ELE Times

HSINCHU, Taiwan – August 1, 2023 – With Taiwan forecast to remain a top buyer of chipmaking equipment, the stage is set for SEMICON Taiwan 2023 as companies from across the electronics design and manufacturing supply chain gather for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 6-8, 2023, at TaiNEX 1 and 2 in Taipei.

The largest SEMICON Taiwan ever, the event is expected to draw more than 50,000 attendees while featuring 3,000 booths and 850 exhibitors. Themed Inspire Innovation. Empower Sustainability, SEMICON Taiwan 2023 will offer more than 20 forums spotlighting critical semiconductor industry topics including:

• Advanced Manufacturing
• Heterogeneous Integration
• Compound Semiconductors
• Automotive Chips
• Smart Manufacturing
• Sustainable Manufacturing
• Semiconductor Cybersecurity
• Talent

Taiwan is projected to maintain a top position in purchases of chipmaking equipment in 2023 and 2024, according to the recent Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective announced by SEMI.

“The semiconductor industry is the main driving force for technology development and critical to innovations that promise to help overcome some of the world’s greatest challenges,” said Terry Tsao, Global Chief Marketing Officer at SEMI and President of SEMI Taiwan. “SEMICON Taiwan 2023 will bring together representatives from the global microelectronics industry, governments, academia and research to set a path to a more prosperous, sustainable future.”

Top semiconductor industry executives will gather at the CEO Summit to examine vital innovation trends and keys to the industry’s success over the next 20 years. Featured speakers will include:

• Tien Wu, CEO of Advanced Semiconductor Engineering (ASE)
• Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC)
• Anirudh Devgan, President and CEO of Cadence Design Systems
• Tim Archer, President and CEO of Lam Research
• Toshiki Kawai, President and CEO of Tokyo Electron (TEL)

Top industry analysts will explore market trends, present industry forecasts and provide insights into how companies across the semiconductor ecosystems can navigate the unpredictable market environment. Speakers will include analysts from Gartner, McKinsey & Company, Morgan Stanley, Mizuho Bank, the SEMI Market Intelligent Team (MIT), and TechInsights.

With Taiwan a vital and reliable partner in the global economy, many regions have sought cooperation with the region in order to better adapt to a rapidly changing industry. Toward that end, SEMICON Taiwan 2023 will feature eight country pavilions including Australia, the Czech Republic, the UK, Italy, Japan, Poland and Singapore. In addition, the Silicon Europe Pavilion will feature Dutch and German exhibitors.

SEMICON Taiwan 2023 will feature 12 theme pavilions to showcase areas key to semiconductor industry growth including Heterogeneous Integration, Compound Semiconductor, Materials, Green Manufacturing, and Workforce Development.

The event will also host Smart Manufacturing Journey, themed AI-Driven Innovation of Future Automation. The interactive exhibition of virtual and real integration technology will showcase powerful, innovative artificial intelligence (AI) technologies and the latest developments in robotics and automation.

SEMICON 2023 will also include:

• Smart Manufacturing Expo Taiwan
• Heterogeneous Integration Global Summit
• Strategic Materials Conference Taiwan
• FLEX Taiwan 2023

Register for SEMICON Taiwan 2023 before August 15 for a 25% early-bird discount. Groups of more than three people receive a 50% early-bird discount.

Register for International Forums by August 15 for an early-bird discount of up to 50%.

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Electronic Industries Association of India (ELCINA) and SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, are jointly participated in the prestigious SemiconIndia 2023 Exhibition. The six-day event, underway at Mahatma Mandir, Gandhinagar, Gujarat, India from 25th July to 30th July, features three days exclusively dedicated to the student community for their skill development and three days exclusively for the business community.

The ELCINA SEMI pavilion witnessed an illustrious gathering of industry leaders, including esteemed ELCINA members such as Semiconductor Laboratory, Sahasra Semiconductors, Applied Materials India, Imagine Marketing, Kaynes Technology, Bergen Group, Continental Device, PCB Power, HLBS Tech, Tesscorn Nanoscience, Highness Microelectronics, Rakon India, ESSCI, Matrix Comsec, and RIR Power Electronics. The event served as a remarkable platform to showcase the vast potential of India’s burgeoning semiconductor ecosystem.

ELCINA’s dedicated efforts in the semiconductor domain have led to significant collaborations with prestigious organizations, including SEMI USA, government laboratories specializing in semiconductors such as GATEC, SCL, and SSPL, as well as academic institutions like IIT, IISC, and Manav Rachna University. These partnerships aim to drive innovation, research, and skills development in the semiconductor industry.

SemiconIndia 2023 is highlighting ELCINA’s notable contribution through the Semiconductor Special Group, a strategic initiative designed to tackle the distinctive challenges and opportunities encountered by the Indian semiconductor sector. This group is composed of two essential wings – the Workforce Development SIG and the Supply Chain SIG, each dedicated to enhancing crucial aspects of the semiconductor industry in collaboration with ESSI and SEMI.

Workforce Development SIG: The Workforce Development SIG’s primary objective is to bridge the skills gap in the semiconductor industry by fostering talent development and upskilling.

Supply Chain SIG: The Supply Chain SIG focuses on strengthening the semiconductor supply chain ecosystem in India. Through the ELCINA B2B portal, this wing aims to facilitate networking and collaboration among semiconductor supply chain players.

SemiconIndia Exhibition serves as a prominent platform for industry players to showcase their latest technologies, products, and services, fostering collaboration and networking within the semiconductor community.

Representing the Indian electronics industry, ELCINA is underscoring the remarkable strides made by the Indian semiconductor sector and underscore the pivotal role of local companies in the global supply chain. The exhibition provides a unique opportunity for ELCINA members to showcase their expertise and contributions to the semiconductor ecosystem.

Shri. Ajit Manocha, the President & CEO of SEMI, has emphasized the active role that SEMI plays in collaboration with ELCINA to make India a preferred destination in the semiconductor industry. This collaboration reflects the shared vision of both organizations to promote and strengthen the semiconductor ecosystem in India.

“We are thrilled to be a part of SemiconIndia 2023, as it provides an excellent platform for ELCINA and its members to demonstrate our technological capabilities,” said Shri Sanjay Agrawal, President of ELCINA. “Through this event, we aspire to promote the growth of the Indian semiconductor industry and foster collaborations that will drive its continued success.”

In addition to the exhibition, ELCINA actively engages in seminars and knowledge-sharing sessions, contributing valuable insights and perspectives on industry trends, challenges, and opportunities. The association endeavors to engage with attendees, industry stakeholders, and policymakers during the event.

ELCINA wholeheartedly welcomed the SemiconIndia 2023 event in Gandhinagar, Gujarat, and the Meity initiative aimed at promoting chip manufacturing in India. The Union government’s allocation of a $10 billion dedicated fund through the incentive scheme is a significant milestone, showcasing a strong commitment to attract investments and enhance the country’s domestic chip manufacturing capabilities.

