ELE Times

AEC-Q200 Qualified Device in Compact SOT-227B Package Offers High Pulse Handling Capability and Power Dissipation to 200 W

Vishay Intertechnology, Inc. introduced a new AEC-Q200 qualified thick film power resistor in the compact, low profile SOT-227B package for mounting on a heatsink. Available with an optional NTC thermistor for internal temperature monitoring and pre-applied Phase Change Thermal Interface Material for more efficient mounting, the Vishay MCB ISOA200 offers high pulse handling capability and high power dissipation up to 200 W at an 80 °C bottom case temperature.

Built on an exposed alumina substrate instead of a metal tab, the device released, lowers costs and weight for automotive, industrial, and avionics, military, and space (AMS) applications, in which it will serve as a precharge, discharge, active discharge, or snubber resistor. For applications subject to high and repetitive pulse surges, the resistor can handle high energy pulses up to 140 J for 0.1 s and is multi-pulsed tested. Additional custom testing options for the device are also available.

With the option to integrate an AEC-Q200 qualified, temperature cycle tested NTC thermistor inside the resistor package, the ISOA200 simplifies designs and saves board space, while its optional PC-TIM streamlines installation in production. The device’s high power and high energy dissipation further simplify designs while lowering costs by reducing the need for power components.

The ISOA200 features a resistance range from 10 Ω to 1 MΩ, with tolerances of ± 5 % and ± 10 %, and TCR of ± 100 ppm/K and ± 150 ppm/K. The resistor offers a maximum operating voltage of 1500 V, an operating temperature range of -55 °C to +150 °C, and dielectric strength of 4000 Vrms. The RoHS-compliant device offers a non-inductive design and can include two different resistors.

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Integrated low-power analog peripherals reduce design costs and complexity

Devices designed for capturing rapidly changing analog signals must respond quickly while consuming minimal power, especially in battery-operated applications. To address these demands, Microchip Technology has released the PIC16F17576 microcontroller (MCU) product family with integrated low-power peripherals and the ability to precisely measure volatile analog signals.

PIC16F17576 MCUs feature a new low-power comparator and voltage reference combination that can operate while the MCU core is in sleep mode, allowing for continuous analog measurement while consuming less than 3.0 µA of current. The Analog Peripheral Manager controls which peripherals are active to minimize total energy consumption and enable battery-operated applications to monitor signals effectively without excessive power drain.

Engineered for applications that measure volatile analog signals, PIC16F17576 MCUs include operational amplifiers with software-controlled gain ladders. This feature enables a single op amp to switch between multiple gain options, helping mitigate noise while maintaining precision and power efficiency. Equipped with up to four op amps and a 12-bit differential ADC with automated averaging, the MCUs enable precise signal measurement over a wide range of inputs.

“Sensor systems can quickly become complex, often requiring multiple analog components that add board size, cost and power draw,” said Greg Robinson, corporate vice president of Microchip’s MCU business unit. “With the integrated analog features in our low-power PIC16F17576 MCUs, we’re cutting that complexity. You can eliminate parts and reduce power consumption, cutting costs and simplifying the overall design process.”

PIC16F17576 MCUs are well suited for measuring analog signals in a number of industries, including environmental and industrial monitoring, smart home and building automation. Key applications include vibration and strain measurement, flow metering, gas detection, cold asset tracking and motion sensing.

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Rohde & Schwarz test solutions have been officially approved by the Video Electronics Standards Association (VESA) for testing DisplayPort technology. This achievement reinforces the company’s commitment to delivering high-quality solutions for testing of the physical layer compliant with various industry standards.

VESA has officially approved the test solutions from Rohde & Schwarz for DisplayPort 2.1 (HBR X) transmitter testing, providing manufacturers a toolset to validate their DP2.1 (HBR X) transmitters with confidence. This test solution is based on the R&S RTP oscilloscope and R&S ScopeSuite test automation software.

Additionally, Rohde & Schwarz vector network analyzers have been approved for DisplayPort cable/connector testing, supporting various data rates including DP80 (UHBR20), DP54 (UHBR13.5 and UHBR10), and DP8k (HBR3). The brand-new R&S ZNB3000 with its exceptional measurement speed is an ideal fit for this application and reduces the test time significantly. The R&S ZNBT multiport VNA and other vector network analyzers from Rohde & Schwarz are capable of performing this task, as well.

Beyond VESA-approved testing, the Rohde & Schwarz solutions also seamlessly integrate Embedded DisplayPort (eDP) transmitter testing, providing design engineers with a unified platform for comprehensive DisplayPort technology evaluation. This integrated approach enables manufacturers to efficiently test and optimize eDP transmitters utilizing the R&S RTP and R&S ScopeSuite solution.

Patrick McKenzie, Technology Manager, at Rohde & Schwarz, said: “We’re pleased to receive VESA’s approval for our DisplayPort testing solutions. This confirms our commitment to precise and reliable test tools for the evolving display technology landscape. Our solutions empower our customers develop innovative DisplayPort products quickly and efficiently, while meeting industry standards.”

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The MCPF1412 power module with integrated I2C and PMBus interfaces for flexible configuration and monitoring

AI at the edge is driving increased integration and power consumption, requiring advanced power management solutions for industrial automation and data center applications. Microchip Technology announced the MCPF1412, a highly efficient and fully integrated point-of-load 12A power module with a 16V VIN buck converter and support for I2C and PMBus interfaces.

The MCPF1412 power module is designed to deliver superior performance and reliability, ensuring efficient power conversion and reduced energy loss. Its compact form factor of 5.8 mm × 4.9 mm × 1.6 mm and innovative Land Grid Array package significantly reduce the required board space by over 40% compared to traditional discrete solutions. This reduction in size, coupled with enhanced reliability and minimized PCB switching and RF noise, positions the MCPF1412 as a leading industry device.

“The MCPF1412 is highly compatible with our FPGAs and PCIe solutions, providing a comprehensive solution for Microchip customers,” said Rudy Jaramillo, vice president of Microchip’s analog power interface division. “This innovative solution minimizes space usage by reducing chip placements when combined with other Microchip devices.”

The MCPF1412M06 is a versatile device that offers significant flexibility for configuration and system monitoring through the I2C and PMBus interfaces. Additionally, it supports standalone operation without a digital interface, allowing designers to easily configure output voltages using simple resistor divider adjustments and monitor the system via the Power Good output.

Other key features of the MCPF1412 include multiple diagnostic functions such as over-temperature, over-current and over-voltage protection for improved performance and reliability. The operating temperature range is TJ −40°C to +125°C. An on-board embedded EEPROM is available for programming the default power-up configuration.

Microchip offers a wide range of DC-DC power modules with input voltages from 5.5-70V, available in ultra-compact, rugged and thermally enhanced packaging to improve high power density.

