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In the evolving 5G landscape, channel-state information (CSI) is essential for optimizing network performance and user capacity. CSI enables efficient channel-dependent scheduling and adaptive modulation, ensuring robust high-speed communications between base station and mobile device. AI/ML- driven CSI enhancements promise even greater efficiency, reduced overhead, and improved user experience in 5G-Advanced and future 6G networks. However, implementation across vendors will be challenging. Rohde & Schwarz and Qualcomm Technologies have achieved an industry milestone by demonstrating cross-vendor interoperability of ML-based CSI feedback enhancements, to be showcased at MWC 2025 in Barcelona.

Rohde & Schwarz today announced the successful validation of machine learning-based channel-state information feedback compression for 5G-Advanced networks with support from Qualcomm Technologies, Inc., demonstrating a significant increase in throughput compared to conventional methods. This breakthrough confirms the feasibility of cross-vendor AI implementation in wireless communications with the aim of enhancing network performance.

The two companies achieved interoperability between ML models running on a mobile form factor reference design powered by a Qualcomm® 5G Modem-RF and the CMX500 5G one-box signaling tester from Rohde & Schwarz, implementing enhanced CSI feedback mechanisms studied in 3GPP Release 18 and 19. The setup enables efficient compression of the channel state based on CSI reference signal (CSI-RS) measurements, optimizing massive MIMO operations critical for 5G networks. This validation demonstrated that the throughput performance improved by 51% compared to Type I feedback followed by wideband precoding, as defined in 3GPP Release 15.

Both parties employed separate training approaches for AI models on the network and device side. Compatibility was achieved through specified reference models. Utilizing autoencoder architecture, Qualcomm Technologies implemented a proprietary device encoder, while Rohde & Schwarz developed a decoder for its network emulator. The CMX500 one-box tester supports flexible ML model integration through the Open Neural Network eXchange (ONNX) format, enabling users to implement and validate their own AI architectures for wireless testing scenarios.

The successful interoperability proves that two-sided ML-based air interface enhancements can be effectively implemented and tested across equipment coming from different vendors. It is a significant step toward implementing AI-enhanced wireless communications, providing a framework for testing and verification essential for the commercial deployment of 5G-Advanced features. It also serves as a crucial milestone for the upcoming standardization for a future 6G standard, where AI is expected to be natively integrated into the air interface design from the beginning. Hence, cross-vendor AI interoperability will be an essential foundation for future wireless systems.

Christoph Pointner, Senior Vice President of Mobile Radio Testers at Rohde & Schwarz, says: “The capability of our CMX500 to implement and validate ML-based signal processing highlights the need for evolving test and measurement alongside wireless innovation. Thanks to ONNX support, customers can integrate their own ML architectures, making the CMX500 a versatile platform for AI-enhanced wireless testing. Validating interoperability with Qualcomm Technologies’ encoder confirms our commitment to establishing essential verification frameworks for AI-driven communications, from 5G-Advanced to future 6G systems.”

John Smee, Senior Vice President, Engineering, Qualcomm Technologies, Inc. adds, “In this new 5G- Advanced era of connectivity, and as we look toward 6G, AI is even more critical not just for the best user experiences but also for network performance. The joint research between Qualcomm Technologies and Rohde & Schwarz validates that AI-based CSI will help ensure these performance enhancements.”

Rohde & Schwarz will present the CSI feedback enhancements demonstration together with Qualcomm Technologies live at Mobile World Congress 2025 at Fira Gran Via in Barcelona in hall 5, booth 5A80. A video preview of the demonstration is available here:

https://www.rohde-schwarz.com/_251220-1545553.html

For further information on Rohde & Schwarz solutions for AI and ML in 6G networks, visit: www.rohde-schwarz.com/6G-AI-ML

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Integrated AI capabilities, rugged design, and with quick access expansion, the BOXER-6647-MTH sees AAEON corner the advanced robotics market.

Leading provider of industrial PC solutions AAEON, has introduced the BOXER-6647-MTH, a fanless embedded computer powered by the Intel Core Ultra platform. Available with either the Intel Core Ultra 7 processor 155H or Intel Core Ultra 5 processor 125H, the BOXER-6647-MTH sports a broad variety of interfaces tailored for industrial robotics use.

The system hosts LAN ports providing up to 2.5GbE speed, six USB (four USB 3.2 Gen 2, two USB 2.0), and three serial ports that include dual RS-232/422/485 signals and an 8-bit DIO, the BOXER-6647-MTH’s I/O provides a strong foundation with which systems integrators can install cameras, sensors (LIDAR, IMUs), and actuators for advanced robotics applications like AGVs and AMRs. Moreover, the system boasts a wealth of expansion options to accommodate Wi-Fi, 5G, and NVMe storage modules.

The mechanical design of the BOXER-6647-MTH offers a number of unique features, including external SATA and M.2 M-Key device trays that allow users to swap, upgrade, or replace SATA and M.2 NVMe storage devices without the need to open the system or use tools to configure. A second change to what users will have become accustomed to with AAEON’s fanless embedded PC line is its fully sealed chassis panels. Previous products from the selection required additional vents on the system side panel in order to ensure adequate heat dissipation, the BOXER-6647-MTH compensates for this with a more efficient and effective heatsink.

Despite its ventless chassis, the BOXER-6647-MTH remains relatively compact at 220mm x 154mm x 62.1mm, while also maintaining a -20°C to 60°C temperature range. The system can operate in industrial environments with fluctuating power supplies, with a 9V to 36V power input range via a 3-pin terminal block connector, while also receiving protection from damage during operation thanks to both shock and vibration resistance features.

With respect to its OS, the BOXER-6647-MTH supports Windows 11 Pro and Windows 11 IoT Enterprise, as well as Linux Ubuntu 22.04.

For detailed specifications, please visit the BOXER-6647-MTH’s product page on the AAEON website, or contact an AAEON representative.

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ATMXT3072M1 and ATMXT2496M1 single-chip touchscreen controllers bring reliable and secure touch detection to automotive displays including emerging OLED and microLED technologies

Automakers are revolutionizing the driving experience with innovative smart cockpit designs that feature large displays and emerging technologies like Organic Light Emitting Diodes (OLEDs) and microLEDs, seamlessly blending functionality with brand identity. However, these advancements pose significant challenges for the integration of capacitive touch sensing, especially with the thinner stack-up and an increasing number of touch electrodes. To address these challenges, Microchip Technology has launched the ATMXT3072M1 and ATMXT2496M1 touchscreen controller families to help provide automotive HMI designers with reliable touch solutions. The single-chip touchscreen controllers feature up to 112 reconfigurable touch channels—or 162 equivalent touch channels in ultra-wide mode— enabling the support of large, curved and free-form touch displays up to 20 inches in 16:9 format and 34 inches in 7:1 format.

Large thin displays, such as on-cell OLED, embed touch electrodes with higher capacitive loads and stronger coupling of display noise, increasing the risk of false or missed touch detections. As part of the maXTouch touchscreen controller family, the new devices employ Microchip’s proprietary Smart Mutual touch acquisition method and algorithms to increase the touch Signal-to-Noise Ratio (SNR) by up to +15 dB compared to the previous generation.

