ELE Times

India’s BrahMos missile is a milestone in new age technology and an icon of Indo-Russian defense cooperation Introduced through a joint collaboration between India’s Defense Research and Development Organisation and Russia’s NPO Mashinostroyenia in 1998, the name of the missile Brahmos is derived from the names of rivers Brahmaputra (India) and Moskva (Russia). It represents the integration of both countries technological strengths.

Land-launched and ship- launched Brahmos entered service in November 2005. Subsequently, an air-launched version was completed for the Su-30MKI fighter, which emerged in 2012 and became officially operational in 2019. The BrahMos is derived from the Russian P-800 Oniks cruise missile but has been indigenously upgraded and adapted to Indian Armed Forces specifications. It is the fastest supersonic cruise missile in active service worldwide, with the ability to cruise at speeds of Mach 2.8 to 3.0. Its speed makes it nearly impossible to detect and intercept, providing it with a decisive advantage over ordinary subsonic missiles.

Design:

Technically, Brahmos is a two-stage missile. Its first stage is a solid-fuel booster that takes it to supersonic speed, and the second stage is a liquid-fueled ramjet engine that maintains its cruise speed. The missile is stealth-designed to reduce radar detection and has the capability of low-altitude flying, particularly in sea-skimming mode. It adheres to a fire and forget policy with no further instructions after being fired, and it employs sophisticated inertial navigation supplemented with GPS/GLONASS technology for accuracies within a circular error probable (CEP) of less than a meter.

BrahMos has the capability to carry conventional warheads ranging from 200 to 300 kilograms and has a maximum range of 450 kilometers, with an extended-range division that can fly more than 800 kilometers under development. BrahMos is deployable from land-based platforms, submarines, surface ships, and fighter jets like Sukhoi Su-30MKI.

Variants:

A number of variants have been created to be compatible with various divisions of the military. These include Brahmos-A to be launched from air, BrahMos-ER for longer-range strikes and the BrahMos-NG (Next Generation) lighter and small variant being developed to be used by lighter planes and smaller launch platforms. A next-generation hypersonic version, BrahMos -II, is also on the cards, which plans to travel faster than Mach7.

Features:

Type: Supersonic cruise missile

Speed: Mach 2.8 to Mach 3.0 ( approximate 3,700 km/h)

Range: Up to 450 Km (Extended Range variant over 800 km)

Length: Approximately 8.4 meters

Diameter: Around 0.67 meters

Propulsion: Two stage-solid fuel booster and liquid-fueled ramjet

Launch Platforms: Land launchers, ships, submarines, aircraft

Guidance system: Inertial navigation system with GPS/GLONASS support

Conclusion:

In the recent India-Pakistan conflict, BrahMos missile was instrumental in the military campaign of India under ‘Operation Sindoor’. The Indian Defence Forces employed BrahMos missiles to carry out targeted attacks, having a deep impact on Pakistan’s defence setup.

India utilized BrahMos missiles along with other precision-guided weaponry such as HAMMER and SCALP missiles. BrahMos’s high speed (Mach 2.8- 3.0), precision accuracy, and fire and forget nature enabled India to target deep, the extended range (up to 800 km) of the missile granted strategic deterrence. The BrahMos missile is a symbol of India’s technological drive and strategic independence.

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Credifin Limited announced the launch of its new product EV Startup Loans. This product will promote entrepreneurship through EV business and deployment of active vehicles throughout the country. The EV Startup Loans will be available to any individual or company that wants to start a dealership or electric vehicle related business.

Under the EV StartUp Loans product, Credifin will provide the EV Entrepreneur loans up to Rs. Fifty Lakhs to begin with. On a need and case to case basis the loan amount can be increased going forward. With presence in over 200 locations in 13 states and expanding rapidly, Credifin is targeting 1000 EV Entrepreneurs in the next 2-3 years

Credifin has over 100 existing OEM partnerships across E-Rickshaw, L5 and EV 2 Wheeler Segment and will help the entrepreneur lendee with not just the financing but also facilitate tie ups with reputed manufacturers for setting up of the new dealership, at no cost. In addition, under the scheme, Credifin will also provide trade advance for the dealership to acquire the vehicles to be sold by them. Credifin will also offer financing of the vehicles to the end customer.

Credifin will help create EV entrepreneurs by creating an ecosystem where Credifin team will provide an end-to-end solution to the Entrepreneur. Whether it is setting up of the business, dealership, getting business leads, partnerships or help with local authorities for registration of the vehicles, Credifin’s team can assist the entrepreneurs and hand-hold them all the way.

“We at Credifin are committed to Building Bharat and what better way to do this than to make sure that our entrepreneurs have an enabling environment. Our EV StartUp Loan is a product that makes sure that setting up a business is made as easy as possible and that we are with them all through, ensuring that they not just survive but thrive. We have today, one of the biggest EV networks and we believe that the time is ripe to use this network to help individuals realize their dreams of building successful businesses in a sustainable manner”, says Shalya Gupta, CEO, Credifin Limited.

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• Cadence best-in-class simulation software integrated with NVIDIA Blackwell-accelerated compute enables unmatched scale and speed
• Delivers up to 80X higher performance and 20X lower power
• Optimized for a broad range of workloads across EDA, system design and drug design

Cadence announced a major expansion of its Cadence Millennium Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.

The new supercomputer integrates Cadence’s industry-leading solvers with NVIDIA HGX B200 systems, NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs and NVIDIA CUDA-X libraries and solver software. This powerful combination delivers dramatic reductions in simulation run times and up to 80X higher performance versus CPU-based systems for electronic design automation, system design and analysis, and drug discovery applications. The supercomputer provides a tightly co-optimized hardware-software stack that enables breakthrough performance with up to 20X lower power across multiple disciplines, accelerating the build-out of AI infrastructure, advancing physical AI machine design and pushing the frontiers of drug design.

