ELE Times

The rise in price of silver and sustainability requirements are accelerating across semiconductor assembly. MacDermid Alpha Electronics Solutions introduces ATROX CD 560-1, a zero-per and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.

As silver prices continue to fluctuate sharply, semiconductor manufacturers face growing pressure on assembly budgets and long-term planning. ATROX CD 560-1 addresses this challenge through an engineered alternate silver filler approach that supports more stable cost management while delivering reliable performance and production efficiency.

The formula to support high-speed, high-volume manufacturing, offering 2.5 watts per meter-kelvin (W/mK) bulk thermal conductivity and robust die attach performance across key metal leadframe surfaces, including pre-plated frames (PPF), commonly nickel-palladium-gold (NiPdAu), and copper leadframes. Consistent dispensing performance supports repeatable flow and dispense patterns, along with clean deposits across long production runs with minimal maintenance.

ATROX CD 560-1 is manufactured with no added and polyfluoroalkyl substances (PFAS), helping customers respond to evolving environmental expectations and regulatory scrutiny while maintaining device performance. The zero PFAS chemistry aligns with broader sustainability goals without slowing production or adding process complexity.

“This approach sets a new benchmark in conductive die attach by combining manufacturing speed with reliability,” said Avin Dhoble, Product Manager, MacDermid Alpha Electronics Solutions. “It’s tuned dispensing and cure profile supports high-throughput processing, enabling faster production without a quality trade-off.”

The paste is compatible with time-pressure pump systems used on most die bonders, allowing consistent dispensing over long production runs. Low outgassing helps maintain cleaner oven environments and supports strong package reliability in downstream processes. Flexible cure options include snap cure for fast production lines and box-oven cure for conventional manufacturing flows, both delivering consistent results.

By enabling faster operation, lower contamination risk, and improved cost stability, ATROX CD 560-1 expands the ATROX portfolio to address sustainability, throughput, and price stability across semiconductor assembly. The product reflects MacDermid Alpha’s continuous commitment towards environment, health, and safety (EHS) while maintaining the reliability and build quality required for advanced semiconductor devices.

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The global electronics manufacturing landscape is witnessing a massive structural realignment. According to recent trade data, India’s electronics exports surged by 11.62%, crossing the $5 billion milestone.
While the headline growth indicates strong momentum for India’s “Make in India” initiative, a deeper look at the data reveals a dramatic geopolitical and supply chain pivot: a sharp drop in trade with the United Arab Emirates (UAE) countered by an aggressive diversification into the United States (US) market.

The UAE Drawdown and Macro-Geopolitical Disruptions

Historically, the UAE has served as a primary re-export hub and secondary market for Indian-manufactured hardware. However, intensifying geopolitical tensions in the Middle East have severely strained traditional shipping lanes and trade corridors.
The impact on tech logistics is stark:

• The April Downturn: Electronics exports to the UAE nosedived, accounting for a mere 6.41% of India’s total electronics export basket in April.
• The Macro Shift: This represents a massive decline from the 2025-26 fiscal year, where the UAE captured 11.03% of India’s total tech exports, consuming over $5 billion worth of electronic goods.

Category-Specific Hit to Components & Hardware

The contraction wasn’t localized to just consumer units; it disrupted multiple hardware tiers where the UAE previously held dominant buyer positions:

• Smartphones: The UAE was formerly the second-largest buyer of Indian-assembled smartphones, representing a $4 billion+ segment.
• Enterprise & Infrastructure: The region plummeted from its status as a top destination for computer hardware and the third-largest destination for core electronic components.
• Regional Contraction: Parallelly, tech shipments to Israel dropped by 40% in April—notably impacting consumer electronics, printed circuit boards (PCBs), and telecommunication transmission equipment.

The US Tech Corridor: Absorbing the Supply Chain Deficit

This strategic shift completely offset regional losses 65% Exponential Surge: Electronics exports specifically to the US surged by 65%.

Net Positive Growth: This massive redirection of hardware volume pushed India’s total electronics export growth up by 24.4% in the tracked period, completely neutralizing the Middle Eastern bottleneck.

Silicon and Circuit Boards: What This Means for Global Hardware Sourcing

For enterprise hardware buyers, infrastructure architects, and supply chain officers, this pivot underscores two major trends:

• India’s Maturing EMS (Electronics Manufacturing Services) Ecosystem: The capacity to rapidly redirect billions of dollars in highly sensitive components—such as PCBs, transmission gear, and enterprise computer hardware—from one global superpower destination to another proves that India’s manufacturing logistics are becoming highly agile.
• De-risking is No Longer Theoretical: The 65% spike in US consumption shows that American enterprise tech pipelines are actively integrating Indian-fabricated hardware to establish multi-layered, resilient supply chains independent of traditional East Asian single-source hubs.

As India moves further up the value chain from basic smartphone assembly to complex multi-layered PCBs and enterprise computing systems, expect the US-India hardware corridor to solidify as a foundational pillar of global technology infrastructure.

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India’s leading UAV manufacturing startup, BonV Aero, is set to establish a 30-acre drone manufacturing campus in Khordha, Odisha. Envisioned as a first-of-its-kind concept in India, the facility will combine the latest UAV manufacturing with a curated visitor experience, offering firsthand engagement with the UAV ecosystem.

“The first time I saw a drone take flight, it left a lasting impression on me and shaped the path I chose,” said Satyabrata Satapathy, co-founder & CEO, BonV Aero. “Through BonV’s Drone Park, I hope to spark that same sense of awe and possibility in every visitor, especially young, aspiring minds who will go on to shape and secure India’s UAV future.”

That ecosystem is envisioned to take shape across the ₹300 crore facility. The campus will reimagine conventional manufacturing by bringing together advanced assembly lines and a Centre of Excellence alongside training rooms and certification halls open to pilots and technicians. At its core, the BonV Experience Centre will be designed to inspire and engage, offering something for everyone from knowledge seekers to thrill seekers. Thoughtfully designed visitor spaces, the campus will blur the lines between industry and experience, creating a destination that feels as much like a hub of innovation as it does a manufacturing facility.

Most UAV and defence manufacturing facilities in India keep visitors out. BonV Aero Drone Park does the opposite, opening its gates in a structured and guided manner to those seeking to understand how drones are designed, built, and flown all within a single integrated site, added Satapathy.

