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Panasonic Industry Europe announces the release of its new ECWFJ series of metallized polypropylene film capacitors, developed to support cost-effective designs while maintaining a high level of safety and long-term reliability. The new series is aimed at engineers working across industrial and automotive power electronics (it is qualified to AEC-Q200 standards) who require dependable performance under demanding environmental conditions.

The ECWFJ series demonstrates proven resistance to moisture, maintaining stable operation under conditions of 40°C and 95% relative humidity for up to 1.000 hours. This ensures long-term reliability even in humid environments, while still offering a cost-efficient solution. As a result, the capacitors are well suited for a broad range of industrial uses as well as automotive applications.

Typical application areas include electric mobility systems such as DC/DC converters, on-board chargers and e-compressors, along with solar inverters and EV charging infrastructure. The series is also designed for use in industrial power supplies, LED lighting, smart meters and embedded power systems, where consistent electrical performance and durability are essential.

Technically, the ECWFJ series covers voltage ratings from 600V up to 1.100V DC. Capacitance values range from 1µF up to 12µF. The capacitors operate across a temperature range from -40°C up to +110°C, with the 1.000V variant rated up to 105°C. The devices are engineered to withstand thermal shock from -55°C up to 85°C over 1.000 cycles and can tolerate maximum ambient temperatures of up to 125°C for limited durations.

Panasonic’s proprietary patterned metallization with an integrated fuse mechanism helps ensure stable capacitance over the lifetime of the component and enhances overall system reliability. The design is complemented by a flame-retardant plastic enclosure and non-conductive resin, supporting compliance with UL and other regulatory standards. In addition, the capacitors are fully compliant with RoHS requirements.

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​A team of researchers at Penn State University has now come up with a bio-hybrid device that pairs custom-synthesised human DNA with a perovskite crystalline semiconductor to present a new form of low-power data storage and computation. Their study was published in Advanced Functional Materials in the latest edition released August 17, 2026. Such a device may in time help reduce the energy used for powering AI computing centres and huge data centres, the scientists say.

The technology addresses a growing challenge in modern computing: the enormous energy required to model and process data. An increasing number of high-performance AI workloads and the overall compute and memory demand of data centres mean that there is pressure to find a more efficient way to store and process data.

The researchers used synthetic DNA – a chemically engineered molecule arranged into short molecular sequences and a crystalline perovskite semiconductor material (used in things like solar cells and electronics). The combined pair of these materials created a memristor: a type of electronic memory that retains clues about its past electrical experience.

Such technology could potentially go toward energy-efficient AI-computing hardware; as well as data centres and even the burgeoning field of neuromorphic computing by coupling the storage and processing information within the same device.

The development highlights a broader trend in semiconductor research: instead of relying solely on conventional silicon scaling, researchers are exploring biological materials, memristors and unconventional computing architectures to address the energy and memory demands of next-generation AI systems.

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Nuvoton Technology is preparing to begin mass production of its KA49703A and KA49713A battery monitoring ICs (BMICs) in September 2026. The devices are designed for Battery Backup Units (BBUs) used in AI servers, helping monitor battery-cell conditions and support reliable power management in high-performance computing systems. As AI servers become critical infrastructure supporting modern society, ensuring continuous operation requires highly reliable power systems capable of running 24/7 throughout the year. By leveraging the company’s proven automotive-grade daisy-chain communication technology in high-voltage 400V/800V BBU applications, the KA49703A and KA49713A help realize highly reliable and efficient power architecture.

Achievements:
1. Supports daisy-chain communication and connection of up to 55 devices, simplifying large-scale battery system design.
2. Incorporates a transportation and storage mode that extends storage duration and reduces operational costs.

Data centers are mission-critical infrastructure that must operate continuously without interruption. Consequently, their power systems require exceptional reliability and stability. In recent years, the rapid growth of generative AI and cloud services has significantly increased AI server power consumption, driving demand for higher efficiency and reliability in power delivery systems.

At the same time, adoption of 400V and 800V high-voltage power architectures is accelerating to improve power efficiency,
while server and power-system densities continue to increase. These trends require battery systems not only to provide safe
monitoring under high-voltage conditions but also to ensure long-term reliability and low thermal generation during continuous
operation.

Battery systems are no longer simply backup power sources for outages. They now play an increasingly important role in
absorbing instantaneous power fluctuations, protecting systems, and ensuring service continuity, making them foundational
technologies for modern data centers and communication infrastructure.

Building on its proven automotive daisy-chain communication technology, Nuvoton has developed the KA49703A and KA49713A battery monitoring ICs for high-voltage 400V/800V BBUs used in industrial and infrastructure applications. Mass production is scheduled to begin in September 2026.

The KA49703A and KA49713A can accurately monitor up to 16 battery cells while integrating communication functions for high- voltage systems and safety features such as cell anomaly detection, addressing the demanding requirements of next generation energy storage systems.

Features of New Product:

1. Daisy-Chain Communication Supporting up to 55 Devices
AI-server BBUs and Energy Storage Systems (ESS ) operating at 400V/800V levels require large numbers of lithium-ion battery cells connected in series. Conventional battery monitoring systems typically require a dedicated MCU and isolation device for each monitoring IC. As cell counts increase, component count and communication wiring also increase, creating challenges in communication reliability and system complexity.

To address these issues, the KA49703A and KA49713A incorporate daisy-chain communication technology. Multiple battery monitoring ICs can be connected in series, enabling systems with up to 55 devices while minimizing wiring requirements and ensuring robust communication even in high-voltage environments. This architecture reduces the need for additional MCUs and isolation components, simplifying system design, reducing component count, minimizing board space, and improving overall reliability. The compact QFP-48 package (7 mm × 7 mm) also helps address the stringent space constraints found in AI server BBUs. Combined with high-precision voltage measurement accuracy of ±2.9 mV, the device enhances both monitoring performance and safety in next-generation power systems.

