ELE Times

Panasonic Industry has returned to Electronica India this year with its broadest showcase yet for the Indian market comprising of new-to-India technologies focusing on performance, safety and reliability. Anwesh Koley of ELE Times, caught up with Narayan Kumar, Chief Business Office, Panasonic Industry & Energy India, to understand the company’s automotive trajectory and future trends.

ELE Times: Brief us about what all Panasonic is displaying this year and how important Electronica is for your company?

Narayan Kumar: We all know Electronica is a leading platform for the entire electronic ecosystem, and so we have been continuously participating in the Electronica event. Largely, from our point of view, we are looking at how we increase our participation in the total electronic ecosystem. If you look at the last few years, the movement has shifted from pure assembly to many organisations now doing local design and development.

That is a very big change because we can engage directly with the R&D and engineering teams of many of our customers across almost all segments to look at the future products they want to make, and determine how we can participate through our device solutions.

More importantly, it’s not only for the Indian market alone. We can now see many companies doing design and development for global markets. That’s a big shift. Being here in the city of Bangalore, we can see many Global Capability Centres (GCCs) coming up in India. It’s a very exciting time—the overall market is growing rapidly, and so are we with high double-digit growth, a momentum we would like to continue.

ELE Times: In terms of the current market—the Indian market vis-à-vis other Asian markets—how does Panasonic perceive the Indian market? What are the growth opportunities you have identified, and what is the way forward?

Narayan Kumar: The Indian market has become super important, not only from a Panasonic point of view, but also from the perspective of the total electronic ecosystem.

If you look at one big example of growth in Electronic Manufacturing Services (EMS), a few years back we primarily saw global EMS companies. Now, we see the rapid rise of Indian EMS companies growing at high double-digit rates. Again, this is not just for local Indian consumption; they are actively engaging in global exports. From a policy standpoint, the government is actively looking at signing Free Trade Agreements (FTAs), which will further boost the “Make in India” program.

A lot of organisations we are in touch with would like to diversify their production to India. That is where Panasonic Industry India would like to participate with those customers—not only from a supply standpoint, but also from a development perspective.

ELE Times: The government currently has been quite optimistic about the electronic and semiconductor sectors, backed by significant incoming investments. What is your take on these government and policy initiatives backing the sector?

Narayan Kumar: We need to look at current progress through the lens of where we were before. We started off largely on the assembly of mobile phones, but now almost all sectors in the economy involving electronic hardware are growing.

India remains very strong on the automotive side, with a high contribution to manufacturing GDP coming from automotive. Besides traditional automotive, we see rapid electrification happening across two-wheeler and four-wheeler EV markets.

Looking at non-automotive industrial markets, smart infrastructure and smart metering are expanding as part of government programs, driving action to produce meters locally and increase local content. In renewables and solar power, we are looking at the localisation of inverters. Every single component of the manufacturing value chain for electronics has initiated action, which is great news for companies like us to participate and offer our device solutions.

ELE Times: You mentioned the growth of electric vehicles in the automotive sector. How do you see EV technology developing in India, and what are your key takeaways from the current government push for EVs?

Narayan Kumar: India’s automotive sector is a massive market. Almost all global players are physically present here—not only with manufacturing powerhouses, but also with design and development centres.

Given the sheer volume of the Indian market, we won’t look at just one part of the powertrain; multiple powertrain options will emerge in parallel. In the two-wheeler segment, we are the largest globally. The EV market is definitely growing, and three-wheeler EV penetration is already very high because customers see a quick return on investment (ROI), a trend likely following into two-wheelers as well. As the economy progresses, multiple technology options will grow side-by-side.

ELE Times: How do you see the current state of localisation in India regarding technology and ancillary equipment sectors, and what is your perspective on the “Make in India” initiative today?

Narayan Kumar: That is a very pertinent question regarding the flagship government program, and I would break it down into three parts:

• Local Design Support: While localisation usually refers to local manufacturing, the piece that comes before it is local design. Global Capability Centres in India are expanding their workforce to design for global platforms. The world recognises that Indian designs are becoming global platforms, which is a major starting point where we actively participate.
• EMS & Manufacturing Content: Electronic Manufacturing Services are continuously increasing their localisation content and expanding local production capabilities.
• Component-Level Localisation: The third part involves going deeper into the supply chain to evaluate localised manufacturing for a wide variety of electronic components based on volume feasibility and product combinations.

ELE Times: At Panasonic, how do you balance quality and cost—a key factor the Indian market is known for—without compromising on reliability or impacting margins?

Narayan Kumar: The best way to look at this is not to separate quality and cost. They are deeply integrated because the consumer ultimately makes the buying decision. Across product roadmaps in all sectors, there is a constant focus on building long-lasting, reliable solutions. Many modern programs demand strong, long-term warranties. For instance, smart meter manufacturers are required to provide a 10-year warranty on maintenance and supply. Naturally, this demands selecting high-performance components built to last a decade.

Simultaneously, high manufacturing volumes help make pricing competitive. India is at a point where high volumes justify competitive pricing. Ultimately, reliability is the factor that beats everything—urbanisation means consumers want premium, durable products rather than spending time replacing items.

ELE Times: How does Panasonic foresee the future of technology in India, and how is the company poised to address upcoming opportunities and challenges?

Narayan Kumar: I would answer this from the perspective of how our headquarters and global customers view India:

• High-Value Consumption: India has always been a massive consumption market, but that consumption is shifting toward high-urban, premium categories. Launching high-quality products creates growing opportunities for our industrial devices.
• Export Expansion: Local EMS companies are expanding exports. As local manufacturing scales, imports will decline and exports will grow.
• Engineering & Design Leadership: We are very excited about the growth of local design and development that serves both India and global markets.

