ELE Times

Infineon Technologies AG has introduced the TRAVEOTM CYT4EN, a new microcontroller (MCU) for cost-effective high-performance instrument clusters and display applications in the automotive industry, including two-wheelers. The automotive cluster MCU is designed to leverage external LPDDR4 memory, resulting in capabilities that traditionally required more complex SoC (System-on-chip)-based platforms: The device supports advanced 2.5D graphics and 3D scene rendering, drives high-resolution displays up to Full HD, and can power two displays simultaneously. At the same time, it reduces system complexity and the bill of materials compared to SoC-based platforms.

“Cutting-edge cluster and display solutions are playing a central role for the user experience in connected and software-defined vehicles,” said Thomas Boehm, Senior Vice President Automotive Microcontrollers at Infineon. “With TRAVEO T2G CYT4EN, we are helping our customers bring them to market more quickly, efficiently and cost-effectively. By combining the simplicity, safety, and fast responsiveness of an MCU architecture with the high-bandwidth memory required for modern cockpit graphics, we are enabling a new generation of vehicle displays.”

While developing CYT4EN, Infineon collaborated closely with Micron to optimize the memory subsystem for the use of LPDDR4 memory to support advanced graphic capabilities while maintaining overall system efficiency.

“Micron’s automotive LPDDR4 memory provides a proven combination of bandwidth, reliability, and functional safety features for cost-optimized cockpit platforms,” said Amanda Henderson, Director of Ecosystem Enablement at Micron. “For vehicle programs where affordability, longevity, and functional safety are key requirements, LPDDR4 remains an effective solution for delivering modern display experiences.”

Built on the proven TRAVEO T2G architecture, the CYT4EN combines high-performance processing, advanced graphics, and automotive-grade safety and security in a highly integrated device. It includes features such as on-the-fly rendering and hardware-accelerated decompression to enable a rich graphical user experience. The device delivers deterministic boot times below 150 milliseconds that are significantly shorter than the multi-second initialization common to complex SoC platforms. It supports functional safety up to ASIL-B according to ISO 26262 and was developed in accordance with ISO 21434 for automotive cybersecurity. In addition, an independent voltage domain keeps central system functions such as communication and basic processing active in low-power modes, improving system efficiency and robustness.

The high level of integration enables cost-effective smart cockpit designs without complex system implementations. For example, CYT4EN allows designs without additional microcontrollers for system management and in-vehicle network communication, enables simplified PCB layouts with as few as six layers, and avoids the need for active cooling thanks to optimized power efficiency.

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Keysight Technologies has collaborated with the University of Glasgow, the National Physical Laboratory (NPL), and MPI Corporation to develop a new approach to broadband characterization of next-generation sub-terahertz (sub-THz) semiconductor devices. Together, the organizations demonstrated continuous on-wafer characterization of indium phosphide high-electron-mobility transistors (InP HEMTs) from near DC to 250 GHz in a single sweep, simplifying broadband measurements for advanced semiconductor research and design.

As semiconductor technologies move into millimeter-wave and sub-terahertz frequencies for next-generation applications, engineers need to accurately characterize transistor performance across increasingly broad frequency ranges. Conventional approaches can require multiple measurement setups and calibrations, adding complexity and making it more difficult to obtain consistent data for broadband device modeling.

The four organizations combined Keysight instrumentation, University of Glasgow semiconductor devices, MPI Corporation on wafer probing technology, and NPL metrology expertise to create the broadband measurement solution. The setup brought together:

• Keysight’s PNA-X Vector Network Analyzer
• Keysight’s Single-Sweep 250 GHz Frequency Extender
• Keysight’s Precision Source/Measure Unit (SMU)
• University of Glasgow’s InP HEMT devices and on-wafer calibration standards
• MPI Corporation’s broadband on-wafer probing technology and calibration software
• NPL’s high-frequency metrology and calibration methodologies

Together, these technologies enabled continuous measurement from near DC to 250 GHz with a single probe touchdown, eliminating the need for multiple setup changes and providing consistent broadband S-parameter measurements. Built-in source filtering and broadband source power calibration also helped ensure signal purity of the applied millimeter-wave signal at the probe-tip.

Thierry Locquette, VP of Sales, Europe, Middle East & Africa at Keysight said: “Characterizing devices continuously from near DC to 250 GHz in a single sweep can significantly simplify the measurement process for researchers developing next generation semiconductor technologies. By bringing together expertise in instrumentation, devices, probing, and metrology, this collaboration demonstrates a practical approach to generating the consistent broadband data engineers need to accelerate device development.”

Dr Xiaobang Shang, Principal Scientist and On-wafer Measurement Lead at NPL, said: “Accurate on-wafer measurement is essential for developing reliable semiconductor devices, particularly as technologies move further into the millimetre-wave and sub-terahertz frequency ranges. We were pleased to contribute NPL’s high-frequency on-wafer metrology and calibration expertise to this collaboration, helping demonstrate a practical route to consistent broadband device measurements using the state-of-the-art single sweep system.”

Matthew White, Director of Business Development at MPI Corporation, said: “Extending on-wafer characterization to 250 GHz requires the probing, calibration, and measurement platform operating as one seamlessly integrated system. This collaboration demonstrates a practical approach to achieving consistent broadband measurements from near DC to 250 GHz with a single probe touchdown, helping researchers simplify characterization and accelerate device development with great confidence.”

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Infineon Technologies today announced the completion of its acquisition of C2i Semiconductors, a Bengaluru-based technology company specialising in software-defined multiphase controllers and smart power stages for AI data centre applications. C2i Semiconductors’ technology complements Infineon’s leading portfolio of power semiconductors and power systems, enabling intelligent and scalable power delivery architectures from grid to core for AI servers and high-performance computing platforms. The acquisition further strengthens Infineon’s leadership in power solutions for AI data centres, expands its engineering capabilities in India and reinforces the country’s role as a strategic innovation hub. With the completion of the transaction, the C2i Semiconductors team becomes part of Infineon’s Power Systems division.

“Completing this acquisition marks an important milestone for our AI power business and our innovation activities in India,” said Adam White, President of Infineon’s Power Systems division. “C2i Semiconductors brings exceptional expertise in software-defined power management and system-level power architectures, backed by a highly experienced engineering team. By combining these capabilities with Infineon’s semiconductor technologies, application know-how, manufacturing capabilities and global customer reach, we will accelerate innovation in power delivery solutions for AI data centres and create significant value for our customers. I am delighted to welcome the C2i team to Infineon.”

