ELE Times

India to welcome three more semiconductor plants after PM Modi inaugurated Micron’s plant last week, on February 28.

Since the commencement of the India Semiconductor Mission in 2021, India has developed its semiconductor ecosystem exponentially, with four out of ten plants already approved and three more to be inaugurated in 2026 itself. The government further accelerated this by introducing catalyst initiatives like the PLI scheme.

With semiconductors being the core of any modern technology, the demand has grown multifold, and India is pioneering to become a competitive manufacturer for semiconductor to meet the global demand.

India has given approval to ten semiconductor plants in six states with an investment of about Rs 1.60 lakh crore.

As per government records, the approved list of semiconductor plants other than the recently inaugurated Micron plant is as follows:-

1. Tata Electronics (Dholera, Gujarat): Semiconductor fab in partnership with PSMC, Taiwan.
2. CG Power (Sanand, Gujarat): OSAT facility in partnership with Renesas & Stars.
3. Tata Semiconductor Assembly and Test (TSAT) (Morigaon, Assam): Semiconductor packaging facility.
4. Kaynes Semicon Pvt Ltd (Sanand, Gujarat): OSAT facility.
5. HCL-Foxconn JV (Location TBD): Semiconductor packaging and testing.
6. SiCSem Private Limited: Compound semiconductor manufacturing.
7. 3D Glass Solutions Inc.: Advanced substrate manufacturing.
8. Advanced System in Package (ASIP) Technologies: Assembly and testing.
9. Continental Device India Private Limited (CDIL): Discrete semiconductor fab.

The evolving semiconductor landscape in India is expected to generate over two lakh jobs, secure supply chains, as well as strengthen the AI, EV, and defence sectors.

By: Shreya Bansal, Sub-Editor

The post India on the Road to Semicon Self-Reliance with Three More Plants appeared first on ELE Times.

Union Minister for Electronics and Information Technology Ashwini Vaishnaw on Sunday encouraged Gujarat to develop itself as a global hub for data-centres to capture data-hosting opportunities from across the world while speaking at the Gujarat SemiConnect Conference 2026 in Gandhinagar.

The Minister highlighted the growing importance of the AI, Semiconductors, and Electronics Manufacturing trio in the coming years. With the world surging in the production of advanced electronics, the above three are beginning to take centre stage, and India must grasp this opportunity to leverage its advantage of skilled population, clubbed with the fertile ecosystem for growth.

Gujarat has great potential to grow as a data centre for the world with its surplus power and availability of clean energy, presenting a bright opportunity for the establishment of such facilities in the state.

The event was attended by other prominent dignitaries like Chief Minister of Gujarat, Shri Bhupendra Patel and Deputy Chief Minister Shri Harsh Sanghvi. The three leaders unveiled the new ‘Science, Technology and Innovation (STI) 2026–31’ Policy at the event.

Organised by the state government’s Department of Science and Technology, and inspired by the Prime Minister’s vision, the conference carried the theme “Gujarat: India’s Silicon Gateway”, aimed at fostering strategic collaboration between high-tech chip manufacturers and local industry.

The Chief Minister described the conference as the “right job at the right time,” highlighting how Prime Minister Modi’s inauguration of the Micron plant at Sanand has ignited a technological revolution for the country. He added that the conference, which was launched immediately after that historic milestone, will demonstrate the state’s readiness to build a semiconductor ecosystem, attract global partners, and fulfil the vision of an Aatmanirbhar Bharat through research, innovation, and supply chain localisation.

India is developing its semiconductor atmosphere, with Dholera Special Investment Region (SIR) in Gujarat being developed as India’s premier ‘Semicon City’ and a global hub for electronics manufacturing. Located near Ahmedabad, it is the site of India’s first commercial semiconductor fabrication unit by Tata Electronics. 

By: Shreya Bansal, Sub-Editor

The post Upcoming years to Bring Boom for Semiconductors and Electronics appeared first on ELE Times.

Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another pivotal milestone in 6G research and ecosystem readiness, successfully demonstrating carrier aggregation across FR1 and FR3 frequency ranges. The joint achievement is showcased live at MWC Barcelona 2026.

At MWC Barcelona, Rohde & Schwarz and Qualcomm Technologies present a live demonstration at the Rohde & Schwarz booth (5A80) that aggregates a mid-band channel around 2.5 GHz (FR1) with an upper mid-band channel around 7 GHz (FR3), using 4×4 MIMO on both bands and higher-order modulation. With this setup, the two companies validate end-to-end device behaviour across the aggregated spectrum.

At the heart of the test setup is the CMX500 one-box signalling tester from Rohde & Schwarz, extended with the new RFU18 board to provide coverage up to 18 GHz. RFU18 is a modular hardware upgrade for the CMX500 platform, giving customers a straightforward, cost-effective path to extend existing testers towards 6G. As the device under test (DUT), Qualcomm Technologies provided a Mobile Test Platform (MTP) powered by the Qualcomm® Modem-RF System, enabling comprehensive validation of RF performance and protocol behaviour across the aggregated FR1 and FR3 bands.

The FR3 frequency range (7.125 to 24.25 GHz) has been identified by industry and research as a “sweet spot” for combining wide-area coverage with high capacity. FR3 in terrestrial networks (TN) and non-terrestrial networks (NTN) is expected to support demanding applications such as eXtended Reality (XR), connected and autonomous vehicles and industrial automation. By validating FR3 as an additional frequency range for future networks, the partners are helping accelerate 6G development and ecosystem readiness.

Goce Talaganov, Vice President Mobile Radio Testers at Rohde & Schwarz, said: “Through our ongoing collaboration with Qualcomm Technologies, we continue to push the boundaries of wireless communications. As the ecosystem moves toward 6G, we’re showing how easy innovation can be with our test equipment. In response to customer demand, we are extending the CMX500 platform to 18 GHz – so that our customers gain headroom for FR3 evolution and higher-frequency emissions and harmonic testing.”

Tingfang Ji, Vice President of Engineering and Head of 6G Research at Qualcomm Technologies, Inc., said: “Our collaboration with Rohde & Schwarz highlights the importance of aggregating existing spectrum bands with new 6G spectrum in FR3 to establish 6G as the high-efficiency digital infrastructure for the 2030s. By validating new spectrum layers and advanced RF capabilities using our MTP powered by Qualcomm Modem-RF System, we are accelerating innovation across the ecosystem and helping prepare devices and networks for the next-generation of services.”

Future-ready CMX500 platform for 6G:

The CMX500 is a modular, powerful and future-proof one-box signalling tester enabling comprehensive multi-technology testing – from RF to protocol – across all relevant frequency ranges (FR1, FR2 and FR3). All existing CMX500 platforms can be enhanced with the new RFU18 board to extend frequency coverage and capabilities without replacing the entire system, offering users a simple upgrade path.

Engineered for data rates up to 20 Gbps, the CMX500 is one of the most versatile mobile device test platforms, supporting wide dynamic range, 4096QAM and up to 16 device antenna ports for advanced spatial multiplexing. With its multi-band capabilities, it covers LTE and NR in SA/NSA modes, NR-NTN, NB-NTN, Direct-to-Cell (D2C/DTC) testing, and WLAN, including Wi‑Fi 7 and future Wi‑Fi 8.

The post R&S Propels 6G Readiness With FR1–FR3 Carrier Demonstration appeared first on ELE Times.

ROHM and Suchi Semicon have announced the establishment of a strategic semiconductor manufacturing partnership in India.

This collaboration reflects a shared commitment to strengthening semiconductor manufacturing capabilities in India while supporting the requirements of both domestic and global markets. By combining ROHM’s device technology expertise and global semiconductor leadership with Suchi Semicon’s manufacturing capabilities and operational execution, the companies aim to build a reliable and scalable manufacturing framework aligned with evolving industry needs.

