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The VelocityDRIVE Software Platform enables switch-management communication based on standardized YANG models

Driven by the need for higher bandwidth, advanced features, enhanced security and standardization, automotive OEMs are transitioning to Ethernet solutions. Automotive Ethernet provides the necessary infrastructure to support Software-Defined Networking by centralizing control, enabling flexible configurations and real-time data transfer. To provide OEMs with comprehensive Ethernet solutions, Microchip Technology today announces its new family of LAN969x Multi-Gigabit Ethernet Switches and VelocityDRIVE Software Platform (SP), which is a turnkey Ethernet switch software solution and Configuration Tool (CT) based on standardized YANG models.

The combination of LAN969x devices and VelocityDRIVE SP, the industry’s first integration of CORECONF YANG, offers an innovative industry-standard network configuration solution. The CORECONF YANG standard aims to empower designers by separating software development from the hardware network layer. This reduces complexity and costs and accelerates the time to market.

The high-performance LAN969x Ethernet switches are powered by a 1 GHz single-core Arm Cortex-A53 CPU and feature multi-gigabit capabilities with scalable bandwidths from 46 Gbps to 102 Gbps. Advanced Time-Sensitive Networking (TSN) is designed to meet precise timing and reliability requirements of applications like Advanced Driver Assistance Systems (ADAS).

“The introduction of the VelocityDRIVE Software Platform provides our automotive customers with a turnkey software switch solution and configuration tool to easily manage in-vehicle Ethernet networking,” said Charlie Forni, vice president of Microchip’s USB and networking group. “The use of the standards-based YANG configuration protocol enables software to be developed independently and reused across multi-vendor Ethernet switches.”

The LAN969x switch family is designed to support ASIL B Functional Safety and AEC-Q100 Automotive Qualification standards, offering high reliability and safety for automotive applications. The devices are optimized for systems with a small embedded-memory footprint and feature secure and fast boot capabilities using integrated ECC SRAM for code execution, which eliminates the need for expensive external DDR memory.

As in-vehicle networking continues to increase, software solutions like VelocityDRIVE SP are necessary for customers to configure and manage their networking systems. The LAN969x switch family joins Microchip’s portfolio of automotive Ethernet solutions, which includes 10 Mbps to 1000 Mbps PHY transceivers, controllers, switches and endpoints. For more information about Microchip’s automotive Ethernet solutions, visit the web page.

Development Tools

The LAN969x devices are supported by the LAN9692 VelocityDRIVE Evaluation Board and VelocityDRIVE Configuration Tool (CT).

Pricing and Availability

The LAN9691, LAN9692 and LAN9693 are available in production quantities. The VelocityDRIVE Software Platform is available to download. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

Resources

High-res images available through Flickr or editorial contact (feel free to publish):

• Application image: flickr.com/photos/microchiptechnology/54036155085/sizes/l

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Nuvoton Technology Corporation, a leading microcontroller platform provider with years of extensive industry experience, is set to host its first-ever microcontroller/microprocessor roadshow in Southeast Asia. Building on its extensive experience and recent expansion into emerging markets, Nuvoton has strengthened regional support and optimized its global supply chain. The roadshow will take place in Singapore on November 6 and in Hanoi, Vietnam, on November 8, where we will showcase Nuvoton’s latest MCU/MPU platforms, solutions, and ecosystems to local experts and industry professionals.

Nuvoton will present comprehensive topics covering the NuMicro MCU platforms with 8051, Arm Cortex-M23/ M4/ A35, and Arm9 cores. Key products, including the MG51, ML51, M253, M460, M480, and MA35 series, are designed for various IoT, smart homes, industrial control, and HMI applications.

Additionally, Nuvoton will introduce audio chips, audio amplifiers, HMI solutions, battery management systems, and smart industrial IoT. To streamline development, the NuDeveloper ecosystem offers evaluation boards, debuggers, and software tools, supporting developers from prototyping to production, ensuring a smooth and efficient design process.

Attendees can expect live demonstrations of HMI solutions, lighting control, touch key solutions, and advanced audio designs.

This event aims to strengthen ties with Southeast Asia’s tech community and explore future collaboration opportunities. We welcome industry professionals to join us and participate in these insightful discussions and demonstrations.

For more details about the Nuvoton Technology 2024 Microcontroller Innovations Roadshow, please visit: Nuvoton Technology 2024 – Microcontroller Innovations Roadshow (digitimes.com.tw)

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New 871 Series Fuse provides 150A and 200A ratings in compact SMD form factor,
simplifying designs and saving PCB space

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, today announced the launch of the 871 Series Ultra-High Amperage SMD Fuse. This innovative new series supplements the 881 Series by offering 150A and 200A fuse ratings, a significant upgrade from the 881 Series’ 125A maximum rating. The 871 Fuse Series provides a single-fuse, surface-mounted solution for electronics designers, eliminating the need for parallel fusing configurations.

The 871 Series High-Current SMD Fuse is the first and only small-sized SMD fuse with ultra-high ratings of 150A and 200A, previously only available in much larger through-hole fuses. This advancement addresses the challenges of higher power requirements and limited fuse amperage ratings, offering a streamlined solution for modern electronic designs.

Product Features and Benefits:

• High Amperage Ratings: Available in 150A and 200A, meeting higher power requirements with a single fuse.
• Space-Saving Design: Provides a smaller-sized fuse solution, saving PCB space compared to larger through-hole legacy fuses.
• Simplified Design: Eliminates the need for parallel fusing, reducing the number of components and simplifying the bill of materials (BOM).
• Optimized Efficiency: Enables electronics engineers to optimize their designs for smaller, more space-efficient products.

“The 871 Series Fuse helps design teams simplify their processing and bill of materials by eliminating the need for two or more fuse components, reducing it down to just one fuse,” said Daniel Wang, Senior Director of Product Management. “Additionally, these SMD fuses save board space, allowing electronics engineers to optimize their designs further to be smaller and more space efficient.”

The 871 Series Fuse is ideally suited for high-power applications in various markets, including:

• Data Centers: Providing reliable protection for critical infrastructure.
• Network Infrastructure: Ensuring robust performance in demanding environments.

• Servers/Racks: Enhancing power management and efficiency in server and rack systems.

By offering a high amperage rating in a compact form factor, the 871 Series Fuse enables designers to meet their power requirements while reducing the number of components needed and the overall size of their end-product. This makes it an ideal solution for electronics engineers looking to simplify their designs and save valuable PCB space.

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Technology drives the development of new advancements in the automotive and electric vehicle industry. As the world is today witnessing and will witness the development of new technologies in the near-future, it shall lead to the improvement and further development in the product and design of the automotive and electric vehicle industry.

The following are few future technologies that shall lead the development of automotive and electric vehicle’s technologies:

First, OTA (over the air) charging of electric vehicles. The OTA (over the air) technology enables charging of an electric vehicle’s battery without any need for physical contact while recharging. However, this OTA technology is not available at a mass-scale today.

Hence, when the OTA (over the air) technology would be available on a mass-scale, it would lead to the development of many recharge stations in India. This would certainly increase the number of electric vehicles being used in our country. Besides, it would ease their mobility in India.