“The Millennium M2000 Supercomputer will drive the next leap in AI-accelerated engineering by leveraging our massively scalable solvers, dedicated NVIDIA Blackwell-accelerated computing and AI to help designers continue to push the limits of what is possible,” said Anirudh Devgan, president and CEO of Cadence. “Purpose-built for the most advanced AI models of today and tomorrow, the Millennium M2000 Supercomputer delivers unprecedented designer productivity to propel the next generation of AI infrastructure, physical AI systems and drug discovery.”

“From biology to chip design, the world’s most complex engineering challenges require simulation at scales and speeds only possible with accelerated computing,” said Jensen Huang, founder and CEO of NVIDIA. “Built with NVIDIA Blackwell, CUDA-X and Cadence’s computational software, the Millennium M2000 Supercomputer is a new class of infrastructure: an AI factory for science to drive breakthroughs that will transform discovery across disciplines.”

The next generation of infrastructure AI, physical AI and sciences AI requires sophisticated computational capability in data centers and edge devices. Building upon the success of the Millennium M1 Supercomputer, which delivers breakthrough performance and energy efficiency for high-fidelity computational fluid dynamics simulations, the Millennium M2000 Supercomputer harnesses Cadence’s broad array of EDA, SDA and molecular software solvers to perform massive simulations that were previously impossible, transforming approaches to semiconductor and 3D-IC design, data center digital twins, drug discovery modeling and other engineering challenges across the hyperscale computing, automotive, data center, and aerospace and defense markets.

Advancing Semiconductors and 3D-IC Design

The industry’s first purpose-built emulator for AI design, the Millennium M2000 Supercomputer combines all the multiphysics capabilities needed to analyze and optimize 3D-IC and advanced packaging designs, including power, thermal, stress/warpage and electromagnetics. This enables superior quality in a fraction of the time, ensuring engineering teams can achieve greater reliability and efficiency in their product development cycles. For example, traditional semiconductor chip-level power integrity simulations are limited to small windows of time. Customers can now deliver simulations in less than a day with one Millennium M2000 Supercomputer that previously would have taken hundreds of CPUs almost two weeks.

Accelerating Autonomous System Design

The AI infrastructure buildout requires a significant investment in data centers and compute infrastructure. Doing this in an energy- and resource-efficient manner is critical to delivering the next generation of foundation models from AI factories. Digital twins improve operational efficiencies, reduce risk and lower total power consumption. The Millennium M2000 Supercomputer accelerates the design and operation of these data center digital twins and the modeling process required for the racks, boards and equipment that power them.

The Millennium M2000 Supercomputer also enables high-accuracy and high-capacity virtual simulations of machines that will embody AI outside of data centers, such as autonomous transportation, drones and robotics. To design these systems effectively, the combination of accelerated compute and computational software unlocks improved designs in a shorter time by delivering virtual wind tunnels that can precisely simulate real-world conditions. Designers of electronic and mechatronic systems can now make crucial decisions in less than a day versus multiple days, saving both time and energy compared to using a CPU-based Top 500 supercomputer cluster with hundreds of thousands of processors.

Advancing Life Science Innovation

Cadence Molecular Sciences accelerates drug discovery by enabling pharmaceutical customers to perform more simulations in less time with the Millennium M2000 Supercomputer. Cadence’s Orion Molecular Design Platform on Cadence OnCloud, available on the Millennium M2000 Supercomputer, equips researchers with unmatched computational power to speed up the discovery of potential drug candidates and enhance process scalability.

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Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation products, is now stocking the AR0145CS Hyperlux SG image sensors from onsemi. The AR0145CS is a 1/4.3 inch CMOS digital image sensor with a 1280 (H) x 800 (V) active-pixel array. Capturing both continuous video and single frames, the AR0145CS sensors are ideal for scanning and industrial inspection applications.

The onsemi AR0145CS Hyperlux SG image sensors, now available at Mouser, offer sophisticated camera features, including auto exposure control, pixel binning, row- and column-skip modes, and windowing. An innovative global shutter pixel design allows the sensors to capture moving scenes with speed and accuracy.

The AR0145CS image sensors include automatic black level calibration (ABLC) and produce clear, low-noise images in low-light and bright scenes. The sensors are programmable through a simple, two-wire interface and include an on-chip trigger mode for synchronization, built-in flash control, and two on-chip phase lock loops (PLLs). With this combination of features, the AR0145CS Hyperlux SG image sensors are suitable for a wide range of applications, including bar code scanners, gesture recognition, augmented reality, biometrics, surveillance, HD video, and machine vision.

As a global authorized distributor, Mouser offers the widest selection of the newest semiconductors, electronic components and industrial automation products. Mouser’s customers can expect 100% certified, genuine products that are fully traceable from each of its manufacturer partners. To help speed customers’ designs, Mouser’s website hosts an extensive library of technical resources, including a Technical Resource Center, along with product data sheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other helpful information.

Engineers can stay abreast of today’s exciting product, technology and application news through Mouser’s complimentary e-newsletter. Mouser’s email news and reference subscriptions are customizable to the unique and changing project needs of customers and subscribers. No other distributor gives engineers this much customization and control over the information they receive.

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The new rugged, compact, and low-profile CP2816 Series integrated thin film (ITF) directional couplers satisfy cross-market demand for small, high-power couplers compatible with VHF and UHF bands.

KYOCERA AVX,a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new CP2816 Series integrated thin film high-directivity couplers for high-frequency wireless systems.

Developed in response to customer requests for small, high-power couplers compatible with very- and ultra-high-frequency bands, the new CP2816 Series ITF high-directivity couplers feature a rugged, compact, and low-profile 2816 (7x4mm) case and exhibit 20W continuous power handling, 50Ω impedance, and excellent high-frequency performance from 225–750MHz and -40°C to +105°C. They also exhibit a tight coupling factor over the frequency range (-10±1.2dB, -10±2dB, -15±2dB, and -15±4dB), low insertion loss extending from less than -0.8dB to less than -0.9dB, a voltage standing wave ratio of 1.3, and -14dB directivity. Additional benefits include high temperature stability, high lot-to-lot and part-to-part reliability, and repeatable RF performance.