India possesses a unique combination that few other markets can claim: strong domestic consumption, deep engineering talent, rapid technology adoption, and active government incentives, such as electronics manufacturing clusters and talent upskilling. This combination makes the entire ecosystem more robust, durable, and long-lasting.

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​With the continuously rising demand for electric vehicles, real-world energy efficiency is becoming an important performance metric alongside driving range and charging speed. Related to this, a recent test conducted on 22 participating vehicles from 15 different brands in Canada demonstrated the energy efficiency of modern electric vehicles. Each tested electric vehicle covered a 230 km route from Blue Mountain to Vaughan, Ontario in a single charge. The study found that modern electric vehicles consume 40% less energy on an average compared to vehicles tested in CAA’s February 2025 EV Winter Test.

During the recent test conducted in September 2026, variations in energy consumption among the tested vehicles ranged between 11.43 kWh/100 km and 28.91 kWh/ 100 km. This figure demonstrates how a vehicle’s size, weight and aerodynamics determine the electricity needed to cover a specific distance. A low-energy consumption vehicle uses less energy from the battery to cover the same distance, thus reducing charging requirements and charging cost, especially on longer trips.​

The key findings of the conducted test include range and battery usage, energy efficiency and charging performance among the vehicles. The Toyota bZ recorded the lowest energy consumption usage at 11.43 kWh/100 km, whereas the Lucid Gravity recorded the highest energy consumption at 28.91 kWh/100 km. CAA test also highlights that the two tests, conducted in different years involved different vehicles and operating conditions. Therefore, the resulting figures should not be treated as a direct vehicle-to-vehicle comparison.

The test demonstrates that EV evolution is more about increasing range. To be more practical while designing electric vehicle, designers and engineers must cater different factors such as energy consumption, charging performance, battery temperature, and vehicle design for improving the overall performance.

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Infineon Technologies on 1st of October, 2026 officially inaugurated its new backend manufacturing site in Bangkok, Samut Prakan in collaboration with Prime Minister of Thailand, Anutin Charnvirakul and Chief Operations Officer of Infineon Technologies, Alexander Gorski. The purpose of building new site is to strengthens and expanding the company’s global manufacturing footprint while adding capacity for future growth. The new site is located in the heart of Southeast Asia reinforcing Infineon’s ability to server customers worldwide at a time when long-term semiconductor demand continues to grow because of digitalisation, electrification and the energy transition.

Built for future growth, the facility can scale up to five modules, giving Bangkok the potential to become one of Infineon’s largest backend manufacturing sites over time. As a strategic addition to Infineon’s globally diversified manufacturing network, the site complements the ongoing expansion of Infineon’s frontend manufacturing capacities.

“What makes Bangkok such an important addition to our global manufacturing footprint is its unique combination of location and growth potential,” says Alexander Gorski, Chief Operations Officer of Infineon Technologies. “We are establishing a new hub in the heart of Southeast Asia, surrounded by a fast-growing ecosystem and with excellent access to global logistics. This helps us further diversify our manufacturing network across regions and serve our customers with resilient capacity and great flexibility. We have built the Bangkok site with the future in mind. Starting with Module A, the site can grow to up to five modules over time, giving us unique scalability to support future growth.”

“Infineon’s new backend manufacturing site in Bangkok, Samut Prakan, is a strong vote of confidence in Thailand’s future as a leading semiconductor location,” says Anutin Charnvirakul, Prime Minister of Thailand. “Together, we are advancing Thailand’s semiconductor ecosystem, strengthening our role in the global value chain and creating new opportunities and highly skilled jobs for future generations. We welcome Infineon’s long-term engagement and look forward to deepening our cooperation.”

A long-term investment in Thailand’s semiconductor ecosystem

Thailand’s commitment to building a strong semiconductor ecosystem, guided by its national technology strategy, is creating new momentum for advanced manufacturing and technology-driven growth in the region. Thailand offers excellent connections throughout Southeast Asia, proximity to key customer markets and a long-standing semiconductor manufacturing heritage. The Bangkok site builds on local expertise, established partnerships and a highly skilled workforce while contributing to the further development of Thailand’s flourishing semiconductor ecosystem.

The site currently employs around 350 people and is expected to grow to approximately 1,000 employees as the first building (Module A) ramps up. Beyond manufacturing, Infineon supports talent development through collaborations with universities, educational institutions and industry partners.

Expanding capabilities for complex, high-value semiconductor solutions

The Bangkok site combines advanced automation, scalable design and a digital manufacturing backbone to support efficient, stable and high-quality production at scale. Built as a greenfield site, the facility leverages proven expertise from Infineon’s established backend manufacturing locations while providing the flexibility to adapt to evolving customer requirements, new technologies and large production volumes.

Equipped with advanced cleanroom, assembly and test capabilities, all supported by a high level of automation, the Bangkok site covers the full spectrum of semiconductor backend processes as well as wafer test. This unique combination strengthens its role within Infineon’s manufacturing network and enables increasingly complex, high-value semiconductor solutions for applications across the automotive, industrial and energy infrastructure, contributing directly to technologies that drive electrification, energy efficiency and digitalization worldwide.

Sustainability built in from the ground up

The Bangkok site runs on 100 percent green electricity, incorporates water recycling and rainwater collection systems and is equipped with solar modules that generate renewable energy on site. Together, these measures support resource-efficient manufacturing and contribute to Infineon’s strategic priority of continuously reducing its carbon footprint across the entire value chain.

