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Digital signal controllers (DSCs) in Microchip’s dsPIC33CK Value Line provide real-time control for cost-sensitive designs. Starting at $0.51 each, they offer consistent pricing regardless of order size. The 16-bit controllers deliver 100-MHz deterministic processing, high-resolution PWM, and a 12-bit ADC supporting motor control, precision sensing and control, and touch/HMI applications.

A balanced set of peripherals helps reduce external component count, PCB footprint, and overall BOM cost. With flash memory ranging from 32 KB to 256 KB and compatibility across the dsPIC33CK family, the Value Line DSCs enable scalability and migration to future designs. The devices integrate a 12-bit ADC capable of up to 2 Msamples/s, four PWM pairs with resolution down to 2 ns, and on-chip analog comparators with a 12-bit DAC. Communication interfaces include CAN FD, LIN, SENT, UART, SPI, and I2C.

To accelerate evaluation and development, Microchip offers the dsPIC33CK Value Line Curiosity Nano evaluation kit with an onboard debugger. The evaluation platform supports the Curiosity Nano base for Click Boards and a touch adapter board for touch applications. A motor control DIM is also available for rapid prototyping of motor control designs.

Value Line DSCs are available directly from Microchip, its sales representatives, or authorized distributors.

dsPIC33CK Value Line

Microchip Technology 

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Keysight’s RF Circuit Simulation Professional software now enables engineers to document their design workflow on an executable whiteboard. The software replicates design decisions while capturing simulations, optimizations, decision trees, and parameters derived from prior analyses. Each step generates editable Python code that can be saved, shared, replayed for design reviews, and redeployed across the Keysight Advanced Design System (ADS), Cadence Virtuoso, and Synopsys Custom Compiler environments with full design data traceability.

Design teams often face workflow inefficiencies, simulation bottlenecks, and knowledge-transfer challenges. Engineers can build workflows visually on an executable whiteboard while the software automatically generates corresponding Python scripts. The platform executes simulations, optimizations, and design decisions in sequence, with support for decision-based loops and parameter settings.

Each workflow becomes a repeatable methodology that can be shared across teams, reused, and driven by AI. Captured workflows help preserve RF design expertise while creating structured design data that can support future AI-driven automation and training. Design review and tapeout tasks that previously required manual configuration now execute automatically.

RF Circuit Simulation Professional

Keysight Technologies 

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Diodes’ APK43070Q synchronous buck controller integrates a USB Type-C PD 3.1 source controller, simplifying automotive single- and multi-port charging designs. Operating from a 4-V to 36-V input, it enables USB Type-C charging up to 140 W. The device supports USB extended power range (EPR) and adjustable voltage supply (AVS) up to 28 V, along with standard power range (SPR) and programmable power supply (PPS) up to 21 V.

The constant-frequency controller features integrated drivers, optimized dead time, and elevated gate drive voltage for efficient mid- to high-power charging using external N-channel MOSFETs. This allows flexible MOSFET selection to balance thermal performance and power loss. A VIN DC pass-through mode further improves converter performance by enabling the high-side MOSFET to act as the VBUS switch, eliminating the need for an additional output switch.

An I2C interface with a controller/target addressing scheme enables power sharing across up to eight USB Type-C ports via resistor selection without an external MCU. The APK43070Q also includes overvoltage, overcurrent, undervoltage, and thermal protection. 

The APK43070Q is priced at $0.80 each in 1000-unit quantities.

APK43070Q product page

Diodes Inc.

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Pico Technology has launched the PicoScope 5000E series of USB-C oscilloscopes for analog, digital, and mixed-signal debugging. The four-channel scopes provide true 16-bit resolution with bandwidths to 200 MHz, sample rates to 2.5 Gsamples/s, and up to 1 GS of memory. PicoScope 5000E Plus models also offer a switchable 8-bit high-speed mode that raises bandwidth to 500 MHz, sample rates to 5 Gsamples/s, and memory to 2 GS.

