Новини світу мікро- та наноелектроніки

Skyworks ships over 1 million units of first small-cell base-station 5G PA

Semiconductor today - Срд, 01/13/2021 - 18:02
Skyworks Solutions Inc of Woburn, MA, USA (which manufactures analog and mixed-signal semiconductors) says that it has now shipped more than 1 million units of its SKY66318-21 power amplifier (PA), which is claimed to be the first high-efficiency small-cell PA with a bandwidth of 200MHz at +28dBm. Skyworks says that the milestone highlights it accelerating the adoption of 5G by enabling enhanced 5G connections and powering more efficient range extension for small cells...

6 essential activities to help developers build in IoT cybersecurity

EDN Network - Срд, 01/13/2021 - 17:54

For many development teams, the idea of building cybersecurity into their IoT design can seem daunting. Striking a balance between adding functionality and minimizing implementation cost can quickly lead to confusion and frustration without a systematic approach to addressing the problem. To support developers, the US government has identified some essential activities that development teams can pursue to provide a reasonable foundation for their device’s security capabilities.

In its document NISTIR 8259, Foundational Cybersecurity Activities for IoT Device Manufacturers, the US Department of Commerce’s National Institute of Standards and Technology (NIST) has defined six foundational activities it sees as essential for development teams to follow when considering cybersecurity in their IoT device designs. These foundational activities can be grouped into two timeframes. The first is the pre-market activities, which take place before detailed development even begins. These activities will help development teams determine what security functionality their designs should provide and can often uncover guidance into how to implement that functionality.

The second group of activities come into play following the delivery of the finished product to market, although they should be planned for before beginning development. These post-market activities relate to the question of how to support customers who have purchased the product and incorporated it into their systems. Because cyber-attack processes continually evolve, IoT devices will also need to be able to evolve. Most customers will expect their device vendor to help support that evolution.

NIST diagram of activities for development teams to secure IoT designsFigure 1 These six activities can help development teams ensure that their IoT designs implement adequate and appropriate cybersecurity features. (Source: NIST)

In the pre-market phase, there are four key activities intended to supplement or be concurrent with a development team’s other, traditional pre-market activities that help define the market opportunity the design seeks to fulfill.

1. Identify expected customers and define expected use cases

This activity is essential for determining what cybersecurity features will be demanded by customers and can often indicate how those features will need to be implemented. Questions to ask might include how and where the device will be used, how long the device will remain in use, what other customer systems the device will interact with, and how attackers might compromise or mis-use the device.

2. Research customer cybersecurity needs and goals

Developers will need to understand, at least in part, how the customer will need to mitigate their unique cybersecurity risks. Understanding what the customer risks and the means by which the customer will control their risk will go a long way toward defining the device’s cybersecurity functionality requirements. Two kinds of threat are in play – the device itself may need protection against its functionality being compromised or hijacked and the information the device handles may need protection from theft or manipulation.

For some customers and use cases, there may also be regulatory or application-specific cybersecurity needs to be addressed. In such cases, the design will benefit from implementing features that simplify and support the customer in meeting those needs. This activity, therefore, might need to include exploring the relevant regulatory standards for guidance on feature requirements as well as interviewing potential customers to understand their needs and expectations.

3. Determine how to address customer needs and goals

For each cybersecurity goal identified in activity 2, development teams need to ask the question: What is a suitable means or combination of means for achieving that goal? The means may include capabilities built into the device itself, be provided by another customer device such as a hub or gateway, or be provided by third parties such as a cloud-based service. Non-technical means also need consideration, such as the customer’s willingness to accept the risk of not meeting the goal. Teams should also consider how robust the means will need to be.

4. Plan for adequate support of customer needs and goals

Developers can make their designs more suitable for meeting the customer goals by ensuring there are mechanisms in place and design choices made with the idea of long-term device support in mind. For example, if a device is to have an installed life of decades, it might be appropriate to include an ability to update encryption algorithms or change keys after installation. Other questions to ask might include how customers can verify the integrity of the hardware and software, how to ensure the security of third-party software, and how to protect the code from unauthorized access and tampering.

In addition to these activities, which can help guide the selection and implementation of a device’s cybersecurity features, there are two post-market activities development teams should plan for.  

5. Define approaches for communicating to customers

Customers evaluating a device for purchase will likely need to know what security capabilities the device can provide. Following installation, they may need to know how to activate, modify, or update such features. Development teams thus need to plan on how to communicate this information to customers. Questions to consider include what terminology the customer will understand (based on their technical sophistication), how much information they will need, how that information is to be made available, and how customers can verify the information’s integrity.

6. Decide what to communicate to customers

Many factors may be involved in making the determination of what information to communicate and how to do it. One thing to consider is how long to support the device once sold and what happens after end-of-life. Another consideration is to determine what customers need to know about the device and its design in order to integrate it into their systems and maintain it. Questions to ask also include, how will customers receive updates to software, what must they do to disable a device, and how can they transfer ownership to another party?

The NIST document NISTIR 8259 provides numerous additional, more detailed suggestions for development teams seeking to engage in these activities. It is free to download from the link provided above, and well worth the read. Cybersecurity can seem daunting, but these guidelines will provide development teams with a solid framework for beginning to tackle the challenge.

Rich Quinnell is a retired engineer and writer, and former Editor-in-Chief at EDN.

