Новини світу мікро- та наноелектроніки

Any country’s core is its military industry. It serves as the nation’s shield, facing up against any possible threats and hostility. The only aim of the businesses engaged in defence operations is to power the nation’s strongest point and advance the industry with state-of-the-art technology. India is the world’s third-largest army investment,  contributing 3.7% of global military spending. Due to growing requirements, the government is suggesting that the military industry be one of the key drivers of economic growth and development. The Indian defence and aerospace industry ecosystem is about to undergo a change that will enable it to firmly establish its position among the world’s leading industries. The ecology of the Indian military industry has already experienced several fundamental changes, including a move from being mostly dependent on imports to being an internationally competitive sector. The previous ten years have seen the government create policy frameworks that have both fostered and facilitated the design, development, and manufacturing of various military systems and platforms by Indian firms. To conduct co-development, share technology, and produce in India for both domestic consumption and exports, it has also promoted cooperation with international businesses.  

1. Hindustan Aeronautics Ltd. 

The Bengaluru-based Hindustan Aeronautic Limited,  formerly known as Hindustan Aircraft was rebranded to its current name in 1964. HAL, a government-owned business, focuses on defence and aerospace technologies. HAL today includes 21 production divisions and 11 distinct R&D divisions spread throughout India’s four industrial zones. HAL’s current concentration is on avionics, software development,  spare parts, fighter planes, helicopters, jet engines,  and marine gas turbine engines, as well as reconditioning and modernising Indian military aircraft. The company builds and assembles engines and aircraft such as the Prentice, Vampire, and Gnat under licence from worldwide designers. In partnership with the United States Intercontinental  Aircraft business, the business began constructing the Curtiss Hawk Fighter, Harlow Trainer, and Vultee bomber aircraft.  

2. Bharat Electronics Ltd. 

Bharat Electronics was founded in 1954 in Bengaluru.  The Indian government runs the corporation, which mostly manufactures aerospace and military technologies. It works for both the defence and non-defense industries. It offers a comprehensive range of goods to provide for both sectors, such as Naval Systems, Avionics, Electro-Optics, Land-based radars,  and so on. Non-defense services include Cyber  Security, Homeland Security, and so on. Radar,  communication C4I systems, and electro-optics are the company’s three main products. The firm has five headquarters offices and nine production plants in India. 

3. Bharat Dynamics Ltd. 

Bharat Dynamics, a public sector organisation under the Ministry of Defence, Government of India, was founded in 1970 and is headquartered in Hyderabad.  It has a guided missile system production facility as well as equipment needed to serve the Indian Armed  Forces. As a leader in the nation’s production of Anti Tank Guided Missiles (ATGM), BDL is now producing next-generation ATGMs as well as surface-to-air weapon systems, launchers, underwater weapons,  decoys, and test apparatus. From manufacturing missiles to becoming a weapon system integrator, it now provides the Indian Armed Forces with end-to-end solutions. Four production facilities are run by  Bharat Dynamics: one in Visakhapatnam, Andhra  Pradesh, and three in Telangana (Hyderabad, Bhanur,  and Ibrahimpatnam).  

4. Mazagon Deck Shipbuilders  

Mazagon Dock Shipbuilders Limited (MDL) is a  Ministry of Defence-administrated Schedule A, Mini Ratna Category-I shipyard. It builds Scorpene  Submarines, Stealth Frigates, and Missile Destroyers for the Indian Navy. Mazagon Dock developed quickly when the government took control of it in 1960,  becoming India’s top shipbuilding yard for creating warships for the Navy and offshore buildings for the  Bombay High. From a single, modest ship repair unit,  it has expanded into a multi-unit, multi-product business with a notable increase in production, the application of contemporary technology, and sophisticated goods.MDL has constructed 801 vessels in all since 1960, including 27 warships, advanced destroyers, missile boats, and 7 submarines.  

5. Cochin Shipyard Ltd.  

In India, Cochin Shipyard Ltd. is the biggest shipbuilding and maintenance complex. It is one of several in a range of infrastructure for mariners in the  Indian state of Kerala’s port city of Kochi. The first indigenous aircraft carrier in India was built by Cochin  Shipyard. India constructed and built its first aircraft carrier, INS Vikrant (previously known as the Project 71  “Air Defence Ship”), for the Indian Navy. 

6. Bharat Earth Movers Limited ( BEML) 

BEML was founded in 1964 and began operations as a  Bengaluru-based producer of mining equipment, rail coaches, and spare components. The corporation works in the rail and metro, mining and construction,  and defence industries. 

The company’s principal offerings include rail and metro products (metro cars, electric multiple units, and maintenance vehicles), defence goods (heavy-duty trucks, bridge systems, and recovery vehicles), and mining equipment (dozers, dumpers, excavators,  loaders, and shovels). Its production facilities are located in Bengaluru, Mysuru, Kolar Gold Fields, and  Palakkad in the state of Karnataka (Kerala).  

7. DRDO

DRDO was founded in 1958 and is based in New  Delhi. It is a research and development centre run by the Ministry of Defence, to advance defence technology for India and raise awareness of a critical defensive system. With 52 laboratories devoted to developing military technologies in fields including aeronautics, armaments, electronics, ground combat engineering, life sciences, materials, missiles,  and naval systems, DRDO is the biggest and most varied research organisation in India. 

