Новини світу мікро- та наноелектроніки

Ventana Micro Systems Inc. has introduced the latest iteration of its Veyron family of RISC-V processors, positioning itself as a pioneer with the world’s first data centre-class RISC-V processor. The newly unveiled processor, known as Veyron V2, is available in both chiplet and IP configurations and represents a significant leap forward in high-performance RISC-V CPUs.

Balaji Baktha, Founder and CEO of Ventana, emphasized the processor’s groundbreaking features, stating, “This signifies a significant advancement in our relentless pursuit to lead the industry in high-performance RISC-V CPUs. The V2 processor underscores our commitment to customer-driven innovation, workload acceleration, and optimizing overall performance for industry-leading efficiency in terms of performance per Watt per dollar.”

Key Highlights of the Veyron V2 Processor:

1. Substantial Performance and Efficiency Boost:

• Up to 40% performance improvement was achieved through enhancements in microarchitecture, advanced processor fabric architecture, improved cache hierarchy, and a high-performance vector processor.

2. Ecosystem Advancement with RISE:

• Introduction of RISE, a new ecosystem initiative enhancing support for V2, facilitating the rapid deployment of open, scalable, and versatile solutions.

3. Streamlined Development and Cost-Efficiency:

• Utilization of the industry-leading UCIe chiplet interconnects for chiplet-based solutions, offering cost-effective unit economics, accelerating time to market, and reducing development expenses by up to 75%.

4. Specialized Workload Acceleration:

• Integration of Domain Specific Accelerator technology designed to enhance the efficiency of workloads across data centre infrastructure, fostering customer-driven innovation and distinctiveness.

Technical Specifications of Veyron V2 Processor:

• Fifteen comprehensive out-of-order pipelines.
• Clock speed of 3.6GHz and cutting-edge 4nm process technology.
• 32 cores per cluster, with multi-cluster scalability extending to an impressive 192 cores.
• 128MB of shared L3 cache per cluster and a 512b vector unit for handling intensive computational tasks.
• Ventana AI matrix extensions for advanced AI capabilities.
• Server-class IOMMU and Advanced Interrupt Architecture (AIA) system IP for enhanced performance and reliability.
• Advanced side-channel attack countermeasures for heightened security.

Reliability and Serviceability:

• Comprehensive RAS (Reliability, Availability, and Serviceability) features.
• Top-down performance-tuning methodology for optimal performance.

Ventana Micro Systems complements the Veyron V2 Processor with a Software Development Kit (SDK) comprising various validated software building blocks tailored for the RISC-V platform. The Veyron V2 Development Platform is readily available, opening the doors to high-performance computing and AI applications.

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In a recent announcement, MediaTek, drawing upon its extensive expertise in 5G connectivity, revealed plans to broaden its array of modems and chipsets to accommodate the 5G RedCap standard. The newly introduced solutions, namely the M60 modem IP and the MediaTek T300 chipset series, are poised to streamline the transition to 5G-NR, particularly for applications demanding prolonged battery life and efficiency. This encompasses wearables, lightweight AR devices, IoT modules, and devices incorporating edge AI functionalities.

RedCap, an acronym denoting “reduced capability,” has been devised to extend the advantages of 5G to NR consumer, enterprise, and industrial devices. Capitalizing on the evolution of 5G networks towards the Standalone (SA) architecture, RedCap assures reliability for low-bandwidth requirement devices, offering the benefits of 5G without the typical costs and complexities associated with conventional 5G solutions.
JC Hsu, Corporate Senior Vice President at MediaTek, emphasized the significance of RedCap solutions in the company’s mission to democratize 5G. He underscored their role in enabling customers to optimize components and deliver 5G-enabled devices across various applications and price points. According to Hsu, the shift to 5G RedCap will supplant legacy 4G/LTE solutions, providing enhanced power efficiency and more dependable user experiences compared to leading-edge 5G eMMB modem solutions and legacy 4G LTE Cat 4 and Cat 6 devices.

