ELE Times

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the availability of ST Edge AI Suite, bringing together tools, software and knowledge to simplify and accelerate building edge-AI applications.

The ST Edge AI Suite is an integrated collection of software tools, designed to facilitate the development and deployment of embedded AI applications. This comprehensive suite supports both optimization and deployment of machine-learning algorithms, starting from data collection to final deployment on hardware, streamlining the workflow for different types of users.

The tools from the suite are covering a broad range of ST products, from smart sensors to microcontrollers and microprocessors including upcoming STM32N6 neural-processing microcontrollers.

“ST Edge AI Suite is the new starting point on st.com for embedded AI development. Here, today’s innovators, driven by imagination, can find help to realize tomorrow’s smart things that sense, infer, and respond intelligently, autonomously, and efficiently to the world around,” said Alessandro Cremonesi, Executive Vice President, Chief Innovation Officer and General Manager of STMicroelectronics’ System Research and Applications Group. “This environment brings developers simplicity through an easy choice of models and data sources, finding the right tools quickly and easily, optimizing and benchmarking, then automatically generating code and libraries – all within one unified framework.”

While working across multiple hardware platforms, ST Edge AI Suite meets the needs of different types of users such as data scientists, embedded software developers, and hardware system engineers.

There is seamless access to online tools such as the ST Edge AI Model Zoo and Developer Cloud, as well as desktop tools for data tuning and model optimization on the chosen hardware platform. These include NanoEdge AI Studio for generating machine learning libraries automatically, and STM32Cube.AI, MEMS Studio, and Stellar Studio, for model optimization on STM32 devices, MEMS inertial sensors, and Stellar processors. All are ready to use free of charge.

The release of this suite is also an opportunity to introduce world-first innovations for AI applications in the MEMS Studio tool: the “ISPU NN model optimizer” and “automatic selection of MLC features and filters.”

Lead customers’ experiences:

Honeywell, Soxai, and HPE Group explain how tools such as MEMS Studio and Stellar Studio in the ST Edge AI Suite help simplify and accelerate edge-AI development.

Israel Herrera, Firmware Architect & Embedded Systems Engineer, Honeywell Fire, commented, “We recognize the innovative strides ST has made in the realm of edge computing with their sensors. MEMS Studio, as featured in the ST Edge AI Suite, has proved to be a great software development tool to help us perform quick tests using multiple MEMS sensor modules from ST. It enables us to create proof of concepts easily through its code generation feature. MEMS Studio is also very useful in testing different and independent Machine Learning and Data Analysis algorithms.”

Tatsuhiko Watanabe, CEO & Founder of SOXAI, which is using ST’s edge-AI sensors, said, “While we were developing SOXAI RING 1, ST introduced the world’s first sensor with edge AI, and we quickly adopted it to boost our product’s performance. The machine-learning core software tool featured in the ST Edge AI Suite helped us quickly integrate this new technology and allowed our developers to harness the full potential of the sensor with minimal effort. Compared to the first generation, our new SOXAI RING 1 now boasts an extended battery life of at least 10 hours, a game-changer in the world of wearable technology.”

Andrea Bozzoli, CEO of HPE Group, added, “HPE is at the forefront of transforming the automotive sector through our collaboration with STMicroelectronics and their Stellar MCU and Stellar Studio software, which is part of the ST Edge AI Suite. Our Prometeo Joint Innovation Lab efforts are set to deliver a proof-of-concept for next-generation vehicle powertrains, leveraging AI to enhance predictive maintenance and control systems. This synergy will not only elevate electric vehicle performance but also enrich the digital cockpit experience, setting a new standard for smart, sustainable mobility.“

ST Edge AI Suite is now live at https://www.st.com/content/st_com/en/st-edge-ai-suite.html

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Author: STMicroelectronics

MWC Shanghai 2024 should be memorable, thanks to more than 30 innovative product showcases and demonstrations, nine applications on display, and more than 50 on-site experts. However, beyond exhibiting our latest technologies, the conference is about showing how we can positively impact society. And for those who can’t be there, here’s an overview of three demos that will stand out, not only because of the innovations they feature but the benefits they bring to all. Whether improving accessibility to public services with Bluetooth audio, making lives healthier with the most inconspicuous smoke detectors, or transforming developing economies worldwide, MWC Shanghai 2024 is about the human experience behind our digital lives.

MWC Shanghai 2024 will bring the BLE capabilities of the new STM32WBA54 and STM32WBA55 to life with two audio streaming demos. The first one showcases unicast support by setting up a real-time call between two systems powered by our STM32WBA55. The application demonstrates how developers can use a unidirectional or bidirectional connected isochronous stream. In practice, developers could create a system where a smartphone sends a signal to two pairs of headphones or speakers to share content while also being able to receive an audio stream from these products, like a person speaking into a microphone. Additionally, thanks to our LC3 codec support, developers can improve the quality of the data streamed without requiring greater bandwidth.

The other demo showcases broadcasting capabilities known as Auracast. In a nutshell, Bluetooth Low Energy Audio’s new features enable a source device to stream one stereo or two mono audio feeds to multiple sink devices at once. At MWC Shanghai 2024, our demo will send a signal to two headsets, one speaker, and two cellular devices. A real-world scenario could be an Auracast transmission in a train station to many passengers simultaneously and in two languages (one on each stream), giving users greater accessibility options. Critically, both demos can work with existing smartphones, like the Google Pixel 8. Additionally, we provide application examples for both in our STM32CubeWBA software package.

For the first time in Asia, ST is showcasing our air quality demo, which uses a VL53L8MA time-of-flight sensor in partnership with Mobile Physics. Very simply, the application can detect particles as fine as 2.5 µm to determine their concentration in the air and thus measure overall air quality. Traditionally, particulate matter sensors are expensive and serve one purpose. Consequently, it’s rare to find them in anything but devices created for that purpose. However, because ST’s VL58L8 is the same time-of-flight sensor found in smartphones, we can envision the rise of particulate measurement applications on consumer devices since all it would take is an ST sensor already present and Mobile Physics’s software.

The VL53L8MA is unique because it comes pre-loaded with the algorithm and libraries from Mobile Physics. Additionally, our partner’s SDK can help developers write their air quality measurement applications faster. In the MWC Shanghai 2024 demo, the VL53L8MA sits at the bottom of a case that contains smoke particles. The pollutant is so fine and so few that it’s invisible to the naked eye. When a fan in the case starts blowing up the air, the particles rise, and a UI shows an increase in pollutant levels. Hence, the solution essentially puts a smoke detector in every phone, transforming how we track air pollution and protect against fires.

Finally, the ST booth at MWC Shanghai 2024 will challenge the definition of a feature phone by introducing a model embarking on an NFC ST54L controller with a secure element capable of acting as a virtual card and NFC reader. The ST device is connected to two antennas: one behind the keypad, which turns the phone into a point-of-sale, and one antenna at the top of the phone to use as a virtual credit or transit card. The first deployment of this technology will take place in Nigeria and represent a major step towards a more modern and inclusive transportation system in the country by enabling people to more easily pay and receive payments.

