Новини світу мікро- та наноелектроніки

Led by Dr Andreas Fiedler at Germany’s Leibniz-Institut für Kristallzüchtung im Forschungsverbund Berlin e.V. (IKZ), the ‘All-GO-HEMT’ project aims to develop modulation-doped β-(AlxGa1-x)2O3/Ga2O3 heterostructures that exhibit high electron mobility. With total project funding of almost €2m, financed by the German Federal Ministry of Education and Research (BMBF), this project is expected to lead to a considerable increase in efficiency in power electronics and thus make a significant contribution to sustainable energy generation...

ams OSRAM GmbH of Premstätten, Austria and Munich, Germany has unveiled its new OSLON UV 3535. Serving the growing demand for mercury-free and efficient UV-C disinfection and treatment solutions, the UV-C LED offers 115mW output power from a single chip at 265nm, which is the emission wavelength providing the highest germicidal effectiveness. Combined with what is claimed to be outstanding wall-plug efficiency (WPE) of 5.3%, the optimized system solution has been specifically designed for the UV-C disinfection market...

Alarm that counts using a 7-segment display. Added the ability to use a single scr to latch and power an led with a battery, since the most important element is to have a way to know whether someone is inside waiting to do you harm. A single led accomplishes this. Here's the pcb, and Photoshop even gives me the ability to label it. I simple head over to my local library, and have them print this onto this special paper with their laser printer, and then iron & etch it. https://i.redd.it/16nes7xdttwd1.gif submitted by /u/The_Mr_Nemo15 [link] [comments]

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Microchip’s RTG4 FPGAs with lead-free flip-chip bumps have achieved QML Class V qualification, the highest level for space components. This status, designated by the Defense Logistics Agency, ensures exceptional reliability and longevity for critical space missions. QML Class V-qualified products also help customers streamline their design and certification processes.

According to Microchip, the RTG4 radiation-tolerant FPGA with lead-free flip-chip bumps is the first of its kind to gain QML Class V status. Flip-chip bumps are used to connect the silicon die and the package substrate, while the lead-free material extends the longevity of the product. The flip-chip bump is contained within the FPGA package, so converting to these new RTG4 FPGAs has no impact on the user’s design, reflow profile, thermal management, or board assembly process.

With a flash-based fabric, RTG4 FPGAs deliver high density and performance for space applications, consuming significantly less power than equivalent SRAM-based FPGAs. They also exhibit zero configuration upsets in radiation environments, eliminating the need for mitigation measures.

The RTG4 FPGAs are supported by development kits, mechanical samples, and daisy chain packages for board validation and testing. To learn more, click the product page link below.

RTG4 series product page

Microchip Technology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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With a 2000-V breakdown voltage, Infineon’s IDYH80G200C5A CoolSiC Schottky diode suits systems with DC link voltages up to 1500 V. The Gen 5 silicon carbide (SiC) diode offers current ratings from 10 A to 80 A, making it well-suited for solar and EV charging applications.

The diode comes in a TO-247PLUS-4-HCC package with 14-mm creepage and 5.4-mm clearance, supporting up to 80A. This enables developers to reach higher power levels with half the component count compared to 1200-V solutions. The reduced component count simplifies the overall design and eases the transition from multilevel to two-level topologies.

Infineon’s .XT interconnection technology enhances the Schottky diode’s resistance to humidity, extending system lifetime. According to the company, it also significantly reduces thermal resistance and impedance, improving heat management.

The IDYH80G200C5 CoolSic Schottky diode is available now.

IDYH80G200C5 product page

Infineon Technologies 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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The RX260 and RX261 groups of 32-bit MCUs from Renesas feature a capacitive touch sensing unit with high noise immunity and water resistance. These 64-MHz microcontrollers consume 69 µA/MHz when active, dropping to 1 µA in standby mode. With their low-power operation and touch capabilities, the RX260/RX261 MCUs are well-suited for home appliances, building and factory automation, e-bikes, and smart locks.

Based on an RXv3 CPU core, the devices achieve a CoreMark score of 355 at 64 MHz, up to 2.5 times higher than comparable 64-MHz MCUs. Renesas also reports 25% lower active current and 87% lower standby current than similar MCUs, enabling customers to meet strict energy regulations for home appliances and extend the operating time of battery-powered equipment.

The capacitive touch IP (CTSU2SL), included as an HMI function, offers multi-frequency scanning to reduce false detection due to external noise and an automatic judgement function to detect touch events without CPU activation. QE for Capacitive Touch V4.0.0, a development assistance tool, simplifies the initial settings of the touch user interface and sensitivity tuning.

In addition, RX261 microcontrollers feature RSIP-E11A security IP with built-in AES, ECC, and SHA encryption engines and security management features. They also add full-speed USB and CAN FD interfaces.

Both the RX260 and RX261 groups of MCUs are available now from Renesas and authorized distributors.