Software-defined power solutions combine advanced power semiconductors with intelligent digital control and software algorithms to optimise power conversion, regulation and system performance in real time. As increasingly powerful AI processors create highly dynamic and rapidly changing power demands, power delivery systems must respond faster and more precisely to sudden load fluctuations while maintaining efficiency and system stability. By adding intelligence to the power delivery architecture, software-defined solutions can help improve efficiency, reduce power losses and support the increasing power density requirements of next-generation AI processors.

The acquisition combines C2i Semiconductors’ digital power expertise with Infineon’s global scale, application know-how and broad portfolio of power semiconductors, including silicon, silicon carbide (SiC) and gallium nitride (GaN) technologies, as well as vertical power delivery solutions. Together, the teams will accelerate the development of more intelligent, efficient and scalable power delivery solutions for AI infrastructure, including future Substrate Integrated Voltage Regulators (SIVR).

C2i Semiconductors adds expertise in software-defined power management, multiphase controllers, smart power stages, digital control technologies and system-level power architectures. The combination strengthens Infineon’s capabilities across the entire power path from grid to core and supports the development of next-generation power solutions for AI servers and high-performance computing platforms.

The acquisition also adds highly specialised engineering expertise to Infineon’s global R&D network and further strengthens its innovation capabilities in India. The combined team will contribute to reinforcing Bengaluru’s role as an important innovation location for digital power technologies and to accelerating the development of next-generation power solutions for AI infrastructure. Infineon currently employs approximately 2,800 people across multiple locations in India.

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As AI data centers scale to support high-power GPU clusters, the industry is shifting toward 800V DC rack power architectures to improve distribution efficiency, increase power density and support next-generation server designs. To help accelerate this transition, Microchip Technology and Navitas Semiconductor (Nasdaq: NVTS) have collaborated on an 800V DC-to-6V DC reference design for AI data center rack power applications.

The platform combines Microchip’s digital power control and security technologies with Navitas’ GaNFast gallium nitride (GaN) power devices to give developers a practical path to implement high-efficiency power conversion aligned with the Open Compute Project (OCP) 800V DC standard. Complete with reference hardware, software and design documentation, the solution helps reduce design risk, shorten development cycles and accelerate deployment of next-generation AI infrastructure.

“AI infrastructure optimization is driving one of the most significant power architecture transitions the data center industry has experienced in decades,” said Joe Thomsen, corporate vice president of Microchip’s digital signal controller business unit. “As the ecosystem moves toward higher-voltage rack power systems, developers need proven control and security to help reduce implementation risk. Our collaboration with Navitas combines digital control, hardware-based security and advanced GaN power conversion to help customers bring 800V rack power systems to market more quickly.”

At the core of the reference platform are Microchip’s dsPIC33AK Digital Signal Controllers (DSCs) and TA100 CryptoAuthentication security IC, paired with Navitas’ GaNFast FETs. The dsPIC33AK provides deterministic digital power control for high-frequency, high-efficiency DC/DC conversion, while the TA100 helps establish a hardware root of trust for authentication, secure boot and protected firmware updates. Together, these technologies make up the precision control and security foundations required for connected OCP power supply designs. The dsPIC33AK256MPS306 family is powered by a 200 MHz 32-bit core with a double-precision floating-point unit (FPU), 78 ps high-resolution Pulse Width Modulators (PWMs) and multiple 12-bit Analog-to-Digital Converters (ADCs) operating at up to 40 MSPS. The devices include library support for Commercial National Security Algorithm (CNSA) Suite 2.0 recommended post-quantum cryptographic algorithms and hardware-accelerated cryptographic functions for connected real-time control designs.

This PDB is powered by 16 × NV6034, 650 V, 17 mΩ GaNFast FETs in a stacked half-bridge topology on the primary side. The DFN8×8 dual-side-cooled package extends the performance advantages of GaN by reducing thermal resistance, allowing higher continuous power operation while maintaining exceptional efficiency. The PDB targets delivering up to 96% peak efficiency at full load with 1 MHz switching frequency, enabling a power density of 2,100 W/in³.

Approximately 20% thinner than a mobile phone, its ultra-low profile enables extremely close integration with the GPU board, maximizing transient performance and improving power distribution efficiency. Navitas’ system-level approach helps translate advances in GaN technology into measurable improvements in efficiency, power density, transient performance and total cost of ownership. Direct conversion from 800V DC to 6V DC combines both 800V DC to 50V DC and 50V DC to 6V DC conversion stages into one converter, delivering higher end-to-end efficiency.

“As AI infrastructure scales to support increasingly demanding computing platforms, Navitas’ GaNFast technology is a critical enabler of higher power density, greater efficiency and improved system performance,” said Vipin Bothra, vice president of Global Solution Marketing at Navitas Semiconductor. “By combining Navitas’ leadership in power semiconductors with Microchip’s digital control expertise, this collaboration accelerates the delivery of advanced power solutions tailored to the evolving requirements of next-generation AI data centers.”

Hardware-based security is integrated through Microchip’s TA100 CryptoAuthentication IC, enabling developers to establish a trusted foundation for system authentication and protection without implementing these capabilities from scratch. The TA100 device provides support for code authentication, including secure boot, Message Authentication Code (MAC) generation, trusted firmware updates, multiple key management protocols including Transport Layer Security (TLS), and other root-of-trust-based operations.

The Microchip and Navitas reference design provides a platform for developing high-voltage, high-power, compact rack power systems for AI data centers. The design is supported with a reference board, software and documentation, giving developers access to the resources needed to evaluate and accelerate deployment of 800V DC power conversion systems for AI data center applications.

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​AI is leaving the question-answering and content-generation stage. The frontier of the next generation of AI is agentic AI. That’s an AI that perceives an objective, reasons about the problem by planning, compares multi-step plans, accesses external tools, and acts independently without a human operator. Moving from a stand-alone question-answering bot that responds to a prompt to an agent to execute a task means asking enterprise data stories, working with platforms, running workflows, testing and accessing outputs, and changing the data. By 2026, enterprises will shift from publishing generative AI experiments and exploration to launching agentic workflows-connecting foundation models to enterprise data, programs, and operations.

What Is Agentic AI?

Agentic AI is the type of AI that is trying to obtain a goal and perform a multi-step task on its own. Rather than requiring someone to make every decision for it, an agent can decompose a goal, develop a plan to attack it, determine what tools are going to be needed, do the work, and evaluate the results. A traditional AI assistant, for instance, might answer a question about whether a customer’s order is ready. An agentic AI would be able to retrieve the order details, identify that the order is held up, tap into the source system, compose an updated message to the customer, and create a case for escalation to a human customer support representative when necessary.

How Does Agentic AI Work?