With an ultra-low-noise front end, the oscilloscopes achieve a noise floor below 22 µV RMS and total harmonic distortion better than -73 dB. The resulting dynamic range helps reveal small-amplitude components, ripple, distortion, and other anomalies that lower resolution or noisier instruments can miss.

The compact, portable scopes connect to a host computer through a SuperSpeed USB 3.0 Type-C interface. For debug and validation, Pico 7 software provides more than 40 serial protocol decoders, advanced math channels, automated measurements including power analysis, multi-capture analysis, and measurement and mask limit testing. The Pico SDK supports custom application development using C, C#, C++, Python, MATLAB, and LabVIEW.

The PicoScope 5000E series is available in four-channel and 4+16-channel mixed-signal oscilloscope variants, with bandwidth options from 60 MHz to 500 MHz depending on model and operating mode. Units are sold through authorized distributors worldwide and directly from Pico Technology.

PicoScope 5000E product page

Pico Technology 

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🏆 Міжнародний конкурс студентських наукових робіт зі штучного інтелекту 2026 kpi ср, 06/03/2026 - 23:33

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has introduced the EPC91128, EPC91129, EPC91130 and EPC91131 evaluation boards — compact, high-performance 3-phase brushless DC (BLDC) motor drive inverter platforms designed to accelerate development of next-generation motor control systems using GaN technology...

On 29 May at the Taipei Nangang Exhibition Center, gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA participated in NVIDIA’s Partner Ceremony, which brought together key ecosystem partners supporting the NVIDIA AI Factory MGX platform, highlighting industry collaboration to accelerate the development of next-generation AI data centers powered by emerging 800VDC rack architectures...

For the past decade the electric vehicle industry has become the dominant application area for power electronics. For most power electronics players, the automotive industry has been their main source of revenue for years, and power electronics innovations have focused mainly on improving efficiency and performance across the e-powertrain...

On the bottom left it is shown next to its accompanying vacuum tube power supply, not a single semiconductor used in the whole setup. Wiring is horrible, and its performance reflects that. But at least it looks nice. Uses a 2" diameter 902 CRT, and is based mostly on a 1945 RCA schematic for this tube. The CRT only runs at <600V (schematic specifies 577V, mine only runs on ~400V), which is remarkably low for a CRT but it definitely still hurts. Uses two 6SJ7 pentodes for vertical and horizontal amplification with a Type 884 thyratron for sawtooth generation. Has x-y mode and internal/line/external sync. Rectification is done with a Type 80 for B+ and a 6AU4 for the negative CRT supply (grounded anode). The tube could maybe use some magnetic shielding and I am trying to figure that out, but for now I just keep the power supply away from it to eliminate the interference. Whole thing uses a little over 60W when running and is fused accordingly. This is by far my highest-effort electronics project ever, and I am very glad to be done with it! I started this project over a year ago before, I got my real oscilloscope. Whadaya think? submitted by /u/MultiSubjectExpert [link] [comments]

🎥 КПІ ім. Ігоря Сікорського об’єднав Київ і Кіото піснею KPI4U-2 ср, 06/03/2026 - 19:00

It wasn't working, so unplugged it and the metal was hot as hell. So took it apart, soldered some leads for power and gave it some juice. Got a lot hotter than I was expecting. Resistor was reading as .5Ω submitted by /u/MISTERDIEABETIC [link] [comments]

I’m a graduate electrical engineer with over 12 years of experience in electronics. I’ve worked on a wide range of projects, and I thought I had seen most things by now… but I’ve never seen capacitors that look like this. submitted by /u/Constant_Whereas1445 [link] [comments]

submitted by /u/Public_Ice_736 [link] [comments]

This circuit design for power supply on/off sequencing uses Schmidt triggers for triple-positive-rail timing purposes.

Recent design ideas have explored the utility of timed power supply ON/OFF sequencing and provided circuit designs to implement it.  Figure 1 shows a simple topology using Schmidt triggers for timing the turn ON and OFF of triple positive supply rails.  Here’s how it works.

