ELE Times

SPE campaign opens curtain on new dawn of Ethernet connectivity

element14 has assembled an elite group of industry leading suppliers to support a campaign to highlight the multiple advantages of Single Pair Ethernet (SPE) solutions.

The campaign, adopted by Amphenol, ADI, Harting, Microchip, Molex, Phoenix, Weidmuller and Wurth Electronik, is designed to inspire IIoT developers and industrial designers to switch to SPE products and protocols, to not only foster innovation but to also make their professional lives easier, more productive and produce more reliable results.

Ben Morgan, Product Segment Leader for SPE Connectors at element14 said, “We firmly believe that the future of industrial network connectivity lies with Single Pair Ethernet. IoT design engineers fully understand the current struggle of balancing space limitations with increasing data demands, however SPE is a compact, efficient technology that delivers full Ethernet performance with a single, twisted-pair cable.”

Among the many benefits of SPE is that it vastly reduces the need to allow for bulky and intricate bundles that waste valuable installation real estate space. Using SPE products for such installations streamlines a network and reduces costs, enabling professional developers to focus on maximising the power of connected devices to their fullest potential.

SPE does this by simplifying the IIoT and industrial automation design process by providing a single, high-speed connection that’s perfect for Edge devices, especially those that are often destined for tight, compromised spaces. SPE has proven to be sleek, elegant and reliable solutions that ensure devices are always connected, and always performing at their best.

Morgan added, “We are delighted to be joined by so many of key supplier in this initiative, which we think heralds a new dawn in what is achievable in network connectivity, which comes at a crucial moment to meet the demands of an increasingly interconnected world.”

SPE products from Amphenol, ADI, Harting, Microchip, Molex, Phoenix, Weidmuller and Wurth Electronik will be available from Farnell in EMEA, Newark in North America and element14 in APAC.

The post element14 gives wings to Edge devices with new Single Pair Ethernet offerings appeared first on ELE Times.

• Solution identifies subtle defects such as wire sag, near shorts, and stray wires for comprehensive assessment of wire bond integrity
• Advanced capacitive-based test methodology enables superior defect detection
• Test platform is high volume manufacturing ready, capable of testing 20 integrated circuits simultaneously for throughput of up to 72,000 units per hour

INDIA – Keysight Technologies, Inc. introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components.

The semiconductor industry is faced with testing challenges due to the increasing density of chips in mission-critical applications such as medical devices and automotive systems. Current testing methodologies often fall short in detecting wire bond structural defects, which lead to costly latent failures. In addition, traditional testing approaches frequently rely on sampling techniques that do not adequately identify wire bond structural defects.

The EST addresses these testing challenges by using cutting-edge nano Vectorless Test Enhanced Performance (nVTEP) technology to create a capacitive structure between the wire bond and a sensor plate. Using this method the EST can identify subtle defects such as wire sag, near shorts, and stray wires to enable comprehensive assessment of wire bond integrity.

• Advanced defect detection – Identifies a wide range of wire bond defects, both electrical and non-electrical, by analyzing changes in capacitive coupling patterns to ensure the functionality and reliability of electronic components.
• High volume manufacturing ready – Enables throughput of up to 72,000 units per hour through the ability to test up to 20 integrated circuits simultaneously, which boosts productivity and efficiency in high-volume production environments.
• Big data analytics integration: Captures defects and enhances yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT), and real-time part averaging test (RPAT).

Carol Leh, Vice President, Electronic Industrial Solutions Group Center of Excellence, Keysight, said: “Keysight is dedicated to pioneering innovative solutions that address the most pressing challenges in the wire bonding process. The Electrical Structural Tester empowers chip manufacturers to enhance production efficiency by rapidly identifying wire bond defects, ensuring superior quality and reliability in high-volume manufacturing.”

The post Keysight Unveils Wire Bond Inspection Solution for Semiconductor Manufacturing appeared first on ELE Times.

Author: STMicroelectronics

With the global spotlight on sports these days, it is almost impossible to overlook the technological innovations like the MEMS (Micro-Electro-Mechanical Systems) sensors. Embedded in wearable technology like smartwatches and fitness trackers, MEMS sensors facilitate athletic performance monitoring and enhancement. From everyday training to major sports events, these tiny yet powerful sensors help monitor progress and receive real-time feedback.

In the world of athletics, every millisecond and centimeter matters. Consider an athlete preparing for a high jump and representing their country at an international level. They are constantly seeking ways to perfect their jumping techniques. With each leap, MEMS sensors embedded in their sportswear ensure precise data capturing on jump height and distance and the real-time feedback will help athletes make immediate adjustments – optimizing form and technique.

Cyclists rely heavily on maintaining optimal cadence and power output to ensure peak performance. Thanks to MEMS sensors, they can optimize their pedaling efficiency and power distribution. The data collected by these sensors facilitates real-time adjustments, leading to not only improved performance but also providing a competitive edge.

ST is at the forefront of MEMS sensor Technology, integrating micro-electro-mechanical systems with electronic circuits and enabling the measurement of various physical parameters such as acceleration, angular velocity, orientation, pressure and more. For example, an accelerometer calculates the velocity, measures the rate of change of velocity in an object, and detects specific gestures and tracks body movements, providing athletes with precise and reliable data.

Efficient turns can make all the difference in competitive swimming. Precise depth measurements are crucial for underwater challenges and MEMS sensors have made a substantial impact in this area. For example, the ST waterproof pressure sensor can provide real-time data on turns and depth, helping swimmers optimize their performance and efficiency in the water.

Indeed, with MEMS sensors embedded in their sportswear or goggles, the swimmer can monitor their performance during training sessions. Moreover, using this data, coaches can adjust the training regimen, empowering their swimmers to perform their best, resulting in improved performance and a competitive edge in the pool or open water.

In racket sports like tennis, padel and baseball, the speed and accuracy of strokes are key. MEMS sensors embedded in rackets or bats provide detailed data on gestures and impact, helping athletes make immediate adjustments and improve their strokes. If you want to learn more about the latest advancements in performance monitoring, read the article on MEMS sensors that vastly Improve the performance-per-watt ratio.

For contact sports like football, impact monitoring is crucial for both player safety and performance, as well as tracking the ball’s speed and spin rate while in the air. High-g accelerometer MEMS sensors embedded in helmets, capture detailed impact data while meticulous smart ball tracking enhances the viewing experience for football fans.

In addition, they provide valuable insights into the force and direction of collisions that in turn help coaches and medical staff monitor the safety of the players. It also enables informed decision-making around training and gameplay. For instance, if a player experiences significant impact, the data can prompt immediate medical evaluation, thus ensuring the player’s well-being.

The versatility of MEMS sensors extends to a wide range of sports. Whether it is cyclists adjusting their cadence, swimmers refining their turns or tennis players perfecting their swing, MEMS sensors, including motion sensors such as Inertial Measurement Units (IMU) provide the real-time data needed to make immediate improvements and, over time, achieve better results and a competitive edge.

MEMS sensors embedded in wearable technology are undeniably transforming the landscape of competitive sports. They provide precise performance monitoring and optimize training routines with real-time feedback. As technology continues to advance, the role of MEMS sensors in enhancing athletic performance will only become more significant, paving the way for future generations of athletes.

The post From basic training to world-class competitions: MEMS sensors in wearable technology enhance athletic performance appeared first on ELE Times.

When we think of space exploration, the focus often gravitates toward massive rockets, sophisticated spacecrafts, and the captivating images they send back to Earth. However, the unsung heroes in these endeavors are the critical components ensuring that every part of these complex systems communicates effectively. One of the most critical components enabling this communication is connectors.

From the Artemis program’s monumental lunar missions to the revolutionary insights of the James Webb Space Telescope, the success of these missions hinges not just on the large-scale engineering feats but also on the reliability and performance of connectors. These ubiquitous components face the extreme conditions of space and are pivotal in every step, from the rigors of launch to the harsh environment of outer space.

Space exploration, both by government organizations and commercial ventures, is very much in the news. One of the most extensive programs in recent space history is the Artemis program, which will see humans return to the Moon. The Space Launch System (SLS) completed its first successful test mission in December of 2022 and forms the largest component of the program. However, the latest steps in our return to the Moon are not the only exciting initiatives in space.

While these high-profile events capture the public’s imagination, they represent just a small part of the picture. Exploration and exploitation of space are everyday activities. More than 200 space launches were made in 2023 alone, carrying science missions and satellites into orbit and beyond.

Even though spaceflight has become more common, the conditions in which these systems must perform are unlike any other. Space represents possibly the single most demanding environment known to engineering. Any equipment used in spaceflight is exposed to a range of extremes, from high and low temperatures and harsh radiation to the severities of the launch process and the vacuum of space.