So, in essence, it’s just a perception, reasoning, planning, and acting loop: A goal or task is communicated or perceived by the agent; the agent gathers data from the environment (databases, files, APIs, enterprise applications, API or other connected systems); the agent reasons with its AI model and takes actions. The agent further decomposes the goal into intermediate, achievable steps (if needed) through a set of tools that it gathers. If the step wasn’t completed successfully or if the conditions change, the agent updates the plan and repeats. Put simply, the working process of an agentic automation is something like goals, perception, reasoning, planning, tool use, action, evaluation, next action. This continuous agentic loop is what sets agentic AI apart from automation that relies on us anticipating all potential options and expressing every possible path in advance.

Agentic AI Architecture and Its Components

The architecture of a production-grade agentic AI system contains multiple layers. The first layer, that of the agents themselves, can include an AI model, such as a large language model or other foundation model that can comprehend instructions, assess context, apply reasoning, and figure out what actions can be taken. Businesses can choose various models, based on a task’s complexity, latency, cost, privacy needs, or safety. But the model is just the start of a good agentic system.

An orchestrator controls how the agent will go about completing a task. An orchestrator can decide the order of operations, control context, route information, coordinate tool calls, and manage multiple specialised agents working together. This is especially critical when an enterprise task involves multiple steps and multiple agents or multiple AI agents working together. An orchestrator offers the structure around model logic and allows organisations to manage agent-to-business system interactions.

Tools and APIs supply the AGI agent with the ability to act. A tool might be a database, enterprise search engine, API, CRM, and ERP systems, software development environment, code execution platform, communication channel, or almost any enterprise system. Without the ability to access the tools, the basic AI model is capable of modifying or creating data. With the ability to do so within a closed environment, the agent can access data and perform the appropriate activities.

Knowledge and grounding are another aspect of architecture to consider. It’s not wise to depend solely on the information within a foundation model; that’s when your enterprise agents need factually accurate and pertinent knowledge. Retrieval augmented generation, enterprise knowledge bases, semantic search, structured data, and application data can all supply this context, grounding an agent in enterprise information and decreasing the potential for generating contradictory outputs.

Memory and context enable an agent to remember information during a task or conversation, depending on your implementation. Short-term memory can give the agent a sense of how a current conversation or task is proceeding, and long term memory might contain information that will be useful for some future task. However, be cautious when considering memories in the enterprise; agents will have access to private data regarding customers, financial data, operations, and employees.

Security and governance are another critical architecture level. An autonomous system that has business systems and skills to act must be granted the right. An agent’s authority and role-based access control, the principle of least privilege, the ability to be audited, observability, and monitoring, policies, human-in-the-loop, and safety guardrails reduce the likelihood of an agent taking an unauthorised action. As enterprise AI becomes ever more autonomous, it is becoming an architectural requirement.

What Are Agentic Workflows?

Agentic workflows are flexible sequences in which agents think, plan, carry out multiple steps, assess results, and adapt appropriately. For example, at an IT-support desk, an agent could not only give instructions on how to fix an employee’s malfunctioning app but could also diagnose the issue, survey the computer’s activity logs, review recent changes to its settings, identify likely causes, offer a fix, and- with permission- carry out the fix. The agent could check whether the app’s restored to normal.

In a higher-level workflow, there may be a team of agents; one particular expert agent may go through the technical solution, another cybersecurity agent may look into potential security issues, and another could look at the solution details prior to the ultimate actions being approved. This is the multi-agent system and allows an organisation to distribute many complex workflow jobs over a number of specialist AI agents while maintaining overall control.

Enterprise Use Cases of Agentic AI

The scope of enterprise agentic AI use cases is growing fast. In customer service, for instance, agentic AI can help employees by classifying support requests, loading customer information, troubleshooting frequent issues, generating responses, recording updates, and escalating sophisticated cases to human agents. This doesn’t mean, however, that they will replace human support teams. Instead, they can automate mundane workflows and free employees to focus on more nuanced, human interactions.

An additional significant domain is software development. In agentic coding systems, AI could possibly investigate and alter web pages, generate or suggest code, run and review code, test and examine bugs, and suggest or make fixes. This is a shift from AI as a coding assistant that shows code snippets to AI programs that can perform many stages of the software development process.

Agentic Automation in security: Security is a good fit for agentic work because you wouldn’t want a security team to look at lots of alerts and aggregation points. The agents can track activity, investigate anomalies, link information, recognize attacks, specify a response, and in certain cases take predefined remediation actions. But for high-consequence actions, they need to have limited authority, be approved, audited, and reviewed by humans.

Enterprise AI agents can also perform document analysis, fraud investigations, compliance processing, customer service, research, and any other enterprise activity involving a large set of business data. For example, supply-chain agents can work out whether a supply disruption is imminent using knowledge of suppliers’ status, inventory position, demand, and logistics, and then suggest remedial measures for procurement, inventory, and logistics, and so on.

Healthcare is yet another option, mainly for administrative work such as data entry, making appointments, finding the right data, and road-mapping the workflow. AI’s use for clinical purposes has to go through a stronger validation process, as the wrong decision on the part of the AI could directly endanger patients’ lives.

Why Enterprise Agentic AI Needs Strong Governance

There are also risks associated with using an autonomous agentic AI. Entering an instruction wrong, not using the correct tool, escaping, leaking, or bending a malicious prompt are all ways to the dark side. Failure can cascade across agents in multi-agent systems and to the wider systems. Companies should regard AI agents as operational software rather than a new chat service.

Good governance might include implementing identity and access management, least-privilege permissions, requiring approvals for high-risk actions, tracking and logging actions with audit trails, providing data-protection controls, immediate defence against injection attacks, model assessment, and validation of tools and controls on resources. Also, enterprises will need accountability and ownership of what AI agents are doing. So, the new model will not be one of total freedom but controlled freedom.

The Future of Agentic AI

The advent of agentic AI will probably see the development of more specialised agents within shared enterprise IT systems. Rather than a generalist to do all types of jobs, firms will deploy specialist agentic models in software engineering, customer service, cybersecurity, finance, supply chain and more. They will operate alongside each other on shared levels of orchestration, identity, observability and governance.

This shift is also transforming how organisations conceptualize their enterprise software landscape. More and more, AI agents are being considered an operational layer that communicates with the applications already in place- rather than an expansion that necessitates replacements for every single back-end application. As agentic workflows develop further, tools such as agent registries, observability tools, policy engines, security measures, and standards for interoperability may come into play.

So, the big change, therefore, is not so much between chatbots and autonomous AI. It also falls somewhere in the middle of AI as a set of features in the software process beneath. Enterprises that can master the art of good model construction, having access to high-quality data, appropriate tooling, targeted orchestration, and appropriate governance, will be the ones to benefit from agentic AI.

Conclusion

Agentic AI is the future of enterprise AI. By integrating data, orchestration, and governance with reasoning models, enterprise AI agents become everlasting multi-step workers and not static question-answering tools. Use cases for agentic AI are emerging in customer service. Software engineering, security, finance, healthcare, and supply chain.