Moreover, the deep tech firm expects the facility to create over 1,000 jobs across manufacturing, research, and pilot training over the next two years, and sees the campus as a step toward making Odisha a hub for the wider drone economy, not just a production base. The launch comes as Indian states compete for investment in drone manufacturing, backed by federal production-linked incentives and a push for domestic UAV components. Odisha’s ambitious Aerospace and Defence Manufacturing Policy and the B-MAAN scheme for the aviation sector were cited as reasons for the company’s decision to set up in the state.

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Keysight Technologies, Inc. joins the Siemens Digital Industries Software Technology Partner Program. The collaboration gives customers access to Keysight Eggplant Test, an AI-driven test automation solution, to validate their digital engineering and product lifecycle management (PLM) environments.

Manufacturers face growing pressure to shorten development cycles while managing increasingly complex software-driven products. As engineering teams rely on digital tools like PLM platforms, testing those workflows, integrations, and system performance has become a significant operational challenge, with manual processes too slow and inconsistent to address at scale.

Siemens Digital Industries Software develops solutions for engineering, manufacturing, and product lifecycle management. Through the partnership, customers using the Teamcenter software can deploy Keysight Eggplant Test, an AI-driven test design and generation solution, to validate their enterprise applications and engineering workflows before they reach production.

Gareth Smith, Software Quality Engineering General Manager at Keysight, said: “As PLM environments grow in complexity, organizations need a reliable, AI-driven way to validate software before it reaches production. By joining the Siemens Digital Industries Software Solution Partner Program, engineers can use Keysight Eggplant Test to reduce the risk of undetected issues when upgrades or integrations are released, maintaining system performance and reliability at every stage of the product lifecycle.”

Resources

• White Paper: The Business Case for PLM Test Automation
• Survey: Complexity Overload and Bottleneck Struggles: The Hidden Costs of Manual PLM Testing
• Data Sheet: Testing the Product Lifecycle Management (PLM) Process with Keysight Eggplant Test

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New analyzers help engineers capture more signal behavior with faster measurements, reducing rework and accelerating wireless design and validation 

Keysight Technologies, Inc. introduces the Pro XA6 SA6320A and Expert XA5 SA6210A signal analyzers, designed to help engineers design and validate increasingly complex wireless systems faster and with greater confidence. As wireless systems evolve toward wider bandwidths, higher frequencies, and more advanced multi-antenna architectures, RF validation workflows are becoming more difficult and time-consuming. Even with multiple captures and repeated tests, engineers often lack complete visibility into signal behavior. These workflows can slow debugging, increase measurement uncertainty, and delay identification of signal impairments until late in development.

Keysight’s Pro XA6 SA6320A and Expert XA5 SA6210A signal analyzers address these challenges by enabling engineers to accelerate design, debugging, and validation workflows, reduce re-runs, and improve confidence when characterizing next-generation wireless, radar, and wideband systems. The Pro XA6 SA6320A delivers up to 8 GHz analysis bandwidth, full preselection up to 67 GHz, and advanced RF measurement capabilities for demanding wideband, millimeter-wave, radar, and electromagnetic spectrum operations applications. The Expert XA5 SA6210A delivers fast swept measurements up to 32 GHz, a wide analysis bandwidth up to 2 GHz, and dual-channel RF analysis in a single platform optimized for everyday wireless design and validation. 

The Pro XA6 SA6320A enables engineers to validate demanding wideband and high-frequency systems with deeper signal insights. Key capabilities include:

• Wideband Capture to 8 GHz: Up to 8 GHz analysis bandwidth captures wideband signals, enabling broader signal analysis and reducing workflow complexity.
• Extends High-Frequency Design and Validation: Frequency coverage up to 67 GHz supports next-generation wireless, millimeter-wave, radar, and spectrum operations applications.
• Improved Signal Clarity: Advanced displayed average noise level (DANL), phase noise, and EVM performance reveal low-level spurs, interferers, and wideband impairments.
• Accelerated 5G NR Analysis: Graphics processing unit (GPU)-accelerated demodulation speeds for wide bandwidth 5G NR error vector magnitude (EVM) measurements shortens analysis time.
• Regulatory Compliance with Wide RBW: Up to 80 MHz resolution bandwidth (RBW) supports standards-compliant signal measurements.

The Expert XA5 SA6210A helps R&D, validation, and manufacturing teams accelerate 5G, wireless local area network (WLAN), ultra-wideband, radar, pulsed RF, and general-purpose wireless test workflows. Key capabilities include:

• Accelerates Spur Detection: Fast, image-free swept measurements up to 32 GHz help engineers identify low-level signals and spurious emissions sooner.
• Simplified Validation: Dual-receiver architecture enables 5G NR and WLAN MIMO measurements and cross-correlated error vector magnitude (ccEVM), supporting single-instrument analysis of complex RF interactions.
• Broader Wireless Test Coverage: Up to 2 GHz analysis bandwidth supports advanced 5G, WLAN, radar, and general-purpose validation workflows.
• Greater Measurement Confidence: High RF measurement accuracy helps reduce EVM uncertainty and improve signal characterization.
• Streamlined RF Workflows: A larger display, redesigned user interface, and legacy X-Series SCPI compatibility help teams transition more quickly and efficiently.

Jun Chie, Vice President, Keysight Core Product Management, said: “Wireless design and validation are becoming significantly more challenging as engineers work with wider bandwidths, higher frequencies, and more complex signal environments. The Pro XA6 SA6320A and Expert XA5 SA6210A signal analyzers are built to help engineering teams capture more signal behavior in less time, increase measurement speed, and move from design and debug to validation with greater confidence.”

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Murata Manufacturing Co., Ltd. announces a new collaboration with Synopsys, Inc., enabling users of Synopsys’ simulation tools to navigate directly to Murata’s website to access and download the latest high-performance simulation models from Murata. The collaboration covers Synopsys’ 3D electromagnetic field analysis tool, Ansys HFSS, and thermal analysis tool Ansys Icepak, and marks a significant step toward streamlining the simulation workflow for electronic circuit designers. Murata is also the first company to offer passive component simulation models via Ansys Icepak.

As demand for high-speed, high-capacity communications continues to grow, electronic circuit design has become increasingly complex. Engineers must now account for a range of physical phenomena, from electromagnetic interference (EMI) to component heat generation, within a single design. Addressing these challenges early in the design process is critical; overlooking them can trigger costly redesigns, extend development timelines, and drive up prototyping expenses. This has placed greater pressure on electronic component suppliers to provide ready-to-use, high-quality simulation models that are compatible with the tools engineers already rely on.

