ELE Times

DefTech Bharat successfully concluded its 2026 edition in Bengaluru, reaffirming its position as one of India’s emerging platforms for aerospace, defence, and space technology collaboration. Held from May 20–22, 2026, at the Karnataka Trade Promotion Organisation (KTPO), Whitefield, the exhibition and conference attracted strong participation from defence manufacturers, technology developers, government stakeholders, startups, research institutions, and international delegations.

According to the organisers, the exhibition featured over 200 exhibitors from India and more than 12 countries, showcasing advanced technologies and next-generation solutions across air, land, sea, cyber, and space domains. The event also saw participation from more than 15,000 business visitors, including procurement officials, defence personnel, OEMs, system integrators, engineers, and policymakers.

The co-located DEFTECH Conference brought together industry leaders, technology experts, and government representatives for strategic discussions on indigenous defence manufacturing, AI-enabled warfare systems, aerospace innovation, cybersecurity, advanced electronics, and C4ISR technologies. More than 20 conference sessions and technical seminars were organised during the three-day event, focusing on technology collaboration, innovation pathways, and future battlefield requirements.

A major highlight of DEFTECH Bharat 2026 was the extensive display of cutting-edge technologies including autonomous and unmanned systems, UAVs and counter-drone solutions, AI-driven surveillance platforms, defence electronics, rugged embedded systems, aerospace subsystems, secure communication technologies, radar and sensor systems, additive manufacturing, semiconductor solutions, cyber defence technologies, and advanced manufacturing equipment. Live demonstrations and interactive technology showcases generated strong interest among both domestic and international visitors.

The exhibition also served as a strong networking and business development platform, enabling direct interaction between OEMs, MSMEs, startups, R&D organisations, armed forces representatives, and global technology providers. Several exhibitors reported high-quality business enquiries and strategic partnership discussions during the event.

Building on the strong response to the 2026 edition, the organisers announced that the next edition of DEFTECH Bharat will be held from May 19–21, 2027, at the Bangalore International Exhibition Centre (BIEC), Bengaluru. The move to the larger BIEC venue comes in response to increasing exhibitor demand and rising visitor participation. The exhibition area for the 2027 edition is expected to expand significantly to accommodate a broader range of aerospace, defence, homeland security, and space technology exhibitors.

With India accelerating its focus on indigenous defence production and technology-led modernisation under the Atmanirbhar Bharat initiative, DEFTECH Bharat continues to evolve as an important industry platform connecting innovation, manufacturing, research, and strategic capability development for the future defence ecosystem.

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ST announces Zephyr 4.4.0 is adding support for the STM32C5, STM32H5E/F, STM32U3C5, as well as the X-NUCLEO-IKS5A1 daughter board, the EVKITST87M01-1 evaluation kit, and the ST B-DSI-MB1314 touch-sensitive display, among many other things, such as sensors and modems (ST87M01). It’s a testament to the collaboration between ST and the Zephyr community. Over the years, ST prevail drivers, optimize performance, and supports new features. And while we do have partners who use Zephyr and benefit from these contributions, this also stems from our desire to work with open-source projects that help democratize real-time operating systems and lower the barrier to entry.

The ST software ecosystem, encompassing the STM32Cube suite and tools like MEMS Studio, provides engineers with low-level device access and accessible machine learning capabilities. Through utilities such as NanoEdge AI Studio, the company facilitates edge AI development and optimizes hardware accessibility for a broad user base. For more insights, visit the ST Blog.

STM32Cube Ecosystem and the other ST software that grant developers low-level access to devices, such as MEMS Studio, which makes machine learning on sensors even more approachable. For many, tools like STM32CubeProgrammer help make the hardware more accessible, while ST’s software packages for its microcontrollers, microprocessors, sensors, and more provide drivers, middleware, example code, and more. Recently, utilities like NanoEdge AI Studio help programmers and software engineers work on neural networks and optimize their AI applications at the edge, thanks to features like synthetic data generation.

The Zephyr project provides a necessary, agnostic system for organizations managing diverse hardware, offering a unified abstraction layer that enhances portability and interoperability for complex, multi-vendor projects. By utilizing this open-source platform, developers can establish a flexible foundation for building proprietary subsystems and avoid vendor-specific lock-in. You can read the full analysis at ST’s official website.

The importance of the collaboration between ST and Zephyr

ST contributes to the Zephyr project and supports its low-level APIs. Concretely, it means we work with Zephyr to support numerous peripherals and interfaces, including USB modules, LCD-TFT display controllers, networking interfaces, and much more. Since the beginning of the Zephyr project, ST engineers have contributed to the Zephyr codebase and the support community. In certain instances, we even help with critical technologies, such as low-power modes, recognizing that our contribution will benefit more than just the engineers using our products. Another aspect of ST’s work on the Zephyr project is the significant effort that involves reviewing community contributions to the STM32 codebase. It may include new board support, bug fixes, and even complete drivers pushed and maintained by external contributors. Over time, these contributions have been responsible for a significant part of the STM32’s current status.

New MCU Support

The STM32N6 Discovery Kit with a CMOS sensor running a person detection application. Zephyr 4.4.0 is a good example of dedication to the project. Similar to frequent updates to STM32CubeProgrammer bringing new STM32 MCU support, this new version of Zephyr adds support for the STM32C5, STM32H5E/F, the STM32U3C5, and the STM32WBA2X. In some instances, like the STM32C5, this version adds support for DMA, I2C, SPI, ADC, timers, and watchdog. Since we just launched the STM32C5, Zephyr 4.4.0 is an inaugural release for the new series. For other devices in an existing series, the MCU support builds on what is already in place, enabling developers to leverage new part numbers.

New Middleware Features

Beyond the device itself, ST also brings updates to its drivers or middleware. For instance, among many improvements, v4.4.0 brings performance enhancements on STM32, adds RTIO and optimizes DMA in SPI STM32 drivers, and adds a stream API for ADC STM32 drivers. We also added the ability to inject ADC channels to enable immediate execution, overriding the regular sequence. Similarly, Zephyr 4.4.0 adds a portable API to read the one-time programmable non-volatile memory on STM32 MCUs. Usually, that means an ADC sensor can now access calibration data. We are also starting to make our I3C interfaces available on our STM32MP2 MPU, and we have moved our USB default stack to a newer and more robust version.

 

 

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At PCIM Europe 2026 in Nuremberg, Infineon Technologies AG showcases its comprehensive semiconductor portfolio for future-proof power infrastructure, AI data centers, robotics, and electromobility. The company presents a broad range of power system solutions spanning silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) semiconductors, with support of software, tools, and cybersecurity expertise.

