ELE Times

Power designs now face the same demands at the same time: higher efficiency, smaller size, lower cost, and more power from the same space. For years, silicon has supported these designs. However, in a growing number of applications, it is close to its practical limits, and further optimisation increases losses and heat.

For this reason, gallium nitride (GaN) power transistors are receiving significant attention. ST has added a new 700 V and 100 V PowerGaN family to its portfolio and brings these advantages to mainstream power conversion. This article explains what the technology offers power designs and why it matters now.

Gallium nitride is a wide-bandgap semiconductor and, in a power converter, its main advantage is speed. Gallium nitride (GaN) power transistors, also called gallium nitride high electron mobility transistors (GaN HEMTs), switch much faster than silicon devices and lose less energy each time they turn on and off. Two effects follow from this behaviour. Less energy is wasted as heat, and the converter can operate at a higher switching frequency without losses increasing as they do with silicon.

Almost every benefit of GaN results from these two effects. Until recently, the technology appeared mainly in specialised, high-end products where the cost was justified. With a broad 700 V to 100 V family now in production, GaN has become a practical choice for everyday power conversion across a wide range of designs.

The clearest benefit is efficiency. Because GaN has low conduction and switching losses, more of the input power reaches the load, and less of the power turns into heat. In ST reference designs, PowerGaN has achieved power-supply efficiency of up to 98.6%. Higher efficiency affects the entire design: lower operating costs, less energy consumption over the product life cycle, and lower demand on the cooling system.

For equipment that operates continuously, such as power supplies, lighting, and energy systems, even a small efficiency gain accumulates over thousands of operating hours. Efficiency is usually the first reason that a design team considers GaN, and it leads directly to the next two benefits.

The second benefit is size. A higher switching frequency allows the bulky magnetic components and filters in a converter to shrink, and the rest of the design shrinks with them. That creates two options for a design team: deliver the same power in a smaller, lighter product, or fit more power into an existing enclosure.

Gallium nitride (GaN)-based designs have reached an average size reduction of around 50%, compared with earlier silicon equivalents, at power densities above 100 watts per cubic inch. For products with tight space and weight constraints, such as compact adapters, chargers, and on-board systems, that extra headroom can determine whether a design fits at all. Increased power density is where the move to GaN becomes visible in the finished product.

The third pillar is lower system cost. It results as much from the design around the transistor as from the device itself. A gallium nitride (GaN)-based converter uses smaller passive components and fewer passive components and often requires little or no heat sink. As a result, the overall system cost decreases, and the design is simpler.

Cooler operation also improves reliability and life cycle, which means that the system tends to last longer and requires less servicing. Lower energy consumption over the product life cycle adds to the savings. Together, these effects reduce the cost of building and operating the system, and they are a large part of why GaN deserves its place in a design.

These benefits are not tied to a single product type. The same value higher efficiency, greater density, and lower total cost) extends across a broad range of designs, including AC-DC and DC-DC power supplies, USB Type-C adapters and chargers, LED lighting, motor control, AI servers, robotics, industrial systems, and advanced consumer applications such as home appliances, as well as power and energy systems such as solar and storage. The same value also supports the growing power demands of computing and electrification.

Across these areas, priorities differ, but the same three advantages apply. A choice of package options allows a design team to match the device to the power level and board layout of each application. Because the 700 V & 100V PowerGaN family is already in production and available, these benefits can already be built into designs today.

Adopting a new switching technology is a decision about support as much as about the device itself. Alongside the 700 V and 100 V family, ST brings decades of power semiconductor experience, a broad product portfolio, a reliable supply chain, and strong technical support. For a team that works with GaN for the first time, that combination reduces the risk of the transition and shortens the path from an idea to a working design. It is part of what makes the value of PowerGaN practical rather than theoretical.

GaN power transistors provide higher efficiency, greater power density, and lower system cost for power conversion. The new 700 V and 100 V PowerGaN family makes these benefits available to mainstream designs. For a design team that is considering the move to GaN, the technology has reached the point at which its advantages are practical today rather than promised for tomorrow.

The post GaN Power transistors: What 700 V and 100 V PowerGaN Bring to Power-Supply Design appeared first on ELE Times.

Aheesa Digital Innovations, a DLI-scheme backed fabless semiconductor company headquartered in Chennai, has signed a Memorandum of Understanding (MoU) with Optilink Networks Pvt. Ltd., onboarding the company as its packaging partner for VIHAAN-I, Aheesa’s indigenous RISC-V broadband networking System-on-Chip (SoC). The partnership marks another step towards commercialising VIHAAN-I, strengthening the pathway from indigenous chip design and silicon validation to packaging, distribution and market deployment.

The partnership brings together two complementary parts of the broadband technology ecosystem. Optilink has supported the VIHAAN-I journey through testing, validation and engineering support, with its in-house capabilities across product design, firmware development and hardware integration. Under the MoU, Optilink will support end-to-end product development from prototyping to packaging, while the companies work towards developing, qualifying and commercialising ONT/CPE products based on the VIHAAN-I chipset. The collaboration is aimed at delivering solutions that are cost-efficient and comply with Indian and global standards, while accelerating commercialisation through Optilink’s engineering and manufacturing expertise.