RX260 product page 

RX261 product page 

Renesas Electronics 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Vishay’s 299 PHL-4TSI series of snap-in aluminum electrolytic capacitors includes a diverse selection of 350-V, 500-V, 550-V, and 600-V devices. Recent additions significantly broaden the capacitance-voltage combinations available to designers, with a rated capacitance range of 270 µF to 3300 µF.

The 299 PHL-4TSI devices are polarized aluminum electrolytic capacitors with a non-solid electrolyte, suitable for smoothing, filtering, and energy storage in applications such as power supplies and renewable energy converters. Their 4-terminal configuration enhances mechanical stability and ensures keyed polarity. Cylindrical case sizes range from 35×50 mm to 45×100 mm.

The snap-in capacitors feature ripple current ratings ranging from 1.9 A to 7.6 A and operate over a temperature range of -40°C to +105°C. They also provide a useful life of over 5000 hours at +105°C, enhancing end-product longevity.

Samples are available in small quantities from catalog houses. All 299 PHL-4TSI values are currently available in production quantities, with lead times of 18 weeks.

299 PHL-4TSI product page 

Vishay Intertechnology 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Several series of AC/DC controllers from Nexperia provide lower standby current and higher conversion efficiency for flyback converters. The NEX806xx and NEX808xx are quasi-resonant/multi-mode flyback controllers that operate over a VCC range of 10 V to 83V, while the NEX81801 and NEX81802 are adaptive synchronous rectifier (SR) controllers. These components are suited for applications like power delivery (PD) chargers, adapters, industrial and auxiliary power supplies, wall sockets, and strip sockets.

The ICs work with Nexperia’s NEX52xxx PD controllers and other discrete power devices to create a turnkey flyback converter solution. This setup optimizes current sense voltage levels and PFM mode, reduces standby power, and ensures high efficiency across all load ranges.

The primary side controller directly drives either a silicon MOSFET or a GaN HEMT. Additionally, the SR controller employs an adaptive control method to prevent mis-conduction in switching devices, improving overall system reliability.

All of the devices are available in TSOT23-6 packages with low thermal resistance. To learn more about Nexperia’s AC/DC controller ICs, click here.

Nexperia

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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Germany-based ZF Friedrichshafen AG (one of the world’s largest suppliers to the automotive industry) intends to withdraw from the projected $3bn silicon carbide (SiC) device fabrication plant and R&D center in Ensdorf, Saarland, Germany that Wolfspeed Inc of Durham, NC, USA plans to build (as announced in February 2023), reports Reuters. ZF had been set to contribute $185m for a stake in the plant, which was to make SiC devices for electric vehicles (EVs)...

Dallas-based Texas Instruments Inc (TI) has begun production of gallium nitride (GaN)-based power semiconductors at its factory in Aizu, Japan. Coupled with its existing GaN manufacturing in Dallas, Texas, TI will internally manufacture four times more GaN-based power semiconductors as Aizu ramps to production...

Market research firm TrendForce notes that, according to a report by China’s CCTV Finance, South Korea’s Samsung Electronics has begun restructuring its business, as the semiconductor division has decided to withdraw from the mainstream LED market, due mainly to the firm’s overall performance falling short of expectations...

Audi’s Q6 e-Tron, hitting the road in 2024, will sport handsfree secure car access via a smart mobile device and this capability is built around an ultrawideband (UWB) semiconductor device to precisely identify the driver’s location in relation to the car. The car, which only needs a single UWB device to measure distance, can locate a person near a door or tailgate and then respond according to driver preferences.

UWB, a wireless technology that enables extra security capabilities and has already gained traction in smartphones for identification features, adds location sensing to a vehicle key fob to mitigate security challenges like key fob spoofing. In other words, it precisely identifies the location of the driver in relation to the car, allowing the doors to be unlocked only when the driver is near the car.

Source: NXP

Drivers can unlock and start their car handsfree using a digital key on a UWB-enabled smartphone or wearable, which can remain in the driver’s pocket or bag. In addition to handsfree access to cars, UWB can support other use cases such as automated electric vehicle (EV) charging.

Audi Q6 e-tron’s handsfree car entry is powered by NXP’s Trimension NCJ29Dx family of UWB chips that deliver high localization resolution and power optimization for battery-powered devices like key fobs. These USB devices also offer maximum protection against car theft through relay attacks with on-chip support for a wide range of cryptographic operations.

It’s worth mentioning that NXP’s Trimension NCJ29Dx family is part of NXP’s larger portfolio of secure car access system solutions, which includes the NCF3340 NFC controller and the KW37 Bluetooth 5.0 Long-Range microcontroller. And these two devices are also part of Audi’s secure car access platform.

