ELE Times

The winners of the 2026 Infineon Start-up Challenge – the competition for critical technologies for the next generation of humanoid robots – have been announced by Infineon. After four months of hard work, the jury finally chose 15 startups from more than 100 submissions to pitch their solutions during the Infineon Start-up Challenge Demo Day at EBSCON – the Electronic Based Systems Conference in Graz, Austria.

The challenge united start-ups from Europe and Asia, investors, industry innovators, and technology leaders around robotics and physical AI innovation. The participants innovated solutions to enable humanoid robots to more effectively sense their surroundings and interact with the environment, handle objects, and execute precise movements. The winners were chosen by an international jury of industry, venture capital, start-up ecosystem, and technology innovation experts.

“Strategic collaboration with start-ups creates a win-win situation, combining novel ideas with industrially proven semiconductor technologies and thereby accelerating innovative, market-ready applications,” said Sören Jehmlich, Vice President Ventures, Start-ups & Ecosystems at Infineon. “The Start-up Challenge is a key pillar of our innovation culture, bringing together entrepreneurial courage, technological expertise and rapid implementation.”

“The quality of innovation we have seen throughout this year’s challenge has been remarkable. Start-ups from Europe and Asia demonstrated how diverse perspectives and technologies can come together to solve some of the most important challenges in humanoid robotics. Programs like the Infineon Start-up Challenge are essential for connecting innovators across regions and accelerating the path from breakthrough ideas to real-world impact,” highlights Jerry Park, Director Asia Pacific at Infineon.

The winners are shaping the future of humanoid robotics

First place went to AdapTronics S.r.l. from Italy with its innovative gripping technology, which allows robots to safely handle a wide variety of objects without conventional suction cups or mechanical grippers. Such flexible object handling is a key capability for next-generation humanoid robots. The technology also addresses applications in logistics, packaging, and future space-robotics. The jury highlighted its versatility, innovation, and potential for industrial use. “Winning the Infineon Start-up Challenge is a great recognition of our team’s work and vision,” said Lorenzo Agostini, Founder and CEO at AdapTronics S.r.l. “The challenge gave us valuable access to technology experts, industry insights and a strong innovation network. We look forward to further advancing our solution and exploring new opportunities for collaboration.”

COSMOKE and TECHiFAB complete the podium

Second place went to COSMOKE from South Korea. The start-up developed COSKIN, an innovative flexible magnetic tactile sensing technology that enables humanoid robots to perceive touch, pressure, and physical interactions. By providing essential tactile feedback for dexterous manipulation and safer human robot interaction, COSKIN plays a key role in advancing next-generation humanoid robotics and physical AI.

TECHiFAB from Germany took third place with its In-Memory Computing based approach to real-time motor control for robotic actuators. This is physical AI by definition and is designed to enable faster, more energy-efficient and safer control while improving performance directly within the drive train of humanoid robots.

The solutions presented during the challenge reflect the technologies required for the next generation of humanoid robots, from tactile sensing to dexterous gripping and precise motor control. To support the start-ups in developing and validating their concepts, Infineon provided access to dedicated hardware and software platforms, including Environmental Sensing Kits, Artificial Skin Kits, Motor Control Kits, Visual Feedback Kits, and in-house AI development software, enabling teams to accelerate prototyping and transform innovative ideas into scalable applications.

“Humanoid robots are the most complex form of physical AI and highly relevant for Infineon,” said Dirk Geiger, Senior Director & Team Lead Humanoid Robotics at Infineon. “They combine power, sensing, real-time connectivity, safety and security with software and AI compute, turning machines into autonomous systems. No single company can master
this complexity alone. With the Start-up Challenge, we gave start-ups early access to our hardware stack as well as our software and system offering and brought them together with our partners and application experts. The solutions shown prove how quickly ideas can become building blocks for scalable humanoid platforms and give valuable insight into where the technology is heading.”

The Infineon Start-up Challenge is part of the global Infineon Start-up Co-Innovation Program, in which Infineon collaborates with start-ups as a technology and development partner. As the winner of the Infineon Start-up Challenge 2026, AdapTronics will now join the Infineon Start-up Co-Innovation Program to further develop and scale its solution together with Infineon. The collaboration will officially kick off at the Start-up Night in Munich in November, where Infineon showcases successful start-up partnerships and highlights the value of start-up-driven innovation. Infineon continues to engage with other promising participants for future technological and business collaboration. By combining the agility and creativity of start-ups with Infineon’s technological expertise and global capabilities, the program supports the development of scalable applications and accelerates innovation in humanoid robotics and physical AI.

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Infineon Technologies AG is expanding its technology partnership with NVIDIA based on 800 Volt direct current (VDC) power architectures for AI data centres. The latest from the companies is an announcement timed to NVIDIA’s GTC Berlin developer conference based on the high-voltage intermediate bus converter (IBC), which is one of the most critical and challenging conversion stages in the power chain of AI data centres, with Infineon’s gallium nitride (GaN) emerging as a preferred technology. This builds on the companies’ prior collaboration announced in May 2025, and elaborated on in October 2025, which included power-path protection and hot-swap functionality for 800 VDC server architectures.

“AI is fundamentally reshaping the demands we place on power infrastructure, and semiconductors are at the heart of solving that challenge,” said Jochen Hanebeck, CEO, Infineon Technologies AG. “Our collaboration with NVIDIA on 800 Volt power architectures shows what is possible when deep semiconductor expertise meets the pace of innovation required by AI. Gallium nitride-based system solutions are a key enabler of this next generation of data centres, and Infineon is proud to help power the AI era from grid to core.”

The growing power demands of AI workloads have driven data centre designers to adopt intermediate-bus architectures. An intermediate bus converter (IBC) steps down the main DC bus voltage and supplies a lower voltage to subsequent power-conversion stages, which generate the voltage levels required by AI processors. This multi-stage approach helps manage power-distribution losses and improve overall efficiency while meeting strict constraints on board space, thermal management and system reliability. As AI computing requirements grow, 800 VDC is emerging as an additional power-distribution approach designed to support higher power densities in AI data centres.

Gallium nitride is well suited to meet these requirements. Compared to silicon, GaN allows power devices to switch significantly faster with lower losses, which enables higher switching frequencies of up to 1 MHz at the IBC stage. This in turn allows the size of magnetic components and passives to shrink considerably, directly translating into higher power density and lower board heights, a critical advantage as rack space becomes an increasingly scarce resource in AI data centres. At the same time, GaN’s low conduction and switching losses support best-in-class conversion efficiency, helping to limit heat generation even as power levels per rack continue to climb toward the megawatt range. These characteristics make GaN the preferred semiconductor technology today capable of meeting the combined demands of power density, efficiency, and fast transient response at the IBC stage, a position Infineon has built on the back of many years of leadership in GaN development and manufacturing. In combination with PSoC control C3 and EiceDRIVER product families, full system solutions for IBCs are provided by Infineon.

