Новини світу мікро- та наноелектроніки

Free (and Open Source!) Electronics Part Inventory Software

Reddit:Electronics - Втр, 03/12/2024 - 18:14

Hi everyone,

I recently published the first version of an open source project I've been working on. It's an electronics part inventory software - completely free and open source (https://github.com/PartPilotLab/PartPilot). I've originally made it for my brother, as he was f*cked up with ordering parts he already had or noticing that he actually doesn't have the part while assembling the project. All existing solutions were either expensive or shit. So I made an alternative. It has pretty much all the most important features and directly integrates with LCSC (but still lacks a bit).
Would love to get some feedback and maybe some of you would be willing to contribute :) Leaving a star would also mean a lot ✨
Lenni

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onsemi realigns business groups to expand product portfolio and accelerate growth

Semiconductor today - Втр, 03/12/2024 - 17:22
Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA has formed an Analog and Mixed-Signal Group (AMG) that will be led by newly appointed group president Sudhir Gopalswamy. The group will be focused on expanding onsemi’s portfolio of power management and sensor interface devices to unlock an additional $19.3bn total addressable market and accelerate the firm’s growth in the automotive, industrial and cloud-end markets...

Brought back old VHS camera using USB C

Reddit:Electronics - Втр, 03/12/2024 - 16:19
Brought back old VHS camera using USB C

It looks a bit like a pipe bomb But there is a purple trigger board taking 12V from the power bank, and a step-down converter turning it into 7V for the camera. I also had to add a capacitor because while opening the cassette bay, the camera was turning off. It looks really bad, but I'm out of home, next week I will 3d print a case for all the electronics.

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Charge pump halves voltage to double current “efficiency”

EDN Network - Втр, 03/12/2024 - 13:50

Capacitor type charge pumps are a well-known, simple, efficient, cost-effective (and therefore popular!) method for inverting and multiplying voltage supply rails. Perhaps less well known, however, is that they also work just as well for dividing voltage (while multiplying current). Figure 1 illustrates a Vout = Vin/2, Iout = Iin*2 example pump built around the venerable xx4053 CMOS triple SPDT switch.

Figure 1 xx4053 based, 100kHz, voltage-halving, current-doubling charge pump.

Here’s how it works.

Wow the engineering world with your unique design: Design Ideas Submission Guide

The R1C1 time constant couples the Vin/ppv square wave found at U1pin14 to U1pin9, creating an Fpump oscillator frequency of (approximately):

Fpump = 1 / (2 * 100k * 68 pF * loge(2)) = 100 kHz

During the Fpump negative half-cycle (U1pin4 = 0), the upper (U1pin14) end of C2 is connected to Vin while the lower end (U1pin15) end is connected to Vout, thus charging C2 to:

Vc2-= Vin – Vout

 Then, during the following Fpump positive half-cycle (U1pin4 = Vin), the upper end of C2 connects to Vin while the lower end connects to Vout, and:

Vc2 = Vout

 This deposits a quantity of charge onto C3 of:

Q+ = C2((Vin – Vout) – Vout) = C2(Vin – 2Vout)

 During the subsequent negative half-cycle, again:

Vc2 = Vin – Vout

Depositing another charge onto C3 of:

Q- = C2 ((Vin – Vout) – Vout) = C2(Vin – 2Vout)

Thus, each full cycle of Fpump deposits a net charge onto C3 of:

Q = Q+ + Q- = 2 * C2(Vin – 2Vout)

 Which, if Iout = 0, forces Q = 0 and therefore:

Vin – 2Vout = 0

Vout = Vin / 2

 However, for the (much more interesting) case of Iout > 0:

Q = Iout / 100 kHz

2 * C2(Vin – 2Vout) = Iout / 100 kHz

Vin – 2Vout = Iout / 100 kHz / 2 / C2

Vout = (Vin – (Iout / 100 kHz / 2 / C2)) / 2

In other words, Vout droops a bit as the output is loaded. This is because, for a finite C2 Q is also finite, but also to the fact that the U1a and U1b internal switches have non-zero ON resistances.