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​Moving to advance technology in electric vehicle, Delta Electronics and NVIDIA Hyperion have partnered to accelerate the development of next-generation autonomous-driving systems. The collaboration was announced on September 29, 2026, via a press release in Fremont, California, USA by Delta Electronics. The partnership aims to deliver more advanced, safer, and efficient next-generation Level 4 autonomous vehicles and robotaxis.

The company did not announce any commercial products to be launched. However, the collaboration focuses on introducing integrated automotive solutions by embedding Delta’s core hardware technologies directly into the NVIDIA Hyperion architecture.

Delta Electronics will contribute electronics hardware and integration expertise covering automotive energy management, xEV powertrain systems, power electronics, system integration, and in-vehicle high-performance computing (HPC). These technologies are crucial for autonomous vehicles because advanced systems depend not only on AI-based perception and decision-making but also on a reliable power supply, vehicle computing, and the integration of multiple electronic components.

To provide reference sensor and computing platform, NVIDIA Hyperion is d​eveloped and introduced as a modular architecture and end-to-end platform that integrate computer hardware, multimodal sensor and safety software into a single unit for autonomous vehicles.

The specific roles of this platform include integrating dual NVIDIA DRIVE AGX Thor centralised computers for handling level 4 autonomous driving tasks, a standardised sensor architecture for achieving full 360-degree environmental perception, and the NVIDIA Halos safety system, which offers safety mechanisms that satisfy automotive safety standards, including ISO 26262 ASIL-D requirements.

The collaboration highlights the efforts toward​s advancing AI-driven autonomous-driving solutions and expanding opportunities in smart mobility. It demonstrates the further steps towards merging AI, high-performance in-vehicle computing, automotive power electronics, sensor system, and functional safety in the development of level 4 autonomous vehicle.

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​To deepen domestic manufacturing, scale-up its own supply chain, less dependent on import, and increasing the number of homegrown smartphones, India announced Rs 62,500 crore Mobile Phone Manufacturing Scheme (MPMS). The scheme’s time period covers five years, from FY 2026-27 to FY 2030-31 and it was approved by the Union Cabinet. The scheme is designed to strengthen mobile-phone manufacturing beyond large-scale assembly while supporting the Indian brand and technology development.

The new scheme enters the development phase just after the completion of the Production Linked Incentive (PLI) Scheme whose tenure ended in March 2026. Under this scheme, the manufacturers will receive incentives depending on their eligible selling products with rates ranging from 2.5% to 5%. Companies can also receive an additional incentive of up to 1.5% for domestic sourcing of key components and sub-assemblies. For Indian brand, the scheme provides 5% incentive, along with additional 3% incentive linked to product design and R&D. These steps were taken to encourage deeper localisation of the mobile-phone supply chain.​

Through this scheme, the government targets a production value of Rs 39 lakh crore in mobile phones over the five-year tenure and aims to create around 60,000 direct opportunities. The scheme also aims to promote Indian brands and intellectual property by offering target-based incentives for domestic research, design, and component ownership.

The existing Indian market already consumes 99.2% of the mobile phones manufactured or assembled in the country and India is the world’s second-largest mobile-phone manufacturer in the​ global market. Exporting mobile phones is also increasing in India, thus supporting its integration into global value chains.

The new scheme is aimed at strengthening domestic manufacturing and deepening India’s electronics manufacturing capabilities through component sourcing, research and development (R&D), and support for Indian-owned brands. Along with the development of manufacturing, the mobile phone manufacturing scheme (MPMS) is also intended to strengthen India’s position in global value chains in electronics manufacturing.

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Keysight Technologies on 1st of October, 2026, announced the new 20 gigahertz (GHz) PSG XG7-class analog signal generator, which combines two fully independent channels in a single 2U chassis. Its low noise and calibrated output power help engineers evaluate device performance more clearly, while its compact dual-channel design increases test capacity without requiring additional rack space.

In challenging testing scenarios, such as aerospace and defence, advanced wireless and high-speed digital applications, the noise from the signal source can hide the behaviour engineers need to measure. Engineering teams also need to increase test capacity, while working within limited rack space and without costly modifications to existing test systems. The new PSG meets these needs with low phase noise, low amplitude modulation noise, low broadband noise floor, calibrated output power and two independent channels in a compact 2U chassis.

Key benefits of the new XG7-class include:

• Enhanced measurement visibility: Ultra-low noise helps engineers evaluate device performance without the signal source masking critical behavior.
• Expanded test capacity: Two fully independent channels in a compact 2U chassis enable teams to run more tests without increasing rack space.
• Improved performance in lossy test setups: Clean, calibrated output power up to +22 decibel-milliwatt (dBm) helps maintain the required signal level at the device under test, including through lossy cables and test fixtures.
• Faster technology refresh: Standard Commands for Programmable Instruments (SCPI) compatibility, familiar rear-panel connections and settings aligned with previous-generation instruments help teams reuse existing automation and test procedures.

The PSG provides phase noise of -135 dBc/Hz and amplitude modulation noise of -150 dBc/Hz, measured at 10 GHz with a 10 kHz offset, together with a broadband noise floor of -166 dBc/Hz at 10 GHz. Its hybrid architecture uses software mode switching to optimize performance across different applications, while calibrated output power up to +22 dBm helps compensate for losses in cables and test fixtures.

Jun Chie, Vice President, Keysight Core Product Management, said: “For decades, engineers have relied on Keysight’s PSG signal generators for trusted performance in the most demanding measurement environments. This new analog signal generator builds on that legacy with the purity, power, and productivity customers need to reveal true device performance and modernize test environments with confidence.”

