ELE Times

Highly integrated chips support multiple wireless technologies and the latest security standards, perfectly addressing requirements for smart industrial, medical, and consumer devices

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed the next generation of its short-range wireless microcontrollers. These innovative, all-in-one components enable wearables and smart objects including smart home devices, health monitors, and smart appliances to become ever more miniaturized, easy to use, secure and affordable.

Short-range wireless technologies like Bluetooth LE, Zigbee and Thread (popular in smart meters and smart buildings) are the fabric connecting smart devices to home bridges, gateways, and controllers including smartphones. As we all seek solutions for making life more economical, sustainable, and comfortable, vendors are looking to bring creative and high-performing new solutions to market more quickly, within tight cost constraints. They need to be stylish, too: tiny, low-profile, or even embedded out of sight in other equipment, such as in smart bulbs. Going wireless is a part of this trend, for freedom, flexibility, and fashion.

Wireless microcontrollers like ST’s new STM32WBA5 product line allow a one-chip solution that’s extremely compact, reduces the bill of materials, and shortens the time to market by relieving wireless design challenges. Also, being compatible with the development tools and software packs of the STM32 microcontroller development ecosystem, the new line simplifies migrating existing products designed for wired connections.

The new series’ flagship STM32WBA55 microcontroller can communicate using multiple wireless standards concurrently, including low-energy Bluetooth LE 5.4, Zigbee, Thread, and Matter (Thread RCP). Matter border router is a perfect match with the STM32WBA5 for this new open-source connectivity standard for smart-home and IoT (Internet of Things) devices. In this way, the STM32WBA55 supports a great user experience while simplifying hardware and software engineers’ development journey, aiding affordability and time to market for the new product.

With this new generation, ST has also introduced support for the recently completed Bluetooth LE Audio specifications that enable exciting and innovative new products for richer listening and hearing experiences. These include the new Bluetooth Auracast feature, which opens the door to a new world of audio broadcasting applications.

“Lead customers are already appreciating the enhanced wireless performance, flexibility, and security of our latest STM32WBA wireless microcontrollers. They are creating diverse products including smart thermostats, tracking devices, smart chargers, headsets, power tools, and smart meters,” said Benoit Rodrigues, Wireless MCU Division General Manager, STMicroelectronics. “The extensive software ecosystem that provides communication stacks, microcontroller-specific software packs, sample code, and tools helps developers bring new products to market based on these MCUs quickly and efficiently.”

The STM32WBA series is the first wireless MCU in the market to achieve the important SESIP (Security Evaluation Standard for IoT Platforms) Level 3 security certification. With this, smart devices containing STM32WBA microcontrollers are ready to satisfy the US Cyber Trust Mark and EU Radio Equipment Directive (RED) regulations due to become mandatory in 2025.

“We work with smart asset tracking devices which are connected through Bluetooth to mobiles and through mobile apps to the cloud, enabling us to deliver complete asset tracking management for our customers. ST’s microcontrollers bring wireless connectivity to our multi-mode trackers,” said Olivier Hersent, CEO, Abeeway (Actility Group). “We have selected the new wireless connectivity product, STM32WBA5, for its enhanced performance with ultra-low power radio capabilities, which is key for our battery-powered devices. They ensure stable connectivity in the harsh industrial environment where we operate, combined with security that meets the highest industry standards.”

“We believe that gaming peripherals should be as unique and accessible as the gaming community itself,” said Tom Roberts, CTO, Performance Designed Products (PDP). “ST and PDP have worked together through several Video Game generations, and we have used STM8 and STM32 devices for many years. ST products consistently provide the features we need in our highly competitive market segment. We recently selected ST’s short-range wireless connectivity product, the STM32WBA5, based on the integrated MCU and Bluetooth low-energy technology, as the right solution for a new, groundbreaking game controller.  The STM32WBA offered us an ideal combination of performance, peripherals, cost efficiency and ecosystem support that enabled simple and fast development.”

Sample requests and pricing information are available from local ST sales offices. ST will introduce a ready-to-use module containing the STM32WBA, integrated with necessary external components including power-supply and antenna-balancing circuitry, in June 2024.

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Available with four frequency options each covering from 8 kHz to 12.75 GHz, 20 GHz, 31.8 GHz or 40 GHz, the new R&S SMB100B microwave signal generator from Rohde & Schwarz brings excellent output power, spectral purity, very low close-in phase noise, and practically no wideband noise to analog microwave signal generation.

The new R&S SMB100B analog microwave signal generator from Rohde & Schwarz offers outstanding, market-leading performance for analog signal generation up to 40 GHz in the midrange class. Thanks to its easy operation and comprehensive functionality, the versatile R&S SMB100B is now the first choice for all applications requiring clean analog signals or high output power from 8 kHz to 40 GHz. Typical applications include testing radar receivers, semiconductor components, upconverters, downconverters or amplifiers. Thehigh output power and low phase noise make it ideal as a source for simulating interferers for blocking tests.

The R&S SMB100B microwave signal generator features a signal purity which combines very low single sideband (SSB) phase noise, excellent non-harmonics suppression, and low wideband noise for all carrier frequencies. For users seeking even better close-in phase noise and frequency stability, and less temperature-based variation in performance, in addition to the standard OXCO reference oscillator, a higher performance version is available for all frequency ranges. In addition to the conventional 10 MHz reference frequency, users can choose optionally 1 MHz to 100 MHz as well as 1 GHz reference frequency signals. Optional high output power of measured 25 dBm at 20 GHz and 19.5 dBm at 40 GHz is activated by keycode, so users can install it at any time. Considering the microwave frequency range covered by the instrument, the R&S SMB100B microwave signal generator is light (10.7 kg) and compact, fitting in a 19” rack and only two rack units in height.

The level accuracy of the output directly from an R&S SMB100B itself is excellent. With each increase in the frequency of the required signal, the challenge of obtaining the correct level input to a device increases: The R&S SMB100B supports two additional features to compensate for path losses and variations in the signal caused by setups with additional test fixtures, cables or amplifiers. These features help to provide the wanted power level at the reference plane i.e. at the input of the device under test. One of them, the user correction function (UCOR), compensates if the frequency response of the setup is known and stable. However, there are still unknown factors especially if the setup includes additional active devices such as an amplifier. Then 1/2 the frequency response of the setup with an external additional amplifier can vary over level or temperature. Closed-loop power control can compensate for all these variations by continuously measuring the input level to the DUT i.e. at the wanted reference plane with a suitable R&S NRP power sensor feeding its measured level back to the generator to adjust the output power accordingly. More details about this use case can be found in the application note 1GP141.

The R&S SMB100B is user-friendly in every detail. Users can create their own customized menus, so that the parameters they most use are always available. They can generate code to automate measurements first made manually with the SCPI macro recorder while the measurements are set up and run, then use the code generator to export the instructions in languages such as MATLAB. Thanks to R&S Legacy Pro, the R&S SMB100B (and other Rohde & Schwarz test equipment) can be used to emulate other instruments such as R&S SMB100A or competitor instruments directly, as a drop-in replacement using the existing code.

The new R&S SMB100B microwave signal generator up to 40 GHz is now available from Rohde & Schwarz and expands the R&S SMB100B analog signal generator family with its established RF models up to 6 GHz.

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Having delivered 13% revenue growth in FY24, Tata Elxsi is among the world’s leading design and technology service providers across industries including Automotive, Broadcast, Communications, Healthcare, and Transportation. They mark high competence in servicing through design thinking and development in digital technologies like IoT, Cloud, Mobility, Virtual Reality, and AI.

Rashi Bajpai, Sub-Editor at ELE Times spoke with Jayaraj Rajapandian, Head of Avionics, Transportation, Tata Elxsi on various aspects of aerospace/ aviation – from what’s trending to what the future holds for the industry.

This is an excerpt from the interaction.

ELE Times: What are some of the latest trends in Aerospace electrification?

Jayaraj Rajapandian: The aerospace industry is rapidly evolving, with many innovations redefining the field. One of the latest advancements is in aerospace electrification. This is a major boost to meet the UN sustainable development goals set for the Aerospace industry. It involves implementing electric propulsion technologies such as electric motors and turbo-electric propulsion by using electric energy to power the aircraft fully or in hybrid mode.

The electrification of propulsion systems made Urban Air Mobility (UAM) vehicles a reality and it is a step closer to commercial operation. Smaller aircraft and drones provide decreased emissions, quieter operation, and improved efficiency. Electrical actuators drive fuel efficiency and are replacing the hydraulic-driven actuators.

Hybrid-electric propulsion systems combine traditional fuel-powered engines with electric propulsion systems. The larger aircraft adapts them to increase fuel efficiency and reduce emissions.

Sustainable Aviation Fuels (SAFs) can be used to reduce aviation’s environmental impact. However, the investment to scale the SAF production is to be monitored against aviation demands.

Electric Vertical Takeoff and Landing (eVTOL) vehicles enable vertical takeoff and landing, which reduces the dependency on infrastructure like a dedicated runway. Vertiport unlocks the potential for urban air mobility. These vehicles will be incorporated more for logistics and aerial combat vehicles.

Moreover, advancements in battery technologies are seeing exponential growth in fuel cells for storage, effective power conversion, and distribution, necessitating effective battery management solutions. Lithium polymer batteries enable long-endurance owing to their lower weight and higher power storage.