The combined effect on Vout versus Iout amounts to an effective impedance of 150 Ω for Vin = 5 V and is plotted in Figure 2, along with current multiplication “efficiency”. Note that the latter soars past unity due to the fact that only half of the dollops of C2 charge (the Q+) are drawn from the Vin rail, while the Q- are supplied from residual voltage on C2, causing zero additional drain from the rail.

Figure 2 Current multiplying charge-pump Vout and Iout/In current “efficiency” for Vin = 5 V.

So, what is it good for?

Figure 3 suggests one useful application, generating nominally symmetrical +/-Vin/2 bipolar rails from a single positive source with minimal current draw from the source.

Figure 3 Current doubling charge pump plus voltage inverter makes an efficient bipolar rail splitter.

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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Infineon launches CoolSiC MOSFETs 2000V product family

Semiconductor today - Втр, 03/12/2024 - 13:39
Infineon Technologies AG of Munich, Germany has launched the CoolSiC MOSFETs 2000V in the TO-247PLUS-4-HCC package to meet designers’ demand for increased power density without compromising the system's reliability even under demanding high-voltage and switching frequency conditions. The CoolSiC MOSFETs offer a higher DC link voltage so that the power can be increased without increasing the current. It is claimed to be the first discrete silicon carbide device with a breakdown voltage of 2000V on the market and comes in a TO-247PLUS-4-HCC package with a creepage distance of 14mm and clearance distance of 5.4mm. With low switching losses, the devices are suitable for solar (e.g. string inverters) as well as energy storage systems and electric vehicle charging applications...

Singaporean chiplet specialist plans new fabrication site in Italy

EDN Network - Втр, 03/12/2024 - 13:16

Silicon Box, an advanced packaging upstart focused on chiplets, is moving to Italy after setting up a $2 billion packaging facility in Singapore in July 2023. The chiplet specialist has announced to set up another manufacturing facility in Northern Italy to cater to Europe’s existing and planned wafer fabrication clusters in France, Germany, and Italy.

While fabs like TSMC and Samsung Foundry as well as OSATs such as Amkor and ASE Technology are eying opportunities in chiplets business amid their expertise in advanced packaging technologies, what makes Silicon Box prominent is its sole focus on chiplet fabrication and packaging.

For a start, Silicon Box claims to bring effective chiplet integration capabilities through its Singapore site. It’s important to note that while the Singapore-based firm specializes in advanced packaging technologies like other OSATs, it uses panel packaging instead of standard wafer approach. The panel-level production leads to higher yield and is tailored for chiplet interconnects.

In other words, Silicon Box’s advanced packaging capabilities are not limited to chiplet integration; the company employs advanced interconnection through proprietary, large-format manufacturing. So, its standardized packaging process facilitates the shortest chiplet-to-chiplet interconnection with better thermal and electrical performance.

The new chiplet production facility in Italy plans to replicate Silicon Box’s foundry in Singapore.

Silicon Box’s next hop to Italy shows that the upstart founded by Marvell co-founders in 2021 is confident in the growing demand for chiplets and their manufacturing capacity. The firm plans to invest $3.6 billion in this new chiplet manufacturing facility in Northern Italy while creating approximately 1,600 semiconductor jobs.

Moreover, a close collaboration with European fabs will boost resilience and cost efficiency for the brand-new chiplet supply chain. A new chiplet packaging facility in Europe also bodes well for the ecosystem that is still in its infancy and needs more focused efforts to make chiplet production viable.

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EPC issues Phase-16 Reliability Report

Semiconductor today - Втр, 03/12/2024 - 11:32
Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has issued its Phase-16 Reliability Report, documenting continued work using test-to-fail methodology and adding specific guidelines for overvoltage specifications and improving thermo-mechanical reliability...

Mi first pcb design works!

Reddit:Electronics - Втр, 03/12/2024 - 10:13
Mi first pcb design works!

Pretty much the title. Is a vfd display module, now is the turn for the microcontroller board. Hope you could enjoy!

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element14 now stocking Traco Power’s compact 5–50 Watt encapsulated TMPW Series

ELE Times - Втр, 03/12/2024 - 09:12

Electronics and industrial design engineers can benefit from these ultra-compact AC/DC power supplies, available in PCB and chassis mount packages, for demanding building automation, industrial, and IT applications.

element14 is now stocking the TMPW Series of ultra-compact AC/DC power supplies from Traco Power.

