ELE Times

In the realm of global technology, India is forging ahead with ambitious plans to enhance its semiconductor or chip manufacturing capabilities. Semiconductors, crucial components in modern electronic devices ranging from smartphones, EVMs, and applications of Artificial Intelligence, etc., are at the heart of India’s strategic initiatives aimed at reducing dependence on imports and establishing itself as a significant player in this pivotal ICT sector.

The  Production Linked Incentive (PLI) scheme extended to the ICT sector including chip manufacturing has been a game changer. It signaled also India’s determination to bolster semiconductor manufacturing., among other things This initiative attracted global giants such as Intel, Samsung, and TSMC, recognizing India’s potential as a lucrative market and manufacturing hub. The prospect of substantial incentives and access to India’s expanding consumer base has spurred a flurry of activity in the semiconductor sector.

Recent advancements underscore notable progress toward India’s semiconductor aspirations. Tata Group is on track to launch commercial production from India’s inaugural semiconductor fabrication unit by 2026, with plans for additional facilities in the pipeline. Samsung’s pledge to invest $8 billion in expanding its semiconductor fabrication facility further underscores India’s appeal for semiconductor production.

Besides, companies like Reliance Jio and Infosys are leveraging their telecommunications and IT services expertise to drive innovation in semiconductor design and manufacturing. This collective effort from both domestic and international stakeholders is propelling India toward semiconductor self-sufficiency and also chip designing. India has a considerable capacity in chip designing and that work has been outsourced to a few software companies. With the prospects of FAB coming up in India, domestic chip-designing companies will have more work.

The Indian government’s proactive stance, through initiatives like the National Electronics Policy and Electronics Manufacturing Clusters (EMC) scheme, is fostering an enabling environment for semiconductor manufacturing. Nevertheless, challenges persist, including environmental concerns surrounding fabrication processes and the necessity for additional policy reforms,  skill development and more importantly capital infusion since semiconductor manufacturing is a highly capital-intensive sector.

Addressing these challenges requires the implementation of sustainable practices and rigorous environmental regulations. Additionally, efforts to streamline regulations, facilitate ease of doing business, and invest in education and vocational training programs are imperative for sustaining India’s semiconductor manufacturing growth. Chip manufacturing is a highly competitive segment, which requires sourcing rare earth, which is hard to find out in India. Countries like China, the Netherlands, and the US are sourcing the high-demand rare earth that goes into chip manufacturing from countries like the Democratic Republic of Congo, Zimbabwe, and Latin American countries. Our embassies and high commissions should play an important role in identifying such locations for sourcing rare earth. Chip-making also requires considerable investment in R&D since the specifications of the chips keep on changing.

Despite these challenges, India’s semiconductor journey holds great promise. With robust government support, strategic investments, and a burgeoning talent pool, India is poised to emerge as a global leader in semiconductor innovation and production. As momentum gathers, India’s semiconductor industry is paving the way for a new era of technological advancement and economic prosperity.

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SiP Includes Wise-integration’s 650V E-Mode Gallium-Nitride (GaN) Transistor Die And Leadtrend’s Silicon Die Flyback Controller

Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power supplies, and Leadtrend Technology Corporation (TWSE stock code: 3588), a specialist in analog and analog-digital mixed-mode IC designs, today announced the release of a GaN system-in-package (SiP) supporting consumer electronics applications.

Their collaboration’s targeted application is a 65-watt USB PD adapter for high-speed charging of smartphones, laptops and other devices. The LD966LGQALVE High Voltage Multi-Mode PWM Controller of Flyback with GaN integrated includes Leadtrend’s silicon die flyback controller and Wise-integration’s 650V e-mode gallium-nitride (GaN) transistor die in a SiP. The SiP has passed 1,000 hours of operating life tests (OLT).

“This SiP enables original design manufacturers (ODM) to develop a less expensive system with fewer components, a smaller printed circuit board and faster system-development time,” said Thierry Bouchet, CEO of Wise-integration. “This collaboration also underscores Leadtrend’s confidence in the breadth and depth of our GaN expertise and the quality of our products.”

­­­The LD966L is green-mode PWMIC built-in with brown-in/out functions of a QFN8X8 package. It minimizes the component count and circuit space, and reduces overall material cost for the power applications. It features HV start, green-mode power-saving operation, soft-start functions to minimize power loss and enhances system performance.

The LD966LGQALVE Evaluation Board features an overall peak efficiency of 93.02 percent and a power density of 22.7 W/in3.  For more information, see: https://www.leadtrend.com.tw/tw/product-page/12/355-ld966L.

Wise-integration has optimized GaN capabilities to make power-electronics technology both greener and more efficient with high-current, high-voltage breakdown and high switching frequency. Its WiseGan® power-integrated circuit (IC) combines several power electronics functions into a single GaN chip for improved speed, efficiency, reliability and cost-effectiveness.

The company opened an office in Taiwan in 2022, and uses 650V GaN/Si technology from Taiwan Semiconductor Manufacturing Co. (TSMC) in its  650V e-mode GaN transistor die with ESD protection.

Wise-integration recently announced the closing of its Series B round of funding totalling €15 million.

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New driver offers tailored turn-on and turn-off timing, minimized switching losses, and
enhanced dV/dt immunity

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, is excited to announce the launch of the IX4352NE Low-side SiC MOSFET and IGBT Gate Driver. This innovative driver is specifically designed to drive Silicon Carbide (SiC) MOSFETs and high-power Insulated Gate Bipolar Transistors (IGBTs) in industrial applications.

The key differentiator of the IX4352NE lies in its separate 9 A source and sink outputs, which enable tailored turn-on and turn-off timing while minimizing switching losses. An internal negative charge regulator also provides a user-selectable negative gate drive bias for improved dV/dt immunity and faster turn-off. With an operating voltage range (VDD – VSS) of up to 35 V, this driver offers exceptional flexibility and performance.

One of the standout features of the IX4352NE is its internal negative charge pump regulator, which eliminates the need for an external auxiliary power supply or DC/DC converter. This feature is particularly valuable for turning off SiC MOSFETs, saving valuable space typically required for external logic level translator circuitry. The logic input’s compatibility with standard TTL or CMOS logic levels further enhances space-saving capabilities.

• on-board and off-board chargers,
• Power Factor Correction (PFC),
• DC/DC converters,
• motor controllers, and
• industrial power inverters.

Its superior performance makes it ideal for demanding power electronics applications in the electric vehicle, industrial, alternate energy, smart home, and building automation markets.

With its comprehensive features, the IX4352NE simplifies circuit design and offers a higher level of integration. Built-in protection features such as desaturation detection (DESAT) with soft shutdown sink driver, Under Voltage Lockout (UVLO), and thermal shutdown (TSD) ensure the protection of the power device and the gate driver. The integrated open-drain FAULT output signals a fault condition to the microcontroller, enhancing safety and reliability. Furthermore, the IX4352NE saves valuable PCB space and increases circuit density, contributing to overall system efficiency.

• A safe DESAT-initiated soft turn-off.
• A thermal shutdown with high threshold accuracy.
• The charge pump’s ability to operate during thermal shutdown.

The new IX4352NE is pin-compatible, allowing for a seamless drop-in replacement in designs that specify the existing Littelfuse IX4351NE, which was released in 2020.

“The IX4352NE extends our broad range of low-side gate drivers with a new 9 A sink/source driver, simplifying the gate drive circuitry needed for SiC MOSFETs,” commented June Zhang, Product Manager, Integrated Circuits Division (SBU) at Littelfuse. “Its various built-in protection features and integrated charge pump provide an adjustable negative gate drive voltage for improved dV/dt immunity and faster turn-off. As a result, it can be used to drive any SiC MOSFET or power IGBT, whether it is a Littelfuse device or any other similar component available on the market.”

The IX4352NE Low-side SiC MOSFET and IGBT Gate Driver are available in tube format in 50 per tube or tape and reel format in quantities of 2,000. Place sample requests through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit Littelfuse.com.