To make all of this accessible, ST collaborated with KaiOS, the Chinese company that wrote an open-source operating system for feature phones capable of offering a rich user experience and apps like WhatsApp, YouTube, Facebook, and Google. It also includes the software stack needed to help OEMs and ODMs deploy a feature-rich mobile solution into their markets. Consequently, by adding the ST54L to feature phones and working with KaiOS to make the solution accessible in their operating system, we can offer transit and payment contactless solutions while also leveraging the eSIM capability of the ST device. The demo is, therefore, meaningful to Chinese actors realizing they can enter emerging markets in Africa while transforming people’s lives.

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Low temperature dependence together with wide angle emission and uniform light output contribute to the evolution of automotive driving assistance technologies

ROHM has established VCSELED, a new infrared light source technology that encapsulates a VCSEL (Vertical Cavity Surface Emitting Laser) element in a resin optical diffusion material for laser light. ROHM is currently developing this technology for commercialization as a light source for improving vehicle Driver Monitoring Systems (DMS) and In-Cabin Monitoring Systems (IMS).

To further enhance automotive safety, driver monitoring systems are increasingly being installed in vehicles equipped with Advanced Driver Assistance Systems (ADAS) to detect drowsiness, sleepiness, and distracted driving. In Japan, the Ministry of Land, Infrastructure, Transport, and Tourism (MLIT) has created guidelines that define the design and functions of the system, and in the EU, there are plans to make installation mandatory in all new vehicles sold in Europe from July 2024 onwards. Automakers and suppliers are also developing in-vehicle monitoring systems to detect occupants other than the driver, and there is a growing awareness of the need for high-performance light sources that enable detection systems to function with greater precision.

In response, ROHM has developed VCSELED that achieves high-accuracy sensing. Minimal wavelength temperature variation combined with a wide emission beam angle make it ideal not only for in-vehicle monitoring systems, but also contribute to improving the accuracy and performance of inspection systems for robots and industrial equipment as well as spatial recognition and ranging systems.

VCSELED extends the beam (irradiation) angle similar to LEDs by combining a high-performance VCSEL element and light diffusion material to enable sensing over a wider area with higher accuracy than VCSELs. What’s more, the light emitting element and light diffuser are integrated into a compact package, contributing to smaller, thinner applications.

The VCSEL element used in VCSELED features a narrow emission wavelength bandwidth of 4nm, approximately one-seventh that of LEDs. This characteristic improves resolution performance on the receiving side while eliminating the red glow often associated with LEDs. At the same time, a wavelength temperature variation of 0.072nm/°C – less than one-fourth that of LEDs (0.3nm/°C) – allows for high-accuracy sensing unaffected by temperature changes. Furthermore, the response time when emitting light is 2ns, approx. 7.5 times faster than LEDs, contributing to higher performance in ToF (Time of Flight) applications that use infrared light to measure distance.

ROHM is working on commercializing VCSELED as a new technology brand for infrared light source components. Prototype samples is available for purchase now, with mass production samples for consumer scheduled for release in October 2024 and automotive use in 2025, respectively. To obtain samples, please contact a sales representative or visit the contact page on ROHM’s website. Going forward, we will continue to develop laser light source technology for in-vehicle monitoring and other systems.

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The new 9289-000 Series single-piece wire-to-wire connectors facilitate quick, easy, accurate, economical, and space-saving high-reliability, IP67 in-field connections in a variety of industrial, transportation, commercial, and consumer electronics applications.

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new 9289-000 Series waterproof wire-to-wire connectors, which are designed to deliver economical, space-saving, user-friendly, and high-reliability IP67 connections in a variety of industrial, transportation, commercial, and consumer electronics applications.

These new single-piece, three-position waterproof wire-to-wire connectors are the sixth poke-home wire-to-wire connector series in the KYOCERA AVX portfolio but the first waterproof connectors in the range, as well as the first waterproof KYOCERA AVX connectors to feature its industry-proven poke-home contact technology.

Engineered to simplify, speed-up, and error-proof the termination process for a broad range of power and signal applications that require waterproof connections, the new 9289-000 Series waterproof wire-to-wire connectors enable simple, tool-free strip-and-poke-home wire insertion and twist-and-pull wire extraction for both solid and stranded wires, which facilitates quick, easy, accurate, and economical in-field connections with IP67 protection. The series features transparent polycarbonate insulators that allow installers to visually confirm wire positioning and ensure proper insertion and single-piece phosphor bronze contacts with tin-over-nickel plating and high-force contact beams that provide superior mechanical stability and maximum-strength wire retention in addition to integral wire-stops that prevent over insertion. It also offers space and cost savings compared to two-piece wire-to-wire connectors that require contact crimping and subassembly.

The new 9289-000 Series waterproof wire-to-wire connectors are rated for up to 10A, up to 1,000VACRMS or the DC equivalent, and operating temperatures extending from -40°C to +80°C and facilitate IP67 connections for 16AWG wire with outer diameters spanning 2.0–2.2mm or 3.0–3.2mm. They are also UL approved and RoHS compliant and ideal for applications including factory automation equipment, outdoor recreational vehicles, transportation lighting, horticulture lighting, other outdoor power and lighting applications, home appliances, and drones. Parts are packaged in bulk in quantities of 200 pieces per bag, and variants with other contact counts and wire sizes are available upon request.

“We’re thrilled to introduce our first waterproof poke-home connectors,” said Perrin Hardee, Product Marketing Manager, KYOCERA AVX. “The new 9289-000 Series single-piece, poke-home waterproof wire-to-wire connectors fill a gap in the industrial, transportation, commercial, and consumer electronics markets by facilitating quick, easy, accurate, economical, and space-saving in-field connections with IP67 protection, superior mechanical stability, and maximum wire retention strength for both solid and stranded wires.”

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In layman parlance, a thermocouple is a sensor that is used to measure temperature at any point. Be aware, it is different from a thermometer as it uses electricity to measure temperature rather than mercury used inside a thermometer!

• A thermocouple is made up of two wires that are made of different metals. The two wires are joined with each other to form a junction at the point of their contact. This junction is called thermocouple junction.
• One end of a wire is placed at the point where the temperature is required to be measured. The end of the other wire is kept at a constant lower temperature.
• A measuring instrument is connected to this circuit at the thermocouple junction. It is calibrated to measure temperature by voltage difference at the junction.

• When the end of a wire is placed at the point where the temperature is required to be measured, due to temperature difference with respect to the end of the other wire placed at a constant lower temperature, a temperature gradient is generated.
• The temperature, that is, thermal energy, at the end of the wires, is converted into electrical energy due to thermoelectric effect.
• Due to temperature gradient at the end of the two wires, a voltage, corresponding to the temperature gradient, is generated in the circuit. This happens due to Seebeck effect.
• Seebeck effect stipulates that when two different metal wires are joined at the two ends to form a loop, a voltage is developed in the circuit corresponding to the temperature gradient at the two ends.
• The generated voltage is measured at the thermocouple junction by a measuring instrument that has been calibrated to read the voltage generated corresponding to the temperature gradient at the two ends. This way, temperature at any point can be measured.