The 5-50 Watt encapsulated power supplies are available in both PCB and chassis mount packages. The chassis mount models come with screw terminals or optional JST connectors and have an extended input range of 90 – 305 VAC, making them ideal for use in a wide range of industrial and household/building applications.

Other features of the TMPW series include an I/O-isolation voltage of 4000 VAC, operating temperature range of –40°C to +70°C, and Class II safety approvals. Additionally, an internal EN 55032 Class B filter saves valuable space for an otherwise often mandatory external filter. The series is also ERP ready, which means that it has an energy-efficient design, with less than 0.1 Watt standby power consumption, and satisfies tomorrow’s requirements for compact green power applications around the globe.

element14 Product Segment Leader for Traco Power, Steve Hallgate, said, “The TMPW Series of AC/DC power supplies from Traco Power is an excellent addition to element14’s power portfolio. With their compact size, extended input range, and energy-efficient design, these power supplies are sure to be a hit with engineers and designers alike.”

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Navitas unveils plans for 8–10kW power platform supporting 2025 AI power requirements

Semiconductor today - Пн, 03/11/2024 - 23:13
Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has announced its artificial intelligence (AI) data center technology roadmap for to up to 3x power increase to support similar exponential growth in AI power demands expected in just the next 12–18 months...

Quarterly smartphone production jumps 12.1% in Q4/2023

Semiconductor today - Пн, 03/11/2024 - 15:57
Third-quarter 2023 saw a significant rebound in global smartphone production, marking the end of an eight-quarter slump, according to market research firm TrendForce. In a strategic year-end surge, brands amped up production to capture more market share, propelling fourth-quarter smartphone output up 12.1% to 337 million units. Despite this final-quarter growth, 2023 rounded off with a slight 2.1% dip in annual production — totaling 1.166 billion units...

The TiVo RA2400 Stream 4K: A decent idea, plagued by usage delay

EDN Network - Пн, 03/11/2024 - 15:31

I’ve torn down a lot of streaming multimedia receiver devices over the years, most recently both HD (1080p) and 4K variants of Google’s Chromecast with Google TV. The list of victims also includes a bunch of Rokus in both “box” and “stick” form factors, Amazon’s Fire TV Stick, and an Apple TV (plus a few others with proprietary operating systems, including Google’s own prior-generation Chromecasts). But until today, I’m pretty sure I’ve only taken apart one other “pure” Android TV-based player, that one being the grandfather of them all, Google’s Nexus Player.

What do I mean by “pure”? Consider, for example, that Amazon’s Fire TV devices run (at least for the moment) the Android-derived Fire OS. Google TV, similarly, has an Android TV foundation, on top of which the company has (simplistically speaking) notably revamped the user interface and feature set, innately integrating (for example) Google Home facilities for smart home control purposes, along with making Live TV support front-and-center. But the Nexus Player’s Android TV UI obviously hearkened back to its Android roots; in fact, it originally ran Android 5. And the UI of today’s teardown victim, TiVo’s RA2400 Stream 4K (which, going forward I’ll refer to as “RA2400” for short)  is similarly Android TV-ish in its characteristics.

Why do Android TV-based products like the RA2400 still exist, if Google TV is supposedly a superior successor? Some of the answer, I suspect, has to do with longevity; Android TV has been around for a few months shy of a decade now, whereas the first Google TV-based Chromecast only started shipping in late 2020. And some of it, I also suspect, has to do with higher licensing fees that Google may charge for Google TV versus Android TV, as well as a more restrictive list of licensees. Whatever the reason(s), plenty of Android TV-based devices are still available for sale, which isn’t necessarily a good thing from a consumer standpoint.