The lack of atmosphere in space is incredibly unforgiving. On Earth, our atmosphere is a protective blanket that provides pressure, thermal insulation, and safety from harmful radiation. This protection is stripped away in space, exposing equipment to potential damage.

Without the atmosphere to protect it, an object in space receives the full force of the sun’s radiation. When equipment is bombarded by direct sunlight, its temperature can quickly become dangerously high. In contrast, the parts of a spacecraft that remain in shadow are very cold. These temperature extremes, must be considered when selecting the materials to use aboard space vehicles. Other radiation sources, including galactic cosmic rays, are highly ionizing and can harm delicate instruments or sophisticated electronic circuits.

The lack of atmospheric pressure also causes materials to behave in unique ways. Components employed for spaceflight can face an array of challenges that affect performance. Outgassing is when a gas trapped inside another material is released. This is a common problem when plastic is exposed to a vacuum during spaceflight, but it is not limited to plastics alone. Some metals, including zinc and cadmium, are also prone to sublimation in vacuum conditions, both of which are commonly used in conventional equipment design.

In both cases, the gas that is released can cause damage. It may condense onto cold surfaces such as the optics and sensors of scientific equipment, which can degrade or even negate their effectiveness and put the entire mission at risk. NASA and the European Space Agency (ESA) have recommended volume levels of outgassing for materials used in their space applications. These recommendations play a key role in selecting components for spaceflight.

Components also need to be mechanically robust, as launching satellites, probes, and spacecrafts into orbit exposes them to acceleration and vibration that can cause damage that might be undiscovered for months or years. As such, plastic components need to be manufactured using materials that exhibit high stability, even in vacuum conditions.

To provide solutions for these demanding conditions, connectors designed for spaceflight must be amongst the most advanced in the industry. Manufactured to stringent standards and tested to prove their performance even in the vacuum of space, they are the very definition of high-reliability connectors.

If the spaceflight environment is not challenging enough, there is one additional aspect that contributes to the difficulties of designing for spaceflight: endurance. Whether intended for commercial or scientific purposes, space missions can last for years. If a piece of equipment fails, gaining access to fix the problem is essentially impossible. In these circumstances, designers and engineers depend on the reliability of each component that makes up the equipment, no matter how small.

Endurance also plays a crucial role in power planning. A long-range probe operates on a stringent power budget, and any component that introduces unwanted electrical resistance will risk jeopardizing the mission. The electrical terminals of connectors designed for space applications are made from high-performance materials and coated with a thick layer of gold, ensuring minimal electrical resistance to reduce power loss.

Contacts with low electrical resistance provide additional benefits beyond power planning. The instruments on space probes take highly precise measurements, and the currents generated by these sensors can be extremely small. For these tiny currents, low contact resistance is crucial to maximize the likelihood of detecting critical signals.

With endurance in mind, connectors designed for spaceflight applications use materials that provide the best possible performance by reducing interference. Manufacturers must ensure that the magnetic signature of any component is minimized to prevent interference with precision scientific experiments. The connector shell also protects against electromagnetic interference (EMI). Vehicles that must traverse the vacuum of space are unprotected against solar radiation, which can interfere with scientific observations and damage sensitive instruments. This is another reason why the shells of spaceflight connectors are gold-plated, which provides the highest possible protection against EMI in these circumstances.

Connectors play an often-overlooked role in spaceflight applications. Space vehicles are typically manufactured from sub-assemblies, which are brought together before launch. Connectors provide the vital interface between each system during the extensive testing regime before launch and the demanding conditions in space. Spaceflight connectors are designed according to some of the highest standards in the interconnection industry and, as a result, represent some of the most capable products available today.

The post Connectors in Space appeared first on ELE Times.

Integration in traction inverters extends the cruising range and improves performance

ROHM has announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker. Since 2023, these power modules have been mass-produced and shipped from HAIMOSIC (SHANGHAI) Co., Ltd. – a joint venture between ROHM and Zhenghai Group Co., Ltd. to Viridi E-Mobility Technology (Ningbo) Co., Ltd, a Tier 1 manufacturer under Geely.

Geely and ROHM have been collaborating since 2018, beginning with technical exchanges, then later forming a strategic partnership focused on SiC power devices in 2021. This led to the integration of ROHM’s SiC MOSFETs into the traction inverters of three models: the ZEEKR X, 009, and 001. In each of these EVs, ROHM’s power solutions centered on SiC MOSFETs play a key role in extending the cruising range and enhancing overall performance.

ROHM is committed to advancing SiC technology, with plans to launch 5th generation SiC MOSFETs in 2025 while accelerating market introduction of 6th and 7th generation devices. What’s more, by offering SiC in various forms, including bare chips, discrete components, and modules, ROHM is able to promote the widespread adoption of SiC technology, contributing to the creation of a sustainable society.

ZEEKR Models Equipped with ROHM’s EcoSiC

The ZEEKR X, which features a maximum output exceeding 300kW and cruising range of more than 400km despite being a compact SUV, is attracting attention even outside of China due to its exceptional cost performance. The 009 minivan features an intelligent cockpit and large 140kWh battery, achieving an outstanding maximum cruising range of 822km. And for those looking for superior performance, the flagship model, 001, offers a maximum output of over 400kW from dual motors with a range of over 580km along with a four-wheel independent control system.

Market Background and ROHM’s EcoSiC

In recent years, there has been a push to develop more compact, efficient, lightweight electric systems to expand the adoption of next-generation electric vehicles (xEVs) and achieve environmental goals such as carbon neutrality. For electric vehicles in particular, improving the efficiency of the traction inverter, a key element of the drive system, is crucial for extending the cruising range and reducing the size of the onboard battery, heightening expectations for SiC power devices.

As the world’s first supplier to begin mass production of SiC MOSFETs in 2010, ROHM continues to lead the industry in SiC device technology development. These devices are now marketed under the EcoSiC brand, encompassing a comprehensive lineup that includes bare chips, discrete components, and modules.

EcoSiC Brand

EcoSiC is a brand of devices that utilize silicon carbide (SiC), which is attracting attention in the power device field for performance that surpasses silicon (Si). ROHM independently develops technologies essential for the evolution of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.

The post ROHM’s 4th Generation SiC MOSFET Bare Chips Adopted in Three EV Models of ZEEKR from Geely appeared first on ELE Times.

The top 10 lithium-ion battery manufacturing companies in India in 2024 are as follows:

1. Servotech Power Systems

Servotech Power Systems was incorporated in 2004. It is based out of New Delhi. It has its manufacturing and R&D plant in Sonipat, Haryana.

It manufacturers its batteries by the application of the latest engineering concepts and high-quality raw materials.

Its manufactured batteries are among the best reliable energy storage solution available in India. They are known for their high efficiency and durability.

They find their application in numerous appliances. For instance, 2/3/4 wheelers, power back-up systems, solar power plants, offices, factories, etc.

It has also established a subsidiary company, Servotech Power Infrastructure, to operate as a charging point for the electric vehicles. This subsidiary company is reliant on the lithium-ion batteries manufactured by Servotech Power Systems.

2. Amara Raja Energy & Mobility

Amara Raja Energy & Mobility is a flagship company of the famous Amara Raja Group. It was established by

It is one of the first companies in India to invest in Li-ion technology. It produces Li-ion cells, battery packs and charging solutions for batteries. They are widely used in various electric vehicles and the telecom industry.

It has established a state-of-the-art Gigafactory in Telangana. It has a cell production capacity of 16 GWh. It has a battery pack capacity of 5 GWh. It was established at a cost of Rs 9,500 crore.

It exports its quality batteries to 50 countries across the globe.

3. Exide Energy Solutions Limited

It is a subsidiary company of the Exide Industries Limited. It was earlier called Exide Energy Private Limited. EEPL merged into Exide Energy Solutions Limited in March, 2024.

Exide Energy Private Limited was incorporated on 29 September, 2018. It was a joint venture between Exide Industries Limited (EIL) and Leclanche SA (LSA), Switzerland. In November, 2022, the latter exited from the joint venture. Thereafter, Exide Industries Limited became the sole owner of the venture.

Exide Energy Private Limited had its production plant in Prantij, which is situated in the Sabarkantha district of Gujarat. This plant is still functional.

This plant produces lithium ion batteries using the battery management system. They are used for both electric mobility and stationary power application. They are produced under the brand name Nexcharge.

Upon merger into Exide Energy Solutions Limited, the EESL is establishing a 12 Gwh gigafactory in Bengaluru, Karnataka.

Once this plant will become operational, it will further scale up the production of lithium ion batteries.

