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UP Squared Pro 7000 Edge combines the reliability of a fanless design with the power of Intel Core i3 Processor N-series, Atom Processor X Series, and Intel® Processor N-series platforms.

Converting the ingenuity of the UP Squared Pro 7000 board to its edge system range, AAEON’s UP Squared Pro 7000 Edge is the first mini PC to harness the power of Intel Core i3 Processor N-series, Atom® Processor X Series, and Intel Processor N-series processors in a fanless chassis.

The first fanless mini PC to utilize the processor platforms, the UP Squared Pro 7000 Edge provides developers with the same performance boost as its board counterpart, but with a more convenient route to market. The device’s heatsink offers effective heat dissipation without the obvious drawbacks of a fan-based cooling system, opening the door to deployment in more settings, such as smart manufacturing and healthcare.

A multipurpose design, the UP Squared Pro 7000 Edge’s heatsink contains a removable section for users to access the PC’s expansion slots. This makes the installation of 5G, Wi-Fi 6, and AI expansion modules much more efficient and convenient. In keeping with the UP system range’s previous iterations, the device’s rear I/O also houses a 40-Pin GPIO for further expansion.

The UP Squared Pro 7000 Edge presents improvements across its external I/O, with both LAN ports supporting 2.5GbE, compared to only one in the case of its predecessor. Further, a USB 3.2 Gen 2 Type-C port joins two USB 3.2 Gen 2 Type-A ports; while two COM ports supporting RS-232/422/485 have been added across all SKUs, a feature which until now had been limited to one COM port available only on SKUs powered by Intel Atom CPUs.

For more information about the UP Squared Pro 7000 Edge, please visit our product page or contact an AAEON representative directly.

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By Mark Patrick, Mouser Electronics

Data conversion is fundamental to our modern world, from smart sensors to smart home automation and power supplies. In this article, Mark Patrick, Mouser Electronics, explains how data conversion between the analogue and digital domains is achieved, and explores popular converter architectures. Equipped with this information, readers will have a better understanding of the technology and terminology, and the key datasheet specifications to review when selecting a device.

Converting analogue signals to digital signals and vice versa is essential in an increasingly connected world. We use analogue measurements to garner data about parameters such as temperature, humidity, and air pressure. But we need to convert these analogue signals for processing in the digital domain. Processing information digitally is a convenient, quick, and power-efficient process, for which low-cost microcontrollers are ideal.

Equally, we may need to convert digital signals into analogue signals. Indeed, some applications use both conversion methods: for example, in home automation systems. Analogue human speech is converted into a digital audio stream, which is then interpreted by a cloud-based machine learning algorithm. The answer or the desired music is then sent back to the speaker for conversion to the analogue domain. This is achieved using data converters.

Understanding data converters

Data converters are classified as either analogue to digital (ADC) or digital to analogue (DAC). A simple, functional block diagram of an industrial process closed loop controller featuring an ADC and a DAC is shown in Figure 1. Note that the input and output of the ADC and DAC are supported by signal conditioning functions. Signal conditioning may involve using low pass filters on the ADC input, for example, to remove any high-frequency signal artefacts that might interfere with the ADC’s conversion accuracy. Alternatively, signal conditioning may be applied to limit the input range of the acquired analogue signal to prevent damage to the ADC.

Figure 1: The use of an ADC and a DAC in an industrial process loop controller (Source: Analog Devices)

Where multiple analogue sensor elements are required, the input to the ADC can be multiplexed to provide a cost-efficient control circuit design. The design might require a programmable gain amplifier to accommodate different analogue input ranges from multiple sensors (Figure 2).

 

Figure 2: A complete analogue to digital to analogue control loop with a microcontroller or microprocessor (Source: Analog Devices)

ADC and DAC functions may be designed using a discrete component approach. However, the most time-efficient and PCB space-effective method is to select an integrated circuit (IC) that typically includes the ADC or DAC functions, a multiplexer, and some signal conditioning components.

The data conversion process

Data conversion essentially involves two distinct processes: sampling and quantisation. Sampling determines how faithfully the digital output signal represents the input analogue signal. It is typically quoted as the number of samples per second (s/s). A slow sampling rate is sufficient for slow-changing analogue signals, but a more rapidly changing input requires a faster sampling rate. On the far right of Figure 3, you can see that the analogue input signal is changing more quickly than the sampling rate, resulting in a loss of conversion accuracy.

Figure 3: The impact of sampling rate on the reproduction of a digital output signal (Source: Kuphaldt – http://www.ibiblio.org/))

Quantisation determines the analogue value for each digital bit and the resolution of the ADC. For example, an 8-bit ADC can represent the input signal in 256 levels, but a 16-bit ADC improves the resolution to 65,536 steps, so each digital bit represents 256 analogue values compared to an 8-bit ADC. In general, the use case determines the selection criteria for the ADC’s resolution and sampling rate (Figure 4). Digital-to-analogue conversion uses the same principles of sampling and quantisation.

Figure 4: The quantisation process determines the value of each digital bit and the ADC’s resolution (Source Analog Devices)

Common converter architecture

ADC Architecture

The principal factors influencing ADC architecture are cost (simplicity of design), resolution, or linearity. Each use case will require different architecture attributes, but here are four of the most common.

A flash architecture converts an analogue signal into the digital domain using a parallel array of clocked comparators. Each comparator is fed with the input signal and a set fraction of a reference voltage from a resistor ladder (Figure 8). A flash architecture achieves conversion within one clock cycle, but it requires eight comparators for an 8-bit ADC, which also imposes a high input capacitance.

Figure 8: The outline architecture of a flash ADC (Source: Analog Devices)

A pipelined architecture typically uses a two-stage conversion process, each consisting of a sample and hold, a DAC, and an ADC. The first sample becomes the most significant bit (MSB). It is then fed back and subtracted from the input signal and the residual signal is sampled. This process is repeated for each bit from MSB to LSB. The pipeline model can accommodate a wide dynamic range of input signals and achieve a high resolution, but it is not as fast as a flash ADC and introduces conversion latency.

Successive approximation register (SAR) architecture compares the input signal against a known reference voltage, using successively smaller reference voltages for each digital bit (Figure 9). If the analogue input is greater than the reference, a bit is set. Otherwise, it remains at zero and continues to the next bit. SAR ADCs are compact because they only require a single comparator, and they have no pipelining delay. However, the DAC linearity and any comparator noise can affect accuracy.

Figure 9:  An outline of the SAR analogue-to-digital converter (Source: Analog Devices)

A sigma-delta architecture creates a sigma-delta modulator using an integrator, comparator, and a one-bit DAC (Figure 10). This modulator subtracts a value from the DAC and feeds the result to the integrator. The comparator converts the integrator output to a single-bit digital output, which is fed back to the input. This architecture yields a high resolution and can operate at a fast ‘oversampling’ rate.

Figure 10: The architecture of a sigma-delta ADC (Source: Analog Devices)

Common DAC architecture

Typically, the simplest form of DAC uses string architecture. This deploys a string of precision resistors to create a voltage divider, converting a digital input to an analogue output (Figure 11). It can be prone to resistance-matching issues.

Figure 11: DAC binary-weighted string architecture (Source: Analog Devices)

An R-2R ladder architecture requires just two resistor values in a 2:1 ratio (Figure 12). This architecture suits voltage or current output configurations and avoids the resistance-matching problems associated with string architecture.

