ELE Times

ASMPT, the global innovation and market leader in SMT and semiconductor assembly & packaging solutions, calls its extensive presence at the world’s leading trade fair productronica for electronics development and manufacturing in Munich a complete success. All its businesses – ASMPT Semiconductor Solutions, ASMPT SMT Solutions, and Critical Manufacturing – presented themselves as an innovative and integrated whole.

“What belongs together in the semiconductor industry is coming together,” said Guenter Lauber, EVP & Chief Strategy and Digitalization Officer at ASMPT. “Innovative developments such as system-in-package components, but also increasing cost pressures, require us to overcome the boundaries between SMT and die processing, and to think and act across lines, products and manufacturing facilities when it comes to data use.”

Industry visitors were able to see what this looks like in practice at the joint ASMPT booth, where ASMPT Semiconductor Solutions presented new innovative machines that are particularly interesting for automotive applications in the areas of ADAS, connectivity and electrification that require maximum precision and unique speeds. With an SMT production line that was fully optimized for volume production and a flexible SMT line for small-batch production, ASMPT demonstrated once again that the innovation and market leader is able to cover the entire hardware spectrum for modern electronics manufacturing. The hybrid pick-and-place machine SIPLACE CA marks the successful synthesis between chip assembly and SMT processing, and the industry audience’s interest was correspondingly high.

ASMPT’s software products were all about its new Intelligent Factory concept, which focuses on the smart use of data and connects all production levels from the machines to the enterprise into a functional and productive whole. As a result, skilled workers are deployed more efficiently, materials are scheduled more effectively, and errors and production impediments are detected and rectified more quickly. Also trend-setting was ASMPT’s Critical Manufacturing software business, which presented its modern, integrated manufacturing execution system (MES) designed specifically for electronics manufacturing at the trade fair.

“Frequent feedback from our customers was: “What I would otherwise have to put together from many different sources, the market leader is now offering from a single source”,” said Guenter Lauber. “This means ASMPT features a hardware and software concept that is as coherent as it is comprehensive while incorporating existing third-party solutions and combining the performance and precision of proven hardware with future-oriented software.”

“Lively interest by the public and extremely positive customer feedback at the fair are both a confirmation of our work and an incentive,” says Guenter Lauber, about his company’s endeavors. “In 2024, we will continue to consistently advance our integrative strategy in all divisions. Achieving the greatest return on investment for our customers, however, is and continues to be our overarching goal in everything we do.”

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Author : STMicroelectronics

ST is announcing today the launch of STM32C071s with 128 KB of flash and a USB controller, thus further cementing our new series as an entry-level MCU and gateway to 32-bit architectures. We are also divulging a new roadmap with devices housing up to 256 KB of flash by the end of next year and will update this blog post when they become available. In the meantime, samples of the STM32C071 should arrive by mid-2024 but are publicly revealed today to help integrators plan ahead. We are also announcing new price drops with the existing STM32COs featuring 32 KB of flash dipping below $0.24 for 10,000 units, making the series even more accessible.

Despite launching the STM32C0 only a few months ago, in January 2023, the reception has been so positive that competitors have adopted similar strategies, some even calling out STM32s in their documentation. In a nutshell, the new price-per-performance ratio of the STM32C0s disrupted the market by enabling integrators to not only consider 32-bit MCUs but also envision roadmaps and upgrade paths previously impossible. Hence, as we close 2023, we wanted the STM32C0 to continue disrupting markets by further lowering prices and increasing memory so more engineers can jump on the bandwagon.

The STM32C071 is the most impressive upgrade as it quadruples the memory configuration thanks to 128 KB of flash and 24 KB of RAM. Put simply, products that had to adopt significantly more expensive devices because of memory constraints can now exist in entry-level markets, thus making them vastly more competitive. And because we anticipate a lot of these systems to use USB to deliver power, we added a crystal-less USB controller. Indeed, engineers can use the internal clock, thus alleviating the need for an external crystal, which increases the bill of materials and the PCB layout complexity.

Consequently, the STM32C071 is highly symbolic because it brings more functionalities from the STM32G0 down to the STM32C0. Besides the USB controller, there’s an additional SPI and I2C interface and a 32-bit timer. After all, it’s been our strategy all along: make more features accessible to all systems. The STM32C071 is, therefore, a new roadmap enabler as it becomes a bridge between entry-level MCUs and the STM32G0 that teams would use to provide a more costly system to their customers featuring lower power consumption and more features. That’s why we also ensured pin-out compatibility between the STM32C071 and the STM32G0.

The STM32C0 is a new microcontroller for entry-level applications with a price that can fit bills of materials that previously required inexpensive 8-bit MCUs. Hence, the device increases the accessibility of the STM32 family of devices while offering significant computational throughput thanks to a Cortex-M0+ running at 48 MHz and scoring 114 points in CoreMark. Depending on the configuration, the STM32C0 series will also oscillate between 16 KB of Flash and 6 KB of RAM to 128 KB of Flash and 24 KB of RAM. ST also provides a wide range of packages to ensure PCBs that rely on a small 8-bit microcontroller retain their form factor.

8-bit microcontrollers continue to play an exciting role in the industry, and ST remains dedicated to its STM8 series. Some companies need the EEPROM available in our 8-bit MCUs, while others depend on the AEC-Q10x automotive qualification of some of our devices. However, in many instances, designers choose an 8-bit MCU only because of pricing concerns. Their applications work well enough with 8-bit registers, meaning their primary focus is the bill of materials. The problem is that choosing an 8-bit architecture can have costly long-term consequences.

One of the challenges when working on an entry-level application is the limited upgradability. While prioritizing a low BoM, many successful projects often need more memory, computational throughput, pins, etc. However, 8-bit architectures have stricter restrictions and thus provide far fewer upgrade possibilities. The inherent limitations on 8-bit MCUs may also mean that a company has to qualify multiple devices instead of having one component that can fit numerous applications. Finally, as the industry inevitably marches toward 32-bit systems, using an 8-bit device may prevent developers from using software stacks or existing codes that would vastly shorten their time to market.

ST understands that despite all the benefits of a 32-bit architecture, financial and physical constraints may force some teams to use an 8-bit alternative. That’s why the STM32C0 has packages and a price rivaling 8-bit MCUs. Put simply, it opens engineers to new markets by enabling them to transition without blowing up their BoM or existing designs. Given ST’s guarantee of reliability, our device’s ability to support operating temperatures of up to 125ºC, and many peripherals, the STM32C0 is the most affordable MCU today.

Furthermore, ST ensured that transitioning from an 8-bit architecture to a 32-bit one would be as efficient and straightforward as possible. For example, we published an application note with guidelines for moving from an STM328L or STM328S to an STM32C0. It delves into peripheral migration and even shows that moving to a 32-bit architecture often means an increase in code size of only 6% to 15% in most cases. ST also organized a webinar available on demand, and the STM32 development environment can greatly optimize operations. Tools like STM32CubeMX and STM32CubeIDE, debug software like STM32CubeProgrammer, or STM32Cube expansion packages optimize workflows and even help reuse code or modules.

The STM32C0 wasn’t only designed to encourage engineers to transition from 8-bit systems but to breed more capable entry-level applications. Consequently, we worked on improving the feature density. The STM32C0 thus has one of the smallest packages for a general-purpose MCU thanks to its 3 mm x 3 mm 20-pin QFN housing, which is only possible because the die is so tiny. ST also offers an 8-pin SO8N version or a particularly thin WLCSP12 package. Similarly, the STM32C0 has power consumption modes significantly lower than other 8-bit devices, which means it’s possible to create more efficient designs.

