBR10), and DP8k (HBR3). The brand-new R&S ZNB3000 with its exceptional measurement speed is an ideal fit for this application and reduces the test time significantly. The R&S ZNBT multiport VNA and other vector network analyzers from Rohde & Schwarz are capable of performing this task, as well.
Beyond VESA-approved testing, the Rohde & Schwarz solutions also seamlessly integrate Embedded DisplayPort (eDP) transmitter testing, providing design engineers with a unified platform for comprehensive DisplayPort technology evaluation. This integrated approach enables manufacturers to efficiently test and optimize eDP transmitters utilizing the R&S RTP and R&S ScopeSuite solution.
Patrick McKenzie, Technology Manager, at Rohde & Schwarz, said: “We’re pleased to receive VESA’s approval for our DisplayPort testing solutions. This confirms our commitment to precise and reliable test tools for the evolving display technology landscape. Our solutions empower our customers develop innovative DisplayPort products quickly and efficiently, while meeting industry standards.”
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Microchip Unveils New High-Density Power Module for AI at the Edge Applications
The MCPF1412 power module with integrated I2C and PMBus interfaces for flexible configuration and monitoring
AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications. Microchip Technology announced the MCPF1412, a highly efficient and fully integrated point-of-load 12A power module with a 16V VIN buck converter and support for I2C and PMBus interfaces.
The MCPF1412 power module is designed to deliver superior performance and reliability, ensuring efficient power conversion and reduced energy loss. Its compact form factor of 5.8 mm × 4.9 mm × 1.6 mm and innovative Land Grid Array package significantly reduce the required board space by over 40% compared to traditional discrete solutions. This reduction in size, coupled with enhanced reliability and minimized PCB switching and RF noise, positions the MCPF1412 as a leading industry device.
“The MCPF1412 is highly compatible with our FPGAs and PCIe solutions, providing a comprehensive solution for Microchip customers,” said Rudy Jaramillo, vice president of Microchip’s analog power interface division. “This innovative solution minimizes space usage by reducing chip placements when combined with other Microchip devices.”
The MCPF1412M06 is a versatile device that offers significant flexibility for configuration and system monitoring through the I2C and PMBus interfaces. Additionally, it supports standalone operation without a digital interface, allowing designers to easily configure output voltages using simple resistor divider adjustments and monitor the system via the Power Good output.
Other key features of the MCPF1412 include multiple diagnostic functions such as over-temperature, over-current and over-voltage protection for improved performance and reliability. The operating temperature range is TJ −40°C to +125°C. An on-board embedded EEPROM is available for programming the default power-up configuration.
Microchip offers a wide range of DC-DC power modules with input voltages from 5.5-70V, available in ultra-compact, rugged and thermally enhanced packaging to improve high power density.
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XENSIV 4th generation of magnetic switches supports functional safety up to ASIL B in automotive applications
When developing applications for autonomous driving, compliance with the ISO 26262 standard is crucial – at both the system and sensor levels. To meet these demands, Infineon Technologies AG introduces the XENSIV TLE4960x magnetic switch family. Developed in accordance with ISO 26262, the TLE4960x switches integrate diagnostic functions to support functional safety applications with requirements up to ASIL B. They are the only ASIL-B-compliant switches on the market that can address a wide range of automotive applications, including window regulators, sunroof actuators, and seat adjustment. In addition, the devices are AEC-Q100 compliant and qualified to Grade 0, ensuring robust performance in harsh environments.
The TLE4960x devices are designed to measure the magnetic field orthogonal to the printed circuit board in the Z-direction and feature an open-drain output for speed information. They also include integrated overcurrent and overtemperature protection. Housed in a standardized SOT23-3 SMD package, the sensors require only 1.6 mA and operate across an extended temperature range from -40°C to 175°C. Their excellent temperature stability makes them ideal for harsh automotive environments.
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Navigating the Future: Key Tech Trends Shaping 2025 and Beyond
As we near the halfway mark of this decade, the pace of technological advancement continues to surge like never before. These advancements aren’t just changing how we work and live—they’re redefining what’s possible. Based on emerging research and industry forecasts, here are the most significant developments poised to reshape our world in the coming years.
