ELE Times

Infineon and SolarEdge are partnering to advance the development of highly efficient next-generation Solid-State Transformer (SST) technology for AI and hyperscale data centres.
– The new SST is designed to enable direct medium-voltage to 800–1500V DC conversion with over 99% efficiency, reducing size, weight, and CO₂ footprint – The collaboration combines SolarEdge’s DC expertise with Infineon’s semiconductor innovation to support sustainable, scalable power infrastructure and further expansion into the AI data-centre market

Infineon Technologies AG and SolarEdge Technologies, Inc. announced a collaboration to advance SolarEdge’s Solid-State Transformer (SST) platform for next-generation AI and hyperscale data centres. The collaboration focuses on the joint design, optimization and validation of a modular 2-5 megawatt (MW) SST building block. It combines advanced silicon carbide (SiC) switching technology from Infineon with SolarEdge’s proven power-conversion and control topology set to deliver >99% efficiency, supporting the global shift towards high-efficiency, DC-based data centre infrastructure.

The Solid-State Transformer technology is well positioned to play a crucial role in future,
highly efficient 800 Volt direct current (VDC) AI data centre power architectures. The
technology enables end-to-end efficiency and offers several key advantages, including a
significant reduction of weight and size, a reduced CO₂ footprint, and accelerated
deployment of power distribution, among others, when connecting the public grid with data
centre power distribution. The SST under joint development will enable direct medium-
voltage (13.8–34.5 kV) to 800–1500 V DC conversion.

“Collaborations like this are key to enabling the next generation of 800 Volt DC data centre
power architectures and further driving decarbonization,” said Andreas Urschitz, Chief
Marketing Officer at Infineon. “With high-performance SiC technology from Infineon,
SolarEdge’s proven capabilities in power management and system optimization are
enhanced, creating a strong foundation for the efficient, scalable, and reliable infrastructure
demanded by AI-driven data centres.”

“The AI revolution is redefining power infrastructure,” said Shuki Nir, CEO of SolarEdge. “It
is essential that the data centre industry is equipped with solutions that deliver higher levels of efficiency and reliability. SolarEdge’s deep expertise in DC architecture uniquely positions us to lead this transformation. Collaborating with Infineon brings world-class semiconductor innovation to our efforts to build smarter, more efficient energy systems for the AI era.”

As AI infrastructure drives an unprecedented surge in global power demand, data centre
operators are seeking new ways to deliver more efficient, reliable, and sustainable power.
Building on more than 15 years of leadership in DC-coupled architecture and high-efficiency
power electronics, this development would enable SolarEdge to expand into the data-centre
market with solutions designed to optimize power distribution from the grid to the compute
rack. This optimization relies on the efficient conversion of power, a challenge that
semiconductor solutions from Infineon are addressing, enabling efficient power conversions
from grid to core (GPU). With a focus on delivering reliable and scalable power systems
based on all relevant semiconductor materials silicon (Si), silicon carbide and gallium nitride (GaN), Infineon is enabling reduced environmental footprint and lower operating costs for the AI data centre ecosystem.

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One of the natal and most crucial stages of electronic devices’ production is the design stage. It encompasses the creative, manual, and technical facets incorporated in an electronic device. The design stage allows manufacturers and developers to convert a textual system definition into a detailed and functional prototype before mass production. Almost all the functional requirements of an electronic device are addressed at the design stage itself.

Considering the BOM and the DFM are crucial at this stage to maintain or improve quality,
while keeping a check on the cost and expected features and performance.

Fundamentals of the Design Process

• Prior to investing in materials required for manufacturing, it is essential to establish a
  list of requirements. This helps the manufacturer understand the features required in
  the product. Similarly, it is essential to conduct a thorough market research to identify
  market gaps and consumer requirements to develop products that can address the
  consumer needs. A successful product is one that fulfills what the market of similar
  products lack.
• Subsequently, after the conceptualization is complete, the focus shifts to creating a
  design proposal and project plan. This defines the projected expenses involved in the
  manufacturing process, an approximate timeline, along with other design and
  manufacturing process segments.
• A final electronic device comprises of several small components like multiple
  microcontrollers, displays, sensors, and memory to name a few. The advent in
  technology has allowed us to leverage the usage of advanced software like Electronic
  Computer-aided design (ECAD) or Electronic Design Automation (EDA) tools to
  create the schematic diagram. These help in reducing the scope of error and act as
  catalysts to the design process.
• Eventually, the detailed schematic design proves beneficial for the next step where the
  schematic is transformed into a PCB layout.

Growing Trends in the Design Process

• The advancement in nanotechnology and microfabrication techniques have evolved
  the design process to allow for further miniaturization with increased integration on
  chips. Design engineers can now add more features than before on a single chip along
  with reducing its size.
• Present day electronic designs are trying to incorporate the usage of renewable energy
  as the industry shifts from fossil fuels. This change has forced designers to maneuver
  the design of electronic devices along with incorporating advanced features like IoT
  efficiency.
• The growing demand for sustainable devices has equally affected the design process
  which now needs to include features to reduce greenhouse gas emissions as well as
  reduce energy consumption. This has influenced electric designers to modify power
  converters and motor drives to reduce energy loss and increase efficiency.
• The contemporary times also require the integration of automation and robotics for
  both industrial and consumer electronic devices. The design process hence, has to assimilate these requirements to maintain the longevity of the electronic device to
  allow its easy adoption of advanced technology. The same goes for integration with
  artificial intelligence, a growing rage and one that is bound to prove monumental in
  the simplification of the process and usage of electronic devices.
• The major challenge in the design process is not the integration of such features but
  their human-friendly integration. Any feature in a device can fail to fulfil its purpose
  if it is not user-friendly, hence, the task falls on design engineers to make their access
  easy and durable.
• Apart from the features and structural innovation, the design process in upcoming
  electronic devices has also undergone a change in the materials used. Newer, flexible
  devices have changed the dynamics from rigid circuit boards to flexible substrates and
  conductive polymers. Electronic designers are now compelled to adhere to even
  mechanical flexibility in their electronic layouts.