Infineon’s PCIM 2026 demo highlights:

• Making power infrastructure future-proof: As renewable energy continues to scale, robust power infrastructure is essential to support energy-intensive applications like AI data centers and advance factories. At PCIM, Infineon demonstrates its semiconductor technologies for efficient battery storage systems, uninterruptible power supplies, Solid-State Transformers (SST), and Solid-State Circuit Breakers (SSCB). Highlights include a demo stack for SSTs, along with SSCB components based on CoolSiC JFET technology, enabling fault isolation within microseconds and delivering high robustness for future DC grids.
• Powering AI from grid to core: Rapidly rising AI computing workloads are driving a sharp increase in data center energy demand and accelerating the shift toward new power architectures such as HVDC sidecars and DC microgrids. At PCIM, Infineon presents a comprehensive portfolio of Si, SiC, and GaN supporting this transformation from grid connection to processor core. Exhibits include power semiconductors, drivers, microcontrollers, and sensors for the latest power supply units, as well as solutions for battery backup units, intermediate bus converters, voltage regulation, and intelligent protection devices.
• Shaping the future of electromobility: Infineon is advancing electromobility as the global market leader in automotive semiconductors. PCIM highlights the link of this area, including solutions for traction inverters, DC-DC converters, on-board chargers, and battery management systems. Visitors can explore the company’s “One Inverter, One Infineon” system solution to improve drivetrain efficiency while optimizing space and cost. Additional demos showcase CoolSiC and CoolGaN power switches, the new EasyPACK S and CIPOS Prime module solutions, XENSIV sensors, and AURIX TC4xx microcontrollers.
• Empowering robotics: Robots are rapidly evolving toward physical AI systems that can sense, think, and act. At PCIM, Infineon will showcase semiconductor solutions supporting this evolution across industrial and domestic robots, humanoids, and drones. Demos include high‑efficiency motor control and power management solutions based on CoolGaN power semiconductors, PSOC Control C3 microcontrollers, and XENSIV sensors, enabling compact designs, precise control, and robust operation in future robotic applications.
• EU Cyber Resilience Act: Infineon highlights its commitment to security. At PCIM, experts will address upcoming regulatory requirements of the EU Cyber Resilience Act, illustrating how secured‑by‑design semiconductor solutions enable customers to meet compliance demands while strengthening product differentiation.

Infineon also contributes to the PCIM conference program and the various expo stages. An overview of all presentations by Infineon experts is available at www.infineon/pcim.

 

 

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Keysight Technologies today introduces an Electrical-Optical-Electrical (EOE) simulation solution in ADS 2026. Engineers can now simulate electrical-to-optical-to-electrical signal chains within a single design environment. This capability is increasingly important as AI infrastructure and high-performance computing drive demand for faster optical links. This type of analysis is essential for setting architecture and evaluating performance.

By 2029, 87% of hyperscale optical transceivers will operate at 800 Gbps or higher, with 1.6 Tbps and 3.2 Tbps on the horizon. With optical links connecting CPUs, GPUs, and high-speed SerDes interfaces, teams need to model interactions across electrical and optical domains. Legacy simulation workflows handle these separately, requiring results from different tools to be manually stitched together, potentially missing cross-domain effects that impact system performance.

The breakthrough EOE capability in ADS 2026 enables engineers to simulate the complete signal path, from transmitters through optical and photonic circuits to electrical receivers, in a unified workflow. The solution leverages Keysight’s High Speed Digital workflow with Keysight Photonic Designer. By simulating the mixed-domain signal chain before hardware implementation, teams can evaluate electrical and optical design tradeoffs and assess signal integrity against high-speed standards earlier in the design cycle.

Key benefits of the solution include:

• Detect signal integrity issues across electrical and optical domains before prototyping: Simulate high-speed SerDes digital channels and photonics IC behavior together. It catches cross-domain issues that surface only when you model both domains simultaneously.
• Simulate bidirectional optical links as they behave in the real world: Full-duplex optical simulation captures forward and backward signal propagation within an EOE channel. It’s a capability that previous tools could not perform.
• Assess nonlinear effects across multiple wavelengths for multi-lane interconnects: Wavelength division multiplexing support within EOE simulation flows lets engineers evaluate how optical nonlinearities affect performance across wavelengths. This addresses a growing concern as 800G and 1.6T optical links use multiple wavelengths simultaneously on the same waveguide. These modulations in wavelengths and non-linearities model together as a system.
• Obtain a realistic view of system-level signal quality: Noise modeling spans the electrical and optical domains simultaneously, enabling engineers to assess performance under realistic conditions rather than modeling each domain in isolation.
• Catch nonlinear effects before they reach hardware: Modulator bias-dependent and large-signal non-linear effects are visible within end-to-end simulations.
• Make electrical-optical design trade-offs in one workflow: The electrical channel and optical envelope simulators have a patent for multi-domain co-simulation bridges, which eliminates the need to move between separate tools to evaluate trade-offs.

Beyond system-level EOE simulation, ADS 2026 covers the full design flow from system down to component optimization. Through PDK support at the circuit level and Keysight RSoft integration at the component level, engineers get a true representation of photonic IC behavior, with no disconnect between the real chip and system-level simulation.

Niels Fache, Senior Vice President, Keysight, said, “AI infrastructure depends on 800 Gbps and 1.6 Tbps optical links to move data at scale. At these speeds, electrical and optical performance can no longer be modeled separately. With ADS 2026, engineering teams can now simulate those interactions before committing to silicon.”

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Defence technology company Tonbo Imaging receives an award and a contract from the Indian Navy under the ADITI 3.0 innovation framework to integrate and commission a High Power Microwave (HPM) system for naval platforms. The programme supports iDEX and the Defence Innovation Organisation (DIO) under the Ministry of Defence, Government of India. Within the scope of the engagement, Tonbo Imaging will undertake system integration and commissioning activities, followed by the supply of multiple production units upon successful development, validation, and acceptance.

High-power microwave systems represent a strategically significant direct-energy capability and are considered a strategic asset; only a limited number of countries possess them today. Such systems provide a non-kinetic means of disabling or degrading adversary electronics, sensors, and unmanned systems, and one of the few practical approaches to countering swarms of drones, making them increasingly relevant in modern maritime and asymmetric threat environments. The Indian Navy’s continued investment in this domain reflects a forward-looking approach to electromagnetic spectrum dominance and next-generation deterrence.

ADITI (Advanced Defence Technology Incubation) is a Government of India initiative to enable the maturation, integration, and validation of advance defence technologies before induction. The selection of Tonbo Imaging under ADITI 3.0 reflects the emphasis on indigenously developing strategic capabilities aligned with the Navy’s evolving operational requirements and long-term force modernisation plans.

Commenting on the development, Arvind Lakshmikumar, Managing Director and Chief Executive Officer, Tonbo Imaging India Limited, said, “This programme represents a significant responsibility to execute complex capability integration with discipline, rigour, and clear alignment to end-user operational needs. Over the past several years, Tonbo Imaging has invested substantially in the indigenous development of core building blocks of High Power Microwave technology, including critical sub-systems and vacuum tube sources. We are among the very few private organisations to own core intellectual property in vacuum-tube technologies that are fundamental to HPM systems, and this deep technology foundation has been a key factor in our selection for this naval programme. For the class of effects required in High Power Microwave applications, vacuum tube–based sources remain the practical path forward, as they can generate the extremely high peak power and energy levels necessary for effective target coupling. Solid-state RF sources, while well suited for many RF applications, cannot today achieve the required peak power and pulse energy levels within feasible size, weight, and efficiency envelopes for operational HPM systems.”

With this engagement, Tonbo Imaging’s role extends well beyond that of an imaging and electro-optics company, reinforcing its position as a defence technology company focused on the development and integration of advance defence systems. The programme underscores the company’s growing involvement in complex system-level integration, advanced electronics, embedded software, and emerging direct-energy and mission systems, in addition to its prevailing strengths in electro-optics. This evolution reflects Tonbo Imaging’s transition toward delivering integrated defence capabilities.

About Tonbo Imaging India Limited

Tonbo Imaging India Limited is a defence technology company that focuses on the design, development, and integration of advanced sensing, perception, and mission-critical systems for military and security applications. The company’s portfolio spans electro-optics, thermal imaging, situational awareness, advanced electronics, embedded software, and emerging directed-energy technologies, enabling the delivery of integrated defence solutions that support operational requirements across land, maritime, and air domains. Tonbo Imaging continues to evolve as a defence technology and systems company, investing in the development of next-generation directed-energy systems as well as advanced defence solutions such as loitering munitions and counter-unmanned aerial systems (C-UAS), reflecting its strategic focus on addressing emerging operational threats through indigenous capability development.