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With the growing amount of electronic waste generated by consumers, industry and other sectors, it is critical to address this specific environmental issue. Reducing the carbon footprint and promoting sustainability are therefore key to achieving climate goals and improving environmental protection. This is why Infineon Technologies AG is taking another important step towards a greener future with the introduction of Soluboard®, a recyclable and biodegradable printed circuit board (PCB) substrate based on natural fibers and a halogen-free polymer. The product was developed by UK start-up Jiva Materials and helps to reduce the carbon footprint of the electronics industry.

Soluboard’s plant-based PCB material is made from natural fibers, which have a much lower carbon footprint than the traditional glass-based fibers. The organic structure is enclosed in a non-toxic polymer that dissolves when immersed in hot water, leaving only compostable organic material. This not only eliminates PCB waste, but also allows the electronic components soldered to the board to be recovered and recycled. By using Soluboard for its demo and evaluation boards, Infineon is making another important contribution to the testing of sustainable designs in the electronics industry.

“For the first time, a recyclable, biodegradable PCB material is being used in the design of electronics for consumer and industrial applications – a milestone towards a greener future,” said Andreas Kopp, Head of Product Management Discretes at Infineon’s Green Industrial Power Division. “We are also actively researching the reusability of discrete power devices at the end of their service life, which would be an additional significant step towards promoting a circular economy in the electronics industry.”

“Adopting a water-based recycling process could lead to higher yields in the recovery of valuable metals,” said Jonathan Swanston, CEO and co-founder of Jiva Materials. “In addition, replacing FR-4 PCB materials with Soluboard would result in a 60 percent reduction in carbon emissions – more specifically, 10.5 kg of carbon and 620 g of plastic can be saved per square meter of PCB.”

Currently, Infineon is using the biodegradable material to reduce the carbon footprint of demo and evaluation boards – but is also exploring the possibility of using thematerial for all boards to make the electronics industry more sustainable. In doing so, Infineon is following the European Commission’s “Green Deal” agenda, which aims to achieve climate neutrality by 2050 by making circularity the mainstream in our lives and accelerating the greening of the EU economy. In addition, the company is committed to the responsible collection and recycling of electronic products manufactured by Infineon in accordance with the EU Directive on Waste of Electrical and Electronic Equipment (WEEE).

Infineon has produced three different demo boards using Soluboard technology and plans to expand its offering over the next few years. More than 500 units are already in use to showcase the company’s power discretes portfolio, including one board that features components specifically for refrigerator applications. Based on the results of ongoing stress tests, the company plans to provide guidance on the reuse and recycling of power semiconductors removed from Soluboards, which could significantly extend the lifetime of the electronic components.

The research will also provide Infineon with a fundamental understanding of the design and reliability challenges customers face with the new material in their core applications. In particular, customers will benefit from the new knowledge as it will contribute to the development of sustainable designs.

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Amphenol RF expands its TNC product portfolio with new sealed rear mount bulkhead configurations designed for popular low loss cable types.

Amphenol RF is pleased to announce the expansion of the popular miniature sized TNC interface with additional configurations designed to accommodate micro coax cable types. These new configurations are IP67 rated which makes them ideal for applications that may experience temporary water or dust ingress due to exposure to external elements in harsh environments. They are ideal for outdoor use in antenna and industrial solutions.

These IP67 rear mount bulkhead jacks are manufactured mainly with nickel-plated, brass components including the body, hex nut, lock washer, inner ferrule and sleeve. The contact is constructed from gold-plated, beryllium copper. They are designed for use with 0.81 and 1.37 mm ultra-flexible micro coaxial cable with rear mounting for easy and secure mounting on the inside of a panel. These connectors offer an additional layer of protection for systems that may otherwise be compromised by weather-related issues.

The sealed TNC jacks join a growing portfolio of IP-rated products available at Amphenol RF. These products are well suited for remote outdoor enclosures, portable radios, handheld equipment and industrial and military equipment.

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Infineon Technologies AG introduces the new XENSIV 60 GHz radar sensor BGT60UTR11AIP. With a compact size of only 16 mm², it is the smallest 60 GHz radar sensor with antennas in package (AIP) on the market and is specifically designed for integration into the smallest devices. This makes the sensor ideal for vital sensing (heart and respiratory rate) and healthcare devices such as baby monitors and sleep trackers. It is also suitable for consumer electronics such as laptops, TVs and cameras, as well as smart home and building devices such as air conditioners, thermostats and smart doorbells. The radar sensor can also be used in industrial applications including robotics and tank level measurement.

The monolithic microwave integrated circuit (MMIC) is based on Infineon’s B11 SiGe BiCMOS technology, which ensures excellent radio frequency (RF) performance. The chip features an ultra-wide bandwidth of 5.6 GHz and a ramp speed of 400 MHz/µs. As a result, the sensor enables high-resolution frequency modulated continuous wave (FMCW) operation with sensitive presence and motion detection at a range of up to 15 m (50 ft). In addition, the sensor enables precise distance measurement, 1D gesture and vital sign detection, all with sub-mm motion detection capabilities. The integrated antennas provide a ±60° field of view. In addition, an integrated state machine enables real-time data acquisition without processor interaction. The MMIC also includes a 12-bit analog-to-digital converter (ADC) with a sampling rate of up to 4 MSPS (Mega Samples per Second).

The MMIC’s built-in broadcast mode allows multiple chips to be synchronized. It also includes on-chip sensors for measuring Tx output power and temperature. In addition, the sensor features ultra-low power operation enabled by hardware deep sleep mode. Its high integration level makes this MMIC ideal for optimizing system costs.

The XENSIV 60 GHz radar BGT60UTR11AIP can be ordered now and will begin shipping in the fourth quarter of 2023. For an initial evaluation of the radar sensor, Infineon provides the DEMO BGT60UTR11AIP and the Radar Development Kit (RDK), both available for download from the Infineon Developer Center (IDC).

In addition, Infineon’s associated partner RFbeam Microwave has integrated the BGT60UTR11AIP radar transceiver into its new V-LD1 level measurement module. RFbeam also offers an evaluation kit for the V-LD1 module, which can be used in conjunction with a lens to focus the radar beam to an area of 8 x 8.

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Asahi Kasei Microdevices (AKM) has launched the AK7709VQ, a new multicore digital signal processor (DSP) conceived for next-generation in-vehicle sound design. This powerful DSP enables the real-time largescale computational processing required to provide an immersive sound experience for passengers.

With the advent of self-driving cars, there will be less need for passengers to focus on the traffic, allowing more time to be spent on work, entertainment, or relaxation. As passengers’ expectations for the automotive environment evolve, the ability to create a customized, quiet setting with an accompanying premium listening experience will become a key differentiator for the in-cabin user experience.