NXP’s Trimension NCJ29Dx devices—compliant with 802.15.4, Car Connectivity Consortium (CCC), and FiRa Consortium standards—have a production win in Audi vehicles, and that cements UWB’s place in real-time, accurate distance measurement between driver and vehicle. Other UWB features besides precise and secure real-time localization could also be in play in upcoming vehicles.

Related Content

• The Future of Automotive Connectivity
• Ceva’s UWB Radar Detects Child Presence in Cars
• Enhancing security of passive keyless entry with UWB technology
• NXP Adds Latest Automotive UWB chip as BMW Drives Digital Key 3.0
• Volkswagen and NXP Show First Car Using UWB To Combat Relay Theft

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Toray Industries Inc of Tokyo, Japan has developed materials and technologies for mounting indium phosphide (InP) and other optical semiconductors used in silicon photonics on silicon substrates...

Many industrial applications are transitioning to higher power levels with minimized power losses, which can be achieved through increased DC link voltage. Infineon Technologies AG of Munich, Germany has hence addressed this challenge by introducing the CoolSiC Schottky diode 2000V G5, which is claimed to be the first discrete silicon carbide diode on the market with a breakdown voltage of 2000V. The product family is suitable for applications with DC link voltages up to 1500VDC and offers current ratings from 10A to 80A, making it suitable for higher DC link voltage applications such as in solar and electric vehicle (EV) charging applications...

First please read this earlier post where I noted how Hydrotherapy equipment for my physical therapy after a foot surgery had “scalding” temperatures set to 120°F (Figure 1).

Figure 1 Hydrotherapy equipment with scalding water temperature is 120oF and beyond.

Then see this more recent post and be prepared for a shock.

The post on Inside Edition describes how a man was killed after being exposed to a water shower where the hot water temperature was 150 degrees Fahrenheit (150°F). This was way, way higher than the scalding threshold of 120°F mentioned in the earlier EDN post.

No mention was made, but I rather suspect, that the man who was killed may have let the hot water run for a while before stepping into the shower to avoid being chilled by cold water and that he did not test the shower water by hand first. Had he checked, he would have avoided the scalding.

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related articles:

• Understanding circular polarization
• How hot is too hot to touch?
• Misconception revealed: Can a heat sink be too big?
• Goodbye, thermal grease; hello, integral heat sink?
• Non-electronic instrument measures water depth and temperature
• Common-impedance plumbing
• The case of the too-hot laptop

The post Part 2: How hot is too hot to touch?  appeared first on EDN.

An electromagnetic wave or signal traveling from “here” to “there” has an electrostatic field component that we call its E-field and whose direction we assign as the signal’s polarity. Often, the E-field is either vertical or horizontal as developed by a dipole structure or a ground plane antenna, but it can also be rotary which means it can be rotating around the signal’s axis of travel. The conventional terminology for that case however is not the word “rotary”, it is the word “circular”. We thus speak of vertical polarization, horizontal polarization, and circular polarization.

What grammarian made that decision is anyone’s guess, but that’s how things are.

It isn’t hard to create a circularly polarized signal. Please see Figure 1.

Figure 1 Making a circularly polarized signal is achieved by feeding both polarizations at the same time but with a 90o signal phase shift between the two.

A circularly polarized signal has a handedness which is defined from the point of view of the signal’s recipient. If the E-field is rotating clockwise from the recipient’s observation point, the signal is right hand polarized (RHP). If the E-field is rotating counterclockwise from the recipient’s observation point, the signal is left hand polarized (LHP). When I was at Sirius Satellite Radio prior to the merger with XM Radio, I learned that their Sirius satellite signals were LHP.

If you the recipient of an incoming signal point your right-hand thumb along the axis of signal arrival, your remaining four fingers will curl to your right for RHP, the direction of E-field rotation. If you the recipient of an incoming signal point your left-hand thumb along the axis of signal arrival, your remaining four fingers will curl to your left for LHP, the direction of E-field rotation.

Got that?

One advantage of circular polarization is a reduced susceptibility to signal fading over long distances. Various factors can affect the polarization of the traveling signal, and the degree of fading can be different between different degrees of polarization angle. Vertical and horizontal polarizations share this vulnerability.

Circular polarization is less susceptible to signal fading since the polarization most easily propagated is achieved whatever the intervening propagation environment might happen to be. In ham radio, this is a noted advantage of “cubical quad” antennas over multi-element Yagi antennas. Cubical quads deliver circular polarization.

Please see this article.

Where “QSB” stands for signal fading and “DX” stands for long distance communication, we find the following:

John Dunn is an electronics consultant, and a graduate of The Polytechnic Institute of Brooklyn (BSEE) and of New York University (MSEE).

Related Content

• RFID Basics: Antenna Polarization
• Tutorial: Radio Basics for UHF RFID–Part VI
• Take advantage of smaller beam widths and higher frequencies in antenna designs
• Minimize lightning damage on satellite antennae

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