“The size and appearance of automotive cockpit displays can significantly influence a buyer’s perception of the vehicle’s technological sophistication. However, integrating reliable touch functionality into advanced displays can present significant challenges,” said Patrick Johnson, senior corporate vice president overseeing Microchip’s human machine interface division. “Our ATMXT3072M1 and ATMXT2496M1 touchscreen controllers address these challenges with innovative sensing algorithms for fast and reliable touch performance. This enables automakers to design cutting-edge, visually stunning and user-friendly interfaces that enhance both the driving experience and vehicle safety.”

ATMXT3072M1 and ATMXT2496M1 controllers are designed to be compliant with ASIL-A and B standards and are developed according to Microchip’s ISO26262 Functional Safety Management System, which is certified by TÜV Rheinland. Failure Modes, Effects and Diagnostic Analysis (FMEDA) and safety manuals are also available to help customers achieve certification for their systems’ touch functionality more efficiently and cost-effectively. The touch controllers’ firmware is upgradable by the automobile’s main computer system and can be verified using the integrated firmware authentication feature, which implements the SHA-512 cryptographic hash function. This cybersecurity function enables reliable Over-the-Air (OTA) updates in compliance with ISO 21434:2021 standards.

To limit eyes-off-road time and promote safer driving, the Euro NCAP tests in 2026 will likely encourage manufacturers to use separate physical controls for basic functions. Microchip’s Knob-on-Display (KoD) technology allows for the addition of intuitive physical knobs on the touchscreen, improving safety while preserving the sleek look of modern vehicle displays. Additionally, implementing haptic feedback on the touchscreen is a recognized method for reducing driver distraction. The new maXTouch M1 Generation touchscreen controller features dedicated functions, such as the Shape Event Trigger combined with automated pattern Pulse Width Modulation (PWM), to achieve ultra-low-latency haptic control. This innovation transfers the decision-making and generation of haptic waveforms from the main application host processor to the touchscreen controller.

Visit the maXTouch M1 Generation family webpage to learn more about the key features of Microchip’s touchscreen controller solutions.

The comprehensive EV01S50A development printed circuit board (PCB) was designed for the ATMXT3072M1 touchscreen controller family to enable customers to more easily evaluate and test the devices in their applications. The EV13B92A evaluation kit includes a 15.6” ITO touch sensor.

For additional information and to purchase, contact a Microchip sales representative or authorized worldwide distributor.

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India’s Focused Show for Robotics, Smart Manufacturing, India Manufacturing Week, Technologies, Materials, Composites and Engineering, Product Design

The India Manufacturing Week 2025 is set to be a landmark event for India’s manufacturing sector, bringing together industry leaders to explore the latest advancements in digitalization, automation, robotics, additive manufacturing (3D printing), innovative materials, and design technologies. This three-day event will showcase cutting-edge solutions for smart, lean, and high-volume production.

With participation from top IT solution providers, the expo will offer valuable insights on optimizing production processes, reducing costs, and integrating advanced systems like ERP, MES, IIoT, and CIM. It’s the perfect platform for C-level executives, industry experts, and government representatives to connect and drive digital transformation in manufacturing.

India’s manufacturing landscape is rapidly evolving with the rise of Industry 4.0, fueled by the integration of IoT, AI, robotics, and data analytics. These advanced technologies enable seamless communication between machines, devices, and people, driving automation and significantly improving operational efficiency.
The shift to smart manufacturing is not only enhancing productivity and reducing costs but also improving product quality and enabling faster responses to market demands.

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Kyocera has developed an innovative mmWave phased array antenna module (PAAM) that simultaneously creates multiple beams in different directions at different frequencies. These PAAMs will be used in 5G FR2 infrastructure installations, enabling for example site co-location of different operators running networks on different frequency bands. To ensure optimal beam steering and beam directivity of their groundbreaking product, Kyocera relies on CATR-based multi-reflector OTA testing technology from Rohde & Schwarz.

Kyocera and Rohde & Schwarz will showcase at MWC 2025 in Barcelona the characterization of a novel mmWave PAAM design for FR2 applications. Crucial to the demonstration at the Kyocera booth (5E12) is the R&S ATS1800M 5G NR multi-directional mmWave test chamber from Rohde & Schwarz, designed for over-the-air (OTA) testing with an exceptionally small footprint.

Mobile communications that operate in the FR2 frequency range experience a high path loss, something that can be solved by using beamforming antenna arrays. In contrast to traditional antennas, FR2 antennas typically use phased arrays with a high number of individual antenna elements. Kyocera has developed a novel phased array antenna module (PAAM) featuring 384 dual polarization elements which is able to create up to 8 simultaneous beams in different directions at different frequencies. With this design, the PAAM can be used in site installations allowing multiple operators to run networks on different frequency bands.

However, all these antenna elements need to work perfectly together to form an RF beam with the desired characteristics. Rohde & Schwarz offers a patented approach for testing such a complex antenna array over- the-air (OTA) in a fully shielded environment, which helps engineers verify the correct beam pattern and supports the process of minimizing sidelobes.

The R&S ATS1800M is a unique solution that features four feed antennas and CATR reflectors, each with a 30 cm quiet zone (QZ). In the demonstration at MWC 2025, the Kyocera PAAM device under test (DUT) is placed on a rugged 3D positioner in the center, where all four QZs overlap, coming from multiple directions. This allows Kyocera’s engineers to address a variety of different tests, including the simultaneous reception of RF beams from four different directions, as will be shown at MWC 2025. Thanks to the vertical CATR design patented by Rohde & Schwarz, this setup takes up a fairly small footprint in the lab compared to other OTA-solutions.

The full test setup contains multiple test instruments from Rohde & Schwarz in addition to the mmWave test chamber, which work seamlessly together: four 5G NR-capable R&S SMW200A vector signal generators, a 5G NR-capable R&S FSW signal and spectrum analyzer, and an R&S NGP800 power supply. Each generator simulates a 5G NR FR2 signal which will be fed through one of the R&S ATS1800M feed antennas. The DUT receives the signal via one of the CATR reflectors. With the combination of all signal

sources, feed antennas and reflectors, Kyocera’s engineers can simulate complex reception scenarios of four frequency independent signals from four different locations. The received signal quality can be observed using the signal analyzer connected to the Kyocera PAAM.

Visitors to MWC 2025 can experience this milestone demonstration live at the Kyocera booth 5E12 in hall 5 of the Fira Gran Via in Barcelona from March 3 to 6, 2025.

For further information on antenna testing solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/_231852.html

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AI-powered tool streamlines software development for greater efficiency and accuracy

Microchip Technology is leveraging the power of Artificial Intelligence (AI) to assist software developers and embedded engineers in writing and debugging code with the launch of its MPLAB AI Coding Assistant. A Microsoft Visual Studio Code (VS Code) extension, the free tool is based on Continue—the market’s leading open-source AI code assistant—and comes preconfigured with Microchip’s AI chatbot for real-time support.

The Microchip chatbot enables a chat functionality which allows developers to evaluate and iterate on code directly from the sidebar. This interactive support enhances the coding experience by providing highly customized, relevant real-time assistance and insights on Microchip-specific products. Additional features include advanced autocomplete for easier coding, an edit feature and error detection for efficient code modifications within the current file and integrated access to searchable Microchip documentation within the IDE.

“The MPLAB AI Coding Assistant represents a significant leap forward in software development and will transform how engineers work with Microchip products,” said Rodger Richey, vice president of development systems and academic programs at Microchip. “We’re harnessing the power of AI to provide interactive, real-time support that helps developers create better software, more quickly and with less hassle.”