Breaking new ground in the RedCap arena, the MediaTek T300 series stands out as the world’s first 6nm Radio Frequency System-On-Chip (RFSOC) single die solution. This innovation is expected to empower brands to capitalize on the emerging RedCap market, fostering innovative designs for enterprise, industrial, consumer, AR, and data-card applications. Fabricated on the highly efficient TSMC 6nm process, the MediaTek T300 series integrates a single-core Arm Cortex-A35 in a significantly more compact PCB area, supporting up to 227 Mbps downlink and 122 Mbps uplink data rates.

Both the T300 series and the M60 5G modem IP adhere to the 3GPP R17 standard, combining MediaTek’s renowned power efficiency with coverage enhancements and exceptionally low latency. Leveraging MediaTek’s UltraSave 4.0 technology and minimizing unnecessary paging receptions, the M60 promises up to a 70% reduction in power consumption compared to analogous 5G eMBB solutions, and up to 75% power savings compared to 4G LTE solutions.

MediaTek’s RedCap solutions are anticipated to usher in a new era of efficiency, reliability, and cost savings for 5G-enabled devices across consumer, enterprise, and industrial sectors, aligning with evolving connectivity requirements and expectations. The MediaTek T300 series is set to enter the sampling phase in the first half of 2024, with commercial samples expected in the second half of the same year.

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The new HP Series filters deliver reliable and repeatable high-frequency performance in space-constrained microwave and RF applications including wireless LANs, satellite TV receivers, vehicle location systems, base stations, and ground and mobile communications systems.

FOUNTAIN INN, S.C. KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has released a new series of miniature high-pass thin-film filters engineered to provide excellent high-frequency performance in a variety of space constrained microwave and RF applications in the telecommunications, automotive, consumer electronics, and military markets.

The new HP Series high-pass thin-film filters are based on proven multilayer integrated thin-film technology that enables the quick adjustment of RF parameters and development of custom filters. They exhibit reliable and repeatable high-frequency performance as well as low insertion losses, extremely sharp roll-off values, and steep attenuation. HP Series filters also exhibit high temperature stability and lot-to-lot and part-to-part consistency and feature a rugged, miniature, and low-profile construction optimized for automated assembly. They are rated for operating frequencies spanning 1.0GHz to 5.15GHz and operating temperatures extending from -40°C to +85°C and have a characteristic impedance of 50Ω. Ideal applications for the series include wireless LANs, satellite TV receivers, vehicle location systems, and ground and mobile communications systems ranging from handheld commercial radios to military communications systems.

HP0805 high-pass thin-film filters currently offer five part numbers optimized for 2.70, 2.80, 2.90, 3.00, and 5.15 GHz performance to enable broad compatibility with high-frequency wireless systems, including 5G and ultra-wideband applications and the high-power remote radio units in base stations. Their miniature cases measure just 2.03 x 1.55 x 0.8 mm (L x W x H, ±0.1mm) and they have a 3W continuous power rating.

HP2816 thin-film high-pass filters measure 7.0 (±0.3) x 4.0 (±0.2) x 1.2mm max. (L x W x H). They are rated at 15W and are also well-suited for military applications.

“Our new HP Series high-pass thin-film filters provide engineers with superior, repeatable performance in a miniature case size optimized for the smaller and more densely populated PCBs common in next-generation wireless applications,” said Amir Kopelman, Technical Services Manager, KYOCERA AVX. “The multilayer thin-film technology they’re based on allows us to quickly adjust RF parameters and develop custom filters with a short lead time. In addition, we manufacture our thin film filters in an ISO 9001 facility equipped with extremely accurate processing lines that support design flexibility, reduce noise, prevent shrinkage, ensure high-quality parts and performance, and allow us to achieve consistent manufacturing results and deliver excellent filtering performance in smaller device sizes than competing technologies provide.”

HP Series high-pass thin-film filters have RoHS-compliant lead-free and solder-coated nickel terminations compatible with reflow, wave, vapor phase, and manual automatic soldering technologies. Finished parts are 100% tested for electrical parameters and visual and mechanical characteristics, and parts are packaged on tape and reel. Lead-time for the series is currently 14 weeks.

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Anritsu Corporation, in collaborating with the University of Texas at Dallas, showcases the OpenROADM at the Supercomputing Conference 23 (SC23) on November 12-17, 2023, in Denver, USA. Anritsu will be exhibiting our test system in which the MT1040A, the 400G Ethernet tester, evaluates the quality of the physical and Ethernet layer, and monitors the network performance through the 400GZR module connected to the Add/Drop line of the end-to-end OpenROADM.

