Новини світу мікро- та наноелектроніки

Houqiang Fu, an assistant professor of electrical engineering in Arizona State University’s Ira A. Fulton Schools of Engineering, has received a 2024 National Science Foundation (NSF) Faculty Early Career Development Program (CAREER) Award to explore the potential of the ultrawide-bandgap semiconductor material aluminum nitride (AlN) for enhanced power electronics...

Infineon Technologies AG, a leader in power systems and IoT, is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services. Both companies have agreed on operating a dedicated packaging and test centre at Amkor’s manufacturing site in Porto. Operations are expected to commence in the first half of 2025.

With this long-term agreement, Infineon and Amkor further strengthen their partnership, extending the classical Outsourced Semiconductor Assembly and Test (OSAT) business model. Amkor will expand its facilities in Porto and run the production line, providing dedicated clean room space, and Infineon will provide an onsite team with engineering and development support. The cooperation further strengthens the European semiconductor supply chain and contributes to making it more resilient – especially for automotive customers. It complements Infineon’s already diversified manufacturing footprint, balancing in-house and outsourced production capabilities.

”We are pleased to further deepen our partnership with Amkor and will contribute with our engineering and development expertise,” said Alexander Gorski, Executive Vice President and responsible for Infineon’s global Backend Operations. ”Infineon and Amkor are jointly increasing geographical resilience and supply security for our customers. Together, we are strengthening Europe’s importance as a location for semiconductor manufacturing. For 20 years, Infineon has been successfully operating a large service centre in Porto, now with more than 600 employees. With the joint manufacturing centre, we are becoming even more deeply rooted in Portugal’s excellent semiconductor ecosystem. We are looking forward to further increasing our footprint in Portugal.”

“Amkor is proud to expand our partnership with Infineon,” said Giel Rutten, Amkor’s president and chief executive officer. “We continue to invest in our Porto manufacturing site, expanding capacity as well as broadening our Advanced packaging and test technology portfolio. This collaboration represents another milestone for both companies in enhancing supply chain resiliency for advanced products supporting Automotive & Industrial end markets.”

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Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has launched the EPC9192 reference design, enabling powerful, compact and efficient Class-D audio amplifiers. The EPC9192 showcases the capabilities of EPC’s 200V EPC2307 eGaN FETs in a ground-referenced, split-dual-supply single-ended (SE) design, delivering 700W per channel into a 4Ω load...

CENTENNIAL, Colo.–(BUSINESS WIRE)– Arrow Electronics, Inc. is utilizing the onsemi  Imager Access System (IAS) module standard for developing intelligent vision solutions for use in robotics, machine vision, commercial cameras and other uses.

The solution reduces the design complexities that are common with designing a product that utilizes image sensors. Part of that complexity is there is no standardization of the hardware interfaces of the different technology blocks. This is where the onsemi IAS module standard comes in and is adopted throughout the ecosystem.

Working with Appletec, Arrow developed the newest IAS module, AP-VISION-AR0830-83, that utilizes the latest generation of onsemi image sensors.

“The onsemi Hyperlux LP family of sensors set a new industry benchmark for ultra-low power sensor design. Combined with a small form factor, purpose-oriented features and best-in-class imaging, Hyperlux LP will be a fixture for smart home, office, and robotics for years to come,” said Stephen Harris, senior director of marketing for onsemi’s Industrial and Commercial Sensing Division. “onsemi is now able to bring the newest high-performance, feature-rich 4K sensor in the Hyperlux family, AR0830, to market with Arrow’s IAS module, allowing our customers to reduce camera development efforts significantly with best-in-class module design.”

This new module joins the existing portfolio of IAS modules offered by Arrow and Appletec.

Arrow worked with its company, eInfochips, and onsemi to develop drivers that enable the Appletec IAS modules to work with leading embedded processors.

“eInfochips has extensive experience in developing end-to-end vision solutions. This includes hardware design, image sensor integration and tuning, image processing, image driver development, low latency streaming and AI Inferencing on edge/cloud,” said Gaurav Patel, vice president and general manager of product engineering services for eInfochips. “Companies rely on eInfochips to deliver innovative vision solutions and accelerate and de-risk design cycles.”