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The initiative that helps defense organizations to modernize EW test and simulation with greater speed, flexibility, and minimal risk.

Today, Keysight Technologies Inc. announces a strategic collaboration with SRC UK Limited to support EW customers globally in modernizing their test and simulation environments. The initiative will help accelerate the adoption of Keysight’s EWASP, enabling customers to transition to open, scalable, and software-defined architectures with greater efficiency and minimal operational risk. The collaboration also enables customers to preserve and integrate existing threat libraries and test assets into modern, open architectures, enabling continuity while accelerating modernization.

As EW systems grow increasingly complex, defense organizations are seeking more flexible and high-fidelity test environments to validate performance, shorten development timelines, and ensure mission readiness. Through this collaboration, Keysight and SRC will align their respective strengths in EW simulation, systems integration, and local engineering support to address customer needs across global markets.

The effort centers on supporting customers across key areas, including engineering and integration services, training, and knowledge transfer. By combining Keysight’s expertise in EWASP architecture and scenario generation with SRC UK’s in-country engineering and support, customers gain faster deployment, improved access to expertise, and stronger operational readiness. This approach enables more accurate and repeatable validation of EW systems, and the collaboration helps deliver reliable, high-performance capabilities for increasingly complex electromagnetic environments.

Steve Davies, Managing Director at SRC UK, said: “Collaborating with Keysight allows us to bring advanced EW simulation capabilities closer to UK customers. By combining our proven EW, IMD, Mission Data, and engineering expertise with Keysight’s EWASP platform, we can help organizations optimize their test environments while maintaining alignment with evolving mission requirements.”

Eric Taylor, Vice President, Aerospace, Defense and Government Solutions at Keysight, said: “This effort reflects Keysight’s commitment to supporting our customers across the globe as they modernize EW capabilities. Together with SRC, we are expanding access to scalable, high-fidelity simulation and test solutions that reduce risk, improve efficiency, and accelerate mission readiness across the EW development lifecycle.”

Keysight will also discuss its further EW modernization at the upcoming AOC Europe event.

Resources

• EWASP: Advancing EW Test and Measurement
• EWASP Solution Catalog
• EWASP Solution Brief

About Keysight Technologies

At Keysight, we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world.

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STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces a new generation of ultralow-power global-shutter image sensors. That delivers high-quality, always-on vision to compact devices operating on batteries or harvested energy. The VD55G4 (monochrome) and VD65G4 (RGB colour) sensors, part of the ST BrightSense portfolio, are now available to early adopters. Also, enabling customers to start designing their next generation of smart, ultralow-power vision devices today.

The new sensors serve applications including wearables, AR/VR and XR headsets, smart home appliances and medical devices. They deliver rich visual context and AI-ready data under tight constraints on power, size, and cost. The sensors combine an ultralow-power detect-and-wake architecture with a very small global-shutter optical format and interfaces that optimise low-power microcontrollers and cost-effective systems-on-chips (SoCs).

“Always‑on vision is becoming essential for the next generation of personal electronics, from smart glasses and AR/VR headsets to intelligent home appliances and medical devices. With VD55G4 and VD65G4, we are bringing this capability to smaller, lighter products that must run for a longer period on a tiny battery. These new sensors help our customers create more intuitive and responsive experiences, extend battery life, and bring embedded vision and edge AI into everyday devices,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics.

From wearables and AR/VR to smart appliances

VD55G4 and VD65G4 bring always‑on vision to products that must stay small, light, and extremely power-efficient. Building on the ST BrightSense family, they add a colour option, faster response for interactive use cases, and simple connectivity to low‑power microcontrollers, making it easier to add vision to space‑ and cost‑constrained designs.

In wearables, the sensors enable all‑day, always‑aware features such as glance detection, presence sensing, and contextual alerts, while fitting into very compact designs and working directly with microcontroller‑based platforms. For AR/VR and XR headsets, they combine low power and high‑quality capture to support accurate tracking and spatial awareness, helping extend battery life without compromising comfort.

In smart home appliances, IoT devices, and medical products, the sensors allow more intelligence to run locally on the device itself, reducing cloud dependence and standby power. Their tiny size and energy efficiency also make them well-suited to solar‑ or energy‑harvesting‑powered vision nodes.

Ultralow‑power design consumes up to 10x less power

VD55G4 and VD65G4 consume up to 10 times less power than conventional global‑shutter sensors. It watches for changes in a scene and wakes up the main processor only when needed, shifting from continuous streaming to event‑driven operation. This enables all‑day, always‑on experiences, longer battery life, and practical vision systems powered by small batteries or energy harvesting. The small footprint with integrated image processing simplifies design and reduces system cost, while supporting responsive AI‑ready vision features in a wide range of edge devices.

Growing design ecosystem

The VD55G4 (monochrome) and VD65G4 (RGB colour) image sensors generate 300 mm wafers using a 3D‑stacked 65 nm / 40 nm architecture, in-house process and manufacturing in ST Crolles plant.

ST is also offering the full companion ecosystem with multiple tools and resources, including:

• Development boards for platforms such as STM32 and Raspberry Pi
• Turnkey camera modules
• Evaluation software, platform drivers
• A software development kit to accelerate embedded vision projects

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Microchip’s LAN878x and LAN888x PHY families enable secure, scalable and deterministic Ethernet connectivity for automotive and industrial systems. Microchip Technology announces the launch of the LAN878x and LAN888x families of Single Pair Ethernet (SPE) PHY transceivers. It is available in 100BASE-T1, 1000BASE-T1, and dual-speed 100/1000BASE-T1. Designed to deliver secure, reliable and scalable Ethernet connectivity for automotive and other mission-critical applications.

The LAN878x and LAN888x PHYs integrate hardware-based MACsec security compliant with IEEE 802.1AE-2018, providing frame-level confidentiality, data integrity and replay protection without adding system latency or software complexity. Native Time-Sensitive Networking (TSN) support enables deterministic, low-latency communication required for ADAS, zonal gateways and safety-critical control networks.

The LAN878x and LAN888x families go beyond security and performance by delivering the latest functional safety engineered for ISO 26262 ASIL-B systems. Advanced on-chip diagnostics and link monitoring increase visibility, accelerate fault detection and support stronger system-level safety mechanisms than traditional SPE PHY solutions.

To simplify platform scalability and design reuse, the LAN878x and LAN888x families offer pin-compatible SKUs across 100BASE-T1 and 1000BASE-T1 variants, as well as SGMII and RGMII host interfaces. This compatibility allows designers to reuse existing hardware designs while scaling network bandwidth to meet evolving performance requirements.

“OEMs need a clear and efficient path to scale Ethernet performance as vehicle networks evolve,” said Charlie Forni, corporate vice president of Microchip’s networking and connectivity business unit. “The LAN878x and LAN888x families allow teams to reuse designs while supporting higher data rates and stronger security. By integrating MACsec directly in the PHY, we help designers enhance network protection without added system complexities.”

The LAN878x family includes LAN8781, LAN8781M, LAN8782 and LAN8782M, while the LAN888x family includes LAN8881, LAN8881M, LAN8882, LAN8882M, LAN8883, LAN8883M, LAN8884 and LAN8884M. Devices with the “M” suffix support MACsec security. All devices are designed for high reliability, with a maximum junction temperature of 150°C, supporting Automotive Grade 1 operating conditions (-40°C to +125°C).

