ELE Times

Both the scientific and relevant industrial sectors have felt the need for devices that can help understand the characteristics of smart fluids. To address this demand, scientists from IIT Patna prepared Nano iron powder-based MR fluids and developed a hybrid magneto-rheometer. This device can trace the rheological (flow and deformation) and tribological behaviour (friction and wear) of the MR fluid in the non-conventional compression and shear mode both with and without a magnetic field, using the custom-designed rheometer.

The newly designed innovative hybrid magneto-rheometer offers a novel way to characterize the performance of smart fluids that are useful for medicine, aerospace, the defense sector and automation. These fluids increase in viscosity when subjected to a magnetic field. MR fluids are “smart” materials that rapidly change their mechanical properties when exposed to a magnetic field, increasing in apparent viscosity, to the point of becoming a viscoelastic solid.  The fluid can transmit force which can be controlled with an electromagnet, giving rise to many possible control-based applications.

​​This unique capability makes them ideal for adaptive technologies such as brakes, clutches, shock absorbers, vibration control systems, dampers, actuators, and medical devices. The increasing need to accurately understand how these fluids behave under actual operating conditions has remained a significant challenge. Particularly, the compression plus shear mode is the least understood of the MR fluid’s operation modes, limiting the potential of its practical applications.

This initiative is led by Prof Chiranjit Sarkar, with support from the Nano and Advanced Materials division of the Department of Science and Technology (DST). The team fabricated a rheometer that can measure both the rheological and tribological properties of an MR fluid under compression and shear modes of operation at different normal loads, both with and without a magnetic field.

In the hybrid rheometer, the scientists generated a constant, high-magnitude magnetic field throughout the MR sample region using a smaller current. They conducted experiments in compression plus shear mode (mixed mode) for iron-based MR fluid. This development demonstrates how advances in testing technology can drive innovation in smart materials, providing researchers and industry with the tools needed to engineer high-performance MR fluids for future generations of adaptive and energy-efficient technologies.

The comprehensive testing capability of the prototype they developed provided a better understanding​ MR fluid performance than conventional characterization methods. Such hybrid Rheometers can help understand the viscoelastic properties of materials that are indispensable in sectors such as polymers, pharmaceuticals, food processing, cosmetics, and petrochemicals.

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​Given the growth in Advanced Driver Assistance Systems (ADAS) and Autonomous Drive (AD), highly accurate motion sensing has become more important to vehicles than it’s ever been. Today’s car utilizes an array of cameras, LiDAR, radars, and inertial sensors to estimate the car’s orientation and location and enable real-time decisions for navigating without human assistance.

A central challenge, however, still exists, and that is to maintain accurate location tracking and motion estimation when experiencing loss of GNSS, operating in tunnels or harsh weather conditions, or when individual sensors suffer interference or occultation. To solve this challenge, Murata Manufacturing Co., Ltd. developed a high-accuracy 6 Degrees of Freedom (6DoF) IMU, tailored for direct mounting inside the AD or ADAS ECU.

The new IMU contains a high-accuracy three-axis accelerometer and three-axis gyroscope packaged in a small format suitable for in-vehicle operation, which allows it to precisely measure vehicular accelerations, angular velocities, and motions. Incorporating six motion axes within this IMU unit provides a self-contained source of real-time vehicular dynamics data that ADAS and autonomy ECUs can use directly.

Traditional motion sensors can be difficult to integrate with the ECU in other cars as there’s a certain level of pre-configuration required, or external processing must take place. Because it is designed for ECU incorporation, Murata’s newest IMU allows for fewer parts in vehicle electronics design, fewer design development challenges, and allows OEMs to bring enhanced driver assistance features to market faster.

This release reflects the broader shift across the automotive industry toward software-defined vehicles (SDVs), using high performance computing and central domain controller hardware instead of a proliferation of distributed ECUs. In the context of such architectures, high-fidelity inertial sensing​g becomes a critical component of vehicle perception, localization, and control loops, a demand which will intensify further as automotive automation deepens.

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​As China’s increased presence in the Indian Ocean and upgrades to regional submarine forces transform the global maritime security environment, India is moving urgently to reinforce underwater warfare, following a trajectory similar to the United States. While China’s Indian Ocean presence-and by extension, the world-class status of submarines deployed by regional navies-is transforming the waterscape of the world’s second most populous continent, India has accelerated plans to finalise one of its historically largest defence procurements: a nearly Rs 90,000-crore Project-75(I) deal with Germany for new submarines, aimed at reinforcing the nation’s submarine fleet at all costs and strengthening its burgeoning indigenous industry.

According to German Ambassador to India Philipp Ackermann, Germany and India are looking to sign an agreement next month. Project-75(I) program, which involves the development of the six conventional futuristic generation submarines for the Indian Navy through an India–German collaboration between MDL and TKMS, will amount to over Rs 90,000 crores, nearly eight billion​ dollars. The submarines will be developed based on the Strategic Partnership model in India.

The Project-75(I) is seen as one of the most critical naval modernisation projects undertaken by India. The submarines are envisioned to be built based on German-designed Type-214 submarines with futuristic features, including an advanced Stealth design, state-of-the-art Combat management systems, longer operating range, and Air- Independent Propulsion (AIP) technology. While a normal diesel-electric submarine needs to resurface regularly to charge the batteries, the equipped AIP allows the submarines to stay underwater longer, thus evading reconnaissance in deep waters, especially during the combat role.