8. MTAR Technologies  

In the last forty years, MTAR has been a major player in the military industry, providing India’s aerospace and defence projects with high-precision indigenous systems, subsystems, and components. Since the program’s inception, MTAR has contributed to the development of strategic missiles and offers a range of high-precision parts and subassemblies.  

9. Mahindra Defence System  

One of the leading producers of armoured vehicles for the military and paramilitary is Mahindra Defence  Systems. With more than 70 years of combined project and operations management experience, the company is regarded as one of the nation’s leading defence contractors. It provides the Army, Navy, and  Air Force with cutting-edge and potent defence equipment in addition to several other services,  such as aircraft mobile surveillance.  

10. Bharat Forge Ltd. 

On June 19, 1961, Neelkanthrao A. Kalyani launched the firm. This is the flagship firm of the Kalyani Group,  with its headquarters located in Pune, Maharashtra. An  Indian multinational corporation, Bharat Forge Limited is active in the forging, automotive, energy, mining,  railway, maritime, aerospace, and defence sectors.  Bharat Forge has been providing defence manufacturing services to the Indian and international armed forces for more than ten years. Crankshafts,  steering knuckles, connecting rods, and front axle beams are among the goods produced by Bharat  Forge. The new approach is to advocate for lightweight materials with a significant global footprint. 

 

India’s increasing prominence in the international military industry is evidence of its capacity to adapt and compete on a worldwide scale. It is no doubt that the government would keep encouraging and helping the Indian military sector to increase its market share in the world. It is expected that the military industry’s sustain expansion and prosperity and strongly believed that India will maintain its position as a major participant.

 

The post DEFENCE COMPANIES IN INDIA appeared first on ELE Times.

Many people have heard the term cache coherency without fully understanding the considerations in the context of system-on-chip (SoC) devices, especially those using a network-on-chip (NoC). To understand the issues at hand, it’s first necessary to understand the role of cache in the memory hierarchy.

Cache in the memory hierarchy

Inside a CPU are a relatively small number of registers with extremely high speed. These registers can be accessed by the CPU in a single clock cycle. However, their storage capacity is minimal. In contrast, accessing the main memory for reading or writing data takes up many clock cycles. This often results in the CPU being idle most of the time.

In 1965, a British computer scientist, Maurice Wilkes, introduced the concepts of cache memory and memory caching. This involved having a small amount of fast memory called a cache adjoining the CPU. The word “cache” itself comes from the French word “cacher,” meaning “to hide” or “to conceal,” the idea being that the cache hides the main memory from the CPU.

This process operates based on two key points. First, when a program running on the CPU does something involving one location in the main memory, it typically performs operations on several nearby locations. Consequently, when the CPU requests a single piece of data from the main memory, the system brings in data from nearby locations.

A high-level view of a memory hierarchy involving a simple cache is illustrated in Figure 1.

Figure 1 High-level view shows where cache stands in the memory hierarchy. Source: Arteris

This approach ensures that related data is readily available if needed. Second, programs usually conduct numerous operations on the same data sets. Therefore, storing the actively used data in the cache closest to the CPU is beneficial. This proximity allows quicker access and processing of the data.

Cache in the context of an SoC

In the case of an SoC, the cache is implemented on-chip in high-speed, high-power, and low-capacity SRAM. Meanwhile, the main memory is implemented off-chip on the PCB, typically in the form of low-speed, low-power, and high-capacity DRAM.

To minimize latency, designers have added multiple levels of cache in many of today’s SoCs. These typically include three levels: L1, L2 and L3. The L1 cache is closest to the CPU and has the smallest capacity but the fastest access times, usually within 1-2 clock cycles. The L2 cache is a bit further from the CPU and offers higher capacity but slower access times, generally between 4-10 clock cycles. The L3 cache is still further from the CPU and provides the largest capacity among the three, but has the slowest access times, ranging from 10-30 clock cycles.

Multiple cache levels maximize performance while minimizing off-chip accesses to the main memory. Accessing this main memory can consume hundreds of clock cycles. By using multiple cache levels, data can be retrieved more quickly from these caches rather than the slower main memory, enhancing overall system efficiency.

The complexity of all this increases when multiple CPU cores are involved. Consider a common scenario with a cluster of four CPU cores, labeled as cores 0 to 3, each with its own dedicated L1 cache. In some implementations, each core will also have its own dedicated L2 cache, while all four cores share a common L3 cache. In other designs, cores 0 and 1 share one L2 cache, cores 2 and 3 share another L2 cache, and all four collectively use the same L3 cache. These varying configurations impact how data is stored and accessed across different cache levels.

Typically, all processor cores within a single cluster are homogeneous, meaning they are the same type. However, having multiple clusters of processor cores is becoming more common. In many cases, the cores in different clusters are heterogeneous, or of different types. For example, with Arm’s big.LITTLE technology, the “big” cores are designed for maximum performance but are used less frequently.

The “LITTLE” cores are optimized for power efficiency with lower performance and are used most of the time. For instance, in an Arm-based smartphone, the “big” cores might be activated for tasks like Zoom calls, which are relatively infrequent. In contrast, the “LITTLE” cores could handle more common, less demanding tasks like playing music and sending text messages.