Infineon’s GaN portfolio supports the full range of conversion ratios required at the HV IBC stage, including 800 V to 50 V, 800 V to 12 V, and 800 V to 6 V, giving data centre operators the flexibility to optimize rack architectures without compromising on power density or efficiency. At this combination of high switching frequency, power density and efficiency, the GaN power switches are used to their full benefits. Infineon’s technology leadership in power semiconductors relies on extensive in-house manufacturing capabilities as well as application and system expertise built up over many years. The company’s portfolio spans IBC solutions across silicon, gallium nitride and silicon carbide, supporting customers along the entire range of their design requirements.

Infineon and NVIDIA collaborate along the entire data centre power chain. In addition to IBCs, this also includes power path protection solutions, as announced in October 2025, targeting safety and service aspects such as the hot-swap controller functionality and enabling future server boards to operate in 800 VDC power architectures.

This advanced collaboration underscores Infineon’s position as a grid-to-core power semiconductor partner for AI infrastructure, supplying solutions across the full power delivery chain, from grid-facing power supply units to the point of load at the processor.

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Keysight Technologies, today announced the Functional Interconnect Test Solutions (FITS)-16CH digital-layer error performance validation system, expanding Keysight’s FITS portfolio for optical, active copper, and passive copper interconnects. With 16 transmit and 16 receive channels, FITS-16CH has twice the channel density of FITS-8CH, and is designed to validate complete interconnect assemblies across research and development, product design, manufacturing, and pre-and post-production AI and network infrastructure deployments.

As interconnect speeds increase, testing only the physical-layer does not provide a complete view of system-level error performance. FITS-16CH combines bit error ratio (BER) and forward error correction (FEC) measurements at the digital layer to evaluate how complete interconnect assemblies perform under real-world conditions. The platform enables 106G and 212G lane-rate validation for today’s 800G interconnects and emerging 1.6T technologies.

FITS-16CH supports validation across a broad range of optical and electrical interconnects. These include full-retimed optics (FRO), active optical cables (AOCs), linear-retimed optics (LRO), linear pluggable optics (LPO), active copper cables (ACCs), active electrical cables (AECs), passive direct attach cables (DACs), and high-speed copper flyover cables used in networking and high-performance computing equipment. The platform also supports development and manufacturing workflows for silicon chips, networking equipment, and interconnect products, as well as performance benchmarking for data centre operators.

Key capabilities include:

• Higher channel density for complete-assembly validation: With 16 transmit and 16 receive channels, FITS-16CH is designed to test fully assembled interconnects using two Module Compliance Boards (MCBs) with independent channel groups and MCB controls, enabling teams to validate interconnect performance on more lanes simultaneously, ensuring a high degree of system-level qualification.
• Broad interconnect support and insertion-loss capability: A large insertion-loss budget supports signals across lossy channels and customer fixtures, enabling validation of a broad range of optical and copper interconnects, including active copper and high-speed copper flyover cables.
• Automated lane tuning: The FITS Windows 11 graphical user interface integrates FITS-16CH with the Keysight DCA-X to automatically calculate optimal transmit finite impulse response (FIR) tap settings and open the electrical eye. The automated process can reduce tuning time to a few minutes compared with manual tuning that can take hours, days, or even weeks.
• Flexible integration and automation: FITS-16CH can integrate as a transmitter or receiver with Keysight data communications analysers (DCAs), high-performance bit error ratio testers (BERTs), and UXR real-time oscilloscopes. The platform supports automated validation workflows with Standard Commands for Programmable Instruments (SCPI) API support, automatic real-time charts and data tables, pass/fail flagging, and PDF and .csv report generation. The solution reduces validation complexity by using the common FITS software framework, providing a familiar environment across the FITS portfolio.

Ameet Suri, Vice President of Product, Credo Technologies, said: “The tighter margins at 1.6T make it essential to evaluate active electrical cable performance at the system level, not in isolation for each link. Keysight’s solutions give Credo a practical way to test our AEC cables during development and qualification, so issues surface sooner and designs reach production with greater assurance.”

Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: “As interconnect speeds increase, manufacturers need to validate more lanes simultaneously on many types of interconnects without adding unnecessary complexity to their labs. FITS-16CH expands our functional interconnect validation portfolio with the capacity, flexibility, and automation needed to help engineers move from product development and qualification to mass production with greater confidence.”

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In an exclusive interview with Anwesh Koley of ELE Times, Prasanth Viswanathan Pillai, Design Manager, Senior Member Technical Staff (SMTS), Texas Instruments, shares his views on the recent innovations at TI and how next-generation applications are simplifying the path from design to deployment.

ELE Times: Texas Instruments recently introduced the AM13Ex MCU family at Embedded World 2026. Could you walk us through the core innovation behind this launch and its significance for the embedded systems market?

Prasanth Viswanathan Pillai: At Embedded World 2026, Texas Instruments introduced the AM13Ex MCU family, designed to help developers bring intelligence closer to where data is generated and decisions are made. The core innovation behind the AM13Ex family is the integration of TI’s TinyEngine Neural Processing Unit (NPU) alongside an Arm Cortex-M33 core, dedicated hardware accelerators, and an advanced real-time control architecture on a single chip. This combination enables developers to run AI inference directly at the edge while maintaining deterministic real-time control performance.

The first device in the family, the AM13E23019, is built for applications that require both intelligent decision-making and precise control. It combines a 200MHz Cortex-M33 core, TinyEngine NPU, trigonometric math acceleration, integrated security features, and high-performance analogue peripherals, enabling developers to address increasingly complex industrial and embedded workloads on a single platform.

For the embedded systems market, this represents an important shift. Embedded devices are evolving from performing fixed functions to becoming intelligent, adaptive systems capable of local data processing and real-time decision-making. By integrating AI acceleration, real-time control, and security into one device, the AM13Ex family helps reduce system complexity and improve energy efficiency.

ELE Times: Texas Instruments also recently expanded its MCU portfolio with the MSPM33C321A. What role does this device play in TI’s broader embedded strategy, and what opportunities does it create for developers?

PVP: The MSPM33C321A reflects Texas Instruments’ commitment to delivering highly integrated, scalable microcontroller solutions that address the growing demands of modern embedded applications. Built on the Arm Cortex-M33 core, the device combines processing performance, integrated security features, advanced communication capabilities, and precision analogue integration in a single platform.

A key differentiator of the MSPM33C321A is its rich analogue and control integration, including high-speed ADCs, configurable analogue peripherals, and motor-control capabilities. These features make it well-suited for applications that require accurate sensing, real-time control, and reliable operation, while helping developers streamline system design.

For developers, the MSPM33C321A opens opportunities across a wide range of applications, including industrial automation, motor drives, building automation, smart appliances, and intelligent sensing systems. Additionally, as part of the MSPM0 portfolio, it enables developers to leverage a common software ecosystem and development environment, supporting greater design flexibility and scalability as product requirements evolve.

ELE Times: How does the Arm Cortex-M33 architecture support next-generation embedded applications?

PVP: At the core of M33C321 is the Arm Cortex-M33 architecture, which is built to balance performance, efficiency, and security. Its TrustZone-enabled security framework provides hardware-level protection, which is increasingly essential as connected systems expand.

At the same time, its deterministic real-time responsiveness and DSP capabilities make it ideal for applications that require precision, reliability, and efficient decision-making at the edge. This architecture gives developers the flexibility to design for today’s needs while building platforms that can scale with tomorrow’s complexity.