Why? Android’s maturity and ubiquity, along with its open-source foundation, make it straightforward to develop apps that run on top of the O/S. This software might unfortunately also include malware and other undesirable code, enabled by unpatched vulnerabilities in out-of-date software stacks (if, say, the manufacturer goes out of business or maybe just decides to redirect its support attention to more lucrative newer products). At minimum, that no-name Android TV box you bought on eBay or elsewhere might be doing bitcoin mining on the side, piggybacking on your network connection and sucking up your electricity in the process. More critically, it might directly act as an attack vector for infecting other devices on your LAN and/or, by opening firewall holes via UPnP or other more malicious means, expose the entire LAN to WAN-based attacks, too.

That’s why, if you’re going to bring an Android TV-based device into your residence, it’s best to go with a “brand name” supplier like, say…well, TiVo, for example. I was admittedly surprised to find out in researching the RA2400 that it’s still available for sale, given that it was introduced in May 2020. Four years is forever in the consumer electronics industry, particularly for a product whose initial reviews called out its sluggish performance. Applications generally get more resource-intensive over time, not less, which would tend to increasingly hamper performance over time. But for whatever reason, the RA2400 is still alive and kicking; its advanced-at-the-time 4K resolution support doesn’t hurt.

My unit was a seller-refurbished device sold by VIP Outlet on eBay, which I bought two years (and a few weeks) ago promotion-priced at $21.25 plus tax ($25 minus 15%) solely with a future teardown in mind. That might sound like a good deal, and in fact it is in at least some sense, given that the RA2400 originally was priced at $50. Then again, however, as I wrote these words, new units were selling for $24.99 at both Amazon and Best Buy (in both cases marked down from the usual $39.99, which is what it’s selling for on TiVo’s website right now).

It obviously took a while for the RA2400 to rise to the top of my teardown pile! And in finally cracking open the box a few weeks ago, I found several surprising omissions (hold that thought). The packaging on my refurb, as you can see, was quite spartan.

I’ll save you five more photos’ worth of plain white box panels, instead focusing on the sticker affixed to one side:

Opening the box lid provides our first look at our “patient”:

Underneath, in a bubble wrap baggie, are a male-to-male HDMI-to-mini HDMI cable (which doesn’t seem to come with new units, or to serve a useful purpose for that matter, so I’m guessing this was a VIP Outlet mix-up) and a USB-A to micro-USB power cable (but no wall wart, although it looks from the documentation that one comes with new units, so this was apparently just another “seller refurbished” miss).

And speaking of omissions, can you tell yet what else isn’t in the box that should be? For a clue, take another look at that online documentation, either in HTML or (if you prefer) PDF format. Now take a look at the “stock” photo I showed you earlier. See the remote control there? See it here? No? Exactly. Sigh.

Onward. Freed from its cardboard and clear-plastic constraints, the RA2400 (with dimensions of 77 x 53 x 16 mm) comes into full view, as-usual accompanied by a 0.75″ (19.1 mm) diameter U.S. penny for size comparison purposes:

On one end is the aforementioned micro-USB power input:

Coming out the other end is the beefy HDMI jack:

Along one side, and admittedly only barely visible in this shot, is a small button which, when held down for a few seconds, enables manual pairing with the remote control (assuming one exists…did I mention that mine was missing its remote control?), and when pressed a bit longer, initiates a factory reset:

(Full disclosure: I’m being a bit harsh about the missing remote control and wall wart, because I never intended to actually use the RA2400, only to take it apart. Frankly, considering all my fancy-pants video gear, the HDMI to mini-HDMI cable I got in exchange was a net sum gain. On the other hand, if I was a normal consumer hoping to use the RA2400, I’d be pretty bummed…)

And along the other side is another interesting advanced feature (for a 2020-era product, at least), a USB-C connection (with USB 2.0-only bandwidth, by the way):

This is not, TiVo’s documentation makes clear, an alternative power input path, nor is it an alternative video output option. It is, instead, a means of hardware-expanding (along with associated software support, dependent in some cases on third-party Android TV drivers and the like) the RA2400 to handle, for example, a wired Ethernet adapter, a game controller, a keyboard or mouse, a storage device, or multiples of these via a USB-C hub intermediary.

Last but not least, here’s a top view:

And a bottom view:

With a closeup of the label revealing, among other things the FCC ID (2AOVU-IPA1104HDW):

Before diving in, one more thing. The penny in the prior photos obscured, I suspect, just how funky the RA2400’s enclosure is. Check out the unique asymmetry!

