ELE Times

Cockpit Computers: 10 million units delivered

• High-performance solutions: Bosch and Qualcomm aim to make ADAS solutions for enhanced safety and comfort available to everyone
• Continued Business Momentum: Collaboration has secured significant new business wins for both next-generation ADAS and cockpit solutions
• Proven Global Success: Bosch delivers over 10 million cockpit computers powered by Snapdragon Cockpit Platforms
• Global Market Penetration: Deliveries span all vehicle segments from entry to premium, serving both regional and global automakers

Stuttgart, Germany / San Diego, USA – Bosch and Qualcomm Technologies, Inc. announced today that they are expanding their strategic partnership, which has focused on vehicle computers for cockpit solutions, to also include ADAS solutions. Together, Bosch and Qualcomm Technologies are helping address one of the industry’s most pressing needs – scaling intelligent vehicle technology to meet growing consumer demand for vehicles that are automated, connected, and highly personalized. The companies also highlighted a significant milestone in their longstanding collaboration: Bosch has developed and delivered more than 10 million vehicle computers based on Qualcomm Technologies’ Snapdragon Cockpit Platforms for the global automotive market.

“By combining leading-edge compute technology with our system integration expertise – hardware, software, and safety – we enable automakers to meet the rising demand for personalized, safe, and comfortable driving experiences,” said Christoph Hartung, Member of the Bosch Mobility business sector board, Chief Technology Officer for Systems, Software, and Services, and President of the division Cross-Domain Computing Solutions.

“The growing success of our collaboration with Qualcomm Technologies underlines a central value Bosch brings to the industry: we provide the robust, high-performance computing platforms that form the backbone of today’s software-defined vehicle“, said Christoph Hartung, Member of the Bosch Mobility business sector board, Chief Technology Officer for Systems, Software, and Services, and President of the division Cross-Domain Computing Solutions.

“Our collaboration with Bosch spans the full spectrum of vehicle compute – from high‑performance cockpit systems to scalable automated driving solutions and emerging centralized vehicle architectures – all powered by Snapdragon Digital Chassis automotive platforms,” said Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT, and Robotics, Qualcomm Technologies, Inc.

“ADAS is where performance and safety must scale in the real world. By expanding our work with Bosch into production-ready ADAS platforms, we’re helping automakers bring advanced driver assistance across vehicle lines more efficiently, with a clear path to centralized compute“, said Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT, and Robotics, Qualcomm Technologies, Inc.

Building on this momentum, the companies are extending their collaboration through new ADAS production programs. These programs leverage Bosch’s cost-optimized vehicle computer architecture, powered by Qualcomm Technologies’ Snapdragon Ride platform, to support practical and scalable ADAS deployments. The collaboration also includes purpose-built combined cockpit and ADAS platforms supporting mixed criticality applications delivered on a single system-on-chip, unique to Snapdragon Ride Flex SoCs, aligning with automakers’ software-defined vehicle strategic initiatives. At the core of these programs is the Bosch ADAS integration platform – a scalable, modular vehicle computer designed for ADAS functions. With high bandwidth, computing power, and memory management, it meets strict safety and security standards, fuses multiple sensor technologies for a precise 360° environment model, and runs complex algorithms to deliver safe, dynamic vehicle behavior—even at high speeds.

The Next Frontier: Jointly Engineering the Future of ADAS
Bosch and Qualcomm Technologies’ joint approach is delivering scalable, cost-optimized vehicle computers with ADAS solutions that have secured multiple global customer design wins in the East Asian market. These joint efforts provide automakers with critical flexibility and a clear migration path to centralized computing architectures featuring a small number of highly powerful vehicle computers instead of many individual control units. Powered by the scalable Snapdragon Ride Platform from Qualcomm Technologies, Bosch´s vehicle computers support a broad range of configurations – from entry-level ADAS, such as speed and distance regulation or lane keeping, to advanced automated driving systems. The first vehicles from these new business wins are expected on the road in 2028.

In addition, ADAS and cockpit solutions can also be consolidated onto a single platform to give automakers even greater flexibility and reduce architectural complexity. To this end, Bosch and Qualcomm Technologies are also working on solutions using existing products: Snapdragon Ride Flex builds on this foundation by enabling the consolidation of cockpit and ADAS functions onto a single, safety-certifiable SoC, reducing system complexity, power consumption, and cost while giving automakers a path toward centralized compute architectures. Bosch’s cockpit and ADAS integration platform combines the system functions for assisted and automated driving and infotainment, like personalized navigation and voice assistance functions, in one high-performance computer.

Both the ADAS and cross-domain computing solutions are designed to meet stringent safety requirements (up to ASIL-D) while reducing complexity and cost. For drivers, this means greater access to advanced Level 2 driving features like lane keeping, hands-free driving, and intelligent automated parking.

A story of successful collaboration: defining the modern digital cockpit
The collaboration between Bosch and Qualcomm Technologies is redefining the modern digital cockpit by serving the full spectrum of both the regional and global automotive market across North America, Asia, and Europe. This approach has driven exponential growth since first deliveries began in 2021, scaling from one million units in 2023 to ten million in less than three years, fueled by successful program awards with vehicle manufacturers worldwide. The delivery milestone underscores the companies’ shared ability to industrialize advanced automotive technologies at a global scale for the software-defined vehicle era, spanning entry-level to premium vehicles. The success is rooted in Bosch’s flexible and scalable approach, leveraging Snapdragon Cockpit Platforms. The Bosch cockpit integration platform can drive an increasing number of in-vehicle displays and camera inputs. Qualcomm Technologies’ Snapdragon Cockpit Platforms combine high-performance compute with power-efficient design to enable a wide range of vehicle experiences. That includes crisp, essential displays in cost-optimized systems up to premium systems featuring ultra-low-latency HMI responsiveness, multi-display configurations, immersive multimedia, AI-powered conversational voice assistance, and higher levels of personalization – while maintaining efficiency across vehicle segments.

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• Semiconductor Revenue to Grow 64% in 2026
• DRAM Prices to Increase by 125% in 2026 and Storage Crisis to Extend into 2027

STAMFORD, Conn., April 8, 2026 — Global semiconductor revenue is projected to exceed $1.3 trillion in 2026, exhibiting the highest growth in the last two decades, according to Gartner, Inc., a business and technology insights company.

“Amid high demand for AI processing, data center networking and power, and memory price inflation (memflation), the semiconductor industry is projected to achieve a third consecutive year of double-digit growth in 2026 – a milestone that underscores the sector’s pivotal role in the AI technology stack,” said Rajeev Rajput, Senior Principal Analyst at Gartner.

Gartner forecasts semiconductor revenue will grow 64% in 2026, with memory revenue expected to increase threefold amid memflation (see Table 1). Gartner analysts said that memflation is profound, but it is not perennial. Gartner estimates DRAM and NAND flash annual prices in 2026 will increase by 125% and 234%, respectively, and any meaningful pricing relief is not expected until late 2027.

 

Table 1. Semiconductor Revenue Forecast, Worldwide, 2025-2027 (Billions in U.S. Dollars)

	2025	2026	2027
Memory	216.3	633.3	748.1
Nonmemory	589.0	686.9	806.4
Total Market	805.3	1,320.2	1,554.5

Source: Gartner (April 2026)

AI Semiconductors Will Represent 30% of Total Semiconductor Revenue in 2026

AI semiconductors are expected to account for approximately 30% of total semiconductor revenue in 2026 and will remain the driving force behind the overall industry growth. Hyperscaler investment in AI infrastructure buildouts remains strong, with spending expected to increase by more than 50% in 2026, driving demand for AI accelerators, including GPUs and custom non‑GPU chips.

“Memflation will destroy, or at least delay, non-AI demand into 2028, to varying degrees depending on the application,” said Rajput. “Technology suppliers should prepare for higher prices during the first half of 2026, followed by persistent but moderating price increases throughout the rest of the year. CIOs and IT leaders should be cautious about signing supply agreements with unfavourable pricing terms that extend beyond 2027.”

Gartner clients can read more in Forecast: Semiconductors and Electronics, Worldwide, 2024-2030, 1Q26 and How Long Will AI Demand Sustain Memory Prices.

A complimentary webinar on 1Q26 Semiconductor Reset: Who Wins in a Constrained Market? will take place on April 22 at 11:00 AM ET and registrations are available here.

Gartner Is the World Authority on AI

Gartner is the indispensable partner to C-Level executives and technology providers as they implement AI strategies to achieve their mission-critical priorities. The independence and objectivity of Gartner insights provide clients with the confidence to make informed decisions and unlock the full potential of AI. Clients across the C-Level are using Gartner’s proprietary AskGartner AI tool to determine how to leverage AI in their business. With more than 2,500 business and technology experts, 6,000 written insights, as well as more than 1,000 AI use cases and case studies, Gartner is the world authority on AI. More information can be found here.