2. Transportation and Storage Mode Reduces Maintenance Costs

AI-server BBUs and large-scale ESS installations contain numerous lithium-ion cells and are often transported over long distances by ship or truck. Minimizing power consumption during transportation and storage is therefore essential.

However, conventional ICs incorporating daisy-chain communication typically exhibit increased shutdown current, leading to
battery drain during storage and transport.

To solve this issue, the KA49713A incorporates a dedicated transportation and storage mode that reduces shutdown current to less than 0.1 μA.

This significantly minimizes battery depletion during transportation and storage, extends allowable storage periods, reduces recharge requirements, and contributes to lower operating costs.

These battery monitoring ICs enable customers to address increasing power demands in the AI era and the transition toward higher-voltage power systems. They support improved reliability and operational efficiency in energy storage systems for data centers, industrial equipment, and social infrastructure.

Through continued expansion of its BM-IC product lineup, Nuvoton will further advance battery monitoring technologies and contribute to realizing a sustainable and highly reliable energy society.

Applications:

・Battery Backup Units (BBUs) for AI servers
・Large-scale Energy Storage Systems (ESS)

Product name:

Industrial Battery Monitoring ICs
・KA49703A
・KA49713A

Specifications:

Start of mass production:

Sep. 2026

Definitions:

• BBU (Battery Backup Unit). A backup power system equipped with rechargeable batteries, such as lithium-ion batteries, that supplies power during outages or momentary voltage drops.
• Daisy-Chain Communication. A communication method in which multiple monitoring ICs are connected in series. It reduces wiring complexity while providing high immunity to electrical noise.
• ESS (Energy Storage System). An energy storage system used for renewable energy integration, peak load management, and power supply-demand balancing.

 

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The Defence Research and Development Organisation (DRDO) has put EW (Electronic Warfare), digital twins and mission critical systems as the focus for its NETRA-2026 national seminar held in Bengaluru. As representatives from Armed Forces, DRDO, ISRO and industry and academia met on August 11 and 12 to deliberate over future battlespace-enabling technologies, emerging technologies like EW and RF systems, AI, next-gen radar, FPGA design, digital engineering, modelling and simulation took centre stage for discussion. These technologies are finding an increasing inter-relationship in present-day combat platforms where dominion of the electromagnetic spectrum is crucial in determining operational capability of not just sensors and communication, but also weapon systems.

In fact, electronic warfare, or EW, is playing an increasingly important role in a way in military activities since warfighting is getting to lean more and more towards combatting with and around networked systems, radar, and the use of wireless signals. EW includes the capability of using EM-spectrum visibility and analysis (EVS/A) and threat awareness, together with such capabilities as electromagnetic countermeasures (ECM). Providing digital models and mission-critical design can thus demonstrate how complicated networks can be tested without their being produced.

NETRA-2026 clearly indicates the DRDO’s emphasis on establishing technological building blocks to prepare for a network centric, AI-enabled and electronically contested battle scenario where informational and electromagnetic advantages are as significant as conventional firepower.

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India’s Electronics Component Manufacturing Scheme (ECMS) has green lighted the setting up of 31 new projects with a proposed investment of Rs 7,877 crore – taking it one step closer to increasing India’s footprint in electronic goods production and cutting import dependence. New sanctions reported on August 17, 2026. The new proposals are expected to drive production worth over Rs 82,243 crore and create nearly 10,000 direct jobs spread across ten Indian states.

The development is extremely beneficial to India’s defence electronics ecosystem. This includes the defence, radar, avionics, surveillance, electronic warfare, communications and unmanned systems sectors where indigenous and secure supply of components would add to the robustness of their systems.

The latest projects cover a broad range of components, including capital goods, camera and display modules, connectors, anode materials, enclosures, antennas, rare-earth permanent magnets, speakers and microphones, and metallised films for capacitors and coils. These components can support multiple high-technology industries, including defence, telecommunications, automotive, industrial electronics and aerospace.

The recently issued approvals for ECMS can hence be viewed both as a defence electronics manufacturing policy as well as a nascent strategic industry-capacity development program. With rising India defence production and exports, a deeper electronics supply chain would help India realise its ambitions of becoming a manufacturing and innovation hub by design.

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Indrajaal Autonomous Defence Systems and Sigma Advanced Systems have received government orders totalling around Rs 155 Crore for Indrajaal Ranger, a mobile drone patrolling vehicle for use at the border, in urban areas, and other places to tackle threats that need quick and agile response. This moves the counter-unmanned aerial system (C-UAS) away from static security measures at military bases. The companies stated that around 145 Crore of the current orders would be used for border security, while another order of Rs 10 Crore will be used for VVIP protection and other security scenarios.

The Indrajaal Ranger drone is a mobile counter-drone system capable of detecting and fighting unmanned aerial threats. Indrajaal Ranger is mobile and can function in multiple terrain sand condition, making its induction in this era a necessary step, as drones are becoming increasingly ubiquitous. Mobile platforms help security personnel to effectively deploy anti-drone solutions wherever needed, such as for guarding the borders, VVIP corridors, critical infrastructures and cities, unlike a stationary counter-drone facility.

The development also underscores the rising influence of Indian private sector enterprises in the country’s counter-UAS landscape, with the new order poised to accelerate the adoption of mobile counter-drone technology from exploratory defence platforms to broad operational use to improve both detection and reaction time to low-altitude threats.

