ELE Times

NASH Energy, India’s first mass-scale LFP cell manufacturer, will showcase its latest energy storage and energy management solutions at the 50th edition of Middle East Energy 2026, being held from September 1–3 at the Dubai World Trade Centre.

At Booth Z3.E10, NASH Energy will present its capabilities spanning LFP cells, battery packs, battery management systems and energy storage solutions, addressing a range of applications across automotive, electric mobility, industrial and energy sectors.

The company will highlight solutions ranging from battery packs to large-scale energy storage systems, demonstrating its capabilities across the energy technology value chain. With in-house engineering, R&D and manufacturing capabilities, NASH Energy is developing customised energy solutions designed to address the evolving requirements of global customers.

NASH Energy has an R&D centre in Japan and operates an LFP cell and battery pack manufacturing line in Bengaluru, India. The company has invested significantly in strengthening its R&D and manufacturing capabilities, with the aim of developing and manufacturing advanced energy solutions in India for global markets.

The company’s portfolio includes LFP cells and battery packs designed for applications across electric mobility, industrial systems and energy storage. Its capabilities extend from cell technology and battery-pack development to the integration of battery management and monitoring technologies.

NASH Energy’s energy technology portfolio is complemented by firmware and battery management capabilities developed by NASH Industries, including Battmonx, Battery Management Systems (BMS) and EVolt. These technologies enable battery monitoring, management and automation, supporting the development of connected and intelligent energy applications.

Commenting on the company’s participation, Mr. Sanjay Wadhwa, Chairman & Managing Director, NASH Group, said, “The energy ecosystem is undergoing significant transformation, with growing requirements for reliable energy storage, intelligent battery management and connected technologies. At NASH Energy, we are building capabilities across the energy value chain, from LFP cells and battery packs to integrated energy-storage solutions. Our investments in R&D and manufacturing are focused on developing scalable, application-specific energy solutions from India for global markets. Middle East Energy provides an excellent platform to engage with customers and partners in the region, understand their evolving requirements and demonstrate how our technologies can support the next generation of energy applications.”

NASH Energy’s solutions cater to applications across automotive and electric mobility, renewable energy, industrial equipment, energy storage and other emerging energy applications. The company’s integrated approach combines battery technology, engineering and manufacturing capabilities to support customers from product development through to scalable production.

The Middle East is emerging as an important market for energy storage and intelligent energy solutions as industries and infrastructure increasingly seek reliable, efficient and scalable energy technologies. Through its participation at Middle East Energy 2026, NASH Energy aims to engage with customers, technology partners and industry stakeholders and explore opportunities to develop application-specific solutions for the region.

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Electronic waste has the potential to be a source of valuable metals because a group of scientists have developed an experimental method for recovering gold from electronic waste. A research group at ETH Zurich has identified an experimental way to selectively recover gold from e-waste and have then gone on to converted the recovered material into a gold containing nugget.

Gold’s properties of electrical conductivity and resistance to corrosion make it ideal for use in components in semiconductor devices. Unfortunately, recovering gold from old computer circuit boards can be challenging, and old methods can use up huge amounts of electricity with and also harmful chemicals which generate hazardous waste and potentially harmful emissions that can pollute the environment and pose risks to human health.

A team of researchers at ETH Zurich manufactured a porous protein-based aerogel which is selective in terms of gold ion binding from solutions that contain metals recovered from discarded computer equipment. The team recovered metal material from 20 computer motherboards, dissolved them in an acid solution and tested how selective was the recovered material.

The solution obtained now consisted of several species of metal ions. The researchers then added the aerogel. The aerogel captured the gold ions from the solution. The captured gold was subsequently converted into flakes, and melted to produce a solid gold nugget.

The reported experiment produced approximately 450 mg of a metal nugget from 20 discarded computer motherboards, containing 91% gold and 9% copper, corresponding to approximately 21-22 carats. This research demonstrated a gold absorption capacity on the scale of 166.7 mg/g of aerogel which is considerably high.

The technology could create a method for extracting precious metals from abandoned PCs and other electronic waste items and help further a circular economy in the process. According to the ETH Zurich economic analysis, the cost of combined material sourcing and energy during recovery of precious metals were substantially lower than the value of the recovered gold under the study’s assumptions.

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The EV charging infrastructure sector in India is moving away from merely providing hardware to offering digitally connected and interoperable charging services. A prime example of this transition is the recent partnership between Hyundai Motor India (HMIL) and Jio-bp, aiming to combine the EV charging infrastructure with its digital platform, making it easier for EV users to discover and access charging stations.

As part of the new collaboration, Hyundai Motor India will now be connecting over 7,000 Jio-bp pulse charging points across more than 300 Indian cities directly into its myHyundai application. Through this, the total number of available charging points through myHyundai app grows to more than 37,000, thereby making charging options readily available for EV customers at one place.

The primary purpose of this collaboration is to offer improved accessibility and convenience for EV charging stations using a digitally integrated approach. Rather than drivers having to search across multiple charging apps, the myHyundai platform can allow drivers to be connected to more of the charging network through a single platform.

This highlights the increasing significance of interoperability within the EV ecosystem. With individual charge point operators running their own networks, apps and payment systems, incompatible digital ecosystems can fragment the public charging experience for EV drivers. Software linking networks together can reduce this fragmentation.

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Driven by the need for alternatives to traditional lithium-ion solutions, India’s push for the indigenous iron-air battery system utility-scale testing is to begin at NTPC’s Simhadri Super Thermal Power Station (STPS) in Andhra Pradesh. To be executed under the aegis of the Atal Incubation Centre – Anna University (AIC-AU) and scheduled to commence in August 2026, the pilot will test deep-tech start up Meine Electric’s long-duration energy storage (LDES) solution.

Iron-air batteries generate stores and release electrical energy through an electrochemical reaction that undergoes oxidation and reduction reactions an iron-based negative electrode and utilizing oxygen contained in ambient air. Discharging occurs by oxidizing iron to produce electricity and during the charge step the iron-containing reaction products are reduced, regenerating iron. This chemistry adds an alternative approach to long-duration energy storage with the potential for high power or long cycle life applications beyond those readily delivered today by current lithium-ion technologies.

According to Meine Electric, the Fast Charge Long Discharge is a six-hour charge and eighteen-hour discharge cycle. In addition, Meine Electric’s technology was also independently tested by CES and evaluated on performance in terms of electrochemistry as well as operational durability and capacity retention.

At present, the applications of the Simhadi pilot are more focused on stationary energy storage than on the EV traction applications, but it has future relevance to electric mobility since long-duration storage technology could enable the use of renewables, increase grid flexibility, and provide more reliable power supply.

In the future, with EV charging networks scaling up in India, large scale storage could eventually help charging infrastructure to balance the variations between renewable electricity generation and EV demand. This is especially the case in higher power charging hubs and corporate EV fleets.

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With the increasing growth rate of electrical vehicle adoption in India, a paramount concern of battery reliability, safety and lifespan arises. Conventionally, Battery Management Systems (BMS) have monitored parameters such as voltage, current and temperature constantly. But with the modern technology approach of integrating artificial intelligence (AI) and machine learning (ML), battery management could be transformed from conventional monitoring into a predictive system capable of identifying degradation patterns, detecting abnormalities, estimating battery health, and supporting predictive maintenance.

One key application is a State of Health (SoH) prediction, that represents the state of the battery compared to their original state of capacity or performance. ML models can be used with charging and discharging curves, temperature, current, voltage and past usage history to predict battery degradation, avoiding periodic physical tests.

Likewise, Data-driven algorithms are also useful for the estimation of state of charge (SOC). To accurately estimate the remaining usable energy is crucial in order to enhance driving range prediction. ML models can be a good supplement to current approaches (such as coulomb counting, model-based estimation), especially in varying conditions.

Other applications being developed include remaining useful life (RUL) prediction. Algorithms trained on historical data for degradation behaviour may use battery performance to determine how long a battery or cell could last before a certain level of performance was reached. This might enable predictive maintenance and warranty management.

As a part of the growing Indian EV manufacturing community shifting to connected cars and data-driven fleet management it is possible that an AI-based BMS might evolve as one more layer within the EV system. High-performance prediction would again depend on accuracy of the sensor inputs, quality of algorithm and computational capacity available and to be validated across various conditions.

