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EU–India FTA: A Defining Moment for India’s Electronics and Semiconductor Industry

Втр, 02/03/2026 - 07:18

As global electronics and semiconductor supply chains are restructured for resilience and trust, the proposed EU–India Free Trade Agreement (FTA) is emerging as a pivotal opportunity for the Indian industry. More than a tariff-reduction exercise, the agreement has the potential to integrate India more deeply into Europe’s advanced electronics and semiconductor value chains. For India, the FTA represents a transition—from cost-driven manufacturing to value-driven, technology-led partnership.

The European Union is one of the world’s most quality-conscious electronics markets, with strong demand across automotive electronics, industrial automation, medical devices, power electronics, renewable energy systems, and telecom infrastructure. Under the EU–India FTA, reduced tariffs and streamlined regulatory frameworks will enhance the competitiveness of Indian electronics products.

Alignment on conformity assessment and technical standards will shorten qualification cycles and lower compliance costs, enabling Indian manufacturers to integrate directly into EU OEM and Tier-1 supply chains. As European companies pursue China-plus-one sourcing strategies, India stands to gain as a reliable and scalable manufacturing base.

India’s electronics industry has historically been assembly-led, but this is changing rapidly. Supported by policy incentives and growing design capabilities, Indian firms are expanding into PCB assembly, system integration, testing, and engineering services.

The EU–India FTA accelerates this shift by encouraging European OEMs to localise higher-value activities in India. Electronics manufacturing services (EMS) providers, component manufacturers, and design-led companies can leverage European partnerships to move beyond box build toward design-for-manufacturing, reliability engineering, and lifecycle management—key to long-term competitiveness.

Semiconductors are central to the EU–India technology partnership. The FTA aligns closely with India’s Semiconductor Mission and the EU Chips Act, creating a stable framework for collaboration across design, packaging, testing, and advanced manufacturing.

India’s strengths in chip design, embedded systems, and engineering talent complement Europe’s leadership in semiconductor equipment, materials, power electronics, and automotive-grade chips. Reduced barriers for capital equipment, technology transfer, and skilled workforce mobility can accelerate joint investments in OSAT, ATMP, and speciality semiconductor manufacturing.

This collaboration positions India as a trusted node in Europe’s semiconductor supply chain diversification efforts.

Beyond large fabs and design houses, the FTA creates opportunities for component and equipment suppliers. Demand for sensors, power modules, passive components, connectors, precision tooling, and clean-room equipment is expected to rise as European electronics and semiconductor companies expand operations in India.

Indian MSMEs operating in these segments can integrate into European Tier-2 and Tier-3 supply chains, benefiting from long-term sourcing contracts, technology upgrades, and exposure to global quality benchmarks.

The EU–India FTA also strengthens innovation linkages. Indian start-ups working in semiconductor IP, AI-enabled hardware, EV electronics, power electronics, and Industry 4.0 solutions will gain improved access to European R&D ecosystems, pilot customers, and funding platforms.

Europe’s strong IP regimes and industrial testbeds offer Indian deep-tech start-ups a credible pathway from development to global commercialisation.

Alignment with European technical, safety, and environmental standards will enhance the global credibility of Indian electronics and semiconductor products. Standards convergence reduces certification duplication, improves supplier trust, and increases acceptance across multiple export markets. For global buyers, this translates into confidence in Indian suppliers—an essential requirement in electronics and semiconductor sourcing.

The EU–India FTA arrives at a defining moment for the electronics and semiconductor industry. With effective execution, it can accelerate India’s shift from assembly-led operations to value-added manufacturing, design, and innovation. More importantly, it positions India as a strategic, trusted partner in global electronics and semiconductor supply chains—built on quality, resilience, and long-term collaboration.

Devendra Kumar
Editor

The post EU–India FTA: A Defining Moment for India’s Electronics and Semiconductor Industry appeared first on ELE Times.

Future-Proofing Bharat: India’s Multi-Billion Dollar AI Strategy Revealed

Пн, 02/02/2026 - 14:29

India is hosting the AI Impact Summit 2026 under the Ministry of Electronics and Information Technology, this month from February 16-20. The Summit has received a phenomenal response from across the world, and is shaping up to be the biggest such event so far globally, said Union Minister Ashwini Vaishnaw on Friday.

The summit week will feature around 500 curated events across Bharat Mandapam and Sushma Swaraj Bhawan. The AI Impact Expo will host over 840 exhibitors, including country pavilions, Ministries, State governments, industry, start-ups, and research institutions, showcasing AI solutions with proven real-world impact.

The conference has confirmed the participation of 15 Heads of State Government, more than 40 Ministers, over 100 leading CEOs and CXOs, and more than 100 eminent academics. Industry partners, including Jio, Qualcomm, OpenAI, Nvidia, Google, Microsoft, Adobe, and the Gates Foundation, are expected to participate in the event.

The Minister also informed that leading IT companies had developed over 200 focused and sector-specific AI models, expected to be launched during the upcoming summit. With investments worth nearly $70 billion already flowing into the AI infrastructure layer, the potential to double it by the conclusion of the event is exponential, he added. The AI talent pool is expected to be scaled up by extending infrastructure and industry-finalised curricula to 500 universities.

Budget Highlights for the AI Sector

Additionally, the government has proposed to focus on developing the AI landscape in India with specific provisions in the Union Budget 2026-27. As the focus shifts to building the digital infrastructure, the government has proposed an additional investment of USD 90 billion, specifically for the AI Data Centres and further encouraged long-term investments by proposing a tax holiday till 2047 for foreign companies providing cloud services to customers globally using data centre services from India. Such companies will provide services to Indian customers through an Indian reseller entity. Simultaneously, a safe harbour of 15 per cent on cost has also been proposed where the data centre service provider in India is a related entity.

The government has proposed several domains for AI integration in the Indian landscape: –

  • Governance: Serving as a force multiplier for improved public service delivery.
  • Supporting new technologies: Adopting new technologies in various sectors through the AI Mission and National Quantum Mission.
  • Labour market analysis: Assessing the impact of emerging tech such as AI on job roles and skill requirements.
  • Bharat-VISTAAR: A new multilingual AI tool designed for broader linguistic accessibility.
  • Agriculture: Integration with AgriStack portals and ICAR agricultural practice packages.
  • Healthcare & accessibility: R&D and integration into assistive devices for People with Disabilities manufactured by Artificial Limbs Manufacturing Corporation of India (ALIMCO).
  • Customs & security: Expanding non-intrusive scanning and advanced imaging for risk assessment.
  • Education: Embedding AI modules directly into the national education curriculum from school level onwards and for teacher training.
  • Professional development: Upskilling and reskilling programs for engineers and tech professionals.
  • Employment matching: AI-enabled platforms to connect workers with jobs and training opportunities.

India’s AI Landscape

Since 2020, the Artificial Intelligence (AI) start-up ecosystem in India has experienced rapid growth, with over 150 native AI start-ups having raised over $1.5 billion in funding as of September 2025.

As of early 2026, there are over 1,900 total AI companies in India, with 555 being funded. AI start-ups have touched several industries to provide a technically advanced perspective to the workings in the industry, from healthcare, agriculture, Aerospace & Defence, navigation, to education, manufacturing, banking, and E-commerce. Some notable start-ups include Sarvam AI, Krutrim, Observe.AI, Avaamo, Nanonets, and Atomicwork in the sector.

Global giants like IBM, Google, Microsoft, OpenAI, and Nvidia have established or expanded their R&D centres, engineering hubs, and regional offices in India to leverage the country’s vast tech talent pool and rapidly expanding digital economy. Domestic players like Perplexity has partners with telecom giants like Airtel to expand their reach. Simultaneously, Anthropic, the AI start-up backed by Google and Amazon, plans to open its first Indian office in Bengaluru in early 2026, focusing on AI tools and tapping into the local developer ecosystem.

Future of AI in India

The AI market is projected to reach $126 billion by 2030, with a long-term contribution of $1.7 trillion to India’s GDP by 2035.

These developments, coupled with the government’s initiative to boost the sector and focus on “Sovereign AI” to reduce dependency on foreign technology and build custom chips within 3-5 years, can position India as a formidable force in the sector of Artificial Intelligence globally, while the country already ranks third globally in AI competitiveness.

By: Shreya Bansal, Sub-Editor

The post Future-Proofing Bharat: India’s Multi-Billion Dollar AI Strategy Revealed appeared first on ELE Times.

