ELE Times

In a groundbreaking announcement, Infineon Technologies AG has joined forces with OMRON Social Solutions Co. Ltd., a trailblazing company in social systems technology. This strategic partnership integrates Infineon’s cutting-edge gallium nitride (GaN) based power solutions with OMRON’s innovative circuit topology and control technology, resulting in the creation of one of Japan’s smallest and lightest vehicle-to-everything (V2X) charging systems.

The collaboration leverages Infineon’s CoolGaN technology within the KPEP-A series, a multi-V2X system by OMRON Social Solutions. This system achieves a 60% reduction in size and weight compared to conventional designs while offering a charging capability of 6 kW. With the integration of Infineon’s CoolGaN solution, the V2X system exhibits increased power efficiency, with improvements exceeding 10% at light load and approximately 4% at rated load.

OMRON Social Solutions has enhanced its EV charger and discharger system, enabling bi-directional charging and discharging paths between renewable energy sources, the grid, and EV batteries. This development aligns with broader efforts to accelerate the transition to renewable energies, promote a smarter grid, and facilitate the widespread adoption of electric vehicles, thereby advancing decarbonization and digitalization initiatives.

Adam White, Division President of Power & Sensor Systems at Infineon, expressed excitement about the collaboration, stating, “Our CoolGaN-based solutions directly contribute to speeding up the transition to renewable energies, reducing CO2 emissions, and driving decarbonization. It will also make charging electric vehicles easier and more convenient for consumers, helping to overcome one of the biggest barriers to EV adoption.”

Atsushi Sasawaki, Managing Executive Officer and Senior General Manager for the Energy Solutions Business of OMRON Social Solutions highlighted the significance of the collaboration, stating, “Having access to a broad portfolio of wide bandgap (WBG) solutions significantly increases the functionality, performance, and quality of our products. We look forward to further developing GaN- and SiC-based power solutions with Infineon to help drive renewable energy and electric vehicles.”

Wide bandgap semiconductors made of silicon carbide and gallium nitride play a pivotal role in this collaboration, offering greater power efficiency, smaller size, lighter weight, and lower overall cost than conventional semiconductors. With over two decades of heritage in SiC and GaN technology development, Infineon is positioned as a leading power supplier, addressing the need for smarter, more efficient energy generation, transmission, and consumption.

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Author: STMicroelectronics

Update, December 21, 2023

The STM32WBA52xx are now available in a QFN32 package measuring only 5 mm x 5 mm as opposed to the QFN48 package of 7 mm x 7 mm. Integrators will gravitate towards the models with fewer pins for projects that use fewer interfaces and timers, which are often used for wake-up capabilities, among other things. While the first STM32WBA maximized features, we also know that not all developers need 16 wake-up pins and would rather get the benefits of a smaller package. The QFN32 housing can thus help them tailor their systems to save space to create a more compact and cost-effective design.

Original publication, March 10, 2023

The STM32WBA is the first wireless STM32 to open the way for a Bluetooth Low Energy 5.3 and SESIP Level 3 certification. At its heart, the new series uses an architecture inspired by the STM32U5. We find a similar Cortex-M33, but running at 100 MHz, and flash capacities varying from 512 KB to 1 MB. While the STM32WBA has a dedicated firmware package (STM32CubeWBA), it supports current profiles for STM32WB microcontrollers, thus vastly facilitating the transition from the STM32WB to the STM32WBA. ST also improved the radio to reach +10 dBm in output power, making it the first wireless MCU of its kind to provide such a robust link.

A new architectural foundation A Cortex-M33 The STM32WBA

The STM32WBA represents a new approach to our wireless MCUs. The original STM32WB had a Cortex-M0+ running the radio stack and a Cortex-M4 for the application. The STM32WBA uses a single Cortex-M33 with a score of 407 in CoreMark, which is twice the performance of the previous generation. Beyond computational improvements, the new architecture simplifies developments and provides new features. For instance, the STM32WBA offers an interface for touch sensors that could serve industrial applications and one advanced timer for motor control.

Similarly, the new device supports a background autonomous mode (BAM). It enables peripherals to remain functional and use direct memory access (DMA) without waking the CPU. Engineers can perform sensor monitoring operations using BAM through I2C, SPI, or UART, increasing the usefulness while keeping the power consumption low. Additionally, the STM32WBA supports low-power STOP0, STOP1, and standby modes that developers find in the STM32U5, but ST tweaked them to go rapidly from a running mode with connectivity to Standby mode with the radio context written in the memory. Standby mode with RTC only needs 200 nA, and the Stop mode with 64 KB of RAM demands 16.3 µA.