This partnership supports the expansion of semiconductor manufacturing capabilities in India (aligned with the “Make in India” objective) while maintaining global standards of manufacturing excellence. The collaboration aims to enhance supply chain resilience and provide customers with trusted manufacturing solutions.

Specifically, ROHM is considering the outsourcing of back-end processes for power devices and IC products to Suchi Semicon and has begun technical evaluations toward potential mass production shipments starting in 2026. Through these efforts, ROHM aims to build, in collaboration with Suchi Semicon, an early-stage manufacturing framework in India that aligns with the expected industry ramp-up in the coming years.

Furthermore, ROHM and Suchi Semicon will share a roadmap to expand the range of locally manufactured packages, thereby broadening the scope of collaboration between the two companies.

The partnership between ROHM and Suchi Semicon will extend beyond semiconductor manufacturing. Both companies recognise the growing expectations from customers across diverse sectors for locally manufactured semiconductors for the Indian market and will jointly pursue new business development opportunities to meet this demand. In addition, the collaboration will leverage Suchi Semicon’s strong local marketing expertise to conduct joint marketing initiatives that enhance visibility and customer engagement. Importantly, the alliance is not limited to these areas alone; ROHM and Suchi Semicon are committed to exploring further avenues of cooperation, ensuring that the partnership evolves into a comprehensive and long-term alliance that supports the sustainable growth of India’s semiconductor industry over time.

The post ROHM and Suchi Semicon Establish a Strategic Semicon Manufacturing Partnership in India appeared first on ELE Times.

Batteries have quietly become the limiting factor of modern technology. They define how far an electric vehicle can go, how safely energy can be stored in a city, how fast systems can charge, and how reliably power can be delivered over years of use. In transport, grids, and electronics alike, progress is no longer constrained by motors or software—it is constrained by electrochemical trade-offs embedded deep inside the cell.

At the heart of those trade-offs sits a deceptively simple question: what are you optimising for? Every battery design balances five variables—energy density, safety, lifetime, cost, and scalability—and no chemistry can maximise all five at once. Push harder on one axis, and something else gives way. This is not a materials problem waiting for a perfect solution; it is an engineering problem that demands choice.

That choice, today, largely resolves into two dominant lithium-ion chemistries: LFP and NMC. They are not incremental variations of the same idea. They represent two fundamentally different engineering philosophies. LFP embeds stability, durability, and cost control into the chemistry itself. NMC extracts higher performance by operating closer to material limits, shifting risk and complexity to system-level design.

For companies such as Amara Raja Advanced Cell Technologies, this divergence is not theoretical. It directly shapes manufacturing strategy, product architecture, and long-term capacity planning. The future is not converging toward one universal battery. It is segmenting.

Every battery discussion eventually sounds like a chemistry debate—but the real argument is architectural.

Engineers do not choose LFP or NMC because of crystal diagrams; they choose them based on how each chemistry behaves across five non-negotiable constraints:

• Energy density
• Safety under abuse or fault
• Cycle life and ageing behaviour
• Cost stability and manufacturability
• Scalability across millions of cells

From a manufacturer’s standpoint, these trade-offs extend beyond lab performance. When thermal management, battery management system (BMS) complexity, and warranty risk are considered, the hidden advantages of LFP become system-level advantages.

According to Yi Seop Ahn, Associate Vice President – Centre of Excellence at Amara Raja Advanced Cell Technologies, customers today largely understand LFP’s strengths over NMC:

• Less heat generation, reducing thermal management burden
• Lower degradation at high temperatures
• Reduced BMS complexity due to smaller variation in cell ageing
• Lower warranty risk because of longer intrinsic cycle life

One often underestimated advantage, however, lies in cell sizing. Because LFP carries a lower risk of rupture or explosion compared to NMC, manufacturers can scale cell capacity significantly higher. Larger-format LFP cells reduce the proportion of inactive components within a pack, partially offsetting LFP’s lower gravimetric energy density. In other words, system-level design can compensate for chemistry-level limitations.

At the material level, LFP and NMC reflect opposing design philosophies.

LFP: Structurally Conservative
Its iron–phosphate framework is chemically and mechanically stable. The lattice resists deformation during cycling, tolerates elevated temperatures, and does not readily release oxygen under stress. Stability is intrinsic, not engineered on top.

NMC: Structurally Aggressive
Its layered oxide structure enables higher voltage and energy density, but expands and contracts during cycling. At high states of charge or temperature, structural instability increases. The chemistry delivers more—but demands tighter control.

This difference cascades into real-world outcomes: thermal behaviour, ageing, fast-charging margins, and pack architecture.

In India, the expansion of LFP is not accidental—it is contextual.

Yi Seop Ahn notes that most Indian vehicle usage consists of daily commuting and urban mobility rather than sustained high acceleration or long-distance highway driving. In a price-sensitive market, these usage patterns favour a chemistry optimised for durability, cost stability, and safety rather than peak energy density.

Temperature is an even stronger driver. Intrinsically, LFP performs weaker at low temperatures compared to NMC. However, India’s predominantly hot climate turns this limitation into an advantage. LFP cells exhibit lower degradation at high temperatures and require less aggressive cooling strategies. In such environments, LFP becomes a natural fit.

The result is not merely economic preference — but climatic alignment.

Energy density, thermal behaviour, and lifetime are not separate attributes. They stem from how aggressively a material system is pushed.

NMC achieves higher energy density through higher operating voltage and electrochemically active nickel content. But that gain comes with tighter stability margins and increased reliance on cooling, sensing, and control algorithms.

LFP sacrifices some voltage and gravimetric energy density but maintains wider thermal margins. Ageing remains slower and more predictable due to minimal structural strain during cycling.

From a system-design perspective, LFP reduces the engineering burden outside the cell. NMC shifts complexity upward—into pack design, software controls, and thermal infrastructure.

While LFP is often described as “mature,” its evolution continues across three parallel layers: chemistry, cell design, and system integration.

Chemistry
Over the past decade, LFP active materials have undergone incremental but meaningful improvements. Manufacturing costs have declined significantly, enabling price competitiveness over NMC. Compaction density has steadily increased through sintering process refinements, with further improvements expected. New chemistries such as LMFP are entering the market, targeting improved cycle life alongside electrolyte advancements.

Cell Architecture
Capacity per cell has expanded dramatically. LFP cells have moved into the 300 Ah range and are advancing toward 400–500 Ah formats. Larger cells reduce inactive material proportion and improve effective pack-level energy density.

System Integration
Innovation is accelerating at the integration layer—moving from module-based packs to cell-to-pack and cell-to-chassis architectures. As integration tightens, chemistry choice increasingly influences vehicle platform design.

All three vectors—chemistry, cell scaling, and system integration—are advancing in parallel rather than sequentially.

NMC’s performance advantages remain real and strategically important.

Despite requiring more robust and complex pack management, NMC offers:

• Better low-temperature performance
• Higher power output
• Longer-range capability
• Stronger suitability in weight- and space-constrained applications

These characteristics ensure NMC’s continued relevance in premium and performance-oriented platforms.

Moreover, innovation in electrolyte systems—including semi-solid and solid-state approaches—aims to mitigate thermal risks. Pairing high-nickel cathodes and silicon-dominant anodes with safer electrolyte systems and improved thermal insulation could extend high-energy-density solutions into domains currently dominated by LFP.

In that sense, NMC is not static. It is evolving along a different axis.

Looking five to seven years ahead, battery chemistries are unlikely to remain interchangeable components.

Different nominal voltages and operating profiles between LFP and NMC inherently drive platform divergence. NMC’s need for more robust management systems further reinforces chemistry-specific architectures.

While experimental “dual-pack” or “two-heart” systems exist—combining different chemistries in one vehicle—they require discrete BMS systems and add architectural complexity. The broader trend points toward OEMs standardising around chemistry-specific platforms rather than designing neutral battery bays.

This is not convergence. It is structural segmentation.