For More Information
Additional information on the latest series release is available on the IX4352NE Low-side SiC MOSFET and IGBT Gate Driver product page. For technical questions, please contact one of the following in the Littelfuse Integrated Circuits Division (SBU):

Hugo Guzman, Product Marketing Manager, HGuzman@Littelfuse.com

Klaus Wiedorn, Sr. Technical Marketing Analyst, KWiedorn@Littelfuse.com

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Cadence has a mission to help solve technology’s toughest challenges to make a lasting, positive impact on our world, highlighting the company’s commitment to environmental stewardship and empowering employees to become ambassadors for sustainability both within and beyond the organization.

The launch of the Mission Sustainable program in 2023 marked an amplification of this commitment by mobilizing employees from every corner of the company to engage in sustainable development actively. This initiative underscores Cadence’s dedication to environmental care and its vision to cultivate a company-wide culture of sustainability champions.

Cadence launched the Mission Sustainable program in 2023 with two key features: the “Live the Brand Sustainably” Quiz and the “Mission Sustainable Ideation Challenge.”

The Live the Brand Sustainably Quiz transformed learning into an exciting competition, deepening employee understanding of Cadence’s ESG efforts and spurring a spirited dialogue around sustainability. This educational contest has significantly bolstered internal engagement with the company’s sustainable vision.

The Mission Sustainable Ideation Challenge harnessed collective creativity by reaching out to our global team to devise innovative solutions in critical sustainability domains such as water conservation, waste reduction, and enhancing supply chain sustainability. Garnering over 150 ideas globally, the challenge culminated in a presentation before Cadence’s leadership, spotlighting the innovation engine driving the company.

A standout project by Indian software architects Gunjan Goel and Naina Dandona, titled “Climate Resilient Software Architecture,” clinched the challenge’s top honor, embodying the inventive spirit Cadence seeks to foster.

Nimish Modi, SVP and GM of Strategy and New Ventures and the executive champion of the program, highlights the foundational belief of Mission Sustainable: “Nurturing sustainability isn’t just a corporate responsibility; it’s a collective endeavor that requires the commitment and passion of every individual. At Cadence, our sustainability initiatives are about reducing our environmental footprint, innovating Cadence technology that delivers sustainability impact for our customers, and empowering our employees to become agents of positive change. Through meaningful engagement and collaboration, we are shaping a more sustainable future for our company and inspiring a broader culture of environmental stewardship.”

The Mission Sustainable challenge has sparked engagement and participation throughout Cadence, encouraging collaboration towards achieving sustainability milestones. Cadence is forging ahead on its sustainability path, leveraging its employees’ diverse talents and innovative thinking, inviting all to be part of a greener, more responsible future.

Read more about Cadence’s environmental, social, and governance programs in the 2023 Cadence ESG Report.

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Anritsu Corporation, a global leader in test and measurement solutions, is excited to unveil its groundbreaking advancements in field testing equipment – the Site Master MS2085A Cable and Antenna Analyzer and the MS2089A with Integrated Spectrum Analyzer. These latest entries to the Anritsu lineup are designed from the ground up to further cement Anritsu’s dominance in the installation and maintenance arena and to also address the multifaceted demands of the general-purpose market. They redefine industry standards for functionality, precision, and user-friendly operation, marking a transformative leap forward in field testing technology.

The Site Master MS2085A and MS2089A encapsulate the pinnacle of modern engineering, combining Anritsu’s extensive experience and commitment to customer-focused innovation. This dual offering merges the functions of cable and antenna analysis with spectrum analysis and monitoring in a seamless, integrated solution. It is tailored to support a wide spectrum of industries, including telecommunications, broadcasting, aerospace, satellite, and defense, facilitating a variety of applications from Distributed Antenna Systems (DAS) and satellite monitoring to interference analysis and routine installation and maintenance tasks.

• Multi-functional Capability: The Site Master’s integration of cable and antenna analysis alongside spectrum analysis equips professionals with a singular, versatile tool for a wide array of testing and analysis needs. It stands as a comprehensive solution for assessing antenna systems, diagnosing wireless networks, or conducting spectrum signal monitoring.
• Operational Efficiency: Merging multiple testing functions into one device, the Site Master significantly optimizes field testing workflows. This consolidation reduces the need for multiple instruments, streamlines testing processes, and allows for greater achievements in shorter timeframes – effectively enhancing productivity while minimizing operational costs.
• Accuracy and Dependability: Engineered for precision and built to withstand rigorous field conditions, the Site Master ensures consistent, reliable outcomes. Its superior measurement accuracy and robust construction instill confidence in every test result, allowing for precise, informed decisions under any circumstances.
• Advanced Features: With features like Real-Time Spectrum Analysis (RTSA), IQ capture and streaming, and PIM hunting, we’re not just meeting industry standards, we’re creating them.

Raymond Chan, Product Manager at Anritsu Corporation, expresses his enthusiasm: “We are thrilled to launch the Site Master MS2085A and MS2089A, signifying a monumental stride in field testing technology. These innovations underscore our dedication to advancing testing and measurement technologies that not only meet but exceed our customers’ evolving requirements across various sectors. They stand as a testament to Anritsu’s unwavering commitment to excellence, setting a new benchmark for field testing proficiency.”

The Site Master MS2085A and MS2089A Analyzers are now available globally. For detailed information on the products and their capabilities, please visit www.anritsu.com.

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The SAMD21RT MCU is offered in 64-pin ceramic and plastic packages with a 10 mm × 10 mm footprint

Space exploration is experiencing a resurgence with exciting new missions like the highly anticipated Artemis II mission, the recent successful lunar landing missions such as JAXA SLIM and Chandaaryan-3, and New Space deployments in Low Earth Orbit (LEO). Designers require electronic components that meet stringent radiation and reliability standards to operate in the harsh environments found in space. Microchip Technology  today announces the SAMD21RT, a radiation-tolerant (RT) Arm Cortex-M0+ based 32-bit microcontroller (MCU) in a 64-pin ceramic and plastic package with 128 KB Flash and 16 KB SRAM.

Designed for space-constrained applications where size and weight are of critical importance, the SAMD21RT is available in a small footprint of 10 mm × 10 mm. Running at up to 48 MHz, the SAMD21RT delivers high-performance processing for harsh environments. The device integrates analog functions including an Analog-to-Digital Converter (ADC) with up to 20 channels, a Digital-to-Analog Converter (DAC) and analog comparators.

The SAMD21RT device builds on Microchip’s existing family of SAMD21 MCUs, which is widely used in industrial and automotive markets. It is also based on Commercial-Off-The-Shelf (COTS) devices, which significantly simplifies the design process when transitioning to a radiation-tolerant device as the design remains pinout compatible. Microchip offers a comprehensive system solution for space applications with many devices that can be designed around the SAMD21RT MCU including FPGAs, power and discrete devices, memory products, communication interfaces and oscillators providing a broad range of options across qualification levels.

To withstand harsh environments including radiation and extreme temperatures, the SAMD21RT can operate in temperatures ranging from −40°C to 125°C and provides a high level of radiation tolerance with a Total Ionizing Dose (TID) capability up to 50 krad and Single Event Latch-up (SEL) immunity up to 78 MeV.cm²/mg.

“The advantage of working with Microchip is that we have the history, knowledge and capability to do the design and testing in house for our radiation-tolerant and radiation-hardened devices,” said Bob Vampola, vice president of Microchip’s aerospace and defense business unit. “We continue to bring newer technologies like Ethernet, AI and ML, which have evolved in the commercial and industrial markets, and improve them with radiation performance to meet the needs of space missions. We also continue to provide higher computing performance and integration of newer technologies into smaller packages, reducing weight and size.”

The low-power SAMD21RT features idle and standby sleep modes and sleepwalking peripherals. Other peripherals include a 12-channel Direct Memory Access Controller (DMAC), a 12-channel event system, various Timer/Counters for Control (TCC), a 32-bit Real Time Counter (RTC), a Watchdog Timer (WDT) and a USB 2.0 interface. Communication options include Serial Communication (SERCOM), I2C, SPI and LIN.

With tens of thousands of parts in orbit, Microchip has been a significant part of space exploration history and is critical to the missions of today and tomorrow. Its products are on the way to the moon as part of the Artemis program and are contributing to the success of the Space Launch System, Orion Spacecraft, Lunar Gateway, Lunar Lander and next-generation spacesuits. To learn more about Microchip’s space heritage, visit the space applications page on the company’s website.