The Li-ion batteries produced by this organisation uses lithium iron phosphate (LiFePO4) as a raw material. It is the best choice among all available raw materials. It is because of three reason. First, high power density. Second, very high safety. And, third, very long life span of the battery.

4. ATLBattery Technology (India) Private Limited

It is the Indian subsidiary company of the world-famous Japanese company, Amperex Technology Limited, the world’s leading producer of lithium ion batteries. It was established in 2020. In India, it is based out of Rewari, Haryana.

It has established a 180-acre lithium-ion manufacturing plot at MT Sohna, near Gurugram. It is the largest lithium-ion manufacturing plant in India.

It produces lithium ion batteries for electric vehicles and mobile phones.

5. Tata Chemicals Limited

It is a subsidiary company of the prestigious Tata Group.

It had signed an MoU with the Indian Space Research Organisation (ISRO). Under this MoU, the lithium-ion cell technology developed by ISRO’s Vikram Sarabhai Space Centre (VSSC) was transferred to Tata Chemical.

ISRO had developed this technology for the production of lithium-ion cells for space-based applications, such as rockets, satellites, etc.

However, once it was transferred to the Tata Chemicals Limited, it is being used by the TCL to produce a wide variety of lithium-ion cells of different capacity, energy, size, and power density.

It produces lithium-ion batteries using lithium carbonate (Li2CO3) as a raw material.

It has entered into partnership with famous Indian R&D centres such as ISRO, CSIR-CECRI, and CMET, for indigenously developed lithium ion cells.

It also runs a li-ion battery recycling operations. Its recovery plant is able to recover valuable metals at 99% plus purity level within industry levels of yield. For instance, lithium, nickel, manganese, cobalt, etc.

Its main focus is on electric vehicle market in India.

6. Okaya EV Private Limited

It is a subsidiary company of the Okaya Power group. It specialises in producing lithium-ion batteries for electric vehicles, charging, and battery swapping solutions.

It produced India’s first lithium-ion battery. It gave it the name Okaya Royale. It is produced in two variants. First, Okaya Royale. And, second, Okaya Royale XL.

Its production process is certified with ISO 14001:2004 certification.

It is the third-largest battery manufacturer in India. Besides, it is the leading charging station manufacturer in India.

The lithium-ion batteries produced by Okaya EV Private Limited have the following special features:

First, less weight and compact size.

Second, it recharges at a very fast rate.

Third, it has longer life-span.

Fourth, it provides longer back up.

Fifth, it is almost maintenance-free. Hence, it is highly durable.

It specialises in the production of batteries for the electric vehicles.

7. Waaree Technologies Limited

It is one of the constituent Indian company of the world famous Waaree Group. Its parent company produces components in the energy storage, solar, and instrumentation domain.

It produces lithium ion cells and batteries for e-rickshaw, e-bicycles, e-bikes, e-forklift, battery energy storage system, telecom, and uninterruptible power supply (UPS).

It endeavours to create India’s top notch “cell to system” technology. It primarily caters to high quality energy storage solutions for electric utilities, energy storage system, and renewable energy applications.

It produces four series of batteries- Liger, Lion, Lynx, and Lit series.

8. Loom Solar Private Limited

It is a six-years old start-up. It was established in 2018. It is based out of Faridabad, Haryana. It is certified as per the ISO 9001-2015 certification.

It has its manufacturing plant in Faridabad, Haryana.

It manufacturers lithium-ion batteries, inverters, and solar panels.

9. Panasonic Life Solutions India Private Limited

It was established on 14 July, 2006, as Panasonic India Private Limited. With effect from 1 August, 2022, it changed its nomenclature to Panasonic Life Solutions India Private Limited. It was done to bring all businesses of the Panasonic Group in India under one roof.

It is the Indian subsidiary company of the Panasonic Group. Its parent firm is based out of Kadoma, Osaka, Japan.

Its Indian subsidiary’s head-office is in Gurugram, Haryana.

It manufactures lithium-ion batteries and energy storage system using lithium ion batteries.

It manufactures different lithium ion batteries in both coin and cylindrical forms and that too in a wide range of sizes. Hence, they are used in small appliances like digital devices, laptops, to large appliances like electric vehicles.

10. Battrixx

It is a division of Kabra Extrusiontechnik Ltd. The latter is one of the two constituent companies of the Kolsite Group.

It manufactures lithium ion batteries for application in a wide range of appliances in the e-mobility sector. Its application ranges from electric bike, two or three-wheeler electric vehicles, electric car, electric passenger vehicles, light commercial electric vehicles, and electric tractors.

Besides, it also manufactures lithium ion batteries for application in electric forklift, electric golf cart, and devices used in the marine environment.

The post Top 10 Lithium-ion Battery Manufacturing Companies in India in 2024 appeared first on ELE Times.

PCIM Asia 2024 will open its doors from 28 – 30 August at the Shenzhen World Exhibition and Convention Center. Expanding to 20,000 sqm of floor space, this year’s event will welcome 232 exhibitors, representing a rise in exhibitor count of over 28% compared to the 2023 edition. The fair’s fringe programme will feature forums and round table discussions on e-mobility, clean energy, energy storage, wide bandgap (WBG) semiconductors and more. Alongside, the PCIM Asia Conference 2024 will present new technical developments, applications and research in power electronics.

Throughout its three-day run, PCIM Asia 2024 will present the latest advancements in power electronics designed for a wide range of market segments. Maintaining their role as sponsors, Mitsubishi Electric, Semikron Danfoss, Fuji Electric, Infineon and ROHM will be among the leading exhibitors participating in the show.

Other notable exhibitors include AST Technology, Bronze Technologies, CRRC, EPC, FastSic, GaNext, Grecon Semiconductor, Hitachi Energy, JIEJIE MICROELECTRONICS, JSAB, LEM, MacMic, Msemitek, NARI Semiconductor, nexperia, NXP, onsemi, Power Integrations, SiChain Semiconductor, Silan, Sunking Tech, TanKeBlue, Toshiba Devices & Storage, UNITED NOVA, VAC, WeEn, Wolfspeed, Yangjie Electronic and YASC.

As the electric vehicle (EV) market in China continues to heat up, this year’s edition has drawn participation from several first-time exhibitors offering technologies relevant to EV development, including VCTC, Bosch, Amulaire and others.

Alongside the exhibition, a series of industry and exhibitor forums will take place, addressing topics including WBG semiconductors, power devices, materials and packaging, and e-mobility. These forums provide further opportunities for interaction and learning, allowing exhibitors, visitors, researchers, and industry experts to share expertise, discover new products and solutions, and discuss new developments, innovations and challenges in the industry.

In addition to the forums, PCIM Asia will host a new round-table meeting on 28 August. Titled “Power Source Technology of Low-altitude eVTOL”, this session will examine the role of power electronics, particularly power semiconductor device, in supporting innovation and development in the country’s quickly growing electric vertical take-off and

landing (eVTOL) aircraft industry. This topic aligns with the Greater Bay Area’s intensifying efforts to develop its low-altitude aviation sector, with an emphasis on eVTOL development and commercialisation.

The show will also introduce a new University-Enterprise Job Fair on 30 August, designed to enhance industry-academia collaboration and support talent acquisition and development in the industry. With more than 13 participating companies, including VCTC, Suzhou Boschman Semiconductor Equipment Co Ltd, MacMic Science & Technology Co Ltd and more, the fair will allow visitors to directly connect with potential employers and explore open positions. A job board, accessible throughout the duration of the show, will offer further access to career opportunities.

As one of the leading international conferences in the field of power electronics, this year’s PCIM Asia Conference will once again bring together experts from industry and academia to exchange technical knowledge and present their latest research findings. The 2024 programme will include keynote speeches, oral sessions, poster dialogues, and more, covering topics such as intelligent motion, renewable energy and energy management.

Register to visit the PCIM Asia 2024 Conference today at: https://jinshuju.net/f/UUiRgU

PCIM Asia is jointly organised by Guangzhou Guangya Messe Frankfurt Co Ltd and Mesago Messe Frankfurt GmbH. To find out more about PCIM Asia, please visit www.pcimasia-expo.com or email pcimasia@china.messefrankfurt.com.

The post PCIM Asia 2024 opens on 28 August in Shenzhen appeared first on ELE Times.

Author: STMicroelectronics

ST is launching the STM32WB05 and the STM32WB06/07, thus extending the STM32WB0 series inaugurated late last year with the introduction of the STM32WB09. The new family fully realizes the transition from BlueNRG-LP(S) devices to enable developers to take advantage of the STM32Cube ecosystem. Moreover, we are announcing the STM32WB05xN, our new network processor for Bluetooth LE applications, enabling a significantly lower bill of material and a more straightforward implementation for integrators wishing to use a simple radio link with a serial interface. Therefore, today’s announcement is highly symbolic as we promised to deliver the STM32WB0 series by about the first half of 2024 and are glad to meet this target.