And that smart model isn’t enough to make it enterprise-ready. Security, permission, observability, reliability, interoperability, and human oversight will all play a role as organisations consider whether to gate agents’ transition from pilots to production. As companies start to reorganise their workflows around autonomous and semi-autonomous systems, technology leaders should have a firm grasp of agentic AI architecture, its underlying components, how it operates, and its enterprise use cases.

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Nuvoton Technology will begin providing samples of the KA85010UA, a 26-cell battery monitoring IC equipped with integrated electrochemical impedance spectroscopy (EIS) functionality, in January 2027. The IC uses Nuvoton’s proprietary inductor-based EIS method instead of the conventional resistor method. By using an inductor to store and circulate energy as AC measurement current, the technology significantly reduces energy loss and heat generation during EIS measurements. According to Nuvoton’s evaluation, the method reduces both power loss and PCB temperature rise by approximately 93% compared with the conventional resistor method. This low-power and low-heat operation facilitates the integration of EIS into automotive batteries and energy storage systems. The EIS functionality can support battery degradation diagnosis, state-of-health (SOH) estimation, lifetime prediction, and early detection of cell abnormalities. Nuvoton also provides EIS analysis algorithms and end-to-end implementation support to help customers integrate battery diagnostic functions into their applications.

As vehicle electrification and the adoption of energy storage systems (ESS) continue to expand, batteries have become essential components supporting modern infrastructure, making battery safety more important than ever. In particular, as battery systems increase in capacity and output, there is growing demand for technologies that detect early signs of internal cell short circuits, abnormal heating, and other issues to prevent serious failures and accidents.

Conventional battery systems estimate battery condition by measuring voltage, current, and temperature, but it is difficult to directly capture changes occurring inside the battery. EIS measurements, by contrast, can quantitatively capture changes in internal battery conditions as impedance characteristics and are therefore expected to be used for estimating state of health (SOH) and internal temperature, as well as for early detection of signs of cell abnormalities. Until now, however, EIS assessments have mainly been conducted in laboratory environments using dedicated measurement equipment. Implementing EIS in applications has presented various challenges, including managing heat and noise, controlling measurement timing according to operating conditions, and developing EIS analysis algorithms for the acquired data.

To address these challenges, the Company has developed the KA85010UA, a Gen 6 battery monitoring IC equipped with EIS functionality. The inductor method suppresses heat generation and enables EIS measurements across a wide range of operating states, including operation, charging, and rest. In addition, by providing EIS analysis algorithms that leverage expertise gained through joint verification with automakers and research institutions, we help customers accelerate the realization of battery diagnostic solutions.

Features of New Product:

1. EIS is integrated into the BM-IC, enabling quantification of internal battery conditions Enables degradation diagnosis, lifetime prediction, and early detection of signs of cell abnormalities, contributing to improved safety in vehicles and energy storage systems.

In addition to battery monitoring functions, this product integrates EIS-based impedance measurement into a single chip. EIS is a technique that superimposes an AC current on a battery and calculates impedance from the resulting voltage and current responses. This makes it possible to perform EIS measurements within the system, without the dedicated measurement equipment previously required, enabling continuous monitoring and diagnosis of internal battery conditions.

The impedance characteristics obtained through EIS contain different information about the battery interior depending on the frequency range. The high-frequency range reveals changes in terminals, wiring, and electrolyte; the mid-frequency range reveals changes in the negative electrode; and the low-frequency range reveals changes in the positive electrode and internal reactions. By quantitatively assessing internal battery conditions that are difficult to determine from conventional voltage, current, and temperature measurements alone, EIS can estimate SOH and internal temperature, predict battery lifetime, and provide early detection of signs of cell abnormalities, contributing to improved battery safety in vehicles and energy storage systems.

2. Proprietary inductor method enables low-power-consumption impedance measurement Reduces PCB temperature rise during EIS measurements by approximately 93% compared with conventional methods, facilitating implementation of EIS functionality in automotive and energy storage systems.

EIS measurements require a circuit that applies an AC current to the battery. With conventional resistor methods, several amperes of current flow through a resistor, causing much of the energy to be dissipated as heat. As a result, excessive heat generation and increased power consumption have been key challenges.

This product uses the Company’s proprietary inductor method instead of the conventional resistor method. Two switches (FETs) control the current direction, and energy stored in a coil (inductor) is circulated as AC current to generate the measurement current, significantly reducing energy loss. In the Company’s evaluation, it was confirmed that both power loss and PCB temperature rise could be reduced by approximately 93% compared with the conventional resistor method.

These low-power and low-heat characteristics facilitate implementation of EIS functionality in automotive batteries and energy storage systems. They also enable stable acquisition of EIS measurement data across a wide range of operating states, including operation, charging, and rest, contributing to advanced battery condition monitoring and diagnostics.

3. Provides EIS analysis algorithms and end-to-end support, from setting up the EIS measurement environment to product implementation Shortens the development cycle by supporting rapid implementation of battery diagnostic solutions.

Battery diagnostics using EIS require more than simply acquiring impedance data. To make use of the data, analysis techniques are needed to estimate SOH and internal temperature and to detect cell abnormalities. Commercial implementation also requires an environment for accurate impedance measurements, EIS analysis algorithms tailored to the battery type and application, and software for system implementation.

Drawing on EIS data-analysis expertise gained through verification with automakers and research institutions, the Company provides end-to-end support, from setting up the EIS measurement environment and acquiring and organizing battery data to implementing estimation and abnormality-detection functions and integrating them into applications.

This support allows even customers who are just beginning to use EIS functionality to build battery diagnostic systems more easily, start up their systems sooner, and shorten development cycles.

Applications:

Automotive (EVs), large-scale energy storage systems (ESS), reused-battery diagnostic systems, etc.

Product name:

EIS-equipped Gen 6 battery monitoring IC “KA85010UA”.

Specifications:

Item	Description
Product number	KA85010UA
Maximum number of connected cells	26 cells
Main functions	Cell voltage, current, and temperature measurement; EIS measurement
EIS method	Inductor excitation method; V/I complex calculation using quadrature detection
Voltage measurement accuracy	±2.0 mV (EOL)
Functional safety and quality	ISO 26262 compliant (ASIL-D); AEC-Q100 compliant

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Murata Manufacturing, a Japanese global leader in electronic components and communication modules has begun mass production of the LLD series, the world’s smallest line of three-terminal, low equivalent series inductance (ESL) multilayer ceramic capacitors (MLCC). Measuring just 0201-inch size (0.6 × 0.3 mm), the new products reduce mounting area by approximately 64% compared with Murata’s previous smallest 0402-inch size (1.0 × 0.5 mm), freeing up valuable PCB space in compact devices such as smartphones and wearables.