Budget 2026-27: India Semiconductor Mission 2.0 Announced to Boost 3 nm & 2 nm technology nodes in India

Пн, 02/02/2026 - 14:28

The Union Budget 2026-27 outlines the continuation of India’s deep commitment to the domestic semiconductor ecosystem, aiming to promote it to new heights. Union Finance Minister Smt Nirmala Sitharaman, in the Union Budget 2026-27, announces the launch of India Semiconductor Mission 2.0 (ISM 2.0).  It will be a continuation of the earlier ISM 1.0 with a realigned goal to produce equipment and materials, design full-stack India IP, and solidify supply chains, a milestone for the technology sector. ‘This time the mission carries a broad mandate to enable the next level of India’s electronic stride into products and more IPs, precisely. 

“ISM 1.0 expanded India’s semiconductor sector capabilities. Building on this, we will launch ISM 2.0 to produce equipment and materials, design full‑stack Indian IP, and fortify supply chains. We will also focus on industry‑led research and training centres to develop technology and a skilled workforce,” she said.

Upgrading India’s Semiconductor Ecosystem 

Shri Ashwini Vaishnaw, Union Minister of Railways, Electronics and Information Technology, said that the Budget has announced the launch of India Semiconductor Mission (ISM) 2.0, building upon the strong foundation created under ISM 1.0, which established a completely new and foundational semiconductor industry in India.

ISM 2.0 will focus on designing and manufacturing semiconductor equipment in India, manufacturing of materials used in semiconductor production, creation of a large design ecosystem, and further strengthening of talent development initiatives. A provision of Rs. 1,000 crore has been made for ISM 2.0 for FY 2026-27.

Support for Fabless Startups 

The mission launch finds mention in the Budget 2026-27 with a fresh outlay of ₹1,000 crore allocation in the BE fiscal 2027. Vaishnaw said recently that the government plans to support at least 50 fabless chip companies in ISM 2.0 by scaling up the Design Linked Incentive Scheme, with the long-term goal of producing “one AMD” and “one Qualcomm” from India.

“The Union Budget 2026–27 charts a decisive course for India’s evolution into a global technology leader. The enhanced capital outlay of ₹12.2 lakh crore and the launch of the India Semiconductor Mission 2.0 reaffirm the government’s commitment to deep-tech indigenization,” says Mr. Meenu Singhal, Regional Managing Director, Socomec Innovative Power Solutions. 

Talking about the budget Mr Pankaj Mohindroo, Chairman, ICEA, says, “Budget 2026–27 reinforces the government’s commitment to manufacturing-led growth, particularly in electronics and semiconductors, through continuity, scale, and targeted reforms. Measures such as the expansion of ECMS, support for ISM 2.0, and long-term incentives for cloud and data infrastructure send a strong signal of strategic intent and policy stability. 

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Caliber Interconnects Achieves ARAI Certification for EV Charging Solutions, Strengthening India’s Indigenous EV Infrastructure

Пн, 02/02/2026 - 14:22

Caliber Interconnects Private Ltd., a leading Indian engineering and deep-tech solutions company, today announced that its electric vehicle (EV) charging portfolio has been awarded ARAI certification, marking a significant milestone in the company’s journey to deliver reliable, safe, and future-ready charging infrastructure for India’s rapidly evolving mobility ecosystem.

The certification from the Automotive Research Association of India (ARAI) validates Caliber’s adherence to stringent national standards for safety, performance, and environmental compliance—benchmarks critical to the Indian automotive and EV industries.

“This milestone goes far beyond a certificate—it’s a clear signal of our engineering depth and long-term commitment to India’s EV future,” said Suresh Babu, Founder & CEO, Caliber Interconnects.  “ARAI certification reinforces our belief that India deserves globally competitive EV charging solutions that are designed, manufactured, and supported locally. At Caliber, we are building high-performance charging systems that the ecosystem can depend on—not just today, but for the decade ahead.”

A Comprehensive, ARAI-Certified EV Charging Portfolio

Caliber Interconnects offers one of the industry’s most versatile EV charging portfolios, addressing residential, commercial, fleet, and public charging needs:

  • AC Chargers: 3.3 kW | 7.4 kW | 22 kW
  • Hybrid Chargers: 30 kW DC + 22 kW AC
  • DC Fast Chargers: 30 kW | 60 kW | 120 kW | 240 kW
  • Two-Wheeler DC Chargers: 3 kW | 6 kW

All chargers are powered by Cogency, Caliber’s intelligent smart-charging platform engineered for real-time monitoring, predictive maintenance, and optimized charger performance.

Intelligent, Scalable, and Standards-Compliant

Cogency is OCPP 1.6 and 2.0.1 compliant and supports both Android and iOS, enabling seamless system integration, remote management, and scalable deployments across diverse charging networks. The platform is designed to meet the operational demands of utilities, charge point operators, OEMs, and infrastructure developers.

With ARAI certification, Caliber’s EV chargers meet the highest standards expected by India’s automotive industry—ensuring safety, durability, and environmental responsibility across operating conditions.

Designed in India. Built for Scale.

At a time when the market is saturated with imported EV chargers, Caliber Interconnects is championing locally manufactured, future-ready solutions that reduce dependency, improve serviceability, and strengthen India’s EV value chain.

Whether supporting immediate deployments or long-term infrastructure planning, Caliber’s charging solutions are engineered to scale alongside the growing demands of India’s EV and clean-energy ecosystem.

The post Caliber Interconnects Achieves ARAI Certification for EV Charging Solutions, Strengthening India’s Indigenous EV Infrastructure appeared first on ELE Times.

ICEA Welcomes Budget 2026–27’s Focus on Manufacturing, Flags Key Structural Gaps

Пн, 02/02/2026 - 13:58

India Cellular and Electronics Association (ICEA) said that the Union Budget 2026–27 adopts a steady and largely inclusive approach, reinforcing India’s manufacturing and technology ecosystem through policy continuity, scale, and targeted reforms.

The sustained focus on electronics manufacturing, the launch of India Semiconductor Mission (ISM) 2.0, and the significant expansion of the Electronics Component Manufacturing Scheme (ECMS) reaffirm the government’s long-term commitment to building resilient domestic supply chains and strengthening India’s position in global value chains.

ICEA also welcomed the announcement of a tax holiday till 2047 for foreign companies offering global cloud services using India-based data centres, describing it as a forward-looking measure that provides long-term policy certainty, anchors global digital infrastructure in India, and enhances the country’s credibility as a trusted hub for data, cloud, and AI-led services. Long-term predictability, as provided in this measure, will be a sure win for our nation.

Additional measures, such as the five-year income tax exemption for foreign suppliers of capital equipment in bonded zones, the Safe Harbour framework for non-resident component warehousing, customs decriminalisation, and extended validity of advance rulings, are expected to improve ease of doing business, reduce compliance friction, and strengthen investor confidence.

However, ICEA noted that there are a few unfinished businesses. Inverted duty structures across capital equipment, display assemblies, inductors, FPCA, MICs, receivers, speakers, and specialised inputs continue to impact cost competitiveness. Partial progress on MOOWR reforms, limited clarity on tax-neutral VMI models, and residual uncertainty around Permanent Establishment (PE) exposure for foreign-owned capital equipment remain constraints to faster scale-up.

Commenting on the Budget, Mr. Pankaj Mohindroo, Chairman, ICEA, said: “Budget 2026–27 reinforces the government’s commitment to manufacturing-led growth, particularly in electronics and semiconductors, through continuity, scale, and targeted reforms. Measures such as the expansion of ECMS, support for ISM 2.0, and long-term incentives for cloud and data infrastructure send a strong signal of strategic intent and policy stability.

“At the same time, key structural issues, especially inverted duty structures, unfinished MOOWR reforms, and tax-related uncertainties, need timely resolution to ensure cost competitiveness and speed of execution,” Mr. Mohindroo added.

ICEA Chairman further stated that the exponential growth in mobile manufacturing has clearly demonstrated what bold and consistent policy measures can achieve. “To replicate this success across sectors and move towards 25% of GDP through manufacturing, the National Manufacturing Mission is a need of the nation, enabling the ecosystem to truly fire on all cylinders,” he said.

ICEA reiterated its commitment to working closely with the government and stakeholders to support policy implementation and accelerate India’s journey towards becoming a globally competitive electronics manufacturing hub.

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Enabling the Road to 6G: How Rohde & Schwarz Is Shaping the Future of Wireless Networks

Пн, 02/02/2026 - 13:02

Senior leaders from Rohde & Schwarz shared their perspectives with Kumar Harshit, Technology Correspondent at ELE Times, on the evolving wireless landscape, discussing the transition from 5G to 6G and the technologies shaping next-generation networks. The conversation focused on rising network complexity and the growing importance of intelligent test and measurement solutions.

