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Artificial intelligence (AI) interconnect technology company Palomino Laboratories Inc of Goleta, CA, USA has received its first purchase order (PO) from a strategic hyperscaler customer. The PO includes a statement of work (SOW) for the delivery of high-performance gallium nitride (GaN) micro-LED chips for optical interconnect applications within AI infrastructure...

Stratospheric platform attains 21 km altitude during test to develop endurance capabilities for aerial surveillance

The Defence Research and Development Organisation (DRDO) has completed a flight trial of a high-endurance Indigenously Developed High-Altitude Platform (HAPS). As stated by the Ministry of Defence, the stratospheric platform ascended to an altitude of 21 kilometres above mean sea level and stayed at 20 kilometres for over 30 minutes before descending and being recovered successfully.

As it was being tested, the vehicle broadcast live video and vehicle-status information to a ground control station. It had onboard an inertial measurement unit, a GPS receiver, cameras, and an altitude control. The system is under development by DRDO’s Aerial Delivery Research and Development Establishment (ADRDE) at Agra. The trial was carried out in conjunction with the Indian Air Force along with other Aviation and certification authorities.

Elevated platforms could enable long-term surveillance or other applications requiring continuous monitoring in the stratosphere. The test also provided performance data for technology development but is not a systems demonstration.

The post DRDO Successfully Tests Indigenous High-Altitude Surveillance Platform appeared first on ELE Times.

New directed-energy and kinetic technologies will aim to drone swarms and multi-asset aerial threats

BAE Systems has displayed two defence technology demos at AUSA 2026: The Multi-Domain Artillery Cannon System (MDACS) and a High-Power Microwave (HPM) system. They’re aimed at layered defence against unmanned aircraft and missile threats.

The MDACS is a kinetic system armed with precision-guided munitions (PGM) such as the Hypervelocity Projectile for an air defence role. In addition, the system is also intended to cater for a ground-target role with the company’s Scorpio XR munition.

HPM adopts a different approach that involves using directed electromagnetic energy to disable the electronics of an enemy drone. When employed against a drone, a regular missile has to be used for each attack, whereas the microwave system might neutralise several targets in one engagement (depending on its operational limits).

According to BAE: “The HPM architecture employs more than 99% commercial off-the-shelf elements.” The companies say they designed the technologies to work together with a fusion of physical and directed energy approaches to enhance counter-drone defence networks against large swarms.

The systems were pitched as capability demonstrators rather than validation of full-scale operational deployment.

The post BAE Systems Unveils High-Power Microwave and Advanced Artillery Defence Systems appeared first on ELE Times.

New rocket-motor, seeker and warhead upgrades set to boost response time to new unmanned aerial threats.

The upgraded Coyote Block 2C + RM designed by RTX passed three development tests since starting the programme, and has moved to testing from concept in around 15 months.

The modification expands on Coyote versions that have so far been able to shoot down hundreds of drones, according to the company. The new variant features new seekers and a warhead designed to counter a broader set of current and emerging drone threats, as well as a new tactical rocket motor to optimise launch and flight performance.

The latest series of tests involved integration with the counter-drone architecture and the first test firing of an interceptor with the tactical rocket motor. The goal is to enable faster rates of engagement and quicker follow-up shots.

The programme demonstrates the expanding need for counter-unmanned aerial systems (C-UAS) as armed forces attempt to defend sites and troops targeted by ever more effective drones. The tests are a milestone in the development process; they do not alone mean that the various features and applications planned have been fully qualified or deployed in operational service.

The post Raytheon Advances Coyote Interceptor to Counter Emerging Drone Threats appeared first on ELE Times.

Software-defined radar merges 360-degree watching and AI for targeting

Leonardo DRS has launched its cxMHR (C-Band Extended Multi-Mission Hemispheric Radar) and stated that the first units have entered production. The system was announced at the annual Association of the United States Army exhibition in Washington. D.C.

The system is based on a fully digital, software-defined C-band active electronically scanned array (AESA) radar. The four radar panels, identification-friend-or-foe (IFF) equipment, and command-and-control systems are incorporated within a containerised unit designed to be transported by land, air, or sea.