Simplifying the Process for Complex Designs

As the need for miniaturisation and integration grows, the complexity of the design follows
suit, however, advancements in software and applications have simplified the process,
allowing designers to experiment with more creative ideas without compromising on the
timeline and costs.
While ECAD is one such innovation which has been adopted extensively now, some other
EDA tools are:-

• SPICE: This is a simulation tool used to analyse and predict the circuit's behaviour
  under different conditions before building a physical prototype. It helps, identify and
  fix potential issues in advance.
• OptSim: This software tool allows designers to evaluate and optimize the
  performance of optical links within a sensor design, predicting how light will behave
  through components like lenses, fibres, and detectors.

Conclusion
Designing for electronic devices is a dynamic process and requires engineers to stay up-to-
date with the industry and market trends. As automation, robotics, and artificial intelligence garner a strong hold among electronics, their integration for the design process is inevitable. The design process is that vital and non-linear stage in manufacturing which often continues even post testing for refinement and then for documentation and certification.

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Nuvoton Technology announced the MA35D16AJ87C, a new member of the MA35 series microprocessors. Featuring an industry-leading 15 x 15 mm BGA312 package with 512 MB of DDR SDRAM stacked inside, the MA35D16AJ87C streamlines PCB design, reduces product footprint, and lowers EMI, making it an excellent fit for space-constrained industrial applications.

Key Highlights-

•  Dual 64-bit Arm Cortex-A35 cores plus a Cortex-M4 real-time core
• Integrated, independent TSI (Trusted Secure Island) security hardware
• 512 MB DDR SDRAM stacked inside a 15 x 15 mm BGA312 package
• Supports Linux and RTOS, along with Qt, emWin, and LVGL graphics libraries
• Industrial temperature range: -40°C to +105°C
• Ideal for factory automation, industrial IoT, new energy, smart buildings, and smart cities

The MA35D16AJ87C is built on dual Arm Cortex-A35 cores (Armv8-A architecture, up to 800 MHz) paired with a Cortex-M4 real-time core. It supports 1080p display output with graphics acceleration and integrates a comprehensive set of peripherals, including 17 sets of UARTs, 4 sets of CAN-FD interfaces, 2 sets of Gigabit Ethernet ports, 2 sets of SDIO 3.0 interfaces, and 2 sets of USB 2.0 ports, among others, to meet diverse industrial application needs.

To address escalating IoT security challenges, the MA35D16AJ87C incorporates Nuvoton’s independently designed TSI (Trusted Secure Island) hardware security module. It supports Arm TrustZone technology, Secure Boot, and Tamper Detection, and integrates a complete hardware cryptographic engine suite (AES, SHA, ECC, RSA, SM2/3/4), a true random number generator (TRNG), and a key store. These capabilities help customers meet international cybersecurity requirements such as the Cyber Resilience Act (CRA) and IEC 62443.

The MA35D16AJ87C is supported by Nuvoton’s Linux and RTOS platforms and is compatible with leading graphics libraries including Qt, emWin, and LVGL, helping customers shorten development cycles and reduce overall development costs. The Nuvoton MA35 Series is designed for industrial-grade applications and is backed by a 10- year product supply commitment.

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Nokia and Rohde & Schwarz have created and successfully tested a 6G radio receiver that uses AI technologies to overcome one of the biggest anticipated challenges of 6G network rollouts, coverage limitations inherent in 6G’s higher-frequency spectrum.

The machine learning capabilities in the receiver greatly boost uplink distance, enhancing coverage for future 6G networks. This will help operators roll out 6G over their existing 5G footprints, reducing deployment costs and accelerating time to market.

Nokia Bell Labs developed the receiver and validated it using 6G test equipment and methodologies from Rohde & Schwarz. The two companies will unveil a proof-of-concept receiver at the Brooklyn 6G Summit on November 6, 2025.

Peter Vetter, President of Bell Labs Core Research at Nokia, said: “One of the key issues facing future 6G deployments is the coverage limitations inherent in 6G’s higher-frequency spectrum. Typically, we would need to build denser networks with more cell sites to overcome this problem. By boosting the coverage of 6G receivers, however, AI technology will help us build 6G infrastructure over current 5G footprints.”

Nokia Bell Labs and Rohde & Schwarz have tested this new AI receiver under real world conditions, achieving uplink distance improvements over today’s receiver technologies ranging from 10% to 25%. The testbed comprises an R&S SMW200A vector signal generator, used for uplink signal generation and channel emulation. On the receive side, the newly launched FSWX signal and spectrum analyzer from Rohde & Schwarz is employed to perform the AI inference for Nokia’s AI receiver. In addition to enhancing coverage, the AI technology also demonstrates improved throughput and power efficiency, multiplying the benefits it will provide in the 6G era.