Beyond automotive, the LAN878x and LAN888x families also support a wide range of industrial and mission-critical applications, including industrial automation, robotics, avionics and other systems that require deterministic Ethernet communication. The LAN878x and LAN888x PHY transceivers are comprehensive hardware evaluation platforms, SGMII, USB and PCIe plug-in boards and Linux software drivers.

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Nuvoton Technology, a leading global semiconductor provider, has announced the launch of “NuML Studio”. This is a graphic user interface (UI) tool designed specifically for machine learning applications on Nuvoton microcontrollers (MCUs). NuML Studio helps developers solve common problems when building Endpoint AI, providing a clear path from real-time data collection to automatic firmware project generation. This allows developers to focus more on improving their AI models and creating new applications.

Easy Setup to Start AI Development Immediately                                                                                                                            NuML Studio optimises Windows and provides a “ready-to-use” version that does not require users to install Python or complex software libraries, making it significantly easier for beginners to set up their development environment.
This “download and run” approach allows developers to bypass tedious setup processes and immediately access intuitive project management features, where they can easily create projects for data collection, machine learning deployment, or a combination of both to facilitate rapid iteration.

Strong Data Collection and Conversion Features                                                                                                                      Accurate data is the foundation of any AI model. NuML Studio provides full support for sensors and automatic data conversion:

• Support for Many Sensors: It supports 3-axis G-sensors, 16KHz Audio, and Image collection using the NuMaker-M55M1 board.
• Automatic Data Conversion: Collected raw data can be converted into standard formats like .csv (for sensors), .wav (for audio), or .jpg (for images) with one click.
• Cloud Integration: With built-in machine learning platform API support, developers can upload their collected data directly to a cloud platform for model training.

Automatic Project Generation for Fast Deployment                                                                                                                         The core technology of NuML Studio can automatically create firmware projects that follow industry standards:

• Support for Popular Models: It works with the TensorFlow Lite Micro (TFLM) framework and supports quantised models.
• Automatic Firmware Creation: It can automatically generate Keil MDK and VS Code CMSIS projects for tasks like image classification, object detection, and keyword spotting (KWS).
• Hardware Optimisation: For chips with an Arm Ethos-U55 NPU (such as the NuMicro M55M1), it provides special library support to get the best performance from the hardware.

With the launch of NuML Studio, Nuvoton reinforces its commitment to lowering the barriers to Endpoint AI development. By providing an integrated path from real-time data collection to automatic firmware generation, this tool allows developers to bypass complex environment setups and focus on AI model optimisation and innovation. Supporting industry standards and providing specialised library support for hardware acceleration on chips like the Arm Ethos-U55 NPU, NuML Studio empowers developers to deliver high-performance intelligent edge applications with unprecedented speed.

 

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Up to eight 10BASE-T1S transceivers expand the 62 Series for high-performance ECU testing via PCI Express, PXI Express, and stand-alone modes.

The Multibus Controller 6281 is a field-proven test system from GÖPEL electronic offering a wide range of applications and high flexibility. GÖEPEL electronic launches a new generation of multibus communication controllers under “Series 62”. This Series 62 test device is specifically tailored to the needs and transmission standards of the automotive sector and is widely used in that field. With the new expansion, the devices in the 62 Series become even more powerful. The new architecture offers users up to 16 independent bus interfaces for CAN, CAN-FD, FlexRay, Automotive Ethernet and LIN. With the new expansion, the devices in the 62 Series become even more powerful: In addition to support for 100BASE-T1 and 1000BASE-T1 users now have access to up to eight independent 10BASE-T1S interfaces. This allows the Multibus Controller 6281 to cover all communication technologies currently used in vehicles with just a single hardware unit. Numerous configuration and application options are available to ensure optimal adaptation to the device under test or the test task.

The new Series 62 is suited for use in restbus simulations as well as test and flash programming of complex ECUs. With the advent of Ethernet in automotive electronics, the demand for reliable and high-performance test solutions for these communication networks are growing. With a bandwidth of 10 Mbit/s and the use of a multidrop topology, which allows a large number of nodes to be connected to a single twisted-pair cable, 10BASE-T1S competes directly with established vehicle buses such as CAN, CAN FD, CAN XL, LIN, and FlexRay. The PLCA (Physical Layer Collision Avoidance) arbitration, as specified in the standard, prevents collisions and thus enables full utilisation of the available bandwidth with low latency. The new expansion for the 62 Series, featuring up to eight independent 10BASE-T1S interfaces for the first time, now allows for the simultaneous parallel testing of up to eight DUTs. This pays off above all in significant time savings during endurance tests. In addition to its eight communication interfaces, the highly flexible 6281 Multibus Controller offers eight digital I/O interfaces (4 digital inputs, 4 digital outputs). The communication interfaces can be configured in a wide variety of ways. In addition to Automotive Ethernet, CAN FD, LIN, K-Line, or FlexRay interfaces

The Multibus Controller 6281 functions as a standalone embedded test system with its own real-time environment, in which the communication and simulation logic is executed entirely on the hardware. The host connection via PCIe, PXIe, or Ethernet is used for parameterisation, configuration, and result transmission. The G PCIe 6281 and G PXIe 6281 variants have been developed as plug-in cards for a PCIe or PXIe bus system, respectively; the G CAR 6281 is a standalone device with Gigabit Ethernet (1 GigE) as the host interface.

Two connector variants are available to the user for connecting the DUT to the communication interfaces: RJ Point Five or HARTING ix Industrial. The feature set of the Multibus Controller 6281 is identical for both variants, regardless of the connector type. The digital inputs and outputs of the Multibus Controller 6281 are located on a Molex connector. The Gigabit Ethernet host interface, which is also available on the PCIe and PXIe cards, supports PTP (Precision Time Protocol) and can therefore be used to synchronise multiple cards and devices.

 

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Rohde & Schwarz presents its latest test and measurement solutions for power electronics systems at PCIM Expo 2026 in Nuremberg. The showcase highlights cutting-edge approaches that address the most demanding challenges of today’s wide-bandgap devices and drivetrain applications. Advance testing and characterisation enable engineers to improve the performance, efficiency and reliability of SiC- and GaN-based power electronics in applications such as AI data centres, renewable energy and e-mobility. At PCIM Expo 2026, Rohde & Schwarz will showcase its latest test and measurement solutions.

“Power electronics are at the core of the energy and mobility transition. With our latest test and measurement solutions, we enable engineers to fully understand, optimise, and validate the performance of next-generation SiC and GaN devices, bringing higher efficiency, reliability and speed to their designs,” says Philipp Weigell, Vice President Market Segment Industry, Components, Research & Universities at Rohde & Schwarz.

3-Phase Analysis for Power and Drives

Rohde & Schwarz introduces the new 3-phase power analysis option (R&S MXO-K333) for the R&SMXO 3, 4, 5/5C series oscilloscopes. This option turns an MXO oscilloscope into the best-in-class waveform analysis tool for in-depth 3-phase AC power characterisation. The solution simplifies total power results, multiphase AC power qualities, harmonic standard testing and distortion measurements, while keeping the original transient waveforms in view for instant root-cause tracing. At the PCIM Expo, visitors can explore how a guided setup wizard maps the eight available channels of the MXO 5 to three voltage and three current probes, validates the wiring (supporting two-wire, three-wire, and four-wire configurations: 2V2A, 3V3A, 3VN3A) and automatically configures the instrument. After the setup is complete, the software delivers per-cycle power calculations, RMS values, power factor, active and reactive power, total power, phasor/vector visualisation and harmonic/THD analysis. All of this is in line with IEC 61000-3-2, and the results are presented with power-waveform views, harmonic spectra, FFT statistics and phasor diagrams. The 3-phase power analysis option provides MXO oscilloscopes with waveform view and trigger capabilities. This enables engineers to see beyond a conventional power analyser’s statistical data, supporting the debugging of power distribution, converters and industrial power systems.