Today, as the use of powerful ICs is embedded into smartphones and wearables, providing a stable power source is difficult. During high speed operation, the current fluctuates very fast, resulting in fluctuations in voltage to the IC. Reducing this instability to the lowest possible level is critical. Three-terminal capacitors with their four current paths are shorter than two-terminal devices and exhibit a lower ESL than traditional two-terminal components.

At the same time, thinner and smaller electronic devices require efficient use of limited PCB space. However, miniaturizing three-terminal capacitors has been difficult because their internal and external electrode structures are more complex than those of conventional two-terminal types.

Murata overcame this challenge by optimizing the electrode design and advancing its manufacturing processes. The resulting 0201-inch products enable high-density mounting while stabilizing the power supply voltage near ICs, even at high frequencies. This gives designers greater flexibility in component placement and circuit design around ICs, supporting higher performance in space-constrained electronic devices.

Two models are available. LLD033R60G105ME01 has a capacitance of 1 µF, a rated voltage of 4 Vdc, and an operating temperature range of -55 to +85°C. LLD033D80E105ME01 has a capacitance of 1 µF, a rated voltage of 2.5 Vdc, and an operating temperature range of -55 to +105°C.

Murata will continue developing compact, high-performance MLCCs for mobile and wearable devices, contributing to further miniaturization and enhanced performance of electronic equipment.

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​According to General Motors’ official newsroom, General Motors (GM) and LG Energy Solution are collaborating to produce lithium manganese-rich (LMR) battery technology that could reduce the cost of electric vehicles while delivering high energy density. This joint venture is upgrading its Ultium Cells plant in Spring Hill, Tennessee, to produce LMR battery cells for future EV applications.

The manufacturing plant is expected to be completed by 2028 to produce LMR cells that could deliver 33% higher energy density than Lithium Iron Phosphate (LFP) battery cells at a comparable cost. The major components of LMR battery technology contain 35% nickel, 65% manganese, and virtually no cobalt, targeting future GM electric full-size trucks and SUVs. LFP batteries are widely used in electric vehicles because of their low cost and thermal stability, but they require large and heavy battery packs to cover a longer range.

LMR addresses this challenge with higher energy density, allowing manufacturers to build smaller and lighter battery packs while delivering the same amount of power. The chances of adopting this concept are high, as major manufacturers look for alternatives that can balance cost, energy density and performance. The move also highlights the growing focus on developing new technologies at scale using existing manufacturing facilities.

If this concept is successfully commercialized, the rate of adopting this technology for future electric vehicles will depend on several factors such as cycle life, charging performance, thermal management, manufacturing cost, and the amount of production.

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​Chinese automobile manufacturer Geely launched Geely Smart Charging, an ultra-fast AI-powered charging system on September 23 in Ningbo, China, featuring real-world demonstrations. The new technology introduced by Geely significantly reduces charging time, charging an electric vehicle from 10% to 70% in 4.5 minutes and to 97% in 8 minutes and 40 seconds.

The core components used in building this efficient charging technology include Xingrui PowerMind AI to adjust power dynamically, Fifth-Gen Charging Station (C12) that delivers power up to 2,250 kW (2.25 MW) per connector, Next-Gen Ultra Short Blade Battery that reduces charging heat by 10% and supports ultra-fast charging speed, and Lithium-Ion Pulse Restoration Tech, which uses micro-pulse currents and a 5-point liquid-cooling system to increase battery cycle life by 20%.

The technology combines 2.25 MW of charging power with a high-rate battery designed to store a large amount of electrical power in a very short time interval. The company says this technology is introduced to address a major problem in EV adoption: charging vehicles for long hours compared with traditional refueling.

The company is also incorporating artificial intelligence in this charging solution to monitor battery conditions and dynamically manage parameters such as temperature and charging performance during a charging state. Using artificial intelligence in high power charging solution is aimed at making fast charging more practical while maintaining battery safety.​

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India’s Ministry of Defence announced on September 23 that it has entered into a contract with the government-owned enterprise, Bharat Dynamics Limited (BDL), to procure 160 Satellite Smart Anti-Airfield Weapons for the Indian Air Force, worth roughly 811 crores. The contract is a step towards augmenting the Air Force’s precision-strike capabilities and promoting a robust domestic defence production ecosystem. BDL is a state-owned defence company that manufactures guided weapons and other equipment.

BDL Contract Supports Indigenous Air-Launched Weapon Procurement

A satellite-guided weapon uses its positioning information to estimate the location and guide the weapon to programmed points. There are two possibilities depending on the weapon type: some cartridges use inertial navigation combined with satellite information, which means the weapons estimate a displacement between two waypoints based on an internal inertial navigation device. The fusion of the two-navigation mode allows better guidance continuity in a degraded environment. An anti-airfield weapon is designed for an airfield-related target.

Such cartridges need to be suited to the aircraft as well as specific mission planning and release procedures. They must meet preconditions such as accuracy, navigation capabilities, robustness, and compatibility with the launch platform. The statement also mentions that Indian defence manufacturers will be providing the supply of equipment to the armed forces. India has to develop industry and supply chains, along with maintenance skills, with respect to indigenous manufacturing. The timings of manufacturing, milestones, and operationalisation are subject to contractual obligations and the procurement process.

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​The Indian Coast Guard recently announced the interception of a transnational syndicate linked to a seaborne narcotic haul worth about 3,000 crores, in a Ministry of Defence press release dated September 30, 2026. This seaborne drug haul exemplifies a maritime security agency’s effort to combat illicit trafficking in coastal and wider maritime domains. Maritime traffic’s vast ranges of maritime traffic and the immense extent of the maritime domain’s 24×7 tracking and surveillance challenge maritime security agency interdiction efforts.

Coast Guard Operation Highlights Maritime Surveillance and Interdiction

Maritime interdiction often relies on a series of interrelated capabilities. Information gathered from sensitive surveillance networks, shipborne radar and electro-optical sensors, protected communications and data sharing systems enables authorities to develop a picture of activity at sea. This targeted activity can then draw on the deployment of patrol vessels or other assets authorised to stop and search vessels if required.

This operation will be successful if it is possible to share information, encourage watch locations, maintain security over sensitive areas, and make best use of resources. Using fusion techniques, operators can combine information, but a detection still has to be identified and verified before a vessel can be stopped and identified. The seizure of large quantities of drugs can help break up trafficking networks and reduce the impact of the network’s actions, but this is only part of understanding its size and shape.