Thermocouples are classified on the basis of two different metals, used to make two wires that constitute a thermocouple.

• First, type E– one metal is nickel or chromium and the other is constantan.
• Second, type J. In this type, one metal is iron and the other is constantan.
• Third, type N. This type uses metals that are nickel-chromium-silicon alloys, one is doped with chromium and the other with magnesium.
• Fourth, type B. In this type, metals that are platinum-rhodium alloy are used. One metal is a platinum-rhodium alloy with 30% rhodium and the other is a platinum-rhodium alloy with 6% rhodium.
• Fifth, type K. In this type, one metal is an alloy of 95% nickel, 2% aluminium, 2% manganese and 1% silicon, whereas the other is an alloy of 90% nickel and 10%chromium, by weight.
• Sixth, type M– one metal is an alloy of 82% nickel and 18% molybdenum and the other is an alloy of 99.2% nickel and 0.8% cobalt, by weight.
• Seventh, Type T– one metal is copper, whereas the other is constantan.
• Eight, Type R. In this type, one metal is an alloy of 87% platinum and 13% rhodium, by weight, and the other is platinum.
• Ninth, Type S– one metal is an alloy of 90% platinum and 10% rhodium, by weight, and the other metal is platinum.
• Tenth, Type C. In this type, one metal is an alloy of 95% tungsten and 5% rhenium, whereas the other is an alloy of 74% tungsten and 26% rhenium, by weight.
• Eleventh, Type D– one metal is an alloy of 97% tungsten and 3% rhenium, whereas the other is an alloy of 75% tungsten and 25% rhenium, by weight.
• Twelfth, Type G. In this type, one metal is tungsten and the other is an alloy of 74% tungsten and 26% rhenium, by weight.
• Thirteenth, Type P– one metal is an alloy of 55% palladium, 31% platinum and 14% gold, whereas the other is an alloy of 65% gold and 35% palladium, by weight.

Thermocouples are very accurate in measuring temperature differences. Besides, they measure a wide range of temperature, ranging from −270 °C to 3,000 °C. They are durable and have fast response time.

Hence, they are used anywhere where temperature is required to be measured- diesel engines, kilns, scientific labs, furnaces, thermostat, nuclear reactors, etc.

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Easier handling and faster results

Leak tests are essential in semiconductor factories and in the manufacture of solar cells and flat panel displays. Identifying the smallest leaks with helium leak detection is important for maintaining the required purity, avoiding defects and ultimately for product quality. To enhance the UL family of leak testers, INFICON has therefore launched the three intelligent additions SMART-Spray, I·BOOST and SPRAY-Check. The specialist in measurement technology, sensor technology and control software thus ensures easier handling, faster response times, shorter test cycles and more reliable measurement results.

INFICON is offering a new helium spray gun with the SMART-Spray. The hose-bound handling of large helium cylinders and the error-prone adjustment of the spray volume are a thing of the past with SMART-Spray. “The handy device, which is designed for over 1,000 sprays per helium filling, replaces a remote control and combines its functions with those of a manual helium spray gun,” says Product Manager Markus Schwambera, summarising the advantages. Equipped with an illuminated colour display, it makes leak detection on complex semiconductor systems with many test points and potential leaks easier. These applications are characterised by limit leak rates of less than 1 x 10-9 mbar x l/s. In these applications, the battery-operated, portable device makes leak testing more flexible, simpler and more efficient.

With the signal processing filter I·BOOST software update, INFICON accelerates the leak rate signal. This shortens the response and test times, especially for the UL3000 Fab and UL6000 Fab series, because the test points can be sprayed at shorter intervals. “The bottom line is that this results in a time saving up to 50 % in leak detection in all measuring ranges,” says Product Manager Markus Schwambera, outlining the leap in efficiency. “Users who purchase the licence achieve faster and more precise measurement results for different chamber volumes,” assures Schwambera. The benefits of I·BOOST are also particularly effective in complex semiconductor systems. “The lower the limit leakagerates, the longer the test cycles usually take – and this is where the higher sensitivity and time savings of I·BOOST have the greatest impact,” argues Schwambera.

With the SPRAY-Check, INFICON offers an easy-to-install test leak. “The tool is based on quartz windows that are only permeable to light gases such as helium and hydrogen. This increases safety and extends the functionality of leak detection,” explains Markus Schwambera. SPRAY-Check allows the measurement set-up and test method to be checked in the relevant leak rate range. It can also be attached directly to the system to carry out dead-time checks. “Sometimes a certain amount of time elapses between the spray shot and the indication on the display,” says Markus Schwambera. This allows users to better estimate how long the pause between spraying points should last so that potential leaks can be clearly assigned. The exclusion procedure applies: If there is no indication after the dead time has elapsed, there is no leak. “Because SPRAY-Check is impermeable to gases that are harmful to the process, such as water or oxygen, it can also remain mounted on the semiconductor system,” explains the product manager. Important areas of application are systems with limit leakage rates below 10-9 mbar x l/s.

SMART-Spray, I·BOOST and SPRAY-Check are suitable for all mobile INFICON helium leak detectors of the UL family, whereby I·BOOST is limited to the latest generation of UL devices (UL3000 Fab/UL6000 Fab series). The UL6000 Fab is the most powerful and best device on the market for larger test volumes in modern semiconductor factories and coating systems with very large chamber volumes. It offers the fastest response times and shortest test times in all measuring ranges. Its compact design makes it easy to maneuver even in tight spaces. The UL3000 Fab series was also developed for leak detection in semiconductor factories. “It is characterised by flexibility, mobility, fast commissioning and high sensitivity. Users also receive their precise test results very quickly” and are the standard in modern semiconductor factories,” emphasises Product Manager Markus Schwambera. The UL3000 Fab also requires only a small footprint and can be easily and maneuvered through narrow spaces. The UL1000 Fab series covers a wide range of applications when it comes to economical helium vacuum leak tests in industrial or semiconductor environments – especially for smaller chamber volumes. The main advantages: The device is very powerful, robust and inexpensive to purchase.

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With eight PoE LAN, E-Mark certification, and abundant serial communication, the BOXER-8658AI raises the bar for in-vehicle embedded computing.

AAEON today announced a new addition to its extensive range of embedded AI systems based on the NVIDIA Jetson Orin NX, the BOXER-8658AI. Designed for the in-vehicle market, the BOXER-8658AI stands out with eight PoE LAN ports (802.3af/at), as well as GNSS, a 9-axis sensor, E-Mark certification, and 9V to 36V input with accessory ignition delay on/off.