As a total solution provider for the in-vehicle sound environment, AKM has provided premium sound technology used in cars around the world for more than 20 years. Bringing its expertise in the field of active premium sound to the next level, the company’s launch of the new AK7709VQ DSP further boosts the potential for a natural and immersive in-vehicle sound experience.

With a processing capability of 7,000 MIPS (Millions of Instructions per Second) and 2.75 MB of integrated memory, the AK7709VQ performs real-time high-resolution audio processing for multichannel speaker arrays, enabling a quiet cabin with immersive, incredibly detailed music playback. Additionally, the two integrated HiFi 4 DSP cores support various third-party software. The AK7709Q’s unique feature set, which features high sample rate multi-microphone voice processing, also allows for hands-free and in-car communication.  The built-in audio hub function, which includes 20 channels of asynchronous hardware sample rate conversion (ASRC), supports flexible digital input/output to and from many digital sources and endpoints.

In addition, AKM has applied its acclaimed audio PCB (Printed Circuit Board) design expertise to develop a sound design demo board combining the new DSP with the AK4499EXEQ, AKM’s flagship digital audio converter (DAC). This system demonstrates immersive in-vehicle sound and can be experienced by customers in demo cars at the company’s Garage Labs in Tokyo, Shanghai, and Shenzhen. Additional Garage Labs will make this experience available in North America and Europe in the fourth quarter of 2023.

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India’s leading EV Charger manufacturer Servotech Power Systems Ltd. is pleased to announce the establishment of a wholly owned new subsidiary Techbec Green Energy Pvt. Ltd. with the aim to indigenously manufacture key components for Electric Vehicle (EV) chargers. The subsidiary will be equipped with a state-of-the-art manufacturing facility spanning across 40,000 sq. ft. in Sonipat, Haryana, and will focus on the manufacturing of key EV charger components like Power modules, CCS 2 guns, Type 2 guns, Connectors, Control Cards, and PLC Modules and Lithium-ion Batteries.

Servotech along with its subsidiary envisages an initial investment of ₹30 Crores, which will be utilized to procure testing equipment, manpower, machinery, and cutting-edge technology and supporting other allied activities. Further, the company along with the subsidiary plans to invest ₹300 Crores additionally by March 2025 with an aim to achieve a prominent operational scale. Further to streamline the corporate structure, Servotech is divesting its stake of 63.5% in its subsidiary Techbec Global Solutions Pvt. Ltd.

This strategic decision to offer high-quality, domestically made components for EV charging infrastructure aligns perfectly with Servotech’s commitment to supporting the Make in India initiative while contributing to India’s transition towards cleaner and greener energy solutions.

Commenting on the announcement, the Founder and MD of Servotech, Raman Bhatia, stated “We are pleased to announce the establishment of our new subsidiary Techbec Green Energy Pvt. Ltd. Servotech together with its subsidiary, is set to embark on an initial investment of ₹30 Crores. This capital will be allocated towards acquiring testing equipment, hiring skilled manpower, obtaining advanced machinery and technology, and supporting other related activities. Furthermore, the company and its subsidiary intend to further invest ₹300 Crores by March 2025, aiming to attain a significant operational scale in the entire EV charging ecosystem. This capital infusion will serve to significantly bolster the company’s and its subsidiaries capabilities, unlocking its true potential for success.

This new subsidiary will have a team of experienced engineers and technicians. By manufacturing these key EV Charger components in-house, Servotech aims to enhance supply chain efficiency, reduce dependence on imports, and ensure the availability of safe, reliable and cost-effective solutions for the rapidly expanding EV market.

Our new subsidiary marks an important milestone in our journey towards supporting the widespread adoption of electric vehicles. By making EV charger components domestically, we aim to contribute to the Make in India initiative while ensuring availability of technologically advanced charging infrastructure for electric vehicle users.

Further, we would also like to highlight successful divestment of our subsidiary, Techbec Global Solutions Pvt. Ltd. that was primarily engaged in manufacturing battery storage solutions like lithium-ion batteries and other allied activities for EVs, E-rickshaws and varied solar-powered solutions. While the subsidiary has shown promising growth and achievements, the management envisions future goals that demand a broader platform for expansion and innovation. As part of its long-term vision, Servotech aims to focus its resources and investments on ventures that offer greater potential for scalable growth and market penetration. The divestment allows Servotech to realign its portfolio, optimize its resources, and pursue new opportunities in line with its core business objectives.  

Servotech aims to strengthen its position as a key player in the clean energy ecosystem and drive the transition to sustainable transportation. We remain committed to developing innovative solutions that contribute to be above mentioned mission.”

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Infineon Technologies AG, a global leader in power semiconductors, and SolarEdge Technologies, Inc. (“SolarEdge”), a global leader in smart energy technology, today announced the signing of a multi-year Capacity Reservation Agreement (CRA).

Extending the existing partnership, Infineon will supply SolarEdge with critical components for a variety of SolarEdge products. In addition to the CRA, the companies will collaborate on the development of future technologies and cutting-edge solar products based on wide-bandgap (WBG) materials that are key for global green energy supplies.

“We are excited to expand our strategic partnership with SolarEdge to shape innovation in green energy technologies and decarbonization”, said Andreas Urschitz, Chief Marketing Officer at Infineon. “Our long-lasting collaboration is an enormous asset for both companies that paves the way for breakthrough-innovation and accelerated growth, as we combine our expertise and resources. With the latest investments in silicon carbide (SiC) and gallium nitride (GaN) manufacturing capacity, Infineon underlines its commitment to be a leading partner in climate technologies such as solar power.”

Uri Bechor, Chief Operating Officer at SolarEdge, said: “Securing the capacity levels of critical components such as power and wide-bandgap from Infineon enhances SolarEdge’s supply chain resiliency. This Capacity Reservation Agreement with Infineon is in line with our strategy to continue leading the global industry in solar energy advancement.”

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Compliant With the ONFI 1.0 Specification, 1Gb to 8Gb AS9F Series Devices Deliver Fast Block Erase Times Down to 3 ms

To meet the increasing demand for legacy SLC parallel NAND flash memory products in the automotive, industrial, communications, and consumer electronics markets, Alliance Memory today introduced the new AS9F series of 1.8V and 3.3V devices with densities from 1Gb to 8Gb and fast block erase times down to 3 ms typical.

“While new designs are migrating toward serial NAND flash for mass storage, many of our customers’ existing designs still require parallel NAND flash solutions, which are becoming increasingly difficult to find,” said David Bagby, president and CEO of Alliance Memory. “With our AS9F series, we’re perfectly positioned to provide our customers with a reliable source for these cost-effective solutions moving forward, saving them the expense of redesigns.”

Compliant with the ONFI 1.0 specification and offering an x8 I/O interface, the memory solutions released today are ideal for use in chipsets for Wi-Fi routers, DSL and cable modems, set-top boxes, digital TVs, artificial intelligence (AI) speakers, Internet of Things (IoT) devices, and more. Divided into blocks that can be erased independently, AS9F series products allow valid data to be preserved in these applications while old data is erased.

