AAC

In this article, we’ll use SPICE simulations to explore the theory and behavior of negative voltages.

As validation of its technology, Ethernovia recently raised a large sum in its A-round financing.

By embedding PCI Express 5.0 and CXL support, Intel’s new FPGAs seek to tackle high-bandwidth computing workloads.

The company’s new automated impedance control feature aims to make high-speed design accessible for engineers of all levels.

Despite Apple’s internal efforts, the company still needs to rely on third parties for wireless chips.

While there are differences between edge AI, end-point AI, and TinyML, each of these fields is progressing real-time processing in its own ways. Below is a roundup of recent news in these three areas.

Socionext and Techsor recently tested the indoor and outdoor performance of IoT tags using the low-power wide area network ZETA—and the results showed bright promise for asset tracking.

As USB distances increase in automotive applications, signal integrity becomes a pressing issue. Microchip has released reclocker/redriver devices to help solve this challenge.

In this article, we round up four recent UWB-related designs making a big impact on automotive child safety, keyless entry, object detection, and more.

50 years ago today, on May 22, 1973, Robert Metcalfe wrote a memo to management at Xerox Palo Alto Research Center explaining how Ethernet could work.

Learn more about dithering, namely improving the spurious-free dynamic range (SFDR) of an analog-to-digital converter (ADC) that exhibits differential nonlinearity (DNL) errors.

The new solution helps to control the temperature rise in electronic equipment.

Drone technology is experiencing a ground-up performance boost on all fronts thanks to the latest innovations from industry and academia.

The latest advances in radiation-hardened digital components have enabled the development of MCXOs that, for the first time, can replace larger, high-power-consuming OCXOs in low-earth orbit (LEO) New Space applications.

The new family of MPUs offers some unique architectural features for industrial applications.

Semiconductor companies are leveraging the properties of SiC to achieve fast switching speeds and improved isolation in new EV designs.

The CryoCMOS Consortium has demonstrated transistor models operable at 4K and 77K, opening more doors for conventional electronics to operate at cryogenic temperatures.

Learn about the RF noise figure (NF), its power gain, lossy components, and cascaded systems.

Nordic Semiconductor and IoT software company Onomondo have teamed up to eliminate traditional hardware-based SIM cards for 4G and 5G designs.