The first STM32WBAs A more robust signal

The radio also received significant optimizations as it’s the first in this kind of product to reach +10 dBm in output power, thus offering a more robust wireless link. The new performance can make a significant difference when connecting to a device despite an obstruction diminishing the signal. The STM32WBA also supports important features like long-range transmissions, a high-speed connection of up to 2 Mbps, and advertising extensions to optimize communication management. Moreover, while the STM32WBA52 relies on LDOs, future models in the series will also feature a switched-mode power supply. Similarly, while the STM32WBA52 only focuses on, future devices will support Matter, OpenThread, and Zigbee.

A new security paradigm

The presence of a Cortex-M33 in STM32WBA devices also means that, for the first time, our wireless microcontrollers can help provide a SESIP Level 3 certification. Developers can use functionalities like TrustZone, Trusted Firmware, Secure Boot, Secure Debug, and more to bolster their security and protect sensitive applications from the radio stack. Thanks to ST software packages and firmware, developers can more easily implement privileged and unprivileged sections to safeguard sensitive information like cloud credentials or user data.

Existing solutions within the STM32Trust initiative will help users implement these safeguards. Furthermore, because the STM32WBA takes cues from the STM32U5, developers can reuse some of the information or documentation. Nevertheless, ST will have specific content on the STM32 Wiki to address issues related to wireless stacks. The new devices will also include mechanisms protecting against physical attacks, such as anti-tamper pins, a unique hardware key, and more.

Getting started NUCLEO-WBA52CG

The best way to start creating a proof-of-concept is to grab the new NUCLEO-WBA52CG, a new type of Nucleo board where the microcontroller sits on a removable daughter card. The solution can help engineers more easily swap between microcontrollers, making the device more portable. By using the board, developers could determine whether their application can use ST’s basic Bluetooth stack, which helps save memory, or if they require the full-featured version. ST will also provide bare metal middleware and firmware using AzureRTOS. A software package using FreeRTOS will also be available on GitHub Hotspot, which already contains a repository for a web interface supporting the new device.

Read the full article at https://blog.st.com/stm32wba/

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Ideal limit-sensing solution for appliances and automatic testing equipment (ATE) applications

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, is excited to announce the availability of the MATE-12B Reed Switch Series. These sub-miniature reed switches provide longer life and higher reliability than currently available in existing 12.7 mm reed switches, achieving millions of cycles. Their extensive longevity exceeds the requirements for automatic test equipment and appliance applications. View the video.

The MATE-12B is a normally open switch with a 12.7 mm x 1.8 mm (0.276” x 0.071”) glass envelope, which can switch up to 200 Vdc 10 W. They provide a high insulation resistance of 1012 ohms (minimum) and a low contact resistance of less than 100 milli-ohms.

The MATE-12B Reed Switch Series is ideally suited for markets that require long-life cycles and high reliability, such as:

• Automatic Test Equipment (ATE) for power semiconductor testing,
• Appliances, and
• Other limit switching applications.

The MATE-12B key benefits and differentiators include:

• High reliability and prolonged lifecycle: Extensively tested and proven to achieve millions of operation cycles, a significant advantage over currently available 7 mm reed switches.
• Design flexibility: The sub-miniature magnet size and hermetically sealed glass envelope enable use in more challenging environments and applications.
• PCB space savings: Extremely compact size and light weight help reduce the end product’s size.
• Suitable for harsh environments: Hermetically sealed and meets cULus requirements.

“The MATE-12B is an extension of our existing product line, which helps our end customers with significantly higher efficiency and longer lifetime,” said Wayne Wang, Global Product Manager at Littelfuse. “The minimal risk of failure is especially critical to limit switching applications such as in appliances and power semiconductor automatic test equipment.”

Availability

The MATE-12B Reed Switch Series is available in bulk quantities of 1000 pieces. Place sample requests through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit Littelfuse.com.

The post Latest Littelfuse Sub-miniature 12.7 mm Reed Switches Provide High-Reliability, Longer Life Cycles appeared first on ELE Times.

Courtesy: Mouser Electronics

Early-stage Internet of Things (IoT) concepts defined sensors that linked directly to the cloud. However, as vertical industries started seriously evaluating IoT architectures to extract greater business value, it became clear that this one-size-fits-all approach was impractical for various reasons.