Today’s network functions are becoming more sophisticated and virtualized for the diversified use cases of the all-photonics network and beyond 5G/6G era. Network automation is therefore strongly desired aiming to optimize the Quality of Service (QoS) and reduce maintenance and management labor cost. To achieve these goals, it is essential to measure and monitor the performance of physical layer and Ethernet layer in real time.

In our exhibition, two Anritsu MT1040As will be placed at each end of the multi-vendor Open ROADM system through a 400GZR module which is connected to the Add/Drop line. The MT1040A measures the line and path performance in real time when optical wavelength switch occurs on every single site, and captures the measurement results and displays them on an external PC screen automatically. In addition, the MT1040A processes and sends the measurement data to the host system without delay, this way it prevents missing transient failures and the cause analysis.

The University of Texas at Dallas Open Lab contributes to the verification of hardware and software interoperability with the open specifications published by the OpenROADM MSA, issues the verified labels to the devices that pass the interoperability verification, and provides feedback to the OpenROADM MSA based on the verification results.

Through this collaboration, Anritsu will contribute to the automation of OpenROADM test and measurements. In addition, we will contribute to the construction of automated systems used for orchestration that integrates the higher-level network management.

Come to talk to us about network performance measurement and automation.

The MT1040A is a B5 size 400G handheld tester with excellent expandability and operability. It is a touch-panel operated field measurement instrument equipped with a 9-inch screen. It supports multi-date interfaces from 10M up to 400G.

[※1]OpenROADM
It specifies interconnection specifications for optical transmission equipment (ROADM), optical transponders, and detachable optical components, as well as YANG data model specifications, and defines interfaces for realizing interconnection and interoperability between each functional part of an optical transmission network in a multi-vendor environment.

[※2]OpenROADMMSA
Abbreviation for OpenROADM Multi-Source Agreement, the international organisation established in 2015 with members from telecom operators and vendors.

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Microsoft, which developed silicon for Xbox two decades ago and later co-designed chips for Surface devices, has unveiled two custom chips: Azure Maia for artificial intelligence (AI) servers and Azure Cobalt CPU for cloud workloads. It shows how Microsoft is architecting its cloud hardware stack and why custom silicon is crucial in this design journey.

These homegrown chips, tailored for AI and cloud workloads, aim to work hand-in-hand with software developed to unlock new capabilities and opportunities for Microsoft’s data center services. However, Microsoft has provided few technical details about these in-house chips.

Figure 1 The two custom chips aim to optimize cloud infrastructure for Azure data centers. Source: Microsoft

Below is a sneak peek of these custom chips designed to power Microsoft’s Azure data centers while enabling significant cost savings for the company and its cloud service users.

Maia 100 AI accelerator

Microsoft Azure Maia 100 is an AI accelerator specifically designed to run training and inference for large language models (LLMs) and generative image tools. It comprises 105 billion transistors and is manufactured on TSMC’s 5-nm node. In a nutshell, it aims to enable higher density for servers at higher efficiencies for cloud AI workloads.

Named after a bright blue star, Maia is part of Microsoft’s multi-billion partnership with OpenAI; the two companies are collaborating to jointly refine and test Maia on OpenAI models. Currently, it’s being tested on GPT 3.5 Turbo, the model that powers ChatGPT, Bing AI workloads, and GitHub Copilot.

Figure 2 Maia 100 paves the way for training more capable models and making those models cheaper. Source: Microsoft

Microsoft and rivals like Alphabet are currently grappling with the high cost of AI services, which according to some estimates, are 10 times greater than traditional services like search engines. Microsoft executives claim that by optimizing silicon for AI workloads on Azure, the company can overhaul its entire cloud server stack to optimize performance, power, and cost.

“We are rethinking the cloud infrastructure for the era of AI, and literally optimizing every layer of that infrastructure,” said Rani Borkar, head of Azure hardware systems and infrastructure at Microsoft. She told The Verge that Maia chips will nestle onto custom server boards, which will be placed within tailor-made racks that fit easily inside existing Microsoft data centers.