Maintaining cache coherency

In systems where multiple processing elements with individual caches share the same main memory, it’s possible to have multiple copies of the shared data. For example, one copy could be in the main memory and more in each processor’s local cache. Maintaining cache coherency requires that any changes to one copy of the data are reflected across all copies. This can be achieved by updating all copies with the new data or marking the other copies invalid.

Cache coherency can be maintained under software control. However, software-managed coherency is complex and challenging to debug. Still, it can be achieved using techniques such as cache cleaning, whereby modified data stored in a cache is marked as dirty, meaning it must be written back to the main memory. Cache cleaning can be performed on the whole cache or with specific addresses, but it is costly in CPU cycles and must be performed on all CPUs holding a copy of the data.

The preferred way to maintain cache coherency is with special hardware built to manage the caches invisibly from software. For example, the caches associated with the cores in a processor cluster typically include hardware required to maintain cache coherence.

To use or not to use

SoCs are composed of large numbers of functional blocks called intellectual property (IP) blocks. A processor cluster would be one such IP block. A common way to connect the IP blocks is to use a NoC.

In many SoC designs, coherence isn’t needed outside of the processor cluster, allowing a non-coherent or IO-coherent AXI5 or AXI5-Lite NoC, such as NI from Arm or FlexNoC from Arteris. However, for SoC designs with multiple processor clusters lacking inherent cache coherence or when integrating third-party IPs or custom accelerator IPs that require cache coherence, a coherent NoC is needed. Examples include CMN from Arm using the AMBA CHI protocol or Ncore from Arteris using AMBA ACE and/or CHI.

Figure 2 In the above example, the main system employs a coherent NoC in conjunction with a safety island employing a non-coherent NoC. Source: Arteris

Applying cache coherency universally across the entire chip can be resource-intensive and unnecessary for specific components. Therefore, isolating cache coherency to a subset of the chip, such as CPU clusters and specific accelerator IPs, allows for more efficient use of resources and reduces complexity, as shown in Figure 2. Coherent NoCs like Ncore excel in scenarios where stringent synchronization is necessary. Meanwhile, non-coherent interconnects, such as FlexNoC, are ideal in scenarios where strict synchronization is unnecessary.

Designers can strategically balance the need for data consistency in specific areas while benefiting from more streamlined communication channels where strict coherence is unnecessary. In today’s sophisticated heterogeneous SoCs, the synergy between coherent and non-coherent interconnects becomes a strategic advantage, enhancing the overall efficiency and adaptability of the system.

Andy Nightingale, VP of product management and marketing at Arteris, has over 36 years of experience in the high-tech industry, including 23 years in various engineering and product management positions at Arm.

 

Related Content

• Verifying Cache Coherence
• Cache Coherence Issues for Real-Time Multiprocessing
• SoC design: When is a network-on-chip (NoC) not enough?
• Efficient checks for cache-coherency verification in complex SoCs
• Fast, Thorough Verification of Multiprocessor SoC Cache Coherency

The post SoC design: When a network-on-chip meets cache coherency appeared first on EDN.

Author: Rajendra Malhotra, Managing Director of mXmoto

India’s Electric Vehicle (EV) market of India is expected to reach $37.70 billion by 2028, with 44 million vehicles on road by 2030. The government is promoting EV adoption through tax incentives, subsidies, and the Faster Adoption and Manufacturing of Hybrid and Electric Vehicles (FAME) scheme.

The year 2023 has further intensified hopes in this segment, with 15,29,614 registrations of EVs, which is 49% more than the previous year. A recognizable presence of OEMs, a large domestic market, and the availability of qualified engineers and a workforce are potential factors that will accelerate the growth of the EV industry in India. On the demand side, fully loaded with advanced features, new-generation EVs are gradually piquing consumers’ interest and motivating them to drive into a green mobility era.

Electric two-wheelers, the fastest-growing segment in clean mobility, are enticing performance-savvy consumers of India as these bikes offer them quick acceleration, high breaking power, and controlled rides. These new-generation bikes are also helpful in saving consumers’ money by eliminating the need for engine oil, clutches, timing belts, and spark plugs. However, the charging infrastructure is still limited, especially in the outskirts, and it is a challenge that should be addressed through effective public-private collaborations.

Challenges Encountered

India currently has 1640 active public EV chargers, but this number is expected to rise as the population grows. The transportation industry contributes to 10-14% of India’s greenhouse gas emissions, making a comprehensive charging infrastructure crucial. A robust charging infrastructure is crucial for promoting electric vehicle adoption, as range anxiety and lack of nearby charging options are significant barriers.

Across the country, conductive charging technology is prevalent. Still, there’s a growing need for high-power DC chargers, which require a high electricity supply and provide faster charging to electric vehicles. Therefore, fast charging stations in metropolitan areas are crucial for urban residents, while ultra-fast charging is vital for long travels.

Other pertinent issues in the charging infrastructure should also be dealt with through effective policies and strategies. Lack of charging gun standardisation (interoperability), grid capacity and stability, non-uniform electricity supply codes across states and UTs, long processing time, and investment in land acquisition are the major issues which need to be addressed on a priority basis.