Oh well. I was impressed. You all probably just want me to get to the getting-inside.

Peeling off the label from the bottom:

unfortunately didn’t expose any convenient screw heads to view:

but it did draw my attention to something I’d previously overlooked; the thin seam running along the underside periphery:

Betcha know what comes next, yes?

Bingo!

The PCB now also pops right out of the other half of the case:

I’m quite certain you’ve already noticed the Faraday cages on both sides of the PCB. And anyone who’s read one of my teardowns before definitely knows what comes next. Let’s flip the PCB back over to its backside first (as I’ve mentioned before, since these things are designed to dangle from the back of a TV there really is no consistent “top” or “bottom”, but my convention is that “top” is associated with the TiVo logo impression side of the now-removed case, with “bottom” in proximity to the now-removed label side of the now-removed case…phew):

Note how pristine both the cage and PCB still are. Are you proud of my atypical disassembly-force restraint and deft technique?

The shiny IC in the right section, labeled AP6398S, is a SIP module implementing both Bluetooth and Wi-Fi functions, based on Broadcom’s BCM43598. I suspect that at least some of you have already noticed the PCB-embedded antennae in the upper right and lower right-and-left quadrants of the PCB, yes? And in the sorta-center section are, at top, Amlogic’s S905Y2 application processor (can I just say for the record that rarely do I see a system’s “guts” documented so thoroughly in a consumer-intended product page? Here’s even more detail), comprised of, among other things, a quad-core 1.8 GHz Arm Cortex-A53 CPU core and an Arm Mali-G31 MP2 GPU core, and below it, a Nanya NT5AD512M16A4 1 GByte DDR4-2666 SDRAM.

Flip the PCB back over, deftly pop the top off its Faraday Cage too:

and we can inventory the remainder of the notable (IMHO, at least) bill of materials:

Along the left side are the USB-C connector and, below it, a 37.4 (MHz, I’m assuming) crystal oscillator. Along the right is the pairing-and-reset switch. And in the middle are a very faintly marked Samsung KLM8G1GETF-B041 8GByte eMMC flash memory module and, below it, another Nanya NT5AD512M16A4 1 GByte DDR4-2666 SDRAM.

To get a better look at the sides-located components, as well as to gain another perspective on that shiny “box” at the top of both sides of the PCB, out of which the HDMI cable juts, I’ll share some side views now. PCB top-up first:

Now bottom-up:

Those metal blobs on the sides of the “box” are not, I’m pretty confident, solder; those are welding remnants. The reinforcement necessity is understandable when you consider, reiterating what I mentioned earlier, that “these things are designed to dangle from the back of a TV” (not to mention that they’re likely predominantly disconnected from the TV by grabbing the main body and yanking). I was pretty sure there was nothing underneath but solder joints (with the “box” intended to mute high-frequency signal emissions). I even got a chuckle when I checked out the FCC certification report’s internal photo set and noticed they didn’t bother trying to tackle breaking apart the welds, either. However, I still got the tops pried away enough to peek underneath:

See what I told you? Solder. Along with strong adhesive, of course. Fini! Let me know about anything else that caught your eye in the comments.

Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

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OIF hosting multi-vendor interoperability demos and expert panels at OFC

Semiconductor today - Пн, 03/11/2024 - 14:36
The Optical Internetworking Forum (OIF) says that its record-breaking, multi-vendor interoperability demonstrations at the Optical Fiber Communication Conference & Exposition (OFC 2024) in San Diego, CA, USA (24–28 March) will spotlight interoperable solutions in 800ZR, 400ZR and OpenZR+ optics; Energy Efficient Interfaces (EEI) & Co-Packaging; 112G and 224G Common Electrical I/O (CEI); and Common Management Interface Specification (CMIS) implementations...

Panasonic Industry collaborates with multi-utility Hera Group to expand innovative NexMeter technology

ELE Times - Пн, 03/11/2024 - 13:47

The strengthened collaboration between Hera Group and Panasonic Industry aims to improve safety and sustainability with NexMeter technology for Italian and European utilities.