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• STM32C5 with Cortex®-M33 and 40 nm for enhanced speed and Flash density
• Increased performance with cost efficiency
• Comprehensive ecosystem to enhance end-device capabilities and accelerate time to market

 

India, April 9, 2026: STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a new generation of entry-level microcontrollers (MCUs) to boost the performance of billions of tiny smart devices throughout factories, homes, cities, and infrastructures while meeting extreme cost, size, and power limitations.

The new STM32C5 series is aimed at consumer and professional devices like smart thermostats, electronic door locks, industrial smart sensors, robotic actuators, wearable electronics, and computer peripherals.

“The new STM32C5 elevates the precision, speed, and reliability of competitively priced MCUs to realize the potential in these opportunities. It builds on two decades of STM32 heritage and is part of our ambition to deliver the broadest, most scalable and secure portfolio from entry-level devices to advanced MCUs that redefine the application reach of embedded systems,” said Patrick Aidoune, Group Vice President and General Purpose and Automotive Microcontrollers Division General Manager, STMicroelectronics.

Thanks to an improved design based on ST’s proprietary 40nm manufacturing process, the STM32C5 MCUs can run tasks noticeably faster than many entry-level chips used today. This gives products more room to include modern features such as improved sensing, smoother control, and enhanced user experiences—all while keeping dynamic power consumption low.

The STM32C5 MCUs integrate built-in protections that help safeguard products against tampering and cyber risks. These security features support safer connected devices, a growing priority across consumer and industrial markets.

Users of the new STM32C5 series can enjoy an upgraded STM32Cube environment, now with size-optimized, production-grade drivers to leverage the many hardware features. The modernized ecosystem also introduces enhanced code generation and development tools as well as extended production-ready software examples. Benefiting from continuous updates, the STM32Cube environment is all about helping developers code faster and more efficiently, while maximizing the end-product capabilities.

“At SIT, we work in safety-critical gas and HVAC environments where reliability is essential. For our new generation of Burner Integrated Control platform, choosing the STM32C5 was a natural decision as it provides strong and predictable real-time performance, enabling us to manage combustion, flame detection, and safety interlocks with accuracy, even within a compact footprint. We were able to reuse a large part of our validated firmware, speeding up development, simplifying certification, and the result is a robust and scalable control platform designed for long-term reliability and compliance,” explained Dennis Agnello, Electronics Business Line Director, Heating & Ventilation, SIT Group.

“The STM32C5 provides the performance and feature set enabling us to develop a cost-efficient next-generation AC charger for both public and private use, fully aligned with the latest security, encryption, and interface requirements for metering and EV charging solutions. Throughout the project, ST provided the flexibility and comprehensive ecosystem support we needed to reduce development time and solve key functional and cost challenges to bring our product faster to the market,” said Enrique Osorio, R&D Director, Circontrol (Grupo Circutor).

STM32C5 MCUs are entering production now, targeting packages from 3mm x 3mm UFQFPN20 to 20mm x 20mm LQFP144. STM32 Nucleo evaluation boards, and a display extension board from Riverdi with TouchGFX development software for building entry-level graphical user interfaces, are ready to assist development.

Prices start at $0.64 for orders of 10,000 units.

Technical information

The new STM32C5 MCUs leverage an innovative implementation of the advanced Arm® Cortex®-M33 embedded processor. While ARM’s core delivers advanced performance and efficiency, ST’s proprietary 40 nm manufacturing process is cost-efficient, supports higher clock speeds, and enables memory above 512Kbyte, where lower-density technologies are uncompetitive. STM32C5 MCUs feature on-chip Flash ranging from 128Kbytes, making Cortex-M33 performance accessible at an attractive price for entry-level applications that were previously limited to lower-performing Cortex-M0 and Cortex-M23 devices. Devices are available with up to 1Mbyte, providing generous code and data storage for product designers to create sophisticated new features.

Implementing the Arm Cortex-M33 core at the 40 nm node brings improved arithmetic performance to entry-level devices at a competitive cost and low power. This accelerates computations such as embedded digital filters in sensor signal conditioning, noise suppression, and debouncing. In addition, the power supply scheme, comprising a single low-dropout (LDO) regulator, permits extra user I/O pins. There is also direct memory access (DMA), which helps save power, sharpen system responses, and simplify software. Moreover, with two instances, each having at least four channels to permit two fetches in parallel, DMA on the STM32C5 is a valuable tool for developers to boost application performance.

The MCUs target SESIP3 and PSA Level 3 security certifications, with memory protection, tamper protection, cryptographic engines (symmetrical encryption with AES and hashing algorithm), and temporal isolation (HDP) to protect processes such as secure boot and firmware update. The STM32C59x and STM32C5A3 variants have additional security, including hardware unique key support (HUK), secure key storage, and hardware cryptographic accelerators for symmetric and asymmetric operations with protection against side-channel attacks.

Designed for demanding industrial environments, the device delivers robust performance even in harsh networking conditions. It supports a wide ambient temperature range from -40°C to 125°C, with a junction temperature up to 140°C. Even at the maximum operating temperature, the device can run at its maximum rated frequency, ensuring consistent performance across the full temperature range. STM32C5 enables compliance with industrial safety standards, including IEC 61508 SIL-2 and IEC 60335-1/60730-1 Class-B, by integrating essential hardware and software features.

Enhancements to the development ecosystem include a new STM32CubeMX flavor, STM32CubeMX2, which introduces a preview feature that allows faster access to reference code, thereby accelerating development and easing code reuse. Also new in the STM32CubeC5 embedded software offer, the latest code-size optimized hardware abstraction layer (HAL2) gives access to all MCU features and allows more of the MCU’s memory to be used for application code.

Alex Fabre, Embedded Software Expert at ST Authorized Partner RTONE, has experienced the new tools, commenting: “STM32 HAL2 makes developing with the STM32C5 and other family members faster and more efficient. It is much lighter, closer to hardware functions, and porting our code to other STM32 MCUs is extremely easy.”

The comprehensive ecosystem also gives developers:

• STM32C5 hardware evaluation tools enabling faster prototyping and offering reference hardware design guidelines
  • A new examples library offering faster access to a large number of STM32C5 production-ready code examples, simplifying the use of the STM32C5 features and accelerating development
  • A choice of two free integrated development environments (STM32CubeIDEand STM32CubeIDE for VSCODE) for faster development and debug
  • STM32Cube ecosystem with optimized porting of popular middleware including FreeRTOS, LwIP, USBX, and FileX

About STMicroelectronics

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com

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by Sukhendu Deb Roy, Industry Consultant

Key Takeaways

• The economics of warfare have flipped, with cost asymmetry emerging as a primary battlefield dynamic
• Directed energy systems shift defence from inventory-driven models to energy-driven ones
• Future defence architectures will be AI-orchestrated, integrated, and multi-domain
• Semiconductor capability is central to defence sovereignty

Introduction: The Shift in Modern Warfare

Modern warfare is undergoing a structural and economic shift—one that is redefining how conflicts are fought and sustained. Across theatres, adversaries are increasingly deploying low-cost, high-volume threats designed not just to penetrate defences, but to exhaust them. This is not merely a tactical evolution; it is an economic strategy aimed directly at the cost structure of defence systems rather than their technical limits.

In response, Directed Energy Weapons (DEW), particularly high-energy laser (HEL) systems, are emerging as a compelling alternative. By reducing the cost per engagement to near-zero and removing dependence on finite ammunition, they signal a transition toward energy-based warfare—where power availability replaces inventory as the primary constraint.

Operational systems today, typically in the 100–300 kW class, are already capable of countering drones, small boats, and select aerial threats. However, their performance remains constrained by power density, beam quality, and thermal dissipation limits.

Figure 1. Emerging multi-layered defence architectures integrating kinetic and directed energy systems through AI-driven command and control.

The Problem: Capability Without Control

This advantage, however, is not absolute. Real-world deployments continue to reveal persistent constraints—thermal limits, atmospheric attenuation, beam dwell time, and power scalability challenges. These are not isolated engineering challenges; they are systemic constraints.

More importantly, they reveal a deeper dependency: the effectiveness of directed energy systems is inseparable from the ecosystem that supports them. Performance is not defined solely by the platform, but by the electronics, semiconductors, and supply chains beneath it.

This creates a structural risk. A nation may deploy advanced directed energy systems, yet remain dependent on external control at the component and semiconductor level.

The future of defence, therefore, will not be determined by the deployment of advanced platforms alone, but by the ability to secure control over the enabling ecosystem that makes those platforms viable at scale.

Figure 2. Directed energy systems deliver visible capability, but remain dependent on underlying electronics and semiconductor ecosystems—creating hidden vulnerabilities in control.