Unlike most other code assistants on the market, MPLAB AI Coding Assistant’s sidebar chat feature can deliver block diagrams directly within the VS Code interface rather than just text responses. This capability, combined with easy access to a library of documentation on Microchip microcontrollers and microprocessors, streamlines the coding process and helps enhance accuracy.

Visit the website to learn more about Microchip’s wide range of development tools.

Pricing and Availability

The MPLAB AI Coding Assistant is available for free; some advanced features may require a subscription license. For additional information contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

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electronica China 2025 will take place from April 15 to 17, 2025 at the Shanghai New International Expo Centre (SNIEC), in halls W3-W5 and N1-N5. It is expected to attract a total of 1,700 high-quality exhibitors from Chinese and international markets covering 100,000 square meters. The visitor registration is going on heatedly, register now and check out the highlights of the important trade fair for the electronics industry in Asia!

The venue will feature sections for semiconductors, sensors, power supplies, testing and measurement, passive components, displays, connectors, switches, wiring harnesses and cables, distributors, printed circuit boards, electronic manufacturing services, semiconductor intelligent manufacturing, etc. 1,700 premium enterprises from both Chinese and international markets will join in succession, showcasing their cutting – edge scientific research achievements and industry solutions.

This year’s exhibition will continue to host multiple themed forums, focusing on popular application markets and rapidly evolving industries such as electric vehicles, automotive electronics, humanoid robot, third-generation semiconductor, embedded system, AI, IoT, energy storage, smart manufacturing, connector, motor drive. Industry leaders, technical experts, and academic researchers from the electronic sector, application domains, and research institutes will be invited to address audience queries, share case studies, and provide cutting-edge technological solutions.

Click to register now: https://ec.global-eservice.com/?lang=en&channel=ele

For more information: https://www.electronicachina.com.cn/en

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The latest radio resource management (RRM) conformance work item from the Global Certification Forum (GCF) has reached “Active” status following the approval of the Rohde & Schwarz R&S TS8980FTA-M1 5G conformance test system as the first to meet test platform approval criteria (TPAC). This includes the validation of RRM FR2 test cases in standalone mode (SA) for both one and two angles of arrival (1x AoA and 2xAoA) within 5G mmWave band combinations.

Rohde & Schwarz is the first company to obtain Global Certification Forum (GCF) test approval for validating the radio resource management (RRM) performance of advanced 5G New Radio (NR) devices. This approval specifically applies to devices operating in 5G NR standalone (SA) mode within FR2 and capable of managing multiple angles of arrival. It enables device manufacturers to certify their products for global compatibility with mobile networks that utilize mmWave frequencies and operate in 5G SA with a real 5G core network (5GC).

Verifying compliance with critical RRM test cases is increasingly important as wireless 5G routers and customer premises equipment (CPE) gain prominence for fixed wireless access (FWA) applications. These test cases are essential for ensuring a reliable end user experience, especially in challenging network conditions, such as blockages, or at the cell edge.

After the Conformance Agreement Group (CAG) #81 meeting held by GCF in Bangkok January 21 to 23, 2025, it was confirmed that Rohde & Schwarz is currently the only provider offering certification solutions that meet all mandatory test requirements for 5G FR2 RRM, while also supporting the largest number of validated test cases for both RF and RRM in this frequency range. The Rohde & Schwarz 5G mmWave test platform offers a wide range of advanced 5G FR2 non-standalone (NSA) and SA test cases. The platform is built on the CMX500 5G network emulator and includes the R&S ATS1800M anechoic chamber series as well as a powerful device under test (DUT) positioner.

Thomas Eyring, Senior Director of Device Certification at Rohde & Schwarz, commented on the milestone, saying: “We are proud to take a significant step toward enhanced conformance testing as a pioneer in mobile device testing. Our technology will help ensure the quality and reliability of 5G devices while addressing the

challenges in the FR2 frequency range. We are also working on test cases for the upcoming FR3 frequency range, which is expected to play a key role in 6G networks.”

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Altium joins AWS Skills to Jobs Tech Alliance in India; Aims to Bridge Skills Gaps and Enhance Employability for Indian Students

• AWS Cloud Practitioner Essentials – Covering cloud technology basics
• AWS Technical Essentials – Introducing core cloud concepts like networking, databases, and storage
• Amazon AppStream 2.0 Primer – AWS’s application streaming solution
• IoT Fundamentals – Training in IoT and smart technology

• On Campus Applied Learning: Co-hosted events, workshops and challenges will give students hands-on experience in solving industry challenges.
• Pathways to Employment: Students who complete the joint curriculum will connect with industry partners for career opportunities.

The post Altium and AWS Collaborate to Equip India’s Next Generation of Engineers with Industry-Ready Skills in Electronics Design and Cloud Technology appeared first on ELE Times.

The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) growth across most of the key industry segments, SEMI announced today in its Q4 2024 publication of the Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights. The industry outlook is cautiously optimistic at the start of 2025 as seasonality and macroeconomic uncertainty may impede near-term growth despite momentum from strong investments related to AI applications.

After declining in the first half of 2024, electronics sales bounced back later in the year resulting in a 2% annual increase. Electronics sales grew 4% YoY in Q4 2024 and are expected to see a 1% YoY increase in Q1 2025 impacted by seasonality. Integrated circuit (IC) sales rose by 29% YoY in Q4 2024 and continued growth is expected in Q1 2025 with a 23% increase YoY as AI-fueled demand continues boosting shipments of high-performance computing (HPC) and datacenter memory chips.

Similar to electronics sales, semiconductor capital expenditures (CapEx) decreased in the first half of 2024 but saw a strong rebound, particularly in the fourth quarter, resulting in 3% annual growth by the end of 2024. Memory-related CapEx continued to lead the growth surging 53% quarter-on-quarter (QoQ) and 56% YoY in Q4 2024. Non-memory CapEx also edged up in Q4 2024 showing 19% QoQ and 17% YoY improvement. Total CapEx is expected to remain strong in Q1 2025, growing 16% relative to the same period of the previous year on the strength of investments to support high bandwidth memory (HBM) capacity additions for AI deployment.

The semiconductor capital equipment segment remained resilient primarily due to increased investments into expanding leading-edge logic, advanced packaging and HBM capacity. Wafer fab equipment (WFE) spending increased 14% YoY and 8% QoQ in Q4 2024. Quarterly WFE billings are expected to be around $26 billion in Q1 2025. China’s investment continues to play a significant role in the WFE market but started to subside by end of the year. Additionally, back-end equipment showed strong increases in Q4 2024 with the Test segment logging 5% QoQ growth and an impressive 55% YoY increase for the quarter, while the Assembly and Packaging segment experienced a YoY increase of 15%. Both segments are expected to show similar QoQ growth between 6-8% in Q1 2025.

In Q4 2024, installed wafer fab capacity surpassed a record 42 million wafers per quarter worldwide (in 300mm wafer equivalent), and capacity is projected to reach nearly 42.7 million in Q1 2025. Foundry and Logic-related capacity continues to show stronger increases, growing 2.3% QoQ in Q4 2024, and the segment is projected to rise 2.1% in Q1 2025 driven by capacity expansion for advanced nodes. Memory capacity increased 1.1% in Q4 2024 and is forecasted to remain at the same level in Q1 2025 driven by strong demand for HBM.