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When developing applications for autonomous driving, compliance with the ISO 26262 standard is crucial – at both the system and sensor levels. To meet these demands, Infineon Technologies AG introduces the XENSIV TLE4960x magnetic switch family. Developed in accordance with ISO 26262, the TLE4960x switches integrate diagnostic functions to support functional safety applications with requirements up to ASIL B. They are the only ASIL-B-compliant switches on the market that can address a wide range of automotive applications, including window regulators, sunroof actuators, and seat adjustment. In addition, the devices are AEC-Q100 compliant and qualified to Grade 0, ensuring robust performance in harsh environments.

The TLE4960x devices are designed to measure the magnetic field orthogonal to the printed circuit board in the Z-direction and feature an open-drain output for speed information. They also include integrated overcurrent and overtemperature protection. Housed in a standardized SOT23-3 SMD package, the sensors require only 1.6 mA and operate across an extended temperature range from -40°C to 175°C. Their excellent temperature stability makes them ideal for harsh automotive environments.

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As we near the halfway mark of this decade, the pace of technological advancement continues to surge like never before. These advancements aren’t just changing how we work and live—they’re redefining what’s possible. Based on emerging research and industry forecasts, here are the most significant developments poised to reshape our world in the coming years.

The Sustainability Revolution Goes Mainstream

Technological progress is now being driven by a deep commitment to environmental responsibility. Cutting-edge solutions like carbon-neutral data centers, self-healing materials, and AI-powered energy optimization systems are moving from experimental to essential. The next wave of innovation will blur the line between ecological preservation and technological advancement, creating a new standard for responsible development.

AI Transforms from Assistant to Architect

Artificial intelligence is undergoing its most profound evolution yet. Beyond automating tasks, next-generation AI systems will design solutions, predict market shifts before they occur, and even contribute to scientific breakthroughs. This shift will create new opportunities in fields ranging from pharmaceutical research to urban planning, fundamentally altering how we approach complex challenges.

Urban Ecosystems Come Alive

Cities are evolving into responsive, intelligent organisms. Through a combination of advanced IoT networks, distributed computing, and real-time analytics, metropolitan areas will dynamically adapt to their inhabitants’ needs. Imagine streetlights that adjust based on pedestrian flow, or waste systems that predict and prevent overflow—these are no longer futuristic concepts but imminent realities.

Technology Disappears into Experience

The most profound tech innovations will be the ones we don’t notice. Frictionless interfaces, anticipatory systems, and biologically inspired designs will make technology feel increasingly natural and intuitive. This invisible revolution will prioritize human needs over technical specifications, creating experiences that adapt to us rather than requiring us to adapt to them.

Security Becomes Proactive and Predictive

In our hyperconnected world, cybersecurity is evolving from defense to anticipation. Emerging technologies like behavioral biometrics and quantum-resistant cryptography will create systems that identify threats before they materialize. This paradigm shift will redefine trust in the digital age, enabling safer innovation across all sectors.

Charting the Course Forward

These converging trends reveal a future where technology serves as both catalyst and compass—driving progress while helping us navigate its implications. For businesses and individuals alike, success will depend on understanding these transformations and adapting with intention.

The coming years promise extraordinary possibilities, but they demand equally extraordinary vision. Those who can anticipate these shifts and harness their potential will shape not just their own future, but the future of our interconnected world.

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Championing sustainability through technology, people, and planet

In a world racing against the clock to combat climate change and build a more equitable future, STMicroelectronics (ST) is making bold, tangible strides toward becoming a global sustainability leader in the semiconductor industry.

Mr. Edoardo Auteri, S&M Head of Sustainability Programs, APeC Region

From carbon neutrality pledges to sustainable innovation, ST is embedding environmental and social responsibility into the heart of its operations. The company’s sustainability journey is not an afterthought—it’s a carefully architected strategy that places the planet, people, and purposeful technology at the core of its mission.

In this exclusive interview, Mr. Edoardo Auteri, S&M Head of Sustainability Programs, APeC Region,  shares insights on ST’ new long-term sustainability goals and commitments.

 

 

Protecting the Planet: From Footprint to Handprint

ST’s commitment to environmental sustainability is evident in its ambitious goal to achieve carbon neutrality by 2027, encompassing direct (Scope 1), indirect (Scope 2), and select Scope 3 emissions. By the end of 2023, the company had reduced its Scope 1 and 2 greenhouse gas emissions by 45% compared to its 2018 baseline, moving closer to its 50% reduction target by 2025.

71% of ST’s electricity in 2023 was sourced from renewables, rising to 84% by the end of 2024. The company aims to reach 100% renewable electricity by 2027 through a combination of on-site solar, green energy certificates, and long-term power purchase agreements (PPAs) across global sites.

Water stewardship and waste management are integral to ST’s environmental strategy. In 2024, ST recycled 54% of its water usage and continues to invest in water-saving programs across all manufacturing sites.

More here: Protecting the Planet – STMicroelectronics

Sustainable Technology: Innovation with Purpose

ST’s dedication to sustainable innovation is reflected in its products and technologies. All new products undergo an eco-design process, ensuring environmental considerations are integrated from the outset.

The company’s semiconductors play a crucial role in enabling energy-efficient applications across various sectors, including electric vehicles, renewable energy systems, and smart devices. Notably, 40% of ST’s revenue is now EU-Taxonomy eligible, highlighting its alignment with sustainable economic activities.

More here: Sustainable Technology – STMicroelectronics

Prioritizing People: Empowering Teams and Communities

At the heart of ST’s sustainability strategy is a commitment to its people. In 2024, 84% of employees rated ST as a great place to work, reflecting a strong organizational culture.

The company emphasizes health and safety, achieving a recordable case rate of 0.54 for ST employees in 2024. Diversity and inclusion are also prioritized, with 10 out of 11 sites receiving RBA Platinum recognition.

ST’s community engagement is evident through its employees donating over 156,000 hours to volunteering activities in 2023, demonstrating a strong commitment to societal well-being.

More here: Prioritizing People – STMicroelectronics

Sustainability Commitments: A Clear Roadmap

ST’s sustainability efforts are guided by a comprehensive framework aligned with the United Nations Sustainable Development Goals (SDGs). The company has set 24 measurable sustainability goals for 2025, encompassing environmental performance, governance, and social impact.

Governance structures, including an Executive Sustainability Council chaired by the CEO, ensure that sustainability is embedded at the highest levels of decision-making. ST’s transparency and commitment have been recognized by independent agencies, with the company receiving A- scores for CDP water security and climate change.

As the global community intensifies its focus on sustainability, STMicroelectronics exemplifies how integrating environmental and social responsibility into business operations can drive meaningful change. Through its continued efforts, ST is not only advancing semiconductor technology but also paving the way for a more sustainable and equitable future.