The Sustainability Revolution Goes MainstreamTechnological progress is now being driven by a deep commitment to environmental responsibility. Cutting-edge solutions like carbon-neutral data centers, self-healing materials, and AI-powered energy optimization systems are moving from experimental to essential. The next wave of innovation will blur the line between ecological preservation and technological advancement, creating a new standard for responsible development.
AI Transforms from Assistant to ArchitectArtificial intelligence is undergoing its most profound evolution yet. Beyond automating tasks, next-generation AI systems will design solutions, predict market shifts before they occur, and even contribute to scientific breakthroughs. This shift will create new opportunities in fields ranging from pharmaceutical research to urban planning, fundamentally altering how we approach complex challenges.
Urban Ecosystems Come AliveCities are evolving into responsive, intelligent organisms. Through a combination of advanced IoT networks, distributed computing, and real-time analytics, metropolitan areas will dynamically adapt to their inhabitants’ needs. Imagine streetlights that adjust based on pedestrian flow, or waste systems that predict and prevent overflow—these are no longer futuristic concepts but imminent realities.
Technology Disappears into ExperienceThe most profound tech innovations will be the ones we don’t notice. Frictionless interfaces, anticipatory systems, and biologically inspired designs will make technology feel increasingly natural and intuitive. This invisible revolution will prioritize human needs over technical specifications, creating experiences that adapt to us rather than requiring us to adapt to them.
Security Becomes Proactive and PredictiveIn our hyperconnected world, cybersecurity is evolving from defense to anticipation. Emerging technologies like behavioral biometrics and quantum-resistant cryptography will create systems that identify threats before they materialize. This paradigm shift will redefine trust in the digital age, enabling safer innovation across all sectors.
Charting the Course ForwardThese converging trends reveal a future where technology serves as both catalyst and compass—driving progress while helping us navigate its implications. For businesses and individuals alike, success will depend on understanding these transformations and adapting with intention.
The coming years promise extraordinary possibilities, but they demand equally extraordinary vision. Those who can anticipate these shifts and harness their potential will shape not just their own future, but the future of our interconnected world.
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Powering a Sustainable Future: How STMicroelectronics is Leading by Design
Championing sustainability through technology, people, and planet
In a world racing against the clock to combat climate change and build a more equitable future, STMicroelectronics (ST) is making bold, tangible strides toward becoming a global sustainability leader in the semiconductor industry.

From carbon neutrality pledges to sustainable innovation, ST is embedding environmental and social responsibility into the heart of its operations. The company’s sustainability journey is not an afterthought—it’s a carefully architected strategy that places the planet, people, and purposeful technology at the core of its mission.
In this exclusive interview, Mr. Edoardo Auteri, S&M Head of Sustainability Programs, APeC Region, shares insights on ST’ new long-term sustainability goals and commitments.
Protecting the Planet: From Footprint to Handprint
ST’s commitment to environmental sustainability is evident in its ambitious goal to achieve carbon neutrality by 2027, encompassing direct (Scope 1), indirect (Scope 2), and select Scope 3 emissions. By the end of 2023, the company had reduced its Scope 1 and 2 greenhouse gas emissions by 45% compared to its 2018 baseline, moving closer to its 50% reduction target by 2025.
71% of ST’s electricity in 2023 was sourced from renewables, rising to 84% by the end of 2024. The company aims to reach 100% renewable electricity by 2027 through a combination of on-site solar, green energy certificates, and long-term power purchase agreements (PPAs) across global sites.
Water stewardship and waste management are integral to ST’s environmental strategy. In 2024, ST recycled 54% of its water usage and continues to invest in water-saving programs across all manufacturing sites.
More here: Protecting the Planet – STMicroelectronics
Sustainable Technology: Innovation with PurposeST’s dedication to sustainable innovation is reflected in its products and technologies. All new products undergo an eco-design process, ensuring environmental considerations are integrated from the outset.