As per the manufacturer, the cxMHR gives 360-degree coverage in the form of a full hemispheric field of regard and can track multiple threats, including cruise missiles, tactical ballistic missiles, rockets and unmanned aircraft systems. Its artificial intelligence-powered tracking and classification is intended to enhance target recognition and offer swift updates on tracking.

The system is designed to operate as part of larger integrated air and missile defence (IAMD) networks, providing a mobile solution for military users to identify and track various types of aerial threats.

The post Leonardo DRS Launches Digital Radar for Air and Missile Defence appeared first on ELE Times.

BEL contract enhances India’s capability to identify fighter-class aircraft and combat micro and mini drones.

India’s Ministry of Defence has signed a contract worth around Rs 770 crore with Bharat Electronics Limited (BEL) to procure Improved Low-Level Weight Radars (LLLR-I) for the Indian Army. Revealed on 21 October 2026, the radar system can identify and track fighter-sized air targets, along with micro and mini-drones. The radar can also prioritise aerial threats, allowing for a quicker threat- and air-defence response.

The acquisition aims to strengthen the Army’s ability to counter emerging unmanned aerial system (UAS) threats, which have become an important concern in modern warfare. The agreement also advances India’s defence-indigenisation goals by facilitating the domestic defence industry and opening up opportunities for micro-, small, and medium-scale enterprises. The procurement is yet another initiative to enhance India’s layered air-defence architecture with indigenous sensor technology.

The post Indian Army to Receive Rs 770 Crore Advanced Radar Systems appeared first on ELE Times.

Vector and SCSK Corporation have developed a joint evaluation bundle to simplify the development of sensor and actuator applications based on Renesas RL78/F2x microcontrollers. By combining Vector’s MICROSAR IO with SCSK’s QINeS-Lite platform and drivers, the bundle offers a pre-integrated software base that reduces integration effort and speeds up configuration and evaluation. SCSK is a leading Japanese provider of IT services and automotive software solutions.

Joint evaluation bundle for embedded software development

The jointly developed evaluation bundle is aimed at developers who are evaluating or building embedded applications on resource-constrained microcontrollers. By combining Vector’s MICROSAR IO with SCSK’s QINeS-Lite platform and drivers for Renesas RL78/F2x microcontrollers, the solution provides a ready-to-use software base and supports initial evaluation activities while reducing configuration and integration effort. Customers can request the joint MICROSAR IO evaluation bundle for Renesas RL78/F2x from Vector via www.vector.com/pr-bundle-microsar-io.

A lightweight software base for sensor and actuator applications

MICROSAR IO was developed specifically for sensor and actuator applications and provides a lightweight software platform for microcontrollers with limited hardware resources. The solution helps reduce software complexity, cut development effort and shorten time-to-market. QINeS-Lite is SCSK’s lightweight automotive software platform for small ECUs. It supports edge ECU applications that require high-speed communication, over-the-air software updates, cybersecurity and diagnostic capabilities. The drivers provided by SCSK are based on the open Chiisai specification and complete MICROSAR IO with the hardware abstraction layer needed for the Renesas RL78/F2x platform.

Reducing integration effort for Software-Defined Vehicle architectures

With this joint offering, Vector and SCSK provide an accessible development base for sensor and actuator applications on Renesas RL78/F2x microcontrollers. The collaboration helps customers improve software reusability and prepare efficient edge ECU solutions for future Software-Defined Vehicle architectures. More information at: www.vector.com/microsar-io.

The post Vector and SCSK simplify embedded development on Renesas RL78/F2x appeared first on Open Electronics.

Salvaged from an old amplifier that my father brought for me from a junk shop submitted by /u/SupermarketSecure888 [link] [comments]

https://www.youtube.com/watch?v=UJiyGaUV1Rs This is functionally a sequencer, but a dysfunctional midi controller as of now. There is still a lot of room for improvement, and will definitely not be my last rendition. I used an Arduino R3 Uno, 4 buttons, and joystick, the Arduino IDE program, and ton of github resources. I plan on upgrading to a teensy 4.1 eventually with an expanded patchbay to move beyond the prototype board. ...maybe throw some laser beams in there too. submitted by /u/DULTRONtheDESTROYER [link] [comments]

Mouser Electronics, an authorised global distributor with the widest selection of semiconductors and electronic components, is shipping a broad range of new products and solutions from the YAGEO Group, a leading global manufacturer of passive components. With more than 300,000 parts available to order and almost 70,000 YAGEO Group products in stock — including YAGEO, KEMET and Pulse Electronics — Mouser offers a complete portfolio of the latest YAGEO Group products and solutions.