Wow the engineering world with your unique design: Design Ideas Submission Guide

Figure 1 This significantly simple supply sequencing scheme leverages Schmidt triggers.

Switching action begins with SPDT S1 in the OFF position which holds the C1 and C2 timing caps discharged.  The latter holds U1 pin 1 at 15v and therefore its pin 2 and the NFET Q2’s gate at zero, forcing the 5Vout rail OFF.

Meanwhile, C1’s discharged state holds U1’s pins 3 and 5 low so pins 4 and 6 sit high.  The former holds enhancement mode PFET Q1 and the 15Vout rail OFF, while the latter does the same for level shifter Q3, PFET Q4, and the 24Vout rail.

Therefore no power flows to the connected loads.  Yet, at least. Figure 2’s left side graphs the sequence of events initiated by actuating S1.

Figure 2 This plot shows power sequence timing when S1 is flipped ON and later flopped OFF.

C2 connects to ground through R3, quickly charging it to the Schmidt trigger low-going threshold in about R3C2 = 1mS.  This inverts U1 pin 2 to 15v, placing a net forward bias of 15 – 5 =10V on NFET Q2, turning it and the 5Vout rail ON.  Thus they will remain as long as S1 stays ON.

Meanwhile, reset of C1 has been released, allowing it to begin charging through R1 + R3.  The first thing that happens occurs at the end of T1 when U1 pin 3 reaches the ~9V Schmidt threshold.  Since the timeout duration is proportional to C1, any desired interval can be chosen with an appropriate RC product.  U1 pin 4 then snaps low, PFET Q1 turns ON and 15Vout goes active.

Of course C1 continues to charge, so at T2 U1 pin 5 also reaches its triggering threshold.  Then its pin 6 snaps low, turning ON Q3, Q4 and 24Vout.  The ratio R4 = 10 R5/(15 – 0.7) was chosen to apply an adequate and safe ~10V drive to Q4’s gate, independently of 24Vin. The S1 flip ON sequence is now complete.

The right side of Figure 2 shows what happens when S1 subsequently flops OFF. First, C1 is promptly discharged through R3, turning OFF Q1, Q3, Q4 and thereby 15Vout and 24Vout, putting them and whatever they power to sleep.  Meanwhile C2 begins ramping up, taking T3 to get to U1’s threshold.  When it completes the trip, pin 2 goes low, turning Q2 and 5Vout OFF. 

Turnoff sequencing is therefore complete.  Nighty night.

Details of the design include D1 and D2.  Their purpose is to make the sequencer’s response to losing and regaining of the input rail voltage orderly, and to do it regardless of whether S1 is ON or OFF.  If  S1 is OFF, then all output rails remain low and (a safe) nothing occurs when the supply voltages return.  If it’s ON, then a normally timed (and therefore safe) power-up sequence is executed.

Note that the MOSFETs should be chosen for adequate voltage and current handling capacities.  Because Q1 has 15v of gate drive and Q2 and Q4 get 10v, none need be sensitive logic-level types.

Okay.  But what if you also need to sequence a negative supply rail?  Figure 3 shows how.

Figure 3 This power switching circuit works with a negative rail.

When the U1 inverter’s input rises above the Schmidt trigger voltage, its output snaps low, causing the 2N3906  to pass Ic = (+15Vin – 0.6)/15k = 0.96mA.  This develops a 10.6V that’s independent of –Vin across the 11k resistor, saturating the NFET.  If symmetrical polarity rails (e.g. +/-15v) are needed, Figure 3 can be added to Figure 1 to provide the negative side with no other modifications required.

Stephen Woodward‘s relationship with EDN’s DI column goes back quite a long way. Over 200 submissions have been accepted since his first contribution back in 1974.  They have included best Design Idea of the year in 1974 and 2001.

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• Silly simple supply sequencing
• Single switch controls sequential operation of multiple power supplies
• Short push, long push for sequential operation of multiple power supplies

The post Triply simply sequence supply voltages appeared first on EDN.