“Despite seasonality and the challenges of macroeconomic uncertainty, momentum in AI-driven investments continues to fuel expansion across key segments, including memory, capital expenditures, and wafer fab equipment,” said Clark Tseng, Senior Director of Market Intelligence at SEMI. “Looking forward for 2025, the industry remains cautiously optimistic, with robust growth prospects driven by ongoing demand for high-performance computing and data center buildout.”

“As we begin the year, our expectation is for stronger performance in the second half, with semiconductor sales anticipated to remain flat sequentially in the first half, followed by a notable double-digit increase in the latter half,” said Boris Metodiev, Director of Market Analysis at TechInsights. “Inventory challenges persist for discrete, analog, and optoelectronic manufacturers, which will need to be addressed before we can expect widespread growth to resume.”

The Semiconductor Manufacturing Monitor (SMM) report provides end-to-end data on the worldwide semiconductor manufacturing industry. The report highlights key trends based on industry indicators including capital equipment, fab capacity, and semiconductor and electronics sales, along with a capital equipment market forecast. The SMM report also contains two years of quarterly data and a one-quarter outlook for the semiconductor manufacturing supply chain including leading IDM, fabless, foundry, and OSAT companies. An SMM subscription includes quarterly reports.

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The Defence Research and Development Organisation (DRDO) of India has been instrumental in advancing indigenous unmanned aerial vehicle (UAV) technologies to meet the diverse operational requirements of the Indian Armed Forces. Among its notable developments is the Trinetra UAV, a cutting-edge drone system designed to enhance surveillance, reconnaissance, and tactical operations.

Design and Development

The Trinetra UAV, aptly named after the Sanskrit term for “Three Eyes,” signifies a comprehensive surveillance capability. This UAV is engineered to be lightweight and highly portable, primarily constructed from advanced composite materials that ensure structural integrity while minimizing weight. Its compact design facilitates rapid deployment across various terrains, making it an invaluable asset for field operations.

One of the standout features of the Trinetra is its Vertical Take-Off and Landing (VTOL) capability. Utilizing a quadcopter configuration, the UAV can ascend and descend vertically, negating the need for traditional runways or launch systems. This attribute is particularly advantageous in confined or rugged environments where conventional take-off and landing are impractical.

Technical Specifications

While specific technical details of the Trinetra UAV remain classified, insights can be drawn from DRDO’s previous UAV projects, such as the Netra series. The Netra V4+, for instance, boasts an operational range of up to 10 kilometers and a flight endurance exceeding 60 minutes at mean sea level. It is equipped with a high-resolution imaging payload featuring a 10x optical zoom, enabling detailed surveillance from significant distances. Additionally, the Netra V4+ can operate at altitudes up to 400 meters Above Ground Level (AGL) and is designed for ease of transport and quick assembly, weighing approximately 6.5 kilograms.

Given the evolutionary nature of DRDO’s UAV development, it is plausible that the Trinetra UAV incorporates similar or enhanced specifications, tailored to meet the specific demands of modern military operations.

Operational Capabilities

The Trinetra UAV is designed to execute a wide array of missions, encompassing intelligence gathering, border surveillance, and tactical support. Its VTOL capability ensures that it can be deployed in diverse environments without the constraints associated with traditional UAV launch and recovery methods.

Equipped with advanced electro-optical and infrared sensors, the Trinetra provides real-time video streaming and high-resolution imagery, facilitating both day and night operations. This dual-sensor setup ensures continuous situational awareness, enabling ground commanders to make informed decisions based on live intelligence.

Autonomous navigation is a cornerstone of the Trinetra’s operational design. The UAV can follow pre-programmed flight paths using waypoint navigation, allowing it to conduct missions with minimal human intervention. In scenarios where communication is disrupted or battery levels are critically low, the Trinetra is programmed to autonomously return to its launch point, ensuring mission continuity and asset recovery.

Recent Developments

In a strategic move to enhance its unmanned capabilities, the Indian Army has placed a significant order for nearly 700 Trinetra drones. This procurement aims to bolster surveillance and reconnaissance operations, particularly in challenging terrains such as the Himalayas. The deployment of these drones is expected to provide real-time intelligence, thereby improving operational efficiency and response times. This acquisition aligns with the broader strategy of integrating advanced indigenous unmanned systems into the armed forces to address contemporary security challenges.

Strategic Implications

The induction of the Trinetra UAV into the Indian Armed Forces signifies a pivotal shift towards embracing indigenous technologies for defense applications. This move not only reduces dependency on foreign systems but also fosters self-reliance in critical defense technologies. The Trinetra’s capabilities are poised to enhance border surveillance, counter-insurgency operations, and disaster management efforts. Its real-time intelligence-gathering prowess is expected to be a force multiplier, providing commanders with actionable insights and facilitating informed decision-making in complex operational environments.

Conclusion

The DRDO’s Trinetra UAV represents a significant advancement in India’s unmanned aerial capabilities. Its blend of cutting-edge technology, autonomous features, and adaptability to diverse mission requirements positions it as a pivotal asset in modern warfare and surveillance. As the Indian Armed Forces continue to integrate such indigenous systems, the Trinetra UAV stands as a testament to India’s commitment to technological innovation and self-reliance in defense.

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Gallium Nitride (GaN) technology plays a crucial role in enabling power electronics to reach the highest levels of performance. However, GaN suppliers have thus far taken different approaches to package types and sizes, leading to fragmentation and lack of multiple footprint-compatible sources for customers. Infineon Technologies AG addresses this challenge by announcing the high-performance gallium nitride CoolGaN G3 Transistor 100 V in RQFN 5×6 package (IGD015S10S1) and 80 V in RQFN 3.3×3.3 package (IGE033S08S1).

“The new devices are compatible with industry-standard silicon MOSFET packages, meeting customer demands for a standardized footprint, easier handling and faster-time-to- market,” said, Dr. Antoine Jalabert, Product Line Head for mid-voltage GaN at Infineon.

The CoolGaN G3 100 V Transistor devices will be available in a 5×6 RQFN package with a typical on-resistance of 1.1 mΩ. Additionally, the 80 V transistor in a 3.3×3.3 RQFN package has a typical resistance of 2.3 mΩ. These transistors offer a footprint that, for the first time, allows for easy multi-sourcing strategies and complementary layouts to Silicon-based designs. The new packages in combination with GaN offer a low-resistance connection and low parasitics, enabling high performance transistor output in a familiar footprint.

Moreover, this chip and package combination allows for high level of robustness in terms of thermal cycling, in addition to improved thermal conductivity, as heat is better distributed and dissipated due to the larger exposed surface area and higher copper density.

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India’s unmanned aerial vehicle (UAV) industry is soaring to new heights, fueled by rapid technological advancements, policy support, and increasing demand across diverse sectors. From bolstering national security to revolutionizing precision agriculture and infrastructure monitoring, drones are becoming indispensable assets. As the Indian government pushes for self-reliance under the “Make in India” initiative, domestic UAV manufacturers are stepping up with cutting-edge innovations and indigenous designs. In this evolving landscape, several companies are leading the charge, redefining aerial intelligence and automation. Here’s a look at the top 10 UAV manufacturers shaping India’s drone ecosystem in 2025.