Michael Fischlein, VP Spectrum & Network Analyzers, EMC and Antenna Test at Rohde & Schwarz, said: “Rohde & Schwarz is excited to collaborate with Nokia in pioneering AI-driven 6G receiver technology. Leveraging more than 90 years of experience in test and measurement, we’re uniquely positioned to support the development of next-generation wireless, allowing us to evaluate and refine AI algorithms at this crucial pre-standardization stage. This partnership builds on our long history of innovation and demonstrates our commitment to shaping the future of 6G.”

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European Space Agency (ESA), MediaTek Inc., Eutelsat, Airbus Defence and Space, Sharp, the Industrial Technology Research Institute (ITRI), and Rohde & Schwarz (R&S) have conducted the world’s first successful trial of 5G-Advanced Non-Terrestrial Network (NTN) technology over the Eutelsat’s OneWeb low Earth orbit (LEO) satellites compliant with 3GPP Rel-19 NR-NTN configurations. The tests pave the way for deployment of 5G-Advanced NR-NTN standard, which will lead to future satellite and terrestrial interoperability within a large ecosystem, lowering the cost of access and enabling the use of satellite broadband for NTN devices around the world.

The trial used OneWeb satellites, communicating with the MediaTek NR-NTN chipset, and ITRI’s NR-NTN gNB, implementing 3GPP Release 19 specifications including Ku-band, 50 MHz channel bandwidth and conditional handover (CHO). The OneWeb satellites, built by Airbus, carry transparent transponders, with Ku-band service link, Ka-band feeder link, and adopt the “Earth-moving beams” concept. During the trial, the NTN user terminal with a flat panel antenna developed by SHARP – successfully connected over satellite to the on-ground 5G core using the gateway antenna located at ESA’s European Space Research and Technology Centre (ESTEC) in The Netherlands.

David Phillips, Head of the Systems, Strategic Programme Lines and Technology Department within ESA’s Connectivity and Secure Communications directorate, said: “By partnering with Airbus Defence and Space, Eutelsat and partners, this innovative step in the integration of terrestrial and non-terrestrial networks proves why collaboration is an essential ingredient in boosting competitiveness and growth of Europe’s satellite communications sector.”

Mingxi Fan, Head of Wireless System and ASIC Engineering at MediaTek, said: “As a global leader in terrestrial and non-terrestrial connectivity, we continue in our mission to improve lives by enabling technology that connects the world around us, including areas with little to no cellular coverage. By making real-world connections with Eutelsat LEO satellites in orbit, together with our ecosystem partners, we are now another step closer to bring the next generation of 3GPP-based NR-NTN satellite wideband connectivity for commercial uses.”

Daniele Finocchiaro, Head of Telecom R&D and Projects at Eutelsat, said: “We are proud to be among the leading companies working on NTN specifications, and to be the first satellite operator to test NTN broadband over Ku-band LEO satellites. Collaboration with important partners is a key element when working on a new technology, and we especially appreciate the support of the European Space Agency.”

Elodie Viau, Head of Telecom and Navigation Systems at Airbus, said: “This connectivity demonstration performed with Airbus-built LEO Eutelsat satellites confirms our product adaptability. The successful showcase of Advanced New Radio NTN handover capability marks a major step towards enabling seamless, global broadband connectivity for 5G devices. These results reflect the strong collaboration between all partners involved, whose combined expertise and commitment have been key to achieving this milestone.”

Masahiro Okitsu, President & CEO, Sharp Corporation, said: “We are proud to announce that we have successfully demonstrated Conditional Handover over 5G-Advanced NR-NTN connection using OneWeb constellation and our newly developed user terminals. This achievement marks a significant step toward the practical implementation of non-terrestrial networks. Leveraging the expertise we have cultivated over many years in terrestrial communications, we are honored to bring innovation to the field of satellite communications as well. Moving forward, we will continue to contribute to the evolution of global communication infrastructure and strive to realize a society where everyone is seamlessly connected.”

Dr. Pang-An Ting, Vice President and General Director of Information and Communications Research Laboratories at ITRI, said: “In this trial, ITRI showcased its advanced NR-NTN gNB technology as an integral part of the NR-NTN communication system, enabling conditional handover on the Rel-19 system. We see great potential in 3GPP NTN communication to deliver ubiquitous coverage and seamless connectivity in full integration with terrestrial networks.”

Goce Talaganov, Vice President of Mobile Radio Testers at Rohde & Schwarz, said: “We at Rohde & Schwarz are excited to have contributed to this industry milestone with our test and measurement expertise. For real-time NR-NTN channel characterization, we used our high-end signal generation and analysis instruments R&S SMW200A and FSW. Our CMX500-based NTN test suite replicated the Ku-band conditional handover scenarios in the lab. This rigorous testing, which addresses the challenges of satellite-based communications, paved the way for further performance optimization of MediaTek’s and Sharp’s 5G-Advanced NTN devices.”

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As AI tools increasingly take on real-world tasks, the roles of professionals, from copywriters to engineers, are undergoing a rapid and profound redefinition and reenvisioning. This swift transformation, characteristic of the AI era, is shifting core fundamentals and operational practices. Sometimes AI complements people, other times it replaces them, but most often, it fundamentally redefines their role in the workplace.

In this story, we look further into the emerging roles and responsibilities of an engineer as AI tools gain greater traction, while also tracking the industry’s shifting expectations through the eyes of prominent names from the electronics and semiconductor industry. The resounding messages?  Engineers must anchor themselves in foundational principles and embrace systems-level thinking to thrive.