Key Specifications

• E-Mark certified
• PoE LAN x 8, GbE LAN x 2
• Acc ignition delay on/off
• GNSS and 9-axis sensor support
• MIL-STD-810G shock and vibration resistance
• NVIDIA Jetson Orin NX

The BOXER-8658AI is designed for easy deployment and durability in rugged environments, meeting MIL-STD-810G standards for shock and vibration resistance, along with a wide temperature range of -15°C to 60°C. The system measures 8.27’’ x 6.46’’ x 2.99’’ (9.69’’ x 6.46’’ x 3.27’’ with brackets) and can be easily installed via wall mount. With its extensive PoE port selection, it does not require an additional power supply for mobile deployment.

Facilitating communication with various vehicle systems, sensors, and equipment, the BOXER-8658AI’s I/O offers four USB 3.2 Gen 2 ports, along with both DB-9 and DB-15 ports for CANBus and RS-232/422/485, respectively. The system’s DB-15 port also supports an 8-bit DIO, while GPS and 9-axis sensor board support are available via an optional UART/I2C connector.

In addition to its wide range of interfaces for wired peripheral connectivity, the BOXER-8658AI hosts seven antenna openings to support Wi-Fi and LTE communication, accessible through the PC’s M.2 2230 E-Key and M.2 3052 B-Key slots, respectively. Additional expansion options include an M.2 2280 M-Key for NVMe, a SATA drive bay, and two SIM card slots.

AAEON notes that for in-vehicle or Industrial Network Video Recorder (NVR) applications, the BOXER-8658AI can leverage the NVIDIA Jetson Orin NX’s 100 TOPS of performance and 1024-core NVIDIA Ampere architecture GPU to conduct intricate AI inferencing tasks using the vast quantities of data the PC acquires from connected peripherals.

The BOXER-8658AI is now available for pre-order on the eShop in SKUs featuring both 8GB and 16GB NVIDIA Jetson Orin NX modules, along with LPDDR5 system memory of the same capacity.

For more information and detailed specifications, please visit the BOXER-8658AI product page.

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, will exhibit at MWC Shanghai 2024 (Booth N1.D85) on 26-28 June.

ST is at the forefront of innovation, developing unique technologies and products that empower our customers to overcome challenges and capitalize on opportunities. At MWC Shanghai 2024, ST will collaborate with its ecosystem partners to present industry-leading solutions. Visitors will be immersed in the transformative power of connectivity with over 30 demonstrations designed to showcase our commitment to technological excellence and especially the future of connected experiences. These will be featured across 9 major application zones:

• Smart Charging
• Secure & Connectivity
• IMU Attitude Detection
• Smart Personal Electronics
• Time-of-Flight & Smart Cameras
• Air Quality Monitoring based on FlightSense
• Bluetooth Connectivity & Low Power MCU
• Edge AI & GUI
• ST60 mmW Contactless Connector

Secure & Connectivity: According to the International Telecommunication Union (ITU), a staggering 2.6 billion people are still unconnected, 1.4 billion of whom are unbanked, mainly in emerging countries. This disconnect not only excludes them from the digital revolution, but also hinders economic development. To enable a seamless “tap and go” experience, KaiOS has collaborated with STMicroelectronics to develop game-changing solutions designed for underserved transportation drivers. At MWC Shanghai, STMicroelectronics and KaiOS will showcase a solution designed for informal transportation drivers. Utilizing the ST54L chip, this innovative solution combines an NFC controller with an integrated secure element (SE) IC to transform a simple “KaiOS-equipped smart feature phone” into a powerful tool for informal drivers, enabling the KaiOS “smart feature phone” to provide secure contactless ticketing, replacing cash transactions with contactless ones.

Air Quality Monitoring based on FlightSense: Measuring air quality has become crucial due to its direct impact on human health and the environment. A growing body of scientific evidence indicates that the air within homes and other buildings can be more seriously polluted than outdoor air. Most existing AQI stations are designed for outdoor and professional use; however, environmental analysis is now possible in consumer devices. At MWC Shanghai, visitors will have the exclusive opportunity to see the innovative personal mobile environmental monitor in action. ST and Mobile Physics will present a solution for air quality and smoke detection with ST’s VL53L8 direct Time-of-Flight sensor. The comprehensive system includes the VL53L8 hardware, along with tailored firmware and software, plus pioneering air quality algorithms developed by Mobile Physics. The VL53L8 is capable of measuring PM2.5 concentrations within 10% or 10µg/m³ of the reference sensor. Designed for seamless integration, this system is ideal for mobile phones, personal electronics, and a wide array of IoT products.

Bluetooth Connectivity & Low Power MCU:

ST will demonstrate two Bluetooth LE Audio solutions based on the recently announced STM32WBA55 microcontroller. Visitors are invited to put on headphones to personally experience the listening effects in unicast and broadcast scenarios. Harnessing the cutting-edge wireless STM32WBA5 series, ST has now integrated support for the newly finalized Bluetooth LE Audio specifications, achieving certification that unlocks the potential for groundbreaking products. These innovations promise to enrich audio experiences with superior listening, hearing, and sharing capabilities. Among these, the innovative Bluetooth LE Audio Auracast feature stands out, offering a transformative approach to audio broadcasting and sharing, and heralding a new era of auditory communication.

To display its expansive portfolio of solutions across different sectors at MWC Shanghai, ST will also showcase its advanced wireless charging and wireless power-transfer solutions. Highlights include the high-efficiency, compact 100W laptop wireless charger, boasting WPC Qi 1.3 compliance with a security profile, capable of supporting up to a 100W output using ST’s proprietary protocol (STSC). Additionally, ST offers an up to 300W wireless power transfer discrete solution designed for industrial applications with fast load transient response, wider spatial freedom, better thermal dissipation, and a user experience comparable to that of a wired power supply.

ST is proud to present the ST4SIM-300, its first eSIM compliant with the GSMA’s eSIM specification for IoT. The ST4SIM-300 unlocks new possibilities, including over-the-air profile swaps, and is supported by a streamlined ecosystem.  This design is well-suited for compact devices without a user interface. By integrating the ST4SIM-300 into their designs, IoT developers can now ensure the best connectivity anywhere, at any time.

At MWC Shanghai, ST will also showcase a solution that propels consumer products into the realm of high-end applications. With 6-axis architecture, the LSM6DSV32X Inertial Measurement Unit (IMU) is capable of superior edge processing, making it ideal for applications such as advanced 3D mapping on phones, contextual awareness in laptops and tablets, precise gesture recognition in AR and VR headsets, and always-on tracking in wearables.

Learn more about ST at MWC Shanghai 2024 and explore the power of connectivity together with us: https://www.st.com/content/st_com/en/events/mwc-shanghai-2024.html

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The Reserve Bank of India’s (RBI) annual report highlights India’s potential to become a global semiconductor and electronics manufacturing hub, driven by recent government initiatives. Key highlights include:

1. Government Initiatives and Budget Allocation:

• The interim Union Budget 2024-25 allocates ₹6,903 crore for semiconductor and display fabs.
• Investments under the production-linked incentive (PLI) scheme are expected to gain momentum.

