ELE Times

ANRITSU CORPORATION has launched TestDeck, a web-based solution designed to promote digital transformation (DX) of mobile device testing. TestDeck integrates test planning, configuration, execution, and results management by connecting multiple communication test and measurement systems to a web server and aggregating test data. This centralized approach streamlines test operations and supports new perspectives in test analysis.

TestDeck web-based solution enhances the efficiency of test operations for communication test and measurement systems. TestDeck users can centrally manage test results and progress to rapidly identify performance trends and issues by device version using collected historical data. Furthermore, by visualizing and sharing centralized communication test and measurement systems, TestDeck optimizes testing across multiple domestic and international sites, helping cut test costs and shortening mobile device development cycles.

Anritsu is continuing to expand TestDeck functions to further advance test operations in the Beyond 5G and 6G eras.

Development Background
The number of required mobile device test items continues growing as communication standards and device functions evolve, increasing the test burden for vendors. Additionally, fragmented test data from different global test environments makes cross-functional analysis and results sharing difficult. TestDeck addresses these challenges by aggregating and visualizing equipment and test data for efficient testing.

Product Overview
TestDeck web solution promotes the digital transformation of testing. It supports efficient use of communication test and measurement systems, streamlines workflows, and optimizes testing on a global scale for both efficiency and new analytical perspectives.

Key Features:
• Test Vision: Centralized management of test results for failure cause and device trend analyses
• Test Hub: Aggregated management of test environments, plans, reservations, execution, and results
• Test Utilization: Centralized management of test equipment and licenses
• Comprehensive Test Automation (for PCT*1/RFCT*2): Automated GCF/PTCRB-based test planning for efficient measurement system operation

Supported Products:
• 5G NR Mobile Device Test Platform ME7834NR
• New Radio RF Conformance Test System ME7873NR
• Rapid Test Designer Platform (RTD) MX800050A
• SmartStudio NR MX800070A
Contact Anritsu to learn more about TestDeck MX710000A

Technical Terms

*1 PCT
Abbreviation for Protocol Conformance Test—key ME7834NR function for evaluating whether device adheres to various 3GPP communication protocol procedures following GCF/PTCRB certification requirements

*2 RFCT
Abbreviation for RF Conformance Test—key ME7873NR function for evaluating whether device TRx characteristics meet 3GPP radio parameter specifications following GCF/PTCRB certification requirements

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• Clarivate’s list ranks the organisations leading the way in innovation worldwide
• ST earns the distinction for the eighth time overall, including five consecutive years since 2022

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has been named in the Top 100 Global Innovators 2026. In its 15th edition, the annual benchmark from Clarivate, a leading global provider of transformative intelligence, identifies and ranks organisations that consistently deliver high-impact inventions, shaping the future of innovation across industries. The Top 100 Global Innovators navigate complexity with clarity and set the pace for invention quality, originality and global reach.

 “We are honoured to be recognised as a Top 100 Innovator by Clarivate for 2026, marking our fifth consecutive year and eighth time overall receiving this distinction. This achievement underscores STMicroelectronics’ unwavering commitment to sustained, large-scale innovation in products and technologies, driven by the creativity and dedication of our global teams,” said Alessandro Cremonesi, Executive Vice President, Chief Innovation Officer, and General Manager, System Research and Applications. “As the pace of technological change accelerates, we work in open collaboration with customers and partners to develop disruptive semiconductor technologies and solutions in sensing, power and energy, connectivity, data communications, compute and edge AI, helping them turn ambitious ideas into market-defining solutions.”

ST invests significantly in R&D, and about 20% of company employees work on product design, development and technology in extensive collaboration with leading research labs and corporate partners throughout around the world. The company’s Innovation Office focuses on connecting emerging market trends with internal technology expertise to identify opportunities, stay ahead of the competition, and lead in new or existing technology domains. ST is recognised as a leading semiconductor technology innovator in several areas, including smart power technologies, wide bandgap semiconductors, edge AI solutions, MEMS sensors and actuators, optical sensing, digital and mixed-signal technologies, and silicon photonics.

Maroun S. Mourad, President, Intellectual Property, Clarivate, said: “Recognition as a Top 100 Global Innovator is a remarkable achievement given the pace of change. Multi-year winners and new entrants are investing in AI innovation as it redefines the boundaries between research, engineering and commercial execution. The leaders we celebrate today are not just responding to this shift, they are designing for it.”

The Top 100 Global Innovators analysis is underpinned by the Clarivate Centre for IP and Innovation Research. Their analyses are founded in rigorous research leveraging the proprietary Derwent Strength Index, derived from the Derwent World Patents Index (DWPI) and its global invention data to measure the influence of ideas, their success and rarity, and the investment in inventions.

Detailed Methodology

The Top 100 Global Innovators uses a complete comparative analysis of global invention data to assess the strength of every patented idea, using measures tied directly to their innovative power. To move from the individual strength of inventions to identifying the organisations that create them more consistently and frequently, Clarivate sets two threshold criteria that potential candidates must meet and then adds a measure of their internationally patented innovation output over the past five years.

About STMicroelectronics

At ST, we are 50,000 creators and makers of semiconductor technologies, mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. 

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• Acquisition adds USD 17 million current revenue base, with a target to scale to ~USD 25 million within three years; consolidation from Q4 FY26
• Strengthens engagement with global OEM customers in mission-critical segments
• Advancing full-stack, mission-critical electronics capabilities

Aimtron Electronics Limited, an India-based electronics system design and manufacturing (ESDM) company with operations in the United States, announced the acquisition of ICS Company, a US-based ESDM and ODM company headquartered in Decatur. Based on CY 2025 estimates, the acquired business is expected to generate approximately USD 17 million in revenue, with stable performance across the year. Aimtron plans to consolidate revenues from Q4 of FY26.

The acquisition strengthens Aimtron’s capabilities by adding experienced engineering teams, proprietary intellectual property, and long-standing customer relationships, enhancing its end-to-end offerings across product design, manufacturing, and lifecycle support. ICS serves leading global OEMs across industrial and mission-critical segments, including Caterpillar and John Deere. This deepens Aimtron’s presence in high-reliability electronics and strengthens its engagement with global OEM customers.

The acquired facility is currently operating at around 54 per cent capacity utilisation, offering strong headroom for growth. Aimtron intends to scale utilisation to approximately 90 per cent over the next three years through improved procurement, enhanced operating leverage, and targeted capacity expansion.

The transaction has been evaluated on both trailing and forward financials and is expected to be margin- and EPS-supportive from year one, while remaining aligned to Aimtron’s ROCE and ROE benchmarks.

Mukesh Jeram Vasani, Founder, Aimtron Electronics Limited, said, “This acquisition is a decisive step in Aimtron’s global journey. It significantly expands our footprint in North America, deepens our engineering strength, and positions us closer to customers building mission-critical products. With scalable infrastructure, strong regional opportunity, and a highly capable team, this integration accelerates our move toward a truly full-stack ESDM platform and reinforces our ambition to build a global electronics powerhouse.”

The acquired company operates a 58,000 sq. ft. manufacturing facility located on approximately 3.9 acres in Decatur. Strategically positioned within an established industrial and OEM ecosystem, the facility serves customers across agrotech, oil and gas, mining, hardened electronics, heavy engineering, and medical technology.

Dennis Espinoza, Founder & CEO, said, “Joining the Aimtron family marks an exciting new chapter for ICS. By aligning our deep-rooted Midwest engineering focus with Aimtron’s global resources and manufacturing scale, we can now offer our long-standing customers even more comprehensive end-to-end solutions. This partnership empowers us to accelerate innovation and better serve the rising demand for rugged, high-reliability electronics in critical industries like agrotech and heavy engineering.”