This further advances Aheesa’s ambition to establish itself as a semiconductor design house with a portfolio of Indian-designed chips serving both domestic and global markets. With design, silicon validation, packaging and distribution capabilities progressively coming together, Aheesa is now leaping towards commercial deployment in early 2027.

The partnership comes in a landmark year for Aheesa. VIHAAN-I achieved tape-out on Republic Day 2026, followed by Aheesa securing investment from the Tamil Nadu Infrastructure Fund Management Corporation (TNIFMC) through the Tamil Nadu Emerging Sector Seed Fund. On this Independence Day, the chip achieved first-pass silicon success on its very first attempt.

Commenting on the partnership, Sridharan Mani, Founder and CEO, Aheesa Digital Innovations, said, “Building a chip is only half the journey as the real test is turning that silicon into a product people can use. No semiconductor ecosystem thrives on the strength of one player alone; it takes multiple partners, each doing their part, to carry a design to the consumer and make this sector succeed. With Optilink joining us for packaging, VIHAAN-I takes a step closer to that reality. We have spent years estabilishing that world-class semiconductor design can happen in India. Now with Optilink, we’re building the pathway to take it from systems to scale.”

Devchand Haria, Managing Director, Optilink Networks Pvt. Ltd said, “At Optilink, we’ve spent close to two decades building the networking hardware that connects Indian homes from fiber access to broadband CPE. Partnering with Aheesa for VIHAAN-I lets us bring that same experience to an Indian-designed chip, taking it from silicon to the products that will actually sit in Indian households. This is exactly the kind of collaboration our sector needs, that is Indian design and Indian manufacturing expertise working together to put homegrown silicon inside the devices people use every day.”

Founded in 2005 and headquartered in Mumbai, Optilink Networks Pvt. Ltd. is an Indian Original Equipment Manufacturer (OEM) that designs, manufactures and distributes IP-based networking hardware, Fiber-to-the-Home (FTTH) solutions and IP Television (IPTV) technologies. Serving ISPs, telecom operators, cable and MSO networks, enterprises and government customers, Optilink has built a strong B2B presence through its channel partners, distributors and system integrators across India.

Aheesa’s work spans indigenous semiconductor and networking technologies across telecom, broadband, cybersecurity and edge computing. This partnership now reflects the wider momentum in India’s semiconductor design ecosystem, now scaling under Semicon 2.0 — the ₹1,27,500 crore programme approved in July 2026 to build a globally competitive supply chain across chip design, manufacturing, packaging and materials. As indigenous designs move from validation towards commercial adoption, it is partnerships like this, pairing Indian chip design with the reach to deploy it, that will help define how homegrown silicon scales.

The post From Silicon to Scale: Aheesa Signs Packaging MoU with Optilink Networks appeared first on ELE Times.

Infineon Technologies AG introduces the TDA235E5 and TDA235E0, a dual-phase smart power stage family designed to meet the rapidly growing power density requirements of next-generation AI accelerators and vertical power delivery modules. Integrating Infineon’s OptiMOS 6 MOSFETs and a dual-phase driver IC in a compact 6 x 6 x 0.8 mm³ package, the new family delivers benchmark power density exceeding 2 A/mm², setting a new reference point for power stage performance in high current AI processor applications. As hyperscalers and datacenter operators continue to scale AI infrastructure, the demand for power delivery solutions that combine higher current capability with shrinking physical footprints is becoming a critical bottleneck.

“Infineon customers are designing AI systems that will define the next decade of computing infrastructure,” said Rakesh Renganathan, Vice President Power ICs at Infineon. “The TDA235E5 and TDA235E0 power stages give designers the power density, thermal performance, and design flexibility to move faster and build with confidence, backed by Infineon’s full AI server power delivery ecosystem.”

The two devices support up to 300 A peak current and 120 A total design current (TDC), making them well suited for next generation AI xPU accelerators as well as conventional server CPUs in datacenter environments. Both lateral and vertical power delivery configurations are supported, providing the design flexibility required as the industry transitions toward vertical power module architectures in advanced AI processor packages. Superior thermal impedance from junction to top side enables efficient liquid cooling integration, a characteristic that is increasingly important as power levels per processor socket continue to rise and traditional air-cooled thermal budgets are exhausted. Combined with Infineon’s digital multiphase controllers, the power stages support flexible, scalable multi-rail architectures that reduce time to deployment in fast-evolving AI server platforms.

The TDA235E5 and TDA235E0 integrate into Infineon’s end-to-end AI server power delivery ecosystem, spanning the full power chain from grid interface to processor core rails. By combining the complementary strengths of silicon, silicon carbide, and gallium nitride, Infineon provides datacenter customers with a proven, scalable path to the highest efficiency, robustness, and power density available for AI-optimized infrastructure. The datacenter power delivery market is one of the semiconductor industry’s fastest-growing demand segments, driving Infineon’s continued product investment to serve this opportunity at the component level where power density requirements are most critical. 

The post Infineon Sets New Power Benchmark for AI accelerators and Vertical Power Delivery with 2 A/mm² Dual-Phase Smart Power Stages appeared first on ELE Times.

Synopsys, COEP Technological University and CADFEM India have setup the “Ansys Digital Twin & Multiphysics Lab” on the COEP campus, Pune to support advanced engineering education, research, and strengthen the industry-academia partnerships. This program holds huge significance in an ecosystem for automotive and electrical vehicle industry which utilizes the technologies for vehicle system’s product development and validation processes.

