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With the automotive industry continuing to evolve, features that were once considered premium are now becoming standard. As a result, smart low-voltage motors will play an increasingly important role in shaping tomorrow’s user experience in the vehicle. Automotive manufacturers are looking for more reliable, energy-efficient and cost-effective semiconductor solutions that can work effectively even under the given harsh conditions. To address this demand, Infineon Technologies AG is now expanding its portfolio with the MOTIX Bridge BTM90xx family, a product family of full-bridge/ H-bridge integrated circuits (ICs), specifically designed for brushed DC motor applications. The new BTM90xx full-bridge ICs complement the MOTIX low-voltage motor control IC portfolio spanning from driver ICs to highly integrated system-on-chip (SoC) solutions. BTM90xx devices are not limited to but in particular optimized for automotive applications such as door, mirror, seat, body and zone control modules. Accompanying safety documentation is available to allow use also in safety relevant applications.

The BTM90xx family is characterized by a high functionality to enable intelligent and tiny motor control solutions. The devices, with a supply voltage range for normal operation of 7 V to 18 V (extended 4.5 V to 40 V) offer extensive protection and diagnostic functions such as overtemperature, undervoltage, overcurrent, cross-current or short-circuit detection. Currents are measured for both the high-side and low-side switches and the devices are suitable for automotive applications with a current limit of at least 10 A (BTM901x) or 20 A (BTM902x). PWM operation is possible for frequencies up to 20 kHz. The BTM9011EP and BTM9021EP are SPI variants and support pin-saving daisy chain function to help reduce overall system costs. BTM9021 in addition features an integrated watchdog. The BTM90xx’s tiny TSDSO-14 (4.9 x 6.0 mm) package reduces the overall PCB board space required and features a large exposed pad that simultaneously improves the device’s thermal performance.

To simplify the evaluation and design-in process for MOTIX BTM90xx, Infineon also provides a comprehensive support package, including technical product documentation, simulation models, a tool for calculating power dissipation, evaluation boards and Arduino example code. In addition, software (MOTIX BTM90xx Device Driver) and the MOTIX Full Bridge IC Configuration Wizard are available for free at the Infineon Developer Center (IDC).

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In the ever-expanding digital landscape, the terms “cybersecurity” and “ethical hacking” often get tossed around interchangeably. While both disciplines share a common goal – protecting our valuable data and systems from malicious actors – their approaches and objectives diverge significantly. Understanding these distinctions is crucial for navigating the complex terrain of the digital frontier.

Cybersecurity: Building the Fortress

Cybersecurity can be likened to a meticulously constructed fortress, safeguarding our digital assets from unauthorized access, theft, disruption, modification, or destruction. It encompasses a comprehensive set of strategies, technologies, and practices designed to deter, detect, and mitigate cyberattacks.

• Defense in Depth: Cybersecurity professionals employ a layered defense approach, akin to building multiple walls around a castle. This includes firewalls, intrusion detection/prevention systems (IDS/IPS), data encryption, access controls, and user education. Each layer serves as a barrier, making it progressively harder for attackers to breach the system.
• Continuous Monitoring: Vigilance is paramount in cybersecurity. Security professionals constantly monitor network activity, system logs, and user behavior for anomalies that might indicate a potential attack. Security Information and Event Management (SIEM) systems play a vital role in this ongoing process, aggregating data from various sources and providing real-time insights into potential threats.
• Incident Response: Despite the best-laid plans, cyberattacks can still occur. Cybersecurity professionals develop and implement incident response plans to effectively respond to security breaches. These plans outline procedures for containing the damage, eradicating the threat, and restoring affected systems.

Ethical Hacking: Testing the Walls

Ethical hacking, on the other hand, embodies a proactive approach to cybersecurity. Ethical hackers, also known as white hat hackers or penetration testers, are security professionals who are authorized to simulate cyberattacks on a system or network. Their objective is to identify vulnerabilities that malicious actors might exploit and recommend appropriate security measures to address them.

• Vulnerability Assessment and Penetration Testing (VAPT): This is the cornerstone of ethical hacking. Ethical hackers employ a variety of tools and techniques, mirroring those used by real-world attackers, to probe for weaknesses in systems and networks. They may attempt to gain unauthorized access, exploit software vulnerabilities, or bypass security controls.
• Social Engineering Assessments: Ethical hackers don’t just focus on technical vulnerabilities. They also assess the human element of security by conducting social engineering simulations. This involves mimicking tactics used by attackers, such as phishing emails or pretext calls, to evaluate employee awareness and susceptibility to social engineering attacks.
• Red Teaming and Purple Teaming: Ethical hacking can be taken a step further through red teaming and purple teaming exercises. Red teaming exercises simulate a full-blown cyberattack, allowing organizations to assess their overall security posture and response capabilities. Purple teaming exercises involve collaboration between ethical hackers and security teams, fostering communication and knowledge sharing to strengthen the organization’s defenses.

The Synergy Between Cybersecurity and Ethical Hacking

While cybersecurity and ethical hacking operate on different sides of the digital security spectrum, they share a symbiotic relationship. Cybersecurity professionals rely on the insights gleaned from ethical hacking to identify and address vulnerabilities before they can be exploited by malicious actors. Ethical hackers, in turn, depend on a strong understanding of cybersecurity principles and best practices to effectively simulate real-world attacks.

Key Distinctions: A Comparative Analysis

• Objectives: Cybersecurity aims to defend systems and data from unauthorized access and attacks. Ethical hacking, on the other hand, proactively identifies vulnerabilities in systems to improve security posture.
• Methodology: Cybersecurity professionals employ a defensive approach, deploying security tools and monitoring systems for suspicious activity. Ethical hackers take an offensive stance, simulating attacks to uncover vulnerabilities.
• Legality: Cybersecurity activities are always legal and authorized. Ethical hacking is legal only when conducted with explicit permission from the system or network owner.
• Outcomes: Effective cybersecurity practices minimize the risk of cyberattacks. Ethical hacking identifies vulnerabilities that can be addressed to strengthen overall security.

The Evolving Landscape: The Rise of Bug Bounties

The recognition of the value of ethical hacking has led to the emergence of bug bounty programs. These programs incentivize security researchers to identify and report vulnerabilities in software or systems. Organizations can leverage these programs to discover and address vulnerabilities before they are exploited by malicious actors.

