ELE Times

Devices Combine High Peak Output Currents to 4 A With High Operating
Temperatures to +125 °C and Low Propagation Delay of 200 ns

Vishay Intertechnology, Inc. has introduced two new IGBT and MOSFET drivers in the compact, high isolation stretched SO-6 package. Delivering high peak output currents of 3 A and 4 A, respectively, the Vishay Semiconductors VOFD341A and VOFD343A offer high operating temperatures to +125 °C and low propagation delay of 200 ns maximum.

Consisting of an AlGaAs LED optically coupled to an integrated circuit with a power output stage, the optocouplers released today are intended for solar inverters and microinverters; AC and brushless DC industrial motor control inverters; and inverter stages for AC/DC conversion in UPS. The devices are ideally suited for directly driving IGBTs with ratings up to 1200 V / 100 A.

The high operating temperature of the VOFD341A and VOFD343A provides a higher temperature safety margin for more compact designs, while their high peak output current allows for faster switching by eliminating the need for an additional driver stage. The devices’ low propagation delay minimizes switching losses while facilitating more precise PWM regulation.

The optocouplers’ high isolation package enables high working voltages up to 1.140 V, which allows for high voltage inverter stages while still maintaining enough voltage safety margin. The RoHS-compliant devices offer high noise immunity of 50 kV/µs, which prevents fail functions in fast switching power stages.

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Many industrial applications today are transitioning to higher power levels with minimized power losses, which can be achieved through increased DC link voltage. Infineon Technologies AG addresses this challenge by introducing the CoolSiC Schottky diode 2000 V G5, the first discrete silicon carbide diode on the market with a breakdown voltage of 2000 V. The product family is suitable for applications with DC link voltages up to 1500 VDC and offers current ratings from 10 to 80 A. This makes it ideal for higher DC link voltage applications such as in solar and EV charging applications.

The product family comes in a TO-247PLUS-4-HCC package, with 14 mm creepage and 5.4 mm clearance distance. This, together with a current rating of up to 80 A, enables a significantly higher power density. It allows developers to achieve higher power levels in their applications with only half the component count of 1200 V solutions. This simplifies the overall design and enables a smooth transition from multi-level topologies to 2-level topologies.

In addition, the CoolSiC Schottky diode 2000V G5 utilizes the .XT interconnection technology that leads to significantly lower thermal resistance and impedance, enabling better heat management.   Furthermore, the robustness against humidity has been demonstrated in HV-H3TRB reliability tests. The diodes exhibit neither reverse recovery current nor forward recovery and feature a low forward voltage, ensuring enhanced system performance.

The 2000 V diode family is a perfect match for the CoolSiC MOSFETs 2000 V in the TO-247Plus-4 HCC package that Infineon introduced in spring 2024. The CoolSiC diodes 2000 V portfolio will be extended by offering them in the TO-247-2 package, which will be available in December 2024. A matching gate driver portfolio is also available for the CoolSiC MOSFETs 2000 V.

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The RISC-V-based MPUs support mission-critical intelligent edge applications with TSN Ethernet switching and AI capabilities

The global edge computing market is expected to grow by more than 30 percent in the next five years, serving mission-critical applications in the aerospace, defense, military, industrial and medical sectors. To meet this increasing demand for reliable, embedded solutions for mixed-criticality systems, Microchip Technology has announced the PIC64HX family of microprocessors (MPUs). Unlike traditional MPUs, the PIC64HX is purpose-built to address the unique demands of intelligent edge designs.

The latest in Microchip’s 64-bit portfolio, the PIC64HX is a high-performance, multicore 64-bit RISC-V MPU capable of advanced Artificial Intelligence and Machine Learning (AI/ML) processing and designed with integrated Time-Sensitive Networking (TSN) Ethernet connectivity and post-quantum-enabled, defense-grade security.

PIC64HX MPUs are specifically designed to deliver comprehensive fault tolerance, resiliency, scalability and power efficiency.

“The PIC64HX MPU is truly groundbreaking in the number of advanced features we are able to provide with a single solution,” said Maher Fahmi, corporate vice president of Microchip’s communications business unit. “And, integrating TSN Ethernet switching into the MPU helps developers bring standards-based networking connectivity and compute together to simplify system designs, reduce system costs and accelerate time to market.”

The integrated Ethernet switch includes a TSN feature set with support for important emerging standards: IEEE P802.1DP TSN for Aerospace Onboard Ethernet Communications, IEEE P802.1DG TSN Profile for Automotive In-Vehicle Ethernet Communications and IEEE/IEC 60802 TSN Profile for Industrial Automation.

Eight 64-bit RISC-V CPU cores—SiFive Intelligence X280—with vector extensions help enable

high-performance compute for mixed-criticality systems, virtualization and vector processing to accelerate AI workloads. The PIC64HX MPU allows system developers to deploy the cores in multiple ways to enable SMP, AMP or dual-core lockstep operations. WorldGuard hardware architecture support is provided to enable hardware-based isolation and partitioning.

“Next-generation aircraft require a new generation of processors for mission-critical applications such as flight control, cockpit display, cabin networking and engine control. The OHPERA Consortium views RISC-V technology as an essential component of the future of safe and sustainable aircraft,” said Christophe Vlacich, OHPERA technical Leader. The OHPERA Consortium is composed of leading aerospace companies with the mutual goal of evaluating new technologies for next-generation aircraft.  “We are pleased to see the upcoming availability of commercial products like Microchip’s PIC64HX MPU with the compute performance, partitioning, connectivity and security needed to shape the future of aviation.”

The expected arrival of quantum computers poses an existential threat as it will make current security measures ineffective. As a result, government agencies and enterprises worldwide are beginning to call for the inclusion of post-quantum cryptography in any critical infrastructure. Addressing current and future security needs, the PIC64HX is one of the first MPUs on the market to support comprehensive defense-grade security including the recently NIST-standardized FIPS 203 (ML-KEM) and FIPS 204 (ML-DSA) post-quantum cryptographic algorithms.

The PIC64HX MPU is a powerful and versatile solution for intelligent edge applications, addressing key requirements for low latency, security, reliability and compliance with industry standards.

Development Tools

The PIC64HX MPU is supported by a comprehensive package of tools, libraries, drivers and boot firmware. Multiple open-source, commercial and real-time operating systems are supported including Linux and RTEMS, as well as hypervisors such as Xen. PIC64HX MPUs leverage Microchip’s extensive Mi-V ecosystem of tools and design resources to support its RISC-V initiatives. To help reduce development cycles and accelerate time to market, Microchip offers the Curiosity Ultra+ PIC64HX evaluation kit and is partnering with single-board computer partners.

“Aries Embedded has long been a supporter of the RISC-V ecosystem,” said Andreas Widder, Aries Embedded CEO. “We are proud to be a lead System-on-Module partner for the PIC64HX and look forward to helping Microchip enable mission critical intelligent edge applications.”

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Using the most advanced GaN manufacturing technology available today, Aizu, Japan, is now the company’s second factory to produce a complete portfolio of GaN-based power semiconductors

NEWS HIGHLIGHTS:

• TI adds GaN manufacturing in Japan, quadrupling its internal GaN manufacturing capacity between its factories in the United States and Japan.
• TI’s GaN-based semiconductors are in production and available now.
• TI enables the most energy-efficient, reliable and power-dense end products with the widest portfolio of integrated GaN-based power semiconductors.
• TI has successfully piloted the development of GaN manufacturing on 300mm wafers.

Texas Instruments has announced it has begun production of gallium nitride (GaN)-based power semiconductors at its factory in Aizu, Japan. Coupled with its existing GaN manufacturing in Dallas, Texas, TI will now internally manufacture four times more GaN-based power semiconductors, as Aizu ramps to production.

“Building on more than a decade of expertise in GaN chip design and manufacturing, we have successfully qualified our 200mm GaN technology – the most scalable and cost-competitive way to manufacture GaN today – to start mass production in Aizu,” said Mohammad Yunus, TI’s senior vice president of Technology and Manufacturing. “This milestone enables us to manufacture more of our GaN chips internally as we grow our internal manufacturing to more than 95% by 2030, while also sourcing from multiple TI locations, ensuring a reliable supply of our entire GaN portfolio of high-power, energy-efficient semiconductors.”

The power of GaN technology

An alternative to silicon, GaN is a semiconductor material that offers benefits in energy-efficiency, switching speed, power solution size and weight, overall system cost, and performance under high temperatures and high-voltage conditions. GaN chips provide more power density, or power in smaller spaces, enabling applications such as power adapters for laptops and mobile phones, or smaller, more energy-efficient motors for heating and air conditioning systems and home appliances.

Today, TI offers the widest portfolio of integrated GaN-based power semiconductors, ranging from low- to high-voltage, to enable the most energy-efficient, reliable and power-dense electronics.

“With GaN, TI can deliver more power, more efficiently in a compact space, which is the primary market need driving innovation for many of our customers,” said Kannan Soundarapandian, vice president of High-Voltage Power at TI. “As designers of systems such as server power, solar energy generation and AC/DC adapters face challenges to reduce power consumption and enhance energy efficiency, they are increasingly demanding a reliable supply of TI’s high-performance GaN-based chips. TI’s product portfolio of integrated GaN power stages enables customers to achieve higher power density, improved ease of use and lower system cost.”