More here: Sustainability Commitments – STMicroelectronics

Conclusion

As climate urgency grows and ESG becomes a boardroom imperative, STMicroelectronics is not just adapting—it’s innovating for good. With a long-term vision that combines technological excellence, environmental stewardship, and social equity, ST is shaping a future where semiconductors are smarter, greener, and more human-centered.

In the story of sustainable transformation, ST isn’t just a character—it’s becoming one of the leading authors.

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• Aumovio combines tradition and a strong market position in the automotive industry with the ambition to shape the mobility of the future
• With the announcement of the new name at Auto Shanghai 2025, Automotive underlines the importance of the growth market of China and its “in the market for the market” approach
• Philipp von Hirschheydt, Member of the Executive Board of Continental and CEO Automotive: “We have consistently aligned automotive with future technologies and are picking up on market developments quickly, innovatively and from a strong competitive position. This means that we are consistently on our way to becoming an adaptive automotive powerhouse. Our future brand also reflects this ambition”

Continental group sector Automotive presented its future name at Auto Shanghai. The independent automotive company will be named Aumovio. The name of the new company combines the strong market position, heritage and technological expertise in the automotive industry with the ambition to shape the mobility of the future with innovations. Aumovio will offer electronic products and advanced mobility solutions for the software-defined vehicle and safe, exciting, connected and autonomous mobility to a wide range of global customers. According to a market analysis by Berylls, Automotive expects the value of solutions per vehicle in these segments to grow by an average of 4.7 percent annually until 2029 – and more dynamically than the number of passenger cars and light commercial vehicles produced worldwide (based on market forecast by S&P Global Mobility). At the Auto Shanghai this year, the group sector also presented its “in the market for the market” approach and several innovative technologies for Chinese customers and the Chinese market. Following the expected approval at the Continental Annual Shareholders’ Meeting on April 25, 2025, Aumovio is scheduled to list on the Frankfurt Stock Exchange in September 2025.

“As an independent company, we gain significantly more creative power and speed. Aumovio will be characterized by a triad of technologically leading products, a consistent value creation strategy and a global synergetic network, combined with a strong local presence for our customers. Our aim is to further expand our position in the future fields and growth markets of mobility. This strategy is particularly evident in China. Among other things, we are relying on our strong local presence by producing and developing locally for the Chinese market,” says Philipp von Hirschheydt, Member of the Executive Board of Continental and CEO of Automotive.

Continental’s group sector Automotive has been present in China for 30 years and employs around 10,000 people there. In the 2024 financial year, Automotive generated around 14 percent of its global sales in China. At Auto Shanghai, Automotive presented the Luna and Astra driver assistance systems, among others. Both were developed in the joint venture Horizon Continental Technology, for the Chinese market. Luna is an assistance system and supports active safety as well as basic driving and parking functions to increase safety and comfort. Astra is an advanced assistance system and enables, among other things, assisted driving without a high-resolution map and parking assistance with memory function.

Modern mobility solutions from Automotive

The future Aumovio offers highly developed electronic products and modern mobility solutions. In addition to its strong market position with innovative sensor solutions, displays, and technologically leading braking and comfort systems, Aumovio has significant expertise in software, architecture platforms and assistance systems for the rapidly growing future market of software-defined and autonomous vehicles. The Automotive group sector employs around 92,000 people and generated sales of around 19.4 billion Euros in the 2024 financial year.

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New radar sensor with Bosch’s own computing chip (SoC) and flexible ADAS solution packages

• The Bosch ADAS product family is a flexible modular system for driver assistance. Bosch is to equip the first passenger cars in China from mid-2025.
• Bosch is the first Tier 1 supplier to present a new radar sensor with a complete in-house design and its own system-on-chip (SoC).
• The future portfolio for driver assistance and automated driving is rounded off by a next-generation multi-purpose camera and inertial sensor unit.

Bosch is presenting its extensive portfolio of solutions for assisted and automated driving and parking. It includes software features and hardware components that the technology group is aligning with the expectations of local drivers and can be easily customized for different customer needs. With its radar sensor, Bosch is the first Tier 1 supplier worldwide to break new ground and develop and manufacture the entire product in-house. The special feature: The sensor has a computing chip specially developed by Bosch–known as an SoC–which combines high computing power with the smallest possible footprint. The radar sensor fits into Bosch’s newly designed modular system for assisted and automated driving: The Bosch ADAS product family (Advanced Driver Assistance Systems) offers a kind of ecosystem of software, sensors and services as well as the appropriate high-performance computers. Customers can make use of this and flexibly utilize the comprehensive solutions for various markets and vehicle segment – from low-cost small cars to high-performance premium models. The goal: Bosch wants to enable manufacturers worldwide to bring driver assistance functions to the mass market more easily, quickly, and cost-effectively. A new generation of the multi-purpose camera and the inertial sensor unit for the precise localization of assisted and automated vehicles complement the sensor portfolio.

“With our new Bosch ADAS product family, we are offering cost-efficient solutions for assisted and automated driving to the usual high standards of quality and safety. We have the right software and hardware for driver assistance functions, from small cars to mid segment and premium vehicles. This enables car manufacturers to integrate functions quickly and easily into their vehicles and bring them to market very fast.”

Christoph Hartung, President of the Cross-Domain Computing Solutions division at Robert Bosch GmbH.

“With our new Bosch ADAS product family, we are offering cost-efficient solutions for assisted and automated driving to the usual high standards of quality and safety. We have the right software and hardware for driver assistance functions, from small cars to mid segment and premium vehicles. This enables car manufacturers to integrate functions quickly and easily into their vehicles and bring them to market very fast,” says Christoph Hartung, President of the Cross-Domain Computing Solutions division at Robert Bosch GmbH

New Bosch ADAS product family in three equipment variants

Advanced driver assistance systems help to increase safety and comfort on the road. For example, by providing the driver with targeted support during monotonous and tiring driving tasks. Bosch has many years of experience with driver assistance systems, their development and integration into the vehicle. A deep understanding of each vehicle area is required for optimum implementation. With this expertise, Bosch is repositioning the ADAS product family. It enables assisted driving and parking up to SAE level 2, thus meeting the prevailing demand on the market. Bosch offers the ADAS product family in three variants: for the entry segment, the mid segment and the high segment. The variants differ depending on the scope of the software, the number and combination of sensors, and the required computing power. Seamless harmonization of these individual components facilitates system integration. Bosch gives car manufacturers swift and uncomplicated access to driver assistance systems, enabling them to significantly accelerate the development time of their vehicles. Bosch brings its hardware and software components to the market both as a complete systemic solution and separately from each other, as is the case in modern vehicle development. This provides further scope, as individual components of the three variants can be exchanged and flexibly combined as required. Accordingly, manufacturers have further freedom to integrate the driver assistance systems into their cars on a brand-specific basis. Artificial intelligence can be found throughout the Bosch ADAS product family. Bosch uses it, for example, for perception and driving planning. Thanks to AI, the vehicle thinks ahead, pays attention to what other road users might be doing, and calculates the next steps to safely reach the destination.