The Siren Song of AI/ML

There’s no doubt that AI and Machine Learning (ML) are the current darlings of the tech world, attracting a huge talent pool.  Raghu Panicker, CEO of Kaynes Semicon, notes this trend: “Engineers today at large are seeing that there are more and more people going after AI, ML, data science.” While this pursuit is beneficial, he issues a crucial caution. He urges engineers to “start to re-look at the hardcore electronics,” pointing out the massive advancements happening across the semiconductor and systems space that are being overlooked.

The engineering landscape is broadening beyond just circuit design. Panicker highlights that a semiconductor package today involves less purely “semiconductors” and more physics, chemistry, materials science, and mechanical engineering. This points to a diverse, multi-faceted engineering future.

The Bright Future in Foundations and Manufacturing

 The industry’s optimism about the future of electronics, especially in manufacturing, is palpable. With multiple large-scale projects, including silicon and display fabs, being approved, Panicker sees a “very, very bright” future for Electronics and Manufacturing in India.

He stresses that manufacturing is a career path engineers should take “very seriously,” noting that while design attracts the larger paychecks, manufacturing is catching up and has significant, long-term promise. He also brings up the practical aspect of efficiency, stating that minimizing test time is critical for cost-effective customer solutions, requiring a deep understanding of the trade, often gained through specialized programs.

Innovate, Systematize, Tinker: The Engineer’s New Mandate

Building on this theme, Shitendra Bhattacharya, Country Head of Emerson’s Test and Measurement group, emphasizes the need for a community of innovators. He challenges the new generation of engineers to “think innovation, think systems,” which requires them to “get down to dirtying their hands.”

Bhattacharya is vocal about the danger of focusing solely on the “cooler or sexier looking fields like AI and ML.” He asserts that the future growth of the industry, particularly in India, hinges on local innovation and the creation of homegrown products and OEMs. To achieve this, he calls for a shift toward integrated coursework at the university level.

“System design requires you to understand engineering fundamentals. Today, that is missing at many levels… knowing only one domain is not good enough for it. It will not cut it.” – Shitendra Bhattacharya, Emerson

This call for system design thinking —the ability to bring different fields of engineering together—is a key takeaway for thriving in the AI age.

The Return of the ‘Tinkerer’

This focus on fundamental, hands-on knowledge is echoed strongly by  Raja Manickam, CEO of iVP Semicon. He reflects on how the education system’s pivot toward coding and computer science led to the loss of skills like  tinkering  and a foundational understanding of “basics of physics, basics of electricity.”

Manickam argues that AI’s initial impact will be felt most acutely by IT engineers, and the core electronics sector needs engineers who are “more fundamentally strong.” The emphasis is on the joy and necessity of building things from the very scratch. To future-proof their careers, engineers must actively cultivate this foundational, tangible skill set.

The AI Enabler: Transforming the Value Chain

While the focus must return to engineering basics, it’s vital to recognize that AI is not a threat to be avoided but a tool to be mastered.  Amit Agnihotri, Chief Operating Officer at  RS Components & Control, provides a clear picture of how AI is already transforming the semiconductor value chain end-to-end.

AI is embedded in:

• Design: Driving simulation and optimization to improve power/performance trade-offs.
• Manufacturing: Assisting testing, yield analytics, and smarter process control.
• Supply Chain: Enhancing forecasting, allocation, and inventory strategies with predictive analytics.
• Customer Engagement: Providing personalized guidance and virtual technical support to accelerate time-to-market.

Agnihotri explains that companies like RS Components leverage AI to improve component discovery, localize inventory, and provide data-backed design-in support, accelerating prototyping and scaling with confidence.

Conclusion: Engineering for Longevity

The AI age presents an exciting paradox for engineers. To successfully leverage the most advanced tools, they must first become profoundly proficient in the most fundamental aspects of their discipline. The future belongs not to those who chase the shiniest new technology in isolation, but to those who view AI as an incredible enabler layered upon an unshakeable foundation of physics, materials science, system-level design, and hands-on tinkering.

Engineers who embrace this philosophy—being both an advanced AI user and a foundational master—will be the true architects of the next wave of innovation in the core electronics and semiconductor industry. The message from the industry is clear:  Get back to the basics, think in systems, and start innovating locally.  That is the wholesome recipe for a thriving engineering career in the AI era.

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Anritsu Corporation announced the launch of its Virtual Network Master for AWS MX109030PC, a virtual network measurement solution operating in Amazon Web Services (AWS) Cloud environments. This software-based solution enables accurate, repeatable evaluation of communication quality across networks, including Cloud and virtual environments. It measures key network quality indicators, such as latency, jitter, throughput, and packet (frame) loss rate, in both one-way and round-trip directions. This software can accurately evaluate end-to-end (E2E) communication quality even in virtual environments where hardware test instruments cannot be installed.

Moreover, adding the Network Master Pro MT1000A/MT1040A test hardware to the network cellular side supports consistent quality evaluation from the core and Cloud to field-deployed devices.

Anritsu has developed this solution operating on Amazon Web Services (AWS) to accurately and reproducibly evaluate end-to-end (E2E) quality under realistic operating conditions even in virtual environments.

The Virtual Network Master for AWS (MX109030PC) is a software-based solution to accurately evaluate network communication quality in Cloud and virtual environments. Deploying software probes running on AWS across Cloud, data center, and virtual networks enables precise communication quality assessment, even in environments where hardware test instruments cannot be located.