Further, with the company’s proprietary GaN-on-silicon process, more than 80 million hours of reliability testing, and integrated protection features, TI GaN chips are designed to keep high-voltage systems safe.

Most advanced GaN manufacturing technology available today

Using the most advanced equipment available for GaN chip manufacturing today, TI’s new capacity enables increased product performance and manufacturing process efficiency, as well as a cost advantage.

Also, the more advanced, efficient tools used in TI’s expanded GaN manufacturing can produce smaller chips, packing even more power. This design innovation can be manufactured using less water, energy and raw materials, and end products that use GaN chips enjoy these same environmental benefits.

Scaled for future advances

The performance benefits of TI’s added GaN manufacturing also enable the company to scale its GaN chips to higher voltages, starting with 900V and increasing to higher voltages over time, furthering power-efficiency and size innovations for applications like robotics, renewable energy and server power supplies.

In addition, TI’s expanded investment includes a successful pilot earlier this year for development of GaN manufacturing processes on 300mm wafers. Further, TI’s expanded GaN manufacturing processes are fully transferable to 300mm technology, positioning the company to readily scale to customer needs and move to 300mm in the future.

Committed to responsible, sustainable manufacturing

Expanding supply and innovation in GaN technology is the latest example of TI’s commitment to responsible, sustainable manufacturing. TI has committed to use 100% renewable electricity in its U.S. operations by 2027, and worldwide by 2030.

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Delivers SMT and IP67 for high-efficiency performance in automotive, consumer, medical, and industrial applications

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, announces the C&K Switches KSC DCT Series Tactile Switches. The KSC DCT (Dual Circuit Technology) series are sealed IP67-rated, momentary-action tactile switches for surface-mount technology (SMT), designed to give users a positive, adaptable tactile feeling.

The KSC DCT is the first tactile switch to offer single pole double throw (SPDT) functionality in a small 6.2 x 6.2 x 5.2 millimeters size. The switches feature a soft actuator that withstands an operating force of 4.75N (+/-1.25N) and has a lifespan of 300K life cycles. The KSC DCT Series is a logical choice for seamless integration into existing or next-generation designs, providing outstanding, long-term reliability in even the dustiest environments.

The KSC DCT Tactile Switches offer these key features and benefits:

• SPDT Functionality: Added reliability due to one input and two outputs in a single tactile switch.
• Compact Footprint: Fits applications where space is limited.
• IP67 Sealing: Provides high contact reliability, protecting against dust and water ingress.
• J-Bend SMT Package: Enables standard assembly mounting using typical pick-and-place machines. (Gullwing-type terminations are also available.)
• Cost-Efficient: SMT makes it ideal for high-volume applications.

The KSC DCT Series Tactile Switches are ideally suited for:

• Transportation: Automotive door handles, EV charging station units, two- and three-wheelers.
• Consumer Electronics: Power tools, lawn mowers, snow blowers, home appliances.
• Medical Devices: Electrosurgical instruments, portable medical devices.
• Industrial Applications: Elevators, fire alarm equipment.

“By designing the unique functionality of dual-circuit technology tactile switches into such a small form factor, Littelfuse engineers are enabling electronics designers to provide their end-customers a journey to a safer world,” said Jeremy Hebras, Vice President of Digital & Technical Developments, Electronics Business Unit Engineering, at Littelfuse. “Thanks to the KSC DCT’s patented design, everyone can now precisely monitor the actual status of an electromechanical surface-mount technology tactile switch, even when the switch is not in use, which helps discriminate a silent signal versus a device malfunction.”

The increased safety needs of today’s end users require active failure verification: with the added single pole double throw (SPDT) functionality, the KSC DCT tactile switch allows a system to actively verify failures, like an unwanted door opening.

How it works: Dual-Circuit Technology (DCT) is a feature that creates two independent output signals inside the body of one tactile switch–Single Pole Double Throw (SPDT). The KSC DCT tactile switch has a Common, Normally Close (NC), and Normally Open (NO) pin. Suppose the designer chooses to use both NC and NO circuitry. In that case, it provides a Changeover signal that allows the designer to use both circuitries to define the logic of the signal and take actions based on the defined logic. In an automotive door handle, for example, both NC and NO circuitries are used before making any decision. The logic is at rest; the NC contact is closed while the NO contact is open. When a user pushes the button, nothing will happen until the NC contact is open and the NO contact is closed.

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Spectrum Instrumentation launches flagship series of AWG cards in PCIe format

Scientists and engineers now have a way to produce high-frequency arbitrary waveforms, with high purity and low distortion, directly from their PC. Using the new PCIe flagship AWG cards from Spectrum Instrumentation and cost-effective COTS (Commercial-of-the-shelf) PC-parts, it is possible to generate nearly any waveform with up to 10 GS/s output rates, 2.5 GHz bandwidth, and 16-bit vertical resolution. The new cards make a powerful alternative to benchtop AWGs that often face a bottleneck when loading data for new waveforms. The cards offer a massive onboard memory of up to 8 GigaSamples (16 GB) and the possibility to stream data at up to 10 GigaBytes per second directly from CPUs or even GPUs. Four different models make up the M5i.63xx AWG series, offering a perfect fit solution for every application.

Insert the cards into a suitable PC and it turns into one of the most powerful signal generation instruments on the market. The four AWG variants deliver waveform generation with bandwidths of 2.5 and 1.5 Gigahertz (GHz) and output rates of 10, 5 or 3.2 Gigasamples per second (GS/s). The units combine 16-bit vertical resolution with programmable full-scale outputs. Single outputs deliver up to ±500 mV into 50 Ohm and ±1.0 V into high impedance loads – or double the range in differential mode.

Ultrafast data streaming

Each card comes with 2 GSample of onboard memory (8 GSample optional) and high-speed data transfer using a 16 lane, Gen 3, PCIe bus. This ultrafast bus allows data to be sent to cards at a staggering 10 GB/s. For demanding applications, data can even be continuously streamed directly to the AWG for replay in a FIFO mode – a process that allows almost limitless waveform production. Add Spectrum’s SCAPP driver package, which allows FIFO streaming directly to and from a GPU, and turbocharge the waveform processing even further.

The four new AWG flagships in PCIe format combine up to 10 GS/s speed, up to 2.5 GHz bandwidth, and 16-bit resolution. In the diagram, a two-channel M5i.6357 generates the two signals (I and Q component) for a Quadrature-Modulation.

Versatile Waveform Generation

Waveforms can be output in Single-shot, Repeated and Multiple Replay modes. To maximize memory efficiency, Multiple Replay can be used to output segmented data and can also be combined with FIFO streaming. Waveform replay can be initiated by a simple software command or via a trigger event. Trigger signals can be input on two external trigger lines.

Multi-channel Systems

Individual cards have one or two analog output channels. To create larger multi-channel systems, cards can be connected together using the company’s proprietary Star-Hub clock and trigger synchronization module. Star-Hub allows systems with up to eight cards to share a common clock and trigger, delivering fully synchronous output rates of 5 GS/s on up to 16 channels, or 10 GS/s on up to eight channels.

Mixed AWG and Digitizer Systems

The new flagship AWGs are available with one or two output channels, which can be used single-ended or differential (see front panel on the right).

The four new models of the M5i.63xx AWG series and the seven variants of the M5i.33xx digitizer series are designed for working together, making them ideal for use in stimulus-response, receiver-transmitter or closed-loop type testing systems. For example, if two Star-Hubs are used, ultrafast MIMO systems can be built that contain up to 8 AWGs and 8 digitizers. This allows the creation of systems with up to 16 transmit and 16 receiver channels, each channel with 5 GS/s.

Easy connection with other devices

For easy system integration, the front-panel hosts four multi-function SMA connectors. These can perform a variety of Input/Output tasks like Asynchronous Digital-I/O, Synchronous Digital-Out, Trigger Output, Run and Arm status flags, or the System Clock. By switching the multi-function I/O lines to digital outputs, another four synchronous output channels can be added to the AWG. As such, a single AWG card can generate up to two analog and four digital outputs, in parallel, at full speed. As an option, a Digital Pulse Generator firmware is available to turn the four digital outputs into digital generators outputs. All these features are very helpful when interfacing with other equipment for experiment control or in OEM projects.

Fully programmable

Fully programmable, the cards run under Windows or LINUX operating systems, using today’s most popular and powerful software languages. All products are shipped together with SDKs for C++, C#, Python, VB.NET, Julia, Java and IVI. Drivers are also provided for third-party software products LabVIEW and MATLAB.

Five Year Warranty

The Spectrum M5i.63xx series AWGs are available for immediate delivery. All cards are shipped factory tested and include a five-year warranty, with software and firmware updates, free of charge, for the lifetime of the product.

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Test and measurement technology leader Rohde & Schwarz with decades of expertise is set to showcase at electronica 2024, held in its home city Munich. Visitors will be able to experience the company’s wide range of solutions designed to help them tackle their test and measurement challenges in the development, verification, and production of electronic components and devices – from the everyday to the extraordinary.