Developing accurate models for electromagnetic and thermal analysis is inherently challenging, as both electromagnetic behavior and temperature distribution shift considerably depending on design conditions. Murata’s vertically integrated approach, spanning raw material development and manufacturing through to final product processing, enables the company to draw on an extensive proprietary dataset, resulting in simulation models that closely reflect real-world component performance.

The models are compatible with Ansys 2026 R1. Ansys HFSS supports electromagnetic field analysis and covers Murata’s RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak supports thermal analysis and covers Murata’s power inductors.

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Microchip Technology announces that its Nantes facility in France expands its Qualified Manufacturers List (QML) MIL‑PRF‑38535 certification scope to include QML Class Y, reinforcing the company’s commitment to delivering high‑reliability semiconductor solutions for aerospace and defense applications. The Nantes site expanded its certification scope from QML Classes V and Q to now include Class Y.

Microchip’s Nantes site has maintained QML certification to Classes Q and V since 1999, supporting the most demanding space and defense mission requirements. The addition of Class Y certification advances the facility’s capabilities to include additional packaging technologies, including non‑hermetic solutions, enabling higher levels of integration and supporting more advanced semiconductor architectures required by next‑generation military and space programs. 

“We’re honored to be a leading supplier of semiconductors to the aerospace and defense industry and continue to deliver the quality and reliability our customers depend on for critical missions,” said Patrick Johnson, senior corporate vice president of Microchip’s Aerospace and Defense Group. “Microchip’s products are in most military applications, and in space, we are virtually in everything that leaves Earth.”

With Class Y certification, the Nantes facility strengthens Microchip’s European manufacturing footprint for high‑reliability devices. The site also holds ESCC QML and AS9100:2018 certifications, positioning it among Microchip’s most highly qualified manufacturing locations for aerospace and defense solutions. 

The company’s Nantes facility is equipped to support the qualification and testing of its PIC64 High-Performance Spaceflight Computing (PIC64-HPSC), a series of 64-bit microprocessors (MPUs) that are radiation-hardened and radiation-tolerant for space exploration applications. This capability enhances Microchip’s ability to meet evolving customer requirements for electrical testing, qualification, and long‑term mission assurance in harsh operating environments.

Microchip has worldwide qualification sites in the United States and Europe, each certified to specific military standards and classes aligned with their product focus. In the U.S., the company’s site in San Jose, Calif., is qualified to MIL-PRF-38535 Classes Q, V, and Y, for advanced digital and space applications, while its site in Garden Grove, Calif., supports Class Q for analog and mixed-signal devices. The company’s Lawrence, Mass. facility provides capabilities under MIL-PRF-19500 and MIL-PRF-38534 Classes H and K for discrete and hybrid microelectronics. In Europe, in addition to the Nantes site, Microchip’s facility in Ennis, Ireland, is certified to MIL-PRF-19500 for its discrete manufacturing. These sites ensure consistent high-reliability qualification across regions without reliance on dedicated lab certifications.

Microchip has a broad portfolio of high-reliability solutions designed for the aerospace and defense market, including Radiation-Tolerant (RT) and Radiation-Hardened (RH) MCUs, MPUs, FPGAs, and Ethernet PHYs, power devices, RF products, timing solutions, as well as discrete components from bare die to system modules.

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Reducing Switching Losses and Increasing Efficiency, Devices Combine Low Qrr Down to 105 nC and VF Down to 1.45 V With Low Junction Capacitance, Fast Recovery Time, and Minimum Creepage Distance of 5.4 mm.

Vishay Intertechnology, Inc. expands its Gen 7 platform of 1200 V FRED Pt Hyperfast rectifiers with six new devices in the eSMP series SMPC HV package. Optimized for industrial, automotive, and energy applications, the 1 A, 2 A, and 3 A rectifiers not only offer the best trade-off between reverse recovery charge (Qrr) and forward voltage drop for devices in their class, but also provide the lowest junction capacitance and recovery time.

The Vishay Semiconductors rectifiers release include the VS-E7SX0112-M3V, VS-E7SX0212-M3V, and VS-E7SX0312-M3V, and AEC-Q101 qualified VS-E7SX0112HM3V, VS-E7SX0212HM3V, and VS-E7SX0312HM3V. To reduce switching losses and increase efficiency, the devices combine a fast recovery time of 50 ns with Qrr down to 105 nC typical, forward voltage drop down to 1.45 V, and junction capacitance down to 7.25 pF. The robust rectifiers offer non-repetitive peak surge current up to 70 A in a compact package measuring 4.3 mm x 6.5 mm with a low 1.1 mm profile, which is footprint-compatible with the TO-277A. Combined with a minimum 5.4 mm creepage distance and molding compound with a comparative tracking index (CTI) ≥ 600 (Material Group I), the devices reduce component counts and lower BOM costs based on IEC 60664-1 requirements for high voltage applications.

The VS-E7SX0112-M3V, VS-E7SX0212-M3V, VS-E7SX0312-M3V, VS-E7SX0112HM3V, VS-E7SX0212HM3V, and VS-E7SX0312HM3V will serve as clamp, snubber, and freewheeling diodes in flyback auxiliary power supplies and high-frequency rectifiers for bootstrap driver functionality, while providing desaturation protection for the latest fast-switching IGBTs and high-voltage Si / SiC MOSFETs. Typical applications for the devices include industrial drives and tools, on-board chargers and motors for electric vehicles (EV), energy generation and storage systems, and Ćuk converters and industrial LED SEPIC circuitry.

The rectifiers feature a planar structure and platinum-doped lifetime control that guarantee system reliability and robustness without compromising on performance, while their optimized stored charge and low recovery current minimize switching losses and reduce power dissipation. RoHS-compliant and halogen-free, the devices feature a Moisture Sensitivity Level of 1 in accordance with J-STD-020 and offer high temperature operation to +175 °C.