The SAMD21RT 32-bit MCU is supported by the SAM D21 Curiosity Nano Evaluation Kit, MPLAB® X Integrated Development Environment (IDE) and MPLAB PICkit 5 in-circuit debugger/programmer.

The SAMD21RT 32-bit MCU is available in limited sampling upon request. For additional information, contact a Microchip sales representative.

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: flickr.com/photos/microchiptechnology/53641199810/sizes/l

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Authors: Akshat JAIN, STMicroelectronics India, Fabrizio Di FRANCO, STMicroelectronics, Italy, Martin DENDA, Rene WUTTE, STMicroelectronics Austria, Bruno TISSERAND, STMicroelectronics, France

Wireless power is going to introduce significant innovations in kitchens, making them smarter, sleeker and more space-efficient. Appliances from simple low-power juicers to blenders or kettles, and others that require up to 2.2 kW of power will benefit by eliminating power cords thanks to the new standard “Ki Cordless Kitchen” that is set to be released by the Wireless Power Consortium. The key driver of rapid adoption is interoperability. All certified Ki transmitters and appliances will follow defined safety protocols and work with each other, regardless of the brand, device type, or version of Ki they use.

The Ki transmitter can also be considered a smart induction cooktop that will not only power Ki receivers but also operate standard induction utensils like heating a pan. Ki enables smart communication between transmitters and appliances based on Near Field Communication (NFC) providing auxiliary power, bi-directional data paths, advanced control features, authentication and protections (FOD) and it is essential for interoperability. The block diagram of the Ki Cordless Kitchen concept block diagram is highlighted in Figure 1.

STMicroelectronics, a global semiconductor leader serving customers across the wide spectrum of electronics applications, has been participating in the Ki Cordless Kitchen standard since the beginning and is ready with the Ki Cordless Kitchen power transmitter reference design i.e. STEVAL-KITXCB. The reference design consists of a power inverter board, auxiliary power supply board, an NFC board, inverter microcontroller board, a power coil, NFC antenna and GUI display board as shown in Figure 2. Thanks to the modular design approach, it is easy for users to test and debug the various sections involved.

The main power board comprises an inverter stage based on half-bridge topology. The IGBTs during power transfer switch between 26 to 74 kHz. The power inverter board is connected to a power coil and is digitally controlled by the STM32G474RET6 microcontroller, which specifically addresses the needs of digital power conversion applications thanks to the High-resolution timer peripheral and a rich and advanced integrated analog. The NFC communication between the Ki transmitter and Ki receiver is managed by ST25R3916, a high-performance NFC universal device which is mounted on a dedicated daughter card. The NFC antenna is connected to the NFC daughter card. The auxiliary power supply is managed by an off-line flyback circuitry based on VIPer318, high voltage converter ensuring compactness and very low standby consumption to generate 24V DC. The interconnection between the main power inverter board and the daughter cards of the evaluation kit is shown in Figure 3. The inverter stage is based on STGWA50IH65DF trench gate field-stop 650 V IH series IGBT, featuring very low Vcesat and Eoff to ensure high efficiency at high switching frequency and supported by the robust half-bridge gate driver L6491D, provided with high driving current source and sink capability.

The Ki Kitchen standard protocol is managed by a dedicated STM32L476VGT64 microcontroller mounted on an NFC daughter card and it communicates over UART with the STM32G474RET6 microcontroller, which is managing power inverter stage. During startup when the Ki receiver/appliance is brought on top of induction hub the Ki transmitter will supply the initial energy to power the User interface of the appliance through NFC and establish a  communication carrier as shown in Figure 4. And when the Ki receiver/appliance is switched ON (requesting power from the Ki transmitter) from its user interface, then the auxiliary power transfer from NFC stops, and the power inverter of the Ki transmitter transmits the power including auxiliary power to the Ki receiver via the principle of induction.

To prevent interference between NFC and wireless induction power transfer during the power transfer state, the wireless induction power transfer is switched completely off during the mains crossing and NFC becomes active as shown in Figure 4.

Ki receiver vs Induction Utensil (Pan/Pot)

The standard induction utensils are made of ferromagnetic materials. The bottom of an induction utensil (pan/pot) can be treated as an induction coil with one winding and low load resistance where received power is dissipated. So, the power transmitter coil and utensil can be considered a transformer in which the induction utensil acts as a shorted secondary (load). An alternating current is made to flow through the transmitter resonant power coil, which leads to the generation of an oscillating magnetic field. The magnetic field induces an electric current inside the induction utensil.

The Ki receiver mainly consists of a resonant power coil, resonant capacitor, NFC circuitry and Ki receiver/appliance circuitry. For the Ki transmitter the power coil is fixed but for the Ki receivers, the size of the power coil varies depending on the power requirements. To maximize the energy transfer, the Ki receiver must be tuned to the transmitter’s resonant frequency. Now, there will be two resonance points: one of the Ki transmitter and the other of the Ki receiver. To have better efficiency, the transmitter needs to operate at a second resonant frequency, but that doesn’t guarantee the maximum power required by the Ki receiver. To transmit the desired power the Ki transmitter needs to shift to the first resonant frequency. The resonant shift is managed by the STM32G474RET6 microcontroller control algorithm.

To shorten the development time and let customers evaluate products in the final application, STMicroelectronics offers a reference design (STEVAL-KITXCB) for the transmitter and is working on the reference design for the different types of receivers. The hardware design files and firmware source code are available with developer-friendly license terms. For more details, please contact the STMicroelectronics sales office.

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The combined company will bring together two cybersecurity SIEM and UEBA innovation leaders with renowned and demonstrated track records in serving customers with effective threat detection, investigation, and response (TDIR)

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Spectrum Instrumentation presents versatile Python programming for all its 200+ products

Bangalore, India. – 16. May 2024. Spectrum Instrumentation presents a new open-source Python package (“spcm”) that is now available for the current line of all Spectrum Instrumentation test and measurement products. The new package makes the programming of all 200+ instruments, offering sampling rates from 5 MS/s to 10 GS/s, faster and easier. Python, popular for its simplicity, versatility and flexibility, boasts an extensive collection of libraries and frameworks (such as NumPy) that significantly accelerates programming development cycles. The new spcm package allows users to take full advantage of the Python language by providing a high-level Object-Oriented Programming (OOP) interface that is specifically designed for the Spectrum Instrumentation Digitizer, AWG and Digital I/O products. It includes the full source code as well as a number of detailed examples. Available on GitHub, spcm is free of charge under the MIT license.

Spectrum’s Python package safely handles the automatic opening and closing of cards, groups of cards and Ethernet instruments, as well as the allocation of memory for transferring data to and from these devices. All the device specific functionality is capsulated in easy-to-use classes. This includes clock and trigger settings, hardware channel settings, card synchronization, direct memory access (DMA) and product features such as Block Averaging, DDS and Pulse Generator.

The package supports the use of real-world physical quantities and units (e.g. “10 MHz”) enabling the user to directly program driver settings in their preferred unit system. This removes the need for tedious manual conversions to cryptic API settings. Moreover, this package also includes support for calculations with NumPy and Matplotlib, allowing the user to handle data coming from, or going to, the products with the vast toolbox provided by those packages. Detailed examples can be found in the GitHub repository.

Installing the package is easy, thanks to its availability in the pip repository. Simply install Python and then the package with a single command: $ pip install spcm

Users can include the Spectrum Instrumentation Python package in their own programs, or fork to the repository to add more functionality. The package is directly maintained by Spectrum engineers and updates are released regularly offering bug-fixes and new features.

The example in the photo shows the opening of the first analog-output card (AWG) and programming of a simple 10 MHz sine-wave output using the DDS option.

The Spectrum Python repository is found under: https://github.com/SpectrumInstrumentation/spcm

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By 2026, 80% of Large Software Engineering Organizations Will Establish Platform Engineering Teams, up from 45% in 2022

Gartner, Inc. announced the top five strategic technology trends in software engineering for 2024 and beyond. Analysts presented these findings during the Gartner Application Innovation & Business Solutions Summit, which is taking place here through today.