The new CP2816 Series ITF high-directivity couplers also enable quick adjustments to RF parameters and are ideal for use in high-frequency wireless applications extending throughout the telecommunications, commercial aerospace, military and defense, and automotive markets, including active antennas, base stations, emergency systems, mobile tactical radios, VHF and UHF radios, radar systems, and test equipment.

“Our new CP2816 Series integrated thin film high-directivity couplers satisfy growing market demand for small, high-power components optimized for microwave and RF systems,” said Mohammed Abu-Naim, RF Product Manager, KYOCERA AVX. “RF engineers are being challenged to design smaller, higher-power, and more densely populated circuits, and the new CP2816 Series couplers ensure that the transmitted power meets the specification in applications like these and prevent the power amplifiers from burning out due to return power.”

The new CP2816 Series ITF high-directivity couplers feature nickel land grid array terminations equipped with a lead-free solder coating that’s compatible with automated or manual soldering processes include reflow, wave, and vapor phase. They’re also RoHS compliant, compatible with IATF 16949, manufactured in an ISO-9001 facility, and packaged on tape and reel for reliable assembly.

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Automotive Grade Device Allows for Easier Integration Into Space-Constrained Designs, Offers High Resolution of 0.0026 lx/ct for Placement Behind Dark Cover Glass

Vishay Intertechnology, Inc. introduced the industry’s first AEC-Q100 qualified rectangular ambient light sensor. The Vishay Semiconductors VEML4031X00 features an ALS and highly sensitive IR photodiode in an opaque 4.38 mm by 1.45 mm surface-mount package with a low 0.6 mm profile. Occupying half the width of previous-generation solutions, the device allows for easier integration into space-constrained designs, such as bezel-less center control displays.

Highly accurate measurements are supported due to the spectral sensitivity of the Automotive Grade sensor released today, which matches that of the human eye, while its IR channel allows for light source differentiation. With an ambient light range from 0 lx to 172 000 lx, the VEML4031X00 will not saturate in daylight, while its high sensitivity of 0.0026 lx/ct allows the device to be placed behind dark cover glass.

Offering a high operating temperature range from -40 to +110 °C, the VEML4031X00 will be used for display backlight controls, infotainment systems, rearview mirror dimming, interior lighting control systems, and heads-up displays. The sensor supports the easy to use I²C bus communication interface for these applications and offers an interrupt function.

The VEML4031X00 features a supply voltage range of 2.5 V to 3.6 V, I²C bus voltage range of 1.7 V to 3.6 V and low shut down current consumption of 0.5 μA typical. RoHS-compliant, halogen-free, and Vishay Green, the device offers a Moisture Sensitivity Level of 2a and a floor life of four weeks in accordance with J-STD-020.

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As graphics processing units (GPUs) keep getting more powerful, so do the power requirements at the board level. Intermediate bus converters (IBCs) which convert for example a 48 V input voltage to a lower bus voltage are becoming more important for energy efficiency, power density, and thermal performance in AI data centers. Infineon Technologies AG announced that its OptiMOS 6 80V power MOSFETs in a compact 5×6 mm² dual side cooling package have been integrated into the IBC stage of an AI server platform of a leading processor manufacturer. Application tests show an efficiency increase of around 0.4 percent compared to previously used solutions, corresponding to a saving of around 4.3 W per kW of load. At the system level, this leads to significant energy savings when scaled across server racks or entire data centers. For instance, scaling this across a hypothetical hyperscale data center with 2,000 racks would result in over 1.2 MWh in energy savings every hour – the equivalent energy needed to charge 25 small electric vehicles. The implications of this development are substantial, with cost savings and reduced carbon footprint for data center operators.

As the demand for AI computing continues to grow, the need for efficient power management solutions will increase. Infineon’s OptiMOS 6 80V is well-positioned to meet the growing energy-efficiency demand, offering a high-performance solution for AI server IBCs. Infineon’s OptiMOS 6 80V MOSFET in the 5×6 mm² DSC package offers optimized switching performance in hard switching topologies and high energy efficiency due to lower conduction losses. Additionally, the compact package enables cooling on both sides, which contributes to improved thermal management and higher power density – both crucial in AI server environments with limited space.

The OptiMOS 6 80V is part of Infineon’s broad portfolio of silicon power MOSFETs, designed to meet the growing demands for performance, efficiency, and integration in AI server applications. The portfolio leverages the latest MOSFET technology and offers various application-specific variants, optimized for different cooling concepts and system requirements. Infineon silicon power MOSFETs meet the highest quality and protection standards, enabling assured product reliability, dependable system uptime, and proven supply stability.

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HARTING India subsidiary of HARTING Technology Group, a leading provider of industrial connectivity solutions, announced the grand opening of its new Technology Centre in Bangalore, often referred to as the Silicon Valley of India. This state-of-the-art facility is a strategically important location designed to foster innovation, enhance research and development, and support the growing demand for advanced connectivity solutions in the region. This location will hold well-trained core Innovation Hub team, Global IT solutions team, and is spread across approx. 7500+ Sq. Ft. area, and is in the industrial zone.

The inauguration took place in presence of some of Mr. Philip Harting, CEO of HARTING Technology Group, and Ms. Mabel Low, APAC Managing Director, along with Mr. Jacob Chandy, Managing Director of HARTING India. Some of the key customers also were present during the inauguration from companies like Schneider, BHEL, Biesse, ALSTOM, Wabtech, WEG, EVERAXIS. The new Technology Centre will serve as a hub for HARTING’s cutting-edge projects, focusing on the development of next-generation connectivity solutions for various industries, including manufacturing, transportation, and telecommunications. With a commitment to driving technological advancements, HARTING India aims to leverage local talent and expertise to create solutions that meet the evolving needs of its customers.

The Technology Centre will feature advanced laboratories, collaborative workspaces, and a dedicated team of engineers and researchers focused on developing innovative products and solutions. HARTING India is committed to investing in the local community and will also provide training and development opportunities for aspiring engineers and technology professionals.