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India’s Ministry of Defence signed a contract worth Rs 1,943 Crore with General Atomic Aeronautical Systems Inc. Of the US for leasing of two unmanned remote piloted aircraft systems (remotely piloted aircraft) or drones- the MQ-9B Sea Guardian High-Altitude Long-Endurance (HALE)- for Indian Navy on July 17, 2026, for 30 months. The purchase marks a boost to India’s maritime surveillance capabilities.

The long-endurance unmanned aerial vehicle MQ-9B Sea Guardian is suited to sustained ISR operations, and its endurance and sensor load would allow it to monitor large areas of the ocean and help with India’s maritime domain awareness needs. The leased platforms will give the Navy added airborne surveillance capability without the need to purchase permanent platforms immediately. They also arrive at an interesting time, with India pushing the observation of the Ocean area, where long-range UAVs would allow constant monitoring.

The lease also comes against the backdrop of India’s wider use of the MQ-9B technology and systems. Previously in 2024 itself, India has separately contracted for 31 MQ-9B Sky/Sea Guardian RPAS for its military operations. This further leasing underlines India’s increased use of HALE unmanned systems for routine sea-based surveillance, intelligence gathering, and strategic assessment.

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​With EV manufacturers aiming to boost the vehicle’s travel range, fast-charging capabilities, and powertrain efficiency, semiconductor technology is becoming an important part to the development of electric vehicles. Bosch’s third-generation silicon carbide (SiC) semiconductors, developed to enhance the efficiency and performance of EV power electronics, is an achievement in India’s electric-mobility ecosystem. Sample chips are currently shipping to global automakers for testing, with full commercial market availability targeted for 2027.

20% Higher Performance

Bosch’s third-generation Silicon Carbide (SiC) chips support advanced dual-channel trench architecture, a specialised transistor design that improves current transmission efficiency and the overall system power-conversion efficiency by lowering down the resistance and loss during device switching. The chips are designed to meet the demanding power-efficiency and performance requirements of modern electric vehicles.

This technology offers around 20% more performance than the previous generation of chips. According to Bosch, its SiC technology should help to boost the driving range, battery utilisation and reduce the overall cost of ownership to owners of EV vehicles.

Silicon carbide technology can reduce power loss for the energy conversion process and thus can increase the power efficiency. The reduction of loss can also decrease the generation of heat inside the inverter, lowering the system’s cooling requirements.​

Supporting India’s EV Ecosystem

The introduction is particularly relevant as Indian automakers and component suppliers increasingly localise EV technologies and develop higher-efficiency powertrains. Advanced semiconductor devices such as SiC MOSFETs can play a key role in this transition by improving inverter performance without requiring proportionally larger battery packs.

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​Mahindra & Mahindra has introduced its latest BE 6 SPORTEQ electric SUV in India, bringing a new set of AI features and connected technology that works efficiently with its software-powered EV. Launched on August 15, the new series represents an effort to introduce advanced AI features with upgradable software rather than relying on conventional hardware improvements.

To provide an immersive experience, Mahindra has introduced a new feature named TEQ_Talk for the BE 6 SPORTEQ. It’s a conversational AI assistant developed in collaboration with Google Cloud using Gemini technology. According to Mahindra, it integrates 17 specialised AI agents and offers over 100 functions for vehicle controls, navigation, music, applications etc. Through this, drivers can talk to their car like a real person instead of being confined to a specific set of voice commands.

Another area of emphasis is the BE 6’s software-defined vehicle architecture. Mahindra claims that the vehicle will continue to improve after sale through software. From January 2027, further SPORTEQ features will be launched in phases, with access subject to the specific model and variant.

Software plays a part beyond infotainment. In the new BE 6 SPORTEQ, for example, are Drift Mode and Acceleration Boost that can modify performance and handling, and the Digital Car Key. For example, Drift Mode and Acceleration Boost that can modify performance and handling and Digital Car Key. These enable owners to unlock and access vehicles with their smartphones and similar devices.​

The BE 6 SPORTEQ represents an extension of a bigger trend in the Indian EV market – technology areas, beyond batteries and the powertrain, such as artificial intelligence, cloud connectivity, OTA and software-define architectures (SDAs), are gaining more consumer attention and opening new avenues to deliver continually enhanced features over the automobile’s usage life to customers and car manufacturers.

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ASMPT SMT Solutions, the global market and technology leader in integrated hardware and software solutions for electronics manufacturing, will present its latest solutions for the intelligent factory at Productronica India in Bengaluru from September 16 to 18, 2026. The highlight at Booth H4.E11 will be the launch of the new SIPLACE V placement platform in India. Visitors can also experience a live demonstration of large BGA placement for AI server applications on the SIPLACE SX, complemented by the highly precise DEK TQ printer. Software solutions for monitoring, managing and optimizing SMT production are another focus of the presentation.

Up to 30% more real performance

Developed from the ground up, the SIPLACE V combines significantly higher real performance with flexibility, process excellence and long-term investment protection. A new machine architecture with a highly rigid frame, efficient linear drives and high-resolution measurement systems enables higher acceleration and shorter non-productive movements. Under real production conditions, the platform achieves performance gains of up to 30 percent in key electronics manufacturing sectors. At Productronica India, ASMPT will demonstrate the SIPLACE V at a benchmark placement rate of more than 52,000 components per hour. Single- and dual-lane configurations, Smart Pin Support and compatibility with existing SIPLACE X feeders give manufacturers considerable flexibility in configuring the platform. High-resolution vision systems, individual component inspection and closed-loop sensor technology help ensure consistently high process quality even at high placement speeds. Also on display is the SIPLACE Measuring Feeder, which measures electrical component properties before placement.