The most astute readers will have recognized that the new STM32C0 takes essential cues from the STM32G0, which uses the same Cortex core. Consequently, ST ensured developers could quickly move from the STM32C0 to the STM32G0. For instance, the new MCU has the same single Vdd and Vss power supply line found on the STM32G0, simplifying PCB designs and reducing costs. The STM32C0 also includes a highly accurate internal high-speed RC oscillator at 48 MHz. As a result, designers don’t need to add an external one, which lowers the overall BoM. The two devices also share a similar ADC and timers, and a consistent pinout configuration facilitates the move from one to the other.

The best way to start experimenting with the STM32C0 is to get one of the development boards released last January. The NUCLEO-C031C6 is a traditional Nucleo-64 system with an Arduino Uno V3 connector to allow users to stack expansion cards. The STM32C0316-DK uses the same STM32C031 device but in a bundle that comes with the STLINK-V3MINIE, the first STLINK probe to use a USB-C port. The board also features a DIP28 connector compatible with the ATMEGA328 8-bit microcontroller. Interestingly, the board can also welcome STM32G0 devices. It thus serves as a transition tool to migrate to 32-bit applications and more easily experiment with a more powerful MCU.

Finally, the STM32C0116-DK is a smaller platform that uses the STM32C011 in a DIL20 module so teams can remove and share the module from one board to the next. ST is, therefore, offering a new approach to prototyping to make workflows more practical by creating a portable and interchangeable solution.

Read the full article at https://blog.st.com/stm32c0/

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Ventana Micro Systems Inc. has introduced the latest iteration of its Veyron family of RISC-V processors, positioning itself as a pioneer with the world’s first data centre-class RISC-V processor. The newly unveiled processor, known as Veyron V2, is available in both chiplet and IP configurations and represents a significant leap forward in high-performance RISC-V CPUs.

Balaji Baktha, Founder and CEO of Ventana, emphasized the processor’s groundbreaking features, stating, “This signifies a significant advancement in our relentless pursuit to lead the industry in high-performance RISC-V CPUs. The V2 processor underscores our commitment to customer-driven innovation, workload acceleration, and optimizing overall performance for industry-leading efficiency in terms of performance per Watt per dollar.”

Key Highlights of the Veyron V2 Processor:

1. Substantial Performance and Efficiency Boost:

• Up to 40% performance improvement was achieved through enhancements in microarchitecture, advanced processor fabric architecture, improved cache hierarchy, and a high-performance vector processor.

2. Ecosystem Advancement with RISE:

• Introduction of RISE, a new ecosystem initiative enhancing support for V2, facilitating the rapid deployment of open, scalable, and versatile solutions.

3. Streamlined Development and Cost-Efficiency:

• Utilization of the industry-leading UCIe chiplet interconnects for chiplet-based solutions, offering cost-effective unit economics, accelerating time to market, and reducing development expenses by up to 75%.

4. Specialized Workload Acceleration:

• Integration of Domain Specific Accelerator technology designed to enhance the efficiency of workloads across data centre infrastructure, fostering customer-driven innovation and distinctiveness.

Technical Specifications of Veyron V2 Processor:

• Fifteen comprehensive out-of-order pipelines.
• Clock speed of 3.6GHz and cutting-edge 4nm process technology.
• 32 cores per cluster, with multi-cluster scalability extending to an impressive 192 cores.
• 128MB of shared L3 cache per cluster and a 512b vector unit for handling intensive computational tasks.
• Ventana AI matrix extensions for advanced AI capabilities.
• Server-class IOMMU and Advanced Interrupt Architecture (AIA) system IP for enhanced performance and reliability.
• Advanced side-channel attack countermeasures for heightened security.

Reliability and Serviceability:

• Comprehensive RAS (Reliability, Availability, and Serviceability) features.
• Top-down performance-tuning methodology for optimal performance.

Ventana Micro Systems complements the Veyron V2 Processor with a Software Development Kit (SDK) comprising various validated software building blocks tailored for the RISC-V platform. The Veyron V2 Development Platform is readily available, opening the doors to high-performance computing and AI applications.

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In a recent announcement, MediaTek, drawing upon its extensive expertise in 5G connectivity, revealed plans to broaden its array of modems and chipsets to accommodate the 5G RedCap standard. The newly introduced solutions, namely the M60 modem IP and the MediaTek T300 chipset series, are poised to streamline the transition to 5G-NR, particularly for applications demanding prolonged battery life and efficiency. This encompasses wearables, lightweight AR devices, IoT modules, and devices incorporating edge AI functionalities.

RedCap, an acronym denoting “reduced capability,” has been devised to extend the advantages of 5G to NR consumer, enterprise, and industrial devices. Capitalizing on the evolution of 5G networks towards the Standalone (SA) architecture, RedCap assures reliability for low-bandwidth requirement devices, offering the benefits of 5G without the typical costs and complexities associated with conventional 5G solutions.
JC Hsu, Corporate Senior Vice President at MediaTek, emphasized the significance of RedCap solutions in the company’s mission to democratize 5G. He underscored their role in enabling customers to optimize components and deliver 5G-enabled devices across various applications and price points. According to Hsu, the shift to 5G RedCap will supplant legacy 4G/LTE solutions, providing enhanced power efficiency and more dependable user experiences compared to leading-edge 5G eMMB modem solutions and legacy 4G LTE Cat 4 and Cat 6 devices.

Breaking new ground in the RedCap arena, the MediaTek T300 series stands out as the world’s first 6nm Radio Frequency System-On-Chip (RFSOC) single die solution. This innovation is expected to empower brands to capitalize on the emerging RedCap market, fostering innovative designs for enterprise, industrial, consumer, AR, and data-card applications. Fabricated on the highly efficient TSMC 6nm process, the MediaTek T300 series integrates a single-core Arm Cortex-A35 in a significantly more compact PCB area, supporting up to 227 Mbps downlink and 122 Mbps uplink data rates.

Both the T300 series and the M60 5G modem IP adhere to the 3GPP R17 standard, combining MediaTek’s renowned power efficiency with coverage enhancements and exceptionally low latency. Leveraging MediaTek’s UltraSave 4.0 technology and minimizing unnecessary paging receptions, the M60 promises up to a 70% reduction in power consumption compared to analogous 5G eMBB solutions, and up to 75% power savings compared to 4G LTE solutions.

MediaTek’s RedCap solutions are anticipated to usher in a new era of efficiency, reliability, and cost savings for 5G-enabled devices across consumer, enterprise, and industrial sectors, aligning with evolving connectivity requirements and expectations. The MediaTek T300 series is set to enter the sampling phase in the first half of 2024, with commercial samples expected in the second half of the same year.

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The new HP Series filters deliver reliable and repeatable high-frequency performance in space-constrained microwave and RF applications including wireless LANs, satellite TV receivers, vehicle location systems, base stations, and ground and mobile communications systems.

FOUNTAIN INN, S.C. KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has released a new series of miniature high-pass thin-film filters engineered to provide excellent high-frequency performance in a variety of space constrained microwave and RF applications in the telecommunications, automotive, consumer electronics, and military markets.

The new HP Series high-pass thin-film filters are based on proven multilayer integrated thin-film technology that enables the quick adjustment of RF parameters and development of custom filters. They exhibit reliable and repeatable high-frequency performance as well as low insertion losses, extremely sharp roll-off values, and steep attenuation. HP Series filters also exhibit high temperature stability and lot-to-lot and part-to-part consistency and feature a rugged, miniature, and low-profile construction optimized for automated assembly. They are rated for operating frequencies spanning 1.0GHz to 5.15GHz and operating temperatures extending from -40°C to +85°C and have a characteristic impedance of 50Ω. Ideal applications for the series include wireless LANs, satellite TV receivers, vehicle location systems, and ground and mobile communications systems ranging from handheld commercial radios to military communications systems.

