ELE Times

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it has developed four technologies for system-on-chip (SoC) devices for in-vehicle communication gateways. These SoCs are expected to play a crucial role in defining the next-generation electrical/electronic (E/E) architecture in automotive systems.

SoCs for automotive gateways must provide both high performance to implement new applications such as cloud services, and low power consumption when they are not in use. They also need to deliver fast CAN response to support instant start-up. Additionally, these SoCs need to provide power-efficient communication technology that enables network functions as a gateway using limited power and security technology to enable safe communication outside the vehicle. To meet these requirements, Renesas has developed (1) an architecture that dynamically changes the circuit operation timing to match the vehicle conditions with optimized performance and power consumption, (2) fast start-up technology by partitioning and powering essential programs only, (3) a network accelerator that achieves a power efficiency of 10 gigabits per second/watt (Gbps/W), and (4) security technology that prevents communication interference by recognizing and protecting vital in-vehicle communication related to vehicle control.

1. Architecture that optimizes processing performance and power consumption depending on vehicle conditions

Communication gateway SoCs need to deliver processing performance exceeding 30,000 Dhrystone million instructions per second (DMIPS) when running, while also keeping standby power consumption to 2 mW or less in order to maintain battery life. Typically, high-performance SoCs also have high power consumption in standby mode, while low-power SoCs with small standby power consumption have performance issues. To resolve this tradeoff, Renesas combined in a single chip a high-performance application system and a control system optimized for ultralow standby power consumption. The new architecture controls the power supplies of these two subsystems and changes the timing of circuit operation to achieve an optimal balance between performance and power efficiency. This results in higher performance during operation and lower power consumption during standby.

2. Fast start-up technology with external flash memory achieving the same fast speed as embedded flash memory

Since communication gateway SoCs manage processing of critical functions related to vehicle control, they must be able to respond to CAN within 50 milliseconds (msec.) of start-up. However, if the SoC uses a process that does not support embedded flash memory, the start-up program must be encrypted and stored in external flash memory. This means that it takes additional time to load program data and decrypt it. To solve this issue, Renesas developed technology that splits the program into sections and initially loads and decrypts only an essential portion for start-up, while continuing to load the rest of the program in parallel. This enables a fast response to CAN (50ms or less), even when using external flash memory.

3. Highly efficient network accelerator with 10 Gbps/W communication efficiency

To allow air cooling and heat dissipation for electronic control units (ECUs), communication gateway SoCs must keep power consumption to 7 watts or less. Since computing processing performance of 30,000 DMIPS or higher requires approximately 6 watts of power, only around 1 watt can be used for network processing. This presents a challenge as the total communication of 10 Gbps must be achieved using 1 watt of power, with a processing efficiency of only around  3 Gbps/W when processed by the CPU. To work around this issue, Renesas offloaded processing from the CPU to a custom network accelerator, achieving higher efficiency at 9.4 Gbps/W. Additionally, Renesas boosted efficiency to 11.5 Gbps/W by switching the routing method from a conventional TCAM approach to a hash table in SRAM. 

4. Security technology to prevent interference with communication requiring high reliability

A communication gateway SoC performs a mixed set of tasks such as data processing related to vehicle control that requires a high level of reliability, and large amounts of random data communication with cloud services and others. Since vehicle control is essential to ensuring safety, protecting and separating mission-critical data is important. However, despite the differences in data types, all data is transmitted through the same in-vehicle network, leading to physical intersections and raising security issues. To address this challenge, Renesas developed security technology that analyzes incoming packets to the SoC. It determines whether or not they contain essential data, and assigns them to different pathways and control functions within the network accelerator. This prevents interference with data that requires high reliability and safeguards in-vehicle data communication from a variety of security threats.

These four technologies have been incorporated into Renesas’ R-Car S4 vehicle communication gateway SoC. With the latest R-Car S4, developers can accelerate advances in E/E architectures, implement secure connection with cloud services, and ensure safe and reliable vehicle control at the same time.

The post Renesas Develops Technologies for Automotive Communication Gateway SoCs appeared first on ELE Times.

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it has developed four technologies for system-on-chip (SoC) devices for in-vehicle communication gateways. These SoCs are expected to play a crucial role in defining the next-generation electrical/electronic (E/E) architecture in automotive systems.

SoCs for automotive gateways must provide both high performance to implement new applications such as cloud services, and low power consumption when they are not in use. They also need to deliver fast CAN response to support instant start-up. Additionally, these SoCs need to provide power-efficient communication technology that enables network functions as a gateway using limited power and security technology to enable safe communication outside the vehicle. To meet these requirements, Renesas has developed (1) an architecture that dynamically changes the circuit operation timing to match the vehicle conditions with optimized performance and power consumption, (2) fast start-up technology by partitioning and powering essential programs only, (3) a network accelerator that achieves a power efficiency of 10 gigabits per second/watt (Gbps/W), and (4) security technology that prevents communication interference by recognizing and protecting vital in-vehicle communication related to vehicle control.

1. Architecture that optimizes processing performance and power consumption depending on vehicle conditions

Communication gateway SoCs need to deliver processing performance exceeding 30,000 Dhrystone million instructions per second (DMIPS) when running, while also keeping standby power consumption to 2 mW or less in order to maintain battery life. Typically, high-performance SoCs also have high power consumption in standby mode, while low-power SoCs with small standby power consumption have performance issues. To resolve this tradeoff, Renesas combined in a single chip a high-performance application system and a control system optimized for ultralow standby power consumption. The new architecture controls the power supplies of these two subsystems and changes the timing of circuit operation to achieve an optimal balance between performance and power efficiency. This results in higher performance during operation and lower power consumption during standby.

2. Fast start-up technology with external flash memory achieving the same fast speed as embedded flash memory

Since communication gateway SoCs manage processing of critical functions related to vehicle control, they must be able to respond to CAN within 50 milliseconds (msec.) of start-up. However, if the SoC uses a process that does not support embedded flash memory, the start-up program must be encrypted and stored in external flash memory. This means that it takes additional time to load program data and decrypt it. To solve this issue, Renesas developed technology that splits the program into sections and initially loads and decrypts only an essential portion for start-up, while continuing to load the rest of the program in parallel. This enables a fast response to CAN (50ms or less), even when using external flash memory.

3. Highly efficient network accelerator with 10 Gbps/W communication efficiency

To allow air cooling and heat dissipation for electronic control units (ECUs), communication gateway SoCs must keep power consumption to 7 watts or less. Since computing processing performance of 30,000 DMIPS or higher requires approximately 6 watts of power, only around 1 watt can be used for network processing. This presents a challenge as the total communication of 10 Gbps must be achieved using 1 watt of power, with a processing efficiency of only around  3 Gbps/W when processed by the CPU. To work around this issue, Renesas offloaded processing from the CPU to a custom network accelerator, achieving higher efficiency at 9.4 Gbps/W. Additionally, Renesas boosted efficiency to 11.5 Gbps/W by switching the routing method from a conventional TCAM approach to a hash table in SRAM. 

4. Security technology to prevent interference with communication requiring high reliability

A communication gateway SoC performs a mixed set of tasks such as data processing related to vehicle control that requires a high level of reliability, and large amounts of random data communication with cloud services and others. Since vehicle control is essential to ensuring safety, protecting and separating mission-critical data is important. However, despite the differences in data types, all data is transmitted through the same in-vehicle network, leading to physical intersections and raising security issues. To address this challenge, Renesas developed security technology that analyzes incoming packets to the SoC. It determines whether or not they contain essential data, and assigns them to different pathways and control functions within the network accelerator. This prevents interference with data that requires high reliability and safeguards in-vehicle data communication from a variety of security threats.