LFP and NMC are not competitors in a zero-sum contest. They are solutions optimised for different definitions of performance. LFP embeds safety, longevity, and cost predictability into the chemistry itself—reducing system-level burden and aligning naturally with India’s climate and usage patterns. NMC maximises energy density and performance, accepting tighter operating margins and higher management complexity.

For manufacturers such as Amara Raja Advanced Cell Technologies. 

The post Two Batteries, Two Futures: Why LFP and NMC Are Splitting the EV & Energy Landscape appeared first on ELE Times.

Viasat and Rohde & Schwarz are set to collaborate to boost testing for Narrowband Non-terrestrial Networks (NB-NTN) IoT devices connecting via satellite. By thoroughly validating devices and confirming interoperability with Viasat’s network, the collaboration aims to help ensure uninterrupted connectivity for a wide range of satellite-based Internet of Things (IoT) applications. Visitors to MWC Barcelona 2026 can experience the test plan in action.

The collaboration aims to ensure that chipsets, modules and devices interoperate seamlessly with Viasat’s satellite network and comply with 3GPP Release 17 standards.

Deploying advanced testing methodologies upholds the highest standards of quality, performance and reliability for Viasat’s connectivity services: delivering ubiquitous IoT applications in areas without terrestrial network coverage.

The certification test plan with Viasat entails protocol, performance and RF test scenarios. It is based on the CMX500 one-box signalling tester from Rohde & Schwarz, a versatile solution designed for testing various NTN technologies, including New Radio (NR-NTN) and NB-NTN. In a single instrument, the CMX500 covers R&D through certification and carrier acceptance tests, guaranteeing reliable and repeatable results. It empowers engineers to accelerate development, ensure quality and confidently deploy reliable NTN services, safeguarding that the whole ecosystem can achieve the highest levels of performance.

The post R&S and Viasat collaborate on NB-NTN IoT test plan for connectivity via satellite at MWC Barcelona 2026 appeared first on ELE Times.

Keysight Technologies, Inc. will demonstrate lab-based validation of new radio non-terrestrial networks (NR-NTN) devices at Mobile World Congress 2026 in collaboration with Samsung Electronics’ System LSI Business. The demo will showcase testing capabilities aligned with planned Low Earth Orbit (LEO) satellite deployments, including Starlink Direct to Cell.

As satellite connectivity becomes integral to 5G evolution and future 6G networks, chipset and device vendors must validate NR-NTN performance well in advance of large-scale deployment. Satellite systems in LEO introduce new challenges, including rapid motion, frequent handovers, dynamic link conditions, and stringent positioning requirements. Without access to live satellite networks during early development, organisations need accurate laboratory-based methods to assess mobility, service continuity, and throughput performance under realistic operating conditions in a laboratory.

Keysight’s NTN Network Emulator Solutions recreate LEO satellite characteristics in a controlled laboratory environment. The MWC demonstration integrates Keysight’s 5G Network Emulator with a Samsung NR-NTN modem to validate satellite and device mobility, service continuity, and higher-throughput Multiple-Input, Multiple-Output (MIMO) configurations under parameters aligned with Starlink deployment scenarios.

The demonstration also showcases Keysight’s positioning emulation capabilities, enhanced through its recent Spirent acquisition. PNT Xe enables accurate global navigation satellite system-based positioning as part of an end-to-end validation workflow.

Jungwon Lee, Executive Vice President of System LSI Modem Development Team at Samsung Electronics, said: “NR-NTN introduces new technical challenges for modem design, particularly around mobility, handover, and link adaptation in LEO environments. This demonstration with Keysight allows us to validate NR-NTN modem performance under representative satellite conditions, helping ensure readiness for future satellite-based 5G services.”

Peng Cao, Vice President and General Manager, Keysight’s Wireless Test Group, said: “Direct-to-device satellite connectivity is moving from concept to deployment, making early end-to-end NR-NTN validation essential. Our lab-based, live-application testing gives the ecosystem a repeatable way to prove interoperability and performance, cutting risk and time-to-market while keeping users connected beyond terrestrial coverage.”

The post Keysight to Demonstrate NR-NTN devices Mobility Testing at MWC 2026 in Collaboration with Samsung appeared first on ELE Times.

Combining TSMC’s Process Technology to Build an End-to-End, In-Group Production System

ROHM has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC, with which ROHM has an ongoing partnership, to establish an end-to-end production system within the ROHM Group. By licensing TSMC GaN technology, ROHM will strengthen its supply capability to meet growing demand for GaN in applications such as AI servers and electric vehicles.

GaN power devices offer excellent high-voltage and high-frequency performance, helping to improve efficiency and reduce size in a wide range of applications, and are already used in consumer products such as AC adapters. Adoption is also expanding in high-voltage applications such as power units for AI servers and on-board chargers for electric vehicles (EVs), and demand is expected to continue growing.

ROHM began developing GaN power devices at an early stage and established a mass-production system for 150V GaN at ROHM Hamamatsu in March 2022. In the mid-power range, ROHM has built its supply structure while advancing external collaborations. One of the key partners in this effort has been TSMC: ROHM has adopted a 650V GaN process since 2023, and in December 2024, the two companies entered into a partnership related to automotive GaN, further deepening their collaboration.

This latest integration represents an evolution of that partnership. Under a newly concluded license agreement, TSMC’s process technology will be transferred to ROHM Hamamatsu. ROHM aims to establish the production system in 2027 to meet expanding demand in applications such as AI servers.

Upon completion of the technology transfer, ROHM and TSMC will amicably conclude their automotive GaN partnership. At the same time, the two companies will continue to strengthen collaboration for higher efficiency and more compact power supply systems.

The post ROHM Strengthens Supply Capability for GaN Power Devices appeared first on ELE Times.

element14, an Avnet Community, in collaboration with ADI, has launched a new design challenge inviting engineers and makers to develop advanced security and surveillance prototypes.

Participants are tasked with designing a prototype or test rig utilising ADI’s MAX32630FTHR, a versatile development platform, and Würth Elektronik’s SMD LEDs with an integrated WL-ICLED controller. The challenge encourages creative applications of these components to deliver innovative security features.

Selected challengers will receive a free kit of components, with ADI’s MAX32630FTHR as the core element, to assist in building their prototypes. Each participant will document the build process and final outcome through blogs on the element14 Community platform.

Examples of potential applications include facial recognition door entry systems, voice and face detection, environmental monitoring, crowd sentiment analysis, break-in detection and remote security sentry solutions.

“Through this challenge, we’re inviting our global community to showcase creativity and problem-solving in the field of security and surveillance,” said Andreea Teodorescu, Global Director of Product Marketing & element14 Community. “It’s an opportunity for participants to learn, share ideas, and demonstrate how innovative thinking can address real-world safety challenges.”

“We’re excited to collaborate with the element14 Community on a challenge that inspires creativity and problem-solving,” said Stephane Di Vito, ADI Distinguished Engineer, Product Security. “This initiative brings together passionate designers and engineers to explore new ideas and develop solutions that can make security smarter and more effective.”

The post element14 Community launches smart security and surveillance design challenge appeared first on ELE Times.

Rohde & Schwarz and LITEON collaborate to showcase a production-optimised test setup for high-throughput multi-device testing at MWC Barcelona 2026. The demonstration will feature the high-performance PVT360A vector performance tester from Rohde & Schwarz characterising in parallel four new LITEON FlexFi 5G femtocells as devices under test (DUT). The setup highlights the adaptability of the test platform to various production and validation environments, all within a compact form factor.

Rohde & Schwarz has designed the PVT360A performance vector tester with a minimal footprint for maximum performance. It is a comprehensive solution for non-signalling 5G NR FR1 and LTE small cell testing in the design verification stage and in production. LITEON has selected the test platform for the manufacturing lines of their new FlexFi 5G femtocell, boosting the overall testing speed by 50%. At MWC 2026, the two companies will showcase a femtocell production testing setup characterising four DUTs using a single PVT360A.