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Munich, Germany – In the automotive industry, security and functional safety are playing an increasingly important role even in low-end microcontroller applications. At the same time, vehicle manufacturers are replacing mechanical buttons by touch enabled surfaces that blend into a clean cockpit or steering wheel. As a result, there are strong space limitations for the electronic circuits, and a demand for highly integrated ICs with a small form factor. To tackle these challenges, Infineon Technologies AG introduces the PSoC 4 HVMS family of automotive microcontrollers, integrating high voltage features (12 V-regulator and LIN/CXPI-transceiver) in combination with advanced analog features (CAPSENSE, Inductive sensing), ISO26262 compliant and ISO21434 ready.

Target applications include touch-enabled automotive HMIs (Human Machine Interfaces) with touch buttons, sliders, and touchpads for controlling HVAC, interior lighting, power windows/sunroofs or in door handles. In steering wheels, the PSoC 4 HVMS is used for touch sensing as well as safety-critical hands-off detection. The latest generation CAPSENSE module also supports proximity detection for occupant detection or foot kick control. In addition to HMI applications, the PSoC 4 HVMS is also used in generic sensing applications (such as liquid level sensing, Wheatstone bridge sensing, etc.) or in simple actuators such as a PTC heater or interior/exterior lighting.

The PSoC 4 HVMS family is AEC-Q100 qualified and offered in small footprint QFN packages with wettable flanks. The ICs offer scalability and pin compatibility across devices. ISO26262 ASIL-B compliance ensures safe operation at temperatures up to 125°C. The family is based on ARM Cortex-M0+ processors with up to 128 KB of embedded flash and 16 KB of SRAM. The microcontrollers can be powered directly from a 12 V battery and include LIN and CXPI PHY. For capacitive sensing applications, the device supports the latest 5th generation CAPSENSE technology with eight times better SNR than the previous generation, support for high parasitic capacitance up to 3000 pF and support for overlays up to 18 mm. Additional analog integration includes a 12-bit SAR ADC, up to two operational amplifiers and low power comparators.

The microcontroller family is accompanied by comprehensive software support including Automotive Peripheral Driver Library (AutoPDL), Automotive Middleware Library for CAPSENSE, and the Safety Library (SafeTlib) for Automotive PDL, accelerating the time-to-market by significantly reducing customer development time. The software package is developed in adherence to automotive software development processes, including ASPICE, MISRA2012 AMD1, and CERTC coding standards, and guarantees industry-leading reliability and compliance. The PSoC 4 HVMS software package is ISO26262 compliant and developed as a Safety Element out of Context (SEooC) for applications with safety targets up to ASIL-B. The ModusToolbox software development platform will be additionally available soon.

Availability

Samples of the PSoC4 HVMS controllers are available for both the 64 K and 128 K families. The series is expected to go into production in 2024. More information is available at https://www.infineon.com/psochv.

Infineon at Embedded World

Embedded World will take place in Nuremberg, Germany, from 9 to 11 April, 2024. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth #138 and virtually. Company representatives will also hold several TechTalks as well as presentations at the accompanying Embedded World Conference, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email media.relations@infineon.com, Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about the Embedded World show highlights is available at www.infineon.com/embeddedworld.

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Infineon Technologies has announced the XENSIV Sensor Shield for Arduino, a versatile tool designed for evaluating smart sensor systems in smart home and diverse consumer applications. This innovative shield incorporates a wide range of sensors from Infineon’s portfolio along with Sensirion’s SHT35 humidity and temperature sensor which streamlines its capabilities and enhances the design journey of Infineon’s customers. This shield empowers design engineers to evaluate, prototype and develop sensor-based applications faster by fully leveraging Infineon microcontrollers, wireless connectivity and security chips. As a result, it serves as an exceptional platform for enabling accelerated innovation in sensor powered solutions.

“We are very pleased to be teaming up with Sensirion“, said Philipp von Schierstädt, EVP & CSO Consumer, Computing & Communication at Infineon. “Together we can expand our product range and ease the work of application designers.” With the new shield customers addressing smart home applications such as HVAC will have the opportunity to develop within Infineon’s ecosystem and gain access to additional sensors beyond the company’s consumer sensor portfolio of microphones, pressure sensors, CO2 and radar sensors.