Nirmal Vasani, Chief Operating Officer, Aimtron Electronics, said, “The acquisition of ICS is a cornerstone of our ‘Glocal’ strategy, combining the engineering precision of the US with the immense scale of our Indian manufacturing ecosystem. This is a significant leap toward our vision of becoming a ₹1,000 crore global ESDM powerhouse.”

Chris Espinoza, Vice President of ICS Company, said, “Under the Aimtron umbrella, we now have the scale, resources, and global reach to accelerate growth while continuing to serve our customers with the same engineering focus and operational discipline. Our Midwest location—at the heart of North America’s most productive farming regions—also positions us well to support the rising demand for advanced agrotech and rugged electronics solutions.”

Recently, Aimtron incorporated Aimtron Mechatronics, a wholly owned subsidiary in Gujarat, and raised ₹100 crore through preferential convertible warrants. Together with this US acquisition, these initiatives are expected to play a key role in fulfilling Aimtron’s mission of achieving ₹1,000 crore in revenue over the next three years.

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As India approaches Union Budget 2026–27, multiple industrial sectors—from power and automation to digital infrastructure and electric mobility—find themselves at a critical inflexion point. With the country balancing rapid industrialisation alongside sustainability and energy-transition goals, industry leaders are calling for continued capital expenditure, targeted incentives, and policy stability to strengthen infrastructure depth and global competitiveness.

At the core of these recommendations is the need to reinforce India’s power and grid ecosystem. According to Meenu Singhal, Regional Managing Director, Socomec Group, Greater India, sustained capex allocation, grid modernisation, and deeper indigenisation of critical power equipment will be essential to support rising industrial and digital demand. Industry stakeholders are urging the government to prioritise scalable manufacturing clusters, digitally enabled grid infrastructure, and structural reforms that improve reliability and execution efficiency.

Strategic schemes such as capex support mechanisms, fiscal incentives for local manufacturing, and policies favouring large-scale infrastructure implementation are seen as vital to closing capability gaps across transmission and distribution networks. Equally important, experts stress, is policy consistency and an enabling tax framework that continues to attract both domestic and global capital into the power sector, reinforcing India’s long-term vision of energy security and sustainable growth.

Beyond core infrastructure, industrial automation has emerged as a key lever for enhancing India’s manufacturing competitiveness as the economy advances towards the $5-trillion milestone. Sanjeev Srivastava, Business Head – Industrial Automation SBP at Delta Electronics India, highlights that smart factories, AI-driven automation, and closer human–machine collaboration will define the next phase of industrial transformation.

Industry players believe that stronger Budget support in the form of smart manufacturing incentives, R&D-linked tax benefits, and skill-development programmes can significantly accelerate the adoption of next-generation automation technologies. Such measures would help manufacturers improve productivity, reduce operating costs, and strengthen India’s position on the global manufacturing and automation curve.

Also read industry’s recommendations on the Union Budget 2026 at: PCB Duty Cuts to Manufacturing Zones: Top Industry Recommendations for Budget 2026

As India moves deeper into the 5G, cloud, and AI era, mission-critical digital infrastructure is increasingly being viewed as the backbone of every industry. Pankaj Singh, Head – Data Centre & Telecom Business Solutions at Delta Electronics India, notes that the upcoming Budget presents an opportunity to prioritise energy-efficient and resilient data-centre ecosystems.

Industry recommendations include stronger incentives for modular and containerised data-centre deployments to enable faster rollout of scalable core and edge facilities. There is also a growing emphasis on supporting advanced cooling technologies—such as liquid-to-liquid and liquid-to-air coolant distribution systems—to manage the high thermal loads associated with AI-driven workloads. When complemented with sustainability-linked benefits and Make-in-India incentives for locally manufactured power, cooling, and automation equipment, these measures could encourage OEMs to invest with greater confidence in building a future-ready, low-carbon digital backbone.

Meanwhile, India’s electric mobility ecosystem is entering a decisive phase, where long-term resilience and supply-chain stability are becoming as critical as adoption numbers. Bhaktha Keshavachar, Co-Founder & CEO of Chara Technologies, points out that while policy efforts have successfully focused on vehicle adoption and battery localisation, recent global disruptions have exposed vulnerabilities stemming from India’s dependence on imported rare-earth magnet motors.

As Budget 2026 approaches, industry voices are calling for formal recognition and fiscal support for magnet-free motor technologies within existing incentive frameworks. These solutions offer predictable costs, reduced supply-chain risk, and the development of indigenous intellectual property—particularly for high-volume segments such as two-wheelers, three-wheelers, and commercial fleets.

Targeted incentives for rare-earth-free motor manufacturing, stakeholders argue, would not only de-risk India’s EV ambitions but also position the country as a global hub for affordable, resilient, and export-ready EV powertrain solutions.

Taken together, these pre-Budget recommendations underline a shared industry priority: building resilient, scalable, and future-ready industrial ecosystems through focused policy support. Whether in power infrastructure, automation, digital systems, or electric mobility, Budget 2026 is widely seen as a pivotal opportunity to reinforce India’s transition towards sustainable growth, technological leadership, and global manufacturing competitiveness.

The post From Power Grids to EV Motors: Industry Flags Key Budget 2026 Priorities for India’s Next Growth Phase appeared first on ELE Times.

Artificial Intelligence (AI), like any other technology, comes with its own set of boons and banes. According to the Stanford AI Index 2024, India ranks first globally in AI skill penetration with a score of 2.8, ahead of the US (2.2) and Germany (1.9). AI talent concentration in India has grown by 263% since 2016, positioning the country as a major AI hub. India also leads in AI Skill Penetration for Women, with a score of 1.7, surpassing the US (1.2) and Israel (0.9).

India in its AI Era

According to a PIB report, India is one of the top five fastest-growing AI talent hubs, alongside Singapore, Finland, Ireland, and Canada. The demand for AI professionals in India is projected to reach 1 million by 2026. Taking this advancement into mind, all eyes will be on the Budget for 2026, judging what the government intends to propose to boost the AI landscape in India.

“India’s rapid advancement in the AI era places the spotlight on the upcoming Union Budget as a decisive moment for building a future-ready workforce. With over 40% of India’s IT and gig workforce already utilising AI tools, and India projected to account for the world’s AI talent by 2027, there is clear momentum; yet, significant gaps remain.

Although the employability of the workforce has improved, some part of the young workforce possesses deep AI skills, and many companies complain about the difficulties in hiring the right people. The provision of more funds for AI workforce training programs, along with the National Education Policy’s emphasis on the incorporation of applied AI, data science, and digital technologies into the curriculum, is important. We anticipate policies that foster close cooperation between the industry and the universities, provide incentives for certifying the basic knowledge gained through practical training, and allow more students to have access to hands-on labs and internships. Not only will these measures lift the entry-level skills of the labour force, but they will also make it certain that the young population of India is capable of turning to the global market as the main supplier of leaders in the coming years,” says Tarun Anand, Founder & Chancellor, Universal AI University.

Shortcomings of AI: Cybersecurity Threats

While AI has great potential and proposed advanced opportunities in various sectors, it comes with its own set of shortcomings. The issues of cybersecurity have escalated significantly in the AI era. Subsequently, it will be important to note what the new budget has in store to build on cybersecurity, as AI will continue to dominate the Indian landscape.

“As India approaches the 2026 Union Budget, the cybersecurity sector does so with clarity: compliance is no longer optional, and policy must now accelerate infrastructure transitions that enterprises cannot manage alone. In 2025, India faced nearly 265 million cyberattacks, with AI-driven ransomware democratizing threats at an unprecedented scale.