The conversation was enriched by insights from Simon Ng, Sales Director – Mobile Network Testing (Asia Pacific), R&S Regional Headquarters, Singapore; Alexander Pabst, Vice President – Market Segment Wireless Communication, R&S GmbH & Co. KG, Germany; and Mahesh Basavaraju, Market Segment Manager – Wireless Communication, R&S India Pvt. Ltd.

Together, the leaders shared a cohesive outlook on key enablers of future networks, including advanced test and measurement methodologies, AI-native and AI-assisted networks, non-terrestrial and satellite integration, the emergence of Wi-Fi 8, and India’s expanding role as a critical hub for telecom R&D and innovation.

Here are the excerpts from the conversation: 

ELE Times: How does Rohde & Schwarz view localization, particularly in manufacturing and equipment development in India?

R&S:  Rohde & Schwarz develops global technologies for a global market. Rather than localizing products in isolation, we operate through a unified global development model. India plays a key role in this framework.

We have over 200 engineers in India who contribute directly to our global R&D efforts. The solutions developed through this collaboration are deployed worldwide, including in India. In that sense, India is deeply integrated into our global innovation ecosystem.

ELE Times: As the industry transitions from 5G toward 6G, how is Rohde & Schwarz positioning itself?

R&S:  Connectivity is no longer limited to consumer communication; it is becoming core infrastructure for industry and society. While 5G has enabled private networks, industrial IoT, and enterprise use cases, 6G will take this further.

With 6G, we expect higher operating frequencies, native integration of non-terrestrial networks such as satellites, network sensing capabilities, and deeper convergence of AI, XR, and communication technologies. Our role is to enable this entire ecosystem—on both the network and device sides—through advanced test, measurement, and validation solutions, from early research to commercialization.

ELE Times: What are the defining technology pillars you associate with 6G?

R&S:  Three pillars stand out clearly. First is ubiquitous connectivity, where satellite communication becomes a native part of the network rather than an add-on. Second is immersive and intelligent experiences driven by the convergence of XR, AI, and sensing technologies. Third is energy and spectrum efficiency, which will be critical to ensure sustainability as network capacity and complexity continue to grow.

ELE Times: Rohde & Schwarz is known for working in the pre-market phase. How early are you involved in new technology development?

R&S:  Very early. Typically, we operate three to five years ahead of commercial deployment. Our responsibility is to translate high-level visions—such as holographic communication or pervasive sensing—into concrete, testable technical requirements.

This includes supporting evolving standards, advances in massive MIMO, AI-driven air interfaces, integrated sensing and communication (ISAC), and next-generation antenna systems. We work closely with industry players to ensure these technologies are testable and reliable long before they reach the market.

ELE Times: Wi-Fi 8 is emerging alongside cellular evolution. Why is Wi-Fi 8 important?

R&S:  Wi-Fi 8 is less about peak data rates and more about reliability, coordination, and scalability. One key improvement is the ability of access points to coordinate spectrum usage among themselves, significantly reducing interference.

It also enhances mesh networking, improves spectrum efficiency, and allows a single cell to serve more users reliably. While there may be incremental increases in bandwidth, the real value lies in better-managed spectrum and consistent user experience.

ELE Times: Can you highlight some recent breakthroughs in test and measurement technologies?

R&S:  One important area is testing XR and AI applications over wireless networks. Unlike wired connections, wireless networks introduce latency, fading, congestion, and other impairments that directly affect performance. Our platforms can simulate these real-world conditions to validate application behavior accurately.

Another breakthrough is in base station testing. Traditionally, this required large racks of individual instruments. We have introduced compact, fully integrated base station testers that are cost-efficient, reliable, and well-suited for production environments.

We have also developed solutions for millimeter-wave Wi-Fi, particularly relevant to India, and advanced test setups for non-terrestrial networks, including satellite-based communication.

ELE Times: How do you assess India’s progress after its rapid nationwide 5G rollout?

R&S:  India’s progress has been remarkable. Network quality, coverage, and speed have improved dramatically in a short time. More importantly, India is no longer content with being a fast follower.

There is a strong national ambition to be at the forefront of 6G, supported by government funding, research programs, and industry collaboration. We are actively supporting this journey by working closely with Indian operators, OEMs, startups, and academic institutions.

ELE Times: What role does Rohde & Schwarz play in India’s 6G and R&D ecosystem?

R&S:  We are actively engaged with the Bharat 6G Alliance and contribute across multiple working groups covering technology, spectrum, and use cases. Our role is to bring global experience into Indian research programs and testbeds.

India has set ambitious goals around creating domestic intellectual property for 6G. We already see strong innovation emerging from Indian universities and startups, particularly in areas such as massive MIMO and AI-driven networks, and we support them with advanced validation and measurement platforms.

ELE Times: What are the key challenges in pre-silicon testing and validation?

R&S:  One major challenge has been early-stage testing. Historically, this required complex hardware simulators and tightly synchronized physical interfaces. We have now shifted toward software-based testing using IQ-over-IP, enabling validation at a much earlier stage.

Another important shift is continuous integration, where software can be repeatedly tested in pre-silicon environments before being committed to hardware. This significantly accelerates development cycles.

We are also simplifying automation by moving from traditional programming approaches to Python-based workflows and introducing AI-assisted scripting, allowing engineers to define complex tests using natural language.

ELE Times: AI is becoming central to telecom systems. How does Rohde & Schwarz approach AI?

R&S:  From a telecom perspective, AI can be broadly categorized into AI on RAN, AI for RAN, and AI and RAN. Our primary focus is AI for RAN, where AI is used to optimize network performance.

AI introduces many new variables, making performance validation more complex. Our focus is on enabling fair, repeatable, and meaningful testing. Internally, we see AI as a powerful enabler rather than a replacement for engineers. The engineer remains at the center of decision-making, with AI enhancing efficiency, automation, and insight.

ELE Times: Finally, how do you see India shaping the global 6G ecosystem?

R&S:  India brings together scale, talent, a vibrant startup ecosystem, and strong policy support. What is particularly striking is the density of innovation and risk-taking startups, supported by government initiatives.

With sustained investment in research, testbeds, and global collaboration, India is well-positioned to influence global 6G standards and deployments. We expect India to play a significant role in shaping the future of wireless communication worldwide.

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Union Budget 2026-27: ECMS Gets a budgetary Outlay of Rs 40,000 Crore, Big boost to Components Manufacturers in India

Пн, 02/02/2026 - 12:52

The Union Budget 2026-27 presented in the parliament on 1st February, 2026, allocates Rs 40, 000 crore to the Electronics Components Manufacturing Scheme (ECMS) launched last year in April. With a proposed budgetary outlay of around Rs 40,000 Crore for the Electronics Components & Manufacturing Scheme (ECMS), as compared to the previous outlay of  Rs 22,919 crore during its launch in April 2025, the government intends to ensure that India’s electronics components game goes up globally. The outlay is being doubled even as the scheme “already has investment commitments at double the target,” and the near-doubling of the outlay will “capitalise on the momentum,” she says. 

The increased budgetary outlay will highly benefit the electronics sector in India as it aims to promote the domestic manufacturing of electronics components that the nation really needs at this time, so as to become the real electronics hub globally. It promotes the manufacturing of Printed Circuit Boards (PCBs), lithium-ion Cells and other necessary electronics components used in modern-day devices ranging from mobile phones to automobiles. 

Commitment to Mnaufacturing-led Growth 

Commenting on the Budget, Mr. Pankaj Mohindroo, Chairman, ICEA, says, “Budget 2026–27 reinforces the government’s commitment to manufacturing-led growth, particularly in electronics and semiconductors, through continuity, scale, and targeted reforms.”India Cellular & Electronics Association (ICEA) is India’s apex industry body representing the entire mobile and electronics ecosystem. “Measures such as the expansion of ECMS, support for ISM 2.0, and long-term incentives for cloud and data infrastructure send a strong signal of strategic intent and policy stability,” he adds. 

The EMS Component in GDP to Increase 

The intent behind the budgetary outlay speaks volumes about the government’s vision for the electronics industry. Talking about this very thing, Mr Jasbir Singh, Executive Chairman and CEO, Amber Enterprises, welcomes the governmnet’s decision to increase the budgetary outlay. He says,” Cementing this further, the decision to establish high-tech tool rooms to manufacture high-precision components at scale and lower cost will propel India to become self-reliant and globally competitive.” 

He also commends the government’s decision to rejuvenate  200 legacy industrial clusters, which will boost the EMS sector tonexponential growth. He adds,” These policies will increase the EMS contribution to the GDP, expected to be the third-largest.” 