These four technologies have been incorporated into Renesas’ R-Car S4 vehicle communication gateway SoC. With the latest R-Car S4, developers can accelerate advances in E/E architectures, implement secure connection with cloud services, and ensure safe and reliable vehicle control at the same time.

The post Renesas Develops Technologies for Automotive Communication Gateway SoCs appeared first on ELE Times.

A joint venture of Vedanta and Foxconn in September last year signed a Memorandum of Understanding (MoU) with the Gujarat government to invest Rs 1,54,000 crore to set up the plant in the state. This will be the first manufacturing facility for semiconductors in India.

This project is likely to get huge subsidies and incentives, like zero stamp duty on land purchase and subsidised water and electricity, under the ‘Gujarat Semiconductor Policy 2022-27’. Gujarat became the first state in the country to have such a dedicated policy for the semiconductor and display fabrication sector.

A joint venture of Vedanta and electronics manufacturing giant Foxconn has finalised the Dholera Special Investment Region near Ahmedabad city of Gujarat for setting up their semiconductor and display manufacturing facility.

“After a detailed site analysis in consultation with Gujarat government authorities, the joint venture entity of Vedanta and Foxconn has selected Dholera SIR for setting up their semiconductor and display manufacturing facility. The project is in the advanced stage of evaluation by the government of India,” the official said. The MoU was signed in September last year in Gandhinagar in the presence of Minister for Railways, Communications, Electronics & Information Technology, Ashwini Vaishnaw.

Both the companies would invest Rs 1,54,000 crore to set up the facility in Gujarat, which would create one lakh job opportunities, Gujarat Chief Minister Bhupendra Patel had said on the occasion. Patel had also said his government will provide cooperation to set up the facility and to make it a success.

Prime Minister Narendra Modi, had given clear indication that the mega semiconductor plant will come up at Dholera SIR, nearly 100 km from Ahmedabad.

Under ‘Gujarat Semiconductor Policy 2022-27’, eligible projects will be given 75 per cent subsidy on the purchase of the first 200 acres of land for setting up manufacturing units. The eligible projects will be provided good quality water at the rate of Rs 12 per cubic metre for the first five years.

To encourage investors under the policy, the state government has also announced to reimburse 100 per cent of stamp duty which investors would pay for the first time for taking land on lease, sale or on land transfer.

The post India to get first semiconductor facility at Dholera SIR for Vedanta-Foxconn JV appeared first on ELE Times.

A joint venture of Vedanta and Foxconn in September last year signed a Memorandum of Understanding (MoU) with the Gujarat government to invest Rs 1,54,000 crore to set up the plant in the state. This will be the first manufacturing facility for semiconductors in India.

This project is likely to get huge subsidies and incentives, like zero stamp duty on land purchase and subsidised water and electricity, under the ‘Gujarat Semiconductor Policy 2022-27’. Gujarat became the first state in the country to have such a dedicated policy for the semiconductor and display fabrication sector.

A joint venture of Vedanta and electronics manufacturing giant Foxconn has finalised the Dholera Special Investment Region near Ahmedabad city of Gujarat for setting up their semiconductor and display manufacturing facility.

“After a detailed site analysis in consultation with Gujarat government authorities, the joint venture entity of Vedanta and Foxconn has selected Dholera SIR for setting up their semiconductor and display manufacturing facility. The project is in the advanced stage of evaluation by the government of India,” the official said. The MoU was signed in September last year in Gandhinagar in the presence of Minister for Railways, Communications, Electronics & Information Technology, Ashwini Vaishnaw.

Both the companies would invest Rs 1,54,000 crore to set up the facility in Gujarat, which would create one lakh job opportunities, Gujarat Chief Minister Bhupendra Patel had said on the occasion. Patel had also said his government will provide cooperation to set up the facility and to make it a success.

Prime Minister Narendra Modi, had given clear indication that the mega semiconductor plant will come up at Dholera SIR, nearly 100 km from Ahmedabad.

Under ‘Gujarat Semiconductor Policy 2022-27’, eligible projects will be given 75 per cent subsidy on the purchase of the first 200 acres of land for setting up manufacturing units. The eligible projects will be provided good quality water at the rate of Rs 12 per cubic metre for the first five years.

To encourage investors under the policy, the state government has also announced to reimburse 100 per cent of stamp duty which investors would pay for the first time for taking land on lease, sale or on land transfer.

The post India to get first semiconductor facility at Dholera SIR for Vedanta-Foxconn JV appeared first on ELE Times.

Anritsu Corporation President Hirokazu Hamada has announced a strategic partnership with Spirent Communications in Open RAN* test solutions. This collaboration will play a key role in helping equipment vendors, carriers, system integrators, cloud service providers, and others to configure an Open RAN ecosystem by measuring wireless RAN O-RU characteristics, fronthaul Conformance Tests and End-to-End tests connecting O-DU, O-CU, and Core.

The Open RAN is the concept specifying open standards for network interfaces to expand services and reduce costs by supporting multivendor equipment sourcing as well as to enable intelligence, helping drive growth and creating new business opportunities. Mobile network operators and equipment vendors are testing and introducing Open RAN led by the O-RAN ALLIANCE and other promotion groups.

Outline of Spirent and Anritsu Test Solution

Spirent Communications provides simulating/emulating environment for all network components and interfaces on the Landslide and Wireless Test Series to solve Open RAN interconnectivity challenges.

Anritsu offers a line of solutions for precision time synchronization as well as test equipment for O-RU TRx characteristics, and also introduces its new O-RU test solution combining O-DU and fronthaul emulation. This collaboration with Spirent offers a comprehensive portfolio of solutions covering both network and wireless testing for suppliers and carriers deploying Open RAN.

The Anritsu and Spirent video demonstration explaining their O-RU test solutions will be played MWC 2023, starting 27 February 2023, in Barcelona, Spain, including MWC 2023 Virtual Exhibition.

Anritsu will contribute to the success of diversified and advanced 5G mobile networks through future collaborative business partnerships.

The post Anritsu and Spirent Communications Collaborate to Provide Open RAN Test Solutions appeared first on ELE Times.

Anritsu Corporation President Hirokazu Hamada has announced a strategic partnership with Spirent Communications in Open RAN* test solutions. This collaboration will play a key role in helping equipment vendors, carriers, system integrators, cloud service providers, and others to configure an Open RAN ecosystem by measuring wireless RAN O-RU characteristics, fronthaul Conformance Tests and End-to-End tests connecting O-DU, O-CU, and Core.

The Open RAN is the concept specifying open standards for network interfaces to expand services and reduce costs by supporting multivendor equipment sourcing as well as to enable intelligence, helping drive growth and creating new business opportunities. Mobile network operators and equipment vendors are testing and introducing Open RAN led by the O-RAN ALLIANCE and other promotion groups.

Outline of Spirent and Anritsu Test Solution

Spirent Communications provides simulating/emulating environment for all network components and interfaces on the Landslide and Wireless Test Series to solve Open RAN interconnectivity challenges.

Anritsu offers a line of solutions for precision time synchronization as well as test equipment for O-RU TRx characteristics, and also introduces its new O-RU test solution combining O-DU and fronthaul emulation. This collaboration with Spirent offers a comprehensive portfolio of solutions covering both network and wireless testing for suppliers and carriers deploying Open RAN.

The Anritsu and Spirent video demonstration explaining their O-RU test solutions will be played MWC 2023, starting 27 February 2023, in Barcelona, Spain, including MWC 2023 Virtual Exhibition.

Anritsu will contribute to the success of diversified and advanced 5G mobile networks through future collaborative business partnerships.

The post Anritsu and Spirent Communications Collaborate to Provide Open RAN Test Solutions appeared first on ELE Times.