Ready for AI server boards

A second live demonstration addresses one of the major challenges facing electronics manufacturers: the production of AI server boards. These combine extremely high component densities with increasingly large and heavy processor BGAs. Component dimensions of up to 150 × 150 millimeters and weights of more than 500 grams are no longer unusual. The SIPLACE SX at the booth will demonstrate the placement of large BGAs for AI server applications. The proven platform can be equipped with the TWIN VHF placement head for large and heavy processor BGAs, while its heavy-duty conveyor handles boards weighing up to ten kilograms. SIPLACE Smart Pin Support automatically positions support pins to prevent large boards from bending during placement. The DEK TQ printer complements the AI server presentation with solder paste printing for large-format boards.

Intelligent data use increases yield and performance

“We boost your intelligent factory” is ASMPT’s key message at Productronica India – and the presentation extends well beyond hardware. The WORKS Software Suite demonstrates how software can make production processes more transparent, support operators in their daily work, and help manufacturers make better use of production data. Real-time production KPIs make deviations and trends visible at an early stage. Combined with data from SPI and AOI systems, AI-based analysis helps identify the causes of printing and placement process deviations, automatically optimizes the printing process, and provides concrete recommendations for improving the placement process.

Additionally ASMPT will showcase its Factory Solutions, with SMT Analytics demonstrating how intelligent data use can help increase yield and performance. Another highlight is the latest version of Virtual Assist, ASMPT’s AI-based expert system for onboarding, service and maintenance. Its enhanced AI chat function now enables a continuous dialogue, allowing users to ask follow-up questions and refine their queries. A new image-based spare-parts recognition function also identifies likely matches from a smartphone photo of a disassembled part. ASMPT will also present its new Customer Portal at the booth.

“With the launch of the SIPLACE V in India, our live demonstration production of AI server boards and our latest software solutions, we are showing how advanced hardware, software and intelligent data use work together in future-ready electronics manufacturing,” says Mr Neeraj Bhardwaj, General Manager for India, Bangladesh & Sri Lanka at ASMPT SMT Solutions India. “Electronics manufacturers need more performance and flexibility, but they also need to make better use of their production data and automate processes where it makes sense. That is exactly what we want to demonstrate at Productronica India.”

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Reliance Industries and British aerospace and defence company Rolls-Royce have announced their strategic intent to partner on the design, development, manufacturing and delivery of a sovereign indigenous combat engine for India’s Advanced Medium Combat Aircraft (AMCA) programme. The announcement was made on August 14, 2026, marking a significant development in India’s efforts to build advanced aerospace and defence capabilities domestically.

Under the proposed collaboration Rolls-Royce’s expertise in Aerospace propulsion and gas-turbine technology would be teamed with Reliance’s industrial and manufacturing capabilities in India. In addition, the two parties propose to examine the feasibility of setting up a specialized Aerospace Gas Turbine Complex.

The combat engine is one of the most technically challenging elements of a modern fighter aircraft. Developing such an engine requires expertise in areas including high-temperature materials, compressors, turbines, combustion systems, cooling technologies, digital engine controls and advanced manufacturing.

Developing indigenous propulsion for the AMCA program can ease India’s future dependence on the international engine suppliers. It will strengthen the in-country capacity in India’s aerospace supply chain and contribute significantly to India’s long-term objectives of Atmanirbhar Bharat and defense-indigenization programs.

The partnership represents a potential shift from simply manufacturing or assembling imported propulsion systems toward co-development and indigenous technology creation. If successfully implemented, the initiative could strengthen India’s capabilities in high-thrust aircraft engines, create specialised aerospace manufacturing opportunities and support the development of domestic intellectual property.

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What’s New?

Ather Energy, one of India’s leading electric two-wheeler manufacturers, announced the introduction of its new Ather 450X Overtones Series in Nepal, expanding its product portfolio in the company’s earliest international market. Alongside the new 450X Overtones, Ather is also taking its latest technology and ride experiences to the market, with Magic Twist, Infinite Cruise and Voice on Ather, now available on the 450 Series in Nepal.

What Senior Employee of Ather Company said?

Speaking on the occasion, Ravneet Singh Phokela, Chief Business Officer, Ather Energy Limited, said: “Since we entered Nepal in 2023, we’ve seen a strong response to Ather, and that’s translated into incredible growth for us in the market. We’ve significantly expanded our footprint, built out our retail, service and charging network, and grown the portfolio from the 450 to include Rizta. The 450X Overtones Series further strengthens that portfolio, bringing a fresh take on the 450, giving customers more choice while carrying forward some of the latest technologies shaping the Ather experience today. We’re looking to build on that momentum, and Nepal remains a market we’re committed to growing steadily over the long term.”

Ather entered Nepal in November 2023 with the 450 Series, marking its first international market. Since then, the company has built out its presence across the country through 14 experience centres and 31 fast charging points via its national distributor, Vaidya Energy Pvt. Ltd. In 2025, Ather added the Rizta to its portfolio in Nepal, bringing a family-focused offering centred around comfort and convenience. The introduction of the 450X Overtones now further expands the 450 Series offering in the market.

The new 450X Overtones brings a fresh design treatment to the 450, with a tone-on-tone finish across three colourways: Still White, Space Grey and Lunar Grey. Different textures and finishes across the scooter accentuate its form while retaining the distinctive design and performance-focused character of the 450 Series.