Second, solid state batteries. The lithium-ion batteries have led to a revolution in the electric vehicle segment. Traversing on the same trajectory, the future is expected to be even more revolutionary. It is so because more efficient solid-state batteries would be available on a large scale.

A solid-state battery is an electrical battery that uses solid electrolyte.

The benefit of using solid-state batteries are as follows:

First, it provides a much higher energy density than lithium-ion batteries.

Second, it provides higher vehicle range and a significant decrease in the time required to recharge the battery.

Third, grid of driverless cars. The future electric cars would be driven driverless. They would ply in a grid of driverless cars. They would be controlled with real time access to data pertaining to traffic, lane, GPS, and other parameters. The data pertaining to such parameters would be available on a real-time basis. Using these parameters, the automobile industry would be further developed.

These driverless cars have radar sensors, machine learning systems, and complex algorithms to safely operate and navigate the vehicle.

Fourth, augmented reality. Augmented reality (AR) is an interactive experience that blends digital information with the real world.

The cars that possess augmented reality (AR) technology, necessarily use a computer within the dashboard. This gives the driver real time information about a vehicle’s surroundings. For instance, speed, direction of movement, and video footage of the area adjacent to the vehicle.

Examples of car manufacturers that use augmented reality- BMW, Jaguar and Mazda use augmented reality in their models.

By 2025, the global automotive augmented reality and virtual reality is estimated to reach about $673 billion.

Fifth, heads-up display windshields. The heads-up display windshield technology projects images from a vehicle’s dashboard on the vehicle’s windshield. This helps the driver focus better on driving and be aware of all data from the dashboard by their projection on the windshield.

Sixth, connected cars. A connected car is a car that can communicate with the outside system. This enables it to share internet access and data with other devices, both inside and outside of the car.

For instance, use of GPS and 5G technology by a car.

Seventh, regenerative braking. This technology enables a car to store kinetic energy captured during deceleration and braking as electric energy within the battery of the car. It is later used to power the electric motor.

Eighth, mobility-as-a-service (MaaS). Mobility-as-a-Service (MaaS) means integration of all the modes of transport over a single interface. This provides end-to-end transportation solutions to users. As cities will become more modern in the future, MaaS is the only solution to the traffic woes.

Ninth, advanced driver assistance systems (ADAS). The advanced driver assistance systems (ADAS) makes the automobile capable of autonomous emergency braking, driver monitoring systems, lane departure warning, etc. This technology makes an automobile safer and reliant.

Tenth, 3D printing. 3D printing enables automotive parts manufacturers to produce complex parts with ease and much faster pace. Besides, the produced parts are light-weight. This makes the manufacturing process more efficient and economical than the traditional manufacturing process. Due to this, the spare parts would be available at a much cheaper rate and at a mass-scale.

Eleventh, smart grid solutions. A smart grid integrates information and communication technology with the electrical technology. It supplies power to consumer appliances through a smart network.

The following are a few benefits of smart grid solutions:

First, quicker restoration of electricity after power lapse.

Second, more efficient transmission of electricity.

Third, lowering of the cost of operation. Hence, the cost of power for consumers would be low. This provides an economic edge.

Fourth, reduction in peak demand.

Five, increase in the security of the electrical power generation system.

Twelfth, composite materials. Any substance that has been engineered by combining two or more distinct materials so that the engineered material has complementary properties. This means it has enhanced and unique characteristics. Hence, it is referred to as a composite material.

Few common examples of the composite materials are as follows:

First, carbon fibre-reinforced plastics,

Second, fiberglass-reinforced composites, and

Third, Kevlar-reinforced materials.

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is exhibiting at Industrial Transformation Asia Pacific (ITAP 2024, Booth 3C07) on 14-16 October.

The booth will showcase more than 10 demos from ST and its ecosystem partners in key industrial markets addressing edge AI use-cases for industrial automation and IoT segments, sensors for smart buildings and machinery condition monitoring, an innovative use case of NFC-powered Electronic Circuit Board, Motor Control & Servo Drives with IO Link, STM32 & Graphics solutions, wireless-connectivity solutions with Matter, and power-management solutions with STSPIN.

NFC-powered Electronic Circuit Board (ECB): The NFC-powered ECB is an innovative solution from Deng Kai Sdn Bhd that incorporates multiple ST components, including an ST25R NFC reader and an ST25DV dynamic tag, together with a low-power STM32G0 microcontroller (MCU) and an LDO voltage regulator. It integrates energy harvesting through NFC technology, a first in the industry, using an antenna to capture the electromagnetic energy from an active NFC reader and converting it into electrical power. This technology offers convenience, sustainability, and cost-effectiveness for designs with low power consumption, eliminating the need for batteries.

Multi-pose estimation AI demo: ST provides X-Linux-AI open-source software ecosystem free of charge to support multiple different edge AI use cases in industrial automation and IoT segments. The demo is built around ST’s 2nd-generation STM32MP2 microprocessor, which embeds secured and enhanced peripherals for connected applications.

Servo Drives Orchestra: This showstopper features a comprehensive motor-control demo comprising of 8 motor-control modules, which use 4 different reference designs with loads ranging from 500 W to 22 kW. Each of the motors controls a rope that pulls a load and demonstrates precision position control, in a harmonic movement coordinated simultaneously with the others. Each motor drive executes the commands sent by I/O link from the podium where an HMI interface allows to select the mode, and each of them collects temperature and vibration data, executes condition-monitoring algorithms, and wirelessly sends data to a Baidu cloud, which then informs back the system and its HMI to reflect how the systems behave and save power, among other things.

STSPIN for Motor Control: The EVSPIN32G4-DUAL is a demonstration board based on the STSPIN32G4 and STDRIVE101 for applications using two three-phase brushless motors. The STSPIN32G4 is a system-in-package integrating, in a 9×9 mm VFQFPN package, a triple high-performance half-bridge gate driver with a rich set of programmable features and one mixed-signal STM32G431 microcontroller. The STDRIVE101 is a triple half-bridge gate driver in a compact 4×4 VFQPN package featuring 600 mA current capability and embedded protection.

Sensors: ST’s latest AI sensor devices for orientation and gesture-tracking (the LSM6DSO16IS for consumer and the ISM330IS for industrial) feature the Intelligent Sensor Processing Unit (ISPU) with an embedded DSP programable core. Users can port C code into the ISPU, enabling essential functions like Fast Fourier Transform (FFT) and AI solutions with tiny neural networks. This technology enhances the ability to monitor conditions and gestures effectively. The new generation of IMU sensors (the LSM6DSV for consumer) and the ISM330BX for industrial) delivers embedded sensor fusion, which processes motion data from accelerometers, gyroscopes, and external magnetometers. This provides quaternion output to track the orientation of an object in 3D space. The sensor-fusion library is also available in the STM32 library list, enhancing predictive tracking and gesture capabilities.