ELE Times: Give us some insights into the future innovations in Unmanned Air Systems.

Jayaraj Rajapandian: Unmanned Air Systems (UAS) have been incredibly useful in improving efficiency, reducing costs, reaching remote and inaccessible areas, improving defence systems, and, most importantly, enhancing safety. The primary focus is to improve autonomous navigation and control by incorporating cutting-edge technologies such as Artificial Intelligence (AI) and Machine Learning (ML) to operate effectively in complex environments and all-weather conditions and push the endurance for extended missions.

Currently, commercial usage of UAVs is being monitored by regulators, mainly when operating beyond the visual line of sight (BVLOS). However, advanced sensor and payload technologies such as LiDAR and thermal imaging systems could help improve the availability and reliability.

Unmanned Combat Systems consist of aerial, land, and underwater drones. Unmanned aerial vehicles are used to gather intelligence, conduct surveillance, and reconnaissance (ISR), and carry munitions. Governments worldwide recognize Unmanned Combat Systems as an asset comparable to manned fighter jets as they consume a significant portion of defence budgets. Researchers are exploring swarm intelligence to enable several drones to work together and operate collectively, ensuring the mission is never compromised, even if many UAVs are lost.

ELE Times: Elaborate on some of the latest technologies in avionics development for advanced navigation and control.

Jayaraj Rajapandian: In the past couple of decades, satellite-based navigation and communications systems have become more widespread, electronic systems have become more scalable, and higher redundancy has become more common in recent aircrafts. Fly-by-wire flight control systems have replaced mechanical controls with electronic interfaces, allowing for precise and adaptive control of aircraft flight surfaces. Using a single pane of glass in the cockpit flight decks turned the operation to be more seamless. However, by the mid-2030s, ICAO predicts that airspace will witness double the current traffic and the industry requires more than incremental innovation, a transformation is needed.

Currently, the focus is on bringing compact form factors and platforming the systems. Aerospace OEMs and technology partners are collaborating on this next journey. RISC-V-based processing units are gaining attention for their security features and custom-built capabilities that meet OEMs’ needs. The collaboration on Avionics such as FMS, used in different aircraft supplied by various vendors, to create a unified family of products signifies a strategic move towards standardization and interoperability in the aviation industry. This reduces inventory costs for OEMs and the training costs of airlines.

Innovations to counter deceived sensors to manage spoofing, anti-jamming and to distinguish friends from foes, and security in communications are gaining attention. A growing number of regional players are developing Avionics for UAVs, breaking the technology entry barrier. To stay competitive and relevant, defense OEMs require transformational effort to reduce cycle time which typically takes 5 to 7 years. Digital Twin, Investment in Big-Data processing with High Processing Computing capability can accelerate this cycle time.

Tata Elxsi’s advanced process flow can be used in the development of a cloud-based Digital Twin of a sub-system. The features developed from the Digital Twin are scalable and can be used for multiple systems simultaneously.

ELE Times: How can AI/ML be adopted for aerospace design and maintenance?

Jayaraj Rajapandian: With AI and ML capabilities, aerospace design and maintenance can improve efficiency, reduce downtime, and improve the health of systems. AI and ML can analyze extensive datasets from simulations, past designs, and real-world operations to pinpoint the most effective configurations for aircraft components, structures, and systems.

AI and ML tools also help to build virtual prototyping and testing of aircraft systems and components. It generates precise simulations using high-processing computers, anticipating performance traits, and fine-tuning design parameters. More importantly, AI and ML algorithms also help in predictive maintenance. These algorithms can analyze sensor data from aircraft systems and components to detect anomalies, predict failures, and schedule maintenance proactively. AI and ML tools also help in care for health monitoring systems and analysis of root causes. We will soon see certifications through simulations of numerous scenarios exercised on the system models.

Our solution accelerator for TEDAX- Tata Elxsi’s big data platform is being used to build system models and visualize the data. Tata Elxsi’s AI-based Video Analytics AIVA resolves complex scenarios in real-time.

ELE Times: How is Tata Elxsi enhancing aircraft production efficiency?

Jayaraj Rajapandian: The aerospace industry is picking up the pace in demand post-slowdown due to the COVID-19 pandemic. With the boost in demand, OEMs will need to enhance their production efficiency by tapping into advanced manufacturing technologies, adding cost-effective suppliers, and integrating product lifecycle management techniques. Technologies like 3D printing, robotics, digital twins, and automated assembly systems can enhance aircraft production.

Tata Elxsi designs and implements Industry 4.0 solutions, improving manufacturing performance. We are also working with OEMs in identifying suppliers to source raw materials, build-to-spec, and certify their products.

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NORD drive solutions for the process industry

From 10 to 14 June 2024, NORD will be presenting a wide range of products at ACHEMA in Frankfurt am Main. The focus is on ATEX-compliant drive concepts for the process industry and the robust heavy-duty MAXXDRIVE® industrial gear unit, in particular for agitator and mixer applications. Further focal points at the trade fair will be the new decentralised NORDAC ON/ON+ frequency inverters, the revolutionary DuoDrive geared motors and IE5+ synchronous motors as well as the NORDCON APP with NORDAC ACCES BT. Interested trade visitors can find out more about NORD’s wide range of solutions at the trade fair grounds in Frankfurt am Main in Hall 8.0, Stand B52.

Whether in the chemical, pharmaceutical or food industries: Companies that extract, transport or process raw materials require industry-specific, innovative drive solutions. As a system supplier, NORD offers matched drive systems consisting of gear unit, motor and drive electronics that are tailored to the respective requirements of the customer application.

ATEX drives for explosion-protected areas Flammable gases and dust in processing industries create serious safety risks. NORD has decades of experience with gas and dust explosion protection and offers particularly robust electric motors with powers from 0.12 to 200 kW especially for this field of use. The explosion-protected electric motors can be operated in category 2D or 3D dust atmospheres (zones 21 and 22) as well as in category 2G or 3G gas atmospheres (zones 1 and 2) and are approved according to ATEX and HazLoc. The dust-protected motors feature the ignition protection category “Protection by enclosure” (tD). Depending on the requirements, the motors in the gas explosion protection version are available in the following ignition protection classes: increased safety
(e), pressure-resistant encapsulation (d/de) and non-sparking design.

Industrial gear units for high torque applications NORD’s MAXXDRIVE® industrial gear units power heavy-duty applications such as agitators, mixers and grinders in food or cosmetic production. The parallel and right-angle gear units cover a speed ratio range from 5.54:1 to 400:1 – and with a first-stage gear unit, even up to 30,000:1. They feature:

• High output torques from 15 to 282 kNm for reliable operation even under extreme conditions
• Torsionally rigid, one-piece UNICASE housing for a longer bearing life and efficient power transmission
• Large low-friction roller bearings for extremely high radial and axial load capacities and a long service life
• High-precision axis alignment for guaranteed quiet running
For mixer and agitator applications, the industrial gear units can also be equipped with a SAFOMI-IEC
adapter:
• The adapter is available for parallel gear units and in sizes 7 to 11, i.e. for maximum output torques from 25
to 75 kNm.
• The adapter is compact and simple in design and has an integrated oil expansion volume; oil tanks and hoses as well as the radial shaft seal that is subject to leakage and wear between gear unit and IEC cylinder are therefore not required.

The NORDAC ON frequency inverters are part of the NORD modular system and can be optimally combined with the manufacturer’s motors.
• NORDAC ON was designed for applications with asynchronous motors,
• NORDAC ON+ was designed for the combination with highly efficient IE5+ synchronous motors.
The inverters are designed for power ranges from 0.37 to 3 kW.

The IE5+ motor generation from NORD DRIVESYSTEMS guarantees the highest level of efficiency and operational reliability, thanks to IE5+ technology. The motors are available as a TENV smooth-surface motor, as a TEFC motor with cooling fins and as an integrated DuoDrive motor. The latter combines a highefficiency IE5+ motor and a single-stage helical gear unit in one housing. The IE5+ synchronous motors with motor efficiencies of up to 95% are available in the TEFC version with a power of up to 4.0 kW, in the TENV
version with up to 2.2 kW and in the DuoDrive version with up to 3.0 kW.

With the NORDCON APP for mobile maintenance and commissioning of NORD frequency inverters, NORD enables the diagnosis, analysis, parametrisation and monitoring of the drive systems via a mobile terminal device for service use. The NORDAC ACCESS BT is a Bluetooth stick that is used directly with the frequency inverter – this ensures convenient mobile access to the drive data while at the same time access control.

NORD will present its comprehensive range of solutions at ACHEMA in Hall 8.0, Stand B52.

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On April 22, Rohde & Schwarz inaugurated a new facility center in Bengaluru’s Manyata Tech Park, housing R&D, system integration as well as calibration and repair services. The opening marks a strategic milestone for the technology company: it not only increases its presence in the third-largest city in India, but also strengthens its commitment to the Make in India initiative of the government by fostering innovation across the automotive, telecom, semiconductor, electronics, aerospace and defense sectors.

Rohde & Schwarz India, the Indian subsidiary of the German-based, global technology company Rohde & Schwarz, celebrated the grand opening of its new future-oriented facility located in the heart of Bengaluru’s prestigious Manyata Tech Park.