Conclusion: A United Front in the Digital Age

Cybersecurity and ethical hacking, though distinct disciplines, are both essential components of a comprehensive digital security strategy. By combining the proactive vulnerability identification of ethical hacking with the defensive measures of cybersecurity, organizations can create a robust and innovative security ecosystem that can adapt to the rapidly changing threat landscape and safeguard our increasingly interconnected digital world.

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The Internet of Things (IoT), a revolutionary concept seamlessly intertwining the physical and digital realms, is no longer a distant futuristic vision but a rapidly unfolding reality. At its core, IoT represents a vast network of interconnected devices—ranging from the mundane to the extraordinary—imbued with the ability to sense, communicate, and act upon their environment. From wearable fitness trackers and household appliances to industrial machinery and precision agricultural tools, IoT’s potential to transform our world is profound and unprecedented.

The Foundation of Connectivity: Data as the Lifeblood

The genesis of IoT lies in its capacity to generate, collect, and utilize data. Embedded within these interconnected devices are arrays of sensors—meticulously designed instruments that monitor a myriad of parameters such as temperature, humidity, motion, location, and more. These sensors act as the IoT’s nervous system, continuously gathering data from their environment. Once collected, this raw data becomes the lifeblood of IoT, driving transformative applications across various industries.

However, the process doesn’t end with data collection. IoT’s effectiveness depends heavily on its ability to transmit this data reliably and efficiently. The advent of high-speed networks, particularly 5G technology, has proven instrumental in this endeavor. With its ultra-low latency, high data transfer speeds, and capacity to connect billions of devices simultaneously, 5G serves as the critical backbone for real-time data exchange. This capability is crucial for applications like autonomous vehicles, which rely on instantaneous communication with traffic signals and other vehicles, or remote surgical procedures that demand precise, latency-free control.

The Intelligence Quotient: AI and Machine Learning

While the collection and transmission of data form the foundational layers of IoT, the true transformative power lies in intelligent data processing and interpretation. Artificial Intelligence (AI) and Machine Learning (ML) algorithms are pivotal in this aspect, acting as the cognitive engines of IoT.

AI systems analyze massive datasets to uncover intricate patterns and predict future outcomes. For instance, in manufacturing, AI-powered predictive analytics can monitor sensor data from industrial equipment to forecast potential failures, enabling proactive maintenance and minimizing costly downtime. Similarly, in smart cities, AI algorithms analyze traffic flow and identify congestion hotspots, optimizing traffic management systems to reduce delays and improve urban mobility.

Machine Learning models also enhance IoT by enabling devices to adapt to changing conditions over time. Smart thermostats, for example, learn user preferences and environmental patterns to optimize energy consumption without manual intervention.

A Tapestry of Applications: Weaving a Smarter World

IoT’s impact extends across multiple industries, each leveraging its potential to innovate and optimize operations.

1. Smart Cities

IoT technologies are integral to building smart cities, where interconnected systems manage resources efficiently and sustainably. Smart grids optimize energy distribution, intelligent traffic systems reduce congestion, and IoT-enabled sensors monitor air quality to improve urban health standards. Cities like Singapore and Barcelona have already implemented IoT solutions to enhance public safety, transportation, and energy efficiency.

2. Healthcare

In healthcare, IoT has revolutionized patient care through wearable devices and remote monitoring systems. These devices collect real-time health data, such as heart rate, blood pressure, and glucose levels, enabling personalized and proactive medical interventions. Remote monitoring also allows healthcare providers to track patients’ conditions outside hospital settings, reducing costs and improving accessibility.

3. Industrial Automation

The Industrial Internet of Things (IIoT) is driving significant advancements in manufacturing and supply chain management. Smart factories utilize interconnected machines to monitor production processes, detect anomalies, and optimize workflows. Predictive maintenance powered by IoT sensors reduces equipment downtime, while real-time tracking enhances inventory management and logistics.

4. Agriculture

Precision agriculture leverages IoT-enabled sensors to monitor soil moisture, weather conditions, and crop health. Farmers can optimize irrigation schedules, apply fertilizers more effectively, and predict pest infestations, leading to higher yields and reduced environmental impact. These technologies are especially valuable in addressing the challenges of food security and climate change.

5. Consumer Electronics

Smart home devices, such as voice-activated assistants, connected lighting systems, and intelligent appliances, have become mainstream. These devices enhance convenience and energy efficiency, creating personalized living environments for users.

The Future of IoT: A Horizon of Possibilities

The evolution of IoT is an ongoing journey fueled by technological innovation. Several key trends are shaping its future:

1. Edge Computing

As the volume of data generated by IoT devices continues to explode, the need for decentralized processing becomes critical. Edge computing addresses this challenge by processing data closer to its source, reducing latency and bandwidth requirements. Applications such as autonomous vehicles and industrial automation greatly benefit from the responsiveness enabled by edge computing.

2. Blockchain Technology

Blockchain’s inherent security and transparency make it a valuable tool for IoT. By providing tamper-proof data storage and secure transaction mechanisms, blockchain enhances trust within the IoT ecosystem. This is particularly important for applications involving sensitive data, such as healthcare and finance.

3. Low-Power Wide-Area Networks (LPWAN)

Technologies like LoRaWAN and NB-IoT are expanding the reach of IoT into remote and challenging environments. These networks enable long-range communication for battery-powered devices, supporting applications in agriculture, logistics, and environmental monitoring.

4. Interoperability and Standards

The diverse array of devices and platforms in the IoT ecosystem necessitates standardized communication protocols. Efforts to establish universal standards will be critical for ensuring seamless integration and scalability across different IoT applications.

5. Sustainability

As IoT adoption grows, so does its environmental impact. The development of energy-efficient devices, sustainable manufacturing practices, and recycling programs for IoT components will be essential to mitigate this impact.

Challenges and Considerations

Despite its potential, IoT faces several challenges that must be addressed:

• Security and Privacy: With billions of connected devices, the risk of cyber-attacks and data breaches is significant. Implementing robust security measures, such as encryption and real-time threat detection, is crucial.
• Scalability: Managing the massive influx of IoT devices and data requires scalable infrastructure and efficient resource allocation.
• Cost and Accessibility: The initial investment in IoT infrastructure can be prohibitive for smaller organizations, underscoring the need for cost-effective solutions.
• Regulatory Compliance: As IoT applications intersect with various industries, ensuring compliance with regulatory standards is a complex yet essential task.