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The Automotive Skills Development Council (ASDC) recently hosted its 15th Annual Conclave 2026 in New Delhi. The conclave brought together more than 500 representatives from government, industry, academia and the automotive sector to deliberate on the skills required to support India’s evolving automotive industry. The theme of then event was: “Skilled Hands, Strong Nation: Building India’s Automotive Future.” The conclave was inaugurated by Shri H. D. Kumaraswamy, Union Minister of Heavy Industries, who underlined the importance of preparing India’s workforce for emerging technologies.

Addressing the gathering, the union minister said, “India’s automotive sector is a powerful engine of growth, creating opportunities across engineering, electronics, components, logistics, software, services and employment. As India expands its manufacturing capabilities and global value-chain presence, developing a skilled workforce that meets global standards of quality, productivity, safety and innovation is critical.”

He highlighted that the shift to electric mobility is creating new opportunities while increasing demand for skilled professionals in battery technology, high-voltage systems, power electronics and advanced diagnostics. Strengthening the link between education, skilling and employment must therefore remain a national priority. Through the Skill India Mission, the Government is committed to building a future-ready automotive workforce and positioning India as a global hub for skilled talent, contributing to the vision of ‘Viksit Bharat @2047.’

Speaking at the conclave, Vinkesh Gulati, Chairperson, Automotive Skills Development Council (ASDC), said, “India’s automotive industry is at an important inflection point, with electric mobility, advanced manufacturing, AI and Industry 4.0 rapidly reshaping not only vehicles and factories, but also the skills required across the automotive value chain. Our focus at ASDC is to ensure that skilling evolves at the same pace as technology. The real measure of our success is not just the number of people trained, but how effectively those skills translate into employability, productivity and meaningful career opportunities.”

Highlighting ASDC’s increasing focus on future technologies and global capability building, he spoke about the development of seven EV skill labs across India and internationally, including facilities in Chennai, Vadodara and South Africa. These initiatives are aimed at providing hands-on exposure to emerging automotive technologies and creating a workforce equipped to meet both domestic and global industry requirements. Gulati also presented ASDC’s Performance Report for 2025–26, highlighting the Council’s expanding initiatives across industry partnerships, women’s participation, academia-industry collaboration, emerging technologies and employment-linked skilling.

As India aspires to become a global automotive and mobility hub, our competitive advantage cannot come from manufacturing scale alone. It must also come from the quality of our talent, mentioned Gulati. “Future-ready vehicles will need a future-ready workforce, and India has the opportunity to become not only a global manufacturing hub, but also a global talent hub for the automotive industry.”

The conclave emphasized on strengthening partnerships between the skilling ecosystem and industry. The event saw MOU exchanges with Kia Motors India Private Limited; Kukje Business Solution Private Limited and Rossik East Europe SRL; Shell India; and Lucas India Service Limited. The conclave further marked important milestones in ASDC’s skilling and employment journey through the launch of its Annual Report 2025-26, the flag-off of candidates proceeding to Romania and a convocation ceremony.

Attendees witnessed two high-level industry panels addressing critical challenges across the automotive skills and employment ecosystem. The first panel, “The Last Mile Workforce: Building a Pipeline of Technicians and Entrepreneurs,” examined the need to create a robust pipeline of skilled technicians and entrepreneurs capable of supporting the industry’s expanding requirements. The second panel, “From Training to Employment: Strengthening the Skill-to-Industry Pipeline,” focused on strengthening the connection between training and actual employment opportunities, with discussions around industry requirements, job readiness and the need for greater alignment across the skill-to-employment value chain.

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The Centre for Development of Telematics (C-DOT), the premier telecom R&D centre of the Department of Telecommunications (DoT), Ministry of Communications, Government of India, celebrated its 43rd Foundation Day on 25 August 2026 at BHIM Hall, Dr. Ambedkar International Centre, New Delhi. The occasion marked 42 years of C-DOT’s contribution to the development of indigenous telecom technologies since its establishment in 1984.

Jyotiraditya M. Scindia, Hon’ble Union Minister of Communications and Development of North Eastern Region; Dr. Chandra Sekhar Pemmasani, Hon’ble Minister of State for Communications and Rural Development; and Shri Amit Agarwal, Secretary (Telecom) and Chairman, Digital Communications Commission, graced the occasion along with other senior officials, industry representatives and distinguished guests. The Foundation Day exhibition was inaugurated by both the ministers.

The Ministers also unveiled the Quantum Products Wall, showcasing C-DOT’s indigenous Quantum Series comprising of 14 products covering both Quantum Key Distribution (QKD) and Post-Quantum Cryptography (PQC) solutions developed to strengthen the security and resilience of India’s communication networks in the emerging quantum era. The product showcase at the exhibition, provided an opportunity to showcase C-DOT’s indigenous technologies and solutions across various domains of telecommunications. The dignitaries thereafter were briefed at the exhibition on the various indigenous telecom technologies and solutions developed by C-DOT.

During the inaugural session, the Hon’ble Ministers and senior dignitaries launched a Quantum Product booklet, which is a consolidation of C-DOT’s indigenous quantum solutions. The booklet presents C-DOT’s work in Quantum Key Distribution (QKD) and Post-Quantum Cryptography (PQC), highlighting the Centre’s efforts towards developing secure, resilient and future-ready communication technologies.

Addressing the gathering, Shri Jyotiraditya M. Scindia, Hon’ble Union Minister of Communications and Development of North Eastern Region, lauded C-DOT as an institution with the potential to transform not only India but also contribute to shaping the technological landscape globally. Highlighting C-DOT’s work in 5G, 6G, cybersecurity and disaster resilience, he emphasised the importance of taking indigenous innovations from the laboratory to the market. The Minister also highlighted the importance of strengthening indigenous research and innovation to create technologies that can serve national requirements and also position Indian technologies on the global stage.

He said that the spirit of “Atmanirbhar Bharat” and “Make in India” would attain its true potential when India not only develops technologies domestically but also “makes for the world”. Dedicating the occasion to C-DOT’s young engineers and researchers, he highlighted the true reflection of each letter of the name C-DOT in their Curiosity, spirit of Disruption, Ownership and Tenacity. He urged them to nurture their thirst for invention, challenge boundaries and harness their courage and capabilities to build technologies for the future, observing that the spirit of “Jai Vigyan, Jai Anusandhan” lies within the young minds of C-DOT.

The Foundation Day celebrations focused around a day-long conference themed “Beyond Connectivity: Secure, Trusted and Intelligent Communication”. It brought together senior government officials, policy makers, industry leaders, technology experts and academia to deliberate on emerging technologies and the evolving communication landscape.

Speaking on the occasion, Dr. Rajkumar Upadhyay, CEO, C-DOT, said, “C-DOT’s journey over the past 42 years has been driven by its commitment to developing indigenous technologies for the nation. As telecommunications move beyond conventional connectivity, our focus is expanding towards secure, trusted and intelligent communication systems. Through our work in cybersecurity, quantum-secure communications, 6G and other emerging areas, C-DOT remains committed to strengthening India’s technological self-reliance and contributing to the development of globally competitive telecom technologies.”

The 43rd Foundation Day celebrations showcased C-DOT’s commitment to advancing indigenous research and innovation and contributing to the development of a secure, trusted and future-ready digital communications ecosystem. As it enters its 43rd year, C-DOT continues its research and development efforts in 6G, quantum-secure communications and other emerging technologies. This is in line with the vision of Atmanirbhar Bharat and India’s ambition of positioning the country as a global leader in next-generation, trusted connectivity.

Q-AKSHAY CD is a compact, fibre-based Quantum Key Distribution (QKD) system based on Coherent One Way (COW) and Differential Phase Shift (DPS) protocols in a compact 1U size. It enables secure quantum key generation and distribution over fibre networks.

Q-AKSHAY MD is a fibre-based QKD system based on the Measurement Device Independent (MDI) protocol, offering enhanced security against vulnerabilities associated with measurement devices. It represents C-DOT’s next-generation approach to secure quantum key distribution.

C-SPD is a Single-Photon Detector, a critical sub-module used in quantum communication systems.