The RF Front End Includes RF Switches and Pre-Drivers and Is Integrated with the AMD RFSoC Digital Front End ZCU Evaluation Kit

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced plans to showcase a full RF front end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD. Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers and pre-drivers. It offers a complete solution to meet the demand of the growing mobile network infrastructure market.

The new 5G design platform integrates all the essential RF and digital front-end hardware for base stations operating in the Open Radio Access Network (O-RAN) ecosystem. This includes a high-isolation multi-throw DPD (Digital Pre-Distortion) switch, a high-gain and linearity pre-driver in a compact package, an integrated switch and Low Noise Amplifier (LNA) with input signal coupling functionality. This full RF front end platform is designed to efficiently process and transmit data to wireless networks with optimized power levels. Moreover, it has been integrated with the AMD RFSoC DFE ZCU670 Evaluation Kit for quick prototyping and rapid development of wireless network systems. The platform offers superior RF performance, while minimizing DPD resources for TX channel linearization, improving radio efficiency and ultimately reducing operating costs for wireless network providers.

The RF front-end solution is the latest 5G solution to be jointly developed by Renesas and AMD. Previously, the two companies collaborated on the high-performance RF timing solution for 5G Next-Gen Radio (5G NR), which incorporates Renesas’ IEEE 1588-enabled System Synchronizer as part of the DFE ZCU670 Evaluation Kit.

“We are thrilled to be collaborating with AMD once again to demonstrate our latest RF capabilities at the upcoming Mobile World Congress,” said Naveen Yanduru, Vice President of RF Engineering at Renesas’ Infrastructure Business Division. “Using our turnkey hardware solution, developers of 5G RF wireless infrastructure systems can reduce development time and cost. We are confident that this solution will set a new standard in RF performance and efficiency for the wireless communication market.”

“The RFMC expansion connectors on the ZCU670 evaluation board allow our customers to quickly prototype and evaluate a complete RF line up design for their Radio. To demonstrate, we have collaborated with Renesas again to develop an optimized RF Front End reference design targeting the N78 band,” said Brendan Farley, Corporate Vice President of Wireless Engineering at AMD. “As the market for OpenRAN 5G Radio (O-RU) continues to grow, these reference designs will help accelerate our mutual customers’ time to market with proven solutions.”

The post Renesas Collaborates with AMD to Demo Full RF and Digital Front-End Design for 5G Active Antenna Systems appeared first on ELE Times.

The RF Front End Includes RF Switches and Pre-Drivers and Is Integrated with the AMD RFSoC Digital Front End ZCU Evaluation Kit

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced plans to showcase a full RF front end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD. Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers and pre-drivers. It offers a complete solution to meet the demand of the growing mobile network infrastructure market.

The new 5G design platform integrates all the essential RF and digital front-end hardware for base stations operating in the Open Radio Access Network (O-RAN) ecosystem. This includes a high-isolation multi-throw DPD (Digital Pre-Distortion) switch, a high-gain and linearity pre-driver in a compact package, an integrated switch and Low Noise Amplifier (LNA) with input signal coupling functionality. This full RF front end platform is designed to efficiently process and transmit data to wireless networks with optimized power levels. Moreover, it has been integrated with the AMD RFSoC DFE ZCU670 Evaluation Kit for quick prototyping and rapid development of wireless network systems. The platform offers superior RF performance, while minimizing DPD resources for TX channel linearization, improving radio efficiency and ultimately reducing operating costs for wireless network providers.

The RF front-end solution is the latest 5G solution to be jointly developed by Renesas and AMD. Previously, the two companies collaborated on the high-performance RF timing solution for 5G Next-Gen Radio (5G NR), which incorporates Renesas’ IEEE 1588-enabled System Synchronizer as part of the DFE ZCU670 Evaluation Kit.

“We are thrilled to be collaborating with AMD once again to demonstrate our latest RF capabilities at the upcoming Mobile World Congress,” said Naveen Yanduru, Vice President of RF Engineering at Renesas’ Infrastructure Business Division. “Using our turnkey hardware solution, developers of 5G RF wireless infrastructure systems can reduce development time and cost. We are confident that this solution will set a new standard in RF performance and efficiency for the wireless communication market.”

“The RFMC expansion connectors on the ZCU670 evaluation board allow our customers to quickly prototype and evaluate a complete RF line up design for their Radio. To demonstrate, we have collaborated with Renesas again to develop an optimized RF Front End reference design targeting the N78 band,” said Brendan Farley, Corporate Vice President of Wireless Engineering at AMD. “As the market for OpenRAN 5G Radio (O-RU) continues to grow, these reference designs will help accelerate our mutual customers’ time to market with proven solutions.”

The post Renesas Collaborates with AMD to Demo Full RF and Digital Front-End Design for 5G Active Antenna Systems appeared first on ELE Times.

With research on the technology components for the future 6G wireless communication standard in full swing, the possibilities of an AI-native air interface for 6G also are being explored. Rohde & Schwarz, working with NVIDIA, is taking a step forward from simulations to implementing artificial intelligence and machine learning (AI/ML) in future 6G technology. At MWC Barcelona, the companies will present the industry’s first hardware-in-the-loop demonstration of a neural receiver, showing the achievable performance gains when using trained ML models compared to traditional signal processing.

At this year’s Mobile World Congress, visitors can experience the first demonstration of how a neural receiver approach performs in a 5G NR uplink multi-user multiple input multiple output (MU-MIMO) scenario – a blueprint for a possible 6G physical layer. The setup combines high-end test solutions for signal generation and analysis from Rohde & Schwarz and the NVIDIA Sionna GPU-accelerated open-source library for link-level simulations.

A neural receiver constitutes the concept of replacing signal processing blocks for the physical layer of a wireless communications system with trained machine learning models. Academia, leading research institutes and industry experts across the globe anticipate that a future 6G standard will use AI/ML for signal processing tasks, such as channel estimation, channel equalization, and demapping. Today’s simulations suggest that a neural receiver will increase link-quality and will impact throughput compared to the current high-performance deterministic software algorithms used in 5G NR.

To train machine learning models, data sets are an absolute prerequisite. Often, the required access to data sets is limited or simply not available. In the current state of early 6G research, test and measurement equipment provides a viable alternative when generating various data sets with different signal configurations to train machine learning models for signal processing tasks.

In the showcased AI/ML-based neural receiver setup at the Rohde & Schwarz booth, the R&S SMW200A vector signal generator emulates two individual users transmitting an 80 MHz wide signal in the uplink direction with a MIMO 2×2 signal configuration. Each user is independently faded, and noise is applied to simulate realistic radio channel conditions. The R&S MSR4 multi-purpose satellite receiver acts as the receiver, capturing the signal transmitted at a carrier frequency of 3 GHz by using its four phase-coherent receive channels. The data is then provided via the real-time streaming interface to a server. There, the signal is pre-processed using the R&S Server-Based Testing (SBT) framework including R&S VSE vector signal explorer (VSE) micro-services. The VSE signal analysis software synchronizes the signal and performs fast Fourier transforms (FFT). This post-FFT data set serves as input for a neural receiver implemented using NVIDIA Sionna.

NVIDIA Sionna is a GPU-accelerated open-source library for link-level simulation. It enables rapid prototyping of complex communications system architectures and provides native support to the integration of machine learning in 6G signal processing.

As part of the demonstration, the trained neural receiver is compared to the classical concept of a linear minimum mean squared error (LMMSE) receiver architecture, which applies traditional signal processing techniques based on deterministically developed software algorithms. These already high-performance algorithms are widely adopted in current 4G and 5G cellular networks.