ELE Times: What was the role of TI India in the development of this MCU, and how did the local team contribute to enabling this innovation?

PVP: M33C321 is especially meaningful because it represents true end-to-end product leadership from India. At Texas Instruments India, the team drove the journey from architecture and core design through full development, validation, and test program generation.

This demonstrates how India is contributing not just engineering capacity, but full-spectrum semiconductor innovation. It reflects the maturity of India’s R&D ecosystem and reinforces its role as a strategic center for global product development.

ELE Times: What differentiates TI’s approach to embedded processing compared with other MCU vendors?

PVP: TI’s differentiation comes from taking a truly end-to-end view of semiconductor innovation. Beyond designing advanced embedded processors, Texas Instruments combines system architecture, analogue leadership, software ecosystems, and importantly, internal manufacturing capability. This in-house manufacturing strength allows TI to co-develop silicon and process technologies together—optimising device architecture alongside manufacturing processes to deliver better performance, efficiency, quality, and long-term reliability for customers.

For customers, this means more tightly optimised products and a stronger value proposition because device design is not isolated from manufacturing realities. For engineers, it opens up a far more complete perspective—extending beyond product design into process development, optimisation, and manufacturability. From a semiconductor standpoint, that full-stack visibility is incredibly valuable because it creates opportunities to innovate across the entire lifecycle, from architecture to fabrication. This combination of product, process, and ecosystem integration is what makes TI’s approach particularly distinctive in embedded processing.

ELE Times: How do these new devices help customers accelerate innovation in industrial and automation applications?

PVP: M33C321 helps customers innovate by simplifying the path from design to deployment. Its integrated architecture supports advanced control, secure connectivity, and efficient system management, enabling developers to focus more on differentiation and less on integration challenges.

This versatility makes it highly relevant across evolving sectors—from industrial automation and precision robotics to intelligent infrastructure supporting large-scale digital transformation. As industries modernise, customers need platforms that can adapt quickly, scale efficiently, and maintain reliability—and that is where the M33C321 delivers significant value.

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Henkel Adhesive Technologies, the market leader in adhesives, sealants and surface treatments, has been actively developing and executing numerous initiatives geared towards sustainable, energy-efficient, lightweight solutions for the Automotive and Metals market in India. Anwesh Koley of ELE Times caught up with Manish Dave, Head of Industrials – India, Henkel Adhesive Technologies, to deep-dive into the company’s India initiatives and its completion of 150 years of operations.

ELE Times: Tell us about Henkel at Productronica this year. What is the company showcasing?

Manish Dave: We are very passionate about Electronica, and as you can see, we have a wide variety of offerings. Our business spans from data centres and AI—which obviously are seeing a lot of growth—to power and industrial automation, because all this data requirement now needs energy, and we supply solutions for that.

We also have aviation and avionics, which are growing significantly, alongside newer domains around life sciences and wearable items. Across all of these, we provide material solutions, whether it is circuit board protection or thermal materials to dissipate heat.

ELE Times: In terms of the current market for electronics in India, how do you perceive the Indian market vis-à-vis other Asian markets and from a global perspective? How do you see that?

Manish Dave: It depends upon the segment you talk about. For AI, we are behind; certainly, the US and China are far ahead. But India is catching up really fast. Over the last many months, I have continuously seen India coming in at number 3. It used to be maybe 5 or 6, with Japan, Germany, many European countries, and even South Asian nations ahead of us. If you look at Malaysia, Thailand—Thailand is really, really good—and Vietnam, India is certainly growing. We still have some work to do, so I would say a couple more years before we arrive on the global scene.

ELE Times: In terms of the latest innovations at Henkel that we are seeing, particularly in the AI domain, and then if you could talk about the defence sector which is also showing a lot of promise, please brief us about the initiatives at Henkel.

Manish Dave: For AI, for sure, there is data generation and heat management. An AI data centre would have servers and routers, and we are involved with all of them across the whole ecosystem. Our job is to make sure that piece of circuit board is protected—that you have underfills and conformal coatings, potting that protects it. And then for any heat on any active surface, we have our thermal interface materials that dissipate heat, keeping it at an optimal temperature. We see a tremendous amount of growth in data and AI, and I think India is probably at the cusp of getting into the lead at some point in time.

Defence is new for us, but there have been lots of announcements from the frontline objects, and Henkel is involved. Our Loctite products have been used on frontline objects onwards. From a structural strength perspective, I always say our products are used to bond primary and secondary structures on an aircraft flying at 24,000 feet, going 500 miles per hour, carrying 300 people. Our products play a very important role in that, delivering quality and innovation. We have several key innovations not just in electronics, but around structures—how to make them lighter—and composites are a big part of what we do.

ELE Times: In terms of current market dynamics and how you see India vis-à-vis other markets, there are also challenges the industry faces regarding process optimization. How does Henkel deal with that, and how does the cost factor feature in this?

Manish Dave: That is a very good question. What we have done in Bangalore is open an application centre, because we want to be closer to the customer and faster. The role of our engineers there is to welcome customers who bring in their challenges.

We had a recent case where they brought in a challenge, we worked together to find a solution, and within one week we delivered an end-to-end solution. That is really what we are trying to do: build our ecosystem to work with the epicentre here, working with both unicorns and established players.

ELE Times: The government is highly optimistic about semiconductors, not only in terms of products but also the investments coming up in recent years. What’s your take on the India Semiconductor Mission 2.0, the massive investments, and how do you see this sector going forward?

Manish Dave: I think this is the next big frontier for us. The government has done the right job of investing. You could argue we are a little late, but I think the speed at which India moves is what I am really enjoying.

I grew up in Ahmedabad, and I used to know this small town called Sanand. Now I go there and I see Tata Electronics and Tata Semiconductor, and it’s just breathtaking. There is massive potential, and public-private partnerships are playing a key role there. We are very actively involved on both sides of that, and NASSCOM is one area where we work very closely.

ELE Times: You mentioned PCBs and PCB designs. How critical is getting this technology right? Many manufacturers have been wary of introducing new technologies, preferring to continue with older ones due to the critical nature of the component. How do you see PCB design evolving, and what is your perspective?

Manish Dave: We are more focused on solutions to protect the circuit board and have seen the evolution of PCBs. I remember the early days—and I have been in the industry a long time across multiple roles—circuit boards went from being very small to massive boards for different subsystems, and now they are coming back down to smaller sizes, showing a tremendous amount of innovation.

For India, I think there is still a heavy reliance on China in terms of critical components. A lot of investment has gone into components and assembly being made in India, but not necessarily the raw materials required. If you look at a circuit board, there are so many materials required; I think bringing some of those in to achieve independence is the next big frontier. Then you can truly talk about cost, quality, and speed altogether.

ELE Times: Henkel has been part of the entire value chain in electronics. You talked about developing indigenous technology as of now and mentioned our reliance on China. What according to you can be the steps to increase self-reliance going forward?

Manish Dave: That’s an excellent question. One key factor is investment coming not just from the government, but from private players—the movement of capital is critical. I spent most of my life in the US, and I am convinced the entrepreneurial drive exists in India. However, people sometimes lack access to capital. How do they get access to that capital?