 

Device Specification Table:

Part #	IF(AV) (A)	VR (V)	VF at IF (V)	trr (ns)	Qrr (nC)	CT (pF)	IFSM (A)	Package	AEC-Q101
VS-E7SX0112-M3V	1	1200	1.45	50	105	7.25	19	SMPC HV	No
VS-E7SX0112HM3V	1		1.45		105	7.25	19		Yes
VS-E7SX0212-M3V	2		1.6		165	9.0	21		No
VS-E7SX0212HM3V	2		1.6		165	9.0	21		Yes
VS-E7SX0312-M3V	3		1.45		240	20	70		No
VS-E7SX0312HM3V	3		1.45		240	20	70		Yes

Samples and production quantities of the new Gen 7 rectifiers are available now, with a lead time of eight weeks.

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Rohde & Schwarz is driving the commercialization of 5G-based New Radio non-terrestrial networks, with successful certification of the highest number in GCF conformance test cases for NR-NTN to date. The validation covers all three domains, RF, RRM, and PCT.

Following the successful validation of the first 5G-based NR-NTN at the PTCRB (PCS Type Certification Review Board), Rohde & Schwarz continues its efforts to enable validation at the GCF (Global Certification Forum). The validated test cases within GCF WI-555 (Work Item) are defined in accordance with the 3GPP test specifications for RF (Radio Frequency), RRM (Radio Resource Management), and PCT (Protocol Conformance Testing) and were executed with Rohde & Schwarz conformance test solutions.

All measurements were conducted on the R&S TS8980 Conformance Test Platform, the R&S TS-RRM, and the CMX500 in frequency range 1 (FR1), verifying the latest NR-NTN chipset from Samsung as the device under test (DUT).

3GPP conformance testing is essential for ensuring that devices and networks comply with global standards. 5G NR-NTN testing presents challenges that extend beyond those encountered in traditional terrestrial networks, primarily due to the vastly different operating environment and the dynamic nature of satellite-based communication.

At the core of the Rohde & Schwarz conformance test solutions is the CMX500 5G one-box signaling tester, which also supports early research and development through integrated fading and channel emulation, along with an intuitive tool for visualizing satellite constellations – all in a single-box test setup. In addition, the user-friendly R&S CONTEST test system software platform facilitates the seamless execution of 3GPP test cases.

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ROHM develops the “AG16xFNxx Series,” a lineup of 80V power MOSFETs designed for 48V power supply systems, which are becoming increasingly common in automotive applications.

In the automotive sector, power demand is increasing, particularly in high-end vehicle models. 48V power supply systems are gaining attention as a highly efficient alternative to conventional 12V power supply systems. With widespread adoption expected around 2030, there is a growing need for 80V power MOSFETs capable of delivering even lower power losses than standard 100V devices.

ROHM’s new products enable downsizing in comparison to standard automotive MOSFET packages such as the TO-252 (6.6 × 10.0mm) by adopting the HPLF5060 (4.9 × 6.0mm) and DFN3333 (3.3 × 3.3mm) packages.

The HPLF5060 features Gull-Wing Leads, while the DFN3333 features Wettable Flank Technology, which contributes to improved reliability on PCBs (Printed Circuit Boards). Furthermore, by adopting Copper Clip Junction Technology to enhance heat dissipation, these devices are capable of handling high currents. All models comply with the automotive reliability standard AEC-Q101, ensuring high reliability.

The product lineup of these packages will be further expanded in the near future. In addition, development of TOLG (TO-Leaded with Gullwing, 9.9 × 11.7mm) packaged products has begun, with continued expansion of the lineup of high-power, high-reliability 80V MOSFETs.

Application Examples

Automotive 48V systems: Main inverter control circuits, electric motors, electric water pumps, etc.

 

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• Industrial-grade vibration sensor delivers the latest wide-bandwidth and dynamic range sensing.
• Intelligent sensor processing unit (ISPU 2.0) inside the sensor boosts signal processing and edge AI performance while reducing energy consumption.
• Provides the first compelling alternative to piezosensors for condition monitoring, combining performance, lightweight design, ease of integration, ultra-accuracy, and energy efficiency.

A global semiconductor leader serving customers across the spectrum of electronic applications introduces an intelligent vibration sensor designed for industrial condition monitoring that requires high accuracy, reliability, and energy efficiency.

Built using ST MEMS (Micro Electromechanical Systems) technology, the IIS3DWB10IS vibration sensor with intelligent sensor processing unit (ISPU 2.0) brings advance digital signal processing and AI inference closer to the sensing element. The result is a compact, rugged device that measures vibrations and shocks up to 200g at frequencies of 10 kHz and above. Combining digital precision and ease of use with a wide temperature range up to 125°C to withstand harsh conditions, the vibration sensor is engineered to help customers improve equipment uptime, reduce unplanned downtime, and support predictive maintenance strategies across industrial environments.

Vibration analysis is the dominant segment in condition monitoring, as many industries use rotating and oscillating machinery for cutting, shaping, moving, cooling, and other processes. The ability to prevent equipment stoppages through early detection of issues, such as predicting bearing failures in advance, helps companies across all sectors, including automotive and other manufacturing activities, to optimize production flow.

“Our industrial MEMS vibration sensor delivers the dynamic range and bandwidth needed for high-end applications and extends the advantages of ST in-sensor digital processing. Integrating the ISPU 2.0, with its new hardware accelerators for fast signal processing and AI inference, sharpens equipment-wear recognition while reducing latency and power consumption,“ said Simone Ferri, APMS executive VP MEMS sub-group. “Industries can expect a new generation of condition monitoring sensors, the first compelling alternative to piezosensors, that is lightweight, easy to fit and design, ultra-accurate, and energy efficient enough for battery-powered operations.”

“The IIS3DWB10IS delivers unique properties for our target markets and environments. Its high dynamic range, wide bandwidth, and high-temperature capability, combined with ease of adoption and a cost-effective, simplified circuit design, allowed us to replace the incumbent piezosensor technology. Moreover, the integrated ISPU 2.0 processor positions complex signal processing and rapid AI inference close to the sensing element, enabling smarter system responses,” said  Andrea Torcelli, Chief Technology Officer at Bonfiglioli S.P.A.

By enabling predictive and prioritizing maintenance, remote condition monitoring allows companies to improve equipment uptime and operating efficiency while eliminating unexpected failures and enhancing safety. Fortune Business Insights states the global market for this technology will exceed $5 billion by 2032, growing at over 9% CAGR1.

 

Further technical information:

The IIS3DWB10IS vibration sensor is the first digital sensor with wide bandwidth and embedded processing to deliver performance meeting the needs of high-end industrial condition monitoring applications, offering a compelling alternative to piezoelectric sensors.