That’s how Microsoft aims to reimagine the entire stack and think through every layer of its data center footprint. However, Microsoft executives are quick to note that the development of Maia 100 won’t impact the existing partnerships with AI chipmakers like AMD and Nvidia for Azure cloud infrastructure.

Azure Cobalt 100 CPU

Microsoft’s second in-house chip, Azure Cobalt CPU, named after the blue pigment, seems to answer the Graviton in-house chips offered by its chief cloud rival, Amazon Web Services (AWS). The 128-core chip, built on an Arm Neoverse CSS design, is designed to power general cloud services on Azure. And, like Azure Maia 100, Cobalt CPU is manufactured on TSMC’s 5-nm node.

Microsoft, currently testing Cobalt CPU on workloads like Microsoft Teams and SQL server, claims a 40% performance boost compared to commercial Arm server chips during initial testing. “We made some very intentional design choices, including the ability to control performance and power consumption per core and on every single virtual machine,” Borkar said.

Figure 3 Cobalt CPU is seen as an internal cost saver and an answer to AWS-design custom chips. Source: Microsoft

Maia 100 AI accelerator and Cobalt 100 CPU will arrive in 2024 and be kept in-house. Microsoft hasn’t shared design specifications and performance benchmarks of these chips. However, their naming conventions show that the development of second-generation Maia and Cobalt custom chips might be in the works right now.

We are making the most efficient use of the transistors on the silicon, says Wes McCullough, Microsoft’s corporate VP of hardware product development. Now multiply those efficiency gains in servers across all our data centers, and it adds up to a pretty big number, he wrote on the company’s blog.

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In a significant development for embedded and edge computing technology, Congatec has introduced six cutting-edge computer-on-modules—specifically, the conga-TC675r COM Express Compact modules. Powered by the 13th Gen Intel Core processors, these modules are engineered to operate reliably in demanding environments, making them ideal for applications subjected to extreme temperature fluctuations. Capable of withstanding temperatures ranging from -40°C to +85°C, these modules ensure robust performance in harsh conditions.

Utilizing Intel’s Raptor Lake microarchitecture, the modules are strategically designed for original equipment manufacturer (OEM) applications, catering to both manned and unmanned rail and off-road vehicles. This includes a spectrum of applications such as mining, construction, agriculture, forestry, and various mobility scenarios beyond conventional road infrastructure.

Equipped with soldered random access memory (RAM), the modules adhere to the highest standards for shock and vibration resistance, meeting stringent railway standards. This makes them well-suited for stationary devices and outdoor applications, providing critical infrastructure protection against natural disasters like earthquakes.

Featuring up to 14 cores and 20 threads, supported by LPDDR5x memory, these modules deliver substantial parallel processing and multitasking capabilities while maintaining optimized power budgets. The soldered LPDDR5x memory incorporates in-band error code correction (IBECC), enhancing data integrity for mission-critical applications without necessitating specialized memory types.

The Intel processors boast a hybrid architecture, incorporating performance cores (P-cores) and efficient cores (E-cores) on a single chip. This integration results in an improved performance per watt ratio, contributing to reduced power costs over the modules’ lifespan. Additionally, the modules support Time Sensitive Networking (TSN) and Time Coordinated Computing (TCC), further enhancing their industrial-grade capabilities.

Congatec’s ecosystem for these modules includes efficient cooling solutions, optional conformal coating for added protection, evaluation carrier boards, and carrier board schematics. For edge computing scenarios, the modules can be equipped with a pre-evaluated real-time hypervisor from real-time systems, facilitating real-time operations without introducing latency.

To complement these advanced modules, Congatec offers additional services, encompassing shock and vibration testing for custom system designs, temperature screening, high-speed signal compliance testing, design-in services, and training sessions aimed at facilitating the utilization of their embedded computer technologies. This comprehensive suite positions Congatec as a key player in delivering robust solutions for mission-critical applications in challenging environments

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SemiQ’s 1200-V SiC MOSFETs can be copackaged with or without a 1200-V SiC Schottky barrier diode (SBD) in SOT-227 packages. The QSiC modules provide a breakdown voltage of >1400 V and low on-resistance shift over the full operating temperature range of -55°C to +175°C. They are offered in 20-mΩ, 40-mΩ, and 80-mΩ SiC MOSFET categories.

