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Caliber Interconnects Achieves ARAI Certification for EV Charging Solutions, Strengthening India’s Indigenous EV Infrastructure
Caliber Interconnects Private Ltd., a leading Indian engineering and deep-tech solutions company, today announced that its electric vehicle (EV) charging portfolio has been awarded ARAI certification, marking a significant milestone in the company’s journey to deliver reliable, safe, and future-ready charging infrastructure for India’s rapidly evolving mobility ecosystem.
The certification from the Automotive Research Association of India (ARAI) validates Caliber’s adherence to stringent national standards for safety, performance, and environmental compliance—benchmarks critical to the Indian automotive and EV industries.
“This milestone goes far beyond a certificate—it’s a clear signal of our engineering depth and long-term commitment to India’s EV future,” said Suresh Babu, Founder & CEO, Caliber Interconnects. “ARAI certification reinforces our belief that India deserves globally competitive EV charging solutions that are designed, manufactured, and supported locally. At Caliber, we are building high-performance charging systems that the ecosystem can depend on—not just today, but for the decade ahead.”
A Comprehensive, ARAI-Certified EV Charging Portfolio
Caliber Interconnects offers one of the industry’s most versatile EV charging portfolios, addressing residential, commercial, fleet, and public charging needs:
- AC Chargers: 3.3 kW | 7.4 kW | 22 kW
- Hybrid Chargers: 30 kW DC + 22 kW AC
- DC Fast Chargers: 30 kW | 60 kW | 120 kW | 240 kW
- Two-Wheeler DC Chargers: 3 kW | 6 kW
All chargers are powered by Cogency, Caliber’s intelligent smart-charging platform engineered for real-time monitoring, predictive maintenance, and optimized charger performance.
Intelligent, Scalable, and Standards-Compliant
Cogency is OCPP 1.6 and 2.0.1 compliant and supports both Android and iOS, enabling seamless system integration, remote management, and scalable deployments across diverse charging networks. The platform is designed to meet the operational demands of utilities, charge point operators, OEMs, and infrastructure developers.
With ARAI certification, Caliber’s EV chargers meet the highest standards expected by India’s automotive industry—ensuring safety, durability, and environmental responsibility across operating conditions.
Designed in India. Built for Scale.
At a time when the market is saturated with imported EV chargers, Caliber Interconnects is championing locally manufactured, future-ready solutions that reduce dependency, improve serviceability, and strengthen India’s EV value chain.
Whether supporting immediate deployments or long-term infrastructure planning, Caliber’s charging solutions are engineered to scale alongside the growing demands of India’s EV and clean-energy ecosystem.
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ICEA Welcomes Budget 2026–27’s Focus on Manufacturing, Flags Key Structural Gaps
India Cellular and Electronics Association (ICEA) said that the Union Budget 2026–27 adopts a steady and largely inclusive approach, reinforcing India’s manufacturing and technology ecosystem through policy continuity, scale, and targeted reforms.
The sustained focus on electronics manufacturing, the launch of India Semiconductor Mission (ISM) 2.0, and the significant expansion of the Electronics Component Manufacturing Scheme (ECMS) reaffirm the government’s long-term commitment to building resilient domestic supply chains and strengthening India’s position in global value chains.
ICEA also welcomed the announcement of a tax holiday till 2047 for foreign companies offering global cloud services using India-based data centres, describing it as a forward-looking measure that provides long-term policy certainty, anchors global digital infrastructure in India, and enhances the country’s credibility as a trusted hub for data, cloud, and AI-led services. Long-term predictability, as provided in this measure, will be a sure win for our nation.
Additional measures, such as the five-year income tax exemption for foreign suppliers of capital equipment in bonded zones, the Safe Harbour framework for non-resident component warehousing, customs decriminalisation, and extended validity of advance rulings, are expected to improve ease of doing business, reduce compliance friction, and strengthen investor confidence.
However, ICEA noted that there are a few unfinished businesses. Inverted duty structures across capital equipment, display assemblies, inductors, FPCA, MICs, receivers, speakers, and specialised inputs continue to impact cost competitiveness. Partial progress on MOOWR reforms, limited clarity on tax-neutral VMI models, and residual uncertainty around Permanent Establishment (PE) exposure for foreign-owned capital equipment remain constraints to faster scale-up.