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Rohde & Schwarz announced that MediaTek is utilizing the CMP180 radio communication tester to test and verify TC-DFT-s-OFDM, a proposed waveform technology for 6G networks. This collaboration demonstrates the critical role of advanced test equipment in developing foundational technologies for next-generation wireless communications.

TC-DFT-s-OFDM (Trellis Coded Discrete Fourier Transform spread Orthogonal Frequency Division Multiplexing) is being proposed to 3GPP as a potential candidate technology for 6G standardization. MediaTek’s research shows that TC-DFT-s-OFDM delivers superior Maximum Coupling Loss (MCL) performance across various modulation orders, including advanced configurations like 16QAM.

Key benefits of this 6G waveform proposed by MediaTek include enhanced cell coverage through reduced power back-off requirements and improved power efficiency through optimized power amplifier operation techniques such as Average Power Tracking (APT). TC-DFT-s-OFDM enables up to 4dB higher transmission power compared to traditional modulation schemes while maintaining lower interference levels, implying up to 50% gain in coverage area.

“MediaTek’s selection of our CMP180 for their 6G waveform verification work demonstrates the instrument’s capability to support cutting-edge research and development,” said Fernando Schmitt, Product Manager, Rohde & Schwarz. “As the industry advances toward 6G, we’re committed to providing test solutions that enable our customers to push the boundaries of wireless technology.”

The collaboration will be showcased at this year’s Brooklyn 6G Summit, November 5-7, highlighting industry progress toward defining technical specifications for future wireless communications. As TC-DFT-s-OFDM advances through the 3GPP standardization process, rigorous testing using advanced equipment becomes increasingly critical.

The CMP180 radio communication tester is part of the comprehensive test and measurement portfolio from Rohde & Schwarz designed to support wireless technology development from research through commercial deployment.

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The L98GD8 driver from STMicroelectronics has eight fully configurable channels for driving MOSFETs in flexible high-side and low-side configurations. It is able to operate from a 58V supply, and the L98GD8 provides rich diagnostics and protection for safety and reliability.

The 48V power net lets car makers increase the capabilities of mild-hybrid systems including integrated starter-generators, extending electric-drive modes, and enhancing energy recovery to meet stringent new, globally harmonized vehicle-emission tests. Powering additional large loads at 48V, such as the e-compressor, pumps, fans, and valves further raises the overall electrical efficiency and lowers the vehicle weight.

ST’s L98GD8 assists the transition, as an integrated solution optimized for driving the gates of NMOS or PMOS FETs in 48V-powered systems. With eight independent, configurable outputs, a single driver IC controls MOSFETs connected as individual power switches or as high-side and low-side switches in up to two H-bridges for DC-motor driving. It can also provide peak-and-hold control for electrically operated valves. The gate current is programmable, helping engineers minimize MOSFET switching noise to meet electromagnetic compatibility (EMC) regulations.

Automotive-qualified and featured to meet the industry’s high safety and reliability demands, the L98GD8 has per-channel diagnostics for short-circuit to battery, open-load, and short-to-ground faults. Further diagnostic features include logic built in self-test (BIST), over-/under-voltage monitoring with hardware self-check (HWSC), and a configurable communication check (CC) watchdog timer.

In addition, overcurrent sensing allows many flexible configurations while the ability to monitor the drain-source voltage of external MOSFETs and the voltage across an external shunt resistor help further enhance system reliability.  There is also an ultrafast overcurrent shutdown with dual-redundant failsafe pins, battery-under voltage monitoring, an ADC for battery and die temperature monitoring, and H-bridge current limiting.

The L98GD8 is in production now, in a 10mm x 10mm TQFP64 package with a budgetary pricing starting at $3.94 for orders of 1000 pieces.

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Keysight Technologies, announced the release of Quantum System Analysis, a breakthrough Electronic Design Automation (EDA) solution that enables quantum engineers to simulate and optimize quantum systems at the system level. This new capability marks a significant expansion of Keysight’s Quantum EDA portfolio, which includes Quantum Layout, QuantumPro EM, and Quantum Circuit Simulation. This announcement comes at a pivotal moment for the field, especially following the 2025 Nobel Prize in Physics, which recognized advances in superconducting quantum circuits, a core area of focus for Keysight’s new solution.

Quantum System Analysis empowers researchers to simulate the quantum workflow, from initial design stages to system-level experiments, reducing reliance on costly cryogenic testing and accelerating time-to-validation. This integrated approach supports simulations of quantum experiments and includes tools to optimize dilution fridge input lines for thermal noise and qubit temperature estimation.

Quantum System Analysis introduces two transformative features:

• Time Dynamics Simulator: Models the time evolution of quantum systems using Hamiltonians derived from electromagnetic or circuit simulations. This enables accurate simulation of quantum experiments such as Rabi and Ramsey pulsing, helping researchers understand qubit behavior over time.
• Dilution Fridge Input Line Designer: Allows precise modeling of cryostat input lines to qubits, enabling thermal noise analysis and effective qubit temperature estimation. By simulating the fridge’s input architecture, engineers can minimize thermal photon leakage and improve system fidelity.