Target markets for the copackaged SiC modules include EV charging, on-board chargers, energy storage systems, solar and wind energy, and many other automotive, industrial, and medical power applications. All of the modules are tested at wafer-level gate burn-in to provide high-quality gate oxide with stable gate threshold voltage.

In addition to the burn-in test, which helps to stabilize the extrinsic failure rate, stress tests—such as gate stress, high-temperature reverse bias (HTRB) drain stress, and high humidity, high voltage, high temperature (H3TRB)— ensure requisite industrial-grade quality levels.

Follow the product page link below to access datasheets and to request samples or volume pricing.

QSiC module product page

SemiQ

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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BB5x 8-bit MCUs from Silicon Labs join the company’s PG2x family of 32-Bit MCUs in sharing a common development environment. The Simplicity Studio software is also the development platform for Silicon Labs’ portfolio of wireless SoCs, allowing developers to develop once and deploy in multiple product variations, regardless of whether they are connected or not. Developers do not have to learn two sets of tools and can cost-optimize their devices by selecting the part that best fits application needs.

Powered by a pipelined 8-bit C8051 core operating at 50 MHz, the BB5x family of microcontrollers generates up to 36% more compute power than other general-purpose 8-bit MCUs. They can be used in battery-operated power tools, handheld kitchen gadgets, and children’s toys, as well as industrial automation and LED/lighting control. The MCUs support a range of voltage options, from 1.8 V to 5.5 V, allowing them to operate for years on a coin-cell battery.

BB5x microcontrollers offer a choice of package sizes. BB50 variants come in 2×2-mm packages, while BB51 and BB52 devices come in 3×3-mm packages offering additional GPIOs and increased analog functionality.

The BB5x family is now generally available from Silicon Labs and its distribution partners. To aid evaluation of the microcontroller family, Silicon Labs offers the BB50 8-bit MCU Explorer Kit.

BB5x series product page

Silicon Labs 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Cypress, a solid-state MEMs speaker from xMEMS Labs, replaces legacy push-air sound reproduction with ultrasonic amplitude modulation transduction. Using this principle, Cypress turns ultrasonic air pulses into rich, bass-heavy, high-fidelity sound. This tiny MEMS speaker offers a high-quality, high-resolution alternative to the moving-coil speakers found in true wireless stereo (TWS) earbuds with active noise cancelling.

As an air pulse generator, Cypress comprises a modulator and demodulator. The modulator generates an amplitude-modulated ultrasonic wave (carrier) that faithfully follows the amplitude of the intended audio signal. The demodulator synchronously demodulates the ultrasonic wave, transferring the acoustic energy down to the baseband. Thus, producing the intended audible sound as a result. With its superior resolution in the time domain, xMEMS claims the Cypress speaker can more accurately reproduce advanced sound formats, including high resolution and spatial audio.

Housed in a 6.3×6.5×1.65-mm package (9-mm diagonal), Cypress is 40 times louder at low frequencies compared to xMEMS’ previous-generation speakers. It provides stronger, deeper bass that is consistent with the best 10-mm to 12-mm legacy coil speakers, including sound pressure levels of greater than 140 dB at frequencies as low as 20 Hz.

Full-function Cypress prototype silicon is now sampling to select early customers. Production-candidate samples of Cypress and the companion Alta controller/amplifier ASIC will sample in June 2024. Mass production is planned for late 2024.

Cypress product page

xMEMS Labs 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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PCTEL announced an embedded antenna platform for integrated radio deployments, providing off-the-shelf Wi-Fi solutions to a broader set of customers. The portfolio comprises compact, low-profile designs that provide wide coverage patterns in the 2.4-GHz, 5-GHz, and 6-GHz frequency bands. The antennas are intended for portable and network devices used across different vertical markets.

One of the devices, the EMB-910004, is a dual-band dipole antenna for 2.4-GHz and 5-GHz Wi-Fi applications. It mounts on a plastic support or directly on a nonmetallic surface in the host product with plastic screws and nuts or heat stakes. The EMB-910004 comes with an attached 6-in. micro-coax cable with a U.FL-type connector.