Consider just a few of the implications of a cloud-first model in industrial IoT (IIoT) deployments:

• Data and device security: The potential of insecure endpoints communicating directly with the cloud meant hackers could exploit vulnerabilities to access sensitive industrial networks.
• Runaway networking costs: Sensor-to-server data transmissions (especially over public networks) can be so costly they prohibit scaling to the thousands of nodes required by many IIoT deployments. Add large volumes of measurement and status data generated by industrial sensors, and network congestion, packet delays, and inefficient bandwidth usage abound.
• Power consumption of always-on sensor nodes: Remote sensor nodes require continuous connection to the network and an energy source. This is particularly challenging in remote settings like mining and agriculture, where limited access can mean replacing batteries or troubleshooting networks costs thousands of dollars.

New classes of secure hardware, networking, and battery technology emerged from these challenges to redefine how IoT systems were architected and industrial devices were designed. The technology revolution began by combining security and energy efficiency in edge-centric silicon.

The Low-Power Foundations of IoT Processors

Introduced as real-world IoT requirements were being defined in 2009, ArmCortex-M0 CPUs offered the ability to operate solely on 16-bit “thumb” instructions rather than the 32-bit instructions required by its predecessors.

Thumb instructions’ compact encoding method enables code density improvements of roughly 30 percent on processors like the Cortex-M0, which has a cascading effect on memory usage (lower), die sizes (smaller), power consumption (less), and ultimately cost (reduced). Fast-forward to today and devices based on the Arm Cortex-M33 architecture feature thumb instructions and built-in hardware security via features like TrustZone.

TrustZone delivers hardware-based data and device security through a secure root of trust (RoT). When combined with the energy efficiency of Cortex-M33 CPU cores, TrustZone creates secure, battery-powered IoT devices that can operate for extended periods in remote settings. It also doesn’t detract from CPU performance, as Cortex-M33 processors deliver an impressive 1.5 DMIPS/MHz and 4.09 CoreMark/MHz for handling complex tasks at the edge to reduce reliance on centralized cloud processing.

From the beginning of IoT rollouts through today, Cortex-M-class chips continue to deliver possibilities for various IoT use cases.

The Rise of LPWAN

The success of energy-efficient IIoT edge nodes is not only a result of their host processor but also how they connect. In the late 2000s, the advent of 4G technology signaled the decline of earlier networks, highlighting the need for a new low-power, wide-area networking (LPWAN) technology that facilitates long-range communication for IoT devices.

LPWAN technologies such as LoRa have emerged as an appealing method for linking battery-powered IoT devices to networks. Its long-range capabilities and low energy consumption make it an ideal choice for IIoT applications like asset tracking, environmental monitoring, industrial automation, smart agriculture, and smart cities.

Today’s LoRa transceiver modules facilitate LPWAN communications over distances of up to 15km while consuming approximately 40mA of current during transmission. Typically, LoRa modules interface with host processors like Cortex-M-class devices through UART and communicate via ASCII commands, streamlining integration with IoT devices.

These transceivers pair with sub-GHz antennas that meet the frequency requirements of LPWAN networks, many of which are available in compact SMD form factors that fit the space constraints of edge devices. In addition to supporting protocols like LoRaWAN, some of these antennas also support short-range wireless technologies like Wi-Fi, Zigbee, and Bluetooth to enable the creation of backhaul-enabled wireless sensor networks.

Lithium Battery Technology Advances for IoT Edge Nodes

Thanks to the availability of secure, energy-efficient computing technology and LPWAN networking, the idea of battery-powered IIoT sensor nodes became a reality. The IIoT industry embraced the concept of battery-powered sensors, and demand for dependable, high-density power sources increased.

Lithium-ion batteries emerged as the preferred choice for powering these sensors thanks to consistent power density and reliability improvements. These advancements yielded the ability for IoT devices to operate for extended periods on a single battery charge—a critical requirement for many agriculture, mining, and industrial applications. Meanwhile, the improved reliability of lithium-ion battery technology led to reductions in maintenance and operational expenses while ensuring uninterrupted data collection and communication.

A Qoitech study on the compatibility of LoRaWAN technology and coin cell batteries highlighted the pairing’s potential in enduring, low-power wireless IoT sensor nodes. In the study, researchers tested the performance of coin cell batteries using a battery-profiling tool. The tool measured a 40mA (peak current) LoRaWAN power profile with an exit condition that triggered when the voltage dropped below 0.6V or 2V. The study provides insightful results, revealing disparities in coin cell performance among manufacturers that are particularly evident at higher current levels. It also proved that CR2032 and CR2450 are viable options for powering LoRaWAN devices.

This harmony between LPWAN technology and high-density lithium-ion batteries has helped propel the IIoT landscape, enabling new energy-efficient wireless sensor nodes. Lithium coin cell batteries have emerged as the go-to power source for these devices due to their compact size, impressive energy density, and extended lifespan. The availability of diverse lithium coin cell battery options—available in various chemistries and configurations tailored to specific IoT applications—gives developers freedom of choice.