Chris Mueth, Senior Director for New Markets at Keysight, said: “Quantum System Analysis marks the completion of a truly unified quantum design workflow, seamlessly connecting electromagnetic and circuit-level modeling with comprehensive system-level simulation. By bridging these domains, it eliminates the need for fragmented toolchains and repeated cryogenic testing, enabling faster innovation and greater confidence in quantum system development.”

Mohamed Hassan, Quantum Solutions Planning Lead at Keysight, said: “Quantum System Analysis is a leap forward in accelerating quantum innovation. By shifting left with simulation, we reduce the need for repeated cryogenic experiments and empower researchers to validate system-level designs earlier in the development cycle.”

Quantum System Analysis is available as part of Keysight’s Advanced Design System (ADS) 2026 platform and complements existing quantum EDA solutions. It supports superconducting qubit platforms and is extensible to other modalities such as spin qubits, making it a versatile choice for quantum R&D teams.

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Infineon Technologies is expanding its MOTIX 32-bit motor control SoC (System-on-chip) family with new solutions for both brushed (BDC) and brushless (BLDC) motor applications: TLE994x and TLE995x. The new products are tailored for small- to medium-sized automotive motors, ranging from functions such as battery cooling in electric vehicles to comfort features such as seat adjustment. The number of such motors continues to grow in modern, especially electric, vehicles and they are used in an increasing number of safety-critical applications.

Therefore, car manufacturers require reliable, compact and cost-effective solutions that
integrate multiple functions. Based on Infineon’s extensive experience in motor control, the
new SoCs combine advanced integration with functional safety and cybersecurity-relevant
features.

The three-phase TLE995x (BLDC) is ideal for pumps and fans in thermal management
systems, while the two-phase TLE994x (BDC) targets comfort functions such as electric
seats and power windows. Both devices integrate advanced diagnostic and protection
functions that support reliable motor operation.

By combining a gate driver, microcontroller, communication interface, and power supply in a single chip, Infineon’s SoCs offer exceptional functionality with minimal footprint. The new LIN-based devices feature an Arm Cortex-M23 core running up to 40 MHz, with
integrated flash and RAM. Field-Oriented Control (FOC) capability ensures efficient and
precise motor operation. Compared to the established TLE986x/7x family, the TLE994x/5x
offers enhanced peripherals, flexible PWM generation via the CCU7, and automatic LIN
message handling to reduce CPU load. All devices comply with ISO 26262 (ASIL B) for
functional safety. Additionally, the integrated Arm TrustZone technology provides a
foundation for improved system security.

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India’s battery manufacturing capacity stands at nearly 60 GWh and is projected to reach 100 GWh by next year, said Mr. Nikhil Arora, Director, Encore Systems.

Arora said that with automation efficiencies crossing 95% and advanced six-axis robotics handling 625Ah, 12kg cells, we are driving large-scale localization in the energy storage value chain. Our sodium-based cell technologies, safer, highly recyclable and ideal for grid-scale storage reflect India’s growing self-reliance in clean energy.

“Collaborations with IIT Roorkee, NIT Hamirpur and local automation partners are accelerating innovation and technology transfer. As storage costs fall from ₹1.77 to ₹1.2 per unit in five years, India is set to achieve cost parity between solar and storage, advancing its journey toward energy independence.” Arora said while speaking at the 18th Renewable Energy India Expo in Greater Noida.

Speaking at the event, Mr. Ankit Dalmia, Partner, Boston Consulting Group, said “India’s next five years will be shaped by advances in battery storage, digitalization, and green hydrogen. New emerging chemistries such as LFP, sodium-ion and solid-state batteries could cut storage costs by up to 40% by 2030, enabling 24×7 renewable power. AI-driven grid management and smart manufacturing are improving reliability and reducing system costs by nearly 20%. The National Green Hydrogen Mission, targeting 5 million tonnes of production annually by 2030, is positioning India to capture about 10% of global green-hydrogen capacity.”

“With the right policy support, manufacturing scale-up and global partnerships, India can become a resilient, low-cost hub for clean energy and battery innovation. India’s clean-energy ecosystem represents a US$200–250 billion investment opportunity this decade, with targets of 500 GW of renewables and 200 GWh of storage by 2030. Investors are focusing on hybrid RE + storage, grid-scale batteries, and pumped storage projects, while companies leverage AI and digital twins for smarter grid integration. Despite policy and land challenges, strong momentum and falling costs are powering rapid growth.” he further added.

Mr. Arush Gupta, CEO, OKAYA Power Private Limited, said” OKAYA has powered over 3 million Indian households with its inverter and power backup solutions and is now accelerating its presence in solar and lithium storage. With a new ₹140 crore facility coming up in Neemrana, we’re scaling both lithium and inverter production to meet growing residential demand. Solar is projected to contribute nearly 40% of our business within the next five years, driven by initiatives like the PM Suryaghar Muft Bijli Yojana. As India targets 1 crore solar-powered homes, our focus is on providing efficient, digitally enabled rooftop solutions built on indigenous technology. By integrating advanced BMS and power electronics, we aim to make every Indian household energy independent and future-ready.”

Acharya Balkrishna, Head, Patanjali, said “At Patanjali, our vision has always been to contribute to the nation’s development and people’s prosperity through Swadeshi solutions be it in health, wellness, or daily essentials. Extending the same philosophy to renewable energy, we are committed to advancing solar and battery technologies that reduce foreign dependence and make clean energy affordable for all. Solar energy, a divine and continuous source, holds the key to meeting India’s growing power needs at minimal cost. Through Swadeshi-driven innovation and collaboration, we aim to ensure that sustainable and economical solar solutions reach every household in the country.”