The 60th anniversary edition of the world’s leading electronics trade fair, electronica, is coming to Munich from November 12 to 15, 2024. Munich-based T&M expert Rohde & Schwarz will welcome trade show visitors to booth A3.307 at the Messe München fairgrounds, where they will exhibit a variety of test and measurement solutions tailored to developers and test engineers. Highlight applications will range from day-to-day test and measurement tasks – like verifying RF frontends or optimizing wide bandgap power designs – to dedicated solutions for emerging technologies – like radar, non-terrestrial networks or particle accelerators and quantum computing.

Ensuring reliability in power electronics
Rohde & Schwarz will showcase a variety of applications based on its next-generation oscilloscopes of the MXO 5 and MXO 5C series at electronica that assist engineers to ensure the reliablity of their power electronics. The eight-channel MXO 5 oscilloscope coupled with the R&S RT-ZISO isolated probing system delivers unparalleled accuracy, sensitivity, dynamic range and bandwidth. With these features it is the ideal solution for characterization, verification and debug of the next generation of wide-bandgap (WBG) power designs with SiC and GaN, demonstrated at the event.

In another setup, the MXO 5 oscilloscope will demonstrate that multi-phase buck converter design validation can be easy and delivers reliable results. High-speed multi-phase buck converter SoCs offer various operational benefits to meet demands in big data and other applications requiring lower voltages, higher currents and faster switching times.

And in a demonstration in partnership with PE Systems GmbH, visitors will be able to experience a double pulse tester system employing the new rackmount optimized MXO 5C oscilloscope without a display along with probes and power supplies from Rohde & Schwarz. The fully automated test system for characterizing power conductors and passive components allows the user to search for optimal driver parameters and conduct verification measurements on entire power electronic systems.

Wideband modulated load pull
To verify the system level performance of RF frontends across different impedances, Rohde & Schwarz will present a new solution for wideband modulated load pull, using the R&S SMW200A vector signal generator, the R&S RTP164 oscilloscope and new software option R&S RTP-K98 to characterize non-linear devices fast and precisely. With this solution users can validate RF frontends for load impedance variation as seen when driving RF signals into an antenna over a wider frequency range.

Conducted emission measurements
For both device developers and conformance test houses, the R&S EPL1000 EMI test receiver offers fast, accurate and reliable EMI compliance measurements up to 30 MHz and fully complies with CISPR 16-1-1. The R&S EPL1000 features 4-channel click rate analysis, a real-time spectrogram function and automated measurements, making it ideal for conducted voltage and current measurements. Typical applications include pre-compliance measurements, pre-certification and certification in line with IEC, EN, CISPR and FCC.

Gigabit Multimedia Serial Link (GMSL) signal integrity analysis
Gigabit Multimedia Serial Link (GMSL) from Analog Devices is a cost-efficient and scalable SerDes technology that achieves a new level of performance for high-resolution digital video transport in camera and display-based applications. At electronica, Rohde & Schwarz will feature the R&S RTP oscilloscope performing key signal integrity measurements such as eye diagrams to validate and debug a GMSL link.

Automotive radar functional testing
The new R&S RadEsT automotive radar tester is an ultra-compact, versatile radar target simulator that meets the full range of testing needs – from lab-based functional testing to vehicle-level production checks and beyond. Visitors can learn how to streamline radar sensor testing using the R&S RadEsT in radar sensor calibration, ADAS/AD functional testing and on OEM production lines.

Electric drivetrain component testing
Even marginal improvements in electric drivetrain efficiency and performance can significantly enhance overall electric vehicle (EV) operation. At electronica, Rohde & Schwarz will present a solution for OEMs and their suppliers to characterize and optimize drivetrain components, such as inverters and battery management systems. The solution is based on the MFIA from Zurich Instruments, the MXO 5 oscilloscope and the R&S NGM power supply.

Non-terrestrial network testing
Rohde & Schwarz is pushing the limits of seamless global coverage over land, sea and air with its test solutions for non-terrestrial networks (NTN) that offer extensive protocol verification and compliance with GCF/PTCRB and operator‑specific standards like Skylo, enhancing the reliability and efficiency of satellite-based communications. In a demo setup at electronica, the CMX500 radio communication tester will emulate complex multi-orbit (LEO, MEO, GSO, GEO) and multi-band (L/S/Ku/Ka Band) satellite environments, simulating a wide range of network conditions to ensure NTN-NR devices perform flawlessly anywhere in the world. In addition, test cases for NB-NTN, using the advanced CMW500 wideband radio communication tester, will also be showcased.

RedCap device testing
5G RedCap devices offer reduced features and operate on 5G standalone networks only. This results in greater reliability, lower latency, and improved performance and efficiency. Rohde & Schwarz will present specialized testing for RedCap device R&D with a comprehensive solution based on the CMX500 radio communication tester. Visitors will be able to learn how to ensure optimal device performance and regulatory compliance with extensive LTE and 5G NR protocol verification as defined in 3GPP 5G Release 17.

Researching game-changing technologies
Rohde & Schwarz, in collaboration with Zurich Instruments, addresses particle accelerators physics, quantum computing and other extraordinary scientific and industrial research applications. Experiments in accelerators physics, for instance in synchrotron labs, often require precise measurements of pulse amplitude or timing jitter. Oscilloscopes are indispensable for continuous monitoring for the entire signal, while the UHF-BOX Boxcar Averager from Zurich Instruments streamlines the data acquisition by capturing the directly the integrated pulse amplitude in real-time.

Service and calibration in great hands
Leading-edge technology belongs in expert hands. The Rohde & Schwarz support network spans multiple time zones and reaches every corner of the globe. At electronica, Rohde & Schwarz will spotlight its comprehensive service portfolio, including accredited calibration services, repair services directly from Rohde & Schwarz, training courses and industry insights from the R&S Technology Academy, as well as a 24/7 hotline and on-site support.

Moreover, as a world leader in RF product manufacturing with extensive vertical integration, Rohde & Schwarz also offers its expertise to other electronic product manufacturers. At electronica, visitors can learn about the high-precision electronic manufacturing services (EMS) available at the Rohde & Schwarz plants in Memmingen and in Teisnach.

Rohde & Schwarz will be at electronica 2024 in hall A3 at booth 307 from November 12 to 15, 2024.

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Focusing on Smart Power and Smart Industrials for a sustainable future

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, will host the Industrial Summit 2024 on October 29 at the Futian Shangri-La Hotel, in Shenzhen, China.

Recognizing the significant challenges posed by climate change, ST has consistently demonstrated its unwavering commitment to sustainability. The Company is dedicated to improving power density and efficiency through its cutting-edge solutions, leading the way towards reduced carbon emissions and a sustainable future.

The Industrial Summit is a top-notch technology showcase that highlights the breadth and depth of ST’s industrial products and solutions. Into its 6th edition, this year’s event continues the overarching theme of “Powering Your Sustainable Innovation”, with a focus on Smart Power and Smart Industrials for a sustainable future.

Visitors will hear insightful keynotes and 28 technical presentations from ST, its customers and partners, and can explore over 150 demonstrations targeting three main market segments: Automation, Power & Energy, and Motor Control. Additionally, the event will feature 6 showstoppers developed in close collaboration with ST’s customers and partners, presenting innovative technologies, solutions, and products in the areas of growing demand from the end markets, including Silicon Carbide (SiC) and Gallium Nitride (GaN), power supply for AI data center, High Power Thermal Management system, Automation Production Line, the Solar-Storage-Charging Integration demo, and various solutions from the Ecosystem Partners of ST.

Showstopper and demo highlights

ST’s 25+ Years of SiC Leadership: ST brings value to its customers through mastery of the full silicon carbide (SiC) value chain, from R&D, substrate, epitaxy, and wafer fabrication to assembly and packaging of power discretes and modules. At this year’s Industrial Summit, the SiC showstopper will demonstrate ST as a global SiC leader in market, innovation and manufacturing, with a broad portfolio of STPOWER MOSFETs and diodes adapted for key industrial and automotive applications. Visitors will get a comprehensive overview of the development and manufacturing of SiC devices, from powder to the end product.

ST’s cutting-edge SiC MOSFET and diode portfolio, complemented by STGAP galvanic isolated drivers, delivers high efficiency, reliability, and performance in different packages. It will be demonstrated at the Summit through various reference designs for energy storage and power supply for AI servers, as well as other high-power applications.

 Next-Generation Data Center Infrastructure from Megawatt to Gigawatt: The AI and data communications sectors, currently responsible for 4% of global carbon emissions, are projected to reach 14% of emissions by 2040. Adopting heat recovery, liquid cooling, HVDC (High Voltage Direct Current), high-efficiency PSUs (Power Supply Unit), and new power-semiconductor technologies can further reduce power consumption.

Rapid advancements in power technology, including through new semiconductor materials like SiC and GaN (Gallium Nitride) driven by STGAP galvanic isolation gate drivers, will help further moderate the growth in energy demand from data centers. Highlighting ST’s capabilities is a 5.5 kW power supply for AI data centers using SiC for greater efficiency and better power density. In addition, with STPOWER MDmesh M9/DM9 series super-junction power MOSFETs, ST sets a benchmark for the 600V/650V super-junction technology combining best-in-class performance with remarkable ease of use. Tailored for both hard- and soft-switching topologies, the MDmesh M9 and DM9 series are ideal for AI server data centers. Moreover, the STM32G4 microcontrollers bring intelligence and advanced control to our power solutions, allowing us to better manage power distribution and adapt to fluctuating loads in real-time.

