ELE Times

With latest ground-breaking innovation, Technovos is proactively paving the way for a new era of Green Mobility Solutions, amalgamating automotive capacity to eliminate manual labour-intensive tasks.

Technovos- a leading developer of sustainable mobility solutions disrupting the Cleantech and Agritech landscape has recently launched its latest yet innovative offering the GaadE Electric Wheelbarrow to redefine manual-material handling tasks. The launch signifies a revolutionary stride in labour-intensive tasks, reshaping the peripheral of diverse industries.

Challenging conventions and breaking the boundaries of possibilities in the realm of agriculture, logistics, construction and many more, the Wheelbarrow stands at the edge of sustainability convergence. Moving beyond the limits of being an electric motor-driven upgrade of its traditional counterparts, it embodies an inaugural fusion of cutting-edge technology and eco-friendliness.

Thrilled with the launch of its latest offering, Bharath Anantha Srinivas, CEO and Founder of Technovos, commented, “In a world where technological innovation continues to dominate every facet of our daily lives, Technovos aims to become the catalyst for revolutionising the Agritech and Sustainable mobility space. With our latest product, the dynamic Electric Wheelbarrow, we’ve crafted a breakthrough in the realm of material movement, being the premier platform to offer a purpose-driven electric wheelbarrow, designed to exude excellence from concept development to integration and assembly.”

With Electric Propulsion at its forefront, it employs a 4KW 3Phase Induction motor which helps in efficiently transporting substantial loads. Utilising advanced sensors and AI algorithms, it has opened the doors to self-navigation, along with obstacle avoidance and precise manoeuvring. Furthermore, it boasts a loading capacity to move 80% of the applications to minimise the need for human effort.

Accelerating green mobility to an elevated level, it operates with zero-emissions and energy-efficient mechanisms, emerging as the gateway to fostering a sustainable environment.

Offering an opportunity to partake in a future driven by automation, the introduction of electric wheelbarrows in the Precision AgriTech segment is a game-changing innovation. Being a labour-intensive sector, it will deliver farmers and agronomists an escape from manual lifting, opening doors to a versatile and efficient solution that is designed to improve farm operations, whilst enhancing crop management.

With multifaceted warehouse operations, the seamless integration of the GaadE- Electric Wheel-Barrow marks a significant leap forward in material handling and sustainability endeavours. This ingenious solution is poised to transform the warehousing and logistic industries, with access to streamlined operations and reduced costs, whilst enhancing the notions of industrial safety and environmental responsibility.

In the absence of a purpose-built machine for the hyper-local segment, Technovos has carved a distinctive niche with the augment of India’s premier purpose-driven Electric Wheelbarrow. With the launch of this innovative solution, the company has showcased its commitment to becoming the vanguard developer of sustainable mobility solutions that address the gap of implausible material movement methods in an array of markets. Autonomous wheelbarrow after this Electric wheelbarrow is the next innovation planned by Technovos.

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Infineon Technologies has announced a collaboration with Worksport Ltd. Worksport will use Infineon’s GaN power semiconductors GS-065-060-5-B-A in the converters for its portable power stations to increase efficiency and power density. Enabled by Infineon’s GaN transistors, the power converters will be lighter and smaller in size with reduced system costs. In addition, Infineon will support Worksport in the optimization of circuits and layout design to further reduce size and increase power density.

“Infineon’s high-quality standard and solid supply chain provide us with the best components to ensure power-dense converters for our COR system product line and contribute to a first-class end product performance,” said Worksport CEO Steven Rossi. The company’s COR battery system can be integrated into a pickup truck or recharged by any solar panel or wall outlet. By replacing the former silicon switch in the power converter with Infineon’s GaN power semiconductors and operating the transistors at higher switching frequency, Worksport will be able to reduce the battery system weight by 33 percent and system costs by up to 25 percent.

The working relationship with Infineon will also help Worksport to reduce CO2 in the manufacturing process. GaN is proving itself as a game-changing technology across many markets and applications. For example, in data centers, GaN solutions have a global energy savings potential of 21 TWh annually, 10 million tons of Carbon Dioxide (CO2) equivalent. “In order to further drive electrification and decarbonization, the industry’s power designs require innovation,” said Johannes Schoiswohl, Business Line Head GaN Systems of Infineon’s Power & Sensor Systems Division. “With our GaN power semiconductors we enable Worksport to create the next generation portable power stations that users require.”

Infineon’s GS-065-060-5-B-A is an Automotive-grade 650 V enhancement mode GaN-on-Silicon power transistor. It offers very low junction-to-case thermal resistance for demanding high-power applications such as on-board chargers, industrial motor drives and solar inverters. Furthermore, it features simple gate drive requirements (0 V to 6 V) and a transient tolerant gate drive (-20 / +10 V).

Availability

The GS-065-060-5-B-A is available in a bottom-cooled, low-inductance GaNPX® package.

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The metaverse and extended reality (XR) applications are considered critical to unlocking the full consumer potential of the 5G technology. Rigorous testing is crucial to ensure the performance and market acceptance of these immersive experiences. Rohde & Schwarz and Slalom have collaborated to address this need, developing essential tools to test XR use cases thoroughly prior to market launch. At Mobile World Congress 2024, visitors can experience a first demonstration of how to enable tomorrow’s augmented reality.

The 3rd Generation Partnership Project (3GPP) closely examined extended reality (XR) applications with Release 17. This was pivotal in identifying the current limitations and potential enhancements in today’s 5G specifications, paving the way for 5G-Advanced, which will be addressed in Release 18. One of the key areas for 5G-Advanced is the development of animated avatar calls that use augmented reality. This is considered a stepping stone toward a broader integration of the metaverse.

Rohde & Schwarz, a leader in test and measurement solutions, has partnered with Slalom, a next-generation professional services company creating value at the intersection of business, technology, and humanity, to create a state-of-the-art lab environment. This collaboration has resulted in a test bed for XR-based use cases. At the test bed’s core is the R&S CMX500 5G one-box signaling tester from Rohde & Schwarz. This innovative setup empowers network operators to evaluate XR-based applications and services in a controlled environment, ensuring optimal performance and quality of experience (QoE) for their subscribers even before mainstream deployment.

The animated avatar, developed by Slalom, renders on a cloud computing architecture, which is seamlessly integrated with the R&S CMX500. The R&S CMX500 emulates a 5G network to establish a Voice over New Radio (VoNR) connection to the end-user device. The end-user experience is brought to life using a Motorola Edge 40 Pro 5G smartphone connected to Lenovo ThinkReality A3 Smart Glasses, where the avatar is displayed. The system also features a loopback of audio samples, laying the groundwork for future audio quality assessments based on the POLQA algorithm. A key aspect of the avatar’s animation is head movement emulation, which is designed to convey attentiveness during calls. The accurate rendering and timely display of such details on the end-user device are among the key performance indicators that are being further investigated by both companies.

Christoph Pointner, Senior Vice President for Mobile Radio Testers at Rohde & Schwarz says: “We are thrilled to enhance our application testing capabilities through our collaboration with Slalom. This partnership lays a robust foundation for the wireless ecosystem, accelerating the market introduction of XR-based applications and services to pave the way for the metaverse.”