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Ather Energy CEO and Co-founder Tarun Mehta has confirmed that the company will launch its first mass-market electric scooter, built on its all-new EL platform, at Ather Community Day on 29 August in Bengaluru.

Sharing the announcement on X, Mehta said the new scooter is the culmination of years of investment in the core technologies and architectures that define a great electric scooter.

“We have been patiently investing in the building blocks of what makes a good scooter for years now,” Mehta wrote. “A decade in, EV two-wheelers are ready to now move beyond the early adopter stage. The tech is ready for everybody, the features are becoming relevant for all. Not early adopters, but truly mainstream.”

According to Mehta, this transition marks a new phase for the electric two-wheeler industry, where EVs need to deliver across every dimension that matters to mainstream customers. He highlighted expectations ranging from strong resale value and faster servicing to ride comfort on challenging roads, seamless charging experiences, visible safety features, and software driven intelligence that enhances everyday ownership.

The upcoming scooter will be the first production model built on Ather’s EL platform, the company’s next-generation scooter architecture unveiled at Ather Community Day 2025. Designed to underpin a new family of products, the platform represents Ather’s next phase of innovation and growth as it expands into a more accessible segment of the electric scooter market.

The launch is expected to mark an important milestone for Ather as it broadens its portfolio beyond the 450 and Rizta range and positions itself for the next wave of EV adoption in India.

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The first indigenous 350-kg power-level single-use turbojet engine was successfully designed and built by DRDO’s GTRE (Gas Turbine Research Establishment), with production support from the Hyderabad-based private company Azad Engineering. This marks a major achievement in Defence Self-Reliance, a path followed by a select group of nations.

Expendable turbojet engines are designed to be launched once in battle against enemy targets, unlike jet fighter engine technology. They will form an engine “package” for the next generation of air-to-surface long-range missiles, military drones with longer flight ranges, smart and roaming bombs (weapons), and other highly accurate attack systems, says Defence Industry Daily.

The success of this engine also signals India’s developing skills in advanced materials, high-accuracy engineering and aerospace systems. Defence sources feel that its entry into military service would significantly enhance our ability to replace imports of advanced engine systems and further promote self-reliance on our indigenous military network.

In an era where wars are slowly transforming into a battlefield of self-operating technology and long-distance smart warfare, a home-made engine for such a platform becomes crucial. With this, India boosts its technological capabilities and supports the nation’s drive towards ‘Aatmanirbhar Bharat” for defence production. As further tests and weapon system integration proceed, the indigenous turbojet engine may become the foundation for India’s next-generation missiles and military drones.

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As geopolitical stakes rise and warfare evolves to include long-range precision attacks, high-altitude deployment and rapid troop deployment capabilities, countries face enormous pressure to modernise their defence capabilities. The task before India is not just limited to creating high end missile programmes, but also demonstrating round the year operationally ready systems in adverse conditions as well as establishing a robust indigenous defence industrial ecosystem. In the past couple of weeks-a Notice to Air Missions (NOTAM) of a missile test from long range, developed for extreme weather conditions and a rally in defence stocks-all signal accelerated efforts by India towards becoming defence self-reliant.

India has released an extensive NOTAM over the Indian Ocean along a 2,530 km route for the purpose of launching a strategic long-range missile test on August 6-7, 2026. Though India has not confirmed which missile, defence analysts say the vast No Fly zone is meant for an upcoming launch of a long-range, strategic nuclear weapon capability from the ITR off the coast of Odisha. NOTAMs like this were published routinely whenever, a missile is test-fired from India so that the entire air and maritime, shipping routes are shut down during missile tests for safe conduct.

Defence specialists observe that long-term operational capabilities and preparedness of armed forces in the future would no longer rest on solely state-of-the-art missile technology; to be operationally fit and effective in a contemporary environment, armed forces would need secure logistics and supply chains, custom-made fuels, flexible and resilient industrial production capabilities, and steady innovation. Current trajectory indicates that India is aiming for​ a combination of the above, to realise its dream of becoming a technologically modern and a self-reliant defence power to address the current and future security requirements of India, and the Indian region.

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India’s air defence strengthened with the successful first flight test of DRDO’s ‘Project Kusha’. India has completed another key defence success. India’s homegrown Project Kusha missile had previously made some progress, but it was first fully tested in August 2023 for its ability to stop high-speed air targets, which enables successful missile launch and defeat of all kinds of air threats.

India will soon have its own air defence shield- an offensive system designed to cut dependence on imported defence systems such as the Russian S-400 in the future.  Project Kusha, an advanced system equipped with radar, a command-and-control unit, and defence missiles, is designed to find, follow and attack enemy aircraft, cruise missiles and their long- range air targets, strengthening India’s multiple-layer air defence. With this development, India is expected to respond to new security threats faster and gain an advantage by using local defence weapon​ systems.