The company’s semiconductors play a crucial role in enabling energy-efficient applications across various sectors, including electric vehicles, renewable energy systems, and smart devices. Notably, 40% of ST’s revenue is now EU-Taxonomy eligible, highlighting its alignment with sustainable economic activities.
More here: Sustainable Technology – STMicroelectronics
Prioritizing People: Empowering Teams and CommunitiesAt the heart of ST’s sustainability strategy is a commitment to its people. In 2024, 84% of employees rated ST as a great place to work, reflecting a strong organizational culture.
The company emphasizes health and safety, achieving a recordable case rate of 0.54 for ST employees in 2024. Diversity and inclusion are also prioritized, with 10 out of 11 sites receiving RBA Platinum recognition.
ST’s community engagement is evident through its employees donating over 156,000 hours to volunteering activities in 2023, demonstrating a strong commitment to societal well-being.
More here: Prioritizing People – STMicroelectronics
Sustainability Commitments: A Clear RoadmapST’s sustainability efforts are guided by a comprehensive framework aligned with the United Nations Sustainable Development Goals (SDGs). The company has set 24 measurable sustainability goals for 2025, encompassing environmental performance, governance, and social impact.
Governance structures, including an Executive Sustainability Council chaired by the CEO, ensure that sustainability is embedded at the highest levels of decision-making. ST’s transparency and commitment have been recognized by independent agencies, with the company receiving A- scores for CDP water security and climate change.
As the global community intensifies its focus on sustainability, STMicroelectronics exemplifies how integrating environmental and social responsibility into business operations can drive meaningful change. Through its continued efforts, ST is not only advancing semiconductor technology but also paving the way for a more sustainable and equitable future.
More here: Sustainability Commitments – STMicroelectronics
ConclusionAs climate urgency grows and ESG becomes a boardroom imperative, STMicroelectronics is not just adapting—it’s innovating for good. With a long-term vision that combines technological excellence, environmental stewardship, and social equity, ST is shaping a future where semiconductors are smarter, greener, and more human-centered.
In the story of sustainable transformation, ST isn’t just a character—it’s becoming one of the leading authors.
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Continental Group Sector Automotive will be Named Aumovio in the Future
- Aumovio combines tradition and a strong market position in the automotive industry with the ambition to shape the mobility of the future
- With the announcement of the new name at Auto Shanghai 2025, Automotive underlines the importance of the growth market of China and its “in the market for the market” approach
- Philipp von Hirschheydt, Member of the Executive Board of Continental and CEO Automotive: “We have consistently aligned automotive with future technologies and are picking up on market developments quickly, innovatively and from a strong competitive position. This means that we are consistently on our way to becoming an adaptive automotive powerhouse. Our future brand also reflects this ambition”
Continental group sector Automotive presented its future name at Auto Shanghai. The independent automotive company will be named Aumovio. The name of the new company combines the strong market position, heritage and technological expertise in the automotive industry with the ambition to shape the mobility of the future with innovations. Aumovio will offer electronic products and advanced mobility solutions for the software-defined vehicle and safe, exciting, connected and autonomous mobility to a wide range of global customers. According to a market analysis by Berylls, Automotive expects the value of solutions per vehicle in these segments to grow by an average of 4.7 percent annually until 2029 – and more dynamically than the number of passenger cars and light commercial vehicles produced worldwide (based on market forecast by S&P Global Mobility). At the Auto Shanghai this year, the group sector also presented its “in the market for the market” approach and several innovative technologies for Chinese customers and the Chinese market. Following the expected approval at the Continental Annual Shareholders’ Meeting on April 25, 2025, Aumovio is scheduled to list on the Frankfurt Stock Exchange in September 2025.
“As an independent company, we gain significantly more creative power and speed. Aumovio will be characterized by a triad of technologically leading products, a consistent value creation strategy and a global synergetic network, combined with a strong local presence for our customers. Our aim is to further expand our position in the future fields and growth markets of mobility. This strategy is particularly evident in China. Among other things, we are relying on our strong local presence by producing and developing locally for the Chinese market,” says Philipp von Hirschheydt, Member of the Executive Board of Continental and CEO of Automotive.
