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The 20 new KAM Series capacitors deliver high capacitance values in compact, lightweight, surface-mount packages optimized for EV, ADAS, and ADS applications and are designed, manufactured, and tested to meet the high quality and reliability standards of the automotive industry.

KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, has expanded its line of KAM Series automotive MLCCs with the addition of 20 new components.

Manufactured using miniaturization and high-capacity atomization technologies developed for smartphones and materials proven to maintain high-reliability performance in automotive environments, KAM Series automotive MLCCs are available in an extensive range of case sizes, capacitance values, and voltage ratings optimized for use in small, densely packed automotive circuits with fast processing speeds. These compact and lightweight surface-mount components minimize board space requirements and deliver capacitance values high enough to reduce capacitor component counts, both of which are essential to helping automotive engineers overcome some of the many challenges posed by evolving electric vehicle (EV), advanced driver assistance system (ADAS) and automated driving system (ADS) designs.

KAM Series automotive MLCCs are designed, manufactured, and tested to ensure that they meet the high quality and reliability standards of automotive industry applications. They are compliant with the AEC-Q200 Stress Test Qualification for Passive Components standard, manufactured in IATF, QS9000, and VDA 6.4-approved facilities, and continuously tested in quality assurance (QA) laboratories to ensure superior quality and performance. QA methods include 100% visual inspection, increased sampling for accelerated wave soldering, and lot-by-lot reliability testing. All KAM Series automotive MLCCs are also RoHS compliant and designed to be operated below the rated voltage.

The latest expansion of the KAM Series automotive MLCCs includes 20 new components. The new releases are available in four case sizes (0201, 0402, 0603, and 0805) with thicknesses extending from 0.33mm to 1.45mm, nickel/tin terminations, two dielectrics (X7R and X7T), four voltage ratings (4, 6.3, 10, and 16V), capacitance values extending from 0.1–22µF (±10%), and 7” reels loaded with paper or embossed plastic tape.

Ideal applications for the new KAM Series automotive MLCCs include electric vehicle (EV), automated driver assistance system (ADAS), and automated driving system (ADS) engine control units (ECUs), powertrains, central gateway (CGW) communication nodes, cluster heads-up displays (HUDs), door control units (DCUs), cameras, radar, LiDAR, memory, CPU/MPU decoupling, and other low-voltage safety systems with space constraints and high capacitance demands. They are also well suited for use in high-reliability applications outside of the automotive industry.

With this latest extension, the KAM Series automotive MLCCs is now available with nine case sizes (0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, and 2220), two termination styles (nickel/tin and FLEXITERM), six dielectrics (C0G/NP0, X7R, X7T, X8R, X8L, and X8G), 16 voltages extending from 4V to 3,000V, capacitance values extending from 0.5pF to 22µF, eight capacitance tolerances spanning­ ±0.1pF to ±20%, and 7” and 13” reels loaded with paper or embossed plastic tape. As such, KAM Series MLCCs are also well suited for use in hybrid automotive battery control, inverter, converter, motor control, and water pump applications; on-engine automotive applications; hybrid electric commercial applications, including emergency circuits, sensors, and temperature regulation devices; oil exploration applications; and other applications with a 150°C operating requirement.

“KYOCERA AVX has been a trusted supplier of automotive MLCCs for several decades and is very proud to introduce the new small-case-size, high-capacitance-value, wide-voltage-range, and AEC-Q200-qualified KAM Series automotive MLCCs to market,” said Kensuke Ikeda, Senior Manager – MLCC Development, KYOCERA Corporation. “The number of MLCCs mounted in circuits related to EV, ADAS, and autonomous driving systems is steadily increasing, accelerating market demand for miniature components, and the voltage ratings of the ICs employed in these systems is decreasing, driving new demand for low-voltage MLCCs. Our evolving line of KAM Series capacitors satisfy these market demands. For example, when 5VDC is applied to our 0805 X7R dielectric MLCC rated for 10V and 10µF, it maintains 86.3% of its capacitance due to excellent DC bias characteristics. In addition, KAM Series MLCCs are precision engineered, manufactured, and tested to provide optimal solutions for EV, AD, and ADAS circuits and will continue to satisfy evolving automotive market demands with future series extensions.”

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Includes Automated AI Model Construction, Validation, and Deployment Modules of Reality AI Tools along with Tutorials, Application Examples and Email Support

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News highlights:

• New power modules with MagPack technology are up to 50% smaller than previous generations, doubling power density while maintaining excellent thermal performance.
• The industry’s smallest 6A power modules reduce electromagnetic interference (EMI) radiation by 8dB and simultaneously improve efficiency by up to 2% compared to predecessors.