1. ideaForge Technology Limited

Established in 2007, ideaForge is a Mumbai-based UAV manufacturer renowned for designing and developing drones tailored for mapping, security, and surveillance applications. Serving defense forces and various government departments, ideaForge holds a significant position in the Indian drone industry. In July 2023, the company marked a milestone by launching its initial public offering (IPO), underscoring its growth trajectory. At Aero India 2025, ideaForge unveiled four new UAVs: NETRA 5, SWITCH V2, a Tactical UAV concept, and a Logistics UAV concept, each designed to address operational challenges in high-stakes environments.

2. Asteria Aerospace

Asteria Aerospace is a prominent player in the Indian drone industry, focusing on the development of UAVs for diverse applications across defense and industrial sectors. The company offers a range of drone solutions tailored to meet specific operational requirements, emphasizing innovation and reliability in its products.

3. Zen Technologies

Specializing in defense training solutions, Zen Technologies has expanded its portfolio to include UAVs and related systems for military applications. Leveraging its expertise in simulation and training, the company provides comprehensive drone solutions that enhance defense capabilities and operational readiness.

4. Paras Defence and Space Technologies

Paras Defence is engaged in the design, development, and manufacturing of a wide array of defense and space engineering products, including UAVs. Catering to various segments of the Indian defense industry, the company contributes to the nation’s strategic capabilities by delivering advanced drone technologies and solutions.

5. Garuda Aerospace

Based in Chennai, Garuda Aerospace offers drone-based solutions across multiple sectors, including agriculture, infrastructure, and surveillance. The company’s focus on delivering cost-effective and efficient UAV services has positioned it as a key player in the Indian drone ecosystem, addressing diverse industry needs with innovative approaches.

6. Aarav Unmanned Systems

Aarav Unmanned Systems specializes in providing drone solutions for industrial applications such as mining, urban planning, and agriculture. Their UAVs are engineered to deliver high-quality data, facilitating informed decision-making processes and enhancing operational efficiency across various sectors.

7. NewSpace Research & Technologies

Headquartered in Bengaluru, NewSpace Research & Technologies focuses on developing persistent drones for earth observation and communications. Collaborating with Hindustan Aeronautics Limited (HAL), the company is instrumental in projects like the Combat Air Teaming System (CATS) Infinity, a high-altitude pseudo-satellite UAV designed for extended endurance and strategic operations.

8. Throttle Aerospace Systems Pvt Ltd

Throttle Aerospace Systems (TAS), based in Bengaluru, is a leading entity in the Indian drone manufacturing sector. As the first Directorate General of Civil Aviation (DGCA)-approved maker of civil drones and licensed to produce military drones, TAS offers a range of innovative products and solutions aimed at transforming mobility across various industries.

9. Drones Origin Private Limited

Located in Hyderabad, Drones Origin Private Limited specializes in the indigenous design and manufacturing of drone and UAV components. Positioning itself as a one-stop solution for various drone-related needs, including propulsion and custom designs, the company emphasizes self-reliance and aligns with the ‘Make in India’ initiative, contributing to the nation’s growing drone manufacturing industry.

10. IG Drones

IG Drones is recognized as one of the top ‘Made-in-India’ drone manufacturers, contributing significantly to the country’s UAV landscape. The company focuses on delivering innovative drone solutions that cater to various industry requirements, enhancing operational efficiency and productivity.

The rapid expansion of India’s UAV industry is a testament to the technological advancements and entrepreneurial spirit driving the sector. These top 10 manufacturers exemplify the country’s commitment to innovation, self-reliance, and the strategic integration of drone technology across multiple domains.

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At NORD DRIVESYSTEMS, our sustainability strategy for 2025 focuses on acting in an environmentally conscious, responsible and integer manner. A cross-divisional team as well as the management and owners are part of the implementation. Besides NORD’s products, it includes four further fields of action.

 “Our sustainability strategy for 2025 is a promise to our customers, to the public and to ourselves to consequently act in an ecological, economic and socially responsible manner”, emphasizes Carolin von Rönne from the area of Process and Organisational Development & Corporate Sustainability Management at NORD DRIVESYSTEMS. The strategy comprises five key aspects:

When it comes to sustainability, our products at NORD are also our top priority. This is because the design, life cycle and application areas have an impact on the environment. The concept of sustainability is therefore already rooted in the product development process. “Drives can be found in many areas of industry, where they consume a large proportion of the energy used,” explains Carolin von Rönne. “With efficient drive solutions such as the IE5+ synchronous motor, we want to make a significant contribution to reducing CO₂ emissions.“ The NORD ECO service furthermore supports companies in finding the most efficient drive solutions for them.

The sustainability management was introduced at NORD in 2022. Since then, the company has achieved important milestones such as an annual sustainability report according to GRI, environmental certifications and the integration of international structures. The central objective in this field of action is the establishment of an international governance structure and CSRD-compliant reporting for the entire NORD DRIVESYSTEMS Group with 48 subsidiaries in 36 countries because the success of other factors – in

In order to coordinate structured measures and document them in a legally secure manner, international environmental management is essential for NORD. This is implemented in accordance with ISO14001 for the largest subsidiaries. In addition, the climate balance for Scope 1–3 is determined group-wide. NORD DRIVESYSTEMS Group further aims to reduce its energy consumption and amount of waste as well as increase the share of self-produced electric power and the use of renewable energies. Existing biodiversity areas are to be further expanded.

In times of skills shortage, NORD continues to increase its attractiveness as an employer. The company is currently rolling out a global digital learning management system to offer all employees the opportunity for further individual development. Further targeted campaigns and measures are intended to promote diversity among the workforce. “Inclusion, respect for human rights, strengthening our work culture, safety and continuous transfer of knowledge are only some of the topics we would like to promote”, says Carolin von Rönne.

NORD wants to reassure its customers and employees that sustainable production is given high priority both at manufacturing facilities and in the upstream supply chain. Risk analyses and other processes are carried out within the framework of the Germany Act on Corporate Due Diligence Obligations in Supply Chains (LKSG).

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In recent years, the proliferation of unmanned aerial vehicles (UAVs) has necessitated the development of robust counter-drone technologies to address security concerns. India, recognizing this imperative, has seen a surge in companies specializing in anti-drone systems.

This article highlights ten leading Indian manufacturers at the forefront of this critical sector, detailing their technological innovations and contributions.

1. Zen Technologies

Established in 1993, Zen Technologies has been a pioneer in defense training solutions and has expanded into anti-drone technologies. Their comprehensive anti-drone system encompasses detection, tracking, and neutralization capabilities. Utilizing radar, radio frequency (RF) sensors, and electro-optical systems, Zen’s solution can detect and track multiple drones simultaneously. For neutralization, they offer both ‘soft kill’ options, such as RF jamming to disrupt drone communications, and ‘hard kill’ measures, including kinetic systems to physically eliminate threats. Notably, Zen Technologies provides a net-based drone capture mechanism, deploying a dedicated drone equipped with a hanging net to intercept and secure rogue UAVs safely.

2. Bharat Electronics Limited (BEL)

A state-owned enterprise, BEL has collaborated with the Defence Research and Development Organisation (DRDO) to produce an advanced anti-drone system. This system is capable of real-time detection, tracking, and neutralization of micro and small UAVs. It integrates radar, RF detectors, and electro-optical sensors to provide comprehensive situational awareness. The neutralization suite includes both ‘soft kill’ options, like jamming the drone’s communication and navigation signals, and ‘hard kill’ solutions, such as laser-based directed energy weapons to destroy the target.