Opportunities Explored

Indeed, the sector has witnessed a silver line as the government came out with many constructive measures in the recent past. The de-licensing of EV charging stations/installations to prioritize infrastructure development is a significant step in this direction. Permits for private charging stations in residential areas and offices have been extended and individuals are allowed to easily contact local or state nodal agencies. Permission of charging points in public places like malls, housing societies, office complexes, restaurants, and hotels is a great support to reinforce the charging infrastructure. Moreover, the government’s decision to make charging stations mandatory in public parking lots and gas stations over 5,000 square meters resulted in a significant increase in charging stations across the country.

The partnership among stakeholders has been marked as a potent solution to resolve charging issues. In this regard, partnerships between charging station operators and electric vehicle (EV) manufacturers are crucial for the growth and success of the EV ecosystem. Several charging station operators have partnered with EV manufacturers to expand charging infrastructure, providing convenient access to charging facilities for customers. Renewable energy sources like solar energy are also used by many charging station owners, reducing their carbon footprint and addressing power shortages in some regions.

SMEs in the sector are also preparing to establish electric vehicle charging stations due to rising demand, and banks and NBCs are offering them loans for this purpose. Battery swapping technology is another important facilitator in this direction, which allows depleted batteries to be replaced with fully charged ones, reducing manual labour and accelerating the charging process.

Towards a positive scenario

India’s transition towards an electric future could be driven by strategic investments, insightful policies, and collective will. Unquestionably, a robust charging infrastructure boosts consumer confidence, creates economic opportunities, and stimulates the EV industry’s growth. As the charging station market evolves, innovative trends emerge, attracting investments and technology development.

The post Charging Infrastructure for Electric Bikes: Challenges and Solutions appeared first on ELE Times.

STMicroelectronics is a highly renowned Semiconductor company that develops competitive products in segments of Smart Mobility, Power & Energy, and Cloud-connected Autonomous systems. It is among the global leaders with strong R&D and innovation teams working from across several locations around the world.

ST is also known for its innovative industry-first and leading fast wireless charging solutions. It has been providing wireless charging receivers to the largest smartphone makers in the world since day one.

Rashi Bajpai, Sub-Editor at ELE Times spoke with Mr. Leong Foo Leng, Director, Technical Marketing for Wireless Charging and Battery Management Products at STMicroelectronics about their latest Qi Wireless Charging Solutions.

This is an excerpt from the interaction.

1. Help us understand the development process of Qi Wireless chargers.

To develop efficient Qi wireless charging solutions, it is crucial to define specific use cases for the wireless receiver and transmitter applications. This involves careful consideration of factors such as power requirements, system architecture, mechanical design, and coil selection.

The customer builds a prototype based on ST reference designs that are optimized for performance and efficiency, using our unique wireless power software and development ecosystem.

ST can provide support to key customers during coil design simulation and tuning of the wireless charging circuit, as well as the official Wireless Power Consortium Qi compliance tester to run in-house precertification tests to speed up the entire Qi certification process.

The Wireless Power Consortium (WPC) maintains and develops the standards for a variety of wireless power applications. This includes Qi standards for smartphones and portable devices up to 15W of power. There are more than 350 member companies in the consortium including STMicroelectronics.

Once the customer evaluates and validates their solution, they can submit their product for WPC Qi certification.

The process includes passing compliance testing at an Accredited Testing Lab (ATL), interoperability testing at an Interoperability Testing Centre (IOC) and being a WPC member in good standing as the product owner.

Certified products are allowed to use the Qi logo on the product and packaging.

2. Brief us on STWLC38 and STWBC86 ICs’ use cases and application areas.

ST has a wide range of wireless charger IC solutions from 1 W to 100 W, including transmitters and receivers providing low standby power, accurate foreign object detection (FOD) and reverse charging features for personal electronics, industrial and medical applications.

STWLC38 is a Qi 1.3 certified receiver IC which is optimized for small form factor applications such as wearables and hearables. It was designed for low power applications and can deliver up to 15 W of output power. It is also capable of operating in Tx mode to transmit power to charge other devices. The device can provide power up to 5W Output power in this mode. STWLC38 can be paired with the STWBC86 transmitter IC for a complete wireless charging solution.

The chip comes in an ultra-compact WLCSP40 package (Wafer Level Chip Scale Package) measuring only 2.1mm by 3.3mm. The total area of the STWLC38 solution (including peripheral components) is 7mm x 7mm. The Vout is configurable from 4V – 12V in 25mV resolution. It is packed with the power of ARM 32-bit Cortex-M0+ core running at up to 64MHz, 32kB RRAM for Firmware patch-ability like flash memory, 64KB ROM and 16kB RAM.

Two reference designs, STDES-WLC38WA and STDES-WLC38TWS, are available to simplify prototyping with the STWLC38 for wearable and true wireless stereo applications, respectively.

STDES-WLC38WA for wearable designs

Some use cases for STWLC38 include medical and beauty devices as wireless charging enables a hermetic product design so devices can be easily sterilized before subsequent use.

Applications for STWLC38 include low-power wireless charging in smartphones, wearable/hearables, asset tracking devices, and medical, and healthcare equipment.

STWBC86 is a highly integrated monolithic wireless power transmitter solu

STDES-WLC38TWS for True Wireless Stereo designs

tion suitable for applications delivering up to 5 W.

This wireless power transmitter has a 32-bit, 64 MHz Arm® Cortex® M0+ microcontroller, SRAM, FTP (Few Times Programmable) NVM memory, 10-bit A/D converter, and on-chip current sense.