STM32 for Industrial Applications:

A wide variety of STM32 solutions will be on display including:

• Graphics solutions: From high-performance STM32H7 MCUs based on the 32-bit Arm Cortex-M7 core and running at up to 600 MHz, to ultra-low-power STM32U5 series offering advanced power-saving devices to meet the most demanding power/performance requirements for smart applications, including wearables, HMI, personal medical devices, home automation, and industrial sensors.
• Sustainable technology: The STM32U0 is the latest addition to the STM32 ultra-low power device range: an energy-conscious microcontroller that can reduce power consumption by up to 50% compared to previous product generations. This enables less frequent battery replacements, minimizes the impact of discarded batteries, and allows more designs to go battery free, running solely from an energy-harvesting system such as a small photovoltaic cell.
• Wireless Connectivity: ST portfolio covers all Matter device types, for its seamless interaction between connected smart homes and smart building devices across different IP technologies. Based on the STM32WB0 microcontroller, the Electronic Shelf Label (ESL) demo shows how to improve operational efficiency.

Fireside chat

ST is participating in this year’s Industrial Transformation Forum to share how we are integrating AI in our manufacturing operations to make factories smarter, propelling manufacturing into a new era of efficiency, flexibility, and sustainability.

ST looks forward to contributing to important conversations and advancing the development of smart factories.

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• Infineon hosts first-ever Supplier Sustainability Summit to intensify collaboration for sustainable action and reduction of CO2 emissions in line with the Science Based Target initiative (SBTi)
• Infineon is working with more than 100 suppliers engaging them to define their own science-based targets and implement appropriate reduction measures
• Applied Materials Inc., Sumco Corporation, and iwis are recognized foroutstanding environmental advancements with Infineon’s Green Award

Infineon Technologies AG, is intensifying its collaboration with suppliers to further reduce CO2 emissions along the whole supply chain. Infineon hosted its first ever Supplier Sustainability Summit to further stimulate collaboration and incentivize and support suppliers to accelerate their decarbonization journeys. The virtual event brought together about 100 top semiconductor industry suppliers.

“In order to meet our ambitious targets, we need you, our suppliers,” said Elke Reichart, Member of the Board and Chief Digital and Sustainability Officer at Infineon, during her welcome message. “Infineon’s scope 3 emissions make up the lion’s share of our footprint, especially the materials we source from our suppliers. Therefore, we very much look forward to joining forces with you. Together, we can stimulate and implement decarbonization strategies even better.”

Collaboration with suppliers is a fundamental part of Infineon’s overall sustainability strategy. The company has already made significant progress on its way to reaching climate neutrality by 2030; since 2019 Infineon has halved its CO2 emissions (scope 1 and 2) while doubling revenue at the same time. In December 2023, Infineon added a commitment to setting a science-based target that includes the supply chain (scope 3). The procurement team is actively working with over 100 suppliers, engaging them to define their own science- based targets and implement appropriate reduction measures.

The Supplier Sustainability Summit was an excellent opportunity for Infineon to share learnings from its own climate strategy and journey and to facilitate exchange of best practices among suppliers. For instance, experts from the Infineon electricity procurement team gave insights from their hands-on experience in achieving 100 percent renewable electricity by 2025; whereas two suppliers shared their expertise in effectively setting science-based targets. The topic was deepened in a panel discussion with Infineon leaders and an expert from the CDP (formerly the Carbon Disclosure Project) that offered further practical advice to attendees.

Infineon’s Green Award recognizes and honors suppliers who demonstrated outstanding environmental commitment and advancements throughout the past year. The “Best Performance Award” went to Applied Materials Inc. for its ambitious climate strategy, including a 1.5°C science-based target and the company’s innovative “Xchange” program. As part of the program Infineon is directly collaborating with Applied Materials to increase resource efficiency and reduce emissions. The program enables take-back and refurbishment of spare parts for complex semiconductor equipment, thereby building on the circular economy to create environmental and business benefits for both parties.

The “Best Improvement Award” winner is Sumco Corporation, that has made remarkable progress in environmental sustainability throughout the past year. The Japan-based company is the first silicon wafer supplier to make a public commitment to setting a science- based target. Following discussions at the top leadership level, Sumco acted at an impressive speed, accelerating existing carbon reduction targets and expanding renewable electricity sourcing.

In the category of companies with less than one billion euros revenue, the “Best Improvement Award” went to iwis SE & Co. KG. The Munich-based, family-owned company serves as a great example to many with its ambitious “Zero Carbon 2040 program” and science-based target commitment. Infineon recognizes the proactive approach towards improving the environmental impact of operations and supply chain and the integration of climate targets in the environmental management system at the sites.

“We would like to applaud the winners of our Green Awards: Applied Materials, Sumco and iwis for stepping up and taking responsibility for environmental sustainability and performance,” said Angelique van der Burg, Chief Procurement Officer at Infineon and host of the day. “We believe that this performance will motivate our whole supplier base to raise the bar higher and follow their example. Now let’s make the best practice a standard practice.”

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“As chips are pervading all segments of human life, owing to the possibility of chip-backdoors, the threats of espionage, sabotage, and the concerns to national security are haunting all of humanity”.

The threat of chip-based backdoors is raising eyebrows across the globe. Today, since chips are an integral and inevitable component of any electronic device, presence of any chip-backdoor shall have widespread consequences. Both in its expanse across the countries and myriad sectors.

Given the pervading nature of chips in electronic systems, the gravity and the extent of the problem of chip-backdoors can only be speculated. Indeed, any such speculation is alarming!

It is so because the presence of any chip-based backdoor has the potential threat of granting clandestine access to information about the functioning of any electronic system. Whether it be data centres, servers, devices used in complex and critical installations such as a nuclear-reactors, space-faring vehicles, communication devices, military assets such as warships, fighter jets, etc. No such system is immune from this looming threat.

As chips are now being used for many applications that are essential and critical for national security, any chip-backdoor is a threat to any country’s national security. It is not only an infringement of right to privacy, but also poses a grave threat to the security of all devices used by humanity in this digital age.

No wonder the threat of chip-backdoor is sending shivers down the spine of the scientific community and senior military officials!

Meaning of chip backdoor

A backdoor provides clandestine and unauthorised access to a system. It does so by bypassing the legitimate authentication to access a system.

Similarly, a chip-backdoor provides a backdoor to an electronic system by means of a semi-conductor chip. It is a subset of hardware backdoor, which provides backdoor to any hardware.

If a chip-backdoor succeeds in providing backdoor access to a chip in an electronic system, it further enables unauthorised control over the system. It can even maim or cripple a system. If it so happens, it will endanger the performance of any electronic system. Hence, it may render any system’s performance at risk.

Major effects of chip-backdoors on a system

Since a chip-backdoor provides unauthorized access to a system, it gives rise to three major effects on a system. They are as follows:

First, the collection of data about the performance of a system. This data can be processed and analysed to draw inferences about the functioning of a system.

Second, spying and surveillance on the system.

Third, the threat of sabotage to the entire system. This may cripple or maim any essential and critical system in the hour of the utmost need. Hence, it has a high capability to compromise the credibility and safety of any system in emergency situations such as a war, natural calamity, etc.