In addition, transitioning to HVDC infrastructure can further enhance data-center efficiency by reducing transmission losses and energy consumption. ST’s SiC technology, paired with advanced packaging, enables HVDC systems to excel in high-temperature environments.

High-Power Thermal-Management Systems: The demand for high-power cooling solutions is rapidly increasing across various sectors, driven by significant growth in HVAC (Heating, Ventilation, Air Conditioning) systems, AI data centers infrastructure management, and grid-scale battery energy storage.

ST provides a comprehensive set of high-power cooling solutions to address differentiated power ranges and architectures. At this showstopper, ST will showcase its latest 10kW Commercial Compressor solution, which innovates using one single STM32G4 microcontroller (MCU) to control multiple functions, including three-phase PFC Vienna, FOC (Field Oriented Control) motor control, Nano Edge AI predictive maintenance, and KNX. This solution also delivers robust and reliable performance with ST’s 1200V IGBTs and SiC diodes, plus STGAP galvanically isolated gate drivers. Also, two other solutions will be featured at this showstopper­­: the 7kW triple FOC and interleaved PFC, and 4kW Dual FOC and Interleaved PFC. These solutions ensure efficient and reliable performance to meet different customer specifications for heat pumps and commercial air conditioning, based on ST’s SLLIMM Intelligent Power Modules, and Power Management and Analog ICs

Automated Assembly Line System: This groundbreaking automated assembly line system is the first of its kind at ST and represents the largest demonstration at the Industrial Summit 2024. An unprecedented factory-automation system underscores ST’s comprehensive ecosystem of partners and extensive system-level expertise in embedded systems. This demo features a complex automation system that integrates 3 robotic arms, which communicate precisely with an AGV (Automated Guided Vehicle) to transfer items running on an MTS (Maglev Track System) driven by 7 ST dual motor servo drive solutions. All these components are managed by an ST Programmable Logic Controller (PLC), navigating through a variety of standards such as Codesys, EtherCAT, Profinet, Sub-1G, IO-Link, and more. This demo is further enhanced in collaboration with Siemens automation solutions, enabling seamless integration like the PLC (Programmable Logic Controller) and HMI, which reflects accuracy, reliability and precision.

This impressive system demonstrates all major ST technologies for automation systems, including STM32 MCUs for HMI (Human Machine Interface), STM32MP1/2 Microprocessor Units (MPUs) for PLC processing, and a wide variety of analog products like IPS (intelligent power switches) for control. The system also covers different connectivity technologies for both wired (such as IO-link) and wireless, where the ST ultra-low power MCUs can bring added value in battery life.

Lastly, ST technologies include Industrial sensors (such as ToF proximity sensors, MEMS and IR sensors, IMUs, accelerometers, vibrometers, pressure sensors), ST25R for RFID read/write and Industrial actuators for the robotic arms, and the massive 14 PMSM linear motors are well covered by ST gate drivers and motion control ICs, wide LV and HV MOSFETS, IPS, Power management IC, and all this requires good protection devices for both input (CLTxx) and output (SMAJxx). In total, more than 500 ST devices are utilized across various HMIs, PLC controllers, drivers, RFID readers, gateways, connectivity devices, sensors, servo motors, and other components.

Solutions from Ecosystem Partners: To tackle the diverse challenges of the highly fragmented industrial market, ST is collaborating with technology leaders, key industrial customers, and ecosystem partners to accelerate growth and meet local market needs. Beyond the major highlights above, additional demos showcasing collaborations between ST and its ecosystem partners will be featured, including the Carbon Management solutions from ST’s customer Sungrow iCarbon, the Solar-Storage-Charging Integration Digital Energy Management solution from ST’s distributor WT Microelectronics, and multiple innovations from Joint Labs between ST and some leading Chinese universities.

The post STMicroelectronics hosts premier Industrial Summit in Shenzhen appeared first on ELE Times.

New best-of-both memory combines serial Flash speed and density with EEPROM byte-level flexibility

STMicroelectronics’ Page EEPROM combines the power efficiency and durability of an EEPROM with the capacity and speed of a Flash memory, creating a hybrid memory for applications that face extreme size and power constraints.

The new memories address growing demand for storage in embedded applications, needed to support increasingly sophisticated features and run data-hungry edge-AI algorithms. One example is behind-the-ear hearing aids, where Page EEPROM can reduce the bill of materials and help create products that are slimmer and more comfortable to wear.

In addition to wearables, Page EEPROM is ideal for applications such as healthcare devices, asset trackers, e-bikes, as well as other industrial and consumer products. “The intelligent edge has evolved quickly and is profoundly changing demands on embedded memory storage density, performance, and power consumption,” said Philippe Ganivet, STMicroelectronics EEPROM product line manager.  “Our new Page EEPROM is the perfect ultra-low-power memory to complement a microcontroller for remote IoT modules that operate on battery power.”

“ST’s Page EEPROM is the perfect non-volatile memory, a true best-of-both worlds solution that enabled us to achieve the ambitious targets we set when creating the latest generation of our flagship product family of GPS trackers, IoT devices, and all other designs where high performance, high reliability, small size, and low power are required,” said Patrick Kusbel, owner of BitFlip Engineering, one of the first customers to use the new memory ICs. “The M95P is up to 50 times faster yet consumes as little as one-tenth the power and delivers five times the reliability — at 500k writes compared to 100k writes — typical of other parts we used before. It’s a game changer.”

ST’s Page EEPROM family offers densities of 8Mbit, 16Mbit, and 32Mbit, greatly increasing storage over standard EEPROM devices. Embedded smart page-management allows byte-level write operations for processes like data logging, while also supporting page/sector/block erase and page-program up to 512 bytes for efficiently handling firmware over the air (OTA) updates. The devices also allow buffer loading, which can program several pages simultaneously to cut the time for loading software in production. The data-read speed of 320 Mbit/s is about 16 times faster than standard EEPROM, while write-cycle endurance of 500,000 cycles is several times higher than conventional serial Flash.

Also featuring a novel peak-current control, Page EEPROM minimizes power supply noise and prolongs the runtime of battery-operated equipment. The write current is below that of many conventional EEPROMs and there is also a deep power-down mode with fast wakeup that reduces the current to below 1µA.

Longevity is assured, with 100-year data retention. The devices are included in ST’s 10-years product longevity program that guarantees long-term product availability.

The X-NUCLEO-PGEEZ1 expansion board and X-CUBE-EEPRMA1 software package are available now, for users to learn how to interact with Page EEPROM and adopt the new devices in application designs. The software includes a demonstration application that shows how to test the memory’s hybrid architecture and quickly build a proof of concept.

The post STMicroelectronics reveals Page EEPROM two-in-one memory to boost smart-edge performance and efficiency appeared first on ELE Times.

In today’s tech-driven era, automotive electronics have become integral to modern vehicles, comprising an array of systems such as engine management, ignition, radio, carputers, telematics, in-car entertainment systems, among others. Over time, the importance of these electronic systems has been growing. Historically, electronics constituted about 10% of the total car cost till the 1980s, later, this share reached 35% by 2010, according to Statista. Keeping pace with the trend, in 2030, electronics are projected to make up around 50% of the cost of a new car. The main drivers of this rise are attributed to electronics usage in cars and the broader trends of connectivity and automation.

Considering this upsurge, technology is destined to lead the way for the automotive electronics sector in the foreseeable future. To speed fast its systems, telematics and the Internet of Things (IoT) can create welcome opportunities. Telematics, in particular, is capable of tracking the vehicle to transmit and store real-time data about its location, operation, and function. Subsequently, this data can be used to improve driver safety, increase efficiency, and reduce costs. Similarly, automotive IoT forms an essential component of connected car technology allowing vehicles to interact with external objects and road users such as other vehicles, people, or road infrastructure, and ensure greater road safety and traffic efficiency.

Let’s look at how telematics and IoT are evolving to aid automotive electronics:

• Real-Time Supply Chain Visibility: Telematics provides automotive makers with critical insights into their supply chains, allowing them to address gaps in deliveries and production timelines. Additionally, IoT apps ease fleet management with the help of integrated weight management, location tracking and advanced sensors.
• Data Collection and Analysis: Tracking devices powered by telematics collect and transmit data, such as GPS position, speed, and fuel consumption. The data is sent to a centralised server, where it can be analysed and optimised for user interfaces. Moreover, the increase in electronics has enhanced vehicles’ capabilities to monitor both internal and external conditions. Thus, connected cars are capable of sharing these kinds of information with other devices via a robust IoT ecosystem. Interestingly, it is projected that by 2025, there will be over 400 million connected cars in operation, up from some 237 million in 2021.
• Live Monitoring and Safety Enhancement: Telematics allows for real-time monitoring of vehicles, especially in semi-autonomous cars. It is put in place with GPS and onboard diagnostics to record and map the vehicle’s location, route, speed, and ensure the safety of people. Moreover, IoT-infused semi-autonomous cars make on-spot decisions while partly controlling the vehicle operations to avoid accidents and reduce the load from the driver. Along with different proximity sensors and cameras, cars are integrated with IoT systems to reduce human error and make driving more comfortable and safe.
• Predictive Analysis and Improved Efficiency: A sought-after feature of automotive electronics is predictive analytics. Telematics data helps businesses make insightful decisions to identify potential issues. These systems can proactively alert drivers if they swerve, and detect drowsiness using vision AI models. As for IoT, it aids in taking necessary actions to prevent car parts from sudden breakdowns.