The Italian-based Hera Group and Panasonic Industry Europe announce the renewal of our longstanding collaboration. This entails a new commercial agreement designed to extend the reach of the innovative NexMeter meter within the Italian gas distribution market. The NexMeter, initially launched in 2019 as a smart gas meter 4.0, has evolved over time, incorporating advanced safety features and, since 2021, utilizing recycled plastic components.

Boasting compatibility with green gas mixtures like hydrogen and biomethane, NexMeter has already garnered interest from several utilities, with potential future partnerships on the horizon. The collaboration with Hera and Panasonic Industry aims to enhance NexMeter’s capabilities, surpassing national standards and offering Italian operators a meter that not only prioritizes safety and sustainability but also enhances efficiency, reduces costs, and contributes to the decarbonization goals of the sector.

“We are thrilled to embark on this transformative journey with one of the largest Italian multiutilities in Italy,” said Johannes Spatz, President of Panasonic Industry Europe. “This partnership represents not only a collaboration to provide our Japanese-developed know-how and technology, enhancing safety in gas installations across Italy and Europe, but also marks a significant step in our commitment to innovation. The agreement with Hera Group opens new avenues for introducing NexMeter to other utility providers, revolutionizing gas distribution infrastructure with advanced metering technology. For the Panasonic Industry, this collaboration is the beginning of new developments, extending NexMeter’s performance to new functionalities, aiming to be a technological reference for the future’s second generation of smart gas meters. Our strong ambition is to position ourselves as a key partner in the Italian and European markets, providing cutting-edge solutions for gas distribution and integrating advanced technology with an IoT software platform for continuous field monitoring. This partnership with Hera Group also offers the prospect of joint initiatives and projects, aligning with our shared objectives in environmental sustainability, carbon dioxide emissions reduction, and the principles of the circular economy, all integral components of Panasonic’s GREEN IMPACT plan.”

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Light + Building 2024: Fulminant innovation show provides a stage for sustainability and efficiency in buildings

ELE Times - Пн, 03/11/2024 - 11:04

Frankfurt am Main, 08 March 2024. The modern building is intelligent, connected and as a result saves energy. In combination with alternative energy sources and efficient lighting solutions, emissions in the building sector can be drastically reduced. This makes a significant contribution to achieving climate targets. 2,169 exhibitors presented the latest developments in building technology and trends in innovative lighting design at Light + Building in Frankfurt am Main from 3 to 8 March 2024. Over 151,000 visitors travelled to the world’s leading trade fair for lighting and building-services technology.

“The atmosphere at the exhibitors’ booths, in the halls and throughout the exhibition grounds was simply fantastic. We are extremely pleased that so many exhibitors and visitors, as well as our long-standing partners, have continued the success story of the world’s leading trade fair for lighting and building-services technology in 2024,” summarises Wolfgang Marzin, President and Chief Executive Officer of Messe Frankfurt. He adds: “With the switch to renewable energy sources, greater efficiency and sustainability in buildings, the industry has key goals on its agenda. That’s why they used the platform intensively, especially in the first few days, to present and discover innovations and drive forward key topics. After all, if we want to achieve the climate protection goals, the building sector is an essential milestone. It is unfortunate that the rail and air transport strikes have already affected Messe Frankfurt’s third leading international event since the beginning of the year.”

Buildings of tomorrow and inspiring lighting solutions

Key topics are the electrification and digitalisation of homes and buildings in order to reduce emissions and reuse raw materials. At Light + Building, the industry presented the digital and electrotechnical infrastructure for this and, on this basis, showcased solutions for dynamic power control, energy storage systems and applications for connected security. One growing area is the range of e-mobility and charging infrastructure as well as innovations and products for decentralised energy supply systems and components.

Light plays an important role in the architecture of tomorrow. At Light + Building 2024, 65 per cent of exhibitors belonged to this sector. They presented high-quality lighting solutions for indoor and outdoor areas as well as dynamic room concepts. Modern LED installations ensure contemporary efficiency and either blend harmoniously into the architecture or emphasise the design elements. Lighting is to provide maximum visual comfort in all living and working environments. Thanks to the materials used, Acoustic Lighting combines a pleasant lighting atmosphere with sound-absorbing functions. Sustainability plays an essential role in both the materials used and the manufacturing processes. Many manufacturers design luminaires in a way that the raw materials used can be recycled at the end of their useful life.