C-RD is a wideband RF driver designed to drive intensity and phase modulators used in quantum communication systems. It serves as a critical sub-module for enabling high-performance quantum communication applications.

Q-SETU is a quantum-safe encryptor designed to secure Layer 3 communications with a throughput of up to 80 Mbps. It incorporates NIST Post-Quantum Cryptography (PQC) algorithms to protect data against emerging quantum-era threats.

Q-MAHASETU is a next-generation, commercial-grade quantum-safe encryptor supporting Layer 2/3 networks with throughput of up to 40 Gbps. It uses NIST PQC algorithms to provide high-speed, quantum-resistant protection for enterprise and critical communication networks.

Q-VIKRAM is a defence-grade quantum-safe encryptor providing up to 1 Gbps throughput for Layer 2/3 networks. It incorporates NIST PQC algorithms to provide enhanced protection for sensitive and strategic communications.

Q-AMOGH is a high-speed quantum-safe optical encryptor providing up to 200 Gbps throughput at Layer 1. Based on NIST PQC algorithms, it is designed to secure high-capacity optical communication links against emerging quantum threats.

Q-DARSHAN is a quantum-safe video IP phone incorporating NIST PQC algorithms to protect voice and video communications. It brings quantum-safe security directly into IP-based communication systems.

Q-VACHAN is quantum-safe In-line node for IP phone, NIST PQC algorithms, it can upgrade existing IP phones with quantum security.

Q-RAQSHAK is a quantum-safe enterprise network solution designed to protect enterprise communications and network infrastructure. It incorporates NIST PQC algorithms to provide protection against current and future cryptographic threats.

Q-VAAYU is a quantum-safe wireless point-to-point network solution designed to secure wireless communication links. It uses NIST PQC algorithms to provide quantum-resistant security for wireless connectivity.

Q-VAJRA1000 is a quantum-safe access node designed to upgrade existing communication networks with quantum security. It can support technologies such as GPON and wireless radios, enabling quantum-safe protection to be integrated into existing network infrastructure.

Q-PARAKRAM is a defence-grade quantum-safe encryptor providing up to 1 Gbps throughput for Layer 2/3 networks. It incorporates NIST PQC algorithms and is designed to provide robust quantum-resistant security for strategic and defence communications.

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Abhishek Pandey | Sub-Editor | ELETimes

​“How little smart robots in swarms are revolutionizing farming; one field at a time.”

Agriculture’s history has always been based on years of experience, sheer muscle, and eventually- better machines. Farming tools like tractors grew bigger, irrigation more complex, and harvest more automated. But even with all this progress, many of today’s agriculture issues- labour scarcity, inclement weather, skyrocket costs, depleted soil and the demand for more food- seems harder than ever to solve.

What if the future farming technology wasn’t about big machines and instead would use thousands of smaller ones to collaborate like an ant colony?

But this isn’t just future science fiction anymore. We already see teams of robotics swarmer’s-teams of small, autonomous bots working together in a group to coordinate actions, communicate, and make collective decisions-at the hands of university researchers and agricultural tech firms. Using cutting- edge AI and loT, a tight wireless connection, Edge AI, these minute devices are re-shaping how we cultivate, protect, watch, and harvest our food.

Farmers of the future will perhaps abandon expensive machinery in favour of a hundred robots the size of shoebox collaborating with a hive mind, say scientists who drew inspiration for their robot swarm from living creatures. It will adapt and regroup on the fly, even if one of its number malfunctions.

It might therefore surprise you that swarm robotics didn’t start out in some engineering lab. Instead, it began with observation in nature. Bees build intricate underground nests that never had any leader to order each individual around. They would fly in coordinated swarms to protect their nest and gather food. Bees have the ability to marshal thousands of workers together and fly in formations, their flight directions will adjust by themselves depending on the directions of adjacent rather than order from the commander.

Together that enables an extraordinary smart system to function based on a number of individuals’ quite simple activities. Inspired by such an instinct, the engineers adopted the concept of the design to implement the concept of swarm robotics- a discipline that entails many-or sometimes a hundred-small robots units working together for tasks that could otherwise not be achieved by a solitary unit. Each unit senses the surrounding, communicates it to its close peers and modifies its behaviour according to the information aggregated.

This collective intelligence, known as a “Hive Mind” is swarm robots, is one of the reasons that this emerging field of robots, sometimes referred to as swarm intelligence, is such a rapidly growing area for research and robotics in general.

The amount of pressure being placed on modern day farming today is huge. Weather and the climate have become increasingly unpredictable with climate change. Water resources are dwindling in many regions. There is a global need for increased food production with fewer resources, in a manner that protects the environment.

Meanwhile, many countries are encountering shortages in labour supplies and there have always been issues finding workers to support agriculture planting and harvesting. Many traditional solutions to some of these issues create others, though. Large tractors can pack the soil, guzzle a lot of fuel and often approach entire fields in the same manner, even when the crop will not require the same treatment for every square foot of the field.

This is exactly where precise agriculture starts to kick into gear. So instead of spraying a field with one spray the technology can be used to determine exactly what the individual part needs for precision agriculture. Robot swarms take it to the extreme allowing thousands of small decisions to be made constantly throughout a field.

It’s not the one machine to do it all that is forming the basis for the agriculture robot swarms. Instead, responsibilities are shared.

The robot inspects the moisture level of the soil or checks the nutrients level of the plants. Other robots can scan fields to pinpoint weeds or monitor crop health from up in the air using drones and look at single plants up close with robots on the ground. Some even deliver a precise dose of pesticides or fertilizer just where the plant needs it.

If one robot detects something abnormal, it alerts its robot peers, which can help further assess the situation, and coordinate actions. This constant communication ensures that the farms are able to respond in a far more dynamic way that older farming systems ever could.

The brain power comes in the form of AI and Edge AI technology for these robots. Instead of transmitting all images and sensor data back to faraway cloud servers, the majority of robots process them in real-time, so they can react to shifting field conditions. If, for instance, a robot notices a weird pattern in leaf discoloration, it doesn’t need to pause for seconds or minutes while it’s being told what to do.

The robot can scan a picture, compare it to its earlier recordings, and can send nearby robots the signal nearly in real time. Combining this local knowledge with the power of coordinated communication enables the development of a quicker and more robust farming system.

The great thing about swarm robotics is that they are capable of being very precise. Some traditional spray equipment has the capacity to apply treatment across a whole field without differentiating between individual plants. But there are many plants which will never receive a benefit from pesticide or fertilizer applications. On the other hand, swarm robot design is more open.

Through the use of cameras, sensors, and artificial-intelligence image recognition, they can tell weeds apart from the plants or can identify if the plant has deficiency and needs more food. Why spray everything on the meter area, when it is not necessarily the problem. This leads to less chemical input, more healthy soil, reduced production costs and increased crop quality. That adds up to more efficient farming- while keeping it sustainable.

However, the benefit of robotic swarms isn’t only to increase output. Heavy machinery for agriculture presses on the ground with more weight, while light weights robots make less pressure on the soil thus saving the structure for a long time.

Their electric system reduces reliance on the combustion of fossil fuel, which means lower emissions of carbon dioxide. As farmers always keep an eye on their crop, they are alerted of potential pests, diseases, lack of water or deficiency in any of the necessary nutrients at a much early stage. The very fact that problems can be spotted much easier ensures that they don’t snowball into big losses.

Swarm systems collect useful information to make better planning for the future as well. A farmer will know better on how his performance has been during a season and identify the repetitive problems encountered each season so as to have a better planning on what he or she needs to harvest next.

While the technology is promising, the applications of swarm robotics are still a work in progress. The difficult and complex engineering task of producing low-cost, robust robots capable of withstanding challenging weather is a key priority for robotics researchers worldwide. Harsh environments-characterized by dust, rain, mud, rough terrain-pose significant hurdles for autonomous machines. Battery power is also another issue which limits how long robots, particularly small, heavy robots equipped with sensors, can be operational.

Hundreds of autonomous machines to stay secure, reliable and resilient, as cybersecurity is rapidly becoming a vital aspect of every automation process. There are also questions of economic nature. Despite the fact that robotic swarms help cut down expenses in the long run, a farmer on a small scale might find a steep initial investment to be a burden if they can’t obtain funding, or set up a cooperative model to share these expenses.