Alongside the new design, the 450 Series in Nepal now features technologies such as Magic Twist, Infinite Cruise, as well as Voice on Ather, which was recently rolled out in India. Magic Twist allows riders to decelerate by twisting the throttle backwards, using regenerative braking to slow the scooter while recovering energy. Infinite Cruise helps maintain a consistent speed with reduced throttle input, while Voice on Ather, powered by AtherStack 7.0, enables riders using a compatible Bluetooth headset or smart helmet to use voice commands for functions such as navigation, locating charging stations, and controlling supported scooter settings.

Ather has continued to build out its presence in international markets. In Sri Lanka, the company now operates 42 experience centres. This sits alongside a network of 715 experience centres in India, as the company continues to scale its presence market by market.

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India’s electric vehicle industry is rapidly emerging as a significant force in the global automotive market, with electric car exports reportedly reaching approximately $369 million in Q1 2026. This development signals a new phase for India’s EV sector, positioning domestic manufacturing increasingly for international markets.

Sharing his optimism regarding the e-mobility segment in India, Dr. Rajeev Mishra, President, IFEVA (International Federation of Electric Vehicle Association), said, “Make in India is now evolving into Made in India, made for the World.” He highlighted the growing potential of India as a global electric mobility manufacturing and export hub.

India as a Global EV Powerhouse

Dr. Mishra emphasised that India’s EV ambition should go far beyond increasing domestic EV sales. “India must transition from being an EV-consuming market to becoming a Global EV Manufacturing, Technology, Innovation and Export Hub. Our objective should be to build Indian EVs not only for India, but for the world.”

India’s next phase of growth, according to him, must focus on EV manufacturing, batteries, power electronics, components, charging infrastructure, testing and certification, R&D, software, skill development and global supply-chain integration. He further stressed the importance of collaboration between government, industry, MSMEs, startups, academia, research institutions, investors and international technology partners to build a globally competitive EV ecosystem.

“$1 billion quarterly EV exports should be the next milestone,” Dr. Mishra averred, calling for a clear national ambition of taking India’s quarterly electric vehicle exports towards $1 billion. He said achieving this target would require stronger localisation, world-class quality standards, technology innovation, competitive financing, robust testing infrastructure, global certifications and strategic international partnerships.

Europe Emerging as a Key Opportunity

Europe is becoming an important destination for Indian electric vehicles, driven by stringent emission regulations, the transition towards clean mobility and increasing demand for cost-effective and technologically capable EVs. India’s expanding manufacturing ecosystem, competitive production capabilities and growing localisation of EV components are strengthening its position in the international market.

Three Forces Driving India’s EV Export Momentum

Government Manufacturing Support: Policy initiatives and manufacturing incentives are helping strengthen India’s EV and advanced battery ecosystem while encouraging investment and localisation.

Atmanirbhar Bharat: Expanding domestic manufacturing and supply chains creates a stronger foundation for Indian and global automotive companies to manufacture in India and serve international markets.

Global EV Transition: As countries accelerate the shift towards electric mobility and diversify global supply chains, India has an opportunity to emerge as a major “China+1” manufacturing destination.

EVs Can Become a New Engine of India’s Growth

The growth of electric mobility can generate opportunities across manufacturing, engineering, electronics, batteries, software, charging infrastructure, logistics and associated services, while strengthening India’s foreign-exchange earnings and global industrial footprint. Dr. Mishra said the EV revolution can become an important pillar of India’s broader journey towards Viksit Bharat 2047, strengthening both economic and energy security.

Dr. Mishra reiterated IFEVA’s commitment to creating stronger platforms for industry collaboration, policy dialogue, technology exchange, skill development, investment facilitation and global partnerships in electric mobility. “The opportunity before India is not merely to manufacture more electric vehicles. The real opportunity is to make India one of the world’s most trusted destinations for electric mobility innovation, manufacturing and exports.”

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A pilot project has been planned at NTPC Simhadri Thermal Power Station to evaluate an indigenous Iron-Air Battery technology for Long-Duration Energy Storage (LDES) applications. The project will be implemented by Atal Incubation Centre – Anna University (AIC-AU) at NTPC Simhadri through its technology partner, Meine Electric, with the objective of assessing the technology under utility operating conditions.

Role of Pilot Project

The pilot project will evaluate the technical performance, operational reliability and operational characteristics of the indigenous Iron-Air Battery system under real world conditions. The study is expected to generate valuable operational data and insights into the suitability of the technology for long-duration energy storage applications, enabling reliable 24×7 clean energy, enhancing grid flexibility and supporting future applications that require enhanced operational flexibility.

What Makes Meine Electric’s Iron-Air LDES Technology Different?

Meine Electric is the first company in APAC and the third globally to pioneer Iron-Air Long-Duration Energy Storage (LDES) technology. Its proprietary Fast Charge Long Discharge (FCLD) technology, which enables a six-hour charge and 18-hour discharge, has also been independently validated by Customized Energy Solutions (CES), the parent company of the India Energy Storage Alliance (IESA). CES Battery Laboratory testing assessed the technology’s electrochemical performance, capacity retention and operational stability under a 6-hour charging and 18-hour discharging cycle, providing third-party validation as Meine Electric advances towards larger scale demonstrations and commercial deployment.

As India continues to expand its renewable energy capacity, long-duration energy storage is expected to play an increasingly important role in improving grid reliability, managing renewable energy variability and supporting a more flexible and resilient power system. The pilot project is expected to contribute towards the development and evaluation of indigenous energy storage technologies while generating valuable learnings for future applications.

Through the AIC-Anna University initiative, Meine Electric will be responsible for the development, system integration and performance monitoring of the Iron-Air Battery system. The operational data and technical insights generated during the pilot will provide an important benchmark for further technology development and future commercial-scale deployment.