“We are thrilled to establish our Technology Centre in Bangalore, a city known for its vibrant tech ecosystem and skilled workforce,” said Jacob Chandy, Managing Director of HARTING India. “This facility will not only enhance our R&D capabilities but also strengthen our collaboration with local partners and customers. We believe that innovation is key to staying ahead in today’s fast-paced market, and this centre will play a crucial role in our mission to deliver high-quality connectivity solutions.”

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Texas Instruments (TI) is demonstrating new power-management products and designs at the Power Conversion, Intelligent Motion (PCIM) Expo and Conference, May 6-8 in Nuremberg, Germany. At the show, TI is featuring semiconductor advancements for sustainable energy, automotive, USB Type-C and USB Power Delivery (PD), robotics, and motor control, including:

• Industry’s first automotive-qualified inductor-inductor-capacitor (LLC) controller for light electric vehicle charging: TI is debuting its new primary-side LLC controller, the UCC25661-Q1, in a three-stage AC/DC battery charger demonstration for electric two-wheelers. The demonstration showcases how the UCC25661-Q1 controller enables engineers to design a highly efficient and reliable power supply with double the power density using integrated features and TI’s patented Input Power Proportional Control (IPPC).

• 65W dual-port USB PD charger with self-biasing gallium nitride (GaN) flyback: TI is showcasing the industry’s first self-biasing GaN flyback converter, the UCG28826, in a demonstration of its 65W dual-port USB PD charger reference design. Designed for next-generation fast-charging applications, the UCG28826 converter delivers 65W across 90VAC to 264VAC in this reference design, enabling engineers to meet strict efficiency standards, minimize standby power consumption and increase power density.
• Short-circuit detection reference design with Flex: In collaboration with electronics manufacturer Flex, TI is demonstrating a comparison of shunt-based, desaturation and Hall-effect sensor methods for short-circuit detection in automotive onboard chargers and DC/DC converters. Booth visitors will learn how to enhance silicon carbide (SiC) metal-oxide semiconductor field-effect transistor (MOSFET) reliability by optimizing the current-sensing location, method and component selection, and printed circuit board layout to meet end-customer safety requirements.

Why it matters

Rising data consumption levels, shrinking consumer electronics, and a focus on renewable energy and vehicle electrification place unique demands on power engineers to maximize efficiency, push power into smaller spaces, and support higher voltages across all applications.

“TI’s broad portfolio and deep system design expertise on display at PCIM enable power engineers to achieve high performance, reliability and scalability in their next-generation applications,” said Mark Ng, director, Automotive Systems. “In automotive, for example, our power-dense and efficient semiconductors enable nearly every aspect of system design, from improved driving range to optimized charging, and new architectures for a feature-rich experience.”

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Hero MotoCorp, in collaboration with the Automotive Skills Development Council, launched Phase 2 of its flagship CSR initiative, Project Saksham, with a grand Training Inauguration Ceremony.

The initiative, aims to empower 20,000 women across India by providing specialized training for diverse roles in the automotive sector, including sales, service, and emerging areas like Electric Vehicle (EV) maintenance and diagnostics. This Event Was hosted in partnership with NIFA Infocom Services Pvt. Ltd. at the Pradhan Mantri Kaushal Kendra, Agra.

The ceremony was graced by Smt. Hemlata Divakar Kushwaha, Mayor of Agra Municipal Corporation, who served as the Chief Guest. She praised the program’s vision, stating, “Empowering women with technical skills not only benefits them individually but strengthens our economy and community. Initiatives like Project Saksham are crucial steps towards a more inclusive future.”

Adding to the occasion, Mr. Vinkesh Gulati, Vice President, ASDC, emphasized the broader industry impact of the initiative. “The automotive sector is undergoing a major transformation with emerging technologies like EVs. It is vital that women are not just participants but leaders in this evolution. Through Project Saksham, we are committed to building a skilled, gender-diverse workforce ready to meet the demands of the new mobility era,” Mr. Gulati remarked.

Phase 2 of Project Saksham builds on the success of the first phase by expanding its geographic footprint and curriculum. Alongside technical training, the program includes modules on soft skills, workplace readiness, and financial literacy to ensure holistic development.

The NIFA Infocomp-operated centre, Agra will serve as a key hub for delivering this transformative training. With initiatives like Project Saksham, Hero MotoCorp and ASDC reaffirm their dedication to fostering an inclusive, skilled workforce that will shape the future of the Indian automotive industry.

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Rohde & Schwarz and industry partners will be providing a virtual platform for RF design engineers to enhance their RF expertise and engage with industry leaders at the forefront of innovation. The online event will feature informative presentations by experts from Rohde & Schwarz, The University of Cardiff, Maury Microwave, Qorvo, MathWorks, Analog Devices and Greenerwave.

At the virtual RF Testing Innovations Forum 2025, taking place from May 20 to 21, 2025, design engineers will be able to gain invaluable insights into the latest advancements in RF testing methodologies and technologies. Led by experts from Rohde & Schwarz and industry partners, the two-day event will explore the critical factors expected to shape the future of RF testing.

Agenda highlights of Session 1

Day one of the two-day online event will start by covering subjects such as how to enhance the accuracy of mmWave non-linear vector network analyzers, which monitor harmonic distortion, intermodulation and other non-linear effects that can influence mmWave system performance.

Participants will discover innovative approaches to wideband modulated load pull including how to address typical limitations. This novel approach to RF front-end testing uses an R&S RTP oscilloscope plus an R&S SMW200A wideband vector signal generator. The experts will then take a look at the importance of achieving stable and accurate test levels using closed-loop power control. Areas covered will include supported signal forms, suitable test instrumentation and what needs to be considered to achieve the best results.

Two further presentations will take place before the first day’s session closes at 1:00 pm. One presentation will explore load pull techniques for next generation sub-THz components while the next will look at how to characterize wideband active RF components using real-world stimulus signals, in particular how using a fully modulated signal can speed up the overall testing process as it offers deep insights in a single measurement.