Mr. Inderjit Singh, Founder & Managing Director, INDYGREEN Technologies, said “We provide customized battery solutions across L5, C&I, and utility-scale BESS segments, designed to balance performance, scale, and economics for Indian customers. With over 100 battery assembly lines successfully implemented, we aim to expand multifold in the next two years, targeting over 20 GWh of battery lines and 20 GW of solar PV manufacturing solutions. Leveraging IoT and AI-driven technologies, we enhance battery safety, thermal management, and lifecycle efficiency while supporting OEMs and Tier 1 suppliers with advanced insulation and fire-safety systems. Additionally, we’re enabling India’s industrial lithium cell ecosystem through pilot-line infrastructure for premier institutes and labs, alongside showcasing high-efficiency solar cell lines and large-scale BESS assembly solutions at REI and The Battery Show India.”

Sharing perspective on the co-located expos, Mr. Yogesh Mudras, Managing Director, Informa Markets in India, said, “India’s clean energy transition is accelerating faster than ever, with renewable capacity surpassing 250 GW in 2025 and a strong pipeline targeting 500 GW by 2030. The Ministry of Power has approved a ₹5,400 crore Viability Gap Funding (VGF) scheme for 30 GWh of Battery Energy Storage Systems (BESS), in addition to 13.2 GWh already underway, which is expected to attract ₹33,000 crore in investments by 2028.

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India’s electronics export sector continues its remarkable upward trajectory, recording a 41.9% jump to USD 22.2 billion during April–September 2025, compared to USD 15.6 billion in the same period last year. The surge was primarily driven by strong performance in the smartphone segment, which saw exports grow by 58%, reaching USD 13.38 billion, up from USD 8.47 billion a year ago.

Data from the Ministry of Commerce and Industry indicate that this robust growth is the reflection of India’s strengthening position in the global electronics supply chain, bolstered by the policy support extended under the Production Linked Incentive Scheme and rising investments from global players such as Apple, Foxconn, and Samsung.

The total value of India’s electronic exports reached USD 38.6 billion during the fiscal year 2024-25, with a year-on-year increase of 32.6%. This indicates continuous growth, reinforcing the country’s position as an emerging major electronic manufacturing hub and the third-largest smartphone exporter globally, after China and Vietnam.

According to industry experts, this momentum is driven by a better manufacturing ecosystem, diversified supply chains, and recent government initiatives towards “Make in India, Make for the World.”

With rising foreign investments and expanding production capacity, India is well on track to become a USD 100-billion electronics export powerhouse over the coming years.

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Keysight Technologies, Inc. announced that they support the development of the new NVIDIA NVQLink open architecture for the low latency of quantum processors and AI supercomputing.  Keysight Technologies is working with NVIDIA to advance hybrid quantum–AI computing through high-performance control systems and AI-driven infrastructure.

Disaggregated computer architecture is redefining the future of high-performance computing (HPC), enabling organizations to meet rapidly evolving computational demands with greater agility and efficiency. By decoupling compute, memory, storage, and networking into composable resource pools, this approach allows on-demand configuration and precise resource allocation, maximizing performance while optimizing both scalability and cost.

As industries push toward increasingly complex and data-intensive workload spanning artificial intelligence, data analytics, large-scale simulations, and quantum computing—disaggregated systems deliver the flexible, future-proof foundation required to sustain innovation at scale. With seamless upgrades, improved utilization, and dynamic adaptability, these architectures are poised to become the cornerstone of next-generation HPC infrastructure, driving breakthroughs across science and industry.

With decades of experience designing and enabling large-scale systems, Keysight is advancing the integration of quantum and classical computing technologies to address evolving computational challenges. The company’s QCS enables precise, scalable quantum experimentation and plays a vital role in the emerging quantum ecosystem. Working with NVIDIA NVQLink and NVIDIA CUDA-Q, Keysight is exploring how quantum control systems and classical accelerators can be harnessed together, Keysight is helping organizations prepare for a new era of hybrid computing—one that enables quantum-enhanced AI, ultra-precise simulations, and advanced modeling, while remaining adaptable to future advancements across both quantum and classical domains.

This initiative marks a significant milestone for Keysight aimed at uniting high-performance control systems with AI-driven infrastructure to accelerate quantum research and hybrid compute development.

Dr. Eric Holland, General Manager, Keysight Quantum Engineer Solutions, said: “As the industry accelerates toward the next era of high-performance computing, leadership means more than building breakthrough technologies, it requires defining the standards that make these transformative technologies universally accessible. By working with NVIDIA to establish a framework for quantum–HPC hybrid compute, we are helping ensure that tomorrow’s heterogeneous engines, spanning quantum, AI, and classical HPC, operate seamlessly within modern data centers.  Together, we’re shaping the future fabric of compute for scientific discovery and innovation at scale. ”

Tim Costa, General Manager for Quantum at NVIDIA, said: “Driving breakthroughs in quantum computing requires quantum processors to integrate within AI supercomputers to run complex control tasks and deploy hybrid applications. Keysight is playing an integral role in solving this challenge, and NVQLink is the open unified interface for developing what comes next.”

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In a significant effort to enhance India’s electronics ecosystem, the Union Government has cleared investment of ₹5,532 crore for seven projects under the Electronics Components Manufacturing Scheme (ECMS). The initiative is to further India’s transition from assembling imported components to manufacturing core electronic materials and parts within the country.