3. Alpha Design Technologies

Specializing in electronic warfare systems, Alpha Design Technologies has developed advanced solutions to counter UAV threats. Their anti-drone systems are designed to detect, track, and neutralize unauthorized drones using a combination of radar, RF monitoring, and electro-optical tracking. The neutralization methods include jamming and spoofing techniques to disrupt the drone’s control and navigation systems, effectively mitigating potential threats.

4. Adani Defence & Aerospace

A significant player in India’s defense sector, Adani Defence & Aerospace is actively engaged in developing counter-drone technologies. Their approach focuses on creating integrated systems that combine detection and neutralization capabilities. Utilizing radar and RF sensors for detection, their systems can identify and track multiple drone threats. For neutralization, they employ electronic countermeasures to disrupt drone operations, ensuring the protection of critical infrastructure and airspace.

5. Indo Wings Private Limited

As one of India’s fastest-growing drone and anti-drone manufacturers, Indo Wings specializes in advanced UAVs and counter-UAV systems. Their anti-drone solutions are equipped with sophisticated detection technologies, including radar and RF sensors, to identify and track unauthorized drones. Neutralization is achieved through electronic jamming and other countermeasures, effectively addressing potential threats in various environments.

6. Hindustan Aeronautics Limited (HAL)

A state-owned aerospace and defense company, HAL is developing artificial intelligence-driven advanced drones and counter-drone systems for strategic missions. Their focus includes creating solutions capable of operating in high-altitude areas, addressing security challenges along India’s frontiers. HAL’s anti-drone technologies aim to detect and neutralize UAV threats, enhancing the country’s defense capabilities.

7. Paras Aerospace

A subsidiary of Paras Defence and Space Technologies, Paras Aerospace offers a range of UAVs and counter-drone solutions. Their anti-drone systems are designed to detect and neutralize rogue drones using advanced sensor technologies and electronic countermeasures. These systems are suitable for protecting critical infrastructure, public events, and sensitive areas from unauthorized drone activities.

8. Kadet Defence Systems

Specializing in defense technologies, Kadet Defence Systems has developed anti-drone solutions focusing on detection and neutralization. Their systems utilize radar and RF sensors to detect unauthorized drones and employ jamming technologies to disrupt their operations. These solutions are designed to protect military installations, government facilities, and other critical assets from potential drone threats.

9. Throttle Aerospace Systems

Throttle Aerospace Systems has developed the ‘Defender,’ an innovative anti-drone platform that employs vision-based techniques and artificial intelligence. The Defender is capable of actively tracking and neutralizing rogue drones weighing up to 5 kg. This system enhances security by providing an effective solution to counter unauthorized UAVs in various environments.

10. DSE Technologies Pvt. Ltd.

DSE Technologies has secured projects for high-end tactical drone detection and neutralization systems. Their solutions offer both ‘soft-kill’ and ‘hard-kill’ options, emphasizing their expertise in security solutions for Indian forces and national security agencies. These systems are designed to detect, track, and neutralize unauthorized drones, ensuring the protection of critical assets and airspace.

India’s anti-drone industry is rapidly evolving, with these companies leading the charge in developing advanced technologies to counter the growing threat of unauthorized UAVs. Through continuous innovation and collaboration, they are enhancing the nation’s security infrastructure and contributing to global counter-drone capabilities.

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The drone industry in the United States has witnessed remarkable growth, driven by startups pioneering advancements across various sectors. From defense and agriculture to public safety and logistics, these companies are redefining the capabilities of unmanned aerial systems (UAS).

This article highlights ten leading U.S.-based drone startups, delving into their innovative technologies and contributions to the industry.

1. Anduril Industries

Founded in 2017, Anduril Industries specializes in AI-driven surveillance and reconnaissance solutions for the defense sector. Their flagship product, the Lattice platform, integrates sensor fusion, machine learning, and mesh networking to provide autonomous monitoring and control of defense assets. Additionally, Anduril has developed the Ghost drone, an autonomous single-rotor UAV controllable via web platforms or mobile applications, enhancing situational awareness in complex environments.

2. Skydio

Established in 2014, Skydio is renowned for its autonomous drones equipped with advanced AI and computer vision. Their drones, such as the Skydio 2+, utilize six 4K navigation cameras to construct a 3D map of their surroundings, enabling obstacle avoidance and autonomous navigation even in GPS-denied environments. Skydio’s technology serves various applications, including infrastructure inspection, public safety, and cinematic content creation.

3. Shield AI

Founded in 2015 by former Navy SEAL Brandon Tseng and his brother Ryan, Shield AI focuses on developing AI-powered drones for military applications. Their V-BAT drone is notable for its vertical takeoff and landing (VTOL) capabilities and autonomous navigation without reliance on GPS or remote control. The V-BAT has demonstrated resilience in electronic warfare environments, successfully identifying and aiding in the neutralization of hostile assets.

4. DroneDeploy

Since its inception in 2013, DroneDeploy has become a leading provider of drone software solutions, enabling users to create detailed aerial maps and 3D models. Their platform supports various industries, including agriculture, construction, and mining, by offering tools for real-time data analysis, progress tracking, and resource management. DroneDeploy’s software is compatible with a wide range of drone hardware, providing flexibility for enterprise applications.

5. Epirus

Epirus, established in 2018, specializes in directed energy systems designed to counter unmanned aerial threats. Their flagship product, the Leonidas system, employs high-power microwave technology to disable swarms of drones instantaneously. This compact and mobile system offers a scalable solution for defense against evolving aerial threats, providing protection for critical infrastructure and military assets.

6. Zipline

Founded in 2014, Zipline has revolutionized logistics through autonomous drone delivery services. Initially focusing on medical supply deliveries in remote regions, Zipline has expanded its operations to include commercial partnerships, such as delivering retail products in urban areas. Their drones are designed for long-range missions, capable of operating in diverse weather conditions to ensure timely deliveries.

7. Corvus Robotics

A participant in Y Combinator’s 2018 cohort, Corvus Robotics develops autonomous indoor drones for warehouse inventory management. Their drones navigate complex indoor environments to perform automated inventory scans, reducing the need for manual counts and increasing operational efficiency. Equipped with advanced sensors and AI algorithms, these drones can operate in GPS-denied spaces, providing real-time data to warehouse management systems.

8. Rotor Technologies

Established in 2021, Rotor Technologies focuses on converting traditional helicopters into unmanned aerial systems. Their Sprayhawk model, based on the Robinson R44 platform, is designed for agricultural applications, featuring a 120-gallon spray tank and autonomous flight capabilities. This approach leverages existing aircraft designs, retrofitting them with advanced avionics and control systems to perform tasks such as crop spraying and cargo transport autonomously.

9. BRINC Drones

Founded in 2018, BRINC Drones develops UAVs tailored for public safety and emergency response. Their drones are designed for both indoor and outdoor operations, featuring two-way communication systems, the ability to breach barriers, and payload delivery capabilities. These features enable first responders to assess situations remotely, communicate with individuals in hazardous environments, and deliver essential supplies during emergencies.

10. Unusual Machines

Unusual Machines, based in Florida, specializes in the manufacturing of drone components and systems. In November 2024, the company garnered attention by appointing Donald Trump Jr. to its advisory board, aiming to repatriate drone manufacturing to the United States. This strategic move aligns with broader efforts to reduce dependence on foreign technology and strengthen domestic production capabilities in the drone industry.