All the STM32WB0s share a lot of their DNA with the BlueNRG-LP(S). They use the same Cortex-M0+ and a similar Bluetooth stack. Aligning with the STM32Cube Ecosystem meant modifying some APIs and processes. However, migrating from the BlueNRG stack to the STM32WB0 remains straightforward. Integrators creating cost-effective and energy-sensitive solutions will thus inherit the BlueNRG modular software stack geared toward memory footprint optimizations and performance. The stack also stands out thanks to its interoperability and maturity. Similarly, developers enjoy the same advertising extensions, 2 Mbps high-speed, and 1.3 km (0.8 miles) unobstructed long-range and new ones, like Periodic Advertising with Response (PAwR), while reusing some of the BlueNRG-LPS PCB reference designs.

In essence, PAwR, is a bidirectional version of periodic advertising, a technology that enables a Bluetooth device to send an advertisement at deterministic intervals. Consequently, a system can stay in deep sleep and know exactly when to wake up to receive an advertisement, thus significantly extending battery life. Periodic advertisement with response builds on this technology by enabling the device receiving the advertisement to respond to the broadcaster. This is crucial for one-to-many topologies like electronic shelf labels (ESL) that need to send information to many systems simultaneously and have the receiving devices acknowledge that they received the message, for instance.

In fact, we will soon share the ESL demo we showcased at the last Embedded World. It uses PAwR on an STM32WB09 to show what an electronic label can do. The application is available on our STM32 Hotspot Github page for download to ensure any developers can reproduce it in their lab or learn from our implementation.

When digging into the new portfolio, we see that the STM32WB05 is a direct descendant of the BlueNRG-LPS and is certified Bluetooth LE 5.4. Hence, as long it has the necessary hardware elements, it can perform angle of arrival (AoA) or departure (AoD) calculations for position tracking. Both are a favorite in applications like asset tracking, which benefits from the ability to locate items in a very cost-effective and power-efficient manner. AoA and AoD are also popular in large infrastructures, like airports or stadiums, where companies must track assets and the people they host. Like the BlueNRG-LPS, the STM32WB05 comes with 192 KB of flash and 24 KB of RAM.

The STM32WB06/07 takes its DNA from the BlueNRG-LP. As such, just like all the STM32WB0s, it features functionalities like advertising extensions, 1.3 km (0.8 miles) unobstructed long-range, and a high-speed connection while providing 256 KB of flash and 64 KB of RAM. As the BlueNRG-LP(S), it also stands out thanks to its low power consumption (4.3 mA peak current in transmission at 0 dBm) and its ability to support an RX sensitivity of -104 dBm at 125 kbps. It doesn’t offer AoA and AoD because it targets applications that require more memory than the STM32WB05 but don’t perform asset tracking or people monitoring. It thus represents a compromise for teams looking to optimize their bill of materials.

Integrators looking for more flash and AoA/AoD capabilities will gravitate toward the STM32WB09. Architecturally, the device is a BlueNRG-LPS with 64 KB of RAM instead of 24 KB to allow for more complex applications. It also has an updated radio that supports all Bluetooth LE 5.4 hardware features, like PAwR, and Isochronous Channels, which the other STM32WB0s don’t support. Very simply, Isochronous Channels is a new PHY layer that enables more complex data streams by ensuring the transmission of time-sensitive and synchronized information. In practice, it can carry a segregated audio stream beside the traditional channel, to ensure less current spike in sensitive devices like hearing aids.

The choice to release the STM32WB09 before the others stemmed from a desire to reach partners that are content with the processing capabilities and energy efficiency of the BlueNRG-LP(S) but need the memory afforded by some of the dual-core STM32WBs. For instance, the typical current draw of the device in shutdown mode is only 800 nA or almost half that of an STM32WB55.

The STM32WB05xN takes the value proposition of the STM32WB0 series one step further by offering a network co-processor instead of an application processor. It still features the same +8 dBm output power or a sleep current consumption of 800 nA, but it is much more cost-effective and straightforward to implement. Developers just need a serial interface with the host MCU and send commands over the serial interface to control its Bluetooth radio. Obviously, engineers who need to run an application on their Bluetooth device will choose the other wireless MCUs in our portfolio.

However, those wishing for a drop-in solution for their BLE stack, now have an option that supports the STM32Cube Ecosystem. A common example is a company which already uses a Zephyr stack, although it will work with other software as well. By offering a secondary library that interfaces with the host controller interface instead of the host stack itself, ST ensures that the STM32WB05xN will work in existing projects and be vastly simpler to implement.

To make the adoption of the STM32WB05xN even more accessible, we are releasing the X-NUCLEO-WB05KN1 development board and making the X-CUBE-WB05N package available for download. Put simply, any developer, regardless of expertise, can grab an STM32U5 evaluation kit and compile our example code to run a proof-of-concept showcasing the STM32WB05xN. Developers can then send commands to show the network co-processor in action.

The initiative behind the STM32WB0 series partly stems from customers requesting to use the STM32Cube ecosystem with their BlueNRG devices. Hence, all STM32WB0s will enjoy the support of tools like STM32CubeMX and STM32CubeIDE that help with the initialization process, project generation, and code development. We are also working on updating STM32CubeProgrammer to debug and flash the device and STM32CubeMonitor-RF to test and optimize RF performances. Consequently, in time, moving from an STM32WBx to an STM32WB0, or vice versa, will be as simple as changing settings in STM32CubeMX, configuring a different pin-out, and adapting to a few different APIs. We’ve also started working on migration guides. The STM32 community is thus gaining in portability and flexibility.

Over time, ST will also bring some features and application demos from the BlueNRG Ecosystem to the STM32Cube Ecosystem. Customers have shared that some of those tools have helped them optimize their workflow, and we want to ensure that the transition doesn’t rob them of the solutions they’ve been relying on. Put simply, we are creating a unified portfolio to ensure developers can move up and down the price-per-performance ladder more fluidly, making this announcement a pivotal moment for our community.

The announcement of the first STM32WB in 2018 was so significant that it disrupted high-end Bluetooth applications. For the first time, the radio and the Cortex-M0+ core driving the wireless stack sat right next to a Cortex-M4, thus allowing developers to create vastly more powerful applications without blowing up their bill of materials. For instance, the Jammy E guitar-shaped MIDI controller wouldn’t have been possible without the STM32WB running the Bluetooth MIDI profile. In fact, the idea of an all-in-one solution became so appealing that we released the STM32WB5MMG soon after. The module houses an STM32WB55, the antenna, baluns, and crystals, further facilitating the creation of robust Bluetooth systems.

In early 2023, we released the STM32WBA, the first wireless Cortex-M33, thus showing our desire to provide powerful and secure systems since the STM32WBA opened the door to a SESIP Level 3 certification. However, teams that didn’t need all this computational power significantly favored BlueNRG. Today, ST updates its portfolio to release devices that can significantly lower a bill of materials without compromising features such as the +8 dBm output power, making them one of the best price-per-feature ratios in the industry. The STM32WB0 series is a testament to the success of the BlueNRGs and the STM32WBs as it harmonizes our portfolio while keeping our extensive price umbrella.

The fact that the STM32WB0s also showcases a Bluetooth LE 5.4-certified radio means that engineers enjoy features like Isochronous Channels. This new PHY layer enables more complex data streams by ensuring the transmission of time-sensitive and synchronized information. However, more than adding to a list of specifications, the Bluetooth LE 5.4 radio is symbolic because it shows that besides being cost-effective, like the BlueNRG-LP(S), the STM32WB0s are also cost-competitive, like the STM32WBs. Hence, more than a rebranding, the STM32WB05xN, STM32WB05, STM32WB06/07, and STM32WB09 represent a new beginning for engineers working on Bluetooth LE applications that want to make their products vastly more accessible.

The post STM32WB0x: Meet all the new wireless STM32WBs that will slash bills of materials everywhere! appeared first on ELE Times.

The 5V operating voltage and high interference immunity, along with the 20-pin small package design, optimize system cost

With continuous advancements in semiconductor technology, the performance of 32-bit microcontrollers has been steadily improving while costs have been decreasing, making them the mainstream choice in the market. The rapid growth in applications such as AIoT, industrial automation, smart homes, energy storage, and automotive electronics has placed higher demands on microcontroller performance. Traditional 8-bit microcontrollers often fall short in various applications, driving the widespread adoption of 32-bit microcontrollers. To address these market challenges, Nuvoton Technology has launched the new M2003 series of 32-bit microcontrollers based on the Arm Cortex-M23 core. This series not only features fast computing capabilities and an integrated hardware divider but also supports 5V operating voltage and high interference immunity. The 20-pin small package design meets the market’s performance and optimized system cost needs.