While inaugurating the new offices, Andreas Pauly, President and Chief Technology Officer (CTO) of Rohde & Schwarz, said: “We are proud to expand our presence in Bengaluru. For Rohde & Schwarz, India is not merely a growth market but a vital component of our global strategy. The new facility marks a significant milestone in our journey toward strengthening our position as a trusted partner in India’s evolving technological landscape. Moreover, it reflects our contribution to the Make in India initiative through a large team of highly skilled engineers.”

For more than 90 years, Rohde & Schwarz has had a tradition of innovation, helping to develop current and future cutting-edge technologies. By expanding R&D activities in India, Rohde & Schwarz is able to enhance technological excellence for the highly dynamic Indian market. The R&D team in Bengaluru is involved in developing next-generation solutions for the company’s Test and Measurement Division.

Yatish Mohan, Managing Director, Rohde & Schwarz India, added: “For the past 25 years, we have fostered technological advancement in India through strategic partnerships with government agencies, training institutes and technology firms. Our presence spans multiple locations throughout the country, encompassing tier-II cities directly and via our extensive channel partner network. We are excited about the opportunities that our new facility brings, allowing us to enhance our services to the Indian technology industry and facilitate innovation in the electronics, semiconductor, automotive and telecommunications sectors.”

The new facility houses an ISO 9001 and ISO17025 (NABL) accredited calibration and repair service center, offering precision services to meet the rigorous quality standards of the industry. This addition reinforces the commitment of Rohde & Schwarz to delivering high-quality products and services to its customers across India and beyond. Furthermore, the facility will also encompass sales, applications, systems integration and a dedicated demo display area showcasing various test and measurement equipment and test solutions. This strategic move underscores the company’s intention to enhance customer experience and accessibility, providing clients with hands-on experiences and seamless access to cutting-edge technology solutions.

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Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today expanded its timing solutions portfolio with a new ultra-low 25fs-rms clock solution for wireline infrastructure, data center and industrial applications. The new FemtoClock 3 family includes ultra-low jitter clock generators and jitter attenuators with 8 and 12 outputs, enabling high-performance, easy-to-use, and cost-effective clock tree designs for next-generation, high-speed interconnect systems. Target applications for the new devices include telecom switches and routers, top-or-rack data center switches, medical imaging, broadcast audio & video and more.

FemtoClock 3 devices provide industry leading phase noise and jitter required to meet the needs of 112Gbps SerDes rates, as well as next generation 224Gbps SerDes designs using commonly available 48MHz to 73MHz crystals. The highly integrated devices can generate up to four frequency domains and offer integrated LDOs (Low Drop Out regulators) with superior PSRR, reducing board complexity and cost.

“Renesas leads the industry with best-in-class timing solutions built from decades of experience and patented technology,” said Zaher Baidas, Vice President of the Timing Division for Renesas. “FemtoClock 3 devices extend that leadership by providing multiple clock and synchronization functions in a single device with ultra-low jitter, simplifying printed circuit board design and reducing solution area and cost.”

“FemtoClock 3 was the only timing solution that offered us the ultra-low jitter performance while maintaining low power dissipation and simplifying the PCB design and lowering solution area on our next-generation switches,” said Vincent Ho, CEO at UfiSpace. “We count on Renesas to deliver the timing solutions that enable us to deliver leading-edge products quickly and cost-effectively.”

Key Features of the FemtoClock 3 Family

• Industry-leading 25fs-rms jitter exceeds next-generation 112Gbps and 224Gbps SerDes reference clock requirements
• Up to 4 frequency domains allow all system clocks to be generated from a single device
• Device variants with jitter attenuation, synchronization and clock generation capabilities and with 8 or 12 outputs
• Low power dissipation of 1.2W and operating a single 1.8V supply
• Integrated non-volatile memory allows for device customization in factory at no additional cost to customer
• Small 7 x 7mm 48-pin VFQFPN and 9 x 9mm 64-pin VFQFPN packages
• Compliant with ITU-T G.8262 and G.8262.1 for enhanced synchronous Ethernet
• Single chip with multiple operating modes simplifies overall clock tree

FemtoClock 3 supports multiple operating modes, including synchronization, jitter attenuation, and clock generation. Customers can combine the new FemtoClock 3 solution with the broader ClockMatrix, VersaClock, buffer and oscillator portfolio of timing solutions to address challenging timing needs for their high-performance wireline infrastructure and data center designs.

FemtoClock 3 functions seamlessly in conjunction with the state-of-the-art Renesas IC Toolbox (RICBox) application, empowering users to configure and program devices on the evaluation board. Additionally, RICBox interfaces with the Renesas Lab on the Cloud platform, providing users with the capability to connect virtually to an actual laboratory setting.

Winning Combinations

Renesas has combined FemtoClock 3 with numerous compatible devices from its portfolio to offer Winning Combinations, including the 1600G Fixed Form Factor Switch. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

Availability

The FemtoClock 3 devices and evaluation boards are available today from Renesas and its distribution partners. For more information, including ordering samples and factory customization, please visit www.renesas.com/femtoclock3.

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• New STM32MP2 MPUs with 64-bit processing and edge AI acceleration
• Built for speed, security, and reliability
• Leverage the STM32 ecosystem for rapid development and secure provisioning

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is releasing new devices from the second generation of its industrial microprocessors (MPUs), the STM32MP2 series, to drive future progress in smart factories, smart healthcare, smart buildings, and smart infrastructure.

Digital transformation is happening everywhere, driving improvements including greater business productivity, better healthcare, and enhanced safety and energy management throughout buildings, utilities, and transport networks. Critical enabling technologies include cloud computing, data analytics, artificial intelligence (AI), and the Internet of Things (IoT). ST’s new STM32MP2 MPUs will power the next generations of equipment that create the fabric of this evolving digital world. These include industrial controllers and machine-vision systems, scanners, medical wearables, data aggregators, network gateways, smart appliances, and industrial and domestic robots.

“Our embedded MPUs address the trend that’s pushing more workloads and greater demands to smart devices, often deployed at the IoT edge, for faster response and increased efficiency,” said Stephane Henry, General Purpose MPU Division General Manager, STMicroelectronics. “The new STM32MP2 devices we are announcing today extend the performance trajectory, introducing our most powerful processing engine, now adding edge AI, and supported by the STM32 ecosystem to accelerate product development.”

Architected for demanding and time-sensitive workloads, AI inferencing, and communication, and featuring state-of-the-art cyber security, the STM32MP2 MPUs are built to withstand up to 10 years of continuous operation.

State-of-the-art security of the new STM32MP2 devices leverages ST’s proprietary secure hardware, anti-tamper controls, protected firmware, and secure provisioning, working with Arm’s TrustZone architecture, to keep sensitive data and keys secret. Certification to SESIP Level 3, the leading security test methodology for IoT devices and compliance, is ongoing for STM32MP2 MPUs to satisfy forthcoming tougher cyber-protection requirements in key territories worldwide. These include the US CyberTrust mark and stipulations in the EU’s Radio Equipment Directive that are due to become mandatory in 2025.

“Together with ST, we tackled the challenge of connecting our devices to the cloud. From opening locks remotely to granting new access rights, our products are shaping the future of access management,” said Marco Temporiti, R&D Software Manager, ISEO. “Thanks to the STM32MP2 microprocessor with its strong encryption capabilities, we are able to build an industrial-grade gateway with unmatched reliability and security. The seamless integration with Yocto Linux has streamlined our development process, allowing us to innovate with ease. And, ST’s 10-year longevity program also ensures a long product lifecycle at reduced cost, setting a new standard in the industry.”

“We worked with ST to build a 2-channel network audio adapter, leveraging the STM32MP1 series microprocessors to handle tasks like converting network digital audio signals for transmission and reception. The robust processing power, Ethernet connectivity and adaptable audio output interfaces were key considerations in choosing the STM32MP1 series for integration into our products,” said Yue XIONG, CEO, S-TRACK. “Now, we’re enthusiastic about the possibilities presented by ST’s latest MPUs, particularly the STM32MP2 series, which deliver improved power efficiency, enabling us to minimize cooling requirements in our enclosed casings. Additionally, the integrated Cortex-M co-processor eliminates the need for a separate microcontroller, and support for Gigabit Ethernet with precision time protocol (PTP) enables accurate data transfer and synchronization among devices. With this advanced technology, our goal is to broaden our product range to include 16-channel offerings.”

The first STM32MP2 MPUs are scheduled to enter volume production in June 2024. Sample requests and pricing information are available from local ST sales offices.

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Infineon Technologies AG supplies its power semiconductor devices to FOXESS, a fast-growing leader in the green energy industry and a manufacturer of inverters and energy storage systems. The two sides aim at promoting the development of green energy. Infineon will provide FOXESS with its CoolSiC MOSFETs 1200 V, which will be used with EiceDRIVER gate drivers for industrial energy storage applications. At the same time, FOXESS’ string PV inverters will use Infineon’s IGBT7 H7 1200 V power semiconductor devices.

The global market for photovoltaic energy storage systems (PV-ES) has grown at a high speed in the last years. As competition in the PV-ES market accelerates, improving power density has become key to success, and how to improve efficiency and power density for energy storage applications has attracted much attention. Infineon’s CoolSiC MOSFET 1200 V and IGBT7 H7 1200 V series power semiconductor devices adopt the latest semiconductor technologies and design concepts that are tailored to industrial applications.