The XENSIV Sensor Shield for Arduino enables seamless hardware interoperability between multiple Infineon MCUs and sensors as a fully integrated development platform. The featured sensors include XENSIV 60 GHz Radar, PAS CO2, Pressure, PDM Microphones, IMU accelerometer and the Sensirion SHT35 humidity and temperature sensor. The shield seamlessly integrates with Infineon’s microcontroller kits and provides convenient access via an Arduino Uno connector. As part of Infineon’s ongoing commitment to deliver comprehensive system solutions, the shield is specifically designed and optimized to work with targeted MCUs in the Infineon lineup such as PSoC 6, AIROC Bluetooth SoCs and Wi-Fi MCUs.

To further accelerate time-to-market and improve the customer experience while working within Infineon’s ecosystem, the XENSIV Sensor Shield for Arduino is fully enabled to work with Infineon’s ModusToolbox software development platform for simplified software integration. ModusToolbox provides a comprehensive development environment: a unified platform with all tools and resources needed for embedded system development. Included code generation and configuration wizards automate repetitive tasks and simplify complex configurations. The ModusToolbox development ecosystem is designed to scale with project requirements and adapt to changing needs, providing developers with essential libraries and code examples necessary for rapidly prototyping a variety of applications.

Designers can also leverage the sensors of the XENSIV Sensor Shield for Arduino in Machine Learning use cases, utilizing Infineon microcontrollers, ModusToolbox and Imagimob Machine Learning together with Infineon’s broad sensor capabilities and Sensirion’s temperature and humidity sensor.

Availability

The new XENSIV Sensor Shield for Arduino will be available in the third quarter of 2024. Infineon will be showcasing the shield at Embedded World in Nuremberg.

Infineon at Embedded World

Embedded World will take place in Nuremberg, Germany, from 9 to 11 April 2024. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth #138 and virtually. Company representatives will also hold several TechTalks as well as presentations at the accompanying Embedded World Conference, followed by discussions with the speakers. If you are interested in interviewing an expert at the show, please email media.relations@infineon.com. Industry analysts interested in a briefing can email MarketResearch.Relations@infineon.com. Information about the Embedded World show highlights is available at www.infineon.com/embedded-world.

The post Infineon introduces the XENSIV Sensor Shield for Arduino with Infineon and Sensirion sensors for Smart Home applications appeared first on ELE Times.

AXT Inc of Fremont, CA, USA — which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials — says that it expects to report revenue of $22.4–22.7m for first-quarter 2024, up from $19.4m a year ago and last quarter’s $20.4m, and exceeding its prior guidance of $20–22m...

A few months back, LA Computer Company (whose website is still up as I write these words, although it may no longer be when you read them), a retailer from whom I’d purchased a number of products over the years, announced that it was closing up shop and “fire sale-ing” its remaining inventory. I subsequently purchased several items from the company, one of which was a “Refurbished 4-Bay Portable Tower Enclosure 12TB (4x3TB)” further described as a “Refurbished 4 bay Thunderbolt 2 enclosure with 4 x 3TB hard drives installed.” The product photo (no longer available, alas) was generic, but the price was compelling, so I took a chance.

What arrived was a cosmetically imperfect but still functional AKiTiO Thunder2 Quad enclosure:

This last stock photo is particularly apropos, as the initial computer I intend to tether the enclosure (and HDDs inside) to is my own “trash can” Mac Pro:

And after the Mac Pro exits Apple’s supported-products stable, I’ll still be able to use the AKiTiO external storage device with newer Macs (along with Thunderbird-supportive Windows systems) in conjunction with an Apple adapter:

What of those HDDs inside the enclosure? They’re 7,200 RPM Seagate ST3000DM001 3.5” drives (here’s a PDF spec sheet for the entire Barracuda product family generation, code-named “Grenada”), with 6 Gbps SATA interfaces and 64 Mbyte RAM caches onboard. This particular variant integrated three 1 TByte platters, each with two associated read/write heads (one on either side), and also came in fewer-platter and lower-capacity versions.

I was initially surprised when Google search results on the product code revealed a Wikipedia page dedicated to the ST3000DM001, but all became clear when I started reading it. Suffice it to say that going with the “industry’s first 1TB-per-disk hard drive technology” more than a decade ago may have incurred at least some long-term usage risk for Seagate and its customers, in contrast the product family’s generally positive initial review results. Specifically, Backblaze, a well-known cloud storage company who uses lots of mass storage devices (both rotating and solid-state) and regularly publishes data on various drives’ reliability, found the ST3000DM001 exhibiting atypically high failure rates. Quoting from the company’s April 2015 report:

Beginning in January 2012, Backblaze deployed 4,829 Seagate 3TB hard drives, model ST3000DM001, into Backblaze Storage Pods. In our experience, 80% of the hard drives we deploy will function at least four years. As of March 31, 2015, just 10% of the Seagate 3TB drives deployed in 2012 are still in service.