The Economic War of Attrition

At the heart of this transformation lies a fundamental imbalance shaping modern conflict. Defenders are increasingly forced to deploy high-value interceptors against low-cost threats, creating an unsustainable economic equation. Systems such as surface-to-air missiles or kinetic interceptors become prohibitively expensive when faced with saturation attacks.

This imbalance is not incidental—it is being deliberately operationalized through drone swarm attacks and loitering munitions designed to overwhelm defences through sheer volume rather than technological sophistication. The objective is clear: to stretch defensive resources to their limits and exploit the cost asymmetry inherent in traditional systems.

Directed energy systems fundamentally alter this equation. By shifting from consumable munitions to energy-based engagement, they dramatically reduce marginal costs and enable sustained operation without the constraints of inventory—as long as sufficient power is available.

This represents more than a technological evolution. It is a financial reset in how defence is structured and sustained. This is the defining shift from inventory-based warfare to energy-based warfare.

Figure 3. Cost asymmetry in modern warfare—low-cost threats forcing disproportionately expensive kinetic responses, driving unsustainable defence economics.

Without such a transition, the long-term economics of defence operations risk becoming untenable in the face of increasingly scalable, low-cost threats.

The Illusion of Sovereignty

The visible success of a directed energy intercept can be compelling. It signals speed, precision, and technological sophistication—creating the impression of true strategic independence. But that impression can be deceptive.

Beneath every such system lies a tightly integrated ecosystem of power electronics, thermal systems, optical assemblies, RF components, and semiconductors. If these critical elements are externally sourced, control has not been achieved—it has merely shifted out of view. Dependence is not eliminated; it is reconfigured.

In practice, this dependence surfaces through export controls, defence supply chain choke points, firmware constraints, and restricted access to advanced semiconductor nodes. Under normal conditions, these limitations may remain hidden. Under geopolitical stress, they translate directly into operational risk.

Capability alone does not ensure sovereignty.

Control does.

Where Control Actually Resides

To understand where control truly resides, directed energy systems must be viewed not as standalone platforms, but as layered architectures.

At the surface lies the platform layer—the visible capability, including laser systems deployed on land, sea, or air platforms. Beneath this sits the system layer, where command-and-control frameworks, targeting systems, and sensor fusion enable coordinated operation.

Deeper still is the engineering layer, which determines real-world performance. This includes power electronics that stabilize output, thermal systems that govern endurance, and optical and beam control mechanisms that ensure precision.

At the foundation lies the control layer—the least visible, yet most decisive. This layer encompasses semiconductors, advanced materials, packaging, and the broader supply chain that sustains the system.

It is this lowest layer that anchors performance, scalability, and resilience. Any external dependence here propagates upward, constraining every layer above and limiting true autonomy.

Performance, scalability, and resilience are determined at the lowest layer. Any external dependence at the control layer propagates upward, constraining the entire system.

Sovereignty, in this context, is not a function of the platform—it is a function of control at the component and semiconductor level.

These constraints are not theoretical—they are engineered into the system itself.

Figure 4. Directed energy performance is constrained by tightly coupled power, thermal, and semiconductor systems—highlighting the central role of control-layer technologies such as GaN-based switching.

The Real Bottlenecks

The challenges facing directed energy systems are physical, not conceptual.

• Thermal constraints limit sustained firing duration
• Advanced power electronics define efficiency
• Atmospheric conditions degrade beam propagation
• Beam dwell time limits effectiveness against fast-moving targets
• AI-enabled defence systems must operate at machine speed

Figure 5. Directed energy constraints are interdependent—thermal, power, and control limitations must be solved as an integrated system, not in isolation.

These constraints do not exist in isolation—they reinforce and amplify one another. Addressing a single limitation, whether in thermal management or power delivery, does not translate into real operational capability on its own. What is required is coordinated industrial depth across multiple domains, from materials science and semiconductor design to power systems and real-time computation.

A directed energy system is only as effective as the ecosystem that sustains it.

From Weapons to Systems

Directed energy is no longer a standalone capability. It is steadily becoming part of integrated, AI-orchestrated defence architectures—often described as Cognitive Hybrid Defence—where multiple systems operate in coordination rather than isolation. In this emerging model, directed energy systems function alongside electronic warfare, cyber capabilities, and kinetic interceptors, all unified through real-time command-and-control frameworks.

Figure 6. Transition from standalone weapons to AI-orchestrated, multi-layer defence systems, where threats are dynamically assigned to the most efficient response layer.

This shift is already visible in operational programs such as the U.S. Navy’s HELIOS system and Israel’s Iron Beam, both of which demonstrate how layered, multi-domain defence is replacing single-point solutions. The objective is no longer limited to individual interception—it is about orchestrating responses across domains with speed, precision, and economic efficiency. As this transition accelerates, control over the underlying technological ecosystem becomes even more critical.

Semiconductor Policy is Defense Policy

This convergence carries direct implications for national strategy. Defence capability and semiconductor capability can no longer be treated as separate domains—they are structurally interdependent. Initiatives such as India’s Electronics Component Manufacturing Scheme (ECMS) and the India Semiconductor Mission (ISM 2.0) must be viewed through this lens. These initiatives are central to building semiconductor sovereignty and securing India’s position in the global defence technology supply chain. They are not merely industrial policies; they are foundational to future defence capability.

Yet the challenge is not one of intent or conceptual understanding. It lies in industrial depth—particularly in manufacturing, materials ecosystems, and advanced semiconductor fabrication. Without control over critical technologies such as Gallium Nitride (GaN)-based power electronics systems, advanced packaging, and high-reliability electronics, there is a real risk of remaining a system integrator rather than a true control holder. Sovereignty, in this context, is not achieved through system assembly but through ownership of the components and technologies that define performance and resilience.

Figure 7. Defence capability is fundamentally anchored in semiconductor ecosystems—spanning materials, manufacturing, and advanced power electronics such as GaN-based systems.

Conclusion: Capability vs Control

What emerges is a broader shift in how warfare itself is understood. We are moving into a phase defined by energy, integration, and system-level thinking. Directed energy systems will become increasingly visible on the battlefield, delivering immediate and measurable impact. However, the true determinants of success will remain largely invisible—embedded in defence supply chains, semiconductor ecosystems, and industrial capability.

This creates a clear strategic imperative. Nations must move beyond assembling advanced platforms to controlling them end-to-end.

Forward Outlook

Looking ahead, the defining question of the next decade will not be who deploys directed energy systems first, but who can sustain and scale them under real-world conditions. Future conflicts may become power-limited rather than ammunition-limited, where grid resilience, energy density, and power electronics infrastructure and power distribution emerge as core defence parameters.

Meeting this challenge will require closer alignment between defence procurement and semiconductor strategy, sustained investment in power electronics, thermal systems, and advanced materials, and a decisive shift from platform-centric thinking to ecosystem-centric design.

Countries that recognize this transition early will build not just capability, but resilience. Those that do not will remain dependent—regardless of how advanced their visible systems may appear.

Figure 8. Future defence systems will be constrained by power, energy infrastructure, and semiconductor capability—marking the shift from ammunition-limited to energy-limited warfare.

Final Perspective

In the next generation of warfare, capability will be visible. Control will be decisive.

 

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Serial communication remains the backbone of electronic communication in the automotive sector. The cost-effective LIN bus with master-slave architecture and the fast multi-host fieldbus CAN-FD (Controller Area Network) have become established in this field. The great advantage and efficiency of the applications lies in the combination of both bus systems. GÖPEL electronic has now introduced an extension for the SCANFLEX Multi Port Bus I/O Module 9305 for these interfaces, which makes the functional diversity of the SCANFLEX system available for automotive interfaces in production testing.

With the new BAC module for CAN-FD/LIN, these interfaces can now be tested for functionality during production. The Bus Access Cable (BAC) is connected to one of the five slots of the SCANFLEX Multi Port Bus I/O Module 9305 and thus connected to the SCANFLEX system. This enables access to the complex test functions of the SCANFLEX boundary scan controller. The controller then takes over the simultaneous generation and dynamic distribution of the vectors and control sequences to the interfaces.

SCANFLEX is a modular JTAG/boundary scan controller. Based on state-of-the-art multi-core processors and FPGAs, it allows users to execute test and programming technologies from Embedded JTAG Solutions. Its multifunctional architecture enables these technologies to be combined flexibly and with high performance on a single platform. SCANFLEX II has eight independent, truly parallel test access ports (TAP) for up to 100MHz. This enables the synchronized execution of embedded test, debug, and programming operations via boundary scan (IEEE1149.x), processor emulation, chip integrated instruments, or the embedded diagnostics method.

About GÖPEL electronic
GÖPEL electronic develops and manufactures innovative electrical and optical test, measurement, and inspection equipment for electronic components and printed circuit board assemblies as well as industrial and automotive electronics systems. The company is active worldwide, with its own subsidiaries as well as through distributors, and generated sales of approximately 40 million euros in 2023 with 240 employees.