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Asahi Kasei & Crystal IS launch second round of UV Accelerator funding initiative

Semiconductor today - Срд, 01/13/2021 - 16:35
Crystal IS Inc of Green Island, NY, USA, which makes proprietary ultraviolet light-emitting diodes (UVC LEDs), and its parent company Asahi Kasei have announced the second round of their UV Accelerator funding initiative for supporting the development of new disinfection products that use ultraviolet-C (UVC) LEDs. Following the funding of two companies in the first round (launched in June 2020), the endeavor again aims to team up with innovative companies that have ideas for new applications of UVC LEDs in a post-COVID world by providing investments of up to $250,000 per company...

ams introduces VCSEL IR emitters for industrial mass-market 2D/3D sensing

Semiconductor today - Срд, 01/13/2021 - 11:43
High-performance sensor designer and manufacturer ams AG of Premstaetten, Austria has introduced the EGA2000 family of infrared vertical-cavity surface-emitting laser (VCSEL) flood illuminators, which can help industrial manufacturers to develop new applications for robots, cobots (collaborative robots), autonomous guided vehicles (AGV) and smart devices that perform 2D and 3D optical sensing...

Design Tips for Photodiode Amplifiers

AAC - Срд, 01/13/2021 - 08:31
This article covers important details related to the design of transimpedance amplifiers for photodiode-based systems.

Research Headlines - Engineers put the squeeze on cancer cells

EC:RIC: - Срд, 01/13/2021 - 02:00
[Source: Research & Innovation] EU-funded researchers have applied engineering know-how to understand what controls the mechanical strength of living cells. Their findings offer new insights into the spread of cancers as well as into diseases of the heart and nervous system.

Research Headlines - Engineers put the squeeze on cancer cells

EC:RIC:News - Срд, 01/13/2021 - 02:00
ImageEU-funded researchers have applied engineering know-how to understand what controls the mechanical strength of living cells. Their findings offer new insights into the spread of cancers as well as into diseases of the heart and nervous system.

Engineers put the squeeze on cancer cells

EC:RIC - Срд, 01/13/2021 - 02:00
EU-funded researchers have applied engineering know-how to understand what controls the mechanical strength of living cells. Their findings offer new insights into the spread of cancers as well as into diseases of the heart and nervous system.

Integrated Laser-on-Silicon Photonics Gets a Boost from DARPA

AAC - Срд, 01/13/2021 - 01:00
Partially funded by DARPA, Tower Semiconductor is creating a new foundry process for integrated-laser-on-silicon photonics.

POET announces special meeting of shareholders

Semiconductor today - Втр, 01/12/2021 - 22:22
POET Technologies Inc of Toronto, Ontario, Canada — designer and developer of the POET Optical Interposer and photonic integrated circuits (PICs) for the data-center and telecom markets — is to hold a special meeting of shareholders on 19 February in order to seek their authorization to enable the board of directors (within its sole discretion) to consolidate the firm’s issued and outstanding common shares, on the basis of a ratio to be determined from within a range of ratios to be proposed at the Special Meeting...

New Reference Design Bridges the Gap Between Primary and Secondary Windings for Low-Voltage Applications

AAC - Втр, 01/12/2021 - 19:37
Combining a new AC-DC controller and patented "Inde-Flux" transformer technology, Microchip and Würth Elektronik eiSos aim to help designers create reliable bi-directional communication between the primary and secondary elements in isolated applications.

Skyworks partners with ASUS on first ultra-fast Wi-Fi 6E extended-band router

Semiconductor today - Втр, 01/12/2021 - 19:19
Skyworks Solutions Inc of Woburn, MA, USA (which manufactures analog and mixed-signal semiconductors) says that its high-performance Wi-Fi 6E front-end modules are featured on the first ultra-fast Wi-Fi 6E gaming router from ASUS...

Dual-channel op amp is noise-tolerant

EDN Network - Втр, 01/12/2021 - 19:16

The BD77502FVM ground sense CMOS op amp from Rohm limits output voltage fluctuations to less than ±300 mV with respect to noise. Part of the EMArmour series of noise-tolerant op amps, the BD77502FVM integrates two op amps that prevent oscillation, while providing high-speed amplification with slew rates up to 10 V/μs.

Rohm PR image of the BD77502FVM op amp, EMArmour logo, and application photos

Like the series’ single-channel and quad-channel variants, the dual-channel BD77502FVM op amp operates over a wide single supply range of 7 to 15V or dual supply range of ±3.5 to ±7.5V. Output voltage across the entire noise frequency band is limited to under ±20 mV, which is 10× lower than a conventional op amp, according to the manufacturer. Input offset voltage is typically 4 mV. Bias current is 0.001 nA, and circuit current is 2.6 mA typical.

The EMArmour series enables high-speed amplification without being affected by external noise or load capacitance when used in devices that output small signals. These op amps can be used in both consumer and industrial applications, such as measurement and control systems. All of the devices are in mass production and are sold through Rohm’s distributor network.

BD77502FVM product page 

Rohm Semiconductor 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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GaN Systems launches first GaN power stage with programmable source current and over-current protection

Semiconductor today - Втр, 01/12/2021 - 18:20
GaN Systems Inc of Ottawa, Ontario, Canada (a fabless developer of gallium nitride-based power switching semiconductors for power conversion and control applications) has released two 650V half-bridge daughter cards (30A and 60A), which provide a versatile platform for evaluating GaN drivers and transistors...

Kyocera completes acquisition of SLD Laser

Semiconductor today - Втр, 01/12/2021 - 18:11
Kyocera Corp of Kyoto, Japan (which manufactures fine ceramic components) has completed its acquisition of SLD Laser of Goleta, near Santa Barbara, CA, USA (formally Soraa Laser Diode Inc)...


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