ELE Times

By: Mouser Electronics

Computing on the Edge of the IIoT with TE Connectivity Product Solutions

As the Industrial Internet of Things (IIoT) continues to evolve and expand, the sheer amount of data being collected, organized, and analyzed by data centers and in the cloud continues to multiply. The total amount of data shared worldwide is expected to more than double in the next three years1. Processing that much data requires significant bandwidth and processing power and can create computing gridlock and slowdowns. “Edge computing” aims to ease some of the burden on the central processing system by performing simple operations on smart devices or network gateway nodes, thereby lowering latency and freeing up valuable bandwidth for more complex computations. Edge computing is currently being implemented in a variety of use cases and industries, including:

• Healthcare – surgical robots that require lower latency to make real-time decisions and adjustments and smart medical wearable devices like heart and blood pressure monitors
• Retail and Manufacturing – inventory and supply chain management with RFID trackers and smart sensors
• Media – real-time video analysis to improve content moderation and enhanced gaming functionality by reducing latency and content caching closer to the edge for faster access
• Transportation – autonomous vehicles with self-driving capabilities utilize computing on the edge to react to traffic and weather conditions as quickly and efficiently as possible
• Agriculture – farmers implement smart sensors on their crops to monitor hydration and nutrition levels and help predict when weather conditions may precipitate an early harvest

Moving logic and data storage to the edge creates privacy concerns, so a network of wirelessly connected devices requires powerful encryption to ensure data transmitted and received on the edge is safe and secure. Edge computing, however, can reduce the risk of data loss or theft by reducing the amount of data being transmitted to the cloud in the first place. The principal benefit of edge computing is spreading the responsibility around—in other words, more hands mean less work. Lowering latency and increasing bandwidth can lead to faster response and transmission times, critical factors in certain applications.

Conditions on the edge of the IIoT can be demanding for smart devices and intelligent gateways and nodes. Sensors and actuators can be exposed to extreme heat, variable humidity, intense and intermittent vibrations, and electromagnetic interference that can damage devices and adversely affect data transmission. Smart devices at the edge in certain industries or manufacturing settings must be rugged and reliable in harsh physical environments, like acoustic and temperature sensors designed to improve preventative maintenance on industrial robots or heavy machinery. Size and form factor can also be critical factors as physical space is at a premium in many IIoT applications, and edge devices equipped with processors might be larger than their more basic predecessors. In some implementations, engineers and facilities managers might need to weigh the relative pros and cons of larger gateways with more processing capability versus smaller devices that put more pressure on data transmission and processing in the cloud. Another factor to consider is how much computing power is required to meet an application’s needs and how to allocate the responsibility as data centers are under a greater and greater burden. As a result, they are increasing compute density, but the strain can create significant latency issues. Pushing data storage responsibilities to devices at the edge frees up bandwidth for transmission to and from the data center and enhances overall system response time.

TE Connectivity offers a variety of product solutions designed to help optimize edge computing applications. Approximately half of all internet connections worldwide are between machines without human users on either end. Making those connections as robust, secure, and reliable as possible is paramount to ensuring safe, efficient communication and operation, especially connections that must be maintained in harsh conditions. TE’s 16GT/s 0.5mm free height stacking COM (computer-on-module) connectors can provide a transfer rate of up to 16GT/s and feature a new contact design that improves signal integrity. The vertical mating configuration allows designers to adjust their designs to fit the physical space limitations they’re working with. TE’s COM connectors can be found in everything from aerospace design to medical equipment, industrial machinery, COM modules, and more.

Similarly, TE’s ICCON slim power pins and sockets enable scalability in designs while coming in a small, unobtrusive form factor for saving physical space. With a current capacity of 35A per contact, the ICCON power pins are an optimal solution for switches, servers, or data storage devices. The pins and sockets themselves can be easily installed or removed without tools and can accommodate pin-in-paste reflow processes.

For the IIoT to continue to grow and evolve, developers will have to use every weapon in their arsenal to lower latency and reduce bandwidth usage across various use cases and applications. Pushing some of the computational burden from a central processing system to devices on the edge can do that, but not without creating new potential issues. Reliability in harsh environmental conditions like extreme heat or vibration is paramount, especially with COM’s or edge devices with built-in processors. Network security is also a major concern, especially when multiple wireless protocols are being used in concert; robust encryption and network security are vital. Accounting for these factors can make edge computing the secret to unlocking the IIoT’s operational potential. As data centers get bigger and denser, processing data on the edge could be the answer to keeping networks running smoothly.

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Power Integrations, a leader in high-voltage integrated circuits for energy-efficient power conversion, has introduced the world’s highest-voltage, single-switch gallium-nitride (GaN) power supply integrated circuit (IC). This new release features a remarkable 1250-volt PowiGaN switch. These InnoSwitch3-EP 1250 V ICs represent the latest additions to Power Integrations’ InnoSwitch family, designed for off-line constant voltage/constant current (CV/CC) QR flyback switcher ICs.

The InnoSwitch line boasts synchronous rectification, FluxLink safety-isolated feedback, and a range of switch options, including 725 V silicon, 1700 V silicon carbide, and now PowiGaN variants in 750 V, 900 V, and 1250 V.

One of the standout features of Power Integrations’ proprietary 1250 V PowiGaN technology is its remarkably low switching losses, measuring less than one-third of those found in equivalent silicon devices at the same voltage. This attribute results in a staggering power conversion efficiency of up to 93%, enabling the creation of highly compact flyback power supplies capable of delivering up to 85 W without the need for a heatsink.

Radu Barsan, the Vice President of Technology at Power Integrations, highlighted the company’s commitment to pushing the boundaries of high-voltage GaN technology. He noted, “Power Integrations continues to advance the state of the art in high-voltage GaN technology development and commercial deployment, rendering even the best high-voltage silicon MOSFETs obsolete along the way. We were first to market with high-volume shipments of GaN-based power-supply ICs in 2019, and earlier this year introduced a 900-volt version of our GaN-based InnoSwitch products. Our ongoing development of higher voltage GaN technology, illustrated here by our new 1250 V devices, extends the efficiency benefits of GaN to an even wider range of applications, including many currently served by silicon-carbide technology.”

Designers incorporating the InnoSwitch3-EP 1250 V ICs into their projects can confidently specify an operating peak voltage of 1000 V, allowing for an industry-standard 80% de-rating from the 1250 V absolute maximum. This substantial headroom is particularly valuable in challenging power grid environments where robustness is essential to defend against grid instability, surges, and other power perturbations.

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With research on the technology components for the future 6G wireless communication standard in full swing, the possibilities of an AI-native air interface for 6G are also being explored. In collaboration with NVIDIA, Rohde & Schwarz takes another step forward and presents an enhancement of their recent hardware-in-the-loop demonstration of a neural receiver, showing the achievable performance gains when using trained ML models compared to traditional signal processing, while for the first time also optimizing the transmitter side.