Root cause? Here’s one working theory, according to German data recovery company Datenrettung (who was specifically discussing the drives’ usage in Apple’s 5th-gen Time Capsule):

The parking ramp of this hard drive consists of two different materials. Sooner or later, the parking ramp will break on this hard drive model, installed in a rather poorly ventilated Time Capsule. The damage to the parking ramp then causes the write/read unit to be destroyed and severely deformed the next time the read/write unit is parked. When the Time Capsule is now turned on again or wakes up from hibernation, the data disks of the Seagate hard drive are destroyed because the deformed read-write unit drags onto it.

Is Datenrettung right? Maybe. Some of my skepticism comes from the brutally honest “rather poorly ventilated Time Capsule” observation in the company’s comments. Apple has long been all about sleek, svelte, quiet, and otherwise boundary-pushing system design, and this isn’t the first time that a propensity for overheating has been the end result. Take my G4 Cube, for example. Or my first-generation MacBook Air. Or, more germane to this particular conversation, my own 3rd-gen Time Capsule, which also exhibited overheating-induced functional compromise but used an older, lower-capacity drive from an unknown manufacturer.

My skepticism further increased when I came across an excellent dissection at Tom’s Hardware:

By its own admission, Backblaze employed consumer-class drives in a high-volume enterprise-class environment that far exceeded the warranty conditions of the HDDs. Backblaze installed consumer drives into a number of revisions of its own internally developed chassis, many of which utilized a rubber band to “reduce the vibration” of a vertically mounted HDD.

 The first revision of the pods had no fasteners for securing the drive into the chassis. As shown, a heavy HDD is mounted vertically on top of a thin multiplexer PCB. The SATA connectors are bearing the full weight of the drive, and factoring the vibration of a normal HDD into the non-supported equation creates the almost perfect recipe for device failure.

 Backblaze has confirmed it still has all revisions of its chassis installed in its datacenters and that it replaced failed drives into the same chassis the original drive failed in. This could create a scenario where replacement drives are repeatedly installed into defective chassis, thus magnifying the failure ratio.

 Backblaze developed several revisions of the custom chassis due to its admitted vibration problems with the early models, and the company shared the designs with the public. However, Backblaze did not indicate which type of enclosures each drive failed within, leaving speculation that the chassis may be the real root of the problem (among others).

The bolded emphasis in this last paragraph is mine:

The Backblaze environment employed more drives per chassis and featured much heavier workloads (both of which accelerate failure rates tremendously) than the vendors designed the client-class HDDs for. This ultimately helped Backblaze save money on their infrastructure. The Seagate 3 TB models failed at a higher rate than other drives during the Backblaze deployment, but in fairness, the Seagate drives were the only models that did not feature RV (Rotational Vibration) sensors that counteract excessive vibration in heavy usage models — specifically because Seagate did not design the drives for that use case.

So, to save cost, Backblaze went with HDDs that weren’t designed for this particularly demanding application. And when those HDDs failed at higher rates than those that were designed for that particularly demanding application, the company questioned the reliability of the HDDs instead of questioning its own procurement criteria (which, as Tom’s Hardware noted in February 2016, “was borne of necessity; it began during the Thailand floods when HDDs were excessively high priced”).

Supposedly, said Tom’s Hardware, “Backblaze issued numerous disclaimers about the applicability of the findings outside of its own unique (and questionable) use case.” Candidly. I’m not sure where those disclaimers appeared; I sure don’t see them within the report itself. Regardless, “the damage from the information dealt Seagate an almost immeasurable blow in the eyes of many consumers.” And that, I’ll frankly proffer, is profoundly unfair. The courts, who tossed out a class-action lawsuit subsequently filed by one complainant, apparently concurred.