The M2003 series adopts the Arm Cortex-M23 core and is a 32-bit microcontroller with an operating frequency of up to 24 MHz. It includes a 32-bit hardware multiplier/divider, offers 32 KB of Flash memory and 4 KB of SRAM, and operates within a voltage range of 2.4V to 5.5V, with an operating temperature range of -40°C to 105°C.

To meet diverse performance design requirements while reducing size and cost, the M2003 series supports 4 sets of 32-bit timers, 1 watchdog timer, a 3-channel enhanced input capture timer, 2 UARTs, 1 I²C, and 1 universal serial control interface (USCI), which can be flexibly configured as UART/SPI/I²C. Additionally, all communication interfaces have independent FIFO to ensure data integrity during high-speed communication. This series also provides rich analog peripherals, including an 8-channel 12-bit 500 ksps ADC and a 6-channel 16-bit PWM. The series offers small package sizes in TSSOP20 and QFN20 (3 x 3 mm).

The M2003 series comes equipped with the NuTool – CodeGenerator tool. Developed in-house by Nuvoton, this tool can quickly generate initialization projects and integrates peripheral, pin, and clock configuration functions. Users can easily set system parameters through an intuitive interface, and the generated code is fully compatible with Keil, IAR, and NuEclipse, helping to reduce setup time and improve development efficiency. The M2003 series supports ISP and IAP upgrade methods, simplifying system and software update processes and allowing developers to utilize the numerous features of the M2003 series fully. Combined with the NuMaker-M2003FC development board and Nu-Link debugger, it supports Keil MDK, IAR EWARM, and NuEclipse IDE and uses the GNU GCC compiler, providing a complete development ecosystem.

The post Nuvoton Technology’s Arm Cortex-M23 Core M2003 Series Helps Upgrade from 8-bit to 32-bit, Balancing Performance and System Cost appeared first on ELE Times.

• Robot Vacuums and Mops – D10 Plus Gen 2, D9 Max Gen 2 and L10 Prime feature high suction power, customizable cleaning options for multi-surface cleaning and advanced navigation and mapping technology
• Wet and Dry Vacuum – H12 Dual comes with 4 operation modes, an edge-to-edge cleaning brush, a high speed brushless motor and 6×4,000mA battery
• Cordless Stick Vacuums – The Mova J10, J20 and J30 are equipped with a brushless motor, illuminating multi-surface brush head with LED light and a multi-layer and filtration system with up to 97% efficiency rate

Dreame Technology, a global leader in smart home technology appliances, announces the launch of its latest range of versatile home cleaning innovations. The new offerings include the intelligent robot vacuum and mop trio – D10 Plus Gen 2, D9 Max Gen 2, and L10 Prime; the H12 Dual Wet and Dry Vacuum; and the powerful cordless stick vacuums – Mova J10, J20, and J30. The new range caters to diverse cleaning needs, offering a perfect blend of power, intelligence, and convenience.

For hands-free cleaning, the D10 Plus Gen 2, D9 Max Gen 2, and L10 Prime robot vacuums and mops offer advanced navigation, powerful suction, and efficient mopping capabilities. The H12 Dual is a multi-functional marvel that effortlessly tackles both wet and dry messes, making it ideal for spills, pet accidents, and general cleaning. To tackle everyday messes with ease, the Mova J10, J20, and J30 cordless stick vacuums provide powerful cleaning performance and flexibility.

All these products will be available on Amazon starting at INR 7,999 from August 22nd onwards.

Manu Sharma, Managing Director, Dreame India stated, “The market for Robot Vacuum cleaners and Dual Wet & Dry Cleaners in India is growing rapidly and we see a significant opportunity to cater to the Indian households. At Dreame, we are committed to establish ourselves as a trusted brand in this space by delivering reliable, innovative products that seamlessly fits in our customers’ lives. Our new range of vacuum cleaners are designed to make home cleaning effortless, reaffirming our dedication to enhancing everyday living through technology.”

L10 Prime:  L10 prime is a Self-Cleaning Robot Vacuum and Mop built for the ultimate convenience and cleaning performance. It features advanced dual rotary mop pads that rotate at 180RPM with downward pressure to mop closer to the floor without making noise. After mopping, the mop is raised up to 7mm when returning to the base station to keep cleaned floors and rugs dry, where it’s cleaned and dried. A powerful 4,000Pa of powerful suction and a bristleless rubber brush combine to remove hair, dirt, dust, and debris from carpet, hard flooring, nooks, and crannies. Ultrasonic carpet detection allows L10 Prime to accurately identify carpets and rugs, and the LiDAR navigation and an advanced SLAM algorithm generate three separate 3D floor maps to expertly clean and navigate multi-storey spaces expertly.  The Dreamehome app allows the user to create virtual boundaries, set no-mop zones, customize cleaning time, and more.

D10 Plus Gen 2: The D10 Plus is an Auto-Empty Robot Vacuum and Mop with a high-performance motor supplying 6,000Pa* of suction power, swiftly tackling dirt and pet hair on both floors and carpets. The innovative floating rubber brush cleans out pet hair from carpets, making this an ideal choice for pet owners. The 2-in-1 dual-action vacuum and mop for customizable moisture levels while cleaning. The Smart Pathfinder technology avoids obstacles, and generates editable maps for thorough coverage. Moreover, its 4L dust bag capacity offers up to 90 days of uninterrupted cleaning, ensuring a spotless home without the need to continuously check up on the machine. The DreameApp and voice control sync with Alexa, Google and Siri make your cleaning routine more convenient and effortless.

Dreame D9 Max Gen 2:  The D9 Max Gen 2 is an entry-level robot vacuum that can sweep and mop at the same time. It uses high-precision motion sensors and the Smart Pathfinder technology to navigate across different spaces and return to the dock after cleaning. With a powerful 6,000Pa Vormax Suction and four adjustable levels, users can customize cleaning pressure to suit hard floors and carpets. The Carpet Boost feature and an all rubber floating brush prevents hair from clogging the vacuum and makes carpet cleaning more effective and robust.

The H12 Dual is a powerful 4-in-1 cleaning wizard that tackles sticky, wet or dry spills and messes on all kinds of surfaces including hard floors, sofas, cars, curtains, and more. With its high-speed brushless motor, the H12 Dual wipes the floor an impressive 520 times per minute*, quickly and easily. The smart sensor with advanced dirt and mess detection systems intelligently adjusts settings for deep cleaning, while the 900mL clean water tank and the enhanced edge-to-edge cleaning brush help clean hard-to-reach areas. The user can also switch between different operation modes – the Auto Mode detects and adjusts to the type of dirt, for a more thorough clean, the Suction Mode sucks up liquids from spills and the Standard and Turbo Modes enable handheld vacuuming, allowing you to let loose on all the dirt in tight spaces. After self-cleaning with a roller brush, brush scraper and serrated bristles, the brush undergoes hot air drying at 55°C for 30 minutes, reducing the growth of mildew, mold, and unpleasant odors. The H12 Dual comes with a long-lasting 6×4,000mAh battery pack, providing over 30 minutes* of cleaning time for wet and dry cleans and 60 minutes for handheld vacuuming before recharging is required. For added convenience, a large LED display and intelligent voice prompts provide real-time information on cleaning optimization, including remaining battery life, floor cleanliness, and operation status.

Mova J30: The Mova J30 features a powerful 450W brushless motor, delivering up to 60 minutes of cleaning time, making it highly effective at picking up dust, dirt, and debris. It can vacuum and mop simultaneously, thanks to its integrated water tank and mop pad, which remove both dry particles and stubborn stains from hard floors. The folding tube allows you to easily reach tight corners and low spaces without the need to bend down, making it more comfortable to clean hard-to-reach areas. The multi-surface brush illuminates dark spots for better visibility, and the switchable nozzles offer specialized tools for various tasks, like removing pet fur from furniture or cleaning crevices and windows. Additionally, the multi-layered filtration system achieves an impressive 97% efficiency rate.

Mova J20: The Mova J20 features a robust 250W brushless motor that offers up to 50 minutes of cleaning time and a filtration system that cleans dust particles with 97% efficiency. The multi surface brush is illuminated with LED lights to clean dimly lit spaces and the folding tube design helps with easy cleaning of hard to reach spaces on both carpeted and wooden floors.

