ELE Times

If we had to summarize the spirit that drives the AEK-POW-BMS63EN development board in one word, it would be accessibility. Battery management applications are notoriously challenging, and building one capable of meeting the automotive industry’s stringent requirements is even more complex. Consequently, a device like the L9963E can feel daunting. The component offers fast and precise measurements that enable state of charge (SOC) and state of health (SOH) estimations and play an active role in operations like charge balancing, which directly increases the lifespan of the battery cells. However, it also means that battery management applications can remain out of reach to those with less expertise, which is becoming a more significant issue.

Indeed, complex battery management solutions are no longer limited to electric cars, which creates a problem of accessibility. While experts rapidly take the L9963E and start using it in their custom reference design, more and more teams are new to this type of application. The e-mobility market has expanded to e-bikes, e-scooters, delivery robots, and more. Additionally, the democratization of home batteries that store energy from solar panels also means that battery management systems are penetrating new markets. As a result, teams with little to no experience in this field can end up struggling. That’s why we came up with the AEK-POW-BMS63EN, and AEK-COM-ISOSPI1 basic building blocks, and the AutoDevKit ecosystem.

The AEK-POW-BMS63EN and its hardware ecosystem Creating a daisy chain AutoDevKit Studio showing a configuration with multiple nodes

The AEK-POW-BMS63EN improves accessibility by providing a connector to the battery pack that works easily with the AEK-POW-BMSHOLD, a holder capable of storing up to 14 cylindrical INR 18650 battery cells in series. Put simply, even someone without experience in this application can grab the holders, add cells, and connect them to the L9963E board.. The holder also makes it easier to connect the load and install temperature sensors. Moreover, it is possible to daisy chain up to 31 AEK-POW-BMS63EN nodes thanks to the board’s isolated (ISOL) ports, which use a USB connector and a cable implementing a two-wire isolated SPI interface to ensure greater communication stability and better protection from noise.

Connecting an MCU board The AEK-POW-BMS63EN in a single board configuratIon

To connect the L9963E board to an MCU, ST developed the AEK-COM-ISOSPI1, a dongle featuring the L9963T transceiver. It enables an isolated SPI connection between the battery management system and a host MCU board like the AEK-MCU-C4MLIT1. It’s possible to use the system without isolation to save costs, which makes sense in lower power systems. Conversely, in designs handling more than 48 V or very high current, the isolation between the boards in the daisy chain and with the host MCU offers protection against adverse events, thus providing a robust implementation to those with little experience. In fact, all our boards come with schematics and bills of materials.

The AEK-POW-BMS63EN and its software ecosystem Starting with AutoDevKit Studio

ST’s commitment to accessibility goes as far as enabling the use of the AEK-POW-BMS63EN with another MCU board than the one we suggest in this blog post. We even recognize that a team could use another MCU maker entirely. Our goal is to make battery management solutions more approachable to all teams, including those that work on competing systems. However, many choose our SPC boards because they enable developers to take full advantage of the AutoDevKit ecosystem, which comes with unique implementations that can shorten the time to market by several months or even a year.

AutoDevKit Studio showing a dual ring configuration

For instance, the AutoDevKit Studio IDE has all the drivers, middleware, and GUIs to facilitate configuration operations. In very practical terms, developers can delve into the documentation, study each register, and take the time needed to program their proof-of-concept. Or, they can open AutoDevKit Studio and get started in a few clicks. There are even demo implementations, such as dual ring configuration. In this setup, engineers connect both ends of the daisy chain to the MCU board, thus creating a redundancy that automatically routes the signal to the secondary ring if the primary one fails. Therefore, creating a genuinely robust implementation only takes a few boards.

Learning from AutoDevKit Studio

Since we published our first blog post on AutoDevKit in 2020, the software ecosystem has grown to benefit more than just automotive applications. This has been even more true with battery management solutions where developers can use the GUI to grasp complex notions like coulomb counting or cell balancing. We also provide a Getting Started Guide to walk new engineers through the available demos. The documentation even details the major APIs that will help teams create their application. In a nutshell, even integrators who don’t work on cars can use the AutoDevKit ecosystem as an educational tool to help them understand battery management and design their solution faster.

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Microsoft has set specific requirements for a PC to be classified as a Copilot+ PC. These include:

• A Neural Processing Unit with at least 40 TOPS (trillions of operations per second)
• 16GB of memory
• 256GB of storage

Snapdragon X Series processors meet and exceed these specifications, ensuring that Copilot+ PCs deliver exceptional performance.

What is an NPU?

An NPU, or neural processing unit, is a dedicated processor within a larger system on chip (SoC). It is designed specifically to accelerate neural network operations and AI tasks, enhancing the capabilities and efficiency of AI applications.

What Does TOPS Mean?

TOPS stand for trillions of operations per second, a metric used to measure the power and velocity of AI processing. It signifies the maximum achievable throughput for an NPU. To qualify as a Copilot+ PC, a device must deliver at least 40 NPU TOPS.

What is On-Device AI?

On-device AI refers to AI processing capabilities that operate directly on the device, rather than relying solely on cloud-based AI. This approach provides several benefits:

• Speed: Faster response times as data does not need to be sent to the cloud for processing.
• Security: Enhanced security since sensitive data remains on the device.
• Optimization: Highly optimized performance tailored to the specific hardware of the device.
• On-device AI works in harmony with cloud AI, delivering a robust and reliable AI computing experience directly on the laptop.

Copilot+ on Windows: Enabling Smart Innovations for Enhanced Productivity

Copilot+ PCs, powered by Snapdragon X Series processors, introduce a new era of productivity and innovation on Windows. With features like automatic meeting recaps, email composition assistance, advanced search capabilities, and simplified content creation, users can achieve more with less effort, leveraging the powerful on-device AI capabilities.

1. Effortlessly Recap Meetings:

• Feature: Automatic meeting summaries
• Benefit: Instead of multitasking during meetings, users can ask for a summary before signing off, ensuring they don’t miss important points.

2. Compose More Effective Emails:

• Feature: Email composition assistance
• Benefit: Get suggestions on delivering sensitive information effectively or tips to improve clarity and tone, making communication more impactful.

3. Find Information Faster:

• Feature: Advanced search and analysis
• Benefit: Instantly find, create, summarize, and analyze information without the need to open multiple apps and files, streamlining workflows.

4. Create Content More Easily:

• Feature: Content creation tools
• Benefit: Transform your words into a PowerPoint presentation complete with visuals, simplifying the process of content creation and presentation.

Snapdragon X Series: Enhancing Performance and Efficiency

The Snapdragon X Series processors are engineered to help applications run fast while consuming significantly less power. With a multi-day battery life, these processors reduce downtime and frustration, allowing you to stay on task. Key benefits include:

• Extended Battery Life: Work for hours on a single charge, maximizing productivity without frequent recharges.
• Smooth Performance: Run the latest apps without lags or delays, ensuring a seamless user experience.
• Quick Responses: Get lightning-fast responses to queries, enhancing efficiency in daily tasks.

Advanced Security and Privacy

Chip-to-Cloud Security:

The Snapdragon X Series provides robust security, starting from the chip and extending to various safeguards such as:

• Qualcomm Secure Processing Unit
• Qualcomm Trusted Execution Environment (TEE)
• Microsoft Pluton

All Copilot+ PCs are Secured-Core PCs by default, ensuring advanced protection against cyber threats.

Personalized Privacy Controls:

• On-Device AI: Keeps tasks and data on your device, maintaining privacy and security.
• Recall: Utilizes information you’ve seen or created with snapshots built and stored entirely on your device. These snapshots remain private and are not shared.
• Liquid Text: Employs AI features running entirely on the NPU, ensuring your data stays private and secure.