Mr. Yu Daihui, Senior Vice President and Head of Industrial & Infrastructure of Infineon Technologies Greater China said, “As an industry leader in power semiconductors, we are proud to work closely with FOXESS. We will continue to drive decarbonization by enabling higher power density and more reliable systems for PV-ES applications.”

Mr. Zhu Jingcheng, Chairman of FOXESS, said, “Thanks to the support of Infineon’s advanced components, FOXESS’ products have been significantly improved in terms of reliability and efficiency. This has been an important driving force for FOXESS’ growth. Infineon’s technical support and product quality have not only strengthened our competitiveness, but also expanded our presence in the market. We are confident about the future and look forward to further cooperation with Infineon to jointly promote the development of the industry and create greater value for our customers.”

With a high power density, Infineon’s CoolSiC MOSFETs 1200 V can reduce losses by 50 percent and provide ~2 percent additional energy without increasing the battery size, which is especially beneficial for high-performance, lightweight, and compact energy storage solutions. FOXESS’ H3PRO 15 kW-30 kW energy storage series uses Infineon’s CoolSiC MOSFETs 1200 V for all models. Thanks to Infineon’s excellent performance, the H3PRO series has achieved an efficiency of up to 98.1 percent and excellent EMC performance; with superior performance and reliability, the H3PRO series has seen rapid sales growth in the global market.

Infineon’s TRENCHSTOP IGBT7 H7 650 V / 1200 V series has lower losses and helps improve the overall efficiency and power density of inverters. In high-power inverter projects, high-current mold packaged discrete devices with current handling capability above 100 A can reduce the number of IGBTs in parallel and replace the IGBT module solution, further improving system reliability and reducing costs; in addition, the H7 series has become an industry benchmark for its high-quality performance and greater resistance to humidity. At present, FOXESS’ main industrial and commercial model, the R Series 75-110 kW, redefines the overall design of the 100 kW model by using IGBT7 H7 series discretes, and the efficiency of the whole machine can reach up to 98.6 percent. Thanks to the low power loss and high power density of the IGBT7 H7 series in discrete packages, technical problems such as current sharing in the paralleling process can be simplified and optimized.

Every power device needs a driver, and the right driver can make the design a lot easier. Infineon offers more than 500 EiceDRIVER gate drivers with typical output currents of 0.1 A~18 A and comprehensive protection functions including fast short-circuit protection (DESAT), active Miller clamp, shoot-through protection, fault reporting, shutdown, and overcurrent protection, suitable for all power devices including CoolSiC and IGBTs.

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Microchip introduces configurable family of companion driver boards using its Hybrid Power Drive modules available in silicon carbide (SiC) or silicon (Si) technology

The aviation industry’s requirements for the latest, most efficient and lowest-emission aircraft is propelled by an overarching goal towards sustainability and decarbonization. To satisfy these goals, aviation power systems developers are transitioning to electric actuation systems as the trend towards More Electric Aircraft (MEA) continues to grow. To provide the aviation industry with a comprehensive electric actuation solution, Microchip Technology (Nasdaq: MCHP) today announces a new integrated actuation power solution that combines companion gate driver boards with our expansive Hybrid Power Drive (HPD) modules in silicon carbide or silicon technology with a power range of 5 kVA to 20 kVA.

The new integrated actuation power solution maintains the same footprint regardless of the power output. The companion gate driver boards are designed to be integrated with Microchip’s HPD modules to provide an all-in-one motor drive solution for the electrification of systems such as flight controls, braking and landing gear. Microchip’s power solutions are designed to scale based on the requirements of the end application, from smaller actuation systems for drones to high-power actuation systems for Electric Vertical Take-Off and Landing (eVTOL) aircraft, MEA and all-electric aircraft.

“We developed the companion gate driver boards to be used with our existing HPD modules to bring to market a plug-and-play power solution for MEA,” said Leon Gross, vice president of Microchip’s discrete product group. “With this solution, customers no longer need to design and develop their own drive circuitry, which can reduce design time, resources and cost.”

These high-reliability devices are tested to conditions outlined in DO-160, “Environmental Conditions and Test Procedures for Airborne Equipment.” There are multiple protection features including shoot-through detection, short circuit protection, desaturation protection, Under Voltage Lock Out (UVLO) and active miller clamping.

The gate driver boards are designed to be driven with external PWM signals based on Low Voltage Differential Signaling (LVDS) compliant with TIA/EIA-644 for low Electromagnetic Interference (EMI) and good noise immunity. The gate driver board provides differential outputs for telemetry signals like DC bus current, phase current and solenoid current by taking feedback from shunts present in the HPD module and DC bus voltage. It also provides direct output of two PT1000 temperature sensors available in the HPD power module.

The companion gate driver boards are low-weight, low-profile and compact solutions to optimize size and power efficiency of actuation systems. The gate drivers are designed to operate throughout the temperature range of −55°C to +110°C, which is critical for aviation applications that are often exposed to harsh environments.

The isolated companion gate driver boards only require a single 15V DC input for the control and drive circuit; all additional voltages needed are generated on the card. This significantly reduces the number of system components and simplifies system cabling.

Microchip provides comprehensive solutions for MEA by integrating power products with FPGAs, microcontrollers, security, memory and timing. Microchip’s solutions are designed to help customers speed up their development, reduce costs and get to market faster.

The companion gate driver boards are supported with detailed data sheets and device models.

The companion gate driver boards and accompanying HPD modules are available in production quantities. For additional information, contact a Microchip sales representative.

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: http://www.flickr.com/photos/microchiptechnology/53415024168/sizes/l

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SMD Devices Provide High Luminous Intensity to 2300 mcd, Offer Wavelengths of 525 nm and 465 nm for Heart Rate Monitoring and Smoke Detection

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced new blue and true green surface-mount LEDs in the ultra compact MiniLED package. Measuring 2.2 mm by 1.3 mm by 1.4 mm, the Vishay Semiconductors VLMB2332T1U2-08 and VLMTG2332ABCA-08 utilize the latest ultrabright InGaN chip technology to achieve typical luminous intensity of 440 mcd and 2300 mcd, respectively, which is up to four times higher than previous-generation solutions in PLCC-2 packages.

With their high brightness and small size, the LEDs released today are the perfect choice for small scale, high power products that are expected to work reliably in arduous environments. Typical applications will include medical light treatment; signal lights for agricultural equipment and energy generation systems; indicators and backlighting for office, entertainment, and telecommunications equipment; LCD switches; and symbols for general use.

In addition, with a typical wavelength of 525 nm at 20 mA, the VLMTG2332ABCA-08 is ideal for heart rate monitoring applications in fitness trackers and other devices that rely on variations in green light absorption. Offering a typical wavelength of 465 nm at 20 mA, the VLMB2332T1U2-08 is optimized for smoke detectors that utilize short wavelength blue light for the detection of small particles.

The LEDs’ MiniLED package features a lead-frame embedded in a white thermoplast. The devices offer a ± 60° angle of half-intensity, a wide viewing angle of 120° for homogenous illumination and backlighting, and forward voltage of 2.9 V typical. The VLMB2332T1U2-08 and VLMTG2332ABCA-08 are categorized, per packaging unit, for luminous intensity and color.

RoHS-compliant, halogen-free, and Vishay Green, the LEDs are available in 8 mm tape, offer an ESD-withstand voltage up to 2 kV in accordance with JESD22-A114-B, and are compatible with preconditioning according to JEDEC Level 2a, IR reflow soldering according to J-STD-020, and automatic placement equipment.

Device Specification Table: 

Samples and production quantities of the VLMB2332T1U2-08 and VLMTG2332ABCA-08 are available now, with lead times of 12 weeks.

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• Cadence’s new dynamic duo offers more than 2X increased capacity and is 1.5X faster than the previous generation, enabling the rapid development of advanced chips for generative AI, mobile, automotive, hyperscale and LLM applications
• Palladium Z3 emulator features a new custom Cadence emulation processor that delivers the fastest, most predictable compile and comprehensive pre-silicon hardware debug
• Protium X3 prototyping offers the fastest bring-up times for pre-silicon software validation of billion-gate designs
• Seamlessly integrated flow with unified compiler and common virtual and physical interfaces offers rapid design migration and testing from emulation to prototyping

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence® Palladium® Z3 Emulation and Protium X3 FPGA Prototyping systems, a revolutionary digital twin platform that builds on the success of the industry-leading Palladium Z2 and Protium X2 systems to tackle escalating system and semiconductor design complexity, and to accelerate the development timeline for the most advanced SoCs. Palladium and Protium systems have long been trusted by market-shaping AI, automotive, hyperscale, networking and mobile chip companies to deliver the highest throughput pre-silicon hardware debug and pre-silicon software validation. Targeted at the industry’s largest multi-billion-gate designs, the new Palladium Z3 and Protium X3 systems set a new standard of excellence, providing customers with more than a 2X increase in capacity and a 1.5X performance increase compared to previous-generation systems, enabling faster design bring-up and shortening overall time to market.

“As generational drivers accelerate the need for system and semiconductor innovation, our customers are facing increasing challenges to power the most advanced applications,” said Paul Cunningham, senior vice president and general manager of the System Verification Group at Cadence. “The third generation Palladium and Protium dynamic duo systems are core components of the Cadence Verification Suite and seamlessly interface with the Verisium AI-driven Verification Platform. The Cadence verification full flow offers our customers the highest verification throughput needed to deliver their hardware innovations to market faster and to support the rapid development of new technologies, such as generative AI.”

The Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance. The systems are powered by the NVIDIA BlueField DPU and NVIDIA Quantum InfiniBand networking platforms and maintain congruency when transitioning between the two systems and transitioning from virtual to physical interfaces and vice versa. The Palladium Z3 system accelerates hardware verification, and through functional and interface congruency, models can be quickly brought up onto the Protium X3 system for accelerated software validation.

“The supercharged Palladium Z3 and Protium X3 are built to deliver fast pre-silicon verification and validation of the largest and most complex devices,” said Dhiraj Goswami, corporate vice president, Hardware System Verification R&D at Cadence. “Our innovative custom silicon and system architecture, combined with revolutionary modular compile and debug capabilities enabling multiple turns per day, continues to push the envelope to meet our customers’ needs, allowing them to solve the world’s toughest challenges and enable their next generation of innovations to become a reality.”

“Building efficient, high-performance AI platforms requires sophisticated infrastructure and integration across a full stack of optimized systems and software,” said Scot Schultz, senior director, Networking at NVIDIA. “Accelerated by NVIDIA networking, the next-generation Cadence Palladium and Protium systems push the boundaries of capacity and performance to help enable a new era of generative AI computing.”

With the Palladium Z3 system’s new domain-specific apps, users have access to the most complete offering for managing increasing system and semiconductor design complexity, improving system-level accuracy, and accelerating low-power verification. The domain-specific apps include the industry’s first 4-State Emulation App, the Real Number Modeling App, and the Dynamic Power Analysis App.

“As SoCs become more complex, scalable validation and verification tools that enable massive software testing before tapeout are more critical than ever,” said Tran Nguyen, senior director of design services, Arm. “The latest hardware verification platforms and tools from Cadence are sparking innovation in Arm IP design for AI, automotive, and data center applications, and we look forward to how this will benefit our mutual customers.”

“Delivering on leadership computing products requires AMD to bring together a multitude of pre-silicon solutions and techniques to meet the scale of the verification challenge,” said Alex Starr, Corporate Fellow, AMD. “Cadence Palladium Z3 and Protium X3 systems add to our capabilities between emulation and enterprise prototyping to improve design productivity and meet time-to-market goals. Our collaboration with Cadence also incorporates the AMD Versal Premium VP1902 adaptive SoC within the Protium X3 system as well as AMD EPYC processor-based host servers qualified for both the Palladium Z3 and Protium X3 systems to enable high capacity with next-level performance and scalability.”

The Palladium Z3 and Protium X3 systems are part of the broader Cadence Verification Suite and support the company’s Intelligent System Design strategy, enabling SoC design excellence. The systems have been deployed at select customers, with general availability expected in Q3 2024. For more information on the new Palladium Z3 and Protium X3 systems, please visit www.cadence.com/go/dynamicduo3.

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• On track to become carbon neutral on scope 1 and 2, and partially scope 3, by 2027 with global sourcing of electricity from renewable energy growing to 71% in 2023, from 62% in 2022
• 87% of employees would recommend ST as a great place to work
• 12.2% of net revenues (US$2.1 billion) invested in R&D to support innovation

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today releases its annual sustainability report, which provides insight into its 2023 performance related to priority environmental, social and governance (ESG) factors that support long-term value creation for all its stakeholders and sustainable growth for its business.

“Sustainability is at the heart of our value proposition, driving benefits for our company, customers, and society. We’re proud of our progress on innovation, resilience, employee engagement and the advancement towards our ambitious goal of becoming carbon neutral on scope 1 and 2, and partially on scope 3, by 2027,” said Jean-Marc Chery, President and CEO, STMicroelectronics. “Together with our partners and empowered employees, we’re accelerating sustainable transformation in technology and beyond.”

ESG highlights during 2023 include:

• A 45% decrease in GHG emissions for scopes 1 and 2 since 2018 in absolute terms (vs a 40% decrease in 2022).
• An increased sourcing of electricity coming from renewable sources to 71% (from 62% in 2022) and the signing of a significant power purchase agreement (PPA) in Italy to produce 250GWh renewable energy per year (3.75 TWh over 15 years) starting in 2024.
• The reuse, recovery, or recycling of 96% of the Company’s waste (1% higher than in 2022).
• A- scores for CDP water security and climate change.
• 12.2% of net revenues (US$2.1 billion) invested in R&D to support innovation.
• Involved in 195 active R&D partnerships worldwide.
• More than 610 STEM (Science, Technology, Engineering, and Mathematics) events and initiatives (a 35% increase on 2022) reaching over 100,000 students and teachers globally.
• 87% of employees would recommend ST as a great place to work, 4% higher than in 2021 (when we last had a full survey).
• In 2023, the company established a strong focus on setting up voluntary, employee-led Employee Resource Groups (ERGs) to promote inclusion in the workplace. WISE (Women Inspiring Supporting and Empowering), the first ERG for women, has grown fast, with some 1,400+ members in 60 locations.

In 2023, ST maintained a strong presence in major sustainability indices such as the Dow Jones Sustainability indices, FTSE4Good, EuroNext VIGEO Europe 120, CAC 40 ESG, MIB ESG, ISS ESG Corporate ratings, Bloomberg Gender Equality Index, and received an MSCI ESG Rating of AAA.

The 27th annual report contains highlights and details of ST’s sustainability performance in 2023 and presents the Company’s ambitions and longer-term goals in alignment with both the United Nations Global Compact Ten Principles and Sustainable Development Goals and the Science Based Targets initiative (SBTi). It is aligned with Global Reporting Standards (GRI), Sustainability Accounting Standards Boards (SASB), and Task Force on Climate-Related Financial Disclosures (TCFD). A third party has verified this report.

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New flagship in ultra-low-power consumes less, and delivers more at an effective cost

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a new generation of energy-conscious and cost-effective microcontrollers (MCUs) that can reduce energy consumption by up to 50% compared to previous product generations. This enables less frequent battery replacements, minimizes the impact of discarded batteries, and allows more designs to go battery-freerunning solely from an energy-harvesting system such as a small photovoltaic cell.

In the global pursuit of sustainability, technologies deployed in smart buildings and Internet of Things (IoT) applications are critical tools for managing energy and resources efficiently. At the heart of the smart sensors and actuators making them possible, ST’s microcontrollers manage the processes that collect, filter, analyze, and act, communicating with high-level applications in the cloud. There are billions of these MCUs in action already and the expansion of smart living and working will demand billions more.

“It’s vital that these pervasive devices consume as little energy as possible as they help to minimize waste elsewhere. The new STM32U0 microcontroller series we are introducing today takes this notion to a new level, building on our proven ultra-low-power technologies,” explained Patrick Aidoune, General Purpose MCU Division General Manager, STMicroelectronics. “In fact, our new MCUs consume so little power that small devices in some dedicated applications like industrial sensor management can run for twice as long from the same size battery. This comes with the opportunity to add more advanced features and deliver cost-effective solutions for a variety of industrial, medical and consumer devices.”

The new STM32U0 MCUs enable this great leap in energy efficiency through a combination of their state-of-the-art design techniques and advanced manufacturing process. These include extremely low static power consumption in standby mode and superior wake-up performance, enabling the MCU to spend more time in power-saving sleep modes to minimize average energy demand.

One lead customer, in the security-systems market, is using the STM32U0 in security cameras to wake the device when motion is detected and thus enhance surveillance while saving energy. Another has created ultra-long-lasting smoke detectors, while a further application, by Ascoel, is using the STM32U0 to manage power-conscious functions of a water meter.

“Ascoel builds a wide range of innovative electronic devices with a focus on IoT technologies. We are working to design an ultrasonic water meter, with battery lasting for more than 10 years, integrating an LCD screen for real-time data, as well as the necessary security,” said Francesco Cerretani, Senior Software Developer, Ascoel. “We found that the STM32U0 was the perfect solution, supporting our goal to create a low-cost, ultra-low-power, easy-to-install, zero maintenance, precise water meter. When deployed at scale in the customer’s grid, it will improve control over water leakage and contribute to reducing the environmental impact.”

The STM32U0 enhances cost-effectiveness by providing an LCD segment display controller. Devices with an LCD, like Ascoel’s water meter as well as thermostats, smart retail labels, access-control panels, and factory automation can take advantage of this to reduce the cost of their PCB. Additional value-added features of STM32U0 MCUs include numerous analog peripherals like analog-to-digital converters (ADC), digital-to-analog converters (DAC), operational amplifiers, and comparators. There is also an on-chip system oscillator that helps cut the bill of materials to save costs and PCB space.

STM32U0 devices are the first MCUs running on Arm Cortex-M0+ targeting SESIP Level 3 and PSA level 1 focusing on firmware code protection. Certification provides an independent assurance of the STM32U0 security capabilities that product manufacturers can leverage to comply with the coming voluntary US Cyber Trust Mark and mandatory EU Radio Equipment Directive (RED).

Developers can also take advantage of up to 256KB of Flash, package options up to 81 pins, and 56MHz core speed, which are generous specifications for this class of device.

The STM32U0 series is in production now and ST is making the new devices available at an attractive price point starting at $0.68 for 1,000 units. Sample requests and further pricing options are available from local ST sales offices.

For more information, please go to www.st.com/stm32u0.

A marketing presentation for the STM32U0 series is available at https://www.st.com/resource/en/product_presentation/microcontrollers-stm32u0-series-product-overview.pdf.

STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.

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The demand for more efficient power semiconductors is on the rise as businesses adapt to a low-carbon future. Minimizing the overall cost and footprint of the system while enhancing efficiency is a crucial objective that needs to be considered while developing power semiconductor solutions. Intelligent power modules (IPMs) are one such solution that has gained significant attention in the heat pump market. These compact and highly integrated modules provide high power density and advanced control and monitoring capabilities, making them an ideal choice for heat pumps.

According to Eurostat data, about 50% of all energy consumed in the European Union (EU) is used for heating and cooling, and more than 70% still comes from fossil fuels (mostly natural gas). In the residential sector, around 80% of the final energy consumption is used for space and water heating.

Heat pumps (Figure 1) can deliver heating, cooling, and dehumidification needs and are a proven and sustainable solution for heating powered by electricity. They are an environmentally friendly option for your home and office, helping us move away from fossil fuels to more renewable energy technologies. With global concerns about energy security and climate commitments, heat pumps are emerging as the primary tool for decarbonization in space and water heating systems.

The number of heat pumps installations globally will rise from 180 million in 2020 to around 600 million in 2030, according to the International Energy Association (IEA). At least three times more efficient than traditional fossil fuel boilers, heat pumps are preferred and its installation in individual buildings is forecasted to rise from 1.5 million per month currently to around 5 million by 2030 (Source: IEA). In the U.S., the Inflation Reduction Act includes tax credits and rebates that can cover up to 100% of the costs, depending on household eligibility.

Intelligent power modules (IPMs) are crucial in controlling the power flow to inverter compressors and fans in heat pump systems. (Figure 2) These modules adjust the frequency and voltage of power supplied to three-phase motors and contribute to achieving higher energy efficiency standards for compressors and pumps. For example, coolers using IPMs for their inverter systems reduce power by 30% compared to non-inverter systems.

IPMs are prevalent in various applications and systems. Owing to their high level of integration, whether in the power stage, drivers, or protections, IPMs allow for shorter development phases.

onsemi has recently unveiled a new family of 1200 V SPM31 IPMs, setting a new standard for three-phase inverter applications. This groundbreaking technology not only addresses the growing need for energy efficiency but also focuses on reducing system costs and improving overall performance. With new and improved features, the SPM31 IPMs are a game-changer in the heat pump market.

The SPM31 IPMs incorporate the latest 7th generation of IGBT Field Stop (FS7) technology, making them highly efficient and robust. The well-optimized active cell design and buffer profile, coupled with narrow electrical parameter distribution, eliminates short circuit oscillation in both single and parallel device operations. This technology uses a submicron trench gate cell pitch that increases channel density to reduce the conduction losses. The gate capacitance is optimized for smooth switching waveforms and low switching losses. On the emitter side, multiple FS layers enhance blocking capability and reduce drift layer thickness, resulting in lower conduction and switching energy losses. The FS7 IGBT development focuses on optimizing both Vcesat and Eoff to achieve state-of-the-art device performance.

This technology results in minimized EMI, up to 10% a remarkable reduction in power losses, up to 9% increase in power density, and a 20% size reduction in IGBT chip die size compared to previous generation products. As a result of the improved power density, designers can use a simplified layout to free up valuable space in the heat pump system while improving efficiency. The SPM31 IPMs are available in multiple current rating line-ups ranging from 15 to 35 Amps (A).

onsemi’s SPM31 IPMs come equipped with an array of advanced features to ensure reliable operation. The modules include gate driver ICs and various on-module protection features, such as:

• Under-Voltage Lockouts: The SPM31 IPMs protect against low voltage conditions that can cause unpredictable operation or even damage to the system.
• Over-Current Shutdown: This feature provides protection against excessive current flow, which can cause permanent damage to the system.
• Thermal Monitoring: The SPM31 IPMs can accurately sense temperature, allowing for proper thermal management and preventing overheating.
• Fault Reporting: The modules can detect and report various faults to the system, providing early warning signs for potential issues.

Additionally, the SPM31 IPMs use a direct bond copper substrate (Figure 5), providing superior thermal performance. These features enhance the robustness of the modules and contribute to their suitability for a wide range of applications. The versatility of the SPM31 IPMs makes them an ideal choice for various inverter drive applications including HVAC, heat pumps, variable frequency drives (VFD), industrial pumps and fans, and servo motors.

Alongside the SPM31, onsemi has a versatile IPM product portfolio. (Figure 6)

The adaptability of these modules showcases their potential to revolutionize multiple industries by providing efficient and compact solutions.

The SPM31 IPMs are a significant advancement for heat pumps. The IPMs provide a compact, high-performance solution that helps engineers design more efficient, reliable, and cost-efficient systems for industrial applications.

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Timers are a common peripheral in microcontrollers (MCUs), including PIC MCUs. With so many possible choices, how do you select the right one to use in your application?

Timers are a ubiquitous peripheral in MCUs. It should come as no surprise that there are a lot of timers, each with their own use case that they excel at. Some timers are designed to be used as part of waveform generation, while others are ideal for pulse counting. In many cases, there is no wrong choice—instead, it will depend on the requirements and resources available. For more information about the timers, please see the linked peripheral pages in the table below.

*Hardware limit refers to the ability to rollover at an arbitrary value, rather than the maximum count possible. (E.g.: 0x1000 versus 0xFFFF for a 16-bit timer)

TMR0 can function in 8-bit or 16-bit mode. When in 8-bit mode, the high and low byte of the timer are independent of each other. The timer rolls over when the value set in the high byte matches the low byte. 16-bit mode is a free running timer, where the timer will rollover when it reaches the value 0xFFFF. To prevent data corruption during read/writes, the register is buffered, and only latched on the low byte.

TMR1 is a 16-bit gated timer with support for both synchronous and asynchronous clock signals. When TMR1 is in asynchronous mode, the timer functions in sleep and can generate an interrupt to wake the microcontroller. The timer also contains a gating function which can be used to hold the current value.  To prevent corruption when reading/writing the 16-bit value, the timer can be configured to buffer the counter. The data will be latched on the low byte.

TMR2 is an 8-bit timer that supports one-shot and monostable modes of operation. One-shot mode triggers the timer, then clears the ON bit after reaching the hardware limit. Monostable functions identically to the one-shot mode, except that the ON bit remains set and the timer can be retriggered. TMR2 can be reset or triggered by an external signal.

The SMT is a large 24-bit timer that supports the following modes:

• (Windowed/Gated) Counter
• Capture
• Time of Flight
• (Gated) Window Measurement
• High and Low Measurement
• Period and Duty Cycle Measurement
• (Gated) Timer

Note: Values in parentheses are other modes available, e.g.: Windowed Counter, Gated Counter and Counter are all valid modes.

To support these operating modes, the SMT contains four 24-bit registers. The exact behavior of the registers depends on the mode.

The UTMR is composed of two timer modules that can operate independently of each other, or as one larger timer. The size of the UTMR may vary by device; currently on the PIC18-Q71 family, it is 16-bit per module, or 32-bits if chained together. This timer was designed to contain the functionalities of all legacy timers (TMR0, TMR1 and TMR2).

The UTMR supports both synchronous and non-synchronous clock sources and allows for reading the current count without stopping the timer, even with non-synchronous sources. To control the timer, there are three configurable events: Start, Reset and Stop.

Start events define what starts the timer. The reset event defines what resets the count back to zero. And there is a stop event, which defines what will stop the timer completely. These events can be always enabled, triggered from an input signal or disabled entirely. This enables features like monostable triggering, hardware limits and one-shot operation.

Note: The size of the NCO (16-bits or 20-bits) may vary, depending on device family.

The NCO is designed to generate a periodic waveform by adding a programmable increment to an accumulated total. When the total overflows, the overflow is kept, and a pulse is generated. The pulse can be a fixed number of input clock cycles in width, or it can be 50% output at the cost of halving the output frequency. While the NCO isn’t designed for measurement, it can be used if the NCO is stopped, read and then restarted.

The CCP has three modes—Capture, Compare or Pulse Width Modulation (PWM). The Capture/Compare modes utilize TMR1 while PWM utilizes TMR2.

The Capture mode stores the value in TMR1 when a rising or falling event occurs (depending on operating mode). The Compare mode generates an output when the value in TMR1 matches the set value in the CCP. For PWM mode, TMR2 is 8-bit, but the CCP extends it to 10-bit using the internal oscillator’s prescaler bits.

Note: For PWM that depends on TMR2, see the CCP section.

The 16-bit PWM peripheral is fully standalone—meaning that it does not utilize another system timer, unlike CCP (which depends on TMR2). There are five operating modes for generating PWM:

• Left Aligned
• Right Aligned
• Center-Aligned
• Variable Aligned
• Compare

These modes change how the count is used to generate the output. Inside of each instance are slices, each containing two outputs. The outputs share a common frequency but have their own duty cycle registers. Additionally, the peripheral is double buffered for smooth output changes and can be synchronized with other PWM instances.

The WWDT is a special timer designed to detect a deadlock in the microcontroller. A WWDT is a timer that runs the background. Periodically, software must clear it through a special sequence, or it will reset the microcontroller. WDT and WWDT differ only in that the WWDT has a “Window” feature. The “Window” feature can require the clearing sequence to be performed within a certain time window, rather than any time before the timer rolls over. This prevents a deadlock from being undetected by clearing the timer continuously.