Silicon photonics-based chip-to-chip optical connectivity firm Ayar Labs of San Jose, CA, USA — which is pioneering co-packaged optics (CPO) for AI scale-up — has joined the NVIDIA NVLink Fusion ecosystem, and is making its products optically and electrically compatible with NVIDIA optical and SerDes technologies. This allows hyperscalers and system innovators to build optically connected AI infrastructure around NVIDIA’s NVLink Fusion platform and partner ecosystem...

Rohde & Schwarz successfully certifies the testing of its hybrid eCall and the Next Generation eCall test solution done by Cetecom Advanced, a leading independent test laboratory for product testing and worldwide certification for devices from various branches like communication technologies, automotive, medical technology, payment & identification. The Rohde & Schwarz solution is based on the CMX500 radio communication tester with the latest eCall option to ensure compliance with the latest eCall regulations and standards.

The hybrid eCall test specification EN 18052 states that a hybrid system must combine different transmission paths and protocols to make sure an eCall reliably reaches its destination. In practice, this means a vehicle uses NG eCall functions (IP/IMS-based voice and data over 4G/5G) but can automatically fall back to available classic CS eCall (2G/3G) transport paths when coverage or service quality degrades. Manufacturers need to validate hybrid implementations to ensure they can trigger calls, transmit the minimum set of data (MSD), maintain GNSS positioning, and deliver intelligible voice quality across multiple network scenarios, including voice over New Radio (VoNR), voice over LTE (VoLTE), and circuit-switched fallback. Tests must demonstrate that a system remains robust during handovers and under degraded radio conditions, while also complying with relevant CEN, ETSI, 3GPP, and national requirements.

“We use the solution for functional tests and protocol conformity tests as well as for the type-approval of In-Vehicle Systems (IVS) that implement hybrid eCall and NG eCall,” says Thomas Reschka, Senior Technical Consultant at cetecom advanced.

Rohde & Schwarz has updated its eCall evaluation solution, CMX-KA09x, to support compliance with EN 18052:2025 and EN 17240:2024+A1:2026. The CMX-KA099 option completed Public Safety Answering Point (PSAP) test scenarios in accordance with EN 18052:2025, while the CMX-KA098 option completed PSAP test scenarios in accordance with EN 17240:2024+A1:2026. This marks an important step toward meeting European requirements for NG eCall test systems. The test environment allows the simulation of the real world mobile network conditions and the emulation of various network scenarios. This is a significant advantage in preparing for certifications or the market launch of new vehicle models.

 

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Strengthening Microchip Technology’s data center solutions portfolio, the retimers support high-bandwidth architectures while helping reduce integration complexity

As AI workloads continue to scale, the data center architects show limitations by signal reach and rising latency, leaving valuable memory resources underutilized across large GPU clusters. These challenges boost as interconnect speeds increase. At 64 GT/s (giga transfers per second), signal integrity limitations can restrict system scale and burden server architectures. In response, Microchip Technology releases XpressConnect PCIe 6.0 and CXL 3.1 retimers to enable memory expansion and resource disaggregation in large-scale AI fabrics.

The retimers extend signal reach beyond conventional PCIe Gen 5 and Gen 6 electrical limits, enabling more flexible system designs across complex baseboards, riser cards, and cabled interconnects. The retimers are engineered to help address these challenges by enabling higher-bandwidth connectivity while supporting the stringent thermal requirements of modern AI fabrics that require power budgets. XpressConnect retimers achieve a pin-to-pin latency of less than 12 ns, approximately 80% lower than PCIe 6.0 specifications. This low-latency performance helps improve utilization of AI accelerators and GPUs by reducing data stalls in high-density AI clusters.

“AI data centers are increasingly constrained not by compute, but by the ability to move data efficiently across the system. As PCIe 6.0 pushes speeds to 64 GT/s, signal reach and latency become critical design challenges,” said Brian McCarson, corporate vice president and GM of Microchip’s data center solutions business unit.