2. Economic Growth and Employment:

• These investments are anticipated to create new employment opportunities, improve labor incomes, and strengthen domestic demand.
• Real GDP growth for 2024-25 is projected at 7.0%.

3. Research and Innovation Boost:

• The passage of ‘The Anusandhan National Research Foundation Bill, 2023’ will establish the Anusandhan National Research Foundation (NRF) to enhance research and innovation in basic science, healthcare, and humanities.

4. National Quantum Mission (NQM):

• Approved at a total cost of around ₹6,000 crore from 2023-24 to 2030-31, the NQM aims to scale up scientific and industrial R&D in quantum technology.
• This mission aligns with national priorities like Digital India, Make in India, Skill India, Stand-up India, Start-up India, Self-reliant India, and the Sustainable Development Goals (SDGs).

5. Infrastructure and Digital Technologies:

• Government-led investments in infrastructure and the increasing adoption of digital technologies are expected to boost productivity and potential growth in the medium term.

These initiatives are poised to strengthen India’s position in the global semiconductor and electronics manufacturing sectors, fostering significant economic growth and technological advancement.

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OMC has introduced the H19 fibre optic shield, designed for the Arduino Uno, to facilitate the integration of optical fibre datalinks into microprocessor-based designs. This shield combines a transmitter, receiver, necessary drivers, and digital output, simplifying the receiver circuit by eliminating the need for a pin diode amplifier and Schmitt trigger circuits.

William Heath, OMC’s Commercial Director, highlighted the reliability and security of fibre optic datalinks, emphasizing their noise-free, interference-proof, and electrically isolated nature. The shield is stackable, featuring jumpers for both transmitter and receiver devices. It includes an example program to demonstrate data transmission over the optical fibre link using UART ports. Data can be monitored via the Arduino software’s serial monitor or interfaced with a standard 16×2 LCD shield stacked on top of the fibre shield.

The shield supports various microprocessor baud rates from 300 to 115200, with the optical fibre emitter and receiver capable of operating up to 5Mbd. It works with PMMA cables up to 25 meters in standard configuration, with high-power emitters and glass fibre options for extended range or specific applications. OMC offers customizable transmitter and receiver parts for integration into customers’ designs, including different cable lengths and fibre/jacket types.

This new product showcases the potential of incorporating fibre optic links into digital systems, providing a reliable and straightforward solution for secure data transmission.

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Extensions are the company’s first steps in a longer-term plan to expand its portfolio and better serve developers working within the VS Code ecosystem

Leveraging the versatility of Microsoft Visual Studio Code (VS Code), Microchip Technology has released an early access version of MPLAB Extensions for VS Code. This launch provides embedded designers with tools to import projects from MPLAB X Integrated Development Environment (IDE) to VS Code while still accessing Microchip’s debugging and programming support. This initiative is part of Microchip’s long-term strategy to expand its offerings and serve developers working within the VS Code ecosystem.

MPLAB X IDE is an expandable, highly configurable software program that incorporates powerful tools to help developers discover, configure, develop, debug and qualify embedded designs for most Microchip microcontrollers and digital signal controllers. The VS Code extensions merge the capabilities of MPLAB X IDE with the flexibility of VS Code to create a more seamless and efficient development environment for both new and existing customers. These products are being released under an early access program to provide the essential tools to customers quickly, while the Microchip development team continues to refine the extensions based on user feedback.

“At Microchip, we are dedicated to meeting developers in their environment of choice. VS Code is an extremely popular tool, and the recent MPLAB Extensions enable developers to continue working in the IDE they are most familiar with, while taking full advantage of Microchip’s complete device support and toolset,” said Rodger Richey, vice president of development systems and academic programs at Microchip. “This fusion offers an optimal blend of familiarity and functionality, providing an easy path for developers to integrate our resources and components.”

During this early access release, the MPLAB Extensions for VS Code include capabilities such as MPLAB X IDE project import and the ability to compile, program and perform basic debugging with any supported Microchip device. Additionally, MPLAB Data Visualizer can be utilized inside VS Code through an extension, offering users the opportunity to see what’s happening on the device at run time.

Future updates will bring MPLAB Code Configurator into VS Code to help set up preconfigured projects. Development has also started on a VS Code extension for the MPLAB Machine Learning Development Suite and an additional MPLAB Extension for AI code-generative assistance to review and improve code from inside the IDE.

The introduction of MPLAB Extensions for VS Code signifies a new phase of accessibility and flexibility for developers using Microchip tools. This launch represents the first instance of the MPLAB IDE software being available outside the MPLAB development ecosystem, but it is just the beginning of Microchip’s broader integration with the VS Code community. The current features are designed to meet the immediate needs of developers, with the intention to continue refining the toolset and introducing new extensions with added functionality in the future.

To learn more about Microchip’s ecosystem of development tools and software, visit https://www.microchip.com/en-us/tools-resources.

MPLAB Extensions for VS Code are available for free; some advanced features may require a subscription license. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: https://www.flickr.com/photos/microchiptechnology/53785645044/sizes/l/
• Videos available through YouTube or editorial contact (feel free to post):
  https://www.youtube.com/playlist?list=PLtQdQmNK_0DRncMlBVPL2JTDJnOpDdSWi

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• Test automation solution quickly analyzes field logs and replicates complex 5G field issues in the lab as a test script
• Solution enables Samsung Semiconductor India to significantly reduce the time it takes to replicate field scenarios in the lab and increase time spent on improving end user quality of experience

Keysight Technologies, Inc. (NYSE: KEYS) announces that Samsung Semiconductor India Research (SSIR) has selected the Keysight Signaling Field-To-Lab (S-FTL) solution to streamline and automate its 5G field-to-lab workflow in its Bengaluru lab. The comprehensive, end-to-end 5G wireless protocol signaling solution improves end-user quality of experience (QoE) by accelerating the replication, analysis, and resolution of 5G field issues in a test lab environment.

As 5G continues to be deployed, the focus has shifted to ensuring users receive the highest QoE by rapidly resolving issues reported from the field. A significant challenge is replicating complicated field scenarios in a lab environment to identify possible solutions. This involves the complex, time-consuming process of analyzing field logs, which are often missing data or contain errors, in order to replicate the issues. To solve this challenge, mobile operators, device makers, and chip manufacturers need an efficient and reliable solution that can quickly translate device field logs into precisely replicated protocol sequences in the lab.

To assist its global customer base, SSIR sought an intelligent test automation solution that could replicate field issues in its Bengaluru test lab. In addition, SSIR was looking for a solution allowing its engineers to focus on addressing field issues rather than analyzing logs or creating test cases. SSIR chose the Keysight S-FTL solution because it enables automated test case creation from device field logs. Based on the 5G Protocol R&D Toolset, this solution automates the process by analyzing field logs for 5G / 4G and IMS, making protocol-based adjustments to ensure protocol compliant behavior, and then replicating the field scenario as a test script. The S-FTL solution features an open input log template that accommodates various formats to enable faster adoption into the workflow.