Union Electronics and IT Minister Ashwini Vaishnaw announced that the projects are a “transformational step” towards developing a self-reliant and innovation-led electronics manufacturing ecosystem.

The projects cleared recently distributed across Tamil Nadu (5 units), Andhra Pradesh (1 unit), and Madhya Pradesh (1 unit) will create over ₹36,000 crore worth of component production and generate over 5,000 direct employment opportunities.

The ECMS will facilitate local manufacturing of key components like Multi-Layer and HDI PCBs, Camera Modules, Copper Clad Laminates (CCL), and Polypropylene Films. These components form the backbone of thousands of diverse products, ranging from smartphones and electric vehicles to medical devices and defence technology.

The cleared projects will satisfy some 20% of India’s domestic demand for PCBs and 15% of its camera module needs, while the production of CCLs will be entirely localized, with 60% of the output being export-focused.

The ECMS initiative has drawn a strong response from industry players, with 249 applications already submitted, signaling robust interest in the program. Combined, they amount to potential investments of ₹1.15 lakh crore, production value of ₹10.34 lakh crore, and 1.42 lakh job opportunities the largest-ever pledge in India’s electronics industry.

The program is likely to sharply reduce import dependence, improve supply chain resilience, and attract high-skill employment in manufacturing and R&D. The components produced under ECMS will help feed key industries like defence, telecommunication, renewable energy, and electric vehicles.

Vaishnaw highlighted that ECMS synergizes with flagships such as the Production Linked Incentive (PLI) scheme and the India Semiconductor Mission (ISM).

“India is transforming from being an assembling country to a product country designing, producing, and exporting sophisticated electronic gear. ECMS fills the critical gap between devices and components and manufacturing and innovation,” he added.

With this approval, India makes another decisive step towards becoming a world electronics manufacturing hub, driven by indigenous innovation, large-scale investment, and increasing self-reliance.

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Nuvoton Technology has launched its latest generation AI microcontroller, the NuMicro M55M1, specifically designed for edge applications such as AI data recognition and intelligent audio. Positioned as a rare entry-level AI solution in the market, the M55M1 integrates an NPU delivering up to 110 GOPS of AI computing power, providing over 100 times the inference performance compared to traditional 1GHz MCUs. Paired with Nuvoton’s self-developed NuML Tool Kit, it enables developers to quickly get started with AI applications in a familiar MCU development environment. A variety of AI models are also available for trial, including face recognition, object detection, audio command recognition, and anomaly detection, effectively lowering the technical barrier and accelerating product deployment.

To meet diverse AI application scenarios, the M55M1 is a 32-bit microcontroller based on the Arm Cortex-M55 core, equipped with Arm Ethos-U55, offering up to 110 GOPS of computing power and a built-in Helium vector processor. Compared to Arm’s existing DSPs, it delivers up to 15 times higher performance. To address AI model requirements, it provides up to 1.5 MB of RAM, 2 MB of Flash, and supports external HyperRAM/OctoSPI expansion. The M55M1 not only features powerful computing capabilities and a flexible architecture but also offers a highly integrated development environment. Through the NuML Tool Kit, developers can easily port AI models to the M55M1 platform using familiar MCU firmware development methods. This architecture is suitable for a wide range of edge AI applications, such as predictive maintenance analysis for factory equipment, analysis for various home appliances and medical sensing devices, as well as endpoint AI applications like keyword spotting, echo cancellation, and image recognition.

On the general MCU operation side, the M55M1 is equipped with a Cortex-M55 core running at up to 220 MHz and offers five low-power modes. It also supports a wide range of peripherals, including CCAP, DMIC, I2C, SPI, Timer, UART, ADC, and GPIO, all of which can operate in low-power modes. In addition, the M55M1 features multi-level security mechanisms, including secure boot, Arm TrustZone, a hardware crypto engine, and Arm PSA Certified Level 2 compliance, providing reliable protection for IoT and embedded applications.

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ANRITSU CORPORATION has enhanced the functions of its New Radio RF Conformance Test System ME7873NR to support 5G wireless device conformance tests and compliance with the ETSI EN 301 908-25 standard under the European Radio Equipment Directive (RED).

By using these enhanced functions, manufacturers can ensure regulatory compliance for 5G wireless devices sold in the EU and guarantee product quality and reliability. Anritsu is dedicated to supporting smooth market entry for products into the EU.

RED is an EU legal framework defining the safety, electromagnetic compatibility (EMC), radio-spectrum efficiency, and cybersecurity requirements of wireless devices in the EU. With the spread of wireless technologies, such as 5G, the ETSI EN 301 908-25 standard for 5G NR devices has been established based on 3GPP Release 15 regulating 5G specifications, and wireless products now sold in the EU must comply with this standard.

Through this latest enhancement, Anritsu continues to play a key role in deployment of commercial 5G services, helping create a 5G-empowered society.

The New Radio RF Conformance Test System ME7873NR is a 5G test platform compliant with 3GPP standards and is certified by both the Global Certification Forum (GCF) and PCS Type Certification Review Board (PTCRB).

In addition to supporting Frequency Range 1 (FR1, Sub-6 GHz), combining the system with an OTA (CATR) chamber 2 adds support for Frequency Range 2 (FR2, mmWave). The flexible configuration and customizable design provide an upgrade path from current ME7873LA systems, offering enhanced 5G compatibility at a lower capital cost.

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