Conclusion

The Internet of Things represents a paradigm shift, a convergence of technology, data, and intelligence poised to reshape our world. By harnessing the power of interconnected devices, AI-driven insights, and robust communication networks, IoT has the potential to create a smarter, more sustainable future. From optimizing urban living to revolutionizing healthcare and agriculture, the applications of IoT are as diverse as they are impactful.

As we continue to navigate this transformative era, addressing challenges such as security, interoperability, and sustainability will be paramount. With continued innovation and collaboration, IoT stands ready to enrich the human experience, weaving a tapestry of connectivity and intelligence that defines the future.

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• STMicroelectronics has been awarded “Top Employer Global” certification for the first time
• 17 companies in the world have obtained this international certification for 2025
• ST entities in 41 countries certified as Top Employer

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has been recognized for the first time as a global Top Employer for 2025 by Top Employers Institute.

This year STMicroelectronics was one of only 17 global Top Employers to be recognized by Top Employers Institute for their outstanding HR policies and practices worldwide, covering ST entities in 41 countries. The Top Employers Institute program certifies organizations based on the participation and results of their HR Best Practices Survey. STMicroelectronics was distinguished in this ranking thanks to a continuous improvement approach and stands out particularly in the themes of Ethics & Integrity, Purpose & Values, Organization & Change, Business Strategy, and Performance.

“A couple of years ago, we began a people-centric transformation to enhance our leadership culture, simplify and digitalize people processes, with the employee journey and experience as our north star. Achieving the Top Employer Global certification confirms that our efforts are well-directed, and that ST is a place where every talent can thrive, regardless of their career stage or perspective,” said Rajita D’Souza, President, Human Resources & Corporate Social Responsibility, STMicroelectronics.

“We’re excited that STMicroelectronics certified as a global Top Employer for the first time. They have particularly showcased their strengths in areas such as Organisation & Change, Ethics & Integrity, Purpose & Values and Business Strategy. This Certification shows ST’s commitment to creating a better world of work through their HR initiatives and practices, by demonstrating how they support their colleagues across 41 countries,” said David Plink, CEO Top Employers Institute.

The Top Employers Institute survey, followed by validation and audit, covers six HR domains consisting of 20 topics including People Strategy, Work Environment, Talent Acquisition, Learning, Diversity & Inclusion, Wellbeing and more. The program has certified and recognized over 2,400 Top Employers in 125 countries/regions across five continents.

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Author: STMicroelectronics

As ST recently released X-CUBE-MCSDK 6.3.2, let us delve into its firmware libraries and its Graphical User Interface (GUI) to see how it can help create motor control applications. Designed for permanent magnet synchronous (PMSM) and BLDC motors using FOC (Field-oriented control) or 6-steps, it has gained popularity since we launched it in 2018 because it helps engineers bring their solutions to market faster. For instance, the algorithms from ST will maximize efficiency and facilitate the implementation of critical features like on-the-fly startup for air conditioning fans, a single shunt for cost-effective solutions, flux weakening for washing machines, and a rotor’s angular position detection for sensorless applications.

X-CUBE-MCSDK: Latest highlights HSO

Over the years, X-CUBE-MCSDK has received new algorithms that have changed what is capable on BLDC motors and PMSM, such as HSO or high-sensitivity observer. In a nutshell, HSO is a field-oriented control algorithm that enables an application to figure out the rotor’s position and speed without needing a sensor. It’s particularly useful with PMSM sensorless motors running at low speeds in home appliances, for instance, because cost is such a critical factor. To attract new customers, manufacturers must lower their bill of materials, which means doing away with sensors and using more cost-effective MCUs, like an STM32G4. By using HSO, engineers can meet those constraints.

ZeST

ZeST (zero-speed full torque) is another algorithm meant to optimize the operations of sensorless motors by enabling them to recover from a complete stop. Combined with HSO, it can detect when a motor is no longer rotating and immediately resume operations. Accordingly, since most applications don’t need to know if a motor has ceased turning, most developers will only need to use HSO, which has been available in X-CUBE-SDK since version 6.2. However, engineers working on applications that could use ZeST can reach out to their local ST representative and seek to enable the STM32 ZeST and implement the feature in their application.

The idea behind HSO and ZeST isn’t new, and more seasoned engineers will be familiar with the phase-locked loop (PLL) observer, a technique (also found in X-CUBE-MCSDK) that determines the rotor position and speed without a sensor. However, combining HSO and ZeST helps alleviate some of PLL’s shortcomings, such as its inability to work under a minimum motor speed. Additionally, HSO and ZeST take advantage of the STM32G4 to run without maximizing CPU usage, despite how advanced these algorithms are. HSO and ZeST also have a shorter start-up time and do not generate high peak current, resulting in an energy saving between 15% and 40% in a typical washing machine application.

Regular updates

X-CUBE-MCSDK receives regular updates. Before version 6.3.1 in September 2024, we launched version 6.3 in May 2024, which brought support for new MCUs, like the STM32C0, our new entry-level device, and new STSPIN32 devices like the STSPIN32G4. It also added a new Board Designer tool and the ability to spec user boards using JSON to simplify developments. And while all versions of X-CUBE-MCSDK are mindful of legacy support, previous versions have also brought new features like BLCD six-step motors, monitoring, and profiling. Put simply, X-CUBE-MCSDK is a unique way to create motor control applications because it demystifies complex notions and makes modern algorithms and development paradigms more accessible.

X-CUBE-MCSDK and its robust firmware architecture Motor Control Libraries now based on STM32Cube

A significant advantage of the new SDK resides in the use of a different programming paradigm to ensure developers get a code that is a lot easier to customize and debug. Before X-CUBE-MCSDK, certain aspects of our libraries used object-oriented concepts inherited from C++. We rewrote them to something more approachable in C to simplify application development. For example, we no longer cast some expressions to void, a popular method in C++ to suppress compiler warnings, but that tends to complicate debugging operations drastically. Porting libraries to C also helped optimize applications as teams can more easily improve performance and efficiency.