The entry segment version already incorporates key safety and comfort functions into the vehicle. The car uses this to regulate its speed and distance from the vehicle in front depending on the situation and keeps in lane when lane markings are clearly visible. This variant can be implemented as a purely camera solution with the new multi-purpose camera from Bosch, but can also be supplemented with up to five radar sensors depending on the safety requirements (of a country). The variant for the mid segment unlocks even more extensive functions. For example, an extended lane keeping assist that can also cope with lane markings that are not visible in places. In this variant, Bosch combines its camera heads for perception with additional sensors. The computing power no longer takes place in the camera itself, but in a more powerful central vehicle computer, as is becoming standard in software cars. Thanks to Bosch, the vehicle masters more complex traffic scenarios, which further increases driving comfort and safety on freeways and in heavy traffic. The system also pays attention and supports the driver. Bosch is already introducing hands-free driving on the freeway in this variant, provided the legal framework in the respective country permits it. This means that the driver can take their hands off the steering wheel at times, but still remains responsible. The variant for the high segment represents the pinnacle of Bosch driving assistance. It uses a 360-degree video belt and impresses with even greater computing power, so that the vehicle can handle urban junctions with ease and safely enter and exit roundabouts. Hands-free driving is extended to urban traffic in this version, provided that the legal requirements in the markets allow it. Bosch takes into account the various regulatory requirements and safety assessments

Bosch ADAS product family goes into serial production in mid-2025

The equipment variant for the mid-range segment will go into serial production with a Chinese manufacturer in the middle of this year. Users of this system will benefit from an assistance system linked to the navigation system, which is particularly popular among Chinese customers. The vehicle then independently carries out driving maneuvers along the route entered, such as changing lanes on freeways. The driver remains responsible and must be ready to intervene at any time. This function makes driving in the heavy traffic of Chinese cities more convenient and safer. Bosch has also already secured its first orders for the high segment version, with serial production expected to start in summer 2025. Bosch has already acquired half a dozen new customers for the ADAS product family for mid- and high segment in China, including BAIC, Dongfeng and Jetour. Bosch is thus continuously strengthening its leading position in the global ADAS market.

New radar sensor with Bosch SoC

Radar sensors are key components of driver assistance systems and modern vehicles would be inconceivable without them. For the new generation of its radar sensor, Bosch has developed and manufactured all core elements in-house, including the computing chip (SoC). The new Bosch radar sensor uses “RF CMOS technology,” which enables the efficient integration of high-frequency and digital circuits on a single chip. The structure size of the transistors of only 22 nanometers makes the chip particularly powerful and efficient despite its small footprint. Bosch is the first Tier 1 supplier on the market to introduce this technology in serial production.

New generation of the multi purpose camera

With the increasing market penetration of more extensive driver assistance functions in the lower price segments, high-performance yet affordable camera solutions are steadily gaining in importance. The new multi purpose camera from Bosch enables assisted driving and parking functions (up to SAE level 2) from the entry segment. Serial production is scheduled to start in 2026, initially in the Chinese market. Bosch’s own optical image processing module in the new camera generation ensures optimum sharpness and precision over the entire product service life, even in highly fluctuating temperatures. The camera is particularly durable, with consistently stable functional performance.

With its 8 megapixel image sensor, a horizontal field of vision of 120 degrees, and a detection range of up to 300 meters, the camera enables safety and convenience functions for assisted driving. These include adaptive cruise control and distance control, emergency braking within your own lane, lane keeping in urban areas, and detection and stopping at red lights

The new multi purpose camera is the central interface for the fusion of various sensor data. This means that the camera combines the data from its own image sensor and additionally from up to five radars and other sensors such as driver monitoring cameras or interior sensors. This integrated approach enables OEMs to reliably comply with mandatory ADAS regulations (e.g. General Safety Regulation), improve driving safety, and support the driver on the freeway (e.g. with assisted lane changes).

Safe localization in all driving situations

For assisted and automated driving, it is essential that vehicles can locate themselves precisely and safely at all times. Even in difficult visibility conditions and in the absence of lane markings or if the signal from the global navigation satellite system (GNSS) fails – for example, when driving through a tunnel – it is essential that the vehicle’s location can be determined reliably. This is the only way to guarantee a high level of functional availability. At the largest automotive trade fair in China, Bosch is presenting for the first time the new generation of its high-performance inertial measurement unit (IMU), which has been specially designed for ADAS and vehicle dynamics applications. Vehicles pitch when braking, lean to one side (roll) or lurch (swerve) when taking corners. In addition to these movements, the inertial sensor unit measures the vertical, longitudinal and lateral acceleration of the vehicle. From this, it can precisely calculate the relative change in position of the vehicle, enabling it to maintain the originally planned route with only minimal deviation. With various product variants, Bosch offers a high degree of scalability, from the cost-effective entry segment variant for assisted driving to the high-performance sensor for automated driving up to SAE level 4. Bosch uses sensor modules that are manufactured in the company’s own production facilities and, in addition to an in-depth understanding of the system, can draw on a comprehensive range of experience from over three decades of developing such inertial sensors.

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The new OX01N1B is designed to be a cost-effective solution for DMS cameras and features industry-leading QE, MTF and low power

OMNIVISION, a leading global developer of semiconductor technology, including advanced digital imaging, analog and display solutions, announced the new OX01N1B image sensor for in-cabin automotive driver monitoring systems. The device is the newest addition to OMNIVISION’s industry-leading Nyxel near-infrared technology family of automotive sensors and is a 1.5-megapixel RGB-IR or monochrome BSI global shutter (GS) sensor with a pixel size of 2.2 microns (µm) and an optical format of 1/4.51-inch. OMNIVISION will showcase the OX01N1B sensor with eco-system partners at Auto Shanghai, taking place April 23-May 2, 2025.

Key features of the OX01N1B include industry-leading NIR quantum efficiency at 36% for excellent low-light performance, a high modulation transfer function for better image quality and resolution, low power consumption, and an optical format that enables extremely compact camera module design. The OX01N1B uses OmniPixel 4-GS technology for simultaneous image detection in all pixels to accurately reproduce rapid motion without any distortions.

“Driver monitoring systems will be mandatory for all new cars in Europe starting in 2026; the entire global automotive industry is experiencing greater adoption rates of DMS as well, in an effort to improve road safety. As a result, OMNIVISION is introducing the new OX01N1B, which is the ‘sweet spot’ among performance, size and cost for mainstream DMS applications,” said Dr. Paul Wu, head of automotive product marketing, OMNIVISION. “The OX01N1B chip size is even smaller than the previous OX01H1B and it can reuse the same optical path since the pixel size and optical array size is identical. We’ve also added image signal processing to the OX01N1B device.” Dr. Wu adds, “There are many design considerations for DMS. With our expanded portfolio, we offer automotive OEMs a variety of cost and performance options and greater flexibility to place the DMS camera into different locations in their next-generation vehicle designs.”