Sam Andrews, General Manager at Slalom says: “In partnership with Rohde & Schwarz, we have developed an innovative concept where we can assess and measure the end-to-end quality of XR experiences that considers network, device, and application to create seamless outcomes for end users and unlock new opportunities for enterprises.” Jason Inskeep, Advanced & Converged Architectures / Mobile / 5G at Slalom, adds: “At Slalom, we believe that being able to architect a true end-to-end integrated solution – from the network to the application layer to the end user – is fundamental to helping our customers achieve resiliency and efficiency at scale, unlock new revenue streams and create amazing customer experiences.”

This collaboration between Rohde & Schwarz and Slalom opens the way to virtual interactions that are more immersive and personal. For consumers, this innovation promises an enhanced sense of presence and engagement during voice calls.

Rohde & Schwarz and Slalom will demonstrate the test bed for AR-animated avatar calls at the Mobile World Congress 2024 at the Rohde & Schwarz booth 5A80 in hall 5 of Fira Gran Via in Barcelona.

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Anritsu Corporation a global provider of innovative test and measurement solutions now enable advanced AI (Artificial Intelligence) capabilities for solving difficult problems in wireless communications systems using DeepSig’s proven AI machine learning (ML) technology.  Radio Spectrum is a valuable asset that needs to be managed, shared, and utilized optimally in wireless networks.  New radio frequencies required to enable 6G Use Cases are becoming increasingly scarce, and there is increased attention towards the development of novel spectrum-sharing techniques.  Traditional RF sensing techniques face limitations in dynamically changing wireless environments, and more advanced monitoring and signal characterization is required.

Anritsu has addressed this challenge by partnering with Deepsig to deliver a groundbreaking solution that integrates the capabilities of the Anritsu MS2090A Field Master Pro Spectrum Analyser with DeepSig’s wireless signal detection and classification software, which is based on its patented Artificial Intelligence (AI) deep learning algorithms.  Employing a deep learning, data-driven approach allows Anritsu to rapidly incorporate new radio signal models into their capabilities using DeepSig’s ML training tools. RF signals of interest from diverse new sources like drones and IOT devices can be learned quickly and accurately in days, rather than months, to meet fast-changing customer requirements. These advanced technologies also form the foundation for AI-native RF sensing for 6G. This integrated solution will empower customers to enhance network performance, optimize spectrum utilization, and achieve real-time adaptation to changing RF conditions.

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Step into the future of wireless technology with Rohde & Schwarz’s latest innovation in Wi-Fi 7 test solutions, aimed at enhancing device development for ultra-high-definition video streaming, VR, AR, and beyond.

As the telecommunications landscape embraces the era of 5G technology, the integration of non-3GPP networks like public, home, and enterprise WLAN hotspots with the 5G core is of paramount importance. This integration paves the way for the future of smartphones and wireless devices, heavily reliant on advanced WLAN technologies such as Wi-Fi 7, promising greater power and efficiency but posing challenges of complexity.
Addressing these emerging needs, Rohde & Schwarz has unveiled its cutting-edge Wi-Fi 7 test solutions. These solutions are tailored to tackle the growing test challenges associated with next-generation WLAN technologies and their coexistence with existing LTE and 5G standards. Equipped with Wi-Fi 7 testing capabilities, the multi-technology multi-channel signalling tester enables R&D engineers to streamline the testing process for wireless devices across both cellular and non-cellular standards, thus optimizing the development process.

Key features of these solutions include new Wi-Fi 7 capabilities, testing of RF TX/RX characteristics of WLAN devices under real conditions, support for Multi-Link-Operation (MLO), flexibility across multiple radio technologies for Wi-Fi 7-specific tests, and the ability to test WLAN offloading and Voice over WLAN for seamless service continuity and high-quality voice experiences over WLAN networks.

Wi-Fi 7, also known as IEEE 802.11be, marks a significant leap forward in WLAN technology, aimed at supporting extremely high data throughput for applications like ultra-high-definition video streaming, virtual reality, and augmented reality. With enhancements such as increased channel bandwidth (up to 320 MHz), up to 16 spatial streams, and advanced 4096 QAM modulation, Wi-Fi 7 sets the stage for the future of wireless connectivity.

Rohde & Schwarz’s Wi-Fi 7 test solutions are meticulously designed to meet these advanced specifications, underscoring the company’s commitment to supporting the evolution of WLAN technologies. Optimized for efficient RF measurements in non-signaling mode for device production, the tester supports a wide range of cellular and non-cellular technologies, including Wi-Fi 6E, Wi-Fi 7, and 5G NR FR1, with bandwidth capabilities up to 500 MHz, positioning itself as a forward-looking solution for both R&D and production needs.

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As 5G technology evolves, non-3GPP networks such as public, home and enterprise WLAN hotspots will be more and more interlinked with the 5G core. As a result, tomorrow’s smartphones will rely even more on the next generations of WLAN technology, which will be more powerful and efficient, but also more complex. At Mobile World Congress 2024 in Barcelona, Rohde & Schwarz will be showcasing its latest Wi-Fi 7 test solutions for R&D and production to meet the ever-increasing test challenges posed by the technology and the parallel operation with LTE and 5G cellular standards.

Rohde & Schwarz will display its R&S CMX500 multi-technology multi-channel signaling tester at MWC 2024 with newly added Wi-Fi 7 testing capabilities. With this functionality, the one-box tester allows R&D engineers of wireless devices to comprehensively test their design’s operation in cellular and non-cellular standards of the latest generation in a single instrument setup. In addition to this, the R&S CMP180 radio communication tester will verify a signal waveform of 480 MHz bandwidth in loopback mode, attesting to be a future-proof solution for users in R&D and production, even beyond the requirements of Wi-Fi 7.

Challenges of next-generation WLAN testing

While the market for the sixth generation of Wi-Fi, IEEE 802.11ax, is still growing, the development of Wi-Fi 7, or IEEE 802.11be, is in full swing. Wi-Fi 7 is the next generation of Wi-Fi technology, designed for extremely high data throughput. With tens of gigabits of data per second and low latency, it meets the growing demand for ultra-high-definition video streaming, virtual reality and augmented reality applications. Key elements to achieve higher throughput are an increased channel bandwidth of 320 MHz, up to 16 spatial streams and 4096 QAM modulation. In addition, for a yet-to-be-defined Wi-Fi 8 (IEEE 802.11bn) standard, even wider channel bandwidths are in discussion. Rohde & Schwarz meets these challenging characteristics with its solutions for testing Wi-Fi 7 and beyond, showcased at MWC Barcelona.

R&S CMX500 features new Wi-Fi 7 capabilities for R&D

During the development of WLAN devices, measurements of the RF TX and RX characteristics must be conducted under real-world conditions in signaling mode. The R&S CMX500 one-box tester is a multi-technology multi-channel signaling tester that is now available with integrated Wi-Fi 7 test functionality. Especially in Wi-Fi 7 where Multi-Link-Operation (MLO) is a key feature, a test environment that provides multiple RF chains is crucial. The tester’s flexibility, support for multiple radio technologies, and embedded IP test capabilities make it a versatile solution for a wide range of Wi-Fi 7-specific tests, such as 2×2 MIMO, 6 GHz band with out-of-band discovery, coexistence and E2E test capabilities.