Mova J10: The Mova J10 features a 150W brushless motor, offering up to 35 minutes of cleaning time. The crevice nozzle, wide combination tool and foldable tube excels in reaching low angle spaces and corners, while the illuminating multi-surface brush head uses LED light to illuminate dim floors and carpets, making cleaning more visible, efficient, and effective. The advanced multi-layer filtration system captures fine dust and particles with up to 97%* efficiency. In tandem, an advanced filter prevents dust from escaping into the air, keeping it inside the dust cup.

The vacuum robots and mops will be available from August 22 on Amazon India.  Robot Vacuums and Mops – L10 Prime is priced at Rs. 45.999, D10 Plus Gen 2 at Rs. 39,999, D9 Max Gen 2 at Rs. 29,999. The H12 Dual Wet and Dry Vacuum is priced at Rs 36,999. Cordless stick vacuums, the Mova J10, J20 and J30 are priced at Rs 7,999; Rs. 10,999 and Rs. 13,999 respectively.

The post Dreame Technology Expands India Portfolio with Diverse Range of Robotic & Smart Vacuum Cleaners appeared first on ELE Times.

• Up to 7 simultaneous sensor outputs
• Laser-based technology for accurate detection of PM1, PM2.5, PM10
• Metal oxide-based gas sensor
• Precise temperature and humidity sensor
• Absolute measurement of TVOC
• Estimated CO2 for low-cost CO2 room indication
• Ultra compact size: 46.6 x 34.8 x 12mm to fit in many applications
• On-board MCU for smart sensor management
• Robust & Siloxane resistant
• Support I²C and UART communication

The post Renesas Launches Ultra Compact Sensor Module for Smart Air Quality Monitoring at Homes, Schools and Public Buildings appeared first on ELE Times.

Market leader in solid-state, micro speaker technology brings revolutionary air cooling to ultraportable devices for uncompromised performance in AI and other demanding mobile applications.

xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world’s leading all-silicon micro speakers, today announced its latest industry-changing innovation: the xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) solutions.

For the first time, with active, fan-based micro-cooling (µCooling) at the chip level, manufacturers can integrate active cooling into smartphones, tablets, and other advanced mobile devices with the silent, vibration-free, solid-state xMEMS XMC-2400 µCooling chip, which measures just 1-millimeter thin.

“Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, xMEMS CEO and Co-Founder. “Thermal management in ultramobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers. Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin.”

The XMC-2400 measures just 9.26 x 7.6 x 1.08 millimeters and weighs less than 150 milligrams, making it 96 percent smaller and lighter than non-silicon-based, active-cooling alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure. The all-silicon solution offers semiconductor reliability, part-to-part uniformity, high robustness, and is IP58 rated.

xMEMS µCooling is based on the same fabrication process as the award-winning, sound-from-ultrasound, xMEMS Cypress full-range micro speaker for ANC in-ear wireless earbuds, which will be in production in Q2, 2025 with several customers already committed to the device. xMEMS plans to sample XMC-2400 to customers in Q1, 2025.

“We brought MEMS micro speakers to the consumer electronics market and have shipped more than half a million speakers in the first 6 months of 2024,” Jiang continued. “With µCooling, we are changing people’s perception of thermal management. The XMC-2400 is designed to actively cool even the smallest handheld form factors, enabling the thinnest, most high-performance, AI-ready mobile devices. It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology.”

xMEMS will begin demonstrating XMC-2400 to lead customers and partners in September at its xMEMS Live events in Shenzhen and Taipei. For more information about xMEMS and its μCooling solutions, visit xmems.com.

The post xMEMS Introduces 1mm-Thin Active Micro-Cooling “Fan on a Chip” appeared first on ELE Times.

Servotech Power Systems Ltd., India’s largest EV Charger manufacturer, has secured a substantial contract for installing 12 EV charging stations from the Agency for New and Renewable Energy Research and Technology (ANERT), Department of Power, Govt. of Kerala. Under this contract Servotech has to build 12 electric vehicle (EV) charging stations with 30KW Fast DC EV Chargers at the various locations of Kerala Motor Vehicle Department. This contract involves Servotech supplying, commissioning, and construction of EV charging stations.

This pilot project whose execution has already begun will be executed in phases with the 1st phase involving the installation of 4 EV charging stations and the 2nd phase will involve the installation of 8 EV charging stations. This initiative will prove to be beneficial in facilitating Kerala’s shift towards sustainable transportation solutions by substantially improving the state’s EV charging network. As the demand for EV mobility grows, there is a corresponding requirement for convenient and accessible charging infrastructure for electric vehicles. These charging stations will enable EV owners to recharge their vehicles conveniently while on the move.

Sarika Bhatia, Director of Servotech Power Systems Ltd. said, “We are elated to be working on this pilot project for ANERT. As a leading EV Charging player who is very actively working towards making India transition towards green transportation, this step brings us closer to achieving our collective dream of seeing India as an EV-powered nation. We are creating our green footprints, starting from Kerala, we plan to increase our footprints to other states as well. Our efficient hardware and software solutions will ensure dependable EV charging stations, catering to the growing demand for sustainable travel options. This initiative will prove to be essential for facilitating infrastructure development to support the expanding EV customer base and enable its strategic expansion in EV charging infrastructure at places with high charging demand.

The post Servotech Power Systems to Build 12 EV Charging Stations for ANERT, Kerala Govt. appeared first on ELE Times.

The prices of Lithium, the primary workhorse of energy storage solutions today, have dropped by over 60% in the past 18 months. Among many other reasons, this is attributed to a drop in EV demand globally as governments across US and EU started moderating EV related subsidies. There was also an aggressive ramp-up of capacity in China during the Covid period buoyed by the strong EV uptick which has now resulted in a supply glut. To give you a sense of the impact of this glut, we now see that LFP (Lithium Iron Phosphate) batteries are already commercially available at sub-$100 per kWh prices. This was forecast to happen only beyond 2026. At these prices, it is possible for EVs to have capital cost parity with conventional fossil fuel based vehicles which is supposed to be a massive inflection point. 

In the world of stationary energy storage, where Lead Acid batteries have ruled the roost for decades, Lithium based batteries become highly attractive substitutes with a significantly longer life and superior performance. Common sense dictates that this is about the worst time to invest in a new chemistry and that we should rather make the most of the ongoing supply glut to drive the agenda of accelerating decarbonization in India. We would however miss the forest for the trees in doing only that and nothing more.

It is a well known fact that the majority of the world’s active materials, the most critical components within a Lithium cell, are processed in China. Chinese players are also deeply backward integrated with interests in Lithium, Nickel and Cobalt mines across the world. So, financially speaking, we are merely converting our petro-dollars to lithium-dollars and directing them towards China instead of the countries that supply oil and gas. There are active investments in cell manufacturing in India propelled by the recent ACC-PLI incentives with over 50 GWh of capacity planned over the next few years. However, as long as the active material processing and the backward linkages rest with China or other countries the result will be broadly similar. This may also eliminate the possibility of using trade barriers even if local cell manufacturing capacity is fully established. India will need to do a similar backward integration and set up massive capacities for active materials processing which may largely end up becoming a catch-up game with low odds of success.

Secondly, Lithium, just like any other metal is a commodity which will go through its own commodity cycles. It is a risky gamble to leave a critical agenda like energy transition to the vagaries of commodity prices. We have had over five decades and continuing government intervention to insulate the economy from a similar commodity cycle impact of oil and gas and it has been anything but a smooth ride.

Lastly, the electrification of the economy will only be as green as the power sector that generates the electricity. While there is a lot of focus today on EVs, the other, potentially bigger, problem to solve is the greening of the generation through renewables which requires a large amount of energy storage capacity to mitigate the intermittency. For instance, NITI Aayog has estimated annual demand of around 300 GWh of storage capacity by 2030 of which about 60% would come from grid level storage alone. There is no other category, on a standalone basis, that even comes close to this requirement. This is pertinent because it should be a critical decision parameter as we think of the specific chemistries where we choose to invest the country’s limited resources.

So, in summary, we would do well to proactively invest in a chemistry or set of chemistries that are reasonably insulated from commodity cycles, could offer very attractive unit economics at scale, are well suited for grid scale storage and do not require aggressive critical mineral investments. There are many promising candidates on the horizon and Sodium-ion is one such candidate.

Sodium-ion has almost as long a history of development as Lithium-ion but did not take off earlier as Lithium-ion batteries were more compact allowing them to be used in consumer electronics resulting in their widespread adoption. Sodium-ion has however come a long way from the lab over the past few years. BYD, one of the world’s largest cell and EV manufacturers, broke ground on a 30 GWh Sodium-ion plant in January 2024 validating its role in the future of energy transition. A few weeks ago, in June 2024, the world’s largest Sodium-ion grid scale storage of 100 MW / 200 MWh was commissioned in Qianjiang, located in the Hubei province in China. 