At this year’s Brooklyn 6G Summit, taking place from October 31 to November 2 in Brooklyn, New York, visitors can experience the first demonstration of how a neural receiver paired with a learned custom modulation performs in a 5G NR uplink multiple input multiple output (UL MIMO) scenario. The setup combines premium test solutions for signal generation and analysis from Rohde & Schwarz and the NVIDIA Sionna GPU-accelerated open-source library for 5G and 6G link-level simulations. NVIDIA’s Sionna enables rapid prototyping of complex communications system architectures and provides native support to the integration of machine learning in 6G signal processing.

This demonstration builds on the successful showcase at the Mobile World Congress 2023 in Barcelona, where both companies demonstrated the concept of a neural receiver in a hardware-in-the-loop experiment involving two independent companies for the very first time. Academia, leading research institutes, and key industry experts across the globe anticipate that a future 6G standard will use AI/ML for signal processing tasks, such as channel estimation, channel equalization, and demapping. This concept is understood as a neural receiver. Today’s simulations suggest that a neural receiver will improve overall link performance and thus throughput compared to the current high-performance deterministic software algorithms used in 5G NR while keeping computational complexity at a manageable level.

Going a step further, the test bed has been extended to enable the verification of communication systems that apply AI/ML not only in the receiver, but also in the transmitter. The demonstration at Brooklyn 6G Summit showcases the application of learned custom constellations, which researchers are investigating as a stepping stone towards pilotless communication. Instead of relying on well-known, symmetric constellations such as QPSK or QAM modulations, the constellation points are determined through an end-to-end learning process, which jointly optimizes the neural receiver and the constellation mapper of the transmitter while taking the faded mobile radio channel into account.

The test bed setup leverages the R&S SMW200A vector signal generator, which emulates a single user transmitting a 100 MHz (273 PRB) wide signal in the uplink direction at a carrier frequency of 2.14 GHz in a MIMO 2×4 configuration. Fading and noise are applied to the transmission to emulate realistic radio channel conditions. The R&S MSR4 multi-purpose satellite receiver captures the RF signal instantaneously with its independent 4x 200 MHz channels. The digitalized signal is streamed in real-time and transferred to the R&S Server-Based Testing (SBT) framework including R&S VSE vector signal explorer (VSE) micro-services, which performs synchronization and fast Fourier transform (FFT) calculation. The post-FFT data serves as input for a neural receiver implemented and trained using NVIDIA Sionna. As part of the demonstration, the trained neural receiver with custom constellation is compared to the classical concept of a linear minimum mean squared error (LMMSE) receiver architecture, which applies traditional signal processing techniques based on deterministically developed software algorithms. These high-performance algorithms are widely adopted in current 4G and 5G cellular networks.

To verify the performance of such an enhanced neural receiver, including custom modulation, the capabilities of the R&S SMW200A vector signal generator were extended for this demo to allow the user to freely configure each individual constellation point by magnitude and phase in the IQ domain based on the selected QPSK or QAM modulation. The R&S FSW Signal and Spectrum Analyzer and the R&S Vector Signal Explorer (VSE) software today support custom modulation, too. This enables users to assess transmitter performance through well-known key performance indicators such as the error vector magnitude (EVM) even when learned custom constellations are used.

Rohde & Schwarz actively supports 6G research activities across Europe, Asia, and the US, while contributing to research projects, the work of industry alliances, and collaborating with leading research institutes and universities. The company’s test and measurement expertise and solutions help pave the way for the next generation of wireless communications, which is expected to be commercially deployed around 2030.

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AAEON, a prominent global player in the field of embedded computing solutions, has recently launched the GENE-ADN6, a cutting-edge 3.5″ SubCompact Board powered by Intel Atom x7000E Series, Intel Processor N Series, and Intel Core i3-N305 Processors. This remarkable addition to AAEON’s lineup caters to a wide array of industries, including machine vision, drone technology, and Automated Mobile Robots (AMR).
Engineered to excel in harsh industrial environments, the GENE-ADN6 is capable of dependable operation across an impressive temperature range from -40°F to 185°F (-40°C to 85°C) and supports power inputs ranging from 9V to 36V. Furthermore, it provides versatile expansion possibilities through M.2 2230 E-Key and M.2 3052 B-Key slots, alongside accommodating additional storage solutions via a full-size mSATA slot and a SATA HDD bay.

For machine vision applications, the GENE-ADN6 shines with its three LAN ports supporting Intel I226 Ethernet at 2.5GbE, enabling seamless integration of peripheral cameras. Additionally, the board supports up to three simultaneous displays with an internal LVDS connector, along with physical HDMI 1.4 and VGA ports.
On the connectivity front, the GENE-ADN6 boasts two USB 3.2 Gen 2 ports, while its internal connectors are ideally suited for AMR applications, including four COM pin headers (two of which support RS-232/422/485 interfaces), an 8-bit GPIO, SMBus, and an additional four USB 2.0 connectors.

The board’s high-bandwidth DDR5 system memory ensures swift data processing and optional TPM 2.0 enhances data security.
Despite its compact size, robust design, and extensive interface options, the GENE-ADN6 stands out as an ideal choice for both AMR and machine vision applications, thanks to its impressive temperature resilience (-40°C to 85°C), which is a rare find in a single-board computer of this size.

With the introduction of the GENE-ADN6, AAEON reiterates its commitment to providing versatile, market-ready solutions incorporating the latest Intel processing technology. This dedication ensures that AAEON’s customers can easily find the perfect platform for their specific project needs.

The GENE-ADN6 is now in mass production and available for purchase on the AAEON eShop in a variety of SKUs. For further pricing information and inquiries, interested parties can get in touch with AAEON through their contact form.

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Intel, a global technology giant, has revealed its ambitious vision for advancing its semiconductor technology development facilities situated at Gordon Moore Park within the scenic landscapes of Ronler Acres, Hillsboro, Oregon. This facility serves as Intel’s central hub for pioneering semiconductor research, technology innovation, and manufacturing in the United States. These plans come to fruition with the invaluable support of the state of Oregon, the city of Hillsboro, Washington County, and in hopeful anticipation of backing from the U.S. CHIPS and Science Act.

Intel’s substantial investments in its research and development (R&D) and manufacturing operations in Oregon play a pivotal role in the company’s pursuit of technological leadership. As part of its grand strategy to infuse more than $100 billion into the United States over a five-year span, Intel’s CEO, Pat Gelsinger, outlined this vision at September’s Intel Innovation event.

The intricate details of Intel’s plans encompass the following:

1. Revamping Existing Technology Development Facilities: The company is committed to enhancing its current technology development facilities at the Gordon Moore Park campus, equipping them with state-of-the-art process technology and tools, thereby propelling the campus to the forefront of innovation.
2. Introduction of Cutting-Edge Technology: A noteworthy feature includes the anticipated arrival of the world’s first high-numerical aperture extreme ultraviolet (high-NA EUV) lithography tool later this year.
3. Permit Application for Expansion: Furthermore, Intel is set to initiate the application process for permits that would pave the way for a potential multibillion-dollar expansion of Intel’s R&D and manufacturing capacity.

These investments, mirroring similar commitments across other Intel locations in the U.S., hinge on support from the U.S. CHIPS Act. They are projected to yield thousands of new permanent and construction jobs, while also securing Oregon and the Pacific Northwest’s position as the epicentre of U.S. semiconductor research and technology development for years to come.