Delivering reliable, long-term performance, the parallel NAND flash devices feature 100,000 program/erase cycles — with 4-bit ECC per 528 bytes — and 10-year data retention. Offered in the 9.0 mm by 11.0 mm by 1.0 mm 63-ball FBGA package, the RoHS-compliant solutions are available in industrial (-40°C to +85°C) and automotive (-40°C to +105°C) temperature ranges.

Samples and production quantities of the 1.8V and 3.3V SLC parallel NAND flash memory products are available now, with lead times of 12 weeks.

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A small footprint of discrete power MOSFETs plays a critical role in achieving space savings, cost reduction, and easy-to-design applications. Additionally, higher power density can lead to layout routing flexibility and overall system size reduction. By expanding the current PQFN 2×2 portfolio with the new best-in-class OptiMOS power MOSFETs, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) offers benchmark solutions optimized for efficiency and performance in a small footprint. The new products are ideal for applications like synchronous rectification in switched mode power supplies (SMPS) for servers, telecom, and portable- and wireless chargers. Additional applications also include electric speed controllers for small brushless motors in drones.

The new OptiMOS 6 40 V and OptiMOS 5 25 V and 30 V power MOSFETs further optimize the proven OptiMOS technology for high-performance designs. They offer leading-edge silicon technology, package reliability, and superior thermal resistance (RthJC, max = 3.2 K/W) in the ultra-small PQFN 2×2 mm² package. The new devices combine industry-leading low on-resistance RDS(on) with industry-leading figures of merit (FOMs, QG and QOSS) for outstanding dynamic switching performance. As a result, MOSFETs with ultra-low switching and reduced conduction losses ensure optimal energy efficiency and power density, all while simplifying thermal management.

With the compact PQFN 2×2 mm2 package outline, the OptiMOS power switches enable an improved system form factor with smaller, more flexible geometric outlines for end-user applications. The MOSFETs facilitate reliable system design with less need for paralleling, significantly reducing space and system cost.

The new OptiMOS 6 power MOSFET 40 V (ISK057N04LM6) with 5.7 mΩ RDS(on) and OptiMOS 5 power MOSFETs 25 V (ISK024NE2LM5) and 30 V (ISK036N03LM5) with 2.4 mΩ and 3.6 mΩ RDS(on), respectively, are available in the improved PQFN 2×2 mm2 package and can be ordered now.

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Rail transportation plays a crucial role in many modern transportation networks. It’s essential to ensure that rail transportation is safe and efficient, which requires constant improvements. The integration of industrial computers in railway applications has been a significant development contributing to railway safety through the railway detection system, passenger convenience through passenger information display systems (PIDS), and personal safety through in-car surveillance. Cincoze’s latest addition to the Rugged Computing – DIAMOND product line, the efficient and compact DX-1200 embedded industrial computer, is an excellent choice for these railway computing applications due to its high efficiency, stable operation, wide temperature support, expandability, and rich I/O.

Railway detection systems that use real-time monitoring to detect situations and events, ensuring safe and smooth operations. It provides the driver with control suggestions and relays data to the Operation Control Center (OCC) for vehicle scheduling, equipment monitoring, and fault handling. The DX-1200 provides the required performance, graphics processing, and data transmission for these tasks with a 12th gen Intel® Alder Lake-S processor that has efficient cores for multi-tasking and performance cores for complex data analysis. The DX-1200 supports up to 64GB of DDR5 4800MHz memory, with ECC error correction technology that detects and corrects errors in real time, ensuring stability and reliability. It also includes the UHD 770 graphics chip with Intel® Xe architecture for powerful graphics processing, providing high-res images and visual data analysis. Various I/O interfaces, including 10GbE LAN or USB 3.2, provide high-speed data delivery.

The two primary in-car applications are the Passenger Information Display System (PIDS) and the surveillance system. PIDS connects with the control center to gather real-time train arrival and departure information, train numbers, operation status, and other useful information. The in-car surveillance system uses highly accurate cameras and sensors to monitor the environment, ensuring a safe and comfortable ride for passengers. The DX-1200 supports up to 8x 1Gbps LAN with optional PoE, providing data transmission and power through a single cable, reducing the complexity of wiring. Optional M12 connectors (A-coded and X-coded) are also available to meet the requirements of railway computing applications. Wireless connectivity is covered by DX-1200’s 1x M.2 Key E slot and 2x Mini PCIe slots that support add-on cards for WiFi, GNSS, 4G, and Bluetooth.

Safety is the top priority in rail transportation. The DX-1200 has passed EU EN 50121-3-2 (railway EMC) and EN 45545-2 fire protection standards, providing evidence of its safety in rail transportation. In addition to safety, it boasts a robust design, including wide temperature (-40 – 70°C) and wide voltage (9 – 48 VDC) support, and overvoltage, overcurrent and ESD protection. The DX-1200 has passed the US military specification MIL-STD-810G, showing excellent performance in withstanding shock and vibration in the railway environment.

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ASRock Industrial, the leading provider of global industrial motherboards and systems, has released new Mini PCs and motherboards powered by Intel Processor N97 (Alder Lake-N). The available selections include NUC BOX-N97, iBOX-N97, and Motherboard Series consisting of NUC-N97, Pico-ITX (SOM-P104), SBC 3.5’’ (SBC-260, SBC-261), and Mini-ITX (IMB-1005, IMB-1006, IMB-1007) form factors. Compared to the previous Intel Celeron Processor J6412 (Elkhart Lake), the Intel Processor N97 (Alder Lake-N) showcases remarkable CPU performance increase of up to 37% and graphics performance up to 154%. The new NUC BOX-N97, iBOX-N97, and NUC-N97 Motherboard Series provide rich I/O and expansion options, including triple displays up to 4K at 60Hz, dual 2.5G LAN, and dual storages with SATA 3.0 and M.2 Key M, catering to diverse application needs, such as entertainment, office, business, retail, transportation, embedded, industrial, and beyond.

The NUC BOX-N97 Mini PC is compact in size, measuring 117.5 x 110.0 x 47.85mm (L x W x H) with fanned barebone design, offering a rich selection of I/Os and expansion slots for streamlined versatility. Based on Intel Processors N97 (Alder Lake-N), it guarantees CPU and graphics performance. For Ethernet connectivity, the NUC BOX-N97 provides dual 2.5 Gigabit LAN, and one M.2 (Key E, 2230) bundled with AMD RZ608 Wi-Fi 6E Module for wireless connection, plus diverse I/Os, including five USB 3.2 Gen2 (two Type C and three Type A), one audio and microphone jack. The NUC BOX-N97 also provides excellent visual capabilities, supporting triple-display with HDMI 2.0b and DP 1.4a (through Type-C) up to 4096×2160@60Hz. The system offers dual storages with one M.2 (Key M, 2242/2260/2280), one SATA 3.0, and supports one 260-pin SO-DIMM DDR4 3200MHz up to 16GB. In addition, the NUC BOX-N97 comes with a 19V/65W power adaptor and VESA mounting bracket for space-saving installation, with TPM 2.0 onboard for enhanced security. The NUC BOX-N97 is the choice designed to meet the advancement of your needs in home entertainment, office productivity, business, and embedded applications.