How can a chip-backdoor be introduced in a chip?

If any chip, maliciously designed or fabricated and capable of providing a backdoor, is inserted in an electronic system, it provides a chip-backdoor.

A chip-backdoor can be introduced in a chip at any of the three stages of the production of a chip. They are as follows:

First, the design stage. In this stage, chip-backdoor can be introduced by the use of third-party IP cores and the electronic design automation (EDA) tools.

Second, the fabrication stage. In this stage, chip-backdoor can be introduced by making malicious modifications to photomasks, doping processes and metal interconnects.

Third, the ATMP (assembly, testing, marking, and packaging) stage. In this stage, chip-backdoor can be introduced by making alterations to chip packaging and printed circuit board.

Why is it difficult to detect a chip-backdoor?

Most important reasons that make detection of chip-backdoor difficult are as follows:

First, few chip-backdoors may be so well designed that it is difficult to detect them by all methods.

Second, few chip-backdoors may disguise as accidental vulnerability. Hence, they may evade detection.

Third, it is a herculean task to scan the entire system for a single or a few backdoor capable chips.

Reported cases of chip-backdoor

Due to the possibility of introducing backdoor at every stage of the production of a chip, there exists numerous possibilities of chip-backdoors. Despite this, there exists no concrete evidence about it.

Even though few cases have been reported in the past, the private companies involved in the production of such questionable chips have vehemently denied any such allegations.

Few such reported cases are as follows:

First, researchers from the University of Cambridge discovered a backdoor in the Actel/ Microsemi ProASIC3 chip. It was being used in sensitive industrial and military applications. They used a technique called Pipeline Emission Analysis (PEA) to detect this backdoor.

Second, in 2018, Bloomberg reported that very small malicious chips were found on Supermicro server motherboards. This backdoor was allegedly being used for spying.

Third, in June, 2024, in an interview to www.moneycontrol.com, HCL’s co-founder, Mr. Ajai Choudhary, alleged that many Chinese chips in a whole range of products have backdoors.

What counter-measures have been developed so far?

Only few counter-measures have been developed so far to detect chip-backdoor. They are as follows:

First, as per a report from the Business Insider published in May, 2012, Mr. Skorobogatov, a researcher from the University of Cambridge, developed a method to detect malicious chips in a system.

Second, as per a report from the TechRepublic published in 2016, researchers from the New York University developed a method to detect a chip’s operation by means of verifiable computing.

Third, as per a report published in the IEEE Spectrum in 2019, researchers from the University of Southern California and Paul Scherrer Institute developed the Ptychographic X-ray laminography. This technique enables verification of the blueprint of chips and their design without even minutely interfering with the chip or its functioning.

Concerns about the looming threat of chip backdoor

The mounting concerns about the looming threat of chip-backdoor steams from many factors. Few of them are as enumerated below:

First, as chips pervade all electronic systems, the possibility of the presence of backdoor in any critical installation becomes very high. It is only possible if the chip is capable of a backdoor, though.

Second, since the production of chip across all the stages of its production today spans across many locations and vendors, it is a herculean task to identify the exact coordinates of the origin of a chip-backdoor.

Third, any component of an electronic system that has the potential of activating a chip-backdoor has the potential to stay dormant for a considerable time. It gets triggered only when specific requisite conditions arise. These conditions make the chip-backdoor functional from that instant of time when such specific requisite conditions are met.

Fourth, the expenditure incurred in scanning for a backdoor-capable chip in a system is so high that it is not at all an economical option to opt for. As the deciding factor in today’s global market is the most competitive cost of production, the economic cost of production trumps all other factors.

The way forward

One method to evade the threat of chip-backdoor is to use only chips produced indigenously and by the most trusted source for all essential and critical applications involved in national security.

Besides, the scientific community of all countries has to come together to develop the most efficient and cost-effective method to detect a chip-backdoor in any system. It is sine qua non to ensure the safety and security of all of humanity in this digital age. It is a must do thing. And, it must be accomplished at the earliest.

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Author: STMicroelectronics

One of Matter development’s biggest issues is a potentially false sense of security resulting from improperly implementing specifications. According to CommScope, a member of the ST Partner Program, failing to manage certificates or device attestation credentials (DACs) correctly can lead to security vulnerabilities, as DACs are the most sensitive parameters for establishing device authentication and trust within the Matter ecosystem. It can also mean a company can fail to meet the IoT Device Security Specification from the CSA, the consortium behind Matter.

Launched in March 2024, the specification establishes unique Critical Security Parameters (CSPs) and follows best practices on secure storage and management processes. Once device manufacturers meet the certification criteria, they obtain Product Security Verified Marks. Hence, the IoT Device Security Specification represents a significant milestone toward what some are calling a “global cybersecurity standard for smart home devices”1, by ensuring a more secure ecosystem that’s capable of meeting today’s growing threats. CommScope and ST are, therefore, collaborating to ensure STM32 developers can rapidly meet these requirements.

The entire industry has high hopes for Matter, which explains why so many are adopting it, from Apple to Samsung, Amazon, and Google, among many others, and why ST is a promoter member of the CSA. We even released an X-CUBE-MATTER software package to help developers rapidly release their products to market thanks to pre-certified code and demo applications. Moreover, we have already shown demos of a certified Matter system running on STM32 MCUs. The CSA explains that it created Matter “with security and privacy as key design tenets.2” Consequently, as a promoter member, ST ensured our customers have all the tools and hardware needed to meet the latest security requirements.

The reason behind this new security push is simple. Until 2010, many developers didn’t even think the vast majority of IoT devices warranted security safeguards. This led to severe issues like the Mirai Botnet, which exploited IoT devices to launch massive DDoS attacks. Similarly, when researchers showed how they could remotely take control of a car by exploiting inherent vulnerabilities3 or that hackers spied on children’s bedrooms by breaching popular home security cameras4, people started to take notice. The CSA’s emphasis on security and privacy recognizes the critical importance of safeguarding users and devices in a world where threats are increasingly complex.

The problem is that few device manufacturers have the expertise to properly design and implement security measures. What’s even worse is that many developers vastly underestimate what it takes to implement security in a Matter system. For instance, the IoT Device Security Specification requires that the private key never leave its origin device. As a result, many companies only discover their non-compliance when they enter the certification program to obtain the Product Security Verified Mark. This often leads to significant delays and expenses when teams must revisit their initial designs and implementations and address the security issues preventing them from obtaining the IoT Device Security certification.

Matter devices will end up everywhere. That’s why the ST and CommScope partnership is so important.

Any security implementation starts at the hardware level. No amount of software can save a device that doesn’t offer strict physical and logical safeguards. Hence, the STM32WB55, which many use to run their Matter application, offers tamper protection mechanisms. It also has multiple crypto cores accelerating AES symmetric and RSA/ECC asymmetric cryptography. Moreover, it supports secure firmware installations and provides key storage and management services. Furthermore, the STM32WBA5x devices, like the newly launched STM32WBA54 and STM32WBA55, which can work as a radio co-processor in a Thread border router in a Matter ecosystem, can target a SESIP3 and PSA Certified Level 3 certification. Accordingly, developers know that these devices can help them meet modern specifications.