Testing WLAN offloading with Voice over WLAN in a single box

WLAN offloading is the process of delivering data originally intended for cellular networks over WLAN. It helps reduce the amount of data carried on the cellular bands, freeing up bandwidth for other users. It is also used to ensure service continuity in scenarios where cellular coverage is insufficient, but a WLAN hotspot is available to take over the connection. For example, the handover between a cellular network and WLAN during a voice call, often referred to as Voice over WLAN, aims to provide subscribers with an uninterrupted voice call experience.

At MWC, Rohde & Schwarz will demonstrate the R&S CMX500 and its ability to test seamless traffic offloading and interworking between cellular 5G and WLAN with a single box solution. The newly integrated Non-3GPP Interworking Function (N3IWF) gateway in the R&S CMX500 makes it an easy-to-use solution for testing WLAN offloading with Voice over WLAN, enabling device manufacturers and operators to efficiently test these applications. In addition, the integrated POLQA voice quality measurement function of the R&S CMX500 offers a comprehensive and cost-effective solution to ensure the quality of experience for voice over WLAN applications at an early stage.

Future-proof R&S CMP180 R&D and production tester

In the production phase of WLAN devices, all RF measurements are performed in non-signaling mode to save time. Rohde & Schwarz has optimized the R&S CMP180 radio communication tester for this purpose. The instrument supports many cellular and non-cellular technologies including Wi-Fi 6E, Wi-Fi 7 and 5G NR FR1 up to 8 GHz in frequency with bandwidths up to 500 MHz. Leveraging the wide bandwidth, the R&S CMP180 will demonstrate at MWC its ability to verify a WLAN waveform with 480 MHz bandwidth in loopback mode, a potential waveform candidate for the yet-to-be-defined Wi-Fi 8 (IEEE 802.11bn) standard. This feature shows that the cost-effective instrument is future-proof for users not only in production but also in R&D.

Two analyzers, two generators and two sets of eight RF ports are integrated in the R&S CMP180 to support 2×2 MIMO testing in a single box. Two R&S CMP180 instruments can be combined and scaled to support four analyzers and generators for efficient testing of 4×4 MIMO access points.

Rohde & Schwarz will present its comprehensive test solutions for next-generation WLAN at the Mobile World Congress 2024 at the Fira Gran Via in Barcelona in hall 5, booth 5A80.

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Enables accurate evaluation of a network using OpenZR+ transceivers with excellent cooling performance of the measurement module

Anritsu Corporation introduces the 400G (QSFP-DD) multi-rate module MU104014B that supports the new interface standard OpenZR+, as a module of the Network Master Pro MT1040A. OpenZR+ enables low-cost Data Center Interconnects (DCI) and metro network construction.

This measurement solution supports tests for transitioning from high-cost networks using existing WDM[*1] systems to low-cost networks using OpenZR+ transceivers. Through this solution, the MT1040A helps reduce network construction and expansion costs. With excellent heat dissipation and cooling performance, the new measurement module is able to prevent communication failures caused by the heat generated by OpenZR+ transceivers. This enables more accurate measurement of network performance.

Development Background

Datacenters and metro networks are growing at a rapid pace due to the spread of generative AI and cloud services as well as advances in digital transformation (DX) meeting social needs. Particularly, limits on available space, power-supply capacity, and air-conditioning can cause problems in scaling-up the capacity of established medium-scale datacenters so increasing the number of distributed medium datacenters can be more efficient than building new hyperscale datacenters, which is driving demand for DCI between more medium-scale datacenters.

WDM circuits provided from network operators are used widely for DCI but are expensive. To resolve this issue, the 400ZR[*2] standard was established, allowing low-cost network construction. However, the transmission distance of 400ZR is short and its data rate is only 400G. The OpenZR+ standard was created to support a longer transmission distance and data rates ranging from 100G to 400G.

OpenZR+ transceivers are inexpensive compared to the existing WDM systems. OpenZR+ supports various network configurations and is suitable for DCI construction. On the other hand, however, because OpenZR+ is capable of long-haul transmission, some OpenZR+ transceivers consume nearly 1.5 times as much power as the existing 400ZR transceivers and generate more heat. In order to measure an OpenZR+ transceiver accurately without failure, therefore, the measurement module needs to have a transceiver heat dissipation measure in place to suppress the heat generated by the transceiver. This measurement solution answers this need.

Product Overview

Network Master Pro (400G Tester) MT1040A
The MT1040A is a B5 size 400G handheld tester with excellent expandability and operability. It is a touch panel-operated field measurement instrument equipped with a 9-inch screen that is small enough to carry with a single hand. It supports a range of interfaces from 10M up to 400G.

Technical Terms

[*1] WDM
Abbreviation for Wavelength Division Multiplexing technology supporting transmission of multiple optical signals with different wavelengths in one optical cable by simulating multiple cables.

[*2] 400ZR
One interface standard for optical modules used by DCI. Facilitates lower-cost connections between data centers than conventional wavelength division multiplexing (WDM) systems.

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IBASE Technology Inc. has introduced its latest innovation in the realm of computing solutions – the AMI240 fanless system. This cutting-edge system, powered by the IBASE MBE240AF motherboard, promises unparalleled performance and connectivity options, catering to diverse applications across various industries.

Designed to accommodate 14th and 13th Gen Intel Core processors, including the Intel® i9-14900T processor with 24 cores and 36M cache, the AMI240 system offers exceptional processing power while maintaining energy efficiency. With a 35W TDP, it ensures optimal performance for demanding tasks, making it suitable for a wide range of applications.

One of the standout features of the AMI240 system is its compatibility with Sierra 5G modules, providing high-speed connectivity for advanced networking needs. Additionally, the system boasts a compact and space-efficient design, measuring just 210mm(W) x 285mm(D) x 77mm(H), making it suitable for installations where space is limited.

The system’s robust construction allows it to operate reliably in temperatures ranging from -20°C to 70°C, making it ideal for environments with extreme thermal conditions. This feature ensures that the system maintains its performance and functionality even in challenging operating environments.

Key features of the AMI240 fanless system include:

• Fanless design featuring the IBASE MBE240AF motherboard
• Support for 14th and 13th Gen Intel Core processors (i9/i7/i5/i3) with a 35W TDP
• Dual SIM slots for WWAN redundancy (5G/4G/LTE)
• Four RJ45 Ethernet ports (dual 2.5GbE + dual PoE+ supporting 802.3at)
• Three M.2 slots (B-Key/E-Key/M-Key), iAMT (16.1), TPM (2.0)
• Single 24V DC input with voltage protection (over/under/reverse)
• Wide operating temperature range (-20°C to 70°C)

Furthermore, the AMI240 system offers comprehensive connectivity options, including dual SIM slots for WWAN redundancy, four RJ45 Ethernet ports with dual 2.5GbE and dual PoE+ support, and multiple M.2 slots for additional expansion. It also includes features such as iAMT (16.1), TPM (2.0), and PCI-E slots for further customization and expansion capabilities.