Agenda highlights of Session 2

Day two will open with a keynote interview exploring the evolution of vector network analyzers, considering growing demand for faster and more accurate test solutions while keeping costs down. RF components are becoming more sophisticated, having more features integrated into them and offering unseen performance and frequency coverage, posing new challenges to RF design engineers.

This will be followed by a presentation on dealing with the challenges of on-wafer characterization of bulk acoustic wave filter harmonics, especially in achieving accurate measurements and minimizing distortions. The speaker will outline how to use an advanced probing technique when characterizing the second harmonic performance of BAW filters.

The next presentation will look at how to accelerate antenna pattern analysis and simulation using MATLAB. There will be a particular focus on building the full 3D radiation pattern from a subset of 2D pattern measurements using analytical methods and AI techniques. Participants will also learn how to integrate the measured data into a system level simulation model for wireless communication and radar systems. A talk on dataset acquisition optimization for AI-controlled electronically steerable antennas will then take place before a break.

The RF Testing Innovations Forum 2025 will conclude with a presentation on advanced measurement techniques for ultra-wideband software-defined radios and an outline of the role of the R&S ZNB3000 VNA in RF front-end production.

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With the rapid growth of AI data centers, the increasing adoption of electric vehicles, and the ongoing trends in global digitalization and reindustrialization, global electricity demand is expected to surge. To address this challenge, Infineon Technologies AG is introducing the EasyPACK CoolGaN Transistor 650 V module, adding to its growing GaN power portfolio. Based on the Easy Power Module platform, the module has been specifically developed for high-power applications such as data centers, renewable energy systems, and DC electric vehicle charging stations. It is designed to meet the growing demand for higher performance while providing maximum ease of use, helping customers accelerate their design processes, and shorten time to market.

“The CoolGaN based EasyPACK power modules combine Infineon’s expertise in power semiconductors and power modules,” says Roland Ott, Senior Vice President and Head of the Green Energy Modules and Systems Business Unit at Infineon. “This combination offers customers a solution that meets the increasing demand for high-performance and energy-efficient technologies in applications such as data centers, renewable energy, and EV charging.”

The EasyPACK CoolGaN module integrates 650 V CoolGaN power semiconductors with low parasitic inductances, achieved through compact die packing enabling fast and efficient switching. Delivering up to 70 kW per phase with just a single module, the design supports compact and scalable high-power systems. Furthermore, by combining Infineon’s .XT interconnect technology with CoolGaN options, the module enhances both performance and reliability. The .XT technology is implemented on a high-performance substrate, significantly reducing thermal resistance, which in turn translates to higher system efficiency and lower cooling demands. This results in increased power density and excellent cycling robustness, even under demanding operating conditions. With support for a broad range of topologies and customization options, the EasyPACK CoolGaN module addresses diverse requirements in industrial and energy applications.

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Space-Saving, Industrial-Grade Devices Combine Load Voltages to 60 V With Isolation Voltage of 3750 VRMS and Low Leakage Current of < 1 µA

Vishay Intertechnology, Inc. introduced two new industrial-grade 1 Form A solid-state relays in the surface-mount SOP-4 package. The Vishay Semiconductors VO1401AEFTR and VOR1003M4T combine high continuous load current of 550 mA and 5 A, respectively, with load voltages of 60 V and 30 V, isolation voltage of 3750 VRMS, and low leakage current of < 1 µA typical.

With their high current capability, the devices released are ideal for replacing electromechanical relays, which are susceptible to damaging vibrations, with contactless optical relays that provide robust, vibration-proof switching for higher reliability and a longer service life. In addition, their high isolation voltage allows them to be used in harsh environments.

Offering typical turn-on and turn-off times of 1.3 ms and 0.15 ms for the VO1401AEFTR, and 0.5 ms and 0.1 ms for the VOR1003M4T, the relays will provide fast switching for industrial automation systems and controls; security systems; medical instrumentation; and broadcasting equipment. In these applications, the devices’ compact package saves board space, while their low leakage current translates into higher efficiency by helping to keep the sensitive load on the output side turned off.

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Infineon Technologies AG is launching its new CoolSET System in Package (SiP), a compact, fully integrated system power controller for highly efficient power delivery of up to 60 W at universal input voltage range of 85 – 305 VAC. Housed in a small SMD package, the high-voltage MOSFET with low RDS(ON) eliminates the need for an external heat sink, reducing system size and complexity. The CoolSET SiP supports zero-voltage switching flyback operation, which enables low switching losses and low EMI signature, while also enhancing system reliability and robustness. This makes it an ideal solution for applications such as major home appliances and AI servers. In addition, the controller makes it easier for developers to meet stringent energy standards, supporting future-proof power solutions for modern designs.

The CoolSET SiP integrates a 950 V startup-cell, an 800 V avalanche rugged CoolMOS P7 SJ MOSFET, a ZVS primary flyback controller, a secondary-side synchronous rectification controller, and reinforced isolated communication enabled by Infineon’s proprietary CT Link technology. This high level of integration supports the development of more sophisticated end products by significantly reducing the number of discrete components, lowering the bill of materials, and minimizing PCB space requirements. A comprehensive set of advanced protection features simplifies system integration and allows designers more flexibility to optimize their solutions and enhance the overall user experience.

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Rohde & Schwarz is accelerating the development of the new automotive Ethernet variant 10BASE-T1S by offering compliance and trigger & decode options

10BASE-T1S (IEEE 802.3cg) is a type of Ethernet networking technology that is designed for use in automotive and industrial applications, and 10BASE-T1S E2B products from ADI enable highly optimized yet flexible hardware-based Ethernet edge node connectivity solutions. The new variant is not just introducing a new lower speed grade of 10 Mbps over distances of 25 meters and beyond but also adding novel capabilities such as multi-drop transmission, thus eliminating the need for a switch. By eliminating the need for microcontrollers at the edge nodes, ADI’s E2B solution enables the centralization of all software to help enable next-gen zonal architectures and software-defined vehicles. This technological advancement is particularly applicable for linking sensors and actuators throughout the car body, powertrain, and beyond to a domain or zonal controller.