Future Prospects

Looking ahead, as the field of telematics matures, smart cars will continue tapping into IoT sensors and devices that link vehicles in cities via smart traffic technologies. Automotive manufacturers will use telematics for a variety of testing and training purposes such as gaining deeper insights into onsite or remote testing, creating predictive models for vehicle integrity, training employees virtually, as well as running simulations to improve crash-test safety.

The sector is bound to integrate AI to analyse large amounts of data from vehicle sensors for autonomous driving capabilities. Future vehicles may even influence telematics to provide tailored experiences based on driver preferences and habits, including navigation, entertainment, and comfort settings. With the rise of electric vehicles, telematics will play a major role in managing battery health, optimising charging, and planning energy-efficient routes. Ultimately, these developments will certainly shape business opportunities and process refinements in automotive electronics that were previously unattainable.

Author: Pavan Puri, Founder & Managing Director, Greencore Electronics

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                                                                                             FOR IMMEDIATE RELEASE

 

Littelfuse Unveils Industry’s First Asymmetrical TVS Diode Series for SiC MOSFET Gate Protection

Ideal for high-efficiency power solutions in data center, EV infrastructure, and industrial equipment

CHICAGO, October 22, 2024 — Littelfuse, Inc. (NASDAQ: LFUS), an industrial technology manufacturing company empowering a sustainable, connected, and safer world, today announced the SMFA Asymmetrical Series Surface-Mount TVS Diode, the first-to-market asymmetrical TVS solution specifically designed to protect Silicon Carbide (SiC) MOSFET gates from overvoltage events. As SiC MOSFETs become increasingly popular due to their faster switching speeds and superior efficiency compared to traditional Silicon MOSFETs and IGBTs, the need for robust gate protection has never been greater. The SMFA Asymmetrical Series offers an innovative, single-component solution that significantly enhances circuit reliability while simplifying design.  View the video.

The SMFA Asymmetrical Series is the only TVS diode on the market engineered specifically for the unique gate protection requirements of SiC MOSFETs. Unlike traditional solutions that require multiple Zener or TVS diodes, the SMFA Series effectively protects against ringing and overshoot phenomena in gate drive circuits using a single component, saving valuable PCB space and reducing the complexity of circuit designs.

The SMFA Asymmetrical Series Surface-Mount TVS Diode offers the following key features and benefits:

• Asymmetrical Design: The SMFA Series is tailored to the specific negative and positive gate voltage ratings of SiC MOSFETs, ensuring precise and reliable protection.
• Single-Component Solution: Replaces multiple Zener and TVS diodes, reducing the number of components and simplifying circuit layout.
• Space Efficiency: By combining multiple protection functions into one component, the SMFA Series minimizes PCB space usage, allowing for more compact and efficient designs.
• Compatibility: The SMFA Asymmetrical Series is compatible with all available Littelfuse and other leading SiC MOSFETs, making it a versatile solution for various applications.

“The SMFA Asymmetric TVS Diodes protect valuable SiC MOSFETs from gate failures using a single component solution that easily replaces multiple Zener and TVS diodes,” said Ben Huang, Director of Product Marketing at Littelfuse. “This unique solution also saves valuable PCB space while reducing the number of components required.”

The SMFA Asymmetrical Series is ideal for a variety of demanding applications where SiC MOSFETs are used, including:

• AI / Data Center Server Power Supplies: Enhances the reliability and efficiency of critical power supplies in high-performance computing environments.
• High-Efficiency Electric Vehicle Infrastructure (EVI) Power Systems: Provides robust gate protection in EV charging stations and related power systems, ensuring longevity and performance.
• High-Reliability Semiconductor/Industrial Equipment Power Supplies: Protects essential power supplies in industrial and semiconductor manufacturing environments, where reliability and uptime are paramount.

Availability

The SMFA Asymmetrical Series TVS Diode is available in tape and reel format in quantities of 3,000. Sample requests are accepted through authorized Littelfuse distributors worldwide. For a listing of Littelfuse distributors, please visit Littelfuse.com.

 

For More Information
Additional information is available on the SMFA Asymmetrical Series TVS Diodes product page. For technical questions, please contact: Ben Huang, Director of Product Management, Protection Business, SBU, Bhuang@littelfuse.com

About Littelfuse
Littelfuse is a diversified, industrial technology manufacturing company empowering a sustainable, connected, and safer world. Across more than 20 countries, and with approximately 17,000 global associates, we partner with customers to design and deliver innovative, reliable solutions. Serving over 100,000 end customers, our products are found in a variety of industrial, transportation, and electronics end markets—everywhere, every day. Headquartered in Chicago, Illinois, United States, Littelfuse was founded in 1927. Learn more at Littelfuse.com.

LFUS-P

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Author: STMicroelectronics

X-CUBE-STL now supports the STM32MP1, the STM32U5, the STM32L5, the STM32H5, and the STM32WL. In essence, the most extensive family of general-purpose microcontrollers capable of running Safety Integrity Level 2 and 3 certified systems continues to grow, and teams needing to meet IEC 61508, ISO 13849, and IEC 61800 requirements can do so on our latest devices. Additionally, the Functional Safety page will make finding the various ST resources that will assist developers striving for industrial or household electrical appliance certifications easier. It also lists the ST Authorized Partners providing real-time operating systems, development tools, engineering services, and training to ensure teams can cross the bridge from proof-of-concept to commercial products.

• Watch our Webinar on functional safety

The International Electrotechnical Commission defines safety as the “freedom from unacceptable risk of physical injury or of damage to people’s health.” When designing an embedded system, functional safety covers the various aspects of safety that depend on that system. For instance, in a manufacturing plant, functional safety ensures that in case of an internal failure, the circuit controlling a robot fails gracefully instead of harming its operators. In a medical application, standards guarantee that users are aware of malfunctions by the use of an alarm, among other things, to prevent detrimental usage. And since our STM32 microcontrollers are everywhere, we needed to see that they all had a straightforward path to IEC 61508 for industrial applications.

Before X-CUBE-STL: How to start working on an IEC 61508 certification A robot arm in an industrial setting

The IEC 61508 governs functional safety for electrical and electronic systems in all sorts of industries and applications. However, many STM32 users seek this certification when working in an industrial setting where risks are higher and requirements more stringent. The first significant aspect of the standard is the safety life cycle. Before anything else, engineers must document all the steps and measures they will take to accomplish functional safety, from the first design operations to the product’s decommissioning. The process includes risk analysis, safety protocols, and validations, maintenance, etc.

Our Functional Safety page is a great starting point for engineers because it provides a “safety manual” for nearly all STM32 microcontrollers, thus ensuring that teams can begin working on defining their product’s life cycle. Most documentation focuses on IEC 61508 compliance. However, we recently published an application note (AN5698) to help engineers adapt what’s in the X-CUBE-STL package to other safety certifications, such as ISO 13849, for safety of machinery. We also provide a failure mode and effect analysis (FMEA), which lists all the MCU failure modes and how to mitigate them. Similarly, the failure mode effect and diagnostic analysis (FMEDA) extends the former and computes failure rates for the MCU at the function level.

X-CUBE-STL: Self-test libraries to more rapidly obtain SIL 2 or SIL 3 certifications Understanding Safety Integrity Levels

The second aspect of IEC 61508 is the assignment of a Safety Integrity Level (SIL). After a hazard analysis determines what can go wrong and how badly it can damage a person or the environment, there’s a risk assessment to determine how often or how likely a hazard can occur. From these analyses, functional safety standards draw safety requirements or SIL.

There are four levels, the first being the laxest and the fourth representing the strictest standard. SIL 4 is traditionally for railway or nuclear applications. SIL 1 is looser and tends to apply to monitoring/information devices like CCTV, while SIL 2 and 3 are much more common in hardware designed for industrial applications. The main difference is the requirement to perform redundant measurements in SIL 3.

Knowing how to get started

To start working toward SIL 2 or SIL 3 certifications, teams begin by selecting an STM32 with the hardware safety features that match their application’s requirement. For instance, all our MCUs have a dual watchdog, but only the STM32G0, STM32G4, STM32H5, STM32H7, STM32L4/L4+, STM32L5, STM32U5, STM32WB/A, and STM32WL have ECC Flash memory, and out of them, only the STM32H7, STM32H5, and STM32U5 have ECC SRAM, which is traditionally only a requirement for high-performance applications.