Copilot+ PCs powered by Snapdragon X Series processors offer enhanced performance, efficiency, and security. With extended battery life, smooth app performance, quick responses, and advanced security measures, these PCs provide a robust and reliable platform for users. Personalized privacy controls and on-device AI ensure that your data remains private, enabling you to work confidently and securely.

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Infineon Technologies AG introduces the 600 V CoolMOS 8 high voltage superjunction (SJ) MOSFET product family. The devices combine the best features of the 600 V CoolMOS 7 MOSFET series and are the successors to the P7, PFD7, C7, CFD7, G7 and S7 product families. The new superjunction MOSFETs enable cost-effective Si-based solutions that enhance Infineon’s wide-bandgap offering. They are equipped with an integrated fast body diode, making them suitable for a wide range of applications such as server and industrial switched-mode power supply units (SMPS), EV chargers, and micro-solar.

The components come in SMD QDPAK, TOLL and ThinTOLL 8 x 8 packages, which simplifies designs and reduces assembly costs. At 10 V, the 600 V CoolMOS 8 SJ MOSFETs offer 18 percent lower gate charge (Qg) than the CFD7 and 33 percent lower than the P7. At 400 V, the product family offers a 50 percent lower output capacitance COSS than the CFD7 and the P7. In addition, the turn-off losses (Eoss) have been reduced by 12 percent compared to the CFD7 and the P7 and the reverse recovery charge (Qrr) is 3 percent lower compared to the CFD7. Furthermore, the devices offer the lowest reverse recovery time (trr) on the market and the thermal performance has been improved by 14 to 42 percent compared to the previous generation.

With these features, the devices offer high efficiency and reliability in soft-switching topologies such as LLC and ZVS phase-shift full-bridge. They also provide excellent performance levels in PFC, TTF and other hard-switching topologies. Due to their optimized RDS(on), the devices offer higher power density, allowing products in a Si-based super junction (SJ) technology to be reduced to a single-digit value of 7 mΩ.

Infineon will showcase the 600 V CoolMOS 8 SJ MOSFETs at the Infineon booth (Hall 7 / Booth 470) at PCIM 2024 in Nuremberg.

Availability

Samples of the 600 V CoolMOS 8 SJ MOSFETs are now available. More information is available at www.infineon.com/coolmos8.

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Cambridge GaN Devices (CGD) has launched two new packages for their ICeGaN family of GaN power ICs. These new packages are designed to enhance thermal performance and simplify inspection, targeting applications in data centres, inverters, and more. Variants of the well-proven DFN style, both packages are noted for their extreme ruggedness and reliability. This development supports CGD’s mission to make greener electronics possible through innovative semiconductor technology.

1. DHDFN-9-1 (Dual Heat-spreader DFN)

Design: Thin, dual-side cooled package with a 10×10 mm footprint.

Features:

• Wettable flanks for simplified optical inspection.
• Low thermal resistance (Rth(JC).
• Flexible cooling options: bottom-side, top-side, and dual-side.
• Dual-gate pinout for optimal PCB layout and easy paralleling.

Advantages: Outperforms the TOLT package in top-side and dual-side cooling configurations, supporting applications up to 6 kW.

2. BHDFN-9-1 (Bottom Heat-spreader DFN)

Design: Bottom-side cooled package with a 10×10 mm footprint.

Features:

• Wettable flanks for easy inspection.
• Thermal resistance of 0.28 K/W, matching or exceeding other leading devices.
• Similar footprint to the TOLL package, allowing for a common layout and ease of evaluation.

Benefits of Improved Thermal Resistance

1. Increased Power Output: More power at the same RDS(on).
2. Lower Operating Temperatures: Devices run cooler for the same power, reducing heatsinking needs and system costs.
3. Enhanced Reliability: Lower temperatures lead to higher reliability and longer lifetimes.
4. Cost Efficiency: Designers can use lower-cost parts with higher RDS(on) while achieving the required power output.

These advancements in packaging technology enable the GaN power ICs to offer superior performance, reliability, and cost-effectiveness, contributing to greener and more efficient electronic solutions.

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The VIAVI Automated Lab-as-a-Service for Open RAN (VALOR) has come out with the O-RU conformance, performance, security, and subsystem interoperability tests based on O-RAN ALLIANCE specifications. The services are well-suited for radio manufacturers aiming to participate in the National Telecommunications and Information Administration (NTIA) Public Wireless Supply Chain Innovation Fund (PWSCIF) Second Notice of Funding Opportunity (NOFO 2), which focuses on Open Radio Unit (O-RU) Commercialization and Innovation.

For radio manufacturers, VALOR offers an on-demand test suite, including O-RU conformance, performance, security, and interoperability testing. Additionally, VALOR provides Massive MIMO and beamforming over-the-air (OTA) validation, including system-level Massive MIMO performance testing for up to 16 parallel spatial layers, utilizing a full set of golden O-RAN compliant O-RUs, O-DUs, and O-CUs provided by several reputable partners and a large RF anechoic chamber.

VALOR, made possible by a $21.7 million grant from the first PWSCIF Notice of Funding Opportunity, provides fully automated, open, and impartial testing and integration for Open RAN. It provides a pathway to certification in the U.S. for new entrants, startups, and academia. Access to VALOR is free for academic institutions and NTIA co-grantees, subject to availability, enabling O-RU vendors to meet the comprehensive performance requirements needed by mobile network operators (MNOs) to deploy their equipment at scale as required by NOFO 2.

VALOR is based on VIAVI’s industry-leading NITRO Wireless Open RAN Test Suite, including the TM500 and TeraVM test platforms. The TM500 O-RU Tester enhances legacy conformance test tools with its Direct Performance Test capabilities, such as uplink and downlink data performance and capacity testing.

VIAVI also offers Test-as-a-Service (TaaS) supporting short-term and time-sensitive 5G and Open RAN projects. The TaaS offering provides a complementary alternative to handle peaks in lab demand for major NEMs and CSPs with customers’ in-house testing approach.

VIAVI Solutions has been directly involved in testing, assuring, and securing the largest communications networks around the globe for over 100 years, validating network products for all Tier-1 network equipment manufacturers.

Dr. Sameh Yamany, VIAVI’s Chief Technology Officer, expressed gratitude for the NTIA’s trust in awarding them the grant for VALOR, making Open RAN testing accessible, affordable, and sustainable for the entire ecosystem. He looks forward to partnering across the industry to realize the vision of Open Radio Commercialization and Innovation.

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The Indian semiconductor industry is projected to reach USD 55 billion by 2026. To address the global semiconductor shortage, the Indian government has established the India Semiconductor Mission (ISM), which includes four key schemes aimed at building a global hub for semiconductor manufacturing.

Prime Minister Narendra Modi has emphasized the country’s evolving role in technology, stating, “India is already a digital power, nuclear power, and space power; soon India will become an Electronic Power.” The vision of a “Made in India” and “Designed in India” semiconductor powerhouse underscores the nation’s ambition to lead in this critical sector.

To achieve this, India aims to overcome technological challenges, build a skilled workforce, create a resilient supply chain, and develop green energy solutions for sustainable manufacturing. At the heart of all advanced technologies—such as the Internet of Things (IoT), artificial intelligence (AI), nanotechnology, image processing, and augmented reality—lies electronics, making the semiconductor industry a crucial aspect of the global economy.

By investing in and prioritizing the semiconductor sector, India seeks to solidify its position as a key player in the global technology landscape.