Texas Instruments today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage TI’s proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% compared to competing modules, enabling designers of industrial, enterprise and communications applications to achieve previously impossible performance levels.  In fact, three of the six new devices, the TPSM82866A, TPSM82866C and TPSM82816, are the industry’s smallest 6A power modules, supplying an industry-leading power density of nearly 1A per 1mm2 of area.

“Designers turn to power modules to save on time, complexity, size and component count, but these benefits have required a compromise on performance – until now,” said Jeff Morroni, director of power management research and development at TI’s Kilby Labs. “After nearly a decade in the making, TI’s integrated magnetic packaging technology enables power designers to meet the defining power trend that has shaped our industry – pushing more power in smaller spaces efficiently and cost-effectively.”

In power design, size matters. Power modules simplify power designs and save valuable board space by combining a power chip with a transformer or inductor in one package. By leveraging TI’s exclusive 3D package molding process, MagPack packaging technology maximizes the height, width and depth of the power modules to push more power in a smaller space.

The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now achieve best-in-class power density and reduce temperature and radiated emissions while minimizing both board space and system power losses. These benefits are especially important in applications such as data centers, where electricity is the biggest cost factor, with some analysts predicting a 100% increase in demand for power by the end of the decade.

Available today on TI.com

• Preproduction quantities of TI’s new power modules with MagPack packaging technology are available for purchase now on TI.com.
• Evaluation modules are also available, starting at US$49.
• Multiple payment, currency and shipping options are available.

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Compact, environmentally resilient, and incorporating Texas Instruments AM62x Sitara Processors, the PICO-AM62 & SRG-AM62 show AAEON make big moves in cost-efficient RISC-based computing.

AAEON, a leading provider of compact embedded solutions, has announced two new additions to its RISC computing line: the PICO-AM62, a single board built on the PICO-ITX form factor, and the SRG-AM62, its RISC Gateway system counterpart.

Both the PICO-AM62 and SRG-AM62 represent a new approach from AAEON’s RISC Computing Division, powered by Texas Instruments AM62x Sitara Processors. These processors consist of a quad-core Arm Cortex-A53 CPU, single-core Arm® Cortex®-M4F MCU, and integrated GPU support.

The new product line stands out for its cost-efficiency and reliability. Both the PICO-AM62 single-board and the compact SRG-AM62 Gateway System are available in SKUs with a wide temperature tolerance of -40°C to 85°C and a power input range of 9V to 36V. The products are based on Texas Instruments processors, which are highly scalable and have a 20-year lifespan. This influenced AAEON’s vendor choice and should attract customers looking for cost-effective, durable IoT solutions. The environmental ruggedness of both the PICO-AM62 and SRG-AM62 makes them well-suited for deployment in challenging environments, such as in-vehicle digital clusters or industrial applications.

At both board and system levels, the platform offers dual LAN ports, camera, and sensor support. These features, combined with their compact dimensions, make them strong candidates for applications such as building access monitoring. Additionally, both products host an HDMI 1.4b interface. The PICO-AM62, in particular, includes an LVDS connector for display output, which is well-suited for human-machine-interface (HMI) use.

Wireless communication, such as Wi-Fi and 4G/LTE, is also available via full and half-size mini cards. Both products also feature a multipurpose I/O connector for industrial control functions such as RS-232/422/485, CANBus, UART, GPIO, and I2C. Leveraging this versatility, it is easy to see how the products could serve as a flexible foundation for low-cost industrial automation devices. AAEON notes that the PICO-AM62 hosts additional serial configuration options. Combining its multipurpose I/O connector with two pin headers, users can pair two RS-232/422/485 interfaces with two CAN-FD, four full RS-232/422/485 by BOM, all the way to four RS-485 alongside dual UART.

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Rohde & Schwarz further strengthens its oscilloscope portfolio by introducing the industry’s first ASIC–based zone triggering. With this new approach, the MXO series can offer the world’s fastest zone trigger update rate of up to 600.000 waveforms per second and less than 1.45 us blind time between trigger events. It is up to 10 000 faster than competitive zone triggering offerings. Thanks to the new ASIC–based zone triggering, MXO oscilloscopes can precisely isolate events where traditional triggering does not provide the needed flexibility.