Figure 12: The basic architecture of an R-2R ladder DAC (Source: Analog Devices)

String and R-2R architectures use a fixed reference voltage and a fixed gain. However, the multiplying DAC (MDAC) architecture provides a digitally variable gain to a wide dynamic range analogue signal. It uses an R-2R ladder and a programmable gain op-amp. This gives the MDAC the ability to function as a DAC-based attenuator or amplifier and is ideally suited to high bandwidth AC or varying DC signals.

Conclusion

Data conversion is a key skill for engineers today, because it underpins so many of the automated systems on which our world relies. An understanding of popular converter architectures and the common terminology associated with data conversion will aid appropriate product selection.

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1. ZF gains a leading supplier for silicon carbide technology to reliably fulfil electromobility orders worth more than €30 billion
2. ST’s silicon carbide devices will be integrated in ZF’s future modular inverter platform, going into series production in 2025
3. In ST, ZF found a supplier whose experience with complex systems meets ZF’s requirements and which can produce silicon carbide devices in exceptionally high quality and at the required quantities

The technology group ZF will, from 2025, purchase silicon carbide devices from STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications. Under the terms of the multi-year contract, ST will supply a volume of double-digit millions of silicon carbide devices to be integrated in ZF’s new modular inverter architecture going into series production in 2025. ZF will leverage ST’s vertically integrated silicon carbide manufacturing in Europe and Asia to secure customer orders in electromobility.

“With this strategically important step, we are strengthening our supply chain to be able to securely supply our customers. Our order book in electromobility until 2030 now amounts to more than thirty billion euros. For this volume, we need several reliable suppliers for silicon carbide devices,” says Stephan von Schuckmann, member of the ZF Board of Management responsible for electromobility as well as materials management. “In STMicroelectronics, we now have a supplier whose experience with complex systems meets our requirements and who, above all, can produce the devices in exceptionally high quality and at the required quantities.” With this agreement, ZF has gained a world-class supplier for silicon carbide technology, in addition to ZF’s existing partnership agreement on silicon carbide technology announced in February.

“As a vertically integrated company, we are investing heavily to expand capacity and develop our silicon carbide supply chain to support our global and European customers across automotive and industrial sectors, as they pursue electrification and decarbonization targets,” says Marco Monti, President Automotive and Discrete Group of STMicroelectronics. “The key to success in electric vehicle technology is greater scalability and modularity with increased efficiency, peak power, and affordability. Our silicon carbide technologies help deliver these benefits and we are proud to work with ZF, a leading automotive supplier for electrification, to help them differentiate and optimize the performance of their inverters.”

ST will manufacture the silicon carbide chips at its production fabs in Italy and Singapore with packaging of the chips into STPAK, an ST-developed advanced package, and testing at its back-end facilities in Morocco and China.

ZF can connect a variable number of such devices together to match customers’ performance requirements

ST will supply ZF from 2025 with a volume of double-digit millions of third generation silicon carbide MOSFET devices. ZF can connect a variable number of such devices together to match customers’ performance requirements without changing the design of the inverter. Among others, ZF will use the technology in inverters for vehicles of a European car manufacturer whose production start is planned for 2025.

The inverter is the brain of electric drivetrains. It manages the flow of energy from battery to e-motor and vice versa. Inverters have become more efficient and more complex with every development step. The combination of the inverter design and the semiconductors, like silicon carbide, is the key to improving electric vehicle performance. Silicon carbide devices significantly reduce power losses in electric car inverters, as well as in wind turbine and photovoltaic inverters. Devices made with silicon carbide have decisive advantages over conventional silicon-based products, such as higher efficiency, power density and reliability. At the same time, they enable smaller and more cost-effective system designs. Simply put, an electric vehicle charges faster, drives further and has more space when equipped with silicon carbide-based semiconductors.

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Renesas Electronics announced that it has produced its first microcontroller (MCU) based on advanced 22-nm process technology. By employing state-of-the-art process technology, Renesas can provide customers with superior performance at lower power consumption driven by reduced core voltages. The advanced process technology also offers the ability to integrate a rich feature set including functions such as RF. Additionally, the advanced process node uses a smaller die area for the same functionality, resulting in smaller chips with higher integration of peripherals and memory.

The first chip produced on the new 22-nm process is an extension to Renesas’ popular RA family of 32-bit Arm Cortex-M microcontrollers. This new wireless MCU delivers Bluetooth 5.3 Low Energy (LE) with the integration of a software-defined radio (SDR). It offers a future-proof solution for customers building products targeting a long lifetime. Whether during development or after deployment, the devices can be upgraded either with new application software or new Bluetooth capabilities to assure compliance to the latest specification versions.

End product manufacturers can leverage the full feature set of previous Bluetooth LE specification releases. Whether designing devices for direction-finding applications utilizing the Bluetooth 5.1 Angle of Arrival (AoA) / Angle of Departure (AoD) features, or adding low power stereo audio transmission to products by employing Bluetooth 5.2 isochronous channels, developers now only need one device to support all of these features.

“Renesas’ MCU leadership is based on a wide array of products and manufacturing process technologies,” said Roger Wendelken, Senior Vice President in Renesas’ IoT and Infrastructure Business Unit. “We are pleased to announce the first 22-nm product development in the RA MCU family which will pave the way for next generation devices that will help customers to future proof their design while ensuring long term availability. We are committed to providing the best performance, ease-of-use, and the latest features on the market. This advancement is only the beginning.”

Winning Combinations

Renesas will combine the new 22-nm MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 300 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.

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Virtual currency and expanded mobile ordering among the enhancements to Lower.com Field fan experience 

The Columbus Crew hosted their home opener of the club’s second full season in Lower.com Field this March, with several enhancements to what was already one of the highest-tech stadium and fan experiences in professional sport. The best-in-class technology integration throughout the stadium and on display during every home match is made possible through the ongoing support of Vertiv, a global provider of critical digital infrastructure and continuity solutions, and a Founding Partner and Official Data Center Equipment Provider for the Crew.

Vertiv infrastructure equipment supports the network that enables fan entry into the stadium, point-of-sale systems for concessions and retail, a variety of in-game experiences – including the scoreboard and digital signage – and office and administrative IT systems for the club’s front office staff.

During the home opener, the club reported nearly 16,000 unique users and more than 9,500 simultaneous devices on its in-stadium Wi-Fi network. Both numbers are the highest ever recorded at the stadium, which has an official capacity of 20,371.

For the first time, Crew supporters benefitted from a new virtual currency called Crew Cash Through the fan-focused program, individuals have the opportunity to redeem Crew Cash for concessions and retail purchases through the Crew Mobile App. Fans responded positively to the advancement by placing a total number of mobile orders during the opener that represented 37% of those transactions in all of 2022. All Crew point-of-sale and retail point-of-sale systems were integrated with their loyalty and promotion platform, allowing fan flexibility in redeeming and spending Crew Cash on retail and concessions, which was implemented during the off-season.

“We continue to add digital capabilities throughout the stadium to enhance the fan experience, and we’re comfortable pushing the limits the way we do because we have confidence in our digital infrastructure from Vertiv,” said Brandon Covert, vice president of information technology for the Crew and Haslam Sports Group. “In addition to not having any network failures during the first match, we haven’t even had to revert to our backup systems. From an operational uptime perspective, we are performing at an exceptional level. That’s due largely to equipment and services from Vertiv.”

If fans’ phone batteries run low, they can also take advantage of four additional charging stations which allow fans to charge their mobile devices on the go. During the home opener, use of charging stations increased three times compared to last season.