To allow developers to gain firsthand experience with Matter Device Attestation Credential provisioning without requiring software development, CommScope provides a video showcasing the process with a test DAC on an STM32WB5MMG evaluation board, the STM32WB5MM-DK. The CommScope solution provides services that handle certificate authority, provisioning services, certificate lifecycle management services, boot loaders, and app code signing. The services predate Matter and work in a wide range of IoT applications. In fact, their expertise has helped them anticipate the needs of developers, which is why ST featured CommScope Security Solution during Embedded World 2024.

In the video, CommScope shows a demonstration software package, which includes:

1. The DAC provisioning firmware
2. The programming station application

The DAC provisioning firmware runs on the STM32WB5MMG to generate the DAC key pair and its corresponding Certificate Signing Request (CSR) within the device. As a result, it keeps the private key secure. Users can use STM32CubeProgrammer, our popular debugging and flashing tool, to flash the DAC provisioning firmware onto the evaluation board. As for the programming station application, it facilitates communication between the STM32WB5MMG and the CommScope’s Matter DAC provisioning server (PKIWorks Essentials) by forwarding Certificate Signing Requests (CSRs) and receiving DACs. The demo is also close to a real-world example. When it’s time to move to production, the manufacturer must simply transition to a software package enabling the provisioning of DACs tailored for the product in question.

ST and CommScope recognize the pain points that come from transitioning from a proof-of-concept with a demo package to a production line. Hence, CommScope offers a pre-integrated and tested pre-production solution with an integration guide for our STM32WB5MM-DK Discovery Kit. Device manufacturers can thus create a factory-deployable workflow ready to roll out and fit into their existing factory processes with minimum software customization. Both ST and CommScope understand the challenges involved in modifying manufacturing processes. It involves careful planning and adjustments to optimize production yields, especially when integrating DAC provisioning into manufacturing lines.

Consequently, to facilitate the transition from test DACs to production DACs, device manufacturers only need to provide their company name, vendor ID, and/or product ID to CommScope. The company will then create a specific Product Attestation Intermediate (PAI) essential for DACs issuance during production. Each device manufacturer’s specific PAI(s) is linked to CommScope’s CSA-approved non-VID-scoped Product Attestation Authorities (PAAs) and recorded in the CSA’s blockchain, known as the Device Compliance Ledger (DCL).

Therefore, ST and CommScope’s pre-integrated software package includes necessary baseline software implementation and offers direct Certificate Authority Services tailored for various device manufacturers. In addition, CommScope’s expertise in security ensures that DAC private keys never leave devices and are securely stored within STM32WBA5x. This best practice enables device manufacturers to achieve IoT Device Security certification swiftly. Put simply, it removes a lot of complexity so engineers can focus on what they do best: develop unique features and release products ahead of everyone else.

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In battery-powered applications such as motor drives and switched-mode power supplies (SMPS), the power supply architecture often requires that a module can be disconnected from the main supply rail when a fault occurs in that module. To achieve this functionality, it is common to use high-side disconnect switches (e.g. MOSFETs) to prevent a load short circuit from affecting the battery. Infineon Technologies AG has now introduced the EiceDRIVER 1EDL8011, a high-side gate driver designed to protect battery-powered applications such as cordless power tools, robotics, e-bikes, and vacuum cleaners in the event of a fault.

The device provides fast turn-on and turn-off of high-side N-channel MOSFETs with its high gate current capabilities. It consists of an integrated charge pump with an external capacitor to provide strong start-up. The internal charge pump provides the MOSFET gate voltage when the operating input voltage is low. The gate driver IC manages inrush current and provides fault protection. Undervoltage Lockout (UVLO) protection at input voltage prevents the device from operating under hazardous conditions. The driver is available in a DSO-8 package, making it ideal for space-constrained designs. It includes overcurrent protection (OCP), adjustable current setting threshold, time delay and a safe start-up mechanism with flexible blanking during MOSFET turn-on transitions.

The 1EDL8011 has a wide operating voltage range of 8 V to 125 V and a high gate sinking current of up to 1 A, allowing for efficient switching. Additionally, the product has an extremely low off-mode quiescent current of 1 µA, helping to minimize power consumption in sleep mode. The device also includes a VDS sense feature that is used to trigger an overcurrent shutdown by monitoring the drain-to-source voltage of the disconnect MOSFET.

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Rohde & Schwarz, in collaboration with wireless communications engineering experts IMST GmbH, has developed a patented antenna digital twin solution, effectively addressing a multitude of challenges and delivering considerable benefits for vehicle manufacturers and their suppliers to optimize automotive connectivity. The solution combines measurements of the antenna characteristics with simulation of the electromagnetic wave propagation to optimize the antennas’ design and their position to ensure for example optimal WiFi coverage inside the vehicle.

Vehicle manufacturers face several challenges when integrating antennas out- or in-side their vehicles. Performing antenna simulations is complex and time consuming, and simulation results have to be proven by physical measurements. Accurate measurements in-side the vehicle are simply not possible due to the closed vehicle environment. A combination of measurements and simulation is needed in order to achieve the best antenna position and therefore also connectivity performance for the user in-side the vehicle.

Rohde & Schwarz has joined forces with IMST to develop a process, divided into three steps. The first involves the characterization of physical antennas using Rohde & Schwarz test equipment, including an anechoic chamber, a R&S ZNA vector network analyzer, and the R&S AMS32 software. The second step focuses on the creation of a digital twin by involving the easy to use Near Field to Far Field Transformation Algorithm (FIAFTA). This is followed by a 3D EM simulation of a virtual scenario using EM-TWIN software from IMST.

The antenna digital twin solution from Rohde & Schwarz and IMST offers multiple benefits. Notably, it brings about a significant reduction in cost and time for antenna suppliers and vehicle manufacturers through the front-loading of antenna validation by combining measurements and simulations. It ensures the accurate and consistent characterization of physical antennas through the use of anechoic chambers and vector network analyzers in conjunction with the R&S AMS32 automation software.

Moreover, the solution significantly reduces development time as EM-TWIN simulation results are available within hours, not days. The performance of the antenna can be enhanced as production tolerances and reflections from the vehicles’ bodies are considered. The patented EM-TWIN digital antenna twin source technology provides an exceptional high level of modeling accuracy.

This solution allows for the optimal location of the antenna to be found before the physical vehicle is available, thereby avoiding expensive and time-consuming development cycles. The ability to identify the optimal location of the antenna and verify in-vehicle wireless coverage is a significant advantage, particulalry because conventional measurements are extremely difficult and unreliable within the physical contriants of the vehicle. In summary, the patented antenna digital twin solution from Rohde & Schwarz and IMST accelerates design cycles and optimizes the location of antennas on vehicles, thereby improving coverage and performance before prototypes and chassis become available.