Mouser Electronics offers a comprehensive selection of coin cell batteries, enabling developers to select the most suitable power source for their IoT projects. Additionally, many tools are available to help developers evaluate battery performance under practical conditions. These can ensure IoT sensor nodes operate reliably over long lifecycle deployments and help identify the most efficient and cost-effective power solutions for a given application.

Future of Technology for the Industrial IoT

Recent IIoT technology advancements have not been limited to the edge; they’ve also extended to the control layer. These improvements have led to multicore systems-on-chips (SoCs) featuring multiple CPU or graphics cores, integrated neural network accelerators, and dedicated IP blocks for executing analog, security, and other workloads.

These high-performance chipsets almost always contain multiple high-speed I/O interfaces that streamline system integration in a number of deployment contexts. They are also candidates for embedded virtualization using technologies like hypervisors and single-root I/O virtualization (SR-IOV) that partition on-chip cores, memory, and I/O resources. As a result, multiple mixed-criticality workloads can run and execute simultaneously on a single physical processor, maximizing resource utilization and reducing overall size, weight, power consumption, and cost versus multiprocessor solutions.

Elsewhere, networking standards like Ethernet Time-Sensitive Networking (TSN) are rising. TSN introduces deterministic communication capabilities from the control layer to sensor nodes and enterprise systems for fine-grained timing control, precision device management, and task-oriented workflows like virtual programmable logic controllers (vPLCs). The convergence of these technologies is expanding functionality as IIoT nodes continue to evolve.

The evolution of IIoT technology building blocks started at the far edge and continues today at the control layer. For instance, the emergence of multicore SoCs with integrated accelerators and the adoption of networking standards like Ethernet TSN have paved the way for improved device management and the implementation of containerized enterprise applications.

The post Building Blocks for IIoT Edge Nodes appeared first on ELE Times.

TTape revolutionizes the EV industry by delivering a unique capability to detect overtemperature at every Li-ion cell, offering superior safety and battery life enhancement.

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, is excited to introduce TTape, a groundbreaking overtemperature detection platform designed to transform the management of Li-ion battery systems. With its innovative features and unparalleled benefits, TTape helps vehicle systems manage premature cell aging effectively while reducing the risks associated with thermal runaway incidents. View the video.

TTape is ideally suited for a wide range of applications, including automotive EV/HEVs, commercial vehicles, and Energy Storage Systems (ESS). Its distributed temperature monitoring capabilities enable superior detection of localized cell overheating, thereby improving battery life and enhancing the safety of battery installations.

TTape’s key benefits and differentiators include:

• Premature Cell Aging Management: TTape aids vehicle systems in managing premature cell aging, significantly reducing the risks associated with thermal runaway.
• Extended Battery Pack Life: TTape ensures that the battery pack remains serviceable for an extended period by initiating temperature management at an earlier stage.
• Efficient Multi-cell Monitoring: With a single TTape device, multiple cells can be monitored, thus alerting the BMS sooner in case of overtemperature scenarios.
• Ultra-fast Response: With a response time of less than one second, TTape guarantees quicker alerts, signaling the potential onset of thermal runaway conditions.
• Seamless Integration: Calibration isn’t necessary. TTape can easily integrate with existing BMS, making it a go-to solution for many battery applications.

Moreover, the extremely thin design of TTape makes it ideal for conformal installations. With a single MCU input, its distributed temperature monitoring capability drastically improves the detection of localized cell overheating. This approach enables efficient cooling measures to prolong battery life and significantly heightens the safety standards of battery installations.

“Distinguishing itself from NTCs, TTape is a stellar addition to the Littelfuse product family. The profound advantage of localized cell overheating detection ensures quicker alerts to the BMS compared to traditional NTC setups,” explained Tong Kiang Poo, Global Product Manager at Littelfuse. “The TTape Platform is a distributed temperature monitoring device for battery packs that helps to improve the detection of localized cell overheating. With no calibration or temperature lookup tables required, and only one MCU input needed, it integrates seamlessly with current BMS solutions alongside NTCs, delivering an enhanced detection of cell overheating.”

This groundbreaking product builds upon the Littelfuse legacy of innovation. It leverages the company’s rich research, design, and development expertise in PPTCs, bringing forth a temperature monitoring solution that the industry eagerly awaits.

TTape promises to be a game-changer for the Li-ion battery pack market, emphasizing safety and efficiency. As the industry moves rapidly towards more sustainable and safe energy solutions, Littelfuse products like TTape are a testament to the company’s commitment to innovation and excellence.