Light + Building 2024 in figures

The high-quality, extensive and international portfolio of lighting and building-services technology impressed the visitors. 95 per cent of them were extremely satisfied with what was on display and stated that they had achieved 93 per cent of their trade fair attendance targets. The most came to the innovation meeting point from Germany, China, Italy, the Netherlands, France, Switzerland, Belgium, Austria, the UK, Spain and Poland. They came from a total of 146 countries – including, for example, India, the USA, the United Arab Emirates, Australia, Brazil and Singapore. The degree of internationality was thus 51 per cent. The level of internationality among the 2,169 exhibitors was also high at 76 per cent.

Meeting place for the social media community

The social media community also found its home at Light + Building. On 3 and 4 March, the leading content creators in the lighting and building-services technology sector gathered for the Power Creator Days. In addition to live podcasts, expert talks and case studies, visitors had the chance to pedal for a good cause and work together towards a high energy target. A total of 1,510 minutes were cycled on the six fitness bikes. The sponsors will convert the result into a cash donation for the Leberecht Foundation, which Messe Frankfurt will double. The exact amount will be announced on social media further to Light + Building.

The next Light + Building will take place from 8 to 13 March 2026 in Frankfurt am Main.

www.light-building.messefrankfurt.com

Voices from the industry Alexander Neuhäuser, General Manager ZVEH (Central Association of the German Electrical and Information Technology Trades)

“Light + Building demonstrates how sector coupling can succeed through the necessary connectivity. The electrical trades integrate photovoltaics, storage, electromobility and heat pumps. They show how the energy industry requirements for controllable consumption devices (SteuVE) can be met and thus take account of the current transformation process. The good atmosphere at this year’s Light + Building 2024 was also noticeable at the joint stand of the electrical trades, which was very busy on all days of the event. The traditional partners’ evening was also a complete success, bringing together the partners of the electrical trades and the industry leaders. We were particularly pleased that so many young people once again took the opportunity to visit the E-House and the workshop street and gain an impression of what is feasible with smart and intelligently connected building automation.”

Wolfgang Weber, CEO, ZVEI (Electro and Digital Industry Association):

In the context of climate goals and the economic situation of urgently creating more affordable living space in Germany, technologies are increasingly coming into focus. The exhibiting companies at Light + Building have impressively demonstrated how easily well-designed climate protection can even lead to greater economic efficiency in the operation of houses, buildings and entire neighbourhoods. This requires the right solutions, especially from the electrical and digital industry, such as heat pumps, controllable lighting, charging points and an energy management system. This is relevant – not just in Germany and Europe, but worldwide. Light + Building is the right place to present innovative, climate-friendly technologies and solutions and to engage in dialogue with trade visitors from Germany and abroad.”

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Marvell’s Nagarajan to receive Optica’s 2024 David Richardson Medal

Semiconductor today - Пн, 03/11/2024 - 10:57
Optica (formerly the Optical Society of America, OSA) says that Dr Radhakrishnan Nagarajan has been selected as the 2024 recipient of the David Richardson Medal. Nagarajan is honored for the successful manufacturing and commercialization of indium phosphide (InP)- and silicon (Si)-based photonic integrated circuits for use as optical interconnects with a wide range of applications. Described as an insightful engineer and outstanding innovator and mentor, Nagarajan’s ability to move from concept to commercialization and deployment continues to have a profound impact on our industry, says Optica...

Tokyo Institute of Technology’s Kenichi Iga awarded Optica’s Frederic Ives Medal/Jarus W. Quinn Prize

Semiconductor today - Пн, 03/11/2024 - 10:45
Optica (formerly the Optical Society of America, OSA) has named Kenichi Iga, Professor Emeritus and former president of Tokyo Institute of Technology, as recipient of the 2024 Frederic Ives Medal/Jarus W. Quinn Prize for his “pioneering contributions and visionary leadership in the field of semiconductor lasers and optoelectronics and a dedication to training and educating future generations”...

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