Strong Ambitions Fostering Economic Growth

 

India is striking remarkable streaks in the semiconductor industry, reflecting strong ambitions fostering substantial economic growth. Here are the key developments:

1. Upcoming Semiconductor Manufacturing Units:

India plans to establish three new semiconductor manufacturing units with an investment of ₹1.26 lakh crore. This major investment underscores the country’s commitment to becoming a global leader in chip manufacturing.

2. Renesas and IIT Hyderabad Collaboration:

Renesas and IIT Hyderabad have signed a three-year Memorandum of Understanding (MoU) to collaborate on research in VLSI (Very-Large-Scale Integration) and embedded semiconductor systems. This partnership aims to drive innovation and enhance research capabilities in India.

3. Tata Group’s Semiconductor ATMP Facility:

The Tata Group announced in March this year the setup of a semiconductor ATMP (Assembly, Testing, Marking, and Packaging) facility worth ₹27,000 crore. This facility is crucial for strengthening the semiconductor supply chain and boosting India’s manufacturing capabilities.

4. Government Initiatives: Semicon India:

Launched in 2021, the Semicon India initiative aims to develop a robust and sustainable semiconductor and display ecosystem in the country. This initiative highlights the government’s strategic focus on advancing the semiconductor industry.

5. Design Linked Incentive (DLI) Scheme:

The DLI scheme offers financial incentives and design infrastructure support for the entire semiconductor lifecycle, including integrated circuits (ICs), chipsets, system-on-chips (SoCs), systems and IP cores, and semiconductor-linked design. This scheme is designed to foster innovation and attract investments in semiconductor design and manufacturing.

6. Job Creation:

The semiconductor industry is expected to create at least 1 million jobs over the next decade, significantly contributing to economic growth and employment in the country.

These initiatives and investments demonstrate India’s determination to become a global semiconductor manufacturing hub, leveraging public and private sector efforts to achieve this ambitious goal.

On the Way to Become a Sustainable & Self-Reliant Electronics SuperPower

India’s journey towards becoming a sustainable and self-reliant electronics superpower is driven by several key initiatives and strategic policies to boost its electronics manufacturing capabilities, foster innovation, and ensure environmental sustainability. Here are some of the significant steps and factors contributing to this transformation:

·  Government Initiatives and Policies

1. Make in India: Launched in 2014, this initiative encourages companies to manufacture their products in India to boost indigenous production and reduce dependency on imports.
2. Production Linked Incentive (PLI) Scheme: This scheme offers financial incentives to electronics manufacturers to boost domestic production and attract investments.
3. National Policy on Electronics (NPE) 2019: The policy aims to position India as a global hub for Electronics System Design and Manufacturing (ESDM) by promoting the growth of the semiconductor and display industry.
4. 4. Digital India: This campaign aims to ensure that government services are available to citizens electronically, promoting digital literacy and connectivity.

·  Strengthening the Supply Chain

1. Local Sourcing: Encouraging local sourcing of components to reduce reliance on imports.
2. Semiconductor Manufacturing: Plans to set up semiconductor fabrication plants (fabs) in India to establish a strong semiconductor ecosystem.
3. Electronics Manufacturing Clusters (EMCs): Establishing EMCs to provide state-of-the-art infrastructure and facilities to electronics manufacturers.

· Innovation and Research

1. Research and Development: Promoting R&D in the electronics sector to drive innovation and develop cutting-edge technologies.
2. Collaboration with Global Companies: Partnering with global technology companies to bring advanced manufacturing technologies and practices to India.

·         Environmental Sustainability

1. E-Waste Management: Implementing stringent e-waste management rules to ensure proper recycling and disposal of electronic waste.
2. Green Manufacturing Practices: Encouraging the adoption of eco-friendly manufacturing practices to minimize the environmental impact.
3. Renewable Energy: Promoting the use of renewable energy sources in electronics manufacturing processes to reduce the carbon footprint.

· Skill Development

1. Skilling Initiatives: Launching programs to train the workforce in advanced manufacturing technologies and electronics design.
2. Collaboration with Educational Institutions: Partnering with educational institutions to develop a skilled talent pool for the electronics industry.

· Global Competitiveness

1. Improving Ease of Doing Business: Simplifying regulations and providing incentives to attract foreign investments.
2. Export Promotion: Encouraging the export of Indian-made electronics to global markets.

The post India’s Semiconductor Dream: Building Manufacturing Prowess and Global Outreach appeared first on ELE Times.

Improved Shield Design Delivers Higher Voltage Ratings, Up to 20 dB of Radiated E-Field Reduction, and Polarity Marking for Additional EMI Control

Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its IHLE® series of low profile, high current inductors featuring integrated E-field shields with a new second-generation Automotive Grade device in the 10 mm by 10 mm 4040 case size. Offering an improved shield design over previous-generation solutions, and polarity marked for more consistent EMI performance, the Vishay Dale IHLE-4040DDEW-5A lowers costs and saves board space by potentially eliminating the need for separate board-level Faraday shielding.

Compared to traditional composite inductors, the device released today contains the electric and magnetic fields associated with EMI in a tin-plated copper integrated shield. When the shield is connected to ground, the IHLE-4040DDEW-5A provides up to 20 dB reduction in radiated noise interference, and a further 6 dB reduction in magnetic flux leakage to minimize crosstalk to nearby board components. The inductor features continuous high temperature operation to +155 °C and improved operating and isolation voltage ratings of 75 V and 100 V, respectively.

The IHLE-4040DDEW-5A power inductor is optimized for energy storage in switch mode power supplies and provides excellent noise attenuation when used as a DC power line choke. AEC-Q200 qualified, the device is designed for filtering and DC/DC conversion in entertainment / navigation systems; LED drivers; and noise suppression for motors, automotive domain control units (DCU), and other noise-sensitive applications.

Packaged in a 100 % lead (Pb)-free, magnetically shielded, iron alloy encapsulant, the IHLE-4040DDEW-5A offers high resistance to thermal shock, moisture, and mechanical shock from the additional mounting support provided by its two shield terminals. The inductor is RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table: 

	Low End	High End
Inductance @ 100 kHz (μH)	0.47	68
DCR typ. @ 25 °C (mΩ)	1.55	240
DCR max. @ 25 °C (mΩ)	1.66	252
Heat rating current typ. (A)(¹)	32	2.6
Saturation current typ. (A)(²)	28	3.5
Saturation current typ. (A)(³)	40.1	4.9
SRF typ. (MHz)	32.0	3.5
Case size	4040	4040
Part number	IHLE4040DDEWR47M5A	IHLE4040DDEW680M5A

 (¹) DC current (A) that will cause an approximate ΔT of 40 °C
(²) DC current (A) that will cause L0 to drop approximately 20 %
(³) DC current (A) that will cause L0 to drop approximately 30 %

Samples and production quantities of the IHLE-4040DDEW-5A are available now, with lead times of 16 weeks.

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Infineon Technologies AG today announced two new CoolGaN product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS provides exceptional soft- and hard-switching behavior, with bidirectional switches available at 40 V, 650 V and 850 V. Target Applications of this family include mobile device USB ports, battery management systems, inverters, and rectifiers. The CoolGaN Smart Sense products feature lossless current sensing, simplifying design and further reducing power losses, as well as transistor switch functions integrated into one package. They are ideal for usage in consumer USB-C chargers and adapters.