X-CUBE-MCSDK was thus a major internal overhaul accompanied by massive updates to our SDK’s libraries. Indeed, previous versions used older code that was no longer standard on STM32 MCUs. STM32Cube is the de facto solution for all developments on our microcontrollers. It offers Hardware Abstraction Layers (HAL), increases portability between STM32 MCUs, and offers low-level APIs, drivers, and other Middleware components to make the ST ecosystem more accessible and efficient. X-CUBE-MCSDK brought the same standard libraries, so developers familiar with STM32Cube could have a much easier time with the code and reuse a significant chunk of their application from one project to the next.

X-CUBE-MCSDK and its flexible GUI Interface of STM32CubeMX

Aside from internal modifications that may not always be obvious, the new SDK works in conjunction with STM32CubeMX. Indeed, X-CUBE-MCSDK still uses MC-Workbench, a graphical tool where engineers can enter their motor and sensors’ parameters to generate custom code for their setup. When developers want to change the preselected configuration, such as the STM32 part number, the pinout configuration, the clock configuration, or add peripherals for new communication interfaces, they can more easily generate a new code for their application by using STM32CubeMX. They are also free to customize projects and add custom code (extra PID control loop, for instance) within tags created by STM32CubeMX.

The ST Community is fond of the STM32CubeMX configuration tool because it uses STM32Cube libraries and an intuitive interface to quickly generate header files, taking complex design operations out of developers’ hands. Using a step-by-step process, it’s easy to configure pinouts, clock trees, and peripherals, as well as resolve conflicts, among other things. If designers working on a motor control application decide to use another MCU in the middle of their prototyping phase, they will merely need to open STM32CubeMX, and will much more quickly port the work done on the previous MCU. X-CUBE-MCSDK thus brought a new level of flexibility.

ST teams are already working on the next updates. In the meantime, the best way to start working on a motor control solution is to check out our dedicated Wiki and ask questions on our Community forum. The Wiki will guide users by showing them how to run example applications on ST development boards to hasten prototyping. It’s also a quick way to see how we implemented our libraries and can thus serve as the basis for a project. For instance, the page on the six-step algorithm helps engineers with less experience understand what is happening while also providing a walkthrough of the GUI and compatible boards.

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Renesas 100-V N-channel MOSFETs leverage an improved wafer manufacturing process with split gate technology, reducing on-resistance (RDS(on)) by 30%. The REXFET-1 process also cuts total gate charge (Qg) by 10% and gate-to-drain charge (Qgd) by 40%, according to the company.

Designed for high-power applications, these MOSFETs provide high-current switching in motor control, battery management systems, power management, and charging. Typical end products include electric vehicles, e-bikes, charging stations, power tools, and uninterruptible power supplies.

Both the RBA300N10EANS and RBA300N10EHPF MOSFETs feature a standard gate drive voltage of 2.0 V to 4.0 V. Other key specifications include an RDS(on) of 1.5 mΩ, drain current (ID) of 340 A, Qg of 170 nC, and Qgd of 30 nC.

In addition to enhanced electrical characteristics, the RBA300N10EANS and RBA300N10EHPF MOSFETs are offered in TOLL and TOLG packages, respectively. These packages are pin-compatible with devices from other manufacturers and 50% smaller than conventional TO-263 packages. The TOLL package also has wettable flanks for optical inspection.

The RBA300N10EANS and RBA300N10EHPF MOSFETs are now available in production volumes. Renesas also offers a reference design and application note to help shorten design cycles.

RBA300N10EANS product page

RBA300N10EHPF product page

Renesas Electronics 

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EPC offers a GaN-based motor drive inverter reference design for industrial and battery-powered applications. The EPC91200 demonstration board, built for 3-phase brushless DC motors, integrates the EPC2305, a 150-V, 3.0-mΩ GaN FET.

With a wide input voltage range of 30 V to 130 V, the EPC91200 supports 80-V and 110-V battery systems in industrial automation and material handling equipment. It delivers up to 40 ARMS (60 A pk) of output current and operates at PWM switching frequencies up to 150 kHz, demonstrating GaN technology’s efficiency, reliability, and adaptability in power systems.

An optimized PCB layout and GaN technology minimize resistance and heat generation, enhancing performance. The 130×100-mm demo board features current sensing, voltage monitoring, overcurrent protection, and temperature sensing. It also includes a preconfigured shaft encoder/Hall sensor interface and supports field-oriented control. Compatible with various controller boards from STMicroelectronics, Texas Instruments, and Microchip, the EPC91200 offers broad integration flexibility.

The EPC91200 reference design board costs $812.50 and is available from Digi-Key.

EPC91200 product page

Efficient Power Conversion 

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Built on a wide-bandgap GaN HEMT process, Teledyne’s TDSW84230EP reflective SPDT switch covers 30 MHz to 5 GHz, handling 20 W of continuous power. It is intended to replace PIN diode-based RF switches commonly used in the RF front ends of tactical and military communication radios.

The TDSW84230EP tolerates up to 900 mA/mm of saturation current, leveraging GaN’s high breakdown voltage and carrier density. Encased in a compact 3×3×0.8-mm, 16-pin QFN package, it offers 0.2-dB insertion loss and 45-dB port isolation, providing enhanced efficiency and saving board space over PIN diode architectures.

Qualified for operation over the military temperature range of -55°C to +125°C, the TDSW84230EP requires a positive supply voltage of 2.6 V to 5.25 V. Its internal charge pump is disabled to eliminate charge pump spurs in low-noise applications, while a -18-V supply is needed on the VCP pin.

The TDSW84230EP GaN RF switch is available now in commercial versions from Teledyne HiRel and authorized distributors.

TDSW84230EP product page 

Teledyne HiRel Semiconductors 

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At this month’s CES 2025 show, Murata unveiled what is claimed to be the world’s smallest 006003-inch (0.16×0.08 mm) chip inductor. This development offers a 75% volume reduction compared to the previous smallest product, the 008004-inch (0.25×0.125 mm) inductor.

“Following our success in introducing the world’s smallest multilayer ceramic capacitor (MLCC) in September 2024, our engineering teams are now developing a pioneering 006003-inch size chip inductor to further meet market demands,” says Takaomi Toi, general manager of Inductor Product Development at Murata Manufacturing.

“With the creation of the world’s smallest class prototype, we’re confident that this product represents an exciting addition to Murata’s extensive portfolio of market-leading chip inductors. This development continues to demonstrate Murata’s commitment to innovation and also marks a significant milestone in our quest to support the miniaturization and enhanced functionality of future electronic devices,” Toi said.