One of the most notable areas of innovation to improve the fan experience is one of the least noticeable – mobile and facial recognition ticketing. These technologies have continued to make entering the stadium fast and easy for fans by allowing them to use facial authentication to pass through the stadium gates without presenting a phone or ticket to scan.

Other new digital elements at the stadium include a camera-based player tracking system, and a digital security system that accelerates physical security screening for a safer in-stadium experience.

“The Crew will celebrate the two-year anniversary of its first match in the new stadium in July, and Vertiv has been there from the beginning to help Major League Soccer’s best fans enjoy the league’s most sophisticated fan experience,” said Pete Klanian, senior vice president, North America sales at Vertiv. “We value our partnership with the Crew because our organizations share core values of teamwork, relentless effort, diversity and, of course, a love for our Columbus home.”

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High-density, scalable, modular power systems solve electrification power conversion challenges

As the automotive industry rapidly moves toward fully electric vehicles with higher-voltage and higher power requirements, power system design engineers are looking for power conversion solutions that have high density, low weight and are scalable across platforms.

Vicor will present four papers at the premiere global automotive engineering event, World Congress Experience 2023 (WCX) in Detroit on April 18 – 20, describing innovative approaches to xEV power conversion using its high-density, scalable, modular power system technology.

The Vicor papers are:

• Reducing Range Anxiety by Reducing Harness Weight Using Power Modules
  Presented by: Nicolas Richard, Director Automotive Sales and Field Applications, Vicor EMEA
• Managing High-Voltage Line Ripple Rejection with High-Bandwidth DC-DC converters
  Presented by: Haris Muhedinovic, Automotive Principal Field Applications Engineer, Vicor

Ranya Badawi, Power Converter Engineer, General Motors
Contributor: Steve Wybo, Technical Specialist, Power Electronics, General Motors

• The Transition to 800V Electric Vehicles: Bidirectional Conversion Between 800V and 400V
  Presented by: Matt Jenks, North American Director of Automotive, Vicor
• Building Redundancy in an Electrical System that Power 400V or 800V Electric Vehicles
  Presented by: Patrick Kowalyk, Automotive Principal Field Applications Engineer, Vicor

Reduced size and weight are necessary for next generation xEV platforms. Vicor modules provide the highest power density and most efficient power distribution for EVs.

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Initial solutions enable video broadcasters and application providers of any size to evaluate, deploy and scale their services immediately and cost-effectively

Avnet and Digital Realty are enabling customers to virtually and cost-effectively evaluate, deploy and scale high-performance, capital-intensive IT hardware for video streaming platforms. The initial solution is founded on a 3rd Gen AMD EPYC based server from Supermicro and integrated with AMD Alveo U30 media accelerator cards.

Avnet Virtual Platforms is an evaluation platform offered by Avnet Integrated, the global advanced systems integration arm of Avnet. The platform enables customers to virtually benchmark workloads on high-performance, typically capital-intensive IT hardware stacks. Once optimized solutions are defined, Avnet Integrated facilitates volume deployment and servicing of the prescribed solutions – providing customers with a single point of engagement throughout the life of the solution. Customers may then focus wholly on extending their competitive advantage, typically found in software innovation, and driving demand with their users.

The initial solution offering is purpose-built to address the growing needs of the global video streaming market which is estimated by Research and Markets to reach $224B by 2028. New, growing, and established digital content providers will benefit from access to high-performance IT hardware, the ability to virtualize their hardware, and efficiently outsource how they purchase video streaming solutions. Typical applications include:

• Live events
• Telehealth
• Live eCommerce
• Customer support & engagement
• eLearning
• Live sports betting
• Live social and collaboration
• Interactive media & entertainment

To satisfy the low-latency requirements of applications like video streaming, and enable immediate scale, Avnet is leveraging Digital Realty and its global footprint of 310+ data centers. This allows customers to evaluate solutions in a production-ready environment of highly interconnected facilities. Digital Realty’s PlatformDIGITAL allows customers to see how their applications will perform when deployed, without having to make the full deployment investment.

Additionally, to deliver the unprecedented compute performance required by these real-time applications, Avnet has deployed Supermicro A+ servers based on AMD EPYC processors & AMD Alveo U30 Media Accelerators. While this solution addresses the low-latency compute and bandwidth requirements inherent to interactive streaming, the Alveo U30 media accelerators simultaneously drive a reduction in the cost per stream and overall power consumption.

“As the insatiable demand for high-performance IT solutions continues, the collaboration with Digital Realty drives a new level of capital optimization, for technology providers and customers, that also accelerates time to market, and scale, of these needed solutions,” said Nicole Enright President, Avnet Integrated.

“Digital Realty is actively supporting the industry’s shift to a data-centric architecture and is evolving its interconnection capabilities with an updated roadmap for PlatformDIGITAL®, a first of its kind global data center platform for scaling digital businesses. Our partnership with Avnet Integrated and the deployment of the first video streaming centric solution from our Santa Clara Campus paves the way for subsequent installations and the expansion of solution profiles (i.e. liquid cooled servers) to accelerate innovation where high-performance matters,” said Tony Bishop, SVP, Enterprise, Platform and Solutions, Digital Realty.

“The live streaming market is rapidly evolving and service providers are urgently looking for ways to reduce infrastructure overhead and the associated capital and operating expenses to scale,” said Sean Gardner, head of video strategy and market development, Video Transcoding Group, AMD. “The Alveo U30 media accelerator, coupled with 3rd generation EPYC processors, maximizes video server density while reducing power and thermal footprint. Now, with its availability through Avnet Virtual Platforms, customers can move from concept to production even faster to meet their market window.”

“Today’s leading high-performance video streaming applications need solutions optimized with the latest innovations,” said Don Clegg, senior vice president, Worldwide Sales, Supermicro. “The Supermicro 1U, AS -1114S-WN10RT, incorporating an AMD CPU with up to 64 cores, is an ideal solution for these compute-intensive workloads.”

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With the current state of the world, it is clear the global energy sector must accelerate the shift from fossil-based systems of energy production to renewable energy sources. Power semiconductors are a key part of this transition. They play an important role in energy conversion, transfer, storage, and increasingly, ensuring that the electricity grid is responsive and efficient.

In Europe, almost a quarter of the EU’s electricity came from renewable sources in 2020. Spain and Greece are among the leading European countries in embracing solar power while the UK and Denmark have constructed large offshore generation plants for wind power. In hydropower production, Norway and France are the leaders.

Factors impeding further renewable adoption

While renewable electricity growth is increasing, there are still significant barriers to overcome. Renewable energy does not work in the same way as coal-fired power plants. There are fluctuations in output, due to the intermittent nature of some renewable energy sources. The excess electricity generated must therefore be stored, so it is available for use later. The problem is exacerbated in the case of solar power because input only comes during the day. But electric usage peaks in the evening when people are at home. More sophistication is therefore required to ensure that stable, reliable power is delivered on demand.

Boosting efficiency using the latest power semiconductors

Power semiconductors are fundamental components to control the power generation and connection of the network from renewable energy sources. They play a vital part in converting power generated from renewables and transmitting it to the grid. For solar panels, the transfer of power is executed through an array of supporting semiconductor devices. These are responsible for adapting the electricity generated by the panels, which is initially in a DC form, into the AC form required for power grid distribution. The efficiency of this conversion is critical to power output and systems costs.