A Mighty Scheme

The scheme has approved 46 projects so far, attracting cumulative investments of ₹54,567 crore, with projected production valued at ₹3.68 trillion and the creation of over 50,000 direct jobs. Notified with a six-year budgetary outlay of ₹22,919 crore, the scheme envisages a total production of ₹10.34 lakh crore and employment generation for nearly 142,000 people. It is designed to lay the groundwork for a $500-billion electronics manufacturing ecosystem by 2030–31.

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 Microchip Expands its Arm Cortex-M0+ Portfolio with PIC32CM PL10 MCUs

Пн, 02/02/2026 - 11:33

Building on decades of experience in serving embedded applications where low power, affordability and ease of development are critical, Microchip Technology has added PIC32CM PL10 MCUs to its PIC32C family of Arm Cortex-M0+ core devices. PL10 MCUs feature a rich set of Core Independent Peripherals (CIPs), 5V operation, touch capabilities, integrated toolsets and safety compliance. The device family targets high-volume applications including industrial control, building automation, consumer appliances, power tools and sensor-based systems. As part of the company’s unified MCU strategy, PL10 devices offer pin-to-pin compatibility with AVR MCUs.

The integrated Peripheral Touch Controller (PTC), along with a 12-bit Analogue-to-Digital Converter (ADC) are designed to provide responsive performance in touch applications and strong noise immunity for analogue signal measurement. Additional on-chip CIPs help offload time-critical, repetitive and deterministic tasks from the CPU to improve real-time performance and power efficiency. The PL10 supports the Cortex Microcontroller Software Interface Standard (CMSIS), enabling the development of modular, reusable application code to accelerate the process.

In addition to support from Microchip’s MPLAB development ecosystem, the PL10 family incorporates industry-standard tools and integrated development environments (IDEs), providing developers with more flexibility in how they build, debug, and deploy their software. Compatible third-party tools include Microsoft Visual Studio Code (VS Code), IAR Systems, Arm Keil, SEGGER, Zephyr and MikroElektronika. AI-driven resources such as the MPLAB AI Coding Assistant offer context-aware code generation and real-time product insights to help accelerate and simplify development.

“PL10 MCUs help engineers more easily migrate to higher performance microcontrollers while maintaining the straightforward development experience, power efficiency and cost structure of our established 8-bit solutions,” said Greg Robinson, corporate vice president of Microchip’s MCU business unit. “As we prepare to introduce a range of new microcontrollers over the next 12-18 months, with everything spanning entry-level to AI-capable devices, Microchip is strengthening its commitment to a comprehensive MCU portfolio designed to meet evolving market demands.”

The PL10 family is designed to comply with various industry safety standards, including International Organisation for Standardisation (ISO) 26262 for functional safety in electrical and electronic systems of road vehicles. Additionally, the MCUs are designed to operate from 1.8 to 5.5 volts, supporting performance in high-noise environments such as automotive, IoT, industrial automation and consumer electronics applications. PL10 MCUs enable simultaneous connection to devices operating at different voltage levels without external level shifters using the integrated Multi-Voltage I/O (MVIO).

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Vishay Intertechnology’s 1200 V SiC MOSFET Power Modules for Power Efficiency

Птн, 01/30/2026 - 12:37

Vishay Intertechnology, Inc. has introduced five new 1200 V MOSFET power modules designed to increase power efficiency for medium to high frequency applications in automotive, energy, industrial, and telecom systems. The Vishay Semiconductors VS-SF50LA120VS-SF50SA120VS-SF100SA120VS-SF150SA120, and VS-SF200SA120 feature Vishay’s latest generation silicon carbide (SiC) MOSFETs in the industry-standard SOT-227 package.

Offered in single switch and low side chopper configurations, each power module released today features a SiC MOSFET integrated with a soft body diode offering low reverse recovery. The result is reduced switching losses and increased efficiency for solar inverters, off-board chargers for electric vehicles (EV), SMPS, DC/DC converters, UPS, and HVAC systems; large-scale battery storage systems, and telecom power supplies.

The compact SOT-227 package of the VS-SF50LA120, VS-SF50SA120, VS-SF100SA120, VS-SF150SA120, and VS-SF200SA120 allows the devices to serve as drop-in replacements for competing solutions in existing designs, enabling designers to adopt one of the newest SiC technologies without the expense of changing PCB layouts. The moulded package also offers electrical insulation up to 2500 V for one minute, lowering costs by eliminating the need for additional insulation between the component and heatsink.

The power modules provide continuous drain current from 50 A to 200 A and low on-resistance down to 12.1 mΩ. The RoHS-compliant devices deliver high-speed switching with low capacitance and offer a high maximum operating junction temperature of +175 °C.

Device Specification Table:

Part #

VDSS

ID

RDS(ON)

Configuration

Package

VS-SF50LA120

1200 V

50 A

43 mΩ

Low side chopper

SOT-227

VS-SF50SA120

50 A

47 mΩ

Single switch

VS-SF100SA120

100 A

23 mΩ

Single switch

VS-SF150SA120

150 A

16.8 mΩ

Single switch

VS-SF200SA120

200 A

12.1 mΩ

Single switch

Samples and production quantities of the VS-SF50LA120, VS-SF50SA120, VS-SF100SA120, VS-SF150SA120, and VS-SF200SA120 are available now, with lead times of 13 weeks.

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Budget 2026-27: Can New PLI Schemes Drive India’s A&D Tech Sovereignty?

Птн, 01/30/2026 - 12:05

As the Union Budget approaches, the spotlight intensifies on India’s aerospace and defence technology sector, a vertical that has transitioned from a heavy importer to a nascent global manufacturing hub. The numbers tell a story of aggressive scaling: under the aegis of “Atmanirbhar Bharat,” domestic defence production surged to a historic ₹1.27 lakh crore in FY 2023-24.

However, for an industry eyeing a $5 trillion economy, this record high is viewed not as a finish line, but as a baseline. The shift toward indigenous manufacturing has fundamentally rewired the nation’s military-industrial complex, replacing foreign dependency with homegrown R&D and high-tech sovereignty. As the government prepares to lay out its fiscal roadmap, the industry is looking for more than just procurement orders; it is looking for deep-tech incentives, streamlined export pathways, and sustained capital outlay.

This budget will be a litmus test for India’s self-reliance commitment. Stakeholders are bracing for announcements that could further catalyse the aerospace ecosystem, ensuring that “Made in India” weaponry and avionics don’t just meet internal security needs but become a cornerstone of India’s global economic footprint.

The Tech-Sovereignty Mandate

As the lines between commercial innovation and battlefield superiority blur, technology has emerged as the definitive fulcrum for India’s tri-service modernisation. Industry experts argue that the upcoming Budget presents a pivotal window to institutionalise this convergence through aggressive structural reforms.

Central to this discourse is the evolution of the Production Linked Incentive (PLI) Scheme. While the current framework has provided a vital tailwind for the drone industry, there is a growing consensus that a “narrow-lens” approach is no longer sufficient. To truly insulate India’s supply chain from global volatility, the PLI umbrella must expand to cover the high-stakes world of dual-use technologies.

In terms of using technology in aerospace and defence technology development, the use of AI and related features will play a significant role.

“Investing in digital twins and simulation technology for testing and research in aviation and defence can boost precision and efficiency in the electronic manufacturing industry. Tecknotrove urges the government to prioritize use of digital twin technology in this financial budget. It’s a strategic move that will amplify innovation, save research and development and manufacturing costs, and drive India’s self-reliance in manufacturing. Digital twins aren’t just a trend—they’re a game-changer. With decades of expertise in digital twins for aviation and defence, we have seen this technology helping in at least 30% reduction in costs,” says Payal Gupta, Co-Founder, Director-Business Development, Tecknotrove Systems India Pvt. Ltd. 

The strategic roadmap for the FY 2026-27 fiscal cycle should ideally prioritise:

  • The Full Drone Spectrum: Moving beyond basic assembly to incentivise the manufacturing of high-endurance propulsion systems and autonomous flight controllers.
  • Electronic Warfare & Surveillance: Bringing Airborne Early Warning (AEW) systems, jamming devices, and advanced radar arrays under the incentive net to neutralise import dependencies.
  • The Robotics Frontier: Providing fiscal stimulus for indigenous sensors and robotic systems that will define the future of unmanned combat and deep-space communication.

By widening these incentive corridors, the government can transform the “Make in India” initiative from a manufacturing slogan into a high-tech powerhouse, ensuring that the next generation of aerospace sensors and AI-driven robotics are conceived, designed, and built on Indian soil.