Overall, the AMI240 fanless system from IBASE Technology Inc. stands as a testament to the company’s commitment to delivering cutting-edge computing solutions with unparalleled performance, reliability, and connectivity options.

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Exceptional power and reliability at the core of the new resistor range adds new capabilities, temperature tolerance and space-saving options for developers.

element14 is now stocking a range of special flat chip resistor solutions from KOA Corporation (KOA).

Important to design engineers in a wide range of demanding markets, KOA resistors are an ideal choice for designers working in automotive, industrial, aerospace, medical, instrumentation and power conversion sectors.

Among the new resistors featured is the RN73R, a high-precision, high-reliability thin film resistor, that replaces the RN73 series with improved electrolytic corrosion resistance and higher stability.

The RN73H resistor in the series is designed for tough environments and is ideal for high-precision circuits for automotive, aerospace and other challenging applications. Despite their ultra-thin film, these resistors have excellent moisture resistance due to an additional inner protective layer.

A high-precision resistor now carried by element14 that uses thick film technology is the RS73, which makes it ideal for long-term stability when designing high-accuracy sensing or voltage detection circuits in automotive, industrial and measuring applications where ESD sensitivity is an issue.

The SG73P is an endured pulse power thick film resistor that has approximately seven times the pulse handling capability of standard flat chip resistors. Its special trimming gives it a higher power rating, which means that a SG73P device can be dropped onto the pads of a similar-sized conventional part, thus increasing the power capability without changing the PCB layout.

For designers who need to conserve board space, the new WK73R wide termination thick film resistor offers several advantages. For example, the 0612 chip size allows a 6x power rating compared to standard 1206 parts, which saves board space by improving heat dissipation. The larger terminals also enhance terminal strength and the smaller distance between the terminals reduces expansion stress.

element14’s new stock of KOA resistors also includes:

• Flat chip resistors for high voltage applications, represented by KOA’s HV73(V)-series, designed for voltages up to 3 kV (2512 size with special coating and trimming insulation to ensure that higher voltages can be applied at operating temperatures up to +155 °C.
• TLR low-ohm, high-power metal plate shunt resistors are offered in the ultra-low 0.5mΩ…20mΩ resistance range. Special trimming gives the device low inductance and removes any hotspots from the design.
• The TLRZ series metal plate zero-ohm jumpers handle high currents in very small sizes. These low-profile jumpers are the perfect replacement for thick film devices in existing designs.
• UR73 resistors are low resistance, low TCR thick film resistors that offer a cost-efficient approach for current sensing in the power range from 0.125 to 1 Watt and are available in sizes from 0402 to 2512.
• KOA’s UR73V low resistance, low TCR thick film resistors for automotive applications cover the 10mΩ – 1Ω range and are a highly cost-effective approach to current sensing in automotive, power supply, motor control and many other industrial automation applications.

element14 Product Segment Leader, Resistors, Euan Gilligan, said, “KOA is known for the quality and reliability of their resistors and other products. We are delighted to make the benefits of their capabilities readily available to developers worldwide.”

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Author: Capt. Nikunj Parashar, Founder & CMD, Sagar Defence Engineering Pvt. Ltd. 

In recent times, the Indian Defence sector has emerged as a focal point for the ‘Aatmanirbhar Bharat’ initiative, emphasizing self-reliance and indigenous manufacturing. With a strong commitment from the government, the Defence and Aerospace sector is witnessing a transformative phase. Recognizing the significance of a robust domestic defence industry, the vision of the government that is steering towards transparency, predictability, and ease of doing business has led to the establishment of an indigenous manufacturing infrastructure, supported by a robust research and development ecosystem, that is at the forefront of this transformative journey.

Capt. Nikunj Parashar, Founder & CMD, Sagar Defence Engineering Pvt Ltd

In the quest for self-reliance, the Indian defence manufacturing industry has seen a surge in innovation driven by a vibrant ecosystem of startups. Contributing to the development of cutting-edge technologies that empower and support the country’s defence efforts, such startups have become key players in the larger goal of reducing dependency on external sources for defence procurement. To foster the growth of the domestic defence industry, the government has implemented various initiatives and measures such as de-licensing, de-regulation, export promotion, and liberalization of foreign investments aimed at creating a conducive environment for startups. The ‘Make in India’ and ‘Startup India’ initiatives, supported by other policy measures, have modernized the armed forces and boost indigenous manufacturing.

One significant step towards fostering innovation in the Defence and Aerospace ecosystem is the Innovations for Defence Excellence (iDEX) program. By providing a platform for collaboration between startups and the defence forces, iDEX accelerates the integration of innovative technologies into the country’s defence capabilities. In addition to iDEX, the government has implemented various supportive schemes to encourage innovation within the Defence and Aerospace sector. These schemes provide financial support, mentorship, and resources to startups, nurturing a culture of innovation and research. The ‘Make in India’ initiative is not just a slogan but a strategic move to reduce external dependency for defence procurement by promoting indigenous manufacturing, the government has enhanced the self-sufficiency of the Indian Defence sector. Startups, with their agility and innovation, play a crucial role in this process, contributing to the development of state-of-the-art technologies and products.

While the journey towards self-reliance in the defence sector is promising, it is not without challenges. Indian startups face obstacles such as funding constraints, regulatory hurdles, and the need for skilled manpower. However, the opportunities are immense. The government’s commitment to simplifying regulations, promoting exports, and encouraging foreign investment presents a favourable environment for startups to thrive. The role of Indian startups in defence exports is gaining prominence on the global stage with a focus on creating innovative solutions, these startups are well-positioned to cater to the evolving needs of the global defence market. Collaborations with foreign partners, facilitated by the government’s export promotion measures, have opened avenues for Indian startups to showcase their capabilities and contribute to global security. With continued support from the government and collaborative efforts, Indian startups are poised to play a pivotal role in shaping the future of the country’s defence industry. The journey towards an Atmanirbhar Bharat is not just a vision but a collective effort, with startups leading the way into a new era of self-sufficiency and technological prowess.

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In 2023, the global semiconductor industry faced a significant setback with an 8.8% decline in revenue, largely attributed to sluggish enterprise and consumer spending. This decline prompted notable shifts in the industry’s landscape, with Intel reclaiming the top spot from Samsung, the latter grappling with challenges in the memory sector and smartphone business.

However, during this downturn, artificial intelligence (AI) emerged as a beacon of hope, driving content and revenue growth, particularly in the latter half of the year. NVIDIA and AMD emerged as key beneficiaries, poised to expand their AI-related ventures in the coming years.

The analysts underscored 2023 as a pivotal year for semiconductor companies to recalibrate strategies and manage inventory in anticipation of an impending AI boom. Counterpoint’s semiconductor revenue tracker revealed that only 6 out of the top 20 global semiconductor vendors reported year-over-year revenue growth, indicating the pervasive nature of the downturn.