The laboratory was established as a part of Memorandum of Understanding (MoU) signed during the 2026 Symposium. It will provide students, researchers, and faculty members access to Ansys digital-twin technologies and advanced high-end multiphysics simulation tool that have been acquired by Synopsis. The lab will host industry training and certification, technical seminars and research.

Multiphysics simulation has a potential role in analysis of different physics domains in development process of the vehicle or component within EV industry. Engineers are able to investigate on battery thermals, electric motor efficiencies, power electronics functionality, structural strength, electromagnetic phenomenon and thermal management by simulation work-flows prior build physical prototype. Digital-twin methodology can create bridge between physics-based models and actual data taken from sensors and operation data so to monitor and predict system behaviours.

The post Synopsys, COEP Tech University and CADFEM Establish Digital Twin and Multiphysics Lab in Pune appeared first on ELE Times.

​India’s rapidly growing EV industry faces a capability gap in developing and producing high-technology components that can meet modern technology demands because about 80% of component manufacturers are small businesses built for traditional mechanical parts rather than advanced electronics and software. The capability gap involves areas such as batteries, power electronics, embedded software, advanced electronics, and system integration.

India is shifting more towards electric vehicles as its automotive supply chain expands. Original Equipment Manufacturer (OEM) sourcing of auto-components is expected to increase by 16% to 6.6 lakh crore by FY26 against components’ exports valued at around 2.1 lakh crore. However, import charges rise at a greater rate, with China covering about 36% of all the auto component imports India uses.

The capability challenge is particularly significant for small and medium-scale enterprises (MSMEs), which constitute almost 80% of Indian auto-parts producers. Though electronics, embedded software, advanced engineering, and system integration are key factors for competitiveness, a lesser than half the small and medium scale enterprises lack the capabilities required to develop and manufacture components as per the modern industry demands. Embedded software capability is estimated to be found in only 10% of domestic suppliers, whereas system integration, and product-development capabilities are around 14%.

The post India’s EV Component Industry Faces Technology Capability Gap as Imports Rise appeared first on ELE Times.

There is growing demand from Indian electronics manufacturers for alternatives to expensive copper such as aluminium, and a more widespread adoption of other cheaper materials due to increased cost pressure and lower profit margins as copper prices rocket. Companies are also encouraged to boost domestic procurement and re-engineer product and component designs to reduce dependence on these raw materials.

Copper is widely used across the electronics industry because of its electrical conductivity, robustness, and reliability. Due to recent surge in copper prices has increased manufacturing costs, creating challenges for companies especially those already facing a competitive market that might not be able to fully pass the rising input costs to consumers.

A recent report stated that the copper price has risen by around 45%, thereby decreasing manufacturers’ profit. Because of this, some Indian electronics manufacturers are now considering aluminium as an alternative to copper in applications whether it’s electrical, mechanical, and thermal properties are highly required to meet product specifications. Aluminium is being considered as a substitute of copper because it is lighter and cheaper.

The product design needs modification when using aluminium as a substitute to achieve performance comparable to that of copper. Using aluminium as a substitute for copper is not easy to practically implemented across all electronics applications. It is important for manufacturers to consider properties like electrical conductivity, thermal performance, resistance to corrosion, joining techniques, and product lifespan before adopting alternate materials.

The post Indian Electronics Makers Turn to Aluminium as Rising Copper Costs Squeeze Margins appeared first on ELE Times.

Electronics will make up 50% to 55% of a car’s total manufacturing cost by 2030, growing significantly from 30% to 35% in 2020, creating a growth opportunity for Indian automotive component manufacturers in high-value electronic systems, according to a recent report by the Boston Consulting Group (BCG) and the Automotive Component Manufacturers Association of India (ACMA).

As per the report, increasing adoption of ADAS, infotainment, connected vehicle technologies, sensors, and ECUs in both ICE and EV vehicles are driving higher content of electronics.

However, India’s electrical and electronics segment was expected to be around 12% of domestic component supply in FY2025, highlighting significant scope for localization. Indian suppliers could capture a share of this emerging value pool, while also developing new capabilities in automotive electronics and other associated technologies.

Some technologies such as sensors, Electronic Control Units (ECUs), power electronics, connectivity systems, and Battery Management Systems (BMS) are gaining more consumer attraction as cars evolve into software-defined and highly connected products.

To capture this localisation opportunity, Indian component manufacturers need to move beyond traditional mechanical and manufacturing capabilities. They need to invest more in engineering, research and development, electronics design, software, testing, and technology development to compete in advanced technology that can be easily adopted by consumer mature automotive supply chains.

The post ​Automotive Electronics Could Account for 50–55% of Car Cost by 2030, Enhancing Localisation Opportunities appeared first on ELE Times.

The defence minister, Rajnath Singh, has authorized the transfer of technologies, including conventional missile systems developed by DRDO, to eligible Indian defence manufacturers to set up indigenous production. In this process, mature and proven missile technologies are being moved from development to industrial-level mass production. The manufacturers will need to have applicable technical qualifications, certification levels, and regulatory requirements in place.

The scope for wider participation in the missile production chain would occur to some extent also due to technology transfer, where state-owned manufacturers, private firms, MSMEs & specialized manufacturers could develop expertise and participate in components and sub-components, electronics, propellants, guidance systems and associated mechanisms, launch systems and integration with greater depth.