It’s essential to note that Intel stands as the sole leading-edge semiconductor manufacturer with its research and development and technology development headquarters in the United States. Oregon, through its support, plays a vital role in Intel’s strategy to regain technological leadership by 2025 and realize the company’s IDM 2.0 vision. Incentives provided by the U.S. CHIPS Act hold the potential to significantly expedite advancements at the site, thereby ensuring the United States maintains its supremacy in leading-edge semiconductor technology.

Hillsboro, Oregon, is home to Intel’s facilities that constitute the core of the most influential semiconductor innovation cluster in the nation. The company nurtures strong partnerships with the local government, educational institutions, construction trades, and nonprofits. On April 5, 2023, during her visit to Oregon, U.S. Commerce Secretary Gina Raimondo commended the unity and strength of this diverse ecosystem, expressing being “blown away” by the collaboration between Intel, the community, and the government in driving the semiconductor industry in Oregon.

Intel’s Technology Development Group, headquartered in Oregon, conducts research that peers into the technological future, with teams exploring new process technologies a decade or more ahead. Simultaneously, Intel is committed to mitigating its environmental impact by investigating eco-friendly chemistries and treatment methods, contributing to its pledge to achieve net-zero greenhouse gas emissions across its global operations by 2040.

As part of its broader mission, Intel is dedicated to widening access to opportunities, empowering the next generation of innovators, and expanding the talent pool within the industry. Collaborative investments in programs with universities, community colleges, and local school districts across the state underscore Intel’s commitment to STEAM education and fostering accessible workforce pathways.

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Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the company is extending its AIROC portfolio with the AIROC CYW5551x Wi-Fi 6/6E and Bluetooth 5.4 solution. The versatile family delivers secured, reliable 1×1 Wi-Fi 6/6E (802.11ax) connectivity that goes beyond the standard, plus advanced ultra-low power Bluetooth (BT) connectivity. The optimized CYW55512, a dual-band Wi-Fi 6 solution, and CYW55513, a tri-band Wi-Fi 6/6E solution, feature power-efficient designs ideal for smart home, industrial, wearables and other small form-factor IoT applications.

“Infineon’s new CYW5551x family brings the range, reliability, and network robustness from our 2×2 Wi-Fi 6/6E CYW5557x family of devices to an IoT optimized family,” said Sivaram Trikutam, Vice President of Wi-Fi Products of Infineon. “As part of the company’s digitalization and decarbonization strategy, this family is optimized for very low power consumption, making it ideal for battery-operated devices like wearables and IP cameras. Tuned for best performance across a wide temperature range, it serves industrial and infrastructure applications such as electric vehicle charging, solar panel controls, logistics and others”

The new solution also offers support for the “greenfield” 6 GHz band for Wi-Fi 6E, delivering lower latency and reduced interference. Bluetooth 5.4 low energy (LE) with Audio is range and power-optimized with up to 20 dBm transmit power. Other features include improved multi-layer security (PSA Level 1-certifiable); and design versatility supported by a wide ecosystem of module and platform partners. As with other members of the AIROC CYW5551x family, the devices feature Linux, RTOS and Android support, and have a fully validated Bluetooth stack and sample code to accelerate development time.

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STMicroelectronics Reports 2023 Third Quarter Financial Results

• Q3 net revenues $4.43 billion; gross margin 47.6%; operating margin 28.0%; net income $1.09 billion
• YTD net revenues $13.00 billion; gross margin 48.7%; operating margin 27.6%; net income $3.14 billion
• Business outlook at mid-point: Q4 net revenues of $4.30 billion and gross margin of 46%

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the third quarter ended September 30, 2023. This press release also contains non-U.S. GAAP measures (see Appendix for additional information).

ST reported third quarter net revenues of $4.43 billion, gross margin of 47.6%, operating margin of 28.0%, and net income of $1.09 billion or $1.16 diluted earnings per share.

Jean-Marc Chery, ST President & CEO, commented:

• “Q3 net revenues of $4.43 billion came in above the midpoint of our business outlook range, and Q3 gross margin of 47.6% was slightly above guidance.” 
• “Q3 net revenues increased 2.5% year-over-year. As expected, the revenue performance was driven mainly by continued growth in Automotive, partially offset by lower revenues in Personal Electronics.”
• “On a year-over-year basis, gross margin remained stable at 47.6%, while, as expected, operating margin decreased to 28.0% from 29.4% and net income was stable at $1.09 billion.”
• “First nine months net revenues increased 11.1% year-over-year, driven by growth in ADG and MDG Product Groups, partially offset by a decline of AMS Product Group. Operating margin was 27.6% and net income was $3.14 billion.”
• “Our fourth quarter business outlook, at the mid-point, is for net revenues of $4.30 billion, declining year-over-year and sequentially by about 3%; gross margin is expected to be about 46%.”
• “The midpoint of this outlook translates into full year 2023 revenues of about $17.3 billion, representing 7.3% year-over-year growth and a gross margin of about 48.1%.”

Quarterly Financial Summary (U.S. GAAP)

(US$ m, except per share data)	Q3 2023	Q2 2023	Q3 2022	Q/Q	Y/Y
Net Revenues	$4,431	$4,326	$4,321	2.4%	2.5%
Gross Profit	$2,109	$2,119	$2,059	-0.5%	2.4%
Gross Margin	47.6%	49.0%	47.6%	-140 bps	–
Operating Income	$1,241	$1,146	$1,272	8.2%	-2.4%
Operating Margin	28.0%	26.5%	29.4%	150 bps	-140 bps
Net Income	$1,090	$1,001	$1,099	8.9%	-0.8%
Diluted Earnings Per Share	$1.16	$1.06	$1.16	9.4%	–

 

Third Quarter 2023 Summary Review

Net Revenues By Product Group (US$ m)	Q3 2023	Q2 2023	Q3 2022	Q/Q	Y/Y
Automotive and Discrete Group (ADG)	2,025	1,955	1,563	3.6%	29.6%
Analog, MEMS, and Sensors Group (AMS)	990	940	1380	5.3%	-28.3%
Microcontrollers and Digital ICs Group (MDG)	1412	1427	1374	-1.0%	2.8%
Others	4	4	4	–	–
Total Net Revenues	4431	4326	4321	2.4%	2.5%

Net revenues totaled $4.43 billion, representing a year-over-year increase of 2.5%. On a year-over-year basis, ADG and MDG revenues increased 29.6% and 2.8% respectively, while AMS decreased 28.3%. Year-over-year net sales to OEMs and Distribution increased 2.1% and 3.4%, respectively. On a sequential basis, net revenues increased 2.4%, 130 basis points better than the mid-point of ST’s guidance. ADG and AMS both reported an increase in net revenues on a sequential basis, and MDG slightly decreased, as expected.

Gross profit totaled $2.11 billion, representing a year-over-year increase of 2.4%. Gross margin of 47.6% was stable year-over-year, as improved product mix was offset by higher manufacturing costs and unused capacity charges.