For more information about this chip inductor development, please contact Murata here.

Murata Manufacturing

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GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet Summit, GENIO EVO is the second generation of MZ’s flagship GENIO cross-fabric platform for system design. Like its predecessor, GENIO EVO enables co-design of chiplets, dies, silicon interposers, packages, and surrounding PCBs to meet area, power, and performance targets.

GENIO EVO integrates seamlessly with existing commercial implementation platforms or custom EDA flows through plugins. Operating at the architectural level, it provides optimal system choices for 2.5D or 3D multi-die designs. A new user interface supports a cross-hierarchical, 3D-aware design methodology that streamlines the system design process. By integrating IC and advanced packaging design, it ensures full system-level optimization, shorter design cycles, faster time-to-manufacturing, and improved yields.

The platform identifies and analyzes thermal and mechanical failures. It supports architectural exploration and what-if analysis in the early design stages to improve implementation predictability. By planning and managing high-pin-count interconnects in complex multi-fabric designs, it anticipates and avoids downstream thermal and mechanical issues.

GENIO EVO is available for immediate licensing. For more information, click the link below.

MZ Technologies

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Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which develops and manufactures radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — has formally released the GRF0020D and GRF0030D, the first in a new class of GaN-on-SiC HEMT power amplifiers being developed by the company...

Whether its buck, boost, or buck/boost, internal or external switch, milliamps or tens of amps, a literal cornucopia of programmable output switching regulator/converter chips are commercially available. While the required external Ls and Cs (of course) vary wildly from topology to topology and chip to chip, (almost) all use exactly the same basic two-resistor network for output voltage programming shown in Figure 1. Its example buck type regulator was picked more or less arbitrarily, so please ignore the L and Cs and just focus on R1, R2, and (later) R3.

Figure 1 The (almost) universal regulator output programming network where Vout = Vsense(R1/R2 + 1) = 0.8v*(11.5 + 1) = 10v.

Wow the engineering world with your unique design: Design Ideas Submission Guide

For reasons known only to gurus of the mystic and marvelous monolithic realm, the precision Vsense feedback node voltage varies from type to type over a roughly 3:1 range from 0.50v to 1.5v. Recommended values for R1 vary too. 

The point is the topology doesn’t vary. All (or at least most) conform faithfully to Figure 1. This surprising uniformity becomes very useful if your application requires DAC control of the output voltage. See Figure 2 for how this can be done with a positive polarity DAC and just one added resistor: R3.

Figure 2 Regulator output programming with a DAC and the KISS1 network where Vout = (Vc)*(R1/R2) = (2.5 to 0v) 4 = 0 to 10v.

Given reasonable choices for the DAC (e.g., 2.5v), numbers for R1 and Vsense from the regulator chip datasheet, and Vomax from your application requirements, here’s the KISS1 arithmetic:

1. R2 = R1 Vcmax/Vomax
2. R3 = R1/(Vomax/Vsense – R1/R2 – 1)

And, in the grand tradition of the KISS1 principle, that’s it. Ok, ok. Except maybe for a couple of (minor?) caveats. For example:

1. Expression 2 above, and therefore the necessary value for R3, must shake out positive. I can’t think of a practical case where it wouldn’t, but there’s probably some perverse permutation of parameters out there where it won’t, and implementing negative resistors isn’t particularly simple.
2. The relation between Vout and Vc is inverse. So, the digital version of Vc must be 1’s complemented (a totally KISS-bit of software arithmetic to flip all the bits, so 0s become 1s, and 1s become 0s) before being written to the DAC register.
3. Vin must be adequate for the chosen chip to generate the chosen Vomax when Vc = 0. Duh.

So maybe it’s not really totally KISS1, just mostly.

1 Famous KISS principle: Is a footnote really necessary?

Stephen Woodward’s relationship with EDN’s DI column goes back quite a long way. Over 100 submissions have been accepted since his first contribution back in 1974.

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• Designing with a DAC: Settle for the best

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Multi-national industrial and energy company METLEN Energy & Metals of Athens, Greece – which operates the only vertically integrated bauxite, alumina and primary aluminium production unit in the European Union (EU) with privately owned port facilities – says that the Metallurgy Committee, in a joint session with the Capital Allocation Committee, has made the final investment decision (FID) to proceed with implementing a new €295.5m plan for the production of bauxite, alumina and gallium...

The Vermont Gallium Nitride (V-GaN) Tech Hub — a consortium led by the University of Vermont (UVM) and including GlobalFoundries and the State of Vermont — has been awarded $23.7m in federal funding from the US Economic Development Administration (EDA)...

DC-to-DC converters are electronic devices that change one DC voltage level to another. They are widely used in power supplies for electronic devices, electric vehicles, and renewable energy systems. Here are the main types:

1. Linear Regulators:
   • Simple and cost-effective.
   • Converts excess voltage into heat, making them inefficient for large voltage differences.
   • Example: Low Dropout Regulators (LDO).
2. Switching Converters:
   • Efficient and suitable for large voltage differences.
   • Types:
     • Buck Converter (Step-Down):
       • Reduces input voltage to a lower output voltage.
     • Boost Converter (Step-Up):
       • Increases input voltage to a higher output voltage.
     • Buck-Boost Converter:
       • Can increase or decrease voltage depending on the configuration.
     • Cuk Converter:
       • Provides an inverted output voltage and regulates it.
     • SEPIC (Single-Ended Primary Inductor Converter):
       • Allows for voltage output either higher or lower than the input.
     • Flyback Converter:
       • Common in isolated power supplies for low-power applications.
     • Push-Pull Converter:
       • Symmetrical design for higher power and efficient isolation.
3. Charge Pump Converters:
   • Use capacitors for energy storage and voltage conversion.
   • Lightweight and efficient for low-power applications.
4. Isolated Converters:
   • Separate the input and output using transformers or optocouplers for safety.
   • Examples: Flyback and Forward Converters.