Accurate measurement of vibrations above 10 kHz, with a large dynamic range up to 200g, combines with a noise floor as low as 35 µg/sqrt(Hz). This is comparable to the noise performance of piezoelectric sensors. Moreover, the IIS3DWB10IS delivers equivalent accuracy and sensitivity, adding digital-sensing advantages including smaller size, lower power consumption, simplified electrical and mechanical design, and greater flexibility in the computational partitioning.

ISPU 2.0 (Intelligent Sensor Processing Unit) introduces new hardware accelerators to perform real-time signal processing and AI at the edge. These hardware accelerators make frequently used functions faster and more power-efficient. The core is C-programmable and contains on-chip program and data RAM.

The supporting ecosystem provides software libraries that facilitate executing typical vibration monitoring algorithms in the ISPU, including FFT, filtering, envelope, velocity severity, and anomaly detection. With 40 MIPS and 40 MFLOPS digital signal processing, the ISPU 2.0 delivers up to four times the processing performance of the previous generation. In addition, the ISPU 2.0 sensor interface supports six times faster data transfer with the MEMS circuitry.

The IIS3DWB10IS also contains a 2048×80-bit FIFO register and an accurate temperature sensor. The sensor’s rugged MEMS-based design supports operation up to 125°C. The IIS3DWB10IS is supported in ST’s 10-year industrial longevity program. The IIS3DWB10IS is a 4.5 mm x 4.5 mm x 1.5 mm 16-lead LGA package with wettable flanks that facilitate automatic optical inspection in high-quality surface-mount assembly processes. The product is scheduled to be available by July 2026 from $25 for orders of 1000 pieces. 

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Advance robotics and the dynamic growth of humanoid systems are heralding the next stage of automation. Bosch is actively pushing ahead with key technologies for automation and robotics.

“Sophisticated sensor technology, software, and the efficient conversion of electrical energy into motion aren’t just technologically related to automated mobility; they’re the cornerstones of modern robotics,” said Stefan Hartung, chairman of the board of management of Robert Bosch GmbH.

Bosch was quick to respond to the growing demand for automation and robotics technologies and is already a sought-after and attractive commercialization partner and component supplier worldwide.

“With the advent of humanoid robotics, the demand for Bosch components and solutions is increasing”, Hartung added.

With its comprehensive expertise, the company is well-positioned to participate in the growth of the robotics market. Bosch sees the potential to develop a business worth billions in this field. The company is putting its faith in synergy effects to achieve this. “We’re combining proven technologies from various business sectors with visionary innovations to drive forward the industrial scaling of robotics – all the way to humanoids,” Hartung said. “We also hope that committing to this course will strengthen Europe as a technology location.” Moreover, Bosch is making targeted use of automation to increase the competitiveness of its German plants compared to the rest of the world, as well as to counteract the ever more acute shortage of skilled workers.

Robotics needs a delicate touch

“Bosch is moving the future on wheels and with arms,” says Tanja Rueckert, member of the board of management of Robert Bosch GmbH. The company is deploying its cross-domain automation expertise from the car to the factory to the home as its decisive advantage in shaping this growth market. Bosch is positioning itself not as a manufacturer of humanoid robots, but as a leading supplier and partner for the “brain and nervous system” of modern automation and robotics. At the heart of these flexible solutions is Bosch’s open ctrlX AUTOMATION platform. This makes robotics accessible, modular, and quick to integrate. The Bosch Rexroth division is currently implementing several customer projects in this area.

Robots need a keen sense of touch so that they can interact safely and precisely with their environment, whether in the factory or in the home. A tiny but indispensable technology gives robots precisely this tactile sense: microelectromechanical systems, known as MEMS sensors. They are the key to enabling robots to handle objects with the necessary finesse and react sensitively to physical contact. For example, it’s these sensors that give a robot the ability to precisely adjust its grip to a robust water glass or a delicate stemmed glass. “Humans have 4 million touch sensors. If we were to build robots with just as many sensors, then 4 years’ worth of worldwide sensor production would barely be enough for 12,500 robots,” Hartung says. This figure illustrates the immense potential in the future of automation and robotics. According to the Yole Group, a market research and strategy consultancy, the market for MEMS sensors is expected to grow to over 19.2 billion U.S. dollars by 2030 and achieve an average annual growth rate of 4 percent.

Bosch is working to further develop cognitive robots

To accelerate development in automation and robotics, Bosch is relying on a combination of in-house innovation and an open ecosystem approach. The company’s GmbH is an optimal unit that focuses on the development and commercialization of new robotics solutions. At the same time, Bosch is continuing to drive forward industrial scaling through strategic partnerships. For example, the company is working together with deep manufacturing expertise. Bosch also acts as a key partner for leading robotics startups from around the world, including Humanoid from the U.K., and other U.S. and Chinese partners, is bringing their prototypes to production scale. Bosch Robotics Center China (BROC) is driving forward the development of physical AI and the commercialization of robotics solutions.

In addition to the robots’ “intelligence,” Bosch’s strength lies in the crucial components that give robots their physical performance. Bosch Rexroth has a comprehensive portfolio of key components for modern robotics and factory automation. These include high-precision electric motors and powerful servo drives that ensure dynamic and precise movements, as well as CtrlX AUTOMATION for smart, flexible control of robots for a range of environments and requirements. Bosch also offers complex assemblies and subsystems that give robots the power, speed, and precision they need, meaning these components serve as the technological backbone for various automation tasks. Moreover, Bosch can provide support with factory equipment for robotics manufacturing, for example, with Rexroth conveyor systems.

Unique treasure trove of data from over 230 plants worldwide

Artificial intelligence (AI) is the engine that gives automation and robotics new capabilities. “The combination of cutting-edge electronics and mechanics with AI puts significant technological breakthroughs in automation and robotics within reach,” Rueckert says.

For example, it enables robots to perceive their environment, understand processes, and learn from experience. Bosch builds this key technology firmly into its strategy and uses it on two levels. First, the company is bringing AI models from the cloud directly into its physical products to enable automated operation. Second, Bosch already makes extensive use of AI in its own manufacturing.

“Our decisive competitive advantage is not the machinery alone, but the data from our global manufacturing network,” Rueckert says. This treasure trove of data is the raw material for the development of intelligent automation solutions in the future. In addition, to translate human expertise into machine-readable data, Bosch uses special data suits that record complex movement sequences as a basis for training.