The fanless iBOX-N97, based on Intel Processors N97 (Alder Lake-N), is conveniently sized with aluminum housing, measuring 135 x 110 x 44.5mm (L x W x H). The Series supports a single 260-pin SO-DIMM DDR4 3200MHz up to 16GB of memory. For high-speed connectivity, the Series features dual Realtek 2.5 Gigabit LAN, plus one M.2 (Key E, 2230) slot with PCIex1 and USB 2.0. It offers a total of six USB3.2 Gen 2 ports (two Type C and four Type A), as well as dual storages with M.2 (Key M, 2242/2260/2280) and SATA 3.0. Additionally, the iBOX-N97 provides an enhanced visual experience with support for triple-display through two HDMI 2.0b and two DP 1.4a (from Type C), with a maximum resolution of up to 4096×2160@60Hz. The Series is equipped with various mounting options, including VESA mount, wall mount, and DIN rail to offer flexibility for diverse applications. Other key features also include 19V/65W power adaptor, and TPM 2.0 onboard for enhanced cybersecurity. These features combine to create the all-inclusive option suitable for embedded, industrial, and edge computing utilizations.

Additional releases based on the Intel Processors N97 (Alder Lake-N) also include the Motherboard Series, encompassing various form factors, including the NUC-N97, Pico-ITX (SOM-P104), the SBC 3.5 inch models (SBC-260 and SBC-261), and Mini-ITX models (IMB-1005, IMB-1006, IMB-1007). These models offer enhanced performance in both DDR4 and DDR5 configurations, and feature support for diverse industrial-centric I/Os and expandability.

The NUC-N97, adhering to NUC form factor specifications with measuring 4.09 x 4.02 inch is designed for advanced computing capabilities with expanded I/Os and expansions, including two 2.5 Gigabit LAN for solid connectivity, one M.2 (Key E, 2230) for Wi-Fi, six USB 3.2 Gen2, two USB 2.0, and one COM. Great visuals are provided with support of triple-display over HDMI 2.0b and DP 1.4a (from Type C), holding maximum resolutions up to 4096×2160@60Hz. Moreover, dual storages include one M.2 (Key M, 2242/2260/2280), and one SATA 3.0 for SSD with one 260-pin SO-DIMM DDR4 3200MHz up to 16GB of memory.

Additional motherboards that support DDR4 3200 MHz memory and triple-display, including IMB-1005 and IMB-1006, featuring dual 2.5G LAN, while SBC-260 supports one 2.5G and one 1G LAN ports. The DDR5 4800MHz configurations include models like SOM-P104, which comes with 2.5 Gigabit LAN, as well as SBC-261 and IMB-1007 both featuring dual 1 Gigabit LAN, all supporting triple displays. The newly releases products are equipped with Intel Processor N97 (Alder Lake-N), offering improved graphics capability, breakthrough memory up to DDR5, and rich I/O features to improve the customer’s experience over prior generation, fulfilling the demands of various IoT edge applications.

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Asahi Kasei has begun licensing of technology for the design and manufacture of lithium-ion capacitors (LiCs) based on its proprietary lithium pre-doping technology1. The novel proprietary doping method enables LiCs to be manufactured at lower cost with generally available materials and equipment which are used for manufacturing lithium-ion batteries (LiBs), while enabling the design and manufacture of LiCs with increased capacity and improved input/output performance.

The licensing includes not only Asahi Kasei’s intellectual property related to LiC technology, but also technical expertise such as cell design and manufacturing with pilot equipment.  By licensing its technology, Asahi Kasei expects to support licensees around the world to significantly reduce LiC development times and achieve low-cost LiC manufacture utilizing existing equipment.

Demand for energy storage devices is forecasted to continue rising due to the spread of electric mobility and increased use of renewable energy.  The LiC is a next-generation energy storage device that uses the same material as an electric double layer capacitor (EDLC) for the cathode and the same material used as a LiB for the anode.  As LiCs have higher input/output characteristics than LiBs, they are suited to fields where instantaneous power is needed, and can be quickly recharged.  Also featuring long cycle life and high safety, LiCs are expected to be used in mobility applications such as electric trams and buses which charge at each stop instead of using power from overhead lines.

In the growing field of energy storage systems (ESS) for renewable energy such as solar and wind, it is possible to extend the service life of LiBs by using LiCs in conjunction to reduce the LiB charge/discharge load.  This is expected to reduce both running costs and environmental impact through less frequent replacement of LiBs, generating less waste.

The conventional LiC manufacturing process requires expensive materials for pre-doping, such as perforated foil and lithium metal foil.  Furthermore, as lithium metal is highly reactive and hazardous, additional costs are incurred to maintain a safe working environment.

Asahi Kasei developed a low-cost pre-doping method using inexpensive lithium carbonate as the source of lithium ions, eliminating the need for expensive materials such as perforated foil and lithium metal foil.  With this novel doping method, lithium carbonate is included in the cathode and pre-doping is performed at initial charging, when nearly all of the lithium carbonate decomposes, and lithium ions transfer to the anode.  This not only allows the manufacture of LiCs using materials and equipment similar to those used in the manufacture of LiBs, but also enables capacity and input/output performance to be raised by a factor of 1.3 or more (compared to Asahi Kasei’s conventional LiCs).

Asahi Kasei has already licensed this technology, and will continue offering it to other licensees in order to support further adoption and application development of the LiC as a next-generation energy storage device which contributes to the world’s sustainability.

1 Lithium ions are pre-doped in the anode, keeping the anode potential lower than the electrolytic solution potential, allowing a larger energy density due to improved withstand voltage and increased capacitance of the capacitor itself compared to conventional EDLC.

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Within the average large enterprise, sensitive data is being shared to generative AI apps every hour of the working day

Netskope, a leader in Secure Access Service Edge (SASE), today unveiled new research showing that for every 10,000 enterprise users, an enterprise organization is experiencing approximately 183 incidents of sensitive data being posted to the app per month. Source code accounts for the largest share of sensitive data being exposed.

The findings are part of Cloud & Threat Report: AI Apps in the Enterprise, Netskope Threat Labs’ first comprehensive analysis of AI usage in the enterprise and the security risks at play. Based on data from millions of enterprise users globally, Netskope found that generative AI app usage is growing rapidly, up 22.5% over the past two months, amplifying the chances of  users exposing sensitive data.

Netskope found that organizations with 10,000 users or more use an average of 5 AI apps daily, with ChatGPT seeing more than 8 times as many daily active users as any other generative AI app. At the current growth rate, the number of users accessing AI apps is expected to double within the next seven months.