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DigiKey, the global distribution leader in electronic components and automation products, has announced the launch of Season 6 of Factory Tomorrow, a video series highlighting how manufacturers and technology suppliers are building the foundation for the next generation of industrial production.

This three-episode season of Factory Tomorrow explores how industry leaders such as Phoenix Contact and Belden are helping manufacturers build more connected and intelligent factories. The series covers AI-enabled data centres supporting Industry 4.0, as well as industrial networks that move power and data across the factory floor.

As factories evolve into highly connected, software-defined environments, the sixth season examines the technologies enabling real-time visibility, autonomous operations and resilient industrial systems. As manufacturers increase AI adoption and invest in digital transformation initiatives, demand for industrial networking, edge connectivity, data infrastructure and intelligent automation continues to grow.

“Factory Tomorrow continues to bring together industry experts to discuss the technologies shaping the future of manufacturing, including the growing impact of AI on industrial operations and data infrastructure,” said Connor Doherty, director, industrial automation for DigiKey. “This season examines the networks, connectivity and computing infrastructure required to support smarter, more connected factories.”

Season 6 Highlights

• AI-ready data centres supporting industrial operations
• Industrial networking for connected factories
• Copper, fiber and optical connectivity infrastructure
• Real-time visibility and operational intelligence
• Smart manufacturing and Industry 4.0 applications
• Expert perspectives from DigiKey, Phoenix Contact and Belden

In the first video, Phoenix Contact highlights how its connectivity and industrial networking solutions support both AI-ready data centres and smart factory environments.

“Today’s digital factories need to collect, secure, transport, analyze and act on data,” said Greg Jerrehian, vice president of channel management at Phoenix Contact USA. “As a manufacturer, Phoenix Contact understands these challenges firsthand. We’re excited to share our expertise in networking, automation and connectivity to help the industry improve efficiency and optimize operations. Through our partnership with DigiKey, we’re accelerating access to new technologies and helping customers achieve success faster.”

The second video focuses on how Belden’s customized and scalable networking solutions spanning advanced copper and fiber, multi-lane optics and high-density optical frames enable data centres to adapt to rapidly changing technology demands.

“It was a pleasure to work with DigiKey to discuss how AI is changing the landscape of factories of all kinds and how data centres are enabling that change, regardless of whether they are on-prem, using hyperscale data centres, cloud services, or somewhere in between,” said Brian Kennedy, global vertical leader – data centres, for Belden.

In the final video, experts look ahead to the future of smart manufacturing where AI, autonomous systems and sustainable industrial design converge. This episode brings together connectivity, data and intelligence into a cohesive vision for the factory of tomorrow, examining how manufacturers can build flexible, energy-efficient and resilient systems capable of evolving alongside emerging technologies.

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DRFM jammers rely on receiving radar signals, digitizing them and retransmitting them with controlled delay, phase and frequency. As radar systems become more agile and use increasingly complex waveforms, test systems need to measure parameters such as pulse shape, timing, modulation and repeatability, as well as analyze complete pulse trains and pulse-to pulse variations. The R&S FSWX signal and spectrum analyzer addresses these requirements with its dual-channel, phase coherent architecture. With the R&S FSWX-KM700 pulse analysis option, Rohde & Schwarz adds a software extension dedicated to pulsed-signal and DRFM analysis, enabling engineers to evaluate pulse parameters, pulse trains, modulation and the timing behavior of jammer signals.

The R&S FSWX-KM700 pulse analysis option measures key pulse parameters, including pulse width, amplitude, rise time, fall time, pulse repetition interval, duty cycle, pulse shape and overshoot. These measurements can help engineers evaluate the accuracy and consistency of reproduced radar pulses and identify variations in timing, amplitude and other pulse characteristics. Such variations can affect the fidelity of a reproduced signal, making accurate pulse analysis important when testing DRFM-based deception and jamming systems.

The analysis also covers complete pulse trains. The option extracts pulse repetition frequency spectra and pulse-to-pulse variation data, allowing engineers to verify complex pulse sequence behavior and timing patterns. R&S FSWX-KM700 supports chirped pulses, pulse width modulation, pulse position modulation and phase-modulated waveforms. Engineers can use these measurements to check whether a device handles modulation schemes used by modern radar systems, including both the pulse envelope and modulation content.

The system can trigger on amplitude, pulse width, pulse repetition interval or user-defined patterns. This helps engineers isolate selected events inside a pulse train and focus the measurement on the relevant parts of the signal. For longer measurements, R&S FSWX-KM700 aggregates results from many captured pulses. This provides information about repeatability and consistency over time and helps engineers assess whether timing or modulation errors occur only under certain conditions.

The option comes with the following displays: parameter trend for DRFM electronic attack technique analysis, capture vs. time to measure jammer response time and latency between stimulus and response, individual pulse parameter display such as pulse amplitude, frequency, and phase to make sure there are no distortions introduced by the jammer. These measurements connect pulse analysis with the behavior of the jammer under test.

With the new R&S FSWX-KM700 option, the FSWX signal and spectrum analyzer gains a more specialized role in DRFM test workflows. It combines phase coherent multi-channel analysis with pulse, pulse train, modulation and segmented capture functions in one instrument, supporting verification of signal fidelity, timing behavior and consistency in agile electronic warfare scenarios.