Speaking on the collaboration, Mr. Priyansh Mohan, Co-Founder & CEO, Meine Electric, said:

“We are honoured that our indigenous Iron-Air Battery technology has been selected for implementation under this pilot project planned at NTPC Simhadri Thermal Power Station. The project provides an important opportunity to demonstrate the technology under utility operating conditions and generate valuable performance data that will help accelerate the development of cost-effective long-duration energy storage solutions for India’s evolving power system.”

Speaking on the partnership, Shri Kishore Kumar.S, CEO, AIC – Anna Incubator, said:

“Our mission is to catalyze high-impact innovations that solve critical national challenges. Supporting Meine Electric in deploying India’s indigenous Iron-Air Battery technology at NTPC Simhadri is a major step toward achieving scalable, long duration energy storage. This collaboration highlights how academia, startups, and public sector leaders can work together to strengthen India’s clean energy ecosystem and accelerate our transition to a resilient, sustainable grid.”

The initiative reflects the growing emphasis on indigenous innovation, advanced energy storage technologies and collaborative research aimed at supporting India’s clean energy transition and strengthening long-term energy security.

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Pixus Technologies, a provider of embedded computing and chassis solutions, has announced a MIL Ruggedized NI software defined radio (SDR) with extended temperature options. Now a part of Emerson, the NI SDR is based on the family of Ettus brand Universal Software Radio Peripherals (USRPs).

Pixus ruggedizes various versions of NI SDRs in IP67 outdoor and full MIL rugged qualified versions.  The new RN310 version has options for an external MIL grade fan that pulls air over the conduction-cooled fins on the enclosure as well as an internal heater board.  This allows the units to meet -40C to +71C applications.

Pixus offers MIL rugged and commercial enclosure solutions in VITA based architectures such as OpenVPX, as well as specialty customized solutions like the rugged NI SDRs.   The company has also developed two-in-one dual USRP versions in a 1U format with superior front to rear cooling.

 

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As AI infrastructure, industrial robotics, battery management systems (BMS) and advanced power electronics drive increasing power density and efficiency requirements, accurate current sensing is becoming increasingly critical. According to market analyses, the global current-sense resistor market is projected to expand at a CAGR of approximately 6% through the coming years, reflecting growing demand across battery management, motor control and power conversion applications.

At the same time, engineers are under increasing pressure to improve energy efficiency and reduce system costs while maintaining measurement accuracy in higher power designs. To address these challenges, Panasonic Industry offers its Thick Film Current Sensing Resistors as a cost-effective alternative to conventional metal shunt resistors for selected low- and medium-current sensing applications.

Current sense resistors play a vital role in measuring electrical current and enabling its monitoring and control in applications ranging from AI server power systems and industrial robotics to battery management systems, DC/DC converters, motor drives and advanced power supplies. Accurate current detection and control support improved system performance, system protection and higher energy efficiency.

Traditionally, metal shunt resistors have been widely used for current sensing, particularly in applications requiring very low resistance values and high power-handling capabilities. However, not all current-sensing applications require ultra-low resistance values or the highest power ratings. In low- and medium-current designs with suitable electrical and thermal requirements, thick film current sense resistors can provide the required sensing performance while helping to reduce component cost.

Panasonic’s Thick Film Current Sense Resistors support efficient and accurate current measurement in low- and medium current applications where low resistance, thermal stability and cost efficiency are key design considerations. By combining advanced resistor materials, optimized trimming technology and different structural designs, including double-sided resistor structures and wide-terminal designs, Panasonic offers resistance values down to 10 mΩ, with stable resistance performance over temperature and TCR values as low as ±75ppm/°C in selected series.

A key challenge in current sensing is balancing low resistance with a low temperature coefficient of resistance (TCR), as these requirements typically involve a trade-off. Panasonic addresses this challenge through optimized resistor materials and component structures that support accurate current measurement, low power loss through low resistance values, improved heat dissipation and reduced temperature-induced drift.

For engineers working within the operating range in which thick-film and metal-shunt technologies overlap, Panasonic’s Thick Film Current Sensing Resistors offer several important advantages:

• Potential component cost savings of up to 50% compared with selected comparable metal shunt solutions in suitable applications*
• Improved heat dissipation through optimized component design, such as wide-terminal structures and double-sided resistive element structures, helping to lower operating temperatures and enhance thermal performance.
• Enhanced reliability under thermal cycling, supported by soft termination technology that helps reduce solder-joint stress.
• Supports accurate current sensing with resistance values down to 10mΩ, stable resistance performance over temperature and TCR values as low as ±75ppm/°C in selected series.
• Simplified migration through footprint-compatible designs available in selected case sizes, supporting the replacement of metal shunt resistors within the overlapping operating range.

Panasonic’s Thick Film Current Sense Resistors are already proven in customer applications and are particularly suited to AI infrastructure, robotics, battery management systems, motor control, power supplies and industrial automation systems, where designers seek to optimize both cost and performance.

As designers look for ways to improve efficiency, reduce thermal stress and manage bill-of-materials costs, Panasonic’s Thick Film Current Sensing Resistors offer a practical, cost-effective option for low- and medium-current sensing applications that require accurate measurement, thermal stability and reliable performance.

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MongoDB, Inc. today announced at MongoDB .local Build Fest that MongoDB’s intelligent data platform is now available natively inside the AI tools developers use to build applications. Available today, MongoDB Atlas Managed MCP Server is a fully hosted way to connect agents to Atlas without running additional infrastructure. Builders can now easily add MongoDB Atlas to Claude Code, Codex, Grok Build and Devin. Everything announced today is available now, and teams can get started with Atlas for free at mongodb.com/atlas.