Beyond defence, a boost to indigenous manufacturing, also known as Project Kusha it would boost new technology in radar systems, missile navigation systems and defence electronics, creating new opportunities for India’s defence manufacturing firms. Because of the importance of missile defence in modern warfare, the successful demonstration of the system means more than just testing. It shows increased confidence in India’s ability​ to indigenously design and deliver state-of-the-art defence equipment for its future security needs.​​

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India Electronics Development Fund (EDF) strengthened the country’s deep-tech ecosystem with an accumulated investment of Rs 1,335.77 crore (approx. $139.23 million) supporting 128 start-ups and tech enterprises. This milestone further demonstrates the government’s commitment to developing Indian capabilities in innovation across electronics, semiconductors, nanoelectronics, and IT. This development reiterates their aim to foster an indigenous self-reliant ecosystem that can eventually enable the creation of a globally competitive technology economy leveraging high innovation, leading edge technology, high-quality human talent to create differentiated technology solutions.​

The Electronics Development Fund (EDF) set up by the Ministry of Electronics and Information Technology (MeitY) in February 2016 is an Umbrella-Fund of Funds concept. In this model, the EDF invests into other professionally managed venture capital and angel investment funds, called “Daughter Funds.” These Daughter Funds invest into the high- growth potential start ups that build future technologies. As of September 30, 2025, a sum of 257.77 crore of direct equity in eight Daughter Funds by EDF and additional 1,335.77 crore capital invested by Daughter Funds in total of 128 start-ups/ ventures were catalysed in India.

The electronics development fund manages eight SEBI regulated Daughter Funds like Unicorn India Ventures Trust, Aaruha Technology Fund-I, Endiya Seed Co-creation Fund, Karsemven Fund, pi Ventures Fund I, YourNest India VC Fund II, Ventureast Proactive Fund-II and Exfinity Technology Fund Series II. The daughter venture funds pick out startups that can use cutting edge technologies and have high commercial viability.

Having invested in 128 start-ups spanning various frontier technologies, the Electronics Development Fund has become a significant lever for nurturing deep-tech innovation in the country. Over the coming years, the programme will play an even larger role in scaling the nation’s electronics ecosystem, create high-skill, high-value jobs, and advance India’s vision to lead the world in areas like electronics design, semiconductor technologies, and next generation digital innovations.

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India is stepping up investments in key EV technologies. The South Asian country is speeding up its investments in key electric vehicle (EV) technologies while planning to boost a self-dependent and globally relevant EV manufacturing ecosystem. Driven by various central government initiatives, state government programs, and private sector investments, India attracted commitments for around US$25.6 billion worth of investments across battery manufacturing, advanced battery chemistries, powertrains, charging infrastructure, and technologies for battery and electric powertrains. These investments will help scale up domestic manufacturing and reduce dependence on imported components.

The Government of India launched multiple schemes to boost domestic manufacturing of the Electric Vehicles (EV) ecosystem through production-linked Incentive (PLI) Schemes for Advanced Chemistry Cell (ACC) and battery storage, as well as the PM E-Drive program to promote charging. The PM E-Drive program aims to promote charging for automobiles and auto components. Along with manufacturers both domestically and overseas, these schemes lead to localization of EVs’ key technologies.

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High-voltage batteries for e-mobility have become highly complex systems consisting of numerous components. The market for these batteries is becoming increasingly dynamic, and technologies are constantly evolving: innovative battery cells with new chemical compositions are being introduced. Automotive suppliers and manufacturers therefore require a tailored and flexible testing strategy for battery cell quality assurance, both in development and in production. Only in this way can suppliers compete in the market with more powerful batteries, higher levels of automation, and optimized workflows.

To address these challenges, GÖPEL electronic has developed a high-performance and quickly configurable battery cell tester that features a modular design and high flexibility. This allows for the quick and transparent determination of quality, charging efficiency, and reliability in up to five battery cells simultaneously. The tester complements the product portfolio, which includes, among other things, GÖPEL electronic’s EOL battery test system, which performs comprehensive test routines for the entire battery pack.

The new battery cell tester covers standard safety tests that evaluate the condition of the cells: The OCV (Open Circuit Voltage) value indicates the voltage of a battery without a load (open circuit) and serves as an indicator of its state of charge. For the ACIR (Alternating Current Internal Resistance) measurement, the tester uses a test method to determine the internal resistance of the battery cells. This internal resistance under alternating current provides information about the performance, state of aging, and quality of the battery cell.

The main advantage of the new, smaller tester from GÖPEL electronic lies in its fast and reproducible test results: By interfacing with automated equipment, highly efficient batch testing can be performed in a matter of seconds. This is ideal, for example, for incoming inspection or cell grouping.

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Ather Energy has started rolling out Pothole+ Alerts for customers with Gen 2 and above scooters, including the Ather 450 Apex, 450X and Rizta Z. The feature leverages data generated by Ather’s connected scooter fleet to warn riders about potholes, broken road sections, uneven surfaces and speed breakers ahead while navigating. It also goes a step further, suggesting the smoothest route before a ride begins, beyond just the fastest one.

Announcing the rollout on X, Ather Co-founder and CEO Tarun Mehta said the feature had been nearly nine years in the making. “The challenge was never the idea. It was the data,” Mehta wrote. He explained that building the feature required a large connected fleet travelling the same roads over time, allowing Ather to generate the scale of fleet intelligence needed to accurately identify road conditions.

Every Ather scooter comes equipped with onboard compute and connectivity, enabling the company to continuously gather real-world riding data and deliver new capabilities through over-the-air software updates. According to Mehta, Pothole+ Alerts represents one of the first large-scale applications of this connected ecosystem, transforming millions of kilometres of ride data into a feature that benefits riders every day.