 

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​A new analysis report presented by EY-IESA estimates that India’s semiconductor market will grow more than threefold by 2035. It states that the market will increase from nearly $64 billion in 2026 to $200 billion by 2035 covering areas such as artificial intelligence, data centres, telecommunications, electric vehicles, and advanced semiconductor manufacturing.

The findings of the report point to the increase in demand for semiconductors in India’s consumer electronics and industrial sectors. Consumer electronics is the largest demand segment accounting for a 30% market share, followed by Automotive (16%) and Industrial (15%).

Semiconductor imports by India have also increased in recent years. According to the report, semiconductor imports have increased fivefold, from $5.7 billion in FY2017 to $30.3 billion in FY2025, representing a compound annual growth rate of 23%. The report also states that increased domestic demand presents a good opportunity to expand India’s manufacturing, research and development, and supply chain capabilities for semiconductors.

Another key strength is India’s ability in chip design. The country has nearly 20% of the global chip design engineers which is a positive point for talent development and there is a huge opportunity for expand semiconductor manufacturing, chip design and commercialisation.

According to the report, key technologies in the semiconductor industry—including advanced packaging, compound semiconductors, photonics and chip-to-system integration—should be the focus for India’s potential growth. It also calls for stronger semiconductor manufacturing clusters, improved infrastructure, specialised talent and closer industry-academic collaboration.

The Indian semiconductor market, projected $200 billion by 2035, indicates the scale of the opportunity for India as it seeks to expanding its footprints across the semiconductor supply chain.

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​As India emerges as a global supplier in the semiconductor industry and builds capabilities in chip design and manufacturing, the country could face cybersecurity, geopolitical, and other disruption-related challenges. Union IT Minister Ashwini Vaishnaw gave this warning during a media interview in New Delhi. While speaking to the media on September 19, the minister urged Indian startup companies to be careful against potential cyberattacks, geopolitical risks and other disruptions.

Addressing the media, the minister said that India’s emergence as a country capable of designing and manufacturing chips for semiconductor devices could improve its position in the global semiconductor value chain, potentially drawing attention from established players and opponents of India’s rise. He also stated that he had discussed these concerns with the industry and urged them to prepare for potential cyberattacks, threats, and other possible disruptions.

These risks could extend beyond common business competition to include cyberattacks, physical attacks, misinformation, and other forms of disruption. The country’s push for semiconductors has also attracted increasing investment interest. Recent announcements related to this include Applied Materials, a United States manufacturing company, planning a US$5 billion investment in India through 2035, Lam Research’s proposed ₹10,000 crore investment; and Fujifilm planning to invest approximately ₹800 crore to establish a semiconductor material plant in Dholera. These developments reflect the country’s growing ambition to expand India’s semiconductor ecosystem.

The warning from Union IT Minister reflects the major concern that needs to be cater by Indian semiconductor companies to consider cybersecurity and other broader disruption risks alongside investment in manufacturing capacity, technology and talent.​

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Vishay Intertechnology has introduced a new Automotive Grade, top-side cooling mount thick film power resistor. The Vishay Sfernice D2TO35S is designed for automotive applications, offering improved thermal performance and reduced PCB space requirements. The resistor provides high power dissipation of up to 35 W at 25°C and is housed in a surface-mount TO-263 (D²PAK) package.

As thermal constraints increasingly become the primary system design limitation, many power components are transitioning from PCB-based cooling to top-side cooled architectures. By transferring heat directly to a heatsink, the D2TO35S released today enables up to nine times greater power dissipation than standard PCB-mounted devices when paired with an appropriate heatsink. Its compact, surface-mount design allows designers to increase power dissipation within the same footprint or provide the same functionality in a smaller footprint, while lowering PCB temperatures, reducing thermal stress on neighboring components, and improving overall system reliability.

Offering a non-inductive design for improved signal integrity and power handling in fast transient conditions, the D2TO35S features a resistance range from 4.7 Ω to 550 kΩ — with tolerances down to ± 1 % — thermal resistance of 4.28 °C/W, TCR down to ± 150 ppm/°C, and a wide operating temperature range from -55 °C to +175 °C. The RoHS-compliant device is solder reflow secure at 270 °C/10 s.

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ROHM has developed a 2nd Generation terahertz (THz) wave oscillation device using semiconductor elements known as Resonant Tunneling Diodes (RTDs). The company is making the device available via the RTD-EVK-G2 Terahertz Wave Device Evaluation Kit, which includes a sample device, cable, and evaluation board. The kit enables companies and research institutions to evaluate THz wave oscillation and detection in a compact development environment.

Occupying the frequency region between radio waves and light, terahertz waves combine the penetrating properties of radio waves with the straight-line propagation of light. Because they exhibit unique absorption characteristics for polymers, moisture, and other substances, they are expected to be used in non-destructive testing without ionizing radiation, medical and healthcare applications, and high-resolution radar sensing. However, conventional terahertz systems require large equipment and high implementation costs, making it difficult for new companies and research institutions to enter the field or pursue commercialization.

Since the late 2000s, ROHM has engaged in joint research with the Institute of Science Tokyo, Osaka University, and many other universities and research institutions to develop THz wave oscillation and detection devices using RTDs. In 2024, ROHM began offering samples of 1st Generation products, achieving substantial downsizing and cost reduction compared with conventional methods.

What’s New in the 2nd Gen Wave Oscillation Device?

To address the growing demand for improved signal quality in application development, ROHM has now developed a 2nd Generation terahertz wave oscillation device. The device maintains the same compact 0.5×0.5mm chip size as the 1st Generation product while adopting an internal structure that enables higher output power. As a result, output power has been increased to approximately 4 times that of the 1st Generation product, reaching a maximum of 40µW. The higher output power improves the detectability of THz waves after transmission through or reflection from target objects – making the device well suited for applications such as sensing and imaging that require high signal quality.