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In a move that cements India’s transition from a consumer to a producer in the global silicon race, Prime Minister Narendra Modi officially inaugurated the Kaynes Semicon OSAT (Outsourced Semiconductor Assembly and Test) facility on March 31, 2026.

The ₹3,300 crore plant, located in the industrial heart of Sanand, marks the second major semiconductor unit to go operational in Gujarat within 900 days, following the earlier launch of the Micron facility. This rapid execution underscores the momentum of the India Semiconductor Mission (ISM) 2.0, as the country aggressively pursues a slice of the $110 billion global chip market.

A Global Export Hub

While domestic self-reliance is a key driver, the Kaynes plant is looking outward. During the ceremony, the first batch of Intelligent Power Modules (IPMs), sophisticated components that integrate 17 individual chips, was presented to Stephen Chang, CEO of Alpha & Omega Semiconductor, a California-based anchor customer.

“Today, a new bridge has been formed between Sanand and Silicon Valley,” the Prime Minister stated during his address. “The modules made here will reach American companies and, from there, power the world.”

Key Specifications of the Sanand Plant

The facility is designed for high-volume, high-precision manufacturing, focusing on sectors that are currently seeing explosive growth:

Feature	Details
Investment	₹3,300 Crore
Production Capacity	Approx. 6.3 Million chips per day
Primary Products	Intelligent Power Modules (IPMs), Multi-chip modules
Target Industries	Electric Vehicles (EVs), Industrial Automation, 5G Infrastructure
Timeline	From Cabinet approval to production in 14 months

The “Techade” Vision

The inauguration is more than just a corporate milestone; it is a strategic piece of the “India Techade” vision. Unlike traditional manufacturing, the Kaynes plant focuses on the back-end of the semiconductor value chain, like assembly, testing, and packaging, which has historically been a bottleneck for Indian electronics.

Union IT Minister Ashwini Vaishnaw highlighted the speed of the project, noting that the plant moved from foundation-laying to commercial production in record time. He also pointed to the growing “Sanand-Dholera” cluster, which is being modelled after global hubs like Hsinchu in Taiwan and Gyeonggi in South Korea.

Building the Talent Pipeline

To sustain this growth, Kaynes Semicon announced a memorandum of understanding with SVNIT Surat to develop a specialised workforce. This partnership aims to bridge the gap between academic theory and the rigorous standards of semiconductor cleanrooms, ensuring a steady stream of engineers for the 10 major chip projects currently approved across six Indian states.

As the ribbon was cut in Sanand, the message to the global tech community was clear: India is no longer just waiting for the future of hardware; it is assembling it.

The facility has already reported early execution success, having shipped approximately 900 multi-chip modules (IPM5) just days before the formal inauguration, signalling high operational readiness for its export commitments.

By: Shreya Bansal, Sub-Editor

The post Why Every EV & 5G Phone Could Soon Be Powered by Gujarat appeared first on ELE Times.

Alligator Automations India Pvt. Ltd., a manufacturer of end-of-line packaging automation systems, has reduced engineering effort in electrical design by around 50% by implementing WSCAD’s E-CAD solution.

The company’s ten-person electrical engineering team now uses WSCAD for creating electrical schematics, control cabinet design, and project documentation. Previously, tasks such as wire numbering, device grouping, and bill-of-materials generation had to be performed manually, resulting in project delays and an increased risk of errors. After switching to WSCAD, many of these steps are now automated, significantly improving both efficiency and design accuracy.

“Tasks that previously required manual work are now automated,” says Sagar Bhavsar, Control Engineering Manager at Alligator Automations. “Wire numbering alone now takes roughly half the time, allowing our team to focus more on complex design and optimisation tasks.”

Alligator Automations develops customised automation solutions, including robotic palletising systems, packaging automation, automatic loading systems, and intralogistics conveyor technology. Projects cover the entire value chain – from design and development to manufacturing, installation, commissioning, and long-term support for customers in industries such as food & beverage, paint & cement, fertiliser & petrochemicals, as well as tyre and agro industries.

“Automation projects are becoming increasingly complex while engineering timelines continue to shrink,” says Dr Axel Zein, CEO of WSCAD. “At the same time, AI is fundamentally changing how electrical engineering is performed. By automating documentation, verification, and knowledge retrieval, engineers can focus more on system design and optimisation instead of repetitive tasks. The Alligator Automations example demonstrates how standardising the E-CAD environment can significantly increase engineering efficiency.”

Beyond schematic creation, WSCAD supports precise 2D and 3D control cabinet layouts, automatic wire routing, and direct data transfer to cabinet manufacturing systems. This eliminates media discontinuities and reduces sources of error. AI-supported design, documentation, and multilingual translation capabilities further accelerate project delivery while ensuring compliance and data quality.

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Vishay Intertechnology has introduced a new Automotive Grade photovoltaic MOSFET driver that is the first such device in the compact SMD-4 package to provide a creepage distance of 8 mm and mould compound with a comparative tracking index (CTI) of 600. Designed to increase safety and reliability in high voltage automotive applications — while simplifying designs and reducing costs — the Vishay Semiconductors VODA1275 features the industry’s fastest turn-on times and the highest open circuit voltage and short circuit current in its class.

Classified as providing reinforced isolation, the device delivers an open circuit voltage of 20 V typical, short circuit current of 20 μA, and turn-on time of 80 μs, which is three times faster than competing devices. These characteristics enable quicker and more reliable driving of MOSFETs and IGBTs in high-voltage systems. In addition, the device’s working isolation voltage of 1260 Vpeak and isolation test voltage of 5300 VRMS make it ideal for 800 V+ battery systems.

AEC-Q102 qualified, the VODA1275 is intended for use in pre-charge circuits, wall chargers, and battery management systems (BMS) for electric (EV) and hybrid electric (HEV) vehicles. While designers previously had to use two MOSFET drivers in series to generate the higher voltages required in these applications, the device’s high open-circuit output voltage allows them to use just one, saving space and lowering costs. In addition, the driver enables the creation of custom solid-state relays to replace legacy electromechanical relays in next-generation vehicles.

The optically isolated VODA1275 draws all the current required to drive its internal circuitry from an infrared emitter on the low-voltage side of the isolation barrier. This construction simplifies designs and lowers costs by eliminating the need for an external power supply. The MOSFET driver is RoHS-compliant, halogen-free, and Vishay Green.

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ROHM has added the new CMOS Operational Amplifier (op amp) series “TLRx728” and “BD728x” to its lineup. These are suitable for a wide range of applications, including automotive, industrial, and consumer systems. A broad lineup also makes product selection easier.

In recent years, demand for high-accuracy op amps has been rapidly increasing as automotive and industrial systems become more sophisticated, demanding faster speed, better precision, and higher efficiency. In applications requiring amplification of sensor outputs, minimising signal error and delay is essential. To meet these requirements, a well-balanced set of key characteristics is needed, including Input Offset Voltage, Noise, and Slew Rate.

These new products are high-performance op amps that offer a low input offset voltage, low noise, and high slew rate. TLRx728 features an input offset voltage of 150 μV (typ.), while the BD728x offers 1.6 mV (typ.).  Both series have a noise voltage density of 12 nV/√Hz at 1kHz and a slew rate of 10 V/μs. They are therefore suitable for a wide range of precision applications, including sensor signal processing, current detection circuits, motor driver control, and power supply monitoring systems. Both series are designed to balance versatility and high performance rather than being limited to specific applications.

Application Examples

Automotive equipment, industrial equipment, and consumer electronics.

Example use case: Sensor signal processing, current detection circuits, motor driver control, and power supply monitoring systems.

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In a major move to solidify India’s standing as a global high-tech hardware hub, the Union Government has announced a strategic investment of ₹257.77 crore (approximately $31 million) into 128 technology startups.

The announcement, shared by Minister of State for Electronics and IT, Jitin Prasada, in a written reply to the Rajya Sabha on Friday, March 27, 2026, highlights a shift toward “risk capital” for sectors critical to national security and economic self-reliance.

The “Fund of Funds” Mechanism

The investment was executed through the Electronics Development Fund (EDF), which operates under a “Fund of Funds” model. Instead of direct equity, the EDF acts as an anchor investor in eight professionally managed “Daughter Funds” (early-stage venture and angel funds).

These Daughter Funds have leveraged the government’s initial contribution to mobilise a total of ₹1,335.77 crore in follow-on investments for startups specialising in:

• Semiconductor Design & Nano-electronics

• Cybersecurity & AI/ML

• Robotics & IoT

• Medical Electronics (HealthTech)

Impact by the Numbers

As of late February 2026, the ripple effect of this capital injection has already yielded significant socio-economic returns:

• Job Creation: Over 22,700 high-skilled jobs have been generated within the supported startups.