Over the past two months, the fastest growing AI app was Google Bard, currently adding users at a rate of 7.1% per week, compared to 1.6% for ChatGPT. At current rates, Google Bard is not poised to catch up to ChatGPT for over a year, though the generative AI app space is expected to evolve significantly before then, with many more apps in development.

Netskope found that source code is posted to ChatGPT more than any other type of sensitive data, at a rate of 158 incidents per 10,000 users per month. Other sensitive data being shared in ChatGPT includes regulated data- including financial and healthcare data, personally identifiable information – along with intellectual property excluding source code, and, most concerningly, passwords and keys, usually embedded in source code.

“It is inevitable that some users will upload proprietary source code or text containing sensitive data to AI tools that promise to help with programming or writing,” said Ray Canzanese, Threat Research Director, Netskope Threat Labs. “Therefore, it is imperative for organizations to place controls around AI to prevent sensitive data leaks. Controls that empower users to reap the benefits of AI, streamlining operations and improving efficiency, while mitigating the risks are the ultimate goal. The most effective controls that we see are a combination of DLP and interactive user coaching.”

Netskope Threat Labs is currently tracking ChatGPT proxies and more than 1,000 malicious URLs and domains from opportunistic attackers seeking to capitalize on the AI hype, including multiple phishing campaigns, malware distribution campaigns, and spam and fraud websites.

Blocking access to AI related content and AI applications is a short term solution to mitigate risk, but comes at the expense of the potential benefits AI apps offer to supplement corporate innovation and employee productivity. Netskope’s data shows that in financial services and healthcare – both highly regulated industries – nearly 1 in 5 organizations have implemented a blanket ban on employee use of ChatGPT, while in the technology sector, only 1 in 20 organizations have done likewise.

“As security leaders, we cannot simply decide to ban applications without impacting on user experience and productivity,” said James Robinson, Deputy Chief Information Security Officer at Netskope. “Organizations should focus on evolving their workforce awareness and data policies to meet the needs of employees using AI products productively. There is a good path to safe enablement of generative AI with the right tools and the right mindset.”

In order for organizations to enable the safe adoption of AI apps, they must center their approach on identifying permissible apps and implementing controls that empower users to use them to their fullest potential, while safeguarding the organization from risks. Such an approach should include domain filtering, URL filtering, and content inspection to protect against attacks. Other steps to safeguard data and securely use AI tools include:

• Block access to apps that do not serve any legitimate business purpose or that pose a disproportionate risk to the organization.
• Employ user coaching to remind users of company policy surrounding the use of AI apps.
• Use modern data loss prevention (DLP) technologies to detect posts containing potentially sensitive information.

In conjunction with the report, Netskope announced new solution offerings from SkopeAI, the Netskope suite of artificial intelligence and machine learning (AI/ML) innovations. SkopeAI leverages the power of AI/ML to conquer the limitations of complex legacy tools and provide protection using AI-speed techniques not found in other SASE products.

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First in industry to launch 8-high 24GB HBM3 Gen2 with bandwidth over 1.2TB/s and superior power efficiency enabled by advanced 1β process node

Micron Technology, Inc. (Nasdaq: MU), today announced it has begun sampling the industry’s first 8-high 24GB HBM3 Gen2 memory with bandwidth greater than 1.2TB/s and pin speed over 9.2Gb/s, which is up to a 50% improvement over currently shipping HBM3 solutions. With a 2.5 times performance per watt improvement over previous generations, Micron’s HBM3 Gen2 offering sets new records for the critical artificial intelligence (AI) data center metrics of performance, capacity and power efficiency. These Micron improvements reduce training times of large language models like GPT-4 and beyond, deliver efficient infrastructure use for AI inference and provide superior total cost of ownership (TCO).

The foundation of Micron’s high-bandwidth memory (HBM) solution is Micron’s industry-leading 1β (1-beta) DRAM process node, which allows a 24Gb DRAM die to be assembled into an 8- high cube within an industry-standard package dimension. Moreover, Micron’s 12-high stack with 36GB capacity will begin sampling in the first quarter of calendar 2024. Micron provides 50% more capacity for a given stack height compared to existing competitive solutions. Micron’s HBM3 Gen2 performance-to-power ratio and pin speed improvements are critical for managing the extreme power demands of today’s AI data centers. The improved power efficiency is possible because of Micron advancements such as doubling of the through-silicon vias (TSVs) over competitive HBM3 offerings, thermal impedance reduction through a five-time increase in metal density, and an energy-efficient data path design.

Micron, a proven leader in memory for 2.5D/3D-stacking and advanced packaging technologies, is proud to be a partner in TSMC’s 3DFabric Alliance and to help shape the future of semiconductor and system innovations. As part of the HBM3 Gen2 product development effort, the collaboration between Micron and TSMC lays the foundation for a smooth introduction and integration in compute systems for AI and HPC design applications. TSMC has received samples of Micron’s HBM3 Gen2 memory and is working closely with Micron for further evaluation and tests that will benefit customers’ innovation for the next-generation HPC application.

The Micron HBM3 Gen2 solution addresses increasing demands in the world of generative AI for multimodal, multitrillion-parameter AI models. With 24GB of capacity per cube and more than 9.2Gb/s of pin speed, the training time for large language models is reduced by more than 30% and results in lower TCO. Additionally, the Micron offering unlocks a significant increase in queries per day, enabling trained models to be used more efficiently. Micron HBM3 Gen2 memory’s best-in-class performance per watt drives tangible cost savings for modern AI data centers. For an installation of 10 million GPUs, every five watts of power savings per HBM cube is estimated to save operational expenses of up to $550 million over five years.

“Micron’s HBM3 Gen2 technology was developed with a focus on unleashing superior AI and high-performance computing solutions for our customers and the industry,” said Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group. “One important criterion for us has been the ease of integrating our HBM3 Gen2 product into our customers’ platforms. A fully programmable Memory Built-In Self Test (MBIST) that can run at the full specification pin speed positions us for improved testing capability with our customers, creates more efficient collaboration and delivers a faster time to market.”

“At the core of generative AI is accelerated computing, which benefits from HBM high bandwidth with energy efficiency,” said Ian Buck, vice president of Hyperscale and HPC Computing at NVIDIA. “We have a long history of collaborating with Micron across a wide range of products and are eager to be working with them on HBM3 Gen2 to supercharge AI innovation.”

Micron developed this breakthrough product by leveraging its global engineering organization, with design and process development in the United States, memory fabrication in Japan and advanced packaging in Taiwan. Today’s announcement is another milestone in Micron’s technology leadership in the industry. Micron previously announced its 1α (1-alpha) 24Gb monolithic DRAM die-based 96GB DDR5 modules for capacity-hungry server solutions and today introduced the1β 24Gb die-based 24GB HBM3 offering. In the first half of calendar 2024, the company plans to make available its 1β 32Gb monolithic DRAM die-based 128GB DDR5 modules. These offerings demonstrate Micron’s leading-edge technology innovations for AI servers.