By: Shreya Bansal, Sub-Editor

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How to Build a Hacker-Proof Car: Insights from the Auto EV Tech Summit

Птн, 01/30/2026 - 11:14

Speaking at the Auto EV Tech Vision Summit 2025, Suresh D highlights the major cyber vulnerabilities and the corresponding technologies required to enable a safer and more resilient automotive ecosystem. 

Since the electronic components in passenger vehicles are set to increase by 20-40 percent, as the recent studies suggest, including infotainment, ADAS, etc, drawing in a lot of sensors in the near future, automobiles are emerging as the new battlefield for cyber developments. Underlining this growing phenomenon, Suresh D, Group CTO, Minda Corporation, CEO, Spark Minda Tech Centre & Board Member, Spark Minda Green Mobility says, “A passenger vehicle is expected to see a 20–40 percent increase—nearly doubling in some cases—over the next two to three years, bringing in a large number of on-board electronic systems. This will significantly increase software content and complexity,” at the Auto EV Tech Vision Summit 2025 held at KTPO, Bengaluru, on November 18–19, 2025.

He further goes on to add that the phenomenon will make Operating Systems and other software indispensable, escalating the security question in automobiles. 

Critical Challenges on the way 

He says that the new architectural parameter of SDVs, where the distributed architecture is being replaced by controlled or zonal architecture, also poses certain security challenges. Also, as the new vehicles remain entirely connected, as in V-2-V or V-2-I connection, the proximity of cyber risks escalates. 

Further, he touches upon the critical challenges that are to be tackled, including phishing, hacking, snooping, malware, etc. He goes on to underline some of the crucial cyberattacks that the automotive industry has seen in the recent past, ranging from CAN spoofing a Jeep Cherokee in 2014 to the latest TESLAMATE attack on Tesla cars in 2025, underlining how the question of cybersecurity becomes more relevant than ever. 

Curious Case of SDVs & EVs 

As EVs are on the rise across the world, Suresh D highlights how EV expansion and the need for robust charging systems also aggravate the risk. He explains that if a charging station compromises a supplier’s build server, it can be manipulated to tamper with BMS parameters via a compromised internal bus or a malicious charging station.

While for SDVs, potential risk sources he underlines include attack scenarios ranging from unprivileged root access and pivoting through fleet management backends, to compromised third-party apps and poorly protected cryptographic keys.

How to Tackle this? 

In the latter part, he touches upon the important steps that can be taken to avoid the potential risks and create a safer and reliable cyber ecosystem for automotives. First among them is the System Architecture approach. He says, “It refers to developing a robust architecture—understanding the OEM’s architecture and aligning the product accordingly.” He sums it up as thinking way ahead of the OEMs. It also includes encryption and decryption of the hardware to ensure that no vulnerability remains open to exploitation. 

Further, he also outlines a distinct approach, which is Embedded Edge Solutions, which means solving the problem at the source. It includes several protections, including secure flashing and secure boot. This is done through the plant server of the OEM that generates distinct private keys for each of the units for further authorization.  

For SDVs, he highlights a telematics-based approach which consists of 3 layers, namely Layer 1- In-vehicle security, Layer 2- Vehicle Communication Security & Layer 3- The cloud infrastructure. When Internet Protocol is used for communication, it enables whitelisting of the IPs through encryption and decryption through SSL, enabling a better and safer environment. 

High Frequency Options:  Granting More Immunity

He also underlines how automobiles these days usually come with smart keys or keyless access to the vehicle. While the technology is referred to as Low-Frequency Radio Frequency (LFRF), it is immune to relay attacks. However, the industry is gradually moving towards safer and more reliable options like Bluetooth and Ultra Wide Bandgap (UWB), with high-frequency technology making decoding highly difficult.   

He adds that even these technologies are prone to cyberattacks, either at the server level or the device level. Conclusively, some techniques like channel sounding with Bluetooth-based technology have been developed, which are more precise and help make authentication more secure. It offers a turnkey secure foundation, making automobiles reliable and secure. 

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Palo Alto Networks Unifies Observability and Security for the AI Era through Chronosphere Acquisition

Птн, 01/30/2026 - 08:38

As enterprises increasingly rely on AI to run digital operations, protect assets, and drive growth, success depends on one critical factor: trusted, high-quality, real-time data. Palo Alto Networks, the global cybersecurity leader, announced the completion of its acquisition of Chronosphere, addressing a core challenge of the AI era: the inability to see and secure the massive data volumes running modern businesses.

Chronosphere, a Leader in the 2025 Gartner Magic Quadrant for Observability Platforms, was purpose-built to handle this scale. While legacy tools break down in cloud-native environments, Chronosphere gives customers deep visibility across their entire digital estate. With this acquisition, Palo Alto Networks is redefining how organisations run at the speed of AI—by enabling customers to gain deep, real-time visibility into their applications, infrastructure, and AI systems — while maintaining strict control over data cost and value.

The planned integration of Palo Alto Networks Cortex AgentiX with Chronosphere’s cloud-native observability platform will allow customers to apply AI agents that can now find and fix security and IT issues automatically—before they impact the customer or the bottom line. AI security without deep observability is blind; this acquisition delivers the essential context across models, prompts, users, and performance to move from manual guessing to autonomous remediation.

Nikesh Arora, Chairman and CEO, Palo Alto Networks:

“Enterprises today are looking for fewer vendors, deeper partnerships, and platforms they can rely on for mission-critical security and operations. Chronosphere accelerates our vision to be the indispensable platform for securing and operating the cloud and AI. We believe that great security starts with deep visibility into all your data, and Chronosphere provides that foundation for our customers.”

Martin Mao, Co-founder and CEO, Chronosphere, is joining Palo Alto Networks as SVP, GM Observability and comments:

“Chronosphere was built to help the world’s most complex digital organisations operate at scale with confidence. Joining Palo Alto Networks allows us to bring AI-era observability to a global audience. Together, we’re delivering a new standard — where observability, security, and AI come together to give organisations control over their most valuable asset: data.”

The Chronosphere Telemetry Pipeline remains available as a standalone solution, enabling organisations to eliminate the ‘data tax’ associated with modern security operations. By acting as an intelligent control layer, the pipeline filters low-value noise to reduce data volumes by 30% or more while requiring 20x less infrastructure than legacy alternatives. This is key to Palo Alto Networks Cortex XSIAM strategy, ensuring customers can scale their security posture—not their spending—as they transition to autonomous, AI-driven operations.

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Spectral Engineering and Control Architectures Powering Human-Centric LED Lighting

Чтв, 01/29/2026 - 14:26

As technological advancements continue to pursue personalisation & customisation at every level, illumination has also transformed from a need to a customisation. Consequently, the LED industry is moving towards a similar yet prominent stride, making customised and occasion-specific solutions, keeping in consideration the human behaviour and lighting changes across the day. Long seen as the constant and uniform thing, illumination is now being reimagined as something dynamic and customisable.  

In the same pursuit, the industry has moved towards enabling Human-Centric Lighting(HCL), where lighting is designed and engineered to emulate natural daylight, ranging from dimming them as the Sun goes down, while brightening up as the day begins. Gradually, illumination is now being designed around human biology, visual comfort, and cognitive performance rather than simple brightness or energy efficiency. 

But what lies behind this marvel is hardcore engineering. Technically, the result is made possible by the marvels of spectral engineering & control architectures, wherein the former adjusts the light spectrum while the latter enables the intelligence directing the timing changes of the lighting system. Simultaneously, the dual play brings forth today’s human-centric lighting into real-life examples and is also making them more customised and personalised. This ultimately helps in supporting human circadian rhythms, enhancing well-being, mood, and performance. 

To enable these engineered outcomes, embedded sensors, digital drivers, and networked control platforms are integrated into the modern-day LED lights, transforming illumination into a responsive, data-driven infrastructure layer. In combination, spectral engineering and intelligent control systems are reshaping the capabilities of LED lighting, transforming it from a passive utility into a dynamic, precision-engineered tool for enhancing human wellbeing, productivity, and performance.

How is Spectral Power Distribution engineered? 

When we talk about LED lights, white light is the first thing that comes to our minds. Although the same is not true scientifically. Surprisingly, LEDs inherently emit blue light and not white. To turn the blue light into white, a Phosphor coating is applied over it. Consequently, the blue light mixes with the phosphor to turn some of the light into green, red & yellow simultaneously. These lights eventually mix to turn white.