The researchers think that it is early days for the technology. In the future, farming might involve integrated networks of autonomous tractors, swarms of robotics weeders and harvesters, aerial drones, satellites, weather models, and AI-powered analytics, forming a smart farming ecosystem.

Rather than being a substitute for farmers, these tools will likely be excellent decision-making support tools that enable the farmers to use their experience, intuition, and judgement along with robots taking care of very specific, laborious, and highly repeatable and high precision tasks. Technologies are being rapidly developed in the 5G, Edge AI, robotics and sensor spheres that are making fully integrated smart farming closer than ever.

For centuries, technology has been driving innovation in agriculture, from handheld implements and animal-powered plows to automated machinery and GPS-guided tractors. This latest agriculture revolution may not come in larger machines, but in millions of smaller, more intelligent ones.

Bur swarm robotics, artificial intelligence-assisted farming and precision agriculture, for example, indicate that the ways in which we can grow food in the future could be entirely different, with help from miniature robots coordinated like nature’s own organized swarms and ant colonies. The key: They’re showing that smart behaviour doesn’t always reside within an individual, highly intelligent system, but can be generated from multiple, cooperating units working together towards a collective objective.

And if this picture continues to evolve, the farm of tomorrow won’t just be automatic, but cooperative, fluid, connected and profoundly effective. Tomorrow, the tiniest hands can get the biggest job done in a field.​

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Prashant Verma | Sub-Editor | ELETimes

Modern electronic devices are becoming smart and more efficient with the passage of time. They give high-performance computing power, 5G speed network support, auto pilot mode in EVs like Tesla, Artificial Intelligence (AI), and cloud computing. These features have made human life more comfortable than before because now modern processors can integrate tens of billions of transistors on a single silicon die by using advanced manufacturing nodes. These innovations in semiconductors significantly improve computational performance. However, they also introduce a critical engineering challenge such as managing heat while maintaining a stable power supply throughout the chip.

A single operation in electronic devices can allow billions of transistors to operate simultaneously at frequencies exceeding several gigahertz and thus generate a substantial amount of heat. If the generated heat is not effectively dissipated, the chip’s temperature rises which can cause performance degradation or lagging of a system. Thus, thermal management plays a significant role in maintaining the temperature of semiconductor devices to ensure that the chip’s temperature is constant throughout the operation.

Heat in semiconductor devices is produced by the flow of electrical current during transistor operation. As electrons move through the semiconductor material, some kinetic energy is converted into heat because of the device’s internal resistance.

Modern digital electronics use CMOS transistors because of their high integration density and low power dissipation. It is used to manufacture nearly all integrated circuits (ICs). Every CMOS transistor consumes power through two primary mechanisms which contribute to heat generation.

• Dynamic Power
• Leakage Power

Dynamic Power: It is the energy consumed when a circuit actively switches between logic states (0 and 1). The primary role of dynamic power is to provide energy for switching the transistor between logic states. The higher the operating frequency and switching activity, the greater will be the consumption of dynamic power which will generate more heat.

Thermal management controls this heat through the following methods:

1. System-Level Active Cooling: It provides cooling through fans or circulating dielectric liquid.
2.  Circuit and Architecture-Level Management: It lowers the supply voltage and clock frequency when there is less workload on the system.
3. Semiconductor and Packaging-Level Dissipation: It includes dummy metals placed below hot CMOS junctions to draw heat away from the microscopic transistor level.

Leakage Power: It is defined as the electrical energy wasted as heat due to continuous current flowing through the semiconductor device even when the device is in idle state. Several physical mechanisms generate leakage in modern transistors such as subthreshold leakage, reverse-bias PN junction, and gate oxide tunneling. It is a major challenging problem in thermal management.

1.   Power Gating: It is a circuit design technique that reduces power consumption by completely shutting off the power supply to idle regions of the chip.
2. Dynamic Voltage and Frequency Scaling: Lowering the supply voltage and clock frequency during tasks that require low computation power to reduce overall power and subsequently lower operating temperature.
3. Thermal Floor planning: It is a chip design technique to minimize leakage heat by strategically arranging different heat generating circuits across the chip.    Thermal Management plays an important role in maintaining the optimal temperature of electronic devices.

While thermal management focuses on removing heat, power integrity focuses on delivering required stable power to every transistor on the chip. This ensures that the device operates efficiently under all operating conditions.

Why Power Integrity is required in Semiconductor Devices?

The major requirement of power integrity is to prevent voltage fluctuations and noise that can cause logic errors, timing failures, and performance degradation. Following are the list of primary reasons why power integrity is essential in modern semiconductor devices:

• Preventing Voltage Drop: Voltage practically drops when millions of transistors switch simultaneously. Power integrity minimizes voltage drop by minimizing the impedance of the Power Distribution Network (PDN).
• Controlling Clock Jitter: Clock jitter is the unwanted, short-term variation in the clock signal caused by noise sources such as power supply variations and electromagnetic interference.
• Reducing Electromagnetic Interference (EMI): A well-designed Power Distribution Network (PDN) delivers suitable power across the transistors of the chip that reduces electromagnetic interference which eventually reduces power consumption and improves thermal performance.

Modern semiconductor devices deliver enhanced computational power. However, they also face critical power integrity challenges such as ensuring suitable power delivery across a chip, despite shrinking transistors size and massive current surge. Following are the key challenges in Power Integrity:

1. IR Drop: Current flowing through the resistance (metal interconnects) causes voltage loss. This voltage reduction is known as IR Drop. In semiconductors, a higher current flowing through a resistive interconnect results in a large voltage drop. If the voltage reaching a functional block falls below its required operating level, functional errors may occur. Engineers must therefore optimize​ the power grid to minimize IR drop across the chip.
2. Simultaneous Switching Noise (SSN): It is the voltage fluctuations created within the power delivery network when multiple transistors switch simultaneously creating a sudden surge in current demand. If SSN is not controlled, it can cause timing errors, signal integrity issues, and unreliable operation. Engineers minimize Simultaneous Switching Noise (SSN) by optimizing the Power Delivery Network (PDN) and controlling on-chip switching dynamics.
3. Power Supply Noise: It is defined as an unwanted variation in current and voltage on a DC power line. It includes high frequency spikes and voltage drops caused by switching regulators and high-speed switching of transistors inside the chip.

Power supplies are never perfectly stable. Without sufficient decoupling capacitance and well-designed power distribution network, Power Supply Noise occurs as voltage ripple across the chip. One of the major challenges in modern semiconductor devices occurs due to the simultaneous switching of billions of transistors, lower operating voltages, increasing clock frequencies, and high-power density. Engineers reduce power supply noise by building on-chip decoupling capacitance, using thicker metal power grids to lower resistance, and integrating voltage regulators directly onto the chip.

Thermal management and Power integrity are closely linked to each other. As power delivery losses generate heat and increasing temperature slows down electrical efficiency and increases resistance. To prevent any hindrance in the performance of a system, it is essential to perfectly balance these two disciplines during the design process.

Modern semiconductor companies treat both thermal management and power integrity as a single discipline while evaluating throughout the design process using advanced Electronic Design Automation (EDA) tools. This co-optimization approach enables engineers to achieve higher performance, lower power consumption, and improved long-term reliability in advanced semiconductor devices.

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Texas Instruments (TI) today introduced the industry’s first multiaxial coreless Hall-effect current sensor designed for all hybrid electric vehicle and electric vehicle (HEV/EV) traction inverter applications. The TMCS2100-Q1 sensor offers a first-of-its-kind approach to current sensing through the combination of multiaxial measurement and a proprietary algorithm, eliminating the trade-off between precision and system size in traction inverter designs.

While existing coreless solutions are limited to single-axis measurements, the TMCS2100-Q1 sensor is the first to measure magnetic fields in both horizontal and vertical directions. This multiaxial measurement is 20 times more accurate than single-axis alternatives, achieving displacement error of less than 1% at 0.4mm movement and as low as 0.25% at 0.1mm. This level- of precision improves the EV powertrain torque control loop, maximizing efficiency and power delivery across varying load and thermal conditions.