Teams can also use the self-test libraries available in the X-CUBE-STL to start implementing failure detection mechanisms. For instance, they can help spot random failures in the CPU, the SRAM, or the Flash. The diagnostic capability of X-CUBE-STL is verified by fault injection methodology to improve the customers’ confidence in our solutions. To make these libraries more accessible, we offer them as object code, meaning that they can be integrated into any application, and developers can use any compiler.

X-CUBE-STL provides object code to help developers run self-tests on STM32 MCUs. Consequently, because we deliver an object code, developers can integrate it into their software, certify one object, and reuse it multiple times since it doesn’t depend on the compiler version or other dependencies. It greatly facilitates the process when applying to certification bodies.

X-CUBE-CLASSB and why an ecosystem matters Sharing resources

Recently, ST updated its X-CUBE-CLASSB, which targets electrical household appliances, to align it with X-CUBE-STL. Put simply, while they have different user manuals and different purposes, the selt-test libraries share the same code base with X-CUBE-STL. Hence, it becomes much easier to obtain more than one certification on the same hardware platform. Additionally, since these certifications are much less stringent than IEC 61508, the ability to use the same object code as the X-CUBE-STL provides greater assurance. The software package currently supports the STM32U5, STM32G0, STM32C0, STM32L4, STM32G4, STM32WL, STM32MP1, STM32H5, STM32F7, and STM32H7. Support for the STM32H7R/S, STM32U0, and STM32F4 will arrive by the end of the year.

Optimizing functional safety

All these packages turn our STM32 general-purpose microcontrollers into great candidates for the most complex protocols. Traditionally, MCUs aimed at these standards are custom products, which means that they are much more expensive and use hardware specifications that are sometimes more prohibitive in one way or another. ST’s approach is thus unique because we make these standards more accessible and provide an essential network of partners. In many instances, using two STM32s is still more cost-effective than using one MCU sold specifically for safety.

As great as the documentation and self-test libraries are, we know that they represent only the first steps in a long process. Many teams often underestimate the difficulties associated with getting a certification. Hence, we also have ST Authorized Partners who know our devices and can ensure engineers cross the finish line by shipping a certified product.

The post X-CUBE-STL: Supporting more STM32s and sharing resources to demystify functional safety appeared first on ELE Times.

Keysight Propels Pegatron 5G to Transform Power Efficiency for Open RAN

• 40% reduction in power consumption will support sustainability goals and reduce network operating costs

 

October 21, 2024

INDIA – Keysight Technologies, Inc. (NYSE: KEYS) has enabled Pegatron 5G to test and validate its Open Radio Unit (O-RU) advanced energy savings features using ETSI-specified energy measurement methods. This was achieved using Keysight’s Open Radio Access Network Architect Solutions (KORA), which ensures conformance, interoperability, performance, security, and energy efficiency validation for radio access network (RAN) testing.

With the majority of energy (76%) consumed in the RAN, improving efficiency is a strategic priority for operators. Therefore, testing energy consumption and its impact on network performance is critical. While advancements from 2G to 5G have delivered improvements, the increasing density of 5G networks to meet higher data demands will drive up consumption, impacting operating costs and sustainability goals. E-plane testing helps operators and manufacturers optimize networks to enhance efficiency in 5G and future network deployments.

By utilizing Keysight’s E-Plane ETSI Test Suites to evaluate the energy efficiency of its PR1450 O-RU solution, Pegatron 5G was able to achieve a 40% reduction in power consumption while adhering to O-RAN energy saving requirements and the ETSI ES 202 706-1 and ETSI TS 103 786 energy measurement methods. This will significantly reduce network operating costs and ensure compliance with environmental targets. The capability was demonstrated at the India Mobile Congress 2024.

David Hoelscher, Vice President of Business Development and Chief Product Officer of Pegatron 5G, said: “We are proud to be the first company in Taiwan to demonstrate O-RAN energy saving and e-plane support on our PR1450 O-RU. This achievement reflects our ongoing commitment to innovation and our ability to deliver advanced 5G solutions that benefit customers and the environment.”

Peng Cao, Vice President and General Manager of Keysight’s Wireless Test Group, said: “Keysight’s KORA solutions expedite the sustainable development and deployment of the O-RAN ecosystem, with a full range of industry-proven Open RAN energy lab and field tests solutions. By collaborating with partners like Pegatron 5G, Keysight is accelerating deployments, helping network operators reduce costs, and contributing to environmental sustainability.”

About Keysight Technologies

At Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and www.keysight.com.

 

Media Contacts

Keysight

 

North America PR Team
pdl-americas-keysight@keysight.com

 

Fusako Dohi

Asia

+81 42 660-2162

fusako_dohi@keysight.com

 

Jenny Gallacher

Europe

+44 (0) 7800 737 982

jenny.gallacher@keysight.com

 

Thejas A S

India

+91 98862 57535

thejas.as@2020msl.com

 

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GÖPEL electronic introduces the new Multi Line product family, an innovative platform of inspection systems that supports the entire manufacturing process. The centerpiece of this solution is a modular base system with a uniform and powerful software interface. This reduces training requirements, enables flexible employee scheduling, and optimizes the exchange of knowledge between production staff. This can be especially important when there may be a shortage of skilled workers.

The all-rounder can be configured for all inspection tasks throughout the entire manufacturing process: for solder paste inspection (SPI), for surface mount technology (SMT) and through-hole technology (THT) automated optical inspection (AOI), and also for conformal coat inspection (CCI). For THT printed circuit board assemblies (PCBA), Multi Line provides flexible transport options, with or without carriers, and all the necessary camera modules for this application. It also allows THT solder inspection, even during return on the optional lower transport conveyor. Thanks to 3D technology, solder joints can be inspected not only for soldering quality and for shorts, but also for solder volume and pin length, without flipping the PCBA.

The system’s configuration versatility also makes it suitable for use in the SMT process, where optional double-sided inspection offers the advantage of fully testing SMT assemblies without flipping the PCBA.

Furthermore, Multi Line is available as an SPI system for the inspection of solder paste deposits in regard to shape, height, area, bridges, volume, X/Y offset, and co-planarity. A closed-loop interface to the solder paste printer is available, and a link to PILOT Verify software makes fault analysis more efficient by displaying associated AOI, AXI, and SPI result data.

Multi Line CCI can automatically inspect protective coatings by making fluorescent coatings glow using UV LEDs of different wavelengths. With telecentric optics and a color camera, the system delivers high-contrast images and enables fast programming using CAD data and coating plans. As a special feature, the PCBA can be simultaneously inspect both top and bottom without turning, and, if necessary, can also be transported back to the beginning of the line using a lower level return conveyor.

Thanks to the modular design of the Multi Line platform, camera modules can be flexibly combined and, if necessary, retrofitted later for new applications in the manufacturing process.

With this comprehensive solution, GÖPEL electronic is utilizing its many years of experience in quality assurance and setting new standards in inspection technology for the electronics manufacturing process.

GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies as well as industrial and automotive electronics systems. GÖPEL electronic is comprised of four business units:

• Automotive Test Solutions
• Embedded JTAG Solutions
• Inspection Solutions AOI-AXI-SPI-IVS
• Industrial Function Test

The company is a global supplier with its own subsidiaries as well as distribution, and generated sales of approximately 40 million Euros in 2023 with 240 employees.

Further information: www.goepel.com/en

Press Contact:

GÖPEL electronic GmbH                                                    Tel.: +49 (0)3641-6896-779

Bettina Richter                                                                     Fax: +49 (0)3641-6896-944

Göschwitzer Straße 58/60                                                 E-Mail: presse@goepel.com

07745 Jena, Germany.                                                        Web: www.goepel.com

 

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                                                                                  News Release

Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification

QML Class V designation recognizes exceptional reliability and longevity for critical space missions

 

October 18, 2024 — Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s (Nasdaq: MCHP) Radiation-Tolerant (RT) RTG4 Field- Programmable Gate Arrays (FPGAs) with lead-free flip-chip bumps have earned the Qualified Manufacturers List (QML) Class V status. As designated by the Defense Logistics Agency (DLA), QML Class V is the highest level of qualification for space components and a necessary step to satisfy mission assurance requirements on the most critical space missions such as human-rated, deep space and national security programs. Because QML qualifications are standardized based on specific performance and quality requirements governed by the DLA, customers can streamline their design and certification processes by using QML-qualified products.

 

In 2018, RTG4 FPGAs became the first RT FPGAs offering more than 150,000 logic elements to achieve a QML Class V qualification, and this next-generation solution with lead-free flip-chip bumps is the first of its kind to achieve QML Class V status. In advanced flip-chip package construction, such as that used in the RTG4 FPGA, flip-chip bumps are utilized to connect the silicon die and the package substrate. Lead-free bump material will help extend the longevity of the product, which is critical to space missions.

 

“This is another milestone for our RTG4 FPGAs that will provide customers with added confidence in designing these devices in space flight systems, while allowing them to take advantage of our high-reliability, zero-configuration-upset and low-power consumption FPGAs,” said Bruce Weyer, corporate vice president for Microchip’s FPGA business unit. “For more than 60 years, Microchip solutions have powered space flight missions, and we are dedicated to product longevity and providing the highest quality solutions.”