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Available in the Space-Saving SOP-4 Package, Automotive Grade Device Delivers Industry’s Fastest Turn-On and Turn-Off Times of 0.1 ms Typical

Vishay Intertechnology, Inc. today introduced the industry’s first 1 Form A solid-state relay to offer AEC-Q102 qualification and a 100 V load voltage. Offered in the low profile SOP-4 package, the Vishay Semiconductors VORA1010M4 delivers the industry’s fastest turn-on and turn-off times of 0.1 ms typical, in addition to the highest operating temperature to +125 °C.

The fast turn-off time of the optically isolated device released today is a result of its integrated turn-off circuit, while its combination of a state-of-the-art infrared emitter and photovoltaic diode array delivers its fast turn-on time. This switching performance makes the solid-state relay ideal for safety-critical applications, while its compact SOP-4 package saves space over competing solutions in the DIP-4 package.

Offering an isolation voltage of 3750 VRMS, the Automotive Grade VORA1010M4 is designed to provide clean, bounce-free switching for glass dimming, lighting control, inverters, motor controls, and battery management systems (BMS) in electric (EV) and hybrid electric (HEV) vehicles; industrial motor drives and controls; security and automation systems; and telecom servers and datacenters.

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The evaluation of electric vehicle motors is based on many factors. Mainly, it is based on three factors- durability, performance, and reliability of an electric vehicle motor.

The evaluation system for the assessment of an electric vehicle’s motor simulates the real-world driving conditions. It measures and records vital parameters such as speed, torque, power, and temperature.

Thereafter, the data collected by the evaluation system is used to identify key areas of improvement in the performance of an electric vehicle’s motor.

The key parameters on which an electric vehicle’s motor is evaluated are as follows:

First, constant load testing. In this testing method, a fixed load is applied to an electric vehicle’s motor for a constant time period. This load can be set to a predetermined value. And then, it records the motor’s performance in terms of its temperature, torque, speed, and power consumption.

Second, real-time DC- A real-time DC is built to assess the effectiveness of different energy management controllers in a variety of road conditions.

Third, EVREVO. This testing method evaluates any evaluation software without waiting for the other vehicle parts to be installed on it.

Fourth, EV motor test systems. This test system simulates the driving conditions prevailing on roads. This aid the driver to hone his/ her driving skills pertaining to different parameters. For instance, acceleration, deceleration, and other road and load conditions.

Thereafter, the data collected from these sources is used to identify areas of improvement in the performance and design of an electric vehicle.

Fifth, input voltage control. The allowed voltage range should be selected before the test, and each test point should work as quickly as possible.

Sixth, efficiency maps. They are installed in an electric vehicle’s simulation model. It gives vital inputs about the performance of an electric vehicle’s motor, battery, and other components.

Seventh, simulation calculation. It can be used to derive the distribution of operating points under different conditions. This can help to match the motor system to the whole vehicle and get a more accurate efficiency performance.

Eight, analytical hierarchy process (AHP). It is used to quantitatively measure the relative performance of different types of batteries. For example, lithium-ion batteries, fuel cells, and hybrid batteries.

Ninth, airgap eccentricity. It detects any major defect that may occur in any variable speed induction motor.

Tenth, input voltage control. It maintains a specific voltage range at each point of an electric vehicle’s motor.

Eleventh, step load testing. In this method, a specific load is applied in incremental steps to an electric vehicle’s motor. Thereafter, the response of that motor is monitored at each load level. This enables to assess the ability of that motor to handle increasing loads without any decrease in performance or overheating. This helps to determine that motor’s load capacity and performance under different conditions.

Twelfth, peak load testing. It is undertaken to evaluate an electric vehicle’s motor’s ability to withstand any sudden high loads or short bursts of power demand. In this method, that motor is subjected to its maximum rated load or slightly higher than that limit for a brief period of time. This helps to assess that motor’s ability to withstand any such spurt in peak load without overheating or failing.

Thirteenth, endurance testing. In this method, a load is continuously applied to an electric vehicle’s motor for a prolonged period. This type of testing helps to evaluate that motor’s reliability, durability, and thermal performance under prolonged operating conditions.

Fourteenth, regenerative load testing. In this method, an electric vehicle’s motor is subjected to variable loads in regenerative mode. This helps to evaluate its efficiency in both recovering and converting kinetic energy into electrical energy during the process of deceleration.

Fifteenth, thermal load testing. It is aimed at assessing an electric vehicle’s motor’s thermal management system. In this method, a motor is operated under heavy loads or at maximum power for an extended period. During this process, its change in temperature is monitored. Hence, this testing helps in determining the effectiveness of that motor’s cooling system so that it can maintain an optimal operating range of temperature.

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First-ever demo of connected in-cabin vital signs monitoring will debut at AutoSens Europe, featuring OMNIVISION’s state-of-the-art CMOS image sensor and Philips’ vital signs camerai for automotive software

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Lucid has integrated Everspin’s MRAM Across Multiple High-Performance EV Models, Strengthening Data Reliability and System Performance

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release third quarter 2024 earnings before the opening of trading on the European Stock Exchanges on October 31, 2024.

STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its third quarter 2024 financial results and current business outlook on October 31, 2024 at 9:30 a.m. Central European Time (CET) / 3:30 a.m. U.S. Eastern Time (ET).

A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until November 15, 2024.

The Company will webcast live its 2024 Capital Markets Day meeting from Paris, France, on Wednesday, November 20, from 9:00 a.m. to 1:15 p.m. Central European Time (CET) / 3:00 a.m. to 7:15 a.m. U.S. Eastern Time (ET).

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As AI technologies advance, they are placing unprecedented demands on personal computing devices and smartphones. These edge devices, which are becoming increasingly untethered from cloud data centers, must handle substantial computing loads, driven by AI models that often contain billions of parameters. With AI integration predicted to skyrocket, storage controller chips are facing growing pressure to deliver optimized performance to keep pace with these evolving workloads.

According to industry forecasts, by 2025 nearly half of all new personal computers will run AI models, including generative AI, locally. This shift is transforming edge computing, enabling devices like PCs and smartphones to process AI tasks without relying on cloud infrastructure. However, this advancement brings with it significant challenges for hardware, particularly in terms of memory, interconnect, and storage.

Storage systems in edge devices must excel in four critical areas to effectively support AI workloads: capacity, power efficiency, data efficiency, and security.

1. Capacity:

The massive datasets required by generative AI models demand extensive storage capacity. Applications such as image generation tools or AI-driven content creation software may require gigabytes, if not terabytes, of storage. For example, Microsoft’s Phi-3 language model, despite being compact, has 3.8 billion parameters and requires between 7 and 15 gigabytes of storage. As multiple AI applications coexist on a single device, storage needs will quickly surpass a terabyte.

2. Power Efficiency:

While often overlooked, power efficiency is critical for edge devices, particularly mobile platforms where battery life is a priority. Storage components contribute significantly to power consumption, accounting for about 10% of a laptop’s power usage and roughly 5% in smartphones. As AI models and workloads expand, power-efficient storage solutions are essential to maintain extended operating hours without compromising performance.