Spectral Power Distribution (SPD) is simply the profile of the white colour which is not visible to our naked eyes, and how much of each colour is present in the visible white light. The final light can be controlled by various means, such as the type of phosphor, how thick the phosphor layer is, or by adding extra coloured LEDs (like red or cyan). 

Spectral Power Distribution is engineered by carefully mixing different colours of light inside an LED, even though it looks white, so that the light feels right for the human body and mind. 

Engineering the Spectral Power Distribution of White LEDs

Often, it is seen that the very same white light is sometimes harsh while sometimes soft- all this is because of various variables. Today, from being a static character, SPD has turned into a tunable design parameter,++ becoming a Controllable Design Variable. To this effect, SPD is largely controlled by Phosphor composition (which colours it emits), Particle size and density, and finally Layer thickness and distribution. 

That’s why the same 400K LEDs from different manufacturers can feel completely different — their SPDs are different, even if the Correlated Color Temperature (CCT) is the same. But as long as the final color is decided by some application made during manufacturing, the effect remains static. While spectral Power distribution is essential, it is equally important to dictate the given behaviour as per the time of the day.

Multi-Channel LED Configurations for Spectral Tunability

To enable a real-time nature to this Spectral tunability, engineers today use multiple LED channels, including: 

  • White + Red
  • White + Cyan
  • RGBW / RGBA
  • Tunable white (warm white + cool white)

By precisely varying the current supplied to each LED channel, the spectral power distribution can be reshaped in real time, allowing the system to shift between blue-enriched and blue-reduced lighting modes as required. This level of control allows you to adjust the perceived colour temperature independently of the light’s biological impact, rather than having them locked together. As a result, SPD is no longer a fixed characteristic of the light source but becomes a dynamic, real-time controllable design parameter.

Melanopic Response, Circadian Metrics, and Spectral Weighting

When we talk about light, visibility & brightness make up the primary issue, but that has changed drastically with the emergence of Human Centric Lighting (HCL). With HCL coming into play, photopic lux, the quantification of brightness, is no longer a go-to metric to decide upon the quality of lighting. It is because it explained only one part of the coin, which is visibility, and not how this light or visibility affects human biology. 

At the same time, Human Centered Lighting focuses on how light affects the circadian system, alertness, sleep–wake cycles, mood, and hormonal regulation. This phenomenon has brought up new metrics that tell us not only about the brightness or visibility, but also how it biologically acts.  One such metric is Melanopic Lux, which weights the spectrum based on melanopsin sensitivity. Melanopsin is a photopigment in our eyes, usually sensitive to Blue-Cyan light.  

Interestingly, more melanopic stimulation → increased alertness and circadian activation, while less melanopic stimulation → relaxation and readiness for sleep. That’s where we come to the core of our subject – Light induced behaviuour. The emergence of Melanopic Lux allows engineers to decouple visual brightness from biological effect, giving the right direction to Human Centric Lighting. 

While melanopic metrics define what kind of biological response light should produce, control architectures determine when and how that response is delivered. Translating circadian intent into real-world lighting behaviour requires intelligent control systems capable of dynamically adjusting spectrum, intensity, and timing throughout the day. This is where embedded sensors, digital LED drivers, and networked control platforms come into play, enabling lighting systems to modulate melanopic content in real time—boosting circadian stimulation during the day and reducing it in the evening—without compromising visual comfort or energy efficiency.

Other metrics, such as Melanopic Equivalent Daylight Illuminance (EDI) and Circadian Stimulus (CS) are used to quantify how effectively a light source supports circadian activation or melatonin suppression, beyond what photopic lux can describe.

LED Drivers and Power Electronics for Dynamic Spectral Control

In human-centric lighting systems, LED drivers are no longer simple power supplies but precision control elements that translate circadian intent into real-world illumination. Because LEDs are current-driven devices, accurate current regulation is essential to maintain stable brightness and spectral output, especially as temperature and operating conditions change.

Dynamic spectral tuning typically relies on multi-channel LED architectures, making channel balancing a critical requirement. Each LED colour behaves differently electrically and thermally, and without independent, well-balanced current control, the intended spectral profile can drift over time, affecting both visual quality and biological impact.

Equally important is dimming accuracy. Human-centric lighting demands smooth, flicker-free dimming that preserves spectral integrity at all brightness levels, particularly during low-light, evening scenarios. Advanced driver designs enable fine-grained dimming and seamless transitions, allowing lighting systems to dynamically adjust spectrum and intensity throughout the day while maintaining visual comfort and circadian alignment.

System Integration Challenges and Design Trade-Offs
While human-centric lighting promises precise control over both visual and biological responses, delivering this in real-world systems involves significant integration challenges and design trade-offs. Spectral accuracy, electrical efficiency, thermal management, and system cost must all be balanced within tight form-factor and reliability constraints. Multi-channel LED engines increase optical and control complexity, while higher channel counts demand more sophisticated drivers, sensing, and calibration strategies.

Thermal effects further complicate integration, as LED junction temperature directly influences efficiency, colour stability, and lifetime. Without careful thermal design and feedback control, even well-engineered spectral profiles can drift over time. At the same time, adding sensors, networking, and intelligence introduces latency, interoperability, and cybersecurity considerations that must be addressed at the system level.

Ultimately, successful human-centric lighting solutions are defined not by any single component, but by holistic co-design—where optics, power electronics, controls, and circadian metrics are engineered together. The trade-offs made at each layer determine whether a system merely adjusts colour temperature or truly delivers biologically meaningful, reliable, and scalable lighting performance.

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​​Dell Technologies Enables NxtGen to Build India’s Largest AI Factory

Чтв, 01/29/2026 - 13:54

Story Highlights
 Dell AI Factory with NVIDIA to provide scalable and secure infrastructure for NxtGen’s AI platform, India’s first and largest AI factory, enabling national-scale AI development.
 This milestone deployment accelerates India’s AI mission, enabling large‑scale generative, agentic, and physical AI while expanding NxtGen’s high‑performance AI services nationwide.

Dell Technologies today announced that NxtGen AI Pvt Ltd, one of India’s foremost sovereign cloud and AI infrastructure providers, has selected Dell AI Factory with NVIDIA solutions for building India’s first and largest dedicated AI factory. This milestone deployment will significantly expand India’s national AI capability, enabling large-scale generative AI, agentic AI, physical AI, and high-performance computing across enterprises, start-ups, and government programs.

Dell will provide the core infrastructure, including Vertiv liquid-cooled Dell PowerEdge XE9685L servers, delivered through Dell Integrated Rack Scalable Systems, for NxtGen’s new AI cluster, empowering the company to meet the growing demand for AI as a Service and large-scale GPU capacity.

Why it matters

This accelerated computing infrastructure is vital for advancing India’s AI mission, significantly expanding NxtGen’s AI cloud services for a diverse range of clients, from start-ups to academia and government. By empowering NxtGen with this advanced foundation, Dell is accelerating India’s next wave of AI development and innovation, ensuring critical access to high-performance AI capabilities across the region.

Powering the future of AI with advanced Dell AI infrastructure

The Dell AI Factory with NVIDIA combines AI infrastructure, software, and services in an advanced, full-stack platform designed to meet the most demanding AI workloads and deliver scalable, reliable performance for training and inference. Leveraging the Dell AI Factory with NVIDIA, NxtGen will deploy Vertiv liquid-cooled, fully integrated Dell IR5000 racks featuring Dell PowerEdge XE9685L servers with the NVIDIA accelerated computing platform to build a cluster with over 4,000 NVIDIA Blackwell GPUs, NVIDIA BlueField-3 DPUs, and NVIDIA Spectrum-X Ethernet networking, all purpose-built for AI. These will be complemented by Dell PowerEdge R670 servers and Dell PowerScale F710 storage.

Dell AI Factory with NVIDIA: Empowering AI for Human Progress

The Dell AI Factory with NVIDIA offers a full stack of AI solutions from data center to edge, enabling organizations to rapidly adopt and scale AI deployments. The integration of Dell’s AI capabilities with NVIDIA’s accelerated computing, networking, and software technologies provides customers with an extensive AI portfolio and an open ecosystem of technology partners. With more than 3,000 customers globally, the Dell AI Factory with NVIDIA reflects Dell’s leadership in enabling enterprises with scalable, secure and high-performance AI infrastructure.

The comprehensive Dell AI Factory with NVIDIA portfolio provides a simplified and reliable foundation for NxtGen to deliver advanced AI capabilities at speed and scale. This allows NxtGen to deliver on its core mission of providing sovereign, cost-effective and powerful AI services that help businesses grow and innovate, while at the same time reinforcing Dell’s commitment to providing the technology that drives human progress.