The device is mounted in the same 4.0×4.3mm PLCC package, maintaining the industry’s smallest footprint. This enables evaluation environments to be built even in space-constrained settings. In addition, compared with other THz generation methods, the RTD approach generates less heat and consumes less power. This reduces application development load at both companies and research institutions. Sales of the RTD-EVK-G2 evaluation kit, which includes samples of the 2nd Generation wave oscillation device, are scheduled to begin later this year at $3,300 per set.

By enabling evaluation at a lower cost than other methods, the kit supports the development of a wide range of applications. This includes non-destructive testing; imaging and sensing in the medical and healthcare sectors; material identification; and moisture detection. ROHM will also continue sales of 1st Generation devices for applications that prioritize low power consumption. For further information, please contact a sales representative or visit the contact page on ROHM’s website. Purchase of the evaluation kit requires signing a non-disclosure agreement (NDA) with ROHM.

Expanding THz Wave Applications

Sharing his views on the development, Professor Safumi Suzuki, Laboratory for Future Interdisciplinary Research of Science and Technology, Institute of Integrated Research, Institute of Science Tokyo, said, “Terahertz waves are expected to be applied in a wide range of fields, including non-destructive testing, imaging and sensing, and wireless communications. At the same time, commercialization continues to face major challenges, such as the need for large-scale equipment and high implementation costs.

Professor Safumi Suzuki, Institute of Integrated Research, Institute of Science Tokyo

Conventional methods for generating terahertz waves include the ‘frequency multiplication’ method. This converts the frequency of an electrical signal into an integer multiple for output. The “photomixing” method that produces terahertz waves from the difference frequency created when two laser beams of different wavelengths are mixed in a photo-mixer. Both approaches necessitate large or medium sized costly equipment to generate terahertz waves.

“The RTD terahertz wave device, developed through many years of joint research with ROHM is compact, power saving, and does not require cooling. It can also be introduced at low cost, helping companies and research institutions begin terahertz wave research. With the launch of the 2nd Generation device featuring significantly improved oscillation output, I expect development of applications requiring higher signal quality to accelerate,” added Suzuki.

“With the launch of RTD-EVK-G2, we expect to make another major step forward toward the practical implementation of terahertz technology. Feedback from users of the 1st Generation device revealed strong demand for higher-output devices. With this 2nd Generation product, we have succeeded in increasing oscillation output to approximately 4 times that of the 1st Generation device while maintaining a compact size, bringing us closer to meeting those needs. Terahertz technology is steadily progressing toward real-world implementation,” mentioned Ken Nakahara, General Manager of ROHM Research & Development Center, ROHM Co., Ltd.

The Smallest Terahertz Wave Device Now Becomes Smarter!

Innovative oscillation and detection devices have been ROHM’s forte. Readers will remember that last year, the company introduced the first generation of the industry’s smallest THz wave oscillation and detection devices utilizing RTDs. Its extremely compact size, typically less than one-thousandth that of conventional oscillators, enabled this innovation to ensure easy development of terahertz wave applications, even in space-constrained environments.

By positioning the antenna surfaces of the oscillation and detection devices facing each other 10mm apart, a dynamic range of 40dB (typ.) was easily achievable. Both oscillator and detector maintain a drive power consumption of 10mW (typ.), while their ability to oscillate and detect terahertz waves at room temperature eliminates the need for cooling equipment required with some conventional methods. These compact, power-saving devices are almost unaffected by the operating environment, enabling use in a wide range of applications.

Ken Nakahara, General Manager of ROHM Research & Development Center

Going forward, ROHM intends to continue diversifying the possibilities for THz wave application development and contribute to the early commercialisation and real-world implementation of terahertz technology. This will help accelerate its deployment across a broad range of industries. “ROHM will continue working together with customers, partners, universities, research institutions, and government agencies to support the development of terahertz wave applications and contribute to the realization of a sustainable society,” averred Nakahara.

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As automotive, AI/data centre, networking and industrial systems rapidly transition to 48V power architectures to improve efficiency and support higher power demands, designers require more than visibility into instantaneous voltage and current conditions. They also need systems that can track energy consumption over time and respond to changing power conditions. To address these requirements, Microchip Technology has introduced the PAC1761 and PAC1861 families of 65V energy-aware digital power monitors. The devices combine accumulated energy-measurement capabilities with 65V measurement headroom and transient spike protection to support efficient and resilient 48V power architectures.

The move to 48V power architectures requires digital power monitors to provide additional operating margin, including up to 65V measurement capability and 75V spike protection to ensure transient survivability. The PAC1761 and PAC1861 devices add intelligence to these capabilities, enabling real-time responses to energy-usage dynamics based on accumulated power measurement data.

“The industry conversation is shifting from measuring power at a single point in time to understanding and responding to energy behavior across an entire system and its lifecycle,” said Keith Pazul, vice president of Microchip’s mixed-signal linear business unit. “The PAC1761 and PAC1861 families are designed to help customers build better performing and more reliable 48V systems that can measure instantaneous conditions and understand energy consumption and availability over time. These scalable, low-power solutions reduce monitoring overhead and include pin-compatible package options that improve source flexibility while reducing design risk.”

Microchip’s digital power monitoring devices feature programmable alerts for voltage, current and power excursions, step-limit detection to identify sudden load changes, and configurable accumulated-energy thresholds that enable proactive system management based on both instantaneous and long-term power behavior.