STMicroelectronics is a leader in this arena.  ST’s portfolio offers a wide range of products including high-performance silicon devices and the latest generation of wide bandgap technology to satisfy the high efficiency required by renewable energies. The core of this offer is based on the advanced and innovative properties of new wide bandgap semiconductors, using silicon carbide instead of silicon. These semiconductor devices can achieve efficiencies that were previously unobtainable. ST has been at the forefront of the development of SiC technology for over 25 years.  Compared to what was previously possible with silicon-based technology, ST’s wide bandgap devices can minimize energy wastage by cutting the switching losses by half.

They do so while decreasing the size and weight leading to around 50% reduction in installation costs.

Thanks to their ability to turn on and off far faster, these groundbreaking semiconductors can attain greater conversion efficiencies and handle far greater currents and voltages than previous devices could. This means, for example in the case of solar panels, that each one can support a greater number of solar cells and power, ensuring further cost advantages. In addition, control electronics that were previously separate from the rest of the solar panel, can now be packaged in with it. This brings benefits in relation to heightened reliability and efficiency, as well as reducing the price.

Renewables are changing the power landscape

Advanced semiconductor technologies are also helping transform the power network. The classical power grid operates using what can be thought of as a ‘top-down’ arrangement. The power plants burn fossil fuels generating electricity, and this is then transported via power lines to homes, offices, and factories. A grid based on renewables, however, is structured very differently. It compromises a multitude of distributed power generation sites, rather than just a few large ones. This means that the grid has more places to draw electricity from and may be connected to numerous storage sites used to supplement the electricity generated with additional amounts when required for peaks in demand. Vehicle-to-grid (V2G) technology is also taking off. This means that a battery of an EV can be used to store renewable energy and feed it back to the grid when needed.

Grids, therefore, will increasingly need to be flexible and more adaptable than they have been in the past by leveraging sophisticated processing technology. They will have the intelligence needed to respond to constantly changing situations – sometimes delivering electricity to certain locations, and at other times drawing electricity from them. As a result, there will be an ‘Internet of Energy.’ And, this continuous two-way interaction, between generation and consumption, must be managed.

Microgrids

This more distributed electrical generation strategy relies on the implementation of microgrids. Here small communities, such as hospitals, university campuses, industrial facilities, or office complexes can make themselves more energy-autonomous through local renewable resources (such as a wind turbine, a water wheel, or a bank of solar panels) to generate electricity. If there is a shortfall, additional electricity can be drawn from the main grid. Or they can contribute to the main grid when the energy sourced exceeds local needs. To efficiently manage a complex electric energy distribution network, utilities must have an instantaneous view of energy input and consumption.  Encouraging the right consumer behavior helps to flatten out peaks in demand. Semiconductors are the key enabling technologies for this so-called smart grid concept. ST has a comprehensive offer of power line communications and smart metering solutions that provide the underlying technology.

Decarbonization efforts will increase the demand for renewable energy and its supporting infrastructure. In this ongoing transition, semiconductors are demonstrating their importance to a new emerging clean energy economy and helping to unleash innovations for secure, scalable, and reliable energy solutions.

https://blog.st.com/semiconductors-and-the-clean-energy-revolution/

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Multi-functional Spectrum Analyzer Brings Unprecedented Performance and Measurement Capability to Interference Hunting and Network Verification Applications

Anritsu expands its Field Master MS2080A, a multi-functional spectrum analyzer that combines nine instruments into a single solution, to operate up to 6 GHz. With extended frequency coverage, the MS2080A addresses growing congestion in the 6 GHz spectrum caused by rapid growth in satellite services; cellular, commercial and LMR networks; radio location services; and industrial scientific and medical networks. The compact and portable spectrum analyzer provides insights into interference and intermodulation that degrade network performance through its best-in-class performance and features, bringing distinct benefits to base station installation and maintenance (I&M) applications.

At 6 GHz, the MS2080A features fast sweep speed of 45 GHz/s for greater insight over wider spans. It also has advanced user features, such as AM/FM audio demodulation, and best-in-class RF performance, including +/- 1 dB amplitude accuracy. Additionally, it supports a cable and antenna analyzer, power meter, and 5G/LTE analysis to make it an ideal general-purpose instrument that addresses measurement requirements for legacy and emerging wireless networks.

Options Expand Measurement Capability

Simultaneous with the launch of the MS2080A 6 GHz frequency model, Anritsu announces a new AM/FM modulation quality measurement option for all instruments in the Field Master family. The option enables full characterization of broadcast transmitters, as required by national regulators and transmitter owners. It provides a single screen display of RF spectrum, audio spectrum, and audio oscilloscope, alongside modulation quality and distortion values.

An optional real time spectrum analyzer (RTSA) provides real-time spectrum analysis with 2 µs probability of intercept (POI). The RTSA has up to 40 MHz analysis bandwidth and DANL of <-150 dBm, making it well-suited for capturing intermittent and digitally modulated signals that can be hard to identify. Spectrograms allow irregular and drifting signals to be captured, recorded, and displayed.

The MS2080A conducts a full range of measurements for 5G FR1 radios to support I&M of 5G New Radio (NR) and LTE base stations. Gated sweep analysis for transmitter quality measurements to accurately verify FR1 carriers with 100 MHz bandwidth is provided. The MS2080A offers full-channel, power-based, and 5G/LTE modulation quality measurement-based coverage mapping for accurate Over-the-Air (OTA) testing.

Rugged Design for Any Environment

The MS2080A is a highly durable analyzer that performs in the most challenging environments. It is the only instrument in its class to provide 5 watts of continuous RF input overload protection, preventing costly damage to the instrument’s front-end when used close to high power transmitters or in high signal level environment.

A large 10-inch 1280 x 800 resolution display meets the demanding IK08 specification for direct knocks and drops. Common functions are always accessible from the MS2080A display, and side menus collapse to maximize graphical results.

A soft case provides IP52 environmental protection to safeguard the instrument during transport or rain. Weighing less than 4 kg, the MS2080A is small, compact, and easy to carry.

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ST released its newest EMVCo 3.1 device, the ST25R3916B, for consumer and industrial applications. It facilitates the creation of contactless systems for payment terminals. ST is also shipping the ST25R3916B-EMVCO, a reference design with a four-turn RF antenna. Unlike the previous generation, this new reference design doesn’t feature a display and showcases a smaller antenna to significantly reduce its physical and carbon footprint. Additionally, it can connect to custom antennas to account for various designs, such as a space-constrained payment dongle.

The democratization of contactless payment solutions demands a flawless user experience

EMV was originally the acronym for Europay, Mastercard, and Visa, the companies behind the standard’s first version in 1994. As more payment companies and financial institutions joined, EMV became EMVCo, a global consortium that supervises the development and adoption of standards regulating card payments, whether through a magnetic strip, a chip, or contactless technologies. They oversee the significant technical specifications of the various standards and define the testing and certification process to ensure that devices are truly compliant.

As smartphones and smartwatches became payment solutions, EMVCo’s new mission was to guarantee flawless interoperability between all these solutions to ensure a better user experience for vendors and consumers. EMVCo’s latest certification, the EMV Contactless interface specification v3.1a, continues to solve the challenges arising from the new NFC transmitters that the public uses to purchase goods and services.