 

RTG4 FPGAs are designed to bring high levels of density and performance to space applications, saving cost and engineering efforts through low power consumption and immunity to configuration upsets. Unlike SRAM-based FPGA alternatives, the programming technology used in RTG4 FPGAs provides low static power, which assists in managing thermal issues common in spacecraft. RTG4 FPGAs consume only a fraction of the total power compared to equivalent SRAM FPGAs, while exhibiting zero configuration upsets in radiation and thus requiring no mitigation, reducing engineering expenses and total system costs.

 

To achieve QML Class V qualification, the RTG4 FPGA with lead-free bump has undergone extensive reliability testing, enduring up to 2,000 thermal cycles from −65°C to 150°C junction temperature. The lead-free flip-chip bump interface connections passed MIL-PRF-38535 inspection criteria and exhibited no signs of tin whiskers. The flip-chip bump is inside the FPGA package, so there is no impact on the user’s design, reflow profile, thermal management or board assembly flow when converting to lead-free bump RTG4 FPGAs.

 

Microchip boasts one of the industry’s most comprehensive space product portfolios of radiation-hardened and RT solutions that include QML Class Q RT PolarFire® FPGAs and sub-QML FPGAs that bridge the gap between traditional Qualified Manufacturers List (QML) components and Commercial Off-The-Shelf (COTS) components. For a comprehensive listing of Microchip FPGA and mixed-signal part numbers alongside their corresponding Defense Logistics Agency (DLA) drawing numbers, please refer to the DLA Cross Reference Guide.

 

Development Tools

The RTG4 FPGAs are supported by development kits, mechanical samples and daisy chain packages for board validation and testing. Libero® SoC Design Suite enables RTL entry through programming and includes a rich IP library, complete reference designs and development kits.

 

Availability

For additional information or to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

 

Resources

High-res images available through Flickr (feel free to publish):

• Application Image: https://www.flickr.com/photos/microchiptechnology/54037604837/sizes/l/

 

About Microchip:

Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control and processing solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve approximately 123,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.

###

Note: The Microchip name and logo, the Microchip logo, Libero and PolarFire are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks are the property of their respective companies.

 

Editorial Contact:

Samheetha Ravi Bhat

samheetha@prhub.com

9731054124

The post Press release of Microchip Technology about how RTG4™ FPGAs with lead-free flip-chip bumps achieve the highest space qualification appeared first on ELE Times.

Rohde & Schwarz has successfully achieved full coverage of Skylo’s comprehensive test plan for devices operating in Narrowband-IoT in Non-Terrestrial Networks (NB-NTN). This milestone also enables SMS services over NB-NTN, paving the way for unlimited connectivity on smartphones, wearables, and IoT devices.

Munich, October 17, 2024 — Rohde & Schwarz and Skylo Technologies have verified and validated all of the test cases defined in Skylo’s network operator acceptance criteria, including newly added test cases for SMS over NB-NTN, using the advanced CMW500 wideband radio communication tester. This marks a significant milestone in device certification and paves the way for a successful adoption of NB-NTN technology.

Skylo is a global NTN service provider, whose network takes advantage of dedicated satellite spectrum across various partner constellations, allowing smartphone and IoT cellular devices to connect directly over existing satellites. This technology facilitates seamless communication even in remote areas lacking traditional network coverage. Skylo’s certification process involves rigorous testing and evaluation to ensure that devices meet the stringent performance and reliability standards.

The successful validation of SMS over NB-NTN marks a significant step in bringing satellite connectivity to consumer devices. As a consequence, users of smartphones and wearables can rely on messaging services regardless of their location, which will enhance their safety and communication capabilities in areas without terrestrial network access.

For more information NTN test solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/_256719.html

Proposal for caption: Rohde & Schwarz achieves full coverage of Skylo’s test plan for NB-NTN devices using the advanced CMW500

Press contacts:

Europe (headquarters): Christian Mokry (phone: +49 89 4129 13052; email: press@rohde-schwarz.com)

North America: Dominique Loberg (phone: +1 503 523-7951; email: Dominique.Loberg@rsa.rohde-schwarz.com)

Asia Pacific: Sze Ming Ng (phone: +603 5569 0011; email: press.apac@rohde-schwarz.com)

Contact for readers:

www.rohde-schwarz.com/contact

 

Rohde & Schwarz

Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company’s leading-edge products and solutions empower industrial, regulatory and government customers to attain technological and digital sovereignty. The privately owned, Munich based company can act independently, long-term and sustainably. Rohde & Schwarz generated net revenue of EUR 2.78 billion in the 2022/2023 fiscal year (July to June). On June 30, 2023, Rohde & Schwarz had around 13,800 employees worldwide.

R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.

All press releases, including photos for downloading, are available on the internet at www.press.rohde-schwarz.com.

The post Press release of Rohde & Schwarz about achieving its full coverage of Skylo’s test plan for NB-NTN devices, enabling SMS services appeared first on ELE Times.

Rohde & Schwarz has successfully achieved full coverage of Skylo’s comprehensive test plan for devices operating in Narrowband-IoT in Non-Terrestrial Networks (NB-NTN). This milestone also enables SMS services over NB-NTN, paving the way for unlimited connectivity on smartphones, wearables, and IoT devices.

Munich, October 17, 2024 — Rohde & Schwarz and Skylo Technologies have verified and validated all of the test cases defined in Skylo’s network operator acceptance criteria, including newly added test cases for SMS over NB-NTN, using the advanced CMW500 wideband radio communication tester. This marks a significant milestone in device certification and paves the way for a successful adoption of NB-NTN technology.

Skylo is a global NTN service provider, whose network takes advantage of dedicated satellite spectrum across various partner constellations, allowing smartphone and IoT cellular devices to connect directly over existing satellites. This technology facilitates seamless communication even in remote areas lacking traditional network coverage. Skylo’s certification process involves rigorous testing and evaluation to ensure that devices meet the stringent performance and reliability standards.

The successful validation of SMS over NB-NTN marks a significant step in bringing satellite connectivity to consumer devices. As a consequence, users of smartphones and wearables can rely on messaging services regardless of their location, which will enhance their safety and communication capabilities in areas without terrestrial network access.

For more information NTN test solutions from Rohde & Schwarz, visit: https://www.rohde-schwarz.com/_256719.html

Proposal for caption: Rohde & Schwarz achieves full coverage of Skylo’s test plan for NB-NTN devices using the advanced CMW500

Press contacts:

Europe (headquarters): Christian Mokry (phone: +49 89 4129 13052; email: press@rohde-schwarz.com)

North America: Dominique Loberg (phone: +1 503 523-7951; email: Dominique.Loberg@rsa.rohde-schwarz.com)

Asia Pacific: Sze Ming Ng (phone: +603 5569 0011; email: press.apac@rohde-schwarz.com)

Contact for readers:

www.rohde-schwarz.com/contact

 

Rohde & Schwarz

Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For 90 years, the global technology group has pushed technical boundaries with developments in cutting-edge technologies. The company’s leading-edge products and solutions empower industrial, regulatory and government customers to attain technological and digital sovereignty. The privately owned, Munich based company can act independently, long-term and sustainably. Rohde & Schwarz generated net revenue of EUR 2.78 billion in the 2022/2023 fiscal year (July to June). On June 30, 2023, Rohde & Schwarz had around 13,800 employees worldwide.

R&S® is a registered trademark of Rohde & Schwarz GmbH & Co. KG.

All press releases, including photos for downloading, are available on the internet at www.press.rohde-schwarz.com.

The post Press release of Rohde & Schwarz about achieving its full coverage of Skylo’s test plan for NB-NTN devices appeared first on ELE Times.

Media Alert

 

Vicor releases highest density automotive-grade power modules, enabling 48V power systems for electric vehicles

Andover, Mass., October 16, 2024 – Vicor has released three automotive-grade power modules for 48V EV systems which deliver industry-leading power density and support automotive OEM and tier one production in 2025. The BCM6135, DCM3735 and PRM3735 use AEC-Q100 certified Vicor-designed ICs and have completed the PPAP process with automotive customers.

“Vicor has set a new standard for power density in the automotive industry with these scalable and flexible miniature power modules,” said Patrick Wadden, VP of the Vicor Automotive business unit. “Our high-performance converters enable new possibilities for automotive manufacturers to reduce the size and weight of power systems throughout the vehicle.”

The BCM6135 is a 98% efficient 2.5kW BCM® bus converter which converts 800V from the traction battery to 48V to provide a safety extra-low voltage (SELV) power supply for the vehicle. The BCM6135 internally provides the isolation between high voltage and low voltage which creates a large reduction the space required for the DC-DC conversion. The BCM6135’s power density of 158kW/L allows EV system designers to reduce size of the primary DC-DC converter and reduce vehicle weight. The bidirectional rapid current transient response rate of 8 mega amps per second allows the BCM6135 to replace a 25lb 48V battery — by serving as a virtual 48V battery in the xEV vehicle and delivering additional cost and weight savings.

The DCM3735 2.0kW DCM DC-DC converter transforms an unregulated 48V input into a regulated 12V output. The DCM3735 has a wide input range that is compatible with a variety of automotive applications because the output can be trimmed within a range of 8 – 16V. The DCM3735 has a power density of 300kW/L making it an attractive choice for architectures bridging a 48V distribution to 12V subsystems in zonal ECU applications.