What I love about Bangalore and coming here is that we can find everything in one place: people with money, people with technology, and people with ideas and aspirations. Platforms like NASSCOM give them a chance to come together, and we work very closely with many corporations to help startups grow. We are still dependent on China, but if we keep doing what we are doing with no setbacks in our path forward. The next 10 years are going to be the golden 10 years for India.

ELE Times: Henkel is celebrating 150 years. Tell us about how this journey has been and how you expect the upcoming decades to be.

Manish Dave: It started with Fritz Henkel with a very small role in laundry—that’s where he started. Then he realized those sacks required adhesives, adhesives came into the picture, and now we are at a €22 billion public organization.

Dr. Simone Bagel-Trah, Chairwoman of Henkel’s Supervisory Board and Carsten Knobel, CEO of Henkel

Henkel is celebrating 150 years this month across the world, and in India, the celebration will be in two weeks. We are very, very excited and really proud of an organization that’s 150 years rich. We don’t just look ahead another 150 years; our plan is always long term, always sustainable. Our mantra is “Pioneers at heart for the good of generations.” We really want to create enduring value for generations to come for the next hundreds of years.

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With its new SOLO placement head, ASMPT SMT Solutions, the global market and technology leader in integrated hardware and software solutions for the electronics manufacturing industry, is expanding its portfolio of solutions for the production of complex circuit boards for AI and high-performance computing (HPC) applications. Developed especially for the reliable placement of particularly large and heavy processor BGAs, the new head can initially be used on the SIPLACE SX. It handles components measuring up to 240 × 240 millimetres (9.45 × 9.45 inches) and weighing over 2 kilograms (4.4 pounds), soon to be increased to up to 5 kilograms (11 pounds). 

The growing demand for AI applications and their associated computing power is driving the development of highly integrated multi-die modules. More transistors, higher memory bandwidths and thousands of power supply and signal connectors make processor BGAs increasingly complex, larger, and heavier. Whereas only one year ago large processor BGAs measured roughly 150 × 150 millimetres (9.45 × 9.45 inches) and weighed 500 grams (1.1 pounds), the next generation is already reaching 240 × 240 millimetres (8.45 × 9.45 inches) with weights of 2 kilograms (4.4 pounds) – about two times the area and four times the weight. To meet the dynamic growth of the AI market, ASMPT has developed within six months its completely new SOLO placement head as the perfect solution for handling these ever larger and more expensive processors.

Specialist for large and heavy processor BGAs

The new SOLO head is specially designed for picking and placing processor BGAs of this size and weight class. It is based on a new single-segment architecture with a strengthened and stiffened axis. The connection between the placement head and the gantry as well as the interface between nozzle and segment were also designed to withstand the greater mechanical loads. The maximum placement force is 200 newtons. Construction-wise, the head is already designed for significantly heavier components weighing up to 5 kilograms (11 pounds).

Since the highly complex processors can cost more than 20,000 U.S. dollars, they must be handled with an appropriate level of safety and reliability. The nozzles are matched to the respective housing surfaces and take into account any areas that must not be touched during pickup. And since the mass inertia of the large BGAs can be taken into consideration in the movement profiles, acceleration and rotational movements can be customized for the respective component.

The SOLO placement head handles the final step

The processor is merely one of many components on an AI server board. Before it is placed, many ICs, condensers, connectors and super-small passive components must be processed. To accomplish this, various placement heads can be combined on SIPLACE placement machines in an SMT line: The CP20 handles the speedy placement of the smallest components, the CPP covers a broad component spectrum, and the TWIN VHF handles large, heavy and unusually shaped components. The expensive processor BGAs are installed at the very end of the placement process. The new SOLO head handles this particularly critical step and ensures that these large and heavy components are picked up and placed with reliability and precision.

Process reliability along the entire line

The placement of large processor BGAs is only one part of the manufacturing process. Material feeding, circuit board handling and quality control must also be designed to meet the special requirements of AI server applications. The SIPLACE SX provides the necessary functions. Heavy-duty conveyors ensure the safe transport of large and heavy circuit boards while the SIPLACE Smart Pin Support provides the necessary support and prevents PCBs from bending and vibrating during the placement process. And before placing the processor, the machine can inspect critical board segments, especially those in the processor’s target area, for foreign matter and ensure the presence and correct position of spacers. After picking up the processor, it checks BGA connectors optically and can optionally measure the coplanarity of the solder balls via 3D laser triangulation. With the SOLO placement head, the SIPLACE SX is now keeping pace with the rapid developments in the size and weight of processor BGAs.

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CyteSi, a Menlo Park–based innovator in digital microfluidics, today announced the successful validation of a next generation sequencing (NGS) library preparation workflow on CyteSi’s proprietary Turing Biosystem D1 platform using NGS library preparation kits from QIAGEN GmbH. The validation was conducted by Intelligent Biosystems in Hangzhou, China, applying its industrial-scale biological data-generation capabilities and integrated workflows to support automated NGS library-preparation performance on the D1 platform.

Compared with conventional manual library preparation, the Turing Biosystem D1 enables fully automated NGS library preparation for up to six samples per run with less than five minutes of hands-on time. By miniaturizing and digitizing key liquid-handling steps, the D1 system can reduce reagent consumption and lower reagent costs by more than 70%, dramatically reduce labour requirements, and help minimize batch-to-batch variance.

These advantages are especially important for clinical diagnostics markets in North America, Europe, and Japan, where cost control, workflow standardization, reproducibility, and operational efficiency are critical to broader adoption of NGS based testing. CyteSi and QIAGEN are positioned to support future NGS workflow adoption through validated kit compatibility and automated library preparation, while Intelligent Biosystems’ validation work demonstrates the D1 platform’s readiness for broader clinical-diagnostics applications.

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DigiKey, the global distribution leader of electronic components and automation products, is the exclusive distributor of the newly available Coralboard, a developer-ready edge AI board powered by Coral NPU technology from Google Research and Synaptics Astra embedded processors. Manufactured by Grinn, the development board offers a practical starting point for rapid prototyping, product evaluation, and production-oriented edge AI development.

“DigiKey is excited to partner with Synaptics and Google Research to bring the Synaptics Coralboard to the global engineering community,” said Mike Slater, vice president of global business development for DigiKey. “By carrying the full stack, from development board to module to silicon, DigiKey can support edge AI developers at every stage from experimentation to production. Google Research, Synaptics and Grinn have delivered a game-changing dev board to the electronics industry, and we are excited to support them in getting the board into the hands of engineers, designers, makers and developers worldwide.”

What is Coralboard?

The Coralboard is a development platform for edge AI powered by Coral NPU from Google Research and Synaptics Astra embedded processors. Built for rapid prototyping, the board features an integrated Coral NPU for fast, efficient on device AI acceleration, giving you the power to create, test, and deploy smart experiences with ease. The kit is fully equipped with everything needed to bring development projects to life and offers seamless plug-and-play support for cameras, displays and audio. It also effortlessly keeps devices connected with versatile options like Ethernet-over-USB and optional support for Wi-Fi and Bluetooth modules.

The Coralboard edge AI development board is available now from DigiKey worldwide. Designed for ultra-low-power, always-on applications using ambient sensing, the dev board enables fast, efficient on-device inference and supports all day AI experiences in battery-constrained form factors.