“For the first time, engineers have a Hall-effect current sensor that breaks through the limitations of existing solutions, which is especially critical as 800V architectures raise the bar for traction inverter accuracy,” said Jason Cole, vice president and general manager, Sensing Products at TI. “Leveraging advanced research from TI’s Kilby Labs – our advanced R&D engine – the TMCS2100-Q1 was developed to give automakers a tool to build HEVs and EVs where tighter current measurement translates directly into longer range, smoother ride quality and more efficient motor control.”

Why does it matter?

Automakers are continuously looking to make traction inverters lighter and more efficient to extend driving range and enhance vehicle performance. Traditional measurement approaches present designers with a fundamental trade-off:

• Solutions with a magnetic core – or C-core implementations – deliver accuracy but add size and weight.
• Coreless alternatives are smaller but compromise precision due to displacement error and magnetic crosstalk.

TI’s current sensing technology addresses this trade-off by:

• Measuring both axes simultaneously: vibration during vehicle operation creates movement between the sensor and conductor, causing single-axis, differential coreless sensors to lose accuracy. The TMCS2100-Q1 sensor significantly reduces vibration-induced error by measuring magnetic fields in both horizontal and vertical axes at once.
• Maintaining accuracy: reducing error and maintaining accurate current measurement minimizes magnetic crosstalk influence and torque ripple, a cause of jerky acceleration, motor noise and inefficient operation that reduces range.

By eliminating the magnetic core without sacrificing precision, the TMCS2100-Q1 sensor enables smaller, more power-dense traction inverter designs, helping automakers build EVs that are more efficient, longer-range and more enjoyable to drive. This device is the latest innovation in TI’s automotive portfolio, demonstrating our continued investment in addressing customer challenges throughout the entire vehicle.

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Rohde & Schwarz has announced the launch of a new AI/ML Design centre, as the technology giant prepares for the next step towards chip design within its existing Bengaluru facility. For the first time, this new design centre will bring dedicated artificial intelligence, machine learning, and future chip design capability to the campus. The announcement was made by Christian Leicher, President & CEO of Rohde & Schwarz.

The expansion will add a specialised space focused on artificial intelligence, machine learning, and advanced chipset design. The company expects to create several new hi-tech roles over the next 2-3 years. Commenting on the development, Leicher said, “India is a key part of our long-term global strategy. With this expansion, we’re investing directly in the country’s exceptional young talent in AI, machine learning, and semiconductor design—talent we believe will shape our technology roadmap for years to come.”

The centre reflects Rohde & Schwarz’s own ‘Make in India, for the world’ approach to technology development—drawing on the country’s deep pool of AI/ML and semiconductor engineering talent to design AI/ML solutions and chips in India for the company’s global business. Solutions designed by engineers in Bengaluru will support Rohde & Schwarz products across divisions worldwide, positioning India not just as a market the company serves, but as a source of engineering for its global product line. This expansion adds to Rohde & Schwarz India’s growing team of over 500 employees.

The expansion builds on Rohde & Schwarz’s established engineering presence in Bengaluru and is one of the company’s two R&D centres in India alongside New Delhi. Both centres focus on advanced wireless communication, test and measurement, and secure communication solutions. With the new AI/ML Design Center and preparations for chip design activities, Bengaluru adds silicon-level design capability to its existing R&D work, bringing chip development and systems engineering closer together on the same campus. This initiative strengthens a portfolio that already spans Rohde & Schwarz India’s core businesses.

Rohde & Schwarz is striving for a safer and connected world with its Test & Measurement, Technology Systems and Networks & Cybersecurity Divisions. For over nine decades, the global technology supplier has developed cutting-edge technologies, with the company’s leading-edge products and solutions empowering industrial, regulatory and government customers.

Rohde & Schwarz India Pvt. Ltd is a 100% owned subsidiary of Rohde & Schwarz GmbH & Co KG. The company’s head office is in New Delhi with branch offices in Bengaluru, Hyderabad and Mumbai. R&S India has made significant investments to strengthen its local application support, repair, and calibration capabilities, while also establishing state-of-the-art R&D centres in Bengaluru and New Delhi focused on developing advanced solutions in wireless communications, test and measurement, and electronic warfare.

The company operates an ISO 9001:2015-certified Quality Management System and maintains an ISO/IEC 17025 (A2LA) accredited calibration laboratory, demonstrating its strong commitment to quality, technical excellence, and internationally recognised service standards. The company continuously invests in training and development of its personnel, ensuring a high level of technical competence across pre- and post-sales support to its customers. For more information about Rohde & Schwarz India and its innovative solutions, visit https://www.rohde-schwarz.com/in

Press Contacts:

India: Anitha Nambiar (phone: +91 11 42535400; email: anitha.nambiar@rohde-schwarz.com)

Europe (headquarters): Katrin Wehle (phone: +49 89 4129 11378; email: press@rohde-schwarz.com)

Asia Pacific: Sze Ming Ng (phone: +603 5569 0011; email: press.apac@rohde-schwarz.com)

Contact for readers: www.rohde-schwarz.com/contact

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Vishay Intertechnology, Inc. today announced that it has expanded its portfolio of Automotive Grade common mode chokes with four new surface-mount devices designed to improve system efficiency while saving board space. Offered in compact case sizes, the Vishay Dale ICM5050-A, ICM6050-A, IFLN-1210BE-A, and IFLN-1812CZ-A combine low DCR with high current capability and impedance.

Offering high temperature operation up to +150 °C, the AEC-Q200 qualified devices released today provide noise suppression and filtering for DC/DC power supplies, LCD displays, lighting drivers, in-vehicle Ethernet networks, and battery powered devices. While toroidal common mode chokes typically provide DCR of 23 mΩ, the ICM5050-A, ICM6050-A, IFLN-1210BE-A, and IFLN-1812CZ-A offer low DCR from 0.4 mΩ to 12 mΩ to reduce power losses and increase efficiency in these applications.

The ICM5050-A and ICM6050-A are wirewound ferrite common mode chokes that offer high current capabilities up to 11 A in the 5050 case size and 14 A in the 6050 case size. With footprints of 12.0 mm x 11.0 mm x 6.0 mm and 15.0 mm x 13.0 mm x 6.0 mm, respectively, the devices can save board space by replacing larger toroidal common mode chokes, which typically measure 19 mm x 30 mm x 28 mm.

The IFLN-1210BE-A and IFLN-1812CZ-A are ferrite common mode chokes with precision winding. The devices provide excellent common mode impedance up to 11 kΩ at 100 MHz in the compact 1210 and 1812 case sizes, making them ideal for suppressing EMI noise in CAN, LAN, and automotive DC/DC converters.

RoHS-compliant, halogen-free, and Vishay Green, all four devices are suitable for reflow soldering and compatible with automated pick and place assembly.

Device Specification Table:

(1) DC current (A) that will cause an approximate ΔT of 40 °C

(2) DC current (A) that will cause an approximate ΔT of 20 °C

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Keysight Technologies, today announced that AttoTude Inc., a pioneer of next-generation ASICs over Dielectric interconnect technology for AI and hyperscale data center applications, has expanded its use of Keysight EDA software to manage its full IC design workflow. As a result, AttoTude has reduced its design cycles by more than 50% while achieving first-pass silicon success across advanced RF, sub-THz, and THz tape-outs that underpin its guided-wave interconnect platform.

Design velocity is emerging as a competitive advantage, with global semiconductor revenue forecast to exceed $1.3 trillion in 2026 and AI semiconductors expected to account for 30% of the market. For organizations developing AI interconnect technologies, accelerating silicon development while minimizing costly respins is vital to delivering the required bandwidth, efficiency, and scalability.

AttoTude designs integrated circuits that support per-lane data rates of 200G, 400G, and 800G, where on-chip interconnects behave as waveguides and accurate electromagnetic simulation is essential. With engineers working in parallel on sub-THz and THz subsystems, coordinating workloads without a shared, version-controlled environment makes first-pass silicon success difficult to achieve at scale. With the Keysight Advanced Design System (ADS) platform, AttoTude has cut design cycles to less than six weeks, with designs consistently performing to specification on first silicon.