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The Indo-ASEAN joint Exercise, AIME-26, has started in Subic Bay, Philippines, as per the Ministry of Defence (MoD). The statement was uploaded on 30 September 2026 by the official website of the Press Information Bureau (PIB), and the exercises represent one of the most significant elements of India’s interaction with ASEAN in the maritime sphere, as they constitute a forum for maritime cooperation. Such exercises facilitate participating navies to operate in close coordination, practice SOPs and conduct liaison at sea.

AIME-2026 Strengthens Regional Maritime Engagement

Maritime operations might include the planned manoeuvres, the communication exercise, the search-and-rescue drill, and other professional exchanges arranged as part of the exercise schedule. These activities allow participating forces to familiarise themselves with each other’s procedures and build the capacity to work together in actual maritime-security operations. Location matters. Numerous commercial shipping lanes exist throughout the Indo-Pacific, with ships from all nations moving along these commercial routes.

Naval ships are also expected to be prepared to respond to maritime security threats, including piracy, smuggling, accidents at sea, and other navigation hazards. Maritime coordination can be achieved without ships. Secure communications, navigation aids, radar, identification methods, operational information sharing, and similar programs all contribute to the awareness picture at sea; while exercises can help service personnel practice using them with partner forces, it should not be assumed that all countries’ equipment and operating procedures align.

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India and France are stepping up their partnership in space technology into the realm of satellite production and defence related monitoring, the Financial Express has reported, quoting a $5 million deal between India’s Dhruva Space and France’s Safran Space on the construction of 275 satellites. The report suggests that while India’s space-based surveillance capacity is growing, this particular partnership falls under the Space-Based Surveillance Phase III programme, which is a larger and more ambitious mission to improve monitoring of India’s land and water territories via an expanded satellite fleet.

Dhruva Space–Safran Partnership Highlights Satellite Manufacturing

Distributed satellite constellations allow monitoring many sites on several continents repeatedly to detect changes to land borders, coastlines, and seascape approaches. The spacecraft can be equipped with an optical payload, a radar, or other sensors. Especially with radar imaging, observation can be more independent of clouds or limited sunlight, and distributed constellations can lower reliance on a small number of large spacecrafts.

However, the operational utility of constellations depends on the constellation and orbital designs, including, for example, the ground infrastructure, the revisit time, the sensor capabilities, and the downlink capabilities. The large share of the private sector in the reported agreement indicates an increased importance of private players in India’s space activities, their manufacturing capabilities, specialised components, and also the potential for cross-border collaboration.

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The Indian Army is taking further strides in drone security by working through a network of six specialised laboratories to identify flaws in unmanned aerial systems (UAS). As per a report published by Financial Express on October 1, 2026, this network, named AASHVAST (Assessment and Analysis of Electronic Systems Hardware for Vulnerabilities and Security Threats), is expected to test software bugs, firmware flaws, and electronics that might be compromised by a drone, which could, in turn, threaten the platform. One of these facilities has already been commissioned in Delhi.

AASHVAST Labs to Examine Drone Hardware, Firmware and Software

Indian military drones’ on-board systems include flight controllers, navigation receivers, sensors, communications modules, and embedded computing systems that can all be points of attack if the systems are compromised. Hardware and Firmware Testing can identify rogue components, verify supply-chain traceability and confirm whether the electronics work as they should. These are critical considerations for surveillance, reconnaissance and other security drones that require reliable transmission and precise navigation. In addition to the trial at the laboratory, another programme by Zuppa Geo Navigation Technologies and the Tamil Nadu Unmanned Aerial Vehicles Corporation plans to train over 2,000 people over three years, providing skills in drone operation and maintenance.

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Panasonic Industry has returned to Electronica India this year with its broadest showcase yet for the Indian market comprising of new-to-India technologies focusing on performance, safety and reliability. Anwesh Koley of ELE Times, caught up with Narayan Kumar, Chief Business Office, Panasonic Industry & Energy India, to understand the company’s automotive trajectory and future trends.

ELE Times: Brief us about what all Panasonic is displaying this year and how important Electronica is for your company?

Narayan Kumar: We all know Electronica is a leading platform for the entire electronic ecosystem, and so we have been continuously participating in the Electronica event. Largely, from our point of view, we are looking at how we increase our participation in the total electronic ecosystem. If you look at the last few years, the movement has shifted from pure assembly to many organisations now doing local design and development.

That is a very big change because we can engage directly with the R&D and engineering teams of many of our customers across almost all segments to look at the future products they want to make, and determine how we can participate through our device solutions.

More importantly, it’s not only for the Indian market alone. We can now see many companies doing design and development for global markets. That’s a big shift. Being here in the city of Bangalore, we can see many Global Capability Centres (GCCs) coming up in India. It’s a very exciting time—the overall market is growing rapidly, and so are we with high double-digit growth, a momentum we would like to continue.

ELE Times: In terms of the current market—the Indian market vis-à-vis other Asian markets—how does Panasonic perceive the Indian market? What are the growth opportunities you have identified, and what is the way forward?

Narayan Kumar: The Indian market has become super important, not only from a Panasonic point of view, but also from the perspective of the total electronic ecosystem.

If you look at one big example of growth in Electronic Manufacturing Services (EMS), a few years back we primarily saw global EMS companies. Now, we see the rapid rise of Indian EMS companies growing at high double-digit rates. Again, this is not just for local Indian consumption; they are actively engaging in global exports. From a policy standpoint, the government is actively looking at signing Free Trade Agreements (FTAs), which will further boost the “Make in India” program.

A lot of organisations we are in touch with would like to diversify their production to India. That is where Panasonic Industry India would like to participate with those customers—not only from a supply standpoint, but also from a development perspective.

ELE Times: The government currently has been quite optimistic about the electronic and semiconductor sectors, backed by significant incoming investments. What is your take on these government and policy initiatives backing the sector?

Narayan Kumar: We need to look at current progress through the lens of where we were before. We started off largely on the assembly of mobile phones, but now almost all sectors in the economy involving electronic hardware are growing.

India remains very strong on the automotive side, with a high contribution to manufacturing GDP coming from automotive. Besides traditional automotive, we see rapid electrification happening across two-wheeler and four-wheeler EV markets.

Looking at non-automotive industrial markets, smart infrastructure and smart metering are expanding as part of government programs, driving action to produce meters locally and increase local content. In renewables and solar power, we are looking at the localisation of inverters. Every single component of the manufacturing value chain for electronics has initiated action, which is great news for companies like us to participate and offer our device solutions.

ELE Times: You mentioned the growth of electric vehicles in the automotive sector. How do you see EV technology developing in India, and what are your key takeaways from the current government push for EVs?

Narayan Kumar: India’s automotive sector is a massive market. Almost all global players are physically present here—not only with manufacturing powerhouses, but also with design and development centres.