Electric Drivetrain Efficiency

PCIM Expo visitors can also experience the LMG671 power analyser at the Rohde & Schwarz booth, as it demonstrates how to reliably measure efficiency and quantify losses in modern electric drivetrain power electronics. The analyser provides continuous, high-precision power measurement with exceptional dynamic range, delivering output to input efficiency for the drivetrain under test while simultaneously capturing the motor’s mechanical power through direct speed and torque sensing. Inverter output is examined in the three distinct bandwidths, fundamentals, harmonics and wideband power, to extract derived values such as high-frequency losses. All relevant readings and graphs are presented on a dedicated CUSTOM menu, giving users a complete view of the system’s performance at a single glance. The LMG671 is now part of Rohde & Schwarz’s power electronics portfolio, following the recent acquisition of ZES ZIMMER Electronic Systems GmbH.

Double-Pulse Testing of SiC Automotive Power Modules (Hitachi Energy RoadPak)

In another setup, Rohde & Schwarz, together with PE-Systems, showcase an automated double-pulse tester that delivers precise, repeatable measurements while improving consistency and efficiency in power electronics characterisation. The solution provides fast insights into the dynamic switching behaviour of power modules, with automated parameter extraction that reduces human error and accelerates development.

The demo unit is based on the rack-optimised, next-generation MXO58 oscilloscope from Rohde & Schwarz. Leveraging its eight channels in combination with the R&S RT-ZISO isolated probing system, it enables stable and accurate double-pulse testing for SiC and GaN devices in a fully automated environment.

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Noise, India’s leading connected lifestyle brand, announces the launch of NoiseFit Halo 3, a bold, design, first round dial smartwatch crafted to seamlessly blend style, productivity and AI-powered utility. Design for those who refuse to compromise, Halo 3 combines the refined aesthetics of a classic dress watch with the intelligence and functionality of a modern smartwatch. It delivers what consumers have long sought: a timeless round-dial design paired with meaningful smart capabilities. Building on the Halo legacy, Halo 3 features a sculpted integrated-strap silhouette, a vibrant 1.43″ AMOLED display with 1000 nits brightness, and Noise AI Pro, a productivity-first AI ecosystem offering voice commands, voice recording and transcription, health insights, and personalised wallpapers. 

With Noise Vault for QR pass access, a customizable Smart Dashboard, one-tap health checks and up to 7 days of battery life, Halo 3 is built for the modern man who wants to make an impression, moving effortlessly from a boardroom meeting to a boarding gate, with a watch that transitions as fluidly as he does.

Noise AI Pro with Smart Productive Dashboard

At the core of Halo 3 lies Noise AI Pro, a productivity-first AI layer built for modern routines. Voice commands enable hands-free actions, morning briefs summarise sleep and activity insights, and AI Transcription transcribes voice notes into clean notes. Super Notifications refine alerts by surfacing contextual updates like OTPs, ride statuses and delivery notifications (Android supported). Complementing this intelligence is a customizable Smart Dashboard that supports up to five widgets,  from music control and AQI to sleep insights and hydration tracking, ensuring the most relevant information is always within reach.

Round-Dial Design with AMOLED Brilliance, built to command attention

NoiseFit Halo 3 features refined curves that flow into an integrated strap design, creating a cohesive, sculpted silhouette. Precision cuts along the dial edge add depth and character, while the 1.43” AMOLED display with 1000 nits brightness delivers striking clarity and effortless visibility across lighting conditions. Available in metal, leather and silicon strap options, Halo 3 adapts seamlessly from boardrooms to social settings, offering long-wear comfort without compromising on presence.

Noise Vault & Seamless Utility, scan and move

Halo 3 introduces Noise Vault, allowing users to store QR codes for flights, concerts, movies and more directly on the watch. Acting as a digital passbook, it enables seamless, hands-free scanning at entry points and boarding gates, reducing dependence on the phone during high-movement moments.

Health Insights & Week-Long Battery, built for uninterrupted days

The smartwatch supports one-tap heart rate, stress and SpO₂ monitoring alongside continuous tracking throughout the day. Backed by up to 7 days of battery life, Halo 3 ensures users stay informed and connected without frequent charging interruptions.

Price and Availability

Available in four elegant colours with strap options – Metal (Black) , Leather (Brown, Blue) & Silicon (Black),  the NoiseFit Halo 3 is live on sale, at an introductory price of 5,499 on gonoise.com, Amazon and Flipkart. 

Product Specifications
NoiseFit Halo 3

Specification	Details
Display	1.43″ AMOLED, 1000 nits
Strap options	Metal (Black), Leather (Brown, Blue), Silicon (Black)
Core AI	Noise AI Pro: Voice commands, Morning briefs, AI Transcription, Super Notifications (Android-only advanced notifications)
Health	One-tap Heart Rate, Stress, SpO₂; continuous tracking
Compatibility	Android & iOS
Battery	Up to 7 days

 

About Noise

Noise is India’s leading smartwatch and connected lifestyle brand. The brand prioritises consumer centricity, design innovation, and product excellence to constantly reinvent and introduce future-forward innovations in audio, wearables, and the connected lifestyle ecosystem. As a homegrown brand, it is committed to creating an experience-led ecosystem through futuristic yet meaningful technology. With patents and a strong R&D focus, their innovation arm, Noise Labs, boasts many industry-first breakthroughs and houses some stellar technologies across categories. 

Noise is leading the charge to foster the growth of the industry and the nation’s vision by boosting the manufacturing efforts under the Make in India initiative, fostering a strong community of people who want to connect on health, lifestyle, and fitness on the NoiseFit App, while helping businesses ensure their employee wellbeing through the Corporate Wellness Program.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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Renesas Electronics Corporation is a premier supplier of semiconductor solutions. Today, it announces that a subsidiary of Renesas has completed the acquisition of Irida Labs, a Greece-based company specialising in embedded software for AI-powered visual perception systems. The acquisition strengthens Renesas edge AI embedded processing offerings, a key secular growth area for Renesas. It also enables system-level solutions that integrate physical AI vision systems across industrial, robotics, smart city, IoT, agriculture and healthcare markets. As a part of Renesas’ digitalisation strategy, Irida Labs software and tools will be integrated into Renesas 365, a newly released platform that unifies electronics system development from discovery to development and lifecycle management.

While the demand for intelligent systems at the edge continues to soar across industries, developers must often overcome the growing complexity of AI system development. This includes the integration of power-constraint embedded processors and software, training, deploying AI models and addressing latency and security risks associated with data transmission. Vision AI software plays a critical role in interpreting and processing visual data from cameras and sensors widely used in industrial inspection, robotics guidance, in-cabin automotive sensing, traffic and infrastructure monitoring, smart retail analytics and safety and security systems.

The addition of Irida Labs to Renesas’ product portfolio addresses these emerging challenges. By combining Renesas’ AI-enabled RA microcontrollers (MCU) AND RZ microprocessors (MPU) with Irida Labs comprehensive tool suite and lightweight Vision AI software, Renesas can now delebier high performance, power-efficient edge AI solutions that are ready for deployment. Together, these capabilities reinforce Renesas’ progress towards fully integrated Vision AI system solutions.

Vassilis Tsagaris, CEO & Co-Founder of Irida Labs, added, “The joining of Irida Labs into Renesas marks an important milestone in our edge vision AI journey. By combining Irida Labs’ edge Vision AI expertise and our PerCV.ai software with Renesas hardware and global ecosystem, we open up exciting new opportunities to deliver meaningful impact on edge AI worldwide. I am proud of what the team has built, and genuinely excited to take it forward together with Renesas, turning our shared vision into reality.”