Integrated into the scooter’s navigation experience, Pothole+ Alerts provides advance notifications for potholes, broken road sections, uneven surfaces and speed breakers. Alerts are displayed on the dashboard and can also be delivered through the scooter’s speakers, the Ather Halo smart helmet or any compatible Bluetooth headset.

The rollout reflects Ather’s continued focus on building connected features powered by real-world riding data. Mehta added that Pothole+ Alerts is just the beginning, with the company planning to build more rider experiences on top of its growing road intelligence dataset.

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Ather Energy has begun rolling out Pothole+ Alerts to customers with Gen 2 and above scooters, including the Ather 450 Apex, 450X and Rizta Z. The feature alerts riders to potholes, broken road patches, uneven roads and speed breakers ahead while navigating, using road intelligence built from data generated by Ather’s connected scooter fleet.

Announcing the rollout on X, Ather Co-founder and CEO Tarun Mehta said the feature has been nearly nine years in the making. “The challenge was never the idea. It was the data,” Mehta wrote, noting that Ather’s growing connected fleet has now generated the scale of road intelligence needed to make the feature a reality.

Every Ather scooter is equipped with onboard compute and connectivity, enabling the company to build large datasets over time and develop software-driven features for its customers. According to Mehta, Pothole+ Alerts is one of the strongest examples of how Ather is leveraging connected vehicle data to enhance the riding experience.

When using navigation, riders will receive alerts for potholes, broken road sections, uneven surfaces and speed breakers ahead. Notifications are displayed on the scooter dashboard and can also be heard through the scooter, the Ather Halo smart helmet or any compatible Bluetooth headset, allowing riders to stay informed without taking their attention off the road.

The rollout reflects Ather’s continued focus on building connected features powered by real-world riding data. Mehta added that Pothole+ Alerts is just the beginning, with the company planning to build more rider experiences on top of its growing road intelligence dataset.

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Tessolve, a leading global provider of semiconductor system and silicon solutions for next-generation products, today announced that they have collaborated with Intel Foundry to support package designs with Embedded Multi-die Interconnect Bridge (EMIB), an advanced packaging technology essential for heterogeneous integrated multi-chip(let) architectures.

This collaboration enables Tessolve to support Intel Foundry customers globally. Tessolve has collaborated with Intel Foundry, supporting package design and completing a project end-to-end which includes package design and simulations. This allowed Tessolve to not only gain knowledge of the technology but also helped accelerate the qualification process.

“Over the past two decades, Tessolve has grown into a trusted engineering partner for many of the world’s leading semiconductor companies.”, said Srini Chinamilli, Co-Founder & CEO, Tessolve. “Intel Foundry’s EMIB, combined with our end-to-end capabilities across the semiconductor value chain, allows us to further expand our offerings for Intel Foundry customers.”

“Tessolve has already built deep capabilities over the past two decades, from chip architecture, design, test development and embedded systems”, said Vic Vadi, VP – Ecosystem, Foundry Services, Intel Corporation. “With this collaboration for enablement on our EMIB, we aim to combine Tessolve’s expertise with our advanced package design and test technology to provide our customers with end-to-end solutions to swiftly navigate the complexities of modern electronics design.”

EMIB is an advanced die-to-die connectivity technology developed by Intel and helps achieve low pitch bump with High Bandwidth Memory (HBM) integration and Universal Chiplet Interconnect Express (UCIe) interface compatibility. To meet the performance demands of next-gen semiconductor applications, open standards like UCIe help define interconnect protocols for chiplets. The collaboration aims to reduce development costs, mitigate risk, and accelerate innovation in semiconductor design.

As a leading engineering services player in the US$550 billion semiconductor market, Tessolve has made significant investments to build 11 semiconductor test and embedded labs across the globe to help enable a comprehensive solution offering to its clients. The company in September 2025 secured $150 million in funding from TPG, towards strengthening its global delivery centers, expanding advanced test labs and accelerating strategic acquisitions to consolidate its position as a key enabler to the global and Indian semiconductor ecosystem.

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For decades, the job of a camera or sensor was quite simple. A camera captured an image and a sensor measured distance, sending both pieces of information to a computer, which then studied it. Machines could record the information but didn’t truly understand it.

And this is about to change. Today, sensors are much more intelligent: Sensors have already begun to evolve from merely collecting data into an important part of the machinery’s intelligence. AI, edge AI, 3D sensing, computer vision, and Time-of-Flight (ToF) give machines a complete understanding of their environment, allowing them to react almost immediately. This is leading us into a new age of machines’ understanding of what we see. Machines are slowly learning to ‘see’, not just capture an image of what we see.

Think about a robot rolling around a busy warehouse, but instead of sticking to a set plan, it’s aware of an object in its way, how far off it is, and is able to change its direction. Imagine an intelligent office that knows someone is coming through the room without building a very detailed image of their face. Now imagine a factory environment where a machine has sensors and cameras that can see what’s in its environment and is capable of making a split decision to act. Smart sensing- now that’s a game-changing feature!

“Moving from AI in the cloud to AI in the physical world. A whole new category of smart sensors and other devices enables machines to notice, understand, and communicate with the physical world around them.” – Alexandre Balmefrezol, EVP, Imaging Sub-group, STMicroelectronics.

Old cameras are designed to take pictures of humans. Capture colourful images, improve image quality, and produce clearer videos. However, new cameras are designed for machines and AI, rather than for human beings.

