Новини світу мікро- та наноелектроніки

Magnachip Semiconductor has developed a 1200-V, 75-A IGBT for solar inverters, housed in a TO-247PLUS package. The MBQA75T120RFS IGBT expands the company’s portfolio, which includes a 1200-V, 40-A IGBT and two 650-V IGBTs at 40 A and 75 A, all optimized for the solar energy market. This portfolio also offers four MXT medium-voltage MOSFETs designed for solar applications.

The latest IGBT device’s TO-247PLUS package features an expanded heat spreader, offering better heat dissipation than the standard TO-247. Additionally, the MBQA75T120RFS improves power efficiency by reducing conduction losses by over 14% compared to the previous generation. This enhancement ensures stable operation even under overload conditions, thereby boosting system reliability.

The MBQA75T120RFS IGBT integrates a fast-recovery anti-parallel diode that reduces switching losses by removing residual current. It also guarantees a maximum operating junction temperature of +175°C.

A datasheet for the MBQA75T120RFS IGBT was not available at the time of this announcement. The company plans to start mass production in October 2024.

Magnachip Semiconductor

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Magnachip grows IGBT lineup for solar energy appeared first on EDN.

Optimized for data center and AI workloads, Micron’s 9550 SSDs deliver sequential read speeds of 14 GB/s and sequential write speeds of 10 GB/s. Micron claims that the 9550 PCIe Gen5 drives are the industry’s fastest enterprise SSDs, outperforming similar competitive SSDs. With random reads of 3.3 million IOPS and random writes of 400,000 IOPS, these SSDs also beat the competition in random performance.

The 9550 solid-state drives integrate Micron’s own controller, NAND, DRAM, and firmware, offering swift performance along with improved power efficiency and security features. Drives are available in storage capacities ranging from 3.2 TB to 30.72 TB and in U.2, E1.S, E3.S form factors. They feature NVMe 2.0 and OCP 2.0 support, as well as OCP 2.5 telemetry capabilities for performance and health monitoring.

To safeguard data, the 9550 features self-encrypting drive capabilities and compliance with SPDM 1.2, SHA-512, and RSA standards. Options for FIPS 140-3 Level 2 and TAA compliance are also available.

The 9550 solid-state drives are now sampling globally.

9550 product page 

Micron Technology

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post Data center SSDs achieve blistering speeds appeared first on EDN.

A Bluetooth LE module, the EC4L15BA1 from KAGA FEI, offers a built-in antenna and various certifications to reduce development time and certification costs. Equipped with a Nordic nRF54L15 Bluetooth 5.4 SoC, the EC4L15BA1 reduces receive current by almost 50% compared to its predecessor, the EC2832AA2, which employs the nRF53832 Bluetooth 5.2 SoC.

The EC4L15BA1 wireless module features a 128-MHz Arm Cortex-M33 processor, 1.5 MB of nonvolatile memory, and 256 KB of RAM, providing more than double the processing capability of the EC2832AA2. Furthermore, Arm’s PSA Level 3 certification ensures that it meets the highest security needs.

In addition to single-mode Bluetooth 5.4, the multiprotocol module supports Zigbee, Thread, and Matter. It covers a frequency range of 2402 MHz to 2480 MHz, delivering +8 dBm of output power. The EC4L15BA1 operates from a single 1.7-V to 3.6-V power supply over a temperature range of -40°C to +105°C.

According to KAGA FEI, the EC4L15BA1 has obtained Bluetooth qualification and certifications for Radio Law MIC (Japan), FCC (USA), and ISED (Canada).

Samples of the EC4L15BA1 Bluetooth LE module will be available in November 2024. Mass production is scheduled to begin in June 2025.

EC4L15BA1 product page

KAGA FEI 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post BLE module optimizes power and processing appeared first on EDN.

In PCB design, using grounded copper pour can be a double-edged sword. Learn how to make smart design decisions on balancing copper layers, preventing dead copper issues, and enhancing PCB performance.

Odyssey Semiconductor Technologies Inc of Ithaca, NY, USA — which develops high-voltage vertical power switching components based on proprietary gallium nitride (GaN) processing technology — has updated the timelines for its plan to complete its dissolution and liquidation, as approved by stockholders at a special meeting on 3 June following the closing of the sale of substantially all of its asset to Power Integration Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) on 1 July. After completion of the relevant statutory and regulatory procedures, the firm also intends to declare a liquidating cash distribution, subject to payments of any claims and obligations...

Microchip recently unveiled the newest iteration of its enduring dsPIC family: the dsPIC33A. In an interview with Joe Thomsen, corporate vice president of digital signal controllers (DSCs) and Alexis Alcott, associate director of marketing at Microchip, the design and application scope of the new 32-bit MCU were elucidated. 