The PRM3735 is a 2.5kW PRM regulator for 48V power that is 99.2% efficient. Its small footprint and 260kW/L power density frees up packaging space and reduces the overall volume and weight of the DC-DC power supply. It is best suited to support regulated 48V loads that are implemented in new vehicle architectures.

The newly released Vicor modules can be arranged in over 300 configurations, offering extreme flexibility and scalability to support innovation for a variety of vehicle subsystems. Further, as the market shifts from 12V to 48V Zonal Architecture, these products are highly efficient in converting to and from 48V. All three modules can be arrayed easily to increase power supply levels, and they have automatic power sharing for optimum performance in an array.  These modules solve complex challenges with 800V, 400V, 48V and 12V systems.

“Our power modules make it easy to convert from the primary battery (800V or 400V) to 48V and down to load,” said Wadden. “They are very versatile, and our customers are using the modules to improve efficiency while also removing size and weight from their power systems.”

Vicor power modules are improving power delivery networks throughout the vehicle in innovative ways:

• Active suspension comes of age in EVs
  Power needs of active suspension system are too high to be met with 12V power. Switching to a 48V bus and converting down with the bidirectional BCM6135 is an efficient way to deliver high performance. This application also capitalizes on the BCM6135’s high slew rate as the active suspension is a regenerative power load, which requires immediate current flow reversal to pass regenerated power back to the battery.
• Deleting or reducing the low-voltage battery

The industry-leading slew rate of the BCM6135 presents an opportunity to replace a 48V battery — with the BCM serving as a virtual 48V battery in the xEV vehicle, delivering cost and weight savings. Since the BCM6135 can switch from zero current to full current at 8.0MA/s, it can step down the traction battery’s 800 to 48V and power a load as fast as drawing the power from an auxiliary 48V battery. No other DC-DC converter can match this speed and enables customers to reduce vehicle weight by up to 25kg while reducing vehicle costs by up to $100.

• 48V zonal architecture adoption is on every roadmap
  The new power modules can be easily configured to make this transition easier. The DCM3735 is used in conjunction with BCM3735 to create a regulated 12V power supply off the BCM6135 48V output. When used as a part of the 48V zonal architecture, the DCM3735 can be mounted remotely to create a local 12V supply in a vehicle zone, for example on the right hand side. This application method allows the PDN designer to effectively support 12V loads while achieving up to 90% of the cost and weight savings that come from transitioning to a 48V bus.
• Precharging prevents current surges and saves weight

Precharging is a necessary step of the start-up process. It prevents current surges at battery engagement that will damage the loads (such as pumps and compressors). Currently this is done using high voltage contactors and resistors, which add 1kg and over $50 in cost. The alternative is to use BCM6135 and a PRM3735 as the main DC-DC converters and one of the low-voltage batteries installed in the vehicle. The BCM6135 can boost the low-voltage battery power up to high voltage and achieve the needed precharge, eliminating the legacy precharge contactor and power resistor.

The flexibility of the power modules enable a host of automotive applications to be powered.  More importantly, they deliver on the promise of 48V adoption. Whether converting the high voltage traction battery to 48V, delivering point-of-load power from a 48V bus, or enabling legacy 12V sub-systems to live in new 48V zonal architectures, Vicor’s high performance, automotive grade power modules deliver the highest power density while reducing power loss and simplifying designs.

 

Learn more about the three new automotive-grade Vicor power modules

 

About Vicor

Vicor is the leader in high-performance power modules, enabling customer innovation with easy-to-deploy modular power system solutions for power delivery networks that provide the highest density and efficiency from source to point-of-load. We continuously advance the density, efficiency and power delivery capabilities of our power modules by staying on the forefront of distribution architectures, conversion topologies and packaging technology. Vicor serves customers in high-performance computing, industrial equipment, automotive and aerospace and defense markets. With over 40 years of experience in designing, developing and manufacturing power modules for demanding markets, the Vicor patented, high-frequency DC-DC power conversion technology is ideally suited for the automotive market.

 

www.vicorpower.com

 

Vicor is a registered trademark of Vicor Corporation.

 

For more information contact:

 

Stephen Germino,

sgermino@vicr.com

978 749-8243

The post Press release of Vicor about the highest-density automotive-grade power modules appeared first on ELE Times.

The answers to the following questions shall bring forth few pertinent facts about Auto EV India Expo 2024:

1. With EV sales surging by 35% in 2023, how does Auto EV India 2024 plan to showcase the latest trends driving this rapid market growth?

Answer: Auto EV India 2024 shall bring to fore all companies dealing with latest innovations and advancements in the field of electric vehicle and automotive technology. All of them shall be brought under one roof. They shall exhibit all their latest advancements and products in the exhibition hall of our event. There shall be a free flow of information. This shall enable an un-interrupted exchange of ideas. It shall be a great opportunity to liaison with many industry stalwarts.

 

 

2. As fast-charging infrastructure becomes more widespread, what solutions and collaborations do you expect to be highlighted at the 3rdedition of the Expo?

Answer: All major companies dealing with fast-charging solutions shall exhibit their products and services at Auto EV India 2024. For instance, companies installing charging stations and using over-the-air technology for charging electric vehicles.

 

 

3. How is the Expo promoting collaboration among OEMs, Tier 1 suppliers, and tech innovators to enhance India’s global EV position?

Answer: In collaboration, the original equipment manufacturers and Tier 1 suppliers develop core software solutions. Such as operating systems, middleware, and applications. Besides, Tier 1 suppliers develop specific software solutions. For instance, connectivity, ADAS, in-vehicle experiences, and offering software-as-a-service (SaaS) solutions. Their partnership is based on a shift from hardware-centric partnerships to joint software development.

The Auto EV Expo 2024 is leveraging this domain by bringing together concerned companies on one forum for discussion during the conference and exhibition of their products and services to the concerned stakeholders during the exhibition.

 

 

4. How is the expo positioning itself in the realm of advancing hydrogen fuel cell technology as a key alternative in the automotive sector?

Answer: Traditionally, the automotive industry used to use internal combustion engine. Now, it is being replaced by hydrogen fuel cell. The benefit of using the latter is that it is based completely on renewable source of energy. Besides, it is highly efficient in generating energy. Also, it can be recharged in a very short span of time.

Auto EV Expo 2024 shall endeavour to bring forth all latest advancements in the field of utilising hydrogen fuel cells for a discussion during the conference. And later, for exhibition by all concerned companies during the exhibition. It would be an excellent opportunity to liaison with the technical, marketing, and sales team of concerned companies.

 

 

5. How is the government initiatives like the PLI Scheme and ACC Battery Storage impacting India’s EV future, and how will Auto EV India 2024 contribute in this scenario?

Answer: The Government of India’s Production Linked Incentive (PLI) scheme for Advanced Chemistry Cell (ACC) Battery Storage aims to scale up the production of electric vehicle’s batteries to the tune of 95 GWh. It was approved with an outlay of ₹ 18, 000 crore. It would convert India into a global manufacturing hub. This would lead to reduction in India’s import dependence.

Auto EV India 2024 will bring together all major firms driving benefit under the aforesaid scheme for their display in the exhibition. This would enable them to interact with various industry stakeholders and prospective clients.

The post Few pertinent facts about Auto EV India Expo 2024 appeared first on ELE Times.

In the ever-evolving automotive industry, users demand a seamless Human-Machine-Interface (HMI) experience for their infotainment application. Customers are looking for large touchscreens with advanced features and are venturing into OLED and Micro OLED as their choice of display. OLED is seen as the future of smart mobility applications, enabling flexible design and free-form shapes. Best customer experience coupled with functional safety standards must go hand in hand to provide a seamless journey for the end user. To address these challenges, Infineon Technologies AG introduces the Automotive PSoC Multitouch GEN8XL (IAAT818X), a new generation of touch controllers. Designed for OLED and micro-LED displays up to 24 inches, the touch controller delivers performance and frame rates that meet today’s demands. It ensures a seamless user experience on various touch-based interfaces, such as touchscreens, touchpads, and sliders, while meeting the rigorous automotive standards for electromagnetic compatibility (EMC IEC 61967), including chip-level emission, conducted emission (IEC 62132), and radiated emission (ISO 11452).

The PSoC Automotive Multitouch GEN8XL is AEC-Q100 qualified as well as Auto-SPICE level 3 and ASIL-B compliant. It is offered in two different packages, 128-pin and 100-pin TQFP. The touch controller operates reliably despite water droplets, condensation or sweat and enables users to perform touch operations with gloves up to 4mm. The touch controller’s design allows for scalability to accommodate larger screen sizes, with the possibility of supporting screens up to 55 inches via the implementation of multi-chip architectures. It also supports advanced add-on features like rotary dial and built-in haptics.

Infineon offers a comprehensive support package, including application firmware, design guidance for sensor and Flexible Printed Circuit (FPC), as well as a touch tuning host emulator (TTHE) tuning, to facilitate seamless integration and production.

The post New Automotive PSoCTM Multitouch controller supports OLED and ultra-large screens with superior touch performance appeared first on ELE Times.