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DFI, a global leader in embedded motherboards and industrial computers, has announced their participation in the Embedded Tech India Expo for the first time. In collaboration with distribution partner Dynalog, they will be showcasing their range of rugged industrial-grade products, industrial motherboards, and embedded systems. DFI hopes to assist customers and industries in India in achieving their demands for digital transformation and intelligentization.

This flagship event is co-located with India’s largest tech and infra expo, the Convergence India Expo. Held at Pragati Maidan in New Delhi, India, from January 17th to January 19th, the expo brings together powerful business and technology leaders in the embedded technologies industry to share their knowledge and explore new solutions. DFI’s products will be displayed alongside Dynalog’s networking solutions at their joint exhibition booth. With over 40 years of legacy, Dynalog India Ltd, is a distinguished leader of automation
solutions recognized across India and is one of DFI’s most important distributors and partners.

DFI will present flagship products such as the ECX700-AL rugged embedded system, EP100-AL compact PC, PCSF51 SBC, and the latest SOM modules for applications in factory automation, transportation, and military industries in India. These products are already being implemented and have achieved positive results in India. For example, DFI has initiated production on an SOM module with wide temperature range for an aerospace and defense electronics company. The customer chose DFI after reviewing more than five
industrial PC competitors, because DFI could provide the most comprehensive support and customization services.

With India’s market potential and DFI’s cutting-edge technologies, DFI aspires to become the best partner in India’s industrial transformation. DFI supports government initiatives such as the “Make in India” initiative that promotes entrepreneurship and encourages companies to manufacture products made in India. From government to private sectors, DFI is committed toward contributing its services and enabling companies to realize their goals. DFI will continue to seize opportunities in India by delivering its industrial-grade
embedded solutions for industrial automation, military defense, smart transportation, smart city, and other sectors while enhancing its presence through participation in local events.

– Exhibition Dates: 17th -19th January 2024
– Venue: Pragati Maidan, New Delhi, India
– Booth No.: B158

The post DFI To Present Latest Innovations Alongside Partner Dynalog at Embedded Tech India Expo 2024 appeared first on ELE Times.

The Electronic Communications Office of Iceland (ECOI) has selected Rohde & Schwarz mobile network testing to assess and benchmark the performance, coverage and capacity of the country’s three mobile network operators. The campaign is intended to ultimately improve the quality of service (QoS) and quality of experience (QoE) for the end users in Iceland, given the island’s challenging geography and climate. ECOI commissioned Rohde & Schwarz network analytics services to roll out a benchmarking campaign based on an internationally standardized, transparent process based on the European Telecommunications Standards Institute (ETSI).

The national regulatory authority Fjarskiptastofa (FST) – internationally known as the Electronic Communications Office of Iceland (ECOI) – commissioned Rohde & Schwarz to conduct a large-scale mobile network quality benchmarking campaign in Iceland. The mobile network testing experts from Rohde & Schwarz planned and implemented the benchmarking campaign as a service for ECOI. The collected data was processed using the Network Performance Score (NPS) 2.0. The NPS is a fully transparent test methodology in line with ETSI TR 103 559 that compares standardized KPIs for mobile networks using active drive and walk tests.

ECOI is one of the first regulatory authorities in Europe to rely on the NPS for such a large-scale network benchmarking campaign. The NPS is based on a methodology described by the European standardization organization ETSI in ETSI TR 103 559. It provides an industry-proven standard and internationally comparable quality of service and user experience assessments for mobile networks.

The campaign was conducted over five weeks in September and October 2023. Roughly 9 000 km were driven through big cities like Reykjavik, small towns and on remote roads around the entire island. The network quality within shopping malls was also assessed. Approximately 90 % of Iceland’s population was covered. The campaign included over 17 000 calls and the evaluation of over 160 000 data tests, including application level tests for 90-second voice calls, eGaming applications, online meetings and video chats to assess the typical experience for current subscribers. NPS version 2.0 applies more challenging thresholds and intricate weighting, especially for developed networks dominated by 5G technology, as is the case in Iceland.

The benchmark measurements confirmed that all three mobile networks in Iceland; Síminn, Nova and Vodafone scored over 700 points (out of 1000), making them on par with other mobile networks in Europe. All three networks have very good 5G coverage in cities and towns and excellent 4G coverage nationwide. Both voice and data services are reliable, but there is still room for improvement. Thanks to the NPS method applied in real drive tests, QoE issues especially along highways could be detected, which remain unnoticed with other test methods.