Andreas Pauly, Executive Vice President of Rohde & Schwarz Test & Measurement Division, said: “Signal processing in wireless communications using machine learning algorithms is a very hot topic in the industry right now, often controversially discussed among industry peers. We are delighted to work with a partner like NVIDIA on this test bed. It will enable researchers and industry experts to validate their models based on a data-driven approach and put them to the test in a hardware-in-the-loop experiment, using our leading test solutions for signal generation and analysis.”

Ronnie Vasishta, Senior Vice President of Telecommunications at NVIDIA, said, “Trained ML models open up considerable potential for increasing performance compared to conventional signal processing. This hardware-in-the-loop demonstration of a neural receiver from Rohde & Schwarz and NVIDIA marks a milestone for the industry in demonstrating the utility of AI and machine learning in 6G technology.”

Rohde & Schwarz actively supports 6G research activities across Europe, Asia, and the US, while contributing to research projects, the work of industry alliances, and collaborating with leading research institutes and universities. The company’s test and measurement expertise and solutions help pave the way for the next generation of wireless communications, which is expected to be commercially deployed around 2030.

Rohde & Schwarz will present the AI/ML based trained neural receiver demonstration at the Mobile World Congress 2023 at the Fira Gran Via in Barcelona in hall 5, booth 5A80. Visitors are welcome to witness the performance gains of the neural receiver and discuss the details and general concept with experts from Rohde & Schwarz and NVIDIA.

For further information on Rohde & Schwarz test solutions on the verge of 6G, visit: https://www.rohde-schwarz.com/6G

The post Towards 6G: Rohde & Schwarz showcases AI/ML-based neural receiver with NVIDIA at MWC Barcelona appeared first on ELE Times.

With research on the technology components for the future 6G wireless communication standard in full swing, the possibilities of an AI-native air interface for 6G also are being explored. Rohde & Schwarz, working with NVIDIA, is taking a step forward from simulations to implementing artificial intelligence and machine learning (AI/ML) in future 6G technology. At MWC Barcelona, the companies will present the industry’s first hardware-in-the-loop demonstration of a neural receiver, showing the achievable performance gains when using trained ML models compared to traditional signal processing.

At this year’s Mobile World Congress, visitors can experience the first demonstration of how a neural receiver approach performs in a 5G NR uplink multi-user multiple input multiple output (MU-MIMO) scenario – a blueprint for a possible 6G physical layer. The setup combines high-end test solutions for signal generation and analysis from Rohde & Schwarz and the NVIDIA Sionna GPU-accelerated open-source library for link-level simulations.

A neural receiver constitutes the concept of replacing signal processing blocks for the physical layer of a wireless communications system with trained machine learning models. Academia, leading research institutes and industry experts across the globe anticipate that a future 6G standard will use AI/ML for signal processing tasks, such as channel estimation, channel equalization, and demapping. Today’s simulations suggest that a neural receiver will increase link-quality and will impact throughput compared to the current high-performance deterministic software algorithms used in 5G NR.

To train machine learning models, data sets are an absolute prerequisite. Often, the required access to data sets is limited or simply not available. In the current state of early 6G research, test and measurement equipment provides a viable alternative when generating various data sets with different signal configurations to train machine learning models for signal processing tasks.

In the showcased AI/ML-based neural receiver setup at the Rohde & Schwarz booth, the R&S SMW200A vector signal generator emulates two individual users transmitting an 80 MHz wide signal in the uplink direction with a MIMO 2×2 signal configuration. Each user is independently faded, and noise is applied to simulate realistic radio channel conditions. The R&S MSR4 multi-purpose satellite receiver acts as the receiver, capturing the signal transmitted at a carrier frequency of 3 GHz by using its four phase-coherent receive channels. The data is then provided via the real-time streaming interface to a server. There, the signal is pre-processed using the R&S Server-Based Testing (SBT) framework including R&S VSE vector signal explorer (VSE) micro-services. The VSE signal analysis software synchronizes the signal and performs fast Fourier transforms (FFT). This post-FFT data set serves as input for a neural receiver implemented using NVIDIA Sionna.

NVIDIA Sionna is a GPU-accelerated open-source library for link-level simulation. It enables rapid prototyping of complex communications system architectures and provides native support to the integration of machine learning in 6G signal processing.

As part of the demonstration, the trained neural receiver is compared to the classical concept of a linear minimum mean squared error (LMMSE) receiver architecture, which applies traditional signal processing techniques based on deterministically developed software algorithms. These already high-performance algorithms are widely adopted in current 4G and 5G cellular networks.

Andreas Pauly, Executive Vice President of Rohde & Schwarz Test & Measurement Division, said: “Signal processing in wireless communications using machine learning algorithms is a very hot topic in the industry right now, often controversially discussed among industry peers. We are delighted to work with a partner like NVIDIA on this test bed. It will enable researchers and industry experts to validate their models based on a data-driven approach and put them to the test in a hardware-in-the-loop experiment, using our leading test solutions for signal generation and analysis.”

Ronnie Vasishta, Senior Vice President of Telecommunications at NVIDIA, said, “Trained ML models open up considerable potential for increasing performance compared to conventional signal processing. This hardware-in-the-loop demonstration of a neural receiver from Rohde & Schwarz and NVIDIA marks a milestone for the industry in demonstrating the utility of AI and machine learning in 6G technology.”

Rohde & Schwarz actively supports 6G research activities across Europe, Asia, and the US, while contributing to research projects, the work of industry alliances, and collaborating with leading research institutes and universities. The company’s test and measurement expertise and solutions help pave the way for the next generation of wireless communications, which is expected to be commercially deployed around 2030.

Rohde & Schwarz will present the AI/ML based trained neural receiver demonstration at the Mobile World Congress 2023 at the Fira Gran Via in Barcelona in hall 5, booth 5A80. Visitors are welcome to witness the performance gains of the neural receiver and discuss the details and general concept with experts from Rohde & Schwarz and NVIDIA.

For further information on Rohde & Schwarz test solutions on the verge of 6G, visit: https://www.rohde-schwarz.com/6G

The post Towards 6G: Rohde & Schwarz showcases AI/ML-based neural receiver with NVIDIA at MWC Barcelona appeared first on ELE Times.

Infineon Technologies announced that the U.S. National Institute of Standards and Technology (NIST) has selected the Ascon algorithm developed by Christoph Dobraunig, Maria Eichlseder, Florian Mendel and Martin Schlaeffer as an international standard for lightweight cryptography (LWC). The cryptographic scheme was selected in a multi-stage and multi-year selection process, in which the algorithm turned out to be the strongest and most efficient, partially thanks to the continuous additions made by Infineon cryptologists Mendel and Schlaeffer.

A first version of Ascon was developed at the Graz University of Technology (TU) in early 2014. Since then, the algorithm has been further developed and improved by the teams from TU Graz, Infineon Technologies AG, Lamarr Security Research and Radboud University. Infineon’s main contributions were the efficiently secured implementations in hardware and software as well as the security analysis of Ascon.

“With increasing digitalization, it is becoming more and more important to secure end devices in the IoT. Until now, this has only been possible to a limited extent. With the Ascon algorithm, which has been elevated to a standard by NIST, this gap can be closed and secured for small and miniature devices in the network,” said Thomas Rosteck, President of Infineon’s Connected Secure Systems Division. “We are particularly proud of the fact that two of the cryptologists who contributed to the algorithm have been an integral part of our innovation team for several years.”

Lightweight cryptography addresses cryptographic methods that are suitable for use in resource-constrained environments – especially in the Internet of Things (IoT) with its numerous small sensors and actuators, or in miniaturization technologies. With Ascon, these applications can be efficiently secured even when little energy and computing power is available for security algorithms. The algorithm, which was co-developed by Infineon, is characterized by its efficient, simple and well-secured implementation, as well as additional features to protect against attacks in the field – additional key criteria for the NIST selection process.