Other devices in the lineup include: the EMB-910001, a horizontally polarized monopole antenna for 5-GHz Wi-Fi; the EMB-910002 triband inverted-F antenna for 2.4-GHz, 5-GHz, and 6-GHz Wi-Fi; and the EMB-910003, a triband monopole antenna for 2.4-GHz, 5-GHz, and 6-GHz Wi-Fi.

To learn more about PCTEL’s embedded antenna platform, click here.

PCTEL

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Omnivision’s OVMed OH0131 image signal processor (ISP) works with both reusable and disposable endoscopes connected to tablets or camera controllers. The OH0131 kernel employs image pre-processing algorithms supporting brightness, contrast, saturation, sharpness, hue, white balance, and gamma adjustment with advanced noise reduction.

The OH0131 ISP is compatible with all Omnivison medical image sensors with resolutions up to 2 Mpixels, including the OCHTA, OVM6946, OCHFA, OCHSA, and OCH2B imagers. It provides the company’s proprietary AntLinx CMOS chip-on-tip endoscopy imaging interface, as well as MIPI interfaces, for easy implementation.

The image signal processor serves as a kernel board for integration with any MIPI-input post-processing board. This combination of pre- and post-processing boards can be used to build custom handheld tablet consoles or camera control units.

“Our off-the-shelf OVMed OH0131 streamlines engineering for medical OEMs, enabling customers to get their products to market faster. The ability to purchase a medical-grade image sensor with wafer-level optics, cable, and ISP from one vendor also simplifies the supply chain,” said Richard Yang, senior staff marketing manager, Omnivison. “The OH0131 ISP is based on an ASIC system-on-chip for the highest image quality, reliability, and cost-effectiveness.”

The OVMed OH0131 63×51-mm board is available now. IEC 60601 EMC and EMI pre-scan testing of the ISP is planned.

OVMed OH0131 product page

Omnivision

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Looking at the damage done to a protected antenna over time.

A while back, we looked at how an antenna structure was provided with a protective, cylindrical enclosure.

Taking another look via Google Maps, we find an image of the protected antenna in Baldwin, NY when it looked like Figure 1.

Figure 1 Protected antenna found in Baldin, NY that is in working order.

I drove past this location on October 26th, and this protected antenna now looks like Figure 2.

Figure 2 The same protected antenna in Figure 1 that is now damaged.

The larger diameter section of the protective shroud has fallen off. The antenna elements themselves and their cabling are now in view.

Presumably, this will soon be repaired but the mishap does offer a brief (we hope) view of the goodies.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

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The post Protecting antennas: Part 2 appeared first on EDN.

Ultrasonic sensors have been a staple in the sensing space for several decades due to their capabilities, flexibility, and low cost. As the rise of IoT finds its way into virtually every market and industry, ultrasonic sensors have continued to find new applications in the areas of smart office, industrial and healthcare.

As a quick refresher, ultrasonic sensors function by sending out ultrasonic “chirps,” or sound waves, in the range of 23 kHz to 40 kHz, well above the human audible range of 20 kHz. These “ultrasonic” chirps bounce from nearby objects and return to the sensor. By measuring the amount of time that it takes for this send-and-receive process to occur, an object’s distance from the sensor can be calculated.

Figure 1 The above diagram shows the basic operating principle of an ultrasonic sensor. Source: CUI Devices

Ultrasonic sensors offer several benefits, including very accurate object detection. And, because they are based on sound waves and not electromagnetic waves, the color and/or transparency of an object being detected has no effect on the readings, also known as effect of material. This means that in addition to general object detection, they can also be used for liquid-level sensing or to detect glass.

Ultrasonic sensors also do not produce or require light to operate, making them well suited for applications in variable light conditions. With high refresh rates (hundreds of chirps per second), relatively small footprints and lower cost compared with other technologies, such as photoelectric, laser and inductive sensors, it becomes easy to see why ultrasonic sensors are so established.

With these basic principles and benefits in mind, we will now take a look at some ultrasonic sensor application examples in the smart office, industrial and healthcare markets.

Smart office applications

Driven by the need for safety, advancements in offerings and surging demand for sensor-based networks, Allied Market Research projects the smart-office market to reach $90 billion by 2030. Due to increased energy efficiency to support industry and local regulations, ultrasonic sensors are playing an expanded role in automating various processes around the office.