DC-to-DC Conversion Formula

The power balance principle is used to derive relationships in DC-to-DC converters. The formulas vary based on the converter type:

DC-to-DC Converter Examples

1. Consumer Electronics:
   • USB power adapters using buck converters to step down 12V to 5V.
2. Automotive:
   • Electric vehicles use DC-DC converters for powering 12V systems from a high-voltage battery pack (e.g., 400V or 800V).
3. Renewable Energy:
   • Solar power systems employ boost converters to increase panel voltage for battery charging.
4. Data Centers:
   • Intermediate bus architectures use isolated converters to step down 48V to server-operable voltages (e.g., 12V or 5V).
5. Industrial:
   • Power supplies for robotics and sensors using isolated flyback converters for safety.

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Nuvoton Technology Corporation Japan (NTCJ) announced today the launch of its industry-leading(*) indigo semiconductor laser, which emits an optical output power of 1.7 W and a wavelength of 420 nm. This product contributes to the miniaturization and cost reduction of optical systems. Additionally, when combined with our mass-produced ultraviolet semiconductor lasers (378 nm) and violet semiconductor lasers (402 nm), it serves as an alternative light source solution to mercury lamps, contributing to the realization of a sustainable society.

(*) As of January 15, 2025, based on our research of semiconductor lasers emitting at a wavelength of 420 nm.

Achievements:

• Achieves industry-leading optical output power of 1.7 W at a wavelength of 420 nm, contributing to increased design flexibility and miniaturization of optical systems.
• Realizes high efficiency and long-term reliability through proprietary optical design and heat dissipation technology, reducing the running costs of optical systems.
• By combining this product with existing mass-produced products, it is possible to provide alternative light source solutions to mercury lamps.

Mercury lamps emit bright lines of light such as the i-line (365 nm), h-line (405 nm), and g-line (436 nm) [2], and are used as industrial light sources for applications such as resin curing and exposure. However, the mercury lamps have technical challenges including large light source size and high power consumption. Additionally, since they use mercury, mercury lamps are subject to regulations in Japan and other countries because of health and environmental concerns. Therefore, alternative light sources are expected to be developed.

Aiming to replace the mercury lamps, we have been developing high-efficiency and long-term reliability semiconductor lasers. We have now started mass production of an industry-leading indigo semiconductor laser with an optical output power of 1.7 W at a wavelength of 420 nm, close to the g-line of the mercury lamps. This new product achieves both high efficiency and long-term reliability through proprietary optical design and heat dissipation technology. Furthermore, by combining it with our already mass-produced ultraviolet semiconductor lasers (378 nm) and violet semiconductor lasers (402 nm), we can provide alternative light source solutions to the mercury lamps, contributing to the realization of a sustainable society.

Details of the new product and alternative light source solutions to the mercury lamps will be exhibited at our booth at SPIE Photonics West 2025 in San Francisco, USA, and LASER World of PHOTONICS 2025 in Munich, Germany. We look forward to welcoming you.

Features:

• Achieves industry-leading optical output power of 1.7 W at a wavelength of 420 nm, contributing to increased design flexibility and miniaturization of optical systems.

This product achieves an industry-leading optical output power of 1.7 W at a wavelength of 420 nm, close to the g-line of mercury lamps, in a compact TO-56 CAN package [3]. Using this high-output, compact product enhances the design flexibility of light source devices, enabling the development of smaller light source devices compared to the mercury lamps.

• Realizes high efficiency and long-term reliability through proprietary optical design and heat dissipation technology, reducing the running costs of optical systems.

With over 40 years of experience and more than 3 billion semiconductor lasers shipped for optical discs, we have developed extensive design and manufacturing expertise in semiconductor lasers. Our newly developed indigo semiconductor laser integrates proprietary optical design and heat dissipation technology, achieving both high efficiency and long-term reliability. Compared to the mercury lamps, this reduces power consumption and the frequency of light source replacements, thereby lowering the running costs of light sources.

• By combining this product with existing mass-produced products, it is possible to provide alternative light source solutions to mercury lamps.

This product, which emits laser light at a wavelength of 420 nm close to the g-line of mercury lamps, can be combined with our mass-produced ultraviolet semiconductor lasers (378 nm) and violet semiconductor lasers (402 nm) to serve as alternative light sources for the i-line (365 nm), h-line (405 nm), and g-line (436 nm) of mercury lamps. Additionally, by adjusting the output power ratio of each semiconductor laser according to the application, it is possible to achieve highly flexible optical designs that were not possible with the mercury lamps.

Applications:

Alternative light sources for mercury lamps, Laser Direct Imaging (LDI) light sources [4], laser welding processing light sources, 3D printer light sources, etc.

Product name: KLC420FS01WW

Specification:

Part number	KLC420FS01WW
Wavelength	420 nm
Output power	1.7 W
Package type	TO-56 CAN

Alternative light source solution to mercury lamps Definitions:

[1] Indigo Semiconductor Laser:

Our term for semiconductor lasers that emit laser light with a peak wavelength approximately in the range of 420 nm to 440 nm.

[2] i-line, h-line, g-line:

Names of the bright lines of mercury lamps, with emission peaks at 365 nm, 405 nm, and 436 nm, respectively.

[3] TO-56 CAN:

An industry-standard CAN-type package with a diameter of 5.6 mm.

[4] Laser Direct Imaging (LDI):

A technology that uses lasers to directly expose circuit patterns onto substrates.

SPIE Photonics West 2025

The world’s largest optics and photonics exhibition, organized by the international society for optics and photonics, SPIE, will be held in San Francisco, USA, from Tuesday, January 28 to Thursday, January 30, 2025. This event will showcase the latest optical technologies, including lasers and optical devices.

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INDIA – Keysight Technologies, Inc. launched AppFusion, a network visibility partner program that integrates third-party security and monitoring solutions directly into its network packet brokers. The program integrates market-leading technologies from Forescout, Instrumentix, and Nozomi Networks, enabling customers to streamline network and security operations (NetOps/SecOps) while significantly reducing infrastructure costs. This all-in-one, multi-vendor solution helps IT professionals reduce capital and operational expenses while improving security monitoring and performance.

Enterprise IT and security operations (SecOps) teams need real-time network traffic monitoring to troubleshoot performance issues, detect cyber threats, and maintain operational scale and compliance. Traditionally, this required separate hardware appliances, each running different monitoring tools. Keysight’s Vision Network Packet Brokers eliminate this complexity by integrating partner software directly into a single hardware platform.