• Intellectual Property: The companies have successfully filed or acquired more than 300 IPs, reinforcing India’s domestic design capabilities.

• Profitable Exits: The government has already realised ₹173.88 crore from 37 successful exits, proving that DeepTech ventures are becoming increasingly viable for investors.

Geographic Distribution: Bangalore Leads the Charge

While the government aims for pan-India growth, the current investment data shows a strong concentration in existing tech corridors. Bangalore remains the undisputed leader, housing 88 of the 128 funded startups.

A Strategic Pivot Toward Self-Reliance

This news comes on the heels of the Ministry of Electronics and IT (MeitY) approving 29 additional projects under the Electronics Component Manufacturing Scheme, involving a cumulative investment of ₹7,104 crore.

By focusing on the “Daughter Fund” model, the government ensures that capital is managed by industry experts while maintaining a minority stake—a move designed to encourage private venture capital to take more “brave” bets on hardware and indigenous R&D rather than just consumer-facing software apps.

“The goal is to build a self-sustaining electronics ecosystem,” stated the Ministry. “We aren’t just looking for the next ‘unicorn’; we are looking for the next breakthrough in Indian-owned IP.”

By: Shreya Bansal, Sub-Editor

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As the global transition toward industrial automation and smart living accelerates, the security and processing efficiency of microcontrollers (MCUs) have become decisive factors for enterprises’ success in the business-to-business market. Nuvoton Technology has announced the launch of its new NuMicro M3331 series 32-bit microcontroller. Powered by the Arm Cortex-M33 core, the M3331 series delivers exceptional performance at operating frequencies of up to 180 MHz and integrates TrustZone technology, providing a robust hardware foundation for industrial control, smart factories, smart buildings, and renewable energy.

The M3331 series is more than just a hardware platform; it is an integrated solution designed to address the challenges customers face when processing complex control algorithms and protecting intellectual property (IP). Featuring the Cortex-M33 core with built-in DSP instruction set and a single-precision floating point unit (FPU), it runs up to 180 MHz. The M3331 series is built with comprehensive security mechanisms. Through hardware-level Secure Boot, it ensures that the system executes only certified and authorised firmware from startup, establishing an immutable root of trust. To protect core IP assets, it features eXecute-Only-Memory (XOM) to safeguard core algorithms and eliminate the risk of code leakage. Additionally, the TrustZone technology partitions a secure execution environment to effectively defend against malicious attacks.

Designed for reliability, the M3331 series supports a wide operating temperature range from -40°C to +105°C and exhibits superior interference resistance (ESD HBM 4 kV / EFT 4.4 kV), significantly reducing the risk of downtime caused by environmental factors. To further enhance system reliability, the 512 KB Flash memory supports Error Correction Code (ECC) for detecting and repairing bit-flip errors. Furthermore, within the 320 KB SRAM, a hardware parity check is provided for the 64 KB core area, achieving true industrial-grade system resilience.

To meet the diverse communication demands of the IoT era, the M3331 series introduces an I3C interface and two CAN FD controllers, greatly increasing data throughput between sensors and control nodes. For high-speed peripherals and mass storage, it includes a built-in USB 2.0 High-Speed OTG controller (with on-chip PHY) and an SDH (Secure Digital Host Controller) interface, delivering exceptional performance for both gaming products requiring low-latency transmission and smart consumer devices needing high-bandwidth storage.

Moreover, the M3331 series features a 12-bit ADC with a sampling rate of up to 4.2 Msps, accurately capturing subtle changes in analogue signals. With up to 48 PWM outputs, it provides precise control solutions for professional photography lighting and stage lighting. Specifically, the series is equipped with ELLSI (Enhanced LED Light Strip Interface) and up to 10 LLSI (LED Light Strip Interface) interfaces, supporting next-generation gaming ARGB LED control protocols. This offloads the CPU and reduces development difficulty, enabling brilliant and fluid dynamic LED effects. The M3331 series offers a variety of package options, from the compact QFN 33 (4×4 mm) to the high-pin-count LQFP 128 (14×14 mm), helping customers optimise their PCB layouts.

To accelerate time-to-market, Nuvoton provides NuMaker-M3333KI and NuMaker-M3334KI evaluation boards, along with full support for mainstream RTOS (FreeRTOS, Zephyr, RT-Thread) and GUI libraries (emWin, LVGL). This ecosystem empowers customers to build stable system solutions rapidly.

The M3331 series consists of two subseries: the M3333 series (without USB 2.0 support) and the M3334 series (with USB 2.0 support).

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In a significant move to fortify India’s position as a global electronics hub, the Ministry of Electronics and IT (Meity) has approved 29 new applications under its flagship component manufacturing scheme.

The announcement, made on Monday by IT Secretary S. Krishnan, marks a substantial expansion of the nation’s industrial capacity. The newly sanctioned projects represent a cumulative investment of ₹7,104 crore, signalling robust private sector confidence in the government’s “Make in India” initiatives.

Economic Impact and Job Creation

The scale of the approved projects is expected to ripple through the domestic economy. According to Secretary Krishnan, the fresh wave of investment is projected to:

• Generate 14,246 new jobs directly within the electronics manufacturing segment.

• Yield a production value of ₹84,515 crore, significantly reducing reliance on imported sub-assemblies and parts.

Strengthening the Supply Chain

This latest round of approvals brings the total number of sanctioned projects under the Meity scheme to 75. By focusing specifically on components—the building blocks of smartphones, computers, and automotive electronics—the government aims to move beyond simple assembly and build a more resilient, end-to-end domestic ecosystem.

“The approval of these 29 applications underscores our commitment to deepening the electronics value chain in India,” a senior official noted, highlighting that the move is a strategic step toward the country’s goal of reaching a $300 billion electronics production target by 2026.

The scheme continues to be a cornerstone of India’s strategy to compete with regional manufacturing giants, providing the necessary fiscal support to offset the high costs of setting up sophisticated component units.

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STMicroelectronics has announced the expansion of its 800 VDC power conversion portfolio with two new advanced architectures: 800 VDC to 12V and 800 VDC to 6V. Developed according to the NVIDIA 800 VDC reference design, these new power conversion stages complement the previously introduced 800 VDC to 50V solution. The rapidly emerging 800 VDC data centre architecture enables higher energy efficiency, reduces power losses, and supports more scalable, high compute density infrastructure for hyperscalers and AI compute.

“As AI infrastructure compute scale continues to expand fast, it requires higher voltage distribution and greater density, which can only be achieved with system-level innovation for each of the different AI server form factors,” said Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office at STMicroelectronics. “With these new converters for 800 VDC power distribution, ST brings a complete set of solutions to support the deployment of gigawatt-scale compute infrastructure with more efficient, scalable, and sustainable power architectures.”

A complete 800 VDC ecosystem for the different AI server form factors

The expansion to 12V and 6V output stages reflects the industry move toward different server architectures requiring different power delivery topologies depending on GPU generation, server height, form factor, and thermal envelope for large-scale training clusters, inference farms, and high-density AI infrastructures. The 50V, 12V, and 6V intermediate DC buses will all coexist in AI data centres depending on rack density, GPU configuration, and cooling strategy.

The new 800 VDC to 12V converter enables high-efficiency distribution from rack-level power shelves directly to the voltage domains that feed advanced AI accelerators.

The new 800 VDC to 6V path allows OEMs to reduce the number of conversion stages and move the 6V bus closer to the GPU. This reduces copper usage, minimises resistive losses, and improves transient performance, a critical differentiator for large-scale training clusters.

Back in October 2025, STMicroelectronics introduced a fully integrated prototype power‑delivery system showcasing a compact GaN‑based LLC converter operating directly from 800 V at 1 MHz with over 98% efficiency and exceptional power density in a smartphone‑sized footprint exceeding 2,600 W/in³ at 50 V.

The three solutions combine ST technologies across power semiconductors (silicon, SiC, GaN), analogue and mixed-signal, and microcontrollers.

Technical highlights of the new 12V and 6V architectures

Direct 800 VDC to 12V high-efficiency conversion:

• Eliminates the traditional 54V intermediate stage, reducing conversion steps and system-level losses.
• Enables higher rack-level efficiency, lower copper usage, and simplified integration for future GPU generations.
• Includes a newly developed high-density power delivery board (PDB) achieving efficiency targets exceeding the sum of the previous two-stage conversion paths.

800 VDC to 6V architecture for GPU-nearing conversion:

• Is designed for system builders who require power stages closer to the GPU, minimising IR drop and improving response under fast load transients.
• Completes the topology portfolio for servers with ultra-dense GPU configurations.