HP0805 high-pass thin-film filters currently offer five part numbers optimized for 2.70, 2.80, 2.90, 3.00, and 5.15 GHz performance to enable broad compatibility with high-frequency wireless systems, including 5G and ultra-wideband applications and the high-power remote radio units in base stations. Their miniature cases measure just 2.03 x 1.55 x 0.8 mm (L x W x H, ±0.1mm) and they have a 3W continuous power rating.

HP2816 thin-film high-pass filters measure 7.0 (±0.3) x 4.0 (±0.2) x 1.2mm max. (L x W x H). They are rated at 15W and are also well-suited for military applications.

“Our new HP Series high-pass thin-film filters provide engineers with superior, repeatable performance in a miniature case size optimized for the smaller and more densely populated PCBs common in next-generation wireless applications,” said Amir Kopelman, Technical Services Manager, KYOCERA AVX. “The multilayer thin-film technology they’re based on allows us to quickly adjust RF parameters and develop custom filters with a short lead time. In addition, we manufacture our thin film filters in an ISO 9001 facility equipped with extremely accurate processing lines that support design flexibility, reduce noise, prevent shrinkage, ensure high-quality parts and performance, and allow us to achieve consistent manufacturing results and deliver excellent filtering performance in smaller device sizes than competing technologies provide.”

HP Series high-pass thin-film filters have RoHS-compliant lead-free and solder-coated nickel terminations compatible with reflow, wave, vapor phase, and manual automatic soldering technologies. Finished parts are 100% tested for electrical parameters and visual and mechanical characteristics, and parts are packaged on tape and reel. Lead-time for the series is currently 14 weeks.

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Anritsu Corporation, in collaborating with the University of Texas at Dallas, showcases the OpenROADM at the Supercomputing Conference 23 (SC23) on November 12-17, 2023, in Denver, USA. Anritsu will be exhibiting our test system in which the MT1040A, the 400G Ethernet tester, evaluates the quality of the physical and Ethernet layer, and monitors the network performance through the 400GZR module connected to the Add/Drop line of the end-to-end OpenROADM.

Today’s network functions are becoming more sophisticated and virtualized for the diversified use cases of the all-photonics network and beyond 5G/6G era. Network automation is therefore strongly desired aiming to optimize the Quality of Service (QoS) and reduce maintenance and management labor cost. To achieve these goals, it is essential to measure and monitor the performance of physical layer and Ethernet layer in real time.

In our exhibition, two Anritsu MT1040As will be placed at each end of the multi-vendor Open ROADM system through a 400GZR module which is connected to the Add/Drop line. The MT1040A measures the line and path performance in real time when optical wavelength switch occurs on every single site, and captures the measurement results and displays them on an external PC screen automatically. In addition, the MT1040A processes and sends the measurement data to the host system without delay, this way it prevents missing transient failures and the cause analysis.

The University of Texas at Dallas Open Lab contributes to the verification of hardware and software interoperability with the open specifications published by the OpenROADM MSA, issues the verified labels to the devices that pass the interoperability verification, and provides feedback to the OpenROADM MSA based on the verification results.

Through this collaboration, Anritsu will contribute to the automation of OpenROADM test and measurements. In addition, we will contribute to the construction of automated systems used for orchestration that integrates the higher-level network management.

Come to talk to us about network performance measurement and automation.

The MT1040A is a B5 size 400G handheld tester with excellent expandability and operability. It is a touch-panel operated field measurement instrument equipped with a 9-inch screen. It supports multi-date interfaces from 10M up to 400G.

[※1]OpenROADM
It specifies interconnection specifications for optical transmission equipment (ROADM), optical transponders, and detachable optical components, as well as YANG data model specifications, and defines interfaces for realizing interconnection and interoperability between each functional part of an optical transmission network in a multi-vendor environment.

[※2]OpenROADMMSA
Abbreviation for OpenROADM Multi-Source Agreement, the international organisation established in 2015 with members from telecom operators and vendors.

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In a significant development for embedded and edge computing technology, Congatec has introduced six cutting-edge computer-on-modules—specifically, the conga-TC675r COM Express Compact modules. Powered by the 13th Gen Intel Core processors, these modules are engineered to operate reliably in demanding environments, making them ideal for applications subjected to extreme temperature fluctuations. Capable of withstanding temperatures ranging from -40°C to +85°C, these modules ensure robust performance in harsh conditions.

Utilizing Intel’s Raptor Lake microarchitecture, the modules are strategically designed for original equipment manufacturer (OEM) applications, catering to both manned and unmanned rail and off-road vehicles. This includes a spectrum of applications such as mining, construction, agriculture, forestry, and various mobility scenarios beyond conventional road infrastructure.

Equipped with soldered random access memory (RAM), the modules adhere to the highest standards for shock and vibration resistance, meeting stringent railway standards. This makes them well-suited for stationary devices and outdoor applications, providing critical infrastructure protection against natural disasters like earthquakes.

Featuring up to 14 cores and 20 threads, supported by LPDDR5x memory, these modules deliver substantial parallel processing and multitasking capabilities while maintaining optimized power budgets. The soldered LPDDR5x memory incorporates in-band error code correction (IBECC), enhancing data integrity for mission-critical applications without necessitating specialized memory types.

The Intel processors boast a hybrid architecture, incorporating performance cores (P-cores) and efficient cores (E-cores) on a single chip. This integration results in an improved performance per watt ratio, contributing to reduced power costs over the modules’ lifespan. Additionally, the modules support Time Sensitive Networking (TSN) and Time Coordinated Computing (TCC), further enhancing their industrial-grade capabilities.

Congatec’s ecosystem for these modules includes efficient cooling solutions, optional conformal coating for added protection, evaluation carrier boards, and carrier board schematics. For edge computing scenarios, the modules can be equipped with a pre-evaluated real-time hypervisor from real-time systems, facilitating real-time operations without introducing latency.

To complement these advanced modules, Congatec offers additional services, encompassing shock and vibration testing for custom system designs, temperature screening, high-speed signal compliance testing, design-in services, and training sessions aimed at facilitating the utilization of their embedded computer technologies. This comprehensive suite positions Congatec as a key player in delivering robust solutions for mission-critical applications in challenging environments

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Pickering Electronics, a renowned leader in high-performance reed relays, has introduced its groundbreaking Series 219, marking the company’s foray into high-voltage surface mount reed relays. The announcement was made at Productronica, the premier trade fair for the electronics manufacturing industry.

Designed for versatility, the Series 219 surface mount reed relays come in various package types with identical sizes but differing pin positions. These relays boast the capability to switch up to an impressive 1000V, offering configurations in 1 Form A (SPST), 2 Form A (DPST), and 1 Form B (SPNC). The switch stand-off reaches up to 3000V, and switch-coil isolation achieves a remarkable 5000V stand-off.

The Series 219 is poised to excel in a multitude of high voltage applications, including but not limited to mixed signal semiconductor testers, medical equipment testing, electric vehicle (EV) charge point testing, and monitoring solar cell photovoltaic efficiency.

Within this innovative series, all contact configurations are available with three coil voltages: 3V, 5V, or 12V. The switch stand-off capabilities vary, reaching up to 1.5kV in the 2 Form A package, 2kV in 1 Form B, and 3kV in the 1 Form A package. Switch-coil isolation stands at an impressive 5kV stand-off in 1 Form A and 1 Form B types. The relays support switching up to 0.7A and 10W, and their operational temperature range spans from -40°C to +105°C.