Continental’s group sector Automotive has been present in China for 30 years and employs around 10,000 people there. In the 2024 financial year, Automotive generated around 14 percent of its global sales in China. At Auto Shanghai, Automotive presented the Luna and Astra driver assistance systems, among others. Both were developed in the joint venture Horizon Continental Technology, for the Chinese market. Luna is an assistance system and supports active safety as well as basic driving and parking functions to increase safety and comfort. Astra is an advanced assistance system and enables, among other things, assisted driving without a high-resolution map and parking assistance with memory function.
Modern mobility solutions from Automotive
The future Aumovio offers highly developed electronic products and modern mobility solutions. In addition to its strong market position with innovative sensor solutions, displays, and technologically leading braking and comfort systems, Aumovio has significant expertise in software, architecture platforms and assistance systems for the rapidly growing future market of software-defined and autonomous vehicles. The Automotive group sector employs around 92,000 people and generated sales of around 19.4 billion Euros in the 2024 financial year.
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Bosch presents new software and hardware for assisted and automated driving
New radar sensor with Bosch’s own computing chip (SoC) and flexible ADAS solution packages
- The Bosch ADAS product family is a flexible modular system for driver assistance. Bosch is to equip the first passenger cars in China from mid-2025.
- Bosch is the first Tier 1 supplier to present a new radar sensor with a complete in-house design and its own system-on-chip (SoC).
- The future portfolio for driver assistance and automated driving is rounded off by a next-generation multi-purpose camera and inertial sensor unit.
Bosch is presenting its extensive portfolio of solutions for assisted and automated driving and parking. It includes software features and hardware components that the technology group is aligning with the expectations of local drivers and can be easily customized for different customer needs. With its radar sensor, Bosch is the first Tier 1 supplier worldwide to break new ground and develop and manufacture the entire product in-house. The special feature: The sensor has a computing chip specially developed by Bosch–known as an SoC–which combines high computing power with the smallest possible footprint. The radar sensor fits into Bosch’s newly designed modular system for assisted and automated driving: The Bosch ADAS product family (Advanced Driver Assistance Systems) offers a kind of ecosystem of software, sensors and services as well as the appropriate high-performance computers. Customers can make use of this and flexibly utilize the comprehensive solutions for various markets and vehicle segment – from low-cost small cars to high-performance premium models. The goal: Bosch wants to enable manufacturers worldwide to bring driver assistance functions to the mass market more easily, quickly, and cost-effectively. A new generation of the multi-purpose camera and the inertial sensor unit for the precise localization of assisted and automated vehicles complement the sensor portfolio.
“With our new Bosch ADAS product family, we are offering cost-efficient solutions for assisted and automated driving to the usual high standards of quality and safety. We have the right software and hardware for driver assistance functions, from small cars to mid segment and premium vehicles. This enables car manufacturers to integrate functions quickly and easily into their vehicles and bring them to market very fast.”
Christoph Hartung, President of the Cross-Domain Computing Solutions division at Robert Bosch GmbH.