The reason for the sudden interest in Sodium-ion and why it also makes a lot of sense for India is that it meets many of the criteria we identified earlier. For starters, Sodium is abundant and cheaply available in India which eliminates the need for backward integration.  It also enables domestic supply chains and reduces the overall cost of cells. As an added advantage, Sodium cells use low cost Aluminum collectors (instead of the more expensive Copper collectors required in Lithium) and the anode requires hard carbon (instead of the more expensive Graphite required in Lithium and also controlled largely by China). A key drawback of the Sodium-ion chemistry is that it has a lower energy density compared to Lithium. However for many applications like grid scale storage and 3W mobility, this is not a deterrent. Lastly, the process of Sodium-ion cell manufacturing is almost identical to Lithium-ion making it possible to use commercially available machinery and equipment to scale up manufacturing.

The need for India to invest in establishing local manufacturing capacities is inevitable. However, leaving that decision completely to the market forces through a chemistry-agnostic PLI scheme has the peril of driving a great short term optimization and missing the opportunity to build a truly self-reliant and thriving energy storage industry. The Chinese government took the imperative of driving investments specifically in LFP resulting in the dominance of that chemistry today. India would do well to build a point of view on the specific chemistry it would like to bet on and take control of the narrative.

Author: Venkat Rajaraman, Founder and CEO at Cygni Energy

The post Is it time to think beyond Lithium? appeared first on ELE Times.

Microchip’s LAN887x PHYs offer extended reach up to 40m and are designed to be compliant with industry standards

The automotive and industrial markets are widely adopting Single Pair Ethernet (SPE) solutions for network connectivity because of the system level benefits of reducing cost, weight and cable complexity. SPE, with its proven performance and reliability in automotive applications, is now also being deployed in other segments like avionics, robotics and automation. For exceptional flexibility and interoperability, Microchip Technology today announces it has expanded its SPE solutions with its family of LAN887x Ethernet PHY transceivers supporting 100 Mbps to 1000 Mbps using 1000BASE-T1 network speeds and cable lengths up to 40m for extended reach.

For interoperability across industries, Microchip’s LAN887x PHYs are designed to be fully compliant with IEEE 802.3bp for the 1000BASE-T1 specification and IEEE 802bw-2015 for the 100BASE-T1 specification. Microchip has collaborated with the University of New Hampshire InterOperability Laboratory (UNH-IOL) to create the development test platform for 1000BASE-T1 conformance. For many automotive and industrial applications that operate in harsh environments and need to withstand extreme temperatures, these devices are also designed to be ISO 26262 functional safety ready with ASIL B classification.

These devices provide advanced diagnostics including cable fault detection, signal quality indicator, link down and errors, built in self-test, and temperature and voltage monitoring for increased reliability. To provide flexibility with varying connectivity requirements across end applications, the LAN887x PHYs support Type A operation with cable lengths up to 15m and Type B operation to support extended cable lengths of up to 40m. Both operation types include four inline connectors.

The LAN887x is a low-power solution with EtherGREEN technology for increased energy efficiency. The OPEN Alliance TC10 Sleep and Wakeup feature provides additional power savings with a maximum of 16 µA standby power consumption, which extends operating time in battery applications. An optional integrated linear regulator can optimize BOM costs by reducing the number of components in the design.

“Our comprehensive solutions, which include PHY transceivers, bridge devices, switches and development boards, make it easier for designers to implement Single Pair Ethernet technology into their designs,” said Charles Forni, vice president of Microchip’s USB and networking business unit. “The low-power sleep, extended cable reach features and functional safety support make our LAN887x devices versatile and robust solutions to support our customers’ expanding networking needs.”

The LAN887x PHYs are compatible with Microchip’s broad portfolio of microcontrollers (MCUs), microprocessors (MPUs), System-on-Chip (SoC) devices and Ethernet switches. Microchip offers a growing range of SPE solutions including PHYs, controllers and switches to support data transmission speeds from 10 Mbps to 1000 Mbps. To learn more about Microchip’s SPE solutions, visit the website.

The LAN887x family of PHY transceivers is supported by comprehensive hardware evaluation platforms; Type A and Type B media converter kits, SFP (SGMII), USB and PCIe plug-in boards and Linux software drivers.

The LAN8870, LAN8871 and LAN8872 are now available in production quantities. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

The post Expanded Single Pair Ethernet Portfolio with 100BASE-T1 and 1000BASE-T1 PHY Transceivers for Network Interoperability appeared first on ELE Times.

Ideal for medical, industrial, transportation, and high-end consumer applications

Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, announced a product update on the C&K Switches KSC2 Sealed Tactile Switch product line. This surface-mounted, waterproof tactile switch series now incorporates the Electrical Height enhancement.

The KSC2 series of tactile switches for surface-mount technology (SMT) is an IP67-rated, 3.5 mm high momentary-action tactile switch featuring a soft actuator. The switches are available in several models and provide numerous electrical lifespans that can withstand various operating forces.

The latest KSC2 tactile switch, with its superior durability and extended lifespan, outperforms other switches in the market, reducing the need for frequent replacements. Its consistent performance over time instills confidence in users, ensuring reliable functionality. The KSC2 tactile switch provides clear tactile feedback, making it easier for users to know when an input has been registered. Using the redesigned KSC2 series results in a more reliable, user-friendly, and secure product, ultimately benefiting end users.

The KSC2 series design gives users a positive, adaptable tactile feeling, ideally suited for a wide range of markets and applications, including:

• Medical: Surgical tools, healthcare wearables
• Transportation: Door handles, window lifters, steering wheel columns
• High-end consumer: Power tools, lawnmowers, snow blowers
• Industrial: Elevators, automation, machinery

• Electrical Height of Sealed Tactile Switch: Guarantees precise and reliable electrical connections by precisely defining the distance between the actuation point and bottom contact.
• IP67 Rating: Ensures durability and reliability in harsh environments by providing resistance to dust and water up to 1 meter for 30 minutes.
• Compatibility with Lead-Free Reflow Soldering: Enables efficient, reliable, environmentally friendly manufacturing by withstanding high temperatures and thermal cycling in lead-free, RoHS-compliant soldering processes.
• Soft Actuator (3.5 mm high): Provides comfortable, improved user experience and precise operation via a soft actuator that offers gentle touch and consistent activation.

How it works: Electrical Height enhancement enables better precision on the electrical switching position compared to the printed circuit board (PCB) reference, which is necessary for stack-up tolerances. This new feature makes the KSC2 switch easier to integrate than other products on the market with Electrical Travel. Generally, designers need to determine the switching point position from the PCB and apply the formula: Product Height ±0.2 mm minus Electrical travel ±0.2 mm, giving a total tolerance of ±0.4 mm as a minimum. The target of dimensioning with the Electrical Height value is to avoid cumulated tolerances and to propose a functional value with tighter tolerance. Electrical Height is stable, and a standard tolerance at only ±0.15 mm or ±0.2 mm is recommended.

“This newly specified feature (Electrical Height) demonstrates the decades of experiences the Littelfuse engineers have when it comes to the integration of our products into the final application, as well as the level of control we have on our manufacturing capabilities,” said Jeremy Hebras, Vice President Digital & Technical Developments, Electronics Business Unit at Littelfuse. “By committing to the switch electrical height on this popular series, together with its tight tolerance, we are helping our customers to optimally design their products, obtain the most qualitative and consistent haptic and performance results, and ultimately enhance their product’s quality.”

The same Electrical Height enhancement is planned for additional tactile switch series in the Littelfuse/C&K Switches portfolio.

The post Littelfuse Enhances KSC2 Tactile Switch Series to Empower Designers with Precise Electrical Height appeared first on ELE Times.

Pre-Configured CryptoAuthentication ICs help reduce development time and minimize design costs

Secure key provisioning is vital to protect sensitive keys against third-party tampering and malicious attacks. For securing consumer, industrial, data center and medical applications, secure key storage is essential but the process to develop and document secure key provisioning can be complex and costly. To lower the barrier of entry into secure key provisioning and enable more rapid prototyping, Microchip Technology has added the ECC204, SHA104 and SHA105 CryptoAuthentication ICs to its TrustFLEX portfolio of devices, services and tools.

ECC20x and SHA10x ICs are hardware-based, secure storage devices that are designed to keep secret keys hidden from unauthorized attacks. As part of the TrustFLEX platform, ECC204, SHA104 and SHA105 ICs are preconfigured with defined use cases, customizable cryptographic keys and code examples to streamline the development process.