By using the Keysight S-FTL solution, SSIR has significantly reduced the time it takes to replicate field scenarios in the lab and increased the time its engineers spend on improving end-user QoE. The solution has helped resolve a wide range of issues from real-world scenarios such as voice / data calls, handovers, 5G to 4G mobility, and carrier aggregation for deployments ranging from single SIM, dual SIM, and dual connectivity.

Balajee Sowrirajan, Corporate EVP & MD, SSIR, said: “Our partnership with Keysight has leveraged each of our strengths to recreate real-world field scenarios in a lab environment. This collaboration has accelerated resolution of communication and connectivity issues for our wireless modem customers. With a comprehensive set of tools and techniques for testing, the S-FTL solution enables our engineers to identify and resolve communication issues more accurately. This has also helped to significantly save validation costs and turnaround time. In a nutshell, it has ensured reliability and cost effectiveness, the two most critical components in today’s rapidly evolving telecommunications landscape.”

Cao Peng, Vice President and General Manager for Keysight’s Wireless Test Group, said: “We are pleased to support SSIR’s strategic goals in the current 5G technology phase of network rollout and field integration testing. Keysight’s automated software-based chipset and device test solutions for replicating field issues are designed to help improve efficiency of the process. Keysight is committed to delivering test solutions that help accelerate the commercial introduction of 5G devices and networks to 5G leaders such as SSIR.”

• 5G Signaling Field to Lab Solution
• Signaling Field to Lab Demo Video
• S8701A Protocol R&D Toolset

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Trans-Atlantic Collaboration Starts with Focus on Enabling Next-Gen
Magnetic Memory Devices at the 300mm Wafer Scale

NY CREATES and CEA-Leti today announced their strategic partnership that will initially focus on the research and co-development of magnetic memory devices, which are used to store computer data. These devices would be produced at the 300mm wafer scale, the industry-standard platform upon which computer chips are produced. The announcement was made during the annual Leti Innovation Days in Grenoble.

Officials from the New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), based in Albany, N.Y., USA, and CEA-Leti, based in Grenoble, France, established this joint development agreement to build upon each other’s strengths in the areas related to memory device R&D. CEA-Leti will contribute its expertise in magnetics, spintronics, and the testing of related devices, and NY CREATES will provide the facilities, process integration expertise, and materials process development to run the 300mm silicon hardware.

“By expanding our partnership with CEA-Leti and applying their recognized expertise in device physics and architectures, NY CREATES looks forward to jointly developing innovative technologies for computing. While we are known for our world-class Albany NanoTech Complex with experts in R&D focus areas ranging from advanced logic technologies to heterogeneous integration and more, this initiative’s focus on novel memory is an area in which we can break barriers together,” said NY CREATES President Dave Anderson. “A first objective of this collaboration will be to develop novel magnetic memory architectures and integration. This international partnership will help to address present-day memory needs as computing power continues to progress, and we anticipate a fruitful collaboration.”

“This collaboration will allow CEA-Leti to expand its capability to validate innovative concepts in synergy with the various facilities we have in Grenoble,” said CEA-Leti CEO Sébastien Dauvé. “We strongly believe that our collaboration will be a key enabler for both NY CREATES and CEA-Leti to be much more efficient in the lab-to-fab transition and to better impact our respective local ecosystems with more mature innovations.”

More specifically, the first joint research effort seeks to demonstrate two novel forms of memory devices: Spin Orbit Torque (SOT) Magnetoresistive Random Access Memory (MRAM), and Spin Transfer Torque (STT) MRAM. While both forms of MRAM manipulate different materials’ magnetization to store data, STT MRAM offers non-volatile memory with almost no power leakage; SOT MRAM is considered faster and more efficient.

Leaders of both R&D organizations expect the two-year collaboration to leverage NY CREATES’ 300mm wafer R&D ecosystem centered at its Albany NanoTech Complex, the most advanced non-profit semiconductor R&D facility in North America. CEA-Leti will provide its world-class engineering services and know-how to produce working memory elements on 300mm wafers.

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The unique medium-pressure design ejects the poppet and cap to provide a larger opening for gas to escape during an emergency situation, boosting safety and reducing the risk of damage to other battery packs. It’s so efficient, it can reduce the number of vents required on a battery pack by up to 90%.

Donaldson has extended its range of battery venting systems with the Dual-Stage Jet, a brand-new design that takes electric vehicle (EV) safety to a whole new level by offering the industry’s fastest degassing capabilities, while streamlining the installation process for OEMs. Launched this week at The Battery Show in Stuttgart, Germany, Dual-Stage Jet has been purposely designed to meet the increased demands of today’s more complex and powerful batteries – from providing enhanced pressure equalisation and ingress protection under normal operating conditions to allowing gases to escape at rates of approximately 100 lit/sec @ 100 mbar when necessary.

“Customers were telling us that they needed even higher degassing rates than what was available on the market, so the Donaldson Vehicle Electrification Development engineering team came up with a unique, creative design where the poppet and cap can be jettisoned to instantly produce a much larger opening for gas to escape and help mitigate thermal runaway,” explains Shane Campbell, Product Manager for Vehicle Electrification at Donaldson. “The pressure then rapidly decreases inside the pack, greatly reducing the risk of damage to additional cells and giving occupants extra time to escape from the vehicle.”

Dual-Stage Jet is available in two distinct configurations – screw-in/bolt-on or quarter-turn bayonet fittings. Agricultural and other heavy-duty vehicle manufacturers are likely to favour the former, which can offer more flexibility for use in bulkier battery packs, while the lighter bayonet fittings will be of greater appeal to the automotive sector and provide clear haptic feedback of proper installation.

The new vent is now available for vehicle manufacturers, with the possibility for them to work on further customising the design to their precise needs in partnership with Donaldson’s own application engineers. “Our customers often have different thicknesses of aluminium for their battery pack housing, but it’s easy for us to make an almost identical part that has a small change in the leg length when required,” says Matt Goode, Engineering Manager – Vehicle Electrification Development, Donaldson.

“The option of multiple attachment methods is important to our customers, who want something that integrates really easily with their existing pack, and with application engineers all over the globe, we’re located near the OEM wherever they may be. I think our customers find it refreshing that we take the time to understand their true needs and then find the best solution for them, rather than an ‘off-the-shelf take it or leave it’ type of approach.

“Another major benefit is that these high-performance vents can reduce the number required on a battery pack by 50-90%,” continues Matt. “As well as reducing product cost, this also leads to significant time and money savings in the assembly, ordering and stock-keeping processes.”

At 58mm in diameter, and containing approximately 20% recycled plastic, the vent also delivers a simple solution to the occasionally tricky problem of performing a leak test on a product expressly designed to provide effective ventilation. Temporarily sealing the vent using the supplied leak-check cap is all that is required for manufacturers to carry out tests themselves.