“With our new Bosch ADAS product family, we are offering cost-efficient solutions for assisted and automated driving to the usual high standards of quality and safety. We have the right software and hardware for driver assistance functions, from small cars to mid segment and premium vehicles. This enables car manufacturers to integrate functions quickly and easily into their vehicles and bring them to market very fast,” says Christoph Hartung, President of the Cross-Domain Computing Solutions division at Robert Bosch GmbH
New Bosch ADAS product family in three equipment variants
Advanced driver assistance systems help to increase safety and comfort on the road. For example, by providing the driver with targeted support during monotonous and tiring driving tasks. Bosch has many years of experience with driver assistance systems, their development and integration into the vehicle. A deep understanding of each vehicle area is required for optimum implementation. With this expertise, Bosch is repositioning the ADAS product family. It enables assisted driving and parking up to SAE level 2, thus meeting the prevailing demand on the market. Bosch offers the ADAS product family in three variants: for the entry segment, the mid segment and the high segment. The variants differ depending on the scope of the software, the number and combination of sensors, and the required computing power. Seamless harmonization of these individual components facilitates system integration. Bosch gives car manufacturers swift and uncomplicated access to driver assistance systems, enabling them to significantly accelerate the development time of their vehicles. Bosch brings its hardware and software components to the market both as a complete systemic solution and separately from each other, as is the case in modern vehicle development. This provides further scope, as individual components of the three variants can be exchanged and flexibly combined as required. Accordingly, manufacturers have further freedom to integrate the driver assistance systems into their cars on a brand-specific basis. Artificial intelligence can be found throughout the Bosch ADAS product family. Bosch uses it, for example, for perception and driving planning. Thanks to AI, the vehicle thinks ahead, pays attention to what other road users might be doing, and calculates the next steps to safely reach the destination.
The entry segment version already incorporates key safety and comfort functions into the vehicle. The car uses this to regulate its speed and distance from the vehicle in front depending on the situation and keeps in lane when lane markings are clearly visible. This variant can be implemented as a purely camera solution with the new multi-purpose camera from Bosch, but can also be supplemented with up to five radar sensors depending on the safety requirements (of a country). The variant for the mid segment unlocks even more extensive functions. For example, an extended lane keeping assist that can also cope with lane markings that are not visible in places. In this variant, Bosch combines its camera heads for perception with additional sensors. The computing power no longer takes place in the camera itself, but in a more powerful central vehicle computer, as is becoming standard in software cars. Thanks to Bosch, the vehicle masters more complex traffic scenarios, which further increases driving comfort and safety on freeways and in heavy traffic. The system also pays attention and supports the driver. Bosch is already introducing hands-free driving on the freeway in this variant, provided the legal framework in the respective country permits it. This means that the driver can take their hands off the steering wheel at times, but still remains responsible. The variant for the high segment represents the pinnacle of Bosch driving assistance. It uses a 360-degree video belt and impresses with even greater computing power, so that the vehicle can handle urban junctions with ease and safely enter and exit roundabouts. Hands-free driving is extended to urban traffic in this version, provided that the legal requirements in the markets allow it. Bosch takes into account the various regulatory requirements and safety assessments
Bosch ADAS product family goes into serial production in mid-2025
The equipment variant for the mid-range segment will go into serial production with a Chinese manufacturer in the middle of this year. Users of this system will benefit from an assistance system linked to the navigation system, which is particularly popular among Chinese customers. The vehicle then independently carries out driving maneuvers along the route entered, such as changing lanes on freeways. The driver remains responsible and must be ready to intervene at any time. This function makes driving in the heavy traffic of Chinese cities more convenient and safer. Bosch has also already secured its first orders for the high segment version, with serial production expected to start in summer 2025. Bosch has already acquired half a dozen new customers for the ADAS product family for mid- and high segment in China, including BAIC, Dongfeng and Jetour. Bosch is thus continuously strengthening its leading position in the global ADAS market.
New radar sensor with Bosch SoC
Radar sensors are key components of driver assistance systems and modern vehicles would be inconceivable without them. For the new generation of its radar sensor, Bosch has developed and manufactured all core elements in-house, including the computing chip (SoC). The new Bosch radar sensor uses “RF CMOS technology,” which enables the efficient integration of high-frequency and digital circuits on a single chip. The structure size of the transistors of only 22 nanometers makes the chip particularly powerful and efficient despite its small footprint. Bosch is the first Tier 1 supplier on the market to introduce this technology in serial production.
New generation of the multi purpose camera
With the increasing market penetration of more extensive driver assistance functions in the lower price segments, high-performance yet affordable camera solutions are steadily gaining in importance. The new multi purpose camera from Bosch enables assisted driving and parking functions (up to SAE level 2) from the entry segment. Serial production is scheduled to start in 2026, initially in the Chinese market. Bosch’s own optical image processing module in the new camera generation ensures optimum sharpness and precision over the entire product service life, even in highly fluctuating temperatures. The camera is particularly durable, with consistently stable functional performance.