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Solutions, a global technology manufacturer of hardware and software. Key drivers of the global investments in AI infrastructure and AI server applications are currently the high demand for highly complex server boards, which is leading to an increased need for SMT solutions for technologically sophisticated manufacturing processes.

New order bookings in the first quarter were more than double last year’s amount. Business in Asia showed particularly strong growth. The company also saw a noticeable increase in demand for SIPLACE placement solutions in the Americas and in Europe. In light of these welcome developments, ASMPT SMT Solutions expects its business to keep growing strongly for the rest of fiscal 2026.

“The dynamic growth surrounding AI server applications has exceeded our already high expectations,” explains Josef Ernst, CEO of ASMPT SMT Solutions.

Especially when it comes to the assembly of highly complex server boards, the demands on precision, process stability, and productivity are rising dramatically. It is precisely in these applications that our solutions are currently demonstrating their strengths worldwide.

AI servers are placing new demands on electronics manufacturing.

Placement solutions for modern AI server boards must be capable of handling both heavy, large-format, high-performance BGAs and thousands of highly miniaturized components from 016008M size with great reliability, precision, and productivity.

The combination of ever-larger printed circuit boards, rising component complexity, and the highest demands on accuracy and process stability presents new challenges for SMT manufacturing. Consequently, there is a need for placement solutions that intelligently combine high speed, maximum precision, and stable processes. In this context, the interplay between integrated hardware and software, as well as global service, is becoming increasingly important.

“Today, our customers no longer evaluate individual machines alone, but rather the performance of complete solution environments,” says Josef Ernst. “Global presence, local support, and the close integration of hardware, software, and service are becoming increasingly important.”

Focus on the supply chain and delivery capability

At the same time, high demand is creating new challenges for global supply chains. Geopolitical uncertainties, rising logistics costs, and the highly dynamic market are increasing pressure on supply chains, manufacturing, and service organizations. ASMPT SMT Solutions is therefore making targeted investments in expanding global delivery and service capacities to reliably support customers worldwide.

“In market phases like these, it quickly becomes clear just how resilient a manufacturer really is,” explains Josef Ernst. “Our customers rely on us to deliver and provide first-class service worldwide. That is exactly where our focus lies right now.”

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As India accelerates its transition to electric mobility, the focus is shifting from adoption to scale, efficiency, and affordability. Bosch is set to support this next phase by introducing its latest third-generation Silicon Carbide (SiC) semiconductors in India. Designed to improve the performance and efficiency of electric vehicles, the new chips will also contribute to the development of a stronger local mobility ecosystem.

Silicon carbide (SiC) semiconductors are central to improving the efficiency of electric vehicles. They control the flow of energy within the power electronics system – particularly in the inverter and ensure that energy from the battery to the electric motor is converted as efficiently as possible. With this new generation, Bosch is delivering approx 20% higher performance, supporting India’s rapidly growing EV market. For the end-user, this means longer driving ranges without larger batteries, improved battery utilization, and ultimately, a lower total cost of ownership.

“Our advanced SiC technology is designed to deliver the tangible benefits that Indian consumers demand – longer driving range, faster charging, and lower long-term costs,” said Sandeep Nelamangala, Joint Managing Director, Bosch Limited, and President, Bosch Mobility India. “By making high-efficiency power electronics more accessible, we are helping to unlock the full potential of the EV market, making clean, efficient mobility a reality for everyone in India.”

With over 60 million SiC chips already delivered worldwide, Bosch brings proven power semiconductor expertise to support the next phase of India’s electrification journey. The company continues to invest billions of euros in expanding its global semiconductor capabilities, creating a strong foundation for innovation, supply resilience, and future growth. As India advances its ambitions in electric mobility, localization, and advanced manufacturing, Bosch aims to support customers and ecosystem partners by bringing together global semiconductor expertise and local ecosystem development.

With its third-generation SiC chips, Bosch is taking this technology to the next level. “Our ambition is clear: we want to be a globally leading manufacturer of SiC chips,” said Markus Heyn, member of the Bosch board of Management and chairman of the Bosch Mobility business sector. “With our next-generation SiC chips, we are helping our customers put even more powerful and efficient electric vehicles onto the road.”

Bosch’s Gen 3 SiC technology enables more compact and efficient power electronics designs by reducing energy losses, improving thermal performance, and lowering system complexity and cooling requirements. Miniaturization is a key enabler for long-term cost efficiency, as it allows more chips to be produced per wafer. In this way, Bosch is contributing to making high-performance electronics more widely accessible.

The advantage makes advanced power electronics relevant not only for premium vehicles but also for mass-market EV segments, where efficiency, affordability, and reliability are critical due to the optimal combination. Bosch is bringing advanced semiconductor innovation closer to the needs of India’s evolving mobility landscape and supporting the next phase of efficient, scalable, and sustainable electric mobility in the country.

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Vishay Intertechnology, Inc. announces an expansion of its ILHB series of Automotive Grade multilayer chip ferrite beads for high current filtering. The Vishay Dale devices now offer higher current capability, smaller case sizes, and a wider range of impedance values to meet a broader set of EMC noise reduction requirements.

The ILHB series is now available in 0402, 0603, 0805, 1008, and 1206 case sizes with current handling up to 6 A and impedance values from 10 Ω to 2700 Ω. The expanded lineup allows designers to achieve higher current handling in smaller packages, while delivering two to three times the current capability for the same package size and impedance value.

The immense range of sizes, current handling, and impedance values allows the ILHB ferrite beads to be used in a wider array of EMC noise reduction applications. These include high current, high frequency, and signal-specific filtering in automotive energy distribution and management systems; industrial automation systems; home and building controls; computers and computer peripherals; consumer devices; white goods; medical instrumentation; avionics; and telecom infrastructure.

The ILHB product datasheets optimize with additional design parameters that help engineers estimate bead performance across more frequencies without consulting multiple performance graphs to simplify device selection. These parameters include impedance peak value and frequency, the frequency at which impedance drops below the nominal value, and the X- and R-frequency crossover point.