“OMNIVISION’s new OX01N1B sensor delivers exceptional performance in a remarkably compact format, which makes it a perfect fit for our latest innovation, the All-In-One camera AI ONE,” said Martin Krantz, CEO and Founder of Smart Eye. “With this sensor at its core, we’ve been able to build the integrated DMS we’ve always envisioned, bringing together camera, sensor, processing, and software in a single, self-contained unit.”

The OX01N1B has integrated ASIL-B and cybersecurity that meet the latest industry standards. It comes in an OMNIVISION a-CSP package, allowing for higher-performance image sensors in tighter camera spaces. It is available in a reconstructed wafer option for designers who want to assembly a bare die imager into their camera module.

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Low-Cost RA0E2 Devices Target Consumer Electronics, Small Appliances, Industrial System Control and Building Automation

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the RA0E2 microcontroller (MCU) Group based on the Arm Cortex -M23 processor. The new, cost-competitive devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.

Renesas introduced the RA0 MCU series in 2024 and it has quickly become very popular with a wide range of customers due to its affordability and low power consumption. RA0E1 devices have already been adopted in consumer electronics, appliance and white goods, power tools, industrial monitoring and other applications.

RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.

Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.

Feature Set Optimized for Low Cost

The RA0E2 devices have a feature set optimized for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.

In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.

“The market reception for our RA0 Series has exceeded even our own high expectations,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “The RA0E2 Group MCUs deliver the same ultra-low power and price point that have been so popular with our customers. The addition of extended temperature range and more memory opens up even more applications and use cases. We plan to further expand the RA0 product lineup, delivering optimal solutions for 8-16 bit MCU users transitioning to 32-bit MCUs.”

Key Features of the RA0E2 Group MCUs

• Core: 32MHz Arm Cortex-M23
• Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM
• Extended Temperature Range: Ta -40°C to 125°C
• Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC
• Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs
• Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
• Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection
• Security: Unique ID, TRNG, AES libraries, Flash read protection
• Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP

The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices.

The post Renesas Debuts New Group in Popular RA0 Series with Best-in-Class Power Consumption and Extended Temperature Range appeared first on ELE Times.

Infineon Technologies AG, a global semiconductor leader in power systems and IoT, and Marelli, a world-leading automotive systems manufacturer, are partnering to advance automotive display technology with an innovative MEMS laser beam scanning (LBS) system. Based on Infineon’s LBS technology, this solution enables Marelli to create immersive cockpit experiences free from the constraints of traditional displays. This cutting-edge technology will be showcased at Marelli’s booth during Auto Shanghai 25.

“The automotive industry’s demand for innovative optics solutions in cockpit designs is accelerating, and Infineon is committed to delivering these solutions to our customers faster than ever before,” said Dr. Thomas Schafbauer, Head of Sensor and RF Business Unit at Infineon. “With our focus on a faster time to market, we’re helping our customers stay ahead of the curve and capitalize on the growing demand for next-generation display technologies.”

“We are thrilled to collaborate with Infineon on MEMS LBS, which represents a significant leap in automotive display technology,” said Joachim Fetzer, Chief Technology and Innovation Officer at Marelli. “This innovative solution offers significant design freedom and efficiency, enabling us to create unique and engaging cockpit experiences for our customers with a faster innovation-to-customer approach.”

The Infineon MEMS LBS system is fully automotive-compliant. It is shock and vibration robust, and compliant up to ASIL-B. Its compact chip-scale package ensures versatility and enables flexible design possibilities for easy integration across various applications. Furthermore, the system’s high efficiency provides a bright, clear display even in high ambient light conditions and reduces power consumption and heat generation, making it highly suitable for demanding automotive environments. A large depth of field also offers focus-free projection, simplifying the optical design. These features allow OEMs to differentiate their cockpit designs while maintaining rich information displays.

The Infineon MEMS LBS system will be showcased at Marelli’s booth (Hall 1.2H, booth 1BF009) during Auto Shanghai 25.

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Designed for extreme environments and conditions, radiation-hardened MOSFETs are available from 100 Krad to 300 Krad Total Ionizing Dose

The JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications. Microchip Technology announced the completion of its family of radiation-hardened power MOSFETs to the MIL-PRF-19500/746 slash-sheet specification and the achievement of JANSF qualification for its JANSF2N8587U3, 100V N-channel MOSFET to 300 Krad (Si) Total Ionizing Dose (TID).

Microchip’s JANS series of rad-hard power devices are available in voltage ranges from 100–250V to 100 Krad (Si) TID, with the family expanding to higher Radiation Hardness Assurance levels, starting with the JANSF2N7587U3 at 300 Krad (Si) TID. The JANS RH MOSFET die is available in multiple package options including a plastic package using the MIL-qualified JANSR die, providing a cost-effective power device for New Space and Low Earth Orbit (LEO) applications. The ceramic package is hermetically sealed and developed for total dose and Single-Event-Environments.

The devices are designed to meet the MIL-PRF19500/746 standard with enhanced performance, making them excellent options for applications that demand high-reliability components capable of withstanding the harsh environments of space and extending the reliability of power circuitry.

“Meeting the stringent specifications required for rad-hard MOSFETs is extremely challenging, and Microchip is pleased to achieve this development milestone by leveraging its proprietary rad-hard by design process and technology,” said Leon Gross, corporate vice president of Microchip’s discrete products group. “Our advanced technology provides our aerospace and defense customers with highly reliable and cost-effective solutions that meet the growing demand of the market and their applications.”

The JANSF and JANSR RH power MOSFETs serve as the primary switching elements in power conversion circuits, including point-of-load converters, DC-DC converters, motor drives and controls, and general-purpose switching. With low RDS(ON) and a low total gate charge, these power MOSFETs offer improved energy efficiency, reduced heat generation and enhanced switching performance when compared to similar devices on the market.

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President Donald Trump’s administration has dramatically escalated trade tensions by imposing heavy new tariffs on Chinese goods, some of which are as high as 245%. The rising economic and geopolitical competition between the United States and China is the driving force behind this audacious move, which marks a new chapter in Trump’s “America First Trade Policy.”

Late Tuesday, the White House released a fact sheet outlining how these penalties are a direct response to China’s recent actions. By imposing export restrictions on crucial raw minerals like gallium, germanium, and antimony as well as rare earth magnets and six heavy rare earth elements—items essential to the semiconductor, aerospace, and defense industries—Beijing has been showing off its power.

This strong reaction is a result of the U.S.’s perception that China is using its supply chain dominance as a weapon. “China now faces up to a 245% tariff on imports to the United States because of its retaliatory actions,” the White House stated.