It also has an integrated low-impedance half-bridge/full-bridge inverter to achieve high efficiency and low power dissipation.

The STDES-WBC86WTX reference design, based on STWBC86, is available to help developers start a 2.5 W wireless charging project quickly.

STDES-WBC86TX for wearable designs

Applications for STWBC86 include Smartphone charging, medical electronics, Smart Wearables, and Charging for Hearables.

STWLC38 and STWBC86 use on-chip nonvolatile memory to save configuration parameters, and exchange configuration data and charging control commands through the I²C interface.

The STWLC38 receiver comes in a 2.12 mm x 3.32 mm WLCSP40 pin (Wafer Level Chip Scale) package, while the STWBC86 transmitter is in 3.26 mm x 3.67 mm WLCSP72 pin.

3. Explain the role of STSW-WPSTUDIO in the development of Qi Wireless chargers.

The STSW-WPSTUDIO enables the tuning and design of wireless power devices. It provides support for the complete evaluation of wireless power device STWLC38 and STWBC86 from register tuning to the final NVM programming.

The GUI enables real-time monitoring of key internal parameters, which are streamed over a USB connection, and provides wizards to simplify otherwise complex tasks such as FOD (Foreign Object Detection) and custom coil design.

The GUI can be used to generate a custom configuration file, making it easier to quickly change the configuration of the board and/or transfer the configuration to another board.

The key features include:

• Access to key configuration registers
• Live chart of key electrical parameters such as output voltage, rectifier voltage,
• IC temperature and currents
• Coil selection wizard to assist in the design of a custom coil
• Foreign object detection (FOD) tuning wizard
• NVM programming
• Header generator tool for programming with an external microcontroller

4. Brief us on the features of the STEVAL-WLC38RX receiver board and STEVAL-WBC86TX transmitter board. 

STEVAL-WLC38RX receiver board

The STEVAL-WLC38RX evaluation board, based on STWLC38, is designed for wireless power receiver applications and allows its user to quickly start their wireless charging receiver projects.

Features-

• Design optimized for 15 W application using 8uH coil 57mmx57mm.
• WPC Qi 5W BPP and 15 W EPP compatible
• On board USB-I²C bridge for monitor and control the STWLC38 using the STSW-WPSTUDIO Graphical User Interface (GUI).
• User Manual, BOM, Schematic, PCB Gerber files for Evaluation and reference design available online:

https://www.st.com/en/power-management/stwlc38.html

STEVAL-WLC38RX includes several safety mechanisms providing over temperature (OTP), overcurrent (OCP) and overvoltage (OVP) protections as well as Foreign Object Detection (FOD) for reliable designs.

STEVAL-WBC86TX transmitter board

The STEVAL-WBC86TX evaluation board, based on STWBC86, is designed for wireless power transmitter applications and allows its user to quickly start their 5 W Qi BPP wireless charging projects.

Features

• Design optimized for 5 W application using 6.3 uH coil 53mmx53mm
• WPC Qi 5 W BPP compatible
• On board USB-I²C bridge for monitor and control the STWBC86 using the STSW-WPSTUDIO Graphical User Interface (GUI).
• User manual, BOM, Schematic, PCB Gerber files for evaluation and reference design available online:

https://www.st.com/en/power-management/stwbc86.html

STEVAL-WBC86TX includes several safety mechanisms providing over temperature (OTP), overcurrent (OCP) and overvoltage (OVP) protections as well as Foreign Object Detection (FOD) for reliable designs.

5. Give us some insights into the intricate design of STEVAL-WLC38RX and STEVAL-WBC86TX evaluation boards and how they help in further enhancing the development of Qi wireless chargers.

The STEVAL-WLC38RX and STEVAL-WBC86TX evaluation boards are designed to help developers create high-performance Qi wireless chargers.

The boards have gone through Electro Magnetic Compatibility tests and conform to the EU Declaration of Conformity, as well as the UK Declaration of Conformity for the Radio Equipment Directive.

The on-board USB-I2C bridge allows for a direct interface with a PC to run a GUI tool.

The board features overvoltage and overcurrent protection, ensuring safe and reliable operation of Wireless charging solution.

The board, with test pins, provide easy access to critical power and communication signals for faster testing and debugging.

The evaluation boards can be used for quick testing and debugging. For the final customer prototype, they can reuse the reference design, for example, STDES-WLC38WA.

Watch more here: Wireless Charging Solutions for up to 15 W Applications

The post ST’s Leading Range of Fast Wireless Charging Solutions- the First Preference for the Largest Smartphone Makers Globally appeared first on ELE Times.

Hitachi High-Tech Analytical Science, a Hitachi High-Tech Corporation wholly owned subsidiary engaged in the manufacture and sales of analysis and measuring instruments, has expanded its coatings and materials analysis range with the launch of the new FT210 XRF analyzer. 

The FT210 includes a proportional counter detector for routine measurements of common platings and incorporates advanced user-friendly features designed to enhance high-volume testing needs.

The launch of the FT210 also includes an updated version of FT Connect software for all FT200 Series models, with enhanced usability features for reporting, creating calibrations and data handling. This new version of FT Connect expands the RoHS screening capabilities of the FT230. FT Connect V1.2 software is compatible with both new and existing instruments.