The single‑box vector signal generator (VSG) and vector signal analyser (VSA) solution delivers efficient, high‑performance RF testing and pairs seamlessly with the R&S VSE Vector Signal Explorer software for reliable timing verification as well as comprehensive 5G NR downlink and uplink signal analysis. Engineered to significantly accelerate 5G production testing and streamline design validation workflows, the PVT360A features an innovative 2×8 port architecture, coupled with a unique Smart Channel feature that dynamically optimises resource allocation. This dramatically increases test throughput and enables manufacturers to test more devices in less time.

Beyond core testing efficiency, the PVT360A supports advanced 5G scenarios, including multi-component carrier testing and highly accurate MIMO measurements with optional dual signal generators and analysers. This combination of speed, versatility and support for complex 5G technologies makes the PVT360A a critical tool for manufacturers looking to rapidly scale 5G device production and deliver cutting-edge performance.

To enhance both the production efficiency and quality of its 5G femtocell products, LITEON has successfully integrated the PVT360A performance vector tester into its manufacturing lines, enabling fully automated calibration and verification processes. Leveraging its proprietary Smart Channel technology, a single unit can now simultaneously test four 5G femtocells. This enhancement has delivered a 50% increase in overall testing speed, significantly boosting production throughput while maintaining superior product consistency.

Richard Chiang, General Manager of LITEON Smart Life Application SBU, said: “To enhance our manufacturing excellence, we are embarking on a long-term partnership with Rohde & Schwarz. By adopting their PVT360A platform, we aim to achieve higher levels of automation and precision in our testing processes, ensuring that our products consistently meet the highest market standards.”

Goce Talaganov, Vice President Mobile Radio Testers at Rohde & Schwarz, said: “We are proud to support LITEON in advancing its smart manufacturing strategy with our PVT360A platform. Their ability to achieve higher throughput and consistent quality demonstrates how our scalable multiport architecture and smart channel technology can transform production efficiency. We look forward to deepening our collaboration and enabling even greater innovation in 5G small cell manufacturing.”

The post R & S and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A appeared first on ELE Times.

Next-generation embedded systems are essential for applications in the rapidly evolving connected world. They range from high-performance sensors for capturing critical data to advanced microcontrollers (MCUs) that process and analyse this data. At Embedded World 2026, taking place from March 10 to 12, 2026, in Nuremberg, Germany, Infineon Technologies AG will demonstrate how its innovative semiconductor solutions enable green and efficient energy, clean and safe mobility, and an intelligent and secure IoT. True to the motto “Driving decarbonization and digitalisation. Together,” the Infineon booth in Hall 4A, booth 138, will present highlights for applications ranging from AI and IoT to automotive and robotics that contribute to a more sustainable future.

Infineon’s highlight topics at embedded world 2026

Microcontrollers – the core of embedded intelligence: MCUs are the central processing units of modern embedded systems, coordinating control, computation, and connectivity in countless applications. In Nuremberg, Infineon will demonstrate its comprehensive MCU portfolio through live demos that illustrate real-world use cases, such as:

• Edge AI and robotics demonstrations, where Infineon PSOC and AURIX MCUs enable deterministic real-time processing, adaptive control, advanced safety, and secured connectivity
• Demos targeting software-defined vehicles, including the TRAVEO SDV Zonal Demo, highlighting how automotive MCUs support zonal E/E architectures, OTA updates, and software-driven innovation
• Industrial and IoT applications, showing how energy-efficient MCUs combine performance, safety, and cybersecurity to enable smart devices and enable manufacturers to comply with the upcoming European Cyberresilience Act (CRA)

XENSIV sensors – bridging the physical and digital worlds:

Sensors act as the interface between the real world and digital processing, enabling precise data acquisition for control, monitoring, and decision-making processes. At Embedded World 2026, Infineon will present its XENSIV sensor portfolio, demonstrating how sensor data powers advanced systems across automotive, industrial, and consumer electronics. The demos include:

• Robotics and Edge AI demos in which Infineon XENSIV sensors enable robots to see, hear, and feel, providing the environmental and contextual awareness required for safe interaction and autonomous behaviour
• Automotive and SDV-related use cases, showcasing how radar, magnetic, and current sensors support perception, monitoring, and zonal architectures in modern vehicles
• IoT and industrial demonstrations,s including the next generation XENSIV CMOS 60 GHz radar for IoT. These illustrate how MEMS microphones and other XENSIV sensors deliver reliable, high-fidelity data for connected and energy-efficient devices

In addition, Infineon experts will be giving in-depth presentations demonstrating how the company’s MCU and sensor solutions enable efficient, secure, and rapid innovations in areas such as AI, robotics, IoT, and software-defined vehicles.

The post Infineon presents MCU and sensor solutions for the future of AI, IoT, mobility, and robotics appeared first on ELE Times.

Rohde & Schwarz will showcase a new milestone in AI-driven wireless system testing at MWC Barcelona. The testbed, developed in collaboration with NVIDIA, integrates hardware-in-the-loop site-specific channel emulation using the NVIDIA Sionna Research Kit, enabling testing of AI-RAN applications under realistic channel conditions. The demonstration highlights the long-term collaboration of Rohde & Schwarz and NVIDIA, focusing on prototyping and validation of AI-RAN innovation with cutting-edge test and measurement solutions.

Evolving from prior proofs-of-concept in advanced neural receiver design – including custom constellations for pilotless communication – the new testbed advances from link-level validation to system-level verification using the full 5G NR protocol stack.

Powered by a single NVIDIA DGX Spark, the NVIDIA Sionna Research Kit runs a software-defined 5G RAN based on OpenAirInterface, while supporting AI inference workloads that comply with the strict real-time constraints of wireless systems. To showcase the flexibility of the research platform, a novel AI/ML-enhanced link adaptation algorithm has been integrated into the end-to-end system. It dynamically adjusts the downlink modulation and coding scheme (MCS) to optimise spectral efficiency and link reliability. The AI-driven link adaptation can learn not only site-specific propagation characteristics but also user equipment-specific behaviour on the fly, emphasising the need for end-to-end testbeds that capture these effects.

The testbed integrates the R&S SMW200A vector signal generator featuring dynamic channel emulation capabilities and the FSW signal and spectrum analyser. Jointly, these instruments enable the emulation of complex site-specific radio channels, seamlessly interfacing with the NVIDIA Sionna RT differentiable ray-tracing software. This closed-loop setup enables researchers and developers to evaluate the performance of novel AI-driven RAN features under dynamic, site-specific RF conditions – all without leaving the lab.

Gerald Tietscher, Vice President Signal Generators, Power Supplies and Meters at Rohde & Schwarz, said: “We’re excited to continue our ongoing collaboration with NVIDIA with this latest proof-of-concept for testing AI-enhanced base stations for both 5G-Advanced and 6G under realistic propagation conditions. Leveraging digital twin technology and ray tracing, this approach aims to bridge the gap between AI-driven wireless simulations and real-world deployment, facilitating more efficient and accurate testing of next-generation receiver architectures.”

Soma Velayutham, global industry business development lead for telecommunications at NVIDIA, said: “Synthetic data generation is transforming the way we train and validate AI-RAN systems by ensuring accuracy, scalability, and privacy, especially in settings of sparse data. Rohde & Schwarz, leveraging the NVIDIA Sionna Research Kit, exemplifies how industry-leading expertise and innovative technology can come together to accelerate progress in this critical field.”

The post R&S advances AI-RAN testing using digital twins in collaboration with NVIDIA appeared first on ELE Times.

NanoXplore, the European leader in the design of SoC FPGA and radiation-hardened FPGA technologies, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announce the qualification of NG-ULTRA for space applications. This radiation-hardened SoC FPGA has been designed specifically for space applications, including low- and medium-earth orbit constellations, and is set to be used in numerous satellite equipment systems, including flagship missions such as Galileo, Copernicus, and potentially IRIS.