Typical Coralboard applications include smart cameras, industrial monitoring, predictive maintenance, voice-enabled devices and battery-powered edge AI systems.

The Coralboard is intended for embedded developers, AI and machine learning engineers, system architects, product teams, and device manufacturers building the next generation of intelligent edge products. Teams can begin with Coralboard for evaluation and rapid prototyping, move to product prototyping and integration, and scale to full production designs. This flexible path helps developers explore real-world AI workloads, validate product concepts, and move from experimentation to production using a common Edge AI technology foundation.

“We are excited that the Synaptics Coralboard is now available directly for developers through DigiKey,” said Billy Rutledge, director for Google Research. “With Coralboard, it is easier than ever to bring advanced AI to the edge, and this platform reflects our shared commitment to secure and accessible Edge AI for developers around the globe.”

“With Google’s Coral NPU technology, we are enabling a cutting-edge class of systems where power efficiency, performance and on-device intelligence characterize developer experience,” said Vikram Gupta, SVP & GM, edge compute & connectivity solutions division for Synaptics. “The Coralboard provides users and OEMs a faster path to building and deploying at-scale AI products for the edge.”

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Murata Manufacturing Co., Ltd. announces the development of the world’s smallest 008004-inch size (0.25mm × 0.125mm) NTC thermistor, the NCU01 series. Compared with Murata’s previous smallest 01005-inch size (0.4mm × 0.2mm) product, the new series reduces mounting area by approximately 60% while achieving equivalent temperature sensing performance, with resistance tolerance of ±1% and B-constant tolerance of ±1%. Its ultra-compact size enables temperature sensing to be positioned in increasingly restricted spaces and closer to heat-generating components, supporting more accurate and responsive thermal monitoring in smartphones, wearable devices, and other densely integrated electronic devices.

Murata plans to begin sample shipments in October 2026 and mass production during 2027. The line-up will be expanded progressively, beginning with 100kΩ and 10kΩ resistance values.

Bringing Temperature Sensing Closer to the Heat Source

As electronic devices continue to become smaller and more sophisticated, component density on circuit boards and inside modules continues to increase. As a result, mounting space for electronic components is limited, making it difficult to place NTC thermistors close to heat-generating components. If a thermistor must be placed farther from the heat source, the measured temperature can differ from the actual component temperature, while rapid temperature changes may also take longer to detect.

This creates a demand for smaller NTC thermistors that can be positioned closer to critical components without consuming valuable board space. However, continued miniaturization makes high-precision processing and manufacturing more difficult, making it more challenging to maintain consistent sensing characteristics. For NTC thermistors, tight resistance and B-constant tolerances are critical to enable stable temperature sensing.

High-Precision Performance at 008004-inch Size

Murata addressed these challenges through its proprietary ceramic materials technology, high-precision processing, and optimization of the component structure and manufacturing process to develop the world’s smallest 008004-inch size NTC thermistor. Despite its significantly smaller footprint, the new NCU01 series maintains the ±1% resistance and B constant tolerances achieved by Murata’s previous 01005-inch size product.

By reducing the mounting area by approximately 60%, the NCU01 can be placed in locations that are difficult to accommodate with larger thermistors, including closer to heat-generating components. This can help reduce the temperature difference and detection delay associated with more distant measurement points while contributing to the stable operation of electronic devices with high-density component layouts.

Primary applications include temperature monitoring on circuit boards in smartphones and wearable devices, as well as in integrated circuit (IC) packages and system-in-package (SiP) modules.

Murata will continue to expand its NTC thermistor line-up and contribute to further miniaturization and improved reliability of electronic devices. For product inquiries, please contact us here.

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​AVL and VisIC Technologies are partnering companies that share the vision of upgrading and commercialising high efficiency gallium nitride (GaN) traction inverters. The partnership recently demonstrated advanced research related to traction inverters by integrating gallium nitride (GaN)-based power modules into an electric vehicle reflecting a move that advances high-efficiency power electronics for electric vehicles (EVs).

The test was conducted at AVL’s facilities in Germany where VisIC’s D³GaN technology was integrated into an AVL vehicle demonstrator platform. The development has moved from laboratory testing into a complete vehicle environment.

GaN Technology Targets Lower Inverter Losses

The conducted test trial assembles a GaN technology-based inverter with a high-speed electric axle, advanced power electronics and vehicle control systems. The traction inverter transforms the DC power from an EV’s battery into AC for use in the electric motor. Its efficiency determines the amount of energy taken from the battery that the reaches the motor. This newly announced technology significantly reduces switching and conduction losses, thereby lowering overall inverter losses.

The project also involves NXP Semiconductors for dri​ver electronics, system integration, and performance support. NXP supplies specialized driver ICs for proper control of D³GaN technology at high frequencies. Reducing the inverter’s power losses improves thermal management and supports a more compact powertrain design.

Potential Benefits for Future EVs

Integrating an inverter into a vehicle allows the partnership to evaluate performance metrics under a complete development environment including the electric drivetrain, and their interaction with the motor and vehicle control systems. The companies reported that GaN-technology-based inverter achieved 99.67% efficiency at a switching frequency of 10 kHz and over 99.8% at 5 kHz.

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Hillcrest Energy Technologies, a Canadian clean technology company specializing in manufacturing high-performance power conversion devices and digital control systems, has reported a major development towards a zero-voltage switching (ZVS) inverter. The company has reduced motor-terminal voltage overshoot by more than 90% compared to a conventional hard-switched silicon carbide (SiC) inverter.

Reducing motor-terminal voltage overshoot extends motor’s insulation life, reduces electromagnetic interference (EMI), decreases motor heating, and enables safe deployment of fast-switching, high-efficiency power devices. The detailed findings of the research were presented at the IEEE Energy Conversion Congress and Expo (ECCE 2026). The event was held from October 4 to 8, 2026, in Vancouver, BC, Canada.

ZVS Technology Addresses Motor Insulation Stress

The primary role of the traction inverter is to convert direct current (DC) from the battery into controlled, multi-phase alternating current (AC) to drive the electric motor. Traditional SiC semiconductors enable fast switching operations resulting in voltage spikes between the inverter, connecting wires, and motor. These voltage spikes put additional stress on the motor’s insulation system and increase the risk of premature failure.

Hillcrest’s ZVS technology addresses this challenge by using a smart method for switching the electric current on and off. It allows switching operations between semiconductor devices when the voltage across them is close to zero. This approach slows voltage transitions and reduces overshoot without depending on additional filtering components which add to the system’s volume, cost, and power losses.

This technology could help EV manufacturers to deal with the problem of motor insulation reliability and electromagnetic interference instead of relying on large-sized filtering solutions. The final validation of these results will be seen when the technology moves towards the development phase and yields a positive impact on the vehicle’s long-term reliability.

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​With the rising demands of electric vehicles, researchers are continuously working in this domain to make future mobility more practical for electric vehicle (EV) users. To make future mobility more convenient, researchers have introduced an advanced all-solid-state lithium-sulfur battery. This charging solution addresses two major challenges in modern EV infrastructure: long charging periods and limited cycle life.