Give your team 45 minutes back a day

The FT210, much like the FT230, includes features to improve productivity by reducing the time needed to set up a measurement and act on data. To accelerate analysis set-up, the FT200 Series comes with the largest-in-industry sample view, wide view camera, auto-focus and auto approach, and a smart recognition feature called Find My Part, which automatically recognizes features to be measured and chooses the correct analytical method.  

Expanded RoHS capabilities for the FT230

New FT Connect software updates mean that the FT230 can now be used to check more materials for conformity to the latest hazardous substance directives. The RoHS screening capabilities are built into the FT Connect’s market-leading interface ensuring analysis is simple and seamless.  

Matt Kreiner, Hitachi High-Tech Analytical Science’s Coatings Analysis Product Manager, said, “The FT210 offers our customers the ability to choose the best detector for their coating applications. Thanks to the introduction of the new software features, we’ve continued to innovate on how operators interact with an XRF coatings analyzer to increase testing volumes by simplifying setup and reducing the potential for mistakes. By using either the FT210 or the FT230, XRF owners can gain up to 45 minutes of operator time back per day to focus on value-added tasks or to increase testing volumes.”

From simple plating and coatings to sophisticated applications on the smallest features, Hitachi High-Tech’s extensive range of analyzers – now including the FT210 – is designed to confidently measure coated parts throughout production, from incoming inspection, to process control through final quality control.

The post Hitachi High-Tech introduces the FT210, enhancing its FT200 Series for smart coatings analysis and connected measurements appeared first on ELE Times.

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Microchip recently announced the MCP998x family of automotive-grade, multi-channel temperature sensors—the so-called largest portfolios of its kind in the industry.

Tokyo-based Mitsubishi Electric Corp is to release six new J3-Series power semiconductor modules for various electric vehicles (xEVs), featuring either a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC-MOSFET) or a silicon-based RC-IGBT (insulated-gate bipolar transistor), with compact designs and scalability for use in the inverters of electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs). All six J3-Series products will be available for sample shipments from 25 March...

The first set of dedicated speech synthesis ICs addresses the limitations of microcontroller-based voice systems.

In booth #2245 at the Applied Power Electronics Conference (APEC 2024) in Long Beach, CA (25–29 February), SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-frequency, high-temperature and high-efficiency power semiconductor devices — is debuting new portfolio of QSiC 1200V MOSFET modules, which are designed to operate reliably in challenging conditions and enable high-performance, high-density implementation while minimizing both dynamic and static losses...

Fabless micro-LED company Poro Technologies Ltd (a spin off from the Cambridge Centre for Gallium Nitride at the UK’s University of Cambridge that has developed porous GaN material and has an R&D center in Hsinchu, Taiwan) and Taiwan-based foundry Powerchip Semiconductor Manufacturing Corp (PSMC) have announced a strategic partnership in micro-LEDs for display applications...

Quite possibly the single biggest thing that drives me nuts about consumer electronics products is when their implementation doesn’t grasp the technical comprehension limitations of consumers. I can’t count the number of products I’ve personally tried out over the years, far from the far greater number of products that I’ve only heard about—which is probably still only a fraction of the total number of products for which what I’m about to say qualifies—that underperformed in the market, if not flat-out failed, primarily-to-completely because the target audience couldn’t figure out how to get them to work properly. Great ideas, many of them…just poorly implemented.

Today’s case study is, I think, a perfect example of this implementation-induced undershoot. Regular readers with long-term memories may recall a four-part series that EDN published on my behalf back in 2019 on my five-camera Blink outdoor security camera system acquired and set up in May of that year:

• Overview
• Camera teardown

(I was apparently using U.S. quarters for size-comparison scale purposes back then, versus the pennies I now employ in my photos)

• Sync network module teardown

• and installation and impressions

Here’s a reminder of how the system works, from the original writeup in the series:

A Blink system consists of one or multiple tiny cameras, each connected both directly to a common router or to an access point intermediary (and from there to the Internet) via Wi-Fi, and to a common (and equally diminutive) Sync Module control point (which itself then connects to that same router or access point intermediary via Wi-Fi) via a proprietary “LFR” long-range 900 MHz channel.

The purpose of the Sync Module may be non-intuitive to those of you who (like me) have used standalone cameras before…until you realize that each camera is claimed to be capable of running for up to two years on a single set of two AA lithium cells. Perhaps obviously, this power stinginess precludes continuous video broadcast from each camera, a “constraint” which also neatly preserves both available LAN and WAN bandwidth. Instead, the Android or iOS smartphone or tablet app first communicates with the Sync Module and uses it to initiate subsequent transmission from a network-connected camera (generic web browser access to the cameras is unfortunately not available, although you can also view the cameras’ outputs from either a standalone Echo Show or Spot, or a Kindle Fire tablet in Echo Show mode).

I want to requote something I said in the previous paragraph for emphasis: “Each camera is claimed to be capable of running for up to two years on a single set of two AA lithium cells.” Now do the math; I’ve owned and operated the Blink camera system for more than 4.5 years as I write these words in early December 2023. And finally, here’s the kicker: until the other day, they still had the same original two-AA lithium cell sets in them. That’s downright impressive, qualified only by the clarification that except initially and briefly (when all the subsequent alerts drive me to rapidly reconsider my stance) they haven’t been “armed”, i.e., poised to respond to perceived motion in their fields of view. That particular configuration decision means several things: first off, the cameras aren’t perpetually in a partially powered up state, poised to react to the motion-triggered outputs of their PIR sensors. Plus, of course, they aren’t then fully powering up to capture, encode and transmit audio and video streams to the “cloud” via Wi-Fi.