First, cybersecurity data centre infrastructure must be formally recognised as a critical national asset. Expanding the PLI framework to include cybersecurity data centres would strengthen India’s cyber sovereignty and reduce reliance on offshore infrastructure.

Second, the Budget should enable public–private partnerships to bolster SME cyber resilience. Manufacturing and mid-market enterprises are increasingly targeted by ransomware-as-a-service, yet lack access to enterprise-grade security. Government-backed subsidies routed through certified MSP networks would protect the Make in India ecosystem while democratizing DPDP compliance at scale.

Third, India must invest decisively in cybersecurity talent infrastructure. With a shortage of over 80,000 professionals, Budget 2026 should fund structured partnerships between government, academic institutions, and industry certifiers. This would create a domestic talent pipeline comparable to Singapore’s model. While we currently train over 2,000 professionals annually, government backing could scale this to more than 10,000 within three years.

The DPDP execution phase, starting in November 2026, will ultimately determine whether cyber resilience scales equitably across the country or remains concentrated in metro markets. Through targeted investments in infrastructure, partnerships, and education, the 2026 Budget has the opportunity to shape that outcome decisively,” says Rajesh Chhabra, General Manager, India and South East Asia, Acronis

By: Shreya Bansal, Sub-Editor

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ANRITSU CORPORATION showcases next-generation wireless solutions at MWC 2026 in Barcelona (Hall 5 Stand D41). The company’s portfolio includes software-centric tools for early 6G standardisation, pioneering 6G measurement and AI-powered test solution, unified RF Multiband and NTN Validation Platform, Field Simulation Test for digital twin development, cloud-based automotive validation for ADAS and SDV, sustainable IoT power consumption evaluation, and intelligent assurance for mobile, fixed, and private infrastructures. Together, these innovations confirm Anritsu’s vision to deliver trustworthy, sustainable, and high-performance connectivity, helping operators, manufacturers, and industry verticals unlock new value as networks evolve beyond intelligence.

As a global leader in communications test and measurement, Anritsu continues to empower innovators with tools that support the evolving demands of connectivity, automation, and network intelligence.

6G Test Platform for Early 6G Standardisation and Validation
Anritsu’s Virtual Signalling Tester is a software-based signalling tester for advanced 6G validation. Its Virtual ST-based solution supports L1/Physical layer test, and protocol test/Application test, capable of testing at the MAC layer, DIQ and RF Interface (with SDR). It’s equipped with an arbitrary waveform output function, which is being considered for 6G, making it highly useful for early validation during the 6G standardisation phase.

Pioneering 6G Measurement and AI-Driven Test Solution
Anritsu demonstrates a groundbreaking 6G measurement solution, designed to redefine wireless testing with AI at the core of the workflow. This next-generation solution harnesses advanced data management and AI-powered analytics to simplify complex test processes, reduce engineering workload, and accelerate development cycles. AI-assisted test sequence generation improves accuracy, optimises resource usage, and accelerates development cycles by learning from historical test patterns and real-world performance data. This intelligent approach ensures customers can meet the rapidly evolving demands of 6G technology, digital automation, and scalable network intelligence.

Unified 6G Multiband and NTN Validation Platform
The MT8000A Radio Communication Test Station now integrates support for the Upper Mid-Band (up to 16 GHz), enabling comprehensive RF front-end testing across FR1, FR2, and FR3 bands within a single modular platform. This unified architecture streamlines validation workflows for 6G devices, allowing simultaneous multi-band characterisation, inter-band handover testing, and advanced signal integrity analysis. In addition, the platform introduces next-generation NTN (Non-Terrestrial Network) measurement capabilities, including Direct-to-Cell and NR-NTN protocols delivered as a software upgrade. Engineers can leverage real-time emulation of satellite and aerial link conditions, protocol stack verification, and seamless integration with existing test automation environments. These enhancements empower engineers to efficiently validate NTN features, optimise RF performance, and maintain a competitive edge as wireless technologies evolve toward 6G.

Reproducing Real Networks: FST for Digital Twin Development
Anritsu demonstrates its unique Field Simulation Test (FST) solution, designed to capture real-world radio environments and accurately reproduce complex network propagation conditions in the laboratory. This innovative approach allows engineers to replicate issues observed in live networks and verify propagation scenarios. Moreover, the collection of propagation data supports the development of Digital Twin environments for research into next-generation wireless technologies, such as ISAC and CSI compression.

Future-Ready Automotive Testing: Cloud-Based Validation for Connected SDV Use Cases
Anritsu, in collaboration with Valeo, is demonstrating a Virtualised Automotive Testing Solution designed to accelerate Software development and reduce testing costs for connected and autonomous vehicles. By integrating Anritsu’s virtual connectivity solution for 5G and C-V2X connectivity with Valeo’s virtualised hardware and ECU simulation platform, this joint solution enables comprehensive validation of Connected SDV functions, eliminating the need for physical vehicles or test tracks. The approach delivers faster time-to-market, improved safety, and global scalability through cloud integration, transforming automotive testing into a cost-effective, future-ready process.

Power Consumption Testing for Smarter, Sustainable IoT Devices
As industries accelerate toward smarter, more connected solutions, the demand for low-power, sustainable devices is reshaping the landscape of IoT technology. Anritsu introduces a cutting-edge power consumption test environment, empowering engineers to evaluate sensors, wearables, and smart home systems under real-world operating conditions. This real-world approach provides actionable insights into energy usage, battery life, and optimisation potential, enabling precise measurement and analysis that drive smarter design choices and longer-lasting products. Leveraging the advanced capabilities of the Anritsu MT8000A platform, Qoitech’s Otii power measurement suite, and SmartViser’s expertise in intelligent test automation and orchestration, this solution sets a new benchmark for energy efficiency in IoT device development.

From Complexity to Clarity to Confidence. Applied AI for Autonomous Networks
Anritsu’s Service Assurance platform is a unified solution that transforms network complexity into a competitive advantage. By embedding intelligence directly into the service assurance workflow, Anritsu allows operators to surface the signals that matter most. Data from across the network is correlated, converting fragmented insights into actionable guidance that engineers and operations teams can trust.

This continuous AI-driven understanding of service health accelerates decision-making and forms the foundation for autonomous network transformation. The result is a clear, unified operational picture that empowers teams to act with confidence and deliver superior customer experiences.

Across our AI-powered assurance portfolio, Anritsu’s purpose-built intelligence delivers measurable business outcomes: lower costs, higher satisfaction, and faster resolution.

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As the nation gears up for the Union Budget 2026, slated to be presented in Parliament on February 1, electronics industry associations are stepping up efforts to push India’s electronics manufacturing ecosystem to its next phase of growth.

Among the key recommendations, the Electronic Industries Association of India (ELCINA) has proposed the establishment of 10 world-class, product-specific Electronics Manufacturing Zones (EMCs). The association has urged the government to upgrade the existing EMC 1.0 and EMC 2.0 cluster models to globally accepted infrastructure standards. According to ELCINA, such an approach would help ensure regional balance, improve local facilitation, and enhance India’s competitiveness and export potential.

Strengthening the manufacturing value chain further, the India Cellular & Electronics Association (ICEA) has recommended a reduction in customs duty on microphone, receiver, and speaker assemblies for mobile phones from the current 15% to 10%. The association believes that this duty rationalisation would create cumulative cost advantages, improve global competitiveness, and encourage additional investments in domestic component manufacturing.

ICEA has also suggested reducing duties on Printed Circuit Board Assemblies (PCBAs) and Flexible PCB Assemblies (FPCAs) from 15% to 10%, a move aimed at supporting localisation and scale in electronics production.