Using Donaldson’s proprietary Tetratex expanded polytetrafluoroethylene (ePTFE) membranes for enhanced protection from contaminants, the Dual-Stage Jet enables consistent pressure equalisation with a minimum airflow of 97 lit/hr @ 10 mbar during normal operation. Manufactured in-house, the hydrophobic membrane is comprised of small, randomly connected fibrils that create a permeable water barrier, providing continuous pressure equalisation, while offering IP67, IP68 and IP69K ingress protection against water, dirt, and other contaminants. The membrane’s unique oleophobic treatment also helps the filter media repel oils, providing additional protection.

By ensuring that damp air, which could otherwise accumulate inside the battery housing, is expelled, the effective ventilation provided by the new vent thereby helps to prevent potential internal condensation issues reducing the lifespan of enclosures and batteries alike.

“Quality and reliability are top of our customers’ agenda, and our new vent really fits the bill,” concludes Shane. “Dual-Stage Jet is a fantastic addition to our portfolio; one that enables us to serve more of the global EV market by providing another best-in-class product while offering our customers even greater choice to match their specific applications. Our Dual-Stage Burst design is still available, with a high opening pressure [25 lit/sec @ 300 mbar] while Dual-Stage Jet occupies the medium-pressure section of our portfolio – facilitating industry-leading degassing airflow through a design that’s never been seen until now.”

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In the rapidly evolving landscape of electric vehicles (EVs), the shift towards 800V power system architectures is gaining serious momentum. Our white paper “HIL Simulation’s Crucial Role in the 800V EV Transition” explores the reasons behind the move to 800V, the varied challenges this move presents to test professionals, and the pivotal role hardware-in-the-loop (HIL) simulation is playing in the transition from 400V to 800V architectures. In addition, we detail how to efficiently create a HIL test platform and outline a detailed migration path for testing 800V architectures.

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Cadence Janus NoC enables design teams to achieve better PPA faster and with lower risk, freeing up valuable engineering resources for SoC differentiation

Cadence Design Systems, Inc. today expanded its system IP portfolio with the addition of the Cadence Janus Network-on-Chip (NoC). As larger, more complex SoCs and disaggregated multi-chip systems proliferate to accommodate today’s escalating compute demands, data delivery within and between silicon components has become increasingly challenging—impacting power, performance and area (PPA). The Cadence Janus NoC manages these simultaneous high-speed communications efficiently with minimal latency, enabling customers to achieve their PPA targets faster and with lower risk.

“Cadence is an established leader in IP and design quality, and we continue to invest in our foundational interface and processor IP, system IP, software and design services capabilities to enable our customers to develop differentiated and disaggregated designs,” said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. “The addition of the Cadence Janus NoC to our growing system IP portfolio is a key milestone in this strategy. Our evolution from an IP provider to an SoC design partner delivers greater value to our customers, empowering them to focus valuable engineering resources on differentiating their silicon.”

The Cadence Janus NoC leverages Cadence’s legacy of trusted and time-proven Tensilica RTL generation tools. Customers can utilize Cadence’s extensive portfolio of software and hardware for simulation and emulation of their NoC and gain deep insights into its performance using Cadence’s System Performance Analysis tool (SPA). By enabling architectural exploration, this flow results in the best NoC design to meet product needs. The NoC leverages Cadence’s well-established leadership in IP and quality, backed by industry-leading customer satisfaction for technical support.

The Cadence Janus NoC mitigates the routing congestion and timing issues associated with today’s complex SoC interconnects, which often don’t become apparent until physical implementation. Addressing the most pressing needs today, Cadence’s first-generation NoC provides a platform for future innovations, such as support for industry-standard memory and I/O coherence protocols. Current features and benefits include:

• Easy to use: Cadence’s powerful, state-of-the-art GUI enables easy NoC configuration ranging from small subsystems to full SoCs and future multi-chip systems.
• Accelerated time to market: PPA-optimized RTL enables SoC designers to achieve their bandwidth and latency goals. Packetized messages enable higher utilization of wires, reducing wire count and timing closure challenges.
• Lower risk: The NoC’s built-in power management, clock domain crossing and width matching reduce design complexity.
• Quick turnaround: Cadence’s extensive simulation and emulation capabilities enable early architectural exploration, allowing quick validation of PPA results to ensure the configuration meets design requirements.
• Scalable architecture: Customers can design a subsystem and reuse it in a full SoC context of the NoC, allowing future reuse in a multi-chip system.
• Flexible: The NoC is compatible with any IP with an industry-standard interface, including AXI4 and AHB.

“We are pleased that Cadence is expanding its IP portfolio by investing in system-level solutions,” said Suk Lee, VP and GM, Ecosystem Technology Office at Intel Foundry. “As a NoC is vital for almost any subsystem in today’s SoCs, we support Cadence’s initiatives in developing their NoC and look forward to them continuing to expand their IP offering going forward.”

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Arm Cortex-M23: Extremely Low Power Consumption, Combined with Surprisingly Fast Performance

In an era where energy efficiency is paramount, Nuvoton Technology is proud to announce the launch of its new Arm Cortex-M23 M2L31 microcontroller series. Designed to meet the growing demand for sustainable high-performance embedded computing power, the M2L31 series stands out for its low power consumption and efficiency, with its running speed of up to 72MHz still providing great processing capability.

Nuvoton’s NuMicro M2L31 microcontroller, with an Arm Cortex-M23 core and various configurations featuring 64 to 512 Kbytes of ReRAM (Resistive Random-Access Memory) and 40 to 168 Kbytes of SRAM, is a low-power product designed for sustainability and energy efficiency. The M2L31 series supports two CAN FD and two USB Type-C PD 3.0 ports and prioritizes robust security features to safeguard valuable data.

The NuMicro M2L31 series is a game-changer for applications such as battery management, industrial automation, and consumer peripheral devices, where energy efficiency is necessary. Remarkable low-power capability significantly enhances battery life, reducing the need for frequent battery replacement.

Developers will appreciate the M2L31’s three low-power modes: normal shutdown, standby shutdown, and deep shutdown. These modes are tailored to minimize energy consumption based on application needs, with targeted power reduction that avoids compromising functionality. The microcontroller’s typical operating current is impressively low at 60μA/MHz in normal mode but then drops to a mere 0.5μA in deep shutdown mode. Its ability to independently handle peripheral data acquisition and process data through low-power serial interfaces without CPU intervention sets a new standard for power-efficient automation.

The M2L31 series leaps ahead of old-style MCUs, integrating ReRAM (Resistive Random Access Memory), based on process technology developed in collaboration with TSMC. This new non-volatile memory format accelerates write operations by avoiding the time-consuming ‘erase before write’ process of traditional flash memory and offers lower energy consumption and better durability than flash memory.

Previously, ReRAM was mainly used in the DRAM or NAND flash memory market. With the launch of Nuvoton Technology’s next-generation M2L31 microcontroller, developers in the industrial and consumer sectors can also enjoy the many benefits of ReRAM.