Karoline Leavitt, the press secretary for the White House, added that although President Trump is amenable to a trade agreement with China, he is waiting for Beijing to initiate this increasingly heated tariff spat.

What’s Hard Hit: A More Detailed Look at Tariffs

Needles and syringes: 245%

Lithium-ion batteries: 173%

Seafood: 170%

Wool sweaters: 169%

Plastic dishes: 159%

Toasters: 150%.

Electric vehicles: 148%

Toys, dolls, and puzzles: 145%

Vitamin C: 145%

Car wheels: 73%

Semiconductors: 70%

Metal furniture: 70%

Car door hinges: 67%

Laptops: 20%

Children’s books: 0%

These tariffs have enormous knock-on effects that affect everything from clothing to electronics and medical equipment.

Examining the Specifics:

Devices and Cell Phones

According to the U.S. Commerce Department, electronics, including TVs and mechanical appliances, account for 46.4% of all imports from China in 2022, including smartphones and accessories. More over 80% of the $52 billion worth of cellphones imported into the United States in 2024 came from China. These were initially subject to 145% taxes, but new customs regulations exempted phones and laptops from a reciprocal 125% levy. They are nevertheless forced to pay a 20% total tariff, which builds up over time (0% base + 20% fentanyl-related penalty).

Furniture, Clothes, and Toys

China is a major supplier of consumer products, furniture, and textiles, accounting for more than 50% of toys, furniture, and almost 30% of U.S. textile imports. Up until now, items like tricycles and plush animals were duty-free, which kept costs down. Toys are no longer a deal, though, because to a new 145% tax (0% base + 20% fentanyl penalty + 125% reciprocal). Wool sweaters and other clothing are now subject to a staggering 168.5% total tax (16% base + 7.5% pre-2025 + 20% penalty + 125% reciprocal), which significantly raises the cost of wardrobes.

Conclusion: Companies will have to assess their supply chains to ascertain the damage as these tariffs are not universal; they vary by product, material, and exclusions. EV makers, electronic companies, and energy storage companies that rely on Chinese suppliers will suffer from the 173% tariff on lithium-ion batteries. What about the 70% semiconductor duty? For American computer companies already dealing with chip shortages, that presents even another challenge.

It’s a complicated problem, and if businesses pass it on, the true cost may end up on customers. The United States and China are currently engaged in a high-stake game of chess.

The post Trump’s Trade Bombshell: Tariffs on China Hit 245% appeared first on ELE Times.

IPEC eyes market expansion of its EV Charging Products and Solutions business with new funding and aims to diversify into wider power electronics domain

Bengaluru-based IPEC, a first-mover and innovator in the EV charging space, has secured an investment of $3 million from Nikhil Kamath and Abhijeet Pai’s Gruhas. This investment from Gruhas in IPEC’s journey strengthens IPEC’s mission to consolidate its leadership status in the EV Charging sector and accelerate its growth in the broader power electronics domain. Having successfully delivered over 1 million EV charging products to the top EV OEMs in India, IPEC is now gearing up to expand its manufacturing capacities to 50,000 units per month. IPEC offers a range of EV charging products that include private, portable, and public chargers as well as EV Connectors and Vehicle Charging Inlets. These products are fully compliant with various national and international standards and the latest localisation regulations, including the PM E-Drive and PLI Scheme. Beyond hardware, IPEC also offers Cloud-based Charging Management Systems (CMS) and a user-friendly mobile app for real-time control and insights. IPEC is an approved supplier to leading EV OEMs like Ather Energy, Bajaj Auto, Greaves (Ampere), and more. Recognising the emerging need for power electronics in the EV Sector and in the energy transition, IPEC was created in 2017 by the MEHER Group, together with DEKI Electronics & Sungho Electronics, with Zohra Khan as its CEO. At the core of energy transition is Power Electronics – the technology that facilitates efficient power conversion in EVs, charging infrastructure, renewable energy, energy storage systems and green hydrogen. IPEC is driving this energy transition in e-mobility with intelligent, reliable and cost-effective charging solutions at scale that address India’s specific needs and the rising demand for locally manufactured alternatives. Among its strengths is IPEC’s highly evolved design and manufacturing expertise combined with the ability to seamlessly integrate sophisticated hardware, advanced software and AI.

Zohra Khan, CEO of IPEC, remarked, “Traditionally, India’s reliance on imports for power electronics has been high. At IPEC, we are changing that by designing and manufacturing power electronic products in India – for India and the world. This investment by Gruhas shall further propel our contributions to the ‘Make In India’ mission and enhance India’s EV ecosystem. IPEC has witnessed a 40% growth in revenue in FY25 and anticipates doubling its revenue in FY26.

This investment also enables IPEC to expand our avenues and capabilities to launch IPEC into global markets. We are excited to have Gruhas as part of the team and look forward to a great journey ahead.” Abhijeet Pai, Co-Founder of Gruhas, adds, “IPEC is fast emerging as a changemaker in India’s EV charging ecosystem. As the country accelerates toward an electric future, reliable and scalable charging infrastructure built on quality components, sub-assemblies, and smart chargers becomes mission-critical. Together, Zohra and IPEC have led the way in this space. By already serving four of India’s top OEMs, they’ve set benchmarks in manufacturing chargers, especially for the two-wheeler segment. Their deep ecosystem understanding and technical capabilities position them to expand beyond two-wheelers, into broader applications. At Gruhas, we are committed to backing companies that scale in tandem with OEMs — building the long-term future of the industry together.”

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As India accelerates its journey toward a digitally empowered, sustainable energy future, Advanced Metering Infrastructure (AMI) has emerged as a linchpin for modernizing the nation’s power grid. With rising energy demands, expanding renewable integration, and bold policy initiatives like the Revamped Distribution Sector Scheme (RDSS), the role of smart metering has never been more critical.

Ashish Sahay, Country Manager and Sales Director at Wirepas

In this exclusive interview with ELE Times, Ashish Sahay, Country Manager and Sales Director at Wirepas, shares insights into the transformative role of AMI and RF mesh technology in India’s smart grid evolution. With Wirepas leading the charge in next-gen, infrastructure-free connectivity, Sahay outlines how the company is enabling scalable, cost-effective solutions tailored to India’s unique power distribution landscape.

Excerpt:

ELE Times: India is undergoing a massive transformation in its power sector. How do you see Advanced Metering Infrastructure (AMI) playing a critical role in this journey toward a smarter, more resilient grid?

India’s energy landscape is evolving rapidly, and Advanced Metering Infrastructure (AMI) is emerging as a foundational pillar in building a smarter, more resilient power grid. With rising energy demand and a growing share of renewables, utilities need real-time visibility and control to ensure grid stability. Smart meters provide exactly that – enabling accurate consumption data, reducing non-commercial losses, and helping utilities become financially viable. The loss-making governmental electricity distribution companies, which already have implemented smart meters, have become profitable. This, in turn, allows them to reinvest in modernizing the grid. For consumers, AMI brings transparency, accurate billing, and better control over energy usage. It’s a critical enabler in India’s journey toward sustainable and equitable energy access.