Our XpressConnect retimers are designed to act as the high‑performance nerve center of the AI server, helping customers build more scalable, power‑efficient fabrics by reducing latency and improving connectivity across dense GPU clusters. This system‑level approach allows data center architects to reclaim underutilized resources and improve overall platform efficiency at scale.

The XpressConnect retimers round out Microchip’s data center portfolio and are engineered to work alongside the company’s 3-nm Switchtec PCIe Gen 6 switches, Adaptec SmartRAID controllers and Host Bus Adapters (HBAs), and Flashtec NVMe controllers, helping enable a pre-validated, interoperable fabric. Microchip’s XpressConnect PCIe Gen 6 and CXL 3.1 retimers can integrate with PCIe Gen 3, Gen 4, and Gen 5 platforms as required, helping reduce time to market. The retimers also connect into Microchip’s ChipLink diagnostic ecosystem, delivering a unified graphical user interface for real-time 2D eye capture and four-level pulse amplitude modulation (PAM4) telemetry. These capabilities help data center operators monitor link health more effectively and simplify troubleshooting, which can help reduce the total cost of ownership.

Engineered as an industry-standard, drop-in solution, XpressConnect retimers are designed to help reduce the risk of single-vendor dependency for hyperscalers. Additionally, the devices support flexible link bifurcation configurations (1×16, 2×8, and 4×4) and align with widely adopted retimer footprint guidelines, while providing enterprise-class features such as hot-plug support and end-to-end data integrity. Visit the website to learn more about Microchip Technology’s data center solutions for high-performance compute, storage, and connectivity.

Development Tools

Microchip’s ChipLink diagnostic tools offer comprehensive debug, diagnostics, configuration, and analysis through an intuitive graphical user interface (GUI). ChipLink connects via in-band PCIe or sideband signals such as UART, TWI, and EJTAG, enabling flexible, efficient monitoring and troubleshooting throughout design and deployment.

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The University of Texas at Dallas (UTD) and quantitative cathodoluminescence (CL) solutions provider Attolight SA of Ecublens, Switzerland have announced the opening of a new demonstration laboratory at the university. The equipment is designed to support the rapidly growing wide-bandgap (WBG) semiconductor industry by offering advanced material characterization services and collaborative research opportunities...

Rohde & Schwarz supplies the independent test house BTL Laboratory in Taiwan with a full R&S TS8991 OTA test system that meets CTIA Certification standards. Plus, the company’s experts give hands‑on support throughout the necessary accreditation audits. This collaboration makes BTL the first test house in the region to provide its customers with comprehensive over-the-air testing services, including certification of wireless devices in line with CTIA Certification OTA requirements based on a Rohde & Schwarz test system.

BTL relies on Rohde & Schwarz to install a full CTIA Certification-compliant turnkey OTA test solution in one of its prominent testing and certification laboratories in Taiwan. The project covers the R&STS8991 over-the-air test system, related measurement software, a ready‑to‑use third-party test chamber, and a positioner from a single source. Furthermore, Rohde & Schwarz experts provide guidance and support on-site throughout the process of the two necessary accreditation audits performed by TAF (Taiwan Accreditation Foundation) and CTIA Certification, to guarantee measurement proficiency and accuracy.

Rohde & Schwarz and BTL collaborates closely to make sure the test chamber and its supporting infrastructure provide an interference-free test environment, a requirement for reliable measurements. The single‑source arrangement simplifies procurement for the test house in comparison with solutions that rely on several vendors.

As the first test lab in Taiwan using the R&S TS8991 with CTIA Certification. BTL now offers OTA measurements on wireless devices that use 2G, 3G, 4G, 5G, Wi‑Fi, and Bluetooth technology, especially notebooks and laptops. Furthermore, by keeping it compatible with new wireless standards, A‑GNSS, it upgrades the measurement software of the test system. By bringing in expertise in antenna measurement.