Figure 2 Ultrasonic sensors can be used for HVAC and lighting controls to turn heating and cooling equipment and lighting systems on and off using people detection. Source: Shutterstock

A prime example of this is HVAC and lighting control. Ultrasonic sensors have been employed to detect populated rooms in the office throughout the day. HVAC systems can be programmed, using this data, to heat or cool rooms that are in use or turn off the systems at night and kick back on upon first arrival.

In a similar way, ultrasonic sensors can control automatic motion lighting as people enter and leave certain rooms or areas of the office. While simple in nature, the energy savings of cutting back on HVAC and lighting in unoccupied office space offers significant cost savings when powering large office buildings. To sense objects across areas this large, an ultrasonic transceiver is ideal due to its detection range of up to 15 meters and wide beam angle of 80°.

A few other smart office applications worth mentioning are touchless building entry and hygiene devices. Ultrasonic sensors have long been utilized in automatic door entries as well as touchless hygiene products, such as soap dispensers, faucets, paper towel dispensers and waste bin lids. Due to the Covid-19 pandemic, these commonly recognized applications have seen ever-increasing demand as public health and safety became crucial for local businesses and offices.

Industrial IoT applications

Industry 4.0 and its demand for real-time analytics has led to surging growth in the industrial IoT (IIoT) market as companies look to target enhancements in manufacturing and automation. One of the main goals of utilizing IIoT is targeting inefficiencies and problems sooner to save time and money and to support business intelligence.

Edge devices, which transmit data between local networks and the cloud, are being further integrated into industrial settings for optimization of process and output. These include optimized quality control, sustainability, asset tracking, gaining efficiencies and predictive maintenance.

When it comes to ultrasonic sensors, they can be used in manufacturing processes for automated process control. By detecting an object passing through the line, an ultrasonic sensor could in turn trigger certain parts of the manufacturing process. High-speed counting and box sorting are other potential use cases for ultrasonic sensors due to their high refresh rates.

In these types of applications in which precision and a close range of detection are required, an ultrasonic transceiver with its close detectable range, aluminum housing and IP68 rating to deal with the often-harsher environmental conditions of industrial systems, is a good option.

While ultrasonic sensors are perhaps most often thought of for general object detection, as mentioned earlier, their ability to accurately detect translucent objects like water makes them well suited for liquid-level sensing applications. In this scenario, an ultrasonic sensor is mounted at the top of a chemical-holding tank to monitor fluid levels. As the ultrasonic sensor sends out its chirps, it can detect the liquid levels of the tank by measuring the amount of time it takes for the chirp to return.

As the liquid level decreases, the longer it takes for the chirp to return to the sensor, and vice versa, it gives an operator real-time data on tank fluid levels used for monitoring and reporting. Again, an ultrasonic sensor carrying an IP rating is an important consideration for this type of application.

IoT in healthcare applications

Medical IoT refers to technology that collects, analyzes, alerts, and saves medical information via many different platforms and devices, with an intention to streamline patient’s health and open more accessibility to doctors and other healthcare providers in the sharing and monitoring of a patient’s care. According to Market Research Future, the IoT healthcare market is projected to reach over $320 billion in the next five years.

Intra-office communication is highly important within a facility supplying medical procedures and patient monitoring. Ultrasonic sensors have been used in tandem with wearable communication devices to open communication lines when entering a room. This works on a similar principle as motion-activated lights, only in this case, the ultrasonic sensor detects motion and triggers the communication system.

Of course, when one hears the term “ultrasonic” in the medical field, it is easy to think of ultrasonic imaging via an ultrasound machine. Ultrasound machines create images by using both the echo time of the ultrasound wave and the Doppler shift of the reflected sound to determine the distance to the targeted internal organ and its movement.

While most ultrasonic sensors typically operate at frequencies between 23 and 40 kHz, this application benefits from high-frequency ultrasonic sensors that operate at 100 kHz and above. Although higher-frequency models have a shorter detectable range, they also have a smaller “blind zone,” or area closest to the ultrasonic sensor.