Ascon prevails, final definition will follow soon

Back in 2019, Ascon won the “CAESAR Competition for Authenticated Encryption” in the Lightweight Applications category. As a result, Ascon was the most thoroughly analyzed algorithm in the subsequent NIST competition. In a public selection process, the performance and features of all 57 candidates were reviewed in multiple rounds and examined for weaknesses. In the end, Ascon ultimately emerged as the winner from the ten finalists.

There are currently several variants of the Ascon algorithm. Some or all of these may become part of the LWC standard published by NIST. NIST will be working with the Ascon team over the next few months to define the details of the standard. The variants provide developers with a set of cryptographic functions for different tasks. At its core, Ascon replaces the functionality of a symmetric encryption scheme and a hash function (AES-GCM with SHA-2 or SHA-3 with much improved efficiency) for many use cases.

Efficient and cost-effective cryptography is of great importance for numerous Infineon products that operate in networked systems. This will benefit, for example, many sensor applications in the automotive sector as well as power systems in a wide range of industrial applications. The standardization work of recent years and the security expertise of Infineon’s Connected Secure Systems Division enable the company to integrate Ascon cryptography into products and systems early and competently.

The post Improved security for the IoT: NIST selects Ascon as international standard for lightweight cryptography appeared first on ELE Times.

Infineon Technologies announced that the U.S. National Institute of Standards and Technology (NIST) has selected the Ascon algorithm developed by Christoph Dobraunig, Maria Eichlseder, Florian Mendel and Martin Schlaeffer as an international standard for lightweight cryptography (LWC). The cryptographic scheme was selected in a multi-stage and multi-year selection process, in which the algorithm turned out to be the strongest and most efficient, partially thanks to the continuous additions made by Infineon cryptologists Mendel and Schlaeffer.

A first version of Ascon was developed at the Graz University of Technology (TU) in early 2014. Since then, the algorithm has been further developed and improved by the teams from TU Graz, Infineon Technologies AG, Lamarr Security Research and Radboud University. Infineon’s main contributions were the efficiently secured implementations in hardware and software as well as the security analysis of Ascon.

“With increasing digitalization, it is becoming more and more important to secure end devices in the IoT. Until now, this has only been possible to a limited extent. With the Ascon algorithm, which has been elevated to a standard by NIST, this gap can be closed and secured for small and miniature devices in the network,” said Thomas Rosteck, President of Infineon’s Connected Secure Systems Division. “We are particularly proud of the fact that two of the cryptologists who contributed to the algorithm have been an integral part of our innovation team for several years.”

Lightweight cryptography addresses cryptographic methods that are suitable for use in resource-constrained environments – especially in the Internet of Things (IoT) with its numerous small sensors and actuators, or in miniaturization technologies. With Ascon, these applications can be efficiently secured even when little energy and computing power is available for security algorithms. The algorithm, which was co-developed by Infineon, is characterized by its efficient, simple and well-secured implementation, as well as additional features to protect against attacks in the field – additional key criteria for the NIST selection process.

Ascon prevails, final definition will follow soon

Back in 2019, Ascon won the “CAESAR Competition for Authenticated Encryption” in the Lightweight Applications category. As a result, Ascon was the most thoroughly analyzed algorithm in the subsequent NIST competition. In a public selection process, the performance and features of all 57 candidates were reviewed in multiple rounds and examined for weaknesses. In the end, Ascon ultimately emerged as the winner from the ten finalists.

There are currently several variants of the Ascon algorithm. Some or all of these may become part of the LWC standard published by NIST. NIST will be working with the Ascon team over the next few months to define the details of the standard. The variants provide developers with a set of cryptographic functions for different tasks. At its core, Ascon replaces the functionality of a symmetric encryption scheme and a hash function (AES-GCM with SHA-2 or SHA-3 with much improved efficiency) for many use cases.

Efficient and cost-effective cryptography is of great importance for numerous Infineon products that operate in networked systems. This will benefit, for example, many sensor applications in the automotive sector as well as power systems in a wide range of industrial applications. The standardization work of recent years and the security expertise of Infineon’s Connected Secure Systems Division enable the company to integrate Ascon cryptography into products and systems early and competently.

The post Improved security for the IoT: NIST selects Ascon as international standard for lightweight cryptography appeared first on ELE Times.

• Hon’ble Union Minister of State for Power RK Singh inaugurates 15th edition of ELECRAMA 2023
• Close to 1,000 Exhibitors with 3,50,000 Expected Footfalls
• 15,000 + focused b2b meetings
• Business Opportunities in Defence, Railways, Green Buildings, Smart Cities
• Buyers from 75+ Countries and 300+ domestic buyers
• CEOs from smart cities of North-East to share their procurement requirements in the region
• Report on New Energies Equipment Outlook 2030 to be unveiled

ELECRAMA 2023, World’s largest electrical show by IEEMA, kicked off to an electrifying start following a grand opening at the India Expo Mart, Greater Noida on 18th February 2023. The event was graced by chief guest RK Singh, Union Minister of State (IC) Power, New & Renewable Energy; H.E. Zhemu Soda, Hon’ble Minister of Energy and Power Development, Zimbabwe, Satish Pai, Managing Director, Hindalco Industries; Jean Pascal Tricoire, Global CEO, Schneider Electric, along with Rohit Pathak, President, IEEMA; Jitendra K Agarwal, Chairman, ELECRAMA 2023; Hamza Arsiwala, President-Elect, IEEMA, Sunil Singhvi, Vice President, IEEMA, Charu Mathur, Director General, IEEMA and several other dignitaries.

RK Singh, Hon’ble Union Minister for Power and New & Renewable Energy, added, “I congratulate IEEMA on kickstarting the ELECRAMA 2023 – the 15th edition of world class exhibition of electrical, industrial electronics and allied industry – with a star-studded inaugural ceremony. In the past 5 years, we have brought great transformational changes in our industry. We are committed to being climate-friendly and we are aggressively going ahead with our Hon’ble Prime Minister’s belief in ensuring a healthier planet. I am pleased that the focus of ELECRAMA 2023 is on energy transition and future technology which is in line with the Government of India’s ‘Vision for India@2047’. We are aspiring to become a 5 trillion-dollar economy and we are one of the fastest-growing economies in the world. Electricity is the most significant contributor to the energy requirement of the country. I am proud to see the journey and growth of the industry. I feel ELECRAMA 2023 remains pivotal in helping us identify future challenges and subsequently find innovative solutions to overcome them. I look forward to meeting the startups participating in the exhibitions and wish IEEMA all the best for its five-day flagship event.”

Kickstarting the proceedings of the 15th edition of ELECRAMA 2023, Rohit Pathak, President, IEEMA, said, “We’re privileged to have the presence of the Hon’ble Power Minister and two top industry leaders at ELECRAMA 2023. This decade, and perhaps even this century, belongs to India. The transition to Green Electricity as the main source of energy has provided us with an excellent opportunity to Self-Reliant on Energy and to Lead the World on some of these new technologies with the scale India provides. Aaj Bharat AatmaNirbhar ho raha hai, aage Vishwa Bharat par Nirbhar hoga (Today, India is becoming self-dependent and, in future, the world will depend on India). We believe that these new technologies will require a lot of innovation, and hence we have created a startup platform at IEEMA called ElectraVerse Spark to allow them to “plug into our world of energy” in a seamless manner.