A notable feature of the Series 219 is the inclusion of a diode option in all part numbers. Suppression diodes are strategically placed within the relay to safeguard the device driving the relay coil against back electromotive force (emf), which can occur when the current flow to the coil is interrupted. This preventative measure ensures the protection of other components on a PCB board, such as the coil drive.

Robert King, Product Development Manager at Pickering Electronics, emphasized the uniqueness of the Series 219, stating, “Only Pickering makes surface mount high voltage relays with 2 Form A and 1 Form B packages.” The 2 Form A configuration optimizes board space by providing two switches in the same footprint, while the 1 Form B option offers a normally closed relay, a feature not readily available elsewhere in the market.

True to Pickering’s commitment to customer satisfaction, the Series 219 Reed Relay is available with various standard build options to tailor it to specific applications. Additionally, for requirements beyond standard offerings, the company provides a customized reed relay service to meet users’ specific needs.

Continuing the tradition of excellence seen in other Pickering relays, the new 219 Series high voltage reed relays employ top-tier instrument-grade switches with appropriate switch blade coatings to meet the demands of diverse currents and voltages. Another noteworthy innovation is the incorporation of SoftCenter technology, minimizing internal stresses on the reed switch, thereby extending its life and ensuring contact resistance stability. The use of magnetic Mu-Metal shielding and electrostatic screening further enhances reliability by preventing faulty operation.

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PHOENIX – Avnet, Inc. just made thousands of customizable reference designs easily accessible to engineers in the Americas in its new self-service online tool, Design Hub.

Design Hub is powered by AVAIL, Avnet’s engineering tool with a vast reference design library that helps designers develop system-level solutions quickly and easily any time of day. The tool leverages more than 70,000 solutions to common design problems. These solutions are automatically loaded into the engineer’s design based on their specific requirements.

“Research shows that 80%* of engineers use datasheets, application notes, reference designs and block diagrams to begin their new designs,” said Art Leitherer, vice president of Global Technology and Solutions, Avnet. “All of that research takes time, and if what they are looking for is new to them, asking the right questions to find the data can be challenging as well.  Now they can leverage the Design Hub to take advantage of the community of designers that have assembled current and available content that is applicable to the need.  Ultimately, it helps engineers create their designs faster by giving them visibility to products that are actually available and the knowledge to put them to use.”

Design Hub makes it easy for engineers to understand and access the information needed to get a project started. They can also customize and personalize information in a self-service tool that’s available 24/7. To help accelerate designs, engineers can make modifications and save work, determine if an idea or design can work within constraints, generate the documentation needed to jump start a project and feel comfortable knowing the information is secure through Avnet’s single sign on for customers.

Engineers will walk away with documentation including preliminary schematics and layouts as well as a bill of materials (BOM) for the design. It can even connect to CAD tools. This means the lifecycle status for all parts and overall BOM health will be available up front to ensure available parts are used in the design. Users can add parts to a quote or shopping cart or download the complete BOM with a single click.

“Our latest Avnet Insights research, out tomorrow, found engineers are leaning into their distributor relationships now more than ever. Design Hub allows us to add value to that distribution relationship,” explained Leitherer. “Before Design Hub, finding the right reference design was time consuming. Engineers had to search through a ton of supplier websites before finding what they needed. We bring all those reference designs to them in one place along with the tools to modify them to their needs. There are already over 1,000 free-to-use reference designs on the Avnet Americas Design Hub that cover state-of-the-art applications across the major categories and market verticals.”

Other Design Hub features also include software, calculators, simulators, cross-references, and other design and engineering tools that are typically associated with a key manufacturer’s products. These tools and resources can also be tied to a reference design that has simulation capabilities, or that requires a deeper level of engineering via software to arrive at the best possible solution.

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Despite complex global challenges, Rohde & Schwarz has closed the 2022/2023 fiscal year successfully. For the first time in its 90-year history, the technology group topped the three billion euro mark for order intake. This shows that the group is well positioned in growth markets thanks to its focus on security and connectivity. Also in the reporting period, Rohde & Schwarz continued to invest systematically in its own vertical integration and key technologies in order to remain independent, flexible and technologically relevant for its customers.

The 2022/2023 fiscal year (July to June) was marked by geopolitical uncertainty and difficult economic conditions. Nevertheless, Rohde & Schwarz achieved an excellent order intake of well over EUR 3 billion and revenue rose to EUR 2.78 billion. The positive operating result was also in line with expectations. On June 30, 2023, Rohde & Schwarz had around 13,800 employees worldwide.

The overall good consolidated financial statements show that Rohde & Schwarz is well positioned in markets with strong growth potential. The group’s diversification ensures greater security and stability.

The wireless communications T&M market declined, especially on the production side, due to the global economic situation. In this challenging environment, the diversified Rohde & Schwarz T&M portfolio proved highly advantageous and ensured a robust fiscal year. Customers in the aerospace & defense market continued to invest in the group’s state-of-the-art T&M technology. The automotive industry is driving the transition to electromobility and the development of autonomous vehicles. This, in turn, is generating high demand for the broad range of solutions that Rohde & Schwarz offers for demanding measurement tasks. The group also further expanded its established position in the Industrial Electronics, Components, Research & Universities market segment.

Science and research are already working on 6G, the next wireless communications generation. Rohde & Schwarz has been involved in these efforts from the very start by participating in various programs and initiatives. At Mobile World Congress 2023 in Barcelona, the group teamed up with NVIDIA to give the industry’s first hardware-in-the-loop demonstration of a neural receiver. This has laid the foundation for the integration of artificial intelligence (AI) and machine learning (ML) in the future 6G technology.

The ongoing geopolitical developments have led governments and industry to focus more strongly on digital and technological sovereignty. This paradigm shift is also affecting the business of Rohde & Schwarz. With its secure communications and reconnaissance solutions, the technology group was able to win strategically important projects with authorities and customers in the government sector in the reporting period.

In addition, by acquiring Schönhofer Sales & Engineering GmbH (SSE), the group successfully invested in expertise for key technologies such as big data analytics and AI. In August 2023, Rohde & Schwarz and SSE were commissioned, along with other partners, to develop the AI backbone for the European Future Combat Air System (FCAS).

Demand for network and security technology is increasing in both private and public sectors. The trend toward cloud applications and remote work continued. In the government sector, digitalization is gaining further momentum. Rohde & Schwarz, a key supplier in Germany with solutions to ensure digital sovereignty, is already benefiting from this trend. The group subsidiary LANCOM Systems in particular secured important projects and again achieved profitable growth.

Global air traffic is almost back at pre-pandemic levels. This increased worldwide demand for security scanners. After having been placed on the Transportation Security Administration’s (TSA) Qualified Products List in the USA, the R&S QPS201 security scanner is now being used to carry out smooth security checks at the first US airports. In addition, the R&S QPS Walk2000 – the world’s first 360° walk-through security scanner – is currently being tested at Frankfurt Airport.

Rohde & Schwarz also achieved successes in the air traffic control (ATC) sector. Together with DFS Deutsche Flugsicherung GmbH, the German air navigation service provider, the group completed a nationwide radio modernization program with around 4000 ATC radios at over 100 radio sites. With its tried-and-tested turnkey solution, Rohde & Schwarz ensures safe and efficient airspace operations.

Supply chains that were strained due to the pandemic stabilized somewhat in the reporting period. In the past few years, the group’s high degree of vertical integration once again proved its worth. The Rohde & Schwarz production plants ensure flexibility, dependability and reliable supply capability. The group reaffirmed its vertical integration strategy in the 2022/2023 fiscal year. In February, a groundbreaking ceremony took place at the Memmingen site for a state-of-the-art technology and production center with 18,000 square meters of floor space.