STMicroelectronics’ camera sensors are geared more towards computer vision and AI than just transmitting pixels, according to its June 2026 imaging roadmap. The company touts low-power sensing, always-on sensing, high-quality identification, and tight integration into AI. This strategy places the sensors in industrial applications such as robots and automation, smart buildings, medical equipment, wearable devices, and smart glasses.

It is an important change. A camera operated by humans is programmed to show a perfect photograph. However, the job of a camera developed for a computing machine differs. It will be employed to allow a machine to detect movement of a body or object, perceive the environment, sense an object, or identify that something has changed in an image. In other words, the eye has moved up and become a part of the machine’s brain.

According to an ST presentation from June 2026, the company has delivered more than 3 billion Time-of-Flight (ToF) sensors and is now making use of its specialised knowledge in sensing to pursue next-generation technologies. Its approach relies on sensing-, processing-, and system-level technologies, enabling it to deliver products for use in robots, smart buildings, and industrial automation. STMicroelectronics has been developing two major families of technology in this field: The Flight Sense portfolio and the Bright Sense portfolio.

Flight Sense: Time-of-Flight sensing that helps devices with distance and depth. Bright Sense: Image sensor, focusing on computer vision, AI, and low-power use cases. This is powerful because more often than not a machine needs to know that you are showing it a photograph, rather than something just in front of it, that it needs to understand where in this image a photograph lies and indeed, which photograph you are in.

As an example, a factory robot might rely on a camera to recognize a box, but a combined depth sensor provides an even better understanding of how far away that box is. Using these combined technologies allows the robot to build a richer picture of its environment.

Bright Sense: For the Bright Sense product family, its technology and performance have been further enhanced. The pixel size has gone up from the conventional 3.2 microns to 2.6, 2.43, and even to the current 2.2 microns. ​With further technology development, especially 3D stacking technology, we can further reduce chip size, particularly at the module level and achieve greater performance leaps.

The most exciting part mentioned in the new release material is likely the VL53L9 3D direct Time-of-Flight LiDAR module. The device can deliver detailed information about distance across 54 individual zones of detection, down to a distance of 9 metres and up to 100 frames per second (fps). Furthermore, the technology includes on-chip processing and supports low-power microcontrollers, suitable for use in small form-factor Edge AI applications.

So why is this important? Because robots and smart machines need to be able to sense the world. The VL53L9 offers infrared and depth sensing. The camera can use low-resolution Time of Flight (ToF) to provide meaningful data to an AI with some privacy considerations in place. This will also function in bright light and total darkness, and it may be able to see very thin items and close blind spots.

This could be helpful in the areas of robotics, factories, smart buildings, and security systems. It is also​ in development for use in AR and VR headsets, drones, healthcare, and smart farming, among other uses. At ST’s demonstration of the tech, it connected the VL53L9 with an STM32H5 microcontroller for checking safe areas, processing at 30 frames per second and requiring very small system memory. That’s big news for tiny gadgets. The less computing power you can use, the smaller you can make your device, the more efficiently you can power it, and the longer the battery life.

Another major trend that comes together with intelligent sensors is Edge AI. Traditionally, a device may collect lots of data and send the information to the cloud for analysis. This method may take too much time and waste more network resources. The introduction of edge AI makes a change by performing the analysis closer to the sensor or device. Machines make the decision quicker.

ST’s new imaging material shows the transition towards sensors enabling on-board AI processing, intelligent features in devices closer to the edge, and the new family roadmap including designs that capture and process images at a sensor level to decrease overall system size, power, and computing needs. To an average user, this may not seem like a great improvement on a small piece of technology. However, to robots it could be the difference between going over obstacles and ploughing through them.

There are other exciting things happening too, such as always-on sensors. One of the issues with using AI that runs all the time is the drain on power resources—especially on the limited resources of battery-powered devices like wearables, smart glasses, and easy-to-carry machines. ST’s new sensing design features ultralow power consumption and an auto-wake-up ability. With the sensor able to enter its ultra​-low-power mode, the system waits until something interesting happens to turn on the main system.

An auto-wake-up scene change detection mode drawing just about 1mW was demonstrated in the June 2026 presentations. It’s like a security guard that isn’t alert at all times, but that immediately jolts awake when something’s off. Perhaps the battery can last longer if it still gives the fastest response on devices. Applications can range anywhere from smart glasses, home devices, medicine applications, and security systems to barcode scanning.

There’s no field that’s arguably receiving a bigger benefit from the sensing revolution than robotics. A robot needs good perception, or else it’s almost as good as any other robot out there that is just strong and fast, but also blind to what is going on around. It won’t be safe to run those robots in an unknown environment with just brute force.

ST demonstration image sensors enable “eyes” for machines such as robots in the industrial or humanoid world, robot packaging, logistics, and even for flying robots. ST also emphasizes computer vision to enable machines to make sense of their surroundings.

Now here is where the really fun stuff happens. “The robots of the future will increasingly look like our own visual system, sensing and reacting to their environment,” says Calkins. “They won’t necessarily just be executing the same program over and over again; their eyes will give them understanding and allow them to react to unexpected events.”

Robots could spot a human being on the move in a warehouse. A factory robot may identify an item in front of it. A drone can have a better sense of its environment. If humanoid robots have vision and depth capability, they could interact with the physical world. The more accurately machines can perceive their environment, the more “intelligent” they can behave.