There is scope for increased industrial involvement, which could bring about a higher level of domestic production and value addition, thereby lowering defence imports reliance. Increased industrial involvement could enable DRDO labs to focus more on research in newer and advanced technologies, while existing and developed systems may be produced industrially. A drastic policy shift, as it marks a change in treating private Indian companies as long-term technology and production partners in defence manufacturing. Its success hinges on technological absorption capability, quality testing procedures, test facilities, and orders.

The post India Approves Industry Production of DRDO-Developed Missile Systems appeared first on ELE Times.

The Indian Navy commissioned INS NIPUN, the second ‘Nistar’ class Diving Support Vessel (DSV), at the Naval Dockyard. Mumbai on 31st August 2026. This is considered a great boon to our Navy’s underwater diving, underwater intervention, and submarine rescue capabilities. The first-ever indigenously developed and built vessel designed and built at Hindustan Shipyard Ltd. Visakhapatnam has sophisticated underwater-diving facilities for personnel, capable of submergence in adverse environments and pressures of the high seas. It can perform tasks such as inspection, maintenance, salvage, among others while it stays at sea, far away from shore for long periods.

It will provide increased capabilities in support of submarine-rescue operations- a vital skill that will protect crews and response personnel in submerged situations. Vessels like this are used to embark divers, remote systems and specialist rescue gear to operate as afloat platforms.

Induction of INS Nipun showcases the growing Indian capacity in indigenous design and manufacture of complex naval platforms, and it further bolsters the overall defence-shipbuilding industry in India through the contribution of Indian shipyards, equipment providers & supporting industries. She makes inroads into the Navy at a time when underwater surveillance, operation of submarines, and security of sea-based infrastructure are assuming prime importance.

The post Indian Navy Commissions Indigenous Diving Support Vessel INS Nipun appeared first on ELE Times.

Garden Reach Shipbuilders & Engineers has recently signed two international contracts to boost its digital shipbuilding and marine-engineering activities. Both contracts were signed on September 2, 2026, at SMM, the maritime trade fair that was held in Hamburg, Germany. The signing was completed when the Indian defence shipbuilder and the Norway-based classification and assurance organization DNV signed their first Memorandum of Understanding. The partnership is said to seek digital shipbuilding and development in areas of green technologies, training, and leading technical marine engineering.

GRSE further signed its second accord with the Netherlands-based Damen Technical Cooperation to provide technical and commercial cooperation for the design and construction of high-end dredges in India, reinforcing an existing relationship and boosting India’s capability to manufacture specific vessel types in the future. Digital shipbuilding encompasses the use of an interconnected design platform, data-centric engineering, and 3-D models for developing, constructing, and maintaining a vessel throughout its life cycle.

This process helps identify design challenges early in development and allows predicting maintenance needs on vessel parts. These joint ventures may facilitate GRSE in upgrading its shipyard, attaining foreign technology, and thereby increasing opportunities to participate in overseas tenders, along with augmenting India’s indigenous capabilities for construction of advanced warships and commercial ships.

The post GRSE Expands Digital Shipbuilding Through New International Partnerships appeared first on ELE Times.

The 16th edition of Aero India, the aerospace and defence manufacturing exhibition, is being organized by the Ministry of Defence from 8-12 February, 2027 at the Air Force Station Yelahanka in Bengaluru. Military officials, defence policy planners and policy formers, defence technology experts, as well as foreign investors are said to visit the show; the exhibition will aim to exhibit combat aircraft, helicopters, unmanned aerial systems, avionics, propulsion systems, electronic warfare and air defence technologies. The defence show of Aero India is managed by the Department of Defence Production. A flying display along with a technology exhibition will also be organized.

The event will also offer a platform for Indian defence manufacturing companies, start-ups, and MSMEs for forming manufacturing alliances and becoming an integral part of the global supply chains. The business meetings are anticipated to deliberate on technology transfer, co-development, co-production and defence exports. The announcement assumes significance at a time when India aims to give impetus to aerospace manufacturing indigenization and cut reliance on imports for its defence equipment needs. Aero India 2027 will hence not merely be an Air Show but a catalyst in enabling India’s Make in India, Make for the World defence manufacturing story.

The post Aero India 2027 Announced for February 8–12 in Bengaluru appeared first on ELE Times.

The 66th Annual Convention of The Society of Indian Automobile Manufacturers (SIAM) was recently held in New Delhi. Addressing the event, Indian PM Narendra Modi shared a special message at the convention. He stated, “India’s automobile industry is well placed to further expand its global presence as the country’s mobility ecosystem undergoes a fundamental transformation. Continued innovation, pursuit of excellence and a bold pathway towards Viksit Bharat will unlock transformative opportunities for the sector and accelerate the journey towards a faster, greener and self-reliant future.”

Chief Guest Nitin Gadkari, Hon’ble Union Minister of Road Transport & Highways, Government of India, mentioned, “With quality, innovation, research and competitive pricing, India has the potential to become the largest automobile industry in the world, with the sector playing a key role in Viksit Bharat. We should also encourage the expansion of driver training centres, vehicle fitness centres and vehicle scrapping centres, which can contribute to the economy as well.”