For example, CUI Devices’ CUSA-TR07-008-500-TH67 has a detection range as low as 3 cm, making it well matched for an ultrasound machine in which the device is extremely close to the object it is trying to detect.

Figure 3 Higher-frequency ultrasonic sensors have a shorter detectable range, making them suited for ultrasound machines. Source: Shutterstock

Final design considerations

When searching for ultrasonic sensors, they can be acquired as independent transmitters and receivers or as a combination of the two in a single unit, known as an ultrasonic transceiver. A designer will also need to decide between an analog or digital output as well as the beam angle.

Deciding on the appropriate beam angle will ultimately depend on the intended use of the end system. Wider beam angles are great for general object detection, where perhaps less precision is required, while narrow beam angles can avoid detecting false positives over longer distances. Other considerations include whether to select a more standard or high-frequency sensor and whether the intended operating environment might benefit from a sensor with an IP rating.

The diversity of applications for ultrasonic sensors can be attributed to their straightforward operating principle, reliability, and cost-effectiveness in a range of designs. As new markets continue to emerge in IoT, automation, robotics and more, ultrasonic sensors will remain a go-to solution when object detection and monitoring come into play.

Since joining CUI Devices in 2014, Rex Hallock has been a key member of the product management team. He has overseen various product lines over the years, including the expansion of CUI Devices’ thermal management group, which now features a range of DC fans, heat sinks, Peltier modules and thermal accessories.

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Back to basics: An introduction to ultrasonic sensors

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Pickering Electronics, a renowned leader in high-performance reed relays, has introduced its groundbreaking Series 219, marking the company’s foray into high-voltage surface mount reed relays. The announcement was made at Productronica, the premier trade fair for the electronics manufacturing industry.

Designed for versatility, the Series 219 surface mount reed relays come in various package types with identical sizes but differing pin positions. These relays boast the capability to switch up to an impressive 1000V, offering configurations in 1 Form A (SPST), 2 Form A (DPST), and 1 Form B (SPNC). The switch stand-off reaches up to 3000V, and switch-coil isolation achieves a remarkable 5000V stand-off.

The Series 219 is poised to excel in a multitude of high voltage applications, including but not limited to mixed signal semiconductor testers, medical equipment testing, electric vehicle (EV) charge point testing, and monitoring solar cell photovoltaic efficiency.

Within this innovative series, all contact configurations are available with three coil voltages: 3V, 5V, or 12V. The switch stand-off capabilities vary, reaching up to 1.5kV in the 2 Form A package, 2kV in 1 Form B, and 3kV in the 1 Form A package. Switch-coil isolation stands at an impressive 5kV stand-off in 1 Form A and 1 Form B types. The relays support switching up to 0.7A and 10W, and their operational temperature range spans from -40°C to +105°C.

A notable feature of the Series 219 is the inclusion of a diode option in all part numbers. Suppression diodes are strategically placed within the relay to safeguard the device driving the relay coil against back electromotive force (emf), which can occur when the current flow to the coil is interrupted. This preventative measure ensures the protection of other components on a PCB board, such as the coil drive.

Robert King, Product Development Manager at Pickering Electronics, emphasized the uniqueness of the Series 219, stating, “Only Pickering makes surface mount high voltage relays with 2 Form A and 1 Form B packages.” The 2 Form A configuration optimizes board space by providing two switches in the same footprint, while the 1 Form B option offers a normally closed relay, a feature not readily available elsewhere in the market.

True to Pickering’s commitment to customer satisfaction, the Series 219 Reed Relay is available with various standard build options to tailor it to specific applications. Additionally, for requirements beyond standard offerings, the company provides a customized reed relay service to meet users’ specific needs.

Continuing the tradition of excellence seen in other Pickering relays, the new 219 Series high voltage reed relays employ top-tier instrument-grade switches with appropriate switch blade coatings to meet the demands of diverse currents and voltages. Another noteworthy innovation is the incorporation of SoftCenter technology, minimizing internal stresses on the reed switch, thereby extending its life and ensuring contact resistance stability. The use of magnetic Mu-Metal shielding and electrostatic screening further enhances reliability by preventing faulty operation.

The post Pickering Electronics Unveils Series 219: High Voltage SMD Reed Relays for Enhanced Performance appeared first on ELE Times.