Meeting business objectives is one of their top three performance objectives for 65% of software engineering leaders, according to a Gartner survey of 300 software engineering and application development team managers in the U.S. and UK in the fourth quarter of 2023. By investing in disruptive technologies, software engineering leaders can empower their teams to meet business objectives for productivity, sustainability and growth.

“The technology trends Gartner has identified are already helping early adopters to achieve business objectives, “said Joachim Herschmann, VP Analyst at Gartner. “These disruptive tools and practices enable software engineering teams to deliver high-quality, scalable AI-powered applications, while reducing toil and friction in the software development life cycle (SDLC), improving developer experience and productivity.”

The top five strategic technology trends for software engineering for 2024 are-

• Software Engineering Intelligence

Software engineering intelligence platforms provide a unified, transparent view of engineering processes that helps leaders to understand and measure not only velocity and flow but also quality, organizational effectiveness and business value.

Gartner predicts by 2027, 50% of software engineering organizations will use software engineering intelligence platforms to measure and increase developer productivity, compared to 5% in 2024.

• AI-Augmented Development

Software engineering leaders need a cost-effective way to help their teams build software faster. According to the Gartner survey, 58% of respondents said their organization is using or planning to use generative AI over the next 12 months to control or reduce costs.

AI-augmented development is the use of AI technologies, such as generative AI and machine learning, to aid software engineers in designing, coding and testing applications. AI-augmented development tools integrate with a software engineer’s development environment to produce application code, enable design-to-code transformation and enhance application testing capabilities.

“Investing in AI-augmented development will support software engineering leaders in boosting developer productivity and controlling costs and can also improve their teams’ ability to deliver more value,” said Herschmann.

• Green Software Engineering

Green software engineering is the discipline of building software that is carbon-efficient and carbon-aware. Building green software involves making energy-efficient choices for architecture and design patterns, algorithms, data structures, programming languages, language runtimes and infrastructure.

Gartner predicts by 2027, 30% of large global enterprises will include software sustainability in their non-functional requirements, up from less than 10% in 2024.

The use of compute-heavy workloads increases an organization’s carbon footprint, and generative AI-enabled applications are especially energy-intensive, so implementing green software engineering will help organizations prioritize their sustainability objectives.

• Platform Engineering

Platform engineering reduces cognitive load for developers by offering underlying capabilities via internal developer portals and platforms that multiple product teams can use. These platforms provide a compelling “paved road” to software development, which saves time for developers and improves their job satisfaction.

Gartner predicts that by 2026, 80% of large software engineering organizations will establish platform engineering teams, up from 45% in 2022.

• Cloud Development Environments
  Cloud development environments provide remote, ready-to-use access to a cloud-hosted development environment with minimal effort for setup and configuration. This decoupling of the development workspace from the physical workstation enables a low-friction, consistent developer experience and faster developer onboarding.

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Save space and ease integration in car body electronics, audio systems, and inverter gate drivers

STMicroelectronics has introduced new automotive-qualified step-down synchronous DC/DC converters that save space and ease integration in applications including body electronics, audio systems, and inverter gate drivers.

The A6983 converters offer flexible design choices, comprising six non-isolated step-down converters in low-consumption and low-noise configurations and the A6983I isolated buck converter. With compensation circuitry on-chip, these highly integrated monolithic devices need only minimal external components including filtering, feedback, and a transformer with the A6983I.

The non-isolated A6983 converters can supply up to 3A load current and achieve 88% typical efficiency at full load. The low-consumption variants (A6983C) are optimized for light-load operation, with high efficiency and low output ripple, to minimize drain on the vehicle battery in applications that remain active when parked. The low-noise A6983N variants operate with constant switching frequency and minimize output ripple across the load range for optimum performance in applications such as audio-system power supplies. Both types offer a choice of 3.3V, 5.0V, and adjustable output voltage from 0.85V to VIN.

The A6983I is a 10W iso-buck converter with primary-side regulation that eliminates the need for an optocoupler. Ideal for use as an isolated gate driver for IGBTs or silicon-carbide (SiC) MOSFETs in traction inverters and on-board chargers (OBCs), this converter allows accurate adjustment of the primary output voltage. The transformer turns ratio determines the secondary voltage.

All isolated and non-isolated variants have a low quiescent operating current of 25µA and a power-saving shutdown mode that draws less than 2µA. The input-voltage range from 3.5V to 38V, and load-dump tolerance up to 40V, prevent disruption due to transients on the main supply bus. There is also output overvoltage protection, thermal protection, and internal soft start. In addition, optional spread-spectrum operation helps lower electromagnetic interference (EMI) for noise-sensitive applications, and a power-good pin that enables power sequencing. The A6983I and A6983 allow synchronization to an external clock.

The converters are offered in a 3mm x 3mm QFN16 package. Pricing starts at $1.75 for the A6983 and $1.81 for the A6983I, for orders of 1000 pieces, and free samples of the A6983 and A6983I are available from the ST eStore. The STEVAL-A6983CV1 and STEVAL-A6983NV1 A6983 evaluation boards and STEVAL-L6983IV for the A6983I are available to kickstart development and accelerate project completion.

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Greencore Electronics is making significant strides in the automotive space with its products. By focusing on smart mobility solutions like hybrid and electric vehicles, autonomous driving, and connected cars, Greencore demonstrates a forward-thinking approach to addressing the evolving needs of the automotive market while contributing to sustainability efforts. Having an in-house research and development department speaks volumes about the company’s dedication to innovation and quality assurance. It ensures that their products meet and exceed market standards, reinforcing their reputation for reliability and durability.

Overall, Greencore Electronics Pvt. Ltd. is making commendable efforts to provide comprehensive and cutting-edge solutions for various automotive needs, from convenience to safety to environmental sustainability.

Rashi Bajpai, Sub-Editor at ELE Times interacted with Mr Pavan Puri, Founder and Managing Director at Greencore Electronics about their services and products.

This is an excerpt from the conversation.

ELE Times: Brief us on your product catalogue, specifying their applications and customer base.

Pavan Puri: Our product portfolio includes a fast car phone USB charger, a 3-in-1 charging cable, a door handle scratch guard with a universal design and size to fit most automobiles, and a car charger extension cable for rear seat charging. Furthermore, the shark-fit antenna allows for simple and painless installation with no drilling necessary. We also have a powerful car vacuum cleaner for both wet and dry debris, as well as a car air purifier ionizer with two ports for superior air quality. The single DIN audio system (12V) with a remote control battery and puncture repair kit repairs the tire in less than ten minutes.

The customer base for automotive electronic products includes both automotive manufacturers and end consumers. Manufacturers purchase these systems to integrate into vehicles, while end consumers (car buyers) benefit from features such as ADAS, infotainment systems, telematics, wireless connectivity, and electric/hybrid vehicle systems.

ELE Times: In light of the Make in India initiative that is driving India towards self-reliance and sustainability, how is Greencore contributing towards the same through its expertise in automotive electronics?

Pavan Puri: As a leading automotive electronics company, Greencore is committed to supporting India’s Make in India initiative by leveraging our expertise in developing innovative and sustainable automotive solutions. Recently, we took a significant step towards this goal by launching India’s first Made-in-India car vacuum cleaner. This initiative aligns perfectly with the Made-in-India initiative, as it not only demonstrates our commitment to self-reliance but also contributes to the sustainability goals of the nation.

In addition to helping the Indian economy, we are ensuring that our products are of the best quality and at an affordable price for Indian customers. Furthermore, these endeavours aid in India’s pursuit of becoming a global manufacturing hub.

ELE Times: Greencore develops cutting-edge solutions in the automotive electronics sector. What core technologies and innovations are you currently working on?

Pavan Puri: At Greencore, we’re currently focused on several essential technologies and innovations to enhance the driving experience. Our primary focus is on developing a comprehensive connected infotainment system that seamlessly integrates with other vehicle systems. We’re also working on advanced 360-degree camera systems to enhance safety and improve the driver’s visibility.

Additionally, our radar sensors are being optimized for ADAS (Advanced Driver Assistance Systems) vehicles to provide reliable collision detection and avoidance capabilities. To further support the growth of electric vehicles, we’re developing telematics tracking systems and fast charging ports for both commercial vehicles (CV) and electric vehicles (EV), ensuring efficient and convenient charging solutions.