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In a written reply, Minister of State for Commerce & Industry, Jitin Prasada, informed the Rajya Sabha that incentives worth Rs. 15,554 crores have been provided under the large-scale electronics manufacturing & IT hardware 2.0 schemes. Additionally, a sum of Rs. 2,377.56 crore has been disbursed under the automobiles & auto components sector.

Prasad further highlighted that the PLI schemes have attracted investments worth more than Rs. 2.16 lakh crore so far. Until now, the government has rolled out the PLI scheme for 14 sectors with the aim of strengthening domestic manufacturing and boosting exports.

Providing a sectoral breakdown of funding, the minister informed that Rs 6,022 crore has been disbursed for the pharmaceutical sector, Rs 1,859 crore for telecommunications, and Rs 2,163 crore for food products. Other allocations include Rs 55 crore for bulk drugs, Rs 157 crore for medical devices, Rs 281 crore for white goods, Rs 93 crore for drones, Rs 81 crore for IT hardware, Rs 55 crore for textiles, and Rs 132 crore for speciality steel.

No incentives have been disbursed so far for high-efficiency solar PV modules and advanced chemistry cell (ACC) battery schemes, he added.

Commenting on the dynamics of West Asia and the Gulf countries, the minister highlighted their importance as key markets for Indian agricultural exports. The region, including UAE, Saudi Arabia, Oman, Kuwait, Qatar, Bahrain, as well as Iran, Iraq and Yemen, accounted for exports worth USD 10.68 billion in 2024-25, nearly 20.5 per cent of India’s total agri exports.

These exports span a wide range of products, including cereals, animal products, fruits and vegetables, spices and processed foods sourced from across the country.

Prasada said the government is closely monitoring the evolving geopolitical situation in West Asia and its impact on trade, shipping routes and logistics. Exporters have reported challenges such as higher freight rates, war-risk surcharges, container shortages, shipment delays and port congestion.

By: Shreya Bansal, Sub-Editor

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Amid growing cybersecurity risks in the industry, 63SATS Cybertech has renewed its strategic title partnership with CyberSec India Expo 2026 for the second consecutive year, strengthening efforts to advance India’s rapidly evolving cybersecurity ecosystem.

The expo, scheduled for April 23–24, 2026, at the Bombay Exhibition Centre, Mumbai, will bring together CISOs, CIOs, CTOs, DPOs, policymakers, security leaders, enterprise decision-makers, and technology providers to examine emerging risks, regulatory developments, and advanced defence strategies shaping the digital economy.

As organisations navigate increasing exposure to sophisticated cyber threats and stricter compliance requirements, the platform is expected to facilitate focused discussions on securing critical infrastructure, digital public systems, and enterprise environments. It will also serve as a meeting ground for solution providers and end users to exchange practical insights and explore scalable security frameworks.

Through this renewed association, 63SATS will contribute its expertise across security operations, threat intelligence, and risk mitigation, while engaging with industry stakeholders on addressing current and emerging cybersecurity challenges.

Mr Taher Patrawala, Managing Director, Media Fusion, said, “As digital adoption accelerates across sectors, with India’s digital economy projected to reach $1 trillion by 2030 and over 900 million internet users driving unprecedented data exchange, cybersecurity is becoming central to sustaining trust and business continuity. Our continued engagement with 63SATS strengthens the platform’s ability to bring together expertise, real-world perspectives, and solution-driven discussions that are critical to navigating today’s increasingly complex threat landscape.”

Mr Neehar Pathare, Managing Director, CEO & CIO, 63SATS Cybertech added, “As India advances into a new era of digital governance with the rollout of the Digital Personal Data Protection framework, organisations are being held to significantly higher standards of accountability and compliance. In this environment, cybersecurity is no longer just a technical function but a critical pillar of risk management and business resilience. Our continued partnership with CyberSec India Expo reflects our commitment to driving industry-wide alignment with evolving regulatory mandates, while fostering meaningful conversations around building secure, compliant, and future-ready digital ecosystems.”

With increasing regulatory oversight, growing digital adoption, and heightened exposure to cyber risks, the partnership signals a broader industry shift toward integrated, ecosystem-led approaches to cybersecurity. CyberSec India Expo 2026 is positioned to serve as a critical convergence point for aligning strategy, technology, and policy in response to these challenges.

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Leading semiconductor manufacturer, Nuvoton, has partnered with pioneering cybersecurity business, Trustonic, to strengthen the capability of its advanced NuMicro® MA35 series MPU.

Established in 2008, Nuvoton was founded to bring innovative semiconductors to market and has since evolved into a leading name in the provision of microcontroller application integrated circuits (ICs), audio application ICs and cloud & computing ICs.

To strengthen the security of the solution, the Trusted Secure Island (TSI) of Nuvoton’s NuMicro MA35 series integrates Trustonic’s Trusted Execution Environment (TEE), Kinibi.

Having obtained the World’s first comprehensive EAL5+ certification in 2022, ‘Kinibi’ is now deployed to nearly 3 billion smart devices and 20 million vehicles globally, with zero safety violations. Its integration in the NuMicro MA35 series creates a secure environment that drives Protection, Detection, and Recovery for IoT products, including EV chargers.

Walter Tseng, Vice President of the Microcontroller Business Group at Nuvoton, explained: “Our partnership with Trustonic represents a significant milestone in Nuvoton’s commitment to providing industry-leading security for the industrial IoT market. By integrating the EAL5+ certified Kinibi TEE into our NuMicro MA35 series, we are providing our customers with a robust, hardware-backed security foundation. This collaboration ensures that critical industrial applications—from edge gateways to smart factory automation—are protected against evolving cyber threats through a dedicated ‘Protection, Detection, and Recovery’ framework, all while maintaining the high performance our users expect.”

Andrew Till, General Manager of Secure Platform for Trustonic, added: “Nuvoton’s MA35 platform is designed for high-performance edge applications, and security is critical to its success. Integrating Kinibi provides a proven Trusted Execution Environment that protects sensitive operations and enables manufacturers to build secure, scalable industrial IoT solutions with confidence.”

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STMicroelectronics and Leopard Imaging have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, 3D scene-mapping, and motion sensing with the NVIDIA Holoscan Sensor Bridge technology, the module integrates natively with NVIDIA Jetson and NVIDIA Isaac open robot development platform, simplifying and accelerating vision system design within the size, weight, and power constraints of humanoid robots.

“Humanoid robotics is moving beyond research projects and demonstrations to deliver powerful new machines for a wide range of roles in manufacturing and automotive factories, logistics and warehousing, as well as retail and customer service,” said Marco Angelici, Vice-President of Marketing and Application for Analogue Power MEMS and Sensors, at STMicroelectronics. “Our collaboration with Leopard Imaging brings market-leading ST sensors and actuators, seamlessly integrated into the NVIDIA robotics ecosystem, to accelerate the deployment of physical AI applications with human-like awareness.”

“Accessing ST sensors and actuators directly within the ecosystem has allowed us to standardise and streamline data acquisition and logging for humanoid robot vision across the HSB interface,” said Bill Pu, CEO of Leopard Imaging. “Robot builders can use our multi-sensing vision module with Isaac tools to accelerate learning and quickly bridge the ‘sim-to-real’ gap.”

Powered by the NVIDIA Holoscan Sensor Bridge, the new module integrates seamlessly with NVIDIA Jetson over Ethernet for real-time sensor data ingestion and NVIDIA Isaac open robot development platform, which offers open AI models, simulation frameworks and libraries for developers. The new module includes a build system and application programming interfaces (APIs), artificial intelligence (AI) algorithms curated for mobile robots, sample applications, domain randomisation, and a simulation environment containing sensor models.

ST continues to integrate its sensors, drivers, actuators, controllers, and development tools into the NVIDIA robotics ecosystem as a key NVIDIA robotics and edge AI partner, including high-fidelity models and proof-of-concept modules.

Technical information

The Leopard Imaging Systems vision module incorporates:

For vision-based sensing, the ST VB1940 automotive-grade RGB-IR 5.1-megapixel image sensor has combined rolling shutter and global shutter modes. ST has also released a mass market and industrial version V**943, part of the ST BrightSense product family, existing in monochrome or RGB-IR, in die or packaged sensor.

For motion sensing, the LSM6DSV16X 6-axis inertial measurement unit (IMU) embeds ST machine-learning core (MLC) for AI in the edge, sensor-fusion low-power (SFLP), and Qvar electrostatic sensing for user-interface detection.

For 3D depth sensing, the VL53L9CX dToF all-in-one LiDAR module, part of the ST FlightSense product family, provides 3D depth sensing with accurate ranging up to 9 meters. With its resolution of 54 x 42 zones (nearly 2,300 zones) combined with a wide 55°x42° FoV providing 1° angular resolution, short and long-distance measurements and small objects detection are achievable at up to 100 fps.