KO-CAP capacitors

YAGEO Group KO-CAP capacitors are tantalum capacitors with an organic polymer, designed for applications that demand hold-up protection and maximum circuit energy efficiency in small spaces. The conductive polymer cathode of these solid electrolytic capacitors delivers very low ESR and high capacitance retention at high frequencies. Unlike liquid electrolyte capacitors, KEMET polymer capacitors offer a very long operating life and high ripple current capability, making them ideal for solid-state drives (SSDs), enterprise storage, networking and servers.

SCFx and SCTx common mode inductors

The YAGEO Group SCFx and SCTx high-performance common mode inductors offer a rated current of up to 22 A for the single-phase version and up to 110 A for the three-phase version. The SCFx series is built around a nanocrystalline core, while the SCTx series uses a proprietary Mn-Zn ferrite core. Thanks to their very high inductance and permeability, these inductors suit audio-video equipment, office automation equipment, industrial equipment, air conditioners, home appliances, digital devices and power supplies.

CE X5R multilayer capacitors

The YAGEO Group CE X5R multilayer ceramic capacitors are Class 2 embedded capacitors designed for compact module assembly, with capacitance values from 10 nF to 220 nF. Their construction, a rectangular ceramic dielectric with interleaved metal electrodes, provides high capacitance per unit volume while reducing parasitic inductance. The capacitors support customisation of thickness and termination dimensions for embedding under ICs, ensuring excellent electrical bonding and advanced resonance.

HXE1 high-voltage isolation modules

The YAGEO Group HXE1 10 kV high-voltage isolation modules are designed for 100Base-TX applications and are available in single-channel or single-port (dual-channel) versions. The HXE1 modules support IsoSPI for BMS solutions and 100Base-T1 for industrial STPE. These high-voltage isolation modules comply with the IEEE 802.3u 100Base-TX standard.

Content and resources for designers

Besides offering a wide selection of YAGEO Group products, Mouser is proud to work with YAGEO Group to produce engaging content for design engineers and purchasing professionals, such as an automotive content stream and eBooks. In the eBook Powering the New Automotive Era with Smart Passive Solutions, industry experts explore how passive electronic components are evolving to meet the needs of increasingly electrified automotive systems.

To learn more about the YAGEO Group products available from Mouser, visit the site. For further Mouser news and the latest new product introductions, visit the site.

As an authorised global distributor, Mouser offers the widest selection of the latest semiconductors, electronic components and industrial automation products. Mouser customers can count on 100% certified, genuine and fully traceable products from each of its manufacturer partners. To accelerate customer designs, the Mouser website hosts an extensive library of technical resources, including a Technical Resource Centre, along with product datasheets, supplier-specific reference designs, application notes, technical design information, engineering tools and other useful information.

Engineers can stay up to date on exciting new products, technologies and applications through Mouser’s free electronic newsletter. Subscriptions to Mouser’s email news and references can be customised to the unique and changing design needs of customers and subscribers. No other distributor gives engineers this level of customisation and control over the information they receive. To learn about emerging technologies, product trends and more, you can sign up today.

The post Mouser Ships Nearly 70,000 YAGEO Group Products appeared first on Open Electronics.

Picture a portable box full of scientific sensors, designed to explore environments and make discoveries in the field. Dr. Peter Jansen’s open source tricorder does exactly that: it is a prototype built around a Clockwork Pi UConsole that integrates thermal imaging, visible spectroscopy, magnetic imaging, radiation spectroscopy and environmental sensors. All in a handheld format.

The UConsole uses a Raspberry Pi compute module, so it runs Linux and has about 4 GB of RAM. That lets it handle a user interface written in Python and analyse the data coming from the sensors. What’s more, the project is completely open: anyone who wants to study it or derive a personal version will find all the files available.