“The ESCC 9030 qualification for the NG-ULTRA is a historic step. It proves that Europe now masters the entire production chain for cutting-edge digital components tailored to the requirements of both deep-space and new space constellations. Thanks to the support of the ESA, CNES, and the European Commission (via DG-DEFIS), NanoXplore & STMicroelectronics are securing EU strategic autonomy while making European satellites more competitive than ever.” — Édouard Lepape, CEO, NanoXplore.

“Space applications require a robust sovereign supply chain, radiation-hardened and cost-optimised chips. ST is leveraging its expertise in GEO and LEO platforms with proven FD-SOI technology, hardening expertise, manufacturing, advanced packaging and quality assurance assets in Europe to enable NanoXplore’s NG-ULTRA to the New Space market,” said Thomas Goust, Division General Manager of Space Division, RF & Optical Communication sub-group at STMicroelectronics.

First product certified to ESCC 9030 for the European New Space industry

This qualification marks a major industrial and technological milestone for the European space ecosystem: NG-ULTRA is the first product qualified to ESCC 9030, a new European standard dedicated to high-performance micro-circuits in flip-chip’ed on organic substrate or plastic package. This standard delivers the reliability required for space applications while enabling a transition away from traditional ceramic-packaged solutions – well-suited for deep-space but heavier and more expensive – marking a key step forward for constellations and higher-volume missions.

The “new space” dynamic (constellations, Low and Medium Earth Orbits, higher volumes) is transforming requirements for onboard digital equipment and driving a shift in scale: there is a simultaneous need for greater computing power, controlled power consumption, and contained costs compatible with large-scale deployments. NG-ULTRA addresses this challenge by enabling more data to be processed directly in orbit (edge computing), thereby limiting transmission bottlenecks between space and ground.

NG-ULTRA targets strategic functions such as on-board computers, data management and routing between sub-systems, image and video processing (real-time compression and encoding), Software Defined Radio (SDR) – enabling remote evolution of communication modes, and onboard autonomy (detection, recognition, supervision).

A secure, European supply chain

Beyond performance, this program embodies a strategic ambition to secure a sovereign and sustainable European supply chain for long-duration missions by reducing critical dependencies. For NG-ULTRA, the industrial framework combines design, manufacturing, assembly, and testing capabilities across European sites, with the aim of reconciling competitiveness, volume production, and space-grade reliability.

In addition to its own R&D and design center in Paris, Grenoble and Montpellier, NanoXplore leverages various STMicroelectronics facilities in Europe, including the Grenoble R&D and design center, the 300mm digital fab of Crolles, the space-specialist packaging facility in Rennes (France), the test and reliability site in Grenoble (France) and Agrate (Italy) and additional redundant qualified sites in Europe.

Technical specifications

With an “all-in-one” SoC (System on Chip) architecture designed specifically for platform and onboard computing applications, NG-ULTRA combines a multi-core processor with programmable hardware on a single chip. This architecture allows for greater design agility, reduces electronic board complexity and component count, and optimises latency, mass, and power consumption.

NG-ULTRA is built on STMicroelectronics’ 28nm FD-SOI digital technology platform, recognised for its advantages in energy efficiency, resistance to space radiation and advanced architecture features. Combined with a unique advanced radiation hardening technology, the NG-ULTRA is built to survive the thermal cycles, shocks, and vibrations of launch and long-term orbital life so as to ensure best-in-class performance and durability in the harsh space environment throughout the mission lifetime.

The NG-ULTRA has been designed to operate reliably in harsh radiation environments, offering a Total Ionising Dose (TID) tolerance of up to 50 krad (Si) to ensure long-term performance. It also demonstrates strong resilience to single-event effects, with Single Event Latch-up (SEL) immunity tested up to 65 MeV·cm²/mg and Single Event Upset (SEU) immunity validated for Linear Energy Transfer (LET) levels exceeding 60 MeV·cm²/mg.

NG-ULTRA integrates a full SoC based on quad-core Arm Cortex R52 and provides high computational capability (537k LUTs + 32 Mb RAM) to address the most complex onboard computer requirements.

Its streamlined architecture drastically reduces PCB complexity and system mass—two of the most critical constraints in space design. By minimising the component count, the NG-ULTRA simultaneously lowers total power consumption and project costs while increasing overall system reliability.

In addition, the SRAM-based architecture of the NG-ULTRA enables an adaptive hardware approach, allowing for unlimited on-orbit reconfiguration. This “hardware-as-software” flexibility allows operators to update functionality post-launch, adapt to evolving communication standards, or optimise the chip for different mission phases. The NG-ULTRA thus provides a future-proof platform that extends the operational relevance of assets long after they leave the launchpad.

To facilitate adoption, NG-ULTRA is also available as an evaluation kit — a complete prototyping platform that allows to rapidly validate performance and interfaces, reduces integration risks, and accelerates software and onboard logic development prior to flight-board production.

The post NanoXplore & STMicroelectronics deliver European FPGA for space missions, first to qualify to new European ESCC 9030 standard for space applications appeared first on ELE Times.

In 2026, a new class of intelligent machines will emerge. Several of the trends we’ve identified are natural extensions of those we highlighted at the start of 2025, with the new year’s advancements driven by the widespread deployment of existing technologies. Industrial sectors, robotics, automotive, consumer electronics and smart homes will all benefit from increased autonomy, underpinned by the specialised silicon platforms and advanced processing that will make this a reality.

The foundation will continue to be semiconductor material innovation. Silicon carbide (SiC), gallium nitride (GaN) and silicon photonics will support increasing demands for efficient power conversion, thermal management, and data transmission. Architectural advances in neural processors, imaging sensors, microcontrollers and microprocessors will enhance the capabilities of autonomous and intelligent systems. Security of these systems will remain in sharp focus. In summary, our view for 2026 is: smarter machines will be built on faster and more secure semiconductor technologies.

Edge AI innovation continues to be the lynchpin connecting these trends. In 2025, we saw the momentum of more AI finding its way to the edge. For 2026, this momentum accelerates, as embedded AI finds its way into almost every category of device and sensor. These edge AI and TinyML-enabled devices will benefit from enhanced awareness and analytical capabilities, in turn enabling them to act more autonomously. We will also see the emergence of more domain- and application-specific AI chips, optimised for workloads in different environments and sectors.

The next evolution of robotics (see below), industrial systems, automobiles, smart home technology, consumer devices, and more will be supported by powerful and energy-efficient AI at the edge. In turn, these will become more active participants and partners in every aspect of our lives.

Large language models (LLMs) – AI trained on massive text datasets – have been dominant in the AI discussion of recent years. As highlighted last year, these advancements, along with those in neural processing, allowed machines to “think” better.  A new type of model will help turn thinking into action in 2026. New large action models (LAMs), sometimes called vision-language-action (VLA) models, are enabling robots to interpret their surroundings, make decisions, and perform tasks in the physical world, which some are calling “embodied AI”.

LAMs supporting robotic inference will drive the widespread emergence of edge AI-powered cobots working alongside humans, deployments of humanoid robots, and autonomous industrial systems that act independently with advanced sensing and motor control. The combination of enhanced intelligence and dexterity will pave the way for robotics to move from factories into retail, hospitality, and the home.

Last year, we predicted how the ability to use traditional semiconductor technologies would help advance the development of quantum computing. This has been the case, and the coming year will see quantum computers based on FD-SOI processes move from the lab to deployment. However, in 2026, the quantum-related priority for all organisations will relate to one topic: cybersecurity.

Cybercriminals are already preparing to add quantum computing to their armoury through cryptographically-relevant quantum computers (CRQCs). They are harvesting encrypted data today, confident that quantum computing will provide the power to access it in the future, which poses a real and immediate risk to every organisation. Post-quantum cryptography (PQC) provides a solution; PQC algorithm standards are being established and made available to preemptively secure devices and software. The time to act is now.