The CoolGaN BDS high voltage will be available at 650 V and 850 V and feature a true normally-off monolithic bi-directional switch with four modes of operation. Based on the gate injection transistor (GIT) technology, the devices have two separate gates with substrate terminal and independent isolated control. They utilize the same drift region to block voltages in both directions with outstanding performance under repetitive short-circuit conditions. Applications can benefit by using one BDS instead of four conventional transistors, resulting in higher efficiency, density, and reliability. Furthermore, significant cost savings are achieved. The devices optimize performance in the replacement of back-to-back switches in single-phase H4 PFC and HERIC inverters and three-phase Vienna rectifiers. Additional implementations include single-stage AC power conversion in AC/DC or DC/AC topologies.

The CoolGaN BDS 40 V is a normally-off, monolithic bi-directional switch based on Infineon’s in-house Schottky Gate GaN technology. It can block voltages in both directions, and through a single-gate and common-source design, it is optimized to replace back-to-back MOSFETs used as disconnect switches in battery-powered consumer products. The first 40 V CoolGaN BDS product has a 6 mΩ RDS(on), with a range of products to follow. Benefits of using 40 V GaN BDS vs. back-to-back Si FETs include 50 – 75 percent PCB area savings and a reduction of power losses by more than 50 percent, all at a lower cost.

The CoolGaN Smart Sense products feature 2 kV electrostatic discharge withstand and can connect to controller current sense for peak current control and overcurrent protection. The current sense response time is ~200 ns, which is equal or less than common controller blanking time for ultimate compatibility.

Implementing the devices results in increased efficiency and cost savings. At a higher RDSs(on) of e.g. 350 mΩ, the CoolGaN Smart Sense products offer similar efficiency and thermal performance at lower cost compared to traditional 150mΩ GaN transistors. Moreover, the devices are footprint compatible to Infineon’s transistor-only CoolGaN package, eliminating the need for layout rework and PCB respin, and further facilitating design with Infineon’s GaN devices.

Availability

Engineering samples of the CoolGaN BDS 40 V are available now for 6 mΩ and will follow in Q3 2024 for 4 mΩ and 9 mΩ. Samples of the CoolGaN BDS 650 V will be available in Q4 2024, and 850 V will follow early 2025. CoolGaN Smart Sense samples will be available in August 2024. Further information is available here: https://www.infineon.com/cms/en/product/promopages/GaN-innovations/

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The USB Implementers Forum (USB-IF) has approved the USB 3.2 Gen 1 & Gen 2 transmitter and receiver compliance test solution from Rohde & Schwarz, confirming that it meets the stringent requirements set by the standardization body. Manufacturers of USB devices preparing for official USB-IF certification can have full confidence in the accuracy and reliability of the test results produced by the test solution.

Rohde & Schwarz has received approval from the USB Implementers Forum for its USB 3.2 Gen 1 & Gen 2 transmitter (Tx) and receiver (Rx) compliance test solution. This approval underlines the company’s commitment to providing high-quality test and measurement solutions for the USB ecosystem.

The R&S RTP-K101 for Tx and R&S RTP-K102 for Rx enables manufacturers to test their USB devices for compliance with the USB 3.2 standard, using the R&S RTP oscilloscope from Rohde & Schwarz. The software option includes a range of test cases and scenarios that cover all aspects of electrical compliance testing of USB 3.2 Gen 1 & Gen 2 transmitters and receivers. They are implemented in the R&S ScopeSuite software, which controls all needed hardware to carry out these tests, including third-party bit error rate testers (BERT) required for receiver testing. R&S ScopeSuite features illustrated step-by-step instructions which guide users in terms of optimum setup and connection to test fixtures to obtain reliable test results in line with USB-IF test specifications.

The USB-IF is the industry body responsible for the promotion and development of the Universal Serial Bus (USB) standard. The organization oversees the development of USB technology standards and ensures that all USB-IF certified products meet the highest standards of interoperability and quality.

The R&S RTP-K101 for Tx and R&S RTP-K102 for Rx compliance test options for USB 3.2 Gen 1 & Gen 2 are available from Rohde & Schwarz and are part of the company’s extensive solutions portfolio for USB design and compliance testing. Rohde & Schwarz already has approval from the USB-IF for USB 2.0 transmitter and receiver testing as well as for USB cable and connector testing.

For more information on USB testing solutions from Rohde & Schwarz, go to: https://www.rohde-schwarz.com/_251317.html

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Strategic Partnership Aims to Generate Carbon Credits from EV Charging Network, Revolutionizing India’s Electric Mobility Landscape.

As the world celebrates World Environment Day, E-Fill Electric, a pioneering provider of technology-driven electric vehicle (“EV”) solutions, and DevvStream Holdings Inc. (NEO: DESG) (OTCQB: DSTRF) (FSE: CQ0), a leading carbon credit project co-development and generation firm specializing in technology-based solutions,  announced a definitive agreement (the “E-Fill Agreement”) to leverage E-Fill Electric’s network of EV charging stations in India for carbon credit generation. This agreement is anticipated to establish a new revenue stream for E-Fill Electric, enabling the expansion of the company’s R&D and manufacturing capabilities.

E-Fill Electric will serve as a launch partner forDevvStream’s Electric Vehicle Charging Carbon Offset Program (“EVCCOP”) in India, which aims to accelerate electric mobility by generating revenue for EV charging network owners and operators. The program achieves this by producing and selling voluntary carbon credits, which are generated when EV owners charge their vehicles. The program is tailor-made for Charge Point Operators and Mobility Service Providers that own/operate Level 1, Level 2, or DC Fast Charging stations, public or private, for passenger vehicles or heavy-duty vehicles like e-buses and e-trucks. The average Level 2 EV charger generates approximately 40 credits per year with medium use, while a Level 3 EV charger generates approximately 500 credits annually, according to Company estimates.

Mayank Jain, CEO of E-Fill Electric, emphasized the strategic significance of this collaboration, stating, “DevvStream’s unparalleled expertise in carbon markets aligns seamlessly with our vision to foster the widespread adoption of EVs in India. Through the EVCCOP, we are poised to create a lucrative revenue stream while significantly reducing greenhouse gas emissions.”

“With India prioritizing the adoption and growth of domestic manufacturing of EVs, there is a significant need for expanded EV charging infrastructure to support this shift, and carbon markets present a massive untapped source of funding for technology providers like E-Fill Electric,” said Sunny Trinh, CEO of DevvStream. “DevvStream’s EVCCOP will allow E-FillElectric to create a lucrative new revenue stream from its existing EV charging network through the generation of high value carbon credits which can finance further network expansion. As progress continues toward DevvStream’s business combination with Focus Impact Acquisition Corp., we look forward to sharing additional updates related to the on boarding of additional partners into this and other DevvStream programs.”

DevvStream’s EVCCOP incentivizes EV charging through the production and sale of voluntary carbon credits. This innovative program caters to ChargePoint Operators and Mobility Service Providers, offering a compelling financial incentive to bolster EV infrastructure. With India witnessing a surge in EV adoption, the EVCCOP is poised to catalyze the nation’s transition to electric mobility.

The EVCCOP comes at a critical juncture for India, where EV sales are on the rise, fueled by government incentives and a growing emphasis on environmental sustainability. As India charts a course towards becoming a manufacturing hub for EVs, robust charging infrastructure is imperative to support this transition.

“E-Fill Electric is dedicated to empowering our partners in expanding EV charging infrastructure across India,” added Jain. “The revenues generated through the DevvStream program will provide a vital financial boost, enabling us to realize our vision of a cleaner, greener India.”

With over 12,000 public charging installations already in place, India’s EV charging landscape is primed for exponential growth. As the world commemorates World Environment Day, the collaboration between E-Fill Electric and DevvStream serves as a beacon of hope, showcasing the power of innovation to drive positive change for our planet and future generations.