Testing & Certification 

For any industry, standards play a major role, whether for exports or inbound use; without certification, no product can see the light of day. Recognising this to be at the forefront of product development, ELCINA recommends introducing a Testing & Certification Support Scheme to provide financial support or reimbursement of testing and certification charges to MSMEs. 

Also, to make the services accessible for small entities with minimal investments, the body recommends establishing regional accredited testing centers in collaboration with private labs, industry associations, and technical institutions as per BIS and other international standards.  This would successfully ensure one of the vitals for strengthening the domestic manufacturing and R&D ecosystem. 

Investment Fund for SMEs

As the Union Budget 2026 approaches, ELCINA has also highlighted the long-standing challenge of limited access to low-cost finance for SMEs in the electronics system design and manufacturing (ESDM) sector, noting that funding constraints continue to hamper their ability to scale and invest in advanced technologies. To address this, the association has recommended the creation of a dedicated Technology Acquisition Fund to support technology transfer and licensing, enabling Indian firms to move up the value chain and transition towards a product-led ecosystem. 

ELCINA has also proposed a professionally managed, government-backed venture fund to support high-value-added manufacturing in electronic components, PCBs, and modules, along with targeted tax incentives, including investment- and dividend-stage exemptions for at least five years, to attract private equity and high-net-worth investors and help build globally competitive Indian champions.

Classification of Displays 

In the same vein, the India Cellular and Electronics Association (ICEA) has raised concerns over the lack of clarity in the customs classification of display assemblies used across automobiles, medical devices, industrial electronics, and other applications. Although these displays are technologically identical to flat panel display modules used in mobile phones and televisions, they are often classified under different HSN codes based on end-use, resulting in inconsistent customs treatment and operational uncertainty across field formations. 

To address this, ICEA has recommended uniform classification of all display assemblies under HSN 8524, regardless of application, a step it says would ensure global alignment, reduce classification disputes, and enable smoother integration of display manufacturing across product segments as domestic capacity scales up under the Electronics Components and Manufacturing Scheme (ECMS).

Conclusively, the industry’s pre-Budget recommendations point to a clear priority: strengthening India’s electronics manufacturing depth through targeted policy, fiscal, and regulatory interventions. With focused action on infrastructure, duties, finance, and classification clarity, Budget 2026 has the opportunity to accelerate India’s shift from assembly-led growth to globally competitive electronics manufacturing. 

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CEA-Leti presented new research at SPIE Photonics West highlighting major progress in the integration of quantum cascade lasers (QCLs) with silicon photonic platforms for mid-infrared (MIR) applications.

The paper titled, “Advanced Architectures for Hybrid III-V/Silicon Quantum Cascade Lasers: Toward Integrated Mid-Infrared Photonic Platforms,” compares three complementary hybrid laser architectures that collectively advance the practicality, flexibility, and scalability of MIR photonics.

Toward ‘Smaller, More Robust, and More Manufacturable MIR Systems’

Mid-infrared light plays a critical role in technologies such as gas sensing, chemical spectroscopy, biomedical diagnostics, and security, because many molecules exhibit strong absorption signatures in this spectral region. Despite the technology’s importance, MIR photonic systems remain large, costly, and difficult to manufacture at scale. Integrating MIR light sources directly onto silicon photonic platforms offers a path toward smaller, more robust, and more manufacturable systems—bringing mid-infrared photonics closer to the level of integration in the near-infrared.

Three Architectures, Three Integration Strategies 

In its Photonics West presentation, CEA-Leti demonstrated and compared three distinct hybrid III-V/silicon QCL architectures, each addressing a different integration challenge:

Hybrid Distributed Feedback QCL on Silicon-on-Nothing-on-Insulator with Adiabatic Coupling

• This approach enables robust single-mode emission around 4.3 µm with efficient optical power transfer from the III-V active region into silicon waveguides. High-index-contrast silicon photonics provides precise feedback and light routing, making this architecture well-suited for scalable photonic integrated circuits targeting spectroscopy and chemical sensing.

Hybrid QCL with an External Silicon Distributed Bragg Reflector Cavity

• In this configuration, optical gain and optical feedback are decoupled: the III-V material provides amplification, while wavelength selection and feedback are implemented in silicon using distributed Bragg reflector (DBR) cavities. This separation offers enhanced design flexibility and opens a clear path toward tunable and multifunctional MIR sources for advanced spectroscopic and sensing systems.

Ultra-Compact QCL Micro-Sources Based on Photonic Crystals & Micro-Rings

• Miniature light sources in these devices achieve footprints below 100 µm² by leveraging strong optical confinement and resonant effects. The resulting extreme miniaturization enables dense on-chip integration and supports new system architectures where size, power consumption, and integration density are critical.

From Passive Platform to Active Host

Collectively, the results show that silicon photonics can play an active role in mid-infrared laser systems. By combining adiabatic optical coupling, silicon-based feedback and cavity engineering, and ultra-compact laser concepts, CEA-Leti establishes several viable integration pathways rather than a single, one-size-fits-all solution. The work highlights how different architectures trade off stability, flexibility, and footprint, providing designers with a practical toolkit for MIR photonic systems.

“By combining quantum cascade lasers with silicon photonics, we are bringing mid-infrared sources closer to the level of integration and scalability that silicon platforms have already achieved in the near-infrared,” said Alexis Hobl, presenter and lead author of the paper.

Looking Ahead

Future work will focus on further improving optical coupling efficiency, fabrication robustness, and thermal and electrical management, as well as integrating additional on-chip photonic functions such as filters, multiplexers, and interferometric circuits. Demonstrating wafer-scale reproducibility and packaging-ready designs will be key milestones on the path toward fully integrated mid-infrared photonic systems.

Acknowledgements: L’Institut des Nanotechnologies de Lyon (INL), III-V Lab, and Fraunhofer Applied Solid State Physics IAF contributed to this project.

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The Indian Open Source for Mobile Communication Networks (IOS-MCN) Consortium has developed a new open source, publicly releasing its software platform to allow organisations to build and run their own Private 5G networks. Designed for factories, campuses, research institutions and startups, the platform would allow users to deploy Private 5G networks that promise faster, more reliable and secure connectivity than Wi-Fi or public mobile networks at a lower cost.

The release, named Agartala 0.4.0, is a continuation of IOS-MCN’s convention of using Indian city names to reflect its national, open-source character. This is the fourth open-source milestone that is mature enough for pilot deployments of India’s homegrown Private 5G platform. Validation tests prove end-to-end latency of under 10 milliseconds and downlink throughput of up to 600 Mbps per gNB, making it suitable for early pilots and enterprise trials.

The IOS-MCN is being developed by a consortium led by IISc Bengaluru, IIT Delhi, and C-DAC, with funding from the Ministry of Electronics & Information Technology (MeitY), Government of India. Agartala 0.4.0 marks a decisive step towards industry-grade, deployable Private 5G networks built on an open-source platform.

Brings all key parts of a private 5G network into one integrated, easy-to-deploy software platform:

• Advanced Mobility: Xn, F1, and N2 handovers, cell reselection, and robust RRC idle mode handling
• Voice & Multimedia: VoNR and ViNR with full IMS integration
• ORAN-Compliant Disaggregated RAN with unified RAN support
• Network Slicing for enterprise and mission-critical use cases
• Service Management & Orchestration (SMO) with a unified dashboard
• RIC Framework: E2 interface implementation with near-RT and non-RT RIC support
• Precision Timing: PTP LLS C1 and C3
• Operational Excellence: PM counters across RAN and Core, extensive crash and assert fixes, and expanded test coverage

Agartala 0.4.0 positions IOS-MCN for early pilot deployments led by ecosystem partners, with installations planned to commence in the second half of 2026 across multiple sectors.

