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Murata Manufacturing Co., Ltd. will present new sensors and power products at Electronica 2026, together with immersive demonstrations illustrating how its essential technologies for the AI era are making possible smarter mobility and machines and more intuitive human-machine interaction. The event will be held from 10 to 13 November at Messe München. Visitors to Hall C4, Stand 179 will be able to discover Murata’s innovations across numerous technology areas, including Mobility, AI & Robotics, Connectivity, Health & Wellness, Environment, Data Centers and IC technologies. Murata will also present its own digital service for circuit design.

New isolated power solution for SiC MOSFETs

At Electronica, Murata will launch the new MGJ2T2 series of isolated DC-DC converters for gate driving, intended for high-voltage power applications based on silicon carbide (SiC). Designed to combine high isolation performance with high immunity to electrical noise, the series will support demanding power conversion applications, including energy storage and distribution, motor drives and electric vehicle charging. Further product details will be announced during the event.

New inertial sensing sensor with integrated microcontroller

Murata will also present the SCI36LT series, a new high-performance six-degree-of-freedom (6DoF) inertial measurement solution featuring an integrated microcontroller able to run complex measurement algorithms. The device combines the sensor, passive components and an MCU in a single compact LGA package. The sensor is designed to measure motion accurately and can use Murata’s proprietary Fusion Sensor algorithm to determine orientation in terms of pitch, roll and yaw. Further product details will be announced during the event.

New input interfaces for the AI era

In the AI & Robotics area, Murata will present two new approaches to human-computer interaction (HCI). Developed in collaboration with the start-up Melt Interface Technologies, a hand tracking demonstration uses Murata’s compact, high-sensitivity LF antennas placed on the fingertips to detect hand and finger movements precisely without relying on external cameras. By turning detailed human movements into digital data, this technology could provide a new source of real-world data for training Physical AI, with potential applications ranging from robot learning and teleoperation to the transfer of specialised human skills.

Murata’s Mask Voice Clip uses a Picoleaf piezoelectric film sensor to capture voice by detecting the mask vibrations generated by the user’s voice. As voice is becoming an increasingly important input modality for AI, this technology enables clear voice capture even in noisy environments such as industrial plants.

Taken together, these demonstrations highlight Murata’s exploration of next-generation input interfaces able to connect human movement and voice to AI.

Sensing and connectivity for smarter mobility

Murata’s mobility exhibits will include sensing, connectivity and power technologies for automotive applications.

Outdoor demonstrations will present a range of sensing and connectivity technologies in real-world conditions on board vehicles, including a precision positioning technology developed with Hexagon and Murata sensor technologies for headlight levelling and GNSS-free positioning.

Murata will also present a demonstration of camera-radar sensor fusion for advanced in-cabin detection, developed in collaboration with Smart Eye. The demonstration combines Murata’s automotive-grade 60 GHz radar technology with Smart Eye’s AI-based software for in-cabin detection and data fusion, intended for Driver Monitoring Systems, Occupant Monitoring Systems and Child Presence Detection.

A live demonstration of Vehicle-to-Everything (V2X) technology will also show communication on board a moving vehicle.

Inside the exhibition hall, Murata will present its Ultrasonic Clearing Device (USCD), an innovative application of its piezoelectric technology. By generating ultrasonic vibrations on the camera lens, the USCD is designed to help maintain sensor visibility in adverse weather conditions, supporting the availability and reliability of sensing systems for advanced driver assistance systems (ADAS) and future automated driving applications.

Wireless technologies connect devices and infrastructure

The Connectivity area will feature a demonstration of an indoor tracking device that combines Nordic Inertial’s BorealPath positioning technology, which integrates a Murata inertial measurement unit, with Murata’s Wi-Fi HaLow Type 2HK and Type 2HL modules, intended for long-range, low-power wireless communication of position and device information. The demonstration will show how inertial navigation and Wi-Fi HaLow can be combined to support indoor tracking applications and in environments with limited GNSS signal availability. Alongside the indoor tracking demonstration, Murata will also present its UWB solution for smart locks and compact LoRa wireless modules.

Haptic and wearable technologies

In the Health & Wellness area, Murata will present Echorb (Wonder Stone). Using 3D Haptics technology, Wonder Stone creates tactile sensations that reproduce the perception of being pushed or pulled, making it possible to communicate directional information through the hand. The demonstration explores how these different forms of feedback can support more intuitive navigation and guidance, including applications intended for visually impaired users.

The Smart Ring demonstration explores 3D tracking and positioning using Sensoryx’s tracking solution, which combines an inertial measurement unit (IMU) with Murata’s ultrasonic technology. Jointly developed by Sensoryx and Murata, the demonstration uses Murata’s ultrasonic technology to measure distance, while the IMU provides orientation and motion data. Together, these technologies enable precise pointing, writing and 6DoF motion tracking in a compact wearable device.

Murata will also present its compact Microblower technology for wearable devices, using a demonstration with a wrist-worn wearable to illustrate its inflation capability. Despite its small size, the Microblower delivers effective air pressure performance while operating quietly and with minimal vibration, helping to create new possibilities for compact wearable applications.

Power and components for AI data centers and robotics

Murata will also present power solutions, batteries and passive components designed to meet the efficiency and reliability requirements of AI data centers and robotic applications. A dedicated IC area will also feature Murata’s semiconductor and integration technologies, including embedded solutions, optical communication solutions and a reference design demonstration.