The tricorder’s sensors and their numbers

The heart of the device is its sensor suite. Each one covers a different measurement band, so the tricorder can observe the environment from several points of view at the same time.

• Waveshare Long-wave IR Camera: 80×62 pixel thermal imaging
• Waveshare IMX378 12MP: 12 megapixel visible camera
• Hamamatsu C12666MA: spectrometer with 256 spectral channels between 340 nm and 780 nm, effective resolution of about 15 nm
• SparkFun Magnetic Imaging Tile 8×8: 64 pixel magnetic camera, up to about 20 kHz
• Pomelo Spectroscopic Radiation Detector: radiation detection
• Sensirion SPS30: particulate matter measurement

The magnetic camera deserves a section of its own. Its 64 pixels may seem few, but the acquisition rate reaches about 20 kHz, that is 20,000 frames per second. So it can follow fast magnetic phenomena that a traditional camera would not see. The Hamamatsu spectrometer, on the other hand, covers the whole visible band with 256 channels and a spectral resolution of about 15 nm.

ESP32 firmware and JSONL packets to the UConsole

Not all the sensors speak the same language. Some connect directly to the UConsole over USB. The others are polled periodically by firmware on an ESP32, which collects the measurements and sends them to the UConsole over a USB-to-Serial connection. The data packets are in JSONL format, so the software on the UConsole can parse them easily.

The sensors are wired up in different ways. The Hamamatsu spectrometer, the magnetic imaging tile and the environmental sensors go through dedicated breakouts. The back plate hosts the environmental sensors with the Sparkfun mounting pattern, which measures about 25×25 mm, and the QWIIC hub. That way the wiring stays tidy and every sensor has its place.

For anyone who wants to rebuild the project, Dr. Peter Jansen’s code repository collects the ESP32 firmware, the Python interface, the EAGLE 9.6.2 project files with schematics and board, and the OpenSCAD models with the .scad sources and the exported STLs.

3D printing, M4 screws and press-fit inserts

The enclosure and the sensor mounts are 3D printed. The main body replaces the back of the UConsole and is fastened with four M4 screws at the corners. The press-fit inserts used are mainly M2.5, with some M2 and M3. So anyone who wants to replicate the assembly has to get hold of these inserts and the matching screws.

The cost of the components is not trivial. The UConsole, the CM4 compute module and the HackerGadgets expansion boards probably cost between 300 and 400 dollars. Adding the sensors and the build, the complete cyberdeck comes to around 1000 dollars. Even so, the project remains open and anyone who wants to can start from a reduced configuration and add the sensors later.

If you need a board for another computing project, the catalogue offers the Raspberry Pi 400 computer with Italian keyboard layout, which integrates a 4 GB Raspberry Pi 4 board. For more recent applications there is also the Raspberry Pi 5 with 2 GB of memory, with a quad-core Broadcom BCM2712 processor at 2.4 GHz.

Source: https://github.com/tricorderproject/cyberdeck

Related products

• Raspberry Pi 400 Computer with Italian Keyboard Layout
• Raspberry Pi 5 – 2 GB memory version

The post An Open Source Tricorder with Thermal Imaging and Spectroscopy appeared first on Open Electronics.

Samtec, Inc., a leader in connector services, announces a new product range designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate® HD and AcceleRate® HP families, known for their high density and high performance.

What oHFM is

oHFM, short for Open Harmonized FPGA Module, is the world’s first open modular standard for FPGAs. It tackles the common challenges of unique pinouts, custom form factors and proprietary thermal concepts in FPGA and SOM development by providing a unified, scalable architecture. Ready-made blocks and clear design rules cut engineering time for a faster time-to-market.

Features of the Samtec connectors for oHFM.c

SOMs based on connectors defined by the oHFM.c standard are optimised for compact high-speed interfaces, mid-range and high-end FPGAs, and field upgrades using Samtec connectors with a 5 mm or 10 mm stack height.