With its 8 megapixel image sensor, a horizontal field of vision of 120 degrees, and a detection range of up to 300 meters, the camera enables safety and convenience functions for assisted driving. These include adaptive cruise control and distance control, emergency braking within your own lane, lane keeping in urban areas, and detection and stopping at red lights
The new multi purpose camera is the central interface for the fusion of various sensor data. This means that the camera combines the data from its own image sensor and additionally from up to five radars and other sensors such as driver monitoring cameras or interior sensors. This integrated approach enables OEMs to reliably comply with mandatory ADAS regulations (e.g. General Safety Regulation), improve driving safety, and support the driver on the freeway (e.g. with assisted lane changes).
Safe localization in all driving situations
For assisted and automated driving, it is essential that vehicles can locate themselves precisely and safely at all times. Even in difficult visibility conditions and in the absence of lane markings or if the signal from the global navigation satellite system (GNSS) fails – for example, when driving through a tunnel – it is essential that the vehicle’s location can be determined reliably. This is the only way to guarantee a high level of functional availability. At the largest automotive trade fair in China, Bosch is presenting for the first time the new generation of its high-performance inertial measurement unit (IMU), which has been specially designed for ADAS and vehicle dynamics applications. Vehicles pitch when braking, lean to one side (roll) or lurch (swerve) when taking corners. In addition to these movements, the inertial sensor unit measures the vertical, longitudinal and lateral acceleration of the vehicle. From this, it can precisely calculate the relative change in position of the vehicle, enabling it to maintain the originally planned route with only minimal deviation. With various product variants, Bosch offers a high degree of scalability, from the cost-effective entry segment variant for assisted driving to the high-performance sensor for automated driving up to SAE level 4. Bosch uses sensor modules that are manufactured in the company’s own production facilities and, in addition to an in-depth understanding of the system, can draw on a comprehensive range of experience from over three decades of developing such inertial sensors.
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OMNIVISION Launches 1.5-Megapixel Global Shutter Sensor for Automotive Driver Monitoring Systems
The new OX01N1B is designed to be a cost-effective solution for DMS cameras and features industry-leading QE, MTF and low power
OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, announced the new OX01N1B image sensor for in-cabin automotive driver monitoring systems. The device is the newest addition to OMNIVISION’s industry-leading Nyxel near-infrared technology family of automotive sensors and is a 1.5-megapixel RGB-IR or monochrome BSI global shutter (GS) sensor with a pixel size of 2.2 microns (µm) and an optical format of 1/4.51-inch. OMNIVISION will showcase the OX01N1B sensor with eco-system partners at Auto Shanghai, taking place April 23-May 2, 2025.
Key features of the OX01N1B include industry-leading NIR quantum efficiency at 36% for excellent low-light performance, a high modulation transfer function for better image quality and resolution, low power consumption, and an optical format that enables extremely compact camera module design. The OX01N1B uses OmniPixel 4-GS technology for simultaneous image detection in all pixels to accurately reproduce rapid motion without any distortions.
“Driver monitoring systems will be mandatory for all new cars in Europe starting in 2026; the entire global automotive industry is experiencing greater adoption rates of DMS as well, in an effort to improve road safety. As a result, OMNIVISION is introducing the new OX01N1B, which is the ‘sweet spot’ among performance, size and cost for mainstream DMS applications,” said Dr. Paul Wu, head of automotive product marketing, OMNIVISION. “The OX01N1B chip size is even smaller than the previous OX01H1B and it can reuse the same optical path since the pixel size and optical array size is identical. We’ve also added image signal processing to the OX01N1B device.” Dr. Wu adds, “There are many design considerations for DMS. With our expanded portfolio, we offer automotive OEMs a variety of cost and performance options and greater flexibility to place the DMS camera into different locations in their next-generation vehicle designs.”