Niral Networks, which builds indigenous telecom and networking solutions, has proposed an Intelligent Village pilot. It stated, “Agartala 0.4.0 provides the foundational technology that enables Private 5G deployments for rural and semi-urban environments. We will leverage the IOS-MCN stack to deliver real-world analytics and digital inclusion solutions through initiatives like the Intelligent Village Pilot and Smart Village Connectivity Program.”

Techphosis, which develops secure technology solutions for defence and strategic applications, has proposed a Network-in-a-Box pilot for defence applications. It said: “Agartala 0.4.0 demonstrates the readiness of open-source, ORAN-compliant platforms for defence use cases. The Network-in-a-Box pilot, planned for the second half of 2026, aims to validate rapid, secure, portable and reliable Private 5G deployments for defence communications.”

Together, these proposed pilots, spanning several sectors, underscore IOS-MCN Agartala 0.4.0’s readiness to transition from platform development to industry validation and deployment starting in 2026.

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The idea for a low-cost UPS monitoring system at IIIT-H did not begin in a laboratory or a funding proposal. It began with a familiar frustration – raised by Prakash Nayak, a campus IT staffer who was tired of equipment failures with no clear explanation.

Power outages were happening. Servers were restarting. Despite the installation of UPS units everywhere, no one could say with certainty what the UPS systems were actually doing when the lights went out. That real-world problem became the starting point for a research project that has now resulted in a ₹2,000 IoT-based device capable of tracking UPS behaviour during outages with near-second precision.

The research was documented in a paper titled “Low-cost IoT-based Downtime Detection for UPS and Behaviour Analysis,” by authors Sannidhya Gupta, Prakash Nayak, and Prof. Sachin Chaudhari. It also received the Best Paper award at the 18th International Conference on COMmunication System and NETworkS (COMSNETS-2026) Workshop on AI of Things, recently held in Bangalore.

When monitoring costs more than the problem
“Frequent power outages in developing regions cause equipment damage, operational downtime, and data loss,” says Sannidhya Gupta, noting that while UPS systems are meant to provide protection, “affordable options for monitoring their performance remain limited.” Commercial UPS monitoring tools – typically SNMP cards that collect and organise information about managed devices over IP networks – were an option, but an impractical one. According to the paper, “Commercial solutions are expensive, manufacturer-specific, and reliant on network infrastructure”. With prices exceeding ₹20,000 per unit, the campus IT team simply could not justify deploying them at scale. Worse, these tools often failed at the moment they were most needed. “These systems are unable to record data when the UPS itself loses power,” the authors point out, making post-outage diagnosis nearly impossible.

A device that watches, not interferes
Responding directly to the IT team’s request for something affordable and reliable, the team designed a non-intrusive current-monitoring device. Instead of tapping into UPS internals, it clamps onto the input and output lines, observing how current flows before, during, and after outages. “UPS input and output currents are sensed non-intrusively to detect outages, switchovers, and recovery behaviour,” the researchers explain. Additionally, the device is battery-backed, allowing it to keep recording even when both mains power and internet connectivity are lost.

From theory to campus corridors
In order to test out the system, it was deployed across four UPS installations on campus, including one unit already suspected by IT staff to be malfunctioning. Over a month, the devices collected around 3.7 million data points, automatically detecting 61 outage events. The data confirmed what the IT team had suspected but could never prove. “One UPS repeatedly showed no clear charging behaviour after outages,” reports Prakash, indicating a system that could briefly support loads but failed to properly recharge its batteries.

Smart algorithms, Simple assumptions
The backend analytics automatically labels each event into phases – normal operation, outage, stabilisation, and battery charging – without manual configuration. “All thresholds are expressed as fractions of a locally estimated baseline,” the authors note, adding that this allows the system to adapt to different installations automatically. The results were precise: no missed outages, no false alarms, and timing errors typically within three seconds.

Real-time monitoring, Ten times cheaper 
A web-based dashboard now gives IT staff something they never had before: visibility. Instead of guessing whether a UPS is healthy, administrators can now see it. Plus, they have access to historical analysis of UPS behaviour. Built using off-the-shelf components, the device costs about ₹2,000 – roughly one-tenth the price of commercial monitoring cards. “Its affordability, power independence, and portability make it a practical option for cost-constrained environments,” concludes Sannidhya.

Research grounded in reality
What sets this work apart is not just the technology, but its origin. This was research born out of a real operational pain point, brought directly by the people responsible for keeping systems running. “It is important to note that IT staff, Mr. Prakash, is part of the research paper we have published. He is also part of the patent we have recently filed on this. This highlights the value of treating campus operations teams as co-creators of research problems rather than mere end users – a mindset that leads to more relevant and impactful outcomes,” states Prof. Chaudhari. In a landscape where academic research is often criticised for being disconnected from reality, this project offers a counter example of how researchers take note when a problem statement is identified, and build something that changes how systems are understood and managed.

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element14 has formed a new global distribution partnership with Fulham, expanding access to advanced LED drivers, emergency lighting and intelligent control solutions for customers across EMEA & APAC. The agreement strengthens element14’s lighting portfolio in the region, supporting engineers and buyers across commercial, industrial and architectural lighting applications.

Fulham brings more than 30 years of expertise in LED drivers, modules, emergency lighting and intelligent control systems. Headquartered in the United States, the company operates globally, with manufacturing in India, supply channels in India and China, and a strong presence across Europe. Its portfolio includes indoor and outdoor LED drivers, emergency lighting systems, UV ballasts, and smart control technologies, all designed to meet key international standards, including CE, ENEC, DALI-2, and UL.

Through this partnership, element14 will distribute Fulham’s lighting solutions globally, improving availability and access to future-ready technologies for engineers and buyers worldwide.

The agreement includes Fulham’s core lighting portfolio, including emergency lighting systems, indoor LED drivers, and constant-voltage driver platforms, with key ranges including the HotSpot Series, WorkHorse DALI-2 constant-current drivers, and the ThoroLED Series for architectural lighting, signage, and LED strip applications.

Customer benefits include:

• Broader access to certified, future-ready lighting technologies.
• Global availability through element14’s established distribution network.
• Support for a wide range of lighting applications and form factors.
• Access to Fulham’s deep technical expertise and proven product platforms.

Jose Lok, Global Product Category Director – Onboard Components & SBC, element14, said: “element14 has a strong commitment to adding value for our customers, and this partnership expands both choice and access to innovative lighting technologies. By working with Fulham, we are enabling customers worldwide to source advanced LED drivers, emergency lighting and control solutions through a trusted global distribution partner.”

Antony Corrie, CEO, Fulham, added: “Fulham is extremely excited to embark on this new relationship with element14. The partnership brings together shared values, strong heritage and a commitment to global innovation. element14 in APAC will be selling Fulham’s LED drivers, emergency battery backup solutions, exit signs and UV-C power systems across their global customer base.”

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Despite geopolitical tensions, manufacturing in India has done exponentially well, with smartphones leading the trail. According to data shared by CareEdge Ratings, India’s production has surged by 146% since 2021. The Performance Linked Incentive (PLI) scheme played a significant role in boosting electronics manufacturing from Rs 2.13 lakh crore in the Financial Year 2021 to Rs 5.45 lakh crore in the Financial Year 2025.