Key benefits of AppFusion include:

• Significant reduction in hardware costs by consolidating multiple servers into one Vision appliance.
• Simplified deployment with pre-integrated, best-in-class security solutions.
• Centralized management through a single interface for all monitoring tools.
• Easy scalability with on-demand activation of additional monitoring capabilities.

“The more technology providers integrate and deliver complete solutions, the less time IT and security teams need to spend configuring and managing performance and security,” says Recep Ozdag, Vice President and General Manager, Network Visibility Solutions at Keysight. “Our new partner integration program fuses network visibility and monitoring in a new way to streamline deployment of complete, cost-efficient monitoring solutions for real-time threat detection and troubleshooting of performance issues.”

Initial AppFusion integrations include:

• Forescout platform with eyeInspect security monitoring technology.
• Instrumentix xMetrics trade flow performance monitoring and analytics software.
• Nozomi Networks’ AI-powered security and risk management solutions.

“Forescout has a long history of providing market-leading OT solutions to the most security-conscious organizations in the world. We’re extremely pleased to partner with Keysight on their AppFusion program,” says Rob McNutt, Chief Strategy Officer at Forescout. “Deploying the Forescout Platform within a visibility fabric delivers an unparalleled and comprehensive view that reduces blind spots and monitoring bottlenecks to fortify security across IT, operational technology (OT), internet of things (IoT), and internet of medical things (IOMT) environments.”

As with OT and IoT environments, the financial markets sector benefits from tightly integrated visibility and monitoring solutions. “Time is money in financial markets, where nanoseconds of delay can impact the value of trades,” says Clive Posselt, Commercial Director at Instrumentix, a newly announced Keysight alliance partner. “Delivering our xMetrics trade flow monitoring software onboard a Keysight visibility appliance can provide the buy and sell side, as well as exchanges and other liquidity venues, real-time access to the most reliable trade plant performance data, so they can optimize execution outcomes and differentiate their services.”

Chet Namboodri, Nozomi Networks Senior Vice President of Global Business Development, concurs: “Cyber-physical systems in enterprise and industrial environments require equal and, in many cases, higher performance levels for security monitoring and risk management than traditional IT networks. Integrating Nozomi Networks’ AI-powered security and risk management solutions with Keysight appliances saves customers time and money while achieving the most reliable, innovative, and highest caliber of threat monitoring and risk management available for OT, IoT, and cyber-physical systems.”

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Bluetest and Rohde & Schwarz extend their long-established collaboration and have integrated the Wi-Fi 7 test functionality of the R&S CMX500 one-box signaling tester into the Bluetest Flow control software. Now, developers and manufacturers of next-generation WLAN technology can use the Bluetest reverberation test systems (RTS) to perform MIMO stress testing of IEEE 802.11be stations as well as access points under realistic conditions.

Bluetest specializes in reverberation chambers, such as the RTS65, which are designed for efficient over-the-air performance evaluation of wireless devices. In contrast to anechoic test chambers, reverberation chambers extensively reflect an RF signal inside the chamber, creating a Rayleigh faded multipath RF environment. This environment closely mirrors real-world indoor and city conditions, making it ideal for evaluating the antenna and radio performance of modern multi-antenna (MIMO) and multi-carrier devices as used in WLAN, 4G, and 5G.

The setup is operated using the Bluetest Flow control software, an integrated test environment for complex wireless solutions. By integrating the Wi-Fi 7 test functionality of the R&S CMX500 one-box signaling tester into the Bluetest Flow software, WLAN developers utilizing the R&S CMX500 can now leverage Bluetest’s reverberation chamber technology in the development of their advanced WLAN stations and access points.

Wi-Fi 7 (IEEE 802.11be) is engineered for extremely high data throughput and capable of handling tens of gigabits of data per second with low latency. It caters to the increasing demand for ultra-high-definition video streaming, virtual reality, and augmented reality applications. The key components facilitating higher throughput include an increased channel bandwidth of 320 MHz, up to 16 spatial streams, 4096 QAM modulation, and multi-link operation (MLO).

During the development of WLAN devices, measurements of the antennas as well as RF transmitter and receiver characteristics must be conducted under real-world conditions in signaling mode. With MLO being a key feature in Wi-Fi 7, a test environment that provides multiple RF chains is crucial. The R&S CMX500 one-box tester from Rohde & Schwarz, featuring integrated Wi-Fi 7 test functionality, is a multi-technology multi-channel signaling tester. Its flexibility, support for multiple radio technologies, and embedded IP test capabilities make it a versatile solution for a broad range of Wi-Fi 7-specific tests.

Christoph Pointner, Senior Vice President of Mobile Radio Testers at Rohde & Schwarz, said: “Our collaboration with Bluetest has resulted in a unique synergy between our CMX500 one-box tester and their RTS technology. This long-established partnership has enabled us to push the boundaries of WLAN testing, providing a real-world environment that is integral to the development of cutting-edge wireless solutions.”

Kjell Olovsson, Bluetest CEO, said: “Teaming up with Rohde & Schwarz and integrating their CMX500 one-box tester into our Flow software broadens our WLAN testing capabilities. Now we are able to offer an unprecedented testing environment for the latest Wi-Fi 7 devices, reflecting our commitment to supporting the evolution of wireless communication.”

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7layers successfully validated its Interlab Test Solution Bluetooth RF for Channel Sounding qualification, running with the R&S CMW wideband radio communication tester. Developed jointly with Rohde & Schwarz and leading chipset manufacturers, it is the first test platform listed by the Bluetooth SIG to perform Channel Sounding qualification testing with Bluetooth RFPHY release 6.0. Bluetooth Channel Sounding is a new secure fine ranging feature that will enable unprecedented positioning accuracy for consumer and commercial applications.

For many years, 7layers, a Bureau Veritas Group company, and Rohde & Schwarz have collaborated in developing Bluetooth RF test solutions for Bluetooth Qualification Test Facilities (BQTF), Bluetooth Recognized Test Facilities (BRTFs) as well as for chipset and module vendors. Thanks to this close partnership with Rohde & Schwarz and leading chipset vendors, 7layers has now validated the Channel Sounding feature within its Interlab Test Solution Bluetooth RF. Bluetooth SIG has listed it as a validated test solution for Channel Sounding qualification testing with Bluetooth RFPHY version 6.0.