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At Auto EV TVS Summit, 2025, a panel of industry leaders—from semiconductor companies to automotive software firms—gathered to discuss one of the most transformative shifts underway in mobility: the rise of the Software-Defined Vehicles (SDVs). Moderated by Mohammed Saeed Mombasawala, CTO at Keysight Technologies, the discussion brought together voices from Bosch Global Software Technologies, Marelli India, NXP Semiconductors, Aumovio, and Auto Ascent to unpack how vehicles are evolving from mechanical machines into continuously upgradeable software platforms.

The consensus across the panel was clear: software is no longer an auxiliary component in the automotive stack—it is becoming the primary architecture around which the vehicle is built.

The Shift Toward “Intelligence on Wheels”

Software-defined vehicles represent a departure from the traditional automotive model, where functionality was fixed at the time of manufacturing. Instead, SDVs rely on software layers that can evolve through updates, new services, and data-driven improvements throughout a vehicle’s lifecycle. “SDV is essentially about delivering affordable intelligence on wheels,” explained Bosch’s Naved Narayan during the panel discussion.

The concept is already beginning to take shape in India. Features such as over-the-air updates, connected vehicle services, and Level-2 driver assistance systems are gradually entering the market. However, unlike Western markets where premium vehicles dominate adoption, India’s automotive ecosystem operates under a different constraint: cost sensitivity.

Industry participants emphasized that the success of SDVs in India will depend on achieving a delicate balance between technological sophistication and affordability.

India’s SDV Journey: Progress, But With Constraints

While the SDV revolution is global, India’s pathway has unique challenges. Panelists noted that the country is progressing toward connected and intelligent mobility, but several structural barriers remain.

Latha Chembrakalam, Founder and CEO of Auto Ascent, highlighted that the industry is driven by three key factors: safety, ease of use, and joy of driving. Software-defined architectures promise to enhance all three—but India must simultaneously contend with infrastructure gaps and regulatory limitations.

“India is a cost-sensitive market, and infrastructure readiness also plays a major role,” she noted. “While progress is visible, technological capabilities and regulatory frameworks still need to evolve to fully support SDV adoption.” Yet there are encouraging signs. Automakers such as Mahindra and MG have already begun introducing advanced connected features and driver assistance technologies in the Indian market, creating early momentum.

The New Architecture of the Vehicle

At the engineering level, SDVs are forcing a fundamental redesign of vehicle electronics. Traditional vehicles rely on dozens of electronic control units (ECUs), each responsible for a specific function. SDVs, however, are shifting toward centralized computing architectures, where domain controllers or zonal controllers manage multiple vehicle functions.

This transformation also introduces new challenges. Automotive companies must reconcile modern SDV architectures with legacy platforms and existing software stacks. “For new electric vehicle platforms, it is easier to design from scratch,” Chembrakalam explained. “But the real complexity lies in integrating SDV capabilities into existing vehicle platforms with legacy systems.”

In addition, the industry still lacks fully standardized architectures across OEMs, Tier-1 suppliers, and technology vendors. Without stronger coordination, experts warned, the ecosystem risks becoming fragmented.

Sensors, Connectivity, and the Edge Computing Challenge

Software-defined vehicles depend heavily on three technological pillars:

• Sensors
• Connectivity
• In-vehicle compute

Radar, cameras, LiDAR, and other sensing technologies collectively form the vehicle’s perception system. Rather than relying on a single sensor type, most companies now favor sensor fusion architectures that combine multiple sensing modalities. Rajkumar Anantharaman of NXP noted that radar remains one of the most critical sensing technologies due to its reliability across weather conditions. However, cameras provide complementary information, such as object classification and visual context.

“Radar alone cannot solve everything,” he said. “The industry is moving toward fusion architectures where radar and camera data are combined to improve environmental perception.” At the same time, sensing systems are also becoming increasingly intelligent. Modern radar chips now integrate edge processing capabilities, allowing them to detect and classify objects directly on the sensor rather than transmitting raw data to a central processor.

This shift toward edge AI processing helps reduce latency and bandwidth requirements.

Connectivity: Why Latency Matters

Connectivity plays another crucial role in the SDV ecosystem. While current vehicle platforms rely primarily on 4G networks, panelists believe 5G—and eventually 6G—will enable new levels of vehicle intelligence, particularly for vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2X) communication.

The reason is latency. Even a delay of a few hundred milliseconds can significantly affect vehicle safety systems. In collision scenarios, a 200-millisecond delay could translate into several meters of additional braking distance. Future networks promise to reduce latency to just a few milliseconds, enabling faster information exchange between vehicles and surrounding infrastructure.

However, experts cautioned that India’s current telecommunications infrastructure still needs to mature before such capabilities can be widely deployed.

AI, Data, and the Digital Twin Revolution

Perhaps the most complex dimension of SDVs lies in software development itself. Unlike traditional automotive software, SDV platforms require continuous integration, machine learning models, and large-scale data pipelines.

Training autonomous and driver-assistance systems requires massive datasets capturing real-world driving conditions. Yet India presents a unique challenge in this area: driving environments that are far less structured than those in Western markets. Unpredictable traffic behavior, unmarked roads, and unusual scenarios—from animals crossing highways to dense urban congestion—make it difficult to collect sufficient real-world training data.

To overcome this limitation, companies are increasingly relying on digital twins, simulation environments, and synthetic data generation. These virtual environments allow engineers to simulate thousands of driving scenarios before deploying software in actual vehicles. By shifting validation earlier in the development process—known as “shift-left engineering”—companies can test and refine software models without relying entirely on expensive physical vehicle testing.

Vehicles That Improve Over Time

One of the most intriguing aspects of SDVs is the possibility that vehicles may increase in value over time. Traditionally, a car’s capabilities remained fixed after leaving the factory. With SDVs, however, software updates can introduce entirely new features years after purchase.

Bosch’s Narayan described this shift as “an upgrade without actually upgrading the vehicle.” Through over-the-air updates, automakers can introduce new driver assistance features, improved algorithms, or additional digital services long after the vehicle has been sold.

At the same time, consumer expectations are rapidly evolving. According to Yogesh Davangere Adevappa, rising awareness of global technology trends—driven by social media and digital exposure—is pushing buyers to expect more intelligent and feature-rich vehicles. “People are increasingly aware of the technologies available worldwide,” he noted during the panel discussion. “That awareness is driving demand for vehicles with more connected features, safety systems, and intelligent capabilities.”

Why the Software-Defined Vehicle Matters

Ultimately, the SDV transformation is about more than just technology. It represents a fundamental redefinition of what a vehicle is. For consumers, the appeal lies in enhanced safety, convenience, and personalized driving experiences. For automakers, SDVs open the door to entirely new business models built around software services and continuous updates.

There is also growing demand for customization in vehicles. Vikram Bhatt, Aumovio, pointed out that SDV architectures allow drivers to configure vehicle behavior dynamically—whether enabling features like park-assist modes, obstacle detection systems, or personalized driving configurations. These runtime adjustments represent a fundamental shift from static vehicle functions to software-enabled experiences.

Yet despite this progress, panelists acknowledged that India is still at an early stage of SDV deployment compared to global markets.

As one panelist summarized during the discussion, the future of mobility may not just be electric or autonomous—it will be software-driven at its core.

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As miniaturisation and increasingly complex design architectures continue to define modern technology, nanotechnology is emerging as a frontier discipline shaping the trajectory of innovation—from medical and electronic devices to energy infrastructure and beyond. Simply stated, as the focus of electronics development shifts towards the engineering and application of materials at the atomic and molecular scale—typically between 1 and 100 nanometres—certain physical, chemical, and electrical limitations begin to surface. When conventional materials such as silicon and copper are miniaturised to the nanoscale, they often encounter issues such as increased resistance, heat generation, and reduced performance. To address these limitations, Graphene, an sp²-hybridized two-dimensional honeycomb lattice, has emerged as one of the most promising materials for next-generation electronic systems.

Amid rapid advances across the nanotechnology landscape, graphene is increasingly regarded as a flagship material in nanoscale engineering, attracting significant attention, particularly in electronics.

While Graphene continues to attract significant research interest due to its exceptional properties, the transition from laboratory-scale breakthroughs to commercially viable semiconductor technologies remains a complex challenge. Industry players such as Weebit Nano emphasise that beyond material performance, factors such as manufacturability, process compatibility, and scalability are equally critical. This creates a dynamic balance in nanoelectronics—between exploring high-potential emerging materials and developing solutions that can be seamlessly integrated into existing semiconductor fabrication ecosystems.

Owing to its exceptional electrical conductivity and extremely high electron mobility, graphene is being explored for a wide range of electronic components, including high-speed transistors, flexible circuits, and highly sensitive biosensors. The material is both electrically and thermally efficient, enabling electronic devices to operate with improved performance while generating less heat. These properties have positioned graphene as a promising complement—and in some cases a potential alternative—to conventional materials such as silicon in applications including touchscreens, sensors, and next-generation electronic interfaces.