Rohde & Schwarz has developed the industry’s first ASIC–based zone triggering, implemented in the new MXO series oscilloscopes. This new functionality enhances the oscilloscopes’ ability to precisely isolate events that are difficult or impossible to detect with traditional oscilloscope triggers. Furthermore, the MXO zone trigger implementation is the industry’s fastest, surpassing others by several orders of magnitude.

Traditional oscilloscope trigger types – such as edge triggering – are often difficult to set up and/or inadequate to visualize certain trigger events. Zone triggering, on the other hand, allows users to specify trigger conditions by drawing one or more zone areas on the instrument’s display. The oscilloscope then inspects each acquisition for these conditions and shows the acquisitions on the display for events that meet the graphical conditions. If an event does not meet the graphical conditions, the waveform is discarded and not shown. Zone triggering can be very effective for triggering on non-monotonic edges, serial bus patterns, math waveforms, events across multiple channels, and events in the frequency domain. For these use cases traditional oscilloscope triggers simply do not work. The new zone triggering from Rohde & Schwarz is the world’s first ASIC–based solution that works on analog channel signals, math and spectrum.

Philip Diegmann, Vice President Oscilloscopes at Rohde & Schwarz, says: “The next-generation MXO-EP processing ASIC technology developed by Rohde & Schwarz is the foundation of the breakthrough signal visibility and user responsiveness of the MXO series. The chip design was laid out to have further hardware acceleration capabilities enabled down the road. This way we keep providing new functionalities to our oscilloscope customers never before seen in the industry. With MXO zone triggering, users obtain additional triggering capabilities without having to incur significant trigger blind times that historically have diminished the value of software-based zone triggering solutions.”

With the MXO zone triggering, users testing and debugging in the frequency domain using an oscilloscope can now draw specific zone areas. The oscilloscope will then trigger or activate when a certain tone exceeds a set power level within these zones. Or users can simply draw a zone for RF chirps or pulses. New to the industry is the MXO’s free run mode, where the oscilloscope captures as fast as possible without looking for an edge trigger event. Combining this with zone triggering can be very effective for power integrity measurements and EMI debug.

MXO zone triggering incorporates a new feature previously not found in the market: the ability to exclusively store waveforms in real time that match zone trigger criteria. This functionality enables users to exclusively focus on specific events relevant to their application.

Rohde & Schwarz offers the new ASIC–based zone triggering functionality as a standard feature for all MXO 4, MXO 5, and MXO 5C series oscilloscopes, beginning with version 2.2 firmware. The firmware is available as a free download on the web. Existing MXO users can update their instruments for free.

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Capturing transient analog signals with a microcontroller normally involves adding a full-fat peak-hold circuit as an external peripheral. This novel approach minimizes that extra hardware by using a µP’s ability to switch its pins between analog and digital modes on the fly. While this DI specifically uses a PIC, the principle can be applied to any device with that capability.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1 shows the basics. We may want to add some complications later.

Figure 1 The basic peak-hold circuit. The PIC pin labelled ANA samples the voltage on C1 and then resets it to ground, ready for the next sample.

A1 and D1 form an “active diode”, which rapidly charges C1 to the peak input voltage through R1 whenever A1’s non-inverting input is higher than the diode’s output voltage and hence that on the inverting input. C1 holds its charge as it has no discharge path—leakages excepted—until the PIC needs to sample it, when the ADC is assigned to the relevant input pin (marked as ANA) which starts the acquisition period, during which C1’s charge is shared with the PIC’s internal CHOLD. Once this is done, the conversion can be started, which also immediately disconnects that pin from the ADC, allowing it to be changed from analog input to digital output (active low) to discharge C1, resetting the circuit ready for the next cycle. Thus, a single processor pin performs two functions. Figure 2 shows typical code for the essentials.

Figure 2 Simplified code for capturing the voltage held on C1 and then immediately discharging it to reset the circuit ready for the next sampling cycle.

Now that we’ve got it working, it’s time to point out its shortcomings and suggest some workarounds. 

The voltage across C1 can never be higher than a diode-drop below A1’s VDD, which limits the effective measurement range. (Although a Schottky diode with its lower forward voltage could be used for D1, the higher reverse leakage will compromise accuracy.) If the input must cover the full span, it’s easiest to pot it down first, and either accept a slightly limited resolution on measurements or use a lower reference voltage (2.55 V might be ideal) for the DAC. A1’s VDD can be boosted—see later on—to allow a full positive swing. Similarly, its VSS could be pushed negative if readings needed to be taken very close to ground. Again: see later.