So why the “downer” tone of this writeup’s title? The “downside” to long battery life, if I can mentally stretch to come up with one, is that after so long without cell swaps one forgets when he or she last did such the battery-exchange procedure, or maybe even cease to remember that the cameras run on batteries at all. I admittedly didn’t realize how long it’d been in my case until I went back and figured out when I’d bought them in the first place. As winter approached this year, the “neighbors” were as usual getting more active as they prepped for hibernation:

and so, for this and other security-reassurance reasons, my wife started manually checking all the cameras via the Blink app on her phone each night before retiring to bed. After a few days, she began complaining to me that they were acting erratically. Sometimes, for example, one or a few of them would respond slowly. Or it’d take a few tries before they’d respond. Or the audio and/or video streams would prematurely cease. Or they’d not respond at all.

The next day, when she’d relay these observations to me, I’d try to look at them myself via my various mobile devices (Android phones and iPads) and they’d all work fine each time. And the cameras were mounted in inconvenient-access locations that necessitated tall ladders and such:

Plus, replacement lithium AA batteries are pricey. And, anyway, all the cameras reported both to her (at the time) and me (the next day) that their existing batteries were still “OK”:

So, since she’d recently migrated to a new smartphone, my first suggestion was for her to delete and then reinstall the Blink app. Which seemingly worked at first, but then didn’t. Step two: unplug and plug back in the Sync Module. Same inconsistent and ultimately unsatisfying outcome.

Finally, I “swallowed the bitter pill”, climbed up on the tall wobbly ladder, and swapped out all the batteries in all the cameras. Voila, everything now works fine again. What’s now obvious, as well as I admittedly strongly suspected at the time (ignorance and avoidance are bliss, don’cha know), is that:

• It’s generally colder outside now than it was earlier this year when the cameras were working reliably.
• It’s particularly cold at night, when my wife was checking them, versus the next day, when I was debugging them.
• And colder temperatures, while they may be ideal (to a point) for long-term storage of batteries, are sub-optimal when trying to use them.

We’re techie folks. We already understand such things. But the average consumer doesn’t. All they know is that their cameras aren’t working any more, although they still report that their batteries are “OK”. So, what do these users conclude? Their expensive gear has broken and is destined only for the landfill. They’re never going to buy anything that says “Blink” on it ever again. And they’re going to tell all their friends, family members and colleagues about their negative experiences, too.

On the one hand, putting myself in Blink’s engineers’ shoes, I get it. Again, lithium cells are expensive. You don’t want to prematurely report battery failure, because excessively frequent replacements are a “negative” in their own right. But I’d suggest that the company’s counterbalanced too far in the opposite direction here. Agree or disagree, readers? Let me know in the comments.

—Brian Dipert is the Editor-in-Chief of the Edge AI and Vision Alliance, and a Senior Analyst at BDTI and Editor-in-Chief of InsideDSP, the company’s online newsletter.

Related Content

• Blink: Security camera system installation and impressions
• Blink: Security cameras with a power- and bandwidth-stingy uplink
• Apple’s MagSafe technology: Sticky, both literally and metaphorically
• Lenovo’s Smart Clock 2: A “charged” device that met a premature demise

The post Blink Cameras and their batteries: Functional abnormalities and consumer liabilities appeared first on EDN.

Infineon Technologies AG of Munich, Germany and Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — have expanded and extended their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018 (when Wolfspeed was known as Cree). The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon’s general supply chain stability, also with regard to the growing demand for silicon carbide semiconductor products for automotive, solar and electric vehicle (EV) applications and energy storage systems...

Vacuum pumps and systems manufacturer Busch Vacuum Solutions of Maulburg, Germany and Pfeiffer Vacuum of Aßlar, Germany (also part of the Busch Group) are jointly constructing a new sales, systems and service center in Sisseln, Switzerland, 35km east of Basel, for completion in 2025...

In response to the escalating demand for powerful yet compact USB-C power delivery (PD) chargers, Infineon Technologies AG has launched the EZ-PD PAG2, a sophisticated secondary-side controlled ZVS flyback converter chipset. Comprising the EZ-PD PAG2P and EZ-PD PAG2S, this innovative chipset integrates USB PD, a synchronous rectifier, and a PWM controller, addressing the need for efficient communication and isolation between primary and secondary sides.

The heart of this groundbreaking technology lies in the pulse-edge transformer (PET) CYPET121, facilitating seamless integration of the EZ-PD PAG2 chipset into USB-C adapters, chargers, and travel adapters. Supporting noncomplementary active-clamp flyback (NCP-ACF) and quasi-resonant flyback with zero voltage switching (QR-ZVS) topologies, the chipset boasts enhanced efficiency, making it an ideal solution for modern charging needs.