Self-driving taxis provide the highest profile examples of the progress of autonomous vehicles, underpinned by advances in LiDAR, AI-enabled cameras, and integration with infrastructure. The number of cities around the world allowing the use or trial of so-called “robotaxis”, notably in the US and Asia, grew significantly in 2025, suggesting positive momentum. Challenges remain, with Level 4 autonomy remaining restricted to controlled environments (Level 5 being complete autonomy in any environment) and major manufacturers scaling back timelines to full autonomy.

Consumer confidence is also a barrier to adoption, though studies have shown that acceptance is far higher following use. With the opportunities increasing for consumers to experience the benefits, along with technological enhancements and efficiencies, 2026 should see progress accelerate.

In 2026, several trends will converge to transform domestic technology. Edge AI, advances in connectivity protocols such as Matter and Thread, and approaches to security adopted from the commercial environment will make our homes smarter, better connected, and more secure.

Improving the collection and sharing of data between domestic devices, along with increased intelligence at the edge, will act as a force multiplier, delivering what analyst Gartner has defined as “ambient intelligence”. Among other benefits, this will allow for the creation of domestic digital twins, a concept we touched on in 2025 as an opportunity in every sector, optimising the efficiency of our homes.

As smart homes become more intelligent and connected, cybersecurity will be an increasing concern. We expect to see principles crossing over from commercial environments to the home, and in particular, best practices such as a Zero Trust approach to security in smart home technologies.

As we predicted in 2025, there has been no slowdown in the desire to launch more satellites into space, and particularly those low Earth orbit (LEO) satellites forming part of the communications mega-constellations. 2026 will see advancements in how these satellites are used to provide truly global connectivity. For communications network operators, the decision between traditional terrestrial networks and the growing mega-constellations of low Earth orbit (LEO) satellite networks is no longer “either/or”, but “both”. Mobile network operators are already integrating LEO networks as backhaul, filling coverage gaps in earth-based networks or to improve connection speeds.

This integrated use of networks will continue in 2026, creating a unified “network of networks” managed by AI and advancing towards goals for seamless global connectivity. The economic and educational benefits to previously unconnected parts of the globe will be huge, with significant additional enhancements to connectivity across worldwide consumer, commercial and industrial sectors.

Imaging technology provides the foundation for many of the innovations that allow devices to operate more effectively and efficiently. Yet the central concept of lenses as stacks of curved glass to refract light has remained unchanged for centuries. Metasurface technology shifts this paradigm by recreating optical functions on perfectly flat, ultra-thin layers patterned with nanostructures. Imaging becomes smaller, less costly, and more flexible wherever it is embedded. Imaging improvements will impact every area of life, work, and industry, from more spatially-aware robotics and automobiles, to more secure devices, from enhanced photography to applications that vastly improve power efficiency.

Technology rarely moves in straight lines, but the direction is becoming clearer. The trends emerging for 2026 indicate a world shaped by greater autonomy, deeper intelligence, stronger intelligence and more, all shaped by advances in semiconductor technologies. The opportunity for organisations that understand these trajectories early enough is not simply to react but to shape what comes next. The systems designed today will define how people live, work and connect in the years to come.

The future is already taking form; it’s a matter of how boldly we choose to build it.

The post Top Seven Tech Trends in the semiconductor sector for 2026 appeared first on ELE Times.

Rohde & Schwarz, in collaboration with Broadcom, is set to display its CMX500 multi-technology multi-channel signalling tester at MWC Barcelona 2026 with newly added Wi-Fi 8 (IEEE 802.11bn) testing capabilities. The setup at the Rohde & Schwarz booth (5A80) will validate a prototype Wi-Fi 8 device from Broadcom, showcasing physical layer features unique to Wi-Fi 8.

Addressing UHR challenges with the CMX500

As Wi-Fi transitions beyond increasing throughput, the IEEE 802.11bn amendment introduces crucial advancements focused on delivering consistent, high-quality connectivity across a diverse range of dense environments. It is designed to handle the growing number of connected devices and the increasing demands of applications like VR/AR, 8K streaming, and industrial IoT.

Wi-Fi 8 builds upon the foundation of Wi-Fi 7, retaining core physical layer parameters like supported frequencies up to 7.125 GHz, channel bandwidths up to 320 MHz and 4096QAM modulation, as well as Multi-Link-Operation (MLO). However, to achieve its UHR goals, IEEE 802.11bn introduces a suite of innovative PHY and MAC layer technologies that present new testing hurdles. At MWC 2026, visitors can experience how to address key testing challenges associated with Wi-Fi 8 with the enhanced testing capabilities of the CMX500 one-box signalling tester, one of the most versatile mobile device test platforms in the market, which supports many of the demanding features of Wi-Fi 7 and Wi-Fi 8 today.

For example, Wi-Fi 8 uses distributed resource units (dRU) to overcome power spectral density (PSD) limits. With dRU measurement,s users can validate their device’s effectiveness in boosting uplink transmit power and improving connection reliability. Another technology is unequal modulation (UEQM), where throughput is improved in difficult reception scenarios by allowing each MIMO link to use a different modulation scheme. With UEQM analysis, users can assess the ability of the test device to adapt the modulation accurately, using the specified modulation of coding scheme (MCS) combinations. With comprehensive signalling mode tests, covering a broad range of Wi-Fi 8 features, users can perform in-depth analysis of performance characteristics.

Future-ready platform for all cellular and non-cellular standards

The CMX500 is a modular, powerful one-box signalling tester enabling comprehensive multi-technology testing. It covers LTE and NR in SA/NSA modes, NR-NTN, NB-NTN, Direct-to-Cell (D2C/DTC) testing and WLA, N, including Wi‑Fi 7 and Wi‑Fi 8. Consequently, the CMX500 allows R&D engineers of wireless devices to comprehensively test their design’s operation in both cellular and non-cellular standards of the latest generation in a single instrument setup.

Rohde & Schwarz will present the CMX500 one-box signalling tester, validating a Wi-Fi 8 device from Broadcom and other comprehensive test solutions for next-generation WLAN at MWC Barcelona 2026 at the Fira Gran Via in Barcelona, in hall 5, booth 5A80.

The post R&S and Broadcom showcase first Wi-Fi 8 RF signalling tests, paving way for next-gen connectivity appeared first on ELE Times.

 Keysight Technologies introduced its next-generation Infiniium XR8 Real-Time oscilloscopes, designed to accelerate high-speed digital and compliance testing while improving efficiency and insight for modern electronics development.

As interface standards such as USB, DisplayPort, and DDR rapidly evolve and scale in speed and complexity, engineers face tighter margins, higher data rates, and compressed development timelines. These pressures result in longer validation cycles, reduced noise tolerance, and growing lab constraints. The Infiniium XR8 addresses these challenges with a completely new hardware and software architecture optimised for today’s high-speed digital applications and emerging standards, helping engineering teams condense days of testing into hours.

The XR8 integrates newly designed front-end ASIC technology and an integrated ADC and DSP digital engine to preserve signal integrity, improve timing accuracy, and deliver consistent, repeatable measurements across high-speed serial, memory, and mixed-signal designs. These capabilities are essential for debugging and validating today’s high-speed interface, where small impairments in signal quality can directly impact system performance and compliance margins.

A redesigned mechanical architecture further enhances usability by reducing system power consumption, improving thermal efficiency, and minimising acoustic noise with a compact footprint. Engineers can deploy high-performance oscilloscopes in space-constrained labs and dense validation environments while maintaining a stable, low-noise operation.

Powered by Keysight’s new Infiniium 2026 software platform, the XR8 delivers faster response time, improved stability, and streamlined workflows for high-speed digital and compliance testing. The modern user experience features flexible waveform windows, enhanced visualisation, and productivity tools such as drag‑and‑drop functionality and an integrated SCPI recorder. Optimised multithread processing and memory management enable engineers to fully leverage Keysight’s measurement science, delivering enhanced jitter decomposition, PAM analysis, and advanced equalisation for deeper insight and faster validation.