Catering to diverse design requirements and reducing platform size and cost, the M2L31 series supports a comprehensive set of I/O and peripherals, including UART, I²C, SPI/I²S, and multiple USB options, along with support for up to 16 channels of capacitive touch. Multiple chip packaging choices ensure compatibility with other Nuvoton products and meet most application demands.

Nuvoton Technology is committed to supporting developers with a robust ecosystem, including the M2L31 NuMaker evaluation board and Nu-Link debugger. The M2L31 series is compatible with various IDEs, such as Keil MDK, IAR EWARM, and NuEclipse IDE with the GNU GCC compiler. It also supports multiple program update methods like ISP and IAP, simplifying system upgrades and software updates and maximizing flexibility and availability for developers and users.

For more details of Nuvoton’s M2L31 series, please see: https://www.nuvoton.com/products/microcontrollers/arm-cortex-m23-mcus/m2l31-series

There’s also a short introductory video of Nuvoton’s M2L31 series at: https://www.youtube.com/watch?v=1NCstio8T7I

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On June 19, Hyundai Mobis declared that the pilot implementation of an acoustic AI-based inspection system at its Changwon plant had been completed lately which produces EPS.

Acoustic AI depicts a new generation of artificial intelligence technology, different from generative AI, which depends on language for Q&A tasks. It is relatively untested in the manufacturing industry. The key trait of acoustic AI is developing algorithms that provide meaning to specific sounds and facilitate appropriate judgments.

Hyundai Mobis plans to expand the acoustic AI inspection system beyond the Changwon plant to other component production lines, focusing initially on parts such as braking systems that naturally produce noise during operation.

Choi Nak-Hyun, Vice-President and Head of Digital Transformation at Hyundai Mobis, emphasized that this initiative sets a pioneering standard for process innovation not only within the automotive sector but also across the global manufacturing industry. He affirmed Hyundai Mobis’ commitment to introducing unique AI-driven technologies for production, research and development, and enhancements in workplace environments.

While generative AI stresses on the versatility for general users, acoustic AI is designed for industrial applications, especially smart factories. Generative AI offers a significant advantage in swiftly handling large volumes of tasks. The Changwon plant can recognise defective products at a rate of one unit per second.

The Changwon plant, located in South Korea, produces around 1.3 million units of EPS annually. The production process consists 23 stages, from component assembly to vibration and noise inspection.

Significant quality checks have become necessary due to the direct influence of EPS on steering performance and safety through steering performance. Noise inspections are taking place by connecting actual power to the EPS. The sound generated by the rotating motor constructs a consistent waveform, which the AI analyzes to identify deviations or anomalies.

For a year, Hyundai Mobis engaged in extensive collaboration with on-site engineers, production technology experts, and AI specialists holding advanced degrees to gather and analyze data. This collaborative effort led to the successful development of Acoustic AI, which can now effectively differentiate defective products and identify their underlying causes.

Hyundai Mobis aims to enhance the application of acoustic AI. In the manufacturing sector, the company aims to consistently gather meaningful data using its groundbreaking Acoustic AI and build proprietary AI models from this data, with anticipated further improvements in accuracy for this trained AI.

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Enables secure asset tracking and data handling from billions of devices in smart homes, factories, and cities

STMicroelectronics has introduced the ST4SIM-300, the first embedded SIM in the industry to meet the incoming GSMA standard for eSIM IoT deployment. Also known as SGP.32, the new standard introduces special features to facilitate managing IoT devices connected to cellular networks.

“Leveraging the incoming GSMA specification, our embedded SIM for IoT solution, ST4SIM-300, enhances flexibility, eases network provider switching, and simplifies managing large numbers of connected devices,” said Agostino Vanore, Edge Authentication and M2M Cellular Marketing Manager at STMicroelectronics. “In a more connected and secured world, it will enable seamlessly track assets across the globe, connect smart devices to the cloud, and securely handle data from billions of devices, supporting our healthcare and smart infrastructures, cities, factories, and homes.”

Unlike existing eSIM machine-to-machine (M2M) and eSIM Consumer specifications, eSIM for IoT (SGP.32) is created for the needs of today’s IoT deployments. ST’s ST4SIM-300 supports features including greater automation of remote SIM provisioning (RSP), easily managing SIM profiles for large fleets of devices, and remote switching between network providers that eliminates physical SIM card swaps. The new eSIM conforms to the latest 5G standard and facilitates deploying devices that have a limited user interface and deploying low-power wide-area network (LPWAN) devices.

ST is sampling ST4SIM-300 eSIMs in various form factors, including wafer-level chip-scale packages (WLCSP) suitable for smart meters, GPS trackers, asset monitors, remote sensors, medical wearables, and similar devices.

Built with an EAL6+ certified ST secure microcontroller, the ST4SIM-300 is architected for security from the ground up. Compatible with GSMA IoT SAFE applet the eSIM facilitates adding secure element features for end-to-end communication and supports scalable security by design for creators of IoT devices.

Pricing information and sample requests are available at local ST sales offices.

Please visit https://www.st.com/st4sim-300 for more information.

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Trumpf, a Germany-based Industrial equipment supplier has been in the race for innovation since its inception. The company has launched a laser process for recycling electric vehicle (EV) batteries. This new technology would enable car makers and battery manufacturers to reuse valuable raw materials and comply with the EU’s recycling quotas. The company said this will be the first time when used or defective batteries from EVs can be recycled on an industrial scale.

The Battery Show Europe 2024 commenced in which the laser systems were displayed this week to safely cut used batteries and extract valuable raw materials from the battery foil.

Hagen Zimer, CEO of laser technology at Trumpf, commented, “Recycling batteries is environmentally beneficial and now economically viable, thanks to advancements in laser technology. Trumpf has gained significant expertise in laser welding and cutting for manufacturing e-car batteries through extensive partnerships with top car and battery makers.”

The recycling of EV batteries heavily relies on expensive and sometimes raw materials such as cobalt, lithium and nickel which are unsustainable. The heavy reliance turns recycling into a crucial and significant process. As per the EU mandate, the recycling rate cannot be less than 90%.

Alexander Sauer, Head of the Fraunhofer Institute for Manufacturing Engineering and Automation IPA, stressed the necessity of large-scale recycling. Europe will need to recycle 570,000 tons of battery material annually by 2030. Sauer emphasized the necessity for large-scale recycling within the industry, highlighting the substantial potential of the emerging market for laser processes in battery recycling.

Trumpf says laser processes will aid in extracting the valuable coatings from foil strips used in battery cells, enabling manufacturers to reclaim and reuse the materials. This method would also prevent large amounts of coated foil from being dumped as waste.

Moreover, Trumpf’s laser technology facilitates efficient and automated disassembly of battery packs, enabling the removal of covers, cutting of cables, and thereby aiding in the sorting of raw materials and separation of reusable

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