What’s new with the ST25R3916B? Better active waveshaping

The ST25R3916B brings more excellent active waveshaping capabilities by providing finer settings to tune the signal. Put simply, active waveshaping adjusts the signal to match PICC (Proximity Integrated Circuit Cards) references by limiting undershoots, thus enabling a faster and more efficient coupling of the reader and the card. EMVCo standards have had stricter undershoot requirements over the years, making active waveshaping even more critical. Consequently, fine-tuning the antenna becomes more complex and sensitive as poor performance can prevent a product from receiving certifications.

ST developed a graphical user interface to optimize workflows to help teams visually select registers that shape the signal and manage the undershoot and overshoot patterns. In a nutshell, when connecting the ST25R3916B to an oscilloscope, the GUI shows a wave pattern to help teams more quickly adjust their signal while monitoring the outcome. Thanks to finer settings, the whole process is faster, only taking minutes. The ST tool thus lowers the barrier to entry to help engineers get started and reduce friction in the early prototyping stages. The software is available upon request.

Heartbeat detection

The ST25R3916B also distinguishes itself with features like heartbeat detection. The functionality helps a reader identify whether it is interacting with a card or a smartphone. This is particularly useful in wireless chargers. Indeed, a Qi charger can potentially destroy regular NFC cards if it mistakes them for a phone and tries to send a charge. Thanks to the heartbeat technology patented by ST, the reader can rapidly distinguish between the two by more precisely analyzing behaviors after communication ends.

The 3 pillars of EMVCo 3.x 1. New PICC Reference Profiles

EMVCo 3.0 was a highly symbolic release because it introduced three reference PICCs (Proximity Integrated Circuit Cards) instead of just one. A PICC reference simulates a payment card to test a reader’s compatibility with the current standard. EMVCo can guarantee better terminals’ interoperability with phones and cards by adding multiple PICC references. Very simply, there are two levels of EMV certifications. EMV Contactless Level 1 ensures that the terminal meets the fundamental electromagnetic and communication protocol requirements. At the same time, Contactless Level 2 focuses on the software validation that implements the payment functionalities which run on Level 1 devices.

Under EMVCo 2.6, the Contactless Level 2 certification initially ensured interoperability between readers and mobile devices or cards. However, it was possible to pass the first level under certain use cases and still have issues during Level 2 tests. Hence, by demanding that readers be compatible with these additional two PICCs, EMVCo 3.0 now protects users against the interoperability issues that plagued EMVCo 2.6.

2. New Matching Frequencies and Loads

Another fundamental aspect introduced with version 3 was that each reference PICC required tests with two loads. On top of the original credit card size PICC tuned to 16.1 MHz, EMVCo has been mandating tests for two additional PICCs tuned to 13.56 MHz, one using a standard credit card size and the other using a design that’s about half the size to account for the smaller antennas of mobile terminals like smartwatches. Moreover, the new standard adds two loads per PICC, meaning the terminal must be tested twice for each card.

Moving to the new standard will require substantially more testing because companies must run six simulations instead of a single PICC reference. Hence, the industry is facing an uphill battle because the new standard, though necessary, makes designing a payment terminal more complex since correcting its antenna for one PICC profile may result in a new incompatibility with the other five. As a result, a device that can be tuned in minutes, thanks to a GUI, really stands out.

3. Better Signal Quality

Finally, since version 3, EMVCo has placed much more stringent regulations on the overshoot and undershoot limits. When a reader tries to couple with a PICC, there is always an energy back and forth. If we look at the waveshape of the signal on the antenna, it takes the form of an overshoot and an undershoot until the reader and PICC match. In EMVCo 2.6, terminals had an overshoot and undershoot allowance of about 10 %, whereas new EMVCo standards now limits the overhead to between 5 % and 10 %, depending on the rise/fall times. Such restrictions will ensure a better signal, but dealing with the new PICC references and all six possibilities is even more difficult than before.

How to Get Started?

The ST25R3916B-EMVCO is a reference design that greatly facilitates the creation of the contactless system of a payment terminal by offering a hardware layout and a code example for an EMVCo 3.1 level 1 stack. The kit features the ST25R3916B reader IC, and unlike the previous version, it doesn’t use a display, as the display was only used for demonstration but was not required by the engineer working on the demo kit. Furthermore, we found that most customers would remove the screen as they worked toward a small form factor. Consequently, the new device reflects the latest industry trends.

The kit, design files, recommendations, and reference code are available upon request to designers. Therefore, they can use it to learn from our implementation, reduce the number of PCBs they have to create for their prototype, and shorten their time to market. The ST25R3916B-EMVCO even includes an STM32L476 with 1 MB of Flash, allowing them to write their application layer comfortably. The board also supports STLINK-V3 to program the MCU quicker without necessarily using a dedicated probe. Indeed, developers can use the USB port to drag and drop firmware onto a virtual storage volume.

Teams that want to use another microcontroller may choose the X-NUCLEO-NFC08A1, which houses the same ST25R3916B, but on an expansion board. It includes a 47 mm x 34 mm four-turn antenna, enabling developers to start working immediately. It is, therefore, a great way to test its automatic antenna-tuning capabilities that ensure operations near metallic objects. The board supports an output power of 1.7 W, which is what most NFC applications need. Users can also download the STSW-ST25R-LIB graphical user interface to configure their ST25R devices.

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STMicroelectronics has launched three new accelerometers with advanced processing engines built-in to extend sensor autonomy, enabling systems to respond more quickly to external events while lowering power consumption.

The LIS2DUX12 and LIS2DUXS12 leverage ST’s third-generation MEMS technology, adding programmable capabilities including machine-learning core (MLC), advanced finite state machine (FSM), and an enhanced pedometer. A third entry-level accelerometer, LIS2DU12, is also available for less demanding applications. All three products are equipped with the latest industry standard I3C interface. The three devices integrate the common digital features for detecting events, as well as an anti-aliasing filter for high accuracy at lower sampling frequencies with performance benefits for accurate gesture detection at negligible power consumption.

The integrated MLC in the LIS2DUX12 and LIS2DUXS12 enables artificial-intelligence (AI) algorithms to perform reliable activity detection and the FSM enhances movement recognition. Together, they provide autonomous processing in the sensor, which offloads host interaction and processing, significantly lowering power consumption and enables faster system responses. In addition, by deploying an adaptive self-configuration (ASC) capability, the accelerometers adjust their own settings (such as measurement range and frequency) independently to further optimize performance making each milliampere count.

The LIS2DUXS12 also features ST’s unique Qvar sensing channel that senses changes in the ambient electrostatic environment to provide presence and proximity detection. This capability lets developers add value to applications such as user-interface control, liquid detection, and biometric sensing such as heart-rate monitors. In user-interface applications, Qvar combined with an acceleration signal removes potential false positive detection in two-tap and multi-tap events.

The smart accelerometers provide context sensing for state-of-the-art wearables devices, True Wireless Stereo (TWS) speakers and earbuds, smartphones, hearing aids, game controllers, smart watches, asset trackers, robotic appliances, and IoT devices. All three products leverage on ST’s latest ultra-low-power architecture, which combines inherently extremely low power consumption with the anti-alias filter that helps to boost application performance, removing unwanted noise from the signal. Ready-to-use MLC and FSM algorithms are available through ST’s MEMS GitHub model zoo, which facilitates complex gestures, asset tracking, and many other use cases.

With these enhancements, the LIS2DUX12 and LIS2DUXS12 enable the coming generation of “onlife” applications that support daily activities intuitively and seamlessly, always on, always aware, and continuously in sync with the user’s needs. They expand ST’s family of MEMS sensors enhanced with AI, which includes inertial measurement units (IMUs) introduced in 2019.