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The advent of 5G is poised to revolutionize industrial automation, propelling it to unprecedented levels. This next generation of cellular communications technology will significantly enhance the trend of integrating a factory’s operational technology (OT). It encompasses its machinery, control systems, power infrastructure, and local and remote control software – with its information technology (IT) systems, including the communication network, enterprise resource planning (ERP) system, cloud services, and more.

Sakshi Jain, Sr. Sub Editor-ELE Times had an opportunity to interact with Ludger Boeggering, Senior Principal Segment Manager EMEA Energy & Automation, u-blox.  He talked about the industrial automation that will become more intricate and robust with the implementation of 5G technology. Excerpts.

Ludger Boeggering: From a technology point of view and according to 3GPP, the difference lies in the control logic. In the case of a non-standalone (NSA) 5G network, a 4G/LTE infrastructure is necessary to control the communication. While a standalone (SA) 5G network, on the other hand, is pure 5G implementation. From a user’s point of view, this means that implementation of a private 5G network (Non-Public Network, or NPN) based on SA is significantly leaner and costs less effort. From an application point of view, it is to be expected that an SA network will enable higher availability and reliability, as well as lower turnaround-time, especially in the context of NPNs.

Ludger Boeggering: Since 5G is by definition an umbrella term for a wide range of technologies (eMBB, uRLLC, eMTC and RedCap), it will also enable a wide range of applications. To name just a few, predictive maintenance, environmental monitoring, service and configuration, connected tools as well as safe connected worker benefit from functions defined in eMTC and RedCap. eMTC is already available with LTE-M and NB-IoT and is being consistently developed further by 3GPP.

Furthermore, applications such as industrial assembly solutions, process automation control, human machine interface (HMI) and aiding via augmented reality, but also factory logistics, mobile robotics, cobots and AGV will benefit from the capabilities of RedCap and uRLLC. Above all, the focus here is on reliable response times with sufficient bandwidth and cost-efficient products.

The technology will be used across all relevant industry verticals in the coming years, for example manufacturing (machine, aerospace, automotive, semiconductors), chemical and petrochemical, pharmaceutical, oil and gas, energy and utilities, water and waste water treatment. This is certainly due to the technology itself, but also to the regulatory framework and the dedicated use of spectrum.

Ludger Boeggering: We first need to take the different characteristics of 5G into account.

In use cases that require high reliability and availability, low latency plays an important role. 5G offers by design significantly lower latency and higher availability compared to previous generations of mobile networks.

5G technology enables network slicing, which creates virtual networks tailored to specific applications or services. This allows industrial automation to have dedicated slices that are optimized for their specific needs and it also ensures high reliability and performance.

Edge computing will grow in importance in the future. 5G networks can use edge computing, which brings data processing closer to the devices and sensors. This reduces the time and energy required to transmit data to remote data centers, resulting in faster response times and improved performance in industrial automation processes.

And, last but not least, 5G supports mMTC, which allows a large number of devices to be connected simultaneously. In industrial automation, this means that numerous sensors, actuators and devices can be connected within the same network, improving overall efficiency in terms of utilisation and investment.

Ludger Boeggering: The technology itself has little impact on these parameters. What matters is the implementation as a whole system. 5G allows secure communication environments to be created with an allocated frequency spectrum. Solutions based on wireless technologies are also much easier and more flexible to integrate into an industrial environment. This means that process data can be collected and analyzed in a more targeted manner. With these possibilities, one can create a digital twin and/or ensure a reliable status monitoring, which allows for preventive actions to be taken at any time. With smart use of this technology, processes can then be reliably executed and clever-as-a-service models can be built. This reduces downtime to a necessary minimum, avoids misproduction, and ensures that employees and materials are allocated in a targeted manner.

Ludger Boeggering: 5G is another building block for mastering the challenges of implementing digitalization. Essentially, it helps to implement automation faster and promotes the desire for more flexibility. Key elements are availability and reliability

Ludger Boeggering: Basically, I would first like to stress out that technology always follows the use case problem. The strengths of 5G also lie in its weaknesses – for example, time-critical applications in the milli- or even micro-second range will continue to be cable-based. No one will seriously spend the effort and costs today to build a corresponding 5G solution.

Even in the future, we will continue to find a variety of technologies in the industrial automation environment. One-size-fits-all does not exist.

If you still want to benefit from the advantages of flexibility and an independent, secure, campus-like area coverage, you will have to create a corresponding infrastructure, which entails an initial investment.

In the first described challenge of 5G technology use in industrial automation, one must manage expectations. More solutions will appear in the future to build the infrastructure, which will also allow small-scale deployments.

In addition, as many use cases as possible should use the same infrastructure to maximize user benefits. Network infrastructure must be designed to take these different requirements into account, and vendors must provide appropriate equipment.

Furthermore, a key aspect of implementing 5G in the automation environment is end-to-end traceability. The operator or integrator of a 5G-based solution must always be able to analyze every part of the communication infrastructure in order to quickly identify errors and restore operation.

Ludger Boeggering: This is a very broad question, and I would try to answer it more from a use case perspective. Let’s take as examples use cases such as predictive maintenance or environmental monitoring, where the focus is on deep penetration, high subscriber numbers and easy-to-use existing infrastructure. This mainly involves the use of the traditional spectrum bands of the public network providers.

In other use cases, such as process automation control and aiding via augmented reality, availability and reliability are paramount. This is where the strengths of private networks, including data security, come into full play. The spectrum available for such installations is in the mid-GHz range between 3.xx and 4.xx GHz, and the relevant licences for individual spectrums have been issued by regulatory authorities for a number of years on comparatively attractive terms for local use.

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A subsidiary of Foxconn, the prominent Taiwanese electronics manufacturing giant, is reportedly considering a significant investment of up to $200 million to establish an electronic components plant in Chennai, Tamil Nadu. According to Reports, Foxconn Industrial Internet (FII) CEO Brand Cheng and other company representatives recently met with Tamil Nadu Chief Minister MK Stalin and government officials to discuss the potential investment in the southern state.

FII has presented a plan to state officials outlining an initial investment of $180 million to $200 million for the facility, with the aim of completing the plant by 2024 and considering further investments thereafter. However, a final decision on the matter is yet to be made.

Foxconn Industrial Internet is known for manufacturing communication, mobile network, and cloud computing equipment. Additionally, Foxconn already has an extensive campus near Chennai where it assembles Apple’s iPhones.

Apart from Tamil Nadu, the Karnataka state government in south India has also engaged in discussions with FII, where the company expressed commitment to invest $1.07 billion for another new plant.