Before the acquisition, Renesas and Irida Labs collaborated as partners to develop solutions combining Irida Labs’ PerCV.ai software with Renesas’ RA and RZ devices. Bringing these capabilities in-house enables Renesas to deliver more tightly integrated solutions quickly. Renesas also plans to integrate Irida Labs software and tools into its newly introduced intelligent, open cloud-based development platform, Renesas 365.

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Rhode & Schwartz and Greenerwave conduct a joint measurement trial that demonstrates a near-field system. It can record the full radiation pattern of a 50 cm Ku band electronically steerable array for a SATCOM antenna in just half an hour. The result matches simulation models within a decibel, that make this approach rapid and precise. For manufacturers of SATCOM systems facing large chamber constraints, it offers a clear path towards quick and cost-effective testing.

Electronically Steerable Array (ESA) antennas are a key component in modern SATCOM systems. Accurate knowledge of their radiation pattern is required for reliable operation in LEO, MEO, and GEO orbits. However, conventional far-field testing demands chambers that are often larger for Ku or Ka band antennas, especially when the aperture of the Antenna Under Test (AUT) reaches half a meter or more. Compact Antenna Test Range (CATR) is relatively large for AUTs and are time consumiong dual-axis positioning of AUT to map the radiation pattern.

Greenerwave’s innovative SATCOM user terminals are based on Reconfigurable Intelligent Surface (RIS), allowing the company to design electronically steerable antennas that deliver high-performance connectivity while reducing energy consumption and reliance on semiconductors compared with conventional solutions.

For the joint measurement campaign, T&M expert Rhode & Schwarz provided its R&STS8991 over-the-air and antenna measurement system, equipped with a conical cut positioner, and its R&SZNA vector network analyser. Together, they evaluated Greenerwave’s passive single-aperture ESA that uses RIS technology for beamforming. The Antenna Under Test (AUT) features a 50x 50cm aperture and is designed for low power consumption and easy integration.

The measurement covered an extended upper hemisphere down to a polar angle of 120 degrees, using a one-degree step size. Ten Ku band frequencies were recorded in a total of 32 minutes due to the system’s hardware trigger function. Data was processed using the R&SAMS32 antenna measurement software, which applied the FIAFTA near-field to far-field transformation.

Comparison with the original simulation based on a numerical twin model and with results from Greenerwave’s CATR setup showed peak gain or directivity variations, validating the accuracy of the near-field solution. The trial shows that even large SATCOM antennas can be characterised quickly and accurately, providing a practical alternative to large-sized far-field CATRs. This system can be used by other SATCOM makers testing broadband, research lab environment, IoT for applications requiring flexible beam control and high data rates.

The post Rohde & Schwarz and Greenerwave Achieve an Efficient ESA Antenna Charecterisation Using Near-Field Technology appeared first on ELE Times.

Keysight Technologies today announces a new PCIe 7.0 Receiver (RX) Test application, growing its PCIe 7.0 portfolio to enable end-to-end transmitter and receiver validation. The receiver’s test application targets the emerging challenge of receiver validation performance at 128 GT/s for next-generation computers, AI, and data centre applications.

PCIe base specification releases continue to shorten and the PCIe 7.0 standard moves towards adoption. Engineers face rising challenges in validating receiver performance. These challenges are caused by a lack of test equipment for receiver testing, along with the increasingly complex stress signal calibration requirements.
At 128 GT/s, PCIe 7.0 receiver validation has become a defining hurdle for the industry. Reliable validation testing ensures the least risk and interoperability as the ecosystem scales. Keysight’s receiver test solution enables engineers to validate devices with confidence.

The combination of M8050A BERT family, M8042A 120 Gbaud pattern generator and M8043A error analyser forms the receiver dress testing. This enables accurate signal generation and analysis for ASIC validation.

Complimenting the hardware, the new N5991PB7A software helps in accelerating the receiver validation process by simplifying the calibration and control of PCIe 7.0 receiver stress signals. Advanced automation capabilities enable accuracy in ASIC receiver characterisation.

Combining the hardware and the software formulates a comprehensive PCIe 7.0 receiver test solution that aligns the validation workflow and improves measurement accuracy with ASIC development reliability in common clock mode.  

The Key benefits of the new receiver stress calibration for PCIe 7.0 : 

• Accelerates Receiver Bring-Up and Validation: Automated PCIe 7.0 RX workflows reduce manual setup and enable faster results.
• Reduces Compliance Risk at 128 GT/s: Specification-aligned, stressed-signal generation exposes receiver weaknesses initially, minimising last-stage rework.
• Compliments End-to-End PCIe 7.0 Test: When combined with Keysight’s PCIe 7.0 TX test solution, engineers gain comprehensive transmitter and coverage.

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The Vishay Semiconductor VETH100A1DD1 ESD has successfully passed IEEE 10BASE-T1 compliance testing. It confirms suitability for use in a one-pair Ethernet (OPEN) bus architecture.

The VETH100A1DD1 meets all three OPEN Alliance EMC Test Specifications for ESD Protection Devices. Which supports 100BASE-T1S , and 1000BASE-T1 applications. 10BASE-16 is an automotive data bus which is designed to connect eight nodes over a single twisted-pair cable with lengths of up to 25 meters. The standard nominal data rate is 10 Mbit/s using baseband transmission over one twisted pair in short-range operations. Ethernet connects 100BASE-T1, 1000BASE-T1 , and 10BASE-TS in a multidrop bus topology. It protects automotive Ethernet networks.

10BASE-T1S network includes an ESD protection device at each node; very low capacitance is critical to maintain signal integrity across the bus. The VETH100A1DD1 is specially designed to meet this requirement, offering a capacitance below 1 pF as described in the 10BASE-T1S test specification, making it well-suited for 10BASE-T1S applications while remaining compatible with higher-speed automotive Ethernet standards.

Vishay manufactures one of the world’s largest portfolios of semiconductors and electronic components that are essential to create innovative designs in automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets.

 

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The Union Cabinet approves two more semiconductor projects under the India Semiconductor Mission (ISM) with an investment of more than Rs. 3936 Crore. India’s first commercial Mini/Macro LED display; the facility is based on GaN(Gallium Nitride) Technology and a semiconductor facility. These two approvals are expected to generate more than 2,230 employment opportunities for skilled professionals in Gujarat.

Crystal Matrix Limited (CML) will establish a compound facility semiconductor fabrication. The annual capacity for Mini/Micro-LED display panels is 72,000 sq. meters, and for Mini/Macro LED GaN Epitaxy Wafers is 24,000 sets of RGB wafers. Primarily, these products will be used in large displays for TVs and signage/commercial displays, medium-sized displays for tablets, smartphones, car displays, and Micro displays for Extended Reality(XR) glasses and smart watches.

Suchi Semiconductor Private Limited (SSPL) will set up an Outsourced Semiconductor Assembly and Test(OSAT) facility in Surat, Gujarat, with a production capacity of 1033.20 million chips per annum. The aim is to include power electronics, analog ICs, industrial systems, automotive, industrial automation, and customer electronics.

These two approvals are enhanced by infrastructure support from 315 academic institutions and 104 start-ups across the country. Two projects have already initiated the commercial shipment, and two more are expected to start soon. It would add to the growing world-class chip manufacturing in India.

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Arrow Electronics (NYSE: ARW) today announced the launch of Digital Test Drive, a cloud‑based remote engineering service that helps technology developers evaluate hardware faster, reduce costs and improve productivity.