After understanding the timer peripherals, select which timer closest matches the features needed in the application. In many cases, there are multiple possible timers that can perform the task. In this case, select the simplest timer—this leaves timers with more capabilities available for future use. The device datasheet, application notes and technical briefs go into more detail on how all of these timers operate and the registers associated with them. Code examples that use a specific timer can be found by searching MPLAB Discover.

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Chicony Power Technology, a worldwide leading manufacturer of power supplies and a pioneer in power electronics, has announced the winners of its Annual Partner Awards, honoring Infineon Technologies AG as its 2023 “GaN Strategic Partner of the Year”.

Infineon has been recognized by Chicony Power as its top partner for gallium nitride (GaN)-based power supplies, including notebook adapters, as well as ICT applications in gaming, storage and servers. This acknowledgment is the result of Infineon’s high standards for product selection, application expertise, high reliability and cost-effectiveness.

GaN stands out as one of the most crucial technologies which are essential for improving the efficiency of power supplies and reducing their product size. Pooling Infineon’s leading GaN expertise and Chicony Power’s remarkable capabilities in power supply system design, the win-win collaboration has helped push the boundaries of innovation and further strengthened both companies’ leading positions in energy-efficient power solutions. As of today, the GaN adoption rate in Chicony Power’s high-watt adapters has reached 20 percent, and this rate is rapidly increasing.

“Unrivalled R&D resources, a comprehensive application understanding and a large number of customer projects let Infineon continuously drive its roadmap for becoming a leading GaN Powerhouse,” said Adam White, Division President Power & Sensor Systems at Infineon Technologies. “The Strategic Partner of the Year award from Chicony Power is a great honor for us. We see this as part of our common mission to drive decarbonization and digitalization together.”

“We’re pleased to honor Infineon, which has played a pivotal role in driving customer success throughout 2023, as our GaN Strategic Partner of the Year,” said Peter Tseng, President of Chicony Power Technology. “Our Vision is to be a global pioneer in the implementation of new technology that enhances power supply efficiency, reduces the carbon footprint of power supplies and helps create a greener world. We would like our Annual Partner Awards to encourage Infineon and all other partners to maintain the momentum in jointly promoting GaN technology in the market alongside Chicony Power, making the power industry greener and cleaner.”

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• 8th edition of the premier show by Informa Markets in India to be held on 26th and 27th April 2024 at HITEX Exhibition Centre
• RenewX 2024 will bring together over 5500 visitors, more than 150 exhibitors showcasing over 180 brands

Informa Markets in India, India’s leading B2B exhibitions organizer is gearing up to host the 8th edition of South India’s largest expo for renewable energy and electric vehicle market, RenewX. Scheduled to take place at Hall 1 & 3, HITEX Exhibition Centre, Hyderabad on 26th and 27th April 2024, the expo aims to bring together renewable energy and sustainable mobility professionals under one roof. It aims to set a growth trajectory for the sector, enabling networking, collaboration, and learnings from industry experts and thought leaders.

The show will attract a diverse audience including architects, real estate developers, commercial & industrial consumers, facility managers, energy consultants, independent power producers, EPCs, distributors/dealers, system installers and integrators, regulatory bodies, municipalities, local authorities and more.

RenewX 2024 is a gateway to discover various opportunities and build successful business relationships. Building on the success of last year’s event, the show is expected to welcome over 5500 visitors, and the presence of more than 150 domestic and international exhibitors including a few Chinese companies participating through their India operation team. Key exhibitors include top of the line organisations such as Premier Energies Ltd, Waaree Energies, Goldi Solar, Vikram Solar, Gautam Solar, Swelect Energy, Emmvee Solar, Jinko Solar, Rayzon Solar ,SMA Solar, Grew Energy, Credence Solar, Pahal Solar, , EVVO Solar, ICON Solar, MPL Group, Luminous Power Technologies, Microtek , Livguard Solar, Deye Inverter, Valeo products, Exide Industries, Polycab, and Impulse Green Energy, among many others.

A wide array of over 180 brands will be showcased with products and services spanning photovoltaic modules, hybrid systems, inverters, charge controllers, batteries, solar water heaters/cooling systems, solar pumps, testing and monitoring systems, project consultants, Wind-solar Hybrid Power System Integrators, EV & charging infra, assemblers and EPC players.

Emphasizing the significance of RenewX 2024, Mr. Yogesh Mudras, Managing Director, Informa Markets in India, said “India’s steadfast commitment to reducing carbon intensity by less than 45% by the decade’s end and achieving net-zero carbon emissions by 2070 underscores the imperative of carbon-free growth on our journey towards a $5 trillion economy. With solar PV capacity representing around 55% of our total renewable capacity, and the government’s unwavering focus on sustainable growth, solar energy emerges as a vital solution to meet our energy needs and ensure security, reaffirming India’s global leadership in renewable energy and dedication to sustainability. The recent approval of the Surya Ghar Yojana scheme for installing rooftop solar in 1 crore households further exemplifies India’s advancements in solar technology and manufacturing capabilities, cementing solar energy as a cornerstone of India’s sustainable future. Complemented by wind, biomass, EV, and hydropower, the nation’s focus on renewable energy has never been stronger.

RenewX 2024, set in the vibrant Southern hub of Hyderabad, will serve as a timely catalyst for elevating businesses and knowledge to new heights. As in previous editions, the RenewX conference, along with the exhibition, will foster a platform for understanding manufacturing challenges and collaboratively crafting solutions, with a special emphasis on South India’s unique context,” he further added.

Telangana State Renewable Energy Development Corporation will be the nodal agency at the show, facilitating a two-day conference featuring a CEO conclave and product showcase. The conference will comprise 7 sessions with over 40 speakers, discussing a wide array of topics such as Indian solar manufacturing, RE targets, solar technology advancements, net-zero and E-mobility, AgriPV, Bioenergy, and more. Distinguished dignitaries slated to speak include Sri Ajay Mishra, IAS, Director General, Renewable Energy Society of India (RESI) & (former) Spl. Chief Secretary, Govt of Telangana , Sri N. Janaiah, Vice Chairman & Managing Director, TSREDCO,  Mr. Abhijeet Sinha, National Program Director Ease of Doing Business | Project Director- NHEV, DIISHA, Drone Pilot | President- CPOs of India, Mr Praveen Arora, Partner & Practice Lead- Energy & Infrastructure at BTG Advaya Mr. Amit Shukla, Senior VP and business Head, Energy Solutions, Luminous Power Technologies.;; Mr. Swapnil Wakade, Business Head – Rooftop Solar, Ecofy; Mr.Sumit Kumar – AVP Technology, Vikram Solar; Mr. Gaurav Kedia, Chairman, Indian Biogas Association; Mr. Rohit Dhar , COO, Emmvee Group, among others, will be sharing their valuable insights.   The format would be a diverse spread of interactive channels like Confenrence Sessions, Multiple Workshops and Seminars and a Bioenergy Conference.

This year the expo garnered extensive support from partners and associations include TSREDCO (Telangana State Renewable Energy Development Corporation Ltd), IBA (Indian Bio-gas Association) , IGEF (Indo German Energy Forum), TELMA, TSEA (Telangana Solar Energy Association). The show’s knowledge partners include Frost & Sullivan, Wood Mackenzie, Yole Group, National Highway for EV and Ease of doing Business.

India’s Renewable Energy Sector has experienced remarkable growth, driven by a convergence of factors including favourable Government Policies, cost reductions, increased investment, technological advancements, and heightened environmental awareness. Ranked as the 4th largest installed capacity for renewable energy globally, India’s solar energy sector has emerged as a major player in grid-connected power generation. With ambitious targets set to reduce the nation’s carbon intensity by less than 45% by the end of the decade, achieve 50% cumulative electric power installed by 2030 from renewables, and attain net-zero carbon emissions by 2070, India stands at the forefront of sustainable energy development. Steadfast in its commitment to prioritize solar power, India aims to surpass the 500 GW target before 2030, solidifying its global leadership in renewable energy and unwavering dedication to sustainability.

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• Collaboration aims to improve performance of LFP cathode material
• Reduced carbon footprint of batteries through use of local raw materials
• Focus on European value chain for LFP batteries

Specialty chemicals company LANXESS and battery materials manufacturer IBU-tec advanced materials have entered into a research cooperation in the battery sector. The goal of the two German companies is to develop innovative iron oxides for the production of cathode material for LFP batteries and thus increase the performance of this battery type. The companies aim to optimize the electrochemical properties of LFP batteries, such as energy density, charging speed and number of charging cycles.

More and more car manufacturers are increasingly relying on LFP (lithium/iron/phosphate) batteries for their e-vehicles – especially for volume models. Compared to NMC (nickel/manganese/cobalt oxide) and NCA (nickel/cobalt/aluminum oxide) cell chemistry systems, LFP technology offers cost advantages of up to 50 percent and promises safer use, as the system makes the batteries virtually impossible to ignite.

The demand for LFP in Europe is expected to grow by 20 percent per year until 2030. So far, however, this demand has been met almost exclusively by non-European suppliers. With their development, both companies aim to contribute to the establishment of an independent, robust value chain in the European LFP battery market, while at the same time reducing the carbon footprint of batteries.