Operating income decreased 2.4% to $1.24 billion, compared to $1.27 billion in the year-ago quarter. ST’s operating margin decreased 140 basis points on a year-over-year basis to 28.0% of net revenues, compared to 29.4% in the 2022 third quarter

Corporate developments

On September 19, 2023, the ST Supervisory Board announced that it would propose for shareholder approval at ST’s 2024 Annual General Meeting of Shareholders, the reappointment of Jean-Marc Chery for a three-year mandate as the sole member of the Company’s Managing Board and its President and Chief Executive Officer, and that Mr. Chery had accepted the proposal.

Business Outlook

ST’s guidance, at the mid-point, for the 2023 fourth quarter is:

• Net revenues are expected to be $4.30 billion, a decrease of about 3% sequentially, plus or minus 350 basis points.
• Gross margin of 46%, plus or minus 200 basis points.
• This outlook is based on an assumed effective currency exchange rate of approximately $1.08 = €1.00 for the 2023 fourth quarter and includes the impact of existing hedging contracts.
• The fourth quarter will close on December 31, 2023.

Conference Call and Webcast Information

ST will conduct a conference call with analysts, investors and reporters to discuss its third quarter 2023 financial results and current business outlook today at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until November 10, 2023.

Use of Supplemental Non-U.S. GAAP Financial Information

This press release contains supplemental non-U.S. GAAP financial information.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information from other companies. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with ST’s consolidated financial statements prepared in accordance with U.S. GAAP.

See the Appendix of this press release for a reconciliation of ST’s non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures.

Forward-looking Information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management’s current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance, or events to differ materially from those anticipated by such statements, due to, among other factors:

• changes in global trade policies, including the adoption and expansion of tariffs and trade barriers, that could affect the macro-economic environment and adversely impact the demand for our products;
• uncertain macro-economic and industry trends (such as inflation and fluctuations in supply chains), which may impact production capacity and end-market demand for our products;
• customer demand that differs from projections;
• the ability to design, manufacture and sell innovative products in a rapidly changing technological environment;
• changes in economic, social, public health, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macroeconomic or regional events, geopolitical and military conflicts (including the ongoing conflict between Russia and Ukraine), social unrest, labor actions, or terrorist activities;
• unanticipated events or circumstances, which may impact our ability to execute our plans and/or meet the objectives of our R&D and manufacturing programs, which benefit from public funding;
• financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;
• the loading, product mix, and manufacturing performance of our production facilities and/or our required volume to fulfill capacity reserved with suppliers or third-party manufacturing providers;
• availability and costs of equipment, raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations (including increasing costs resulting from inflation);
• the functionalities and performance of our information technology (“IT”) systems, which are subject to cybersecurity threats and which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers, suppliers, partners and providers of third-party licensed technology;
• theft, loss, or misuse of personal data about our employees, customers, or other third parties, and breaches of data privacy legislation;
• the impact of intellectual property claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
• changes in our overall tax position as a result of changes in tax rules, new or revised legislation, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
• variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
• the outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;
• product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products, or recalls by our customers for products containing our parts;
• natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, the effects of climate change, health risks and epidemics or pandemics such as the COVID-19 pandemic in locations where we, our customers or our suppliers operate;
• increased regulation and initiatives in our industry, including those concerning climate change and sustainability matters and our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027;
• potential loss of key employees and potential inability to recruit and retain qualified employees as a result of epidemics or pandemics such as the COVID-19 pandemic, remote-working arrangements and the corresponding limitation on social and professional interaction;
• the duration and the severity of the global outbreak of COVID-19 may continue to negatively impact the global economy in a significant manner for an extended period of time, and also could materially adversely affect our business and operating results;
• industry changes resulting from vertical and horizontal consolidation among our suppliers, competitors, and customers; and
• the ability to successfully ramp up new programs that could be impacted by factors beyond our control, including the availability of critical third-party components and performance of subcontractors in line with our expectations.

Such forward-looking statements are subject to various risks and uncertainties, which may cause actual results and performance of our business to differ materially and adversely from the forward-looking statements. Certain forward-looking statements can be identified by the use of forward looking terminology, such as “believes,” “expects,” “may,” “are expected to,” “should,” “would be,” “seeks” or “anticipates” or similar expressions or the negative thereof or other variations thereof or comparable terminology, or by discussions of strategy, plans or intentions.

Some of these risks are set forth and are discussed in more detail in “Item 3. Key Information — Risk Factors” included in our Annual Report on Form 20-F for the year ended December 31, 2022 as filed with the Securities and Exchange Commission (“SEC”) on February 23, 2023. Should one or more of these risks or uncertainties materialize, or should underlying assumptions prove incorrect, actual results may vary materially from those described in this press release as anticipated, believed, or expected. We do not intend, and do not assume any obligation, to update any industry information or forward-looking statements set forth in this release to reflect subsequent events or circumstances.

Unfavorable changes in the above or other risks or uncertainties listed under “Item 3. Key Information — Risk Factors”

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In a monumental leap in mobile technology, Qualcomm has introduced the Snapdragon 8 Gen 3, a cutting-edge smartphone processor designed to enable on-device generative AI capabilities. This innovative platform opens the doors to a new era of generative AI, promising to empower users with the ability to generate unique content, enhance productivity, and unlock various breakthrough applications, according to Chris Patrick, General Manager of Qualcomm.

The Snapdragon 8 Gen 3 processor heralds a significant advancement in AI capabilities, offering robust support for large language models (LLM) and language vision models (LVM) on the device. Additionally, it facilitates transformer network-based automatic speech recognition with up to an impressive 10 billion parameters.

One of the standout features of the Snapdragon 8 Gen 3 is its capacity to accommodate LLMs, allowing them to run at a remarkable speed of up to 20 tokens per second, notably exemplified by the 7B Llama 2 model.

Qualcomm claims a substantial improvement in AI inferencing performance, boasting a remarkable 40% increase in performance per watt compared to the company’s previous generation of phone processors. This improvement is set to redefine the AI capabilities of smartphones.

Under the hood, the Snapdragon 8 Gen 3 processor is equipped with a 64-bit CPU, which comprises a potent 3.3GHz ‘prime’ core, strongly believed to be the Cortex-X4, complemented by five ‘performance’ cores clocked at 3.2GHz and two ‘efficiency’ cores running at 2.3GHz. This diverse core architecture ensures optimal performance across a spectrum of tasks.

Gaming enthusiasts will find the Snapdragon 8 Gen 3 particularly appealing, as it is tailored to deliver a captivating on-phone gaming experience. The processor features hardware-accelerated ray tracing, setting the stage for immersive and visually stunning gameplay. Moreover, it supports an astonishing 240 frames per second on 240Hz displays. For those seeking a truly cinematic experience, the processor also includes upscaling capabilities to deliver stunning 8K resolution for external displays.

Connectivity is a core strength of the Snapdragon 8 Gen 3, boasting a 5G modem onboard, ensuring high-speed mobile data connectivity. Complementing this is Wi-Fi 7, which achieves peak speeds of up to 5.8 gigabits per second, redefining wireless connectivity. The processor also integrates Bluetooth 5.4, further enhancing the communication capabilities of smartphones.