Through a secure, private web link, individual users and distributed teams can instantly connect to a pre-set up virtual machine and connect via cloud directly to physical development boards hosted in Arrow’s engineering labs. Users can remotely control evaluation kits, access software environments, run tests and view results in real time. Workshops, training, product demonstrations and live support from Arrow’s technical experts are available.

Digital Test Drive simplifies early‑stage testing and collaboration by helping eliminate common barriers such as kit availability, shipping delays, customs paperwork, platform comparisons, complex setup and software installation, which helps businesses shorten the development cycles and accelerate decision‑making.

“Digital Test Drive helps remove the delays and complexity that slow product development,” said Murdoch Fitzgerald, chief growth officer of global services for Arrow’s global components business. “There’s no shipping, no setup and fewer up‑front costs, just instant access to the tools engineering teams need to work more efficiently.”

Digital Test Drive complements Arrow’s existing Test Drive program that allows customers to borrow physical hardware for on‑site evaluation for up to 28 days.

More information:
Digital Test Drive – Remote Hardware Testing

About Arrow Electronics
Arrow Electronics (NYSE: ARW) sources and engineers technology solutions for thousands of leading manufacturers and service providers. With 2025 sales of $31 billion, Arrow helps enable innovation across major industries and markets. Learn more at arrow.com.

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In an exclusive interview with ELE Times, Shrikant Acharya, CTO and Co-founder of Excelfore, outlines how vehicles are evolving from simple update-driven systems to intelligent, data-centric platforms. He explains the distinction between OTA updates and data aggregation within a unified lifecycle pipeline, while highlighting innovations such as adaptive delta compression and distributed architectures. Acharya also explores the growing role of Ethernet, AI, and scalable system design in shaping software-defined vehicles, positioning India as a key market in this transformation. 

ELE Times: Could you elaborate on OTA updates and how they differ from in-vehicle data-related processes? Also,  what differentiates your OTA solution in this evolving landscape?

Excelfore:
It is important to distinguish between OTA updates and data aggregation. OTA primarily refers to a one-way process—delivering updates from infrastructure to the device. In contrast, extracting data from the device back to the infrastructure is better described as data aggregation. When viewed as a unified pipeline, both functions contribute to lifecycle management. Updates are deployed to improve or fix device functionality, while data is retrieved to evaluate performance, detect issues, and validate those updates through analytics.

From a technical standpoint, OTA updates are asynchronous, involving large data transfers—often several gigabytes —owing to their bulk, especially in systems like Android-based infotainment. Conversely, data retrieval is typically synchronous or near-real-time, requiring smaller, segmented packets to ensure continuity and responsiveness, thereby maintaining the real-time nature of the aggregation. In essence, while both operate within the same pipeline, OTA updates and data aggregation serve fundamentally different purposes—one enables corrective action, while the other supports monitoring and analysis.

OTA has evolved significantly—from early implementations in industrial systems to its adoption in automotive environments. Initial solutions, such as those derived from mobile update frameworks, were primarily suited for infotainment systems and can be considered first-generation approaches. At the same time, our solution represents a more advanced, third-generation architecture. A key innovation lies in its plug-and-play capability. Devices entering the network authenticate themselves through certificates and register dynamically. The client system acts as a generic dispatcher without embedded knowledge of the vehicle or environment, enabling deployment across diverse ecosystems.

Another major advancement is the distributed architecture. Complexity is intentionally removed from the communication pipeline and instead distributed between the server and device. This approach ensures scalability, simplifies integration, and allows seamless accommodation of legacy systems. OEMs can retain existing device management frameworks while selectively adopting newer capabilities.

Agents within devices handle updates, ensuring structured execution while maintaining flexibility. This modular and distributed design is central to our differentiation, which also helps OEMs to preserve legacy. 

ELE Times: Could you explain the concept and significance of adaptive delta compression? How does this approach optimize bandwidth and system performance?

Excelfore:
Traditionally, software updates required transmitting the entire payload. Delta compression improves efficiency by sending only the differences between software versions, significantly reducing bandwidth usage and update time. However, managing these differential files over time creates a substantial IT burden for OEMs. Our approach shifts this responsibility to the server-client system. The server dynamically determines when and how to generate and transmit delta updates, eliminating the need for OEMs to manage them manually.

Also, if one doesn’t want to use the main channel to send these large files, you only give them a reference to the URL for that payload, and then the agent sets up an independent connection and puts it down. Also, the “adaptive” aspect introduces intelligence into this process. The system evaluates multiple parameters—such as device memory, processing capability, network interface (CAN, LIN, Ethernet), and connection speed—to determine the most efficient compression strategy.

Additionally, large payloads are handled via separate channels, ensuring that the primary communication pipeline remains responsive for critical operations such as authentication and command execution.

Regarding optimization, it is achieved by tailoring data packets to device constraints. For instance, if a device has limited cache capacity, the system ensures that data units fit precisely within that space. This avoids inefficiencies caused by partial data processing and repeated memory access. Beyond cache considerations, factors such as network speed and interface type are also evaluated. The system assigns weighted parameters to these variables and generates an optimal data transfer strategy, ensuring efficient utilization of bandwidth while maintaining system performance.

ELE Times: With the rise of SDVs and advanced features, how do you see networking technologies evolving?

Excelfore:
Ethernet has emerged as the dominant in-vehicle networking standard due to its scalability, cost efficiency, and high bandwidth capabilities. Earlier technologies like FlexRay served as transitional solutions but have largely been superseded.

While legacy systems such as CAN will continue to exist due to installed base constraints, advancements like 10 Mbps multi-drop Ethernet are increasingly capable of replacing them.

Time-Sensitive Networking (TSN) plays a crucial role, particularly in time synchronization and deterministic data transmission. Combined with Quality of Service (QoS) mechanisms, it enables efficient bandwidth utilization—often achieving up to 85–90% channel efficiency compared to significantly lower utilization without traffic management.

ELE Times: How are SDVs reshaping vehicle architecture and OEM strategies? How do you view the evolution of SDVs and connected vehicles in India?

Excelfore:
The term SDV is often used loosely, but its true definition involves a standardized hardware platform whose functionality can be dynamically reconfigured through software.

Architecturally, the industry has evolved from domain-based systems to zonal architectures with centralized computing. Zonal controllers process localized data, which is then transmitted to central compute units for decision-making.

This shift introduces challenges, particularly in thermal management, as high-performance compute systems generate significant heat. Cooling solutions have thus become a critical component of system design.

For India, it presents a unique opportunity, having bypassed several legacy stages of technological evolution. This allows for a more forward-looking approach, with fewer constraints from outdated systems. There is a strong willingness to adopt advanced technologies based on value and functionality. This mindset, similar to what was observed in China during its rapid technological growth phase, creates a favorable environment for innovation.

For technology providers, this openness enables deeper collaboration and the deployment of cutting-edge solutions, positioning India as a promising market for SDVs and connected vehicle ecosystems.

ELE Times: What role do you see AI playing in OTA and SDV ecosystems?

Excelfore:
AI adoption in vehicles is constrained by cost and computational limitations. As a result, the focus is shifting toward domain-specific, lightweight models rather than large, generalized AI systems.

While generative AI will primarily reside in the cloud, vehicles will utilize smaller models tailored to specific functions—such as diagnostics or object detection. One practical application is the digitization of vehicle manuals, enabling intelligent interpretation of diagnostic codes and user-friendly outputs.

However, monetization will be a key factor. Advanced AI-driven features are unlikely to be offered free of cost and will likely be delivered as subscription-based services.

ELE Times: How do you ensure safety and integrity in OTA updates, especially for critical systems?