For 90 years, Rohde & Schwarz has lived a tradition of innovation. Research, development and production take place primarily in Germany. The group is stepping up investment in the development and utilization of new technologies involving frequencies above 100 GHz, 6G, AI and microelectronics. This ensures that Rohde & Schwarz remains relevant for its customers in a highly dynamic competitive environment and can expand its leading position.

The group is currently participating in a microelectronics and communications technologies project funded by the European Commission (IPCEI ME/CT). Rohde & Schwarz is thereby helping to ensure Germany and Europe’s ability to shape key technologies.

As a privately owned company, Rohde & Schwarz is deeply committed to taking into account social and environmental effects in its economic activities. Sustainable business activities have always been at the heart of its corporate strategy and will remain so in the future.

Rohde & Schwarz aims to achieve the 1.5 °C climate protection target at selected group locations by 2030 without buying any offset certificates. To enable the energy transition, it is implementing sustainable product design and resource-conserving energy supply concepts. The group is actively saving energy and carbon emissions by using photovoltaic systems on its own buildings, heat pumps to heat and cool buildings and green electrical power.

In 2023, the Bavarian state government awarded Rohde & Schwarz the Gold Certificate of the Bavarian Environmental and Climate Pact for its longstanding commitment to environmental and climate protection.

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Modularity, Loop Disconnect, and Fault Monitoring Enhance Signal Line Protection

In a significant advancement for process automation, Pepperl+Fuchs unveils the M-LB-4000 surge protection system, a two-part solution designed to revolutionize signal line safety. This cutting-edge system integrates modularity, loop disconnect functionality, and fault monitoring, catering to signal lines up to Safety Integrity Level 3 (SIL 3) according to IEC/EN 61508 standards. The M-LB-4000 effectively mitigates induced transients caused by lightning or switching operations, promising higher plant availability.

The core of the M-LB-4000 system lies in its two-part configuration, comprising a surge protection module and a fault status monitoring system. The surge protection module, housing all protective components, offers a tool-free replacement feature. Notably, the base module remains operational during replacement, eliminating the need for rewiring. A front-panel status indicator streamlines monitoring, and the signal circuit remains connected through the base module during the disconnection process. This unique design ensures uninterrupted plant operation even when replacing protection modules.

Commissioning and servicing are simplified through the loop-disconnect function, allowing easy replacement of protection modules during ongoing operations. The protection module, when rotated by 180 degrees and plugged in, activates the integrated isolating function, breaking the signal circuit for efficient servicing, loop checks, and insulation tests during commissioning or routine maintenance.

The fault status monitoring system comprises two components: the optical emitter/receiver and the optical deflection unit. These components work in tandem to monitor multiple surge protection barriers. In the event of a fault, the optical signal is interrupted, triggering the identification of the issue. The fault status module provides a visual LED status indicator for normative compliance and a status message output, allowing precise identification of the affected block. Remarkably, one fault status module can monitor up to 50 modules, contributing to comprehensive system oversight.

At a slender 6mm width, the M-LB-4000 modules save valuable space in switch cabinets, providing a practical solution for retrofitting. Existing common disconnect terminal blocks can be seamlessly replaced, irrespective of space constraints, facilitating easy integration into existing setups.

This innovative surge protection system addresses the growing demand for robust and efficient solutions in the ever-evolving landscape of process automation. Pepperl+Fuchs aims to set a new standard with the M-LB-4000, offering not only enhanced protection but also simplified maintenance procedures, contributing to the overall efficiency and reliability of industrial processes.

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In response to the escalating demand for resilient and efficient data communication solutions in contemporary electronic systems for automotive and industrial applications, Infineon Technologies AG has unveiled its latest addition to the ISOFACE product portfolio – the quad-channel digital isolators. This development signifies a strategic expansion of the company’s isolation technologies.

The ISOFACE quad-channel digital isolators are segmented into two categories. The ISOFACE 4DIRx4xxHA family, boasting AEC-Q100 qualification, targets automotive applications such as onboard chargers (OBC), battery management systems (BMS), inverters, and motor control. Meanwhile, the ISOFACE 4DIRx4xxH family, fully qualified according to JEDEC standards, caters to industrial applications, including renewables, servers, telecom, industrial switch-mode power supplies (SMPS), industrial automation, and isolated serial peripheral interface (SPI). These products are housed in a wide-body 300 mil PG-DSO-16 package, featuring four data channels to deliver enhanced isolation and ensure reliable data communications in challenging operational environments.

Operating within a supply voltage range of 2.7 to 6.5 V, the ISOFACE quad-channel digital isolators exhibit efficient low current consumption, capped at 1.6 mA per channel. This efficiency holds true even when operating at speeds up to 1 Mbps with a 3.3 V supply voltage and a 15 pF load capacitance. Infineon’s Coreless Transformer (CT) technology equips the isolators with high immunity against system noise, boasting a common mode transient immunity of a minimum of 100 kV/µs, and withstanding an isolation voltage of up to 5700 Vrms.

Designed for durability, the ISOFACE digital isolators are well-suited for challenging environments featuring extreme temperatures. For automotive applications, these isolators demonstrate effectiveness within Grade I ambient temperature conditions, enduring temperatures ranging from -40°C to +125°C. Their robust construction enables them to withstand various environmental challenges, including voltage transients, electromagnetic interference (EMI), electrostatic discharge (ESD), and electrical disturbances, ensuring dependable performance.

With precise timing performance attributed to low propagation delay and minimal channel-to-channel mismatch, the isolators mitigate the risk of data corruption, safeguarding data integrity. Their pin-to-pin compatibility enhances stability in power supplies, contributing to improved overall system reliability.

The ISOFACE quad-channel digital isolators excel in minimizing signal noise over a broad supply voltage range. Their precise timing performance and compatibility features make them ideal for high-power density designs. Additionally, component-level and system-level certifications simplify safety approvals, expediting time-to-market, and positioning the ISOFACE digital isolators as a valuable choice for robust and efficient electronic systems.

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New META-DX2C 800G retimer is supported by a complete hardware and software reference design with key Microchip components

The rise of generative AI and AI/ML technologies is fueling demand for more high-speed connections and, in turn, the push toward 800G connectivity in backend data center networks and applications. This can be optimally addressed using Active Electrical Cables (AECs), but there are numerous design and development hurdles for cable vendors to overcome. To address this, Microchip Technology Inc. (Nasdaq: MCHP) today announces an accelerated development path for these Quad Small Form Factor Pluggable Double Density (QSFP-DD) and Octal Small Form Factor Pluggable (OSFP) AEC cable products using its META-DX2C 800G retimer. The retimer is supported by a comprehensive solution for 800G AEC product development including a hardware reference design and complete Common Management Interface Specification (CMIS) software package to minimize development resources needed for cable manufacturers.

“The newest and most compact member of our META-DX2 Ethernet PHY family leverages Microchip’s unique breadth of microcontrollers and other key components to provide a complete reference design that accelerates AEC product development, reduces resource investments and simplifies supply-chain management,” said Maher Fahmi, vice president for Microchip’s communications business unit. “The META-DX2C retimer enables AEC connections for the high-density networks that are needed for generative AI applications.”

The META-DX2C retimer uses high-performance, long-reach 112G SerDes that can support up to 40 dB reach, enabling the design of thinner and longer AECs that are crucial for dense hyperscaler infrastructure buildouts. Additionally, Microchip is offering a fully validated paddle card hardware reference design and a software package that implements the CMIS software in a Microchip 32-bit PIC32 microcontroller. Microchip’s META-DX2C compact retimer can also solve similar connectivity challenges in high-capacity data center switches and routers where high density and data rates create signal integrity problems.