Additionally, the boost in production was aided by USD 4billion in FDI, where 70% was to PLI beneficiaries. Apart from economic benefits, the accelerated production has triggered a massive socio-economic multiplier effect. The electronics sector has been a dominant contributor to the 9.5 lakh jobs generated across all PLI schemes, providing significant direct and indirect employment. Simultaneously, electronics have climbed to become one of India’s top export categories. By shifting from an importer to a “net exporter” of mobile phones, India is successfully narrowing its trade deficit and reducing its long-term dependency on imports from neighbouring manufacturing hubs.

While the 146% jump is a historic achievement, the roadmap ahead focuses on “Deep Localisation.” The government and industry leaders are now pivoting toward high-value components, including semiconductor packaging and display manufacturing. As of January 2026, this momentum positions India to reach its goal of a $300 billion electronics production ecosystem, solidifying its role as a critical alternative in the global “China Plus One” supply chain strategy.

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by Saket Newaskar, Head of AI Transformation, Expleo

Enterprise architecture is no longer a behind-the-scenes discipline focused on stability and control. It is fast becoming the backbone of how organizations think, decide, and compete. As data volumes explode and customer expectations move toward instant, intelligent responses, legacy architectures built for static reporting and batch processing are proving inadequate. This shift is not incremental; it is structural. In recent times, enterprise architecture has been viewed as an essential business enabler.

The global enterprise architecture tools market will grow to USD 1.60 billion by 2030, driven by organizations aligning technology more closely with business outcomes. At the same time, the increasing reliance on real-time insights, automation, and predictive intelligence is pushing organizations to redesign their foundations. Also, artificial intelligence (AI) and machine learning (ML) are not just optional enhancements. They have become essential architectural components that determine how effectively an enterprise can adapt, scale, and create long-term value in a data-driven economy.

Why Modernisation Has Become Inevitable

Traditional enterprise systems were built for reliability and periodic reporting, not for real-time intelligence. As organisations generate data across digital channels, connected devices, and platforms, batch-based architectures create latency that limits decision-making. This challenge is intensifying as enterprises move closer to real-time operations. According to IDC, 75 per cent of enterprise-generated data is predicted to be processed at the edge by 2025. It highlights how data environments are decentralising rapidly. Legacy systems, designed for centralised control, struggle to operate in this dynamic landscape, making architectural modernisation unavoidable.

AI and ML as Architectural Building Blocks

AI and ML have moved from experimental initiatives to core decision engines within enterprise architecture. Modern architectures must support continuous data pipelines, model training and deployment, automation frameworks, and feedback loops as standard capabilities. This integration allows organisations to move beyond descriptive reporting toward predictive and prescriptive intelligence that anticipates outcomes and guides action.

In regulated sectors such as financial services, this architectural shift has enabled faster loan decisions. Moreover, it has improved credit risk assessment and real-time fraud detection via automated data analysis. AI-driven automation has also delivered tangible efficiency gains, with institutions reporting cost reductions of 30–50 per cent by streamlining repetitive workflows and operational processes. These results are not merely the outcomes of standalone tools. Instead, they are outcomes of architectures designed to embed intelligence into core operations.

Customer Experience as an Architectural Driver

Customer expectations are now a primary driver of enterprise architecture. Capabilities such as instant payments, seamless onboarding, and self-service have become standard. In addition, front-end innovations like chatbots and virtual assistants depend on robust, cloud-native, and API-led back-end systems that deliver real-time, contextual data at scale. While automation increases, architectures must embed security and compliance by design. Reflecting this shift, the study projects that the global market worth for zero-trust security frameworks will exceed USD 60 billion annually by 2027. As a result, this will reinforce security as a core architectural principle.

Data Governance and Enterprise Knowledge

With the acceleration of AI adoption across organisations, governance has become inseparable from architecture design. Data privacy, regulatory compliance, and security controls must be built into systems from the outset, especially as automation and cloud adoption expand. Meanwhile, enterprise knowledge, proprietary data, internal processes, and contextual understanding have evolved as critical differentiators.

Grounding AI models in trusted enterprise knowledge improves accuracy, explainability, and trust, particularly in high-stakes decision environments. This alignment further ensures that AI systems will support real business outcomes rather than producing generic or unreliable insights.

Human Readiness and Responsible Intelligence

Despite rapid technological progress, architecture-led transformation ultimately depends on people. Cross-functional alignment, cultural readiness, and shared understanding of AI initiatives are imperative for sustained adoption. Enterprise architects today increasingly act as translators between business strategy and intelligent systems. Additionally, they ensure that innovation progresses without compromising control.

Looking ahead, speed and accuracy will remain essential aspects of enterprise architecture. However, responsible AI will define long-term success. Ethical use, transparency, accountability, and data protection are becoming central architectural concerns. Enterprises will continue redesigning their architectures to be scalable, intelligent, and responsible for the years to come. Those that fail to modernise or embed AI-driven decision-making risk losing relevance in an economy where data, intelligence, and trust increasingly shape competitiveness.

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Nuvoton Technology announced the start of mass production of its high-power ultraviolet semiconductor laser (379 nm, 1.0 W) [1], which delivers industry-leading optical output in a 9.0 mm diameter CAN package (TO-9) [2]. This product achieves short wavelength, high output power, and long lifetime—three elements previously considered difficult for ultraviolet semiconductor lasers—through our proprietary device structure and advanced high-heat-dissipation packaging technology. As a result, it contributes to fine patterning and improved production throughput in maskless lithography [3] for advanced semiconductor packaging [4].

Achievements:

1. Achieves 1.0 W-class optical output at 379 nm, contributing to fine patterning and improved production throughput in maskless lithography for advanced semiconductor packaging.
2. Improves heat dissipation of ultraviolet semiconductor lasers through our proprietary device structure and packaging technology, suppressing device degradation from self-heat generation and ultraviolet light and contributing to the extended lifetime of optical equipment.
3. Expands the lineup of mercury lamp replacement solutions [5], enhancing flexibility in product selection to suit different applications.

Features of New Product:

1. Achieves 1.0 W-class optical output at 379 nm, contributing to fine patterning and improved production throughput in maskless lithography for advanced semiconductor packaging.

As demand grows for information processing capabilities driven by the evolution of artificial intelligence (AI), there is an increasing need for higher performance from semiconductors than ever before. On the other hand, as the miniaturisation of transistors approaches its physical and economic limits, semiconductor back-end package technologies and advanced semiconductor packaging, which allow for integration by arranging multiple semiconductor chips side by side or stacking them vertically, have been attracting attention.

In advanced semiconductor packaging, the mainstream method for forming wiring connections between multiple semiconductor chips has been exposure technology using the i-line (365 nm) of the mercury spectrum and photomasks (master masks of circuits). On the other hand, there has been growing interest in recent years in maskless lithography technology, which directly exposes (draws) wiring patterns based on design data without using photomasks.

This technology is considered to reduce the time and cost associated with the design and production of photomasks. Furthermore, because it is possible to directly imprint wiring patterns to match the surface shape of the target for drawing, alignment and correction are easier, and application to advanced semiconductor packages is currently under consideration.

As one of the key light sources in maskless lithography, semiconductor lasers have faced increasing demands for shorter wavelengths closer to the i-line (365 nm) and higher output, to enable finer wiring and improve equipment throughput. To meet these requirements, we have leveraged over 40 years of experience in laser design and manufacturing to develop and commercialise an ultraviolet semiconductor laser with a wavelength of 379 nm and an output of 1.0 W.

2. Improves heat dissipation of ultraviolet semiconductor lasers through our proprietary device structure and packaging technology, suppressing device degradation from self-heat generation and ultraviolet light and contributing to the extended lifetime of optical equipment.