ELE Times: Wirepas has introduced a unique 5G RF Mesh technology to the Indian market. Can you explain how this solution differs from traditional communication networks and how it improves scalability, cost-efficiency, and performance for smart metering?

Ashish Sahay: Wirepas’ RF mesh technology is fundamentally different from traditional communication networks used in smart metering. Instead of relying on costly and complex infrastructure like cellular base stations, Wirepas turns each smart meter into part of a decentralized, self-healing mesh network. This means meters connect directly with their neighbors, forming a resilient and scalable system with no single point of failure.

The real game-changer is cost and scalability. We have removed the need for network infrastructure. RF Mesh requires a point collecting data to be sent to the cloud. Wirepas has enabled in-meter gateway where,  one smart meter having a cellular connection can support up to 300 Wirepas RF mesh meters, dramatically reducing communication costs. With built-in wireless modules running Wirepas software, utilities can deploy at scale without compromising on performance – achieving proven 99.9% reliability even in challenging environments. It’s a flexible, high-performance solution designed from the ground up to meet the unique demands of India’s smart metering rollout.

Current regulatory setup in India, has not yet adapted to the European harmonized standard for 5G mesh. India has 1880-1900 MHz spectrum available, but not yet allocated for NR+ 5G standard, like in Europe. For this reason Wirepas has adapted 5G technology to be used on 865-868 MHz spectrum with less performance. Going further, the Indian government should enable NR+ 5G technology to be used on the 1880-1900 MHz band which is currently allocated to legacy DECT devices.

ELE Times: Despite government mandates, large-scale smart grid adoption still faces hurdles. From your experience, what are the key challenges utilities face when implementing AMI solutions, and how can they be addressed?

Ashish Sahay: Despite strong government support, large-scale smart grid adoption in India still faces several key hurdles. One major challenge is the industry’s limited experience with smart metering – especially early on, when the local ecosystem was still developing under the Make in India initiative. Many utilities and contractors are still climbing the learning curve, which has led to delays and uneven rollouts.

Reliable communication is another critical issue. AMI depends on consistent, high-quality connectivity, yet cellular coverage in India can be patchy – especially in rural or densely built-up areas. In some cases, only 70% of cellular smart meters maintain a connection, and even when coverage exists, the quality may fall short of AMI service requirements. Workarounds like BLE-based smartphone reconnections are not scalable solutions. While lower cost RF Mesh can deliver better coverage and SLA. Typically each smart meter using Wirepas Mesh communication technology is able to communicate via 50 or more meters, providing seamless network coverage and strong network signal.

Additionally, utilities must navigate the massive scale of deployment and the hidden costs tied to cellular technologies, such as SEP (Standard Essential Patent) fees and long-term subscription costs, which can significantly impact margins.

To overcome these challenges, solutions like Wirepas Mesh offer a compelling alternative. By turning each smart meter into a node in a self-healing, decentralized mesh network, Wirepas eliminates dependency on cellular coverage. It also reduces cost and risk by avoiding SEP-related liabilities. This approach not only ensures reliable connectivity across urban and rural environments but also supports fast, large-scale rollouts, making it a strong fit for India’s ambitious AMI goals.

ELE Times: India’s power sector is guided by ambitious digitalization goals under initiatives like RDSS. How aligned is Wirepas with these national programs, and what role does policy play in accelerating smart metering deployment?

Ashish Sahay: Wirepas is fully aligned with India’s digitalization goals under initiatives like the Revamped Distribution Sector Scheme (RDSS). These policy-driven programs have been instrumental in accelerating smart metering adoption by providing clear targets, financial support, and standardized requirements that create a level playing field for all stakeholders. Without such initiatives, large-scale rollouts would be fragmented and far slower. For Wirepas, this policy alignment means we can offer scalable, infrastructure-free connectivity that meets national standards, helping utilities deploy faster, more efficiently, and at lower cost. Policy has truly been the catalyst turning smart metering from a tech upgrade into a national imperative.

India government RDSS is becoming a worldwide role model of well executed national smart metering programs. Defining the standard at the right level enables the free competition and helps utilities to reach their roll-out targets in time.

ELE Times: You’ve worked across global markets—what lessons from international smart grid rollouts are particularly relevant to India’s unique power distribution landscape

Ashish Sahay: The lifetime of AMI systems is increasingly reaching 15 years or more. This places significant demands on the selected technologies to ensure they do not become obsolete during their operational lifespan.

India tends to focus on short-term goals, such as the upfront cost of hardware, while in reality, maintenance costs (OPEX) play a major role in the overall business case. For instance, parts of Southern Europe widely adopted PLC technology, which, despite the low cost of smart meters, led to high system maintenance costs.

In Europe, in-meter RF mesh gateways have proven to be by far the most economical solution for deploying RF connectivity, effectively covering both rural and densely populated urban areas. India has the opportunity to replicate this success.

ELE Times: With rapid innovation in IoT and connectivity, where do you see the future of connected utilities heading in India over the next five years—and how is Wirepas positioning itself to lead that future?

Ashish Sahay: Over the next five years, India’s connected utilities will evolve into highly data-driven, responsive systems, powered by real-time insights and seamless IoT connectivity. At Wirepas, we see this transformation as a huge opportunity, and we’re positioning ourselves to lead it. Today, our RF mesh technology is already used in around 25% of new smart meter deployments in India, and we’re committed to expanding that footprint by partnering with local players and licensing our technology to Indian manufacturers.

Our solution is built for scale, performance, and future demands, supporting granular data collection intervals and ultra-resilient communication, all with the lowest total cost of ownership. We’re not just keeping pace with innovation; we’re setting the standard for what AMI connectivity should look like in India’s next phase of digital utility transformation.

Wirepas based systems enable utilities to also benefit from load balancing use cases to utilize the same RF communication with the electricity loads connected to the grid.

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Featuring Low 0.88 mm Profile and Wettable Flanks, Space-Saving Devices Provide Improved Thermal Performance and Efficiency

Vishay Intertechnology, Inc. introduced 27 standard and Trench MOS Barrier Schottky (TMBS) surface-mount rectifiers in the low profile DFN33A package with wettable flanks. Providing space-saving, high efficiency solutions for commercial, industrial, telecom, and automotive applications, the standard devices are the industry’s first in this package size and provide current ratings up to 6 A, while the TMBS devices deliver industry-best current ratings up to 9 A. Offering a wide range of voltage options from 60 V to 200 V for TMBS and up to 600 V for standard rectifiers, the devices are available in Automotive Grade, AEC-Q101 qualified versions.