Target applications include automotive, AI/data center, networking, industrial, server, telecom/Power over Ethernet (PoE) and 48V power distribution systems. The 12-bit PAC1761 and 16-bit PAC1861 options are available in VDFN-8 (similar to SOT23-8), VDFN-10 and MSOP-10 packages including automotive-orderable variants. Pin-compatible options can reduce redesign risk, shorten qualification cycles and give customers flexibility to move between devices as requirements, availability, cost or performance change.

Development Tools

Development support includes evaluation board EV12R33A, a Python Command Line Interface (CLI) with library, Linux driver and generic C library with multiple MCU code examples.

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Battery-swapping technology allows electric heavy trucks to replace a drained battery placed between the frame rails with a fully charged one at a charging station in just 5 to 10 minutes. Unlike conventional plug-in EV trucks, battery-swapping vehicles are designed with modular and removable battery packs along with the mechanical, electrical and communication interfaces required for rapid battery exchange.

Automated swapping equipment can then remove the depleted pack and install a charged one. Current heavy-duty EV examples in India demonstrate the growing adoption of this approach, with some systems completing a battery swap in less than five to seven minutes.

This battery-swapping technology is gaining attention in India’s EV transportation sector as manufacturers look for a better option to reduce electric vehicle charging downtime. It also provides an advantage of lower upfront costs because the battery is owned by a battery-swapping operator, allowing the customer to pay for battery use through a subscription.

This technology is now moving beyond the deployment phase towards a wider infrastructure network. In July 2026, Energy In Motion (EIM) and Hindustan Petroleum Corporation Limited (HPCL) announced plans to develop fast-charging and battery swapping stations for heavy EV trucks at specific HPCL petrol pumps or service stations. The partnership company (EIM) will establish swap-and-charge hubs along freight corridors including Mumbai-Pune, Delhi-Jaipur and Chennai-Bengaluru over the next 18 to 24 months.

The implementation of battery-swapping at a wider scale demonstrates that India is adopting modern technologies to provide faster and efficient charging solutions to the EV industry. The adoption of this technology at a very large scale will depend on several factors such as battery standardisation, station availability, interoperability, fleet economics, and the development of reliable freight-corridor infrastructure.

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​The demand for electric vehicles is continuously rising in India. Government and charging companies are making continuous efforts to make charging easy for consumers by expanding charging infrastructure and improving charging efficiency. But increasing the number of chargers alone is not sufficient to provide a reliable charging experience.

A new report from the Institute for Energy Economics and Financial Analysis (IEEFA) found that charger reliability, interoperability, charging cost, home-charging challenges and delays in grid connection are rising problems affecting EV charging in India. The report was published on September 16, 2026.

In the early stages of EV adoption, vehicle range was a major focus for manufacturers and consumers. As EV sales and charging infrastructure continue to expand, attention is increasingly turning​to the reliability and accessibility of charging infrastructure. A charging station is useful only when it is operational and available when an EV user needs it.

Network interoperability is another growing concern, as different charging networks may require separate apps, accounts or payment systems, making it less convenient for users to access and pay for charging across different locations. IEEFA has identified charger reliability and interoperability among charging networks as key factors that need to be addressed to improve India’s EV charging experience.

As India’s charging network continues to grow, the next stage of development will therefore depend not only on deploying more chargers but also on improving their reliability, interoperability, affordability and integration with the electricity grid.

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As manufactures and battery material companies are searching for increasing energy density and improve charging performance in electric vehicles, silicon-based anode technology that replace traditional graphite parts with silicon-based materials is gaining momentum in the electric vehicle (EV) battery industry. The advantage of adopting these technologies is that it holds significantly more lithium ions (up to 10 times more lithium per gram than standard graphite) to boost energy storage of an anode without increasing its size.

Although, this technology suffers from big challenges such as silicon undergo tremendous expansion once it absorbs lithium during charging. This expansion can destroy the anode and cause capacity loss over repeated charging cycles. Researchers have come up with the solution of using silicon-carbon composites to overcome this problem. By combining silicon with carbon based materials can accommodate the expansion to preserve the anode stability.

The technology has new completed its testing phase and is new ready to be implement toward large-scale manufacturing. Group14 Technologies, an American battery technology company, in March 2026 announced that its South Korea battery- material plant for silicon batteries has started production of its SCC55 material at the scale needed for EV batteries. The plant can produce up to 2,000 tonnes of silicon battery material per year, which should amount to about 10 GWh of energy-storage capacity annually once production reaches its planned level.

Australia is another major supporting commercialisation of this silicon-adopting material for energy storage. The Australian Renewable Energy Agency (ARENA) announced an award of $45 million to silicon battery technologies to build a commercial scale facility for advanced silicon-carbon battery material.

These developments put silicon-carbon anodes closer to commercialisation. If the manufacturers can overcome the issues of cost, cycle life, expansion and manufacturing scale, then the technology could contribute to higher battery energy density in future EV batteries, while allowing for faster charging.

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With the rise in the implementation of software technologies in Electric vehicles, the transition towards Software-Defined Vehicles (SDVs) is changing how electric vehicles are designed. Technologies in software-defined vehicles such as advanced automotive semiconductors, edge artificial intelligence (AI) and centralised computing are becoming key concepts in designing future transportation vehicles.

During electronica India 2026 held at Bangalore International Exhibition Centre (BIEC), Renesas Electronics showcased technologies related to SDVs, edge AI, EV charging and intelligent mobility. These technologies highlight the growing role of semiconductor-based computing in designing next-generation vehicles. At the event, Renesas demonstrated its newly designed 3nm multi-domain automotive SoC, the R-Car Gen 5 platform, highlighting features such as advanced driver assistance systems (ADAS), digital cockpit technologies and connected-vehicle solutions providing personalised functions and voice interfaces.