Any input offset in A1 will affect precision. 1 LSB is about 13 mV when using 8 bits with a 3.3 V reference, or ~800 µV with 12 bits, so the allowable offset is half that. (The MCP6021’s offset is quoted as being 500 µV at most.)

Note that while C1’s voltage will be measured with respect to the PIC’s AVSS—or perhaps its VREF- pin—it will be discharged to DVSS. (The lower pin-count devices combine AVSS and DVSS on a single ground pin.) Be cautious of any relative offset between them if accuracy is paramount at low input levels. Microcontrollers are often put to sleep during analog measurements to minimize such errors, which can vary according to how hard the device is working.

A more subtle source of errors is inherent in the ADC’s operation. Internally, it uses a small capacitor (CHOLD), anywhere from 10 pF to 120 pF depending on the device’s vintage, to hold the input for processing. The charge on the external capacitor C1 is shared with the internal one during the acquisition time, so unless the ADC is actually connected to the pin when the input pulse arrives, it will read low, scaled by C1 / (C1 + CHOLD). With C1 = 10 nF and if the DAC’s CHOLD = 10 pF, as in the more modern PICs, the error will be ~1 LSB for a 10-bit result, but negligible for 8 bits; lower values of C1 will lead to greater errors.

If that input pulse is shorter than the reset period and arrives while the pin is being held low, it will be attenuated and effectively lost. (And make sure that A1’s decoupling cap can source the inevitable power transient.) Adding an extra MOSFET (extra GPIO pin required, as shown in Figure 2, below) allows ‘instant’ resetting (or around a thousand times faster, probably within a single instruction cycle), and to a genuine ground rather than the PIC’s internal one. (The ADC’s pin would then be left in analog mode.) A cure in ultra-critical situations might be to duplicate the hold circuitry on another pin and sample each channel alternately, selecting the higher reading in code.

In my original application, which was measuring the strength of RF signal bursts, none of these points was a problem, as the input was always between 0.2 and 2.5 V and lasted for hundreds of microseconds, while the output was scaled to read from 0 to 9.

Despite these reservations, this open-loop approach can be faster than the standard configuration which wraps an op-amp round the capacitor. Because C1 is driven directly, the rise-time of the input pulse can now be as fast as you like. A1’s output may overshoot momentarily, but the glitch will be absorbed by the longer time-constant of R1C1.

For accuracy, R1 should be chosen so that the op-amp’s output drive never exceeds its current-limit value, as that would break the feedback loop, resulting in overshoot and a falsely high reading. Also, for clean operation, time-constant R1C1 should be no less than A1’s rail-to-rail slewing time. The 10n + 47R (470 ns is about the same as the measured slew) allowed for accurate measurements of 2.5 V pulses as short as ~3 µs. Experiments showed that R1 could be reduced to 27R, giving a -10% error for 1 µs / 2.5 V input pulses.

C1’s discharge time to half an LSB will be ~1.6 × (NumberOfBits + 1) × C1 × ROUT(LOW), where the latter term will typically be ~100 Ω for PICs working at 3.3 V. (That “~1.6” is of course 1 / (1 – 1 / e).) For 8 bits, 10 nF, and 100 Ω; that’s about 14 µs, which can be reduced if you don’t need to measure right down to ground. (Some PICs can struggle there, anyway, especially if they use an internal op-amp in the ADC’s input path.) Choosing to cancel the reset and re-enable the analog input as soon as the A–D conversion finished, which took ~20 µs in my implementation, was more than adequate and simplified the code.

A1 is shown as a Microchip MCP6021 (CMOS, RRIO, 2.5–5.5 V, 10 MHz GBW, <500 µV offset). The MCP6001 is cheaper but less well-specified. As an aside, the dual MCP6022 is great for 5 V experimenting and prototyping because it is available in DIP-8.

As drawn in Figure 1, A1 can be fed from a GPIO pin, allowing it to be powered down when the PIC is asleep. This obviously limits its VDD to the PIC’s supply voltage, restricting the input range as noted above. If you need the full range and a higher switched rail is available, use that; if not, a simple voltage-doubler, probably fed from a PWM output, provides a fix.