The latest package in Vishay’s Power DFN family, the DFN33A features a compact 3.3 mm by 3.3 mm footprint and an extremely low typical height of 0.88 mm, allowing the Vishay General Semiconductor rectifiers released today to make more efficient use of PCB space. Compared to the conventional SMB (DO-214AA) and eSMP series SMPA (DO-220AA), the package’s size is 44 % and 20 % smaller, respectively. In addition, the device’s low profile is 2.6x thinner than the SMB (DO-214AA) and SMC, and 7 % thinner than the SMPA (DO-220AA). At the same time, the rectifiers’ optimized copper mass design and advanced die placement technology allow for superior thermal performance that enables operation at higher current ratings.

The devices are intended for low voltage, high frequency inverters, DC/DC converters, freewheeling diodes, and polarity and rail to rail protection in hot swap circuits for baseband antennas and power over Ethernet (PoE) for switches, routers, and optical network equipment. For these applications, the rectifiers offer high temperature operation up to +175 °C, while their exceptionally low forward voltage drop and low leakage current enhance design efficiency. The wettable flanks of their DFN33A package allow for automatic optical inspection, eliminating the need for an X-ray inspection.

Ideal for automated placement, the rectifiers offer an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of 260 °C. The devices are RoHS-compliant and halogen-free, and their matte tin-plated leads meet the JESD 201 class 2 whisker test.

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The market for electric vehicles continues to gather pace with a strong volume growth of both battery electric vehicles and plug-in hybrid electric vehicles. The share of electric vehicles produced is expected to see double-digit growth by 2030 with a share of around 45 percent compared to 20 percent in 2024. Infineon Technologies AG is responding to the growing demand for high-voltage automotive IGBT chips by launching a new generation of products. Among these offerings are the EDT3 (Electric Drive Train, 3rd generation) chips, designed for 400 V and 800 V systems, and the RC-IGBT chips, tailored specifically for 800 V systems. These devices enhance the performance of electric drivetrain systems, making them particularly suitable for automotive applications.

The EDT3 and RC-IGBT bare dies have been engineered to deliver high-quality and reliable performance, empowering customers to create custom power modules. The new generation EDT3 represents a significant advancement over the EDT2, achieving up to 20 percent lower total losses at high loads while maintaining efficiency at low loads. This achievement is due to optimizations that minimize chip losses and increase the maximum junction temperature, balancing high-load performance and low-load efficiency. As a result, electric vehicles using EDT3 chips achieve an extended range and reduce energy consumption, providing a more sustainable and cost-effective driving experience.

“Infineon, as a leading provider of IGBT technology, is committed to delivering outstanding performance and reliability”, says Robert Hermann, Vice President for Automotive High Voltage Chips and Discretes at Infineon Technologies. “Leveraging our steadfast dedication to innovation and decarbonization, our EDT3 solution enables our customers to attain ideal results in their applications.”

The EDT3 chipsets, which are available in 750 V and 1200 V classes, deliver high output current, making them well-suited for main inverter applications in a diverse range of electric vehicles, including battery electric vehicles, plug-in hybrid electric vehicles, and range-extended electric vehicles. Their reduced chip size and optimized design facilitate the creation of smaller modules, consequently leading to lower overall system costs. Moreover, with a maximum virtual junction temperature of 185°C and a maximum collector-emitter voltage rating of up to 750 V and 1200 V, these devices are well-suited for high-performance applications, enabling automakers to design more efficient and reliable powertrains that can help extend driving range and reduce emissions.

“Infineon, as Leadrive’s primary IGBT chip supplier and partner, consistently provides us with innovative solutions that deliver system-level benefits,” said Dr. Ing. Jie Shen, Founder and General Manager of Leadrive. “The latest EDT3 chips have optimized losses and loss distribution, support higher operating temperatures, and offer multiple metallization options. These features not only reduce the silicon area per ampere, but also accelerate the adoption of advanced packaging technologies.”

The 1200 V RC-IGBT elevates performance by integrating IGBT and diode functions on a single die, delivering an even higher current density compared to separate IGBT and diode chipset solutions. This advancement translates into a system cost benefit, attributed to the increased current density, scalable chip size, and reduced assembly effort.

Infineon’s latest EDT3 IGBT chip technology is now integrated into the HybridPACK Drive G2 automotive power module, delivering enhanced performance and capabilities across the module portfolio. This module offers a power range of up to 250 kW within the 750 V and 1200 V classes, enhanced ease of use, and new features such as an integration option for next-generation phase current sensors and on-chip temperature sensing, contributing to system cost improvements.

All chip devices are offered with customized chip layouts, including on-chip temperature and current sensors.

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India is accelerating its semiconductor ambitions, aiming to secure 10% of global chip demand by 2030. Central to this strategy is the India Semiconductor Mission (ISM), launched in December 2022 with an allocation of ₹76,000 crore, designed to foster a sustainable semiconductor ecosystem and reduce reliance on imports.

In a significant development, Tata Electronics and Taiwan’s PSMC have announced a joint venture to establish India’s first 12-inch wafer fabrication facility in Dholera, Gujarat. With an investment of $11 billion, this project is expected to generate over 20,000 jobs and focus on manufacturing power management ICs, display driver ICs, microcontrollers, and high-performance computing logic components.

The 2025 budget reflects the government’s commitment, doubling the allocation for chip initiatives to ₹2,499.96 crore for FY26. This includes increased funding for compound semiconductors, sensors, and chip assembly/testing units, with a 56% rise to ₹3,900 crore, and nearly doubling the allocation for the design-linked incentive (DLI) to ₹200 crore.

Strategic partnerships with countries like Singapore, the US, Japan, and Taiwan are also being pursued to enhance technology transfer, skill development, and foreign direct investment. These efforts position India as a key player in the global semiconductor supply chain, aligning with the ‘China Plus One’ strategy amid evolving geopolitical dynamics.

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According to a recent report by NITI Aayog, the average cost of semiconductor chips in vehicles is projected to rise from $600 to $1,200 by 2030. This increase is attributed to the growing integration of advanced technologies in automobiles, such as electric powertrains, Advanced Driver Assistance Systems (ADAS), Internet of Things (IoT) connectivity, and autonomous driving capabilities. As vehicles become more connected and intelligent, the demand for sophisticated semiconductor chips escalates, leading to higher costs.

This trend signifies a broader transformation in the automotive industry, shifting from traditional fuel-based vehicles to electric vehicles (EVs) equipped with next-generation features. The incorporation of these technologies necessitates more complex and expensive semiconductor components, thereby increasing the overall cost per vehicle. The report underscores the pivotal role of electronics and semiconductors in modern vehicles, highlighting the need for the automotive sector to adapt to these technological advancements.

As India positions itself as a significant player in the global semiconductor market, this development presents both challenges and opportunities. The rising demand for high-tech components in vehicles underscores the importance of strengthening domestic semiconductor manufacturing capabilities to meet future needs.

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