The platform combines high-performance automotive computing with AI capabilities and supports software-defined vehicle architectures. Edge Intelligence was another area of interest, where AI processing is being executed with the help of the vehicle’s sensors and systems instead of depending on cloud interface. Renesas demonstrated applications that support AI vision, autonomous and assisted driving for the driver, and embedded intelligence.

Edge AI can result in faster local responses compared to cloud connectivity and reduce the amount of sensor data that needs to be transmitted to external system. As EV architectures shift towards software-defined systems, the use of advanced automotive system-on-chip (SoC) platforms, edge AI, power semiconductors, and software platform will increasingly play an important role in vehicle computing, charging, connectivity, and smart mobility.

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SEMICON India 2026, the fifth edition of India’s flagship semiconductor conference, concluded on September 19 at Yashobhoomi, New Delhi, highlighting the country’s growing capabilities across the global semiconductor value chain. Held from September 17 to 19 under the theme “Silicon to Systems: Building the Ecosystem,” the three-day event brought together semiconductor companies, policymakers, investors, academia and start-ups.

The event featured more than 600 exhibitors, including around 300 international participants, with representatives from 52 countries and more than 150 speakers. Six country pavilions representing Japan, South Korea, Malaysia, the Netherlands, Singapore and Sweden, along with 12 state pavilions, showcased capabilities across different areas of the semiconductor ecosystem. The event recorded 51,656 registrations and around 40,000 cumulative footfall.

Prime Minister Narendra Modi inaugurated SEMICON India 2026 highlighting India’s progression from policy discussions and project planning to commercial semiconductor production. During the inauguration, the Prime Minister virtually inaugurated commercial production lines at CDIL Semiconductor in Mohali for discrete semiconductor devices and Suchi Semicon in Surat for semiconductor packaging. The two facilities added to India’s operational commercial semiconductor units under the Semicon 1.0 programme.

As a major outcome of SEMICON India 2026, a total of 56 MoUs, announcements and strategic initiatives were announced across areas including semiconductor design, fabrication, advanced packaging, equipment, materials, power electronics, AI, R&D, startups and talent development.

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Due to massive pool of specialised VLSI (Very Large Scale Integration) engineers, large number of Global Capability Centre (GCCs) presence and ongoing government support, India currently accounts for nearly 20% of the world’s semiconductor design workforce. This number highlights the India’s increasing role in global chip design and research. The statement of accounting 20% global workforce in semiconductor design was made by S. Krishnan, the MeitY Secretary on the side-lines of SEMICON India 2026 in New Delhi.

The government is prioritising the development of semiconductor design talent, said S. Krishnan. He said an ongoing programme is focused on training around 85,000 semiconductor design engineers, while skill-development efforts are also being expanded across the semiconductor value chain, with a strong focus on supporting semiconductor manufacturing in India.

The semiconductor design workforce will play an important in strengthening India’s position in the global semiconductor ecosystem. According to government data, India holds 7% of the world’s semiconductor-related Global Capability Centres (GCSs) along with Indian engineers continue to contributing to chip design, fabrication, verification and testing activities.

The government is taking action to move beyond design and improve semiconductor ecosystem by covering fabrication, advanced packaging, assembly and testing, semiconductor equipment and materials, research and development (R&D), and talent development. The recent organised event Semicon 2.0 has an outlay of ₹1,27,500 crore and is structured around six pillars which include design, machine, materials, advanced packaging, additional fabs, research, and talent.

There are different schemes supported by the government body encouraging semiconductor design which include Design Linked Incentive (DLI) Scheme and the Chips to Startup (C2S) Programme. The focus of these programmes is to train around 85,000 semiconductor design engineers. The initiatives are also aimed at strengthening India’s domestic chip-design capabilities and building a stronger semiconductor design ecosystem.

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India continues to focus on raising domestic value addition and further deepening domestic manufacturing in electronics industry. Moving beyond large-scale assembly towards deeper manufacturing and stronger local supply chains, S. Krishnan, the Secretary of the Ministry of Electronics and Information Technology (MeitY) made the statement that India is targeting 35-40% domestic value addition in mobile-phone manufacturing, up from the current level of about 22-23%. To achieve this number, different government schemes are giving support such as India Semiconductor Mission (ISM), mobile manufacturing, the Production Linked Incentive (PLI) for electronics hardware and the Electronics Component Manufacturing Scheme (ECMS).

The Electronics Component and Manufacturing Scheme (ECMS) is expected to play a major role by focusing on deep component-level manufacturing rather than basic assembly. Key areas include printed circuit boards, passive components, electrochemical components, subassemblies, camera module, optical transceivers, and critical equipment.

The government aims to wider the development of India’s semiconductor ecosystem by expanding capabilities across components, semiconductor manufacturing and other parts of electronics value chain. ECMS is designed to integrate Indian manufactures with global value chains and ISM supports semiconductor design, fabrication, advanced packaging, equipment and materials.

The 40% target in domestic manufacturing does not means that forty percent of the electronic devices to be made in India. It means if a device is selling in India, then its forty percent value must be manufactured within the country. This target reflect India’s deepen participation in global value chains by moving beyond final assembly, creating a deeper supplier ecosystem, reduce dependence on imported components, and moving towards complete manufacturing location. This will allow Indian factories to source more inputs locally while maintaining competitive cost, quality and scale.

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