ECOI wants to spur the development of Iceland’s telecommunications networks and provide services for everyone, no matter where they live on the sparsely populated island. By fostering healthy competition among the three Icelandic network operators with benchmarking, the operators are encouraged to invest in the infrastructure that ultimately benefits end-users and businesses. Þorleifur Jónasson, Director Infrastructure Division at the Electronic Communications Office of Iceland, says: “ECOI believes that only a methodology deeply rooted in internationally recognized standards allows a fair and unbiased assessment of the mobile network quality. This is why we partnered with Rohde & Schwarz to provide us with their mobile network quality benchmarking services. Their ETSI defined Network Performance Score methodology convinced us.”

Maja Mitic, Director Network Analytics Services Mobile Network Testing at Rohde & Schwarz, says: “Iceland has vast open landscapes and a rough climate that can make it challenging for operators to provide the best possible network coverage, especially with 5G in the game. ECOI is among the first regulatory authorities in Europe to trust Rohde & Schwarz with such a transparent and unbiased large-scale benchmarking campaign to assess a country’s network quality and user experience. It’s a crucial step to ensure further investment, innovation and consumer protection through enhanced competition among Icelandic network operators.”

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Infineon Technologies AG combines its proven expertise in magnetic position sensors with its established linearized tunnel magnetoresistance (TMR) technology to launch the XENSIV TLI5590-A6W magnetic position sensor. The sensor comes in a wafer-level package and is well suited for linear and angular incremental position detection. The device is qualified for industrial and consumer applications according to the JEDEC standard JESD47K and can be used as a replacement for optical encoders and resolvers. It is well suited for positioning lenses for zoom and focus adjustment in cameras.

The TLI5590 is a low field sensor with Infineon TMR technology which was developed for high-volume sensor systems. As a result, the sensor offers ultra-high sensitivity, low jitter, and low power consumption. Compared to linear Hall sensors, TMR sensors offer better linearity, lower noise, and lower hysteresis. The high signal-to-noise ratio and the lower power enable cost-effective magnetic designs with lower battery consumption.

As a result, the new sensor enables accurate detection with rapidly changing directions. The TLI5590 consists of two TMR Wheatstone bridges, where the TMR resistance depends on the direction and strength of the external magnetic field. In combination with a multipole magnet, each bridge provides a differential output signal, i.e., sine and cosine signals. These can be further processed for relative position measurement.

The sensor is housed in an extreme small 6-ball wafer level package SG-WFWLB-6-3. Due to the higher integration density, the sensor size has been reduced, which supports miniaturization and position detection in microsystems. The TLI5590-A6W enables fine measurement with a very high accuracy of better than 10 µm, which is achieved by using a suitable linear or rotary magnetic encoder. With an extended operating temperature range of up to +125°C, the sensor can be used flexibly in various industrial and consumer applications. In addition, its high temperature stability makes it the perfect choice for use in harsh environments.

Availability

The TLI5590-A6W can be ordered now. More information is available at https://www.infineon.com/linear-sensors/tli5590-a6w

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Courtesy: Lattice Semiconductor

With the explosion of data being generated by billions of connected devices, sensors, and systems, major technology inflection points like AI at the Edge, sensor to cloud connectivity, and resilient security are creating new opportunities. With these trends, the demand for FPGAs is significantly growing thanks to their inherent programmability as customers and developers look for more flexible and adaptable solutions. FPGAs help to improve the longevity of product lifecycles and accelerate time-to-market, enabling customers and developers to lean into FPGA technology when designing applications across Communications, Computing, Industrial, Automotive, and Consumer markets. We are also seeing a fast-growing FPGA ecosystem with an estimated 100,000+ new FPGA-based designs starting every year and 50,000+ FPGA developers worldwide.

With more than 40-years of low power programmable solution innovation, Lattice introduced the ground-breaking mid-range FPGA platform, Lattice Avant and Lattice Avant-E device family in 2022, extending our low power leadership to span the small and mid-size density FPGA portions of the market. This introduction was born out of customer demand as they found the market lacking compelling mid-range FPGA solutions, with three key considerations: power efficiency, performance, and form factor, design aspects for which Lattice has become known and trusted for over the last 4 decades.

Today, at the Lattice Developers Conference, Lattice announced multiple innovative hardware and software solutions creating the strongest and fastest product portfolio in company’s history by introducing two new mid-range FPGAs – Lattice Avant-G and Lattice Avant-X, expanded solution stacks for AI, embedded vision, security, and factory automation, and enhanced software capabilities supporting the robust product portfolio.

Higher Performance. Lower Power – New Mid-range FPGAs Lattice Avant-G FPGA Family

Avant-G general purpose FPGAs are designed to enable a wide range customer needs by offering seamless, flexible interface bridging and optimized compute for system expandability.