For what it’s worth, all four of my Seagate 3TB HDDS are seemingly working just fine so far. They came pre-configured, formatted HFS+ and in a clever performance-plus-reliability RAID combo:

• Each pair configured RAID 0 “striped” (for performance), with
• Both pairs then combined via RAID 1 “mirrored (for reliability)

Undoing all this upfront configuration (which admittedly did have the advantage of relying solely on the software RAID 0/1 facilities already built into MacOS) was a bit tricky, but I accomplished it. I’ve now got an APFS-formatted, RAID 5-configured array via SoftRAID (now owned by Other World Computing, who coincidentally also acquired AKiTiO a few years ago). And although the intermediary Thunderbolt-to-quad-SATA translation hardware would normally make it infeasible to assess HDD health via ongoing S.M.A.R.T. monitoring, SoftRAID neatly manages this bit (maybe, more accurately instead worded, “these bits”?), too.

HDDs are, as my own teardown showcases, complicated pieces of hardware-plus-software. That they work at all, far from reliably for many years, validates my August 2022 observation that they’re “amazing engineering accomplishments”:

• One or (usually) multiple platters, spinning at speeds up to 15,000 RPM. Each platter mated to one or (usually) two read/write heads, hovering over one or both sides of the rapidly rotating platter only a few nanometers away, and tasked with quickly accessing the desired track- and sector-stored details.
• Low-as-possible power consumption and high-as-possible ruggedness and reliability, in contrast to other contending design considerations.
• And ever-more data squeezed onto each platter, thanks to PRML (partial-response maximum-likelihood) sensing and decoding and now-mainstream PMR (perpendicular magnetic recording), next-generation SMR (shingled magnetic recording) and emerging successor HAMR (heat-assisted magnetic recording) storage techniques.

But, in order for them to work reliably for many years, they need to be used as intended. Backblaze seemingly didn’t do so. Was an inherent compromise in Seagate’s design at least partly to blame? Maybe. Reiterating what I said earlier, the ST3000DM001 and its product-family siblings marked Seagate’s initial entry into the 1 TByte-per-platter domain. Ironically, the Hitachi HUS724030ALE641 HDD I tore apart nearly two years ago, which dated from April 2013, was also a 1 TByte/platter design.

But that wasn’t the Hitachi HDD that Backblaze compared the Seagate ST3000DM001 against. It was the much older HDS5C3030ALA630, which not only required 5 platters (and 10 read/write heads) to achieve that same total-capacity metric, but also only ran at 5940 RPM rotational speeds. When you unwisely try to compare apples and oranges, you undoubtedly encounter variances. And in summary. I guess that’s my guidance to all of you: be wise. Don’t be fooled by sensationalist clickbait, whether related to technology, politics, or anything else, that presents you with a cherry-picked subset of the total applicable dataset in attempting to persuade you to accept a distorted conclusion. Question your own assumptions? Yes. But also question others’ assumptions. As well as their underlying motivations. I welcome thoughts in the comments!

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Peeking inside an HDD
• Question your assumptions: Diagnosing computer disruptions
• HDDs vs SSDs: It’s all about the random speeds
• Power vs energy: SSD and HDD case studies

The post Fairly evaluating HDD reliability appeared first on EDN.

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Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has received the Gold Supplier Award from China-based chipmaker BOE HC SemiTek for their collaboration on micro-LED technology. The partnership spans more than 19 years, evolving since 2022 into a close collaboration focusing on 150mm gallium nitride (GaN) and arsenide-phosphide (AsP) materials for the development of micro-LED technologies...

Tokyo-based Mitsubishi Electric Corp has begun shipping samples of a DFB-CAN distributed feedback laser diode with built-in wavelength monitor. The new light source — reckoned to be the industry’s first to use the inexpensive TO-56CAN package (often used for low-speed optical signals, such as passive optical networks) for digital coherent communication capable of high-speed, long-distance transmission — is expected to contribute to the realization of ultra-small, low-power consumption of optical transceiver modules...

Fraunhofer Institute for Applied Solid State Physics (IAF) of Freiburg, Germany has developed single-mode gallium antimonide (GaSb) VECSELs with what are reckoned to be best-in-class output powers of up to 2.4W, enabling quantum frequency conversion as a low-noise pump source...

At the Optical Fiber Communication conference (OFC 2024) in San Diego, CA, USA (26–28 March), Adtran Inc of Huntsville, AL, USA (which provides open, disaggregated networking and communications solutions for voice, data, video and internet communications) and vertical-cavity surface-emitting laser (VCSEL) maker Vertilas GmbH of Garching bei München, Germany announced what is claimed to be the industry’s first 100Gb/s PAM4 single-mode VCSEL technology with capabilities up to 1.6Tb/s. It is said to set new standards for low power consumption in optical engines and modules, with up to 80% reduction in power on the transmit optics compared with conventional solutions...