When nanotechnology converges with electronics, the field is commonly referred to as Nanoelectronics. Nanoelectronic systems require extremely high switching speeds and efficient charge transport while minimizing heat buildup in densely packed circuits. In this context, Graphene offers exceptional carrier mobility—reaching approximately 100,000 cm²/V·s under ideal conditions—making it an attractive material for high-frequency electronic applications. Additionally, as electronic components become increasingly dense in nanoelectronic architectures, thermal management becomes a critical challenge. Graphene’s remarkably high thermal conductivity enables efficient heat dissipation, thereby helping maintain the reliability and performance of nanoscale electronic systems.

Let’s look into some applications of Graphene in nanoelectronics: 

Graphene Field-Effect Transistors (GFETs)

Graphene Field Effect Transistors are advanced, ultra-sensitive electronic components comprising a channel made of a single-atom-thick layer of graphene, enabling modulation of current by an electric field.   

Structure: A GFET typically consists of three things: Source, drain & a gate (top or back).

• Channel: The space between the Source & the Drain makes up a channel where a 2D Sheet of Graphene is placed. 
• Gate Control: The gate voltage modifies the electric field, changing the charge carrier density in the graphene channel.

How does it work? 

It operates by controlling the flow of electrical current through the Graphene channel. When a voltage is applied between the source and drain, charge carriers in the graphene layer begin to move, creating a current. The gate electrode, separated from the graphene by an insulating dielectric layer, is used to control this current. By applying a positive or negative voltage to the gate, an electric field is generated that changes the concentration of electrons or holes in the graphene channel. 

A positive gate voltage increases electron concentration, while a negative gate voltage increases hole concentration, thereby modulating the conductivity of the channel and controlling the amount of current that flows between the source and drain. Because graphene has extremely high carrier mobility, electrons can move through the channel very quickly, allowing GFETs to operate at very high frequencies, which makes them particularly promising for radio-frequency and high-speed electronic applications.

Applications 

GFETs are used in various fields due to their high performance: 

1. Biosensors & Chemical Sensors: For detecting DNA, proteins, and gases at low concentrations.
2. Flexible Electronics: For wearable sensors and devices.
3. Radio Frequency (RF) Electronics: Due to high-speed charge transport. 

Nano-Electro- Mechanical Systems (NEMS)

Nano-Electro -Mechanical Systems are highly miniaturized devices that integrate electrical and mechanical functionality at the nanoscale, enabling the development of devices that are smaller, more sensitive, and more efficient as compared to the traditional silicon-based ones. 

Structure: The structure of a Graphene-based Nanoelectromechanical System (graphene NEMS) generally consists of a few key components integrated on a microfabricated substrate. It Includes: 

• Silicon Base: At the base is a Silicon or silicon-oxide substrate in which a small cavity or trench is created. 

• Electrodes: Metal source and drain electrodes are patterned on the surface to provide electrical contacts. A thin insulating layer may also be included to isolate different parts of the device. 

• Graphene Sheet: The central element is a suspended sheet of Graphene, which spans the cavity and connects the electrodes, forming a bridge-like membrane. 

• Gate Electrode: In some designs, a gate electrode is positioned beneath the graphene, separated by a dielectric layer.

How does it work? 

A Nanoelectromechanical System (NEMS) functions by converting mechanical motion at the nanoscale into electrical signals, or vice versa. These devices integrate mechanical structures—such as beams, membranes, or resonators—with electronic components on a very small scale.

When voltage is applied between electrodes (such as source, drain, or gate), electrostatic forces drive the mechanical motion of the nanoscale structure, and with this, the mechanical component begins to deflect, vibrate, or resonate. This mechanical movement changes certain electrical properties of the system—such as resistance, capacitance, or current flow—which can then be detected and measured by the electronic circuitry. As a result, NEMS devices operate as ultra-sensitive sensors, resonators, or switches, capable of detecting extremely small physical changes at the nanoscale.

Applications: 

NEMS are used in various applications, including: 

• Ultra-Sensitive Sensors: NEMS devices, such as AFM tips, detect forces, vibrations, and chemical signals at the atomic level. They are used as highly sensitive accelerometers for inertial navigation and motion detection.

• Bio-nanotechnology & Medical: NEMS enables lab-on-a-chip devices for diagnostics, biomolecule detection, and precise, targeted drug delivery systems. 
• Nano-switches and Relays: NEMS switches serve as mechanical, low-power alternatives to traditional semiconductor logic switches, offering near-zero leakage current.

Conclusion

As the electronics industry continues to push the boundaries of miniaturisation and performance, materials engineered at the nanoscale will play an increasingly central role in shaping the next phase of technological evolution. Among these, Graphene stands out for its exceptional electrical, thermal, and mechanical properties, offering solutions to several limitations faced by conventional semiconductor materials.

However, the path from material innovation to large-scale deployment remains complex. While graphene continues to demonstrate immense potential in nanoelectronic applications—from high-frequency transistors to ultra-sensitive nanoscale systems—its integration into mainstream semiconductor manufacturing is still an evolving challenge. In contrast, industry players such as Weebit Nano are focusing on developing technologies that align closely with existing fabrication ecosystems, underscoring the importance of manufacturability alongside performance.

As nanotechnology matures, the future of electronics will likely be shaped by a careful balance between breakthrough materials and practical implementation—where innovation is not only defined by what is possible at the nanoscale, but also by what can be reliably produced at scale.

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FormFactor and Rohde & Schwarz have announced a strategic co-marketing partnership as part of FormFactor’s MeasureOne partner program, a solution-integration initiative designed to deliver validated, turnkey on-wafer test systems. The collaboration combines advanced probing technology from FormFactor with industry-leading RF test instrumentation from Rohde & Schwarz, providing manufacturers with comprehensive solutions spanning early design verification through production. With RF device complexity and operating frequencies continuing to increase, this expanded collaboration formalises a tightly integrated on‑wafer test solution designed to lower integration effort and risk, reduce overall cost, and accelerate time-to-market for customers across development and production.

Reduced costs and faster time-to-market

On-wafer device characterisation of RF components such as 5G frontends or filters enables design validation during development, as well as product qualification and verification in production. Identifying faulty devices before packaging can significantly help reduce costs and improve yield. Through their integrated solutions, Rohde & Schwarz and FormFactor help manufacturers detect issues early in the process, which can result in faster time-to-market.

Seamlessly integrated test solutions

Rohde & Schwarz and FormFactor have been working together for several years to deliver powerful, seamlessly integrated solutions. Rohde & Schwarz provides instruments like the R&S ZNA, a versatile high-end VNA capable of measuring all key RF parameters, which can easily be combined with frequency converters extending frequencies up to the THz range. FormFactor complements this with a comprehensive portfolio of manual, semi-automated, and fully automated probe systems, including advanced thermal control, high-frequency probes, precision probe positioners, and robust calibration tools.

This combined approach allows manufacturers to validate product performance directly during wafer runs, leveraging the expertise of both companies. The tight integration of hardware and software components from both companies is designed to enable fast and reliable testing. The complete solution includes advanced instruments, reliable wafer and die fixuring, and high-precision probe positioning throughout the entire test cycle, strengthening confidence in product quality and performance.

Jens Klattenhoff, SVP and GM of the Systems Business Unit at FormFactor, said: “By expanding our collaboration with Rohde & Schwarz through the MeasureOne program, we are delivering integrated on‑wafer RF test solutions designed to help customers reduce risk, improve efficiency, and accelerate development. This partnership brings together advanced wafer probing and proven RF measurement technologies to address the growing complexity of next‑generation semiconductor devices.”

Michael Fischlein, Vice President, Spectrum & Network Analysers, EMC and Antenna Test at Rohde & Schwarz, stated: “We are delighted to be part of MeasureOne, a strategic Co-Marketing partner program that unites FormFactor – one of the world’s leading probe station providers – with Rohde & Schwarz, a global leader in test and measurement. Together, we are set up to deliver turnkey on-wafer solutions enabling crucial and demanding test capabilities for next-generation semiconductors.”

The MeasureOne partnership encompasses a wide range of Rohde & Schwarz instruments, including the R&S ZNA, R&S ZNB, R&S ZNBT, R&S ZVA and R&S ZNL VNA families, alongside signal and spectrum analysers such as the FSW, FSWX, R&S FSV3000 and R&S FSVA3000. Integration also extends to signal generators (R&S SMA100B, R&S SMB100B, R&S SGS100A, R&S SGU100A) and selected frontends and converters for advanced calibration workflows, all working seamlessly with FormFactor’s traditional plus speciality probe stations for cryogenic and vacuum applications.

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