“The AI tools teams reach for keep changing, so our approach is to make sure MongoDB is present in all of them, whether a team is working in Claude or Codex, or running an agent in production. More of that building is now done by agents, and neither the agent nor the developer has to stop and set up a connection, so applications come together faster,” said Pablo Stern-Plaza, Chief Product Officer, AI and Emerging Products, MongoDB.

With the new connectors, MongoDB is available natively across the tools where software is built. Ask questions of data in plain language in ChatGPT, Claude, and Grok. Query, inspect, and update data in MongoDB as work happens, with coding agents like Claude Code, Codex, Grok Build and Devin. And builders can also see live MongoDB data while generating an app in an IDE like Cursor.

Getting connected with these tools takes only a few clicks. Find the MongoDB connector in the tool’s marketplace and authorize it, with no connection string to paste and no infrastructure to configure. Once connected, the tool can list collections and indexes, query and aggregate data, and inspect schemas—and with the right permissions—can also create collections or manage indexes.

Introducing the MongoDB Atlas Managed MCP Server

Running an agent in production means connecting it to real operational data and agent memory, and until now, teams had to build and maintain that connection themselves. MongoDB’s MCP server already sees more than 30,000 installs a week. Starting today, the MongoDB Atlas Managed MCP Server is remote and fully hosted, running as a service inside Atlas, so there is nothing for a team to install, operate, or upgrade. Teams connect using the same credentials and access controls they already use with Atlas, so administrators can govern how agents access operational data from one place.

“Developers want their AI tools to connect with the context and systems they already rely on,” said Vibhor Chhabra, Product Lead for ChatGPT Ecosystem at OpenAI. “MongoDB’s plugin in ChatGPT makes it easier to access and work with live application data, helping developers move faster while staying grounded in the context of their applications.”

“We’re in the golden age of software engineering. The scope of what one engineer can build has exploded, and the unlock is agents working with real context,” said Russell Kaplan, President at Cognition, the company behind Devin. “By connecting Devin to MongoDB Atlas, engineers can hand off well-scoped tasks knowing Devin is working from live application data, not stale assumptions, and spend their own time on the harder problems.”

MongoDB also announced at Build Fest new capabilities that bring its benchmark-leading Voyage AI retrieval models into the operational database, including Automated Embeddings in MongoDB Atlas powered by Voyage AI, the Atlas Embedding and Reranking API, and voyage-code-4: https://www.mongodb.com/company/newsroom/press-releases/mongodb-atlas-now- delivers-industry-leading-context-retrieval-with-precision-accuracy

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The growing New Space market is fueling demand for smaller, less expensive space hardware to support short-duration missions for applications such as satellite-to-cellular communications, alternative navigation and Earth imaging. Microchip Technology today announces it expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems. The device provides a compact, low-power alternative to traditional radiation-hardened timing solutions, helping developers reduce size, weight, power and cost while maintaining accuracy.

Building on the heritage of Microchip’s Space CSAC-SA45, the Space CSAC-SA65 extends radiation tolerance to at least 30 kRad and operates in extended temperature ranges from –40°C to +80°C. Consuming less than 120 mW and occupying less than 17 cc of volume, the device is optimized for size-, weight- and power-constrained satellite designs. Its built-in 1 PPS input and output capabilities support synchronization for satellite systems, while its atomic stability enables extended operation without continuous reliance on external timing references such as Global Navigation Satellite System (GNSS) signals.

“By enabling one of the lowest power atomic clocks to thrive in extreme conditions, even the smallest CubeSat can now fly with atomic accuracy,” said Randy Brudzinski, corporate vice president of Microchip’s frequency and time systems business unit. “The Space CSAC-SA65 brings atomic-clock performance to applications where size, weight, power and cost are tightly constrained, helping developers maintain synchronization and timing accuracy even when external timing references are unavailable.”

Manufactured as a Commercial Off-The-Shelf (COTS) product using radiation-tolerant commercial electronic components, the device can offer shorter lead times and lower overall costs compared to traditional space-grade oscillators. Designed for Low Earth Orbit (LEO) missions, the CSAC-SA65 is well suited for applications including satellite timing and frequency control, satellite clock reference, assured positioning, navigation and timing (PNT), and satellite cross-linking.

Microchip offers an extensive portfolio of clock and timing systems, ranging from miniature component oscillators, to small plug-in timing server cards, to multi-rack time scale systems. As a primary contributor to the world’s time, Microchip’s timing solutions are trusted, reliable and resilient. For more information, visit Microchip’s Clock and Timing Systems web page.

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STMicroelectronics has extended the STGAP3S family of gate drivers that feature enhanced galvanic isolation for greater reliability, introducing an efficient and economical 3A series for circuits that need lower drive current. The new STGAP3S3S is optimized for silicon carbide (SiC) MOSFETs, while the STGAP3S3IF is suited to IGBTs.

All STGAP3S drivers work with high-voltage rails up to 1200V in circuits such as power-factor correction (PFC), power supply units, DC/DC converters, and inverters. International safety and insulation certifications, including UL 1577 and IEC 60747-17, independently confirm robust isolation, safe operation, and reliable long-term performance at high voltage.  Typical applications include charging stations, energy-storage systems (ESS), solar inverters, industrial electric vehicles like forklifts, induction heating equipment, and general drives, pumps and fans.

ST’s state-of-the-art reinforced galvanic isolation protects the power-stage circuitry against transients up to 9.6kV and ensures Common Mode Transient Immunity (CMTI) up to 200V/ns. The family contains three series capable of sinking/sourcing up to 10A, 6A, and now 3A, each containing variants optimized for driving IGBTs and silicon-carbide MOSFETs.