On the R&S MXO series oscilloscopes, the decoded packets are displayed in a color-coded manner, thereby making it straightforward for ADI engineers to identify crucial protocol messages such as Beacon, Commit and MAC frames. This allows for more efficient test validation, thus helping to enable shorter time to market. The 10BASE-T1S takes advantage of the new PLCA technology, making it essential to verify the timing and performance of various nodes connected onto the network. The time alignment of all decoded frames with the captured waveform simplifies debugging and facilitates precise timing measurements. ADI engineers can switch between various data representations such as DME symbols, scrambled, or unscrambled, providing valuable insights into the captured network traffic.

10BASE-T1S Ethernet technology offers additional advantages by supporting a high number of nodes on a single network, making it ideal for complex systems. Its short reach and low data-rate make it energy efficient and cost-effective. ADI’s innovative approach to 10BASE-T1S ensures that SDVs can deliver true value to OEMs by reducing form factors, cutting costs at the edge, lowering boot times, and offering bounded low latency, power saving, timestamping, and timed actuation, so that all nodes in the system are synchronized and operate seamlessly.

Fionn Hurley from ADI remarked: “ADI uses Rohde & Schwarz oscilloscopes, delivering reliable and precise measurements for our industry leading 10BASE-T1S solution. This reinforces our commitment to offering high-quality, robust technology solutions to our customers. ADI takes a holistic approach to system design and understands the complexity of the challenges faced by our customers and helps them overcome these challenges. We’re helping to drive the automotive industry towards a smarter, more efficient future.”

With the R&S MXO series oscilloscope, engineers can further leverage its high-performance capability to debug their 10BASE-T1S communication link. Standard debug tool like the spectrum mode, zone triggers and fast acquisitions makes it easy to detect anomalies on the bus. Furthermore, using the MXO’s ability to make standards-compliant 10BASE-T1S measurements in accordance with the IEEE 802.3cg and OPEN Alliance TC14 specifications, enables the automotive industry to ensure performance and interoperability of this growing automotive network technology.

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• Provides advanced radar target generation and EW threat simulation solutions to strengthen NATO’s radar and electronic support measures capabilities across member nations

Keysight Technologies. Inc. has been awarded a contract with NATO’s Naval Forces Sensor and Weapons Accuracy Check Sites to modernize its testing capabilities for critical radar and electronic support measures systems. Under this agreement, Keysight will deliver Radar Target Generator and Electronic Warfare testing solutions to be deployed at NATO Navy bases, enabling the calibration and maintenance of NATO radar systems and the assessment of ESM effectiveness.

Modern military and naval forces depend heavily on the accuracy and reliability of their radar and ESM systems for maintaining situational awareness, effective targeting, and timely threat detection. In an era of increasingly complex and rapidly evolving electronic warfare threats, defense organizations require sophisticated, high-fidelity test environments. These environments must be capable of replicating real-world scenarios with dynamic multi-emitter signals, advanced threat modeling, and closed loop testing methodologies.

Keysight’s Radar Target Generator and EW solutions are designed to meet these demanding requirements, empowering NATO FORACS to rigorously assess and optimize the operational readiness of radar and ESM systems across all member nations. The contract encompasses the integration and delivery of next-generation Radar Target Generators and EW threat simulators. This will ensure enhanced accuracy verification and thorough system performance testing within complex electromagnetic environments. Notably, the Radar Target Generator leverages commercial-off-the-shelf Keysight components, featuring customized firmware and a graphical user interface developed entirely in Europe and tailored to meet NATO’s specific requirements.

The systems that Keysight will deliver to NATO is defined by several key factors, including:

• High-fidelity Radar Target Generation: Simulates precise radar returns, including Doppler shift, range, and cross-section variability, enabling accurate testing of radar tracking.
• Sophisticated EW threat simulation: Creates complex electromagnetic threat environments with multi-emitter interference, jamming, and deceptive techniques to evaluate ESM system effectiveness.
• Customizable, open-architecture design: The modular hardware and software framework allows for incremental system upgrades, ensuring adaptability to future mission requirements.
• Deployable and modular configuration: Designed for field and lab deployment, providing flexible testing capability across multiple NATO sites.

The NATO FORACS Office in NATO Headquarters in Brussels, reported: “The NATO FORACS Office is pleased to note the placement of this contract which will supply important equipment to restore NATO FORACS’ core radar and ESM testing capabilities in order to meet its users’ evolving demands.”

Thierry Locquette, EMEA VP and GM at Keysight, said: “NATO’s ability to verify and enhance the accuracy of its radar and ESM systems is critical to mission success in today’s contested electromagnetic spectrum environment. Keysight is proud to provide the cutting-edge solutions necessary to enable NATO FORACS to maintain the highest levels of sensor performance, ensuring operational superiority across allied forces. Our Radar Target Generator solution was developed in Europe, working closely with our local R&D and solution centers as well as with European technology partners to provide a highly realistic, flexible, and future-ready test capability for NATO’s evolving defense needs.”

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The Cross-Compatible OBC Enables Flexible, Efficient, And Intelligent Power Systems Across Multiple Wide-Bandgap Platforms

Wise-integration, a pioneer in digital control for gallium nitride (GaN) and GaN IC-based power supplies, will break new ground at PCIM Europe 2025, May 6–8 in Nuremberg. In collaboration with Savoy International Group, the company will debut its digital controller of a silicon carbide (SiC) power demonstrator model, underscoring its expansion into complementary wide-bandgap technologies and showcasing its WiseWare digital controller’s universality and adaptability across those technologies.

This marks a new market entry for Wise-integration—in particular, targeting SiC-based high-voltage applications in automotive and industrial sectors—while reinforcing that WiseWare can serve as a common digital intelligence layer regardless of the underlying semiconductor material.