IBU-tec, based in Weimar, Germany, is currently the only European manufacturer of LFP cathode material. LANXESS operates the world’s largest plant for the key raw material iron oxide in Krefeld-Uerdingen. The company has almost 100 years of experience in developing this material and can supply iron oxide particles for LFP batteries in the required size, purity, morphology and quantities.

Michael Ertl, Head of the Inorganic Pigments business unit at LANXESS, said: “As IBU-tec is currently the only European manufacturer of LFP cathode materials, the company is the ideal partner for us to develop the new material, which is a key component for batteries in e-cars and stationary energy storage systems. This is an important contribution to sustainability and the development of a European value chain in the field of battery materials.”

Jörg Leinenbach, CEO of IBU-tec, said: “With LANXESS, we are gaining one of the largest, globally positioned chemical companies as a strong partner in the battery sector. With the joint product development we will combine our expertise and together we will drive the development of the European LFP battery market and establish an independent value chain. We see this cooperation as an important step towards opening up the market. IBU-tec will inform about further material developments in the battery sector with new application possibilities in January.”

In addition to key ingredients for LFP precursors, LANXESS offers many other solutions for electromobility and the battery industry, including raw materials for electrolytes, battery coolants, flame retardants for plastic components in electric vehicles and charging infrastructure, and orange dyes for coloring high-voltage components.

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The modern building is intelligent, connected and as a result saves energy. In combination with alternative energy sources and efficient lighting solutions, emissions in the building sector can be drastically reduced. This makes a significant contribution to achieving climate targets. 2,169 exhibitors presented the latest developments in building technology and trends in innovative lighting design at Light + Building in Frankfurt am Main from 3 to 8 March 2024. Over 151,000 visitors travelled to the world’s leading trade fair for lighting and building-services technology.

“The atmosphere at the exhibitors’ booths, in the halls and throughout the exhibition grounds was simply fantastic. We are extremely pleased that so many exhibitors and visitors, as well as our long-standing partners, have continued the success story of the world’s leading trade fair for lighting and building-services technology in 2024,” summarises Wolfgang Marzin, President and Chief Executive Officer of Messe Frankfurt. He adds: “With the switch to renewable energy sources, greater efficiency and sustainability in buildings, the industry has key goals on its agenda. That’s why they used the platform intensively, especially in the first few days, to present and discover innovations and drive forward key topics. After all, if we want to achieve the climate protection goals, the building sector is an essential milestone. It is unfortunate that the rail and air transport strikes have already affected Messe Frankfurt’s third leading international event since the beginning of the year.”

Key topics are the electrification and digitalisation of homes and buildings in order to reduce emissions and reuse raw materials. At Light + Building, the industry presented the digital and electrotechnical infrastructure for this and, on this basis, showcased solutions for dynamic power control, energy storage systems and applications for connected security. One growing area is the range of e-mobility and charging infrastructure as well as innovations and products for decentralised energy supply systems and components.

Light plays an important role in the architecture of tomorrow. At Light + Building 2024, 65 per cent of exhibitors belonged to this sector. They presented high-quality lighting solutions for indoor and outdoor areas as well as dynamic room concepts. Modern LED installations ensure contemporary efficiency and either blend harmoniously into the architecture or emphasise the design elements. Lighting is to provide maximum visual comfort in all living and working environments. Thanks to the materials used, Acoustic Lighting combines a pleasant lighting atmosphere with sound-absorbing functions. Sustainability plays an essential role in both the materials used and the manufacturing processes. Many manufacturers design luminaires in a way that the raw materials used can be recycled at the end of their useful life.

The high-quality, extensive and international portfolio of lighting and building-services technology impressed the visitors. 95 per cent of them were extremely satisfied with what was on display and stated that they had achieved 93 per cent of their trade fair attendance targets. The most came to the innovation meeting point from Germany, China, Italy, the Netherlands, France, Switzerland, Belgium, Austria, the UK, Spain and Poland. They came from a total of 146 countries – including, for example, India, the USA, the United Arab Emirates, Australia, Brazil and Singapore. The degree of internationality was thus 51 per cent. The level of internationality among the 2,169 exhibitors was also high at 76 per cent.

The social media community also found its home at Light + Building. On 3 and 4 March, the leading content creators in the lighting and building-services technology sector gathered for the Power Creator Days. In addition to live podcasts, expert talks and case studies, visitors had the chance to pedal for a good cause and work together towards a high energy target. A total of 1,510 minutes were cycled on the six fitness bikes. The sponsors will convert the result into a cash donation for the Leberecht Foundation, which Messe Frankfurt will double. The exact amount will be announced on social media further to Light + Building.

The next Light + Building will take place from 8 to 13 March 2026 in Frankfurt am Main.

Alexander Neuhäuser, General Manager ZVEH, Central Association of the German Electrical and Information Technology Trades, says that “Light + Building demonstrates how sector coupling can succeed through the necessary connectivity. The electrical trades integrate photovoltaics, storage, electromobility and heat pumps. They show how the energy industry requirements for controllable consumption devices (SteuVE) can be met and thus take account of the current transformation process. The good atmosphere at this year’s Light + Building 2024 was also noticeable at the joint stand of the electrical trades, which was very busy on all days of the event. The traditional partners’ evening was also a complete success, bringing together the partners of the electrical trades and the industry leaders. We were particularly pleased that so many young people once again took the opportunity to visit the E-House and the workshop street and gain an impression of what is feasible with smart and intelligently connected building automation.”

Wolfgang Weber, CEO, ZVEI, Electro and Digital Industry Association, is of the opinion that, “In the context of climate goals and the economic situation of urgently creating more affordable living space in Germany, technologies are increasingly coming into focus. The exhibiting companies at Light + Building have impressively demonstrated how easily well-designed climate protection can even lead to greater economic efficiency in the operation of houses, buildings and entire neighbourhoods.

This requires the right solutions, especially from the electrical and digital industry, such as heat pumps, controllable lighting, charging points and an energy management system. This is relevant – not just in Germany and Europe, but worldwide. Light + Building is the right place to present innovative, climate-friendly technologies and solutions and to engage in dialogue with trade visitors from Germany and abroad.”

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Acquisition adds ASA Motion Link technology to Microchip’s broad Ethernet and PCIe automotive networking portfolio to enable next-generation software-defined vehicles

Microchip Technology Inc. has announced the completed acquisition of Seoul, Korea-based VSI Co. Ltd., an industry pioneer in providing high-speed, asymmetric, camera, sensor and display connectivity technologies and products based on the Automotive SerDes Alliance (ASA) open standard for in-vehicle networking (IVN). The terms of the transaction are not disclosed.

The market size of automotive radar, camera and LiDAR modules is expected to grow by greater than two times between 2022 to 2028 to $27B in revenue, according to Yole Group[1]. This anticipated growth is driven by the increased adoption of Advanced Driver Assistance Systems (ADAS), in-cabin monitoring, safety and convenience features (e.g., 360-degree surround view, e-mirrors) and multi-screen digital cockpits for next-generation software-defined vehicles (SDV). These applications will require more highly asymmetric raw data and video links and higher bandwidths, making current, proprietary serializer/deserializer (SerDes) based solutions no longer adequate, both commercially and technically. In response to these developments, the Automotive SerDes Alliance (ASA) was formed in 2019 and released the first open-standard ASA Motion Link (ASA-ML)  specifications.

“This acquisition brings VSI’s knowledgeable team, their market traction and ASA Motion Link technologies and products to Microchip’s expansive automotive networking portfolio to better serve the ADAS megatrend we are focused on,” said Mitch Obolsky, senior vice president of Microchip’s automotive products, networking, and data centre business units. “As the industry converges around three primary IVN pillars – Ethernet, PCIe and ASA Motion Link, camera and display connectivity is one of the fastest growing and largest IVN markets. With VSI, Microchip can now offer products that span all three pillars and also provide automotive security, microcontrollers, motor control, touch and power management solutions to our customers to enable their next-generation software-defined vehicle architectures.”

Today, ASA has over 145 members, including Microchip who is a promoter member. With 11 automotive manufacturers including BMW, GM, Ford, Stellantis and Hyundai-Kia Motors Corporation, the Alliance also includes an ecosystem ranging from Tier 1 suppliers, semiconductor and imager vendors, to test and compliance houses. In addition to being an open standard, ASA-ML brings link layer security and scalability to support 2 Gbps to 16 Gbps line rates. Furthermore, the upcoming specification update will enable ASA-ML to support Ethernet-based architectures.

“Microchip Technology is an established and trusted market leader in automotive networking known for their automotive quality and robust supply chain, and our team is excited to join them to address the growing ADAS and digital cockpit connectivity market,” said Steve Kang, CEO of VSI Co. Ltd. “VSI is a leader in the development of ASA-ML products and was the first to introduce products to the market. Our standards-compliant chipsets are being evaluated by car manufacturers worldwide. We recently collaborated with BMW in a proof of concept to showcase ASA-ML and our product readiness. This acquisition brings together two organizations with a shared commitment to advancing technology through innovation. We look forward to successfully deploying our solutions in production vehicles for years to come.”

In March 2024, BMW Group announced at the Automotive Ethernet Congress in Munich they would shift to using standardized ASA-ML for the upcoming start of productions. BMW has always been at the forefront of in-vehicle networking innovation and strongly believes in leveraging standardized technologies in their vehicle architectures and now also their video architecture.

[1] Sources: LiDAR for Automotive – Radar for Automotive – Status of the Camera Industry – Yole Intelligence, 2023.

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