The memory sector bore the brunt of these challenges, experiencing a staggering 43% year-over-year decline in revenue. This sector’s struggles were further exacerbated by soft demand across PC, server, and smartphone segments, coupled with oversupply issues.
Despite the decline, Intel regained its position atop the revenue rankings in 2023, despite a 16% year-over-year revenue drop attributed to shipment declines in PC and server segments. Samsung, alongside other major players like SK Hynix and Micron, faced substantial revenue declines due to challenges in the memory market.

Looking ahead, analysts anticipate AI to be a primary driver of organic growth in the semiconductor industry for 2024, alongside a projected rebound in the memory sector and growth in the automotive sector. TSMC, the world’s largest foundry player, remains optimistic about capacity expansion plans for 2024, reflecting confidence in sustained demand.

Senior Analyst William Li emphasized the significance of AI, stating, “Artificial intelligence (AI server, AI PC, AI smartphone, etc.) will continue to be a major organic growth driver in the semiconductor industry in 2024.

As the industry navigates through the end of the inventory correction cycle and solidifies support from client demand, supply constraints are poised to be a key focus area. TSMC’s robust capacity expansion plans signal confidence in meeting demand, underlining expectations of continued growth throughout the year.

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Author : STMicroelectronics

Medical devices aren’t immune to the latest machine learning opportunities, but the existing components don’t always satisfy the new engineering needs, which is why the Page EEPROM series by ST is finding design wins in healthcare. Put simply, the new hybrid memory architecture combines an EEPROM’s robustness and power efficiency with the speed and capacity of flash memory. We currently offer modules with eight times more storage than EEPROM to reach up to 32 Mbits while keeping the write time at about 2 ms, which is about half that of an EEPROM. Let’s thus see what such a module can bring to a highly constrained product like a behind-the-ear (BTE) hearing aid and more.

Constraints today The case of the hearing aid

A paper funded by the Federal Ministry of Education and Research of Germany and presented at the 48th European Solid-State Circuits Conference in 20221 looked at a modern take on the BTE hearing aid. The researchers used a Bluetooth SoC and a DSP to process audio. The purpose was to create something small enough to be usable in clinical settings over long periods while having the computational capabilities to try new algorithms. The fact that the authors specifically mention the exploration of neural networks as a reason behind their paper further emphasizes the need to bring machine learning to this industry.

Today’s memory limitations

However, the scientists hit a pretty important limitation common to many industries: memory capacity. The researchers used 2.5 MB of memory for data and 375 KB for instructions. The obvious issue is that even the smallest neural networks will need far more than that. However, the increase in capacity cannot result in a compromise in robustness or overall power consumption. In this instance, the area behind the ear is a major constraint, and direct contact with the patient’s skin prohibits any increase in heat dissipation. Consequently, a significant bump in memory capacity can’t just come from existing devices but requires a new memory architecture.

Greater capacity also opens the door to new levels of efficiency. In this instance, instead of having external and internal modules, engineers can create one memory pool that can satisfy all their needs. It’s an increasingly common practice in embedded systems because it offers a lot of benefits. Among others, it helps simplify designs, which reduces development times and the bill of materials. It also helps optimize memory access for greater performance. Finally, companies significantly lower the risk of shortages or shipping issues since they only need one module. As memory availability can suffer from high volatility, relying on one module simplifies the sourcing and qualification process.

Architectures tomorrow The need for memory pages

At its simplest, all digital information today takes the form of zeros and ones, and each value is stored in a bit, which represents the most basic unit of computing2. Due to historical reasons, memory structures today take 8 bits to form a byte. In a traditional EEPROM, the architecture provides byte-level precision, which gives unparalleled granularity. However, erasing and writing operations take longer. Additionally, the byte-level architecture of a standard EEPROM means a bigger die. Consequently, it limits the overall capacity possible in a small component, which explains why it is difficult to significantly increase the capacity of traditional EEPROM.

To remedy this, the industry has long since adopted the notion of words, which groups bytes, and pages, which bundle words together. Thanks to this system, a memory controller can erase more cells at once, thus accelerating the process at the cost of the byte-level flexibility. For instance, serial flash traditionally has a page size of 256 bytes. Additionally, the memory is organized in sectors, which is the standard block of memory that the controller can erase at once. In most serial flash of comparable sizes to our Page EEPROM, the sector size is 4 KB. Thanks to this structure, it is possible to create significantly smaller dies. However, engineers lose the flexibility of the byte-level EEPROM.

The need for a hybrid architecture

The Page EEPROM is unique because while it uses 16-byte words and 512-byte pages to improve performance and capacity, it also enables byte-level granularity thanks to a smart page management system. More precisely, the memory controller is capable of byte-level write operations to optimize certain processes like data logging while offering efficient erase and program operations for firmware updates. Consequently, it adopts a hybrid structure to keep the flexibility of a traditional EEPROM while featuring the capacity and speed of flash. The ST architecture also checks a 17-bit error-correcting code (ECC) signature after each word to improve the overall reliability, thus enabling the correction of 2 bits within 16-byte words.

Page EEPROM: Benefits now Low power consumption of 500 µA Page EEPROM in SO8N Package

As explained earlier, power consumption is a central issue for many wearables, like BTE hearing aids. In real-world operations, the Page EEPROM needs about 500 µA when reading data, which is about five times less than a serial flash, and its electrical current peak is less than 1 mA, which means fewer passive components. Additionally, ST’s Page EEPROM has a current peak control system to keep the consumption below 3 mA at all times. Comparatively, a serial flash often experiences high current peaks that lead to wide variations in power consumption. As for writing operations, the Page EEPROM needs fewer than 2 mA, which is even less than the 3 mA of some EEPROM.

Concretely, the levels of power consumption afforded by ST’s Page EEPROM mean that engineers can work with smaller batteries and smaller PCBs to fit more space-constrained applications. Indeed, 500 µA when reading data and less than 1 mA in current peak signify that, compared to a serial flash, a designer can either use a much smaller battery or use the same battery for much longer. Additionally, because the smaller current peak means fewer passive components, the PCB can shrink, which also means a bigger battery in the same case or a smaller design altogether. These are critical considerations for BTE hearing aids that were not possible until Page EEPROM.

High data rate of 320 Mbit/s

As explained, the page architecture of ST’s new memory boosts overall performance. Compared to the 20 Mbit/s of a vanilla EEPROM, the Page EEPROM clocks at 320 Mbit/s in read operations. Consequently, a microcontroller can download its firmware from the Page EEPROM in significantly less time. Additionally, our memory includes a Buffer Load feature that can program several pages at the same time, thus bypassing some of the bottlenecks inherent to the SPI protocol. In practical terms, it means that using the buffer load feature can drastically speed up the programming of hundreds of thousands of devices, thus lowering the overall manufacturing costs. The memory access time is also significantly faster for a wake-up time of 30 µs.

High endurance of 500,000 cycles

The Page EEPROM supports 500,000 read-write cycles per page over the full temperature range (from -40 ºC to +105 ºC), which is about five times better than a serial flash. A traditional EEPROM does have a higher endurance, but we’ve also found that current rates are more than acceptable for integrators since the Page EEPROM, just like the standard one, qualified for a cumulated 1 billion cycle over the entire memory capacity. Indeed, since the ST device has more capacity, developers can spread the wear over more cells, thus extending its life. In fact, many medical devices, like hearing aids, already use serial flash successfully. The endurance of our Page EEPROM thus represents an improvement, not a regression.