The AEC-Q200 qualified devices feature a silver (Ag) inner conductor with copper (Cu), nickel (Ni), and tin (Sn) plating. The ferrite beads operate over a temperature range from -55 °C to +125 °C and are RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table:

Part number	IHLB-0402	IHLB-0603	IHLB-0805	IHLB-1008	IHLB-1206
Case size	0402	0603	0805	1008	1206
Dimensions (mm)	1.0 x 0.5 x 0.5	1.6 x 0.8 x 0.8	2.0 x 1.2 x 0.85	2.5 x 2.0	3.2 x 1.6
Z at 100 MHz (W)	10 to 1800	22 to 2500	17 to 2700	300 to 600	19 to 1000
DCR max. (mW)	18 to 2400	7 to 1800	10 to 800	30	10 to 300
Rated DC current at 85 °C (1) (A)	0.05 to 3.1	0.05 to 6	0.2 to 6	4	0.5 to 6
Zpk (2) (W)	19 to 3738	28 to 2526	21.6 to 31 868	554 to 670	32.68 to 1167
F at Zpk (3) (MHz)	97 to 1329	78 to 1000	72 to 1132	122 to 155	61 to 2921
Z typ. at 100 MHz (W)	10 to 2038	22 to 2200	17 to 2713	309 to 517	17.2 to 1000
F at ZDO (4) (MHz)	125 to > 10 000	100 to 8000	84 to 8000	138 to 222	100 to > 10 000
XL / XR x over (5) (MHz)	31 to 710	26 to 439	23 to 298	100 to 117	25 to 120

 

• Rated current is the DC that causes a 40 °C temperature rise at 20 °C ambient
• Zpk = peak of impedance curve
• F at Zpk = frequency of Zpk
• F at ZDO = frequency above 100 MHz where Z drops to nominal Z
• XL / XR x over = crossover point for inductive reactance and resistance impedance

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Qorvo introduces an X-band radar front-end solution that enables defense system designers to achieve higher performance without increasing size, weight, or prime power. The design targets modern phase array and multifunction sensors. The solution combines transmit power, efficiency, and receive sensitivity in a single compact module, addressing key challenges in next-generation radar design.

 

The Qorvo QPF5012 is a fully integrated X-band transmit/receive front-end module operating from 8.5 to 10.5 GHz, delivering 10W of transmit power.  With 42 percent power-added efficiency and 2.1 dB noise figure in a 7 x 5 mm package, the QPF5012 enables designers to extend radar range, reduce thermal load, and improve detection sensitivity without increasing system complexity. 

“Radar designers have historically been forced to trade off output power, prime power, or sensitivity,” said Doug Bostrom, general manager of Qorvo’s Defense and Aerospace business. “With the QPF5012, Qorvo brings all three together in a compact integrated front-end module, helping customers simplify design, reduce thermal constraints, and improve real-world radar performance.”

 

QPF5012 is specifically built for X-band phased array radar applications where size, weight, and power (SWaP) and thermal performance are critical. Its high level of integration reduces component count and simplifies system design while maintaining constant efficiency and RF output power across changing antenna loads. This enables AESA systems to deliver more consistent RF performance across varying scan angles. Qorvo enables this integration through vertically integrated RF design expertise, advanced multi-technology packaging, and trusted manufacturing capabilities.

Key Features of QPF5012:  

• 10W saturated transmit power across 8.5 to 10.5 GHz  
• 42% power-added efficiency to reduce prime power consumption and thermal load  
• 2.1 dB noise figure to improve receive sensitivity and detection accuracy  
• Integrated T/R functionality in a compact 7 x 5 mm module to reduce SWaP and design complexity. 

 

By delivering power, efficiency, and sensitivity together in a single integrated module, Qorvo enables defense radar designers to overcome traditional design constraints and achieve higher system-level performance in a compact front-end architecture.

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The ASM330LHHG1 automotive qualifies as an Inertial Measurement Unit (IMU), which operates from -40°C to 125°C, mounts in vehicle zones, including those where the ambient temperature may be a concern. Combining low-noise sensors, temperature compensation, and a 6-channel synchronize output, the IMU fulfils the industry’s need for greater dead-reckoning accuracy to support navigation and positioning.

Today’s cars, vans, and trucks, as well as industrial and agricultural vehicles, can leverage increasingly accurate GNSS positioning technologies for applications such as routing, tracking, navigation, and driver assistance. These new and latest systems need high-quality dead reckoning to maintain continuity between satellite updates and provide effective fallback during GNSS outages or corruption, ensuring superior performance and greater resilience.

ST’s ASM330LHHG1 meets this need by delivering 3-axis accelerometer and 3-axis gyroscope data through its synchronized output that ensures consistent signal timing for dead-reckoning calculations, motion-data correlation, and GNSS fusion. Both sensors leverage the latest MEMS processes for low noise and benefit from built-in temperature compensation for enhanced stability.

The IMU provides accurate data for other non-safety applications throughout the vehicle, with an accelerometer full-scale range of ±16g and an extended gyroscope range covering ±125dps to ±4000dps with minimal bias drift. These include vehicle-to-everything (V2X) systems, telematics, eTolling, anti-theft, impact detection, crash reconstruction, driving comfort, vibration monitoring and compensation, and general motion-activated functions.

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Engineers can build safer, higher-performing electric vehicles and energy storage systems with TI’s new BQ79826Z-Q1 battery monitor

News highlights:

• The industry’s first 26-cells-in-series channel battery monitor delivers best-in-class sensing accuracy, reducing system costs by supporting more cells per device than competing solutions.
• Integrated smart EIS engine enables early warning of thermal runaway from inside battery cells, helping ensure safety in EVs and ESSs.
• Supports engineers to create safer, higher-performing automotive and industrial applications, the BQ79826Z-Q1 is the latest addition to TI’s portfolio of BMS devices.

Texas Instruments (TI) today introduced the industry’s highest-cell-count battery monitor with an integrated electrochemical impedance spectroscopy (EIS) engine, bringing predictive intelligence, comprehensive data, and real-time diagnostics to battery monitoring in electric vehicles (EV) and Energy Storage System (ESS) applications.

The BQ79826Z-Q1 battery monitor enhances safety and extends battery life by detecting potential failures from within battery cells. The single chip delivers the highest cell count monitoring in its class, tracking up to 44% more channels than previous generations. With this increase in channels, the device significantly decreases the number of components required in a battery pack, reducing system complexity and cost without compromising reliability.