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Ruggedized connectors are usually associated with military/aerospace, industrial, and some medical applications, but there are consumer ones as well, in special circumstances. Of course, the phrase “ruggedized connector” invokes different requirements in different circumstances.

In brief, it’s the ability of the connector to endure and consistently function to specifications despite extreme mechanical, environmental, and thermal stresses. These stresses differ depending on the operating conditions but often have overlap as well. For example:

• Connectors in land-based military systems must handle severe vibration, dirt accumulation (dust, sand, grit), and cold and heat extremes.
• Seaborne interconnects must withstand prolonged exposure to corrosive saltwater; deep-sea ones must also withstand crushing pressure.
• Aerospace applications must tolerate repeated take-offs, landings, and in-flight vibrations in addition to wide temperature ranges.
• Space applications have more extreme temperature swings, vacuum exposure and outgassing, and intense mechanical stress during launch and re-entry.
• Industrial applications often need to function despite vibration, shock, dirt, grease, abuse, and even neglect.
• Some consumer-facing applications such as vending machines, commercial washers/dryers, arcade games, and elevators/escalators also need ruggedized attributes; it’s a surprisingly long list here.

Meeting these requirements involves an understanding of multiple factors, including:

• Vibration: connectors in military vehicles or fighter jets are tested to resist forces up to 20 g.
• Shock: a high-impact force during rapid acceleration or deceleration is a distinct from vibration. It can be as high as 50 g for standard connectors and 100 g for nano and micro designs.
• Temperature extremes: ground-based systems may see temperatures ranging from -65°C to +125°C while space systems can go as high as 200°C.
• Sealing and ingress protection: connectors may need to be protected against exposure to moisture, dust, and contaminants to ensure long-term operation using sealing solutions such as O-rings, gaskets, and grommets.
• Corrosion: it’s caused by exposure to moisture and salt spray, leading to oxidation.

Deciding on a ruggedized connector requires attention to two broad design issues: the body or shell, and the electrical contacts.

For the body or shell, vendors and users consider what it’s made of, how it mates, retention and locking, and more. For this reason, rugged connectors are often associated with relatively bulky form factor, locking rings, and similar; but this is not necessarily the case.

For the contacts, ruggedized connectors also have sophisticated, specially designed and fabricated contacts that use suitable base metals and are clad with advanced plating to withstand and maintain contact despite the challenges. The contact pairs are often based on a multipoint design with two or four mating surfaces for redundancy, rather than a single mating point.

Start with a classic

One widely used choice for a ruggedized connection is the classic D-subminiature connector. If you think that the classic 9-pin D-subminiature connector (often called DB-9) and the rest of the broader family of D-subminiature connectors have largely disappeared due to the fading away of the “ancient” RS-232 interface—along with the rise of various versions of USB and Ethernet connectors—that’s not the case at all.

The D-sub form factor has been in use since the 1950s and still offers many advantages. It’s fully shielded against EMI/RFI and provides a sealed or nearly sealed enclosure. And it’s mechanically rugged, and its mating halves can be locked to each other with small jackscrews or other arrangements. This class of connectors is still widely used due to their flexibility, integrity, track record, and wide variety of models and versions. It’s so good that it is widely used in mil/aero and space-related designs.

This connector is offered in six basic standard-size bodies, but that is only part of its versatility. It also offers flexibility in its electrical contact positions and types.

In addition to offering connector shells with the same contact type at all positions, “Combo-D” D-subs such as those from Amphenol Positronic provide a mix of independent signal and power contacts within the connector shell (Figure 1). A single D-sub can support multiple signal contacts, power contacts, and more in a variety of mix-and-match arrangements. There are available contacts for signal, power, shielded, high voltage, thermocouple, and even fiber-optic applications.