By equipping organizations like NxtGen with cutting-edge AI infrastructure and services, Dell is helping to unlock new possibilities and create a future where technology empowers everyone to achieve more.

Perspectives

“India’s rapid AI growth demands strong, reliable, and future-ready infrastructure,” said Manish Gupta, president and managing director, India, Dell Technologies. “Dell Technologies is addressing this need through the Dell AI Factory with NVIDIA, designed to simplify and scale AI deployments across industries. As the top AI infrastructure provider, we are enabling this shift by combining storage, compute, networking and software to accelerate AI adoption. Our collaboration with NxtGen brings these capabilities closer to Indian enterprises, helping them deploy AI efficiently and cost-effectively. This marks another step in our commitment to empowering India’s digital future through secure, scalable, and sovereign AI infrastructure.”

“NxtGen is committed to building India’s AI backbone,” said A. S. Rajgopal, managing director and chief executive officer, NxtGen. “This deployment marks a significant milestone for the country: India’s largest AI model-training cluster, built and operated entirely within India’s sovereign cloud framework. Dell Technologies has been critical in enabling this scale, performance, and reliability. Together, we are unlocking the infrastructure that will power the next generation of Indian AI models and applications.”

“India’s ambitious AI mission requires a foundation of secure, high-performance accelerated computing infrastructure to enable model and AI application development,” said Vishal Dhupar, managing director, Asia South, NVIDIA. “Dell’s integration of NVIDIA AI software and infrastructure, including NVIDIA Blackwell GPUs and NVIDIA Spectrum-X networking, provides the AI factory resources to help NxtGen accelerate this critical national capability.”

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Quest Global Appoints Richard Bergman as Global Business Head of its Semiconductor Division

Чтв, 01/29/2026 - 13:31

Bengaluru, India, January 28th, 2026 – Quest Global, the world’s largest independent pure-play engineering services company, today announced the appointment of Richard (Rick) Bergman as President & Global Business Head of its Semiconductor vertical.

As the Global Business Head, Rick will focus on shaping the division’s long-term strategy, accelerating revenue growth, and deepening relationships with global customers. His responsibilities include defining a multi-year growth roadmap, supporting clients’ success through high-impact and transformational solutions, especially in AI, automotive, and industrial sectors, and fostering a culture of innovation and operational excellence to meet next-generation engineering demands.

“The semiconductor industry is at a turning point, fueled by AI, system innovation, and shifting supply chains,” says Ajit Prabhu, Co-Founder and CEO, Quest Global. “Rick is a fantastic addition to our team. He brings incredible leadership across semiconductors and computing, plus a real talent for scaling organizations and building genuine, long-term relationships with customers. Bringing him on board is a clear sign of our commitment to growing this vertical and making sure Quest Global remains a humble, trusted partner for engineering and transformation in this space.”

“Semiconductors are the foundational enablers of innovation across AI, high-performance computing, automotive, communications, and industrial systems,” said Rick Bergman, President & Global Business Head – SemiconductorQuest Global. “What attracted me to Quest Global is the company’s unique combination of deep engineering DNA, global scale, and a long-term partnership mindset with customers. As the industry navigates increasing complexity, my focus will be on helping customers solve their most critical engineering challenges while building a scalable, high-impact business.”

Rick brings more than two decades of leadership experience across semiconductors, computing, graphics, and advanced technology platforms. Most recently, he served as President and CEO of Kymeta Corporation. Previously, he held senior leadership roles at AMD, Synaptics, and ATI Technologies. Throughout his career, Rick has led multi-billion-dollar businesses, overseen major acquisitions, and built high-performing global teams.

This appointment underscores Quest Global’s commitment to building category-leading leadership and scaling its Semiconductor business, aligned with evolving customer needs.

About Quest Global

At Quest Global, it’s not just what we do but how and why we do it that makes us different. We’re in the business of engineering, but what we’re really creating is a brighter future. For over 25 years, we’ve been solving the world’s most complex engineering problems. Operating in over 18 countries, with over 93 global delivery centers, our 21,500+ curious minds embrace the power of doing things differently to make the impossible possible. Using a multi-dimensional approach, combining technology, industry expertise, and diverse talents, we tackle critical challenges faster and more effectively. And we do it across the Aerospace & Defense, Automotive, Energy, Hi-Tech, MedTech & Healthcare, Rail and Semiconductor industries. For world-class end-to-end engineering solutions, we are your trusted partner.

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Def-Tech CON 2026: India’s Biggest Conference on Advanced Aerospace, Defence and Space Technologies to Take Place in Bengaluru.

Чтв, 01/29/2026 - 08:50

The two-day international technology conference is focused on promoting innovation in the Aerospace, Defence, and Space sectors, in conjunction with DEF-TECH Bharat 2026, held in Bengaluru.

With a strong India-centric focus, DefTech CON 2026 features high-impact keynote sessions, expert panels, technology showcases, and interactive QA sessions, covering areas such as AI & autonomous systems, cyber defence, unmanned systems, advanced materials, space tech, next-generation battlefield solutions, advanced sensors, secure communication networks, AI-driven command and control, electronic warfare systems, autonomous platforms, space-based surveillance, next-generation missile defence, and more. These technologies enable faster decision-making, enhanced interoperability, and greater operational dominance across land, air, sea, cyber, and space.

Designed as a venue for engineers, researchers, defence laboratories, industry leaders, startups, and system integrators, the conference unites India’s most brilliant minds to investigate emerging trends, groundbreaking solutions, and essential capabilities that are influencing the strategic future of the nation.

Click here to visit the website for more details!

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India- EU FTA to Empower India’s Domestic Electronics Manufacturing Industry to reach USD 100 Billion in the Following Decade

Срд, 01/28/2026 - 14:22

The India–European Union Free Trade Agreement (FTA) is poised to significantly reshape India’s electronics landscape, with industry estimates indicating it could scale exports to nearly $50 billion by 2031 across mobile phones, IT hardware, consumer electronics, and emerging technology segments—up from the current bilateral electronics trade of about $18 billion.

A Global Supplier 

“The agreement aligns directly with India’s shift from scale-led domestic manufacturing to export-oriented integration with global value chains, while promoting inclusive growth across regions and skill levels,” says Pankaj Mohindroo,  Chairman, ICEA

Emphsisisng on the significance of the FTA, he adds that in electronics, the FTA creates a credible pathway to build exports of nearly USD 50 billion by 2031 across electronic goods, including mobile phones, consumer electronics, and IT hardware. He further adds that the FTA carries the potential to exceed USD 100 billion in the following decade, anchored in manufacturing depth, job creation, innovation, and India’s emergence as a trusted global supplier.

Capitalsing a standards-driven market 

At a time when global trade and supply chains are being reshaped by uncertainty and fragmentation, the India–EU FTA underscores a shared commitment to stability, predictability, and a trusted economic partnership. As the world’s fourth- and second-largest economies respectively, India and the European Union together account for nearly 25 percent of global GDP and close to one-third of global trade. 

For India, the agreement goes beyond expanding trade volumes; it represents deeper engagement with one of the world’s most standards-driven markets, anchored in demonstrated capability, regulatory maturity, and institutional strength.

Preferential Access 

The agreement gains added significance as global value chains increasingly prioritise resilience, diversification, and trusted partnerships. Under the FTA, over 99 percent of Indian exports by value are expected to receive preferential access to the EU market, sharply improving export competitiveness. With its scale, policy predictability, and expanding industrial base, India is well-positioned as a credible manufacturing partner for European lead firms seeking long-term stability beyond traditional supply centres.

Entry of Swedish Company ‘KonveGas’ into India

Amidst this positive environment, KonveGas, a Swedish company specializing in gas storage technology, has officially announced its entry into the Indian market. The fact that European Small and Medium Enterprises (SMEs) are now directly engaging with Indian industries is seen as a direct impact of the new trade policy. 

The company has selected Delhi, Pune, and Gujarat for its initial phase of operations. These regions are India’s primary automotive and industrial hubs. Following the FTA, business opportunities in these sectors are expected to grow. The company aims to begin direct operations within the next six months.

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Anritsu Launches TestDeck Web Solution to enhance Test & Measurement

Срд, 01/28/2026 - 07:18

ANRITSU CORPORATION has launched TestDeck, a web-based solution designed to promote digital transformation (DX) of mobile device testing. TestDeck integrates test planning, configuration, execution, and results management by connecting multiple communication test and measurement systems to a web server and aggregating test data. This centralized approach streamlines test operations and supports new perspectives in test analysis.