Building on Wise-integration’s Core GaN Expertise

The WiseWare 1 OBC SIC 7kW power demonstrator model builds on the company’s core expertise in GaN-based systems and digital control ICs, reinforcing its commitment to advancing the full spectrum of power semiconductor technologies. This cross-compatible, digital control solution for both GaN and SiC, enables flexible, efficient, and intelligent power systems across multiple WBG platforms.

“This demonstration of a silicon-carbide onboard charger marks an important step in Wise-integration’s journey toward the automotive market,” said CEO Thierry Bouchet. “By showing that WiseWare can reliably control high-voltage, high-power systems in an EV-relevant application, we’re validating our digital control platform as a strong candidate for next-generation onboard chargers. It’s a first step toward demonstrating that our technology is scalable, adaptable, and aligned with the needs of future EV platforms.”

The demonstrator is a prototype product for the company’s partner, Savoy International Group, a Tier 1 automotive supplier, whose e-mobility division collaborated with Wise-integration on a GaN charger embedded in e-bike batteries in 2023.

“This prototype has been developed specifically to support the electrification of Savoy’s innovative, light electric vehicles under the KILOW brand, as well as their broader ambition to promote fun, accessible, and sustainable mobility solutions,” Bouchet explained.

“Our previous collaboration with Wise-integration on the embedded GaN charger for our e-bike battery met all of our expectations for performance and helps us differentiate KILOW in a crowded field,” said Émile Allamand, CEO of Savoy Group. “The SiC onboard charger will enable us to diversify our EV offerings with a light, four-wheel vehicle under our KILOW brand.”

Major Differentiators of the WiseWare 1 OBC SIC 7kW Demonstrator:

• Technology-agnostic control:WiseWare works seamlessly with both GaN and SiC, allowing OEMs to keep control architecture constant, while optimizing the power stage for each use case (cost, power level, thermal profile, etc.).
• Digital-first approach:Unlike traditional analog control platforms, Wise-integration virtualizes control functions, enabling simplified designs, faster iterations, and more compact systems.
• Open and modular design philosophy:WiseWare is not tied to a proprietary microcontroller or switch brand. This flexibility makes it highly attractive to Tier 1s and system integrators seeking to reduce vendor lock-in.

SiC technology delivers excellent thermal performance and is highly efficient under heavy loads—making it ideal for high-power components like traction inverters and fast chargers. Its ruggedness and maturity also contribute to its reliability in the demanding automotive environment. WiseWare’s SiC demonstration shows that the company’s digital control platform is technology-agnostic, and can bring the same performance, modularity, and intelligence to SiC systems as it does to GaN systems.

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Rohde & Schwarz will showcase its latest solutions and advanced techniques for testing and analyzing power electronic systems and components at PCIM Expo 2025 in Nuremberg, Germany. At the company’s booth (hall 7, booth 166), the spotlight will be on solutions utilizing the company’s cutting-edge test instruments to address the challenges of debugging next generation wide bandgap semiconductors like GaN and SiC.

Rigorous testing and advanced characterization methods help design engineers enhance the performance, efficiency, and reliability of their power electronic designs based on SiC and GaN devices, used in pioneering industries like e-mobility, renewable energy or AI data centers. Rohde & Schwarz will bring a selection of its comprehensive T&M portfolio to booth 166 in hall 7 of PCIM Expo 2025, taking place from May 6 to 8 at the Nuremberg Exhibition Center. The test solutions are tailored for power electronics applications where high efficiency, fast switching speeds, improved power density and high-temperature operation matter.

Wide bandgap analysis

At the center of the presented setups will be the R&S RT-ZISO isolated probing system from Rohde & Schwarz. This next generation isolated probe has set new standards with unprecedented accuracy, sensitivity, dynamic range and bandwidth for wide bandgap power designs with SiC and GaN. Rohde & Schwarz will showcase the advantage of the R&S RT-ZISO over single-ended probes in a setup to investigate the switching behavior of a GaN-MosFET.

Double pulse testing

Double pulse testing is a method for evaluating the switching performance of SiC and GaN based power devices. Rohde & Schwarz is collaborating with industry expert PE-Systems GmbH for a stable and accurate approach to double pulse testing using the MXO 5 next generation oscilloscope from Rohde & Schwarz with eight channels in combination with the R&S RT-ZISO. At PCIM, visitors can experience accurate, reliable and fast double pulse testing on 1200 V SiC devices from Wolfspeed, typically used as traction inverters in the automotive industry.

Automated loadjump testing 

Loadjump testing used to be a time-consuming manual process to verify a Buck converter’s load step response at varying input voltage levels, using only a few reference points. For this application, as well, Rohde & Schwarz collaborates with PE-Systems GmbH, who offers a test automation software. In combination with the MXO 5 oscilloscope and the R&S RT-ZISO isolated probing system, this solution not only reduces overall testing time but also maintains the same number of test points. At PCIM, the companies demonstrate automated loadjump testing of a Buck converter of Monolithic Power Systems, Inc. within a voltage range of 6V to 60V. The setup even allows for more reference points within the same timeframe and can be extended to include temperature control, facilitating the full automation of input voltage, load current, and temperature profile variations.

Component characterization

Rohde & Schwarz will also showcase its solutions for component characterization. The R&S LCX LCR meters with customized impedance measurement functions are suitable for all discrete passive components up to 10 MHz. Users can easily characterize the voltage dependence of capacitances in core components of power converters like MLCCs with the R&S LCX. Combined with a sweep software tool, users can perform comprehensive sweep measurements and display them in numerous charts. The MFIA impedance analyzer from Zurich Instruments AG is capable of impedance spectroscopy for both low impedance components such as shunt resistors and DC-link capacitors and high impedance systems. It offers measurement modes for impedance analysis over frequency and time as well as other features such as integrated oscilloscope and spectrum analyzer capabilities.