3. Data Efficiency:

Efficient use of storage space not only improves performance but also impacts access latency and the longevity of NAND flash storage. Storage controllers must manage how data is placed and retrieved from NAND flash to minimize latency and optimize flash endurance. Techniques like zoned namespaces (ZNS) and flexible data placement (FDP) can help ensure that data is stored in a way that optimizes both power and data efficiency, which is crucial for AI applications.

4. Security:

As AI models often represent years of research and development, their parameter files are highly valuable and must be protected. Developers require robust security protocols to safeguard these files from tampering or theft. Additionally, with more data processing occurring locally rather than in the cloud, users are increasingly storing sensitive personal information on their devices, further heightening the need for secure storage systems.

To meet these evolving demands, storage controllers must be specifically designed to handle the unique requirements of AI workloads on edge devices. A new generation of storage controllers is now available, optimized for AI-ready PCs and smartphones, each offering performance and efficiency enhancements tailored to their respective platforms.

For AI-enabled personal computers, raw storage performance and capacity are critical to support large AI models and multitasking environments. One example is Silicon Motion’s SM2508 controller, designed for high-performance AI workloads in PCs. The SM2508 controller features four PCIe Gen5 lanes for data transfer to the host and eight NAND channels, enabling sequential read speeds of up to 14.5 Gbytes per second. This high throughput ensures smooth operation even with complex, multi-tasking AI applications.

In addition to speed, the SM2508 can manage up to 8 terabytes of NAND flash, providing ample capacity for AI workloads that rely on vast amounts of data. To support this, system designers are leveraging the latest quad-level-cell (QLC) 3D NAND flash, which allows for dense storage. However, QLC chips are prone to unique error patterns as they age, requiring advanced error-correction algorithms to maintain reliability. Silicon Motion has developed a machine-learning-based error correction code (ECC) that adapts to these patterns over time, reducing latency and extending the lifespan of the storage system.

Power efficiency is also a significant concern in AI-ready PCs, especially given the intense computational loads AI models impose. The SM2508 controller is manufactured using TSMC’s 6 nm process, which allows for more efficient power management compared to previous generations built on 12 nm technology. By organizing the functional blocks within the chip and incorporating sophisticated power management features, Silicon Motion has managed to reduce power consumption by half.

Data management plays a crucial role in both power efficiency and overall performance. By optimizing how data is placed and managed within NAND flash, the SM2508 controller can reduce power usage by up to 70% compared to competing solutions. These enhancements ensure that AI workloads can run efficiently without draining battery life or reducing system performance.

Security is another essential pillar for AI-based systems. The SM2508 controller features a tamper-resistant design and uses a secure boot process to authenticate firmware, ensuring that the system remains protected from unauthorized access. The controller also complies with Opal full-disk encryption standards and supports AES 128/256 and SHA 256/384 encryption, securing data without compromising performance.

While the requirements for AI smartphones are similar to those of AI PCs—capacity, power efficiency, data efficiency, and security—mobile devices face additional constraints in size, weight, and battery life. For this market, Silicon Motion has developed the SM2756 controller, optimized for the mobile-optimized Universal Flash Storage (UFS) 4 specification.

UFS 4 offers significant performance improvements over UFS 3.1, and the SM2756 controller takes full advantage of these enhancements. With a 2-lane HS-Gear-5 interface and MPHY 5.0 technology, the controller achieves sequential read speeds of up to 4.3 Gbytes per second, allowing smartphones to load multi-billion-parameter AI models in under half a second. This fast-loading capability is crucial for AI applications to provide a seamless user experience.

To meet the capacity requirements of AI smartphones, the SM2756 controller supports tri-level and QLC 3D flash, managing up to 2 terabytes of storage. Power efficiency is another critical aspect, with the SM2756 achieving nearly 60% power savings when loading large AI parameter files compared to UFS 3 controllers.

Like its counterpart for PCs, the SM2756 leverages sophisticated firmware algorithms to optimize data placement and improve performance. Additionally, it includes anti-hacking measures to prevent unauthorized access during boot-up, ensuring data integrity and security on mobile devices.

As AI continues to evolve, pushing more workloads to edge devices like PCs and smartphones, the demands on storage systems will only intensify. Storage controller chips will play a pivotal role in ensuring that devices can handle the performance, capacity, power efficiency, and security requirements necessary to support AI applications. By developing controllers like the SM2508 and SM2756, Silicon Motion is paving the way for a new generation of AI-enabled devices, equipped to meet the challenges of the edge AI revolution.

Citations from Silicon Motion

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The automotive industry is undergoing a profound transformation, shifting from mechanical-driven vehicles to software-defined vehicles (SDVs). This transition is not just about enhancing features but also about creating platforms that can adapt and evolve. SDVs are capable of upgrading their functionalities via over-the-air updates, thanks to the increased reliance on software for managing many critical vehicle systems. A cornerstone of this shift is the incorporation of advanced semiconductor technologies, particularly wide-bandgap (WBG) semiconductors such as silicon carbide (SiC) and gallium nitride (GaN). These materials offer superior performance compared to traditional silicon-based components, making them pivotal in supporting the next generation of electric and autonomous vehicles.

WBG semiconductors, primarily represented by SiC and GaN, are becoming essential in automotive innovation due to their exceptional electrical and thermal properties. What sets these semiconductors apart is their ability to operate at significantly higher voltages, temperatures, and frequencies than conventional silicon-based components. This is possible because of their larger bandgaps—SiC has a bandgap of 3.3 eV and GaN about 3.4 eV, which is much wider than silicon’s 1.1 eV bandgap. The wider bandgap allows these semiconductors to handle higher electric fields, dissipate heat more efficiently, and reduce energy losses, making them ideal for high-performance applications.

In automotive systems, these characteristics translate into several key advantages. WBG semiconductors enable higher electrical efficiency, reduce the size of cooling systems, and increase the reliability of power electronics—all of which are critical as vehicles become more electrified and software-defined. Moreover, these semiconductors’ ability to function in extreme conditions makes them well-suited for next-generation automotive platforms.

The adoption of SiC and GaN in vehicles is revolutionizing various key systems, including power electronics, electric drivetrains, and charging infrastructure. WBG semiconductors are already playing a central role in enhancing electric vehicles’ performance, efficiency, and longevity (EVs).

1. Power Electronics: WBG semiconductors are increasingly being utilized in inverters, which are essential components in EVs. Inverters transform the direct current (DC) from the battery into alternating current (AC), which is necessary to drive the electric motor. SiC and GaN components enable inverters to operate at higher voltages and temperatures, significantly improving power conversion efficiency. This not only leads to better energy utilization but also extends the range of EVs by reducing energy losses.
2. Electric Drivetrains: The use of SiC in drivetrain systems allows EVs to handle higher power loads with greater efficiency. SiC components can manage faster switching speeds and higher temperatures, which enhances the overall performance of the electric motor. This means that vehicles can achieve better acceleration, longer driving ranges, and increased battery life—all critical for the next generation of electric vehicles.
3. Charging Systems: Fast charging has become a major focus area for EVs, and WBG semiconductors are enabling significant advancements in this space. SiC and GaN components allow for faster switching speeds in power electronics, which supports ultra-fast charging stations. These components can handle higher voltages and currents without overheating, allowing vehicles to recharge in a fraction of the time required by traditional charging systems. This is a game-changer for EV owners, as it addresses one of the major pain points—long charging times.