The MCP6021’s output drives low to within ~5 mV of its VSS (<1/2 LSB with 8 bits). To operate right down to ground, another voltage-doubler can provide a boosted negative feed, with a simple regulator reducing this to -0.6 V for low-voltage op-amps. Make sure that the total voltage across A1 is within its limits; an extra diode in the positive doubler—D6 in Figure 3—may be needed to guarantee this. All these add-ons are lumped together in Figure 3. PICs’ pin-protection diodes are rated at 25 mA and should be safe with the increased voltages under any fault conditions. While these simple PIC-driven voltage-doublers are only good for a few milliamps, they could help power other devices if need be.

All this raises a reality-checking question: what’s powering the upstream circuitry, and is it really delivering a rail-to-rail signal? If not, we don’t need to fuss.

Figure 3 Boosting the op-amp’s supply rails can give true rail-to-rail operation while an extra MOSFET allows “instantaneous” resetting of C1.

Another reality check: if both boosted rails are available, why not use a higher-voltage, non-RRIO op-amp? The negative regulator Q2/3, etc. then becomes unnecessary. The extra complications shown in Figure 2 probably won’t be needed here anyway but may come in handy elsewhere.

Largely because of a PIC’s limitations, the simple circuit of Figure 1 is accurate rather than absolutely precise, but has still proved reliable and useful, especially where board space was at a premium. It could also be appropriate as a front end for an external peak-sensing A–D peripheral. The underlying principle could also be used in microprocessor-based kit to clamp a signal line to ground, albeit with 100 Ω or so effectively in series, perhaps where a MOSFET would add too much capacitance.

—Nick Cornford built his first crystal set at 10, and since then has designed professional audio equipment, many datacomm products, and technical security kit. He has at last retired. Mostly. Sort of.

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• Ultra-low distortion oscillator, part 1: how not to do it.

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After the widespread adoption of the ISO 26262 functional safety standard in automotive designs, another standard is taking hold to protect connected vehicles from malicious cyberattacks. The ISO/SAE 21434 standard defines the engineering requirements for cybersecurity risk management to ensure that cyber risks are monitored, detected, and mitigated throughout the vehicle’s lifecycle.

Today, Synopsys announced that SGS-TṺV Saar has certified its ARC HS4xFS processor IP for ISO/SAE 21434 cybersecurity standard. This processor IP has already been certified to the ISO 26262 standard and meets ASIL D Random and ASIL D Systematic compliance for safety-critical systems.

Figure 1 The ARC HSxFS processors simplify the development of high-performance safety-critical applications and accelerate ISO 26262 safety and ISO/SAE 21434 cybersecurity certification of automotive SoCs. Source: Synopsys

The Synopsys ARC HSxFS functional safety processors—optimized for high-performance embedded applications—feature a dual-issue, 32-bit superscalar architecture with a small area footprint and low power consumption. Its compliance with cybersecurity requirements will reduce design risk and accelerate time-to-market for safe and robust systems-on-chips (SoCs).

But what’s driving the adoption of the ISO/SAE 21434 cybersecurity standard? For a start, cars are increasingly becoming software-defined while automakers add new features or functions remotely through over-the-air (OTA) software updates. Then there are other connected applications like vehicle telematics and smartphone connectivity.

So, the United Nations Economic Commission for Europe’s UN R155 regulation now mandates that automotive OEMs adopt a cybersecurity management system like ISO/SAE 21434. Automotive chip vendors are also acknowledging the critical importance of ISO 21434-certified IPs.

“As a supplier of highly reliable microcontrollers for use in automotive systems, it is critical that our products meet automotive cybersecurity standards to minimize the vulnerability to cyberattacks,” said Joerg Schepers, VP for automotive microcontrollers at Infineon.

Figure 2 Automotive vendors must adhere to tougher cybersecurity regulations amid increased hardware and software vulnerabilities in connected cars. Source: Synopsys

IP suppliers like Synopsys complying with the ISO/SAE 21434 cybersecurity standard show that the automotive industry is starting to address evolving cybersecurity threats. After the automotive industry recognized the vital need for safety, engineers are now focusing on security in chips for connected vehicles.

Related Content

• ARC: from 3D Game Chips to Licensable RISC Processor
• Synopsys Opens Up ARC Processor Architecture Online
• Automotive Cybersecurity: More Than In–Vehicle and Cloud
• ISO/SAE 21434: Software certification for automotive cybersecurity
• Are We Prepared for Cyberthreats in the New Era of Transportation?

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The government of India is in the process of revamping the National Policy on Electronics to boost various sectors and integrating India into global value chains to tackle the discrepancies in the current policy and ensure that India’s electronics manufacturing sector meets its ambitious targets.