Samtec’s oHFM.c connectors feature high-density channels on a 0.635 mm pitch with performance targets of 64 Gbps PAM4 or 112 Gbps PAM4. Within each connector, the narrow edges of the Edge Rate® contact system are aligned with the connector body to reduce broadside coupling and crosstalk, optimising signal integrity. The Edge Rate contact system also has a smooth, wide milled mating surface that reduces wear and increases durability for high-cycle applications. Samtec’s IPC Class 3 compliant solder column termination technique is used to secure the connectors to the printed circuit board. The solder column termination offers superior solder joint reliability and excellent insertion loss and return loss performance.

Designed to meet the evolving needs of FPGA-based computing platforms, Samtec interconnect solutions enable scalable, flexible and reliable system architectures for next-generation embedded and edge applications.

Ordering and more information

Samtec SGeT oHFM.c connectors are available from stock and can be ordered directly from Samtec or through authorised distributors. For more information on Samtec interconnect solutions for SGeT oHFM.c applications, visit samtec.com/oHFM.

The post Samtec backs the SGeT oHFM.c standard with high-performance interconnects appeared first on Open Electronics.

Multiple examples (with scope readings!), formulas for everything you need, and everything laid out so nicely (even if they're a bit long sometimes)... I can't count how many times an exact scenario I encountered was directly described somewhere in the datasheet. Great stuff. submitted by /u/ExerciseFun6808 [link] [comments]

In my local maker space, someone asked about taking a project from a breadboard to a prototype board and wasn't quite ready to go buy a printed PCB quite yet. I think I've seen this topic come up a few times so I figured I'd share how I handle this. Basically, I place all my parts on the prototype board and then draw out where I think all the traces need to go, then I remove all the components. Then I take copper tape and tape over the connections. Then, I place all the parts back on and double check that everything looks good before soldering everything. NOTE: In my my examples below, I made the copper tape thick so it'd show up easier on camera, but if you are doing this for real, you want to copper tape to be thinner than the pads so that the solder connects the tape to each pad along the way. Here is a demonstration (without any components) that I did on a scrap prototype board: Place the copper tape down on the board and press it firmly in place. Using a craft knife, cut away the extra portion (thinner than what I've done here) so that you can see the pads along the length of the trace. You can reuse the portion that you've cut away, but be careful not to touch the adhesive side because it is very weak and the oil from you hands will prevent it from sticking. Finish trimming your trace, then add flux and solder over it. Normally when you solder a component, you want to tin your tip and then add solder to the pad (not your iron), but when doing these traces, you just need the solder from your tip. Ensure that each end that connects to a part is firmly soldered like normal. There are a log of reasons that I like this method. First, it is very intentional. You get to map out all of the work ahead of time and double and triple check your work before soldering anything to the board. Second, if you are planning on designing a PCB, you can use this intermediary step to test your assumptions and figure out if there are any problems. Finally, this method allows you to use both sides of the prototype board for your traces. This can be especially helpful when connecting components to ground without crossing over other traces. This isn't a "You should do this and sell this on the market" thing, but a quick "try it before you buy it" approach to transition from your breadboard to a prototype board and all it costs is a little time and some copper tape. submitted by /u/FrequentlyVeganBear [link] [comments]

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Bel Fuse Inc., a worldwide manufacturer of reliable components, systems and solutions for mission-critical applications in the industrial, medical and data solutions markets, has announced the XRCM 200 and 300 series, the second generation of DC-DC converters with an ultra-wide input voltage range. Designed for the most demanding rail and transportation applications, the new converters combine a compact form factor, an ultra-wide input voltage range and high efficiency to help engineers simplify system design while meeting the strict reliability and safety requirements of the rail sector.

“Rail operators and system designers need power solutions they can rely on, and that is at the heart of our work at Bel,” said Silvan Mueller, Business Development Manager for Rail Power Products. “This new generation of the XRCM series was designed to simplify installation, combining support for a wide input voltage range, a reduced footprint and the protection features technicians need to build resilient transportation systems.”

Key features

The dual-output XRCM 200 converter delivers 200W at ±15V and is a more compact and cost-effective option with low power consumption. The single-output XRCM 300 converter delivers 300W at 24V and offers an extended temperature range for continuous operation at an ambient temperature of up to 85°C. Both feature high power density, low inrush current and full protection against overheating, overvoltage, overcurrent and short circuits. Both are also designed to meet the latest safety standards, including EN 50155, EN 50121-3-2 and AREMA.