The LIS2DUX12 and LIS2DUXS12 are in production now and available in a 2mm x 2mm x 0.74mm 12-lead LGA package.

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As automotive applications, 5G and 6G, smart devices and many other devices require ever more compact and powerful components, advanced packaging becomes one of the key technologies. With its new SIPLACE CA hybrid placement solution, market and technology leader ASMPT combines semiconductor and SMT production in a single machine and integrates the production of SiPs (system-in-packages) directly into the SMT line. The SIPLACE CA2 processes SMDs and dies taken directly from the wafer in a single step at speeds of up to 50,000 dies or 76,000 SMDs per hour with a precision of up to 10 μm @ 3 σ. The result: maximum flexibility, efficiency, productivity and quality paired with enormous savings in terms of time, cost, space, and tape waste. In addition, the advantages of SIPLACE technology are now also available to the semiconductor world with “full single die level traceability” and the various automation options made possible by ASMPT’s flexible and manufacturer-independent Open Automation concept for the integrated smart factory.

In high-speed SiP manufacturing, such as for smartphones and tablets, some dies are processed directly from the sawn wafer while other flip chips and components such as passive components from tape & reel. Until now, this is usually done in two separate processes. With the new highly flexible and powerful SIPLACE CA2 placement platform, ASMPT is integrating the ability to process dies directly from the sawn wafer into the high-speed SMT line.

“The SIPLACE CA2 brings together what belongs together in the SiP age and opens up new dimensions in advanced packaging. The highly flexible configuration and leaner processes create new opportunities, open up new markets and customer groups for electronics manufacturers, and increase productivity while reducing costs, thus delivering significant competitive advantages,” explains Sylvester Demmel, Senior Product Manager at ASMPT SMT Solutions.

Die buffer and parallelization solve speed problems

One of the main obstacles to the combined handling of SMT components and dies used to be the slow process of fetching dies directly from the wafer. On the wafer, which is delivered sawed, the dies are affixed to a carrier film from which they must first be detached before they can be assembled – a process that is almost impossible to accelerate.

The SIPLACE CA2 solves this problem with a buffer storage module that operates similar to a placement head and can hold 16 new dies (plus four on the flip unit) while the placement head itself is placing dies. This separates the pickups from the wafer from the die placement and parallelizes them, thus bringing the machine’s placement performance close to that of the SMT world. In this way, the innovative solution processes up to 40,000 flip-chips or up to 50,000 chips in the die-attach process, or up to 75,000 SMT components from tapes per hour with a placement accuracy of up to 10 μm @ 3 σ.

Maximum flexibility for die processing

Unrivalled, the SIPLACE CA2 has a wafer exchange system that holds up to 50 different wafers. A wafer swap takes only 6.5 seconds. This saves valuable space on the shop floor, creating room for more fast machines and automated storage and transport solutions.

Cost-saving and sustainable

Collecting the dies directly from the wafer also makes the die-taping process unnecessary. Eliminating tapes offers several benefits. Depending on the production volume, the cost savings can run into the millions – for the taping material itself as well as for its storage and disposal. In addition, taking the chips directly from the wafer makes the production more sustainable because it avoids tape waste that can be huge.

Full traceability and software integration

The full traceability of components that is already mandatory in many markets continues to pose major challenges in the world of semiconductors. The SIPLACE technology offers great benefits in this field with its “full single die level traceability”, which automatically logs each die’s pick-up position as well as its placement position on the board.

In addition, the SIPLACE software offers fast program and product changeovers, placement program portability to any machine of the same type, and fast and comprehensive substrate mapping. Many applications in the efficiency- and productivity-enhancing WORKS shop floor management suite are also available for the SIPLACE CA2 for things like setup verification, optimization, and logistics.

Open interfaces for the integrated smart factory

In addition to the SECS/GEM interface, which is important for semiconductor production, the SIPLACE CA2 offers the IPC-CFX open communication standard – one of the basic prerequisites for the integrated smart factory. As a result, seamless data communication can now be ensured also for the die handling process – on the shop floor as well as with factory and enterprise solutions. In this way, the SIPLACE CA2 can be fully integrated into Open Automation, the modular, manufacturer-independent and ROI-based automation concept of ASMPT.

The SIPLACE CA2 boosts productivity in advanced packaging by combining classic SMT with die-attach and flip-chip assembly.

Interior view of the SIPLACE CA2: The placement machine can simultaneously process classic 8-millimeter tapes as well as dies directly from the wafer.

A sawed wafer gets fed from the wafer exchange unit into the multi-wafer system. The wafer swap takes only 6.5 seconds.

The SIPLACE CA2 delivers maximum performance and flexibility in a footprint of only 2.56 × 2.50 meters

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The government said it has approved 34 electronic components manufacturing proposals worth Rs 11,187 crore till March 30 this year. In a written reply to Lok Sabha, Minister of State for Electronics and IT Rajeev Chandrasekhar said the government had notified a Scheme for Promotion of Manufacturing of Electronic Components (SPECS) on April 1, 2020, and applications were received till March 30, 2023.

“As on March 30, 2023, 120 applications have been received under SPECS. The applications received under the scheme are from domestic companies. As on March 30, 2023, thirty four applications with total project cost of Rs 11,187 crore have been approved under the scheme,” he said.

Under the scheme, the approved proposals include those from Tata Electronics, Samsung Display Noida Pvt Ltd, Salcomp Technologies, Sahasra Semiconductors, IdemiaSyscom, Deki Electronics, Molex India and Continental Device India Pvt Ltd.

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Minister of State for Commerce and Industry Anupriya Patel

Minister of State for Commerce and Industry Anupriya Patel said the commodities exhibiting trade deficit with China constituted 86.7 per cent of the total trade in 2014-15, which has reduced to 83.8 per cent of the total trade with China in 2021-22.

Some of the services in which India has a trade deficit with China include construction, telecommunication, computer and information services, maintenance and repair services, Minister of State for Commerce and Industry Anupriya Patel said in a written reply to the Lok Sabha.

She said the commodities exhibiting trade deficit with China constituted 86.7 per cent of the total trade in 2014-15, which has reduced to 83.8 per cent of the total trade with China in 2021-22. Similarly, the services exhibiting trade deficit with China contributed 30.3 per cent to the total trade with China in 2014, which has reduced to 18.5 per cent in 2019, she said.

Replying to a separate question, she said India has signed 13 Free Trade Agreements (FTAs) with its trading partners including the UAE, Australia and Singapore.

“India is currently negotiating FTAs with the United Kingdom, the European Union and Canada. However, it is difficult to predict the timeline for completion of negotiations, as agreements are entered into when negotiating countries are satisfied with the outcome, she added.

In another reply, Patel said that as announced in Union Budget 2022-23, Special Economic Zones Act, 2005 will be replaced with a new legislation that will enable states to become partners in Development of Enterprise and Service Hubs.

“The legislation is currently under inter-ministerial consultations,” she said.

Replying to a question on startups, Minister of State for Commerce and Industry Som Parkash said that since the launch of Startup India initiative in 2016, Department for Promotion of Industry and Internal Trade (DPIIT) has recognised 92,683 entities as startups as on February 28.

As of February-end this year, Rs 537.25 crore has been approved to 148 incubators by the Experts Advisory Committee under Startup India Seed Fund Scheme and Rs 235.25 crore has been disbursed to the approved incubators.