In a video message, Guest of Honour H. D. Kumaraswamy, Union Minister of Heavy Industries and Steel, Government of India, said, “The Indian automobile industry is strengthening its domestic capabilities and advancing vehicle technologies, creating a strong foundation to transform the local market into a global hub. The sector will continue to grow as a cleaner, more inclusive and globally competitive industry, contributing meaningfully to the Viksit Bharat 2047 goal.”

Sharing his views, Shailesh Chandra, President, SIAM and Managing Director & CEO, Tata Motors Passenger Vehicle Ltd. added, “The Indian Automobile Industry continues to play a defining role in shaping India’s Amrit Kaal, contributing significantly to realising the vision of a Viksit Bharat by 2047. Alongside this progress, India has made significant strides in aligning with global and national priorities of sustainability, decarbonisation, and safety.”

Addressing the automobile fraternity, Shenu Agarwal, Vice President, SIAM and Managing Director & CEO, Ashok Leyland Ltd., highlighted, “The Indian automobile industry has demonstrated remarkable resilience, and India can simultaneously become a large mobility market, a global manufacturing hub and a technology leader. But the next phase of this journey will require looking beyond growth alone, with sustainability and resilience going hand in hand.”

The SIAM Annual Convention session concluded with a shared commitment to building resilience in sustainable mobility, harnessing technology to strengthen global competitiveness and advancing India’s journey towards Viksit Bharat.

The post The 66th SIAM Annual Convention: PM Modi Wants Auto Industry to Augment ‘Viksit Bharat’ appeared first on ELE Times.

Vishay Intertechnology, Inc. today introduced a new series of thin film chip resistors in compact 0402 and 0603 case sizes. Built on an advanced aluminum nitride (AlN) substrate, the Vishay Sfernice CHEP series combines exceptional power handling and high frequency performance in standard surface-mount footprints, allowing designers to achieve higher power density without sacrificing RF performance or increasing board space.

The CHEP series sets a new benchmark for power handling in its class. While competing solutions are often rated below 1 W, the devices released today deliver standard power ratings of 1.2 W in the 0402 case size and 1.8 W in the 0603 case size. When mounted per datasheet guidelines, power ratings increase by 50 % to 1.8 W and 2.8 W, respectively, enabling higher power density in smaller footprints.

The resistors operate across a wide frequency range and are available with flip-chip or wraparound terminals. When mounted as flip-chip devices, resistors in the 0402 case size achieve frequencies to 50 GHz, while wraparound active face-up mounting supports operation to 20 GHz. Devices in the 0603 case size support frequencies up to 40 GHz.

Designed to minimize internal reactance, the CHEP series features LC values as low as 1 x 10⁻²⁴. The resulting low parasitics reduce phase shift, maintain consistent impedance, and minimize noise to improve RF performance, while standard 0402 and 0603 case sizes enable easy integration into widely accepted land patterns, simplifying design and layout.

The devices are ideal for telecom and connectivity applications, including LEO satellites, base station terminals, 5G and 6G networks, and RF infrastructure such as remote radio units (RRUs) and antennas. Additional applications include aerospace and defense systems such as drones, satellite payloads, guidance and telemetry systems, data links, and phased array radar systems.

The resistors offer a resistance range from 20 Ω to 120 Ω with tolerances down to ± 1 % and a temperature coefficient of ± 100 ppm/°C, with ± 50 ppm/°C available on request. RoHS-compliant, halogen-free, and Vishay Green, the devices operate over a temperature range from -55 °C to +155 °C.

The post Vishay Intertechnology’s Thin Film High Frequency Chip Resistors Deliver More Power in Less Space, Without Need for a Heatsink appeared first on ELE Times.

Infineon Technologies AG radiation-hardened HiRel power devices are aboard the Nancy Grace Roman Space Telescope, which lifted off from Kennedy Space Center in Florida, marking the successful launch of NASA’s next flagship space observatory. The Roman Space Telescope will travel to the second Sun-Earth Lagrange point (L2), more than 1.5 million kilometers from Earth, the same orbital position as the James Webb Space Telescope, where stable gravitational conditions and an unobstructed view of a wide swath of the sky will support the mission’s scientific program. The Roman Space Telescope mission adds to Infineon’s space heritage that stretches back to the 1970s, during which the company supported hundreds of space missions including navigation satellites, the International Space Station, and NASA’s Artemis program, with rad-hard components that have traveled more than 20 billion kilometers from Earth.

“The launch marks the beginning of what will be one of the most scientifically productive space observatory missions ever undertaken, and Infineon’s HiRel technology is part of that from day one,” said Mike Mills, Senior Vice President and General Manager HiRel at Infineon. “Roman will operate at L2 for up to a decade with no possibility of maintenance or servicing. At that distance, in that radiation environment, power technology has to work flawlessly from day one and keep working. Space programs require technologies and partners they can rely on for decades, and the selection of Infineon’s HiRel devices for the Roman mission reflects the qualification depth and mission heritage that the space industry demands from a strategic technology partner.”

Beyond Earth’s protective magnetic field, high-energy particles strike electronic components unimpeded and can permanently damage or destroy them, causing mission failure. Infineon’s radiation-hardened technology addresses these mechanisms not through passive shielding, but through a semiconductor architecture that is radiation-resistant by design.