Given the sheer volume of the Indian market, we won’t look at just one part of the powertrain; multiple powertrain options will emerge in parallel. In the two-wheeler segment, we are the largest globally. The EV market is definitely growing, and three-wheeler EV penetration is already very high because customers see a quick return on investment (ROI), a trend likely following into two-wheelers as well. As the economy progresses, multiple technology options will grow side-by-side.

ELE Times: How do you see the current state of localisation in India regarding technology and ancillary equipment sectors, and what is your perspective on the “Make in India” initiative today?

Narayan Kumar: That is a very pertinent question regarding the flagship government program, and I would break it down into three parts:

• Local Design Support: While localisation usually refers to local manufacturing, the piece that comes before it is local design. Global Capability Centres in India are expanding their workforce to design for global platforms. The world recognises that Indian designs are becoming global platforms, which is a major starting point where we actively participate.
• EMS & Manufacturing Content: Electronic Manufacturing Services are continuously increasing their localisation content and expanding local production capabilities.
• Component-Level Localisation: The third part involves going deeper into the supply chain to evaluate localised manufacturing for a wide variety of electronic components based on volume feasibility and product combinations.

ELE Times: At Panasonic, how do you balance quality and cost—a key factor the Indian market is known for—without compromising on reliability or impacting margins?

Narayan Kumar: The best way to look at this is not to separate quality and cost. They are deeply integrated because the consumer ultimately makes the buying decision. Across product roadmaps in all sectors, there is a constant focus on building long-lasting, reliable solutions. Many modern programs demand strong, long-term warranties. For instance, smart meter manufacturers are required to provide a 10-year warranty on maintenance and supply. Naturally, this demands selecting high-performance components built to last a decade.

Simultaneously, high manufacturing volumes help make pricing competitive. India is at a point where high volumes justify competitive pricing. Ultimately, reliability is the factor that beats everything—urbanisation means consumers want premium, durable products rather than spending time replacing items.

ELE Times: How does Panasonic foresee the future of technology in India, and how is the company poised to address upcoming opportunities and challenges?

Narayan Kumar: I would answer this from the perspective of how our headquarters and global customers view India:

• High-Value Consumption: India has always been a massive consumption market, but that consumption is shifting toward high-urban, premium categories. Launching high-quality products creates growing opportunities for our industrial devices.
• Export Expansion: Local EMS companies are expanding exports. As local manufacturing scales, imports will decline and exports will grow.
• Engineering & Design Leadership: We are very excited about the growth of local design and development that serves both India and global markets.

India possesses a unique combination that few other markets can claim: strong domestic consumption, deep engineering talent, rapid technology adoption, and active government incentives, such as electronics manufacturing clusters and talent upskilling. This combination makes the entire ecosystem more robust, durable, and long-lasting.

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​With the continuously rising demand for electric vehicles, real-world energy efficiency is becoming an important performance metric alongside driving range and charging speed. Related to this, a recent test conducted on 22 participating vehicles from 15 different brands in Canada demonstrated the energy efficiency of modern electric vehicles. Each tested electric vehicle covered a 230 km route from Blue Mountain to Vaughan, Ontario in a single charge. The study found that modern electric vehicles consume 40% less energy on an average compared to vehicles tested in CAA’s February 2025 EV Winter Test.

During the recent test conducted in September 2026, variations in energy consumption among the tested vehicles ranged between 11.43 kWh/100 km and 28.91 kWh/ 100 km. This figure demonstrates how a vehicle’s size, weight and aerodynamics determine the electricity needed to cover a specific distance. A low-energy consumption vehicle uses less energy from the battery to cover the same distance, thus reducing charging requirements and charging cost, especially on longer trips.​

The key findings of the conducted test include range and battery usage, energy efficiency and charging performance among the vehicles. The Toyota bZ recorded the lowest energy consumption usage at 11.43 kWh/100 km, whereas the Lucid Gravity recorded the highest energy consumption at 28.91 kWh/100 km. CAA test also highlights that the two tests, conducted in different years involved different vehicles and operating conditions. Therefore, the resulting figures should not be treated as a direct vehicle-to-vehicle comparison.

The test demonstrates that EV evolution is more about increasing range. To be more practical while designing electric vehicle, designers and engineers must cater different factors such as energy consumption, charging performance, battery temperature, and vehicle design for improving the overall performance.

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Infineon Technologies on 1st of October, 2026 officially inaugurated its new backend manufacturing site in Bangkok, Samut Prakan in collaboration with Prime Minister of Thailand, Anutin Charnvirakul and Chief Operations Officer of Infineon Technologies, Alexander Gorski. The purpose of building new site is to strengthens and expanding the company’s global manufacturing footprint while adding capacity for future growth. The new site is located in the heart of Southeast Asia reinforcing Infineon’s ability to server customers worldwide at a time when long-term semiconductor demand continues to grow because of digitalisation, electrification and the energy transition.

Built for future growth, the facility can scale up to five modules, giving Bangkok the potential to become one of Infineon’s largest backend manufacturing sites over time. As a strategic addition to Infineon’s globally diversified manufacturing network, the site complements the ongoing expansion of Infineon’s frontend manufacturing capacities.

“What makes Bangkok such an important addition to our global manufacturing footprint is its unique combination of location and growth potential,” says Alexander Gorski, Chief Operations Officer of Infineon Technologies. “We are establishing a new hub in the heart of Southeast Asia, surrounded by a fast-growing ecosystem and with excellent access to global logistics. This helps us further diversify our manufacturing network across regions and serve our customers with resilient capacity and great flexibility. We have built the Bangkok site with the future in mind. Starting with Module A, the site can grow to up to five modules over time, giving us unique scalability to support future growth.”

“Infineon’s new backend manufacturing site in Bangkok, Samut Prakan, is a strong vote of confidence in Thailand’s future as a leading semiconductor location,” says Anutin Charnvirakul, Prime Minister of Thailand. “Together, we are advancing Thailand’s semiconductor ecosystem, strengthening our role in the global value chain and creating new opportunities and highly skilled jobs for future generations. We welcome Infineon’s long-term engagement and look forward to deepening our cooperation.”

A long-term investment in Thailand’s semiconductor ecosystem

Thailand’s commitment to building a strong semiconductor ecosystem, guided by its national technology strategy, is creating new momentum for advanced manufacturing and technology-driven growth in the region. Thailand offers excellent connections throughout Southeast Asia, proximity to key customer markets and a long-standing semiconductor manufacturing heritage. The Bangkok site builds on local expertise, established partnerships and a highly skilled workforce while contributing to the further development of Thailand’s flourishing semiconductor ecosystem.

The site currently employs around 350 people and is expected to grow to approximately 1,000 employees as the first building (Module A) ramps up. Beyond manufacturing, Infineon supports talent development through collaborations with universities, educational institutions and industry partners.