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Over the years, India’s EV (Electric Vehicle) industry has experienced tremendous growth. Significantly, the Indian auto industry is currently ranked fifth on the global automobile landscape and is predicted to go up to third place by 2030. The fact that the Indian EV market is predicted to increase tremendously at 49% CAGR (Compound Annual Growth Rate) by 2030 demonstrates the crucial significance of the EV sector in India. The number of Neobanks, NBFCs (Non-Banking Financial Companies), financing companies, etc. in the EV financing market is rising in India. By 2030, it is anticipated that the country’s EV Finance market will be worth more than $3.7 trillion. The EV sector has received proper recognition from the government in the financial budget 2023-24 by enacting supportive rules that will promote the ecosystem’s multifaceted growth.

Here are the top 4 EV leasing startup companies in India that are making a mark in this emerging industry:

ALT Mobility – ALT Mobility is a full-stack EV leasing platform that offers mobility as a service (MaaS) for commercial vehicle users. The platform enables businesses to lease electric vehicles (EVs) on a monthly basis and utilize their superior ecosystem of services. The company’s tech-enabled commercial EV leasing platform underwrites technology and credit risks to provide the lowest cost of finance to fleet partners, ensures high uptime with fleet management technology, and ultimately drives adoption for electric vehicles across the sector.

Lithium Urban Technologies – Lithium Urban Technologies is one of the largest electric vehicle fleet operators in India. They provide end-to-end EV fleet management solutions to corporates and government organizations. Their EV leasing services include electric cars, electric buses, and electric bikes. Lithium has charging hubs installed at multiple sites across several cities in India with the capacity to charge various cars and buses simultaneously, equipped with fast chargers that can charge a sedan in 90 minutes and slow chargers that can do so in 8 to 9 hours.

eMatrixmile – eMatrixmile is a Mumbai-based EV leasing startup that provides electric bikes and electric scooters on a monthly subscription basis. They offer doorstep delivery and pickup services and have monthly plans starting from as low as INR 3,500. eMatrixmile leverages the latest technologies, including artificial intelligence and machine learning, to optimize their clients’ supply chains and improve their operational efficiency.

Euler Motors – Euler Motors is a Delhi-based EV startup that provides electric vans on lease to logistics and e-commerce companies. Their electric vans have a range of up to 150 km and can carry a maximum load of 1 ton. The company’s mission is to build electric vehicles that are not only eco-friendly but also efficient and affordable for businesses.

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MacDermid Alpha will showcase its integrated solutions for circuit board assembly, including high-reliability solder pastes combined with compatible reinforcement and protective polymers. Additionally, materials and processes for die, package, and top attach will feature which are of particular importance for the expanding Chinese power electronics industry.

Ensuring board level reliability is critical as the demands for performance and longevity increase, especially in harsh end-use environments, such as automotive, 5G, and infrastructure. MacDermid Alpha will feature assembly materials, including the ALPHA CVP-390V and OM-565 HRL3 high-performance solder pastes which when combined with its ALPHA HiTech reinforcement and Electrolube protective polymers can provide exponentially improved performance and reliability. MacDermid Alpha has rigorously tested these products in combination to provide the optimum materials for the end-use application.

Additionally, MacDermid Alpha offers a complete product offering for semiconductor assembly focusing on range, power, and reliability. The Argomax portfolio is renowned for its ability to be sintered at lower pressures than some competitor brands, leading to a leaner, more cost-effective in-line process. Argomax2148, the latest product offering is a sinter paste engineered for low-pressure processing and offers the additional bonus of being suitable for contaminated heat sink surfaces.

MacDermid Alpha is powering the future of circuit board assembly and semiconductor assembly solutions, developing products to meet the ever-changing requirements and standards for the automotive, communication, and power industries. Let’s start a conversation in Hall N4 booth 4528.  The MacDermid Alpha team looks forward to meeting you to discuss how to elevate your process with an integrated ‘start to finish’ roadmap featuring some of the most advanced technologies on the market, backed by extensive R&D facilities, a secure supply chain, and extraordinary customer service. Established brands aligned under MacDermid Alpha Electronics Solutions include Alpha®, Compugraphics, Electrolube, Kester, and MacDermid Enthone. MacDermid Alpha will resolve your pain points today, tomorrow, and beyond.

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Renesas Electronics announced that its cellular-to-cloud development kits powered by Renesas’ 32-bit microcontrollers (MCUs) now fully support Microsoft’s popular Azure cloud services. The two Cloud Kits – the CK-RA6M5 and CK-RX65N – enable users to readily connect and manage wireless IoT devices via the cloud. With these latest updates, IoT device developers can now take advantage of unique features and services available through Azure, an open and flexible cloud computing platform used by billions of devices worldwide.

Both cloud development kits incorporate Renesas’ LTE CAT-M1 module, which wirelessly connects MCUs to cloud services without a gateway. The kits are equipped with Microsoft’s new Embedded Wireless Framework, providing a simplified link to the Azure cloud platform. The Embedded Wireless Framework lets any network adapter securely connect to the cloud, providing greater flexibility and better lifecycle management of cloud-based products. Asset tracking, building automation, medical data management, voice command and industrial control are some of the embedded applications that can benefit from the Renesas Cloud Kits.

To ensure reliable functionality and interoperability, both CK-RA6M5 and CK-RX65N kits have been certified by Microsoft Azure. This means that the devices are validated to connect with Azure IoT Hub and can be securely provisioned through the Device Provisioning Service. Additionally, both devices are IoT Plug and Play-certified, enabling developers to integrate the devices into their solutions using pre-defined device models. This eliminates the need to manually configure hardware.

The Renesas Cloud Kits include a high-performance MCU, the RYZ014A Cat-M1 Pmod, six on-board sensors, and extensive peripherals, including a USB FS connector, USB-to-UART serial converter, two PMOD connectors, and a battery connector. For additional layers of security, Renesas collaborated with its partner, Crypto Quantique to implement a software-based IoT cryptography platform that securely connects IoT devices to server-hosted applications on-premises or in the cloud. Hardware-based security such as the Renesas Secure Crypto Engine 9 (SCE9) and Trusted Secure IP (TSIP) driver has been incorporated on the RA6M5 and RX65N MCUs respectively.

“The opportunities that the Azure cloud platform brings to IoT developers are limitless,” said Roger Wendelken, Senior Vice President and Head of MCU Business in Renesas’ IoT and Infrastructure Business Unit. “Our Azure-enabled Cloud Kits provide engineers with a powerful development environment to create, evaluate and deploy cloud-based IoT solutions with confidence. With real-time data analytics and easy integration with other Azure services, developers can focus on building best-in-class IoT applications.”

“Bringing the Renesas Cloud Kits into the Azure cloud ecosystem is a natural step forward,” said Stefan Wick, Product Lead IoT Edge and RTOS at Microsoft Azure. “By customizing the Embedded Wireless Framework for Renesas’ MCUs, engineers can reuse application code across different IoT products and leverage a flexible abstraction interface for seamlessly connecting IoT systems to the Azure cloud services. Using the pre-configured development platform, system developers can leverage the power of Azure IoT and create reliable and scalable IoT solutions, while saving time and cost for development.”

“We are proud to have been involved in the implementation of enhanced security measures for the Renesas Cloud Kits, as well as providing seamless and speedy connectivity to the Azure cloud,” said Chris Jones, Director of Applications at Crypto Quantique. “Our QuarkLink IoT platform provides industry-leading security, giving customers peace of mind knowing that their data and devices are secure.”