Lattice Avant-G devices offer best-in-class signal processing and AI, flexible I/O supporting a range of system interfaces, while providing dedicated LPDDR4 memory interfaces at 2400 Mbps. Lattice Avant-G devices deliver 12.5G SERDES with support for up to PCIe Gen 3 and 10G Ethernet.

Lattice Avant-X FPGA Family

Avant-X advanced connectivity FPGAs are designed to enable high bandwidth and security, with a feature set tailored to customer needs for signal aggregation and high throughput.

Lattice Avant-X devices offer up to 1 Terabit per second total system bandwidth, PCIe Gen 4 controllers with hard DMA, and a security engine to encrypt user data in motion providing quantum safe cryptography. Lattice Avant-X devices deliver 25G SERDES supporting up to PCIe Gen 4 and 25G Ethernet, along with support for DDR5 memories and advanced user-logic accessible security.

Key features and performance highlights of the new Lattice Avant-G and Avant-X FPGAs include:

• Power Efficiency

• • Up to 2.5X lower power than similar class competitive devices, helping system and application engineers achieve power and thermal design efficiencies, improve operating costs, and enhance reliability
• Form Factor
  • Up to 6X smaller package size compared to similar class competitive devices enables size-efficient system designs
• Performance:
  • Up to 8X faster INT8 multipliers compared to similar class competitive devices, optimized for AI/ML applications
  • Up to 10X faster device configuration times for applications requiring rapid start-up
• Modernized Feature set (varies by device):
  • Advanced bitstream and user logic accessible security features including AES encryption, ECC/RSA authentication, quantum safe cryptography, physical unclonable functions (PUF), tamper monitor, true random number generator (TRNG), and side-channel resistance
  • High speed memory interface support including LPDDR4 and DDR5, and Hardened DFI training layer
  • Fastest Soft Error Detect (SED) to minimize error propagation and to enable fastest recovery from Single Event Upset (SEU)

Expanded Solution Stacks – Accelerating Your Time to Market

Lattice’s solution stacks are designed to speed customer development and time-to-market by giving them a toolkit of hardware, software, and IP tailored to the needs of their application. Solution stack updates announced today include:

Lattice sensAI solution stack: Accelerates the integration of flexible, low power inferencing at the Edge for AI applications across client computing, automotive, factory automation, and consumer IoT with:

• Up to 3X faster performance with upgraded accelerator engine and complier tool
• Expanded network support with additional preprocessing capabilities

Lattice mVision solution stack: Accelerates the development of low power embedded vision applications including machine vision, robotics, ADAS, drones, and AR/VR with:

• Expanded sensor/video bridging solutions including MIPI to PCIe®, SLVS-EC to PCIe, and MIPI to HDMI reference designs and demos

Lattice Sentry solution stack: Provides a cyber resilient Root of Trust solution with:

• Platform Firmware Resiliency (PFR) root of trust to secure and develop a NIST 800-193 compliant PFR solution

Lattice Automate solution stack: Accelerates the development of smart Industrial automation systems including applications like robotics, embedded real time networking, predictive maintenance, functional safety, and security with:

• Enablement of Open Platform Communications Unified Architecture (OPC UA) for field communication
• Expanded motor control solutions with golden hardware & golden system reference designs

Enhanced Software Capabilities

Lattice is committed to providing best-in-class, easy-to-use software tools that help enhance customers’ design experience and design environment. Key updates to Lattice Propel and Lattice Radiant software includes adding full support for the new Lattice Avant-G and Avant-X FPGA families, the introduction of enhanced ease-of-use and scripting to Radiant, and expanding the IP portfolio in Propel.

Advanced computer vision software Glance by Mirametrix was also updated with new features to expand its applicability across Edge applications for various markets. Updates include a new smart avatar privacy feature and 3D head pose for low power capability.

Latest FPGA Trends and Opportunities in Today’s Interconnected World

Alongside these exciting new hardware and software solutions announcement, Lattice is hosting a 3-day virtual Developers Conference featuring

• Guest keynotes from NVIDIA, Meta, and BMW
• An incredible line up of guest panel discussions on Edge AI, connectivity, and security
• 35+ in-depth technical breakout sessions and trainings
• A robust FPGA-based demo showcase with industry leading partners and customers

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Automated inline handler systems for in-circuit testers rely on numerous sensors
fitted around the system to detect and control mechanical operations.