Given the government’s vision pertaining to the sector, we, at IEEMA, have also aligned our Industry Vision for 2047 with the country’s future goals. Acting on the vision, this year’s ELECRAMA will focus on creating a platform to showcase products & solutions in new energies; discussion forums on R&D and innovation in new technologies; in addition to generation, T&D, and building electrical products. With a greater emphasis on providing quality power and identifying innovative solutions, we, at the behest of ELECRAMA 2023, intend to contribute towards making India Atmanirbhar, Green and Energy independent.”

Talking about the evolution of the flagship event over the years, Jitendra K Agarwal, Chairman, ELECRAMA 2023, said, “In the last 12 months, we organised 11 roadshows in India and overseas across major electrical industry clusters to identify the hunger for its persistent growth. The next five days is a culmination of the journey and findings which, in turn, has led to such a stupendous response to this year’s ELECRAMA. The 15th edition of the mega event is bolstered with special concurrent events such as eTechNxt, World Utility Summit, ELECTRAVERSE start-up challenge, special presence of women in power, and global CEOs in attendance. Furthermore, we’re expecting 700 buyers from 75 countries in RBSM, 15000 pre-scheduled b2b meetings, and 300 buyers from Utilities, Railways, Defence, Real Estate, Smart Cities, and large PSUs. Therefore, ELECRAMA 2023 is a true reflection of the capabilities and aspirations of the Indian electrical industry.”

Jean Pascal Tricoire, Global CEO, Schneider Electric, said, “We, at Schneider Electric, consistently strive to identify future challenges and find probable solutions in our persistent bid to contribute to the electrical industry. Our vision is aligned with India’s future goals as it continues to break new ground in the power sector. As the country’s energy landscape continues to grow, we would continue to support rising India on its exciting journey of electrification and digitization. Invited to attend a flagship event that is credited for inspiring new ideas and innovations in the industry, I am elated to be here at the 15th edition of ELECRAMA that started with an exciting and equally entertaining inaugural ceremony. I wish IEEMA good luck for what promises to be yet another dazzling ELECRAMA edition.”

Satish Pai, Managing Director, Hindalco Industries, said, “At a time when global efforts are being driven to help realise our collective vision of a sustainable future, we must embrace sustainability as a way of life before expecting it to become a way of doing business. As we find new ways of negating uncertainty and future challenges, the coming decade will witness the adoption of numerous innovative, tech-enabled solutions especially in the field of sustainability which will allow corporations to implement initiatives in a better and more effective manner. At ELECRAMA 2023, I am expecting exhibitors to showcase their ideas and innovations to contribute towards creating a future roadmap for a sustainable future.”

The biennial electronics congregation, with ‘Reimagine Energy – For Sustainable Future’ as this year’s theme, will have the largest public showcase yet of industry innovations by over 1000 exhibitors from India and abroad occupying 1,10,000 sqm of exhibition space over the course of next five days. The much-anticipated event is expected to witness 3,50,000 footfall and over 15,000 pre-scheduled meetings between buyers and sellers.

The five-day congregation will also see national and international industry experts and policymakers deliberate upon industry challenges, innovations, and business models through a series of leadership summits and meetings. The premier showcase event will also host the world’s largest confluence of power transmission and distribution communities at the 5th Reverse Buyers Sellers Meet (RBSM) and Domestic Buyers Sellers Meet (DBSM). The mega event will also be seen focusing on the role of women in the industry, building stronger electrical systems for homes, offices, and industries, and enabling discussions on the way forward for complete electrification of railways. Digital technologies, IoT and AI-powered electrical systems, and other smart-tech solutions are being showcased at the event.

Completing 33 years of being the only industry platform of its kind, ELECRAMA 2023 is supported by the Ministry of New and Renewable Energy, Ministry of Power, Ministry of Heavy Industries and Public Enterprises, and Ministry of Micro, Small, and Medium Enterprises. While Uttar Pradesh is the host state partner, Germany is the country partner in the 15th edition of the initiative.

The post ELECRAMA 2023 dazzles to an electrifying start with 1000 exhibitors showcasing global innovations appeared first on ELE Times.

• Hon’ble Union Minister of State for Power RK Singh inaugurates 15th edition of ELECRAMA 2023
• Close to 1,000 Exhibitors with 3,50,000 Expected Footfalls
• 15,000 + focused b2b meetings
• Business Opportunities in Defence, Railways, Green Buildings, Smart Cities
• Buyers from 75+ Countries and 300+ domestic buyers
• CEOs from smart cities of North-East to share their procurement requirements in the region
• Report on New Energies Equipment Outlook 2030 to be unveiled

ELECRAMA 2023, World’s largest electrical show by IEEMA, kicked off to an electrifying start following a grand opening at the India Expo Mart, Greater Noida on 18th February 2023. The event was graced by chief guest RK Singh, Union Minister of State (IC) Power, New & Renewable Energy; H.E. Zhemu Soda, Hon’ble Minister of Energy and Power Development, Zimbabwe, Satish Pai, Managing Director, Hindalco Industries; Jean Pascal Tricoire, Global CEO, Schneider Electric, along with Rohit Pathak, President, IEEMA; Jitendra K Agarwal, Chairman, ELECRAMA 2023; Hamza Arsiwala, President-Elect, IEEMA, Sunil Singhvi, Vice President, IEEMA, Charu Mathur, Director General, IEEMA and several other dignitaries.

RK Singh, Hon’ble Union Minister for Power and New & Renewable Energy, added, “I congratulate IEEMA on kickstarting the ELECRAMA 2023 – the 15th edition of world class exhibition of electrical, industrial electronics and allied industry – with a star-studded inaugural ceremony. In the past 5 years, we have brought great transformational changes in our industry. We are committed to being climate-friendly and we are aggressively going ahead with our Hon’ble Prime Minister’s belief in ensuring a healthier planet. I am pleased that the focus of ELECRAMA 2023 is on energy transition and future technology which is in line with the Government of India’s ‘Vision for India@2047’. We are aspiring to become a 5 trillion-dollar economy and we are one of the fastest-growing economies in the world. Electricity is the most significant contributor to the energy requirement of the country. I am proud to see the journey and growth of the industry. I feel ELECRAMA 2023 remains pivotal in helping us identify future challenges and subsequently find innovative solutions to overcome them. I look forward to meeting the startups participating in the exhibitions and wish IEEMA all the best for its five-day flagship event.”

Kickstarting the proceedings of the 15th edition of ELECRAMA 2023, Rohit Pathak, President, IEEMA, said, “We’re privileged to have the presence of the Hon’ble Power Minister and two top industry leaders at ELECRAMA 2023. This decade, and perhaps even this century, belongs to India. The transition to Green Electricity as the main source of energy has provided us with an excellent opportunity to Self-Reliant on Energy and to Lead the World on some of these new technologies with the scale India provides. Aaj Bharat AatmaNirbhar ho raha hai, aage Vishwa Bharat par Nirbhar hoga (Today, India is becoming self-dependent and, in future, the world will depend on India). We believe that these new technologies will require a lot of innovation, and hence we have created a startup platform at IEEMA called ElectraVerse Spark to allow them to “plug into our world of energy” in a seamless manner.

Given the government’s vision pertaining to the sector, we, at IEEMA, have also aligned our Industry Vision for 2047 with the country’s future goals. Acting on the vision, this year’s ELECRAMA will focus on creating a platform to showcase products & solutions in new energies; discussion forums on R&D and innovation in new technologies; in addition to generation, T&D, and building electrical products. With a greater emphasis on providing quality power and identifying innovative solutions, we, at the behest of ELECRAMA 2023, intend to contribute towards making India Atmanirbhar, Green and Energy independent.”