Infineon’s HiRel portfolio integrated into the Roman Space Telescope includes rad-hard power semiconductor components. The devices are qualified to MIL-PRF standards with Total Ionizing Dose (TID) and Single Event Effects (SEE) characterization, providing the performance margins required for sustained operation at L2. Roman’s onboard systems will downlink approximately 1.4 terabytes of raw science data per day to ground stations in New Mexico, Australia, and Japan, representing the highest data volume of any NASA astrophysics mission to date. Reliable, continuous power delivery to the telescope’s instruments and data systems is a prerequisite for meeting this operational cadence across the full duration of the mission.

Infineon’s HiRel product range spans radiation-hardened silicon power MOSFETs, gallium nitride (GaN) transistors, gate drivers, solid-state relays and diodes, backed by in-house fabrication, robust radiation testing capabilities and guaranteed long-term product availability. Infineon’s JANS-qualified rad-hard 100 V GaN transistor, the first and only internally manufactured rad-hard GaN transistor on the market qualified per MIL-PRF-19500, represents the leading edge of this portfolio. GaN enables lower switching losses, higher power density, and higher switching frequencies, reducing power losses and magnetic component requirements and delivering measurable weight and volume savings at the system level, where every gram counts in space applications.

The post Infineon HiRel Power Semiconductors Support Successful Launch of NASA Nancy Grace Roman Space Telescope appeared first on ELE Times.

L&T Technology Services, a global leader in Engineering Intelligence Solutions & ER&D Consulting Services, announced the launch of LTTS FARM, a startup engagement platform designed to accelerate the commercialization journey of deep-tech startups through Engineering Intelligence-led collaboration, co-innovation and market access.

Built on the philosophy of “Collaboration First, Commercialization Next”, LTTS FARM is targeted at startups with TRL 4+ technologies that have validated their technical feasibility and are ready to explore industry adoption. The program is focused on startups aligned with LTTS’ Technology Big Bets – Software Defined Mobility (SDM), Plant Buildout & Modernization, Energy & Industrial Automation, Digital Manufacturing, Next Gen Compute & Data Centers, Software Platforms & EI and MedTech – with the potential to further advance these strategic priorities through new technologies and solutions. By leveraging LTTS’ global presence, domain expertise and customer relationships, LTTS FARM seeks to create a structured launch pad for startups to progress from validated innovation to customer adoption and long-term growth.

The initiative reflects LTTS’ commitment to fostering a thriving innovation ecosystem by bringing together startups, engineering talent and industry stakeholders to address real-world business and technology challenges. The journey will span across evaluation, onboarding, co-innovation, pilot development and commercialization opportunities for eligible startups. Suitable solutions will be considered for broader industry deployments aided by pilot projects, proof-of-concepts, customer demonstrations and diverse commercial engagements.

Amit Chadha, CEO & Managing Director, L&T Technology Services and Member of NASSCOM Executive Council, said, “Many promising technologies struggle because of limited access to customers, industry expertise and commercialization opportunities. Through LTTS FARM, we are creating a platform where startups can collaborate with our experts, gain exposure to global markets and customer requirements, validate real-world applications and accelerate their journey from solution readiness to market adoption. By nurturing innovations that align with and further our technology big bets, LTTS FARM will also expand our Engineering Intelligence ecosystem and help transform breakthrough ideas into industry-ready solutions that deliver measurable business impact”.

The post L&T Technology Services Launches LTTS FARM to Power Engineering Intelligence-led Deep-Tech Innovation from Lab to Market appeared first on ELE Times.

Rohde & Schwarz in collaboration with Qualcomm Technologies, Inc. has completed an early verification step for 3GPP Rel. 17 Search Space Set Group Switching (SSSG). This 5G NR feature, designed to reduce device power consumption, has now been formally submitted for RAN5 verification. This milestone supports the path from standardization to conformance testing and commercial use, while also feeding practical findings back into the standardization process.

Rohde & Schwarz has successfully verified for the first time a 3GPP NR conformance test case for Search Space Set Group Switching (SSSG). Introduced in 3GPP Release 17, SSSG is a power-saving mechanism for user equipment that improves how a device monitors control channel activity while maintaining reliable reception of scheduling information.

By completing verification of the 3GPP RAN5 NR conformance test case TS 38.523-1 TC 7.1.1.12.5 for SSSG at an early stage, the two companies supported early readiness of this feature across the 5G conformance ecosystem. The verification was carried out using a mobile test platform using Qualcomm X105 5G Modem-RF and the R&S TS-PCT protocol conformance test platform from Rohde & Schwarz, which is based on the CMX500 5G one-box signaling tester. SSSG optimizes the PDCCH monitoring behavior in 5G NR devices. This reduces unnecessary monitoring activity and helps improve power efficiency.

Rohde & Schwarz and Qualcomm Technologies are the first to complete all relevant test aspects for this conformance test case. During the verification work, the companies also identified areas where the underlying conformance specification could be improved and supported the submission of a change request to 3GPP RAN5, the group responsible for conformance test specifications. This links practical verification work with ongoing standardization development.

This combination of test execution and standards input shows how verification work can also improve the quality of future test specifications. For device manufacturers, the wireless chipset ecosystem and certification organizations, it marks a step toward reliable testing of advanced 5G power-saving functions.