Many government agencies and companies across the globe are working to commercialize solid-state lithium-sulphur battery designs because they provide high energy density, better safety, reduced dependence on rare-earth metals, and long shelf-life by eliminating the shuttle effect.

Redox Mediator Improves Battery Reaction Kinetics

All-solid-state lithium-sulfur batteries are being explored as an alternative to lithium-ion batteries, offering higher specific energy and lower material cost. However, the solid-state reaction hinders the development of all-solid-state lithium-sulfur batteries due to slow reaction kinetics, which can reduce charging speed and cycling stability.

To overcome this problem, the research team designed a positive electrode with a unique nano-eutectic material of sulfur and iodine arranged in an amorphous network. The iodine serves as a redox mediator, which allows electrons to transfer easily and enhances the sulfur reactions. The electrode’s electrochemical activity is further improved by growing the material within mesoporous carbon.

In lab tests, the battery delivered 851.9 mAh (milliamp-hours per gram) of sulfur and iodine when charged at a rate of 10C, and 474.7 mAh/g at 24C. According to the researchers’ report, electrode showed 9,000 cycles over nine months at 2C and 2,800 cycles at 0.5C over 17 months. These results demonstrate promising cycling stability under the tested conditions.

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DRDO has successfully carried out a flight trial of the indigenous High-Altitude Platforms (HAPS). HAPS is a long endurance unmanned aircraft designed as an aerial platform to be used as a surveillance system in the stratosphere. The platform has been developed by ADRDE, Agra, which is an agency of the DRDO.

In the course of the experimental flight, the platform attained an altitude of about 21 kilometres above mean sea level and was maintained at a level of 20 kilometres for more than 30 minutes before being ordered to descend. The vehicle was recovered and analysed, and its flight-performance data were obtained. Instrumental and control systems onboard included an inertial measurement unit, GPS receiver, onboard cameras, and an altitude-control system. Video and other vehicle data were sent back to a ground control station during the trial.

HAPS vehicles are meant to fly at substantially higher altitudes than aircraft that are currently flying today. They may be capable of watching a large area for an extended period of time. They could eventually be used in a variety of surveillance, comms, and monitoring roles. The trial was also conducted in collaboration with the Indian Air Force, CEMILAC, the Directorate General of Civil Aviation, the Airport Authority of India, and other agencies. The flight achieved a significant milestone in the development, though tests are still needed to confirm endurance, payload capacity, and operational viability.

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Lockheed Martin has announced a new and improved missile for the missile defence force known as PAC-3 Edge for the US Army Future Interceptor programme. It is aimed at enhancing military capability to protect against increasingly sophisticated missile threats such as hypersonic missiles. The PAC-3 Edge is based on technology developed for the combat-proven PAC-3 Missile Segment Enhancement (MSE), including a new seeker, enhanced flight control technology, and a Northrop Grumman-designed multi-pulse solid rocket motor.

Lockheed Martin has announced a new and improved missile for the missile defence force known as PAC-3 Edge for the US Army Future Interceptor programme. It is aimed at enhancing military capability to protect against increasingly sophisticated missile threats such as hypersonic missiles. The PAC-3 Edge is based on technology developed for the combat-proven PAC-3 Missile Segment Enhancement (MSE), including a new seeker, enhanced flight control technology, and a Northrop Grumman-designed multi-pulse solid rocket motor. defence as forces encounter a more complex array of threats. But PAC-3 Edge is still a development program rather than an operational system in the field.

Lockheed Martin said development and testing would start in 2027, and the missile would enter service in 2031. PAC-3 Edge is a prime example of how manufacturers are already moving legacy interceptor technology forward in the areas of sensors, propulsion, and flight control. Its future utility will be contingent on test results, integration, and procurement.

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US-based defence technology firm Anduril Industrial has announced its new family of missiles, Steelfin, a high-speed, configurable surface-to-air missile developed to counter a variety of aerial threats, such as hypersonic vehicles, cruise missiles, and ballistic missiles. The system employs a common two-stage design. Its first-stage booster can be tailored to vary range, performance, and launch parameters. Its second-stage interceptor consists of a common baseline airframe, avionics, software, and flight-control architecture for each variant.

The modular design aims to lessen the incidence of having to redesign the whole missile in the event of a change of operational requirement. Identical parts and production methods could be used to help bring about efficiencies in the manufacturing process and help to achieve economies of scale. Anduril says Steelfin is capable of being integrated with existing land- and sea-based launch infrastructure, such as the Mk 41 Vertical Launch System, and interoperates with current battle-management systems. Ballistic testing with surrogate air vehicles has been conducted, and flight tests will start in 2027.

The move also comes as the armed forces search for cheaper counter-drone tactics to deal with swarms of enemy aircraft that don’t max out the available expensive interceptors. Layered air defence, defensive and offensive protection of the armed forces and the military facilities, ships from the attack of various missile-type ballistics. Steelfin embodies the trend towards modular missile architectures and scalable defence manufacturing. Its actual ability, cost, and effectiveness will have to be proved through additional trials.

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India’s Defence Research and Development Organisation (DRDO) has demonstrated the capacity of a Quantum Key Distribution (QKD) platform on the live network of Proof and Experimental Establishment at Chandipur, Odisha. The trial is aimed at developing cutting-edge technology to safeguard high-value information from growing cyber threats.

Quantum Key Distribution (QKD) uses properties of quantum physics to generate encryption keys. QKD can involve the use of physical objects, such as photons, which have the ability to detect some form of tampering when quantum signals are used to distribute those keys. It has the potential to be part of a high-security communications network.

In the trial, the platform was launched on a live network in a defence test-range environment. The trial was important because a real operational network faced a number of practical issues such as equipment integration, transmission conditions and communication reliability. QKD does not itself encrypt all transmitted information. It enables the creation of secure keys with which to encrypt data, provided that suitable encryption systems are used. In addition, secure end points, management, authentication, and measures to prevent attacks on the system are needed.

Use Cases: Strategic military command network and communications, strategic military research establishments, and other facilities of strategic importance.

The successful demonstration has created more interest in quantum-secured communications in India. Additional testing and integration of the systems will be necessary to ascertain the role this technology will play in defence networks.

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India’s Ministry of Defence has signed agreements worth nearly Rs 4,106 crore to procure a ‘Made-in-India’ communication satellite for the Indian Air Force (IAF) and heavyweight torpedoes, named Varunastra, for the Indian Navy. The deals bolster India’s defence strength in space and underwater combat.

The GSAT-7C contract of Rs 2,563 crore was signed with New Space India Limited (NSIL). This satellite shall be designed, developed, and manufactured in India and would enable the IAF to have a secure, resilient, and seamless communication network. Reliable Satellite Communications are critical for coordination of aircraft, ground stations, and operational assets over scattered areas.

The second contract, valued at Rs 1,543 crore, was granted to Bharat Dynamics Limited (BDL) for Varunastra heavyweight torpedoes. The Varunastra is a domestically produced ship-launched anti-submarine missile with high manoeuvring characteristics, built by the Naval Science and Technological Laboratory (NSTL), to attack opposing submarines at great range.

They align with India’s Atmanirbhar Bharat programme to bolster the country’s defence industry and cut reliance on imports of vital military equipment. The deal points to India’s simultaneous procurement of state-of-the-art underwater wars as well as modern secure military communications. How effective they are commercially will depend on the execution, integration, and delivery dates.