Talking about the evolution of the flagship event over the years, Jitendra K Agarwal, Chairman, ELECRAMA 2023, said, “In the last 12 months, we organised 11 roadshows in India and overseas across major electrical industry clusters to identify the hunger for its persistent growth. The next five days is a culmination of the journey and findings which, in turn, has led to such a stupendous response to this year’s ELECRAMA. The 15th edition of the mega event is bolstered with special concurrent events such as eTechNxt, World Utility Summit, ELECTRAVERSE start-up challenge, special presence of women in power, and global CEOs in attendance. Furthermore, we’re expecting 700 buyers from 75 countries in RBSM, 15000 pre-scheduled b2b meetings, and 300 buyers from Utilities, Railways, Defence, Real Estate, Smart Cities, and large PSUs. Therefore, ELECRAMA 2023 is a true reflection of the capabilities and aspirations of the Indian electrical industry.”

Jean Pascal Tricoire, Global CEO, Schneider Electric, said, “We, at Schneider Electric, consistently strive to identify future challenges and find probable solutions in our persistent bid to contribute to the electrical industry. Our vision is aligned with India’s future goals as it continues to break new ground in the power sector. As the country’s energy landscape continues to grow, we would continue to support rising India on its exciting journey of electrification and digitization. Invited to attend a flagship event that is credited for inspiring new ideas and innovations in the industry, I am elated to be here at the 15th edition of ELECRAMA that started with an exciting and equally entertaining inaugural ceremony. I wish IEEMA good luck for what promises to be yet another dazzling ELECRAMA edition.”

Satish Pai, Managing Director, Hindalco Industries, said, “At a time when global efforts are being driven to help realise our collective vision of a sustainable future, we must embrace sustainability as a way of life before expecting it to become a way of doing business. As we find new ways of negating uncertainty and future challenges, the coming decade will witness the adoption of numerous innovative, tech-enabled solutions especially in the field of sustainability which will allow corporations to implement initiatives in a better and more effective manner. At ELECRAMA 2023, I am expecting exhibitors to showcase their ideas and innovations to contribute towards creating a future roadmap for a sustainable future.”

The biennial electronics congregation, with ‘Reimagine Energy – For Sustainable Future’ as this year’s theme, will have the largest public showcase yet of industry innovations by over 1000 exhibitors from India and abroad occupying 1,10,000 sqm of exhibition space over the course of next five days. The much-anticipated event is expected to witness 3,50,000 footfall and over 15,000 pre-scheduled meetings between buyers and sellers.

The five-day congregation will also see national and international industry experts and policymakers deliberate upon industry challenges, innovations, and business models through a series of leadership summits and meetings. The premier showcase event will also host the world’s largest confluence of power transmission and distribution communities at the 5th Reverse Buyers Sellers Meet (RBSM) and Domestic Buyers Sellers Meet (DBSM). The mega event will also be seen focusing on the role of women in the industry, building stronger electrical systems for homes, offices, and industries, and enabling discussions on the way forward for complete electrification of railways. Digital technologies, IoT and AI-powered electrical systems, and other smart-tech solutions are being showcased at the event.

Completing 33 years of being the only industry platform of its kind, ELECRAMA 2023 is supported by the Ministry of New and Renewable Energy, Ministry of Power, Ministry of Heavy Industries and Public Enterprises, and Ministry of Micro, Small, and Medium Enterprises. While Uttar Pradesh is the host state partner, Germany is the country partner in the 15th edition of the initiative.

The post ELECRAMA 2023 dazzles to an electrifying start with 1000 exhibitors showcasing global innovations appeared first on ELE Times.

The showcase underscores Delta’s unique capability to provide a broad portfolio of IoT-based smart energy-saving solutions to foster India’s sustainable cities and smart factories

Delta’s EVP of Global Operations Jimmy Yiin (left) and Delta India’s President Benjamin Lin unveil the new Green EV Charging Station at Elecrama 2023.

Delta, a global leader in energy management and industrial automation solutions, presented a wide portfolio of IoT-based Smart Green Solutions at ELECRAMA 2023, which includes a smart microgrid-based Green EV Charging Station and the new Open-Loop Variable-Torque Standard Drive VP3000 Series. The former is a total solution integrating Delta’s EV chargers, energy storage systems, solar PV inverters and EV Charging Infrastructure Management System to enable microgrids capable of providing clean and stable electricity to EVs. The new VP3000 series, with power rating up to 630kW, enhances productivity and lowers harmonic distortion (THDi) down to 35% in industrial motors used in HVAC, pumps, compressors, water supply applications. As a major contributor to the “Make in India” initiative through its new growing manufacturing capabilities in Krishnagiri, Delta is increasingly committed to India’s green industrial transformation.

Mr. Jimmy Yiin, Executive Vice President of Delta’s Global Business Operations, said, “As a world-class corporate citizen, Delta commonly invests over 8% of its annual revenues into R&D and currently nurtures more than 10,000 R&D engineers around the world to foster innovation. Moreover, we have also commitment to global sustainability initiatives, such as RE100, which is a promise to power 100% of our global operations with renewable electricity by 2030. This unique business model that combines Delta’s environmental, social & corporate governance (ESG) endeavours and the deployment of our smart energy-saving solutions offers unique value to our global customers and stakeholders.”

In Delta press conference, Mr. Benjamin Lin, President, Delta Electronics India, said, “For two decades now, Delta India has built a unique track record in developing tailor-made solutions to suit the requirements and sustainable goals of our Indian customers. We have cumulatively delivered over 7,000 EV chargers to our customers across the country, and the Green EV Charging Station launched today at ELECRAMA will help accelerate India’s e-mobility transition even further. The new VP3000 Series is an important addition to our broad Industrial Automation Solutions offering for a wide range of applications. Today, we are demonstrating how Delta’s solutions transform transportation, factories, buildings, telecom power sites, and data centres, into intelligent, connected and sustainable infrastructure.”

With over 50 years of expertise in high-efficiency power technologies, Delta has been delivering smart energy-saving solutions worldwide for over a decade. Delta and major stakeholders in the EV charging infrastructure sector, which includes major charge point operators, such as TATA Power, Bangalore Electricity Supply Company Ltd. (BESCOM), oil marketing companies like BPCL, as well as various OEMs, have contributed substantially to the deployment of EV chargers across India.

The post Delta Electronics unveils microgrid-based green EV charging station appeared first on ELE Times.

The showcase underscores Delta’s unique capability to provide a broad portfolio of IoT-based smart energy-saving solutions to foster India’s sustainable cities and smart factories

Delta’s EVP of Global Operations Jimmy Yiin (left) and Delta India’s President Benjamin Lin unveil the new Green EV Charging Station at Elecrama 2023.

Delta, a global leader in energy management and industrial automation solutions, presented a wide portfolio of IoT-based Smart Green Solutions at ELECRAMA 2023, which includes a smart microgrid-based Green EV Charging Station and the new Open-Loop Variable-Torque Standard Drive VP3000 Series. The former is a total solution integrating Delta’s EV chargers, energy storage systems, solar PV inverters and EV Charging Infrastructure Management System to enable microgrids capable of providing clean and stable electricity to EVs. The new VP3000 series, with power rating up to 630kW, enhances productivity and lowers harmonic distortion (THDi) down to 35% in industrial motors used in HVAC, pumps, compressors, water supply applications. As a major contributor to the “Make in India” initiative through its new growing manufacturing capabilities in Krishnagiri, Delta is increasingly committed to India’s green industrial transformation.