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u-locate offers every necessary hardware, software and middleware component for indoor positioning, including support for interoperability with the omlox standard.

u-blox, a global provider of leading positioning and wireless communication technologies and services, has announced u-locate, a complete indoor positioning solution, offering the optimal combination of accuracy, cost and power consumption. Based on Bluetooth LE AoA (Angle-of-Arrival), u-locate delivers positioning accuracy levels down to 10 centimeters while ensuring extended tag battery lifetimes at an affordable price point.

The flexible and modular u-locate solution targets RTLS (real-time location system) solution providers and systems integrators, with end-user indoor tracking applications in warehousing, manufacturing, healthcare and many more. The easy-to-configure mobile application includes an extensive management support tool and anchors with self-aware orientation, removing the pain of complex solution installations and ensuring reduced times to market.

u-locate’s advanced AoA positioning algorithms deliver market-leading accuracy while reducing the cost of tracking assets, enabling a wider range of use cases. The combination of Bluetooth 5.1 technology with the optimized antenna configuration of u-locate delivers exceptional levels of positioning accuracy, without compromising power consumption. The u-locate solution scales easily as the end-user installation grows, and futureproofing is underpinned with OTA (over-the-air) software updates ensuring continuous access to new features and updates.

The flexible solution can be tailored according to the needs of the application, and consists of a positioning middleware (u-locateHub), a positioning engine (u-locateEngine), anchor points (u-locateAnchor) and tags (u-locateTag). It can be complemented with GNSS (Global Navigation Satellite System) products from u-blox, to guarantee seamless indoor and outdoor localization.

u-locateHub complies with the omlox global interoperability standard and its well-documented API platform contains various APIs, supporting integration with multiple vendor solutions. By joining omlox, u-blox recognizes the importance of contributing to a growing ecosystem, and promoting global interoperability of positioning solutions.

“We are delighted that u-blox is entering the omlox ecosystem, by adopting the standard into u-locate, its new RTLS solution for indoor positioning systems,” says Dr. Matthias Joest, Committee leader for omlox.  “omlox is the world’s first locating standard. It specifies flexible locating solutions that allow customers to benefit from lower integration costs, while ensuring future-proof setups. Having u-blox – recognized leader in locating technologies – as member and supporter of omlox, is a huge benefit for our fast-growing ecosystem.”

With u-locate, u-blox is leveraging its deep expertise in wireless connectivity and positioning technologies to address the growing need for high-performance positioning systems which reduce operational costs and maximize sustainability by optimizing inventory management along with material and people flows.

u-blox provides semiconductor chips, modules, and IoT services that reliably locate and connect everything. Our cutting-edge solutions drive innovation for the car of the future and the Internet of Things. Headquartered in Thalwil (Zurich), Switzerland, we have a global presence of 1,400 experts who enable our customers to build solutions for a precise, smart, and sustainable future.  

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The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts. With the introduction of the Thin-TOLL 8×8 and TOLT packages, Infineon Technologies AG is actively accelerating and supporting these trends. They enable a maximum utilization of the PCB mainboard and daughter cards, while also taking the system’s thermal requirements and space restrictions into account. The company is now expanding its portfolio of CoolSiC MOSFET discretes 650 V with two new product families housed in the Thin-TOLL 8×8 and TOLT packages. They are based on the CoolSiC Generation 2 (G2) technology, offering significantly improved figures-of-merit, reliability, and ease-of-use. Both product families specifically target high and medium switching-mode power supplies (SMPS), including AI servers, renewable energy, EV chargers, and large home appliances.

The Thin-TOLL package has a form factor of 8×8 mm and offers the best-in-class Thermal Cycling on Board (TCoB) capability on the market. The TOLT package is a top-side cooled (TSC) enclosure with a similar form factor to TOLL. Both package types offer developers several benefits: Using them in AI and server power supply units (PSU), for example, reduces the thickness and length of the daughter cards and allows for a flat heat sink. When used in microinverters, 5G PSU, TV PSU and SMPS, the Thin-TOLL 8×8 package allows for a minimization of the PCB area occupied by the power supply devices on the mainboard, while TOLT keeps the junction temperature of the devices under control, given that these applications typically use convection cooling. In addition, TOLT devices complete Infineon’s top-side cooled CoolSiC industrial portfolio, namely CoolSiC 750 V in Q-DPAK. They enable developers to reduce the PCB footprint occupied by SiC MOSFETs when the power to be delivered to the devices does not require a Q-DPAK package.

Availability

The CoolSiC MOSFETs 650 V G2 in ThinTOLL 8×8 and TOLT are now available in RDS(on) from 20, 40, 50 and 60 mΩ. Additionally, the TOLT variant is also available with an RDS(on) of 15 mΩ. The product family will be expanded by a more granular portfolio by the end of 2024. More information is available at www.infineon.com/coolsic-gen2. Infineon will showcase the CoolSiC MOSFET 650 V Generation 2 at the PCIM in Nuremberg.

Infineon at the PCIM Europe 2024

PCIM Europe will take place in Nuremberg, Germany, from 11 to 13 June 2024. Infineon will present its products and solutions for decarbonization and digitalization in hall 7, booths #470 and #169. Company representatives will also be giving several presentations at the accompanying PCIM Conference and Forums, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about Infineon’s PCIM 2024 show highlights is available at www.infineon.com/pcim.

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Test Research, Inc., the leading test and inspection systems provider for the electronics manufacturing industry, today announced a collaboration with NVIDIA and leading Taiwanese electronics manufacturers to accelerate the deployment of AI-driven technologies for smart factories.

The collaboration will integrate the cutting-edge NVIDIA Metropolis for Factories workflow into Test Research, Inc. (TRI)’s portfolio to leverage advanced AI capabilities to optimize manufacturing processes through enhanced automation and defect detection. By combining TRI’s domain expertise in test and inspection with NVIDIA’s AI software stack and computing capabilities, TRI aims to empower manufacturers with intelligent solutions that drive operational efficiencies and unlock new levels of productivity for the electronics manufacturing industry. And looking forward TRI plans to leverage NVIDIA NIM to further increase performance and throughput.

“We are thrilled to collaborate with NVIDIA to deliver innovative, future-proof solutions to our customers in the electronics manufacturing industry,” said Jim Lin, Vice President of Test Research Inc. “With NVIDIA Metropolis for Factories, TRI is poised to help drive the adoption of AI in smart factories, empowering manufacturers to embrace the technologies of tomorrow and stay ahead of the curve.”

NVIDIA Metropolis for Factories is a workflow that simplifies the development, deployment, and scaling of AI-enabled visual inspection applications from edge to cloud. It supports data labeling, computer-vision model training, and model integration, and enables industrial technology companies and manufacturers to develop, deploy, and manage customized quality-control systems. It allows TRI to develop incredibly accurate inspection applications, such as for automated optical inspection (AOI). Metropolis for Factories is helping manufacturers increase production line throughput, reduce costs, and improve production quality.

TRI AI Defect Detection

Thanks to TRI’s AI verification advancements, the detection rate of components has improved significantly, the AI detection accuracy for general chip defects now exceeds 99%. Specific improvements include a detection rate of over 95% for components such as OSC, MLD, SOD, SOT23, RNET, and CNET. X-ray void detection with AI implementation improves the first pass yield rate (FPY) from 85% to 98%. For complex components like the Paladin connector, AI classification reduces the false case rate from approximately 25,000 ppm to around 3,000 ppm, an 88% improvement. Detection improvements are also present in the OCR (optical character recognition) algorithms, and traditional methods achieve 89% accuracy, while AI deep learning OCR reaches a 99.58% detection rate.