ELE Times: Help us understand the application areas of automotive electronics in today’s times.

Pavan Puri: Automotive electronics play an important part in modern vehicles, contributing to their operation, safety, and efficiency. Automotive electronics applications include Advanced Driver Assistance Systems (ADAS), which use sensors and cameras to give features such as adaptive cruise control, lane departure warning, and automatic emergency braking to make driving safer. Infotainment systems provide entertainment, navigation, and connectivity through touchscreen displays, GPS navigation, and Bluetooth connectivity.

In addition, telematics systems use telecommunications and GPS to offer services like car tracking, remote diagnostics, and emergency support. Also, wireless connectivity, such as Wi-Fi, Bluetooth, and cellular connectivity, enables the seamless integration of smartphones and other devices, improving the overall driving experience and convenience.

ELE Times: Give us some insights into your R&D process and goals. Also, shed some light on Greencore’s vision for the next decade.

Pavan Puri: Our R&D process is deeply rooted in innovation, safety, and reliability. Our goal is to develop cutting-edge electronic systems that enhance vehicle performance, safety, and efficiency, as we prioritize detailed testing, validation, and development before launching any product. Our rigorous testing procedures ensure that our products meet the highest safety standards and comply with government regulations. Certifications are obtained as per government norms to guarantee the safety and reliability of every product we bring to market.

Greencore’s goal for the next decade involves continued breakthroughs in vehicle electronics, with an emphasis on sustainability, connectivity, and autonomous driving technology. We are dedicated to pushing the frontiers of innovation while emphasizing security as well as reliability in all of our operations.

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Rohde & Schwarz extends its portfolio with a 2U high oscilloscope/digitizer tailored for rack mount and other applications where a low-profile form factor is critical. The new MXO 5C series is the company’s first oscilloscope without an integrated display. It delivers the same peformance as the previously introduced MXO 5 series, but with a fourth of the vertical height.

Rohde & Schwarz introduces the new MXO 5C oscilloscope with four or eight channels. The new series is based on the next-generation MXO 5 oscilloscope and specifically addresses rack mount and automated test system applications where users are often confronted with space limitations. The instrument’s 2U vertical height – just 3.5” or 8.9 cm – allows engineers to deploy it in test systems where a traditional oscilloscope with a large display would not fit. The compact form factor is also of value in applications with high channel density where users need a large number of channels in a small volume. Users operate the instrument via the integrated web interface, or they interact with it exclusively programmatically and use the instrument as a high-speed digitizer.

Like other MXO oscilloscopes, the new MXO 5C series builds on next-generation MXO-EP processing ASIC technology developed by Rohde & Schwarz. It offers the fastest acquisition capture rate in the world of up to

4.5 million acquisitions per second. This makes it the world’s first compact oscilloscope that allows engineers to capture up to 99% real-time signal activity enabling them to see more signal details and infrequent events better than with any other oscilloscope.

Philip Diegmann, Vice President Oscilloscopes at Rohde & Schwarz, said: “While oscilloscopes with large displays work well for bench usage, we’ve had a number of customers ask for a version that is tailored for rack mount applications. At the same time, we have customers who need a large channel count, for example in physics. With the MXO 5C we created a unique instrument that offers the best possible performance for both scenarios.” The new form factor allows to place many channels in close proximity. The eight-channel model of the MXO 5C provides a channel density of 1500 cm3 per channel and consumes just 23 watts per channel.

While primarily designed for rack mount usage, the instrument doubles as a stand-alone bench oscilloscope. Users can simply attach an external display via the built-in DisplayPort and HDMI connectors, or they can

access the instrument’s GUI via a web interface by typing in the oscilloscope’s IP address into their browser. As the first oscilloscope to offer E-ink display technology, the MXO 5C shows the IP address and other critical information on a small non-volatile display on the front of instrument, which stays visible even when power is switched off.

Like the MXO 5, the MXO 5C series comes in both four and eight channel models, in bandwidth ranges with100 MHz, 200 MHz, 350 MHz, 500 MHz, 1 GHz, and 2 GHz models. The starting price of EUR 18 000 for the eight-channel models sets a new industry standard. Various upgrade options are available to users with demanding application needs, such as 16 digital channels with a mixed-signal oscilloscope (MSO) option, an integrated dual-channel 100 MHz arbitrary generator, protocol decode and triggering options for industry-standard buses and a frequency response analyzer to enhance the capabilities of the instrument.

The new MXO 5C series oscilloscopes are now available from Rohde & Schwarz and selected distribution channel partners. For more information on the instrument, visit :

https://www.rohde-schwarz.com/product/MXO5C

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Infineon Technologies AG introduces the new XENSIV TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

All products in the XENSIV TLE49SR family withstand stray magnetic fields of up to 8 mT. The sensors exceed the requirements of ISO11452-8 level IV for car hybridization and electrification with 4000 A/m (equal to 5 mT) for inhomogeneous stray field and eliminate the need for external shielding.

The intrinsic accuracy of the sensors defines an angle error with less than 1°. By using a look-up table, the angle error can be reduced even further: Multi point calibration (16 variable and 32 equidistant) results in an angle error below 0.5°. This feature helps to compensate angle deviations resulting e.g. from mechanical misalignments of the manufacturing process.

The angle sensors were developed according to ISO 26262 as a “safety element out of context”. The ASIL C metric on component level enables system designs up to functional safety level ASIL D.

The first products of the new XENSIV TLE49SR angle sensor family are available now with either PWM, SENT or SPC interface. For surface mounting, they are supplied in a TDSO-8 package. Further information is available at www.infineon.com/angle-sensors/tle49srx8/.

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Over the last decades, Mean Well has become one of the most recognisable global providers of power supply modules and converters. However, its product range also includes a broad selection of other solutions, such as KNX equipment for building automation systems.

The assortment described below includes modules compatible with the KNX system, i.e. a standard applied in home and industrial automation systems. They are used to control diverse consumers, for example actuators, motors or components with DALI interfaces for typical illumination systems. Mean Well offers numerous universal solutions for control, but also for the designing and scaling of KNX systems.

KNX is an open source, international standard for building automation systems that facilitates the control of illumination systems, actuators (gates, shutters, electromagnetic locks), ventilation/air conditioning systems (HVAC in its broadest sense), as well as monitoring or alarm systems (including anti-intrusion systems). A range of KNX-compatible consumer electronics products and white goods are now available. As a result, various complex systems can be created, managed, documented and diagnosed using dedicated software.

The first group of KNX-compatible products offered by Mean Well includes two series of power supply modules, namely KNX-20e and KNX-40e, both designed to supply diverse consumers, mostly drivers connected to the KNX networks (30 V DC output and power up to 38.4 W). They operate at standard mains voltage (180–264V AC) or direct current sources (e.g. 254–370 V DC).

The LCM and PWM series encompasses products for LED illumination systems. These are panel-mounted, constant-current (LCM, 350–1050 mA or 500–1400 mA) or constant-voltage products (PWM, 12–48 V DC). They simplify system design by eliminating the need to install additional gates for controllers, as the units can directly activate and control consumers such as LED strips, lamps or lanterns (within the basic range). The converter power rating is up to 200 W (selected models).

Note also that, in addition to their basic functionality, all these KNX-compatible converters ensure mutual synchronisation of operation and remote monitoring of power supply parameters (voltage, current, energy consumption).

Apart from power supply modules, Mean Well provides a range of drivers, interfaces and other auxiliary devices used to design KNX systems. They are suitable for DIN rail mounting (35 mm), which further expands their range of application, even when it comes to retrofitting work on existing systems.

The first product group includes basic drivers, i.e. relay drivers used to actuate motors, actuators, heaters, solenoid valves, etc. They feature eight channels and contacts with current-carrying capacity of 10 A or 16 A. They provide the simplest solution for remote control of consumers. As far as devices designed for LED illumination are concerned, they can additionally be used to dim the lights, for example to control their intensity and activate them with a gradual brightness enhancement effect (linear or logarithmic mode). This functionality is fully integrated with the driver circuit to use the same power source, which greatly simplifies installation/wiring.