These startups exemplify the dynamic and rapidly evolving landscape of the U.S. drone industry. Through innovative technologies and applications, they are expanding the horizons of what unmanned aerial systems can achieve across various sectors.

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SPEAG and Rohde & Schwarz expand their long-term collaboration with the combination of the CMX500 wideband radio communication tester with the DASY8-3D utilising the enhanced DASY8 Application Programming Interface. This combination allows manufacturers of wireless devices to perform Specific Absorption Rate tests of 5G FR1 devices using the future-proof CMX500 multi-technology, multi-channel one-box signaling tester.

SPEAG, a global leader of dosimetric test systems, has combined the CMX500 OBT from Rohde & Schwarz with its advanced specific absorption rate (SAR) measurement system, DASY83D. The CMX500 OBT emulates a 5G new radio (NR) FR1 base station, fulfilling the requirements for SAR testing of 5G NR devices and providing ease of use for the test engineer. The CMX500 radio communication tester supports cellular technologies such as LTE, 5G NR, as well as non-cellular technologies like Wi-Fi, all in a single instrument. The latest test feature sets, including state-of-the-art wireless technologies like NR-NTN, 5G RedCap, and Wi-Fi 7, provides a long-term, future-proof callbox platform.

The evolution of wireless technology has enabled the creation of an increasing number of wireless products that function close to the human body. These products range from cell phones and smart watches to AR/XR goggles, all of which need to ensure their SAR values meet the essential regulatory requirements imposed by many countries. For instance, the Federal Communications Commission (FCC) in the USA, Innovation, Science and Economic Development (ISED) in Canada, and the European Union have all established stringent SAR regulations and continuously developed safety standards for decades. Several other countries, including China, Vietnam, and India, have gradually adopted similar market access regulation requirements regarding the SAR of radio equipment in recent years. Globally, numerous regulatory test labs and market surveillance test labs are equipped with SPEAG systems for SAR testing.

The successful collaboration between SPEAG and Rohde & Schwarz is testimony to the long-term strategy of both companies for leadership and innovation in test and measurement applications for the wireless industry.

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The electronics industry is experiencing a significant shift towards more compact and powerful systems. To support this trend and further drive innovation at the system level, Infineon Technologies AG is expanding its portfolio of discrete CoolSiC MOSFETs 650 V with two new product families housed in Q-DPAK and TOLL packages.

These diverse product families, with top- and bottom-side cooling, are based on the CoolSiC Generation 2 (G2) technology and offer significantly improved performance, reliability, and ease of use. The product families target high- and medium-power switched-mode power supplies (SMPS) including AI servers, renewable energy, chargers for electric vehicles, e-mobility and humanoid robots, televisions, drives and solid-state circuit breakers.

The TOLL package offers outstanding Thermal Cycling on Board (TCoB) capability, enabling compact system designs by reducing the printed circuit board (PCB) footprint. When used in SMPS, it can also reduce system-level manufacturing costs. The TOLL package now fits an extended list of target applications, enabling PCB designers to further reduce costs and better meet market demands.

The introduction of the Q-DPAK package complements the ongoing development of Infineon’s new family of Topside Cooled (TSC) products, which includes CoolMOS 8, CoolSiC, CoolGaN and OptiMOS. The TSC family enables customers to achieve excellent robustness with maximum power density and system efficiency at low cost. It also enables direct heat dissipation of 95 percent, allowing the use of both sides of the PCB for better space management and reduction of parasitic effects.

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By: STMicroelectronics

Zonal platform. Domain architecture. Those are words people almost never hear in the context of the car they will drive in the next decade. When most people think of the future, they imagine an electric vehicle with a high level of driver assistance or autonomous driving capabilities – and all the latest digital media capabilities built in. While we might wonder what such a car would look like and how it would drive, we rarely think about what would need to take place in the unseen parts of the vehicle to make this reality. Yet, it’s exactly what is driving a hidden revolution: the move to zonal architecture and software-defined vehicles.

Let’s take a step back. A few years ago, most industry pundits foresaw the growing popularity of EVs (electric vehicles), and governments set ambitious goals, such as phasing out fossil fuel vehicles in the European Union by 2035. Many of these objectives are still in effect. And while some consumer adoption has slowed, the hype curve forecasts that the industry is about to pick up steam. Certain analysts simply think that consumers are waiting for longer-range, more reliable and extensive charging networks, as well as more affordable options.

So why is the car of tomorrow not here already? Because building the kind of vehicles consumers are clamoring for requires the industry to rethink how cars are designed. OEMs, Tier 1 suppliers, and others have realized that one of their best solutions was to create new platforms to enable greater efficiency and more quickly introduce technological advancements. For instance, in May 2024, Audi revealed its Premium Platform Electric (PPE). Developed jointly with Porsche, the platform makes its Q6 e-tron series significantly more efficient and capable.

Yet, despite a renewed emphasis on the car architecture, almost no one ever gets to see this “platform.” It’s for this reason that the ST Booth at electronica 2024 in Munich, Germany, will give attendees the unique opportunity to see one of the most hidden aspects of modern vehicles: an electronic/electrical (E/E) architecture. The exhibit shows the wiring harness of an actual car currently on the market, peeling back the curtain to expose the quiet revolution happening in the automotive industry.

The first electronic system to make its way into mainstream vehicles was the electronic fuel injector (EFI) in the 70s, which replaced the carburetor. It used an Electronic Control Unit (ECU) to inject fuel into the engine, improving performance and reducing air pollution. As more ECUs brought electric windows or seats, for instance, engineers moved to a distributed architecture where one central gateway talked to multiple ECUs around the car. It enabled the prioritization of ECUs, ensuring that safety features, such as steering or braking, took precedence.

Afterward, as advanced driver assistance systems and new functionalities were invented and the industry maxed out the number of ECUs it could on a single platform, the industry moved to the domain architecture. This structure categorizes ECUs into domains, such as advanced driver-assistance systems (ADAS), powertrain, chassis, safety, infotainment, and more. Each domain has a gateway that talks to ECUs that control numerous devices and sensors. Many car makers have adopted this architecture today, for good reasons, optimizing it with each new iteration to make it more efficient. In the same vein, other car makers with the same goal in mind are exploring zonal architectures.

The zonal architecture organizes ECUs by their physical location inside the vehicle. It leverages a new generation of ECUs with powerful processing functions and a central High-Performance Computing Unit (HPCU) that supports fast communication protocols like Ethernet. Consequently, it simplifies platform design by reducing cable lengths and gauges, among other things. A central HPCU can also deal with the amount of data, computational throughput, and power required by high-performance ADAS functions, as well as new applications, such as AI.

This helps car makers move toward software-defined vehicles – an important step in speeding up innovation and allowing smartphone-like upgrades over time, thanks to over-the-air updates. This explains why S&P Global Mobility predicts that nearly 40% of the new cars manufactured in 2034 will feature a zonal architecture.

The Q6 e-tron onboard network exhibit on the ST booth at electronica is a great example of a car maker optimizing its architecture. The domain platform features 1,500 cables totaling over 3,500 meters (about 3,900 yards) and weighing nearly 60 kilograms (130 lb). It also includes over 400 connectors that can interconnect around 100 ECUs. It’s rare to see this harness laid out in public. The exhibit exemplifies the expertise it takes to ensure that all ECUs and connectors serve to optimize the platform rather than weighing it down. It’s a new way of thinking that demands highly specialized know-how and extensive knowledge of the overall product.