Next Steps

The best way to get started with a Page EEPROM is to grab our X-NUCLEO-PGEEZ1 expansion board and download the X-CUBE-EEPRMA1 package. The software bundle provides a demo application that uses the board as an external storage solution, thus showcasing how to read and write from it. It is a quick way to learn how to use a single, dual, or quad SPI interface to interact with the Page EEPROM to run a proof-of-concept or test the hybrid architecture. ST also provides technical documentation to understand the memory architecture better or be familiar with cycling endurance, among other things.

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Catalyzing the next-generation Electronics System Design

Tenstorrent Inc., a next-generation computing company building computers for AI has announced that it will be collaborating with C-DAC. This is in line with Digital India futureLABS in the area of RISC-V compute and design & innovation ecosystem. By extending their AI deep learning accelerator solution to the overall progress of the semiconductor Industry, Tenstorrent will be joining forces with the Government of India.

Keith Witek, Chief Operating Officer, Tenstorrent Inc. with Rajeev Chandrasekhar, Minister of State for Electronics & Information Technology, Skill Development & Entrepreneurship and Jal Shakti, Govt. of India

The vision and roadmap of implementation of the Digital India futureLABS is being unveiled by Shri Rajeev Chandrasekhar, Hon’ble Minister of State for Electronics & Information Technology, Skill Development & Entrepreneurship and Jal Shakti, Govt. of India at Indraprastha Institute of Information Technology Delhi (IIIT Delhi), New Delhi.

Speaking on the occasion, Keith Witek, Chief Operating Officer, Tenstorrent Inc. said, “India is witnessing immense growth. What India is going to do over the next five to ten years is going to set the tone for the future. Tenstorrents’ chiplet ecosystems, open hardware platforms, RISCV and artificial intelligence (AI) are a perfect match to reduce the cost of manufacturing at scale. And it is the right time for India to take advantage of the technology offerings from Tenstorrent and disrupt the status quo and incumbents as it catapults to the numero uno position. We are very happy to be part of this innovation and looking forward to the journey.”

Also, present at the moment for the Memorandum of Understanding (MOU) were Aniket Saha, Vice President of Product Management, Tenstorrent Inc and Kishore Amarnath, Director of Sales and Business Development Tenstorrent Inc.

Digital India futureLABS, is conceived to move up the value-chain & fortify domestic R&D by creating a collaborative ecosystem for development of IPs, Standards and catalyzing next-generation Electronics System Design ecosystem in the country by enabling co-development opportunities & partnerships amongst Government, Startups, R&D organizations and large enterprises. Digital India futureLABS will be coordinated by C-DAC to provide the dedicated thrust to following key growth areas- Automotive, Compute, Communication, Strategic Electronics and Industrial Electronics/ IoT.

It is a tremendous opportunity and Tenstorrent is pleased to be a part of innovation and development in India. India has all the necessary ingredients that are needed to be successful such as; scale, workforce – that’s easily educated and highly skilled, educational system that can create that workforce, access to capital – significantly improving, velocity of attention and business that’s going to propel and catch up to a lot of incumbents and eventually exceed over the course of the next decade.

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Highlights:

• Revolutionary dedicated HW/SW acceleration platform leverages GPU and CPU computing and proprietary software algorithms to deliver up to 100X design impact through accuracy, speed and scale
• GPU-resident solvers dramatically improve the energy efficiency of simulation by 20X over traditional HPC
• Digital twin, AI and HPC technology combine to provide the best multiphysics simulation solution for automotive, A&D, energy, turbomachinery and data centre markets
• Innovative generative AI technology further accelerates design and analysis exploration, enabling optimal system solutions through superior design insight
• Available for CFD multiphysics analysis today in the cloud or as an on-premises appliance to accommodate customers’ business requirements

Cadence Design Systems, Inc. has announced the Cadence Millennium Enterprise Multiphysics Platform, the industry’s first hardware/software (HW/SW) accelerated digital twin solution for multiphysics system design and analysis. Targeted at one of the biggest opportunities for greater performance and efficiency, the first-generation Cadence Millennium M1 accelerates high-fidelity computational fluid dynamics (CFD) simulations. Available in the cloud or on premises, this turnkey solution includes graphics processing units (GPUs) from leading providers, extremely fast interconnections and an enhanced Cadence high-fidelity CFD software stack optimized for GPU acceleration and generative AI. Millennium M1 instances can be fused into a unified cluster, enabling customers to achieve an unprecedented same-day turnaround time and near-linear scalability when simulating complex mechanical systems.

Designing mechanical systems for new levels of performance and efficiency has become a key priority in the automotive, aerospace and defense (A&D), energy and turbomachinery industries. To optimize performance and reduce greenhouse gases, automotive designers are focused on improving fuel efficiency, reducing drag and noise, and extending electric vehicle range. Increasing efficiency, reducing carbon emissions and reducing maintenance frequency are top of mind for A&D and turbomachinery design engineers. Advances in multiphysics simulation technology are critical to achieving these goals. Performance, accuracy, capacity and accelerated computing are all essential to enabling digital twin simulations that explore more design innovations, providing confidence that they will function as intended before undertaking prototype development and testing.

The Millennium Platform addresses these needs. Highlights and benefits include:

• Performance: Combines best-in-class GPU-resident CFD solvers with dedicated GPU hardware to provide supercomputer-equivalent throughput per GPU of up to 1000 CPU cores
• Efficiency: Reduces turnaround time from weeks to hours with 20X better energy efficiency compared to its CPU equivalent
• Accuracy: Leverages Cadence Fidelity CFD solvers to provide unmatched accuracy to address complex simulation challenges
• High-Performance Computing: Built with an extensible architecture and massively scalable Fidelity solvers to provide near-linear scalability on multiple GPU nodes
• AI Digital Twin: Rapid generation of high-quality multiphysics data enables generative AI to create fast and reliable digital twin visualizations of the optimal system design solution
• Turnkey Solution: The industry’s first solution that couples GPU compute with modern and scalable CFD solvers, providing an optimized environment for accelerated CFD and multidisciplinary design and optimization
• Flexibility: Available with GPUs from leading vendors, in the cloud with minimum 8 GPU configurations, or on premises with a minimum 32 GPU configuration—providing a flexible and scalable solution to fit each customer’s deployment needs

“Throughout our 35-year history, Cadence has been focused on increasing performance with no loss of accuracy for the most challenging computational applications. Algorithmic throughput remains a key priority, and we’re now leveraging generative AI to harvest knowledge gained from massive quantities of design and simulation data,” said Ben Gu, corporate vice president of R&D for multiphysics systems analysis at Cadence. “Our revolutionary Millennium platform is a giant leap forward, delivering unprecedented acceleration and scalability of digital twin and AI applications. CFD is poised to benefit greatly from performance and efficiency gains, and the tremendous power of the Millennium M1 is disrupting industries that must explore more design innovations and bring them to market faster.”