In the table above, you can see elements used to design and scale KNX networks. As the name suggests, a KNX-USB interface provides network access via any desktop computer/laptop equipped with a USB module. Such connections may be required for programming or diagnostic purposes, e.g. to adjust single controller settings. A universal serial interface can also be used to integrate a less typical device with a KNX system, e.g. a single-board computer to be configured as a remote access/control gateway. The switch/repeater comes with two RJ-45 sockets to facilitate connecting or extending network “branches” in a manner eliminating conflicts and interferences thanks to galvanic port insulation and to filtering telegrams (packages) in line with a specific hierarchy which the user can define.

An Ethernet-KNX router makes it possible to use a LAN infrastructure (and also, indirectly, the wireless WLAN infrastructure) to support a KNX system. Such a solution comes particularly handy in areas where routing new cable runs would require refurbishment work, as well as in system modernisation, servicing and scaling. The router is configured via an interface that is accessible from a web browser.

KNX is a powerful, but still generic standard for control/automation system communication and organisation. Therefore, in various set-ups, it may be necessary to integrate it with much more specialised solutions, such as the DALI interface(Digital Addressable Lighting Interface) used in the field of illumination system design. For example, DLC-02-KN is a gate with an output to two DALI-2 buses to operate a total of 128 control devices (ECG, Electronic Control Gear). Therefore, even very complex illumination systems (residential interiors, offices, and façade/architectural illumination systems) can be integrated with a broader-purpose building automation system. DALI gates ensure access to the diverse capabilities offered by this interface (e.g. RGBW LED strip colour and intensity adjustment, dimming/brightening rate setting, etc.), while also simplifying the presetting of individual functions and entire arrangement programmes which a user can activate via any available interface (smartphone app, wall switch, automatic/timer triggering).

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications is among the early changemakers in the ongoing sustainability issue. The company has been consciously adopting environment-friendly norms and practices and has also charted out its plan for achieving carbon neutrality by 2027. ST has been forward-looking in establishing an ecosystem where business and technology stay relevant and focused on sustainability even under lingering geopolitical and economic disturbances. They are building sophisticated and cutting-edge systems and inculcating best practices within the organization with the utmost understanding of the fact that environmental awareness is its own reward in the semiconductor industry.

ST published its annual Sustainability Report 2024 that delves into insights into its 2023 performance on the ESG markers.

Rashi Bajpai, Sub-Editor at ELE Times spoke with Mr Jean-Louis Champseix, Group Vice President, Corporate Sustainability at STMicroelectronics, on the subject of carbon neutrality and the many aspects of sustainability that ST works upon actively.

ELE Times: Give insights into your vision and sustainability goals at a time when talks on climate change and the environment have taken centre stage on a global platform.

Jean-Louis Champseix: Sustainability is not just a corporate responsibility, but a core component of our value proposition delivering benefits to our company, our customers, and to society.

We believe that technology has a critical role to play in addressing the environmental, social, and economic challenges facing our world today. We are committed to developing innovative technologies and products that enable the transformation of our economies and societies through digitalization, smarter mobility, and decarbonization.

The company’s approach to sustainability is designed to mitigate risks, capitalize on opportunities presented by the global shift towards a more sustainable economy, and build a resilient business that can thrive in an ever-changing world.

And while climate change and environmental topics at large are at the heart of many sustainability-related discussions, sustainability encompasses not only environmental conservation efforts but also addresses social issues.

This is why ST is dedicated to upholding the highest standards of labor practices, ensuring the health and safety of its employees, and engaging in community development.

ELE Times: How does a giant like ST bring out positive results in tackling sustainability and climate goals? What steps has ST taken to ensure the organization remains driven towards attaining sustainability in all areas?

Jean-Louis Champseix: Our sustainability journey started 30 years ago. Since our first environmental policy back in 1993, we have built, step by step, a robust sustainability strategy endorsed by our top management and supported by ambitious goals and a culture of continuous improvement.

There are at least two success factors.

• First, we embed more and more sustainability into our operations at all levels. The corporate environmental team is responsible for developing programs and procedures that enable us to work towards our environmental objectives. These are implemented by local sustainability committees, each of which develops a roadmap according to the needs of their respective sites. Our manufacturing sites each have an Environment, Health and Safety (EHS) steering committee responsible for implementing the environmental policy. We also launched a program to embed sustainability in each step of business strategy, planning, and decision-making. This is supported by accelerator workstreams to facilitate cross-organization collaboration in priority areas.
• Secondly, we consider transparency a must. This is why we have been publicly reporting our target as well as our performance for 27 years. Additionally, socially Responsible Investment (SRI) rating agencies, analysts and investors regularly request detailed feedback on a wide range of Environmental, Social and Governance (ESG) topics to evaluate our corporate behavior and performance. Participating in these evaluations gives us an opportunity to assess our performance within a wider context, benchmark ST against our peers and identify areas for further improvement. It also enables us to monitor investment trends and identify new risks and opportunities. These evaluations have resulted in ST’s inclusion in leading sustainability indices and rankings.

ELE Times: What have been the major challenges that ST had to overcome in the last decade to achieve a significant result in 2023? Also, highlight the top achievements in your journey towards building a more sustainable future for ST globally.

Jean-Louis Champseix: Over the last 28 years, from 1994 to 2023, we have succeeded in drastically mitigating our environmental impact per unit of production. Here are some key figures:

• -84% of perfluorinated compounds (PFC) emissions
• -76% of water consumption
• -56% of electricity consumption
• +336% of waste recycled.

As for the last decade, we have made remarkable progress in many areas, from climate action to safety.  Let’s look at responsible mineral sourcing. Responsible sourcing means companies can identify the origin of the metals contained in electronic components and ensure their extraction, transport, or trade are not associated with serious abuses related to people, working conditions, or the environment, or with bribery and money laundering. We went from 18.5% of ST products free from conflict minerals in 2012 to 100% over the last few years.

We are also proud of being among the best in class when it comes to ensuring a safe working environment to our employees. Through the collective efforts of our sites, we maintained strong safety performance results in 2023: our employee recordable injury case rate was 0.10, better than our target of 0.13.

Our journey is far from over: we intend to continually improve our performance in all areas of Sustainability.

ELE Times: Help us understand the sustainability strategy and business model that ST has adopted.

Jean-Louis Champseix: Throughout our value chain, we have integrated sustainability into our business model. We have implemented numerous programs to effectively manage our impacts, opportunities, and risks, ensuring that sustainability remains at the forefront of our operations and activities.

Our guiding principles and 24 sustainability goals are detailed in our sustainability charter. This is endorsed by Jean-Marc Chery, our President and CEO. Our progress towards these annual, 2025 and 2027 goals are described in our latest Sustainability report, with a focus on transparency.

In our business model, we leverage our expertise in the semiconductor industry to serve sectors that are pivotal for a sustainable future, such as renewable energy, electric vehicles, and smart grid technologies. The company also maintains a strong commitment to ethical business practices, transparency, and corporate social responsibility. By integrating these principles into its core operations, ST aims to not only achieve financial success but also to foster positive environmental and social outcomes, aligning with the broader goals of sustainable development.

ELE Times: ST has committed to achieving carbon neutrality by 2027. Please elaborate on the Plan of Action.

Jean-Louis Champseix: In 2020, we announced our commitment to becoming carbon neutral by 2027 on scope 1 and 2, and partially scope 3. Our carbon neutrality program comprises five main workstreams:

• reducing as much as technically possible our direct emissions, that represented more than 50% of our total emissions, through perfluorinated compounds (PFC) abatement systems
• investing in energy savings, in particular in our manufacturing sites where many energy-saving initiatives are implemented,
• using renewable energies to reach 100% of electricity coming from renewable sources in 2027,
• minimizing all our indirect emissions by optimizing product transportation, business travels and employee commuting,
• sustainable sequestration of what cannot be avoided at the end of our roadmap through credible offsetting programs.

The programs in place at all our manufacturing sites address our direct and indirect emissions in accordance with scopes 1, 2, and partially 3 of the GHG Protocol. In 2023, we continued our progress towards carbon neutrality, with –45% of scopes 1 & 2 (versus 2018) and reaching 71% of renewable electricity sourcing.