Commenting on the Budget, Mr. Pankaj Mohindroo, Chairman, ICEA, said: “Budget 2026–27 reinforces the government’s commitment to manufacturing-led growth, particularly in electronics and semiconductors, through continuity, scale, and targeted reforms. Measures such as the expansion of ECMS, support for ISM 2.0, and long-term incentives for cloud and data infrastructure send a strong signal of strategic intent and policy stability.
“At the same time, key structural issues, especially inverted duty structures, unfinished MOOWR reforms, and tax-related uncertainties, need timely resolution to ensure cost competitiveness and speed of execution,” Mr. Mohindroo added.
ICEA Chairman further stated that the exponential growth in mobile manufacturing has clearly demonstrated what bold and consistent policy measures can achieve. “To replicate this success across sectors and move towards 25% of GDP through manufacturing, the National Manufacturing Mission is a need of the nation, enabling the ecosystem to truly fire on all cylinders,” he said.
ICEA reiterated its commitment to working closely with the government and stakeholders to support policy implementation and accelerate India’s journey towards becoming a globally competitive electronics manufacturing hub.
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Enabling the Road to 6G: How Rohde & Schwarz Is Shaping the Future of Wireless Networks
Senior leaders from Rohde & Schwarz shared their perspectives with Kumar Harshit, Technology Correspondent at ELE Times, on the evolving wireless landscape, discussing the transition from 5G to 6G and the technologies shaping next-generation networks. The conversation focused on rising network complexity and the growing importance of intelligent test and measurement solutions.
The conversation was enriched by insights from Simon Ng, Sales Director – Mobile Network Testing (Asia Pacific), R&S Regional Headquarters, Singapore; Alexander Pabst, Vice President – Market Segment Wireless Communication, R&S GmbH & Co. KG, Germany; and Mahesh Basavaraju, Market Segment Manager – Wireless Communication, R&S India Pvt. Ltd.
Together, the leaders shared a cohesive outlook on key enablers of future networks, including advanced test and measurement methodologies, AI-native and AI-assisted networks, non-terrestrial and satellite integration, the emergence of Wi-Fi 8, and India’s expanding role as a critical hub for telecom R&D and innovation.
Here are the excerpts from the conversation:
ELE Times: How does Rohde & Schwarz view localization, particularly in manufacturing and equipment development in India?
R&S: Rohde & Schwarz develops global technologies for a global market. Rather than localizing products in isolation, we operate through a unified global development model. India plays a key role in this framework.
We have over 200 engineers in India who contribute directly to our global R&D efforts. The solutions developed through this collaboration are deployed worldwide, including in India. In that sense, India is deeply integrated into our global innovation ecosystem.
ELE Times: As the industry transitions from 5G toward 6G, how is Rohde & Schwarz positioning itself?
R&S: Connectivity is no longer limited to consumer communication; it is becoming core infrastructure for industry and society. While 5G has enabled private networks, industrial IoT, and enterprise use cases, 6G will take this further.
With 6G, we expect higher operating frequencies, native integration of non-terrestrial networks such as satellites, network sensing capabilities, and deeper convergence of AI, XR, and communication technologies. Our role is to enable this entire ecosystem—on both the network and device sides—through advanced test, measurement, and validation solutions, from early research to commercialization.
ELE Times: What are the defining technology pillars you associate with 6G?
R&S: Three pillars stand out clearly. First is ubiquitous connectivity, where satellite communication becomes a native part of the network rather than an add-on. Second is immersive and intelligent experiences driven by the convergence of XR, AI, and sensing technologies. Third is energy and spectrum efficiency, which will be critical to ensure sustainability as network capacity and complexity continue to grow.
ELE Times: Rohde & Schwarz is known for working in the pre-market phase. How early are you involved in new technology development?
R&S: Very early. Typically, we operate three to five years ahead of commercial deployment. Our responsibility is to translate high-level visions—such as holographic communication or pervasive sensing—into concrete, testable technical requirements.
This includes supporting evolving standards, advances in massive MIMO, AI-driven air interfaces, integrated sensing and communication (ISAC), and next-generation antenna systems. We work closely with industry players to ensure these technologies are testable and reliable long before they reach the market.
ELE Times: Wi-Fi 8 is emerging alongside cellular evolution. Why is Wi-Fi 8 important?
R&S: Wi-Fi 8 is less about peak data rates and more about reliability, coordination, and scalability. One key improvement is the ability of access points to coordinate spectrum usage among themselves, significantly reducing interference.