Ultraviolet semiconductor lasers generally suffer from significant heat generation caused by low wall-plug efficiency (WPE)[6], and a tendency for device degradation caused by ultraviolet light, making stable operation at high output levels above 1.0 W difficult to achieve. To address this, we took a dual approach by focusing on both a “device structure that enhances wall-plug efficiency (WPE)” and a “high thermal conduction package technology that effectively dissipates heat,” enabling us to develop a product that successfully combines short wavelength, high output, and long lifetime: a 1.0 W ultraviolet (379 nm) device. As a result, we are contributing to extending the lifetime of optical devices that utilise ultraviolet light.

・Device structure to enhance wall-plug efficiency

In addition to optimising the emission layer and optical guide layer, we have adopted a proprietary structure that precisely controls the doping profile. By reducing light absorption loss and operating voltage, this allows electrical energy to be converted into light more efficiently.

・High thermal conduction package technology that efficiently dissipates heat

In addition to adopting a submount made of high thermal conductivity materials, the package materials have been revised to reduce thermal resistance. As a result, rises in device temperature are suppressed, allowing for stable operation at high output.

3. Expands the lineup of mercury lamp replacement solutions, enhancing flexibility in product selection to suit different applications.

This product has been newly added to our lineup of “semiconductor laser-based alternatives to mercury lamps,” providing customers with a new choice. With this addition, customers can flexibly select products according to application, installation environment, and required performance, thereby increasing the freedom of system design.

Details of this new product will be showcased at our booth at SPIE Photonics West 2026 in San Francisco, USA, and at OPIE’26 in Yokohama, Japan. We sincerely look forward to welcoming you.

Applications:

• Maskless lithography

・    Resin curing

・    Marking

・    3D printing

・    Biomedical

・    Alternative light source for mercury lamps, etc.

 Definitions:

[1] Ultraviolet semiconductor laser:

Our term is for a semiconductor laser that emits laser light with a peak wavelength of approximately 380 nm or less.

[2] TO-9 CAN:

CAN-type package with a diameter of 9.0 mm.

[3] Maskless lithography:

A technology that directly exposes photosensitive materials (resist) on a substrate based on design data without using a photomask and forms fine patterns. When using laser light, it is also referred to as Laser Direct Imaging (LDI).

[4] Advanced semiconductor packaging:

An implementation technology in which multiple semiconductor chips are densely integrated to optimise performance and power efficiency.

[5] Mercury lamp replacement solutions:

Nuvoton Technology’s lineup of semiconductor lasers is designed to replace the emission lines of mercury lamps: i-line (365 nm), h-line (405 nm), and g-line (436 nm). We propose the combined use of ultraviolet semiconductor lasers (379 nm), violet semiconductor lasers (402 nm), and indigo semiconductor lasers (420 nm).

[6] Wall-Plug Efficiency (WPE)

An indicator of the efficiency of converting electrical input into optical output. It is generally used to express the emission efficiency of semiconductor lasers.

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• Automotive Electronics Council (AEC) Q-100 Grade 1 qualified for operating temperatures of -40°C to +150°C (Tj)
• Read access time < 12.5ns
• 100K+ endurance cycles
• Data retention of > 10 years @ 125°C
• Only 1-bit ECC required
• Qualification of 32Mb macro at auto grade 1 conditions:
  • Zero bit failures (no ECC applied)
  • Peak yield reached 100%

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As the electronic industry moves past 2025, it advances with significant strides in electronic design systems, encompassing power efficiency, thermal management, and materials. Also, for India, 2025 remained a high-growth year in electronics, wherein the exports of the same grew sixfold from ₹1.9 lakh crore to ₹11.3 lakh crore in a decade. But all this can be sustained and progressed further only through a strong backing in R&D capabilities, as well as exceptional engineering capabilities and resources. In an exclusive conversation with ELE Times, Dr. Raphael Salmi, President – South Asia, Korea, and Japan Components, Arrow Electronics & Bhartendu Mishra, Managing Director – India, Arrow Electronics, discuss these issues in some detail.

Dr. Raphael Salmi notes, “ The role of distributors is rapidly evolving as technology accelerates and India’s electronics manufacturing sector expands,”  while he underlines the role of component distributors in India’s dynamic electronics landscape.

Challenges faced by Design Engineers in India

Apart from the core challenges of supply chain and reliable sourcing being evidently face-to-face in the electronics design industry, Dr. Salmi points towards a growing trend in the Indian landscape. He says,” There is an increasing demand for end-to-end engineering capabilities to accelerate innovation and achieve faster time-to-market.”

He adds that his company addresses these challenges by leveraging its extensive technology portfolio, deep engineering expertise, and comprehensive supply chain services coupled with a robust trade compliance program, aiming to empower innovation & resilience in India’s rapidly growing market.

Distributors’ Role – As India Chases the Electronics Dream

As India grows its electronics footprint, the role of electronics distributors is obvious to transform as it forms the very core of Research & development in the sector. To this, Dr. Salmi says, “The role of distributors is rapidly evolving as technology accelerates and India’s electronics manufacturing sector expands”.

Arrow does this by allowing its customers to outsource portions of their supply chain or specific elements of their bill of materials to it, while the companies can focus on research, development, and go-to-market strategies. This allows for enhanced efficiency and flexibility in the entire landscape. For Arrow’s role in India’s dynamically growing electronics landscape, Dr. Salmi says, “ For Arrow, India serves as a key hub for engineering, integration, and supply chain services. . We are committed to serving the Indian market by leveraging our extensive technology portfolio, engineering expertise, and supply chain capabilities to help customers innovate

faster and scale efficiently, and capture these burgeoning opportunities”.

Design Centre in India

Arrow’s recently inaugurated Arrow Engineering Solutions Center in Bangalore is a testament to its commitment to serve and rope in the Indian design engineering talent into the latest innovations in the sector. Bhartendu says, “  The center helps bridge gaps in local engineering capabilities and accelerates adoption of next-generation technologies, such as AIoT, edge computing, and intelligent sensing—reinforcing Arrow’s commitment to innovation and customer success.”

It enables world-class engineering support and advanced technology resources for sectors such as industrial, automotive, transportation, energy management, aerospace, and defense, he adds.

Arrow’s Beyond Components Approach

Arrow’s approach beyond components says a lot about its efforts to support and empower the design engineers. Beyond distribution, it enables supply chain management, engineering design, and integration services, allowing it to act as an extension of OEMs and suppliers’ product development teams.

Bhartendu Mishra, Managing Director – India, Arrow Electronics, says, “ Our robust compliance framework, global reach, and ability to deliver innovative solutions make Arrow a trusted partner for design engineers seeking reliability, expertise, and comprehensive support”.

Looking Ahead

Concluding the discussion, Dr. Salmi highlights Arrow Electronics’ commitment to empowering customers and suppliers across India and Asia-Pacific through its platform-based, data-driven model. The company is expanding value-added services in design engineering, integration, and supply chain management to help customers innovate faster and reach the market sooner. Continued investments in digital platforms will improve real-time access to inventory, pricing, and design resources, while a strong vertical focus on energy management, robotics, AIoT, and e-mobility will anchor Arrow’s growth strategy in the region.

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Gartner, a business and technology insights company forcasts the global AI spending to rise to $ 2.52 trillion this year through a 44% increase year-over-year.

“AI adoption is fundamentally shaped by the readiness of both human capital and organisational processes, not merely by financial investment,” said John-David Lovelock, Distinguished VP Analyst at Gartner. Organisations with greater experiential maturity and self-awareness are increasingly prioritising proven outcomes over speculative potential.

“Because AI is in the Trough of Disillusionment throughout 2026, it will most often be sold to enterprises by their incumbent software provider rather than bought as part of a new moonshot project,” said Lovelock. “The improved predictability of ROI must occur before AI can truly be scaled up by the enterprise.”