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Keysight Technologies, today announced two new 1.6T Ethernet test platforms, Switch and Edge Router Tester (SERT) 1600GE and AresONE Plus 1600GE, designed to help customers validate next-generation AI data center and hyperscale networking infrastructure. AresONE Plus 1600GE sets a new benchmark by delivering eight 1.6T Ethernet ports in a single 2U appliance while providing stateful, realistic AI workload generation with mix-of-experts emulation.

SERT 1600GE targets data center switch fabric and edge router validation, while AresONE Plus 1600GE adds AI workload emulation and high-density switch fabric testing. The combined platforms provide a consistent test foundation for device qualification, routing, and AI fabric validation. They also enable performance, interoperability, and control-plane evaluation as networks scale.

Key capabilities include:

• AresONE Plus 1600GE for testing high-density switching: Packs eight OSFP1600 ports into a single 2U chassis, delivering 12.8T of line-rate traffic at 64 bytes. It supports 1600GE PAM4 signaling over 224G SerDes with backward compatibility to 112G, plus flexible port breakout of 1x1600GE, 2x800GE, 4x400GE, or 8x200GE.
• SERT 1600GE for switch and edge router validation: Available in eight-port 2U configuration for switch fabric scale testing. In common with the AresONE Plus 1600GE platform, it is capable of being time synchronized using Precision Time Protocol (PTP), for larger topologies, offering flexibility to scale test environments as network configurations grow.
• Protocol and control-plane validation: Both platforms support Border Gateway Protocol (BGP), Equal-Cost Multipath (ECMP), Virtual Extensible LAN (VXLAN), and SONiC validation across routing, bridging, and access use cases. AresONE Plus 1600GE also provides core routing scale for control-plane testing.
• AI workload emulation: AresONE Plus 1600GE integrates with Keysight AI Data Centre Builder software for mix-of experts emulation, RoCEv2, Priority Flow Control (PFC), Explicit Congestion Notification (ECN), and Ultra Ethernet Consortium (UEC) support. These capabilities let customers exercise both network protocols and AI traffic behavior in the same validation environment to identify performance and congestion issues before deployment.
• Optics and test flexibility: Both platforms support DAC, ACC, AEC, AOC, and coherent optics in both IHS and RHS form factors. AresONE Plus 1600GE can dynamically switch between an eight-port mode for data centre switch qualification and a four-port mode for AI benchmarking on the same chassis, helping teams use one appliance across multiple test scenarios and gain more value from their test infrastructure.

NVIDIA Spectrum-6 Ethernet Switch is setting the foundation for next-generation AI Ethernet fabrics with unprecedented bandwidth, scale, and AI-optimized networking. Through collaboration with NVIDIA, Keysight AresONE Plus 1600GE provides the high-performance validation platform needed to stress these capabilities with 1.6T/800GE traffic throughput, 224G SerDes, routing-scale validation, and realistic AI workload emulation, enabling rigorous performance and congestion testing before deployment.

Gilad Shainer, Senior Vice President of Networking, NVIDIA said: “AI factories require an Ethernet fabric designed for accelerated computing, and NVIDIA Spectrum-X provides the performance, predictability and control needed to keep large-scale AI workloads running efficiently. Keysight’s validation capabilities help engineering teams emulate realistic AI traffic and test Spectrum-X-based fabrics before deployment, reducing time to market.”

Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: “The AI era breaks the rules for hyperscale infrastructure. We have moved beyond fault-tolerant commodity scaling to highly synchronized, specialized AI clusters where every packet, link, node, and nanosecond counts. As engineering teams and operators race to upgrade AI infrastructure to 1.6T Ethernet, they need to emulate the broader AI system throughout the development process—from early design and device qualification to system-level validation and AI rack deployment. These new platforms give our customers the flexibility to test at scale while using the same test foundation across the entire design-to-deployment continuum.”

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Infineon Technologies AG announced today that it is expanding its PSOCTM Control family with the launch of the PSOC Control C3 Main Line PSC3M/P6 microcontrollers (MCUs). The new, versatile, and cost-optimized MCUs combine real time motor and power control performance, with advanced security features. The features efficiently drive up to four brushless DC motors in censored or sensor less configuration with a single MCU, power topologies and security needs for a variety of applications including industrial drives, drones, smart home, home appliances, renewables, robotics, telecommunication servers, data centres, and digital healthcare applications.

The MCUs are compliant with post-quantum cryptography (PQC) requirements for firmware protection outlined in the Commercial National Security Algorithm (CNSA) Suite 2.0, and they support PSA (Platform Security Architecture) Level 3 enablement. By supporting both standards, Infineon’s PSOC Control Main Line PSC3M/P6 MCUs meet security needs for a wide range of industrial applications and ease their transition to increased security in the PQC era while allowing compliance with Cyber Resilience Act (CRA).

“These next-generation MCUs are designed for multi-motor control and power conversion systems that require high performance, efficiency and advanced security features,” says Steve Tateosian, SVP and General Manager, IoT, Consumer and Industrial MCUs, Infineon Technologies. “As industrial applications increasingly demand faster control loops for tighter control and improved efficiency, the PSC3M/P6 MCUs give customers another option to help meet their motor, power and general-purpose design needs without increasing their footprint.”

Key features and benefits

• Arm Cortex -M33-based MCU with up to 180 MHz.
• Enables high-performance systems to respond to real-time events with quad-motor control, PFC and very high RPM motor control systems.
• Wide-bandgap-ready with fast, precise analog processing and digital control to improve control loop accuracy and system efficiency.
• Provides a high level of functional integration for power supply units with advanced security to enable compliance with the latest standards.
• Scalable and compatible portfolio in features, packages, pinouts, memory, software and performance.
• Up to PSA L3 / EPC3 security and “DICE ready” including PQC support.
• Additional analog and digital features such as on-chip OpAmps, along with USB and I3C interfaces, expand the suitability of this MCU in markets beyond motor and power systems.
• Quicker time-to-market with ModusToolboxTM Power Suite and Motor Suite GUI as unified and comprehensive software and ecosystem platform for developers with dedicated tools and advanced libraries including ModusToolbox AI Assistant for seamless migration from other solutions to PSOC Control products.

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Prashant Verma, Sub-Editor, ELE Times

​You are driving a car that runs on petrol. A sudden announcement from the government increased the price of petrol due to a shortage, and the government is also telling people to use public transport for day-to-day commutes instead of using their private cars. Many countries have faced this fuel crisis in recent years caused by the war between the United States and Israel against Iran.

Any unexpected global situation can cause restrictions on using gasoline. A better alternative addressing this challenge is adopting electric vehicles, which not only eliminate dependence on fuel but also reduce air pollution, maintenance costs, and vibration compared to fuel-operated vehicles.

Electrification is the process of powering a machine or an entire unit using electricity instead of depending on non renewable natural sources like fossil fuels. This technology supports the global economy by replacing high import charges on fossil fuels with domestic electrical energy and thereby reducing import bills. In simple terms, electrification means replacing traditional methods and technologies operated by combustion fuels with electrical energy delivering the same amount of work at reasonable cost.