Together, the new hardware and software architecture enable: 

Maximised test margin and signal integrity

Intrinsic jitter as low as 13 fs rms and noise performance below 130 µV at 8 GHz bandwidth provide exceptional fidelity and preserved compliance margin, enabling confident validation of high-speed interfaces including USB4v2, DisplayPort 2.1, and DDR5. 

Accelerated compliance testing efficiency

A new ADC and DSP digital engine combined with Infiniium 2026 software accelerates acquisition, analysis, and reporting by up to three times, dramatically reducing validation cycles and improving overall test throughput. 

Compact, quiet, and flexible lab deployment

Lower power consumption, enhanced thermal design, and reduced acoustic noise create a smaller, more flexible platform that can be positioned closer to the device under test while supporting comfortable, distraction-free daily engineering workflows.

Jun Chie, Vice President, Keysight Product Management, said: “Our customers are under intense pressure to validate increasingly complex, high-speed designs on compressed schedules. The Infiniium XR8 directly addresses that reality, preserving signal fidelity, accelerating compliance workflows, and reducing lab constraints in a single, streamlined platform. It’s about giving engineers back time, confidence, and productivity when they need it most.”

“As India strengthens its leadership in AI data centres, 5G-Advanced, next-generation computing, and aerospace and defence, signal integrity measurement challenges are becoming increasingly complex,” said Girish Baliga, General Manager, Industry Marketing, Keysight India. “The Infiniium XR8 oscilloscope delivers the precision and performance required to accelerate innovation while ensuring accurate, high-speed validation. As India advances its ‘Make in India’ vision and expands its global R&D footprint, demand for ultra-high-speed digital test solutions continues to grow. The XR8 empowers local engineering teams with the confidence and efficiency needed to bring world-class technologies to market faster.”

The post Keysight launches next-gen Infiniium XR8 Oscilloscopes for faster analysis, clearer insights, and a compact design appeared first on ELE Times.

Rohde & Schwarz will present its advanced test and measurement solutions for the embedded industry at embedded world Exhibition & Conference in Nuremberg, Germany. Visitors can find the T&M expert at booth 4-218 in hall 4 of the Nuremberg Exhibition Centre from March 10 to 12, 2026. There, they can delve into the company’s innovations designed to help engineers enhance device energy efficiency, expedite EMC compliance within the design process, speed up digital protocols debugging, and meet required regulatory standards for wireless interfaces.

Next generation oscilloscopes

At Embedded World, Rohde & Schwarz will showcase its ever-growing range of next-generation oscilloscopes, from MXO 3 to MXO 5, all powered by the same next-generation MXO-EP ASIC technology from Rohde & Schwarz, originally introduced with the MXO 4 in 2022. The latest addition, the compact MXO 3, comes with up to eight channels and offers a combination of features that rival higher-class oscilloscopes, such as a real-time capture rate of up to 99% and hardware-accelerated functionality on math, spectrum and zone trigger.

Ensuring reliability in power electronics

Combined with high voltage, current and optically isolated probes (R&S RT-ZISO), the eight-channel models of MXO 3 and MXO 5 extend their capabilities to power electronics applications. For power conversion, the instruments’ eight channels and 18-bit HD mode provide critical visibility into complex systems like motor drives and inverters, enabling precise measurements for efficiency and optimisation. Furthermore, they simplify power sequencing analysis with simultaneous multi-channel observation and deep memory of up to 500 Mpts, enabling longer recording durations and precise analysis of small signal events. Additionally, their fast spectrum analysis capability makes them excellent tools for quickly identifying EMI issues and noise sources.

EMI testing for embedded systems

Every electronic product and component is likely to emit conducted or radiated electromagnetic emissions. Especially for densely packed embedded systems, early debugging helps to isolate and correct EMI issues and accelerates time-to-market. As a leader in EMC testing, Rohde & Schwarz will present solutions that integrate EMI testing into the product design process. Visitors can learn how to use the R&S EPL1007 EMI test receiver in fast, accurate and reliable EMI pre-compliance and compliance measurements up to a frequency range of 7.125 GHz. The instrument offers device developers and conformance test houses the flexibility to upgrade with evolving needs – from preselection, including a preamplifier, up to a full CISPR 16-1-1 compliant test receiver.

Verifying signal integrity of digital designs

All hardware elements on a board layout are potential causes of signal degradation. To test the signal integrity on a PCB, Rohde & Schwarz will showcase its R&S ZNB3000 vector network analyser at embedded world, covering up to 40 GHz. This VNA, part of the new midrange family offering instruments with a maximum frequency range of up to 54 GHz, has redefined the standard for speed, precision and versatility with its industry-leading dynamic range, fast measurement speed, and scalable upgrades, perfectly suited for signal integrity applications. Visitors can experience the instrument’s advanced de-embedding techniques, which facilitate characterising the test fixture, extracting the S-parameters and de-embedding the test fixture in a user-friendly manner, with the signal quality visualised by a simulated eye diagram.

Testing of high-speed interfaces

High-speed digital interfaces are integral to electronic designs, with increasing data rates and integration density posing new challenges at the IC, board and system level. Trade show visitors will learn at the Rohde & Schwarz booth about powerful signal integrity test tools for system verification, debugging, and compliance testing for different high-speed busses. Rohde & Schwarz will showcase, for example, 1GBASE-T Ethernet compliance testing using the R&S RTO6 oscilloscope and related equipment to ensure that a 1 Gigabit Ethernet (1GbE) physical layer (PHY) transceiver meets the specifications outlined in the IEEE 802.3 standard. In a different setup, Rohde & Schwarz will showcase its R&S RTP164B oscilloscope for signal integrity testing on a multitude of standards, including DDR5 and USB3.2.

When it comes to automotive interfaces, the emerging standards, including Automotive Ethernet, OpenGMSL or ASA (Automotive SerDes Alliance), bring new challenges for design. Rohde & Schwarz already supports all of these new standards and will showcase comprehensive validation using the R&S RTP164B oscilloscope, featuring signal integrity debugging and automated compliance on ASA, as well as protocol decoding of 10Base-T1S to ensure robust and reliable link performance.

Battery life testing

Battery life is critical for battery-powered devices. Rohde & Schwarz will demonstrate in real time how the features of smart devices affect their power consumption. The setup is based on the R&S NGU source measure unit emulating a battery. The integrated analysis tool captures and visualises current across sleep-to-active transitions. In another application on battery testing with the R&S NGM202, cells will be charged and discharged to characterise battery behaviour and build accurate battery models.

Wireless connectivity testing

Embedded systems increasingly incorporate wireless connectivity as a core function. Thorough testing is essential to ensure reliable performance, interoperability and compliance with industry standards. The complexity of these standards requires specialised test equipment and expertise. The CMP180 radio communication tester from Rohde & Schwarz contains two analysers, two generators and two sets of eight RF ports in a single box and supports many cellular and non-cellular technologies across R&D, pre‑conformance and mass production. At embedded world, visitors will experience the CMP180 testing both Bluetooth LE and Wi-Fi 8 devices.

The platform already supports physical layer testing for the new Bluetooth LE Channel Sounding and new Bluetooth LE High Data Throughput (HDT) feature, a cornerstone for the next generation of Bluetooth Low Energy (LE), offering increased capacity, better energy efficiency, improved spectrum efficiency and enhanced reliability. Wi-Fi 8, based on the IEEE 802.11bn standard, sets new expectations for consistent, ultra-high-reliability and quality connectivity. Designed to support a growing number of connected devices and demanding applications like XR and industrial IoT, the CMP180 helps engineers navigate the technical complexities of 802.11bn throughout the entire device lifecycle in non-signalling mode with its advanced capabilities and broad bandwidth support.

Efficient production lines with tailored solutions
For production tests at component, module and system level, Rohde & Schwarz will showcase a rack-mounted test and measurement configuration, featuring the rack-optimised MXO 5C oscilloscopes and the PVT360A performance vector tester. This setup will demonstrate how tailored Rohde & Schwarz test solutions contribute to a production environment built for reliable validation, streamlined workflows and maximised throughput.