More information on ST’s sustainability efforts can be found at https://www.st.com/content/st_com/en/about/sustainability.html

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The semiconductor industry is experiencing a profound transformation, propelled by technological advancements, market dynamics, and global initiatives. In India, this transformation is particularly significant, as the nation emerges as a key player in the semiconductor landscape. Let’s delve into the mega trends shaping the semiconductor industry in 2024, the career opportunities they present, and the role of the Electronics Sector Skills Council of India (ESSCI) in preparing professionals for this dynamic field.

Semiconductor Applications Across Diverse Fields:

Semiconductor chips serve as the fundamental building blocks powering a vast array of applications, wielding control over power management, enabling intricate power electronics systems, and orchestrating indispensable functions within electronic devices. From the ubiquitous smartphones and computers to the intricate network of IoT devices, semiconductor chips form the backbone, fuelling innovation and driving the seamless integration of technology into our daily lives.

• Driving Automotive Innovation: Semiconductor technology has spearheaded transformative advancements in the automotive sector, ushering in a new era of intelligent and dependable vehicles. By seamlessly integrating semiconductor components, automobiles have evolved to possess heightened intelligence, unparalleled reliability, and superior performance. Advanced Driver Assistance Systems (ADAS) rely on semiconductor solutions for critical features such as collision avoidance, lane departure warning, and adaptive cruise control.

• Revolutionizing Telecommunications: Semiconductor innovation is at the forefront of transforming the telecommunications landscape. With the emergence of 5G networks, semiconductor solutions are crucial for powering base stations, antennas, and network infrastructure, enabling faster data speeds, lower latency, and unparalleled connectivity. In addition to network infrastructure, semiconductor chips are integral to the development of smartphones, enabling advanced features such as AI-driven cameras, augmented reality, and facial recognition.
• Empowering Healthcare Technologies: Semiconductor technology is revolutionizing healthcare by driving advancements in medical diagnostics and patient care. Medical imaging devices, including MRI and CT scanners, heavily rely on semiconductor components for signal processing and image reconstruction, enabling precise diagnostics and treatment planning. Semiconductor chips also power medical monitoring devices such as wearable fitness trackers and smart health monitors, allowing for continuous health tracking and remote patient monitoring.
• Transforming Hearables and Wearables: The integration of semiconductor technology has led to remarkable advancements in hearable and wearable devices, revolutionizing the way we interact with technology. Hearables, such as wireless earbuds and smart headphones, leverage semiconductor chips for Bluetooth connectivity, noise cancellation, and audio processing, delivering immersive audio experiences. Similarly, wearable devices, including smartwatches and fitness trackers, rely on semiconductor solutions for sensors, data processing, and connectivity, enabling seamless health and activity tracking.

Career Opportunities in Semiconductor Technology:

As the semiconductor industry evolves in response to these mega trends, it creates exciting career opportunities for professionals across the value chain – designing, fabrication and packaging. From semiconductor design and manufacturing to research and development, there is a growing demand for skilled professionals who can innovate and drive technological advancements in the industry. The sector is expected to see more than 800,000 to 1 million job openings over the next five years, says staffing company Randstad. The government recently approved $15 billion worth of investments into the sector including from the Tata group. India’s burgeoning semiconductor sector is facing a surge in demand for talent, fuelled by new investments and the government’s ambitious plan to transform the country into a chip manufacturing hub.

1. Semiconductor Design Engineer: Semiconductor design engineers play a crucial role in developing the architecture and circuitry of semiconductor chips. They utilize tools like Electronic Design Automation (EDA) software and simulation tools to design and optimize chip layouts for performance, power efficiency, and manufacturability.
2. Process Engineer: Process engineers are responsible for developing and optimizing semiconductor manufacturing processes. They work closely with equipment vendors and manufacturing teams to ensure the smooth operation of semiconductor fabrication facilities, improve yield rates, and reduce production costs.
3. Research Scientist: Research scientists in the semiconductor industry focus on exploring new materials, devices, and technologies to push the boundaries of semiconductor innovation. They conduct experiments, analyse data, and collaborate with cross-functional teams to develop next-generation semiconductor solutions.
4. Material Engineers – Material engineers in the semiconductor industry are pivotal in researching, selecting, and optimizing the materials used in semiconductor device fabrication. Their expertise spans a wide range of materials, including silicon, gallium arsenide, and various compound semiconductors. Material engineers work closely with semiconductor design teams to ensure that the chosen materials meet the performance requirements of the intended applications while also considering factors such as cost, scalability, and reliability.
5. Product Marketing Manager: Product marketing managers play a vital role in bringing semiconductor products to market. They conduct market research, develop marketing strategies, and collaborate with sales teams to promote semiconductor products and drive revenue growth.
6. Quality Assurance Engineer: Quality assurance engineers ensure that semiconductor products meet the highest standards of quality and reliability. They develop and implement test plans, conduct performance testing, and analyse data to identify and address any issues or defects in semiconductor products.
7. Packaging experts: Packaging experts in the semiconductor industry are instrumental in developing and implementing packaging solutions that safeguard semiconductor chips. Their role entails meticulous selection of packaging materials, designing efficient packaging structures to ensure protection against environmental factors and mechanical stresses, and optimizing designs for thermal management and electrical performance. They collaborate closely with design and manufacturing teams to ensure that packaging solutions meet stringent industry standards while balancing factors such as cost-effectiveness and manufacturability.
8. Machine maintenance technicians –Machine maintenance technicians also play a crucial role in implementing preventive maintenance schedules, identifying opportunities for equipment upgrades or optimizations, and ensuring compliance with safety regulations and operational standards. Their expertise contributes to the overall efficiency and longevity of semiconductor manufacturing operations.
9. Safety protocol checkers – These people are integral to maintaining a safe and secure work environment within semiconductor manufacturing facilities. They are responsible for enforcing safety regulations, conducting regular inspections to identify potential hazards, and implementing corrective measures to mitigate risks and prevent accidents. Safety protocol checkers also play a vital role in developing and implementing safety training programs, conducting safety audits, and promoting a culture of safety awareness among employees. Their diligence and vigilance help to safeguard the well-being of personnel, protect semiconductor manufacturing equipment, and maintain the integrity of semiconductor processes.

Qualifications: National Occupational Standards by ESSCI

As the field becomes more specialized, advanced degrees or skill training provide a competitive edge. Specialized qualifications like IC Package, VLSI Design, and Package Design enhance a designer’s expertise. As on date ESSCI has developed 25 NSQF aligned and approved qualifications on semiconductors (Design, Packaging & Manufacturing segment) and is also planning to develop more qualifications as per the need & demand of the industry especially on the Clean Room, Machine Maintenance and other related fragments, which are the need of the hour.

Short Term Qualifications & Upskilling NOS’s

ESSCI offers focused a range of qualifications covering the complete value chain of the semiconductor industry. Short Term courses such as VLSI Design Engineer, concentrating on designing SOC-module functions using software, Embedded Full Stack Engineer, IoT Hardware Analyst are some of the top courses offered for pursuing engineering graduates to gain the knowledge of EDA Tools and system design. ESSCI also provides qualifications for Wafer Back Grinding Engineer and Wafer Dicing Engineer, specialising in wafer manufacturing tasks which can be taught to ITI / Diploma students.

ESSCI also has foundation / upskilling courses in the field of Nano Science & Advance Nano Science which is also in great demand.

Also, there are some basic courses on the Industrial Safety – Electrical & Hazchem which are very crucial & important for the industrial safety requirements. The complete list of our qualifications along with their model curriculum are all uploaded on our website – https://essc-india.org/qualification-packs.php In conclusion, the semiconductor mega trends present unprecedented opportunities for India to assert its leadership in the global semiconductor industry. Through strategic investments, policy support, and talent development initiatives, India is poised to capitalize on these trends, driving innovation, fostering entrepreneurship, and creating a thriving semiconductor ecosystem for generations to come.