“The electrification of transportation and the rapid expansion of energy storage are redefining what battery performance must deliver, and as a leader in battery management technology, TI is uniquely positioned to meet that challenge,” said Wenjia Liu, vice president and general manager, battery management systems (BMS) at TI.

Delivering safety and performance with EIS technology

Just as an electrocardiogram (EKG) monitors the heart, EIS monitors a battery. It delivers continuous, real-time insight that reveals the battery’s health and warns of issues before they become critical. Integrated EIS technology enables the BQ78926Z-Q1 to detect fault conditions earlier from inside the cells helping maintain safety and notifying passengers of potential vehicle hazards such as thermal runaway.

These same benefits extend to ESSs, where reliable battery monitoring is critical to meeting the growing power demands of artificial intelligence data centers. As effective storage solutions become increasingly vital in the grid-to-gate ecosystem, EIS gives engineers real-time visibility into the state of charge and state of health of each battery cell, regardless of system size.

Maximizing efficiency with industry-leading cell count

The performance of an EV or ESS is fundamentally affected by the quality and efficiency of its batteries. The BQ79826Z-Q1 supports up to 26 cells per device, eight more than any competing solution, setting a new industry standard. Fewer monitoring devices mean a lower bill of materials, simplified architecture, and reduced board space requirements, translating to meaningful cost savings per channel without sacrificing quality or reliability.

When paired with the BQ79881-Q1 pack monitor and optional TI communications bridge, these devices create a powerful chipset that works across different module sizes, battery chemistries, and mechanical designs, giving engineers the flexibility to design once and deploy everywhere. This scalability reduces engineering overhead and accelerates time to market for automotive and energy storage designers.

Calculating charge readings with the best-in-class accuracy

With a voltage accuracy of <2mV across a full temperature range of –40°C to +125°C, higher resolution analog-to-digital converters, and ultra-low noise, the BQ78926Z-Q1 enables more accurate state-of-charge calculations, directly addressing one of the biggest concerns for EV drivers: range anxiety. Utilizing EIS technology, this device enables more accurate temperature and state-of-charge estimation, helping designers achieve longer battery life and faster charging without compromising battery health. With an EIS measurement time that is five times faster than previous solutions, this device delivers the highest functional safety voltage reading per cell. Compliance with Automotive Safety Integrity Level D and International Organization for Standardization 26262 gives designers a smarter, more efficient path to safer, longer-lasting batteries.

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The localized website reinforces DigiKey’s commitment to supporting Vietnam’s dynamic and fast-growing electronics and automation industries

DigiKey, the global distributor of electronic components and automation products, announces the launch of its regional Vietnam website. The new website is tailored to meet the escalating demand for robust supply chain solutions in Vietnam’s expanding electronics and manufacturing sectors.

Vietnam’s exports of computers, electronic products, and components reached $30.72 billion in Q1 of 2026, a 45.5% year-on-year increase, according to Vietnam Customs, underscoring the industry’s role as a leading driver of export growth. Vietnam also remained one of the world’s top mobile phone exporters, ranking third globally, making it an ideal market for DigiKey to support as it grows as a key hub for global electronics manufacturing and supply chain diversification.

“The new DigiKey Vietnam website demonstrates our commitment to supporting our partners and customers in one of Asia’s most dynamic markets,” said Dave Doherty, CEO for DigiKey. “This new platform gives Vietnamese customers access to DigiKey’s global inventory of more than 18 million products, with an emphasis on tailored, localized support and faster, frictionless digital tools. We are thrilled to empower Vietnam’s electronics industry with improved supply chain visibility and custom solutions.” 

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The study lays out six levers to help the sector ease execution bottlenecks, which improve delivery capacity and unlock transformation at scale.

India’s aerospace and defence (A&D) sector is entering a high-growth phase. Still, execution constraints emerge as the biggest risk to sustaining momentum, according to a new PwC India study titled ‘Accelerating aerospace and defence manufacturing through operational excellence and supply chain resilience’.

The A&D sector is ready to play a catalytic role in India’s economic transformation, helping drive the nearly 16-fold expansion in manufacturing needed to realise the country’s ambition of a $30 trillion economy by 2047. While strong demand, rising exports, and policy support have firmly positioned A&D manufacturing as a key pillar of India’s economic growth, the study highlights that large order backlogs—potentially taking up to a decade to clear—could test the sector’s ability to deliver at scale.

“For India’s aerospace and defence sector, the next phase of growth will be shaped not just by demand, but by the ability to execute with consistency, speed, and precision with scale. Companies that strengthen planning, modernise operations, and build resilient, digitally connected supply chains will be best placed to convert today’s order pipeline into timely, high-quality output at scale,” says Captain Vishal Kanwar, Aerospace Defence and Space Leader, PwC India.

Execution is the real challenge, not the demand

India’s A&D sector is at a turning point. Demand is strong. Exports are rising. But the next phase will be defined by one thing: execution at scale. India now exports defence products to nearly 100 countries. Domestic defence production reached a record ₹1.54 lakh crore in FY25. Yet, large order books are creating pressure on delivery capacity.

For major manufacturers, order backlogs are already significant:

•  1.71x to 6.88x order book-to-revenue multiples
•  2–7 years of execution backlog
•  In some segments, up to 5–10 years to clear existing orders

This points to a clear structural challenge. As Dinesh Arora, Partner and Leader, Advisory, PwC India, notes: “The real test for India’s aerospace and defence sector is no longer whether demand exists, but whether the ecosystem can execute with speed, precision, and resilience. As order books expand, companies will need to move beyond incremental capacity addition and fundamentally strengthen planning, shopfloor productivity, supplier coordination, and digital integration. Those that build these capabilities early will be better positioned to convert growth momentum into reliable, globally competitive delivery. Put simply, India has the opportunity. Now it must build the execution engine to match it.”

The blueprint to convert backlog into output

To address the widening gap between order books and execution capacity, the study outlines six priority transformation areas:

• Supply chain efficiency
• Operational excellence
• Planning and governance
• R&D acceleration
• Workforce productivity
• Digital integration (digital thread)

These transformation levers will help the sector move from backlog-led growth to execution-led scale—from stronger operations and shopfloor discipline to digital integration, fostering indigenous vendor ecosystems and supply chain resilience, and smarter use of advanced technologies. These shifts collectively enhance productivity, minimise rework, and provide manufacturers with the necessary tools to execute operations faster, more reliably, and in line with global competitive standards.

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