Another massive advantage that comes with smart depth sensing is privacy. Not all applications require a high-res image of a human face; in some applications, the system needs to determine whether somebody is present, if they have fallen, or how many people there are.

The new VL53L9 material demonstrates low-resolution Time-of-Flight (ToF) sensing with privacy awareness. The system can obtain helpful depth and motion data while still being less personal on visual information than an actual camera. This could be particularly useful in hospitals, offices, and in the smart home, as well as retail surroundings.

For example, a fall detection system for elder care might not need to identify a person’s face. This could bring intelligent sensing not just closer to home, but to personal spaces too.

The technology we are being treated to in the newest ST report indicates an imaging future much broader than just pretty pictures. The attention turns to machine vision, AI, depth sensing, low-power computing and real-time perception. The company’s portfolio includes the new low-power and 5-megapixel Bright Sense sensors targeting edge AI, wearables and industrial automation. Its Flight Sense technology delivers 3D sensing to the edge for a number of uses ranging from robots to smart buildings.

It’s part of a much larger technology trend. AI isn’t confined to your computer screen anymore; it’s becoming a physical part of the physical world around us. In robotics, drones, smart machines, vehicles, or the large number of interconnected gadgets and gizmos out there, it’s important for something to know the difference between the road and your living room before they do something smart (or frankly, dangerous). And that’s why intelligent sensors are becoming so valuable. The biggest revolution of all might be that machines can at last see. And this is where the real revolution is- they are starting to understand what it is that they see.

As the power of Edge AI grows and sensors are becoming smaller, smarter, and more energy efficient, the devices around us may soon have the capability to detect the changes around them, understand them, and react to them in the right way. Perhaps the future of AI won’t involve only smarter software. It would also depend on providing machines with appropriate vision, appropriate senses, and the ability to understand the world around them.

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Keysight Technologies, Inc. today announced certification of its RFPro electromagnetic (EM) design software, part of the Keysight EDA Advanced Design System (ADS), for Intel 14A and Intel 18A-P process technologies. The certification gives radio frequency integrated circuit (RFIC) and mixed-signal designers confidence that their electromagnetic simulations accurately reflect Intel Foundry’s latest manufacturing processes before chips move to production.

As semiconductor manufacturers introduce increasingly advanced process technologies, design teams face growing pressure to shorten development cycles while avoiding costly design errors. Certified simulation software enables engineers to identify and resolve performance issues before manufacturing begins, helping reduce development risk, avoid expensive chip redesigns and accelerate time to market.

A mismatch between EM and circuit behavior that surfaces only after tape-out means an expensive re-spin, so simulation tools must be validated on a node before design work begins. Keysight’s certification gives teams that path as Intel Foundry delivers on its roadmap from Intel 18A into 18A-P and Intel 14A, which introduces RibbonFET 2 and PowerDirect, its new transistor and power delivery architectures.

This certification builds on Keysight’s ongoing collaboration with Intel Foundry, including support for Intel 18A and EMIB-T advanced packaging technology. Together, these capabilities provide customers with consistent design flows across multiple Intel process generations, supporting applications ranging from AI and high-performance computing to mobile devices.

Shawn Han, Senior Vice President and General Manager, Foundry Services, Intel Corporation, said: “As our customers look to address next-generation demands through differentiated solutions, Intel Foundry believes predictable execution on our advanced process and packaging technologies will accelerate their innovation,” “By collaborating closely with ecosystem partners such as Keysight to certify world-class solutions, we are providing our customers with greater confidence they can achieve their power, performance and efficiency goals and get to market more quickly.”

Niels Faché, Senior Vice President, Keysight Design Engineering Software, said: “Design teams can’t wait for a new process node to mature before they trust their simulation results. This certification means engineers can adopt Intel Foundry’s newest technologies early and get the silicon right the first time.”

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EDOM Technology, Asia’s best solutions provider, today announced an expanded collaboration with NVIDIA to help enterprises accelerate Edge AI adoption by integrating the NVIDIA Edge AI platform, open-source models, and system optimization technologies. The collaboration enables organizations to lower the barriers to deploying large AI models while reducing overall deployment costs.

As generative AI rapidly evolves from proof-of-concept to real-world applications, enterprise priorities are shifting. Rather than simply pursuing larger AI models, organizations are increasingly focused on running AI reliably on existing hardware platforms, accelerating deployment, and maximizing return on investment. Across industries from smart manufacturing and autonomous robotics to healthcare, Edge AI has become a key driver of digital transformation where efficient deployment is critical to successfully bringing AI projects into production.

The way enterprises adopt AI is also changing. Instead of building models from scratch, organizations are increasingly leveraging mature foundation models and open-source AI ecosystems to accelerate development, followed by application specific optimization and deployment. However, as AI models continue to grow in capability, several deployment challenges such as memory capacity, inference performance, and system integration have become major hurdles.

EDOM addresses these challenges by combining the NVIDIA Jetson platform with NVIDIA JetPack, NVIDIA CUDA, NVIDIA TensorRT, NVIDIA Jetson AI Lab, and leading open-source AI models and inference frameworks. The company delivers a comprehensive portfolio of services spanning platform selection, model integration, model quantization, memory optimization, and system validation. This end-to-end approach enables enterprises to maximize hardware resource utilization, reduce deployment costs, and shorten the journey from proof of concept (PoC) to production.