This new release from Qualcomm signifies a groundbreaking step in the realm of mobile technology, promising to revolutionize how smartphones harness the power of AI. The Snapdragon 8 Gen 3 offers users the potential to create unique content and explore new horizons in productivity and AI-driven applications, all with unparalleled performance and efficiency.

In conclusion, the Qualcomm Snapdragon 8 Gen 3 processor is poised to redefine the capabilities of smartphones by ushering in a new era of generative AI. With its exceptional performance, support for LLMs and LVMs, and an array of gaming and connectivity features, this processor represents a significant technological advancement, promising an exciting future for mobile devices.

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STMicroelectronics has released the ACEPACK 1DMT-32 family of silicon carbide (SiC) power modules in a convenient 32-pin, dual-inline, molded, through-hole package for automotive applications. Targeted at systems such as on-board chargers (OBC), DC/DC converters, fluid pumps, and air conditioning, they deliver advantages including high power density, very compact design, and simplified assembly. The product family enhances flexibility for system designers by presenting a choice of four-pack, six-pack, and totem-pole configurations.

The modules contain 1200V SiC power switches that leverage ST’s state-of-the-art, second- and third-generation SiC MOSFET technology ensuring low RDS(on) values. The devices deliver efficient switching performance with minimal dependence on temperature to ensure high efficiency and reliability at the converter system level.

Leveraging ST’s proven, robust ACEPACK technology, the modules reduce overall system- and design-development costs while ensuring outstanding reliability. The package technology features a high-performance aluminum nitride (AlN) insulated substrate for excellent thermal performance. There is also an integrated NTC sensor that provides temperature monitoring for thermal protection.

The first product in ACEPACK DMT-32, introduced today with a ramp-up to volume production since Q4’23, is M1F45M12W2-1LA. The M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, M1P30M12W3-1LA are sampling now with ramp-up to volume production starting from Q1’24. Pricing is dependent on configuration.

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Experience the Disruptive Automotive and EV Technologies Live. Second Edition of Auto EV India 2023 is going to take you to the next level of Mobility Technologies

Next Level of Automotive and EV Technologies

Automotive industry is likely to go into some offbeat directions now on. The revolution is reshaping our world with innovations in both electric vehicles and the automotive at a fast pace. 300 plus miles on a single charge, high-speed charging in under 10 minutes, adoption of common standards by the entire ecosystem, battery innovations such as silicon anodes and solid-state, driving more integrated and intelligent energy consumption, energy repository for users, whether on the road or in their homes are some of the next levels of automotive and EV technologies.

Composite materials i.e. sheet-moulded carbon are making the most of an infinitely recyclable material, ADAS systems paving the way toward greater autonomous capabilities, interconnectivity between cars and the grid, public charging infrastructure technology solutions will overthrow the conventional ways of travelling.

Thermal management and adaptation to various climates across the globe, electric motor, regenerative braking to save every bit of energy while driving, which is something that could be leveraged by carmakers in the future to build even more efficient passenger cars.

 

 

Some Newest Technologies are going to Surprise You

BMW i Vision Dee can change colors like a chameleon though limited to just black and white shades. At i Vision Dee, i.e. Digital Emotional Experience, where users can customize the car’s exterior color to express their style. Drivers can select driving-related information, or can also have a virtual experience with a black-out window.

Qualcomm unveiled its Snapdragon Ride Flex SoC which brings low-power, advanced computing capabilities, including digital cockpit and ADAS. Going beyond in-car infotainment, it can unlock in-vehicle experiences, such as the partnership with SalesForce, to offer a one-click over-the-air (OTA) upgrade for new features, buying tickets for a show, parking tickets, or even reserving a table at a restaurant on the go.

Stellantis debuts futuristic Peugeot Inception & Ram 1500 EV Truck – The all-electric concept car can go 500 miles or 800 km on a single charge. It features an innovative Hyper-square control system that is inspired by video games, replacing the traditional steering wheel with an all-digital electric control. The concept EV will also feature Level 4 autonomous driving with a next-gen i-Cockpit.

Hyundai Mobis showed off its future mobility technology by presenting the M Vision to purpose-built concept autonomous shuttle for public transport. The self-driving electric vehicle is equipped with four pillars having radars, sensors, and cameras. Packing more tech, it will also have mixed reality (MR) displays, e-corner modules and LiDARs integrated into the pillars.

 

 

Live Technology Demos

At Auto EV Expo 2023, visitors have the opportunity of getting up close with the technology they hear about. It’s where you can attend a presentation on latest and upcoming technologies and then see it up close, in use, with machines right across the hall. Live demos at Auto EV Expo 2023 give you an exclusive look at current and emerging technology and how it’s being used. Live demos on the show floor and presentations in the conferences give you an exclusive look at current and emerging technology. Get real time answers to your technology questions.

A must Visit for the Engineers Working On Automotive and EV Design

Design teams need a cost-effective design solution to meet safety, reliability and performance specifications. Designers have numerous challenges to overcome as hybrids and EVs become more popular. Charging Infrastructure, Less Efficient Batteries and Restricted Driving Range, EV Reliability as the Power components such as motor, battery and power electronics are vulnerable to environmental stress including mechanical shocks and temperature variation, making powertrain reliability a key challenge for designers.

Moreover, the ability of the microcontroller to optimize power efficiency for a different component of the EV as long-term design flexibility is dependent on high- to low-end designs, Power Semiconductors challenges include functioning in high-voltage and high-frequency modes, operating with high thermal conductivity and less on-state resistance are such challenges. Design engineers will get to know all this and more from the horses’ mouth.

 

 

A must Visit for the Automakers, OEMs, Tier 1 & 2

There is no question that businesses in the automotive industry rely on their supply chains. Without a well-run supply chain, operations stop and time and money are lost. The Automotive industry relies heavily on the manufacture and distribution of components and parts – operate their supply chain on a tier system which puts a lot of importance on Time Critical delivery. This helps to keep things simple for all those involved, from supply chain director to purchasing manager, and ensures parts are delivered in a timely fashion. The entire operation intertwines the interests of automakers, OEMs, Tier 1 & 2 suppliers precisely and gathering them at one place serves their purpose perfectly.

500+ Leading Technology Brands from Nine Countries Display Cutting Edge Technologies

500+ leading technology brands from nine countries will showcase the cutting-edge technologies at Auto EV India. The traditional leaders in automotive technologies like Germany, USA, Japan, the UK and China will showcase the employable and futuristic technologies with live demos at the show. So, stay ahead in technology space. Being the only comprehensive show, Auto EV India, attempts to bring about the entire ecosystem of automotive space at one place. The technologies displayed here are difficult to find generally in any other exhibition in India.

At Auto EV India, Technology is the Name of the Game

Gasoline to hybrid to electric to hydrogen and what not – the automotive technologies are ever changing. At Auto EV India, technology is the name of the game. Don’t miss to visit the show.

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Author: STMicroelectronics

The summer brought some exciting news for IoT developers. The integration of eSIM cards into IoT devices can now be streamlined with GSMA’s new framework for IoT. Naturally, ST is upgrading its portfolio, with a new wave of products coming in 2024. In this article, we will explore how GSMA eSIMs can enhance agility and efficiency in IoT projects.