Utilizing Keysight’s design data management software, AttoTude maintains a single source of truth across its design environment, giving engineers full traceability and visibility at every stage. System-level scenario planning allows the team to explore design trade-offs before committing to silicon, with simulation-to-measurement correlation ensuring results reflect performance. As operating frequencies extend from RF into the sub-THz and THz domains, maintaining consistency between layouts, electromagnetic models, and simulation data becomes critical to delivering reliable silicon.

Richard Chan, ASIC Architect and Development Leader, AttoTude, said: “Developing an ASICs over Dielectric interconnect platform that spans signaling frequencies from 100 GHz to 3 THz requires an exceptional level of design accuracy and simulation fidelity. Keysight’s EDA software has enabled our engineering team to move faster with greater confidence, helping us accelerate development while consistently achieving first-pass silicon success.”

Nilesh Kamdar, General Manager, Keysight EDA, said: “At Keysight, we measure success by what our customers achieve. The next generation of AI infrastructure will be built by the teams that move from design to silicon fastest, and AttoTude is proving what that speed makes possible.”

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The rise of generative AI and large-language models is forcing a complete redesign of data centers in India. Traditional setups designed for 5 to 10 kW per rack simply cannot handle modern GPU clusters, which regularly push power densities beyond 30 to 100 kW. When you hit those numbers, standard air conditioning stops working, and the risk of thermal throttling or total power failure becomes a daily operational challenge.

Running an AI-ready facility today comes down to specialized power electronics, direct-to-chip liquid cooling, heavy-duty physical enclosures, and rock-solid grid stability. Here is how five key infrastructure providers are building the physical hardware behind India’s AI compute push.

1. Delta Electronics India

AI workloads pull massive, continuous surges of electricity while throwing off extreme heat. Delta handles both sides of that equation with specialized power electronics and liquid cooling built explicitly for compute-dense environments. The portfolio centers on megawatt-scale power shelves, high-efficiency UPS systems, and specialized Liquid-to-Liquid (L2L) and Liquid-to-Air (L2A) Cooling Distribution Units (CDUs). By routing direct-to-chip liquid cooling straight to high-TDP processors, Delta keeps Power Usage Effectiveness (PUE) low without letting high-density racks overheat under peak workloads.

2. Eaton India

Training large AI models creates sudden, severe power spikes that can strain local grids and trigger dangerous voltage sags within a facility. Eaton solves this at the power layer with high-density Power Distribution Units (PDUs), energy-storage-ready UPS setups, and smart switchgear designed to buffer heavy load fluctuations. Their systems make it possible to integrate renewable energy directly into high-density data centers while keeping internal power quality steady around the clock.

3. Stulz India

When heat outputs surpass standard HVAC limits, precision thermal management takes over. Stulz specializes in custom direct to-chip and liquid cooling infrastructure, precision air handling, and high-capacity chillers engineered for dense server rooms. Their fluid distribution loops allow operators to shift from hybrid air-water systems toward full liquid cooling setups, keeping sensitive server components running safely without risking heat-induced performance drops.

4. Rittal India

Heavy AI server nodes—packed with multiple GPUs and fluid lines—are drastically heavier and more complex than standard IT equipment. Rittal manufactures industrial-grade modular rack systems, climate-controlled enclosures, and inline cooling manifolds engineered to bear heavy structural loads. Their sealed rack designs integrate liquid lines directly into the enclosure frame, keeping complex server arrays organized, cooled, and isolated within small physical footprints.

5. CoolIT Systems

When rack densities cross the 100 kW mark, pulling heat directly off the silicon becomes non-negotiable. CoolIT builds the custom cold plates, fluid distribution manifolds, and heat-exchange units that sit directly on top of high-performance chips. Partnering with global server OEMs and data center builders, they provide the internal liquid loops necessary to keep high frequency processors running cool under continuous parallel processing loads.

Building the Foundation for AI Compute

India’s AI growth depends entirely on what is happening on the server room floor. The real work is being done by high efficiency power converters, liquid cooling loops, robust enclosures, and stable sub-stations. As compute demands scale up, these hardware manufacturers are laying down the actual foundation that makes real-world AI processing possible.

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The Council of Scientific and Industrial Research – National Aerospace Laboratories (CSIR-NAL) have launched a trilogy of home-made micro and small gas turbine engines, in a move aimed at strengthening India’s capabilities in the hi-end aerospace propulsion and unmanned defence domain.

Launched on August 25 at the SSB Auditorium at CSIR Headquarters in New Delhi, the engines are the NJ-05, NJ-50 and NJ-100 that produce thrusts of 5kg, 50kg and 100kg. These compact propulsion systems units have been developed to address critical requirements for indigenous defence technologies and are suitable to fit in tactical UAVs, drone interceptors and other small missile systems.

The ceremony was attended by senior officials of the scientific and defence sectors of India. Air Marshal Tejinder Singh, the Chief of Integrated Defence Staff to the Chairman of the Chiefs of Staff Committee was the chief guest. Dr N. Kalaiselvi, Director General of CSIR and Secretary, of the Department of Scientific and Industrial Research emphasized the significance of developing specialised and critical aerospace subsystems indigenously, supporting India’s goal of achieving self-reliance in critical propulsion technologies under the ‘Atmanirbhar Bharat’ initiative.

The NJ-05 serves as a critical building block in this program. According to CSIR-NAL, the technology demonstrator has achieved full development and was successfully demonstrated on a small scale flight test model aircraft. It produces 50 N static sea level rated thrust with design speed ranging to 100,000 rpm, generating up to 75 N thrust.

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KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released two new series of compact, vibration-proof aluminum electrolytic capacitors engineered for harsh industrial environments.

Designed to overcome the mechanical stress challenges that have limited the application of aluminum electrolytic capacitors in industrial applications, the new AEVA and AEVB Series aluminum electrolytic capacitors feature compact, surface-mount form factors equipped with innovative plastic supports that improve vibration performance and unique termination shapes that maximize the soldering area. These features also increase the capacitors’ board mounting strength.

The new AEVA and AEVB Series aluminum electrolytic capacitors feature liquid electrolyte dielectrics, provide high-CV performance in smaller packages than competing can-type aluminum electrolytics, and ruggedly withstand up to 30g acceleration and operating temperatures as low as -55°C and as high as +125°C. They exhibit very low ESR, low leakage (≤0.01CV or 3μA, whichever is greater), and high endurance, with rated lifetimes up to 5,000 hours at rated voltage and 125°C, and are halogen-free, lead-free compatible, and RoHS compliant. Both series are ideally suited for industrial applications exposed to high vibration and temperatures — including robotics, embedded motor control units, photovoltaic inverters, power tools, DC/DC converters, and uninterruptable power supplies (UPS) — and are shipped on 15” reels and compatible with reflow soldering to support automated placement.

AEVA Series vibration-proof aluminum electrolytic capacitors are currently available in five case sizes (0810, 1010, 1213, 1616, and 1821) and rated for 6.3–100VDC, 10μF–4,700μF ±20%, operating temperatures extending from -55°C to +125°C, and up to 4,000 hours endurance at rated voltage and 125°C.

AEVB Series vibration-proof aluminum electrolytic capacitors are currently available in four case sizes (0810, 1010, 1213, and 1616) and rated for 16–50VDC, 47μF–2,200μF ±20%, operating temperatures extending from -40°C to +125°C, and up to 5,000 hours endurance at rated voltage and 125°C.

“Mechanical stress has long been a critical concern for aluminum electrolytic capacitors,” said Mack Cartagena, Staff Research Development Engineer, KYOCERA AVX. “To overcome this common challenge, we gave the new AEVA and AEVB series a unique plastic support and special terminations designed to increase the soldering area. These features significantly improve board mounting strength and ensure reliable performance under up to 30g of acceleration. These capacitors are also rated for operating temperatures up to +125°C to effectively address the demands of industrial applications, and every unit is tested in accordance with international standards to uphold the exceptional quality that KYOCERA AVX is known for.”

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Infineon Technologies is now supplying silicon carbide (SiC) power semiconductors to Fox ESS, a renewable energy solution provider, to enhance the efficiency of its residential energy storage systems (ESS). Leveraging Infineon’s CoolSiC MOSFETs 1200 V G2 in the Q-DPAK package, Fox ESS has reduced switching losses by 70%. As a result, the company’s PQ3-Ultra energy storage system achieves a peak photovoltaic (PV) inverter efficiency of up to 98.78% in grid-tied operation and a peak battery charge/discharge efficiency of up to 98.47%.