The new STGAP3S3 series, with 3A drive strength, integrates the complete active Miller clamp, including clamping MOSFET, to prevent unwanted induced turn-on of the power switch thereby avoiding shoot-through currents. Integrating the MOSFET saves PCB space, simplifies the circuit design, and reduces the bill of materials, while providing suitable clamping performance with gate drive up to 3A. The 6A STGAP3S6 and 10A STGAP3SX series contain a pre-driver for an external MOSFET, giving extra flexibility to optimize the clamping speed in systems with high gate-drive current.

All STGAP3S drivers have desaturation detection with soft turn-off to ensure controlled voltage and current transitions, which protects the power switch during dangerous overload or short-circuit conditions. The 6A and 10A drivers, and the new 3A drivers for SiC MOSFETs, let designers connect an external resistor to optimize the soft turn-off speed.

All devices have diagnostic pins that indicate when desaturation protection, undervoltage-lockout UVLO, and thermal shutdown are active. The drivers allow negative gate voltage that strengthens unwanted turn-on prevention, protects the device during fault turn-off, and ensures robust switching without ringing during normal turn-off transitions.

An evaluation board is available for each STGAP3S driver, including the latest 3A models. These two boards, the EVLSTGAP3S3S and EVLSTGAP3S3IF, are half-bridge boards that come with protection already configured and provide test points and diagnostic LEDs to assist development.

The complete STGAP3S family for driving IGBTs and SiC MOSFETs, including STGAP3S3, STGAP3S6, and STGAP3SX series, is in production now. The drivers are offered in the SO16W wide-body package, from $1.93 for orders of 1000 pieces.

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New TCAN6062 CAN XL transceiver delivers the highest bandwidth and largest payload of any CAN-based network while preserving the advantages of proven CAN protocols.

What’s new?

Texas Instruments (TI) today introduced the industry’s first commercially available CAN XL transceiver, designed to help industrial engineers keep pace with the growing data demands of modern networks. TI’s TCAN6062 Controller Area Network (CAN) extended data-field length (XL) transceiver supports payloads up to 2,048 bytes per frame and data rates as high as 20Mbps, while ensuring that priority messages are delivered first and on time with the performance on which humanoid robots, industrial robots and human-machine interface (HMI) systems depend.

The TCAN6062’s backward compatibility with CAN flexible data rate (FD) and CAN signal improvement capability (SIC) operations enables seamless migration to CAN XL, allowing teams to evolve existing designs incrementally without requiring a full redesign. Additionally, the transceiver allows engineers to consolidate communication layers and use Ethernet in mixed network architectures with Transmission Control Protocol/Internet Protocol (TCP/IP) tunneling, enabling efficient transfers of diagnostics, sensor data, control traffic and over-the-air updates on a single network.

Why does it matter?

Industrial systems are generating and demanding more data than ever before, with applications requiring fast, deterministic communication to synchronize motion control, sensor feedback and diagnostic data. These applications have introduced new networking requirements, often leading engineers to accept system-level trade-offs to compensate for bandwidth constraints. TI’s TCAN6062 CAN XL transceiver bridges that gap, offering engineers a path to higher-bandwidth networks while maintaining the proven reliability CAN is known for.

The specification for CAN XL has been standardized for years, but TI is the first to deliver and bring the hardware that makes it possible to the mass market. By introducing the TCAN6062, TI is transforming the innovative protocol into a broadly available, ready-to-use solution that engineers can implement in their next-generation designs.

“As industrial systems become more intelligent and interconnected, what we ask of our networks continues to evolve,” said Dwight Byrd, general manager, Interface Products at TI. “Engineers need more data, higher speeds and greater flexibility, all without compromising performance or reliability. TI’s TCAN6062 CAN XL transceiver puts that capability in their hands today, helping them build faster, more capable industrial systems.”

The TCAN6062 CAN XL transceiver’s SIC helps reduce ringing by as much as 80% in complex networks, simplifying validation in high-node architectures. Combined with wide input/output voltage compatibility and protection up to ±58V, the transceiver offers broad design flexibility across a range of industrial applications.

More details

As members of the CAN in Automation (CiA) technical group that developed International Organization for Standardization (ISO) 11898-2:2024, TI’s engineers helped shape the physical layer specification for CAN XL, ensuring the protocol was built to support the real-world demands of industrial applications.

“CAN has been the backbone of industrial communications for decades,” said Holger Zeltwanger, managing director at CiA. “Texas Instruments’ long-time membership and collaboration with CiA builds on that legacy, helping shape CAN XL by contributing to a standard that will guide the entire industry. Now with the introduction of the first commercially available CAN SIC XL transceiver, CAN XL is accessible to engineers worldwide, reflecting our shared commitment to solving the engineering challenges of today and tomorrow.”

“CAN XL opens the door to a new era of applications, enabling systems to deliver higher performance at a reasonable cost. CAN XL is the better and cheaper CAN FD, but can also tunnel Ethernet,” said Arthur Mutter, Ph.D., chairman of the CAN XL Special Interest Group at CiA and senior executive, Networking Technologies at Bosch. “With TI now offering a CAN SIC XL transceiver, system designers can leverage CAN XL to exchange data rapidly (up to 20 Mbit/s) and reliably in all applications, from industrial and robotics to automotive safety.”

The TCAN6062 represents the next generation of TI’s industry-leading CAN transceiver portfolio. Spanning CAN FD, CAN SIC and now CAN XL, TI offers a comprehensive range of solutions, giving engineers the flexibility to deliver more data faster, farther and more reliably.

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