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Fourth-Generation Device Enables Higher Power Ratings and Density Versus D²PAK While Lowering Conduction and Switching Losses to Increase Efficiency

To provide higher efficiency and power density for telecom, industrial, and computing applications, Vishay Intertechnology, Inc. today introduced its first fourth-generation 600 V E Series power MOSFET in the new PowerPAK 8 x 8LR package. Compared to previous-generation devices, the Vishay Siliconix n- channel SiHR080N60E slashes on-resistance by 27 % and resistance times gate charge, a key figure of merit (FOM) for 600 V MOSFETs used in power conversion applications, by 60 % while providing higher current in a smaller footprint than devices in the D²PAK package.

Vishay offers a broad line of MOSFET technologies that support all stages of the power conversion process, from high voltage inputs to the low voltage outputs required to power the latest high tech equipment. With the SiHR080N60E and other devices in the fourth-generation 600 V E Series family, the company is addressing the need for efficiency and power density improvements in two of the first stages of the power system architecture — power factor correction (PFC) and subsequent DC/DC converter blocks. Typical applications will include servers, edge computing, super computers, and data storage; UPS; high intensity discharge (HID) lamps and fluorescent ballast lighting; telecom SMPS; solar inverters; welding equipment; induction heating; motor drives; and battery chargers.

Measuring 10.42 mm by 8 mm by 1.65 mm, the SiHR080N60E’s compact PowerPAK 8 x 8LR package features a 50.8 % smaller footprint than the D²PAK while offering a 66 % lower height. Due to its top-side cooling, the package delivers excellent thermal capability, with an extremely low junction to case (drain) thermal resistance of 0.25 °C/W. This allows for 46 % higher current than the D²PAK at the same on-resistance level, enabling dramatically higher power density. In addition, the package’s gullwing leads provide excellent temperature cycle capability.

Built on Vishay’s latest energy-efficient E Series superjunction technology, the SiHR080N60E features low typical on-resistance of 0.074 Ω at 10 V and ultra low gate charge down to 42 nC. The resulting FOM is an industry-low 3.1 Ω*nC, which translates into reduced conduction and switching losses to save energy and increase efficiency in power systems > 2 kW. For improved switching performance in hard-switched topologies such as PFC, half-bridge, and two-switch forward designs, the MOSFET released today provides low typical effective output capacitances Co(er) and Co(tr) of 79 pF and 499 pF, respectively. The package also provides a Kelvin connection for improved switching efficiency.

The device is RoHS-compliant and halogen-free, and it is designed to withstand overvoltage transients in avalanche mode with guaranteed limits through 100 % UIS testing.

Samples and production quantities of the SiHR080N60E are available now. For lead time information, please contact your local sales office.

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Internet of things (IoT) devices have many uses in consumer, medical, and industrial areas. With more IoT devices coming to market, battery duration becomes essential for product quality and customer satisfaction. Their safety depends on battery performance for many of these applications, such as implantable medical devices. When the expected battery life does not meet real-world requirements, the device can become very dangerous for patients.

Battery life requirements are also high for intelligent city or asset-tracking applications. A smart meter in every home or a small asset tracker in every item will need a long-lasting battery, as changing batteries over a large deployment area is not profitable. Therefore, testing and predicting a device’s battery life is more important than ever.

With battery emulation and profiling software, device designers can estimate battery life precisely. Moreover, emulation software can evaluate current drain to modify device designs that can extend battery duration.

Batteries are nonideal energy sources because they interact with the device, influencing the current drain of the battery. Precise current consumption results are crucial for maximizing a device’s battery life. Consider the battery’s features when using a DC source to power the device to ensure that the current consumption results correctly imitate the battery current consumption.

There are several reasons why battery profiling and characterization are essential. Users must know how much energy the battery can hold and deliver as it drains over time. The open circuit voltage (VOC) and internal resistance (IR) change as the battery drains. These need to be plotted so that the battery profiles show the actual performance of the battery in the real world. Figure 1 shows a typical plot example of a battery profile.

Verifying the battery’s performance under certain discharge conditions and operating modes is also essential. Factors that influence battery behavior are:

• Temperature
• Load current profiles (constant/dynamic)
• Different operating modes, including constant current, power, and resistance

Battery life depends on these parameters, so making different battery profiles that suit specific discharge situations is essential.

A general-purpose DC source aims to be a perfect voltage source with no output impedance by using remote sensing feedback to maintain its output voltage constant. However, unlike a battery, its voltage does not decrease with load current. Moreover, feedback regulation is not instantaneous, which causes voltage drop and overshoot when loading and unloading changes. A significant transient voltage drop can activate a device’s low-battery-voltage shutdown.

When powering a device with a DC source, emulate the battery’s characteristics for current drain results comparable to those of a battery. A regular DC source differs from a battery, but a DC source that can imitate a battery helps users get more reliable results. Make sure the power supply used has a programmable output resistance.

Using a battery emulator instead of a battery has several advantages for device testing:

• Creates a safer test environment: By using an emulator, designers do not have to physically charge and discharge batteries, which can become dangerous with repeated cycles.
• Achieves repeatable results: Characteristics of an emulated battery do not vary from physical batteries, whose characteristics can fluctuate after charging / discharging. They can also vary between different batteries, even in the same model.
• Reduces test setup times: Designers can instantly simulate any state of charge (SoC) versus manually draining a battery to the desired level to speed testing.

A battery emulator operates through several steps. The initial step is to load a battery profile. This profile is the data from a graph of the battery voltage and internal resistance against the SoC, as shown in Figure 1. Designers can generate a battery profile using battery modeling software or get a profile from a battery provider.

Creating a profile with modeling software will make the profile match the current consumption for a particular device, which is more precise than a generic profile from a battery supplier. For instance, a generic profile is not helpful if the battery supplier makes the profile based on a steady current draw when the device under test has a variable current consumption. Figure 2 shows a battery profiler with a current consumption profile from a device loaded into it. The software repeats the waveform until the battery runs out of power.

The next step is to choose the initial SoC and the termination voltage. Designers will link the device to the emulator and begin the battery emulation with software. Battery emulators constantly monitor the current, whether charging or discharging, to dynamically compute the emulated SoC. The emulator continually adjusts its output (voltage and resistance) according to the SoC to match the loaded battery profile. The test finishes when the emulator reaches the termination voltage if the emulator discharges.

Designers can learn more about a device’s behavior by quickly emulating a battery at various SoCs. Figure 4 shows the information engineers can obtain from a device’s current drain. Engineers can use the data from this analysis to modify the design of the IoT device to improve battery performance.

Engineers need to know the energy a battery can store and deliver to IoT devices. Battery test and emulation software helps visually monitor battery charging and discharging to measure capacity. Software must support constant current (CC) and voltage (CV) modes for charging batteries. When the battery is nearly full using CC mode, the software must switch from CC mode to a mix of CC and CV. This mix is needed because a battery cannot be charged at the same rate when it reaches maximum voltage or capacity.

It is also crucial for the software to support constant current, constant resistance, and continuous power modes when discharging a battery. Engineers can use software to test and emulate current consumption profiles directly from a device. This feature allows engineers to quickly discharge the battery with a profile matching the current drain during usage. Running it throughout the rundown test and simulating it using the actual device to analyze the battery drain is simpler.

Battery performance can deteriorate significantly over a lifetime of charging and discharging. That is why it is essential to simulate battery cycling. Battery test and emulation software is a convenient solution, but the software must support data logging. Also, generating different charging and discharging profiles for a battery is very useful in a battery test and emulation software solution.

Designers can mix various charging and discharging sequences to simulate complex charging and discharging cycling profiles. Then, they can measure how a battery’s performance declines over time. Emulation software solutions are ideal for this as they can enable, for example, up to one thousand cycle operations to assess the battery’s aging effect and reliability under sequence test conditions.

Battery profiling and emulation software are essential for IoT device power analysis. They help improve battery life, mimic any charge and battery profile state, create more reliable and consistent test environments, and measure capacity loss and aging effects. This is important for product quality, customer satisfaction, and safety in various consumer, medical, and industrial applications.

The software ensures engineers do not have to charge and discharge batteries, which can become dangerous with repeated cycles—instantly simulating any state of charge versus manually draining a battery to the desired level. Battery software helps create a safer test environment, measures accurate, repeatable results, and reduces test setup times.

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