The post Rohde & Schwarz has Achieved Initial Verification of 3GPP Rel. 17 Power-Saving Feature SSSG for 5G NR appeared first on ELE Times.

Vishay Intertechnology, today introduced two new low profile common mode chokes for high current automotive, energy, and industrial applications. Available in both surface-mount and through-hole packages, the Vishay Dale commercial ICMS2321 10 and Automotive Grade ICMS2321-1A combine a heat rating current to 30 A with a 1500 VDC dielectric withstand voltage between coils.

With their low profile, the devices released today offer a reduced size and volume, making them more resistant to shock and vibration, while their enhanced core design increases performance and saturation current at high temperatures up to +150 °C. Offering a self-shielded, rugged construction, the common mode chokes are ideal for DC/DC converters, high voltage inverters, EMI filters, and high current filters for noise suppression in motor control and other circuitry. The AEC-Q200 qualified ICMS2321-1A is well suited for use in automotive on-board chargers.

In addition to their surface-mount and through-hole mounting options, the ICMS2321-10 and ICMS2321-1A offer customizable inductance, impedance, DCR, and current ratings. Devices with surface-mount terminations are available in tape and reel packaging and are compatible with automated pick and place assembly for increased flexibility in board layouts. The common mode chokes are RoHS-compliant, halogen-free, and Vishay Green.

Device Specification Table:

(1) DC current (A) that will cause an approximate ΔT of 40 °C

(2) DC current (A) that will cause an approximate ΔT of 100 °C

The post Vishay Intertechnology Commercial and Automotive Grade Low Profile Common Mode Chokes Offer High Shock and Vibration Resistance appeared first on ELE Times.

In electronics manufacturing, material and quality testing using X-ray inspection is considered the gold standard for reliability and the highest standards. For years, GÖPEL electronic has been a leader in the field of inspection and non-destructive, comprehensive assembly testing at all levels. With a completely newly developed system platform, the manufacturer now presents next-generation X-ray inspection: The Multi Line AXI combines outstanding technological innovations with highly versatile application options and multifunctionality, while offering simple operation and rapid adaptability to inspection tasks. The result is an innovative AXI system that sets new standards in X-ray inspection—offering a secure investment and high performance.

Technically, the Multi Line AXI stands out as a state-of-the-art planar 3D-CT X-ray system, offering the highest possible resolution and razor-sharp cross-sectional images. Based on the company’s proprietary aspeCT technology, the system achieves new levels of precision and image quality in X-ray inspection. Using a high-resolution, high-speed flat-panel detector, the detailed images are transformed into intelligent 3D reconstructions and volumetric 3D images and models of the highest quality. An innovative 7-axis system with synchronized control ensures high-speed, on-the-fly CT imaging in the shortest possible time: In less than 2 seconds, and with 8 µm voxel resolution, the Multi Line AXI offers flexible 2D, 2.5D, and 3D X-ray imaging as needed, using microfocus X-ray tubes and in sub-micrometer increments. This makes the system a highly secure investment and versatile in its application, manufactured entirely in Jena.

In addition to its outstanding technology, the Multi Line AXI has been consistently designed for broad applicability, reliability, and low-maintenance operation. With an 810×535 mm inspection area, a maximum PCBA clearance of 105 mm, and a transport capacity of up to 25 kg in its flexible transport system, both the smallest PCBAs and large power electronics can be inspected quickly and with consistently high quality. Thanks to the use of parts from exclusively European suppliers and German-brand mechanical components, the system is extremely durable and reliable. The Multi Line AXI’s platform concept makes upgrades, expansions, and repairs quick and easy. Furthermore, the system can be integrated into any manufacturing or inspection environment—whether inline, at-line, or stand-alone. It interfaces seamlessly with the manufacturer’s MES and can be integrated into traceability systems. High repeatability, variable X-ray performance as needed, and adaptability to high mix, low-volume production are hallmarks of the Multi Line AXI.

However, a system’s performance and quality are only the foundation—in everyday use, an AXI system must be quickly adaptable to specific inspection tasks and easy to operate. The Multi Line AXI guarantees this through its seamless integration into the PILOT software platform’s user interface, which has also proven itself in GÖPEL AOI systems. Inspection programs are automatically generated using “Magic Click” based on Gerber and assembly data or other CAD formats (ODB++, Process, etc.). For reliable verification, the PASS/FAIL evaluation is supported by intelligent AI assistants. This transforms detailed X-ray images into actionable inspection results—ensuring the quality and security of the PCBA. Short programming times and comprehensive evaluation of results—including precise void calculation and THT fill rate measurement in percent—combined with GÖPEL electronic’s software and inspection intelligence make the Multi Line AXI practical and suitable for everyday use, intuitive to operate, and customizable.

In developing the new X-ray inspection system, GÖPEL electronic also addressed questions about the future: How do we want to manage our resources? As a result, the Multi Line AXI is designed as a “Lean & Green Machine” focused on resource conservation, energy efficiency, and sustainability. The manufacturer has deliberately omitted pneumatic components and compressed air, which not only simplifies installation and operation but also reduces maintenance and operating costs. With its lightweight design—weighing just 2.7 metric tons and featuring a compact footprint of 1600×1660—this X-ray system requires no special structural preparations and can be installed quickly and easily in virtually any environment. Based on GÖPEL electronic’s many years of experience, the system is designed from the outset to be durable, upgradeable, and reusable, with easy access for service and maintenance.