Performance upgrades

The dsPIC was intended for real-time control to fundamentally: 

1. Sense the state of a machine
2. Perform calculations, and
3. Make adjustments to the machine via a feedback loop

And while this functionality is not new to the 20-year old dsPIC family, the large leaps in performance are (Figure 1). 

Figure 1: The dsPIC33 DSC core evolution from the dsPIC30F to the dsPIC33A. Source: Microchip 

The dsPIC33A upgraded from its previous 16-bit core to a 32-bit CPU operating at 200 MHz for high performance. “All data paths have doubled, instruction set architecture doubled in size, the map engines all doubled, and by doing just that, you effectively get almost a 2x increase in performance” states Joe Thomsen. An additional double precision floating point unit (DP-FPU) addresses the previous generation’s limitations with fixed point math where users had to manually convert all floating point numbers, leaving potential room for human error. “If I’m using MATLAB, or any high level language that does math, you really want to be using a floating-point unit to use floating point math directly for ease of use.” The DSP engine advanced from 40-bit to 72-bit accumulators for better accuracy and 32-bit working registers “so when there is an interrupt, the user can switch a register set instead of having to push the state of the machine onto the stack at the beginning of an interrupt and pop it off the stack at the end of the interrupt”. 

Two high speed 12-bit ADCs jump from 3.5 megasamples per second (MSPS) to 40 MSPS for more efficient real-time control, allowing the embedded system to more quickly and accurately sense and respond. The DSC includes security with many hooks in hardware that will limit access including the potential for memory partitioning, secure debug, and immutable root of trust (RoT), etc. A slew of new peripherals have been included such as high resolution PWM modules, quadrature encoder interface (QEI) for motor control, as well as revamped comparators and op-amps with 100 MHz gain-bandwidth product (GBW). 

Several communication peripherals have also been added including I3C, ethernet T1S, and bidirectional synchronous serial interface (BiSS)—a protocol to implement a real-time interface. Finally, hardware trace has been introduced to remove the need for hardware breakpoints in the processing of debugging a control loop. Thomsen remarks, “If you’re spinning a motor in an EV that is taking ~300 kW of power, you don’t want to be stopping it and not controlling it anymore.” Hardware trace allows customers to monitor real-time variables while the motor is running without disturbing the program.

Figure 2: The dsPIC33A platform block diagram with key features and enhancements. Source: Microchip

Application  Motor control

However, what is the justification for this massive leapfrog in performance? Thomsen comments on this point by zooming into the two major application spaces of the dsPIC33A: power conversion and motor control. “Algorithms keep on getting more complex, customers are expecting to be able to run three, four, or even five motors from the same microcontroller and want to integrate other functions in cost-driven power conversion.” Applications for motor control include industrial fans, pumps, robotic arms, and autonomous guided vehicles (AGVs) on factory floors that demand more automation (Figure 3). In the automotive space, subsystems that were traditionally hydraulic or mechanical are now leveraging electric motors, increasing the number of motors per vehicle by an order of magnitude. Automotive use cases are generally not limited to commuter cars or even commercial vehicles but also e-mobility with e-scooters, e-bikes, and e-motorcycles. 

Power conversion

Regarding power conversion Joe notes, “The industry has shifted towards wide bandgap devices such SiC and GaN, which has enabled our customer to have extremely fast control loops that allow for incredibly efficient algorithms, but they need the performance for it.” In the pursuit of more sustainable solutions, electronic devices across numerous industries demand power density and energy efficiency, ranging from energy-efficient appliances to server power supplies in data centers. The applications for efficient power conversion and control extend beyond these industries: “LED lighting also necessitates responsive, flexible PWM controls to adjust brightness and color.” 

Figure 3: The dsPIC33A application spaces. Source: Microchip

dsPIC33 support

“As we did the dsPIC33A, our goal was to allow you to sense the state of the machine, do calculations based on it, and adjust the machine as fast as possible, because the faster you can do that, then the more cycles of learning you have with the machine,” Thomsen adds. However, accomplishing this fine-tuning within an embedded system can demand a substantial level of expertise. It is in this context that Microchip’s established ecosystem plays a pivotal role, accelerating the process through the provision of evaluation boards, reference designs accompanied by source code, software tools, and application firmware. Moreover, the dsPIC33A ensures compatibility with the legacy code and ecosystem of preceding dsPIC33 generations.