The integration of WBG semiconductors into EV systems fundamentally improves several key performance metrics, including vehicle efficiency, charging capabilities, and component longevity. These enhancements are critical as automakers strive to make EVs more appealing to mainstream consumers.

1. Improved Electrical Efficiency: SiC and GaN semiconductors have lower electrical losses compared to traditional silicon components. In power electronics systems, such as inverters, this means that less energy is lost as heat during the conversion of electricity from the battery to the motor. Studies show that SiC inverters can improve efficiency by up to 3%, which translates into more of the battery’s energy being used for propulsion rather than being wasted. This improvement plays a direct role in extending the range of EVs.
2. Extended EV Range: As WBG semiconductors improve the efficiency of critical systems like inverters and drivetrains, they also directly impact the vehicle’s range. Vehicles using SiC and GaN components can travel longer distances on a single charge, a feature that helps alleviate “range anxiety”—a common concern among potential EV buyers. The increased efficiency means that EVs can compete more effectively with traditional internal combustion engine vehicles in terms of range.
3. Faster Charging Times: The use of WBG semiconductors in charging systems not only allows for faster charging speeds but also supports the development of higher-powered charging stations. SiC and GaN’s ability to operate at higher voltages and currents without overheating means that EVs can charge to 80% capacity in as little as 20 minutes. This reduction in downtime makes EVs more practical for long-distance travel and enhances their overall convenience.
4. Longer Component Lifespan: WBG semiconductors are more durable and capable of withstanding extreme temperatures and voltages, which makes them less prone to degradation over time. This resilience leads to longer lifespans for critical components like inverters and chargers, reducing maintenance costs and increasing the overall lifecycle of the vehicle. For manufacturers, this means fewer warranty claims, while for consumers, it means lower repair costs over the vehicle’s lifetime.

Despite their many advantages, the adoption of WBG semiconductors in the automotive industry faces some challenges. One of the most significant is the cost. SiC and GaN materials are considerably more expensive than traditional silicon, and their production involves complex fabrication techniques. As a result, vehicles equipped with WBG components may have higher upfront costs, potentially limiting their market penetration in the short term.

Another challenge is the integration of these advanced materials into existing vehicle architectures. Automotive standards are stringent, and new technologies must undergo rigorous validation to ensure they can perform reliably under diverse and often harsh conditions. The need for extensive testing and validation may slow down the adoption of WBG semiconductors in mass-market vehicles.

Looking forward, ongoing research and development in WBG semiconductor technology aim to overcome these challenges and further enhance their performance. Researchers are exploring ways to improve the efficiency and durability of SiC and GaN components while reducing production costs. Additionally, advancements in material science could lead to the development of new composite materials that combine the best properties of WBG semiconductors with other elements.

As WBG technology matures, it is expected to have a profound impact on vehicle design and functionality. The enhanced power-handling capabilities of SiC and GaN could lead to more compact and efficient vehicle architectures, freeing up space for other innovations. Furthermore, these technologies will play a key role in enabling more advanced software-defined features, such as autonomous driving systems and adaptive performance tuning.

Wide-bandgap semiconductors represent a critical enabler for the future of software-defined vehicles. Their superior electrical and thermal properties position them as indispensable components in next-generation EVs, offering enhanced efficiency, faster charging, and greater durability. However, realizing their full potential will require continued research, collaboration between automakers and semiconductor manufacturers, and innovations that address cost and integration challenges. As these obstacles are overcome, WBG semiconductors will play a transformative role in shaping the future of the automotive industry, driving more sustainable, efficient, and intelligent transportation solutions.

Citations from an article by Infineon Technologies

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Driving Innovation in Efficiency, Precision, and AI-Enabled Solutions

STMicroelectronics has introduced a series of cutting-edge innovations, empowering developers in motor control, edge AI, sensor fusion, human presence detection, and ultra-low-power radio solutions. These advancements are set to transform industries like home appliances, industrial automation, robotics, and smart sensing, reinforcing ST’s leadership in embedded technologies.

Rashi Bajpai, Sub-Editor at ELE Times, engaged with ST’s leadership during electronica India 2024 to explore emerging technologies.

1. Motor Control + Edge AI for Washing Machines by Mohammed Zeya WASE

ST’s all-in-one kit solution for washing machine and motor-driving developers combines Motor Control FOC Sensorless technology with Nano Edge AI to significantly boost energy and water efficiency. With precise cloth weight measurement (accuracy of 100g) and double-digit improvements in energy consumption, the integration of ST’s SLLIMM IPM ensures superior motor performance.

Additionally, developers can create advanced user interfaces using the TouchGFX graphical framework, allowing for swift deployment of interactive washing machine designs. This solution marks a major leap forward in the creation of eco-friendly, intelligent home appliances.

2. ST MEMS Sensor with Orientation Tracking by Hong Shao Chen

ST’s new generation of Inertial Measurement Units (IMUs) featuring built-in sensor fusion algorithms allow for real-time orientation tracking of robotic and vehicle applications. The sensor fusion processes data from the accelerometer, gyroscope, and magnetometer (optional) to deliver quaternion output, tracking an object’s orientation in 3D space.

This feature is available through the STM32 MotionFX API or directly within ST’s IMUs, such as the LSM6DSV family for consumer applications and the ISM330BX for industrial use cases. By embedding these algorithms directly into the sensors, developers can accelerate their innovation in robotics, drones, and other motion-sensitive applications.

3. ST BrightSense – Imaging sensors for computer vision by Vincent Lin

ST BrightSense portfolio leverages cutting-edge pixel technologies to offer a tiny form factor and ultra-low power consumption. Combining global shutter, 3D stacking, backside interface (BSI), and capacitive deep trench isolation (CDTI) technologies, ST BrightSense camera sensors provide superior image quality for smart, accurate, and reactive camera-based systems. Their rich set of on-chip features allows faster and more efficient processing to support the next generation of smart devices.

4. STM32WL33 with ULP Wake Up Radio by Pradyumna Kumar JENA

The STM32WL33 delivers an ultra-low-power Sub-GHz System-on-Chip (SoC) with integrated radio capabilities, optimized for IoT and industrial applications. One of its standout features is its ULP Wake Up Radio, which consumes just 4.2µA in always-on mode, allowing remote activation of devices with minimal power consumption.

Boasting 20 dBm transmission power and internal PA, this SoC is built for energy-efficient operation, with a receiving current of 5.6 mA and a transmission current of 10mA at 10 dBm. Available for evaluation via the NUCLEO-WL33CC1 board, this solution opens the door for ultra-low-power IoT devices that can remain on standby without draining energy resources.

STMicroelectronics continues to push the boundaries of innovation, providing developers with cutting-edge tools for creating smarter, more efficient, and highly integrated products. From washing machines to industrial sensors, these new solutions underscore ST’s commitment to energy efficiency, advanced functionality, and seamless integration for next-gen applications for a sustainable future.

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