It also enhances mesh networking, improves spectrum efficiency, and allows a single cell to serve more users reliably. While there may be incremental increases in bandwidth, the real value lies in better-managed spectrum and consistent user experience.
ELE Times: Can you highlight some recent breakthroughs in test and measurement technologies?
R&S: One important area is testing XR and AI applications over wireless networks. Unlike wired connections, wireless networks introduce latency, fading, congestion, and other impairments that directly affect performance. Our platforms can simulate these real-world conditions to validate application behavior accurately.
Another breakthrough is in base station testing. Traditionally, this required large racks of individual instruments. We have introduced compact, fully integrated base station testers that are cost-efficient, reliable, and well-suited for production environments.
We have also developed solutions for millimeter-wave Wi-Fi, particularly relevant to India, and advanced test setups for non-terrestrial networks, including satellite-based communication.
ELE Times: How do you assess India’s progress after its rapid nationwide 5G rollout?
R&S: India’s progress has been remarkable. Network quality, coverage, and speed have improved dramatically in a short time. More importantly, India is no longer content with being a fast follower.
There is a strong national ambition to be at the forefront of 6G, supported by government funding, research programs, and industry collaboration. We are actively supporting this journey by working closely with Indian operators, OEMs, startups, and academic institutions.
ELE Times: What role does Rohde & Schwarz play in India’s 6G and R&D ecosystem?
R&S: We are actively engaged with the Bharat 6G Alliance and contribute across multiple working groups covering technology, spectrum, and use cases. Our role is to bring global experience into Indian research programs and testbeds.
India has set ambitious goals around creating domestic intellectual property for 6G. We already see strong innovation emerging from Indian universities and startups, particularly in areas such as massive MIMO and AI-driven networks, and we support them with advanced validation and measurement platforms.
ELE Times: What are the key challenges in pre-silicon testing and validation?
R&S: One major challenge has been early-stage testing. Historically, this required complex hardware simulators and tightly synchronized physical interfaces. We have now shifted toward software-based testing using IQ-over-IP, enabling validation at a much earlier stage.
Another important shift is continuous integration, where software can be repeatedly tested in pre-silicon environments before being committed to hardware. This significantly accelerates development cycles.
We are also simplifying automation by moving from traditional programming approaches to Python-based workflows and introducing AI-assisted scripting, allowing engineers to define complex tests using natural language.
ELE Times: AI is becoming central to telecom systems. How does Rohde & Schwarz approach AI?
R&S: From a telecom perspective, AI can be broadly categorized into AI on RAN, AI for RAN, and AI and RAN. Our primary focus is AI for RAN, where AI is used to optimize network performance.
AI introduces many new variables, making performance validation more complex. Our focus is on enabling fair, repeatable, and meaningful testing. Internally, we see AI as a powerful enabler rather than a replacement for engineers. The engineer remains at the center of decision-making, with AI enhancing efficiency, automation, and insight.
ELE Times: Finally, how do you see India shaping the global 6G ecosystem?
R&S: India brings together scale, talent, a vibrant startup ecosystem, and strong policy support. What is particularly striking is the density of innovation and risk-taking startups, supported by government initiatives.
With sustained investment in research, testbeds, and global collaboration, India is well-positioned to influence global 6G standards and deployments. We expect India to play a significant role in shaping the future of wireless communication worldwide.
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Union Budget 2026-27: ECMS Gets a budgetary Outlay of Rs 40,000 Crore, Big boost to Components Manufacturers in India
The Union Budget 2026-27 presented in the parliament on 1st February, 2026, allocates Rs 40, 000 crore to the Electronics Components Manufacturing Scheme (ECMS) launched last year in April. With a proposed budgetary outlay of around Rs 40,000 Crore for the Electronics Components & Manufacturing Scheme (ECMS), as compared to the previous outlay of Rs 22,919 crore during its launch in April 2025, the government intends to ensure that India’s electronics components game goes up globally. The outlay is being doubled even as the scheme “already has investment commitments at double the target,” and the near-doubling of the outlay will “capitalise on the momentum,” she says.
The increased budgetary outlay will highly benefit the electronics sector in India as it aims to promote the domestic manufacturing of electronics components that the nation really needs at this time, so as to become the real electronics hub globally. It promotes the manufacturing of Printed Circuit Boards (PCBs), lithium-ion Cells and other necessary electronics components used in modern-day devices ranging from mobile phones to automobiles.