“Generative AI is impacting how data center infrastructure is being built and the amount of network connectivity that is required, in a big way,” said Alan Weckel, co-founder and analyst with the market research firm 650 Group. “To address this challenge, hyperscalers need solutions that are very high bandwidth as well as low power and low cost. We are seeing a transition to active electrical cables as the optimal solution for this challenge. Microchip’s META-DX2C 800G AEC retimer is aligned with this trend and is the type of solution needed to enable growth in this area.”

Microchip’s META-DX2C 800G AEC solution is supported by a paddle card reference design that includes the META-DX2C retimer, PIC32 microcontroller, oscillators, buck regulator and linear voltage regulator, all from Microchip. Having these elements available from a single supplier can simplify a customer’s supply chain management. The included software development kit supports the CMIS 5.2 specification.

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KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce an unprecedented leap in reflow process inspection (RPI) technology. General Manager Miles Moreau will be presenting an exclusive lecture at productronica on Wednesday, November 15, 2023, at the productronica Forum, unveiling the remarkable “Real-time production reflow profile inspection, with new sensor technology for heat transfer detection.”

In today’s dynamic manufacturing environment, maintaining the highest level of quality and process control is imperative. RPI, or reflow process inspection, is a critical element, alongside SPI and AOI, in realizing real-time process control throughout the assembly line. KIC is proud to introduce NEW SENSOR TECHNOLOGY that adds significant value to reflow process inspection by directly measuring board temperatures during production. This technology detects changes in heat transfer, thus marking a revolutionary advancement in electronics manufacturing. Moreau will discuss:

• Reflow Process Inspection and its significance
• Introduction to the groundbreaking Heat Transfer technology
• Sensing technology’s added value in the realm of RPI
• Detecting heat transfer changes in convection
• The role of pyrometers in detecting board jams, board drop, and incorrect recipes

The Evolution of Reflow Process Inspection (RPI): Reflow Process Inspection (RPI) has been a cornerstone of precision and automation in thermal processes within reflow ovens. Developed by industry leader KIC, RPI systems have been synonymous with reliability and quality in electronics manufacturing. KIC’s RPI system comprises embedded sensors that monitor temperature, conveyor speed, and PCBAs as they traverse the oven. By continuously monitoring and calculating temperature profiles, RPI eliminates manual interventions, reduces downtime, and ensures consistent PCB quality.

Introducing Cutting-Edge Sensing Technology: KIC is proud to introduce a groundbreaking sensing technology that directly measures board temperature at the end of the heated oven section during production. This direct measurement capability enables real-time monitoring of temperature and convection changes. It’s a revolutionary leap in reflow process inspection technology.

1. Precision Redefined: Directly measuring board temperature and heat transfer changes during production ensures unparalleled precision and quality in reflow profiles, monitoring all aspects of the oven’s influence on production boards.
2. Combined Board-Level Temperatures: KIC RPI employs advanced algorithms that consider board temperature and ambient temperature at board level to determine temperature, time, and heat transfer changes impacting the reflow profile.
3. Seamless Integration: Our RPI system actively tracks process Cpk, providing critical temperature profile data that seamlessly integrates with other MES factory automation systems, SPI, and AOI data.

Experience the Future of Electronics Manufacturing: Discover the future of electronics manufacturing with our advanced RPI systems equipped with this revolutionary sensing technology. Stay ahead of the competition, enhance process efficiency, and ensure uncompromised quality in every PCB.

Ready to Elevate Your Manufacturing Quality and Process Control? Contact us today to explore how KIC’s new heat transfer detection and advanced sensing technology can enhance your manufacturing quality and process control.

Visit KIC at Hall A4.214, during productronica 2023 to engage with thermal process experts, learn more about this groundbreaking technology, and explore solutions for soldering and curing processes in electronics manufacturing and semiconductor advanced packaging.

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Modern electronic systems in automotive and industrial applications require robust, efficient, and precise data communication capabilities to ensure optimal performance. To meet these needs, Infineon Technologies is introducing its ISOFACE quad-channel digital isolators, emphasizing a broader portfolio of isolation technologies.

The ISOFACE quad-channel digital isolators are available in two categories. The ISOFACE 4DIRx4xxHA family with AEC-Q100 qualification is designed for automotive applications such as onboard chargers (OBC), battery management systems (BMS), inverters, and motor control. The ISOFACE 4DIRx4xxH family is fully qualified according to JEDEC and is designed for industrial applications such as renewables, servers, telecom, industrial switch-mode power supplies (SMPS), industrial automation, and isolated serial peripheral interface (SPI). The products come in a wide-body 300 mil PG-DSO-16 package with four data channels, providing enhanced isolation and ensuring reliable data communications in demanding environments.

The ISOFACE quad-channel digital isolators offer an operating supply voltage range from 2.7 to 6.5 V. Even with this wide supply voltage range, their low current consumption remains efficient, capping at 1.6 mA per channel when operating at speeds up to 1 Mbps with a 3.3 V supply voltage and a 15 pF load capacitance. In addition, Infineon’s robust Coreless Transformer (CT) technology provides high immunity against system noise (common mode transient immunity of minimum 100 kV/µs) and withstands up to 5700 Vrms isolation voltage.

ISOFACE digital isolators are rugged, making them ideal for challenging environments where extreme temperatures are common. For the isolators for automotive applications, their durability is underscored by their ability to function effectively within Grade I ambient temperature conditions, enduring temperatures as low as -40°C and as high as +125°C. They can handle various environmental challenges, such as voltage transients, electromagnetic interference (EMI), electrostatic discharge (ESD), and electrical disturbances, ensuring dependable performance. Their precise timing performance, owing to low propagation delay and minimal channel-to-channel mismatch, mitigates the risk of corruption and safeguards data integrity. Furthermore, their pin-to-pin compatibility adds stability to power supplies, improving overall system reliability.

The isolators are adept at minimising signal noise over a wide supply voltage range, and their precise timing performance and compatibility features enable high power density designs. Component-level and system-level certification simplifies safety approvals and speeds time-to-market, making ISOFACE digital isolators a valuable choice for robust and efficient electronic systems.

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In a recent report by IDC titled “How Generative AI Is Set to Play a Leading Role in IT Operations,” the transformative influence of generative AI (GenAI) on IT operations (ITOps) across the Asia/Pacific region has come to the forefront. The IDC’s 2023 Future Enterprise Resiliency and Spending (FERS) Survey, Wave 6, sheds light on the increasing importance of GenAI in the region. The study reveals that nearly half (43%) of organizations surveyed are actively exploring potential GenAI use cases, with a significant 55% of financial and telecom companies in the region making investments in GenAI technology in 2023.

With a burgeoning digital-first mindset gaining momentum in Asia/Pacific, businesses are on the lookout for innovative solutions to enhance their operations. GenAI has emerged as a game-changing technology, offering companies the means to mitigate risks, enhance efficiency, and drive overall productivity.

Generative AI is gaining prominence, particularly in cost-sensitive Asia/Pacific environments, where it plays a pivotal role in IT operations and IT service management. This technology enables the automation of ITOps tasks, reducing operational costs and optimizing resource utilization. The Asia/Pacific region, encompassing both mature economies like Australia, Japan, and Singapore, and rapidly growing markets like India and China, presents diverse IT requirements and challenges. In emerging economies, generative AI is instrumental in facilitating scalable ITOps.