Teledyne e2v HiRel Electronics of Milpitas, CA, USA (part of the Teledyne Defense Electronics Group that provides solutions, sub-systems and components to the space, transportation, defense and industrial markets) has released the TDGM650LS60, the first product in its new 650V power module family, which utilizes a Teledyne high-voltage gallium nitride (GaN) transistor and integrates an isolated driver in one package...

Gallium nitride-on-silicon (GaN-on-Si) power solutions firm Innoscience (Zhuhai) Technology Co Ltd of Suzhou, China says that it welcomes two decisions of 20 March by the US Patent and Trademark Office (USPTO) to institute a review of the validity of the two remaining US patents, as asserted by Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA against Innoscience. The USPTO wrote that “there is a reasonable likelihood that petitioner [Innoscience] would prevail with respect to at least one of the claims challenged in the petition.”...

An off-the-shelf secure authentication IC combined with cloud-based security software-as-a-service (SaaS) claims to manage and update embedded security credentials in the field instead of being limited to a static certificate chain implemented during manufacturing.

Microchip’s ECC608 TrustMANAGER authentication ICs are paired with Kudelski IoT’s keySTREAM device-to-cloud solution for securing key assets end-to-end in an IoT ecosystem throughout a product’s lifecycle. The combo enables custom cryptographic credentials to be accurately provisioned at the endpoint without requiring supply chain customization and can be managed by the end user.

Figure 1 Here is how a security silicon component (left) works with IoT cloud software for in-field provisioning. Source: Microchip

ECC608 TrustMANAGER, a secure authentication IC designed to store and protect cryptographic keys and certificates, is managed by the keySTREAM SaaS. Their combination allows end users to set up a self-serve root Certificate Authority (root CA). Next, the associated public key infrastructure (PKI) secured by Kudelski IoT creates and manages a dynamic certificate chain and provisions devices in the field the first time they are connected.

Once claimed in the SaaS account, the IoT devices are automatically activated in the user’s keySTREAM service via in-field provisioning. In other words, security ICs like ECC608 TrustMANAGER come with a pre-provisioned set of keys that will be controlled by keySTREAM at the time the IoT device connects for the first time.

The operation—called in-field provisioning of the PKI— happens in-field, and after in-field provisioning, the fleet of devices containing the ECC608 TrustMANAGER is first claimed and then activated in the user’s keySTREAM account.

An IoT device is “claimed” when the purchased batch of security ICs shows up in the keySTREAM account but not connected yet. It’s “activated” when the purchased batch of security ICs is connected to keySTREAM and the in-field provisioning takes place.

Figure 2 Specialized authentication semiconductors tie up with IoT security services for reliable cybersecurity on embedded systems. Source: Microchip

It’s a pivotal moment in the industry’s quest to secure the IoT landscape and make provisioning easier. Especially when the volume of connected devices rapidly increases, and security standards and regulations steadily tighten.

Moreover, security standards and upcoming regulations increasingly require the upgradability of security infrastructure for IoT devices. This poses a dilemma for traditionally static IoT security implementations, which require physical upgrades like changing out the security ICs in each device to stay in compliance.

The combo of silicon components and key management SaaS automates provisioning and facilitates easy device ownership management without changing hardware. It also streamlines the supply chain processes for distribution partners.

Related Content

• Best practice for end-to-end IoT security
• Practical steps to security for IoT devices
• Navigating IoT security in a connected world
• Legal requirements for IoT security start to emerge
• Hardware-Based Design Approach for Smart-Home IoT Security

The post Authentication IC ties up with IoT SaaS for in-field provisioning appeared first on EDN.

Atomic layer etching (ALE) specialist AlixLabs AB of Stockholm, Sweden (which was spun off from Lund University in 2019) says that the European Union Intellectual Property Office has granted a certification of registration for its trademark APS (ALE Pitch Splitting). APS describes the company’s process that aims to enable the production of chips at Ångström scale at lower cost and energy use...

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Hello everyone, could someone tell me where I found the datasheet for this module "Mitsubishi J2-Q03A-D" I can't find it on the Web, very possible it's an IGBT, I want to know what's burnt too Thanks submitted by /u/bil7200 [link] [comments]

It even comes with a light if it's too dark. Incredible! submitted by /u/Desperate_Original56 [link] [comments]