Building AI foundations alone will drive a 49% increase in spending on AI-optimised servers, representing 17% of total AI spending (see Table 1). AI infrastructure will also add $401 billion in spending as a result of technology providers building out AI foundations.

Table 1: Worldwide AI Spending by Market, 2025-2027 (Millions of U.S. Dollars)

Source: Gartner (January 2026)

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As the world transitions towards Industry 5.0, the notion of smart factories is no science fiction. The concept of smart manufacturing revolves around collecting, analysing, and using data from multiple sources to automate and optimise processes. India’s Smart factory market is projected to grow at a 14.3% CAGR (2025-30) to reach USD 15.6 billion by 2026. Among the various industries, the electronics and semiconductors sector is expected to be the fastest-growing in the adoption of Industry 5.0. The concept of Industry 5.0 thrives on three basic pillars­­– human-centricity and collaboration, sustainability, and resilience.

The game of smart manufacturing is all about the usage of data. The one who has the most holistic variety of data is bound to excel in the adoption and implementation of smart factories. From advanced automation, using AI, harnessing updated IoT technology, and big data analytics, the real deal of manufacturing lies in how well data can be used. Apart from these, the biggest innovations in Industry 5.0 are the use of ‘cobots’, or as one would call them, collaborative robots. Among the various technological advancements, the ‘Human-Machine Interface’ (HMI) is projected to be the fastest-growing technology segment in the Indian Smart Factory market.

Shifting from Industry 4.0

Industry 4.0 focused largely on technological advancement to boost the pace of production and its efficiency, and it was often said that this advancement of technology would eventually replace the human workforce. However, the trend changes with the adoption of Industry 5.0.

So, the idea now is that digitalisation will not make humans in industrial manufacturing obsolete; instead, it will integrate smart automation, systems, and devices in the workplace to promote cooperation and collaboration between humans and machines.

Technology in Smart Manufacturing

Core technologies under the smart manufacturing set-up of Industry 5.0 are said to work on edge-computing, cybersecurity measures, cloud-computing, Artificial Intelligence and Machine Learning, and big data analytics.

Edge and cloud computing in Industry 5.0 smart manufacturing offer real-time responsiveness (Edge), enhanced human-cobot collaboration, greater flexibility for mass customization, improved security/privacy, reduced costs/bandwidth, and powerful predictive analytics, with the cloud handling heavy storage/complex AI while the edge provides speed and reliability for immediate action, enabling personalized, sustainable, and efficient production.

Man + Machine Middleware

The contemporary concept of smart factories is no longer just automation through machines. Today, it is all about the ‘coexistence’ of humans and machines, and that is exactly what everyone is focused on!

While there is a buzz about AI taking over human jobs in the coming future, the real deal is that humans are central to manufacturing; however, the role of the human workforce will shift from handling repetitive and laborious tasks to indulging in customisation and creativity.

“The integration of AI and machine learning enables better human-machine collaboration where technology adapts to human needs on a real-time basis. IoT turns equipment into context-aware responsive assets. Digital twins enable engineers and operators to experiment in the virtual world, which is less risky and less cognitively demanding than the shop floor. Complex data is converted into easy-to-use visual and tactile interfaces with advanced HMIs, which can be used to make decisions faster and more safely,” reflects Prasad Kulkarni, Lead–Digital Transformation, Factory Automation Systems, Mitsubishi Electric India.

“Co” in Cobot

Imagine a workspace where a technician is hand-soldering a custom prototype while, just inches away, a robotic arm is flawlessly placing components the size of a grain of salt with 0.01mm precision. Meet your new favourite bench-mate. It doesn’t take coffee breaks, it never gets a “Monday morning” headache, and it can hold a PCB steady for hours without a single tremor. Cobots are the literal “Helping Hands” of Industry 5.0, filling the gap between rigid automation and the high-touch craftsmanship that modern electronics manufacturing requires.

“Cobots are designed with safety and human collaboration in mind. They include sensors and control systems that detect human proximity and can instantly slow or stop motion to prevent accidents. Their flexibility and ease of programming make them suitable for varied tasks such as assembly, material handling, and packaging. These features help reduce worker fatigue and ergonomic risk while maintaining process consistency. When used properly, cobots enhance productivity and workplace safety, enabling humans to focus on tasks that require judgment and creativity,” underscores Dr Sanjeev Srivastava, Business Head–Industrial Automation SBP, Delta Electronics India.

Throwing light on the working mechanism of cobots, Prasad Kulkarni, Lead–Digital Transformation, Factory Automation Systems, Mitsubishi Electric India, detailed, “Cobots are designed with safety, flexibility, and ergonomics as core principles. They are specifically engineered to work safely alongside human operators. This is achieved through built-in safety mechanisms such as force and torque limitation, advanced vision systems, proximity sensing, and real-time feedback, which enable immediate response to human presence. From an efficiency standpoint, cobots deliver high consistency and precision in tasks such as calibration, complex assembly, inspection, sealant application, etc.”

Adoption and Challenges

The complete adoption of smart manufacturing under Industry 5.0 is still a work in progress, but “Adoption of Industry 5.0–aligned technologies is steadily increasing, particularly among organisations seeking flexibility, scalability, and workforce sustainability. While early adoption has been led by larger enterprises, interest from mid-sized manufacturers is also growing. In the long term, this trend will result in more resilient supply chains, faster response to market changes, and a workforce that is better supported by intelligent automation,” confirms Prateek Jain, COO and Co- founder of Addverb.

The International Federation of Robotics predicts that 35% of worldwide manufacturers will implement Industry 5.0 technologies (such as cobots) over the next decade to unite automated systems with human capabilities.

The shift is not expected to take too long; however, there are certain challenges that one may face in the course of time. “One challenge is integrating advanced automation with existing equipment and processes without overwhelming operators. Smart solutions must be powerful yet intuitive. Connectivity and cybersecurity are also critical as more systems communicate across networks. Additionally, helping the workforce upskill and get comfortable with new tools is essential. While intelligent automation can improve efficiency and safety, it requires thoughtful design and training support so technology feels empowering rather than disruptive in everyday operations,” explains Dr Sanjeev Srivastava, Business Head–Industrial Automation SBP, Delta Electronics India.

In Near Future

Industry 5.0 technologies are already in use across several industries, from automotive to electronics manufacturing. AI-based vision systems are supporting human-led quality inspection in the semiconductor and FMCG sectors for early detection of defects while allowing humans to take the final decisions. Simultaneously, “digital twins are widely used to simulate new production lines and train operators before commissioning, particularly in automotive and heavy industry, reducing ramp-up time and risk. At the same time, manufacturers in energy-intensive sectors such as automotive and metals are using data-driven energy optimisation to lower power consumption and emissions. Together, these examples show how factory automation is evolving to be more human-centric, sustainable, and resilient – not just more automated,” says Prasad Kulkarni, Lead–Digital Transformation, Factory Automation Systems, Mitsubishi Electric India.

Ultimately, Industry 5.0 marks a transition from “how fast can we build?” to “how well can we collaborate?” For the electronics B2B sector, this isn’t just a technical upgrade; it’s a cultural renaissance. By weaving the irreplaceable intuition of human craftsmanship into the tireless precision of smart manufacturing, we are moving beyond cold, rigid automation. The future of silicon and circuitry lies in this hybrid harmony where cobots and creators coexist to drive innovation that is as personal as it is powerful. In this new era, the most sophisticated component on the factory floor will always be the human touch.

By: Shreya Bansal, Sub-Editor

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