Dhiraj Badgujar, Senior Research Manager, Digital Innovation Practice and xOps Program at IDC Asia/Pacific, underscores the potential of Generative AI: “Generative AI can enhance the overall productivity of ITOps teams by streamlining ITOps workflows, reducing operational expenses, and enhancing system reliability. However, it is imperative that GenAI systems are implemented in alignment with enterprise objectives, with safeguards in place to handle unforeseen events.”

The report also highlights key ITOps trends that enterprises need to be aware of as the GenAI revolution continues:

• Rise of AIOps: AIOps solutions are gaining traction in Asia/Pacific, with machine learning and AI algorithms automating IT processes, monitoring performance, and predicting and preventing IT disruptions.
• Predictive Analytics: AI-powered predictive analytics in ITOps assist enterprises in proactively identifying and mitigating IT issues.
• Hybrid Cloud and Multicloud Management: As enterprises in the region embrace hybrid and multicloud environments, GenAI is poised to manage the complexities of these infrastructures effectively.
• Continuous Improvement: GenAI models are expected to evolve, integrating with IoT and edge computing for enhanced data collection and analysis.

Key industry players are actively embracing GenAI. Atlassian, ServiceNow, New Relic, PagerDuty, and HCL Technologies are among the leading vendors diving into the GenAI wave, with notable implementations that are set to significantly impact business success for enterprises in the region.

The IDC Asia/Pacific Software Survey 2023 underscores the growing need for IT agility in various industries. Over 50% of enterprises from countries like India, Indonesia, and Malaysia anticipate increased operational efficiency and automation as part of their digital innovation strategy, emphasizing GenAI’s growing role in reshaping IT operations across Asia/Pacific.

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Innovation and production – hand in hand. This is the Rohde & Schwarz motto for this year’s productronica, where the company will present itself as a reliable partner for electronics manufacturing needs. Rohde & Schwarz has determined five pivotal areas of interest, each reflecting its commitment to pushing technological boundaries: (1) secure production, (2) efficiency in RF component manufacturing, (3) electronic module and device production testing, (4) calibration and repair services and (5) electronic manufacturing services. In addition, visitors can experience a new T&M highlight at the booth: The R&S MXO 5 is the first eight-channel oscilloscope from Rohde & Schwarz.

Rohde & Schwarz, celebrating 90 years of ensuring a safer and connected world in 2023, welcomes visitors to this year’s productronica, the leading global trade show for the electronics manufacturing industry. The bi-annual event will take place from November 14 to 17 in Munich, the home city of Rohde & Schwarz. In hall A1, booth 375 of Messe München, visitors can learn about the company’s latest solutions for various aspects of production.

The rapid evolution of electronics development and production necessitates advanced cybersecurity measures to ensure secure production processes. Rohde & Schwarz will address this need for secure and stable industrial IoT (IIoT) shop floors with solutions from its subsidiary LANCOM Systems. Visitors can learn about SD-WAN industrial gateways with 5G for harsh environments as well as cloud-managed networks with LANCOM Management Cloud.

Other solutions on display cover private network testing, using the R&S 5G Site Testing Solution to monitor, for example, the signal quality and power levels of a network. In combination with the QualiPoc Android, users can also perform functional tests, such as voice, data and video streaming, to verify service availability at a site.

As in all production, test speeds are crucial also in RF component manufacturing. Rohde & Schwarz solutions prioritize this while not compromising precision. The R&S PVT360A is a compact VSG/VSA single-box vector tester optimized for FR1 base station, small cell and RF component testing in production and characterization environments. Its two independent signal generators and analyzers enable fast parallel measurements. Demanding requirements of the test environment, such as minimum error vector magnitude (EVM) and high-test throughput, are all fulfilled. 

A test setup based on the four-port R&S ZNA vector network analyzer combined with the R&S ZN-Z86 switch matrix will showcase speed optimized parallel testing of multiport devices with up to 24 available test ports simultaneously.

Other demonstrations at the trade show booth will cover the characterization of both, voltage-controlled oscillators (VCO) using the R&S FSPN phase noise analyzer and of Wi-Fi frontends using a combination of the R&S SMW200A vector signal generator and the R&S FSVA3050 signal and spectrum analyzer.

Addressing diverse industries, Rohde & Schwarz will showcase a wide range of solutions at productronica optimized for testing electronic modules and devices in production. For wireless devices of various standards, the company will present its fast and compact radio communication testers: While the R&S CMP180 covers Wi-Fi 6E, Wi-Fi 7 and 5G NR FR1 standards, the R&S CMP200 will be shown in a test setup for UWB device production.

Other setups will focus on maximizing yield, optimizing efficiency and minimizing test time in automotive applications. The advanced automotive radar test system (RTS) from Rohde & Schwarz is ideal for radar object simulation for R&D and production of radar based advanced driver assistance systems (ADAS). It consists of the R&S AREG800A automotive radar echo generator as a backend and the R&S QAT100 antenna array for the frontend. Other automotive solutions on display will cover in-vehicle network (IVN) testing with the R&S MXO 4 oscilloscope as well as battery management systems (BMS) production testing with the R&S ExpressTSVP.

For precise and time-saving compliance tests of PCIe cables and connectors in line with PCI-SIG specifications, Rohde & Schwarz will showcase a fully automated solution based on a four-port R&S ZNB43 vector network analyzer. Visitors will also see demonstrations of how to automatically control and sort components using the R&S LCX LCR meter and of how to measure power consumption using a R&S NGU201 source measure unit (SMU). Conducted emission measurements for electronic device sample quality control will also be covered.

And for quality control in production lines, Rohde & Schwarz will present its solution for real-time material analysis based on microwave imaging technology. The new R&S QAR50-K80 complements current methods such as cameras, X-rays or scales to detect quality issues such as leakage or unwanted particles in closed packages. The solution leverages hundreds of receive and transmit antennas to quickly characterize materials. Using neuronal networks it detects abnormalities without opening containers.

Rohde & Schwarz recognizes that instruments eventually require calibration and repair and provides accredited services to keep purchased instruments at peak performance with minimal downtime. Rohde & Schwarz services are backed by an extensive global network, ensuring that requests are quickly processed by a local provider. Visitors at productronica will have the opportunity to learn about the company’s comprehensive service portfolio. Rohde & Schwarz experts will be available to answer questions about standard calibration and repair services but also the 24/7 hotline service and on-site support.

Visitors can also learn about electronic manufacturing services (EMS) provided by the Rohde & Schwarz group. The Rohde & Schwarz Memmingen plant offers a variety of production services for high-precision electronic components, and its Teisnach plant offers mechanical services, including complete assembly, 3D printing and production of precision mechanical components and waveguides. These services even fulfill aeronautical and military requirements, if necessary.

Rohde & Schwarz just released the R&S MXO 5, the world’s first eight-channel oscilloscope that can detect 4.5 million acquisitions and 18 million waveforms per second across multiple channels. The instrument shows more of a signal’s activity than any other oscilloscope in both the time and the frequency domains. With a standard simultaneous acquisition memory of 500 Mpoints across all eight channels, it offers double the standard memory of competing models. As the first eight-channel oscilloscope with digital triggering, the R&S MXO 5 sets a new standard in signal analysis. It is also the first oscilloscope with 45 000 FFTs per second. Visitors to the Rohde & Schwarz booth will have the opportunity to experience this exciting new product in action.