Let’s start with the basics. What is an eSIM?

Based on a secure microcontroller, an embedded Subscriber Identity Module (eSIM) is no less than a tiny computer that manages encryption keys and stores confidential information to securely identify devices and authenticate users. Embedded SIMs offer developers three important advantages over regular SIMs. First, eSIMs aren’t removable, they are directly soldered into devices which helps free up valuable space on PCB—a good omen for batteries. Their size is four to fifteen times smaller, making them ideal for IoT and wearable devices. To take one small example, ST’s most recent eSIM has a footprint of 7 mm2. Second, eSIMs are more robust. They can be used in industrial environments for machine-to-machine communications, as well as in Automotive applications (Vehicle-to-everything systems, etc). Third point, eSIMs have the potential to bring more freedom to the end users. Disappointingly, a potential that goes unfulfilled. Although eSIMs can technically support multiple telecom operator profiles, users are still not allowed to juggle between plans. All that is about to change though.

GSMA eSIMs for IoT: the freedom of choice

In 2025, we will be surrounded by more than 75 billion connected IoT devices1. Some of these devices are designed to make our lives easier, others to ensure our safety and protect our health. Hence, IoT developers need to ensure the best connectivity anywhere at any time, in an affordable way.

So, what’s new with this specification? A major benefit: is easy and quick subscriptions. Users can subscribe to multiple international plans and switch between them in record time, depending on their needs or location. Each profile represents a different mobile plan. Plans from various international operators can be activated or deactivated via over-the-air updates instantly. All this without human intervention.

What does this mean for developers? They can now create IoT solutions that automatically switch to the best available network to maximize network performance and cost savings. Take, as an example, asset tracking. With the next wave of GSMA-certified eSIMs, roaming fees can be eliminated. And latencies will come down considerably.

Reducing the complexity of your IoT project: from design to production

Forget everything you’ve heard about development complexity. To update eSIMs remotely, the previous GSMA specification (designed for machine-to-machine) required the use of a certified Subscription Manager Secure Routing (SM-SR) server, which was pre-integrated with certified Subscription Manager Data Preparation (SM-DP) servers. A bane for many IoT developers that design ultralow-power devices, with no or limited user interfaces. But here is the good news. This new specification doesn’t require such a complex configuration. This fundamental change simplifies the swapping process with instant updates.

GSMA Specifications

Additionally, future GSMA-certified eSIMs will work with the vast majority of IoT devices that do not have the processing power or user interface of a typical smartphone or tablet. And eSIMs will be capable of supporting a diverse range of network constraints, including LPWAN (Low Power Wide Area Network) technologies such as NB-IoT (Narrowband IoT).

To the best of our knowledge, ST is the world’s only one-stop eSIM shop for Industrial & IoT. Developers can save both time and money with ST’s comprehensive offer, which includes everything from silicon components to operating system development and product personalization—we can even load your sensitive data for you, using ST’s certified manufacturing process.

To sum things up, future GSMA-certified eSIMs will be a key enabler toward the development and democratization of next-gen. IoT devices. Our next-gen. GSMA eSIMs products will be released in 2024. Contact our sales team to receive samples!

Read the full article by STMicroelectronics at https://blog.st.com/iot-devices-is-it-time-to-consider-gsma-esims/

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Infineon Technologies and Hyundai Motor Company and Kia Corporation have signed a multi-year supply agreement for silicon carbide (SiC) and silicon (Si) power semiconductors. Infineon will build and reserve manufacturing capacity to supply SiC as well as Si power modules and chips to Hyundai/Kia until 2030. Hyundai/Kia will support the capacity build-up and capacity reservation with financial contributions.

“Infineon stands as a valued strategic partner, boasting steadfast production capabilities and distinct technological prowess within the power semiconductor market,” said Heung Soo Kim, Executive Vice President and Head of Global Strategy Office (GSO) at Hyundai Motor Group. “This partnership not only empowers Hyundai Motor and Kia to stabilize its semiconductor supply but also positions us to solidify our leadership in the global EV market, underpinned by our competitive product lineups.”

“The future car will be clean, safe and smart and semiconductors are at the heart of this transformation. As a trusted partner, we are proud to advance our long-term partnership with Hyundai/Kia,” said Peter Schiefer, President of Infineon’s Automotive Division. “We contribute premium products of high quality, our system knowledge and application understanding combined with continued investments in manufacturing capacity to address the increasing demand for automotive power electronics.”

Infineon’s power semiconductors are key enablers for the transition to electromobility. This transition will lead to strong market growth for power semiconductors, especially those based on wide bandgap materials like SiC. With the significant expansion of its Kulim fab, Infineon will build the world’s largest 200-millimeter SiC power fab and further strengthen its market-leading role as a high-quality, high-volume supplier to the automotive industry. In line with Infineon’s multi-site strategy, the Kulim facility will complement Infineon’s current manufacturing capacity in Villach, Austria, and further capacity expansions in Dresden, Germany.

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R&D Vision Includes Adapting Wireless Technology for Drones and Robots in Factories

CEA-Leti today announced a new R&D initiative to contribute to a higher level of vehicle automation and cooperation by expanding the latest developments in vehicular wireless communications that improve reaction time, pedestrian detection and overall vehicle performance.

Combining learnings from its participation in three EU H2020 projects, CEA-Leti scientists have consolidated the institute’s expertise in vehicle-to-everything (V2X) communication technologies and standards. Their focus includes evaluating and demonstrating connected and cooperative vehicular systems to improve automation and help ensure the safety of vulnerable road users, such as pedestrians, workers and cyclists.

“The ultimate goal of our ongoing work is to help our partners in the automotive and related industries understand and adopt the benefits of V2X cooperative communications for improved safety, efficiency and automation performance,” said Benoît Denis, research scientist on radio localization and project manager at CEA-Leti.

The H2020 studies included integrating a dedicated simulation flow for system-level evaluation of different short- and long-range radio technologies, such as IEEE802.11.p/bd, C-V2X sidelink or 5G-NR. They also investigated different architecture and infrastructure options, including roadside units, 5G base stations and MEC servers.

“Most important, a simulation tool the team developed was used to measure the actual impact of observed communication network performance in terms of latency, link reliability, coverage and load, on the critical vehicular applications,” explained Valérian Mannoni, research scientist on communication protocol and project manager at CEA-Leti. “These include service availability and continuity, level of automation allowed, time to collision and other primary key parameters.”

Denis said that while V2X communication technologies and protocols were initially developed to improve road safety through cooperation, the growing use of autonomous fleets of collaborative robots and drones raises similar research questions and challenges in a variety of complex mobile operating contexts.

“The cooperative communication approaches developed for vehicles could therefore also be used for collision avoidance and cooperative maneuvers by autonomous robots in smart factories,” he said.