A notable example is NVIDIA Reachy Mini Jetson Assistant, which demonstrates how Headless Mode, NVIDIA Cosmos-Reason2 open VLMs, model quantization, and optimized inference frameworks enable multimodal AI workloads—including vison- language reasoning, Speech-to-Text (STT), and Text-to-Speech (TTS)—to run simultaneously on the NVIDIA Jetson Orin Nano 8GB platform. This showcases how software and system optimization can efficiently execute multiple AI models and reduce memory footprint on resource-constrained edge devices. Similar architectures are increasingly being adopted across smart manufacturing, autonomous robotics, and healthcare applications, supporting use cases such as production line inspection, intelligent vision systems, voice-enabled interaction, and autonomous decision-making. By performing AI inference directly on edge devices, organizations can achieve low-latency performance while enhancing data security and operational efficiency.

“Generative AI has entered the stage of real-world deployment,” said Jeffrey Yu, CEO of EDOM Technology. “Today, the biggest challenge for enterprises is no longer finding AI models; it’s successfully deploying AI into products and operational environments. The success of an AI project depends not only on hardware performance, but also on deployment efficiency, system integration capabilities, and overall return on investment. EDOM’s role extends beyond supplying platforms and components. We help customers integrate NVIDIA technologies, open-source AI models, and system optimization strategies to accelerate time-to-market, reduce deployment risks, and enable AI to deliver measurable business value.”

Backed by years of expertise in Edge AI and embedded system integration, EDOM provides end-to-end solutions encompassing selections powered by NVIDIA technologies, open-source AI models integration and application optimization, hardware design, and system deployment. The company has successfully enabled Edge AI applications across smart manufacturing, autonomous robotics, healthcare, smart retail, and smart city initiatives. Looking ahead, EDOM will continue collaborating with NVIDIA and the open-source AI community to help enterprises overcome the challenges of deploying large AI models, accelerate the transition from proof of concept to large-scale deployment, and transform AI innovation into tangible value across the industry value chain.

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​Uttar Pradesh has emerged as India’s leading electronics manufacturing hub, producing nearly 65% of the country’s mobile phones. Driven by strong investments, industry-friendly government policies, and the rapid expansion of manufacturing facilities, the state has become a major centre for electronics manufacturing and mobile phone production.

Since 2014, UP has been a hotspot for electronic manufacturers, including domestic and international ones to invest particularly in the Noida-Greater Noida-Yamuna Expressway corridor. Global big manufacturing smartphones, as also their component suppliers, have built huge manufacturing units in the area and put up a complete electronics manufacturing value chain. The state government says it accounts for roughly 65% of all mobile phones being manufactured in the country and is India’s biggest base for smartphone production.

Multiple efforts by both central and state governments have assisted the growth of the electronics sector in the state of Uttar Pradesh. At the national level, policies like the Production Linked Incentive (PLI) Scheme for large electronics manufacturing incentives; the setting up and scaling of production capacities in India, whereas the electronics manufacturing policy issued by the state offers supplemental incentives, enhanced infrastructure, and business ease reforms.

The proactive actions of the Uttar Pradesh government to streamline approvals, build an efficien​t logistics infrastructure, boost investor confidence, and encourage (foreign direct investment) FDI have positioned the state as a prominent investment destination for the global electronics sector.

While these efforts should result in significant acceleration of manufacturing and investment in UP, the state has a lot of work ahead of itself in achieving sustained future growth. Increasing domestic value addition; further ramping up production of semiconductors and components; creating an ecosystem of highly skilled personnel; and upgrading research and development to enhance in-house R&D is crucial for a long-term plan. To stay competitive globally, UP will also need to make priority investments, to ensure availability of dependable power supply, a world-class logistics system, and highly advanced manufacturing technologies.

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​Global sales for semiconductor manufacturing equipment are expected to set another all-time record by 2028, hitting $229.5 billion. This is due to continued spending in artificial intelligence, leading-edge logic, advanced memory, high bandwidth memory (HBM), testing and advanced packaging. The findings are according to the latest forecasts from SEMI in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective.

SEMI expects global semiconductor manufacturing equipment sales to rise 23.2% to $165.9 billion in 2026 and continue growing through 2028, marking five consecutive years of growth. The market is entering a new growth cycle, driven mainly by AI- related investment in semiconductor manufacturing and capital spending.

​​Demand for advanced logic chips and High Bandwidth Memory (HBM) is increasing as the use of AI and HBM-based technologies expands. These applications require increasingly advanced manufacturing processes and more complex chip designs.

According to market analysis, wafer fabrication equipment (WFE) is expected to remain the largest segment of the semiconductor equipment market. It includes machines used for wafer processing, mask and reticle production, and other front-end wafer fabrication processes.

SEMI’s Semiconductor Capital Equipment Market forecast expects equipment suppliers’ annual revenues to approach $100 billion by 2028. The forecast points to a longer period of capital investment as the industry works to address capacity constraints, supply shortages, supply-chain disruptions, and rising demand.

Growth will be driven mainly by artificial intelligence (AI), along with increasing investment in foundry and logic, DRAM, NAND, testing, and packaging. SEMI also highlights the important role of equipment manufacturers in expanding production capacity and developing technologies for future computing systems.