TestDeck web-based solution enhances the efficiency of test operations for communication test and measurement systems. TestDeck users can centrally manage test results and progress to rapidly identify performance trends and issues by device version using collected historical data. Furthermore, by visualizing and sharing centralized communication test and measurement systems, TestDeck optimizes testing across multiple domestic and international sites, helping cut test costs and shortening mobile device development cycles.

Anritsu is continuing to expand TestDeck functions to further advance test operations in the Beyond 5G and 6G eras.

Development Background
The number of required mobile device test items continues growing as communication standards and device functions evolve, increasing the test burden for vendors. Additionally, fragmented test data from different global test environments makes cross-functional analysis and results sharing difficult. TestDeck addresses these challenges by aggregating and visualizing equipment and test data for efficient testing.

Product Overview
TestDeck web solution promotes the digital transformation of testing. It supports efficient use of communication test and measurement systems, streamlines workflows, and optimizes testing on a global scale for both efficiency and new analytical perspectives.

Key Features:
• Test Vision: Centralized management of test results for failure cause and device trend analyses
• Test Hub: Aggregated management of test environments, plans, reservations, execution, and results
• Test Utilization: Centralized management of test equipment and licenses
• Comprehensive Test Automation (for PCT*1/RFCT*2): Automated GCF/PTCRB-based test planning for efficient measurement system operation

Supported Products:
• 5G NR Mobile Device Test Platform ME7834NR
• New Radio RF Conformance Test System ME7873NR
• Rapid Test Designer Platform (RTD) MX800050A
• SmartStudio NR MX800070A
Contact Anritsu to learn more about TestDeck MX710000A

Technical Terms

*1 PCT
Abbreviation for Protocol Conformance Test—key ME7834NR function for evaluating whether device adheres to various 3GPP communication protocol procedures following GCF/PTCRB certification requirements

*2 RFCT
Abbreviation for RF Conformance Test—key ME7873NR function for evaluating whether device TRx characteristics meet 3GPP radio parameter specifications following GCF/PTCRB certification requirements

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STMicroelectronics recognised as a Top 100 Global Innovator 2026

Втр, 01/27/2026 - 09:26
  • Clarivate’s list ranks the organisations leading the way in innovation worldwide
  • ST earns the distinction for the eighth time overall, including five consecutive years since 2022

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has been named in the Top 100 Global Innovators 2026. In its 15th edition, the annual benchmark from Clarivate, a leading global provider of transformative intelligence, identifies and ranks organisations that consistently deliver high-impact inventions, shaping the future of innovation across industries. The Top 100 Global Innovators navigate complexity with clarity and set the pace for invention quality, originality and global reach.

 “We are honoured to be recognised as a Top 100 Innovator by Clarivate for 2026, marking our fifth consecutive year and eighth time overall receiving this distinction. This achievement underscores STMicroelectronics’ unwavering commitment to sustained, large-scale innovation in products and technologies, driven by the creativity and dedication of our global teams,” said Alessandro Cremonesi, Executive Vice President, Chief Innovation Officer, and General Manager, System Research and Applications. “As the pace of technological change accelerates, we work in open collaboration with customers and partners to develop disruptive semiconductor technologies and solutions in sensing, power and energy, connectivity, data communications, compute and edge AI, helping them turn ambitious ideas into market-defining solutions.”

ST invests significantly in R&D, and about 20% of company employees work on product design, development and technology in extensive collaboration with leading research labs and corporate partners throughout around the world. The company’s Innovation Office focuses on connecting emerging market trends with internal technology expertise to identify opportunities, stay ahead of the competition, and lead in new or existing technology domains. ST is recognised as a leading semiconductor technology innovator in several areas, including smart power technologies, wide bandgap semiconductors, edge AI solutions, MEMS sensors and actuators, optical sensing, digital and mixed-signal technologies, and silicon photonics.

Maroun S. Mourad, President, Intellectual Property, Clarivate, said: “Recognition as a Top 100 Global Innovator is a remarkable achievement given the pace of change. Multi-year winners and new entrants are investing in AI innovation as it redefines the boundaries between research, engineering and commercial execution. The leaders we celebrate today are not just responding to this shift, they are designing for it.”

The Top 100 Global Innovators analysis is underpinned by the Clarivate Centre for IP and Innovation Research. Their analyses are founded in rigorous research leveraging the proprietary Derwent Strength Index, derived from the Derwent World Patents Index (DWPI) and its global invention data to measure the influence of ideas, their success and rarity, and the investment in inventions.

Detailed Methodology

The Top 100 Global Innovators uses a complete comparative analysis of global invention data to assess the strength of every patented idea, using measures tied directly to their innovative power. To move from the individual strength of inventions to identifying the organisations that create them more consistently and frequently, Clarivate sets two threshold criteria that potential candidates must meet and then adds a measure of their internationally patented innovation output over the past five years.

About STMicroelectronics

At ST, we are 50,000 creators and makers of semiconductor technologies, mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. 

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Aimtron Electronics acquires US-based ESDM and ODM company to expand global footprint

Втр, 01/27/2026 - 09:19
  • Acquisition adds USD 17 million current revenue base, with a target to scale to ~USD 25 million within three years; consolidation from Q4 FY26
  • Strengthens engagement with global OEM customers in mission-critical segments
  • Advancing full-stack, mission-critical electronics capabilities

Aimtron Electronics Limited, an India-based electronics system design and manufacturing (ESDM) company with operations in the United States, announced the acquisition of ICS Company, a US-based ESDM and ODM company headquartered in Decatur. Based on CY 2025 estimates, the acquired business is expected to generate approximately USD 17 million in revenue, with stable performance across the year. Aimtron plans to consolidate revenues from Q4 of FY26.

The acquisition strengthens Aimtron’s capabilities by adding experienced engineering teams, proprietary intellectual property, and long-standing customer relationships, enhancing its end-to-end offerings across product design, manufacturing, and lifecycle support. ICS serves leading global OEMs across industrial and mission-critical segments, including Caterpillar and John Deere. This deepens Aimtron’s presence in high-reliability electronics and strengthens its engagement with global OEM customers.

The acquired facility is currently operating at around 54 per cent capacity utilisation, offering strong headroom for growth. Aimtron intends to scale utilisation to approximately 90 per cent over the next three years through improved procurement, enhanced operating leverage, and targeted capacity expansion.

The transaction has been evaluated on both trailing and forward financials and is expected to be margin- and EPS-supportive from year one, while remaining aligned to Aimtron’s ROCE and ROE benchmarks.

Mukesh Jeram Vasani, Founder, Aimtron Electronics Limited, said, “This acquisition is a decisive step in Aimtron’s global journey. It significantly expands our footprint in North America, deepens our engineering strength, and positions us closer to customers building mission-critical products. With scalable infrastructure, strong regional opportunity, and a highly capable team, this integration accelerates our move toward a truly full-stack ESDM platform and reinforces our ambition to build a global electronics powerhouse.”

The acquired company operates a 58,000 sq. ft. manufacturing facility located on approximately 3.9 acres in Decatur. Strategically positioned within an established industrial and OEM ecosystem, the facility serves customers across agrotech, oil and gas, mining, hardened electronics, heavy engineering, and medical technology.

Dennis Espinoza, Founder & CEO, said, “Joining the Aimtron family marks an exciting new chapter for ICS. By aligning our deep-rooted Midwest engineering focus with Aimtron’s global resources and manufacturing scale, we can now offer our long-standing customers even more comprehensive end-to-end solutions. This partnership empowers us to accelerate innovation and better serve the rising demand for rugged, high-reliability electronics in critical industries like agrotech and heavy engineering.”

Nirmal Vasani, Chief Operating Officer, Aimtron Electronics, said, “The acquisition of ICS is a cornerstone of our ‘Glocal’ strategy, combining the engineering precision of the US with the immense scale of our Indian manufacturing ecosystem. This is a significant leap toward our vision of becoming a ₹1,000 crore global ESDM powerhouse.”

Chris Espinoza, Vice President of ICS Company, said, “Under the Aimtron umbrella, we now have the scale, resources, and global reach to accelerate growth while continuing to serve our customers with the same engineering focus and operational discipline. Our Midwest location—at the heart of North America’s most productive farming regions—also positions us well to support the rising demand for advanced agrotech and rugged electronics solutions.”

Recently, Aimtron incorporated Aimtron Mechatronics, a wholly owned subsidiary in Gujarat, and raised ₹100 crore through preferential convertible warrants. Together with this US acquisition, these initiatives are expected to play a key role in fulfilling Aimtron’s mission of achieving ₹1,000 crore in revenue over the next three years.

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