According to Thomsen, “the whole world is going model-based and so we’re working hard to make sure that you can model all of our parts,” where the goal is to equal or equivalent results when the system is put into actual hardware, “this way, you’re much more a system architect and the software is generated by the tools.” The seamless integration of model-based designs is particularly advantageous in high-power applications where traditional testing methods, such as those required for hundred-kilowatt fast chargers, pose significant cost and safety risks. Moreover, standards and safety certifications play a crucial role in various application domains, including automotive and data centers. The dsPIC33A incorporates an array of standards to cater to evolving regulatory requirements, encompassing functional safety, cybersecurity, and compliance with NIST standards.

Aalyia Shaukat, associate editor at EDN, has worked in the design publishing industry for seven years. She holds a Bachelor’s degree in electrical engineering, and has published works in major EE journals.

Related Content

• Microchip’s acquisition meshes AI content into FPGA fabric
• Fundamentals of I3C interface communication
• Elevating embedded systems with I3C
• Strengthening the pillars of information assurance in a world of evolving threats
• Proper IC interconnects for high-speed signaling

The post A look at Microchip’s new dsPIC33A digital signal controller appeared first on EDN.

• Expands on his current role as General Manager of Keysight India
• Responsible for expanding into emerging markets and territories across the Asia Pacific

Keysight Technologies, Inc. has announced the appointment of Sudhir Tangri as the Vice President of Asia Pacific Sales, effective from August 1, 2024. With his in-depth expertise and focus on delivering customer value, Sudhir will be responsible for expanding into new markets in the region.

“I am delighted to continue to build on Keysight’s momentum, offering customers innovative solutions that drive value creation,” said Sudhir Tangri, VP of Asia Pacific Sales and GM of India at Keysight. “Asia Pacific is home to some of the world’s fastest growing economies and I am thrilled to lead the company as we look to further expand into emerging markets and new territories. Keysight has continued to strengthen its global position and I look forward to building on this, working with our incredibly talented teams to support customers in the region.”

Tangri will succeed Jun Chie who has been promoted to the new Vice President of Product Management. The strategic appointments are set to support Keysight in its next era of growth as the company looks to accelerate its presence in emerging markets.

 Tangri brings over 25 years of experience in business leadership and sales management roles. During his 12 years leading Keysight India, the team has delivered innovative solutions across the communications, semiconductor, aerospace and defense, and automotive industries. Tangri will bring his high emphasis on customer satisfaction combined with his experience and deep business acumen to increase momentum. In addition to his new responsibilities, Tangri will continue to serve as the General Manager of Keysight India.

 

The post Keysight Appoints Sudhir Tangri as Vice President of Asia Pacific Sales appeared first on ELE Times.

Munich, Germany – 1 August 2024 – Many different trends are taking center stage in both consumer electronics and industrial applications, such as portability, electrification, and weight reduction. All of these trends require compact and efficient designs. They also go hand in hand with unconventional PCB designs with severe space constraints that limit the use of external components. To address these challenges, Infineon Technologies AG  expands its GaN portfolio with the CoolGaN Drive product family. It consists of the CoolGaN Drive 650 V G5 single switches, integrating one transistor plus gate driver in PQFN 5×6 and PQFN 6×8 packages, as well as the CoolGaN Drive HB 650 V G5 devices, combining two transistors with integrated high- and low-side gate drivers in a LGA 6×8 package. The new product family enables improved efficiency, reduced system size, and overall cost savings. This makes the devices suitable for longer-range e-bikes, portable power tools, and lighter-weight household appliances such as vacuums, fans, and hairdryers.

“For several years, Infineon has been focused on accelerating innovation in GaN to provide targeted solutions for real-world power challenges”, said Johannes Schoiswohl, Senior Vice President & General Manager, GaN Systems Business Line Head at Infineon. “The new CoolGaN Drive product family is another proof point of how we support our customers in developing compact designs with high power density and efficiency through GaN.”

The CoolGaN Drive family offers a wide range of single switches and half bridges with integrated drivers based on the recently announced CoolGaN Transistors 650 V G5. Depending on the product group, the components feature a bootstrap diode and are characterized by loss-free current measurement, and adjustable switch-on and switch-off dV/dt. They also provide OCP/OTP/SCP protection functions. As a result, the devices enable higher switching frequencies, leading to smaller and more efficient system solutions with high power density. At the same time, the bill of materials (BoM) is reduced. This not only results in a lower system weight, but also reduces the carbon footprint.

 

 

The post Infineon introduces new CoolGaN Drive product family of integrated single switches and half-bridges with integrated drivers appeared first on ELE Times.

Many different trends are taking center stage in both consumer electronics and industrial applications, such as portability, electrification, and weight reduction. All of these trends require compact and efficient designs. They also go hand in hand with unconventional PCB designs with severe space constraints that limit the use of external components...