“With our SiC MOSFETs in the Q-DPAK package, we are enabling a new level of efficiency, thermal performance and design flexibility for residential energy storage systems,” said Amit Raut, Application Manager Photovoltaic and Residential ESS at Infineon. “Fox ESS is demonstrating how advanced SiC technology can translate into measurable system-level gains and support the broader adoption of clean energy solutions in homes worldwide.”

Compared with conventional bottom-side-cooled designs, the Q-DPAK package supports improved PCB layout, helping to reduce parasitic effects and stray inductance while enabling superior thermal management. Its compact footprint supports space-saving system designs, while compatibility with automated assembly simplifies cost-efficient, scalable manufacturing.

Within Fox ESS’s energy storage system, Infineon’s CoolSiC MOSFETs 1200 V G2 in the top-side-cooled Q-DPAK package deliver optimised thermal performance, system efficiency and power density. Infineon has specifically designed the devices for demanding applications requiring high performance and reliability. Featuring Infineon’s advanced .XT interconnection technology, they reduce thermal resistance and operating junction temperature, while the trench gate architecture helps lower switching losses.

“The collaboration with Infineon is a major pillar of our strategy to deliver high-performance energy storage solutions,” said Daniel Deng, R&D Director at Fox ESS. “Infineon’s CoolSiC technology offers superior efficiency and outstanding reliability, values that perfectly match our philosophy. By working together, we will further advance the performance of residential energy storage systems and accelerate the adoption of renewable energy.”

For its hybrid ESS solution combining the PQ-H3-Ultra-10.0 inverter with the EQ3300-5 battery, Fox ESS has achieved a System Performance Index (SPI) of 97.0 percent in a recent test by HTW Berlin University of Applied Sciences and AQUU Research. This ranks Fox ESS first in the 10-kW class among all hybrid inverter and storage systems tested in 2026 and marks the highest SPI score recorded since the evaluation was launched in 2018. Over the past three years, Fox ESS has installed more than 890,000 PV inverters and over one million batteries in more than 70 countries.

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– Anwesh Koley, Executive Editor, ELE Times

The government is serious about making India a global technology hub and how! After the visible success of the first phase of the India Semiconductor Mission, policy makers are walking the talk with the 2nd phase of the India Semiconductor Mission (ISM 2.0). In a move that could well be termed monumental, a staggering Rs 1,27,500 crore (around $13.25 billion) has been approved towards building an integrated semiconductor ecosystem across major Indian states.

The Indian semiconductor market is currently valued at around $45–$50 billion and is expected to expand to $100–$110 billion by 2030. At a time when India is working to strengthen its position in the global semiconductor supply chain, Semicon 2.0 is expected to provide a significant boost to India’s electronics and semiconductors industry. The emphasis of ISM 2.0 will be on deepening the country’s semiconductor and design ecosystem.

What stands out is how Semicon 2.0 builds on the foundation laid by ISM 1.0. While the first phase focused on establishing India’s semiconductor base through ecosystem creation, ATMP/OSAT and early project execution, Semicon 2.0 is notably broader in scope – spanning chip design IP, equipment and materials, fabs, advanced packaging, R&D and talent development. While much of the conversation around chips has focused on fabrication plants, the latest developments indicate that India is building a broader ecosystem that includes packaging, testing, display manufacturing, and advanced materials.

Airing his views on phase 2 of the ISM, Amitesh Kumar Sinha, CEO, ISM, said, “As India’s semiconductor journey has already gathered momentum, the India Semiconductor Mission (ISM) has laid a strong foundation for semiconductor manufacturing in India, with 10 approved projects—including 2 fabs and 8 ATMP or OSAT units—attracting investments of around Rs 1.6 lakh crore. With ISM 2.0, the focus now shifts to deepening the value chain across materials, equipment, IP, and supply chain resilience.”

As India moves decisively from semiconductor policy to on-ground execution, ISM 2.0 provides a structured pathway to leverage the strengths of global partners in advanced manufacturing, supply chain integration, and design, while accelerating India’s capabilities across assembly, testing, packaging, the broader component ecosystem and overall Semiconductor ecosystem.

India sees strong potential for deeper participation from South Asian countries like Singapore across the value chain. “I would like to assure that ISM is all set to support any further investments in the sector. We are fully committed to facilitating and supporting such investments—ensuring a trusted, scalable, and globally competitive semiconductor ecosystem anchored in strong international partnerships,” affirmed Sinha.

As countries continue to diversify global chip supply chains, India’s semiconductor roadmap is increasingly viewed as a long-term manufacturing and strategic play rather than a short-term production target. India’s world-class engineering talent is a proven asset, and sustained R&D investments are expected to further elevate its position in the global supply chain.

Finance Minister Nirmala Sitharaman announced ISM 2.0 in the Union Budget 2026, with an initial emphasis on design, equipment and materials. The announcement confirmed that Semicon 2.0 will broaden this framework further, encompassing design, machines and materials, fabs, the strengthening of ATMP/OSAT capabilities, research and development, and, significantly, talent development.

Indian Semiconductor Mission 1.0 focused on setting up basic chip making and packaging factories with a budget of Rs 76,000 crore. Taking this initiative a step further, Indian Semiconductor Mission 2.0 expands and strengthens the whole supply chain with a budget of Rs 1,27,500 crore. Indian Semiconductor Mission 1.0 made progress with 12 manufacturing units with investments over Rs 1.64 lakh crore. 24 Semiconductor design projects from startups have been approved for financial support while 105 startups have been granted access to EDA tools.

Under Indian Semiconductor Mission 2.0 government financial support is structured to deepen and strengthen the domestic value chain. For example, subsidies up to 40% on silicon fabrication plants and subsidies up to 35% on other fabrication plants. Semicon 2.0 is more diverse and deeper than ISM 1.0 because of the massive budget, focus on ​the semiconductor ecosystem, industry-led research and development centers and training programs, which lay the foundation for resilient supply chains and high value employment.

ISM 1.0 delivered approvals, investments, and early commercial production. Semicon 2.0 is aimed at deepening domestic capability across the value chain, from materials and equipment to advanced packaging, R&D, and skilled talent. If Semicon 1.0 was about proving that India can enter semiconductors, Semicon 2.0 is about proving that India can scale them.

The ISM (1.0 and 2.0) is critical for India Inc, because the growth of semiconductor supply and ecosystem is highly essential for India to build and grow its own microchip and semiconductor industry. This goes a long way in reducing foreign reliance, encouraging local and domestic industries, economic growth, employment, education, skill based teaching and national security. These foundational capabilities shield the country from global disruptions and foster sustainable, high value technical industries.

The Rs 127,500 crore initiative is a comprehensive push to build India’s semiconductor capabilities for the long term. Hailing this budgetary approval, Hitesh Garg, Vice President and India Managing Director, NXP Semiconductors, said, “As India progresses toward the vision of a “Viksit Bharat” by 2047, the Union Budget will be a critical lever in shaping the country’s medium- to long-term growth trajectory—particularly as global supply chains diversify and technology-led manufacturing becomes central to economic resilience and national competitiveness.”

Since ISM 1.0, the key focus has revolved around talent development, supply-chain readiness, access to raw materials, and long-term competitiveness against established semiconductor hubs. ISM 2.0 framework is expected to address some of these gaps by supporting equipment, chemicals, design ecosystems, and research capabilities. The key focus areas of Semiconductor 2.0 are broadly based on six pillars:

1) Design: The first pillar is based on chip design. Under phase 2, the aim is to develop designs of chips and systems and IPs. ISM 2.0 will focus on designing full stack Indian semiconductor intellectual property, and fortifying both domestic and global supply chains

2) Machines and Materials: Companies and Industries that are involved in the manufacturing process and research and development of machines, materials, chemicals that are essential for manufacturing semiconductors will be encouraged.

3) Setting up more fabrication plants: Efforts will be made to attract more manufacturers to come to India and set up fabrication plants to manufacture chips. Fabrication plants like silicon, compound semiconductor, display etc.