Shown at InnoTrans 2026

The converters were presented at the Bel Fuse booth (Hall 17, Stand no. 310) at InnoTrans 2026 in Berlin, held from 22 to 25 September, together with other power conversion solutions designed for modern rail and transportation systems. Both converter families support DC input voltages from 16.8V DC to 137.5V DC and are compatible with all the most common rail battery systems, allowing OEMs to standardise on fewer power platforms across multiple vehicle architectures.

Together, the XRCM200 and XRCM300 converters give engineers versatile power conversion solutions that reduce integration effort, improve system reliability and support the evolving needs of modern rail electronics.

Summary

• Product series: XRCM
• Applications: rail sector
• Distribution availability: to be defined

For more information on the XRCM series, visit the dedicated DC-DC Converters page. Other product lines are available on the Bel Fuse website.

The post Bel Fuse launches XRCM200 and XRCM300 converters for rail appeared first on Open Electronics.

The wireless charging is not working what might be the issue. Im afraid if i pull the board out it will give me trouble to place it back submitted by /u/Jazzlike-Maybe-6424 [link] [comments]

JBR-001 is an open source desktop robot that sees and recognizes the objects in front of it, then reacts with movements, sounds and animations. It was created by syntheticAIdata and built around the Arduino UNO Q 2GB. Inside there are three servos, a camera, a distance sensor, a buzzer and an animated display. So it is not yet another blinking ornament: it is a platform for experimenting with robotics, computer vision and edge AI on a workbench.

Assembly starts from a body of 3D-printable parts that house the board and the rest of the electronics. The head contains the camera, mounted so that it looks straight ahead of the robot. On the back of the same head sits a Modulino Distance, which continuously measures the distance to nearby objects. The arms and the rotation of the head, on the other hand, come from three servos. The mechanics are therefore easy to replicate for anyone who already has a 3D printer at home.

Servo pins and distance thresholds in the code

The three servos split the tasks: one rotates the head, the other two control the arms. In the code the pins are HEAD_SERVO_PIN = 9, LEFT_ARM_SERVO_PIN = 10 and RIGHT_ARM_SERVO_PIN = 11. The rest positions are all at 90 degrees, so HEAD_CENTER = 90, LEFT_ARM_CENTER = 90 and RIGHT_ARM_CENTER = 90. The servos also use a separate external power supply instead of drawing power from the UNO Q: a forced choice when three motors start at the same time.

The distance sensor decides when the robot should notice someone. In the code the detection threshold is DETECTION_DISTANCE = 200.0, while the reset one is RESET_DISTANCE = 250.0. The units are not specified in the project material, so they should be checked on the bench before trusting them. The margin between the two thresholds prevents the robot from switching on and off continuously when someone stays right on the boundary.

Heartbeat on the display, a greeting in notes and the vision model

The robot’s responses go through three different channels. The LED matrix display is driven with bitmaps of 8 rows by 13 columns, the two used for the small and large heart. In the heartbeat animation the delays are 120, 100, 160 and 700 milliseconds, and the last long gap gives the sense of the pause between one beat and the next. The sound greeting playHello instead uses the notes 523 Hz (C5), 659 Hz (E5), 784 Hz (G5) and 1047 Hz (C6), that is a C major arpeggio rising by one octave.

The most interesting part comes from the camera mounted in the head. It connects through a USB-C hub and gives the robot a front view of its surroundings. The captured images can be processed on the UNO Q with a trained computer vision model: this way JBR-001 does not just understand that something is nearby, but identifies the object and uses the result to decide how to react. Consequently the same hardware can turn its head, move its arms, change the image on the display or play a short sequence.

• Arduino UNO Q 2GB as the robot’s brain
• Modulino Distance for continuous distance measurement
• Modulino Motors for motion control
• Modulino Buzzer for sound sequences
• Arduino USB-C Hub (8 in 1) to connect the camera
• Three servos for head and arms
• Camera mounted in the head
• 3D printer for the body parts

On the software side you need Arduino App Lab and the JBR-001 source code, plus a trained computer vision model for object recognition. The project has 1805 views and 2 respects. Anyone who wants to rebuild it starts here: the maker syntheticAIdata’s site, where the code and the instructions to replicate the build are. For the servos, an RC servo control module simplifies the wiring when the channels to drive grow. The project’s distance sensor is a Modulino, and as an alternative you can consider a ToF laser sensor for close-range measurement. The board everything runs on is the 2GB version, while the catalogue also lists the Arduino UNO Q 4GB in a complete kit: same family, more memory for vision models.