TRI AI Smart Programming

TRI AI Smart Programming facilitates predictive decision-making similar to that of an expert or experienced operator, reducing programming time, downtime, and operator training. Traditional programming of 718 components would take around 60 minutes; AI programming reduces this to just 9 minutes, an 85% improvement.

TRI AI Verify Host

The AI Verify Host is a smart repair station that reduces the need for manual re-inspection and lowers operational costs, powered by the Metropolis for Factories workflow. Typically, repair station operators have lower performance and training is not cost-effective. The AI-powered repair station can continuously operate efficiently, outperforming operators while lowering false calls and providing real-time data analytics of the inspection status.

TRI AI Station

Inspection programming is often limited to the operator’s knowledge. TRI AI Station addresses this by performing AI-powered inspections with existing AI models, optimizing the process, increasing efficiency, and lowering operational costs for the experienced workforce. The AI Station supports multiple AOIs and smart scheduling, reducing AI hardware costs and improving resource management.

TRI AI Training Tool

TRI AI Training Tool is a user-friendly interface that generates AI models from existing inspection data. The tool includes a built-in AI labeling tool and supports classification, segmentation, OCR, detection tools, continued training, heat maps, and more.

TRI will harness NVIDIA Triton Inference Server software and the NVIDIA TensorRT software development kit to further speed up AI inferencing of cutting-edge AI-powered solutions for test and inspection, and smart factories for the electronics manufacturing industry. These AI-driven capabilities will enable manufacturers to readily adopt and benefit from innovative AI-powered solutions.

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Accessory device to Microchip’s TimeProvider 4100 grandmaster scales up to 200 fully redundant T1, E1 or CC synchronization outputs

Critical infrastructure communication networks require highly accurate and resilient synchronization and timing, but over time these systems age out and must be migrated to a more modern architecture. Microchip Technology announces the new TimeProvider XT Extension System, a fan-out shelf used with redundant TimeProvider 4100 grandmasters to migrate legacy BITS/SSU equipment to a modular and resilient architecture. The TimeProvider XT provides operators with a clear path to replace existing SONET/SDH frequency synchronization equipment while adding timing and phase, which is essential for 5G networks.

As an accessory device to Microchip’s widely deployed TimeProvider 4100 grandmaster, each TimeProvider XT shelf is configured with two distribution modules and two plug-in modules to provide 40 fully redundant and individually programmable outputs with synchronization designed to meet ITU-T G.823 for wander and jitter control. Operators can connect up to five XT shelves to scale up to 200 fully redundant T1/E1/CC communication outputs. All configuration, status monitoring and alarm reporting are done via the TimeProvider 4100 grandmaster. This new solution allows operators to consolidate their critical frequency, timing and phase requirements onto a single modern platform, saving maintenance and service costs.

“With the new TimeProvider XT Extension, network operators can take advantage of state-of-the-art technology that is reliable, scalable and flexible to either overlay or replace their SONET/SDH synchronization systems,” said Randy Brudzinski, vice president of Microchip’s frequency and time systems business unit. “The XT solution is an attractive investment for network operators because it is more than just a replacement for legacy BITS/SSU equipment; it also adds PRTC functionality, delivering frequency, time and phase for next-generation networks.”

This solution is compatible with DCD, SSU 2000, TSG-3800 and TimeHub systems’ wire-wrap and output panels, so that network elements do not have to be rewired. This can save network operators significant deployment time and resources while reducing costs. The TimeProvider XT has a Composite Clock (CC) input which allows for live in-service CC phase cutovers, which are typically performed during maintenance windows to ensure that the synchronization in a network is maintained. The TimeProvider XT system requires the TimeProvider 4100 grandmaster to be running the latest version 2.4 firmware.

The TimeProvider XT Extension system is the newest product to join Microchip’s extensive portfolio of clock and timing systems, which ranges from small plug-in timing server cards to multi-rack national and time scale systems.  As a primary contributor to the world’s time, Microchip’s timing solutions are trusted, reliable and resilient. For more information, visit Microchip’s Timing and Synchronization website.

Development Tools

The TimeProvider XT Extension is supported by TimePictra Management Software, a web-based tool to manage and monitor synchronization architectures.

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• New high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy
• Projected 5 billion euros multi-year investment program including 2 billion euros support provided by the State of Italy in the framework of the EU Chips Act
• Catania Silicon Carbide Campus realizes ST’s plan for fully vertically integrated SiC capabilities from R&D to manufacturing, from substrate to module, on one site, enabling automotive and industrial customers in their shift to electrification and higher energy efficiency.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announces a new high-volume 200mm silicon carbide (“SiC”) manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy. Combined with the SiC substrate manufacturing facility being readied on the same site, these facilities will form ST’s Silicon Carbide Campus, realizing the Company’s vision of a fully vertically integrated manufacturing facility for the mass production of SiC on one site. The creation of the new Silicon Carbide Campus is a key milestone to support customers for SiC devices across automotive, industrial and cloud infrastructure applications, as they transition to electrification and seek higher efficiency.

“The fully integrated capabilities unlocked by the Silicon Carbide Campus in Catania will contribute significantly to ST’s SiC technology leadership for automotive and industrial customers through the next decades,” said Jean-Marc Chery, President and Chief Executive Officer of STMicroelectronics. “The scale and synergies offered by this project will enable us to better innovate with high-volume manufacturing capacity, to the benefit of our European and global customers as they transition to electrification and seek more energy efficient solutions to meet their decarbonization goals.”

The Silicon Carbide Campus will serve as the center of ST’s global SiC ecosystem, integrating all steps in the production flow, including SiC substrate development, epitaxial growth processes, 200mm front-end wafer fabrication and module back-end assembly, as well as process R&D, product design, advanced R&D labs for dies, power systems and modules, and full packaging capabilities. This will achieve a first of a kind in Europe for the mass production of 200mm SiC wafers with each step of the process – substrate, epitaxy & front-end, and back-end – using 200 mm technologies for enhanced yields and performances.

The new facility is targeted to start production in 2026 and to ramp to full capacity by 2033, with up to 15,000 wafers per week at full build-out. The total investment is expected to be around five billion euros, with a support of around two billion euros provided by the State of Italy within the framework of the EU Chips Act. Sustainable practices are integral to the design, development, and operation of the Silicon Carbide Campus to ensure the responsible consumption of resources including water and power.

Additional information
Silicon Carbide (“SiC”) is a key compound material (and technology) consisting of silicon and carbon that offers several advantages over conventional silicon for power applications. The wide bandgap of SiC and its intrinsic characteristics – better thermal conductivity, higher switching speed, low dissipation – make it particularly suitable for the manufacturing of high-voltage power devices (notably above 1,200V). SiC power devices, in the form of SiC MOSFET sold as bare die and full SiC modules, are especially useful in electric vehicles, fast-charging infrastructure, renewable energies and various industrial applications including datacenters, as they offer higher electric currents and lower leakage than traditional silicon semiconductors, increasing energy efficiency. SiC chips are however more difficult and more costly to manufacture than silicon chips with many challenges to overcome in the industrialization of the manufacturing process.

ST’s leadership in SiC is the result of 25 years of focus and commitment in R&D with a large portfolio of key patents. Catania has long been an important site for innovation for ST as the home of the largest SiC R&D and manufacturing operations, successfully contributing to the development of new solutions for producing more and better SiC devices. With an established ecosystem on power electronics, including a long-term, successful collaboration between ST and the University of Catania and the CNR (Italian National Research Council), as well as a large network of suppliers, this investment will strengthen Catania’s role as a global competence center for SiC technology and for further growth opportunities.