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Infineon Technologies today announced a new family of microcontrollers (MCUs) in the PSoC portfolio of Arm Cortex-based high-performance, low-power, secured devices. PSoC Edge is designed for next generation responsive compute and control applications, featuring hardware-assisted machine learning (ML) acceleration. The new family of MCUs deliver next-level end-user experiences by enabling end products to be more intelligent and intuitively usable, by lowering the barrier in human-machine interaction and adding contextual awareness to end applications. They do so while providing robust privacy and safety protection through embedded Infineon Edge Protect technologies.

“Infineon’s new PSoC Edge portfolio is built on years of experience delivering solutions to intelligently control, interact, and connect our world with highly usable and powerful MCU-based systems,” said Steve Tateosian, Senior Vice President of Microcontrollers of Infineon. “They offer an ideal mix of scalable power and performance to support emerging AI/ML requirements, extensive HMI capabilities and security features required for next-generation applications. All supported with a deep ecosystem of software and tools, fit for task.”

The PSoC Edge devices are based on high performance Arm Cortex-M55, including Helium DSP support paired with Arm Ethos-U55 and Cortex-M33 paired with Infineon’s ultra-low power NNLite — a proprietary hardware accelerator intended to accelerate the neural networks used in Machine learning and AI application. Support for “always-on” sensing and response makes the devices ideal for advanced IoT and industrial segments such as smart home, security, wearables, robotics, and many more. The family of devices come with ample on-chip memories, including non-volatile RRAM, as well as high speed, secured external memory support. The PSoC Edge family provides scalability for increasingly sophisticated next-generation intelligent systems, while enabling software reuse and portability.

The enhanced intelligence of the PSoC Edge family extends support for advanced graphics, voice, audio, and vision-based applications to the existing PSoC portfolio. The new family enables easy migration of applications within the family, as well as an upgrade path from existing designs.

Supported by a rich set of enablement, developers can leverage the power of PSoC Edge for their current and future design needs. With strong ecosystem partners, comprehensive documentation, and the industry-recognized ModusToolbox software, including integration with the Imagimob Studio AI solution, PSoC Edge accelerates time-to-market.

Infineon’s ModusToolbox software platform provides a collection of development tools, libraries, and embedded runtime assets for a flexible and comprehensive development experience. ModusToolbox supports a wide range of use cases including consumer IoT, industrial, smart home, wearable, and many other applications.

Imagimob Studio is an Edge AI development platform, integrated into ModusToolbox, and delivers end to end ML development, from data in to model deployed. Starter projects and Imagimob’s Ready Models make it simple to get started. Together with PSoC Edge, Imagimob makes it possible to deploy state of the art machine learning models for the edge.

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Integrated solution of PKIWorks platform with STM32WB wireless microcontroller enables IoT security for Matter device development

CommScope, a global leader in network connectivity,  and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the integration of CommScope’s PKIWorks IoT security platform with ST’s popular STM32WB microcontroller unit (MCU). This integrated solution offers device manufacturers a turnkey solution for developing IoT devices that meet the Connectivity Standards Alliance Matter standard for security.

The solution simplifies manufacturing secure Matter-device-credentials development and provisioning, in addition to reducing costs and time for IoT device manufacturers. With this integration, devices can be commissioned at the MCU level without developer intervention. This collaboration harnesses 35 years of experience from the CommScope Sentry team securely integrating cryptographic keys and digital certificates into high-volume manufacturing production with ST’s leadership in microcontrollers and development ecosystem.

“As a CSA promoter, ST is committed to making Matter development seamless for all device makers,” said Nathalie Vallespin, STM32 Connectivity product line manager, STMicroelectronics. “Our #1 ranking for general-purpose microcontrollers and expertise in secure elements positions us to combine our deep understanding of device-makers’ challenges and strong knowledge of Matter to create unique collaborations like this one with CommScope. This will accelerate the adoption of Matter development through an easy and secure process for credential provisioning.”

“By integrating the CommScope Sentry PKIWorks platform with ST’s popular MCU platform, we’re offering our customers a turnkey solution to alleviate the challenges of Matter adoption, while handling the complexity, scale, and cost,” stated Bart Giordano, president, Networking, Intelligent Cellular and Security Solutions, CommScope. “CommScope and ST have a long-standing collaborative relationship, making it easy to meet growing demand for new Matter IoT devices with the expertise of two industry leaders with decades of experience at the forefront of digital security, semiconductor solutions, and device manufacturing.”

About PKIWorks, STM32WB, and Matter
The PKIWorks platform is a secure and flexible credential provisioning and management platform, refined over decades of experience and billions of device credentials. It is now optimized for creating and delivering Matter device credentials — providing a fast track for manufacturers of all IoT devices to provide security and interoperability with the burgeoning Matter ecosystem. The PKIWorks platform leverages CommScope’s expertise in provisioning clients for device credential installation, particularly on resource-constrained IoT devices. These clients enable the support of a wide range of STM32 MCUs and STSAFE-A. CommScope recently integrated this lightweight provisioning client with the STM32WB55, an MCU for IoT device development and ST’s microcontroller of choice for Matter devices. Matter is the new unifying smart home standard for interoperability and security among smart home devices. Announced in October 2022, the specifications and certification programs are the result of a collaboration involving more than 600 technology companies under the auspices of the Connectivity Standards Alliance (CSA). Matter makes smart home devices interoperable while improving and standardizing security across suppliers and IoT ecosystems and offers consumers a seal of approval that says smart devices work reliably together and are secure.

Key PKIWorks Features

• The PKIWorks platform can generate over 30 billion device credentials annually and is designed to scale to even greater capacity, providing a solid foundation for future expansion.
• The platform generates Matter device credentials for a wide spectrum of IoT manufacturers and service providers, using the CSA-approved Root of Trust and the CommScope Product Attestation Authority (PAA).
• The PKIWorks Provisioning Client can install various types of device credentials to STM32 and STSAFE-A —including the STM32WB55 microcontroller designed specifically for Matter devices.
• The STM32WB55 Matter SDK integration enables Matter Commissioning without the need for additional integration effort from device makers.
• PKIWorks solutions encompass both factory settings and over-the-air provisioning, providing Device Attestation Credentials (DACs) and Node Operational Credentials (NOCs) to support the security lifecycle of Matter devices.

PKIWorks services are available to device manufacturers designing with the STM32 and STSAFE-A. CommScope is a member of the ST Authorized Partner program, and CommScope’s Sentry offers integrated solutions that dramatically simplify product development by streamlining device credential provisioning in manufacturing, accelerating time-to-market. The STM32WB with the PKIWorks client is available now and is also offered in multiple configurations to meet the diverse manufacturing environments of IoT device providers.

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To date, the family-owned company has opened 44 national subsidiaries and 14 production plants around the world. Now, another location is being added: with immediate effect, connectors and pre-assembled solutions will also be manufactured to the accustomed HARTING quality standards in Hai Duong, Vietnam.

HARTING has now set up a new production site in Vietnam. China’s neighbour is a strategically important location in Asia for the Technology Group. As from now, a well-trained core team will have connector production up and running on the over 2,500 square metre factory premises.

“It is important to us that we also ensure our high-quality standards here in Vietnam,” as Andreas Conrad, member of the board of the HARTING Technology Group, stated. “With our globally standardised processes and production facilities, we are guaranteeing our customers the HARTING quality they are accustomed to – around the globe. Whether in Germany, Romania, Mexico or now also in Vietnam – our customers can rely on HARTING being at hand worldwide”

Philip Harting, the CEO of the Technology Group, was on location in person to open the new production plant. “With our newly acquired site in Vietnam, we are creating an important building block in the growth region of Southeast Asia. Here in Hai Duong, we are close to our customers and producing directly on site. We are reducing the delivery routes to a minimum and will record significant CO2 savings in this way. Together with the management team, we have already set the course for further expansion.”

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