The EZ-PD PAG2 family caters to diverse applications, providing a versatile and efficient power delivery solution. With support for PD 3.1 standard power range (SPR), programmable power supply (PPS), and 28V extended power range (EPR), the chipset ensures fast and reliable charging. Its compatibility with BC v1.2, AFC, Apple charging, and QC5.0, coupled with universal AC line input support from 90 to 265 V AC, enhances its global usability.

Key features of the EZ-PD PAG2 family include programmable soft-start using an external ss capacitor, offering controlled power-ups and adaptability to different load conditions. Operating in discontinuous conduction mode (DCM), critical conduction mode (CrCM), continuous conduction mode (CCM), burst, and skip modes, the chipset accommodates various regional power sources and device types, ensuring efficient and flexible power management.

The EZ-PD PAG2 family encompasses four specialized products:

1. EZ-PD PAG2S-AC: A secondary-side ACF controller with efficient energy recycling, incorporating USB-PD protocol functionality.
2. EZ-PD PAG2S-QZ: A ZVS controller focusing on QR-ZVS flyback, featuring USB-PD protocol functionality.
3. EZ-PD PAG2P: A primary HV startup controller with integrated functions for improved system performance, including high-voltage startup, PET receiver, gate drivers, fault protection, x-cap discharge, and V cc boost converter.
4. EZ-PD PAG2S-PS: An integrated USB PD and synchronous-rectification (SR) controller, designed to be paired with third-party pulse-width-modulation (PWM) controllers. It boasts a shunt voltage regulator for constant voltage and current control via optocouplers, offering best-in-class SR performance with fast turn-on/off time and support for volt-second integration to prevent false SR activation.

Infineon’s EZ-PD PAG2 chipset marks a significant leap forward in meeting the surging demand for advanced USB-C power delivery chargers. With its cutting-edge features and adaptability, this chipset is poised to play a pivotal role in shaping the future of efficient and high-performance charging solutions.

The post Infineon Unveils Cutting-Edge EZ-PD PAG2 Chipset to Meet Surging Demand for USB-C Power Delivery Chargers appeared first on ELE Times.

The GPS (Global Positioning System) has become a vital tool in the age of digital connectivity, completely changing how we traverse and engage with our environment. Let’s explore the depths of GPS, from its beginnings to its possibilities in the future.

What is GPS?

The Global Positioning System, or GPS, is a navigation system that uses satellites to provide exact location and time data anywhere on Earth. It now plays a crucial role in our everyday routines, helping us navigate strange roads, monitor our exercise regimens, and even help with emergency services.

Who Invented GPS?

The US Department of Defense is recognized for having developed GPS. Ivan A. Getting was instrumental in the system’s early development and was part of a team of scientists and engineers who developed and implemented the system. GPS’s history began in the 1960s when the US Department of Defense launched the initiative to help the armed forces with their maritime needs. In 1995, the system was completely operational and released for civilian use, revolutionizing navigation for people all over the world.

GPS Types

Different GPS types are available to meet the needs of different applications. The Global Navigation Satellite System (GNSS) is the most widely used, but there are other regional systems as well, such as GLONASS (Russia), Galileo (European Union), and BeiDou (China).

How Does GPS Work?

A constellation of satellites in Earth’s orbit is used by GPS to operate. These satellites send out signals all the time that tell us where they are and what time it is. These signals are received by GPS receivers on Earth, which use a triangulation of the data from several satellites to determine the receiver’s exact location. There are a wide range of applications for GPS. GPS is essential for improving efficiency and safety in a variety of applications, from tracking devices for emergency services and personal fitness to navigation systems in cars and smartphones.

How to Use GPS

GPS operation has gotten remarkably easier. Since most smartphones have GPS receivers built in, users may access navigation apps and get real-time directions. Furthermore, for seamless navigation, standalone GPS devices—which are frequently utilized in cars—offer a dedicated interface.

GPS Module

A GPS receiver and an antenna are components of a self-contained GPS module. It is frequently found in many different electronics, giving precise position data that makes location-based features possible. Satellites, GPS receivers, and ground control stations are essential parts of a GPS system. Satellites send out signals, which are interpreted by GPS receivers on Earth to establish location, and are managed by ground control stations.

GPS Architecture

The space segment (satellites), the control segment (ground control stations), and the user segment (GPS receivers) make up the three segments of the GPS architecture. The correctness and functionality of the system are guaranteed by this tripartite structure.

GPS Advantages

There are several advantages to using GPS. In addition to helping with emergency response, improving fleet management and logistics, and enhancing navigation efficiency, it offers precise and up-to-date position information and supports several scientific applications.

GPS Disadvantages

GPS has limitations even with all of its benefits. Signal interference could occur in places with many trees or tall structures. The technology is also prone to interference because it depends on satellite transmissions.

Future of GPS

The potential for GPS is fascinating. We may anticipate improved functionality, quicker signal acquisition times, and more accuracy with continued advances. GPS applications may find new uses through integration with cutting-edge technology like augmented reality and artificial intelligence.

To sum up, GPS has developed from a navigational aid used by the military to a technology that is a part of everyday life. Its importance in contemporary society is highlighted by its ongoing development and incorporation into many areas. Future developments in GPS technology should guarantee that we can continue to traverse our environment with previously unheard-of ease and precision.

The post Navigating the World: A Comprehensive Guide to GPS Technology appeared first on ELE Times.

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The acquisition marks a larger trend of consolidation in the GaN industry.