Expanding capabilities for complex, high-value semiconductor solutions

The Bangkok site combines advanced automation, scalable design and a digital manufacturing backbone to support efficient, stable and high-quality production at scale. Built as a greenfield site, the facility leverages proven expertise from Infineon’s established backend manufacturing locations while providing the flexibility to adapt to evolving customer requirements, new technologies and large production volumes.

Equipped with advanced cleanroom, assembly and test capabilities, all supported by a high level of automation, the Bangkok site covers the full spectrum of semiconductor backend processes as well as wafer test. This unique combination strengthens its role within Infineon’s manufacturing network and enables increasingly complex, high-value semiconductor solutions for applications across the automotive, industrial and energy infrastructure, contributing directly to technologies that drive electrification, energy efficiency and digitalization worldwide.

Sustainability built in from the ground up

The Bangkok site runs on 100 percent green electricity, incorporates water recycling and rainwater collection systems and is equipped with solar modules that generate renewable energy on site. Together, these measures support resource-efficient manufacturing and contribute to Infineon’s strategic priority of continuously reducing its carbon footprint across the entire value chain.

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​Moving to advance technology in electric vehicle, Delta Electronics and NVIDIA Hyperion have partnered to accelerate the development of next-generation autonomous-driving systems. The collaboration was announced on September 29, 2026, via a press release in Fremont, California, USA by Delta Electronics. The partnership aims to deliver more advanced, safer, and efficient next-generation Level 4 autonomous vehicles and robotaxis.

The company did not announce any commercial products to be launched. However, the collaboration focuses on introducing integrated automotive solutions by embedding Delta’s core hardware technologies directly into the NVIDIA Hyperion architecture.

Delta Electronics will contribute electronics hardware and integration expertise covering automotive energy management, xEV powertrain systems, power electronics, system integration, and in-vehicle high-performance computing (HPC). These technologies are crucial for autonomous vehicles because advanced systems depend not only on AI-based perception and decision-making but also on a reliable power supply, vehicle computing, and the integration of multiple electronic components.

To provide reference sensor and computing platform, NVIDIA Hyperion is d​eveloped and introduced as a modular architecture and end-to-end platform that integrate computer hardware, multimodal sensor and safety software into a single unit for autonomous vehicles.

The specific roles of this platform include integrating dual NVIDIA DRIVE AGX Thor centralised computers for handling level 4 autonomous driving tasks, a standardised sensor architecture for achieving full 360-degree environmental perception, and the NVIDIA Halos safety system, which offers safety mechanisms that satisfy automotive safety standards, including ISO 26262 ASIL-D requirements.

The collaboration highlights the efforts toward​s advancing AI-driven autonomous-driving solutions and expanding opportunities in smart mobility. It demonstrates the further steps towards merging AI, high-performance in-vehicle computing, automotive power electronics, sensor system, and functional safety in the development of level 4 autonomous vehicle.

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​To deepen domestic manufacturing, scale-up its own supply chain, less dependent on import, and increasing the number of homegrown smartphones, India announced Rs 62,500 crore Mobile Phone Manufacturing Scheme (MPMS). The scheme’s time period covers five years, from FY 2026-27 to FY 2030-31 and it was approved by the Union Cabinet. The scheme is designed to strengthen mobile-phone manufacturing beyond large-scale assembly while supporting the Indian brand and technology development.

The new scheme enters the development phase just after the completion of the Production Linked Incentive (PLI) Scheme whose tenure ended in March 2026. Under this scheme, the manufacturers will receive incentives depending on their eligible selling products with rates ranging from 2.5% to 5%. Companies can also receive an additional incentive of up to 1.5% for domestic sourcing of key components and sub-assemblies. For Indian brand, the scheme provides 5% incentive, along with additional 3% incentive linked to product design and R&D. These steps were taken to encourage deeper localisation of the mobile-phone supply chain.​

Through this scheme, the government targets a production value of Rs 39 lakh crore in mobile phones over the five-year tenure and aims to create around 60,000 direct opportunities. The scheme also aims to promote Indian brands and intellectual property by offering target-based incentives for domestic research, design, and component ownership.

The existing Indian market already consumes 99.2% of the mobile phones manufactured or assembled in the country and India is the world’s second-largest mobile-phone manufacturer in the​ global market. Exporting mobile phones is also increasing in India, thus supporting its integration into global value chains.

The new scheme is aimed at strengthening domestic manufacturing and deepening India’s electronics manufacturing capabilities through component sourcing, research and development (R&D), and support for Indian-owned brands. Along with the development of manufacturing, the mobile phone manufacturing scheme (MPMS) is also intended to strengthen India’s position in global value chains in electronics manufacturing.

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Keysight Technologies on 1st of October, 2026, announced the new 20 gigahertz (GHz) PSG XG7-class analog signal generator, which combines two fully independent channels in a single 2U chassis. Its low noise and calibrated output power help engineers evaluate device performance more clearly, while its compact dual-channel design increases test capacity without requiring additional rack space.

In challenging testing scenarios, such as aerospace and defence, advanced wireless and high-speed digital applications, the noise from the signal source can hide the behaviour engineers need to measure. Engineering teams also need to increase test capacity, while working within limited rack space and without costly modifications to existing test systems. The new PSG meets these needs with low phase noise, low amplitude modulation noise, low broadband noise floor, calibrated output power and two independent channels in a compact 2U chassis.

Key benefits of the new XG7-class include:

• Enhanced measurement visibility: Ultra-low noise helps engineers evaluate device performance without the signal source masking critical behavior.
• Expanded test capacity: Two fully independent channels in a compact 2U chassis enable teams to run more tests without increasing rack space.
• Improved performance in lossy test setups: Clean, calibrated output power up to +22 decibel-milliwatt (dBm) helps maintain the required signal level at the device under test, including through lossy cables and test fixtures.
• Faster technology refresh: Standard Commands for Programmable Instruments (SCPI) compatibility, familiar rear-panel connections and settings aligned with previous-generation instruments help teams reuse existing automation and test procedures.

The PSG provides phase noise of -135 dBc/Hz and amplitude modulation noise of -150 dBc/Hz, measured at 10 GHz with a 10 kHz offset, together with a broadband noise floor of -166 dBc/Hz at 10 GHz. Its hybrid architecture uses software mode switching to optimize performance across different applications, while calibrated output power up to +22 dBm helps compensate for losses in cables and test fixtures.

Jun Chie, Vice President, Keysight Core Product Management, said: “For decades, engineers have relied on Keysight’s PSG signal generators for trusted performance in the most demanding measurement environments. This new analog signal generator builds on that legacy with the purity, power, and productivity customers need to reveal true device performance and modernize test environments with confidence.”

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