Commitment to Mnaufacturing-led Growth
Commenting on the Budget, Mr. Pankaj Mohindroo, Chairman, ICEA, says, “Budget 2026–27 reinforces the government’s commitment to manufacturing-led growth, particularly in electronics and semiconductors, through continuity, scale, and targeted reforms.”India Cellular & Electronics Association (ICEA) is India’s apex industry body representing the entire mobile and electronics ecosystem. “Measures such as the expansion of ECMS, support for ISM 2.0, and long-term incentives for cloud and data infrastructure send a strong signal of strategic intent and policy stability,” he adds.
The EMS Component in GDP to Increase
The intent behind the budgetary outlay speaks volumes about the government’s vision for the electronics industry. Talking about this very thing, Mr Jasbir Singh, Executive Chairman and CEO, Amber Enterprises, welcomes the governmnet’s decision to increase the budgetary outlay. He says,” Cementing this further, the decision to establish high-tech tool rooms to manufacture high-precision components at scale and lower cost will propel India to become self-reliant and globally competitive.”
He also commends the government’s decision to rejuvenate 200 legacy industrial clusters, which will boost the EMS sector tonexponential growth. He adds,” These policies will increase the EMS contribution to the GDP, expected to be the third-largest.”
A Mighty Scheme
The scheme has approved 46 projects so far, attracting cumulative investments of ₹54,567 crore, with projected production valued at ₹3.68 trillion and the creation of over 50,000 direct jobs. Notified with a six-year budgetary outlay of ₹22,919 crore, the scheme envisages a total production of ₹10.34 lakh crore and employment generation for nearly 142,000 people. It is designed to lay the groundwork for a $500-billion electronics manufacturing ecosystem by 2030–31.
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Microchip Expands its Arm Cortex-M0+ Portfolio with PIC32CM PL10 MCUs
Building on decades of experience in serving embedded applications where low power, affordability and ease of development are critical, Microchip Technology has added PIC32CM PL10 MCUs to its PIC32C family of Arm Cortex-M0+ core devices. PL10 MCUs feature a rich set of Core Independent Peripherals (CIPs), 5V operation, touch capabilities, integrated toolsets and safety compliance. The device family targets high-volume applications including industrial control, building automation, consumer appliances, power tools and sensor-based systems. As part of the company’s unified MCU strategy, PL10 devices offer pin-to-pin compatibility with AVR MCUs.
The integrated Peripheral Touch Controller (PTC), along with a 12-bit Analogue-to-Digital Converter (ADC) are designed to provide responsive performance in touch applications and strong noise immunity for analogue signal measurement. Additional on-chip CIPs help offload time-critical, repetitive and deterministic tasks from the CPU to improve real-time performance and power efficiency. The PL10 supports the Cortex Microcontroller Software Interface Standard (CMSIS), enabling the development of modular, reusable application code to accelerate the process.
In addition to support from Microchip’s MPLAB development ecosystem, the PL10 family incorporates industry-standard tools and integrated development environments (IDEs), providing developers with more flexibility in how they build, debug, and deploy their software. Compatible third-party tools include Microsoft Visual Studio Code (VS Code), IAR Systems, Arm Keil, SEGGER, Zephyr and MikroElektronika. AI-driven resources such as the MPLAB AI Coding Assistant offer context-aware code generation and real-time product insights to help accelerate and simplify development.
“PL10 MCUs help engineers more easily migrate to higher performance microcontrollers while maintaining the straightforward development experience, power efficiency and cost structure of our established 8-bit solutions,” said Greg Robinson, corporate vice president of Microchip’s MCU business unit. “As we prepare to introduce a range of new microcontrollers over the next 12-18 months, with everything spanning entry-level to AI-capable devices, Microchip is strengthening its commitment to a comprehensive MCU portfolio designed to meet evolving market demands.”
The PL10 family is designed to comply with various industry safety standards, including International Organisation for Standardisation (ISO) 26262 for functional safety in electrical and electronic systems of road vehicles. Additionally, the MCUs are designed to operate from 1.8 to 5.5 volts, supporting performance in high-noise environments such as automotive, IoT, industrial automation and consumer electronics applications. PL10 MCUs enable simultaneous connection to devices operating at different voltage levels without external level shifters using the integrated Multi-Voltage I/O (MVIO).
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