Simplifying AI/ML at the Edge

Renesas’ Cloud Kits make it easy to collect data from onboard sensors, upload them to the cloud for AI/Machine Learning processing and tools, and download the model back to the end point. Simplified development software is available out-of-the-box, including Reality AI Tools and Edge Impulse Studio. Reality AI Tools provide a true endpoint AI for a range of applications, including anomaly detection and voice recognition. The Edge Impulse Studio integrated cloud environment enables end-to-end AI/ML development using the kits’ accelerometer for asset and package tracking use cases.

Winning Combination

The Renesas Cloud Kits are part of the Quick-Connect IoT Platform where developers can seamlessly connect to additional sensors or connectivity options via the standard Pmod interfaces. This enables users to easily expand their use-cases and even graphically build software with Quick-Connect Studio. Learn more about these solutions with the Cellular Cloud Connected System Winning Combination which can help accelerate time-to-market.

Renesas MCU Leadership

A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, and is the industry’s No. 1 supplier of 16- and 32-bit MCUs combined, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 200 ecosystem partners.

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Wise-integration, a French pioneer in digital control of gallium nitride (GaN) power supplies and GaN ICs, and Powernet, a leading Korean power supply manufacturer, announced an agreement to build compact and energy-efficient technology for power-supply applications that are currently limited to analog control.

The memorandum of understanding addresses the needs of OEMs that require compact, digitally controlled power-supply systems for faster, smaller and more energy-efficient electronic equipment in products ranging from USB PD fast chargers to monitors, TV sets and electric vehicles.

The breakthrough system will combine Wise-integration’s WiseWare digital controller and Wisegan, a 650V enhancement-mode GaN-on-silicon IC for power applications from 30W to 3kW, with Powernet’s switched mode power supply (SMPS) technology that efficiently converts electrical power.

“We expect our collaboration to be the start of a new era in the power-supply industry by combining Powernet’s well-established experience in productizing power supplies and Wise-integration’s GaN IC  and digital-control technologies,” said Lee Don Ju, CEO of Powernet, which is a supplier to Korea’s semiconductor industry. “This combination will deliver a much higher level of energy efficiency to mass-market products, while reducing their environmental impact.”

“This partnership, guided by our long-term business and development roadmap, will bring Wise-integration’s unique GaN IC and digital-control technologies to global markets and enable Powernet to increase the power density and reduce the size of its SMPS products,” said Thierry Bouchet, CEO of Wise-integration. “We will jointly deliver the high-level of compactness and superior performance required for the mass-market applications.”

Gallium nitride (GaN) is a wide-bandgap, next-generation semiconductor technology that has become key for development of advanced power electronics. It operates up to 20x faster than silicon and provides up to 3x the power or 3x the charge in half the size and weight of silicon devices.

Wise-integration is the first company to bring digital control to the power-supply market, where previously only analog controls were available. Original design manufacturers (ODM) such as Powernet are trying to meet growing demands from original equipment manufacturers (OEM), which require increasingly small and ultra-efficient power supplies for their future product lines. GaN is seen as a key material to delivering these features, but it is very difficult for power-suppy manufacturers to go above switching frequencies of 300kHz with analog devices.

Composed of a standard MCU 32-bit-based controller and running the company’s proprietary firmware, WiseWare manages the WiseGan devices and controls the power supply. Because fewer components are required than in analog controllers and thanks to high running frequency, the new power-electronic architecture reduces weight and volume of standard solutions by 30 percent and significantly reduces production costs.

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NeoCortec, manufacturer of ultra-low-power bi-directional wireless mesh network modules, has recently supplied NeoMesh modules for a project from Nrlyze, a Swedish tech company specialized in optimizing heating and ventilation systems in large buildings. For an old three-storey office building made of 35cm thick brick walls in central Copenhagen they were looking for a suitable wireless network to control the heating system as the building is connected to Copenhagen’s public district heating system and therefore had to fulfill specific requirements regarding the correct temperature drop in the system.

Using NeoCortec’s NeoMesh modules it took only two and a half hours to install 93 temperature and humidity sensors in the building. After being installed in all offices and corridors across the three floors, the NeoMesh sensors automatically connected to each other using the unique self-governing NeoMesh network protocol. No main power cabling was needed as the sensors are battery powered. Immediately after installation, the sensors started to transmit measurement data via the central NeoMesh gateway to the cloud without any need for configuring the network. And, as the NeoMesh network is self-governing, data always finds a way from sender to receiver. The network nodes form an invisible spider’s web of communication channels, and if one communication path is blocked then data automatically just finds an alternative route to its destination.

Explains Lars Hansson, CEO at Nrlyze: “We chose NeoMesh from NeoCortec because it enables our team to quickly roll out a large sensor infrastructure. The network sets itself up and automatically establishes connectivity between the sensors. What makes it particularly easy is the fact that you only need one central gateway to collect all the sensor data and transmit them from the building to the Nrlyze cloud platform. There is no need for repeaters or additional gateways to connect different parts of the network. Embedding the NeoMesh protocol in Nrlyze’s platform has been a smooth and successful process. We are looking forward to expanding our collaboration with NeoCortec further.”

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KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, announce that direct links to simulation models for its most popular embedded antennas are available in the latest release of the globally renowned Ansys HFSS 3D electromagnetic simulation software, Ansys 2023 R1.

Engineers use Ansys HFSS software to design high-frequency, high-speed electronics optimized for use in applications including communications systems, ADAS, satellites, and IoT devices. The latest release, Ansys 2023 R1, empowers users to run large jobs and overcome hardware capacity limitations with new high-performance computing and cloud capabilities, enhanced solver algorithms, and powerful graphical processing units. It also supports new collaborative, model-based systems engineering workflow capabilities and integrated more AI and machine learning capabilities to further improve engineering efficiency and accelerate innovation.

Ansys 2023 R1 features direct links to simulation models for 13 of the most popular KYOCERA AVX antennas, including embedded FR4 and ceramic GNSS, ISM, BLE, Wi-Fi, LPWA, 5G/LTE antennas widely employed in IoT, medical, and automotive applications. When users click on the 13 KYOCERA AVX antenna components featured in the Ansys 2023 R1 software, they will be transported to the KYOCERA AVX website to download the simulation files.

These 13 embedded antenna models are also available on the KYOCERA AVX website for Ansys HFSS versions 2019 R3 to 2022 R2. In addition, a complete range of KYOCERA AVX embedded antenna models designed for use with all of these versions will be available in Q2 2023.

“Many of our customers utilize Ansys HFSS software, and they used to have to contact us for compatible antenna simulation files. So, we’re very proud that our 13 most popular embedded antennas are featured in Ansys 2023 R1 and available for direct download on our website,” said Carmen Redondo, Director of Global Marketing Antennas, KYOCERA AVX. “We’re committed to providing our customers with a comprehensive suite of tools and resources engineered to make antenna integration as easy as possible and ensure optimal performance. So, we’re also proud to offer an increasing array of electromagnetic simulation model downloads compatible with Ansys versions 2023 R1 and 2019 R3 through 2022 R2 on our product pages.”

“We’re pleased to offer a selection of KYOCERA AVX’s embedded antennas in our new Ansys 2023 R1 software,” said Matt Commens, Senior Manager – Electronics Product Management, at Ansys. “The new products, technologies, and tools available in 2023 R1 enable engineering teams to simulate and rigorously examine products and systems under varying conditions, gain precise insights, and optimize designs at every stage of the product development process, regardless of application.”

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