Why is Electrification Important?

Modern technologies are shifting towards electrification not only in transportation but also across every major sector of the global economy. The primary reasons for shifting towards electrification include improving energy efficiency, utilising renewable energy sources such as solar energy, wind energy, and biomass energy to produce electricity, and lowering carbon emissions.

Governments and international organisations such as the United States and the International Renewable Energy Agency (IRENA) are focusing on utilising renewable energy sources to manufacture and power infrastructure such as transportation, industry, buildings, digital infrastructure for data centres and communication networks, and urban infrastructure to establish smart cities.

Given below is the list of targets global organizations aim to achieve in making efficient use of renewable energy sources.

1. Triple Renewable Capacity by 2030: Increasing the production of electricity that powers machines using natural sources reduces carbon dioxide emissions lowers production cost. Many international agencies are aiming to scale global renewable power capacity to over 11,000 GW by 2030, driven by solar photovoltaic (PV) and wind energy.
2. Global Investment: Governing bodies such as European Commission (EC), World Bank Group & Climate Investment Funds (CIF), and COP31 Presidency are aggressively scaling up investments to triple global renewable energy capacity by 2030. This could provide many benefits such as limiting global warming, reducing reliance on volatile global fossil fuel markets, and creating millions of new clean-energy jobs.
3. Net-Zero Emissions: Around 145 countries are targeting reducing the emission of harmful gases into the atmosphere. These emissions include carbon dioxide (CO₂), methane (CH₄), nitrous oxide (N₂O), and fluorinated gases. The countries aim to limit the emission of global greenhouse gases as low as possible by 2050 and balance the remaining emissions through restoring forests or using carbon-removal technologies.

Electrification in Transportation

Electric vehicles have become very popular among people these days because core engineering provides superior performance, cost-effectiveness, and advancements in technology through software integration and cloud connectivity infrastructure compared to fuel-powered cars. The key factors driving the rising demand for electric vehicles include improvement in battery and range; low operating and maintenance costs; a fast-charging network; and superior performance and acceleration. As a result of these developments, transportation is one of the most visible areas of electrification.

One major advantage of using electric vehicles is that they generate power while working. When an EV slows down by applying brakes, the produced kinetic energy is converted into electrical energy and stored in chemical form inside a battery. This feature is not available in fuel-powered cars.

Electrification in transportation covers not only passenger vehicles but also heavy load carrying vehicles, including electric buses and electric trucks. The vehicles are aggressively used in countries like China, the Netherlands, Germany, Chile, and India. The main reasons for adopting these vehicles include less utilisation of fuel and because of this, it supports the country’s economy by lowering import dependence, reducing maintenance, and building a new environment-friendly infrastructure.

The government is also expanding the infrastructure of the rapid metro, which also uses electricity for carrying out its operations. A recent development in this area is the proposed Delhi-Panipat-Karnal Namo Bharat Corridor by the government with an estimated budget of Rs 33,051.15 crore. The train covers 136.30 km starting from Sarai Kale Khan in New Delhi and terminating at Karnal ISBT (New ISBT) in Haryana.

Electrification in the Industry

Electrification in industry refers to the process of replacing fossil fuels and relevant manufacturing equipment with electrically powered alternatives and electrical power should be generated from renewable energy sources such as solar energy, wind power, or hydropower. Conventional industrial processes rely on fossil-fuel technology for manufacturing processes because it provides high-energy density, consistently fulfils production demands in manufacturing processes, and supports large-scale infrastructure.

Fossil-fuel technologies were superior in the past due to their high-power delivery and cost-effectiveness at scale. However, they have certain limitations and problems when manufacturing goods. Following is the list of disadvantages of using fossil-fuel technology in mass production.

• Atmospheric Pollution: Burning fossil fuels such as coal and petroleum gas leads to the emission of harmful gases into the environment, such as carbon dioxide (CO₂), methane, and carbon monoxide. It also releases toxic byproducts and heavy metals into the environment which drive global environmental challenges.
• Operational Inefficiencies: Using fossil fuels on an industrial scale loses a significant portion of energy as waste in the form of heat and byproducts, making the process less energy-efficient for energy conversion.
• Resource Depletion: Fossil fuels are extracted from nature and they are non-renewable sources of energy. Continuous usage of these sources in the long term makes them unavailable from easily accessible reserves.

Adopting electrification on an industrial scale is a smart move which not only saves the environment but also provides lower maintenance costs and higher energy efficiency compared to fossil-fuel methods. At present, adopting this technology can reduce fossil fuel energy consumption by 40% to 50%.

Given below is the list of technologies we can use at industry scale to reduce the need of fossil fuel at industry scale:

1. Low-to-Medium Heat (<400°C): Using Industrial heat pumps, electric boilers, and resistance heating for food & beverage, paper and textiles.
2. Industrial Motion & Logistics: Using electric forklifts, automated guided vehicles (AGVs), and high-efficiency e motors to move raw materials and transport work-in-progress products between production stages.
3. Heavy Duty Transport: Using 800 V high-voltage powertrains, heavy-duty electric cranes for mining, ports, steel manufacturing, and operating equipment that requires high-power and torque.

Electrification and Renewable Energy

Electrification in industry refers to the process of replacing fossil fuels and relevant manufacturing equipment with electrically powered alternatives, and the electrical power should be generated from renewable energy sources such as solar energy, wind power, or hydropower. Conventional industrial processes rely on fossil-fuel technology for manufacturing processes because it provides high-energy density, consistently fulfils production demands in manufacturing processes, and supports large-scale infrastructure.

Many countries are putting their efforts into shifting towards electrification. Given below is the list of strategies adopted by countries in shifting towards electrification:

1. The EV Revolution and Transport Leapfrogging: Using electric vehicles for transportation purposes remains a strong target for rapid electrification. In 2026, sales records for fully electric vehicles reached 18% globally due to their affordable imports and local regulations.
2. Grid Modernisation: To fulfil the rising power demands of modern technologies such as AI, data centres, electric vehicles, energy storage systems, and smart appliances, countries are improving their grid infrastructure by upgrading physical hardware and integrating digital technologies. Developing countries are deploying core technologies such as advanced metering infrastructure (AMI) to improve grid efficiency, lower technical losses, and strengthen power supply reliability.
3. Industrial and Building Electrification: Manufacturers are looking for alternative methods and tools for replacing fossil fuels and setting up large-scale electrification infrastructure. The European Commission introduced its Electrification Action Plan aiming to enhance the production of clean energy by increasing the share of electricity in final energy consumption from around 23% to 46% by 2040.

Conclusion

Modern civilization is going through a process of energy transformation. Electric vehicles are reshaping transport, electric machinery and process equipment are transforming industry, heat pumps are modernising building energy systems, and batteries are opening up new possibilities for electricity storage.

The change towards adopting electrification will not happen at the same rate across different sectors. Some sectors can easily adopt electrification such as buildings, transport, and low-temperature industry because of existing technological setup, while other sectors like steel production and long-distance transport face technical and infrastructure limitations. In cases where electrification alone cannot supply enough power to perform operations, it is likely to work along with hydrogen, sustainable fuels, renewable energy and energy-storage systems.

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