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Expanded partnership highlights significant EV growth opportunity, as well as increased investment in R&D and inverter technology

Allegro MicroSystems, Inc. (“Allegro”) (Nasdaq: ALGM) a global leader in power and sensing semiconductor technology for motion control and energy-efficient systems, today announced that BMW Group (Nasdaq: BMWYY), the world’s leading premium manufacturer of automobiles and motorcycles, has selected Allegro as the sole Current Sensor IC supplier for BMW Group’s traction inverter systems used across the company’s entire fleet of Battery Electric Vehicles.

As the market leader in Magnetic Sensing, Allegro’s Current Sensor integrated circuits (“ICs”) deliver market-leading accuracy in the measurement of electrical current flowing through the vehicle motors. This accuracy enables precise motor control, leading to a superior driving experience and an extended driving range by minimizing power losses.
The IC’s built-in overcurrent detection and self-diagnostics enable BMW to meet the highest level of safety and reliability while reducing the number of components used in the traction inverter.

“For more than two decades, Allegro has worked closely with leading automotive customers to develop innovative, high-performance Magnetic Sensors that help increase the power density and improve the efficiency of power electronic systems used in electric vehicles,” said Michael Doogue, Allegro’s Chief Technology Officer. “We appreciate our strong relationship with the BMW Group, whose innovative mindset, focus on high performance, and technical insights positively influence Allegro’s technology and product roadmaps. Our expertise in Hall, TMR, coreless technologies and Automotive Safety Integrity Level (ASIL) rated sensors enables our customers to meet their design targets and accelerate their time to market.”

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NEU-ISENBURG, Germany-Arrow Electronics has announced a global distribution agreement with Truesense, a leading company in edge AI, software algorithms and UltraWideBand (UWB) radar and ranging technology, to distribute Truesense modules, development kits and software.

The agreement lets Arrow’s customers accelerate new product designs by leveraging Truesense UWB modules for roles such as communication, ranging and localization, real-time location, asset tracking, gesture detection, access control, and environmental sensing.

“Adding the Truesense portfolio to our lineup expands our offer to customers, provides easy access to cutting-edge UWB technology that permits high-value functionality with excellent power efficiency ideal for IoT devices and portable products,” said Matthias Hutter, vice president supplier marketing and product management, EMEA, Arrow Electronics. “With the supporting ecosystem comprising evaluation hardware and ready-to-use software, we can help our customers quickly bring new concepts to market that are innovative and disruptive, as well as robust and reliable.”

“Our agreement with Arrow strengthens our market presence and enables a broader customer base to unleash the inherent strengths of UWB in future generations of smart products,” said Alessandro Bassi, chief marketing officer, Truesense. “Teaming our specialized knowhow and R&D resources with Arrow’s in-house engineering skills and commercial services is a combination that’s sure to deliver success.”

UWB technology is based on IEEE 802.15.4a/z and optimized for precise location, with strengths including high accuracy and reliability, low latency, security, and low power consumption. Resistant to obstructions, interference, and multipath errors, UWB performs strongly in indoor contexts such as in smart buildings, smart factories, medical applications such as patient and equipment monitoring, and the enhanced spatial awareness in Virtual Reality (VR) and Augmented Reality (AR) equipment.

Truesense was founded in 2020 and is closely connected to the Politecnico University in Milan. The current portfolio, now available from Arrow, comprises the DCU040, and DCU150 modules for ranging use cases based on NXP® Semiconductors’ Trimension® ICs, and very soon will make available a new module and platforms for radar use cases. Truesense modules integrate antennas, and external components such as a clock, filter, so there is no requirement of RF design by the user. Also available, the Truesense UWB development kit is ready to plug into Arduino hardware and is easily configured to assist development of new products that incorporate UWB technology.

Customers can also take advantage of Truesense UWB software libraries, AI algorithms, smart-app and code examples to facilitate their projects and minimize time to market for new product designs.

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The Combined Exhibition of Advanced Technologies (CEATEC) 2023, Asia’s premier digital technology showcase, commenced on Tuesday in Chiba, Japan. With a four-day duration, this event, organized by the Japan Electronics and Information Technology Industries Association (JEITA), brings together 684 companies and organizations from Japan and around the world to unveil cutting-edge artificial intelligence (AI) and virtual reality (VR) technologies aimed at addressing critical societal issues, such as labour shortages and global warming.

CEATEC 2023 marks a significant shift in focus, emphasizing the role of technology in realizing a sustainable future. The event, which is the first to be held without COVID-19 restrictions, has evolved substantially since its inception in 2000. In 2016, CEATEC transitioned from a consumer electronics trade fair to a forward-looking exhibition, dedicated to the realization of Society 5.0, a vision of future society and lifestyles made possible by the Internet of Things (IoT) and co-creation.

With labour shortages being a global concern, the technologies on display aim to provide innovative solutions to this problem. AI-powered automation and robotics are at the forefront of this effort, with numerous companies showcasing their contributions to improving workforce efficiency.

Moreover, addressing climate change and global warming, another pressing issue is a central theme at CEATEC 2023. The concept of “green digitalization” is being explored, which emphasizes environmentally friendly digital solutions. Companies are presenting their initiatives to reduce carbon footprints and promote sustainability, underscoring the importance of technology in mitigating the environmental crisis.

The development and application of AI and VR technologies have found new relevance in the context of super cities – smart, interconnected urban areas that rely on data and automation to improve the quality of life. CEATEC 2023 provides a platform for tech companies to demonstrate how these innovations can create more efficient and sustainable urban environments.

CEATEC 2023 is a symbol of resilience and adaptation. For the past three years, the event had to adapt to pandemic-induced restrictions, either partially or fully transitioning to online platforms. However, the return to an in-person format this year signifies a reinvigorated spirit of collaboration and innovation.

Kazuo Sakamoto, President of JEITA, expressed his optimism for CEATEC 2023, stating, “This year’s CEATEC is special in many ways. We are back in person after a challenging period. Our focus on cutting-edge technology solutions for societal issues, combined with the determination of industry leaders to make a difference, is what makes CEATEC 2023 a significant event.”

The expo has already attracted attention from tech enthusiasts, industry professionals, and government officials alike. High-profile speakers and thought leaders are scheduled to discuss the future of technology and its role in solving pressing global issues during panel discussions and keynotes throughout the event.

As CEATEC 2023 unfolds over the next few days, the world will witness the unveiling of innovative AI and VR technologies designed to address labour shortages, combat global warming, and pave the way for super cities of the future. This digital technology exhibition promises to not only showcase technological advancements but also inspire a collective commitment to building a more sustainable and interconnected world through innovation.

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Vicor’s Powering Innovation podcast examines how a global leader in ocean wave energy systems is powering offshore applications using power modules

Vicor Corporation, the leader in high‑performance power modules, speaks with C-Power, a global leader in ocean wave energy systems, about how they harness and store wave power. An idea that began as a graduate project at Oregon State University has matured into a ground-breaking renewable energy power solutions for offshore applications that support the fast growing New Blue Economy.

C-Power’s solutions meet the global demand to decarbonize energy production, by converting ocean waves into usable forms of energy, while also enabling data transmission to and from the Cloud. The electricity harnessed by C-Power’s autonomous offshore power systems (AOPS) powers remote marine projects and is an integral part to the company’s plans to unleash the next wave of zero-carbon energy for terrestrial electric grids and remote offshore mini-grids.