Source: https://projecthub.arduino.cc/syntheticaidata/jbr-001-a-desktop-companion-robot-powered-by-arduino-uno-q-b11c96

Related products

• Arduino shield for RC servo control
• ToF Laser Distance Sensor with VL53L3CX
• Arduino UNO Q 4GB – Complete kit with accessories

The post JBR-001: the open source desktop robot that recognizes objects appeared first on Open Electronics.

Arrow Electronics has announced global access for customers who want to remotely evaluate NXP® Semiconductors’ discrete Ara240 neural processing unit through the Digital Test Drive capability, giving engineers the chance to get early access to advanced AI models and technologies for computer vision, generative AI and multimodal systems, and letting them assess performance and start a project before investing in hardware.

The importance of edge AI

As AI adoption accelerates across industrial, robotics and intelligent vision applications, developers increasingly look to implement more sophisticated AI workloads closer to where data is generated. Working with AI locally at the edge can help reduce latency, improve data privacy and limit dependence on cloud-based processing, particularly in time-sensitive applications.

Features of the NXP Ara240 DNPU

Designed to support these requirements, the NXP Ara240 DNPU delivers up to 40 tera eTOPS (equivalent operations per second), supporting workloads that include LLMs (large language models), VLMs (vision language models), transformers and CNNs (convolutional neural networks). With LPDDR4 memory support up to 16 GB, this device makes it possible to run larger and more complex AI models directly on edge and embedded systems, without having to rely on cloud resources.

Arrow’s Digital Test Drive platform

To help those who want to explore these capabilities, Arrow has made NXP’s Ara240 solutions available through the Digital Test Drive platform, often described as a “digital test platform”: a cloud-based, Arrow-managed remote hardware testing and development environment that lets you evaluate physical embedded boards over the web, without having the hardware on your desk.

This makes it possible to remotely access live systems based on NXP i.MX applications processors paired with the Ara240 DNPU, in order to evaluate real AI applications such as computer vision, large language model inference and vision language AI, without having to rely on specifications or benchmark data. This gives a better understanding of system performance and of a project’s suitability, before committing to hardware investments or architecture decisions.

What the key players say

“Developers need a hands-on way to understand how advanced AI technologies will behave in real applications,” said Justin Mortimer, senior director of product marketing, Secure Connected Edge, NXP Semiconductors. “By providing access to NXP’s Ara240 DNPUs through Digital Test Drive, Arrow lets designers evaluate real edge AI performance more quickly and make design decisions more knowingly.”

“At Arrow we are committed to helping customers accelerate their AI journey by removing the barriers between innovation and implementation,” said Shelby Schnurrenberger, vice president of global semiconductor management and suppliers at Arrow Electronics. “By integrating NXP’s Ara240 AI accelerator into our Digital Test Drive platform, designers can immediately evaluate advanced edge AI workloads, gaining the necessary hands-on experience with the technology before investing in hardware. Together with NXP, we are enabling them to move faster from initial idea to production and to unlock new opportunities in intelligent edge applications. Digital Test Drive extends global access to NXP’s AI portfolio, making it possible to evaluate performance, explore use cases and shorten development cycles anywhere in the world. This collaboration strengthens our commitment to making edge AI more accessible, scalable and practical for customers working in industrial, robotics, computer vision and emerging intelligent systems sectors.”

Availability and access

The NXP Ara240 evaluation environment is now available through Digital Test Drive, which simplifies early-stage testing by removing common obstacles such as kit availability, shipping delays, setup complexity and software installation.

For more information, visit Digital Test Drive – Remote Hardware Testing.

The post Arrow Electronics Offers Digital Test Drive for NXP’s Ara240 AI Accelerator appeared first on Open Electronics.