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OMRON Automation has announced the introduction of TM S Series Collaborative Robots in its robotics portfolio in India. This latest addition to OMRON’s innovative lineup combines faster joints and expanded safety features, making it an ideal solution to improve the efficiency of factories in workspaces shared with people.

The new robots are designed to revolutionize industrial automation by enabling a more flexible and productive workspace where humans and robots can collaborate seamlessly. With increased speed and improved performance, the cobots can handle a wide range of tasks, including machine tending, assembly, and packaging. This allows human workers to focus on more complex and value-added activities, ultimately boosting overall productivity and efficiency.

One of the key highlights of the OMRON TM S Series is the enhanced safety features. Built with the latest advancements in safety technology, the cobots are equipped with integrated sensors, collision detection, and collaborative functionality. This ensures a safe working environment for both human operators and robots, eliminating the need for protective barriers and enhancing further collaboration between humans and machines.

 

 

“Signifying a significant portfolio expansion to strengthen OMRON’s positioning in the industrial robotics segment, the cobots are ideal for industries like logistics, consumer packaged goods, life sciences, digital hardware, etc. for assembly, palletizing, machine tending, packaging, and pick-and-place tasks. Compact and adaptable, they can be effortlessly relocated for various tasks using its built-in cameras and landmark positioning,” says Sameer Gandhi, MD, OMRON Automation, India.

Traditional factories often face challenges when integrating automation technology due to space constraints and safety concerns. The OMRON TM S Series addresses these issues by providing a flexible and easy-to-implement solution. The compact design makes it suitable for various work environments, even in spaces where traditional robots may not fit. With their small footprint and lightweight structure, they can be seamlessly integrated into existing production setup.

Also, the cobots can be easily programmed and operated using OMRON’s intuitive software, allowing for quick deployment and minimal disruption to existing workflows. The next-gen robot-stick control transforms into a full teach pendant with a touchscreen display. Hand guidance programming helps to convert program to flowchart-based graphical programming and script programming is also available for catering to both novice and advanced users.

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Author: Gunjan Malhotra, Director, Komaki Electric Division

India, the fifth-largest global automotive market, is expected to grow to the third-largest by 2030. The Indian Electric Vehicle (EV) industry is thriving, with sales of 8,38,766 units in the first seven months of 2023. Moreover, with 3 million registered EVs currently, India is projected to generate 10 million EVs annually by 2030.

Gunjan Malhotra, Director, Komaki Electric Division

These unprecedented developments in India’s burgeoning EV market are propelled by the significant contribution of the Internet of Things (IoT), Data, and connected technologies. On the other hand, the shift to software-defined vehicles (SDVs) further augments seamless connectivity with the induction of compatible protocols and hardware.

The automotive industry is transforming due to the software-defined vehicle and robust communications infrastructure. The connected car’s value lies in creating a more informed, intelligent mobility infrastructure, making travelling easier, less stressful, safer, and more sustainable. However, to combat growing Cybersecurity issues, it is crucial that automakers use upgraded protocols, encrypted channels, and authentication mechanisms to ensure confidentiality.

The EV industry can only thrive with a robust charging infrastructure, and in this sphere, IoT plays a path-breaking role. These charging stations work on connected devices integrated with third-party service providers, using protocols and cloud infrastructure for seamless charging operations. IoT combines OT and IT, focusing on digital transformation. EV charging consists of charging equipment, a mobile app, and a management platform. A single charging session generates telemetry data, including battery capacity, grid limits, power consumption, and troubleshooting data.

IoT in EV charging requires continuous monitoring and data presentation, enabling notifications for users in case of critical failures or updates. This benefits all stakeholders in the value chain, including EV drivers, Charge Point Operators (CPOs), and network operators. Key use cases include user authentication, charging app availability, automated operations, smart charging, remote management, and EVSE control.

The IoT-based infrastructure should also ensure secure transactions and billing, allow for automatic charging when energy rates vary during seasons, and enable Charge Point Operators to manage operations remotely. The IoT platform also collects data from various sensory nodes, analyzing important metrics like grid limit, energy tariffs, EV battery capacity, and state of charge, making it easier to control and manage a large fleet of charging infrastructure. Thereby, data is crucial for electric vehicles (EVs) as they form a connected network of devices, including cars, charging stations, smart meters, and IEDs.

These devices collect data on user habits, battery security, and grid charge management. OEMs collect data to improve user experience and design advanced technology for a seamless driving experience. For government and other stakeholders, data is essential for EV grid integration (EVGI) and providing support to smart cities and green infrastructure projects. Hence, there should be ample virtual space to store the data as millions of EVs are expected on the road in the next decade.

Road ahead

To achieve green milestones in the mobility sector, IoT is crucial for developing next-gen applications like smart charging and vehicle-to-grid, benefiting everyone from CPOs to grid suppliers. Being a forerunner in the IT sector, India is blessed with all those resources which could be helpful to push the EV industry with a robust IoT ecosystem for its safer and swifter transition.

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Typical applications include power supplies for industrial, server and telecom-infrastructure applications, and automotive signal conditioning and power conversion

STMicroelectronics’ high-accuracy TSZ151 operational amplifiers have very low offset voltage with minimal temperature drift, bringing enhanced accuracy and stability to circuits for sensor interfacing, signal conditioning, and current measurement.

An extremely low input offset voltage (Vio) is the defining parameter of a high-accuracy operational amplifier (op amp). The TSZ151 has Vio less than 7µV at 25°C. Moreover, the value remains stable, below 10µV, over the full specified temperature range, from -40°C to 125°C. Its high stability minimizes reliance on periodic recalibration, enhancing the availability of the end product throughout its lifetime.

With gain-bandwidth of 1.6MHz and drawing just 210μA at 5V, the TSZ151 sits between ST’s 400kHz TSZ121 and 3MHz TSZ181, giving designers more choice and flexibility to optimize speed and power consumption. The TSZ151 combines its excellent speed-to-power ratio with ultra-low maximum input bias current of 300pA.

Having a minimum operating voltage of 1.8V, the TSZ151 can be powered from the same rail as other ICs in the system, such as a low-voltage microcontroller. The rail-to-rail input and output help maximize dynamic range. The op amp also has very low power consumption, drawing just 210μA at 5V, while the low supply-voltage capability permits extended runtime with a discharged battery.

Leveraging its wide operating temperature range, from -40°C to +125°C, designers can use the TSZ151 in equipment to be deployed in harsh environments and in applications with long mission profiles. Typical uses include feedback circuitry in power supplies for industrial, server and telecom-infrastructure applications, and automotive high-accuracy signal conditioning and power conversion. The TSZ151 is AEC-Q100 qualified and is covered by ST’s rolling 10-year longevity plan that guarantees long-term product support.

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In the current fast-paced world, when safety and efficiency are critical in all facets of life, vehicle monitoring systems have become a transportation and logistics industry game-changer. These cutting-edge technologies improve security measures and optimize fleet management, among many other advantages. Let’s take a closer look at car monitoring systems, examining their many varieties, features, uses, advantages, and bright future.

What is a Vehicle Tracking System?