Bluetooth Low Energy devices with improved positioning accuracy
The rollout of Bluetooth Low Energy devices supporting Channel Sounding will significantly improve positioning accuracy for ‘Digital Key’ and ‘Find My’ applications. In addition, these devices will feature improved power consumption and superior security, all critical features for Bluetooth enabled products. Since September, the Bluetooth SIG has introduced test cases to qualify these new features.

The Interlab Test Solution Bluetooth RF fulfils all qualification requirements for Bluetooth Classic, Low Energy (LE), including Direction Finding, as well as the latest Core feature Bluetooth Channel Sounding. Comprehensive test automation and the highly accurate implementation of the Bluetooth test cases are crucial to ensure compliance to the Bluetooth specifications.

The Interlab Test Solution for Bluetooth Channel Sounding runs with a wideband radio communication tester of the R&S CMW platform and offers an integrated RF path calibration, high measurement accuracy as well as precise analysis capabilities. The test platform from Rohde & Schwarz supports the corresponding RF physical layer measurements for the usage in development and for prequalification tests as a standalone box.

Frank Spiller, Manager Interlab Test Products, at 7layers emphasizes: “The industry is eagerly anticipating the qualification of a test solution for Bluetooth Channel Sounding by the Bluetooth SIG. We are proud to offer the first validated test solution, implemented thanks to the advanced test capabilities of our partner Rohde & Schwarz. We enable our customers to perform high quality and automated testing as part of the internal verification and regression process for a smooth transition to qualify products.”

Christoph Pointner, Senior Vice President for Mobile Radio Testers at Rohde & Schwarz, said: “Thanks to our close partnership with 7layers, we were able to quickly integrate the required test cases into the test solution. This means, that vendors of wireless chipsets and modules can now validate the new Bluetooth Channel Sounding feature with an R&S CMW Bluetooth RF tester and the Interlab Test Solution for Bluetooth Channel Sounding. This tester can be used for R&D tests, pre-qualification and production testing. Using the same test solution as BQTFs and BRTFs increases the likelihood of their products achieving the Bluetooth qualification on the first attempt, significantly reducing time to market.”

The Interlab Test Solution Bluetooth RF for Channel Sounding is part of the Interlab portfolio. It is now available from 7layers as qualification test solution for BQTFs and BRTFs. For further information please contact sales@interlab.com.

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Chiplets are reshaping microprocessor design by offering modularity, cost-effectiveness, and performance gains. By breaking traditional monolithic chips into smaller, specialized components, chiplets simplify design improvements and enable scalability. However, this promising technology faces several challenges hindering its broader adoption. Let’s explore these obstacles in detail.

Technological Complexity

Chiplets bring advanced design possibilities but also introduce technical hurdles. Achieving efficiency across multiple chiplets is not a straightforward task.

Interconnect Standards

One of the most prominent issues is the lack of standardized interconnect protocols. Chiplets from different manufacturers often struggle to communicate seamlessly. Current interconnect solutions, like those based on proprietary designs, limit interoperability. This forces companies to either develop their ecosystem or adhere to rigid standards, slowing innovation. A universal interconnect standard, such as Universal Chiplet Interconnect Express (UCIe), could address this bottleneck, but widespread adoption is still a distant goal.

Thermal Management

Heat dissipation becomes more complex in chiplet architectures. Each chiplet generates heat, and when these are packed tightly within a system, thermal management turns into a challenging puzzle. Standard cooling systems may no longer suffice, requiring innovative solutions like 3D stacking techniques and advanced cooling materials. Without effective heat control, performance suffers, and longevity decreases.

Market Competition

While the chiplet market is growing, it is tightly contested by industry giants and budding startups.

Dominance of Large Semiconductor Firms

Major players dominate advanced semiconductor technologies and often dictate industry trends. Companies like Intel, AMD, and TSMC hold much of the market share, making it harder for smaller businesses to compete. Their massive resources allow them to innovate and deploy at a scale that smaller competitors cannot match. This monopoly stifles competition and leads to slower industry-wide progress.

Emerging Startups and Innovations

Startups are essential for fostering innovation. However, they often face financial and technological barriers to entering the chiplet market. Disruptive ideas struggle to gain traction when pitted against well-funded incumbents. While venture capital investment in these companies is increasing, many promising ideas die because of insufficient funding or technical expertise.

Supply Chain and Manufacturing Issues

COVID-19 exposed the fragility of global supply chains, and the chiplet market is no exception. Key materials and manufacturing networks face significant setbacks.

Material Shortages

High demand for semiconductors has strained the availability of raw materials. Critical components like rare earth metals remain limited, leaving manufacturers unsure about how to fulfill orders. The situation worsens as geopolitical tensions over resource control further delay material acquisition.

Manufacturing Process Complexity

Chiplet production often relies on cutting-edge manufacturing processes, such as extreme ultraviolet (EUV) lithography. These processes are expensive, labor-intensive, and prone to errors. Scaling production while maintaining consistent quality adds to the challenge, driving up both costs and timelines.

Regulatory and Compliance Challenges

Navigating industry regulations is another hurdle for chiplet developers. Meeting global standards while protecting intellectual property (IP) rights is no easy feat.

Compliance with International Standards

International semiconductor markets impose various standards to ensure quality, safety, and compatibility. As different regions adopt different regulations, manufacturers must develop chips that satisfy multiple legal frameworks. This can increase costs and introduce engineering challenges.

Intellectual Property Issues

Efforts to integrate chiplets require collaborative innovation, which often leads to IP sharing. Disputes over patent ownership and usage rights can slow the development process. In a market where innovation drives value, IP issues remain a significant concern.

Chiplets Market Outlook 2034

The chiplet industry is set for explosive growth over the next decade. Valued at around $7.14 billion in 2023, the market is projected to skyrocket to $555 billion by 2034, reflecting a staggering CAGR of 46.47%. This surge highlights not only a growing demand for chiplet solutions but also ongoing advancements in semiconductor production. With applications ranging from data centers to consumer electronics, chiplets will likely become even more essential to the technology ecosystem.

Conclusion

While chiplets have transformative potential, the path forward is riddled with challenges. From standardization hurdles and thermal issues to supply chain constraints and regulatory obstacles, each roadblock requires careful navigation. Collaboration across industry stakeholders, investment in research, and regulatory clarity are all essential to unlock the true promise of chiplets. If these challenges can be overcome, the future of computing will be shaped by the success of the chiplet market.

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