“OMNIVISION’s new OX01N1B sensor delivers exceptional performance in a remarkably compact format, which makes it a perfect fit for our latest innovation, the All-In-One camera AI ONE,” said Martin Krantz, CEO and Founder of Smart Eye. “With this sensor at its core, we’ve been able to build the integrated DMS we’ve always envisioned, bringing together camera, sensor, processing, and software in a single, self-contained unit.”
The OX01N1B has integrated ASIL-B and cybersecurity that meet the latest industry standards. It comes in an OMNIVISION a-CSP package, allowing for higher-performance image sensors in tighter camera spaces. It is available in a reconstructed wafer option for designers who want to assembly a bare die imager into their camera module.
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Renesas Debuts New Group in Popular RA0 Series with Best-in-Class Power Consumption and Extended Temperature Range
Low-Cost RA0E2 Devices Target Consumer Electronics, Small Appliances, Industrial System Control and Building Automation
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the RA0E2 microcontroller (MCU) Group based on the Arm Cortex -M23 processor. The new, cost-competitive devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.
Renesas introduced the RA0 MCU series in 2024 and it has quickly become very popular with a wide range of customers due to its affordability and low power consumption. RA0E1 devices have already been adopted in consumer electronics, appliance and white goods, power tools, industrial monitoring and other applications.
RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.
Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.
Feature Set Optimized for Low Cost
The RA0E2 devices have a feature set optimized for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.
In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.
“The market reception for our RA0 Series has exceeded even our own high expectations,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “The RA0E2 Group MCUs deliver the same ultra-low power and price point that have been so popular with our customers. The addition of extended temperature range and more memory opens up even more applications and use cases. We plan to further expand the RA0 product lineup, delivering optimal solutions for 8-16 bit MCU users transitioning to 32-bit MCUs.”
Key Features of the RA0E2 Group MCUs
- Core: 32MHz Arm Cortex-M23
- Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM
- Extended Temperature Range: Ta -40°C to 125°C
- Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC
- Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs
- Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
- Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection
- Security: Unique ID, TRNG, AES libraries, Flash read protection
- Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP
The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices.
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Infineon and Marelli enter new era of automotive cockpit design with MEMS laser beam scanning at 2025 Auto Shanghai
Infineon Technologies AG, a global semiconductor leader in power systems and IoT, and Marelli, a world-leading automotive systems manufacturer, are partnering to advance automotive display technology with an innovative MEMS laser beam scanning (LBS) system. Based on Infineon’s LBS technology, this solution enables Marelli to create immersive cockpit experiences free from the constraints of traditional displays. This cutting-edge technology will be showcased at Marelli’s booth during Auto Shanghai 25.
“The automotive industry’s demand for innovative optics solutions in cockpit designs is accelerating, and Infineon is committed to delivering these solutions to our customers faster than ever before,” said Dr. Thomas Schafbauer, Head of Sensor and RF Business Unit at Infineon. “With our focus on a faster time to market, we’re helping our customers stay ahead of the curve and capitalize on the growing demand for next-generation display technologies.”
“We are thrilled to collaborate with Infineon on MEMS LBS, which represents a significant leap in automotive display technology,” said Joachim Fetzer, Chief Technology and Innovation Officer at Marelli. “This innovative solution offers significant design freedom and efficiency, enabling us to create unique and engaging cockpit experiences for our customers with a faster innovation-to-customer approach.”
The Infineon MEMS LBS system is fully automotive-compliant. It is shock and vibration robust, and compliant up to ASIL-B. Its compact chip-scale package ensures versatility and enables flexible design possibilities for easy integration across various applications. Furthermore, the system’s high efficiency provides a bright, clear display even in high ambient light conditions and reduces power consumption and heat generation, making it highly suitable for demanding automotive environments. A large depth of field also offers focus-free projection, simplifying the optical design. These features allow OEMs to differentiate their cockpit designs while maintaining rich information displays.
The Infineon MEMS LBS system will be showcased at Marelli’s booth (Hall 1.2H, booth 1BF009) during Auto Shanghai 25.
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