Dr. Philipp Weigell, Vice President of the Industry, Components, Research & University Market Segment at Rohde & Schwarz, explains: “PCIM Expo is an important venue for us to highlight our advancements in wide bandgap semiconductor testing. Testing plays a critical role to improve power efficiency, reduce size, and manage heat more effectively in power conversion applications used in AI data centers, for instance. Through collaboration with industry experts and with our advanced testing solutions we enable our customers to develop reliable and efficient systems that meet the rigorous demands of modern data processing applications.”

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Written By: Mr. Rajesh Patawari, Managing Director, National Electrical Equipments Corporation

In the intricate world of global energy infrastructure, transformers are essential components, quietly enabling the smooth transmission and distribution of electrical power. These devices are the backbone of energy systems, ensuring that power reaches homes, industries, and businesses across the globe. For decades, countries like China, Germany, and the United States have been the dominant forces in transformer manufacturing, but in recent years, India has been making significant strides in this industry. The country’s growing presence in global transformer supply chains signals a shift that is both intriguing and indicative of its rising industrial influence.

In 2023, India’s export of electrical transformers reached a new peak, totaling $3.59 billion, marking the country as the 10th largest exporter of transformers worldwide. The United States was the largest importer, purchasing $1.02 billion worth of transformers from India, with other nations like the Netherlands, China, and the UK following closely behind. These figures are not just impressive in isolation; they represent a clear upward trajectory, with exports to markets like the Netherlands increasing by 41% compared to previous years. This consistent growth highlights India’s expanding role as a global supplier of high-quality transformers.

What makes India’s emergence in the transformer market particularly noteworthy is the variety of products it now exports. While transformers themselves form the core of these exports, India has also made significant headway in exporting transformer parts and components. In 2023, exports of transformer parts and static converters amounted to $449 million. The United States remained the largest importer of these components, followed by markets in the Middle East and Europe. This expanding product range speaks volumes about India’s ability to meet the varied demands of different international markets, showcasing both its technical expertise and adaptability.

India’s success in this sector is not just about increasing export volume. The country has effectively entered new markets, some of which were previously dominated by other manufacturers. While the US and Europe remain key markets, India is increasingly making inroads into emerging markets like Mexico, Bangladesh, and Hong Kong. This wider market penetration is a reflection of India’s growing reputation for delivering reliable, cost-effective transformers that meet international standards. It’s not just about competing with established players; it’s about carving out a space in markets that are essential for global energy development.

The competitive landscape is still challenging, with countries like China and Germany leading in overall transformer exports. However, India’s increasing share of the global market demonstrates that it can compete on quality and cost, two critical factors that play a central role in today’s global supply chains. While the larger manufacturers may have the advantage in volume, India’s focus on producing high-quality, affordable products has resonated with many customers worldwide.

Domestically, the Indian transformer market remains strong, valued at over INR 12,000 crore, with power transformers and distribution transformers making up nearly equal shares. Although the country faces challenges, such as a slowdown in power generation and transmission infrastructure development, the transformer sector continues to show steady growth. This stability in the domestic market provides India with a solid foundation to build its export capabilities, as the country’s manufacturing and logistics networks continue to improve.

Looking forward, India’s role in global transformer supply chains is set to grow even more. With the world increasingly focused on renewable energy and sustainable power systems, the demand for efficient and reliable transformers will continue to rise. India’s growing manufacturing capabilities, combined with its expanding market presence, position it to meet this global demand. As the country strengthens its energy infrastructure and develops more advanced technologies, its ability to supply transformers for green energy projects, such as wind and solar power, will become even more important.

The future of India’s transformer industry appears bright, with further growth expected in both domestic and international markets. As the world shifts toward cleaner energy, the need for reliable transformers will only increase, and India is well-positioned to meet that demand. The country’s growing presence in global supply chains is a sign of its increasing industrial capabilities and its determination to be a key player in the future of global energy systems. In the years to come, India’s role in transforming the world’s power infrastructure will be one to watch.

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SMA Solar Technology AG, a leading global specialist in photovoltaic and storage system technology, adopts Semikron Danfoss’ Module with ROHM’s latest 2kV SiC MOSFETs inside its new large scale solar system “Sunny Central FLEX”, a modular platform designed to streamline and enhance grid connections for large-scale photovoltaic installations, battery storage systems, and emerging technologies.

“ROHM’s new 2kV class SiC MOSFETs are designed to enable simple and highly efficient converter topologies for 1500V DC-links. It is developed with high reliability targets and cosmic radiation robustness – addressing the stringent conditions and extended converter lifetime requirements of the photovoltaic sector and beyond,” says Wolfram Harnack, President at ROHM Semiconductor GmbH. “The technology of our SiC device structure and integrated on-chip gate resistance eases device paralleling and simplifies high power module designs. The mass production has started,” adds Harnack.

Semikron Danfoss’ SEMITRANS 20 has designed for high power applications and fast-switching operations, it represents the next generation of power modules for large converters. SEMITRANS 20 with ROHM’s 2kV SiC MOSFETs is an integral part of SMA’s Sunny Central FLEX. “Semikron Danfoss and ROHM have collaborated for over a decade, focusing primarily on the implementation of silicon carbide (SiC) in power modules. More recently, we have teamed up to integrate silicon IGBTs as well”, says Peter Sontheimer, Senior Vice President of Semikron Danfoss’ Industry division.

“The new SEMITRANS 20 offers simple, efficient solutions for 1500VDC applications. These modules are ideal for solar and energy storage inverters. Upcoming high-power electric truck chargers, as well as wind converters, will also benefit,” adds Sontheimer.

“The cooperation between SMA, Semikron Danfoss and ROHM is proof of how the seamless integration of innovative technologies creates the conditions for future-oriented energy projects,” said Bernd Gessner, Product Manager Power Conversion Systems at SMA. “The demands on these solutions are higher than ever. SMA has decades of expertise and fulfills the highest requirements in terms of performance, reliability, durability and flexibility. The fact that Sunny Central FLEX meets these highest future-proof standards is also the result of the excellent cooperation with our partners who share the same commitment to excellence.”

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