Real-time vehicle monitoring and management are made possible by vehicle tracking systems, sometimes referred to as fleet tracking systems or GPS tracking systems. It tracks the position, speed, and status of cars remotely by utilizing GSM (Global System for Mobile Communications) and GPS (Global Positioning System) technology.

Types of Vehicle Tracking Systems

There are several kinds of car tracking systems out there, each designed to meet particular requirements and tastes:

1. Passive Tracking Systems: These solutions allow data to be stored inside the car on a device that can be accessed and analyzed at a later time. Although they are inexpensive, they cannot be tracked in real-time.
2. Active Tracking Systems: With the real-time data transfer offered by active tracking systems, vehicle location, speed, and other parameters may be immediately monitored.
3. Satellite Tracking Systems: Since satellite communication is used to provide precise tracking, satellite-based tracking systems are perfect for rural or off-grid locations where standard cellular networks might not be accessible.

How Does a Vehicle Tracking System Work?

The onboard diagnostics system of a car uses GPS technology to operate in conjunction with vehicle tracking systems. Position data is gathered by GPS receivers mounted in the car and sent to a centralized server or cloud-based platform over cellular networks. Users can use mobile or web applications to get real-time tracking data and analytics.

Vehicle Tracking System Applications

There are numerous uses for vehicle tracking systems in different areas and businesses, such as:

1. Fleet Management: Tracking systems are used by firms that own fleets of cars, like delivery services and transportation companies, to keep an eye on driver safety, maximize fuel efficiency, and monitor vehicle routes.
2. Asset Tracking: Vehicle tracking systems are used to reduce the risk of theft and unlawful usage by tracking valuable assets, such as trailers and construction equipment.
3. Public Transportation: Tracking systems are used by public transportation companies to increase timetable adherence, improve passenger safety, and streamline operations.
4. Personal Vehicles: Individuals use tracking systems for personal vehicles to monitor teenage drivers, track stolen vehicles, and ensure family safety during road trips.

Benefits of Vehicle Tracking Systems

Installing tracking devices in cars has several advantages:

1. Improved Efficiency: Vehicle tracking solutions increase fleet productivity overall, cut down on idle time, and optimize route planning.
2. Enhanced Safety: In addition to ensuring that speed limits and safety standards are followed, real-time monitoring also encourages safer driving practices and allows for prompt emergency action.
3. Cost Savings: Through the reduction of fuel consumption, the mitigation of vehicle wear and tear, and the prevention of theft, tracking systems yield substantial cost savings for commercial enterprises.
4. Enhanced Customer Service: Accurate arrival times and timely delivery updates increase client happiness and loyalty.

Future of Vehicle Tracking Systems

Vehicle tracking systems have a bright future ahead of them as long as technology keeps developing. The capabilities of monitoring systems will be further enhanced by developments in AI (Artificial Intelligence), IoT (Internet of Things), and Big Data analytics. These developments will make it possible to track autonomous vehicles, do predictive maintenance, and seamlessly integrate with other smart city efforts.

In conclusion, vehicle tracking technologies, which provide unmatched efficiency, safety, and cost savings, have completely changed the way we manage and keep an eye on our cars. These systems will continue to be crucial in determining how logistics and transportation are developed in the future with continued improvements and innovations.

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Infineon Technologies is the first company in the industry to receive the ISO/SAE 21434 cybersecurity certification for its SLI37 automotive security controller family. This enables a high level of security with ISO/SAE-compliant products and will facilitate customer integration into automotive applications such as secured devices for V2X (Vehicle-to-everything) communication. It follows the certification of Infineon’s cybersecurity management system, which was announced in November 2022.

“At Infineon, we are constantly improving our security offering,” said Sebastien Colle, Vice President, ‘Security’ at Infineon. “We enable our customers to easily demonstrate their compliance with ISO/SAE 21434. I am particularly proud that the Common Criteria certification has been used as a bridge to demonstrate compliance with ISO/SAE 21434. This is a testament to the power of Common Criteria as a generic tool that can serve application verticals. With the combination of ISO/SAE 21434 and CC EAL6+ (high) certificates, Infineon’s SLI37 controllers provide the best benchmark for security verification in the automotive world today.”

The hardware-based security features of ISO/SAE 21434 certified devices can provide a reliable foundation for a multi-layered security architecture, enabling a root-of-trust. This plays an important role in the automotive industry, where system security is mandatory for vehicle safety. Therefore, Infineon’s SLI37 automotive cybersecurity solutions provide a secured foundation for automotive applications to comply with the ISO/SAE 21434 standard.

As part of the certification process, a security evaluation was conducted by TÜV-IT GmbH, an accredited and independent security evaluator, which concluded that the products have demonstrated resistance to attackers with high attack potential. This also includes protection against physical attacks such as fault and spike attacks, as well as power and side-channel analysis.

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In collaboration with device manufacturer OMS and pmdtechnologies, an expert in Time of Flight (ToF) technology, Infineon Technologies has developed a new high-resolution camera solution that enables enhanced depth sensing and 3D scene understanding for next-generation smart consumer robots. The new hybrid Time of Flight (hToF) solution combines two depth sensing concepts and helps significantly reduce maintenance effort and costs for smart robots.

Infineon’s REAL3 flexible ToF imager technology enables the combination of established high-resolution iToF flood illumination and dToF long-range spot illumination in a single hybrid Time of Flight camera. For many years now, this high-resolution technology has been used to see the smallest objects in the path of the robot and navigate around them. Adding precise long-range spot data now also allows the creation of an accurate 3D map of the surrounding area for intelligent path planning experiences even in challenging light conditions of bright sunlight or darkness that empower the next-generation robot vacuum cleaner.

The new solution reduces the height of robot vacuum cleaners by 20-30 per cent, fully replacing the top-mounted LDS (Laser Distance Scanner) making it possible to clean even under furniture with low clearance. Measuring only 31x16x8 mm, the hybrid ToF camera requires much less space for improved mapping and obstacle avoidance functionality. Making multiple sensors redundant, hybrid ToF reduces system costs as well as operation costs, since there are no moving parts that wear out over time.

The solution serves customers with a simplified and user-friendly approach to implementation. The compact hybrid ToF solution is versatile and robust and aligns well with the evolving needs of mobile consumer robot devices in various industries such as robot vacuum cleaners, commercial robots, air-purifiers and size measurement.

“The partnership with pmdtechnologies and OMS is a great example of how Infineon fosters technology innovation and digitalization together,” said Andreas Kopetz, Vice President Ambient Sensing at Infineon. “Our hybrid ToF solution caters to a rapidly expanding consumer robotic market with a wide array of applications and makes it possible for customers to come up with unique robot designs, on top of reduced system costs and complexity by one camera replacing multiple.”

“Infineon and pmdtechnologies’ hybrid ToF adopts an innovative patent architecture and is paired with dual illumination,” said Eden Xiao, General Manager, Jiangxi OMS Microelectronics Co., Ltd. “For a manufacturer like OMS, the solution has exceptional advantages such as small size, low power consumption, and a reduction of overall application cost. We are excited to utilize the unique optical design scheme that avoids multipath problems and achieves a combination of precise positioning and obstacle avoidance, further enhancing the competitiveness of hybrid ToF camera products.”

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