These and other test solutions for the embedded industry can be found at the Rohde & Schwarz booth 4-218 in hall 4 at the Embedded World Exhibition & Conference from March 10 to 12, 2026, in Nuremberg, Germany.

The post R&S showcases its comprehensive embedded systems test solutions at embedded world 2026 appeared first on ELE Times.

A new report by an environmental group, Toxics Link, reveals significant structural gaps in India’s Extended Producer Responsibility (EPR) framework for e-waste. The study, titled “Long Road to Circularity,” warns that while the EPR model is a cornerstone of waste management, it currently fails to capture a vast range of critical minerals essential for India’s green transition.

The Extended Producer Responsibility (EPR) framework mandates the recovery of only four metals—gold, copper, iron, and aluminium—leaving critical metals untapped. A vast range of valuable and critical metals, including neodymium, dysprosium, and lithium, are essential to strengthening resource security but is currently overlooked and lost.

In light of these concerns, the report examines current e-waste regulations and highlights critical challenges limiting their effective implementation. The report also underscores persistent issues, including low consumer awareness, poor financial traceability of e-waste flow and limited monitoring capacities. The study identifies several operational gaps. Key findings from the report include:

• The EPR portal currently lacks data on total market players and leaves small-scale manufacturers, online sellers, and grey-market importers outside the system.
• Information regarding non-compliance penalties and environmental compensation remains unavailable for the 2023–24 and 2024–25 fiscal years.
• Detailed data is accessible only to operators, resulting in limited public visibility into system performance.
• The current regulation does not identify and place responsibility on any individual stakeholder for the setting up of collection centres, thus making it extremely difficult for consumers to deposit their waste in the authorised e-waste stream.
• No incentive to producers and manufacturers adopting “green” product designs or for recyclers implementing high-quality, advanced recovery processes.

“While Extended Producer Responsibility is a cornerstone of India’s e-waste management framework, the principle alone cannot deliver the desired outcomes. It must be complemented by an effective and robust waste collection system, integrating the informal sector and the development of high-tech recycling facilities along with public awareness for advancing system transparency”, Satish Sinha, Associate Director, Toxics Link.

The report suggests the following key recommendations to plug some of the gaps in the
present system:

• Enhance system accountability and transparency by making data accessible to the
  public.
• Strengthen reverse supply chains and collection mechanisms to streamline the flow
  of e-waste.
• Expand consumer awareness on the advantages of e-waste recycling and the
  importance of using authorised collection channels.
• Integrate the informal sector into the e-waste management ecosystem.

Together, these measures can help build a stronger and more effective e-waste
management system.

The post Toxics Link study Finds a Long Road to Circularity in India’s E-waste EPR Model appeared first on ELE Times.

ESG Data & Solutions (ESGDS) is a fast-growing Indian technology company. It builds tools to enable banks, investors, and other financial groups to track and analyse a company’s performance on Environmental, Social, and Governance (ESG) issues.

With a vast range of covered topics and multiple providers employing different types of methodologies and taxonomies, ESG data sets are notoriously difficult to work with.

Because these analyses guide critical research and investment decisions, ESGDS developed ESGSure—a bespoke research platform built on MongoDB Atlas—to address the challenge.

THEIR CHALLENGE: Overcoming the relational model limitations to unlock AI scale

ESGSure collects points from over 20,000 companies and investors—these include annual reports and corporate filings, news, and client-specific questionnaires. The platform also tracks a range of other publicly available sources, including news articles, compliance records, and sanctions lists, among others. These resources come in various formats, including videos, PDFs, transactional data in APIs, and more.

Before moving to MongoDB Atlas, ESGDS relied on several other databases, including relational databases such as PostgreSQL and Pinecone for vector search workloads. As the use cases and data sets expanded, ESGDS encountered limitations.

“Our platform needs to process massive, diverse, and unstructured data sets, so we can then use a combination of large language models (LLMs), real-time data, and vector search capabilities to deliver AI-driven granular, personalised, and actionable insights for investors,” said Arun Doraisamy, Co-Founder and Chief Technology Officer at ESGDS. “We needed more flexibility, to reduce complexity, and do that at scale. This meant moving away from a relational model and onto a database model that fit our needs.”

Several limitations drove ESGDS to seek a new database:

• Lack of flexibility and scalability: Rigid legacy relational databases lacked the schema flexibility required to dynamically store and update ESGDS’s rapidly evolving datasets. This resulted in inconsistent insights that hindered analysts’ and investors’ ability to make timely and accurate data-driven decisions. Additionally, a lack of elastic scalability throttled ESGDS’s ability to handle continuous data growth, compromising its ambitious expansion plans.
• Delayed data insights: Stale data is a significant challenge for the ESG data analysis industry—by the time it is collected and analysed, ESG data can be up to a year old. To add to this challenge, manual ESG data review in ESGDS’s legacy database took an average of 2 to 3 days per company. ESGDS wanted to automate these processes to provide investors with real-time insights.
• Complex security and compliance: ESGDS manages sensitive, private datasets for its clients. Ensuring secure storage, data encryption, and compliance with ESG frameworks and regional requirements, such as GDPR, has become increasingly complex. With expansion into highly regulated countries on its roadmap, ESGDS knew this challenge would become acute.
• Limited global portability: ESGDS needed a data platform that would easily and efficiently power growth plans across Europe, Asia Pacific, and North America. It had to support a reliable, multi-cloud, and multi-region infrastructure.

“We needed a modern, flexible model with built-in AI capabilities that could meet our complex needs, and keep evolving to support our ambitious growth and diversification goals,” said Doraisamy.

The post ESGDS’ AI platform slashes data processing time by 98% with MongoDB Atlas appeared first on ELE Times.

 Keysight Technologies introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data centre applications.

As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect designs for multi-die and stacked-die applications, which traditional workflows struggle to handle efficiently. As a result, teams spend significant time manually optimising the interconnects that include vias, transmission lines, solder balls, and micro-bumps while ensuring signal and power integrity in densely packed systems. This results in more design spins and longer product development cycles, creating a bottleneck that can delay product launches and increase development costs.

Keysight EDA software streamlines the process with a dedicated workflow for designing and optimising 3D interconnects accurately. The tool handles complex geometries, including hatched or waffled ground planes, which are critical to overcome manufacturing and fabrication constraints, especially silicon processes such as interposers and bridges, in advanced package designs. By enabling engineers to quickly design, optimise, and validate 3D interconnects used in chiplets and 3DICs, it minimises iterations and speeds time-to-market.

Key benefits include:

• Accelerates Design Cycles: Streamlined automation removes time‑consuming manual steps in 3D interconnect design, minimising errors and boosting first‑pass success
• Reduced Compliance Risk: Validates designs against emerging standards such as UCIe and BoW, ex VTF (Voltage Transfer Function), early in the lifecycle, reducing the risk of late-stage failures that lead to costly redesigns
• Predicts Performance Accurately: Electromagnetic-based simulation provides precise electrical analysis of printed circuit boards (PCB) and package 3D interconnect designs

The solution integrates with Keysight’s EDA tools as well as supporting the standalone version, enabling teams to incorporate 3D interconnect design and optimisation into existing workflows. When combined with Chiplet PHY Designer, engineers can design and optimise 3D interconnects specifically for chiplets and three-dimensional integrated circuits (3DICs), ensuring accuracy and reducing costly iterations in multi-die systems.

Nilesh Kamdar, EDA Design and Verification General Manager at Keysight, said:

“With today’s complexity, manual 3D interconnect design and optimisation have become a significant bottleneck. By streamlining the process and providing early insights into potential issues like signal and power integrity, we’re enabling engineers to get products to market faster and deliver compliant designs on tighter timelines.”

The post Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs appeared first on ELE Times.