Visit Murata at Electronica

Visitors to Electronica 2026 will be able to discover these innovations at the Murata stand (Hall C4 – 179), where experts will be available to discuss application requirements and show how Murata technologies make possible smarter mobility, smart machines and more intuitive human-machine interaction.

For more information, visit the Murata website.

*At the time of this announcement, some of the products on display are conceptual products or still in development. Specifications and appearance are subject to change without notice.

The post Murata at Electronica 2026: sensors, power and immersive demos for the AI era appeared first on Open Electronics.

ROHM Semiconductor Europe will return to electronica 2026, taking place from 10 to 13 November 2026 in Munich, Germany. Visitors can meet the ROHM team in Hall C3, Stand 520, where the company will present its latest power and analog semiconductor solutions for AI infrastructure, electric mobility, industrial automation and next-generation electronic systems.

Under the theme “Electronics for the Future”, ROHM will present technologies designed to increase efficiency, performance and reliability across a wide range of applications, contributing to society through its innovative products. The demonstrations set up inside the stand will highlight how advanced semiconductor solutions help meet the growing demands of AI data centres, accelerate vehicle electrification, support smart automotive systems and drive innovation in industrial equipment and energy applications. Visitors will also be able to engage with ROHM’s international experts, exchanging ideas on the technologies that will shape the electronic systems of the future.

“Taking part in electronica offers a unique opportunity to bring together customers, partners and experts from the global electronics industry. Beyond showcasing technology, we place great importance on constructive discussions that help shape future innovations and collaborations,” says Wolfram Harnack, President of ROHM Semiconductor Europe. “We are particularly pleased to welcome visitors, not only to get to know our European team, but also the members of ROHM’s senior management from Japan, creating a one-of-a-kind platform for direct exchange and strategic dialogue.”

Highlights at electronica 2026

Among the highlights of ROHM’s presence at electronica 2026 are:

• Power solutions for AI servers
• E-Powertrain, ADAS and lighting solutions for automotive applications
• Use cases for Solist-AI, ROHM’s AI solution for edge computing, and demonstrations of terahertz technology for industrial applications

Solist-AI is a trademark or registered trademark of ROHM Co., Ltd.

For more information, visit the ROHM website. For more information on ROHM’s participation in electronica 2026, visit the event page: www.rohm.com/electronica.

The post ROHM at electronica 2026: AI, electric mobility and industry appeared first on Open Electronics.

At electronica 2026 (10-13 November, Munich, Germany), the Chomerics Division of Parker Hannifin, a world leader in motion and control technologies, will present its advanced ventilation panels with electromagnetic shielding. At stand B3.457, Parker Chomerics will demonstrate how its stainless steel honeycomb technology lets electronic enclosures deliver effective electromagnetic shielding while maximising airflow for efficient thermal management.

The high-density data centre challenge

The rapid expansion of data centres and high power density electronic systems makes heat management inside equipment enclosures increasingly complex. On top of that, sensitive electronic devices must be protected from electromagnetic interference (EMI), which can degrade system performance.

Stainless steel honeycomb ventilation panels

Parker Chomerics’ stainless steel honeycomb ventilation panels address both needs: they provide airflow of up to 96% and deliver highly effective electromagnetic shielding.

Other advantages of the stainless steel ventilation panels include noise attenuation, corrosion protection and fire resistance. Parker Chomerics engineering teams work closely with customers to develop tailored solutions based on their specific application requirements. Solutions can be fully customised in terms of size, shape, material, frame, gaskets and plating. Thanks to advanced manufacturing technologies, the company supplies high-quality ventilation panels at a competitive price, combining high production volumes with dimensional precision.

Automated optical inspection allows the work to be monitored in real time and defects to be detected early, while automated laser welding ensures precise, repeatable joints with minimal thermal distortion. This strengthens structural integrity and achieves uniform electromagnetic shielding. Data-driven quality control is applied throughout the production process: statistical process control and traceability ensure consistent, repeatable performance. The process maintains a capability level with Cp and Cpk values above 1.67, commonly recognised as “excellent”.

Parker Chomerics supports customers who need fast development and production: prototypes of the stainless steel ventilation panels are available in one week and production lead times are just two to four weeks.

Statement from Keith McDonald

“Parker Chomerics helps its customers tackle the challenges of electromagnetic protection and thermal management without compromising airflow, quality or production speed,” said Keith McDonald, International Director of Sales at Parker Hannifin. “Our stainless steel honeycomb ventilation panels are a highly engineered, customisable solution that ensures reliable enclosure performance and lets customers move efficiently from prototype to production.”

Thermally conductive materials on show

At electronica 2026, Parker Chomerics will also present two recently introduced thermally conductive materials.

THERM-A-GAP PAD 120LOE

THERM-A-GAP PAD 120LOE will also be on display, a high-performance thermal elastomer offering a thermal conductivity of 12.0 W/m-K, with an exceptionally low level of silicone oil bleed and migration. Designed for high-performance electronic applications, this new material delivers high thermal performance, low compression force, vibration attenuation and physical protection of sensitive components.

THERM-A-GAP® PAD 30RB

The new THERM-A-GAP® PAD 30RB thermally conductive elastomer pad, with a thermal conductivity of 3.0 W/m-K, offers excellent elastic recovery and good reusability, allowing repeated compression and reapplication with minimal loss of thickness. It is used in automotive electronics, telecommunications equipment, data processing and consumer electronics.

To learn more about the Parker Chomerics technologies and solutions on show at electronica 2026, visit the Electronica 2026 – Chomerics Division page.

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