ST currently manufactures its flagship high-volume SiC products on two 150-millimeter wafer lines in Catania (Italy) and Ang Mo Kio (Singapore). A third hub is a joint venture with Sanan Optoelectronics, with a 200-millimeter facility under construction in Chongqing (China), dedicated to ST to serve the Chinese market. ST’s wafer production facilities are supported by automotive-qualified, high-volume assembly and test operations in Bouskoura (Morocco) and Shenzhen (China). SiC substrate R&D and industrialization is undertaken in Norrköping (Sweden) and Catania, where ST’s SiC substrates manufacturing facility is ramping up production and most of ST’s SiC product R&D and design staff are based.

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The world faces serious environmental concerns that require immediate attention and progressive solutions. The human civilization is at a crossroads where every decision will either make or break us. Taking corrective measures by making eco-friendly choices and adopting sustainable ways and technologies to operate is crucial.

Environmental conservation and protection are vital aspects of the world today, and the global scientific community is working on solutions to address the escalating climate crisis. There is a growing focus on sustainable transportation, with increased investments in electric mobility.

The electric vehicle (EV) segment in the automotive industry is on the rise in India, accounting for approximately 5% of total vehicle sales. Startups are playing a crucial role in developing and enhancing EV infrastructure, and it is projected that by 2030, EVs could make up more than 40% of India’s automotive market. India’s journey with EVs has just begun, and the country’s ambitious decarbonization target by 2030 necessitates more rigorous action towards building sustainable value chains across its industrial ecosystem.

As the world prepares to celebrate World Environment Day on June 5, 2024, leveraging technology and science to address the climate crisis and related issues should remain our top priority.

Industry Speaks:

ELE Times spoke with technology leaders on the impact of EVs on climate change and the importance of World Environment Day from an EV industry perspective.

Manjula Girish, Business Head EV Charging and Photovoltaic Inverter Division, Delta Electronics India says-

“EVs are a transformative force in the fight against climate change. By significantly reducing greenhouse gas emissions compared to traditional combustion engines, EVs play a critical role in mitigating global warming. At Delta Electronics India, we are committed to advancing EV technology and infrastructure, contributing to a cleaner, more sustainable future. Our innovations in EV charging solutions are designed to support widespread adoption of electric mobility, further reducing our carbon footprint and fostering a healthier planet.

World Environment Day serves as a critical platform for the EV industry to showcase its commitment to a sustainable future. As the mission of EV industry synchronizes with the mission of World Environment day attributing to sustainability, emission reduction and the climate change It’s a day to celebrate the progress we’ve made in electrifying transportation and highlight the positive impact EVs can have on our planet. At Delta Electronics India, we see World Environment Day as an opportunity to raise awareness, inspire action, and accelerate the transition towards cleaner Transportation solutions.”

Akash Gupta, Co-Founder & CEO of Zypp Electric, says-

“EVs have a transformative impact on climate change, and Zypp Electric is leading this charge in India. As the country’s premier tech-enabled EV-as-a-Service platform, we are committed to achieving zero emissions and creating a carbon-free India. Our ecosystem of IoT and AI-enabled electric scooters, combined with strategically placed battery swapping stations, ensures efficient, low-maintenance, and high-performance last-mile delivery. This sustainable model not only lowers delivery costs but also significantly reduces urban pollution. With over 20,000 EVs and delivery pilots, we deliver packages in a manner that is both eco-friendly and cost-effective. By replacing traditional fuel-based vehicles, we are cutting down on greenhouse gas emissions and making cities cleaner and healthier. Through our innovative solutions, Zypp Electric is playing a crucial role in mitigating climate change and driving a greener future.

At Zypp Electric, World Environment Day isn’t just a celebration – it’s a call to action for the EV industry.  Transportation is a major source of pollution, and EVs are the key to a cleaner future. This day highlights the urgency of tackling climate change.  For the EV industry, it’s a chance to showcase the transformative power of electric mobility. We can raise awareness about the environmental benefits of EVs – reduced emissions, cleaner air, and quieter cities.

World Environment Day also unites stakeholders – policymakers, businesses, and citizens.  It’s an opportunity to collaborate on building a robust EV ecosystem – from charging infrastructure to battery recycling. We are proud to be at the forefront of this revolution.  Our sustainable last-mile delivery solutions demonstrate the positive impact EVs can have.  On World Environment Day, let’s reiterate our commitment to a greener future, one electric mile at a time.”

Hyder Khan CEO of Godawari Electric Motors, says-

“The transition to EVs plays a pivotal role in mitigating climate change. EVs produce zero tailpipe emissions, drastically reducing air pollutants compared to traditional internal combustion engine vehicles. This shift is crucial in decreasing the levels of greenhouse gases, primarily carbon dioxide, which are major contributors to global warming. Additionally, EVs align with renewable energy sources, further amplifying their positive environmental impact. When powered by electricity from renewable sources like wind, solar, and hydro, EVs can achieve near-zero emissions throughout their lifecycle. This integration supports global efforts to transition towards a more sustainable energy ecosystem.

At Godawari Electric Motors, we are committed to driving this transformation by producing efficient and affordable electric 2-wheelers and 3-wheelers. Our goal is to provide eco-friendly transportation options that contribute to cleaner air and a healthier planet, while also addressing the mobility needs of a growing population. Together, we can pave the way for a greener, more sustainable future. World Environment Day holds significant importance for the electric vehicle (EV) industry. It serves as a global platform to highlight the urgent need for sustainable practices and environmental stewardship, aligning perfectly with the core values and mission of the EV industry. This day emphasizes the critical role that EVs play in reducing greenhouse gas emissions, combating air pollution, and mitigating climate change. For companies like us (Godawari Electric Motors), World Environment Day is an opportunity to showcase our commitment to creating a greener future through innovative electric mobility solutions. It allows us to engage with consumers, policymakers, and stakeholders to raise awareness about the environmental benefits of EVs, such as reduced carbon footprints and decreased reliance on fossil fuels. Moreover, this day provides a platform to discuss advancements in EV technology, share success stories, and promote the adoption of electric Vehicles. By highlighting our efforts and the positive impact of EVs on the environment, we can inspire collective action towards a more sustainable and eco-friendly transportation landscape.”

Dinesh Arjun, Cofounder and CEO, Raptee, says

“Electric vehicles (EVs) significantly reduce greenhouse gas emissions compared to conventional vehicles, directly addressing climate change. India’s long-term low-carbon development strategy underscores the need for an integrated, efficient, and inclusive transport system to achieve net zero by 2070. Given that transportation is the fastest-growing major contributor to global climate change, accounting for 23% of energy-related carbon dioxide emissions, World Environment Day is vital for the EV industry as it offers a promising solution. By replacing internal combustion engines with electric motors, EVs help decrease reliance on fossil fuels and minimize harmful emissions.  It also highlights the urgent need for sustainable practices and raises awareness about the environmental benefits of electric vehicles. This day emphasizes the role of EVs in reducing greenhouse gas emissions and combating climate change, fostering collaboration, innovation, and public engagement to drive the transition towards a sustainable future”.

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Embedded system designs all have one thing in common: a microprocessor and controller. These can be as sparse as 4-bit wide controllers with less than 1K of code space or as big as a multicore multi-GHz processing supercomputer with Gis of code space. But, modern IoT-based embedded system designs also have another typical requirement. Many designs will be mixed signals, so almost every design will include wireless communications.

Herein lies a challenge. Will a designer choose an overkill all-in open processor with much more performance, peripherals, memory, and processing power than is needed just to have a single integrated processor or dedicated functional processors to handle dedicated and specific tasks?