Furthermore, Foxconn is exploring opportunities in India’s semiconductor sector and is in talks with the Gujarat state government for potential entry into this area. On the occasion of the Semicon India 2023 event in Gandhinagar on July 28, Prime Minister Narendra Modi and Foxconn Chairman Young Liu are scheduled to be present. India aims to establish itself as a semiconductor manufacturing hub, with the local market’s value projected to reach $80 billion by 2028, four times its current size of $23 billion.

In the past, the Indian government announced a $10 billion scheme to promote domestic chip manufacturing, attracting interest from companies like Foxconn and local conglomerate Vedanta Ltd. However, none of these proposals has materialized thus far. It’s worth noting that Foxconn recently backed out of a $19.5 billion chips joint venture with Vedanta, citing delays in the project’s progress. The company now plans to apply separately for setting up a semiconductor unit in India.

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Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is an authorized global distributor for Silicon Labs, a leading manufacturer of secure, intelligent wireless technology. Since 2006, Mouser’s partnership with Silicon Labs has supported the product development process for Mouser customers throughout the world in Internet of Things (IoT), lighting, and AI/ML applications.

Mouser, the authorized global distributor with the newest semiconductors and electronic components, now stocks more than 1,250 different parts from Silicon Labs, as well as 6,805 part numbers available to order. Silicon Labs products include the EFR32BG24 Bluetooth wireless system-on-chip (SoC) devices. Designed for wireless connectivity using Bluetooth Low Energy and Bluetooth Mesh, these SoCs allow IoT designers to create smart, energy-efficient solutions quickly. The EFR32BG24 SoCs also boast a wide range of security features, protecting product designs from remote and local cyberattacks. These wireless SoCs offer low current consumption, an AI/ML hardware accelerator and a high-performance 2.4 GHz RF. The devices support a range of smart home applications, including sensors, door locks, smart plugs, and portable medical devices.

The EFR32MG24 Series 2 multiprotocol wireless SoCs from Silicon Labs deliver ideal mesh wireless IoT connectivity using Matter, OpenThread, and Zigbee protocols. The multiprotocol SoCs feature an Arm Cortex-M33 core with a maximum operating frequency of 78 MHz, as well as up to 1.5 Mbytes of Flash and 256 Kbytes of RAM. The EFR32MG24 SoCs also feature an AI/ML hardware accelerator, providing reliable performance for predictive maintenance and glass break and wake-word detection.

The Silicon Labs Pro Kit for Amazon Sidewalk is pre-programmed with Amazon Sidewalk firmware and pre-registered on AWS, making it an ideal choice for quickly and easily developing Amazon Sidewalk devices. The Amazon Sidewalk kit features BLE, FSK and CSS capabilities, allowing designers to focus on innovation rather than testing and integration. Amazon Sidewalk creates shared wireless networks, connecting IoT devices beyond the smart home throughout the neighborhood and city.

The BT122-DK4315B Bluetooth LE module development kit, available to order, provides a demonstration and development platform for the BT122 wireless module, also available to order. The kit includes a BT122-DK4315B board with two push buttons, two LEDs, a temperature sensor, and a Si7021 relative humidity sensor. The board features a J-Link debugger with a high-speed UART to USB bridge. A mini-simplicity connector allows for current consumption measurements and breakout pads are provided for all the module pins.

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CUI Devices’ Motion & Control Group announced the introduction of a new rotary potentiometer series offering single or dual gang models as well as dual gang options with an on-off switch. The PTN16 series is housed in a 16.5 mm package with shaft lengths of 15, 20, 25, or 30 mm and D-cut or knurled shaft styles. Ideal for control inputs for electronic circuits and audio control applications, the PTN16 models feature resistance ratings from 1 to 2000 kΩ, a rotational life of 10,000 cycles, and a variety of terminal configurations.

These 16.5 mm rotary potentiometers carry linear, logarithmic, and reverse logarithmic tapers, a 0.125 W power rating, and a 300-degree mechanical angle. The PTN16 series further features through hole mounting, center detent options, and an operating temperature range from -10 to 75°C.

The PTN16 models are available immediately with prices starting at $0.97 per unit at 300 pieces through distribution.

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The Two-wheeler suspension system market is anticipated to expand its roots at an average CAGR of 4.9% between 2023 and 2033. The market is expected to have a market share of US$ 2.61 Billion by 2033 while it is likely to be valued at US$ 1.65 Billion in 2023.

The rising traffic on the road, high vehicle population, and technological advancements are anticipated to flourish the market performance during the forecast period. Furthermore, the advanced facilities setting up their feet in emerging economies are also gaining high revenue through vehicle export.

The better mileage, convenience, comfort, fast mobilization, and easy handling make two-wheelers the first choice. The affordable prices of these vehicles and their suspension help the market thrive its way.

Electric two-wheelers are getting popular among customers due to their low emissions; government subsidies and affordability, which in turn, help the market grow.

Collaboration between brands and automotive parts companies is also increasing the sales of two-wheeler suspension systems. Furthermore, the vital focus on smooth trails is also reshaping the market dynamics.

The presence of OEM retailers and repairing facilities and third-party companies together provide a long list of options for consumers.

• The United States market leads the two-wheeler suspension system market in terms of market share in North America. This region is expected to hold a market share of 4.8% by 2023. The growth in this region is attributed to increased traffic, people getting aware of sustainable ways of transport, high affordability, and brands.
• Germany’s two-wheeler suspension system market is another significant market in the Europe region. The market holds a market share of 2.1% in 2023. The growth is attributed to the collaboration between automotive brands and part manufacturers along with the government working on electric two-wheelers.
• China two wheeler suspension system market thrives at a CAGR of 5.4% during the forecast period. The growth is attributed to the big two-wheeler vehicle population, average per capita income, and high traffic.
• The telescopic front suspension system leads the component type segment as it holds a market share of 40.6% in 2023. The growth is attributed to the high response and enhanced shock control.
• Based on the vehicle type, the motorcycle segment leads as it holds a significant global share of 58.2% in 2023.

The key vendors work on key elements like reliability, high safety, comfort, and long shelf life. Furthermore, the electric vehicle suspension is being designed differently. Key competitors merge, acquire, and collaborate with other companies to increase their supply chain and distribution channel.

Showa Corporation, Gabriel India Limited, KYB Corporation, Duro Shox Pvt Ltd, BMW Group, WP AG, Nitron Racing Shocks, Marzocchi Moto, Öhlins Racing, K-Tech Suspension Limited, Progressive Suspension, Inc., TFX Suspension Technology, BITUBO S.r.l., ZF Friedrichshafen AG, Diamond International Pvt. Ltd., Ridon Auto Parts Co., Badve Engineering Group, Zedling Suspension.

• BMW Group with its BMW Motorrad has introduced the suspensions with optimal on all road experience. These suspensions involve a duolever, single-sided swing arm, telelever, dynamic ESA, WAD spring element, and USD fork.

Duro Shox Pvt Ltd has launched their two & three-wheeler shock absorber with attractive design and effective spring control.

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