The Vicor Powering Innovation podcast is available to download from all major podcast providers, including Spotify, Apple Music and Google Podcasts.  Listeners can learn about today’s toughest power challenges, new ideas in electrification, creative power architectures and real-life power design challenges.

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Andreas Pauly, previously Head of the Test & Measurement Division, joined the Rohde & Schwarz Executive Board as Chief Technology Officer (CTO) on October 1, 2023. With three members, the Executive Board is now well positioned to keep the company on course for growth. Christina Gessner has taken over as Head of the Test & Measurement Division and is now a member of Rohde & Schwarz Corporate Management.

Rohde & Schwarz is strategically positioned to address key future connectivity and security technologies and has a strong market position. The company has grown for several years in succession. The appointment of a third Executive Board member is now laying the foundation for the future development of the technology group.

With Andreas Pauly (53), Rohde & Schwarz has bolstered its top management team from within the company’s own ranks. Pauly joined the Test & Measurement Division in 1996. In 2003, he qualified for his first management position and in 2015 was appointed Vice President Signal Generators, Audio Analyzers and Power Meters. Two years later, he took over as Executive Vice President of the Test & Measurement Division and kept it on track for continued success. He also bolstered the division’s resilience to market fluctuations by consistently focusing on a diversified product portfolio and investing in future technologies.

Focus on innovation and project business

As President and CTO, Andreas Pauly will concentrate on R&D topics while maintaining a focus on T&M equipment. Peter Riedel, who joined the Executive Board in 2014, will remain President and COO. He will focus on the growing project business and other areas. Managing Partner Christian Leicher will continue to head the Executive Board as President and CEO.

Adding the role of Chief Technology Officer (CTO) is the logical next step for Rohde & Schwarz. Since its founding, the group has stood for innovation and technical expertise. To stay relevant in its markets, the company invests a double-digit percentage of its revenue every year in research and development. With an eye to achieving its growth targets, the Executive Board also needs to focus even more closely on the project business. Allocating responsibilities to the three presidents creates the capacity needed to do so.

Leicher and Riedel welcome the decision: “We are very much looking forward to working with Andreas Pauly. He has made a significant contribution to the growth of the company in recent years with the Test & Measurement Division. We are convinced that together we will take Rohde & Schwarz to the next level.”

Christina Gessner takes over as Head of the Test & Measurement Division

Christina Gessner (50) has succeeded Pauly in the Test & Measurement Division. She has therefore also joined Rohde & Schwarz Corporate Management. In her most recent role, she served as Vice President Spectrum & Network Analyzers, EMC and Antenna Test Equipment.

She joined Rohde & Schwarz as a technology manager in 2004. In 2011, she became Head of Product Management for Spectrum and Network Analyzers. In the following years, she held several leadership roles before being appointed Vice President of the entire business unit in 2018. With Gessner’s appointment as Executive Vice President, Rohde & Schwarz again recruited a longstanding and experienced manager.

Pauly has full confidence in his successor: “Christina Gessner has an entrepreneurial mindset, drives innovation and focuses on customer needs. She has demonstrated this in several management functions and especially in her role as Vice President. That is exactly what is needed to take the Test & Measurement Division to the next level.”

Gessner welcomes the challenge: “I’m delighted with the trust shown to me. The Test & Measurement Division, with its highly qualified employees, has played an essential role in the company’s success for years. In my new role, I will continue on this path and ensure that our customers can still rely on T&M solutions from Rohde & Schwarz in the future.”

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SHENMAO America, Inc. is proud to introduce its latest breakthrough in soldering technology, the PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. With its exceptional performance, eco-friendly attributes, and adaptability to a wide range of applications, PF606-P276 boasts a series of remarkable features and benefits that set it apart from conventional solder pastes.

PF606-P276 offers superior void performance achieved through special activators, making it the preferred choice for high-reliability soldering applications. This solder paste is halogen-free (ROL0) and fully compliant with international environmental standards like RoHS, RoHS 2.0, and REACH, underscoring its eco-friendly credentials.

Additionally, PF606-P276 excels in solderability, ensuring flawless connections in Surface Mount Technology (SMT) processes. Its remarkable wettability characteristics guarantee a uniform soldering process, while its design for high-speed printing optimizes production efficiency. When reliability is of the essence, PF606-P276 shines with its superior solder joint strength and product performance that consistently surpasses expectations.

PF606-P276 is designed for Lead-Free No-Clean Solder Paste, tailored for Surface Mount Technology (SMT) applications. It excels in minimizing gas generation during the reflow process, achieving a void ratio of less than 10% in critical components like MOS and QFN.

This versatile solder paste is suitable for general SMT applications and is particularly well-suited for demanding automotive products with stringent reliability requirements.

SHENMAO’s commitment to innovation and quality is showcased through PF606-P276, as it continues to drive technological advancements in the electronics manufacturing industry. With this new solder paste, SHENMAO offers a solution that ensures high-performance, eco-friendliness, and the reliability required by modern electronics manufacturers.

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In response to the consumer demand for improved wireless charging user experience, the Wireless Power Consortium announced the release of a new standard to redefine the inductive wireless power transfer: Qi2. Infineon Technologies addresses this demand by introducing its first Qi2 Magnetic Power Profile (MPP) charging transmitter solution, the reference design kit REF_WLC_TX15W_M1. The new MPP in Qi2 offers magnet-based fixed positioning with an intuitive user experience. This new standard guarantees significant benefits in automotive and consumer applications, such as in-cabin wireless charging, smartphones and EarPods cases, portable speakers, and healthcare equipment through better efficiency and safety.

The reference design kit is highly integrated and form factor optimized with a diameter of less than 43 mm, and a programmable wireless charging transmitter centered around an Infineon WLC1 controller. It demonstrates the capabilities of Infineon’s Qi2-capable WLC1 which is already available on the market. The IC integrates a microcontroller (MCU) with Flash memory, a 4.5 V to 24 V DC input buck-boost controller, inverter gate drivers, and factory-trimmed current sensing. It features analog protection peripherals, USB PD, and LIN as well as serial interfaces enabling efficient and smart power delivery.

The REF_WLC_TX15W_M1 is supported with code examples in ModusToolbox to help users take advantage of the IC’s configuration capabilities. The 15 W Qi2 MPP solution board is backward compatible with a basic power profile (BPP) that allows receivers without MPP support to wirelessly charge at 5 W. In addition, a multipath ASK demodulator and adaptive foreign object detection (FOD) are provided, making the design a robust and secure wireless power solution.

“With the emerging Qi2 standards, our programmable solutions offer the flexibility that the industry needs to adapt swiftly and offer differentiated features for automotive and consumer applications,” said Ganesh Subramaniam, Senior Vice President and General Manager of the Wired Connectivity Solutions Product Line at Infineon.

The first public live demonstration of the wireless charging transmitter solution board will take place during Infineon’s OktoberTech Silicon Valley. OktoberTech is the annual technology collaboration forum hosted by Infineon. This time it will take place in the computer history museum in Mountain View, California on 25 October.

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