Mr. Jimmy Yiin, Executive Vice President of Delta’s Global Business Operations, said, “As a world-class corporate citizen, Delta commonly invests over 8% of its annual revenues into R&D and currently nurtures more than 10,000 R&D engineers around the world to foster innovation. Moreover, we have also commitment to global sustainability initiatives, such as RE100, which is a promise to power 100% of our global operations with renewable electricity by 2030. This unique business model that combines Delta’s environmental, social & corporate governance (ESG) endeavours and the deployment of our smart energy-saving solutions offers unique value to our global customers and stakeholders.”

In Delta press conference, Mr. Benjamin Lin, President, Delta Electronics India, said, “For two decades now, Delta India has built a unique track record in developing tailor-made solutions to suit the requirements and sustainable goals of our Indian customers. We have cumulatively delivered over 7,000 EV chargers to our customers across the country, and the Green EV Charging Station launched today at ELECRAMA will help accelerate India’s e-mobility transition even further. The new VP3000 Series is an important addition to our broad Industrial Automation Solutions offering for a wide range of applications. Today, we are demonstrating how Delta’s solutions transform transportation, factories, buildings, telecom power sites, and data centres, into intelligent, connected and sustainable infrastructure.”

With over 50 years of expertise in high-efficiency power technologies, Delta has been delivering smart energy-saving solutions worldwide for over a decade. Delta and major stakeholders in the EV charging infrastructure sector, which includes major charge point operators, such as TATA Power, Bangalore Electricity Supply Company Ltd. (BESCOM), oil marketing companies like BPCL, as well as various OEMs, have contributed substantially to the deployment of EV chargers across India.

The post Delta Electronics unveils microgrid-based green EV charging station appeared first on ELE Times.

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the XENSIV KIT CSK PASCO2 and XENSIV KIT CSK BGT60TR13C connected sensor kits (CSK) from Infineon Technologies AG. The XENSIV connected sensor kits provide a ready-to-use sensor development platform for IoT devices. The CSK platform enables the creation of new prototype ideas based on Infineon sensors, including radar, environmental sensors and others.

Combining sensors, microcontrollers and secure connectivity for a prototype can become a resource-intensive process. The CSK platform solves this issue by combing XENSIV sensors with power-efficient, high-performance processing based on an Infineon PSoC 6 microcontroller. An OPTIGA Trust M security controller enables secure connectivity. The modular board design of the connected sensor kits is compatible with the Adafruit Feather form factor, allowing the user to prototype solutions for various sensor use cases, for example, battery-powered smart home applications.

The XENSIV connected sensor kit is currently available from Mouser paired with the XENSIV PAS CO2 sensor and the XENSIV BGT60TR13C 60 GHz radar sensor.

To learn more about the XENSIV KIT CSK PASCO2 connected sensor kit, visit https://www.mouser.com/new/infineon/infineon-xensiv-pas-co2-connected-sensor-kit/

To learn more about the XENSIV KIT CSK BGT60TR13C connected sensor kit, visit https://www.mouser.com/new/infineon/infineon-xensiv-bgt60tr13c-connected-sensor-kit/.

As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive.

The post Infineon’s XENSIV Connected Sensor Kits, Now at Mouser, Offer Sensor Platform for IoT Device Development appeared first on ELE Times.

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the XENSIV KIT CSK PASCO2 and XENSIV KIT CSK BGT60TR13C connected sensor kits (CSK) from Infineon Technologies AG. The XENSIV connected sensor kits provide a ready-to-use sensor development platform for IoT devices. The CSK platform enables the creation of new prototype ideas based on Infineon sensors, including radar, environmental sensors and others.

Combining sensors, microcontrollers and secure connectivity for a prototype can become a resource-intensive process. The CSK platform solves this issue by combing XENSIV sensors with power-efficient, high-performance processing based on an Infineon PSoC 6 microcontroller. An OPTIGA Trust M security controller enables secure connectivity. The modular board design of the connected sensor kits is compatible with the Adafruit Feather form factor, allowing the user to prototype solutions for various sensor use cases, for example, battery-powered smart home applications.

The XENSIV connected sensor kit is currently available from Mouser paired with the XENSIV PAS CO2 sensor and the XENSIV BGT60TR13C 60 GHz radar sensor.

To learn more about the XENSIV KIT CSK PASCO2 connected sensor kit, visit https://www.mouser.com/new/infineon/infineon-xensiv-pas-co2-connected-sensor-kit/

To learn more about the XENSIV KIT CSK BGT60TR13C connected sensor kit, visit https://www.mouser.com/new/infineon/infineon-xensiv-bgt60tr13c-connected-sensor-kit/.

As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive.

The post Infineon’s XENSIV Connected Sensor Kits, Now at Mouser, Offer Sensor Platform for IoT Device Development appeared first on ELE Times.

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, offers a full suite of online tools for buyers and engineers to simplify the process of selecting and purchasing products. Mouser’s Help Center and Services & Tools allow customers to request data sheets, view and track existing orders, place new orders via API or EDI, and offers additional technical support.

“Mouser is committed to supporting its global customer base, not only with the widest selection of NPI products in the world, but also with a full range of online tools and resources,” said Mark Burr-Lonnon, Mouser’s Senior Vice President of Global Service and EMEA and APAC Business. “Using our Help Center and Services & Tools as guides, both buyers and engineers can more effectively browse and choose the right products to help speed their time to market.”

Modern electronic designs can often involve extensive part lists and multiple purchase orders. Mouser offers numerous Services & Tools to save time and streamline purchasing for buyers, including order automation resources, a Price & Availability Assistant and FORTE, Mouser’s Intelligent BOM Tool. These online resources simplify quoting and purchasing, saving valuable time.

For design engineers, Mouser provides a wealth of online technical resources, including its ECAD Design Library, Conversion Calculators, an extensive library of product data sheets and technical content, as well as detailed product pages with videos, block diagrams and other technical information to assist at any step of the design process.

Mouser’s online Help Center also offers a searchable hub for customer support resources and frequently asked questions. The Help Center allows Mouser customers to create a My Mouser account, leading to simplified ordering and tracking. Mouser’s Help Center also offers quick links for requesting quotes or finding specific parts, saving valuable time when compiling lengthy orders.

As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive.

The post Mouser Tools make it easy to find and choose the right electronic components appeared first on ELE Times.

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, offers a full suite of online tools for buyers and engineers to simplify the process of selecting and purchasing products. Mouser’s Help Center and Services & Tools allow customers to request data sheets, view and track existing orders, place new orders via API or EDI, and offers additional technical support.

“Mouser is committed to supporting its global customer base, not only with the widest selection of NPI products in the world, but also with a full range of online tools and resources,” said Mark Burr-Lonnon, Mouser’s Senior Vice President of Global Service and EMEA and APAC Business. “Using our Help Center and Services & Tools as guides, both buyers and engineers can more effectively browse and choose the right products to help speed their time to market.”

Modern electronic designs can often involve extensive part lists and multiple purchase orders. Mouser offers numerous Services & Tools to save time and streamline purchasing for buyers, including order automation resources, a Price & Availability Assistant and FORTE, Mouser’s Intelligent BOM Tool. These online resources simplify quoting and purchasing, saving valuable time.

For design engineers, Mouser provides a wealth of online technical resources, including its ECAD Design Library, Conversion Calculators, an extensive library of product data sheets and technical content, as well as detailed product pages with videos, block diagrams and other technical information to assist at any step of the design process.

Mouser’s online Help Center also offers a searchable hub for customer support resources and frequently asked questions. The Help Center allows Mouser customers to create a My Mouser account, leading to simplified ordering and tracking. Mouser’s Help Center also offers quick links for requesting quotes or finding specific parts, saving valuable time when compiling lengthy orders.

As a global authorized distributor, Mouser offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive.

The post Mouser Tools make it easy to find and choose the right electronic components appeared first on ELE Times.