Excelfore:
Data integrity is ensured through mechanisms such as SHA-256 hashing, which verifies that transmitted data remains unaltered. If discrepancies are detected, updates are rejected.

Authentication is enforced באמצעות digital certificates, establishing both device identity and software origin. Additionally, encryption ensures that only the intended device can decode and execute the update.

A critical vulnerability lies in key management during manufacturing. Protecting private keys is essential, as any compromise at this stage can undermine the entire security framework.

The post From Updates to Intelligence: How OTA, Data, and Ethernet Are Reshaping Vehicles appeared first on ELE Times.

STMicroelectronics is enabling a shift from dedicated audio wiring to Audio over Ethernet in next-generation vehicles. The Stellar G6 automotive MCU integrates hardware-level Time-Sensitive Networking, Media Clock Recovery, and a dedicated communication engine to deliver high-fidelity, zero-jitter audio over the vehicle’s existing Ethernet backbone. The approach eliminates the need for proprietary A2B cables and transceivers, saving automakers approximately $70 per vehicle while enabling new capabilities such as real-time Active Noise Cancellation at the zonal level. A joint solution with AutoCore has already demonstrated end-to-end latency under two milliseconds, and ST is showcasing the technology live at Embedded World 2026 in Nuremberg.

Bringing high-fidelity audio to the software-defined vehicle
In a car, sound is personal. Listeners sit in fixed, asymmetrical positions surrounded by dozens of speakers, and their brains are ruthlessly precise about timing. A delay of just five milliseconds between two speakers is enough for the Haas Effect to kick in, tricking the listener into “pinning” the sound to whichever speaker fired first. A delta of two milliseconds can pull the entire soundstage to one side of the cabin, destroying the “phantom center” that makes a singer feel like they’re standing on the dashboard. When speakers fall slightly out of sync, sound waves collide destructively, creating nulls in the frequency response that make audio sound hollow or metallic. This is comb filtering, and it’s the acoustic signature of a timing problem.

These are not edge cases. They are the everyday reality of in-cabin audio, and they explain why the automotive industry has relied on dedicated wiring like A2B (Automotive Audio Bus) for so long. A2B is effective, but it demands its own cabling and transceivers, adding weight, complexity, and cost to the vehicle harness. Now that the industry is shifting toward Software-Defined Vehicles and zonal architectures, a new question is taking center stage: can a single Ethernet backbone carry diagnostics, control signals, and high-fidelity audio at the same time, without compromising the millisecond precision that human hearing demands?

With the Stellar G6 automotive MCU, we set out to prove that it can.

Latency is a number; jitter is the real enemy
Engineers often focus on latency, the constant delay between source and speaker. However, in automotive audio, jitter is far more destructive. Jitter is the variation in that delay. On a standard Ethernet network, an audio packet can get stuck behind a burst of sensor data. If the delivery time “jitters” by even a few microseconds, it introduces phase distortion that smears the music. For applications like Active Noise Cancellation, where a microphone signal must be inverted and played back through a speaker in near real-time, jitter doesn’t just degrade quality. It breaks the physics entirely.

Solving this requires more than a fast processor. It requires determinism, meaning the guarantee that a packet arrives exactly when it’s supposed to, and clock coherency, ensuring every node in the vehicle shares the same nanosecond. These are hardware problems, and they need hardware answers.

What Stellar G6 brings to audio over Ethernet
The Stellar G6 was engineered to treat audio as a time-critical stream, not as generic data. Three hardware-level capabilities make this possible. First, the Stellar G6 features a built-in L2+ Ethernet Switch supporting the full suite of Time-Sensitive Networking (TSN) standards. IEEE 802.1AS (gPTP) synchronizes every node in the vehicle to a sub-microsecond master clock. IEEE 802.1Qbv (scheduled traffic) creates protected time slots for audio and microphone data, ensuring they always get priority even on a congested network. IEEE 802.1CB enables seamless redundancy through Ethernet ring topologies, eliminating the single point of failure that plagues traditional star configurations.

Second, even with a perfectly synchronized network, the audio sample clock can still drift. The Stellar G6 includes specialized Media Clock Recovery hardware. Rather than relying on a software-based PLL, a dedicated digital hardware loop recovers the Audio Master Clock directly from the Ethernet stream, keeping speakers and microphones in perfect phase. The result: virtually zero jitter on the recovered clock, which is the critical enabler for professional-grade audio delivery.

Third, Stellar embeds a dedicated communication engine that offloads all data-moving and synchronization tasks from the main CPUs. This hardware isolation means that a processing spike in the vehicle’s body-control zone cannot cause a pop or a glitch in the audio. Communication runs at the lowest possible latency, completely decoupled from whatever else the host cores are doing.

From central processing to localized intelligence
Traditionally, all audio processing happened in a central head unit. Moving to an Ethernet-based zonal architecture changes this fundamentally. With a Stellar G6 acting as the Zonal Controller at each vehicle zone, significant compute now sits closer to every speaker and microphone.

This unlocks capabilities that were previously impractical. In-Cabin noise cancellation becomes possible by placing microphones near individual seats, identifying noise sources such as a loud conversation in the rear, and cancelling them locally. Road noise cancellation works on the same principle: the system captures vibration and road noise through zone-level microphones, generates an anti-noise signal, and plays it back through nearby speakers with near-zero latency. The processing happens at the edge, in the zone, rather than travelling back and forth to a central unit. For the passenger, the result is a cabin that can become a sanctuary, a workspace, or a private sound bubble, all updated over-the-air as easily as a smartphone app.

The cost equation: saving up to $70 per vehicle
Beyond acoustic performance, Audio over Ethernet carries a straightforward economic argument. By eliminating dedicated A2B cables and transceivers and reusing the vehicle’s existing Ethernet backbone, automakers can save approximately $70 per vehicle. In an industry where every cent on the bill of materials is scrutinized, consolidating audio onto a network that already exists for diagnostics and control is not just elegant engineering. It’s a significant cost reduction that scales across millions of units.

From proof-of-concept to production validation
In January 2026, we announced a collaboration with AutoCore on an Ethernet-based Zonal Controller distributed audio solution. By combining Stellar G6’s Media Clock Recovery with AutoCore’s TSN protocol stack, the joint solution achieved end-to-end audio latency of less than two milliseconds. That is fast enough to run high-performance Active Noise Cancellation over a standard Ethernet backbone.

At Embedded World 2026, we are taking this further with a live demonstration of Stellar G6’s native Audio-over-Ethernet capabilities. The demo features two Zonal Controller Units, each built around a Stellar G6, connected in a ring topology. Each ZCU streams four channels of 24-bit audio over Ethernet, for a total of eight high-fidelity streams running simultaneously. Visitors can witness the audio clock recovery in action, hear the zero-jitter playback quality firsthand, and see the resilience of the ring topology through live plug-and-unplug trials that demonstrate fault tolerance without audio interruption. It is a concrete, audible proof point: dedicated audio cables are no longer a requirement for premium in-cabin sound.

The Ethernet backbone is the nervous system of the SDV
We are moving toward a future where the vehicle’s Ethernet backbone becomes its nervous system, and Audio over Ethernet is one of the most visible and audible ways this transformation is taking hold. When a vehicle can use its Zonal Controllers to deliver immersive sound, suppress road noise, or create a private acoustic zone for every passenger, the concept of what a “car” offers fundamentally changes.

Stellar G6 is not just a processor in this journey. Solving one of the most demanding timing and synchronization problems in hardware, it allows automotive engineers to focus on the experience rather than the plumbing. As the industry embraces the zonal revolution, we are ready to help redefine what the drive actually sounds like.

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