Figure 1 The Combo-D subminiature connector style supports many signal- and power-path combinations (upper); these combinations are available in standardized, named shell sizes and contact arrangements (lower). Source: Amphenol Positronic

Among the material options for the shell are:

• Thermoplastic polymers offer excellent mechanical strength, thermal resistance, and chemical stability. These materials effectively absorb vibration and shock in a low-weight structure.
• Composite materials such as fiberglass-reinforced polymers and carbon fiber composites provide excellent strength-to-weight ratios. They can be engineered to maximize specific properties such as tensile strength, impact resistance, or thermal stability.
• Metal enclosures of stainless steel and aluminum alloys are preferred materials for connector housing in the high-shock, high-vibration, and high-EMI environments of aerospace and defense applications.

The virtues of the sub-D shell—or any ruggedized housing—are an important part of the connector story, but they are only half of the ruggedness reality as the electrical contacts and their attributes are also critical. Over the years, there have been many innovations in contact technology with respect to materials, design, and electrical and mechanical performance.

For example, Amphenol Positronic uses its patented PosiBand contact technology (U.S. Patent 7,115,002) in one of its D-sub families. This contact has a unique approach to provide enhanced performance, where its external pressure-element design fully separates the mechanical action from the electrical action of the connection (Figure 2).

Figure 2 The PosiBand uses a patented design to separate the mechanical action and the electrical action of the connection. Source: Amphenol Positronic

The pressure element performs the mechanical action by applying a force pressing the male pin against the inner female cavity, achieving electrical connection along a long line of direct contact. Among its many subtle but important attributes is the spring clip within the PosiBand; it’s a small but critical part of the assembly and a key contributor to its vibration/shock performance (Figure 3).

Figure 3 The PosiBand spring clip provides a normal force across the contact area and so maximizes the electrical mating-surface contact area. Source: Amphenol Positronic

This spring-tempered beryllium copper alloy provides a normal force on the male contact, contributing to a rugged and reliable contact pairing. At the same time, it offers a lower average insertion force while meeting or exceeding performance requirements.

Consumer connectors get a little more rugged, too

The recent European initiative mandating use of USB-C for many classes of consumer end products is a major factor driving the use of this connector. Due to the wide availability of USB-C connected functions and peripherals, it seems logical that the connector and associated standard would be worth considering for medical, industrial, and other non-consumer appliances.

But there’s a problem with USB-C connectors: they are not rugged or sealed against intrusion, yet that’s where many may be used beyond low-end consumer applications.

Addressing this concern, Same Sky has introduced the UJ family of waterproof USB receptacles with IPX5, IPX6, IPX7, IPX8, IP66, IP67, and IP68 ratings, making them well-suited for applications where moisture and environmental contaminants are a concern (Figure 4). If you are not familiar with Same Sky, it was known as CUI Devices until it changed its name in September 2024.

Figure 4 These USB Type C connectors from Same Sky (formerly CUI Devices) feature water/dust intrusion-resistant O-rings to meet multiple IP ratings. Source: Same Sky

The five models are compatible with reflow soldering due to their UV-glued O-rings. This simplifies the PCB assembly process, as there is no need for a separate wave-soldering step (as is often the case with connectors and other larger components).

The five IP-rated USB Type C receptacles conform to a variety of USB standards, from USB 2.0 up to USB 4.0 Gen 3×2, with data-transfer speeds up to 40 Gbps as well as power delivery up to 240 W at 48 V and 5 A. The family also includes power-only models that remove the data-transfer pins to create a more cost-effective solution for designs where charging or power is the sole needed function.

If you are looking for a ruggedized connector, you have these and many other options. The first challenge is defining what you mean by “ruggedized” in your application beyond number and type of contacts and then pick which available connectors meet those criteria.

Maybe AI can help make the selection?

Bill Schweber is a degreed senior EE who has written three textbooks, hundreds of technical articles, opinion columns, and product features. Prior to becoming an author and editor, he spent his entire hands-on career on the analog side by working on power supplies, sensors, signal conditioning, and wired and wireless communication links. His work experience includes many years at Analog Devices in applications and marketing.

Related Content

• Consumer connectors get ruggedized
• Meeting the ‘Rugged Design’ Challenge
• USB-C and Power Delivery: Too much of a good thing?

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