This revamping aims to address the industry’s current challenges and align with the goal of generating USD400 billion from the ESDM sector by 2025 and rejuvenate electronics manufacturing industry and bolster exports.

India’s electronics manufacturing sector has seen tremendous growth, with output reaching $115 billion and exports totalling $29.1 billion, making it the country’s fifth-largest export category.

Since the Union Budget 2024-25 is round the corner which may be presented on 24th July, the government has the chance to realise the dreams of the electronics industry by working on the recommendations of the industry associations on the key domains including mobile phones, IT hardware, capital goods, components, consumer electronics, automotive electronics, medical electronics, industrial and strategic electronics, closed-circuit televisions (CCTVs), wearable and hearable devices, and LED lighting. The industry bodies are urging the government to consider significant changes in the upcoming Union Budget to enhance the competitiveness of India’s electronics industry.

Industry’s recommendations of bringing components used in electronic goods under the PLI scheme and rationalising tariffs on inputs in the upcoming budget seems to be valid demands. The demands aimed at attracting global value chains and scaling up production and exports in the next years to come.

The industry bodies have few recommendations for this budget. It includes: duty for input parts of sub-assemblies to 0%; Peak duties for sub-assemblies: Reduce from 20% to 15%; Remove 2.5% nuisance tariffs on input parts and Allocate Rs 35K-40K crore for parts PLI.

The following recommendations are also worth consideration in the long-term development of the industry Viz. Rs 75,000 crore over 3-5 years to establish collaborative R&D centres, Rs 10,000 crore over 3 years to train manpower for high-end semiconductor and parts manufacturing, higher local value addition, requiring significant improvement, one-day customs clearance turnaround, reduced from the current 3 days, zero duties on raw materials for electronics parts in the national technology policy for 3 years.

In order to create a self-reliant and sustainable electronics manufacturing industry, it is important to develop a components and sub-assembly ecosystem in India. For the same the government should provide appropriate policy and financial support for building large-scale components and sub-assembly ecosystems.

At the time when the electronics companies are shifting from China to other parts of the world, our vision should be to make the congenial and investment friendly atmosphere along with offering the level playing ground to domestic manufacturers so as to elevate the current growth trajectory of electronics manufacturing to new heights.

By implementing focused policies, providing financial support, and maintaining globally competitive tax regimes, India can emerge as a leader in the global electronics industry. This is the moment to harness our potential through innovation, self-reliance, and strategic planning.

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STMicroelectronics has introduced the VL53L4ED single-zone Time-of-Flight (ToF) sensor, which has an extended operating temperature range from -40°C to 105°C. Ready for harsh environments, the VL53L4ED enhances proximity detection and ranging under high ambient light conditions in applications such as industrial tools, smart-factory equipment, robot guidance systems, outdoor lighting controls, and security systems.

Expanding ST’s VL53L4 family of direct-ToF sensors, the VL53L4ED integrates a laser emitter and a single-photon avalanche-diode (SPAD) detector array in a convenient all-in-one module which ensures reliable measurement even in extreme temperature conditions. The next-generation laser provides enhanced performance in high ambient light environments and excellent short-distance ranging accuracy. In addition, the sensors embed a processor that allows power-saving autonomous operation and lowers demand for host-system resources.

ST’s new ToF sensor provides high-accuracy distance measurement to objects up to 1150mm away, throughout the entire field of view and over the full extended temperature range. Special settings allow accurate distance measurement up to 800mm under strong ambient light conditions. The VL53L4ED sensor maintains distance-measurement linearity down to 1mm and supports ranging frequency up to 100Hz.

Developers can take advantage of the X-CUBE-TOF1 expansion software package for the STM32Cube ecosystem to accelerate projects using the VL53L4 sensor family. Ready-to-use software includes as well the STSW-IMG034 driver that lets an interrupt command turn the VL53L4ED or VL53L4CD into an ultra-low-power proximity detector for user detection, system activation, and touchless control. In addition, the STSW-IMG039 software pack contains code examples for liquid-level monitoring. Hardware includes the X-NUCLEO-53L4A3 expansion board for the NUCLEO-F401RE microcontroller board, which eases running code examples and building applications, as well as the SATEL-VL53L4ED breakout board for prototyping.

All the VL53L4 sensors are pin-compatible and offered in a 4.4mm x 2.4mm x 1mm-high LGA package. The new VL53L4ED is in production now, priced from $2.3 for 4500 pieces.

For more information, please visit www.st.com/en/imaging-and-photonics-solutions/vl53l4ed.html

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