“Adding the ECC20x and SHA10x pre-configured devices to our TrustFLEX platform will facilitate leveraging Microchip’s secure provisioning services for a broader set of applications,” Nuri Dagdeviren, corporate vice president of Microchip’s secure computing group. “With this platform expansion, Microchip is continuing to strengthen its portfolio, making security authentication ICs more accessible and more specifically optimized for high-volume, cost-sensitive applications.”

ECC20x and SHA10x devices meet Common Criteria Joint Interpretation Library (JIL) High rated secure key storage requirements and have been certified by the NIST Entropy Source Validation (ESV) and Cryptographic Algorithm Validation Program (CAVP) in compliance with the Federal Information Processing Standard (FIPS). The secure IC families are designed to implement trusted authentication to maintain the confidentiality, integrity and authenticity of data and communications in a wide range of systems and applications.

Microchip’s CryptoAuthentication ICs are small, low-power devices that are designed to be compatible with any microprocessors (MPUs) or microcontrollers (MCUs). They provide flexible solutions for securing industrial, medical devices, battery-powered equipment and disposable applications. Additionally, the ECC204 is a Wireless Power Consortium (WPC) approved Qi authentication Secure Storage Subsystem (SSS). Visit the Microchip website to learn more about the  Trust Platform and its portfolio of security solutions.

ECC20x and SHA10x ICs are supported by Microchip’s Trust Platform Design Suite, which provides code examples and learning materials and enables the secure transfer of credentials to more easily leverage Microchip’s secure key provisioning services. The devices are also supported by the MPLAB® X Integrated Development Environment (IDE), product-specific evaluation boards and CryptoAuthLib library support.

The post Microchip Technology Adds ECC20x and SHA10x Families of Secure Authentication ICs to TrustFLEX Platform appeared first on ELE Times.

Key Features Include Larger Sensitive Area of 6.0 mm², Increased Reverse Light Current, and Small Form Factor of 4.8 mm by 2.5 mm by 0.5 mm

Vishay Intertechnology, Inc. has released a new silicon PIN photodiode that brings a higher level of sensitivity in the visible / near infrared wavelength to biomedical applications such as heart rate and blood oxygen monitoring. The new VEMD8082 features increased reverse light current, decreased diode capacitance, and faster rise and fall times compared to previous-generation solutions. Additionally, its small form factor of 4.8 mm by 2.5 mm by 0.5 mm makes it suitable for integration into low profile devices such as smart watches.

The high sensitivity provided by the VEMD8082 is particularly important in biomedical applications such as photoplethysmography (PPG), where the photodiode is used to detect changes in blood volume and flow by measuring the amount of light absorbed or reflected by blood vessels. In such applications, precise measurements are crucial for diagnosing and monitoring conditions such as cardiovascular disease.

Specifications for the new device contributing to its high sensitivity compared to previous-generation devices include a radiant sensitive area of 6.0 mm² and an increase in reverse light current of 18 % to 20 %, depending on wavelength. Decreased diode capacitance from 50 pF to 46 pF, as well as faster rise times of 40 ns vs. 110 ns, allow for higher sampling rates.

Samples and production quantities of the VEMD8082 are available now.

The post New Vishay Intertechnology Silicon PIN Photodiode Improves Sensitivity in Biomedical Applications appeared first on ELE Times.

Meaning of data transformation

Data transformation is the process of converting data from one format or structure into another format or structure.  For instance, converting a raw dataset into a well arranged, scientifically analysed, vetted, and a user-friendly format.

As the aim of data transformation is to present the data into a very user-friendly format, it invariably involves converting dataset from one format of file into another format. For instance, CSV (comma separated values), excel spreadsheet, XML (extensible markup language), etc.

It involves conversion of both the format and/ or structure of a data set into a format or structure that is congruent to the requirements of the target system.

Aim of data transformation

The aim behind executing any data transformation process is to ensure that the available data is scientifically arranged, well-analysed, vetted from reliable sources and as per the internationally accepted standards, and presented in a user-friendly format.

This ensures that the decision making based on the available data is rational, logical, scientific, and correct to the best of knowledge. Hence, it aids in analyses and developing insights. Besides, further analyses of the data available after executing the process of data transformation brings to fore some of the hitherto unexplored facts or dimensions about any topic.

Data transformation is only change in the format of the data and not the content of the data

An important feature of data transformation is that it only involves conversion of data from one format to another. It does not change anything in the content of the data.

Who are the people involved in the process of data transformation?

Majorly, the data engineers, data analysts, and data scientists collaborate amongst each other to execute the process of data transformation.

Processes involved in data transformation

Data transformation is executed by accomplishing three processes. They are as follows:

First, data integration.

Second, data migration.

Third, warehousing.

Phases of data transformation

Data transformation is accomplished over five phases. They are as follows:

First, data discovery.

Second, data mapping.

Third, code generation.

Fourth, code execution.

Fifth, data review.

Classification of the process of data transformation

The process of data transformation is classified into four types. They are as follows:

First, constructive data transformation. In this type, data is copied, replicated, or added.

Second, destructive data transformation. In this type, data pertaining to fields or records is deleted.

Third, structural data transformation. In this type, columns in data is combined, moved or renamed.

Fourth, aesthetic data transformation. In this type, data pertaining to certain values are standardized.

Significance of data transformation

First, data transformation is a critical stage of both the ETL (Extract, Transform, Load) and ELT (extract, load, transform) processes.

The difference between the ETL approach and the ELT approach is that the ETL approach uses a fixed criteria to sort data from multiple sources before compiling it a central place. On the other hand, the ELT approach aggregates data as it is from the beginning and then transforms it later depending upon the requirements of the case and analytics.

Second, data transformation is an important aspect of big data analytics. Hence, it is of immense importance in today’s age of big data, an age when the data is already huge in volume and is rapidly growing in gargantuan proportions.

Common life examples of data transformation

Data transformation is undertaken in various applications in our life. Few such examples are as follows:

First, converting file from CSV format to XML format.

Second, conversion of speech into text by means of speech conversion software.

The post Data transformation- Meaning, Aim, Processes involved, Phases, Classification, and Significance appeared first on ELE Times.

The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems

The latest data center architectures and increased traffic are driving higher bandwidth requirements between data centers. To address this challenge, system developers must streamline the development of a new generation of 1.2 Tbps (1.2T) transport solutions across a wide range of client configurations. This requires that today’s terabit-scale Ethernet PHY devices and coherent optical modules interoperate with each other in Data Center Interconnect (DCI) and metro transport networks. Microchip Technology today announces that it has worked with Acacia to demonstrate the fourth generation of interoperability between Microchip’s META-DX2 Ethernet PHY family and Acacia’s Coherent Interconnect Module 8 (CIM 8).

The two companies’ interoperable devices enable low-power, bandwidth-optimized, scalable solutions for pluggable optics in DCI and transport networks. They deliver three key benefits as they jointly enable high-capacity, multi-rate muxponders for optical transport platforms:

• Optimized DCI bandwidth: The META-DX2 family, through its META-DX2+ PHY, uses its unique Lambda Splitting feature to split 400 GbE or 800 GbE clients across multiple wavelengths driven by the CIM 8 modules. This maximizes the capacity between data centers in rate configurations such as 3×800 GbE over 2×1.2 Tbps waves or 5×400 GbE over 2×1.0 Tbps waves.
• Reduced design risk: Microchip and Acacia have jointly verified successful SerDes interoperation at up to 112G per lane for Ethernet and OTN clients, which reduces design validation and system qualification requirements.
• Better support for full bandwidth, multi-rate operation: The META-DX2+ crosspoint and gearbox functions enable 100 GbE to 800 GbE client modules to connect with full bandwidth to CIM 8 modules.

“This interoperability extends a long-established partnership with Acacia to help accelerate and optimize the build-out of cloud computing and AI-ready optical networks while reducing development risk for our customers,” said Maher Fahmi, vice president for Microchip’s communications business unit. “Our META-DX2 is the first solution of its kind to integrate 1.6T of encryption, port aggregation and Lambda Splitting into the most compact 112G PAM4 device in the market.”

“With Acacia’s CIM 8 coherent modules verified to interoperate with Microchip’s META-DX2 devices, we see this as a robust solution that reduces system time-to-market,” said Markus Weber, senior director DSP product line management of Acacia. “The compact size and power efficiency of our CIM 8 coherent modules were designed to help network operators deploy and scale capacity of high-bandwidth DWDM connectivity between data centers and throughout transport networks.”

The post Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems appeared first on ELE Times.