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Electronics and Electrical Engineering News, Projects & Technical Articles.
Оновлене: 1 година 1 хв тому

Controlling and Preventing Core Saturation in Inductors

2 години 38 хв тому
Core saturation is one of the main limitations on the design of magnetic components. In this article, we explore how different factors—particularly the number of turns—impact the core saturation of an inductor.

New Embedded Boards Target Edge AI, Industrial, and Digital Displays

19 годин 38 хв тому
In this roundup, we highlight three embedded boards that come in versatile form factors for various applications.

Six Misconceptions About Power Modules—Say Goodbye to Trade-Offs

Втр, 07/16/2024 - 22:00
With power modules, no one wants to have to trade-off performance for other benefits. But you don’t have to. In this article, learn about modern power module capabilities by understanding these six misconceptions.

TI Devises Size-Saving Magnetic Packaging for New Power Modules

Втр, 07/16/2024 - 16:00
Today Texas Instruments has lifted the curtain on six new DC-DC power supply modules with improved thermal, EMI, and efficiency performance.

New Sensors Target Smartphones, Industrial, and Automotive Designs

Втр, 07/16/2024 - 02:00
Samsung, Sensry, and Melexis recently announced new sensor technology and collaborations aimed at improving performance, power, and protection.

Microchip, Infineon, and Qorvo Go to Space With New Rad-Hard Devices

Пн, 07/15/2024 - 20:00
New transistors, memory devices, and RF modules defy the radiation-saturated conditions of space.

Using Permeability to Understand Magnetic Core Saturation

Ндл, 07/14/2024 - 20:00
In this article, we learn about core saturation and why it should be avoided in most applications. We then examine how different ways of defining permeability can help us predict the saturation flux density of a magnetic core.

Solid State Battery Material Offers 100x More Energy Density

Птн, 07/12/2024 - 20:00
TDK developed the new material for its rechargeable solid-state battery, supporting an energy density of 1,000 Wh/L—100 times more energy density than TDK’s current production variants.

Siemens Debuts IC Test and Analysis Tool Aimed at Sub-5 nm Process Nodes

Птн, 07/12/2024 - 03:00
Siemens’ new software can provide more insights into chip failure modes.

Allegro’s New Current Sensors Offer Alternative to Traditional Shunts

Чтв, 07/11/2024 - 22:00
The new current sensors integrate more features, reducing the need for external components.

Makers and Learners Rejoice! Arduino Debuts Plug and Make Kit

Чтв, 07/11/2024 - 16:30
In an effort to reduce the burden of wiring for learning and rapid prototyping, today Arduino has revealed a new system of plug-and-play components leveraging the new UNO R4 with Qwiic connectors and Wi-Fi.

Toshiba Demos New Switching Topology for Non-Isolated DC-DC Converters

Чтв, 07/11/2024 - 02:00
The new topology eliminates the need for a transformer and significantly reduces the number of capacitors in DC-DC converter ICs.

Moving Data Through an LTspice Parallel-Load Shift Register

Срд, 07/10/2024 - 20:00
This article demonstrates the operation of an LTspice shift register and discusses details of its schematic and timing relationships.

InspireSemi Announces Tapeout of Thunderbird Accelerated Computing Chip

Срд, 07/10/2024 - 02:00
InspireSemi’s new compute chip couples the parallel processing of GPUs with the versatility of CPUs.

Taoglas Reveals First GNSS Patch-in-a-Patch Antenna

Втр, 07/09/2024 - 20:00
The new product reduces antenna height by 50% compared to competitive offerings.

Microchip Now Offers Full Microprocessor Spectrum, From 8 to 64 Bit MPUs

Втр, 07/09/2024 - 13:00
With the ability to shift computing resources as needed, Microchip’s new 64-bit, RISC-V processors bring needed flexibility to embedded edge devices.

MIT’s Implantable Microphone May Lead to Internal Cochlear Implants

Втр, 07/09/2024 - 02:00
The new tiny biocompatible sensor may overcome one of the last cochlear implant hurdles.

ST Announces First Embedded SIM to Support New IoT Standard

Пн, 07/08/2024 - 20:00
STMicroelectronics designed its embedded SIM (eSIM) to comply with new GSMA eSIM protocols for IoT deployments.

Understanding How Laminated Cores Reduce Eddy Current Loss

Ндл, 07/07/2024 - 20:00
Eddy currents are a major loss mechanism in transformer cores. This article provides both in-depth and simplified explanations of how core laminations work to mitigate the effects of eddy currents.

Op Amps From ST, TI, and Rohm Vault Analog Design Challenges

Птн, 07/05/2024 - 20:00
Analog designers rejoice! ST, TI, and Rohm have released new op amps to address unique analog pain points.

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