4) Strengthening the ATMP (Assembling, Testing, Marking and Packaging) industry: Setting up of ATMP/ OSAT units is encouraged for strengthening the semiconductor supply chain. Several approved proposals aim to leverage indigenous technologies for the assembly, testing, and packaging of semiconductor chips.

5) Research and Development: Research and Development of semiconductors is essential for advanced technological mechanisms to create better, faster electronic devices. The focus is on developing more advanced nodes and advanced technologies within and outside India.

6) Talent development: Talent development in semiconductors is the process of educating, training, and upskilling people to build a skilled workforce for chip design, manufacturing, testing, packaging, and research. With 315 universities training students using the latest EDA tools, about 68,000 students have already been trained.

“Government initiatives such as ISM 2.0 are a defining milestone in India’s journey toward global semiconductor leadership. By expanding support across the entire value chain from manufacturing and advanced packaging to critical materials and design, this initiative builds a foundation for long-term competitiveness,” Garg opined.

By structuring Semicon 2.0 around six key pillars, the government has taken a holistic view of the industry. The clear roadmap that the sector’s future lays out is especially commendable. This is not merely about setting up a few fabs; it is about building the foundation for India’s semiconductor future over the coming years. While achieving this vision will require sustained effort, collaboration, investment, and strong industry-government partnership, the direction remains clear.

Airing his optimism for phase 2, Vinay Shenoy, MD, Infineon Technologies, India, said, “ISM 2.0 marks a decisive step in India’s journey from semiconductor consumer to semiconductor innovator. For Infineon, having invested in India’s ecosystem for over 25 years, this signals strong policy continuity and ambition. The enhanced focus reinforces our belief that India has the talent and capabilities to further strengthen its position as a global hub for chip innovation, particularly in areas driving decarbonization and digitalization.”

The government’s recent approvals, including projects in Gujarat, Odisha, Assam, and Uttar Pradesh, reflect a shift from policy announcements to infrastructure creation. Companies such as Tata Electronics, Micron, CG Power, and Kaynes Semicon are now part of a growing domestic semiconductor network that aims to reduce import dependence and strengthen India’s role in global electronics manufacturing.

NXP’s Garg further reiterated the semiconductor manufacturer’s commitment towards this massive capacity-building initiative. “At NXP, we are fully committed to this vision. We continue to advance cutting-edge R&D locally and nurture future-ready talent. We believe that collaborative ecosystem innovation is the key, and we look forward to partnering with industry, academia, and policymakers to drive India’s emergence as a global semiconductor hub.”

What makes this phase significant is the focus beyond just fabs. Advanced packaging technologies, display assembly, compound semiconductors, and supply-chain support systems are emerging as equally important areas. Industry observers believe this approach could help India gradually build capabilities in sectors linked to automotive electronics, telecom, AI hardware, and industrial devices.

Through Semicon 2.0, India is demonstrating its readiness to emerge as a trusted and resilient partner in the global semiconductor value chain. The long-term policy support and substantial investment approved by the Cabinet underscore India’s determination to advance domestic capabilities and attract world-class semiconductor manufacturing to the country.

Semiconductor technology is at the heart of all critical technologies and India must catch up with the global leaders in this domain. Strategic strength and ability to lead development of new technologies, R&D and emerging areas of expertise cannot be achieved without electronics and semiconductors. ISM 2.0 is a timely move that will take us to the next level and deliver immense social and economic benefits for India.

This landmark announcement strengthens India’s backend semiconductor capabilities by enabling large-scale production of discrete chips tailored to high-growth sectors such as electric vehicles and industrial automation. Little wonder then, that as time progresses, India’s electronics and semiconductor ecosystem is steadily advancing towards becoming a self-reliant and globally competitive manufacturing hub.

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The market for securing AI is growing rapidly, projected to reach almost $4.8 billion in 2027, a 68.7% increase over 2026, according to the latest Gartner report. By 2028, the market is forecast to reach almost $7.7 billion. AI application security will remain the largest AI security spending category in 2027.

Gartner predicts over half of successful cyberattacks on AI agents are expected to exploit access control weaknesses and prompt injections by 2029. There is a growing need for organisations to identify, monitor and protect AI models from these unique threats, which is driving the adoption of advanced AI security solutions. To build a strong defence, businesses need to combine their existing security systems with specialised AI security tools.

“This surge is driven by the urgent need for enterprises to secure AI systems, address emerging vulnerabilities and strengthen defences against sophisticated cyberthreats,” said Shailendra Upadhyay, Senior Principal Analyst at Gartner. “This is compounded by growing vulnerabilities and supply chain attacks involving third-party and open-source software in AI projects. Without adequate security and visibility controls, enterprise AI initiatives face a high risk of failure,” he added.

The market for securing AI is divided into four main areas: AI application security, AI usage control, AI governance platforms, and AI gateways. This includes a range of software and platforms designed to help organisations use AI safely, responsibly, and in line with regulations.

According to Gartner, competition in the securing AI market varies depending on the segment. For AI governance platforms and AI gateways, which often build on existing enterprise systems for governance, data, and API management, major vendors are likely to maintain their lead by adding AI features or integrating specialised products. On the other hand, the AI application security and AI usage control segments are seeing a wave of startups entering the field.

“As the market grows, we can expect increased consolidation and acquisitions, with larger cybersecurity companies buying these startups to broaden their offerings,” said Upadhyay. “Overall, the fast-paced growth in this space is fuelling intense competition among vendors as they vie for market share.”

AI application security will remain the largest spending category in 2027 and is projected to reach almost $851 million, followed by AI usage control at $749 million. However, AI usage control will experience the largest growth of 73%, followed by AI gateway at 70.9%.

Securing AI Opportunity by Segment (Millions of U.S. Dollars), 2026-2027

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Nuvoton Technology Corporation will demonstrate its latest advancements in HMI, audio, automotive technology, and smart energy management at Electronica India 2026. The company will showcase a comprehensive lineup of solutions designed to meet the evolving needs of the Indian market, focusing on smart buzzers, Cortex-M23 MCUs, Cortex-A35 MPUs, Arm9 MPUs, Gerda ICs, TOF sensing, and automotive and industrial BMICs.

Nuvoton is highlighting its leadership in battery technology with several key demonstrations:

• Automotive Excellence: The KA84936UA evaluation solution offers high-precision cell voltage measurement (±1.5 mV accuracy) for up to 20 series-connected cells. Designed for ISO 26262-compliant safety systems and AEC-Q100 compliance, it is ideal for EV, PHEV, and HEV applications.
• Industrial High-Voltage Systems: The KA49703A stackable battery monitoring solution supports daisy-chain communication for up to 55 devices, making it a robust choice for high-voltage Energy Storage Systems (ESS) and data center backup power.
• Integrated Monitoring & Voice Support: The Battery Monitoring and Voice Prompt System, powered by the NUC980 MPU, features four CAN Bus interfaces for real-time monitoring of multiple battery groups, integrated with emWin graphics and voice-enabled fault responses.

Nuvoton continues to redefine user interaction with advanced display technologies:

• Two-Wheeler HMI: An integrated solution for next-generation two-wheelers featuring the Gerda IC series. This system boasts a rapid boot-up time of less than 0.5 seconds and high visibility under direct sunlight, all on a PCB the size of a business card.
• Industrial Energy Display: The MA35D1 MPU-based platform leverages the Qt5 framework to provide visualized interfaces for new energy applications, supporting multitasking and scalable expansion.
• Smart ITO Panel: A 20-key touch-panel reference design based on the M258 MCU for household appliances, such as rice cookers, demonstrating high sensitivity and simplified development via the NuTool-LCDView.

The technology company will also showcase its KW330 Series for robust human and object perception. Utilizing 2D and 3D sensing, the technology enables skeleton tracking, gesture recognition, and presence detection for applications ranging from automotive in-cabin monitoring to industrial human-machine collaboration.

Rounding out the display is the Power Delivery 3.0 Dual Role Power (DRP) solution based on the M2L31 MCU, which allows devices to switch seamlessly between power source and sink roles with up to 25W of power delivery. Additionally, the Smart Buzzer (NSP2340BA24E) offers an all-in-one voice chip solution with a built-in high-voltage driver for piezoelectric applications.

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