The programmable logic controller (PLC) runs a set of complex algorithms that supervise all handler operations and maintain control of safeguards. This ensures consistent and safe operation of the system. To prevent any external interruption to its operation, the PLC does not allow any user intervention to its process once it starts the automated operation. As such, most of the automated inline systems have a closed-loop design that does not allow user customization of the handler operation.

However, it is possible to split the PLC’s algorithms into sections without degrading the robustness of the safeguards. In doing so, it opens little windows of opportunities into the PLC’s control of the handler and allows customization of the handler operations to suit user requirements.

My previous post shared some of the test steps in the i7090 plug-in for Pathwave Test Executive for Manufacturing (PTEM) application which allow you to configure the i7090 system handler profile and monitor the error codes during runtime. Figure 1 below recounts the flowchart that I discussed before.

Figure 1: Flowchart for handler configuration and error code monitoring

From the flowchart in Figure 1, configuration import is an optional process as user can also set up the handler profile directly on the i7090 system handler application itself. You may choose to omit the configuration import and go directly to the next stage in the process.

The next stage of the handler operation includes setting the handler into auto mode operation followed by the runtime processes. By combining the configuration import sequence into a single bubble and adding the auto mode and runtime processes, the updated flowchart is as shown in Figure 2. Since configuration import is optional, the flow can go directly into the Auto mode process after the handler control is connected to PTEM.

Figure 2: Auto mode and runtime processes follows configuration import processes.

Switching the handler into auto mode lets the PLC take over command of the handler operations and execute the handler initialization algorithm. During the initialization process, you can continue to monitor the handler error codes and terminate the operation if required. However, you cannot alter the initialization steps that the PLC dictates. In this post, I will share details of the events during the initialization process when you set the handler to auto mode. We will leave the runtime processes to the next post.

Getting into the auto mode operation is a two-step process.

First, switch the handler into auto operation by turning the selector switch on the machine panel from Manual to Auto as shown in Figure 3.

Figure 3: Set handler into auto mode by turning switch into auto position on the machine panel.

The next step is to start the auto mode operation in the PLC. In the PTEM testplan shown in Figure 4, I created a repeat loop to monitor the selector switch using the Handler_IsSwitchInAutoMode test step and waited for it to enter the auto position. Within the loop, I included a print step to display a text message and prompt the operator to make the switch. Once the selector switch is in auto, the repeat loop exits and calls the Handler_StartAutoMode test step to start auto mode operation at the PLC.

Figure 4: Handler_StartAutoMode triggers the auto mode operation.

In auto mode operation, the handler starts with the initialization of the hardware before going into the board transfer stage to bring in the device under test (DUT). For initialization to happen, the handler must not be in any error state, and the fixture must be correctly locked down, with all doors closed. No foreign items, including any DUT, should be in the test bay area or on the fixture. Make sure to remove any tools or equipment from the test bay before triggering auto mode operation. Monitor the initialization sequences as the testplan executes, to confirm that the handler receives the correct commands before leaving it to run on its own.

Initialization starts with the press, conveyor, and stopper returned to their home positions. The first action to expect after going into auto mode is that the press should start to move upwards, followed by the conveyor rail and stopper. During the process, the PLC monitors all the position sensors in the handler and reports errors if any one of them fails to respond correctly. The completion of these movements is confirmation that the mechanical hardware is functioning well.

Next, the handler configures the width of the conveyor to the targeted setting in the system handler application. You will notice the handler moves the rear conveyor outwards to its home position, and then inwards until it reaches the targeted width. If adjustment is successful, the adjusted width matches that of the DUT, else it is an indication that you may have set the parameters wrong, or the adjustment motors are defective.

The final phase of the initialization process is getting the press ready at the standby height position. From its home position at the top, the press moves downwards and halts at the standby height position. Standby height is the position of the press where it is slightly above the DUT. This gives sufficient clearance for the DUT to pass under it and move to the stopper position. Moving the press downwards from the standby height is more efficient than having the press to travel from the home position at the top. This reduces the time it takes to engage the DUT into the fixture. Once the press reaches standby height, the handler is now ready to receive DUT. Once the upstream conveyor presents a DUT to the handler, the transfer will begin automatically.

The testplan is now in the parallel operation process where it is constantly monitoring for errors and waiting for the DUT to get into position. Once a DUT is in position, the testplan continues into the runtime operation, which we will discuss in the next post.

Table 1 tabulates all the test steps that I have discussed so far in all my posts on automation control of the i7090 system. You can also check out my previous post on Keysight i7090 with PTEM where I shared how the error monitoring sequences can be created easily with PTEM. Meanwhile, if you have questions or comments regarding what you have just read, feel free to send me a message.

Kwan Wee Lee Technical Marketing Engineer Keysight Technologies

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