The move to a zonal architecture demonstrates this point even more. Conservatively, a vehicle switching to a zonal architecture would see its overall harness weight shrink by around 20%, increasing the battery’s range or gas mileage. A lighter car takes less energy to travel a set distance, thus improving its efficiency and reducing operating costs since consumers can drive more for less. Hence, it is fascinating that while the lighter and simpler harness is entirely hidden from the user, its impact is very visible.

Another way the hidden architecture makes itself known to users is through the many software features consumers want to use and see improved throughout the life of their vehicle. Not many realize how applications govern cars, but they still demand features like 360º camera vision as well as connected and cloud-based systems that provide entertainment, over-the-air updates, and other smartphone-like capabilities. Most drivers don’t know that the harness is directly responsible for enabling a new generation of software-defined vehicles, but they expect predictive maintenance applications for a better experience. And car makers know that instead of a recall, a software update can help save a lot of time, significantly reduce costs, and improve brand appreciation.

Today, software increasingly controls every aspect of the car, thanks in part to the rise of real-time virtualization, which improves the use of hardware resources by ensuring developers can do more with the same components. It’s all about decoupling the code from what it runs on. Thanks to containers and hypervisors, it is possible to run multiple software modules on one hardware ecosystem and still enjoy proper segregation to protect against interference. The technology is already popular in servers and data centers to create secure, safe, and efficient systems. It’s no wonder car makers are bringing it to their new vehicles.

Another advantage of this software paradigm is that it is responsible for the explosion of data generation and the centralization of processing capabilities for improved analysis and decision-making. New architectures have enabled car makers to install hundreds of sensors when they were limited to a few dozen in previous platforms. And more importantly, thanks to the more powerful ECUs and HPCUs, OEMs can future-proof systems and run powerful algorithms but still enjoy a more straightforward development experience. If one software platform can run more applications, it will enable car makers to offer more and richer features while keeping costs down, and ensure consumers get more value out of their vehicles.

As we alluded to, the advent of software-defined vehicles and the decoupling of the hardware from the application is only possible if car makers choose microcontrollers and microprocessors that can meet their safety requirements while also offering the computational power and hardware IPs necessary to make this a reality. Engineers must find devices that can support real-time virtualization, numerous I/Os, and a large, embedded, and fast memory that facilitates over-the-air updates. MCUs must be designed and certified for automotive use with specialized safe redundancy built-in, especially as ECUs handle more and more safety applications.

It’s easy to see that this new evolution in car architecture represents a unique electrical challenge, as engineers must create robust, safe, and efficient power distribution mechanisms. It’s the reason why many are adopting smart switches. Unlike the classic melting fuses and mechanical relays, these new electronic switches are faster. As a result, they can offer far greater protection against an adverse electrical event because they respond much quicker than classical components. Their electronic nature also makes them vastly more accurate and flexible. Indeed, they come with monitoring features to enable real-time load management and control. Moreover, they are resettable, which saves from having to replace them manually.

Another critical benefit of smart fuses is their tiny size compared to traditional switches and relays. Because eFuses are so small and electronically controlled, car makers can use shorter harnesses since, among other things, they no longer need to route cables to a large fuse box that must be user accessible. Moreover, the significantly higher accuracy means that the harness can be thinner, thus further contributing to weight reduction. A smaller design with fewer components that are more robust and accurate also helps improve overall reliability. Hence, while some engineers are still evaluating the cost of eFuses, the overall savings over the architecture’s lifetime explain their increasing popularity.

Taking a step back, we see that power distribution is also a much more critical engineering challenge because vehicles are dealing with far greater loads. Most architectures must handle 12 V, but the industry is moving to 48 V. EV chargers must also be able to handle very high voltages and power levels (up to 3,500 kW today). Hence, one of the most popular solutions is to use wide bandgap devices, such as silicon carbide (SiC). The fast switching frequencies of SiC MOSFETs and diodes mean they can handle a lot more power without the energy losses of previous devices, enabling smaller traction inverters, faster charging modules, and more efficient compressors, among other things.

The domain and zonal car architectures emerging today testify to a new reality: everything is connected, and all roads (harnesses, in this case) lead to close cooperation between the key actors of the industry – car makers, Tier 1s, and semiconductor companies. Companies like ST understand how to support platform designers in their quest to decouple the hardware from the software and improve efficiency, safety, and robustness. Together, they create the innovations essential to the future of vehicles that will drive demand for the next generation of cars. It’s for this reason that existing carmakers and new startups are creating ever more intimate partnerships with semiconductor makers and why the market is going through such a disruption.

ST’s ability to grasp new engineering challenges is evidenced through its products. The Stellar family of devices has unique virtualization capabilities to future-proof the software-driven vehicles of tomorrow while its software ecosystem helps reduce development times and meet regulatory requirements. Similarly, STi²Fuse can shrink the overall harness, reduce the bill of materials, and optimize the overall power distribution. Additionally, silicon carbide power devices continue to bring new levels of efficiency. In essence, it’s by offering a wide range of solutions that semiconductor companies can be the close partners that car makers need them to be as they drive the new architectures that will meet the hopes and expectations of their customers.

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The automotive industry is facing significant technological challenges in developing new and innovative features and services. When defining their products, vehicle manufacturers must anticipate future technical advancements in microelectronic platforms, sensors, and semiconductor technologies. At the same time, suppliers and semiconductor manufacturers need early insights into the requirements for upcoming features and services to be able to invest in technology development with confidence.

As part of the “GENIAL!” project funded by the Federal Ministry of Education and Research (BMBF), eleven partners collaborated to develop concepts and methods that help companies in the automotive industry work together more effectively and prepare for the future. The project specifically focused on optimizing the collaboration between automotive manufacturers and their component and technology suppliers to accelerate innovation across the automotive value chain.

The prototypical automotive microelectronics roadmap developed in GENIAL! provides a strategic framework for identifying future market needs, use cases, system models, and technical requirements in the field of automotive microelectronics. This roadmap establishes a shared understanding of the microelectronics requirements of future highly innovative vehicles across the entire value chain. The results enable all market participants, as well as research institutions and policymakers, to manage investments and research activities more effectively. In turn, this facilitates the implementation of significantly shorter and more reliable development processes, allowing new, innovative automotive components to be realized more quickly.

The project was based on a model-based system development approach that utilizes the Systems Modeling Language (SysML) as a modeling language, now integrated into SysML v2. This approach is supported by the AGILA database and further enhanced by the IRIS (Interactive Roadmapping of Innovative Systems) tool, both developed within the project. AGILA serves as a centralized database for capturing the essential information and providing documentation, consistency checks, and version control.

The IRIS tool enables collaborative modeling, exploration, planning, and evaluation of solution alternatives. It also supports non-technical information, allowing considerations such as security of supply, and enables visualizations for roadmapping. To encourage widespread adoption, the project participants will release tools such as AGILA and IRIS as open-source solutions, making them accessible for anyone interested in creating and maintaining roadmaps.

The innovation modeling methodology “IMoG” (Innovation Modelling Grid) defines activities, roles, and process models for the collaborative creation of roadmaps. This spans from the initial comparison of models in the problem and solution space to the practical application of the AGILA and IRIS tools. Documentation of the methodology, along with several training videos, is available for free download.

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