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Caliber Interconnects demonstrated its renewed focus on semiconductors and technology innovation at the IEEE International Test Conference (ITC) India 2026 through a host of technically rich sessions including a keynote presentation, tutorial, IEEE paper presentations, poster sessions, industry display showcase and panel discussions. The keynote titled ‘From Silicon Complexity to AI Revolution – India’s Silicon Leap 2047′ was delivered by Senthilkumar Dhamodharan, Vice President – Testing, Caliber Interconnects. The keynote, presented on ‘From Silicon Complexity to AI Revolution – India’s Silicon Leap 2047′, by Senthilkumar Dhamodharan, Vice President – Testing, Caliber Interconnects elucidated India’s ascension to global semiconductor status and the influence of AI on next-generation chip technologies.

The keynote examined the transformative role of Artificial Intelligence in reshaping the global semiconductor industry amid increasing silicon complexity, heterogeneous integration and advanced packaging technologies. It outlined how AI is revolutionizing every stage of the semiconductor lifecycle—from intelligent chip design automation and predictive manufacturing to AI-driven Automated Test Equipment (ATE), digital twins and advanced signal integrity analysis—helping improve product quality, accelerate time-to-market and enhance manufacturing efficiency. As Global demand accelerates semiconductors have become the foundation of digital economies, powering applications ranging from AI and autonomous systems to telecommunications, healthcare and defence.

The presentation also highlighted India’s growing strategic importance in the global semiconductor value chain. Drawing on the momentum created by the India Semiconductor Mission, emerging fabrication and advanced packaging initiatives, and the country’s globally recognised semiconductor design talent, the keynote presented a compelling roadmap for India’s evolution into a global hub for semiconductor design, manufacturing, testing and innovation.

Emphasising the vision of Viksit Bharat 2047, the address called upon industry leaders, researchers, policymakers, academia and the IEEE community to strengthen collaboration, develop indigenous test engineering capabilities, embrace AI-enabled validation methodologies and build a resilient, globally competitive semiconductor ecosystem.

Beyond the keynote, Caliber demonstrated its technical leadership by presenting one tutorial, four IEEE technical papers, four poster presentations, participating in an Industry Showcase and contributing to a high-level panel discussion. The company’s presentations focused on emerging challenges and innovations in AI- driven semiconductor testing, Design for-Test (DFT), Automatic Test Pattern Generation (ATPG), MBIST/LBIST, silicon debug, reliability testing, advanced-node devices, chiplets and AI accelerators.

IEEE ITC India 2026 served as an important platform for fostering industry-academia collaboration, promoting AI and machine learning applications in semiconductor test automation, yield improvement and test cost optimisation, while encouraging knowledge exchange among professionals, researchers and students.

Caliber’s exhibition booth attracted visitors, including semiconductor industry professionals, researchers, academicians and IEEE Fellows. The booth welcomed representatives from leading global technology companies including Texas Instruments, AMD, Qualcomm, Synopsys, NVIDIA, Broadcom, Marvell, SanDisk, Google, Siemens, Infineon, Teradyne, Advantest and Tessolve, alongside faculty and researchers from premier institutions such as IIT Patna, IIIT Kottayam, VIT Vellore, the University of Stuttgart, PSG College of Technology and several other universities. The interactions generated meaningful technical discussions and opened new avenues for research collaboration and industry partnerships.

Commenting on the event, Senthilkumar Dhamodharan said, “The future of semiconductors will be shaped by the convergence of AI, advanced testing and collaborative innovation. India has a unique opportunity to lead this transformation by combining its design excellence with world-class manufacturing, testing capabilities and a strong innovation ecosystem. IEEE ITC India provides an excellent platform to collectively build this vision for Viksit Bharat 2047.”

Caliber Interconnect’s strong participation at IEEE ITC India 2026 reflects the company’s continued focus on driving innovation in semiconductor testing, advancing AI-enabled engineering solutions and contributing to India’s emergence as a trusted global semiconductor technology leader.

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Billion Electric Mobility (BillionE) has partnered with JK Cement to deploy 150 heavy-duty electric trucks across Karnataka, Maharashtra and Goa, making one of the region’s largest deployments of electric trucks for cement logistic. The collaboration began with an initial fleet of 20 electric trucks from JK Cement’s Muddapur plant in Karnataka, with the remaining vehicles planned to be introduced in phases. The partnership represents a significant step in the adoption of battery-electric vehicle for heavy duty transportation. The truck is expected to be deployed in phases by March 2027, according to reports.

This latest deployment by JK Cement is one of the largest deployments of electric trucks in the cement sector in India. The project will help the company gain practical experience in operating heavy-duty electric trucks on high-volume transport routes and in challenging conditions. It will also demonstrate the potential of electric trucks for B2B logistics and commercial freight operations.

The initial fleet will feature Montra Electric’s Rhino 5538, a 55-tonne electric truck. The model will be available in both tipper and tractor-trailer versions, with JK Cement initially deploying the tractor-trailer variant. The truck will be offered in a 4×2 configuration and powered by a 280-kW electric motor and a 282-kWh LFP battery pack. Depending on the variant and operating conditions, it is claimed to offer a range of 198 km or 169 km. The battery can be charged from 20% to 100% in approximately one hour.

The phased deployment by BillionE and JK Cement aims to show that electric trucks can support regular, real-world freight operations at scale, rather than being limited to small pilot projects. By combining high-capacity electric trucks, fast charging, and smart route planning, the project could provide a model for the logistics industry to move towards zero-emission freight transport.

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