The post GÖPEL electronic Introduces the New Multi Line AXI 3D-CT X-Ray Inspection System appeared first on ELE Times.

Murata Manufacturing Co., Ltd., a global leader in electronic components and innovative electronic solutions, will participate in electronica India 2026, taking place from 16–18 September 2026 at the Bangalore International Exhibition Centre (BIEC), Bengaluru.

Located at Hall 3, Booth H3.E11, Murata will present its exhibition theme, ‘Scaling the Future from India with Murata,’ showcasing how its technologies are helping shape the next generation of intelligent, connected, and energy-efficient electronic systems. As India’s industries accelerates toward an AI-powered, electrified, and digitally connected future, Murata is helping enable the technologies that make it possible. Backed by global reliability, local commitment, and scalable innovation, Murata delivers advanced electronic components, sensing technologies, power solutions, RF technologies, and system innovations that support next-generation industrial systems.

At electronica India 2026, visitors will experience application-focused demonstrations, engage with Murata’s technical experts, and discover how the company’s technologies help accelerate innovation across rapidly evolving industries.

The electronics industry is entering a new era driven by artificial intelligence, semiconductor innovation, intelligent mobility, industrial automation, robotics, and digital infrastructure. As these technologies continue to converge, the need for highly reliable, energy-efficient, and integrated electronic solutions continues to grow.

At electronica India 2026, visitors will experience how Murata’s technologies address these evolving industry needs through interactive demonstrations and application-focused showcases.

Murata’s booth will feature five application zones highlighting technologies that enable future-ready electronic
systems across diverse industries:

• IC Zone – Accelerating Semiconductor Innovation from Device to System
  High performance AI computing requires increasingly integrated semiconductor systems. Explore how Murata’s components, reference design, and EMI expertise support power delivery, noise control, and reliable system design for advanced semiconductor applications.
• Data Center Zone – Powering AI Servers and Modern Data Center Infrastructure
  Data centers supporting AI and other high-performance computing workloads require efficient, reliable, and scalable power solutions. Discover Murata’s power technologies and electronic components for AI servers, networking, and modern data center infrastructure.
• Mobility Zone – Driving the Future of Connected and Electrified Mobility
  Enabling connected, electrified vehicles through advanced communication, sensing, and battery technologies. Explore Murata solutions for V2X (Vehicle to Everything), connectivity, positioning, and system reliability.
• Industrial Zone – Accelerating Smart Factory Transformation
  Manufacturers are adopting smarter, more connected operations. Explore Murata solutions for automation, machine monitoring, asset tracking, and operational efficiency.
• Humanoid Zone – Enabling Responsive Interaction and Synchronized Action
  Humanoid robots need accurate sensing, reliable connectivity, and coordinated control. Discover how Murata technologies support responsive interaction, synchronized movement, and dependable operation.

Complementing these featured showcases, visitors will also have the opportunity to explore additional product showcases and technology displays across each application zone, together with Murata’s broader product portfolio, demonstrating Murata’s expanding role in delivering comprehensive electronic solutions across diverse applications.

Murata combines decades of global technology leadership with an expanding local presence to support India’s rapidly evolving electronics ecosystem. By integrating global manufacturing standards with local engineering expertise and dedicated customer support, Murata continues to deliver the quality, reliability, and innovation trusted by customers worldwide.

As part of its long-term commitment to India, Murata continues to strengthen its local capabilities through its sales offices in Chennai, Delhi (Noida), and Bengaluru, together with its manufacturing facility in Chennai. This growing footprint enables closer customer collaboration, faster technical support, and stronger partnerships, reinforcing Murata’s commitment to supporting India’s ambition to become a global hub for electronics manufacturing and technological innovation.

Murata invites customers, partners, design engineers, and industry professionals to visit Hall 3, Booth H3.E11 at electronica India 2026 to experience application-focused demonstrations, engage with technical experts, and discover how ’Scaling the Future from India with Murata’ is enabling the next generation of electronics.

The post Murata to Showcase ’Scaling the Future from India with Murata’ at electronica India 2026 appeared first on ELE Times.

​The Indian Navy received its first indigenous multi-purpose vessel, Samarthak, from Larsen & Toubro at its Kattupalli shipbuilding yard. An indigenous content of 75% indigenous content, marking the next step in India’s initiative to build naval warships indigenously. It was built with features to fulfil various requirements, such as surveillance, maritime patrol, and participation in Humanitarian Assistance and Disaster Relief (HADR) activities. Furthermore, the vessel can successfully carry out launching and recovering of naval targets, use automated systems, and evaluate naval weapons, sensors, etc.

This inherent flexibility should provide the capability for the Navy to employ the ship in an operational role in addition to its testing and evaluation capacity. These vessels are critical because new underwater systems and other unmanned vehicles and new radars and weapons need to be rigorously tested in the natural sea environment before they are widely deployed into operations. The ship was built under a contract for two Multi-Purpose Vessels and demonstrates enhanced cooperation between the Indian Navy and private shipbuilding. Its induction proves the increasing capabilities of Indian companies in designing and building advanced, technically complex naval platforms​.

The post Indian Navy Takes Delivery of Indigenous Multi-Purpose Vessel Samarthak appeared first on ELE Times.