Both approaches may have merit depending on a variety of design constraints. Is time to market the driving force? Is cost the critical constraint? What about size or power efficiency? There are many factors and microcontrollers/microprocessors to choose from, especially as embedded systems invade our living space and become more prevalent. Nearly every place is now an intelligent environment.

Wireless Protocols

Every wireless device uses some sort of protocol to establish and maintain communications. While higher-cost, higher-end cellular protocols can be used for home and building communications, this carries the cost of a recurring monthly cellular fee. Modern 4G and 5G systems fall into this category, utilizing a range of wireless protocols for enhanced connectivity.

Wi-Fi® is popular for media-based streaming and high-speed connectivity within a facility. Many Wi-Fi ICs and modules are readily available for designers in their embedded design. Still, many designs don’t require the multi-Gbit/sec data rates or have higher power budgets to justify the more sophisticated and costly Wi-Fi medium.

Zigbee, Bluetooth®, and LTE are the more power-friendly wireless protocols for room or building use. These require much less firmware, memory, and current, making them suitable for remote controls, lighting systems, media systems, temperature sensors, smoke/fire detectors, heating/cooling systems, and more.

What makes these protocols even more desirable is the topological flexibility they offer. In addition to point-to-point, these protocols can offer star, mesh, peer-to-peer, and client-server architectures. Star networks require each node to be in closer proximity to the star center, which is usually an aggregator. Peer-to-peer and mesh networks can “pass the baton” from node to node and cover longer distances since packets propagate along a routing path. This can also help preserve battery life since not a lot of transmission power is needed. Eventually, packets that are necessary for connecting to the World Wide Web will need to be routed to an access point. In all cases, security should be used.

Security

Sometimes, a security breach can be just an annoyance, like if someone hacks into your smart TV and changes channels. Other cases can be more serious, though, such as someone hacking into a home medical system. Handling these threats can be tackled in a few ways, but the most common strategy is encryption.

Many encryption algorithms and standards exist—some simple and some very complex. Wireless protocols like Zigbee and BLE have various methods of providing encryption protection. ZigBee uses 128-bit AES keys and is effective at applications layers as well as MAC layers. Bluetooth Low Energy (BLE) allows four layers of security:

• Level 1: No Security
  • Used for scenarios where data confidentiality is not a concern.
• Level 2: Unauthenticated Pairing with Encryption
  • Basic level of security, encrypting data transmission without verifying the identity of the connecting device.
• Level 3: Authenticated Pairing with Encryption
  • Enhances security with a method of authentication, such as a PIN, before establishing an encrypted connection.
• Level 4: Authenticated LE Secure Connections
  • The highest level of security in BLE, which uses an advanced encryption algorithm for authenticated pairing and secure connections.

Hardware-accelerated security functions can offload security functions from firmware and make processors much more desirable. Hardware encryption, decryption, hash code generation, pseudo-random sequence generators, and other blocks operate at lightning speed in hardware but take longer to implement in software. This adds latency time and requires the programmer to generate and debug more code.

In addition to runtime data protection, another layer of security needs to be in place, which is called a secure boot. With secure boot, boot loader firmware is protected and locked, preventing anyone from rewriting this critical code and redirecting its functionality. Normally, unprotected firmware feeds a processor when it boots. If it is replaced in flash somehow, the system is compromised. Secure boot takes advantage of strongly encrypted initial boot instructions, which then use digital signatures to authenticate the next layer of startup code.

A Dream Come True

Realizing the tightrope that designers have to walk when choosing an ideal microcontroller/microprocessor, many device makers are providing microcontrollers/microprocessors targeting this massive market for IoT, building automation, automotive, and industrial control. These applications need more than a simple processor but don’t need a super processor. While development time needs to be quick, cost and size are generally high on the list of constraints.

One of the best ways to get the processors and peripherals you need is to use a system-on-chip (SoC) solution. These modular units can be made by an OEM for small quantity runs or used to prototype your own higher volume custom version.

The key is the 64MHz PIC32CX-BZ3 family of processors based on the 32-bit Cortex MF4 Arm. This processor brings a multitude of peripherals and its secure boot ROM checks integrity and authenticity before executing to ensure system root trust. There are also eight protected memory zones and a final fuse that makes it impenetrable.

The WBZ351 (Figure 1) drives the WBZ35x modules, which feature a fully compliant Bluetooth Low Energy 5.2 transceiver. The transceiver is also Zigbee 3.0 certified with software stacks built around the robust MPLAB Harmony v3 framework.

Figure 1: The peripheral-packed WBZ351 requires few external devices to implement the entire IoT or wireless design. (Source: Microchip Technology)

Also important are the hardware-based security accelerator and public critical hardware (Figure 2). The AES security encryption and HASH code generator are also included to create a secure execution environment. Anti-rollback and firmware readable life cycle encounters offer even more levels of protection.

Figure 2: The WBZ351 module contains all the processing horsepower and peripherals needed to support smart homes and buildings, industrial control and monitoring, and wireless IoT applications. (Source: Microchip Technology) Conclusion

When it comes to the IoT and smart environments, designers have a big job. They must integrate wireless connectivity with strict security measures. That’s where Bluetooth Low Energy and Zigbee come in. These solutions can cover large areas with mesh networks while consuming less power. By incorporating secure boot and capacitive touch functionalities, designers can accelerate concept-to-market and allow designers to meet the demands for security and user interaction in today’s IoT devices.

The PIC32CX-BZ3 family of processors packs everything needed into one place, including advanced connectivity options and hardware-based security features. By leveraging powerful solutions, designers can navigate complex modern IoT ecosystems to ensure smart environments are intelligent, secure, and user-friendly.

Jon Gabay

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The government is willing to cover up to 50% of the anticipated cost to establish a computing capacity of around 10,000 graphic processing units (GPUs) as part of the National Artificial Intelligence (AI) mission. S. Krishnan, Secretary of the Ministry of Electronics and Information Technology, announced this at the CII Annual Business Summit 2024.

The plan is to collaborate with private institutions to expedite the process and make the capacity available in India. While the private sector will be responsible for creating the computing capacity, it will be accessible at a subsidized rate for specific use cases, research institutions, startups, and small to medium-sized industries. The government may fund the project through viability gap funding or a voucher-based system.

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India is expected to see a significant increase in private equity and venture capital investment over the next five years. According to a report by Bain & Company, the country is projected to reach $80-100 billion in annual deployment by 2024, up from $39 billion in 2023. Despite cautious capital deployment globally, India is anticipated to benefit from substantial capital allocation. Sectors such as healthcare, advanced manufacturing, electronics, and electric vehicles are expected to see significant deal-making potential in the near term. This positive outlook is based on the correlation between India’s GDP levels and the penetration of private equity, comparable to more mature markets like the US.

The post India on the Path to Obtain $80-100 Billion PE-VC Deployment in 5 Years: Reports appeared first on ELE Times.

The government is planning to establish a dedicated research and development (R&D) wing under the proposed India Semiconductor Research Centre (ISRC). This R&D wing will focus on semiconductor research that can quickly transition into industrial production, according to sources.

A senior government official mentioned the need for full-time R&D personnel in both the private and public sectors, especially in the semiconductor space. The objective is to create an intellectual property right (IPR) driven manufacturing ecosystem, and there is consideration of co-funding or a public-private partnership (PPP) for some of the R&D activities.

It’s important to note that the dedicated R&D wing will operate independently from other research work under the ISRC, which typically has a longer project gestation period. The ISRC will concentrate on R&D efforts to develop the next generation of semiconductors, packaging and systems technologies, processes, and materials.

Further details about the scheme are expected to be announced after the general elections in June. Depending on the feasibility of the scheme, the dedicated R&D centre may eventually become an independent entity, according to another official.

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